MULTI-BAND ANTENNA USING NON-SEGMENTED OUTER CONDUCTOR, AND TERMINAL INCLUDING SAME

18-08-2016 дата публикации
Номер:
KR1020160098099A
Принадлежит:
Контакты:
Номер заявки: 00-16-102032594
Дата заявки: 18-03-2016

[1]

The present application in the host computer from the terminal conductor an external, outer segments free for correcting reservation recording time in multi-band antenna and relates to the terminal.

[2]

Smart speakerphone or the like of mobile terminals in metal gradually such that the gaseous support medium rises design attractions. This metal design robustness and internal side design of terminal appearance portable interest in of wet liquid to flow down.

[3]

In one example, design of terminal appearance is being used conductor outer aspect, rigidity interior of terminal conductor aspect can be contained within the frame is.

[4]

Recent metal design some Company for potable the outer conductor antenna used to connect be is research and development is in progress.

[5]

In one example, portable terminal in order to expose the bonding pad in antenna using conductor, outer conductor the antenna as a part of, an outer part of the conductor as to be exposed to the outside the gap is removed conductor (Gap) is formed, the gaps is articulated by antenna of the end portion of an outer conductor can be used.

[6]

State of the SP heads and, outer conductor for segmenting down see without pleasant appearance and show low yield in., however, have the disadvantage that.

[7]

The literature prior art a, the aforementioned of the existing method technical solution provides a solution for this half a object of making it of laser applications does not go disclosure.

[8]

Korean opening patent number 2012-0102517 call Official Gazette Korean opening patent number 2014-0119928 call Official Gazette

[9]

A one in the embodiment of the present invention, outer conductors for correcting reservation recording time in outer segments free defines multiple zones of the absorbing multi-band antenna and provides terminal including same.

[10]

In the embodiment by one of the present invention, node controller varies capacitance of one of the circuit part has both ends, and both ends is electrically connected to an impedance matching once and JPO 2003 ; are located in regions non-metallic terminal, said number 1 impedance matching unit is electrically connected the other end other end and once from an elastic conductive connection member; the other end of said conductive connecting member is electrically connected to a other stage such connected number 1 number 1 and number 2 until each path, disposed in order to expose the bonding pad terminal said an outer conductor members; and said outer conductor members and each path number 2 and number 1 of said substrate electrically connected to ground portion of the processing chamber, and a conductor frame; includes, said outer conductor member, said outer conductor and path number 1 disposed between the connection end said number 1 number 1 radiation for conductor; and said number 1 is formed of conductor for radiation, said outer conductor and path number 2 disposed between the connection end said number 1 number 2 radiation for conductor; including terminal including a multi-band antenna is is proposed.

[11]

Such multi-band antenna by, feed line current for supply of power and output terminal circuit, through conductor members outer engaging member, and a conductive, different low frequency band of a high frequency band and a current path of and provides a path for current by, outer segments free outer conductors by using a fifth radiator antenna conductor multi-band as. can be supported.

[12]

The present for constitution in, a general outline various enumerated in the specification one is provided. Constitution: an a/d solving means is, essentially technique or core of the claimed to make sure that techniques which are not of intended, particulars the claimed only one of which is a substrate is, the claimed particulars detailed to each is specifically, in the description.

[13]

In the embodiment according to one of the present invention, outer conductor is electrically connected to conductor from the terminal to having, outer conductors radiator antenna conductor in order to expose the bonding pad portion segments free by using an antenna cover defines multiple zones of by embodying the, outer segments free of antenna conductor in to be used as an main radiator, antenna can improve the performance as well as, metal the body to lower direction can be to improve the throughput of the system.

[14]

In the embodiment according to one of the present invention including also Figure 1 shows a multi-band antenna is perspective view of terminal appearance. Also one in the embodiment according to Figure 2 shows a general outline of the present invention is multi-band antenna structure. Also one in the embodiment according to Figure 3 shows a general outline of the present invention is operation of multi-band antenna. Of Figure 4 (a), the (b) in the embodiment according to one of the present invention including multi-band antenna decomposition of terminal is cross-sectional drawing of engagement and perspective view. Of Figure 5 (a), the (b) in the embodiment according to one of the present invention including multi-band antenna some cracking of terminal is cross-sectional drawing of engagement and perspective view. In the embodiment according to Figure 6 shows a multi-band antenna also including one of the present invention combine the grille pin and the terminal. of the cross-section of. In the embodiment according to Figure 7 shows a multi-band antenna also including one of the present invention combine the grille pin and the terminal. of the cross-section of. In the embodiment according to Figure 8 shows a multi-band antenna also including one of the present invention combine the grille pin and the terminal. of the cross-section of. One of the present invention also in the embodiment according to Figure 9 shows a multi-band antenna is perspective view including some cracking of terminal. In of Figure 10 (a) to (d) of the present invention in the embodiment according to the non-metal to metal region various features description of region. Also (a) to (f) in the of the present invention in the embodiment according to Figure 11 shows a conductive connecting member is exemplary. In the embodiment according to one of the present invention including also Figure 12 shows a multi-band antenna is perspective view of frame conductor terminal. The metal region in the embodiment according to one of the present invention of Figure 13 (a) to (c), non-metallic region features a description portion and articulated. The (c) to (a) also Figure 14 shows a current flow in the embodiment according to one of the present invention a description is.. One of the present invention also in the embodiment according to Figure 15 shows a conductor with coupling members a conductive structure for connecting frame is exemplary. Also in the embodiment according to Figure 16 shows a multi-band antenna of configuring and operating one of the present invention is described. Figure 17 shows a multi-band antenna and operation of the resonance region in which a is also described of Figure 16. Figure 18 shows a multi-band antenna of in adjustment department impedance number 1 is of Figure 16 and improved method and apparatus for frequency characteristic of a transfer system. Also in the embodiment according to Figure 19 shows a multi-band antenna of configuring and operating one of the present invention is described. In the embodiment according to number 1 (IM1) matching impedance also Figure 20 shows a one of the present invention is exemplary. Figure 21 shows a multi-band antenna descriptions also is of Figure 19. Figure 22 shows a multi-band antenna of in adjustment department impedance number 2 from the server devices and displays the characteristic of a transfer system is of Figure 19. Figure 23 shows a multi-band antenna of number 3 (IM3) impedance matching from the server devices and displays the characteristic of a transfer system is of Figure 19. Figure 24 shows a multi-band antenna in PIFA (Planar Inverted-F Antenna) antenna or loop antenna is also frequency characteristic of of Figure 19. One of the present invention also in the embodiment according to Figure 25 shows a whole by multi-band antenna LTE is frequency characteristic representation of the frequency band. Figure 26 shows a also one of the present invention is exemplary a in adjustment department impedance in the embodiment according to number 1. Figure 27 shows a in adjustment department impedance from the server devices and displays the characteristics of the present invention also is one in the embodiment according to number 1. One of the present invention also in the embodiment according to Figure 28 shows a dense inter-frame and the conductor substrate, a contact conductor line is in one example of. One of the present invention also in the embodiment according to Figure 29 shows a conductor line contact structure by arrangement of terminal is exemplary. Also Figure 30 shows a conductor line contact in the embodiment according to one of the present invention for selecting a switching device (SWD) is exemplary. Also in the embodiment according to Figure 31 shows a contact conductor line implementation of one of the present invention is exemplary. Also in the embodiment according to Figure 32 shows a dense one of the present invention, a contact conductor line according to plane current and sterically is exemplary path of. Figure 33 shows a uniform also in the embodiment according to one of the present invention, a contact conductor line modes plane current and sterically is exemplary path of. One of the present invention also in the embodiment according to Figure 34 shows a contact conductor line light oil/charge not passing according to. surface thereof, and the resonance frequency characteristic show.

[15]

In hereinafter, in the embodiment described the present invention refers to which not limited to, various without beyond of the present invention general outline can be easily changed should understood.

[16]

Furthermore, in each of the present invention in the embodiment, the described structure examples of the one, shape and level of the present invention, to assist understanding of technical to the mike and the e.g., is not limited to. Entire or partial each of the present invention in the embodiment the combined with one another, various types of new embodiment. of the weld can be made form.

[17]

And, in the present invention a to be referenced content overall drawing of the present invention falling on a detector to determine the functionality and substantially the same construction having the same code components is to use a.

[18]

In hereinafter, the present invention is in the field of the embodiment in the present invention is to facilitate person with skill in the art in order to ensure that there can, and attaching a reference to a drawing of the present invention in the embodiment as further described..

[19]

In the embodiment according to one of the present invention a multi-band antenna, substrate and conductor terminal including frame, one end the conductor outer of segments of free, terminal during interior of non-metallic is arranged in the area a conductive through a connection member connected to the circuit of the substrate, substrate through the frame conductor other thereof is connected to the ground portion of the, feed line current for supply of power and output terminal circuit, conductive connecting member, radiation for conductor and conductor through the frame phases, a means for, different low frequency band of a high frequency band and a current path of by forming the current path, a multiple band antenna may operate in. Is to described the reference to drawing.

[20]

In the embodiment according to one of the present invention including also Figure 1 shows a multi-band antenna is perspective view of terminal appearance.

