Средство для химической очистки металлических поверхностей

Изобретение относится к химическим средствам и может быть использовано для обработки воды оборотных систем охлаждения технологического, теплоэнергетического и теплообменного оборудования. Конкретно, для эксплуатационной очистки и защиты от накипно-коррозионных отложений (НКО) различных металлических теплопередающих поверхностей из черных и цветных металлов, используемого в металлургической промышленности технологического, теплоэнергетического и теплообменного оборудования. Описано средство для химической очистки металлических поверхностей, содержащее комплексон и цинковый комплекс, дополнительно содержит дисперсант, калия гидроокись, натрия гидроокись, 1,2,3-Бензотриазол и ингибитор, причем в качестве цинкового комплекса оно содержит оксид цинка, в качестве дисперсанта оно содержит сополимер акриловой кислоты /2-акриламидо-2-метил-1-пропансульфоновой кислоты, в качестве ингибитора оно содержит ингибитор «PuroTech 43», а в качестве воды - воду деминерализованную, при этом компоненты используют ...

WASCHMITTELBLOCK ENTHALTEND NITRILOTRIESSIGSÄURE

Viskoelastische Reinigungsmittel und deren Anwendung.

Verfahren zur Reinigung von Reaktoren

Verfahren zur Behandlung von Geweben durch Wärmeerzeugung

GESCHIRRSPUELMITTEL

The cleaning composition for dishwashing contains sodium and/or potassium hydroxide as alkali metal hydroxide, a phosphate, a silicate, a compound which releases chlorine, and an agent to prevent discoloration. The latter agent is chosen from the group comprising sodium gluconate, sodium glucoheptonate and the sodium salt of ethylenediaminetetraacetic acid. It is employed in amounts of 0.5 to 10% by weight based on the dry cleaning composition. The composition is produced by dry-mixing the individual components.

Compsn. for clearing pipes blocked with hairy material - contg. alkali, alkaline metal nitrate, light metal and glycouril or its derivatives

A prod. for cleaning blocked pipes, partic. for removing hair and similar material, based on a solid mixt. of an alkali metal hydroxide, light metal shavings and an alkali or alkaline earth metal nitrate also contains 0.5 to 5% of glycoluril or its derivs. The pref. compsns. contain 50-80% NaOH, 4-10% Al tumings, 15-40% NaNO3, and 0.5-5% of glycoluril or its derivs. Specified glycoluril derivs. are tetra-acetyl, 1,4-diacetyl, tetrapropionyl, 1,4-dipropionyl, dichloro and tetrachloro-glycoluril.

Lösungen zur Oberflächenbehandlung von Halbleitern

Alkalisches Flaschenreinigungsmittel

Verfahren zum Waschen und Reinigen mittels Aluminiumhydroxyd

SÄUREREINIGUNGSVERFAHREN FÜR GESCHIRRSPÜLEN IN DER MASCHINE

GELIERENDE ZUSAMMENSETZUNGEN ZUM ABZIEHEN UND REINIGEN.

Lackabbeizmittel

Machine washing of crockery carrying food residues

Machine cleaning of crockery, esp. crockery soiled with food residues, involves: (a) an opt. pre-wash, (b) spraying with a highly concd. cleaning soln. contg. 2-6% of a liq. cleaner, free from complex-formers, with alkali content at least 25% and not above 6% of a salt of a modified 1-20C carboxylic acid, where the soln. swells the food residues, (c) washing with a liquor contg. 0.02-0.08% of an alkali-free additive with at least 20% of a complex-former, which rinses off the swollen food residues and (d) rinsing off remaining food residues in a clear washing zone and opt. in a later rinsing zone.

NICHTÄTZENDE WASCHLÖSUNG FÜR FLASCHEN

Verfahren zur Reparatur einer Lotverbindung zwischen zwei Komponenten eines Artikels; reparierter Artikel

WC-ABFLUSSREINIGER

Improvements in or relating to the Cleansing of Water Supply Pipes.

... 15,781. Walker, A. S. July 1. Drawings to Specification. Incrustation, removing.-A cleansing solution for lead water-supply pipes is made by dissolving in hot water a mixture of caustic soda, pearl ash, and borax.

A detergent tablet

Detergent tablets comprise (a) an anionic and/or nonionic synthetic detergent, (b) a phosphate as defined below, (c) 0.48-2.6% (expressed as Na2O based on total weight of tablet) of an alkali material which is a source of Na2O or K2O, and (d) water in amount to effect a concentration of alkali material in water of at least 23.5% expressed as NaOH. Suitable detergents are condensates of ethylene oxide or propylene oxide with a fatty alcohol, an alkylated phenol, a fatty amine, a fatty amide, tall oil, or a propylene oxide/propylene glycol condensate; fatty acid diethanolamides; and anionics such as alkaryl sulphonates, alkyl sulphates, acyl isethionates, acyl taurates, sulphated fatty alcohol/ethylene oxide condensates, alkyl taurines, hydroxyalkyl taurines, and compounds of the type RCH(CH3)NHCO(CH2)nSO3M The phosphate is defined as penta-Na or K-tripolyphosphate or a mixture thereof with each other or with up to stated amounts of trisodium orthophosphate, tetra-Na or K-pyrophosphate, or ...

Dishwashing Composition

... 1,178,197. Dishwashing composition. W. R. GRACE & CO. 14 Oct., 1968 [6 Nov., 1967], No. 48674/68. Heading C5D. A composition for use, in diluted form in dishwashing, comprises:-(a) from 10-50 parts by weight of an alkali metal hydroxide, (b) from 5-30 parts by weight of an alkali metal pyrophosphate; (c) from 5-30 parts by weight of an alkali metal nitrilotriacetate, and (d) from 0À1-2 parts by weight of a water-soluble nitrite. The alkali metal hydroxide may be NaOH, KOH or a mixture thereof. The alkali metal pyrophosphate may be a sodium or potassium pyrophosphate, tetrapotassium pyrophosphate being preferred. The alkali metal nitrilo-triacetates are preferably of Na or K. Any watersoluble nitrite salt may be used as component (d) such as an alkali metal (e.g. Na, K, Li) nitrite, an alkaline earth metal (e.g. Ca, Mg) nitrite or ammonium nitrite. In a modification, milder alkaline materials such as sodium or potassium carbonate, or sodium or potassium orthophosphate may be substituted ...

Particulate built nonionic detergent composition

A particulate built nonionic synthetic organic detergent composition includes a detersive proportion of a nonionic synthetic organic detergent and a building proportion, in combination, of a polyacetal carboxylate builder for the nonionic detergent and a polyphosphate builder for such nonionic detergent. Such compositions are readily made by adding polyacetal carboxylate builder to the formula of a control detergent composition, with corresponding diminutions of other component(s), and have detersive powers superior to such control despite the decrease in detergent and other builders. Preferably, certain nonionic detergents, polyacetal carboxylate builders and polyphosphate, in certain proportions, are employed for better detergency and physical characteristics, e.g., flowability. Process for manufacturing the described detergent compositions are disclosed, in which processes spray dried builder base beads, containing polyphosphate builder salt, have nonionic detergent and polyacetal carboxylate ...

Improvements relating to cleansing preparations, particularly applicable for cleaning the inside of enamelled ovens

... 305,273. Quance, E. N., and Burchell, L. C. June 29, 1928. Cleansing-compositions, especially useful for cleaning the inside of enamelled ovens, consist of dispersions of commercial caustic soda and very fine iron oxide in a liquid or pasty medium. In an example, 2 oz. of a mixture of 4 parts of caustic soda with 1 part of oxide is dispersed in 24 oz. of water.

An improved powder for cleaning silver, plate and brass

... 296,875. Rawlinson, G. Aug. 11, 1927. Metal polishes especially suitable for silver and brassware consist of about 4 1b. of precipitated chalk, 2 fl. oz. of fluid ammonia, and ¢ oz. of Reckitt's blue powder. According to the Provisional Specification chalk and ball blue alone are mixed.

Particulate built nonionic detergent composition

A particulate built nonionic synthetic organic detergent composition includes a detersive proportion of a nonionic synthetic organic detergent and a building proportion, in combination, of a polyacetal carboxylate builder for the nonionic detergent and a polyphosphate builder for such nonionic detergent. Such compositions are readily made by adding polyacetal carboxylate builder to the formula of a control detergent composition, with corresponding diminutions of other component(s), and have detersive powers superior to such control despite the decrease in detergent and other builders. Preferably, certain nonionic detergents, polyacetal carboxylate builders and polyphosphate, in certain proportions, are employed for better detergency and physical characteristics, e.g., flowability. Process for manufacturing the described detergent compositions are disclosed, in which processes spray dried builder base beads, containing polyphosphate builder salt, have nonionic detergent and polyacetal carboxylate ...

METHOD OF MANUFACTURE OF SEWER AND DRAIN CLEANER COMPOSITIONS

... 1338171 Pelleted sewer cleaning composition CONSOLIDATED FOODS CORP 6 April 1971 10636/71 Heading C5D [Also in Division B5] A pelleted sewer and drain cleaner composition from which heat is liberated when added to water, is prepared by (A) intimately admixing 45-65% wt. of sodium hydroxide or potassium hydroxide, 4-10% wt. of finely divided particulate aluminium or a mixture of aluminium and zinc, 20-40% wt. of a particulate water-soluble inorganic nitrate (e.g. sodium nitrate) and 5- 20% wt. of sodium chloride, sodium carbonate or sodium silicate, (B) tackifying the intimately admixed composition by spraying a portion of a total amount of water of about 4À0 to 5À1% wt. of the intimately admixed composition at 100- 160‹ F. on to the composition to effect partial agglomeration thereof, (C) agglomerating said partially agglomerated composition by spraying the composition with additional water consisting of the remainder of the 4À0-5À1% wt. of water at 100-160‹ F. to form homogeneous pellets ...

Process for cleaning rigid articles

The invention comprises a process for cleaning articles made from rigid material with the aid of a chlorinated hydrocarbon wherein the articles are treated with a mixture which contains water, ammonia or a substance that yields ammonia and oleic acid in addition to the chlorinated hydrocarbon. The articles may be pretreated with a chlorinated hydrocarbon alone to remove fatty contaminants and any residual cleaning mixture that adheres to the surface of the articles may be removed by one or more after-treatments with a chlorinated hydrocarbon in either the liquid state or the vapour state.ALSO:A process for cleaning metal articles with the aid of a chlorinated hydrocarbon, comprises treating the article with a mixture which contains water, ammonia or a substance that yields ammonia, and oleio acid in addition to the chlorinated hydrocarbon. The articles may be pretreated with a chlorinated hydrocarbon alone to remove fatty contaminants and any residual cleaning mixture may be removed by ...

Improvements relating to methods of Cleaning Corroded Copper Surfaces

... 1,172,316. Cleaning metals. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. March 7, 1967 [March 10, 1966], No. 10590/67. Heading C7E. Copper or copper alloys are cleaned with an aqueous solution (pH at least 8) containing (% by weight) 5 to 15 of ammonium carbonate, 5 to 25 of ammonia and at least 0À1 of hydrogen peroxide. The copper may be subsequently washed, dried at 70‹C., and then heated at 120‹C. The ammonium carbonate may be formed by adding the acid carbonate to the solution.

