ПОПОЛНЯЕМЫЙ БЕССВИНЦОВЫЙ ПРИПОЙ И СПОСОБ РЕГУЛИРОВАНИЯ КОНЦЕНТРАЦИИ МЕДИ И НИКЕЛЯ В ВАННЕ ДЛЯ ПАЙКИ

Изобретения могут быть использованы для регулирования концентрации Cu и Ni в ванне для пайки, резко меняющейся в зависимости от особенностей следующего за пайкой процесса. В ванну для пайки погружением помещают деталь, представляющую собой печатную плату с покрытием из медной пленки или медный проволочный вывод, или медный ленточный вывод, которую после процесса пайки подвергают обработке с использованием воздушного ножа или штампа. До того как концентрация Cu в ванне с припоем превысит контрольное значение, а концентрация Ni снизится относительно контрольного значения, в ванну подают пополняющий бессвинцовый припой, состоящий в основном из Sn и содержащий по меньшей мере Ni в количестве от 0,01 мас.% до 0,5 мас.%. После загрузки бессвинцового припоя с данным составом концентрация припоя в ванне для пайки, которая резко изменилась в результате последующей обработки, быстро возвращается в необходимый интервал, что позволяет осуществлять пайку без замены припоя. 2 н. и 3 з.п. ф-лы, 2 ил.

УСТАНОВКА НИЗКОТЕМПЕРАТУРНОЙ ПАЙКИ В ЖИДКОМ ТЕПЛОНОСИТЕЛЕ

Изобретение может быть использовано при низкотемпературной пайке в жидком теплоносителе деталей мягкими припоями, в частности каркасов для корпусов микросборок СВЧ-диапазона. Камера каждой из двух ванн устройства выполнена в виде куба и размещена в кожухе с теплоизоляцией. Устройства подогрева расположены по одному на задней и передней стенке каждой камеры и два - на дне. На боковых стенках камеры ванны для предварительного подогрева деталей расположены форсунки для подачи в нее азота. В камеру ванны для пайки залит жидкий теплоноситель. Камеры размещены в корпусе установки, закрытом герметичной верхней крышкой с подсветкой. Передняя стенка корпуса выполнена прозрачной с возможностью перемещения по вертикали. К устройству конденсации прикреплена труба, подключенная через фланец к вентиляции и закрытая емкостью для сбора конденсата теплоносителя, соединенной отводом с камерой пайки. Техническим результатом изобретения является повышение качества пайки и, как следствие, надежности соединения ...

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

Procedure and device for simultaneous soldering of several soldered connections distributed over a larger surface

SOLDERING PLANT WITH SOLDERING MODULES AND AT LEAST A MOBILE ONE AND A REPLACEABLE IN A SOLDERING MODULE APPLICABLE ONE SOLDERING STATION; APPROPRIATE CONDITION BY STATION

LOETMASCHINE.

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

Gas shrouded wave improvement

METHODS AND APPARATUS FOR SOLDERING

PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MANUFACTURE OF ANODES, USED IN THE PROCESSES OF ELECTRO-OBTAINING OR ELECTRO-REFINING OF METALS

WAVE-SOLDERING USING A SHROUD FOR A GAS

A cover plate (28) extends over at least part of a solder reservoir (34) and has a slot (30) for a solder wave (22) to extend up above the cover plate (28). Shield gas is supplied under the cover plate (28) to blanket the solder wave (22) and prevent air from contacting the solder wave (22) and circuit boards (44) passing through the solder wave (22). Circuit boards (44) are generally supported by conveyor fingers (41, 42) at side edges and the fingers (41, 42) pass through the solder wave (22). End shrouds (50, 64) are provided at both ends of the solder wave (22) to prevent the entry of air through the conveyor fingers (41, 42) and to ensure that the side edges of the circuit board (44) are uniformly blanketed by shield gas directed to the side edges passing up through the slot (30) in the cover plate (28). The under surface, front edge back edge and side edges of a circuit board (44) are therefore uniformly blanketed by shield gas as the board passes through a solder wave (22).

Verfahren zur Herstellung von Konservendosenmänteln mit Längsfalz ohne Verwendung von Zinn.

Verfahren zum Herstellen einer Bohrerspitze und nach diesem Verfahren hergestellte Bohrerspitze

Verfahren zum vakuumdichten Verlöten metallischer Teile miteinander, insbesondere von Teilen von Gehäusen für Halbleiterbauelemente

VERFAHREN ZUM VERSEHEN DER ANSCHLUSSSTELLEN VON ANSCHLUSSELEMENTEN MIT DOSIERTEN LOTMENGEN.

Verfahren und Vorrichtung zum gleichzeitigen Verlöten mehrerer Lötstellen

Verfahren zum Anbringen von Anschlussdrähten an elektrischen Einzelteilen mit einem aus dielektrischem oder halbleitendem Material bestehenden, zylindrischen Körper

Soft soldering aluminium and light metal - alloys

Components to be soldered are contained in a receptacle containing soft solder, whereby the surfaces to be soldered are partly or entirely formed in the molten solder. Use relates in particular to radiator and heat exchanger parts.

Verfahren zum Tauchlöten von Kleinteilen, insbesondere Drähten, und Tauchlötgerät zur Ausführung des Verfahrens

VERFAHREN ZUM BESTUECKEN EINER SCHICHTSCHALTUNG MIT BAUTEILEN, INSBESONDERE MIT KERAMIK-KLEINKONDENSATOREN, MITTELS TAUCHLOETEN, SOWIE GEMAESS DEM VERFAHREN BESTUECKTE SCHICHTSCHALTUNG.

Process of mechanical welding fast

Sophisticated method of welding for apparatuses functioning at high temperatures

Manufactoring process of electricals appliance with printed circuits

Process and device for the manufacture of beams of heat exchangers, in particular of radiators of cooling

METHOD OF SOLDERING A METAL TERMINAL TO A SEMICONDUCTOR BODY AND THE COMPONENT SO-FORMED

Method of affixing surface enlarging members in the form of coherent, transversally corrugated metal strips to elongate metal basic profiles

Solder joint and method for forming solder joint

APPARATUS AND METHOD FOR SOLDERING IN MANUFACTURING SYSTEM OF COMBI-TYPE IC CARD

NICKEL-CHROMIUM-PHOSPHOROUS BRAZING ALLOYS

Trépan et son procédé de brasage

METHOD AND DEVICE FOR CLEANING A SOLDERING NOZZLE

The invention relates to a method and a device for cleaning a soldering nozzle and to a soldering device. Impurities on the soldering nozzle are removed by ultrasounds of an ultrasonic source leading to a thorough and simple cleaning.

SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH

A solder free from lead for additional supply to control the Cu concentration and Ni concentration in solder bath which sharply vary depending upon the particularity of post-process; and a method of regulating the Cu concentration and Ni concentration in solder bath under such particular conditions. A lead-free solder composed mainly of Sn wherein at least Ni is contained in an amount of 0.01 to 0.5 mass% is supplied to a solder bath employed for a work of printed board, copper lead wire or copper tape furnished with a copper foil to be processed by an air knife or a die after soldering. By charging of the lead-free solder of this composition, the solder concentration in solder bath having been sharply changed by post-process HASL unit or die is rapidly returned into an appropriate concentration range.

JOINING METHOD AND REFLOW APPARATUS

A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Soldering method for printed circuit board

This invention relates to a method of soldering electronic components for a printed circuit board by dipping the printed circuit board into a molten solder inside a soldering bath. When the printed circuit board is dipped into the molten solder inside the soldering bath, it is dipped together with a member that attracts the molten solder, and when the printed circuit board is pulled up from the molten solder, it is pulled up while the edge of the member keeps contact with a solder connection portion of the printed circuit board. After the printed circuit board is pulled from the molten solder, the edge of the member is separated from the printed circuit board to remove any excessive solder adhering to the connection portion by the surface tension of the solder.

Soldering device

A soldering device adaptable to dipping method for preventing neighboring leads (L) from being mixed in molten lead (Pb) even though spaces between leads (L) of parts mounted to a PCB substrate (P) are relatively narrow, the device having a lead tub where molten lead is filled up to an upper end thereof and maintained at a predetermined temperature, the device comprising a receiving plate disposed at an upper surface of the lead tub and formed with a receiving unit for soldered parts of PCB substrate to contact the molten lead, a fixing unit mounted at the receiving plate for the PCB substrate to be accommodated with, detached from and fixed to the receiving unit, and an elevation arranged to elevate the receiving plate horizontally and slantingly.

Prevention of dripping of material for material injection

An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.

Vorrichtung zur Loetung gedruckter Schaltungen durch Schlepploeten

Vorrichtung für das Verzinnen von abisolierten Kabelenden

Herstellung von Waermeaustauschkoerpern

Maschine zum Einsetzen von Kupfermuttern in ein Werkstück

VERFAHREN ZUM TAUCHBELOTEN VON LEITERPLATTEN

Vorrichtung und Verfahren zum korrektiven Löten

Die Erfindung bezieht sich auf ein Verfahren zum Löten eines verschiedene Lötverbindungen aufweisenden Gegenstands, welches Verfahren die nachfolgenden Schritte umfaßt: das maschinelle Löten von wenigstens einem Teil der gelöteten Verbindungen; die visuelle Beurteilung der gelöteten Verbindungen und das korrektive Löten der visuell beurteilten Lötverbindungen, die nicht den gestellten Qualitätsanforderungen entsprechen, wobei die visuelle Beurteilung mittels einer Videokamera und eines mit der Videokamera verbundenen Rechners erfolgt, in dem die Beurteilungskriterien für die Lötverbindungen gespeichert sind. DOLLAR A Die Erfindung betrifft ebenfalls eine Vorrichtung zur Durchführung eines solchen Verfahrens.

Verfahren zum gegenseitigen elektrischen Kontaktieren wenigstens eines Wicklungsdrahts und einer Platine sowie Aktuator für ein Kraftfahrzeug

A drill bit and method of brazing a cutting insert in a slot formed in the working end of a drill bit body

... 958,384. Making drills; brazing. TIMKEN ROLLER BEARING CO. Nov. 22, 1960 [March 21, 1960], No. 40081/60. Headings B3A, B3C and B3R. In making a drill bit a cutting insert is brazed into a recess in a bit body. A bar is upset and machined to form a head 11, Fig. 1, with a threaded shank, a fluid passageway 18 opening to the bit face and four slots 22 each having an end wall 23 and inwardly tapering side walls 25 and with fingers 30, Fig. 5, extending outwardly from the edges of the slots. The bit and tungsten carbide inserts 35, Fig. 5, are cleaned, the slots and inserts are fluxed, the inserts are placed in the slots and fingers 30 are pressed against the inserts by an hydraulic press. The assembly is furnace or induction heated to brazing temperature and inverted, in a furnace, into a ceramic cup 64, Fig. 7, containing molten brazing metal which flows by capillarity between the inserts and slot walls. The bit may be of the tapered separable or of the integral type and a single insert may ...

A method of brazing composite material parts sealed with a silicon-based composition

Modular soldering apparatus

METHODS AND APPARATUS FOR MASS SOLDERING OF PRINTED CIRCUIT BOARDS

A fluid stream preferably air or other gases which may be heated, is directed onto a soldered board 20 immediately following deposition of molten solder onto the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream. The fluid is preferably directed by a nozzle 62 and the presence of a board 20 is detected by a photo-electric detection 74,78. ...

Improvements in or relating to processes for connecting wires to printed circuits

... 808,814. Making printed circuits; soldering. STANDARD TELEPHONES & CABLES Ltd. Dec. 30, 1955 [Dec. 31, 1954], No. 37414/55. Classes 83 (2) and 83 (4). In connecting an electrically conducting wire to a printed circuit formed on an insulating support, a hollow electrically conducting rivet having a hollow axial extension is fixed in the support for making electrical contact with the circuit, the extension being proud of one surface of the support, inserting the wire in the rivet so that a portion of the wire is in the extension and soldering the portion to the extension. A hollow rivet 1 with a slotted extension 10, a head 11 and an annular flange 2 is fixed in support 12 to be in contact with part 13 of a circuit etched from a copper plating. The rivet may be electrocopper-plated to the plating before the circuit is etched. The wires of components are held in such rivets by bending the slotted sides of the extensions and the support with components in position is located over a bath of ...

Improvements in or relating to the manufacture of heat exchange devices

... 567,286. Making heat exchangers. COLTMAN, J. L., and IMPERIAL CHEMICAL INDUSTRIES, Ltd. Oct. 1, 1941, No. 12704. [Classes 83 (ii) and 83 (iv)] Soldering.-Heat-exchange devices of the kind comprising a matrix of thin walled, tubular or plate - like elements are hard soldered by partially or completely immersing them in a bath of molten solder protected from oxidation by maintaining over the surface thereof a layer of non-oxidizing or reducing gas or mixture thereof. The gases may consist of nitrogen, hydrogen, cracked ammonia, or burnt coal gas preferably previously purified. The solder may consist of an alloy containing 50 per cent of silver, 15.5 per cent of copper, 16.5 per cent of zinc and 18 per cent of cadmium. Such solder is maintained at a temperature of 750-850‹ C. by burners 4 in an iron bath 2 with a brick surround 3 and flue 5. A ring pipe provided with a valve 9 has a number of downwardly directed jets 8 for projecting the gas against the surface of the molten solder. The gaseous ...

PREHEATED FLUX IN AUTOMATED SOLDERING PROCESSES

RADIATION PLUMB BOB CONTAINER

VERFAHREN ZUM VERBINDEN DURCH LÖTEN VON ZWEI TEILEN AUS THERMOSTRUKTURVERBUNDWERKSTOFF

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

PROCEDURE FOR THE REDUCTION OF METALLIC OXIDE POWDER AND ATTACHMENT OF IT ON A HEAT TRANSMISSION SURFACE AND HEAT TRANSMISSION SURFACE

AFFIXING SURFACE ENLARGING MEMBERS

Soldering alloy

SOLDERING ALLOY

A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. As shown in the Figure, molten solder alloy (10) is applied to the hard-to-wet material (18) with the application of ultrasonic energy (14) which removes coatings (20) such as tenacious surface oxides to leave the base material (18) which is readily wetted by the solder alloy (20).

Accumulator welding process

IMPROVEMENTS WITH THE TECHNIQUES OF WELDING, WITH A VIEW IN PARTICULAR TO IT REALIZATION OF CIRCUITS PRINT

PROCESS AND APPARATUS OF WELDING SERIES OF COMPONENTS GO UP ON PLATES HAS CIRCUITS PRINT

Process to weld or braze the ends of rollings up of an armature to the commutator segments

Process and apparatus for the welding of the bodies of limp metal using liquid welding

IMPROVED REFLOW DEVICE AND METHOD FOR BONDING THE SAME

METHOD FOR DIP-SOLDERING PRINTED CIRCUIT BOARDS

CENTRIFUGAL SOLDER EXTRACTOR TOOL AND METHOD

Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector (100) for connecting at least one wire or other terminus thereto where the electrical connector (100) has at least one electrical contact (104) with a metal coating thereon. The method includes the steps of applying molten solder to the electrical contact (104) whereby the coating dissolves into the molten solder to thereby create a molten coating -solder mixture and rotating the electrical connector (100) whereby the molten coating-solder mixture is removed from the electrical contact (104).

