MEMS device, in particular piezoresistive type, oscillating about two axes and having a position detection system

MEMS DEVICE OSCILLATING ABOUT TWO AXES AND HAVING A POSITION DETECTING SYSTEM, IN PARTICULAR OF A PIEZORESISTIVE TYPE

A MEMS device includes a platform carried by a frame via elastic connection elements configured to enable rotation of the platform about a first axis. A bearing structure supports the frame through first and second elastic suspension arms configured to enable rotation of the frame about a second axis transverse to the first axis. The first and second elastic suspension arms are anchored to the bearing structure through respective anchorage portions arranged offset with respect to the second axis. A stress sensor formed by first and second sensor elements respectively arranged on the first and second suspension arms is positioned in proximity of the anchorage portions, on a same side of the second axis, in a symmetrical position with respect to the first axis.

MEMS locking system

A micro-electrical-mechanical system (MEMS) actuator configured to provide multi-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: a first portion, a second portion, wherein the first portion and the second portion are displaceable with respect to each other, and a locking assembly configured to releasably couple the first portion and the second portion to attenuate displacement between the first portion and the second portion.

MEMS ACTUATOR PACKAGE ARCHITECTURE

A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.

MEMS device oscillating about two axes and having a position detecting system, in particular of a piezoresistive type

A MEMS device includes a platform carried by a frame via elastic connection elements configured to enable rotation of the platform about a first axis. A bearing structure supports the frame through first and second elastic suspension arms configured to enable rotation of the frame about a second axis transverse to the first axis. The first and second elastic suspension arms are anchored to the bearing structure through respective anchorage portions arranged offset with respect to the second axis. A stress sensor formed by first and second sensor elements respectively arranged on the first and second suspension arms is positioned in proximity of the anchorage portions, on a same side of the second axis, in a symmetrical position with respect to the first axis.

On the two axis oscillation and with position detection system in particular shape girder of the MEMS device

MEMS COMPONENT FOR GENERATING PRESSURE PULSES

A MEMS component for generating pressure pulses is provided, its micromechanical structure including at least three function levels: a first function level in which at least one stationary trench structure is implemented, a second function level, which is implemented above the first function level and includes at least one triggerable displacement element as well as through-openings as pressure outlet openings, the displacement element protruding into the trench structure and being movable in parallel with the function levels, whereby positive and negative pressure pulses are generated, and a third function level, which is implemented above the second function level and includes at least one triggerable cover element for at least one part of the pressure outlet openings in the second function level.

MEMS 액튜에이터 패키지 구조

... 플랫폼을 6자유도로 운동시키는 패키지가 제공된다. 플랫폼은 그 위에 장착된 광전자 소자를 포함할 수 있다. 패키지는 MEMS 액튜에이터일 수 있는 면내 액튜에이터와 압전 소자로 구성될 수 있는 면외 액튜에이터를 포함한다. 면내 MEMS 액튜에이터는 PCB 내의 인입부에 장착된 면외 액튜에이터 상에 장착될 수 있다. 면내 MEMS 액튜에이터는 반대쪽 빗들의 빗살들의 서로 중첩, 즉 서로의 단부들을 지나 연장되는 복수의 빗 구조들을 포함한다. 면외 액튜에이터는 중앙 부분과 중앙 부분에 연결되는 복수의 둘러싸는 스테이지들을 포함한다. 면내 MEMS 액튜에이터는 면외 Z 액튜에이터에 결합되어 패키지에 포함된 광전자 소자가 될 수 있는 탑재물에 3 자유도를 제공한다.

MEMS component for generating pressure pulses

A MEMS component for generating pressure pulses is provided, its micromechanical structure including at least three function levels: a first function level in which at least one stationary trench structure is implemented, a second function level, which is implemented above the first function level and includes at least one triggerable displacement element as well as through-openings as pressure outlet openings, the displacement element protruding into the trench structure and being movable in parallel with the function levels, whereby positive and negative pressure pulses are generated, and a third function level, which is implemented above the second function level and includes at least one triggerable cover element for at least one part of the pressure outlet openings in the second function level.

MEMS-Bauelement zum Erzeugen von Druckpulsen

Es wird ein MEMS-Bauelement (10) zum Erzeugen von Druckpulsen vorgeschlagen, dessen mikromechanische Struktur mindestens drei Funktionsebenen (1, 2, 3) umfasst: eine erste Funktionsebene (1), in der mindestens eine feststehende Grabenstruktur (11) realisiert ist, eine zweite Funktionsebene (2), die oberhalb der ersten Funktionsebene (1) realisiert ist und mindestens ein ansteuerbares Verdrängungselement (21) sowie Durchgangsöffnungen als Druckaustrittsöffnungen (23) umfasst, wobei das Verdrängungselement (21) in die Grabenstruktur (11) hineinragt und parallel zu den Funktionsebenen (1, 2, 3) bewegbar ist, wodurch positive und negative Druckpulse (4, 5) erzeugt werden, und eine dritte Funktionseben (3), die oberhalb der zweiten Funktionsebene (2) realisiert ist und mindestens ein ansteuerbares Abdeckelement (31) für zumindest einen Teil der Druckaustrittsöffnungen (23) in der zweiten Funktionsebene (2) umfasst.

MEMS ACTUATOR PACKAGE ARCHITECTURE

A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package. 1. An actuator assembly for actuating an optoelectronic device in multiple directions , said actuator assembly comprising:a package including a circuit board, an in-plane micro-electrical-mechanical system (MEMS) actuator, an out-of-plane actuator, and an optoelectronic device, said optoelectronic device conductively coupled to components of said in-plane MEMS actuator through a plurality of electrically conductive flexures; andsaid out-of-plane actuator conductively coupled to at least one of said in-plane MEMS actuator and said circuit board,wherein said in-plane MEMS actuator is capable of providing actuation along a plane and said out-of-plane actuator is capable of providing actuation at least along directions other than along said plane and said circuit board is one of a printed circuit board (PCB) and a ceramic board.2. The actuator assembly as in claim 1 , wherein said package includes said circuit board and said in-plane MEMS actuator includes a platform laterally surrounded by an outer frame claim 1 , said platform directly joined to said optoelectronic device.3. The actuator assembly as in claim 1 , wherein said ...

MEMS ACTUATOR PACKAGE ARCHITECTURE

MEMS Locking System

A micro-electrical-mechanical system (MEMS) actuator configured to provide multi-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: a first portion, a second portion, wherein the first portion and the second portion are displaceable with respect to each other, and a locking assembly configured to releasably couple the first portion and the second portion to attenuate displacement between the first portion and the second portion. 1. A multi-axis MEMS assembly comprising: a first portion,', 'a second portion, wherein the first portion and the second portion are displaceable with respect to each other, and', 'a locking assembly configured to releasably couple the first portion and the second portion to attenuate displacement between the first portion and the second portion., 'a micro-electrical-mechanical system (MEMS) actuator configured to provide multi-axis movement, the micro-electrical-mechanical system (MEMS) actuator including2. The multi-axis MEMS assembly of wherein the locking assembly includes:an engagement assembly; andan actuator assembly coupled to the first portion and configured to displace the engagement assembly so that the engagement assembly releasably engages the second portion.3. The multi-axis MEMS assembly of wherein the engagement assembly is configured to engage a surface of the second portion.4. The multi-axis MEMS assembly of wherein the engagement assembly is configured to engage a recess of the second portion.5. The multi-axis MEMS assembly of wherein:the micro-electrical-mechanical system (MEMS) actuator includes an in-plane MEMS actuator; andthe in-plane MEMS actuator includes the first portion and the second portion.6. The multi-axis MEMS assembly of further comprising:an optoelectronic device coupled to the in-plane MEMS actuator of the micro-electrical-mechanical system (MEMS) actuator.7. The multi-axis MEMS assembly of wherein the in-plane MEMS actuator is an image stabilization actuator.8. The multi- ...

MEMS ACTUATOR PACKAGE ARCHITECTURE

A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package. 135-. (canceled)36. An actuator device being planar in form and capable of actuating an optoelectronic device along directions other than along a plane of said actuator device , said actuator device comprising:a moveable center stage, intermediate stages laterally surrounding said center stage and actuation beams connecting said center stage to at least one of said intermediate stages, said actuation beams being deformable and adapted to actuate said center stage, said center stage adapted to be attached to said optoelectronic device or a further actuator disposed thereover.37. The actuator device as in claim 36 , further comprising further actuator beams coupling said intermediate stages to a platform surrounding said intermediate stages claim 36 , wherein said intermediate stages comprise a plurality of concentric intermediate stages.38. The actuator device as in claim 36 , wherein said actuation beams are formed of piezoelectric material and said directions include a direction orthogonal to said plane.39. The actuator device as in claim 38 , wherein said actuation beams are formed of a composite material including a ...

MEMS device with enhanced sensing structure and manufacturing method thereof

The present disclosure provides a semiconductor device, which includes a first substrate comprising an upper surface and a second substrate disposed over the first substrate. The semiconductor device also includes a first electrode disposed in the second substrate and configured to move in a direction substantially parallel to the upper surface in response to a pressure difference, and a second electrode disposed in the second substrate. The second electrode is configured to provide a capacitance in conjunction with the first electrode.

MICROELECTRONIC STRUCTURE WITH VISCOUS DAMPING CONTROLLED BY CONTROLLING A THERMO-PIEZORESISTIVE EFFECT

Microelectronic structure comprising at least one movable mass that is mechanically connected to a first mechanical element by a first mechanically linking connector and to a second mechanical element (24) by electrically conductive second mechanically linking connector, and a device for electrically biasing the second mechanically linking connector, the second mechanically linking connector being such that they are the seat of a thermo-piezoresistive effect, the second linking connector and the movable mass being placed with respect to each other so that a movement of the movable mass applies a mechanical stress to the second linking connector, wherein the electrically biasing device are DC voltage biasing device and form, with at least the second mechanically linking connector, a thermo-piezoresistive feedback electric circuit.

MEMS DEVICE WITH ENHANCED SENSING STRUCTURE AND MANUFACTURING METHOD THEREOF

The present disclosure provides a semiconductor device, which includes a first substrate comprising an upper surface and a second substrate disposed over the first substrate. The semiconductor device also includes a first electrode disposed in the second substrate and configured to move in a direction substantially parallel to the upper surface in response to a pressure difference, and a second electrode disposed in the second substrate. The second electrode is configured to provide a capacitance in conjunction with the first electrode.

MEMS actuator package architecture

A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.

MICROELECTRONIC STRUCTURE WITH VISCOUS DAMPING CONTROLLED BY CONTROLLING A THERMO-PIEZORESISTIVE EFFECT

Microelectronic structure comprising at least one movable mass that is mechanically connected to a first mechanical element by a first mechanically linking connector and to a second mechanical element (24) by electrically conductive second mechanically linking connector, and a device for electrically biasing the second mechanically linking connector, the second mechanically linking connector being such that they are the seat of a thermo-piezoresistive effect, the second linking connector and the movable mass being placed with respect to each other so that a movement of the movable mass applies a mechanical stress to the second linking connector, wherein the electrically biasing device are DC voltage biasing device and form, with at least the second mechanically linking connector, a thermo-piezoresistive feedback electric circuit.

MEMS actuator package architecture

A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.

Motion controlled actuator

A device can have an outer frame and an actuator. The actuator can have a movable frame and a fixed frame. At least one torsional flexure and at least one hinge flexure can cooperate to provide comparatively high lateral stiffness between the outer frame and the movable frame and can cooperate to provide comparatively low rotational stiffness between the outer frame and the movable frame.

Micromechanical component

A micromechanical component includes: a substrate having a multitude of trench structures which separate a first and a second mass element of the substrate from a web element of the substrate, in such a way that the first and second mass elements enclose the web element along an extension direction of the main surface of the substrate and are disposed to allow movement relative to the substrate in the direction of a surface normal of the main surface; a first electrode layer applied on the main surface of the substrate and forms a first electrode on the web element between the first and second mass elements; and a second electrode layer applied on the first and second mass elements and forming a self-supporting second electrode above the first electrode in the area of the web element, the first and second electrode forming a capacitance.

Mems switches and fabrication methods

MEMS switches and methods of fabricating MEMS switches. The switch has a vertically oriented deflection electrode having a conductive layer supported by a supporting layer, at least one drive electrode, and a stationary electrode. An actuation voltage applied to the drive electrode causes the deflection electrode to be deflect laterally and contact the stationary electrode, which closes the switch. The deflection electrode is restored to a vertical position when the actuation voltage is removed, thereby opening the switch. The method of fabricating the MEMS switch includes depositing a conductive layer on mandrels to define vertical electrodes and then releasing the deflection electrode by removing the mandrel and layer end sections.

Mirror device, mirror array, optical switch, mirror device manufacturing method, and mirror substrate manufacturing method

A mirror device includes a mirror ( 153 ) which is supported to be pivotable with respect to a mirror substrate ( 151 ), a driving electrode ( 103 - 1 - 103 - 4 ) which is formed on an electrode substrate ( 101 ) facing the mirror substrate, and an antistatic structure ( 106 ) which is arranged in a space between the mirror and the electrode substrate. This structure can fix the potential of the lower surface of the mirror and suppress drift of the mirror by applying a second potential to the antistatic structure.

Mirror device, mirror array, optical switch, mirror device manufacturing method, and mirror substrate manufacturing method

A mirror device includes a mirror ( 153 ) which is supported to be pivotable with respect to a mirror substrate ( 151 ), a driving electrode ( 103 - 1 - 103 - 4 ) which is formed on an electrode substrate ( 101 ) facing the mirror substrate, and an antistatic structure ( 106 ) which is arranged in a space between the mirror and the electrode substrate. This structure can fix the potential of the lower surface of the mirror and suppress drift of the mirror by applying a second potential to the antistatic structure.

MEMS Sensor with Movable Z-Axis Sensing Element

A MEMS sensor includes a substrate and a MEMS structure coupled to the substrate. The MEMS structure has a mass movable with respect to the substrate. The MEMS sensor also includes a reference structure electrically coupled to the mass of the MEMS sensor. The reference structure is used to provide a reference to offset any environmental changes that may affect the MEMS sensor in order to increase the accuracy of its measurement.

