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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 23581. Отображено 100.
05-01-2012 дата публикации

Method for producing a stamp for hot embossing

Номер: US20120000379A1
Автор: Eugenia Kumacheva, Jesse Greener, Wei Li
Принадлежит: University of Toronto

The present invention provides a process for producing a stamp for hot embossing (HE). The stamp can be constructed from any photo-resist epoxy that is stable at temperatures equal to the glass transition temperature (T g ) of the material to be stamped. The stamp can be used repeatedly without significant distortion of features. The stamp benefits from low relative cost, high fidelity of features in all three-dimensions and fast construction. The process for producing a stamp for hot embossing from a resist, comprising the steps of producing a seed layer L 1 from a selected photoresist polymer material, soft baking the seed layer L 1 , exposing said seed layer L 1 to initiate cross-linking and then post-exposure bake L 1 to fully cross-link it, coating the cross-linked seed layer L 1 with a second photoresist polymer layer L 2 ; soft baking the second photoresist polymer layer L 2 ; applying a mask to the top surface of the soft baked layer L 2 and illuminating the unmasked portions of the soft baked layer L 2 with UV radiation through the mask, wherein the exposed areas form the pattern of the embossing features, washing away un-exposed regions of the photoresist with a developer to leave behind a relief pattern formed in the second photoresist polymer layer L 2 , which relief pattern corresponds to a pattern in the mask.

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Номер записи: 1
05-01-2012 дата публикации

Actuator device and input apparatus

Номер: US20120001520A1
Автор: Isao Takahashi, Kenichi Mitsumori
Принадлежит: Alps Electric Co Ltd

An actuator device includes an actuator having one end as a fixed end and the other end as a free end, and bendable when a voltage is applied; and a base member having a fixed section that fixes the fixed end of the actuator. A projecting section is provided at the base member. In a state where the actuator is bent, when a force is applied and the free end is deformed toward a direction that is reverse to the bending direction, the actuator contacts the projecting section. The projecting section is a fulcrum of the displacement and a generating load is capable of being large by the principle of material mechanics without losing the displacement amount.

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Номер записи: 2
26-01-2012 дата публикации

Process for manufacturing a micromechanical structure having a buried area provided with a filter

Номер: US20120018819A1
Автор: Igor Varisco, Luca Zanotti, Marco Ferrera, Matteo Perletti
Принадлежит: STMICROELECTRONICS SRL

A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

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Номер записи: 3
26-01-2012 дата публикации

Bonded Microelectromechanical Assemblies

Номер: US20120019598A1
Автор: Marc A. Torrey, Paul A. Hoisington
Принадлежит: Fujifilm Dimatix Inc

A MEMS device is described that has a body with a component bonded to the body. The body has a main surface and a side surface adjacent to the main surface and smaller than the main surface. The body is formed of a material and the side surface is formed of the material and the body is in a crystalline structure different from the side surface. The body includes an outlet in the side surface and the component includes an aperture in fluid connection with the outlet.

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Номер записи: 4
02-02-2012 дата публикации

Electrode assembly

Номер: US20120024571A1
Автор: Andrew Raymond Mount, Anthony John Walton, Jonathan Gordon Terry, Neville John Freeman
Принадлежит: Nanoflex Ltd, University of Edinburgh

The present invention relates to an electrode assembly having a laminate structure comprising: a first insulating capping layer; a first conducting layer capped by the first insulating capping layer and substantially sandwiched by at least the first insulating capping layer such as to leave exposed only an electrical contact lip of the first conducting layer; and an array of etched voids extending through at least the first insulating capping layer and the first conducting layer, wherein each void is partly bound by a surface of the first conducting layer which acts as an internal submicron electrode.

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Номер записи: 5
09-02-2012 дата публикации

Microphone and accelerometer

Номер: US20120033832A1
Автор: Geert Langereis, Martijn Goossens, Twan Van Lippen
Принадлежит: NXP BV

The invention relates to a method for manufacturing a micromachined microphone and an accelerometer from a wafer 1 having a first layer 2 , the method comprising the steps of dividing the first layer 2 into a microphone layer 5 and into an accelerometer layer 6 , covering a front side of the microphone layer 5 and a front side of the accelerometer layer 6 with a continuous second layer 7 , covering the second layer 7 with a third layer 8 , forming a plurality of trenches 9 in the third layer 8 , removing a part 10 of the wafer 1 below a back side of the microphone layer 5 , forming at least two wafer trenches 11 in the wafer 1 below a back side of the accelerometer layer 6 , and removing a part 12, 13 of the second layer 7 through the plurality of trenches 9 formed in the third layer 8 . The micromachined microphone and the accelerometer according to the invention is advantageous over prior art as it allows for body noise cancellation in order to minimize structure borne sound.

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Номер записи: 6
16-02-2012 дата публикации

Method to form nanopore array

Номер: US20120040512A1
Автор: Chengwen Pei, Frank Yang, Zhengwen Li
Принадлежит: Globalfoundries Inc, International Business Machines Corp

A method of forming nanopore is provided that includes forming a first structure on a substrate, and forming a second structure overlying the first structure. An intersecting portion of the first and the second structures is etched to provide an opening of nanopore dimensions. The substrate may be etched with a backside substrate etch to expose the nanopore opening.

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Номер записи: 7
23-02-2012 дата публикации

MEMS Sensor Device With Multi-Stimulus Sensing and Method of Fabricating Same

Номер: US20120043627A1
Автор: Hemant D. Desai, Mark E. Schlarmann, Woo Tae Park, Yizhen Lin
Принадлежит: FREESCALE SEMICONDUCTOR INC

A device ( 20, 90 ) includes sensors ( 28, 30 ) that sense different physical stimuli. A pressure sensor ( 28 ) includes a reference element ( 44 ) and a sense element ( 52 ), and an inertial sensor ( 30 ) includes a movable element ( 54 ). Fabrication ( 110 ) entails forming ( 112 ) a first substrate structure ( 22, 92 ) having a cavity ( 36, 100 ), forming a second substrate structure ( 24 ) to include the sensors ( 28, 30 ), and coupling ( 128 ) the substrate structures so that the first sensor ( 28 ) is aligned with the cavity ( 36, 100 ) and the second sensor ( 30 ) is laterally spaced apart from the first sensor ( 28 ). Forming the second structure ( 24 ) includes forming ( 118 ) the sense element ( 52 ) from a material layer ( 124 ) of the second structure ( 24 ) and following coupling ( 128 ) of the substrate structures, concurrently forming ( 132 ) the reference element ( 44 ) and the movable element ( 54 ) in a wafer substrate ( 122 ) of the second structure ( 24 ).

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Номер записи: 8
23-02-2012 дата публикации

Methods Of Forming Patterns, And Methods Of Forming Integrated Circuits

Номер: US20120045891A1
Автор: Dan Millward, Scott Sills
Принадлежит: Micron Technology Inc

Some embodiments include methods of forming patterns in substrates by utilizing block copolymer assemblies as patterning materials. A block copolymer assembly may be formed over a substrate, with the assembly having first and second subunits arranged in a pattern of two or more domains. Metal may be selectively coupled to the first subunits relative to the second subunits to form a pattern of metal-containing regions and non-metal-containing regions. At least some of the block copolymer may be removed to form a patterned mask corresponding to the metal-containing regions. A pattern defined by the patterned mask may be transferred into the substrate with one or more etches. In some embodiments, the patterning may be utilized to form integrated circuitry, such as, for example, gatelines.

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Номер записи: 9
08-03-2012 дата публикации

MEMS Sensor Package

Номер: US20120056280A1
Автор: Chih-Kung Huang, Ming-Ching Wu
Принадлежит: Individual

A MEMS sensor package includes a support and a MEMS sensor chip having a mounting side adhered on the support by a point-shaped adhesive or a linear-shaped adhesive in such a way that the MEMS sensor chip has a free side opposite to the mounting and suspended above the support. Because the MEMS sensor chip has the free side that is not restrained on the support, the stress due to deformation of the support will not affect the accuracy of the MEMS sensor chip.

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Номер записи: 10
22-03-2012 дата публикации

Substrate bonding with metal germanium silicon material

Номер: US20120068325A1
Автор: Alex P. Pamatat, Ruben B. Montez
Принадлежит: FREESCALE SEMICONDUCTOR INC

In one embodiment, a semiconductor structure including a first substrate, a semiconductor device on the first substrate, a second substrate, and a conductive bond between the first substrate and the second substrate that surrounds the semiconductor device to seal the semiconductor device between the first substrate and the second substrate. The conductive bond comprises metal, silicon, and germanium. A percentage by atomic weight of silicon in the conductive bond is greater than 5%.