Dual additive soldering

Soldering with lead-free alloys is enhanced by use of two additives to a molten solder bath. One additive is an oxygen barrier fluid that floats on or envelops a bath. Another additive is an oxygen or metal oxide scavenger in the bath. Exemplary scavengers include metals with a higher free energy of oxide formation than oxide of tin, reducing gas, or an electrode immersed in the bath. The oxygen barrier may be an organic liquid, preferably polar in nature, which forms at least a monomolecular film over static surfaces of the bath. An exemplary soldering process is wave soldering of printed circuit boards.

Solder application method and apparatus

A method of applying solder includes providing a first roller and a second roller, where at least one of the first and second rollers has an outer surface comprising a solder wicking material. A metallic article is provided, the metallic article having a first side and a second side, and having an opening extending from the first side to the second side. The metallic article is dipped in solder, where the dipping forms an initial coating of solder on the metallic article. After the dipping, the metallic article is fed between the first and second rollers. The wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers.

Soldering apparatus and soldering method

A soldering apparatus 100 including: a chamber 120 configured to contain solder and include an opening 122 configured to discharge the solder in a bottom surface or a side surface; a pump 140 configured to transport the solder to the chamber 120; and an inner bath 160 configured to communicate with the opening 120 and perform soldering using the solder fed through the opening 120.

Dross removal

This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MANUFACTURE OF ANODES, USED IN THE PROCESSES OF ELECTRO-OBTAINING OR ELECTRO-REFINING OF METALS

The invention describes the assembly and construction method for anodes used in the electrolytic processes. It is made up of a copper bus bar () where the plate shall be inserted (). It has a rough surface previously milled to form a groove (), which is, approximately, 0.12 mm thicker than the thickness of the plate; approximately, 19 mm deep. Such copper bus bar () is first subject to a process mechanical/chemical or electrochemical process aimed to significantly increase its roughness, between 0.01 mm and 0.5 mm, preferably 0.15 mm, by using mechanical processes, such as sand blasting or grinding, preferably grinding with blasting material made of various metals or using glass balls/copper slag or chemical corrosion by using oxidant chemical agents or anodic electrolytic corrosion aimed to finally improve bonding between the copper bar. 1. A method for assembling lead anodes used in the electrolytic processes , which increases corrosion resistance and improves bonding between the copper bar , dip weld into a melted bath and a final peripheral coating of such copper bar comprising the following stages:a) The copper bus bar is subject to pre-coating by dip welding in a melted bath, at the right temperature (300° C.-350° C.) with an alloy mainly including lead and silver. The silver content is between 0.1% w/w and 10% w/w, preferably 3% w/w;b) After this pre-coating while the hot copper bar is at a temperature between 250° C. to 280° C., and inserted into a proper mold, the peripheral coating of the copper bar is performed by means of injection or any other similar method with a lead-antimony alloy, between 0.01 and 11% of Sb w/w, preferably 6% w/w, with a thickness between 0.01 and 10 mm, preferably 1.5 mm;c) Right after injection or pre-heating the copper bar is set onto the assembly workbench to fill the groove with a lead-bismuth alloy, between 1 to 55% w/w of bismuth, preferably 50% w/w, at such temperature to allow insertion of the lead plate, while the lead- ...

Solder bump forming apparatus and soldering facility including the same

Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.

Soldering apparatus

A solder drawing member ( 402 ) is detachably attached on the outer side of a jet nozzle ( 303 ) that jets molten solder pumped from a solder tank ( 102 ) storing the molten solder. The solder drawing member ( 402 ) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle ( 303 ). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member ( 402 ), thereby reducing bridge phenomena and icicle phenomena.

Inert environment enclosure

A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.

Dross Removal

This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

Solder bump forming apparatus and soldering facility including the same

Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.

Lead-free and antimony-free tin solder reliable at high temperatures

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.

LEAD-FREE SOLDER COMPOSITION

A lead-free solder composition includes tin, titanium and zinc. Based on 100 parts by weight of the total weight of tin, titanium and zinc, tin is present in an amount ranging from 20 to 40 parts by weight, and titanium is present in an amount ranging from 0.01 to 0.15 parts by weight. 1. A lead-free solder composition comprising tin , titanium and zinc ,wherein, based on 100 parts by weight of the total weight of tin, titanium and zinc, tin is present in an amount ranging from 20 to 40 parts by weight, and titanium is present in an amount ranging from 0.01 to 0.15 parts by weight.2. The lead-free solder composition of claim 1 , wherein titanium is present in an amount ranging from 0.01 to 0.05 parts by weight based on 100 parts by weight of the total weight of tin claim 1 , titanium and zinc.3. The lead-free solder composition of claim 1 , wherein titanium is present in an amount ranging from 0.01 to 0.03 parts by weight based on 100 parts by weight of the total weight of tin claim 1 , titanium and zinc.4. The lead-free solder composition of claim 1 , wherein tin is present in 25 parts by weight based on 100 parts by weight of the total weight of tin claim 1 , titanium and zinc. This application claims priority of Taiwanese Application Number 105123411, filed on Jul. 25, 2016.The disclosure relates to a lead-free solder composition, and more particularly to a lead-free solder composition including tin, titanium and zinc.Conventional high-temperature lead-free solders that are well-known in the industry include gold-tin solder, bismuth-silver solder, zinc-aluminum solder and zinc-tin solder. Since gold and silver are considered more precious metals, gold-tin solder and bismuth-silver solder are more costly than zinc-aluminum solder and zinc-tin solder. Zinc-tin solder has the best mechanical strength and development potential of the above four solder compositions. Conventionally, the zinc-tin solder includes tin in an amount ranging from 20 to 40 wt %, where the ...

WAVE SOLDER NOZZLE WITH AUTOMATED EXIT WING

A wave soldering machine includes a housing and a conveyor configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle assembly configured to create a solder wave. The wave solder nozzle assembly has a nozzle core frame and an exit wing, the exit wing being rotatable about a hinge with respect to the nozzle core frame to adjust a flow of a solder wave. A linear actuator is connected via a linkage to the exit wing to allow the linear actuator to adjust an orientation of the exit wing with respect to the nozzle core frame. 1. A wave soldering machine to perform a wave soldering operation on a printed circuit board , the wave soldering machine comprising:a housing;a conveyor coupled to the housing, the conveyor being configured to deliver a printed circuit board through the housing; anda wave soldering station coupled to the housing, the wave soldering station including a reservoir of solder material, and a wave solder nozzle assembly configured to create a solder wave, the wave solder nozzle assembly having a nozzle core frame and an exit wing, the exit wing being rotatable about a hinge with respect to the nozzle core frame to adjust a flow of a solder wave, the wave solder nozzle assembly further having a linear actuator external to the wave soldering station, the linear actuator being connected to the exit wing and configured to adjust an orientation of the exit wing with respect to the nozzle core frame.2. The wave soldering machine of claim 1 , wherein the linear actuator is connected to the exit wing by a linkage.3. The wave soldering machine of claim 2 , wherein the exit wing includes a first end coupled by the hinge to the nozzle core frame and a second end claim 2 , and wherein the linkage includes at least one rotating link having a first end rotatably coupled to the ...

SOLDER APPLICATION METHOD AND APPARATUS

A method of applying solder includes providing a first roller and a second roller, where at least one of the first and second rollers has an outer surface comprising a solder wicking material. A metallic article is provided, the metallic article having a first side and a second side, and having an opening extending from the first side to the second side. The metallic article is dipped in solder, where the dipping forms an initial coating of solder on the metallic article. After the dipping, the metallic article is fed between the first and second rollers. The wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers. 1. A method of applying solder , the method comprising:providing a first roller and a second roller, wherein at least one of the first and second rollers has an outer surface comprising a solder wicking material;providing a metallic article having a first side and a second side, the metallic article having an opening extending from the first side to the second side;dipping the metallic article in molten solder, wherein the dipping forms an initial coating of solder on the metallic article; andafter the dipping, feeding the metallic article between the first and second rollers;wherein the wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers.2. The method of further comprising:positioning the second roller at least partially in a solder tank, the second roller being located between the first roller and the solder tank, wherein the solder tank is adapted to hold solder; androtating the second roller during the feeding of the metallic article between the first and second rollers, wherein the second roller is cleaned by solder in the solder tank during the rotating.3. The method of wherein after ...

Jet Solder Bath And Jet Soldering Apparatus

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate. 1. A jet solder bath comprising:a first jet nozzle which injects molten solder by a first pump;a second jet nozzle which injects the molten solder by a second pump, the second jet nozzle being arranged on a downstream side of the first jet nozzle along a carrying direction of a substrate; anda bridge member arranged between the first and second jet nozzles, a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing to the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing to an upstream side of the second jet nozzle, and', 'side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate., 'wherein the bridge member includes2. The jet solder bath according to claim 1 , wherein the bridge member extends from a vicinity of an upper end on an upstream end of the second jet nozzle to a vicinity of an upper end on a downstream end of the first jet nozzle.3. The jet solder bath according to claim 2 , further comprising ...

Solder joint structure and solder joining method

A solder joint structure includes a metal pin in the shape of a prism or a circular or substantially circular cylinder; an aluminum wire including a wound portion wound around the metal pin; and a solder layer arranged to join the metal pin and at least one portion of the wound portion to each other. The at least one portion of the wound portion includes a deformed surface resulting from a partial disappearance or elimination of the aluminum wire in a cross-section perpendicular or substantially perpendicular to a direction in which the aluminum wire extends, and the solder layer is directly and closely adhered to the deformed surface.

Jet Nozzle and Jet Soldering Apparatus

Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.

MANUFACTURING OF A HEAT SINK BY WAVE SOLDERING

An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink. 1. An electronic assembly , comprising:an electronic board with a set of vias passing through the electronic board between a first surface and a second surface opposite the first surface,an electronic device attached to the first surface of the electronic board,a heat sink precursor attached to the second surface of the electronic board, the heat sink precursor defining a cavity facing the set of vias, andsolder material that fills the set of vias so as to weld a back of the electronic device to the set of vias and at least partially fills the cavity of the heat sink precursor so as to join the heat sink precursor to the set of vias and form a corresponding heat sink.2. The electronic assembly of claim 1 , wherein the electronic board comprises a first region and a second region arranged around the set of vias claim 1 , the solder paste penetrating through the set of vias causing a joining of a radiator of the electronic device to the first region and causing a joining of an electrical contact of the electronic device to the second region.3. The electronic assembly of claim 1 , wherein the heat sink precursor comprises a bottom wall and two sidewalls facing each other and extending transversely from the bottom wall claim 1 , and wherein the heat sink precursor is attached to the second surface by a free end of at least one of the sidewalls.4. The electronic assembly of claim 3 , ...

Aerosol provision device

A method of forming an aerosol provision device inductor coil comprises providing a litz wire comprising a plurality of wire strands, wherein each of the plurality of wire strands comprise a bondable coating. The method further comprises forming an inductor coil from the litz wire on a support member, wherein the inductor coil has a predetermined shape. The method further comprises activating the bondable coating such that the inductor coil substantially retains the predetermined shape, and removing the inductor coil from the support member.

SOLDERING DEVICE AND SOLDERING SYSTEM

A soldering device, particularly solder pots for selective wave soldering or a fluxer device, having a receiving means configured to store a liquid, particularly a solder reservoir, configured to store a solder, particularly a liquid solder, or having a flux tank configured to store flux, with a nozzle, particularly a solder nozzle or fluxer nozzle, and having a pump, particularly a solder pump or a flux pump, configured to deliver the liquid from the receiving means through the nozzle in the direction of a Z-axis. 1. A soldering device , particularly a solder pot for selective wave soldering or a fluxer device , having a receiving means configured to store a liquid , particularly a solder reservoir that is configured to store a solder , particularly a liquid solder , or having a flux tank configured to store flux , with a nozzle , particularly a solder nozzle or a fluxer nozzle , and having a pump , particularly a solder pump or a flux pump , that is configured to deliver the liquid from the receiving means through the nozzle in the direction of a z-axis , characterized in that the soldering device comprises a moving device that is disposed on the soldering device and configured for independent movement of the soldering device in a working area.2. The soldering device according to claim 1 , wherein the soldering device comprises a top part and a bottom part claim 1 , wherein said top part can be detachably coupled to the bottom part and comprises the receiving means and the nozzle claim 1 , wherein a delivery duct of the pump is disposed in the top part claim 1 , which at least in some sections extends along a circular path claim 1 , and wherein a device for generating a moving magnetic field of the solder pump claim 1 , which device includes at least one magnet claim 1 , and is configured such that said magnet is moved along said delivery duct claim 1 , is disposed in the bottom part.3. The soldering device according to claim 1 , wherein the moving means comprises ...

Wire Automatic Soldering System

A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste. 1. A wire automatic soldering system , comprising:a carrier adapted to load an electrical product to be soldered;a robot adapted to grip and move the carrier on which the electrical product is loaded;a solder paste container containing a solder paste; anda heater configured to heat the solder paste and melt the solder paste into a liquid, the robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.2. The wire automatic soldering system of claim 1 , further comprising a vision detection system configured to detect whether an actual soldering length of a soldered part of the wires is equal to or larger than a first predetermined length.3. The wire automatic soldering system of claim 2 , wherein claim 2 , if the actual soldering length is less than the first predetermined length claim 2 , the robot moves the wires into the solder paste container claim 2 , further soldering the wires until the actual soldering length is equal to or larger than the first predetermined length.4. The wire automatic soldering system of claim 3 , wherein the vision detection system is configured to detect whether an actual soldering quality of the soldered part of the wires conforms to a predetermined soldering quality.5. The wire automatic soldering system of claim 4 , wherein claim 4 , if the actual soldering quality does not conform to the predetermined soldering quality claim 4 , the robot moves the wires into the solder paste ...