Composition

Improvements in or relating to washing bottles and compositions therefor

A bottle washing composition comprises (a) an alkali metal hydroxide (b) a boroheptonic complex. The composition may be in the form of a solution containing from 1/2 to 2 1/2 % by weight of caustic soda, or may be a solid composition comprising 80 to 95 parts by weight of flake caustic soda and 20 to 5 parts by weight of sodium boroheptonate.ALSO:A boroheptonic complex believed to have the formula is prepared by reacting boric acid or a borate with heptonic acid or its salts.

COMPOSITION USED TO REMOVE LABELS

COMPOSITION USED TO REMOVE LABELS

COMPOSITION USED TO REMOVE LABELS

ACID CLEANING METHOD FOR GESCHIRRSPÜLEN IN THE MACHINE

PROCEDURE FOR THE FABRIC TREATMENT

ABFLUSSREINIGER MIT HAARZERKLEINERNDER WIRKUNG

PROCEDURE FOR THE PROCESSING OF MEDICAL AND/OR SURGICAL INSTRUMENTS AND APPARATUSES

CLEANING SOLUTION AND CLEANING METHOD FOR ELECTRICAL CONDUCTOR

DISCHARGE CLEANER WITH HAIR-CUTTING UP EFFECT

DISCHARGE CLEANER WITH HAIR-CUTTING UP EFFECT

Cleaner and disinfectant

A cleaner and disinfectant in which water-soluble permanganates are used to initiate the oxidation of organic substances in alkaline solution and, at the same time there is use of a chemical oxidant, preferably a peroxodisulphate, which is suitable for bringing about, with catalytic assistance by the manganates produced from the added permanganate, free-radical reactions which effect the oxidation of organic substances. All the ingredients are in powder form, it being possible to dissolve a corresponding powder mixture rapidly and residue-free in water. It thus represents a highly efficient cleaner and disinfectant which can be employed universally.

PROCEDURE FOR THE TREATMENT OF CELLULOSEHÄLTIGEM TEXTILE

GELLING COMPOSITIONS FOR TAKING OFF AND CLEANING.

CLEANING AGENT IN THE FORM OF PASTE

PROCEDURE FOR WASHING LACQUER-GOTTEN DIRTY PIECES OF LAUNDRY

NOT CORROSIVE CLEANING AGENT FOR GLASFLASCHEN

Alkaline cleaning agent

An anionic stabilized enzyme-based clean-in-place system

COMPOSITION

Adhesive acrylate-olefin copolymers, methods for producing same and compositions utilizing same

The present invention relates to an adhesive compositions, facestocks and/or packaging labels containing same, where such compositions, facestocks and/or labels are designed to facilitate the recyclability of a plastic article formed from any suitable polymer or mixture of polymers (e.g., a polyethylene terephthalate (PET), high density polyethylene (HDPE), polyvinyl chloride (PVC), low density polyethylene (LDPE), polypropylene (PP), polystyrene (PS), or others of all plastic types), or even glass bottles. In another embodiment, the present invention relates to a method for removing an adhesive composition, facestock and/or packaging label containing same, from a plastic article that is to be recycled.

AMONICAL GEL CLEANING COMPOSITION

Concentrated warewashing compositions and methods

The invention generally relates to concentrated warewashing compositions and methods of using the same. In some aspects, the invention uses concentrated compositions in methods of warewashing where the concentrate is applied directly to the article to be cleaned, rather than dispensed into a sump and applied to the article as a ready-to-use composition. In additional aspects, the methods of using highly concentrated alkaline and/or acid compositions in an alternating pattern of alkaline-acid-alkaline or acid-alkaline-acid, or the like, provide substantially similar or superior cleaning efficacy while reducing the overall consumption of the alkaline and/or acid compositions.

Method of cleaning residual pesticide from an agricultural vessel

The present invention generally relates to methods of cleaning residual pesticide from an agricultural vessel, and to kits and compositions useful for the practice of such methods. Briefly, therefore, the present invention is directed to methods of preparing a tank for use in connection with a second pesticide following use of the tank in connection with a first pesticide. In various embodiments, the first pesticide is an herbicide. The first and second pesticides may be the same pesticide (e.g., dicamba). In various embodiments, the method comprises introducing a cleaning mixture into a tank containing a residual amount of a first pesticide; the cleaning mixture comprises (a) a source of transition metal ions, and (b) a source of hydrogen peroxide. Optionally, the cleaning solution may further comprise water.

A method of treating fabric

Sodium tripolyphosphate composition and method of producing it

Method of cleaning floors

Composition and improved pH driven method for wastewater separation using an amphoteric carboxylate and a cationic destabilizer composition

Anti-etch and cleaning composition for glass bottles

Anti-etch bottle washing solution

NONIONIC DETERGENT COMPOSITION

PHOTORESIST STRIPPER COMPOSITION

REMOVAL OF HEAVY ROAD FILM FROM PAINTED VEHICLES

CAKE-LIKE DETERGENT AND METHOD OF MANUFACTURE

CLEANING AND DISINFECTING AGENT

The invention relates to a cleaning and disinfecting agent in which water- soluble permanganates are used for initiating the oxidation of organic substances in an alkaline solution and, at the same time, a chemical oxidant, preferably a peroxodisulfate, is used that is suited for inducing radical reactions during the catalytic support provided by manganates arising from the supplied permanganate, said radical reactions effecting the oxidation of organic substances. All constituents exist in powder form, whereby a corresponding powder mixture can be rapidly dissolved in water and without leaving residues. This agent thus depicts a highly effective cleaning and disinfecting agent that has universal applications.

STABILIZED CONCENTRATED CLEANING SOLUTIONS AND METHODS OF PREPARING THE SAME

The invention is directed to stabilized concentrated cleaning solutions comprising a source of hypochlorite ions and to a method for providing the stabilized concentrated cleaning solutions. The stabilized concentrated cleaning solutions according to the invention comprise a hydroxide ion source, hypochlorite ion source, and a chelating agent, and are provided simply by mixing the various components together. The stabilized concentrated cleaning solutions exhibit stability against, e.g., dilution with a diluent comprising amounts of copper, iron, nickel cobalt, etc., as well as storage for periods of from about 10 weeks to up to about 1 year without undergoing visible deterioration and/or a substantial deterioration in efficacy.

DETERGENT COMPOSITION AND ITS USE IN A DISHWASHING MACHINE

The invention disclosed provides a new improved detergent composition and a method of using same. The detergent is formulated as a slurry. It contains an alkaline builder, e.g. an alkali metal hydroxide and/or silicate, a water-soluble polyelectrolyte polymer, e.g. sodium polyacrylate, and a water conditioner, e.g. sodium tripolyphosphate. This slurry composition is found to have significant advantages over both liquid detergents and powder detergents in dispensing as well as in use.

SCALE INHIBITORS

The invention provides a composition comprising (a) diethylenetriaminopenta(methylenephosphonic acid) or an alkali metal salt thereof and (b) aminotri(methylenephosphonic acid) or an alkali metal salt thereof wherein the amount of (b) is from 5 to 70 percent of the total weight of (a) and (b). The compositions are useful for the stabilization against precipitation and scaling of alkaline solutions containing potentially scale-forming components.

PARTICULATE BUILT NONIONIC DETERGENT COMPOSITION

A particulate built nonionic synthetic organic detergent composition includes a detersive proportion of a nonionic synthetic organic detergent and a building proportion, in combination, of a polyacetal carboxylate builder for the nonionic detergent and a polyphosphate builder for such nonionic detergent. Such compositions are readily made by adding polyacetal carboxylate builder to the formula of a control detergent composition, with corresponding diminutions of other component(s), and have detersive powers superior to such control despite the decrease in detergent and other builders. Preferably, certain nonionic detergents, polyacetal carboxylate builders and polyphosphate, in certain proportions, are employed for better detergency and physical characteristics, e.g. flowability. Also disclosed are processes for manufacturing the described detergent compositions, in which processes spray dried builder base beads, containing polyphosphate builder salt, have nonionic detergent and polyacetal ...

CLEANING COMPOSITIONS FOR EXTERIOR SURFACES OF ROAD VEHICLES

ALKALI GEL COMPOSITIONS FOR CLEANING GREASY SURFACES

HEAT-DEPENDENT ALKALI GEL CLEANING COMPOSITIONS AND PROCESS FOR CLEANING GREASY SURFACES Alkaline cleaning compositions are prepared by combining water, alkali metal hydroxide and certain surfactants which composition forms a gel when applied to a hot surface and a process for the easy removal of greasy soil from such surfaces.

CLEANING COMPOSITIONS FOR EXTERIOR SURFACES OF ROAD VEHICLES

ACIDIC CLEANING METHOD FOR MACHINE DISHWASHING

The process of continuous machine dishwashing, which can be carried out in single-tank or multi-tank machines, is improved by the machine-operated process disclosed. This is achieved, in particular, by treatment of the tableware at least in one process step with an acidic cleaning solution and in another process step with an alkaline cleaning solution, comprising the steps of: a) applying an acidic aqueous cleaning solution to the at least partly soiled tableware and b) removing the acidic aqueous solution and the soil in one or more following steps, the at least one alkaline treatment taking place before and/or after the acidic treatment and the alkaline and at least acidic aqueous cleaning solution at least partially neutralizing one another.

MICROELECTRONIC CLEANING COMPOSITIONS CONTAINING OXIDIZERS AND ORGANIC SOLVENTS

Cleaning compositions suitable for cleaning microelectronic structures having silicon dioxide, low-k or high-k dielectrics and copper or aluminum metallizations contain an oxidizing agent and a polar organic solvent selected from amides, sulfones, sulfolenes, selenones and saturated alcohols, and optionally other components.

DETERGENT COMPOSITION AND ITS USE IN A DISHWASHING MACHINE

ALKALINE, POST PLASMA ETCH/ASH RESIDUE REMOVERS AND PHOTORESIST STRIPPING COMPOSITIONS CONTAINING METAL-HALIDE CORROSION INHIBITORS

The invention provides alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions contain (a) one or more bases and (b) one or more metal corrosion inhibiting metal halides of the formula: WzMXy where M is a metal selected from the group Si, Ge, Sn, Pt, P, B, Au, Ir, Os, Cr, Ti, Zr, Rh, Ru, and Sb; X is a halide selected from F, CI, Br and I; W is selected from H, to an alkali or alkaline earth metal, and a metal ion-free hydroxide base moiety; y is a numeral of from 4 to 6 depending on the metal halide; and z is a numeral of 1, 2 or 3.

ALKALINE, POST PLASMA ETCH/ASH RESIDUE REMOVERS AND PHOTORESIST STRIPPING COMPOSITIONS CONTAINING METAL-HALIDE CORROSION INHIBITORS

The invention provides alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions contain (a) one or more bases and (b) one or more metal corrosion inhibiting metal halides of the formula: WzMXy where M is a metal selected from the group Si, Ge, Sn, Pt, P, B, Au, Ir, Os, Cr, Ti, Zr, Rh, Ru, and Sb; X is a halide selected from F, CI, Br and I; W is selected from H, to an alkali or alkaline earth metal, and a metal ion-free hydroxide base moiety; y is a numeral of from 4 to 6 depending on the metal halide; and z is a numeral of 1, 2 or 3.