Driving apparatus

A driving apparatus ( 100 ) is provided with: a base part ( 110 ); a stage part ( 130 ) on which a driven object ( 150 ) is mounted and which can be displaced; an elastic part ( 120 ) which has elasticity for displacing the stage part along one direction (Y axis); and an applying part ( 110 ) for applying to the base part microvibration for displacing the stage part ( 130 ) such that the stage part ( 130 ) resonates along the one direction (Y axis) at a resonance frequency determined by the elastic part ( 120 ) and the stage part ( 130 ), the microvibration is non-directional microvibration as non-directional vibrational energy.

Method of preventing stiction of mems devices

A method and apparatus are disclosed for reducing stiction in MEMS devices. The method comprises patterning a CMOS wafer to expose Titanium-Nitride (TiN) surface for a MEMS stop and patterning the TiN to form a plurality of stop pads on the top metal aluminum surface of the CMOS wafer. The method is applied for a moveable MEMS structure bonded to a CMOS wafer. The TiN surface and/or plurality of stop pads minimize stiction between the MEMS structure and the CMOS wafer. Further, the TiN film on top of aluminum electrode suppresses the formation of aluminum hillocks which effects the MEMS structure movement.

Rotationally deployed actuator devices

A method for making an actuator device includes forming a substantially planar structure, including an outer frame with a latch foot, a fixed frame coupled to the outer frame, a latch mass coupled to the fixed frame, a latch block coupled to the latch mass by a latch block flexure, a moveable frame coupled to the outer frame, and an actuator incorporating a plurality of interdigitated teeth alternately attached to the fixed and moving frames. For operation, the latch mass is rotated downward until an upper surface of the latch block is disposed below and held in latching contact with a lower surface of the latch foot by the latch block flexure.

Surface mount actuator

A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).

Microelectromechanical sensor with out-of-plane sensing and process for manufacturing a microelectromechanical sensor

A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate.

Mems electrostatic actuator

A MEMS electrostatic actuator includes a bottom plate affixed to a substrate and a top plate suspended above the bottom plate. The top plate has a parallel plate center section and two rotating members electrically connected to the center section. Each rotating member is attached centrally of the rotating member for rotation about an axis of rotation to a set of anchor posts. The attachment includes at least one pair of torsional springs attached along each axis, each spring comprising a rectangular metal square that twists as the rotational members rotate. Electrostatic pull-down electrodes are underneath each rotational member.

MICRO-ELECTRO-MECHANICAL DEVICE HAVING A TILTABLE STRUCTURE, WITH DETECTION OF THE POSITION OF THE TILTABLE STRUCTURE

A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle. 1. A micro-electro-mechanical device , comprising:a platform configured to rotate by a rotation angle (θ);a slit in the platform;a support structure supporting the platform and including a cavity facing a first side of the platform; anda plurality of integrated photodetectors facing the cavity and the first side of the platform.2. The device according to claim 1 , wherein the slit has a center claim 1 , and the plurality of photodetectors comprises a first photodetector and a second photodetector arranged adjacent to a bottom wall of the cavity facing the platform claim 1 , the first and second photodetectors being arranged at different distances from a vertical line passing through the center of the slit and perpendicular to the bottom wall.3. The device according to claim 2 , wherein said first photodetector is arranged along the vertical line claim 2 , and said second photodetector is spaced apart from the vertical line.4. The device according to claim 2 , wherein the first and second photodetectors are configured to generate first and second light-intensity signals claim 2 , respectively claim 2 , the device further comprising a processing unit configured to receive the first and second light-intensity signals from the first photodetector and the second photodetector claim 2 , respectively claim 2 , the processing unit include a subtractor ...

MICRO-ELECTRO-MECHANICAL DEVICE HAVING A TILTABLE STRUCTURE, WITH DETECTION OF THE POSITION OF THE TILTABLE STRUCTURE

A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle. 1. A micro-electro-mechanical device , comprising:a platform configured to rotate by a rotation angle (θ);a slit in the platform;a support structure supporting the platform and including a cavity facing a first side of the platform; anda plurality of integrated photodetectors facing the cavity and the first side of the platform and configured to receive light beams that pass through the slit in the platform.2. The device according to claim 1 , wherein a first photodetector of the plurality of integrated photodetectors is arranged at a first distance from the slit for generating a first light-intensity signal at a first rotation angle and for generating a second light-intensity signal at a second rotation angle claim 1 , and a second photodetector of the plurality of integrated photodetectors is arranged at a second distance from the slit for generating a third light-intensity signal at the first rotation angle and for generating a fourth light-intensity signal at the second rotation angle.3. The device according to claim 2 , wherein the slit has a center claim 2 , and the first photodetector and the second photodetector are arranged adjacent to a bottom wall of the cavity facing the platform claim 2 , the first and second photodetectors being arranged at different distances from a vertical line passing through the center of the slit and ...

ACTUATOR DEVICE

An actuator device includes a support portion, a movable portion, a connection portion which connects the movable portion to the support portion on a second axis, a first wiring which is provided on the connection portion, a second wiring which is provided on the support portion, and an insulation layer which includes a first opening exposing a surface opposite to the support portion in a first connection part located on the support portion in one of the first wiring and the second wiring and covers a corner of the first connection part. The rigidity of a first metal material forming the first wiring is higher than the rigidity of a second metal material forming the second wiring. The other wiring of the first wiring and the second wiring is connected to the surface of the first connection part in the first opening. 1. An actuator device comprising:a support portion;a movable portion;a connection portion which connects the movable portion to the support portion on a predetermined axis so that the movable portion is swingable about the axis;a first wiring which is provided on the connection portion;a second wiring which is provided on the support portion; andan insulation layer which includes a first opening exposing a surface opposite to the support portion in a first connection part located on the support portion in one wiring of the first wiring and the second wiring and covers a corner of the first connection part,wherein rigidity of a first metal material forming the first wiring is higher than rigidity of a second metal material forming the second wiring, andwherein the other wiring of the first wiring and the second wiring is connected to the surface of the first connection part in the first opening.2. The actuator device according to claim 1 ,wherein the first connection part is separate from the axis by a predetermined distance.3. The actuator device according to claim 2 ,wherein the distance is larger than ½ times a minimum width of the connection portion.4 ...

Symmetrical mems accelerometer and its fabrication process

A symmetrical MEMS accelerometer. The accelerometer includes a top half and a bottom half bonded together to form the frame and the mass located within the frame. The frame and the mass are connected through resilient beams. A plurality of hollowed parts and the first connecting parts are formed on the top and bottom side of the mass, respectively. The second connecting parts are formed on the top and bottom side of the frame, respectively. The resilient beams connect the first connecting part with the second connecting part. Several groups of comb structures are formed on top of the hollowed parts. Each comb structure includes a plurality of moveable teeth and fixed teeth. The moveable teeth extend from the first connecting part and the fixed teeth extend from the second connecting part. Capacitance is formed between the movable teeth and the fixed teeth. Since the accelerometer is symmetrical with a large mass, it has a large capacitance with a low damping force.

Micromechanical Structure and Method for Fabricating the Same

A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region. The functional structure includes a conductive base layer and a functional structure comprising a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region. The stiffening structure material includes a silicon material and at least a carbon material. 1. A micro mechanical structure comprising:a substrate; anda functional structure arranged at the substrate;wherein the functional structure comprises a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region;wherein the functional structure comprises a conductive base layer;wherein the functional structure comprises a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region; andwherein the stiffening structure material comprises a silicon material and at least a carbon material.2. The micro mechanical structure according to claim 1 , wherein the stiffening structure material comprises the carbon material with a concentration that is at least 1% of the concentration of the silicon material.3. The micro mechanical structure according to claim 1 , wherein the stiffening structure material additionally comprises at least one of a nitrogen material claim 1 , an oxygen material claim 1 , a titanium material claim 1 , a molybdenum material and a tantalum material with a material concentration.4. The micro mechanical structure according to claim 3 , wherein the material concentration varies along a thickness direction of the stiffening structure.5. The micro mechanical ...

Converting rotational motion to linear motion

System and methods are disclosed herein for converting rotational motion to linear motion. A system comprising a rotational drive can be connected to a proof mass by a first structure comprising a coupling spring. An anchor can be connected to the proof mass by a second structure comprising a drive spring. The coupling spring and the drive spring can be configured to cause the proof mass to move substantially along a first axis when the rotational drive rotates about a second axis.

ACTUATOR DEVICE

An actuator device includes a support portion, a movable portion, a connection portion which connects the movable portion to the support portion on a second axis so that the movable portion is swingable about the second axis, a first wiring which is provided on the connection portion, and a second wiring which is provided on the support portion. The rigidity of a first metal material forming the first wiring is higher than that of a second metal material forming the second wiring. The second wiring is connected to a surface opposite to the support portion in a first connection part located on the support portion in the first connection part. 1. An actuator device comprising:a support portion;a movable portion;a connection portion which connects the movable portion to the support portion on a predetermined axis so that the movable portion is swingable about the axis;a first wiring which is provided on the connection portion; anda second wiring which is provided on the support portion,wherein rigidity of a first metal material forming the first wiring is higher than that of a second metal material forming the second wiring, andwherein the second wiring is connected to a surface opposite to the support portion in a first connection part located on the support portion in the first wiring.2. The actuator device according to claim 1 ,wherein the first connection part is separate from the axis by a predetermined distance.3. The actuator device according to claim 2 ,wherein the distance is larger than ½ times a minimum width of the connection portion.4. The actuator device according to claim 1 ,wherein a cross-sectional area of the first wiring is larger than a cross-sectional area of the second wiring.5. The actuator device according to claim 4 ,wherein a width of the first wiring is larger than a width of the second wiring.6. The actuator device according to claim 1 , further comprising:a coil which is provided with the movable portion;a magnetic field generator which ...

Driving apparatus

A driving apparatus ( 101 ) is provided with: a first base part ( 110 ); a second base part ( 120 ); an elastic part ( 210 ) configured to couple the first base part with the second base part; a coil ( 300 ) disposed on the first base part; a first magnet ( 710 ) disposed on one side of the coil; a second magnet ( 720 ) disposed on an opposite side of the first magnet as viewed from the coil; a first middle yoke ( 810 ) provided on a surface of the first magnet opposed to the coil; and a second middle yoke ( 820 ) provided on a surface of the second magnet opposed to the coil. In particular, the first magnet is smaller than the second magnet. The first middle yoke is located closer to the coil than the second middle yoke is.

Electrostatic Actuator with Tri-Electrode Topology

A new tri-electrode topology reduces the control voltage requirement for electrostatic actuators. Conventional parallel plate actuators are dual-electrode systems, formed by the MEMS structure and the drive electrode. By placing a perforated intermediate electrode between these elements, a tri-electrode configuration is formed. This topology enables a low voltage on the intermediate electrode to modulate the electrostatic force of the higher voltage drive electrode, whose voltage remains fixed. Results presented show that in comparison to conventional parallel plate electrostatic actuators, the intermediate electrode's modulating voltage can be as low as 20% of normal, while still providing the full actuation stroke. 1. An electrostatic actuator comprising:a base;a drive electrode mounted to the base in a stationary position thereon and connected or connectable to a first voltage source to apply a drive voltage to said drive electrode;a movable electrode suspended over the drive electrode in spaced relation therefrom;an intermediate electrode disposed between the drive electrode and the movable electrode in spaced relation from each thereof and connected or connectable to a variable second voltage source to apply a variable control voltage to said intermediate electrode, said intermediate electrode having a plurality of openings therein at an area thereof overlying the drive electrode;whereby an electric field generated by application of the drive voltage to the drive electrode passes through the openings in the intermediate electrode and is modulated by the variable control voltage applied to the intermediate electrode.2. The electrostatic actuator of wherein said drive electrode is connected to said first voltage source.3. The electrostatic actuator of wherein said intermediate electrode is connected to said variable second voltage source.4. The electrostatic actuator of wherein the openings in the intermediate electrode each have a width less than claim 1 , equal ...

MICROELECTRONIC PACKAGES HAVING SPLIT GYROSCOPE STRUCTURES AND METHODS FOR THE FABRICATION THEREOF

Methods for fabricating microelectronic packages and microelectronic packages having split gyroscope structures are provided. In one embodiment, the microelectronic package includes a first Microelectromechanical Systems (MEMS) die having a first MEMS gyroscope structure thereon. The microelectronic package further includes a second MEMS die, which has a second MEMS gyroscope structure thereon and which is positioned in a stacked relationship with the first MEMS die. The first and second MEMS gyroscope structures overlap as taken along a first axis orthogonal to a principal axis of the first MEMS die. 1. A microelectronic package , comprising:a first Microelectromechanical Systems (MEMS) die having a first MEMS gyroscope structure thereon; anda second MEMS die having a second MEMS gyroscope structure thereon and positioned in a stacked relationship with the first MEMS die, the first and second MEMS gyroscope structures overlapping as taken along a first axis orthogonal to a principal surface of the first MEMS die.2. The microelectronic package of wherein the first and second MEMS gyroscope structures are sensitive along mutually exclusive claim 1 , orthogonal axes such that the first and second MEMS gyroscope structures collectively provide the functionality of a three axis gyroscope.3. The microelectronic package of wherein the first MEMS gyroscope structure is sensitive along a first sense axis substantially orthogonal to the first MEMS die claim 2 , and wherein the second gyroscope structure is sensitive along second and third axes orthogonal to the first axis.4. The microelectronic package of further comprising a non-gyroscope MEMS sensor formed on the first MEMS die proximate the first MEMS gyroscope structure.5. The microelectronic package of wherein the non-gyroscope MEMS sensor comprises an accelerometer located laterally adjacent the first MEMS gyroscope structure.6. The microelectronic package of wherein the planform surface area of the second MEMS ...