WELDING METHOD

A welding method, including: forming a molten solder in a solder bath, forming a dynamic flow of the molten solder from the solder bath, and contacting an object to be welded with the dynamic flow of the molten solder and conducting welding. The surface of the molten solder includes a reduction layer. The oxygen content of the molten solder is below 10 ppm. 2. The method of claim 1 , wherein the reduction layer comprises a nonionic surfactant claim 1 , an antioxidant claim 1 , and ammonium metaphosphate.3. The method of claim 2 , whereinthe nonionic surfactant is selected from nonylphenol ethoxylates, polyoxyethylene sorbitan monolaurates, or a mixture thereof; andthe antioxidant is selected from phytic acid, malic acid, citric acid, or a mixture thereof.4. The method of claim 3 , wherein the reduction layer comprises between 59 and 80 wt. % of the nonionic surfactant claim 3 , between 15 and 40 wt. % of the antioxidant claim 3 , and between 0.5 and 5 wt. % of ammonium metaphosphate.5. The method of claim 1 , wherein a welding temperature is between 240 and 280° C.6. The method of claim 2 , wherein the reduction layer further comprises an accelerator.7. The method of claim 4 , wherein the reduction layer further comprises an accelerator.8. The method of claim 6 , whereinthe accelerator is selected from aniline, tetrabutylammonium bromide, triethanolamine, ethylene diamine, methylamine, ammonium citrate, ammonium dihydrogen phosphate, or a mixture thereof; andthe reduction layer comprises between 0.5 and 5 wt. % of the accelerator.9. The method of claim 7 , whereinthe accelerator is selected from aniline, tetrabutylammonium bromide, triethanolamine, ethylene diamine, methylamine, ammonium citrate, ammonium dihydrogen phosphate, or a mixture thereof; andthe reduction layer comprises between 0.5 and 5 wt. % of the accelerator.10. The method of claim 8 , whereinthe accelerator is ammonium dihydrogen phosphate; anda weight ratio of ammonium metaphosphate to ammonium ...

Advanced Solder Alloys For Electronic Interconnects

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials. 1. A lead-free , antimony-free solder alloy comprising:(a) 10 wt. % or less of silver(b) 10 wt. % or less of bismuth(c) 3 wt. % or less of copper up to 1 wt. % of nickel', 'up to 1 wt. % of titanium', 'up to 1 wt. % of cobalt', 'up to 3.5 wt. % of indium', 'up to 1 wt. % of zinc', 'up to 1 wt. % of cerium, '(d) at least one of the following elements'} 0 to 1 wt. % of manganese', '0 to 1 wt. % of chromium', '0 to 1 wt. % of germanium', '0 to 1 wt. % of iron', '0 to 1 wt. % of aluminum', '0 to 1 wt. % of phosphorus', '0 to 1 wt. % of gold', '0 to 1 wt. % of gallium', '0 to 1 wt. % of tellurium', '0 to 1 wt. % of selenium', '0 to 1 wt. % of calcium', '0 to 1 wt. % of vanadium', '0 to 1 wt. % of molybdenum', '0 to 1 wt. % of platinum', '0 to 1 wt. % of magnesium', '0 to 1 wt. % of rare earths, '(e) optionally one or more of the following elements'}(f) the balance tin, together with any unavoidable impurities.2. A lead-free , solder alloy comprising:(a) 10 wt. % or less of silver(b) 10 wt. % or less of bismuth(c) 3 wt. % or less of copper(d) 4 wt % or less of antimony up to 1 wt % of Ni', 'up to 1 wt. % of titanium', 'up to 1 wt. % of cobalt', 'up to 3.5 wt. % of indium', 'up to 1 wt. % of zinc', 'up to 1 wt. % of cerium, '(e) at least one of the following elements'} 0 to 1 wt. % of manganese', '0 to 1 wt. ...

SOLDERING SYSTEM WITH MONITORING UNIT

The invention relates to a soldering system and a method for wave soldering, having at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle. 1. Soldering system for wave soldering , comprising at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle ,characterized in that the device for monitoring the state of the spray jet has a test surface in the form of a tensioned paper web which has an upper face and a lower face and is designed such that a shape and/or position of the spray jet can be imaged on the upper face of the paper web by bringing the spray jet into contact with the lower face of the paper web, andin that a camera is provided which is arranged above the upper face of the test surface and is designed to detect the shape and/or position of the spray jet that is imaged on the upper face of the test surface.2. Soldering system for wave soldering , comprising at least one solder pot having at least one soldering nozzle and a device for monitoring a state of a standing wave of the soldering nozzle , characterized in that the device for monitoring the state of the standing wave has a test surface in the form of a transparent plate which has an upper face and a lower face and is designed such that a shape and/or position of the standing wave can be imaged on the upper face of the plate by bringing the standing wave into contact with the lower face of the plate , and comprising a camera which is arranged above the upper face of the test surface and is designed to detect at least one of the shape and position of the standing wave that is imaged on the upper face of the test surface.3. Soldering system according to claim 1 , wherein the test surface is planar.4. Soldering system according to claim 1 , wherein the paper of the paper web is designed such that at least one of the shape and position of the spray jet is imaged on the upper face of the paper web by wetting the paper web from ...

WAVE SOLDERING NOZZLE HAVING AUTOMATIC ADJUSTABLE THROAT WIDTH

A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and an adjustable wave solder nozzle assembly adapted to create a solder wave. The adjustable wave solder nozzle assembly has a first curve plate and a second curve plate that together define a nozzle. The second curve plate is movable with respect to the first curve plate between a close proximate position in which the second curve plate is proximate the first curve plate and a spaced apart position in which the second curve plate is spaced from the first curve plate to adjust a width of the nozzle. 1. A wave soldering machine to perform a wave soldering operation on a printed circuit board , the wave soldering machine comprising:a housing;a conveyor coupled to the housing, the conveyor being configured to deliver a printed circuit board through the housing; and a reservoir of solder material, and', a first curve plate and a second curve plate that together define a nozzle, the second curve plate being movable with respect to the first curve plate between a close proximate position in which the second curve plate is proximate the first curve plate and a spaced apart position in which the second curve plate is spaced from the first curve plate to adjust a width of the nozzle,', 'a nozzle core frame configured to fixedly support the first curve plate,', 'an unload support frame configured to movably support the second curve plate,', 'an actuating support frame configured to move relative to the unload support frame, the second curve plate being secured to the actuating support frame, and', 'an actuator assembly configured to move the actuating support frame, the actuator assembly including an actuator support secured to the reservoir, an actuator ...

Method For Cleaning A Solder Nozzle Of A Soldering System

The invention relates to a method for operating a soldering system for selective wave soldering comprising at least one solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump being designed to guide the liquid solder out from the solder reservoir through the solder nozzle for generating a standing wave from liquid solder. The invention relates, in particular, to a method for cleaning a solder nozzle comprising the following steps: conveying solder from the solder reservoir at a first pump capacity which is adjusted in such a way that a standing wave of liquid solder is generated at a solder level which is below an upper edge of the nozzle outlet of the solder nozzle; introducing a cleaning agent into the nozzle outlet of the solder nozzle; increasing the pumping capacity of the solder pump to a second pump capacity such that the cleaning agent flows over the upper edge of the nozzle such that the cleaning agent is guided to an outer side of the solder nozzle. 1. Method for cleaning a solder nozzle of a soldering system for selective wave soldering , wherein the soldering system comprises at least one solder crucible having a solder reservoir , the solder nozzle and a solder pump , wherein the solder pump is designed to guide liquid solder out from the solder reservoir through the solder nozzle for generating a standing first wave from liquid solder , comprising the following steps:conveying solder from the solder reservoir at a first pump capacity which is adjusted in such a way that a second standing wave of liquid solder is generated at a solder level which is below an upper edge of a nozzle outlet of the solder nozzle;introducing a cleaning agent into the nozzle outlet of the solder nozzle onto the second standing shaft, as a result of which the cleaning agent is liquefied;increasing the pump capacity of the solder pump to a second pump capacity, so that the cleaning agent flows over the upper edge ...

METHOD FOR SELECTIVELY PRETINNING A GUIDEWIRE CORE

A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder. 17-. (canceled)8. A method for pretinning a core wire for a guidewire having an elongate axis , comprising:placing a ball of solder within a crucible in a soldering block;melting the ball of solder to produce a molten ball of solder;placing a quantity of flux in a reservoir, and allowing the flux to migrate by capillary action into a linear groove defined by a beam positioned adjacent the crucible;inserting a first portion of the core wire in the flux; thenmoving the first portion laterally in a first direction; andinserting the first portion of the core wire into the molten ball of solder, while maintaining the core wire in a straight configuration with the elongate axis oriented horizontally.9. The method of claim 8 , wherein moving the first portion laterally in a first direction includes moving the first portion into a position above the molten ball of solder and claim 8 , thereafter claim 8 , lowering the core wire and thereby inserting the first portion into the molten ball of solder.10. The method of claim 8 , wherein maintaining the core wire in a straight configuration with the elongate axis oriented horizontally includes maintaining the core wire within the linear groove on a first side of the crucible claim 8 , and within a grooved support on a second side of the crucible opposite the first side.11. The method of claim 8 , further including claim 8 , moving the core wire laterally in a second direction opposite the first direction claim 8 , thereby moving the first portion out of the molten ball of solder and into the quantity of flux.12. The method of further including claim 11 , moving the core wire laterally in ...

Soldering device

A soldering device, in particular a soldering crucible for selective flow soldering, having a solder reservoir which is designed for storing a solder, in particular a molten solder, with a soldering nozzle and with a solder pump which is designed for conveying the solder out of the solder reservoir through the soldering nozzle, wherein the soldering device has an upper part and a lower part, wherein the upper part is releasably connectable to the lower part, and comprises the solder reservoir and the soldering nozzle, wherein a feed channel of the solder pump is disposed in the upper part and a device for generating a moving magnetic field of the solder pump is disposed in the lower part, designed (said device for generating a moving magnetic field) for generating a moving magnetic field along the feed channel.

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole. 1. An apparatus for increasing solder hole-fill in a Printed Circuit Board Assembly (PCBA) , comprising:a first hardware component for causing, in the PCBA, a pin of a device to move in a first direction, the PCBA comprising a Printed Circuit Board (PCB) and the device, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material, the causing the pin to move resulting in drawing the solder material into the hole up to a second distance, wherein the second distance is greater than the first distance; anda second hardware component for allowing the pin to move in a second direction, wherein the move in the second direction returns the pin to an initial position in the hole, and wherein the allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.2. The apparatus of claim 1 , further comprising:a third hardware component for repeating, the causing, the drawing, and the allowing a number of times at a first frequency, wherein the repeating causes the solder material to reach a threshold distance into the hole.3. The apparatus of claim 1 , further comprising:a ...

ELECTRICAL CONNECTOR AND MANUFACTURING METHOD THEREOF

An electrical connector includes a barrel type terminal, having a first connecting area and a second connecting area. The first connecting area has a first non-soldering surface and a first soldering surface. The second connecting area has a second non-soldering surface and a second soldering surface. Each of the first and second soldering surfaces and the first and second non-soldering surfaces has a first solder layer. A sleeve sheathes outside the barrel type terminal, and has a first fixing area and a second fixing area. Two second solder layers are provided between the first fixing area and the first soldering surface and between the second fixing area and the second soldering surface. The amount of solder provided between the first fixing area and the first soldering surface and between the second fixing area and the second soldering surface is greater than that provided on the first and second non-soldering surfaces. 1. An electrical connector , comprising:a barrel type terminal, having a contact area, a first connecting area and a second connecting area, wherein the first connecting area and the second connecting area are respectively provided at two ends of the contact area, an inner surface of the first connecting area has a first non-soldering surface, an outer surface of the first connecting area has a first soldering surface, an inner surface of the second connecting area has a second non-soldering surface, an outer surface of the second connecting area has a second soldering surface, and each of the first soldering surface, the second soldering surface, the first non-soldering surface and the second non-soldering surface has a first solder layer; anda sleeve, sheathing outside the barrel type terminal, wherein two ends of the sleeve are correspondingly provided with a first fixing area and a second fixing area respectively, the first fixing area corresponds to the first connecting area, and the first fixing area and the first soldering surface are ...

Advanced Solder Alloys For Electronic Interconnects

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

INJECTION-MOLDED SOLDER (IMS) TOOL ASSEMBLY AND METHOD OF USE THEREOF

An injection-molded solder (IMS) tool assembly apparatus, the apparatus including an IMS tool for dispensing a molten material via a round extrusion part to coat an inside or an outside wall of a pipe (and a chiller for providing cooling water to flow through an inside of the pipe.) 1. An injection-molded solder (IMS) tool assembly apparatus , the apparatus comprising:an IMS tool for dispensing a molten material via a round extrusion part to coat an outside wall of a pipe; anda chiller for providing cooling water to flow through an inside of the pipe.2. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein the IMS tool comprises:a tungsten head for dispensing the molten material into the round extrusion part;a heater for maintaining a molten state of the molten material in the tungsten head; anda pressure source for supplying pressure to the molten material causing the molten material to dispense from the tungsten head into the round extrusion part.3. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein an inner diameter of the round extrusion part is greater than an outer diameter of the pipe.4. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein the pipe comprises a carbon steel pipe.5. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a temperature of the cooling water is set such that the pipe is cooled to avoid melting of a material of the pipe while the molten material touches the outside wall of the pipe.6. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a melting temperature of the molten material is greater than a melting temperature of the pipe.7. The injection-molded solder (IMS) tool assembly apparatus of claim 4 , wherein the molten material includes a material to coat the pipe such that the pipe has a stainless steel property.8. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a melting ...

Soldering Device, Soldering System And Method

The invention relates to a soldering device for removing solder pearls and/or solder balls from the lower face of a printed circuit board, in particular a soldering device for a soldering system for a selective wave soldering process, comprising a brush device for removing solder pearls and/or solder balls from the lower face of a printed circuit board. The brush device has a brush which can be driven about a drive axis and which is designed to remove the solder pearls and/or solder balls, wherein a moving device is provided, said brush device being arranged on the moving device such that the brush device can be moved relative to the printed circuit board in the direction of an X, Y, and Z axis. 2. The soldering device according to claim 1 , wherein the movement device is a portal system.3. The soldering device according to claim 2 , wherein the portal system has at least one X-axis drive claim 2 , configured for moving the brush device along the X axis claim 2 , wherein the portal system has at least one Y-axis drive claim 2 , which is configured for moving the brush device along the Y axis and wherein the portal system has at least one Z-axis drive which is configured for moving the brush device along the Z axis.4. The soldering device according to wherein the axis drives are configured as linear drives claim 3 , particularly as chain drives claim 3 , screw drives claim 3 , ball screw drives claim 3 , roller screw drives claim 3 , direct linear drives claim 3 , hydraulic cylinders or/or pneumatic cylinders.5. The soldering device according to claim 1 , wherein the movement device is a manipulator of a robot.6. The soldering device according to claim 1 , wherein the brush device has a brush drive claim 1 , which is configured for generating an oscillating rotating movement of the brush.7. The soldering device according to claim 1 , wherein the brush device is configured for draining electrostatic discharges.8. The soldering device according to claim 1 , wherein the ...

