IMPROVED ACTUATOR WITH THERMAL BEND

THERMAL ARCHED BEAM MICROELECTROMECHANICAL STRUCTURE

A MEMS actuator is provided that produces significant forces and displacemen ts while consumming a reasonable amount of power. The MEMS actuator includes a microelectronic substrate, spaced apart support s on the substrate and a metallic arched beam extending between the spaced apart supports. The MEMS actuator also includes a heater for heating the arched beam to cause futher arching of the beam. In order to effectively transfer heat from the heater to the metallic arched beam, the metallic arched beam extends over and is spaced, albeit slightly, from the heater. As such, the MEMS actuator effectively converts the heat generated by the heater into mechanical motion of the metallic arched beam. A family of other MEMS devices, such as relays, switching arrays and valves, are also provided that include one or more MEMS actuators in order to take advantage of its efficient operating characteristics. In addition, a method of fabricating a MEMS actuator is further provided.

MICROELECTROMECHANICAL SYSTEM DEVICE AND LOW IMPEDANCE RESISTIVE TRANSDUCER WITH

Dispositif microélectromécanique comprenant une structure mécanique (P1) s'étendant principalement selon une direction longitudinale (x), reliée à un substrat planaire (S) par au moins un ancrage (APLM, APLM2) situé à l'une de ses extrémités et susceptible de fléchir dans un plan parallèle au substrat, ladite structure mécanique comprenant une portion de raccord, qui la relie audit ou à chaque dit ancrage et qui inclut une région résistive (R1) présentant une première (PL1M1) et une deuxième (I2) zone d'injection d'un courant électrique pour former un transducteur résistif, ladite région résistive s'étendant principalement dans ladite direction longitudinale à partir dudit ou d'un dit ancrage et étant agencée de telle sorte qu'une flexion de ladite structure mécanique dans ledit plan parallèle au substrat induise dans ladite région résistive une contrainte moyenne non nulle et réciproquement; caractérisé en ce que : ladite première zone d'injection est portée par ledit ancrage ; et ladite deuxième zone d'injection est portée par un élément conducteur non fixé audit substrat et s'étendant principalement dans une direction dite latérale, sensiblement perpendiculaire à ladite direction longitudinale. Microelectromechanical device comprising a mechanical structure (P1) extending mainly in a longitudinal direction (x), connected to a planar substrate (S) by at least one anchor (APLM, APLM2) located at one of its ends and capable of flex in a plane parallel to the substrate, said mechanical structure comprising a coupling portion, which connects it to said or each said anchor and which includes a resistive region (R1) having a first (PL1M1) and a second (I2) zone of injection of an electric current to form a resistive transducer, said resistive region extending mainly in said longitudinal direction from said or said anchor and being arranged such that a bending of said mechanical structure in said parallel plane to the substrate ...

COMBINATION HORIZONTAL AND VERTICAL THERMAL ACTUATOR

A micrometer sized, single-stage, horizontal and vertical thermal actuator capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The horizontal and vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above and laterally offset from the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator exhibits horizontal and vertical displacement when current is applied to at least the hot arm.

THERMALLY-ACTIVATED ACTUATOR

An actuator having a hot-arm and a cold-arm wherein the hot-arm and cold-arm vertically offset from one another. The hot-arm is heated to cause the actuator to move both vertically and horizontally. When used as a relay, an electrostatic force latches the actuator when the electrodes are brought in close proximity to one another.

MICROMECHANICAL DEVICES WITH THERMAL SHEET CROSS BEAM AND ASSOCIATED MANUFACTURING PROCESSES

Direct acting vertical thermal actuator

MICROELECTROMECHANICAL SYSTEMS INCLUDING THERMALLY ACTUATED BEAMS ON HEATERS THAT MOVE WITH THE THERMALLY ACTUATED BEAMS

Improved microelectromechanical structures include spaced-apart supports on a microelectronic substrate and a beam that extends between the spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the beam between the spaced-apart supports. A heater, located on the beam, applies heat to the beam and displaces with the beam as the beam displaces. Therefore, heat can be directly applied to the arched beam, thereby reducing thermal loss between the heater and the arched beam. Furthermore, an air gap between the heater and arched beam may not need to be heated, thereby allowing improved transient thermal response. Moreover, displacing the heater as the arched beam displaces may further reduce thermal loss and transient thermal response by reducing the separation between the heater and the arched beam as the arched beam displaces.

DEVICE FOR GENERATING A SECOND TEMPERATURE CHANGE FROM A FIRST TEMPERATURE VARIATION

DUAL POSITION LINEAR DISPLACEMENT MICROMECHANISM

An apparatus (1) that is capable of a first stable configuration and a second stable configuration is disclosed. The bistable mechanism (10) has a leg (30, 32) that is coupled on one end by a base member (22, 24) and on the other end by a shuttle (20). The leg (30, 32) stores potential energy as it is deflected. The potential energy stored in the leg (30, 32) has a maximum potential energy position with a low potential energy position on either side of the maximum. An apparatus and method are also disclosed for a latching mechanism (910) and the associated method. The latching mechanism (910) is comprised of a grasping member (932), a lock slider (928), and a detent slider (916). These three members (916, 928, 932) operate together to induce a locked configuration and an unlocked configuration by actuating the lock slider (928) in a single direction.

Combination horizontal and vertical thermal actuator

A micrometer sized, single-stage, horizontal and vertical thermal actuator capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The horizontal and vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above and laterally offset from the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator exhibits horizontal and vertical displacement when current is applied to at least the hot arm.

Reconfigurable lithographic structures

A lithographically structured device has an actuation layer and a control layer operatively connected to the actuation layer. The actuation layer includes a stress layer and a neutral layer that is constructed of materials and with a structure such that it stores torsional energy upon being constructed. The control layer is constructed to maintain the actuation layer substantially in a first configuration in a local environmental condition and is responsive to a change in the local environmental condition such that it permits a release of stored torsional energy to cause a change in a structural configuration of the lithographically structured device to a second configuration, the control layer thereby providing a trigger mechanism. The lithographically structured device has a maximum dimension that is less than about 10 mm when it is in the second configuration.

Actuator Apparatus, Electronic Device, And Control Method

An actuator apparatus includes a pair of substrates facing each other; a plurality of bias actuators that each vary a gap dimension of a gap between the pair of substrates; a gap detection portion that detects the gap dimension; and a voltage control unit that controls driving of each of the bias actuators on the basis of the detected gap dimension. The bias actuators are located asymmetric relative to a driving central axis and are mutually independently driven; and the voltage control unit derives driving parameters for use in driving the bias actuators, on the basis of voltages and gap dimensions obtained by sequentially switching and driving the bias actuators on by one. 1. An actuator apparatus comprising:a first substrate;a second substrate that faces the first substrate;a first reflecting film that is disposed on the first substrate;a second reflecting film that is disposed on the second substrate, the second reflecting film facing the first reflecting film;a plurality of bias electrostatic actuators that is disposed so as to surround the first reflecting film and the second reflecting film in plan view;a control electrostatic actuator that is disposed so as to surround the first reflecting film and the second reflecting film in plan view;a gap detector that detects a gap between the first reflection film and the second reflection film based on a capacitance between the first reflection film and the second reflection film; anda driving controller that controls the plurality of bias electrostatic actuators and the control electrostatic actuator, the driving controller applying a bias voltage to one of the plurality of bias electrostatic actuators, the driving controller applying a feedback voltage to the control electrostatic actuator, the feedback voltage being generated based on the capacitance,the driving controller deriving a driving parameter to drive the one of the plurality of bias electrostatic actuators based on a voltage supplied to each of the ...

DEVICE AND METHOD FOR GENERATING A SECOND TEMPERATURE VARIATION FROM A FIRST TEMPERATURE VARIATION

Mikromechanischer Aktuator und Verfahren zu seiner Herstellung

Mikromechanischer Aktuator (1), aufweisend: – ein bewegbares erstes Federelement (2), welches Metall und/oder Silizium aufweist, wobei das erste Federelement (2) an einer ersten Stelle (10) angebracht ist und an einer zweiten Stelle frei bewegbar ist, – ein mit dem ersten Federelement (2) verbundenes zweites Federelement (12), welches Silizium aufweist, – ein elektrisch isolierendes Material (20), auf welchem das zweite Federelement (12) teilweise angeordnet ist, und – ein Substrat (11), auf welchem das elektrisch isolierende Material (20) angebracht ist, wobei das zweite Federelement (12) in einem Abstand zum Substrat (11) oberhalb des Substrates (11) in einer ersten Ebene (17) angeordnet ist, und das erste Federelement (2) oberhalb des zweiten Federelementes (12) in einer zweiten Ebene (18) angeordnet ist, wobei die zweite Ebene (18) von der ersten Ebene (17) beabstandet ist, so dass das erste Federelement (2) und das zweite Federelement (12) gegenüber dem Substrat...

PRODUCTION FROM PIEZOELECTRIC HANGING UP MICRO COMPONENTS IN THE VICTIM THICK-FILM PROCEDURE

Thermomechanical in-plane microactuator

Improved thermal bend actuator

MICROELECTROMECHANICAL VALVE HAVING SINGLE CRYSTALLINE COMPONENTS AND ASSOCIATED FABRICATION METHOD

A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate and a thermally actuated microactuator and associated components disposed on the substrate and formed as a unitary structure from a single crystalline material, wherein the associated components are actuated by the microactuator upon thermal actuation thereof. For example, the MEMS device may be a valve. As such, the valve may include at least one valve plate that is controllably brought into engagement with at least one valve opening in the microelectronic substrate by selective actuation of the microactuator. While the MEMS device can include various microactuators, the microactuator advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetwee n. By heating the at least one arched beam of the microactuator, the arched beams will further arch such that the microactuator moves between a closed position in which th e valve plate ...

IMPROVED THERMAL BEND ACTUATOR

A thermal bend actuator (6) is provided with upper arms (23, 25, 26) and lower arms (27, 28) which are non planar, so increasing the stiffness of the arms. The arms (23, 25, 26,27,28) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material. © KIPO & WIPO 2007 ...

MULTI-DIRECTIONAL THERMAL ACTUATOR

A micrometer sized multi-directional thermal actuator capable of repeatable and rapid displacement in a substantially horizontal direction, a substantially vertical direction, and/or a combination thereof. The multi-directional thermal actuator constructed on a surface of a substrate includes three or more beams each cantilevered from one or more anchors at a first end to extend generally parallel to the surface of the substrate. A member mechanically and electrically couples the distal ends of the beams. Application of current to a circuit comprising combinations of any two or more of the beams displaces the member in one of three or more non-parallel radial directions, respectively.

MICROELECTROMECHANICAL DEVICE AND SYSTEM WITH LOW-IMPEDANCE RESISTIVE TRANSDUCER

A microelectromechanical device comprising a mechanical structure extending along a longitudinal direction, linked to a planar substrate by an anchorage situated at one of its ends and able to flex in a plane parallel to the substrate, the mechanical structure comprises a joining portion, which links it to each anchorage and includes a resistive region exhibiting a first and second zone for injecting an electric current to form a resistive transducer, the resistive region extending in the longitudinal direction from an anchorage and arranged so a flexion of the mechanical structure in the plane parallel to the substrate induces a non-zero average strain in the resistive region and vice versa; wherein: the first injection zone is carried by the anchorage; and the second injection zone is carried by a conducting element not fixed to the substrate and extending in a direction, termed lateral, substantially perpendicular to the longitudinal direction. 1. A microelectromechanical device comprising a mechanical structure extending mainly along a direction , termed longitudinal , and linked to a planar substrate by at least one anchorage situated at one of its ends along the longitudinal direction and able to flex in a plane parallel to the substrate , the mechanical structure comprising a portion , termed the joining portion , which links it to the said or to each said anchorage and which includes a resistive region exhibiting a first and a second zone for injecting an electric current so as to form a resistive transducer , the resistive region extending mainly in the longitudinal direction from the said or from a said anchorage and being arranged in such a way that a flexion of the mechanical structure in the plane parallel to the substrate induces a non-zero average strain in the resistive region and vice versa; wherein:the first injection zone is carried by the anchorage; andthe second injection zone is carried by a conducting element not fixed to the substrate and ...

