ВРАЩАЮЩИЙСЯ ЭЛЕКТРОД ДУГОВОГО ВЕНТИЛЯ БОЛЬШОЙ МОЩНОСТИ

Вращающийся анод

METHOD FOR JOINING AN ANODE TARGET COMPRISING TUNGSTEN TO A GRAPHITE SUBSTRATE

RD 9722 Tungsten anode targets are joined to graphite substrates by a brazing method employing a controlled atmosphere and a suitable braze material such as platinum and an alloy of platinum and chromium.

Вращающийся анод

PROCEDURE FOR THE PRODUCTION OF A ROTATING ANODE FOR ROENTGENROEHREN

VERFAHREN ZUR HERSTELLUNG EINER DREHANODE FUER ROENTGENROEHREN

ВРАЩАЮЩИЙ ЭЛЕКТРОД ДУГОВОГО ВЕНТИЛЯ БОЛЬШОЙ МОЩНОСТИ

PROCEDURE FOR THE PRODUCTION OF A ROTATING ANODE FOR ROENTGENROEHREN

PROCEEDED OF MEETING Of a ANODE-CIBLE HAS a GRAPHITE SUBSTRATE

PHOTOSENSITIVE RESIN COMPOSITION

The present invention relates to a photosensitive resin composition, and more specifically, to a photosensitive resin composition which is capable of realizing micropatterns, and due to high retention rate, is also suitable for forming a column spacer, a black matrix, or a color (for example, black) column spacer, and thus may be used in various electronic parts including an OLED display and a TFT-LCD panel.

VERFAHREN ZUM VERBINDEN EINES WOLFRAM ENTHALTENDEN ANODENTARGETS MIT EINEM GRAPHIT-SUBSTRAT

PROCEDE DE REUNION D'UNE ANODE-CIBLE A UN SUBSTRAT DE GRAPHITE

Procédé assurant une liaison exceptionnellement résistante entre le substrat en graphite et l'anode cible en tungstène ou alliage de tungstène. Il consiste : a. à préparer un substrat de graphite; b. à déposer une couche d'un métal d'une épaisseur prédéterminée sur la surface prédéterminé du substrat, la couche de métal ayant une épaisseur prédéterminée et étant constituée de rhodium, d'osmium, de ruthénium, de platine, de palladium ou même d'alliage de platine et de chrome, dans lequel le chrome est présent en quantité allant jusqu'à 1 % en poids environ; c. à déposer une anode-cible sur la couche de métal, l'anode-cible étant constituée de tungstène ou d'un alliage tungstène-rhénium, dans lequel le rhénium est présent en quantité allant jusqu'à 25 % en poids; d. à préchauffer le substrat, la couche de métal et l'anode-cible dans une atmosphère contrôlée à une première température élevée allant de 600 à 900 degrés C environ pendant une période de temps prédéterminée; ...

ELECTRIC LAMP SEALED AT TWO ENDS AND MENTHOD FOR ITS PRODUCTION

The oblong bulb (1) of the lamp is sealed at opposing ends by sealing pieces (6; 32), with application of a holder to each end, whereby said holder comprises an electrical contact element (13; 25), electrically connected to a power supply (15; 21), running to the lighting means. The contact element is housed in a tubular extension (11; 22) of the sealing piece and the maximum external diameter of the contact element (13; 25) is loosely matched to the inner diameter of the sleeve.

PROCEEDED OF MEETING Of a ANODE-CIBLE HAS a GRAPHITE SUBSTRATE

METHOD FOR JOINING AN ANODE TARGET COMPRISING TUNGSTEN TO A GRAPHITE SUBSTRATE

DOUBLE-SIDED SEALED ELECTRIC LAMP AND METHOD FOR PRODUCTION THEROF

The oblong bulb (1) of the lamp is sealed at opposing ends by sealing pieces (6; 32), with application of a holder to each end, whereby said holder comprises an electrical contact element (13; 25), electrically connected to a power supply (15; 21), running to the lighting means. The contact element is housed in a tubular extension (11; 22) of the sealing piece and the maximum external diameter of the contact element (13; 25) is loosely matched to the inner diameter of the sleeve.

MANUFACTURE OF ROTATING ANODE FOR X-RAY TUBE

PURPOSE: To improve the bonding strength by bonding a surface layer consisting of tungsten and molybdenum and an intermediate layer comprising rhenium plate a in reducing atmosphere and bonding it on a graphite substrate in an inert atmosphere. CONSTITUTION: A tungsten plate 4, molybdenum plate 3, and rhenium plate 2 are put one on top the other, and bonded by heat-pressing at 1,400 to 1,700°C under the pressure of 100 to 300kg/cm2 in the atmosphere of a reducing gas such as hydrogen. Then the bonded is put on a graphite substrate 1 and bonded by heat- pressing at 1,200 to 1,600°C under the pressure of 50 to 500kg/cm2 in the atmosphere of inert gas such as nitrogen, and a rotating anode for X-ray tube is formed. Thus carbide layer on the bonding surface of the graphite substrate 1 scarcely forms during manufacture, and the bonding strength can be improved greatly. COPYRIGHT: (C)1982,JPO&Japio ...

Radiation source for generating electromagnetic radiation and method for generating electromagnetic radiation

A radiation source for generating electromagnetic radiation includes an anode, a cathode, and a discharge space. The anode and the cathode are configured to create a discharge in a substance in the discharge space to form a plasma so as to generate the electromagnetic radiation. The radiation source also includes a fuel supply constructed and arranged to supply at least a component of the substance to a location near the discharge space. The fuel supply is located at a distance from the anode and the cathode. The radiation source also includes a further supply constructed and arranged to create and/or maintain a cooling and/or protective layer on or near the anode and/or cathode.

Zweiseitig verschlossene elektrische Lampe und Verfahren zu deren Herstellung

Der längsgestreckte Kolben (1) der Lampe ist an einander gegenüberliegenden Enden durch Abdichtungsteile (6; 32) verschlossen, wobei jeweils ein Sockel an einem Ende angebracht ist, wobei der Sockel ein elektrisches Kontaktelement (13; 25) aufweist, das mit einer zu einem Leuchtmittel führenden Stromzuführung (15; 21) elektrisch leitend verbunden ist, wobei das Kontaktelement in einer rohrförmigen Verlängerung (11; 22) des Abdichtungsteils untergebracht ist; der maximale Außendurchmesser des Kontaktelements (13; 25) ist dem Innendurchmesser der Hülse locker angepasst.

Method for joining an anode target comprising tungsten to a graphite substrate

Tungsten anode targets are joined to graphite substrates by a brazing method employing a controlled atmosphere and a suitable braze material such as platinum and an alloy of platinum and chromium.

DOUBLE-SIDED SEALED ELECTRIC LAMP AND METHOD FOR PRODUCTION THEROF

Manufacturing rotary anode for x-ray tube, comprises providing base body made of ceramics based on silicon carbide, and depositing tungsten focal track on predetermined region of base body by electron beam deposition welding

Manufacturing a rotary anode (10) for x-ray tube, comprises: (a) providing a base body (12) made of a ceramics based on silicon carbide; and (b) depositing a tungsten focal track (14) on a predetermined region (16) of the base body by electron beam deposition welding.

VEHICLE LIGHTING FIXTURE

PROBLEM TO BE SOLVED: To reliably prevent a wedge bulb from falling off from a socket when the wedge bulb is removed from a lamp housing. SOLUTION: A rib 6 to guide a wedge bulb 1 to an installing hole 41 is arranged on the peripheral edge of the installing hole 41 of a lamp housing 4. As a result, when the wedge bulb 1 is removed from the lamp housing 4, since the wedge bulb 1 is guided to the installing hole 41 by the guide action of the rib 6, the wedge bulb 1 can be reliably prevented from falling off from a socket 2 by catching on the peripheral edge of the installing hole 41. COPYRIGHT: (C)1998,JPO ...

Process for producing a high-temperature-resistant composite body

A high-temperature-resistant composite body is formed by joining over an area of a first, nonmetallic section via a bonding solder layer to a second, metallic section composed of Mo, an Mo-based alloy, W or a W-based alloy. A first arrangement composed of the first section, a first Zr solder and an intermediate layer is firstly soldered together in a first soldering step. A second arrangement of the resulting partial composite body, a second solder adjoining the intermediate layer and the second section is subsequently soldered together in a second soldering step. The intermediate layer at least 90 atom % of at least one of the elements Ta, Nb, W. The second solder is formed by precisely one material selected from Ti, Ti-based solder combination, V-based solder combination, Zr or Zr-based solder combination and it melts at a lower temperature than the first Zr solder in the second arrangement.

Double-sided sealed electric lamp and method for production thereof

The oblong bulb (1) of the lamp is sealed at opposing ends by sealing pieces (6; 32), with application of a holder to each end, whereby said holder comprises an electrical contact element (13; 25), electrically connected to a power supply (15; 21), running to the lighting means. The contact element is housed in a tubular extension (11; 22) of the sealing piece and the maximum external diameter of the contact element (13; 25) is loosely matched to the inner diameter of the sleeve.

METHOD OF BONDING ANODE TARGET

Method for joining an anode target comprising tungsten to a graphite substrate

Tungsten anode targets are joined to graphite substrates by a brazing method employing a controlled atmosphere and a suitable braze material such as platinum and an alloy of platinum and chromium.

Ethyl silicon oil based magnetic liquid and preparation method thereof

The invention disclose a preparation method of ethyl silicon oil magnetic liquid, aiming at providing ethyl silicon oil magnetic liquid and the preparation method to overcome the drawbacks of the prior art. The granularity of the magnetic grains is even and the mean grain diameter is 8 to 9 nm without gathering. The ethyl silicon oil magnetic liquid is possessed with a series of special performances of the ethyl silicon oil and good low temperature resistance. The preparation method does not separate out any deposit and can still keep fluid putting at standstill and minus 12 DEG C for one month. The saturation intensity can reach 20.0 emu/g tested by vibrating sample magnetometer. The preparation method of ethyl silicon oil magnetic liquid has the advantages of high magnetism, steady dispersion, simple method and low requirement to the equipments.

Method for manufacturing a light emitting device

Light emitting elements are mounted on substrates to produce a plurality of light emitting element units and a plurality of cover members are manufactured. Each of the cover members includes phosphor particles and pigment particles. Wavelength and luminance of light emitted from the light emitting element of each of the light emitting element units is measured. The measured wavelengths and luminances of lights emitted from the light emitting elements are classified into ranks. The wavelengths of lights emitted from the phosphor particles are classified into ranks and the mixing ratios of pigments are classified. Ranks of the light emitting elements and ranks of the cover members are classified into groups in accordance with desired characteristic. A light emitting element and a cover member belonging to same group are mounted in a case.

Ethyl silicon oil based magnetic liquid and preparation method thereof

The invention disclose a preparation method of ethyl silicon oil magnetic liquid, aiming at providing ethyl silicon oil magnetic liquid and the preparation method to overcome the drawbacks of the prior art. The granularity of the magnetic grains is even and the mean grain diameter is 8 to 9 nm without gathering. The ethyl silicon oil magnetic liquid is possessed with a series of special performances of the ethyl silicon oil and good low temperature resistance. The preparation method does not separate out any deposit and can still keep fluid putting at standstill and minus 12 DEG C for one month. The saturation intensity can reach 20.0 emu/g tested by vibrating sample magnetometer. The preparation method of ethyl silicon oil magnetic liquid has the advantages of high magnetism, steady dispersion, simple method and low requirement to the equipments.

MANUFACTURE OF COUNTER-CATHODE ROTOR MEMBER FOR X-RAY TUBE BULB

PURPOSE: To facilitate and secure the manufacture of a counter-cathode rotor member, by putting raw material of a high conductive metal into a metal mold holding a bar-stock made of a heat resisting metal and, forming the raw material int a cup in parallel with integrating, it with the bar-stock. CONSTITUTION: A bar-stock 15 is put in a metal mold 14. The bar-stock 15 is inserted beforehand into a hole 19, while allowing it to project by a predetermined length from the upper surface of a die 12 which is going to be the inner bottom surface of the metal mold 14. The raw material 16 put in the metal mold 14 is formed to a rough rotor member in the metal mold 14 through reverse extruding forging process with a punch 17, after it is put in. After cutting off the opening end of the roughly formed rotor body of the rough formed rotor member into the determined dimension, a product "rotor" is obtained by finishing the bar-stock to the determined shape and dimension. COPYRIGHT: (C)1981,JPO&Japio ...

Method of determining bond coverage in a joint

A method of determining bonding agent coverage in a joint between a first substrate ( 10 ) and a second substrate ( 12 ), including: dispersing a marker material ( 18 ) throughout a bonding agent ( 16 ); melting the bonding agent ( 16 ) but not the marker material; solidifying the melted bonding agent ( 16 ) to form an actual bond ( 24 ) in a joint between the first substrate ( 10 ) and the second substrate ( 12 ); detecting the marker material ( 18 ) in the joint through at least one of the substrates to ascertain an actual bond ( 24 ); and comparing the actual bond ( 24 ) to an expected bond ( 28 ) for the joint to determine the bonding agent coverage.

BORON CARBIDE-CONTAINING CERAMIC BONDED BODY AND METHOD FOR PRODUCING THE BONDED BODY

A bonded, boron carbide-containing ceramic body includes ceramic members. These ceramic members each contain boron carbide at 2 mass % or higher, and are integrated together via a bonding layer bonded with a bonding material containing at least one metal selected from the group consisting of aluminum, copper, gold and zirconium or integrated together via a bonding layer formed from one of aluminum metal and an aluminum compound and a titanium compound as bonding materials, wherein a bonded part has a strength of 100 MPa or higher. According to this technology, the boron carbide-containing ceramic members can be bonded together with a high strength of 100 MPa or more by a simple process, and further, the bonding is feasible with excellent chemical resistance at the bonded part as needed. 1. A bonded , boron carbide-containing ceramic body comprising ceramic members each containing boron carbide at 60 mass % or higher and integrated together via a bonding layer bonded with a bonding material containing at least one metal selected from the group consisting of aluminum , copper , gold and zirconium or integrated together via a bonding layer formed from one of aluminum metal and an aluminum compound and a titanium compound as bonding materials , wherein a bonded part has a strength of 100 MPa or higher.2. (canceled)3. The bonded claim 1 , boron carbide-containing ceramic body according to claim 1 , wherein the bonding layer has a thickness of 1 to 1 claim 1 ,000 μm.4. A process for producing the bonded claim 1 , boron carbide-containing ceramic body according to claim 1 , comprising claim 1 , upon bonding together ceramic members each containing boron carbide at 60 mass % or higher claim 1 , interposing a bonding material claim 1 , which is selected from a foil claim 1 , paste or vapor deposition layer comprised of a metal of aluminum claim 1 , copper claim 1 , gold or zirconium or an alloy of the metal as a base claim 1 , between parts of the ceramic members claim 1 , ...

Hermetically Sealed Electronic Device Using Solder Bonding

Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications. 1. A method of hermetically sealing an active layer , comprisinga. forming on a first substrate an integral preformed edge,b. positioning on the first substrate an active layer,c. positioning a second substrate in close contact with the active layer, leaving a gap between preformed edge and an edge of the active layer,d. adding a seal material to the gap, ande. applying an energy source to heat and flow the seal material to fully fill the gap thereby forming a seal therein.2. The method of claim 1 , further comprising after (b) and before (c) claim 1 , (b1) laminating a polymer film to at least one of the active layer claim 1 , the first substrate and a second substrate.3. The method of claim 1 , wherein at least one substrate is glass.4. The method of claim 1 , wherein the energy source is localized and selected from the group consisting of ultrasound claim 1 , visible light claim 1 , ultraviolet light claim 1 , broadband infrared claim 1 , laser claim 1 , induction claim 1 , and combinations thereof.5. The method of claim 1 , wherein the energy source is dispersed claim 1 , and selected from the group consisting of thermal heating claim 1 , magnetic induction heating claim 1 , convection furnace claim 1 , and eddy currents.6. The method of claim 1 , wherein the preformed edge and first substrate are formed by cutting and shaping a block of substrate material to become preformed edge integral with the top substrate.7. The method of claim 1 , further comprising applying the first substrate material to the top substrate and firing the material to sinter it claim 1 , thereby forming an integral preformed edge.8. The method of claim 6 , wherein the firing is undertaken during a tempering cycle.9. The method of wherein the active layer ...

METHOD FOR BRAZING ALUMINUM MEMBERS AND BRAZING APPARATUS USED FOR SAME

Provided are: a method for brazing an aluminum alloy, which is characterized in that brazing is carried out by heating an aluminum brazing sheet without using flux in a furnace that is in an argon gas-containing atmosphere, said aluminum brazing sheet comprising a core material that is composed of aluminum or an aluminum alloy and a brazing filler material that is composed of an aluminum alloy and clad on one surface or both surfaces of the core material, and said core material and/or said brazing filler material containing Mg; and a brazing apparatus which is used in the method for brazing an aluminum alloy. The brazing method has good and stable brazing properties and is applicable in industrial practice. 1. A method for brazing an aluminum member , the method comprising the step of: heating for the brazing of said aluminum member without using flux in a furnace in an argon gas-containing atmosphere , said aluminum member comprising a brazing sheet that includes a core made of aluminum or an aluminum alloy , and a filler material made of an aluminum alloy and clad on one surface or both surfaces of said core , at least one of said core and said filler material containing Mg , the method being characterized in that , given that a ratio of luminous intensity of a nitrogen atom to luminous intensity of an oxygen atom , measured by glow discharge optical emission spectrometry , is defined as a luminous intensity ratio (N/O) and that the luminous intensity ratio (N/O) indicating a constant value at the interior of said filler material after having been subjected to the brazing is 1.0 , the luminous intensity ratio (N/O) near the surface of said filler material UP to the depth where said constant value is indicated , is 1.2 or less.2. (canceled)3. The method for brazing the aluminum member according to claim 1 , wherein the argon gas-containing atmosphere in said furnace is an argon gas atmosphere or a mixed gas atmosphere of argon gas and nitrogen gas claim 1 , and ...

Target for x-ray generator, method of manufacturing the same and x-ray generator

There is provided a target for an X-ray generator, including: a holder part made of an electrically conductive material and having an opening part; a diamond plate air-tightly joined to the holder part so as to close the opening part; a thin film target provided on a surface of the diamond plate, with its outer peripheral part extending to the holder part to be electrically connected to the holder part, wherein the holder part is configured to be electrically connected to a power supply of the X-ray generator, and the diamond plate is incorporated into the X-ray generator with one side disposed in a vacuum atmosphere where the thin film target is formed, and an opposite side thereto disposed at a side where the diamond plate is brought into thermal contact with a refrigerant and cooled.