Method for operating a soldering device, soldering device

Method for operating a soldering device and soldering device, wherein a graphic representation of at least part of the soldering device is captured, wherein an instantaneous operating state of the soldering device is determined by means of automated processing of the graphic representation dependent on information about the soldering device from the graphic representation, characterized in that the information about the soldering device is determined dependent on a reference representation of at least part of the soldering device, wherein the reference representation is captured as a graphic representation or wherein the reference representation is read as a graphic representation from a memory, and in that the reference representation characterizes a degree of oxidation of solder (122) when the solder (122) flows out over at least part of a surface (124) of a soldering nozzle (116).

JOINING TO ALUMINIUM

A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminium surfaces solderable using the flux and conventional solders. 1. A flux comprising one or more amines.2. The flux of wherein the amines comprise an ethanolamine and/or an ethoxylated amine.3. The flux of wherein the one or more amines is selected from: monoethanol amine claim 1 , diethanol amine claim 1 , triethanol amine claim 1 , aminoethylethanol amine claim 1 , ethoxylated tallow amines claim 1 , and etholoxated polyamine.4. The flux of comprising:from 10 to 45% by weight monoethanol amine, and/orfrom 15 to 30% by weight triethanol amine, and/orfrom 10 to 35% by weight aminoethylethanol amine, and/orfrom 5 to 36% by weight ethoxylated tallow amines, and/orfrom 1 to 10% by weight etholoxated polyamine.5. The flux of comprising:from 10 to 40 wt. % monoethanol amine;from 15 to 30 wt. % triethanol amine;from 10 to 35 wt. % aminoethylethanol amine;from 5 to 20 wt. % ethoxylated tallow amine; andoptionally from 1 to 10 wt. % ethoxylated polyamine.6. The flux of comprising an activator.7. The flux of wherein the activator is selected from one or more of zinc chloride claim 6 , aluminium chloride and fluoroboric acid.8. The flux of comprising:from 1 to 5% by weight aluminium chloride and/orfrom 5 to 15% by weight zinc chloride, and/orfrom 5 to 15% by weight fluoroboric acid.9. The flux of further comprising a surfactant claim 3 , preferably selected from octyl phenol ethoxylates and nonyl phenol ethoxylates.10. The flux of comprising:from 10 to 40 wt. % monoethanol amine;from 15 to 30 wt. % triethanol amine;from 10 to 35 wt. % aminoethylethanol amine;from 5 to 20 wt. % ethoxylated tallow amine;from 1 to 5 wt. % water;from 1 to 5 wt. % ammonium chloride;from 5 to 15 wt. % zinc chloride;from 5 to 15 wt. % fluoroboric acid, 50%;from 1 to 5 wt. % tin fluoroborate; andfrom 1 to 5 wt. % nonyl and ...

Device For Soldering Electrical Or Electronic Components

A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.

SOLDERING DEVICE

A control device of soldering device identifies the type of lead component to be soldered when soldering multiple types of lead components sequentially with jet device and reads out a value of a soldering parameter corresponding to the lead component type from an HDD. Then, the control device controls jet device so that the lead component is soldered based on the value of the soldering parameter. As a result, the lead of the lead component is soldered with the value of the soldering parameter corresponding to the type of the lead component. 16.-. (canceled)7. A soldering device comprising:a soldering means for soldering leads of multiple lead component types mounted on a board by jetting molten solder reserved in a solder bath;a memory means for storing correspondences between the lead component types and a value of a soldering parameter; anda control means configured to identify the lead component type to be soldered when sequentially soldering the multiple types of lead components by the soldering means, read out a value of the soldering parameter corresponding to the lead component type identified from the correspondences stored in the memory means, and control the soldering means so that the lead of the lead component is soldered based on the value of the soldering parameter read out.8. The soldering device of claim 7 , wherein the soldering parameter may include at least one of:a flux heating time during which flux adhering to the board is heated before the molten solder is applied to the lead of the lead component;a solder application time during which the molten solder is applied to the lead of the lead component;a solder withdrawal speed at which the soldering means is moved downwards below the lead component after the soldering means ends its soldering operation;a solder curing waiting time during which solder is allowed to cure while the lead component is supported to be raised from the board;a tracing soldering speed at which the soldering means is moved ...

WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACTURING

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided. 1. A method of manufacturing a printed circuit board assembly , the method comprising:providing a circuit board;supporting the circuit board on a pallet, the pallet including geometries configured to achieve optimal solder flow;positioning a plurality of components on the circuit board, the plurality of components including a plurality of lead pins extending through the circuit board and protruding from an underside of the circuit board and at least partially through at least one opening defined within the pallet; andpassing the pallet through a wave solder machine such that molten solder contacts the pallet and the geometries of the pallet control the molten solder to flow according to the optimal solder flow to establish connections between the plurality of lead pins.2. The method according to claim 1 , wherein the optimal solder flow is where correct amounts of solder are applied in correct locations and for correct durations to establish the connections between the plurality of lead pins.3. The method according to claim 1 , wherein the optimal solder flow is determined based upon microfluidics of solder flow.4. The method according to claim 1 , wherein the optimal solder flow is determined based upon speed claim 1 , acceleration claim 1 , volume claim 1 , and direction of solder flow.5. The method according to claim 1 , wherein the geometries ...

WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACTURING

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided. 1. A pallet for use during manufacture of a printed circuit board assembly , the pallet comprising:an inner body configured for positioning on an underside of a circuit board, the inner body defining at least one opening configured to receive a plurality of lead pins of components mounted on the circuit board,wherein the inner body defines geometries feeding into the at least one opening and configured to achieve optimal solder flow to establish connections between the plurality of lead pins.2. The pallet according to claim 1 , wherein the geometries of the pallet include at least one of a channel claim 1 , a tunnel claim 1 , or a ramp feeding into at least one of the openings.3. The pallet according to claim 1 , wherein the geometries of the pallet include at least one of an adjustable component or a replaceable component feeding into at least one of the openings.4. The pallet according to claim 1 , wherein the pallet is formed from a high temperature grade plastic via 3D printing.5. The pallet according to claim 1 , further comprising an outer frame surrounding the inner body. This application is a divisional of U.S. patent application Ser. No. 15/807,125, entitled “WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACTURING” and filed on Nov. 8, 2017, which claims the benefit of, and priority to, U.S. Provisional Patent Application ...

HIGH-EFFICIENCY SOLDERING APPARATUS FOR WINDING HEAD OF FLAT-WIRE MOTOR AND SOLDERING PROCESS

The high-efficiency soldering apparatus for a winding head of a flat-wire motor includes a support base, a solder tray, a solder spot isolation and limit plate, a shaft lever and a movable tray. The solder tray is provided at the center of the support base. The solder spot isolation and limit plate is provided on the solder tray. The shaft lever is provided on the support base. The movable tray is provided on the shaft lever. The movable tray is located above the solder tray. The movable tray moves vertically along the shaft lever. A stator is placed at the center of the movable tray, and a winding head of the stator extends below the movable tray. 1. A soldering apparatus , comprising:a support base,a solder tray,a solder spot isolation and limit plate,a shaft lever, anda movable tray;wherein the solder tray is provided at the center of the support base;wherein the solder spot isolation and limit plate is provided on the solder tray;wherein the shaft lever is provided on the support base;wherein the movable tray is provided on the shaft lever;wherein the movable tray is located above the solder tray;wherein the movable tray moves vertically along the shaft lever;wherein a stator is placed at the center of the movable tray, andwherein a winding head of the stator extends below the movable tray.2. The soldering apparatus according to claim 1 , wherein the solder spot isolation and limit plate is provided with threaded holes claim 1 , and screws pass through the threaded holes to fix the solder spot isolation and limit plate on the solder tray.3. The soldering apparatus according to claim 1 , wherein the solder spot isolation and limit plate is provided with solder spot isolation and limit through holes claim 1 , and the solder spot isolation and limit through holes are evenly distributed in a ring.4. The soldering apparatus according to claim 1 , wherein the solder tray is provided with an annular solder slot.5. The soldering apparatus for a according to claim 1 , ...

Low Temperature High Reliability Alloy for Solder Hierarchy

A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METHODS FOR PROTECTING THERMALLY SENSITIVE COMPONENTS

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided. 1. A method of manufacturing a printed circuit board assembly , the method comprising:providing a circuit board;positioning a plurality of components on the circuit board, at least one of the components being a thermally-sensitive component having a maximum temperature threshold;positioning a customized protective heat shield on the thermally-sensitive component;exposing the circuit board to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component; andremoving the customized protective heat shield from the thermally-sensitive component.2. The method according to claim 1 , wherein the customized protective heat shield is positioned on the thermally-sensitive component prior to positioning of the thermally-sensitive component on the circuit board.3. The method according to claim 2 , wherein the thermally-sensitive component and the customized protective heat shield are together picked and placed on the circuit board with a surface mount technology machine.4. The method according to claim 1 , wherein the customized protective heat shield is positioned on the thermally-sensitive component after positioning of the thermally- ...

SOLDERING MODULE

The invention relates to a soldering module () for the, in particular selective, soldering of components to a circuit board (), having a soldering nozzle () for creating a solder wave. It is proposed that the soldering module () comprises a linear conveyor (), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board () by moving the circuit board () in a conveying direction over the solder wave, and that the linear conveyor () is tiltable, in particular about a first tilting axis (). 1. A soldering module for the , in particular selective , soldering of components to a circuit board having a soldering nozzle for creating a solder wave ,the soldering module comprising a linear conveyor, in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board by moving the circuit board in a conveying direction over the solder wave, and in that the linear conveyor is tiltable, in particular about a first tilting axis.2. The soldering module as claimed in claim 1 , wherein the first tilting axis is oriented substantially perpendicularly to a direction of gravitational force.3. The soldering module as claimed in claim 1 , wherein the linear conveyor is tiltable about the first tilting axis such that the normal of the circuit board encloses an angle of at least 4° claim 1 , preferably of at least 8° claim 1 , more preferably of at least 10° claim 1 , with the direction of gravitational force.4. The soldering module as claimed in claim 2 , wherein the first tilting axis is oriented substantially perpendicularly to a conveying direction or substantially parallel to the conveying direction.5. The soldering module as claimed in claim 4 , wherein the linear conveyor is tiltable about a second tilting axis claim 4 , wherein the second tilting axis is oriented substantially normal to the direction of gravitational force.6. The soldering module as claimed in claim 5 , wherein the first tilting axis and/or the second tilting ...

Jet Solder Bath and Jet Soldering Device

A jet solder bath for performing soldering by jetting molten solder to bring the molten solder into contact with a substrate is provided with a primary jet nozzle that jets the molten solder by a first jet pump, as a first jet nozzle, and a secondary jet nozzle, as a second jet nozzle, which is arranged at a downstream side of the primary jet nozzle along a carrying direction of the substrate and jets the molten solder by a second jet pump. The primary jet nozzle includes a first nozzle body, and a first solder-flow-forming plate that is provided at an upper end of the first nozzle body and has a plurality of jet holes, and the secondary jet nozzle includes a second nozzle body and a second solder-flow-forming plate that is provided at an upper end of the second nozzle body and has a plurality of jet holes.

Separating Strip Arrangement for a Soldering Nozzle and Soldering Nozzle Device for Selective Wave Soldering

The invention relates to an arrangement of at least two solder-wettable separating strips () for a soldering nozzle, for simultaneous wave soldering of rows of soldering points, said rows being arranged so as to be spaced apart. 1. A separating strip arrangement comprising:at least two solder-wettable separating strips for a soldering nozzle for simultaneous selective wave soldering, wherein the at least two separating strips are oriented parallel to one another and are connected fixedly as a group of separating strips to form a strip assembly; andat least two rows of soldering points arranged so as to be spaced apart, in a soldering installation, wherein a depth of the separating strips, for generating a surface tension suctioning off excess solder from the soldering points, along a solder influx direction, amounts to at least a multiple of a thickness of the separating strips.2. The separating strip arrangement according to claim 1 , in which the separating strips have a depth of 4 to 8 mm.3. The separating strip arrangement according to claim 1 , in which the separating strips are connected to one another to form a strip assembly with spacers interposed between the separating strips.4. The separating strip arrangement according to claim 1 , in which the separating strips claim 1 , together with at least one bridge connecting the separating strips claim 1 , forms a one-piece strip assembly.5. The separating strip arrangement according to claim 1 , in which the separating strips claim 1 , together with a frame connecting the separating strips claim 1 , forms a one-piece strip assembly.6. The separating strip arrangement according to claim 4 , in which the strip assembly is a solid metal block with material removed.7. The separating strip arrangement according to claim 4 , in which the the material is removed by water jet cutting claim 4 , wire-electro discharge machining claim 4 , or laser beam cutting.8. (canceled)9. The separating strip arrangement according to ...

Integrated Circuit With Sensor Printed In Situ

The present disclosure teaches a method for manufacturing a module comprising an integrated circuit and a sensor. The method may comprise: mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; and printing a sensor directly onto the module after all high temperature mounting processes are complete. 1. A method for manufacturing a module comprising an integrated circuit and a sensor , the method comprising:mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; andenclosing the IC die in a housing comprising a top surface with a plurality of exposed contact areas providing electrical connections to the die enclosed in the housing; andprinting a sensor directly onto the top surface of the housing after all high temperature mounting processes are complete.26-. (canceled)7. A method for manufacturing a module comprising an integrated circuit and a sensor , the method comprising:mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; andprinting a sensor directly onto the PCB after all high temperature mounting processes are complete.8. A method for joining a sensor device to an integrated circuit , the method comprising:mounting an integrated circuit die (IC) to a printed circuit board with a high temperature mounting process;at least partially enclosing the IC in a housing comprising a top surface; andprinting the sensor device directly onto the top surface of the housing.9. A method according to claim 8 , wherein the top surface of the housing defines a plurality of exposed contact areas providing electrical connections to the IC die; andwherein the method includes printing the ...

SOLDERING METHOD AND SOLDERING APPARATUS

To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput. 1. A soldering method comprising:preheating a mask on which a substrate is not placed;placing the substrate on the mask which is preheated; andbringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.2. The soldering method according to claim 1 , further comprising preheating the substrate in a preheating section.3. The soldering method according to claim 1 ,wherein the preheating of the mask includes bringing at least a part of the mask on which the substrate is not placed into contact with the molten solder.4. The soldering method according to claim 3 ,wherein the preheating of the mask includes immersing the entire mask on which the substrate is not placed in the molten solder.5. The soldering method according to claim 1 ,wherein the preheating of the mask includes blowing a hot wind against the mask on which the substrate is not placed.6. The soldering method according to claim 1 ,wherein the preheating of the mask includes preheating the mask on which the substrate is not placed to 150° C. or higher.7. The soldering method according to claim 1 , comprising:detecting temperature of the mask,wherein the preheating of the mask is performed when temperature of the mask reaches a predetermined or lower value.8. The soldering method according to claim 1 , comprising:detecting that the substrate is charged into the soldering apparatus,wherein the preheating of the mask is performed when the charging of the substrate in the soldering apparatus is not detected for a predetermined time period.9. A soldering apparatus comprising:a preheater configured to preheat a mask on which a substrate is not placed, anda soldering section configured to solder the substrate placed on the mask which is preheated.10. The soldering apparatus according to claim 9 , comprising:a preheating ...

