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10-02-2001 дата публикации

СТУДИЙНЫЙ КОНДЕНСАТОРНЫЙ МИКРОФОН

Номер: RU0000016813U1
Автор: Кузьменко В.В., Селезнев В.В., Телков А.А., Ульянов Г.И.
Принадлежит: Открытое акционерное общество "Октава"

1. Студийный конденсаторный микрофон, состоящий из корпуса, в котором размещены неподвижный центральный электрод с рядом сквозных отверстий, две упругие токопроводящие мембраны, расположенные по обеим сторонам от центрального электрода с зазором, образованным диэлектрическими прокладками, и предварительный усилитель, отличающийся тем, что неподвижный центральный электрод выполнен составным из двух частей, расположенных на одной оси, между которыми размещена прокладка для создания зазора. 2. Студийный конденсаторный микрофон по п.1, отличающийся тем, что составные части электрода изготовлены из пластмассы с напылением металла. (19) RU (11) 16 813 (13) U1 (51) МПК H04R 19/04 (2000.01) РОССИЙСКОЕ АГЕНТСТВО ПО ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К СВИДЕТЕЛЬСТВУ (21), (22) Заявка: 2000119512/20 , 01.08.2000 (24) Дата начала отсчета срока действия патента: 01.08.2000 (46) Опубликовано: 10.02.2001 (72) Автор(ы): Телков А.А., Кузьменко В.В., Ульянов Г.И., Селезнев В.В. (73) Патентообладатель(и): Открытое акционерное общество "Октава" U 1 1 6 8 1 3 R U Ñòðàíèöà: 1 U 1 (57) Формула полезной модели 1. Студийный конденсаторный микрофон, состоящий из корпуса, в котором размещены неподвижный центральный электрод с рядом сквозных отверстий, две упругие токопроводящие мембраны, расположенные по обеим сторонам от центрального электрода с зазором, образованным диэлектрическими прокладками, и предварительный усилитель, отличающийся тем, что неподвижный центральный электрод выполнен составным из двух частей, расположенных на одной оси, между которыми размещена прокладка для создания зазора. 2. Студийный конденсаторный микрофон по п.1, отличающийся тем, что составные части электрода изготовлены из пластмассы с напылением металла. 1 6 8 1 3 (54) СТУДИЙНЫЙ КОНДЕНСАТОРНЫЙ МИКРОФОН R U Адрес для переписки: 300000, г.Тула, ул.Каминского 24, ОАО "Октава", техническому директору Кузьменко В.В. (71) Заявитель(и): Открытое акционерное общество "Октава" U 1 U 1 1 6 8 1 3 1 6 ...

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Номер записи: 1
10-02-2001 дата публикации

КОНДЕНСАТОРНЫЙ МИКРОФОН С ИЗМЕНЯЕМОЙ НАПРАВЛЕННОСТЬЮ

Номер: RU0000016814U1
Автор: Кузьменко В.В., Селезнев В.В., Телков А.А., Ульянов Г.И.
Принадлежит: Открытое акционерное общество "Октава"

Конденсаторный микрофон с изменяемой направленностью, имеющий корпус, предварительный усилитель и микрофонную головку, состоящую из неподвижного центрального электрода с отверстиями и упругой токопроводящей мембраны, отличающийся тем, что микрофон выполнен по модульному принципу в виде предварительного микрофонного усилителя и устанавливаемых на него сменных микрофонных головок, имеющих определенную характеристику направленности за счет использования фазосдвигающего устройства, выполненного из спеченных бронзовых шариков. (19) RU (11) 16 814 (13) U1 (51) МПК H04R 19/04 (2000.01) РОССИЙСКОЕ АГЕНТСТВО ПО ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К СВИДЕТЕЛЬСТВУ (21), (22) Заявка: 2000119513/20 , 01.08.2000 (24) Дата начала отсчета срока действия патента: 01.08.2000 (46) Опубликовано: 10.02.2001 (72) Автор(ы): Телков А.А., Кузьменко В.В., Ульянов Г.И., Селезнев В.В. (73) Патентообладатель(и): Открытое акционерное общество "Октава" U 1 1 6 8 1 4 R U Ñòðàíèöà: 1 U 1 (57) Формула полезной модели Конденсаторный микрофон с изменяемой направленностью, имеющий корпус, предварительный усилитель и микрофонную головку, состоящую из неподвижного центрального электрода с отверстиями и упругой токопроводящей мембраны, отличающийся тем, что микрофон выполнен по модульному принципу в виде предварительного микрофонного усилителя и устанавливаемых на него сменных микрофонных головок, имеющих определенную характеристику направленности за счет использования фазосдвигающего устройства, выполненного из спеченных бронзовых шариков. 1 6 8 1 4 (54) КОНДЕНСАТОРНЫЙ МИКРОФОН С ИЗМЕНЯЕМОЙ НАПРАВЛЕННОСТЬЮ R U Адрес для переписки: 300000, г.Тула, ул.Каминского 24, ОАО "Октава", техническому директору В.В.Кузьменко (71) Заявитель(и): Открытое акционерное общество "Октава" U 1 U 1 1 6 8 1 4 1 6 8 1 4 R U R U Ñòðàíèöà: 2 RU 16 814 U1 RU 16 814 U1 RU 16 814 U1 RU 16 814 U1

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Номер записи: 2
27-02-2002 дата публикации

ИНТЕРФЕРЕНЦИОННЫЙ МИКРОФОН

Номер: RU0000021989U1
Автор: Грибачев В.Л., Петровский В.Д.
Принадлежит: Открытое акционерное общество ОКБ "Октава"

1. Интерференционный микрофон, содержащий корпус, с установленным в нем электроакустическим преобразователем и регулируемый по длине интерференционный вход, отличающийся тем, что регулируемый по длине интерференционный вход выполнен телескопическим. 2. Интерференционный микрофон по п.1, отличающийся тем, что регулируемый по длине интерференционный телескопический вход содержит по крайней мере два телескопических звена. (19) RU (11) 21 989 (13) U1 (51) МПК H04R 19/04 (2000.01) РОССИЙСКОЕ АГЕНТСТВО ПО ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К СВИДЕТЕЛЬСТВУ (21), (22) Заявка: 2001118190/20 , 29.06.2001 (24) Дата начала отсчета срока действия патента: 29.06.2001 (71) Заявитель(и): Открытое акционерное общество ОКБ "Октава" Адрес для переписки: 300000, г.Тула, ул. Каминского, 24, ОАО ОКБ "Октава" (73) Патентообладатель(и): Открытое акционерное общество ОКБ "Октава" U 1 2 1 9 8 9 R U Ñòðàíèöà: 1 U 1 (57) Формула полезной модели 1. Интерференционный микрофон, содержащий корпус, с установленным в нем электроакустическим преобразователем и регулируемый по длине интерференционный вход, отличающийся тем, что регулируемый по длине интерференционный вход выполнен телескопическим. 2. Интерференционный микрофон по п.1, отличающийся тем, что регулируемый по длине интерференционный телескопический вход содержит по крайней мере два телескопических звена. 2 1 9 8 9 (54) ИНТЕРФЕРЕНЦИОННЫЙ МИКРОФОН R U (72) Автор(ы): Петровский В.Д., Грибачев В.Л. (46) Опубликовано: 27.02.2002 RU 21 989 U1 RU 21 989 U1 RU 21 989 U1 RU 21 989 U1 RU 21 989 U1 RU 21 989 U1

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Номер записи: 3
27-04-2006 дата публикации

СИСТЕМА ЭЛЕКТРЕТНОГО КОНДЕНСАТОРНОГО МИКРОФОНА

Номер: RU0000053092U1
Автор: Петров Андрей Юрьевич, Сенченок Валентин Михайлович
Принадлежит: Закрытое акционерное общество "АРГУС-СПЕКТР"

1. Система электретного конденсаторного микрофона, включающая электретный конденсаторный микрофон, связанный с источником напряжения питания через нагрузочный резистор, отличающаяся тем, что в ее состав введен импульсный модулятор и устройство выборки и хранения для преобразования импульсного сигнала в непрерывный, при этом выход микрофона соединен с выходом импульсного модулятора через нагрузочный резистор, один из входов устройства выборки и хранения соединен с выходом микрофона, а другой вход соединен с выходом модулятора, а выход устройства выборки и хранения является выходом системы микрофона. 2. Система электретного конденсаторного микрофона по п.1, отличающаяся тем, что в ее состав введен согласующий повторитель, вход которого подключен к выходу устройства выборки и хранения, при этом выход повторителя является выходом системы микрофона. 3. Система электретного конденсаторного микрофона по п.1, отличающаяся тем, что в ее состав введен согласующий усилитель, вход которого подключен к выходу устройства выборки и хранения, при этом выход усилителя является выходом системы микрофона. 4. Система электретного конденсаторного микрофона по любому из пп.1, 2, 3, отличающаяся тем, что она выполнена на одной печатной плате. 5. Система электретного конденсаторного микрофона по любому из пп.1, 2, 3, отличающаяся тем, что она выполнена в виде одной интегральной схемы. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 53 092 (13) U1 (51) МПК H04R 19/04 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2005137552/22 , 29.11.2005 (24) Дата начала отсчета срока действия патента: 29.11.2005 (45) Опубликовано: 27.04.2006 (73) Патентообладатель(и): Закрытое акционерное общество "АРГУС-СПЕКТР" (RU) Ñòðàíèöà: 1 U 1 5 3 0 9 2 R U U 1 Формула полезной модели 1. Система электретного конденсаторного микрофона, включающая электретный конденсаторный микрофон, связанный с источником напряжения питания ...

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Номер записи: 4
10-10-2010 дата публикации

МИКРОФОН

Номер: RU0000098313U1
Автор: Бабкин Виктор Анатольевич, Прибавченкова Людмила Васильевна, Савичев Дмитрий Евгеньевич, Телкова Ольга Владимировна, Трофимова Валентина Александровна
Принадлежит: Открытое Акционерное Общество "Особое конструкторское бюро "Октава" (ОАО "ОКБ "Октава")

Микрофон, содержащий корпус и крышку с акустическим входом, в котором установлены фильтр влаго- и брызгозащиты, жестко соединенные между собой и образующие полость, в которой жестко установлены электретный микрофонный капсюль с предусилителем, усилитель, разъем, жестко установленный в данной части корпуса, электрические соединительные провода, отличающийся тем, что фильтр, герметично установленный на акустическом входе крышки микрофона, выполнен из пленки, выполненной из спеченных шариков фторопласта. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 98 313 (13) U1 (51) МПК H04R 19/04 (2006.01) H05K 5/03 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2010113633/28, 07.04.2010 (24) Дата начала отсчета срока действия патента: 07.04.2010 (45) Опубликовано: 10.10.2010 (73) Патентообладатель(и): Открытое акционерное общество "Особое конструкторское бюро "Октава" (ОАО "ОКБ "Октава") (RU) U 1 9 8 3 1 3 R U Ñòðàíèöà: 1 ru CL U 1 Формула полезной модели Микрофон, содержащий корпус и крышку с акустическим входом, в котором установлены фильтр влаго- и брызгозащиты, жестко соединенные между собой и образующие полость, в которой жестко установлены электретный микрофонный капсюль с предусилителем, усилитель, разъем, жестко установленный в данной части корпуса, электрические соединительные провода, отличающийся тем, что фильтр, герметично установленный на акустическом входе крышки микрофона, выполнен из пленки, выполненной из спеченных шариков фторопласта. 9 8 3 1 3 (54) МИКРОФОН R U Адрес для переписки: 300000, г.Тула, ул. Каминского, 24, ОАО "ОКБ "Октава" (72) Автор(ы): Бабкин Виктор Анатольевич (RU), Прибавченкова Людмила Васильевна (RU), Савичев Дмитрий Евгеньевич (RU), Телкова Ольга Владимировна (RU), Трофимова Валентина Александровна (RU) RU 5 10 15 20 25 30 35 40 45 50 98 313 U1 Заявляемая полезная модель относится к технике электромеханических преобразователей (МПК: класс H04R), а именно ...

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Номер записи: 5
10-09-2013 дата публикации

МИКРОФОННЫЙ ДАТЧИК ДЛЯ СНЯТИЯ АКУСТИЧЕСКИХ КОЛЕБАНИЙ С ПОВЕРХНОСТИ КОНТРОЛИРУЕМОГО ОБЪЕКТА

Номер: RU0000132290U1
Автор: Будков Алексей Ремович, Журавлёв Алексей Викторович, Мальцев Алексей Борисович, Новосельцев Дмитрий Вячеславович, Романов Сергей Иванович, Серебренников Андрей Николаевич, Смолянов Владимир Михайлович
Принадлежит: Общество с ограниченной ответственностью (ООО) "Чистые технологии - СПб"

1. Микрофонный датчик для снятия акустических колебаний с поверхности контролируемого объекта, содержащий электретный конденсаторный микрофон, блок питания и усилитель выходных сигналов, причем микрофон содержит корпус, микрофонный капсюль, в кольцевом пазу которого размещена электретная диафрагма, выполненная из высокополимерной пленки и воздушный канал связи, образованный между торцом корпуса и электретной диафрагмой, отличающийся тем, что в него введена внешняя мембрана, изолирующая канал связи с внешней средой, закрепленная на корпусе микрофона упругим элементом, причем соотношение площадей электретной диафрагмы и внешней мембраны выбраны из условия оптимальной чувствительности микрофона. 2. Микрофонный датчик по п.1, отличающийся тем, что соотношение площадей электретной диафрагмы и внешней мембраны выбирают в пределах диапазона 1:(5-8). 3. Микрофонный датчик по п.1, отличающийся тем, что контакт микрофона с поверхностью контролируемого объекта выполнен в виде полусферы, расположенной в центре внешней мембраны. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (51) МПК H04R 19/00 (13) 132 290 U1 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ 2013117519/28, 16.04.2013 (73) Патентообладатель(и): Общество с ограниченной ответственностью (ООО) "Чистые технологии - СПб" (RU) 16.04.2013 Приоритет(ы): (22) Дата подачи заявки: 16.04.2013 1 3 2 2 9 0 R U Формула полезной модели 1. Микрофонный датчик для снятия акустических колебаний с поверхности контролируемого объекта, содержащий электретный конденсаторный микрофон, блок питания и усилитель выходных сигналов, причем микрофон содержит корпус, микрофонный капсюль, в кольцевом пазу которого размещена электретная диафрагма, выполненная из высокополимерной пленки и воздушный канал связи, образованный между торцом корпуса и электретной диафрагмой, отличающийся тем, что в него введена внешняя мембрана, изолирующая канал связи с внешней средой, закрепленная на корпусе ...

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Номер записи: 6
09-02-2012 дата публикации

Microphone and accelerometer

Номер: US20120033832A1
Автор: Geert Langereis, Martijn Goossens, Twan Van Lippen
Принадлежит: NXP BV

The invention relates to a method for manufacturing a micromachined microphone and an accelerometer from a wafer 1 having a first layer 2 , the method comprising the steps of dividing the first layer 2 into a microphone layer 5 and into an accelerometer layer 6 , covering a front side of the microphone layer 5 and a front side of the accelerometer layer 6 with a continuous second layer 7 , covering the second layer 7 with a third layer 8 , forming a plurality of trenches 9 in the third layer 8 , removing a part 10 of the wafer 1 below a back side of the microphone layer 5 , forming at least two wafer trenches 11 in the wafer 1 below a back side of the accelerometer layer 6 , and removing a part 12, 13 of the second layer 7 through the plurality of trenches 9 formed in the third layer 8 . The micromachined microphone and the accelerometer according to the invention is advantageous over prior art as it allows for body noise cancellation in order to minimize structure borne sound.

