СПОСОБ ВЫПОЛНЕНИЯ ПРИ ПОМОЩИ ЛАЗЕРНОГО ПУЧКА ОТВЕРСТИЙ В ДЕТАЛИ, ИЗГОТОВЛЕННОЙ ИЗ КОМПОЗИТНОГО МАТЕРИАЛА С КЕРАМИЧЕСКОЙ ОСНОВОЙ

Изобретение относится к способу выполнения отверстий при помощи лазерного пучка в детали, изготовленной из композитного материала с керамической основой. Способ включает в себя следующие этапы. Первый этап ударного сверления, на котором выполняют исходное отверстие, имеющее начальный диаметр и ось отверстия. Второй этап кольцевого сверления, на котором путем смещения лазерного пучка и вращения его вокруг оси отверстия выполняют промежуточное отверстие, соосное исходному отверстию, но имеющее больший, чем исходное отверстие, диаметр. Третий этап, на котором фокус лазерного пучка смещают вдоль оси отверстия, после чего выполняют окончательное отверстие с использованием импульсного лазерного пучка. Способ предназначен для выполнения отверстий в стенке камеры сгорания, изготовленной из композитного материала с керамической основой, или лопатке турбины турбореактивного двигателя. 10 з.п. ф-лы, 6 ил.

РАЗРЫВНОЙ ДИСК РЕВЕРСИВНОГО ДЕЙСТВИЯ С ОБРАЗУЕМОЙ ЛАЗЕРОМ ЭЛЕКТРОПОЛИРОВАННОЙ ЛИНИЕЙ ОСЛАБЛЕНИЯ И СПОСОБ ФОРМИРОВАНИЯ ЛИНИИ ОСЛАБЛЕНИЯ

Изобретение относится к арматуростроению и предназначено для использования в предохранительных устройствах для защиты систем высокого давления. Устройство для сброса давления содержит разрывной диск реверсивного действия, имеющий образуемую лазером электрополированную линию ослабляющей канавки. Имеются конструктивные варианты такого устройства и способ изготовления относительно тонкого металлического устройства для сброса давления. Этот способ содержит способ формирования электрополированной линии ослабляющей канавки в разрывном диске реверсивного действия, который гарантирует полное открывание диска при реверсировании. Заготовку разрывного диска подвергают предварительному выпучиванию, окончательному выпучиванию и затем обеспечивают слоем резистного материала. Для удаления, по меньшей мере, части слоя резистного материала, соответствующей желаемой линии ослабляющей канавки в вогнутой наружной поверхности выпученного разрывного диска, используют лазер. После этого диск подвергают операции ...

СПОСОБ УПРАВЛЕНИЯ ПРОЦЕССОМ ЛАЗЕРНОЙ РЕЗКИ И УСТРОЙСТВО ЛАЗЕРНОЙ РЕЗКИ ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ

Группа изобретений относится к способу и устройству для лазерной резки. Согласно настоящему изобретению процессом лазерной резки управляют, используя в качестве опорного сигнала одну или несколько линий спектра испускания, характерных для излучения, испускаемого вспомогательным газом или газообразной примесью, находящейся в объеме материала, облучаемого сфокусированным лазерным лучом, сфокусированным лазерной головкой (12), при этом на основании определенного сигнала проводится корректировка по меньшей мере одного из следующих контролируемых параметров: мощность лазерного излучения, частота и коэффициент заполнения лазерных импульсов, давление вспомогательного газа, испускаемого соплом (16), являющимся частью лазерной головки (12), скорость перемещения лазерной головки (12) относительно заготовки (P), расстояние между лазерной головкой (12) и поверхностью (S) заготовки (P), и расстояние между фокусом (F) лазерного луча и поверхностью (S) заготовки (P). Техническим результатом является улучшение ...

ВОЛОКОННАЯ ЛАЗЕРНАЯ СИСТЕМА СО МНОЖЕСТВОМ ПУЧКОВ

Группа изобретений относится к технологии ввода света, выходящего из нескольких волоконных лазерных устройств, в один оптический компонент и управления излучением, выходящим из таких лазерных устройств. Волоконная лазерная система со множеством пучков выходного излучения для создания нескольких пучков выходного излучения волоконного лазера. Система содержит множество модулей волоконной лазерной системы, множество выходных волокон и объемный оптический элемент. Модули волоконной лазерной системы создают множество отдельных пучков выходного излучения волоконного лазера. Соответствующие пучки выходного излучения различаются одной или несколькими характеристиками пучка. Каждое из выходных волокон выполнено с возможностью доставки одного из указанных отдельных пучков выходного излучения волоконного лазера. К объемному оптическому элементу присоединены каждое из указанных выходных волокон. Оптический элемент выполнен с возможностью приема отдельных пучков выходного излучения волоконного лазера ...

ТРУЩАЯСЯ ДЕТАЛЬ В СМАЗОЧНОЙ СРЕДЕ, РАБОТАЮЩАЯ ПРИ КОНТАКТНОМ ДАВЛЕНИИ, ПРЕВЫШАЮЩЕМ 200 МПа

Трущаяся в смазочной среде деталь предназначена для работы при контактном давлении, превышающем 200 МПа. Поверхность детали текстурируют и до или после текстурирования подвергают обработке поверхностного упрочнения для снижения коэффициента трения поверхности детали. Поверхность имеет периодичную сеть микрометрических полостей, большая длина которых составляет от 5 до 500 мкм, а период меньше половины ширины контактирующей поверхности. Глубина упомянутых полостей меньше или равна 3 мкм, что способствует переходу в режим эласто- гидродинамического смазывания. 4 н. и 14 з.п. ф-лы, 4 ил., 3 пр.

СПОСОБ СОЗДАНИЯ РАДУЖНОГО ЭФФЕКТА НА ПОВЕРХНОСТИ МАТЕРИАЛА И УСТРОЙСТВА ДЛЯ ВЫПОЛНЕНИЯ ТАКОГО СПОСОБА

Изобретения относятся к способу и устройству для создания радужного эффекта на поверхности изделия (1). Лазерные лучи (9) с длительностью импульса меньше одной наносекунды направляют на указанную поверхность в смежных оптических полях систем (14) фокусирования по меньшей мере двух неподвижных устройств или в оптической области по меньшей мере одного подвижного устройства. Каждое указанное устройство (устройства) содержит источник (8) лазерного излучения, сканер (13) и указанную систему (14) фокусирования для нанесения структуры в виде небольших волн на указанную поверхность на ширину указанного импульса. Указанную поверхность сканируют по меньшей мере одним сканером (13) с помощью указанных лазерных лучей (9) вдоль группы линий (5, 6; 16, 17, 18, 16’, 17’, 18’), которые следуют друг за другом в направлении (7) относительного перемещения изделия (1) и по меньшей мере одного сканера (13), и вдоль группы линий, лежащих на продолжении друг друга в направлении, перпендикулярном указанному направлению ...

Способ резки хрупких неметаллических материалов

Изобретение относится к способам резки неметаллических хрупких материалов, преимущественно стекла, кварца и сапфира, и может использоваться при производстве смартфонов и любых других устройств с сенсорными панелями, при изготовлении приборов электротехники и микроэлектроники. Способ резки хрупких неметаллических материалов включает локальное воздействие на линии реза пучком излучения импульсно-периодического лазера, при этом варьируют энергию, воздействуя излучением ближнего и среднего ИК диапазона спектра с длительностью суммарного импульса 60-100 *10с, следующего с частотой от 14 до 20 кГц и энергией в импульсе от 0,35 мДж до 0,7 мДж, при средней суммарной мощности излучения на всех длинах волн 5-10 Вт. Воздействуют пучком импульсного лазера с одновременной генерацией на 8 длинах волн в ИК диапазоне спектра соответственно 1,03; 1,09; 2,6; 2,69; 2,92; 3,01; 3,06; 6,45 мкм. Для осуществления криволинейной резки сначала задают контур фигуры сфокусированным лазерным излучением с диаметром ...

СПОСОБ ПОЛУЧЕНИЯ СТОЙКОЙ ПРИ ОТЖИГЕ ДЛЯ СНЯТИЯ НАПРЯЖЕНИЙ, ТЕКСТУРИРОВАННОЙ КРЕМНИСТОЙ СТАЛИ С НИЗКИМИ ПОТЕРЯМИ В ЖЕЛЕЗЕ

Изобретение относится к способу получения листа из стойкой при отжиге для снятия напряжений текстурированной кремнистой стали. Проводят выплавку чугуна для кремнистой стали, выплавку стали, непрерывную разливку, горячую прокатку, одиночную или двойную холодную прокатку с последующим обезуглероживающим отжигом. На поверхность стали наносят покрытие из разделительного реагента на основе MgO, проводят высокотемпературный отжиг, наносят изолирующее покрытие и выполняют горячее протягивание, дрессировку и отжиг с получением листа из текстурированной кремнистой стали. С помощью сканирования импульсным лазером формируют насечки на одной или обеих поверхностях полученного стального листа. Насечки формируют параллельно друг другу в направлении прокатки стального листа. Сканирование импульсным лазером проводят при ширине периода времени одиночного импульса импульсного лазера, составляющей 100 нс или меньше, пиковой плотности энергии одиночного импульса, составляющей 0,05 Дж/см2или больше, плотности ...

СПОСОБ И УСТРОЙСТВО ДЛЯ ВЫПОЛНЕНИЯ ОТВЕРСТИЙ В ДЕТАЛИ ПРИ ПОМОЩИ ЛАЗЕРНЫХ ИМПУЛЬСОВ

... 1. Способ выполнения отверстий в детали (42), в частности, турбомашины при помощи импульсного лазерного генератора (10), содержащего резонатор (12), в котором установлен твердый стержень (14) для генерирования лазерных импульсов, при этом способ содержит этап (82), на котором определяют значения нескольких рабочих параметров лазерного генератора для выполнения отверстий заранее определенного диаметра в детали, отличающийся тем, что определяют заданное значение (Т1) температуры резонатора лазерного генератора в зависимости от характеристик выполняемых отверстий и/или от материала детали, в которой выполняют отверстия, и регулируют температуру резонатора по этому заданному значению во время выполнения отверстий.2. Способ по п. 1, отличающийся тем, что рабочие параметры лазерного генератора включают в себя частоту повторения импульсов (F), число импульсов, продолжительность импульса (Тр) и/или максимальную мощность лазерного генератора в процентах (Н%).3. Способ по п. 1, отличающийся тем, ...

СПОСОБ ВЫПОЛНЕНИЯ ПРИ ПОМОЩИ ЛАЗЕРНОГО ПУЧКА ОТВЕРСТВИЙ В ДЕТАЛИ, ИЗГОТОВЛЕННОЙ ИЗ КОМПОЗИТНОГО МАТЕРИАЛА С КЕРАМИЧЕСКОЙ ОСНОВОЙ

... 1. Способ выполнения отверстий (30) при помощи лазерного пучка в детали, изготовленной из композитного материала с керамической основой, отличающийся тем, что включает в себя: ! первый этап ударного сверления, на котором путем фокусировки лазерного пучка вглубь детали, в которой будет вырезаться отверстие, выполняют исходное отверстие (20), имеющее начальный диаметр и ось отверстия (16, 18); ! второй этап кольцевого сверления, на котором путем смещения лазерного пучка и вращения его вокруг оси (16, 18) отверстия выполняют промежуточное отверстие (26), соосное исходному отверстию (20), но имеющее больший, чем исходное отверстие (20) диаметр; ! третий этап, на котором фокус лазерного пучка смещают вдоль оси (16, 18) отверстия, после чего выполняют окончательное отверстие (30) с использованием импульсного лазерного пучка. ! 2. Способ по п.1, отличающийся тем, что количество импульсов составляет от 1 до 5. ! 3. Способ по п.1, отличающийся тем, что перемещение фокуса лазерного пучка осуществляется ...

СПОСОБ ИЗГОТОВЛЕНИЯ ОТВЕРСТИЯ

... 1. Способ изготовления отверстия (7) в многослойной системе (1, 120, 130, 155), содержащей, по меньшей мере, одну металлическую подложку (4) и внешний керамический слой (16''), посредством импульсного энергетического луча (22, 22', 22''), в частности посредством, по меньшей мере, одного импульсного луча (22, 22', 22'') лазера (19, 19', 19''), имеющего длительность импульсов, причем способ осуществляют за несколько этапов съема, используют короткие и длинные импульсы, на одном из первых этапов съема используют импульсы иной длительности, нежели на одном из последних этапов съема, и длинные импульсы имеют длительность более 0,4 мс. ! 2. Способ по п.1, при котором во время этапов съема короткими импульсами, по меньшей мере, один энергетический луч (22, 22', 22'') перемещают по поверхности детали (1, 120, 130, 155) для съема материала в зоне одной плоскости изготавливаемого отверстия (7). ! 3. Способ по п.1, при котором на первых этапах съема используют более длинные импульсы, нежели на одном ...

СИСТЕМА ДЛЯ ЛАЗЕРНОЙ ХИРУРГИЧЕСКОЙ ОФТАЛЬМОЛОГИИ

... 1. Система (100) для офтальмологической лазерной хирургии, содержащаяисточник (110) импульсного лазерного излучения с параметрами излучения, подобранными для выполнения разреза в глазной ткани, преимущественно в роговице,сканер (160) для осуществления перемещения лазерного излучения,электронный блок (190) управления, выполненный с возможностью управления сканером в соответствии с заданной геометрией разреза, иблок (170) модулятора для модулирования лазерных импульсов, испускаемых источником (110), при этомблок (190) управления дополнительно выполнен с возможностью управления блоком (170) модулятора в соответствии с паттерном (305, 400, 500) перемещения пучка, определенным для геометрии разреза, таким образом, что в заданных частях указанного паттерна по меньшей мере некоторые лазерные импульсы имеют уменьшенную энергию или подавлены.2. Система по п.1, отличающаяся тем, что паттерн перемещения пучка включает серпантинный паттерн (305) с множеством прямолинейных участков (320), расположенных ...

СПОСОБ И УСТРОЙСТВО ДЛЯ СТРУКТУРИРОВАНИЯ ПОВЕРХНОСТИ ТВЕРДОГО ТЕЛА, ПОКРЫТОГО ТВЕРДЫМ МАТЕРИАЛОМ, С ПОМОЩЬЮ ЛАЗЕРА

... 1. Способ структурирования, как минимум, одной области поверхности твердого тела (9), имеющего покрытие из твердого материала, посредством лазера, имеющего длительности импульса в наносекундном интервале (1), в соответствии со способом проекции шаблона, где гомогенное пятно (FS) системы придания формы оптическому лучу, шаблон (18) и затем диафрагма (6) используются перед оптическими системами создания изображения.2. Способ по п.1, отличающийся тем, что, как минимум, один шаблон и одна диафрагма установлены в обменное устройство, тем самым, любой требуемый шаблон или любая требуемая диафрагма могут помещаться в траекторию лазерного луча независимо друг от друга.3. Способ по п.1, отличающийся тем, что структурирование производится путем наложения множества микроструктур, при этом каждая из накладывающихся структур образует угол (α) с получившейся в результате наложения структурой.4. Способ по п.1, отличающийся тем, что шаблоны и диафрагмы установлены с возможностью вращения в обменном устройстве ...

Verfahren zur Nanostrukturierung polymerer Materialien mit gepulster Laserstrahlung in reaktiver Atmosphäre

In einem Verfahren zur Erzeugung einer ein festes polymeres Material umfassenden Oberfläche, die Oberflächenstrukturen mit Abmessungen im Sub-Mikrometerbereich aufweist, wird die unbehandelte Oberfläche, auf der die Strukturen zu erzeugen sind und die für eine Laserbestrahlung zugänglich sind, mit einem gepulsten Laserstrahl in einer reaktiven Gasatmosphäre ein- oder mehrmals auf solche Weise abgetastet, dass benachbarte Lichtflecke des Laserstrahls lückenlos aneinander stoßen oder sich überlappen und ein bestimmter Bereich einer vorgegebenen Relation zwischen Verfahrensparametern eingehalten wird, wodurch die Oberflächen chemisch modifiziert wird.

VERFAHREN UND VORRICHTUNG ZUR BEHANDLUNG VON MATERIALIEN MITTELS LASER.

SCHNEIDLASER

Sanitäreinrichtungsrohling sowie Verfahren zur Herstellung einer Sanitäreinrichtung

Sanitärwanne mit einem Wannenkörper (1) aus Stahl und einer auf dem Wannenkörper (1) angeordneten Beschichtung aus Email, wobei erfindungswesentlich die Beschichtung mit einem Laserstrahl erzeugte makroskopische Strukturen aufweist.

Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs

Verfahren zur Bearbeitung eines Werkstücks (13) unter Verwendung einer Laserbearbeitungsvorrichtung (10) zur Herstellung eines Schneidwerkzeugs, bei dem der Materialabtrag ein Abtragsprofil aufweist, das dem Querschnittsprofil einer herstellbaren Nut entspricht,mit einem Laser (11) zur Erzeugung eines Laserstahls (12), unter Verwendung einer im Lichtweg des Laserstrahls (12) angeordneten ansteuerbaren Ablenkeinrichtung (15), die den von dem Laser (11) einfallenden Laserstrahl (12a) während der Werkstückbearbeitung in wenigstens zwei Raumrichtungen (X, Y) ablenkt und den abgelenkten Laserstrahl (12b) auf das Werkstück (13) richtet, sowie unter Verwendung einer Positionieranordnung (30),wobei die Ablenkeinrichtung (15) die Auftreffstelle (18) des abgelenkten Laserstrahls (12b) innerhalb einer Schraffurfläche (16) auf der Werkstückoberfläche (17) entlang wenigstens einer Spiralbahn (19) bewegt, und wobei die Positionieranordnung (30) während der Bearbeitung das Werkstück (13) und die Ablenkeinrichtung ...

Laserbearbeitungsvorrichtung

Eine Fokussiereinheit einer Laserbearbeitungsvorrichtung beinhaltet: eine Fokuslinse, die einen Laserstrahl, der durch eine Oszillationseinheit für einen Laserstrahl oszilliert wird, fokussiert; und eine sphärische Aberrationsverlängerungslinse, welche die sphärische Aberration der Fokussierlinse verlängert. Ein gepulster Laserstrahl wird von der Fokussiereinheit auf einem Werkstück aufgebracht, das an einem Einspanntisch gehalten wird, um Abschirmtunnel auszubilden, von denen jeder aus einem feinen Loch und einem amorphen Bereich, der das feine Loch abschirmt, besteht, wobei die Abschirmtunnel sich von einer oberen Oberfläche zu einer unteren Oberfläche des Werkstücks erstrecken.

Verfahren zum Verschweißen von Bauteilen

Verfahren zum Verschweißen von Bauteilen (1, 2) mit folgenden Schritten: • Bereitstellen eines ersten Bauteils (1) und eines zweiten Bauteils (2), • Aneinandersetzen der beiden Bauteile (1, 2), • Verschweißen der beiden Bauteile (1, 2) mittels eines Laserstrahls, (5) wobei durch wiederholtes Ein- und Ausschalten des Laserstrahls (5) eine Vielzahl von Schweißimpulsen erzeugt werden, die jeweils durch schweißfreie Pausenintervalle, in denen der Laserstrahl (5) ausgeschaltet ist, unterbrochen werden, wobei • durch jeden Schweißimpuls ein lokales Schweißareal (11–22) erzeugt wird, in dem Material der beiden Bauteile (1, 2) lokal begrenzt aufgeschmolzen und verschmolzen wird, wobei • sich einzelne der durch die Schweißimpulse erzeugten Schweißareale (11–22) überlappen.

Verfahren zur Desintegration von Gegenständen mittels eines Lasers.

Spannungsreduzierung beim Laserwiederverschluss durch zeitlich geformte Laserpulse und Pulsfolgen

Es wird ein Verfahren zum Herstellen eines mikromechanischen Bauelements mit einem Substrat und mit einer mit dem Substrat verbundenen und mit dem Substrat eine erste Kaverne umschließenden Kappe vorgeschlagen, wobei in der ersten Kaverne ein erster Druck herrscht und ein erstes Gasgemisch mit einer ersten chemischen Zusammensetzung eingeschlossen ist, wobei – in einem ersten Verfahrensschritt eine die erste Kaverne mit einer Umgebung des mikromechanischen Bauelements verbindende Zugangsöffnung in dem Substrat oder in der Kappe ausgebildet wird, wobei – in einem zweiten Verfahrensschritt der erste Druck und/oder die erste chemische Zusammensetzung in der ersten Kaverne eingestellt wird, wobei – in einem dritten Verfahrensschritt die Zugangsöffnung durch Einbringen von Energie oder Wärme in einen absorbierenden Teil des Substrats oder der Kappe mithilfe eines Lasers verschlossen wird, wobei das Einbringen der Energie oder Wärme mithilfe eines eine Laserpulsdauer und eine Laserpulsintensität ...