METHOD AND SYSTEM FOR TIN IMMERSION AND SOLDERING OF CORE WIRE

Disclosed are a method and a system for tin immersion and soldering of a core wire which includes: inserting a core wire row into molten tin vertically; moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from each core wire on a moving direction side; pulling the each core wire out of the molten tin; and performing alignment, such that the inner core conductor of the each core wire on the moving direction side contacts with a bonding pad. According to the technical solution of the present disclosure, the carbonized matter on the core wire that aligned facing the bonding pad is removed, such that the temperature transfer effect of the automatic soldering is improved, the yield of the automatic soldering is improved, and the consistency and the yield of the automatic soldering are more stable. 1. A method for tin immersion and soldering of core wire , comprising:inserting a core wire row into molten tin vertically to melt an insulation skin on each core wire of the core wire row and complete pre-tinning of an inner core conductor;moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from the each core wire on a moving direction side;pulling the each core wire out of the molten tin; andperforming alignment, such that the inner core conductor of the each core wire on the moving direction side is respectively in contact with a bonding pad.2. The method according to claim 1 , wherein the inserting a core wire row into molten tin vertically comprises:performing regular arranging and straightening on solder ends of a plurality of strands of core wires to obtain the core wire row; andinserting the core wire row into the molten tin vertically for 1 to 3 seconds.3. The method according to claim 2 , wherein a temperature of the molten tin is 380° C. to 420° C.4. The method according to claim 1 , wherein the moving the each core wire in ...

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole. 1. A computer usable program product comprising a computer readable storage device including computer usable code for increasing solder hole-fill in a Printed Circuit Board Assembly (PCBA) , the computer usable code comprising:computer usable code for causing, in the PCBA, a pin of a device to move in a first direction, the PCBA comprising a Printed Circuit Board (PCB) and the device, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material,the causing the pin to move resulting in drawing the solder material into the hole up to a second distance, wherein the second distance is greater than the first distance; andcomputer usable code for allowing the pin to move in a second direction, wherein the move in the second direction returns the pin to an initial position in the hole, and wherein the allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.2. The computer usable program product of claim 1 , further comprising:computer usable code for repeating, the causing, the drawing, and the allowing a number of times at a ...

In-Vehicle Electronic Module

There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.

Jet Solder Level Confirmation Jig and Method of Handling the Same

Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.

Soldering Device

Provided are a nut, an attachment for nut and a screw shaft, which are fitted to a coating material coating device or a soldering device and can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each device is used for a long time are fixed, and a soldering device using the same. The nut screws on to the screw shaft having a predetermined length. The nut is provided with a non-meshing part composed of a notch that is formed parallel to a movement direction thereof by cutting off screw threads and a flange portion , which has connecting holes for connecting another member. Under such a configuration, by forward and/or backward movement of the nut , the notch functions as if it scraps the fixed matters 110.-. (canceled)11. A soldering device comprising:an adjustment member for changing a width between conveying rails to match a size of a conveying substrate to be soldered, a screw shaft that rotates;', 'a nut having a flange portion for connection, a fixed position of the nut to the screw shaft being changeable forward or backward by rotating the screw shaft; and', 'a rail-supporting member for supporting a rail which conveys the substrate, the rail-supporting member being fixed to the nut through the flange portion for connection and changing the width between the conveying rails to match the size of the conveying substrate,, 'wherein the adjustment member includeswherein the nut contains a screw portion from a forward end thereof to a rear end thereof and includes at least one non-meshing part along whole thereof, the non-meshing part does not mesh with the screw shaft, andwherein when changing the width between the rails for conveying the substrate by rotating the screw shaft, an adhered matter which is adhered to the screw shaft and is fixed thereto is scrapped by a ridge of the non-meshing part due to the rotation of the screw shaft. The present invention relates to a nut, an attachment for nut, ...

Welding Tray

The embodiments of disclosure disclose a welding tray, which includes a tray frame () and a supporting device (), wherein the supporting device () includes a supporting component and an adjustable connecting component, the supporting component includes a supporting surface, the adjustable connecting component connects the supporting component to a side edge of the tray frame (), and a distance between the supporting surface and a bearing surface of the tray frame () is adjustable. 1. A welding tray , comprising:a tray frame and a supporting device, whereinthe supporting device comprises a supporting component and an adjustable connecting component, and the supporting component comprises a supporting surface; andthe adjustable connecting component connects the supporting component to a side edge of the tray frame, and a distance between the supporting surface and a bearing surface of the tray frame is adjustable.2. The welding tray as claimed in claim 1 , whereinthe tray frame comprises a rectangular outer frame, and the outer frame comprises two transverse supporting beams and two longitudinal supporting beams;the supporting component comprises a supporting part with the supporting surface and two connecting parts positioned at two ends of the supporting part, and the two connecting parts comprise two connecting surfaces spaced from the supporting surface; andthe adjustable connecting component connects the two connecting parts with the two transverse or longitudinal supporting beams respectively, and adjusts the distance between the supporting surface and the bearing surface of the tray frame by changing distances between the two connecting surfaces of the two connecting parts and the two supporting beams.3. The welding tray as claimed in claim 2 , whereinthe adjustable connecting component comprises a locking element and two screw studs;the two screw studs sequentially penetrate through through holes on the two connecting surfaces of the two connecting parts and ...

MOUNTING CARRIER AND METHOD OF MOUNTING A MOUNTING CARRIER ON A CONNECTING CARRIER

A mounting carrier for semiconductor chips includes a second main surface provided for mounting of semiconductor chips, and a first main surface opposite to the second main surface. The mounting carrier also includes a mounting body, wherein the mounting body includes a first metallization on the side facing the first main surface and the first main surface includes a structure having a plurality of columnar structural elements. 117-. (canceled)18. A mounting carrier comprising a second main surface provided for mounting of semiconductor chips , a first main surface opposite the second main surface , anda mounting body comprising a first metallization on a side facing the first main surface, whereinthe first main surface comprises a structure having a plurality of columnar structural elements.19. The mounting carrier according to claim 18 , further comprising a ceramic claim 18 , wherein the mounting body comprises a second metallization on the side facing the second main surface.20. The mounting carrier according to claim 18 , wherein from an inner region towards edges of the first metallization claim 18 , the columnar structural elements comprise cross-sectional surfaces which decrease in size.21. The mounting carrier according to claim 18 , wherein the mounting claim 18 , body contains a ceramic.22. The mounting carrier according to claim 18 , wherein the structural elements comprise a height of 30 micrometers to 300 micrometers.23. The mounting carrier according to claim 22 , wherein the structural elements have the same height.24. The mounting carrier according to claim 18 , wherein a cross-section of the structural elements comprises a maximum extension of 20 micrometers to 3000 micrometers.25. The mounting carrier according to claim 18 , wherein an entire surface of all maximum cross-sections of the structural elements constitutes 25% to 80% of the entire surface of the second main surface.26. The mounting carrier according to claim 18 , wherein the mounting ...

SELECTIVE SOLDERING SYSTEM

The invention relates to a selective soldering plant for the soldering of electronic circuit boards, at least one container for liquid solder, a soldering arrangement with at least one soldering nozzle and at least one pump for conveying the liquid solder to the soldering arrangement being provided, an inner shielding device for at least partially shielding the soldering arrangement upwardly with regard to a gas flow being provided above the soldering arrangement, and an inflow device being provided, through which gas, in particular protective gas, can in any event flow into the region below the inner shielding device. It is proposed that an outer shielding device for at least partially shielding the inner shielding device upwardly with regard to a gas flow be provided. 1. A selective soldering plant for the soldering of electronic circuit boards , at least one container for liquid solder , a soldering arrangement with at least one soldering nozzle and at least one pump for conveying the liquid solder to the soldering arrangement being provided , an inner shielding device for at least partially shielding the soldering arrangement upwardly with regard to a gas flow being provided above the soldering arrangement , and an inflow device being provided , through which gas , in particular protective gas , can in any event flow into the region below the inner shielding device , wherein an outer shielding device for at least partially shielding the inner shielding device upwardly with regard to a gas flow is provided.2. The selective soldering plant as claimed in claim 1 , wherein the inner shielding device has a cover plate which claim 1 , in a standby position claim 1 , is positioned above the at least one soldering nozzle and which can be lowered into a soldering position in such a way that the at least one soldering nozzle projects through a cover plate orifice claim 1 , assigned to the soldering nozzle claim 1 , in the cover plate claim 1 , preferably in that claim 1 , ...

Liquid Coating Device

In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9 a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.

SYSTEMS AND DEVICES FOR IMPROVED SOLDER DISPENSING

Systems and methods for soldering a workpiece using a solder application system. A nozzle includes a plurality of walls and a floor that together define a nozzle reservoir for containing liquid solder. The plurality of walls also define a soldering region that is external to the nozzle reservoir. The plurality of walls in the soldering region define holes that are configured to dispense the liquid solder from the nozzle reservoir. The holes are configured such that the liquid solder dispensed therefrom merges into a combined stream and the workpiece is soldered when placed into the combined stream 1. A nozzle for soldering a workpiece using a solder application system , the nozzle comprising:a plurality of walls and a floor that together define a nozzle reservoir for containing liquid solder filled up to a fill height therein, wherein the plurality of walls also define a soldering region that is external to the nozzle reservoir, wherein the plurality of walls in the soldering region define a plurality of holes that are each defined below the fill height and each configured to dispense a stream of the liquid solder from the nozzle reservoir;wherein when the liquid solder is filled up to at least the fill height, a head pressure is generated at each of the plurality of holes such that the stream of the liquid solder is dispensed therefrom; andwherein the nozzle is configured such that the workpiece is soldered when placed into the soldering region.2. The nozzle according to claim 1 , wherein the plurality of holes are defined such that the streams of the liquid solder dispensed therefrom merge into a combined stream claim 1 , and wherein the workpiece is soldered when placed into the combined stream.3. (canceled)4. The nozzle according to claim 2 , wherein the liquid solder is dispensed based only on head pressure caused by the fill height being higher than the plurality of holes.5. The nozzle according to claim 2 , wherein the plurality of holes include at least two ...

PRE-HEATER LATCH AND SEAL MECHANISM FOR WAVE SOLDER MACHINE AND RELATED METHOD

A wave solder machine includes a pre-heating station, a wave soldering station, and a conveyor to transport substrates through a tunnel passing through the pre-heating station and the wave soldering station. The tunnel has a substantially oxygen-free environment. The pre-heating station includes a pre-heater including a support frame assembly, and a heater assembly supported by the support frame assembly. The heater assembly is slidably coupled to the support frame assembly between an operational position and a non-operational position. The pre-heater further includes a seal disposed between the heater assembly and the support frame assembly. The seal provides a gas-tight seal when the heater assembly is in the operational position to prevent atmosphere from entering the tunnel thereby preserving the substantially oxygen-free environment within the tunnel. 1. A wave solder machine configured to perform a wave solder operation on an electronic substrate , the wave solder machine comprising:a pre-heating station configured to heat the electronic substrate;a wave soldering station configured to attach electronic components to the electronic substrate with solder; anda conveyor configured to transport substrates through a tunnel passing through the pre-heating station and the wave soldering station, a support frame assembly,', 'a support tray slidably coupled to the support frame assembly, the support tray being movable between a closed position in which the support tray is slid into the support frame assembly and an open position in which the support tray is slid out of the support frame assembly,', 'a heater disposed in the support tray, and', 'a latch mechanism configured to releasably secure the support tray in the closed position., 'wherein the pre-heating station includes at least one pre-heater including'}2. The wave solder machine of claim 1 , wherein the support frame assembly includes a pivot bracket secured to the tunnel.3. The wave solder machine of claim 2 ...

PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION

An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part. 1. An injection apparatus for injecting material , comprising:a tank for storing a material;a head body having a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank; andat least one member connected to the opening part, the at least one member allowing gas to flow into and flow out from the opening part.2. The injection apparatus of claim 1 , wherein the opening part has a form of a slit and each of the at least one member is connected to the opening part at a position away from a middle of the slit.3. The injection apparatus of claim 2 , wherein the at least one member includes a second tank equipped with a valve for opening and closing a channel between the second tank and an outside.4. The injection apparatus of claim 3 , wherein the head body includes a first connection channel connected to the tank and a second connection channel connected to the second tank claim 3 , the opening part having a first end connected to the first connection channel and a second end connected to the second connection channel.5. The injection apparatus of claim 2 , wherein each of the at least one member includes a porous member allowing the gas to flow therethrough while separating the gas from the material.6. The injection apparatus of claim 5 , wherein the at least one member includes two members and the head body includes a first connection channel connected to the tank and two second connection channels ...

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

A Cu core ball contains a Cu ball and at least one metal layer for covering a surface of the Cu ball. The metal layer is made of at least one element selected from the group of Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from a group of Fe, Ag and Ni in a total amount of 5.0 ppm by mass or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher to 99.9995% by mass or lower, and sphericity which is 0.95 or higher. 1. A Cu core ball comprising:a Cu ball; anda solder layer for covering a surface of the Cu ball,wherein the Cu ball contains at least one element selected from a group of Fe, Ag and Ni in a total amount of 5.0 ppm by mass or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities,wherein the Cu ball contains purity which is 99.995% by mass or higher to 99.9995% by mass or lower, and sphericity which is 0.95 or higher, andwherein the solder layer contains Cu in an amount of 0.1% by mass or more to 3.0% by mass or lower, Bi in an amount of more than 0% by mass to 10.0% by mass or less, and remainder of Sn.2. The Cu core ball according to wherein the solder layer contains Cu in an amount of 0.1% by mass or more to 3.0% by mass or lower claim 1 , Bi in an amount of 0.5% by mass to 5.0% by mass or less claim 1 , Ag in an amount of 0% by mass or more to 4.5% by mass or less claim 1 , Ni in an amount of 0% by mass or more to 0.1% by mass or less and remainder of Sn.3. The Cu core ball according to wherein the sphericity thereof is 0.98 or higher.4. The Cu core ball according to wherein the sphericity thereof is 0.99 or higher.5. The Cu core ball ...