MULTIAXIAL STRAIN ENGINEERING OF DEFECT DOPED MATERIALS

Compositions and methods related to multiaxially straining defect doped materials as well as their use in electrical circuits are generally described. 1. An electrical device comprising:a defect doped material forming at least a portion of an electrical circuit; andone or more actuators configured to selectively apply a multiaxial strain to at least a first portion of the defect doped material, wherein the defect doped material is a non-conducting material when the defect doped material is in an unstrained state, and wherein at least a second portion of the defect doped material is a semiconducting material or a conducting material when the one or more actuators apply the multiaxial strain to the defect doped material in a strained state.2. The electrical device of claim 1 , wherein at least two externally-applied mechanical forces applied to the defect doped material are substantially non-parallel.3. The electrical device of claim 1 , wherein the multiaxial strain is non-uniform in the defect doped material.4. The electrical device of claim 1 , wherein the multiaxial strain results from application of stress to a stress concentrator of the defect doped material.5. The electrical device of claim 1 , wherein an activation energy to ionize defects of the defect doped material in the strained state is less than the activation energy to ionize the defects when the defect doped material is in the unstrained state.6. The electrical device of claim 1 , wherein the electrical device is configured to apply the multiaxial strain by translating two or more actuators in nonparallel directions.7. The electrical device of claim 1 , wherein the electrical circuit is configured to transmit current from a first electrode connected to the defect doped material to a second electrode connected to the defect doped material through the second portion of the defect doped material when the defect doped material is selectively strained by the one or more actuators.8. The electrical device ...

SENSOR PACKAGE HAVING A MOVABLE SENSOR

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members. 1. A sensor package , comprising: a fixed frame; and', 'a moveable platform configured to be moved with respect to the fixed frame along at least one direction and having a rectangular shape, wherein the moveable platform comprises a plurality of comb electrodes at two opposite edges of the rectangular shape of the moveable platform;, 'a micro-electromechanical system (MEMS) actuator, comprisingmultiple elastic restoring members formed between the fixed frame and another two opposite edges, different from the two opposite edges, of the rectangular shape of the moveable platform, and configured to restore a position of the moved moveable platform; anda sensor chip arranged on the moveable platform.2. The sensor package as claimed in claim 1 , whereinthe multiple elastic restoring members are formed by a patterned metal layer, andthe sensor chip is configured to transmit detected data via the multiple elastic restoring members.3. The sensor package as claimed in claim 1 , wherein the sensor chip comprises solder balls mounted on the multiple elastic restoring members.4. The sensor package as claimed in claim 1 , wherein the multiple elastic restoring members are formed as straight lines between the fixed frame and the moveable platform.5. The sensor package as claimed in claim 1 , wherein the multiple elastic restoring members arranged at each of the another two opposite edges are all parallel to each other.6. The sensor package as claimed in claim 1 , whereinthe fixed ...

Rotation rate sensor, method for manufacturing a rotation rate sensor

A rotation rate sensor including a substrate, a drive structure, which is movable with regard to the substrate, a detection structure, and a Coriolis structure, the drive structure, the Coriolis structure, and the detection structure being essentially situated in a layer, in that an additional layer is situated essentially in parallel to the layer above or underneath the layer, a mechanical connection between the Coriolis structure and the drive structure being established with a first spring component, the first spring component being configured as a part of the additional layer, and/or a mechanical connection between the detection structure and the substrate being established with a second spring component, the second spring component being configured as a part of the additional layer.

Micromechanical mirror device

A micromechanical mirror device has: a plate-shaped mirror having a reflecting surface for reflecting light, the reflecting surface being configured to be planar; a closed frame structure supporting the plate-shaped mirror and completely framing an edge of the plate-shaped mirror; a spring arrangement having at least two spring structures arranged mirror-symmetrically and connecting the closed frame structure to a stationary support structure, the spring arrangement being configured such that the closed frame structure and the plate-shaped mirror can be brought into a resonant vibrational state with respect to the support structure; and a connecting arrangement having at least four connecting spring structures arranged mirror-symmetrically and each connecting the plate-shaped mirror to the closed frame structure; the connecting spring structures being configured to be elastically deformable and arranged such that they deform back and forth in the resonant vibrational state so that the plate-shaped mirror is partially mechanically decoupled from the closed frame structure.

Mems device

The disclosure provides a MEMS device including: a fixed substrate having a cavity; a driving unit disposed in the cavity and floating above the fixed substrate; and an elastic unit for physically connecting the fixed substrate with the driving unit and varying the height of the driving unit according to a control current, wherein the elastic unit includes a bimorph driving unit connected to the fixed substrate and bent according to the control current, a spring connected to the driving unit, and a frame connecting the bimorph driving unit to the spring. Therefore, in order to overcome the limitations according to the power consumption and the size-reduction due to a coil and a magnet, the MEMS device drives one lens and thus can reduce the power consumption and the size thereof. Further, the MEMS device applies a thermal scheme which performs an automatic focusing function through vertical operation of a lens by a thermal expansion difference of different materials, thereby simplifying the structure thereof and reducing the cost.

ELECTRONIC DEVICE

According to one embodiment, an electronic device includes a substrate, a first electrode provided stationary above the substrate and used for a variable capacitor, a second electrode provided movable above or below the first electrode and used for the variable capacitor, a first protective insulation film provided on a first surface of the first electrode, the first surface facing the second electrode, and a second protective insulation film provided on a second surface of the second electrode, the second surface facing the first electrode. 1. An electronic device comprising:a substrate;a first electrode provided stationary above the substrate and used for a variable capacitor;a second electrode provided movable above or below the first electrode and used for the variable capacitor;a first protective insulation film provided on a first surface of the first electrode, the first surface facing the second electrode; anda second protective insulation film provided on a second surface of the second electrode, the second surface facing the first electrode.2. The electronic device of claim 1 , further comprising a third protective insulation film provided on a third surface of the second electrode opposite to the second surface.3. The electronic device of claim 1 , wherein each of the first and second protective insulation films is formed of a material containing silicon (Si) and at least one of nitrogen (N) and oxygen (O).4. The electronic device of claim 1 , wherein the second electrode is movable in a cavity formed by a first film provided above the second electrode and having an opening and a second film provided on the first film.5. The electronic device of claim 1 , wherein the first electrode is formed of a material containing aluminum (Al) as a main component.6. The electronic device of claim 1 , wherein the second electrode is formed of a material containing aluminum (Al) as a main component.7. The electronic device of claim 1 , wherein the second protective ...

Mems actuation systems and methods

A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

High quality factor mems silicon hinge and slot-cut resonator for a vibratory gyroscope

A resonant structure comprising at least two coaxial rings, wherein adjacent coaxial rings have adjacent peripheries and are attached together by a plurality of connection structures regularly arranged along said adjacent peripheries; and wherein a first ring has a first ring portion with a first radial thickness and a second ring, portion, in a vicinity of a first connection structure, with a second radial thickness smaller than said first radial thickness.

MEMS ACTUATION SYSTEMS AND METHODS

INVENTION #7 1. A micro-electrical-mechanical system (MEMS) device comprising:one or more slidable connection assemblies for releasably coupling the micro-electrical-mechanical system (MEMS) device to a wafer from which the micro-electrical-mechanical system (MEMS) device was made.2. The micro-electrical-mechanical system (MEMS) device of wherein the one or more slidable connection assemblies includes a portion of the wafer.3. The micro-electrical-mechanical system (MEMS) device of wherein the portion of the wafer includes a supporting pillar on the wafer.4. The micro-electrical-mechanical system (MEMS) device of wherein the micro-electrical-mechanical system (MEMS) device includes:a MEMS actuation core; anda MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board.5. The micro-electrical-mechanical system (MEMS) device of wherein the one or more slidable connection assemblies includes a portion of the MEMS actuation core.6. The micro-electrical-mechanical system (MEMS) device of wherein the one or more slidable connection assemblies includes a portion of the MEMS electrical connector.7. The micro-electrical-mechanical system (MEMS) device of wherein the one or more slidable connection assemblies includes:one or more finger assemblies on the micro-electrical-mechanical system (MEMS) device.8. The micro-electrical-mechanical system (MEMS) device of wherein the one or more slidable connection assemblies includes:one or more socket assemblies on the wafer that are configured to receive the one or more finger assemblies.9. The micro-electrical-mechanical system (MEMS) device of wherein the one or more socket assemblies on the wafer includes:a spanning structure configured to span at least two fingers of the wafer, thus forming the one or more socket assemblies therebetween.10. The micro-electrical-mechanical system (MEMS) device of wherein the one or more slidable connection ...

Bidirectional mems driving arrangements with a force absorbing system

A micro-electromechanical systems (MEMS) driving arrangement for an electronic device, the micro-electromechanical systems (MEMS) driving arrangement including a driven wheel; a driving actuation assembly for causing rotation of the driven wheel; an indicator assembly including an indicator; and a force absorbing assembly coupled intermediate the indicator assembly and the driven wheel; whereby a force acting upon the indicator assembly is absorbed by the force absorbing assembly so as to inhibit rotation of the driven wheel relative to the driving actuation assembly.

ELECTRODE CONFIGURATION FOR TILTING MICRO-ELECTRO-MECHANICAL SYSTEMS MIRROR

A micro-electro-mechanical system (MEMS) device may include a mirror structure suspended from a first hinge and a second hinge that are arranged to enable the mirror structure to be tilted about a tilt axis. The mirror structure may include a first actuator and a second actuator located on opposite sides of the tilt axis. The MEMS device may include a fixed electrode coupled to first actuator to cause the mirror structure to tilt about the tilt axis in a first direction based on a fixed voltage applied to the fixed electrode. The MEMS device includes a driving electrode coupled to the second actuator to cause the mirror structure to tilt about the tilt axis in a second direction opposite from the first direction based on a driving voltage applied to the driving electrode. 1. A micro-electro-mechanical systems (MEMS) device , comprising:{'claim-text': 'wherein the mirror structure comprises a first actuator and a second actuator located on opposite sides of the tilt axis;', '#text': 'a mirror structure suspended from a first hinge and a second hinge that are arranged to enable the mirror structure to be tilted about a tilt axis,'}a fixed electrode, coupled to first actuator, to cause the mirror structure to tilt about the tilt axis in a first direction based on a fixed voltage applied to the fixed electrode; anda driving electrode, coupled to the second actuator, to cause the mirror structure to tilt about the tilt axis in a second direction that is opposite from the first direction based on a driving voltage applied to the driving electrode.2. The MEMS device of claim 1 , wherein the fixed voltage applied to the fixed electrode causes the mirror structure to tilt about the tilt axis by a first angle in the first direction.3. The MEMS device of claim 2 , wherein a maximum value of the driving voltage applied to the driving electrode causes the mirror structure to tilt about the tilt axis by a second angle in the second direction such that a sum of the first angle and ...

OPTICAL NON-UNIFORMITY CORRECTION (NUC) FOR ACTIVE MODE IMAGING SENSORS USING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) MICRO-MIRROR ARRAYS (MMAs)

An active mode image sensor for optical non-uniformity correction (NUC) of an active mode sensor uses a Micro-Electro-Mechanical System (MEMS) Micro-Mirror Array (MMA) having tilt, tip and piston mirror actuation to form and scan a laser spot that simultaneously performs the NUC and illuminates the scene so that the laser illumination is inversely proportional to the response of the imager at the scan position. The MEMS MMA also supports forming and scanning multiple laser spots to simultaneously interrogate the scene at the same or different wavelengths. The piston function can also be used to provide wavefront correction. The MEMS MMA may be configured to generate a plurality of fixed laser spots to perform an instantaneous NUC. 1. An active mode imaging sensor , comprising: a pixelated imager having a non-uniform response over a specified band of wavelengths,', 'optics having an entrance pupil configured to receive light from a laser illuminated scene over a field-of-view (FOV) and image the light onto the pixelated imager, and', "a circuit for reading out a Non-Uniformed Corrected (NUC'd) image from the pixelated imager at a frame time,"], 'an imaging sub-system, comprising'} a Micro-Electro-Mechanical System (MEMS) Micro-mirror Array (MMA) comprising a plurality of independently and continuously controllable mirrors to tip and tilt each mirror about first and second orthogonal axes and to translate each mirror in a third axis orthogonal to a plane containing the first and second orthogonal axes;', 'a laser source for generating laser energy at one or more wavelengths within the specified band to illuminate the MEMS MMA; and', "one or more processors configured to generate command signals to tip, tilt and translate the mirrors to form the laser energy into a laser spot smaller than the FOV and to scan the laser spot over a portion of the FOV within a frame time so that the laser illumination is inversely proportional to the response of the pixelated imager at ...

LINEARIZED MICROMECHANICAL SENSOR

A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm that spans the cavity; and a lever element that spans the diaphragm and has a first and a second end section, the end sections lying on opposite sides of a center section. A first joint element is fitted between the first end section and the substrate and a second joint element is fitted between the center section and the diaphragm, so that the lever element is able to be pivoted due to a deflection of the diaphragm. In addition, two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes of the sensors are disposed in such a way that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Moreover, the sensor includes an actuator for applying an actuating force between the lever element and the substrate. 110-. (canceled)11. A micromechanical sensor , comprising:a substrate having a cavity;a flexible diaphragm which spans the cavity;a lever element that spans the diaphragm and has a first end section, a second end section, and a center section, the first end section and the second end section lying on opposite sides of the center section relative to one another;a first joint element that is fitted between the first end section and the substrate;a second joint element that is fitted between the center section and the diaphragm;a first capacitive sensor and a second capacitive sensor, each of the first capacitive sensor and the second capacitive sensor having two electrodes, of which one is mounted at one of the first or second end sections and the other is mounted on the substrate so that distances between the electrodes of different capacitive sensors are influenced oppositely when the lever element is pivoted because of a deflection of the diaphragm; andan actuator ...

Vehicle Operator Awareness System

Systems and methods for maintaining autonomous vehicle operator awareness are provided. A method can include determining, by a computing system, an awareness challenge for an operator of a vehicle. The awareness challenge can be based on object data. The awareness challenge can have one or more criteria. The criteria can include a challenge response interval, a response time, and an action for satisfying the awareness challenge. The method can include initiating, by the computing system, a timer measuring elapsed time from a start time of the challenge response interval. The method can include communicating to the operator, by the computing system, a soft notification indicative of the awareness challenge during the challenge response interval. The method can include determining, by the computing system, whether the operator provides a user input after the response time interval and whether the user input corresponds to the action for satisfying the awareness challenge.