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Номер записи: 7
29-03-2012 дата публикации

Phantom Power Circuit

Номер: US20120076325A1
Автор: Hiroshi Akino
Принадлежит: Audio Technica KK

A phantom power circuit has a detection circuit and a limiting circuit, the detection circuit detecting a pulse current generated in association with connection or disconnection of a condenser microphone, the limiting circuit limiting the output of the condenser microphone. The detection circuit detects a pulse current generated between input terminals of the condenser microphone. The limiting circuit reduces the output from the condenser microphone when the detection circuit detects the pulse current.

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Номер записи: 8
19-04-2012 дата публикации

Semiconductor component having a micromechanical microphone structure

Номер: US20120091545A1
Автор: Arnim Hoechst, Frank Reichenbach, Thomas Buck
Принадлежит: ROBERT BOSCH GMBH

A simple and cost-effective form of implementing a semiconductor component having a micromechanical microphone structure, including an acoustically active diaphragm as a deflectable electrode of a microphone capacitor, a stationary, acoustically permeable counterelement as a counter electrode of the microphone capacitor, and means for applying a charging voltage between the deflectable electrode and the counter electrode of the microphone capacitor. In order to not impair the functionality of this semiconductor component, even during overload situations in which contact occurs between the diaphragm and the counter electrode, the deflectable electrode and the counter electrode of the microphone capacitor are counter-doped, at least in places, so that they form a diode in the event of contact. In addition, the polarity of the charging voltage between the deflectable electrode and the counter electrode is such that the diode is switched in the blocking direction.

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Номер записи: 9
07-06-2012 дата публикации

Mems microphone

Номер: US20120139066A1
Автор: Chang Han Je, Jaewoo Lee, Jongdae Kim, Woo Seok Yang
Принадлежит: Electronics and Telecommunications Research Institute ETRI

Disclosed is a micro electro mechanical system (MEMS) microphone including: a substrate; an acoustic chamber formed by processing the substrate; a lower electrode formed on the acoustic chamber and fixed to the substrate; a diaphragm formed over the lower electrode so as to be spaced apart from the lower electrode by a predetermined interval; and a diaphragm discharge hole formed at a central portion of the diaphragm. According to an exemplary embodiment of the present disclosure, attenuation generated by an air layer between the diaphragm and the lower electrode in a MEMS microphone may be effectively reduced, thereby making it possible to obtain high sensitivity characteristics and reduce a time and a cost required for removing a sacrificial layer between the diaphragm and the lower electrode.

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Номер записи: 10
14-06-2012 дата публикации

Electrostatic Loudspeaker System

Номер: US20120148074A1
Автор: Gaston Bastiaens, Ronald Buining
Принадлежит: Individual

An electrostatic loudspeaker (ESL) system includes a damping screen adjacent an outside surface of at least one of its stators to reduce distortion of acoustic output rendered by the loudspeaker's diaphragm, including effects of resonance of the diaphragm. A resilient excursion limiter placed adjacent an inside surface of at least one of the stators prevents contact of the diaphragm with the stator. A conductive portion of the diaphragm is printed with a conductive ink layer that includes conductive nanofibers. The loudspeaker system includes a dipole-radiating ESL element, an unbaffled or partially baffled dynamic loudspeaker and a baffled monopole-radiating dynamic loudspeaker (subwoofer), all essentially co-planar. The unbaffled or partially baffled dynamic loudspeaker provides a smooth transition in sound between the dipole-radiating ESL element and the monopole-radiating subwoofer. The ESL system includes two or more invertedly-driven ESL elements of different sizes, each element handling a different range of frequencies.

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Номер записи: 11
28-06-2012 дата публикации

Speaker and method for fabricating same

Номер: US20120163644A1
Автор: CHAO Xu, Rong-Lin Ling-Hu, Xing-Zhi Huang, Xiong Zhang
Принадлежит: Individual

A method for fabricating a speaker is disclosed. The speaker is equipped with a case having a through cavity, an inner surface forming the cavity and an outer surface, a magnetic bowl coupled to the case, a magnet positioned in the magnetic bowl, a pole plate covering the magnet, a magnetic gap formed by the magnet and the magnetic bowl, a diaphragm supported by the case and vibrating along a vibrating direction, a voice coil connected to the diaphragm, and a hearing aid coil formed on the case. The method includes the steps of: providing a case made of thermoplastic doped with organometallic additive; activating the organometallic additive in the case by a laser beam for forming initial pattern of the hearing aid coil in the inner surface of the case; and bathing the case in copper solution for providing the initial pattern with copper plating layer.

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Номер записи: 12
19-07-2012 дата публикации

Bulk silicon moving member with dimple

Номер: US20120181637A1
Автор: Chia-Hua Chu, Chia-Pao SHU
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A method for forming a semiconductor device includes forming a substrate, forming a moveable member of bulk silicon and forming a first dimple structure on a first surface of the moveable member, where the first surface faces the substrate.

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Номер записи: 13
26-07-2012 дата публикации

Micromechanical Microphone Device and Method for Producing a Micromechanical Microphone Device

Номер: US20120189143A1
Автор: Alexander Buhmann, Ando Feyh
Принадлежит: ROBERT BOSCH GMBH

A micromechanical microphone device includes a membrane that is mounted in an elastically deflectable manner above a substrate and that has at least one gate electrode. The device further includes a source region and a drain region provided in or on the substrate with a channel region therebetween. The channel region is at least partly covered by the gate electrode and is spaced apart from the gate electrode by a gap. The membrane is deflectable under the influence of sound in such a way that the gap is variable.

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Номер записи: 14
06-09-2012 дата публикации

Resettable high-voltage capable high impedance biasing network for capacitive sensors

Номер: US20120223770A1
Автор: John M. Muza
Принадлежит: ROBERT BOSCH GMBH

A high-voltage MEMS biasing network. The network has a reset mode wherein a capacitive sensor is charged, and a functional mode wherein the MEMS biasing network provides a high impedance between the capacitive sensor and a bias voltage source. The network includes a biasing circuit, a mirror circuit, and a control circuit. The biasing circuit and the mirror circuit have a charging state and a high impedance state. The control circuit includes a first branch that controls the biasing circuit and a second branch that controls the mirror circuit. The biasing network receives a logic control signal, the first branch puts the biasing circuit into the charging state when the logic control signal is a first logic signal, and puts the biasing circuit into the high impedance state when the logic control signal is a second logic signal.

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Номер записи: 15
06-09-2012 дата публикации

Mems-microphone

Номер: US20120224726A1
Автор: Andreas Beer, Anton Leidl, Matthias Jungkunz, Wolfgang Pahl
Принадлежит: EPCOS AG

A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.

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Номер записи: 16
04-10-2012 дата публикации

Multi-membrane microphone for high-amplitude audio capture

Номер: US20120250884A1
Автор: Andrew Duncan Phelps, Mikko Veli Aimo Suvanto
Принадлежит: Nokia Oyj

Disclosed herein are apparatus, method, and computer program product whereby a device receives an acoustic signal. In response to the received acoustic signal, the device outputs electrical signals from a first input audio transducer and a second input audio transducer. The second input audio transducer is less sensitive than the first input audio transducer.

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Номер записи: 17
04-10-2012 дата публикации

Programmable microphone

Номер: US20120250910A1
Автор: Claus Erdmann Fuerst, Henrik Thomsen, Jens Jorge Gaarde Henriksen, Mohammad Shajaan
Принадлежит: Audioasics AS

A semiconductor die with an integrated electronic circuit, configured so as to be mounted in a housing with a capacitive transducer e.g. a microphone. A first circuit is configured to receive an input signal from the transducer at an input node and to provide an output signal at a pad of the semiconductor die. The integrated electronic circuit comprises an active switch device with a control input, coupled to a pad of the semiconductor die, to operatively engage or disengage a second circuit interconnected with the first circuit so as to operate the integrated electronic circuit in a mode selected by the control input. That is, a programmable or controllable transducer. The second circuit is interconnected with the first circuit so as to be separate from the input node. Thereby less noise is induced, a more precise control of the circuit is obtainable and more advanced control options are possible.

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Номер записи: 18
25-10-2012 дата публикации

Electromechanical transducer and method of manufacturing the same

Номер: US20120266682A1
Автор: Ayako Kato, Kazutoshi Torashima
Принадлежит: Canon Inc

Disclosed is an electromechanical transducer, including: a cell including a substrate, a vibration film, and a supporting portion of the vibration film configured to support the vibration film so that a gap is formed between the substrate and the vibration film; and a lead wire that is placed on the substrate with an insulator interposed therebetween and extends to the cell, wherein the insulator has a thickness greater than the thickness of the supporting portion. The electromechanical transducer can reduce parasitic capacitance to prevent an increase in noise, a reduction in bandwidth, and a reduction in sensitivity.

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Номер записи: 19
01-11-2012 дата публикации

Surface-Mounted Microphone Arrays on Flexible Printed Circuit Boards

Номер: US20120275621A1
Автор: Gary W. Elko
Принадлежит: MH Acoustics LLC

A microphone array, having a three-dimensional (3D) shape, has a plurality of microphone devices mounted onto (at least one) flexible printed circuit board (PCB), which is bent to achieve the 3D dimensional shape. Output signals from the microphone devices can be combined (e.g., by weighted or unweighted summation or differencing) to form sub-element output signals and/or element output signals, and ultimately a single array output signal for the microphone array. The PCB may be uniformly flexible or may have rigid sections interconnected by flexible portions. Possible 3D shapes include (without limitation) cylinders, spirals, serpentines, and polyhedrons, each formed from a single flexible PCB. Alternatively, the microphone array may be an assembly of multiple, interconnecting sub-arrays, each having two or more rigid portions separated by one or more flexible portions, where each sub-array has at least one cut-out portion for receiving a rigid portion of another sub-array.

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Номер записи: 20
08-11-2012 дата публикации

Microelectromechanical systems (mems) resonators and related apparatus and methods

Номер: US20120280594A1
Автор: David M. Chen, Guiti Zolfagharkhani, Jan H. Kuypers, Jason Goodelle, Klaus Juergen Schoepf, Pritiraj Mohanty, Reimund Rebel
Принадлежит: Sand 9 Inc

Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

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Номер записи: 21
15-11-2012 дата публикации

Stereo microphone

Номер: US20120288101A1
Автор: Hiroshi Akino, Shioto Okita
Принадлежит: Audio Technica KK

A stereo microphone has four condenser microphone units having respective directional axes in the same horizontal plane. The four units each have unidirectivity and a quadrangular shape viewed from the direction of the directional axis. The units are disposed by rotating the directional axes of adjacent units by 90°. A pair of two units diagonally positioned and having the directional axes directed at 180° to each other collaborate with each other to form a pair of bidirectional microphone units.

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Номер записи: 22
15-11-2012 дата публикации

Microphone

Номер: US20120288113A1
Автор: Hiroshi Akino, Shioto Okita
Принадлежит: Audio Technica KK

A microphone includes a plurality of microphone units; in which the microphone units include a first group of microphone units and a second group of microphone units, the first group of microphone units and the second group of microphone units are disposed alternately, the first group of microphone units are connected in series such that outputs from the first group of microphone units are added and outputted as an added output, the second group of microphone units are connected in series such that outputs from the second group of microphone units are added and outputted as another added output, and the added output of one of the first group of microphone units and the second group of microphone units is output from a hot terminal as a balanced output and the other added output is output from a cold terminal as a balanced output.

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Номер записи: 23
06-12-2012 дата публикации

Plate, Transducer and Methods for Making and Operating a Transducer

Номер: US20120308053A1
Автор: Alfons Dehe
Принадлежит: INFINEON TECHNOLOGIES AG

A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.

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Номер записи: 24
06-12-2012 дата публикации

Combined micro-electro-mechanical systems microphone and method for manufacturing the same

Номер: US20120308066A1
Автор: Hung-Jen Chen, Kuan-Hsun Chiu, Kuo-Hsiang Li, Yung-Ta Chen
Принадлежит: Merry Electronics Co Ltd

A combined MicroElectroMechanical Systems (MEMS) microphone includes a first substrate, a second substrate, a vibrating diaphragm, a backplate, and an accommodating slot. The first substrate has a first chamber, the vibrating diaphragm is disposed on the first chamber, the second substrate has a second chamber, one side of the backplate is disposed on the second chamber, and the other side of the backplate is disposed on the vibrating diaphragm, so that the second substrate is combined with the first substrate. In addition, the backplate has multiple sound holes, and the accommodating slot is disposed between the first substrate and the second substrate to form a space between the vibrating diaphragm and the backplate.

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Номер записи: 25
20-12-2012 дата публикации

Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures

Номер: US20120319527A1
Автор: Anthony K. Stamper, Christopher V. Jahnes
Принадлежит: International Business Machines Corp

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming a wiring layer on a substrate comprising actuator electrodes and a contact electrode. The method further includes forming a MEMS beam above the wiring layer. The method further includes forming at least one spring attached to at least one end of the MEMS beam. The method further includes forming an array of mini-bumps between the wiring layer and the MEMS beam.

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Номер записи: 26
17-01-2013 дата публикации

Mems microphone overtravel stop structure

Номер: US20130016859A1
Автор: Thomas Buck
Принадлежит: ROBERT BOSCH GMBH

A MEMS microphone. The MEMS microphone includes a membrane, a spring, and a first layer having a backplate, and a first OTS structure. The spring has a first end coupled to the membrane, and a second end mounted to a support. The first OTS structure is released from the backplate and coupled to a structure other than the backplate, and is configured to stop movement of the membrane in a first direction after the membrane has moved a predetermined distance.

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Номер записи: 27
17-01-2013 дата публикации

Ultrasound transducer and ultrasound diagnostic apparatus

Номер: US20130018269A1
Автор: Jin Hiraoka, Katsuhiro Wakabayashi, Kazuhisa Karaki, Kazuya Matsumoto, Mamoru Hasegawa, Satoshi Yoshida
Принадлежит: Olympus Corp, OLYMPUS MEDICAL SYSTEMS CORP

An ultrasound transducer includes a substrate and a lower electrode layer, a lower insulating layer, an upper insulating layer, and an upper electrode layer. The lower insulating layer and the upper insulating layer are arranged to be opposed to each other via an air gap section. The upper insulating layer and the lower insulating layer are different in a material and thickness and satisfy Equation 1 below. In Equation 1, K 1 represents a relative dielectric constant of the lower insulating layer, K 2 represents a relative dielectric constant of the upper insulating layer, T 1 represents thickness of the lower insulating layer, T 2 represents thickness of the upper insulating layer, ρ 1 (x) represents a charge density distribution in the lower insulating layer, and ρ 2 (y) represents a charge density distribution in the upper insulating layer. 1 K   1  ∫ 0 T   1  x × ρ   1  ( x )    x = 1 K   2  ∫ 0 T   2  y × ρ   2  ( y )    y ( Equation   1 )

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Номер записи: 28
31-01-2013 дата публикации

Lid, fabricating method thereof, and mems package made thereby

Номер: US20130028450A1
Автор: Ivan Micallef, Kun-Chen Tsai, Mario Cortese, Mark A. Azzopardi, Shih-Ping Hsu
Принадлежит: STMICROELECTRONICS SRL, Unimicron Technology Corp

A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon, respectively, wherein a through cavity extends through the first board and the first and second metal layers; a second board with opposite third and fourth surfaces; an adhesive layer sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess; and a first conductor layer coating the bottom and the side surfaces of the recess.