Wave solder nozzle with automated adjustable sliding plate to vary solder wave width

A wave soldering machine includes a housing and a conveyor configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle assembly configured to create a solder wave. The wave solder nozzle assembly has a nozzle core frame, a solder distribution baffle secured to the nozzle core frame, and a sliding plate that together define a nozzle. The sliding plate is movable with respect to the nozzle core frame between a close proximate position in which the nozzle is configured to produce a reduced width solder wave through the solder distribution baffle and a spaced apart position in which the nozzle is configured to produce an extended width solder wave through the solder distribution baffle.

Soldering device and control method for soldering device

A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.

Shield gas wave soldering

A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a gas blanket over the solder, reduction in dross occurs and improved soldering results avoiding the necessity of removing flux residues. Gas diffusers are provided on both sides of a solder wave in an enclosure, the diffusers are placed below the path of the element to be soldered and a further gas diffuser is positioned above the element to be soldered. The gas diffusers supply a calm gas blanket over the solder wave so no turbulent movement of gas occurs within the enclosure.

Process for producing a Schichtwärmeübertragers and layer heat exchanger

Die Erfindung betrifft ein Verfahren zur Herstellung eines gelöteten und geschweißten Schichtwärmeübertragers 1, bestehend aus einem Trenn- und Deckplatten (7, 8, 9, 10) aufweisenden Schichtblock (2) und an den Schichtblock (1) anschließbaren Sammelkästen (3, 4, 5, 6). Es werden folgende, vorzugsweise nacheinander ablaufende Verfahrensschritte vorgeschlagen: a) Stapeln der Trenn- und Deckplatten (7, 8, 9, 10) zu einem Schichtblock (2), b) Aufbringen einer definierten Druckkraft auf entgegengesetzten Seiten (Deckplatten 7, 8) des Schichtblockes (2) und Erzeugen einer definierten Vorspannung im Schichtblock (2), c) Konservieren der Vorspannung durch Legen von Schweißnähten (11) am Schichtblock (2), d) Deponieren von Lot im Bereich des Schichtblockes (2) und e) Löten des Schichtblockes (2). The invention relates to a method for producing a soldered and welded Schichtwärmeübertragers 1, consisting of a separation and cover plates (7, 8, 9, 10) having layer block (2) and to the layer block (1) connectable collecting boxes (3, 4, 5 , 6). The following, preferably successive, process steps are proposed: a) stacking the separating and covering plates (7, 8, 9, 10) into a layer block (2), b) applying a defined compressive force on opposite sides (cover plates 7, 8) of the C) Preserving the prestressing by laying welds (11) on the layer block (2), d) depositing solder in the region of the layer block (2) and e) soldering the layer (2) and generating a defined prestress in the layer block (2) Layer block (2).

Wave soldering device with a light emiiting device and a camera

The wave solder apparatus comprises a solder reservoir (4), a pump (5), a nozzle (6), a device (8) for transporting a printed circuit board (1) and a cover. The pump conveys solder from the reservoir through the nozzle, so that a hollow shaft is produced. A sensor is intended for monitoring the hollow shaft and comprises an illumination unit and a camera, which are housed in the cover. The illumination unit comprises a light source and a matted glass, transfers red light, and illuminates the hollow shaft with diffused light. The camera is directed to the hollow shaft. The wave solder apparatus comprises a solder reservoir (4), a pump (5), a nozzle (6), a device (8) for transporting a printed circuit board (1) and a cover. The pump conveys solder from the reservoir through the nozzle, so that a hollow shaft is produced. A sensor is intended for monitoring the hollow shaft and comprises an illumination unit and a camera, which are housed in the cover. The illumination unit comprises a light source and a matted glass, transfers red light, and illuminates the hollow shaft with diffused light. The camera is directed to the hollow shaft. A unit is intended for evaluating the images provided by the camera. The camera is housed in the area of the cover, which is separated from the hollow shaft by a glass pane.

Process for protecting the surface of a solder bath

Zum Schutz der Oberfläche eines Lötbads wird ein Abdeckmittel mit zwei übereinander angeordneten, bei Löttemperatur flüssigen, ineinander unlöslichen Phasen (3, 4) verwendet. Die untere Phase (3) entsteht durch Einstreuen eines Pulvers einer bei Zimmertemperatur festen, bei Löttemperatur flüssigen chemisch aktiven Komponente aus Sebacin- und/oder Korksäure oder deren Estern in die obere Phase (4), die aus einem flüssigen, synthetischen Polyalphaolefin besteht. To protect the surface of a soldering bath, a covering agent is used with two phases (3, 4) which are arranged one above the other and are liquid and insoluble in one another at the soldering temperature. The lower phase (3) is formed by sprinkling a powder of a chemically active component of sebacic and / or suberic acid or its esters which is solid at room temperature and liquid at the soldering temperature into the upper phase (4), which consists of a liquid, synthetic polyalphaolefin.

내연 기관용 피스톤에 링 부재를 고정하기 위한 방법

본 발명은 내연 기관용 피스톤(1)에 링 부재(6)를 고정하기 위한 방법에 관한 것이다. 이 방법에서는 링 부재(6)가 피스톤 헤드(9) 부분(23)의 방사상 외측면에 형성된 나사산(5)을 통해 피스톤 베이스 바디(4)에 조여지며, 피스톤 헤드(9)에서 나사산(5)의 영역에는 위로 열리고 둘레로 뻗은 그루브(24)가 형성되고, 그루브(24)는 납땜 재료(26)로 채워지며, 납땜 재료(26)가 액화되고 나사산(5)의 틈새 사이로 흐를 때까지 피스톤(1)이 가열되고 이어서 피스톤(1)이 냉각된다. 이를 통해 피스톤 베이스 바디(4)와 링 부재(6) 사이에 견고한 나사 연결부가 형성된다. 또한 이를 통해 냉각 채널(14)이 피스톤 헤드(9)에 작용하는 고압의 연소 가스에 대해 밀폐된다.

The welding method of target material assembly

一种靶材组件的焊接方法，包括：提供铝靶材坯料和背板；利用熔融的锌锡焊料对铝靶材坯料的焊接面进行表面浸润处理；利用熔融的铟焊料对背板的焊接面进行表面浸润处理；利用锌锡焊料和铟焊料将表面浸润处理后的所述铝靶材坯料的焊接面与背板的焊接面焊接在一起。本发明中靶材组件的焊接方法有效提高了铝靶材坯料与背板的结合率以及焊接强度，使铝靶材坯料与背板的结合率达到97%以上，可有效降低焊接出来的靶材组件发生脱靶或者变形的几率。

Soldering process

본 발명은 특히 무연 솔더링에 있어서, 원 위치에서 용융 솔더를 정제하고 솔더링 공정의 효율을 높임으로써 보다 양호한 결과를 제공하는 방법에 관한 것이다. 신뢰성 있는 솔더링을 위한 온도가 저하되기 때문에 무연 솔더가 실용성을 가지게 된다. 솔더로부터 금속 산화물을 제거하고 액체층 속으로 금속 산화물을 흡수융합하기 위해 활성 첨가제의 층을 용융 솔더의 표면에 유지시킨다. 활성 첨가제는 친핵성 및/또는 친전자성 기를 가진 유기 액체이다. 일례로서, 웨이브 솔더링 장치에 유지시키는 이량체 산의 층은 배스로부터 금속 산화물을 제거하여 표면 상에 형성될 수 있는 드로스를 흡수융합한다. 금속 산화물을 제거함으로써 배스가 세정되고 솔더의 점도가 저하되어, 웨이브 상에서 솔더링되는 인쇄회로 기판 등은 신뢰성 있는 솔더 조인트를 갖게 된다. 용융 솔더, 활성 첨가제, 금속 산화물, 드로스, 이량체 산, 삼량체, 친핵성 말단기, 친전자성 말단기 The present invention is particularly directed to methods for providing better results by purifying molten solder in situ and increasing the efficiency of the soldering process, particularly for lead-free soldering. Lead-free solders become practical because the temperature for reliable soldering decreases. A layer of active additive is maintained on the surface of the molten solder to remove the metal oxide from the solder and absorb and fuse the metal oxide into the liquid layer. Active additives are organic liquids having nucleophilic and / or electrophilic groups. As an example, a layer of dimer acid held in a wave soldering device absorbs and fuses dross that may be formed on a surface by removing metal oxide from the bath. By removing the metal oxide, the bath is cleaned and the viscosity of the solder is lowered, so that a printed circuit board or the like soldered on the wave has a reliable solder joint. Molten solder, active additives, metal oxides, dross, dimer acids, trimers, nucleophilic end groups, electrophilic end groups

Wave Soldering Method And Apparatus

본 발명은 회로 기판을 웨이브 솔더링하는 장치 및 방법에 관한 것이다. 회로 기판(26)은 땜납 저장 용기내에 형성된 땜납 웨이브(16)를 통해 컨베이어(30)에 의해 이송됨에 따라 웨이브 솔더링된다. 땜납 웨이브의 양 측부에는 차폐 가스(shield gas)를 배출하는 가스 플리넘(240,250)이 배치된다. 각 가스 플리넘은 상단벽(245,255), 측벽(246,254) 및 하단벽(243,253)을 포함한다. 측벽은 땜납 웨이브와 이격되고 하단벽은 땜납(11)내에 잠긴다. 측벽 및 상단벽(선택적이다)은 차폐 가스를 (i) 땜납 웨이브를 차폐 가스 분위기로 차폐하기 위해 땜납 웨이브를 향해 고속으로 배출하고 (ii) 회로 기판의 하부에 있는 공기를 제거하기 위해 회로 기판의 하부를 향해 저속으로 배출한다. 하단벽을 땜납내에 담그는 대신에, 하단벽은 땜납과 이격되어 배치될 수 있고, 땜납 위쪽에 비활성 분위기를 만들기 위해 플리넘과 땜납 저장 용기 사이를 향해 하방으로 차폐 가스를 방출하는 오리피스를 구비한다. 플리넘내의 분리부(70,270)는 플리넘내의 각 벽의 오리피스와 연통하는 소챔버를 형성하여, 속도가 다른 가스가 오리피스로부터 유입되게 할 수 있다. 가스 플리넘은 회전 방향으로 조절될 수 있고, 수직 및 수평 방향으로도 조절될 수 있다. The present invention relates to an apparatus and method for wave soldering a circuit board. The circuit board 26 is wave soldered as it is conveyed by the conveyor 30 through the solder wave 16 formed in the solder storage container. On both sides of the solder wave, gas plenums 240 and 250 for discharging shield gas are disposed. Each gas plenum includes top walls 245 and 255, sidewalls 246 and 254 and bottom walls 243 and 253. The side wall is spaced apart from the solder wave and the bottom wall is immersed in the solder 11. The side walls and the top wall (optional) allow the shielding gas to be discharged at high speed toward the solder wave (i) to shield the solder wave into the shielding gas atmosphere and (ii) to remove air at the bottom of the circuit board. Discharge at low speed toward the bottom. Instead of immersing the bottom wall into the solder, the bottom wall can be spaced apart from the solder and has an orifice that discharges shielding gas downwardly between the plenum and the solder reservoir to create an inert atmosphere above the solder. Separations 70 and 270 in the plenum form small chambers in communication with the orifices of each wall in the plenum, allowing gas of different rates to flow from the orifice. The gas plenum can be adjusted in the direction of rotation and can also be adjusted in the ...

PROCESS AND APPARATUS FOR THE WAVE SOLDERING OF CIRCUIT BOARDS

본 발명은 회로 기관을 웨이브 솔더링하는 장치 및 방법에 관한 것이다. 회로 기판(26)은 땜납 저장 용기내에 형성된 땜납 웨이브(16)를 통해 컨베이어(30)에 의해 이송됨에 따라 웨이브 솔더링된다. 땜납 웨이브의 양측부에는 차폐 가스(shield gas)를 배출하는 가스 플리넘(240,250)이 배치된다. 각 가스 플리넘은 상단벽(245,255), 측벽(246,254) 및 하단벽(243,253)을 포함한다. 측벽은 땜납 웨이브와 이격되고 하단벽은 땜납(11)내에 잠긴다. 측벽 및 상단벽(선택적이다)은 차폐 가스를 (i) 땜납 웨이브를 차폐 가스 분위기로 차폐하기 위해 땜납 웨이브를 향해 고속으로 배출하고 (ii) 회로 기판의 하부에 있는 공기를 제거하기 위해 기판의 하부를 향해 저속으로 배출한다. 하단벽을 땜납내에 담그는 대신에, 하단벽은 땜납과 이격되어 배치될 수 있고, 땜납 위쪽에 비활성 분위기를 만들기 위해 플리넘과 땜납 저장 용기 사이를 향해 하방으로 차폐 가스를 방출하는 오리피스를 구비한다. 플리넘내의 분리부(70,270)는 플리넘내의 각 벽의 오리피스와 연통하는 소챔버를 형성하여, 속도가 다른 가스가 오리피스로부터 유입되게 할 수 있다. 가스 플리넘은 회전 방향으로 조절될 수 있고, 수직 및 수평 방향으로도 조절도리 수 있다.