Direct acting vertical thermal actuator with controlled bending

SYSTEMS AND METHODS FOR MICRO-CANTILEVER ACTUATION BY BASE EXCITATION

A system and methods for base excitation of moderately high vibration of micro-cantilevers are disclosed. A micro-cantilever may be coupled to one or more actuators adjacent its base. The actuators may comprise bulk materials, bridges, or formed wires that expand and contract by application of electric currents, due to, for example, the effect of electro-thermal heating or piezoelectric effects. Single actuators or an array of actuators may be placed around the micro-cantilever to oscillate it and apply actuation pulses. The system and methods, and adjustments of the geometrical parameters, may be performed to yield a nominal natural frequency in the system. The excitation of actuators with signals corresponding to the natural frequency may induce resonance in the system and may result in high amplitude vibrations and displacement of the cantilever tip of the micro-cantilever. Various architectures of the actuators may be implemented to stimulate different frequencies of the beam and induce ...

SYSTEMS AND METHODS FOR MICRO-CANTILEVER ACTUATION BY BASE EXCITATION

A system and methods for base excitation of moderately high vibration of micro-cantilevers are disclosed. A micro-cantilever may be coupled to one or more actuators adjacent its base. The actuators may comprise bulk materials, bridges, or formed wires that expand and contract by application of electric currents, due to, for example, the effect of electro-thermal heating or piezoelectric effects. Single actuators or an array of actuators may be placed around the micro-cantilever to oscillate it and apply actuation pulses. The system and methods, and adjustments of the geometrical parameters, may be performed to yield a nominal natural frequency in the system. The excitation of actuators with signals corresponding to the natural frequency may induce resonance in the system and may result in high amplitude vibrations and displacement of the cantilever tip of the micro-cantilever. Various architectures of the actuators may be implemented to stimulate different frequencies of the beam and induce ...

THERMAL ARCHED BEAM MICROELECTROMECHANICAL STRUCTURE

A MEMS actuator is provided that produces significant forces and displacements while consumming a reasonable amount of power. The MEMS actuator includes a microelectronic substrate, spaced apart supports on the substrate and a metallic arched beam extending between the spaced apart supports. The MEMS actuator also includes a heater for heating the arched beam to cause futher arching of the beam. In order to effectively transfer heat from the heater to the metallic arched beam, the metallic arched beam extends over and is spaced, albeit slightly, from the heater. As such, the MEMS actuator effectively converts the heat generated by the heater into mechanical motion of the metallic arched beam. A family of other MEMS devices, such as relays, switching arrays and valves, are also provided that include one or more MEMS actuators in order to take advantage of its efficient operating characteristics. In addition, a method of fabricating a MEMS actuator is further provided.

METHOD FOR MAKING AN ACTUATOR BASED ON CARBON NANOTUBES

The disclosure relates to a method for making an actuator based on carbon nanotubes. The method includes: providing a carbon nanotube layer; depositing a vanadium oxide (VO) layer on the carbon nanotube layer; and annealing the VOlayer in an oxygen atmosphere to form a vanadium dioxide layer (VO) layer. Because the drastic reversible phase transition of VO, the actuator has giant deformation amplitude and fast response. 1. A method for making an actuator , the method comprising:providing a carbon nanotube (CNT) layer;{'sub': x', 'x, 'applying a vanadium oxide (VO) layer on the carbon nanotube layer to form a VO/CNT composite; and'}{'sub': x', '2, 'annealing the VO/CNT composite in an oxygen atmosphere to obtain a vanadium dioxide (VO) layer on the carbon nanotube layer.'}230. The method of claim 1 , wherein the applying the vanadium oxide layer on the carbon nanotube layer comprises placing a carbon nanotube film in the vanadium oxide layer claim 1 , wherein a thickness of the carbon nanotube film is less than nanometers.3. The method of claim 1 , wherein the applying the vanadium oxide layer on the carbon nanotube layer comprises:providing a plurality of carbon nanotube films;depositing the vanadium oxide layer on each of the plurality of carbon nanotube films to obtain a plurality of preform composite layers; andstacking the plurality of preform composite layers on the carbon nanotube layer.4. The method of claim 3 , wherein a first thickness of each of the plurality of carbon nanotube films is less than 30 nanometers claim 3 , and a second thickness of the vanadium oxide layer is greater than 30 nanometers.5. The method of claim 4 , wherein a first length of the vanadium oxide layer is less than a second length of each of the plurality of carbon nanotube films.6. The method of claim 5 , wherein after obtain the vanadium dioxide layer claim 5 , a portion of each of the plurality of carbon nanotube films extends out of the vanadium dioxide layer to form an outside ...

MEMS-BASED MICRO AND NANO GRIPPERS WITH TWO-AXIS FORCE SENSORS

The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.

Silicon micromachined optical device

An apparatus at least partially intercepts a plurality of light beams propagating along a respective plurality of beam paths. The apparatus includes a single crystal silicon substrate and an array including a plurality of modules. Each module includes a reflector comprising single crystal silicon and a reflector surface lying in a reflector plane substantially perpendicular to the substrate surface. Each module further includes a reflector support which mounts the reflector to move substantially within the reflector plane with a displacement component along the surface normal direction of the substrate surface. Each module further includes a reflector driver responsive to electrical current to selectively move the reflector between a first position and a second position.

DIRECT ACTING VERTICAL THERMAL ACTUATOR WITH CONTROLLED BENDING

A micrometer sized, single-stage, vertical thermal actuator with controlled bending capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator bends generally at the flexure so that the member moves away from the substrate when current is applied to at least the hot arm.

DIRECT ACTING VERTICAL THERMAL ACTUATOR WITH CONTROLLED BENDING

A micrometer sized, single-stage, vertical thermal actuator with controlled bending capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator bends generally at the flexure so that the member moves away from the substrate when current is applied to at least the hot arm.

Photothermal type flexible drive slice

ELECTRONIC STRUCTURE WITH VISCOUS DAMPING CONTROL BY CONTROL OF THERMO-PIEZORESISTIVE

Structure microélectronique comportant au moins une masse mobile (2) reliée mécaniquement à un premier élément mécanique par des premiers moyens de liaison mécanique (6) et à un deuxième élément mécanique(24) par des deuxièmes moyens de liaison mécanique (14) conducteurs électriques, des moyens de polarisation électrique (15) des deuxièmes moyens de liaison mécanique (14), lesdits deuxièmes moyens de liaison mécanique (14) étant tels qu'ils sont le siège d'un effet thermo-piézorésistif , les deuxièmes moyens de liaison (14) et la masse mobile (2) étant disposés l'un par rapport à l'autre de sorte qu'un déplacement de la masse mobile (2) applique une contrainte mécanique aux deuxième moyens de liaison (14), dans laquelle les moyens de polarisation électrique (15) sont des moyens de polarisation en tension continue et forment avec au moins les deuxièmes moyens de liaison mécanique (14) un circuit électrique de rétroaction thermo-piézorésistive.

MICROELECTROMECHANICAL STRUCTURE AND/OR NANOELECTRIC ELECTROTHERMAL ACTUATOR HAS AT LEAST TWO BEAMS HAVING ACTUATING POLARIZABLE DIFFERENTLY

Structure microélectromécanique à actionnement électrothermique comportant une partie fixe (502), partie mobile (504), une première poutre d'actionnement (506.1) électrothermique permettant de faire circuler un courant électrique de la partie fixe à la partie mobile et une deuxième poutre d'actionnement (506.2) électrothermique permettant de faire circuler un courant électrique de la partie fixe à la partie mobile, les poutres étant reliées mécaniquement à la partie mobile (504) permettant un déplacement de la partie mobile (504) par actionnement électrothermique, un élément de liaison électriquement conducteur (508) reliant la partie mobile (504) à la partie fixe (502), des moyens de connexion (P1) de la première poutre d'actionnement (506.1) à une première source de polarisation et des moyens de connexion (P2) de la deuxième poutre d'actionnement (506.2) à une deuxième source de polarisation, de sorte que la première (506.1) et la deuxième (506.2) puissent être polarisées différemment et séparément. An electrothermally actuated microelectromechanical structure having a fixed portion (502), a moving portion (504), a first electrothermal actuating beam (506.1) for circulating an electric current from the fixed portion to the movable portion, and a second beam of actuation (506.2) electrothermal for circulating an electric current from the fixed part to the movable part, the beams being mechanically connected to the movable part (504) allowing a displacement of the movable part (504) by electrothermal actuation, an element of electrically conductive connection (508) connecting the moving part (504) to the fixed part (502), connection means (P1) of the first actuating beam (506.1) to a first polarization source and connection means ( P2) of the second actuating beam (506.2) to a second polarization source, so that the first (506.1) and the second (506.2) can They should be polarized differently and separately.

MICROMECHANICAL ACTUATOR

Disclosed is a micromechanical actuator (1) comprising: - a movable first spring element (2) that contains metal and/or silicon; - a second spring element (12) which is connected to the first spring element (2) and contains silicon; - an electrically insulating material (20) on which part of the second spring element (20) is arranged; and - a substrate (11) to which the electrically insulating material (20) is attached. The second spring element (12) is arranged on a first plane above the substrate (11), at a distance from the substrate (11). The first spring element (2) is arranged on a second plane (18) above the second spring element (12). The first spring element (2) and the second spring element (12) can be moved relative to the substrate (11). The actuator (1) further comprises a third spring element (3) that is mechanically coupled to the first spring element (2). An elastic deformation of the second spring element (12) can be induced by changing the length of the third spring element ...

Thermal bend actuator

A thermal bend actuator (6) is provided with upper arms (23, 25, 26) and lower arms (27, 28) which are non planar, so increasing the stiffness of the arms. The arms (23, 25, 26,27,28) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material.

Integrated electromechanical switch and tunable capacitor and method of making the same

A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are described. Both electromechanical devices include movable beams actuated either by thermo-mechanical or by electrostatic forces. The devices are fabricated directly on finished silicon-based integrated circuit wafers, such as CMOS, BiCMOS or bipolar wafers. The movable beams are formed by selectively removing the supporting silicon underneath the thin films available in a silicon-based integrated circuit technology, which incorporates at least one polysilicon layer and two metallization layers. A cavity and a thick, low-loss metallization are used to form an electrode above the movable beam. A thick mechanical support layer is formed on regions where the cavity is located, or substrate is bulk-micro-machined, i.e., etched.

Thermal arched beam microelectromechanical structure

A MEMS actuator is provided that produces significant forces and displacements while consuming a reasonable amount of power. The MEMS actuator includes a microelectronic substrate, spaced apart supports on the substrate and a metallic arched beam extending between the spaced apart supports. The MEMS actuator also includes a heater for heating the arched beam to cause further arching of the beam. In order to effectively transfer heat from the heater to the metallic arched beam, the metallic arched beam extends over and is spaced, albeit slightly, from the heater. As such, the MEMS actuator effectively converts the heat generated by the heater into mechanical motion of the metallic arched beam. A family of other MEMS devices, such as relays, switching arrays and valves, are also provided that include one or more MEMS actuators in order to take advantage of its efficient operating characteristics. In addition, a method of fabricating a MEMS actuator is further provided.

Improved thermal bend actuator

Thermal arched beam microelectromechanical devices and associated fabrication methods

A MEMS actuator is provided that produces significant forces and displacements while consuming a reasonable amount of power. The MEMS actuator includes a microelectronic substrate, spaced apart supports on the substrate and a metallic arched beam extending between the spaced apart supports. The MEMS actuator also includes a heater for heating the arched beam to cause further arching of the beam. In order to effectively transfer heat from the heater to the metallic arched beam, the metallic arched beam extends over and is spaced, albeit slightly, from the heater. As such, the MEMS actuator effectively converts the heat generated by the heater into mechanical motion of the metallic arched beam. A family of other MEMS devices, such as relays, switching arrays and valves, are also provided that include one or more MEMS actuators in order to take advantage of its efficient operating characteristics. In addition, a method of fabricating a MEMS actuator is further provided.

