ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY DEVICE

Or of the present invention characterized, and reviewing method achieving a drawing with a refers to in particular a plant processing waste fractions in the embodiment are a clarified that will. However in the embodiment in the present invention refers to hereinafter a disclosure rather than defined in various different, will embodied in the form, in the embodiment the present only to is completely of the present invention disclosure are, in the present invention is in the field of the person with skill in the art of the invention executable commands for transmitting the clock radio to completely inform the be provided with which, the present invention refers to claims. and the user makes a defined by category.

Thereby, the cold air flows of the present invention embodiment to illustrate the drawing to for disclosure shape, size, ratio, angle, the exemplary number such as shown the present invention the tech limited not. Same reference throughout the specification a same. referring to components. Furthermore, in the present invention describes, associated with publicly known techniques the a description is the present subject matter of invention for preventing needless blur wall of the rectangular when a mobile station is determined to a dispensed the description thereof. The present specification-mentioned on 'has includes consisting of', '', '' when or the like is used as an '-only' a portion of an ideal are left can be additional. Short-lived components is particularly when represented by explicit having a substrate with a option associated with the region is chosen when including a plurality a without includes.

In analyzed components, can't be accepted, he then substrates explicit separate including interpreted to the error range.

When a description is in the positional relationship, for example, '-on to-top', '', '', '-next to under-to' is described the positional relation between the position acquired into two sections, such as when, 'directly' or 'direct' an ideal are left a space between the two parts, least one other metal portion locate-able preferably at.

Device or layer thereof is to another element or layers, which are referred to "on (on)" directly on the other element to the other or intermediate layer or another element is includes both a moment when a interposed.

Although number 1, number 2 various elements and the like used to described but, these these components are is not limited to by to terms of. These terms are components of only one other components discriminate between a is being used to. Therefore, hereinafter, which is referred to in number 1 component in technical idea of the present invention may be is a component number 2.

Same reference throughout the specification a same. referring to components.

Each configuration shown in drawing of a size and thickness is shown for facilitating, the present invention is shown is composed of size and thickness must limited not.

In the embodiment of the present invention various signature lies partly or fully in the features are each of joined together which or in combination, or in combination, one skilled in the art is sufficiently can store references to any number of interworking different rpm and outputs the stored input and, each in the embodiment are independent of each other may be embodiment is associated with a body such that it can embodiment.

Hereinafter, drawing with an reference to. as further described are various in the embodiment of the present invention.

Also Figure 2 shows a device and second thin one embodiment of the present invention account for coarse is a plane. Also one embodiment of the present invention Figure 3 shows a device and second thin coarse account for is cross-sectional. Also 2 and 3 with a, organic light emitting display device (200) the substrate (210), organic light emitting device (220), encapsulation part (230), pressure bonded layer (240) and barrier film (250) includes. In Figure 2 the of the organic light emitting device (200) for facilitating various components of an the substrate during (210), organic light emitting device (220), encapsulation part (230) organic sealing layer (232) and pressure bonded layer (240) of number 2 pressure bonded layer (242) corresponding advertisement based on the shown list shown only, number 2 pressure bonded layer (242) is formed the location to which the be [...] are shown. One embodiment of the present invention and second thin device (200) has an organic light emitting device (220) the light emitted in the light-emitting chip arranged on the top surface side (top emission) traction top emission type device is used for.

Also 2 and 3 with a, substrate (210) a substrate (210) formed on the organic light emitting display device (200) of various elements is held. Substrate (210) can be constructed of an insulating material. For example, substrate (210) or of plastics or the like can be constructed of an insulating material.

Also 3 with a, substrate (210) substrate has a display area (DA) and non display area has (NA). Display area (DA) device (200) the second electrode faces at which a video is displayed is in region by, organic light emitting device (220) is formed.. The second electrode faces non-display region (NA) device (200) as timing at which a video is displayed in the areas which are not, display area is generally non-display region (NA) is defined so as to surround (DA). Non-display region (NA) the organic light emitting device (220) for driving the various wiring and circuit or the like can be formed is.

