ADHESIVE COMPOSITION WITH EXCELLENT HEAT-RESISTANCE AND ADHESIVE

Advantages and features of the present invention, achieve the reference method and an electronic component in the embodiment carry the activitycopyright will however, in the present invention refers to hereinafter is limited to disclosure in the embodiment are different but may be implemented in various forms which, in the embodiment of the present invention disclosure are complete and can be utilized for only the, in person with skill in the art of the invention the present invention is provided to a target number for confirming button to complete ball which categories, defined by category of the present invention refers to claim only disclosed. Throughout the specification the same references refer to the same components.

The present invention 2 is automatically change number composition for victims of the study, weight average molecular weight of about 5,000,000 to about 15,000,000 in (meta) acrylic ester photocurable resin and C₈ To C₁₄ Alkyl (meth) acrylate monomer by, number number is checked against a high pressure liquid coolant composition may be an adhesive having excellent heat resistance, the present invention the arrears of work.

Hereinafter, the present invention is described therein that are directionally.

Ceramics composition and preparation number composition

The present invention refers to number 1 (meta) acrylic ester monomer, a photo polymerization resin including disclosure number and optical crosslinking monomer (meta) acrylic ester polymers number number 2 (meta) acrylic ester monomer prepared by the photocurable resin and including ceramics composition and preparation number de-ionized number [...] substrate.

Weight average molecular weight of about 5,000,000 to about 15,000,000 said ceramics composition and preparation number composition of high molecular weight (meta) acrylic ester photocurable resin by including in, adhesive film is improved in heat resistance can be prepared by the number therefrom.

A weight average molecular weight exceeds said photocurable resin of poor adhesive number increases to 15,000,000 side surface coating thickness variation is reduced door number point at the disclosed.

In addition, number 2 (meta) acrylic ester monomer by said photocurable resin, an adhesive can be wider than the adhesive wettability number is given the right to equal to or less than.

Said number 2 (meta) acrylic ester monomer (meta) acrylate methyl, ethyl (meta) acrylate, n - propyl (meta) acrylate, isopropyl (meth) acrylate, n - butyl (meth) acrylate, butyl (meth) acrylate t -, sec - butyl (meth) acrylate, neopentyl (meta) acrylate, 2 - ethylhexyl (meth) acrylate, 2 - ethyl butyl (meth) acrylate, n - octyl (meta) acrylate, octyl isocyanate (meta) acrylate, (meth) acrylate methacrylated, ISO nonyl (meth) acrylate and combination thereof may be one selected from the group consisting, preferably C₈ To C₁₄ Alkyl (meth) acrylate monomer and, most preferably be a methacrylated (meta) acrylate.

Specifically, (meta) acrylic ester photocurable resin 100 parts by weight of said, 8 to 15 parts by weight of said number 2 (meta) acrylic ester monomer, most preferably 9 to 10 parts by weight can be. Said heat resistance and adhesion range when mixed adhesive number can be most optimized.

I.e., said photocurable resin of high molecular weight (meta) acrylic ester (meta) acrylic ester monomer number 1, including a secondary light polymerization resin polymerization composition 1 crosslinking monomer and optical disclosure number (meta) acrylic ester photocurable resin and said prepared by the number of high molecular weight (meta) acrylic ester monomer composition [...] number including the number 2, and a high heat and high mark tightly characteristic can be obtained by light-imparting adhesive number.

Said number 1 (meta) acrylic ester monomer (meta) acrylic ester photocurable resin crosslinking monomer polymers can be synthesized.

Specifically, 100 parts by weight of said number 1 (meta) acrylic ester monomer, said crosslinkable monomer 3. 5 to 7 parts by weight of polymers including composition number can be high pressure liquid coolant.

Crosslinkable monomer 3. 5 parts by weight of an adhesive number can be turned into high heat resistance and reduced when less than including weak cohesion, 7 parts by weight of a polymerization initiator formed member is much reduced adhesive properties when cohesion exceeds door number flow tides.