WATERPROOF MEMS BUTTON DEVICE, INPUT DEVICE COMPRISING THE MEMS BUTTON DEVICE AND ELECTRONIC APPARATUS

A button device includes a MEMS sensor having a MEMS strain detection structure and a deformable substrate configured to undergo deformation under the action of an external force. The MEMS strain detection structure includes a mobile element carried by the deformable substrate via at least a first and a second anchorage, the latter fixed with respect to the deformable substrate and configured to displace and generate a deformation force on the mobile element in the presence of the external force; and stator elements capacitively coupled to the mobile element. The deformation of the mobile element causes a capacitance variation between the mobile element and the stator elements. Furthermore, the MEMS sensor is configured to generate detection signals correlated to the capacitance variation. 1. A button device comprising a MEMS sensor , the MEMS sensor including a MEMS strain detection structure and a deformable substrate configured to undergo deformation in response to an external force , the MEMS strain detection structure including:a mobile element{'sub': 't', 'a first anchorage and a second anchorage both rigid with respect to the deformable substrate and configured to displace and generate a deformation force (F) on the mobile element in response to the external force; and'}a stator element capacitively coupled to the mobile element, a displacement of the mobile element causing a capacitance variation between the mobile element and the stator element, the MEMS sensor configured to generate a detection signal based on the capacitance variation.2. The button device according to claim 1 , wherein the mobile element comprises:a beam, configured to rotate about a rotation axis in response to the deformation force, the beam having a first half beam and a second half beam;a first arm extending between and coupling the first half beam and the first anchorage;a second arm extending between and coupling the second half beam and the second anchorage, the first and the ...

DROPLET CONTROL AND DETECTION DEVICE, OPERATING METHOD THEREOF, AND MICROFLUIDIC DEVICE

A droplet control and detection device and an operating method thereof are provided. The droplet control and detection device includes: a light source; a first electrode; a second electrode; a droplet arranged on a light-exiting side of the light source, where the droplet is movable under the effect of an electric field formed between the first electrode and the second electrode; a photoelectric detection structure configured to detect light emitted by the light source and reflected by the droplet; and a processing circuit configured to obtain droplet information according to a detection result of the photoelectric detection structure and control an electrical signal applied on the first electrode and the second electrode according to the droplet information. 1. A droplet control and detection device , comprising:a light source;a first electrode;a second electrode;a droplet arranged on a light-exiting side of the light source, wherein the droplet is movable under the effect of an electric field formed between the first electrode and the second electrode;a photoelectric detection structure, configured to detect light emitted by the light source and reflected by the droplet; anda processing circuit, configured to obtain droplet information according to a detection result of the photoelectric detection structure and control an electrical signal applied on the first electrode and the second electrode according to the droplet information.2. The droplet control and detection device according to claim 1 , wherein the droplet information comprises at least one of a position parameter claim 1 , an appearance parameter and a component parameter of the droplet.3. The droplet control and detection device according to claim 1 , further comprising:a first hydrophobic layer and a second hydrophobic layer oppositely arranged and on the light-exiting side of the light source, wherein the first hydrophobic layer and the second hydrophobic layer are spaced by a predetermined distance, ...

Resonance Frequency Adjustment Module

A resonance frequency adjustment module is disclosed forming a MEMS sensor for detecting an angular velocity. The resonance frequency adjustment module includes a movable electrode; a fixed electrode facing the movable electrode to form a capacitor; and an elastic body supporting the movable electrode so as to be displaceable in one direction. The movable electrode and the fixed electrode have surfaces facing each other to form a capacitor, and the surface can be inclined to a displacement direction. A region sandwiched between the movable electrode and the fixed electrode has a volume fixed region where the volume is not decreased by movement of the movable electrode.

MICROMECHANICAL COMPONENT HAVING TWO AXES OF OSCILLATION AND METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT

A micromechanical component is described as having a part that is movable relative to a holder. The part is suspended on the holder at least via a suspension structure. Self-oscillations of the suspension structure are inducible such that, relative to the holder, the movable part can be set into a resonant oscillatory movement about a first axis of rotation and into a quasi-static oscillatory movement about a second axis of rotation oriented at an incline to the first axis of rotation by the suspension structure set into the self-oscillations. The movable part is connected directly or via at least one spring to at least one oscillation node point of at least one of the induced self-oscillations of the suspension structure. In addition, a method is described for producing a micromechanical component. 110.-. (canceled)11. A micromechanical component , comprising:a holder;a part movable relative to the holder and suspended on the holder at least via a suspension structure; and [ at least one first subsegment of the suspension structure is set into a first harmonic oscillatory movement along a first axis of oscillation, and', 'at least one of the at least one first subsegment and at least one second subsegment the suspension structure is set into a second harmonic oscillatory movement along a second axis of oscillation oriented at an incline to the first axis of oscillation, whereby self-oscillations of the suspension structure can be induced such that the movable part, in relation to the holder, can be set into a resonant oscillatory movement about a first axis of rotation and into a quasi-static oscillatory movement about a second axis of rotation oriented at an incline to the first axis of rotation by the suspension structure set into the self-oscillations, and, 'through an operation of the at least one actuator device at least one of, 'the movable part is connected one of directly and via at least one spring to at least one oscillation node point at least one of the ...

BIDIRECTIONAL MEMS DRIVING ARRANGEMENTS WITH A FORCE ABSORBING SYSTEM

A micro-electromechanical systems (MEMS) driving arrangement for an electronic device, the micro-electromechanical systems (MEMS) driving arrangement including a driven wheel; a driving actuation assembly for causing rotation of the driven wheel; an indicator assembly including an indicator; and a force absorbing assembly coupled intermediate the indicator assembly and the driven wheel; whereby a force acting upon the indicator assembly is absorbed by the force absorbing assembly so as to inhibit rotation of the driven wheel relative to the driving actuation assembly. 1. A micro-electromechanical system (MEMS) driving arrangement for an electronic device comprising:a driven wheel;a driving actuation assembly for causing rotation of the driven wheel;an indicator assembly comprising an indicator; anda force absorbing assembly coupled intermediate the indicator assembly and the driven wheel;whereby a force acting upon the indicator assembly is absorbed by the force absorbing assembly so as to inhibit rotation of the driven wheel relative to the driving actuation assembly.2. The micro-electromechanical systems (MEMS) driving arrangement for an electronic device as claimed in claim 1 , wherein the force absorbing assembly physically connects the indicator assembly to the driven wheel.3. The micro-electromechanical systems (MEMS) driving arrangement for an electronic device as claimed in claim 1 , wherein the force absorbing assembly comprises one or more springs coupling the indicator assembly to the driven wheel.4. The micro-electromechanical systems (MEMS) driving arrangement for an electronic device as claimed in claim 3 , wherein each of the one or more springs has a respective first end and second end claim 3 , andwherein the first end of the each of the one or more springs is coupled to the driven wheel and the second end of the each of the one or more springs is coupled to the indicator assembly.5. The micro-electromechanical systems (MEMS) driving arrangement for ...

MEMS ELEMENT WITH INCREASED DENSITY

A microelectromechanical device comprising a mobile rotor in a silicon wafer. The rotor comprises one or more high-density regions. The one or more high-density regions in the rotor comprise at least one high-density material which has a higher density than silicon. The one or more high-density regions have been formed in the silicon wafer by filling one or more fill trenches in the rotor with the at least one high-density material. The one or more fill trenches have a depth/width aspect ratio of at least 10, and the one or more fill trenches have been filled by depositing the high-density material into the fill trenches in an atomic layer deposition (ALD) process. 1. A method for manufacturing a microelectromechanical device comprising a mobile rotor in a silicon wafer , wherein the method comprises:{'b': '1', 'b) etching one or more fill trenches in the rotor in a plasma etching process, wherein the one or more fill trenches have a depth/width aspect ratio of at least 10; and'}{'b': '2', 'b) filling the one or more fill trenches with a high-density material by depositing the high-density material into the one or more fill trenches by atomic layer deposition, so that a high-density region is formed in the one or more fill trenches.'}3. The method according to claim 1 , wherein the high-density material comprises a carbide of tungsten claim 1 , tantalum claim 1 , yttrium claim 1 , neodymium claim 1 , cerium claim 1 , lanthanum claim 1 , zirconium claim 1 , indium claim 1 , niobium claim 1 , molybdenum or hafnium.4. The method according to claim 1 , wherein the high-density material comprises a nitride of tungsten claim 1 , tantalum claim 1 , yttrium claim 1 , neodymium claim 1 , cerium claim 1 , lanthanum claim 1 , zirconium claim 1 , indium claim 1 , niobium claim 1 , molybdenum or hafnium.5. The method according to claim 1 , wherein the high-density material comprises an oxide of tungsten claim 1 , tantalum or yttrium.6. A microelectromechanical device claim 1 , ...

MICROELECTRONIC SENSOR DEVICE WITH AN OUT-OF-PLANE DETECTION HAVING A CONTROLLED CROSS SENSITIVITY

Microelectromechanical sensor with an out-of-plane detection has a cross sensitivity in a first direction in the plane with a value of S, the sensor comprising a support, a mass suspended from the support by beams stressed by bending, in such a way that the inertial mass is capable of moving with respect to the support about an axis of rotation contained in a plane of the sensor, a stress gauge suspended between the mass and the support. The bending beams have a dimension tin the out-of-plane direction and the mass has a dimension tin the out-of-plane direction such that t(tlS). Lis the distance between the centre of gravity of the mass and the centre of the bending beams projected onto the first direction. 1. Microelectromechanical sensor with an out-of-plane detection having a cross sensitivity in a first direction in the plane with a value S , said sensor comprising a support , an inertial mass suspended from the support by suspension means , a first axis of rotation about which the inertial mass pivots with respect to the support in an out-of-plane direction when the sensor is subjected to a stress in the out-of-plane direction , said suspension means comprising at least one first beam in the plane , said at least one first beam being anchored by a longitudinal end to the support and by another longitudinal end to the inertial mass , in such a way that during a movement of the inertial mass in the out-of-plane direction , said at least first beam is stressed by bending , and means for detection of the movement of the mass in the out-of-plane direction , said detection means comprising at least one first stress gauge suspended by a first end from the inertial mass and by a second end from the support and extending in parallel to said at least one first beam , wherein said to the first beam has a dimension tin the out-of-plane direction and the inertial mass has a dimension tin the out-of-plane direction such that{'br': None, 'i': t', 't', 'l', 'S, 'sub': f', 'M', ...

MICROMIRROR DEVICE AND PROJECTION DEVICE

A micromirror device including a drive unit, which includes a movable drive element, which is situated in a first plane, and a guiding device, and a mirror, which is elastically coupled to the drive element and is situated in the idle position in a second plane, which is in parallel to the first plane, the guiding device being designed to guide a movement of the drive element on a straight line situated in the first plane. Furthermore, a corresponding projection device is described. 111-. (canceled)12. A micromirror device , comprising:a drive unit situated in a first plane, the drive unit including a movable drive element and a guiding device; anda mirror elastically coupled to the drive element, the mirror being situated in an idle position in a second plane, which is in parallel to the first plane;wherein the guiding device is designed to guide a movement of the drive element on a straight line situated in the first plane.13. The micromirror device as recited in claim 12 , wherein the guiding device includes at least one first spring claim 12 , the at least one first spring including a leaf spring which has a lowest spring stiffness in a direction of the straight line and is coupled to the at least one drive element.14. The micromirror device as recited in claim 13 , wherein the at least one first spring is coupled to a carrier structure of the micromirror device at its end which is not coupled to the drive element.15. The micromirror device as recited in claim 14 , wherein a plurality of first springs is provided claim 14 , which are coupled in a symmetrically distributed way to a post standing upright on the first plane claim 14 , the post being coupled to the carrier structure of the micromirror device.16. The micromirror device as recited in claim 12 , further comprising:a magnet device;wherein the drive element includes an electrical coil, and the magnet device is designed to generate a magnetic field which exerts a force on the electrical coil in such a way ...

Micromechanical spring structure

A micromechanical spring structure, including a spring beam and a rigid micromechanical structure, the spring beam including a first end and an opposing second end along a main extension direction. The spring beam includes a fork having two support arms on at least one of the two ends, which is anchored to the rigid micromechanical structure, the two support arms being anchored to a surface of the rigid micromechanical structure, which extends perpendicular to the main extension direction of the spring beam.

CONTACT POINT STRUCTURE, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS

To provide a contact point structure of an electronic device capable of maintaining stable impact resistance. There is provided a contact point structure including: a base portion that is a semiconductor substrate; a movable contact point portion that is supported by the base portion and is a part of a movable member capable of being driven in a predetermined direction; and a fixed contact point portion that faces the movable contact point portion. The fixed contact point portion includes a fixed portion that is supported by the base portion and an extending member that extends from the fixed portion and is capable of being displaced relative to the fixed portion. 1. A contact point structure comprising:a base portion that is a semiconductor substrate;a movable contact point portion that is supported by the base portion and is a part of a movable member capable of being driven in a predetermined direction; anda fixed contact point portion that faces the movable contact point portion,wherein the fixed contact point portion includes a fixed portion that is supported by the base portion and an extending member that extends from the fixed portion and is capable of being displaced relative to the fixed portion.2. The contact point structure according to claim 1 , wherein at least one of the movable contact point portion and the fixed contact point portion includes a stopper at a position at which the movable contact point portion and the extending member of the fixed contact point portion face each other.3. The contact point structure according to claim 2 , wherein the stopper includes a metal.4. The contact point structure according to claim 2 , wherein the stopper includes a semiconductor material.5. The contact point structure according to claim 2 , wherein a ratio between a first distance from a contact portion between the fixed contact point portion and the movable contact point portion to an installation position of the stopper and a second distance from the ...

