11-06-2020 дата публикации
Номер: US20200180060A1
Принадлежит:
A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided. 1. A pallet for use during manufacture of a printed circuit board assembly , the pallet comprising:an inner body configured for positioning on an underside of a circuit board, the inner body defining at least one opening configured to receive a plurality of lead pins of components mounted on the circuit board,wherein the inner body defines geometries feeding into the at least one opening and configured to achieve optimal solder flow to establish connections between the plurality of lead pins.2. The pallet according to claim 1 , wherein the geometries of the pallet include at least one of a channel claim 1 , a tunnel claim 1 , or a ramp feeding into at least one of the openings.3. The pallet according to claim 1 , wherein the geometries of the pallet include at least one of an adjustable component or a replaceable component feeding into at least one of the openings.4. The pallet according to claim 1 , wherein the pallet is formed from a high temperature grade plastic via 3D printing.5. The pallet according to claim 1 , further comprising an outer frame surrounding the inner body. This application is a divisional of U.S. patent application Ser. No. 15/807,125, entitled “WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACTURING” and filed on Nov. 8, 2017, which claims the benefit of, and priority to, U.S. Provisional Patent Application ...
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