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Номер записи: 11
12-04-2012 дата публикации

Mems device and composite substrate for an mems device

Номер: US20120086086A1
Автор: Bor-Shiun Lee, HUNG-YI LIN, Ming-Fa Chen
Принадлежит: Touch Micro System Technology Inc

An MEMS device and a composite substrate for an MEMS device are provided. The MEMS device comprises a first silicon structure layer and a second silicon structure layer fixedly connecting to the first silicon structure layer. The first silicon structure layer has a twistable rod and a first plane. The first silicon structure layer has a first crystal direction with a miller index of <100> and a second crystal direction with a miller index of <110>. The first crystal direction and the second crystal direction are both parallel to the first plane. The rod has an axis direction, which is parallel to the first plane and intersected by the second crystal direction. In this manner, the torsional stiffness of the rod can be improved.

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Номер записи: 12
19-04-2012 дата публикации

Semiconductor component having a micromechanical microphone structure

Номер: US20120091545A1
Автор: Arnim Hoechst, Frank Reichenbach, Thomas Buck
Принадлежит: ROBERT BOSCH GMBH

A simple and cost-effective form of implementing a semiconductor component having a micromechanical microphone structure, including an acoustically active diaphragm as a deflectable electrode of a microphone capacitor, a stationary, acoustically permeable counterelement as a counter electrode of the microphone capacitor, and means for applying a charging voltage between the deflectable electrode and the counter electrode of the microphone capacitor. In order to not impair the functionality of this semiconductor component, even during overload situations in which contact occurs between the diaphragm and the counter electrode, the deflectable electrode and the counter electrode of the microphone capacitor are counter-doped, at least in places, so that they form a diode in the event of contact. In addition, the polarity of the charging voltage between the deflectable electrode and the counter electrode is such that the diode is switched in the blocking direction.

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Номер записи: 13
03-05-2012 дата публикации

Channel and method of forming channels

Номер: US20120107194A1
Автор: Elizabeth A. Strychalski, Harold G. Craighead, Leon M. Bellan
Принадлежит: CORNELL UNIVERSITY

A device is made by forming sacrificial fibers on a substrate mold. The fibers and mold are covered with a first material. The substrate mold is removed, and the covered fibers are then removed to form channels in the first material.

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Номер записи: 14
17-05-2012 дата публикации

Motion controlled actuator

Номер: US20120119612A1
Автор: Ankur Jain, Guiqin Wang, Robert J. Calvet, Roman C. Gutierrez, Xiaolei Liu
Принадлежит: Tessera MEMS Technologies Inc

A device can have an outer frame and an actuator. The actuator can have a movable frame and a fixed frame. At least one torsional flexure and at least one hinge flexure can cooperate to provide comparatively high lateral stiffness between the outer frame and the movable frame and can cooperate to provide comparatively low rotational stiffness between the outer frame and the movable frame.

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Номер записи: 15
17-05-2012 дата публикации

Mounting flexure contacts

Номер: US20120120507A1
Автор: Ankur Jain, Roman C. Gutierrez
Принадлежит: Tessera MEMS Technologies Inc

A device may comprise a flexure formed of a first semiconductor material. A first trench may be formed in the flexure. The first trench may separate the first semiconductor material into a first portion and a second portion thereof. An oxide layer may be formed in the first trench. The oxide layer may extend over a top portion of the first semiconductor material. A second semiconductor material may be formed on the oxide layer. The first trench and the oxide layer may cooperate to electrically isolate the first portion and the second portion from one another.

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Номер записи: 16
24-05-2012 дата публикации

Systems and methods for a four-layer chip-scale mems device

Номер: US20120126348A1
Автор: Robert D. Horning
Принадлежит: Honeywell International Inc

Systems and methods for a micro-electromechanical system (MEMS) apparatus are provided. In one embodiment, a system comprises a first double chip that includes a first base layer; a first device layer bonded to the first base layer, the first device layer comprising a first set of MEMS devices; and a first top layer bonded to the first device layer, wherein the first set of MEMS devices is hermetically isolated. The system also comprises a second double chip that includes a second base layer; a second device layer bonded to the second base layer, the second device layer comprising a second set of MEMS devices; and a second top layer bonded to the second device layer, wherein the second set of MEMS devices is hermetically isolated, wherein a first top surface of the first top layer is bonded to a second top surface of the second top layer.

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Номер записи: 17
24-05-2012 дата публикации

Method and system for packaging a display

Номер: US20120127556A1
Автор: Brian J. Gally, Clarence Chui, Lauren Palmateer, Philip D. Floyd, William J. Cummings
Принадлежит: Qualcomm Mems Technologies Inc

A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.

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Номер записи: 18
31-05-2012 дата публикации

Micromechanical component

Номер: US20120133003A1
Автор: Jochen Reinmuth
Принадлежит: ROBERT BOSCH GMBH

A micromechanical component includes: a substrate having a multitude of trench structures which separate a first and a second mass element of the substrate from a web element of the substrate, in such a way that the first and second mass elements enclose the web element along an extension direction of the main surface of the substrate and are disposed to allow movement relative to the substrate in the direction of a surface normal of the main surface; a first electrode layer applied on the main surface of the substrate and forms a first electrode on the web element between the first and second mass elements; and a second electrode layer applied on the first and second mass elements and forming a self-supporting second electrode above the first electrode in the area of the web element, the first and second electrode forming a capacitance.

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Номер записи: 19
07-06-2012 дата публикации

Mems switches and fabrication methods

Номер: US20120138436A1
Автор: Jeffrey P. Gambino, Stephen A. Mongeon
Принадлежит: International Business Machines Corp

MEMS switches and methods of fabricating MEMS switches. The switch has a vertically oriented deflection electrode having a conductive layer supported by a supporting layer, at least one drive electrode, and a stationary electrode. An actuation voltage applied to the drive electrode causes the deflection electrode to be deflect laterally and contact the stationary electrode, which closes the switch. The deflection electrode is restored to a vertical position when the actuation voltage is removed, thereby opening the switch. The method of fabricating the MEMS switch includes depositing a conductive layer on mandrels to define vertical electrodes and then releasing the deflection electrode by removing the mandrel and layer end sections.

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Номер записи: 20
07-06-2012 дата публикации

Resin bonding method by photoirradiation, method for producing resin article, resin article produced by the same method, method for producing microchip, and microchip produced by the same method

Номер: US20120140335A1
Автор: Hiroyuki Sugimura, Yoshihiro Taguchi, Yoshinao Taniguchi
Принадлежит: Alps Electric Co Ltd

A resin bonding method according to the present invention is a resin bonding method for bonding a first resin and a second resin including (I) a step of irradiating spaces containing oxygen molecules with vacuum ultraviolet light having a wavelength of 175 nm or less, the spaces being in contact with surfaces of the first and second resins; and (II) a step of, after the irradiation, subjecting the surfaces to temperature rise while the surfaces are in contact with each other, to bond the first resin and the second resin together with the surfaces serving as bonding surfaces. In the step (I), the surfaces of the first and second resins may be further irradiated with the vacuum ultraviolet light. In this case, a light amount of the vacuum ultraviolet light having reached the surfaces is preferably, for example, 0.1 J/cm 2 or more and 10 J/cm 2 or less.

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Номер записи: 21
07-06-2012 дата публикации

Wafer Level Structures and Methods for Fabricating and Packaging MEMS

Номер: US20120142144A1
Автор: Babak Taheri
Принадлежит: Babak Taheri

Methods of fabricating a Micro-Electromechanical System (MEMS) in a hermetically sealed cavity formed at a substrate level are provided. Generally, the method comprises: (i) forming a number of first open cavities in a surface of a first substrate and a number of second open cavities in a surface of a second substrate corresponding to the first open cavities; (ii) forming an actuator/sensor layer including a number of MEMS devices with electrically conductive regions therein; (iii) bonding the first substrate and the second substrate to the actuator/sensor layer so that at least one of the number of the first and second open cavities align with at least one of the number of MEMS devices to form a sealed cavity around the MEMS; and (iv) electrically connecting the electrically conductive regions of the MEMS device to a pad outside of the sealed cavity through an electrical interconnect. Other embodiments are also described.

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Номер записи: 22
14-06-2012 дата публикации

Method to prevent metal pad damage in wafer level package

Номер: US20120149152A1
Автор: Hsin-Ting HUANG, Hung-Hua Lin, Jung-Huei Peng, Ming-Tung Wu, Ping-Yin Liu, Shang-Ying Tsai, Yao-Te Huang, Yuan-Chih Hsieh
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure provide a method of manufacturing a microelectronic device. The method includes forming a bonding pad on a first substrate; forming wiring pads on the first substrate; forming a protection material layer on the first substrate, on sidewalls and top surfaces of the wiring pads, and on sidewalls of the bonding pad, such that a top surface of the bonding pad is at least partially exposed; bonding the first substrate to a second substrate through the bonding pad; opening the second substrate to expose the wiring pads; and removing the protection material layer.