THERMAL MICRO-ACTUATOR BASED ON SELECTIVE ELECTRICAL EXCITATION

NANO GRIPPER AND METHOD OF MANUFACTURING THE NANO GRIPPER

MICROELECTROMECHANICAL SYSTEM DEVICE AND LOW IMPEDANCE RESISTIVE TRANSDUCER WITH

Dispositif microélectromécanique comprenant une structure mécanique (P1) s'étendant principalement selon une direction longitudinale (x), reliée à un substrat planaire (S) par au moins un ancrage (APLM, APLM2) situé à l'une de ses extrémités et susceptible de fléchir dans un plan parallèle au substrat, ladite structure mécanique comprenant une portion de raccord, qui la relie audit ou à chaque dit ancrage et qui inclut une région résistive (R1) présentant une première (PL1M1) et une deuxième (I2) zone d'injection d'un courant électrique pour former un transducteur résistif, ladite région résistive s'étendant principalement dans ladite direction longitudinale à partir dudit ou d'un dit ancrage et étant agencée de telle sorte qu'une flexion de ladite structure mécanique dans ledit plan parallèle au substrat induise dans ladite région résistive une contrainte moyenne non nulle et réciproquement; caractérisé en ce que : ladite première zone d'injection est portée par ledit ancrage ; et ladite deuxième zone d'injection est portée par un élément conducteur non fixé audit substrat et s'étendant principalement dans une direction dite latérale, sensiblement perpendiculaire à ladite direction longitudinale.

System and method for providing an improved electrothermal actuator for a micro-electro-mechanical device

A system and method for providing an improved micro-electro-mechanical (MEMS) electrothermal actuator is disclosed. In prior art electrothermal actuators an electric current passes through a narrow arm and returns through a wide arm. The larger current density in the narrow arm heats the narrow arm so that it expands more than the wide arm. The differential expansion of the hot narrow arm and the cold wide arm deflects the end of the cold wide arm. The present invention provides an additional hot arm to provide a return path for the electric current so that the cold arm does not conduct electric current. The present invention optimizes power consumption, tip deflection and generated force. A bidirectional thermal beam actuator is also disclosed.

IMPROVED THERMAL BEND ACTUATOR

METHOD FOR PRODUCING MICRO-MECHANICAL COMPONENTS AND COMPONENTS PRODUCED ACCORDING TO SAID METHOD

ELECTROTHERMALLY-DRIVEN MEMS MICROGRIPPERS WITH INTEGRATED DUAL-AXIS CAPACITIVE FORCE SENSORS

The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities.

PREPARATION OF MULTI-LAYER MICROCOMPONENTS BY THE METHOD OF THE SACRIFICIAL COUCHEEPAISSE

L'invention concerne la préparation de microcomposants multicouches qui comprend une ou plusieurs couches, chacune constituée par un matériau M choisi parmi les métaux, les alliages métalliques, les verres, les céramiques et les vitrocéramiques. Le procédé consiste à déposer sur un substrat une ou plusieurs couches d'une encre P, et une ou plusieurs couches d'une encre M, chaque couche étant déposée selon un motif prédéterminé, chaque couche d'encre étant au moins partiellement consolidée avant dépôt de la couche suivante ; effectuer une consolidation totale des couches M partiellement consolidées après leur dépôt ; éliminer totalement ou partiellement le matériau de chacune des couches P. Une encre P est constituée par une résine thermodurcissable contenant une charge minérale ou par un mélange comprenant un matériau minéral et un liant organique. Une encre M est constituée par un matériau minéral précurseur du matériau M et un liant organique. Les encres sont déposées par coulage ou par ...

BUCKLE RESISTANT THERMAL BEND ACTUATORS

The invention relates to a thermal bend actuator (7) including: a first anchor portion (9) for securing to a fixed substrate (2); a first thermally conductive active beam member (10) secured at aproximal end to said first anchor portion (9) and extending to a movable distal end; a second beam member (12) similarly anchored at a proximal end to said first anchor portion (9) so as to extend parallel to said first active beam member (10), each of said first and second beam members being directly or indirectly interconnected at their respective proximal ends remote said first anchor portion (9); wherein said first thermally conductive active beam member (10) is configured to define a labyrinthine conductive pathway (14) having a combined effective length in a direction extending between said fixed proximal end and said movable distal end that exceeds twice the effective direct linear path therebetween.

PRODUCTION OF MULTILAYER MICROCOMPONENTS BY THE SACRIFICIAL THICK LAYER METHOD

The invention relates to the production of multilayer microcomponents comprising one or more layers, each consisting of a material M chosen from metals, metal alloys, glasses, ceramics and glass-ceramics. The method consists in depositing, on a substrate, one or more layers of an ink P and one or more layers of an ink M, each layer being deposited in a predetermined pattern, each ink layer being at least partially consolidated before deposition of the next layer, in completely consolidating the partially consolidated layers of ink M after their deposition, and in completely or partially removing the material of each of the layers of ink P. An ink P consists of a thermosetting resin containing a mineral filler or of a mixture comprising a mineral material and an organic binder. An ink M consists of a mineral material that is a precursor of the material M and an organic binder. The inks are deposited by casting or by extrusion.

THERMALLY-ACTIVATED ACTUATOR

Multi-directional thermal actuator

MEMS-BASED MICRO AND NANO GRIPPERS WITH TWO- AXIS FORCE SENSORS

The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.

NANO GRIPPER AND METHOD OF MANUFACTURING THE NANO GRIPPER

A nano gripper, comprising a pair of arms (71, 71) opposed to each other, a pair of projected parts (72, 72) formed on the tip part opposed surfaces of the pair of arms (71, 71) with the tip parts of the arms opposed to each other, and pairs of silicon extendable and thermally expanding actuators (75, 76) allowing the tip parts of the pair of arms (71, 71) to be moved close to and apart from each other, wherein the tip parts of the projected parts (72) are formed in a curvature of 50 nano meter or less, and the projected parts (72) are formed of silicon crystals and have a triangular pyramid shape with an apex formed of surfaces (100, 001, and 111).

MEMS isolation structures

A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material. 1. A device comprising:a substrate having a first outer surface and a second outer surface opposite said first outer surface;a channel formed in said substrate, said channel having a first opening defined by said first outer surface of said substrate;circuitry material disposed in said channel; anda gap formed in said circuitry material in said channel, said gap separating said circuitry material into a first region and a second region; and whereinsaid first region of said circuitry material is mechanically isolated from said second region of said circuitry material such that said first region of said circuitry material is moveable relative to said second region of said circuitry material.2. The device of claim 1 , wherein at least one of said first region of said circuitry material and said second region of said circuitry material extends over said first outer surface of said substrate.3. The device of claim 1 , wherein said first region of said circuitry material and said second region of said circuitry material are electrically isolated from one another.4. The device of claim 1 , wherein said first region of said circuitry material is mechanically isolated from at least a portion of said substrate.5. The device of claim 1 , wherein said channel includes a second opening defined by said second outer surface of said substrate.6. The device of claim 5 , wherein said second opening of said channel is formed by thinning said substrate from said second outer surface.7. The device of claim 5 , wherein:said substrate includes a first region and a second region;said first region of said substrate defines a portion of ...

VERBESSERTER AKTOR MIT THERMISCHER BIEGUNG

COMBINATION HORIZONTAL AND VERTICAL THERMAL ACTUATOR

A micrometer sized, single-stage, horizontal and vertical thermal actuator capable of repeatable and rapid movement of a micrometer-sized optical devic e off the surface of a substrate. The horizontal and vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above and laterally offset from the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator exhibits horizontal and vertical displacement when current is applied to at least the hot arm.

Nano gripper and method of manufacturing the nano gripper

Microelectromechanical valve having single crystalline components and associated fabrication method

A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate and a thermally actuated microactuator and associated components disposed on the substrate and formed as a unitary structure from a single crystalline material, wherein (the associated components are actuated by the microactuator upon thermal actuation thereof. For example, the MEMS device may be a valve. As such the valve may include at least one valve plate that is controllably brought, into engagement with al least one valve opening in the microelectronic substrate by selective actuation of the microactuator. While the MEMS device can include various microactuators, the microactuator advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch such that the microactuator moves between a closed position in which the valve plate ...

VIRTUAL VALVE IN A MEMS-BASED COOLING SYSTEM

An active cooling system is described. The active cooling system includes at least one cooling element that has a vent therein and is in communication with a fluid. The cooling element(s) are actuated to vibrate to drive the fluid toward a heat-generating structure and to alternately open and close at least one virtual valve corresponding to the vent. The virtual valve is open for a low flow resistance and closed for a high flow resistance. The vent remains physically open for the virtual valve being closed. 1. An active cooling system , comprising:at least one cooling element having a vent therein and being in communication with a fluid, the at least one cooling element being actuated to vibrate to drive the fluid toward a heat-generating structure and to alternately open and close at least one virtual valve corresponding to the vent, the virtual valve being open for a low flow resistance and closed for a high flow resistance, the vent remaining physically open for the virtual valve being closed.2. The active cooling of system claim 1 , wherein the at least one cooling element includes a first cooling element and a second cooling element claim 1 , the first cooling element having a passive vent therein claim 1 , the first cooling element being in communication with the fluid claim 1 , the second cooling element being between the first cooling element and the heat-generating structure claim 1 , the second cooling element having an active vent therein claim 1 , the at least one virtual valve including a passive virtual valve corresponding to the passive vent and an active virtual valve corresponding to the active vent claim 1 , the passive virtual valve being open in a suction arrangement and closed in an expulsion arrangement claim 1 , the active virtual valve being closed in the suction arrangement and open in the expulsion arrangement claim 1 , at least one of the first cooling element and the second cooling element using vibrational motion to provide the suction ...

IN-PLANE MEMS THERMAL ACTUATOR AND ASSOCIATED FABRICATION METHODS

A MEMS thermal actuator device is provided that is capable of providing line ar displacement in a plane generally parallel to the surface of a substrate. Additionally, the MEMS thermal actuator of the present invention may provide for a self contained heating mechanism that allows for the thermal actuator to be actuated using lower power consumption and lower operating temperatures. The MEMS thermal actuator includes a microelectronic substrate having a first surface and at least one anchor structure affixed to the first surface. A composite beam extends from the anchor(s) and overli es the first surface of the substrate. The composite beam is adapted for thermal actuatio n, such that it will controllably deflect along a predetermined path that extends substantially parallel to the first surface of the microelectronic substrate. In one embodiment the composite beam comprises two or layers having materials that have correspondingly different thermal coefficients of expansion. As such, the ...

DIRECT ACTING VERTICAL THERMAL ACTUATOR

A micrometer sized, single-stage, vertical thermal actuator capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above the hot arm relative to the surface. A member mechanically and electrically couples the free ends of the hot and cold arms such that the member moves away from the substrate when current is applied to at least the hot arm. The hot arm can optionally include a grounding tab to minimize thermal expansion of the cold arm.

MEMS-BASED MICRO AND NANO GRIPPERS WITH TWO-AXIS FORCE SENSORS

The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.

MICROELECTROMECHANICAL STRUCTURE AND/OR NANOELECTRIC ELECTROTHERMAL ACTUATOR HAS AT LEAST TWO BEAMS HAVING ACTUATING POLARIZABLE DIFFERENTLY

MECHANICAL DEVICE INTEGRATED VERTICAL MOVEMENT

PREPARATION OF MULTI-LAYER MICROCOMPONENTS BY THE METHOD OF THE SACRIFICIAL THICK LAYER

ELECTRONIC STRUCTURE WITH VISCOUS DAMPING CONTROL BY CONTROL OF THERMO-PIEZORESISTIVE

Structure microélectronique comportant au moins une masse mobile (2) reliée mécaniquement à un premier élément mécanique par des premiers moyens de liaison mécanique (6) et à un deuxième élément mécanique(24) par des deuxièmes moyens de liaison mécanique (14) conducteurs électriques, des moyens de polarisation électrique (15) des deuxièmes moyens de liaison mécanique (14), lesdits deuxièmes moyens de liaison mécanique (14) étant tels qu'ils sont le siège d'un effet thermo-piézorésistif , les deuxièmes moyens de liaison (14) et la masse mobile (2) étant disposés l'un par rapport à l'autre de sorte qu'un déplacement de la masse mobile (2) applique une contrainte mécanique aux deuxième moyens de liaison (14), dans laquelle les moyens de polarisation électrique (15) sont des moyens de polarisation en tension continue et forment avec au moins les deuxièmes moyens de liaison mécanique (14) un circuit électrique de rétroaction thermo-piézorésistive. Microelectronic structure comprising at least one mobile mass (2) mechanically connected to a first mechanical element by first mechanical connection means (6) and to a second mechanical element (24) by second electrical conductor connecting means (14), electrical biasing means (15) of the second mechanical connection means (14), said second mechanical connection means (14) being such that they are the seat of a thermo-piezoresistive effect, the second connecting means (14) ) and the moving mass (2) being arranged relative to each other so that a displacement of the moving mass (2) applies a mechanical stress to the second connecting means (14), wherein the means of electric polarization (15) are DC voltage biasing means and form with at least the second mechanical connection means (14) an electrical feedback circuit thermo-piezoresistive.