[21]

With a 1 also, in the embodiment according to one of the present invention including multi-band antenna terminal (10) has an outer conductor members (203), comprises a a.

[22]

The, in the embodiment according to one of the present invention outer conductor members (203) conductors and an independent from a frame conductor or may be are formed independently of the terminal may be assembled.. In one example, said outer conductor members (203) the terminal (10) can be a and one body of may not.

[23]

Wherein, in the embodiment according to one of the present invention outer conductor members (203) at least antenna is not formed of the segments are a new function may be. Therefore, an uncoated portion out of function antenna the of the segments are even when the. a non-intrusive.

[24]

Also one in the embodiment according to Figure 2 shows a general outline of the present invention is multi-band antenna structure.

[25]

Also refers to surface 2, a multi-band antenna in the embodiment according to one of the present invention, impedance matching number 1 (IM1), conductive connecting member (500), outer conductor members (203) and a conductor frame (200) includes.

[26]

Number 1 (IM1) impedance matching the terminal (10) a substrate in a (100) mounted on circuit part (150) (FN) node varies capacitance of one of the capacitors connected to one end, said conductive connecting member (500)/ fail data may include. Wherein, the terminal (IM1) number 1 impedance matching a that is disposed in the interior of, which it need not be limited to specific locations, in one example substrate (100) can be disposed.

[27]

In one example, said number 1 impedance matching (capacitive) device (IM1) has capacitance, inductance (inductive) device and resistance (resistance) at least one device may comprise an.

[28]

Conductive connecting member (500) the terminal (10) non-metallic are located in regions, impedance matching said number 1 (IM1) is electrically connected to the other end of one end, said outer conductor members (203) electrically connected to a may include other end.

[29]

Outer conductor members (203) the conductive connecting member (500) connected the other end of (CT1) connection end number 1 number 1 and number 2 a different stage path (PT1, PT2) until each said terminal (10) in order to expose the bonding pad can be disposed.

[30]

In one example, said outer conductor members (203) the, said conductor frame (200) can be formed integrally with, in addition said conductor frame (200) are assembled by being produced separately from the vehicle and can be.

[31]

In one example, outer conductor members (203) for the number 1 radiation conductor (203-1) and number 2 radiation for conductor (203-2) may comprise an.

[32]

In this case, number 1 radiation for conductor (203-1) the conductor frame (200), which are connected electrically to a connection end said number 1 and (PT1) stage path number 1 (CT1) liver number 1 and provides a path for current the, . functions as radiator frequency band number 1.

[33]

Furthermore, conductor for radiation number 2 (203-2) the number 1 radiation for conductor (203-1) and integrally-formed with the, said conductor frame (200), which are connected electrically to a connection end said number 1 and number 2 (PT2) stage path (CT1) liver number 2 the and provides a path for current, said number 1 number 2 other frequency band and. functions as radiator frequency band.

[34]

In one example, conductor for radiation number 1 (203-1) number 2 and a conductor for radiation (203-2) is different frequency bands for to functioning at radiator, said number 1 radiation for conductor (203-1) the number 2 radiation for conductor (203-2) electrical length (EL2) and a other electrical length material may have a (EL1).

[35]

Wherein, number 1 radiation for conductor (203-1) and number 2 radiation for conductor (203-2) and the omni of segments of each, said number 1 radiation for conductor (203-1) and number 2 radiation for conductor (203-2) has only two stainless steel plates or without segments each other can be formed.

[36]

Said conductive connecting member (500) for the number 1 radiation conductor (203-1) and number 2 radiation for conductor (203-2) respective electrical greater than the length smaller material may have a length.

[37]

An editing unit switches the first, number 1 radiation for conductor (203-1) number 2 and a conductor for radiation (203-2) each other antenna to different frequency bands of main radiator to functioning at, number 1 radiation for conductor (203-1) number 2 and a conductor for radiation (203-2) can further be connected to each electrical length (of Figure 3 EL1, EL2) a conductive connection member (500) is longer than the length of the electrical.

[38]

Furthermore, said conductive connecting member (500) the in one example said outer conductor members (203) of number 1 connection end structure for connecting to electrical (CT1) may be connected to through. Other in one example, said conductive connecting member (500) the outer conductor members (203) and the physical connected to each other can be integrally formed.

[39]

Conductor frame (200) the outer conductor members (203) of number 1 and number 2 path stage (PT1, PT2) with each of said substrate (100) ground portion of electrically (GND) may be connected to. In each in the embodiment of the present invention, conductor frame (200) a terminal can be in the a metallic cover of a (reference 5 also), not to form the internal-conductor can be frame (also 4 reference).

[40]

In each in the embodiment of the present invention, conductor conductor within the interior of the terminal frame when the frame is the, cover is further may be included, the cover including at least a portion of a conductor to the metal cover or non-metallic cover is can be.

[41]

Furthermore, these in addition said outer conductor members (203) of number 1 and number 2 path stage (PT1, PT2) with each of said substrate (100) (GND) electrically connects the ground portion of capable, said conductor frame specially said metal cover or. it need not be limited to.

[42]

In one example, conductor frame (200) the number 1 conductor region (200-A11) and number 2 conductor region (200-A12) may include a. In this case, number 1 conductor region (200-A11) the number 1 radiation for conductor (203-1) of (PT1) stage path number 1 and the circuit part (150) (GN1) ground node number 1 of. electrically coupled to each. The number 1 conductor region (200-A11) the number 1 radiation for conductor (203-1) of (PT1) stage path number 1 and the circuit part (150) of number 1 (PH1) between (GN1) ground node number 1 may provide a current path.

[43]

Furthermore, number 2 conductor region (200-A12) the number 2 radiation for conductor (203-2) of stage path number 2 (PT2) and the circuit part (150) (GN2) ground node number 2 of. electrically coupled to each. The, number 2 conductor region (200-A12) the number 2 radiation for conductor (203-2) of stage path number 2 (PT2) and the circuit part (150) between (GN2) ground node number 2 of number 2 (PH2) may provide a current path.

[44]

* Wherein, number 1 conductor region (200-A11) and number 2 conductor region (200-A12) each current path number 1 and number 2 (PH1, PH2) region for providing, fixing the second device that the areas targeted, element as to number 1 and number 2 current path (PH1, PH2) at least one pathway of to modify the variable layer is can be.

[45]

Also one in the embodiment according to Figure 3 shows a general outline of the present invention is operation of multi-band antenna.

[46]

Also 3 with a, a multi-band antenna in the embodiment according to one of the present invention, impedance matching number 1 (IM1), conductive connecting member (500), outer conductor members (203) and a conductor frame (200) includes.

[47]

Also shown in 3 (IM1) matching impedance number 1, conductive connecting member (500), outer conductor members (203) and a conductor frame (200) among a description, reference 2 also equal to the description for defined in the description are disclosed, described sound generating bodies the directions of which thereof can be dispensed with.

[48]

Also 3 with a, the number 1 (PH1) current path said number 1 corresponding to the route of a current to frequency band, is a circuit section (150) (FN) node varies capacitance of one of the capacitors, impedance matching number 1 (IM1), conductive connecting member (500), number 1 radiation for conductor (203-1), conductor frame (200) of number 1 conductor region (200-A11) and substrate (100) of number 1 is formed by (GND1) ground.

[49]

Furthermore, said number 2 (PH2) current path the number 2 to the route of a current corresponding to frequency band, is a circuit section (150) (FN) node varies capacitance of one of the capacitors, impedance matching number 1 (IM1), conductive connecting member (500), number 2 radiation for conductor (203-2), conductor frame (200) of number 2 conductor region (200-A12) and substrate (100) of number 2 is formed by (GND2) ground.

[50]

And, number 1 (PH1) electrical current path length and number 2 current path electrical length (PH2) of different type, the different bandwidths a multi band antennas are may be embodied in.

[51]

While, conductor frame (200) the one example to terminals (10) can be in the cover of conductors (also reference 5), other one example to terminals (10) a conductor can be frame (also 4 reference). As such, conductor frame (200) an external conductor members (203) and said substrate (100) the ground portion of the be electrically connected to (GND) using a one-, specially to the unique components. it need not be limited.

[52]

In each in the embodiment of the present invention, outer conductor members (203) the, terminal is attached on the glass plate, of an interior component, panel, or the like and the display substrate with magnetic force are, terminal sized surrounding side of can take the width of.

[53]

The in Figure 13 to 4 also, for diagram in compact, circuit part (150) and a conductive connecting member (500), which is disposed between the impedance matching is achieved due to the omission (IM1) number 1.

[54]

Of Figure 4 (a), the (b) in the embodiment according to one of the present invention including multi-band antenna decomposition of terminal is cross-sectional drawing of engagement and perspective view.

[55]

Refers to surface of Figure 4 (b) and of Figure 4 (a), said terminal (10) of a cover (50), substrate (100), conductor frame (200) and display panel (300) may include a.

[56]

The, terminal with multi-band antenna said, cover (50) and substrate (100) includes. Said substrate (100) the cover (50) arranged on the inner side of the circuit part (150) may comprise an. Wherein, circuit part (150) the terminal (10) required by the for supporting the, in one example, central control device (CPU), signal processor (ISP), memory (Memory), communication modem and input/output interface may comprise, in addition, circuit part (150) for providing reference potential exit the substrate ground (100) the ground portion of the is electrically connected to.