Anzeigevorrichtung und deren Herstellungsverfahren

Tragbares Informationsendgerät (7200), umfassend:ein erstes flexibles Substrat (301);eine erste Klebeschicht (318a) über dem ersten flexiblen Substrat (301);eine erste organische Harzschicht (320a) über der ersten Klebeschicht (318a);ein Isolierfilm (321a) über der ersten organischen Harzschicht (320a);einen Transistor (552) über dem Isolierfilm (321a);ein EL-Element (572), das elektrisch mit dem Transistor (552) verbunden ist;eine zweite organische Harzschicht (320b) über dem EL-Element (572);eine zweite Klebeschicht (318b) über der zweiten organischen Harzschicht (320b); undein zweites flexibles Substrat (307) über der zweiten Klebeschicht (318b),wobei eine Dicke der ersten organischen Harzschicht (320a) kleiner als oder gleich 20 µm ist, undwobei mindestens ein Teil eines Anzeigeabschnitts (7202) des tragbaren Informationsendgeräts (7200) eine gekrümmte Oberfläche aufweist.

Erzeugung und Anwendung von effizienten Festkörperlaser-Pulszügen

Structuring the surface of materials

Material such as glass, plastic, semiconductor material, wood or ceramic is surface worked using a laser beam of wavelength 1.4-3.0 mu m.

Optische Messskala und laserbasierte Erstellungsmethode dafür

Ein Verfahren zur Herstellung einer optischen Bandmessskala zur Verwendung mit einem optischen Positionkodierer, bestehend aus: Erstellung einer Marke der Skala durch Bestrahlung der Oberfläche eines reflektierenden, flexiblen Metallträgermaterials an einer vorher festgelegten Markenposition mit einer Reihe von räumlich überlappenden Pulsen von einem Laser, wobei jeder Puls eine zweidimensionale Punktintensitätsverteilung hat, und jeder Punkt eine Energiedichte von weniger als ca. 1 J/cm2 innerhalb eines 1/e2-Durchmessers der Pulsintensitätsverteilung hat; Änderung der relativen Position des Lasers und des Trägermaterials durch eine Verschiebung, die eine nächste Markenposition auf dem Trägermaterial, an der die nächste Marke der Skala erstellt werden soll, definiert; und Wiederholung der Markenerstellung und Positionsänderungsschritte für aufeinanderfolgende Marken einer Vielzahl von Marken der Skala, wobei die Marken einen Markierungsabstand zueinander im Bereich von 10 bis 50 m nominal ...

Laserbohren von nicht kreisförmigen Öffnungen

Verfahren und Vorrichtung zur Formung von Strahlung für die Laserbearbeitung

Die Erfindung betrifft ein Verfahren und eine Laseranordnung zur Materialbearbeitung, wobei in einer Laseranordnung ein Laserstrahl auf eine Bearbeitungs-/ Abbildungsebene fokussiert und der Laserstrahl mittels mindestens eines Strahlformers hinsichtlich seiner Intensitätsverteilung angepasst werden kann. Dabei ist vorgesehen, dass der Laserstrahl zur Vermeidung von Uniformitätsfehlern in der Bearbeitungs-/ Abbildungsebene mittels mindestens eines Strahlteilers in mindestens zwei Teil- oder Einzelstrahlen aufgeteilt wird und die Teil- oder Einzelstrahlen derart unterschiedlich beeinflusst werden oder jeder Teil- oder Einzelstrahl aus einer Laserquelle mit unterschiedlicher Wellenlänge gebildet wird, dass diese nach deren Zusammenführung und Fokussierung auf die Bearbeitungs-/ Abbildungsebene einen Ausgangsstrahl mit einem Intensitätsprofil bilden, wobei benachbarte Intensitätsmaxima des Intensitätsprofils sich in ihren Lichteigenschaften unterscheiden. Damit kann eine störende Interferenzbildung ...

Verfahren zur Herstellung einer Schwächelinie mittels Laser

GAS LASER APPARATUS

Verfahren und Vorrichtung zur Formung von Strahlung für die Laserbearbeitung

Verfahren zur Strahlformung bei einem Laserbearbeitungsprozess, bei dem in einer Laseranordnung (20) ein Laserstrahl (22) auf eine Bearbeitungs- / Abbildungsebene (29) fokussiert und der Laserstrahl (22) mittels mindestens eines Strahlformers (26, 30) hinsichtlich seiner Intensitätsverteilung angepasst werden kann, wobei der Laserstrahl (22) zur Vermeidung von Uniformitätsfehlern in der Bearbeitungs-/ Abbildungsebene (29) mittels mindestens eines Strahlteilers (23) in mindestens zwei Teil- oder Einzelstrahlen (24, 25, 35) aufgeteilt wird und die Teil- oder Einzelstrahlen derart unterschiedlich beeinflusst werden oder jeder Teil- oder Einzelstrahl aus einer Laserquelle (21) mit unterschiedlicher Wellenlänge gebildet wird, dass diese nach deren Zusammenführung und Fokussierung auf die Bearbeitungs-/ Abbildungsebene (29) einen Ausgangsstrahl (28) mit einem Intensitätsprofil (28.1) bilden, wobei benachbarte Intensitätsmaxima des Intensitätsprofils (28.1) sich in zumindest einer Lichteigenschaft ...

SiC-SUBSTRATBEARBEITUNGSVERFAHREN

Es wird ein SiC-Substratbearbeitungsverfahren zum Herstellen eines SiC-Substrats aus einem SiC-Ingot offenbart. Das SiC-Substratbearbeitungsverfahren umfasst einen Trennschichtausbildungsschritt mit einem Einstellen eines Brennpunkts eines Laserstrahls, der eine Transmissionswellenlänge für SiC aufweist auf eine von der oberen Fläche des SiC-Ingots aus vorbestimmte Tiefe im Inneren des SiC-Ingots und als Nächstes einem Aufbringen eines Laserstrahls LB auf den SiC-Ingot, um dadurch eine Trennschicht zum Trennen des SiC-Substrats von dem SiC-Ingot auszubilden, einen Substratanbringschritt mit einem Anbringen eines Substrats an der oberen Fläche des SiC-Ingots und einen Trennschritt mit einem Aufbringen einer äußeren Kraft auf die Trennschicht, um dadurch das SiC-Substrat mit dem Substrat von dem SiC-Ingot entlang der Trennschicht zu trennen.

VERFAHREN ZUM HERSTELLEN EINES SUBSTRATS FÜR EIN AKUSTISCHES WELLENBAUELEMENT

Ein Verfahren zum Herstellen eines Substrats für ein akustisches Wellenbauelement beinhaltet: einen Verbindungsschritt für ein Substrat zum Verbinden einer piezoelektrischen Materialschicht mit einer Oberfläche an einer Seite des Trägersubstrats; einen Schleifschritt zum Schleifen der piezoelektrischen Materialschicht; einen Ausbildungsschritt für eine Abbildung einer Entfernungsmenge zum Messen der Dicke in der Ebene der piezoelektrischen Materialschicht mit einer optische Dicken-Messvorrichtung und Berechnen einer Entfernungsmenge der piezoelektrischen Materialschicht zum Anpassen der Dickenvariation der piezoelektrischen Materialschicht auf einen oder unterhalb eines Grenzwerte(s) auf der Basis einer jeden Koordinate in der Ebene, um eine Abbildung einer Entfernungsmenge auszubilden; einen Laserbearbeitungsschritt zum Aufbringen eines gepulsten Laserstrahls einer solchen Wellenlänge, dass dieser in der piezoelektrischen Materialschicht absorbiert werden kann, um selektiv die piezoelektrische ...

Method for scratching, cutting and drilling of leather with laser beam of lasers, comprises subjecting the leather to scratching, cutting or drilling with pulsed laser beam so that clean and ink-saving and/or odorless machining rims arise

The method comprises subjecting a leather to scratching, cutting or drilling with pulsed laser beam with a wavelength of less than 600 nm so that clean and ink-saving and/or odorless machining rims arise. The leather is subjected with pulsed and/or frequency-doubled or frequency-tripled lease beam of solid-state laser, with a wave length of 532-355 nm, and/or with a pulsed laser beam of an excimer laser with a wavelength of 351 nm, 308 nm or 248 nm. The pulse time of the pulsed laser beam is less than 200 ns. An independent claim is included for an arrangement for scratching, cutting and drilling of leather with laser beam of laser.

Method for ablating, joining, penetrating or surface treating workpieces with laser radiation, comprises moving focused laser radiation on working path relative to workpiece, where the relative motion is guided with varying velocities

The method for ablating, joining, penetrating or surface treating materials/workpieces with laser radiation, comprises moving the focused laser radiation on working path relative to the workpiece, where the relative motion is guided with varying velocities during the processing and a process parameter for a velocity or velocity region (G1, G2) is modulated. The modulation is adjusted in frequency, duty factor, amplitude and/or modulation pattern depending on the velocity of the working path, and the actualization of the parameter is carried out before the termination of the modulation period. The method for ablating, joining, penetrating or surface treating materials/workpieces with laser radiation, comprises moving the focused laser radiation on working path relative to the workpiece, where the relative motion is guided with varying velocities during the processing and a process parameter for a velocity or velocity region (G1, G2) is modulated. The modulation is adjusted in frequency, ...

Material removal method

Multiple-wavelength laser micromachining of semiconductor devices

A specially shaped laser pulse energy profile (98, 104, 156) characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.

Infrared laser wafer scribing using short pulses

Systems and methods are provided for scribing wafers (300) to efficiently ablate passivation and/or encapsulation layers (302, 304) while reducing or eliminating chipping and cracking in the passivation and/or encapsulation layers (302, 304). Short laser pulses are used to provide high peak powers and reduce the ablation threshold. In one embodiment, the scribing is performed by a q-switched CO2 laser.

A reflective mask.

A reflective mask for defining an image to be marked on an article using a laser beam (34) wherein the mask assembly (20, 40, 50) comprises reflective portions (32) defining the image. The mask (20) may comprise a plurality of individually selectable reflective elements (32) for defining an image, e.g. wheel members (26-29) each carrying several digits around its periphery, or wheel members each having a plurality of reflective elements around its periphery (Fig 4. not shown) or individually pivotable members arranged in arrays and each carrying a reflective element (Figs 5-8. not shown). ...

Method for laser marking an anodized metal surface with a desired colour

A method for laser marking an anodized metal surface 5 comprises: providing a laser 1 for emitting a laser beam 4 comprising laser pulses; providing a scanner 2 comprising a pair of mirrors 6, 7 for scanning the laser beam in first 8 and second 9 directions; providing a lens 3 for focusing the laser beam onto the anodized metal surface 5 to form a spot 31; providing a controller 11 for controlling the scanner 2; marking a plurality of lines 15 separated by a hatch distance 19 on the anodized metal surface to form a desired mark 16 by scanning the scanner 2 while pulsing the laser 1; the method being characterized by: overwriting each line 15 more than once and the colour of the mark being given by controlling parameters of the laser 1 and scanner 2 via controller 11.

Aom modulation techniques for improving laser system performance

Apparatus and method for laser processing a material

Real time target topography during laser processing

Method for laser machining inside materials

LASER METHOD OF PRECISION HOLE DRILLING

NO DETAILS

METHOD FOR THE SEPARATION FROM SUBSTRATES

PROCEDURE AND DEVICE FOR THE INCREASE OF THE MATERIAL DISTANCE RATE DURING THE LASERBEARBEITUNG

PROCEDURE FOR WELDING AN ELECTRODE POINT IN A SPARK PLUG

DENTALLASERANORDNUNG

A dental laser arrangement switchable between different modes of operation, the arrangement including a laser device operable as a laser oscillator and as a laser amplifier. The laser device includes a laser resonator having a pump unit and an active modelocker as well as an optic loss element that introduces selective losses in the resonator. The laser arrangement further includes a laser beam-out-coupling unit. The modelocker is connected to a control circuit for switching between a CW-mode of operation for coagulating soft tissue, in which the modelocker is switched off, and two short-pulse modes of operation in which high frequency signals of equal frequencies, but different powers are applied by the control circuit to the modelocker so as to generate laser pulses of a pre-determined duration. One of the two short-pulse modes of operation is provided for ablation of hard tooth tissue, and the other short-pulse mode of operation, in which the laser radiation has a lower peak power in ...

PROCEDURE FOR WELDING A METAL FOIL WITH A CYLINDRICAL METAL PIN

DEVICE AND PROCEDURE FOR THE SHAPING OF SURFACES

Single dominant spike output erbium laser

Uv laser system and method for single pulse severing of ic fuses

Laser-formed features

Embodiments are directed to laser-based processes for forming features on the surface of a part. The feature may include a geometric element, a color element, and/or a surface finish element. In some cases, the laser-formed features are formed as a pattern of textured features that produce an aesthetic and/or tactile effect on the surface of the part. In some cases, the texture features may be sufficiently small that they may not be discerned by the unaided human eye. Also, in some cases, a multiple laser-based processes are combined to form a single feature or a finished part having a specific aesthetic and/or tactile effect.

METHOD AND APPARATUS FOR INCREASING THE MATERIAL REMOVAL RATE IN LASER MACHINING

Multibeam fiber laser system

The present invention provides a fiber laser system that delivers from a single processing cable a multibeam output. The present invention allows for controlling multiple fiber laser modules and delivering their respective outputs in a pre-determined sequence but in a single processing cable, thereby providing multiple processing steps on a work piece that heretofore required separate optics for each beam. Custom fiber laser systems that combine processing steps tailored for a specific industrial application such as pre-heating, cutting, cleaning, welding, brazing, ablating, annealing, cooling, polishing and the like can be readily provided because of the present invention.

Laser-formed features

Embodiments are directed to laser-based processes for forming features on the surface of a part. The feature may include a geometric element, a color element, and/or a surface finish element. In some cases, the laser-formed features are formed as a pattern of textured features that produce an aesthetic and/or tactile effect on the surface of the part. In some cases, the texture features may be sufficiently small that they may not be discerned by the unaided human eye. Also, in some cases, a multiple laser-based processes are combined to form a single feature or a finished part having a specific aesthetic and/or tactile effect.

Laser processing

Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method

Method for removing a plastic material adhering to a surface and device for carrying out said method

METHOD AND DEVICE FOR STRUCTURING THE SURFACE OF A HARD MATERIAL COATED SOLID BODY BY MEANS OF A LASER

In the method for structuring at least one area of a solid body surface (9,10) provided with a ta-C coating, by means of a first laser (1), preferably an excimer laser having pulse durations in the nanosecond range, a first structure is produced upon which a second, ripple-like structure is superposed by means of a second laser (15), having pulse durations in the picosecond or in the femtosecond range. Preferentially, the excimer laser structuring is carried out according to the mask projection technique and the picosecond or femtosecond laser (15) structuring according to the focus technique. This method allows the rational manufacture of very complex, extremely fraud-resistant authentication features and/or of esthetically attractive, optical diffraction effective colored patterns.

APPARATUS AND METHOD FOR LASER PROCESSING A MATERIAL

Apparatus for laser processing a material (8) with optical radiation (T), which apparatus comprises a seed laser (1) pumped by a seed pump (2), an amplifier (3) pumped by an amplifier pump (4), a controller (5), and a scanner (6), wherein the controller (5) controls the seed pump (2), the amplifier pump (4) and the scanner (6) in synchronism such that optical pulses (10) emitted by the seed laser (1) are propagated through the amplifier (3) and directed to the material (8) by the scanner (6), the apparatus being characterized in that controller (5) controls the amplifier pump (4) to cause the amplifier (3) to act as an optical attenuator when the optical radiation (7) is in a first power range, and as an optical amplifier when the output power is in a second power range.

METHOD FOR MANUFACTURING STRESS-RELIEF-ANNEALING-RESISTANT, LOW-IRON-LOSS GRAIN-ORIENTED SILICON STEEL

Disclosed is a stress relief annealing resisting method for manufacturing a low-iron-loss oriented silicon steel, the method comprising: carrying out, by means of a pulse laser, scanning grooving on a single surface or two surfaces of a silicon steel sheet after cold rolling, decarburizing annealing, high temperature annealing or after hot-drawing flattening annealing, and forming several grooves parallel with each other in a rolling direction of the silicon steel sheet, wherein a single pulse laser time width of the pulse laser is less than or equal to 100 ns, and a single pulse peak energy density is greater than or equal to 0.05 J/cm2; the energy density of a single scan of a single laser beam is 1 J/cm2-100 J/cm2; a beam spot of the pulse laser is a single beam spot or a combination of a plurality of beams spots, the shape of the beam spot is circular or elliptic, and the diameter of the beam spot in a scanning direction is 5 µm1 mm, and the diameter thereof in a direction perpendicular ...

METHOD FOR PRODUCTION OF A HOLE

SYSTEM AND METHOD FOR SHAPING A CERAMIC MATRIX COMPOSITE (CMC) SHEET

A method for shaping a ceramic matrix composite (CMC) sheet having a first surface and a second surface is presented. The method includes receiving an input signal representative of a predetermined shape and a type of the CMC sheet. Further, the method includes selecting a laser beam based on the received input signal. Also, the method includes projecting the selected laser beam on the CMC sheet to shape the CMC sheet into the predetermined shape.

Process and apparatus for increasing the repetition frequency of the pulses of a laser

In order to increase the repetition frequency of the pulses of a gas laser including two discharge tubes (A, B) connected in series, the discharge of the two tubes is commanded alternately in such a manner that each tube has its recycling time while the other is discharging. The apparatus comprises a pulse generator (2) composed of an oscillator (O) coupled to a pulse distributor (D) which commands the discharges of the tubes via electronic gates (8, 9). The process and the apparatus can be utilised for etching by means of laser discharges in ceramic substrates. ...

Method of removing material from a metallic workpiece, in particular for boring, by means of a laser-beam pulse focused on the material to be removed

The point of the workpiece (9) to be machined is surrounded with an atmosphere containing helium and/or hydrogen. The laser beam focused on the workpiece (9) is proportioned in its variation in intensity per unit of time and selected in its half beam width a in such a way that a plasma absorbing the laser radiation is formed at the start of the laser-beam pulse, which plasma, however, is only maintained for a fraction of the pulse duration. In order to achieve this, the workpiece surface (8) is arranged at a distance d from the neck (6) of the beam, in which case in which k = 0.1 to 2.0 and w is the radius of the neck (6) of the beam. By this measure, metallic workpieces can be efficiently machined with a high degree of reflection for the laser radiation used for the machining. ...

Procedure and device for the production of raster cells in the surface of a gravure cylinder.

Verfahren und System zum Bohren mit einem begrenzten Laserbohrer.

Es ist ein Verfahren zum Bohren eines Lochs (52) in einer Komponente geschaffen. Das Verfahren weist einen Laserstrahl (64) auf, der mittels Lichtführungs - und - fokussiermechanismen eines Laserbohrers (62) begrenzt ist. Das Verfahren umfasst ein Richten eines begrenzten Laserstrahls (64) in Richtung auf eine erste Lochposition an einer nahegelegenen Wand (66) der Komponente. Das Verfahren enthält ferner ein Erfassen einer Lichteigenschaft innerhalb eines durch die Komponente definierten Hohlraums (46). Die nahegelegene Wand (66) ist benachbart zu dem Hohlraum (46) positioniert, und der Sensor ist außerhalb des Hohlraums (46) positioniert. Das Verfahren enthält ferner ein Feststellen eines ersten Durchbruchs des begrenzten Laserstrahls (64) durch die nahegelegene Wand (66) der Komponente an der ersten Lochposition basierend auf dem Licht aus dem Innenraum des Hohlraums (46), das mit dem Sensor erfasst wird. Ein derartiges Verfahren (120, 200, 300, 400) kann ein komfortableres und zeiteffizienteres ...

Method and system for drilling with limited laser.