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Номер записи: 29
31-01-2013 дата публикации

Monolithic Silicon Microphone

Номер: US20130028459A1
Автор: Yunlong Wang
Принадлежит: Individual

A monolithic silicon microphone including a first backplate, a second backplate and a diaphragm displaced between said first backplate and said second backplate. Said first backplate is supported by a silicon substrate with one or more perforation holes. Said second substrate is attached to a perforated plate which itself is supported on said substrate. Said monolithic silicon microphone has integrated signal conditioning circuit, and is said diaphragm, said first backplate, said second backplate, and said signal conditioning circuit are electrically interconnected. Signals from said diaphragm, said first backplate, and said second backplate are fed into said signal conditioning circuit, and are amplified differentially.

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Номер записи: 30
21-02-2013 дата публикации

Electret loudspeaker device

Номер: US20130044905A1
Автор: Chih-Kung Lee, Han-Lung Chen, Hsu-Ching Liao, Wen-Hsin Hsiao, Yu-Chi Chen
Принадлежит: National Taiwan University NTU

An electret loudspeaker device including a diaphragm, a first perforated electrode and a first spacer is provided. The diaphragm has an electret layer and an electrode layer. The first perforated electrode is stacked on a side of the diaphragm near the electret layer, and has multiple holes. The first spacer is stacked between the diaphragm and the first perforated electrode, and includes a first distribution area and plural second distribution areas. The first distribution area has first openings penetrating through the first spacer, and each first opening has a first opening space volume between the diaphragm and the first perforated electrode. Each second distribution area has second openings penetrating through the first spacer, and each second opening has a second opening space volume between the diaphragm and the first perforated electrode. A difference between the first and the second opening space volumes is greater than 10%.

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Номер записи: 31
14-03-2013 дата публикации

Method For Facilitating Assembly Of A Printhead Having A Polymer Layer

Номер: US20130062007A1
Автор: ANDREWS JOHN R., DeCrescentis Antonio, Dolan Bryan R., Gerner Bradley J., Lin Pinyen
Принадлежит: XEROX CORPORATION

A method for assembling an inkjet jet print head enables piezoelectric transducers to be bonded to an inkjet ejector without closing inlets to a pressure chamber within the inkjet ejector. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer with a thermoset adhesive, placing thermoset polymer in areas between the piezoelectric transducers on the diaphragm layer, and drilling inlets through the thermoset polymer and the diaphragm at the openings in the diaphragm. 1. A method for bonding a piezoelectric transducer layer with a diaphragm layer comprising:bonding a polymer layer to a diaphragm layer having a plurality of opening in the diaphragm layer;bonding piezoelectric transducers to the diaphragm layer with a thermoset adhesive;placing thermoset polymer in areas between the piezoelectric transducers on the diaphragm layer; anddrilling inlets through the thermoset polymer and the diaphragm layer at the openings in the diaphragm layer.2. The method of wherein the drilling is performed with laser ablation.3. The method of further comprising:bonding an electrical standoff and an electrical interconnect to the piezoelectric transducers prior to drilling the inlets.4. The method of further comprising:planarizing the thermoset polymer.5. The method of claim 4 , the planarizing further comprising:placing a layer of polytetrafluoroethylene (PTFE) over the thermoset polymer;curing the thermoset polymer; andremoving the PTFE layer.6. The method of further comprising:removing thermoset polymer from an upper surface of the piezoelectric transducers.7. The method of further comprising:releasing the piezoelectric transducers from a carrier plate after the piezoelectric transducers are bonded to the polymer layer.8. The method of further comprising:bonding a fluid path plate having a body layer with inlet and outlet regions to the polymer layer before the piezoelectric transducers ...

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Номер записи: 32
28-03-2013 дата публикации

Electrostatic parallel plate actuators whose moving elements are driven only by electrostatic force and methods useful in conjunction therewith

Номер: US20130076275A1
Автор: Daniel Lewin, Eric Andreas Haber, Meir Ben Simon, Shay Kaplan, Yuval Cohen
Принадлежит: Audio Pixels Ltd

An actuator apparatus is provided that includes at least one actuator device, each actuator device including an array of moving elements, each individual moving element is operative to be constrained to travel alternately back and forth along a respective axis responsive to an individual first electrostatic force operative thereupon, wherein each moving element has an at-rest position and is driven away from its at rest position solely by the first electrostatic force; and at least one electrode operative to apply a controlled temporal sequence of potential differences with at least one individual moving element from among the array of moving elements thereby to selectably generate the first electrostatic force; and a controller operative to receive the digital input signal and to control at least one of the at least one electrode and the individual moving element to apply the sequence of potential differences.

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Номер записи: 33
11-04-2013 дата публикации

Micro-electromechanical semiconductor component

Номер: US20130087865A1
Автор: Arnd Ten Have
Принадлежит: ELMOS SEMICONDUCTOR SE

The micro-electromechanical semiconductor component is provided with a semiconductor substrate in which a cavity is formed, which is delimited by lateral walls and by a top and a bottom wall. In order to form a flexible connection to the region of the semiconductor substrate, the top or bottom wall is provided with trenches around the cavity, and bending webs are formed between said trenches. At least one measuring element that is sensitive to mechanical stresses is formed within at least one of said bending webs. Within the central region surrounded by the trenches, the top or bottom wall comprises a plurality of depressions reducing the mass of the central region and a plurality of stiffening braces separating the depressions.

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Номер записи: 34
11-04-2013 дата публикации

Pre-charged CMUTs for zero-external-bias operation

Номер: US20130088118A1
Автор: Butrus T. Khuri-Yakub, Mario Kupnik, Min-Chieh Ho
Принадлежит: Leland Stanford Junior University

Capacitive micromachined ultrasonic transducers (CMUTs) having a pre-charged floating electrode are provided. Such CMUTs can operate without an applied DC electrical bias. Charge can be provided to the floating electrode after or during fabrication in various ways, such as injection by an applied voltage, and injection by ion implantation.

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Номер записи: 35
11-04-2013 дата публикации

Condenser microphone

Номер: US20130089222A1
Автор: Hiroshi Akino
Принадлежит: Audio Technica KK

The present invention has: a condenser microphone unit which performs electroacoustic conversion according to a change in an electrostatic capacitance between a diaphragm and a fixed pole; a non-inverting amplifier which is connected to one of the diaphragm and the fixed pole, and which has an impedance converter which converts an output impedance of the microphone unit into a low impedance; an inverting amplifier which receives an input of an output signal of the non-inverting amplifier through an input resistance, and which has a feedback resistance; and a variable resistor which is connected between an output of the non-inverting amplifier and an output of the inverting amplifier, and in which a wiper is connected to the diaphragm or the fixed pole, whichever is not connected to the non-inverting amplifier, and the sensitivity changes according to the position of the wiper of the variable resistor.

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Номер записи: 36
18-04-2013 дата публикации

COMPACT, HIGHLY INTEGRATED MICROPHONE ASSEMBLY

Номер: US20130094674A1
Автор: Kirkpatrick Galen, Lautenschlager Eric J.
Принадлежит:

A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly. 1. A microelectromechanical (MEMS) microphone assembly , the assembly comprising:a MEMS structure, the MEMS structure including a diaphragm that responds to changes in sound pressure, the MEMS structure contributing to a vertical dimension of the assembly;a base portion, the MEMS structure being supported by the base portion; anda lid, the lid partially but not completely enclosing the MEMS structure, such that a portion of the MEMS structure not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.2. The assembly of wherein a port is disposed through the lid.3. The assembly of wherein a port is disposed through the base portion.4. The assembly of further comprising an integrated circuit coupled to the MEMS structure.5. The assembly of wherein the integrated circuit is mounted in a flip-chip type configuration.6. The assembly of wherein the portion of the MEMS structure not surrounded by the lid is directly exposed to the external environment.7. The assembly of wherein the portion of the MEMS structure not surrounded by the lid is covered with a thin film. This patent claims benefit under 35 U.S.C. §119 (e) to U.S. Provisional Application No. 61/475,913 entitled “Compact, Highly Integrated Microphone Architecture And Method Of Manufacture” filed Apr. 15, 2011 having attorney docket number 8354-99386-US the ...

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Номер записи: 37
18-04-2013 дата публикации

Electret Condenser Microphone

Номер: US20130094676A1
Автор: Motonaga Hidenori, MURAOKA Tetsuji, Nakanishi Kensuke
Принадлежит: HOSIDEN CORPORATION

An electret condenser microphoneelectret condenser microphone includes a capsule, diaphragm ring with attached diaphragm, back electrode plate having an electret-dielectric-film-coated surface facing the diaphragm, insulating spacer with space between the back electrode plate and the diaphragm, impedance converter, flexible printed circuit board in which a hollow cylinder, a flange projecting radially from an edge of the hollow cylinder on one end face facing the back electrode plate, and a rear plate blocking the other end face of the hollow cylinder are integrally formed, in which the impedance converter is placed on a surface of the rear plate facing the back electrode plate, and gate ring electrically connecting the back electrode plate to wiring on the flexible printed circuit board. An edge on an open side of the capsule bends inwardly to fit against the flange of the flexible printed circuit board. 1. An electret condenser microphone comprising:a capsule that includes a first hollow cylinder and a front plate blocking one end face of the first hollow cylinder, the capsule being made of metal material;a diaphragm ring that has one surface in contact with an inner surface of the front plate and the other surface to which a diaphragm is attached;a back electrode plate that has a surface with which an electret dielectric film is coated, the surface facing the diaphragm, the back electrode plate being made of metal material;an insulating spacer that is annularly formed and present between the back electrode plate and the diaphragm to keep a space between the back electrode plate and the diaphragm;an impedance converter that performs impedance conversion of an electric signal generated on the back electrode plate and extracts a converted signal;a flexible printed circuit board in which a second hollow cylinder, a flange that projects radially from an edge of the second hollow cylinder on one end face of the second hollow cylinder that faces the back electrode plate ...

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Номер записи: 38
18-04-2013 дата публикации

Microphone Unit, Method of Manufacturing Microphone Unit, Electronic Apparatus, Substrate for Microphone Unit and Method of Manufacturing Substrate for Microphone Unit

Номер: US20130094689A1
Автор: Fuminori Tanaka, Yuji Ushiyama
Принадлежит: Funai Electric Co Ltd, Hitachi Chemical Co Ltd

This microphone unit includes a vibrating portion converting a sound to an electric signal, a substrate having a first surface where the vibrating portion is set and a second surface opposite to the first surface and including a hollow portion transmitting a sound therein, and a coating layer formed on an inner surface of the hollow portion of the substrate. The substrate further includes a first substrate sound hole portion provided on the first surface for causing the hollow portion and the vibrating portion to communicate with each other, a second substrate sound hole portion provided on the first surface for causing the hollow portion and the exterior to communicate with each other, and a coating liquid draining hole portion provided on the second surface for causing the hollow portion and the exterior to communicate with each other.

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Номер записи: 39
02-05-2013 дата публикации

MEMS Microphone with Spring Suspended Backplate

Номер: US20130108084A1
Автор: Zhang Xin
Принадлежит: ANALOG DEVICES, INC.

A MEMS microphone has a base, a backplate, and a backplate spring suspending the backplate from the base. The microphone also has a diaphragm forming a variable capacitor with the backplate. 1. A MEMS microphone comprising:a base;a backplate having a plurality of apertures;a backplate spring suspending the backplate from the base; anda diaphragm forming a variable capacitor with the backplate.2. The MEMS microphone as defined by wherein when the microphone is stationary claim 1 , the backplate spring has a spring constant that is high enough to cause the backplate to remain substantially stationary upon receipt of audio signals having amplitudes on the order of magnitude of the human speaking voice.3. The MEMS microphone as defined by wherein the backplate spring comprises a serpentine shape.4. The MEMS microphone as defined by wherein the backplate spring is substantially solid and circumscribes the backplate.5. The MEMS microphone as defined by wherein the backplate has a thickness claim 4 , the backplate spring having a thickness that is less than the thickness of the backplate.6. The MEMS microphone as defined by wherein the backplate spring comprises at least one tether.7. The MEMS microphone as defined by wherein the tether is solid.8. The MEMS microphone as defined by wherein the diaphragm has a diaphragm spring with a diaphragm spring constant claim 1 , the backplate spring having a backplate spring constant claim 1 , the backplate spring constant being at least ten times larger than the diaphragm spring constant.9. A method of reducing stress on a MEMS microphone backplate claim 1 , the method comprising:providing a base;supporting a diaphragm on the base; andforming a variable capacitor by spacing a backplate from the diaphragm, the backplate being connected to the base with at least one spring configured to reduce stress on the backplate.10. The method as defined by further comprising applying an incident audio signal of a spoken human voice against the ...

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Номер записи: 40
02-05-2013 дата публикации

ELECTROSTATIC LOUDSPEAKER

Номер: US20130108086A1
Автор: Takano Yasuaki, YAMASHITA Masayoshi
Принадлежит: YAMAHA CORPORATION

An electrostatic loudspeaker includes: a vibrating member; an electrode disposed so as to be opposed to the vibrating member; a spacer member disposed on an opposite side of a face of the electrode, which is opposed to the vibrating member, and having acoustic transmission property; and a cover member disposed on an opposite side of a face of the spacer member, which is opposed to the electrode, and having waterproof property and insulation property. 1. An electrostatic loudspeaker comprising:a vibrating member;an electrode disposed so as to be opposed to the vibrating member;a spacer member disposed on an opposite side of a face of the electrode, which is opposed to the vibrating member, and having acoustic transmission property; anda cover member disposed on an opposite side of a face of the spacer member, which is opposed to the electrode, and having waterproof property and insulation property.2. The electrostatic loudspeaker according to claim 1 , whereinthe electrode has acoustic transmission property,the vibrating member is a vibrating membrane,an elastic member having elasticity, insulation property, and acoustic transmission property, is disposed between the vibrating membrane and the electrode,the spacer member is a first cover member having elasticity,the cover member is a second cover member having acoustic transmission property, anda third cover member having acoustic transmission property is disposed on an opposite side of a face of the second cover member, which is opposed to the first cover member.3. The electrostatic loudspeaker according to claim 2 , wherein the second cover member includes a conductive membrane formed on an entire area of at least one face of the second cover member claim 2 , and the conductive membrane is electrically connected to a ground of a drive circuit configured to supply an acoustic signal to the electrode.4. The electrostatic loudspeaker according to claim 2 , whereinthe first cover member is a pair of first cover members ...