Specifically, said number 1 (meta) acrylic ester monomer is methyl (meth) acrylate, ethyl (meth) acrylate, n - propyl (meta) acrylate, isopropyl (meth) acrylate, n - butyl (meth) acrylate, butyl (meth) acrylate t -, sec - butyl (meth) acrylate, neopentyl (meta) acrylate, 2 - ethylhexyl (meth) acrylate, 2 - ethyl butyl (meth) acrylate, n - octyl (meta) acrylate, octyl isocyanate (meta) acrylate, (meth) acrylate methacrylated, nonyl (meth) acrylate and combinations thereof selected from the group consisting isocyanate can be one disclosed.

In particular, said number 1 (meta) acrylic ester monomer is 2 - ethylhexyl (meth) acrylate (meta) acrylate methacrylated can weight ratio 3:1 to 4:1.

Said 2 - ethylhexyl (meth) acrylate (meta) acrylate ratio methacrylated polymer when photocurable resin composition including including, adhesive number both heat resistance and durability can be improved...copyright 2001.

Said crosslinkable monomer, copolymerizable functional group (e.g., carbon - carbon double bonds) to molecular structure and crosslinkable functional group monomer including simultaneously by big.

Said crosslinkable monomer, e.g., monomer containing hydroxyl, carboxyl containing monomer or a nitrogen-containing monomer can be selected from the group consisting one and combinations thereof, is not limited.

Said crosslinkable monomer, specifically, 2 - hydroxyethyl (meth) acrylate, 2 - hydroxypropyl (meta) acrylate, 4 - hydroxy butyl (meth) acrylate, 6 - hydroxy hexyl (meta) acrylate, 8 - hydroxy octyl (meta) acrylate, 2 - hydroxy ethylene glycol (meth) acrylate, 2 - hydroxy propylene glycol (meth) acrylate such as hydroxy-containing monomer; acrylic acid, methacrylic acid, 2 - (meth) acrylic with the jade city which rises acetic acid, 3 - (meta) acrylic acid profile with the jade city which rises, with the jade city which rises butyric acid 4 - (meta) acrylic, acrylic double body, itaconic, maleic acid such as carboxyl group-containing monomer; 2 - isocyanatoethyl (meth) acrylate, 3 - (meta) acrylate at the time of this toe pro which it knows it will bloom isocyanate, 4 - isocyanate at the time of this toe butyl which it knows (meta) acrylate, (meth) acrylamide, N - vinyl pyrrolidone, vinyl caprolactam N - such as nitrogen-containing monomer; and combinations thereof can be selected from the group consisting one, be a most preferably acrylic acid.

Number of high molecular weight alkyl (meta) acrylate resin to said adhesive composition is produced by polymerization at the allocatable resources more implementing high viscosity.

The degree of polymerization generally polymer composition has a viscosity polymer (also referred to as conversion), total solids content (TSC, total solid content), determined by the molecular weight and the like. The same molecular weight having different viscosity even if the different degree of polymerization which is able to disclosed. In addition polymer or different viscosity also depends on the kind of component comprising of compositional ratio is determined by the molecular weight since without to be rented, viscosity increasing order to improve the molecular weight is one method which is able to disclosed.

After said adhesive composition viscosity number photopolymerization variously guide, e.g., preferably about 100,000 cp low 25 °C can be implemented, as in the case of having a solids level of 5 wt % and a weight average molecular weight as high as 15,000,000 500,000 cp 25 °C can be implementing. For example, a solids level of from 3 to 10 wt % of the total weight of said adhesive number when, in viscosity to 10,000,000 cp 25 °C 100,000 cp implementation being.

In addition, said ceramics composition and preparation number composition does not contain tackifying number thereof can. General adhesive number composition including more adhesive for improving the adhesion-imparting number used, adhesion-imparting number including the reduced heat resistance with respect to the softening point number exists in the flow tides. To the W-CDMA, the present invention according to weight average molecular weight of about 5,000,000 to about 15,000,000 (meta) adhesive number composition in C8 to C14 alkyl (meta) acrylic ester photocurable resin of high molecular weight acrylate monomer by, adhesion-imparting number which has excellent adhesive number maintained without tack can be [...] a number.

