ZUSAMMENSTELLUNGEN UND METHODEN ZUR ANORDNUNG ANISOTROPISCH LEITENDER BAHNEN UND VERBINDUNGEN ZWISCHEN ZWEI SÄTZEN VON LEITERN

ELEKTRISCHE KONTAKTVORRICHTUNG FÜR EINE BRENNSTOFFZELLE

Leitklebeverbindung zwischen zwei Kontaktpartnern und Verfahren zur Herstellung einer Leitklebeverbindung

Die Erfindung betrifft eine Leitklebeverbindung zwischen zwei Kontaktpartnern (1), welche jeweils einen elektrisch nicht leitenden Träger (20) und einen elektrisch leitenden Kontaktbereich (40) aufweisen, wobei auf jedem Kontaktpartner (1) eine vorgegebene Klebeflächengeometrie (10) ausgebildet ist, welche in Verbindung mit einem aufgebrachten Leitkleber (16) eine elektrisch leitfähige Verbindung zwischen den elektrisch leitenden Kontaktbereichen (40) der Kontaktpartner (1) herstellt, sowie ein Verfahren zur Herstellung einer Leitklebeverbindung zwischen zwei Kontaktpartnern (1). Erfindungsgemäß umfasst die Klebeflächengeometrie (10) mindestens eines Kontaktpartners (1) mindestens einen elektrisch nicht leitenden Bereich (12) des Trägers (20) und mindestens einen elektrisch leitenden Bereich (14) des Kontaktbereichs (40).

Elektronische Vorrichtung mit einem elektrisch leitenden Klebstoff.

KATIONISCH POLYMERISIERBARE KLEBSTOFFZUSAMMENSETZUNG UND ELEKTRISCH ANISOTROP LEITENDE KLEBSTOFFZUSAMMENSETZUNG

Elektrischer Verbinder zum Verbinden von elektrischen Einheiten , elektrische Anordnung sowie Verfahren zur Herstellung

LEITFAEHIGE KLEBSTOFFE

Busschiene

Eine Busschiene (10) mit einer gewünschten Schaltkreiskonfiguration ist in einem elektrischen Verbindergehäuse aufgenommen, welches an oder in einem Kraftfahrzeug anordenbar ist; die Busschiene (10) weist eine Metallplatte auf Aluminiumbasis auf, welche in eine gewünschte Schaltkreiskonfiguration gestanzt ist, um einen flachen plattenartigen Schaltkreiskörper (11) zu bilden. Ein L-förmiges Anschlußteil (12) ist aus einer Metallplatte auf Kupferbasis gefertigt. Ein horizontaler Abschnitt des L-förmigen Anschlußteils (12) ist an dem flachen plattenartigen Schaltkreiskörper (11) durch Löten, einen leitfähigen Kleber, durch Nieten oder durch Formschluß verbunden, so daß ein vertikaler Abschnitt des Anschlußteils (12) von dem Schaltkreiskörper vorsteht, um eine Kontaktzunge (12a) zu bilden.

Leitkleberverbindung

Leitkleberverbindungen werden dort bevorzugt angewendet, wo die Kontaktverbindungen großen Temperaturvariationen unterliegen, beispielsweise an einem Drosselklappensteller. Es wird vorgeschlagen, zur Erhöhung der mechanischen Stabilisierung derartiger Leitkleberverbindungen die Oberfläche (2) der Kontakte (1) zu bearbeiten und diese mit Strukturen (4) wie Riffelungen, Prickelung etc. zu strukturieren. Durch diese Strukturierung (4) verhakt der Leitkleber (3) mechanisch an diesen Punkten. Dies führt zu einer hohen Kontaktsicherheit auch bei extremen Temperaturwechseln.

ANISOTROPIC ELECTRICAL CONNECTION

Flexible repair circuit

A self-adhesive flexible circuit for printed circuit assembly repair comprises a carrier film top layer 100, which may be made of Kapton (RTM), at least one circuit trace 110 attached to the carrier film and an adhesive 120 applied to the said circuit trace. The flexible circuit is placed in a desired location and adhered to the circuit board 130 using its own adhesive. The flexible circuit can then be electrically attached 140, i.e. soldered or conductively adhered, to the board. The flexible circuit allows simple repair of boards not designed or manufactured correctly and which contain undesirable short or open circuits or misrouted traces.

Heat-sealable connector and method for the preparation thereof

Improvements relating to electrical terminal connections to electrically conducting surfaces

... 288,174. Metropolitan-Vickers Electrical Co., Ltd., (Assignees of Slepian, J.). April 2, 1927, [Convention date]. Couplings.-An effective electrical connection to a surface of poor conducting material such as the oxide coating in copper oxide rectifiers is obtained bv cementing to the surface by means of a solidified insulating material such as paraffin wax or a phenol condensation product a layer of finely divided conducting material such as flocculent graphite. The graphite may be applied by rubbing into a layer of solidified paraffin wax previously applied to the surface in a liquid state. Alternatively, the graphite may be sprinkled on to the surface after smearing the latter with a condensation product. A metal plate, e.g. of lead, is then pressed on to the graphite-coated surface, and the condensation product is solidified by heating.

COMMUTATOR

Electric ballistic connection through a field joint

A perforating system having annular connectors for attachment between adjacent perforating guns and connectors. The connectors include male and female connectors with respective outer and inner contact surfaces. The connectors also include attachment for electrical detonators and/or booster charges for transferring ballistic detonations between the perforating gun and connector sub.

IMPROVEMENTS IN ADAPTORS

ELECTRICAL CONNECTORS

ANISOTROPIC CONDUCTIVE FILM AND PROCEDURE FOR ITS PRODUCTION

BY A METAL ATTACHMENT OF CONNECTIONS GLASS ARTICLES AND THIS USING CONNECTING CONSTRUCTION

PRESSURE-SENSITIVE ADHESIVE COMPOSITION FROM POLY (N-VINYL LACTAM), PROCEDURES FOR YOUR PRODUCTION AND USE

MADE SMALLER DEVICE FOR THE CONNECTION OF ELECTRICALLY LEADING ELEMENTS FOR VERY HIGH AMPERAGES.

PROCEDURE FOR THE PRODUCTION OF A MONO LAYER PRODUCTS MANUFACTURED BY PARTICLES AND THEREBY

USE OF MICRO CARBON FIBERS

HOCHPOLIGER PROTECTED CONNECTOR

ANISOTROPIC CONDUCTIVE FILM AND PROCEDURE FOR ITS PRODUCTION

ANISOTROPIC CONDUCTIVE FILM AND PROCEDURE FOR ITS PRODUCTION

ANISOTROPIC CONDUCTIVE FILM AND PROCEDURE FOR ITS PRODUCTION

ANISOTROPIC CONDUCTIVE FILM AND PROCEDURE FOR ITS PRODUCTION

ANISOTROPIC CONDUCTIVE FILM AND PROCEDURE FOR ITS PRODUCTION

ANISOTROPIC CONDUCTIVE FILM AND PROCEDURE FOR ITS PRODUCTION

ANISOTROPIC CONDUCTIVE FILM AND PROCEDURE FOR ITS PRODUCTION

Conductive epoxy flip-chip

A thin multichip module

DISPOSITIF MINIATURISE DE CONNEXION D'ELEMENTS CONDUCTEURS DE L'ELECTRICITE SOUMIS A DE TRES FORTES INTENSITES

Un dispositif de connexion de deux fils conducteurs de l'électricité, utilisable plus particulièrement dans un dispositif parafoudre ou parasurtension, comporte un liant à bas point de fusion, solide à la température ambiante, entourant les parties extrêmes voisines des deux fils et assurant leur tenue mécanique. Pour permettre sa miniaturisation et sa résistance à de très fortes intensités du courant électriques un enrobage en matériau rigide entourant totalement le liant solide et confinant ce liant à sa place lors de sa fusion provoquée par une forte intensité, en maintenant ainsi la connexion entre les fils conducteurs.

CONDUCTIVE RESIN STRUCTURE FOR CONNECTING METAL CONDUCTORS

A structure for connecting metal conductors in an oil-leak detector having the connectors covered with porous polytetrafluoroethylene (PTFE) and the metal conductors connected by a band of carbon-filled porous PTFE.

MULTIPLE-CONNECTOR ADHESIVE TAPE

Procédé de fabrication de connexions électriques permanentes

Method for mechanically and electrically connecting two members each bearing a bundle of electrical conductors, and adhesive for implementing the method

This method enables two thin supports (1 and 2) bearing conducting strips (4a and 5a) to be joined so as to attach these two supports to each other and at the same time to connect each strip (4a) electrically to a strip (5a). For this purpose, an adhesive is used which includes an insulating adhesive mass (7) in which conducting particles (8) are dispersed. The adhesive is deposited in the form of a layer on the part (1), which is a printed circuit for example, after which the part (2) is put in place and pressed onto the part (1) in a press. Particles (8) simultaneously come into contact with two opposing strips and provide the connections. This adhesive establishes a secure electrically-conducting connection between the two strips of each pair, whilst providing an electrical insulation between pairs of strips thus connected. This method is especially applicable for connecting integrated circuits to a printed board. ...

Method for bonding a tape-like conductor with a solar cell.

Die Erfindung betrifft ein Verfahren zur Verklebung eines bandförmigen Leiters mit einer Solarzelle, umfassend die Schritte: Auftragen eines Klebstoffs (3, 4) auf den Leiter (1) und/oder auf die Solarzelle (2); und Zusammenführen des Leiters (1) und der Solarzelle (2), so dass der Klebstoff den Leiter und die Solarzelle (2) miteinander verklebt. Um das Verfahren durch einen gezielten Klebstoffeinsatz effizienter zu gestalten, ist erfindungsgemäss vorgesehen, dass der Klebstoff in diskontinuierlicher Form aufgetragen wird. Ferner wird eine Anordnung offenbart, umfassend einen bandförmigen Leiter und eine Solarzelle, die über einen Klebstoff verklebt sind, wobei der Leiter die Solarzelle in räumlich beabstandeten Abschnitten elektrisch kontaktiert. Ausserdem offenbart die Erfindung die Verwendung eines oder mehrerer Piezo-Jet-Dispenser zur Auftragung eines Leitklebstoffs in diskontinuierlicher Form und gegebenenfalls eines Strukturklebstoffs auf einen bandförmigen Leiter und/oder auf eine ...

Device for connecting flat electrical elements of variable size.

Foil for electrical connections linked to substrates

Sheet material esp. suitable for bonding electrical connections to a substrate has an adhesive layer (I), which tackifies and then cures when heated and is solid and does not flow at room temp., and a monolayer of individual, separate electroconductive particles (II), dispersed in (I). Some areas of (I) have a greater vol. than others, so that the adhesive materis is forced into the depressions when the sheet is heated and pressure against a substrate abd (II) are brought into close electrical contact with the substrate. The average thickness of (I) is greater than that of (II) in some areas andless than that of (II) in other areas. The material also has a flexible backing, pref. of polyester film with a thickness of max. 50 microns, opt. with an electroconductive coating, pref. in numerous narrow, parallel strips. (I) is depressed in the spaces between the strips.

Sheet for bonded electrical connection based on thermosetting adhesive - tackifying on heating contg. monolayer of separate protruding conductive particles

Sheet material esp. suitable for bonding electrical connections to a substrate has an adhesive layer (1), which tackifies and then cures when heated and is solid and does not flow at room temp., and a monolayer of individual, separate electroconductive particles (II), dispersed in (I). The novelty is that the average thickness of (II) is greater than that of (I) and the upper edge of partically all (II) is higher than (pt. of) the outer surface of (I) around (II). Pref. the average thickness of (I) is ca.60-90% of that of (II). The average distance between individual (II) is at least equal their average dia. The material also has a flexible backing, opt. with an electroconductive coating, perf. in numerous parallel strips. (I) has a tack value of min. 75gf at 40 deg.C or over. It contains acrylic polymer(s) in which (a) min. 50mole-% consists of acrylate ester monomers, (b) the polymers have Tg=-10 to 80 deg.C, (c) (I) has a tack value of min. 75gf at 20 deg.C and under 75gf at min. 50 ...

Sheet for bonded electrical connection based on adhesive - contg. monolayer of separate conductive particles and tackifying insulating film

Sheet material esp. suitable for bonding electrical connections to a substrate has an adhesive layer (I) and a monolayer of individual , separate electroconductive particles (II), dispersed in (I), which is at thick as or thicker than (I), and a thin layer of insulating material (II) over the (II) monolayer, which is (almost) tack-free at room temp., has a resistance of min, 1 Mohm in the direction to (II), becomes soft and fluid on heating and sets to a solid on cooling to room temp. The sheet is easy to handle and does not form an electrical connection at room temp. but, when pressed against a substrate and heated, forms an electrical coneections in which (II) protrude through (III) to the substrate. Pref. the material also has electroconductive layer(s) under the (II) monolayer, pref. on an insulating substrate. It pref. has numerous conductive strips on an insulating sheet, which pref. are narrow, parallel, elongated strips. (I) is electroconductive and this and/or (II) extends only ...

Circuit connecting material, circuit connecting structure and circuit element connecting method

The invention provides a circuit connecting material, a circuit connecting structure and a circuit element connecting method, wherein the circuit connecting structure can utilize the circuit connecting material. The circuit connecting material comprises an electric conduction rubber layer and a plurality of insulating protruding blocks which are arranged at intervals and are at least arranged on one surface of the electric conduction rubber layer. When the circuit connecting material is applied to the circuit connecting structure, the insulating protruding blocks and gaps among a plurality of electric connecting terminals of one circuit element of the circuit connecting structure are correspondingly arranged. Therefore, the short circuit phenomenon of an electric connection end of the circuit connecting structure utilizing the circuit connecting material and the circuit element connecting method cannot happen easily.

Optical module, manufacturing method therefor, protective component for a light guide, and protective component having electric wiring

An elastic shielding ring for signal transmission

Conductive adhesive bond assembly and system for the same

An arrangement consisting of a piezoactuator (1) and a printed circuit board (3) that are connected by at least one adhesive connection (5), with at least one electrical connection created by an electrically conductive adhesive between a first connection contact (13) on the printed circuit board and between a second connection contact (15) on the piezoactuator, whereby the connection contacts face in the same direction and the adhesive connection (5) takes place through an opening in one of the components.

接触元件

... 一种用于电气部件(1)的接触元件用导电材料制造。而且材料象橡胶一样有弹性并可变形。结果，在相互连接的接触元件(4)和电子部件(1)之间获得接触力。电接点包括第一和第二金属部分，所述第一和第二部件导电式相互连接。而且，接点包括一个弹性的接触元件。接触元件用导电的硅材料生产。 ...

Method for connecting chip to antenna of radio frequency identification device of chip card

A method of making a display cell resumes contact counter electrode.

METHOD FOR CONNECTING THE SHIELD AT LEAST A SHIELDED ELECTRIC CABLE CONNECTING AN ELECTRIC CONDUCTOR, AND CONNECTING [...] OBTAINED BY THIS METHOD.

Procédé pour réaliser un affichage à cristaux liquides combiné.

La présente invention concerne un procédé pour réaliser un affichage à cristaux liquides combiné, qui comporte les étapes consistant à: -lier à l'aide d'un adhésif (26) en une matière de la série des hauts polymères les surfaces d'extrémité des côtés mutuellement en regard de plusieurs substrats (21), émettre des faisceaux laser (27) sur une partie de l'adhésif qui déborde de la surface des substrats à la suite de leur contact par pression, afin d'éroder cette partie de telle façon que la différence de niveaux par rapport à la surface des substrats (21) soit inférieure à 5 mu m, et disposer un second substrat (23) en regard et au-dessus de l'ensemble constitué par les premiers substrats (21) liés l'un à l'autre, en ménageant un intervalle (22) entre eux et à enfermer hermétiquement un cristal liquide dans cet intervalle.

Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them

Dans le procédé, on place des corps conducteurs entre les contacts de raccordement du module et du composant et l'on presse ensemble l'un contre l'autre, le module, le corps conducteur et le composant. Les corps conducteurs (16, 17) destinés à être placés entre le module (25) et le composant électrique (26), pour raccorder leurs contacts correspondants (20, 21), sont disposés dans une structure de fixation (10) compressible. Application à la fabrication fiable et économique de cartes à puce.

CONNECTOR FOR CIRCUIT PRINTS

Membrane keyboard which the flexible membrane control at least one passive component

Un clavier comprend au moins une membrane souple de commande sur laquelle sont disposés au moins un composant passif et au moins une piste conductive. Les composants passifs (1) sont des composants sous boîtier pourvus de fils de connexion (2, 3). Chaque fil (2, 3) est passé à travers au moins une ouverture (6, 7, 8, 9) de la membrane (4) et un tronçon de chaque fil de connexion (2, 3) est appliqué à fleur, par pression, sur au moins une piste conductive (5) et relié électriquement à celle-ci. Applicable à divers appareils électriques et électroniques.

DEVICE OF ELECTRICAL CONTACT ELASTIC OR DEPASSIVANT WITHOUT RISE IN TEMPERATURE.