[57]

In one example, cover (50), substrate (100), conductor frame (200) and display panel (300) the, of Figure 4 (a) as shown in can be degraded and arranged in order of, are not limited to.

[58]

Substrate (100) of nonmetallic material and is made by a metal region (conductive region) (A1) (non-conductive region) region includes (A2), (A1) said metal region (conductive region) a circuit part provided at least one (150) is disposed, said non-metallic region (A2) conductive connection member (500) can be is arranged. Wherein, metal region (A1) the substrate (100) reference potential ground for maintaining can be contacts are arranged.

[59]

Wherein, in each of the present invention in the embodiment, substrate (100) (A1) metal region of the to ground described in which, of the substrate (100) of metal region (A1) is ground necessarily entire with the content is to be the not intentionally.

[60]

Said conductor frame (200) a metal cover or internal conductor can be frame is, in one example, said conductor frame (200) when the frame conductor therein, terminal (10) substrate (100) of the internal structures including tightness for imparting a frame, metal region (201) and non-metal region (202) may include a. And, said conductor frame (200) an external conductor members (203) may be formed as integrally.

[61]

In one example, said metal region (201) some or all of the hollow metal elements in such a manner or may be, surface entire. may consist of metallic materials. Said non-metallic region (202) a detectiong portions are removed of the metal (e.g., air) may be a small, plastic such as. may consist of non-metallic materials.

[62]

Said outer conductor members (203) the terminal (10) exposed outside of the resin part in conductor is an outer conductor outer segments free, of the radiator main of the antenna segments in order to enable a can be made of a conductive material and without. The, said outer conductor members (203) the conductor frame (200) of metal region (201) such as and may a wafer surface level of, said metal region (201) may differ from the a wafer surface level of.

[63]

In one example, outer conductor members (203) as shown in the of Figure 4 (a), conductor frame (200) the torsion bar cooperates with, substrate (100) capable of receiving said metal region (201) at an elevation which is above that surface of may include an approach.

[64]

Said display panel (300) the a circuit part provided substrate (150) information from can be the information. Wherein, display panel (300) of terminal information displayed on a related to operation information or/and selected by the user can be information.

[65]

The, said conductive connecting member (500) of said other outer conductor members (203) of number 1 (CT1) connection end can be electrically connected to, said conductive connecting member (500) for a feed one end of said substrate (100) a circuit part provided (150) (also of Figure 3 FN and 2) to controller varies capacitance of one of the node number 1 impedance matching (also of Figure 3 IM1 and 2) may be connected to through.

[66]

Wherein, said conductive connecting member (500) adds the basic at said circuit part (150) (FN) node varies capacitance of one of the capacitors (or signal) from the pumping unit for said outer conductor members (203) performs the delivery of the transfer function.

[67]

Of Figure 5 (a), the (b) in the embodiment according to one of the present invention including multi-band antenna some cracking of terminal is cross-sectional drawing of engagement and perspective view.

[68]

Refers to surface of Figure 5 (b) and of Figure 5 (a), said terminal (10) corresponding to cover conductors conductor frame (200A), outer conductor members (203A), substrate (100) and display panel (300) may include a. The, said conductor frame (200A), substrate (100) and display panel (300) the of Figure 5 (a) as shown in can be degraded and arranged in order of, are not limited to.

[69]

The, said conductor frame (200A) the, metal region (201A) and non-metal region (202A) including, outer conductor members (203A) may be formed as integrally. The, outer conductor members (203A) the, said conductor cover conductor frame (200A), located in a external space of, as shown in the of Figure 5 (b), substrate (100) and display panel (300) to surround outside of can be formed.

[70]

Said metal region (201A) some or all of the or may be hollow metal elements in such a manner, part or all of the surface conductive material which may consist of, at least a portion may include a conductive material. Said non-metallic region (202A) the, establishing an optical fiber at a side, a detectiong portions are removed metal (e.g., air) or may be, plastic such as. may consist of non-metallic materials.

[71]

Said outer conductor members (203A) the terminal (10) exposed outside of the resin part in conductor is an outer conductor outer segments free, of the radiator main of the antenna segments in order to enable a can be made of a conductive material and without. The, said outer conductor members (203A) the conductor frame (200A) of metal region (201A) such as and may a wafer surface level of, said metal region (201A) may differ from the a wafer surface level of.

[72]

In one example, outer conductor members (203A) as shown in the of Figure 5 (a), frame conductor cover conductor (200A) the torsion bar cooperates with, substrate (100) capable of receiving said metal region (201A) at an elevation which is above that surface of may include an approach.

[73]

While, in of Figure 5 (b), stationary object (60) the in one example plastic or non-conducting material such as conductive material into, substrate (100) for including terminal (10) the internal structures of terms of the tightness, that are capable of imparting a material or can be formed in the shape of.

[74]

Also refers to surface 4 and 5, in the embodiment according to one of the present invention including multi-band antenna such as terminal, cover, substrate, is combined display panel frame and conductor arrangement order among the various also can be easily changed, also to 6 also described by referring to a 9.

[75]

In the embodiment according to Figure 6 shows a multi-band antenna also including one of the present invention combine the grille pin and the terminal. of the cross-section of.

[76]

Also 6 with a, said terminal (10) the non-conductive cover (50), substrate (100), conductor frame (200) and display panel (300) order can be combined. is arranged. The, outer conductor members (203B) the conductor frame (200) may be connected to electrically.

[77]

In one example, also 5 and 6 with a, said cover (50) the, in one example, by injection molding or the like type insert, outer conductor members (203B) may be formed as integrally.

[78]

[79]

In the embodiment according to Figure 7 shows a multi-band antenna also including one of the present invention combine the grille pin and the terminal. of the cross-section of.

[80]

Also with a 7, said terminal (10) the, non-conductive cover (50), conductor frame (200), substrate (100) and display panel (300) order can be bound is arranged, in one example, said cover (50) of the insert by injection molding or the like, outer conductor members (203B) may be formed as integrally.

[81]

Wherein, in each in the embodiment of the present invention, said outer conductor members (203B) of manufacturing the manner in which the. is not particularly limited in for.

[82]

In the embodiment according to Figure 8 shows a multi-band antenna also including one of the present invention combine the grille pin and the terminal. of the cross-section of.

[83]

Also 8 with a, said terminal (10) the non-conductive cover (50), conductor frame (200), substrate (100) and display panel (300) order can be bound is arranged, in one example, said conductor frame (200) the flat fluorescent conductor members (203) may be formed as is integrally.

[84]

In aforementioned reference to 8 also to 4, outer conductor members (203,200A, 200B) of a nonmetallic or metal end may be formed of, or internal conductor frame (200) formed integrally with is formed integrally with the screw and can be, alternatively outer conductor members (203), has a frame or conductor cover after the manufacturing separated into separate may be assembled to one another in.

[85]

One of the present invention also in the embodiment according to Figure 9 shows a multi-band antenna is perspective view including some cracking of terminal.

[86]

9 also refers to surface, said terminal a cover (50), substrate (100) and a conductor frame (200) order can be combined. is arranged.

[87]

In one example, said outer conductor members (203B) the cover (50) or conductor frame (200) may be formed separated, terminal substrate after the assembly (100) and a conductor frame (200) is arranged outside can be combined..

[88]

In Figure 9 the, conductor frame (200) outer conductor members (203B) and the separate when the, the generation of air on a, example metal region (201) includes, includes metal region pushing may not be a determined thickness of wet liquid to flow down.

[89]

Establishing an optical fiber at a side, of the present invention in the embodiment according to terminal having a Bluetooth function, said conductive connecting member (500) is said substrate (100) during said non-metallic region or is placed on the (A2), said substrate (100) another layer different from the layer to components of can be arranged. For example, conductive connecting member (500) is said substrate (100) a cover disposed another layer different from the layer (50) or conductor frame (200) can be disposed.

[90]

As such, said conductive connecting member (500) the terminal (10) within, including a non-conductive material or disposed on a non-metallic region (A2), (A2) and at least non-metallic region a arranged at the positions flatly overlapping with, its arranging the location to which the a particular the layer or member or components it need not be limited to..

[91]

Of Figure 10 (a) to (d) in the of the present invention in the embodiment according to non-metal to metal region various features description of region.

[92]

*Of Figure 10 (a) the substrate (100) and the conductor frame (200) is to efficient position in structure sides of, outer conductor members (203) conductor frame (200) integrally structures that can be produced a..

[93]

Of Figure 10 (b) of a cover (50), substrate (100) and a conductor frame (200) arranged in order to efficient position in structure, outer conductor members (203B) is arranged is produced separately from the vehicle and capable of being assembled. a structure.

[94]

Conductor frame holds a conductive cover of Figure 10 (c) (200A) and substrate (100) is to efficient position in structure sides of, outer conductor members (203A) conductor frame (200A) integrally structures that can be produced a..