Es ist ein Verfahren zum Bohren eines Lochs (52) in einer Komponente (38) geschaffen. Das Verfahren enthält ein Richten eines begrenzten Laserstrahls (64) des begrenzten Laserbohrers (62) in Richtung auf eine erste Lochposition an einer nahegelegenen Wand (66) der Komponente (38). Das Verfahren enthält ferner ein Erfassen einer Eigenschaft von Licht innerhalb eines durch die Komponente (38) definierten Hohlraums (46). Die nahegelegene Wand (66) ist benachbart zu dem Hohlraum (46) positioniert, und der Sensor (98) ist ausserhalb des Hohlraums (46) positioniert. Das Verfahren enthält ferner ein Feststellen eines ersten Durchbruchs des begrenzten Laserstrahls (64) durch die nahegelegene Wand (66) der Komponente (38) an der ersten Lochposition, basierend auf dem Licht aus dem Innenraum des Hohlraums (46), das mit dem Sensor (98) erfasst wird. Ein derartiges Verfahren kann ein komfortableres und zeiteffizienteres Bohren mit begrenztem Laser in Gasturbinenkomponenten ermöglichen.

Laser machining systems and - method, a laser beam dithering can.

Laserbearbeitungssysteme und -verfahren sind in der Lage, einen Laserstrahl (110) zu bewegen, während gleichbleibende Laserstrahleigenschaften an Bearbeitungsstellen aufrechterhalten werden. Die Laserbearbeitungssysteme (120) erzeugen einen kollimierten Laserstrahl, der eine gleichbleibende Leistungsdichte in Z-Richtung entlang wenigstens eines Abschnitts einer Länge des Laserstrahls aufweist, und dithern den kollimierten Laserstrahl in X- oder Y-Richtung. Durch das Dithering des kollimierten Laserstrahls wird eine gleichbleibende Laserbearbeitung auf einer dreidimensionalen Oberfläche ermöglicht, um beispielsweise einen gleichbleibenden Auftrag einer Beschichtung in einem Laserauftragschweissprozess bereitzustellen. Ein Laserbearbeitungssystem kann ein Strahlübertragungssystem (130) umfassen, das sowohl die Kollimation als auch das Dithering des kollimierten Lasers sowie eine Einstellung des Strahldurchmessers des kollimierten Strahls bereitstellt.

METHOD FOR CONTROLLING A LASER CUTTING PROCESS AND LASER CUTTING SYSTEM IMPLEMENTING THE SAME

Wafer producing method

On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations

Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

Short-pulsed laser treatment for adjusting bending of hard disk drive component

Crystallization method, crystallization apparatus, processed substrate, thin film transistor and display apparatus

Method for marking a workpiece with a data matrix code by means of a laser beam

SEMICONDUCTOR INGOT INSPECTING METHOD AND APPARATUS, AND LASER PROCESSING APPARATUS

Laser drilling method and apparatus with radiation output changes in a radial direction during drilling of a workpiece

Wafer generation method

Wafer processing method

For ophthalmic laser surgery system

Method of providing consistent quality of target material removal by lasers having different output performance characteristics

Laser pulse energy adjustments are motivated by an understanding of the effect of laser pulse width variations among different lasers on satisfying a quality metric associated with a laser-processed target. In a preferred embodiment, the adjustments normalize this effect among different lasers drilling vias in a target specimen. The number of pulses delivered to the target specimen to form each via can be modified, based on the pulse energy applied to the via location, to control different via quality metrics.

Laser machining method and semiconductor device

METHOD AND DEVICE FOR LASER MICRO-MACHINING

PROCESS AND DEVICE FOR the REMOVAL OF MATTERS USING LASER BEAMS

PROCESS FOR THE PREPARATION OF A COATING FOR SHEET METAL

L'invention concerne un procédé de préparation de tôle métallique (1) ou d'éléments structurels en tôle métallique, qui présentent des arêtes de coupe, en particulier sur tout le pourtour et/ou dans la région de perforations, poinçonnages ou découpes de matériau analogues, pour un revêtement (3) avec un agent de protection contre la corrosion ayant une matrice constituée de liants organiques ou comprenant principalement des composants organiques, en particulier dans le cadre d'un revêtement par EDC, sachant que les arêtes de coupe, arêtes de poinçonnage ou arêtes de bords de perforations sont arrondies et/ou rendues rugueuses avant le revêtement.

METHOD FOR MARKING SURFACE OF A MECHANICAL PART BY A PREDEFINED GRAPHICAL REPRESENTATION WITH HOLOGRAPHIC EFFECT

METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED MICROELECTRONIC DEVICE STRUCTURES AND MICROELECTRONIC DEVICES

Procédé de formation d'une structure de dispositif micro-électronique qui comprend l'enroulement d'une portion d'un câble électrique autour d'au moins une paroi Latérale d'une structure qui fait saillie depuis un substrat. Au moins une interface entre une région supérieure de la structure et une région supérieure de la portion enroulée du câble électrique est soudée pour former une région de fusion entre la structure et le câble électrique.

METHODS AND SYSTEMS FOR GENERATING PULSE TRAINS FOR MATERIAL PROCESSING

Method for processing transparent materials using spatio-temporally shaped pulsed-laser beam and Apparatus for the same

레이저 가공장치

... 가공대상물의 내부에 집광되는 레이저광의 수차를 억제할 수 있는 레이저 가공장치를 제공한다. 레이저 가공장치(200)는 레이저광(L)을 출사하는 레이저광원(202)와, 레이저광원(202)에서 출사된 레이저광(L)을 변조하는 반사형 공간 광변조기(203)를 구비하고, 레이저광(L)의 광로에서 레이저광원(202)과 반사형 공간 광변조기(203)와의 사이에는 레이저광(L)을 반사하는 제1 미러(205a, 205b)가 배치되어 있으며, 제1 미러(205a, 205b)는 레이저광(L)의 반사방향을 조정 가능하게 구성되어 있다. 따라서, 레이저 가공장치(200)에서는 미러(205a, 205b)의 각각에서 레이저광(L)의 반사방향을 조정함으로써, 반사형 공간 광변조기(203)에 입사하는 레이저광(L)의 위치 및 입사각도를 원하는 대로 조정할 수 있다. 따라서, 반사형 공간 광변조기(203)에 레이저광(L)을 정밀도 좋게 입사시킬 수 있다.

레이저가공장치

... 펄스에너지의 불균일을 억제하면서, 가공시간의 장대화도 억제하는 것이 가능한 레이저가공장치를 제공한다. 빔편향기가, 가공대상물의 표면에 있어서 펄스레이저빔의 입사위치를 이동시키고, 이동이 완료되면 위치결정완료신호를 송출한다. 전환기가 개방상태일 때, 레이저광원으로부터 빔편향기에 펄스레이저빔이 입사되고, 폐쇄상태일 때 입사되지 않는다. 제어장치가, 빔편향기에 이동지령신호를 송출하고 나서 위치결정완료신호를 수신할 때까지의 기간 동안, 전환기를 폐쇄상태로 하여, 일정한 제1 반복주파수로 출력지령신호를 송출한다. 위치결정완료신호를 수신하면, 직전의 출력지령신호로부터 다음의 출력지령신호까지의 제2 반복주파수를, 제1 반복주파수를 포함하는 주파수변동범위 내에서 선택한다. 제2 반복주파수로 레이저광원에 다음의 출력지령신호를 송출함으로써, 고품질가공모드로 가공을 행한다.

레이저광 조사 장치

... 레이저광 조사 장치는 레이저 광원, 공간 광 변조기, 제어부, 대물 렌즈 및 강도 분포 취득부를 구비한다. 레이저 광원은 레이저광을 발생시킨다. 공간 광 변조기는 위상 패턴을 표시하는 표시부를 가지고, 레이저 광원에서 발생시킨 레이저광을 표시부에 입사시키고, 당해 레이저광을 위상 패턴에 따라 변조하여 표시부로부터 출사한다. 제어부는 표시부에 표시하는 위상 패턴을 제어한다. 대물 렌즈는 공간 광 변조기로부터 출사된 레이저광을 대상물에 집광한다. 강도 분포 취득부는 공간 광 변조기로부터 출사되어 대물 렌즈에 입사되는 레이저광의 강도 분포를 취득한다. 제어부는 레이저광에 있어서의 대물 렌즈의 동공면에 입사되지 않는 일부를 변조하는 마킹을 포함하는 위상 패턴을, 표시부에 표시시킨다.

고전력 다이오드 기반 적층 가공을 위한 시스템 및 방법

... 기판을 형성하는 분말화된 물질에 대한 적층 가공 제조 공정을 수행하기 위한 시스템이 개시된다. 시스템은 기판의 분말화된 물질을 용융 또는 소결하는데 충분한 광학 신호를 생성하기 위한 다이오드 어레이를 이용할 수 있다. 마스크는 광 신호의 제1 소정 부분이 기판에 도달하는 것을 방지하고, 반면에 제2 소정 부분이 기판에 도달하는 것을 허용하는데 사용될 수 있다. 적어도 하나의 프로세서는 다이오드 어레이의 출력을 제어하는데 사용될 수 있다.

탄성파 디바이스용 기판의 제조 방법

... [과제] 탄성파 디바이스의 비용을 억제하면서도 압전체층의 두께 변동을 억제할 수 있는 탄성파 디바이스용 기판의 제조 방법을 제공하는 것. [해결수단] 탄성파 디바이스용 기판의 제조 방법은, 지지 기판의 한쪽의 면에 압전체층을 접합하는 기판 접합 단계(ST1)와, 압전체층을 연삭하는 연삭 단계(ST2)와, 압전체층의 면내 두께를 광학식 두께 측정기로 측정하고, 압전체층의 두께 변동을 임계치 이하로 하기 위한 압전체층의 제거량을 면내의 좌표마다 산출하여 제거량 맵을 작성하는 제거량 맵 작성 단계(ST3)와, 제거량 맵에 기초하여, 압전체층에 대하여 흡수성을 갖는 파장의 펄스 레이저 빔을 조사하여, 압전체층을 선택적으로 제거하는 레이저 가공 단계(ST4)와, 압전체층의 표면을 연마 패드로 연마하여, 면내 두께 변동을 유지하면서 소정 두께의 압전체층을 형성하는 연마 단계(ST5)를 구비한다.

Automated beam marker

A beam marking system is disclosed for marking on beams with a marking device. The beam marking system includes a beam marking device configured to mark on the surface of a beam. A movable arm is coupled to the marking device. The movable arm has at least three movable components that collectively move the beam marking device along or about at least three axes. A controller is in electronic communication with the movable arm and the marking device. The controller controlling the movement of the at least three movable components of the movable arm and controlling the operation of the marking device. In some instances, the beam marking system can automatically mark beams, such as metal beams used in heavy construction projects in a rapid and accurate manner.

Defect correcting apparatus and defect correcting method

The present disclosure provides a defect correcting apparatus including a defect detecting device configured to detect a defect within a repetitive pattern in a multilayer substrate a defect correcting device configured to correct the defect in the multilayer substrate by a specified defect correcting method, and a control device configured to, when the defect detected by the defect detecting device is detected overlapping a region in which occurrence of an interlayer short-circuit defect is assumed, generate an object corresponding to the defect correcting method for the interlayer short-circuit defect, and controlling the defect correcting device for correcting the defect using the generated object.

Device for simultaneously processing the circumference of a workpiece with laser beams

A device for simultaneously processing a circumference of a workpiece includes a plurality of laser-lens modules and a waveguide. The modules each include a diode laser and a lens system and is configured to emit a laser beam radially in a shared radiation plane. The waveguide includes a lower part and an upper part that together form a cavity enclosing the radiation plane. The laser-lens modules are configured so that the laser is reflected repeatedly between a bottom surface and a cover surface and propagates in an unaffected manner within the radiation plane so as to form a beam spot that strikes the workpiece with a homogeneous energy distribution. The beam spot has a height based on a distance between the surfaces and a width based on a divergence angle in the radiation plane and a distance of the module from the workpiece surface.

Substrate with shaped cooling holes and methods of manufacture

A substrate having one or more shaped effusion cooling holes formed therein. Each shaped cooling hole has a bore angled relative to an exit surface of the combustor liner. One end of the bore is an inlet formed in an inlet surface of the combustor liner. The other end of the bore is an outlet formed in the exit surface of the combustor liner. The outlet has a shaped portion that expands in only one dimension. Also methods for making the shaped cooling holes.

On-The-Fly Manipulation Of Spot Size And Cutting Speed For Real-Time Control Of Trench Depth And Width In Laser Operations

Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

Method and System for Mitigation of Particulate Inclusions in Optical Materials

A method of fabricating an optical material includes providing input materials having a material softening temperature, melting the input materials, and flowing the melted input materials into a laser inclusion mitigation system. The melted input materials comprise one or more inclusions. The method also includes irradiating the input materials using a laser beam, fragmenting the one or more inclusions in response to the irradiating, and reducing a temperature of the input materials to less than the material softening temperature. The method further includes forming an optical material and annealing the optical material.

Method for producing semiconductor light-emitting chip and semiconductor light-emitting chip

In producing a semiconductor light-emitting chip whose substrate is composed of a sapphire single crystal, cracking in semiconductor light-emitting elements in the obtained semiconductor light-emitting chip is suppressed. A semiconductor light-emitting chip is obtained by forming, on an element-group formation substrate on a front surface of which semiconductor light-emitting elements are formed, the front surface being composed of a C-plane of a sapphire single crystal, dividing grooves extending toward a first direction along an M-plane of the sapphire single crystal and the front surface of the substrate from a substrate front surface side (step 103 ), forming first modified regions extending toward the first direction and second modified regions extending along the substrate front surface and toward a second direction different from the first direction in the substrate (step 104 and step 105 ), and dividing the element-group formation substrate using the first modified regions and the second modified regions (step 106 ).

Laser processing systems and methods for beam dithering and skiving

A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

Apparatus and method for repair of defects in an electronic energy control or display device

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

Pulsed light generation method

The present invention relates to a method of enabling generation of pulsed lights each having a narrow pulse width and high effective pulse energys. A pulse light source has a MOPA structure, and comprises a single semiconductor laser, a bandpass filter and an optical fiber amplifier. The single semiconductor laser outputs two or more pulsed lights separated by a predetermined interval, for each period given according to a predetermined repetition frequency. The bandpass filter attenuates one of the shorter wavelength side and the longer wavelength side, in the wavelength band of input pulsed lights.

Apparatus and method for repair of defects in an electronic energy control or display device

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

Laser marking

A method and apparatus is disclosed for producing precision marks for a metrological scale in the form of a stainless steel ribbon. A laser is used to produce ultra-short pulses which have a fluence at the ribbon such that ablation takes place. The laser light can be scanned via scanner and the pitch of the marks can be controlled. The ablative technique causes little thermal input and improves the accuracy of the scale.

Monitoring method and apparatus for excimer laser annealing process

A method is disclosed evaluating a silicon layer crystallized by irradiation with pulses form an excimer-laser. The crystallization produces periodic features on the crystalized layer dependent on the number of and energy density in the pulses to which the layer has been exposed. An area of the layer is illuminated with light. A detector is arranged to detect light diffracted from the illuminated area and to determine from the detected diffracted light the energy density in the pulses to which the layer has been exposed.

Systems and methods for processing thin films

Methods and systems for processing a thin film are disclosed. Thin films are loaded onto two different loading fixtures, laser beam pulses are split into first and second laser beam pulses, the thin film loaded on one loading fixture is irradiated with the first laser beam pulses to induce crystallization while the thin film loaded on the other loading fixture is irradiated with the second laser beam pulses. At least a portion of the thin film loaded on the first and second loading fixtures is irradiated. The laser source system includes first and second laser sources and an integrator that combines the laser beam pulses to form combined laser beam pulses. The methods and system further utilize additional loading fixtures for processing additional thin film samples. The irradiation of additional thin film samples can be performed while thin film samples are being loaded onto the remaining loading fixtures.

Methods, devices, systems for joining materials and resulting articles

A method, article of manufacture, and system for joining different materials is described. In a principal embodiment, two articles, for example different metals, are placed in proximity to one another with an interfacial area. One article is heated using a laser that is scanned across from a point remote from the interface to a point at or just short of the interface. In embodiments, the interfacial bond region is characterized by a homogenous mixed phase region with very low to substantially no brittle intermetallics.

Method for partitioning and incoherently summing a coherent beam

A method and apparatus for decorrelating coherent light from a light source, such as a pulsed laser, in both time and space in an effort to provide intense and uniform illumination are provided. For some embodiments employing a pulsed light source, the output pulse may be stretched relative to the input pulse width. The methods and apparatus described herein may be incorporated into any application where intense, uniform illumination is desired, such as pulsed laser annealing, welding, ablating, and wafer stepper illuminating.

Method and apparatus for marking an article

Numerous embodiments of methods and apparatus for marking articles are disclosed. In one embodiment, a method of marking an article includes providing an article having a preliminary visual appearance; modifying a region of the article; and directing a plurality of optical pulses into the modified region of the article. The plurality of optical pulses can be configured to produce a visible mark on the article. Generally, the mark can be characterized as having a modified visual appearance different from the preliminary visual appearance.

System and method for manufacturing an airfoil

A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A liquid flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a liquid inside the airfoil, and disrupting the first fluid column with the liquid flowing inside the airfoil.

GOLF CLUB HEAD AND MANUFACTURING METHOD FOR SAME

A golf club head includes a heel portion, a toe portion, a hosel, and a striking face. The striking face includes a plurality of scorelines each having an average depth no less than about 0.10 mm, a plurality of micro-grooves each having an average depth no greater than about 0.010 mm, and a plurality of textured surface treatment regions superimposed on the micro-grooves so as to at least partially intersect the micro-grooves. 1. A method comprising:(a) mechanically milling a striking face of a golf club head having a central region and a toe region thereby forming a plurality of generally parallel arcuate grooves that extend at least partially into the toe region;(b) forming a plurality of scorelines in the striking face, the scorelines extending horizontally and comprising an average scoreline width, a scoreline heel-ward extent that is coincident with a central region heel-ward extent, and a scoreline toe-ward extent that is coincident with a central region toe-ward extent; and(c) forming by material removal a plurality of horizontally-oriented lines at least in the central region interspersed between, and spaced from, the plurality of scorelines, the plurality of horizontally-oriented lines having an average line width less than the average scoreline width.2. The method of claim 1 , further comprising claim 1 , subsequent to step (a) and prior to step (c) claim 1 , applying a media blast to a portion of the striking face.3. The method of claim 1 , wherein the step (c) comprises forming the horizontally-oriented lines as to be substantially confined to the central region.4. The method of claim 1 , wherein the step (c) further comprises forming the plurality of horizontally-oriented lines by mechanical milling.5. The method of claim 1 , wherein the step (c) comprises forming the horizontally-oriented lines at a concentration of no less than 2 lines between each adjacently-located pair of scorelines of the plurality of scorelines.6. The method of claim 5 , wherein ...

CURVED QUASI-NON-DIFFRACTING LASER BEAMS FOR LASER PROCESSING OF TRANSPARENT WORKPIECES

A method for processing a transparent workpiece comprises directing a laser beam oriented along a beam path into the transparent workpiece such that a portion of the laser beam directed into the transparent workpiece is a laser beam focal arc and generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece. The laser beam focal arc has a wavelength λ, a spot size w, and a Rayleigh range Zthat is greater than 2. The method of claim 1 ,wherein the curvature is defined by a line shift direction that deviates from an unaffected beam propagation direction, and{'sub': p', 'p, 'wherein the line shift direction varies in the x-direction according to a line shift function x(z) or the line shift direction varies in the y-direction according to a line shift function y(z); and'}{'sub': p', 'p, 'wherein the z-direction is the unaffected beam propagation direction and at least one of x(z) and y(z) is non-zero.'}3. The method of claim 2 , wherein the line shift function x(z) claim 2 , the line shift function y(z) claim 2 , or both comprise a hyperbola claim 2 , a parabola claim 2 , a circle claim 2 , an ellipse claim 2 , a logarithmic function claim 2 , an exponential function claim 2 , portions thereof claim 2 , or combinations thereof.4. The method of claim 2 , wherein the line shift function x(z) or the line shift function y(z) is 0.5. The method of claim 2 , wherein the defect has a central axis not aligned with the unaffected beam propagation direction.6. The method of claim 2 , wherein the unaffected beam propagation direction z is oriented at a non-normal angle of incidence to the transparent workpiece.7. The method of claim 1 , wherein the curvature is produced by impinging the laser beam on a phase-altering optical element.8. The method of claim 7 , wherein the phase-altering optical element comprises a spatial light modulator or adaptive optic.9. The method of claim 7 , wherein the phase- ...

Method for Nano-Structuring Polmer Materials Using Pulsed Laser Radiation in an Inert Atmosphere

In a method for generating a surface having a solid polymeric material, which has surface structures with dimensions in the sub-micrometer range, the untreated surface, on which the structures are to be generated and which are accessible to laser radiation, is scanned once or multiple times using a pulsed laser beam in an inert gas atmosphere in such a way that adjacent light spots of the laser beam adjoin each other in a gapless manner or overlap and a certain range of a specified relation between process parameters is observed.

