МОБИЛЬНЫЙ ТЕРМИНАЛ И ЕГО СПОСОБ УПРАВЛЕНИЯ, ЗАПОМИНАЮЩИЙ НОСИТЕЛЬ ИНФОРМАЦИИ

Изобретение относится к электротехнике. Мобильный терминал включает: корпус, компонент управления, и пьезоэлектрический компонент возбуждения, расположенный внутри корпуса, создающий пьезоэлектрический эффект. Пьезоэлектрический компонент возбуждения включает: первый источник возбуждения и второй источник возбуждения, окружающий первый источник возбуждения. Компонент управления выполнен с возможностью управления первым источником возбуждения, чтобы генерировать первую вынуждающую силу вибрации, и управления вторым источником возбуждения, чтобы генерировать вторую вынуждающую силу вибрации, когда мобильный терминал находится в режиме телефонной трубки так, что в позиции, где располагается второй источник возбуждения, первая волна вибрации, генерируемая первой вынуждающей силой вибрации, и вторая волна вибрации, генерируемая второй вынуждающей силой вибрации, имеют противоположные направления вибрации, и амплитуда вибрации второй волны вибрации меньше или равна той, что у первой волны вибрации ...

СПОСОБ И УСТРОЙСТВО СОЗДАНИЯ ВЫСОКОИНТЕНСИВНЫХ ФОКУСИРОВАННЫХ УЛЬТРАЗВУКОВЫХ ПОЛЕЙ ДЛЯ НЕИНВАЗИВНОГО ЛОКАЛЬНОГО РАЗРУШЕНИЯ БИОЛОГИЧЕСКИХ ТКАНЕЙ

Группа изобретений относится к медицинской технике, а именно к средствам для ультразвуковой хирургии. Устройство создания высокоинтенсивных фокусированных ультразвуковых полей для неинвазивного локального разрушения биологической ткани представляет собой фазированную решетку со случайным расположением излучающих элементов в виде многоугольников, площади которых отличаются до 1% при наличии или отсутствии технологических промежутков между элементами, каждая из сторон элементов внутри решетки является смежной с одной из сторон соседних элементов. Способ изготовления устройства включает получение шаблона фазированной решетки со случайным расположением излучающих элементов посредством формирования ее компьютерной модели с последующим изготовлением устройства по полученному шаблону, при этом для получения шаблона осуществляют выбор формы поверхности и формы границы решетки, а также количества ее излучающих элементов, нанесение на полученную поверхность согласно равномерному закону распределения ...

СИММЕТРИЧНЫЕ И ПРЕДПОЧТИТЕЛЬНО ОТКЛОНЯЕМЫЕ СЛУЧАЙНЫЕ РЕШЕТКИ ДЛЯ УЛЬТРАЗВУКОВОЙ ТЕРАПИИ

... 1. Фазированная ультразвуковая решетка для устройства генерации ультразвука, причем решетка содержит совокупность ультразвуковых элементов, в которой ультразвуковые элементы решетки располагаются симметрично относительно точки или разделительной линии в решетке в отношении размеров, форм элементов и положений элементов, причем, по меньшей мере, один элемент из совокупности элементов имеет размер и/или форму, который(ая) отличается от остальных из совокупности элементов и/или, по меньшей мере, одно расстояние между элементами отличается от остальных расстояний. ! 2. Фазированная ультразвуковая решетка по п.1, в которой размеры и/или формы ультразвуковых элементов выбраны случайно. ! 3. Фазированная ультразвуковая решетка по п.1, в которой положения ультразвуковых элементов выбраны случайно. ! 4. Фазированная ультразвуковая решетка по п.1, в которой совокупность дистанций между положениями центров масс соседних ультразвуковых элементов является апериодической. ! 5. Устройство для генерации ...

УЛЬТРАЗВУКОВОЙ ПРЕОБРАЗОВАТЕЛЬ С ГЕРМЕТИЗИРОВАННЫМ 3D-ПЕЧАТНЫМ МАССИВОМ МИНИАТЮРНЫХ РУПОРОВ

Medizinischer Apparat zur Behandlung mit Ultraschall.

ULTRASCHALLWELLENSENSOR

Piezoelectric transducer device for ultrasound apparatus for ultrasound medical diagnosis or materials testing

The device has a number of piezoelectric transducers (1) arranged next to one another along an azimuth axis (2). A pair of electrically insulating carrier rails (4) extend parallel to the azimuth axis and are positioned adjacent one another along a perpendicular elevation axis (3). A contact rail (5) with electric leads (6) for the transducers is positioned between the carrier rails. Each transducer is attached to the carrier rails and a respective electric lead via a conductive adhesive layer. A set of piezoelectric transducer devices are combined to form a transducer array.

PROCESS FOR THE MANUFACTURE OF AN ULTRASONIC TRANSDUCER DEVICE

Linear ultrasonic array

A linear ultrasonic array which contains ultrasonic transducers arranged in a row next to one another. According to the invention, ultrasonic transmitting and receiving transducers (2 and, respectively 4), which in each case contain a lambda /4-thick stack of thin piezoelectric plastic foils (6) are in each case alternately arranged next to one another and the ultrasonic transmitting transducers (2) can be connected electrically in parallel during the transmitting and the ultrasonic receiving transducers (4) can be connected electrically in series during the receiving. This design provides a very sensitive linear ultrasonic array of simple construction. ...

Phase-controlled ultrasonic array-type transducer

A method for producing a phase-controlled ultrasonic array-type transducer is described. A plate of piezoelectric material is soldered to the lateral edges of a pair of double-sided circuit boards, on both sides of which conductor tracks are provided. Then filling material for attaching the piezoelectric element and circuit boards is poured in. To construct the elements of the transducer, separating notches are sawn in with the aid of a saw. This method facilitates and simplifies production of phase-controlled ultrasonic array-type transducers.

ULTRASCHALLVIBRATOR

PIEZOELEKTRISCHE KOMPOSITMATERIALIEN UND HERSTELLUNGSVERFAHREN DAFÜR

ULTRASCHALLWANDLER-ANORDNUNG

Ultrasonic transducer mfr. method - arranging row of transducer elements in magazine with metal edge connectors held in place by lid

The arrangement comprises a row of a parallel electrical array of transducer elements each having on its small side a metallisation layer. A magazine (2) contains a pile of transducer elements (6) and is connected to a reservoir (4). The inner surface of the magazine and the lid (12) are formed to the shape of the transducers. Each side of the transducer element is overlaid with a metal leaf at the edge (8,10) which extends over to the magazine region on each side of the element. The metal elements and the transducers are held in place by the lid member.

AKUSTISCHER ABSORBER AUS VERBUNDWERKSTOFF FÜR EINE ULTRASCHALLWANDLERANORDNUNG

Akustische Absorber (18) werden für Ultraschallwandler (10) ausgebildet. Der akustische Absorber (18) bietet die gewünschten Dämpfungs-, Impedanz- und Wärmeleitfähigkeitseigenschaften basierend auf einem Füllstoff aus Gummi-, Keramik- und Metallpartikeln (19). Die relativen Mengen der unterschiedlichen Füllstoffe können zur Abstimmung der akustischen Dämpfung, der Wärmeleitfähigkeit und/oder der akustischen Impedanz angepasst werden.

WANDLEREINRICHTUNG FUER EIN ULTRASCHALLIMPULSECHOGERAET

Ultrasound transmit pulser system for echocardiography application, has one transistor connected with transducer element and an amplifier input, and another transistor connected with transducer element and power source

The system includes a transistor connected with the transducer element (24) and an amplifier input, and another transistor connected with the transducer element and power source. The transistors are connected with same electrode of the transducer element. An Independent claim is also included for method for using ultrasound transmit pulser system.

Improvements in or relating to ceramic transducers for underwater transmission and reception of sound

... 726,330. Piezo-electric instruments. BENDIX AVIATION CORPORATION. Feb. 6, 1953 [Feb. 18, 1952], No. 3458/53. Addition to 718,260. Class 40 (4). In an electro-mechanical transducer for translating compressional waves in a fluid into electrical waves, comprising an annular, radially-vibratile piezoelectric element 24 as in the parent Specification, the backing member 36 has a planar front face spaced from the front face or window 34 of the casing, and sound-absorbing material is interposed between the outer circumference surface of the element and the cylindrical wall of the case. The casing comprises a cylindrical section 30 and a rear closure member 31 secured to make a fluidtight joint by screws 33. The sound or supersonic vibration-transmitting window 34 is set in a counterbore 35 and the ceramic elements 24 are positioned in holes 38a in a rubber of Corprene disc. The case is filled with oil through filler opening 45. Specifications 583,639 and 601,477, [both in Group V], are referred ...

An interface between two media

Piezoelectric sound transducer

The sound transducer comprises at least one piezoelectric element 10 connected to a carrying element 12. The carrying element 12 has a sound-active surface 13 that may be raised and differently-shaped (fig 2). The carrying element 12 has at least one fixing element 20 so that the carrying element 12 can be arranged at a distance above or spaced from a fixing plane 30. The piezoelectric element 10 may be attached to various parts of the carrying element 12 (figs 3, 4 & 5) and the transducer may be used as part of an array of similar transducers (fig 6). A transducer of this form is said to be more suitable for use in an external environment, e.g. on a vehicle.

Method, downhole tool and transducer for echo inspection of a well bore

A method, downhole tool (20) and transducer (30) for echo inspection of a well bore (2) equipped with a casing and/or liner (12) extending inside the well bore (2) using sound signals. A sound signal (24) is emitted into the fluid (18) within the casing or liner (12) and to the wall (14) of the casing or liner (12), an echo signal including superimposed reflections (38, 40, 36) of the emitted sound signal from the wall (14) of the casing or liner (12) any from portions of the well bore(2) outside the casing or liner (12) is received, and the echo signal is analysed and it is discriminated between signal reflections (38, 40) from the wall (14) of the casing or liner (12) and signal reflections (36) from said portions of the well bore (2) outside the casing or liner (12).

Acoustic Transducer And Underwater Sounding Apparatus

Acoustic transducer and method of manufacturing

A first metal layer 23 is deposited on a first side of a piezoelectric composite 22 to form a common electrode, a second metal layer 25 is provided over the opposite side and a thicker third metal layer 26 may be provided over the second metal layer 25. Portions of the second metal layer are removed to create a plurality of individual electrodes (fig 4B). The individual electrodes extend 24 beyond the piezoelectric composite 22 in the elevation direction to create an improved attachment contact point for electrode leads. The metal layers may be provided by lithography, a wireframe or a foil sheet. Several array shapes are discussed (figs 6, 7, 10). The transducer array is intended for downhole use (figs 10, 11).

Haptic pedal

A haptic pedal 10 for a vehicle (4, Figure 1) comprises a plurality of piezoelectric actuators (22, Figure 4) operable for providing haptic feedback to a driver through a footrest 18, Figure 5 and sensing means 26, for example an electrically conductive pressure sensitive material such as a quantum tunnelling composite, for mapping the area of footrest 18 in contact with a driver's foot 24 so that haptic feedback is delivered by selective activation of actuators in the mapped area; a haptic feedback system is disclosed in which haptic feedback is delivered dependent on a sensed state of the vehicle. Also disclosed is a navigation aid delivering haptic feedback through a pedal 10, with the actuators selectively activated to deliver feedback according to navigation information, preferably with the actuators also activating in a way dependent on the area of footrest 18 in contact with foot 24.

Ultrasonic transducer array

Apparatus for the ultrasonic examination of an object, comprises: a transducer array comprising a plurality of adjacent transducer elements for directing pulses of ultrasonic energy along a beam into the object, characterized in that the width of each of the transducer elements in the direction transverse to the longitudinal direction of the element is non-uniform along the length of the element.

Improvements in and relating to piezo electrical transducers

... 805,470. Piezo-electric loud-speakers. GENERAL ELECTRIC CO. June 28, 1955 [June 28, 1954], No. 18701/55. Class 40 (4). [Also in Group XL (c)] A loud-speaker comprises a number of barium titanate elements formed as discs or spherical caps 17 with electrodes 18,19. The elements may drive a common diaphragm. Each element is polarized so that it vibrates in a spherical mode, i.e. the radius of the sphere changes cyclically. To achieve this, the element is polarized parallel to the thickness dimension and to the electric field and the intensity of polarization is different, and may be of opposite sign, near the two electrodes. A method of polarizing an element in this manner is described in Specification 681,671, [Group XL (b)]. Alternatively the polarization may be radial in a plane perpendicular to the field exerted by the electrodes. In one arrangement, Fig. 2, elements are supported by shoulders 16 on holes in a rigid framework 12. In another arrangement, Fig. 4, elements 31 are mounted ...

PIEZOELECTRIC COMPOUND ELEMENT AND ITS MANUFACTURING PROCESSES

ELECTROACOUSTIC TRANSDUCER

DEVICE FOR THE ULTRASONIC INVESTIGATION OF AN OBJECT

ULTRASONIC HEAD FOR INVESTIGATIONS OF AN OBJECT OF MEANS ULTRASONIC

PROCEDURE FOR PLATING A PIEZOELECTRIC COMPOUND MATERIAL

Universal ultrasound device and related apparatus and methods

An ultrasound device is described configurable to operate in a variety of modes. At least some of the modes are associated with different frequencies of ultrasound signals. A system is also described, comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

Ultrasound transducer and system

Some embodiments of the invention relate to an applicator for applying ultrasound energy to a tissue volume, comprising: an array comprising a plurality of ultrasound transducers, the transducers arranged side by side, the transducers configured to emit unfocused ultrasound energy suitable to thermally damage at least a portion of the tissue volume, each of the transducers comprising a coating thin enough so as not to substantially affect heat transfer via the coating to the tissue; and a cooling module configured to apply cooling via the transducers to prevent overheating of a surface of the tissue volume being contacted by the transducers.

Particles for use in acoustic standing wave processes

Microparticles and nanoparticles made of various materials that are used in various configurations are disclosed. Such particles can also contain various types of materials as payloads to be used in the separation, segregation, differentiation, modification or filtration of a system or a host anatomy. The microparticles and nanoparticles are utilized in conjunction with an acoustic standing wave or an acoustic traveling wave in various processes.

Ultrasound transducers with reduced sidelobes and method for manufacture thereof

Ultrasonic imaging devices and methods of fabrication

Ultrasonic transducer for parametric array

ULTRASONIC ELECTROACOUSTIC TRANSDUCER

Arrays made from flexible transducer elements

ULTRASONIC PROBE

PIEZOELECTRIC APODIZED ULTRASOUND TRANSDUCERS

METHOD FOR MAKING AN ACOUSTIC TRANSDUCER

The invention concerns a method for making a low frequency piezoelectric composite material block consisting of rows of superimposed ceramic contacts immersed in a dielectric material. Said method consists mainly in producing a composite material block from two identical superimposed half-blocks, made by cutting into a single pre-machined piezoelectric ceramic block. The invention is characterized in that the ceramic material block thus formed is then machined so as to form a structure including rows of aligned contacts, each contact consisting of two strictly opposite elementary contacts. The thus produced ceramic structure is then integrated in an appropriate dielectric matrix. The thus produced block is designed to be used to manufacture acoustic transducers, from composite materials. The invention is of particular interest in the field of sonar detectors for detecting objects located at a relatively short distance from the detector.

IMPEDANCE MATCHING TRANSDUCERS

The present invention provides exemplary transducer elements, transducer packages and methods of making same. One exemplary transducer element (10) has first and second transducer surfaces (14, 20) and a plurality of tapered pillars (16) that comprise piezoelectric material and extend between the first and second transducer surfaces. At least one of the pillars (16) has a first cross-sectional area at the first tranducer surface (14) that is larger than a second cross-sectional area at the second transducer surface (20). Hence, the transducer has a lower acoustic impedance at the second surface than at the first surface.

ULTRASONIC TRANSDUCER ARRAY

An apparatus for the ultrasonic examination of an object, comprises a transducer array comprising a plurality of adjacent transducer elements for directing pulses of ultrasonic energy along a beam into the object, characterised in that the width of each of the transducer elements in the direction transverse to the longitudinal direction of the element varies along the length of the element.

METHOD FOR MANUFACTURING AN ULTRASONIC TRANSDUCER

A method for manufacturing an ultrasonic transducer arrangement having groups of jointly controlled transducer elements. One flat side of a stripshaped piezoelectric body is undetachably connected to a metal coated side of a plastic contact foil. The other side of the plastic contact foil is fastened to a damping body. The piezoelectric body is finely divided to produce individual transducer elements having relatively narrow width. Portions of the plastic contact foil which extend beyond the piezoelectric body are connected as contact tabs to control lines. A plurality of individual transducer elements in the piezoelectric body are electrically coupled to one another to form transducer oscillator groups.

PIEZOELECTRIC APODIZED ULTRASOUND TRANSDUCERS

... "Apodized ultrasound transducer". An ultrasound transducer for medical pulse echo applications is apodized by causing the level of response to vary as a function of position on the transducer aperture. In a preferred embodiment the response varies as a Gaussian function of distance from the center or center line of the transducer so that the response at the edge of the transducer is approximately 30% of the response at the center or center line. The response may be varied by causing the polarization of a piezoelectric ceramic transducer to decrease as a function of distance from the acoustic axis. This is achieved in that the transducer comprises a matrix of parallel rods (80) of piezoelectric ceramic in an inert binder (82), The polarization, the composition, the cross-section or the spacing of the rods may vary as a function of distance (X) from the center (C) of the transducer.

PROBE FOR ELECTRONIC SCANNING TYPE ULTRASONIC DIAGNOSTIC APPARATUS

PIEZOELECTRIC COMPOSITES AND METHODS FOR MANUFACTURING SAME

A method is described for making a composite, such as a piezoelectric composite, having a predetermined volume ratio. Initially, a pair of base slabs are diced to form slot having uniform pitch spacing such that a material portion of one diced base slab may be received within the slots of another diced base slab. The diced base slabs are interdigitated and joined to form a first piezoelectric composite that can subsequently be diced to form slots having a uniform pitch spacing that are spaced from the first slots. Two diced first piezoelectric composites are interdigitated and joined to form a second piezoelectric composite of reduced volume ratio and finer pitch.

METHOD OF MANUFACTURING AN APODIZED ULTRASOUND TRANSDUCER

IMPROVED TECHNIQUE AND PHASED ARRAY TRANSDUCER FOR ULTRASONIC INSPECTION OF COARSE GRAINED, ANISOTROPIC WELDS

A transducer for generating acoustic waves comprising an array of transmitter elements, receiver elements, at least one wedge for the array of transmitter elements and the array of receiver elements. Also provided are transducers wherein the pitch of the transmitter array varies along the length of the transmitter array.

PHASED ARRAY TRANSDUCER CONSTRUCTION

UNIVERSAL ULTRASOUND DEVICE AND RELATED APPARATUS AND METHODS

An ultrasound device is described configurable to operate in a variety of modes. At least some of the modes are associated with different frequencies of ultrasound signals. A system is also described, comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

FLEXIBLE ULTRASOUND ARRAY

The present invention provides a flexible ultrasound transducer (1) for an ultrasound monitoring system for examining a curved object. The ultrasound transducer (1) comprises an integrated circuit structure (7) and a multi-layered structure (2), said multi-layered structure (2) comprising an array (3) of ultrasound transducing elements (3a) arranged in a first layer structure (4) and configured for generating ultrasonic energy propagating along a main transducer axis Z and an array (5) of control circuits (5a) arranged in a second layer structure (6), and wherein the array (5) of control circuits and the integrated circuit structure (7) are configured for operating the array (3) of ultrasound transducing elements in said first layer structure (4), Further, the multi-layered structure (2) comprises at least one flexible layer (8, 9) arranged so that the bending flexibility of the multi-layered structure (2) permits the ultrasound transducer (1) to form a continuous contact with said curved ...