[95]

The, said conductor frame (200A) a metal region (201A) of nonmetallic material and is made by region (202A) may include a

[96]

The aforementioned of Figure 10 (a), (b) and (c) such as a, in each of the present invention in the embodiment, substrate (100) conductive region (A1) the conductor frame (200A or 200) or outer conductor members (203,200A or 200B) to and outputs a is electrically connected to the bump, receiving zone includes electrical metal shown in of Figure 10 (d) may be connected in a plurality of conductive materials, for example, terminal extended from the edge of the object, conductor frame (200), outer conductor members (203) such as conductive portion and a a conductive out all including. can be modeled region.

[97]

Entire in the embodiment of the present invention the metal region in (or conductive region), as shown in the of Figure 10 (d), metal in electrical connection with conductor frame or outer conductor members including both conductive portion such as can be the layout based upon the resistance value region.

[98]

Wherein, terminal metal layer to connect an a nonmetallic region is made of a. is.

[99]

While, in the embodiment according to one of the present invention conductive interconnect member (500) comprises at least one pattern can be formed. For example, conductive connecting member (500) or one conductive connecting member connected one or more conductive 2 can be member.

[100]

Furthermore, conductive connecting member (500) has circuitry (150) signals from or current to a outer conductor members (203) a capable of transferring a, specially. it need not be limited to specific shape. Said conductive connecting member (500) width of the light irradiated from the various several example 11 having a reference to a described.

[101]

Also (a) to (f) in the of the present invention in the embodiment according to Figure 11 shows a conductive connecting member is exemplary.

[102]

Of Figure 11 (a) formed physically separated each other number 1 and number 2 conductive connecting member (510,520) a including conductive connecting member (500) shown of wet liquid to flow down. Shown in of Figure 11 (a) number 1 and number 2 conductive connecting member (510,520) each one end of the one feed line commonly connected circuit part can be connected to, number 1 and number 2 conductive connecting member (510,520) each other a different conductor members outer number 1 and number 2 connection end (CT1, CT2) may be connected to to.

[103]

The current path conductive connection member (510,520) in can be done via the, antenna cover band conductive connecting member (510,520) can be modified by.

[104]

A conductive connection member of Figure 11 (b) (500) and ground pattern (400) shows of wet liquid to flow down. Conductive connecting member (500) once the is connected to feed line of the circuit, other number 1 of outer conductor members may be connected to to (CT1) connection end. Ground pattern (400) the conductive connecting member (500) is disposed at and a conductive pattern is made of a metal and, one end connected to the ground of the substrate, number 2 of conductor members outer other thereof may be connected to to (CT2) connection end.

[105]

In addition said conductive connecting member (500) and ground pattern (400) the, in one example, as shown in of Figure 11 (b), said conductive connecting member (500) and ground pattern (400) the in one example capacitance binding, electromagnetic coupling so formed as to form a can be arranged adjacent to each other. Or, other in one example, from the control unit via the wire each other may be connected to with each other directly.

[106]

As such, ground pattern (400) is shifted from a predetermined mode to additional impedance on current path in is changed, antenna cover band can be change.

[107]

(Branch) brunch can one of Figure 11 (c) and apparatus for manufacturing conductive connecting member (500) shown of wet liquid to flow down. Shown in conductive connecting member of Figure 11 (c) (500) once the is connected to feed line of the circuit, other number 1 of outer conductor members may be connected to to (CT1) connection end. In addition conductive connecting member (500) brunch can member between other end one end of (501) the substrate may be connected to ground part of the.

[108]

Terminal 3 of the of Figure 11 (d) part connection member (500) (in one example 'h' shape) shown of wet liquid to flow down. Shown in conductive connecting member of Figure 11 (d) (500) the one terminal is one feed line connected to the circuits through, remaining 2 different absence conductor an outer its two terminals in a number 1 and number 2 connection end (CT1, CT2) may be connected to each.

[109]

Is such a case the current path on current path or have been diversified impedance changes cover band are applied to the plurality of sub can be various. In the embodiment of the can be applied to the each of the present invention.

[110]

On polygonal of Figure 11 (e) (e.g., adjacent trenches on the) of conductive elements made of conductive connecting member (500) shown of wet liquid to flow down. Conductive interconnect member of Figure 11 (e) shown in (500) for air flow between the circuits through commonly feed lines of one point can be connected to part, different two points are a different conductor members outer number 1 and number 2 connection end (CT1, CT2) may be connected to to.

[111]

Of Figure 11 (f) has its interior a polygonal that a slit is formed on conductive connecting member (500) shown of wet liquid to flow down.

[112]

Refers to surface of Figure 11 (f), said conductive connecting member (500) conductive member the polygonal of a slit is removed conductive substance may include a. Conductive interconnect member of Figure 11 (f) shown in (500) point for air flow between a feed line and a circuit unit which can be connected to, different two points are a different conductor members outer number 1 and number 2 connection end (CT1, CT2) may be connected to to.

[113]

The current path is established can be changed, antenna cover band can be various.

[114]

In the embodiment according to one of the present invention including also Figure 12 shows a multi-band antenna is perspective view of frame conductor terminal.

[115]

Also refers to surface 12, conductive connecting member (500A) is disposed between the and display holder of terminal plate said conductor frame (200) non-metallic region (202) in air space conductor frame (200) layer of the same, said conductor frame (200) in order to expose the bonding pad conductor members (203) may be formed as integrally.

[116]

Wherein, said conductive connecting member (500A) one end of the substrate (100) from the control unit via the feed line to a circuit part is connected at the first side of, said conductive connecting member (500A) of said other outer conductor members (203) may be connected to electrically.

[117]

While, in the embodiment according to each of the present invention outer conductor members (203) at least antenna functions as formed of the segments are the position of an upper heater installed inside, outer conductor members (203) an uncoated portion out of function antenna during the of the segments are even when the which a non-intrusive, is 13 also to reference to a described.

[118]

The metal region in the embodiment according to one of the present invention of Figure 13 (a) to (c), non-metallic region features a description portion and articulated.

[119]

In the embodiment according to one of the present invention of Figure 13 (a) the conductive interconnect member (500) is connected is an outer frame conductor members (203) including outer conductor member as a whole is articulated a low structural..

[120]

In the embodiment according to one of the present invention of Figure 13 (b) the conductive interconnect member (500) is connected is an outer frame conductor members (203) the antenna which acts as a portion a low structural articulated and, in the embodiment according to one of the present invention, antenna conductor an external out of function segments the level of the amounts of interfering absence a structure portion is found for a..

[121]

In the embodiment according to the one of the present invention of Figure 13 (c) conductive interconnect member (500) is connected is an outer frame conductor members (203) the antenna which acts as a portion a low structural articulated and, in the embodiment according to one of the present invention antenna absence conductor an external out of function segments to two a structure portion is found for a..

[122]

Of Figure 13 (a), (b) and (c) refers to surface, conductive connecting member (500) drive, regardless of non-metallic region which may be present in an is electrically connected, further more presence a base metal region placed on an outer conductor members around the antenna functions as the segments. a non-intrusive a date in a portion. At least all the outer conductor absence conductive connecting members are to be joined so that the antenna functions as an outer't of the segments are the conductor members.

[123]

Antenna in the embodiment according to one of the present invention an external out of function independent of the presence of segments of the conductor members which, according to of the present invention in the embodiment just, outer conductor member is free segments used for antenna function of the insertion part and the holder, an outer of the segments are free whole using conductor members is enabled. Overall articulable free an outer conductor portion when the parts are bent about an inner and three dimensionally can be offer multiple advantages over.

[124]

While, in Figure 13 and 11 also to 4 in aforementioned, circuit part (150) and a conductive connecting member (500), which is disposed between the height achieved due to the omission (IM1) matching impedance number 1,2 and 3 also as shown in the, said circuit part (150) and a conductive connecting member (500) is at least two bodies separated be electrically coupled to one another is number 1 (IM1) part are coupled with impedance matching.

[125]

As well as, conductive connecting member (500) and a outer conductor members (203), conductive connecting member (500) and the substrate the ground portion of the, ground pattern (400) the ground portion of the and the substrate, and ground pattern (400) and an outer conductor members (203) has a electrically and directly connected or may be, additional impedance matching may be connected via.

[126]

The, number 1 impedance matching device capacitance matching impedance including (IM1), inductance device and resistance device may include at least one, in particular number 1 impedance matching in the case of being employed for device capacitance (IM1) to antenna efficiency can be improved.

[127]

The (c) to (a) also Figure 14 shows a current flow in the embodiment according to one of the present invention a description is..

[128]

To illustrate the flow of a current of Figure 14 (a) of an input signal to produce a sine wave signal in one example.. Amount of the input signal of Figure 14 (b) (+) phase. a a current path. The input signal of Figure 14 (c) negative (-) phase. a a current path.

[129]

In one example, refers to surface of Figure 14 (a) and (b), the current phase +, circuit part, feed line, impedance matching number 1, conductive engaging member, and a outer conductor members (203) through (CT1) connection end of number 1 after making member partially coming in contact with right-and-left direction of drawings sheet, outer conductor members (203) for radiation number 1 of conductor (203-1) and number 2 radiation for conductor (203-2) each of. to flow ground portion of the substrate. Furthermore, refers to surface of Figure 14 (c), the current-phase is and vice versa.

