ЖИДКАЯ КОМПОЗИЦИЯ, СПОСОБ ПОЛУЧЕНИЯ КРЕМНИЕВОЙ ПОДЛОЖКИ И СПОСОБ ПОЛУЧЕНИЯ ПОДЛОЖКИ ДЛЯ ГОЛОВКИ ДЛЯ ВЫБРОСА ЖИДКОСТИ

Изобретение относится к жидкой композиции, способу получения кремниевой подложки и к способу получения подложки для головки для выброса жидкости. Сущность изобретения: жидкая композиция, используемая для проведения анизотропного травления кристалла кремниевой подложки, снабженной маской для травления, формируемой из пленки оксида кремния, включает гидроксид цезия, щелочное органическое соединение и воду, в которой отношение по массе гидроксида цезия к массе жидкой композиции составляет 1% мас. до 40% мас. включительно. Изобретение обеспечивает повышение скорости анизотропного травления кремния при снижении травления пленки оксида кремния, используемой в качестве маски. 3 н. и 4 з.п. ф-лы, 4 ил., 2 табл., 8 пр.

СВЕТОЧУВСТВИТЕЛЬНАЯ НЕГАТИВНАЯ ПОЛИМЕРНАЯ КОМПОЗИЦИЯ

Изобретение относится к светочувствительным негативным полимерным композициям, подходящим для образования тонкой структуры фотолитографическим способом. Предложена светочувствительная негативная полимерная композиция, содержащая (a) содержащее эпоксидные группы соединение, (b) первую ониевую соль, содержащую структуру катионной части, представленную формулой (b1), и структуру анионной части, представленную формулой (b2), и (c) вторую ониевую соль, содержащую структуру катионной части, представленную формулой (c1), и структуру анионной части, представленную формулой (c2). Предложены также полученная из указанной композиции тонкая структура и способ ее получения, а также жидкостная эжекторная головка, в которой использована упомянутая тонкая структура. Технический результат - предложенная композиция обеспечивает меньшую изменчивость и превосходную воспроизводимость трехмерной формы при использовании фотолитографического процесса. 4 н. и 7 з.п. ф-лы, 5 ил., 1 табл., 12 пр.

УСТРОЙСТВО ДЛЯ НАГНЕТАНИЯ ТЕКУЧЕЙ СРЕДЫ И НАНЕСЕНИЯ КАПЕЛЬ

... 1. Устройство для нанесения капель, содержащее стенки камеры, ограничивающие камеру для жидкости, причем одна из указанных стенок камеры является упруго деформируемой в направлении приведения в действие; сопло для эжекции, соединенное с камерой; средство подачи жидкости для создания непрерывного потока жидкости через камеру; акустические границы, служащие для отражения акустических волн в жидкости в камере; и исполнительный механизм, вынесенный из камеры и из средства подачи жидкости, действующий в указанном направлении приведения в действие на упруго деформируемую стенку камеры, чтобы создать акустические волны в жидкости в камере и посредством этого вызвать эжекцию капель через сопло. 2. Устройство по п.1, в котором акустические границы служат для негативного отражения акустических волн в жидкости в канале. 3. Устройство по п.1, в котором упруго деформируемая стенка камеры образует уплотнение, изолирующее исполнительный механизм от текучей среды в камере. 4. Устройство по п.1, в котором ...

ЖИДКАЯ КОМПОЗИЦИЯ, СПОСОБ ПОЛУЧЕНИЯ КРЕМНИЕВОЙ ПОДЛОЖКИ И СПОСОБ ПОЛУЧЕНИЯ ПОДЛОЖКИ ДЛЯ ГОЛОВКИ ДЛЯ ВЫБРОСА ЖИДКОСТИ

... 1. Жидкая композиция, используемая для проведения анизотропного травления кристалла кремниевой подложки, снабженной маской для травления, сформированной из пленки оксида кремния, с пленкой оксида кремния, используемой в качестве маски, причем жидкая композиция содержит: ! гидроксид цезия; ! щелочное органическое соединение; и ! воду. ! 2. Жидкая композиция по п.1, в которой щелочное органическое соединение включает гидроксид тетраметиламмония. ! 3. Жидкая композиция по п.1, в которой отношение по массе гидроксида цезия к массе жидкой композиции составляет от 1 мас.% до 40 мас.% включительно. ! 4. Жидкая композиция по п.2, в которой отношение по массе гидроксида тетраметиламмония к массе жидкой композиции составляет от 5 мас.% до 25 мас.% включительно. ! 5. Способ получения кремниевой подложки, причем способ включает: ! получение кремниевой подложки, на которой пленку оксида кремния, формируемую с отверстием, формируют, по меньшей мере, на одной поверхности подложки; и ! травление подложки ...

СПОСОБ ИЗГОТОВЛЕНИЯ ПОДЛОЖКИ ДЛЯ ГОЛОВКИ ДЛЯ ВЫБРАСЫВАНИЯ ЖИДКОСТИ И СПОСОБ ОБРАБОТКИ ПОДЛОЖКИ

... 1. Способ изготовления подложки головки для выбрасывания жидкости, включающей в себя подложку, которая имеет на одной поверхности элемент для генерирования энергии, который генерирует энергию, используемую для выбрасывания жидкости, и канал подачи жидкости, который проходит через одну поверхность подложки и через другую поверхность подложки, при этом другая поверхность обеспечена на задней стороне указанной одной поверхности, содержащий этапы, на которых: ! обеспечевают углубленный участок на другой поверхности подложки посредством выпускания жидкости в линейной форме к другой поверхности подложки и посредством обработки другой поверхности с использованием лазерного света, который проходит вдоль по и в линейной жидкости; и ! формируют канал подачи жидкости путем травления подложки от другой поверхности, снабженной углубленным участком. ! 2. Способ по п.1, в котором выполняют подложку, снабженную металлическим слоем, имеющим отверстие на его задней поверхности, и заднюю поверхность обрабатывают ...

Farbstrahldrucker

SPRITZKOPF FUER EINEN TINTENSTRAHLDRUCKER MIT MEHREREN DUESEN

Monolithisches Tintenstrahldruckkopf mit Tintenkammer begrenzt durch eine Grenzwand und Verfahren zu ihrer Herstellung

Monolitischer Tintenstrahldruckkopf und Herstellungsverfahren

SELBSTKÜHLENDER THERMOTINTENSTRAHLDRUCKKOPF

Farbstrahldruckkopf mit ionischer Passivierung der elektrischen Schaltungen.

Flüssigkeitsausstosskopf, Herstellungsverfahren des Flüssigkeitsausstosskopfes, Kassette mit diesem Flüssigkeitsausstosskopf und Flüssigkeitsausstossvorrichtung

Tintenstrahlkopf und Verfahren zu dessen Herstellung

Tintenstrahlkopf und Verfahren zu dessen Herstellung

VERFAHREN ZUR HERSTELLUNG EINES TINTENSTRAHLDRUCKKOPFES

FLUIDISCHE DICHTUNG FÜR TINTENSTRAHLDÜSENANORDUNG

Struktur eines Tintenzuführkanals für vollintegrierten Tintenstrahldruckkopf

Struktur eines Tintenzuführkanals für vollintegrierten Tintenstrahldruckkopf

Forming an oxide piezoelectric element(s) and upper electrode layer(s) of an inkjet printhead microactuator using a photoresist film(s) and etching process

Initially, a lower electrode 3 (Fig.4A), an oxide piezoelectric sheet 4 and an electrode layer 5 are laminated over a vibrating plate 2 with an integral chamber plate 1. A photoresist film 6 (Fig.4B) is coated over the upper surface of the electrode layer. Some film is removed (Fig.4C) through baking, exposure to light and rinsing to remove unnecessary portions thereof. The electrode layer is then etched (Fig.4D) at exposed portions, and patterned using the remaining film as a mask, to form upper electrodes of a desired pattern. The remaining film, which is left on the patterned upper electrodes, is completely removed using a rinsing solution (Fig.4E). Another photoresist film (6,Fig.1F) is coated over the entire upper surface of the resulting structure, i.e. the exposed upper surface portions of the oxide piezoelectric sheet 4 and the upper surfaces of the upper electrodes 5. Some film is removed through baking, exposure to light and rinsing to remove unnecessary portions thereof such ...

Method of forming ink jet nozzles

Method of making an inkjet printhead

A method of making an inkjet printhead comprises forming at least one ink ejection element 18, 36 on a surface 14 of a substrate 10, forming a slot 12 in the substrate to provide fluid communication between an ink supply and the ink ejection element, and subjecting the slotted substrate to an isotropic etch.

A method of making an inkjet printhead

A method of making an inkjet printhead

Improved ink jet printheads and methods therefor

Method of forming ink jet nozzles

Nozzle plate, ink jet head and manufacturing method thereof

COLLECTION OF FLOODED NOZZLES

INK RADIATION PRINT HEAD WITH MOVING NOZZLE AND EXTERNAL ACTUATOR

PROTECTION FOR NOZZLE CONSTRUCTIONS IN AN INK RADIATION PRINT HEAD

NOZZLE PROTECTION ADJUSTMENT FOR INK RADIATION PRINT HEAD

INK RADIATION PRINT HEAD AND PROCEDURE FOR ITS PRODUCTION

MICRO-FLUID ARCHITECTURE

INK RADIATION PRINT HEAD MANUFACTURING PROCESS

INK RADIATION HEAD

HEAT INK RADIATION PRINT HEAD WITH HANGING UP CARRIER HEATING DEVICE

PRINT HEAD WITH SEVERAL INK SUPPLY CHANNELS

PRINT HEAD MODULE

PRINT HEAD

INK RADIATION PRINT HEAD MANUFACTURING PROCESS

LIQUID DISTRIBUTOR FOR A LIQUID EJECTOR

INK JET NOZZLE WITH MAGNETIC DRIVE CHAMBER

INK RADIATION RECORDING SYSTEM

RADIATION PRINTER WITH VESICLES FOR PICTURE RECORDING DEVICE

NOZZLE STRUCTURES FOR INK JET PRINTERS

INK RADIATION RECORDING HEAD, SUBSTRATE FOR IT AND INK RADIATION RECORDING DEVICE

MANUFACTURING PROCESS FOR AN INK RADIATION RECORDING HEAD

PROCEDURE FOR THE PRODUCTION OF A MONOLITHIC PRINT HEAD WITH SHORTENED CONICAL NOZZLES

PRINT HEAD WITH SEVERAL INK SUPPLY CHANNELS

INK RADIATION HEAD WITH ANTI-CAVITATION LAYER FOR PREVENTING DEPOSITS AND EROSION

PIEZOELECTRIC STRUCTURE, FLUID JET HEAD AND PROCEDURE FOR THE PRODUCTION

PROCEDURE FOR MANUFACTURING A ZUFÜHRKANALS FOR AN INK RADIATION PRINT HEAD

PROCEDURE FOR MANUFACTURING AN INK RADIATION HEAD

FLUID JET RECORDING HEAD AND ITS MANUFACTURING PROCESS

THERMAL INJECTION AND DOSING HEAD, PROCEDURE FOR ITS PRODUCTION AS WELL AS FUNCTIONALIZATION OR ADDRESSING SYSTEM WITH SUCH A HEAD

A Print Engine for an Inkjet Printer

Printhead

Abstract A printhead (10) comprising a monolithic semiconductor body defining a flow path and an impedance feature.

Thermal ink jet printhead with high nozzle areal density

Method of fabricating suspended beam in a mems process

A method and apparatus

Ink jet printhead nozzle array

Cartridge unit having negatively pressurized ink storage

Micromechanical fluid supply system (fluid08)

PROCESSING OF IMAGES FOR HIGH VOLUME PAGEWIDTH PRINTING

Method for manufacturing liquid discharge head

Method of manufacturing a liquid discharge head, liquid discharge head manufactured by the same method, and method of manufacturing a minute mechanical apparatus

THERMAL INK JET PRINTHEAD

RESIDUE GUARD FOR NOZZLE GROUPS OF AN INK JET PRINTHEAD

A nozzle guard (80) for an ink jet printer printhead with an array (14) of nozzles (10). The nozzle guard (80) has an array of apertures (84) individually corresponding to the nozzle array (14). The ink droplets are ejected through the apertures (84) and onto the media to be printed. A wiper blade (143) sweeps dust and residual ink (144) stuck to the exterior surface (142) of the nozzle guard (80) characterized in that the exterior surface has one or more recesses (146) encompassing a group or pod of the apertures (84) to prevent the wiper blade (143) from engaging the exterior surface (142) immediately adjacent any of the apertures (84) in the pod.

INKJET COLLIMATOR

A printhead for an ink jet printer that has a collimator [84] associated with each of the ink nozzles [22] to retain any misdirected ink droplets [150] ejected from damaged nozzles [22]. The collimators [84] are formed in a nozzle guard [80] covering the exterior or the nozzle array. Each collimator [84] is an aperture in the form of an elongate passage where lengthwise dimension far exceeds the bore of the passage.

THERMAL INK JET PRINTHEAD WITH HEATERS FORMED FROM LOW ATOMIC NUMBER ELEMENTS

There is disclosed an ink jet printhead which comprises a plurality of nozzles (3) and one or more heater elements (10) corresponding to each nozzle. Each heater element is configured to heat a bubble forming liquid in the printhead to a temperature above its boiling point to form a gas bubble (12) therein. The generation of the bubble causes the ejection of a drop (16) of an ejectable liquid (such as ink) through the respective corresponding nozzle, to effect printing. Each heater element is formed of solid material, more than 90% of which, by atomic proportion, is constituted by at least one element, from the periodic table of elements, having an atomic number below 50.

MEMS FLUID SENSOR

... ²²²A fluid sensor for detecting fluid in a chamber, has a MEMS sensing element of ²conductive material with a resistance that is a function of temperature, and ²electrical contacts for connection to an electrical power source for heating ²the sensing element with an electrical signal, so that control circuitry can ²measure the current passing through the sensing element during heating of the ²sensing element; and determine the temperature of the sensing element from the ²known applied voltage, the measured current and the known relationship between ²the current, resistance and temperature. As the temperature of the element ²will be greater if it is in the presence of gas rather than liquid, the sensor ²determines if there is liquid or gas in the chamber. This is particularly ²useful to detect if the chambers of an inkjet printhead are primed with ink.² ...

INK JET NOZZLE STRUCTURE AND METHOD OF MAKING

INK JET NOZZLE STRUCTURE AND METHOD OF MAKING A nozzle array structure for pressurized fluid jets includes a uniform deposited membrane having an array of uniform small orifices therein overlaying a planar substrate having an array of larger aperture openings therethrough with approximately the same central axes as the orifice array. The method of making includes forming a substrate of a planar single crystal material oriented with the (100) planes parallel to the surface. A membrane comprising a uniform coating of an inorganic material is applied to the planar surface of the substrate. The substrate is preferentially etched from the rear surface to form an array of openings therein extending therethrough to the membrane. The membrane is then selectively eroded to form an array of uniform small orifices therein.