ULTRASONIC TRANSDUCER ASSEMBLY

TRANSMIT RECEIVE TRANSDUCER ARRAY AND ULTRASONIC IMAGING SYSTEM

PIEZOELECTRIC COMPOSITES AND METHODS FOR MANUFACTURING SAME

... ²²²A method is described for making a composite, such as a piezoelectric ²composite, having a predetermined volume ratio. Initially, a pair of base ²slabs are diced to form slot having uniform pitch spacing such that a material ²portion of one diced base slab may be received within the slots of another ²diced base slab. The diced base slabs are interdigitated and joined to form a ²first piezoelectric composite that can subsequently be diced to form slots ²having a uniform pitch spacing that are spaced from the first slots. Two diced ²first piezoelectric composites are interdigitated and joined to form a second ²piezoelectric composite of reduced volume ratio and finer pitch.² ...

ACOUSTOPHORETIC CLARIFICATION OF PARTICLE-LADEN NON-FLOWING FLUIDS

Acoustophoretic devices for separating particles from a non-flowing host fluid are disclosed. The devices include a substantially acoustically transparent container and a separation unit, with the container being placed within the separation unit. An ultrasonic transducer in the separation unit creates a planar or multi-dimensional acoustic standing wave within the container, trapping particles disposed within the non-flowing fluid and causing them to coalesce or agglomerate, then separate due to buoyancy or gravity forces.

ULTRASOUND TRANSDUCER AND METHOD FOR MAKING THE SAME

The present application provides a multilayer lateral mode coupling method for phased array construction and transducer devices built accordingly. This disclosure describes and demonstrates that the electrical impedance of a phased array can be substantially reduced and readily controlled to be close to the source impedance. The fabrication process is relatively simple and inexpensive. In addition, the elements are robust for use in 1.5, 2, 3 or other dimensional configurations, over an extended period of operation, without structural failure, and providing a high power output required for imaging and/or medical therapy applications.

TRANSDUCERS

A method of making an ultrasound transducer includes providing a piezoelectric crystal of PIN-PMN-PT (lead indium niobate-lead magnesium niobate-lead titanate) and etching kerfs into the piezoelectric crystal using a laser. In at least some embodiments, each kerf has a width of no more than 4 µm. The kerfs are filled with a non-piezoelectric material to form an array of piezoelectric elements.

INTRAVASCULAR ULTRASOUND CATHETER FOR MINIMIZING IMAGE DISTORTION

The present disclosure provides various embodiments of an ultrasound catheter for use in intravascular ultrasound (IVUS) imaging. An exemplary IVUS device includes an flexible elongate member having a lumen extending therethrough, and a rotatable imaging core disposed within the lumen. The imaging core is further configured to transmit and receive ultrasound signals through a distal portion of the flexible elongate member. The distal portion of the flexible elongate member includes a first set of material layers, while the proximal portion includes a second set of material layers different than the first set of material layers. The first set of material layers and the second material layers minimize distortion of the ultrasound signals. The first set of material layers further facilitates an average speed of sound through the first set of material layers that is substantially equivalent to a speed of sound through blood.

APPARATUS AND METHODS FOR CLEANING DELICATE PARTS

Clamped ultrasonic transducers are driven at harmonic resonant frequencies i n a range of 100 kHz - 350 kHz to impart microsonic frequencies to process liquid. The application of microsonic frequencies to liquid preferably occurs simultaneously with a sweeping of the microsonic frequency within the transducer's (122) harmonic bandwidth to reduce or eliminate (a) standing waves within the liquid, (b) other resonances, (c) high energy cavitation implosion, and (d) non-uniform sound fields, each of which is undesirable for cleaning and/or processing of semiconductor wafers and other delicate parts. The invention c an also drive ultrasonic transducers (122) such that the frequency of applied energy has a sweep rate within the ultrasonic bandwidth of the transducers; and that sweep rate is also varied so that the sweep rate is substantially non-constant during operation. An ultrasound generator of the invention sometimes utilizes amplitude modulation (AM), and the AM frequency is swept over ...

Transducteur électromécanique destiné à être mis en contact avec un corps pour lui transmettre ou en recevoir des ondes élastiques.

Einrichtung zur Ultraschallbehandlung.

Biegungsschwinger aus elektrostriktivem Material

Sende- und Empfangsvorrichtung für Ultraschall

Aktives Messglied mit mehreren elektroakustischen Wandlern für medizinische Ultraschalluntersuchungen

Ultraschallwandleranordnung für die Patientenüberwachung

Phased Array Ultrasonic Transducers With Solderless Stack Bonding Assembly

Multi-sensor ultrasound probe and related methods

Piezoelectric Element, Method Of Forming Piezoelectric Element, And Ultrasonic Device

Multi-frequency ultra wide bandwidth transducer

Piezoelectric micromachined ultrasonic transducer (pMUT) arrays and techniques for frequency shaping in pMUT arrays are described, for example to achieve both high frequency and low frequency operation in a same device. The ability to operate at both high and low frequencies may be tuned during use of the device to adaptively adjust for optimal resolution at a particular penetration depth of interest. Various sizes of piezoelectric membranes are fabricated for tuning resonance frequency across the membranes. Signal processing of the drive and/or response signals generated and/or received from each of the two or more electrode rails may achieve a variety of operative modes, such as a near field mode, a far field mode, or ultra wide bandwidth mode.

The ultrasonic converter device, probe, ultrasonic detector and electronic equipment

PROBE IMAGING ULTRASONIC DEVICE AND OF THE JAW 3D

La présente invention concerne une sonde ultrasonore (1) d'imagerie dentaire, comprenant typiquement plusieurs transducteurs (4) agencés pour fonctionner en émission et en réception, et notamment agencés pour émettre des ondes ultrasonores de fréquence d'au moins 10 MHz, et éventuellement plusieurs transducteurs (4) agencés pour fonctionner en émission et en réception et agencés pour émettre des ondes ultrasonores de fréquence inférieure à 4 MHz. Les transducteurs sont montés sur un support souple (3), solidaire d'une armature rigide (2) typiquement en forme de « U ». L'invention concerne aussi un dispositif comprenant une telle sonde.

INSPECTING PROCESS AND DEVICE OF WELDING OF CONNECTION OF CONTROL PER ULTRASOUND SCAN

AUDIO SOUND PRESSURE SENSOR WITH HIGH SPATIAL RESOLUTION.

SONDE ULTRASONIQUE DE TYPE-DIVISE

L'INVENTION CONCERNE UNE SONDE ULTRASONIQUE DU TYPE-DIVISE POUR UN TRANSDUCTEUR ULTRASONIQUE. LA SONDE COMPREND UN SUBSTRAT 1 SUR LEQUEL SONT DISPOSES SUCCESSIVEMENT PLUSIEURS ELECTRODES ARRIERE 12A PARALLELES ET EN FORME DE BANDE, UN FILM PIEZOELECTRIQUE POLYMERE 2B ET UNE ELECTRODE AVANT 2C; UNE EXTREMITE 12AA DE CHAQUE ELECTRODE ARRIERE EN FORME DE BANDE 12A EST REALISEE MINCE, ELLE EST PLIEE LE LONG DE LA PAROI LATERALE 1B DU SUBSTRAT 1 ET ELLE EST RELIEE A UN FIL CONDUCTEUR 15 PARTANT DU TRANSDUCTEUR ULTRASONIQUE ET PASSANT PAR UN TROU 14 MENAGE DANS LE SUBSTRAT 1; UNE TELLE STRUCTURE PERMET UN GROUPAGE SERRE DES ELECTRODES ARRIERE TOUT EN EVITANT UN CONTACT ENTRE ELLES, EN CONFERANT AINSI UNE HAUTE RESOLUTION A LA SONDE ULTRASONIQUE.

ULTRASONIC TRANSDUCER ASSEMBLIES

MANUFACTORING PROCESS Of an ACOUSTIC PROBE MULTIELEMENTS USING a FILMPOLYMERE METALLIZES AND WEARS DOWN LIKE PLAN OF MASS

ULTRASONIC DEVICE OF TRANSDUCTION HAS NETWORK Of PIEZOELECTRIC ELEMENTS TRANSDUCERS

Ultra-sonic transducer - for use at high temperature eg in a sodium-cooled nuclear reactor

METHOD FOR ESTIMATING THE DIAMETER OF A WELD

L'invention concerne un procédé d'estimation d'un diamètre (D) d'une zone de soudure (9) présentant un centre (C), ledit procédé comprenant : - une étape de positionnement (100) d'un capteur ultrasonore en regard de ladite liaison, ledit capteur présentant au moins une barrette (1) positionnée à une distance (H1) dudit centre (C) ; - une étape d'identification (200) d'une première intersection (la) entre ladite barrette (1) et ladite zone de soudure (9) et d'une deuxième intersection (Ib) entre ladite barrette (1) et ladite zone de soudure (9) respectivement ; - une étape de calcul (300) d'une première valeur (D1) calculée dudit diamètre (D).

DEVICE TO INCREASE THE SENSITIVITY OF ULTRASONIC TRANSDUCERS

Empilage acoustique (150) destiné à servir dans un transducteur ultrasonore à fréquence centrale, comprenant une couche de matériau piézoélectrique polarisé (154) et au moins une couche d'adaptation d'impédance (164, 168). La couche de matériau piézoélectrique polarisé (154) à des faces supérieure et inférieure (166, 170) et est constituée d'un matériau piézoélectrique polarisé ayant une première impédance acoustique. La couche de matériau piézoélectrique polarisé (154) a une première épaisseur (190) et l'empilage acoustique (150) a une impédance électrique de sortie dépendant de la première épaisseur (190). Les couches d'adaptation d'impédance (164, 168) sont conçues pour se fixer aux faces supérieure et inférieure (166, 170) de la couche de matériau piézoélectrique polarisé (154) et ont une deuxième ou une troisième épaisseur (192) ou (194). Les couches d'adaptation d'impédance (164, 168) sont constituées d'un ou de plusieurs matériaux qui ont une impédance acoustique sensiblement similaire ...

SIDE LOOKING SONAR TRANSDUCER

PROCESS AND DEVICE TO MINIATURIZE A CABLE OF TRANSDUCER HAVE ULTRASOUNDS

Transducteur à ultrasons (106), comprenant une matrice (200) d'éléments formant des rangées et des colonnes et des fils (252) à l'intérieur d'un câble (120) de transducteur, conçue pour connecter au moins une partie des éléments (104) à un système d'échographie (100). La matrice (200) comprend une rangée centrale (206) et au moins une première et une deuxième rangées extérieures (208), (210) disposées de part et d'autre de la rangée centrale (206). Un premier ensemble de lignes (218) connecte électriquement à l'un des fils (252) les éléments (104) présents dans une première partie (212) de la rangée centrale (206). La première partie (212) comporte un nombre d'éléments inférieur au nombre total d'éléments (104) de la rangée centrale (206). Un deuxième ensemble de lignes (250) connecte électriquement au moins une partie des éléments (104) des première et deuxième rangées extérieures (208), (210) qui sont dans une même colonne et connecte électriquement les éléments (104) d'une deuxième partie ...

ULTRASONIC TRANSDUCER ASSEMBLIES

Improvements with the feelers transmitter-receivers for surveys by ultrasonic echoes

Device of excitation of transverse acoustic waves of inflection in a metal blade

ULTRASONIC TRANSDUCER ASSEMBLY

ARRANGEMENT OF TRANSDUCERS ACOUSTIC AND PROCEEDED Of INSPECTION Of MACHINE ELEMENTS

Ultrasound Probe and Manufacturing Method thereof

ULTRASONIC TRANSDUCER ELEMENT CHIP AND PROBE, AND ELECTRONIC DEVICE AND ULTRASOUND DIAGNOSTIC EQUIPMENT

... 개구가 어레이 형상으로 배치된 기판과, 상기 기판의 제1 면에 있어서 개개의 상기 개구에 설치되는 초음파 트랜스듀서 소자와, 상기 기판의 상기 제1 면과는 반대측의 상기 기판의 제2 면에 고정되어 상기 기판을 보강하는 보강 부재를 구비하고, 상기 보강 부재는, 상기 기판의 상기 제2 면에 고정되는 면에 있어서, 그 면의 면 내의 제1 방향으로, 상기 기판의 상기 제2 면에 있어서의 상기 개구의 상기 제1 방향의 개구 폭보다도 작은 간격으로 배열되어 배치되고, 상기 개구의 내부 공간 및 상기 기판의 외부 공간을 서로 연통하는 직선 형상 홈부를 갖는 것을 특징으로 하는 초음파 트랜스듀서 소자 칩.

ULTRASONIC PROBE

복수의 공진 주파수에서 햅틱 피드백을 제공하는 방법 및 시스템

... 복수의 공진 주파수에서 햅틱 피드백을 제공하는 방법 및 시스템이 개시된다. 예를 들면, 일 개시되는 장치는 기저부 및 복수의 돌출부를 구비하는 공진기를 포함하되, 복수의 돌출부 중 제1 돌출부는 제1 공진 주파수를 갖고 복수의 돌출부 중 제2 돌출부는 제2 공진 주파수를 가지며, 상기 장치는 공진기에 연결되고 제1 공진 주파수 및 제2 공진 주파수에서 햅틱 피드백 효과를 출력하도록 동작할 수 있는 압전 액추에이터를 더 포함한다.

Method and Apparatus for Manufacturing Ultrasound Probe

Ultrasound Probe and Manufacturing Method thereof

PIEZOELECTRIC TRANSDUCERS USING MICRO-DOME ARRAYS

High frequency ultrasound probe

A high frequency ultrasound probe includes a substrate having a number of transducer elements on it and a ground plane that is electrically coupled by one or more vias to a conductive frame that supports the substrate. The conductive frame is electrically coupled to a ground plane of a printed circuit having conductors that are coupled to the transducer elements.

High frequency ultrasound transducer

A high frequency ultrasound array having a number of transducer elements that are formed in sheet of piezoelectric material. A frame having a coefficient of thermal expansion that is similar to that of the piezoelectric material surrounds the piezoelectric material and is separated from the piezoelectric material by a filling material. Kerf cuts that define the individual elements in the sheet of piezoelectric material extend across a full width of the sheet. In some embodiments, sub-dice kerf cuts that divide a single transducer element into two or more sub-elements also extend all the way across the width of the sheet. A lens positioned in front of the transducer elements can have a radius machined therein to focus ultrasound signals.

MULTIDIMENSIONAL ARRAY AND FABRICATION THEREOF

According to various aspects of the invention, a transducer is manufactured by providing a substrate assembly, making major element cuts in the substrate assembly in a first direction, making minor element cuts in the substrate assembly in a second direction, positioning a plurality of signal lines (such as a flex circuit) on the substrate assembly such that the plurality of signal lines is aligned with said minor element cuts, and making major element cuts in the substrate assembly in the second direction after said plurality of signal lines is positioned. Various aspects of the invention also include a multi-dimensional transducer having a plurality of elements, wherein the transducer includes a conductor; a piezo-electric assembly assembled with said conductor and having a first plurality of cuts in a first direction; and a matching layer assembly having a second plurality of aperture cuts in the first direction, wherein the matching layer is coupled to the conductor opposite the piezo-electric ...

PIEZOELECTRIC COMPOSITES AND METHODS FOR MANUFACTURING SAME

A method is described for making a composite, such as a piezoelectric composite, having a predetermined volume ratio. Initially, a pair of base slabs are diced to form slot having uniform pitch spacing such that a material portion of one diced base slab may be received within the slots of another diced base slab. The diced base slabs are interdigitated and joined to form a first piezoelectric composite that can subsequently be diced to form slots having a uniform pitch spacing that are spaced from the first slots. Two diced first piezoelectric composites are interdigitated and joined to form a second piezoelectric composite of reduced volume ratio and finer pitch.

Ultrasonic probe and ultrasonic diagnostic device

An ultrasonic probe includes at least one transmission element layer for transmitting ultrasonic waves, at least one reception element layer for receiving ultrasonic waves and which is provided with an electrode on each of both surfaces opposed in a direction of a thickness thereof, and at least one matching layer for matching acoustic impedance. These layers are arranged in this order in a direction of transmitting the ultrasonic waves. The reception element layer is provided with a projecting portion projecting in a direction of elevation from upper and lower layers which sandwich the two electrodes respectively formed on both surfaces of the reception element layer, and at least one of the electrodes is formed by extending to the projecting portion.

Concave Ultrasound Transducers and 3D Arrays

A Multiple Aperture Ultrasound Imaging (MAUI) probe or transducer is uniquely capable of simultaneous imaging of a region of interest from separate apertures of ultrasound arrays. Some embodiments provide systems and methods for designing, building and using ultrasound probes having continuous arrays of ultrasound transducers which may have a substantially continuous concave curved shape in two or three dimensions (i.e. concave relative to an object to be imaged). Other embodiments herein provide systems and methods for designing, building and using ultrasound imaging probes having other unique configurations, such as adjustable probes and probes with variable configurations.

METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS

The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein. 1. An ultrasonic transducer assembly comprising:a transducer array comprising a number of spaced transducer elements;at least one printed circuit including a plurality of trace layers, each layer having a plurality of conductive traces therein that are electrically coupled to a corresponding transducer element, wherein the conductive traces in any single trace layer at a point where the traces are coupled to the transducer elements are spaced farther apart than a distance between adjacent transducer elements in the transducer array; anda plurality of interconnections, each interconnection electrically coupling a conductive trace of the printed circuit to a corresponding transducer element.2. The ultrasonic transducer assembly of claim 1 , wherein the interconnections have a width that is narrower than a width of the transducer elements to which they are connected.3. The ultrasonic transducer assembly of claim 1 , wherein the transducer array has a length and a width that is shorter than the length claim 1 , and wherein the printed circuit has traces therein that extend along the printed circuit in a direction that is generally parallel to the length of the transducer array.4. The ...

Ultrasonic probe and manufacturing method thereof

An ultrasonic probe including a matching layer providing conductivity via an electrode formed on a surface contacting a piezoelectric material, and a manufacturing method thereof. The method of manufacturing an ultrasonic probe includes forming kerfs on a surface of the matching layer, forming an electrode on the surface of the matching layer at which the kerfs are formed, or on an opposite surface thereof, and mounting the surface provided with the electrode on the piezoelectric material.

Backing element of ultrasonic probe, backing layer of ultrasonic probe, and manufacturing method thereof

A backing element of a ultrasonic probe, a backing layer of a ultrasonic probe, and a manufacturing method thereof, the backing layer formed by arranging a plurality of members each having a shape of a polygonal column in a one-dimensional manner or in a two-dimensional manner while each of the plurality of members is provided with a conductive trace formed at one side surface thereof, thereby electrically connecting an ultrasonic transducer array, which is being acoustically connected to the backing layer, in a further simple and definite manner.

Ultrasonic transducer element chip, probe head, probe, electronic instrument, and ultrasonic diagnostic device

An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements, a wiring part and an additional wiring part. The substrate defines a plurality of openings arranged in an array pattern. Each of the ultrasonic transducer elements is provided in each of the openings. The wiring part is connected to the ultrasonic transducer elements. The additional wiring part is disposed in a peripheral region between an outline of the array pattern of the openings and an outer edge of the substrate in a plan view as viewed along a thickness direction of the substrate. The additional wiring part is electrically insulated from the wiring part. The additional wiring part is longer than a shortest distance between the outline of the array pattern and the outer edge of the substrate in the plan view.