[130]

Number 1 in the embodiment according to + each of the present invention current flow phase of currents in the circuit part (current flow in the left) (PH1), feed line, impedance matching number 1, conductive connecting member, outer conductor members (203) of number 1 (CT1) connection end, outer conductor members (203) for radiation number 1 of conductor (203-1) is compared with the gas generated from the dry stoker surge, the ground portion of the substrate is formed.

[131]

Furthermore, current flow number 2 + phase of currents in the circuit part (PH2) (current flow in the right), feed line, impedance matching number 1, conductive connecting member, outer conductor members (203) of number 1 (CT1) connection end, outer conductor members (203) for radiation number 2 of conductor (203-2) is compared with the gas generated from the dry stoker surge, the ground portion of the substrate is formed.

[132]

And, such as a of Figure 14 (c), the aforementioned current-phase and phase + .flow in opposite directions.

[133]

Furthermore, conductor for radiation said number 1 (203-1) and number 2 radiation for conductor (203-2) comprises the without a segment each, said number 1 radiation for conductor (203-1) and number 2 radiation for conductor (203-2) tomatoes and cucumber are the only two stainless steel plates or even of the segments are't. Wherein, establishing an optical fiber at a side, the continuous conductive segments is not discontinuous quality by initiator, in one example, air or plastic a base metal such as can be material.

[134]

Furthermore, conductor for radiation said number 1 (203-1) and number 2 radiation for conductor (203-2) different resonant each of the antenna for forming a band applicable to main radiator. Wherein, different resonant band are identical to each other not in need end is delimited by a special particular frequency free, in one example, the edge lower than 1GHz 1GHz a high-frequency band and can be.

[135]

Said substrate (100) to conductive connection member (500) is said conductor frame (200) that the formed integrally with, said conductive connecting member (500) structure for connecting electrical other through said outer conductor members (203) can be electrically connected to, is an example of such a described by referring to a 15 having a.

[136]

One of the present invention also in the embodiment according to Figure 15 shows a conductor with coupling members a conductive structure for connecting frame is exemplary.

[137]

Refers to surface of Figure 15 (a), substrate (100) (of Figure 4 A2) to non-metallic region conductive connection member (500) and the conductor frame (200) of a structure for connecting, via hole (TH), contact (CLP) and clip (CA) may include a.

[138]

Said via hole (TH) a substrate (100) through a conductive holographic upper and lower faces of the frame, substrate (100) non-metallic region (of Figure 4 A2) resin materials connection member (500) is formed in the active, substrate (100) plays a role of a drift (CA) conductive contacts is electrically connected to, conductive connecting member (500) and a conductive contacts. electrically connects the (CA).

[139]

Said conductive contacts (CA) holds a conductive clip (CLP) conductor frame (200) may be connected to electrically.

[140]

The of Figure 15 (b), conductive connecting member (500) and the conductor frame (200) for the electrical connection of the top surface to the level of the surface of first and second for drawing and, of Figure 15 (c) a conductive connection member (500) and the conductor frame (200) is of the surface for electrical connection to the cathode is connected to similar on an inverted version of a clock is drawing.

[141]

Refers to surface of Figure 15 (b) and (c), a conductive connection member (500) and the conductor frame (200) of a structure for connecting, screw (SR) and conductive plates may comprise an (MP). Substrate (100) non-metallic region (of Figure 4 A2) resin materials connection member (500) and the conductor frame (200) the, electrical connection provided to save the space regardless of the height of, screw (SR) and conductive plates by (MP), electrically may be connected to.

[142]

As reference 15 also, conductive connecting member (500) and the conductor frame (200) various approaches, electrically connected to the structure for connecting among the persons can just one exemplary..

[143]

Also in the embodiment according to Figure 16 shows a multi-band antenna of configuring and operating one of the present invention is described.

[144]

With a 16 also, conductive connecting member (500) has door 16 as shown in, display panel (of Figure 5 300) display area of not overlapping of the terminal such that the can be arranged onto a part of the region of. Wherein, conductor frame (200) non-metallic region (202) the, establishing an optical fiber at a side, a detectiong portions are removed metal (e.g., air) may be a small, plastic or with other solid dielectric material such as. may consist of non-metallic materials.

[145]

In one example, non-metallic region (202) a conductive connection member (500) and providing a space for a radiation through a, non-metallic region (202) has is not particularly limited in the shape of the. One examples may be rectangular, can be is arranged in a curved shape, may be least one title number, plurality of. may consist of the original.

[146]

Drawing in each selection that exceeds a preset in the embodiment of the present invention non-metallic region (202) each CDK exhibiting are exemplary, limited to not.

[147]

With a 16 also, conductive connecting member (500) corresponding to one example the number 1 impedance matching unit (C10) the substrate by using a capacitance that is device (100) a circuit part provided (150) which can be connected to, such as shown in 15 also structure for connecting through conductor frame (200) in order to expose the bonding pad conductor members (203) connection stage electrically (CT1) may be connected to.

[148]

Substrate (100) a circuit part provided (150) has capacitance device (C10) and conductive connection member (500) through conductor frame (200) in order to expose the bonding pad conductor members (203) may be connected to electrically. And a substrate (100) (A1) metal region of conductor frame (200) (of Figure 4 201) metal region of electrically may be connected to. Wherein, substrate (100) of metal region (A1) and the conductor frame (200) of metal region (201) particularly in the connection means electrical connection means of which it is possible to is has is not particularly limited in surface of the table at predetermined intervals. 34 also to 28 also to is by referring to a described.

[149]

For example, with a 16 and 14 also, substrate (100) a circuit part provided (150) from the current feed line, impedance matching number 1 (IM1), conductive connecting member (500) for radiation number 1 and conductor (203-1) the substrate by using a (100) detects over-currents flowing to the ground portion of the current path number 1 can be a (PH1). In addition substrate (100) a circuit part provided (150) from the current feed line, impedance matching number 1 (IM1), conductive connecting member (500) and number 2 radiation for conductor (203-2) detects over-currents flowing to ground portion of the substrate by using a current path number 2 can be a (PH2).

[150]

Wherein, said number 1 of a high frequency band the (PH1) current path can be in the current path, said number 2 current path of the low frequency band (PH2) can be current path is established.

[151]

The, said conductive connecting member (500) is outer conductor members (203) that are electrically coupled to the at position its resonant frequency band a frequency used for selection can vary with.

[152]

The conductive connecting member (500) has an outer conductor members (203) or substrate (100) of metal region (A1) or conductor frame (200) of metal region (201) electrically and directly connected to a can be, or impedance may be connected the, case an impedance device according to a value impedance of an antenna cover can be change zones.

[153]

Figure 17 shows a multi-band antenna and operation of the resonance region in which a is also described of Figure 16.

[154]

Which is applicable to, in this 16 also also Figure 17 shows a serialized feed-coupling antenna and operation of the resonance region in which a is surface to explain the.

[155]

Also as shown in 17, number 1 (IM1) matching impedance conductive line device (e.g., capacitor element) is applied and the capacitance is shifted from a predetermined mode to join serialized feed-coupling antenna capable of operating in which, case an through coupling capacitance, also 17 shown in everywhere that a conductive path is loop-shaped such as can be formed.

[156]

Wherein, said feed line circuit portion (+) connected to impedance matching number 1 (IM1) has capacitance device (e.g., capacitor) .may be implemented with. Instead according to said capacitance device or necessary, an inductance device (IM1) said number 1 impedance matching (e.g., inductor) and resistance such as may be embodied in discrete element.

[157]

Or, the, method for manufacturing capacitance element impedance matching said number 1 (IM1), inductance element and resistance or includes at least one of, elements can be to a bottom of the.

[158]

Also in Figure 17 and 16, the direction of the current flow in phase + blocked out flow, also 16 and in Figure 17, of the current flow to the length so as the electronic elements has an performance to the surface of glass, right elongated electrical low frequency portion (fL) resonator which may be, electrical length is shortened the left portion (fH) is a high frequency resonator can be formed.

[159]

Feed line connected to said capacitance in adjustment department impedance number 1 a piezoelectric device inductance element may be, non-antenna at a temperature of 100-140 lock the coupled, the antennas of the loop configuration different resonance when the antenna can be formed.

[160]

Figure 18 shows a multi-band antenna of in adjustment department impedance number 1 is of Figure 16 and improved method and apparatus for frequency characteristic of a transfer system.

[161]

Also 18 of Figure 17 and 16 also the number 1 of multi-band antenna impedance matching by a wireless local loop (IM1) a first (SWR: standing-wave-ratio) contrast frequency plots on is used as a transmitter of.

[162]

Also with a 18, said number 1 (of Figure 2 IM1) impedance matching the that capacity device is used example features calibration data with respect to the frequency characteristics. Wherein, number 1 impedance matching provide an impedance a, pattern, electrode, absence the driving circuit alternately at least one metal circuit and can be a device, an impedance device the impedance capable of providing specific not limited to components.

[163]

Also with a 18, the aforementioned of the current flow loop along the length of, electrical, the loop length long or low-frequency resonator and, electrical loop length is shortened can be formed is-frequency resonator. In addition said number 1 impedance matching coupling (IM1) is based on the amount the antenna 50 can be ohmic matching. Also case an as shown in the 18, better or low-frequency resonator can be properties which.