Substrate (210) on organic light emitting device (220) is arranged. Organic light emitting device (220) an anode, anode formed on an organic luminescent layer and an organic light emitting layer formed on a cathode can be constructed. Organic light emitting device (220) of organic light emitting display device (200) (DA) display area of a substrate corresponding to an (210) is formed to the center portion of a. Also 3 is not shown in a low cost, organic light emitting device (220) for driving a thin film transistor, capacitors and the like, various circuitry portions and various lines, and various substrate the insulating layer (210) an organic light emitting element (220) can be formed between the. Furthermore, substrate (210) an organic light emitting element (220) that are formed between the insulating layers at least some of the degradation rates may be selected from hydroxyl (NA).

Also 3 with a, encapsulation part (230) is organic light emitting device (220) is arranged to cover the. Encapsulation part (230) the number 1 inorganic sealing layer (231), organic sealing layer (232) and number 2 inorganic sealing layer (233) has.

Substrate (210) and organic light-emitting device (220) number 1 on inorganic sealing layer (231) is formed. Number 1 inorganic sealing layer (231) a substrate (210) is configured on the front face of. I.e., number 1 inorganic sealing layer (231) a substrate (210) (DA) display area of display area and non is to both ends of the halogen lamp (NA). Therefore, inorganic sealing layer number 1 (231) a substrate (210) formed on an organic light emitting device (220) so as to seal can be arranged.

Number 1 inorganic sealing layer (231) device (200) the second electrode faces outside moisture impermeable, air or using the push tool from organic light emitting device (220) a can be protected. The, number 1 inorganic sealing layer (231) mineral may be formed as. For example, number 1 inorganic sealing layer (231) the nitride (SiNx), aluminum oxide (Al2O3), such as silicon oxide (SiOx) may be formed as inorganic. As described above, one embodiment of the present invention device (200) and second thin used for emission is since the device, sealing layer inorganic number 1 (231) an inorganic-transparent can be formed.

Number 1 inorganic sealing layer (231) the thickness of the sealing layer inorganic number 1 (231) the materials comprising the latency performance the permeation of moisture can be is determined in consideration of. For example, number 1 inorganic sealing layer (231) is formed from aluminum oxide inorganic sealing layer number 1 when (231) has a thickness of from about 200 Å to 1500 Å and the shaft transfers the, number 1 inorganic sealing layer (231) is number 1 inorganic sealing layer when formed formed background (231) has a thickness of from about 5000 Å to 15000 Å can be. Just, number 1 inorganic sealing layer (231) thickness of limited to not.

Also 3 with a, number 1 inorganic sealing layer (231) on organic sealing layer (232) is formed. Organic sealing layer (232) the number 1 inorganic sealing layer (231) displayed on display area and non (DA) region is formed in a portion of (NA).

Organic sealing layer (232) substrate in the second manufacturing a foreign matter such as may cover an. Organic light emitting display device (200) manufacturing substrate in the second organic light-emitting device and to a foreign matter (220) can be of unit is at least arranged in the, number 1 inorganic sealing layer (231) crack of can cause (crack). Furthermore, organic sealing layer (232) the number 1 inorganic sealing layer (231) and number 2 inorganic sealing layer (233) [...] a burr washer in place whilst a higher than a transition temperature of substrate, such as a having, relatively [...] is number 1 inorganic sealing layer (231) and number 2 inorganic sealing layer (233) internal and or, number 1 inorganic sealing layer (231) is finely crack portion can be serves to filled. Organic sealing layer (232) acrylic (acryl) resin and epoxy (epoxy) resin can be one. Furthermore, organic sealing layer (232) organic light-emitting device and to (220) planarized by performs a function.

Organic sealing layer (232) the display area is formed are flattened at the (DA), non-display region (NA) in organic sealing layer (232), resulting gradually thinner thickness of. Also as shown in 3, organic sealing layer (232) edge profile that increase a thickness of the edge region of top (edge top) phenomenon occurs to, display area (DA) and the non-display area (NA) at a boundary between organic sealing layer (232) a local increase in thickness of may also be used but, organic sealing layer (232) the manufacturing process of organic sealing layer (232) the display region (DA) are flattened at entire portion. Therefore, organic sealing layer (232) also of a shown in example 3 is not limited to.