LINEAR ACTUATOR

The present invention provides a linear actuator. The linear actuator includes: a substrate having a cavity; a first fixed electrode structure fixed on the substrate; an elastic linkage; and a movable electrode structure connected to the substrate through the elastic linkage, wherein: the cavity has a first area; at least one of the first fixed electrode structure and the movable electrode structure has a second projection area on the substrate; and the first area and the second projection area overlap. The linear actuator allows the making of an out-of-plane linear motion motor with a large motion stroke, the robustness of impact, the easy removal of residual process contaminants, an improvement of the efficiency of electrical-to-mechanical energy conversion and the off-axis motion decoupling of movable comb structure. 2. The linear actuator as claimed in claim 1 , wherein the substrate has an electronic element.3. The linear actuator as claimed in claim 1 , wherein the substrate has a front surface and a rear surface claim 1 , and the cavity extends through the front and the rear surfaces.4. The linear actuator as claimed in claim 1 , further comprising a second fixed electrode structure formed on the substrate claim 1 , wherein at least one position sensing capacitor is formed by the movable electrode structure and the second fixed electrode structure claim 1 , and the at least one position sensing capacitor is disposed above one of the cavity and a second cavity of the substrate.5. The linear actuator as claimed in claim 1 , wherein the elastic element is a main hinge.6. The linear actuator as claimed in claim 5 , wherein the main hinge has a first end claim 5 , a first center point and a second end claim 5 , and the first and the second ends are fixed on the substrate.7. The linear actuator as claimed in claim 6 , wherein the movable electrode structure has a keel connected with the first center point.8. The linear actuator as claimed in claim 6 , further ...

Tunable spectrum sensing device, out-of-plane motion motor and producing method thereof

The present invention provides a tunable spectrum sensing device. The tunable spectrum sensing device includes: a device body; an out-of-plane motion motor mounted on the device body and including: a base having a normal direction; and a single-axis actuator having a motion direction parallel to the normal direction, and including: a substrate with an electronic element; and an actuating end driven by the electronic element; a first glass mounted on and moved by the actuating end; and a second glass mounted on the device body. The out-of-plane motion motor can keep an object at a specific rotation angle, position the object at a specific out-of-plane displacement or be programmed for the object to perform a specific scan trajectory motion. The out-of-plane motion motor also has a large motion stroke, and thus, there is no need to use multiple tunable spectrum sensing devices to satisfy the spectral bandwidth requirement.

Microelectromechanical component and corresponding production method

A micro-electromechanical component includes: an electrically conductive substrate having an upper side and an underside; a structured electrically conductive first functional layer fashioned on the upper side of the substrate; an elastically deflectable actuator device suspended via a spring device fashioned in the first functional layer; a movable first electrode device extending vertically through the substrate and connected to the actuator device; and a stationary second electrode device extending vertically through the substrate, at a distance from the first electrode device, the actuator device being configured to be deflected through the application of an electrical voltage between the first and the second electrode device.

ANCHOR STRUCTURE FOR REDUCING TEMPERATURE-BASED ERROR

The present invention relates to microelectromechanical systems (MEMS), and more specifically to an anchor structure for anchoring MEMS components within a MEMS device. The anchor points for rotor and stator components of the device are arranged such that the anchor points are arranged along and overlap a common axis. 1. A MEMS device comprising:a substrate, which defines a substrate plane;a rotor mounted to the substrate via a rotor anchor point, wherein the rotor is capable of rotation with respect to the substrate plane; andtwo stators, wherein the position of each stator is fixed with respect to the substrate plane and mounted to the substrate via a stator anchor point;wherein the rotor anchor point and stator anchor points are arranged such that all of the anchor points overlap a common axis.2. The MEMS device of claim 1 , wherein the width of the rotor anchor point and stator anchor points is the same claim 1 , and wherein the rotor anchor point and stator anchor points are aligned along the common axis.3. The MEMS device of claim 1 , wherein the rotor anchor point and stator anchor points are rectangular.4. The MEMS device of claim 1 , wherein the stator anchor points are L-shaped and wherein the L-shaped stator anchor points are arranged such that:the L-shapes of the stator anchor points are the same size and one of one of the stator anchor points is rotated by 180 degrees relative to the other stator anchor points;first portion of each L-shape is parallel to the common axis and a second portion of each L-shape is perpendicular to the common axis; andthe second portions of the L-shaped stator anchor points are aligned along the common axis.5. The MEMS device of claim 4 , wherein the first portions of the L-shaped stator anchor points overlap a second axis claim 4 , the second axis being perpendicular to the common axis.6. The MEMS device of claim 4 , wherein the width of the rotor anchor point measured perpendicular to the common axis is the same as the ...

Micro-electro-mechanical device with a movable structure, in particular micromirror, and manufacturing process thereof

A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

INTEGRATED MECHANICAL DEVICE WITH VERTICAL MOVEMENT

A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit. 1. An integrated circuit , comprising:a substrate;an interconnection region overlying the substrate, the interconnection region comprising a plurality of metallization levels and a via level; a first element located within a first metallization level of the plurality of metallization levels, the first element extending from the fixed end zone into the cavity;', 'a second element secured to an underside of the first element and located within the via level, which is adjacent to the first metallization level, the second element extending from the fixed end zone into the cavity, wherein a length of the first element is greater than a length of the second element; and', 'an electrically conductive body arranged at least partly in the cavity, the thermally deformable electrically conductive assembly having different configurations corresponding respectively to different distances along a direction between the free end zone and the electrically conductive body, the thermally deformable electrically conductive assembly being activatable in order to change from one configuration to another, wherein one of the configurations corresponds to a zero distance such that only the first element at the free end zone is in physical contact with the electrically conductive body so as to establish an electrical connection passing through the electrically conductive body and the thermally deformable electrically conductive assembly, wherein the first metallization level and the first via level have the same metal and wherein the second element comprises an insulating portion between two metal portions., 'a device comprising a thermally deformable electrically conductive ...

MEMS DEVICE

MEMS devices include fluid confinement structures on either a fixed part of a substrate and/or on a suspended element. The fluid confinement structures may be configured to confine a viscoelastic fluid in a limited part of a gap between one or more vertical sidewalls of both the fixed part of the substrate and either the suspended element or the drive beam or both the suspended element and drive beam such that one part of the gap is bridged by the fluid and another part of the gap is not, The structures may be configured to prevent flow of the fluid to other parts of the gap. 1100200300500600700. A MEMS device (; ; ; ; ; ) , comprising:{'b': 111', '211, 'a substrate (; );'}{'b': 101', '201', '301', '407', '501', '601', '701', '901', '1101', '110', '210', '310', '510', '610', '710', '810', '1110', '111', '211', '104', '204', '304', '504', '604', '1104', '104', '204', '304', '504', '604', '1104', '101', '201', '301', '407', '501', '601', '701', '901', '1101', '110', '210', '310', '510', '610', '710', '810', '1110', '111', '211, 'a suspended element (; ; ; ; ; ; ; ; ) connected to a fixed part (; ; ; ; ; ; ; ); ofthe substrate (; ) by one or more flexures (; ; ; ; ; ), wherein the one or more flexures (; ; ; ; ; ) are configured to permit movement of the suspended element (; ; ; ; ; ; ; ; ) relative to a fixed part (; ; ; ; ; ; ; ) of the substrate (; );'}{'b': 107', '207', '307', '407', '507', '607', '707', '1107', '101', '201', '301', '407', '501', '601', '701', '901', '1101, 'a drive beam (; ; ; ; ; ; ; ) connected to suspended element (; ; ; ; ; ; ; ; ); and'}{'b': 312', '313', '409', '411', '413', '511', '513', '611', '613', '711', '713', '714', '813', '814', '913', '915', '1014', '1111', '1113', '110', '210', '310', '510', '610', '710', '810', '1110', '111', '211', '101', '201', '301', '407', '501', '601', '701', '901', '1101', '208', '308', '408', '508', '608', '708', '808', '1008', '1108', '1201', '611', '711', '811', '1011', '110', '210', '310', '510', '610', ...

Epi-Poly Etch Stop for Out of Plane Spacer Defined Electrode

In one embodiment, a method of forming an out-of-plane electrode includes forming an oxide layer above an upper surface of a device layer, etching an etch stop perimeter defining trench extending through the oxide layer, forming a first cap layer portion on an upper surface of the oxide layer and within the etch stop perimeter defining trench, etching a first electrode perimeter defining trench extending through the first cap layer portion and stopping at the oxide layer, depositing a first material portion within the first electrode perimeter defining trench, depositing a second cap layer portion above the deposited first material portion, and vapor releasing a portion of the oxide layer with the etch stop portion providing a lateral etch stop. 1. A method of forming an out-of-plane electrode , comprising:forming an oxide layer above an upper surface of a device layer;etching an etch stop perimeter defining trench extending through the oxide layer;forming a first cap layer portion on an upper surface of the oxide layer and within the etch stop perimeter defining trench;etching a first electrode perimeter defining trench extending through the first cap layer portion and stopping at the oxide layer;depositing a first material portion within the first electrode perimeter defining trench;depositing a second cap layer portion above the deposited first material portion; andvapor releasing a portion of the oxide layer with the etch stop portion providing a lateral etch stop.2. The method of claim 1 , further comprising:depositing a third cap layer portion above the second cap layer portion after vapor releasing the portion of the oxide layer;etching a second electrode perimeter defining trench extending through the second cap layer portion and the third cap layer portion; anddepositing a second material portion within the second electrode perimeter defining trench, such that a spacer including the first material portion and the second material portion define a perimeter ...

THERMAL METAMATERIAL FOR LOW POWER MEMS THERMAL CONTROL

A thermal metamaterial device comprises at least one MEMS thermal switch, comprising a substrate layer including a first material having a first thermal conductivity, and a thermal bus over a first portion of the substrate layer. The thermal bus includes a second material having a second thermal conductivity higher than the first thermal conductivity. An insulator layer is over a second portion of the substrate layer and includes a third material that is different from the first and second materials. A thermal pad is supported by a first portion of the insulator layer, the thermal pad including the second material and having an overhang portion located over a portion of the thermal bus. When a voltage is applied to the thermal pad, an electrostatic interaction occurs to cause a deflection of the overhang portion toward the thermal bus, thereby providing thermal conductivity between the thermal pad and the thermal bus. 1. A device comprising: a substrate layer including a first material having a first thermal conductivity;', 'a thermal bus over a first portion of the substrate layer, the thermal bus including a second material having a second thermal conductivity that is higher than the first thermal conductivity;', 'an insulator layer over a second portion of the substrate layer, the insulator layer including a third material that is different from the first and second materials, the insulator layer including a first portion having a first height, and a second portion having a second height that is less than the first height; and', 'a thermal pad supported by the first portion of the insulator layer, the thermal pad including the second material and having an overhang portion, wherein the overhang portion is located over a portion of the thermal bus;, 'at least one micro-electro-mechanical (MEMS) thermal switch, comprisingwherein when a voltage is applied to the thermal pad, an electrostatic interaction occurs between the thermal pad and the thermal bus to cause a ...

Mirror unit and optical module

A mirror unit 2 includes a mirror device 20 including a base 21 and a movable mirror 22, an optical function member 13, and a fixed mirror 16 that is disposed on a side opposite to the mirror device 20 with respect to the optical function member 13. The optical function member 13 is provided with a light transmitting portion 14 that constitutes a part of an optical path between the beam splitter unit 3 and the fixed mirror 16. The light transmitting portion 14 is a portion that corrects an optical path difference that occurs between an optical path between the beam splitter unit 3 and the movable mirror 22 and the optical path between the beam splitter unit 3 and the fixed mirror 16. The second surface 21b of the base 21 and the third surface 13a of the optical function member 13 are joined to each other.

Stiction resistant mems device and method of operation

A MEMS device ( 20 ) includes a movable element ( 20 ) suspended above a substrate ( 22 ) by a spring member ( 34 ) having a spring constant ( 104 ). A spring softening voltage ( 58 ) is applied to electrodes ( 24, 26 ) facing the movable element ( 20 ) during a powered mode ( 100 ) to decrease the stiffness of the spring member ( 34 ) and thereby increase the sensitivity of the movable element ( 32 ) to an input stimulus ( 46 ). Upon detection of a stiction condition ( 112 ), the spring softening voltage ( 58 ) is effectively removed to enable recovery of the movable element ( 32 ) from the stiction condition ( 112 ). A higher mechanical spring constant ( 104 ) yields a stiffer spring ( 34 ) having a larger restoring force ( 122 ) in the unpowered mode ( 96 ) in order to enable recovery from the stiction condition ( 112 ). A feedback voltage ( 56 ) can be applied to feedback electrodes ( 28, 30 ) facing the movable element ( 32 ) to provide electrical damping.

MEMS DEVICE WITH CAPACITANCE ENHANCEMENT ON QUADRATURE COMPENSATION ELECTRODE

A MEMS device includes a mass system capable of undergoing oscillatory drive motion along a drive axis and oscillatory sense motion along a sense axis perpendicular to the drive axis. A quadrature correction unit includes a fixed electrode and a movable electrode coupled to the movable mass system, each being lengthwise oriented along the drive axis. The movable electrode is spaced apart from the fixed electrode by a gap having an initial width. At least one of the fixed and movable electrodes includes an extrusion region extending toward the other of the fixed and movable electrodes. The movable electrode undergoes oscillatory motion with the mass system such that the extrusion region is periodically spaced apart from the other of the fixed and movable electrodes by a gap exhibiting a second width that is less than the first width thereby enabling capacitance enhancement between the electrodes. 1. A MEMS device for capacitance enhancement comprising:a fixed electrode coupled to a substrate and lengthwise oriented in a first direction;a movable electrode coupled to and extending from a movable mass system, said movable electrode being lengthwise oriented in said first direction, said movable electrode being spaced apart from said fixed electrode by a gap in a second direction that is perpendicular to said first direction; andan extrusion region extending in said second direction from one of said fixed and movable electrodes toward the other of said fixed and movable electrodes.2. The MEMS device of wherein:said gap between said fixed and movable electrodes is a first gap exhibiting a first width; andsaid movable electrode is configured to undergo oscillatory motion with said mass system such that said extrusion region is periodically spaced apart from the other of said fixed and movable electrodes by a second gap exhibiting a second width, said second width being less than said first width.3. The MEMS device of wherein:said first width is a minimum allowable spacing ...