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Номер записи: 23
14-06-2012 дата публикации

Thin Semiconductor Device Having Embedded Die Support and Methods of Making the Same

Номер: US20120149153A1
Автор: Gregory A. Miller, Jeffrey J. Frye, Xiaoyi Ding
Принадлежит: Continental Automotive Systems Inc

Ultra-thin semiconductor devices, including piezoresistive sensing elements can be formed in a wafer stack that facilitates handling many thin device dice at a wafer level. Three embodiments are provided to form the thin dice in a wafer stack using three different fabrication techniques that include anodic bonding, adhesive bonding and fusion bonding. A trench is etched around each thin die to separate the thin die from others in the wafer stack. A tether layer, also known as a tether, is used to hold thin dice or dice in a wafer stack. Such as wafer stack holds many thin dice together at a wafer level for handling and enables easier die picking in packaging processes.

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Номер записи: 24
21-06-2012 дата публикации

Forming nanometer-sized patterns by electron microscopy

Номер: US20120152902A1
Автор: Andrew P. Homyk, Axel Scherer, Sameer WALAVALKAR
Принадлежит: California Institute of Technology CalTech

A method for forming nanometer-sized patterns and pores in a membrane is described. The method comprises incorporating a reactive material onto the membrane, the reactive material being a material capable of lowering an amount of energy required for forming a pore and/or pattern by irradiating the membrane material with an electron beam, thus leading to a faster pore and/or pattern formation.

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Номер записи: 25
21-06-2012 дата публикации

Composite sacrificial structure for reliably creating a contact gap in a mems switch

Номер: US20120156820A1
Автор: Sangchae Kim
Принадлежит: RF Micro Devices Inc

The present Disclosure provides for fabrication devices and methods for manufacturing a micro-electromechanical system (MEMS) switch on a substrate. The MEMS fabrication device may have a first and second sacrificial layer that form the mold of an actuation member. The actuation member is formed over the first and second sacrificial layers to manufacture a MEMS switch from the MEMS fabrication device.

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Номер записи: 26
28-06-2012 дата публикации

Mirror device, mirror array, optical switch, mirror device manufacturing method, and mirror substrate manufacturing method

Номер: US20120162736A1
Автор: HIROFUMI Morita, Hiromu Ishii, Johji Yamaguchi, Katsuyuki Machida, Kunihiko Sasakura, Makoto Murakami, Makoto Sato, Shingo Uchiyama, Shuichiro Inagaki
Принадлежит: Individual

A mirror device includes a mirror ( 153 ) which is supported to be pivotable with respect to a mirror substrate ( 151 ), a driving electrode ( 103 - 1 - 103 - 4 ) which is formed on an electrode substrate ( 101 ) facing the mirror substrate, and an antistatic structure ( 106 ) which is arranged in a space between the mirror and the electrode substrate. This structure can fix the potential of the lower surface of the mirror and suppress drift of the mirror by applying a second potential to the antistatic structure.

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Номер записи: 27
28-06-2012 дата публикации

Mirror device, mirror array, optical switch, mirror device manufacturing method, and mirror substrate manufacturing method

Номер: US20120162737A1
Автор: HIROFUMI Morita, Hiromu Ishii, Johji Yamaguchi, Katsuyuki Machida, Kunihiko Sasakura, Makoto Murakami, Makoto Sato, Shingo Uchiyama, Shuichiro Inagaki
Принадлежит: Individual

A mirror device includes a mirror ( 153 ) which is supported to be pivotable with respect to a mirror substrate ( 151 ), a driving electrode ( 103 - 1 - 103 - 4 ) which is formed on an electrode substrate ( 101 ) facing the mirror substrate, and an antistatic structure ( 106 ) which is arranged in a space between the mirror and the electrode substrate. This structure can fix the potential of the lower surface of the mirror and suppress drift of the mirror by applying a second potential to the antistatic structure.

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Номер записи: 28
05-07-2012 дата публикации

Micromechanical component and manufacturing method for a micromechanical component

Номер: US20120167681A1
Автор: Jochen Reinmuth
Принадлежит: ROBERT BOSCH GMBH

A micromechanical component having a fixing point and a seismic weight, which is connected to the fixing point by at least one spring and is made at least partially out of a first material, the first material being a semiconductor material, the seismic weight being additionally made out of at least one second material, and the second material having a higher density than the first material. In addition, a manufacturing method for a micromechanical component is provided, having the steps of forming a seismic weight at least partially out of a first material, the first material being a semiconductor material, connecting the seismic weight to a fixing point of the micromechanical component, using at least one spring, and forming the seismic weight from the first material and at least one second material, which has a higher density than the first material.

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Номер записи: 29
19-07-2012 дата публикации

Method for mems device fabrication and device formed

Номер: US20120181638A1
Автор: Joseph Damian Gordon Lacey, Mickael Renault, Thomas L. Maguire, Vikram Joshi
Принадлежит: Cavendish Kinetics Inc

The present invention generally relates to methods for producing MEMS or NEMS devices and the devices themselves. A thin layer of a material having a lower recombination coefficient as compared to the cantilever structure may be deposited over the cantilever structure, the RF electrode and the pull-off electrode. The thin layer permits the etching gas introduced to the cavity to decrease the overall etchant recombination rate within the cavity and thus, increase the etching rate of the sacrificial material within the cavity. The etchant itself may be introduced through an opening in the encapsulating layer that is linearly aligned with the anchor portion of the cantilever structure so that the topmost layer of sacrificial material is etched first. Thereafter, sealing material may seal the cavity and extend into the cavity all the way to the anchor portion to provide additional strength to the anchor portion.

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Номер записи: 30
26-07-2012 дата публикации

Mems/moems sensor design

Номер: US20120186338A1
Автор: Pierre Bonnat
Принадлежит: Individual

A MEMS/MOEMS sensor and method for using such sensor to detect a person's breath or other fluid for purposes of controlling a user interface of an electronic device.

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Номер записи: 31
16-08-2012 дата публикации

Micro-electromechanical system devices and methods of making micro-electromechanical system devices

Номер: US20120205753A1
Автор: Andrew J. Minnick, Charles W. Blackmer, Kenneth D. Brennan, Mollie K. Devoe, Scott G. Adams
Принадлежит: Kionix Inc

A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first, second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.

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Номер записи: 32
16-08-2012 дата публикации

MEMS and Protection Structure Thereof

Номер: US20120205808A1
Автор: Bang-Chiang Lan, Chao-An Su, Chien-Hsin Huang, Hui-Min Wu, Li-Che Chen, Meng-Jia Lin, Min Chen, Ming-I Wang, Tzung-Han Tan, Tzung-I Su
Принадлежит: United Microelectronics Corp

A protection structure of a pad is provided. The pad is disposed in a dielectric layer on a semiconductor substrate and the pad includes a connection region and a peripheral region which encompasses the connection region. The protection structure includes at least a barrier, an insulation layer and a mask layer. The barrier is disposed in the dielectric layer in the peripheral region. The insulation layer is disposed on the dielectric layer. The mask layer is disposed on the dielectric layer and covers the insulation layer and the mask layer includes an opening to expose the connection region of the pad.

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Номер записи: 33
16-08-2012 дата публикации

Method for manufacturing structure

Номер: US20120208130A1
Автор: Takahiko Yoshizawa
Принадлежит: Seiko Epson Corp

A method for manufacturing a structure includes forming a layer of photosensitive material above a substrate, disposing a mask above the layer of photosensitive material, shielding a portion of the layer of photosensitive material other than a first region of the layer of photosensitive material, exposing the first region, moving the mask along a surface of the layer of photosensitive material, shielding a portion of the layer of photosensitive material other than a second region that is a portion of the first region and a third region that is adjacent to the second region and is a portion of the region shielded in the step, and exposing the second region and the third region, and developing the layer of photosensitive material to form surfaces in the layer of photosensitive material at different heights along a direction in which the mask is moved.

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Номер записи: 34
30-08-2012 дата публикации

Polyhedral oligomeric silsesquioxane compositions, methods of using these compositions, and structures including these compositions

Номер: US20120219793A1
Автор: Nathan Fritz, Paul Kohl, Rajarshi Saha
Принадлежит: Georgia Tech Research Corp

Embodiments of the present disclosure include functionalized polyhedral oligomeric silsesquioxane compositions or mixtures, methods of using functionalized polyhedral oligomeric silsesquioxane compositions, structures including functionalized polyhedral oligomeric silsesquioxane, and the like.