[164]

While, conductive connecting member (500) and a outer conductor members (203), conductive connecting member (500) and the substrate (100) the ground portion of the, ground pattern (400) and the substrate (100) the ground portion of the, and ground pattern (400) and an outer conductor members (203) has a electrically and directly connected may be, additional impedance matching may be connected via. The also 19 and 20 reference to a described.

[165]

Also in the embodiment according to Figure 19 shows a multi-band antenna of configuring and operating one of the present invention is described.

[166]

Also refers to surface 19, said a multi-band antenna, each in the embodiment according to the aforementioned of the present invention a multi-band antenna, (IM1) matching impedance number 1, number 3 and number 2 (IM2) (IM3) impedance matching at least one impedance matching impedance matching may further include any.

[167]

Wherein, said number 1 (IM1) impedance matching the circuit and conductive connecting member (500) may be included in feed line between.. Impedance matching said number 2 (IM2) a conductive connection member (500) and a outer conductor members (203) can be enclosed between the. And, said number 3 (IM3) impedance matching a conductive connection member (500) and the substrate a point located between both ends of (100) the ground portion of the can be contained between separating containing.

[168]

The, impedance matching in Figure 19 (IM1) the number 1, number 3 and number 2 (IM2) impedance matching impedance matching including both (IM3) but it is shown a e.g., one layer of material to the mike and the exemplary, not limited to.

[169]

Furthermore, impedance matching (IM1) said number 1, number 3 and number 2 impedance matching impedance matching (IM2) correlate the rectangular areas to a preset impedance (IM3) each having fixed to fixed impedance matching or impedance capable of changing variable impedance 202a, 202b can be.

[170]

For example, fixed impedance matching predetermined provide an impedance with at least one compound capable of impedance element can be implemented by. In one example, a capacitor impedance element, inductor and resistance the active elements and the passive elements can be is.

[171]

In one example, variable impedance matching varactor diode (Varractor diode) such as the variable impedance element may comprise, using switching elements for variable impedance circuit impedance may include, variable impedance circuit and the variable impedance element may include both.

[172]

Said fixed impedance matching at least two of elements 202a, 202b variable impedance or when the 2 including, a series-parallel circuit various can be to a bottom of the.

[173]

Furthermore, impedance matching (IM1) said number 1, number 3 and number 2 (IM2) impedance matching (IM3) using fixing elements each when impedance matching including, variable element of may further comprise a pump, and a central control system. can be made variable impedance.

[174]

And, number 1, number 2 and number 3 (IM3) impedance matching (IM1, IM2, IM3) variety of through impedance variation at least one of cover and the antenna can be change band, in the embodiment according to one of the present invention eventually LTE full multi-band by the antennas can be cover cylindrical body.

[175]

In the embodiment according to number 1 (IM1) matching impedance also Figure 20 shows a one of the present invention is exemplary.

[176]

the number 1 impedance matching of Figure 20 (a) (C10) device capacitance is fixed (IM1) implementing informed fixed impedance including a is example.

[177]

the number 1 impedance matching of Figure 20 (b) is varied (IM1) variable impedance including a coupling element or circuit (C20) implementing example is informed. The, control voltage (SC) number 1 (IM1) according to mass of the impedance matching may be variable.

[178]

the number 1 impedance matching of Figure 20 (c), method for manufacturing capacitance element is fixed (IM1) (C11) and a, , method for manufacturing capacitance element fixing said varactor diode (CV) (C11) in parallel to a variable impedance including implementing example is informed. The, said C12 and C13 the DC blocking capacitor can be in the, SC capacity of the varactor diode (CV) (SC) and a control voltage for controlling the, R11 control voltages (SC) is resistance provide a ground path for a of.

[179]

the number 1 impedance matching of Figure 20 (d), method for manufacturing capacitance element is fixed (IM1) (C11) and a, (C11), method for manufacturing capacitance element fixing (Switched) switched in parallel to said impedance circuit is informed variable impedance including implementing example. Wherein, said switched impedance circuit are connected to each other in series switch (SW1) and a capacitor (C12) may comprise, or/and connected to each other in series switch (SW2) and a may comprise an inductor (L11).

[180]

As such, of Figure 20 (a), (b), (c) and (d) (IM1) is fixed impedance element impedance matching the number 1, the variable impedance element, user switch or the like can be configured a determined thickness to the mike and the example, not limited to.

[181]

On the other hand, said number 1 impedance matching using a fastening a capacitor (IM1) (C11), method for manufacturing capacitance element) when including a, , method for manufacturing capacitance element fixing said low primarily ohmic matching through capacitive elements 50 which can be used basic, the ohmic 50 for detemining 18 also by resonator as shown in can be noise amplifier is used for receiving.

[182]

Said switched impedance circuit plural switch and a plurality of passive element (R device, L device, C device) may comprise an.

[183]

Or more described impedance matching in number 1 (IM1) but is described one embodiment of, the description, said number 2 and number 3 (IM2, IM3) herein, the impedance matching can be applied. As such, in one in the embodiment of the present invention, impedance matching number 1 (IM1) a part which is described (IM2, IM3) number 2 and number 3 impedance matching a description is different even without a can be applied.

[184]

Figure 21 shows a multi-band antenna descriptions and, number 2 of multi-band antenna of Figure 19 also Figure 22 shows a in adjustment department impedance is from the server devices and displays the characteristics of Figure 19.

[185]

Also refers to surface 21 and 22, of Figure 21 number 1 impedance matching door has (IM1) 21 as shown in the, to match a resonant not match and serves to direct a minor axis and a.

[186]

A high impedance matching said number 1 (IM1) includes capacitive elements including elements eliciting or inducing an non-antenna coupling when the PIFA (Planar Inverted-F Antenna) may operate in or loop antenna.

[187]

Furthermore, also refers to surface 21 and 22, number 1 impedance matching to match a resonant not a mating (IM1) a minor axis and a but can act as a, is connected to the semiconductor layer. difficulty provides the illusion mobile resonance.

[188]

Also as shown in the 22, the use of a matching impedance number 2 (IM2), length characteristics for a loop of the current flow and can be varied, said number 2 (IM2) is inductive, making impedance matching including element by increasing the length of a loop when the main vice versa when used capacitive elements relatively length of loop can be is smaller. The low-frequency and high-frequency mobile adapted to resonate in an..

[189]

Figure 23 shows a multi-band antenna of number 3 (IM3) impedance matching from the server devices and displays the characteristic of a transfer system is of Figure 19.

[190]

Also 22 and 23 with a, the use of a matching impedance number 2 (IM2), resonator is of the movement of more low frequency or high-frequency wave so as to branch off (IM3) number 3 impedance matching can be using.

[191]

The center of which lies on the (G12) graph of Figure 23, left transferred to a point chain line transferred to a right graphs and lunch a graph, number 3 impedance matching is implemented in device are capacitively (IM3) surface, and movement adapted to resonate in an low frequency, inductive element is implemented in. mobile adapted to resonate in an high frequency further surface.

[192]

Wherein, capacitive element and an induction correction piece of cross arm for deflection mobile resonator using the Image through a general change in the condition and various ambient condition can vary with.

[193]

Figure 24 shows a multi-band antenna in PIFA antenna or loop antenna is also frequency characteristic of of Figure 19.

[194]

Also refers to surface 24, in one example, number 1 impedance matching that capacity device which does not contain (IM1) is, high both sexes elements or resistance, inductive elements when including features frequency characteristic of an antenna for a.

[195]

Also refers to surface 24, in one example, antenna is capacitance coupling forming the loop antenna or PIFA may operate in. In this case wireless local loop 24 also characteristics shown in graph (G13) such as a might be shown, panel conditions generally in antenna patterns may be varied depending to requirements.

[196]

One of the present invention also in the embodiment according to Figure 25 shows a whole by multi-band antenna LTE is frequency characteristic representation of the frequency band.

[197]

The graph of Figure 24 and a (G12) graph also 25 of Figure 23 is shown (G13) together. Also refers to surface 25, the aforementioned number 1, number 2 and number 3 impedance matching (IM1, IM2, IM3) (IM3), conductive connecting member, outer conductor members, outer conductor member using area for metallization of a substrate containing, LTE entire band can be cover both can be viewed.

[198]

For example, number 1 and number 2 (IM2) impedance matching impedance matching (IM1) a combination of (center frequency fL) 824-960, (center frequency fM) 1710-2170 2300-2690 and (center frequency fH) can be satisfy a, number 3 impedance matching to a (IM3) 703-803 absorbing. Also combination various other well as. cover.

[199]

Figure 26 shows a also one of the present invention is exemplary a in adjustment department impedance in the embodiment according to number 1.

[200]

The number 1 of Figure 26 (a) impedance matching including e.g. a (C10) device capacitance is fixed (IM1) a.. In one example, fixing capacitance device can be is a capacitor (C10).

[201]

Impedance matching the number 1 of Figure 26 (b) (C10) without the use of (IM1) is fixed capacitance device, by using conductive member 2 may provide a capacitance.