LASER SYSTEM AND METHOD FOR PROCESSING SAPPHIRE

Laser processing of sapphire is performed using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm (hereinafter “QCW laser”). Laser processing of sapphire using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 10%) and in an inert gas atmosphere such as argon or helium. Laser processing of sapphire using a QCW laser may further include the use of an assist laser having a shorter wavelength and/or pulse duration to modify a property of the sapphire substrate to form absorption centers, which facilitate coupling of the laser light pulses of the QCW laser into the sapphire. 1. A method for laser processing a sapphire substrate , the method comprising:periodically switching on a power source to pulse a continuous wave laser, thereby operating the laser in a quasi-continuous wave (“QCW”) mode so as to emit consecutive pulses of laser light at a wavelength ranging between about 1060 nm and about 1070 nm;focusing the pulses of laser light at the sapphire substrate; andlaser processing the sapphire substrate with the pulses of laser light.2. The method of further comprising supplying inert gas in a vicinity of the sapphire substrate.3. The method of claim 2 , wherein the inert gas is selected from the group consisting of argon and helium.4. The method of claim 1 , wherein laser processing the sapphire substrate is selected from the group consisting of cutting claim 1 , scribing claim 1 , and drilling.5. The method of claim 1 , wherein laser processing includes cutting with a speed between about 10 and 40 inches per minute claim 1 , and wherein the sapphire substrate has a thickness between about 0.1 and about 1 mm.6. The method of claim 1 , wherein the laser is an ytterbium fiber laser.7. The method of claim 1 , wherein the laser is operated with a duty cycle ranging between about 1% and about 10%.8. The method of claim 1 , wherein ...

METHOD FOR JOINING DIFFERENT KINDS OF PLATES

The present invention relates to a joining method, and more specifically relates to a method for joining different kinds of plates that joins at least two plate members of which materials thereof are different from each other through laser welding. For this, a method for joining different kinds of plates according to an exemplary embodiment of the present invention may include disposing a first plate and a second plate, materials of which are different from each other, such that they are overlapped with each other, and joining the first plate and the second plate by irradiating a laser beam at a predetermined inclination angle and in a regular pattern onto the overlapped portion of the two plates. 1. A method for joining different kinds of plates , comprising:disposing a first plate and a second plate, materials thereof being different from each other, such that they are overlapped with each other; andjoining the first plate and second plate by irradiating a laser beam at a predetermine inclination angle and in a regular pattern onto the overlapped portion of the two plates.2. The method for joining different kinds of plates of claim 1 , wherein the first plate is made of aluminum and the second plate is disposed on the first plate and is made of steel of which a melting point is higher than that of the first plate.3. The method for joining different kinds of plates of claim 2 , wherein the laser beam is outputted as a regular pulse wave.4. The method for joining different kinds of plates of claim 2 , wherein a welding pool of the second plate is charged in a key hole formed on the first plate between the first plate and the second plate.5. The method for joining different kinds of plates of claim 2 , wherein the laser beam performs conduction welding that can form a welding pool on a plate member through a non-focus part.6. The method for joining different kinds of plates of claim 5 , wherein the laser beam is irradiated such that the diameter of the laser beam ...

METHOD AND APPARATUS FOR USE IN LASER SHOCK PEENING

An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5J to about 10 J, an average power (defined as energy (J) x frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz. 130-. (canceled)31. A system comprising:a diode-pumped solid-state laser (DPSSL) oscillator configured to generate a pulsed laser beam having a first set of laser beam characteristics;a modulator configured to modify the pulsed laser beam to generate a modulated pulsed laser beam, wherein the modulated pulsed laser beam has a second set of laser beam characteristics;a multi-stage amplifier configured to modify the modulated pulsed laser beam to generate a first pulsed laser beam, wherein the first pulsed laser beam has a third set of laser beam characteristics, and further configured to modify the first pulse laser beam to generate a second pulsed laser beam, wherein the second pulsed laser beam has a fourth set of laser beam characteristics; anda beam delivery system configured to deliver the second pulsed laser beam to a target part to laser shock peen the target part.32. The system of claim 31 ,wherein the first set of laser beam characteristics comprises a first energy, a first temporal profile, and a first spatial profile;wherein the second set of laser beam characteristics comprises a second energy, a second temporal profile, and the first spatial profile;wherein the third set of laser beam characteristics comprises a third energy, a ...

LASER PROCESSING APPARATUS, METHODS OF LASER-PROCESSING WORKPIECES AND RELATED ARRANGEMENTS

Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed. 1. (canceled)2. An apparatus for laser-processing a workpiece , the apparatus , comprising:a laser source configured to generate a plurality of laser pulses;a scan lens arranged in a beam path along which the plurality of laser pulses are directable to the workpiece to thereby irradiate a process spot at the workpiece;a first positioner including an acousto-optical deflector (AOD) system arranged along the optical path between the laser source and the scan lens, wherein the first positioner is operative to deflect the plurality of laser pulses relative to the scan lens to thereby position the process spot within a first scanning range associated with the first positioner a processor configured to generate one or more control signals to which the first positioner is responsive; and', {'b': 3', '14, 'computer memory accessible by the processor, wherein the computer memory has instructions stored thereon which, when executed by the processor, cause the first positioner to scan the process spot along a process trajectory to form a via in the workpiece, wherein the process trajectory defines a sequence of spot locations to be addressed upon irradiating the workpiece with the plurality of laser pulses during formation of the via and wherein a maximum diameter of the via is smaller than or equal to the first scanning range. claims -. (canceled ...

APPARATUS FOR ADDITIVELY MANUFACTURING THREE-DIMENSIONAL OBJECTS

Apparatus () for additively manufacturing three-dimensional objects () by means of successive layerwise selective irradiation and consolidation of layers of a build material () which can be consolidated by means of an energy beam (), which apparatus () comprises an irradiation device () adapted to generate the energy beam (), wherein the irradiation device () comprises a beam guiding unit () that is adapted to guide the energy beam () in a build plane () in which build material () is applied, wherein the irradiation device () is adapted to generate at least one segmented track () comprising at least two first track segments () in which build material () is to be irradiated with the energy beam (). 112491696895461112498101718171795129518. Apparatus () for additively manufacturing three-dimensional objects () by means of successive layerwise selective irradiation and consolidation of layers of a build material () which can be consolidated by means of an energy beam () , which apparatus () comprises an irradiation device () adapted to generate the energy beam () , wherein the irradiation device () comprises a beam guiding unit () that is adapted to guide the energy beam () in a build plane () in which build material () is applied , characterized in that the irradiation device () is adapted to generate at least one segmented track () comprising at least two first track segments () in which build material () is to be irradiated with the energy beam () , wherein the beam guiding unit () is adapted to move at least one beam guiding element () in a continuous motion , comprising at least two first motion parts () and at least one second motion part () between the at least two first motion parts () , wherein during at least one , in particular each , first motion part () the energy beam () is guided onto the build plane () and one first track segment () is generated , wherein the energy beam () is not guided onto the build plane () during the at least one second motion part ...

Systems and methods for processing thin films

The present disclosure is directed to methods and systems for processing a thin film samples. In an exemplary method, semiconductor thin films are loaded onto two different loading fixtures, laser beam pulses generated by a laser source system are split into first laser beam pulses and second laser beam pulses, the thin film loaded on one loading fixture is irradiated with the first laser beam pulses to induce crystallization while the thin film loaded on the other loading fixture is irradiated with the second laser beam pulses. In a preferred embodiment, at least a portion of the thin film that is loaded on the first loading fixture is irradiated while at least a portion of the thin film that is loaded on the second loading fixture is also being irradiated. In an exemplary embodiment, the laser source system includes first and second laser sources and an integrator that combines the laser beam pulses generated by the first and second laser sources to form combined laser beam pulses. In certain exemplary embodiments, the methods and system further utilize additional loading fixtures for processing additional thin film samples. In such methods and systems, the irradiation of thin film samples loaded on some of the loading fixtures can be performed while thin film samples are being loaded onto the remaining loading fixtures. In certain exemplary methods and systems, the crystallization processing of the semiconductor thin film samples can consist of a sequential lateral solidification (SLS) process.

ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-CERAMIC/SEMICONDUCTOR BONDING

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates. 1. An apparatus for room temperature laser bonding comprising:an x-axis motion stage mounted to a base;a y-axis motion stage mounted to the x-axis motion stage;a substrate alignment fixture mounted on the y-axis motion stage, said alignment fixture adapted to align and secure at least two substrates with a mutual interface as a workpiece;a gantry mounted to the base and supporting alignment optics for a laser to focus on the workpiece in the alignment fixture; anda controller for translation of the x-axis motion stage and y-axis motion stage for motion of the focused laser on the workpiece.2. The apparatus as defined in wherein the substrate alignment fixture comprises:a mounting structure to mount the alignment fixture to the y-axis stage;a vertically translating engagement slider supported by translation rods extending from the mounting structure;an expansion device positioned intermediate the engagement slider and the mounting structure for vertical adjustment of the engagement slider;a workpiece holding frame to support the workpiece;risers extending upward from the mounting structure to receive an optical flat to be positioned over the holding frame; anda securing plate mounted with spacers to fix the optical flat to the risers;whereby retraction of the expansion device ...

Laser Pulse Shaping Method

A laser pulse shaping method is configured for microscopically viewing and modifying an object. A temporal modulation and a two-dimensional spatial modulation of laser pulses are carried out. At least the phase of the laser pulses is modulated dependent on the location, and the modulated laser pulses are directed at the object.

PROCESSING APPARATUS AND PROCESSING METHOD

A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head and a control device. The irradiation head includes a laser turning unit and a condensing optical system The laser turning unit includes a first prism a second prism a first rotating mechanism and a second rotating mechanism The control device adjusts the differences between rotation speeds and phase angles of the first prism and the second prism based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser. 1. A processing apparatus which performs processing by irradiating a workpiece with laser , comprising:an irradiation head configured to irradiate the workpiece with the laser and including a laser turning unit which turns the laser relative to the workpiece and a condensing optical system which collects the laser turned by the laser turning unit; anda control device configured to control an operation of the irradiation head, whereinthe laser turning unit includes a first prism which refracts the laser, a second prism which is arranged at a position opposite to the first prism and refracts the laser output from the first prism, a first rotating mechanism which rotates the first prism, and a second rotating mechanism which rotates the second prism, andthe control device controls the first and second rotating mechanisms based on a relation between at least an allowable thickness of a heat affected layer of the workpiece and a turning speed of the laser emitted to the workpiece, and adjusts differences between rotation speeds and phase angles of the first and second prisms.2. The processing apparatus according to claim 1 , whereinthe first rotating mechanism includes a first spindle which holds the first prism and of which a part of the light path of the laser is hollow, and a first hollow motor to which the first spindle is rotatably inserted and ...

REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES

A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed. 1. A method for selectively removing a protective coating from a substrate , comprising:applying a protective coating to a substrate; andselectively cutting at least a portion of the protective coating with a removal medium comprising a laser light.2. The method of claim 1 , wherein applying the protective coating comprises applying a polyp-xylylene) coating to the substrate.3. The method of claim 1 , wherein selectively cutting at least the portion of the protective coating comprises exposing a periphery of at least one portion of the substrate through the protective coating.4. The method of claim 1 , wherein exposing the periphery of the at least one portion of the substrate comprises exposing a periphery of a selected feature and/or component of the substrate.5. The method of claim 3 , wherein exposing at least the periphery of the at least one portion of the substrate comprises exposing the protective coating to a laser beam.6. The method of claim 5 , further comprising:exposing an area of the substrate delineated by the periphery of the at least one portion of the substrate.7. The method of claim 6 , wherein the area is exposed by scanning the laser beam across a region of the protective coating located over the area of the substrate.8. The method of claim 7 , wherein scanning comprises raster scanning the laser beam across the region of the protective coating.9. The method of claim 1 , wherein selectively cutting comprises selectively cutting at least the portion of the protective ...

GOLF CLUB HEAD AND MANUFACTURING METHOD FOR SAME

A golf club head includes a heel portion, a toe portion, a hosel, and a striking face. The striking face includes a plurality of scorelines each having an average depth no less than about 0.10 mm, a plurality of micro-grooves each having an average depth no greater than about 0.010 mm, and a plurality of textured surface treatment regions superimposed on the micro-grooves so as to at least partially intersect the micro-grooves. 1. A method comprising:(a) mechanically milling a striking face of a golf club head having a central region and a toe region thereby forming a plurality of generally parallel arcuate grooves located in the central region and the toe region;(b) forming a plurality of scorelines in the striking face, the scorelines extending horizontally and comprising an average scoreline width, a scoreline heel-ward extent that is coincident with a central region heel-ward extent, and a scoreline toe-ward extent that is coincident with a central region toe-ward extent; and(c) forming by material removal a plurality of horizontally-oriented lines in the central region interspersed between, and spaced from, the plurality of scorelines, the plurality of horizontally-oriented lines having an average line width less than the average scoreline width.2. The method of claim 1 , further comprising claim 1 , subsequent to step (a) and prior to step (c) claim 1 , applying a media blast to a portion of the striking face.3. The method of claim 1 , wherein the step (c) comprises forming the horizontally-oriented lines as to be substantially confined to the central region.4. The method of claim 1 , wherein the step (c) further comprises forming the plurality of horizontally-oriented lines by mechanical milling.5. The method of claim 1 , wherein the step (c) comprises forming the horizontally-oriented lines at a concentration of no less than 2 lines between each adjacently-located pair of scorelines of the plurality of scorelines.6. The method of claim 5 , wherein the ...

PROCESSES AND SYSTEMS FOR DOUBLE-PULSE LASER MICRO SINTERING

Processes and systems that include one or more laser beam sources configured to provide laser irradiation with one or more laser pulse groups to at least a portion of powder particles on a solid surface at one or multiple locations thereof. Sintering laser pulse(s) is provided to induce coalition of at least some of the powder particles into a more continuous medium, and pressing laser pulse(s) is provided to produce pressure pulse(s) on at least a portion of the powder particles and/or the more continuous medium. Laser pulse groups may include one or more of the sintering laser pulses followed by one or more of the pressing laser pulses with a time delay between a last of the sintering laser pulse(s) and a first of the pressing laser pulse(s). 1. A laser sintering process comprising:providing powder particles on a solid surface so that at least a portion of the powder particles forms a material surface; and then or simultaneouslylaser irradiating the material surface with one or more laser pulse groups at one or multiple locations to induce coalition of at least some of the powder particles into a more continuous medium; one or more sintering laser pulses followed by one or more pressing laser pulses, wherein at least one of the sintering laser pulse(s) is different from at least one of the pressing laser pulse(s) in at least one parameter or characteristic selected from the group consisting of laser pulse duration, laser pulse energy, peak laser power within the laser pulse, laser spot size on the material surface, laser beam wavelength, the relation of laser power versus time within the laser pulse, spatial profile of laser beam intensity on the material surface, and any combination thereof; and', 'a time delay between a last one of the sintering laser pulse(s) and a first one of the pressing laser pulse(s)., 'wherein at least one of the one or more laser pulse group(s) comprises2. The laser sintering process of claim 1 , wherein the at least one laser pulse ...

Grain-oriented electrical steel plate and production method therefor

Provided is an oriented electrical steel sheet including a groove existing on the surface of the electrical steel sheet and a forsterite layer formed on a part or all of the surface of the electrical steel sheet, in which forsterite which is extended from the forsterite layer and penetrates to a base steel sheet in an anchor form is present on the surface of the side of the groove.

MANUFACTURING METHODS FOR MULTI-LOBED COOLING HOLES

A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof. 1. A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface , the method comprising:forming a cooling hole inlet at the first wall surface;forming a cooling hole outlet at the second wall surface;forming a metering section downstream from the inlet; andforming a multi-lobed diffusing section between the metering section and the outlet,wherein the inlet, outlet, metering section and multi-lobed diffusing section are formed by a technique selected from the group consisting of laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.2. The method of claim 1 , wherein the wall comprises a metal or superalloy substrate.3. The method of claim 1 , wherein the second wall surface comprises a coating claim 1 , and wherein at least a portion of the cooling hole extends through the coating.4. The method of claim 3 , wherein the coating comprises:a bond coating; anda thermal barrier coating.5. The method of claim 4 , wherein a portion of the diffusing section is located within the coating.6. The method of claim 5 , wherein the entire diffusing section is located within the coating.7. The method of claim 6 , wherein a portion of the metering section is located within the coating.8. The method of claim 1 , wherein the inlet and metering section ...

METAL MEMBER AND MANUFACTURING METHOD FOR METAL MEMBER

A manufacturing method for a metal member includes irradiating a first region of a surface of the base material, the surface having at least any one of Cu, Al, Sn, Ti, and Fe, as a main component, with a laser beam to melt the first region; generating metal particles from a vapor or plasma of a metal released to a predetermined atmosphere by melting the surface of the base material in the first region, and depositing the metal particles in the first region; irradiating a second region adjacent to the first region with a laser beam to melt the second region; and generating metal particles from a vapor or plasma of a metal released to a predetermined atmosphere by melting the surface of the base material in the second region, and depositing the metal particles in each of the first region and the second region. 1. A manufacturing method for a metal member that includes a base material of which at least a surface is made of a material containing at least any one of Cu , Al , Sn , Ti , and Fe , as a main component , and an uneven portion having an uneven shape , which is formed on the surface of the base material , the manufacturing method comprising forming the uneven portion , irradiating a first region of the surface of the base material with a pulse-oscillating laser beam to melt the surface of the base material in the first region,', 'generating metal particles from a vapor or plasma of a metal released to a predetermined atmosphere by melting the surface of the base material in the first region, and depositing the metal particles in the first region,', 'irradiating a second region of the surface of the base material with the pulse-oscillating laser beam, the second region being adjacent to the first region, to melt the surface of the base material in the second region, and', 'generating metal particles from a vapor or plasma of a metal released to the predetermined atmosphere by melting the surface of the base material in the second region, and depositing the metal ...

METHOD AND DEVICE FOR OPERATING A LASER MATERIAL PROCESSING MACHINE

A computer-implemented method for operating a laser material processing machine. Process parameters are varied with the aid of Bayesian optimization until a result of the laser material processing is sufficiently good. The Bayesian optimization taking place with the aid of a data-based process model, and it being taken into consideration during the variation of the process parameters how probable it is that a variable which characterizes a quality of the result is within predefinable boundaries. 1. A computer-implemented method for operating a laser material processing machine , the method comprising:varying process parameters using Bayesian optimization until a result of the laser material processing is sufficiently good, the Bayesian optimization taking place using a data-based process model, wherein, during the variation of the process parameters, it is taken into consideration how probable it is that a variable which characterizes a quality of the result is within predefinable boundaries.2. The method as recited in claim 1 , wherein in an acquisition function claim 1 , as a function of which the variation of the process parameters is ascertained claim 1 , a probability is taken into consideration claim 1 , which characterizes how probable it is that the result is within the predefinable boundaries.3. The method as recited in claim 2 , wherein the probability is ascertained based on a data-based quality model.4. The method as recited in claim 3 , wherein the data-based quality model is configured to output parameters which characterize a statistical prediction of the result to be expected.5. The method as recited in claim 4 , wherein it is taken into consideration during the variation of the process parameters how probable it is that further variables claim 4 , which each characterize further qualities of the result claim 4 , are within respective predefinable boundaries claim 4 , each of the respective probabilities being ascertained using a respective further ...

Si SUBSTRATE MANUFACTURING METHOD

An Si substrate manufacturing method includes a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to Si to a depth, equivalent to a thickness of an Si substrate to be manufactured, from a flat surface of an Si ingot and irradiating the Si ingot with the laser beam while relatively moving the focal point and the Si ingot in a direction < parallel to a cross line at which a crystal plane { and a crystal plane { intersect or a direction [ orthogonal to the cross line, and an indexing feed step of executing indexing feed of the focal point and the Si ingot relatively in a direction orthogonal to a direction in which the separation band is formed. 1100. A silicon substrate manufacturing method for manufacturing a silicon substrate from a silicon ingot in which a crystal plane () is made to be a flat surface , the silicon substrate manufacturing method comprising:{'b': 110', '100', '111', '110, 'a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to silicon to a depth equivalent to a thickness of the silicon substrate to be manufactured from the flat surface and irradiating the silicon ingot with the laser beam while relatively moving the focal point and the silicon ingot in a direction <> parallel to a cross line at which a crystal plane {} and a crystal plane {} intersect or a direction [] orthogonal to the cross line;'}an indexing feed step of executing indexing feed of the focal point and the silicon ingot relatively in a direction orthogonal to a direction in which the separation band is formed; and{'b': '100', 'a wafer manufacturing step of repeatedly executing the separation band forming step and the indexing feed step to form a separation layer parallel to the crystal plane () as a whole inside the silicon ingot and separating the silicon ...