La présente invention est destinée à l'amélioration et à la définition de nouvelles méthodes de connexions électriques entre divers éléments (par exemple entre un boîtier comprenant une puce à semi-conducteur et un circuit imprimé), ou à l'amélioration de la prise de contact électrique (par exemple, accès électrique à l'aide d'une pointe (8) sur un plot de contact (4) appartenant à un circuit imprimé (2) en vue de son test) en compatibilité avec les méthodes industrielles actuelles de fabrication.Le dispositif utilise des matériaux polymères conducteurs (1) (là conductivité métallique) ayant entre autres comme caractéristiques une élasticité sensible ainsi que des propriétés dépassivantes, à température ambiante, et sur la gamme industrielle de température, facilitant l'établissement du contact électrique. Un moyen de compression est utilisé pour maintenir au contact les deux sous-ensembles à interconnecter; ...

Wall bushing (feed-through) for electrical cables

CONDUCTOR CONNECTION MEMBER, CONNECTION STRUCTURE, AND SOLAR CELL MODULE

Electrical connection tape

Anisotropic Conductive Adhesives Having Core-Shell Structure for UltraSonic Bonding and Electrical Interconnection Method of Electronic Component Using Thereof

도전성 입자, 도전성 재료 및 도전성 입자의 제조방법

... [과제] 도전성이 높은 도전성 입자를 제공하는 것. [해결 수단] 코어 재료 입자의 표면에 도전성 피막이 형성되어 이루어지는 도전성 입자이다. 도전성 피막이 코어 재료 입자의 표면에 접하는 바닥 피막과 상층 피막을 가진다. 바닥 피막은, 니켈 및 인을 포함한다. 상층 피막은, 결정 구조를 가지고, 니켈, 인 및 1 종류 이상의 금속 M을 포함한다. 상층 피막은, 평탄부와, 상기 평탄부로부터 돌출하고 또한 평탄부로부터의 연속체가 되어 있는 복수의 돌기부를 가지며, 상기 평탄부와 상기 돌기부가 동일한 재료로 구성되어 있다.

ADHERING STRUCTURE, LIQUID CRYSTAL DEVICE, AND ELECTRONIC APPARATUS

UNDETACHABLE ELECTRICAL AND MECHANICAL CONNECTION, CONTACT ELEMENT FOR AN UNDETACHABLE ELECTRICAL AND MECHANICAL CONNECTION AND METHOD FOR PRODUCING SUCH AN ELECTRICAL AND MECHANICAL CONNECTION

The invention relates to an undetachable electrical and mechanical connection (4) between a contact element (7) having contacts (31) and a counter-contact element (8) having counter- contacts (27) with a flexible section (39) of the contact element (7) in at least a part of the contacts (31). The invention is further characterized in that the contact element (7) has at least one first and second layer (21, 22) that define an intermediate space (23) between them in the zone of the flexible section (39) in which intermediate space the counter-contact element (8) is disposed. The first and the second layer (21, 22) is provided with one contact (31) each on the layer inner sides (40) facing one another. The counter-contact element (8) has at least one counter-contact (27) on each of its upper and lower side (25, 26). © KIPO & WIPO 2007 ...

ANISOTROPIC CONDUCTIVE FILM

이방 도전성 필름 및 접속 구조체

... 이방 도전성 필름 (1A, 1B) 이, 절연 접착제층 (10) 과 그 절연 접착제층 (10) 에 격자상으로 배치된 도전 입자 (P) 를 포함한다. 임의의 도전 입자 (P0) 와 그 도전 입자 (P0) 에 인접하는 도전 입자의 중심간 거리에 대해, 도전 입자 (P0) 와 가장 짧은 거리를 제 1 중심간 거리 (d1) 로 하고, 그 다음으로 짧은 거리를 제 2 중심간 거리 (d2) 로 한 경우에, 이들 중심간 거리 (d1, d2) 가, 각각 도전 입자의 입자경의 1.5 ∼ 5 배이고, 임의의 도전 입자 (P0) 와, 그 도전 입자 (P0) 와 제 1 중심간 거리에 있는 도전 입자 (P1) 와, 그 도전 입자 (P0) 와 제 1 중심간 거리 (d1) 또는 제 2 중심간 거리 (d2) 에 있는 도전 입자 (P2) 로 형성되는 예각 삼각형에 대해서, 도전 입자 (P0, P1) 를 통과하는 제 1 배열 방향 (L1) 에 대하여 직교하는 직선 (L0) 과, 도전 입자 (P1, P2) 를 통과하는 제 2 배열 방향 (L2) 이 이루는 예각의 각도 (α) 가 18 ∼ 35°이다. 이 이방 도전성 필름 (1A, 1B) 은, COG 접속에 있어서도 안정된 접속 신뢰성을 갖는다.

ELECTRICAL CONTACTS

Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof

A circuit member connection structure (10) includes circuit members (20, 30) having a plurality of circuit electrodes (22, 32) formed on main surfaces (21a, 31a) of circuit substrates (21, 31). A circuit connection member (60) connects the circuit members (30, 30) to each other so that the circuit electrodes (22, 32) oppose. The circuit connection member (60) is made of a hardening material for hardening the circuit connection material. The circuit connection material contains an adhesive component and coated particles (50) made of conductive particles (51) each having a part of the surface (51a) coated by insulating fine particles (52). The insulating fine particle (52) has a mass equal to 2/1000 to 26/1000 of the mass of the conductive particle (51).

Adhesive film for circuit connection, method for producing circuit connected structure, and adhesive film housing set

An adhesive film 11 for circuit connection is provided with: a peelable support film 12, a first adhesive layer 13 containing conductive particles P, the first adhesive layer being disposed on the support film; and a second adhesive layer 14 disposed on the first adhesive layer 13. The thickness of the first adhesive layer is 0.1 to 1.0-times the average particle diameter of the conductive particles.

Conductive fine particles, method for plating fine particles, and substrate structural body

The purpose of the present invention is to provide a conductive fine particles having an ability of relaxing the force exerted on a circuit, and a method for retaining the constant distance between substrates. The present invention relates to conductive fine particles, wherein at least one metallic layer is covered with basic fine particles of resin. The coefficient of linear expansion of the resin is 3x10-5 to 7x10-5 (1/K).

Electric connection material and electric connection method

The present invention provides an electric connection material that can form an electric connection through the electrically conductive particles even though the target objects are somewhat bumpy. The electric connection material 100 electrically connects an electric connection portion of a first target object 4 and an electric connection portion of a second target object 2, and comprises a first film-shaped bonding layer 6, which is the film-shaped bonding layer disposed on the first target object 4 and contains several electric conductive particles 7, a first binder 8 containing the electric conductive particles 7, and a first filler F1; and the second film-shaped bonding layer 9, which is disposed on the first film-shaped bonding layer 6 and comprises a second binder 9A having a viscosity smaller than that of the first binder 8, and a second filler F2.

Wire-Equipped Crimp Terminal and Method of Curing Coating Agent

A wire-equipped crimp terminal includes a wire (4), a crimp terminal (1) and a coating agent. The wire has a conductor (9) exposed from an insulative sheath (8). The crimp terminal has a crimping piece (5) which is press-deformed to embrace the conductor. The coating agent is coated to a first part of the crimp terminal. A recess (13) is formed at a non-coating part of the crimp terminal where the coating agent is not coated. The coating agent is cured by irradiating light or an electron beam to the first part in a state where a part of the coating agent flowing out from the first part is received in the recess.

CIRCUIT BOARD ASSEMBLY

A circuit board assembly is described. The circuit board assembly comprises a circuit board (2) comprising a substrate (4) supporting a plurality of contact lands (9; Fig. 2) and a device (3), such as a bare die or printed circuit board, comprising a plurality of contact pads (12: Fig. 3) which is mounted on the circuit board such that the contact pads are aligned with the contact lands. The circuit board assembly comprises an interconnect layer (15) which has a sheet resistance, RS, of at least 0.5 MΩ/sq, which is disposed between the device and the circuit board and which is arranged to provide electrical connections between the contact lands and corresponding contact pads.

ELECTRICAL CONNECTOR

An electrical connector adapted for placement on a single edge of a thin film device (10) having an electrically responsive layer (24) to deliver electric current from a power supply (54) to at least one electrode in electrical contact with the electrically responsive layer. This connector comprises a flexible insulator (26) having electrically conductive portions (28, 30) on its faces which are preferably provided with electrically conductive adhesive (32, 34). At least a portion of said insulator is adapted for insertion into a portion of the electrically responsive layer (24).

FILM CONNECTOR AND METHOD OF MANUFACTURING SAME

This invention is roughly divided into two, i.e., a film in which a pattern is formed by providing one main surface of a flexible insulating film (1) with a first metallic film (2) which consists of one kind of metal chosen among copper, silver, nickel and aluminum, or an alloy thereof, a second metallic film (3) consisting of one kind of metal chosen among nickel, chromium, tungsten and silver, or an alloy thereof, a third isotropic conductive film (4) consisting of carbon powder and synthetic resin, and a fourth anisotropic conductive film (7a) consisting of carbon powder and synthetic resin; and an anisotropic conductive bonding agent. Owing to the functions of these products, a film connector capable of reliably carrying out the electrical connection of even the high-density terminal leads, and having an improved reliability can be obtained.

CONNECTING STRUCTURE, LIQUID CRYSTAL DEVICE, ELECTRONIC EQUIPMENT, ANISOTROPIC CONDUCTIVE ADHESIVE, AND METHOD FOR MANUFACTURING THE ADHESIVE

An anisotropic conductive adhesive which can improve the secured and reliable continuity between terminals to be connected to each other by surely interposing a prescribed number of conductive particles. In the adhesive (1), a plurality of conductive particles (3) contained in an insulating adhesive material (2) of the adhesive (1) is unevenly distributed to one adhesive surface side of the material (2) having two adhesive surfaces. When the adhesive surface of the material (3) to which the conductive particles (3) are distributed is directed to one of the two terminals which is less protruded toward the adhesive (1) at the time of arranging the adhesive (1) between the two terminals, the conductive particles (3) are not pushed out even when the adhesive (1) is pushed out in the lateral direction by the other terminal which is largely protruded toward the adhesive (1) at the time of thermocompression bonding, because the particles (3) are not distributed to the other terminal side. Therefore ...

DOUBLE ADHERENT ELECTRICALLY CONDUCTIVE TAPE

Double adherent, electrically conductive tape comprising an elastic and flexible tape (1) being adherent on both sides, and an electrically conductive material applied along at least one edge of the tape. The electrically conductive material is in the shape of at least one continuous strip (2) folded in the longitudinal direction of the tape about an edge of the tape.

CONNECTOR MODULE ORGANIZER

An electrical connector module pack (100) comprises multiple connector modules (111-117) each having exterior surfaces (131-137, 141-147, 161-167), side walls (151-156), and a mating face (121-127). Each of the mating faces is configured to receive one of power contacts, signal contacts, and a guide. The connector modules are organized in a predetermined order with respect to one another such that the side walls of adjacent connector modules are located adjacent to each other. An adhesive medium (300) is secured to at least one exterior surface of each said connector module to hold the connector modules in said predetermined order.

GLASS PRODUCT, METHOD OF APPLYING CONNECTOR TO GLAZING, AND CONNECTOR

A glass product includes a glazing having a connectable material with a connecting surface on the glazing, a connector including a housing, and a connector plate within the housing, and a conductive material within the housing; at least part of the conductive material being positioned between the connector plate and the connecting surface.

Conductive particle lead termination for an electro-optic display

An electrode termination assembly for use on a display device wherein the amount of space required for the pin connector to attach to the display device is greatly reduced, the physical and electrical integrity of the assembly is greatly enhanced and the cost of the assembly is reduced as compared to present assemblies for pin connectors. An adhesive material having conductive particles is used to not only physically support and attach the connector pins to the display, but also electrically connect the connector pins to electrode pads on the display.

Thin film circuits with high density connector

A method of fabricating a high density thin film circuit includes the step of bonding a high density connector having a plurality of electrical connection lines with a wafer having a plurality of electrical contact pads arranged in a pattern with a pitch less than about 100 μm so that an electrical coupling is formed between respective ones of the wafer contact pads and corresponding ones of connector electrical connection lines. The step of forming the electrical coupling comprises pyrolysis of an adhesive disposed between the high density connector and said wafer. The electrical coupling between respective ones of the contact pads and corresponding electrical connection lines is formed by directing a laser beam on the area in which the electrical coupling is to be formed so as to cause thermal decomposition of the adhesive to form a conductive carbon material; portions of the wafer contact pad and the connector electrical connection line are also welded to the conductive carbon material ...

Return pad cable connector

A return pad cable connector, in accordance with the present disclosure, for use with a disposable return pad, includes a cord having a conductive wire disposed therethrough which conductive wire interconnects the return pad cable connector to an electrosurgical energy source. The return pad further includes a connector operatively coupled to the cord, the connector having a conductive surface which is selectively engageable with a corresponding conductive surface disposed on the return pad, the conductive surface of the connector including a conductive adhesive disposed thereon and a non-conductive adhesive disposed above the periphery of the conductive surface of the connector for engagement with a corresponding non-conductive adhesive disposed above the periphery of the conductive surface of the return pad. The connector can include a magnet for magnetically coupling the connector to the conductive surface disposed on the return pad.

Anisotropically electroconductive connecting material

An anisotropically electroconductive connecting material, which is disposed between a connection terminal on a first substrate and a connection terminal on a second substrate and joins the substrates together by thermocompression bonding while maintaining electroconductive connection therebetween, includes electroconductive particles dispersed in an insulating adhesive, wherein the modulus of elasticity of the electroconductive particles at the compression bonding temperature is 200% or less of the modulus of elasticity of the first substrate at the compression bonding temperature.

Thermally and electrically conductive adhesive material and method of bonding with same

The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas the filler provides continuous thermal and electrical metal bridges, each bridge extending through the adhesive and contacting the bonded surfaces. The method includes (a) dispersing a filler containing a liquid metal into an unhardened adhesive, (b) contacting the unhardened adhesive and the filler in non-solidified state to the surfaces resulting in separate spaced regions of the non-solidified filler contacting both surfaces, and (c) hardening the adhesive.

Assembly using electrically conductive cement

An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width ...

Packaging and interconnection of contact structure

A packaging and interconnection for connecting a contact structure to an outer peripheral component. The packaging and interconnection includes a contact structure made of conductive material and formed on a contact substrate, a contact trace formed on the contact substrate and connected to the contact structure, a contact pad formed on a bottom surface of the contact substrate and connected to the contact structure through a via hole and the contact trace, a contact target provided at an outer periphery of the contact structure to be electrically connected with the contact pad, and a conductive member for connecting the contact pad and the contact target.

Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof

A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min.

SHEET SENSOR

Provided is a sheet sensor comprising an anisotropically-conductive sheet exhibiting conductivity in a thickness direction and having a first surface as a contact surface for a sensing target object, and multiple conductive members electrically connected to a second surface of the anisotropically-conductive sheet and electrically insulated from each other. 1. A sheet sensor comprising:an anisotropically-conductive sheet exhibiting conductivity in a thickness direction and having a first surface as a contact surface for a sensing target object; andmultiple conductive members electrically connected to a second surface of the anisotropically-conductive sheet and electrically insulated from each other.2. The sheet sensor according to claim 1 , whereinthe conductive members are each formed linearly, and are arranged in parallel, anda direction of extending the conductive members is set to a direction perpendicular to a parallel direction of the conductive members.3. The sheet sensor according to claim 1 , whereinthe conductive members are each formed linearly, and are arranged in parallel from one end side to the other end side in a width direction of the anisotropically-conductive sheet.4. The sheet sensor according to claim 3 , whereinthe first surface of the anisotropically-conductive sheet exhibits a hydrophilic property.5. The sheet sensor according to claim 3 , further comprising:a layer formed from non-woven fabric on the first surface of the anisotropically-conductive sheet.6. The sheet sensor according to claim 3 , further comprising:a slit extending, at the first surface of the anisotropically-conductive sheet, in a direction crossing the direction of extending the conductive members.7. The sheet sensor according to claim 1 , whereinthe anisotropically-conductive sheet is formed in a recessed shape to have a top portion between the conductive members.8. The sheet sensor according to claim 1 , further comprising:an insulating sheet connected to the second ...

Anisotropically electroconductive film

An anisotropically electroconductive film, which has a high reliability in its capacity for conducting electricity and also a good adhesion under such an adhesive condition that the film is heated at a temperature of 130° C. or less for a short period of time, has a layer of an adhesive within which electroconductive particles are distributed. The adhesive is composed of a thermosetting resin composition including a base resin, a reactive compound, an organic peroxide and a reaction accelerating compound, and also the electroconductive particles incorporated into the thermosetting resin composition. The base resin is a polyacetalized resin which is obtained by acetalizing a polyvinyl alcohol. The reactive compound is at least one selected from a group consisting of acryloxy group-bearing compounds, methacryloxy group-bearing compounds and epoxy group-bearing compounds. The reaction accelerating compound is a compound which has a radically reactive group and alkali-reactive group as its ...