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Номер записи: 41
02-05-2013 дата публикации

ELECTROSTATIC LOUDSPEAKER

Номер: US20130108087A1
Автор: Matsubara Yoshikatsu, Muroi Kunimasa, Takano Yasuaki
Принадлежит: YAMAHA CORPORATION

An electrostatic loudspeaker includes: a first electrode having acoustic transmission property; a second electrode having acoustic transmission property, and disposed so as to be opposed to the first electrode; a vibrating member having conductibility, and disposed between the first electrode and the second electrode; a first elastic member having elasticity, insulation property, and acoustic transmission property, and disposed between the vibrating member and the first electrode; a second elastic member having elasticity, insulation property, and acoustic transmission property, and disposed between the vibrating member and the second electrode; and a first separation member having insulation property and acoustic transmission property, and disposed on an opposite side of a face of the first electrode, which is opposed to the first elastic member. 1. An electrostatic loudspeaker comprising:a first electrode having acoustic transmission property;a second electrode having acoustic transmission property, and disposed so as to be opposed to the first electrode;a vibrating member having conductibility, and disposed between the first electrode and the second electrode;a first elastic member having elasticity, insulation property, and acoustic transmission property, and disposed between the vibrating member and the first electrode;a second elastic member having elasticity, insulation property, and acoustic transmission property, and disposed between the vibrating member and the second electrode; anda first separation member having insulation property and acoustic transmission property, and disposed on an opposite side of a face of the first electrode, which is opposed to the first elastic member.2. The electrostatic loudspeaker according to claim 1 , further comprising:a second separation member having insulation property and acoustic transmission property, and disposed on an opposite side of a face of the second electrode, which is opposed to the second elastic member.3. ...

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Номер записи: 42
16-05-2013 дата публикации

Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method

Номер: US20130119492A1
Автор: Anton Leidl, Gregor Feiertag, Hans Krueger, Wolfgang Pahl
Принадлежит: EPCOS AG

The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

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Номер записи: 43
16-05-2013 дата публикации

Sound Transducer with Interdigitated First and Second Sets of Comb Fingers

Номер: US20130121509A1
Автор: Alfons Dehe, Shu-Ting Hsu
Принадлежит: INFINEON TECHNOLOGIES AG

A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force.

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Номер записи: 44
16-05-2013 дата публикации

METHODS AND DEVICES FOR RADIO FREQUENCY (RF) MITIGATION PROXIMATE THE EAR

Номер: US20130123919A1
Автор: Duvall Gideon, Goldstein Steven Wayne
Принадлежит: Personics Holdings Inc.

Earpieces and methods of forming earpieces for radio frequency (RF) mitigation are provided. An earpiece is configured to be inserted in an ear canal. The earpiece includes an insertion element and a sealing section disposed on the insertion element and configured to conform to the ear canal. The sealing section is configured to substantially mitigate radio frequency (RF) transmission and to substantially isolate the ear canal from an ambient environment. 1. An earpiece configured to be inserted in an ear canal comprising:an insertion element; anda sealing section disposed on the insertion element and configured to conform to the ear canal,wherein the sealing section is configured to substantially mitigate radio frequency (RF) transmission and to substantially isolate the ear canal from an ambient environment.2. The earpiece according to claim 1 , wherein the sealing section includes a plurality of particles configured to at least one of interfere with the RF transmission claim 1 , absorb the RF transmission or reflect the RF transmission.3. The earpiece according to claim 2 , wherein the particles include at least one of ferromagnetic particles claim 2 , ferrimagnetic particles or electrically conductive particles.4. The earpiece according to claim 1 , wherein the sealing section includes:a mixture of a medium and a plurality of particles, the particles configured to substantially mitigate the RF transmission; andan expandable element disposed on the insertion element, the expandable element configured to receive the mixture and to expand, responsive to the mixture, to conform to the ear canal.5. The earpiece according to claim 4 , wherein the expandable element is formed from a material including at least one of silicone claim 4 , rubber claim 4 , a polyurethane elastomer or an RF absorbing elastomer.6. The earpiece according to claim 4 , wherein the medium includes at least one of a liquid or a gel.7. The earpiece according to claim 6 , wherein the liquid ...

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Номер записи: 45
23-05-2013 дата публикации

ULTRASOUND TRANSDUCER AND PROCESSING METHODS THEREOF

Номер: US20130127297A1
Автор: BAUTISTA Richard, ZELENKA Robert
Принадлежит: Silicon Valley Medical Instruments, Inc.

An ultrasonic transducer includes a backing element, an active element overlying the backing layer, and a matching element overlying the active element, the matching element having an inner surface that contacts the active element and an outer surface with a non-homogeneous texture and/or material composition. The matching element may be formed by subtractive or deposition techniques. 1. An ultrasonic transducer comprising:a backing layer;an active element overlying the backing layer; anda matching element overlying the active element, the matching element having an inner surface that contacts the active element and an outer surface with a non-homogeneous texture and/or material composition.2. The transducer of claim 1 , wherein the matching element comprises a single matching layer claim 1 , the outer surface having (a) a first region with a first texture and a first material composition and (b) a second region with a second texture and a second material composition claim 1 ,wherein (i) the first texture differs from the second texture and/or (ii) the first material composition differs from the second material composition.3. The transducer of claim 2 , wherein the first and second textures are coarse or rough claim 2 , the first and second regions having a reduced thickness in the matching layer.4. The transducer of claim 3 , wherein the first and second textures are formed by ablation.5. The transducer of claim 3 , wherein the first and second textures are formed by abrasion.6. The transducer of claim 1 , wherein the matching element includes a plurality of matching regions having different thicknesses.7. The transducer of claim 6 , wherein the matching regions are arranged side-by-side on the active element.8. The transducer of claim 6 , wherein at least two of the matching regions are overlapping.9. The transducer of claim 1 , wherein the matching element includes a plurality of discrete matching regions of a first material over the active element.10. The ...

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Номер записи: 46
23-05-2013 дата публикации

Air cavity package configured to electrically couple to a printed circuit board and method of providing same

Номер: US20130128487A1
Автор: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
Принадлежит: UBOTIC INTELLECTUAL PROPERTY CO Ltd

In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole. The one or more second electrically conductive leads can be configured to couple to the printed circuit board at a first side of the one or more sides of the base. Other embodiments are disclosed.

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Номер записи: 47
23-05-2013 дата публикации

MICRO-ELECTRO-MECHANICAL MICROPHONE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20130129118A1
Автор: Mao Jianhong, Tang Deming
Принадлежит: LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) LTD

A micro-electro-mechanical microphone and manufacturing method thereof are provided in the invention. The micro-electro-mechanical microphone comprises: a diaphragm, which is formed on a surface of one side of a semiconductor substrate, exposed to the outside surroundings, and can vibrate freely by sensing the pressure generated by sound waves; an electrode plate with air holes, which is under the diaphragm; an isolation structure for fixing the diaphragm and the electrode plate; an air gap cavity between the diaphragm and the electrode plate, and a back cavity under the electrode plate and in the semiconductor substrate; a second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner; the air gap cavity is connected with the back cavity through the air holes of the electrode plate; the back cavity is connected with the second cavity through an air groove formed in the semiconductor substrate. The micro-electro-mechanical microphone in the invention is formed on the surface of one side of the semiconductor substrate, and the manufacturing method thereof is compatible with CMOS technics, therefore the device is easy to be miniaturized and integrated into a semiconductor chip. 1. A micro-electro-mechanical microphone , comprising:a diaphragm formed on a surface of one side of a semiconductor substrate, which is exposed to an external environment and can vibrate freely under the pressures generated by sound waves;an electrode plate under the diaphragm and having air holes therein;an isolation structure for fixing the diaphragm and the electrode plate;an air gap cavity formed between the diaphragm and the electrode plate;a back cavity formed under the electrode plate and in the semiconductor substrate; anda second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner;where the air holes in the electrode plate join the air gap cavity and the back cavity, and an air groove formed in ...

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Номер записи: 48
23-05-2013 дата публикации

ELECTROSTATIC LOUDSPEAKER AND METHOD OF PRODUCING ELECTROSTATIC LOUDSPEAKER

Номер: US20130129121A1
Автор: YAMASHITA Masayoshi
Принадлежит: YAMAHA CORPORATION

An electrostatic loudspeaker includes: a first electrode; a second electrode which is opposed to the first electrode; and a vibrating member which is disposed between the first electrode and the second electrode and in which an insulation membrane and a conductive membrane are stacked, the insulation membrane being disposed on both end faces of the vibrating member in a direction of the stacking. 1. An electrostatic loudspeaker compressing:a first electrode;a second electrode which is opposed to the first electrode; anda vibrating member which is disposed between the first electrode and the second electrode and in which an insulation membrane and a conductive membrane are stacked, the insulation membrane being disposed on both end faces of the vibrating member in a direction of the stacking.2. The electrostatic loudspeaker according to claim 1 , wherein the vibrating member is formed by folding a sheet in which the conductive membrane is formed on the insulation membrane.3. The electrostatic loudspeaker according to claim 2 , wherein the vibrating member is formed by folding the sheet into two parts.4. The electrostatic loudspeaker according to claim 1 , wherein the vibrating member is formed by stacking two sheets claim 1 , in which the insulation membrane and the conductive membrane are stacked claim 1 , so that the insulation membrane is disposed outside.5. A method of producing an electrostatic loudspeaker claim 1 , the method comprising:a first step of stacking an insulation membrane and a conductive membrane to form a vibrating member, the insulation membrane being disposed on both end faces of the vibrating member in a direction of the stacking; anda second step of disposing a first electrode, a second electrode and the vibrating member so that the vibrating member formed in the first step is disposed between the first electrode and the second electrode which are opposed to each other.6. The method according to claim 5 , wherein claim 5 , in the first step ...

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Номер записи: 49
23-05-2013 дата публикации

SHIELDING OF BEHIND-THE-EAR HEARING AIDS

Номер: US20130129131A1
Автор: BRUNDA DANIEL D.
Принадлежит:

Provided is a method and shield for shielding a behind-the-ear hearing aid. A Mu metal shielding material is bonded to the external or internal surface of the behind-the-ear hearing aid, the shielding providing effective shielding of electromagnetic radiation in the frequency range of 0.78 Hz to 20 KHz and effective sound shielding in the audio frequency range of 20 Hz to 20,000 Hz. 1. A shield for a behind-the-ear hearing aid , the hearing aid comprising a package of electrical components , the shield comprising a shielding material providing effective shielding of electromagnetic radiation in the frequency range of 0.78 Hz to 20 KHz and effective sound shielding in the audio frequency range of 20 Hz to 20 ,000 Hz , the shielding material being a Mu metal alloy , completely surrounding the package of electrical components , wherein effective shielding means shielding to at least the extent that the audio cannot be detected by a human ear at a distance of one foot and the EMR cannot be distinguished from background noise at a distance of one foot.2. The shield according to claim 1 , wherein the shielding material forms a layer along an interior surface of the hearing aid.3. The shield according to claim 1 , wherein the shielding material forms a layer along an exterior surface of a hearing aid.4. The shield according to claim 1 , wherein effective electromagnetic radiation and audio shielding is at least 75% of the electromagnetic radiation and audio intensities claim 1 , respectively.5. A method for shielding a behind-the-ear hearing aid claim 1 , the hearing aid comprising a package of electrical components claim 1 , the method comprising encompassing the package of electrical components with a shielding material providing effective shielding of electromagnetic radiation in the frequency range of 0.78 Hz to 20 KHz and effective sound shielding in the audio frequency range of 20 Hz to 20 claim 1 ,000 Hz claim 1 , the shielding material being a Mu metal alloy.6. The ...

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Номер записи: 50
23-05-2013 дата публикации

Microphone unit

Номер: US20130129133A1
Автор: Fuminori Tanaka, Ryusuke Horibe, Takeshi Inoda
Принадлежит: Funai Electric Co Ltd

A microphone unit ( 1 ) is provided with an electro-acoustic transducer ( 13 ) which converts acoustic signals into electric signals on the basis of the oscillation of a diaphragm ( 134 ), and a housing ( 10 ) which contains the electro-acoustic transducer ( 13 ). The housing ( 10 ) is provided with: a first sound conduction space (SP 1 ) that guides sound waves from the outside to one side of the diaphragm ( 134 ) via at least one first aperture ( 18 ) formed on the exterior of the housing ( 10 ); and a second sound conduction space (SP 2 ) that guides sound waves from the outside to the other side of the diaphragm ( 134 ) via at least one second aperture ( 19 ) formed on the exterior of the housing ( 10 ). The total square area of at least one first aperture ( 18 ) and the total square area of at least one second aperture ( 19 ) are not the same.

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Номер записи: 51
30-05-2013 дата публикации

Mems microphone

Номер: US20130136291A1
Автор: Sang Ho Lee, Yong Hyun Shim
Принадлежит: BSE Co Ltd

A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space.

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Номер записи: 52
06-06-2013 дата публикации

METHOD OF MANUFACTURING RESONANT TRANSDUCER

Номер: US20130139377A1
Автор: NODA Ryuichiro, YOSHIDA Takashi
Принадлежит: YOKOGAWA ELECTRIC CORPORATION

A method of manufacturing a resonant transducer having a vibration beam includes: (a) providing an SOI substrate including: a first silicon layer; a silicon oxide layer on the first silicon layer; and a second silicon layer on the silicon oxide layer; (b) forming a first gap and second gap through the second silicon layer by etching the second silicon layer using the silicon oxide layer as an etching stop layer; (c) forming an impurity diffusion source layer on the second silicon layer; (d) forming an impurity diffused layer in a surface portion of the second silicon layer; (e) removing the impurity diffusion source layer through etching; and (f) removing at least a portion of the silicon oxide layer through etching such that an air gap is formed between the first silicon layer and a region of the second silicon layer surrounded by the first and second gaps. 1. A method of manufacturing a resonant transducer having a vibration beam , the method comprising:(a) providing an SOI substrate comprising: a first silicon layer; a silicon oxide layer on the first silicon layer; and a second silicon layer on the silicon oxide layer;(b) forming a first gap and second gap through the second silicon layer by etching the second silicon layer using the silicon oxide layer as an etching stop layer;(c) forming an impurity diffusion source layer on the second silicon layer, wherein the impurity diffusion source layer is configured to diffuse impurity into the second silicon layer;(d) forming an impurity diffused layer in a surface portion of the second silicon layer by diffusing the impurity from the impurity diffusion source layer through heat treatment for the SOI substrate;(e) removing the impurity diffusion source layer through etching; and(f) removing at least a portion of the silicon oxide layer through etching such that an air gap is formed between the first silicon layer and a region of the second silicon layer surrounded by the first and second gaps, wherein the region of ...

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Номер записи: 53
06-06-2013 дата публикации

Mems acoustic transducer and method for fabricating the same

Номер: US20130140655A1
Автор: Chien-Nan YEH, Chin-Hung Wang, Hsin-Li Lee, Jien-Ming Chen, Li-Chi Pan, Tzong-Che Ho
Принадлежит: Industrial Technology Research Institute ITRI

A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.