ROTARY X-RAY ANODE

A rotary X-ray anode has a support body and a focal track formed on the support body. The support body and the focal track are produced as a composite by powder metallurgy. The support body is formed from molybdenum or a molybdenum-based alloy and the focal track is formed from tungsten or a tungsten-based alloy. Here, in the conclusively heat-treated rotary X-ray anode, at least one portion of the focal track is located in a non-recrystallized and/or in a partially recrystallized structure. 117-. (canceled)18. A rotary X-ray anode , comprising:a powder-metallurgically produced composite formed of a support body and a focal track on said support body;said support body being formed of molybdenum or a molybdenum-based alloy;said focal track being formed of tungsten or a tungsten-based alloy; andwherein, in the conclusively heat-treated rotary X-ray anode, at least one portion of said focal track is present in a non-recrystallized or a partially recrystallized structure.19. The rotary X-ray anode according to claim 18 , wherein said at least one portion of said focal track has claim 18 , in a direction perpendicular to a focal track plane claim 18 , a preferential texturing in a <111> direction with a texture coefficient TCof ≧4 determinable by way of X-ray diffraction and a preferential texturing in a <001> direction with a texture coefficient TCof ≧5 determinable by way of X-ray diffraction.20. The rotary X-ray anode according to claim 18 , wherein the following relationship for the texture coefficients TCand TCdeterminable by way of X-ray diffraction is satisfied for the portion of the focal track perpendicular to the focal track plane:{'br': None, 'i': TC', '/TC, 'sub': (222)', '(310), '≧5.'}21. The rotary X-ray anode according to claim 18 , wherein the at least one portion of said focal track has a hardness of ≧350 HV 30.22. The rotary X-ray anode according to claim 18 , wherein the at least one portion of said focal track is present in a partially recrystallized ...

Zirconium-coated steel plates and chemical device elements produced with such plates

Method for producing coated assembly parts for chemical device elements including the following steps: (a) the formation of an initial assembly including a steel support part, a zirconium or zirconium alloy coating, and at least one brazing material between the support part and the coating; (b) the insertion of the initial assembly into a brazing chamber with a controlled atmosphere; (c) the formation of a controlled atmosphere in said chamber; and (d) the reheating of said assembly to a temperature at least equal to the melting temperature of said brazing material.

ACTIVE METAL BRAZE JOINT WITH STRESS RELIEVING LAYER

The present disclosure relates to a brazed superabrasive assemblies and method of producing brazed superabrasive assemblies. The brazed superabrasive assemblies may include a plurality of braze alloy layers that are positioned opposite a stress relieving layer. The stress relieving layer may have a solidus temperature that is greater than a solidus temperature of the plurality of braze alloy layers. 1. A brazed superabrasive assembly , comprising:a superabrasive layer;a stress relieving layer coupled to the superabrasive layer by a first braze layer; anda substrate coupled to the stress relieving layer by a last braze layer, wherein the stress relieving layer has a solidus or melting temperature that is greater than a solidus temperature of the first braze layer and the last braze layer.2. The brazed superabrasive assembly of claim 1 , wherein the stress relieving layer comprises copper or a copper alloy.3. The brazed superabrasive assembly of claim 1 , wherein the stress relieving layer comprises nickel or a nickel alloy.4. The brazed superabrasive assembly of any of - claim 1 , wherein the first braze layer comprises a refractory metal or a refractory metal alloy that is positioned between the superabrasive layer and the stress relieving layer.5. The brazed superabrasive assembly of any of - claim 1 , further comprising a carbide layer claim 1 , wherein the carbide layer is positioned between a first diamond-containing material and the first braze layer.6. The brazed superabrasive assembly of claim 5 , wherein the carbide layer comprises a carbide of a refractory metal.7. The brazed superabrasive assembly of any of - claim 5 , wherein the refractory metal comprises at least one of tungsten claim 5 , titanium claim 5 , niobium claim 5 , zirconium claim 5 , tantalum claim 5 , vanadium claim 5 , chromium claim 5 , molybdenum claim 5 , or an alloy or composite thereof.8. The brazed superabrasive assembly of any of - claim 5 , wherein the first braze layer and the ...

Carbide Wear Surface and Method of Manufacture

A radial bearing having a wear surface with improved wear characteristics comprises a steel support, to which is bonded a metal carbide composite wear surface made by first arranging, within a cavity defined between a steel mold and the steel support, tiles made of microwave sintered, cemented metal carbide, closely packing the voids between the tiles with metal carbide powder, and infiltrating the mold cavity with a metal brazing alloy by subjecting the filled mold to rapid heating. The brazing alloy fills voids between the metal carbide particles, the microwave sintered metal carbide tiles, and the metal support, thereby relatively rapidly consolidating the carbide into a wear layer bonded with the steel support without substantially damaging the properties of the microwave-sintered metal carbide tiles.

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

A semiconductor device includes a semiconductor element; an insulating substrate formed from stacking a rectangular shaped circuit plate, insulating plate, and metal plate, wherein the semiconductor element is fixed to the circuit plate, and the metal plate has at least one first groove portion in four corners thereof; a radiating member made of metal and having a predetermined arrangement area to dispose the insulating substrate, the radiating member having at least one second groove portion provided in four corners of the arrangement area; four positioning members disposed between the four corners of the metal plate and the four corners of the radiating member, each of the four positioning members being fitted to each of the first groove portions and second groove portions; and a solder filling a space between the insulating substrate and the radiating member, and covering the positioning members.

BRAZE FOR CERAMIC AND CERAMIC MATRIX COMPOSITE COMPONENTS

In some examples, a technique may include positioning a first part comprising a ceramic or ceramic matrix composite and a second part comprising a ceramic or a CMC adjacent to each other to define a joint region at the interface of the first part and the second part. In some examples, the joint region may be heated using at least one of a laser or a plasma arc source to heat the joint region to an elevated temperature. The first and second parts may be pressed together and cooled to join the first and second parts at the joint region. In other examples, a solid braze material including a filler material and a metal or alloy may be delivered to the joint region and locally heated to cause a constituent of the filler material and a constituent of the metal or alloy to react. When reacted, the constituents may form a solid material, which may join the first and second parts. 1. A method comprising:positioning a first part comprising a ceramic or ceramic matrix composite (CMC) and a second part comprising a ceramic or a CMC adjacent to each other to define a joint region between adjacent portions of the first part and the second part;delivering a solid braze material in the joint region, wherein the solid braze material comprises at least a filler material and a metal or alloy, and wherein the solid braze material comprises at least one of a wire, ribbon, thread, rod, or strand; andlocally heating the solid braze material, wherein a constituent of the filler material reacts with a constituent of the molten metal or alloy to join the first part and the second part.2. The method of claim 1 , wherein locally heating the solid braze material comprises locally heating the solid braze material substantially simultaneously with delivering the solid braze material in the joint region.3. The method of claim 1 , wherein at least one of the first part or the second part comprises a silicon carbide-silicon carbide composite.4. The method of claim 1 , wherein the filler material ...

METHOD FOR COATING SOLID DIAMOND MATERIALS

A method for coating solid diamond materials, to solder or bond coated diamond materials into a metallic surface or a second diamond surface under ambient air. The diamond materials are at least partially coated under a noble gas atmosphere by a vapour depositing process, the coating is performed with at least one carbide-forming chemical element selected from among B, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo and W; some diamond carbon is converted into elemental carbides, which form an elemental carbide layer; and wherein there is a stoichiometric excess of the chemical element in relation to the elemental carbides formed, so an element layer is deposited onto the surface of the elemental carbide layer or a mixed elemental carbide/element layer forms and is deposited on the element layer or mixed elemental carbide/element layer. Also, a machine component, in particular a tool, with a soldered-in solid PCD. 1. A method for coating solid diamond materials in order to solder or bond the coated diamond materials into a metallic surface or a second diamond surface under ambient air; whereinthe diamond materials are at least partially coated in a noble gas atmosphere by means of a vapour deposition process, wherein the coating is accomplished using at least one carbide-forming chemical element which is selected from the group consisting of: B, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W; whereina partial quantity of the diamond carbon of the diamonds contained in the surface of the diamond materials is converted into elemental carbides which form an elemental carbide layer; whereinthe chemical element is present in stoichiometric excess in the molar ratio to the elemental carbides formed so that an element layer is deposited on the surface of the elemental carbide layer or a mixed elemental carbide/element layer is formed,wherein:a transition layer is deposited on the resulting element layer or mixed elemental carbide/element layer; andthe transition layer comprises at least one layer which ...

ATTACHMENT OF STRUCTURES HAVING DIFFERENT PHYSICAL CHARACTERISTICS

Methods of bonding first structures to second structures are disclosed wherein the first and second structures are fabricated materials having different physical characteristics. For example, the first structure may be a composite fan blade and the second structure may be a composite or metallic rotor, both for use in gas turbine engines. The method includes providing the first and second structures and plating or otherwise coating a portion of the first structure with a metal to provide a metal-coated portion. The method includes applying at least one intermediate material onto the metal-coated portion of the first structure. The method further includes bonding the metal-coated portion of the first structure and the intermediate material to the second structure. The bonding is carried out using a relatively low-temperature process, such as liquid phase bonding, including TLP and PTLP bonding. Brazing is also a suitable technique, depending on the materials chosen for the first and second structures. 112-. (canceled)13. A rotor assembly for a gas turbine engine , the assembly comprising:a composite fan blade, the fan blade including a root;a metallic rotor including a slot for receiving the root;the root being at least partially coated with a metal to form a metal-coated portion;the metal-coated portion of the root being at least partially covered with an intermediate material; andthe root, metal-coated portion and intermediate material being received in the slot and bonded to the rotor.14. The rotor assembly of wherein the root claim 13 , metal-coated portion claim 13 , intermediate material and rotor are bonded using a process selected from the group consisting of transient liquid phase (TLP) claim 13 , partial transient liquid phase (PTLP) and brazing.15. The rotor assembly of wherein the composite fan blade is fabricated from a material selected from the group consisting of polyetherimide (PEI) claim 13 , polyimide claim 13 , polyether ether ketone (PEEK) claim ...

METHOD FOR PROCESSING A MODULAR HYBRID COMPONENT

The invention relates to a method for processing a modular hybrid component having a first part made of a first material and a second part made of a second material, which is different from the first material with regard to its electromagnetic and/or thermal properties. The method including exposing the modular hybrid component to an alternating electromagnetic field, whereby both parts are heated up differently, and that a brazing or soldering joint or field sensitive mineral cement between the first part and the second part is affected by the heating action. 1. A method for processing a modular hybrid component having a first part made of a first material and a second part made of a second material , which is different from said first material with regard to its electromagnetic and/or thermal properties; said method comprising said modular hybrid component being exposed to an alternating electromagnetic field , whereby both parts are heated up differently , and that a brazing or soldering joint or field sensitive mineral cement between said first part and said second part is affected by said heating action.2. The method according to claim 1 , wherein said first part is a metal part and said second part is a ceramic part claim 1 , and said alternating electromagnetic field has a frequency of more than 1 kHz.3. The method according to claim 2 , wherein said alternating electromagnetic field has a frequency of more than 1 GHz.4. The method according to claim 1 , wherein said electromagnetic field is confined in a chamber in a multimode configuration.5. The method according to claim 4 , wherein that an atmosphere exists in said chamber during execution of the process claim 4 , which atmosphere contains less than ambient oxygen partial pressure.6. The method according to claim 5 , wherein the total pressure in said chamber during execution of the process is less than 1 mbar claim 5 , specifically less than 10mbar.7. The method according to claim 1 , wherein said ...

X-RAY SYSTEMS AND METHODS INCLUDING X-RAY ANODES WITH GRADIENT PROFILES

An anode for an X-ray tube can include one or more of an yttrium-oxide derivative, titanium diboride, boron carbide, titanium suboxide, reaction-bonded silicon carbide, and reaction-bonded silicon nitride. Upon collision with an anode, the kinetic energy of an electron beam in an X-ray tube is converted to high-frequency electromagnetic waves, i.e., X-rays. An anode from one or more of the above materials and a gradient distribution of conductive metals can reduce costs and/or weight, extend the life of the anode or associated components (e.g., bearings) and simultaneously provide a higher heat storage capacity as compared to traditional molybdenum and tungsten anodes. 1. An X-ray anode , comprising: at least in a thermally excited state, emits X-rays in response to incident electrons from an electron beam, and', 'for at least a first temperature range, increases in thermal conductivity with increased temperature; and, 'a ceramic body that,'} 'wherein thermal energy from a plurality of received incident electrons is distributed throughout the ceramic body via the distributed conductive metals, such that the temperature of the ceramic body increases as does the thermal conductivity of the ceramic body for at least the first temperature range.', 'a gradient distribution of one or more conductive metals within the ceramic body to facilitate thermal distribution within the ceramic body,'}2. The X-ray anode of claim 1 , further comprising an outer layer of molybdenum on at least one surface to receive incident electronics from the electron beam and generate x-rays.3. The X-ray anode of claim 1 , wherein the gradient distribution of one or more conductive metals decreases in percentage from a surface of electron incidence to an opposing surface.4. The X-ray anode of claim 1 , wherein the gradient distribution of one or more conductive metals decreases in percentage from a ring of electron incidence on a surface of the ceramic body with respect to distance.5. The X-ray ...

METHOD FOR ESTABLISHING A PERMANENT BOND BETWEEN A FERROUS ALLOY AND AN ALUMINIUM OR AN ALUMINIUM ALLOY

A process for establishing a permanent bond between a first part made of a ferrous alloy and a second part made of aluminum or of an aluminum alloy, comprises: a step of stacking a plurality of parts comprising the first part and the second part; and a heating step in which the heat produced by a heat source is transmitted to the second part through the first part, the heating step being carried out so as to cause the bond to be established between the first part and the second part by melting at least one of the stacked parts. 1. A process for establishing a permanent bond between a first part made of a ferrous alloy and a second part made of aluminum or of an aluminum alloy , the bond takes the form of a closed loop , the process comprising:a step of stacking a plurality of parts comprising the first part and the second part; anda heating step in which the heat produced by a heat source is transmitted to the second part through the first part, the heating step being carried out so as to cause the bond to be established between the first part and the second part by melting at least one of the stacked parts;the process further comprising, prior to the heating step, a preheating step of preheating the stacked parts by the heat source so as to raise the stacked parts to respective temperatures below their respective melting points, the same heat source being used for the preheating step and for the heating step.2. The process as claimed in claim 1 , in which claim 1 , in the stacking step claim 1 , a third part made of filler material claim 1 , which part is intended to establish the bond between the first part and the second part claim 1 , is interposed between the first part and the second part claim 1 , and in the heating step claim 1 , the heat produced by the heat source is transmitted to the second part and to the third part through the first part claim 1 , the third part being chosen and the heating step being carried out so as to establish the bond by braze- ...

TUBING MATERIAL, DOUBLE WALL STEEL TUBES AND METHOD OF MANUFACTURING A DOUBLE WALL STEEL TUBE

A double wall steel tube includes an inner tube wall and an outer tube wall. The inner and outer tube walls are formed from a tubing material including an inner layer of iron steel, first and second outer layers of an alloy of aluminum and silicon, a first intermediate layer disposed between the inner layer and the first outer layer, and a second intermediate layer disposed between the inner layer and the second outer layer. The first and second intermediate layers include aluminum, silicon and iron. The inner and outer tube walls are brazed together. 1. A tubing material comprising:an inner layer of iron alloy;first and second outer layers of an alloy of aluminum and silicon;a first intermediate layer disposed between the inner layer and the first outer layer; anda second intermediate layer disposed between the inner layer and the second outer layer;wherein the first and second intermediate layers include aluminum, silicon and iron.2. The tubing material claim 1 , wherein the first and second outer layers have a silicon composition of approximately 1 weight % to approximately 15 weight %.3. The tubing material claim 1 , wherein the first and second outer layers have a silicon composition of approximately 12 weight %.4. The tubing material claim 1 , wherein the first and second outer layers each have a thickness of approximately 5 microns to approximately 16 microns.5. The tubing material claim 1 , wherein the first and second outer layers each have a thickness of about 10 microns.6. The tubing material of claim 1 , wherein the iron is a high strength steel.7. The tubing material of claim 1 , wherein the first and second intermediate layers include 44 weight % aluminum claim 1 , 7 weight % silicon and 49 weight % iron.8. A double wall steel tube comprising:an inner tube wall; andan outer tube wall;wherein the inner tube wall and the outer tube wall are formed from a tubing material including an inner layer of iron alloy, first and second outer layers of an alloy of ...

SOLDER JOINT STRUCTURE, POWER MODULE, POWER MODULE SUBSTRATE WITH HEAT SINK AND METHOD OF MANUFACTURING THE SAME, AND PASTE FOR FORMING SOLDER BASE LAYER

There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member. 1. A solder joint structure obtained by joining an aluminum member made of aluminum or aluminum alloy with a joint member using a solder material ,the solder joint structure comprising:a glass layer formed on a surface of the aluminum member;an Ag layer laminated on the glass layer; anda solder layer laminated on the Ag layer,wherein crystalline oxide particles are dispersed in the Ag layer.2. The solder joint structure according to claim 1 ,wherein the crystalline oxide particles are composed of any one or two or more of titanium oxide, silicon oxide, and zinc oxide.3. A power module comprising: a power module substrate in which a circuit layer made of an aluminum member is disposed on one surface of an insulating layer claim 1 , and a semiconductor device joined to one surface of the circuit layer claim 1 ,{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'wherein a junction between the circuit layer and the semiconductor device is the solder joint structure described in .'}4. A power module substrate with a heat sink claim 1 , comprising:a power module substrate in which a circuit layer is disposed on one surface of an insulating layer; anda heat sink that is joined to the other surface side of the power module substrate;wherein at least one of a joint surface of the heat sink and a joint surface of the power module substrate is composed of the aluminum member, and{' ...

Brazing method

A brazing method for brazing a material without using a flux includes performing brazing in an inert gas atmosphere, in a state in which the material to be brazed is covered with a cover member formed of an upper cover portion covering the whole upper portion of the material to be brazed and side cover portions covering at least some of the side portions of the material to be brazed, with the upper cover portion contacting the upper portion of the material to be brazed, and the material to be brazed and the cover member are held with a heat transmission promoting member formed of an upper heat transmission promoting portion and a lower heat transmission promoting portion, with the upper heat transmission promoting portion contacting the upper cover portion, and with the lower heat transmission promoting portion contacting the lower portion of the material to be brazed.

TURBINE ROTOR FOR SUPERCHARGER AND MANUFACTURING METHOD THEREOF

A turbine rotor for a supercharger includes a TiAl turbine wheel and a carbon steel shaft joined to each other via an Ni brazing filler metal at a brazed part distanced from a back face of the turbine wheel so that a turbine wheel outer diameter ratio calculated by “a distance from the back face of the turbine wheel to the brazed part”/“an outer diameter of the turbine wheel” is within a range of from 7 to 10%. 14-. (canceled)5. A turbine rotor for a supercharger comprising:a TiAl turbine wheel and a carbon steel shaft joined to each other via an Ni brazing filler metal at a brazed part distanced from a back face of the turbine wheel so that a turbine wheel outer diameter ratio calculated by “a distance from the back face of the turbine wheel to the brazed part”/“an outer diameter of the turbine wheel” is within a range of from 7 to 10%, wherein a maximum temperature at the brazed part is less than 60% of a melting point of the Ni brazing filler metal.6. The turbine rotor for a supercharger according to claim 5 , further comprising:a back plate at a back face side of the turbine wheel along the back face with a gap between the back plate and the back face so as to prevent an exhaust gas that leaks from an inlet side toward an outlet side of the turbine wheel from flowing into a joint part of the Ni brazing filler metal.7. The turbine rotor for a supercharger according to claim 5 ,wherein the brazed part is disposed on a position such that the turbine wheel outer diameter ratio is substantially 8%.8. A manufacturing method of manufacturing a turbine rotor for a supercharger where a TiAl turbine wheel and a carbon steel shaft are joined to each other via an Ni brazing filler metal claim 5 , comprising the steps of:measuring an outer diameter of the turbine wheel;setting a distance from a back face of the turbine wheel to a brazed part so that a turbine wheel outer diameter ratio calculated by “a distance from the back face of the turbine wheel to the brazed part”/“an ...