High wattage solderless flexible connector for printed conductors

An adhesive connector for making an electrical connection to a conductor formed on a support surface is provided. The adhesive connector includes a substrate and a metal strip attached to a first surface of the substrate, wherein the metal strip is configured to engage a releasable electrical connector. The adhesive connector also includes a conductive strip attached to a second surface of the substrate and a conductive staple configured to secure the conductive strip, the substrate, and the metal strip together. The adhesive connector further includes an electrically-conducting adhesive that coats a first portion of the conductive strip, and is configured to provide electrical contact to a conductor formed on a support surface.

Spacer-containing tape

A conductive tape comprising a conductive particle-containing layer containing at least a binder resin layer and a plurality of conductive particles, In this conductive tape, the plurality of conductive particles are distributedly disposed independently from each other on one surface of the binder resin layer, a surface of the binder resin layer in a vicinity of each of the conductive particles has an inclination or an undulation with respect to a tangent plane of the binder resin layer in a center portion between adjacent conductive particles, in the inclination, the surface of the binder resin layer around the conductive particle is lacked with respect to the tangent plane, and in the undulation, a resin amount of the binder resin layer right above the conductive particle is smaller than that when the surface of the binder resin layer right above the conductive particle is flush with the tangent plane.

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME

Return pad cable connector

A return pad cable connector, in accordance with the present disclosure, for use with a disposable return pad, includes a cord having a conductive wire disposed therethrough which conductive wire interconnects the return pad cable connector to an electrosurgical energy source. The return pad further includes a connector operatively coupled to the cord, the connector having a conductive surface which is selectively engageable with a corresponding conductive surface disposed on the return pad, the conductive surface of the connector including a conductive adhesive disposed thereon and a non-conductive adhesive disposed above the periphery of the conductive surface of the connector for engagement with a corresponding non-conductive adhesive disposed above the periphery of the conductive surface of the return pad. The connector can include a magnet for magnetically coupling the connector to the conductive surface disposed on the return pad.

Joint forming sheet or tape and method for joint formation using the same

Electric connecting device using resin solder and method of connecting electric wire to them

The objectives of the present invention include to connect an electric wire to the electric connecting device without soldering work and to connect a very fine wire to the electric connecting device by means of an automatic machine. The electric connecting device (100) according to the present invention comprises a first connecting part (110) which couples with a counterpart member or fits with a counterpart member, and a second connecting part (120) to which the conductor (210) of an electric wire (200) is connected. In this electric connecting device (100), at least a part of the second connecting part (120) to which the conductor (210) of the electric wire (200) is connected is made of a lead-free ultrahigh-conductive plastic being a conductive resin composite.

Electrical connector

The present invention provides a connector for interconnecting electroconductive elements within a laminate. The connector includes a flat electroconductive member having a first portion with at least one connecting segment which overlays an electroconductive element within the laminate, and a second portion extending from the first portion. One end of the second portion of the connector includes a rigid, integral connection terminal which includes multiple plies of the member. Selected portions of the first portion, and preferably at least the connecting segment, are coated with an adhesive. The adhesive may be electrically conductive or non-electrically conductive. In one particular embodiment of the invention the maximum thickness of the first portion of the connector is about 0.10 mm and the maximum width of the first portion, other than the connection segment, is about 6.4 mm. An electrically insulating cover may be positioned over a section of the second portion and a sealing means ...

Particle material, anisotropic conductive connection and anisotropic conductive connection material

A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage (110), a load and transfer device (140) and a control device (180) are comprised, whereby a wafer (202) after having bumps formed thereon which is held by the load and transfer device is disposed to above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of a thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.

Anisotropic conductive film and method of fabricating the same

A method of fabricating anisotropic conductive film comprises the steps of: mixing conductive particles, a resin material and a solvent to form slurry; and providing a separate means for progressively distributing the conductive particles on one side of the resin material when forming the anisotropic conductive film from slurry. The method disclosed in the present invention is easy to use, and the anisotropic conductive film fabricated by the method has high conductive particles capturing rate.

Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device

By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Conductive particle, and anisotropic conductive film, bonded structure, and bonding method

To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.

Coated conductive particles and method for producing same

[Problem to be Solved] To provide conductive particles which are capable of providing an anisotropically conductive adhesive that can maintain sufficient insulation characteristics and conduction characteristics even when used for the connection of a very small circuit, while having excellent moisture absorption resistance at a lower cost. [Solution] A coated conductive particle ( 5 ) comprises: a composite conductive particle ( 3 ) that has a resin particle ( 4 ) and a metal layer ( 6 ) that covers the resin particle ( 4 ); and insulating fine particles ( 1 ) that are provided on the outer side of the metal layer ( 6 ) so as to partially cover the surface of the metal layer ( 6 ). The metal layer ( 6 ) has a nickel-palladium alloy plating layer ( 6 a ).

Fiber, fiber aggregate and adhesive having the same

Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

Fiber, fiber aggregate and adhesive having the same

Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

Display panel

Embodiments may be directed to a display panel includes a base substrate including a display region having a plurality of pixels and a non-display region adjacent to the display region, a connecting line in the non-display region and including at least a first input pad, a second input pad, and an output pad, and an insulating layer on the connecting line. The insulating layer includes at least one first contact hole exposing at least a portion of the first input pad, at least one second contact hole exposing at least a portion of the second input pad, and at least one third contact hole between the first contact hole and the second contact hole. A first contact electrode, a second contact electrode, and a dummy contact electrode are disposed at the first, second and third contact holes, respectively.

Contacting assembly for conductors present on flat structures, in particular glass panels

The present invention relates to a contacting assembly for conductors that are present on flat structures, in particular glass panels, and have a contact point in the connection section. According to the invention, an end of a connecting cable or of another connecting means, for example, a connecting plug, is connected electrically and mechanically to a pad made of a conductive nonwoven fabric. The connecting cable thus assembled is introduced into a casting block which is open on one side and which has a frame that is provided with adhesive and encloses the nonwoven fabric. The surface of the conductive nonwoven fabric which is delimited laterally by the frame is matched to the area of the contact point, in order to produce, via an adhesive bond between the frame and the flat structure, a contacting connection created by surface pressing between the contact point and the nonwoven fabric surface, wherein the frame together with the casting body seals the contact point with respect to the surrounding area.

Connection method and connection structure of electronic component

A connection method and a connection structure of electronic components by which high connection reliability can be obtained. An anisotropic conductive film is temporarily disposed, and thermally compressed and bonded, in such manner that a boundary of a circuit protection area and a terminal area of a second electronic component is positioned on a single layer area of the anisotropic conductive film; and the terminal area of the second electronic component is positioned on a double-layer area of the anisotropic conductive film.

Z-axis conductive article and method of making the same

A Z-axis conductive article includes an adhesive layer having a first major surface and a second major surface opposite the first major surface. The adhesive layer includes a dielectric pressure-sensitive adhesive and conductive magnetic particles aligned in mutually isolated conductive pathways extending from the first major surface to the second major surface of the adhesive layer. A method of making the same is also disclosed.

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, CIRCUIT CONNECTION STRUCTURE, METHOD FOR CONNECTING CIRCUIT MEMBERS, USE OF ADHESIVE COMPOSITION, USE OF FILM-LIKE ADHESIVE AND USE OF ADHESIVE SHEET

An adhesive composition for bonding a first circuit member including a first circuit electrode formed on a first circuit substrate and a second circuit member including a second circuit electrode formed on a second circuit substrate, the first circuit electrode and the second circuit electrode being electrically connected, wherein at least one substrate among the first circuit substrate and the second circuit substrate includes a thermoplastic resin having a glass transition temperature of not more than 200° C. The adhesive composition contains core-shell type silicon particles having a core layer and a shell layer provided for coating the core layer. 1. An adhesive composition for bonding a first circuit member including a first circuit electrode formed on a first circuit substrate and a second circuit member including a second circuit electrode formed on a second circuit substrate , the first circuit electrode and the second circuit electrode being electrically connected , whereinat least one substrate among the first circuit substrate and the second circuit substrate includes a thermoplastic resin having a glass transition temperature of not more than 200° C., andthe adhesive composition contains core-shell type silicon particles having a core layer and a shell layer provided for coating the core layer.2. An adhesive composition for bonding a first circuit member including a first circuit electrode formed on a first circuit substrate and a second circuit member including a second circuit electrode formed on a second circuit substrate , the first circuit electrode and the second circuit electrode being electrically connected , whereinat least one substrate among the first circuit substrate and the second circuit substrate includes at least one selected from the group consisting of polyethylene terephthalate, polycarbonate, polyethylene naphthalate and a cycloolefin polymer, andthe adhesive composition containing core-shell type silicon particles having a core ...

ANISOTROPIC CONDUCTIVE MATERIAL AND PROCESS FOR PRODUCTION THEREOF, AND MOUNTING BODY AND PROCESS FOR PRODUCTION THEREOF

A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min. 1. An anisotropic conductive material , comprising an adhesive composite and conductive particles dispersed in the adhesive composite , the adhesive composite containing a film forming resin , an ethylene vinyl acetate copolymer , a radical polymerizable resin , and a radical polymerization initiator ,wherein a melt flow rate of the ethylene vinyl acetate copolymer is not less than 400 g/10 min.2. The anisotropic conductive material according to claim 1 , wherein a content of vinyl acetate in the ethylene vinyl acetate copolymer is not less than 25 wt %.3. The anisotropic conductive material according to claim 1 , wherein the film forming resin is at least one selected from the group consisting of a polyester urethane resin claim 1 , a polyester resin claim 1 , a polyurethane resin claim 1 , a phenoxy resin claim 1 , an acrylate resin claim 1 , a polyimide resin claim 1 , and a butyral resin.4. The anisotropic conductive material according to claim 1 , wherein the radical polymerizable resin is at least one selected from the group consisting of epoxy acrylate claim 1 , urethane acrylate claim 1 , and polyester acrylate.5. The anisotropic conductive material according to claim 1 , wherein the radical polymerization initiator is at least one selected from the group consisting of peroxyketal claim 1 , diacyl peroxide claim 1 , peroxydicarbonate claim 1 , peroxyester claim 1 , dialkyl peroxide claim 1 , hydroperoxide claim 1 , and silyl peroxide.6. The anisotropic conductive material ...

Display Device

A display device includes a first substrate which constitutes a part of a display panel, the first substrate having a first side and having a terminal formed thereon adjacent to the first side, and a flexible printed circuit board which is connected to the first substrate. The flexible printed circuit board includes a board portion, a wiring layer which is mounted on the board portion, a cover portion which covers the wiring layer, and a connecting portion which is connected to the terminal formed on the first substrate. The connecting portion includes a metal layer, and wherein the cover portion overlaps with the first side and an area between the first side and the terminal.

ANISOTROPIC CONDUCTIVE FILM AND APPARATUS INCLUDING THE SAME

An anisotropic conductive film includes a first insulating adhesive layer, a conductive adhesive layer, and a second insulating adhesive layer which are sequentially stacked on a base film, wherein an adhesive strength ratio of the second insulating adhesive layer to the first insulating adhesive layer is about 1.1 to about 20. 1. An anisotropic conductive film , comprising a first insulating adhesive layer , a conductive adhesive layer , and a second insulating adhesive layer which are sequentially stacked on a base film , wherein an adhesive strength ratio of the second insulating adhesive layer to the first insulating adhesive layer is about 1.1 to about 20.2. The anisotropic conductive film as claimed in claim 1 , wherein the adhesive strength ratio of the second insulating adhesive layer to the first insulating adhesive layer is about 1.3 to about 5.3. The anisotropic conductive film as claimed in claim 1 , wherein:the first insulating adhesive layer has an adhesive strength of about 10 to about 100 gf, andthe second insulating adhesive layer has an adhesive strength of about 50 to about 150 gf.4. The anisotropic conductive film as claimed in claim 1 , wherein:the first insulating adhesive layer has an adhesive strength of about 20 to about 60 gf, andthe second insulating adhesive layer has an adhesive strength of about 50 to about 90 gf.5. The anisotropic conductive film as claimed in claim 1 , wherein a melt viscosity ratio of the second insulating adhesive layer to the first insulating adhesive layer at 40° C. is about 0.01 to about 1.0.6. The anisotropic conductive film as claimed in claim 1 , wherein:{'sup': 5', '5, 'the first insulating adhesive layer has a melt viscosity of about 1.0×10to about 5.0×10Pa·s, and'}{'sup': 4', '5, 'the second insulating adhesive layer has a melt viscosity of about 1.0×10to about 1.5×10Pa·s.'}7. The anisotropic conductive film as claimed in claim 1 , wherein:a thickness ratio of the first insulating adhesive layer to the ...

Assembly, component for an assembly and method of manufacturing an assembly

An assembly is provided of an electro-physical transducer ( 10 ) on a flexible foil ( 20 ) with a carrier ( 40 ). The flexible foil ( 20 ) has a first main surface ( 22 ) provided with at least a first electrically conductive track ( 24 ) connected to the electro-physical transducer and opposite said first main surface a second main surface ( 23 ) facing towards the carrier. At least a first incision ( 25 a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion ( 27 ) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor ( 421 ) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module

The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.

CONTACT MAKING ARRANGEMENT FOR CONDUCTORS PROVIDED ON FLAT STRUCTURES, NAMELY PANES OF GLASS

The invention relates to a contacting arrangement for conductors provided on flat structures, namely glass panes, the conductors having a contact point in their connecting section, wherein one end of a connecting cable or another connection device is electrically and mechanically connected with a pad including a conductive fleece or double-sided conductive adhesive tape, wherein the connecting cable configured in this way is introduced into an encasement block which is open at one side and which includes a frame which surrounds the fleece or the conductive adhesive tape and which is provided with adhesive, wherein the surface of the conductive fleece which is laterally defined by the frame is matched to the area of the contact point in order to provide a contact connection between the contact point and the fleece surface through an adhesive joint between the frame and the flat structure, wherein the frame with the encasement element closes off the contact point in sealing fashion towards the ambient and a portion of the frame is usable as a sealing lip for preventing adhesives from spreading out when the glass pane is fitted. 1. A contacting arrangement for conductors provided on flat structures , namely glass panes , the conductors having a contact point in their connecting section ,wherein one end of a connecting cable or another connection device is electrically and mechanically connected with a pad including a conductive fleece or double-sided conductive adhesive tape,wherein the connecting cable configured in this way is introduced into an encasement block which is open at one side and which includes a frame which surrounds the fleece or the conductive adhesive tape and which is provided with adhesive,wherein the surface of the conductive fleece which is laterally defined by the frame is matched to the area of the contact point in order to provide a contact connection between the contact point and the fleece surface through an adhesive joint between the frame ...

Display apparatus

A display apparatus including a display panel including a pixel electrode and a plurality of first signal lines transmitting a driving signal to the pixel electrode, a conductive member on the first signal lines, the conductive member having a resin, and a second signal line on the conductive member, the second signal line having an opening through which the resin travels to couple the second signal line with one of the first signal lines.

Bonding structure of touch panel and flexible circuit board

A bonding structure of a touch panel and a flexible circuit board includes a touch panel, a flexible circuit board and a conductive adhesive film. The touch panel includes a shielding layer and multiple transmission wires disposed on the shielding layer. The flexible circuit board is under the touch panel and includes a substrate and multiple connection wires on the substrate. Each the connection wire includes a first connection portion and a second connection portion, and the two connection portions are separated from each other by an interval and electrically insulated from each other. The conductive adhesive film is between the transmission wires of the touch panel and the connection wires of the flexible circuit board, in which the first connection portions and the second connection portions of the connection wires are electrically connected to the transmission wires via the conductive adhesive film so as to form an electric loop.

ANISOTROPIC CONDUCTIVE FILM

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter. 1. An anisotropic conductive film comprising an insulating adhesive layer and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view , wherein the conductive particle has a conductive particle diameter of 10 μm or more , the film has a thickness of 1 or more times and 3.5 or less times the conductive particle diameter , and positions of the conductive particles are varied in a thickness direction of the film within a variation range of less than 10% of the conductive particle diameter.2. The anisotropic conductive film according to claim 1 , wherein the thickness of the anisotropic conductive film is 1 or more times and 2.5 or less times the conductive particle diameter.3. The anisotropic conductive film according to claim 1 , wherein a distance between one surface of the anisotropic conductive film and each conductive particle is 10% or more of the conductive particle diameter.4. The anisotropic conductive film according to claim 1 , wherein a difference between maximum and minimum values of particle densities claim 1 , as viewed in a plan view claim 1 , measured at ten regions which each have an area of 1 mm×1 mm and are extracted in a longitudinal direction of the anisotropic conductive film is less than 20% of an average of the particle densities at the respective region.5. The anisotropic conductive film ...

PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

A display device includes a display substrate including a display area and a pad region, a first pad portion including a plurality of first pad terminals, the plurality of first pad terminals being arranged in a first direction, and a printed circuit board (PCB) including a base film and a second pad portion. The second pad is electrically connected to the first pad portion. The second pad portion includes a plurality of second pad terminals electrically connected to the plurality of first pad terminals, and a plurality of first test lines. The plurality of second pad terminals includes a plurality of sub-pad terminals. One of the plurality of first lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first lines. 1. A display device , comprising:a display substrate including a display area for displaying an image and a pad region disposed at a side of the display area;a first pad portion including a plurality of first pad terminals, the first pad portion being disposed in the pad region, the plurality of first pad terminals being arranged in a first direction; anda printed circuit board (PCB) including a base film and a second pad portion, wherein the second pad portion is disposed at a side of the base film and is electrically connected to the first pad portion, a plurality of second pad terminals electrically connected to the plurality of first pad terminals; and', 'a plurality of first test lines,', 'wherein the plurality of second pad terminals includes a plurality of sub-pad terminals,', 'wherein one of the plurality of first test lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first test lines, and, 'wherein the second pad portion includeswherein each of the plurality ...

Electrically conductive adhesive

One aspect refers to an electrically conductive adhesive including a) a (meth)acrylate monomer, b) a polymer being soluble in the (meth)acrylate monomer, c) a biocompatible metal having a median particle size d50 of below 50 μm, and d) a polymerization initiator. One aspect also refers to a kit for preparing an electrically conductive adhesive, to an implantable medical device including such an electrically conductive adhesive, or a cured form thereof, and to the use of such an electrically conductive adhesive.

Conductive particles, method for producing conductive particles, conductive material and connection structure

Provided are a conductive particle and a conductive material which are capable of decreasing the connection resistance and suppressing generation of voids in a connection structure when the connection structure is obtained by electrically connecting electrodes. The conductive particle according to the present invention has a solder at a conductive surface, wherein a group including a carboxyl group is covalently bonded to the surface of the solder; and the conductive material according to the present invention includes the conductive particles and a binder resin.

CONNECTION STRUCTURE

A connection structure: a first electronic component having a terminal pattern in which a plurality of terminals are arranged side by side in a radial form and a second electronic component having a terminal pattern corresponding to the terminal pattern of the first electronic component are anisotropically conductively connected using an anisotropic conductive film, (i) the effective connection area per terminal is 3000 μmor more, and the number density of conductive particles in the anisotropic conductive film is 2000 particles/mmor more and 20000 particles/mmor less, (ii) as the anisotropic conductive film, adopted is an anisotropic conductive film in which the conductive particles are arranged in a lattice form, and the arrangement pitch and the arrangement direction are configured such that each terminal captures three or more conductive particles, or (iii) as the anisotropic conductive film, adopted is an anisotropic conductive film having a multiple circular region. 1. A method for producing a connection structure in which a first electronic component having a terminal pattern in which a plurality of terminals are arranged side by side in a radial form and a second electronic component having a terminal pattern corresponding to the terminal pattern of the first electronic component are anisotropically conductively connected using an anisotropic conductive film , wherein{'sup': '2', 'an effective connection area per terminal is 3000 μmor more, and'}{'sup': 2', '2, 'a number density of conductive particles in the anisotropic conductive film is 2000 particles/mmor more and 20000 particles/mmor less.'}2. A method for producing a connection structure in which a first electronic component having a terminal pattern in which a plurality of terminals are arranged side by side in a radial form and a second electronic component having a terminal pattern corresponding to the terminal pattern of the first electronic component are anisotropically conductively connected ...

CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTING BODY AND INSPECTION METHOD THEREOF

Indentation visibility is improved and quick and accurate inspection is performed after a connection step using an anisotropic conductive film. A connection body according to the present disclosure comprises a transparent substrate and an electronic component connected to the transparent substrate via an anisotropic conductive adhesive; conductive particles contained by the anisotropic conductive adhesive cause a plurality of indentations arranged in an in-plane direction of a terminal of the transparent substrate. 1. A connection body comprising:a transparent substrate; andan electronic component connected to the transparent substrate via an anisotropic conductive adhesive;wherein the transparent substrate has terminals on which a plurality of indentations caused by conductive particles contained in the anisotropic conductive adhesive are arranged in an in-plane direction of the terminals.2. The connection body according to claim 1 , wherein in the terminals which are neighboring each other of the transparent substrate claim 1 , the indentations have a sameness property or a similarity property.3. The connection body according to claim 1 , wherein:the transparent substrate has a terminal row in which a plurality of the terminals are arranged;wherein in the terminal row, 55% or more of the indentations exist independently within a central terminal.4. The connection body according to claim 3 , wherein the indentations do not overlap within a same terminal of the terminals.5. The connection body according to claim 3 , wherein claim 3 , within the terminals claim 3 , a difference in distances between outside edges of the indentations to nearest other indentations is within ±30% of an average within a same terminal.6. The connection body according to claim 1 , wherein:the transparent substrate has a terminal row in which a plurality of the terminals are arranged;wherein in the terminal row, 55% or more of the indentations exist independently within terminals on both ...

CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

The present invention provides a conductive material in which, even when the conductive material is left for a certain period of time, solder can efficiently placed on an electrode, and, in addition, wettability of the solder can be improved. 1. A conductive material , comprising a thermosetting compound and a plurality of solder particles ,the conductive material having the concentration of free tin ions of 100 ppm or less.2. The conductive material according to claim 1 , further comprising an ion scavenger.3. The conductive material according to claim 2 , wherein the ion scavenger comprises zirconium claim 2 , aluminum or magnesium.4. The conductive material according to claim 2 , wherein the particle diameter of the ion scavenger is 10 nm or more and 1000 nm or less.5. The conductive material according to claim 2 , wherein the content of the ion scavenger in 100% by weight of the conductive material is 0.01% by weight or more and 1% by weight or less.6. The conductive material according to claim 1 , further comprising a compound having a benzotriazole skeleton or a benzothiazole skeleton claim 1 , wherein the content of the solder particles in 100% by weight of the conductive material is less than 85% by weight.7. The conductive material according to claim 6 , wherein the compound having a benzotriazole skeleton or a benzothiazole skeleton has a thiol group.8. The conductive material according to claim 7 , wherein the compound having a benzotriazole skeleton or a benzothiazole skeleton is a primary thiol.9. The conductive material according to claim 6 , wherein the compound having a benzotriazole skeleton or a benzothiazole skeleton is attached on the surface of the solder particle.10. The conductive material according to claim 6 , wherein the content of the compound having a benzotriazole skeleton or a benzothiazole skeleton in 100% by weight of the conductive material is 0.01% by weight or more and 5% by weight or less.11. The conductive material according to ...

Flexible printed wiring board, joined body, pressure sensor and mass flow controller

In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.

ELECTRO-OPTIC DEVICE WITH WIRE EMBEDDED IN AN ADHESIVE SEAL

An electro-optic device comprises a first substrate having a first surface, a second surface, and an outer perimeter edge; a second substrate having a third surface, a fourth surface, and an outer perimeter edge, the third surface of the second substrate being opposed to the second surface of the first substrate; a chamber defined between the second surface of the first substrate and the opposed third surface of the second substrate; a first electrode coating disposed on the second surface of the first substrate; a second electrode coating disposed on the third surface of the second substrate; a first conductive or semi-conductive material disposed on and extending longitudinally along at least a portion of a peripheral area of the first substrate and in electrical communication with the first electrode coating; and a non-conductive material extending between the first conductive or semi-conductive material and the second electrode coating. 1. An electro-optic device comprising:a first substrate having a first surface, a second surface, and an outer perimeter edge;a second substrate having a third surface, a fourth surface, and an outer perimeter edge, the third surface of the second substrate being opposed to the second surface of the first substrate;a chamber defined between the second surface of the first substrate and the opposed third surface of the second substrate;a first electrode coating disposed on the second surface of the first substrate;a second electrode coating disposed on the third surface of the second substrate;a first conductive or semi-conductive material disposed on and extending longitudinally along at least a portion of a peripheral area of the first substrate and in electrical communication with the first electrode coating; anda non-conductive material extending between the first conductive or semi-conductive material and the second electrode coating.2. The electro-optic device of claim 1 , wherein the first conductive or semi-conductive ...

Low profile electrical connector

An electrical connector for electrically connecting a package with a printed circuit board (PCB) with a plurality of pads and an alignment feature includes an insulating housing, a plurality of contacts received in the insulating housing and a stiffener insert molding with the insulating housing. When the stiffener is assembled upon the alignment feature correspondingly, the contacts align with the pads of the PCB correspondingly.

THREE-DIMENSIONAL MOUNTING STRUCTURE AND METHOD FOR MOUNTING THE SAME

A three-dimensional mounting structure includes a first mounting component, a second mounting component facing the first mounting component, a connecting layer disposed between the first mounting component and the second mounting component, a third mounting component, an adhesive layer, and a barrier sheet. The first mounting component includes a first end surface. The third mounting component is bonded on the first end surface through the adhesive layer. The connecting layer includes a second end surface close to the first end surface. The three-dimensional mounting structure can avoid the adhesive layer overflowing from the first end surface to the second end surface and improve the electronic product yield. A method for assembling the three-dimensional mounting structure is also disclosed. 1. A three-dimensional mounting structure , comprising:a first mounting component;a second mounting component;a connecting layer disposed between the first mounting component and the second mounting component;a third mounting component;an adhesive layer; anda barrier sheet,wherein, the first mounting component comprises a first end surface, the third mounting component is bonded on the first end surface through the adhesive layer, the connecting layer comprises a second end surface close to the first end surface, the barrier sheet is disposed between the second end surface and the third mounting component.2. The three-dimensional mounting structure of claim 1 , wherein the third mounting component comprises a mounting body and a plurality of mounting portions connected to an end of the mounting body claim 1 , each of the plurality of mounting portions comprises a first surface and a second surface opposite to the first surface claim 1 ,the adhesive layer comprises a plurality of connecting units each corresponding to the plurality of mounting portions, each of the plurality of connecting units is disposed between the first surface and the second surface.3. The three-dimensional ...

Electrical Connection Tape

A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape. 1. A thermal managing electrical connection tape comprising:a carrier film; anda composition including solder powder, the composition being applied to the carrier film.2. The thermal managing electrical connection tape of claim 1 , wherein the composition includes a soldering flux having the solder powder disposed in the soldering flux.3. The thermal managing electrical connection tape of claim 2 , wherein the composition contains between about 50 wt % and about 70 wt % soldering flux.4. The thermal managing electrical connection tape of claim 3 , wherein the composition contains between about 30 wt % and about 50 wt % solder powder.5. The thermal managing electrical connection tape of claim 2 , wherein the composition is patterned with epoxy and/or acrylic.6. The thermal managing electrical connection tape of claim 1 , wherein the composition includes at least one of epoxy and acrylic.7. The thermal managing electrical connection tape of claim 1 , wherein the composition includes a suction cup-shaped morphology.8. The thermal managing electrical connection tape of claim 1 , wherein the composition includes filler materials that ...

IMPLEMENTING CUSTOMIZED PCB VIA CREATION THROUGH USE OF MAGNETIC PADS

A method and apparatus are provided for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via. 1. A method for implementing enhanced customized printed circuit board (PCB) via creation during printed circuit board (PCB) manufacturing comprising:providing a printed circuit board (PCB);forming a via extending through the printed circuit board (PCB);rendering at least one magnetic pad into the via before aqueous seed and plate processing in the PCB manufacture;performing PCB aqueous seed and plate processing, and said magnetic pad selectively rendering copper in at least one selected region of the via.2. The method as recited in wherein rendering at least one magnetic pad includes rendering at least one magnetic pad by an inner-layer PCB processing step.3. The method as recited in includes accomplishing said at least one magnetic pad rendering using an existing PCB manufacturing method.4. The method as recited in wherein rendering at least one magnetic pad includes forming at least one magnetic capture pad.5. The method as recited in includes forming said at least one magnetic capture with ferrous seed material.6. The method as recited in wherein rendering at least one magnetic pad includes providing said ferrous seed material for prohibiting a seed layer from forming in the via barrel outside of an intended area with the seed material being captive by aqueous magnetic material with said at least one magnetic pad.7. The method as recited in wherein rendering at least one magnetic pad includes forming at least one magnetic anti-pad.8. The method as recited in includes forming said at least one magnetic anti-pad with ferrous resist material.9. The method as recited in wherein said at least one ...

Display apparatus

A display apparatus includes a display panel which have first display pads arranged in a first direction, a main circuit board, a first flexible circuit board which includes first substrate pads connected to the main circuit board and the first display pads and a first driving chip connected to the first substrate pads, and is bent in a direction toward a back surface of the display panel, and a protective member disposed on the first flexible circuit board. The protective member covers the first driving chip.

Electrode joining method, production method of electrode joined structure, and production system of electrode joined structure

Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.

METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE ADHESIVE FILM, ELECTRICALLY CONDUCTIVE ADHESIVE FILM, AND METHOD FOR MANUFACTURING CONNECTOR

A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer. 1. An electrically conductive adhesive film comprising:a base film;a binder resin that is laminated on the base film; andelectrically conductive particles that are regularly dispersed and disposed on the binder resin in a predetermined pattern,wherein, among the electrically conductive particles, electrically conductive particles having a mark on a surface are within 30% of the total number of particles.2. The electrically conductive adhesive film according to claim 1 , wherein the electrically conductive particles is subjected to further insulation treatment.3. An electrically conductive adhesive film comprising:a base film;a binder resin that is laminated on the base film; andelectrically conductive particles that are regularly dispersed and disposed on the binder resin in a predetermined pattern,wherein the electrically conductive particles have a metal surface, andwherein the electrically conductive particles include electrically conductive particles in which a portion of the metal surface is peeled off.4. The electrically conductive adhesive film according to claim 3 , wherein the electrically conductive particles are coated on a surface with a metal.5. The electrically conductive adhesive film according to claim 4 , wherein the electrically conductive particles coated on a surface with a metal are plated ...

METHOD OF BONDING FLEXIBLE PRINTED CIRCUITS

A method for forming electrical connections between a first plurality of electrical conductors and a second plurality of electrical conductors, the method comprising: providing a first cushion () on a mount (); disposing a first substrate () on the mount wherein a first side of the first substrate is in contact with the first cushion and a second side of the first substrate comprises the first plurality of electrical conductors (); depositing an anisotropic conductive (AC) bonding material () on the first plurality of electrical conductors; aligning a second substrate with the first substrate, wherein a first side of the second substrate comprises the second plurality of conductors (), and wherein the second plurality of conductors are aligned with the first plurality of conductors such that the AC bonding material is sandwiched between the first side of the first substrate and the first side of the second substrate; providing a second cushion () on the second substrate; applying heat and pressure to the second cushion to form the AC bond between the first and second plurality of conductors; wherein the first and second cushions are formed of a thermally resistive and elastic material to enable substantially uniform pressure and heat to be applied across the first and second plurality of electrical conductors when forming the AC bond. 1. A method for forming electrical connections between a first plurality of electrical conductors and a second plurality of electrical conductors , the method comprising:providing a first cushion on a mount;disposing a first substrate on the mount wherein a first side of the first substrate is in contact with the first cushion and a second side of the first substrate comprises the first plurality of electrical conductors;depositing an anisotropic conductive (AC) bonding material on the first plurality of electrical conductors;aligning a second substrate with the first substrate, wherein a first side of the second substrate comprises ...

Printed wiring board

A printed wiring board includes a central resin insulating layer, an electronic component embedded in the central insulating layer, a first resin insulating layer formed on first surface side of the central insulating layer, a second resin insulating layer formed on second surface side of the central insulating layer, via conductors formed in the central insulating layer such that the via conductors are formed toward the first surface side, and metal posts formed in the central insulating layer such that the metal posts are formed toward the second surface side. The central insulating layer does not contain a core material, and the via conductors include a group of via conductors connected with the metal posts respectively such that a via conductor and a respective metal post connected to the via conductor is connecting a first surface and a second surface of the central insulating layer on the opposite side.

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

A circuit board structure, including a redistribution circuit structure layer, a build-up circuit structure layer, and a connection structure layer, is provided. The redistribution circuit structure layer includes multiple first connecting pads. The build-up circuit structure layer is disposed on one side of the redistribution circuit structure layer and includes multiple second connecting pads. A line width and a line spacing of the redistribution circuit structure layer are smaller than a line width and a line spacing of the build-up circuit structure layer. The connection structure layer is disposed between the redistribution circuit structure layer and the build-up circuit structure layer, and includes a substrate and multiple conductive paste pillars penetrating the substrate. The first connecting pads are electrically connected to the second connecting pads respectively through the conductive paste pillars. The first connecting pads and the second connecting pads are respectively embedded in two opposite surfaces of the substrate.

Display apparatus and electronic device

A display apparatus includes a display panel, a driving integrated circuit (IC), and an anisotropic conductive film. The display panel includes a non-display area adjacent to a display area and an upper substrate and a lower substrate. The driving IC overlaps the non-display area. The anisotropic conductive film attaches the driving IC to the lower substrate and includes conductive balls with diameters that gradually increase toward the display area.