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Номер записи: 54
06-06-2013 дата публикации

Low Frequency CMUT with Thick Oxide

Номер: US20130140704A1
Автор: Ira Oaktree Wygant, Peter Johnson, Steven Adler
Принадлежит: Texas Instruments Inc

A capacitive micromachined ultrasonic transducer (CMUT), which has a conductive structure that can vibrate over a cavity, utilizes a thick oxide layer to substantially increase the volume of the cavity which, in turn, allows the CMUT to receive and transmit low frequency ultrasonic waves. In addition, the CMUT can include a back side bond pad structure that eliminates the need for and cost of one patterned photoresist layer.

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Номер записи: 55
13-06-2013 дата публикации

DIAGNOSTIC ULTRASOUND TRANSDUCER

Номер: US20130145611A1
Автор: Guo Xiaocong
Принадлежит: MR HOLDING (HK) LTD.

An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member. 1. A method for manufacturing an ultrasound imaging transducer assembly comprising:applying electrically conductive traces to at least one surface of a rigid printed circuit board (PCB);forming a backing block with the PCB secured to the backing block;sputtering an electrically conductive layer onto a distal, non-recessed, planar contact surface of the backing block and a top edge of the PCB;mounting an electro-acoustic material on the contact surface of the backing block;mounting at least one matching layer on the electro-acoustic material;dicing the matching layer, the electro-acoustic material, and the electrically conductive layer into an array of electrically separated portions, each portion of the electro-acoustic material thereby forming a separate electro-acoustic element and each portion of the electrically conductive layer thereby forming an electrode connecting the electro-acoustic element to at least one of the traces;on at least one side of the backing block, mounting a metallic member in contact with a ...

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Номер записи: 56
13-06-2013 дата публикации

Dynamic Microphone Unit and Dynamic Microphone

Номер: US20130148836A1
Автор: AKINO Hiroshi
Принадлежит:

A dynamic microphone unit includes: a diaphragm that vibrates in response to received sound waves; a voice coil that is fixed to the diaphragm and vibrates together with the diaphragm; a magnetic circuit that generates a magnetic field in a magnetic gap, the voice coil being disposed in the magnetic gap; a resonator that is disposed adjacent to the obverse of the diaphragm; and a noise canceling coil that is fixed to a surface of the resonator so as to face a position of fixing the voice coil, the surface facing the diaphragm. The noise canceling coil is connected in series with the voice coil and has a winding direction different from that of the voice coil. 1. A dynamic microphone unit comprising:a diaphragm that vibrates in response to received sound waves;a voice coil that is fixed to the diaphragm and vibrates together with the diaphragm;a magnetic circuit that generates a magnetic field in a magnetic gap, the voice coil being disposed in the magnetic gap;a resonator that is disposed adjacent to the obverse of the diaphragm; anda noise canceling coil fixed to a surface of the resonator, the surface facing a surface of the diaphragm, the noise cancelling coil facing the voice coil.2. The dynamic microphone unit according to claim 1 , whereinthe noise canceling coil is connected in series with the voice coil, anda winding direction of the noise canceling coil being different from a winding direction of the voice coil.3. The dynamic microphone unit according to claim 1 , wherein the resonator has a convex surface on its surface that faces the diaphragm claim 1 , the convex surface being formed along a circle concentric with the voice coil claim 1 , the noise canceling coil being aligned along the convex surface.4. The dynamic microphone unit according to claim 1 , wherein the noise canceling coil has the same wound diameter as that of the voice coil.5. The dynamic microphone unit according to claim 1 , wherein the noise canceling coil has the same number of turns ...

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Номер записи: 57
20-06-2013 дата публикации

System With Recessed Sensing Or Processing Elements

Номер: US20130154032A1
Автор: Alan J. O'Donnell, Garrett A. Griffin, Michael J. Cusack, Rigan F. McGeehan
Принадлежит: Analog Devices Inc

Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside of the base member, or with circuits on an active backside cap. An array of recessed components may a form complete, compact sensor system.

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Номер записи: 58
20-06-2013 дата публикации

Acoustic Apparatus And Method Of Manufacturing

Номер: US20130156235A1
Автор: Wickstrom Timothy K.
Принадлежит:

A microphone assembly comprising includes a base, at least one side wall, and a cover. The side wall is disposed on the base. The cover is coupled to the at least one side wall. The base, the side wall, and the cover form a cavity and the cavity has a MEMS device disposed therein. A top port extends through the cover and a first channel extends through the side wall. The first channel is arranged so as to communicate with the top port. A bottom port extends through the base. The MEMS device is disposed over the bottom port. A second channel is formed and extends along a bottom surface of the base. The second channel extends between and communicates with the first channel and the bottom port. Sound received by the top port is received at the MEMS device. 1. A microphone assembly comprising:a base;at least one side wall disposed on the base;a cover coupled to the at least one side wall, wherein the base, the at least one side wall, and the cover form a cavity, the cavity having a MEMS device disposed therein;a top port extending through the cover;a first channel extending through the at least one side wall, the first channel arranged so as to communicate with the top port;a bottom port extending through the base, wherein the MEMS device is disposed over the bottom port;a second channel formed and extending along a bottom surface of the base, the second channel extending between and communicating with the first channel and the bottom port;such that sound energy received by the top port passes through the first channel, the second channel, and the bottom port and is received at the MEMS device.2. The microphone assembly of wherein a solder ring claim 1 , the bottom surface of the base claim 1 , and a mounting substrate form the second channel.3. The microphone assembly of wherein the base comprises a printed circuit board.4. The microphone assembly of further comprising an integrated circuit disposed in the cavity and coupled to the MEMS device.5. The microphone ...

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Номер записи: 59
20-06-2013 дата публикации

HANDHELD COMPUTING DEVICE

Номер: US20130156242A1
Автор: Dabov Teodor, Hobson Phillip M., MONTEVIRGEN Anthony
Принадлежит: Apple Inc.

A handheld computing device is disclosed. The handheld computing device includes a seamless housing formed from an extruded metal tube. The extruded tube includes open ends and internal rails which serve as a guide for slidably assembling an operational assembly through the open ends of the extruded tube, a reference surface for positioning the operational assembly relative to an access opening in the seamless housing, and a support structure for supporting the operational assembly during use. 1. A method of mounting an electrical component to a metal frame , the method comprising:placing a first end of an electrical component within an undercut feature disposed on a first side of the frame; andsnapping the second end of the electrical component into a snap attaching feature disposed on a second side of the metal frame, the second side opposite the first side,wherein the undercut feature and the snap feature cooperate to hold the electrical component securely against the frame.2. The method as recited in claim 1 , wherein the electrical component is a printed circuit board (PCB).3. The method as recited in claim 2 , wherein an opening in the metal frame allows access to both a first surface and a second surfaces of the PCB.4. The method as recited in claim 3 , further comprising:electrically coupling the PCB to a plurality of other electrical components mounted to the metal frame with a flexible connector.5. The method as recited in claim 4 , further comprising:attaching a testing device to a connector disposed on the flexible connector; andtesting each of the attached electrical components prior to installation of the metal frame within an associated electronic device.6. The method as recited in claim 5 , wherein the metal frame can be configured to be positioned within an electronic device housing by a rail system disposed along an interior surface of the electronic device housing.7. The method as recited in claim 2 , wherein the snapping of the second end of the ...

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Номер записи: 60
20-06-2013 дата публикации

Method for Wafer-Level Surface Micromachining to Reduce Stiction

Номер: US20130157005A1
Автор: Fang Liu, Kuang Yang
Принадлежит: Analog Devices Inc

An array of microbumps with a layer or coating of non-superhydrophobic material yields a superhydrophobic surface, and may also have a contact angle hysteresis of 15 degrees or less. A surface with such an array may therefore be rendered superhydrophobic even though the surface structure and materials are not, by themselves, superhydrophobic.

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Номер записи: 61
27-06-2013 дата публикации

MEMS Tilt Sensor

Номер: US20130160547A1
Автор: Eric J. Lautenschlager, Sung Bok Lee
Принадлежит: Knowles Electronics LLC

An acoustic sensor includes a back plate; at least one back plate electrode coupled to the back plate; a proof of mass with the proof of mass elastically coupled to the back plate; and a proof of mass electrode coupled to the proof of mass. Movement of the sensor causes a capacitance between the proof of mass electrode and the at least one back plate electrode to vary and the capacitance represents a magnitude of the movement of the sensor.

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Номер записи: 62
27-06-2013 дата публикации

Tunable ultrasound transducers

Номер: US20130162102A1
Автор: Firas Sammoura, Sang-Gook Kim
Принадлежит: Masdar Institute of Science and Technology, Massachusetts Institute of Technology

A variety of micromachined structures are disclosed for use in DC-tunable ultrasound transducers.

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Номер записи: 63
27-06-2013 дата публикации

ELECTRO-ACOUSTIC TRANSDUCER AND METHOD OF MANUFACTURING THE SAME

Номер: US20130163807A1
Автор: LIN Jium Ming
Принадлежит: CHUNG HUA UNIVERSITY

An electro-acoustic transducer includes an insulative flexible substrate, a base, and a magnetic field generator. The base includes a cavity and a magnetic portion disposed below the cavity. The insulative flexible substrate is configured to cover the cavity. The magnetic field generator can be disposed on the insulative flexible substrate and corresponds to the cavity. The magnetic field generator can produce a magnetic field and a reverse magnetic field to cause the magnetic field generator and the magnetic portion of the base to attract and repel each other, thereby vibrating the insulative flexible substrate. 1. An electro-acoustic transducer comprising:an insulative flexible substrate;a base comprising a cavity covered by the insulative flexible substrate and a magnetic portion disposed below the cavity; anda magnetic field generator disposed on the insulative flexible substrate and corresponding to the cavity;wherein the magnetic field generator is configured to produce a magnetic field and a reverse magnetic field to cause the magnetic field generator and the magnetic portion of the base to attract and repel each other, thereby vibrating the insulative flexible substrate.2. The electro-acoustic transducer of claim 1 , wherein the magnetic field generator comprises a planar coil.3. The electro-acoustic transducer of claim 2 , wherein the magnetic field generator comprises a conductive adhesive.4. The electro-acoustic transducer of claim 1 , wherein the magnetic portion comprises a polymer and magnetic powder.5. The electro-acoustic transducer of claim 1 , wherein the base comprises a polymer and magnetic powder.6. The electro-acoustic transducer of claim 1 , further comprising a signal processor coupled with the magnetic field generator claim 1 , wherein the signal processor is configured to drive the magnetic field generator to produce the magnetic field and the reverse magnetic field.7. The electro-acoustic transducer of claim 6 , further comprising a ...

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Номер записи: 64
04-07-2013 дата публикации

SPEAKER UNIT

Номер: US20130170677A1
Автор: Enomoto Tsutomu
Принадлежит: SONY CORPORATION

Disclosed herein is a speaker unit, including: a magnetic circuit having a magnet and a coil; a vibrating plate adapted to be vibrated by a drive force of the magnetic circuit; and a frame having a circuit mounting portion to which the magnetic circuit is mounted, an edge mounting portion to which an edge of the vibrating plate is mounted, and plural leg portions through which the circuit mounting portion and the edge mounting portion are coupled to each other and which are provided in spaced relation to one another in a circumferential direction, wherein irregularity portions are provided in the plural leg portions, respectively, and forms of the irregularity portions are made different from each other at least in two of the leg portions. 1. A speaker unit , comprising:a magnetic circuit having a magnet and a coil;a vibrating plate adapted to be vibrated by a drive force of said magnetic circuit; and a circuit mounting portion to which said magnetic circuit is mounted,', 'an edge mounting portion to which an edge of said vibrating plate is mounted, and', 'plural leg portions through which said circuit mounting portion and said edge mounting portion are coupled to each other and which are provided in spaced relation to one another in a circumferential direction,, 'a frame having'}wherein irregularity portions are provided in said plural leg portions, respectively, and forms of said irregularity portions are made different from each other at least in two of said leg portions.2. The speaker unit according to claim 1 , wherein of the forms of said irregularity portions claim 1 , sizes are made different from each other.3. The speaker unit according to claim 1 , wherein of the forms of said irregularity portions claim 1 , shapes are made different from each other.4. The speaker unit according to claim 1 , wherein of the forms of said irregularity portions claim 1 , numbers are made different from each other.5. The speaker unit according to claim 1 , whereinsaid leg ...

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Номер записи: 65
25-07-2013 дата публикации

Acoustic sensor and method of manufacturing the same

Номер: US20130185928A1
Автор: Chang Han Je, Jaewoo Lee, Jongdae Kim, Woo Seok Yang
Принадлежит: Electronics and Telecommunications Research Institute ETRI

Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.

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Номер записи: 66
01-08-2013 дата публикации

ELECTROMECHANICAL TRANSDUCER AND METHOD FOR MANUFACTURING THE SAME WHICH SUPPRESSES LOWERING OF SENSITIVITY WHILE A PROTECTIVE LAYER IS FORMED

Номер: US20130192056A1
Автор: Chang Chienliu
Принадлежит: CANON KABUSHIKI KAISHA

An electromechanical transducer of the present invention includes a first electrode, a vibrating membrane formed above the first electrode through a gap, a second electrode formed on the vibrating membrane, and an insulating protective layer formed on a surface of the second electrode side. A region where the protective layer is not formed is present on at least part of a surface of the vibrating membrane. 1forming a first electrode;forming a vibrating membrane above the first electrode through a gap;forming a second electrode on the vibrating membrane;forming an insulating protective layer on a surface of the vibrating membrane side of the electromechanical transducer; andremoving at least part of the protective layer formed on a surface of the vibrating membrane while leaving the protective layer formed on a surface of the second electrode and a surface of wiring of the second electrode.. A method for manufacturing an electromechanical transducer comprising the steps of: The present application is a divisional of U.S. patent application Ser. No. 12/615,070, filed Nov. 9, 2009, entitled “ELECTROMECHANICAL TRANSDUCER AND METHOD FOR MANUFACTURING THE SAME WHICH SUPPRESSES LOWERING OF SENSITIVITY WHILE A PROTECTIVE LAYER IS FORMED”, the content of which is expressly incorporated by reference herein in its entirety. Further, the present application claims priority from Japanese Patent Application No. 2008-295799, filed Nov. 19, 2008, which is also hereby incorporated by reference herein in its entirety.1. Field of the InventionThe present invention relates to an electromechanical transducer and a method for manufacturing the electromechanical transducer.2. Description of the Related ArtCapacitive electromechanical transducers manufactured using a micromachining step have been actively investigated in recent years. A typical capacitive electromechanical transducer includes a lower electrode as a first electrode, a vibrating membrane supported so as to maintain a certain ...

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Номер записи: 67
01-08-2013 дата публикации

CROSSOVER DOUBLE SPEAKER

Номер: US20130195293A1
Автор: KO Ju-Heon
Принадлежит: Youngbo Engineering Industries, Inc.