LASER PROCESSING APPARATUS

A laser processing apparatus includes: a chuck table that holds a workpiece; a laser beam applying unit that applies a pulsed laser beam having a predetermined line width to the workpiece held by the chuck table; and a processing feeding unit that performs relative processing feeding of the chuck table and the laser beam applying unit. The laser beam applying unit includes: a laser oscillator that oscillates the pulsed laser beam; a focusing device that focuses the pulsed laser beam oscillated by the laser oscillator; and a pulse width adjustment unit that is disposed between the laser oscillator and the focusing device and that generates a time difference in a wavelength region of the pulsed laser beam in the predetermined line width, thereby adjusting the pulse width. 1. A laser processing apparatus comprising:a chuck table that holds a workpiece;a laser beam applying unit that applies a pulsed laser beam of a wavelength having a predetermined line width to the workpiece held by the chuck table; anda processing feeding unit that performs relative processing feeding of the chuck table and the laser beam applying unit, a laser oscillator that oscillates the pulsed laser beam,', 'a focusing device that focuses the pulsed laser beam oscillated by the laser oscillator, and', 'a pulse width adjustment unit that is disposed between the laser oscillator and the focusing device and that generates a time difference in a wavelength region of the pulsed laser beam in the line width, thereby adjusting pulse width., 'wherein the laser beam applying unit includes'}2. The laser processing apparatus according to claim 1 ,wherein the laser beam applying unit further includes a polarization beam splitter that splits the pulsed laser beam oscillated by the laser oscillator,the focusing device focuses the pulsed laser beam reflected by the polarization beam splitter, andthe pulse width adjustment unit is disposed on the opposite side of the polarization beam splitter from the laser ...

POLYCRYSTALLINE SiC WAFER PRODUCING METHOD

There is provided a polycrystalline SiC wafer producing method. In this method, in a modified layer forming step for forming an interface for producing a polycrystalline SiC wafer from a polycrystalline SiC ingot, the formed interface is a surface formed by linking of modified layers formed in such a manner that an initial modified layer is formed through splitting of polycrystalline SiC into amorphous silicon and amorphous carbon at the light focus point of a pulse laser beam and then polycrystalline SiC splits into amorphous silicon and amorphous carbon at a position at which the power density is constant with absorption of the continuously-emitted pulse laser beam by amorphous carbon formed in advance. 1. A polycrystalline SiC wafer producing method for producing a polycrystalline SiC wafer from a polycrystalline SiC ingot , the method comprising:a modified layer forming step of positioning a light focus point of a pulse laser beam having such a wavelength as to be transmitted through the polycrystalline SiC ingot at a predetermined position from an irradiated surface of the polycrystalline SiC ingot and irradiating the polycrystalline SiC ingot with the pulse laser beam to form modified layers at a position at which an interface between the polycrystalline SiC wafer and the polycrystalline SiC ingot is to be formed; anda polycrystalline SiC wafer separating step of giving an external force to an upper side relative to the interface formed by the modified layer forming step and separating the polycrystalline SiC wafer from the interface,wherein the interface formed in the modified layer forming step is a surface formed by linking of modified layers formed in such a manner that an initial modified layer is formed through splitting of polycrystalline SiC into amorphous silicon and amorphous carbon at the light focus point of the pulse laser beam, the pulse laser beam emitted next is absorbed by the amorphous carbon formed by the pulse laser beam emitted in advance ...

METHOD AND APPARATUS FOR PERFORMING LASER CURVED FILAMENTATION WITHIN TRANSPARENT MATERIALS

Systems and methods are described for forming continuous curved laser filaments in transparent materials. The filaments are preferably curved and C-shaped. Filaments may employ other curved profiles (shapes). A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths in the range of 100 μm-10 mm. An aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process. 1. A method of laser processing a transparent material , comprising the steps of:providing a laser beam, said laser beam includes a burst of laser pulses or a single laser pulse;providing a cubic phase plate or mask in said laser beam path to induce cubic phase in said laser pulses forming Airy beam;externally focusing said laser Airy beam relative to said transparent material to form a beam waist at a location that is external to said transparent material; and,said laser pulses are focused such that a sufficient energy density is maintained within said transparent material to form a continuous laser C-shaped curved filament therein without causing optical breakdown.2. A method of processing a transparent material , comprising the steps of:providing a laser beam, said laser beam having a plurality of bursts and each of said bursts include a plurality of pulses;generating an initial waist of said laser beam external to said transparent material;generating a weakly focused laser beam distributed within said transparent material in a C-shaped ...

OPTICAL PULSE STRETCHER, LASER APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

An optical pulse stretcher includes a separation optical element configured to separate pulsed laser light incident on a first surface thereof into first transmitted light and first reflected light, a reflective optical system configured to guide the first reflected light to be incident on a second surface of the separation optical element that is the surface opposite the first surface, and a holding member that has a through hole having an opening area smaller than the area of a reflective surface of a reflective optical element provided in the reflective optical system, is disposed on the rear side of the reflective optical element, and is configured to hold the reflective optical element. 1. An optical pulse stretcher comprising:a separation optical element configured to separate pulsed laser light incident on a first surface thereof into first transmitted light and first reflected light;a reflective optical system configured to guide the first reflected light to be incident on a second surface of the separation optical element that is a surface opposite the first surface; anda holding member that has a through hole having an opening area smaller than an area of a reflective surface of a reflective optical element provided in the reflective optical system, is disposed on a rear side of the reflective optical element, and is configured to hold the reflective optical element.2. The optical pulse stretcher according to claim 1 ,wherein an opening section of the through hole has an opening width in a first direction greater than an opening width in a second direction perpendicular to the first direction.3. The optical pulse stretcher according to claim 2 ,wherein the opening section has a substantially oblong shape.4. The optical pulse stretcher according to claim 3 ,wherein the opening section has a substantially oblong shape having rounded corners.5. The optical pulse stretcher according to claim 2 ,wherein the opening section has a substantially elliptical shape.6 ...

PUNCTURE FORMING METHOD, SAMPLE SEPARATING METHOD, SEMICONDUCTOR ELEMENT MANUFACTURING METHOD, SEMICONDUCTOR LASER ELEMENT MANUFACTURING METHOD, AND SEMICONDUCTOR LASER ELEMENT

A puncture forming method is a method of forming punctures in a sample by irradiating a surface of the sample with a light beam. The puncture forming method includes: forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; and after the forming of the first puncture, forming a second puncture which at least partially overlaps the first puncture by irradiating, with a second pulse of the light beam, a second position on the surface of the sample positioned away from the first position in a first direction. The second puncture has a tip which is positioned inside the sample and which is bent in a direction opposite to the first direction. 1. A puncture forming method of forming a puncture in a sample by irradiating a surface of the sample with a light beam , the puncture forming method comprising:forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; andforming a second puncture by irradiating a second position on the surface of the sample with a second pulse of the light beam after the forming of the first puncture, the second puncture at least partially overlapping the first puncture, the second position being positioned away from the first position in a first direction,wherein the second puncture has a tip positioned inside the sample, the tip being bent in a direction opposite to the first direction.2. The puncture forming method according to claim 1 ,wherein the light beam is polarized in a direction perpendicular to the first direction.3. The puncture forming method according to claim 1 ,wherein the light beam is a laser beam.4. A semiconductor element manufacturing method of manufacturing a semiconductor element by separating a semiconductor element substrate claim 1 , the semiconductor element manufacturing method comprising:forming a first puncture by irradiating a first position on a surface of the semiconductor element ...

Scanned pulse anneal apparatus and methods

Apparatus, system, and method for thermally treating a substrate. A source of pulsed electromagnetic energy can produce pulses at a rate of at least 100 Hz. A movable substrate support can move a substrate relative to the pulses of electromagnetic energy. An optical system can be disposed between the energy source and the movable substrate support, and can include components to shape the pulses of electromagnetic energy toward a rectangular profile. A controller can command the source of electromagnetic energy to produce pulses of energy at a selected pulse rate. The controller can also command the movable substrate support to scan in a direction parallel to a selected edge of the rectangular profile at a selected speed such that every point along a line parallel to the selected edge receives a predetermined number of pulses of electromagnetic energy.

Laser irradiation induced surface planarization of polycrystalline silicon films

A method for planarizing excimer laser annealed (ELA) poly-crystalline thing films via irradiation. The method includes providing an ELA thin film having an oxide and a top surface with a first surface roughness defined at least by a first plurality of protrusions. The ELA thin film is etched to substantially remove the oxide. At least a portion of the etched ELA thin film is then irradiated using a short-pulse duration excimer laser beam, to form an irradiated thin film with a second surface roughness defined at least by a second plurality of protrusions. The second surface roughness is lower than the first surface roughness. 1. A method , comprising: a polycrystalline thin film having a top surface having a first surface roughness defined by a first plurality of protrusions; and', 'an oxide layer over the top surface of the thin film;, 'providing a film comprisingetching the film to substantially remove the oxide layer; andirradiating a portion of the etched film using a short-pulse duration laser beam with controlled energy density to cause partial melting to the portion of the etched film, to form an irradiated polycrystalline thin film having a second surface roughness defined by a second plurality of protrusions wherein the second surface roughness is lower than the first surface roughness.2. The method of claim 1 , wherein the film is an excimer laser annealed (ELA) film.3. The method of claim 1 , wherein the portion of the etched film is irradiated using at least one of an excimer laser claim 1 , a solid-state laser claim 1 , a rapidly scanned continuous wave laser claim 1 , and a rapidly scanned quasi-continuous wave laser that provides laser energy to cause partial melting to the polycrystalline thin film below the near complete melting threshold.4. The method of claim 1 , wherein the irradiating comprises directing a single pulse of the laser beam toward the etched film.5. The method of claim 1 , wherein the irradiating comprises directing a plurality of ...

PROCESS FOR PREPARING A PROCESSED FILAMENT, INCLUDING INTERACTION OF A SEGMENT WITH AT LEAST ONE BEAM OF ELECTROMAGNETIC RADIATION OF A FIRST KIND

One aspect relates to a process for preparing a processed filament, including provision of a filament, including a segment. At least in the segment, the filament includes a core, including a first metal, a first layer which is superimposed on the core, and includes a polymer, and a second layer which is superimposed on the first layer, and includes a second metal. The segment of the filament is processed by interaction of the segment with at least one beam of electromagnetic radiation of a first kind. The electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm. Further, one aspect relates to a processed filament, obtainable by the process; a filament; an electrical device, including at least a part of the processed filament. 1. A process for preparing a processed filament , the process comprising: wherein, at least in the segment, the filament comprises', 'i) a core, comprising a first metal,', I) is superimposed on the core, and', 'II) comprises a polymer, and, 'ii) a first layer which'}, I) is superimposed on the first layer, and', 'II) comprises a second metal; and, 'iii) a second layer which'}], 'a) providing a filament, comprising a segment,'}b) processing the segment of the filament by interaction of the segment with at least one beam of electromagnetic radiation of a first kind;wherein the electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm.2. The process of claim 1 , wherein a surface of the first layer has an average roughness Ra in the range from 0.07 to 4 μm.3. The process of claim 1 , wherein a surface of the first layer has a root-mean-squared roughness Rin the range from 0.2 to 7 μm.4. The process of claim 1 , wherein the at least one beam of electromagnetic radiation of the first kind is at least one laser beam of a first kind claim 1 , wherein the at least one laser beam of the first kind is at least one pulsed laser beam of the ...

METHOD FOR MARKING THE SURFACE OF A MECHANICAL PART WITH A PREDEFINED GRAPHICAL REPRESENTATION HAVING A HOLOGRAPHIC EFFECT

A method of marking the surface of a mechanical part with a predefined graphic having a holographic type effect, the method including using a laser source to apply a succession of laser pulses to the outside surface of a part for marking, with different masks being interposed between the laser source and the outside surface of the part, each mask having a particular pattern, each laser pulse having a power density of at least 20 MW/cmand a duration that is less than or equal to 100 ns. 1. A method of marking the surface of a mechanical part with a predefined graphic having a holographic type effect , the method comprising using a laser source to apply a succession of laser pulses to the outside surface of a part for marking , with different masks being interposed between the laser source and the outside surface of the part , each mask having a particular pattern , each laser pulse having a power density of at least 20 MW/cmand a duration that is less than or equal to 100 ns.2. The method according to claim 1 , wherein the power density and/or the diameter of the mask and/or the particular pattern of the mask are different for each pulse applied to the outside surface of the part.3. The method according to claim 1 , wherein a focusing lens is interposed between the laser source and the outside surface of the part.4. The method according to claim 1 , wherein the laser source is an Nd-YAG laser.5. The method according to claim 1 , wherein each laser pulse has an impact diameter of at least 0.5 mm.6. The method according to claim 1 , wherein when the part for marking is made of metal claim 1 , each laser pulse has power density lying in the range 0.04 GW/cmto 0.55 GW/cm.7. The method according to claim 1 , wherein when the part for marking is made of composite material comprising carbon fibers and an epoxy matrix claim 1 , each laser pulse has a power density lying in the range 0.15 GW/cmto 2 GW/cm.8. The method according to claim 1 , wherein when the part for marking ...

METHOD FOR PRODUCING DEPOSITION MASK

A mask substrate includes a resin layer. A step of forming openings in a mask substrate includes step A of forming openings of “a” number of continual columns included in a first region (R) including at least the (n/2)th column or the {(n+1)/2}th column; step B of forming openings of “b” number of continual columns included in a second region (R) adjacent to the first region (R) in a −x direction with a first gap region (RS) being sandwiched between the first and second regions, the first gap region including “sa” number of continual columns; and step C of forming openings of “c” number of continual columns included in a third region (R) adjacent to the first region (R) in an x direction with a second gap region (RS) being sandwiched between the first and third regions, the second gap region including “sb” number of continual columns. 1. A method for producing a deposition mask including a quadrangular mask substrate secured so as to define an xy plane and a plurality of active region formation portions provided on the mask substrate and arrayed in p rows by q columns , the plurality of active region formation portions each including a plurality of openings arrayed in m rows by n columns , the method comprising:a step of preparing the mask substrate secured so as to define the xy plane; andan opening formation step of forming the plurality of active region formation portions on the mask substrate, whereinthe mask substrate includes a resin layer and the opening formation step includes a step of directing laser light to the resin layer to form the plurality of openings, and wherein step A of forming openings of “a” number of continual columns included in a first region including at least the (n/2)th column or the {(n+1)/2}th column;', 'step B of forming openings of “b” number of continual columns included in a second region adjacent to the first region in a −x direction with a first gap region being sandwiched between the first region and the second region, the first ...

SIMULTANEOUS PATTERN-SCAN PLACEMENT DURING SAMPLE PROCESSING

A laser ablation system, and method, facilitates the execution of user-defined scans (i.e., in which a laser beam is scanned across a sample along a beam trajectory to ablate or dissociate a portion of the sample) and enables the user define additional scans while a scan is being executed. 1. A method for use with a laser ablation system having a sample chamber accommodating a sample within an interior thereof , a laser configured to generate a laser beam having parameters suitable for ablating or otherwise dissociating a portion of the sample within the sample chamber , and at least one scanning component configured to impart relative movement between the sample and the laser beam , the method comprising:processing image data, representative of obtained imagery of the sample, to generate location data, the location data associating at least one location within the obtained imagery with at least one corresponding spatial location within the interior of the sample chamber;controlling an operation of at least one selected from the group consisting of the laser and the at least one scanning component to execute a first scan in a first region-of-interest of the sample where the sample is to be ablated or otherwise dissociated by the laser beam; andwhile controlling an operation of at least one of the laser and the motion stage to execute the first scan, generating and storing scan data defining a second scan to be executed in a second region-of-interest of the sample where the sample is to be ablated or otherwise dissociated by the laser beam.2. The method of claim 1 , prior to controlling the operation of at least one of the laser and the at least one scanning component to execute the first scan claim 1 , generating and storing scan data defining the first scan.3. The method of claim 1 , further comprising generating and storing scan data defining the first scan in response receiving user input obtained through a user interface.4. The method of claim 1 , after ...

Laser machining apparatus that machines surface of workpiece by irradiating laser beam thereon

In a laser machining apparatus, a scanner is configured to scan a laser beam emitted from a laser beam emission device. A first part of a workpiece is exposed through an opening formed in the workpiece. A controller is configured to perform: acquiring shape data indicative of a shape of the workpiece; acquiring machining pattern data indicative of a machining pattern to be machined on the first part; acquiring a length of the machining pattern based on the machining pattern data; calculating an unmachinable position on a setting surface using the length and the shape data, the unmachinable position resulting from a second part of the workpiece hindering the laser beam reaching the first part, at least a part of the machining pattern being unmachinable on the first part in a state where the workpiece is set on the unmachinable position; and displaying the unmachinable position on a display.

DEVICE AND PROCESS FOR MARKING AN OPHTHALMIC LENS WITH A PULSED LASER OF WAVELENGTH AND ENERGY SELECTED PER PULSE

A device for marking an ophthalmic lens (), the lens () being made of at least one preset material, includes a laser () configured to produce permanent engravings on the lens () and configured to emit a focused beam of pulsed ultraviolet laser radiation that includes at least one radiation wavelength ranging between 200 nm and 300 nm, has a pulse length ranging between about 0.1 ns and about 5 ns, and has an energy per pulse ranging between about 5 μJ and about 100 μJ. A laser marking process configured to produce permanent engravings on an ophthalmic lens () via this device is also described. 1. A device for marking an ophthalmic lens , said ophthalmic lens being produced from at least one predetermined material , including a laser configured to produce permanent engravings on the ophthalmic lens , wherein the laser is configured to emit a focused pulsed beam of ultraviolet laser radiation , the focused beam having at least the following parameters:a radiation wavelength comprised between 200 nm and 300 nm;a pulse duration comprised between about 0.1 ns and about 5 ns; andan energy per pulse at the focal point comprised between about 10 μJ and about 80 μJ.2. The device as claimed in claim 1 , wherein the energy per pulse at the focal point is comprised between about 10 μJ and about 65 μJ.3. The device as claimed in claim 1 , wherein the energy per pulse at the focal point is comprised between about 10 μJ and about 60 μJ.4. The device as claimed in claim 1 , wherein the focused beam of ultraviolet laser radiation has a peak power comprised between about 2.5 kW and about 1 MW.5. The device as claimed in claim 4 , wherein the peak power is comprised between about 10 kW and about 100 kW.6. The device as claimed in claim 1 , wherein the focused beam of ultraviolet laser radiation has a pulse frequency comprised between about 100 Hz and about 10 kHz.7. The device as claimed in claim 6 , wherein the pulse frequency is comprised between about 100 Hz and about 1 kHz.8. The ...

SYSTEM AND METHOD FOR ENHANCEMENT OF LASER MATERIAL PROCESSING VIA MODULATION OF LASER LIGHT INTENSITY

The present disclosure relates to a laser-based system and method for providing efficient melt removal of material from a surface of a material sample being acted on in a laser machining operation. In one implementation the system may make use of a continuous wave (CW) laser for generating a laser beam directed at a spot on the surface of the material sample. The CW laser may be configured to be modulated at a predetermined frequency such that the laser beam excites and amplifies surface capillary waves on the surface of the sample up to a melt ejection point, which ejects molten material from the spot being acted on by the laser beam, to more rapidly facilitate material removal from the spot. 1. A laser system for providing efficient melt removal of material from a surface of a material sample being acted on in a laser machining operation , the system comprising:a continuous wave (CW) laser for generating a laser beam directed at a spot on the surface of the material sample; andthe CW laser configured to be modulated at a predetermined frequency such that the laser beam excites and amplifies surface capillary waves on the surface of the sample up to a melt ejection point, to eject molten material from the spot being acted on by the laser beam, to more rapidly facilitate material removal from the spot.2. The system of claim 1 , wherein the laser beam comprises a collimated laser beam.3. The system of claim 1 , wherein the laser beam is directed along an axis perpendicular to a surface of the sample.4. The system of claim 1 , wherein the predetermined frequency of the capillary waves is given by the expression: ω=(σk/ρ) claim 1 , where “σ” is surface tension claim 1 , “k” is a wave number claim 1 , and “ρ” is a metal density of the sample.5. The system of claim 1 , further comprising a focusing lens for focusing the laser beam to produce a focused claim 1 , collimated laser beam.6. The system of claim 1 , wherein the predetermined frequency comprises a frequency ...