FLUID PUMPING AND DROPLET DEPOSITION APPARATUS

In fluid pumping apparatus suitable for use in drop on demand ink jet printing, a resiliently deformable chamber wall is acted upon to create acoustic waves, which in turn cause a fluid flow in a chamber outlet. The resiliently deformable chamber wall preferably comprises both rigid and flexible portions. In an alternative arrangement a channel wall is provided with a region moveable in an actuation direction. An electromagnetic actuator operates under the principle of flux modulation. The invention is preferably of planar construction, manufactured using MEMS techniques.

Method and Apparatus for Elimination of Misdirected Satellite Drops in Thermal Ink Jet Printhead

NOZZLE MEMBER INCLUDING INK FLOW CHANNELS

In one of the preferred embodiments, an inkjet printhead includes a nozzle member formed of a polymer material that has been laser-ablated to form inkjet orifices, ink channels, and vaporization chambers in the unitary nozzle member. The nozzle member is then mounted to a substrate containing heating elements associated with each orifice. In a preferred method, the orifices, ink channels, and vaporization chambers are formed using an Excimer laser.

Micromechanically manufactured nozzle for the production of reproducible droplets.

Structure manufacturing method and liquid discharge head substrate manufacturing method

A method for processing a silicon substrate includes providing a combination of a first silicon substrate, a second silicon substrate, and an intermediate layer including a plurality of recessed portions, which is provided between the first silicon substrate and the second silicon substrate, forming a first through hole that goes through the first silicon substrate by executing etching of the first silicon substrate on a surface of the first silicon substrate opposite to a bonding surface with the intermediate layer by using a first mask, and exposing a portion of the intermediate layer corresponding to the plurality of recessed portions of the intermediate layer, forming a plurality of openings on the intermediate layer by removing a portion constituting a bottom of the plurality of recessed portions, and forming a second through hole that goes through the second silicon substrate by executing second etching of the second silicon substrate by using the intermediate layer on which the plurality ...

Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge apparatus

The present invention provides a nozzle plate, including: a first silicon layer; a glass layer; a second silicon layer provided between the first silicon layer and the glass layer, the second silicon layer being bonded to the glass layer; and a silicon oxide layer provided between the first silicon layer and the second silicon layer. A nozzle hole passing through the first silicon layer and discharging a droplet is formed. A channel passing through the silicon oxide layer and the second silicon layer and communicating with the nozzle hole is formed. A liquid chamber formed in the glass layer and communicating with the channel is formed.

Ink-jet head substrate, ink-jet head and its manufacture, using method of ink-jet head and ink-jet device

Piezoelectric element, liquid nozzle and their making method

Piezoelectric element, inkjet head, inkjet printer and method for producing piezoelectric element

Ink jet head with multiple units and its producing method

Electromechanical transducing device and manufacturing method thereof, and liquid droplet discharging head and liquid droplet discharging apparatus

Ink-jet head substrate, ink-jet head and its manufacture, using method of ink-jet head and ink-jet device

Precision liquid dispenser e.g. for ink-jet printer has ejector plate and moulded polymer one-piece plate and spacer

La présente invention concerne un dispositif dispensateur de fluide comprenant une plaque d'éjection de fluide présentant au moins un orifice de sortie (112) du fluide et des moyens de commande de l'éjection de fluide reliés à la plaque par au moins un espaceur pour ménager un canal d'adduction du fluide vers l'orifice, caractérisé en ce qu'il comprend une pièce moulée (110) formant d'un seul tenant la plaque et l'espaceur. Application à aux imprimantes.

LOW LOSS ELECTRODE CONNECTION FOR INKJET PRINTHEAD

PROCESSING OF IMAGES FOR HIGH VOLUME PAGEWIDTH PRINTING

ink jet head including filtering element formed in a single body with substrate and method of fabricating the same

bubble-ink jet print head and fabrication method therefor

Method of Manufacturing Microstructure, Method of Manufacturing Liquid Discharge Head, and Liquid Discharge Head

INK JET PRINT HEAD AND METHOD OF MANUFACTURING INK JET PRINT HEAD

FLOODED NOZZLE DETECTION

A nozzle guard (80) for an ink jet printer with an array (14) of nozzles (22) and respective ink ejection means for ejecting ink onto media to be printed. The nozzle guard (80) has ink containment formations (146) that stop any misdirected ink droplets or ink leakage from damaged nozzles interfering with the operation of surrounding nozzles or dropping onto the media. To maintain print quality and to stop the supply of ink to damaged nozzles, each containment formation (146) has an ink sensor. The nozzle or nozzles (22) within the containment formation are disabled if a predetermined amount of ink is present. © KIPO & WIPO 2007 ...

PROCESS FOR FABRICATING MICROSTRUCTURE, PROCESS FOR MANUFACTURING LIQUID EJECTION HEAD, AND LIQUID EJECTION HEAD

PURPOSE: To provide a costless, highly reliable and precise liquid ejection head and its manufacturing process. CONSTITUTION: A thermally crosslinked positive photosensitive material layer(first positive photosensitive material layer) and a second positive photosensitive material layer are formed on a substrate and then the second positive photosensitive material layer is patterned followed by patterning of the first positive photosensitive material layer. Subsequently, a negative resin for forming a channel wall is applied thereon and an ejection hole is made in the negative resin layer before the positive photosensitive material layer is removed. The first positive photosensitive material is an ionizing radiation decomposing positive resist of a methacryl-based copolymer composition containing methacrylic acid having methacrylic acid unit of 2-30 wt% and molecular weight of 5,000-50,000, and the second positive photosensitive material is an ionizing radiation decomposing positive resist ...

METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD, LIQUID DISCHARGE HEAD MANUFACTURED BY THE SAME METHOD, AND METHOD OF MANUFACTURING MINUTE MECHANICAL APPARATUS

PURPOSE: A method for manufacturing a liquid discharge head is provided to discharge a predetermined liquid due to a bubble generated by heat energy and to exhibit a reduced manufacturing time and a film thickness of several dozen microns. CONSTITUTION: A liquid discharge head includes a discharge opening(5) for discharging liquid droplets therefrom, a wall member constituting a liquid flow path(7) communicating with the discharge opening(5) to supply liquid to the discharge opening, a substrate provided with a bubble creating element for creating a bubble in the liquid, and a movable member(6) supported by and fixed to the substrate with the discharge opening side thereof as a free end and provided at a position facing the bubble creating element in the liquid flow path(7) with a gap between it and the substrate, wherein the free end of the movable member(6) being displaced away from the substrate by pressure produced by creating the bubble to thereby directs the pressure to the discharge ...

METHOD FOR MANUFACTURING AN INKJET PRINT HEAD, IN WHICH AN INK SUPPLY PORT IS FORMED THROUGH A WET ETCHING PROCESS

PURPOSE: A method for manufacturing an inkjet print head is provided to increase the productivity by adopting wet etching and achieve a structure improved in miniaturization and strength. CONSTITUTION: A method for manufacturing an inkjet print head comprises the steps of preparing a silicon wafer having an azimuth of 110 as a substrate(10); forming a trench(50) on the front surface(10a) of the substrate; and forming an ink supply port(40) from the rear surface of the substrate to the trench through a wet etching process so that the inner wall of the ink supply port is vertical. Etchant used for the wet etching process includes at least one selected from the group consisting of KOH, NaOH and TMAH. © KIPO 2008 ...

METHOD FOR MANUFACTURING A FLUID EJECTION DEVICE SUCH AS AN INK-JET PRINT HEAD BY USING A SACRIFICIAL MATERIAL IN AN ORIFICE

PURPOSE: A method for manufacturing a fluid ejection device is provided to improve resolution by charging filler in a fluid space defined by a barrier layer and removing the filler from the fluid space after etching a throughway. CONSTITUTION: A barrier layer is formed in an upper part(21) of a substrate for defining a fluid space filled with filler, and a throughway(24) is formed from a rear surface(23) of the substrate. The filler is removed from the fluid space via the throughway. The barrier layer is formed by providing a photo resist layer, exposing the photo resist layer to light for defining the fluid space, developing the photo resist layer for generating pores in the fluid space and charging the filler in the pores. © KIPO 2006 ...

LIQUID DISCHARGE DEVICE FOR AN INK-JET RECORDING HEAD AND A MANUFACTURING METHOD THEREOF FOR REDUCING THE SIZE AND COSTS

PURPOSE: A liquid discharge device and a manufacturing method thereof are provided to manufacture an ink supply pipe accurately by decreasing the thickness of a substrate and quickly forming a penetration hole, and to discharge liquid actively by reducing ink supply deviation. CONSTITUTION: A film is formed in a substrate by sputtering, and multiple electric wires are formed to supply power to multiple heating resistors by lithography without bending or deformation(S1). A precursor of the substrate is polished in a rear part to decrease the thickness of the substrate, and the rear part of the substrate is flattened. A small penetration hole for a penetration electrode is formed(S2), and a seed layer is formed in the penetration hole. The inside of the penetration hole is covered by a seed layer for plating, and charged with gold by electroplating to form the penetration electrode(S3). A dry etching mask layer is formed in the surface of the substrate by coating a dry etching mask material ...

INTEGRAL TYPE INK JET PRINTER HEAD AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: An integral type ink jet printer head and a method for manufacturing the same are provided to prevent a misalignment of components by integrally forming the components and an MOS integrated circuit with a substrate. CONSTITUTION: An integral type ink jet printer head includes a plurality of ink exhaust sections(100), which are aligned on an ink feeding manifold(112) in a zigzag manner. A plurality of bonding pads(102), which are electrically connected to the ink exhaust sections(100) through an MOS integrated circuit, are aligned at both side portions of the integral type ink jet printer head. A wire is bonded to the bonding pads(102). The manifold(112) is connected to an ink container. In order to improve the resolution, at least three rows of the ink exhaust sections(100) are provided. A substrate is integrally formed with an ink chamber and an ink channel. A silicon oxide layer is deposited on the substrate. A heater is installed on the silicon oxide layer. The silicon oxide ...

ACTUATOR, LIQUID DROP DISCHARGE HEAD, INK CARTRIDGE, INKJET RECORDING DEVICE, MICRO PUMP, OPTICAL MODULATION DEVICE, AND SUBSTRATE

An actuator includes a vibration plate area displaced by an electrostatic force, and electrodes facing each other via a first space in the vibration plate area. The first space is formed by a sacrificial layer process using a sacrificial layer removing hole. A barrier as a fluid resistance is formed between the first space and a second space situated in the vicinity of the sacrificial layer removing hole. © KIPO & WIPO 2007 ...

HIGH SPEED DIGITAL PRINTER UNIT

An printer unit is provided comprising a body having a media input assembly for supporting media for printing (34), a media output assembly for collecting printed media and a print engine (70) adapted to be mounted to said body and having a printhead for printing an image on a surface of the media. The printhead being a pagewidth printhead that is removable from the print engine. © KIPO & WIPO 2008 ...

METHOD FOR PRODUCING INKJET PRINTER HEAD OF BUBBLE JET TYPE

PURPOSE: A method for manufacturing an inkjet printer head of a bubble jet type is provided to prevent ink from reverse flowing by forming a bubble as a doughnut shape and to reduce generation of satellite droplet by combining the bubble. CONSTITUTION: A method for producing an inkjet printer head of a bubble jet type comprises an ink chamber(200) integrally formed with a base plate(100) by being recessed; a manifold(210) connected to the ink chamber; an ink channel(220); a bubble protrusion(202) preventing the bubble from slanting toward the ink channel by being protruded on a surface of the base plate; a groove(150) forming the ink chamber by being mounted on a middle portion of the ink chamber and the manifold; a manifold forming groove(160); an ink channel forming groove(170) formed on an insulation film(110); a heater(120) mounted on the insulation film; an electrode applying heater driving current by being connected to the heater; a protecting film(230) mounted on the insulation film ...

Method of manufacturing nozzle plate, liquid ejection head and image forming apparatus

The method of manufacturing a nozzle plate which includes a nozzle having a tapered section and a linear section includes the steps of: forming an etching stopper layer for stopping dry etching of a silicon substrate, on a first surface of the silicon substrate; forming a mask layer on a second surface of the silicon substrate reverse to the first surface; performing a first patterning process with respect to the mask layer so that an opening section is formed in the mask layer; carrying out the dry etching of the silicon substrate through the opening section in the mask layer so that the tapered section of the nozzle is formed in the silicon substrate; carrying out dry etching of the etching stopper layer through the opening section in the mask layer so that at least a part of the linear section of the nozzle is formed in the etching stopper layer; and removing the mask layer.

Ink ejection nozzle with thermal actuator coil

A printhead for an inkjet printer is disclosed. The printhead has ink nozzles formed on a print face of the printhead. Each ink nozzle has an ink chamber with an ink ejection port and an ink inlet port. A paddle device is arranged inside each chamber. Each ink nozzle further has a bi-layer thermal actuator coil with a fee end connected to the paddle device. Heating of the thermal actuator coil displaces the paddle device, causing ejection of an ink droplet through the ink ejection port.

Inkjet print head and method for manufacturing the same

An inkjet print head and a method for manufacturing the same are provided. The inkjet print head includes: an upper board having a pressure chamber; and a lower board including an upper silicon layer, an insulating layer, and a lower silicon layer, wherein the lower board includes a projection formed of the upper silicon layer and protruded into the interior of the pressure chamber in order to reduce the space of the pressure chamber, and a lower surface of the upper board and an upper surface of the lower silicon layer are fixed.

Printhead assembly incorporating ink distribution assembly

A printhead assembly includes an ink distribution assembly including an ink distribution molding, the ink distribution molding including a plurality of first ducts; at least one printhead integrated circuit in fluid communication with the ink distribution assembly; and a rotary platen having at least three surface, each surface for providing one of a platen surface, capping portion, and a blotting portion. The ink distribution assembly further includes a plurality of second ducts acutely angled with respect to the plurality of first ducts, a plurality of transfer ports facilitating fluid communication between the plurality of first ducts and the plurality of second ducts, and a plurality of ink inlet ports facilitating fluid communication between an ink cassette and the plurality of first ducts.

Liquid discharge head and manufacturing method of the same

A liquid discharge head comprises: a liquid discharge head substrate including an element row in which a plurality of energy generating elements for generating thermal energy for use in discharging liquid are arranged; and a discharge port member corresponding to each of the plurality of energy generating elements, the discharge port members including a plurality of walls in contact with the liquid discharge head substrate to form a plurality of liquid chambers for storing liquid and a plurality of discharge ports which communicate with each of the plurality of the liquid chambers to discharge liquid with the thermal energy generated by the energy generating element; and a plurality of heat dissipating members corresponding to each of the plurality of the liquid chambers and having a first portion exposed to the liquid chamber and a second portion exposed to the atmosphere.

Method of compensating for dead nozzles in stationary pagewidth printhead

A method of compensating for a dead nozzle in a stationary pagewidth printhead. The method includes the steps of: (i) identifying the dead nozzle; (ii) selecting a functioning nozzle in a same nozzle row as the dead nozzle; and firing ink droplets from the selected functioning nozzle at a primary dot position associated with the dead nozzle.

Printhead integrated circuit with printable zone longer than nozzle row

A printhead integrated circuit (IC) for a stationary pagewidth printhead, includes nozzle rows extending along a longitudinal axis thereof. A length of a printable zone corresponding to the nozzle row is longer than a length of the nozzle row.