Circuit board wave soldering method and apparatus

METHOD OF SOLDERING BY FUSIBLE SOLDER

ÐÎÑÑÈÉÑÊÀß ÔÅÄÅÐÀÖÈß (19) RU (11) 2006 140 378 (13) A (51) ÌÏÊ B23K 31/02 (2006.01) ÔÅÄÅÐÀËÜÍÀß ÑËÓÆÁÀ ÏÎ ÈÍÒÅËËÅÊÒÓÀËÜÍÎÉ ÑÎÁÑÒÂÅÍÍÎÑÒÈ, ÏÀÒÅÍÒÀÌ È ÒÎÂÀÐÍÛÌ ÇÍÀÊÀÌ (12) ÇÀßÂÊÀ ÍÀ ÈÇÎÁÐÅÒÅÍÈÅ (21), (22) Çà âêà: 2006140378/02, 18.04.2005 (71) Çà âèòåëü(è): Ï. ÊÅÉ ÌÅÒÀË, ÈÍÊ. (US) (30) Êîíâåíöèîííûé ïðèîðèòåò: 16.04.2004 US 60/562,964 14.09.2004 US 60/609,589 (85) Äàòà ïåðåâîäà çà âêè PCT íà íàöèîíàëüíóþ ôàçó: 16.11.2006 (87) Ïóáëèêàöè PCT: WO 2005/110657 (24.11.2005) R U (54) ÑÏÎÑÎÁ ÏÀÉÊÈ ËÅÃÊÎÏËÀÂÊÈÌ ÏÐÈÏÎÅÌ (57) Ôîðìóëà èçîáðåòåíè 1. Ñïîñîá ïàéêè, â êîòîðîì íà ïîâåðõíîñòè ðàñïëàâëåííîãî ïðèïî â óñòðîéñòâå ïàéêè ïîääåðæèâàþò ñëîé æèäêîñòè, è ïà þò îáúåêò ñ èñïîëüçîâàíèåì ðàñïëàâëåííîãî ïðèïî , îòëè÷àþùèéñ òåì, ÷òî óïîì íóòà æèäêîñòü ñîäåðæèò äèìåðíóþ êèñëîòó. 2. Ñïîñîá ïî ï.1, êîòîðûé ïðåäñòàâë åò ñîáîé ïàéêó âîëíîé ïðèïî , ïàéêó ôîíòàíîì ïðèïî , êàñêàäíóþ ïàéêó èëè ïàéêó ïîãðóæåíèåì, ëèáî âûðàâíèâàíèå ïðèïî ãîð ÷èì âîçäóøíûì íîæîì. 3. Ñïîñîá ïî ï.1, â êîòîðîì ðàñïëàâëåííûé ïðèïîé ïðåäñòàâë åò ñîáîé áåññâèíöîâûé ïðèïîé, è âàííà ðàñïëàâëåííîãî ïðèïî íàõîäèòñ ïðè òåìïåðàòóðå íå áîëåå 260°Ñ. 4. Ñïîñîá ïî ï.1, â êîòîðîì äèìåðíà êèñëîòà èìååò óãëåðîäíîå ÷èñëî â äèàïàçîíå îò 24 äî 60, ïðè ýòîì ââîä ò êîëè÷åñòâî äèìåðíîé êèñëîòû, äîñòàòî÷íîå äë ïîãëîùåíè îêñèäà ïî ìåðå åãî îáðàçîâàíè íà ïîâåðõíîñòè ðàñïëàâëåííîãî ïðèïî . 5. Ñïîñîá ïî ï.1, â êîòîðîì ïà åìûé îáúåêò ïðèâîä ò â êîíòàêò ñ îáëàñòüþ ðàñïëàâëåííîãî ïðèïî , êîòîðà íå ñîäåðæèò êàêîãî-ëèáî âèäèìîãî êîëè÷åñòâà äèìåðíîé êèñëîòû. 6. Ñïîñîá ïî ï.1, â êîòîðîì äèìåðíà êèñëîòà, ïëàâàþùà íà ïîâåðõíîñòè âàííû ðàñïëàâëåííîãî ïðèïî , ïîãëîùàåò øëàê ñ óïîì íóòîé ïîâåðõíîñòè. 7. Ïà íîå ñîåäèíåíèå, âûïîëíåííîå â ñîîòâåòñòâèè ñî ñïîñîáîì ïî ëþáîìó èç ïï.1-6. 8. Ñïîñîá ïàéêè, ñîäåðæàùèé ñëåäóþùèå ýòàïû: ïîääåðæèâàíèå ñëî æèäêîé äîáàâêè íà ïîâåðõíîñòè ðàñïëàâëåííîãî ïðèïî â óñòðîéñòâå ïàéêè âîëíîé ïðèïî , ïàéêè ôîíòàíîì ïðèïî èëè êàñêàäíîé ïàéêè; Ñòðàíèöà: 1 RU A 2 0 0 6 1 4 0 3 7 8 A Àäðåñ äë ïåðåïèñêè: 129010, Ìîñêâà, óë. Á. ...

Apparatus and method for soldering flat work piece

본 발명은, 용융 땜납을 수용하는 땜납조(109), 상기 융융 땜납의 평면형상 오버플로잉 웨이브가 형성되는 납땜 챔버(106c)를 내장한 케이싱(106), 상기 케이싱과 함께 이동이 가능하도록 일체로 이루어지고 상기 납땜 챔버(106c)를 통해 인쇄회로기판(3)을 운반하도록 작동가능한 컨베이어(107), 상기 케이싱(106)을 상하 이동시키는 작동자들(118 및 119), 상기 납땜 챔버(106c)에 불활성가스를 공급하는 불활성가스공급기(114a), 및 상기 작동자의 작동을 제어하는 제어수단을 포함하고, 상기 인쇄회로기판(3)은 납땜 챔버(106c)를 통과하는 동안 불활성가스 분위기의 평면형상 오버플로잉 웨이브의 표면과 접하는 것을 특징으로 하는 납땜장치에 관한 것이다. The present invention relates to a solder bath (109) for accommodating molten solder, a casing (106) containing a solder chamber (106c) in which a planar overflowing wave of the molten solder is formed, and integrally movable together with the casing. And a conveyor 107 operable to carry the printed circuit board 3 through the soldering chamber 106c, the operators 118 and 119 to move the casing 106 up and down, and the soldering chamber 106c. Inert gas supply (114a) for supplying an inert gas, and control means for controlling the operation of the operator, the printed circuit board 3 is a plane of the inert gas atmosphere while passing through the soldering chamber (106c) A soldering apparatus characterized by being in contact with the surface of a shape overflowing wave. 반송 컨베이어, 납땜 챔버, 땜납조, 용융 땜납, 오버플로잉 웨이브 Conveyor Conveyor, Soldering Chamber, Solder Bath, Molten Solder, Overflowing Wave

Soldering device and method, and manufactured substrate and electronic component

전극(2)을 갖는 부품(10)을 세팅하는 제 1처리부(110)와, 개폐수단(119)에 의해 구획되고 부품(10)을 제 3처리부(130)로 이송하는 제 2처리부(120)와, 개폐수단(129)에 의해 구획되고 부품(10)을 유기지방산 함유용액(131)에 접촉시켜서 수평 이동하는 제 3처리부(130)와, 부품(10)을 공간부(143)로 이동하여 전극(2)에 용융땜납(5)을 부착시키는 수단(33) 및 잉여의 용융땜납(5)을 제거하는 수단(34)을 갖는 제 4처리부(140)와, 제 4처리부(140)에서 하방으로 이동된 부품(10)을 수평 이동하는 제 5처리부(150)와, 개폐수단(159)에 의해 구획되고 부품(10)을 제 7처리부(170)로 이송하는 제 6처리부(160)와, 개폐수단(169)에 의해 구획되고 부품(10)을 취출하는 제 7처리부(170)를 갖는 납땜장치(100)에 의해서 낮은 코스트로 수율이 높고, 신뢰성이 높은 납땜을 할 수 있는 공간 절약형 납땜을 실행한다. The first processing unit 110 for setting the component 10 having the electrode 2, and the second processing unit 120 partitioned by the opening and closing means 119 and transferring the component 10 to the third processing unit 130. And a third processing unit 130 partitioned by the opening and closing means 129 and horizontally moving the component 10 in contact with the organic fatty acid-containing solution 131, and moving the component 10 to the space portion 143. A fourth processing unit 140 having a means 33 for attaching the molten solder 5 to the electrode 2 and a means 34 for removing the excess molten solder 5 and a lower portion from the fourth processing unit 140. A fifth processing unit 150 for horizontally moving the component 10 moved to the second, a sixth processing unit 160 partitioned by the opening and closing means 159 and transferring the component 10 to the seventh processing unit 170, The soldering apparatus 100 having the seventh processing unit 170 which draws out the part 10 by the opening and closing means 169 allows a space-saving soldering with high yield and high reliability at low cost. Execution do.

Soldering equipment in an inert atmosphere

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

[과제] 저비용으로, 제품 수율이 높고, 신뢰성이 높은 납땜을 실시할 수 있고는 납땜 장치 및 방법을 제공한다. [해결 수단] 동전극(2)을 갖는 피처리 부재(10)를 유기 지방산 함유 용액(31)에 침지하고, 침지한 피처리 부재(10)를 유기 지방산 함유 용액(31) 중에서 수평 이동하는 제1 처리부와, 처리한 피처리 부재(10)를 윗방향의 증기 분위기의 공간부(24)로 끌어올리면서, 피처리 부재(10)를 향해서 용융 땜납(5a)의 기류(5')를 분사하는 분사 수단(33)을 구비한 제2 처리부와, 처리한 피처리 부재(10)를 공간부(24) 중에서 수평 이동한 후에 유기 지방산 함유 용액(31) 중으로 강하시키면서, 피처리 부재(10) 상의 잉여의 용융 땜납(5a)에 유기 지방산 함유 용액(31)을 분사하여 제거하는 분사 수단(34)을 구비한 제3 처리부와, 처리한 피처리 부재(10)를 유기 지방산 함유 용액(31) 중에서 수평 이동한 후에 윗방향으로 끌어올려 용액 밖으로 꺼내는 제4 처리부를 구비한 납땜 장치에 의해 상기 과제를 해결했다. [PROBLEMS] To provide a soldering apparatus and method capable of performing soldering with a high product yield and high reliability at a low cost. An object to be treated 10 having a copper electrode 2 is immersed in an organic fatty acid containing solution 31 and an immobilized agent 10 for horizontally moving the immersed object 10 in an organic fatty acid- (5 ') of the molten solder (5a) toward the member to be treated (10) while raising the treated member (10) to the space portion (24) And a spraying means 33 for spraying the material to be treated 10 while the processed object 10 is horizontally moved in the space portion 24 and then dropped into the organic fatty acid containing solution 31. [ And a spraying means 34 for spraying and removing the organic fatty acid-containing solution 31 to the surplus molten solder 5a on the surface of the object to be treated 10, And a fourth processing unit for taking out the solution out of the solution Thereby solving the above problems.

Welding and shaping integrated method for circular titanium target and back plate

本发明涉及一种圆形钛靶材和背板的焊接整形一体化方法，所述一体化方法包括：分别在圆形钛靶材的焊接面和背板的焊接面上浸润熔化的焊料，并将两者的焊接面相贴合，且所述圆形钛靶材位于所述背板的上方；在所述圆形钛靶材的上方放置垫块，并在所述垫块的上方进行加压操作；经冷却后撤去所述加压操作，得到圆形钛靶材组件。本发明所述一体化方法，可以在焊接的同时对圆形钛靶材的平面度进行校正，避免了后续额外的整形操作，同时达到圆形钛靶材组件的焊接结合度要求和平面度要求，使得焊接结合度≥99％且平面度≤0.3mm，同时提高了焊接合格率和整形合格率。

Flux management system for wave soldering machine and method for removing contaminants

Jet solder bath and jet soldering equipment

Jet solder vessel

一种喷流焊锡槽，如下地构成：在焊锡槽主体(1)内形成有焊锡输送室(2)，在焊锡输送室内比液面水平面(L)更为下侧处设置有入口(3)，并且在比液面水平面(L)更为上侧处设置有出口(4)，在入口安装有螺杆泵(5)，沿着壳体的贯通方向送入焊锡，并且所述螺杆泵(5)在壳体(12)所贯通的内部空间(13)中可以旋转地设置有螺杆(14)，螺杆将多片螺旋叶片(21)在圆周方向上等间隔地突出在旋转轴(20)的外侧，并且在从轴线方向看的情况下以所有的螺旋叶片包围旋转轴的整周。

Welding method of brittle target material

本发明涉及一种脆性靶材的焊接方法，先将脆性靶坯的焊接面与辅助压块的第一平面相接触并进行绑定，所述第一平面与所述溅射面的形状尺寸相同，再将绑定脆性靶坯、背板以及焊料进行加热，利用熔化后的焊料对焊接面进行浸润处理，随后将浸润处理后的绑定脆性靶坯扣合在浸润处理后的背板上，实现焊接面之间的接触，在所述辅助压块的第二表面上放置压块并冷却，将所述辅助压块取下，得到脆性靶材。本发明所述脆性靶材的焊接方法通过将脆性靶坯与辅助压块进行绑定，不仅有效解决了扣合后焊料残存空气而被氧化的问题，使得焊接结合率≥97％，平面度＜1mm，还有效防止了靶坯开裂，满足磁控溅射的使用要求。

Solder bath and method of heating solder contained in the solder bath

【課題】はんだ槽のはんだ槽本体に収容されたはんだをできるだけ均一に加熱して溶融することができるはんだ槽及び加熱方法を提供する。 【解決手段】はんだ４を収容するはんだ槽本体２と、はんだ槽本体２の底面の外面及び側面の外面に装着されてはんだ４を加熱するための加熱部材３とを備えるはんだ槽１である。加熱部材３は、底面の外面及び側面の外面に当接して装着されるステンレス鋼からなる熱拡散板９と、熱拡散板９に当接して装着される発泡セラミックスからなる断熱体１０と、断熱体１０の内部に熱拡散板９から離間して埋設される発熱抵抗体９とにより構成される。 【選択図】図１

Jet solder tank

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Low temperature high reliability tin alloy for soldering

무연 무안티몬 솔더 합금으로서, (a) 1 내지 4중량%의 은, (b) 0.5 내지 6중량%의 비스무트, (c) 3.55 내지 15중량%의 인듐, (d) 3중량% 이하의 구리, (e) 임의로 아래의 원소들 중의 하나 이상: 0 내지 1중량%의 니켈, 0 내지 1중량%의 티타늄, 0 내지 1중량%의 망간, 0 내지 1중량%의 희토류 원소, 예를 들면 세륨, 0 내지 1중량%의 크롬, 0 내지 1중량%의 게르마늄, 0 내지 1중량%의 갈륨, 0 내지 1중량%의 코발트, 0 내지 1중량%의 철, 0 내지 1중량%의 알루미늄, 0 내지 1중량%의 인, 0 내지 1중량%의 금, 0 내지 1중량%의 텔루륨, 0 내지 1중량%의 셀레늄, 0 내지 1중량%의 칼슘, 0 내지 1중량%의 바나듐, 0 내지 1중량%의 몰리브덴, 0 내지 1중량%의 백금, 0 내지 1중량%의 마그네슘, (f) 잔여량의 주석을 임의의 불가피한 불순물과 함께 포함하는, 무연 무안티몬 솔더 합금. A lead-free antimony solder alloy comprising: (a) 1 to 4 weight percent silver, (b) 0.5 to 6 weight percent bismuth, (c) 3.55 to 15 weight percent indium, (d) (e) optionally one or more of the following elements: 0 to 1 wt% nickel, 0 to 1 wt% titanium, 0 to 1 wt% manganese, 0 to 1 wt% rare earth elements such as cerium, 0 to 1 wt.% Chromium, 0 to 1 wt.% Germanium, 0 to 1 wt.% Gallium, 0 to 1 wt.% Cobalt, 0 to 1 wt.% Iron, 0 to 1 wt. 0 to 1 wt% of phosphorus, 0 to 1 wt% of gold, 0 to 1 wt% of tellurium, 0 to 1 wt% of selenium, 0 to 1 wt% of calcium, 0 to 1 wt% of vanadium, 0 to 1 0 to 1 wt.% Of magnesium, 0 to 1 wt.% Of magnesium, and (f) balance of tin with any inevitable impurities.

Fluxless application of a metal comprising coating

내용 없음. No content.