A GRAIN-ORIENTED SILICON STEEL HAVING HEAT-RESISTANT MAGNETIC DOMAIN AND MANUFACTURING METHOD THEREOF

A heat-resistant magnetic domain refined grain-oriented silicon steel, a single-sided surface or a double-sided surface of which has several parallel grooves which are formed in a grooving manner, each groove extends in the width direction of the heat-resistant magnetic domain refined grain-oriented silicon steel, and the several parallel grooves are uniformly distributed along the rolling direction of the heat-resistant magnetic domain refined grain-oriented silicon steel. Each groove which extends in the width direction of the heat-resistant magnetic domain refined grain-oriented silicon steel is formed by splicing several sub-grooves which extend in the width direction of the heat-resistant magnetic domain refined grain-oriented silicon steel. The manufacturing method for a heat-resistant magnetic domain refined grain-oriented silicon steel comprises the step of: forming grooves on a single-sided surface or a double-sided surface of a heat-resistant magnetic domain refined grain-oriented silicon steel in a laser grooving manner, a laser beam of the laser grooving is divided into several sub-beams by a beam splitter, and the several sub-beams form the several sub-grooves which are spliced into the same groove. 1. A grain-oriented silicon steel having heat-resistant refined magnetic domain , characterized by multiple parallel grooves formed by grooving on surface of one side or of both sides of the grain-oriented silicon steel , wherein each groove extends in the width direction of the grain-oriented silicon steel , and said multiple parallel grooves are uniformly distributed along the rolling direction of the grain-oriented silicon steel having heat-resistant refined magnetic domain.2. The grain-oriented silicon steel having heat-resistant refined magnetic domain according to claim 1 , wherein said each groove that extends in the width direction of the grain-oriented silicon steel is formed by splicing multiple sub-grooves that extend in the width direction of the ...

LASER NANOSTRUCTURED SURFACE PREPARATION FOR JOINING MATERIALS

A joined article includes a first component having a laser-treated surface portion and a second component having a laser-treated surface portion. An adhesive joins the first component to the second component at the treated surface portion. A method of making a joined article form components and a system for making joined articles are also disclosed. 1. A joined article , comprising:a first component having an interference laser-treated surface portion;a second component having an interference laser-treated surface portion;an adhesive joining the first component to the second component at the treated surface portion.2. The joined article of claim 1 , wherein the interference laser-treated surface portions comprise features comprising at least one selected from the group consisting of depressions claim 1 , channels and holes.3. The joined article of claim 2 , wherein the features have a periodicity.4. The joined article of claim 3 , wherein the periodicity is between 0.5-50 μm.5. The joined article of claim 3 , wherein the periodicity varies by no more than ±5%.6. The joined article of claim 1 , wherein the interference laser is a multiple-beam interference laser claim 1 , wherein an original laser beam is split into at least 2 beams which are then refocused over the same spot on the component surface.7. The joined article of claim 1 , wherein the joined article treated according to the invention has a tensile strength that is at least 10% greater than a baseline tensile strength of an untreated article.8. The joined article of claim 1 , wherein the joined article treated according to the invention has a ductility that is at least 100% greater than a baseline joint of an untreated article.9. The joined article of claim 1 , wherein the interference laser-treated surface portion of the first component and the interference laser-treated portion of the second component are dissimilar materials.10. The joined article of claim 1 , wherein one of the interference laser- ...

Three-Dimensional Rendering Preview of Laser-Finished Garments

A tool allows a user to create new designs for apparel and preview these designs in three dimensions before manufacture. Software and lasers are used in finishing apparel to produce a desired wear pattern or other design. Based on a laser input file with a pattern, a laser will burn the pattern onto apparel. With the tool, the user will be able to create, make changes, and view images of a design, in real time, before burning by a laser. The tool can be accessed or executes via a Web browser.

Method and apparatus for marking coconuts and similar food products

A method of marking a product such as a coconut includes providing a laser light emitter configured to produce powered laser light having a user-specified spectrum and intensity. A bracket base is provided that includes a workframe interface configured to stabilize the bracket relative to a workframe, and the bracket base defines at least one receiving socket sized to stabilize at least a portion of the food product relative to the bracket base. Programmable controllers trigger the laser light emitter and manipulates at least one servomotor to burn at least a portion of the graphical mark at least partially onto a surface of the food product in accordance with graphics-related data. An apparatus is also disclosed.

METHOD OF MATERIAL PROCESSING BY LASER FILAMENTATION

A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that is comprised of pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving said substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves, rendering bevels to the laser-cleaved edges. Preferably, the laser pulses are delivered in a burst train for lowering the energy threshold for filament formation and increasing the filament length. 124-. (canceled)25. A method of preparing a substrate for cleavage , the method comprising the steps of:irradiating said substrate with a single pulse of a focused laser beam, wherein said substrate is transparent to said focused laser beam, and wherein said single pulse has an energy and pulse duration selected to produce a single continuous filament within said substrate;translating said substrate relative to said focused laser beam to irradiate said substrate and produce additional single continuous filaments at locations in said substrate;said single continuous filaments form an array defining an internally scribed path for cleaving said substrate;each said single pulse of said focused laser beam is focused to provide a sufficient beam intensity within said substrate to cause self-focusing of the focused laser beam over an extended laser interaction focal volume, thereby producing a plasma channel within said substrate while avoiding optical breakdown, such that substantially uniform modification of said material occurs along said beam path, thereby forming a single continuous filament within said substrate; ...

Apparatus and method for overlap laser welding

Apparatus for laser welding a first metal part ( 1 ) to a second metal part ( 2 ), which apparatus comprises: a laser ( 3 ) which emits a laser beam ( 6 ) in the form of laser pulses ( 21 ), a scanner ( 4 ) for moving the laser beam ( 6 ) with respect to a metal surface ( 7 ) of the first metal part ( 1 ), an objective lens ( 5 ) which focuses the laser beam ( 6 ) onto the metal surface ( 7 ), and a controller ( 12 ) which controls the scanner ( 4 ) such that it moves the laser beam ( 6 ) with respect to the metal surface ( 7 ) to a plurality of focussed spots ( 16 ), characterised in that the apparatus focuses the laser pulses ( 21 ) with a spot size ( 34 ) and a pulse fluence ( 36 ) that causes the formation of a plurality of melt pools ( 19 ) in the first metal part ( 1 ) and heat stakes ( 17 ) in the second metal part ( 2 ), each heat stake ( 17 ) extends from a different one of the melt pools ( 19 ) and has a distal end ( 101 ), and the controller ( 12 ) spaces the focussed spots ( 16 ) apart by a distance ( 18 ) that is small enough to cause the melt pools ( 19 ) to overlap and that is large enough to ensure the distal ends ( 101 ) of the heat stakes ( 17 ) are distinct and separate from each other in at least one direction ( 108 ).

PROCESSING 3D SHAPED TRANSPARENT BRITTLE SUBSTRATE

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a COlaser for fully automated separation. 1. A glass article having a 3D surface , the glass article having at least one edge having a plurality of defect lines extending at least 250 microns , the defect lines each having a diameter less than or equal to about 5 microns.2. The glass article of claim 1 , wherein the glass article comprises strengthened glass.3. The glass article of claim 1 , wherein the glass article comprises unstrengthened glass.4. The glass article of claim 1 , wherein the edge has an Ra surface roughness less than about 0.5 microns.5. The glass article of claim 1 , wherein the edge has subsurface damage up to a depth less than or equal to about 75 microns.6. The glass article of claim 1 , wherein a distance between the defect lines is less than or equal to about 7 microns. This application is a divisional of U.S. application Ser. No. 14/530,379 filed on Oct. 31, 2014, which claims the benefit of U.S. Provisional Application No. 61/917,127 filed on Dec. 17, 2013, U.S. Provisional Application No. 62/024,581 filed on Jul. 15, 2014, and U.S. Provisional Application No. 62/046,360 filed on Sep. 5, 2014; the entire disclosures of which are incorporated herein by reference.The next wave of consumer electronics products is incorporating not only software and hardware innovations, but also changes that have design and functional appeal. New products are being announced and released on a ...

ARTICLE COMPRISING A METAL SUBSTRATE AND A CHANNEL IN THE METAL SUBSTRATE AND METHOD FOR PRODUCING SAME

An article having a metal substrate and a channel in the metal substrate which is partly or completely open to the surface, wherein the cross section of the channel has a local width maximum () between the channel base () and the contact plane (), measured parallel to the contact plane and at right angles to the longitudinal channel axis in the section perpendicular to the surface. (FIG. ) 1. An article having.a metal substrate, anda channel defined by a wall encasing the channel in the metal substrate,wherein the channel has an opening at a surface of the article;{'b': ['5', '7', '1'], '#text': 'wherein a cross section of the channel has a local width maximum () between a base () of the channel and a contact plane () when measured at a widest section of the cross section of the channel;'}{'b': '1', '#text': 'wherein the contact plane () is defined as the plane corresponding to a secant that runs through two contact points of a circle having a radius of 3 mm disposed on the opening of the channel from a perspective of the cross section of the channel;'}andwherein a region proximal to the wall of the channel has a heat-affected zone having an altered grain size structure compared to a grain size structure of the metal substrate which is not heat affected.251. The article as claimed in claim 1 , wherein the local width maximum () is ≥0.5 μm beneath the contact plane ().35. The article as claimed in claim 1 , wherein the local width maximum () measured at right angles to a longitudinal axis of the channel is ≥1 μm.45. The article as claimed claim 1 , wherein the channel has an aspect ratio of the local width maximum () claim 1 , measured at right angles to the longitudinal axis of the channel claim 1 , to a length of the channel claim 1 , measured parallel to the surface of the article of ≥1:3.513. The article as claimed in claim 1 , wherein the channel measured at right angles to the contact plane () has a depth () of 0.1 μm to 10 000 μm.6. The article as claimed in ...

SEPARATION AND RELEASE OF LASER-PROCESSED BRITTLE MATERIAL

A method for separating and releasing a closed-form piece from a workpiece made of a brittle material is disclosed. A first pulsed laser-beam creates defects along the outline of the closed-form piece. A second laser-beam selectively heats the closed-form piece for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam is applied for a second time that causes melting and deformation of the closed-form piece. The deformation opens a gap between the closed-form piece and the rest of the workpiece, thereby allowing release of the closed-form piece. 1. A method for separating and releasing a closed-form piece from a workpiece made of a brittle material using a beam of laser-radiation , the method comprising:providing a workpiece having a plurality of defects along an outline of the closed-form piece created by laser processing;applying the beam of laser-radiation to the closed-form piece for a first duration, the beam of laser-radiation initiating cracking between the defects;pausing application of the beam of laser-radiation while the cracking propagates completely between the defects; andapplying the beam of laser-radiation for a second duration, the beam of laser-radiation heating at least a portion of the closed-form piece above the melting temperature of the brittle material, the melting causing deformation;wherein contraction of the deformed closed-form piece during cooling after the second duration opens a gap between the closed-form piece and the rest of the workpiece.2. The separating and releasing method of claim 1 , wherein the defects were created by laser filaments formed by focusing a beam of pulsed laser-radiation.3. The separating and releasing method of claim 1 , wherein the defects are in the form of voids.4. The separating and releasing method of claim 1 , wherein the beam of laser-radiation is ...

Laser system and method thereof

A laser system includes a laser configured to emit pulse bursts and a motion device in optical communication with the laser. The motion device moves a laser beam along a process path on a substrate and is configured to have a natural frequency that is greater than an operating frequency of the laser system. The laser system enables high and constant speed processing along tight radii in the process path, which is useful to form laser induced channels along the process path with equal spacing.

LASER BEAM POSITIONING SYSTEM, LASER PROCESSING DEVICE AND CONTROL METHOD

A method is provided of controlling a laser processing device with at least one laser. The method includes setting an optical path of the laser processing device by at least one rotatable mirror; a first triggering of the laser at a first point in time so as to generate a first laser spot; continuously adjusting, the optical path of the laser processing device; and a second triggering of the laser at a second point in time so as to generate a second laser spot. The method also includes, before the second triggering: determining the second point in time so that the position of the second laser spot has a desired distance, along the path, to the position of the first laser spot. 1. A method of controlling a laser processing device having at least one laser , comprising:setting an optical path of the laser processing device by at least one deflection element, including at least one rotatable mirror, so that a path point which can be generated by a laser beam following the optical path lies on a desired path on or in an object;a first triggering of the laser at a first point in time so as to generate a first laser spot;adjusting, in particular continuously adjusting, the optical path of the laser processing device by the at least one rotatable mirror, so that a path point which can be generated by the laser beam following the optical path lies on the desired path;a second triggering of the laser at a second point in time so as to generate a second laser spot;wherein the method comprises the following step before the second triggering:determining the second point in time on the basis of at least one of a target position, a first or a higher time derivative thereof, and a first or a higher time derivative of an actual position of the path point of the optical path along the desired path, so that a position of the second laser spot has a desired distance, along the desired path, to a position of the first laser spot.2. The method according to claim 1 , wherein the second ...

PROCESSING DEVICE

A processing device forms, in an object to be processed, a modified spot constituting a modified region. The processing device includes a first irradiation unit configured to irradiate the object with first light to temporarily increase absorptivity in a partial region of the object as compared with the absorptivity before irradiation of the first light, and a second irradiation unit configured to irradiate the partial region with second light in an absorptivity increase period in which the absorptivity of the partial region is temporarily increased. 1. A processing device for forming , in an object to be processed , a modified spot constituting a modified region , the processing device comprising:a first irradiation unit configured to irradiate the object with first light to temporarily increase absorptivity in a partial region of the object as compared with the absorptivity before irradiation of the first light; anda second irradiation unit configured to irradiate the partial region with second light in an absorptivity increase period in which the absorptivity of the partial region is temporarily increased.2. The processing device according to claim 1 , wherein energy of the second light is greater than energy of the first light.3. The processing device according to claim 1 , wherein peak intensity of the second light is lower than peak intensity of the first light.4. The processing device according to claim 1 , wherein a wavelength of the second light is different from a wavelength of the first light.5. The processing device according to claim 1 , wherein the second light is light with which no modified spot is formed when being singly applied to the object.6. The processing device according to claim 1 , wherein an irradiation direction of the second light with respect to the object is different from an irradiation direction of the first light with respect to the object.7. The processing device according to claim 1 , wherein an angle at which the second light ...

NANOPOSITIONER AND METHOD OF MAKING

A tunable, all-optical, coupling method for a high-Q silica microsphere and an optical waveguide is disclosed. By means of a novel optical nanopositioning method, induced thermal expansion of an asymmetric microsphere stem for laser powers up to 211 mW is observed and used to fine tune the microsphere-waveguide coupling. Microcavity displacements ranging from (0.61±0.13)−(3.49±0.13) μm and nanometer scale sensitivities varying from (2.81±0.08)−(17.08±0.76) nm/mW are obtained. Additionally, an apparent linear dependency of coupling distance on stem laser heating is achieved. Using these methods, coupling can be altered such that the differing and customizable coupling regimes can be achieved. 1. A method of fabricating a nanopositioner environment , comprising:attaching a weight to the bottom of a predetermined length of a first fiber;a CO2 laser side-heating the first fiber, where the CO2 laser is located perpendicular to a central axis of the first fiber;applying side-heat to the first fiber, thereby deforming a core of the first fiber;warping the core in such a way that the core is shifted to one side of the first fiber;focusing a beam to a spot size smaller than a diameter of the first fiber;adjusting the position of the CO2 laser such that the heating occurs predominantly on one side of the first fiber;inducing an asymmetry by reducing the spot size;pulsing the laser power in order to mimic an etching-like process via ablation; therebycarving the asymmetry out of the first fiber thereby creating an asymmetric stem;obtaining a predetermined geometry in the asymmetric stem suitable for preventing laser light from passing unimpeded through the first fiber;melting a tip of the first fiber such that the melted tip of the asymmetric stem assumes a spherical morphology thereby forming a microsphere.2. The method of claim 1 , further comprising:broad-focus laser heating of the microsphere; therebyreducing surface irregularities.3. The method of claim 1 , further ...

ELECTRODE FOR A MEDICAL DEVICE

One aspect refers to an electrode for a medical device including a monolithic substrate having at least one surface including a continuous pattern, wherein the continuous pattern is formed by at least one set of hollow lines, and wherein the at least one set of hollow lines forms the boundaries of repeating elements. One aspect further relates to a medical device including the electrode according to one embodiment, and to a process for preparing the electrode according to one embodiment. 1. An electrode for a medical device comprising a monolithic substrate having at least one surface comprising a continuous pattern ,wherein the continuous pattern is formed by at least one set of hollow lines, andwherein the at least one set of hollow lines forms the boundaries of repeating elements.2. The electrode according to claim 1 , wherein the monolithic substrate is a metal selected from the group of iron claim 1 , silver claim 1 , copper claim 1 , nickel claim 1 , palladium claim 1 , platinum claim 1 , gold claim 1 , iridium claim 1 , steel claim 1 , titanium claim 1 , hafnium claim 1 , niobium claim 1 , tantalum claim 1 , cobalt claim 1 , chromium claim 1 , zirconium claim 1 , rhenium claim 1 , tungsten claim 1 , molybdenum claim 1 , and alloys of each one of these metals claim 1 , and preferably is platinum or a platinum alloy.3. The electrode according to claim 1 , wherein the repeating elements have a width and/or a length in the range of 1 to 200 μm claim 1 , or wherein the repeating elements have a width which is below 50 μm and a length which is above 50 μm.4. The electrode according to claim 1 , wherein the repeating elements have a width and/or a length in the range of 10 to 50 μm.5. The electrode according to claim 1 , wherein the repeating elements have a width and a length in the range of 5 to 50 μm.6. The electrode according to claim 1 , wherein the repeating elements have a width and a length in the range of 10 to 30 μm.7. The electrode according to claim 1 , ...

PROCESS SHEET RESISTANCE UNIFORMITY IMPROVEMENT USING MULTIPLE MELT LASER EXPOSURES

Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate. 1. A thermal processing apparatus , comprising:a laser source; and a first member which is substantially transparent to the energy emitted from the laser source; and', 'a second member which is substantially non-transmissive to the energy emitted from the laser source, wherein the second member is disposed at the first member substantially at the focal plane., 'an aperture member disposed at a focal plane of energy emitted from the laser source, the aperture member comprising2. The apparatus of claim 1 , wherein an opening is formed within the first member substantially coplanar with the second member.3. The apparatus of claim 2 , wherein the opening has a volume defined by the first member and the second member.4. The apparatus of claim 1 , wherein the first member comprises a quartz or glass material.5. The apparatus of claim 1 , wherein the second member is formed from an opaque material or a reflective material.6. The apparatus of claim 5 , wherein the second member is formed from a reflective metallic material.7. The apparatus of claim 5 , wherein the second member is a dielectric mirror.8. The apparatus of claim 5 , wherein an interior surface of the second member is angled.9. The apparatus of claim 1 , further comprising:a third member disposed radially outward of the first member and the second member.10. The apparatus of claim 9 , wherein the first member claim 9 , the second member claim 9 , and the third member are coupled by a substantially transparent adhesive.11. The apparatus of claim 10 , wherein the substantially transparent adhesive is Canada balsam.12. The apparatus of claim 1 , wherein the aperture member is coupled to a controller and a motor.13. The ...

LASER MACHINING DEVICE AND LASER MACHINING METHOD

A laser processing apparatus that performs laser processing on an object to be processed by irradiating the object with laser light along a line to process includes a support table, a laser light source, a converging unit, a moving unit, an actuator, a displacement sensor, a temperature sensor, and a control unit. The control unit calculates the amount of driving of a converging unit that is performed by the actuator on the basis of a displacement of an incidence surface measured by the displacement sensor and a temperature of the converging unit detected by the temperature sensor, and controls the actuator such that the converging unit is driven according to the amount of driving when the moving unit relatively moves a converging point. 1: A laser processing apparatus that performs laser processing on an object to be processed by irradiating the object with laser light along a line to process , the laser processing apparatus comprising:a support table that supports the object;a laser light source that outputs the laser light;a converging unit including a converging lens for converging the laser light on the object supported by the support table;a moving unit that moves at least one of the support table and the converging unit along an incidence surface of the laser light in the object and relatively moves a converging point of the laser light along the line to process;an actuator for driving the converging unit in a direction crossing the incidence surface;a displacement sensor that measures a displacement of the incidence surface along the line to process;a temperature sensor that detects a temperature of the converging unit; anda control unit that calculates the amount of driving of the converging unit by the actuator on the basis of the displacement of the incidence surface measured by the displacement sensor and the temperature of the converging unit detected by the temperature sensor, and controls the actuator such that the converging unit is driven according ...