Printhead integrated circuit having common conductive track fused to nozzle plate

An inkjet printhead integrated circuit (IC) includes: a substrate having a drive circuitry layer; a plurality of nozzle assemblies disposed on an upper surface of the substrate and arranged in one or more nozzle rows extending longitudinally along the printhead IC; a nozzle plate extending across the printhead IC; and a conductive track fused to the nozzle plate which extends longitudinally along the printhead IC and parallel with the nozzle rows. The conductive track is connected to a common reference plane in the drive circuitry layer via a plurality of conductor posts extending between the drive circuitry layer and the conductive track.

Liquid ejection head and method of manufacturing the same

A liquid ejection head, wherein recessed portions are formed in an ejection face such that, where, in the one direction, a distance D 1 is a distance between (i) a one-side portion of an opening end of one recessed portion and (ii) an other-side portion of an opening end of another recessed portion adjacent to the one recessed portion on one side thereof and where a distance D 2 is a distance between (i) an other-side portion of the opening end of the one recessed portion and (ii) a one-side portion of an opening end of another recessed portion adjacent to the one recessed portion on the other side thereof, a large-and-small relationship of an average value of the distances D 1 , D 2 of a second recessed portion with respect to that of a first recessed portion is the same as a large-and-small relationship of a cross-sectional area of the first recessed portion with respect to that of the second recessed portion.

Protective coating for print head feed slots

A method of method of making a corrosion resistant print head die comprises creating a self-ionized plasma (SIP) of a coating material; establishing a bias on a print head die comprising a plurality of feed slots ( 40 ), each feed slot ( 40 ) comprising side wall surfaces ( 61 ); and causing the coating material plasma to be deposited on the surfaces to form a protective coating, wherein at least a portion of the coating material is deposited on at least a portion of the surfaces by resputtering. In some cases, the feed slots have an aspect ratio greater than 2. In some cases, the feed slot comprises at least one rib ( 41 ), each rib ( 41 ) comprising a top surface ( 68 ), two side surfaces ( 66 ), and an under surface ( 69 ), and the formed protective coating is deposited on the top surface ( 68 ), two side surfaces ( 66 ), and under surface ( 69 ) of each rib ( 41 ).

Micro-fluid ejection device and method for assembling a micro-fluid ejection device by a wafer-to-wafer bonding

A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.

Printheads and method for assembling printheads

Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus

A piezoelectric element comprises a first electrode including platinum, a piezoelectric layer disposed above the first electrode, made of a complex oxide having a perovskite structure containing at least bismuth, and a second electrode disposed above the piezoelectric layer. An oxide containing bismuth and platinum is disposed at the interface of the piezoelectric layer with the first electrode.

Method for fabricating fluid ejection device

Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned to method.

Ejection devices for inkjet printers and method for fabricating ejection devices

Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.

Ink-jet recording head, recording element substrate, method for manufacturing ink-jet recording head, and method for manufacturing recording element substrate

An ink-jet recording head includes a plurality of recording element substrates each having an ejection pressure generating element configured to generate pressure for ejecting ink from an ink discharge port. The plurality of recording element substrates each include a first surface on which the corresponding ejection pressure generating element is disposed and a second surface, serving as an end surface intersecting with the first surface, being at least partially formed by etching.

Handheld imaging device with image processor provided with multiple parallel processing units

A handheld imaging device includes an image sensor for sensing an image; a micro-controller integrating therein a dedicated image processor for processing the sensed image, a bus interface, and an image sensor interface; and a plurality of processing units connected in parallel by a crossbar switch, the plurality of processing units provided within the micro-controller to form a multi-core processing unit for the processor. The image sensor interface provides communication between the micro-controller and the image sensor. The bus interface provides communication between the micro-controller and devices external to the micro-controller other than the image sensor.

Handheld imaging device with multi-core image processor integrating image sensor interface

A handheld imaging device includes an image sensor for sensing an image; a processor for processing the sensed image; a multi-core processing unit provided in the processor, the multi-core processing unit having a plurality of processing units connected in parallel by a crossbar switch; and an image sensor interface for converting signals from the image sensor to a format readable by the multi-core processing unit, the image sensor interface sharing a wafer substrate with the processor. A transfer of data from the image sensor interface to the plurality of processing units is conducted entirely on the shared wafer substrate.

Handheld imaging device with vliw image processor

A handheld imaging device includes an image sensor for sensing an image: a Very Long Instruction Word (VLIW) processor for processing the sensed image; a plurality of processing units provided in the VLIW processor, the plurality of processing units connected in parallel by a crossbar switch to form a multi-core processing unit for the VLIW processor; and an image sensor interface for receiving signals from the image sensor and converting the signals to a format readable by the VLIW processor, the image sensor interface sharing a wafer substrate with the VLIW processor. A transfer of data from the image sensor interface to the VLIW processor is conducted entirely on the shared wafer substrate.

Substrate structure for ejection chip and method for fabricating substrate structure

Disclosed is a substrate structure for an ejection chip that includes a first substrate layer, a second substrate layer disposed beneath the first substrate layer, and an intermediate layer configured between the first substrate layer and the second substrate layer. The substrate structure also includes a plurality of fluid channels configured within the second substrate layer. Further, the substrate structure includes a plurality of fluid ports configured within the first substrate layer. At least one fluid port of the plurality of fluid ports is configured in alignment with a corresponding fluid channel of the plurality of fluid channels. Furthermore, the substrate structure includes a plurality of slots configured within the intermediate layer such that the at least one fluid port is in fluid communication with the to corresponding fluid channel. Further disclosed is a method for fabricating the substrate structure and an ejection chip employing the substrate structure.

Camera system with color display and processor for reed-solomon decoding

A camera system including: a substrate having a coding pattern printed thereon and a handheld digital camera device. The camera device includes: a digital camera unit having a first image sensor for capturing images and a color display for displaying captured images to a user; an integral processor configured for: controlling operation of the first image sensor and color display; decoding an imaged coding pattern printed on a substrate, the printed coding pattern employing Reed-Solomon encoding; and performing an action in the handheld digital camera device based on the decoded coding pattern. The decoding includes the steps of: detecting target structures defining the extent of the data area; determining the data area using the detected target structures; and Reed-Solomon decoding the coding pattern contained in the determined data area.

Method of manufacturing liquid ejection head substrate

A liquid ejection head substrate including a silicon substrate having a liquid supply port as hollow and slots as through holes connecting the hollow and a liquid channel arranged opposite sides of the substrate. The method includes etching the substrate to form the hollow; forming a first resist on the hollow; etching the first resist on the bottom of the hollow under conditions of securing an equal etching rate to both the silicon substrate and the first resist; forming a second resist on the hollow; patterning the second resist into an etching mask; and etching the substrate using the etching mask to form the through holes.

Electromechanical transducer

An electromechanical transducer ( 1 ) has a pressurizing chamber ( 21 ) and a side-chamber ( 23 ) formed in a plate ( 11 ). On a driven film ( 13 ) forming the upper wall surface ( 21 a ) of the pressurizing chamber ( 21 ) and the side-chamber ( 23 ), a lower electrode ( 33 ), a driving member, and an upper electrode ( 35 ) are formed in this order. The driving member is composed of an operation section ( 31 p ) located over the pressurizing chamber ( 21 ), and an extended section ( 31 a ) extending from the operation section ( 31 p ) to over the side-chamber ( 23 ). The side-chamber ( 23 ) has a smaller width than the pressurizing chamber ( 21 ) in a second direction perpendicular to a first direction in which the side-chamber ( 23 ) is located beside the pressurizing chamber ( 21 ). The extended section ( 31 a ) of the driving member has a smaller width than the side-chamber ( 23 ) in the second direction.

Planar heater structures for ejection devices

Disclosed is a method for fabricating a planar heater structure for an ejection device. The method includes providing a substrate wafer having a plurality of plugs configured therewithin. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.

Methods for fabricating planar heater structures for ejection devices

Methods and apparatus teach a substrate wafer having a plurality of plugs configured there within. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.

Method of fabricating an integrated orifice plate and cap structure

In an embodiment, a method of fabricating an integrated orifice plate and cap structure includes forming an orifice bore on the front side of a product wafer, coating side walls of the orifice bore with a protective material, grinding the product wafer from its back side to a final thickness, forming a first hardmask for subsequent cavity formation, forming a second hardmask over the first hardmask for subsequent descender formation, forming a softmask over the second hardmask for subsequent convergent bore formation, etching a latent convergent bore using the softmask as an etch delineation feature, etching a descender using the second hardmask as an etch delineation feature, and anisotropic etching of convergent bore walls and cavities using the first hardmask as an etch delineation feature.

Liquid ejecting head, liquid ejecting apparatus, and piezoelectric element

A liquid ejecting head contains a piezoelectric element having a piezoelectric layer and an electrode disposed on the piezoelectric layer, in which the piezoelectric layer contains a complex oxide containing bismuth, iron, barium, and titanium and having a perovskite structure, has a yield stress of 5.66 GPa or more, and has a Young's modulus of 114 GPa or more.

Fluid nozzle array

A method for fabricating a fluid nozzle array includes forming a circuitry layer onto a substrate, the substrate comprising a stopping layer disposed between a membrane layer and a handle layer, forming a fluid feedhole extending from a surface of the membrane layer to the stopping layer, and forming a fluid supply trench extending from a surface of the handle layer to the stopping layer. A fluid nozzle array includes a substrate including a membrane layer, a stopping layer adjacent to the membrane layer, a handle layer adjacent to the stopping layer, and a set of fluid chambers disposed on a surface of the membrane layer above and along a width of a fluid supply trench extending from a surface of the handle layer to the stopping layer.

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING SAME

A method of manufacturing a liquid ejection head includes the steps of () forming a recess in a second surface of a substrate to form a common supply port, () forming an etching mask, which specifies opening positions of independent supply ports, on a bottom surface of the common supply port, and () performing ion etching using plasma with the etching mask employed as a mask, thereby forming the independent supply ports. The etching mask has an opening pattern formed therein such that respective distances from an ejection energy generation element to openings of two independent supply ports adjacent to the ejection energy generation element on the first surface side of the substrate are equal to each other. 1. A method of manufacturing a liquid ejection head comprising a substrate including , in a first surface thereof , a plurality of ejection energy generation elements configured to generate energy for ejecting a liquid , and an orifice plate disposed on a first surface side of the substrate to form ejection orifice through which the liquid is ejected , and to define liquid flow passages communicating with the ejection orifices ,the substrate including a recess-shaped common supply port formed in a second surface thereof on an opposite side to the first surface, and a plurality of independent supply ports penetrating from a bottom surface of the common supply port to the first surface and communicating with the liquid flow passages,the ejection orifices being disposed above the ejection energy generation elements,two of the independent supply ports being disposed adjacent to each of the ejection energy generation elements for supply of the liquid to the relevant ejection energy generation element with the relevant ejection energy generation element disposed between the two independent supply ports,the method comprising the steps of:(1) forming a recess in the second surface of the substrate to form the common supply port,(2) forming an etching mask, which ...

METHOD OF FORMING INKJET NOZZLE CHAMBER

A method of forming an inkjet nozzle chamber includes the steps of: (a) depositing a layer of chamber material onto a substrate, the layer of chamber material defining a depth of the nozzle chamber; (b) removing a predetermined region of the layer of chamber material to define sidewalls of the nozzle chamber and an internal volume of the nozzle chamber; (c) depositing a sacrificial material to fill the internal volume contained within the sidewalls; (d) depositing a roof layer onto the sacrificial material and the sidewalls; (e) etching the roof layer to define a nozzle opening therein; and (f) removing the sacrificial material contained in the internal volume so as to form the nozzle chamber. 114-. (canceled)15. A method of forming an inkjet nozzle chamber , the method comprising the steps of:(a) depositing a layer of chamber material onto a substrate, the layer of chamber material defining a depth of the nozzle chamber;(b) removing a predetermined region from the layer of chamber material to define sidewalls of the nozzle chamber and an internal volume of the nozzle chamber;(c) depositing a sacrificial material to fill the internal volume contained within the sidewalls;(d) depositing a roof layer onto the sacrificial material and the sidewalls;(e) etching the roof layer to define a nozzle opening therein; and(f) removing the sacrificial material contained in the internal volume so as to form the nozzle chamber.16. The method of claim 15 , wherein the substrate is comprised of a silicon substrate having a layer of drive circuitry.17. The method of claim 15 , wherein the chamber material is comprised of silicon dioxide.18. The method of claim 17 , wherein the predetermined region of the layer of chamber material is removing by etching.19. The method of claim 15 , wherein the layer of chamber material has a depth of 4 to 20 microns.20. The method of claim 15 , wherein the layer of chamber material has a depth of 6 to 12 microns.21. The method of claim 15 , wherein ...

Method of manufacturing liquid ejection head and method of processing substrate

A liquid ejection head includes a substrate having an ejection energy generating element formed at a first surface side thereof, a common liquid chamber formed at a second surface of the substrate, and a liquid supply port extending from the bottom of the common liquid chamber to the first surface. The liquid ejection head is manufactured by preparing a substrate having the common liquid chamber formed at the second surface side, then arranging a material to be filled in the common liquid chamber, subsequently forming an aperture in the filled material as corresponding to the liquid supply port to be formed, and thereafter forming the liquid supply port by reactive ion etching, using at least the filled material as a mask.

Process for manufacturing a nozzle plate and fluid-ejection device provided with the nozzle plate

A nozzle plate for a fluid-ejection device, comprising: a first substrate made of semiconductor material, having a first side and a second side; a structural layer extending on the first side of the first substrate, the structural layer having a first side and a second side, the second side of the structural layer facing the first side of the first substrate; at least one first through hole, having an inner surface, extending through the structural layer, the first through hole having an inlet section corresponding to the first side of the structural layer and an outlet section corresponding to the second side of the structural layer; a narrowing element adjacent to the surface of the first through hole, and including a tapered portion such that the inlet section of the first through hole has an area larger than a respective area of the outlet section of the first through hole.

Piezoelectric thin film element and method of manufacturing the same, droplet discharge head and inkjet recording device using the piezoelectric thin film element

A piezoelectric thin film element includes a vibration plate, a lower electrode provided on the vibration plate and made of a conductive oxide, a piezoelectric thin film provided on the lower electrode and made of a polycrystalline substance, and an upper electrode provided on the piezoelectric thin film, wherein the lower electrode includes a titanium oxide film formed on the vibration plate, a platinum film formed on the titanium oxide film, and a conductive oxide film formed on the platinum film and, the platinum film and the conductive oxide film being a solid film with no holes.

METHOD OF FORMING SUBSTRATE FOR FLUID EJECTION DEVICE

A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side of the substrate toward a first side of the substrate, further forming the opening in the substrate to the first side of the substrate, anisotropically wet etching the substrate, including increasing the opening at the second side of the substrate and forming the opening with converging sidewalls from the second side to the first side, and after anisotropically wet etching the substrate, isotropically etching the substrate. 1. A method of forming a substrate for a fluid ejection device , the substrate having a first side and a second side opposite the first side , the method comprising:forming an opening in the substrate from the second side toward the first side;further forming the opening in the substrate to the first side;anisotropically wet etching the substrate, including increasing the opening at the second side of the substrate and forming the opening with converging sidewalls from the second side to the first side; andafter anisotropically wet etching the substrate, isotropically etching the substrate.2. The method of claim 1 , wherein forming an opening in the substrate from the second side toward the first side comprises laser machining the substrate from the second side toward the first side.3. The method of claim 1 , wherein further forming the opening in the substrate to the first side comprises dry etching the substrate through the opening.4. The method of claim 1 , wherein anisotropically wet etching the substrate comprises anisotropically wet etching the substrate with at least one of tetra-methyl-ammonium hydroxide and potassium hydroxide.5. The method of claim 1 , wherein isotropically etching the substrate comprises isotropically etching the substrate with xenon difluoride.6. A method of forming an opening through a substrate having a first side and a second side opposite the first side claim 1 , the method comprising:forming ...