PROCESS FOR BRAZING OF ALUMINUM ALLOYS AND A FLUX

A process for brazing of aluminium magnesium alloys is described applying a flux which comprises KAlFor CsAlFor both as major constituent. The flux further comprises at least one alkaline or alkaline earth metal compound selected from the group consisting of KAlF, CsAlF, LiAlF, CaF, CaCO, MgF, MgCO, SrF, SrCO, BaF, and BaCO. Preferably the flux comprises or consists of KAlF, CsAlF, and LiAlFand optionally contains also BaF. 1. A process for brazing parts of aluminum alloy comprising equal to or more than 0.5 by weight of magnesium in the interface , the process comprising a step of applying a brazing flux to at least one of the parts to be joined , a step of assembling the parts to be joined and and a step of heating the parts to be joined to a temperature of equal to or higher than 450° C. to provide brazed joint parts , wherein the brazing flux comprises equal to or more than 65% by weight , relative to the total weight of the brazing flux , of a first component and equal to or more than 3% by weight of a second component , relative to the total weight of the brazing flux , with the proviso that the first component and the second component are not identical , and wherein the first component is a monoalkali tetrafluoroaluminate selected from the group consisting of KAlF , CsAlFand mixtures thereof , and the second component is at least one alkaline or alkaline earth metal compound selected from the group consisting of KAlF , CsAlF , LiAlF , CaF , CaCO , MgF , MgCO , SrF , SrCO , BaF , BaCO , and mixtures of two or more thereof.2. The process of wherein the first component is KAlF.3. The process of wherein the second component is selected from the group consisting of LiAlF claim 1 , CsAlF claim 1 , CaF claim 1 , MgF claim 1 , SrF claim 1 , BaF claim 1 , and mixtures of two or more thereof.4. The process of wherein the content of free KF is lower than 0.1% by weight claim 1 , relative to the total weight of the brazing flux if at least one compound selected from the ...

MANUFACTURING METHOD OF RADIATOR-INTEGRATED SUBSTRATE AND RADIATOR-INTEGRATED SUBSTRATE

A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500≦R≦surface pressure (N/mm)×2000+12000. 1. A manufacturing method of a radiator-integrated substrate comprising one surface of a metal circuit board made of aluminum or an aluminum alloy that is bonded to one surface of a ceramic substrate , and a metal base plate , wherein one surface of the metal base plate made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate , and another surface of the metal base plate is bonded to a radiator , the method comprising:bonding the metal circuit board and the metal base plate to the ceramic substrate to form a metal-ceramic bonded substrate;then arranging the metal base plate of the metal-ceramic bonded substrate on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator;arranging a jig having a concave R surface on another surface of the radiator with the jig butting against the another surface of the radiator;bringing a jig having a convex R surface protruding toward the metal-ceramic bonded substrate into contact with another surface of the metal circuit board of the metal-ceramic ...

TiAl JOINED BODY AND MANUFACTURING METHOD FOR TiAl JOINED BODY

A manufacturing method of a TiAl joined body includes: an arranging step and a heating step. The arranging step is a step of arranging a plurality of members which contains a TiAl intermetallic compound and insert materials which contain Ti as a major element, Cu and Ni such that each of the insert materials is inserted between two adjacent members of the plurality of members. The heating step is a step of heating the plurality of members and the insert materials in a non-oxidizing atmosphere at a temperature above melting points of the insert materials and below melting points of the plurality of members. 1. A manufacturing method of a TiAl joined body comprising:arranging a plurality of members which contains a TiAl intermetallic compound and insert materials which contain Ti as a major element, Cu and Ni such that each of the insert materials is inserted between two adjacent members of the plurality of members; andheating the plurality of members and the insert materials in a non-oxidizing atmosphere at a temperature above melting points of the insert materials and below melting points of the plurality of members.2. The manufacturing method of a TiAl joined body according to claim 1 , wherein the heating step is performed without actively applying pressure to the plurality of members.3. The manufacturing method of a TiAl joined body according to claim 1 , wherein each of the insert materials includes one of a lamination material in which Ti foil claim 1 , Cu foil and Ni foil are laminated claim 1 , a lamination material in which Ti foil and Cu—Ni foil are laminated and Ti—Cu—Ni foil.4. The manufacturing method of a TiAl joined body according to claim 3 , wherein claim 3 , in the arranging step claim 3 , each of the insert materials is pressed by one of the two adjacent members to the other of the two adjacent members by using own weight of the one of the two adjacent members.5. The manufacturing method of a TiAl joined body according to claim 1 , wherein each of ...

PROCESS FOR JOINING METALLIC AND CERAMIC STRUCTURES

A method for joining a ceramic component to a metallic component is described. At least one layer of molybdenum is applied to a surface of the ceramic component, by a high-velocity molybdenum wire spray technique. A layer of a nickel-based braze composition is then applied over the molybdenum layer. The braze composition and the ceramic and metallic components are then heated to a sufficient brazing temperature, so as to provide a braze joint between the components. The method can be used to seal an open region of a thermal battery, e.g., a sodium metal halide-based battery. 1) A method for joining a ceramic component to a metallic component , comprising the following steps:a) applying at least one layer of molybdenum to a surface of the ceramic component, by a high-velocity molybdenum wire spray technique;b) applying at least one layer of a nickel-based braze composition over the molybdenum layer; andc) heating the braze composition to a sufficient brazing temperature, so as to provide a braze joint between them.2) The method of claim 1 , wherein the molybdenum wire spray technique comprises melting molybdenum wire by means of a combustion flame.3) The method of claim 2 , wherein the combustion flame is formed by the ignition of a gas mixture that comprises oxygen and at least one hydrocarbon gas.4) The method of claim 2 , wherein the hydrocarbon gas is selected from acetylene claim 2 , propane claim 2 , propylene claim 2 , and liquefied petroleum gas (LPG).5) The method of claim 2 , wherein the temperature of the combustion flame is in the range of 2 claim 2 ,600° C. to 4 claim 2 ,000° C.6) The method of claim 2 , wherein the molybdenum wire has a diameter in the range of about 1 mm to 5 mm.7) The method of claim 2 , wherein the molybdenum wire is fed into the combustion flame at a feed rate in the range of 10 g/minute to 30 g/minute.8) The method of claim 7 , wherein the feed rate is adjusted in coordination with adjustment of the diameter of the molybdenum wire; ...

PLOW BLADE

The present disclosure provides a plow blade edge device for mounting to a moldboard of a plow comprising at least one adapter blade including a bottom edge having selectively carbide insert(s) along at least a portion of the bottom edge. The disclosure further provides for a method of brazing the carbide insert(s) in a cavity along at least a portion of the bottom edge. The device further includes at least one wear block selectively reversible to present the adapter blade at a first angle or a second angle. The at least one wear block can include a bottom edge having a carbide insert along at least a portion of the bottom edge. 1. A plow blade edge system for mounting to a moldboard of a plow comprising: a first plow blade edge segment and a second plow blade edge segment; each plow blade segment including: at least one adapter blade including a bottom edge selectively having a first carbide insert along at least a portion of said bottom edge; at least one wear block welded to a back side of each said adapter blade wherein said at least one wear block includes a bottom edge having a carbide insert along at least a portion of said bottom edge , wherein said first plow blade edge segment is mounted adjacent said second plow blade edge segment.2. The plow edge system as recited in claim 1 , wherein each said at least one wear block is cast steel.3. The plow edge system as recited in claim 2 , further including a plowguard welded to a terminal end of a front side of said at least one adapter blade.4. The plow edge system as recited in claim 3 , wherein each said at least one adapter blade is boron steel.5. The plow edge system as recited in claim 1 , wherein each said at least one adapter blade includes a channel along said at least a portion of said bottom edge claim 1 , said channel including at least a second carbide insert brazed into said channel and to said first carbide insert.6. The plow edge system as recited in claim 5 , wherein a height of said at least ...

FLUX COMPOSITION AND BRAZING SHEET

Disclosed is a flux composition for use in brazing of an aluminum alloy material and includes a flux component [A] containing KAlF; and a fluoride [B] containing an element other than Group 1 elements and Group 2 elements and containing no potassium (K). Also disclosed is a brazing sheet which includes an aluminum alloy core; a filler material lying on or over at least one side of the core; and a flux layer lying on or over one side of the filler material and including the flux composition. 1. A flux composition , comprising:{'sub': '4', 'a flux component comprising KAlF; and'}a fluoride comprising an element other than Group 1 elements and Group 2 elements and comprising no potassium (K).2. The flux composition according to claim 1 , wherein the fluoride is AlF.3. The flux composition according to claim 1 , wherein the composition has a melting point of 580° C. or lower.4. The flux composition according to claim 1 , comprising:particles comprising the flux component; andparticles comprising the fluoride.5. The flux composition according to claim 1 , comprising the fluoride in a content of from 1 part by mass to 200 parts by mass per 100 parts by mass of the flux component.6. The flux composition according to claim 1 , further comprising a melting-point-lowering agent.7. The flux composition according to claim 6 , wherein the melting-point-lowering agent is at least one compound selected from the group consisting of NaF and LiF.8. The flux composition according to claim 6 , comprising the melting-point-lowering agent in a content of from 0.1 part by mass to 30 parts by mass per 100 parts by mass of the flux component.9. A brazing sheet comprising:a core comprising an aluminum alloy;a filler material lying on or over a side of the core; and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a flux layer lying on or over one side of the filler material and comprising the flux composition according to .'}10. The brazing sheet according to claim 9 , wherein the flux ...

Solder joint structure and solder joining method

A solder joint structure includes a metal pin in the shape of a prism or a circular or substantially circular cylinder; an aluminum wire including a wound portion wound around the metal pin; and a solder layer arranged to join the metal pin and at least one portion of the wound portion to each other. The at least one portion of the wound portion includes a deformed surface resulting from a partial disappearance or elimination of the aluminum wire in a cross-section perpendicular or substantially perpendicular to a direction in which the aluminum wire extends, and the solder layer is directly and closely adhered to the deformed surface.

METHOD OF BRAZING ARTICLES OF STAINLESS STEEL

The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel. 1. A brazed article of stainless steel comprising at least about one base material of stainless steel and an iron-based brazing filler material wherein the obtained brazed areas , pores , cracks , gaps , joints , or crevices having a tensile strength of at least about 110 N/mm.2. A brazed article of stainless steel comprising at least about one base material of stainless steel and an iron-based brazing filler material wherein the obtained brazed areas , pores , cracks , gaps , joints , or crevices having an average hardness less than about 600 HV1.3. The article of stainless steel according to claim 1 , wherein the parts or the articles obtained in step (iv) claim 1 , are selected from reactors claim 1 , separators claim 1 , columns claim 1 , heat exchangers claim 1 , or equipments for chemical plants or food plants claim 1 , or for car industry.4. The article of stainless steel according to claim 2 , wherein the parts or the articles obtained in step (iv) claim 2 , are selected from reactors claim 2 , separators claim 2 , columns claim 2 , heat exchangers claim 2 , or equipments for chemical plants or food plants claim 2 , or for car industry.5. The article of stainless steel according to claim 1 , wherein the article is being brazed heat exchanger ...

MIXED COMPOSITION COATING MATERIAL FOR BRAZING

In a mixed composition coating material for brazing, when a total mass of a solid material, an organic solvent, and water is defined as 100 mass %, the solid material are contained in an amount of 30 mass % or greater and 80 mass % or less with respect to the whole coating material, the organic solvent and the water is contained in a total amount of 20 mass % or greater and 70 mass % or less with respect to the whole coating material, and the water is contained in an amount of 0.4 mass % or greater and 2.5 mass % or less with respect to the whole coating material. 1. A mixed composition coating material , consisting of:from 30 mass % to 80 mass % of a solid material;from 20 mass % to 70 mass % of an organic solvent; andfrom 0.4 mass % to 2.5 mass % of water,wherein, a total mass of the solid material, the organic solvent, and the water is defined as 100 mass %.2. The mixed composition coating material according to claim 1 ,wherein an SP value of the organic solvent is from 9.4 to 14.3. The mixed composition coating material according to claim 1 ,wherein the solid material consists of, among a brazing material, a flux, and a synthetic resin, the flux and the synthetic resin; or the brazing material, the flux, and the synthetic resin.4. The mixed composition coating material according to claim 3 ,wherein the flux is a fluoride-based flux.5. The mixed composition coating material according to claim 4 ,{'sub': 3', '2', '2', '3', '2', '6', '4', '3', '6', '2', '5', '2, 'wherein the fluoride-based flux consists of one or more of KZnF, ZnF, LiF, KF, CaF, AlF, KSiF, KAlF, KAlF, and KAlF.5HO.'}6. The mixed composition coating material according to claim 3 ,wherein the brazing material comprises a Si powder or a Si-containing alloy powder.7. The mixed composition coating material according to claim 3 ,wherein the synthetic resin consists of one or more of an acrylic resin, a resin having a polyether skeleton, and a cellulose-based resin. The present invention relates to a ...

TITANIUM WELDING WIRE, ULTRASONICALLY INSPECTABLE WELDS AND PARTS FORMED THEREFROM, AND ASSOCIATED METHODS

A welding wire formed of a trace boron titanium base alloy is provided, along with welds formed from the wire and articles comprising one or more of such welds. A method may include forming such a weld or welds from such a welding wire, and may also include non-destructively inspecting titanium alloy articles comprising one or more of such welds using ultrasonic waves to detect internal flaws. 1. An apparatus comprising:welding wire formed of a titanium base alloy and boron in a range of about 0.05 to 0.20 percent by weight.2. The apparatus of wherein the boron is in a range of about 0.05 to 0.15 percent by weight.3. The apparatus of wherein the boron is in a range of about 0.05 to 0.10 percent by weight.4. The apparatus of wherein the boron is in a range of about 0.10 to 0.20 percent by weight.5. The apparatus of wherein the boron is in a range of about 0.10 to 0.15 percent by weight.6. The apparatus of wherein the titanium base alloy is one of:commercial purity titanium, Ti-6Al-4V, Ti-5Al-2Sn-2Zr-4Mo-4Cr, Ti-6Al-2Sn-4Zr-2Mo, Ti-6Al-2Sn-4Zr-2Mo-0.1Si, Ti-10V-2Fe-3Al, Ti-6Al-2Sn-4Zr-6Mo, Ti-5Al-2.5Sn, Ti-3Al-2.5V, Ti-6Al-4V extra low interstitial, Ti-6Al-6V-2Sn, Ti-15Mo-2.7Nb-3Al-0.2Si, Ti-3Al-8V-6Cr-4Mo-4Zr and Ti-5Al-5V-5Mo-3Cr.7. The apparatus of wherein the titanium base alloy is one of:commercial purity titanium, Ti-(6.5-8)Al-4V, Ti-(5.5-7)Al-2Sn-2Zr-4Mo-4Cr, Ti-(6.5-8)Al-2Sn-4Zr-2Mo, Ti-(6.5-8)Al-2Sn-4Zr-2Mo-0.1Si, Ti-10V-2Fe-(3.5-5)Al, Ti-(6.5-8)Al-2Sn-4Zr-6Mo, Ti-(5.5-7)Al-2.5Sn, Ti-(3.5-5)Al-2.5V, Ti-(6.5-8)Al-4V extra low interstitial, Ti-(6.5-8)Al-6V-2Sn, Ti-15Mo-2.7Nb-(3.5-5)Al-0.2Si, Ti-(3.5-5)Al-8V-6Cr-4Mo-4Zr or Ti-(5.5-7)Al-5V-5Mo-3Cr.8. An apparatus comprising:at least one weld formed of a titanium base alloy and boron in a range of about 0.05 to 0.20 percent by weight.9. The apparatus of wherein the titanium base alloy is one of:commercial purity titanium, Ti-6Al-4V, Ti-5Al-2Sn-2Zr-4Mo-4Cr, Ti-6Al-2Sn-4Zr-2Mo, Ti-6Al-2Sn-4Zr-2Mo-0.1Si, Ti-10V-2Fe- ...

METHODS FOR ASSEMBLING METALLIC SANDWICH AND HONEYCOMB STRUCTURES

A method for creating metallic sandwich structures that includes providing at least two face sheets; providing at least two core sheets; orienting the core sheets relative to one another in a predetermined manner; and using indirect resistance roll brazing to join the core sheets to the face sheets to create a sandwich structure. 1. A method for creating metallic sandwich structures , comprising:(a) providing at least two face sheets;(b) providing at least two core sheets;(c) orienting the core sheets relative to one another in a predetermined manner; and(d) using indirect resistance roll brazing to join the core sheets to the face sheets to create a sandwich structure.2. The method of claim 1 , further including creating spot brazes between the oriented core sheets.3. The method of claim 1 , wherein the at least two core sheets further include dimple structures formed thereon.4. The method of claim 3 , wherein the indirect resistance roll brazing further includes the use of positioning rolls claim 3 , where in the positioning rolls further include protrusions formed thereon claim 3 , and wherein the protrusions engage the dimple structures formed on the core sheets for properly orienting the positioning rolls.5. The method of claim 4 , wherein properly orienting the positioning rolls facilitates orientation of the core sheets for continuous indirect resistance roll brazing.6. A method for creating metallic honeycomb panels claim 4 , comprising:(a) providing base materials, wherein the base materials are components of metallic sandwich structures;(b) identifying predetermined metallurgical requirements of the base materials;(c) selecting predetermined coatings for the base materials based on the predetermined metallurgical requirements, wherein the predetermined coatings form interlayers that facilitate the joining of the of metallic sandwich structures to one another;(d) applying the predetermined coatings to the base materials; and(e) using indirect resistance ...

METHOD FOR MIG BRAZING, METHOD FOR MANUFACTURING LAP JOINT MEMBER, AND LAP JOINT MEMBER

The present invention provides a method for MIG brazing an Al alloy to a steel sheet so as to manufacture a lap joint member that excels in bonding strength with respect to the Al alloy. With the MIG brazing method, a bonding target sheet, specifically, an Al sheet or an Al alloy sheet is bonded to a hot dip Zn-based alloy coated steel sheet () whose coating layer contains Al in an amount of 1.0% by mass to 22.0% by mass. A target location of MIG brazing is a region between (i) an intersection (C) of one end of an end surface () of the bonding target sheet and the hot dip Zn-based alloy coated steel sheet and (ii) the other end (U) of the end surface of the bonding target sheet. 1. A method for MIG brazing a bonding target sheet that is stacked on a sheet surface of a hot dip Zn-based alloy coated steel sheet , a coating layer of the hot dip Zn-based alloy coated steel sheet containing 1.0% by mass to 22.0% by mass of Al , and the bonding target sheet being an Al sheet or an Al alloy sheet , the method comprising:a brazing step of forming a brazed part on the sheet surface for joining the bonding target sheet and the hot dip Zn-based alloy coated steel sheet together,in the brazing step, a target location of the MIG brazing being a region between (i) an intersection of one end of an end surface of the bonding target sheet and the sheet surface and (ii) the other end of the end surface of the bonding target sheet.2. The method as set forth in claim 1 , wherein:in the brazing step, fluxless MIG brazing is carried out with use of a fluxless wire as a brazing filler metal.3. The method as set forth in claim 2 , wherein:the brazing filler metal is composed of Al; orthe brazing filler metal has a composition that contains Al and one or more selected from the group consisting of Si: 0.2% by mass to 15.0% by mass, Mg: 0.3% by mass to 7.0% by mass, and Mn: 0.03% by mass to 2.0% by mass.4. The method as set forth in claim 1 , wherein: {'br': None, 't≤W≤7.5 t \u2003\u2003(1 ...