Cellular Array Electrostatic Actuator

Illustrative embodiments provide an electrostatic actuator and methods of making and operating an electrostatic actuator. The electrostatic actuator comprises a framework and a plurality of electrodes. The framework comprises walls defining a plurality of cells forming an array of cells. The plurality of electrodes comprise an electrode in each cell in the plurality of cells. A gap separates the electrode in each cell from the walls of the cell. The framework is configured to contract in response to an electrical signal applied between the framework and the plurality of electrodes. 1. An electrostatic actuator , comprising:a framework comprising walls defining a plurality of cells forming an array of cells;a plurality of electrodes comprising an electrode in each cell in the plurality of cells;a gap separating the electrode in each cell from the walls of the cell;a plurality of flexible electrical interconnects electrically connected to the plurality of electrodes and electrically isolated and mechanically anchored to the framework at a plurality of nodes of the framework;wherein the framework is configured to contract in response to an electrical signal applied between the framework and the plurality of electrodes; andwherein the plurality of nodes deform less than other portions of the framework when the electrical signal is applied between the framework and the plurality of electrodes.2. The electrostatic actuator of claim 1 , further comprising:a support structure coupled to a first portion of the framework;a base connected to the framework that extends across at least a portion of a first side of the framework to connect together one side of at least a portion of the array of cells,wherein cells attached to the base contract less on the first side that is attached to the base than on a second side that is not attached to base causing framework to bend when the electrical signal is applied between the framework and the plurality of electrodes; andwherein a ...

MICRO-MECHANICAL DEVICE WITH LOCAL ELECTROMAGNETIC ACTUATION

A micromechanical device with electromagnetic actuation includes a base and a micro electro mechanical system (MEMS). The MEMS includes a mobile rotating element based on one or two axes of rotation. The base includes stators each forming a first internal pole, an external pole and an air gap. In order to increase the reliability and the mechanical stability of the device, the first internal poles are mounted in a connected manner to each other onto the base. 18-. (canceled)9. A micromechanical device with electromagnetic actuation , comprising:a base;a plate;a micro electro mechanical system (MEMS) mounted indirectly through the plate onto the base, the MEMS comprising a rotating element having a first axis of rotation and a first rotor comprising at least one first conductor line and two first segments detached from the rotating element so as to define two empty spaces internal and external to the first rotor,{'o': [{'@ostyle': 'single', 'B'}, {'@ostyle': 'single', 'B'}], 'two first stators each made up of a first internal pole, a first external pole and a first air gap together defining a magnetic field , each one of the two first segments arranged in one of the first air gaps perpendicularly to field , so that the first internal poles and first external poles are placed in the two empty spaces internal to and external to the first rotor,'}the first internal poles are mounted in a connected manner to each other onto the base and the MEMS is mounted indirectly through the plate onto the base.10. The micromechanical device of claim 9 , wherein the MEMS is fixed to the base using an intermediary metal plate with a coefficient of thermal expansion close to that of silicon.11. The micromechanical device of claim 10 , wherein the intermediary plate includes essentially rectangular cutouts in a vicinity of welding points that attach the intermediary plate to the base.12. The micromechanical device of claim 9 , wherein:the rotating element is movable about a second axis ...

MEMS Actuation Systems and Methods

A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly. 1. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate;mounting an image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator; andelectrically coupling the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.2. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of wherein mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate includes:applying epoxy to the metal plate;positioning the micro-electrical-mechanical system (MEMS) actuator on the epoxy; andcuring the epoxy.3. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of wherein mounting an image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator includes:applying epoxy to the micro-electrical-mechanical system (MEMS) actuator;positioning the image sensor on the epoxy; andcuring the epoxy.4. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of wherein electrically coupling the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator includes:wirebonding the image sensor assembly to the micro-electrical-mechanical system (MEMS) actuator.5. The method of manufacturing a micro-electrical-mechanical system (MEMS) assembly of further comprising:mounting the micro-electrical-mechanical system ( ...

ACTUATOR PLATE PARTITIONING AND CONTROL DEVICES AND METHODS

Devices and methods of operating partitioned actuator plates to obtain a desirable shape of a movable component of a micro-electro-mechanical system (MEMS) device. The subject matter described herein can in some embodiments include a micro-electro-mechanical system (MEMS) device including a plurality of actuation electrodes attached to a first surface, where each of the one or more actuation electrode being independently controllable, and a movable component spaced apart from the first surface and movable with respect to the first surface. Where the movable component further includes one or more movable actuation electrodes spaced apart from the plurality of fixed actuation electrodes. 1. A micro-electro-mechanical system (MEMS) device comprising:a first plurality of fixed actuation electrodes attached to a first surface, wherein each of the plurality of fixed actuation electrodes is independently controllable;a second plurality of fixed actuation electrodes attached to a second surface that is spaced apart from the first surface, wherein each of the plurality of actuation electrodes is independently controllable; andat least one actuation electrode attached to a movable component,wherein the movable component is positioned between the first surface and the second surface and is movable with respect to the first or second surface.2. The MEMS device of further comprising at least one fixed capacitor plate fixed to one or both of the first and second surfaces and spaced apart from at least one movable capacitive electrode fixed to the movable component.3. The MEMS device of claim 2 , wherein the first and second plurality of fixed actuation electrodes are selectively controllable to deflect the movable component relative to the first or second surface to any of a plurality of positions corresponding to a plurality of capacitance states of the at least one fixed capacitor plate and the at least one movable capacitive electrode.4. The MEMS device of claim 1 , comprising ...

MICROMACHINED MULTI-AXIS GYROSCOPES WITH REDUCED STRESS SENSITIVITY

In a general aspect, a micromachined gyroscope can include a substrate and a static mass suspended in an x-y plane over the substrate by a plurality of anchors attached to the substrate. The static mass can be attached to the anchors by anchor suspension flexures. The micromachined gyroscope can include a dynamic mass surrounding the static mass and suspended from the static mass by one or more gyroscope suspension flexures. 1. A micromachined gyroscope comprising:a substrate;a static mass suspended in an x-y plane over the substrate by a plurality of anchors attached to the substrate, the static mass attached to the anchors by anchor suspension flexures; anda dynamic mass surrounding the static mass and suspended from the static mass by one or more gyroscope suspension flexures.2. The micromachined gyroscope of claim 1 , wherein the static mass is suspended in the x-y plane over the substrate by a geometrically distributed arrangement of the plurality of anchors claim 1 , the geometrically distributed arrangement of the anchors tracking substrate deformation and averaging capacitive gaps between out-of-plane rate sense electrodes placed on the substrate and the dynamic mass.3. The micromachined gyroscope of claim 1 , wherein the plurality of anchors include a symmetrical arrangement of four anchors claim 1 , each of the four anchors attached to the substrate at about a same radial distance from a center of the gyroscope.4. The micromachined gyroscope of claim 1 , wherein the static mass has an X shape.5. The micromachined gyroscope of claim 4 , wherein the dynamic mass is attached to the static mass at about the bottoms of the valleys of the X shape by the one or more gyroscope suspension flexures.6. The micromachined gyroscope of claim 5 , wherein the one or more gyroscope suspension flexures include a C-beam flexure.7. The micromachined gyroscope of further comprising one or more sense electrodes disposed on the substrate and configured to detect x-axis and y- ...

Electrical tuning of resonant scanning

A scanning device includes a frame, having a central opening, and an array including a plurality of parallel mirrors contained within the central opening of the frame. Hinges respectively connect the mirrors to the frame and define respective, mutually-parallel axes of rotation of the mirrors relative to the frame. A main drive applies a driving force to the array so as to drive an oscillation of the mirrors about the hinges at a resonant frequency of the array. A sensor is configured to detect a discrepancy in a synchronization of the oscillation among the mirrors in the array, and an adjustment circuit applies a corrective signal to at least one of the mirrors in order to alleviate the detected discrepancy.

In-plane-strain-actuated out-of-plane actuator

A micromechanical device capable of providing out-of-plane motion and force generation in response to an in-plane strain applied to the device is provided. Embodiments of the present invention comprise one or more islands that are operatively coupled with one or more hinges. The hinges are operative for inducing rotation of the islands when a lateral strain is applied to the structure. In some embodiments, the hinges are also electrically conductive such that they enable electrical communication between the one or more islands and devices external to the structure. Some embodiments of the present invention are particularly well suited for use in biological applications. Some devices in accordance with the present invention are fabricated using conventional planar processes, such as flex-circuit fabrication techniques.

MICROMECHANICAL SPRING DEVICE AND METHOD FOR MANUFACTURING A MICROMECHANICAL SPRING DEVICE

A micromechanical device and a corresponding manufacturing method. The micromechanical device includes: a spring element which is moveably coupleable or is moveably coupled to a frame unit at at least one connecting point of the spring element, the spring element including at least one web, which extends outward from the at least one connecting point; and the at least one web being structured in such a way that it includes at least one first section as well as at least one widening section for reducing a non-linearity of the spring element, which is widened compared to the first section. 110-. (canceled)11. A micromechanical device , comprising:a spring element, which is moveably coupleable or moveably coupled to a frame unit at at least one connecting point of the spring element, the spring element including at least one web which extends starting from the at least one connecting point;wherein the at least one web is structured in such a way that it includes at least one first section and at least one widening section for reducing a non-linearity of the spring element, which is widened compared to the first section.12. The device as recited in claim 11 , wherein the at least one widening section has a greater cross sectional area than the first section.13. The device as recited in claim 11 , wherein the at least one widening section is formed at least partly by a mass unit claim 11 , which is formed on the web as part of the spring element.14. The device as recited in claim 13 , wherein the mass unit leaves a stiffness of the spring element unchanged.15. The device as recited in claim 13 , wherein the mass unit is formed at least partly as one piece with the web.16. The device as recited in claim 13 , wherein the mass unit is disk-shaped.17. The device as recited in claim 13 , wherein the mass unit is cuboid-shaped.18. The device as recited in claim 11 , wherein the spring element includes at least two webs claim 11 , each having the first section and the at least ...

INERTIA SENSOR

Provided is an inertia sensor that can be reduced in size. An inertia sensor having layers in which detection parts are formed, the inertial sensor being a laminated structure obtained by laminating two or more of the layers. 1. An inertial force sensor comprising a layer in which a detector is formed ,wherein the layer is a laminated structure in which two or more layers are laminated.2. The inertial force sensor according to claim 1 ,wherein the detector includes a movable body and an electrode.3. The inertial force sensor according to claim 2 ,wherein at least one pair of detectors is arranged such that the movable body and the electrode are formed in a same layer.4. The inertial force sensor according to claim 2 ,wherein at least one pair of detectors is arranged such that the movable body and the electrode are formed in mutually different layers.5. The inertial force sensor according to claim 4 ,wherein, in the detector in which the movable body and the electrode are formed in mutually different layers,the electrode is formed in the same layer as the layer in which the movable body of another detector is formed.6. The inertial force sensor according to claim 1 ,wherein the at least one pair of detectors are provided in two sets or more, and arranged in an array.7. The inertial force sensor according to claim 1 ,wherein a signal of the sensor is extracted solely on one side of the laminated structure.8. The inertial force sensor according to claim 7 ,wherein a signal of the detector passes through the laminated structure.9. The inertial force sensor according to claim 1 ,wherein at least one layer has a structure of a microelectromechanical system.10. The inertial force sensor according to claim 1 ,wherein at least one detector has a portion that detects pressure.11. The inertial force sensor according to claim 1 ,wherein at least one layer is a layer in which an LSI element is formed.12. The inertial force sensor according to claim 1 ,wherein at least one layer ...

SENSOR ASSEMBLY AND ARRANGEMENT AND METHOD FOR MANUFACTURING A SENSOR ASSEMBLY

A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board. 1. A sensor assembly for being mounted on a circuit board , the sensor assembly comprising a first main surface, a second main surface opposite to the first main surface and at least one opening extending between the first and the second main surface; and', 'at least two stress decoupling elements, wherein each of the at least two stress decoupling elements comprises a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening;, 'an interposer with'}a sensor die connected to the flexible structures on the first main surface; andat least two board connection elements adapted for connecting the sensor assembly to the circuit board, the at least two board connection elements being arranged on the first main surface.2. The sensor assembly according to claim 1 , wherein the sensor die comprises a sensor element configured to generate at least one sensor signal depending on an environmental parameter and the sensor die further comprises a readout circuitry configured to generate at least one output signal depending on at least one sensor signal.3. The sensor assembly according to claim 1 , wherein the sensor element is arranged on a first sensor surface of the sensor die facing the first main surface.4. The sensor assembly according to claim 1 , wherein an air gap is present between the interposer and the ...

MEMS DEVICE COMPRISING A MEMBRANE AND AN ACTUATOR

A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction. 1. A device , comprising:a support defining a cavity having a central axis;a membrane coupled to a first surface of the support and having a first portion extending over the cavity;a projection region extending from a first surface of the membrane into the cavity;a first actuator positioned on a second surface of the membrane opposite the first surface;a second actuator positioned on a second surface of the membrane further from the central axis than the first actuator and surrounding the first actuator and the projection region.2. The device of claim 1 , wherein the first and second actuators are collectively configured to deflect the membrane in either a first direction or a second direction responsive to a voltage applied between the first and second actuators.3. The device of claim 2 , wherein the first and second actuators include a piezoelectric material.4. The device of claim 1 , wherein the second actuator is positioned on the second surface of the membrane partially over the support and partially over the cavity.5. The device of claim 4 , wherein the first actuator is positioned on the second surface of the membrane entirely over the cavity.6. The device of claim 1 , wherein the membrane includes an ...