LIQUID EJECTING HEAD AND METHOD FOR PRODUCING THE SAME

A method for producing a liquid ejecting head of the present invention includes the steps of: forming an etching stop layer on a portion corresponding to a region in which an independent supply port is formed, on a first face of a substrate; conducting dry etching treatment for the substrate from a second face side until the etched portion reaches the etching stop layer; and removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, wherein the isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer. 1. A method for producing a liquid ejecting head comprising a substrate which has an ejection energy generating element that generates energy for ejecting a liquid , on its first face , and an independent supply port that reaches the first face from a side of a second face which is opposite to the first face , comprising:(1) a step of forming an etching stop layer on a portion corresponding to a region in which the independent supply port is formed, on the first face;(2) a step of conducting dry etching treatment for the substrate from the second face side until the etched portion reaches the etching stop layer; and(3) a step of removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, whereinthe isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer.2. The method for producing a liquid ejecting head according to claim 1 , wherein the isotropic etching is wet etching treatment.3. The method for producing a liquid ejecting head according to claim 1 , wherein the dimension of an aperture on the first face side of the independent ...

Liquid droplet discharge head, method of manufacturing liquid droplet discharge head, and liquid droplet discharge device

In a liquid droplet discharge head, a first groove-shaped cavity is formed on a cavity plate, a second groove-shaped cavity is formed on a nozzle plate in addition to nozzle holes, when bonding the cavity plate and the nozzle plate to each other, the first groove-shaped cavity and the second groove-shaped cavity overlap to form a pressure chamber.

EJECTION DEVICES FOR INKJET PRINTERS AND METHOD FOR FABRICATING EJECTION DEVICES

Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device. 112.-. (canceled)13. A method for fabricating an ejection device for an inkjet printer , the method comprising:depositing a first layer of an organic material on an ejection chip, the ejection chip comprising a substrate and at least one fluid ejecting element carried by the substrate;patterning the first layer of the organic material to configure a flow feature layer over the ejection chip;depositing a first layer of an inorganic material over the first layer of the organic material;patterning the first layer of the inorganic material to configure a plurality of openings therewithin;depositing a second layer of an organic material over the first layer of the inorganic material to configure a nozzle plate of the ejection device;processing the second layer of the organic material by one of patterning and planarization;depositing a second layer of one of an inorganic material and a hydrophobic material over the second layer of the organic material; patterning the second layer of the one of the inorganic material and the hydrophobic material to configure a plurality of openings corresponding ...

Method of processing inkjet head substrate

A method of processing an inkjet head substrate includes, in series, a step of forming a barrier layer on a substrate and forming a seed layer on the barrier layer, a step of forming a resist film on the seed layer and patterning the resist film such that the resist film has an opening corresponding to a wiring section configured to drive ink discharge energy-generating elements, a step of forming the wiring section in the opening of the patterned resist film, a step of removing the resist film, a step of laser-processing a surface of the substrate, a step of forming an ink supply port by anisotropically etching the substrate, and a step of removing the barrier layer and the seed layer.

Shear mode physical deformation of piezoelectric mechanism

A piezoelectric mechanism includes first and second electrodes and a thin film sheet of piezoelectric material. The second electrode is interdigitated in relation to the first electrode. The first and the second electrodes are embedded within the thin film sheet. The thin film sheet is polarized in a direction at least substantially perpendicular to a surface of the thin film sheet. The thin film sheet is to physically deform in a shear mode due to polarization of the thin film sheet at least substantially perpendicular to the surface of the thin film sheet, responsive to an electric field induced within the thin film sheet at least substantially parallel to the sheet via application of a voltage across the first and the second electrodes.

DRY ETCHING METHOD

According to one aspect of the present invention, there is provided a dry etching method which carries out patterning of a resin film provided on a substrate, by reactive ion etching using a resist mask, wherein a gas mixture containing CFgas with a percentage flow rate of 1.0 to 5.0% is used as an etching gas; and pressure in an etching reaction chamber in an apparatus used for the reactive ion etching is 1.0 Pa or more. 1. A dry etching method which carries out patterning of a resin film provided on a substrate , by reactive ion etching using a resist mask , wherein a gas mixture containing CFgas with a percentage flow rate of 1.0 to 5.0% is used as an etching gas; and pressure in an etching reaction chamber in an apparatus used for the reactive ion etching is 1.0 Pa or more.2. The dry etching method according to claim 1 , wherein the reactive ion etching includes a first stage in which 5 to 95% of a thickness of the resin film is removed beginning with a start of etching claim 1 , and a second stage in which etching is performed after the first stage; and high-frequency antenna power in the second stage is higher than high-frequency antenna power in the first stage.3. The dry etching method according to claim 2 , wherein the high-frequency antenna power in the second stage is higher than the high-frequency antenna power in the first stage by 1000 w or more.4. The dry etching method according to claim 3 , wherein the high-frequency antenna power in the first stage is 1000 to 3000 w and the high-frequency antenna power in the second stage is 2000 to 4000 w.5. The dry etching method according to claim 2 , wherein high-frequency bias power in the first stage is 450 to 1050 w and high-frequency bias power in the second stage is 30 to 70 w.6. The dry etching method according to claim 1 , wherein the resin film is made of any one of a polyamide resin claim 1 , an epoxy resin or a light-curing acrylate resin.7. The dry etching method according to claim 1 , wherein the ...

PROCESSES FOR PRODUCING SUBSTRATE WITH PIERCING APERTURE, SUBSTRATE FOR LIQUID EJECTION HEAD AND LIQUID EJECTION HEAD

The invention provides a process for producing a substrate with a piercing aperture, the piercing aperture being formed by conducting dry etching from the side of a second surface opposite to a first surface of a substrate to the first surface, the process comprising, in the following order, the steps of (a) forming a groove around a region where the piercing aperture is formed in the first surface of the substrate, (b) forming an etch-stop layer in the region where the piercing aperture is formed in the first surface of the substrate and in the interior of the groove, and (c) forming the piercing aperture by conducting the dry etching from the side of the second surface. 1. A process for producing a substrate with a piercing aperture , the piercing aperture being formed by conducting dry etching from the side of a second surface opposite to a first surface of a substrate to the first surface , the process comprising , in the following order , the steps of:(a) forming a groove around a region where the piercing aperture is formed in the first surface of the substrate;(b) forming an etch-stop layer in the region where the piercing aperture is formed in the first surface of the substrate and in the interior of the groove; and(c) forming the piercing aperture by conducting the dry etching from the side of the second surface.2. The process according to claim 1 , wherein in the step (c) claim 1 , over etching is conducted after the dry etching reaches the etch-stop layer claim 1 , thereby spreading an opening portion of the piercing aperture on the side of the first surface up to the groove.3. The process according to claim 1 , which further comprises a step of removing at least a portion of the etch-stop layer claim 1 , the portion corresponding to the first surface side opening portion of the piercing aperture claim 1 , after the step (c).4. The process according to claim 1 , wherein a Bosch process is applied for the dry etching.5. A process for producing a substrate ...

Dry etching method and device manufacturing method

A dry etching method of etching a conductive material layered on a dielectric material, comprising: using a mixed gas including a halogen gas and an oxygen gas as an etching gas, a mixing ratio of the oxygen gas in the mixed gas being equal to or greater than 30% and equal to or less than 60%; setting a gas pressure in a chamber at a time of supplying the mixed gas into the chamber and generating plasma, within a range equal to or greater than 1 Pa and less than 5 Pa; and applying a bias voltage of frequency equal to or greater than 800 kHz and less than 4 MHz as a bias voltage to an etched material in which the conductive material is layered on the dielectric material, and performing etching, wherein the dielectric material is a ferroelectric material and the conductive material is a noble metal material.

Liquid discharge head, recording apparatus, and method of manufacturing liquid discharge head

A liquid discharge head includes a substrate that is provided with. a supply passage having an opening; an energy generating element that is disposed on a surface of the substrate; an electric wiring layer; an insulation layer; and a discharge port member that forms a discharge port. The insulation layer has an end portion adjacent to the opening of the supply passage and set back from an edge of the opening of the supply passage toward a side where the energy generating element is disposed. The electric wiring layer includes a plurality of electric wiring layers layered on each other.

INK JET HEAD AND MANUFACTURING METHOD THEREOF

An ink jet head includes a base member having a plurality of openings, a diaphragm formed on a surface of the base member covering each of the openings, a pressure chamber being formed at each of the openings, and a plurality of piezoelectric elements formed at locations on the diaphragm corresponding to the pressure chambers, each of the piezoelectric elements being configured to eject liquid from a corresponding pressure chamber by causing deformation of the diaphragm. The diaphragm includes a plurality of stress release portions that reduces compressive residual stress in the diaphragm, each of the stress release portions corresponding to one of the piezoelectric elements. 1. An ink jet head , comprising:a base member having a plurality of openings;a diaphragm formed on a surface of the base member covering each of the openings, a pressure chamber being formed at each of the openings; anda plurality of piezoelectric elements formed at locations on the diaphragm corresponding to the pressure chambers, each of the piezoelectric elements being configured to eject liquid from a corresponding pressure chamber by causing deformation of the diaphragm, whereinthe diaphragm includes a plurality of stress release portions that reduces compressive residual stress in the diaphragm, each of the stress release portions corresponding to one of the piezoelectric elements.2. The ink jet head according to claim 1 , further comprising:a wiring extending along a surface of the base member and connected to the piezoelectric elements, whereinthe stress release portions are not formed on a region of the diaphragm corresponding to a region of the base member along which the wiring extends.3. The ink jet head according to claim 1 , whereineach of the stress release portions is formed along a periphery of the corresponding pressure chamber.4. The ink jet head according to claim 1 , whereineach of the stress release portions includes a slit that penetrates the diaphragm.5. The ink jet head ...

METHOD FOR MANUFACTURING LIQUID EJECTION HEAD

There is provided a method for forming a smooth resin layer on a substrate having a concavo-convex portion in manufacturing a liquid ejection head by a casting method. To achieve this, after forming an opening pattern on the resin layer formed on the substrate, a mold is brought into contact with the resin layer at a predetermined pressure so as to smooth a surface of the resin layer. 1. A method for manufacturing a liquid ejection head including a substrate having formed thereon an energy generating element , wiring for supplying power to the energy generating element , and a supply port for supplying liquid , the substrate having laminated thereon a flow path forming member on which a flow path for guiding the liquid supplied from the supply port to the energy generating element is formed , the method comprising:a step for forming a resin layer by applying a resin for forming an area to be the flow path on the substrate;an opening pattern forming step for forming an opening pattern to be a concave portion on the resin layer; anda smoothing step for smoothing a surface of the resin layer by bringing a smoothing member into contact with the resin layer on which the opening pattern is formed at a predetermined pressure.2. The method for manufacturing the liquid ejection head according to claim 1 , wherein in the opening pattern forming step claim 1 , the opening pattern is formed on the resin layer so that a volume of a space formed by a concavo-convex portion on the resin layer becomes substantially equal in a plurality of unit areas.3. The method for manufacturing the liquid ejection head according to claim 2 , wherein after the smoothing step claim 2 , a variation in the volume of the space formed by the concavo-convex portion of the resin layer among the unit areas is 1% or less.4. The method for manufacturing the liquid ejection head according to claim 1 , wherein the resin is a photosensitive resin claim 1 , andin the opening pattern forming step, the opening ...

INK JET RECORDING HEAD SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND INK JET RECORDING HEAD

An ink jet recording head substrate is provided which includes a base substrate, a heat accumulation layer overlying the base substrate, a heating resistor layer including an electrothermal conversion portion and overlying the heat accumulation layer, a wiring layer electrically connected to the heating resistor layer, and an insulating protective layer covering the heating resistor layer and the wiring layer. The heat accumulation layer includes a porous cyclic siloxane film. 1. An ink jet recording head substrate comprising:a base substrate;a heat accumulation layer overlying the base substrate, the heat accumulation layer including a porous cyclic siloxane film formed by a gas-phase process;a heating resistor layer overlying the heat accumulation layer, the heating resistor layer including an electrothermal conversion portion;a wiring layer electrically connected to the heating resistor layer; andan insulating protective layer covering the heating resistor layer and the wiring layer.2. The ink jet recording head substrate according to claim 1 , wherein the cyclic siloxane film is made of a material having a cyclic skeleton expressed by (—Si—O—)n claim 1 , wherein the number n of (—Si—O—) units is in the range of 3 to 20.3. The ink jet recording head substrate according to claim 2 , wherein the material of the cyclic siloxane film contains Si claim 2 , O claim 2 , C and H.4. The ink jet recording head substrate according to claim 2 , wherein the material of the cyclic siloxane film contains Si claim 2 , O claim 2 , F and H.5. The ink jet recording head substrate according to claim 2 , wherein the material of the cyclic siloxane film contains Si claim 2 , O claim 2 , C claim 2 , H and F.6. The ink jet recording head substrate according to claim 2 , wherein the material of the cyclic siloxane film contains Si claim 2 , O claim 2 , C claim 2 , H claim 2 , N and F.7. The ink jet recording head substrate according to claim 3 , wherein the cyclic siloxane film has a ...

METHOD FOR MANUFACTURING LIQUID EJECTION HEAD AND LIQUID EJECTION HEAD

A method for manufacturing a liquid ejection head includes selectively exposing a first photosensitive resin layer to light, thereby curing the portion of the first photosensitive resin layer defining a flow channel member; forming a second photosensitive resin layer on the first photosensitive resin layer; selectively exposing the second photosensitive resin layer to light, thereby curing the portion of the second photosensitive resin layer defining an ejection opening member; and removing the unexposed portions of the first and the second photosensitive resin layer at one time with a developer. Before removal with the developer, the water absorption W of the intermediate layer, the water absorption W1 of the exposed portion of the first photosensitive resin layer, and the water absorption W2 of the exposed portion of the second photosensitive resin layer satisfy the relationship W≥W1>W2. 1. A liquid ejection head comprising:a substrate;a flow channel member overlying the substrate and defining a flow channel through which a liquid flows;an ejection opening member overlying the flow channel member and defining an ejection opening through which the liquid is ejected; andan intermediate layer between the substrate and the flow channel member,wherein water absorption W of the intermediate layer, water absorption W1 of the flow channel member, and water absorption W2 of the ejection opening member satisfy the relationship: W>W1>W2.2. The liquid ejection head according to claim 1 , wherein the water absorptions W claim 1 , W1 claim 1 , and W2 satisfy the relationship W>W1>W2.3. The liquid ejection head according to claim 1 , wherein the water absorption W1 of the flow channel member is 2 to 5 times as high as the water absorption W2 of the ejection opening member.4. The liquid ejection head according to claim 1 , wherein the water absorption W of the intermediate layer is 2 times or less as high as the water absorption W1 of the flow channel member. The present ...