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Номер записи: 35
06-09-2012 дата публикации

MEMS Sensor with Movable Z-Axis Sensing Element

Номер: US20120223726A1
Автор: Michael W. Judy, Xin Zhang
Принадлежит: Analog Devices Inc

A MEMS sensor includes a substrate and a MEMS structure coupled to the substrate. The MEMS structure has a mass movable with respect to the substrate. The MEMS sensor also includes a reference structure electrically coupled to the mass of the MEMS sensor. The reference structure is used to provide a reference to offset any environmental changes that may affect the MEMS sensor in order to increase the accuracy of its measurement.

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Номер записи: 36
06-09-2012 дата публикации

Mems-microphone

Номер: US20120224726A1
Автор: Andreas Beer, Anton Leidl, Matthias Jungkunz, Wolfgang Pahl
Принадлежит: EPCOS AG

A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.

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Номер записи: 37
20-09-2012 дата публикации

Mems sensor

Номер: US20120235039A1
Автор: Atsushi Onoe, Kenjiro Fujimoto, Takahiro Kawano, Takanori Maeda
Принадлежит: Pioneer Corp

A MEMS sensor has a frame portion 2 formed in a rectangular frame shape and a convexoconcave shaped membrane 3 that is constructed within the frame portion 2, the convexoconcave shape of the membrane 3 extend to two direction where a concave and a convex are orthogonal to each other, and square concave portions 3 a and square convex portions 3 b are disposed in a web shape within a whole in-plane area of the membrane 3.

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Номер записи: 38
20-09-2012 дата публикации

Driving apparatus

Номер: US20120235540A1
Автор: Jun Suzuki
Принадлежит: Pioneer Corp

A driving apparatus ( 100 ) is provided with: a base part ( 110 ); a stage part ( 130 ) on which a driven object ( 150 ) is mounted and which can be displaced; an elastic part ( 120 ) which has elasticity for displacing the stage part along one direction (Y axis); and an applying part ( 110 ) for applying to the base part microvibration for displacing the stage part ( 130 ) such that the stage part ( 130 ) resonates along the one direction (Y axis) at a resonance frequency determined by the elastic part ( 120 ) and the stage part ( 130 ), the microvibration is non-directional microvibration as non-directional vibrational energy.

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Номер записи: 39
04-10-2012 дата публикации

Micromechanical Component and Manufacturing Method for a Micromechanical Component

Номер: US20120248931A1
Автор: Jochen Reinmuth
Принадлежит: ROBERT BOSCH GMBH

A micromechanical component is described having a substrate which has at least one stator electrode fixedly mounted with respect to the substrate, a movable mass having at least one actuator electrode fixedly mounted with respect to the movable mass, and at least one spring via which the movable mass is displaceable. The movable mass is structured from the substrate with the aid of at least one separating trench, at least one outer stator electrode spans at least one section of the at least one separating trench and/or of the movable mass, the at least one actuator electrode protrudes between the at least one outer stator electrode and the substrate, and at least one inner stator electrode protrudes between the at least one actuator electrode and the substrate. A related manufacturing method is also described for a micromechanical component.

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Номер записи: 40
25-10-2012 дата публикации

Low temperature bi-cmos compatible process for mems rf resonators and filters

Номер: US20120270351A1
Автор: Christopher Vincent Jahnes, James Francis Ziegler, James Louis Speidell, Jennifer Louise Lund, Kevin Kok Chan, Kevin Shawn Petrarca, Leena Paivikki Buchwalter, Timothy Joseph Dalton
Принадлежит: International Business Machines Corp

A method of removal of a first and second sacrificial layer wherein an O 2 plasma or an O 2 -containing environment is introduced to a cavity and a gap region through a plurality of via holes in a cavity capping material.

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Номер записи: 41
15-11-2012 дата публикации

Nanoelectromechanical Structures Exhibiting Tensile Stress And Techniques For Fabrication Thereof

Номер: US20120286377A1
Автор: Conal E. Murray, Fei Liu, Josephine B. Chang, Michael A. Guillorn, Sebastian U. Engelmann
Принадлежит: International Business Machines Corp

Improved nano-electromechanical system devices and structures and systems and techniques for their fabrication. In one embodiment, a structure comprises an underlying substrate separated from first and second anchor points by first and second insulating support points, respectively. The first and second anchor points are joined by a beam. First and second deposition regions overlie the first and second anchor points, respectively, and the first and second deposition regions exert compression on the first and second anchor points, respectively. The compression on the first and second anchor points causes opposing forces on the beam, subjecting the beam to a tensile stress. The first and second deposition regions suitably exhibit an internal tensile stress having an achievable maximum varying with their thickness, so that the tensile stress exerted on the beam depends at least on part on the thickness of the first and second deposition regions.

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Номер записи: 42
15-11-2012 дата публикации

Processes and mounting fixtures for fabricating electromechanical devices and devices formed therewith

Номер: US20120286380A1
Автор: Navid Yazdi, Weibin Zhu, Yafan Zhang
Принадлежит: EVIGIA SYSTEMS

Processes and fixtures for producing electromechanical devices, and particularly three-dimensional electromechanical devices such as inertial measurement units (IMUs), through the use of a fabrication process and a three-dimensional assembly process that entail joining single-axis device-IC chips while positioned within a mounting fixture that maintains the orientations and relative positions of the chips during the joining operation.

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Номер записи: 43
22-11-2012 дата публикации

Method of fabricating liquid film, method of arranging nano particles and substrate having liquid thin film fabricated using the same

Номер: US20120292185A1
Автор: Byung Do Oh, Hyeon Jin Shin, JaeYoung Choi, JaiYong Han, Seonmi YOON
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A method of fabricating a liquid film is provided. The method comprises the steps of applying hydrophilic liquid onto a substrate with an electrode formed thereunder, covering the hydrophilic liquid with a protection film comprising hydrophobic liquid, dispersing surfactant for reducing the surface tension between the hydrophilic liquid and the protection film, and applying voltage to the hydrophilic liquid and the electrode to wet the substrate with the hydrophilic liquid. With the surfactant and the electro-wetting principle, a contact angle between the hydrophilic liquid and the substrate is controlled. The liquid film having a uniform thickness in nano size is thus formed on the substrate. The protection film prevents the evaporation of the liquid film in the air to thereby secure the stability of the liquid film.

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Номер записи: 44
22-11-2012 дата публикации

Method for manufacturing micro-structure and optically patternable sacrificial film-forming composition

Номер: US20120292286A1
Автор: Hideyoshi Yanagisawa, Yoshinori Hirano
Принадлежит: Shin Etsu Chemical Co Ltd

A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, and etching away the sacrificial film pattern through an aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) coating a substrate with a composition comprising a cresol novolac resin, a crosslinker, and a photoacid generator, (B) heating to form a sacrificial film, (C) patternwise exposure, (D) development to form a sacrificial film pattern, and (E) forming crosslinks within the cresol novolac resin.

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Номер записи: 45
22-11-2012 дата публикации

Nonvolatile nano-electromechanical system device

Номер: US20120293236A1
Автор: David J. Frank, Guy Cohen
Принадлежит: International Business Machines Corp

A nonvolatile nano-electromechanical system device is provided and includes a cantilever structure, including a beam having an initial shape, which is supported at one end thereof by a supporting base and a beam deflector, including a phase change material (PCM), disposed on a portion of the beam in a non-slip condition with a material of the beam, the PCM taking one of an amorphous phase or a crystalline phase and deflecting the beam from the initial shape when taking the crystalline phase.

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Номер записи: 46
29-11-2012 дата публикации

Device for measuring environmental forces and method of fabricating the same

Номер: US20120297884A1
Автор: Naresh Venkata Mantravadi, Sisira Kankanam Gamage
Принадлежит: General Electric Co

A device for measuring environmental forces, and a method for fabricating the same, is disclosed that comprises a device wafer, the device wafer comprising a first device layer separated from a second device layer by a first insulation layer. The first device wafer is bonded to an etched substrate wafer to create a suspended diaphragm and boss, the flexure of which is determined by an embedded sensing element.

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Номер записи: 47
06-12-2012 дата публикации

Plate, Transducer and Methods for Making and Operating a Transducer

Номер: US20120308053A1
Автор: Alfons Dehe
Принадлежит: INFINEON TECHNOLOGIES AG

A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.