DEVICE OF GENERATION Of ONE SECOND TEMPERATURE VARIATION STARTING FROM a FIRST Temperature variation

Ce dispositif de génération d'une seconde variation ΔT2 de température à partir d'une première variation ΔT1 de température d'utilisation, comporte : - une couche (30) en matériau élastocalorique dont la température interne est apte à varier de ΔT2 en réponse à une variation donnée Δσ d'une contrainte mécanique appliquée sur cette couche en matériau élastocalorique, la variation donnée Δσ étant induite par la première variation ΔT1 de température - un élément suspendu (24) en contact mécanique avec la couche en matériau élastocalorique de manière à appliquer sur cette couche une contrainte mécanique qui varie en réponse à la variation ΔT1 de température d'utilisation, cet élément suspendu (24) étant agencé de manière à faire varier de Δσ la contrainte mécanique appliquée sur la couche en matériau élastocalorique en réponse à la variation ΔT1 de température pour générer ainsi la seconde variation ΔT2 de température.

MECHANICAL DEVICE INTEGRATED VERTICAL MOVEMENT

Le dispositif comprend un ensemble thermiquement déformable (ENS) logé dans une cavité (CVT) de la partie d'interconnexion (RITX) d'un circuit intégré. L'ensemble peut fléchir lors d'une variation de température de façon à ce que sa zone d'extrémité libre (Z2) se déplace verticalement (DV).

IMPROVED THERMAL BEND ACTUATOR

A thermal bend actuator (6) is provided with upper arms (23, 25, 26) and lower arms (27, 28) which are non planar, so increasing the stiffness of the arms. The arms (23, 25, 26,27,28) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material.

DIRECT ACTING VERTICAL THERMAL ACTUATOR

A micrometer sized, single-stage, vertical thermal actuator capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above the hot arm relative to the surface. A member mechanically and electrically couples the free ends of the hot and cold arms such that the member moves away from the substrate when current is applied to at least the hot arm. The hot arm can optionally include a grounding tab to minimize thermal expansion of the cold arm.

THERMAL MICRO-ACTUATOR BASED ON SELECTIVE ELECTRICAL EXCITATION

A thermal microactuator is provided that can be deflected in multiple positions. The actuator has a hot arm and a cold arm coupled together at their distal ends suspended above a reference plane of a substrate. A potential difference is applied across the hot arm so that a current circulates through the hot arm but not the cold arm.

Thermal bend actuator with corrugate profile

A thermal bend actuator ( 6 ) is provided with a group of upper arms ( 23, 25, 26 ) and a group of lower arms ( 27, 28 ) which are non planar, so increasing the stiffness of the arms. The arms ( 23, 25, 26,27,28 ) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material ...

MEMS isolation structures

A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.

Integrated mechanical device with vertical movement

A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.

MEMS ACTUATOR

Apparatus including substrate, pusher assembly, and flexor assembly adjacent to pusher assembly. Pusher assembly includes hot and cold pusher arms. First ends of hot and cold pusher arms are anchored over substrate. Second ends of hot and cold pusher arms are coupled together and suspended for lateral displacement over substrate. Flexor assembly includes flexor arm, and conductor having actuator contact. First end of flexor arm is anchored over substrate. Pusher assembly is configured for causing lateral displacement of second end of flexor arm and of actuator contact over the substrate. Method includes providing apparatus and causing pusher assembly to laterally displace second end of flexor arm and actuator contact over substrate.

THERMALLY-ACTIVATED ACTUATOR

An actuator having a hot-arm and a cold-arm wherein the hot-arm and cold-arm vertically offset from one another. The hot-arm is heated to cause the actuator to move both vertically and horizontally. When used as a relay, an electrostatic force latches the actuator when the electrodes are brought in close proximity to one another.

Actuator based on carbon nanotubes and actuating system using the same

The disclosure relates to an actuator based on carbon nanotubes and actuating system using the same. The actuator includes: a carbon nanotube layer and a vanadium dioxide layer stacked with each other. Because the drastic, reversible phase transition of VO2, the actuator has giant deformation amplitude and fast response. An actuating system using the actuator is also provided.

Method for producing micro-mechanical components and components produced according to said method

Switches and switching arrays that use microelectromechanical devices having oneor more beam members that are responsive to temperature

Electrothermal microgripper

COMBINATION HORIZONTAL AND VERTICAL THERMAL ACTUATOR

A micrometer sized, single-stage, horizontal and vertical thermal actuator capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The horizontal and vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above and laterally offset from the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator exhibits horizontal and vertical displacement when current is applied to at least the hot arm. © KIPO & WIPO 2007 ...

MEMS ACTUATOR

Apparatus including substrate, pusher assembly, and flexor assembly adjacent to pusher assembly. Pusher assembly includes hot and cold pusher arms. First ends of hot and cold pusher arms are anchored over substrate. Second ends of hot and cold pusher arms are coupled together and suspended for lateral displacement over substrate. Flexor assembly includes flexor arm, and conductor having actuator contact. First end of flexor arm is anchored over substrate. Pusher assembly is configured for causing lateral displacement of second end of flexor arm and of actuator contact over the substrate. Method includes providing apparatus and causing pusher assembly to laterally displace second end of flexor arm and actuator contact over substrate.

Device and method for generating a second temperature variation from a first temperature variation

A device for generating a second temperature variation ΔT2 from a first use temperature variation ΔT1, includes an elastocaloric material layer, having an internal temperature which is able to vary by ΔT2 in response to a given mechanical stress variation Δσ applied to the elastocaloric material layer. The variation Δσ being induced by the first use temperature variation ΔT1 There is a suspended element in mechanical contact with the elastocaloric material layer so as to apply to this layer a mechanical stress that varies in response to the use temperature variation ΔT1. The suspended element is arranged so as to make the mechanical stress applied to the elastocaloric material layer vary by Δσ in response to the temperature variation ΔT1, to generate the second temperature variation ΔT2.

THERMAL ARCHED BEAM MICROELECTROMECHANICAL DEVICES AND ASSOCIATED FABRICATION METHODS

A MEMS actuator is provided that produces significant forces and displacements while consumming a reasonable amount of power. The MEMS actuator includes a microelectronic substrate, spaced apart supports on the substrate and a metallic arched beam extending between the spaced apart supports. The MEMS actuator also includes a heater for heating the arched beam to cause futher arching of the beam. In order to effectively transfer heat from the heater to the metallic arched beam, the metallic arched beam extends over and is spaced, albeit slightly, from the heater. As such, the MEMS actuator effectively converts the heat generated by the heater into mechanical motion of the metallic arched beam. A family of other MEMS devices, such as relays, switching arrays and valves, are also provided that include one or more MEMS actuators in order to take advantage of its efficient operating characteristics. In addition, a method of fabricating a MEMS actuator is further provided.

Verfahren zur Herstellung mikromechanischer Bauteile und nach dem Verfahren hergestellte Bauteile

Es wird ein Verfahren zur Herstellung mikromechanischer Bauteile angegeben, die mindestens eine elastische Federzunge enthalten, wobei diese Federzunge insbesondere durch galvanische Abscheidung, Sputtern, Aufdampfen und/oder Ätzen erzeugt wird. DOLLAR A Das Verfahren ist dadurch gekennzeichnet, dass auf Bereiche der Federzunge thermisch eingewirkt wird und ein mechanischer Eigenspannungsgradient in der Federzunge erzeugt wird.

MICROELECTROMECHANICAL VALVES INCLUDING SINGLE CRYSTALLINE MATERIAL COMPONENTS AND METHOD OF MANUFACTURING THE SAME

PURPOSE: Microelectromechanical valves including single crystalline material components and method of manufacturing the same is provided to achieve great out-of-plane stiffness, robust and be controllably and efficiently heated and actuated. CONSTITUTION: A microelectromechanical valve comprises a microelectronic substrate(50) defining at least one opening(40) therethrough, a thermally actuated microactuator(20) disposed upon the substrate and comprised of a single crystalline material, and at least one valve plate(30) comprised of a single crystalline material and having at least one valve seat, the at least one valve plate being operably engaged with the microactuator and adapted to move the at least one valve seat between a disengaged open position and an engaged closed position with respect to the at least one opening upon thermal actuation of the microactuator. © KIPO 2002 ...

DIRECT ACTING VERTICAL THERMAL ACTUATOR WITH CONTROLLED BENDING

A micrometer sized, single-stage, vertical thermal actuator with controlled bending capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator bends generally at the flexure so that the member moves away from the substrate when current is applied to at least the hot arm.

Method of making an integrated electromechanical switch and tunable capacitor

A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are described. Both electromechanical devices include movable beams actuated either by thermo-mechanical or by electrostatic forces. The devices are fabricated directly on finished silicon-based integrated circuit wafers, such as CMOS, BiCMOS or bipolar wafers. The movable beams are formed by selectively removing the supporting silicon underneath the thin films available in a silicon-based integrated circuit technology, which incorporates at least one polysilicon layer and two metallization layers. A cavity and a thick, low-loss metallization are used to form an electrode above the movable beam. A thick mechanical support layer is formed on regions where the cavity is located, or substrate is bulk-micro-machined, i.e., etched.

Thermal arched beam microelectromechanical structure

A MEMS actuator is provided that produces significant forces and displacements while consuming a reasonable amount of power. The MEMS actuator includes a microelectronic substrate, spaced apart supports on the substrate and a metallic arched beam extending between the spaced apart supports. The MEMS actuator also includes a heater for heating the arched beam to cause further arching of the beam. In order to effectively transfer heat from the heater to the metallic arched beam, the metallic arched beam extends over and is spaced, albeit slightly, from the heater. As such, the MEMS actuator effectively converts the heat generated by the heater into mechanical motion of the metallic arched beam. A family of other MEMS devices, such as relays, switching arrays and valves, are also provided that include one or more MEMS actuators in order to take advantage of its efficient operating characteristics. In addition, a method of fabricating a MEMS actuator is further provided.

MULTI-DIRECTIONAL THERMAL ACTUATOR

A micrometer sized multi-directional thermal actuator capable of repeatable and rapid displacement in a substantially horizontal direction, a substantially vertical direction, and/or a combination thereof. The multi-directional thermal actuator constructed on a surface of a substrate includes three or more beams each cantilevered from one or more anchors at a first end to extend generally parallel to the surface of the substrate. A member mechanically and electrically couples the distal ends of the beams. Application of current to a circuit comprising combinations of any two or more of the beams displaces the member in one of three or more non-parallel radial directions, respectively.

THERMAL ARCHED BEAM MICROELECTROMECHANICAL DEVICES AND ASSOCIATED FABRICATION METHODS

Multidirektionale Übersetzungs- und Neigungsplattform unter Verwendung von Biegeaktuatoren als aktive Entität

Ausführungsbeispiele stellen eine Plattform bereit, die eine erste Betätigungsschicht und eine zweite Betätigungsschicht aufweist. Die erste Betätigungsschicht weist einen ersten Rahmen, einen zweiten Rahmen und eine Mehrzahl von Aktuatoren auf, die zwischen den ersten Rahmen und den zweiten Rahmen geschaltet sind, wobei die Mehrzahl von Aktuatoren angepasst ist, den ersten Rahmen und den zweiten Rahmen in Bezug zueinander in einer ersten Richtung zu bewegen. Die zweite Betätigungsschicht weist einen dritten Rahmen, einen vierten Rahmen und eine Mehrzahl von Aktuatoren auf, die zwischen den dritten Rahmen und den vierten Rahmen geschaltet sind, wobei die Mehrzahl von Aktuatoren angepasst ist, den dritten Rahmen und den vierten Rahmen in Bezug zueinander in einer zweiten Richtung, die von der ersten Richtung verschieden ist, zu bewegen. Dadurch sind der vierte Rahmen der zweiten Betätigungsschicht und der zweite Rahmen der ersten Betätigungsschicht mechanisch miteinander verbunden, sodass ...

Actuator based on carbon nanotubes and actuating system

Method for producing a multilayer piezoelectric microcomponent using sacrificial thick film technology

The invention relates to the preparation of multilayer microcomponents which comprise one or more films, each consisting of a material M selected from metals, metal alloys, glasses, ceramics and glass-ceramics. The method consists in depositing on a substrate one or more films of an ink P, and one or more films of an ink M, each film being deposited in a predefined pattern selected according to the structure of the microcomponent, each film of ink P and each film of ink M being at least partially consolidated before deposition of the next film; effecting a total consolidation of the films of ink M partially consolidated after their deposition, to convert them to films of material M; totally or partially removing the material of each of the films of ink P. An ink P consists of a thermoset resin containing a mineral filler or a mixture comprising a mineral filler and an organic binder. An ink M consists of a mineral material precursor of the material M and an organic binder. The inks are ...