Also 3 with a, number 1 inorganic sealing layer (231) and organic sealing layer (232) on inorganic sealing layer number 2 (233) is formed. Number 2 inorganic sealing layer (233) a substrate (210) is configured on the front face of. I.e., number 2 inorganic sealing layer (233) a substrate (210) (DA) display area of display area and non is to both ends of the halogen lamp (NA), organic sealing layer (232) is formed to seal the. Specifically, inorganic sealing layer number 2 (233) the number 1 inorganic sealing layer (231) and the non-display area are so formed as are juxtaposed at contact (NA), number 2 inorganic sealing layer (233) and inorganic sealing layer number 1 (231) organic sealing layer (232) can be on the upper section and seals the. Therefore, inorganic sealing layer number 1 (231) and inorganic sealing layer number 2 (233) relatively moisture or air effected using the organic sealing layer (232) moisture or air is suppressed substrate includes a concave portion. Furthermore, inorganic sealing layer number 2 (233) the planarized organic sealing layer (232) is formed at a on, number 2 inorganic sealing layer (233) and is arranged underneath the bending according to number 2 a foreign matter to the lower sub-magnetic layer inorganic sealing layer (233) the water-potential crack of. can be reduced.

Number 2 inorganic sealing layer (233) device (200) the second electrode faces outside moisture impermeable, air or using the push tool from organic light emitting device (220) a can be protected. The, number 2 inorganic sealing layer (233) mineral may be formed as. For example, sealing layer inorganic number 2 (233) the nitride, aluminum oxide, such as silicon oxide may be formed of mineral, inorganic sealing layer number 1 (231) and the oxide layer may be formed.

Number 2 inorganic sealing layer (233) the thickness of the sealing layer inorganic number 2 (233) the materials comprising the latency performance the permeation of moisture can be is determined in consideration of, for example, inorganic sealing layer number 2 (233) the number 1 inorganic sealing layer (231) the same may be formed to have thicknesses on the order. Furthermore, one embodiment of the present invention device (200) and second thin device (200) used for emission is since the, number 2 inorganic sealing layer (233) an inorganic-transparent can be formed.

Also with a 3, barrier film (250) a substrate (210) is opposed to. Barrier film (250) the encapsulation part (230) oxygen and moisture together with the blue light emitting display device (200) media penetration of the additionally the NC.. Barrier film (250) the COP (Copolyester Thermoplastic Elastomer), COC (Cycoolefin Copolymer) and of a material resistant to either PC (Polycarbonate) can be degraded and, limited to not. Barrier film (250) (DA) organic light emitting device in the display area (220) that the light emitted from the transmissive to light at, a, for holding the quality of Image display optically isotropic properties it is preferable that the.

In some in the embodiment, organic light emitting display device (200) the touch of screen one body when-implemented device display, barrier film (250) the PI (Polyimide) such as may be plastic material. In this case, pressure bonded layer (240) and barrier film (250) the touch between the electrode and buffer layer, or the like can be arranged..

Also 3 with a, pressure bonded layer (240) is encapsulation part (230) and a barrier film (250) between the. Pressure bonded layer (240) the number 1 pressure bonded layer (241) and number 2 pressure bonded layer (242) includes.

Number 1 pressure bonded layer (241) the barrier film (250) is arranged lower surface of. I.e., number 1 pressure bonded layer (241) the barrier film (250) is disposed so as to be in contact on an upper face of the of, substrate (210) (DA) display area of display area and non (NA) is arranged both.

Number 1 pressure bonded layer (241), double-sided translucent consists of apparatus for the film in the form. In particular, number 1 pressure bonded layer (241) pressure constant to increase adhesion of the element consisting of a material which has properties can be formed. Number 1 pressure bonded layer (241) olefin (olefin) series, acrylic (acrylic) and silicon (silicon) is formed one of series can be degraded and, not limited to blood. For example, number 1 pressure bonded layer (241) olefins having the hydrophobicity may be formed of stacked, in this case number 1 pressure bonded layer (241) moisture permeability. may act as retardation layers. Thereby, encapsulation part (230) and barrier film (250) as well as number 1 pressure bonded layer (241) even with, organic light emitting device (220) is further penetration of moisture and oxygen to be delayed as is, organic light emitting display device (200) of organic electrolyte can be reliability is enhanced.

Number 2 pressure bonded layer (242) the number 1 pressure bonded layer (241) is arranged lower surface of. I.e., number 1 pressure bonded layer (241) the number 2 pressure bonded layer (242) and barrier film (250) is disposed between and in, number 2 pressure bonded layer (242) the number 1 pressure bonded layer (241) and a encapsulation part (230) is arranged between. Number 1 pressure bonded layer (241) and number 2 pressure bonded layer (242) are physically separated is distinct layer. I.e., number 1 pressure bonded layer (241) and number 2 pressure bonded layer (242) between the number 1 pressure bonded layer (241) and number 2 pressure bonded layer (242) which makes it possible to distinguish between interface is present.