STABILIZED, NON-AQUEOUS CLEANING COMPOSITIONS FOR MICROELECTRONICS SUBSTRATES

Non-aqueous stripping and cleaning compositions for cleaning microelectronics devices, the composition having a least one organic sulfur-containing polar compound as a stripping solvent, at least one water-free source of a strong hydroxide base, and at least one hydroxypyridine stabilizing agent to inhibit detrimental side reactions.

CLEANING COMPOSITION

Provided herein is a composition that includes: (i) chelator (e.g., ethylenediaminetetraacetic acid (EDTA)), (ii) buffer system (e.g., potassium phosphate dibasic and sodium hydroxide), (iii) cleaner (e.g., diethyl glycol monoethyl ether), (iv) solubilizer (e.g., propylene glycol), and (v) diluent (e.g., water), wherein the composition has a pH of at least about 9.5. Also provided is a method of cleaning a medical device that includes contacting the medical device with the composition described herein, for a period of time effective to clean the medical device. Subsequent to the cleaning, the medical device can optionally be disinfected, dried, and stored.

SYNERGISTIC STAIN REMOVAL THROUGH NOVEL CHELATOR COMBINATION

The invention relates to a concentrated detergent composition comprising an alkali metal hydroxide, methylglycinediacetic acid, glutamic acid ?,?-diacetic acid, and alkali metal tripolyphosphate. The composition is particularly suited to remove tea and coffee soil in warewashing applications.

ADHESIVE ACRYLATE-OLEFIN COPOLYMERS, METHODS FOR PRODUCING SAME AND COMPOSITIONS UTILIZING SAME

The present invention relates to an adhesive compositions, facestocks and/or packaging labels containing same, where such compositions, facestocks and/or labels are designed to facilitate the recyclability of a plastic article formed from any suitable polymer or mixture of polymers (e.g., a polyethylene terephthalate (PET), high density polyethylene (HDPE), polyvinyl chloride (PVC), low density polyethylene (LDPE), polypropylene (PP), polystyrene (PS), or others of all plastic types), or even glass bottles. In another embodiment, the present invention relates to a method for removing an adhesive composition, facestock and/or packaging label containing same, from a plastic article that is to be recycled.

DEPOSIT CLEANING COMPOSITION FOR INTERNAL COMBUSTION ENGINES

It has been found that a composition comprising an alkoxy alcohol, an aliphatic alcohol, a liquid petroleum distillate, a liquid fatty acid, a volatile nitrogen base, polyisobutenyl aminoethylethanolamine, and water may be used as an engine deposit cleaner which removes air and fuel induction system deposits, valve deposits, and combustion chamber deposits. The inventive composition may be introduced into the engine in lieu of fuel, or in conjunction with fuel while the engine is operating.

PROCESS FOR DE-INKING PAPER AND FABRIC CLEANING

A process for the preparation and use of a cleaning solution with both foaming and non foaming properties which can be used to de-ink paper or clean surfaces which have been soiled either by the pulping of virgin or secondary recycled fiber or natural usage.

DETERGENT RESIN COMPOSITION

A detergent resin composition capable of very effectively deterging the inside of molding machines in a small quantity of its use and in a short time at the time of change-over of chlorine-containing resins inside the machines is provided, which composition is obtained by blending 50 to 95% by weight of a polystyrene resin, 0 1 to 15.degree.% by weight of a polymethyl methacrylate, 2 to 30% by weight of a neutral salt of a sulfonic acid and 0.1 to 10% by weight of basic magnesium carbonate, magnesium hydroxide, aluminum hydroxide, zinc carbonate or a mixture thereof, the respective proportions being based upon the weight of the composition.

Tableted Detergent, Method of Manufacture and Use

AUTOMATIC DISHWASHING DETERGENT COMPOSITION BASED ON SODIUM POTASSIUM TRIPOLYPHOSPHATE

A stable homogeneous liquid detergent composition based on sodium potassium tripolyphosphate, which is either formed in situ or preneutralized, and ortho- or pyrophosphates is described. The composition contains sodium and potassium ions in a K+/Na+ weight ratio of about 0.5 to less than about 1.5, and is substantially free of alkali silicate.

PROCESS FOR FORMING TABLETED HIGH-CAUSTIC DETERGENT

Tableted detergents are formed from a hydrated phosphate sequestrant, causti c, free water and, optionally, fillers by combining the products and tableting the components without permitting the tablets or detergent to exceed 50 .degree.C. In a preferred embodiment where fillers are incorporated, all free water is combined with the phosphate sequestrants , both anhydrous and hydrated. After the water has been absorbed by the sequestrants, the filler and caustic can be added and the detergent tableted. The free water is bound sufficiently tightly to the phosphate sequestrant that it does not rapidly react with the anhydrous caustic, maintaining the temperature at less than 50 .degree.C, which in turn prevents the water of hydration in the phosphates from reacting and thereby weakening the formed tablets. The tablets can also be formed by combining the filler with the phosphate sequestrants and water and subsequently adding caustic if the detergent is cooled and its temperature maintained ...

PROCESS FOR LAUNDERING PAINT SOILED GARMENTS

A process for laundering garments soiled with a one component paint, a two component paint, a waterborne paint, a powder coat paint or a mixture thereof comprising the steps of exposing the soiled garment to an acid ester; subsequently washing the garment by exposing the garment to at least one detergent and to at least one alkali to remove paint solids adhered to the garment in the presence of a coating solvent to prevent the redeposition of the paint solids removed from the garment by the detergent and the alkali and, subsequently drying the garment.

pH Adjusted Nonionic Surfactant-Containing Alkaline Cleaner Composition for Cleaning Microelectronics Substrates

Mittel zur Trockenreinigung von Wänden, Decken usw., sowie Verfahren zur Herstellung desselben.

Putzmittel.

Fleckenwasser und Verfahren zu seiner Herstellung.

Verfahren zur Herstellung eines Metallputzmittels.

Alkalische Reinigungsflüssigkeit für Metalle.

Verfahren zur Herstellung eines Reinigungsmittels für Natur- und Kunststeine.

Keine Färbung hervorrufendes Reinigungsmittel

Verfahren zur Herstellung eines Putzmittels.

Verfahren zur Herstellung eines Metallputzmittels.

Préparation de dégraissage et d'entretien

Verfahren zur Entfernung von Energie aus mit ionisierenden Strahlen behandeltem cellulosehaltigem Textilgut

Verfahren zur Reinigung, insbesondere zur Entzunderung, von Metalloberflächen in Alkalihydroxyd und Nitrat enthaltenden Salzschmelzen

Detergent for use in appliances

Disclosed are liquid alkaline detergent preparations that are to be dispensed automatically when washing dishes in a dishwasher, comprising: a) 15 to 60 percent by weight of builder; b) 30 to 80 percent by weight of water; and c) less than 5 percent by weight of surfactant. Because of their thermal stability, the detergent preparations are particularly suitable for carrying out automatic dispensing processes when washing dishes in a dishwasher and washing fabrics in a washing machine. Furthermore, the detergent preparations are characterized by significantly improved cleaning power compared with conventional methods.

Degreasing composition and production method thereof

As a method for producing a degreasing composition in the form of a slurry, crystallization of the composition during low-temperature storage being suppressed and the composition being used for preparing a cleaning liquid having little environmental impact, provided is a method including a step of obtaining a slurry by mixing a first liquid and a powdery silicate having a particle diameter ranging from 0.2 mm to 10 mm, wherein the first liquid contains an alkaline component composed of at least one of sodium hydroxide and potassium hydroxide, an alcohol having three or fewer carbon atoms, and water; and the degreasing composition contains, with respect to the total composition, 10 mass % to 60 mass % of the alkaline component, 0.1 mass % to 5 mass % of the alcohol, 1 mass % to 50 mass % of the silicate, and 20 mass % to 50 mass % of water including hydration water of the silicate, and contains no chelating agent.

Pretreatment process for aluminum and high etch cleaner used therein

A high etch cleaner for aluminum and aluminum alloy substrates that leads to enhanced corrosion protective performance of a variety of anti-corrosion pretreatments. The cleaner comprises low levels of silicate of from 0 to 250 ppm, 50 to 500 ppm of at least one chelator, and has a pH of from 11.0 to 13.5. The cleaner may be used to etch from 0.5 to 4.0 grams per meter squared from substrates. Substrates treated with the cleaner and then coated with a variety of anti-corrosion pretreatments and outer coatings show enhanced corrosion resistance compared to substrates cleaned with standard cleaners that have low etch rates, high silicate levels and no chelating agents followed by anti-corrosion pretreatments and outer coatings.

Photoresist removal

Disclosed herein is a composition and method for semiconductor processing. In one embodiment, a wet-cleaning composition for removal of photoresist is provided. The composition comprises a strong base; an oxidant; and a polar solvent. In another embodiment, a method for removing photoresist is provided. The method comprises the steps of applying a wet-cleaning composition comprising about 0.1 to about 30 weight percent strong base; about one to about 30 weight percent oxidant; about 20 to about 95 weight percent polar solvent; and removing the photoresist.

Liquid composition for cleaning semiconductor substrate and method of cleaning semiconductor substrate using the same

[Problems] An object of the present invention is to provide a cleaning liquid composition which removes residual liquid and contaminants after chemical-mechanical polishing (CMP) of the surface of a semiconductor substrate in the production process of a semiconductor circuit device; and a cleaning method using the cleaning liquid composition. [Means for Solution] The cleaning liquid composition according to the present invention comprises a quaternary ammonium hydroxide, 1-ethinyl-1-cyclohexanol, a complexing agent, diethylenetriamine pentamethylene phosphonate and water and has a pH of 9 to 13. By cleaning a wiring material with the cleaning liquid composition according to the present invention, the wiring material can be protected against contamination, corrosion, oxidation and generation of foreign substance that are originated from the production process of a semiconductor circuit device or the environment, so that a clean wiring surface can be obtained.

Cleaning Formulations and Method of Using the Cleaning Formulations

A water-rich hydroxylamine formulation for photoresist and post-etch/post-ash residue removal in applications wherein a semiconductor substrate comprises aluminum. The cleaning composition comprises from about 2 to about 15% by wt. of hydroxylamine; from about 50 to about 80% by wt. of water; from about 0.01 to about 5.0% by wt. of a corrosion inhibitor; from about 5 to about 45% by wt. of a component selected from the group consisting of: an alkanolamine having a pKa<9.0, a water-miscible solvent, and a mixture thereof. Employment of such composition exhibits efficient cleaning capability for Al substrates, minimal silicon etch while protecting aluminum for substrates comprising both materials.