MICRO ELECTROMECHANICAL SYSTEM SENSOR AND METHOD OF FORMING THE SAME

A micro electromechanical system (MEMS) device includes a MEMS section attached to a substrate, and a cap bonded to a first surface of the substrate. The MEMS device further includes a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section. The MEMS device further includes a bond pad on a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section. 1. A micro electromechanical system (MEMS) device comprising:a MEMS section attached to a substrate;a cap bonded to a first surface of the substrate;a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section; anda bond pad on a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section.2. The MEMS device of claim 1 , further comprising a conductive plug extending through the carrier claim 1 , the conductive plug connected to the bond pad claim 1 , wherein the conductive plug comprises tungsten.3. The MEMS device of claim 1 , further comprising an isolation trench extending through the carrier claim 1 , the isolation trench surrounding the bond pad claim 1 , wherein the bond pad is configured to receive a signal through the carrier between the isolation trench.4. The MEMS device of claim 3 , wherein a surface of the bond pad is level with a surface of the carrier.5. The MEMS device of claim 1 , further comprising an active circuit wafer claim 1 , the active circuit wafer comprising:an active circuit substrate comprising active devices; andan interconnect structure configured to convey signals to and from the active devices, wherein the interconnect structure is boned to the surface of the carrier opposite the MEMS ...

Method for manufacturing mems torsional electrostatic actuator

A method for manufacturing an MEMS torsional electrostatic actuator comprises: providing a substrate, wherein the substrate comprises a first silicon layer, a buried oxide layer and a second silicon layer that are laminated sequentially; patterning the first silicon layer and exposing the buried oxide layer to form a rectangular upper electrode plate separated from a peripheral region, wherein the upper electrode plate and the peripheral region are connected by only using a cantilever beam, and forming, on the peripheral region, a recessed portion exposing the buried oxide layer; patterning the second silicon layer and exposing the buried oxide layer to form a back cavity, wherein the back cavity is located in a region of the second silicon layer corresponding to the upper electrode plate, covers 40% to 60% of the area of the region corresponding to the upper electrode plate, and is close to one end of the cantilever beam; exposing the second silicon layer, and suspending the upper electrode plate and the cantilever beam; and respectively forming an upper contact electrode and a lower contact electrode on the second silicon layer.

Movable reflection device and reflection surface drive system utilizing same

A mirror with a reflective layer formed thereon is supported within a frame-shaped support by two U-shaped arms. A plate-like arm connects fixation points (Q 1 , Q 2 ), and a plate-like arm connects fixation points (Q 3 , Q 4 ). A pair of piezoelectric elements (E 11 , E 12 ) disposed along a longitudinal axis (L 1 ) on an upper surface of an outside bridge of the arm, and a single piezoelectric element (E 20 ) disposed along the longitudinal axis (L 2 ) on the upper surface of an inside bridge. Similarly, a pair of piezoelectric elements (E 31 , E 32 ) disposed on an upper surface of an outside bridge of the arm, and a single piezoelectric element (E 40 ) disposed on the upper surface of an inside bridge. When a positive drive signal is applied to the piezoelectric elements (E 11 , E 20 , E 31 , E 40 ) and a negative drive signal is applied to the piezoelectric elements (E 12 , E 32 ), the mirror is displaced efficiently.

MEMS DEVICE COMPRISING A MEMBRANE AND AN ACTUATOR

A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction. 1. A method , comprising:forming a first semiconductor layer on a first surface of a substrate;forming a first epitaxial layer on the first semiconductor layer and on the first surface of the substrate;forming a second semiconductor layer on the first epitaxial layer;forming a second epitaxial layer on the second semiconductor layer;forming a first piezoelectric actuator and a second piezoelectric actuator on the second epitaxial layer spaced apart from each other; andforming a cavity extending through the substrate, the first epitaxial layer and the second semiconductor layer.2. The method of claim 1 , wherein forming the cavity includes:exposing a first surface of the second epitaxial layer; andforming a first projecting region on the first surface of the second epitaxial layer and extending into the cavity.3. The method of claim 2 , wherein forming the first projecting region includes forming the first projecting region with first respective portions of the first epitaxial layer and the second semiconductor layer.4. The method of claim 2 , wherein forming the first projecting region includes forming the first projecting region with first respective portions of the first semiconductor layer claim 2 , the ...

MEMS TRANSDUCER FOR INTERACTING WITH A VOLUME FLOW OF A FLUID AND METHOD FOR MANUFACTURING THE SAME

A MEMS transducer for interacting with a volume flow of a fluid includes a substrate including a cavity, and an electromechanical transducer connected to the substrate in the cavity and including an element deformable along a lateral movement direction, wherein a deformation of the deformable element along the lateral movement direction and the volume flow of the fluid are causally related. 1. A MEMS transducer for interacting with a volume flow of a fluid , comprising:a substrate comprising a cavity;an electromechanical transducer connected to the substrate in the cavity and comprising an element deformable along a lateral movement direction, wherein a deformation of the deformable element along the lateral movement direction and the volume flow of the fluid are causally related;wherein the deformation of the deformable element is a curvature of the deformable element in-plane with respect to the substrate.2. The MEMS transducer according to claim 1 , wherein the electromechanical transducer is connected to the substrate in a force-fitted or in a form-fitted manner.3. The MEMS transducer according to claim 1 , wherein the deformable element comprises an active bending bar and is configured to contact the volume flow of the fluid.4. The MEMS transducer according to claim 1 , wherein the electromechanical transducer is configured to claim 1 , in response to an electrical drive claim 1 , causally cause a movement of the fluid in the cavity and/or claim 1 , in response to the movement of the fluid in the cavity claim 1 , to causally provide an electrical signal.5. The MEMS transducer according to claim 1 , comprising a first and a second electromechanical transducer connected to the substrate and each comprising an element deformable along the lateral movement direction claim 1 , which is configured to be deformed along the lateral movement direction claim 1 , wherein the first electromechanical transducer and the second electromechanical transducer are configured to ...

MICROELECTROMECHANICAL DISPLACEMENT STRUCTURE AND METHOD FOR CONTROLLING DISPLACEMENT

The present disclosure provides a displacement amplification structure and a method for controlling displacement. In one aspect, the displacement amplification structure of the present disclosure includes a first beam and a second beam substantially parallel to the first beam, an end of the first beam coupled to a fixture site, and an end of the second beam coupled to a motion actuator; and a motion shutter coupled to an opposing end of the first and second beams. In response to a displacement of the motion actuator along an axis direction of the second beam, the motion shutter displaces a distance along a transversal direction substantially perpendicular to the axis direction. 112-. (canceled)13. A thermally actuated displacement amplification structure , comprising:a motion actuator having a first thermally actuated beam and a second thermally actuated beam that are coupled at an output portion of the motion actuator;a motion shutter coupled to a first shutter beam and a second shutter beam, a first end of the first shutter beam coupled to a fixture site, and a first end of the second shutter beam coupled to the motion actuator at the output portion; andwherein, in response to a displacement of the motion actuator along an axis direction of the second shutter beam, the motion shutter displaces along a transverse direction relative to the axis direction.14. The structure of claim 13 , wherein the displacement of the motion actuator along the axis direction ranges from about 25 to about 50 microns and the motion shutter displaces a distance along the transverse direction of between 500 microns and 1000 microns.15. The structure of claim 13 , wherein the first shutter beam and the second shutter beam have a strip shape and comprise an elastic material.16. The structure of claim 13 , wherein the motion shutter has a shape selected from one of a square claim 13 , a rectangle claim 13 , a circle claim 13 , an oval claim 13 , and a polygon.17. The structure of claim 13 , ...

SENSOR PACKAGE HAVING A MOVABLE SENSOR

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members. 1. A sensor package , comprising: a fixed frame; and', 'a moveable platform configured to be moved with respect to the fixed frame along at least one direction;, 'a micro-electromechanical system (MEMS) actuator, comprisingat least one elastic restoring member each being formed as a straight line between the fixed frame and the moveable platform, and configured to restore a position of the moved moveable platform; anda sensor chip arranged on the moveable platform.2. The sensor package as claimed in claim 1 , whereinthe at least one elastic restoring member is a patterned metal layer, andthe sensor chip is configured to transmit detected data via the at least one elastic restoring member.3. The sensor package as claimed in claim 1 , wherein the sensor chip comprises solder balls electrically connected to the at least one elastic restoring member.4. The sensor package as claimed in claim 1 , wherein the movable platform has a rectangular shape claim 1 , and the at least one elastic restoring member is formed between two opposite sides of the rectangular shape and the fixed frame.5. The sensor package as claimed in claim 1 , wherein the movable platform has a rectangular shape claim 1 , and the at least one elastic restoring member is formed between four corners of the rectangular shape and the fixed frame.6. The sensor package as claimed in claim 1 , whereinthe fixed frame has a plurality of first comb electrodes and the moveable platform has a plurality of second comb ...

MICRO-ELECTROMECHANICAL APPARATUS HAVING CENTRAL ANCHOR

A micro-electromechanical (MEMS) apparatus includes a substrate, two first anchors, a frame, and two elastic members. The substrate is provided with a reference point thereon. The frame surrounds the two first anchors, and each of the elastic members connects the corresponding first anchor and the frame. Each of the first anchors is disposed near the center of the MEMS apparatus to decrease an effect caused by warpage of the substrate. The MEMS apparatus can be applied to an MEMS sensor having a rotatable mass, such as a three-axis accelerometer or a magnetometer, to improve process yield, reliability, and measurement accuracy. 1. A micro-electromechanical apparatus , comprising:a substrate;two first anchors disposed on the substrate, wherein a distance from each of the first anchors to a reference point of the substrate is equal;a frame surrounding the two first anchors; andtwo elastic members wherein each of the two first anchors is connected to the frame through corresponding one of the two elastic members,wherein the distance from each of the first anchors to the reference point is less than a distance from each of the first anchors to the frame.2. The micro-electromechanical apparatus as recited in claim 1 , wherein a distance from an inner side of the frame to another inner side of the frame is L claim 1 , and a distance between the two first anchors is less than L/4.3. The micro-electromechanical apparatus as recited in claim 1 , wherein each of the elastic members comprises:a fixed end connected to the corresponding first anchor;a movable end connected to the frame; anda connecting portion connected to the fixed end and the movable end, wherein a width of the fixed end is greater than a width of the connecting portion.4. The micro-electromechanical apparatus as recited in claim 3 , wherein a width of the movable end is greater than the width of the connecting portion.5. The micro-electromechanical apparatus as recited in claim 1 , further comprising at least ...

Microelectromechanical displacement structure and method for controlling displacement

The present disclosure provides a displacement amplification structure and a method for controlling displacement. In one aspect, the displacement amplification structure of the present disclosure includes a first beam and a second beam substantially parallel to the first beam, an end of the first beam coupled to a fixture site, an end of the second beam coupled to a motion actuator, and a motion shutter coupled to an opposing end of the first and second beams. In response to a displacement of the motion actuator along an axis direction of the second beam, the motion shutter displaces a distance along a transversal direction substantially perpendicular to the axis direction.

SWITCHABLE DISPLAYS WITH MOVABLE PIXEL UNITS

In an example, a switchable display may include a movable pixel unit having a rotatable motive element. The movable pixel unit may further include a first display unit having a first display characteristic and disposed on a first side of the rotatable motive element. The movable pixel unit may further include a second display unit having a second display characteristic and disposed on a second side of the rotatable motive unit, different from the first side. 1. A switchable display , comprising: a rotatable motive element;', 'a first display unit having a first display characteristic disposed on a first side of the rotatable motive element; and, 'a movable pixel unit, comprisinga second display unit having a second display characteristic, different from the first display characteristic, and disposed on a second side of the rotatable motive element, different from the first side.2. The switchable display of claim 1 , wherein the first display characteristic is an emissive display characteristic claim 1 , and the second display characteristic is a reflective display characteristic.3. The switchable display of claim 2 , further comprising a display screen.4. The switchable display of claim 3 , wherein the rotatable motive element is to position the first display unit to face the display screen in a first display mode claim 3 , and to position the second display unit to face the display screen in a second display mode.5. The switchable display of claim 4 , wherein the first and second display units are to be substantially parallel to the display screen when disposed in the first display mode and the second display mode claim 4 , respectively.6. The switchable display of claim 4 , wherein the rotatable motive element comprises a microelectromechanical motor.7. A switchable display claim 4 , comprising:a display screen; a rotatable motive element;', 'a first display unit having a first display characteristic and disposed on a first side of the rotatable motive element; ...

Mems actuator structures resistant to shock

Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

ACTUATOR DEVICE

An actuator device includes a support portion, a movable portion, a connection portion which connects the movable portion to the support portion on a second axis, a first wiring which is provided on the connection portion, a second wiring which is provided on the support portion, and an insulation layer which includes a first opening exposing a surface opposite to the support portion in a first connection part located on the support portion in one of the first wiring and the second wiring and covers a corner of the first connection part. The rigidity of a first metal material forming the first wiring is higher than the rigidity of a second metal material forming the second wiring. The other wiring of the first wiring and the second wiring is connected to the surface of the first connection part in the first opening. 110-. (canceled)11: An actuator device comprising:a frame;a support portion formed in a frame shape and located at the inside of the frame;a movable portion located at the inside of the support portion;a first connection portion which connects the movable portion to the support portion so that the movable portion is swingable; anda second connection portion which connects the support portion to the frame so that the support portion is swingable;wherein the first connection portion is formed with a first wiring which includes an impurity layer of a first conductivity type.12: An actuator device according to claim 11 ,wherein the first connection portion includes a region of a second conductivity type.13: An actuator device according to claim 11 ,wherein a second wiring formed of a metal material is provided on the support portion and the second connection portion and the first wiring and the second wiring are electrically connected to each other.14: An actuator device according to claim 13 ,wherein the first wiring includes a first portion located at the support portion and the first wiring is electrically connected to the second wiring at the first ...

Sensor device and method of fabrication

A device includes a substrate, a first electrode formed on the substrate and a structural layer formed on the substrate. The structural layer includes a movable mass and a fixed portion, the movable mass being suspended above the substrate and the first electrode being interposed between the substrate and the movable mass. A second electrode is spaced apart from an upper surface of the movable mass by a gap and an anchor couples the second electrode to the fixed portion of the structural layer. A method entails integrating formation of the second electrode into a wafer process flow in which the first electrode and the structural layer are formed.