ANISOTROPIC CONDUCTIVE CONNECTION STRUCTURE BODY

There is provided a new and improved anisotropic conductive connection structure body that reduces the connection resistance of an anisotropic conductive connection portion between electrode terminals and can enhance reliability, and can enhance the connection strength. The anisotropic conductive connection structure body includes: a first electrode terminal on a surface of which a protruding portion is formed; a second electrode terminal; and an anisotropic conductive adhesive layer containing electrically conductive particles that provide conduction between the first electrode terminal and the second electrode terminal. A ratio of a height of the protruding portion to a before-compression particle size of the electrically conductive particle is less than 60%, an opening area ratio of the first electrode terminal is more than or equal to 55%, and a height of the second electrode terminal is more than or equal to 6 μm. 1. An anisotropic conductive connection structure body comprising:a first electrode terminal on a surface of which a protruding portion is formed;a second electrode terminal; andan anisotropic conductive adhesive layer containing electrically conductive particles that provide conduction between the first electrode terminal and the second electrode terminal,wherein a ratio of a height of the protruding portion to a before-compression particle size of the electrically conductive particle is less than 60%,an opening area ratio of the first electrode terminal is more than or equal to 55%, anda height of the second electrode terminal is more than or equal to 6 μm.2. The anisotropic conductive connection structure body according to claim 1 ,wherein a ratio of a hardness of the first electrode terminal to a hardness of the second electrode terminal is larger than 10%.3. The anisotropic conductive connection structure body according to claim 1 ,wherein a concavity surrounded by the protruding portion is formed on a surface of the first electrode terminal, ...

DISK DEVICE

A disk device according to one embodiment includes a recording medium, a magnetic head, a wiring member, and a flexible printed circuit board. The magnetic head is configured to read/write information from/to the recording medium. The wiring member includes a plurality of first terminals, and a plurality of first wires that electrically connect the magnetic head to the first terminals. The flexible printed circuit board includes a surface, a plurality of second terminals located on the surface to be connected to the first terminals by means of a conductive adhesive, and a ground plane spaced apart from the second terminals in a direction along the surface. 2. The disk device according to claim 1 , further comprising:an electronic component mounted on the flexible printed circuit board,wherein the flexible printed circuit board comprises:a first part on which the plurality of second terminals are located, anda second part on which the electronic component is mounted, andthe ground plane is located on the second part with spacing from the first part in the direction along the surface.3. The disk device according to claim 1 ,wherein the plurality of second terminals include a plurality of first electrodes arranged at intervals in a first direction along the surface,the flexible printed circuit board is provided with a via hole, and a second wire that electrically connects the via hole and one of the plurality of first electrodes, andthe via hole is located in the middle of two adjacent first electrodes among the plurality of first electrodes in the first direction.4. The disk device according to claim 3 ,wherein the plurality of second terminals include a plurality of second electrodes that are arranged at intervals in the first direction with spacing from the plurality of first electrodes in a second direction, the second direction being along the surface and intersecting the first direction, andthe via hole is located in the middle of two adjacent first electrodes ...

Display device

A display device includes a first substrate including a display area including pixels, a non-display area disposed around the display area, and a base substrate, a second substrate facing the first substrate, and a printed circuit board attached to side surfaces of the first substrate and the second substrate, wherein the first substrate includes a plurality of connection wirings connected to the pixels, arranged on the base substrate, extending along a first direction, and spaced apart from each other along a second direction intersecting the first direction, and a plurality of connection pads arranged on the side surface of the first substrate and the side surface of the second substrate, connected to the connection wirings, extending along a thickness direction, and spaced apart from each other along the second direction, the first substrate further includes a coupling member disposed between the printed circuit board and the side surface of the first substrate and between the printed circuit board and the side surface of the second substrate, and the coupling member includes a non-conductive film portion disposed to overlap the connection wirings along the first direction, and a conductive film portion disposed around the non-conductive film portion.

Electronic Device and Method of Making the Same Using Surface Mount Technology

A method of and system for manufacturing an electronic device, a curable conductive adhesive for use in the same, and an electronic device are disclosed. The method includes printing a conductive adhesive onto pads at ends of traces on a substrate, placing one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and after the component(s) have been placed onto the pads, curing the conductive adhesive at a predetermined temperature or with light having a predetermined wavelength (band). The system comprises a printer configured to print a conductive adhesive onto pads at ends of traces on a substrate, a surface mounting machine configured to place one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and a curing station configured to cure the conductive adhesive after the component(s) have been placed onto the pads. 1. A method of manufacturing an electronic device , comprising:a) printing a conductive adhesive onto pads at ends of traces on a substrate;b) placing one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon; andc) after the component(s) have been placed onto the pads of the substrate, curing the conductive adhesive at a predetermined temperature or with light having a predetermined wavelength or wavelength band.2. The method of claim 1 , wherein the conductive adhesive is cured at the predetermined temperature claim 1 , and the predetermined temperature is in the range of from 50° C. to 140° C.3. The method of claim 1 , wherein the conductive adhesive is an anisotropic conductive paste (ACP) claim 1 , comprising:a) one or more polymerizable monomers;b) one or more co-monomers that is co-polymerized with the polymerizable monomers, the one or more co-monomers having a formula with at least three functional groups that are co-polymerizable with the one or more polymerizable monomers ...

CHIP ASSEMBLIES

A chip assembly may include a package substrate that includes one or more pins. The chip assembly may also include one or more pads. The one or more pads may be electrically coupled to the one or more pins. In addition, the chip assembly may include a board that includes one or more board pads. Further, the chip assembly may include an anisotropic layer. The anisotropic layer may be positioned between the board and the one or more pads and between the board and a portion of the package substrate. In addition, the anisotropic layer may mechanically couple the board to the one or more pads and to the portion of the package substrate. Further, the anisotropic layer may electrically couple the one or more pads to the one or more board pads. 1. A chip assembly , comprising:a package substrate comprising one or more pins;one or more pads, the one or more pads electrically coupled to the one or more pins;a board comprising one or more board pads; andan anisotropic layer positioned between the board and the one or more pads and between the board and a portion of the package substrate, the anisotropic layer mechanically coupling the board to the one or more pads and to the portion of the package substrate and electrically coupling the one or more pads to the one or more board pads.2. The chip assembly of claim 1 , wherein the anisotropic layer electrically couples the one or more pads to the one or more board pads by maintaining a physical proximity of the one or more pads relative to the one or more board pads.3. The chip assembly of claim 1 , wherein a portion of the one or more pins comprises one or more power pins and a portion of the board comprises a board ground layer that defines one or more openings that expose the one or more board pads and wherein at least a portion of the one or more pads are electrically coupled to the one or more power pins and the portion of the one or more pads is positioned relative to a single opening of the one or more openings.4. The chip ...

FORMING ELECTRICAL INTERCONNECTIONS USING CAPILLARY MICROFLUIDICS

A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel. 1. A method for manufacturing an electronic device , comprising:providing a substrate with a first major surface comprising a microchannel, wherein the microchannel has a first end and a second end;dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; andsolidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel.2. The method of claim 1 , wherein the volume of the conductive liquid dispensed in the microchannel is significantly larger than the volume of the portion of the channel underlying the conductive liquid dispensed therein.3. The method of claim 1 , wherein the microchannel has a substantially constant width and depth from the first end to the second end.4. The method of claim 1 , wherein the second end of the microchannel terminates in a bore extending from the first major surface of the substrate to a second major surface of the substrate opposite the first major surface.5. The method of claim 4 , wherein the first electronic ...

ELECTRICAL CONTACT COMPOSITES AND METHOD FOR PRODUCING ELECTRICAL CONTACT COMPOSITES

An electrical contact composite is described. The electrical contact composite has a substrate and an electrically conductive coating applied to the substrate, which coating is connected to an electrode. A metal contact element is connected to the electrode, which contact element is used to connect the conductive coating to a current/voltage source. Furthermore, at least one sprayed layer produced by means of a thermal spraying method, in particular gas dynamic cold spray, and is provided with at least one metal and/or metal alloy, the sprayed layer being arranged between the conductive coating and the contact element. The sprayed layer has a coefficient of thermal expansion that is between the coefficients of thermal expansion of the carrier and of the contact element. The sprayed layer can also be used as the electrode for the conductive coating. 1. An electrical contact composite , comprising , in order:a flat substrate with an electrically conductive coating applied thereon;an electrode that is electrically connected to the conductive coating and mechanically connected to the conductive coating by way of a printing method;a sprayed layer that is produced by a thermal spraying method onto the electrode;a solder layer; and 'wherein the sprayed layer comprises at least one metal and/or at least one metal alloy.', 'a metal contact element that is electrically connected to the electrode and mechanically connected to the sprayed layer by way of the solder layer, the metal contact element serving for electrical connection of the conductive coating to an electrical component,'}2. The contact composite according to claim 1 , wherein a coefficient of thermal expansion of the sprayed layer is in a range of a middle third of a value range for coefficients of thermal expansion bounded by coefficients of thermal expansion of the flat substrate and the contact element.3. The contact composite according to claim 2 , wherein the coefficient of thermal expansion of the sprayed ...

LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board. 1. A light-emitting device comprising:a light-emitting panel comprising a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; anda flexible wiring board comprising a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board,wherein a ratio of a minimum distance between a substrate of the flexible wiring board and the first board at a portion where the conductor patterns and the circuit pattern are not in electrical contact with each other via the anisotropic conductive layer relative to a distance between the substrate of the flexible wiring board and the first board at a portion where the conductor patterns and the circuit pattern are in electrical contact with each other via the anisotropic conductive layer is at least ¾ and no more than 9/10.2. A light-emitting device comprising:a light-emitting panel comprising a first board that is ...

CONNECTION STRUCTURE BETWEEN SENSOR AND CABLE, AND CONNECTION CABLE

A connection structure between sensor and cable includes a cable formed by assembling a plurality of electric wires each including a covering portion covering a core and a core-exposing portion exposing the core at an end of the covering portion, a spacer that is interposed in a space surrounded by the covering portions of the electric wires and holds end portions of the covering portions in the state that the end portions are spaced from each other, and a sensor that detects a physical quantity, and the core-exposing portion of each of the electric wires of the cable is electrically connected to the sensor via a fixing member in the state that each of the electric wires is held by the spacer. 1. A connection structure between sensor and cable , comprising:a cable comprising a plurality of electric wires each comprising a covering portion covering a core and a core-exposing portion exposing the core at an end of the covering portion;a spacer that is interposed in a space surrounded by the covering portions of the electric wires and holds end portions of the covering portions in the state that the end portions are spaced from each other; anda sensor that detects a physical quantity,wherein the core-exposing portion of each of the electric wires of the cable is electrically connected to the sensor via a fixing member in the state that each of the electric wires is held by the spacer.2. The connection structure between sensor and cable according to claim 1 , wherein the spacer has an outer circumferential surface on which a plurality of holding recesses are spaced from each other in a circumferential direction.3. The connection structure between sensor and cable according to claim 1 , wherein the spacer has an end face on which a contact portion configured to be in contact with the sensor is provided.4. The connection structure between sensor and cable according to claim 3 , wherein the sensor comprises a positioning portion for positioning with respect to the contact ...

ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure. 1. An electronic package structure , comprising:a carrier;at least one electronic component disposed on the carrier;a plurality of conductive elements disposed on the carrier;a metal frame having a plurality of conductive pads bonded to the conductive elements and a board corresponding in position to the electronic component, wherein at least a part of the board is located at a projected area of the electronic component; andan encapsulant formed on at least one of the carrier and the metal frame and encapsulating at least one of the electronic component and the conductive elements, wherein the board is embedded in the encapsulant with an outer surface of the board exposed from a first surface of the encapsulant.2. The electronic package structure of claim 1 , wherein the carrier is a packaging substrate claim 1 , a coreless circuit structure claim 1 , or a lead frame.3. The electronic package structure of claim 1 , wherein the carrier has a first side and a second side opposite to the first side claim 1 , and the first side and the second side of the carrier are each disposed with at least one of the at least one electronic component and the metal frame.4. The electronic package structure of claim 1 , wherein ...

Conductor connecting structure and mounting board

A conductor connecting structure includes a mounting board, a target board, and an anisotropic conductive material. The mounting board includes a base material that includes first and second surfaces. The mounting board also includes a conductor layer formed on the first or second surface and a first dummy conductor layer formed at a corner of the second surface. The target board includes a mounting surface, a conductor layer, and a second dummy conductor layer. The anisotropic conductive material includes a polymeric material and electrically conductive particles dispersed in the polymeric material. The electrically conductive particles, when heated, aggregate so as to connect an end portion of the conductor layer of the mounting board and the conductor layer of the target board to each other and connect the first and second dummy conductor layers to each other.

Conductor connecting structure and mounting board

A conductor connecting structure includes a mounting board, a target board, and an anisotropic conductive material. The mounting board includes a base material including a first surface, a second surface, and an end surface. The mounting board also includes a first conductor layer and a second conductor layer. The target board includes a mounting surface and a third conductor layer formed on the mounting surface. The anisotropic conductive material includes a polymeric material and electrically conductive particles dispersed in the polymeric material. The electrically conductive particles, when heated, aggregate to connect an end portion of the first or second conductor layer to the third conductor layer. One of the end portions not subjected to connection established with the anisotropic conductive material is separated further from the end surface of the base material than another end portion which is connected to the third conductor layer.

Flexible display panel

The present application provides a flexible display panel including a flexible substrate and a flexible circuit board electrically connected to the flexible substrate. Pins on the flexible substrate and the flexible circuit board are disposed to be inclined at a certain angle. When pitches of the pins on the flexible circuit board are changed due to expansion and contraction of the flexible circuit board itself, an accurate alignment of the pins on the flexible substrate and the flexible circuit board can be realized by adjusting the position of the flexible circuit board relative to the flexible substrate before connecting the flexible circuit board to the flexible substrate, thereby ensuring the quality of the flexible display panel and improving product yield of the display panel.

Display device

A display device includes: a display panel including a top surface, a bottom surface facing the top surface, and a plurality of side surfaces which connects the top surface to the bottom surface; a plurality of data driving units disposed on a first side surface of the side surfaces; a plurality of gate driving units disposed on a second side surface of the side surfaces, which is connected to the first side surface, and a first control signal line disposed on the first and second side surfaces, in which the first control signal line connects a first adjacent data driving unit of the data driving units, which is disposed adjacent to the second side surface, to the first gate driving units.

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. 1. An anisotropic conductive film having a first connection layer and a second connection layer formed on a surface of the first connection layer , whereinthe first connection layer is a photopolymerized resin layer,the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer, andthe first connection layer has conductive particles for anisotropic conductive connection that are arranged in a single layer on a surface on a side of the second connection layer, and fine projections and recesses are provided to a surface of the first connection layer opposite to the side of the second connection layer.2. An anisotropic conductive film having a second connection layer layered on a surface of a first connection layer and a third connection layer layered on another surface of the first connection layer , whereinthe first connection layer is formed of a ...

WIRING BODY ASSEMBLY, WIRING BOARD, AND TOUCH SENSOR

A wiring body assembly includes: a first wiring body including a first insulating portion, a first lead wiring and a first terminal portion, the first lead wiring and the first terminal portion are disposed on a surface of the first insulating portion; a second wiring body including a second insulating portion, a second lead wiring and a second terminal portion, the second lead wiring and the second terminal portion are disposed on a surface of the second insulating portion that is oriented opposite to the surface of the first insulating portion; and a conductive adhering portion connecting the first terminal portion and the second terminal portion. The first wiring body and the second wiring body overlap each other so that the first terminal portion and the second terminal portion face each other through the conductive adhering portion. 1. A wiring body assembly comprising:a first wiring body including a first insulating portion, a first lead wiring and a first terminal portion, wherein the first lead wiring and the first terminal portion are disposed on a surface of the first insulating portion;a second wiring body including a second insulating portion, a second lead wiring and a second terminal portion, wherein the second lead wiring and the second terminal portion are disposed on a surface of the second insulating portion that is oriented opposite to the surface of the first insulating portion; anda conductive adhering portion that connects the first terminal portion and the second terminal portion, whereinthe first wiring body and the second wiring body overlap each other so that the first terminal portion and the second terminal portion face each other through the conductive adhering portion,the conductive adhering portion includes a first protruding portion that protrudes from a space between the first wiring body and the second wiring body,the first protruding portion covers a portion of an end surface of the first wiring body, andthe portion of the end ...

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

An anisotropic conductive film A includes a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer The anisotropic conductive film A has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles is asymmetric with respect to the conductive particle The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film A, short circuits and conductive failure can be reduced. 1. An anisotropic conductive film comprising:a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer, the anisotropic conductive film having a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles is asymmetric with respect to the conductive particle.2. The anisotropic conductive film according to claim 1 , wherein the direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles.3. The anisotropic conductive film according to claim 1 , wherein in a cross section of the anisotropic conductive film when the anisotropic conductive film is cut in the direction in which the thickness distribution is asymmetric claim 1 , the direction passing through a center of the conductive particle claim 1 , an area of the insulating resin layer surrounding the conductive particle is configured such that an area on one side of the conductive particle is smaller than an area on the other side.4. The anisotropic conductive film according to claim 3 , wherein in the cross section of the anisotropic ...