HEAD UNIT, ULTRASONIC PROBE, ELECTRONIC INSTRUMENT, AND DIAGNOSTIC DEVICE

A head unit for an ultrasonic probe includes a connecting section, an element chip and a supporting member. The connecting section is configured to electrically connect the head unit to a probe main body of the ultrasonic probe. The element chip is configured to be electrically connected to the probe main body through the connecting section. The element chip includes a substrate and an ultrasonic element array. The substrate defines a plurality of openings arranged in an array pattern. The ultrasonic element array includes a plurality of ultrasonic transducer elements, with each of the ultrasonic transducer elements being provided in each of the openings of the substrate. The supporting member supports the element chip. 1. A head unit for an ultrasonic probe comprising:a connecting section configured to electrically connect the head unit to a probe main body of the ultrasonic probe; a substrate defining a plurality of openings arranged in an array pattern, and', 'an ultrasonic element array including a plurality of ultrasonic transducer elements, with each of the ultrasonic transducer elements being provided in each of the openings of the substrate; and, 'an element chip configured to be electrically connected to the probe main body through the connecting section, the element chip including'}a supporting member supporting the element chip.2. The head unit according to claim 1 , whereinthe connecting section has a plurality of connecting terminals configured to be connected to the probe main body, andthe connecting terminals are disposed on a first surface side of the supporting member and the element chip are supported on a second surface side of the supporting member with the second surface side being a reverse side of the first surface side.3. The head unit according to claim 2 , wherein at least one connector having the connecting terminals, and', 'at least one flexible printed circuit board including a wiring part for connecting the connector and the element ...

Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device

An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements, a reinforcing member and a ventilation passage. The substrate defines a plurality of openings arranged in an array pattern. The ultrasonic transducer elements are respectively disposed at the openings on a first surface of the substrate. The reinforcing member is fixed on a second surface of the substrate opposite to the first surface of the substrate to reinforce the substrate. Through the ventilation passage, internal spaces of the openings and an external space of the substrate are in communication with each other.

Ultra wide bandwidth transducer with dual electrode

Wide bandwidth piezoelectric micromachined ultrasonic transducers (pMUTs), pMUT arrays and systems having wide bandwidth pMUT arrays are described herein. For example, a piezoelectric micromachined ultrasonic transducer (pMUT) includes a piezoelectric membrane disposed on a substrate. A reference electrode is coupled to the membrane. First and second drive/sense electrodes are coupled to the membrane to drive or sense a first and second mode of vibration in the membrane.

MULTI-FREQUENCY ULTRA WIDE BANDWIDTH TRANSDUCER

Piezoelectric micromachined ultrasonic transducer (pMUT) arrays and techniques for frequency shaping in pMUT arrays are described, for example to achieve both high frequency and low frequency operation in a same device. The ability to operate at both high and low frequencies may be tuned during use of the device to adaptively adjust for optimal resolution at a particular penetration depth of interest. In embodiments, various sizes of piezoelectric membranes are fabricated for tuning resonance frequency across the membranes. The variously sized piezoelectric membranes are lumped together by two or more separate electrode rails, enabling independent addressing between the two or more subgroups of sized transducer elements. Signal processing of the drive and/or response signals generated and/or received from each of the two or more electrode rails may achieve a variety of operative modes for the device, such as a near field mode, a far field mode, and an ultra wide bandwidth mode. 1. A piezoelectric micromachined ultrasonic transducer (pMUT) array , comprising:a plurality of piezoelectric transducer element populations disposed over a substrate, each element population including at least first and second transducer elements having piezoelectric membranes of differing size, and each transducer element having a drive/sense electrode coupled to a piezoelectric membrane;a plurality of sets of electrode rails disposed over the substrate, each set of electrode rails coupled to only one of the transducer element populations, wherein a first electrode rail of the set is electrically coupled to the drive/sense electrode of the first transducer element and a second electrode rail of the set is electrically coupled to the drive/sense electrode of the second transducer element.2. The pMUT array of claim 1 , wherein each element population includes a plurality of first transducer elements with a piezoelectric membrane of a first size and includes a plurality of second transducer ...

ULTRASONIC TRANSDUCER, MANUFACTURING METHOD THEREOF, AND ULTRASONIC PROBE

The purpose is to provide an ultrasonic transducer and ultrasonic probe without the complexity of the manufacturing process of a non-conductive acoustic matching layer while ensuring the conductive path. In the non-conductive acoustic matching layer comprising the first surface of the electrode side and the second surface of the opposite side of the piezoelectrics, a plurality of first grooves leading up to the mid-way point between the first surface and the second surface are arranged on each of the first surfaces of the non-conductive acoustic matching later in response to the arrangement of sound elements. Moreover, each of the second surfaces is provided with the plurality of second grooves leading up to at least the mid-way point from the second surface, intersecting the first grooves. 1. An ultrasonic transducer , comprising:a plurality of piezoelectrics which are two-dimensionally arranged,electrodes provided on each of the plurality of piezoelectrics,non-conductive acoustic matching layers with a first surface on the electrode side and a second surface on the opposite side of the first surface, and which are two-dimensionally arranged according to the piezoelectrics, andsubstrates arranged on the second surface side,first grooves provided on each of the first surfaces, the first grooves having depth leading up to the mid-way point between the first surface and the second surface,second grooves provided on each of the second surfaces, the second grooves having depth leading up to at least the mid-way point and intersecting the first grooves, wherein,the electrode and the second surface are conducted via the first grooves, the intersections of the first grooves and the second grooves, and the second grooves.2. The ultrasonic transducer according to claim 1 , further comprising conductive acoustic matching layer which is a two-dimensionally arranged between the non-conductive acoustic matching layer and the substrate according to the piezoelectrics.3. The ...

HANDHELD ULTRASOUND IMAGER

Described are ultrasound transducer modules and handheld ultrasound imagers including thermal and acoustic management features to produce high quality ultrasound images in a portable, handheld form factor. 1. An ultrasound transducer for a handheld ultrasound imager device comprising a transducer element comprising an array of piezoelectric Micromachined Ultrasound Transducers (pMUTs) , wherein the transducer element is integrated onto an application-specific integrated circuit (ASIC) forming a transducer tile , and wherein a cavity is formed under the transducer element to provide acoustic isolation of the transducer element from the ASIC.2. The ultrasound transducer of claim 1 , wherein the array comprises a plurality of transducer pixels.3. The ultrasound transducer of claim 1 , wherein the array comprises 4096 or more transducer pixels.4. (canceled)5. (canceled)6. The ultrasound transducer of claim 1 , wherein the cavity houses a gas claim 1 , a vapor claim 1 , a liquid claim 1 , or a vacuum.7. The ultrasound transducer of claim 1 , wherein the integration between the transducer element and the ASIC is implemented by flip chip/direct bonding of transducer chip-to-ASIC Wafer (C2 W) claim 1 , transducer chip-to-ASIC chip (C2C) claim 1 , or transducer wafer to ASIC wafer (W2 W).8. The ultrasound transducer of claim 1 , wherein the ASIC is integrated into a module comprising connectors enabling connection to external signal processing electronics through wirebonds to dedicated pads on the ASIC or through silicon vias (TSV) directly to a high density printed circuit board (PCB).9. The ultrasound transducer of claim 1 , wherein the transducer tile is mounted on a transducer substrate.10. The ultrasound transducer of claim 9 , wherein the transducer tile is mounted on the transducer substrate through a high acoustic attenuation and high thermal conductivity acoustic absorber.11. The ultrasound transducer of claim 9 , wherein the transducer tile is mounted on the ...

UNIVERSAL ULTRASOUND DEVICE AND RELATED APPARATUS AND METHODS

A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode. 1. An ultrasound sensor , comprisinga substrate,a plurality of circular or square ultrasonic transducers on the substrate;a membrane configured to vibrate in response to a changing voltage differential applied to the ultrasonic transducers, the membrane having a thickness of less than or equal to 5 microns and at least partially bounding at least one of the plurality of ultrasonic transducers.2. The ultrasound sensor of claim 1 , further comprising control circuitry on the substrate configured to apply a peak-to-peak AC voltage in a range of 16-41 V to the plurality of ultrasonic transducers.3. The ultrasound sensor of claim 1 , wherein the plurality of ultrasonic transducers are configured to operate in a frequency range of 1-15 MHz.4. The ultrasound sensor of claim 1 , wherein the plurality of ultrasonic transducers form an array.5. The ultrasound sensor of claim 4 , wherein the array has a pitch of about 52 microns.6. The ultrasound sensor of claim 1 , wherein at least one of the plurality of ultrasonic transducers is configured to operate in a collapsed mode and at least one of the plurality of ultrasonic transducers is configured to operate in a non-collapsed mode.7. The ultrasound sensor of claim 1 , wherein:the plurality of ultrasonic transducers are configured to detect ultrasound signals having frequencies in a first frequency range, at a first depth relative to a subject;the plurality of ultrasonic transducers are configured to detect ultrasound signals having frequencies in a second frequency range, at a second depth relative to the ...

METHOD AND MEASURING DEVICE FOR DETERMINING A FLUID QUANTITY

A method determines a fluid quantity relating to a fluid flowing in a measuring device. The measuring device has a measuring tube which receives the fluid, and first and second oscillation transducers. An excitation of a total wave, which is conducted through a wall of the measuring tube, by the first and/or second oscillation transducer, by wave components which are conducted in the wall being excited by the oscillation transducers in a plurality of excitation regions. These wave components are superposed to form the total wave. A distance between the centers of the excitation regions and the excitation frequency are selected such that an oscillation mode to be attenuated is quenched by destructive interference of the wave components in a propagation direction. Excitation of a compression oscillation of the fluid by the total wave occurs. Measurement data relating to the compression oscillation is used to determine the fluid quantity. 1. A method for determining a fluid quantity relating to a fluid and/or a fluid flow of the fluid with a measuring device , the measuring device having a measuring tube for receiving the fluid and/or through which the fluid flows , and a first and a second oscillation transducer being disposed at a distance from one another on the measuring tube , which comprises the steps of:carrying out an excitation of a respective total wave, being conducted through a wall of the measuring tube, by the first and/or the second oscillation transducer, by wave components which are respectively conducted in the wall being excited by the first and/or the second oscillation transducer in a plurality of mutually separated excitation regions, the wave components being superposed to form the respective total wave;selecting a distance between centers of the excitation regions and an excitation frequency such that an oscillation mode to be attenuated is at least partially quenched by destructive interference of the wave components at least in one propagation ...

ULTRASONIC DIAGNOSTIC DEVICE

In the present invention, a wave transmission/reception unit is provided in the distal end of a probe. The wave transmission/reception unit includes a 2D-array oscillator, an electronic circuit, and a relay substrate for electrically joining the 2D-array oscillator and the electronic circuit. The face of the wave transmission/reception unit on a subject side thereof is a wave transmission/reception face. A temperature detection unit is provided to the relay substrate. In the present invention, a surface temperature estimation unit estimates the temperature of the surface of the wave transmission/reception face on the basis of the detected temperature from the temperature detection unit and the power consumption by the wave transmission/reception unit. Specifically, by separately taking into account the power consumption of the electronic circuit and the power consumption of the 2D-array oscillator, the temperature difference from a temperature detection location to the surface of the wave transmission/reception face is estimated, and the surface temperature is estimated from the detected temperature and the temperature difference. 1. An ultrasonic diagnostic device comprising: a wave transceiver unit including an oscillator that transmits and receives ultrasonic waves, a wave transmission/reception surface disposed on a living subject side of the oscillator, a substrate, and an electronic circuit electrically connected to the oscillator disposed on the substrate, and', 'a temperature sensing unit disposed in the wave transceiver unit; and, 'an ultrasonic probe comprising'}a temperature estimation unit that estimates a surface temperature of the wave transmission/reception surface based on a wave transmission/reception condition of the ultrasonic waves and, a sensed value sensed by the temperature sensing unit.2. The ultrasonic diagnostic device according to claim 1 , wherein a temperature difference estimation unit that estimates a difference between the temperature ...

ULTRASONIC SENSOR

An ultrasonic sensor including a case having a bottom portion, and a piezoelectric element that is bonded to an inner surface of the bottom portion and performs bending vibration together with the bottom portion. The piezoelectric element includes a piezoelectric layer having a transmission region and a reception region, a common electrode, a transmission electrode opposing the common electrode with the transmission region interposed therebetween, and a reception electrode opposing the common electrode with the reception region interposed therebetween. The transmission region and the reception region are formed at positions adjacent to each other. 1. An ultrasonic sensor comprising:a case having a bottom portion; and a piezoelectric layer having a transmission region and a reception region;', 'a common electrode having at least one portion facing or disposed within both the transmission region and reception region of the piezoelectric layer;', 'a transmission electrode opposed to the common electrode with the transmission region interposed therebetween; and', 'a reception electrode opposed to the common electrode with the reception region interposed therebetween, wherein an impedance between the transmission electrode and the common electrode is lower than an impedance between the reception electrode and the common electrode., 'a piezoelectric element bonded to an inner surface of the bottom portion, the piezoelectric element including2. The ultrasonic sensor according to claim 1 , wherein the reception electrode comprises at least one disk and the transmission electrode comprises a plurality of intermediate portions disposed in the transmission region of the piezoelectric layer claim 1 , wherein the number of intermediate portions is greater than the number of the at least one disk.3. The ultrasonic sensor according to claim 1 , wherein the transmission region and the reception region are arranged at positions adjacent to each other in a direction perpendicular to ...

Method for Producing Mems Transducer, Mems Transducer, Ultrasound Probe, and Ultrasound Diagnostic Apparatus

Substrate is produced by using a MEMS technique to form multiple diaphragms in a substrate by forming piezoelectric material layer on one surface of the substrate and thereafter by forming openings in the substrate from the other surface of the substrate; substrate and substrate on which signal detection circuit is formed are aligned to each other using at least one of multiple diaphragms as alignment diaphragm; and substrate and substrate are bonded together. 1. A method for producing a MEMS transducer , the method comprising:producing a MEMS substrate by using a MEMS technique to form a plurality of diaphragms in a substrate, the plurality of diaphragms being formed by forming a piezoelectric material layer on one surface of the substrate and thereafter by forming openings in the substrate from the other surface of the substrate;performing alignment between the MEMS substrate and an electronic circuit substrate by using at least one of the plurality of diaphragms as an alignment diaphragm; andbonding together the MEMS substrate and the electronic circuit substrate.2. The method for producing the MEMS transducer according to claim 1 , wherein the MEMS transducer is a piezoelectric micromachined ultrasonic transducer (pMUT).3. The method for producing the MEMS transducer according to claim 1 , wherein a signal detection circuit is formed on the electronic circuit substrate claim 1 , the signal detection circuit detecting a transmission signal or a reception signal for transmission or reception of an ultrasonic wave at the plurality of diaphragms.4. The method for producing the MEMS transducer according to claim 1 , whereinthe plurality of diaphragms include first diaphragms constituting a channel used for the transmission or reception of the ultrasonic wave and second diaphragms not used for the transmission or reception of the ultrasonic wave, andthe alignment diaphragm is at least one of the second diaphragms.5. The method for producing the MEMS transducer ...

CONTROL DEVICE AND CONTROL METHOD FOR REDUCING AND HOMOGENIZING WELDING RESIDUAL STRESS BY ACOUSTIC WAVE

A control device for reducing and homogenizing welding residual stress by acoustic waves, comprising: a fixing tool having two rows of through holes; a plurality of ultrasonic transducers each having a body and a conical horn transmitting portion at a lower end of the body, wherein lower ends of the horn transmitting portions are fixedly connected with flanges, the horn transmitting portions of the ultrasonic transducers extend into respective through holes of the fixing tool to be in contact with welded parts below the fixing tool, the flanges are fixed to the fixing tool by bolts, and the two rows of through holes are arranged both sides of a welding seam of the welded parts; and a driving device for driving the ultrasonic transducers to operate. A corresponding control method is also provided. The control device can be used to control residual stress at the welding seam of steels. 1. A control device for reducing and homogenizing welding residual stress by acoustic wave , which controls welding residual stress generated in welded parts during welding , the control device comprising:a fixing tool having two rows of through holes;a plurality of ultrasonic transducers each having a body and a conical horn transmitting portion at a lower end of the body, wherein lower ends of the horn transmitting portions are fixedly connected with flanges; anda driving device for driving the ultrasonic transducers to operate,wherein the horn transmitting portions of the ultrasonic transducers extend respectively into the respective through holes of the fixing tool to be in contact with the welded parts below the fixing tool, the flanges are fixed to the fixing tool by bolts, and the two rows of through holes are arranged both sides of a welding seam of the welded parts.2. The control device according to claim 1 , wherein the driving device comprises:a residual stress controller including an industrial computer, an analog-digital signal card and a multi-channel controller, which are ...

Piezoelectric transducers

A piezoelectric transducer comprises a piezoelectric element operable to transduce mechanical movement of the piezoelectric element to an electrical signal and to transduce an electrical signal in the piezoelectric element to a mechanical movement thereof, wherein the piezoelectric transducer is operable to transduce above a temperature of 200° C.

ULTRASOUND PROBE, METHOD OF MANUFACTURING ULTRASOUND PROBE, AND ULTRASOUND DIAGNOSTIC APPARATUS

An ultrasound probe includes: a piezoelectric material in which piezoelectric elements to transmit and receive ultrasound are one-dimensionally arrayed; and at least one acoustic matching layer arranged on a subject side of the piezoelectric material, wherein the piezoelectric material includes a plurality of first grooves, and at least a second groove formed between the plurality of first grooves, the piezoelectric material is divided by at least either the first grooves or the second groove, and either each of the first grooves or the second groove is a void, or the first grooves and the second groove are respectively filled with fillers having different hardness. 1. An ultrasound probe comprising:a piezoelectric material in which piezoelectric elements to transmit and receive ultrasound are one-dimensionally arrayed; andat least one acoustic matching layer arranged on a subject side of the piezoelectric material,wherein the piezoelectric material includes a plurality of first grooves, and at least a second groove formed between the plurality of first grooves,the piezoelectric material is divided by at least either the first grooves or the second groove, andeither each of the first grooves or the second groove is a void, or the first grooves and the second groove are respectively filled with fillers having different hardness.2. The ultrasound probe according to claim 1 , wherein the acoustic matching layer includes a division layer divided by at least either the first grooves or the second groove.3. The ultrasound probe according to claim 2 , wherein the division layer is a layer divided by only either the first grooves or the second groove.4. The ultrasound probe according to claim 2 , wherein the division layer is an uppermost layer of the acoustic matching layer.5. The ultrasound probe according to claim 1 , wherein the piezoelectric material is divided by only either the first grooves or the second groove.6. The ultrasound probe according to claim 1 , further ...

Sonar transducer array assembly and methods of manufacture thereof

A sonar transducer array assembly comprises a first flexible circuit, a second flexible circuit, and a plurality of transducer elements. The first and second flexible circuits each include a first side, a second side, and a plurality of adhesive areas spaced apart and positioned in a line along one edge of the first side. The transducer elements each include a first surface attached to one of the adhesive areas of the first flexible circuit, an opposing second surface attached to one of the adhesive areas of the second flexible circuit, and a third surface positioned between the first and second surfaces. The transducer elements form a linear array with the third surface of each transducer element in alignment and configured to transmit and receive an acoustic pressure wave.

ULTRASONIC TRANSDUCER AND FABRICATING THE SAME

An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion and electrically connected to the convex portion, a resin provided between the oscillator and the printed wiring board, the resin covering at least the convex portion and a portion of the printed wiring board. 1. (canceled)2. An ultrasonic transducer , comprising:a plurality of oscillators, each of the oscillator having a convex portion;a printed wiring board provided to be opposed to the convex portion and electrically connected to the convex portion;a resin provided between the oscillator and the printed wiring board, the resin covering at least the convex portion and a portion of the printed wiring board.3. The ultrasonic transducer of claim 2 , whereinthe oscillator includes a transducer element including an acoustic matching layer, a piezoelectric element and a backing member in order as a stacked body, a first electrode on the packing member and a second electrode on the acoustic matching layer, and the convex portion includes the first electrode and the backing member.4. The ultrasonic transducer of claim 2 , whereinthe oscillator includes the transducer element including the acoustic matching layer, the piezoelectric element and the backing member in order as the stacked body, the first electrode on the backing member and the second electrode on the acoustic matching layer, and the convex portion is provided on the first electrode.5. The ultrasonic transducer of claim 2 , further comprising:an adhesive material contacted to cover at least a portion of the convex portion, the adhesive material connecting the oscillator and the printed wiring board,wherein the resin is provided to cover at least a portion of the adhesive material.6. A method of fabricating the ultrasonic transducer according to claim 2 , comprising:providing the plurality ...