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Номер записи: 48
13-12-2012 дата публикации

Method of preventing stiction of mems devices

Номер: US20120313189A1
Автор: Kegang Huang, Martin Lim, Xiang Li
Принадлежит: InvenSense Inc

A method and apparatus are disclosed for reducing stiction in MEMS devices. The method comprises patterning a CMOS wafer to expose Titanium-Nitride (TiN) surface for a MEMS stop and patterning the TiN to form a plurality of stop pads on the top metal aluminum surface of the CMOS wafer. The method is applied for a moveable MEMS structure bonded to a CMOS wafer. The TiN surface and/or plurality of stop pads minimize stiction between the MEMS structure and the CMOS wafer. Further, the TiN film on top of aluminum electrode suppresses the formation of aluminum hillocks which effects the MEMS structure movement.

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Номер записи: 49
13-12-2012 дата публикации

Semiconductor apparatus

Номер: US20120313246A1
Автор: Ching-Hou SU, Chyi-Tsong Ni, Ting-Ying CHIEN, Yi Hsun CHIU
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The disclosure relates to integrated circuit fabrication, and more particularly to a semiconductor apparatus with a metallic alloy. An exemplary structure for an apparatus comprises a first silicon substrate; a second silicon substrate; and a contact connecting each of the first and second substrates, wherein the contact comprises a Ge layer adjacent to the first silicon substrate, a Cu layer adjacent to the second silicon substrate, and a metallic alloy between the Ge layer and Cu layer.

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Номер записи: 50
20-12-2012 дата публикации

Normally closed microelectromechanical switches (mems), methods of manufacture and design structures

Номер: US20120318648A1
Автор: Anthony K. Stamper, Dawn D. HALL, Mark C.H. Lamorey
Принадлежит: International Business Machines Corp

Normally closed (shut) micro-electro-mechanical switches (MEMS), methods of manufacture and design structures are provided. A method of forming a micro-electrical-mechanical structure (MEMS), includes forming a plurality of electrodes on a substrate, forming a beam structure in electrical contact with a first of the electrodes, and bending the beam structure with a thermal process. The method further includes forming a cantilevered electrode extending over an end of the bent beam structure, and returning the beam structure to its original position, which will contact the cantilevered electrode in a normally closed position.

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Номер записи: 51
20-12-2012 дата публикации

Micro-electro-mechanical system (mems) and related actuator bumps, methods of manufacture and design structures

Номер: US20120319527A1
Автор: Anthony K. Stamper, Christopher V. Jahnes
Принадлежит: International Business Machines Corp

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming a wiring layer on a substrate comprising actuator electrodes and a contact electrode. The method further includes forming a MEMS beam above the wiring layer. The method further includes forming at least one spring attached to at least one end of the MEMS beam. The method further includes forming an array of mini-bumps between the wiring layer and the MEMS beam.

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Номер записи: 52
27-12-2012 дата публикации

Microfabricated elastomeric valve and pump systems

Номер: US20120328834A1
Автор: Axel Scherer, Hou-Pu Chou, Marc A. Unger, Stephen R. Quake, Todd A. Thorsen
Принадлежит: California Institute of Technology CalTech

A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

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Номер записи: 53
03-01-2013 дата публикации

Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component

Номер: US20130001711A1
Автор: Armin Scharping, Christoph Schelling, Frank Henning, Hubert Benzel
Принадлежит: Individual

A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.

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Номер записи: 54
10-01-2013 дата публикации

Alignment methods in fluid-filled mems displays

Номер: US20130010341A1
Автор: Jasper Lodewyk Steyn, Jignesh Gandhi, John J. Fijol, Nesbitt W. Hagood, Richard S. Payne
Принадлежит: Pixtronix Inc

This application relates to a display including a first layer of material including a first aperture having at least one side, a first substrate separated from the first layer of material by a gap, where the first substrate is arranged to pass through a portion of light emitted from a light source into the gap. The display further includes a movable shutter arranged within the gap, where the shutter is movable to at least a first position and a second position, to obstruct passage of the portion of light through the first aperture at the first position. The movable shutter has a first edge, and in the first position, the movable shutter is aligned with the first aperture such that the first edge extends a first length past the at least one side of the first aperture.

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Номер записи: 55
24-01-2013 дата публикации

Block copolymer for manufacturing nanowire and method for manufacturing thereof

Номер: US20130020278A1
Автор: Byoungman BANG, Hyun-Kon Song, Jaephil Cho, Sooiin PARK
Принадлежит: UNIST Academy Industry Research Corp

A block copolymer for manufacturing a nanowire and a method of manufacturing the same are disclosed. The block copolymer and the method of manufacturing a nanowire using the same are used to fabricate a nanowire having a diameter of less than or equal to 30 nm and a porous nanowire having a diameter within the same range and pores with a diameter of less than or equal to 10 nm.

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Номер записи: 56
31-01-2013 дата публикации

Lid, fabricating method thereof, and mems package made thereby

Номер: US20130028450A1
Автор: Ivan Micallef, Kun-Chen Tsai, Mario Cortese, Mark A. Azzopardi, Shih-Ping Hsu
Принадлежит: STMICROELECTRONICS SRL, Unimicron Technology Corp

A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon, respectively, wherein a through cavity extends through the first board and the first and second metal layers; a second board with opposite third and fourth surfaces; an adhesive layer sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess; and a first conductor layer coating the bottom and the side surfaces of the recess.

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Номер записи: 57
31-01-2013 дата публикации

Monolithic Silicon Microphone

Номер: US20130028459A1
Автор: Yunlong Wang
Принадлежит: Individual

A monolithic silicon microphone including a first backplate, a second backplate and a diaphragm displaced between said first backplate and said second backplate. Said first backplate is supported by a silicon substrate with one or more perforation holes. Said second substrate is attached to a perforated plate which itself is supported on said substrate. Said monolithic silicon microphone has integrated signal conditioning circuit, and is said diaphragm, said first backplate, said second backplate, and said signal conditioning circuit are electrically interconnected. Signals from said diaphragm, said first backplate, and said second backplate are fed into said signal conditioning circuit, and are amplified differentially.

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Номер записи: 58
31-01-2013 дата публикации

Method for making a reinforced silicon micromechanical part

Номер: US20130029157A1
Автор: Nakis Karapatis
Принадлежит: Montres Breguet SA

A method of fabricating a reinforced silicon micromechanical part includes: micromachining the part, or a batch of parts in a silicon wafer; forming a silicon dioxide layer over the entire surface of the part, in one or plural operations, so as to obtain a thickness of silicon dioxide that is at least five times greater than the thickness of native silicon dioxide; and removing the silicon dioxide layer by etching.

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Номер записи: 59
31-01-2013 дата публикации

Method of manufacturing liquid ejection head substrate

Номер: US20130029437A1
Автор: Masaya Uyama
Принадлежит: Canon Inc

A liquid ejection head substrate including a silicon substrate having a liquid supply port as hollow and slots as through holes connecting the hollow and a liquid channel arranged opposite sides of the substrate. The method includes etching the substrate to form the hollow; forming a first resist on the hollow; etching the first resist on the bottom of the hollow under conditions of securing an equal etching rate to both the silicon substrate and the first resist; forming a second resist on the hollow; patterning the second resist into an etching mask; and etching the substrate using the etching mask to form the through holes.

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Номер записи: 60
07-02-2013 дата публикации

Metal thin shield on electrical device

Номер: US20130032385A1
Автор: Mario Francisco Velez, Peng Cheng Lin
Принадлежит: Qualcomm Mems Technologies Inc

This disclosure provides systems and methods for forming a metal thin film shield over a thin film cap to protect electromechanical systems devices in a cavity beneath. In one aspect, a dual or multi layer thin film structure is used to seal a electromechanical device. For example, a metal thin film shield can be mated over an oxide thin film cap to encapsulate the electromechanical device and prevent degradation due to wafer thinning, dicing and package assembly induced stresses, thereby strengthening the survivability of the electromechanical device in the encapsulated cavity. During redistribution layer processing, a metal thin film shield, such as a copper layer, is formed over the wafer surface, patterned and metalized.

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Номер записи: 61
07-02-2013 дата публикации

Method of Fabricating an Integrated Device

Номер: US20130034958A1
Автор: Alexander Payne, Gregory Beach, James Hunter, Joshua Lu
Принадлежит: Silicon Light Machines Inc

A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

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Номер записи: 62
28-02-2013 дата публикации

Glass as a substrate material and a final package for mems and ic devices

Номер: US20130050227A1
Автор: David William Burns, Justin Phelps Black, Kurt Edward Petersen, Nicholas Ian Buchan, Philip Jason Stephanou, Ravindra V. Shenoy, Srinivasan Kodaganallur Ganapathi
Принадлежит: Qualcomm Mems Technologies Inc

This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.