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD

Provided are a liquid ejection head capable of preventing deformation and breakage of a filter and a method of manufacturing the liquid ejection head. The liquid ejection head comprises: a substrate comprising a supply port through which to supply a liquid and an element configured to produce energy for ejecting the liquid; a resin layer comprising an ejection port through which the liquid is ejectable with the energy produced by the element, and a flow channel connecting the supply port and the ejection port; a filter disposed between the supply port and the flow channel; and a support portion supporting a surface of the filter on the supply port side and a surface of the filter on the flow channel side. 1. A liquid ejection head comprising:a substrate comprising a supply port through which to supply a liquid and an element configured to produce energy for ejecting the liquid;a resin layer comprising an ejection port through which the liquid is ejectable with the energy produced by the element, and a flow channel connecting the supply port and the ejection port;a filter disposed between the supply port and the flow channel; anda support portion supporting a surface of the filter on the supply port side and a surface of the filter on the flow channel side.2. The liquid ejection head according to claim 1 , wherein the support portion is formed integrally with the resin layer.3. The liquid ejection head according to claim 2 , wherein the support portion extends through the flow channel from the resin layer claim 2 , penetrates through the filter claim 2 , and reaches the supply port.4. The liquid ejection head according to claim 3 , wherein a penetrating portion of the support portion penetrating through the filter is smaller in diameter than an extending portion of the support portion positioned in the flow channel and a tip portion of the support portion positioned in the supply port.5. The liquid ejection head according to claim 3 , whereinthe support portion is ...

RECORDING ELEMENT BOARD, LIQUID EJECTION APPARATUS AND METHOD OF MANUFACTURING RECORDING ELEMENT BOARD

A recording element board has a plurality of heat-generating resistor elements arranged in a row and each of the plurality of heat-generating resistor elements comprises a heat-generating resistor layer and first and second pairs of electrodes connected to the heat-generating resistor layer. The first and second pairs of electrodes contact the heat-generating resistor layer at the opposite surfaces thereof to each other. The first pair of electrodes is formed as vias, while each surface of the second pair of electrodes is inclined so as to gradually reduce the thickness thereof toward the end thereof. 1. A recording element board having a plurality of heat-generating resistor elements arranged in a row , each of the plurality of heat-generating resistor elements comprising:a heat-generating resistor layer to be electrically powered for generating heat to energize liquid contained in a pressure chamber to be arranged beside the heat-generating resistor layer in order to cause the pressure chamber to eject the liquid therefrom;at least a pair of first electrodes formed as vias connected to a surface of the heat-generating resistor layer at a side opposite to the pressure chamber, the pair of first electrodes feeding electrical power to a first part of the heat-generating resistor layer to form a first heat-generating region between the pair of first electrodes; andat least a pair of second electrodes connected to the surface of the heat-generating resistor layer at a side facing the pressure chamber, the pair of second electrodes feeding electrical power to a second part of the heat-generating resistor layer to form a second heat-generating region between the pair of second electrodes, wherein surfaces of the pair of second electrodes located at the side facing the pressure chamber being inclined so as to gradually reduce the thickness thereof toward respective ends thereof.2. The recording element board according to claim 1 , whereinthe pair of first electrodes is ...

Liquid droplet discharge head, image forming apparatus including same, and method of inspecting liquid droplet discharge head

A liquid droplet discharge head includes a nozzle substrate; nozzles, disposed on the nozzle substrate, to discharge a liquid; a pressurized liquid chamber that communicates with the nozzles; a diaphragm forming one wall of the pressurized liquid chamber; an electromechanical transducer element for discharging, disposed on an element mount surface of the diaphragm opposite a side facing the pressurized liquid chamber; and a retainer substrate laminated to the element mount surface of the diaphragm with an adhesive. The subject head is configured to discharge a liquid inside the pressurized liquid chamber from the nozzles while the diaphragm is displaced by a drive voltage applied to the electromechanical transducer element for discharging, and the liquid droplet discharge head further comprising an electromechanical transducer element for inspection that does not perform discharging, disposed on the element mount surface of the diaphragm, to which a voltage is applied so that the diaphragm displaces.

PRINTBARS AND METHODS OF FORMING PRINTBARS

A method of forming a printbar module may include providing a printed circuit board (PCB) having a recess extending partially through the PCB and a dam surrounding the recess. An adhesive material may be applied to the recess and a printhead die sliver may be positioned in the recess. The printhead die sliver may be bonded with the PCB and the printhead die sliver and the PCB may be encapsulated with a molding compound. In response to encapsulating, a slot, extending through the PCB and the adhesive material may be formed, wherein the slot is in fluidic communication with fluid feed holes of the printhead die sliver to provide direct fluidic communication without fan-out. 1. A method of forming a printbar module , comprising:providing a solid printed circuit board (PCB) that does not include an opening extending through the PCB, wherein the PCB includes a recess extending partially into the PCB but not through the PCB and a dam surrounding the recess;applying an adhesive material to the recess;positioning a printhead die sliver in the recess;bonding the printhead die sliver with the PCB with an adhesive material disposed on a bottom surface of the recess;encapsulating the printhead die sliver and the PCB with a molding; andin response to encapsulating, forming a slot extending through the PCB and a portion of the adhesive material to the printhead die sliver, wherein the slot is in fluidic communication with a fluid feed hole of the printhead die sliver to provide direct fluidic communication without fan-out.2. The method of claim 1 , wherein forming includes forming the slot using a plunge-cut saw.3. The method of claim 1 , wherein bonding includes wire bonds coupling conductive elements of the PCB to conductive elements of the printhead die sliver.4. The method of claim 1 , wherein applying the adhesive material to the PCB includes applying adhesive material only to the recess of the PCB.5. The method of claim 1 , wherein forming includes forming the slot such ...

METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD, LIQUID DISCHARGE HEAD, AND METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD SUBSTRATE

There is provided a method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member, the liquid discharge head substrate having a base, a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid, and a supply port for supplying the liquid to the pressure generation portion, and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion. The method includes removing a sacrificial layer by etching the base from a back surface of the base, in a state in which an end covering portion of a cover layer for covering the sacrificial layer is covered with the resin layer. The method suppresses formation of a crack in the end covering portion that covers the end portion of the sacrificial layer. 1. A method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member , the liquid discharge head substrate having a base , a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid , and a supply port for supplying the liquid to the pressure generation portion , and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion , the method comprising:providing a sacrificial layer on the front surface of the base;providing a cover layer at the front surface of the base, the cover layer covering the sacrificial layer and including an end covering portion for covering an end of the sacrificial layer;providing a resin layer for covering the end covering portion;providing a flow path mold member on a front surface of the cover layer and a front surface of the resin layer;providing the flow path forming member on a front surface of the flow path mold member; andremoving the sacrificial layer by etching the ...

MANUFACTURING A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE

Aspects are directed to techniques for fabricating a microfluidic device on a substrate. In a particular example, a method of manufacturing a microfluidic device includes growing a thermal oxide layer on a substrate and depositing a dielectric layer, including doped a dielectric film, over the thermal oxide layer. Next, an aperture defined by a dielectric wall which forms part of the dielectric layer is formed in the dielectric layer by selectively removing the dielectric film. Finally, the aperture is sealed with a sealing film to prevent the dielectric film from being exposed to a fluid contained in the aperture. The sealing film may be of an electrically insulating material resistive to corrosive attributes of the fluid contained in the aperture. 1. A method comprising:growing a thermal oxide layer on a substrate;depositing a dielectric layer over the thermal oxide layer, the dielectric layer including a doped dielectric film;forming an aperture in the dielectric layer, wherein the aperture is defined by a dielectric wall which forms part of the dielectric layer, by selectively removing the dielectric film; andsealing the aperture in the dielectric layer with a sealing film that prevents the dielectric film from being exposed to a fluid contained in the aperture.2. The method of claim 1 , wherein sealing the aperture in the dielectric layer includes depositing an un-doped dielectric film over the dielectric wall.3. The method of claim 1 , wherein sealing the aperture in the dielectric layer includes depositing an un-doped dielectric film that is electrically insulating and resistive to corrosive attributes of the fluid contained in the aperture.4. The method of claim 1 , wherein sealing the aperture in the dielectric layer includes depositing tetraethyl orthosilicate (TEOS) over the dielectric wall.5. The method of claim 4 , wherein forming the aperture in the dielectric layer includes dry etching the doped dielectric film in the dielectric layer to a termination ...

METHOD FOR FABRICATING FLUID EJECTION DEVICE

Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned method. 1. A method for fabricating a fluid ejection device , the method comprising:forming a drive circuitry layer on a substrate;fabricating at least one fluid ejection element on the substrate, each fluid ejection element of the at least one fluid ejection element being electrically coupled to the drive circuitry layer;forming at least one slot within a top portion of the substrate;forming at least one fluid feed trench within a bottom portion of the substrate, wherein each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot; andlaminating a flow feature layer and a nozzle plate directly onto the top portion of the substrate having the at least one slot and the at least one fluid feed trench formed therewithin.2. The method of claim 1 , further comprising grinding the substrate from the bottom portion of the substrate up to a predetermined height prior to forming the at least one slot within the top portion of the substrate.3. The method of claim 1 , further comprising depositing a layer of an etch-stop material over the top portion of the substrate while filling the at least one slot ...

Ink jet driving apparatus and ink jet driving method

When a diameter of a hole at an exit of a nozzle is expressed as D (μm) and a distance between a position in a circulation flow path part on a side thereof closest to the exit and the exit is expressed as N (μm) in an ink jet driving apparatus, N≤3.47D is satisfied. During non-ejection, a driving control unit generates a driving signal for withdrawing ink from the exit of the nozzle to a side of a pressure chamber through a distance of 0.16N or more and 0.555D or less, and for causing the ink meniscus to oscillate, and applies the driving signal to a driving element.

FLUID EJECTION DEVICE

A method of forming a substrate for a fluid ejection device includes forming an opening through the substrate, with the opening having a long axis profile and a short axis profile, and with the long axis profile including a first portion extending from a minimum dimension of the long axis profile to a first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to a second side of the substrate opposite the first side. The method also includes forming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening. 1. A method of forming a substrate for a fluid ejection device , the substrate having a first side and a second side opposite the first side , the method comprising:forming an opening through the substrate, the opening having a long axis profile and a short axis profile, the long axis profile including a first portion extending from a minimum dimension of the long axis profile to the first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to the second side of the substrate; andforming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening.2. The method of claim 1 , wherein the first portion of the long axis profile of the opening has one of an angled profile and a stepped profile.3. The method of claim 1 , wherein a maximum dimension of the first portion of the long axis profile is provided at the first side of the substrate.4. The method of claim 1 , wherein forming the protective layer includes directionally depositing the protective layer on the sidewalls of the second portion of the long axis profile of the opening from the second ...

REDUCING SIZE VARIATIONS IN FUNNEL NOZZLES

Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate. 1. (canceled)2. A process for making a nozzle , the process comprising:forming a first opening having a first width in a top layer of a substrate;forming a patterned layer on a top surface of the substrate so that the patterned layer is disposed on the top layer of the substrate, the patterned layer including a second opening spanning the first opening in the top layer, the second opening having a second width larger than the first width;reflowing the patterned layer to form curved side surfaces terminating on the top surface of the substrate;etching a second layer of the substrate through the first opening in the top layer of the substrate to form a recess in the second layer of the substrate, the recess extending from a bottom surface of the recess to the top surface of the substrate and having a substantially constant width; andafter the recess is formed, etching the curved side surface of the patterned layer, the top layer of the substrate, and the second layer of the substrate while the bottom surface of the recess is exposed to the etch, where the etching forms a curved sidewall of the recess such the recess is wider at the top surface of the substrate than at the bottom surface of the ...

Etching method and method of manufacturing liquid discharge head substrate

An etching method of etching a first member containing iridium is provided. The method includes forming a second member above the first member, forming a first mask pattern on the second member, forming a second mask pattern by etching the second member using the first mask pattern and etching the first member using the first mask pattern and the second mask pattern. In etching the first member, the first member is etched on a condition that the first mask pattern shrinks and an upper surface of the second mask pattern is partially exposed.

PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ELEMENT APPLICATION DEVICE, AND METHOD OF MANUFACTURING PIEZOELECTRIC ELEMENT

A piezoelectric element includes a piezoelectric layer formed as a stacked structure of first, second, and third piezoelectric films. The first piezoelectric film is formed on a first electrode. The second piezoelectric film is formed on the first piezoelectric film. The third piezoelectric film is formed on the second piezoelectric film. Each of the first, second, and third piezoelectric films includes potassium, sodium, and niobium. A second electrode is formed on the piezoelectric layer. A concentration of sodium in the first piezoelectric film is greater than a concentration of sodium in the second piezoelectric film. The concentration of sodium in the second piezoelectric film is greater than a concentration of sodium in the third piezoelectric film. 1. A piezoelectric element comprising:a first electrode;a piezoelectric layer formed of a first piezoelectric film formed on the first electrode;a second piezoelectric film formed on the first piezoelectric film, and a third piezoelectric film formed on the second piezoelectric film, each of the first, second, and third piezoelectric films including potassium, sodium, and niobium; anda second electrode formed on the piezoelectric layer,wherein the piezoelectric layer is a stacked structure of the first, second, and third piezoelectric films, anda concentration of sodium in the first piezoelectric film is greater than a concentration of sodium in the second piezoelectric film, and the concentration of sodium in the second piezoelectric film is greater than a concentration of sodium in the third piezoelectric film.2. The piezoelectric element according to claim 1 ,wherein the first piezoelectric film formed on the first electrode is provided without a titanium film interposed therebetween.3. A piezoelectric element application device comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the piezoelectric element according to .'}4. A piezoelectric element application device comprising:{'claim-ref': {'@idref': ...

METHOD FOR MANUFACTURING LAMINATED STRUCTURE AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD SUBSTRATE

A method for manufacturing a laminated structure, or a method for manufacturing a liquid ejection head substrate having an electrode pad, including: preparing a substrate on which a first layer is formed, foreign matter being present on a surface of the first layer; forming a mask layer on an entire area of a surface of the substrate, the surface of the substrate being provided with the first layer; removing at least a part of the foreign matter in a height direction by performing an etching treatment on the entire surface of the mask layer; and forming a second layer on a surface on which the etching treatment is performed, wherein the etching treatment is performed so that the foreign matter is not exposed from the second layer after forming the second layer. 1. A method for manufacturing a laminated structure including a first layer on a substrate and a second layer formed on the first layer , comprising:preparing the substrate on which the first layer is formed, foreign matter being present on a surface of the first layer;forming a mask layer on an entire are of a surface of the substrate, the surface of the substrate being provided with the first layer;removing at least a part of the foreign matter in a height direction by performing an etching treatment on the entire surface of the mask layer; andforming the second layer on a surface on which the etching treatment is performed, whereinthe etching treatment is performed so that the foreign matter is not exposed from the second layer after forming the second layer.2. The method for manufacturing the laminated structure according to claim 1 , wherein the first layer is made of an electro-conductive material.3. The method for manufacturing the laminated structure according to claim 1 , wherein the mask layer is formed by a sputtering method or a CVD method.4. The method for manufacturing the laminated structure according to claim 1 , wherein the etching treatment is a treatment in which an etching selection ratio ...