Lead-free and antimony-free tin solder reliable at high temperatures

(a) 10 중량% 이하의 은, (b) 10 중량% 이하의 비스무트, (c) 3 중량% 이하의 구리, (d) 하기 원소들 중 적어도 하나, 1 중량% 이하의 니켈, 1 중량% 이하의 티탄, 1 중량% 이하의 코발트, 3.5 중량% 이하의 인듐, 1 중량% 이하의 아연, 1 중량% 이하의 비소, (e) 임의적으로, 하기 원소들 중 하나 이상, 0 내지 1 중량%의 망간, 0 내지 1 중량%의 크롬, 0 내지 1 중량%의 게르마늄, 0 내지 1 중량%의 철, 0 내지 1 중량%의 알루미늄, 0 내지 1 중량%의 인, 0 내지 1 중량%의 금, 0 내지 1 중량%의 갈륨, 0 내지 1 중량%의 텔루륨, 0 내지 1 중량%의 셀레늄, 0 내지 1 중량%의 칼슘, 0 내지 1 중량%의 바나듐, 0 내지 1 중량%의 몰리브덴, 0 내지 1 중량%의 백금, 0 내지 1 중량%의 마그네슘, 0 내지 1 중량%의 희토류 원소, (f) 임의의 불가피한 불순물들과 함께, 잔부의 주석을 포함하는 무납, 무안티몬 땜납 함금.

The partial soldering method of the printed circuits board and the apparatus thereof

종래의 인쇄기판의 부분 납땜은, 소정의 부분에 부분적으로 플럭스를 도포하여 예비 가열하고 그리고 용융 땜납을 부착하는 것이 곤란하여 불필요한 부분에 플럭스나 땜납이 부착되어버리는 경우가 있었다. 본 발명은 인쇄기판의 필요한 부분에만 플럭스를 도포하고, 용융 땜납을 부착시킬 수 있는 부분 납땜 방법과 부분 납땜장치를 제공하는 것이다. 인쇄기판을 주행시키는 반송장치의 하방에는 플럭서, 프리히터, 분류납땜조가 설치되어 있고, 인쇄기판에 납땜이 필요한 부분에 대응되는 분무 노즐, 가열부, 분류 노즐이 일정한 간격으로 설치되어 있다. 그리고 인쇄기판을 푸셔에 의해 일정한 거리만큼 이동시킴으로써, 납땜이 필요한 부분이 반드시 분무 노즐, 가열부, 분류 노즐과 동일한 위치가 되어 다른 부분에는 플럭스나 용융 땜납이 부착되지 않는다.

Lead-free and antimony-free tin solder reliable at high temperatures

(a) 10 중량% 이하의 은, (b) 10 중량% 이하의 비스무트, (c) 3 중량% 이하의 구리, (d) 하기 원소들 중 적어도 하나, 1 중량% 이하의 니켈, 1 중량% 이하의 티탄, 1 중량% 이하의 코발트, 3.5 중량% 이하의 인듐, 1 중량% 이하의 아연, 1 중량% 이하의 비소, (e) 임의적으로, 하기 원소들 중 하나 이상, 0 내지 1 중량%의 망간, 0 내지 1 중량%의 크롬, 0 내지 1 중량%의 게르마늄, 0 내지 1 중량%의 철, 0 내지 1 중량%의 알루미늄, 0 내지 1 중량%의 인, 0 내지 1 중량%의 금, 0 내지 1 중량%의 갈륨, 0 내지 1 중량%의 텔루륨, 0 내지 1 중량%의 셀레늄, 0 내지 1 중량%의 칼슘, 0 내지 1 중량%의 바나듐, 0 내지 1 중량%의 몰리브덴, 0 내지 1 중량%의 백금, 0 내지 1 중량%의 마그네슘, 0 내지 1 중량%의 희토류 원소, (f) 임의의 불가피한 불순물들과 함께, 잔부의 주석을 포함하는 무납, 무안티몬 땜납 함금.

Soldering method

납땜 랜드 및 도금된 관통 구멍을 포함하는 인쇄 회로 기판 상으로 전자 소자의 표면 상에 형성된 팔라듐 또는 팔라듐 합금층과 납땜 리드 단자를 포함하는 전자 소자를 납땜하기 위한 납땜 방법에서, 주 성분으로 주석 및 아연을 함유한 땜납층이 HAL 처리에 의해 랜드 관통 구멍의 표면 상에 형성된다. 리드 단자는 관통 구멍에 삽입되어 장착된다. 인쇄 회로 기판은 주 성분으로 주석 및 아연을 함유한 땜납의 분류 유동과 접촉함으로써 랜드 및 관통 구멍에 땜납을 공급한다. In a soldering method for soldering an electronic device comprising a solder lead terminal and a palladium or palladium alloy layer formed on a surface of the electronic device onto a printed circuit board comprising a solder land and plated through holes, tin and zinc as main components The solder layer containing is formed on the surface of the land through hole by HAL processing. The lead terminal is inserted into the through hole and mounted. The printed circuit board supplies solder to the lands and through-holes by contacting the fractional flow of solder containing tin and zinc as main components. 납땜 랜드, 관통 구멍, 인쇄 회로 기판, 팔라듐 합금층, 납땜 리드 단자, HAL 처리 Solder Land, Through Hole, Printed Circuit Board, Palladium Alloy Layer, Solder Lead Terminals, HAL Treatment

Brazing equipment

一种钎焊设备，特别是用于有选择的行波焊的钎焊坩埚，带有被设计用来保存焊料特别是液态焊料的焊料储备器，带有钎焊喷嘴，且带有被设计用来把来自焊料储备器的焊料经由钎焊喷嘴输送的焊料泵，其中，钎焊设备具有上部件和下部件，其中，上部件可松开地可与下部件连接，且具有焊料储备器和钎焊喷嘴，其中，在上部件中设置了焊料泵的输送通道，其中，在下部件中设置了用于产生焊料泵的移动的磁场的装置，该装置被设计用于沿着输送通道产生移动的磁场。

Process and apparatus and panel heater for soldering electronic components to printed circuit board

In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit boad, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit boad with the first heater; and heating the electronic component with the second heater; wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.

Multi stage heater

A multi stage heater heats items on a conveyor so that they follow a predetermined temperature profile. The heater is used for printed circuit boards or the like when heated for soldering and avoids thermal gradients that can occur with heating different materials. The heater has a first heater for applying a first quantity of heat to items on the conveyor, a temperature sensing device for determining temperature of items leaving the first heater, a second heater downstream of the first heater and a control system which compares signals from the temperature sensing device with a predetermined temperataure profile to produce a first control output to control the first heater and a second control output to control the second heater so that items passing through the heater follow the predetermined temperature profile.

Control device for automatic soldering system

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering

In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit board, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit board with the first heater; and heating the electronic component with the second heater; wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.

Solder jet device, method for manufacturing solder jet device, and method for soldering electronic components

半田槽２と、加熱手段として面状ヒーター３及び管ヒーター４と、半田１０を吹き付けるノズル５１，５２が突設され、半田槽２内に昇降自在に取り付けられた半田吹出し手段５と、この半田吹出し手段５に半田１０を供給する半田供給手段６と、半田付けするとき、ノズル５１，５２を半田槽２の半田液面１１より上昇させ、かつ、待機するとき、ノズル５１，５２を半田槽２の半田液面１１より降下させる昇降手段７と、電気回路基板１００を所定の位置に位置決めする載置板８とを具備した構成としてある。 The solder tank 2, the sheet heater 3 and the tube heater 4 as heating means, the nozzles 51 and 52 for spraying the solder 10, and the solder blowing means 5 mounted in the solder tank 2 so as to be movable up and down, and the solder The solder supply means 6 for supplying the solder 10 to the blowing means 5 and the nozzles 51 and 52 are raised from the solder liquid surface 11 of the solder tank 2 when soldering and the nozzles 51 and 52 are set in the solder tank when waiting. The lifting / lowering means 7 for lowering from the solder liquid level 11 and the mounting plate 8 for positioning the electric circuit board 100 at a predetermined position are provided.

Method and apparatus for wave soldering of an assembly

본 발명은 운송수단(10)에 의해서 솔더링 장치(13)로 유도되고, 솔더(16)를 난류영역에서 먼저 난류 솔더링 웨이브(20)를 통해서 운송방향(11)으로 예각(α 1 )을 이루며 추진하고, 그 후의 정류 솔더링 웨이브(22)를 통해서 거의 직각을 이루며 조립체(12)를 향하여 추진하는 조립체의 웨이브 솔더링 방법에 관한 것이다. 솔더점이 냉각되는 것과 솔더에 의해 적셔지지 않은 가리워지는 부위의 발생을 피하기 위해서, 본 발명은 부가로 솔더(16)를 난류영역에서 제2난류 웨이브(21)를 통해서 반운송방향으로 조립체(12)를 향하여 예각(α 1 )을 이루며 추진한다.

TIN SOLDERING MACHINE WITH SHAFT PROTECTION DEVICE.

Shield gas wave soldering

A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a gas blanket over the solder, reduction in dross occurs and improved soldering results avoiding the necessity of removing flux residues. Gas diffusers are provided on both sides of a solder wave in an enclosure, the diffusers are placed below the path of the element to be soldered and a further gas diffuser is positioned above the element to be soldered. The gas diffusers supply a calm gas blanket over the solder wave so no turbulent movement of gas occurs within the enclosure.

Shield gas wave soldering

A wave soldering apparatus and process occurs in an atomsphere which substantially excludes oxygen. By providing a gas blanket over the solder, reduction in dross occurs and improved soldering results avoiding the necessity of removing flux residues. Gas diffusers are provided on both sides of a solder wave in an enclosure, the diffusers are placed below the path of the element to be soldered and a further gas diffuser is positioned above the element to be soldered. The gas diffusers supply a calm gas blanket over the solder wave so no turbulent movement of gas occurs within the enclosure.

Wave-soldering using a shroud for a gas

A cover plate (28) extends over at least part of a solder reservoir (34) and has a slot (30) for a solder wave (22) to extend up above the cover plate (28). Shield gas is supplied under the cover plate (28) to blanket the solder wave (22) and prevent air from contacting the solder wave (22) and circuit boards (44) passing through the solder wave (22). Circuit boards (44) are generally supported by conveyor fingers (41, 42) at side edges and the fingers (41, 42) pass through the solder wave (22). End shrouds (50, 64) are provided at both ends of the solder wave (22) to prevent the entry of air through the conveyor fingers (41, 42) and to ensure that the side edges of the circuit board (44) are uniformly blanketed by shield gas directed to the side edges passing up through the slot (30) in the cover plate (28). The under surface, front edge, back edge and side edges of a circuit board (44) are therefore uniformly blanketed by shield gas as the board passes through a solder wave (22).

Solder nozzle with gas knife jet

A solder nozzle to produce a smooth turbulent free solder wave has at least one air jet associated therewith to remove solder icicles and bridges that can form on the under surface of circuit boards and other elements. The circuit boards move in an upward inclined path in the direction of travel and after passing through the solder wave an air knife projects a non-oxidizing gas with sufficient force to remove excess solder. The soldering can occur in a non-oxidizing gas enclosure such as an inert gas, or a reducing gas, and vibrating the solder wave below ultrasonic frequencies can assist in the soldering.

Gas shrouded solder wave with reduced solder splatter

A cover or shroud extends over a solder reservoir and has a slot for a solder wave to protrude therethrough. Gas is provided to blanket the solder wave and the shroud is positioned to reduce solder from contacting elements that are conveyed through the solder wave. The device comprises a solder reservoir having at least one solder nozzle projected therefrom, a pump for forming a solder wave from the nozzle, a cover for covering at least a portion of the reservoir containing the solder wave, the cover having a longitudinal slot for the solder wave to pass therethrough and contain solder splatter caused by the solder wave falling into the solder reservoir. A gas supply provides gas under the cover and also provides a gas blanket over the solder wave, and a conveyor moves the element in a predetermined path over the cover ensuring at least a portion of the element passes through the solder wave.

Soldering system with a protective gas atmosphere over the soldering tape

Lötanlage mit einer das Lötbad (2) enthaltenden Wanne (1), sowie Transportmitteln (3, 4, 22), die elektronische Schaltungen auf einer Bahn nahe der Oberfläche des Lötbades und über eine in dieser erzeugten Lötwelle führen, und mit einer im wesentlichen geschlossenen Haubenanordnung (5, 6, 7), die zumindest eine einlaufseitige Anordnung (6) und eine zentrale Anordnung (5) über der Wanne (1) umfaßt, sowie mit Mitteln zur Erzeugung und Aufrechterhaltung einer nichtoxydierenden Atmosphäre in der Haubenanordnung und über dem Lötbad, dadurch gekennzeichnet, daß die zentrale Anordnung (5) ein Unterteil (9) umfaßt, das an der Wanne (1) im wesentlichen dicht anliegt, und daß zumindest die zentrale Anordnung (5) eine obere Haube (8, 11, 12) umfaßt, in die Gaszuführungen (15) münden und die einen sich über den Transportmitteln erstreckenden, im wesentlichen planen Diffusor (17) enthält, der zwischen den Gaszuführungen (15) und der Bahn liegt, auf der die elektronischen Schaltungen geführt werden. soldering with a soldering bath (2) containing tub (1), as well as means of transport (3, 4, 22), the electronic circuits on a track near the surface of the solder bath and over a generated in this solder wave to lead, and with a substantially closed hood arrangement (5, 6, 7), the at least one inlet-side arrangement (6) and a central arrangement (5) via the tub (1) comprises and with means for producing and maintaining a non-oxidizing the atmosphere in the hood arrangement and over the solder bath, by characterized in that central arrangement (5) comprises a lower part (9), which on the trough (1) in essentially tight, and that at least the central arrangement (5) includes an upper hood (8, 11, 12) in the gas feeds (15) result and the one about the transport means extending, substantially planar diffuser (17) contains, between the gas supply lines (15) and the path on which the electronic circuits are routed.

Wave solder nozzle with an exit trough having a weir, a surface of the through being wettable by solder; a wave soldering machine with such nozzle; a method of improving the flow of solder out of a wave solder nozzle

A wave solder nozzle (42) is capable of delivering solder material to perform a wave soldering operation on a printed circuit board (18) in an inert atmosphere. The wave solder nozzle (42) includes a front plate (48) and a back plate (50) coupled to the front plate (48). The front plate (48) and the back plate (50) define a channel (52) through which solder material (54) flows. The nozzle (42) further includes an exit trough (58) extending from the back plate (52). The exit trough (58) has a weir (60) provided at one end of the exit trough (58). The exit trough (58) is constructed and arranged to control the flow of solder material (54) from the wave solder nozzle (42). A surface of the exit trough (60) is wettable to improve the flow of solder material (54) out of the wave solder nozzle (42). A method of improving the flow of solder material (52) through the nozzle (42) is also disclosed.