ANALYTICAL X-RAY TUBE WITH HIGH THERMAL PERFORMANCE

An analytical X-ray tube with an anode target material that emits characteristic X-rays in response to excitation by an electron beam may include any of several advantageous features. The target material is deposited on a diamond substrate layer, and a metal carbide intermediate layer may be provided between the target material and substrate that provides enhanced bonding therebetween. An interface layer may also be used that provides an acoustic impedance matching between the target material and the substrate. For a low thermal conductivity target material, a heat dissipation layer of a higher thermal conductivity material may also be included between the target material and substrate to enhance thermal transfer. The target material may have a thickness that corresponds to a maximum penetration depth of the electrons of the electron beam, and the structure may be such that a predetermined temperature range is maintained at the substrate interface. 1. An X-ray tube comprising:a target anode comprising a target material that emits characteristic X-rays in response to excitation by an electron beam;a diamond substrate upon which the target anode is located; andan intermediate layer between the diamond substrate and the target material, the intermediate layer comprising a metal carbide.2. An X-ray tube according to wherein the target material comprises one of copper and silver.3. An X-ray tube according to wherein an operating temperature at an interface with the diamond substrate is between 600 K and 800 K.4. An X-ray tube according to further comprising an interface layer located between the target material and substrate claim 1 , the interface layer comprising a material having an acoustic impedance Zthat closely matches a geometric mean √{square root over (ZZ)} of an acoustic impedance of the target material (Z) and an acoustic impedance of the diamond substrate (Z) claim 1 , such that Z/√{square root over (ZZ)} is between 0.75 and 1.5.5. An X-ray tube according to ...

CONNECTION ARRANGEMENT OF AN ELECTRIC AND/OR ELECTRONIC COMPONENT

A connection arrangement includes at least one electric and/or electronic component. The at least one electric and/or electronic component has at least one connection face, which is connected in a bonded manner to a join partner by means of a connection layer. The connection layer can for example be an adhesive, soldered, welded, sintered connection or another known connection that connects joining partners while forming a material connection. Furthermore, a reinforcement layer is arranged adjacent to the connection layer in a bonded manner. The reinforcement layer has a higher modulus of elasticity than the connection layer. A particularly good protective effect is achieved if the reinforcement layer is formed in a frame-like manner by an outer and an inner boundary and, at least with the outer boundary thereof, encloses the connection face of the at least one electric and/or electronic component. 11002003004001010114020. A connection arrangement ( , , , ) of at least one electric and/or electronic component () , wherein the at least one electric and/or electronic component () has a connection face () , which is connected in a bonded manner to the join partner () by a connection layer () , wherein{'b': 30', '20', '30', '20', '30', '36', '35', '36', '11', '10, 'a reinforcement layer (′) is arranged adjacent to the connection layer (), said reinforcement layer (′) having a higher modulus of elasticity than the connection layer (), wherein the reinforcement layer (′) is formed in a frame-like manner by an outer boundary and an inner boundary (, ) and, at least with the outer boundary () thereof, encloses the connection face () of the at least one electric and/or electronic component (), and'}{'b': '30', 'wherein the reinforcement layer (′) comprises at least one intermetallic phase.'}2203030203030. The connection arrangement according to claim 1 , characterized in that the connection layer () comprises at least one metal and the reinforcement layer (′) is formed from ...

Multi-Step Processes For High Temperature Bonding And Bonded Substrates Formed Therefrom

A method for high temperature bonding of substrates may include providing a top substrate and a bottom substrate, and positioning an insert between the substrates to form a assembly. The insert may be shaped to hold at least an amount of Sn having a low melting temperature and a gap shaped to hold at least a plurality of metal particles having a high melting temperature greater than the low melting temperature. The assembly may be heated to below the low melting temperature and held for a first period of time. The assembly may further be heated to approximately the low melting temperature and held for a period of time at a temperature equal to or greater than the low melting temperature such that the amount of Sn and the amount of metal particles form one or more intermetallic bonds. The assembly may be cooled to create a bonded assembly. 1. A method for high temperature bonding of substrates , the method comprising:providing a top substrate and a bottom substrate; the insert is positioned around at least a portion of the top substrate and comprises at least one of a porous material and one or more channels;', 'the insert comprises a gap that is shaped to be disposed between the top and bottom substrates and that is configured to hold a plurality of metal particles having a high melting temperature, wherein at least one of the insert and the gap holds an amount of Sn having a low melting temperature; and', 'the high melting temperature is greater than the low melting temperature;, 'positioning an insert between the top and bottom substrates to form a assembly, whereinheating the assembly during a first heating to a first temperature that is below the low melting temperature;holding the assembly at the first temperature for a first period of time;heating the assembly during a second heating to a second temperature that is approximately equal to the low melting temperature;holding the assembly at a holding temperature for a second period of time such that the amount ...

CERAMIC PRESSURE SENSOR AND METHOD FOR PRODUCTION THEREOF

A method for production of a pressure sensor including a flat flexible membrane made of a ceramic material and a flat rigid support thereof made of a ceramic material is provided. Steps include: —establishing an electric circuit on the membrane; —establishing an electric contact with the outside on the support; —depositing an electrically conductive material on the support; —establishing an electrical and mechanical coupling between the membrane and the support. The electrical coupling between the membrane and the support are performed by deposition and sintering of at least one layer of an electrically conductive sinterable electrical connection material. The mechanical coupling between the membrane and the support are performed by deposition and sintering of at least one layer of sinterable mechanical connection material that is electrically insulating and/or isolated from the layer of sinterable electrical connection material. The layer of sinterable electrical connection material and the layer of sinterable mechanical connection material undergo re flow together in a single step in a sintering furnace. 1. A method for production of a pressure sensor comprising a flat flexible membrane made of a ceramic material and a flat rigid support thereof made of a ceramic material , comprising:establishing an electric circuit on the membrane;establishing an electric contact with the outside on the support;depositing an electrically conductive material on the support;establishing an electrical and mechanical coupling between the membrane and the support;wherein the electrical coupling between the membrane and the support is performed by deposition and sintering of at least one layer of electrically conductive sinterable electrical connection material,wherein the mechanical coupling between the membrane and the support is performed by deposition and sintering of at least one layer of sinterable mechanical connection material that is electrically insulating and/or isolated ...

METHOD OF PRODUCING A MEDICAL CUTTING INSTRUMENT

A method of producing a medical cutting instrument. Medical cutting instrument is provided which stably exhibits high joint strength obtained by brazing. Cutting instrument is configured by providing a working section to a front end of a shank section. Working section consists of a carbide or a ceramic, shank section being constructed from round stainless steel bar or round tool steel bar. Shank section and working section are connected through a brazed section. Brazed section is portion at which shank section and working section are brazed together while brazing surfaces, which are provided with protrusion sections formed on shank section and/or working section, are caused to be in contact with each other. Protrusion sections each have sloped surfaces having an apex, and the height of the sloped surfaces is set in range of 0.5%-8%, inclusive, of the diameter of the brazing surface of the shank section. 13-. (canceled)4. A method of producing a medical cutting instrument , the medical cutting instrument including a shank portion which has a first brazing surface formed as a raised sloped surface including an apex and is formed of a round stainless steel bar or a round tool steel bar and a working portion which has a second brazing surface and is formed of cemented carbide or ceramic at a leading end of the shank portion , the first brazing surface being a conical surface and the second brazing surface being a flat surface , the method comprising the steps of:a) connecting the working portion on which a blade has not been formed with the shank portion using solder such that the solder is placed in a space provided between the first brazing surface and the second brazing surface for bonding the first brazing surface and the second brazing surface, and that the apex of the first brazing surface is in contact with the second grazing surface;b) processing the working portion on which a blade has not been formed while rotating the shank portion to produce an intermediate ...

JOINED COMPONENT AND METHOD FOR MANUFACTURING JOINED COMPONENT

It is an object of the present invention to provide a joined component in which the overflow of brazing filler metal from the outer peripheral line of a joint boundary surface between a first member and a second member is suppressed, and a method for manufacturing the joined component. A joined component is obtained by joining, with brazing filler metal, a first member and a second member to each other at a joint boundary surface where the first member and the second member are in contact with each other, the joined component having a non-contact area that is provided on an inner side with respect to an outer peripheral line of the joint boundary surface and in which the first member and the second member are not in contact with each other. In the joined component, the first member has a retaining recess where the brazing filler metal that is melted when the first member and the second member are joined to each other is retained, the retaining recess providing the non-contact area. The molten brazing filler metal including some solidified part forms a brazing-filler-metal pool in the retaining recess. 1. A joined component obtained by joining , with brazing filler metal , a first member and a second member to each other at a joint boundary surface where the first member and the second member are in contact with each other , the joined component having a non-contact area that is provided on an inner side with respect to an outer peripheral line of the joint boundary surface and in which the first member and the second member are not in contact with each other ,wherein the first member has a retaining recess where the brazing filler metal that is melted when the first member and the second member are joined to each other is retained, the retaining recess providing the non-contact area, andwherein the molten brazing filler metal including some solidified part forms a brazing-filler-metal pool in the retaining recess.2. The joined component according to claim 1 , ...

STRUCTURE JOINED BY NICKEL BRAZING

A multi-plate oil cooler with high joining strength with an inner fin while suppressing a usage amount of a nickel brazing filler, even when ferrite-based stainless steel with low wettability for a nickel brazing filler is used for a plate is provided. A plate made from a ferrite-based stainless steel plate and an inner fin made from a pure iron plate or a carbon steel plate are joined with a nickel brazing filler to form a multi-plate oil cooler. In general, a structure body is provided wherein a ferrite-based stainless steel and pure iron or a carbon steel are joined with a nickel brazing filler. 1. A structure body wherein a ferrite-based stainless steel , and pure iron or a carbon steel are joined with a nickel brazing filler.2. The structure body according to claim 1 , wherein the structure body is a heat exchanger in which a plate made from a ferrite-based stainless steel plate and an inner fin made from a carbon steel plate are joined with a nickel brazing filler.3. The structure body according to claim 2 , wherein the heat exchanger is an oil cooler of a multi-plate type in which an oil flow path and a cooling water flow path are arranged alternately claim 2 , and the inner fin is arranged to the oil flow path. The present invention relates to a structure body joined with a nickel brazing filler, which is optimum mainly for multi-plate oil coolers.As one example, there is known a multi-plate one in which a plurality of plates formed in a dish shape are stacked and an oil flow path and a cooling water flow path are alternately arranged for every other plate. Then to the oil flow path, an inner fin is arranged, to improve a heat transfer property on the oil side. For the plate, an austenite-based stainless steel such as SUS304 or SUS316, or a ferrite-based stainless steel such as SUS430 is used, and respective plates are brazed with a copper brazing filler.However, when joining is performed with a copper brazing filler as an oil cooler for cooling a ...

METHOD FOR FIXING HEAT RESISTANT COMPONENT ON A SURFACE OF A HEAT EXPOSED COMPONENT

The invention refers to a method for fixing a heat resistant component on a surface of a heat exposed component, by brazing of at least a part of a surface of the heat resistant component limited by a peripheral boundary edge on the surface of the heat exposed component using a molten solder. A first alternative includes: 1. A method for fixing a heat resistant component on a surface of a heat exposed component , by brazing of at least a part of a surface of the heat resistant component limited by a peripheral boundary edge on the surface of the heat exposed component using a molten solder , comprising:metallizing the surface of the heat resistant component at least with the exception of an edge area comprising the peripheral boundary edge andbrazing said metallized surface to the surface of the heat exposed component, wherein:at least the surface of the heat resistant component consists of a ceramic material which has a physico-chemical property concerning wettability such that the ceramic material is not wettable by the molten solder, and/ora metal or a metal alloy is used for metallizing which has a physico-chemical property concerning wettability such that the metallizing is wettable by the molten solder.2. A method for fixing heat resistant component on a surface of a heat exposed component; the method comprising brazing of at least a part of a surface of the heat resistant component limited by a peripheral boundary edge on the surface of the heat exposed component using a molten solder ,coating at least an edge area comprising the peripheral boundary edge of the heat resistant component with a distance layer having a physico-chemical property concerning wettability such that the distance layer is not wettable by the molten solder andbrazing the surface of the heat resistant component, having a physico-chemical property concerning wettability such that the surface is wettable by the molten solder, to the surface of the heat exposed component.3. The method ...

DEVICE IMPLANTABLE UNDER SKIN

A cochlear implant includes a sealed housing containing electronics for at least stimulation or collection of data and at least one antenna for communicating with an external device and a magnet configured to hold the external device in proximity to the sealed housing. The sealed housing includes an upper cover being closest to the skin when the device is implanted, and a lower cover that is hermetically connected to the upper cover. The lower cover includes an elevated region, a recessed region, and at least one feedthrough element formed in the recessed region of the lower cover. The recessed region provides space for a lead to connect to the feedthrough element and protects it from shock and other environmental risks. 1. A device implantable under skin , comprising:a sealed housing containing electronics for at least stimulation or collection of data and at least one antenna for communicating with an external device;a magnet configured to hold said external device in proximity to the sealed housing, wherein an upper cover being closest to the skin when the device is implanted, and', 'a lower cover that is hermetically connected to the upper cover,, 'the sealed housing includes'} an elevated region,', 'a recessed region, and', 'at least one feedthrough element formed in the recessed region of the lower cover., 'the lower cover includes'}2. The device according to claim 1 , whereinthe at least one feedthrough element includes a plate shaped base with one or more holes, andthe at least one feedthrough element is configured to connect an electrode to the electronics housed within the sealed housing through conductive pins in the one or more holes.3. The device according to claim 2 , whereinthe plate shaped base of the at least one feedthrough element is hermetically joined to the lower cover of the external housing.4. The device according to claim 1 , whereinthe lower cover has a circular disc outer perimeter shape, andthe lower cover includes an elevated part ...

Polycrystalline Diamond Compact Bit Manufacturing

A method of manufacturing PDC drill bits includes inspecting a plurality of cutters. The method further includes inspecting a plurality of pockets of a bit body. A cutter of the plurality of cutters is assigned to a pocket of the plurality of pockets based on the inspection of the plurality of cutters and the inspection of the plurality of cutter pockets. A robot positions the cutter inside the pocket and applies heat to a brazing material to produce a molten brazing material within the pocket. 1. A method of manufacturing polycrystalline diamond compact (PDC) drill bits , the method comprising:inspecting a plurality of cutters;inspecting a plurality of pockets of a bit body;assigning a cutter of the plurality of cutters to a pocket of the plurality of pockets based on the inspection of the plurality of cutters and the inspection of the plurality of cutter pockets;positioning, by a robot, the cutter of the plurality of cutters inside the pocket of the plurality of pockets; andapplying heat, by the robot, to a brazing material to produce a molten brazing material within the pocket.2. The method of claim 1 , further comprising applying a flux material to the plurality of cutters and to the bit body including the plurality of pockets.3. The method of claim 2 , wherein applying the flux material comprises heating the bit body to a first temperature and heating the plurality of cutters to a second temperature claim 2 , and wherein the first temperature and the second temperature equal or exceed an activation temperature of the flux material.4. The method of claim 1 , further comprising spinning claim 1 , by the robot claim 1 , the cutter of the plurality of cutters within the pocket of the plurality of pockets while applying the heat to the brazing material within the pocket.5. The method of claim 1 , further comprising placing the brazing material within the pocket prior to applying the heat.6. The method of claim 1 , wherein positioning the cutter of the plurality of ...

Brazing method

According to this brazing method, a first base member having a non-plated surface, a metal layer for functioning as a diffusion barrier layer, a brazing foil, and a second base member having a surface are arranged in this order so that the non-plated surface of the first base member and the surface of the second base member are faced with each other. The first base member and the second base member are brazed by using the brazing foil. The cost of providing a diffusion barrier layer between the first base member and the brazing foil is thereby reduced.

X-RAY ILLUMINATION SYSTEM WITH MULTIPLE TARGET MICROSTRUCTURES

An x-ray illumination beam system includes an electron emitter and a target having one or more target microstructures. The one or more microstructures may be the same or different material, and may be embedded or placed atop a substrate formed of a heat-conducting material. The x-ray source may emit x-rays towards an optic system, which can include one or more optics that are matched to one or more target microstructures. The matching can be achieved by selecting optics with the geometric shape, size, and surface coating that collects as many x-rays as possible from the source and at an angle that satisfies the critical reflection angle of the x-ray energies of interest from the target. The x-ray illumination beam system allows for an x-ray source that generates x-rays having different spectra and can be used in a variety of applications. 1. An x-ray illumination beam system providing multiple characteristic x-ray energies from a plurality of x-ray generating materials selected for its x-ray generating properties , comprising:a vacuum chamber including an electron emitter;a first window transparent to x-rays and attached to a wall of the vacuum chamber;an electron optical system that focusses an electron beam from the electron emitter;a target comprising a plurality of microstructures coupled to a substrate,wherein each microstructure includes a material selected for its x-ray generating properties, and in which a lateral dimension of said material is less than 250 microns;a means to position the x-ray target relative to the electron beam; anda plurality of total external reflection mirror optics, wherein each of the plurality of optics is matched to the x-ray spectra produced by at least one of the plurality of microstructures and positioned to collect x-rays generated by the at least one of the plurality of microstructures when bombarded by the focused electron beam.2. The x-ray illumination beam system of claim 1 , wherein one or more of the plurality of total ...

PROCESS FOR JOINING TWO METAL PARTS BY BRAZE-WELDING

A process for joining two parts by braze-welding, including forming a joint, between two surfaces to be joined, and a fillet. The composition of the filler metal used to form the fillet is different from that used to form the joint, to provide the joint with a higher ductility. The method can, for example, be applied to production of high-pressure compressor guide-vane sectors for a turbomachine. 19-. (canceled)10. A method for joining two metal parts by brazing , comprising:forming, by a filler metal, a bonding joint between two bonding surfaces and a fillet,wherein the chemical composition of the filler metal for forming the fillet is different from that of the bonding joint, to have greater ductility.11. A method according to claim 10 , wherein the bonding joint is a capillary joint.12. A method according to claim 10 , wherein brazing temperature for the fillet is lower than liquidus temperature of the filler metal of the bonding joint.13. A method according to claim 10 , wherein the two metal parts are made of either a nickel-based or cobalt-based superalloy.14. A method according to claim 13 , wherein the filler metal for forming the bonding joint is either a nickel-based or cobalt-based alloy including at least one flux compound.15. A method according to claim 14 , wherein the flux compound is at least one element from among boron claim 14 , silicon claim 14 , and phosphorus.16. A method according to claim 10 , wherein the filler metal of the fillet is a copper-based alloy claim 10 , or CuMnNi930 claim 10 , or a manganese-based alloy claim 10 , or a precious-metal alloy.17. A method according to claim 10 , wherein one part of the two metal parts is a turbine engine compressor blade and the other part is a collar.18. A method according to claim 17 , wherein the joining forms a stator vane sector. The present invention relates to the brazing of parts made of a nickel-based or cobalt-based superalloy, that is to say made of a refractory alloy having a content by ...

