CARRYING APPARATUS FOR SEMICONDUCTOR WAFER

24-10-2003 дата публикации

Номер:

JP2003303874A

Автор: FUJISAWA SHINICHI

Принадлежит: Disco Abrasive Systems Ltd

Контакты:

Номер заявки: 99-10-200293

Дата заявки: 12-04-2002

[1]

PROBLEM TO BE SOLVED: To provide a carrying apparatus for a semiconductor wafer which can suck and hold the semiconductor wafer without wrinkling its outer circumference and secure rigidity even when the wafer is formed thin.

[2]

SOLUTION: The carrying apparatus for the semiconductor wafer is equipped with a suction pad having a suctional holding surface for sucking and holding the semiconductor wafer, a sucking means which applies negative pressure to the suction pad, and a transport moving mechanism which carries the suction pad to a specified position. The suction pad has an annular suction area formed continuously on the suctional holding surface.

[3]

IPC - классификация

B B2 B23 B23Q B23Q7 B23Q7/B23Q7/0 B23Q7/04 B6 B65 B65G B65G4 B65G49 B65G49/B65G49/0 B65G49/07 H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/6 H01L21/67 H01L21/677 H01L21/68