Connector, display device including the same, and method of manufacturing the display device

A display device includes a display panel configured to display an image, a first circuit board electrically connected to the display panel and including a first connecting pad part, a second circuit board electrically connected to the display panel and including a second connecting pad part overlapping the first connecting pad part, and a connector disposed between the first circuit board and the second circuit board to electrically connect the first connecting pad part to the second connecting pad part. The connector includes a base plate; and a pad part including a first pad surface exposed from one surface of the base plate and a second pad surface exposed from the other surface of the base plate, and the first pad surface and the second pad surface overlap each other in a plan view.

DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE

The present disclosure provides a display panel, a method for manufacturing the same, and a display device. The display panel includes a binding region which includes a PAD region. The PAD region includes a connect layer which is composed of patterns of multiple sharp protrusions. 1. A display panel , comprising:a binding region comprising a PAD region, the PAD region comprising a connect layer which is composed of patterns of multiple sharp protrusions.2. The display panel according to claim 1 , wherein a width of each of the sharp protrusions is no larger than one-half of a diameter of an anisotropic conductive film particle.3. The display panel according to claim 2 , wherein the width of each of the sharp protrusions is no less than one third of the diameter of the anisotropic conductive film particle.4. The display panel according to claim 1 , wherein a distance between any two adjacent sharp protrusions is no larger than one-half the diameter of the anisotropic conductive film particle.5. The display panel according to claim 1 , wherein the sharp protrusions are provided with a shape of a sharp convex.6. The display panel according to claim 1 , wherein the PAD region further comprises: a base substrate claim 1 , a buffer layer claim 1 , and a source/drain metal layer that are stacked from bottom to top claim 1 , wherein the connect layer is provided between the buffer layer and the source/drain metal layer.7. The display panel according to claim 6 , wherein the width of each of the sharp protrusions is no larger than one-half of the diameter of the anisotropic conductive film particle.8. The display panel according to claim 7 , wherein the width of each of the sharp protrusions is no less than one third of the diameter of the anisotropic conductive film particles.9. The display panel according to claim 6 , wherein a height of each of the sharp protrusions is at least twice a thickness of source/drain metal in the source/drain metal layer.10. The display panel ...

FABRIC HAVING MULTIPLE LAYERED CIRCUIT THEREON INTEGRATING WITH ELECTRONIC DEVICES

The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s). 1. A fabric having a multiple layered circuit thereon integrating with an electronic device , comprising:a base layer;a plurality of conductive circuit layers, formed on the base layer;at least one connecting layer, comprising a plurality of via-holes made of a conductive material and a plurality of electrically insulated regions made of an insulating material and being positioned between any two adjacent conductive circuit layers of the plurality of conductive circuit layers wherein the via-holes electrically connect the two adjacent conductive circuit layers and the electrically insulated regions are distributed in areas other than the via-holes of the connecting layer;at least one electronic device, mounted on and electrically connected to a circuit of the conductive circuit layer through anisotropic conductive film; anda waterproof layer, formed on the conductive circuit layer be farthest away from the base layer;wherein the absolute value of the difference between the thermal expansion coefficient of the material constituting the conductive circuit layer and the thermal expansion coefficient of the insulating material constituting the ...

DISPLAY APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS

A display apparatus comprises a display panel comprising a plurality of driving elements to drive pixels and a first terminal group electrically connected to the driving elements; a supporting member comprising a surface on which the display panel is to be placed and comprising, on the surface, a plurality of wirings and a second terminal group connected to the plurality of wirings; and a holding member provided along an edge of the display panel using a rod-shaped material having a linear or curved shape to hold the display panel on the surface of the supporting member, wherein the first terminal group is provided on a surface of the display panel to be directed to the supporting member; and the display panel is placed on the surface of the supporting member, and each of terminals constituting the first terminal group is connected to each of terminals constituting the second terminal. 1. A display apparatus comprising:a display panel comprising a plurality of driving elements to drive pixels and a first terminal group electrically connected to the driving elements;a supporting member comprising a surface on which the display panel is to be placed and comprising, on the surface, a plurality of wirings and a second terminal group connected to the plurality of wirings; anda holding member provided along an edge of the display panel using a rod-shaped material having a linear or curved shape to hold the display panel at a given position on the surface of the supporting member, whereinthe first terminal group is provided on a surface of the display panel to be directed to the supporting member;the display panel is placed on the surface of the supporting member, and each of terminals constituting the first terminal group is connected to each of terminals constituting the second terminal; andthe supporting member comprises a window glass of a vehicle.2. (canceled)3. The display apparatus according to claim 1 , whereinthe supporting member comprises a windshield of an ...

CONNECTING DEVICE AND DISK DEVICE

A connecting device includes a first flexible printed circuit including a bonding end in which a plurality of connecting pads are provided, a first base portion, a junction portion extending between the bonding end and the first base portion, and a plurality of traces extending from the first base portion to the bonding end, a first connector that is mounted on the first base portion, a second flexible printed circuit including a bonding end in which a plurality of connecting pads are provided, a second base portion, a junction portion extending between the bonding end and the second base portion, and a plurality of traces extending from the second base portion to the bonding end, and a second connector that is mounted on the second base portion. The first connector and the second connector are disposed side by side in a same plane. 1. A connecting device comprising:a first flexible printed circuit including a bonding end in which a plurality of connecting pads are provided, a first base portion, a junction portion extending between the bonding end and the first base portion, and a plurality of traces extending from the first base portion to the bonding end;a first connector that is mounted on the first base portion;a second flexible printed circuit including a bonding end in which a plurality of connecting pads are provided, a second base portion, a junction portion extending between the bonding end and the second base portion, and a plurality of traces extending from the second base portion to the bonding end; anda second connector that is mounted on the second base portion,wherein the first connector and the second connector are disposed side by side in a same plane.2. The connecting device according to claim 1 , further comprising:a first support that is attached to the first base portion and supports the first connector, anda second support that is attached to the second base portion and supports the second connector.3. The connecting device according to claim ...

INPUT DEVICE

An input device includes a sensor unit, an optical layer superimposed on the sensor unit, and a flexible wiring substrate having a connection region held between the optical layer and support base member. The flexible wiring substrate has a flexible base member on which an electrode layer is provided and a wiring end that is an end of the electrode layer and is conductive with the terminal part with a conductive joining member. The wiring end is set back from an end of the flexible base member, so that the flexible base member has a protruding part protruding toward the sensing region. Since the input device has, on the sensing region side relative to a front end of the protruding part, a part into which the conductive joining member does not stick out, an air bubble region between the sensor unit and the optical layer can be narrowed. 1. An input device comprising: a support base member having a sensing region on a first surface thereof;', 'a light-transmitting electrode unit provided in the sensing region of the support base member; and', 'a terminal part provided on the first surface of the support base member outside the sensing region, the terminal part being conductive with the light-transmitting electrode unit;, 'a sensor unit includingan optical layer provided on the sensor unit in a first direction; and a flexible base member having a first end on a sensing region side; and', 'an electrode layer provided on the flexible base member, the electrode layer having a wiring end portion in the connection portion, an edge of the wiring end portion being disposed at a position shifted from the first end of the flexible base member such that the flexible base member has an extending part which lacks the electrode layer thereon and extends toward the sensing region beyond the edge of the wiring end portion; and, 'a flexible wiring substrate having a connection portion interposed between the optical layer and the support base member of the sensor unit, the flexible ...

ELECTROMAGNETIC PULSE SHIELD

A method according to one embodiment includes securing a first plurality of conductive sheets to a surface, applying a conductive tape to a first plurality of joints between conductive sheets of the first plurality of conductive sheets, and securing a second plurality of conductive sheets to the first plurality of conductive sheets without fully penetrating the first plurality of conductive sheets. In such an embodiment, each of a second plurality of joints between conductive sheets of the second plurality of conductive sheets is offset relative to the first plurality of joints. 1. A method , comprising:securing a first plurality of conductive sheets to a surface;applying a conductive tape to a first plurality of joints between conductive sheets of the first plurality of conductive sheets; andsecuring a second plurality of conductive sheets to the first plurality of conductive sheets without fully penetrating the first plurality of conductive sheets,wherein an adhesive is arranged between the first plurality of conductive sheets and the second plurality of conductive sheets.2. The method of claim 1 , wherein securing the second plurality of conductive sheets to the first plurality of conductive sheets comprises adhering the second plurality of conductive sheets to the first plurality of conductive sheets.3. The method of claim 1 , wherein securing the second plurality of conductive sheets to the first plurality of conductive sheets comprises screwing the second plurality of conductive sheets to the first plurality of conductive sheets with self-tapping screws without fully penetrating the first plurality of conductive sheets.4. The method of claim 3 , wherein screwing the second plurality of conductive sheets to the first plurality of conductive sheets with the self-tapping screws comprises screwing the second plurality of conductive sheets to the first plurality of conductive sheets with the self-tapping screws at every nine inches in both a longitudinal direction ...

METHOD FOR FLIP-CHIP BONDING USING ANISOTROPIC ADHESIVE POLYMER

The present invention discloses flip-chip bonding method using an anisotropic adhesive polymer. The method includes applying an adhesive polymer solution containing metal particles dispersed therein onto a circuit substrate to form an adhesive polymer layer such that the adhesive polymer layer covers the metal particles; drying the adhesive polymer layer; and positioning an electronic element to be electrically connected to the circuit substrate on the dried adhesive polymer layer and causing dewetting of the polymer from the metal particles. 1. A structure for flip-chip bonding , the structure allowing an adhesive polymer to be dewettted , the structure comprising:a circuit substrate;an anisotropic adhesive polymer layer applied on the circuit substrate; andmetal particles dispersed in the adhesive polymer layer,wherein an effective interfacial potential of the adhesive polymer at a position corresponding to the metal particle has a metastable state, and the adhesive polymer at the position corresponding to the metal particle has a thickness change by an external force applied thereto, such that the adhesive polymer is dewetted from the metal particle.2. The structure for flip-chip bonding of claim 1 , wherein the adhesive polymer is UV curable.4. The structure for flip-chip bonding of claim 3 , wherein claim 3 , in the metastable state claim 3 , a value of the function of the effective interfacial potential changes from a negative value to a positive value as a value of h increases and claim 3 , then claim 3 , a slope of the function of the effective interfacial potential is changed to a negative value.5. The structure for flip-chip bonding of claim 4 , wherein a minimum thickness of the adhesive polymer at the position corresponding to the metal particle or the relief electrode is defined as a thickness thereof at which the slope of the effective interfacial potential of the adhesive polymer at the position corresponding to the metal particle or the relief ...

DISPLAY PANEL AND DISPLAY DEVICE

A display panel and a display device are provided. The display panel comprises a first substrate having a step area; a second substrate disposed opposite to the first substrate, wherein the second substrate has a first surface facing the first substrate and an opposite second surface; a Chip On Flex (COF) disposed on the step area of the first substrate and comprising at least one ground pad, wherein the COF has a first surface facing the first substrate and an opposite second surface, and the at least one ground pad is disposed on the second surface of the COF; a conductive layer disposed on the second surface of the second substrate; and a conductive adhesive electrically connected to the conductive layer and the at least one ground pad. 1. A display panel , comprising:a first substrate having a step area;a second substrate disposed opposite to the first substrate, wherein the second substrate has a first surface facing the first substrate and an opposite second surface;a Chip On Flex (COF) disposed on the step area of the first substrate and comprising at least one ground pad, wherein the COF has a first surface facing the first substrate and an opposite second surface, and the at least one ground pad is disposed on the second surface of the COF;a conductive layer disposed on the second surface of the second substrate; anda conductive adhesive electrically connected to the conductive layer and the at least one ground pad.2. The display panel according to claim 1 , wherein:the conductive adhesive includes a conductive silver paste or a conductive tape.3. The display panel according to claim 1 , wherein:the conductive adhesive is directly electrically connected to the conductive layer; andthe conductive adhesive is directly electrically connected to the at least one ground pad.4. The display panel according to claim 1 , wherein:an orthogonal projection of the at least one ground pad onto the first substrate is located within the step area of the first substrate.5. ...

Display screen and display apparatus

The present disclosure provides a display screen and a display apparatus, pertaining to the field of display technologies. The display screen includes: a backplane, a printed circuit board and a fixing adhesive, wherein the printed circuit board is fixed to the backplane by the fixing adhesive.

Disk device

A disk device according to one embodiment includes a recording medium, a magnetic head, a wiring member, and a flexible printed circuit board. The magnetic head is configured to read/write information from/to the recording medium. The wiring member includes a plurality of first terminals, and a plurality of first wires that electrically connect the magnetic head to the first terminals. The flexible printed circuit board includes a surface, a plurality of second terminals located on the surface to be connected to the first terminals by means of a conductive adhesive, and a ground plane spaced apart from the second terminals in a direction along the surface.

ANISOTROPIC CONDUCTIVE FILM

An anisotropic conductive film includes an electrically conductive particle dispersion layer, which includes electrically conductive particles dispersed, in a predetermined dispersion state, in an electrically insulating adhesive. The anisotropic conductive film includes a defective portion indication means configured to provide information about a location of a defective portion regarding the dispersion state of the electrically conductive particles. A bonding method for bonding the anisotropic conductive film to an electronic component is performed such that, in accordance with the information about the location of the defective portion, obtained from the defective portion indication means, a defect-free portion of the anisotropic conductive film is bonded to a region where terminals or terminal arrays are present in the electronic component to be anisotropically conductively connected. 1. An anisotropic conductive film including an electrically conductive particle dispersion layer , the electrically conductive particle dispersion layer including electrically conductive particles dispersed , in a predetermined dispersion state , in an electrically insulating adhesive , the anisotropic conductive film comprising:a defective portion indication means configured to provide information about a location of a defective portion regarding the dispersion state of the electrically conductive particles.2. The anisotropic conductive film according to claim 1 ,wherein the defective portion indication means comprises a mark provided for the anisotropic conductive film.3. The anisotropic conductive film according to claim 2 ,wherein the mark is provided a predetermined distance away from the defective portion.4. The anisotropic conductive film according to claim 1 ,wherein a distance between a center of the mark and the defective portion is less than or equal to 5 mm in a longitudinal direction of the anisotropic conductive film.5. The anisotropic conductive film according to ...

DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE

A display device includes a display module and a circuit board. The display module includes a base substrate, which includes a display area and a non-display area adjacent to the display area, and a first pad positioned on the base substrate and overlapping the non-display area. The circuit board includes a first board and a second pad positioned on the first board and contacting the first pad, wherein the second pad is provided with a first metal layer of a single material. 1. A display device comprising:a display module comprising a base substrate, the base substrate having a display area and a non-display area adjacent to the display area, and a first pad on the base substrate and overlapping the non-display area; anda circuit board comprising a first board and a second pad on the first board and contacting the first pad,wherein the second pad is provided with a first metal layer composed of a single material.2. The display device of claim 1 , wherein the first pad comprises:a first sub metal layer on the base substrate;a second sub metal layer on the first sub metal layer; anda third sub metal layer on the second sub metal layer and contacting the second pad.3. The display device of claim 2 , wherein at least a portion of the second sub metal layer contacts the second pad.4. The display device of claim 2 , wherein a thickness of the second sub metal layer is larger than that of each of the first sub metal layer and the third sub metal layer.5. The display device of claim 2 , wherein the first sub metal layer and the third sub metal layer are composed of the same material.6. The display device of claim 2 , wherein the first sub metal layer and the third sub metal layer are composed of titanium claim 2 , and the second sub metal layer is composed of aluminum.7. The display device of claim 6 , wherein the first metal layer is composed of copper.8. The display device of claim 1 , further comprising:a resin between the base substrate and the first board, the resin ...

Electrically conductive adhesives comprising silver-coated particles

The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesive of the present invention comprises one or more epoxy resins, silver-coated particles having a silver content of 2 to 30 wt.-%, based on the total amount of the silver-coated particles, and one or more amine-epoxy adducts, comprising one or more functional groups, each derived from an alkyl-substituted nitrogen-containing heterocycle.

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

An anisotropic conductive film 1A includes a conductive particle array layer 4 in which a plurality of conductive particles 2 are arrayed in a prescribed manner and held in an insulating resin layer The anisotropic conductive film 1A has a direction in which a thick distribution, around the individual conductive particle, of the insulating resin layer 3 holding the array of the conductive particles 2 is asymmetric with respect to the conductive particle 2. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film 1A, short circuits and conductive failure can be reduced. 1. An anisotropic conductive film comprising:a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer,wherein the anisotropic conductive film has a resin amount distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles, and the resin amount distribution has a direction in which a resin amount decreases.2. The anisotropic conductive film according to claim 1 , wherein claim 1 , in a film surface direction claim 1 , the resin amount distribution claim 1 , around the individual conductive particle claim 1 , of the insulating resin layer holding the array of the conductive particles has a direction in which a resin amount decreases.3. The anisotropic conductive film according to claim 1 , wherein the direction in which the resin amount is less aligned in the same direction in the plurality of conductive particles.4. The anisotropic conductive film according to claim 1 , wherein in a cross section of the anisotropic conductive film when the anisotropic conductive film is cut in the direction in which the resin amount decreases claim 1 , the direction passing through a center of the ...