Method and system to prevent depoling of ultrasound transducer

An ultrasound system, probe and method are provided. The ultrasound system includes a transducer with piezoelectric transducer elements polarized in a poling direction. A bipolar transmit circuit is configured to generate a transmit signal having first and second polarity segments. The first and second polarity segments have corresponding first and second peak amplitudes. A bias generator is configured to generate a bias signal in a direction of the poling direction. The bias signal is combined with the transmit signal to form a biased transmit signal that is shifted in the direction of the poling direction and still includes both of positive and negative voltages over a transmit cycle.

ENERGY BASED FAT REDUCTION

Systems and methods for non-invasive fat reduction can include targeting a region of interest below a surface of skin, which contains fat and delivering ultrasound energy to the region of interest. The ultrasound energy generates a thermal lesion with said ultrasound energy on a fat cell. The lesion can create an opening in the surface of the fat cell, which allows the draining of a fluid out of the fat cell and through the opening. In addition, by applying ultrasound energy to fat cells to increase the temperature to between 43 degrees and 49 degrees, cell apoptosis can be realized, thereby resulting in reduction of fat. 1targeting a region of interest below a surface of skin, said region of interest containing a fat lobuli;delivering ultrasound energy to said region of interest;generating a conformal lesion with said ultrasound energy, said conformal lesion on a surface of said fat lobuli;creating an opening in said surface of said fat lobuli; andreleasing a fluid out of said fat lobuli and through said opening in reducing an appearance of the cellulite on said surface of skin.. A method of non-invasive treatment of cellulite, the method comprising: This application is a continuation of U.S. application Ser. No. 17/127,691 filed Dec. 18, 2020, which is a continuation of U.S. application Ser. No. 16/794,701 filed Feb. 19, 2020, now U.S. Pat. No. 10,888,716, which is a continuation of U.S. application Ser. No. 16/272,427 filed Feb. 11, 2019, now U.S. Pat. No. 10,603,519, which is a continuation of U.S. application Ser. No. 15/996,249 filed Jun. 1, 2018, now U.S. Pat. No. 10,238,894, which is a continuation of U.S. application Ser. No. 15/829,175 filed Dec. 1, 2017, now U.S. Pat. No. 10,010,721 which is a continuation of U.S. application Ser. No. 15/650,525 filed Jul. 14, 2017, now U.S. Pat. No. 9,833,639, which is a continuation of U.S. application Ser. No. 15/380,267 filed Dec. 15, 2016, now U.S. Pat. No. 9,713,731, which is a continuation of U.S. application Ser. ...

INTERPOSER, ULTRASOUND PROBE USING THE SAME, AND METHOD OF MANUFACTURING INTERPOSER

An interposer includes: a circuit board stack in which circuit boards are stacked; and an outer board arranged on at least one of outer side surfaces of the circuit board stack. The circuit boards are arranged include first conductive lines having first ends exposed through a first side portion of the circuit boards and second ends exposed through a second side portion opposite the first side portion of the circuit boards. The outer board includes second conductive lines having first ends exposed through a different side from the first side portion of the circuit boards and second ends exposed through a side portion located on a same side as the second side portion of the circuit boards. 1. An interposer comprising:a circuit board stack in which a plurality of circuit boards are stacked, the plurality of circuit boards being arranged next to one another to form a first side portion of the circuit board stack and comprise first conductive lines, each of the first conductive lines having a first end exposed through the first side portion of the circuit board stack and a second end exposed through a second side portion of the circuit board stack, the second side portion being opposite the first side portion; andan outer board arranged on at least one of outer side surfaces of the circuit board stack, to form joined planes with a plane of the first side portion and a plane of the second side portion, respectively, the outer side surfaces of the circuit board stack extending between the first side portion and the second side portion, a first end exposed through a first side of the outer board that is different from the plane joined with the plane of the first side portion of the circuit board stack, and', 'a second end exposed through a second side of the outer board that is located on a same side as the plane joined with the second side portion of the circuit board stack., 'wherein the outer board comprises second conductive lines, each of the second conductive lines ...

Multilayer acoustic impedance converter for ultrasonic transducers and method of forming the same

An impedance conversion layer useful for medical imaging ultrasonic transducers comprises a low impedance polymer layer and a high impedance metal layer. These layers are combined with corresponding thicknesses adapted to provide a function of converting from a specific high impedance to specific low impedance, wherein the polymer layer is at the high impedance side and the metal layer is at the low impedance side. The effective acoustic impedance of the polymer and metal layer combination may be adapted to configure an impedance converter in the same way as a quarter wavelength impedance converter, converting from low impedance to high impedance (metal to polymer) or from a high impedance to low impedance (polymer to metal). This structure may be used for front matching with the propagation medium and back matching with an absorber for ultrasonic transducers.

Bonding interposer and integrated circuit chip, and ultrasound probe using the same

The method of bonding an interposer and an integrated circuit chip includes preparing an interposer including an insulator and conductive lines each having one end exposed to a first surface of the insulator and another end exposed to a second surface opposite to the first surface; placing a bonding mask on the interposer; forming through-holes on the bonding mask before or after the placing of the bonding mask on the interposer; filling the plurality with a conductive material; and bonding an integrated circuit chip to the bonding mask.

ULTRASONIC PROBE AND SUBJECT INFORMATION ACQUISITION APPARATUS

An ultrasonic probe includes an oscillator including a pair of electrodes, wherein the ultrasonic probe is configured to transmit and receive an ultrasonic wave by an oscillation of the oscillator, and wherein a wiring for transmitting a transmission signal for transmitting the ultrasonic wave by the oscillator is connected to one of the pair of electrodes, and a preamplifier configured to amplify a reception signal acquired from the reception of the ultrasonic wave by the oscillator is connected to the other of the pair of electrodes. 1. An ultrasonic probe comprising:an oscillator including a pair of electrodes,wherein the ultrasonic probe is configured to transmit and receive an ultrasonic wave by an oscillation of the oscillator, andwherein a wiring for transmitting a transmission signal for transmitting the ultrasonic wave by the oscillator is connected to one of the pair of electrodes, and a preamplifier configured to amplify a reception signal obtained from the reception of the ultrasonic wave by the oscillator is connected to the other of the pair of electrodes.2. The ultrasonic probe according to claim 1 , wherein the wiring for transmitting the transmission signal and a wiring for transmitting the reception signal form a common wiring in which a wiring is partially shared between the transmission signal and the reception signal claim 1 , and a switch configured to switch a state capable of transmitting the transmission signal and a state capable of transmitting the reception signal is provided in this common wiring.3. The ultrasonic probe according to claim 1 , further comprising a piezoelectric element between the pair of electrodes claim 1 ,wherein the ultrasonic probe is configured to transmit and receive the ultrasonic wave using a piezoelectric effect of the piezoelectric element.4. The ultrasonic probe according to claim 1 , further comprising a space between the pair of electrodes claim 1 ,wherein the ultrasonic probe is configured to transmit and ...

ULTRASONIC DEVICE, PIEZOELECTRIC DEVICE, ULTRASONIC MEASUREMENT APPARATUS, AND ELECTRONIC INSTRUMENT

An ultrasonic device includes an element substrate provided with an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged in an array, a sealing plate (array counter plate) that is bonded to the element substrate and covers at least the ultrasonic transducer array, and a support substrate that supports at least one of the element substrate and the sealing plate, and the support substrate has a through hole (insertion section) into which at least part of the sealing plate is inserted. 1. An ultrasonic device comprising:an element substrate provided with an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged in an array;an array counter plate that is bonded to the element substrate and covers at least the ultrasonic transducer array; anda support substrate that supports at least one of the element substrate and the array counter plate,wherein the support substrate has an insertion section into which at least part of the array counter plate is inserted.2. The ultrasonic device according to claim 1 , further comprisinga fixing member that fixes the array counter plate to the support substrate.3. The ultrasonic device according to claim 1 ,wherein the insertion section is a first groove section provided in a thickness direction of the support substrate, andthe first groove section has a first bottom surface that comes into contact with a surface of the array counter plate, the surface facing a side opposite the element substrate.4. The ultrasonic device according to claim 1 ,wherein the insertion section is a through hole that passes through the support substrate in a thickness direction.5. The ultrasonic device according to claim 4 , further comprisinga reinforcing plate that covers the through hole and is bonded to the support substrate,wherein a surface of the reinforcing plate, the surface facing the through hole, comes into contact with a surface of the array counter plate, the surface facing a ...

ULTRASONIC SENSOR AND ULTRASONIC SENSOR DEVICE

A sensor includes a first element part and a second element part. The first element part includes a first upper main electrode part, a first upper sub electrode part and a first lower electrode layer. In the second element part, a configuration of electrodes is inverse to that of the first element part. It includes a second lower main electrode part, a second lower sub electrode part and a second upper electrode layer. The first upper main electrode part and the second lower sub electrode part are connected. The first upper sub electrode part and the second lower main electrode part are connected. The first lower electrode layer and the second upper electrode layer are connected. 1. An ultrasonic sensor comprisinga piezoelectric layer comprising a first region and a second region which face cavities different from each other and each has a thickness direction as a direction of polarization,a first element part comprising the first region, anda second element part comprising the second region, wherein a first upper electrode layer which is located on one side among a positive side and negative side in the direction of polarization relative to the first region and', 'a first lower electrode layer which is located on the other side among the positive side and negative side in the direction of polarization relative to the first region,, 'the first element part comprises'} a second upper electrode layer which is located on the one side among the positive side and negative side in the direction of polarization relative to the second region and', 'a second lower electrode layer which is located on the other side among the positive side and negative side in the direction of polarization relative to the second region,, 'the second element part comprises'} a first upper main electrode part comprising a part located on a center side in the first region and', 'a first upper sub electrode part comprising a part which is located at an outer side of the first region from the first ...

METHOD FOR EXCITING PIEZOELECTRIC TRANSDUCERS AND SOUND-PRODUCING ARRANGEMENT

A method for exciting sound-wave producing transducers () which have operating frequencies defining a transducer frequency range, in which a generator () produces an electrical excitation signal for the transducers (), these electrical excitation signal being fed to the transducers (), wherein the generator () carries out frequency sweeps in a frequency sweep range between a minimum frequency (f) and a maximum frequency (f) with an adjustable sweep rate, with a target frequency (f) being defined within said frequency sweep range, this method being characterized in that the minimum frequency (f), the maximum frequency (f) and the target frequency (f) are selected in such a way that a first frequency difference (Δf) between the minimum frequency (fmin) and the target frequency (f) differs in terms of magnitude from a second frequency difference (Δf) between the maximum frequency (f) and the target frequency (f) within a number of frequency sweeps, and wherein the minimum frequency (f) and/or the maximum frequency (f) and/or the target frequency (f) is/are modified after at least one frequency sweep in such a way that an arithmetic mean of the first frequency differences (Δf), formed over all frequency sweeps carried out, and an arithmetic mean of the second frequency differences (Δf), formed over all frequency sweeps carried out, are substantially the same in terms of magnitude. 177. A method for the excitation of one or a plurality of transducers () , said transducers () being designed for generation of sound waves and exhibiting operating frequencies that define a transducer frequency range , the method comprising:{'b': 7', '9', '8', '7', '1', '7, 'generating an electrical excitation signal for the transducers () with a generator () which has an electrical connection () to the transducers () and a frequency sweep function for the generation of an electrical excitation signal with a variable excitation frequency (), and supplying said excitation signal to the ...

Ultrasound Transducer Array

A transducer array for an ultrasound imaging system includes a substrate and a single array comprising individual sub-sets of transducer elements disposed on the substrate, wherein the individual sub-sets are physically separate from each other and spatially arranged contiguous to each other. An apparatus includes a transducer array with a substrate and a single array comprising individual sub-sets of transducer elements disposed on the substrate, wherein the individual sub-sets are not in physical contact with each other and are serially arranged with respect to each other. The apparatus further includes transmit circuitry that conveys an excitation pulse to the transducer array, receive circuitry that receives a signal indicative of an ultrasound echo from the transducer array, and a beamformer that processes the received signal, generating ultrasound image data.

ULTRASOUND TRANSDUCER ARRANGEMENT AND ASSEMBLY, COAXIAL WIRE ASSEMBLY, ULTRASOUND PROBE AND ULTRASONIC IMAGING SYSTEM

An ultrasound transducer arrangement () is disclosed comprising a plurality of substrate islands () spatially separated and electrically interconnected by a flexible polymer assembly () including electrically conductive tracks providing said electrical interconnections, said plurality including a first substrate island () comprising a plurality of ultrasound transducer cells () and a second substrate island () comprising an array of external contacts for connecting the ultrasound sensor arrangement to a flexible tubular body including a coaxial wire assembly () comprising a plurality of coaxial wires () each having a conductive core () covered by an electrically insulating sleeve (); and an electrically insulating body () having a first main surface (), a second main surface () and a plurality of through holes () each extending from the first main surface to the second main surface and coated with an electrically conductive member, wherein each coaxial wire comprises an exposed terminal core portion mounted in one of said though holes from the first main surface, and wherein each through hole is sealed by a solder bump () on the second main surface such that the ultrasound transducer arrangement can be directly mounted on the flexible tubular body without the need for a PCB. 1. A transducer arrangement for an invasive diagnostic device , comprising:a flexible polymer assembly comprising electrically conductive tracks;a plurality of transducer elements on a transducer substrate island; andone or more support substrate islands comprising application specific integrated circuits and capacitors,wherein the transducer substrate island and the one or more support substrate islands are attached to the flexible polymer assembly.2. The transducer arrangement of claim 1 , wherein the capacitors comprise decoupling capacitors.3. The transducer arrangement of claim 1 , wherein the capacitors comprise trench capacitors formed within a plurality of trenches extending into the one ...

Ultrasound Device

An ultrasound system () includes an ultrasound transducer array and a component () with electronics () embedded in a material () with at least one redistribution layer () electrically coupled to the embedded electronics, wherein the at least one redistribution layer electrically couples the ultrasound transducer array and the electronics. 1. An ultrasound system , comprising:an ultrasound transducer array; anda component with electronics embedded in a material with at least one redistribution layer electrically coupled to the embedded electronics,wherein the at least one redistribution layer electrically couples the ultrasound transducer array and the electronics.2. The ultrasound system of claim 1 , wherein the component is one of a Fan Out Wafer Level Packaging or an Embedded Wafer Level Ball Grid Array based component.3. The ultrasound system of claim 1 , wherein the material includes a mold compound.4. The ultrasound system of claim 1 , wherein the material includes a printed circuit board.5. The ultrasound system of claim 1 , wherein the electronics includes a plurality of dies.6. The ultrasound system of claim 5 , wherein the plurality of dies includes a two dimensional matrix of the dies.7. The ultrasound system of claim 5 , wherein the dies are tiled in a same plane.8. The ultrasound system of claim 5 , wherein a die includes an electrical contact and the redistribution layer includes an electrical conductive trace that extends through the redistribution layer from the electrical contact to the opposing side claim 5 , forming a contact pad.9. The ultrasound system of claim 8 , the ultrasound transducer array claim 8 , comprisingat least one transducer element; andat least one electrical contact of the at least one transducer element, wherein the contract pad and the at least one electrical contact are electrically coupled.10. The ultrasound system of claim 9 , further comprising:a conductive coupling that electrically couples the contract pad and the at ...

ULTRASONIC OSCILLATOR UNIT

An ultrasonic oscillator unit including an ultrasonic oscillator array in which a plurality of ultrasonic oscillators are arranged; an electrode part having a plurality of electrodes electrically connected to the plurality of ultrasonic oscillators, respectively; a circular-arc backing material layer disposed on a rear surface of the ultrasonic oscillator array; three or more wiring boards electrically connected to the plurality of electrodes of the electrode part; and three or more connectors to which a plurality of cables are connected, respectively. The three or more wiring boards are respectively mounted to the three or more connectors and electrically connect the plurality of electrodes of the electrode part to the plurality of cables. The three or more connectors are arranged on a rear surface side of the backing material layer in a width direction. 1. An ultrasonic oscillator unit comprising:an ultrasonic oscillator array in which a plurality of ultrasonic oscillators having a rod shape are arranged in a circular-arc shape while aligning in a longitudinal direction of the rod shape;an electrode part that is provided in at least one end surface of the plurality of ultrasonic oscillators perpendicular to the longitudinal direction and has a plurality of electrodes electrically connected to the plurality of ultrasonic oscillators, respectively;a circular-arc backing material layer disposed on a rear surface of the ultrasonic oscillator array that becomes a center side of the circular-arc shape;three or more electrode wiring boards electrically connected to the plurality of electrodes of the electrode part; andthree or more connectors to which a plurality of cables are connected, respectively,wherein the three or more electrode wiring boards are respectively mounted to the three or more connectors and electrically connect the plurality of electrodes of the electrode part to the plurality of cables, andwherein the three or more connectors are arranged in a width ...

ULTRASONIC TRANSDUCER CHIP ASSEMBLY, ULTRASOUND PROBE, ULTRASONIC IMAGING SYSTEM AND ULTRASOUND ASSEMBLY AND PROBE MANUFACTURING METHODS

Disclosed is an ultrasonic transducer assembly comprising an ultrasonic transducer chip () having a main surface comprising a plurality of ultrasound transducer elements () and a plurality of first contacts () for connecting to said ultrasound transducer elements; a contact chip () having a further main surface comprising a plurality of second contacts (); an backing member () comprising ultrasound absorbing and/or scattering bodies (), said backing member comprising a first surface () on which the transducer chip is mounted and a second surface () on which the contact chip is mounted; and a flexible interconnect () extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks (), each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed. 1. An ultrasonic transducer assembly comprising:an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements;a contact chip having a further main surface comprising a plurality of second contacts for contacting a signal processing assembly;a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is located and a second surface on which the contact chip is located; anda flexible interconnect extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact.2. The ultrasonic transducer assembly of claim 1 , wherein the backing member ...

Modular piezoelectric sensor array with co-integrated electronics and beamforming channels

A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.

ULTRASONIC IMAGING DEVICE WITH PROGRAMMABLE ANATOMY AND FLOW IMAGING

An imaging device includes a transducer that includes an array of piezoelectric elements formed on a substrate. Each piezoelectric element includes at least one membrane suspended from the substrate, at least one bottom electrode disposed on the membrane, at least one piezoelectric layer disposed on the bottom electrode, and at least one top electrode disposed on the at least one piezoelectric layer. Adjacent piezoelectric elements are configured to be isolated acoustically from each other. The device is utilized to measure flow or flow along with imaging anatomy. 1. An imaging device comprising:a transducer;a two-dimensional (2D) array of piezoelectric elements arranged in rows and columns on the transducer, each piezoelectric element having at least two terminals, each piezoelectric element being physically isolated from each adjacent piezoelectric element to reduce cross talk,a first column of piezoelectric elements of the array, each piezoelectric element having a first top electrode connected to a respective receive amplifier, each of the piezoelectric elements to be electronically programmed as if connected together to form a first column, anda second column of piezoelectric elements of the array, each piezoelectric element having a second top electrode connected to a respective transmit driver, each of the piezoelectric elements to be electronically programmed as if connected together to form a second column,wherein the electronically programmed connections of the piezoelectric elements enables connection of an arbitrary number of piezoelectric elements in a column.2. The imaging device of claim 1 , wherein elements and sub-elements of columns are controlled as separate claim 1 , independent columns.3. The imaging device of claim 1 , wherein each piezoelectric element exhibits multiple modes of vibration enabling Anatomy and Doppler imaging over a large bandwidth with electronic steering and focus control of an elevation plane.4. The imaging device of claim 1 ...