COMPOSITION AND PROCESS FOR POST-ETCH REMOVAL OF PHOTORESIST AND/OR SACRIFICIAL ANTI-REFLECTIVE MATERIAL DEPOSITED ON A SUBSTRATE

A composition and process for removing photoresist and/or sacrificial anti-reflective coating (SARC) materials from a substrate having such material(s) thereon. The composition includes a base component, such as a quaternary ammonium base in combination with an alkali or alkaline earth base, or alternatively a strong base in combination with an oxidant. The composition may be utilized in aqueous medium, e.g., with chelator, surfactant, and/or co-solvent species, to achieve high-efficiency removal of photoresist and/or SARC materials in the manufacture of integrated circuitry, without adverse effect on metal species on the substrate, such as copper, aluminum and/or cobalt alloys, and without damage to SiOC-based dielectric materials employed in the semiconductor architecture. 1. A cleaning composition useful for removing photoresist and/or sacrificial anti-reflective coating (SARC) materials from a substrate having such material(s) thereon , said composition comprising potassium hydroxide in combination with an oxidant.28.-. (canceled)9. The cleaning composition of claim 1 , which includes an aqueous solution of at least one oxidant claim 1 , potassium hydroxide claim 1 , optionally a chelator and optionally a co-solvent and/or a surfactant.10. (canceled)11. The cleaning composition of including the following components:0.1-30 wt % potassium hydroxide strong base;0.01-30 wt % oxidant;0-10 wt % chelator;0-5 wt % surfactant;0-50 wt % co-solvent; and20-98.9 wt % deionized water,wherein percentages of the components are percentages by weight, based on total weight of the composition, and wherein the total of the weight percentages of such components of the composition does not exceed 100 weight %.12. (canceled)13. The cleaning composition of wherein the oxidant comprises an oxidant species selected from the group consisting of hydrogen peroxide claim 1 , amine-N-oxides claim 1 , perborate salts claim 1 , persulfate salts claim 1 , and combinations of two or more of the ...

COTTON-GENTLE HYPOCHLORITE BLEACH

Methodologies and equipment for using a hypochlorite solution to remove menstrual fluid, underarm perspiration or other hard-to-remove stains from soft fabric articles with reduced damage to the fabric articles when compared with popular chlorine bleaches. The soft fabric articles preferably are in white, although the present invention can also be applied to articles in other colors. In one embodiment, the weight concentration ratio of the alkali metal hydroxide over the hypchlorite salt in the hypochlorite solution is no less than 1:12.5. The hypochlorite solution may contain at least 0.2% by weight of sodium hydroxide and/or have a pH of at least 11.8. 1130-. (canceled)131. A method for reducing the damaging effect of a hypochlorite-containing solution on a soft fabric article , the method comprising:combining an amount of sodium hydroxide and an amount of sodium hypochlorite in a solution to achieve a weight concentration ratio of the sodium hydroxide to the sodium hypochlorite in the solution of no less than 1:30 and to reduce at least one damaging effect of the solution on the soft fabric article when the article is directly contacted by the solution.132. The method of claim 131 , wherein the concentration ratio of the sodium hydroxide to the sodium hypochlorite in the solution is no less than 1:12.5.133. The method of claim 131 , wherein the concentration ratio of the sodium hydroxide to the sodium hypochlorite in the solution of no less than 1:5.134. The method of claim 131 , wherein the concentration ratio of the sodium hydroxide to the sodium hypochlorite in the solution is no less than 1:2.135. The method of claim 131 , wherein the concentration ratio of the sodium hydroxide to the sodium hypochlorite in the solution is no less than 1:1.136. The method of claim 131 , wherein the solution comprises at least 0.5% by weight of sodium hypochlorite.137. The method of claim 136 , wherein the solution comprises about 1% by weight to 2.5% by weight of sodium ...

Cleaning Methods and Compositions

Methods and chemical solvents used for cleaning residues on metal contacts during a semiconductor device packaging process are disclosed. A chemical solvent for cleaning a residue formed on a metal contact may comprise a reactive inorganic component and a reactive organic component. The method may comprise spraying a semiconductor device with a chemical solvent at a first pressure, and spraying the semiconductor device with the chemical solvent at a second pressure less than the first pressure.

Water-rich stripping and cleaning formulation and method for using same

The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water.

On site generation of alkalinity boost for ware washing applications

Methods for enhancing alkalinity and performance of ash-based detergents are disclosed. Nonhazardous ash-based detergent alkalinity is enhanced through increasing the ratio of sodium hydroxide to ash-based alkalinity. Methods according to the invention do not require the addition of chemical ingredients, do not generate additional waste streams and use the entirety of the ash-based detergent. The methods according to the invention provide alkalinity-enhanced detergent use solutions that are sufficiently concentrated for adequate cleaning capability while only requiring minimal amounts of the use solution to be dispensed for an in situ cleaning process.

OXIDIZING AQUEOUS CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES

An oxidizing aqueous cleaning composition and process for cleaning post-plasma etch residue and/or hardmask material from a microelectronic device having said residue thereon. The oxidizing aqueous cleaning composition includes at least one oxidizing agent, at least one oxidizing agent stabilizer comprising an amine species selected from the group consisting of primary amines, secondary amines, tertiary amines and amine-N-oxides, optionally at least one co-solvent, optionally at least one metal-chelating agent, optionally at least one buffering species, and water. The composition achieves highly efficacious cleaning of the residue material from the microelectronic device while simultaneously not damaging the interlevel dielectric and metal interconnect material also present thereon. 1. An aqueous cleaning composition , comprising at least one oxidizing agent , at least one oxidizing agent stabilizer comprising an amine species selected from the group consisting of primary amines , secondary amines , and tertiary amines , optionally at least one organic co-solvent , optionally at least one metal-chelating agent , optionally at least one buffering species , and water , wherein the pH of the cleaning composition is about 3 to about 9.24.-. (canceled)5. The aqueous cleaning composition of claim 1 , wherein the at least one oxidizing agent comprises hydrogen peroxide.6. The aqueous cleaning composition of claim 1 , wherein the at least oxidizing agent stabilizer comprises an amine species selected from the group consisting of monoethanolamine claim 1 , amino ethoxyethanol (diglycolamine) claim 1 , monoisopropanolamine claim 1 , isobutanolamine claim 1 , C-Calkanolamines claim 1 , methylethanolamine claim 1 , N-methylaminoethanol claim 1 , diethanolamine claim 1 , triethanolamine claim 1 , methyldiethanolamine claim 1 , triethylamine claim 1 , N claim 1 ,N-dimethylglycolamine claim 1 , N claim 1 ,N-dimethyldiglycolamine claim 1 , pentamethyldiethylenetriamine claim 1 , ...

METHODS FOR REFURBISHING AEROSPACE COMPONENTS

Embodiments of the present disclosure generally relate to methods for refurbishing aerospace components by removing corrosion and depositing protective coatings. In one or more embodiments, a method of refurbishing an aerospace component includes exposing the aerospace component containing corrosion to an aqueous cleaning solution. The aerospace component contains a nickel superalloy, an aluminide layer disposed on the nickel superalloy, and an aluminum oxide layer disposed on the aluminide layer. The method includes removing the corrosion from a portion of the aluminum oxide layer with the aqueous cleaning solution to reveal the aluminum oxide layer, then exposing the aluminum oxide layer to a post-rinse, and forming a protective coating on the aluminum oxide layer. 1. A method of refurbishing an aerospace component , comprising:exposing the aerospace component containing corrosion to an aqueous cleaning solution, wherein the aerospace component comprises a nickel superalloy, an aluminide layer disposed on the nickel superalloy, and an aluminum oxide layer disposed on the aluminide layer, and wherein the corrosion is contained on a first portion of the aluminum oxide layer while a second portion of the aluminum oxide layer is free of the corrosion;removing the corrosion from the first portion of the aluminum oxide layer with the aqueous cleaning solution to reveal the first portion of the aluminum oxide layer; thenexposing the first and second portions of the aluminum oxide layer to a post-rinse; andforming a protective coating on the first and second portions of the aluminum oxide layer.2. The method of claim 1 , wherein the aqueous cleaning solution comprises water claim 1 , a complexing agent claim 1 , and a base.3. The method of claim 2 , wherein the complexing agent comprises ethylenediaminetetraacetic acid (EDTA) and/or a salt thereof claim 2 , and wherein the base comprises a hydroxide.4. The method of claim 2 , further comprising:exposing the aerospace ...

CHEMICAL SOLUTION AND METHOD OF UNCLOGGING STOPPED TOILETS

A method for employing a particular chemical compound formed with sodium hydroxide to rapidly clear clogs in drains, such as clogs caused by organic debris in toilet drains. A user may dispense this chemical compound in solid or powder form into the drain, following which the chemical will attack the source of the clog and potentially clear the drain. 1. A solution that removes clogs from pipes , comprising:anhydrous sodium hydroxide, the anhydrous sodium hydroxide comprising substantially 80% anhydrous sodium hydroxide flakes and a remainder of anhydrous sodium hydroxide beads.2. The solution of claim 1 , wherein the anhydrous sodium hydroxide claim 1 , when mixed with water claim 1 , causes an exothermic reaction that removes clogs.3. A method of removing clogs from drains claim 1 , comprising:mixing a solution of 80% anhydrous sodium hydroxide flakes with 20% anhydrous sodium hydroxide beads;pouring the solution into a drain with a clog and water present;having an exothermic reaction between the solution and the water; anddisplacing the clog with the exothermic reaction.4. The method of claim 3 , further comprising:pouring hot water into the drain after a predetermined period of time to flush the clog down the drain. This application claims the benefit of the filing date of U.S. Provisional Patent Application No. 62/021,468, filed Jul. 7, 2014, which is incorporated herein by reference in its entirety.Current models of bathroom toilets can occasionally, during unusual or even routine use, become clogged and essentially unusable, greatly impairing the user experience. While a variety of techniques of unclogging toilets exist, from mechanical methods like plungers or plumber's snakes to chemical techniques like enzyme treatments, all have notable downsides. Using a mechanical method, like the aforementioned plungers and plumber's snakes, to clear the drain requires a user to decontaminate their equipment once finished with the task, and often results in the user ...

CONTROL OF SCALE IN WAREWASH APPLICATIONS

Provided are compositions useful for cleaning, such as warewashing. The compositions comprise (a) a polymer comprising polymerized units of (i) an ethylenically unsaturated carboxylic acid monomer or salt thereof, (ii) an ethylenically unsaturated sulfonic acid monomer or salt thereof, and optionally (iii) one or more further monomers or salt thereof, the polymer having a Mw from 2000 to 100,000; (b) a water soluble silicate; (c) an alkaline source; and (d) optionally a surfactant. 2. The cleaning composition of wherein the ethylenically unsaturated carboxylic acid monomer comprises (meth)acrylic acid or a salt thereof.3. The cleaning composition of claim 1 , wherein the ethylenically unsaturated sulfonic acid monomer comprises 2-acrylamido-2-methylpropane sulfonic acid (AMPS) claim 1 , 2-(meth)acrylamido-2-methylpropane sulfonic acid claim 1 , 4-styrenesulfonic acid claim 1 , vinylsulfonic acid claim 1 , 3-allyloxy claim 1 , 2-hydroxy 1-propane sulfonic acid (HAPS) claim 1 , 2-sulfoethyl(meth)acrylic acid claim 1 , 2-sulfopropyl(meth)acrylic acid claim 1 , 3-sulfopropyl(meth)acrylic acid claim 1 , and 4-sulfobutyl(meth)acrylic acid claim 1 , or a salt thereof.4. The cleaning composition of claim 1 , wherein the polymer is derived from polymerized units of 70 to 93 weight percent acrylic acid; from 7 to 30 weight percent of an ethylenically unsaturated sulfonic acid monomer; and from 2 to 22 weight percent of a further monomer selected from ethyl acrylate claim 1 , butyl acrylamide claim 1 , and maleic anhydride.5. The cleaning composition of claim 1 , wherein the water soluble silicate is a hydrous sodium silicate.6. The cleaning composition of claim 1 , wherein the water soluble silicate comprises sodium (di)silicate claim 1 , sodium metasilicate claim 1 , or mixtures thereof.7. (canceled)8. (canceled)9. The cleaning composition of claim 1 , wherein the cleaning composition is a warewash formulation or a hard surface cleaner formulation.10. A method of cleaning an ...