Machining Metal Removal Control

A process is disclosed for controlling the length of chips or shavings on materials that is inherent to produce long undesired chips when machined. Based on the work piece configuration and surface area to machine a determined outlay and process application for a continuous scribe or arrangements of different scribe pattern or patterns for the part and or surface is selected to provide optimal chip control during the machining operation. Engineered Interruptions are applied to the work object prior to the machining operation to maximize optimal chip control. Controlling the depth of scribe of the laser is accomplished and managed through the interface of hardware, software and electronics. 1. A method of machining a work piece , comprising:emitting an energy beam onto a to piece to form a first cut in a spiral orientation along the work piece and having a defined space between adjacent spinal sections of the first cut;measuring a real-time cutting depth of the energy beam;generating a feedback signal representing the real-time cuffing depth; andmaking a second cut on the work piece with a cutting tool, the second out removing material from the work piece, the second cut being adjacent to where the first cut in the surface of the work piece was made by the energy beam, controlling the depth of the first cut made by the energy earn by adjusting, the position of the energy beam with respect to the work piece or adjusting the power supplied to the energy beam in response to the feedback signal, the depth of the first cut being from about 40% to about 60% of the depth of the second cut that remove material from the work piece, creating interruptions in the work piece with the first cut, the interruptions causing the material removed from the work piece by the cutting tool to break into pieces of a desired length, size of the defined space determining the desired length of the pieces.2. The method of in which adjusting the depth of the groove is accomplished by changing ...

Laser pulse shaping for additive manufacturing

The present disclosure relates to an apparatus for additively manufacturing a product in a layer-by-layer sequence, wherein the product is formed using powder particles deposited on an interface layer of a substrate. A laser generates first and second beam components, where the second beam component has a substantially higher power level and a substantially shorter duration than the first beam component. A mask is used to create a 2D optical pattern in which only select portions of the first and second beam components are allowed to irradiate the powdered particles. The first beam component heats the powder particles at least to substantially a melting point, at which point the particles begin to experience surface tension forces relative to the interface layer. While the particles are heated, the second beam component further heats the particles and also melts the interface layer of the substrate before the surface tension forces can act on and distort the particles, and such that the particles and the interface layer are able to bond together.

CUTTING DEVICE FOR CUTTING COMPOSITE MATERIAL

A cutting device for cutting a composite material includes a carrier module and a laser generating module. The carrier module is used for carrying the composite material. The laser generating module is used for providing a laser beam. The laser generating module includes a laser scanning writer for providing a laser source, and a laser path adjuster located on a scanning path of the laser source. The laser path adjuster adjusts the scanning path of the laser beam or the carrier module carries the composite material to move, so that a cutting area formed by projecting the laser beam onto the composite material is offset parallel. 1. A cutting device for cutting a composite material , comprising:a carrier module for carrying the composite material; and a laser scanning writer for providing a laser source; and', 'a laser path adjuster located on a scanning path of the laser source,, 'a laser generating module configured to provide a laser beam and includingwherein the laser path adjuster adjusts the scanning path of the laser beam or the carrier module carries the composite material to move, so that a cutting area formed by projecting the laser beam onto the composite material is offset parallel.2. The cutting device for cutting the composite material according to claim 1 , wherein the laser beam is offset parallel relative to the composite material by the adjustment of the laser path adjuster.3. The cutting device for cutting the composite material according to claim 1 , wherein the composite material is offset parallel relative to the laser generating module by being carried and moved by the carrier module.4. The cutting device for cutting the composite material according to claim 1 , wherein a pulse width of the laser source is in the order of femtoseconds.5. The cutting device for cutting the composite material according to claim 1 , wherein a pulse width of the laser source is less than 500 femtoseconds.6. The cutting device for cutting the composite material ...

DEVICE AND METHOD FOR LASER-BASED SEPARATION OF A TRANSPARENT, BRITTLE WORKPIECE

The present disclosure provides a device and a method for laser-based separation of a transparent, brittle workpiece, comprising a laser that emits a laser beam having an intensity (I) along an optical axis (P), and an optical device. The optical device has at least one one-piece double axicon. The double axicon has an entrance surface and the optical device has an exit surface. The entrance surface is such that in the double axicon, a ring beam is formed. The intensity (I) in the double axicon is lower than the threshold intensity (I) of the material of the double axicon. The exit surface is such that a line focus having a maximum intensity (I) and a length (L) is generated in the direction of the laser beam behind the exit. 1. A device for the laser-based separation of a transparent , brittle workpiece , having a laser , which emits a laser beam with an intensity Ialong an optical axis , and an optical device ,wherein the optical device has at least one one-piece double axicon,wherein the double axicon has an entrance surface and the optical device has an exit surface,wherein the entrance surface is designed in such a way that a ring beam is formed in the double axicon,{'sub': L', 'S, 'wherein the intensity Iin the double axicon is less than the threshold intensity Iof the material of the double axicon, and'}{'sub': max', 'f, 'wherein the exit surface is such that a line focus having a maximum intensity Iand a length Larises in the direction of the laser beam behind the exit surface.'}2. The device according to claim 1 , wherein the double axicon is a Galileo axicon.3. The device according to claim 1 , wherein the double axicon is a Kepler axicon.4. The device according to claim 1 , wherein the one-piece double axicon is monolithic.5. The device according to claim 4 , wherein the double axicon has a refractive index of 1.35≤n≤1.9.6. The device according to claim 1 , wherein the double axicon is composed of a first planar axicon and a second planar axicon.7. The ...

Method for connecting a metal sheet at least partially to a busbar and an arrangement of a busbar and a metal sheet

A method for connecting a metal sheet () at least partially to a busbar (), including: 22. The method according to claim 1 , wherein the metal sheet () is at least a part of a flexible printed circuit.3. The method according to claim 1 , wherein said laser pulses have a pulse duration between 0.1 ns and 800 ns.477. The method according to claim 1 , wherein a plurality of welding joints () is realized within the contact region claim 1 , wherein the welding joints () are spatially separated from each other.57. The method according to claim 4 , wherein the plurality of welding joints () is grouped.62121. The method according to claim 1 , wherein prior to welding the metal sheet () to the busbar () claim 1 , at least the contact region of the metal sheet () is fixed to the busbar () for forming a gap-free arrangement in the contact region.71. The method according to claim 1 , wherein prior to welding a surface treatment is realized on at least one part of the busbar ().87. The method according to claim 1 , wherein a ratio of a spot size of the welding joint () to a size of the contact region is smaller than 0.2.97. The method according to claim 1 , wherein the spot size of the welding joint () is between 0.01 mmand 5 mm.10. The method according to claim 1 , wherein the size of the contact region is between 1 mmand 80 mm.1177. The method according to claim 4 , wherein the welding joints () of the group of welding joints () are at least partially arranged in a row.121. The method according to claim 1 , wherein the busbar () is coated and/or plated with a metal layer.1321. The method according to claim 1 , wherein the metal sheet () outside the connection region extends slanted or curved relative to an outer surface of the busbar ().14. The method according to claim 1 , wherein a cross section of the welding joint is at least partially rectangularly claim 1 , elliptically claim 1 , triangularly claim 1 , and/or circularly shaped.1512. An arrangement of a busbar () and a ...

STRUCTURAL COMPONENT AND A METHOD OF MANUFACTURING SUCH A COMPONENT

A structural component for a motor vehicle comprises first and second profiled sheet metal parts joined together by welding spots, which sheet metal parts have opposing free ends arranged to be mating to form an overlapping portion over a predetermined distance. A cross-section of the component through the overlapping portion has a hat shape that comprises first and second edge portions extending in the longitudinal direction of the component, first and second side portions arranged to join a respective edge portion, and a central portion arranged to join the side portions. The free end of the central portion of each sheet metal part comprises at least two tabs separated by a recess, and the tabs of the first and second sheet metal parts are joined to a part of an adjacent central portion by welding. The disclosure further relates to a method for making the component. 1. A structural component for a motor vehicle , the structural component comprising: first and second edge portions extending in a longitudinal direction of the component;', 'first and second side portions that are each arranged to join a respective edge portion; and', 'a central portion arranged to join the side portions;, 'first and second profiled sheet metal parts joined together by welding spots, which sheet metal parts have opposing free ends arranged to mate to form an overlapping portion over a predetermined distance, wherein a cross-section of the component through the overlapping portion has a hat shape with each sheet metal part comprisingwherein the free end of the central portion of each sheet metal part comprises at least two tabs separated by a recess, and the tabs of each sheet metal part are joined to a part of an adjacent central portion by welding.2. The structural component according to wherein each recess extends from the free end of a respective central portion past a welding spot on an adjacent tab.3. The structural component according to wherein at least one welding spot is ...

SiC WAFER PRODUCING METHOD

An SiC wafer is produced from a single crystal SiC ingot by a method that includes forming a plurality of breakable layers constituting a separation surface in the SiC ingot, each breakable layer including a modified layer and cracks extending from the modified layer along a c-plane, and separating part of the SiC ingot along the separation surface as an interface to thereby produce the SiC wafer. In forming the separation surface, the energy density of a pulsed laser beam is set to an energy density not causing the formation of an upper damage layer above the breakable layer previously formed due to the reflection of the pulsed laser beam from the breakable layer and not causing the formation of a lower damage layer below the breakable layer previously formed due to the transmission of the pulsed laser beam through the breakable layer. 1. An SiC wafer producing method for producing an SiC wafer from a single crystal SiC ingot having a first surface , a second surface opposite to said first surface , a c-axis extending from said first surface to said second surface , and a c-plane perpendicular to said c-axis , said c-axis being inclined by an off angle with respect to a normal to said first surface , said off angle being formed between said c-plane and said first surface , said SiC wafer producing method comprising:a breakable layer forming step of setting a focal point of a pulsed laser beam having a transmission wavelength to SiC inside said SiC ingot at a predetermined depth from said first surface, said predetermined depth corresponding to the thickness of said SiC wafer to be produced, and next applying said pulsed laser beam to said SiC ingot as relatively moving said SiC ingot and said focal point in a first direction perpendicular to a second direction where said off angle is formed, thereby forming a breakable layer inside said SiC ingot at said predetermined depth, said breakable layer including a modified layer extending in said first direction and ...

Dynamic optical valve for mitigating non-uniform heating in laser processing

Embodiments of the present invention generally relate to an optical valve that modifies a laser beam to allow more energy to be irradiated onto less absorbing areas on a substrate and less energy to be irradiated onto more absorbing areas on the substrate, thus creating a more uniform heating field. The optical valve is a layered structure comprising a reflective switch layer, an absorbing layer, a thermal resistor and a thermal bath.

METHOD FOR MANUFACTURING OPTICAL DEVICE, OPTICAL DEVICE, AND MANUFACTURING DEVICE FOR OPTICAL DEVICE

A method for manufacturing an optical device includes: a laser irradiation step of condensing pulsed first laser light and pulsed second laser light to the inside of a glass member including germanium and titanium; and a condensing position movement step of moving condensing positions relatively to the glass member. Each of the first laser light and the second laser light has a repetition frequency of 10 kHz or greater. The first laser light is condensed to a dot-shaped condensing region, and the second laser light is condensed to an annular condensing region surrounding the condensing region of the first laser light. A central wavelength of the first laser light is greater than 400 nm and equal to or less than 700 nm, and a central wavelength of the second laser light is equal to or greater than 800 nm and equal to or less than 1100 nm. 1. A method for manufacturing an optical device , comprising:a laser irradiation step of condensing pulsed first laser light and pulsed second laser light in a glass member including germanium and titanium to cause a photo-induced refractive index variation in the glass member; anda condensing position movement step of moving condensing positions of the first laser light and the second laser light relatively to the glass member,wherein each of the first laser light and the second laser light has a repetition frequency of 10 kHz or greater,the laser irradiation step includes condensing the first laser light to a dot-shaped condensing region and condensing the second laser light to an annular condensing region surrounding the condensing region of the first laser light,the first laser light has a central wavelength greater than 400 nm and equal to or less than 700 nm, and the second laser light has a central wavelength equal to or greater than 800 nm and equal to or less than 1100 nm, andthe laser irradiation step and the condensing position movement step are alternately repeated or are performed in parallel to form a continuous ...

A Weld

A weld () between a first material () and a second material (), the first material () being a first metallic material, and the second material () being a second metallic material, the weld () has a width () between 0.5 mm and 7 mm, the weld () comprises at least one microweld (), the microweld () forms a welding pattern () defined parallel to a surface () of the first material (), and the microweld () has a characteristic feature size () of between 20 μm and 400 um. 143.-. (canceled)44. A weld between a first material and a second material , the first material being a first metallic material , and the second material being a second metallic material ,the weld comprises at least one microweld,the microweld forms a welding pattern defined parallel to a surface of the first material, andthe microweld has a characteristic feature size of between 20 μm and 400 μm.45. A weld according to wherein the weld has a width between 0.5 mm and 7 mm.46. A weld according to wherein the first material and the second material remain substantially unmixed in the weld.47. A weld according to wherein the weld is substantially inhomogeneous.48. A weld according to wherein the weld comprises discrete zones of the first metallic material and the second metallic material.49. A weld according to wherein the microweld comprises a hole formed in the first material claim 44 , and wherein at least one of the first and the second material has flowed into the hole.50. A weld according to wherein the first material has a top surface and a bottom surface claim 49 , the bottom surface is closer to the second material than the top surface claim 49 , the hole has a width at the top surface and a width at the bottom surface claim 49 , the width at the top surface is wider than the width at the bottom surface and the second material has flowed into the hole.51. A weld according to wherein the first material comprises a metal selected from the group consisting of copper claim 44 , aluminium claim 44 , iron ...

INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER

An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10/K to 3.4×10/K. The interposer further includes a number of holes having diameters ranging from 20 μm to 200 μm. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip. 1. A method for producing holes in a board-shaped base substrate of an interposer which is adapted for electrical connection between a CPU chip and a circuit board , the method comprising the steps of:providing the board-shaped base substrate to be perforated, the board-shaped base substrate being made of glass;aligning laser beams to predetermined perforation points of the board-shaped base substrate;triggering focused laser pulses in a wavelength range between 1600 and 200 nm in which the glass is at least partially transparent and with a radiation intensity that causes local non-thermal destruction of the glass along filamentary channels at the predetermined perforation points; andwidening the filamentary channels to a desired diameter of the holes.2. The method of claim 1 , wherein the widening step comprises electro-thermal heating and evaporation of perforation material in the filamentary channels due to dielectric breakdowns.3. The method of claim 1 , wherein the widening step comprises directing reactive gases onto the filamentary channels.4. The method of claim 1 , wherein the widening step comprises etching.5. The method of claim 1 , wherein the board-shaped base substrate is made of a single layer of glass having a first and a second substrate surface.6. The method of claim 5 , wherein the board-shaped base substrate has transversely to the first and second substrate surfaces ...

METHOD FOR SELECTIVELY IRRADIATING A MATERIAL LAYER, METHOD FOR PROVIDING A DATA SET, DEVICE AND COMPUTER PROGRAM PRODUCT

A method for selectively irradiating a material layer in additive production. The method includes: providing geometry data having geometry information of individual layers of a component that is to be produced by additive means, and defining an irradiation pattern for the layers by a computer-supported production method, wherein the irradiation pattern has a contour and a surface region in layers, wherein first contour vectors of the contour are specified for continuous irradiation operation and second contour vectors of the contour are specified for pulsed irradiation operation. A method for providing a data set, an additive production method, a corresponding device and a corresponding computer program product selectively irradiate a material layer in additive production. 1. A method for selectively irradiating a material layer in additive production , the method comprising:providing geometrical data comprising geometrical information of individual layers of a component to be additively produced,defining an irradiation pattern for the layers by means of a computer-aided manufacturing method, the irradiation pattern layerwise comprising a contour and a surface region, lying inside the contour,wherein first contour vectors of the contour for continuous irradiation operation and second contour vectors of the contour for pulsed irradiation operation are established, andwherein further irradiation parameters for the irradiation pattern comprising vector length, pulse length, scan or irradiation speed, laser power, track or strip distance and/or strip width are established.2. The method as claimed in claim 1 ,wherein the contour comprises regions of the component having a defined surface quality or structural quality and/or a defined dimensional accuracy.3. The method as claimed in claim 1 ,wherein the irradiation pattern is defined as a function of an overhang angle of individual cross-sectional regions of the component.4. The method as claimed in claim 1 ,wherein a ...

Complex laser folding and fabrication

Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.

Apparatus and method of improving beam shaping and beam homogenization

The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. Typically, the anneal regions may be square or rectangular in shape. Generally, the optical system and methods of the present invention are used to preferentially anneal one or more regions found within the anneal regions by delivering enough energy to cause the one or more regions to re-melt and solidify.

COUNTER ELECTRODE MATERIAL FOR ELECTROCHROMIC DEVICES

Various embodiments herein relate to electrochromic devices, methods of fabricating electrochromic devices, and apparatus for fabricating electrochromic devices. In a number of cases, the electrochromic device may be fabricated to include a particular counter electrode material. The counter electrode material may include a base anodically coloring material. The counter electrode material may further include one or more halogens. The counter electrode material may also include one or more additives. 128-. (canceled)29. An integrated deposition system for fabricating an electrochromic device stack , the integrated deposition system comprising:a plurality of deposition stations aligned in series and interconnected and operable to pass a substrate from one station to the next without exposing the substrate to an external environment, wherein the plurality of deposition stations comprises(i) a first deposition station containing a first one or more material sources for depositing a cathodically coloring layer; wherein the second one or more material sources for depositing the anodically coloring layer comprise at least a first metal and a halogen, the second one or more material sources for depositing the anodically coloring layer optionally comprising one or more-additives,', 'wherein the first metal is selected from the group consisting of—chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), rhodium (Rh), and iridium (Ir), ruthenium (Ru), vanadium (V), and combinations thereof, and', 'wherein the optional one or more additives are selected from the group consisting of silver (Ag), arsenic (As), gold (Au), boron (B), cadmium (Cd), cesium (Cs), copper (Cu), europium (Eu), gallium (Ga), gadolinium (Gd), germanium (Ge), mercury (Hg), osmium (Os), lead (Pb), palladium (Pd), promethium (Pm), polonium (Po), platinum (Pt), radium (Ra), rubidium (Rb), terbium (Tb), technetium (Tc), thorium (Th), thallium (Tl), tungsten (W), and combinations thereof; and, '(ii) a ...

Method and device for etching patterns inside objects

Systems and methods for etching complex patterns on an interior surface of a hollow object are disclosed. A method generally includes positioning a laser system within the hollow object with a focal point of the laser focused on the interior surface, and operating the laser system to form the complex pattern on the interior surface. Motion of the laser system and the hollow object is controlled by a motion control system configured to provide rotation and/or translation about a longitudinal axis of one or both of the hollow object and the laser system based on the complex pattern, and change a positional relationship between a reflector and a focusing lens of the laser system to accommodate a change in distance between the reflector and the interior surface of the hollow object.

MANUFACTURING DEVICE

The invention relates to a device () for manufacturing a part () made of metallic material, comprising a depositing member () made of said metallic material. The device () further comprises an impacting member () of the material being deposited by emitting an energy beam (), so as to locally modify its crystalline structure. 11100245. A device () for manufacturing a part () made of metallic material , comprising a member () for depositing said metallic material , characterized in that it also comprises an impact member () for impacting the material being deposited by emitting an energy beam () , so as to locally modify its crystal structure.212101. The device () as claimed in claim 1 , wherein the deposition member () is configured to deposit beads () of molten metal.31210. The device () as claimed in claim 2 , wherein the deposition member () is configured to deposit beads () of molten titanium-based alloy.4145101. The device () as claimed in claim 2 , wherein the impact member () is configured to focus the energy beam () on at least one of the beads ().514. The device () as claimed in claim 1 , wherein the impact member () is adapted to locally modify the crystal structure into a substantially equiaxed structure.614. The manufacturing device () as claimed in claim 1 , wherein said impact member () is a laser claim 1 , preferentially a pulsed laser having a pulse duration comprised between 5 nanoseconds and 150 nanoseconds.7124. The device () as claimed in claim 1 , comprising a closed enclosure confining the deposition member () and the impact member ().8154. The device () as claimed in claim 7 , comprising an inductor for regulating a temperature in the closed enclosure claim 7 , a camera coupled to a pyrometer for viewing the part and measuring the temperature before the energy beam () is emitted by the impact member ().910015. A process for manufacturing a titanium-based alloy part () claim 1 , using a device () as claimed in claim 1 , the process comprising ...