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Номер записи: 63
14-03-2013 дата публикации

Electromechanical transducer

Номер: US20130063530A1
Автор: Kusunoki Higashino, Shinya Matsuda
Принадлежит: KONICA MINOLTA INC

An electromechanical transducer ( 1 ) has a pressurizing chamber ( 21 ) and a side-chamber ( 23 ) formed in a plate ( 11 ). On a driven film ( 13 ) forming the upper wall surface ( 21 a ) of the pressurizing chamber ( 21 ) and the side-chamber ( 23 ), a lower electrode ( 33 ), a driving member, and an upper electrode ( 35 ) are formed in this order. The driving member is composed of an operation section ( 31 p ) located over the pressurizing chamber ( 21 ), and an extended section ( 31 a ) extending from the operation section ( 31 p ) to over the side-chamber ( 23 ). The side-chamber ( 23 ) has a smaller width than the pressurizing chamber ( 21 ) in a second direction perpendicular to a first direction in which the side-chamber ( 23 ) is located beside the pressurizing chamber ( 21 ). The extended section ( 31 a ) of the driving member has a smaller width than the side-chamber ( 23 ) in the second direction.

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Номер записи: 64
28-03-2013 дата публикации

Rotationally deployed actuator devices

Номер: US20130077947A1
Автор: Robert J. Calvet, Roman C. Gutierrez
Принадлежит: DigitalOptics Corp MEMS

A method for making an actuator device includes forming a substantially planar structure, including an outer frame with a latch foot, a fixed frame coupled to the outer frame, a latch mass coupled to the fixed frame, a latch block coupled to the latch mass by a latch block flexure, a moveable frame coupled to the outer frame, and an actuator incorporating a plurality of interdigitated teeth alternately attached to the fixed and moving frames. For operation, the latch mass is rotated downward until an upper surface of the latch block is disposed below and held in latching contact with a lower surface of the latch foot by the latch block flexure.

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Номер записи: 65
28-03-2013 дата публикации

Surface mount actuator

Номер: US20130077948A1
Автор: Roman C. Gutierrez
Принадлежит: DigitalOptics Corp MEMS

A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).

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Номер записи: 66
11-04-2013 дата публикации

Micro-electromechanical semiconductor component

Номер: US20130087865A1
Автор: Arnd Ten Have
Принадлежит: ELMOS SEMICONDUCTOR SE

The micro-electromechanical semiconductor component is provided with a semiconductor substrate in which a cavity is formed, which is delimited by lateral walls and by a top and a bottom wall. In order to form a flexible connection to the region of the semiconductor substrate, the top or bottom wall is provided with trenches around the cavity, and bending webs are formed between said trenches. At least one measuring element that is sensitive to mechanical stresses is formed within at least one of said bending webs. Within the central region surrounded by the trenches, the top or bottom wall comprises a plurality of depressions reducing the mass of the central region and a plurality of stiffening braces separating the depressions.

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Номер записи: 67
18-04-2013 дата публикации

Bond pad structure and fabricating method thereof

Номер: US20130093104A1
Автор: Chien-Hsin Huang, Hui-Min Wu, Kuan-Yu Wang, Kun-Che Hsieh, Ming-I Wang
Принадлежит: United Microelectronics Corp

A bond pad structure comprises an interconnection structure and an isolation layer. The dielectric layer has an opening and a metal pad. The isolation layer is disposed on the interconnection structure and extends into the opening until it is in contact with the metal pad, whereby the sidewalls of the opening is blanketed by the isolation layer, and a portion of the metal pad is exposed from the opening.

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Номер записи: 68
02-05-2013 дата публикации

Semiconductor structure

Номер: US20130105920A1
Автор: Anthony K. Stamper, Daniel R. Miga, Russell T. Herrin
Принадлежит: International Business Machines Corp

Micro-Electro-Mechanical System (MEMS) structures, metrology structures and methods of manufacture are disclosed. The method includes forming one or metrology structure, during formation of a device in a chip area. The method further includes venting the one or more metrology structure after formation of the device.

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Номер записи: 69
16-05-2013 дата публикации

Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method

Номер: US20130119492A1
Автор: Anton Leidl, Gregor Feiertag, Hans Krueger, Wolfgang Pahl
Принадлежит: EPCOS AG

The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

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Номер записи: 70
23-05-2013 дата публикации

Air cavity package configured to electrically couple to a printed circuit board and method of providing same

Номер: US20130128487A1
Автор: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
Принадлежит: UBOTIC INTELLECTUAL PROPERTY CO Ltd

In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole. The one or more second electrically conductive leads can be configured to couple to the printed circuit board at a first side of the one or more sides of the base. Other embodiments are disclosed.

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Номер записи: 71
30-05-2013 дата публикации

Method for fabricating a microarray of soft materials

Номер: US20130136863A1
Автор: Hiroaki Onoe, Kaori Kuribayashi, Satoshi Hiyama, Shoji Takeuchi
Принадлежит: NTT DOCOMO INC

A method for fabricating a microarray of plural soft materials includes: vapor-depositing a first layer poly(para-xylylene) resin on a substrate, forming a first micro pattern in the poly(para-xylylene) resin; obtaining a substrate including a first microarray formed by pouring a first soft material solution, freeze-drying the first soft material to obtain a micro-arrayed substrate of the freeze-dried first soft material; vapor-depositing a second layer poly(para-xylylene) resin on the micro-arrayed substrate of the freeze-dried first soft material, forming a second micro pattern placed differently from the first micro pattern by penetrating the poly(para-xylylene) resin of the first and second layers, forming a second microarray on the substrate by pouring a second soft material solution; and forming a microarray of the first and second soft materials on the substrate by peeling off the poly(para-xylylene) resin of the first and second layers.

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Номер записи: 72
06-06-2013 дата публикации

Pressure sensor having nanostructure and manufacturing method thereof

Номер: US20130140611A1
Автор: Jeong Hoon Lee, Jin Seok Kim, Jun-Kyo Francis SUH, Sung Chul Kang
Принадлежит: Korea Advanced Institute of Science and Technology KAIST

The present disclosure relates to a pressure sensor having a nanostructure and a method for manufacturing the same. More particularly, it relates to a pressure sensor having a nanostructure attached on the surface of the pressure sensor and thus having improved sensor response time and sensitivity and a method for manufacturing the same. The pressure sensor according to the present disclosure having a nanostructure includes: a substrate; a source electrode and a drain electrode arranged on the substrate with a predetermined spacing; a flexible sensor layer disposed on the source electrode and the drain electrode; and a nanostructure attached on the surface of the flexible sensor layer and having nanosized wrinkles.

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Номер записи: 73
06-06-2013 дата публикации

Mems acoustic transducer and method for fabricating the same

Номер: US20130140655A1
Автор: Chien-Nan YEH, Chin-Hung Wang, Hsin-Li Lee, Jien-Ming Chen, Li-Chi Pan, Tzong-Che Ho
Принадлежит: Industrial Technology Research Institute ITRI

A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.

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Номер записи: 74
06-06-2013 дата публикации

Micro structure, micro actuators, method of fabricating micro structure and micro actuators

Номер: US20130141769A1
Автор: Jae-Ik Lee, Jongbaeg Kim, Jungwook CHOI, Youngkee EUN, Youngsup SONG
Принадлежит: Industry Academic Cooperation Foundation of Yonsei University

A method for fabricating a micro-structure is provided, which can simply and easily fabricate the micro-structure by a batch process of directly forming a highly aligned nano-material array on a micro-structure to be used as an adhesive material during plastic deformation of the micro-structure without the use of existing complicated fabrication process.

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Номер записи: 75
13-06-2013 дата публикации

Space curve mesh driving pair and polyhedral space curve mesh transmission

Номер: US20130145876A1
Автор: Jiang Ding, Yangzhi Chen, Zhen Chen
Принадлежит: South China University of Technology SCUT

A space curve mesh driving pair and a polyhedral space curve mesh transmission are disclosed. Said space curve mesh driving pair consists of a driving wheel and a driven wheel. Axes of the driving wheel and the driven wheel are intersected at an angle of 0°˜180°, and power transmission is realized by continuous mesh between the driving tines and the driven tines; a number of driving tines are provided on said driving wheel, and a number of driven tines are provided on the driven wheel; the driving tines are uniformly arranged on an end face of a cylinder of the driving wheel, and the driven tines are uniformly arranged on the circumference of a cylindrical surface of the driven wheel. Said polyhedral space curve mesh transmission consists of an above-mentioned space curve mesh driving pair. Motion is input from an input end, and is passed through a number of pace curve mesh driving pairs to realize the speed change, then is output from one or more output ends. Wherein, the space curve mesh driving pair is the core of the transmission. The invention has the advantages of compact structure, small size, light weight, stable transmission and flexible operation, and can be widely used in micro-mechanism field.