STRUCTURE FOR JOINING CERAMIC PLATE TO METAL CYLINDRICAL MEMBER

A member for semiconductor manufacturing device includes a susceptor which is a ceramic plate formed of AlN and a gas introduction pipe which is joined to the susceptor An annular pipe joining bank is provided at a position of the susceptor facing a flange of the gas introduction pipe In addition, a pipe brazed part is formed between the flange and the pipe joining bank The flange has a width of 3 mm or more and a thickness of from 0.5 to 2 mm. It is preferable that the height of the pipe joining bank be 0.5 mm or more, the edge of the bank facing the outer edge of the flange be chamfered as designated by C0.3 or more or rounded as designated by R0.3 or more. 1. A structure for joining a ceramic plate to a metal cylindrical member , including:a flange which is formed at an end of the cylindrical member,an annular bank which is provided at a position of the ceramic plate facing the flange, anda brazed part which is formed in a space between the flange and the bank,wherein the flange has a width of 3 mm or more and a thickness of from 0.5 to 2 mm,an edge of the bank facing an outer edge of the flange is chamfered or rounded.2. The structure for joining according to claim 1 ,wherein a height of the bank is 0.5 mm or more.3. The structure for joining according to claim 1 ,wherein the edge of the bank facing the outer edge of the flange is chamfered as designated by C0.3 or more or rounded as designated by R0.3 or more.4. The structure for joining according to claim 1 ,wherein the ceramic plate is formed of AlN,the cylindrical member is formed of Kovar, andthe brazed part is formed of a brazing filler material including Ag, Cu, and Ti or an Al brazing filler material.5. The structure for joining according to claim 1 ,wherein the ceramic plate has a gas introduction hole that is opened toward inside of the bank and that penetrates through the ceramic plate in a thickness direction, andthe cylindrical member is a gas introduction pipe through which a gas is supplied to the ...

METHOD AND ARRANGEMENT FOR PRODUCING A THREE-DIMENSIONAL MATERIAL COMPOSITE USING AN EXPANSION BODY

A method and arrangement for producing a three-dimensional material composite using an expansion body includes at least two metal bodies having surface regions resting loosely against one another. The composite is heated to a target temperature and the surface regions are pressed against one another so that an integral connection is established. At least one expansion cavity having a predefined initial volume is arranged in one of the metal bodies or in an additional expansion body resting against one of the metal bodies in such a manner that when the expansion cavity expands, the surface regions to be connected are pressed against one another. A predefined quantity of at least one substance which is gaseous at least at a target temperature is hermetically enclosed in the expansion cavity before the target temperature is reached. 1. A method for producing a three-dimensional material composite of at least two metal bodies , wherein the metal bodies are initially assembled such that the surface areas to be connected loosely abut on one another , wherein said composite is then heated to a target temperature while said surface areas are pressed against one another such that no gap remains , and wherein a positive-locking and/or firmly bonded connection is produced between the surface areas of the metal bodies ,wherein the pressure required for pressing the surface areas against one another is generated by arranging at least one expansion cavity with a predefined initial volume in one of the metal bodies or in an additional expansion body, which abuts on at least one of the metal bodies, in such a way that, during its expansion, the surface areas to be connected are pressed against one another,wherein a predefined amount of at least one substance is filled into the expansion cavity and hermetically confined, wherein said substance is gaseous at least at the target temperature or forms, prior to reaching the target temperature, at least one substance in a predefined ...

PRINTED WIRING BOARD, PRINTED WIRING BOARD REINFORCING MEMBER, AND PRINTED CIRCUIT BOARD

It is possible to maintain high-reliable ground effect and reinforcement function over a long period. A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding. 1. A printed wiring board comprising:a base member that includes a ground wiring pattern; anda printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state, wherein a metal base material layer; and', 'a nickel layer bonded, with a diffusion layer, to at least a surface, on a side opposite to a side bonded to the ground wiring pattern, of the metal base material layer, wherein, 'the printed wiring board reinforcing member includeswhen a thickness of the nickel layer is tNi, a relationship between a thickness tD of the diffusion layer and a distance {tNi+(tD/2)} from a center position of the diffusion layer to a superficial layer surface of the nickel layer is (tD/2)/{tNi+(tD/2)}≤0.80.2. The printed wiring board according to claim 1 , wherein the diffusion layer has a thickness of 5 μm or less.3. (canceled)4. (canceled)5. The printed wiring board according to claim 1 , wherein the metal base material layer is made of any of a stainless steel claim 1 , an aluminum claim 1 , and an aluminum alloy.6. A printed wiring board reinforcing member disposed opposed to a ground wiring pattern in a printed wiring board claim 1 , the printed wiring board reinforcing member having an opposed one surface bonded to the ground wiring pattern in a conductive state claim 1 , the printed wiring board reinforcing member having another surface electrically conducted with an external ground member at a ground potential claim ...

Two-layer abrasive coating for rotor-blade tips, method, component, and turbine assembly

An excellent abrasive blade tip is provided by a two-layer coating system consisting of a brazing solder coating and an NiCoCrAlY coating containing cBN (cubic Boron Nitride).

Brazing Process of Pipes and Compressor

The present invention describes a brazing process in copper and steel parts for several equipment, using a zinc alloy as an additive material, and a device produced according do said process. Specifically, the present invention includes a brazing process between a copper pipe and a steel part, using an alloy composed mainly by zinc as addiction material. Said brazing process is applied to exhaust copper pipes and steel exhaust system, both present in the compressors. The present invention is situated on the industrial field of compressors, metallurgy, mechanical engineering and materials engineering.

LOW-PROFILE MECHANICAL RETENTION

An assembly of mechanical components includes a solder joint between two metal components. A mounted component is retained on one side of a support structure by a solder joint on the other side of the support structure between a retainer and a connector that is fast with the mounted component and extends through the support structure. The retainer is of sheet metal construction, so that a height of the solder joint is no more than the thickness of the retainer, thus providing a low-profile joint. The assembly may be in the form of a movable push button for control of an electronic device. 1. An assembly comprising:a framework that includes a frame wall having an obverse side and an opposite reverse side, the framework defining a housing cavity;electronics components located in the housing cavity;a mounted component that is mounted on the frame wall such as to be exposed on the obverse side of the frame wall, the mounted component of being a button member that is operable to control one or more functionalities of the electronics components;a metal connector that is fast with the mounted component and that projects from the mounted component transversely through at least part of the frame wall;a metal retainer that is located on the reverse side of the frame wall such that part of the frame wall is sandwiched between the mounted component and the retainer; anda solder joint that fastens the retainer to the connector, thereby retaining the mounted component on the frame wall.2. The assembly of claim 1 , whereinthe retainer is of sheet metal construction oriented such that a thickness dimension of the retainer is transverse to the frame wall at the mounted component; andwherein the retainer has one or more connection cavities in which part of the connector is received, the solder joint being located at least in part in the one or more cavities.3. The assembly of claim 2 , wherein the solder joint has a height dimension that is oriented transversely to the frame wall at ...

A METHOD OF JOINING AND SEALING A VANADIUM BASED MEMBRANE TO A METALLIC CONNECTION SECTION

A method of joining and sealing a vanadium based membrane to a metallic connection section comprising: mounting a section of a vanadium based membrane on a connector formation of a connection section, the connection section being formed of a different metal to the vanadium based membrane, the connector formation providing a recess into which a section of the vanadium based membrane is seated and a connection interface in which the end face of the vanadium based membrane is proximate to or substantially abuts an adjoining face of the connector formation; mounting and operating a chiller arrangement in thermal contact with vanadium based membrane proximate the connection interface; heating a filler metal on the connection section to at least the liquidus temperature of the filler metal using a laser beam directed onto the filler metal located on the connection section and having a beam edge positioned at an offset location spaced apart from the connection interface a distance that attenuates direct heating of the vanadium based membrane by the laser beam, and on the connection section, such that the filler metal can flow over the connection interface from the offset location onto the vanadium based membrane; and cooling the filler metal to form a bridging section of filler metal between the vanadium based membrane and connection section over the connection interface. 1. A method of joining and sealing a vanadium based membrane to a metallic connection section comprising:mounting a section of a vanadium based membrane on a connector formation of a connection section, the connection section being formed of a different metal to the vanadium based membrane, the connector formation providing a recess into which a section of the vanadium based membrane is seated and a connection interface in which the end face of the vanadium based membrane is proximate to or substantially abuts an adjoining face of the connector formation;mounting and operating a chiller arrangement in ...

WIRE SPLICING DEVICE, WIRE SPLICING METHOD, AND METHOD FOR MANUFACTURING SPLICE STRUCTURE

A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together. 1. A wire splicing method comprising:disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween,pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder;keeping the first wire and the second wire pressed together by the pressing plate;separating the heating body from the pressing plate; andcooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.2. The wire splicing method according to claim 1 , whereinthe first wire and the second wire are superconducting wires.3. A method for manufacturing a splice structure comprising:disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween;pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder;keeping the first wire and the second wire pressed together by the pressing plate,separating the heating body from the pressing plate; andcooling the pressing plate to ...

WIRE SPLICING DEVICE, WIRE SPLICING METHOD, AND METHOD FOR MANUFACTURING SPLICE STRUCTURE

A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together. 1. A wire splicing method comprising:disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other;disposing solder to straddle the first wire and the second wire;disposing a connection wire on the solder;pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder;keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate;separating the heating body from the pressing plate; andcooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.2. The wire splicing method according to claim 1 , whereinthe first wire, the second wire, and the connection wire are superconducting wires.3. A method for manufacturing a splice structure comprising:disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire ...

METHODS AND SYSTEMS FOR REINFORCED ADHESIVE BONDING USING SOLDER ELEMENTS AND FLUX

The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The solder-adhesive mixture is heated to at least partially melt or at least partially vaporize the flux coating to promote a bonding condition between the solder-adhesive mixture and the first substrate. Finally, the second contact surface is then positioned adjacent the solder-adhesive mixture. The present technology additionally includes methods to produce a solder-reinforced adhesive bond joining a first substrate and a second substrate. 1. A bonding system formed by a process comprising:providing a first substrate having a first contact surface and a second substrate having a second contact surface, opposite the first contact surface;applying to the first contact surface a flux coating;applying to the first contact surface a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive, wherein the solder-adhesive mixture is heated to at least partially melt or at least partially vaporize the flux coating upon contact therewith, thereby promoting a bonding condition between the solder-adhesive mixture and the first substrate; andpositioning the second contact surface adjacent the solder-adhesive mixture, wherein the second contact surface is opposite the first contact surface.2. The product of the process of claim 1 , wherein the solder-adhesive mixture is heated to a flux melting temperature.3. The product of the process of claim 1 , wherein the flux coating is applied to the second contact surface prior to application of the solder-adhesive mixture.4. The product of the process of claim 1 , wherein at least one of the plurality of solder elements is in contact ...

CERAMIC-METAL STRUCTURE

A ceramic-metal structure in which a metallic body () is inserted into or disposed above a through hole () of a ceramic substrate () and which includes an annular pad layer () disposed around the through hole; an annular ring member () joined to the pad layer via a first brazing filler portion () and having a coefficient of thermal expansion smaller than that of the metallic body; a second brazing filler portion () intervening between the ring member and metallic body; and brazing filler flow prevention layers () covering an outer surface of the pad layer so as to expose a central region () of the outer surface of the pad layer facing the first brazing filler portion. The first brazing filler portion joins the central region and the ring member without projecting to a radially inner or outer side of the flow prevention layers. 1. A ceramic-metal structure in which a pipe-shaped or rod-shaped metallic body is inserted into a through hole extending through a ceramic substrate from a surface of the ceramic substrate in a thickness direction thereof or is coaxially disposed just above the through hole ,the ceramic-metal structure comprising:an annular pad layer made of a metal and disposed on the surface of the ceramic substrate to be located around the through hole;an annular ring member joined to the pad layer via a first brazing filler portion and having a coefficient of thermal expansion smaller than that of the metallic body;a second brazing filler portion intervening between the ring member and the metallic body and joining the ring member and the metallic body together; anda brazing filler flow prevention layer which covers an outer surface of the pad layer in such a manner as to expose a central region of an upper surface of the outer surface of the pad layer, the upper surface facing the first brazing filler portion,wherein the first brazing filler portion joins the central region and the ring member together without projecting to a radially inner side and a ...

Methods And Apparatuses For Assessing High Temperature Bonding Systems And Bonded Substrates Therefrom

Methods and apparatuses for assessing the behavior of high temperature bonding systems such as sinter joint models of virtual interconnect microstructures via simulations that analyze sinter joint model properties include defining a plurality of sinter joint objects in a virtual interconnect microstructure, each sinter joint object having a type and a size, and determining a location of individual sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model. The type is at least one of an intermetallic compound, a void, and a metal particle. The location is determined by, for each object, creating three-dimensional coordinates, and based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object. 1. A method for assessing an interconnect microstructure of a virtual assembly of a high temperature bonding of substrates , the method comprising:defining, by a processor, a plurality of sinter joint objects in the interconnect microstructure of the virtual assembly, each sinter joint object of the plurality of sinter joint objects having a type and a size, wherein the type is at least one of an intermetallic compound, a void, and a metal particle; and creating three-dimensional coordinates for the sinter joint object; and', 'based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object in the virtual joint space., 'determining, by the processor, a location of individual sinter joint objects of the plurality of sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model, wherein the location is determined by, for each individual sinter joint object2. The method of claim 1 , further comprising:creating, by the processor, a three-dimensional ...

X-RAY ILLUMINATION SYSTEM WITH MULTIPLE TARGET MICROSTRUCTURES

An x-ray illumination beam system includes an electron emitter and a target having one or more target microstructures. The one or more microstructures may be the same or different material, and may be embedded or placed atop a substrate formed of a heat-conducting material. The x-ray source may emit x-rays towards an optic system, which can include one or more optics that are matched to one or more target microstructures. The matching can be achieved by selecting optics with the geometric shape, size, and surface coating that collects as many x-rays as possible from the source and at an angle that satisfies the critical reflection angle of the x-ray energies of interest from the target. The x-ray illumination beam system allows for an x-ray source that generates x-rays having different spectra and can be used in a variety of applications. 1. An x-ray illumination beam system providing multiple characteristic x-ray energies from a plurality of x-ray generating materials selected for its x-ray generating properties , comprising:a vacuum chamber including an electron emitter;a first window transparent to x-rays and attached to a wall of the vacuum chamber;an electron optical system that focusses an electron beam from the electron emitter;a target comprising a plurality of microstructures coupled to a substrate,wherein each microstructure includes a material selected for its x-ray generating properties, and in which a lateral dimension of said material is less than 250 microns;a means to position the x-ray target relative to the electron beam; anda plurality of total external reflection mirror optics, wherein each of the plurality of optics is matched to the x-ray spectra produced by at least one of the plurality of microstructures and positioned to collect x-rays generated by the at least one of the plurality of microstructures when bombarded by the focused electron beam.2. The x-ray illumination beam system of claim 1 , wherein one or more of the plurality of total ...

Semiconductor Device and Method of Manufacturing Semiconductor Device

A semiconductor device includes: a semiconductor element; a conductor pattern provided on an insulating substrate and having a main surface to which the semiconductor element is joined; and a terminal electrode joined to the main surface of the conductor pattern by a hard solder material and electrically connected to the semiconductor element. A joining region joined to the hard solder material in the conductor pattern includes: a first region in which the terminal electrode exists in a plan view; and a second region located outside the first region and not overlapping with the terminal electrode. The conductor pattern on the insulating substrate and the terminal electrode can be firmly joined by the hard solder material. 1. A semiconductor device comprising:a semiconductor element;a conductor pattern provided on an insulating substrate and having a main surface to which the semiconductor element is joined; anda terminal electrode joined to the main surface of the conductor pattern by a hard solder material and electrically connected to the semiconductor element, a first region in which the terminal electrode exists in a plan view, and', 'a second region located outside the first region and not overlapping with the terminal electrode., 'a joining region joined to the hard solder material on the main surface of the conductor pattern including'}2. The semiconductor device according to claim 1 , wherein the semiconductor element is joined to the main surface of the conductor pattern by a soft solder material.3. The semiconductor device according to claim 1 , further comprising a resin case surrounding the insulating substrate claim 1 , whereinthe terminal electrode is attached to the resin case.4. The semiconductor device according to claim 1 , wherein the main surface of the conductor pattern has claim 1 , in the second region claim 1 , a roughened region that is greater in surface roughness than outside the joining region.5. The semiconductor device according to ...

Method for Joining Ceramic Bodies by means of an Active Hard Solder, or Braze, Assembly having at least two Ceramic Bodies joined with one another, especially a Pressure Measuring Cell

An assembly, comprising: a first ceramic body and a second ceramic body connected by means of a joint of an active hard solder, or braze, wherein the active hard solder, or braze, averaged over a continuous main volume, which includes at least 50% of the volume of the joint, has an average composition Cwith a liquidus temperature T(C). An edge region of the joint, which contacts at least one of the ceramic bodies, has an average composition Cwith a liquidus temperature T(C), which lies not less than 20 K, preferably not less than 50 K, and especially preferably not less than 100 K above the liquidus temperature T(C) of the average composition Cof the main volume. 117-. (canceled)18. An assembly , comprising:a first ceramic body; anda second ceramic body, wherein:said first ceramic body and said second ceramic body are connected by means of a joint, said joint contains an active hard solder, or braze;{'sub': M', 'l', 'M', 'M', 'M1', 'MN', 'M', 'Mi', 'i, 'said active hard solder, or braze, averaged over a continuous main volume, which includes at least 50%, especially at least 70% and preferably at least 80% of the volume of the joint, has an average composition Cwith a liquidus temperature T(C), wherein C:=(c, . . . , c), wherein |C|=1, and wherein the care the stoichiometric fractions of the components Ki=1, . . . , N of the average composition of the active hard solder, or braze, in the main volume; and'}{'sub': E', 'l', 'E', 'l', 'M', 'M', 'E', 'E1', 'EN', 'E', 'Ei', 'i, 'an edge region of said joint, which contacts at least one of said ceramic bodies and which overlaps no more than 8% of a main volume, for example, no more than 4% and especially no more than 2% of the main volume and preferably lies outside of the main volume, has an average composition Cwith a liquidus temperature T(C), which lies not less than 20 K, preferably not less than 50 K, and especially preferably not less than 100 K above the liquidus temperature T(C) of the average composition Cof the ...

METHODS FOR JOINING MATERIALS, AND MATERIAL COMPOSITE

A method for joining materials, includes: providing a first material and a second material, providing the first material with a grid structure at a joining point, and joining, in particular soldering, the second material to the grid structure such that a material composite of the first material and the second material is produced, wherein the grid structure is designed in such a way that stresses in the material composite are at least partly compensated by the grid structure. 1. A method for joining materials , comprising:a) providing a first material and a second material,b) providing the first material at a connection point with a grid structure, wherein the grid structure is produced with an additive production method or selective laser melting or electron beam melting, andc) connecting or soldering, the second material to the grid structure so that a material compound is generated from the first material and the second material, wherein the grid structure is formed in such a manner that tensions in the material compound are at least partially compensated by the grid structure.2. The method as claimed in claim 1 ,wherein the first material is a metallic material, or a nickel- or cobalt-based superalloy.3. The method as claimed in claim 1 ,wherein the second material is a ceramic material, or a ceramic fiber composite.4. The method as claimed in claim 1 ,wherein the grid structure is produced from the same material as the first material.5. The method as claimed in claim 1 ,wherein the first material is produced with an additive production method, or selective laser melting or electron beam melting.6. The method as claimed in claim 1 ,wherein the grid structure is produced in the same production method with the first material in order to form a composite component.7. The method as claimed in claim 6 ,wherein the composite component is a part of a gas turbine, or a part of a gas turbine upon which hot gas acts.8. The method as claimed in claim 1 ,wherein the second ...