Microactuators including a metal layer on distal portions of an arched beam

A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate and a thermally actuated microactuator and associated components disposed on the substrate and formed as a unitary structure from a single crystalline material, wherein the associated components arc actuated by the microactuator upon thermal actuation thereof. For example, the MEMS device may be a valve. As such, the valve may include at least one valve plate that is controllably brought into engagement with at least one valve opening in the microelectronic substrate by selective actuation of the microactuator. While the MEMS device can include various microactuators, the microactuator advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch such that the microactuator moves between a closed position in which the valve plate sealingly engages the valve opening and an open position in which the valve plate is at least partly disengaged from and does not seal the valve opening. The microactuator may further include metallization traces on distal portions of the arched beams to constrain the thermally actuated regions of arched beams to medial portions thereof. The valve may also include a latch for maintaining the valve plate in a desired position without requiring continuous energy input to the microactuator. An advantageous method for fabricating a MEMS valve having unitary structure single crystalline components is also provided.

A MEMS DEVICE WITH BI-DIRECTIONAL ELEMENT

Mikromechanischer Aktuator

Mikromechanischer Aktuator (1), aufweisend: - ein bewegbares erstes Federelement (2), welches Metall und/oder Silizium aufweist, wobei das erste Federelement (2) an einer ersten Stelle (10) angebracht ist und an einer zweiten Stelle frei bewegbar ist, - ein mit dem ersten Federelement (2) verbundenes zweites Federelement (12), welches Silizium aufweist, - ein elektrisch isolierendes Material (20), auf welchem das zweite Federelement (12) teilweise angeordnet ist, und - ein Substrat (11), auf welchem das elektrisch isolierende Material (20) angebracht ist, wobei das zweite Federelement (12) in einem Abstand zum Substrat (11) oberhalb des Substrates (11) in einer ersten Ebene (17) angeordnet ist und das erste Federelement (2) oberhalb des zweiten Federelementes (12) in einer zweiten Ebene (18) angeordnet ist, wobei die zweite Ebene (18) von der ersten Ebene (17) beabstandet ist, so dass das erste Federelement (2) und das zweite Federelement (12) gegenüber dem Substrat (11) bewegbar sind.

Combination horizontal and vertical thermal actuator

Buckle resistant thermal bend actuators

Light responsive polymer magnetic microrobots

A microrobot is disclosed. The microrobot includes a magnet configured to provide a motive force when magnetic force of one or more electrical coils act upon the magnet, a support member coupled to the magnet, a thermo-responsive polymer member coupled to each end of the support member at a proximal end, the thermo-responsive polymer member configured to articulate when heated, wherein the thermo-responsive polymer members configured to receive light from a microrobot structured light system and convert the received light into heat.

Light responsive polymer magnetic microrobots

A microrobot is disclosed. The microrobot includes a magnet configured to provide a motive force when magnetic force of one or more electrical coils act upon the magnet, a support member coupled to the magnet, a thermo-responsive polymer member coupled to each end of the support member at a proximal end, the thermo-responsive polymer member configured to articulate when heated, wherein the thermo-responsive polymer members configured to receive light from a microrobot structured light system and convert the received light into heat.

MEMS DEVICE MANUFACTURING METHOD, MEMS DEVICE, AND SHUTTER APPARATUS USING THE SAME

Provided is a method including at least the thermal treatment step of thermally treating a SOI substrate having a first silicon layer at a first temperature that the diffusion flow rate of an interstitial silicon atom in a silicon single crystal is higher than the diffusion flow rate of an interstitial oxygen atom and the processing step of processing the SOI substrate after the thermal treatment step to obtain a displacement enlarging mechanism. 1. A MEMS device manufacturing method comprising: at leasta thermal treatment step of thermally treating a substrate having a silicon layer at a first temperature that a diffusion flow rate of an interstitial silicon atom in a silicon single crystal is higher than a diffusion flow rate of an interstitial oxygen atom; anda processing step of processing the substrate after the thermal treatment step to obtain a MEMS device.2. The MEMS device manufacturing method according to claim 1 , whereinat the step performed after the thermal treatment step, a temperature applied to the silicon layer is equal to or lower than a second temperature that the diffusion flow rate of the interstitial oxygen atom in the silicon single crystal is higher than the diffusion flow rate of the interstitial silicon atom and precipitated oxide contained in the silicon layer does not substantially grow.3. The MEMS device manufacturing method according to claim 1 , whereinthe substrate is a multilayer bonded substrate configured such that a handle layer, an insulating layer, and a device layer are stacked on each other in this order, andthe device layer is the silicon layer, and is formed using a silicon substrate manufactured by a Czochralski (CZ) method.4. The MEMS device manufacturing method according to claim 1 , wherein{'sup': 17', '3', '18', '3, 'the silicon layer contains a predetermined concentration of oxygen, and the predetermined concentration is in a range of 5×10/cmto 1×10/cm.'}5. The MEMS device manufacturing method according to claim 1 , ...

MEMS ISOLATION STRUCTURES

A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material. 120-. (canceled)21. A microelectromechanical systems (MEMS) device comprising:a substrate having a first outer surface and a second outer surface opposite said first outer surface;a channel formed in said substrate, said channel having a first opening defined by said first outer surface of said substrate, said channel being at least partially bounded by a first side wall and an opposite facing second side wall, said first side wall and said second side wall extending from said first outer surface toward said second outer surface; anda first body of circuitry material having a first portion disposed in said channel and a second portion extending over said first outer surface of said substrate, said second portion of said first body of circuitry material extending from said first portion of said first body of circuitry material.21. The MEMS device of claim 21 , wherein:said first portion of said first body of circuitry material is spaced apart from said first side wall of said channel, defining a first gap between said first portion of said first body of circuitry material and said first sidewall of said channel;said first portion of said first body of circuitry material is spaced apart from said second side wall of said channel, defining a second gap between said first portion of said first body of circuitry material and said second sidewall of said channel; andsaid second portion of said first body of circuitry material is spaced apart from said first outer surface of said substrate, defining a third gap between said second portion of said first body of circuitry material and said first outer surface of said ...

MICROELECTROMECHANICAL AND/OR NANOELECTROMECHANICAL STRUCTURE WITH ELECTROTHERMAL ACTUATION COMPRISING AT LEAST TWO DIFFERENTLY POLARISABLE ACTUATING BEAMS

A microelectromechanical structure with electrothermal actuation including a fixed part, a moveable part, a first electrothermal actuating beam enabling an electric current to flow from the fixed part to the moveable part and a second electrothermal actuating beam enabling an electric current to flow from the fixed part to the moveable part, the beams being mechanically connected to the moveable part enabling a displacement of the moveable part by electrothermal actuation, an electrically conductive connecting element connecting the moveable part to the fixed part, a first connector for connecting the first actuating beam to a first polarisation source and a second connector for connecting the second actuating beam to a second polarisation source, such that the first and the second can be polarised differently and separately. 1. A microelectromechanical and/or nanoelectromechanical structure with electrothermal actuation comprising a fixed part , at least one moveable part with respect to the fixed part , at least one first electrothermal actuating beam enabling an electric current to flow from the fixed part to the moveable part and at least one second electrothermal actuating beam enabling an electric current to flow from the fixed part to the moveable part , said first and\or second actuating beam being a nanowire; said first and second actuating beams being connected at least mechanically to the moveable part and configured to displace the moveable part with respect to the fixed part by electrothermal actuation , at least one electrically conductive connecting element electrically connecting the moveable part to the fixed part , a first circuitry for connecting the first actuating beam to a first polarisation source and second circuitry for connecting the second actuating beam to a second polarisation source , such that the first and the second can be polarised differently and separately.2. The structure according to claim 1 , in which the first and second ...

INTEGRATED MECHANICAL DEVICE WITH VERTICAL MOVEMENT

A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit. 1. An integrated circuit , comprising:a substrate;an interconnection region overlying the substrate, the interconnection region comprising a plurality of metallization levels and a via level; a first element located within a first metallization level of the plurality of metallization levels, the first element extending from the fixed end zone into the cavity;', 'a second element secured to an underside of the first element and located within the via level, which is adjacent to the first metallization level, the second element extending from the fixed end zone into the cavity, wherein a length of the first element is greater than a length of the second element; and', 'an electrically conductive body arranged at least partly in the cavity, the thermally deformable electrically conductive assembly having different configurations corresponding respectively to different distances along a direction between the free end zone and the electrically conductive body, the thermally deformable electrically conductive assembly being activatable in order to change from one configuration to another, wherein one of the configurations corresponds to a zero distance such that only the first element at the free end zone is in physical contact with the electrically conductive body so as to establish an electrical connection passing through the electrically conductive body and the thermally deformable electrically conductive assembly, wherein the first metallization level and the first via level have the same metal and wherein the second element comprises an insulating portion between two metal portions., 'a device comprising a thermally deformable electrically conductive ...

Multidirectional translating and tilting platform using bending actuators as active entity

A platform includes first and second actuation layers. The first actuation layer includes first and second frames and a plurality of actuators connected between the first frame and the second frame, wherein the plurality of actuators are adapted to move the first and second frames with respect to each other in a first direction. The second actuation layer includes third and fourth frames and a plurality of actuators connected between the third frame and the fourth frame, wherein the plurality of actuators are adapted to move the third frame and the fourth frame with respect to each other in a second direction, different from the first direction. Thereby, the fourth frame of the second actuation layer and the second frame of the first actuation layer are mechanically connected to each other, such that the second actuation layer experiences the movement in the first direction induced by the first actuation layer.

Systems and methods for micro-cantilever actuation by base excitation

A system and methods for base excitation of moderately high vibration of micro-cantilevers are disclosed. A micro-cantilever may be coupled to one or more actuators adjacent its base. The actuators may comprise bulk materials, bridges, or formed wires that expand and contract by application of electric currents, due to, for example, the effect of electro-thermal heating or piezoelectric effects. Single actuators or an array of actuators may be placed around the micro-cantilever to oscillate it and apply actuation pulses. The system and methods, and adjustments of the geometrical parameters, may be performed to yield a nominal natural frequency in the system. The excitation of actuators with signals corresponding to the natural frequency may induce resonance in the system and may result in high amplitude vibrations and displacement of the cantilever tip of the micro-cantilever. Various architectures of the actuators may be implemented to stimulate different frequencies of the beam and induce displacement in different direction and amplitudes.

MEMS isolation structures

A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material. 1. A device comprising:a substrate formed of a first material;a trench formed in the substrate; anda second material formed in the trench, the second material having first and second portions isolated with respect to one another and isolated with respect to the first material.2. The device as recited in claim 1 , wherein the first and second portions are mechanically isolated with respect to one another and are mechanically isolated with respect to the first material.3. The device as recited in claim 1 , wherein the first and second materials are conductors or semiconductors and wherein the first and second portions are electrically isolated with respect to one another and are electrically isolated with respect to the first material.4. The device as recited in claim 1 , further comprising a pinch formed in the trench to facilitate isolation of the first and second portions of the second material.5. The device as recited in claim 4 , wherein the pinch is defined by a narrowing of the trench.6. The device as recited in claim 1 , wherein the trench becomes more narrow from a top of the substrate to a bottom of the substrate.7. The device as recited in claim 1 , wherein the second material extends over at least a portion of a top of the first material.8. The device as recited in claim 1 , wherein the first material comprises single crystalline silicon and the second material comprises polysilicon.9. An electronic device comprising the device of .10. A system comprising:an actuator device having a substrate formed of a first material;a trench formed in the substrate; anda second material formed in the trench, the ...

MICROELECTRONIC STRUCTURE WITH VISCOUS DAMPING CONTROLLED BY CONTROLLING A THERMO-PIEZORESISTIVE EFFECT

Microelectronic structure comprising at least one movable mass that is mechanically connected to a first mechanical element by a first mechanically linking connector and to a second mechanical element () by electrically conductive second mechanically linking connector, and a device for electrically biasing the second mechanically linking connector, the second mechanically linking connector being such that they are the seat of a thermo-piezoresistive effect, the second linking connector and the movable mass being placed with respect to each other so that a movement of the movable mass applies a mechanical stress to the second linking connector, wherein the electrically biasing device are DC voltage biasing device and form, with at least the second mechanically linking connector, a thermo-piezoresistive feedback electric circuit.