[202]

Of Figure 26 (b) refers to surface, conductive connecting member (500) end of (500T1) adjacent to conductive connecting terminal (CCT1) may be formed. The, said conductive connecting member (500) end of (500T1) and a conductive connecting terminal vicinity of each other (CCT1) manner a capacitance along a capacitive coupling a e.g. forming a..

[203]

The number 1 of Figure 26 (c) (IM1) matching impedance conductive connection member (500) end of (500T2) is of Figure 26 (b) has a large area to than, conductive connecting member (500) end of (500T2) and a capacitance coupling (CCT2) in addition of Figure 26 (b) forming a conductive connecting terminal shown in of area greater than (CCT2) terminal conductive connection may include a.

[204]

Case an, relatively large area caused by coupling large capacitance coupling a e.g. forming a..

[205]

Figure 27 shows a in adjustment department impedance from the server devices and displays the characteristics of the present invention also is one in the embodiment according to number 1.

[206]

The number 1 impedance matching of Figure 27 (a) (IM1) is fixed capacitance device including. a e.g. a (C10).

[207]

The number 1 impedance matching of Figure 27 (b) (IM1) is fixed capacitance device when-implemented (C10) paths are formed in the as a graph show band resonator, number 1 impedance matching (C10) 4 input sample pixels in vertical direction (IM1) is fixed capacitance device, in (fL) low frequency band of 1GHz hereinafter having or low-frequency resonator, such as G11 (RP11), fundamental resonant frequencies, such as G11 (RP12) corresponding to frequency multiplying of a resonant..

[208]

Simultaneously in 1GHz or more high frequency band (fH) having frequency resonator such as a G12, G12 of fundamental resonant frequencies of at equally useful multiplying frequency (not shown) corresponding to a resonant can take the. Wherein, the fixing capacitance device (C10), in one example, low dose of 10pF hereinafter can be device.

[209]

Furthermore, the number 1 impedance matching of Figure 27 (c) (IM1) is fixed inductance element including. a e.g. a (L10).

[210]

The number 1 impedance matching of Figure 27 (d) (IM1) is fixed inductance element when-implemented (L10) paths are formed in the as a graph show band resonator, number 1 impedance matching (L10) inductance element is fixed (IM1), such as during or more 1GHz G13 4 input sample pixels in vertical direction, can take the frequency resonator.

[211]

Another hand, frame conductor terminal in the embodiment according to each of the present invention (200) into a substrate to when including, said conductor frame (200) of metal region (201) and said substrate (100) of metal region (A1) is positioned on an edge of the plurality of contact conductor line may include a (cm). 34 and 28 also to is by referring to a described.

[212]

One of the present invention also in the embodiment according to Figure 28 shows a dense inter-frame and the conductor substrate, a contact conductor line is in one example of.

[213]

With a 28 also, in the embodiment according to one of the present invention substrate (100) of metal region (A1) and the conductor frame (200) of metal region (201), densely formed, a contact conductor line (cm) electrically through may be connected to. Wherein, said contact conductor line (cm) a substrate (100) (e.g., metal region) the ground portion of the other and the substrate conductor (e.g., conductor frame or/and outer conductor rear fixed) electrically connected to each other by a. means for.

[214]

Also 28 (cm) conductor line contact an example shown in uniform, is formed tightly which the persons can just example, such densely formed, a contact conductor line the greater said substrate (100) of metal region (A1) and the conductor frame (200) of metal region (201) to an one conductive connection member. may be modeled with.

[215]

In one example, that it is densified conductor line contact the contact conductor line face up, the distance between the short than the wavelength of frequency usage band can be means.

[216]

One of the present invention also in the embodiment according to Figure 29 shows a conductor line contact structure by arrangement of terminal is exemplary.

[217]

The substrate of Figure 29 (a) (100) and the conductor frame (200) arranged in upper and lower each other contact to the structure of the exemplary conductor line features. Refers to surface of Figure 29 (a), substrate (100) of metal region (A1) and the conductor frame (200) of metal region (201) the plurality of contact conductor line electrically by may be connected to.

[218]

Conductor frame of Figure 29 (b) cover means of a metallic compound (200A) and the substrate (100) arranged in upper and lower each other contact to the structure of the exemplary conductor line features.

[219]

Refers to surface of Figure 29 (b), outer conductor (203A) cover conductor with conductor frame (200A) and the substrate (100) (A1) metal region of the plurality of contact conductor line electrically by may be connected to.

[220]

Of Figure 29 (c) of a cover (50), substrate (100) and a conductor frame (200) is located at this order, separate outer conductor members (203B) to a structure having at, a contact conductor line exemplary features.

[221]

Of Figure 29 (c) refers to surface, substrate (100) of metal region, conductor frame (200) for conductor members (203B) the plurality of contact conductor line electrically by may be connected to.

[222]

Of Figure 29 (a), (b) and (c) refers to surface, contact conductor line is current path can provide an, substrate (100) of metal region (A1), conductor frame (200) of metal region (201) for conductor members (203B or 203A or 203) according to the position the electrical connections between the resonance can be altered in terms of..

[223]

Furthermore, in the embodiment according to terminal each of the present invention, said substrate (100) of metal region (e.g., ground) and the conductor frame (200) conductor line plurality of contact between conductor line contact some of selecting or non switching device for selecting a may comprise an (of Figure 30 SWD).

[224]

In one example, the (SWD) said switching device, said substrate (100) of metal region (A1) and the conductor frame (200) at least conductor line plurality of contact between for selecting one of the at least one switch may comprise an.

[225]

Also Figure 30 shows a conductor line contact in the embodiment according to one of the present invention for selecting a switching device (SWD) is exemplary.

[226]

If reference 30 also, in the embodiment according to terminal each of the present invention, in one example, said terminal, said substrate (100) of metal region (A1) and the conductor frame (200) between number 1, number 2 and number 3 contact conductor line (CM1, CM2, CM3) when including a, the (SWD) said switching device, said substrate (100) of metal region (A1) and the conductor frame (200) between number 1, number 2 and number 3 contact conductor line (CM1, CM2, CM3) for selecting a number 1, number 2 and number 3 switch (SW11, SW12, SW13) may comprise an.

[227]

Wherein, said number 1, number 2 and number 3 contact conductor line (CM1, CM2, CM3) each one end of the conductor frame (200) of number 1, number 2 and number 2 contact point (P21, P22, P23) and capable of being connected to a, its respective other said substrate (100) of number 1, number 2 and number 2 (P11, P12, P13) and a contact point may be connected to.

[228]

Said number 1 switch (SW11) the substrate (100) of number 1 (GND11) ground contact point (P11) and a number 1 which can be arranged on the between, said number 2 switch (SW12) the substrate (100) of (P12) and a number 2 number 2 (GND12) ground contact point between may be located on, the (SW13) switch said number 3 said substrate (100) of number 3 (GND13) ground number 3 and a contact point (P13) can be disposed between the.

[229]

The number 1, number 2 and number 3 switch (SW11, SW12, SW13) each state or an off-state according to so as to realize, number 1, number 2 and number 3 contact conductor line (CM1, CM2, CM3) particular one of contact conductor line is selected or non can be selected.

[230]

Wherein, said number 1, number 2 and number 3 switch (SW12, SW12, SW13) a arrangement position of the selecting conductor line contact said to enable a which it need not be limited specifically, in one example substrate (100) can be disposed.

[231]

As such, both conductor line plurality of contact switch of Figure 30 can be applied to, alternatively, plurality of contact conductor line can be applied to a portion of.

[232]

A power management component uses, one of the present invention in the embodiment according to terminal having a Bluetooth function, or variable impedance through said impedance matching, connecting conductor line contact through the switch the guidance by (off) (on) or short, antenna resonant various can be easily changed.

[233]

* Also 28 to as exemplary one conductor line of contact in Figure 30, the detection position or the thereof for has is not particularly limited in number.

[234]

Also in the embodiment according to Figure 31 shows a contact conductor line implementation of one of the present invention is exemplary. C clip of Figure 31 (a) and (b) (SR2) and screw (CLP2) conductors, a contact using selection that exceeds a preset structure of conductor line is drawing.

[235]

Refers to surface of Figure 31 (a), substrate (100) of metal region (A1) and the conductor frame (200) of metal region (201) conductor C sources are electrically connected by clip (CLP2) can be connected, or screw (SR2) by said substrate (100) of metal region (A1) and the conductor frame (200) of metal region (201) directly may be connected to. To so that to is the description.

[236]

First over and the drawing of Figure 31 (b), substrate (100) (A1) metal region of the substrate (100) to a conductive water film layer formed via hole (TH2) the substrate through the (100) plays a role of a drift (CA2) to which makes contact with conductive contacts, conductors (CA2) is conductive contacts C clip (CLP2) conductor frame (200) may be connected to electrically.

[237]

Second over and the drawing of Figure 31 (b), substrate (100) and the conductor frame (200) is, electrical connection for first and second level of the surface of a an example of such a.. Third over and the drawing of Figure 31 (c), substrate (100) of metal region and the conductor frame (200) is, of the surface for electrical connection to the cathode is connected to similar when. a an example of such a.