Method of cleaning residual pesticide from an agricultural vessel

The present invention generally relates to methods of cleaning residual pesticide from an agricultural vessel, and to kits and compositions useful for the practice of such methods.

Cleaning composition containing a polysaccharide hybrid polymer composition and methods of improving drainage

A composition includes a polysaccharide hybrid polymer composition. In one embodiment, the polysaccharide hybrid polymer composition includes a polysaccharide residue present in an amount from about 5% to about 90% by weight of the polysaccharide hybrid polymer composition and a residue of at least one ethylenically unsaturated monomer present in an amount from about 10% to about 75% by weight of the polysaccharide hybrid polymer composition.

CLEANING COMPOSITION CONTAINING A POLYSACCHARIDE GRAFT POLYMER COMPOSITON AND METHODS OF IMPROVING DRAINAGE

A composition includes a polysaccharide graft polymer composition. In one embodiment, the polysaccharide graft polymer composition includes a polysaccharide residue present in an amount from about 5% to about 90% by weight of the polysaccharide graft polymer composition and a residue of at least one ethylenically unsaturated monomer present in an amount from about 10% to about 75% by weight of the polysaccharide graft polymer composition. 1. A cleaning composition comprising:at least one alkali metal hydroxide present in an amount from about 21% to about 80% by weight of the cleaning composition;water; anda polysaccharide graft polymer composition comprising:polysaccharide residue in an amount from about 5% to about 90% by weight of the polysaccharide graft polymer composition; andresidue of at least one ethylenically unsaturated monomer present in an amount from about 10% to about 75% by weight of the polysaccharide graft polymer composition.2. The cleaning composition of claim 1 , wherein the at least one ethylenically unsaturated monomer includes at least one ethylenically unsaturated anionic monomer.3. The cleaning composition of claim 1 , wherein the at least one ethylenically unsaturated monomer includes at least one member selected from the group consisting of acrylic acid claim 1 , methacrylic acid claim 1 , ethacrylic acid claim 1 , α-chloro-acrylic acid claim 1 , α-cyano acrylic acid claim 1 , β-methyl-acrylic acid (crotonic acid) claim 1 , α-phenyl acrylic acid claim 1 , β-acryloxy propionic acid claim 1 , sorbic acid claim 1 , α-chloro sorbic acid claim 1 , angelic acid claim 1 , cinnamic acid claim 1 , p-chloro cinnamic acid claim 1 , β-styryl acrylic acid (1-carboxy-4-phenyl butadiene-1 claim 1 ,3) claim 1 , itaconic acid claim 1 , maleic acid claim 1 , citraconic acid claim 1 , mesaconic acid claim 1 , glutaconic acid claim 1 , aconitic acid claim 1 , fumaric acid claim 1 , tricarboxy ethylene claim 1 , 2-acryloxypropionic acid claim 1 , 2-acrylamido- ...

SURFACTANTS DERIVED FROM OLIGOGLYCEROLS

Provided is a surfactant composition comprising an oligoglycerol compound of formula I, wherein R and m are as defined above. The compounds exhibit favorable surfactancy properties. Advantageously, the compounds may be prepared from renewable materials. 1. A composition comprising a solution of 3-(2-hydroxy-3-(2-propylheptyl)oxy)propoxy)propane-1 ,2-diol.2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)71. A method of cleaning a hard surface , the method comprising contacting the surface with a cleaning composition comprising the composition of Claim .8. (canceled)9. (canceled)10. The composition of claim 1 , further comprising a glycol ether claim 1 , an alkanolamine and sodium hydroxide. This application claims priority from provisional application Ser. No. 61/551,680, filed Oct. 26, 2011, which is incorporated herein by reference in its entirety.This invention relates generally to surfactant compositions and more specifically to surfactant compositions that are derived from oligoglycerol.Surfactants are important materials that find use across a broad spectrum of applications. A wide variety of surfactant types are known. One class is the nonionic surfactants, which are used in many commercial and household applications where advantage is taken of their superior performance as wetting agents, their detergency and scouring characteristics and resistance to hard water conditions, as well as their adaptability for being combined with other types of surfactants.Many common nonionic surfactants are prepared by the addition of ethylene oxide or mixtures of ethylene oxide and propylene oxide to various alcohols, which are generally long-chain monohydric alcohols. Numerous different adducts have been prepared, some of which contain only oxyethylene groups while others contain a random distribution of oxyethylene and oxypropylene groups or discrete blocks of polyoxyethylene and polyoxypropylene.In recent years, there has been a trend towards surfactants ...

Selective etching of reactor surfaces

Compositions, methods, and systems permit selectively etching metal oxide from reactor metal parts (e.g., titanium and/or titanium alloys). The etching composition comprises an alkali metal hydroxide and gallic acid. The method is useful for cleaning reaction chambers used in the deposition of metal oxide films such as aluminum oxide.

SEMICONDUCTOR ELEMENT CLEANING LIQUID AND CLEANING METHOD

The present invention makes it possible to provide a semiconductor element cleaning method that is characterized in that: a hard mask pattern is formed on a substrate that has a low relative permittivity film and at least one of a cobalt, a cobalt alloy, or a tungsten plug; and a cleaning liquid that contains 0.001-20% by mass of an alkali metallic compound, 0.1-30% by mass of quaternary ammonium hydroxide, 0.01-60% by mass of a organic water-soluble solvent, 0.0001-0.1% by mass of hydrogen peroxide, and water is subsequently used on a semiconductor element in which, using the hard mask pattern as a mask, the hard mask, the low relative permittivity film, and a barrier insulating film are dry etched, and dry etch residues are removed. 1. A method for cleaning a semiconductor element which is obtained by forming a hardmask pattern on a substrate that has a low-dielectric-constant film and at least one of cobalt , a cobalt alloy and a tungsten plug , and then subjecting a hardmask , the low-dielectric-constant film and a barrier insulating film to a dry etching treatment using said hardmask pattern as a mask , the method comprising the step of removing dry etch residues with a cleaning liquid containing 0.001-20% by mass of an alkali metal compound , 0.1-30% by mass of a quaternary ammonium hydroxide , 0.01-60% by mass of an organic water-soluble solvent , 0.0001-0.1% by mass of hydrogen peroxide and water.2. The method according to claim 1 , wherein the alkali metal compound is at least one or more selected from the group consisting of sodium hydroxide claim 1 , sodium sulfate claim 1 , sodium carbonate claim 1 , sodium hydrogen carbonate claim 1 , sodium nitrate claim 1 , sodium fluoride claim 1 , sodium chloride claim 1 , sodium bromide claim 1 , sodium iodide claim 1 , potassium hydroxide claim 1 , potassium sulfate claim 1 , potassium carbonate claim 1 , potassium hydrogen carbonate claim 1 , potassium nitrate claim 1 , potassium fluoride claim 1 , potassium ...

METHOD FOR CLEANING LANTHANUM GALLIUM SILICATE WAFER

The present disclosure provides a method for cleaning a lanthanum gallium silicate wafer which comprises the following steps: at a step of a cleaning solution constituted of phosphorous acid, hydrogen peroxide and deionized water is utilized to clean the lanthanum gallium silicate wafer with a megahertz sound wave; at a step of the cleaned lanthanum gallium silicate wafer is rinsed and dried by spinning; at a step of a cleaning solution constituted of ammonia, hydrogen peroxide and deionized water is utilized to clean the lanthanum gallium silicate wafer with the megahertz sound wave; at a step of the cleaned lanthanum gallium silicate wafer is rinsed and dried by spinning; and at a step of the rinsed and dried wafer is placed in an oven to be baked. The present invention shortens a period of acidic cleaning process and prolongs a period of alkaline cleaning and utilizes a more effective cleaning with megahertz sound wave to replace the conventional ultrasonic cleaning to solve the issue of cleaning the lanthanum gallium silicate wafer after a cutting process and to improve surface cleanliness of the lanthanum gallium silicate wafer to get a better cleaning effect. 1. A method for cleaning a lanthanum gallium silicate wafer which comprises the following steps:{'b': '1', 'at a step of , a cleaning solution constituted of phosphorous acid, hydrogen peroxide and deionized water is utilized to clean the lanthanum gallium silicate wafer with a megahertz sound wave;'}{'b': '2', 'at a step of , the cleaned lanthanum gallium silicate wafer is rinsed and dried by spinning;'}{'b': '3', 'at a step of , a cleaning solution constituted of ammonia, hydrogen peroxide and deionized water is utilized to clean the lanthanum gallium silicate wafer with the megahertz sound wave;'}{'b': '4', 'at a step of , the cleaned lanthanum gallium silicate wafer is rinsed and dried by spinning; and'}{'b': '5', 'at a step of , the rinsed and dried wafer is placed in an oven to be baked.'}21. The ...

COMPOSITION FOR CLEANING MASK AND METHOD FOR CLEANING MASK USING THE SAME

The present invention provides a composition for cleaning a mask comprising a) 0.2 to 10% by weight of two or more alkali compounds selected from alkali hydroxides and alkali carbonates, b) 0.1 to 8% by weight of nitrate, c) 1 to 8% by weight of an oxidizer, and d) residual water, wherein the pH is 11.5 to 14. 1. A composition for cleaning a mask comprising:a) 0.2 to 10% by weight of two or more alkali compounds selected from alkali hydroxides and alkali carbonates,b) 0.1 to 8% by weight of nitrate,c) 1 to 8% by weight of an oxidizer, andd) residual water,wherein the pH is 11.5 to 14.2. The composition for cleaning a mask of claim 1 , wherein the composition is used for cleaning a mask on which one or more selected from a metal film including one or more of silver and magnesium; and an aluminum oxide (AlO) film are deposited.3. The composition for cleaning a mask of claim 1 , wherein the material of the mask is one or more metals selected from stainless steel or a nickel alloy.4. The composition for cleaning a mask of claim 3 , wherein the material of the mask is one or more alloys selected from a steel use stainless (SUS) alloy claim 3 , an invariable (INVAR) alloy claim 3 , and a KOVAR alloy.5. The composition for cleaning a mask of claim 1 , wherein a) two or more alkali compounds comprises potassium hydroxide and sodium hydroxide.6. The composition for cleaning a mask of claim 5 , wherein a) the potassium hydroxide and sodium hydroxide have an amount of 0.1 to 5% by weight based on 100% by weight of the total weight of the composition for cleaning a mask (a+b+c+d).7. The composition for cleaning a mask of claim 1 , wherein b) nitrate is one or more selected from potassium nitrate claim 1 , sodium nitrate claim 1 , ammonium nitrate claim 1 , calcium nitrate claim 1 , aluminum nitrate claim 1 , and magnesium nitrate.8. The composition for cleaning a mask of claim 1 , wherein c) oxidizer is a sulfate compound.9. The composition for cleaning a mask of claim 8 , ...