ELECTRODE STRUCTURE OF BIO-SIGNAL MEASUREMENT AND ELECTRODE SYSTEM

An electrode structure of a bio-signal measurement comprises electrodes adapted to be adhered on skin with an adhesive and separated from each other. A connector arrangement for an electric contact with an external electric device is on an opposite side of the electrode structure. Electric conductors are electrically connected with the electrodes and the connector arrangement. The electrode structure comprises attachable sections directly adjacent to one of the at least two electrodes, the attachable sections being adapted to be adhered on the skin. The electrode structure comprises a flexible and elastic loose section, which is free from an adherence to the skin, each of the attachable sections being located between an electrode and a loose section. 1. An electrode structure of a bio-signal measurement , wherein the electrode structure comprisesat least two electrodes, are adapted to be adhered on the skin of a mammal with an adhesive, are separated from each other in a longitudinal direction of the electrode structure;a connector arrangement for an electric contact with an external electric device on an opposite side of the electrode structure in a transverse direction of the electrode structure;electric conductors, which are electrically connected with the at least two electrodes and the connector arrangement;the electrode structure comprises at least one attachable section directly adjacent to one of the at least two electrodes, each of the at least one attachable section being adapted to be adhered on the skin;the electrode structure comprises at least one loose section configured to be flexible, elastic, and free from an adherence to the skin when the electrode structure is applied on the skin, each of the at least one attachable section being located between one of the at least one electrode and one of the at least one loose section.2. The electrode structure of claim 1 , wherein the electrode structure comprises the at least one loose section between the ...

Miniature High Density Opto-Electronic Package

A method comprising coupling a circuit to an opto-electronic package via an anisotropic conductive film (ACF), wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 gigahertz (GHz) to about 40 GHz. An apparatus comprising, an opto-electronic package comprising a plurality of first electrodes, and a circuit comprising a plurality of second electrodes, wherein at least one of the first electrodes is coupled to at least one of the second electrodes via an ACF, and wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 GHz to about 40 GHz. 1. A method comprising:coupling a circuit to an opto-electronic package via an anisotropic conductive film (ACF),wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 gigahertz (GHz) to about 40 GHz.2. The method of claim 1 , wherein the opto-electronic package comprises a receiver optical sub-assembly (ROSA).3. The method of claim 1 , wherein the opto-electronic package comprises a transmitter optical sub-assembly (TOSA).4. The method of claim 1 , wherein the opto-electronic package comprises a pin pitch of about 10 micrometers (microns) to about 250 microns.5. The method of claim 1 , wherein the electrical signals comprise maximum bandwidth of about 25 gigabits per second (Gbps) to about 100 Gbps.6. The method of claim 1 , wherein coupling further comprises:positioning the ACF on at least one electrode of the circuit;tacking the ACF to at least one electrode of the opto-electronic package;aligning the opto-electronic package electrode and the circuit electrode; andcuring the ACF.7. The method of claim 1 , wherein coupling further comprises:positioning the ACF on at least one electrode of the opto-electronic package;tacking the ACF to at least one electrode of the circuit;aligning the opto- ...

DISPLAY DEVICE

Terminal portions are arrayed at regular widths and regular intervals, and each face any enable terminal, and are electrically connected to the enable terminals by conductive particles. A lead portion is connected to the other terminal portion except for a pair of terminal portions which is a pair of terminal portions adjacent to each other, and extends from an overlap region to a lead region. A connection portion connects the respective terminal portions that are not connected with the lead portion to the adjacent terminal portions that are connected to the lead portion within an area of the overlap region. An interval between a pair of lead portions extending from a pair of connection portions located to sandwich a pair of terminal portions that are not connected with the lead portion therebetween is larger than an interval between the other adjacent lead portions. 1. A display device , comprising:a display panel having a plurality of terminals;a flexible wiring board having a plurality of wiring patterns, an overlap region which overlaps with the display panel, and a lead region adjacent to the overlap region; andan anisotropic conductive material that joins the display panel and the overlap region, whereineach of the wiring patterns of the flexible wiring board has a terminal portion which is electrically connected to corresponding one of the terminals of the display panel through the anisotropic conductive material in the overlap region,the terminal portion of some of the wiring patterns branches into a plurality of portions in the overlap region,the terminal portion of the wiring patterns is of various types including a first terminal portion having two branches, a second terminal portion having three or more branches, and a third terminal portion having no branch, andthe wiring patterns are substantially equal to each other in a width of the terminal portion in the overlap region.2. The display device according to claim 1 ,wherein the terminal portion of the ...

Attachment Apparatus and Attachment Method for Conductive Adhesive

Embodiments of the present invention provide an attachment apparatus and an attachment method for a conductive adhesive. The attachment apparatus includes: a carrier stage, which is provided with at least one working surface, the working surface being configured to support a printed circuit board and provided with a groove, and the groove being provided with a plurality of adsorption holes on its bottom surface; a vacuum adsorption device being connected to each of the plurality of adsorption holes; and an attaching mechanism provided above the carrier stage, and configured to attach the conductive adhesive to a predetermined region of the printed circuit board, and the predetermined region being a region of the printed circuit board to be squeeze connected to a flexible printed circuit board or a chip on film. 118-. (canceled)19. An attachment method for a conductive adhesive , comprising steps of:attaching the conductive adhesive to one of electrode regions at two opposite ends of a flexible printed circuit board or a chip on film;attaching the conductive adhesive to a predetermined region of a printed circuit board, wherein the predetermined region is a region of the printed circuit board to be squeeze connected to the flexible printed circuit board or the chip on film;squeeze connecting the electrode region of the flexible printed circuit board or the chip on film that is attached with the conductive adhesive to a glass substrate; andsqueeze connecting the electrode region of the flexible printed circuit board or the chip on film that is not attached with the conductive adhesive to the region of the printed circuit board that is attached with the conductive adhesive.20. The attachment method according to claim 19 , whereinthe electrode region of the flexible printed circuit board or the chip on film that is attached with the conductive adhesive is squeeze connected to the glass substrate by using a high temperature squeeze connector; andthe electrode region of ...

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

An anisotropic conductive film has an insulating binder layer, conductive particles arranged in a regular pattern on a surface of the insulating binder layer, and an insulating adhesion layer layered on the surface of the insulating binder layer. In the insulating binder layer of the anisotropic conductive film, insulating fillers are arranged in a regular pattern so as not to be overlapped with the conductive particles. This anisotropic conductive film is produced by arranging the conductive particles and the insulating fillers in regular patterns using a transfer mold having openings. The anisotropic conductive film can suppress linking of the conductive particles during anisotropic conductive connection without an increase in connection resistance, to largely suppress occurrence of short circuit. 1. An anisotropic conductive film comprising: an insulating binder layer; conductive particles arranged in a regular pattern on a surface of the insulating binder layer; and an insulating adhesion layer layered on the surface of the insulating binder layer , whereinin the insulating binder layer, insulating fillers are arranged in a regular pattern so as not to be overlapped with the conductive particles.2. The anisotropic conductive film according to claim 1 , wherein the conductive particles and the insulating fillers are locally located on the surface of the insulating binder layer.3. The anisotropic conductive film according to claim 1 , wherein the insulating fillers have an average particle diameter of 75% or less of that of the conductive particles.4. The anisotropic conductive film according to claim 1 , wherein the insulating fillers are softer than the conductive particles.5. The anisotropic conductive film according to claim 1 , wherein the insulating fillers are harder than the conductive particles claim 1 , and the insulating fillers have an average particle diameter smaller than that of the conductive particles.6. The anisotropic conductive film according ...

Semiconductor unit, method of manufacturing the same, and electronic apparatus

There are provided a semiconductor unit that prevents connection failure caused by a wiring substrate to improve reliability, a method of manufacturing the semiconductor unit, and an electronic apparatus including the semiconductor unit. The semiconductor unit includes: a device substrate including a functional device and an electrode; a first wiring substrate electrically connected to the functional device through the electrode; and a second wiring substrate electrically connected to the functional device through the first wiring substrate.

SYSTEMS AND METHODS FOR DETERMINING THE SUITABILITY OF RF SOURCES IN ULTRAVIOLET SYSTEMS

A UV system for irradiating a substrate includes a RF source capable of generating RF energy, a UV lamp capable of emitting UV energy when excited by the RF energy generated by the RF source, and a monitor coupled to the RF source. The monitor includes data relating to the RF source. The UV system further includes a controller capable of communication with the monitor, and the controller determines if the RF source is suitable for operation with the UV system based on the data of the monitor and/or the end of its useful life. 1. A UV system for irradiating a substrate , the system comprising:a RF source configured to generate RF energy;a UV lamp configured to emit UV energy when excited by the RF energy generated by said RF source;a monitor coupled to said RF source, said monitor configured to generate data relating to said RF source; anda controller configured to receive said data from said monitor, and determine whether said RF source is suitable for operation with said UV system based on said data.2. The system of claim 1 , wherein said data includes an identification code specific to said RF source claim 1 , and said controller is configured to determine whether said RF source is suitable for operation with said UV system by determining if said RF source is compatible with said UV system based on said identification code included in said data.3. The system of claim 2 , further comprising a connector coupling said monitor to said RF source such that said connector is not removable without damaging said connector and/or said monitor.4. The system of claim 3 , wherein said RF source is a magnetron which includes a cooling fin claim 3 , and said monitor is coupled to said fin by said connector.5. The system of claim 3 , wherein said RF source includes a frame claim 3 , and said monitor is coupled to said frame of said RF source by said connector.6. A UV system for irradiating a substrate claim 3 , the system comprising:a RF source configured to generate RF energy;a ...

Electronic device and display device comprising the same

A display device is provided and includes: a display panel; and a circuit board electrically connected to the display panel and including: a substrate; a first conductive layer disposed on the substrate and including a first connecting pad and a second connecting pad; a second conductive layer disposed on and electrically connected to the second connecting pad; a first electronic component disposed on and electrically connected to the first connecting pad; and a second electronic component disposed on the second conductive layer and electrically connected to the second connecting pad through the second conductive layer. The first connecting pad has a first thickness. A total thickness of the second connecting pad and the second conductive layer is a second thickness. The second thickness is greater than the first thickness. A ratio of the second thickness to the first thickness ranges from 1.2 to 5000.

Coupling conductive terminal structure and display device

A coupling conductive terminal structure is provided. The coupling conductive terminal structure is disposed between a display device and an IC or an FPC, and includes a first linking part and a second linking part matched with the first linking part. The first linking part is disposed on the display device, the second linking part is disposed on the IC or the FPC, the first linking part and the second linking part are locked with each other, and the display device electrically connects to the IC or the FPC. The disclosure further provides a display device. By practice of the disclosure, the bonding shift could be overcome to solve the problem of short circuit or poor contact, so the product yield could be improved.

HIGH WATTAGE SOLDERLESS FLEXIBLE CONNECTOR FOR PRINTED CONDUCTORS

An adhesive connector for making an electrical connection to a conductor formed on a support surface is provided. The adhesive connector includes a substrate and a metal strip attached to a first surface of the substrate, wherein the metal strip is configured to engage a releasable electrical connector. The adhesive connector also includes a conductive strip attached to a second surface of the substrate and a conductive staple configured to secure the conductive strip, the substrate, and the metal strip together. The adhesive connector further includes an electrically-conducting adhesive that coats a first portion of the conductive strip, and is configured to provide electrical contact to a conductor formed on a support surface. 1. An adhesive connector for making an electrical connection to a conductor formed on a support surface , the adhesive connector comprising:a substrate;a metal strip attached to a first surface of the substrate, wherein the metal strip is configured to engage a releasable electrical connector;a conductive strip attached to a second surface of the substrate;a conductive staple configured to secure the conductive strip, the substrate, and the metal strip together; andan electrically-conducting adhesive that coats a first portion of the conductive strip, and is configured to provide electrical contact to a conductor formed on a support surface.2. The adhesive connector of claim 1 , wherein the substrate is constructed using a flexible polymer.3. The adhesive connector of claim 1 , wherein the metal strip further comprises:a first portion that is configured to attach to, and lie coplanar with, the first surface of the substrate, anda second portion that is canted away from first surface of the substrate, and configured to engage the releasable electrical connector.4. The adhesive connector of claim 1 , wherein the conductive strip is constructed using laminated foil or printed conductive ink.5. The adhesive connector of claim 1 , wherein a width ...

SOLDERLESS BGA INTERCONNECT

Embodiments disclosed herein include electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first substrate and a plurality of first conductive pads on the first substrate. In an embodiment, the electronics package further comprises a second substrate and a plurality of second conductive pads on the second substrate. In an embodiment, the electronics package further comprises a plurality of interconnects between the first and second substrate. In an embodiment, each interconnect electrically couples one of the first conductive pads to one of the second conductive pads. In an embodiment, the interconnects comprise strands of conductive material. 1. An electronics package , comprising:a first substrate;a plurality of first conductive pads on the first substrate;a second substrate;a plurality of second conductive pads on the second substrate; anda plurality of interconnects between the first and second substrate, wherein each interconnect electrically couples one of the first conductive pads to one of the second conductive pads, and wherein the interconnects comprise strands of conductive material.2. The electronics package of claim 1 , wherein the strands of conductive material comprise copper.3. The electronics package of claim 2 , wherein the strands of conductive material further comprise gold plating around the copper.4. The electronics package of claim 1 , wherein the strands of conductive material are wound to form a stranded mesh having a bulk shape.5. The electronics package of claim 4 , wherein the bulk shape is cylindrical.6. The electronics package of claim 4 , wherein the bulk shape is cylindrical with a convex end surface.7. The electronics package of claim 6 , wherein the bulk shape is cylindrical with a first convex end surface and a second convex end surface.8. The electronics package of claim 4 , wherein the bulk shape comprises a concave end surface.9. The electronics package of claim 1 , ...

Aluminum Cable Provided with Crimping Terminal

A crimping portion includes a first crimping portion including a conductor crimping portion and a conductor enveloping portion that is integrally connected to the conductor crimping portion and envelops a portion of a conductor in the vicinity of an insulating covering portion, and a second crimping portion that is separate from the first crimping portion and crimped to the insulating covering portion in the vicinity of the conductor. A gap between the first crimping portion and the second crimping portion is sealed with a sealer, and thus the first crimping portion and the second crimping portion are integrally interconnected to each other. 1. An aluminum cable with crimping terminal comprising:an aluminum cable including a conductor formed of aluminum or aluminum alloy and an insulating covering portion that envelops an outer periphery of the conductor, and a crimping terminal including a crimping portion that is crimped to the aluminum cable and electrically connected to the aluminum cable, whereinthe crimping portion includes a first crimping portion including a conductor crimping portion that is crimped to the conductor exposed by removing the insulating covering portion on the terminal portion of the aluminum cable, and a conductor enveloping portion that is integrally connected to the conductor crimping portion along an extending direction of the aluminum cable, and deformed when being crimped to the aluminum cable in substantially the same shape as a case of being crimped to the insulating covering portion so as to envelop a portion of the conductor in a vicinity of the insulating covering portion, anda second crimping portion that is formed of a tubular metallic member separate from the first crimping portion, and crimped to an outer peripheral surface of the insulating covering portion in a vicinity of the conductor of the aluminum cable that is inserted into the tube, and whereinthe first crimping portion and the second crimping portion are integrally ...

FUNCTION PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

A function panel, a manufacturing method thereof and a display device are provided. The function panel is in the display device, and includes: a base substrate, a plurality of conductive structures and a plurality of bonding structures on the base substrate, the plurality of conductive structures being connected with the plurality of bonding structures in one-to-one correspondence; and a core obstructing structure being provided on each of the bonding structures for obstructing overflow of conductive particles in an anisotropic conductive film. By providing the core obstructing structure on the bonding structure, the core obstructing structure can obstruct overflow of the conductive particles in the anisotropic conductive film. After the display device is formed, an overall width of the frame of the display device can be reduced effectively. 1. A function panel , comprising:a base substrate;a plurality of conductive structures and a plurality of bonding structures provided on the base substrate, the plurality of conductive structures being connected with the plurality of bonding structures in one-to-one correspondence; anda core obstructing structure provided on each of the bonding structures, which is configured to obstruct overflow of conductive particles in an anisotropic conductive film.2. The function panel according to claim 1 , wherein the core obstructing structure comprises: a plurality of pore-like structures claim 1 , a width of each of the pore-like structures being smaller than a diameter of the conductive particle.3. The function panel according to claim 2 , wherein the width of each of the pore-like structures is equal to one third of the diameter of the conductive particle.4. The function panel according to claim 2 , wherein the pore-like structures are blind holes.5. The function panel according to claim 1 , wherein the core obstructing structure comprises: protruding structures provided at two sides of the bonding structures claim 1 , a height of ...