Disclosed is a crossover double speaker having a small speaker and a large speaker on the upper side and on the lower side thereof. The crossover double speaker includes a cover integrally formed on the outer circumference of a flange of the yoke; a frame disposed below the cover; a first speaker unit including a first magnet disposed in a first speaker space, a first vibration plate arranged over the first magnet, and a first voice coil inserted into a first air gap; and a second speaker unit including a second magnet disposed in a second speaker space, a second vibration plate arranged between the yoke and the frame, and a second voice coil inserted into a second air gap. The yoke has sound release holes to output the sound generated from the second speaker unit in the direction of the first speaker unit. 1. A crossover double speaker , which includes a yoke of a roughly U shape having a bottom , a cylinder portion integrally formed on the outer circumference of the bottom , and a flange extending outward from the top end of the cylinder portion; a first speaker unit having a first magnet arranged in a first speaker space provided by the bottom and the cylinder portion of the yoke; and a second speaker unit having a second magnet arranged in a second speaker space provided below the yoke , wherein a sound generated from the second speaker unit of the lower side is outputted in the direction of the first speaker unit , the crossover double speaker comprising:a cover which is integrally formed on the outer circumference of a flange of the yoke and extends downward from the flange of the yoke at a predetermined interval radially so as to surround the cylinder portion of the yoke that provides the first speaker space therein; anda frame which is disposed below the cover so as to provide the second speaker space,wherein the first speaker unit comprises a first magnetic plate attached to the top face of the first magnet, a first vibration plate in which the outer ...

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Номер записи: 68
08-08-2013 дата публикации

SYSTEMS AND METHODS FOR IMPROVED ACOUSTO-HAPTIC SPEAKERS

Номер: US20130202134A1
Автор: Afshar Shahriar S.
Принадлежит: IMMERZ, INC.

The systems and methods described herein relate to, among other things, a transducer capable of producing acoustic and tactile stimulation. The transducer includes a rigid mass element disposed on the diaphragm of a speaker. The mass element may optionally be removable and may have a mass selected such that the resonant frequency of the transducer falls within the range of frequencies present in an input electrical audio signal. The systems and methods advantageously benefits from both the fidelity and audio performance of a full-range speaker while simultaneously producing high-fidelity, adjustable and palpable haptic vibrations. 1. A transducer capable of generating acoustic and haptic signals , comprising:a speaker, including a diaphragm, configured to transform an electrical signal having audio information in a first range of frequencies, into an acoustic signal,an echo chamber formed adjacent to the diaphragm, anda mass element attached to the diaphragm,wherein the mass of the mass element is selected such that a portion of a resonant frequency range of the combination of the speaker and the mass element falls within the first range of frequencies.2. The transducer of claim 1 , wherein the diaphragm is substantially rigid and the speaker further comprises a semi-rigid diaphragm attached to a voice coil and rigid diaphragm claim 1 , such that the echo chamber is formed in the region enclosed by the semi-rigid diaphragm and the rigid diaphragm.3. The transducer of claim 2 , wherein the rigid diaphragm is cone-shaped and the semi-rigid diaphragm is substantially hemispherical shaped.4. The transducer of claim 1 , wherein the mass element is removably attached to the diaphragm.5. The transducer of claim 1 , wherein the mass element is glued to the center region of the diaphragm.6. The transducer of claim 1 , wherein the mass element is formed from a rigid material having a mass in the range of about 0.1 g to 20 g.7. The transducer of claim 1 , wherein the mass ...

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Номер записи: 69
15-08-2013 дата публикации

METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS

Номер: US20130207519A1
Автор: Chaggares N. Christopher, Reider Eric
Принадлежит:

The invention features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the inventions provides methods of patterning electrodes, e.g., in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layer for an ultrasound transducer. The invention also features ultrasound transducers produced by the methods described herein. 1. A method for producing electrodes in a pattern , said method comprising the steps of:(a) providing an electrical component comprising a first plurality of electrodes;(b) placing a connector comprising a second plurality of electrodes in proximity to the electrical component;(c) depositing a composite dielectric material comprising a matrix material and a particulate material on the first plurality of electrodes and the second plurality of electrodes, wherein the matrix material is laser ablated at a lower fluence than the particulate material;(d) laser ablating at least a portion of the composite dielectric material to remove matrix material and increase the surface area of the composite dielectric material; laser ablating the composite dielectric material to expose the first plurality of electrodes and the second plurality of electrodes; and laser ablating a trench in the composite dielectric material from each of the first plurality of electrodes to a corresponding electrode of the second plurality;(e) depositing a conductive metal on areas ablated in step (d);(f) depositing a resist on the conductive metal, wherein the resist is thicker over the first plurality of electrodes, the second plurality of electrodes, and the trenches compared to other ablated areas; and(g) removing a portion of the resist to expose a portion of the conductive metal in a negative pattern and etching the exposed portion of the conductive metal to produce the electrodes in the pattern.2. The method of claim 1 , further ...

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Номер записи: 70
12-09-2013 дата публикации

Electret-Based Accelerometer

Номер: US20130233078A1
Автор: Michael J. Sinclair
Принадлежит: Microsoft Corp

An electret accelerometer is provided in which a diaphragm, an electret, a back plate and an electronic circuit are placed in a sealed casing to prevent external acoustic signals from reaching the diaphragm.

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Номер записи: 71
19-09-2013 дата публикации

Method of Assembling a Cordless Hand-Held Ultrasonic Cautery Cutting Device

Номер: US20130239402A1
Автор: Bales, Deville Derek Dee, Jr. Thomas O., Palmer Matthew A., Smith Kevin W.
Принадлежит: Covidien AG

A method for assembling an ultrasonic surgical device includes the steps of rotatably freely connecting an ultrasonic waveguide to an ultrasonic surgical handle body, the ultrasonic waveguide having a proximal coupling end, substantially simultaneously removably coupling an ultrasonic-driving-wave-signal generating circuit to the ultrasonic surgical handle body and removably inserting an ultrasonic-movement-producing distal end of a cordless, rotatably free ultrasonic transducer into the ultrasonic surgical handle body opposite the proximal coupling end of the ultrasonic waveguide, and rotating the ultrasonic waveguide with respect to the ultrasonic transducer to fixedly couple the ultrasonic waveguide to the ultrasonic-movement-producing distal end of the ultrasonic transducer. 1. A method for assembling an ultrasonic surgical device , the method comprising:rotatably freely connecting an ultrasonic waveguide to an ultrasonic surgical handle body, the ultrasonic waveguide having a proximal coupling end; removably coupling an ultrasonic-driving-wave-signal generating circuit to the ultrasonic surgical handle body; and', 'removably inserting an ultrasonic-movement-producing distal end of a rotatably free, cordless ultrasonic transducer into the ultrasonic surgical handle body opposite the proximal coupling end of the ultrasonic waveguide, the ultrasonic transducer being operable to dynamically produce a resonant wave along the ultrasonic waveguide when coupled thereto; and, 'substantially simultaneouslyrotating the ultrasonic waveguide with respect to the ultrasonic transducer to fixedly couple the ultrasonic waveguide to the ultrasonic-movement-producing distal end of the ultrasonic transducer.2. The method according to claim 1 , which further comprises providing the ultrasonic-driving-wave-signal generating circuit and the cordless claim 1 , rotatably free ultrasonic transducer within a shell of an ultrasonic-movement-generator assembly to expose a proximal end of ...

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Номер записи: 72
19-09-2013 дата публикации

MULTI-ARRAY ULTRASONIC PROBE APPARATUS AND METHOD FOR MANUFACTURING MULTI-ARRAY PROBE APPARATUS

Номер: US20130242705A1
Автор: CHO Kyung II, KIM Bae Hyung, KIM Dong Wook, KIM Young-Il, LEE Seung Heun, SONG Jong Keun
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam. 1. A multi-array ultrasonic probe apparatus , comprising:n tiles which transmit and receive ultrasonic beams; anda substrate comprising n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array.2. The apparatus of claim 1 , wherein the substrate further comprises:n adhesive portions which are disposed underneath the n guide portions and comprise an adhesive material that attaches the n tiles to the substrate.3. The apparatus of claim 2 , wherein the substrate further comprises:n outlets which discharge, to an outside of the substrate, an excess of the adhesive material when the n tiles are being mounted on the n guide portions.4. The apparatus of claim 2 , wherein widths of the n guide portions are wider than widths of corresponding n adhesive portions.5. The apparatus of claim 2 , wherein each of the n guide portions has identical heights claim 2 , andeach of the n adhesive portions has identical heights.6. The apparatus of claim 2 , wherein:the n guide portions are disposed in a matrix on the substrate with a first predetermined gap between adjacent guide portions to separate the adjacent guide portions from one another, andthe n adhesive portions are disposed in a matrix on the substrate with a second predetermined gap between adjacent adhesive portions to separate the adjacent adhesive portions from one another.7. The apparatus of claim 1 , wherein widths of the n guide portions are wider than widths of the n tiles by a ...

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Номер записи: 73
26-09-2013 дата публикации

CUSTOM IN-EAR MONITOR

Номер: US20130251161A1
Автор: Lott Phillip Dale
Принадлежит:

An in-ear monitor that can be customized for particular applications and individuals includes a housing formed from a body and a cover. A dynamic driver is mounted in a cavity in the housing on an angled mounting flange. The dynamic driver is acoustically coupled to a trumpet-shaped sound collector. The trumpet-shaped sound collector is coupled to a main sound bore that exits an opening in a nozzle portion of the body that is inserted into the ear canal of a user. An ambient sound port collects ambient sound and couples it to the sound bore. An additional bass post increases the bass response of the monitor. Ear impressions are used to customize the body of the monitor to the ear of a user and the location of the bass and ambient sound ports can be altered for different applications. 1. An in-ear monitor , said in-ear monitor comprising:a housing having a cover and a body;a trumpet-shaped sound collector;a main sound bore acoustically coupled to said trumpet-shaped sound collector;a nozzle having a nozzle opening in said body acoustically coupled to said main sound bore;a bass sound port acoustically coupled to said nozzle opening;an ambient sound port acoustically coupled to said nozzle opening; anda dynamic driver acoustically coupled to said trumpet shaped sound collector.2. The in-ear monitor of wherein said bass sound port further comprises a bass port valve that selectively restricts a sound flow through said bass sound port.3. The in-ear monitor of wherein said ambient sound port further comprises an ambient port valve that selectively restricts a sound flow through said ambient sound port.4. The in-ear monitor of wherein said nozzle includes a recessed channel and a sealing o-ring positioned on a tip of said nozzle.5. The in-ear monitor of further comprising a recessed cable connector.6. The in-ear monitor of further comprising a balanced armature receiver positioned inside said main sound bore.7. The in-ear monitor of wherein said dynamic driver further ...

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Номер записи: 74
17-10-2013 дата публикации

SPEAKER

Номер: US20130272537A1
Автор: Ito Ryo, Tada Arata
Принадлежит: Alpine Electronics, Inc.

A speaker includes a magnetic circuit, a voice coil, and a diaphragm which are disposed in a case. The case is placed in an engine compartment of an automobile. Reproduced sound is emitted through a duct protruding outward from the case. A partition wall, which is a metal body frame of the automobile, is present between the engine compartment and the cabin space. The duct is inserted into a hole formed in the partition wall so that a sound port faces and protrudes into the cabin space. A heat dissipation port is formed in the case, and an end surface the magnetic circuit facing the partition wall is exposed in the heat dissipation port. An elastically deformable thermal conductive sheet is sandwiched between the partition wall and the end surface of the magnetic circuit. 1. A speaker comprising:a magnetic circuit having a magnetic gap;a voice coil disposed in the magnetic gap;a diaphragm that vibrates together with the voice coil;a case in which the magnetic circuit, the voice coil, and the diaphragm are disposed; anda duct protruding from the case, the duct including a sound port that is a distal open end of the duct, the sound port facing and protruding into an acoustic space,wherein the case is disposed in an outer space that is separated from the acoustic space by a partition wall made of a metal,wherein the speaker is installed in such a way that the duct is inserted into a hole that is formed in the partition wall, andwherein a heat dissipation port in which an end surface of the magnetic circuit facing the partition wall is exposed is formed in the case, and an elastically deformable thermal conductive sheet is inserted into the heat dissipation port so as to be sandwiched between the partition wall and the end surface of the magnetic circuit facing the partition wall when the speaker is attached to the partition wall.2. The speaker according to claim 1 ,wherein the thermal conductive sheet is a silicone-based thermal conductive sheet.3. The speaker according ...

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Номер записи: 75
31-10-2013 дата публикации

ULTRASOUND TRANSDUCER ARRAY, METHOD OF MANUFACTURING ULTRASOUND TRANSDUCER ARRAY AND ULTRASOUND ENDOSCOPE

Номер: US20130286786A1
Автор: HASEGAWA Mamoru, HIRAOKA Jin, KARAKI Kazuhisa, MATSUMOTO Kazuya, WAKABAYASHI Katsuhiro, YOSHIDA Satoshi
Принадлежит:

An ultrasound transducer array according to an embodiment includes a substrate, a plurality of groove-like recesses arranged at a predetermined interval on one surface of the substrate, a cell region arranged between the recesses on the one surface side of the substrate, a flexible film configured to cover the substrate and the cell region and having fragility lower than fragility of the substrate, and a dividing groove having a width smaller than a width of the recess and reaching from the other surface of the substrate to the flexible film in the recess. 1. An ultrasound transducer array comprising:a substrate;a plurality of linear groove-like recesses arranged at a predetermined interval on one surface of the substrate;a cell region arranged between the recesses on the one surface of the substrate and formed by at least one ultrasound transducer cell;a flexible film configured to cover the substrate and the cell region on the one surface side of the substrate and having fragility lower than fragility of the substrate; anda dividing groove having a width smaller than a width of the recess and reaching from the other surface of the substrate to the flexible film in the recess.2. The ultrasound transducer array according to claim 1 , whereinthe dividing groove has the width smaller than the width of the recess and has a sidewall portion, and a bottom surface portion formed by forming a groove,the bottom surface portion has a shape in which an interval of extended portions of the sidewall portion decreases to be smaller than the width toward a depth direction of the groove, anda boundary between the sidewall portion and the bottom surface portion is located in the recess.3. The ultrasound transducer array according to claim 1 , wherein a low fragility material having fragility lower than fragility of the substrate is arranged in the recess.4. The ultrasound transducer array according to claim 3 , wherein the low fragility material and the flexible film are formed of ...

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Номер записи: 76
07-11-2013 дата публикации

METHOD FOR PRODUCING AN EARPIECE WITH A VENT

Номер: US20130291370A1
Автор: BOLTYENKOV ARTEM
Принадлежит:

The production of an earpiece for a hearing apparatus and in particular for a hearing device is closely tailored to the simulation. To this end, the earpiece of a hearing apparatus to be inserted into an auditory canal is produced by first selecting a virtual raw vent and manufacturing the earpiece with a real vent. A base frequency of the acoustic transmission function of the virtual raw vent is determined. From that, a virtual vent is determined as a function of the base frequency and of at least one predetermined property of the auditory canal or of the earpiece. The earpiece is then manufactured on the basis of the virtual vent. 1. A method of producing an earpiece of a hearing apparatus to be inserted into an auditory canal , the method which comprises:selecting a virtual raw vent;determining a base frequency of an acoustic transmission function of the virtual raw vent;determining a virtual vent as a function of the base frequency and of at least one predetermined property of the auditory canal or of the earpiece; andmanufacturing the earpiece with a real vent on a basis of the virtual vent.2. The method according to claim 1 , wherein the virtual raw vent is selected with a circular cross-section.3. The method according to claim 1 , which comprises selecting the virtual raw vent with adjustment software for adjusting the hearing apparatus to a hearing ability of a user.4. The method according to claim 3 , which comprises inputting data relating to the vent and using the data by the adjustment software to adjust to the hearing ability of a user.5. The method according to claim 1 , which comprises substituting a determination of an acoustic mass of the virtual raw vent for a determination of the base frequency claim 1 , and defining the virtual vent in dependence on the acoustic mass.6. The method according to claim 1 , wherein the at least one predetermined property of the ear-piece is the location or the course of the virtual vent in the earpiece.7. The method ...