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature. 1. A method of fabricating an ultrasound device , the method comprising:forming, in a first wafer having a first silicon device layer and a dielectric layer, a plurality of cavities by completely etching through a first thickness of the dielectric layer and by partially etching through a second thickness of the first silicon device layer; andbonding a second wafer, having a second silicon device layer, with the first wafer so that the plurality of cavities are disposed between the first device layer and the second device layer.2. The method of claim 1 , wherein bonding the second wafer with the first wafer comprises annealing the bonded first and second wafers at a temperature greater than 500° C.3. The method of claim 1 , wherein bonding the second wafer with the first wafer comprises forming a Si—SiObond or a SiO—SiObond.4. The method of claim 1 , further comprising thinning a portion of the second silicon device layer.5. The method of claim 1 , further comprising bonding a CMOS wafer with the bonded first and second wafers at a temperature that is less than 450° C.6. The method of claim 5 , further comprising placing a bonding material in contact with the second silicon device layer claim 5 , and wherein bonding the CMOS wafer with the bonded first and second wafers comprises placing a metallization layer of the CMOS wafer electrically in contact with the bonding material.7. The method of claim 1 , wherein the first wafer is a silicon-on-insulator (SOI) wafer and the second wafer is a bulk silicon ...

ULTRASOUND ELEMENT AND ULTRASOUND ENDOSCOPE

An ultrasound element includes a silicon substrate, a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities smaller than the respective lower electrode sections are formed, an upper electrode layer that has a plurality of upper electrode sections that are disposed to face the respective lower electrode sections via the respective cavities, and are smaller than the lower electrode sections and larger than the cavities, and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential that detects a capacitance signal, and a protection layer. 1. An ultrasound element , comprising:a base substrate;a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections that connect the plurality of lower electrode sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied;a lower insulating layer;an upper insulating layer in which a plurality of cavities smaller than the respective lower electrode sections are formed;an upper electrode layer that has a plurality of upper electrode sections that are disposed to face the respective lower electrode sections via the respective cavities, and are smaller than the lower electrode sections and larger than the cavities, and a plurality of upper wiring sections that connect the plurality of upper electrode sections, and is connected to an upper electrode terminal at a ground potential that detects a capacitance signal; anda protection layer.2. The ultrasound element according to claim 1 ,wherein the upper wiring sections and the lower wiring sections are placed so as not to be disposed to face each other.3. The ultrasound element according to claim ...

DEVICE MOUNTABLE PACKAGING OF ULTRASONIC TRANSDUCERS

An electronic device including an array of ultrasonic transducers for generating and receiving ultrasonic signals, and an acoustic coupling layer overlying the array of ultrasonic transducers, where the ultrasonic signals are propagated through the acoustic coupling layer. 1. A mobile device comprising:a processor;a memory unit;a display device disposed on a first surface of the mobile device; anda fingerprint sensor disposed on a second surface of the mobile device, wherein the second surface is a curved surface having a curvature such that the fingerprint sensor is curved to match the curvature of the curved surface.2. The mobile device of claim 1 , wherein the fingerprint sensor comprises an ultrasonic fingerprint sensor.3. The mobile device of claim 2 , wherein the ultrasonic fingerprint sensor comprises:an array of ultrasonic transducers for generating and receiving ultrasonic signals; andan acoustic coupling layer overlying the array of ultrasonic transducers, wherein the ultrasonic signals are propagated through the acoustic coupling layer.4. The mobile device of claim 3 , wherein the ultrasonic transducers comprise Piezoelectric Micromachined Ultrasonic Transducer (PMUT) devices.5. The mobile device of claim 3 , wherein the ultrasonic transducers comprise Capacitive Micromachined Ultrasonic Transducer (CMUT) devices.6. The mobile device of claim 3 , wherein the acoustic coupling layer of the fingerprint sensor is curved to match the curvature of the curved surface.7. The mobile device of claim 3 , wherein the fingerprint sensor further comprises a cover overlying the acoustic coupling layer claim 3 , wherein the cover is curved to match the curvature of the curved surface.8. The mobile device of claim 7 , wherein the cover has varying thickness such that the cover is thinner at a midpoint of the cover and thicker towards an edge of the cover.9. The mobile device of claim 7 , wherein the cover has varying thickness such that the cover is thicker at a midpoint ...

Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, electronic apparatus, and manufacturing method of mounting structure

A mounting structure includes a first substrate which has a first surface on which a functional element is provided, a second substrate that has a second surface facing the first surface, a wiring portion that is provided at a position which is different from a position of the functional element on the first surface, has a third surface facing the second surface, and is electrically connected to the functional element, and a conduction portion that is provided on the second surface, protrudes toward the first surface, and is connected to the third surface so as to be electrically connected to the functional element, in which an area of the third surface is larger than an area of a first end section of the wiring portion on the first substrate side in a plan view which is viewed from a thickness direction of the first substrate and the second substrate.

Ultrasound probe and flexible substrate used in ultrasound probe

An ultrasound probe of the present disclosure includes an ultrasound element unit 1, to which a flexible substrate 7 is connected, the flexible substrate 7 including lamination of a ground layer 7 e and a signal layer 7 a via an insulation layer 7 c. The flexible substrate 7 includes a bending part and a flat part. The signal layer 7 a includes a linear first signal line and a linear second signal line that are adjacent to each other. The ground layer 7 e at the bending part includes a linear first ground line and a linear second ground line that are adjacent to each other. The first signal line and the first ground line are opposed to each other, and the second signal line and the second ground line are opposed to each other.

Implementation of On-Off Passive Wireless Surface Acoustic Wave Sensor Using Coding and Switching Techniques

Methods and systems for passive wireless surface acoustic wave devices for orthogonal frequency coded devices to implement ON-OFF sensors reusing orthogonal frequency code and distinguishing between ON and OFF states using additional PN sequence and on/off switches producing multi-level coding as well as external stimuli for switching and identification of a closure system. An embodiment adds a level of diversity by adding a dibit to each surface acoustic wave devices, thus providing four different possible coding states. The PN on-off coding can be with the dibit for coding in a multi-tag system. 1. A wireless external closure detection for surface acoustic wave devices , comprising:one or more magnetic switches each connected with a single channel or parallel channels of a coded surface acoustic wave device; andan external magnetic field applied to the two or more magnetic switches to determine if a wireless communication link is established and that the surface acoustic wave device is operational.2. The wireless external closure detection of claim 1 , wherein the one or more magnetic switches comprises:two magnetic switches, one in a normally on position connected with a first channel and the other one in a normally off position connected to a second channel parallel with the first channel, the two magnetic switches switching between channels when the external magnetic field is present.3. The wireless external closure detection of claim 1 , wherein the one or more magnetic switches comprises:one or more reed switches for magnetic closure detection.4. An integrated surface acoustic wave closure sensor consisting essentially of:surface acoustic wave encoded devices having plural reflector gratings coupled with a transducer; anda thin film ferromagnetic material connected with the surface acoustic wave encoded devices, the placement of the thin film ferromagnetic material changing a selected one of a delay, loss or frequency of the surface acoustic wave devices.5. ...

Ultrasonic inspection probe, system, and method

Disclosed herein is an ultrasonic inspection probe for inspecting parts. The ultrasonic inspection probe comprises a probe body that comprises an ultrasonic array and a plate attachment surface. The ultrasonic array comprises a plurality of ultrasound elements, each selectively operable to generate an ultrasonic beam and each fixed relative to the plate attachment surface. The ultrasonic inspection probe also comprises an interface plate, comprising a body attachment surface, removably attachable to the plate attachment surface of the probe body, and a part inspection surface, shaped to complement a shape of one of the parts.

METHOD OF MANUFACTURING ULTRASOUND PROBE

Provided is a method of manufacturing an ultrasound probe. The method includes: preparing a backing layer having first and second surfaces with different heights due to forming a groove in the backing layer, wherein first and second electrodes are exposed on the first and second surfaces, respectively; forming a third electrode that is in contact with the first electrode; forming a base piezoelectric unit on the third electrode, the base piezoelectric unit including a piezoelectric layer; forming a piezoelectric unit by removing an upper region of the base piezoelectric unit; and forming a fourth electrode on the backing layer and the piezoelectric unit. 1. An ultrasound probe comprising:a backing layer having first and second surfaces with different widths due to forming a groove in the backing layer,a first and second electrodes disposed within the backing layer and exposed on the first and second surfaces, respectively;a third electrode that is disposed within the groove and contacts the first electrode;a piezoelectric unit that is disposed on the third electrode and includes a piezoelectric layer; anda fourth electrode disposed on the backing layer and the piezoelectric unit, wherein an upper surface of the piezoelectric unit is at the same level as the second surface of the backing layer.2. The ultrasound probe of claim 1 , wherein the second electrode is electrically connected to a upper surface of the piezoelectric unit through the fourth electrode formed as at least one of layer on the second surface and the upper surface of the piezoelectric unit.3. The ultrasound probe of claim 1 , wherein the fourth electrode is diposed on the piezoelectric layer of the piezoelectric unit and the second surface of the backing layer.4. The ultrasound probe of claim 1 , wherein the fourth electrode contacts both the piezoelectric layer of the piezoelectric unit and the second surface of the backing layer directly.5. The ultrasound probe of claim 1 , wherein the fourth ...

Modular piezoelectric sensor array with co-integrated electronics and beamforming channels

A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.

Flexible micromachined transducer device and method for fabricating same

Techniques and structures for providing flexibility of a micromachined transducer array. In an embodiment, a transducer array includes a plurality of transducer elements each comprising a piezoelectric element and one or more electrodes disposed in or on a support layer. The support layer is bonded to a flexible layer including a polymer material, wherein flexibility of the transducer array results in part from a total thickness of a flexible layer. In another embodiment, flexibility of the transducer array results in part from one or more flexural structures formed therein.

REFLECTION MINIMIZATION FOR SENSOR

An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation. 1. An electronic device comprising:a substrate layer having a front surface and a back surface opposite the front surface; anda plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer; anda plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.2. The electronic device of claim 1 , wherein the plurality of substrate structures comprises scattering structures configured to modify a direction of the backward waves during the operation.3. The electronic device of claim 2 , wherein the scattering structures are dimensioned to create destructive interference of the backward waves.4. The electronic device of claim 1 , wherein the plurality of substrate structures comprises absorption structures comprising acoustic absorption material to modify an amplitude of the backward waves during the operation.5. The electronic device of claim 1 , wherein the plurality of ultrasonic transducers are Piezoelectric Micromachined Ultrasonic Transducer (PMUT) devices.6. The electronic device of claim 5 , wherein a PMUT device of the plurality of ultrasonic transducers comprises:a support structure connected to the substrate layer; and a ...

ULTRASOUND TRANSDUCER AND METHOD FOR MAKING THE SAME

The present application provides a multilayer lateral mode coupling method for phased array construction and transducer devices built accordingly. This disclosure describes and demonstrates that the electrical impedance of a phased array can be substantially reduced and readily controlled to be close to the source impedance. The fabrication process is relatively simple and inexpensive. In addition, the elements are robust for use in 1.5, 2, 3 or other dimensional configurations, over an extended period of operation, without structural failure, and providing a high power output required for imaging and/or medical therapy applications. 1. A method for fabricating an acoustic array of transducer elements , comprising: providing a plurality of piezoelectric layers, each piezoelectric layer having a respective plurality of dimensions defining its spatial extent, including a first dimension along a first axis along which said piezoelectric layer radiates acoustic energy when excited by an electrical driving signal applied along a second axis that is perpendicular to said first axis, each piezoelectric layer having a signal electrode and a ground electrode; and', 'providing a plurality of conducting foils acting as electrodes to deliver electrical driving signals to the piezoelectric layers, wherein said conducting foils are interspersed between said plurality of piezoelectric layers to define a set of signal electrodes spatially interleaved with a set of ground electrodes, such that an adjacent pair of piezoelectric layers share a single electrode lying therebetween; and', 'connecting said set of signal electrodes form a common signal electrode and connecting said set of ground electrodes form a common ground electrode, said common ground electrode comprising outer ground electrodes extending along outer sides of the transducer element such that said second axis is perpendicular to said outer ground electrodes; and, 'providing a plurality of acoustic transducer elements, ...

CONCAVE ULTRASOUND TRANSDUCERS AND 3D ARRAYS

A Multiple Aperture Ultrasound Imaging (MAUI) probe or transducer is uniquely capable of simultaneous imaging of a region of interest from separate apertures of ultrasound arrays. Some embodiments provide systems and methods for designing, building and using ultrasound probes having continuous arrays of ultrasound transducers which may have a substantially continuous concave curved shape in two or three dimensions (i.e., concave relative to an object to be imaged). Other embodiments herein provide systems and methods for designing, building and using ultrasound imaging probes having other unique configurations, such as adjustable probes and probes with variable configurations. 1. A method of producing volumetric data representing a region of interest within an object to be imaged , the method comprising:transmitting ultrasound energy as an unfocused ultrasound ping towards a scatterer with a transmit aperture comprising at least one transducer element on an ultrasound transducer array;receiving ultrasound echoes from the scatterer with a first receive aperture comprising a first receiver group of transducer elements on the ultrasound transducer array;coherently combining echoes received by the elements of the first receive aperture;forming first volumetric data with the coherently combined ultrasound echoes received by the first receive aperture;receiving ultrasound echoes from the scatterer with a second receive aperture comprising a second receiver group of transducer elements on the ultrasound transducer array;coherently combining echoes received by the elements of the second receive aperture;forming second volumetric data with the coherently combined ultrasound echoes received by the second receive aperture; andincoherently combining the first volumetric data and the second volumetric data to produce the volumetric data representing the region of interest.2. The method of further comprising accessing calibration data that describes a position and orientation of ...

Release hole plus contact via for fine pitch ultrasound transducer integration

Methods, systems, computer-readable media, and apparatuses for high density Micro-Electro-Mechanical Systems (MEMS) are presented. In some embodiments, a method for manufacturing a micro-electro-mechanical device on a substrate can comprise etching a release via through a layer of the device. The method can further comprise creating a cavity in the layer of the device using the release via as a conduit to access the desired location of the cavity, the cavity enabling movement of a transducer of the device. The method can then comprise depositing low impedance, electrically conductive material into the release via to form an electrically conductive path through the layer. Finally, the method can comprise electrically coupling the electrically conductive material to an electrode of the transducer.

ACOUSTOPHORETIC DEVICE WITH PIEZOELECTRIC TRANSDUCER ARRAY

An apparatus for separating particles from a fluid stream includes a flow chamber that has at least one inlet and at least one outlet. At least one ultrasonic transducer is located on a wall of the flow chamber. The transducer includes a piezoelectric array with at least two piezoelectric elements. The piezoelectric array includes a piezoelectric material to create a multi-dimensional acoustic standing wave in the flow chamber. A reflector is located on the wall on the opposite side of the flow chamber from the at least one ultrasonic transducer. 1. An apparatus for separating a second fluid or a particulate from a host fluid , comprising:a flow chamber that includes at least one inlet and at least one outlet; andat least one ultrasonic transducer coupled to the flow chamber, the transducer including a piezoelectric array formed from a plurality of piezoelectric elements, and the piezoelectric array being configured to create at least one multi-dimensional acoustic standing wave in the flow chamber.2. The apparatus of claim 1 , further comprising at least one reflector across the flow chamber from the at least one ultrasonic transducer.3. The apparatus of claim 1 , wherein the piezoelectric array is present on a single crystal claim 1 , with one or more channels separating the piezoelectric elements from each other.4. The apparatus of claim 1 , wherein each piezoelectric element is physically separated from surrounding piezoelectric elements by a potting material.5. The apparatus of claim 1 , wherein each piezoelectric element is connected to an individual electrode claim 1 , such that each piezoelectric element can be individually controlled for phasing claim 1 , frequency claim 1 , and power.6. The apparatus of claim 5 , wherein the plurality of piezoelectric elements also share a common ground electrode.7. The apparatus of claim 1 , wherein the piezoelectric array can be rotated during operation.8. The apparatus of claim 1 , wherein the piezoelectric elements are ...

HAPTIC PEDAL

The present invention relates to a haptic pedal () for a vehicle (). The pedal comprises a plurality of piezoelectric actuators () operable for providing haptic feedback to a driver through the footrest () and sensing means () for mapping the area of the footrest in contact with a driver's foot so that haptic feedback is delivered by selective activation of actuators in the mapped area. The invention also comprises a haptic feedback system including the haptic pedal () and a controller () for receiving an input from the sensing means () relating to the area of the footrest in contact with the driver's foot and for delivering an output to selectively activate piezoelectric actuators overlapping the contact area in dependence on a sensed state of the vehicle. The haptic feedback system may be implemented as part of the vehicle's navigation system. 1. A haptic pedal for a vehicle comprising;a plurality of piezoelectric actuators individually operable for providing haptic feedback to a driver through a footrest; andsensing means for mapping the area of the footrest in contact with a driver's foot whereby haptic feedback is delivered by selective activation of the actuators in the mapped area.2. The pedal of wherein the sensing means comprises pressure sensing means.3. The pedal of wherein the sensing means comprises a pressure sensitive material.4. The pedal of wherein the pressure sensitive material comprises a layer of the footrest.5. The pedal of wherein the pressure sensitive material comprises an electrically conductive material.6. The pedal of wherein the electrically conductive pressure sensitive material comprises a quantum tunnelling composite material.7. The pedal of wherein the piezoelectric actuators comprise a layer of piezoelectric elements disposed on the footrest such that at least one element underlies the foot when a driver's foot is applied to the pedal.8. The pedal of wherein the piezoelectric actuators comprise an array of piezoelectric strips.9. ...

ULTRASONIC FINGERPRINT SENSOR PACKAGE

The present disclosure discloses an ultrasonic fingerprint sensor package. The ultrasonic fingerprint sensor package includes a substrate, a control chip, bonding wires, an ultrasonic probe, and packaging material. The control chip is arranged on the substrate. The control chip is connected to the substrate by the bonding wires using a wire bonding technology. The ultrasonic probe is arranged on the control chip and is configured to emit ultrasonic wave and receive ultrasonic wave reflected by an object. The packaging material covers the substrate, the control chip, and the bonding wires and fixing the ultrasonic probe using a molding technology. 1. An ultrasonic fingerprint sensor package comprising:a substrate;a control chip arranged on the substrate;bonding wires, the control chip connected to the substrate by the bonding wires using a wire bonding technology;an ultrasonic probe arranged on the control chip and is configured to emit ultrasonic wave and receive ultrasonic wave reflected by an object; andpackaging material covering the substrate, the control chip, and the bonding wires and fixing the ultrasonic probe using a molding technology.2. The ultrasonic fingerprint sensor package of claim 1 , wherein the substrate comprises a substrate top surface claim 1 , the control chip comprises a chip bottom surface corresponding to the substrate top surface claim 1 , the ultrasonic fingerprint sensor package further comprises a first adhesive layer claim 1 , and the first adhesive layer connects the substrate top surface to the chip bottom surface.3. The ultrasonic fingerprint sensor package of claim 2 , wherein the first adhesive layer comprises one or more of the following: diallyl fumarate adhesive and liquid non-conductive adhesive.4. The ultrasonic fingerprint sensor package of claim 2 , wherein the positive projection of the control chip on the substrate top surface falls in the substrate top surface.5. The ultrasonic fingerprint sensor package of claim 1 , ...

FINGERPRINT SENSOR AND FINGERPRINT IDENTIFICATION MODULE COMPRISING THE SAME

The present disclosure discloses a fingerprint sensor and a fingerprint identification module. The fingerprint sensor comprises a substrate and an ultrasonic transducer. The upper surface of the substrate is provided with a plurality of first connecting electrodes, wherein the lower surface of the substrate is provided with a plurality of second connecting electrodes, and wherein the first connecting electrodes are configured to electrically connect with the second electrodes. The ultrasonic transducer is provided on the upper surface, wherein the ultrasonic transducer comprises a plurality of third connecting electrodes, and wherein the third connecting electrodes are configured to electrically connect with the first connecting electrodes. 1. A fingerprint sensor , comprising:a substrate comprising an upper surface, a plurality of first connecting electrodes formed on the upper surface, a lower surface, and a plurality of second connecting electrodes formed on the lower surface, and wherein the first connecting electrodes are configured to electrically connect with the second electrodes; andan ultrasonic transducer, wherein the ultrasonic transducer is provided on the upper surface, wherein the ultrasonic transducer comprises a plurality of third connecting electrodes, and wherein the third connecting electrodes are configured to electrically connect with the first connecting electrodes.2. The fingerprint sensor of claim 1 , wherein the first connecting electrodes are arranged corresponding to the third connecting electrodes.3. The fingerprint sensor of claim 1 , wherein the positive projections of second connecting electrodes on the upper surface of the substrate are distributed around the first connecting electrodes.4. The fingerprint sensor of claim 1 , wherein the ultrasonic transducer comprises:a piezoelectric layer, wherein the piezoelectric layer comprises an array of piezoelectric pillars;a plurality of receiving electrode lines being formed on the ...