Method of Making Inkjet Print Heads Having Inkjet Chambers and Orifices Formed in a Wafer and Related Devices

A method of making inkjet print heads may include forming recesses in a first surface of a first wafer to define inkjet chambers. The method may also include forming openings extending from a second surface of the first wafer through to respective ones of the inkjet chambers to define inkjet orifices. The method may further include forming a second wafer including ink heaters, and joining the first and second wafers together so that the ink heaters are aligned within respective inkjet chambers to thereby define the inkjet print heads. 1. An inkjet print head comprising:a first semiconductor substrate comprising a first surface and an opposite second surface;an inkjet chamber disposed in the first semiconductor substrate, the inkjet chamber comprising a recess extending from the first surface into the first semiconductor substrate;an inkjet orifice disposed in the first semiconductor substrate, the inkjet orifice extending from the second surface to the plurality of inkjet chambers;a substrate comprising a second semiconductor substrate attached to the first semiconductor substrate; andan ink heater disposed in the substrate, wherein the ink heater is disposed directly underneath the inkjet chamber; andan adhesion layer disposed between the first semiconductor substrate and the second semiconductor substrate.2. The inkjet print head of claim 1 , further comprising inkjet print head comprising a conductive trace to energize the ink heater.3. The inkjet print head of claim 1 , wherein the inkjet chamber has a trapezoidal or a rectangular cross-sectional shape.4. The inkjet print head of claim 1 , wherein the inkjet chamber has a height of about 20 microns claim 1 , a roof of about 12 microns claim 1 , and a floor of about 40 microns.5. The inkjet print head of claim 1 , wherein the inkjet chamber comprises a sidewall inclined at an angle of 54.7° to the first surface.6. The inkjet print head of claim 1 , wherein the adhesion layer comprises a photosensitive polymer ...

Methods of manufacturing piezoelectric element, liquid ejecting head, and ultrasonic transducer

A method of manufacturing a piezoelectric element includes a first electrode, a piezoelectric layer, and a second electrode, in which unevenness on one surface of the piezoelectric layer is formed by forming an oxidizable metal layer on the one surface of the piezoelectric layer; aggregating the metal layer by thermal oxidation; and performing isotropic etching on the metal layer aggregated on the one surface of the piezoelectric layer.

ELECTRONIC DEVICE, PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, AND MANUFACTURING METHODS FOR ELECTRONIC DEVICE, PIEZOELECTRIC DEVICE, AND LIQUID EJECTING HEAD

An electronic device includes a capacitor that is configured with a first electrode layer, an insulating layer, and a second electrode layer being formed in the order listed herein. At least one end of the capacitor is defined by an end of the second electrode layer. The insulating layer is provided so as to extend to a non-element region that is on the outside of one end of the capacitor. The insulating layer under the non-element region is formed thinner than the insulating layer under the capacitor. A difference between the thickness of the insulating layer under the non-element region and the thickness of the insulating layer under the capacitor is equal to or less than 50 nm. 1. A piezoelectric device comprising:a diaphragm; anda plurality of piezoelectric elements,wherein each one of the plurality of piezoelectric elements is configured with a first electrode layer, a first piezoelectric layer, and a second electrode layer being stacked on the diaphragm in the order listed herein,wherein the piezoelectric element is defined by a region where the first electrode, the piezoelectric layer and the second electrode layer are stacked,wherein the piezoelectric layer is provided so as to extend to a non-element region that is outside of the piezoelectric element,wherein the piezoelectric layer of the non-element region is formed thinner than the piezoelectric layer of the piezoelectric element in a direction intersectional to a direction which the plurality of piezoelectric elements are arranged,wherein the piezoelectric layer is made of dielectric polycrystals.2. The piezoelectric device according to claim 1 , wherein a damaged layer that is formed on a surface of the piezoelectric layer of the non-element region is amorphous.3. The piezoelectric device according to claim 1 , wherein claim 1 , in the direction intersectional to the direction which the plurality of piezoelectric elements are arranged claim 1 , a boundary of the piezoelectric layer of the non-element ...

METHOD OF MANUFACTURING AN EJECTION ORIFICE MEMBER

A method of manufacturing an ejection orifice member includes: preparing a substrate including a first layer, a second layer, and a third layer, the first layer protruding in a first direction crossing a principal surface of the substrate, the second and third layers being formed on the first direction side of the first layer, the preparing a substrate including forming the second layer to follow a contour of a first direction side surface of the first layer, and then forming the third layer on a surface of the second layer which protrudes on the first direction side; performing plating using the second layer as a seed to form a fourth layer on the first direction side of the second layer; removing the third layer from the fourth layer to form a hole as the ejection orifice in the fourth layer; and thinning the fourth layer at least around the hole. 1. A method of manufacturing an ejection orifice member comprising an ejection orifice for ejecting liquid , preparing a substrate comprising a first layer, a second layer, and a third layer, the first layer protruding in a first direction crossing a principal surface of the substrate, the second layer and the third layer being formed on the first direction side of the first layer,', forming the second layer so as to follow a contour of a surface of the first layer on the first direction side, and then forming the third layer on a surface of the second layer which protrudes on the first direction side; and', 'forming the third layer on the surface of the first layer which protrudes on the first direction side, and then forming the second layer on a surface of the third layer on the first direction side and on the surface of the first layer on the first direction side;, 'the preparing a substrate comprising one of, 'performing plating with the second layer being used as a seed to form a fourth layer on the first direction side of the second layer;', 'removing the third layer from the fourth layer to form a hole to be the ...

Flow path component, liquid discharge head, and liquid discharge apparatus

An inclined plane which inclines toward a lower plane of a ceiling portion, that is, the lower plane of a communication substrate from a ceiling plane of a second liquid chamber is formed in the second liquid chamber of the communication substrate. Therefore, an individual communication opening is formed, in a state of penetrating the communication substrate from the inclined plane. One end (lower end) of the individual communication opening communicates with the second liquid chamber by being open onto the inclined plane, and the other end (upper end) of the individual communication opening individually communicates with a pressure chamber of a pressure chamber forming substrate by being open onto an upper plane of the communication substrate. When a thickness of the communication substrate is referred to as T, a length of the individual communication opening is referred to as L, and a substantial depth of the second liquid chamber is referred to as D, the dimensions are configured so as to be L+D>T.

Chip layout to enable multiple heater chip vertical resolutions

An inkjet printer including a printhead with a fluid ejection chip and an associated method of forming is described. The fluid ejection chip includes a substrate, a plurality of groups of drive elements formed on the substrate, and a plurality of fluid ejection devices disposed on the substrate. Each group of drive elements includes at least two drive elements electrically coupled in parallel. Each fluid ejection device of the plurality of fluid ejection devices is electrically coupled with a respective group of the plurality of groups of drive elements so that the plurality of drive elements selectively activate the plurality of fluid ejection devices for causing fluid to be expelled from the printhead in accordance with image data.

METHOD OF MANUFACTURING ELEMENT SUBSTRATE

Provided is a method of manufacturing an element substrate, including: forming first and second resists on a predetermined surface of a substrate so that part of the predetermined surface is exposed; etching the substrate with the first and second resists being used as a mask to form a first recess in the substrate; removing the second resist to expose a portion of the substrate that is different from the first recess; etching the substrate with the first resist being used as a mask to deepen the first recess and to form a second recess communicating with the first recess in the substrate; and covering openings of the first and second recesses with an orifice forming member to form a pressure chamber by the first recess and an orifice forming member and to form a flow reducing portion by the second recess and the orifice forming member. 1. A method of manufacturing an element substrate , an orifice forming member having an orifice for ejecting liquid formed therein; and', 'a flow path forming member for forming a pressure chamber for storing the liquid to be ejected through the orifice and for generating an ejection pressure, and forming a flow reducing portion communicating with the pressure chamber,, 'the element substrate comprisingthe method comprising:forming a first resist and a second resist on a predetermined surface of a substrate serving as the flow path forming member so that part of the predetermined surface is exposed;etching the substrate with the first resist and the second resist being used as a mask to form a first recess in the substrate;removing the second resist to expose a portion of the substrate that is different from the first recess;etching the substrate with the first resist being used as a mask to deepen the first recess and to form a second recess communicating with the first recess in the substrate; andcovering openings of the first recess and the second recess with the orifice forming member to form the pressure chamber by the first ...

METHOD FOR MANUFACTURING LIQUID EJECTION HEAD

A method of manufacturing a liquid ejection head includes forming a hole in an SOI substrate including a first silicon layer, a second silicon layer, and a silicon oxide layer interposed between the first and second silicon layers such that the hole extends through the first silicon layer and the silicon oxide layer to the second silicon layer, forming a first protective film on the first silicon layer and an inner wall of the hole, forming a water-repellent film on the first protective film, attaching a support substrate to part of the water-repellent film facing away from the first silicon layer, removing the second silicon layer to remove a bottom of the hole, removing part of the water-repellent film disposed on the inner wall of the hole, and releasing the support substrate from the water-repellent film. 1. A method of manufacturing a liquid ejection head having an ejection port through which liquid is ejected , the method comprising:(a) forming a hole in an SOI substrate including a first silicon layer, a second silicon layer, and a silicon oxide layer interposed between the first and second silicon layers such that the hole extends through the first silicon layer and the silicon oxide layer to the second silicon layer;(b) forming a first protective film on the first silicon layer and an inner wall of the hole to protect the first silicon layer against the liquid;(c) forming a water-repellent film on the first protective film;(d) attaching a support substrate to part of the water-repellent film facing away from the first silicon layer;(e) removing the second silicon layer to remove a bottom of the hole;(f) removing part of the water-repellent film disposed on the inner wall of the hole; and(g) releasing the support substrate from the water-repellent film.2. The method according to claim 1 , further comprising:after step (f) and before step (g), bonding a cavity substrate having a liquid chamber communicating with the hole to the silicon oxide layer.3. The ...

Liquid ejection head and liquid ejection apparatus

According to one embodiment, an actuator of a liquid ejection head is supplied with a drive signal including a first waveform and at least one second waveform. First waveform includes a first change from a first voltage to a second voltage, and a second change from the second voltage to a third voltage less than the first voltage. A second waveform begins after a time equal to one half of the natural oscillation period of liquid in a pressure chamber of the liquid ejection head. The second waveform includes a change from the third voltage to the second voltage and a change from second voltage to the third voltage after a time less than one half of the natural oscillation period.

METHOD FOR MANUFACTURING LIQUID EJECTION HEAD

A method for manufacturing liquid ejection heads includes the steps of forming ejection port members on a substrate, the ejection port members each having a liquid channel and an ejection port for ejecting liquid through the channel, the liquid channel communicating with the substrate; forming supply ports passing through the substrate to supply liquid to the channels; and forming a separation groove in the substrate to separate the substrate for each liquid ejection head. The step of forming the ejection port members includes the step of hardening a material constituting the ejection port member by heat treatment. The step of forming the separation groove is performed before the step of hardening. 1. A method for manufacturing liquid ejection heads , comprising the steps of:forming ejection port members on a substrate, the ejection port members each having a liquid channel and an ejection port for ejecting liquid through the liquid channel, the liquid channel communicating with the substrate;forming supply ports passing through the substrate to supply liquid to the channels; andforming a separation groove in the substrate to separate the substrate for each liquid ejection head,wherein the step of forming the ejection port members includes the step of hardening a material constituting the ejection port members by heat treatment; andthe step of forming the separation groove is performed before the step of hardening.2. The method for manufacturing liquid ejection heads according to claim 1 , wherein in the step of forming the separation groove claim 1 , the separation groove is formed in the substrate by processing the substrate from a surface on which the ejection port members are to be formed.3. The method for manufacturing liquid ejection heads according to claim 1 , wherein the step of forming the supply ports and the step of forming the separation groove are performed in a same process.4. The method for manufacturing liquid ejection heads according to claim 1 , ...

LIQUID JETTING APPARATUS AND METHOD OF PRODUCING LIQUID JETTING APPARATUS

There is provided a liquid jetting apparatus, including: a first pressure chamber and a second pressure chamber arranged in a first direction; a first insulating film covering the first and second pressure chambers; a first piezoelectric element arranged to face the first pressure chamber with the first insulating film being intervened therebetween; a second piezoelectric element arranged to face the second pressure chamber with the first insulating film being intervened therebetween; a trace arranged between the first and the second piezoelectric elements adjacent to each other in the first direction; and a second insulating film covering the trace. An end, in the first direction, of a part of the second insulating film covering the trace between the first piezoelectric element and the second piezoelectric element is positioned inside an end of a partition wall partitioning the first pressure chamber and the second pressure chamber. 1. A liquid jetting apparatus , comprising:a first pressure chamber;a second pressure chamber located next to the first pressure chamber in a first direction;a first insulating film covering the first pressure chamber and the second pressure chamber;a first piezoelectric element arranged above the first pressure chamber, the first insulating film being intervened between the first pressure chamber and the first piezoelectric element;a second piezoelectric element arranged above the second pressure chamber, the first insulating film being intervened between the second pressure chamber and the second piezoelectric element;a trace arranged between the first piezoelectric element and the second piezoelectric element in the first direction; anda second insulating film covering the trace,wherein the first piezoelectric element a first electrode intervened between the first insulating film and a piezoelectric film of the first piezoelectric element,wherein the second piezoelectric element a second electrode intervened the first insulating film ...

MANUFACTURING METHOD FOR A FLUID-EJECTION DEVICE, AND FLUID-EJECTION DEVICE

A method for manufacturing a device for ejecting a fluid, including producing a nozzle plate including: forming a first nozzle cavity, having a first diameter, in a first semiconductor body; forming a hydrophilic layer at least in part in the first nozzle cavity; forming a structural layer on the hydrophilic layer; etching the structural layer to form a second nozzle cavity aligned to the first nozzle cavity in a fluid-ejection direction and having a second diameter larger than the first diameter; proceeding with etching of the structural layer for removing portions thereof in the first nozzle cavity, to reach the hydrophilic layer and arranged in fluid communication the first and second nozzle cavities; and coupling the nozzle plate with a chamber for containing the fluid. 1. A fluid ejection device , comprising: a first nozzle cavity, having a first diameter, in a first semiconductor body;', 'a first hydrophilic layer on the first semiconductor body and on inner walls of said first nozzle cavity;', 'a structural layer on the first hydrophilic layer, the first hydrophilic layer being positioned between the structural layer and the first semiconductor body; and', 'a second nozzle cavity in the structural layer, the first and second nozzle cavities being in mutual fluidic communication, the second nozzle cavity being aligned to the first nozzle cavity in a fluid-ejection direction and having a second diameter larger than the first diameter; and, 'a nozzle plate includinga containment chamber coupled to the nozzle plate and configured to contain said fluid so that the first and second nozzle cavities are in fluidic connection with the containment chamber.2. The fluid ejection device according to claim 1 , wherein the first hydrophilic layer completely coats the inner walls of the first nozzle cavity.3. The fluid ejection device according to claim 3 , wherein said first hydrophilic layer has a contact angle equal to or less than 40°.4. The fluid ejection device ...