Also 2 and 3 with a, number 2 pressure bonded layer (242) organic sealing layer (232) is shaped to apply a corresponding and advancing an end of the. In other words by, number 2 pressure bonded layer (242) organic sealing layer (232) n + type and is formed so as to be overlapped with. The, number 2 pressure bonded layer (242) a substrate (210) (DA) display area of display area and non (NA) that are not disposed throughout the and, organic sealing layer (232) and advancing an end of the substrate so as to correspond to the (210) can be arranged a partial area of. Wherein organic sealing layer (232) of the end the also 2 as shown to a planar on organic sealing layer (232) of outermost portion..

Number 2 pressure bonded layer (242) organic sealing layer (232) n + type and is formed with several arbitrarily shaped so as to be overlapped with the. it does but refers to, number 2 pressure bonded layer (242) the shape of the barrier film (250) and the substrate (210) in an inlet number 2 pressure bonded layer (242) due to the pressure exerted on can be randomly determined. For example, number 2 pressure bonded layer (242) 3 as shown in also the shape as the heating boilers but can be formed with the, not limited to having various shapes at can be formed.

Number 2 pressure bonded layer (242) adhesive, double-sided translucent and element consisting of a material which has, the air orifice, the constant pressure pressing the to increase adhesion of surface element consisting of a material which has properties can be formed. Number 2 pressure bonded layer (242) olefin series, acrylic and one of silicon series is formed can be degraded and, not limited to blood. Number 2 pressure bonded layer (242) the number 1 pressure bonded layer (241) layer is formed of a material having equal to may also be used but, number 1 pressure bonded layer (241) and number 2 pressure bonded layer (242) between the interface is present.

One embodiment of the present invention device (200) and second thin sealing layer organic in (232) by a thickness of organic sealing layer (232) end of is interposed in the vicinity in order to compensate for double layer structure of pressure bonded layer (240) is carried out by using an acidulous. Specifically, barrier film (250) an upper face of the overlapped with the number 1 pressure bonded layer (241) and organic sealing layer (232) having in a pattern that corresponds in shape and advancing an end of the number 2 pressure bonded layer (242) is used and as the, in particular, number 2 pressure bonded layer (242) the organic sealing layer (232) end of encapsulation part in the vicinity (230) and a pressure bonded layer (240) the American total tightly space between force the. The, encapsulation part (230) and a pressure bonded layer (240) through-bubble forces generated between moisture or oxygen is organic light emitting display device (200) the penetrate into the interlayer, or, decomposition of the surface during the organic emissive layer electrodes are prevent the surface oxidation by carrying out can be. Therefore, organic light emitting display device (200) external moisture or oxygen organic light emitting device (220) as well of the parking brake are minimized, and, organic light emitting display device (200) of can be reliability is improved.

Furthermore, one embodiment of the present invention device (200) and second thin encapsulation part in (230) and a pressure bonded layer (240) between by suppressing the production of space the American total tightly the pressure adhesive layer (240) without increasing the entire thickness of, an organic sealing layer occurring the American total tightly space (232) end of additional only a portion corresponding to the number 2 pressure bonded layer (242) is carried out by using an acidulous a manner is disposed. Therefore, organic light emitting display device (200) penetration of moisture or oxygen inside the main body generating this prevents the front frame the structure of an equipment by being organic light emitting display device (200) the gate structure includes a, -in in a thinner organic light emitting display device (200) may be provided with, organic light emitting display device (200) is minimized in the [...] of a practical use of the space can be.

Also 2 and in Figure 3 the number 2 pressure bonded layer (242) the organic sealing layer (232) end of a corresponding to both axial flow fan is improved to prevent shown but, in some embodiment, number 2 pressure bonded layer (242) organic sealing layer (232) corresponding to only a part during end of can. I.e., number 2 pressure bonded layer (242) organic sealing layer (232) in a pattern that corresponds in shape with at least a portion of the end of can take the.

Also Figure 4 shows a other embodiment of the present invention device and second thin coarse account for is cross-sectional. Of Figure 4 organic light emitting display device (400) has door 2 and of Figure 3 organic light emitting display device (200) comparison with a number 1 pressure bonded layer (441) and number 2 pressure bonded layer (442) 48a-different only arrangement position of the other components are substantially each, ., which does not require a redundant described.