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Номер записи: 76
13-06-2013 дата публикации

Three-dimensional, ultrasonic transducer arrays, methods of making ultrasonic transducer arrays, and devices including ultrasonic transducer arrays

Номер: US20130146995A1
Автор: Jingkuang Chen
Принадлежит: STC UNM

Systems, apparatus, and associated methods of forming the systems and/or apparatus may include imaging devices that may comprise multiple arrays of ultrasonic transducer elements for use in a variety of applications. These multiple arrays of ultrasonic transducer elements can be arranged to form a three-dimensional imaging device. Non-coplanar arrays of ultrasonic transducer elements can be coupled together. These imaging devices may be used as medical imaging devices. Additional apparatus, systems, and methods are disclosed.

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Номер записи: 77
20-06-2013 дата публикации

Device and method for manufacturing the same

Номер: US20130156657A1
Автор: Tomohiro Saito
Принадлежит: Canon Inc

It is an object of this invention to prevent a resistor material and an electrode material from diffusing and suppress variation in electric resistance. In a device including a plurality of metal layers of different compositions on a substrate and a second structure made of a material, such as glass paste, requiring a firing process at the time of formation, an intermediate layer is formed between a first metal layer and a second metal layer forming the first structure. The intermediate layer is of an intermetallic compound including one or more metallic elements in the first metal layer and one or more metallic elements in the second metal layer. The melting point of the intermetallic compound is higher than a firing temperature when the second structure is formed, and the intermetallic compound is produced at a temperature higher than the firing temperature for forming the second structure.

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Номер записи: 78
04-07-2013 дата публикации

Micro-electro-mechanical system (mems) capacitive ohmic switch and design structures

Номер: US20130168783A1
Автор: Anthony K. Stamper, Hanyi Ding, Qizhi Liu
Принадлежит: International Business Machines Corp

A micro-electro-mechanical system (MEMS), methods of forming the MEMS and design structures are provided. The method comprises forming a coplanar waveguide (CPW) comprising a signal electrode and a pair of electrodes on a substrate. The method comprises forming a first sacrificial material over the CPW, and a wiring layer over the first sacrificial material and above the CPW. The method comprises forming a second sacrificial material layer over the wiring layer, and forming insulator material about the first sacrificial material and the second sacrificial material. The method comprises forming at least one vent hole in the insulator material to expose portions of the second sacrificial material, and removing the first and second sacrificial material through the vent hole to form a cavity structure about the wiring layer and which exposes the signal line and pair of electrodes below the wiring layer. The vent hole is sealed with sealing material.

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Номер записи: 79
04-07-2013 дата публикации

Semiconductor package substrate and method, in particular for mems devices

Номер: US20130170166A1
Автор: Federico Giovanni Ziglioli, Giovanni Graziosi, Mario Francesco Cortese
Принадлежит: STMICROELECTRONICS SRL

A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.

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Номер записи: 80
25-07-2013 дата публикации

Micro-Electro-Mechanical System Device, Out-of-Plane Sensor and Method for Making Micro-Electro-Mechanical System Device

Номер: US20130186201A1
Автор: Chuan Wei WANG, Sheng-Ta Lee
Принадлежит: PixArt Imaging Inc

The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a mass including a main body and two capacitor plates located at the two sides of the main body and connected with the main body, the two capacitor plates being at different elevation levels; an upper electrode located above one of the two capacitor plates, forming one capacitor therewith; and a lower electrode located below the other of the two capacitor plates, forming another capacitor therewith, wherein the upper and lower electrodes are misaligned with each other in a horizontal direction.

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Номер записи: 81
25-07-2013 дата публикации

Microfluidic device with a chamber for storing a liquid

Номер: US20130186512A1
Автор: Christian Dorrer
Принадлежит: ROBERT BOSCH GMBH

A microfluidic device has a chamber for storing a liquid. The chamber includes at least in part a hydrophobic surface on an internal wall.

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Номер записи: 82
08-08-2013 дата публикации

Micromechanical component and method for the manufacture of same

Номер: US20130200473A1
Автор: Andreas Scheurle, Jochen Reinmuth, Johannes Classen
Принадлежит: ROBERT BOSCH GMBH

A method for manufacturing a micromechanical component is described in which a trench etching process and a sacrificial layer etching process are carried out to form a mass situated movably on a substrate. The movable mass has electrically isolated and mechanically coupled subsections of a functional layer. A micromechanical component having a mass situated movably on a substrate is also described.

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Номер записи: 83
15-08-2013 дата публикации

Single-axis flexure bearing configurations

Номер: US20130207328A1
Автор: Mohammad Olfatnia, Shorya Awtar, Siddharth Sood
Принадлежит: University of Michigan

Flexure bearing systems and configurations guide translational motion along a single-axis in micro and macro applications such as micro-electro-mechanical system (MEMS) devices including sensors and actuators like electrostatic comb-drive actuators. The flexure bearing systems and configurations described herein provide an improved constraint against movement (i.e., stiffness) of the primary mover in non-motion axes such as a bearing axis.

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Номер записи: 84
15-08-2013 дата публикации

Method and apparatus for building three-dimensional mems elements

Номер: US20130209747A1
Автор: Brian Lee WARDLE, Fabio Ferruccio Fachin, Matthew Varghese, Stefan Nikles
Принадлежит: Brian Lee WARDLE, Fabio Ferruccio Fachin, Matthew Varghese, Stefan Nikles

The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.

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Номер записи: 85
22-08-2013 дата публикации

Microfluid control device and method of manufacturing the same

Номер: US20130212882A1
Автор: Dae Sik Lee, Hyun Woo Song, Kwang Hyo Chung, Moon Youn Jung, Seon Hee Park, Seung Hwan Kim
Принадлежит: Electronics and Telecommunications Research Institute ETRI

Provided are a plastic microfluid control device having a multi-step microchannel and a method of manufacturing the same. The device includes a lower substrate, and a fluid channel substrate contacting the lower substrate and having a multi-step microchannel having at least two depths in a side coupling to the lower substrate. Thus, the device can precisely control the fluid flow by controlling capillary force in a depth direction of the channel by controlling the fluid using the multi-step microchannel having various channel depths. A multi-step micropattern is formed by repeating photolithography and transferred, thereby easily forming the multi-step microchannel having an even surface and a precisely controlled height.

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Номер записи: 86
29-08-2013 дата публикации

Microelectromechanical sensor with out-of-plane sensing and process for manufacturing a microelectromechanical sensor

Номер: US20130220016A1
Автор: Barbara Simoni, Carlo Valzasina
Принадлежит: STMICROELECTRONICS SRL

A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate.

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Номер записи: 87
29-08-2013 дата публикации

Three-dimensional digital microfluidic system

Номер: US20130220810A1
Автор: Gary Chorng-Jyh Wang
Принадлежит: Individual

A three-dimensional digital microfluidic system comprises a first plate with a first electrode, a second plate with a second electrode, and a microfluidic drop in between the first and the second electrode. The electrodes are able to be actuated in sequence such that the microfluidic drop is able to be transported. A bridge plate is able to be included.

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Номер записи: 88
12-09-2013 дата публикации

Method for coating micromechanical parts with dual diamond coating

Номер: US20130234165A1
Автор: Beat Gilomen, David Richard, Detlef Steinmuller, Doris Steinmuller, Herwig Drexel, Slimane Gnodbane, Stewes Bourban
Принадлежит: Swatch Group Research and Development SA

Method for coating micromechanical components of a micromechanical system, in particular a watch movement, comprising: providing a substrate ( 4 ) component to be coated; providing said component with a first diamond coating ( 2 ) doped with boron; providing said component with a second diamond coating ( 3 ); wherein: said second diamond coating ( 3 ) is provided by CVD in a reaction chamber; during CVD deposition, during the last portion of the growth process, a controlled increase of the carbon content within the reaction chamber is provided, thereby providing an increase of the sp2/sp3 carbon ( 6 ) bonds up to an sp2 content substantially between 1% and 45%. Corresponding micromechanical components are also provided.