Non-linear springs to unify the dynamic motion of individual elements in a micro-mirror array

An array of micro mirrors is used to beam steer a laser for Light Detection and Ranging (LiDAR) applications. The array of micro mirrors are driven in a nonlinear motion to synchronize motion of the micro mirrors in the array.

Multidirectional translating and tilting platform using bending actuators as active entity

A platform includes first and second actuation layers. The first actuation layer includes first and second frames and a plurality of actuators connected between the first frame and the second frame, wherein the plurality of actuators are adapted to move the first and second frames with respect to each other in a first direction. The second actuation layer includes third and fourth frames and a plurality of actuators connected between the third frame and the fourth frame, wherein the plurality of actuators are adapted to move the third frame and the fourth frame with respect to each other in a second direction, different from the first direction. Thereby, the fourth frame of the second actuation layer and the second frame of the first actuation layer are mechanically connected to each other, such that the second actuation layer experiences the movement in the first direction induced by the first actuation layer.

Systems and methods for micro-cantilever actuation by base excitation

A system and methods for base excitation of moderately high vibration of micro-cantilevers are disclosed. A micro-cantilever may be coupled to one or more actuators adjacent its base. The actuators may comprise bulk materials, bridges, or formed wires that expand and contract by application of electric currents, due to, for example, the effect of electro-thermal heating or piezoelectric effects. Single actuators or an array of actuators may be placed around the micro-cantilever to oscillate it and apply actuation pulses. The system and methods, and adjustments of the geometrical parameters, may be performed to yield a nominal natural frequency in the system. The excitation of actuators with signals corresponding to the natural frequency may induce resonance in the system and may result in high amplitude vibrations and displacement of the cantilever tip of the micro-cantilever. Various architectures of the actuators may be implemented to stimulate different frequencies of the beam and induce displacement in different direction and amplitudes.

ACTUATOR, OPTICAL SCANNING DEVICE, AND MANUFACTURING METHODS

An actuator includes a first driving beam that is connected to an object to be driven and includes multiple first beams extending in a direction orthogonal to a first predetermined axis, ends of each adjacent pair of the first beams being connected to each other via one of first turnaround parts such that the first driving beam forms a zig-zag bellows structure as a whole; first driving sources formed on first surfaces of the first beams; and ribs formed on second surfaces of the first beams at positions that are closer to the first predetermined axis than the first turnaround parts. The first driving sources are configured to move the first driving beam and thereby rotate the object around the first predetermined axis. 1. An actuator , comprising:a first driving beam that is connected to an object to be driven and includes multiple first beams extending in a direction orthogonal to a first predetermined axis, ends of each adjacent pair of the first beams being connected to each other via one of first turnaround parts such that the first driving beam forms a zig-zag bellows structure as a whole;first driving sources formed on first surfaces of the first beams; andribs formed on second surfaces of the first beams at positions that are closer to the first predetermined axis than the first turnaround parts,wherein the first driving sources are configured to move the first driving beam and thereby rotate the object around the first predetermined axis.2. The actuator as claimed in claim 1 , wherein each of the ribs has a width in a longitudinal direction of the first beams and a length in a lateral direction of the first beams claim 1 , and the width is shorter than the length.31. The actuator as claimed in claim 1 , wherein each of the first beams has a width W in a direction of the first predetermined axis;{'b': '2', 'each of the ribs has a width W in a direction that is orthogonal to the first predetermined axis; and'}{'b': 2', '1, 'the width W is less than or equal ...

MICROELECTROMECHANICAL DEVICE WITH A STRUCTURE TILTABLE BY PIEZOELECTRIC ACTUATION HAVING IMPROVED MECHANICAL AND ELECTRICAL CHARACTERISTICS

A microelectromechanical device includes a fixed structure defining a cavity with a tiltable structure that is elastically suspended in the cavity. A piezoelectrically driven actuation structure, interposed between the tiltable structure and the fixed structure, is biased for causing rotation of the tiltable structure about a first rotation axis belonging to a horizontal plane in which the tiltable structure rests. The actuation structure includes a pair of driving arms carry respective regions of piezoelectric material and are elastically coupled to the tiltable structure on opposite sides of the first rotation axis through respective elastic decoupling elements. The elastic decoupling elements exhibit stiffness in regard to movements out of the horizontal plane and compliance to torsion about the first rotation axis. 1. A microelectromechanical device , comprising:a fixed structure defining a cavity;a tiltable structure elastically suspended in the cavity and having a main extension in a horizontal plane; anda piezoelectrically driven actuation structure that is biased for causing rotation of the tiltable structure about at least a first rotation axis parallel to a first horizontal axis of said horizontal plane, said actuation structure being interposed between the tiltable structure and the fixed structure;wherein said piezoelectrically driven actuation structure comprises at least a first pair of driving arms including respective regions of piezoelectric material and which are elastically coupled to the tiltable structure on opposite sides of the first rotation axis by respective first decoupling elastic elements, said respective first decoupling elastic elements being stiff in regard to movements out of the horizontal plane and being compliant in regard to torsion about said first rotation axis.2. The device according to claim 1 , wherein said first decoupling elastic elements are coupled to said tiltable structure in the proximity of said first rotation axis.3 ...

Digital mirror device, method of manufacturing digital mirror device, and image display apparatus

A substrate, a plurality of mirrors disposed on one surface of the substrate to be separated from the substrate, a mirror support post disposed between the substrate and the mirror and connected to a part of the mirror to support the mirror, a first electrode disposed between a first portion of the mirror and the substrate on the substrate, a second electrode disposed between the substrate and a second portion facing the first portion are included. The mirror includes a thin portion in which a thickness of at least a part of an end portion of a rear surface of the mirror is thinner than a thickness of a middle of the mirror.

SELF-ALIGNED VERTICAL COMB DRIVE ASSEMBLY

A vertical comb drive assembly may include a rotor assembly. The rotor assembly may include a comb anchor to attach the rotor assembly to a base, a comb rotor attached to the comb anchor, and a movable element attached to the comb rotor. The vertical comb drive assembly may include a stator assembly. The stator assembly may include a plate anchor to attach the stator assembly to the base, a plate, wherein the plate forms a comb stator, and a plate hinge to connect the plate to the plate anchor. The plate hinge and the plate may be configured for moving the plate from a first position where the comb rotor and the comb stator are both in a first plane to a second position where the comb rotor is in the first plane and the comb stator is in a second plane. 1. A vertical comb drive assembly , comprising: a comb anchor to attach the rotor assembly to a base,', 'a comb rotor attached to the comb anchor, and', 'a movable element attached to the comb rotor; and, 'a rotor assembly, comprising a plate anchor to attach the stator assembly to the base,', 'a plate, wherein the plate forms a comb stator formed from the plate, and', 'a plate hinge to connect the plate to the plate anchor, and, 'a stator assembly, comprisingwherein the plate hinge is configured for moving the plate from a first position to a second position,wherein, in the first position, the comb rotor and the comb stator are both in a first plane, and in the second position, the comb rotor is in the first plane and the comb stator is in a second plane that is parallel to the first plane.2. The vertical comb drive assembly of claim 1 , further comprising: the base, wherein the base is a substrate; and', 'a spacer disposed on the substrate., 'a base assembly, comprising3. The vertical comb drive assembly of claim 2 , further comprising:a silicon dioxide layer disposed between the substrate and the spacer.4. The vertical comb drive assembly of claim 1 , wherein the rotor assembly and the stator assembly are formed ...

MEMS DEVICE AND PROCESS

The application describes MEMS transducers having a vent structure provided in a flexible membrane of the vent structure The vent structure comprises at least one moveable portion and the vent structure is configured such that, in response to a differential pressure across the vent structure, the moveable portion is rotatable about first and second axes of rotation, which axes of rotation extend in the plane of the membrane. 1. A MEMS transducer comprising: a flexible membrane , the flexible membrane having a vent structure comprising at least one moveable portion , wherein the moveable portion is connected to the rest of the membrane by a connecting portion having a width , and wherein the moveable portion is asymmetrical about a notional line which extends from the centre of the connecting portion across the moveable portion in a direction that is substantially orthogonal to the width of the connecting portion.2. A MEMS transducer comprising:a flexible membrane, the flexible membrane having a vent structure comprising at least one moveable portion connected to the membrane by a single joint structure, the vent structure being configured such that, in response to a differential pressure across the vent structure, the moveable portion is rotatable about first and second axes of rotation, which axes of rotation extend in the plane of the membrane when the vent structure is at an equilibrium position, wherein the first axis of rotation and the second axis of rotation intersect at the joint structure.3. A MEMS transducer as claimed in claim 2 , wherein the joint structure comprises a connecting portion having a width and wherein the first axis of rotation has a component that is substantially coincident with claim 2 , or parallel to claim 2 , the width of the connecting portion in the plane of the membrane.4. A MEMS transducer as claimed in claim 2 , wherein the second axis of rotation has a component that is substantially perpendicular to the first axis of rotation.5. ...

Mems vibrator, electronic apparatus, and moving object

A MEMS vibrator includes: a vibrating portion; an electrode portion provided to face the vibrating portion with a gap therebetween; and a support portion extended in a first direction from the vibrating portion. The vibrating portion includes a functional portion having a different thickness viewed from the first direction.

Three-axis monolithic mems accelerometers and methods for fabricating same

Three-axis monolithic microelectromechanical system (MEMS) accelerometers and methods for fabricating integrated capacitive and piezo accelerometers are provided. In an embodiment, a three-axis MEMS accelerometer includes a first sensing structure for sensing acceleration in a first direction. Further, the three-axis MEMS accelerometer includes a second sensing structure for sensing acceleration in a second direction perpendicular to the first direction. Also, the three-axis MEMS accelerometer includes a third sensing structure for sensing acceleration in a third direction perpendicular to the first direction and perpendicular to the second direction. At least one sensing structure is a capacitive structure and at least one sensing structure is a piezo structure.

MEMS DEVICE WITH OPTIMIZED GEOMETRY FOR REDUCING THE OFFSET DUE TO THE RADIOMETRIC EFFECT

A MEMS device with teeter-totter structure includes a mobile mass having an area in a plane and a thickness in a direction perpendicular to the plane. The mobile mass is tiltable about a rotation axis extending parallel to the plane and formed by a first and by a second half-masses arranged on opposite sides of the rotation axis. The first and the second masses have a first and a second centroid, respectively, arranged at a first and a second distance b1, b2, respectively, from the rotation axis. First through openings are formed in the first half-mass and, together with the first half-mass, have a first total perimeter p1 in the plane. Second through openings are formed in the second half-mass and, together with the second half-mass, have a second total perimeter p2 in the plane, where the first and the second perimeters p1, p2 satisfy the equation: p1×b1=p2×b2. 1. A MEMS device , comprising:a mobile mass having an area in a plane and a thickness in a direction perpendicular to the plane, the mobile mass being tiltable about a rotation axis extending parallel to the plane and thereby forming a first mass portion and a second mass portion arranged on opposite sides of the rotation axis, the first and the second mass portions having a first centroid and a second centroid, respectively, the first and second centroids being arranged at first and second distances b1, b2, respectively, from the rotation axis;a plurality of first through openings in the first mass portion, wherein the plurality of first through openings and the first mass portion have a first total perimeter p1 in the plane; anda plurality of second through openings in the second mass portion, wherein the plurality of second through openings and the second mass portion have a second total perimeter p2 in the plane, {'br': None, 'i': p', 'b', 'p', 'b, '1×1=2×2.'}, 'wherein the first and the second total perimeters p1, p2 satisfy equation2. The MEMS device according to claim 1 , wherein the MEMS device is ...

Microelectromechanical structure with frames

A robust microelectromechanical structure that is less prone to internal or external electrical disturbances. The structure includes a mobile element with a rotor suspended to a support, a first frame anchored to the support and circumscribing the mobile element, and a second frame anchored to the support and circumscribing the mobile element between the mobile element and the first frame, electrically isolated from the first frame. The rotor and the second frame are galvanically coupled to have a same electric potential.

Mechanical connection forming a pivot for mems and nems mechanical structures

A mechanical connection between two parts of a microelectromechanical and/or nanoelectromechanical structure forming a pivot with an axis of rotation pivot includes two first beams with an axis parallel to the pivot axis, the first beams configured to work in torsion, and two second beams with an axis orthogonal to the axis of the first beams, the second beams configured to work in bending, each one of the first and second beams being connected at their ends to the two parts of the structure.

FORMING AN OFFSET IN AN INTERDIGITATED CAPACITOR OF A MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICE

A method for forming a MEMS device may include performing a silicon-on-nothing process to form a cavity in a monocrystalline silicon substrate at a first depth relative to a top surface of the monocrystalline silicon substrate; forming, in an electrically conductive electrode region of the monocrystalline silicon substrate, an electrically insulated region extending to a second depth that is less than the first depth relative to the top surface of the monocrystalline silicon substrate; and etching the monocrystalline silicon substrate to expose a gap between a first electrode and a second electrode, wherein the second electrode is separated from the first electrode, within a first depth region, by a first distance defined by the electrically insulated region and the gap, and wherein the second electrode is separated from the first electrode, within a second depth region, by a second distance defined by the gap. 120-. (canceled)21. A microelectromechanical systems (MEMS) device , comprising: 'wherein the first electrode and the second electrode are part of an interdigitated electrode structure and are, within a first depth region, separated from each other by a first lateral distance and, within a second depth region, separated from each other by a second lateral distance.', 'a non-silicon-on-insulator (SOI) monocrystalline semiconductor substrate comprising a MEMS structure that includes a first electrode and a second electrode arranged to be movable relative to each other and separated by a gap,'}22. The MEMS device of claim 21 , wherein the first depth region is located closer to a top surface of the non-SOI monocrystalline semiconductor substrate than the second depth region.23. The MEMS device of claim 21 , wherein the first lateral distance is different than the second lateral distance.24. The MEMS device of claim 21 , wherein the first lateral distance includes a first length of the gap and a second length of an electrically insulated region formed between the ...