Methods and systems for preparing superconductors for reaction and integration

A method and system for manufacturing a superconducting material is described. In one embodiment, a layer of refractory cushion is placed over a spool. A first layer of superconducting cable is wound over the first layer of refractory cloth. The superconducting cable is reaction heat-treated on the spool. A first layer of refractory fabric can be placed over the layer of refractory cushion. One or more adjustment mechanisms can be disposed between the first layer of the superconducting cable and the spool.

Nickel-chromium-phosphorous brazing alloys

Disclosed is the semi-amorphous, ductile brazing foil with composition consisting essentially of Ni bal Cr a B b P c Si d Mo e Fe f with approximately 24 atomic percent≦a≦approximately 31 atomic percent; b≦approximately 3 atomic percent; approximately 9 atomic percent≦c≦approximately 11 atomic percent; approximately 2 atomic percent≦d≦approximately 4 atomic percent; e≦approximately 2 atomic percent; f≦approximately 1 atomic percent; and the balance being Ni and other impurities; where b+c+d<approximately 16 atomic percent.

HIGH TEMPERATURE PROBE

High temperature probes and methods for assembling high temperature probes are disclosed. The high temperature probes may include a rod with a thermocouple embedded within the rod, and a ceramic matrix composite sheath substantially surrounding the rod. The high temperature probes may also include an outer metal tube surrounding a portion of the rod, and an inner metal tube positioned between the alumina rod and the outer metal tube, the inner metal tube being configured to prevent the rod from spatial displacement with respect to the outer metal tube. 1. A temperature probe comprising:a rod;a thermocouple embedded within the rod;an outer metal tube surrounding at least a portion of the rod;an inner metal tube positioned between the alumina rod and the outer metal tube configured to prevent the rod from spatial displacement with respect to the outer metal tube; anda ceramic matrix composite sheath substantially surrounding the rod and the outer metal tube.2. The temperature probe in accordance with claim 1 , wherein the rod includes at least a first member and a second member and wherein at least one of the first and second members includes a groove that forms a channel; andwherein the thermocouple is positioned within the channel.3. A method for assembling a temperature probe claim 1 , comprising:positioning a thermocouple between a first member and a second member;mating the first member and the second member to form a rod;placing an outer tube over at least a portion of the rod to engage the first and second members;placing an inner tube between at least a portion of the rod and at least a portion of the outer tube to secure the rod with respect to the outer tube; andapplying a ceramic matrix composite sheath to substantially cover the rod and the outer metal tube.5. The probe of claim 4 , wherein the thermocouple comprises:a first thermocouple wire; anda second thermocouple wire coupled to the first thermocouple wire to form the thermocouple.6. The probe of ...

PROCESSES FOR FORMING SELF-HEALING SOLDER JOINTS AND REPAIR OF SAME, RELATED SOLDER JOINTS, AND MICROELECTRONIC COMPONENTS, ASSEMBLIES AND ELECTRONIC SYSTEMS INCORPORATING SUCH SOLDER JOINTS

Solder joints comprising two different solder materials having different melting points, an outer solder material extending over an inner solder material bonded to a conductive pad, the inner solder material having a lower melting point than a melting point of the outer solder material and being in a solid state at substantially ambient temperature. A metal material having a higher melting point than a melting point of either solder material may coat at least a portion of the inner solder material. Microelectronic components, assemblies and electronic systems incorporating the solder joints, as well as processes for forming and repairing the solder joints are also disclosed. 1. A microelectronic component , comprising:a substrate having at least one bond pad on a surface thereof; and a first solder material having a first melting point contacting and protruding from the at least one bond pad; and', 'a second solder material within the first solder material contacting and protruding from the at least one bond pad, the second solder material being in a solid state at ambient temperature and having a second melting point lower than the first melting point., 'a solder joint on the at least one bond pad and comprising2. The microelectronic component of claim 1 , wherein the first solder material comprises an Sn—Ag—Cu (SAC) solder comprising 95.5% Sn claim 1 , 4.0% Ag and 0.5% Cu claim 1 , an Sn—Ag—Cu (SAC) solder comprising 95.5% Sn claim 1 , 3.8% Ag and 0.7% Cu claim 1 , or an Sn—Ag solder comprising 96.5% Sn and 3.5% Ag.3112904. The microelectronic component of claim 1 , wherein the second solder material comprises an Indalloy solder comprising 50% In and 50% Sn claim 1 , an Indalloy E solder comprising 52% In and 48% Sn claim 1 , an Indalloy solder comprising 97% In and 3% Ag claim 1 , or an Indalloy solder comprising 100% In.4. The microelectronic component of claim 1 , further comprising a protective coating of a metal material over the second solder material and ...

METHOD FOR THE BRAZING OF PARTS MADE FROM A COMPOSITE MATERIAL, INCORPORATING A SLUG IN THE BOND

A method of assembling together by brazing first and second parts made of composite material, each of the first and second parts having an assembly face for brazing with the assembly face of the other part, the method including making at least one perforation in the assembly face of the first part; interposing capillary elements between the assembly faces of the first and second parts made of composite material; placing the first and second parts facing each other while inserting a peg in each perforation of the first part; placing a brazing composition in contact with a portion of the capillary elements; and applying heat treatment to liquefy the brazing composition so as to cause the molten brazing composition to spread by capillarity between the assembly faces of the composite material parts. 1. A method of assembling together by brazing first and second parts made of composite material , each of the first and second parts having an assembly face for brazing with the assembly face of the other part , the method comprising:making at least one perforation in the assembly face of the first part;interposing capillary elements between the assembly faces of the first and second parts made of composite material;placing the first and second parts facing each other while inserting a peg in each perforation of the first part;placing a brazing composition in contact with a portion of the capillary elements; andapplying heat treatment to liquefy the brazing composition so as to cause the molten brazing composition to spread by capillarity between the assembly faces of the composite material parts.2. A method according to claim 1 , wherein clearance is provided between the inside wall of each perforation and the outside wall of the peg inserted in said perforation.3. A method according to claim 1 , wherein at least a first perforation is made in the assembly face of the first part and wherein a second perforation is made in the assembly face of the second part claim 1 , the ...

JOINT OF COPPER TERMINAL AND ALUMINIUM CONDUCTOR AND PLASMA WELDING METHOD THEREFOR

Provided is a joint of a copper terminal and an aluminum conductor. A copper terminal connecting member of the joint is connected to a conductive core of the aluminum conductor by means of a transition welding layer, and the joint can also be provided with a reinforcing welding layer. Further provided is a method for preparing the joint using plasma arc welding. According to the invention, the connection portion of the copper terminal with the aluminum conductor is filled with solder in a plasma arc welding manner, such that copper and aluminum are connected by means of the solder. Damage to an aluminum oxide layer during welding increases the conductivity and can also isolate the copper terminal and the aluminum conductor, thus preventing an electrochemical reaction between the copper and the aluminum. 1. A joint of a copper terminal and an aluminum wire , wherein the copper terminal comprises a connecting member and a functional member connected with the connecting member of the copper terminal , a conductive core of the aluminum wire is connected with the connecting member of the copper terminal , and at least the conductive core of the aluminum wire is connected with the connecting member of the copper terminal through a transition welding layer.2. The joint of a copper terminal and an aluminum wire according to claim 1 , wherein the joint of the copper terminal and the aluminum wire comprises a crimping region claim 1 , an area of the crimping region accounts for at least 1% of an overlapping area of the aluminum wire and the copper terminal; and preferably claim 1 , the area of the crimping region of the joint of the copper terminal and the aluminum wire accounts for at least 10% of the overlapping area of the aluminum wire and the copper terminal.3. The joint of a copper terminal and an aluminum wire according to claim 1 , wherein the transition welding layer is composed of solder claim 1 , a depth of penetration of the solder accounts for 3% to 100% of a ...

METHOD FOR MAKING A HIGH TEMPERATURE RESISTANT SILICON ALLOY JOINT FOR THE JOINING OF CERAMICS AND DEVICES USING SAME

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with a silicon and an alloying element under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck. 1. A method for the joining of ceramic materials , said method comprising the steps of:placing a brazing element in a joint interface area between the first interface surface of a first ceramic piece and the first interface area of a second ceramic piece to create a joining pre-assembly, said brazing element comprising a silicon and an alloying element;placing the joining pre-assembly into a process chamber;removing oxygen from said process chamber prior to the heating step; andheating said joining pre-assembly to a first joining temperature, thereby joining said first ceramic piece to said second ceramic.2. The method of wherein said first ceramic piece comprises aluminum nitride.3. The method of wherein said second ceramic piece comprises aluminum nitride.4. The method of wherein the step of removing oxygen from said process chamber comprises applying a pressure of lower than 1×10 E-4 Torr to said process chamber.5. The method of wherein the step of removing oxygen from said process chamber comprises applying a pressure of lower than 1×10 E-4 Torr to said process chamber.6. The method of wherein said brazing element comprises silicon containing alloying elements selected from the group consisting of aluminum claim 3 , copper claim 3 , magnesium claim 3 , nickel claim 3 , iron chrome claim 3 , titanium claim 3 , zirconium claim 3 , tantalum claim 3 , vanadium claim 3 , and tungsten.8. The method of wherein said brazing element comprises ...

METHOD FOR BRAZING OR REFILLING A PART WITH MICRO-INTERSTICES, AND HEAT EXCHANGER OBTAINED WITH SUCH A METHOD

Method for brazing or refilling comprising the following steps: 111-. (canceled)12. A brazing or refilling method , comprising the following steps:providing at least one part containing at least 90% by mass of a metal or metal alloy, the part having at least one face defining a plurality of interstices, the interstices comprising at least two opposite edges separated on the face by a maximum distance being less than or equal to 250 micrometers,obtaining a coating in contact with said face, the coating comprising at least a first layer located at least partially in the interstices, and a second layer adjacent to the first layer, the first layer comprising a first powder comprising at least 90% by mass of a metal or metal alloy and having a solidus temperature TSA, the second layer comprising a mixture of a second powder and a third powder, the second powder and the third powder being, respectively, different alloys suitable for brazing or refilling the part, the second powder having a solidus temperature TSB, and the third powder having a solidus temperature TSC strictly lower than the solidus temperature TSB,heating the part and the coating at a heating temperature strictly lower than the solidus temperature TSA, on the one hand, and lower than the solidus temperature TSB, and strictly higher than the solidus temperature TSC, and at least partially melting the coating, andcooling the part and the at least partially molten coating, and obtaining a solidified residue attached to the part.13. The method according to claim 12 , wherein the first powder comprises at least 90% by mass of the same metal or the same metal alloy as the part.14. The method according to claim 12 , wherein the second powder represents claim 12 , in said mixture claim 12 , a proportion by mass of between 60% and 95% claim 12 , said proportion by mass being before mixing.15. The method according to claim 12 , wherein the third powder comprises at least 70% by mass of nickel.16. The method ...

CUTTING PICK TOOL

A cutting pick tool including a cemented carbide support body that mounts a diamond composite cutting tip. The support body includes a recess having a conical region that mounts a complementary conical shaped mount portion of the tip. The components are brazed together to provide a secure and robust cutting tip region. 1. A cutting pick tool comprising:a cutting tip of a diamond composite, the tip having a mount portion extending axially rearward; anda cemented carbide support body having an axially forward region and an axially rearward region mounted at a steel pick body, the support body including a recess extending axially rearward from the forward region, the mount portion being received and mated within the recess, wherein the recess is defined by a conical sidewall that tapers radially inward in a direction from the forward to the rearward region and towards a central axis, the mount portion having a complementary truncated conical shape profile to seat within the recess.2. The tool as claimed in claim 1 , wherein an axial depth of the recess in an axial direction of the tool is in a range of 20 to 30% of a total axial length of the support body.3. The tool as claimed in claim 1 , wherein an angle by which the sidewall tapers radially inward relative to the central axis is in the range of 10 to 70°.4. The tool as claimed in claim 3 , wherein the range is 20 to 40°.5. The tool as claimed in claim 3 , wherein the range is 25 to 35°.6. The tool as claimed in a claim 1 , wherein a forward region of the tip includes a domed apex and is generally conical being defined by a cone surface claim 1 , an angle of the cone surface relative to the axis being at least equal to or greater than an angle by which the sidewall of the recess tapers radially inward relative to the axis.7. The tool as claimed in claim 1 , wherein a rearward end of the sidewall terminates at a substantially planar base surface.8. The tool as claimed in claim 7 , wherein an annular junction disposed ...

Attachment of Structures Having Different Physical Characteristics

Methods of bonding first structures to second structures are disclosed wherein the first and second structures are fabricated materials having different physical characteristics. For example, the first structure may be a composite fan blade and the second structure may be a composite or metallic rotor, both for use in gas turbine engines. The method includes providing the first and second structures and plating or otherwise coating a portion of the first structure with a metal to provide a metal-coated portion. The method includes applying at least one intermediate material onto the metal-coated portion of the first structure. The method further includes bonding the metal-coated portion of the first structure and the intermediate material to the second structure. The bonding is carried out using a relatively low-temperature process, such as liquid phase bonding, including TLP and PTLP bonding. Brazing is also a suitable technique, depending on the materials chosen for the first and second structures. 1. A method of bonding a first structure to a second structure , the first structure being non-metallic , the method comprising:providing the first and second structures;coating a portion of the first structure with a metal to provide a metal-coated portion;applying at least one intermediate material on the metal-coated portion; andbonding the metal-coated portion of the first structure and the intermediate material to the second structure.2. The method of wherein the bonding is a process selected from the group consisting of transient liquid phase (TLP) bonding claim 1 , partial transient liquid phase (PTLP) bonding and brazing.3. The method of wherein the second structure is metallic and the first structure is composite.4. The method of wherein the bonding includes diffusing intermediate material into the second structure and reacting intermediate material with the metal-coated portion of the first structure.5. The method of wherein the first and second structures are ...

METHOD FOR BRAZING PARTS MADE FROM A COMPOSITE MATERIAL, WITH ANCHORING OF THE BRAZED JOINT

A method of assembling together by brazing two parts made of composite material, each part having an assembly face for brazing with the assembly face of the other part, the method including: making a plurality of cavities in the assembly face of at least one of the two composite material parts, at least some of the cavities opening out into one or more portions of the part that are situated outside the assembly face; interposing capillary elements between the assembly faces of the composite material parts; placing a brazing composition in contact with a portion of the capillary elements; and applying heat treatment to liquefy the brazing composition so as to cause the molten brazing composition to spread by capillarity between the assembly faces of the composite material parts. 1. A method of assembling together by brazing two parts made of composite material , each part having an assembly face for brazing with the assembly face of the other part , the method comprising:making a plurality of cavities in the assembly face of at least one of the two composite material parts, at least some of said cavities opening out into one or more portions of the part that are situated outside the assembly face;interposing capillary elements between the assembly faces of the composite material parts;placing a brazing composition in contact with a portion of the capillary elements; andapplying heat treatment to liquefy the brazing composition so as to cause the molten brazing composition to spread by capillarity between the assembly faces of the composite material parts.2. A method according to claim 1 , wherein a plurality of grooves are made in the assembly face of at least one of the two composite material parts claim 1 , at least some of said grooves opening out into one or more faces adjacent to the assembly face of the at least one of the two composite material parts.3. A method according to claim 1 , wherein a plurality of grooves are made in the assembly face of at least one ...

PRESSURE SENSOR WITH EXTERNAL VERTICAL ELECTRICAL INTERCONNECTION SYSTEM

A pressure sensor assembly, which includes a support substrate, circuitry mounted to the support substrate, at least one conductor mounted to the support substrate and in electrical communication with the circuitry, and at least one vertically conductive path connected to and in electrical communication with the at least one conductor. The pressure sensor assembly also includes a diaphragm, at least one sealing glass section connected to the diaphragm and the support substrate, and at least one lateral conductive feed-through mounted to the diaphragm. At least one conductive joint is connected to the vertically conductive path and the lateral conductive feed-through, and the conductive joint provides electrical communication between the vertically conductive path and the lateral conductive feed-through. 1. A pressure sensor assembly , comprising:a support substrate;at least one conductor mounted to the support substrate;at least one vertically conductive path connected to and in electrical communication with the at least one conductor;a sensing bridge; andat least one conductive joint in electrical communication with the at least one vertically conductive path and the sensing bridge;wherein the sensing bridge sends a signal through the at least one vertically conductive path to the at least one conductor indicating the amount of pressure applied to the sensing bridge.2. The pressure sensor assembly of claim 1 , further comprising a diaphragm substrate claim 1 , wherein the sensing bridge is mounted to the diaphragm substrate.3. The pressure sensor assembly of claim 2 , further comprising at least one sealing glass section connected to the diaphragm substrate and the support substrate.4. The pressure sensor assembly of claim 2 , further comprising:at least one lateral conductive feed-through mounted to the diaphragm substrate;wherein the at least one lateral conductive feed-through is connected to and in electrical communication with the sensing bridge and the at ...

Method for affixing a metal sheet to a carbon structure using a brazing and soldering process

An assembly comprises a carbon structure ( 10 ), a metal sheet ( 40 ), a brazing layer ( 20 ) disposed on a surface of the carbon structure ( 10 ). The brazing layer ( 20 ) is formed by brazing a brazing material on the surface of the carbon structure ( 10 ), and a solder layer ( 30 ) disposed on a surface of the brazing layer ( 20 ) and binding the metal sheet ( 40 ) to the brazing layer ( 20 ). A method for affixing a metal sheet ( 40 ) to a carbon structure ( 10 ) and a method for metalizing a surface of a carbon structure ( 10 ) are also provided.

Window Assembly With Casing For Solder Joint

A window assembly () includes a transparent pane (), an electrical conductor () contacting the transparent pane (), an electrical connection element () for energizing the electrical conductor (), an electrically conductive solder joint () disposed between the electrical connection element () and the electrical conductor () for providing an electrical connection between the electrical connection element () and the electrical conductor (), an encapsulation () over the electrical connection element () and the electrical conductor (), and a casing () disposed between the encapsulation () and the electrical conductor () to prevent contact between the encapsulation () and the solder joint (). 1. A window assembly comprising:a transparent pane;an electrical conductor contacting said transparent pane;an electrical connection element for energizing said electrical conductor;an electrically conductive solder joint between said electrical connection element and said electrical conductor for providing an electrical connection between said electrical connection element and said electrical conductor;an encapsulation over said electrical connection element and said electrical conductor; anda casing disposed between said encapsulation and said electrical conductor and contacting said encapsulation and said transparent pane to prevent contact between said encapsulation and said solder joint.2. A window assembly set forth in wherein said casing is set apart in substantially all areas to form a layer of air between said encapsulation and said solder joint to prevent stress imparted on said casing from said encapsulation from being transferred to said solder joint to prevent said transparent pane from cracking.3. A window assembly as set forth in wherein said casing surrounds said solder joint.4. A window assembly as set forth in wherein said casing is made of a polymeric material.5. A window assembly as set forth in including an adhesive to attach said casing to said transparent pane. ...

