CLAMPING DEVICE FOR SOLDERING OPERATIONS

This application claims priority to Chinese Patent Application No. 201510857353.8 filed on Nov. 30, 2015, the contents of which are incorporated by reference herein.

The subject matter herein generally relates to clamping devices, and particularly, to a self-weighted clamping device capable of holding an electronic part for a soldering operation.

A clamping device may be employed to press a SIM card onto a circuit board to fix the SIM card in place for soldering it into the circuit board using Surface Mount Technology (SMT).

It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the exemplary embodiments described herein. However, it will be understood by those of ordinary skill in the art that the exemplary embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features. The description is not to be considered as limiting the scope of the exemplary embodiments described herein.

The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like.

Exemplary embodiments of the present disclosure will be described in relation to the accompanying drawings.

FIG. 1 illustrates an exemplary embodiment of a clamping device 1. The clamping device 1 can press a solderable part (not shown) of a circuit board (not shown) onto the circuit board. The clamping device 1 includes a base plate 10, and at least one press block 20. The at least one press block 20 is slidably arranged on the base plate 10, such that the at least one press block 20 can be moved up or down relative to the base plate 10. The at least one press block 20 can exert pressure on the solderable part of the circuit board by its own weight when the at least one press block 20 moves down relative to the base plate 10. In at least one exemplary embodiment, the solderable part is a SIM card.

FIG. 2 also illustrates the clamping device 1 of FIG. 1. The at least one press block 20 includes a first cylinder block portion 202 and a second cylinder block portion 204. The first cylinder block portion 202 and the second cylinder block portion 204 are coaxial to each other. The radius of the first cylinder block portion 202 is greater than the radius of the second cylinder block portion 204. The height of the first cylinder block portion 202 is less than the height of the second cylinder block portion 204. In at least one exemplary embodiment, the at least one press block 20 is an integrally formed cylindrical block made of copper.

The base plate 10 defines at least one first through hole 101. Each of the at least one first through holes 101 corresponds to one press block 20. The radius of the first through hole 101 is greater than the radius of the second cylinder block portion 204, but less than the radius of the first cylinder block portion 202. The clamping device 1 also includes at least one snap spring 30. Each press block 20 has an associated snap spring 30. An end of the second cylinder block portion 204 of the press block 20 that is away from the first cylinder block portion 202 passes through the bottom side of the first through hole 101 and then the snap spring 30 clips around the periphery of the second cylinder block portion 204, in an annular groove 206 (discussed in more detail below). Accordingly, the snap spring 30 and the first cylinder block portion 202 are on different sides of the base plate 10. When the second cylinder block portion 204 passes through the first through hole 101, the second cylinder block portion 204 is restricted both by the first cylinder block portion 202 and the snap spring 30.

In this exemplary embodiment, the snap spring 30 includes an annular body 302 and two ends 304 connected to the annular body 302. The internal diameter of the annular body 302 is slightly less than the diameter of the second cylinder block portion 204. The external diameter of the annular body 302 is greater than the diameter of the first through hole 101. The annular groove 206 is defined in the second cylinder block portion 204. The internal diameter created by the annular groove 206 matches with that of the snap spring 30 for receiving and retaining the annular body 302 of the snap spring 30. Accordingly, the part of the second cylinder block portion 204 between the first cylinder block portion 202 and the snap spring 30 can freely pass through the first through hole 101 by the self-weighted of the press block 20. In this exemplary embodiment, the distance between the snap spring 30 and the first through hole 101 is greater than a thickness of the part of the base plate 10. The weight of the press block 20 can be between about 9 grams and 9.5 grams. In this exemplary embodiment, the numbers of the press blocks 20, the first through holes 101, and the snap springs 30 are all four.

In this exemplary embodiment, the base plate 10 also defines a number of second through holes 40, some of which may have different sizes from each other. The second through holes 40 are defined around the first through holes 101. When using Surface Mount Technology to solder the circuit board, the press block 20 of the clamping device 1 can be used to press the solderable part of the circuit board. The soldering heat, which when required, can be transferred to the solderable part by the second through holes 40 around the first through holes 101.

FIG. 3 illustrates another view of clamping device 1 of FIG. 1. In this exemplary embodiment, the base plate 10 also defines a number of support elements 50. Each support element 50 is arranged substantially adjacent to a corner of the base plate 10. The support elements 50 can support the clamping device 1. The thickness of the support element 50 is less than the distance between the first cylinder block portion 202 and the annular groove 206.

The use of the clamping device 1 is as follows: first, the second cylinder block portion 204 of the press block 20 is pushed to pass up through the bottom of the first through hole 101. Then the annular body 302 of the snap spring 30 is fitted to the annular groove 206 of the second cylinder block portion 204. When the first cylinder block portion 202 of the press block 20 is placed on the a solderable portion of the solderable part by a user, the first cylinder block portion 202 is able to press the solderable part to the circuit board by its own weight.

The exemplary embodiments shown and described above are only examples. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the present disclosure is illustrative only, and changes may be made in the detail, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including, the full extent established by the broad general meaning of the terms used in the claims.