MOLDED PRINTHEAD

In one example, a molded printhead includes a printhead die in a molding having a channel therein through which fluid may pass directly to a back part of the die. The front part of the die is exposed outside the molding surrounding the die. Electrical connections are made between terminals at the front part of the die and contacts to connect to circuitry external to the printhead. 1. An ink cartridge comprising:a cartridge housing having an ink chamber including an ink supply integrated in the ink chamber;a molding; andat least one die sliver embedded in the molding, the at least one die sliver having a back part to which ink of the ink supply passes.2. The cartridge of claim 1 , wherein the at least one die sliver comprises a liquid ejection die.3. The cartridge of claim 1 , further comprising a fluid channel fluidly connecting the ink supply with the back part of the at least one die sliver claim 1 , the fluid channel being formed in the molding in which the at least one die sliver is embedded for delivering liquid to the at least one die sliver.4. The cartridge of claim 1 , wherein a surface of the at least one die sliver is coplanar with a surface of the molding.5. The cartridge of claim 1 , wherein further comprising conductors running between a plurality of die slivers and electrical contacts claim 1 , the conductors being disposed along a surface of the molding.6. The cartridge of claim 1 , wherein:the at least one die sliver comprises a plurality of liquid ejection die slivers; andthe molding comprises a molded panel of molded material in which the plurality of ejection die slivers is embedded, wherein the liquid ejection die slivers are arranged end to end along a length of the panel, with ejection orifices of each liquid ejection die being exposed at a first surface of the panel.7. The cartridge of claim 6 , wherein a face of the molded panel and a face of each of the liquid ejection die slivers forms a single claim 6 , uninterrupted planar surface ...

LIQUID DISCHARGE HEAD SUBSTRATE, METHOD OF MANUFACTURING THE SAME, LIQUID DISCHARGE HEAD, AND LIQUID DISCHARGE APPARATUS

A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate. 120.-. (canceled)21. A liquid discharge head substrate comprising:a base where a semiconductor element is formed;a first wiring structure positioned above the base;a second wiring structure positioned above the first wiring structure;a liquid discharge element positioned above the second wiring structure; anda protective film positioned above the liquid discharge element,wherein a first surface of the first wiring structure and a second surface of the second wiring structure are in contact with each other,the first surface of the first wiring structure includes a first conductive portion, a first insulating portion, and a second insulating portion, the first conductive portion being positioned between the first insulating portion and the second insulating portion,the second surface of the second wiring structure includes a second conductive portion, a third insulating portion, and a fourth insulating portion, the second conductive portion being positioned between the third insulating portion and the fourth insulating portion,the first conductive portion and the second conductive portion are in contact with each other,the first insulating portion and the third insulating portion are in contact with each other, andthe second insulating portion and the fourth insulating portion are in contact with each other.22. The substrate according to claim 21 , wherein the second wiring structure includes an insulating member and conductive members of a ...

Droplet jetting device

A droplet jetting device comprising a membrane layer defining a pressure chamber that is in fluid communication with a nozzle, the membrane layer carrying, on a membrane that covers the pressure chamber, an actuator for generating pressure waves in a liquid in the pressure chamber, the device further comprising a distribution layer bonded to the membrane layer on the side of the membrane and defining a supply line for supplying the liquid to the pressure chamber, the supply line being connected to the pressure chamber via a restrictor passage extending through the distribution layer in the thickness direction of that layer, and via a window formed in the membrane, characterized in that the restrictor passage has a uniform cross-section, and the membrane window is delimited by a contour that is inwardly offset from the contour of the restrictor passage on the entire periphery of the restrictor passage.

LIQUID JETTING APPARATUS AND METHOD OF PRODUCING LIQUID JETTING APPARATUS

There is provided a liquid jetting apparatus, including: a first pressure chamber and a second pressure chamber arranged in a first direction; a first insulating film covering the first and second pressure chambers; a first piezoelectric element arranged to face the first pressure chamber with the first insulating film being intervened therebetween; a second piezoelectric element arranged to face the second pressure chamber with the first insulating film being intervened therebetween; a trace arranged between the first and the second piezoelectric elements adjacent to each other in the first direction; and a second insulating film covering the trace. An end, in the first direction, of a part of the second insulating film covering the trace between the first piezoelectric element and the second piezoelectric element is positioned inside an end of a partition wall partitioning the first pressure chamber and the second pressure chamber. 1. A liquid jetting apparatus , comprising:a first pressure chamber;a second pressure chamber located next to the first pressure chamber in a first direction;a first insulating film covering the first pressure chamber and the second pressure chamber;a first piezoelectric element arranged above the first pressure chamber, the first insulating film being intervened between the first pressure chamber and the first piezoelectric element;a second piezoelectric element arranged above the second pressure chamber, the first insulating film being intervened between the second pressure chamber and the second piezoelectric element;a trace arranged between the first piezoelectric element and the second piezoelectric element in the first direction; anda second insulating film arranged between the trace and a partition wall, the partition wall partitioning the first pressure chamber and the second pressure chamber in the first direction,wherein two ends of the second insulating film in the first direction are located between two ends of the partition ...

METHOD OF MANUFACTURING LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING STRUCTURE

To manufacture a liquid ejection head, a film having a lower surface free energy than a surface free energy of a substrate is first formed on an inner face of a liquid supply port. Next, a dry film to be a flow path forming member is attached to cover the surface of the substrate, and then a member to be an ejection orifice forming member is provided on the surface of the dry film. 1. A method of manufacturing a liquid ejection head , the liquid ejection head including a substrate having formed a liquid supply port as a through-hole , an ejection orifice forming member having formed an ejection orifice configured to eject a liquid , and a flow path forming member for forming a flow path that communicates with the liquid supply port and the ejection orifice , on a surface of the substrate , the method comprising:a step of forming, on an inner face of the liquid supply port, a film having a lower surface free energy than a surface free energy of the substrate;a step of attaching a dry film to be the flow path forming member so as to cover the surface of the substrate having the liquid supply port provided with the film; anda step of providing, on an opposite face of the dry film to the face facing the surface of the substrate, a member to be the ejection orifice forming member.2. The method of manufacturing a liquid ejection head according to claim 1 , wherein the substrate is silicon claim 1 , and the film is a deposited film formed when dry etching is performed to form the liquid supply port.3. The method of manufacturing a liquid ejection head according to claim 2 , wherein a part of the film located on the surface side of the substrate is removed.4. The method of manufacturing a liquid ejection head according to claim 3 , whereinthe liquid supply port is formed by etching using a mask resist provided on the surface of the substrate, andin etching removing the mask resist, a part of the film located on the surface side of the substrate is removed.5. The method of ...

METHOD FOR REMOVING TARGET OBJECT

There is provided a method for selectively removing a plurality of target objects by using a stripping solution without causing damage to an underlying material, the target objects including a resist used as a mask material for dry etching and a transformed layer and a deposited film formed during the dry etching, the stripping solution including a first composition, a second composition, and a third composition, and the method including continuously changing the composition of the stripping solution from the first composition to the second composition and then from the second composition to the third composition. 1. A method for removing a target object with a stripping solution , the target object including a mask material , a transformed layer , and a deposited film , the mask material being formed on a substrate by using a resist , the transformed layer being formed on a surface of the mask material in a step of forming a pattern on the substrate by dry etching with the mask material , the deposited film being formed on a surface of the substrate and a surface of the transformed layer , andthe stripping solution including:a first composition capable of removing the deposited film,a second composition capable of removing the transformed layer, anda third composition capable of removing the mask material,the method comprising: a substep of removing the deposited film with the stripping solution having the first composition,', 'a substep of continuously changing the composition of the stripping solution from the first composition to the second composition at least prior to the exposure of the transformed layer,', 'a substep of removing the transformed layer with the stripping solution having the second composition,', 'a substep of continuously changing the composition of the stripping solution from the second composition to the third composition with at least the mask material remaining, and', 'a substep of removing the mask material with the stripping solution ...

FLUID EJECTION DEVICE AND PRINTHEAD

Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid. 1. A method for manufacturing a fluid ejection device , the method comprising:forming a chamber configured to receive a fluid, the chamber including a first membrane at a first surface of the chamber;forming an ejection nozzle in fluidic connection with the chamber;forming a damping membrane; andforming a reservoir chamber,wherein the first membrane is configured to cause fluid in the chamber to be ejected through the ejection nozzle,wherein the reservoir chamber is fluidically coupled to the chamber by a fluid path and configured to provide the fluid to the chamber, andwherein the damping membrane faces the reservoir chamber and is configured to dampen the fluid in the reservoir chamber.2. The method according to claim 1 , wherein the damping membrane is configured to dampen the fluid in the chamber.3. The method according to claim 1 , wherein forming the damping membrane comprises forming a closed cavity in a monolithic body claim 1 , the damping membrane facing the closed cavity.4. The method according to claim 3 , further comprising forming a filter in in the monolithic body that forms a portion of the fluid path.5. The method according to claim 4 , wherein the closed cavity is formed before the filter is ...

REDUCING SIZE VARIATIONS IN FUNNEL NOZZLES

Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate. 1. A process for making a nozzle , the process comprising:forming a first opening having a first width in a top layer of a substrate, wherein the substrate includes the top layer and an underlying second layer of different material than the top layer;forming a patterned layer on a top surface of the substrate so that the patterned layer is on top of the top layer of the substrate, the patterned layer including a second opening spanning the first opening in the top layer, the second opening having a second width larger than the first width;reflowing the patterned layer to form curved side surfaces terminating on the top surface of the substrate;etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess in the second layer with outer edges of the first opening in the top layer defining a boundary of the straight-walled recess, the straight-walled recess having the first width, a bottom surface, and a side surface substantially perpendicular to the top surface of the substrate; andafter the straight-walled recess is formed, etching the curved side surface of the patterned layer, the top layer of the substrate, and the ...

METHOD FOR MANUFACTURING A FLUID-EJECTION DEVICE WITH IMPROVED RESONANCE FREQUENCY AND FLUID EJECTION VELOCITY, AND FLUID-EJECTION DEVICE

A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion. 1. A method , comprising:forming a first structural layer at a first side of a first semiconductor wafer;forming a first portion of a chamber in the first structural layer by removing selective portions of the first structural layer and, at the same time, fluidically coupling a nozzle of the first semiconductor wafer with the first portion;forming a second portion of the chamber in a second structural layer at a second side of a second semiconductor wafer by removing selective portions of a second structural layer of the second semiconductor wafer; andforming the chamber configured to contain the fluid by coupling together the first and second semiconductor wafers with the first portion facing the second portion, the first portion defining a first volume of a total volume of the chamber, the second portion defining a second volume of the total volume, the first volume being larger than the second volume.2. The method according to claim 1 , wherein:forming the first structural layer includes forming the first structural layer on a nozzle layer of the first semiconductor wafer, the nozzle layer being on a substrate of the first semiconductor wafer and including the nozzle; andforming the ...

Liquid Jet Apparatus and Method for Manufacturing Liquid Jet Apparatus

There is provided a liquid jet apparatus including a channel substrate having a plurality of pressure chambers and a film covering the plurality of pressure chambers, a piezoelectric layer, a plurality of individual electrodes, a common electrode, and a trace extending from one of the plurality of individual electrodes to pass through between two adjacent individual electrodes of the plurality of individual electrodes. An opening of the piezoelectric layer is provided between the two adjacent individual electrodes, and a metallic film is formed to cover the trace in such an area of the trace as to overlap with the opening positioned between the two adjacent individual electrodes. 1. (canceled)2. A liquid jet apparatus comprising:a film;a first piezoelectric element arranged on the film;a second piezoelectric element arranged on the film;a third piezoelectric element arranged on the film; anda trace connected with the first piezoelectric element,wherein the second piezoelectric element and the third piezoelectric element are aligned along a first direction,wherein the first piezoelectric element is offset from the second and the third piezoelectric elements in a second direction orthogonal to the first direction,wherein the first piezoelectric element includes a first piezoelectric portion,wherein the second piezoelectric element includes a second piezoelectric portion,wherein the third piezoelectric element includes a third piezoelectric portion,wherein the trace includes a first portion and a second portion which is offset from the first portion in the second direction,wherein the first portion is located between the film and the first piezoelectric portion in a third direction orthogonal to the first and second directions,wherein the second portion is located between the second piezoelectric portion and the third piezoelectric portion in the first direction, andwherein the second portion is covered with a metallic film.3. The liquid jet apparatus according to ...

Ink jet head having nozzle plate equipped with piezoelectric elements

An ink jet head includes: a pressure chamber to be filled with ink formed in a pressure chamber structure, the pressure chamber in which an etching limiter made of a material different from a material of the pressure chamber structure is formed on an inner wall surface of the pressure chamber; a nozzle plate comprising a nozzle that leading to the pressure chamber and a movable range fitted to the etching limiter; and a flat driver comprising a piezoelectric body to operate the movable range and arranged on the nozzle plate.

LIQUID EJECTION HEAD SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF PROCESSING SILICON SUBSTRATE

The wall of each supply path formed in a silicon substrate has such a shape that a plurality of regions distinguished from each other due to different inclinations to a first surface of the silicon substrate are connected to each other between the first surface and a second surface of the silicon substrate and the width of the supply path is maintained or expands from the first surface to second surface of the silicon substrate. An internal opening is formed by one of the regions that is most steeply inclined to the first surface of the silicon substrate. A region reducing the squeezing of an adhesive into the internal opening is placed between the internal opening and the second surface of the silicon substrate. 1. A liquid ejection head substrate having a first surface and a second surface opposite to the first surface , comprising:a plurality of ejection energy-generating elements placed on the first surface,the liquid ejection head substrate having a plurality of supply paths, extending between the first and second surfaces, for supplying liquid to the ejection energy-generating elements,wherein the distance between the centers of the neighboring supply paths in the first surface is 1 mm or less;the wall of each supply path has a cross-sectional shape which is perpendicular to the first surface, in which a plurality of regions distinguished from each other due to different inclinations to the first surface are connected to each other between the first and second surfaces, and in which the width of the supply path is maintained or expands from the first surface toward the second surface; andthe supply path has an internal opening formed by one of the regions that is most steeply inclined to the first surface and a mechanism, located between the second surface and one of the regions that is most steeply inclined, reducing the squeezing of an adhesive into the internal opening.2. The liquid ejection head substrate according to claim 1 , wherein the number of the ...

Piezoelectric device, liquid ejecting head, liquid ejecting apparatus and manufacturing method of piezoelectric device

A piezoelectric device comprising a substrate having two surface sides; a vibration plate on one of the two surface side, a piezoelectric element including a first electrode provided on the vibration plate, a piezoelectric body layer provided on the first electrode, the piezoelectric body layer having a groove section on a side surface, the groove section including a first surface facing to the vibration plate, and a second electrode provided on the piezoelectric body layer, and a stress application film having tensile stress and provided on an inner surface of the groove section.

Mems device, liquid ejecting head, and liquid ejecting apparatus

There is provided a MEMS device which includes a second substrate which is disposed with an interval from a first substrate, and an interposed member which is interposed between the first substrate and the second substrate, and which has space which is defined by the first substrate, the second substrate, and the interposed member, in which the first substrate includes a wiring which extends from a first surface side which is a surface on a side opposite to the second substrate toward a second surface side which is a surface of the second substrate side and is made of a conductor, in which an end portion of the first surface side of the wiring is covered by a first protective film provided on the first surface side, and in which an end portion of the second surface side of the wiring faces the space.