[238]

Third and of second interleavers in the units of drawing of Figure 31 (b) with a, substrate (100) of metal region (A1) and the conductor frame (200) is, electrical connection provided to save the space regardless of the height of, screw (SR2) and conductive plates (MP2) a substrate, by means of an (100) of metal region (A1) and the conductor frame (200) an electric wire electrically connecting to the effects of levodopa, and can of wet liquid to flow down.

[239]

Also referenced on description 31, substrate (100) of metal region (A1) and the conductor frame (200), electrically connected to the respective ones of means for. the persons can just one example.

[240]

Also in the embodiment according to Figure 32 shows a dense one of the present invention, a contact conductor line according to plane current and sterically and exemplary path of, uniform one in the embodiment according to Figure 33 of the present invention, a contact conductor line modes plane current and sterically is exemplary path of.

[241]

Of Figure 32 (a) and (b) the substrate (100) of metal region (A1) and the conductor frame (200) is densified conductor line contacts between a exemplary features.

[242]

Refers to surface of Figure 32 (a) and (b), substrate (100) of metal region (A1) and the conductor frame (200) (cm) conductor line contacts each other by densely is connected, feed line which is turned on to carry current from circuit part, conductive engaging member, and a outer conductor through the member after, the selected (cm) conductor line contact number 1 and if circuit portion shortest to ground is allowed to flow through the path.

[243]

Of Figure 33 (a) and (b) the substrate (100) of metal region (A1) and the conductor frame (200) DOTTY-uniform conductor line contacts between an exemplary scavenger forming features.

[244]

Refers to surface of Figure 33 (a) and (b), substrate (100) of metal region (A1) and the conductor frame (200) by conductor line contacts is connected non-uniformly DOTTY, feed line which is turned on to carry current from circuit part, conductive engaging member, and a outer conductor through the member after, in (CM2) conductor line contact number 1 is off, directly circuit part closest to the ground portion of the and prevents the flow of through the passageway, number 1 (CM1) conductor line contact adjacent to the closest number 2 contact conductor line (CM2) current is caused to flow via the, the of Figure 32 (a) and (b) a current path shown in which, unlike current path is established and it will be, antenna resonant the can be altered.

[245]

One of the present invention also in the embodiment according to Figure 34 shows a contact conductor line light oil/charge not passing according to. surface thereof, and the resonance frequency characteristic show.

[246]

The number 1 of Figure 34 (a) contact conductor line (CM1) is selected for the case when the selection that exceeds a preset a current path is drawing. Of Figure 34 (a) refers to surface, contact conductor line number 1 (CM1) is selected (CM1) conductor line contact number 1 when the current through the path is established it is found that the.

[247]

The *of Figure 34 (b) contact conductor line is not selected and number 1, number 2 contact conductor line is selected for the case when the selection that exceeds a preset a current path is drawing. Of Figure 34 (b) refers to surface, contact conductor line number 1 (CM1) is selected is not current is provided to increase through (CM1) conductor line contact said number 1, adjacent (CM1) conductor line contact said number 1, which is of a selected number 2 contact conductor line (CM2) flow current through the. it will be.

[248]

Of Figure 34 (a) and (b) refers to surface, contact conductor line includes a voice input part current path is changed surface, in one example of Figure 34 (a) such as a when the selected (CM1) conductor line contact said number 1, electrical current path relatively short length when the low frequency of the bands and a relatively high frequency band. may be positioned resonance. In one example also 34 is said number 1 (b) such as a contact conductor line (CM1) is selected if this is not the case, electrical current path length is relatively long low frequency of the bands and relatively low frequency with resonance of pick current density is.

[249]

According to establishing an optical fiber at a side, corresponding contact conductor line through the switch on/off the (On/Off) the first variable width of the resonance frequency. I.e., contact conductor line position change according to advantage can be to change the path current at, the antenna electrical Multicast is connected, the change in length adapted to resonate in an electrical. is variable frequency.

[250]

Wherein, in of the present invention in the embodiment, the position of the conductor line contact in which the desired frequency and capable of measuring the position with. can be other.

[251]

While, for the change in length antenna resonant other, a contact conductor line in addition to, a contact conductor line the tightly the thin film transistor substrate (100) of metal region and the conductor frame (200) may be modeled with one conductor is in that, one frame and the conductor substrate (GND) is the ground portion of the loss of current should advantageous in that can be reduced in the..

[252]

On the other hand, different band service local cellular services from a example, past to test the corresponding devices by mobile phone services of a carrier's network but can be used only to test the corresponding devices by network as well as modern mobile phone different carrier's services. horn radiating units. Communication Company provider each frequencies assigned to different input button of portable communication to the typical frequency band must cover various different service area, in one example other can be using roaming service even.

[253]

As such a wide frequency band so as to cover, a pigmented or switch or the like one or more antennas using network impedance variation of frequency, for example by selecting method can be using roaming service.

[254]

In one example, in the embodiment according to one of the present invention upon application mobile phone in power terminal, the controller algorithm scan band automatic, mobile phone the impedance in any rotational conductor line contact and, to scan and band all a searchable, most potent base station to scan a signal bandwidth of which, most potent signal bandwidth usage band for printing can be set according..

[255]

In the aforementioned of the present invention each in the embodiment, impedance matching number 1, number 3 and number 2 impedance impedance adjustment vice-middle least one of capacitance coupling or inductance element 1GHz by or a combination thereof as well as a high-frequency band higher than, a lower low frequency band in particular 1GHz the torsion bar is used for cover an can be viewed.

[256]

The aforementioned of the present invention in the embodiment according to, conductor frame mounted between a bottom of the first yield of the flexible driving control second drive signals in response to the, the AC/DC inverter is arranged in and design may man runaway.

[257]

100: substrate 200: conductor frame 203,203A, 203B: outer conductor members 300: display panel 400: ground pattern 500: conductive connecting member



[1]

A multi-band antenna according to one embodiment of the present invention comprises: an impedance matching unit having one end electrically connected to a feed node of a circuit unit mounted on a substrate and the other side; a conductive connection member having one end electrically connected to the other end of a first impedance matching unit and the other side; an outer conductor member arranged from a first connection end electrically connected to the other end of the conductive connection member to each of a first path end and a second path end which are different points; and a conductor frame electrically connected to the each of the first and second path ends of the outer conductor member and a ground part of the substrate. The outer conductor member includes: a first emission outer conductor arranged between the first path end of the outer conductor and the first connection end; and a second emission outer conductor integrally formed with the first emission outer conductor, and arranged between the second path end of the outer conductor and the first connection end. According to one embodiment of the present invention, the present invention provides a multi-band antenna capable of covering a multi-band by using a non-segmented outer conductor among outer conductors, and a terminal including the same.

[2]

COPYRIGHT KIPO 2016

[3]

[4]

  • (100) Substrate
  • (150) Circuit unit
  • (200) Conductor frame
  • (300) Display panel
  • (50) Cover
  • (A1,201) Metal region
  • (A2,202) Non-metal region



A multi-scanning; are located in regions non-metallic terminal, said other end and that is coupled to circuit part from an elastic conductive connection member; connected the other end of a connecting element conductive said number 1 number 1 a other stage such connected and path until each path number 2, arranged along said terminal in order to expose the bonding pad, the each path number 2 said number 1 path and said substrate connected to the ground portion of the conductor members is an outer frame; and a display for displaying information from said circuit part panel; includes, said outer conductor member, said number 1 and path is disposed between connection end said number 1, number 1 number 1 frequency band which acts as a radiator for radiation conductor; and said number 1 is formed of conductor for radiation, said number 2 path and is disposed between connection end said number 1, number 2 frequency band other frequency band and said number 1 which acts as a radiator for radiation number 2 conductor; a including terminal.

According to Claim 1, said controller varies capacitance of one of the circuit part has both ends, and both ends is electrically connected to node once and said conductive connection member is/fail data having impedance matching number 1 ; and said outer conductor members of said and each path number 1 and number 2 the ground portion of the substrate connecting the conductors making up the frame; further including terminal.

According to Claim 1, for radiation for radiation said number 1 number 2 conductor minute description electrical conductor length and other electrical length the host computer from the terminal.

According to Claim 1, said conductive the connecting member is radiation for radiation said number 1 number 2 conductor and respective electrical conductor for smaller length greater than the length the host computer from the terminal.

According to Claim 1, said conductive connecting member 300 outer conductor members and physical connected to each other being an integrally formed terminal.

According to Claim 1, said terminal, said conductive with coupling members of said outer conductor members disposed between the connection end number 1 number 2 further including terminal impedance matching.

According to Claim 1, said outer conductor member, said conductor and an terminal.

According to Claim 1, said metal feature frame conductor said metal resistance area a plurality of contact conductor line; further including terminal.

According to Claim 1, said metal feature frame conductor said metal resistance area a plurality of contact conductor line; and said conductor metal region and said DC-DC converter for a plurality of contact conductor line some of contact conductor line selecting or non switching device for selecting a; further including terminal.

According to Claim 2, said conductive connection portion the minute description which it measures conductor frame is disposed in a zigzag, said outer conductor the sub control unit which is formed integrally with the terminal.

According to Claim 2, with coupling members conductive said outer said number 2 impedance matching disposed between the conductor members; and said conductive with coupling members located between the ground substrate said impedance matching number 3 ; further including terminal.