ADVANCED BRAZE JOINT FOR TUBE-TO-TUBE CONNECTION

Systems for tube-to-tube connections are described herein. A device having an aperture for receiving a tube may comprise: an inlet portion comprising a first diameter, the inlet portion located at an inlet of the aperture; a braze filler collector portion located axially adjacent to the inlet portion comprising a second diameter, the second diameter being greater than the first diameter; a necked portion located axially adjacent to the braze filler collector portion comprising a third diameter, the third diameter being less than the first diameter and the second diameter; a flow surface comprising a fourth diameter, the fourth diameter being less than the third diameter, the flow surface defining a void; and a collection pocket located axially adjacent to the necked portion, the collection pocket configured to collect a braze filler material from the necked portion to prevent the braze filler material from contacting the flow surface. 1. A device having an aperture for receiving a tube comprising:an inlet portion comprising a first diameter, the inlet portion located at an inlet of the aperture;a braze filler collector portion located axially adjacent to the inlet portion comprising a second diameter, the second diameter being greater than the first diameter;a necked portion located axially adjacent to the braze filler collector portion comprising a third diameter, the third diameter being less than the first diameter and the second diameter;a flow surface comprising a fourth diameter, the fourth diameter being less than the third diameter, the flow surface defining a void; anda collection pocket located adjacent to the necked portion, the collection pocket configured to collect a braze filler material from the necked portion to prevent the braze filler material from contacting the flow surface.2. The device of claim 1 , wherein at least a portion of at least one of the inlet portion claim 1 , the braze filler collector portion claim 1 , the necked portion claim 1 , ...

LOW-PROFILE MECHANICAL RETENTION

An assembly of mechanical components includes a solder joint between two metal components. A mounted component is retained on one side of a support structure by a solder joint on the other side of the support structure between a retainer and a connector that is fast with the mounted component and extends through the support structure. The retainer is of sheet metal construction, so that a height of the solder joint is no more than the thickness of the retainer, thus providing a low-profile joint. 1. An assembly comprising:a framework that includes a frame wall having an obverse side and an opposite reverse side;a mounted component that is mounted on the frame wall such as to be exposed on the obverse side of the frame wall, the mounted component being of a polymeric plastics material;a metal connector fast with the mounted component, the connecter being partially embedded in the mounted component and projecting from the mounted component towards the reverse side of the frame wall;a metal retainer that is located on the reverse side of the frame wall such that part of the frame wall is sandwiched between the mounted component and the retainer; anda solder joint between the retainer and the connector, the solder joint fastening the retainer to the connector and thereby retaining the mounted component on the frame wall.2. The assembly of claim 1 , whereinthe retainer is of sheet metal construction oriented such that a thickness dimension of the retainer is transverse to the frame wall at the mounted component; andwherein the retainer has one or more connection cavities in which part of the connector is received, the solder joint being located at least partly at an interface between the connector and the one or more connection cavities.3. The assembly of claim 2 , wherein the solder joint has a height dimension that is oriented transversely to the frame wall at the mounted component and that coincides substantially with an overlap between the retainer and the connector ...

MULTILAYER BRAZE TAPE

A method may include positioning a multilayer braze tape at a joint between a first part comprising a ceramic or CMC and a second part comprising at least one of a ceramic, a CMC, a metal, or an alloy. The multilayer braze tape may include at least one layer comprising a silicon-containing braze material and at least one layer comprising a reinforcement material. The method also may include applying pressure to compress the multilayer braze tape between the first part and the second part, and heating the multilayer braze tape to melt the silicon-containing braze material and join the first part and the second part. 1. A method comprising: at least one layer comprising a silicon-containing braze material; and', 'at least one layer comprising a reinforcement material;, 'positioning a multilayer braze tape at a joint between a first part comprising a ceramic or ceramic matrix composite (CMC) and a second part comprising at least one of a ceramic, a CMC, a metal, or an alloy, wherein the multilayer braze tape comprisesapplying pressure to compress the multilayer braze tape between the first part and the second part; andheating the multilayer braze tape to melt the silicon-containing braze material and join the first part and the second part.2. The method of claim 1 , wherein the multilayer braze tape comprises:a first layer comprising the silicon-containing braze material;a second layer comprising the silicon-containing braze material; anda third layer comprising the reinforcement material, wherein the third layer is between the first layer and the second layer.3. The method of claim 1 , wherein the reinforcement material comprise silicon carbide.4. The method of claim 1 , wherein the at least one layer comprising the reinforcement material further comprises at least one of graphite claim 1 , carbon black claim 1 , or diamond.5. The method of claim 1 , wherein the at least one layer comprising the silicon-containing braze material further comprises an organic binder ...

METHOD FOR PRODUCING AN ESPECIALLY LARGE AERONAUTICAL PART

The present disclosure relates to a method for producing a final metal part for a nacelle of a turbojet. The method includes brazing at least two parts, one being an inner part having an inner surface and the other being an outer part having an outer surface. The method further includes a step of heating the outer surface of the outer part using an external heating means, and a step of heating the inner surface of the inner part using an internal heating means. 1. A method for manufacturing a metal final part of turbojet engine nacelle , the method comprising:brazing of at least two parts, the two parts comprising an inner part having an inner surface and an outer part having an outer surface;heating the outer surface of the outer part by an outer heating means; andheating the inner surface of the inner part by an inner heating means.2. The method according to claim 1 , wherein the step of heating the inner surface of the inner part by the inner heating means is simultaneous with the heating step of the outer surface of the outer part by the outer heating means.3. The method according to claim 1 , further comprising a cooling step by a gas of at least one heating means.4. The method according to claim 3 , wherein the cooling step is performed by means of an inert gas.5. The method according to claim 3 , wherein the cooling step is performed by means of argon.6. The method according to claim 1 , wherein the metal final part is manufactured from titanium.7. The method according to claim 1 , wherein the metal final part is a revolution part.8. The method according to claim 1 , wherein the metal final part is an inner fixed structure.9. The method according to claim 1 , further comprising a heating step at a temperature greater than necessary so as to reduce the brazing cycle time.10. A brazing device manufactured according to the method of .11. The method according to claim 10 , further comprising a heating step by an inner heating means. This application is a ...

CERAMIC CIRCUIT SUBSTRATE AND ITS PRODUCTION METHOD

A method for producing a ceramic circuit substrate comprising the steps of forming brazing regions each comprising brazing material powder and an organic binder on a ceramic substrate; setting metal plates on the ceramic substrate via the brazing regions, and heating the ceramic substrate, the brazing regions and the metal plates to bond the metal plates to the ceramic substrate via brazing layers made of the brazing material, thereby forming a bonded body; and cleaning the bonded body with a hypochlorite-containing agent. 1. A method for producing a ceramic circuit substrate comprising the steps of:forming brazing regions each comprising brazing material powder and an organic binder on a ceramic substrate;setting metal plates on said ceramic substrate via said brazing regions, and heating said ceramic substrate, said brazing regions and said metal plates to bond said metal plates to said ceramic substrate via brazing layers made of said brazing material, thereby forming a bonded body; andcleaning said bonded body with a hypochlorite-containing agent.2. The method for producing a ceramic circuit substrate according to claim 1 , further comprising a step of forming a resist layer on said metal plates after the bonding step and before the cleaning step claim 1 , a step of etching said metal plates to form circuit patterns claim 1 , and then a step of removing residual brazing layers.3. The method for producing a ceramic circuit substrate according to claim 1 , wherein the concentration of hypochlorite is 2.5-13.5% by mass as sodium hypochlorite.4. The method for producing a ceramic circuit substrate according to claim 1 , wherein said agent has pH of 9 or more.5. The method for producing a ceramic circuit substrate according to claim 1 , wherein said cleaning is conducted at 30° C. or higher for 5 minutes or more.6. A ceramic circuit substrate comprising a ceramic substrate claim 1 , two brazing layers formed on said ceramic substrate claim 1 , and two metal plates ...

JOINT STRUCTURE AND SEMICONDUCTOR DEVICE STORAGE PACKAGE

A joint structure includes: a ceramic member; a metallized layer formed on a surface of the ceramic member; and a metal member joined to the metallized layer via a brazing material. The metal member includes a base part erected on the metallized layer, and an extended part extended from the base part to define a predetermined gap with respect to the metallized layer. The base part includes an end joined to the metallized layer by a brazing material layer including the brazing material, and a side joined to the metallized layer around the base part by a fillet including the brazing material formed on the metallized layer around the base part. The extended part defines a recess at a position facing the metallized layer on which the fillet is formed. 1. A joint structure comprising:a ceramic member;a metallized layer formed on a surface of the ceramic member; anda metal member joined to the metallized layer via a brazing material,wherein the metal member includes a base part erected on the metallized layer, and an extended part extended from the base part to define a predetermined gap with respect to the metallized layer,wherein the base part includes an end joined to the metallized layer by a brazing material layer including the brazing material, and a side joined to the metallized layer around the base part by a fillet including the brazing material formed on the metallized layer around the base part, andwherein the extended part defines a recess at a position facing the metallized layer on which the fillet is formed.2. The joint structure according to claim 1 , wherein the base part defines a first expanded recess that is adjacent to and integrated with the recess.3. The joint structure according to claim 2 ,wherein the base part extends beyond the extended part, andwherein the base part defines a second expanded recess that is integrated with the first expanded recess and extends along the base part beyond the extended part.4. The joint structure according to claim ...

ARC WELDING/BRAZING PROCESS FOR LOW-HEAT INPUT COPPER JOINING

An arc welding/brazing process is disclosed that is useful to join together a first copper piece and a second copper piece without damaging more heat-sensitive materials that may be located nearby is disclosed. The arc welding/brazing process includes using a non-consumable electrode wire, which electrically communicates with a weld control in a straight polarity orientation, to strike an arc across a gap established between a leading tip end of the electrode wire and the first copper piece. The current that flows through the arc when the arc is established heats the first copper piece such that the first copper piece becomes joined to a second copper piece. The joint between the first copper piece and the second copper piece may be an autogenous weld joint or a braze joint. 1. A method of joining a first copper piece to a second copper piece , the method comprising:protracting a non-consumable electrode wire forward along a longitudinal axis such that a leading tip end of the electrode wire makes contact with a first copper piece, the non-consumable electrode wire being in electrical communication with a weld control that is configured to supply DC electrical current to the non-consumable electrode wire in a straight polarity orientation;supplying DC electrical current to the non-consumable electrode wire while the leading tip end of the electrode wire and the first copper piece are in contact;retracting the non-consumable electrode wire rearward along the longitudinal axis while current is being supplied to the non-consumable electrode wire to strike an arc across a gap established between the leading tip end of the electrode wire and the first copper piece; andprotracting the non-consumable electrode wire forward along the longitudinal axis until the leading tip end again makes contact with the first copper piece and extinguishes the arc, and wherein an input of heat from current flowing through the arc when the arc is established heats the first copper piece ...

ARC WELDING METHOD AND ARC WELDING APPARATUS

Provided is an arc welding method and arc welding apparatus for arc welding by a brazing filler metal two base materials subjected to a plating process. An arc welding method for arc welding two base materials, at least one of which has a plating layer thereon, by a brazing filler material, performs alternately a plating layer removal process of removing a plating layer by performing arc discharge at a first current value while moving a welding torch along a welding line in a state of stopping feed of the brazing filler metal, and a brazing filler metal welding process of welding the brazing filler metal to a position where the plating layer is removed, by performing arc discharge at a second current value smaller than the first current value while feeding the brazing filler metal in a state of stopping a movement of the welding torch. 1. An arc welding method for arc welding two base materials , at least one of which has a plating layer thereon , by a brazing filler metal , performing a plating layer removal process and a brazing filler metal welding process alternately , whereinthe plating layer removal process removes the plating layer by performing arc discharge at a first current value while moving a welding torch along a welding line in a state of stopping feed of the brazing filler metal, andthe brazing filler metal welding process welds the brazing filler metal to a position where the plating layer is removed, by performing arc discharge at a second current value smaller than the first current value while feeding the brazing filler metal in a state of stopping a movement of the welding torch.2. The arc welding method as set forth in claim 1 , whereinone of the two base materials is a first base material which is an Fe-based metallic member coated with the plating layer containing Zn, the other is a second base material which is an Al-based metallic member, andthe brazing filler metal is a ZnSi-based brazing filler metal.3. The arc welding method as set forth ...

HEAT EXCHANGER AND METHOD FOR PRODUCING SAME

A heat exchanger includes multiple aluminum heat transfer tubes through which a heat medium flows, and multiple aluminum connection pipes brazed to end portions of the heat transfer tubes. A heat equalizing member formed of a heat conductor is disposed to be in contact with at least two of the connection pipes and be capable of transferring heat therebetween. A method for producing the heat exchanger includes brazing the heat transfer tubes to the connection pipes in a state where the heat equalizing member is in contact with the at least two of the connection pipes. 1. A heat exchanger comprising:a plurality of heat transfer tubes through which a heat medium flows, the plurality of heat transfer tubes being made of aluminum and arrayed side by side;a plurality of connection pipes through which the heat medium flows, the plurality of connection pipes being made of aluminum and brazed to end portions of the plurality of heat transfer tubes; anda heat equalizing device formed of a heat conductor and disposed to be in contact at least partly with at least two of the plurality of connection pipes and be capable of transferring heat therebetween.2. The heat exchanger according to claim 1 , whereinthe heat equalizing device and the plurality of connection pipes are brazed to each other, anda brazing material that joins the plurality of heat transfer tubes to the plurality of connection pipes is lower in melting point than a brazing material that joins the heat equalizing device to the plurality of connection pipes.3. The heat exchanger according to claim 1 , whereina brazing material that joins the plurality of heat transfer tubes to the plurality of connection pipes contains one of an Al—Cu—Si brazing material and an Al—Cu—Si—Zn brazing material.4. The heat exchanger according to claim 1 , wherein the heat equalizing device and the plurality of connection pipes are in mechanical contact with each other.5. The heat exchanger according to claim 1 , wherein the plurality of ...

METHOD OF MANUFACTURING AN ALUMINUM STRUCTURE

A brazing method includes shaping a clad sheet to form a hollow structure. A tube is then partially inserted into a through hole in the hollow structure, thereby forming an assembled aluminum structure. The exterior surface of the hollow structure adjacent the through hole is composed of an Al—Si alloy that serves as a first filler material. The interior surface of the hollow structure adjacent the through hole is composed of an Al—Si alloy containing at least one of Cu and Zn and having a solidus temperature of 570° C. or less that serves as a second filler material. The assembled aluminum structure is brazed by heating it in an inert-gas atmosphere such that fillets joining the hollow structure to the tube along the through hole are formed first on the interior surface of the hollow structure and then on the exterior surface of the hollow structure. 1. A fluxless brazing method comprising:preparing a clad sheet that: (i) has a multi-layer structure comprising at least a core composed of an aluminum material, a first filler material composed of an Al—Si alloy and disposed on a first side of the core, and a second filler material composed of an Al—Si alloy containing at least one of Cu and Zn and having a solidus temperature of 570° C. or less, and that is disposed on a second side of the core; and (ii) contains, in at least one of the layers of the multi-layer structure, an element that breaks down an oxide film;preparing a tubular member composed of an aluminum material;manufacturing a hollow structure from the clad sheet, the outer-surface side of the hollow structure being composed of the first filler material and the hollow structure having a through hole into which the tubular member is inserted;assembling an aluminum structure such that the tubular member is inserted into the through hole and an end part of the tubular member is disposed in the interior of the hollow structure; andperforming a brazing process in which the aluminum structure is heated in an ...

DEVICE COMPRISING AN ANODE FOR GENERATING X-RAY RADIATION

An anode for generating X-radiation having a holder and a target layer held by the holder, the target layer comprising a middle section and an edge section, is provided. The anode is provided for being exposed to an electron beam directed at the middle section of the target layer. The edge section is arranged laterally next to the middle section in relation to the direction of the electron beam. Furthermore, the edge section is thicker than the middle section in the direction of the electron beam. 1. An anode for generating x-ray radiation , comprising;a holder; anda target layer held by the holder, the target layer comprising a central portion and an edge portion,wherein the anode is provided to be exposed to an electron beam directed onto the central portion of the target layerwherein the edge portion is arranged laterally next to the central portion in relation to a direction of the electron beam;wherein the edge portion has a greater thickness in the direction of the electron beam than the central portion.2. The anode as claimed in claim 1 , wherein the edge portion is raised over the central portion in a direction opposite to the direction of the electron beam.3. The anode as claimed in claim 1 , wherein the edge portion is arranged around the central portion in a ring-shaped manner.4. The anode as claimed in claim 1 , wherein the target layer is comprised of a uniform material.5. The anode as claimed in claim 1 , wherein the target layer is comprised of a material with an atomic number of between 42 and 74.6. The anode as claimed in claim 5 , wherein the target layer is comprised of tungsten.7. The anode as claimed in claim 1 , wherein the central portion has a thickness of between 50 nm and 10 μm.8. The anode as claimed in claim 1 , wherein the central portion has a diameter of between 1 mm and 20 mm perpendicular to the direction of the electron beam.9. A device for generating x-ray radiation claim 1 , comprising a cathode for emitting an electron beam and ...

BRAZING ALLOYS

An alloy is provided having the composition TiZrCoRwherein R represents any element other than Ti, Zr, or Co 0.182≦x≦0.718 0.154≦y≦0.681 0.08≦z≦0.3 and 0.95≦x+y+z≦1. the alloy may be used to braze titanium and titanium alloys. 2. An article as claimed in claim 1 , in which R comprises or consists of incidental impurities.3. An article as claimed in claim 1 , in which R comprises or consists of one or more biocompatible elements.4. An article as claimed in claim 1 , in which x is greater than 0.2 or greater than 0.25 or greater than 0.3 or greater than 0.35 or greater than 0.4.5. An article as claimed in claim 1 , in which x is less than 0.65 or less than 0.6 or less than 0.55 or less than 0.5.6. An article as claimed in claim 1 , in which y is greater than 0.2 or greater than 0.25 or greater than 0.3.7. An article as claimed in claim 1 , in which y is less than 0.65 or less than 0.6 or less than 0.55 or less than 0.5 or less than 0.45 or less than 0.4.8. An article as claimed in claim 1 , in which z is greater than 0.1 or greater than 0.15.9. An article as claimed in claim 1 , in which z is less than 0.25 or less than 0.2.10. An article as claimed in claim 1 , in which x+y+z is greater than 0.96 or greater than 0.97 or greater than 0.98 or greater than 0.99 or greater than 0.995.11. An article as claimed in claim 1 , in which the alloy has a liquidus below 880° C.12. An alloy precursor that when melted in a brazing process with at least one component formed from titanium or titanium alloy and at least one component formed from a material selected from the group metals claim 1 , alloys claim 1 , ceramics claim 1 , or glasses forms an article as claimed in claim 1 , the precursor comprising two or more metal layers of different composition that when melted form an alloy as specified in .13. An alloy precursor that when melted in a brazing process with at least one component formed from titanium or titanium alloy and at least one component formed from a material ...

Method for producing a metal-ceramic soldered connection

A method for producing a material-bonding metal-ceramic soldered connection of an uncoated ceramic body to a metal part uses a metallic solder and begins by choosing the metal part with a 50% fraction of an oxygen-affine element; choosing the ceramic body with at least 80% aluminum oxide, zirconium oxide, silicon oxide or an alloy thereof; choosing an inactive, eutectic or near-eutectic solder; and forming a structure with the ceramic body and the metal part with an intermediate space between the their opposing surfaces. The solder is introduced into the intermediate space or the vicinity thereof. The structure is heated in a vacuum at a soldering temperature (T) greater than the liquidus temperature (TL) of the solder for a soldering period. The connection is applied between a ceramic bushing and a high-temperature sensor.