Also refers to surface 4, barrier film (250) is formed on the lower surface of pressure bonded layer (440) of number 2 pressure bonded layer (442) in which there is disposed a, barrier film (250) and number 2 pressure bonded layer (442) below the pressure bonded layer (440) of number 1 pressure bonded layer (441) is arranged. I.e., number 2 pressure bonded layer (442) organic sealing layer (232) and advancing an end of the corresponding configured to have a barrier film (250) is disposed on the lower surface of, number 1 pressure bonded layer (441) the number 2 pressure bonded layer (442) so as to cover the barrier film (250) is arranged lower surface of. The, number 2 pressure bonded layer (442) is number 1 pressure bonded layer (441) and barrier film (250) is disposed between and in, number 1 pressure bonded layer (441) the encapsulation part (230) upper surface of, i.e., number 2 inorganic sealing layer (233) are arranged so that a contact on the upper surface of.

Other embodiment of the present invention device (400) and second thin in number 2 pressure bonded layer (442) a barrier film (250) is arranged in the, number 1 pressure bonded layer (441) is number 2 inorganic sealing layer (233) are arranged so that a contact on the upper surface of. Therefore, encapsulation part (230) and a pressure bonded layer (440) it is prevented that difference between the can be. Furthermore, single number 2 pressure bonded layer (442) is number 2 inorganic sealing layer (233) since contact on the upper surface of, organic light emitting display device (400) moisture or oxygen from outside is permitting penetration of coating material can be further minimize.

Also Figure 5 shows a device manufacturing method and second thin one embodiment of the present invention to explain the order. The 6c also to 6a also one embodiment and second thin device manufacturing method of the present invention to explain the. are cross-sectional drawing process. Also door has 6c also to 6a 2 and 3 device (200) on the transistor region shown in to explain the manufacturing method of as cross-sectional drawing process, also 2 and 3 reference to of a local terminal element described., which does not require a described.

First, substrate (210) on organic light emitting device (220) to form (S50), organic light emitting device (220) covering the encapsulation part (230) to form a (S51).

Also refers to surface 6a, substrate (210) on organic light emitting device (220) is formed. Specifically, substrate (210) is formed the ecwr (DA) display area of, organic light emitting layer is formed on an anode, cathode on organic light-emitting layer is formed.

Organic light emitting device (220) than that of the encapsulating part (230) is formed. Encapsulation part (230) the number 1 inorganic sealing layer (231), inorganic sealing layer number 1 (231) on organic sealing layer (232) and organic sealing layer (232) on inorganic sealing layer number 2 (233) has.

Number 1 inorganic sealing layer (231) organic light-emitting device and to (220) so as to cover the IC chip display area (DA) and non display area is to both ends of the halogen lamp (NA). Specifically, inorganic sealing layer number 1 (231) as the above chemical vapor deposition inorganic (Chemical Vapor Deposition; CVD) or atomic layer deposition method (Atomic Layer Deposition; ALD) deposited using vacuum film forming method such as are formed in which can be degraded and, not limited to blood.

Organic sealing layer (232) the number 1 inorganic sealing layer (231) displayed on display area and non (DA) region is formed in a portion of (NA). Organic sealing layer (232) as the above organic material (slit coating) slit coating or screen printing (screen printing) can be formed in which.

Number 2 inorganic sealing layer (233) the number 1 inorganic sealing layer (231) and organic sealing layer (232) is formed on. Number 2 inorganic sealing layer (233) a substrate (210) (DA) display area of display area and non is to both ends of the halogen lamp (NA), organic sealing layer (232) is formed to seal the. Number 2 inorganic sealing layer (233) an inorganic material that as the above chemical vapor deposition or atomic layer deposition vacuum film forming method such as deposited using can be degraded and are formed in which, not limited to blood.

Furthermore, barrier film (250) number 1 to number 1 portion having thickness (D1) (246) (D1) (D2) greater than thickness number 1 and number 2 number 2 portion having thickness (247) having pressure bonded layer (240) is formed on (S52).

Also refers to surface 6b, barrier film (250) to pressure bonded layer (240) is formed. Pressure bonded layer (240) number 1 number 1 portion having the thickness (D1) (246) (D2) having thickness number 2 and number 2 portion (247) has. At this time, the number 1 number 2 thickness (D2) greater than (D1) thickness.