ON LINE CHEMICAL CLEANING OF AIR COOLERS

This invention relates to cleaning of deposits or scale or fouling from external surface of air coolers tubes bundle. 1):Method of work which includes pneumatic dry spraying of powder chemicals onto air coolers tubes bundle, with a benefit of chemical and mechanical cleaning at the same time, with no need to shut down the production process, no water treatment, no scaffolding, no confined space entry and no removal of the safety screen.2):Chemistry (chemicals mixture) of a blend of compounds in different ratios to achieve desired cleaning results and to maximize the cleaning effectiveness according to specific conditions of the air cooler bundle that is been cleaned. The present invention relates to cleaning of deposits or scale or fouling and in particular, to cleaning of deposits or scale or fouling from complex structures where there are difficulties in reaching to their parts.Equipment performance can deteriorate over time as result of accumulation of dust, mud, rust, microorganisms, oil, scale and other deposits. Heat exchangers can lose their thermal efficiency that may result inadequate and sometimes dangerous thermal conditions, higher energy consumption and bottlenecks in production.The propensity of water or steam or other solvents to form solutions and emulsions is used in various cleaning processes. Many industrial processes rely on using water or steam or other solvents to dissolve and extract substances, sometimes with chemicals that are dissolved or solids that are suspended in water or steam or other solvents. Yet, there are some problems associated with the use of water or steam or other solvents. Apart from equipment mechanical or chemical damage, there is a global water crisis that has become a major concern with humanitarian implications. Additional environmental difficulties relate to treatment and disposal of waste water that had become costlier, as result of increasing environmental concern and governmental regulatory pressures. The capital ...

Laundry detergent composition comprising branched alkyl alkoxylated sulphate

The present invention relates to a solid free-flowing particulate laundry detergent composition including C 11 -C 13 alkyl benzene sulphonate detersive surfactant; C 11 -C 15 alkyl ethoxylated sulphate having an average degree of ethoxylation of from 0.5 to 3.0, and comprising a C 1 -C 5 alkyl branch in the position C2, and having an average degree of branching of from 0.01 to 0.25; from 0 wt % to 10 wt % zeolite builder; and from 0 wt % to 10 wt % phosphate builder.

PHOSPHORUS FREE LOW TEMPERATURE WARE WASH DETERGENT FOR REDUCING SCALE BUILD-UP

Phosphorus-free detergent compositions are provided. Detergent compositions including an aminocarboxylate, water conditioning agent, source of alkalinity and water beneficially do not require the use of additional surfactants and/or polymers to provide suitable detergency and prevent scale build-up on treated surfaces. The detergent compositions are used with a sanitizer to employ the phosphorus-free detergent compositions for use as low temperature ware wash detergents that beneficially reduce scale build-up. Methods of employing the phosphorus-free detergent compositions are also provided. 1. A phosphorus-free detergent composition comprising:an alkalinity source;from about 0.1-15 wt-% of an aminocarboxylate;from about 0.1-15 wt-% of a water conditioning polymer;from about 20-80 wt-% of water,wherein the composition is phosphorus-free, does not contain surfactants and reduces or eliminates scale build-up on treated surfaces, andwherein the detergent composition provides a use solution having a pH of at least about 8 and an effective sanitizing effect at wash temperatures that are not heated above about 140° F. when employed with a sanitizer.2. The composition of claim 1 , wherein the aminocarboxylate is an aminocarboxylic acid or a salt of an aminocarboxylic acid.3. The composition of claim 2 , wherein the aminocarboxylate is methylglycinediacetic acid.4. The composition of claim 1 , wherein the water conditioning polymer is a polyacrylate claim 1 , polycarboxylate or polycarboxylic acid.5. The composition of claim 1 , wherein the alkalinity source is sodium hydroxide.6. The composition of claim 1 , wherein the ratio of the aminocarboxylate to the water conditioning polymer is from about 1:5 to about 5:1.7. The composition of claim 1 , wherein the composition comprises between about 1 wt-% and about 10 wt-% aminocarboxylate claim 1 , between about 0.1 wt-% and about 10 wt-% water conditioning polymer claim 1 , and between about 30 wt-% and about 80 wt-% water.8. A ...

FREESTANDING DETERGENT COMPOSITION NOT REQUIRING AN AUTOMATED DISPENSER

A solid controlled release composition according to the present invention includes at least one cellulosic material, water, at least one active ingredient, and optionally at least one of a saccharide, sugar alcohol or salt. The active ingredient can be a polycarboxylic acid. 1. A system for cleaning wares , the system comprising:a solid controlled release composition having a substantially homogenous composition and consisting essentially of at least one cellulosic material, water, at least one polycarboxylic acid, and optionally at least one member selected from the group consisting of saccharides, sugar alcohols, and salts; anda discrete detergent composition comprising at least one alkalinity source.2. The system of claim 1 , wherein the at least one polycarboxylic acid comprises maleic acid claim 1 , maleic anhydride claim 1 , methacrylic acid claim 1 , acrylic acid claim 1 , and itaconic acid.3. The system of claim 2 , wherein the discrete detergent composition is substantially free of the at least one polycarboxylic acid of the solid controlled release composition.4. The system of claim 1 , wherein the solid controlled release composition consists essentially of at least one cellulosic material claim 1 , water claim 1 , at least one polycarboxylic acid claim 1 , at least one saccharide claim 1 , and at least one salt.5. A solid controlled release composition consisting essentially of:at least one cellulosic material;water;at least one polycarboxylic acid; andoptionally, at least one member selected from the group consisting of saccharides, sugar alcohols, and salts,wherein the solid controlled release composition has a substantially homogenous composition and is substantially free of an alkalinity source.6. The solid controlled release composition of claim 5 , wherein the at least one cellulosic material is present in an amount of between about 5% and about 90% by weight of the solid composition claim 5 , water is present in an amount of between about 0.5% and ...

Peroxide Contact Lens Care Solution

The invention is directed to a method of cleaning and disinfecting a contact lens. The method includes instructing a consumer to disinfect their contact lens comprising the following steps: remove a contact from an eye and position the lens in a lens assembly that includes a cap member; add a disinfection solution to the lens case such that the lens is submerged in the solution upon closure of the lens case with the cap member. The disinfection solution will comprise 0.5 wt. % to 6 wt. % hydrogen peroxide or a chemical precursor of hydrogen peroxide, and a P-metal modulating compound. The presence of the P-metal modulating compound in the disinfection solution decreases the neutralization rate of the hydrogen peroxide. The disinfection system exhibits a pseudo first-order, half-life of hydrogen peroxide from 12 minutes to 30 minutes over an initial sixty minutes of neutralization following exposure of the disinfection solution to a catalyst comprising a P-metal. This reduction in rate of peroxide neutralization can provide a more effective solution for killing certain microorganisms and fungi. 1. A method of cleaning and disinfecting a contact lens , the method comprising instructing a consumer to disinfect their contact lens comprising the following steps:remove a contact from an eye and position the lens in a lens assembly that includes a cap member;add a disinfection solution to a lens case such that the lens is submerged in the solution upon closure of the lens case with the cap member, said disinfection solution comprising 0.5 wt. % to 6 wt. % hydrogen peroxide or a chemical precursor of hydrogen peroxide, and a P-metal modulating compound, wherein the solution exhibits a pseudo first-order, half-life of hydrogen peroxide from 12 minutes to 30 minutes over an initial sixty minutes of neutralization following exposure of the disinfection solution to a catalyst comprising a P-metal.2. The method of wherein upon closure of the lens case with the cap member the ...

AQUEOUS CLEANING SOLUTION FOR REMOVAL OF ROUGING DEPOSITS ON MEDIA-CONTACTED SURFACES OF STAINLESS STEELS, USE THEREOF AND PROCESS FOR PRODUCTION THEREOF

An aqueous cleaning solution for removing rouging deposits on media-contacted surfaces of stainless steels comprises a first component and a second component. The first component is an alkali sulfite and the second component is an alkali formate, wherein the concentrations thereof are adjusted in such manner that formate is present in a molar ratio of 1.5 to 4.2 relative to sulfite, and that the pH value of the cleaning solution is 4.0 to 4.8. For preparing the aqueous cleaning solution, an aqueous solution of an alkali hydroxide is provided initially, thereafter a first amount of concentrated aqueous formic acid is admixed in an excess in such manner that a pH value of 3.5 to 4.5 is established, then a second amount of solid alkali sulfite is admixed in accordance with the sulfite concentration to be established, thus resulting in a pH value of 5.5 to 6.5, and finally a third amount of concentrated aqueous formic acid is admixed until a pH value of 4.0 to 4.8 is attained. 1. An aqueous cleaning solution comprising:a first component and a second component,wherein the first component is an alkali sulfite and the second component is an alkali formate,wherein the concentrations of the first component and second component are adjusted such that formate is present in a molar ratio of 1.5 to 4.2 relative to sulfite, and that the pH value of the cleaning solution is 4.0 to 4.8,wherein the aqueous cleaning solution is adapted to remove rouging deposits on media-contacted surfaces of stainless steels.2. The aqueous cleaning solution according to claim 1 , wherein the molar ratio of formate relative to sulfite is 3.0 to 4.2 and the pH value of the cleaning solution is 4.1 to 4.5.3. The aqueous cleaning solution according to claim 1 , wherein the alkali sulfite is sodium sulfite and the alkali formate is sodium formate.4. The aqueous cleaning solution according to claim 1 , wherein the sulfite is present in a concentration of 0.05 to 1.5 mol/kg.5. Method for removing rouging ...

COMPOUND OF BIODEGRADABLE SURFACTANTS FOR SEPARATING IMPURITIES IN A HYDROCARBON

Compounds of biodegradable surfactants useful for optimizing the separation of impurities typical of hydrocarbons, and designed to intervene and stabilize the molecular structure of crude oil, with no significant alterations of the crude's intrinsec composition are disclosed. The biodegradable surfactants compounds coexist with a non-ionic surfactant and an organic mix in emulsion form with the purpose of isolating crude from the pipeline, reduce friction to improve crude flow and to enter the crude macromolecule to modify the hydrocarbon chain to reduce its density and thus its viscosity; including compounds of biodegradable surfactants that comprise sodium hydroxide N, potassium chloride, sulphonic acid, dodecanoic acid, nonylphenol, terpene- and water, preferably hard water. 15-. (canceled)6. The process of using a compound of biodegradable surfactants , comprising sodium hydroxide 1N , potassium chloride , sulphonic acid , dodecanoic acid , nonylphenol , terpene-1 and water , for cleaning crude formations and facilities , for dissolving waxes , asphaltene and other component precipitates in the crude , for enhancing the physico-chemical properties of the crude such as viscosity , density , API gravity , water/crude emulsion content , reduction of acidity and stimulation of crude production.7. The process of using the compound of biodegradable surfactants of for treating different kinds of crude oil claim 6 , bitumen claim 6 , greases claim 6 , oily sands and crude oil spills. This application is a claims benefit of Serial No. MX/a/2012/000253, filed 2 Jan. 2012 in Mexico and which application is incorporated herein by reference. To the extent appropriate, a claim of priority is made to the above disclosed application.The compound of biodegradable surfactants of the present invention has been produced for optimizing the separation of impurities usually found in hydrocarbons, and it is designed to intervene and stabilize the molecular structure of crude oil, ...