Mems-based micro and nano grippers with two- axis force sensors

The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.

Thermal micro-actuator based on selective electrical excitation

A thermal microactuator is provided that can be deflected in multiple positions. The actuator has a hot arm and a cold arm coupled together at their distal ends suspended above a reference plane of a substrate. A potential difference is applied across the hot arm so that a current circulates through the hot arm but not the cold arm.

MEMS-based micro and nano grippers with biaxial force sensors

Micro-Pump for Lab-on-a-chip and the Method of producting that

본 발명은 랩온어칩용 마이크로 펌프, 마이크로 펌프 제조 방법 및 이를 이용한 유체 이동 방법에 관한 것으로서, 랩온어칩(Lab on a chip)용 마이크로 펌프에 있어서, 랩온어칩의 마이크로 채널 내부의 적어도 일부분에 온도변화에 따라 수축 또는 팽창하는 온도감응성 고분자를 고정시키고, 상기 온도감응성 고분자가 고정된 마이크로 채널 부분의 온도를 조절하여 상기 온도감응성 고분자의 수축 또는 팽창으로 상기 마이크로 채널 내의 미세 유체를 이동시키는 것을 특징으로 하는 랩온어칩용 마이크로 펌프이며, 본 발명에 의하면, 간단한 구성으로 마이크로 채널 상의 유체를 이동시킬 수 있어 랩온어칩을 단순화 및 소형화하는데 기여할 수 있다. The present invention relates to a micropump for a lab-on-a-chip, a micropump manufacturing method, and a fluid transfer method using the same. In a micro-pump for a lab-on-a-chip, a temperature in at least a portion of a micro-channel of a lab-on-a-chip is Fixing the temperature-sensitive polymer shrinking or expanding in accordance with the change, by controlling the temperature of the microchannel portion in which the temperature-sensitive polymer is fixed to move the microfluid in the microchannel by the contraction or expansion of the temperature-sensitive polymer The micro-pump for a lab-on-a-chip, and according to the present invention, it is possible to move the fluid on the micro-channel with a simple configuration can contribute to simplify and miniaturization of the lab-on-a-chip. 랩온어칩, 온도감응성, 마이크로채널, 마이크로펌프. Lab-on-a-chip, temperature sensitive, microchannel, micropump.

Mems-based micro and nano grippers with two- axis force sensors

MEMS-based micro and nano grippers with two-axis force sensors

The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.

MEMS-based micro and nano grippers with two axis force sensors

The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.

Electrothermally-driven mems microgrippers with integrated dual-axis capacitive force sensors

The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two- axis force sensing capabilities.

Mems-based micro and nano grippers with two- axis force sensors

MEMS-based micro and nano grippers with biaxial force sensors

広範囲のサイズのマイクロ物品およびナノ物品を把持できかつ二軸の力の検出能力を備えているマイクログリッパの設計およびマイクロファブリケーション法を提供する。グリッピング運動は、１つ以上の電熱アクチュエータにより引起こされる。ｘ方向およびｙ方向に沿う集積形の力センサは、グリップ力並びに法線方向に沿ってマイクログリッパアームの端部に加えられる力を測定でき、両方ともナノニュートンより小さい分解能を有する。マイクロファブリケーション法は、アクチュエータおよび力センサのモノリシック集積を可能にする。 【選択図】 図１

Mems-based micro and nano grippers with two- axis force sensors

The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.

Shape-Morphable Soft Actuator

본 발명에 따른 소프트 액추에이터는 서로 상이한 열팽창계수를 갖는 제1유연층과 제2유연층을 포함하는 자극반응부; 및 상기 자극반응부와 접하여 위치하고, 1차원 전도성 나노구조체의 네트워크이며 위치에 따라 상이한 면저항을 갖는 전도성 네트워크를 포함하는 가열부;를 포함한다. A soft actuator according to the present invention includes: a stimulus response unit including a first flexible layer and a second flexible layer having different coefficients of thermal expansion; and a heating unit located in contact with the stimulus response unit, a network of one-dimensional conductive nanostructures, and including a conductive network having different sheet resistance depending on the position.

Microstage having piezoresistive sensor and chevron beam structure

본 발명은 압저항 변위센서 및 쉐브론 빔 구조를 가지는 마이크로스테이지에 관한 것으로서, 정확한 위치제어를 위한 압저항 변위센서가 내부에 집적되어 있으며, 대변위를 갖는 열구동기의 변위를 증폭시키기 위하여 쉐브론 빔 구조를 가지는 압저항 변위센서 및 쉐브론 빔 구조를 가지는 마이크로스테이지를 제공함에 그 목적이 있다. The present invention relates to a microstage having a piezoresistive displacement sensor and a chevron beam structure. A piezoresistive displacement sensor for accurate position control is integrated therein and a chevron beam structure for amplifying displacement of a thermal actuator having a large displacement. It is an object of the present invention to provide a micro stage having a piezoresistive displacement sensor having a chevron beam structure. 이러한 목적을 달성하기 위한 본 발명은, 사각형상으로서, 그 중앙부에 샘플이 놓여지는 플랫폼; 상기 플랫폼의 일측면으로부터 연장되며, 특정 축으로의 처짐현상을 방지하기 위한 전극이 배치되는 연장 빔; ' V ' 형상이며, 그 중심부가 상기 연장 빔과 연결되어, 열구동기가 구동되었을 경우 상기 연장 빔을 끌어 당김으로써 플랫폼을 구동시키는 쉐브론 빔; 및 전압이 인가되면 줄열을 발생시킴으로써 특정 방향으로 구동되며, 압저항 변위센서가 각각 집적화된 2개의 열구동기; 를 포함하되, 상기 연장 빔, 쉐브론 빔 및 2개의 열구동기는, 상기 플랫폼의 네 측면으로부터 각각 연장되어, 상기 플랫폼을 기준으로 상하 좌우 대칭구조를 가지도록 형성되는 것을 특징으로 한다. The present invention for achieving this object, the rectangular shape, the platform on which the sample is placed; An extension beam extending from one side of the platform and having an electrode disposed thereon to prevent deflection on a specific axis; A chevron beam having a 'V' shape, the center of which is connected to the extension beam to drive the platform by attracting the extension beam when a heat driver is driven; And two heat drivers each of which is driven in a specific direction by generating joule heat when a voltage is applied, and each of which has a piezoresistive displacement sensor integrated therein; Including, the extension beam, the chevron beam and the two thermal actuators, each extending from the four sides of the platform, characterized in that formed to have a vertical symmetry structure with respect to the platform. 마이크로스테이지, 변위, 압저항, 쉐브론 빔 Microstage, Displacement, Piezoresistive, Chevron Beam

Buckle resistant thermal bend actuators

The invention relates to a thermal bend actuator 7 including: a first anchor portion 9 for securing to a fixed substrate 2; a first thermally conductive active beam member 10 secured at a proximal end to said first anchor portion 9 and extending to a movable distal end; a second beam member 12 similarly anchored at a proximal end to said first anchor portion 9 so as to extend parallel to said first active beam member 10, each of said first and second beam members being directly or indirectly interconnected at their respective proximal ends remote said first anchor portion 9; wherein said first thermally conductive active beam member 10 is configured to define a labyrinthine conductive pathway 14 having a combined effective length in a direction extending between said fixed proximal end and said movable distal end that exceeds twice the effective direct linear path therebetween.

A kind of preparation method of the actuator based on carbon nanotube

本发明涉及一种致动器的制备方法，该方法包括以下步骤：提供一碳纳米管层；在所述碳纳米管层的表面设置一氧化钒层；以及在含氧气氛中退火使所述氧化钒层转变为二氧化钒层。本发明的致动器采用碳纳米管层与二氧化钒层复合结构。由于二氧化钒层相变时形变较大，响应速率快，因此该致动器具有较大的形变和较快的响应速率。

Thermal actuator

열 굽힘 액츄에이터는, 아암의 강성을 증가시키도록 비(非)평면 형상인 상부 아암(23, 25, 26)과 하부 아암(27, 28)을 구비하고 있다. 이들 아암(23, 25, 26, 27, 28)은 횡방향으로 간격을 두고 서로 떨어져 있고, 평면에서 보아, 서로 겹치지 않게 되어 있어, 모든 아암을 단일의 아암 형성 재료 층을 퇴적하여 형성할 수 있다. The thermal bending actuator has a non-planar upper arm 23, 25, 26 and lower arms 27, 28 to increase the rigidity of the arm. These arms 23, 25, 26, 27, 28 are spaced apart from one another in the transverse direction and are not overlapped with each other in plan view so that all arms can be formed by depositing a single layer of arm forming material. . 마이크로머신, 아암, 강도, 평면, 비평면, 액츄에이터, 열 굽힘, 잉크젯, 마이크로 전자기계 Micromachines, Arms, Strength, Planar, Non-Plane, Actuator, Thermal Bending, Inkjet, Micro Electromechanical

Thermal arched beam microelectromechanical valve

A MEMS actuator is provided that produces significant forces and displacements while consuming a reasonable amount of power. The MEMS actuator includes a microelectronic substrate, spaced apart supports on the substrate and a metallic arched beam extending between the spaced apart supports. The MEMS actuator also includes a heater for heating the arched beam to cause further arching of the beam. In order to effectively transfer heat from the heater to the metallic arched beam, the metallic arched beam extends over and is spaced, albeit slightly, from the heater. As such, the MEMS actuator effectively converts the heat generated by the heater into mechanical motion of the metallic arched beam. A family of other MEMS devices, such as relays, switching arrays and valves, are also provided that include one or more MEMS actuators in order to take advantage of its efficient operating characteristics. In addition, a method of fabricating a MEMS actuator is further provided.

Thermomechanical in-plane microactuator

A microactuator (10) providing an output force and displacement in response to an increase in thermal energy is disposed. The microactuator (10) may have a substantially straight expansion member (20, 22) with a first and a second end. The first end may be coupled to a base (12, 16) and a second end may be coupled to a shuttle (24). The expansion member is capable of elongating in a elongation direction. Elongation of the expansion member may urge the shuttle to translate in an output direction substantially different than the elongation direction. In certain embodiments, multiple expansion members are arrayed along one side of the shuttle to drive the shuttle against a surface. Alternatively, expansion members may be disposed on both sides of the shuttle to provide balanced output force. If desired, multiple microactuators may be linked together to multiply the output displacement and/or output force.

Thermal expansion micro actuator, micro mirror formed directly on the same, micro mirror actuating apparatus using thermal expansion micro actuator, and light switch using the same

본 발명에 따른 열 마이크로 구동기는 고온부와, 저온부와, 상기 고온부 및 상기 저온부의 일단이 각각 연결된 연결부와, 상기 고온부의 타단에 형성된 제1 전극부와, 상기 저온부의 타단에 형성된 제2 전극부로 구성된 열 마이크로 구동기에 있어서, 상기 고온부의 외면(外面)에 순차적으로 적층된 절연층과 메탈층을 포함하여 구성되며, 상기 제1 전극부 및 상기 제2 전극부에 전류를 통전시킬 때, 상기 메탈층 및 상기 고온부의 열팽창률 차이에 따라 굴곡되는 제1 변위와, 상기 고온부 및 상기 저온부의 저항차이에 따라 굴곡되는 제2 변위가 합성된 합성변위가, 상기 저온부 측으로 발생하도록 구성한다. The thermal micro driver according to the present invention includes a high temperature part, a low temperature part, a connection part to which one end of the high temperature part and the low temperature part are respectively connected, a first electrode part formed at the other end of the high temperature part, and a second electrode part formed at the other end of the low temperature part. A thermal micro driver, comprising an insulating layer and a metal layer sequentially stacked on an outer surface of the high temperature portion, wherein the metal layer is formed by energizing the first electrode portion and the second electrode portion. And a synthetic displacement in which the first displacement bent according to the thermal expansion coefficient difference of the high temperature part and the second displacement bent according to the resistance difference of the high temperature part and the low temperature part are generated on the low temperature part side. 이를 통해, 본 발명에 의한 열 마이크로 구동기는 2가지 구동한계 요소(최대허용온도 및 항복응력)를 최대한도 범위 내에서 충족시키면서, 종래의 열 마이크로 구동기보다 더 큰 변위를 얻을 수 있다. Through this, the thermal micro driver according to the present invention can achieve a larger displacement than the conventional thermal micro driver while satisfying two driving limit factors (maximum allowable temperature and yield stress) within the maximum range. 열 마이크로 구동기, 차동저항, 바이메탈, 마이크로 미러 Thermal Micro Drivers, Differential Resistors, Bimetal, Micro Mirror