OPTICAL COUPLING ASSEMBLIES FOR COUPLING OPTICAL CABLES TO SILICON-BASED LASER SOURCES

Optical coupling assemblies for silicon-based optical sources are disclosed. In one embodiment, an optical coupling assembly includes an optical coupling carrier frame and a jumper cable assembly. The optical coupling carrier frame includes a frame portion defining an integrated circuit opening operable to receive an integrated circuit assembly, and a connector portion extending from the frame portion. The connector portion includes a channel operable to receive an optical connector of an optical cable assembly. The jumper cable assembly is disposed within the connector portion. The jumper cable assembly includes a plurality of jumper optical fibers, a jumper ferrule coupled to a first end of the plurality of jumper optical fibers, and an optical turn assembly coupled to a second end of the plurality of jumper optical fibers. The optical turn assembly is operable to optically turn optical signals propagating within the optical turn assembly. 1. An optical coupling assembly comprising: a frame portion defining an integrated circuit opening operable to receive an integrated circuit assembly; and', 'at least one connector portion extending from the frame portion, wherein the at least one connector portion comprises a channel operable to receive an optical connector of an optical cable assembly; and, 'an optical coupling carrier frame comprising a plurality of jumper optical fibers having a first end and a second end;', 'a jumper ferrule coupled to the first end of the plurality of jumper optical fibers; and', 'an optical turn assembly coupled to the second end of the plurality of jumper optical fibers, wherein the optical turn assembly is operable to optically turn optical signals propagating within the optical turn assembly from a first direction to a second direction., 'at least one jumper cable assembly disposed within the at least one connector portion, the at least one jumper cable assembly comprising2. The optical coupling assembly of claim 1 , wherein the at ...

METHOD TO PROVIDE A BRAZE COATING WITH WEAR PROPERTY ON MICROMIXER TUBES

Manufactured articles, and methods of manufacturing enhanced wear protected components and articles. More particularly, wear protected components and articles, such as combustor components of turbine engines, and even more particularly enhanced wear protected micromixer tubes and assemblies thereof with one or more micromixer plates, the micromixer tubes having wear protection for enhanced performance and reduced wear related failure. Methods including surface treatment to enhance wear, including vacuum braze application of coatings to enhance surface hardness for wear benefits. 1. A micromixer assembly of a turbine system comprising:a plate having at least one aperture having a receiving diameter;at least one micromixer tube having an inlet and an outlet for receiving a flow and dispersing the flow to a combustor, and having an outer surface having a diameter configured to fit within the receiving diameter of the at least one plate aperture, the at least one micromixer tube comprising on at least a portion of its outer surface a wear resistant treatment; the at least one micromixer tube being inserted through the plate aperture and optionally operably coupled at a location on its outer surface to the plate at the at least one aperture.2. The micromixer assembly of claim 1 , comprising a plurality of plate apertures and a plurality of micromixer tubes inserted therethrough.3. The micromixer assembly of claim 2 , wherein one or more of the at least one micromixer tube is operably coupled to the plate.4. The micromixer assembly of claim 3 , wherein the mode of coupling between the one or more of the at least one micromixer tube and the plate is brazing.5. The micromixer assembly of claim 3 , wherein the mode of coupling between the one or more of the at least one micromixer tube and the plate is friction welding.6. The micromixer assembly of claim 3 , wherein the surface treatment comprises a protective coating.7. A method of assembling a micromixer assembly of a ...

METHOD FOR PRODUCING A PLATE HEAT EXCHANGER AND PLATE HEAT EXCHANGER WITH THERMOCOUPLES OR MEASURING RESISTORS

The present invention concerns a method for producing a plate heat exchanger () with a multiplicity of parting sheets () and a multiplicity of fins (), a fin being respectively arranged between two neighboring parting sheets, wherein at least one capillary () with at least one thermocouple and/or measuring resistor element () is introduced into at least one parting sheet (), and wherein in each case a parting plate of the multiplicity of parting plates and a fin of the multiplicity of fins are alternately arranged and are connected to one another in a material-bonding manner, and concerns a plate heat exchanger () produced in such a way. 11201112. Method for producing a plate heat exchanger () with a multiplicity of parting sheets () and a multiplicity of fins ( , ) , a fin being respectively arranged between two neighboring parting sheets ,{'b': 30', '40', '103', '20', '20, 'wherein at least one capillary () with at least one thermocouple and/or measuring resistor element () is introduced () into at least one parting sheet () of the multiplicity of parting sheets (), and'}{'b': 104', '106, 'wherein in each case a parting plate and a fin are alternately arranged () and are connected to one another in a material-bonding manner ().'}21074030. Method according to claim 1 , wherein temperature values are recorded () by means of the at least one thermocouple and/or measuring resistor element () in the at least one capillary () during the material-bonding connection.3201112106. Method according to claim 1 , wherein the parting sheets () and the fins ( claim 1 , ) are respectively connected to one another in a material-bonding manner () by means of a brazing process claim 1 , in particular by means of a vacuum brazing process.430103232420. Method according to claim 1 , wherein the at least one capillary () is introduced () into a groove ( claim 1 , ) in the at least one parting sheet ().5202122. Method according to claim 1 , wherein the at least one parting sheet () is ...

JOINT PART

Provided is joint part capable of suppressing diffusion of carbon and nitrogen contained in the steel member to the TiAl-based alloy member and suppressing formation of voids, titanium carbide or a nitride due to diffusion of carbon and nitrogen contained in the steel member, and thereby suppressing decrease in the brazing strength. A joint part comprises a steel member containing alloy elements including C and Cr, a TiAl-based alloy member, and a Ni-based brazing filler metal via which the steel member and the TiAl-based alloy member are joined to each other, wherein the steel member has a carbide and a nitride each forming a bond with at least one of the alloy elements at least on a side of a boundary with the Ni-based brazing filler metal, and diffusion of C and N to the Ni-based brazing filler metal adjacent to the TiAl-based alloy member is suppressed by the carbide and the nitride. The joint part may be a turbine body comprising a turbine wheel and a shaft and a structural steel material of the shaft is structural steel material containing 0.30 to 0.45 wt % of C and 0.85 to 1.25 wt % of Cr, or a martensitic stainless steel material containing at most 15 wt % of C and 11.5 to 13 wt % of Cr. 1. A joint part comprising a steel member containing alloy elements including C and Cr , a TiAl-based alloy member , and a Ni-based brazing filler metal via which the steel member and the TiAl-based alloy member are joined to each other ,wherein the steel member has a carbide and a nitride each forming a bond with at least one of the alloy elements at least on a side of a boundary with the Ni-based brazing filler metal, and diffusion of C and N to the Ni-based brazing filler metal adjacent to the TiAl-based alloy member is suppressed by the carbide and the nitride.2. The joint part according to claim 1 , wherein the steel member comprises a structural steel material containing 0.30 to 0.45 wt % of C and 0.85 to 1.25 wt % of Cr claim 1 , and has a carbide and a nitride having ...

Resistance Brazing for a Shaft Balancing System

A method and a system of balancing a shaft for an axle assembly. The method may include using an electrical resistance welder to weld a balance weight to a shaft proximate an imbalance location using an insert or brazing material. The insert material may have a lower liquidus temperature than a liquidus temperatures of the shaft and balancing weight. 1. A method of balancing a shaft for an axle assembly , the method comprising:locating an imbalance location of the shaft, the shaft being made of cast iron;applying an insert material and a balance weight adjacent the imbalance location;positioning a first electrode in contact with the balance weight and a second electrode in contact with a surface of the shaft;providing current the first and second electrodes to heat the shaft and the insert material, without melting the shaft; anddeactivating the first and second electrodes to permit the insert material to cool and secure the balance weight to the shaft.2. The method of claim 1 , wherein the insert material has a liquidus temperature that is less than a liquidus temperature of the shaft and is less than a liquidus temperature of the balance weight.3. The method of claim 2 , further comprising deactivating the first and second electrodes after heating the insert material to the liquidus temperature of the insert material and prior to heating the shaft to the liquidus temperature of the shaft and prior to heating the balance weight to a liquidus temperature of the balance weight.4. The method of claim 1 , wherein applying the insert material comprises applying the insert material on the balance weight prior to positioning the balance weight adjacent the imbalance location.5. The method of claim 1 , wherein applying the insert material comprises applying the insert material on the shaft adjacent the imbalance location prior to positioning the balance weight adjacent the imbalance location.6. The method of claim 5 , wherein the insert material is applied using a solid- ...

Electrical contacts, fusible members, and methods of attaching electrical contacts to substrates

A contact includes a body section, a tail section arranged at a lower portion of the body section, a peg extending from the tail section such that the peg projects from a front surface of the contact, and a fusible member attached to the contact such that the peg protrudes into the fusible member. A lower portion of the fusible member is offset from a main portion of the fusible member.

BRAZING JOINING METHOD OF CNT ASSEMBLIES ON SUBSTRATES USING AN AT LEAST TERNARY BRAZING ALLOY; CORRESPONDING BRAZING MATERIAL AND DEVICE COMPRISING SUCH ASSEMBLY

The present application describes a joining method of a Carbon Nanotube-assembly () on a substrate (), showing a reproducible controlled joining with partly carbidization of the carbon nanotubes. To solve this problem, the Carbon Nanotube-assembly () is fixed to the substrate () by an active brazing process, with the steps of: melting and subsequent wetting and spreading of an active brazing alloy () in form of a at least ternary alloy, comprising an amount of copper and at least one carbide forming element with an amount of at least 1 wt % onto the substrate (), contacting of the Carbon Nanotube-assembly () with the active brazing alloy () on the substrate (), followed by a heating step of the components () in vacuum or inert gas atmosphere to temperatures above the solidus temperature of the active brazing alloy () and between C. and C. corresponding brazing material and assembly are also claimed. 1. Joining method of a Carbon Nanotube-assembly on a substrate using an active brazing alloy in form of an at least ternary alloy , comprising an amount of copper and at least one carbide forming element with an amount of at least 1 wt. % , whereinthe Carbon Nanotube-assembly is fixed to the substrate by an active brazing process, comprising:at least partial melting and subsequent wetting of the substrate by and spreading of an active brazing alloy in form of the at least ternary alloy, comprising the amount of at least 20 wt. % of copper and an organic binder, whereas the active brazing alloy having a solidus temperature above 770° C., onto the substrate, while heating in vacuum or inert gas atmosphere to temperatures above the solidus temperature of the active brazing alloy and between 800° C. and 900° C., while the Carbon Nanotube-assembly is contacted before, simultaneous or after heating with the active brazing alloy on the substrate.2. Method according to claim 1 , wherein the organic binder is a cellulose nitrate binder.3. Method according to claim 1 , wherein the ...

BONDED ASSEMBLY OF DISSIMILAR MATERIALS AND METHOD OF MANUFACTURE OF THE SAME

The disclosure relates to bonded assemblies () and a method of manufacture of such bonded assemblies (). A such bonded assembly () has low residual stress and includes an inner body () having a substantially conical form, an outer body () having a substantially conical recess and a bonding region; whereby the conical form is in a first material having a thermal expansion coefficient al and the conical recess is in a second material having a thermal expansion coefficient a2 whereby al is not equal to a2; whereby said conical form includes an axis () extending in an axial direction and is substantially concentric with said conical recess; said bonding region including at least a third material having a plurality of grains and with an alignment of said grains relative to the generatrices of said conical form and said conical recess; said related method including an axial displacement of said inner body () relative to said outer body () simultaneous with cooling of said bonded assembly () from an elevated temperature to a low or ambient temperature. 125394451556162676910326273060666871284159637032. A bonded assembly ( , , , , , , , , , ) with a forward end () and a rearward end () and including at least an inner body ( , , , , ) , an outer body ( , , , , ) and a bond region ();{'b': 30', '60', '66', '68', '71', '26', '25', '39', '44', '51', '55', '61', '62', '67', '69', '103', '52', '31, 'said inner body (, , , , ) including a substantially conical form, said conical form having a forward end and a first apex angle 2.θ towards said forward end () of said bonded assembly (, , , , , , , , , ), a rearward end, a first set of generatrices () and a first cone axis () extending in an axial direction, said conical form in a first material having a mean coefficient of thermal expansion α1 and a first solidus temperature;'}{'b': 28', '41', '59', '63', '70', '29', '29', '26', '25', '39', '44', '51', '55', '61', '62', '67', '69', '103', '53', '31', '29, 'said outer body (, , , , ) ...

PROCESS FOR PRODUCING A HIGH-TEMPERATURE-RESISTANT COMPOSITE BODY

A high-temperature-resistant composite body is formed by joining over an area of a first, nonmetallic section via a bonding solder layer to a second, metallic section composed of Mo, an Mo-based alloy, W or a W-based alloy. A first arrangement composed of the first section, a first Zr solder and an intermediate layer is firstly soldered together in a first soldering step. A second arrangement of the resulting partial composite body, a second solder adjoining the intermediate layer and the second section is subsequently soldered together in a second soldering step. The intermediate layer at least 90 atom % of at least one of the elements Ta, Nb, W. The second solder is formed by precisely one material selected from Ti, Ti-based solder combination, V-based solder combination, Zr or Zr-based solder combination and it melts at a lower temperature than the first Zr solder in the second arrangement. 115-. (canceled)16. A process for producing a high-temperature-resistant composite body , the process comprising:A) producing a first assembly of a first, nonmetallic section, a first Zr solder, and an intermediate layer in sequence, the intermediate layer being formed to at least 90 atom % of one or more of the elements selected from the group consisting of Ta, Nb, and W;B) heating the first assembly in a first soldering step to melt the Zr solder but not the intermediate layer and to obtain a partial composite body;C) producing a second assembly of the partial composite body, a second solder adjoining the intermediate layer of the partial composite body and a second, metallic section in sequence, where the second section is composed of a metal selected from the group consisting of Mo, a Mo-based alloy, W, and a W-based alloy, and where the second solder is formed by precisely one material selected from the group consisting of Ti, a Ti-based solder combination, a V-based solder combination, Zr and a Zr-based solder combination, and the second solder configured to melt at a ...

A METHOD OF BARZING A PLATE HEAT EXCHANGER USING SCREEN PRINTED BRAZING MATERIAL; A PLATE HEAT EXCHANGER MANUFACTURING BY SUCH METHOD

A method for brazing a plate heat exchanger comprising a stack of heat exchanger plates () is provided with a pressed pattern of ridges (R) and grooves (G) adapted to form contact points between the plates () and provide for interplate flow channels for media to exchange heat is provided. The interplate flow channels are in selective fluid communications with port openings () provided near corners of the heat exchanger plates (). The method comprises the following steps: 1. Method for brazing a plate heat exchanger comprising a stack of heat exchanger plates provided with a pressed pattern of ridges and grooves adapted to form contact points between the plates and provide for interplate flow channels for media to exchange heat , said interplate flow channels being in selective fluid communications with port openings provided near corners of the heat exchanger plates , the method including the steps of:i. calculating or measuring the exact position of all contact points between the ridges and grooves of the neighboring plates;ii. applying brazing material close to, but not at, the contact points;iii stacking heat exchanger plates provided with brazing material to a stack;iv. placing the stack of heat exchanger plates in a furnace;v. heating the stack of heat exchanger plates to a temperature sufficient for melting the brazing material; andvi. allowing the stack of heat exchanger plates to cool down such that the brazing material solidifies and binds the plates together, andwhereinstep ii. includes screen printing the brazing material in half moon shaped, donut-shaped or ( )-shaped patterns neighboring the contact point.2. The method according to claim 1 , including the further step of:applying brazing material on skirts surrounding the heat exchanger plates and areas around the port openings that should be joined.3. The method according to claim 1 , wherein the brazing material is applied in at least one minute groove extending around said port opening.4. The method ...

ROTARY X-RAY ANODE AND PRODUCTION METHOD

A rotary X-ray anode has a support body and a focal track formed on the support body. The support body and the focal track are produced as a composite by powder metallurgy. The support body is formed from molybdenum or a molybdenum-based alloy and the focal track is formed from tungsten or a tungsten-based alloy. Here, in the conclusively heat-treated rotary X-ray anode, at least one portion of the focal track is located in a non-recrystallized and/or in a partially recrystallized structure. 1. A rotary X-ray anode , comprising:a powder-metallurgically produced composite formed of a support body and a focal track on said support body;said support body being formed of molybdenum or a molybdenum-based alloy;said focal track being formed of a tungsten-rhenium alloy having a rhenium proportion in a range of 5-10% by weight; andwherein, in a conclusively heat-treated rotary X-ray anode, at least one portion of said focal track is present in a non-recrystallized or a partially recrystallized structure and having a hardness of ≧350 HV 30.2. The rotary X-ray anode according to claim 1 , wherein said at least one portion of said focal track has claim 1 , in a direction perpendicular to a focal track plane claim 1 , a preferential texturing in a <111> direction with a texture coefficient TCof ≧4 determinable by way of X-ray diffraction and a preferential texturing in a <001> direction with a texture coefficient TCof ≧5 determinable by way of X-ray diffraction.3. The rotary X-ray anode according to claim 1 , wherein the following relationship for the texture coefficients TCand TCdeterminable by way of X-ray diffraction is satisfied for the portion of the focal track perpendicular to the focal track plane:{'br': None, 'sub': (222)', '(310), 'TC/TC≧5.'}4. The rotary X-ray anode according to claim 1 , wherein the at least one portion of said focal track is present in a partially recrystallized structure.5. The rotary X-ray anode according to claim 4 , wherein:crystal grains ...

FLUX-LESS DIRECT SOLDERING BY ULTRASONIC SURFACE ACTIVATION

A solder joint and a method of making the same is described. The solder joint includes, a first metal part; a second metal part; and solder material disposed between the first and second metal parts; such that the solder material forms a joint with the first and second metal parts; and the solder material has a plurality of abrasive particles disposed therein. The method includes contacting the solder material with the abrasive particles; placing the solder material and the abrasive particles between the first and second metal parts to form a layered structure; applying a compressive force on the layered structure; applying ultrasonic vibration for a predetermined time to the layered structure to remove the passive oxide layer of the metal part; and applying heat to the layered structure to cause the solder material to melt and flow between the metal parts and form a bond with the metal parts. 1. A solder joint comprising:a first metal part;a second metal part; andsolder material disposed between the first and second metal parts;wherein the solder material forms a joint with the first and second metal parts; andwherein the solder material has a plurality of abrasive particles disposed therein.2. A solder joint according to claim 1 , wherein claim 1 , the first metal part is made from a metal capable of forming a passive oxide layer on the surface.3. A solder joint according to claim 1 , wherein claim 1 , the second metal part is made from a metal capable of forming a passive oxide layer on the surface.4. A solder joint according to claim 1 , wherein claim 1 , the metal is an aluminum alloy.5. A solder joint according to claim 1 , wherein claim 1 , the metal is a titanium alloy.6. A solder joint according to claim 1 , wherein claim 1 , the solder material is selected from a group containing tin-lead-based solder alloys and lead-free tin-based solder alloys.7. A solder joint according to claim 1 , wherein claim 1 , the solder material is brass.8. A solder joint ...