Support material formulation and additive manufacturing processes employing same

Novel support material formulations, characterized as providing a cured support material with improved dissolution rate, while maintaining sufficient mechanical strength, are disclosed. The formulations comprise a water-miscible non-curable polymer, a first water-miscible, curable material and a second, water-miscible material that is selected capable of interfering with intermolecular interactions between polymeric chains formed upon exposing the first water-miscible material to curing energy. Methods of fabricating a three-dimensional object, and a three-dimensional object fabricated thereby are also disclosed.

MODERATELY ALKALINE CLEANING COMPOSITIONS FOR PROTEINACEOUS AND FATTY SOIL REMOVAL AT LOW TEMPERATURES

The present invention comprises chlorinated and non-chlorinated alkaline cleaning compositions for removal of proteinaceous and fatty soils at low temperature, i.e. less than 120° F., with little or no deleterious affect on cleaning performance. According to the invention, applicants have found that adding additional alkalinity makes protein removal more difficult and reducing the amount of alkalinity actually improves performance. According to the invention optimized combinations of chlorine and alkalinity components for low temperature cleaning as well as a surfactant system optimized for low temperature fatty soil removal are disclosed. 1. A cleaning composition capable of removing proteinaceous soils and/or fatty soils or mixtures thereof at temperatures of less than 100° F. comprising:a source of chlorine; anda source of active alkalinity; wherein said chlorine and active alkalinity are in a ratio of greater than 1:1 on a percent weight basis.2. The cleaning composition of claim 1 , wherein said chlorine and active alkalinity are in a ratio of greater than 3:1 on a weight basis.3. The cleaning composition of claim 1 , wherein said chlorine and active alkalinity are in a ratio of greater than 5:1 on a weight basis.4. The cleaning composition of wherein said alkaline portion comprises one or more of the following: an alkali or alkaline earth metal borate claim 1 , silicate claim 1 , carbonate claim 1 , hydroxide claim 1 , or phosphate.5. The cleaning composition of wherein said source of chlorine comprises one or more of the following: a hypochlorite claim 1 , a chlorinated phosphate claim 1 , a chlorinated isocyanurate claim 1 , a chlorinated melamine claim 1 , or a chlorinated amide.6. The cleaning composition of claim 1 , further comprising a surfactant.7. The cleaning composition of wherein said composition is a use composition8. The cleaning composition of wherein said surfactant is an amine oxide that has at least 50% of the carbon chain lengths of 14 or ...

HIGH ALKALINE CLEANERS, CLEANING SYSTEMS AND METHODS OF USE FOR CLEANING ZERO TRANS FAT SOILS

The present disclosure relates to high alkaline cleaners, cleaning systems and methods for removing polymerized zero trans fat soils. The high alkaline cleaner of the present invention generally includes one or more alkaline wetting and saponifying agent(s), a chelating/sequestering system and a surface modifying-threshold agent system. In various embodiments, the cleaners may include, at least one cleaning agent comprising a surfactant or surfactant system and/or a solvent or solvent system and/or cleaning booster such as a peroxide or sulfite type additive. The cleaners may also include one or more components to modify the composition form and/or the application method in some embodiments. All components described above may also be optimized optionally, to provide emulsification of a composition (both as a usable product or a concentrate that can be diluted to form a usable product). The use of the high alkaline cleaner of the present invention has demonstrated enhanced cleaning characteristics especially at higher temperatures (° F. to about ° F.) but also shows enhanced cleaning at ambient temperatures. 153-. (canceled)54. A method for removing a polymerized zero trans fat soil from a food processing surface comprising:{'claim-text': ['(i) water;', '(ii) about 1.5 wt. % to about 30 wt. % of an alkalinity source, wherein the alkalinity source is an alkali metal hydroxide and an alkanol amine;', '(iii) about 0.1 wt. % to about 5 wt. % chelating/sequestering agent(s);', '(iv) about 0.1 wt. % to about 50 wt. % of a solvent, wherein the solvent comprises an aromatic solvent;', '(v) about 0.1 wt. % to about 30 wt. % of a surfactant;', '(vi) about 0.01 wt. % to about 5 wt. % of a thickening agent,'], '#text': '(a) providing an alkaline cleaning solution, wherein the alkaline cleaning solution comprises:'}(b) applying the alkaline cleaning solution to the food processing surface at a temperature of between about 40° F. and about 200° F., wherein the food processing ...

Reducing agent as corrosion inhibitor for machine warewash

Warewash detergent compositions with reducing agents to overcome corrosion challenges in stainless steel dish machines subject to conditions from chlorine sanitizing rinse steps (or other oxidizing chlorine containing compositions) are provided. Liquid and solid detergent composition beneficially containing a reducing agent that reacts with chlorine introduced in sanitizing rinse steps that follow detergent cleaning steps are provided. Methods for ware washing using the detergent compositions with reducing agents and methods for reducing residual chlorine in a ware washing cycle are also provided.

Cleaning Compositions

This disclosure relates to a cleaning composition that contains 1) hydroxylamine, 2) an amino alcohol, 3) hexylene glycol, and 4) water.

DELAYED COKER FEED HEATER ON-LINE STEAM-CHEMICAL DECOKING METHOD

A process for decoking of delayed coker feed heater pass is disclosed. A chemical mixture containing a metal hydroxide and a metal carbonate is combined with steam to decoke the delayed coker feed heater pass. 1. A process for decoking a delayed coker feed heater comprising the steps of:(a) supplying a mixture of steam and predetermined chemical amount at pre-calculated radiant coil outlet temperature by controlling heater firing;(b) decreasing the flow of steam and while maintaining radiant coil temperature and chemical injection rate; and(c) further decreasing the flow of steam while maintaining radiant coil temperature and chemical injection rate until heater de-coking is complete.2. The process of claim 1 , further comprising the steps of:calculating quantity of steam and chemical mixture to provide sufficient reaction time in the heater as a function of radiant coil outlet temperature; anddetermining feasible operating radiant coil temperature for decoking.3. The process of claim 1 , wherein in the step (a) the radiant coil outlet temperature is about 1100° F. to 1200° F. claim 1 , depending on the heater mechanical design claim 1 , and in the step (b) and step (c) the radiant coil temperature is same as that in step (a).4. The method of claim 2 , further comprising the step of adjusting chemical injection rate into steam to increase coke burning gasification rate.5. The process of claim 1 , wherein in the step (a) the steam flow rate in the radiant coils has a mass velocity less than 60 lbs/ft-sec.6. The process of claim 1 , wherein in the step (a) claim 1 , step (b) and step(c) claim 1 , the chemical mixture is an aqueous solution of KOH and of K2CO3.7. The process of claim 1 , wherein in the step (a) claim 1 , step (b) and step(c) claim 1 , the chemical is an aqueous solution that contains KOH—K2CO3 mixture and the amount of up to 50 wt % KOH.8. The process of claim 1 , wherein in the step (b) claim 1 , step (b) and step (c) chemical injection rate provides ...

CLEANING FORMULATIONS FOR REMOVING RESIDUES ON SEMICONDUCTOR SUBSTRATES

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 3) at least one metal-containing additive; and 4) water. 1. A cleaning composition , comprising:1) at least one redox agent;2) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers;3) at least one metal-containing additive; and4) water.2. The composition of claim 1 , wherein the composition has a pH from about 7 to about 11.3. The composition of claim 1 , wherein the at least one redox agent comprises hydroxylamine.4. The composition of claim 1 , wherein the at least one redox agent is from about 5% to about 20% by weight of the composition.5. The composition of claim 1 , wherein the at least one organic solvent comprises two organic solvents.6. The composition of claim 5 , wherein the two organic solvents are each independently selected from the group consisting of alkylene glycols and alkylene glycol ethers.7. The composition of claim 1 , wherein the at least one organic solvent is from about 60% to about 95% by weight of the composition.8. The composition of claim 1 , wherein the at least one metal-containing additive comprises a metal halide claim 1 , a metal hydroxide claim 1 , a metal boride claim 1 , a metal alkoxide claim 1 , a metal oxide claim 1 , or a metal-containing ammonium salt.9. The composition of claim 1 , wherein the at least one metal-containing additive comprises a Group 2A metal claim 1 , a Group 3B metal claim 1 , a Group 4B metal claim 1 , a Group 5B metal claim 1 , or a lanthanide metal.10. The composition of claim 9 , wherein the at least one metal-containing additive comprises Ca claim 9 , Ba claim 9 , Ti claim 9 , Hf claim 9 , Sr claim 9 , La claim 9 , Ce claim 9 , W claim 9 , V ...

Liquid composition for cleaning semiconductor device, method for cleaning semiconductor device, and method for fabricating semiconductor device

[Problem] To provide a liquid cleaning composition for removing a titanium nitride hard mask while suppressing damage to copper, a copper alloy, cobalt or a cobalt alloy upon fabricating a semiconductor device, a cleaning method using the same, and a method for fabricating a semiconductor device. [Solution] A liquid cleaning composition of the present invention used for fabricating a semiconductor device comprises hydrogen peroxide at 1-30% by mass, potassium hydroxide at 0.01-1% by mass, aminopolymethylene phosphoric acid at 0.0001-0.05% by mass, a compound having a group 13 element at 0.00005-0.5% by mass and water.

Compositions for removing residues and related methods

Compositions for removing residues from a semiconductor structure. The compositions comprise water, a base, a polydentate chelator, a degasser, and a fluorine source. The compositions comprise greater than or equal to approximately 99 wt % of the water and are formulated to exhibit a pH of from approximately 10.0 to approximately 12.0. Methods of forming and using the compositions are also disclosed.

LEAD-FREE AND SULPHURIC ACID-FREE METHOD FOR GALVANISING METALLIC MATERIALS, AND STEARATE-REMOVING COMPOSITION

The present invention relates to a galvanization process that comprises a residue cleanup step which aims to provide many improvements and facilities to manufacturers and processors of metal wires in general. 1. Process for residue cleanup and galvanization of drawn wire metal materials which eliminates a lead pot bath step , characterized in that it comprises the steps of:drawing the wire with lubricant soap;bathing the drawn wire in a removing bath with a stearate removing composition to remove residues, followed by a sponge set which is made with synthetic fibers, natural fibers or rotating brushes, placed in a strategic position in a removing tank through which the wire to be galvanized passes;rinsing in a tank with water;optionally etching;flushing; andimmersing in a pot with molten zinc, thus finishing the hot dip galvanizing process.2. Process claim 1 , according to claim 1 , characterized in that the removing bath comprises 1 to 15% of diphosphonic hydroxyethylene acid claim 1 , 20 to 40% of potassium hydroxide claim 1 , 1 to 10% of oleic acid claim 1 , 1 to 20% of propylene glycol claim 1 , 1 to 10% of butyl glycol and 0.5 to 3% of silicone antifoam.3. Process claim 2 , according to claim 2 , characterized in that the removing bath is used at a final concentration from 8 to 30% claim 2 , at a working temperature between 25 and 100° C.4. Process claim 1 , according to claim 1 , characterized in that the sponge set claim 1 , made from synthetic fibers claim 1 , natural fibers or rotating brushes claim 1 , is conformed and positioned in such a way to wrap the entire wire surface.5. Process claim 1 , according to claim 1 , characterized in that the flushing step comprises a water bath claim 1 , zinc chloride and ammonium chloride.6. Process claim 1 , according to claim 1 , characterized in that it comprises an oven drying step claim 1 , occurring between the flushing step and the zinc application step.7. Process claim 1 , according to claim 1 , characterized in ...