ULTRASONIC PROBE AND MANUFACTURING METHOD OF THE SAME AND ULTRASONIC FINGERPRINT RECOGNITION DEVICE

The present disclosure provides an ultrasonic probe. The ultrasonic probe includes a piezoelectric layer, including a number of piezoelectric posts arranged in a number of rows along a first direction and arranged in a number of columns along a second direction, and an angle between the first direction and the second direction being an acute angle, a distance between the two adjacent piezoelectric posts along the first direction being greater than a distance between the two adjacent rows of the piezoelectric posts. The ultrasonic probe improves the density of the piezoelectric post by misaligning the two adjacent rows of piezoelectric posts and compressing the row spacing, which makes better use of the space between the two adjacent rows of piezoelectric posts. That is, the space utilization of the ultrasonic probe is improved and pixel density is high. 1. An ultrasonic probe for use in an ultrasonic fingerprint recognition device , the ultrasonic probe comprising:a piezoelectric layer, comprising a plurality of piezoelectric posts arranged in a plurality of rows along a first direction and arranged in a plurality of columns along a second direction, and an angle between the first direction and the second direction being an acute angle, a distance between the two adjacent piezoelectric posts along the first direction being greater than a distance between the two adjacent rows of the piezoelectric posts.2. The ultrasonic probe of claim 1 , wherein the cross-section of the piezoelectric post is circular shape or rectangular shape.3. The ultrasonic probe of claim 2 , wherein when the cross-section of the piezoelectric post is rectangular shape claim 2 , the side of rectangle is perpendicular to or parallel to the second direction.4. The ultrasonic probe of claim 1 , wherein the height of the piezoelectric post is 70 to 80 microns.5. The ultrasonic probe of claim 1 , wherein the piezoelectric post comprises lead zirconate titanate piezoelectric material.6. The ...

ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANSDUCER

An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards. 1. An apparatus , comprising:an ultrasound-on-a-chip device comprising an ultrasonic transducer substrate having a plurality of ultrasonic transducer cells; andfor each of first and second ultrasonic transducer cells of the plurality of ultrasonic transducer cells, multiple conductive bond connections disposed between the ultrasonic transducer substrate and an integrated circuit substrate.2. The apparatus of claim 1 , wherein the first and second ultrasonic transducer cells are disposed proximate a first side of the ultrasonic transducer substrate and the multiple conductive bond connections are disposed between a second side of the ultrasonic transducer substrate and the integrated circuit substrate.3. The apparatus of claim 2 , wherein the multiple conductive bond connections of the first ultrasonic transducer cell of the plurality of ultrasonic transducer cells are distributed substantially evenly with respect to an area of the first ultrasonic transducer cell.4. The apparatus of claim 2 , wherein the multiple conductive bond connections comprise one or more of: thermal compression connections claim 2 , eutectic connections or silicide connections.5. The apparatus of claim 2 , wherein the multiple conductive bond connections of the first and second ultrasonic transducer cells contact a conductive portion of a silicon layer of the ultrasonic transducer substrate at a first end thereof claim 2 , and a metal layer of the integrated circuit substrate at a second end thereof.6. The apparatus of claim 2 , further comprising a plurality of ...

MAGNETICALLY DRIVEN ULTRASONIC SCANNING DEVICE

The present invention provides an ultrasonic probe scanning device comprising: a disposable part and a fixed part. In the disposable part, an ultrasonic probe with a magnetic end attaches to a slide rail encapsulated in a water-containing closed area. Otherwise, in the fixed part, a magnetic holder attached to a track, and a motor for driving the magnetic holder to move back and forth on the track. When the disposable part and the fixed part be combined, it can drive the motion of ultrasonic scanning device by magnetic attraction force. 1. An ultrasonic probe scanning device comprising: a power input port;', 'a slide rail: and', 'an ultrasonic probe having a magnetic end with at least a pair of magnet N and S poles, wherein the ultrasonic probe is connected to the slide rail and electrically connected to the power input port, wherein the slide rail and the ultrasonic probe are encapsulated in a water-containing closed area;, 'a disposable part having a power output slot for electrically engaging the power input port when the disposable part is combined with the fixed part;', 'a track;', 'a magnetic holder coupled to the track for magnetically driving the ultrasonic probe when the disposable part is combined with the fixed part; and', 'a motor which drives the magnetic holder to move on the track., 'a fixed part having2. The ultrasonic probe scanning device of claim 1 , wherein the ultrasonic probe further comprises a miniature brake claim 1 , which is used for controlling the ultrasonic probe moving perpendicularly to the slide rail.3. The ultrasonic probe scanning device of claim 1 , wherein the ultrasonic probe comprises:a therapy probe; andan imaging probe, which is parallel to the irradiation direction of the therapy probe.4. The ultrasonic probe scanning device of claim 3 , wherein the imaging probe has the same focal plane as the therapy probe.5. The ultrasonic probe scanning device of claim 3 , wherein the operating frequency of the imaging probe is 5 to 20 ...

PROCESSING DEVICE, ULTRASONIC DEVICE, ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSTIC DEVICE

An ultrasonic device includes a substrate, first ultrasonic elements having a resonance characteristic of a first frequency, and second ultrasonic elements having a resonance characteristic of a second frequency lower than the first frequency. The first ultrasonic elements are arranged along a first direction to make a first to an n-th high-frequency ultrasonic element lines. The second ultrasonic elements are arranged along the first direction to make a first to an n-th low-frequency ultrasonic element lines. The first to the n-th high-frequency ultrasonic element lines and the first to the n-th low-frequency ultrasonic element lines are arranged along a second direction. The first and second ultrasonic elements have an opening, a vibrating membrane, and a piezo element part. A length in the second direction of the opening of the first ultrasonic element is shorter than a length in the second direction of the opening of the second ultrasonic element. 1. An ultrasonic device comprising:a substrate;a plurality of first ultrasonic elements having a resonance characteristic of a first frequency disposed on the substrate; anda plurality of second ultrasonic elements having a resonance characteristic of a second frequency, which is lower than the first frequency, disposed on the substrate,the plurality of first ultrasonic elements being arranged along a first direction to make a first high-frequency ultrasonic element line to an n-th high-frequency ultrasonic element line (n is an integer of more than 2),the plurality of second ultrasonic elements being arranged along the first direction to make a first low-frequency ultrasonic element line to an n-th low-frequency ultrasonic element line,the first high-frequency ultrasonic element line to the n-th high-frequency ultrasonic element line being arranged along a second direction which intersects with the first direction,the first low-frequency ultrasonic element line to the n-th low-frequency ultrasonic element line being ...

THIN AND WEARABLE ULTRASOUND PHASED ARRAY DEVICES

Ultrasound phased array apparatuses (including systems and devices) and methods for making and using them. These apparatuses may be thin, and lightweight, so that they may be worn on a subject's head or other body region in acoustic communication so as to deliver ultrasound for stimulation of tissue, and particularly for neurostimulation. The ultrasound phased array apparatuses may be used as wearable and lightweight neurostimulation apparatuses. 130.-. (canceled)31. A wearable phased array ultrasound neurostimulator apparatus , the apparatus comprising:an array of ultrasound transducer elements wherein each transducer element has a width and a thickness, and the width is greater than twice the thickness to cause preferential operation of said transducer element in a radial mode as compared with a thickness mode;control circuitry configured to operate the array of ultrasound transducer elements between 100 kHz and 1 MHz as a phased array to cause a beamforming of emitted ultrasound signals; andan outer surface of the apparatus configured to adhesively attach to a subject's skin.32. The apparatus of claim 31 , wherein the spacing between the ultrasound transducer elements of the array of ultrasound elements is between about 0.2 mm and 2 mm.33. The apparatus of claim 31 , wherein the control circuitry is printed onto a printed circuit board (PCB) substrate configured as a matching layer claim 31 , a front side of each ultrasound transducer element of the array of ultrasound transducer elements being mounted onto said PCB substrate to cause a transmission of the emitted ultrasound signals through the PCB substrate.34. The apparatus of claim 31 , wherein the array of ultrasound transducers are air backed on a back side of each ultrasound transducer element.35. The apparatus of claim 31 , wherein the width is between about 2 times and 10 times the thickness for each transducer element.36. The apparatus of claim 31 , wherein the width is approximately half of a wavelength ...

Ultrasonic module and method for manufacturing the same

An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.

ULTRASOUND IMAGING WITH SPARSE ARRAY PROBES

Sparse arrays of transducer elements may be beneficial in providing ultrasound transducer probes with a wide total aperture while containing a manageable number of transducer elements. Sparse arrays made with bulk piezoelectric materials or with arrays of micro-elements can be effectively with ping-based multiple aperture ultrasound imaging techniques to perform real-time volumetric imaging. 1. An ultrasound imaging system comprising:a transducer probe having a first array segment and a second array segment separated from the first array segment by a gap of open space, the first and second array segments secured to at least one structural housing member rigidly holding the first and second arrays in fixed positions relative to one another; andan imaging control system containing instructions to: transmit an unfocused ultrasound ping from a transmit aperture approximating a point-source into an object to be imaged, receiving echoes of the ping from reflectors directly below gap with receive transducer elements on both the first array segment and the second array segment, producing a volumetric image of the region below the gap by combining echo data from echoes received by receive elements on both array segments.2. The system of claim 1 , wherein each array segment comprises an array of micro-elements. This application is a division of U.S. application Ser. No. 15/418,534, filed Jan. 27, 2017, now U.S. Pat. No. 10,856,846, which application claims the benefit of U.S. Provisional Application No. 62/287,694, filed Jan. 27, 2016, titled “Ultrasound Imaging Using Apparent Point-Source Transmit Transducer”, and U.S. Provisional Application No. 62/310,482, filed Mar. 18, 2016, titled “Real-Time Three-Dimensional Ultrasound Imaging”, all of which are herein incorporated by reference in their entirety.All publications and patent applications mentioned in this specification are herein incorporated by reference in their entirety to the same extent as if each individual ...

INTEGRATION TECHNIQUES FOR MICROMACHINED pMUT ARRAYS AND ELECTRONICS USING THERMOCOMPRESSION BONDING, EUTECTIC BONDING, AND SOLDER BONDING

The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable. 1. A device comprising a first substrate and a second substrate , the first substrate comprising at least one piezoelectric micromachined ultrasonic transducer (pMUT) array and the second substrate comprising at least one electrical circuit , wherein the first substrate and the second substrate are bonded together using thermocompression , wherein any set of one or more individual PMUTs of the at least one PMUT array is addressable.2. The device according to claim 1 , wherein the pMUT array is configured to perform ultrasound imaging.3. The device according to claim 1 , wherein the at least one electrical circuit comprises an application-specific integrated circuit (ASIC).4. The device according to claim 1 , wherein the bonding comprises wafer-to-wafer bonding.5. The device according to claim 1 , wherein the bonding comprises die-to-wafer bonding.6. The device according to claim 5 , wherein the die-to-wafer bonding uses an intermediate handle substrate and a temporary bonding layer.7. The ...

METHODS AND SYSTEMS FOR MANUFACTURING AN ULTRASOUND PROBE

Systems and methods described herein generally relate to forming a conductive layer of an ultrasound probe. The systems and methods form an ultrasound probe that includes a piezoelectric layer, and first and second matching layers. The first matching layer is interposed between the second matching layer and the piezoelectric layer. The second matching layer formed from a material having a select acoustic impedance from a laser activated molded interconnect device (MID) or a three-dimensional printer. The second matching layer being electrically coupled to the piezoelectric layer. 1. A method , comprising:forming a second matching layer of an ultrasound probe from a material having a select acoustic impedance;activating a bottom surface area of the second matching layer using a laser beam based on a template to form a conductive layer; andelectrically coupling the conductive layer to a piezoelectric layer.2. The method of claim 1 , wherein the material includes Acrylonitrile butadiene styrene (ABS) claim 1 , a polycarbonate (PC) claim 1 , Polymerization (PA) claim 1 , Polyphthalamide (PPA) claim 1 , Polybutylene terephthalate (PBT) claim 1 , Cyclic Olefin Copolymer (COP) claim 1 , Polyphenyl Ether (PPE) claim 1 , Liquid-crystal polymer (LCP) claim 1 , Polyethylenimine (PEI) claim 1 , Polyether ether ketone (PEEK) claim 1 , or Polyphenylene sulfide (PPS).3. The method of claim 1 , further comprising coating the material with a metallic particulate encapsulated with an organic coating such that the laser beam is configured to break down the organic coating to expose the metallic particles.4. The method of claim 1 , further comprising positioning the material in a container to form a metal layer on the activated bottom surface area claim 1 , wherein the container includes a chemical electrolyte that includes a metal compound.5. The method of claim 4 , further comprising adjusting the metal compound within the container based on a predetermined sequence claim 4 , such ...

ACOUSTOPHORETIC CLARIFICATION OF PARTICLE-LADEN NON-FLOWING FLUIDS

Acoustophoretic devices for separating particles from a non-flowing host fluid are disclosed. The devices include a substantially acoustically transparent container and a separation unit, with the container being placed within the separation unit. An ultrasonic transducer in the separation unit creates a planar or multi-dimensional acoustic standing wave within the container, trapping particles disposed within the non-flowing fluid and causing them to coalesce or agglomerate, then separate due to buoyancy or gravity forces. 1. An acoustophoretic device for clarifying a discrete volume of fluid , comprising:a substantially acoustically transparent container; anda separation unit surrounding the container and defined by at least one wall and a first opening into which the container can be inserted, the separation unit including at least one ultrasonic transducer having a piezoelectric material driven by a voltage signal to create an acoustic standing wave.2. The device of claim 1 , wherein the container comprises a material selected from the group consisting of plastic claim 1 , glass claim 1 , polycarbonate claim 1 , low-density polyethylene claim 1 , and high-density polyethylene.3. The device of claim 1 , wherein the acoustic standing wave is a planar one-dimensional acoustic standing wave.4. The device of claim 1 , wherein the acoustic standing wave is a multi-dimensional acoustic standing wave.5. The device of claim 5 , wherein the multi-dimensional acoustic standing wave results in an acoustic radiation force having an axial force component and a lateral force component that are of the same order of magnitude.6. The device of claim 1 , further comprising a support structure for moving the container and the at least one ultrasonic transducer relative to each other.7. The device of claim 6 , wherein the support structure moves the at least one ultrasonic transducer along one wall of the separation unit.8. The device of claim 6 , wherein the at least one ultrasonic ...

INTEGRATION TECHNIQUES FOR MICROMACHINED pMUT ARRAYS AND ELECTRONICS USING SOLID LIQUID INTERDIFFUSION (SLID)

The present disclosure provides methods to integrate pMUT arrays with an ASIC using solid liquid interdiffusion (SLID). In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT device and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using a conductive bonding pillar, which conductive bonding pillar comprises one or more intermetallic compounds. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT device and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using a conductive bonding pillar, wherein the bonding is performed at a temperature less than the melting point of the conductive bonding pillar after the bonding. 1. A device comprising a first substrate and a second substrate , the first substrate comprising at least one piezoelectric micromachined ultrasonic transducer (pMUT) device and the second substrate comprising at least one electrical circuit , wherein the first substrate and the second substrate are bonded together using a conductive bonding pillar , which conductive bonding pillar comprises one or more intermetallic compounds.2. The device according to claim 1 , wherein the bonding is performed at a temperature less than the melting point of the conductive bonding pillar after the bonding.3. The device according to claim 1 , wherein the pMUT device is configured to perform ultrasound imaging.4. The device according to claim 1 , wherein the bonding comprises wafer-to-wafer bonding.5. The device according to claim 1 , wherein the bonding comprises die-to-wafer bonding.6. The device according to claim 5 , wherein the die-to-wafer bonding uses an intermediate handle substrate and a temporary bonding layer.7. The ...

ULTRASONIC DEVICE, ULTRASONIC PROBE, ELECTRONIC EQUIPMENT, AND ULTRASONIC IMAGE DEVICE

An ultrasonic device includes a base, a plurality of ultrasonic transducer elements, and a reinforcing body. The base defines a plurality of openings arranged in an array form. The ultrasonic transducer elements are arranged respectively corresponding to the openings with a plurality of vibration films being respectively provided for the ultrasonic transducer elements. The reinforcing body is fixed to the base in an area between adjacent ones of the vibration films when viewed in a plan view along a thickness direction of the base. The reinforcing body has Young's modulus greater than Young's modulus of the base. 1. An ultrasonic device comprising:a base defining a plurality of openings arranged in an array form;a plurality of ultrasonic transducer elements arranged respectively corresponding to the openings with a plurality of vibration films being respectively provided for the ultrasonic transducer elements; anda reinforcing body fixed to the base in an area between adjacent ones of the vibration films when viewed in a plan view along a thickness direction of the base, the reinforcing body having Young's modulus greater than Young's modulus of the base.2. The ultrasonic device according to claim 1 , whereinthe reinforcing body, in cooperation with the base, forms a composite body having a second moment of area greater than a second moment of area of the base alone.3. The ultrasonic device according to claim 2 , whereinthe reinforcing body has a crossing part along a first direction and a second direction that cross each other in the plan view.4. The ultrasonic device according to claim 3 , whereina crossing angle of the first direction and the second direction is 90 degrees.5. The ultrasonic device according to claim 3 , whereinin the plan view, the reinforcing body has a first straight line part cutting across an array area of the ultrasonic transducer elements in the first direction.6. The ultrasonic device according to claim 3 , whereinthe reinforcing body has ...

Multi frequency 2d phased array transducer

Improved two-dimensional planar array transducer and beamformer apparatus and methods. In one embodiment, the two-dimensional planar array transducer is capable of simultaneously or sequentially forming multiple acoustic beams in two axes and at two or more widely separated acoustic frequencies from a single flat planar array transducer. The transducer planar array consists of two or more electrically and acoustically independent two dimensional planar transducer array structures operating at different frequencies that are physically integrated onto a single multi frequency configuration. In an exemplary embodiment, a second higher frequency transducer array is positioned within the aperture area of a lower frequency planar array transducer. Methods of using the aforementioned two-dimensional planar array transducer and beamformer are also disclosed.

INDIVIDUAL ACTUATOR-SENSOR FOR GENERATING A HAPTIC EFFECT ON A PANEL, AND USE OF SAME

A system includes sensor-actuator units fixed onto a plate to be actuated according to at least one predetermined vibratory mode, each sensor-actuator unit having an electromechanical actuator and a deformation or vibratory speed sensor, wherein the electromechanical actuator and the sensor are colocated on the surface, that is to say that the measurement by the sensor is performed in immediate proximity to the electromechanical actuator, this proximity being such that the actuator and the sensor can respectively actuate and measure the same predetermined vibratory mode.