Specifically, barrier film (250) having number 1 to number 1 pressure bonded layer thickness (D1) (241) is formed. Number 1 pressure bonded layer (241) the pressure bonded layer (240) of number 1 portion (246) and number 2 portion (247) 20 is formed so as to corresponding to both. Number 1 pressure bonded layer (241) the liquid phase olefin series, acrylic series or silicon stacked, i.e., liquid adhesive resin with a barrier film (250) manner and curing a applied to can be formed.

After this, number 1 pressure bonded layer (241) to number 1 number 2 thickness difference (D1) (D2) and a thickness having thickness number 2 pressure bonded layer (242) is formed. Number 2 pressure bonded layer (242) the pressure bonded layer (240) of number 2 portion (247) corresponding to only a 20 is formed so as to. Separate and a member such pressure bonded layer (240) of number 1 portion (246) after and allows placement of the, liquid phase olefin series, acrylic series or silicon stacked, i.e., liquid adhesive resin with a pressure bonded layer (240) of number 2 portion (247) manner and curing a applied to number 2 pressure bonded layer (242) is can be formed. Just, number 2 pressure bonded layer (242) method of fabricating for of is disclosed in direction as the channel limited to not.

Wherein, number 2 pressure bonded layer (242) the thickness of the organic sealing layer (232) thickness of at least. I.e., number 1 number 2 and a thickness (D1) (D2) organic sealing layer thickness difference (232) such that a terminal portion of thickness of number 2 pressure bonded layer (242) by forming a, encapsulation part (230) and a pressure bonded layer (240) foam between a is prevented from being generated on a can be. Generally organic sealing layer (232) about 15 micro m to 20 micro m is protruded from the guide thickness of, number 2 pressure bonded layer (242) thickness of, i.e., number 1 number 2 the difference in thickness (D1) and a thickness (D2) for example, 20 micro m can be.

Number 2 pressure bonded layer (242) organic sealing layer (232) configured to have a corresponding end of the above-mentioned liquid adhesive resin applying and curing a manner can be formed. I.e., pressure bonded layer (240) of number 2 portion (247) organic sealing layer (232) n + type and can be formed so as to be overlapped with.

Furthermore, pressure bonded layer (240) is encapsulation part (230) so as to be in contact to, barrier film (250) and pressure bonded layer (240) are attached to a vehicle a (S53).

Also refers to surface 6c, organic light emitting device (220) and encapsulation part (230) to the outside is formed (210) and a pressure adhesive layer (240) a barrier film (250) is. voltage lines for supplying positive voltages on. Specifically, barrier film (250) forming a adhesive layer (240) the substrate (210) the encapsulation part (230) so as to be in contact to, barrier film (250) and pressure bonded layer (240) the substrate (210) is end and closed end. Barrier film (250) and pressure bonded layer (240) a substrate (210) side for attaching the brake actuator assembly to, substrate (210) of a lower surface and an/or barrier film (250) applying pressure to upper surface of can be scheme is used. The, number 1 pressure bonded layer (241) the number 2 pressure bonded layer (242) and barrier film (250) can be disposed between the. Also refers to surface 6c, number 2 pressure bonded layer (242) the organic sealing layer (232) and advancing an end of the substrate so as to correspond to the (210) and barrier film (250) is can be voltage lines for supplying positive voltages on.

Device manufacturing method of the present invention in one embodiment and second thin liquid adhesive resin with a 2 times applied and curing a manner pressure bonded layer (240) is formed. I.e., pressure bonded layer (240) by using of 1 times applied to the liquid adhesive resin with a network and monitors and curing a thickness (D1) having number 1 number 1 portion (246) and number 2 number 2 portion having thickness (D2) (247) having pressure bonded layer (240) since: a, liquid adhesive resin with a 2 times applied and curing a manner pressure bonded layer (240) is formed. The, organic sealing layer (232) generated by thickness of an organic sealing layer (232) in end step compensating pressure bonded layer (240) unit can be formed. Furthermore, easy manner thickness (D1) having number 1 number 1 portion (246) and number 2 number 2 portion having thickness (D2) (247) having pressure bonded layer (240) for formed, encapsulation part (230) and a pressure bonded layer (240) difference on the pressure to avoid adhesive layer (240) entire thickness of is while being used without increased. Therefore, organic light emitting display device (200) as a kind of electric charge like the total thickness of the encapsulation part without the extra (230) and a pressure bonded layer (240) difference on the results in a greater reduction in a, organic light emitting display device (200) of reliability is improved or not, thereby providing a desired-in in a thinner organic light emitting display device (200)..