Said ceramics composition and preparation number composition further comprises optical disclosure number and cured number can be.

Disclosure number publicly known material can be used without a number to said light a light disclosure number can be, among other things heat disclosure number can be used if a material having a light absorbing for manufacturing semiconductor device. For example, benzo-phosphorus-based disclosure number is said optical absorber polymerization disclosure number, hydroxy ketone-based disclosure number, aminoketone-based disclosure number, and combinations thereof including at least one selected from the group consisting disclosure number [lak the total burning caprolactam using optical disclosure number can be.

Photosetting resin 100 parts by weight of said optical disclosure number, 0. 1 to 1 parts by weight can be. Said coolant out or polymerized as a decrease in rate is bigger disclosed.

Said number is cured polybutadiene (ethylene glycol) methacrylate, hexane the die the d arc relay [thu which comes, the methyl the propane tree arc relay [thu which comes and combinations thereof selected from the group consisting be a tree. In particular, tetra (ethylene glycol) methacrylate is used crosslinking point relatively [nelm to increased adhesion formed between a crosslinked effectiveness disclosed.

The photocurable resin 100 parts by weight of said curing said number, 0. 1 to 5 parts by weight can be.

In addition, other publicly known addition number to form a focused even adhesive number composition without the use number may be added disclosed. For example, added as said number, filler, surfactant number, coupling number, antistatic number, dye, pigment, UV blocking number, antioxidant number, working and combination thereof can be selected from the group consisting further comprises including at about the number added.

Adhesive number

The present invention refers to the aforementioned ceramics composition and preparation number composition is an adhesive formed a number number [...] substrate.

In particular, said composition to UV curing bath 1308. 500mJ 1000mJ quantity number. 500mJ discharge adhesive force and peel force cannot be ensured when cured quantity less than, greater than quantity 1000mJ yellowing upon curing coatings has poor appearance or moves an disclosed.

Such a number as said adhesive is photocurable resin and (meta) acrylic ester C having high molecular weight₈ To C₁₄ Alkyl (meta) acrylic ester monomer using number since the bath having excellent heat resistance disclosed.

Hereinafter, preferred embodiment of the present invention to aid in understanding a number etched. In the embodiment of the present invention is more easily understand to however only for being ball number, in the embodiment of the present invention content is restricted to by are not correct.

In the embodiment

The following composition was number number adhesion of high pressure liquid coolant composition.

In the embodiment 1

(Ethylhexyl (meth) acrylate) 75 parts by weight of monomer 2 a-EHA, 20 parts by weight of acrylic acid (methacrylated (meta) acrylate) monomer IBOA 4 parts by weight of 1 - hydroxy photopolymerization disclosure number as crosslinking monomer as current events claw [heyk thread phenyl ketone (Igacure 184, BASF [...] number tank) 0. 005 parts by weight of a 1 liter glass reactor 30 minutes with respect to the substituted nitrogen nitrogen gas into the gas solution nit. Black fluorescent lamp (meta) acrylic ester photocurable resin irradiated using UV light-up. (Meta) acrylic ester photocurable resin weight average molecular weight of polymer were measured.

(Meta) acrylic ester photocurable resin synthesized said photocurable resin 100 parts by weight of said, octyl acrylate monomer 10 parts by weight of isocyanate, a, a - 0 - a hydroxy methoxy (Igacure 651) at the time of oh three toe lung rice field. 005 parts by weight, tetra (ethylene glycol) methacrylate 0. 5 parts by weight, coupling number (KBM403) 0. 2 parts by weight of added by mixing ceramics composition and preparation number number and number and other high pressure liquid coolant composition, a high pressure liquid coolant toward the same UV irradiation was about 720mJ quantity number number.