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Номер записи: 77
14-11-2013 дата публикации

Flexible stop for an acceleration sensor

Номер: US20130299923A1
Автор: Guenther-Nino-Carlo Ullrich, Jochen Reinmuth, Johannes Classen
Принадлежит: ROBERT BOSCH GMBH

A micromechanical acceleration sensor includes a seismic mass and a substrate that has a reference electrode. The seismic mass is deflectable in a direction perpendicular to the reference electrode, and the seismic mass has a flexible stop in the deflection direction. The flexible stop of the seismic mass includes an elastic layer.

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Номер записи: 78
21-11-2013 дата публикации

Microelectromechanical component and method for testing a microelectromechanical component

Номер: US20130305804A1
Автор: Bernd Burchard, Michael Doelle
Принадлежит: ELMOS SEMICONDUCTOR SE, Silicon Microstructures Inc

The microelectromechanical component has a semiconductor substrate ( 1 ), which has a cavity ( 2 a ) formed in the semiconductor substrate. The cavity is covered by a reversibly deformable membrane ( 2 ). A sensor ( 17 ) for detecting a deformation of the membrane ( 2 ) is formed within the region of the membrane ( 2 ). A test actuator ( 28, 29, 30 ) for deforming the membrane ( 2 ) for testing purposes is also arranged within the region of the membrane ( 2 ). Finally, the microelectromechanical component has an evaluation and activation unit ( 41 ) connected to the sensor ( 17 ) and the test actuator ( 28, 29, 30 ) for activating the test actuator ( 28, 29, 30 ) in order to deform the membrane ( 2 ) as a test and for evaluating a measurement signal of the sensor ( 17 ) as a sensor detection of a deformation of the membrane ( 2 ) as a result of the activation of the test actuator ( 28, 29, 30 ).

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Номер записи: 79
05-12-2013 дата публикации

ULTRASONIC TRANSDUCER FOR PARAMETRIC ARRAY

Номер: US20130322216A1
Автор: Pompei Frank Joseph
Принадлежит:

An ultrasonic transducer having a reduced cost of manufacture. The ultrasonic transducer includes a first insulative retaining layer, a second insulative retaining layer, and a vibrator film layer sandwiched between the first and second retaining layers. The first retaining layer includes a first plurality of apertures formed therethrough, and the second retaining layer includes a second plurality of apertures formed therethrough, in which the second apertures are substantially in registration with the first apertures. The ultrasonic transducer further includes a first cover portion having a plurality of spring/backplate assemblies connected thereto, and a second cover portion. The combination of the first retaining layer, the vibrator film layer, and the second retaining layer is sandwiched between the first and second cover portions of the ultrasonic transducer. The laminated construction of the ultrasonic transducer allows the formation of an array of ultrasonic film transducers using a single piece of ultrasonic vibrator film. 1. An ultrasonic transducer , comprising:a vibrator surface operative to generate one or more ultrasonic compression waves; anda protective cover disposed on one side of the vibrator surface to allow the ultrasonic compression waves to pass therethrough,wherein the protective cover and the vibrator surface are spaced apart a predetermined distance sufficient to minimize absorption and transmission losses due to the protective cover.2. The ultrasonic transducer of further comprising:a spacer element operative to maintain the protective cover and the vibrator surface spaced apart at the predetermined distance.3. The ultrasonic transducer of wherein the protective cover and the vibrator surface are spaced apart by the predetermined distance to minimize absorption and transmission losses for a specified carrier frequency of the ultrasonic transducer.4. The ultrasonic transducer of wherein the protective cover and the vibrator surface are ...

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Номер записи: 80
05-12-2013 дата публикации

Micro-electro-mechanical system microphone chip with expanded back chamber

Номер: US20130322661A1
Автор: Chun-Chieh Wang, Hung-Jen Chen, Kuan-Hsun Chiu, Min-Li Hsu
Принадлежит: Merry Electronics Co Ltd

A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed. above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with. a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.

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Номер записи: 81
12-12-2013 дата публикации

Systems and Methods for Reducing Stray Magnetic Flux

Номер: US20130329910A1
Автор: Crosby Justin D., LEGGETT William F., Yap Derek J.
Принадлежит:

Systems and methods for reducing the effects of stray magnetic flux are provided. For example, an electronic device can employ the system and can include a first audio component configured to have a first acoustic phase and a first magnetic phase. The electronic device can also include a second audio component configured to have the first acoustic phase and a second magnetic phase that is opposite the first magnetic phase. The first audio component can be positioned with respect to the second audio component, such that any stray magnetic flux from the first audio component enters the second audio component during operation of the first and second audio components. 1. An electronic device comprising:a first audio component configured to have a first acoustic phase and a first magnetic phase; anda second audio component configured to have the first acoustic phase and a second magnetic phase that is opposite the first magnetic phase, the first audio component being positioned with respect to the second audio component such that stray magnetic flux from the first audio component enters the second audio component during operation of the first and second audio components.2. The electronic device of claim 1 , wherein at least one of the first and second audio components is a loudspeaker.3. The electronic device of claim 1 , wherein the first audio component is positioned adjacent the second audio component.4. The electronic device of further comprising:a hall effect sensor.5. The electronic device of claim 4 , wherein the hall effect sensor is disposed between the first audio component and the second audio component.6. The electronic device of claim 1 , wherein the first audio component comprises a first magnet being oriented to provide the first magnetic phase.7. The electronic device of claim 6 , wherein the first magnet is oriented to provide the first magnetic phase.8. The electronic device of claim 7 , wherein the second audio component comprises a second magnet being ...

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Номер записи: 82
19-12-2013 дата публикации

SENSOR AND A SENSOR SYSTEM

Номер: US20130336095A1
Автор: Seppä Heikki, Sillanpaa Teuvo, Viikari Ville
Принадлежит: TEKNOLOGIAN TUTKIMUSKESKUS VTT

The invention relates to a sensor and a system for measuring pressure, variation in sound pressure, a magnetic field, acceleration, vibration, or the composition of a gas. The sensor comprises an ultrasound transmitter, a cavity, and a passive sensor element. In accordance with the invention the sensor includes antenna means for receiving radio frequency signals (f, f), and connecting means connecting the antenna to the ultrasound transmitter for using the radio frequency signals for providing energy for driving the ultrasound transmitter. 1. A wireless sensor which comprises;an electrostatically actuated ultrasound transmitter loaded with a fluid-filled cavity, andan antenna or a coupling element matched to the ultrasound transmitter.2. A wireless sensor in for measuring pressure , variation in sound pressure , a magnetic field , acceleration , vibration , strain , stress , torque , temperature , electric field , electromagnetic radiation , viscosity of fluid , specific heat capacity of fluid , fluid flow , or the composition of a gas , comprising;an ultrasound transmitter having a light-construction diaphragm oscillator which is well connected to the surrounding medium,a cavity arranged in connection with the ultrasound transmitter which affects the mechanical impedance of the ultrasound transmitter,{'sub': 1', '2, 'claim-text': {'sub': 1', '2', '3, 'wherein the antenna for receiving radio frequency signals (f, f) is capable of acting as means for sending radio frequency signals (f) based on the interaction between the ultrasound transmitter and the cavity.'}, 'a sensor having a passive sensor element located at the opposite end of the cavity to the ultrasound transmitter or a means to allow a measured fluid inside the cavity, an antenna for receiving radio frequency signals (f, f), and a connecting means connecting the antenna to the ultrasound transmitter for using the radio frequency signals for providing energy for driving the ultrasound transmitter,'}3. A ...

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Номер записи: 83
26-12-2013 дата публикации

PACKAGING OF ACOUSTIC VOLUME INCREASING MATERIALS FOR LOUDSPEAKER DEVICES

Номер: US20130341118A1
Автор: Jagsich Thomas, Papakyriacou Maria, STEINHAUSER Markus
Принадлежит: KNOWLES ELECTRONICS ASIA PTE. LTD.

There is provided an acoustic element () for placement in a sound path () of a loudspeaker device (), the acoustic element () comprising a container() and an acoustic volume increasing material() located in the container (). In an embodiment, the container () comprises wall portions with different physical characteristics. In other embodiments, the walls of the container () are made of the same material. 1. An acoustic element for placement in a sound path of a loudspeaker device , the acoustic element comprising:a container; andan acoustic volume increasing material located in the container.2. The acoustic element according to claim 1 , wherein the container comprises a first wall portion and a second wall portion claim 1 , the second wall portion having a physical characteristic different from the respective physical characteristic of the first wall portion.3. The acoustic element according to claim 2 , wherein the sound transmissibility of the first wall portion is higher than the sound transmissibility of the second wall portion.4. The acoustic element according to claim 2 , wherein the second wall portion is formed of a molded element.5. The acoustic element according to claim 2 , wherein:the second wall portion is cup-shaped, forming an opening; andthe first wall portion closes the opening.6. The acoustic element according to claim 1 , whereinthe container comprises a container wall that encloses a cavity containing the acoustic volume increasing material; andthe container wall is formed of a single wall material.7. The acoustic element according to claim 6 , whereinthe container wall is formed of a single sheet of the wall material; andthe single sheet of the wall material is folded to form the container).8. The acoustic element according to claim 1 , wherein the container has a predetermined three-dimensional shape.9. The acoustic element according to claim 1 , wherein the container being is at least partially formed of a filter material.10. A loudspeaker ...

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Номер записи: 84
02-01-2014 дата публикации

Mems pressure sensor and manufacturing method therefor

Номер: US20140001579A1
Автор: Lianjun Liu
Принадлежит: MEMSEN ELECTRONICS INC

A Micro Electromechanical System (MEMS) pressure sensor may include a first substrate provided with a sensitive diaphragm of a capacitive pressure sensing unit, an electrical connecting layer and a first bonding layer on a surface of the first substrate; and a second substrate provided with an inter-conductor dielectric layer, a conductor connecting layer in the inter-conductor dielectric layer and/or a second bonding layer on a surface of the second substrate. The second substrate is arranged opposite to the first substrate, and the second substrate is fixedly coupled to the first substrate via the first bonding layer and the second bonding layer; a pattern of the first bonding layer is corresponding to a pattern of the second bonding layer, and both the first bonding layer and the second bonding layer are formed of a conductive material.

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Номер записи: 85
02-01-2014 дата публикации

MEMS MICROPHONE AND FORMING METHOD THEREFOR

Номер: US20140003633A1
Автор: Liu Lianjun
Принадлежит: MEMSEN ELECTRONICS INC

A micro-electro-mechanical system (MEMS) microphone and a forming method therefore. The MEMS microphone comprises: a first substrate, the first substrate is provided with a first bonding face, the first substrate comprises an MEMS microphone component and a first conductive bonding structure arranged on the first bonding face, a second substrate, the second substrate is provided with a second bonding face, the second bonding substrate comprises a circuit and a second conductive bonding structure arranged on the second bonding face; the first substrate and the second substrate are oppositely fitted together via the first conductive bonding structure and the second conductive bonding structure. Embodiments of the present invention have a simple packaging technique and a compact size; the MEMS microphone packaging structure formed has a great performance on signal-to-noise ratio, and a great anti-interference capability 1. A MEMS microphone , comprising:a first base-structure having a first bonding surface and comprising a MEMS microphone component and a first conductive bonding structure, with the first conductive bonding structure having the first bonding surface; anda second base-structure having a second bonding surface and comprising a circuit and a second conductive bonding structure, with the second conductive bonding structure having the second bonding surface;wherein the first base-structure is bonded correspondingly to the second base-structure via the first conductive bonding structure and the second conductive bonding structure.2. The MEMS microphone according to claim 1 , wherein the MEMS microphone component comprises a sensitive diaphragm and a fixed electrode corresponding to the sensitive diaphragm.3. The MEMS microphone according to claim 2 , further comprising: a first structure located in the first base-structure claim 2 , wherein the first structure is a first opening or a first air cavity.4. The MEMS microphone according to claim 3 , wherein the ...

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Номер записи: 86
02-01-2014 дата публикации

Polymer speaker

Номер: US20140003634A1
Автор: Hitoshi Yoshikawa, Katsuhiko Nakano, Mitsuyoshi Kondo, Takamasa Ito
Принадлежит: Sumitomo Riko Co Ltd

A polymer speaker is configured to include an electrostrictive element having an elastomer or resin dielectric layer and a plurality of electrode layers arranged on the front and back surfaces of the dielectric layer. The electrode layers are formed from a conductive material including a polymer binder and a conductor and having a modulus of elasticity of 100 MPa or less. The spring constant of the electrode layers in the surface direction is smaller than the spring constant of the dielectric layer in the surface direction. The volume resistivity of the electrode layers is 200 Ω·cm or less. The polymer speaker provides a practical sound pressure in a wide frequency region from low frequencies to high frequencies.

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Номер записи: 87
09-01-2014 дата публикации

Capacitive transducer

Номер: US20140007693A1
Автор: Kazutoshi Torashima, Takahiro Akiyama
Принадлежит: Canon Inc

Provided is a capacitive transducer including an element including a plurality of cells: each of the plurality of cells including: a first electrode; and a vibrating film including a second electrode, the second electrode being opposed to the first electrode with a gap; and a vibrating film supporting portion that supports the vibrating film so as to form the gap, in which the element includes a first cell and a second cell, the first cell including the vibrating film having a first spring constant, the second cell including the vibrating film having a second spring constant lower than the first spring constant; and a voltage to be applied between the first electrode and the second electrode of the first cell is higher than a voltage to be applied between the first electrode and the second electrode of the second cell.

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Номер записи: 88
09-01-2014 дата публикации

CAPACITIVE TRANSDUCER

Номер: US20140010052A1
Автор: Akiyama Takahiro, Torashima Kazutoshi
Принадлежит:

Provided is a capacitive transducer having a wide frequency band width and an improved transmitting and receiving sensitivity, the capacitive transducer including an element including a plurality of cells: each of the plurality of cells including: a first electrode; a vibrating film including a second electrode, the second electrode being opposed to the first electrode with a gap; and a supporting portion that supports the vibrating film, in which the element includes a first cell and a second cell as the cell, the first cell including the vibrating film having a first spring constant, the second cell including the vibrating film having a second spring constant smaller than the first spring constant; and a distance between the first electrode and the second electrode of the first cell is smaller than a distance between the first electrode and the second electrode of the second cell. 1. A capacitive transducer comprising an element comprising a plurality of cells , a first electrode;', 'a vibrating film comprising a second electrode, the second electrode being opposed to the first electrode with a gap; and', 'a supporting portion that supports the vibrating film so as to form the gap,, 'each of the plurality of cells comprisingwherein the element comprises a first cell and a second cell as the cell, the first cell comprising the vibrating film having a first spring constant, the second cell comprising the vibrating film having a second spring constant smaller than the first spring constant, andwherein a distance between the first electrode and the second electrode of the first cell is smaller than a distance between the first electrode and the second electrode of the second cell.2. The capacitive transducer according to claim 1 , wherein the vibrating film of the first cell has a thickness larger than a thickness of the vibrating film of the second cell claim 1 , and the vibrating film of the first cell has an area equal to an area of the vibrating film of the second ...