ELECTRONIC DEVICE

Terminal portions are arrayed at regular widths and regular intervals, and each face any enable terminal, and are electrically connected to the enable terminals by conductive particles. A lead portion is connected to the other terminal portion except for pair of terminal portions which is a pair of terminal portions adjacent to each other, and extends from an overlap region to a lead region. A connection portion connects the respective terminal portions that are not connected with the lead portion to the adjacent terminal portions that are connected to the lead portion within an area of the overlap region. An interval between a pair of lead portions extending from a pair of connection portions located to sandwich a pair of terminal portions that are not connected with the lead portion therebetween is larger than an interval between the other adjacent lead portions. 1. A display device , comprising:a display panel having a plurality of terminals,a flexible wiring board having a plurality of wiring patterns, an overlap region that overlaps with the display panel, and a lead region adjacent to the overlap region,an anisotropic conductive material that joins the display panel and the overlap region, whereinthe wiring patterns of the flexible wiring board have terminal portions that are electrically connected to the respective terminals of the display panel through the anisotropic conductive material in the overlap region, andeach of the terminal portions of the wiring patterns branches into a plurality of divided portions at least in the overlap region.2. The display device according to claim 1 ,wherein the terminal portions of the wiring patterns include a first terminal portion with the divided portions in the overlapping region and a second terminal portion with the divided portions in the lead region.3. The display device according to claim 1 ,wherein each of the terminals of the display panel branches into a plurality of portions in the overlap region.4. The ...

FLEXIBLE DISPLAY DEVICE

A flexible display device is provided. The flexible display device includes a color filter substrate, an array substrate, and a flexible circuit board. One end of the array substrate is provided with a first array-substrate pad, a second array-substrate pad, and a via hole, wherein the first array-substrate pad is electrically connected with the via hole, the second array-substrate pad, and the flexible-circuit-board pad in order. Thus, an edge length of the flexible display device can be further shortened, so as to design the flexible display device to have a narrower frame. 1. A flexible display device , comprising:a color filter substrate;an array substrate attached with the color filter substrate, wherein one end of the array substrate is provided with a first array-substrate pad, a second array-substrate pad, and a via hole; the first array-substrate pad is disposed on a surface of the array substrate facing the color filter substrate, and the first array-substrate pad is attached to the color filter substrate; the second array-substrate pad is disposed on another surface of the array substrate; and the via hole is formed in the array substrate and passes through the array substrate so as to connect the first array-substrate pad to the second array-substrate pad; anda flexible circuit board having a flexible-circuit-board pad at one end thereof, wherein the flexible-circuit-board pad is electrically connected with the second array-substrate pad, and one end of the flexible circuit board is attached to the array substrate, so that the first array-substrate pad is electrically connected with the via hole, the second array-substrate pad, and the flexible-circuit-board pad in order.2. The flexible display device according to claim 1 , wherein the flexible-circuit-board pad is electrically connected with the second array-substrate pad by an attachment method.3. The flexible display device according to claim 2 , wherein the flexible-circuit-board pad is electrically ...

Electrically conductive material

An electrically conductive material includes a liquid gallium alloy mixed with multiple solid particles, so as to form an electrically conductive material in which solid and liquid coexist. The electrically conductive material is disposed between and electrically connecting a first conductor and a second conductor. The first conductor is disposed on a first electronic element, and the second conductor is disposed on a second electronic element.

Electronic Device Display with a Backlight

An electronic device may include display layers such as liquid crystal display layers and a backlight unit that provides illumination for the display layers. The backlight unit may include light-emitting diodes that emit light into the edge of a light guide film. To minimize the inactive area of the display, the light-emitting diodes may be tightly spaced to approximate a line light source instead of point light sources. Color and/or luminance compensation layers may be incorporated at various locations within the backlight structures to ensure that the backlight provided to the display layers is homogenous. A thin-film transistor layer of the display may be coupled to a printed circuit board by a flexible printed circuit. The flexible printed circuit may have additional solder mask layers to improve robustness, may include encapsulation, and may have traces with a varying pitch. 1. An electronic device comprising:display layers that include a thin-film transistor layer;a printed circuit board;a flexible printed circuit coupled between the thin-film transistor layer and the printed circuit board, wherein the flexible printed circuit has traces that are electrically connected to the thin-film transistor layer and wherein the traces have a varying pitch across the flexible printed circuit; anda display driver integrated circuit mounted on the flexible printed circuit.2. The electronic device defined in claim 1 , wherein the pitch of the traces is at a minimum at a center of the flexible printed circuit and wherein the pitch of the traces is at a maximum at an edge of the flexible printed circuit.3. The electronic device defined in claim 1 , wherein the pitch of the traces follows a profile that increases with a distance from a center of the flexible printed circuit.4. The electronic device defined in claim 3 , wherein the profile increases according to a step function.5. The electronic device defined in claim 1 , further comprising:a stainless steel stiffener attached ...

Electronic Device Display with a Backlight

An electronic device may include display layers such as liquid crystal display layers and a backlight unit that provides illumination for the display layers. The backlight unit may include light-emitting diodes that emit light into the edge of a light guide film. To minimize the inactive area of the display, the light-emitting diodes may be tightly spaced to approximate a line light source instead of point light sources. Color and/or luminance compensation layers may be incorporated at various locations within the backlight structures to ensure that the backlight provided to the display layers is homogenous. A thin-film transistor layer of the display may be coupled to a printed circuit board by a flexible printed circuit. The flexible printed circuit may have additional solder mask layers to improve robustness, may include encapsulation, and may have traces with a varying pitch.

Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connector

An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.

ELECTRICALLY CONNECTING STRUCTURE, GLASS PLATE WITH TERMINAL HAVING THE SAME, AND METHOD OF MANUFACTURING GLASS PLATE WITH TERMINAL

An electrically connecting structure includes a glass plate, a feeding part formed on the glass plate, a terminal having a base part opposing the glass plate, an adhesive adhering the glass plate and the terminal, and a conductive rubber arranged between the feeding part and the base part. The adhesive is a thermosetting adhesive that once softens when heated and thereafter cures, and is arranged to surround a periphery of the conductive rubber. The feeding part and the base part have electrical continuity via the conductive rubber. 1. An electrically connecting structure comprising:a glass plate;a feeding part formed on the glass plate;a terminal having a base part opposing the glass plate;an adhesive adhering the glass plate and the terminal; anda conductive rubber arranged between the feeding part and the base part,wherein the adhesive is a thermosetting adhesive that once softens when heated and thereafter cures, and is positioned at least on both sides of the conductive rubber, andwherein the feeding part and the base part have electrical continuity via the conductive rubber.2. The electrically connecting structure as claimed in claim 1 , wherein the adhesive is positioned to surround a periphery of the conductive rubber.3. The electrically connecting structure as claimed in claim 1 , wherein the adhesive is compressed and cured in a state before the glass plate and the terminal are bonded claim 1 , so that the conductive rubber is maintained in a compressed state.4. The electrically connecting structure as claimed in claim 1 , wherein the adhesive heated from a state before bonding the glass plate and the terminal has properties such that a viscosity of the adhesive is 6.0×10Pa·s or less at a temperature of 70° C. or higher and lower than 120° C. claim 1 , and cures at a temperature of 120° C. or higher.5. The electrically connecting structure as claimed in claim 1 , wherein the conductive rubber has a resistance that varies depending on a compressibility ...

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

A display module and a manufacturing method of a display module are disclosed. The manufacturing method includes: forming a metal layer in the vias and on the array substrate thereby to cause the metal layer in the vias to form connecting terminals; providing a pattern treatment for the metal layer on the array substrate to form a plurality of metal wires and the metal wires disposed correspondingly to the vias; and cutting off a part of the array substrate disposed at an outer side of the vias to expose the connecting terminals at a sidewall of a remaining part of the array substrate. 1. A manufacturing method of a display module , comprising:providing a display panel, comprising:providing an array substrate provided with a display region and a solder region;forming a plurality of vias on the array substrate and in the solder region;forming a metal layer in the vias and on the array substrate thereby causing the metal layer in the vias to form connecting terminals;providing a pattern treatment for the metal layer on the array substrate to form a plurality of metal wires, wherein the metal wires are correspondingly disposed to the vias;cutting off a part of the array substrate disposed at an outer side of the vias to expose the connecting terminals at a sidewall of a remaining part of the array substrate, wherein the outer side of the vias is a side away from the metal wires; andconnecting electrically the connecting terminals to a flexible printed circuit to form a binding area at the sidewall of the array substrate.2. The manufacturing method of a display module according to claim 1 , wherein the step of cutting off a part of the array substrate disposed at an outer side of the vias to expose the connecting terminals at a sidewall of a remaining part of the array substrate comprises:cutting off the array substrate along a line interconnecting geometric centers of the plurality of vias.3. The manufacturing method of a display module according to claim 1 , wherein a ...

System and method for stripline electrodes for thin-film characterization

Systems and methods provide a device for characterizing a thin film, including a conducting or insulating substrate, an active layer on the conducting or insulating substrate to be characterized, and a plurality of stripline electrodes on the active layer. The plurality of stripline electrodes include a pitch width of a same order as the thickness of the active layer and strip width smaller than the thickness of the active layer.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

A method of manufacturing a semiconductor device may include forming an adhesive film on a surface of a semiconductor chip, mounting the semiconductor chip on a substrate such that the adhesive film contacts an upper surface of the substrate, and bonding the semiconductor chip and the substrate curing the adhesive film by simultaneously performing a thermo-compression process and an ultraviolet irradiation process on the adhesive film disposed between the substrate and the semiconductor chip. 1. A method of manufacturing a semiconductor device , the method comprising:forming an adhesive film on a surface of a semiconductor chip;mounting the semiconductor chip on a substrate such that the adhesive film contacts an upper surface of the substrate; andbonding the semiconductor chip and the substrate by curing the adhesive film by simultaneously performing a thermo-compression process and an ultraviolet irradiation process on the adhesive film disposed between the substrate and the semiconductor chip.2. The method of claim 1 , wherein the semiconductor chip has a polygonal shape in a plan view claim 1 ,wherein the ultraviolet irradiation process is performed by irradiating the adhesive film with ultraviolet light from at least one side of the polygonal shape of the semiconductor chip, andwherein the ultraviolet light does not irradiate the adhesive film in vicinities of vertices of the polygonal shape of the semiconductor chip.3. The method of claim 2 , wherein the ultraviolet irradiation process is performed by irradiating the adhesive film with ultraviolet light from all sides of the polygonal shape of the semiconductor chip.4. The method of claim 2 , wherein the ultraviolet irradiation process is performed at an angle of about 00 to about 90° with respect to the upper surface of the substrate.5. The method of claim 1 , wherein the ultraviolet irradiation process is performed at a light quantity of about 5 claim 1 ,000 mJ/cm2 or less.6. The method of claim 1 , wherein ...

Electrical connector

An electrical connector includes a first terminal group, an insulation body, a conductive glue, and an insulation casing. The first terminal group includes grounding terminals and signal terminals. Each of the terminals in the first terminal group has a main portion. The insulation body is fixed to the main portion of each terminal of the first terminal group. The insulation body has openings exposing corresponding grounding terminals. The conductive glue fills the openings of the insulation body, and the conductive glue electrically connects the grounding terminals. The insulation casing includes a first side wall which includes first terminal slots. The first terminal group is disposed in the first terminal slots of the first side wall, and the conductive glue is sandwiched between the first side wall and the insulation body.

CONNECTION METHOD FOR TERMINAL FITTING AND CONNECTION STRUCTURE OF TERMINAL FITTING

A connection method for a terminal fitting, in which the terminal fitting includes a terminal body and a plurality of terminal connection portions extending from the terminal body, and a pair of fastening caulking pieces of each of connection terminals connected to end portions of electric wires are caulked and connected to a pair of fastened caulking pieces formed in a corresponding one of the terminal connection portions, the connection method includes folding open end portions of the fastened caulking pieces inward respectively to form folded portions and a space between the folded portions so that open end portions of the pair of fastening caulking portions enter the space, and crushing the pair of the fastening caulking pieces to caulk the pair of the fastened caulking pieces so that the open end portions of the pair of the fastening caulking pieces enter the space. 1. A connection method for a terminal fitting , in which the terminal fitting includes a terminal body and a plurality of terminal connection portions extending from the terminal body , and a pair of fastening caulking pieces of each of connection terminals connected to end portions of electric wires are caulked and connected to a pair of fastened caulking pieces formed in a corresponding one of the terminal connection portions , the connection method comprising:folding open end portions of the fastened caulking pieces inward respectively to form folded portions and a space between the folded portions so that open end portions of the pair of fastening caulking portions enter the space; andcrushing the pair of the fastening caulking pieces to caulk the pair of the fastened caulking pieces so that the open end portions of the pair of the fastening caulking pieces enter the space.2. The connection method for the terminal fitting according to claim 1 , further comprising:forming a retention space in each of the connection terminals by the fastening caulking pieces so that the fastened caulking pieces ...

CONNECTION STRUCTURE AND CONNECTION METHOD FOR TERMINAL FITTING

A connection structure of a terminal fitting includes the terminal fitting including a terminal body, and a plurality of terminal connection portions extending from the terminal body and connection terminals connected to end portions of electric wires. Each of the connection terminals includes a pair of fastening caulking pieces which erects on opposite side portions of a terminal bottom portion. The pair of the fastening caulking pieces are caulked with opposite side portions of a corresponding one of the terminal connection portions from outside so that the connection terminal is caulked and fastened to the terminal fitting. Concave-convex engagement portions are provided in opposed surfaces in which the terminal connection portion and the terminal bottom portion abut against each other. The terminal fitting is connected to the electric wires through the connection terminals. 1. A connection structure of a terminal fitting comprising:the terminal fitting including a terminal body, and a plurality of terminal connection portions extending from the terminal body; andconnection terminals connected to end portions of electric wires,wherein each of the connection terminals includes a pair of fastening caulking pieces which erects on opposite side portions of a terminal bottom portion,wherein the pair of the fastening caulking pieces are caulked with opposite side portions of a corresponding one of the terminal connection portions from outside so that the connection terminal is caulked and fastened to the terminal fitting,wherein concave-convex engagement portions are provided in opposed surfaces in which the terminal connection portion and the terminal bottom portion abut against each other, andwherein the terminal fitting is connected to the electric wires through the connection terminals.2. The connection structure of the terminal fitting according to claim 1 ,wherein each of the concave-convex engagement portions includes concave grooves extending in a width ...

MANUFACTURING METHOD OF FLEXIBLE DISPLAY APPARATUS

A manufacturing method of a flexible display apparatus is provided. A flexible display panel is formed on the substrate. The flexible display panel has a display area and a bonding area located outside the display area. A driving chip is bonded on the bonding area of the flexible display panel via at least one flexible circuit board. A hot-melt protective layer is formed on the display area and the bonding area of the flexible display panel and a portion of the flexible circuit board. A heating step is performed to soften the hot-melt protective layer. The flexible display panel is separated from the substrate. 1. A manufacturing method of a flexible display apparatus , comprising:providing a substrate;forming a flexible display panel on the substrate, wherein the flexible display panel has a display area and a bonding area located outside the display area;bonding a driving chip on the bonding area of the flexible display panel via at least one flexible circuit board;forming a hot-melt protective layer on the display area and the bonding area of the flexible display panel and a portion of the flexible circuit board;performing a heating step to soften the hot-melt protective layer; andseparating the flexible display panel from the substrate.2. The manufacturing method of the flexible display apparatus as recited in claim 1 , wherein the step of forming the flexible display panel on the substrate comprises:forming an adhesive layer on the substrate; andforming the flexible display panel on the substrate, wherein the flexible display panel is adhered to the substrate via the adhesive layer.3. The manufacturing method of the flexible display apparatus as recited in claim 1 , wherein the driving chip is disposed on the flexible circuit board claim 1 , and a location of the driving chip does not overlap with a location of the flexible display panel.4. The manufacturing method of the flexible display apparatus as recited in claim 1 , wherein the flexible circuit board is ...

DISPLAY DEVICE CAPABLE OF ASSEMBLY WITH EASE AND RELIABILITY

A display device may include a first base substrate including a first planar surface and a first side surface, which is connected to the first planar surface and extends in a first direction when viewed in a sectional view, a second base substrate including a second planar surface, which is disposed to face the first planar surface in the first direction, and a second side surface, which is connected to the second planar surface and extends in a second direction crossing the first direction when viewed in a sectional view, a pixel disposed between the first and second base substrates, a signal line disposed on the first base substrate and connected to the pixel, a pad electrode disposed on the second side surface and connected to the signal line, and an electronic circuit connected to the pad electrode. 1. A display device , comprising:a first base substrate including a first planar surface and a first side surface, which is connected to the first planar surface and extends in a first direction when viewed in a sectional view;a second base substrate including a second planar surface, which is disposed to face the first planar surface in the first direction, and a second side surface, which is connected to the second planar surface and extends in a second direction crossing the first direction when viewed in a sectional view;a pixel disposed between the first base substrate and the second base substrate;a signal line disposed on the first base substrate and connected to the pixel;a pad electrode disposed on the second side surface and connected to the signal line; andan electronic circuit connected to the pad electrode.2. The display device of claim 1 , wherein the electronic circuit comprises a chip mounted on the second side surface.3. The display device of claim 1 , wherein the electronic circuit comprises:a circuit film attached to the first side surface; anda chip mounted on the circuit film.4. The display device of claim 3 , wherein the circuit film is extended ...