ABLATION FOR FEATURE RECOVERY

When opaque films are deposited on semi-conductor wafers, underlying features may be concealed. In accordance with one implementation, such concealed features may be re-exposed via an ablation recovery process. One ablation recovery process entails aligning an energy source with a target position on a first surface of a semiconductor wafer based on position information retrieved from a second opposite surface of the semiconductor wafer, and firing a beam of the energy source to ablate opaque material at the target position and to expose a recovery feature underlying the opaque material. 1. A method comprising:aligning an energy source with a target position on a first surface of a semiconductor wafer based on position information retrieved from a second opposite surface; andfiring a beam of the energy source to ablate opaque material at the target position and to expose a recovery feature underlying the opaque material.2. The method of claim 1 , wherein the energy source is a laser.3. The method of claim 1 , wherein aligning the energy source further comprises:aligning the energy source with the target position using an alignment feature visible on the second opposite surface.4. The method of claim 3 , further comprising:etching the alignment feature on the second opposite surface of the semiconductor wafer; androtating the semiconductor by 180 degrees prior to the alignment operation.5. The method of claim 3 , further comprising:positioning a mirror to reflect an image of the second opposite surface including the alignment feature.6. The method of claim 3 , further comprising:capturing, with a camera, a reflection of the alignment feature in a mirror; andidentifying a position of the recovery feature based on the reflection.7. The method of claim 6 , further comprising:defining a target ablation region based on the identified position of the recovery feature.8. The method of claim 7 , wherein the target position is within the target ablation region.9. The method of ...

METHOD OF PROVIDING DECORATIVE DESIGNS AND STRUCTURAL FEATURES ON AN ARTICLE OF FOOTWEAR

The invention relates to footwear and portions thereof having structural features and decorative designs thereon, and related systems and methods for manufacturing same. An exemplary method for providing a feature on a surface of an object includes positioning a laser proximate the surface of the object, directing a laser beam from the laser to the surface of the object to mark or engrave at least a portion of the surface of the object, and moving at least one of the laser and the object to create a pattern on the surface of the object, the pattern providing at least one of an aesthetic and a structural feature on the surface of the object. 134-. (canceled)35. A sole for an article of footwear , comprising:a midsole comprising a first midsole component, the first midsole component comprising an upper surface, a lower surface, and an interior portion extending between the upper surface and the lower surface and bounded by a sidewall, the sidewall comprising at least one first region and at least one second region, wherein;(i) the first region comprises a first pattern comprising a series of distributed structural elements comprising at least one of discrete unconnected polyhedronal elements, discrete unconnected spheroidal elements, or a grid of connected polyhedronal elements, the first pattern providing at least one of an aesthetic or a structural feature in the first region; and(ii) at least one of a size, a cross-sectional shape, an orientation, a depth, or a density of the structural elements differs between a first location and a second location of the first pattern.36. The sole of claim 35 , wherein the first pattern is substantially absent from the second region.37. The sole of claim 36 , wherein the sidewall comprises a plurality of first regions with at least one second region extending between the first regions.38. The sole of claim 35 , wherein the first midsole component comprises a single claim 35 , unitary foamed material.39. The sole of claim 35 , ...

WORKPIECE CUTTING METHOD

An object cutting method includes: a first step of preparing an object; a second step of irradiating the object with a laser light to form at least one row of modified regions in a single crystal silicon substrate of the object so as to extend between the at least one row of modified regions and a second main surface of the object along each of a plurality of lines to cut and to form a fracture; and a third step of, after the second step, performing dry etching on the object from the second main surface side to form a groove opening to the second main surface, along each of the plurality of lines to cut. In the second step, the modified region is formed so that a not-fracture region, to which the fracture does not extend, is formed at a predetermined position in the thickness direction in the object. 1. An object cutting method , comprising:a first step of preparing an object to be processed including a single crystal silicon substrate and a functional device layer provided on a first main surface side;a second step of, after the first step, irradiating the object with a laser light to form at least one row of modified regions in the single crystal silicon substrate along each of a plurality of lines to cut and to form a fracture in the object so as to extend between the at least one row of modified regions and a second main surface of the object along each of the plurality of lines to cut; anda third step of, after the second step, performing dry etching on the object from the second main surface side to form a groove opening to the second main surface, in the object along each of the plurality of lines to cut,wherein in the second step, the modified region is formed so that a not-fracture region to which the fracture does not extend is formed at a predetermined position in a thickness direction in the object.2. The object cutting method according to claim 1 , wherein the modified region includes at least a first modified region on the first main surface side from ...

METHOD OF DETERMINING WHETHER OR NOT RESULT OF PROCESSING PROCESS OF LASER PROCESSING APPARATUS IS ACCEPTABLE

There is provided a method of determining whether or not a result of a processing process of a laser processing apparatus is acceptable including a laser processing step of applying a laser beam to predetermined processing regions of a workpiece held on a chuck table, thereby performing a piercing process on the workpiece, an image capturing step of capturing images of all the processing regions while moving the image capturing unit and the workpiece relatively to each other, a detecting step of detecting regions where light is not transmitted through the workpiece among the processing regions in the image captured in the image capturing step, and a determining step of determining that the laser processing apparatus needs to be readjusted if the regions where light is not transmitted through the workpiece is equal to or more than the predetermined quantity. 1. A method of determining whether or not a result of a processing process of a laser processing apparatus is acceptable , the laser processing apparatus includinga chuck table including a transparent or semitransparent holding member having a holding surface for holding a surface of a workpiece in its entirety and light-emitting bodies disposed sideways of a surface of the holding member remote from the holding surface,a laser beam applying unit for applying a laser beam having a wavelength that is absorbable to the workpiece to the workpiece held on the chuck table,a moving unit for moving the chuck table and the laser beam applying unit relatively to each other, andan image capturing unit for capturing an image of the workpiece held on the chuck table,the method comprising:a laser processing step of applying a laser beam to predetermined processing regions of the workpiece held on the chuck table, thereby performing a piercing process on the workpiece;a light-emitting body energizing step of energizing the light-emitting bodies while the workpiece is being held on the chuck table;after the laser processing ...

DEVICE AND METHOD FOR SEPARATING A TEMPORARILY BONDED SUBSTRATE STACK

A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device. 19-. (canceled)10. A method for separating a temporarily bonded substrate stack , said method comprising:bombarding a joining layer of the temporarily bonded substrate stack by means of laser beams emitted by a laser;detecting the laser beams of the laser that are reflected and/or transmitted at the temporarily bonded substrate stack during the bombarding of the joining layer with the laser beams; andmonitoring and/or adapting parameters of the laser during the bombarding of the joining layer.11. The method according to claim 10 , wherein the method includes detecting the reflected and/or transmitted laser beams of the laser before the bombarding of the joining layer with the laser beams at the temporarily bonded substrate stack or a reference substrate stack.12. The method according to claim 10 , wherein the method includes controlling a beam shape and/or an intensity profile of the laser beams by means of the detected laser beams.13. The method according to claim 10 , wherein the bombarding of the joining layer takes place in a scanned manner with the laser beams.14. The method according to claim 10 , wherein the method includes evaluating the detected laser beams to control a process for separating the temporarily bonded substrate stack.15. A device for separating a temporarily bonded substrate stack claim 10 , said device comprising:means for bombardment of a joining layer of a substrate stack by means of laser beams emitted by a laser;detection means for detecting the laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate ...

Transparent material processing method, transparent material processing device, and transparent material

An object of one embodiment of the invention is to process a material simply and high efficiently. A fabrication method of transparent material is a method of processing a thermosetting transparent material. The fabrication method of transparent material includes a disposing step (S 01 ) of disposing an uncured thermosetting transparent material, a laser beam irradiation step (S 02 ) of irradiating the disposed uncured thermosetting transparent material with a laser beam so that cavitation bubbles are generated in the uncured thermosetting transparent material, and a curing step (S 03 ) of performing a curing process on the uncured thermosetting transparent material in which the cavitation bubbles are generated.

CERAMIC TRANSDUCER ELECTRONIC COMPONENT AND METHOD OF FORMING ELECTRODE THEREIN

A method of forming an electrode in a ceramic transducer electronic component is provided. The method includes preparing a sintered body for a ceramic transducer containing a metal oxide, performing patterning by irradiating a laser on a surface of the sintered body for a ceramic transducer, and forming a metal electrode by performing an electroless plating process on the sintered body for a ceramic transducer on which the patterning is formed, wherein, in the performing of the patterning by irradiating the laser on the surface of the sintered body for a ceramic transducer, the patterning is performed by irradiating the laser that satisfies at least one of a predetermined power condition and a predetermined processing speed condition. 1. A method of forming an electrode in a ceramic transducer electronic component , the method comprising;preparing a sintered body for a ceramic transducer containing a metal oxide;irradiating a laser on a surface of the sintered body for a ceramic transducer to perform patterning; andperforming an electroless plating process on the sintered body for a ceramic transducer, on which the patterning is formed, to form a metal electrode,wherein, in the irradiating of the laser on the surface of the sintered body for a ceramic transducer to perform the patterning, the laser that satisfies at least one of a predetermined power condition and a predetermined processing speed condition is irradiated to perform the patterning.2. The method of claim 1 , wherein the sintered body for a ceramic transducer is a sintered body for a ceramic transducer based on a PZT-PZN piezoelectric ceramic composition.3. The method of claim 1 , wherein claim 1 , in the irradiating of the laser on the surface of the sintered body for a ceramic transducer to perform the patterning claim 1 , the laser that satisfies a processing speed condition of 400 mm/sec or less as the predetermined processing speed condition is irradiated to perform the patterning.4. The method of ...

LASER PROCESSING APPARATUS

A laser beam irradiating unit of a laser processing apparatus includes a laser oscillator, a mirror configured to reflect a laser beam emitted from the laser oscillator and propagate the laser beam to a processing point, a power measuring unit configured to measure power of leakage light of the laser beam transmitted without being reflected by the mirror, and a condensing lens configured to condense the laser beam propagated by the mirror and irradiate a workpiece with the condensed laser beam. The control unit measures the power of the leakage light of the laser beam by the power measuring unit while irradiating the workpiece with the laser beam. 1. A laser processing apparatus comprising:a chuck table configured to hold a workpiece;a laser beam irradiating unit configured to irradiate the workpiece held on the chuck table with a pulsed laser beam;a processing feed unit configured to processing-feed the chuck table and the laser beam irradiating unit relative to each other;an indexing feed unit configured to indexing-feed the chuck table and the laser beam irradiating unit relative to each other; anda control unit; a laser oscillator,', 'a mirror configured to reflect the laser beam emitted from the laser oscillator and propagate the laser beam to a processing point,', 'a power measuring unit configured to measure power of leakage light of the laser beam transmitted without being reflected by the mirror, and', 'a condensing lens configured to condense the laser beam propagated by the mirror and irradiate the workpiece with the condensed laser beam,, 'the laser beam irradiating unit including'}wherein the control unit allows to measure the power of the leakage light of the laser beam by the power measuring unit while irradiating the workpiece with the laser beam.2. The laser processing apparatus according to claim 1 , wherein a signal generating section configured to generate a signal controlling timing of pulse oscillation of the laser oscillator, and', 'a signal ...

Method for Laser Marking a Metallic Surface

A method is provided for marking a location on a surface of a component. The location defines a normal extending perpendicularly therefrom. The method includes irradiating the location with a first laser beam to create a first mark having a first color. The first laser beam is disposed at a first angle relative to the normal. The method also includes irradiating the location with a second laser beam to create a second mark having a second color different than the first color. The second laser beam is disposed at a second angle relative to the normal. The second angle is different than the first angle. 1. A method of marking a location on a surface of a component , the location defining a normal extending perpendicularly therefrom , the method comprising:irradiating the location with a first laser beam to create a first mark having a first color, the first laser beam disposed at a first angle relative to the normal; andirradiating the location with a second laser beam to create a second mark having a second color different than the first color, the second laser beam disposed at a second angle relative to the normal, the second angle being different than the first angle.2. The method of claim 1 , wherein the first angle is greater than the second angle.3. The method of claim 1 , wherein the first angle is less than the second angle.4. The method of claim 1 , wherein the first laser beam is generated by a laser source claim 1 , the method further comprising moving one of the component or the laser source relative to another of the component or the laser source while irradiating the location with the first laser beam.5. The method of claim 4 , further comprising moving one of the component or the laser source relative to the other of the component or the laser source while irradiating the location with the second laser beam.6. The method of claim 1 , wherein the first color includes a shade of gray or a shade of brown claim 1 , and the second color includes a shade of ...

LASER FORMING NON-SQUARE EDGES IN TRANSPARENT WORKPIECES USING MODIFIED AIRY BEAMS

A method includes directing a laser beam onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is a modified Airy beam having a modified Airy beam focal region having a main lobe and a plurality of side lobes. The main lobe has a lobe aspect ratio of 1.2 or greater. 1. A method comprising directing a laser beam onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device comprises a modified Airy beam having a modified Airy beam focal region comprising a main lobe and a plurality of side lobes , wherein the main lobe comprises a lobe aspect ratio of 1.2 or greater.2. The method of claim 1 , wherein the lobe aspect ratio of the main lobe is 2 or greater.3. The method of claim 1 , wherein at least 65% of a laser energy of the modified Airy beam focal region is disposed in the main lobe.4. The method of claim 1 , wherein the phase-adjustment device comprises a phase plate having a cubic phase modulation.6. The method of claim 1 , wherein the laser beam is a pulsed laser beam comprising pulse bursts and each pulse burst of the pulsed laser beam comprises from 2 sub-pulses to 20 sub-pulses.7. The method of claim 1 , further comprising directing the modified Airy beam onto a transparent workpiece such that the modified Airy beam forms the modified Airy beam focal region in the transparent workpiece claim 1 , the modified Airy beam focal region inducing absorption in the transparent workpiece claim 1 , the induced absorption producing a curved defect in the transparent workpiece.8. The method of claim 7 , further comprising translating at least one of the transparent workpiece and the modified Airy beam relative to each other along a contour line to form a contour comprising a plurality of curved defects.9. The method of claim 7 , wherein the transparent workpiece comprises borosilicate glass claim 7 , soda-lime glass claim 7 , aluminosilicate glass claim 7 , alkali aluminosilicate glass claim 7 , ...

APPLICATIONS, METHODS AND SYSTEMS FOR MATERIALS PROCESSING WITH VISIBLE RAMAN LASER

Laser additive manufacturing systems and apparatus using laser wavelengths below 800 nm. Raman laser modules having laser pump sources in the blue wavelength range. Matching functional laser beam wavelength with maximum absorption wavelengths of starting materials. 1. A laser additive manufacturing (LAM) apparatus comprising:a. a laser for providing a functional laser beam along a beam path, the functional laser beam having a wavelength less than about 750 nm;b. a build table;c. a starting material, and a starting material delivery apparatus, wherein the starting material can be delivered to a target area adjacent the build table;d. a laser beam delivery apparatus, comprising a beam shaping optic to provide a functional laser beam and form a laser beam spot;e. a motor and positioning apparatus, mechanically connected to the build table, the laser beam delivery apparatus, or both; whereby the motor and positioning apparatus are capable of providing relative movement between the laser beam delivery apparatus and the build table; and,f. a control system, the control system comprising a processor, a memory device and a LAM plan, wherein the control system is capable of implementing the LAM plan through the predetermined placement of the functional laser beam and the starting material.2. The apparatus of claim 1 , wherein the laser comprises a pump laser diode having a wavelength of less than 500 nm and a Raman oscillator fiber.3. The apparatus of claim 1 , wherein the laser comprises a pump laser diode and a Raman oscillator that are configured to provide an n-order Raman oscillation claim 1 , where n is an integer.4. The apparatus of claim 3 , wherein n is selected from the group consisting of 2 claim 3 , 3 claim 3 , 4 claim 3 , 5 claim 3 , and 6.5. The apparatus of claim 3 , wherein the n-order oscillation is stokes.6. The apparatus of claim 3 , wherein the n-order oscillation is anti-stokes.7. The apparatus of claim 1 , wherein the build material is selected from the ...

Laser light irradiating device

There is provided a laser light irradiating device that includes a spatial light modulator configured to modulate laser light output from a laser light source according to a phase pattern and emit the modulated laser light, an objective lens configured to converge the laser light emitted from the spatial light modulator onto the object, a focusing lens arranged between the spatial light modulator and the objective lens in an optical path of the laser light and configured to focus the laser light, and a slit member arranged at a focal position on a rear side of the focusing lens in the optical path of the laser light and configured to block a part of the laser light.

Immersion laser fabrication method and system

The present invention discloses an immersion laser fabrication method and system, the method comprises providing a substrate with a first shape; disposing the substrate in a carrier, and a liquid is injected into the carrier; providing a laser source to generate a laser beam; cutting the substrate along a second shape by the laser beam based on an application program in order to separate the substrate into a main substrate and a sub-substrate, the sub-substrate is detached from the substrate and sinks to the bottom of the carrier, or the substrate is drilled by the laser beam based on the application program in order to form a hole and a derivative in the substrate, the derivative is detached from the substrate and sinks to the bottom of the carrier; and obtaining the main substrate, the substrate with the hole, or the main substrate with the hole.

METHOD OF PATTERNING GRAPHENE HOLES AND METHOD OF FABRICATING GRAPHENE TRANSPARENT ELECTRODE BY USING PULSE LASER

A method of patterning holes includes placing a substrate on a stage of a laser system, the substrate having a graphene layer on a surface thereof, generating a pulse laser from the laser system, and forming a plurality of hole patterns spaced apart from each other on the graphene layer by irradiating the pulse laser while the graphene layer is in motion. 1. A method of patterning graphene holes , the method comprising:placing a substrate on a stage of a laser system, the substrate having a graphene layer on a surface thereof;generating a pulse laser from the laser system; andforming a plurality of hole patterns spaced apart from each other on the graphene layer by irradiating the pulse laser while the graphene layer is in motion.2. The method of claim 1 , whereinthe placing places a flexible transparent substrate.3. The method of claim 2 , whereinthe generating generates a pulse laser having a wavelength of about 400 nm to about 1200 nm.4. The method of claim 1 , further comprising:reducing a surface resistance of the graphene layer by performing chemical doping on the graphene layer.5. The method of claim 1 , whereinthe forming forms the plurality of hole patterns on the graphene layer by one of moving the stage and scanning the pulse laser.6. The method of claim 1 , whereinthe generating generates the pulse laser having a pulse width of about 1 ns to about 200 ns.7. The method of claim 1 , whereinthe generating generates the pulse laser having an average output of about 20 mW to about 600 mW.8. The method of claim 1 , whereinthe generating generates the pulse laser having a scanning speed of about 200 mm/s to about 1,000 mm/s.9. The method of claim 1 , whereinthe generating generates the pulse laser having a repetition rate of about 3 kHz to about 100 kHz.10. A method of fabricating a graphene transparent electrode claim 1 , the method comprising:providing a flexible transparent substrate;forming a graphene layer on the flexible transparent substrate;placing the ...

METHODS AND SYSTEMS FOR PROCESSING MATERIALS, INCLUDING SHAPE MEMORY MATERIALS

A method for treating a material comprising: applying energy to a predetermined portion of the material in a controlled manner such that the local chemistry of the predetermined portion is altered to provide a predetermined result. When the material is a shape memory material, the predetermined result may be to provide an additional memory to the predetermined portion or to alter the pseudo-elastic properties of the shape memory material. In other examples, which are not necessarily restricted to shape memory materials, the process may be used to adjust the concentration of components at the surface to allow the formation of an oxide layer at the surface of the material to provide corrosion resistance; to remove contaminants from the material; to adjust surface texture; or to generate at least one additional phase particle in the material to provide a nucleation site for grain growth, which in turn, can strengthen the material. 1. A method for treating a material comprising:applying energy to a predetermined portion of the material in a controlled manner such that the local chemistry of the predetermined portion is altered to provide a predetermined result.2. The method of wherein the applying energy comprises processing the predetermined portion with a laser.3. The method of wherein the processing the predetermined portion with a laser comprises:selecting a power, beam size, and movement speed for the laser to produce the predetermined result;focusing the laser on a subset of the predetermined portion; andadjusting the spatial relationship of the laser and the material such that a beam from the laser contacts all of the predetermined portion.4. The method of wherein the laser is operated in a pulsed fashion to provide shorter bursts of energy to control the application of energy.5. The method of claim 1 , wherein the applied energy is controlled to reduce conduction outside the predetermined portion of the material.6. The method of claim 1 , wherein the material is ...