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Номер записи: 89
16-01-2014 дата публикации

Mems device

Номер: US20140016798A1
Автор: Anthony Traynor, Richard Ian Laming
Принадлежит: Wolfson Microelectronics plc

A method of fabricating a micro-electrical-mechanical system (MEMS) apparatus on a substrate comprises the steps of processing the substrate so as to fabricate an electronic circuit; depositing a first electrode that is operably coupled with the electronic circuit; depositing a membrane so that it is mechanically coupled to the first electrode; applying a sacrificial layer; depositing a structural layer and a second electrode that is operably coupled with the electronic circuit so that the sacrificial layer is disposed between the membrane and the structural layer so as to form a preliminary structure; singulating the substrate; and removing the sacrificial layer so as to form a MEMS structure, in which the step of singulating the substrate is carried out before the step of removing the sacrificial layer.

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Номер записи: 90
23-01-2014 дата публикации

Microfabrication of High Quality Three Dimensional Structures Using Wafer-Level Glassblowing of Fused Quartz and Ultra Low Expansion Glasses

Номер: US20140021561A1
Автор: Alexander A. Trusov, Andrei M. Shkel, Doruk Senkal
Принадлежит: UNIVERSITY OF CALIFORNIA

A high temperature micro-glassblowing process and a novel inverted-wineglass architecture that provides self-aligned stem structures. The fabrication process involves the etching of a fused quartz substrate wafer. A TSG or fused quartz device layer is then bonded onto the fused quartz substrate, creating a trapped air pocket or cavity between the substrate and the TSG device layer. The substrate and TSG device layer 14 are then heated at an extremely high temperature of approximately 1700° C., forming an inverted wineglass structure. Finally, the glassblown structure is cut or etched from the substrate to create a three dimensional wineglass resonator micro-device. The inverted wineglass structure may be used as a high performance resonator for use as a key element in precision clock resonators, dynamic MEMS sensors, and MEMS inertial sensors.

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Номер записи: 91
23-01-2014 дата публикации

Microelectromechanical gyroscope with enhanced rejection of acceleration noises

Номер: US20140021564A1
Автор: Gabriele CAZZANIGA, Giacomo Calcaterra, Luca Coronato
Принадлежит: STMICROELECTRONICS SRL

An integrated microelectromechanical structure is provided with a driving mass, anchored to a substrate via elastic anchorage elements and designed to be actuated in a plane with a driving movement; and a first sensing mass and a second sensing mass, suspended within, and coupled to, the driving mass via respective elastic supporting elements so as to be fixed with respect thereto in said driving movement and to perform a respective detection movement in response to an angular velocity. In particular, the first and the second sensing masses are connected together via elastic coupling elements, configured to couple their modes of vibration.

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Номер записи: 92
30-01-2014 дата публикации

ULTRASONIC TRANSDUCER

Номер: US20140026396A1
Автор: REICHE Martin
Принадлежит: ROBERT BOSCH GMBH

An ultrasonic transducer includes: a diaphragm pot that has a surrounding wall; a transducer element mounted in a diaphragm pot on a transducer section on an inner side of the diaphragm for generating the ultrasonic vibrations; a first damping element situated in the diaphragm pot on transducer element for damping the diaphragm; and a second damping element situated within the diaphragm pot in an edge section of the diaphragm around the transducer element for damping vibrations of the wall; the second damping element being connected with force locking, at least section by section, both to the edge section and to the inner side of the wall. 118-. (canceled)19. A method for manufacturing an ultrasonic transducer having: a diaphragm pot having a surrounding wall and a diaphragm; a transducer element; a first damping element and a second damping element , the method comprising:inserting the second damping element into the diaphragm pot, the second damping element being connected in a force-locking manner to an inner surface of the surrounding wall of the diaphragm pot and to an edge region of an inner side of the diaphragm in the diaphragm pot; andfitting the first damping element into a through hole of the second damping element.20. The method according to claim 19 , further comprising:closing the diaphragm pot using a third damping element.21. The method as recited in claim 19 , further comprising:removably mounting, before the insertion of the second damping element, a core having the shape and the dimensions of the first damping element on the transducer element, wherein the second damping element is introduced as a castable material into a region between the core and the inner surface of the surrounding wall of the diaphragm pot; andremoving the core to form the through hole, after the curing of the second damping element.22. A method for manufacturing an ultrasonic transducer having: a diaphragm pot having a surrounding wall and a diaphragm; a transducer element; ...

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Номер записи: 93
06-02-2014 дата публикации

Microphone and Method to Position a Membrane Between Two Backplates

Номер: US20140037121A1
Автор: Mortensen Dennis
Принадлежит: EPCOS AG

A microphone includes two backplates. A membrane is located between the two backplates. A voltage source applies a first bias voltage to the membrane and the first backplate and applies a second bias voltage to the membrane and the second backplate. A control unit adjusts the first and the second bias voltage. A method to center the membrane in a final electro-mechanic equilibrium position between the two backplates in a microphone is also disclosed. 114-. (canceled)15. A microphone comprising:first and second backplates;a membrane located between the first and second backplates;a voltage source configured to apply a first bias voltage to the membrane and the first backplate and a second bias voltage to the membrane and the second backplate; anda control unit configured to adjust the first and the second bias voltage.16. The microphone according to claim 15 , wherein the voltage source comprises a first voltage source configured to apply the first bias voltage to the membrane and the first backplate and a second voltage source configured to apply the second bias voltage to the membrane and the second backplate.17. The microphone according to claim 15 , wherein the control unit comprises an adjustable voltage pump.18. The microphone according to claim 15 , further comprising a measurement circuit configured to measure a collapse voltage between the membrane and the first backplate and a collapse voltage between the membrane and the second backplate.19. The microphone according to claim 15 , further comprising a measurement circuit configured to measure a capacitance between the membrane and the first backplate and a further capacitance between the membrane and the second backplate.20. The microphone according to claim 15 , wherein the microphone is a MEMS microphone.21. The microphone according to claim 15 ,wherein the membrane and the first and second backplates are realized on a first chip;wherein the control unit and the voltage source are integrated in an ...

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Номер записи: 94
13-02-2014 дата публикации

FLAT TYPE SPEAKER HAVING DAMPER-LEAD PLATE OF PCB VOICE COIL PLATE

Номер: US20140044287A1
Автор: Kim Dong-Man, Kwon Yong-Ji
Принадлежит: EXELWAY INC.

The present invention relates to a flat type speaker, and more particularly, to a flat type speaker having a damper-lead plate of a PCB voice coil plate, which improves the quality deterioration due to the reduction of production process and the disconnection of a lead wire, by being attached to the top of a voice coil plate, increases vibration efficiency, and eliminates the lead wire connection of the voice coil. The flat type speaker having a damper-lead plate of a PCB voice coil plate according to the present invention comprises: a pair of magnetic bodies having a magnet and a yoke formed side by side, separated at a predetermined interval; a voice coil plate inserted in the space between the magnetic bodies, and having formed thereon a voice coil with a spiral pattern printed thereon; a damper-lead plate having a first damper-lead plate and a second damper-lead plate, which are physically separated, each having +, − terminals formed on the front ends thereof, wherein the first and the second damper-lead plates are each equipped with a coil plate spline, which adheres to the upper end of the voice coil plate, and at least one wing spline having one end thereof connected to the coil plate spline and the other end connected to the + or − terminals; and a vibration plate, which vibrates from the vibration received from the voice coil plate, while being contacted to the upper end portion of the damper-lead plate. 1. A flat type speaker having damper-lead plates for a PCB voice coil plate , comprising:a pair of magnetic bodies spaced apart from each other at a specific interval, formed side by side, and each having a magnet and yorks formed therein;a voice coil plate inserted into an interval between the magnetic bodies and having a voice coil spirally patterned and printed formed therein;damper-lead plates comprising first and second damper-lead plates physically separated and having + and − terminals formed at respective front ends of the damper-lead plates, ...

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Номер записи: 95
06-03-2014 дата публикации

Mems packaging scheme using dielectric fence

Номер: US20140061824A1
Автор: Loi N. Nguyen, Venkata Ramana Yogi Mallela, Venkatesh Mohanakrishnaswamy
Принадлежит: STMicroelectronics lnc USA

A packaging scheme for MEMS device is provided. A method of packaging MEMS device in a semiconductor structure includes forming an insulation fence that surrounds the MEMS device on the semiconductor structure. The method further includes attaching a wafer of dielectric material to the insulation fence. The lid wafer, the insulation fence, and the semiconductor structure enclose the MEMS device.

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Номер записи: 96
06-03-2014 дата публикации

Vibrating panel device for electromagnetic vibrator and its manufacture method

Номер: US20140064525A1
Автор: Huang Xinmin
Принадлежит:

The present invention includes a vibrating panel device for an electromagnetic vibrator, which includes at least one vibrating panel device. The vibrating panel module includes a base, a vibrating panel and an upper suspension, wherein an inner edge and an outer edge of the upper suspension are respectively connected with the base and the vibrating panel, and form an integrated whole body. Further, two vibrating panel modules are fixedly connected in opposite directions to form the vibrating panel device. By unique structures of the vibrating panel device, when the voice coil drives the vibrating panel to actuate, shaking of the vibrating panels is offset due to interactions between a pair of the suspensions and a pair of the vibrating panels, in such a manner that the voice coil drives the vibrating panel to process vertical up-and-down stroke, so as to replace a conventional damper. 1. A vibrating panel device for an electromagnetic vibrator comprising at least one vibrating panel module , wherein said vibrating panel module comprises a base , a vibrating panel and an upper suspension , an inner edge and an outer edge of said upper suspension are respectively connected with said vibrating panel and said base , so as to form an integrated whole body , wherein two of said vibrating panel modules are fixedly connected in opposite directions to form said vibrating panel device.2. The vibrating panel device for the electromagnetic vibrator claim 1 , as recited in claim 1 , wherein said base comprises a first button and a first button hole claim 1 , wherein said first button is mounted on a first side bottom of said base claim 1 , and said first button hole is mounted on a second side bottom of said base which is opposite to the first side bottom surface for coupling with said first button claim 1 , in such a manner that when a pair of said vibrating panel modules are adopted claim 1 , by rotating a vibrating panel module thereof for 180 degrees claim 1 , said first ...

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Номер записи: 97
13-03-2014 дата публикации

MICROMACHINED ULTRASONIC TRANSDUCER ARRAY

Номер: US20140070669A1
Автор: JEONG Byung-gil
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A micromachined ultrasonic transducer (MUT) array includes a printed circuit board, an alignment plate formed on the printed circuit board, the alignment plate having a plurality of cavities formed therein and a plurality of protruding portions respectively formed between neighboring cavities of the plurality of cavities, and a plurality of MUT modules formed on the plurality of the cavities and the plurality of the protruding portions of the alignment plate. In the MUT array, each of the plurality of MUT modules includes an application-specific integrated circuit (ASIC) arranged on the alignment plate and an MUT arranged on the ASIC. 1. A micromachined ultrasonic transducer (MUT) array comprising:a printed circuit board;an alignment plate formed on the printed circuit board, the alignment plate having a plurality of cavities formed therein and a plurality of protruding portions respectively formed between neighboring cavities of the plurality of cavities; anda plurality of MUT modules formed on the plurality of the cavities and the plurality of the protruding portions of the alignment plate,wherein each of the plurality of MUT modules comprises an application-specific integrated circuit (ASIC) arranged on the alignment plate and an MUT arranged on the ASIC.2. The MUT array of claim 1 , wherein the alignment plate is formed of any one of silicon claim 1 , polymer claim 1 , and ceramic.3. The MUT array of claim 1 , wherein the MUT is a capacitive micromachined ultrasonic transducer (CMUT) or a piezoelectric micromachined ultrasonic transducer (PMUT).4. The MUT array of claim 1 , wherein each of the plurality of cavities has a depth that is substantially the same as or greater than a thickness of the MUT.5. The MUT array of claim 4 , wherein each of the plurality of cavities has a depth that is substantially the same as a thickness of each of the plurality of MUT modules.6. The MUT array of claim 1 , wherein the plurality of MUT modules comprises a plurality of first ...

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Номер записи: 98
13-03-2014 дата публикации

Dual Single-Crystal Backplate Microphone System and Method Of Fabricating Same

Номер: US20140072152A1
Автор: Chen Li, Chen Thomas D., Yang Kuang L.
Принадлежит: InvenSense, Inc.

A dual backplate MEMS microphone system includes a flexible diaphragm sandwiched between two single-crystal silicon backplates. Such a MEMS microphone system may be formed by fabricating each backplate in a separate wafer, and then transferring one backplate from its wafer to the other wafer, to form two separate capacitors with the diaphragm. 1. A dual-backplate microphone comprising:a first backplate layer comprising a first conductive, single-crystal backplate;a second backplate layer comprising a second conductive, single-crystal backplate; anda conductive diaphragm movably sandwiched between and electrically isolated from the first and second backplates, wherein the backplates and diaphragm form a stack such that the diaphragm forms a first variable capacitor with the first backplate and a second variable capacitor with the second backplate.2. A dual-backplate microphone according to claim 1 , the microphone further comprising a first insulating layer between the first backplate layer and the diaphragm claim 1 , and a second insulating layer between the second backplate layer and the diaphragm.3. A dual-backplate microphone according to claim 1 , the second backplate layer further comprising:a second backplate contact electrically coupled to the second backplate; anda diaphragm contact electrically coupled to the diaphragm.4. A dual-backplate microphone according to claim 3 , the second backplate layer further comprising a first backplate contact electrically coupled to the first backplate.5. A dual-backplate microphone according to claim 1 , the first backplate layer further comprising a first side and a second side claim 1 , the first side facing the diaphragm claim 1 , and the second side comprising a backside cavity.6. A dual-backplate microphone according to claim 1 , the second backplate layer further comprising a first side and a second side claim 1 , the first side facing the diaphragm claim 1 , and the second side comprising a backside cavity.7. A dual ...

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Номер записи: 99
20-03-2014 дата публикации

Mems electrostatic actuator

Номер: US20140076697A1
Автор: Arun K. Gupta, William C. McDonald
Принадлежит: Texas Instruments Inc

A MEMS electrostatic actuator includes a bottom plate affixed to a substrate and a top plate suspended above the bottom plate. The top plate has a parallel plate center section and two rotating members electrically connected to the center section. Each rotating member is attached centrally of the rotating member for rotation about an axis of rotation to a set of anchor posts. The attachment includes at least one pair of torsional springs attached along each axis, each spring comprising a rectangular metal square that twists as the rotational members rotate. Electrostatic pull-down electrodes are underneath each rotational member.

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Номер записи: 100