TRANSDUCER AND INSPECTION DEVICE

According to one embodiment, a transducer includes first structure sections and second structure sections. The first structure sections are spaced from each other in a first direction. Part of each of the first structure sections is fixed. The each of the first structure sections includes a first membrane part, a first piezoelectric part, a first conductive part, and a first electrode. The second structure sections are spaced from each other in the first direction. Part of each of the second structure sections is fixed. The each of the second structure sections includes a second membrane part, a second piezoelectric part, a second conductive part, and a second electrode. The second structure sections are spaced from the first structure sections in the first direction. Pitch along the first direction of the second structure sections is shorter than pitch along the first direction of the first structure sections. 1. A transducer comprising: a first membrane part;', 'a first piezoelectric part;', 'a first conductive part provided between at least part of the first membrane part and the first piezoelectric part in a second direction crossing the first direction; and', 'a first electrode, at least part of the first piezoelectric part being located between at least part of the first conductive part and the first electrode in the second direction; and, 'a plurality of first structure sections spaced from each other in a first direction, part of each of the plurality of first structure sections being fixed, the each of the plurality of first structure sections including a second membrane part;', 'a second piezoelectric part;', 'a second conductive part provided between at least part of the second membrane part and the second piezoelectric part in the second direction; and', 'a second electrode, at least part of the second piezoelectric part being located between at least part of the second conductive part and the second electrode in the second direction,, 'a plurality of ...

ULTRASONIC DIAGNOSTIC APPARATUS, PROBE HEAD, ULTRASONIC PROBE, ELECTRONIC MACHINE, AND ULTRASONIC DIAGNOSTIC APPARATUS

An ultrasonic measurement apparatus has an ultrasonic transducer device including an ultrasonic element array, a first through n-th first end-side terminal XA to XAn provided to a first end side, and a first through n-th second end-side terminal XB to XBn provided to a second end side opposing the first end side; a first transmission circuit outputting first drive signals VTA to VTAn to the first through n-th first end-side terminals XA to XAn; and a second transmission circuit outputting second drive signals VTB to VTBn to the first through n-th second end-side terminals XB to XBn. 1. An ultrasonic measurement apparatus comprising:an ultrasonic transducer device including an ultrasonic element array, a first first end-side terminal through an n-th (where n is an integer two or greater) first end-side terminal provided to a first end side of the ultrasonic element array, and a first second end-side terminal through an n-th second end-side terminal provided to a second end side of the ultrasonic element array opposing the first end side of the ultrasonic element array;a first drive electrode line through an n-th drive electrode line, each drive electrode line having a first end and a second end, the first end being connected to the first end-side terminal and the second end being connected to the second end-side terminal;a first transmission circuit configured to output first drive signals to the first first end-side terminal through the n-th first end-side terminal; anda second transmission circuit configured to output second drive signals to the first second end-side terminal through the n-th second end-side terminal,an amplitude of at least one of the first drive signals and the second drive signals being variably set.2. The ultrasonic measurement apparatus as set forth in claim 1 , whereina set position of a scan plane, which is a plane running along a direction of scanning of a beam of ultrasonic waves emitted from the ultrasonic transducer device, is changed by ...

Ultrasound Transducer and Manufacturing Method Thereof

An ultrasound transducer used in an ultrasound system and a method of manufacturing the same are disclosed. The ultrasound transducer is manufactured by forming a backing block including a plurality of surfaces; forming a piezoelectric layer including a first portion formed on the backing block to be in contact therewith and a second portion extending from the first portion; electrically connecting a plurality of pins to the second portion by attaching a connector having the plurality of pins for electrical connection with at least one of a transmitting unit and a receiving unit of an ultrasound system to at least one surface of the plurality of surfaces of the backing block; cutting the first portion and the second portion of the piezoelectric layer into a plurality of piezoelectric elements, wherein each of the plurality of piezoelectric elements is connected to a corresponding one of the plurality of pins of the connector; and forming a ground layer connected to the piezoelectric layer. 1. A method of manufacturing an ultrasound transducer , comprising:forming a backing block including a plurality of surfaces;forming a piezoelectric layer including a first portion formed on the backing block to be in contact therewith and a second portion extending from the first portion;electrically connecting a plurality of pins to the second portion by attaching a connector having the plurality of pins for electrical connection with at least one of a transmitting unit or a receiving unit of an ultrasound system to at least one surface of the plurality of surfaces of the backing block;cutting the first portion and the second portion of the piezoelectric layer into a plurality of piezoelectric elements, wherein each of the plurality of piezoelectric elements is connected to a corresponding one of the plurality of pins of the connector; andforming a ground layer connected to the piezoelectric layer.2. The method of manufacturing an ultrasound transducer of claim 1 , wherein ...

PIEZOELECTRIC ULTRASONIC TRANSDUCER ARRAY WITH SWITCHED OPERATIONAL MODES

Switchable micromachined transducer arrays are described where one or more switches, or relays, are monolithically integrated with transducer elements in a piezoelectric micromachined transducer array (pMUT). In embodiments, a MEMS switch is implemented on the same substrate as the transducer array for switching operational modes of the transducer array. In embodiments, a plurality of transducers are interconnected in parallel through MEMS switch(es) in a first operational mode (e.g., a drive mode) during a first time period, and are then interconnected through the MEMS switch(es) with at least some of the transducers in series in a second operational mode (e.g., a sense mode) during a second time period. 1. A micromachined transducer array , comprising:a transducer substrate;a plurality of transducers disposed over the transducer substrate; andone or more switches disposed over the transducer substrate, wherein the one or more switches are electrically switchable between a first state and second state, the first state interconnecting at least two transducers of the plurality in electrical parallel, and the second state interconnecting the at least two transducers in electrical series.2. The transducer array of claim 1 , wherein the one or more switches comprise one or more MEMS switches.3. The transducer array of claim 1 , wherein the first state places all transducers of the plurality in parallel claim 1 , and the second state places a first subset of the plurality in series with a second subset of the plurality.4. The transducer array of claim 3 , wherein the first subset includes a plurality of transducers connected in electrical parallel and the second subset includes a plurality of transducers connected in electrical parallel.5. The transducer array of claim 3 , wherein the plurality of transducers comprise one channel of a multi-channeled array with each channel of the array including the same number of transducers claim 3 , and each channel of the array ...

INTEGRATION TECHNIQUES FOR MICROMACHINED pMUT ARRAYS AND ELECTRONICS USING THERMOCOMPRESSION BONDING, EUTECTIC BONDING, AND SOLDER BONDING

The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable. 1. A device comprising a first substrate and a second substrate , the first substrate comprising at least one piezoelectric micromachined ultrasonic transducer (pMUT) array and the second substrate comprising at least one electrical circuit , wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding , wherein any set of one or more individual PMUTs of the at least one PMUT array is addressable.2. The device according to claim 1 , wherein the pMUT array is configured to perform ultrasound imaging.3. The device according to claim 1 , wherein the at least one electrical circuit comprises an application-specific integrated circuit (ASIC).4. The device according to claim 1 , wherein the bonding comprises wafer-to-wafer bonding.5. The device according to claim 1 , wherein the bonding comprises die-to-wafer bonding.6. The device according to claim 5 , wherein the die-to-wafer bonding uses an intermediate handle substrate and a temporary bonding layer.7. ...

Ultrasonic endoscope

An ultrasonic endoscope has a laminated body that includes an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged, and a backing material layer that supports the plurality of ultrasonic transducers; a cable portion that includes a plurality of cables each of which is electrically connected to a corresponding one of the plurality of ultrasonic transducers, and a shield member that covers the plurality of cables from outside and that is made of a metal; and a first heat conductive member that is disposed on a side surface of the laminated body. The first heat conductive member is extended to the shield member that is grounded to a housing and is thermally connected to the shield member.

TOUCH DISPLAY SUBSTRATE AND TOUCH DISPLAY DEVICE

The disclosure provides a touch display substrate and a touch display device. The touch display substrate includes: a substrate; a plurality of ultrasonic sensors disposed on the substrate; and one ultrasonic generator disposed on the substrate. The ultrasonic generator has a plurality of openings, and at least one of the plurality of ultrasonic sensors is disposed in at least one of the openings. 1. A touch display substrate , comprising a substrate , a plurality of ultrasonic sensors disposed on the substrate , and one ultrasonic generator disposed on the substrate , whereinthe ultrasonic generator has a plurality of openings, and at least one of the plurality of ultrasonic sensors is disposed in at least one of the plurality of openings.2. The touch display substrate according to claim 1 , wherein the touch display substrate comprises a plurality of pixels arranged in an array claim 1 , each of the plurality of pixels comprises a plurality of sub-pixels claim 1 , the ultrasonic sensor and the sub-pixels are arranged in an array claim 1 , and the ultrasonic generator has a grid-shaped distribution.3. The touch display substrate according to claim 1 , wherein the ultrasonic generator and the ultrasonic sensors are disposed substantially in a same layer.4. The touch display substrate of claim 1 , wherein the touch display substrate comprises a plurality of pixels arranged in an array and a peripheral area surrounding the plurality of pixels claim 1 , and each of the plurality of openings corresponds to each of the plurality of openings.5. The touch display substrate according to claim 1 , wherein each of the ultrasonic sensors comprises a data electrode claim 1 , a bias electrode claim 1 , and a sensing piezoelectric layer disposed between the data electrode and the bias electrode claim 1 , andthe ultrasonic generator comprises an upper electrode, a lower electrode, and a generating piezoelectric layer disposed between the upper electrode and the lower electrode.6. ...

ULTRASONIC DEVICE, ULTRASONIC PROBE, ULTRASONIC DIAGNOSTIC APPARATUS, AND METHOD OF MANUFACTURING ULTRASONIC DEVICE

An ultrasonic device includes a substrate, a first piezoelectric body, a second piezoelectric body, and an acoustic matching section. The substrate has a first surface that is a flat surface. The first piezoelectric body is disposed on the first surface of the substrate. The second piezoelectric body is disposed on the first surface of the substrate. The second piezoelectric body has a different thickness from a thickness of the first piezoelectric body as measured from the first surface of the substrate. The acoustic matching section is disposed on the first piezoelectric body and the second piezoelectric body. The acoustic matching section has a first side facing the first piezoelectric body and the second piezoelectric body, and a second side opposite from the first side. A surface of the acoustic matching section on the second side is a flat surface parallel with the first surface of the substrate. 1. An ultrasonic device comprising:a substrate having a first surface, the first surface being a flat surface;a first piezoelectric body disposed on the first surface of the substrate;a second piezoelectric body disposed on the first surface of the substrate, the second piezoelectric body having a different thickness from a thickness of the first piezoelectric body as measured from the first surface of the substrate; andan acoustic matching section disposed on the first piezoelectric body and the second piezoelectric body, the acoustic matching section having a first side facing the first piezoelectric body and the second piezoelectric body, and a second side opposite from the first side, a surface of the acoustic matching section on the second side being a flat surface parallel with the first surface of the substrate.2. The ultrasonic device according to claim 1 , wherein [{'br': None, 'i': f', 'n×f, '2=1 \u2003\u2003formula (1)'}, {'br': None, 'i': d', 'Cp', 'f, '1=/(2×1) \u2003\u2003formula (2)'}, {'br': None, 'i': d', 'Cp', 'f, '2=/(2×2) \u2003\u2003formula (3)'}, ...

Sound Transducer Arrangement

A sound transducer system is provided having a piezoelectrically active electret material between a first and a second electrode structure. The electret material is applied on the first electrode structure, so that the first electrode structure is completely covered with the electret material. The second electrode structure is situated on or above the electret material, so that the electret material is situated between the first and second electrode structure. The first electrode structure is configured from a plurality of electrode elements that are addressable independently of one another. The electrode elements thus define the individual sound transducer elements, which together form a sound transducer system, also designated an array. The first electrode structure is configured on a surface of a multilayer circuit bearer.

METHODS FOR MANUFACTURING ULTRASOUND TRANSDUCERS AND OTHER COMPONENTS

The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein. 1. An ultrasonic transducer assembly comprising:a transducer array comprising a number of spaced transducer elements;at least one printed circuit including two or more stepped trace layers, each layer having a plurality of conductive traces therein the ends of which are electrically coupled to a corresponding transducer element, wherein the ends of the conductive traces in any single trace layer at a point where the traces are coupled to the transducer elements are spaced farther apart than a distance between adjacent transducer elements in the transducer array; anda plurality of interconnections, each interconnection electrically coupling a conductive trace in a trace layer the printed circuit to a corresponding transducer element.2. The ultrasonic transducer assembly of claim 1 , wherein the interconnections have a width that is narrower than a width of the transducer elements to which they are connected.3. The ultrasonic transducer assembly of claim 1 , wherein the transducer array has a length and a width that is shorter than the length claim 1 , and wherein the printed circuit has traces therein that extend along the printed circuit in a direction that is generally parallel to ...

ULTRASONIC GENERATOR

According to one embodiment, an ultrasonic generator includes a plurality of ultrasonic transducers and a drive unit. The ultrasonic transducers each are configured to generate an ultrasonic wave. The drive unit is configured to supply a drive signal generating the ultrasonic wave to each of the ultrasonic transducers, and configured to change phase of the drive signal supplied to a second ultrasonic transducer among the ultrasonic transducers relative to the drive signal supplied to a first ultrasonic transducer among the ultrasonic transducers. The second ultrasonic transducer is located in a position in which a traveling direction of a combined wave front of a first combined wave is aligned with a frontal direction, the first combined wave being formed by combining the ultrasonic waves generated by each of the first ultrasonic transducer and the second ultrasonic transducer, wherein the position is more frontward in the frontal direction of the first ultrasonic transducer than the first ultrasonic transducer. 1. An ultrasonic generator comprising:a plurality of ultrasonic transducers each configured to generate an ultrasonic wave; anda drive unit configured to supply a drive signal generating the ultrasonic wave to each of the ultrasonic transducers, and configured to change phase of the drive signal supplied to a second ultrasonic transducer among the ultrasonic transducers relative to the drive signal supplied to a first ultrasonic transducer among the ultrasonic transducers, whereinthe second ultrasonic transducer is located in a position in which a traveling direction of a combined wave front of a first combined wave is aligned with a frontal direction, the first combined wave being formed by combining the ultrasonic waves generated by each of the first ultrasonic transducer and the second ultrasonic transducer, wherein the position is more frontward in the frontal direction of the first ultrasonic transducer than the first ultrasonic transducer.2. The ...

Layer for inducing varying delays in ultrasonic signals propagating in ultrasonic sensor

An apparatus includes an ultrasonic transmitter, an ultrasonic receiver, and an acoustic delay gradient layer disposed in an acoustic path between the ultrasonic transmitter and the ultrasonic receiver. The acoustic delay gradient layer is configured to cause a reflection from a platen interface of the transmitted ultrasonic signal to reach the first receiver region at a first time and the reflection from the platen interface of the transmitted ultrasonic signal to reach the second receiver region at a second time that is different from the first time. The apparatus can further include a controller configured to set for a first region or portion of the receiver, a first range gate window (RGW). The controller is also configured to set, for a second region or portion of the receiver, a second RGW, and to establish a first temporal delay between the first RGW and the second RGW.

PORTABLE ULTRASOUND IMAGING PROBE INCLUDING A TRANSDUCER ARRAY

A portable ultrasonic imaging probe that is adapted to connect to a host computer via a passive interface cable. The probe includes an array of ultrasound transducers, a high voltage pulser for energizing transducers to emit an ultrasound pulse, analog signal processing circuitry that combines echoes detected by transducers into a single analog echo signal, am analog-to-digital converter that converts the analog echo signal into a digital echo signal; and interface circuitry that transfers the digital echo signal across the passive interface cable to the host computer. 1. A portable ultrasound imaging probe comprising:a probe head mounted on the probe including an array comprising a plurality of ultrasound transmitting ultrasound transducers (Tx transducers) and a plurality of ultrasound receiving ultrasound transducers (Rx transducers);a high voltage (HV) pulser within the probe;an analog summing amplifier within the probe;a plurality of transmit (Tx) switches within the probe, wherein each of the plurality of Tx switches connects the HV pulser and a different one of the plurality of Tx transducers;a plurality of receive (Rx) switches within the probe, wherein each of the plurality of Rx switches connects a different one of the plurality of Rx transducers to the analog summing amplifier;wherein the plurality of Tx switches is not connected to the plurality of Rx transducers, and the plurality of Rx switches is not connected to the plurality of Tx transducers whereby the Rx transducers are never used to emit ultrasound;a controller within the probe and coupled to the plurality of Tx switches and plurality of Rx switches;wherein the controller is configured to selectively close the Tx switches to connect transmit sets of the Tx transducers to the HV pulser including a first transmit set of the transmit sets of the Tx transducers at a first transmit time, a second transmit set of the transmit sets of the Tx transducers at a second transmit time, and a third transmit ...

ULTRASOUND TRANSDUCER AND SYSTEM

Some embodiments of the invention relate to an applicator for applying ultrasound energy to a tissue volume, comprising: an array comprising a plurality of ultrasound transducers, the transducers arranged side by side, the transducers configured to emit unfocused ultrasound energy suitable to thermally damage at least a portion of the tissue volume, each of the transducers comprising a coating thin enough so as not to substantially affect heat transfer via the coating to the tissue; and 1. An ultrasound transducer , comprising:a piezo element comprising top and bottom electrodes;an electrically conductive element in contact with said top electrode;a substrate layer on which said bottom electrode is mounted, said substrate layer comprising no more than 10% electrically conductive material in volume disposed within said substrate, said electrically conductive material sufficient for conducting electrical current to said bottom electrode.2. The ultrasound transducer according to claim 1 , wherein said substrate layer comprises at least 10 electrically conductive elements dispersed in an electrically insulating matrix claim 1 , such that at least 90% of a surface area of said bottom electrode is in contact with said electrically insulating matrix claim 1 , and less than 10% of a surface area of said bottom electrode is in contact with said electrically conductive elements; said less than 10% distributed across a total surface area of said bottom electrode.3. The transducer according to claim 1 , wherein said substrate has a thickness smaller than 100 microns.4. The transducer according to claim 1 , wherein said substrate is mounted on an electrically conductive layer claim 1 , said electrically conductive layer mounted on an isolating layer claim 1 , and said isolating layer is mounted on a base.5. The transducer according to claim 2 , wherein said 10% of said surface area contacting said electrically conductive elements is in the form of a plurality of contact points ...

ACOUSTIC TRANSDUCER DEVICE COMPRISING A PIEZO SOUND TRANSDUCER AND AN MUT SOUND TRANSDUCER, METHOD OF OPERATING SAME, ACOUSTIC SYSTEM, ACOUSTIC COUPLING STRUCTURE, AND METHOD OF PRODUCING AN ACOUSTIC COUPLING STRUCTURE

An acoustic transducer device includes a piezo sound transducer configured to emit, on the basis of a control signal, a first sound wave in a radiation direction. The acoustic transducer device includes an MUT sound transducer configured to provide an output signal on the basis of a second sound wave received from a receive direction. 1. An acoustic transducer device comprising:a piezo sound transducer configured to emit a first sound wave in a radiation direction on the basis of a control signal; andan MUT sound transducer configured to provide an output signal on the basis of a second sound wave received from a receive direction;wherein the piezo sound transducer and the MUT sound transducer are arranged such that the MUT sound transducer encloses the piezo sound transducer when a location of the piezo sound transducer and a location of the MUT sound transducer are projected into a plane; andwherein an internal dimension of the MUT sound transducer is larger than an external dimension of the piezo sound transducer.2. The acoustic transducer device as claimed in claim 1 , wherein the MUT sound transducer is arranged along the radiation direction of the piezo sound transducer.3. The acoustic transducer device as claimed in claim 1 , wherein the piezo sound transducer and the MUT sound transducer are acoustically coupled to each other claim 1 , so that the MUT sound transducer is directly excited by emission of the first sound wave on the part of the piezo sound transducer.4. The acoustic transducer device as claimed in claim 1 , further comprising an acoustic coupling element configured to acoustically couple the piezo sound transducer and the MUT sound transducer.5. The acoustic transducer device as claimed in claim 4 , wherein the acoustic coupling element is an acoustic lens configured to influence propagation of the first sound wave claim 4 , the MUT sound transducer being mechanically connected to the acoustic lens claim 4 , so that the first sound wave emitted ...