INKJET PRINTING APPARATUSES, INKJET NOZZLES, AND METHODS OF FORMING INKJET NOZZLES

Provided is an inkjet printing apparatus. The inkjet printing apparatus includes a nozzle. The nozzle includes at least two nozzle parts. A first of the at least two nozzle parts has a first tapered shape, and a second of the at least two nozzle parts has a second tapered shape and extends from the first nozzle part. The first and second tapered shapes have a same taper direction. 1. An inkjet printing apparatus comprising:a nozzle; a first of the at least two nozzle parts a first tapered shape, and', 'a second of the at least two nozzle parts having a second tapered shape and extending from the first nozzle part, and', 'wherein the first and second tapered shapes have a same taper direction., 'wherein the nozzle includes at least two nozzle parts,'}2. The apparatus of claim 1 , wherein the second nozzle part has a tapered shape to a direction in which the nozzle extends claim 1 , and the taper angle of the second nozzle part is greater than zero and less than 90 degrees.3. The apparatus of claim 2 , wherein the at least two nozzle parts includes a third nozzle part having a third tapered shape and extending from the second nozzle part claim 2 , andwherein a taper angle of the second nozzle part is less than taper angles of the first nozzle part and the third nozzle part.4. The apparatus of claim 1 , wherein the at least two nozzle parts includes a third nozzle part having a third tapered shape and extending from the second nozzle part claim 1 , andwherein taper angles of the first nozzle part and the third nozzles part are substantially the same.5. The apparatus of claim 1 , further comprising:a trench formed around the nozzle.6. The apparatus of claim 1 , wherein the at least two nozzle parts are in a single substrate.7. The apparatus of claim 5 , wherein the trench extends in a first direction and is formed on two sides of the nozzle in a second direction substantially orthogonal to the first direction.8. The apparatus of claim 1 , wherein the nozzle is a ...

INKJET HEAD AND METHOD FOR MANUFACTURING INKJET HEAD

An inkjet head according to an embodiment includes a base portion, a driving element, a wire, a protection portion, and a boundary portion. The base portion includes a mounting surface. The driving element is mounted on the base portion. The wire is formed on the mounting surface and connected to the driving element. The protection portion is formed on the mounting surface, covering a portion of the driving element and the wire, and possesses an insulation property. The boundary portion is provided at an end of the protection portion contacting the wire that is exposed. The boundary portion is thinner than the protection portion and possesses an insulation property. Thus, an inkjet head in which stripping of an insulating portion can be restrained is provided. 1. An inkjet head comprising:a base portion including a mounting surface;a driving element mounted on the base portion;a wire formed on the mounting surface and connected to the driving element;a protection portion formed on the mounting surface, covering a portion of the driving element and the wire, wherein the protection portion possesses an insulation property; anda boundary portion provided at an end of the protection portion contacting the wire that is exposed, wherein the boundary portion is thinner than the protection portion and possesses an insulation property.2. The inkjet head according to claim 1 , wherein the boundary portion decreases in thickness as it goes toward the wire that is exposed.3. The inkjet head according to claim 2 , further comprising:a lateral protection portion covering at least a part of a lateral surface of the base portion that intersects with the mounting surface, wherein the lateral protection portion possesses an insulation property; anda lateral boundary portion provided at an end of the lateral protection portion that faces the mounting surface, wherein the lateral boundary portion is thinner than the lateral protection portion and possesses an insulation property; ...

Piezoelectric actuator and method for manufacturing piezoelectric actuator

A piezoelectric actuator includes a substrate, a first electrode arranged on the substrate, a piezoelectric body stacked on the first electrode, a second electrode superimposed on a surface of the piezoelectric body on a side opposite to the first electrode, and a wiring connected to the first electrode. The first electrode has a connecting portion which is arranged to protrude from an end portion of the piezoelectric body and to which the wiring is connected, and a first conductive portion is provided so that the first conductive portion overlaps with the first electrode while extending over from an area overlapped with the end portion of the piezoelectric body up to the connecting portion of the first electrode.

PROCESSING METHOD OF SILICON SUBSTRATE, FABRICATING METHOD OF SUBSTRATE FOR LIQUID EJECTION HEAD, AND FABRICATING METHOD OF LIQUID EJECTION HEAD

An object of the present invention is to provide a processing method of a silicon substrate, capable of suppressing breakage of thin silicon or a thin film structure of an intermediate layer in etching first and second silicon substrates. According to the present invention, a first silicon substrate and a second silicon substrate are bonded to each other while holding an intermediate layer having an opening between both of the silicon substrates in a bonding step. A closed space defined by at least one of the first and second silicon substrates and the opening at least partly embedded with a filler in a filling step. Furthermore, a liquid supply port is formed in such a manner as to penetrate the filler in the opening and the second silicon substrate from the first silicon substrate in an etching step. 1. A processing method of a silicon substrate comprising the steps of:bonding a first silicon substrate and a second silicon substrate facing the first silicon substrate while holding an intermediate layer having an opening between the first and second silicon substrates;filling to at least partly embed a closed space defined by at least one of the first and second silicon substrates and the opening with a filler; andetching to form a through port penetrating the filler in the opening and the second silicon substrate from the first silicon substrate.2. The processing method of a silicon substrate according to claim 1 , wherein the opening is a hole penetrating the intermediate layer.3. The processing method of a silicon substrate according to claim 1 , wherein the opening is a recess formed at the intermediate layer.4. The processing method of a silicon substrate according to claim 3 , wherein in the etching step claim 3 , etching to penetrate the recess formed on the intermediate layer is further performed.5. The processing method of a silicon substrate according to claim 4 , wherein in the etching step claim 4 , etching to penetrate the recess formed on the ...

METHOD OF MANUFACTURING AN INK-JET PRINTHEAD

A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of said ink; and assembling the silicon substrate with said hydraulic structure layer and said silicon orifice plate. Providing the silicon orifice plate comprises: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning step at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink. 1. A method of manufacturing an ink jet printhead comprising:providing a silicon substrate including active ejecting elements;providing a hydraulic structure layer for defining hydraulic circuits through which ink flows;providing a silicon orifice plate having a plurality of nozzles for ejection of said ink; andassembling said silicon substrate with said hydraulic structure layer and said silicon orifice plate;wherein providing said silicon orifice plate comprises:providing a silicon wafer having a planar extension delimited by a first and a second surface opposite to each other;performing a thinning step at said second surface so as to remove from said second surface a central portion having a preset height, said silicon wafer being formed, following said thinning step, by a base portion having a planar extension and a peripheral portion extending, from said base portion transversally with respect to the planar extension of said base portion; andforming in said silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of said ink.2. The method according to claim 1 , wherein said first and second surfaces are separated by a distance claim 1 , a longitudinal length of said nozzles being defined by a ...

Method of manufacturing substrate with resin layer and method of manufacturing liquid ejection head

In a method of manufacturing a liquid ejection head including transferring a dry film for forming a partial structure of a liquid ejection head from a support to a substrate, the dry film with the support is bonded on a processing surface of the substrate with forming a projection part in which peripheral edges of the dry film and the support protrude further outside than a peripheral edge of the processing surface; the projection part is cut at a cutting position between an outer edge of the projection part and the peripheral edge of the processing surface to form a remaining projection part, and the support is peeled from the substrate with the remaining projection part as a start position to leave the dry film on the processing surface which forms the partial structure of the liquid ejection head.

Method of making inkjet print heads having inkjet chambers and orifices formed in a wafer and related devices

A method of making inkjet print heads may include forming recesses in a first surface of a first wafer to define inkjet chambers. The method may also include forming openings extending from a second surface of the first wafer through to respective ones of the inkjet chambers to define inkjet orifices. The method may further include forming a second wafer including ink heaters, and joining the first and second wafers together so that the ink heaters are aligned within respective inkjet chambers to thereby define the inkjet print heads.

Fluid ejection structure

A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.

Device using a piezoelectric element and method for manufacturing the same

An inkjet printing head includes a hydrogen barrier film, covering side surfaces of upper electrodes and piezoelectric films, a portion of an upper surface of each upper electrode, and a portion of an upper surface of a lower electrode, an insulating film, formed above the hydrogen barrier film, upper wiring, formed above the insulating film, connects the upper electrode to a drive circuit, and a lower wiring, formed above the insulating film, connects the lower electrode to the drive circuit. First contact holes, each exposing an upper electrode, and second contact holes, each exposing an extension portion, are formed in the hydrogen barrier film and the insulating film. The upper wirings are connected to the upper surfaces of the upper electrodes via the first contact holes and the lower wiring is connected to an upper surface of the extension portion via the second contact holes.

LIQUID EJECTING HEAD, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD

A liquid ejecting head includes a first substrate in which a piezoelectric element is provided; and a second substrate on which the first substrate is connected to a first surface, in which the second substrate is provided with a penetration hole, which penetrates through the second substrate in a plate thickness direction, and penetration wiring, which is formed from a conductor that is formed in an inner portion of the penetration hole, the penetration wiring is formed from a first end portion, which is provided on a first surface side, a second end portion, which is provided on a second surface side, which is a surface that is on an opposite side to the first surface, and connection wiring, which connects the first end portion and the second end portion, and a cross-sectional area of the connection wiring in a planar direction of the first surface is smaller than cross-sectional areas of the first end portion and the second end portion in the planar direction. 1. A liquid ejecting head comprising:a first substrate in which a piezoelectric element is provided; anda second substrate on which the first substrate is connected to a first surface,wherein the second substrate is provided with a penetration hole, which penetrates through the second substrate in a plate thickness direction, and penetration wiring, which is formed from a conductor that is formed in an inner portion of the penetration hole,wherein the penetration wiring is formed from a first end portion, which is provided on a first surface side, a second end portion, which is provided on a second surface side, which is a surface that is on an opposite side to the first surface, and connection wiring, which connects the first end portion and the second end portion, andwherein a cross-sectional area of the connection wiring in a planar direction of the first surface is smaller than cross-sectional areas of the first end portion and the second end portion in the planar direction.2. The liquid ejecting head ...

Liquid discharge head substrate, liquid discharge head, and method for disconnecting fuse portion in liquid discharge head substrate

Influence of transform of quality to an entire liquid discharge head is suppressed when a heat resistor and a covering portion are electrically connected to each other. To address this problem, a liquid discharge head substrate includes fuse portions for respective heat resistor arrays.

Liquid Jet Apparatus and Method for Manufacturing Liquid Jet Apparatus

There is provided a liquid jet apparatus including a channel substrate having a plurality of pressure chambers and a film covering the plurality of pressure chambers, a piezoelectric layer, a plurality of individual electrodes, a common electrode, and a trace extending from one of the plurality of individual electrodes to pass through between two adjacent individual electrodes of the plurality of individual electrodes. An opening of the piezoelectric layer is provided between the two adjacent individual electrodes, and a metallic film is formed to cover the trace in such an area of the trace as to overlap with the opening positioned between the two adjacent individual electrodes. 1. A liquid jet apparatus comprising:a film;a first piezoelectric element arranged on the film;a second piezoelectric element arranged on the film;a third piezoelectric element arranged on the film;a trace connected with the first piezoelectric element; andan electrode arranged on the film,wherein the second piezoelectric element and the third piezoelectric element aligned along a first direction,wherein the first piezoelectric element is offset from the second and the third piezoelectric element in a second direction orthogonal to the first direction,wherein the first piezoelectric element includes a first piezoelectric portion,wherein the second piezoelectric element includes a second piezoelectric portion,wherein the third piezoelectric element includes a third piezoelectric portion,wherein the trace includes an end, in the second direction, which is connected to the electrode and a portion which is offset from the end in the second direction,wherein the electrode is located between the film and the first piezoelectric portion in a third direction orthogonal to the first and second direction,wherein the portion of the trace is located between the second piezoelectric portion and the third piezoelectric portion in the first direction, andwherein the portion of the trace is covered with a ...

LIQUID EJECTION HEAD AND METHOD FOR PRODUCING THE SAME

A liquid ejection head including a substrate having an ejection-energy-generating element for generating energy for ejecting a liquid; an orifice plate including at least an ejection-orifice-forming wall that constitutes an ejection orifice for ejecting the liquid and an upper wall of a liquid chamber communicating with the ejection orifice, and a liquid chamber side wall that constitutes a side wall of the liquid chamber. The orifice plate is formed of an inorganic material. The liquid ejection head includes a plurality of liquid chambers; and an elastic member filled into a depressed portion formed between the liquid chamber side wall of one liquid chamber of the liquid chambers adjacent to each other and the liquid chamber side wall of the other liquid chamber. The upper end of the elastic member is arranged in a position higher than an upper face of the ejection-orifice-forming wall. 1. A liquid ejection head comprising:a substrate having an ejection-energy-generating element for generating energy for ejecting a liquid;an orifice plate including at least an ejection-orifice-forming wall that constitutes an ejection orifice for ejecting the liquid and an upper wall of a liquid chamber communicating with the ejection orifice, and a liquid chamber side wall that constitutes a side wall of the liquid chamber, whereinthe orifice plate is formed of an inorganic material,the liquid ejection head comprises:a plurality of liquid chambers; andan elastic member filled into a depressed portion formed between the liquid chamber side wall of one liquid chamber of the liquid chambers adjacent to each other and the liquid chamber side wall of the other liquid chamber, andan upper end of the elastic member is arranged in a position higher than an upper face of the ejection-orifice-forming wall.2. The liquid ejection head according to claim 1 , wherein the elastic member is arranged also on the ejection-orifice-forming wall.3. The liquid ejection head according to claim 2 , ...

LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC DEVICE

A liquid ejecting head includes a flow channel forming substrate that is provided with a space constituting a pressure generating chamber which communicates with nozzle openings, a vibration plate that is stacked on one surface of the flow channel forming substrate and seals the space, and a piezoelectric element that includes a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on a surface of the vibration plate opposite to the flow channel forming substrate, in which the first electrode is formed, in which at least a width of a first direction along the opposite surface is narrower than the space in a region corresponding to the space, the piezoelectric layer is stacked so as to overlap the first electrode and at least a part of the vibration plate in the region corresponding to the space, the second electrode is stacked so as to overlap the piezoelectric layer in the region corresponding to the space, and as a thickness of a stacked direction of the piezoelectric element is a thickness of the piezoelectric layer, a first thickness (D) of the piezoelectric layer of a part positioned on the first electrode and a second thickness (D) of the piezoelectric layer of a part positioned on the vibration plate satisfy a relationship of the first thickness (D)>the second thickness (D). 1. A liquid ejecting head comprising:a plurality of chambers arranged in a first direction;a nozzle opening;a vibration plate positioned on at least one chamber of the plurality of chambers; anda piezoelectric element positioned on the vibration plate, the piezoelectric element having a first electrode, a piezoelectric layer, and a second electrode in a stacked direction,wherein the first electrode has a width in the first direction which is narrower than a width of the chamber in the first direction, the first electrode has a side surface intersecting the first direction and an upper surface,wherein the piezoelectric layer is positioned on the first ...