In the embodiment 2

(Ethylhexyl (meth) acrylate) 80 parts by weight of monomer 2 a-EHA, 20 parts by weight of acrylic acid (methacrylated (meta) acrylate) monomer IBOA 5 parts by weight of (meth) acrylic ester polymers as crosslinking monomer number the same method in the embodiment 1 and a photocurable resin number point number adhesion of a high pressure liquid coolant bath [...] his number.

In the embodiment 3

(Ethylhexyl (meth) acrylate) 75 parts by weight of monomer 2 a-EHA, 20 parts by weight of acrylic acid (methacrylated (meta) acrylate) monomer IBOA 5 parts by weight of (meth) acrylic ester polymers as crosslinking monomer number the same method in the embodiment 1 and a photocurable resin number point number adhesion of a high pressure liquid coolant bath [...] his number.

In the embodiment 4

(Ethylhexyl (meth) acrylate) monomer 77 parts by weight of 2 a-EHA, (methacrylated (meta) acrylate) monomer 18 parts by weight of crosslinking monomer as IBOA 6 parts by weight of acrylic acid polymers in the embodiment 1 and the number a (meta) acrylic ester photocurable resin bath method adhesion of a number equal to the number [...] point number was high pressure liquid coolant.

Comparison example 1

(Ethylhexyl (meth) acrylate) monomer 77 parts by weight of 2 a-EHA, 20 parts by weight of acrylic acid (methacrylated (meta) acrylate) monomer IBOA 3 parts by weight of (meth) acrylic ester polymers as crosslinking monomer number the same method in the embodiment 1 and a photocurable resin number point number adhesion of a high pressure liquid coolant bath [...] his number.

Comparison example 2

(Ethylhexyl (meth) acrylate) monomer 77 parts by weight of 2 a-EHA, 20 parts by weight of acrylic acid (methacrylated (meta) acrylate) monomer IBOA 3 parts by weight of (meth) acrylic ester polymers as crosslinking monomer number photocurable resin and high pressure liquid coolant, said photocurable resin octyl acrylate monomer is added the isocyanate in the embodiment 1 and the same method adhesion of a number number number the fact [...] his high pressure liquid coolant.

Comparison example 3

Said photocurable resin octyl acrylate monomer is added the isocyanate in the embodiment 1 and the same method adhesion of a number number number the fact [...] his high pressure liquid coolant.

Evaluation

In the embodiment 50 a releasing film (PET) adhesive prepared by the number according to exemplary and comparison number with respect to the drying by applying a micro m thickness. Then, a steel plate is cut into a 1 inch X 1 inch X longitudinal horizontal line disconnecting, 1 kg of rubber roller into an been adhered to. An adhesive film tagged type 0 1 kg weight. 6 °C/min 250 °C oven temperature (SAFT; Shear A Failer Temperature) separated by raised up into 250 °C withstand temperatures and time were measured.

As shown in the table 1, the present invention according to 12 hours even number 250 °C can withstand both adhesive is characterized in that it has, the higher the photocurable resin added having excellent heat resistance can be that of a weight-average molecular weight.

To the W-CDMA, comparison example 1 and 2 is 100 parts by weight of the total amount of the monomers 2 a-EHA monomer and IBOA, acrylic acid 3. 5 parts by weight to less than including, crosslinking monomer content of lower weight average molecular weight of 5,000,000 photocurable resin of less than seen, to lower heat resistance has been confirmed.

In particular, comparison example octyl acrylate monomer is added to 2 isocyanate groups is not difference, heat resistance and adhesion as compared to comparison example 2 input device number from other.

In addition, molecular weight of 5,000,000 abnormality octyl acrylate monomer isocyanate do not require the addition of a high heat resistance compared to the another comparison example 3 compared relative to the present invention according to embodiment adhesive number has been confirmed that the cells be prevented from falling.

In case that the description of the invention which is for example, of the present invention technical idea of the present invention is provided to a person with skill in the art or essential characteristics without changing other form may be understand easily outputted are disclosed. In the embodiment described above the exemplary non-limiting all sides are understood to which must substrate.