The 7b and 7a also other embodiment of the present invention device manufacturing method and second thin to explain the. are cross-sectional drawing process. Also 7a and 7b has door 4 shown in device (400) on the transistor region to explain the manufacturing method of as cross-sectional drawing process, by referring to 4 also of a local terminal element described., which does not require a described.

First, substrate (210) on organic light emitting device (220) to form (S50), organic light emitting device (220) covering the encapsulation part (230) to form a (S51). Organic light emitting device (220) is formed, encapsulation part (230) also forming a 6a described by referring to one embodiment of the present invention and second thin device manufacturing method, which does not require a redundant each and described..

Furthermore, barrier film (250) having thickness (D1) number 1 to number 1 portion (446) (D1) (D2) greater than thickness number 1 and number 2 number 2 portion having thickness (447) having pressure bonded layer (440) (S52) is formed on.

Also refers to surface 7a, barrier film (250) to pressure bonded layer (440) is formed. Pressure bonded layer (440) having thickness (D1) the number 1 number 1 portion (446) and number 2 number 2 portion having thickness (D2) (447) has. At this time, the number 1 number 2 thickness (D2) greater than (D1) thickness.

Specifically, barrier film (250) to number 1 number 2 thickness difference (D1) (D2) and a thickness having thickness number 2 pressure bonded layer (442) is formed. Number 2 pressure bonded layer (442) the pressure bonded layer (440) of number 2 portion (447) corresponding to only a 20 is formed so as to. Number 2 pressure bonded layer (442), in such a way the also 6b refers to the inventive number 2 pressure bonded layer (442), in such a way the same as the may.

After this, barrier film (250) and number 2 pressure bonded layer (442) having thickness (D1) number 1 to number 1 pressure bonded layer (441) is formed. Number 1 pressure bonded layer (441) the pressure bonded layer (440) of number 1 portion (446) and number 2 portion (447) 20 is formed so as to corresponding to both. The, number 1 pressure bonded layer (441) the number 2 pressure bonded layer (442) is formed so as to cover the. The, number 2 pressure bonded layer (442) the number 1 pressure bonded layer (441) and barrier film (250) can be disposed between the. Number 1 pressure bonded layer (441), in such a way the also 6b the inventive refers to number 1 pressure bonded layer (441), in such a way the same as the may.

I.e., other embodiment of the present invention device manufacturing method and second thin in pressure bonded layer (440) of number 1 number 2 adhesive layer such that the adhesive layer and a one embodiment of the present invention only formation position order and forming and second thin 48a-a chuck device manufacturing method, forming method, material, thickness are substantially identical so that., which does not require a redundant described.

Furthermore, pressure bonded layer (440) is encapsulation part (230) so as to be in contact to, barrier film (250) and pressure bonded layer (440) are attached to a vehicle a (S53).

Also refers to surface 7b, organic light emitting device (220) and encapsulation part (230) to the outside is formed (210) and a pressure adhesive layer (440) a barrier film (250) is. voltage lines for supplying positive voltages on. Specifically, barrier film (250) forming a adhesive layer (440) the substrate (210) the encapsulation part (230) so as to be in contact to, barrier film (250) and pressure bonded layer (440) the substrate (210) is end and closed end.

Other embodiment of the present invention and second thin organic sealing layer in device manufacturing method (232) in a pattern that corresponds in shape and advancing an end of the a are formed such that they have a number 2 pressure bonded layer (442) is number 1 pressure bonded layer (441) is formed prior to, number 1 pressure bonded layer (441) and number 2 pressure bonded layer (442) unit can be formed.

Or more drawing with an reference to more rapidly and to reduce a memory but of the present invention in the embodiment, the present invention refers to such necessarily and but are not limited to exemplify embodiment, of the present invention within such a range that causes no beyond slimly of the animals so modified more various can be embodiment. Therefore, in the embodiment of the present invention are a disclosure to the present invention and to limit the slimly is supported by the upper case and for described, such embodiment of the present invention and/or at least two different slimly range of limited not. If of the present invention scope of protection which must be interpreted by, and equivalent that lie within the ranges included within the scope rights of all technical idea of the present invention should be interpreted to will.