Realization of piezoelectric microcomponents suspended by the sacrificial thick layer procedure

Procedimiento para la fabricación de un microcomponente piezoeléctrico suspendido que comprende unelectrodo inferior (3) y un electrodo superior (4), consistiendo dicho procedimiento en:1) Depositar sobre un sustrato de alúmina, una primera capa provisional de una tinta (P) constituida poruna resina termoendurecible epoxi que contiene SrCO3 como carga mineral, y en consolidar dichacapa:2) Depositar, en ambos lados de la primera capa provisional de tinta (P), una primera capa de tinta de oro(M1) en forma de dos zonas, y en consolidar parcialmente dicha capa (M1);3) Depositar una segunda capa de tinta de oro (M'1) según un modelo que representa la forma delelectrodo inferior (3), únicamente encima de la primera capa provisional de tinta (P) y de tal modo quedicha segunda capa de tinta de oro (M'1) establezca contacto con una primera de dichas dos zonasque forman la primera capa de tinta de oro (M1), y en consolidar parcialmente dicha capa (M'1);4) Depositar, únicamente sobre la parte de la segunda capa de tinta de oro (M'1) que representa elelectrodo inferior (3), una cuarta capa de tinta (M2), conteniendo dicha cuarta capa un aglutinanteorgánico y un polvo que comprende PbZr0,5Ti0,5O3 y un eutéctico PbO/PbF2, y en consolidarparcialmente dicha capa (M2);5) Depositar una segunda capa provisional de tinta (P') constituida por una resina termoendurecible epoxique contiene SrCO3 como carga mineral, para aislar eléctricamente los dos electrodos (3, 4),disponiéndose la segunda capa provisional de tinta (P') directamente sobre una superficie libre de laprimera capa provisional de tinta (P) entre la segunda capa de tinta de oro (M'1) y la segunda dedichas dos zonas que forman la primera capa de tinta de oro (M1), y en consolidar dicha capa (P');6) Depositar una tercera capa de tinta de oro (M''1), encontrándose contenida dicha capa en el modelo dela cuarta capa de tinta (M2) de tal modo que establezca contacto con la segunda de dichas ...

Microelectromechanical and/or nanoelectromechanical structure with electrothermal actuation comprising at least two differently polarisable actuating beams

A microelectromechanical structure with electrothermal actuation including a fixed part, a moveable part, a first electrothermal actuating beam enabling an electric current to flow from the fixed part to the moveable part and a second electrothermal actuating beam enabling an electric current to flow from the fixed part to the moveable part, the beams being mechanically connected to the moveable part enabling a displacement of the moveable part by electrothermal actuation, an electrically conductive connecting element connecting the moveable part to the fixed part, a first connector for connecting the first actuating beam to a first polarisation source and a second connector for connecting the second actuating beam to a second polarisation source, such that the first and the second can be polarised differently and separately.

Method of making a thermal bend actuator

A method of forming a thermal bend actuator ( 6 ) is provided with upper arms ( 23, 25, 26 ) and lower arms ( 27, 28 ) which are non planar, so increasing the stiffness of the arms. The arms ( 23, 25, 26, 27, 28 ) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material.

Structure having microchannel and sensor and heater contacting with fluid in microchannel and method for manufacturing the same

마이크로 채널과 마이크로 채널내 유체와 직접 접촉하는 센서와 히터를 구비하는 구조물 및 그 제조 방법에 관해 개시되어 있다. 개시된 본 발명은 일면에 마이크로 채널 형성을 위한 소정 길이의 홈이 형성된 반도체 기판과, 일면이 상기 반도체 기판의 상기 홈이 형성된 면과 접합된 유리 기판을 구비하되, 상기 두 기판 사이에는 마이크로 채널을 흐르는 유체의 물리적 특성을 직접적으로 측정할 수 있는 센서, 상기 마이크로 채널내 임의의 위치에서 상기 유체를 직접 히팅하기 위한 국소 히터 및 상기 마이크로 채널의 일단의 둘레에 메인 히터가 구비된 것을 특징으로 하는 마이크로 채널을 구비하는 구조물을 제공한다. Disclosed are a structure having a microchannel and a sensor and a heater in direct contact with a fluid in the microchannel and a method of manufacturing the same. The present invention includes a semiconductor substrate having a groove having a predetermined length for forming a microchannel on one surface thereof, and a glass substrate bonded to the surface of the groove on which one surface of the semiconductor substrate is formed, wherein a microchannel flows between the two substrates. A microchannel comprising a sensor capable of directly measuring the physical properties of the fluid, a local heater for directly heating the fluid at any position in the microchannel, and a main heater around one end of the microchannel. It provides a structure having a.

Thermomechanical in-plane microactuator

A microactuator ( 10 ) providing an output force and displacement in response to an increase in thermal energy is disposed. The microactuator (10) may have a substantially straight expansion member ( 20, 22 ) with a first and a second end. The first end may be coupled to a base ( 12, 16 ) and a second end may be coupled to a shuttle ( 24 ). The expansion member is capable of elongating in a elongation direction. Elongation of the expansion member may urge the shuttle to translate in an output than the elongation direction. In certain embodiments, multiple expansion members are arrayed along one side of the shuttle to drive the shuttle against a surface. Alternatively, expansion members may be disposed on both sides of the shuttle to provide balanced output force. If desired, multiple microactuators may be linked together to multiply the output displacement and/or output force.

Micromechanical thermal actuator

The present invention provides a microelectromechanical element comprising a cold beam and at least a first beam pair comprising a first beam member and a second beam member, the beam pair being coupled to said cold beam by a free end tether and configured to elongate when heated to a greater temperature than a temperature of said cold beam thereby causing the assembly to deflect in a first direction determined by a movement plane. The first beam member and the second beam member of the beam pair are arranged to determine a beam plane such that the beam plane is at an angle α from the movement plane where α≠Kπ and K is an integer. Various embodiments further relate to microelectromechanical element capable of performing unidirectional in-plane deflection, unidirectional out-of-plane deflection and bi-directional inplane deflection, as well as a latching relay using a combination of a unidirectional out-of-plane element with a bi-directional in-plane element.

Device, system and method for thermal capnography

A device for measuring a concentration of a component in a target sample includes a flow chamber with a first channel that receives a reference sample having a known concentration of the component. The flow chamber also includes a second channel that receives the target sample having an unknown concentration of the component. A pump operates to pump the reference sample and the target sample at a same volume flow rate through the first and second channels, respectively. A thermal mass flow meter measures a thermal conductivity of the reference sample, a thermal conductivity of the target sample, or both.

Thermal arched beam microelectromechanical devices and associated fabrication methods

A MEMS actuator is provided that produces significant forces and displacements while consuming a reasonable amount of power. The MEMS actuator includes a microelectronic substrate, spaced apart supports on the substrate and a metallic arched beam extending between the spaced apart supports. The MEMS actuator also includes a heater for heating the arched beam to cause further arching of the beam. In order to effectively transfer heat from the heater to the metallic arched beam, the metallic arched beam extends over and is spaced, albeit slightly, from the heater. As such, the MEMS actuator effectively converts the heat generated by the heater into mechanical motion of the metallic arched beam. A family of other MEMS devices, such as relays, switching arrays and valves, are also provided that include one or more MEMS actuators in order to take advantage of its efficient operating characteristics. In addition, a method of fabricating a MEMS actuator is further provided.

Thermally-activated actuator

An actuator having a hot-arm and a cold-arm wherein the hot-arm and cold-arm vertically offset from one another. The hot-arm is heated to cause the actuator to move both vertically and horizontally. When used as a relay, an electrostatic force latches the actuator when the electrodes are brought in close proximity to one another.

Microelectromechanical device and system with low-impedance resistive transducer

A microelectromechanical device comprising a mechanical structure extending along a longitudinal direction, linked to a planar substrate by an anchorage situated at one of its ends and able to flex in a plane parallel to the substrate, the mechanical structure comprises a joining portion, which links it to each anchorage and includes a resistive region exhibiting a first and second zone for injecting an electric current to form a resistive transducer, the resistive region extending in the longitudinal direction from an anchorage and arranged so a flexion of the mechanical structure in the plane parallel to the substrate induces a non-zero average strain in the resistive region and vice versa; wherein: the first injection zone is carried by the anchorage; and the second injection zone is carried by a conducting element not fixed to the substrate and extending in a direction, termed lateral, substantially perpendicular to the longitudinal direction.

Microelectromechanical valve having single crystalline components and associated fabrication method

A microelectromechanical (MEMS) device (10) is provided that includes a microelectronic substrate (50) and a thermally actuated microactuator (20). For example, the MEMS device (10) may be a valve. As such, the valve may include at least one valve plate (30) that is controllably brought into engagement with at least one valve opening (40) in the microelectronic substrate (50) by selective actuation of the microactuator (20). While the MEMS device (10) can include various microactuators (20), the microactuator advantageously includes a pair of spaced apart supports (22) disposed on the substrate (50) and at least one arched beam (24) extending therebetween. The microactuator (20) may further include metallization traces (70) on distal portions (23) of the arched beams (24) to constrain the thermally actuated regions of arched beams to medial portions thereof. The valve may also include a latch (680) for maintaining the valve plate (30) in a desired position without requiring continuous energy input to the microactuator (20).

Micromechanical actuator

A micromechanical actuator includes a movable first spring element having metal and/or silicon. The first spring element is fitted at a first point and can move freely at a second point. A second spring element connected to the first spring element has silicon and is partially arranged on an electrically insulating material which is applied to a substrate. The second spring element is arranged at a distance from the substrate above the substrate on a first plane, and the first spring element is arranged above the second spring element on a second plane which is at a distance from the first plane such that the first and second spring elements can move with respect to the substrate. The actuator has a third spring element which is mechanically coupled to the first spring element. The elastic deformation of the second spring element can be induced by a length change of the third spring element.

Method of making an integrated electromechanical switch and tunable capacitor

A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are described. Both electromechanical devices include movable beams actuated either by thermo-mechanical or by electrostatic forces. The devices are fabricated directly on finished silicon-based integrated circuit wafers, such as CMOS, BiCMOS or bipolar wafers. The movable beams are formed by selectively removing the supporting silicon underneath the thin films available in a silicon-based integrated circuit technology, which incorporates at least one polysilicon layer and two metallization layers. A cavity and a thick, low-loss metallization are used to form an electrode above the movable beam. A thick mechanical support layer is formed on regions where the cavity is located, or substrate is bulk-micro-machined, i.e., etched.

Nano gripper and method of manufacturing the nano gripper

본 발명의 나노 그리퍼는, 대향하는 한쌍의 아암(71, 71)과, 이 한쌍의 아암(71, 71)의 선단부에 있어서의 대향면에, 선단끼리를 대향시켜서 각각 형성된 한쌍의 돌기부(72, 72)로 구성되어 있고, 이 돌기부(72)의 선단이, 50 나노미터 이하의 곡률이다. 또한, 이 돌기부(72)는, 실리콘의 결정이고, (100)면, (001)면 및 (111)면으로 구성된 정점을 구비한 삼각추의 형상이다. 그리고, 한쌍의 아암(71, 71)의 선단부끼리를 접근·이격시키는, 실리콘으로 만든 신축 자유로운 한쌍의 열팽창 액츄에이터(75, 76)가 설치되어 있다.

Actuator apparatus, electronic device, and control method

An actuator apparatus includes a pair of substrates facing each other; a plurality of bias actuators that each vary a gap dimension of a gap between the pair of substrates; a gap detection portion that detects the gap dimension; and a voltage control unit that controls driving of each of the bias actuators on the basis of the detected gap dimension. The bias actuators are located asymmetric relative to a driving central axis and are mutually independently driven; and the voltage control unit derives driving parameters for use in driving the bias actuators, on the basis of voltages and gap dimensions obtained by sequentially switching and driving the bias actuators on by one.