Ultrasonic Transducer with a Sealed 3D-Printed Mini-Horn Array

A flow meter includes a pair of ultrasonic transducers. Each transducer includes a housing, a piezoelectric crystal disposed within the housing, and a mini-horn array coupled to the housing. The mini-horn array, which may be formed via a 3D printing technique, includes an opening-free enclosure, a closed cavity inside the enclosure, and a plurality of horns enclosed within the closed cavity. The horns include a horn base portion adjacent to a proximal end surface of the cavity and a horn neck portion that extends from the base portion in a direction away from the piezoelectric crystal and towards a distal end surface of the cavity. The horn neck portions are separated by spaces within the cavity, wherein the spaces between the horn necks may be filled with powder. 1. An ultrasonic flow meter , comprising:a meter body;a passage in the meter body for conducting flow of a fluid stream that is to be metered; a transducer housing;', 'a piezoelectric crystal disposed within the transducer housing; and', an opening-free enclosure;', 'a closed cavity inside the enclosure, the cavity having a proximal end surface and a distal end surface; and', 'a plurality of horns enclosed within the closed cavity, wherein the horns include a horn base portion adjacent to the proximal end surface of the cavity and a horn neck portion that extends from the horn base portion in a direction away from the piezoelectric crystal and towards the distal end surface of the cavity, wherein the horn neck portions are separated by spaces within the cavity., 'a mini-horn array coupled to the transducer housing, the mini-horn array comprising], 'a pair of ultrasonic transducers coupled to the meter body, the transducers configured to form a chordal path across the passage between the transducers, each transducer comprising2. The ultrasonic flow meter of further comprising powder in the cavity between the horns.3. The ultrasonic flow meter of wherein the enclosure comprises a first material and wherein ...

ULTRASONIC PROBE AND ULTRASONIC IMAGING APPARATUS

Provided are an ultrasonic probe that controls temperature of a piezoelectric layer using a thermoelectric element and an ultrasonic imaging apparatus having the same. The ultrasonic probe includes: the piezoelectric layer that vibrates and generates ultrasonic waves if a current is supplied to the piezoelectric layer; and a thermoelectric element that contacts one surface of the piezoelectric layer and controls the temperature of the piezoelectric layer if a current is supplied to the thermoelectric element. 1. An ultrasonic probe comprising:a piezoelectric layer that vibrates and generates ultrasonic waves if a current is supplied to the piezoelectric layer; anda thermoelectric element that contacts one surface of the piezoelectric layer and controls temperature of the piezoelectric layer if a current is supplied to the thermoelectric element.2. The ultrasonic probe of claim 1 , wherein the thermoelectric element comprises:a heat dissipation plate that is disposed on one surface of the thermoelectric element and dissipates heat toward a contact surface between the piezoelectric layer and the thermoelectric element; anda heat absorption plate that is disposed at an opposite side to the heat dissipation plate and absorbs heat of the contact surface.3. The ultrasonic probe of claim 2 , wherein the thermoelectric element contacts the piezoelectric layer through the heat dissipation plate and heats the piezoelectric layer.4. The ultrasonic probe of claim 2 , wherein the thermoelectric element contacts the piezoelectric layer through the heat absorption plate and cools the piezoelectric layer.5. The ultrasonic probe of claim 1 , wherein the piezoelectric layer and the thermoelectric element share a signal electrode through which a current is supplied to the piezoelectric layer and the thermoelectric element claim 1 , respectively.6. The ultrasonic probe of claim 1 , wherein the piezoelectric layer and the thermoelectric element share a ground electrode.7. The ultrasonic ...

Integrated ultrasonic transducers

Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

MEMS-SWITCHED ULTRASONIC TRANSDUCER ARRAY WITH IMPROVED RELIABILITY

Various approaches for improving reliability in an ultrasound system having transducer elements, phase transmission lines, and a switch matrix having beamforming switches for connecting the phase transmission lines to the transducer elements involve operating the beamforming switches to avoid “hot” switching as the activation pattern of the transducers changes. 1. A method of improving reliability in an ultrasound system comprising (i) a plurality of transducer elements , (ii) a phase generator connected to a plurality of phase transmission lines , and (iii) a switch matrix comprising a plurality of beamforming switches for switchably connecting various ones of the phase transmission lines to the transducer elements , each of the transducer elements being associated with a set of beamforming switches each connected to a different phase transmission line , wherein some of the beamforming switches are open and some of the beamforming switches are closed in accordance with an initial switch activation pattern , the method comprising:(a) reducing the differential voltage between the phases at the phase generator;(b) reducing the differential voltage between the phases at near the beamforming switches; and(c) following steps (a) and (b), altering the initial switch activation pattern.2. The method of claim 1 , wherein the differential voltage in step (a) is reduced below a first predetermined threshold corresponding to a voltage closer to zero than ±0.5V.3. The method of claim 1 , wherein the differential voltage in step (b) is reduced below a second predetermined threshold corresponding to a voltage closer to zero than ±0.5V.4. The method of claim 1 , further comprising a step of pausing after performing steps (a) and (b) and before performing step (c).5. The method of claim 4 , wherein the pausing step has a duration determined by at least one of an environmental condition or a sonication parameter.6. The method of claim 5 , wherein the environmental condition is an ...

ULTRASONIC TRANSDUCER, ULTRASONIC PROBE, AND ULTRASONIC EXAMINATION DEVICE

An ultrasonic transducer includes a substrate, a supporting film disposed on the substrate, and a piezoelectric element disposed on the supporting film. The substrate includes an opening. The piezoelectric element is disposed on an area that overlaps the opening in a plan view in a thickness direction of the substrate. A thickness of the supporting film at an area that overlaps the piezoelectric element in a plan view of the supporting film is smaller than a thickness of the supporting film at a different area different from the area that overlaps the piezoelectric element. 1. An ultrasonic transducer comprising:a substrate;a supporting film disposed on the substrate; anda piezoelectric element disposed on the supporting film,the substrate including an opening,the piezoelectric element being disposed on an area that overlaps the opening in a plan view in a thickness direction of the substrate,a thickness of the supporting film at an area that overlaps the piezoelectric element in a plan view of the supporting film being smaller than a thickness of the supporting film at a different area different from the area that overlaps the piezoelectric element.2. The ultrasonic transducer according to claim 1 , whereinthe supporting film at an area that overlaps the opening includes a portion a thickness of which gradually increases as the portion approaches an area in which the supporting film overlaps the substrate in the plan view.3. The ultrasonic transducer according to claim 1 , whereinthe supporting film includes a surface facing the opening, and the surface has a curved concave surface.4. The ultrasonic transducer according to claim 1 , whereinthe supporting film at the area that overlaps the opening has a uniform thickness portion a thickness of which is uniform at an outer edge portion of the area that overlaps the opening.5. The ultrasonic transducer according to claim 4 , whereinthe uniform thickness portion is arranged along a whole circumference of the area that ...

PIEZOELECTRIC ELEMENT, PIEZOELECTRIC MODULE, ELECTRONIC APPARATUS, AND PIEZOELECTRIC ELEMENT MANUFACTURING METHOD

A receiving transducer includes: a flexible portion; a piezoelectric film provided on the flexible portion; a first electrode provided between a first surface of the flexible portion, on which the piezoelectric body is provided, and a second surface of the piezoelectric film that is a surface not facing the flexible portion; and a second electrode that is provided between the first and second surfaces and that faces the first electrode with a gap interposed therebetween in plan view as viewed from the thickness direction of the flexible portion. 1. A piezoelectric element , comprising:a flexible film;a piezoelectric body provided on the flexible film;a first electrode provided between a first surface of the flexible film, on which the piezoelectric body is provided, and a second surface of the piezoelectric body not facing the flexible film; anda second electrode that is provided between the first and second surfaces and that faces the first electrode with a first gap interposed therebetween in plan view as viewed from a thickness direction of the flexible film.2. The piezoelectric element according to claim 1 ,wherein the first and second electrodes are provided between the flexible film and the piezoelectric body.3. The piezoelectric element according to claim 1 ,wherein the first and second electrodes are embedded in the piezoelectric element.4. The piezoelectric element according to claim 1 ,wherein the first and second electrodes are provided within a plane parallel to the first surface.5. The piezoelectric element according to claim 1 ,wherein the first electrode has a first end surface facing the second electrode,the second electrode has a second end surface facing the first electrode, andthe first and second end surfaces are parallel to each other.6. The piezoelectric element according to claim 1 , further comprising:at least one or more intermediate electrodes that are provided between the first and second electrodes in plan view and that face each of the ...

ULTRASONIC DEVICE, ULTRASONIC PROBE, ELECTRONIC EQUIPMENT, AND ULTRASONIC IMAGING APPARATUS

Provided is an ultrasonic device including: an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body; an acoustic lens secured via an acoustic matching layer to a surface, formed with the ultrasonic elements, of the ultrasonic element array substrate; and a support member secured to a surface, opposite to the surface formed with the ultrasonic elements, of the ultrasonic element array substrate, wherein the support member is formed to have a larger area, in plan view in the thickness direction of the ultrasonic element array substrate, and a higher bending stiffness than the ultrasonic element array substrate, and the acoustic lens is formed to have a lower bending stiffness than the ultrasonic element array substrate. The above-described ultrasonic device further includes an acoustic matching layer filled between the ultrasonic element array substrate and the acoustic lens. 1. An ultrasonic device comprising:an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body and perform at least one of transmission and reception of ultrasound;an acoustic lens secured via an acoustic matching layer to a surface, formed with the ultrasonic elements, of the ultrasonic element array substrate, the acoustic lens having a lens portion that focuses the ultrasound; anda support member secured to a surface, opposite to the surface formed with the ultrasonic elements, of the ultrasonic element array substrate, whereinthe support member is formed to have a larger area, in plan view in the thickness direction of the ultrasonic element array substrate, and a higher bending stiffness than the ultrasonic element array substrate, andthe acoustic lens is formed to have a lower bending stiffness than the ultrasonic element array substrate.2. The ultrasonic device according to claim 1 , further comprising:an acoustic matching layer filled between the ultrasonic element ...

Gas Matrix Piezoelectric Ultrasound Array Transducer

A phased ultrasonic transducer and method for transmitting sound or ultrasound through a gaseous medium into a solid spectrum with ultrasound beam steering and focusing. 1. A phased ultrasonic transducer for continuous monitoring comprising:a plurality of individual piezoelectric rods, wherein the individual piezoelectric rods have a top and a bottom and are separated from one another by a predetermined distance;a printed circuit board having electrodes printed on the printed circuit board, wherein the electrodes are divided into segments such that each segment is connected to an individual piezoelectric rod of the plurality of individual piezoelectric rods;a common conductive electrode plate connected to the bottom of the plurality of individual piezoelectric rods;a acoustic impedance matching layer is bonded to the common conductive electrode plate such that the common conductive electrode plate is between the acoustic impedance matching layer and the plurality of individual piezoelectric rods; anda multipin connector is connected to an end of the printed circuit board, wherein the multipin connector is connected to an ultrasound excitation and signal amplification electronic system.2. The phased ultrasonic transducer of claim 1 , wherein the plurality of individual piezoelectric rods are separated by nonconductive material.3. The phased ultrasonic transducer of claim 1 , wherein the combination of an individual piezoelectric rod and a segment of electrodes is a channel.4. A method for creating an ultrasonic transducer for continuous monitoring claim 1 , the method comprising:fabricating, by a 3D printing method, a plurality of individual piezoelectric rods, electrodes, and matching layers, whereinthe plurality of individual piezoelectric rods have a top and a bottom and are separated from one another by a predetermined distance;the electrodes are printed on a printed circuit board;the electrodes are divided into segments such that each segment is connected to an ...

PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCERS USING TWO BONDED SUBSTRATES

A piezoelectric micromachined ultrasound transducer (PMUT) is disclosed. The PMUT consists of a flexural membrane that is piezoelectrically actuated. These membranes are formed on a first substrate that is bonded to a second substrate. The two substrates are separated by an air gap to allow the PMUT to vibrate. Several methods for joining the two substrates are described. 1. A device , comprising:a first substrate containing one or more piezoelectric micromachined ultrasound transducers (PMUTs) that include one or more electrodes at a front side of the first substrate, wherein one or more openings formed through the first substrate from a front side thereof to a backside thereof are configured to act as resonant tubes for the one or more PMUTs;a second substrate having one or more electrical connections on a surface thereof, wherein the first substrate is bonded with the front side facing the second substrate such that the back side of the first substrate faces away from the second substrate, wherein the first and second substrates are bonded such that there is a gap between the PMUTs on the first substrate and the surface of the second substrate, and wherein the one or more electrodes on the front side of the first substrate electrically contact the electrical connections on the surface of the second substrate independent of any connections through the first substrate from the front side of the first substrate to the back side of the first substrate.2. The device of claim 1 , wherein the first substrate is bonded to a second substrate using a conductive bonding layer that provides both a mechanical connection between the first and second substrates and an electrical connection between the one or more electrodes on the front side of the first substrate and the one or more corresponding electrical connections on the surface of the second substrate.3. The device of claim 2 , wherein the bonding layer is formed using solder balls claim 2 , gold-to-gold compression ...

DIFFERENTIAL ULTRASONIC TRANSDUCER ELEMENT FOR ULTRASOUND DEVICES

Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic transducer element may be coupled to an integrated circuit that is configured to operate the differential ultrasonic transducer element in one or more modes of operation, such as a differential receive mode, a differential transmit mode, a single-ended receive mode, and a single-ended transmit mode. 1. An ultrasound device , comprising: a differential receive mode;', 'a differential transmit mode;', 'a single-ended receive mode; and', 'a single-ended transmit mode; and, 'a differential capacitive micromachined ultrasonic transducer (CMUT) element operable in each mode of the group comprising select a first mode from the group; and', 'operate the differential CMUT element in the first mode., 'an integrated circuit coupled to the differential CMUT element and configured to2. The ultrasound device of claim 1 , wherein the integrated circuit is configured to operate the differential CMUT element in the differential receive mode and the differential transmit mode.3. The ultrasound device of claim 1 , wherein the differential CMUT element is integrated into an ultrasonic transducer array and wherein the integrated circuit and the ultrasonic transducer array are formed on a single semiconductor die.4. The ultrasound device of claim 1 , wherein:the differential CMUT element comprises a first CMUT that is configured to be biased with a first bias voltage and a second CMUT that is configured to be biased with a second bias voltage.5. The ultrasound device of claim 4 , wherein the integrated circuit is configured claim 4 , when operating the differential CMUT element in the differential transmit mode claim 4 , to:cause the first bias voltage and the second bias voltage to have opposite polarities; anddrive the first CMUT and the second CMUT with ...

Ultrasonic Device And Ultrasonic Measuring Apparatus

An ultrasonic device includes: a vibration film provided with a vibration region that is vibratable by a vibration element; and a damper layer that is provided to cover the vibration region of the vibration film. The damper layer has a thickness dimension of 13 μm or larger and 25 μm or smaller.

ULTRASONIC PROBE

According to one embodiment, an ultrasonic probe includes a plurality of piezoelectric elements, a substrate, an intermediate layer and a backing member. A plurality of piezoelectric elements are arranged at a predetermined pitch. A substrate is arranged on a back surface of the plurality of piezoelectric elements and includes signal lines for signal transmission with the plurality of piezoelectric elements and a wiring pattern for extracting a signal outside of the probe. An intermediate layer is arranged on a back surface of the substrate and in which a plurality of layer members are arranged in an array direction of the piezoelectric elements at the predetermined pitch. A backing member is arranged on a back surface of the intermediate layer. 1. An ultrasonic probe comprising:a plurality of piezoelectric elements that are arranged at a predetermined pitch;a substrate that is arranged on a back surface of the plurality of piezoelectric elements and includes signal lines for signal transmission with the plurality of piezoelectric elements and a wiring pattern for extracting a signal outside of the ultrasonic probe;an intermediate layer that is arranged on a back surface of the substrate and in which a plurality of layer members are arranged in an array direction of the piezoelectric elements at the predetermined pitch; anda backing member that is arranged on a back surface of the intermediate layer.2. The probe according to claim 1 , wherein the layer member is made of a same material as a material of the backing member.3. The probe according to claim 1 , wherein the layer member is made of a same material as a material of the substrate.4. The probe according to claim 1 , wherein the substrate includes:a first layer that is joined to the back surface of the plurality of piezoelectric elements and separated at the predetermined pitch as electrodes of the piezoelectric elements; anda second layer that is arranged on a back surface of the first layer and on which a ...

Ultrasonic device and manufacturing method thereof, electronic equipment, and ultrasonic image device

An ultrasonic device includes a substrate, an acoustic adjustment layer, an acoustic lens and a structural member. The substrate has an element array including a plurality of thin film ultrasonic transducer elements arranged in an array form. The acoustic adjustment layer covers the element array. The acoustic lens is arranged above the acoustic adjustment layer. The structural member is in contact with the acoustic lens and fixed to the substrate. The structural member has a modulus of rigidity greater than a modulus of rigidity of the acoustic lens.

ULTRASONIC DEVICE, METHOD FOR MANUFACTURING THE SAME, ELECTRONIC DEVICE AND ULTRASONIC IMAGING DEVICE

An ultrasonic device includes a substrate having a first opening, a second opening and a wall part partitioning the first opening and the second opening; a first vibration film and a second vibration film which close the first opening and the second opening respectively; a first piezoelectric element and a second piezoelectric element which are formed on surfaces of the first vibration film and the second vibration film opposite to the substrate; an acoustic matching layer which is disposed within the first opening and the second opening so as to come into contact with the first vibration film and the second vibration film. 1. A ultrasonic device comprising:a substrate which has a first opening, a second opening and a wall part partitioning the first opening and the second opening,a first vibration film and a second vibration film which close the first opening and the second opening respectively,a first piezoelectric element and a second piezoelectric element which are respectively formed on surfaces of the first vibration film and the second vibration film opposite to the substrate, andan acoustic matching layer which is disposed within the first opening and the second opening so as to be in contact with the first vibration film and the second vibration film.2. The ultrasonic device according to claim 1 , wherein a plurality of the first openings are disposed in a row claim 1 , and wherein a plurality of the second first openings are disposed in a row parallel to the arrangement of the first openings.3. The ultrasonic device according to claim 1 , wherein the wall part has a first wall part with a first height in a thickness direction of the substrate and a second wall part with a second height that is larger than the first height.4. The ultrasonic device according to claim 3 , further provided with an acoustic lens which is in contact with the second wall part and coupled to the acoustic matching layer.5. The ultrasonic device according to claim 3 , wherein the ...

METHOD FOR ELECTRICALLY CONTACTING A PIEZOELECTRIC CERAMIC

A method for electrically contacting a piezoelectric ceramic includes: providing the piezoelectric ceramic having electrodes for electrically contacting the piezoelectric ceramic and having a flexible, electrically conductive film; producing a composite by applying the flexible, electrically conductive film at least partially to an electrode of the piezoelectric ceramic; forming a durable, electrically conductive connection between the flexible, electrically conductive film and the electrode of the piezoelectric ceramic. Also a sound transducer, as well as a sound transducer array produced using the method for electrically contacting a piezoelectric ceramic. 110-. (canceled)11. A method for electrically contacting a piezoelectric ceramic , the method comprising:providing the piezoelectric ceramic having electrodes for electrically contacting the piezoelectric ceramic and having a flexible, electrically conductive film;producing a composite by applying the flexible, electrically conductive film at least partially to an electrode of the piezoelectric ceramic;forming a durable, electrically conductive connection between the flexible, electrically conductive film and the electrode of the piezoelectric ceramic.1210. The method of claim , wherein , to form the composite , a conductive adhesive or a solder paste is applied between the flexible , electrically conductive film and the electrode of the piezoelectric ceramic.1310. The method of claim , wherein , with a thermode , heat and/or pressure is introduced into the composite to produce the durable , electrical connection between the electrode of the piezoelectric ceramic and the flexible , electrical film.14. The method of claim 13 , wherein the thermode has at least one thermode head having at least one arbitrarily shaped contact surface that is subdividable and that introduces heat and/or pressure into the composite.1520244626. The method of claim 13 , wherein the thermode head () includes a heating () for introducing ...