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Номер записи: 89
19-09-2013 дата публикации

Nanoporous to Solid Tailoring of Materials via Polymer CVD into Nanostructured Scaffolds

Номер: US20130244008A1
Автор: Ayse Asatekin, Brian Lee WARDLE, Fabio Fachin, Karen K. Gleason
Принадлежит: Massachusetts Institute of Technology

Method for tailoring permeability of materials. The method establishes a pattern of vertically aligned nanowires on a substrate and a physical shadow mask is provided to protect selected features of the pattern. A polymer is selectively infiltrated, using chemical vapor disposition, into interstices in the vertically aligned carbon nanotubes to establish a selected permeability. A cover over the infiltrated vertically aligned nanowires is provided.

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Номер записи: 90
03-10-2013 дата публикации

Microfluidic component, reactor comprising a plurality of such components, and method for producing same

Номер: US20130255822A1
Автор: Martin Wichert, Silvio Kraus
Принадлежит: INSTITUT FUER MIKROTECHNIK MAINZ GMBH

A microfluidic component made of a metal sheet having a structure which includes a closed fluid line and which is formed of a structured surface of a first section of the metal sheet and an adjoining structured or unstructured surface of a second section of the metal sheet, wherein the metal sheet is folded such that the sections integrally connected to each other are located on top of each other in a surface-parallel manner. The metal sheet further includes at least one third section having a contoured edge and is moreover folded such that the third section is also supported in a surface-parallel manner and the contoured edge forms a first wall section and the adjoining structured or unstructured surface of the first or second section forms a second wall section of an open fluid line. A microfluidic reactor comprising a plurality of such microfluidic components and a method for producing such components.

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Номер записи: 91
03-10-2013 дата публикации

Physical quantity sensor and electronic apparatus

Номер: US20130256814A1
Автор: Satoru Tanaka
Принадлежит: Seiko Epson Corp

A physical quantity sensor includes: a movable body displaceable in a direction of a first axis; a fixed electrode portion disposed to face a movable electrode portion; a spring portion as a connection member connecting a fixed portion with the movable body and including a first extending portion extending from the fixed portion along a second axis crossing the direction of the first axis, a turn-around portion connected to the first extending portion, and a second extending portion extending from the turn-around portion along the second axis; and a wall portion extending from the fixed portion and disposed, in plan view, outside the first extending portion and the turn-around portion of the spring portion. The spring portion and the wall portion are electrically connected.

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Номер записи: 92
10-10-2013 дата публикации

Package structure and packaging method

Номер: US20130266774A1
Автор: Pinyen Lin, Yu-Fu Kang
Принадлежит: Touch Micro System Technology Inc

A package structure and a packaging method for manufacturing the package structure are provided. The package structure comprises a cover wafer, a device wafer and a bonding material. The cover wafer has an optical element, and a surface of the cover wafer is defined with a height difference that is greater than 20 micrometers. The bonding material has a width and continuously surrounds the optical device, and is disposed between the cover wafer and the device wafer, in which the width is between 10 micrometers and 150 micrometers. The bonding material hermetically bonds the cover wafer and the device wafer to make a leakage rate of the package structure less than 5e −8 atm-cc/sec.

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Номер записи: 93
31-10-2013 дата публикации

Tmap sensor systems and methods for manufacturing those

Номер: US20130285167A1
Автор: Appolonius Jacobus Van Der Wiel, Laurent Otte
Принадлежит: MELEXIS TECHNOLOGIES NV

A pressure sensor system comprising a pressure sensor chip is disclosed. The pressure sensor chip comprises a sensing side where pressure sensing is performed and one or more interconnections where electrical connections are made at the other side of the chip. The pressure sensor comprising an integrated circuit ( 1 ) forming a substrate, the substrate comprising a membrane shaped portion adapted for being exposed to the pressure, the integrated circuit ( 1 ) comprising both pressure signal sensing components and pressure signal processing components.

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Номер записи: 94
14-11-2013 дата публикации

Flexible stop for an acceleration sensor

Номер: US20130299923A1
Автор: Guenther-Nino-Carlo Ullrich, Jochen Reinmuth, Johannes Classen
Принадлежит: ROBERT BOSCH GMBH

A micromechanical acceleration sensor includes a seismic mass and a substrate that has a reference electrode. The seismic mass is deflectable in a direction perpendicular to the reference electrode, and the seismic mass has a flexible stop in the deflection direction. The flexible stop of the seismic mass includes an elastic layer.

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Номер записи: 95
14-11-2013 дата публикации

Method for mems device fabrication and device formed

Номер: US20130299926A1
Автор: Joseph Damian Gordon Lacey, Mickael Renault, Thomas L. Maguire, Vikram Joshi
Принадлежит: Cavendish Kinetics Inc

The present invention generally relates to methods for producing MEMS or NEMS devices and the devices themselves. A thin layer of a material having a lower recombination coefficient as compared to the cantilever structure may be deposited over the cantilever structure, the RF electrode and the pull-off electrode. The thin layer permits the etching gas introduced to the cavity to decrease the overall etchant recombination rate within the cavity and thus, increase the etching rate of the sacrificial material within the cavity. The etchant itself may be introduced through an opening in the encapsulating layer that is linearly aligned with the anchor portion of the cantilever structure so that the topmost layer of sacrificial material is etched first. Thereafter, sealing material may seal the cavity and extend into the cavity all the way to the anchor portion to provide additional strength to the anchor portion.

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Номер записи: 96
21-11-2013 дата публикации

Microelectromechanical component and method for testing a microelectromechanical component

Номер: US20130305804A1
Автор: Bernd Burchard, Michael Doelle
Принадлежит: ELMOS SEMICONDUCTOR SE, Silicon Microstructures Inc

The microelectromechanical component has a semiconductor substrate ( 1 ), which has a cavity ( 2 a ) formed in the semiconductor substrate. The cavity is covered by a reversibly deformable membrane ( 2 ). A sensor ( 17 ) for detecting a deformation of the membrane ( 2 ) is formed within the region of the membrane ( 2 ). A test actuator ( 28, 29, 30 ) for deforming the membrane ( 2 ) for testing purposes is also arranged within the region of the membrane ( 2 ). Finally, the microelectromechanical component has an evaluation and activation unit ( 41 ) connected to the sensor ( 17 ) and the test actuator ( 28, 29, 30 ) for activating the test actuator ( 28, 29, 30 ) in order to deform the membrane ( 2 ) as a test and for evaluating a measurement signal of the sensor ( 17 ) as a sensor detection of a deformation of the membrane ( 2 ) as a result of the activation of the test actuator ( 28, 29, 30 ).

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Номер записи: 97
21-11-2013 дата публикации

Composite Wafer Semiconductor

Номер: US20130307095A1
Автор: Bruce C.S. Chou
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A composite wafer semiconductor device includes a first wafer and a second wafer. The first wafer has a first side and a second side, and the second side is substantially opposite the first side. The composite wafer semiconductor device also includes an isolation set is formed on the first side of the first wafer and a free space is etched in the isolation set. The second wafer is bonded to the isolation set. A floating structure, such as an inertia sensing device, is formed in the second wafer over the free space. In an embodiment, a surface mount pad is formed on the second side of the first wafer. Then, the floating structure is electrically coupled to the surface mount pad using a through silicon via (TSV) conductor.

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Номер записи: 98
21-11-2013 дата публикации

Superhydrophobic substrate and method of manufacturing the same

Номер: US20130309451A1
Автор: Bu-Gon Shin, Hyeon Choi, Jae-Jin Kim, Jong-Byung Lee, Su-Jin Kim, Tae-Su Kim
Принадлежит: LG Chem Ltd

There is provided a superhydrophobic substrate comprising a plurality of protrusions having a pseudo random distribution on one surface thereof, an average interval between respective protrusions among the plurality of protrusions being greater than an interval between light beam wave peaks of light within the visible spectrum, allowing the substrate to have durability and transparency secured therein.

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Номер записи: 99
05-12-2013 дата публикации

Chip package and method for forming the same

Номер: US20130320559A1
Автор: Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho, Yu-Ting Huang
Принадлежит: XinTec Inc

An embodiment of the invention provides a chip package including: a first semiconductor substrate; a second semiconductor substrate disposed on the first semiconductor substrate, wherein the second semiconductor substrate includes a lower semiconductor layer, an upper semiconductor layer, and an insulating layer located between the lower semiconductor layer and the upper semiconductor layer, and a portion of the lower semiconductor layer electrically contacts with at least a pad on the first semiconductor substrate; a signal conducting structure disposed on a lower surface of the first semiconductor substrate, wherein the signal conducting structure is electrically connected to a signal pad on the first semiconductor substrate; and a conducting layer disposed on the upper semiconductor layer of the second semiconductor substrate and electrically contacted with the portion of the lower semiconductor layer electrically contacting with the at least one pad on the first semiconductor substrate.

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Номер записи: 100