Mems device production method, mems device, and shutter device using same

シリコン単結晶中における格子間シリコン原子の拡散流速が格子間酸素原子の拡散流速よりも大きい第１の温度で第１シリコン層２１０を有するＳＯＩ基板２００を熱処理する熱処理工程と、熱処理工程の後にＳＯＩ基板２００を加工して変位拡大機構１０を得る加工工程と、を少なくとも備えている。

Thermal bend actuator

A thermal bend actuator ( 6 ) is provided with upper arms ( 23, 25, 26 ) and lower arms ( 27, 28 ) which are non planar, so increasing the stiffness of the arms. The arms ( 23, 25, 26,27,28 ) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material.

Thermally-activated actuator

An actuator having a hot-arm and a cold-arm wherein the hot-arm and cold-arm are vertically offset from one another. The hot-arm is heated to cause the actuator to move both vertically and horizontally. When used as a relay, an electrostatic force latches the actuator when the electrodes are brought in close proximity to one another.

局部的触覚作動システム

【課題】媒体の内部の複数の位置において局部的変形をもたらすことができる触覚アクチュエータデバイスを提供する。【解決手段】触覚アクチュエータデバイスは、、複数の領域の温度を、形状記憶材料の形状記憶転移温度よりも高い温度まで選択的に制御するステップ２１０と、領域のうちの少なくとも1つを選択的に変形させるステップ２２０と、少なくとも1つの領域の変形を維持したまま、その領域の温度を形状記憶転移温度未満まで低下させるステップ２３０と、次に、印加されたストレスを取り除くステップ２４０と、その後、この少なくとも1つの領域を、形状記憶転移温度よりも高い温度まで加熱して変形前の形状に戻すステップ２５０とを含む。【選択図】図２

Systems and methods for micro-cantilever actuation by base excitation

A system and methods for base excitation of moderately high vibration of micro-cantilevers are disclosed. A micro-cantilever may be coupled to one or more actuators adjacent its base. The actuators may comprise bulk materials, bridges, or formed wires that expand and contract by application of electric currents, due to, for example, the effect of electro-thermal heating or piezoelectric effects. Single actuators or an array of actuators may be placed around the micro-cantilever to oscillate it and apply actuation pulses. The system and methods, and adjustments of the geometrical parameters, may be performed to yield a nominal natural frequency in the system. The excitation of actuators with signals corresponding to the natural frequency may induce resonance in the system and may result in high amplitude vibrations and displacement of the cantilever tip of the micro-cantilever. Various architectures of the actuators may be implemented to stimulate different frequencies of the beam and induce displacement in different direction and amplitudes.

ベース励振によるマイクロ−カンチレバー作動のためのシステムおよび方法

【課題】熱作動およびベース励振技術の両方の効率的および実用的な特徴を兼ね備え、高周波数のマイクロカンチレバー振動を可能にする、マイクロ−カンチレバーアクチュエータシステムを備える方法を提供する。【解決手段】マイクロ−カンチレバーシステム１Ａに振動を誘導する方法であって、前記方法は、ベース励振を１以上のアクチュエータ１６の配列を有するマイクロ−カンチレバー１０の固定端に適用することを備え、前記アクチュエータ１６の配列は前記マイクロ−カンチレバー１０と機械的に連絡しており、前記アクチュエータ１６の配列の熱起動のためのエネルギは、電熱加熱、隣接媒体からの熱伝導、近くの媒体からの放射、またはそれらの組み合わせによって提供される、ことを特徴とする方法。【選択図】図１

ベース励振によるマイクロ－カンチレバー作動のためのシステムおよび方法

Systems and methods for micro-cantilever actuation by base excitation

Multidirectional translating and tilting platform using bending actuators as active entity

A platform (100) comprising a first actuation layer (102) and a second actuation layer (104) is provided. The first actuation layer (102) comprises a first frame (106), a second frame (108) and a plurality of actuators (110) connected between the first frame (106) and the second frame (108), wherein the plurality of actuators (110) are adapted to move the first frame and the second frame with respect to each other in a first direction (120). The second actuation layer (104) comprises a third frame (112), a fourth frame (114) and a plurality of actuators (116) connected between the third frame (112) and the fourth frame (114), wherein the plurality of actuators (116) are adapted to move the third frame (112) and the fourth frame (114) with respect to each other in a second direction (122,124,128), different from the first direction (120). The fourth frame of the second actuation layer and the second frame of the first actuation layer are mechanically connected to each other (118), such that the second actuation layer experiences the movement in the first direction induced by the first actuation layer.

基于异质驱动单元的微型热力阵列及其制备方法

本发明公开了一种基于异质驱动单元的微型热力阵列及其制备方法，所示基于异质驱动单元的微型热力阵列，包括：衬底，所述衬底上设有呈阵列状布置的多个微驱动器，所述微驱动器包括设于衬底表面上的薄膜电阻加热器以及导热硅柱，所述薄膜电阻加热器的表面设有聚合物驱动结构层，且所述导热硅柱内嵌于聚合物驱动结构层的内部。本发明能够改善内部热场分布均匀性和传输速度，有效提升热驱动的效率，能够显著的改善聚合物内部的温度场分布的均匀性，充分发挥聚合物的热膨胀系数大的优点，最大效率的提升驱动效率，提升驱动结构末端响应位移，能够实现对典型的微机电系统结构(如薄板等)加工误差或面外变形的精准调控/矫正。

Mikromechanische vorrichtungen mit thermischer bogentraverse und zugehörige herstellungsverfahren

用于通过基部激励进行微悬臂致动的系统和方法

公开了用于微悬臂的中等高度振动的基部激励的系统和方法。微悬臂可以被耦合到邻近其基部的一个或多个致动器。致动器可以包括块状材料、桥或成形的电线，由于例如电热加热效应或压电效应，他们通过施加电流而膨胀和收缩。单个致动器或致动器阵列可以被放置在微悬臂周围以使其振荡并施加致动脉冲。系统和方法以及几何参数的调整可以被执行以产生系统中的标称固有频率。利用对应于固有频率的信号的致动器的激励可以在系统中诱发共振并且可能导致微悬臂的悬臂尖端的高幅度振动和位移。致动器的各种架构可以被实现以刺激梁的不同频率并且诱发不同方向和幅度的位移。

MEMS device manufacturing method, MEMS device, and shutter apparatus using the same

Provided is a method including at least the thermal treatment step of thermally treating a SOI substrate having a first silicon layer at a first temperature that the diffusion flow rate of an interstitial silicon atom in a silicon single crystal is higher than the diffusion flow rate of an interstitial oxygen atom and the processing step of processing the SOI substrate after the thermal treatment step to obtain a displacement enlarging mechanism.

Herstellung von piezoelektrischen aufgehängten mikrokomponenten nach dem opfer- dickschichtverfahren

Verfahren zur herstellung mikromechanischer bauteile und nach dem verfahren hergestellte bauteile

Es wird ein Verfahren zur Herstellung mikromechanischer Bauteile angegeben, die mindestens eine elastische Federzunge enthalten, wobei diese Federzunge insbesondere durch galvanische Abscheidung, Sputtern, Aufdampfen und/oder Ätzen erzeugt wird. Das Verfahren ist dadurch gekennzeichnet, dass auf Bereiche der Federzunge thermisch eingewirkt wird und ein mechanischer Eigenspannungsgradient in der Federzunge erzeugt wird.

Light responsive polymer magnetic microrobots

A microrobot is disclosed. The microrobot includes a magnet configured to provide a motive force when magnetic force of one or more electrical coils act upon the magnet, a support member coupled to the magnet, a thermo-responsive polymer member coupled to each end of the support member at a proximal end, the thermo-responsive polymer member configured to articulate when heated, wherein the thermo-responsive polymer members configured to receive light from a microrobot structured light system and convert the received light into heat.

驱动组件及其制造方法

本发明涉及一种驱动组件及其制造方法，其中驱动组件包括基板、加热器、隔板和动力元件。隔板一端与所述基板相互固定连接，另一端向远离所述基板的方向延伸构成自由端，所述加热器设置于所述基板上，相邻所述隔板之间设有动力元件。当加热器通电后，动力元件受热膨胀，在横向和纵向上产生位移，即驱动组件产生驱动力，有效的解决现有迂回结构驱动器驱动方向刚度低，线性驱动差等问题。

Verbesserter aktor mit thermischer biegung

A mems device with bi-directional element

The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

A mems device with bi-directional element

The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

Mems device with bi-directional element

The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

In-plane MENS thermal actuator and associated fabrication methods

Semiconductor device

According to an embodiment, a semiconductor device includes a first actuator, a second actuator, a first frame provided between the first actuator and the second actuator, a first connection member connecting the first actuator and the first frame to each other, a second connection member connecting the first actuator and the first frame to each other at a position different from a position at which the first connection member connects the first actuator and the first frame to each other, a third connection member connecting the second actuator and the first frame to each other, a fourth connection member connecting the second actuator and the first frame to each other at a position different from a position at which the third connection member connects the second actuator and the first frame to each other.

국부적 햅틱 작동 시스템

햅틱 작동기 디바이스는 국부화된 온도 변화들에 응답하는 기계적 특성을 갖는 표면을 포함한다. 이 표면은 형상-기억 재료를 포함하는 층 또는 시트를 포함할 수 있다. 햅틱 작동기 디바이스는 시트 내의 복수의 영역을 선택적으로 변형시키도록 구성된 작동기; 및 복수의 영역의 온도들을 제어하도록 적응된 온도 제어기를 더 포함할 수 있다. 국부화된 작동의 방법은 복수의 영역의 온도들을 형상-기억 재료의 형상-기억 전이 온도 위로 되도록 선택적으로 제어하는 단계; 영역들 중 적어도 하나의 영역을 선택적으로 변형시키는 단계; 적어도 하나의 영역의 변형을 유지하면서, 적어도 하나의 영역의 온도를 형상-기억 전이 온도 아래로 낮추는 단계; 후속적으로 가해진 응력을 중단시키는 단계; 및 그 이후에 적어도 하나의 영역을 형상-기억 전이 온도 위로 가열하여, 영역을 그것의 변형 전 형상으로 복귀시키는 단계를 포함한다.

MEMS nanotube based thermal neutron detector

A MEMS nanotube based radiation sensor that is low cost, low power, compact, reliable and is applicable across many fields and a method for fabricating such a sensor are described. Each sensor may be connected to an array of similar but distinct sensors that leverage different materials and nanotube technology to detect radiation.

Direct acting vertical thermal actuator with controlled bending

Integrated circuit packages having stress-relieving features

Expansion compensating structures are formed in redistribution layers of a wafer-level chip-scale integrated circuit package (WLCSP) or other IC package having a low-expansion substrate. The structures include micromechanical actuators designed and oriented to move solder bumps attached to them in the same direction and distance as a function of temperature as do pads to which they may be connected on a higher-expansion substrate such as a printed circuit board. Expansion compensated IC packages incorporating these expansion compensating structures are provided, as well as expansion compensated assemblies containing one or more of these IC packages. Methods of fabricating expansion compensated IC packages requiring minimal changes to existing commercial WLCSP fabrication processes are also provided. These devices and methods will result in assemblies having improved board-level reliability during thermal cycling, and allow the use of larger IC die sizes in WLCSP technology.

超低功率熱致動振盪器及其驅動電路

本發明係揭露一種超低功率熱致動振盪器及其驅動電路，超低功率熱致動振盪器包含質量塊、熱致動元件及複數個驅動件。質量塊為對稱配置且由彈簧結構懸空連接於基板上。熱致動元件為線結構以有效減低運動阻抗和降低直流功率，其中，熱致動元件與質量塊或彈簧結構相連接。複數個驅動件則分別設置在熱致動元件兩側以提供驅動電流。當驅動電流流經熱致動元件時，使熱致動元件產生變形，以驅動質量塊產生振盪。

抑制位移输出端温升的电热微驱动器

本发明公开了一种抑制位移输出端温升的电热微驱动器，包括梭板梁，梭板梁两侧对称连接有驱动梁阵列，驱动梁阵列另一侧端面为锚点Ⅰ，锚点Ⅰ上沉积有驱动电极，所述梭板梁上沉积有梭板梁电极薄膜，梭板梁在水平方向上的长度大于或等于驱动梁阵列在水平方向上的长度的三分之一。所述梭板梁与位移输出终端之间设置有热阻，热阻为沿驱动位移方向的细长梁，热阻的末端两侧均连接有热沉，热沉外端连接有锚点Ⅱ，所述热沉为方波型或S型的柔性梁。与现有技术相比，本发明能够有效降低位移输出端的温升并在相同温升下增大电热驱动器的输出位移，在驱动器驱动方向刚度增幅很小的情况下使位移输出终端的温升很小。