COMPOSITION USED TO REMOVE LABELS

The invention relates to the use of a composition for removing a label or labels from a labelled item, said composition comprising: between 1 and 3 wt. % of at least one organic or mineral base; between 2 and 10 wt. %, preferably between 3 and 8%, more preferably between 4 and 6%, of at least one water-miscible organic solvent; and water, the quantity of which is determined in such a way as to form the remainder of the total composition (100 wt. %). The invention also relates to the method for removing labels using said composition. 1. A method for removing label(s) from a labeled article , comprising using a composition comprising:from 1% to 3% by weight of at least one organic or mineral base,from 2% to 10% by weight of at least one water-miscible organic solvent, andwater, the amount of which is determined so as to form the remainder of the total composition (100% by weight).2. The method as claimed in claim 1 , wherein said at least one organic solvent is an aprotic water-soluble solvent.3. The method as claimed in claim 1 , wherein said at least one organic solvent has a boiling point at atmospheric pressure above 25° C.4. The method as claimed in claim 1 , wherein said at least one organic solvent is selected from the group consisting of acetone claim 1 , ethyl acetate claim 1 , acetonitrile claim 1 , dimethylformamide claim 1 , dimethoxyethane claim 1 , dioxane claim 1 , triethylamine claim 1 , tetrahydrofuran claim 1 , dimethyl sulfoxide claim 1 , N claim 1 ,N-dimethylacetamide claim 1 , N-methyl-2-pyrrolidone claim 1 , N-ethyl-2-pyrrolidone claim 1 , and N-octylpyrrolidone.5. The method as claimed in claim 1 , wherein said at least one organic solvent is dimethyl sulfoxide.6. The method as claimed in claim 1 , wherein said at least one base is a mineral or organic base selected from the group consisting of alkali and alkaline-earth metal hydroxides claim 1 , alkali and alkaline-earth metal salts claim 1 , alkali and alkaline-earth metal hypochlorites claim ...

Caustic free low temperature ware wash detergent for reducing scale build-up

Caustic-free detergent compositions are provided. Detergent compositions including an aminocarboxylate, water conditioning agent, non-caustic source of alkalinity and water beneficially do not require the use of additional surfactants and/or polymers to provide suitable detergency and prevent scale build-up on treated surfaces. The detergent compositions are used with a sanitizer to employ the caustic-free detergent compositions are particularly suitable for use as low temperature ware wash detergents that beneficially reduce scale build-up. Methods of employing the caustic-free detergent compositions are also provided.

SOLID CONTROLLED RELEASE CAUSTIC DETERGENT COMPOSITIONS

Solid detergent compositions for dishwashing or warewashing compositions and applications of use are disclosed. In particular, solid caustic-based compositions that do not require a traditional dispenser for controlled rate of release over multiple cycles are disclosed. Compositions, methods of employ and cleaning using the same are disclosed. 1. A system for cleaning wares in an automatic dishwashing environment comprising:a solid controlled release composition comprising from about 20 wt-% to about 95 wt-% of a hydroxide alkalinity source, from about 0.01 wt-% to about 20 wt-% of at least one polysaccharide material having between about a 1 wt-% to about 2 wt-% aqueous solution viscosity at 25° C. of between about 1 cps and about 5000 cps, and a surfactant;wherein the solid composition is a homogenous 2-in-1 composition providing a detergent and rinse aid in a single solid composition, wherein the solid is a multi-use composition, and wherein the solid is not encapsulated with a delayed release chemistry; andwherein the system does not include a dispensing system.2. The system of claim 1 , wherein the solid controlled release composition is a pressed solid.3. The system of claim 1 , wherein the solid controlled release composition is a capsule claim 1 , tablet claim 1 , coated tablet claim 1 , puck claim 1 , brick or block.4. The system of claim 1 , wherein the solid controlled release composition is a pressed solid tablet or block.5. The system of claim 1 , wherein the automatic dishwashing environment is a consumer or commercial dish washing machine.6. The system of claim 1 , wherein the system further comprises a holder to hold the solid controlled release composition and wherein the holder is configured to be secured to a wash tub of a consumer or commercial dish washing machine.7. The system of claim 6 , wherein the solid controlled release composition is placed in the wash tub before the beginning of a wash cycle and is present in the wash tub for more than ...

GEL COMPOSITION FOR CLEANING PIPELINES AND PIPE-NETWORKS AND THE USE THEREOF

The invention relates to a gel composition comprising 0.6 to 2.5 weight percent of guar gum, 0.01 to 0.05 weight percent of boric acid, 0.003 to 0.007 weight percent of a base, 2.5 to 4.5 weight percent of a short carbon chain alcohol, optionally 0.01 to 0.5 weight percent of additives and the necessary amount of water to reach 100% weight. The invention covers a method for producing the gel composition and the use thereof. 1. A gel composition comprising 0.6 to 2.5 weight percent of guar gum , 0.01 to 0.05 weight percent of boric acid , 0.003 to 0.007 weight percent of a base , 2.5 to 4.5 weight percent of a short carbon chain alcohol , optionally 0.01 to 0.5 weight percent of additives and the necessary amount of water to reach 100% weight.2. The gel composition according to claim 1 , wherein the base is NaOH.3. The gel composition according to claim 1 , wherein the short carbon chain alcohol is ethanol.4. The gel composition according to in the form of a pushing gel comprising 1.9 to 2.1 weight percent of guar gum claim 1 , 0.03 to 0.035 weight percent of boric acid claim 1 , 0.0053 to 0.0055 weight percent of a base claim 1 , 3.6 to 3.8 weight percent of a short carbon chain alcohol and the necessary amount of water to reach 100% weight.5. The gel composition according to in the form of an intermediate gel comprising 1.32 to 1.37 weight percent of guar gum claim 1 , 0.03 to 0.033 weight percent of boric acid claim 1 , 0.0053 to 0.0055 weight percent of a base claim 1 , 3.6 to 3.8 weight percent of a short carbon chain alcohol claim 1 , optionally 0.01 to 0.5 weight percent of additives (such as hydrogen-peroxide) and the necessary amount of water to reach 100% weight.61. The gel composition according to in the form of a pick-up gel comprising 1.05 to 1. weight percent of guar gum claim 1 , 0.03 to 0.035 weight percent of boric acid claim 1 , 0.0053 to 0.0055 weight percent of a base claim 1 , 3.65 to 3.85 weight percent of a short carbon chain alcohol claim 1 , ...

CLEANING COMPOSITION AND METHOD OF MANUFACTURING METAL WIRING USING THE SAME

A cleaning composition includes about 0.01 to about 5 wt % of a chelating agent; about 0.01 to about 0.5 wt % of an organic acid; about 0.01 to about 1.0 wt % of an inorganic acid; about 0.01 to about 5 wt % of an alkali compound; and deionized water. 1. A cleaning composition comprising:about 0.01 to about 5 wt % of a chelating agent, wherein the chelating agent comprises an amino acid compound;about 0.01 to about 0.5 wt % of an organic acid;about 0.01 to about 1.0 wt % of an inorganic acid;about 0.01 to about 5 wt % of an alkali compound; anddeionized water.2. The cleaning composition according to claim 1 , wherein the amino acid compound comprises at least one of glycine claim 1 , ethylenediaminetetraacetic acid claim 1 , and cyclohexanediaminetetraacetic acid.3. The cleaning composition according to claim 1 , wherein the organic acid comprises at least one of lactic acid claim 1 , lactic acid alkyl ester claim 1 , acetic acid claim 1 , and acetic acid alkyl ester.4. The cleaning composition according to claim 1 , wherein the inorganic acid comprises at least one of hydrochloric acid claim 1 , phosphoric acid claim 1 , nitric acid claim 1 , sulfuric acid claim 1 , hydrofluoric acid claim 1 , bromic acid claim 1 , and iodic acid.5. The cleaning composition according to claim 1 , wherein the alkali compound comprises at least one of tetramethylammonium hydroxide claim 1 , tetrabutylammonium hydroxide claim 1 , tetraethylammonium hydroxide claim 1 , and trimethylammonium chloride.6. The cleaning composition according to claim 1 , wherein the cleaning composition has a pH of about 1 to about 6.7. The cleaning composition according to claim 1 , wherein the cleaning composition has a pH of about 8 to about 13.8. The cleaning composition according to claim 1 , further comprising about 0.01 to about 3 wt % of a corrosion inhibitor.9. The cleaning composition according to claim 8 , wherein the corrosion inhibitor comprises a benzene carboxylic acid-based material or a ...

NEW CLEANING MATERIAL

The invention provides a cleaning formulation comprising a multiplicity of solid cleaning particles, wherein the solid cleaning particles comprise polymeric particles and at least one cleaning agent, wherein the at least one cleaning agent is immobilised on the surface of the polymeric particles. Typically the at least one cleaning agent is immobilised on the surface of the polymeric particles by means of chemical bonds, typically ionic bonds, hydrogen bonds, covalent bonds, polar bonds, or bonds formed by virtue of unequal charge distributions between polymeric particles and immobilised materials. The invention also provides a method for the cleaning of a substrate, the method comprising the treatment of the substrate with a formulation according to the invention, and a method for the preparation of the cleaning formulation of the invention which comprises treating a multiplicity of polymeric particles with at least one cleaning agent. 150-. (canceled)51. A method for the cleaning of a substrate , said method comprising the treatment of the substrate with a cleaning formulation comprising a multiplicity of solid cleaning particles , wherein said solid cleaning particles comprise polymeric particles and at least one cleaning agent , wherein said at least one cleaning agent is immobilised on the surface of said polymeric particles.52. A method as claimed in wherein said method is performed in an aqueous environment in the presence of limited quantities of water claim 51 , optionally wherein water is added to the system so as to provide a water to substrate ratio which is between 2.5:1 and 0.1:1 w/w.53. A method as claimed in wherein said solid cleaning particles are added at a particle to substrate addition level of 0.1:1-30:1 by dry mass of substrate.54. A method as claimed in wherein said substrate comprises a textile fibre or wherein said substrate comprises plastics materials claim 51 , leather claim 51 , paper claim 51 , cardboard claim 51 , metal claim 51 , ...

METHOD FOR CLEANING OUTDOOR SURFACES

A method for cleaning an outdoor surface includes combining a first composition from a first vessel with a second composition from a second vessel. The first composition includes hydrogen peroxide and makes up 94-99.5% of the combination by weight. The second composition including at least one of a silicate, a carbonate, a bicarbonate and a percarbonate and makes up 0.5-6% of the combination by weight. The method further includes mixing the first composition with the second composition. The method further includes applying the combination to the outdoor surface within twenty four hours after mixing. The method further includes contacting the outdoor surface with the combination for at least five minutes. The method further includes rinsing the combination off of the outdoor surface. 1. A method for cleaning an outdoor surface , the method comprising:combining a first composition from a first vessel with a second composition from a second vessel, the first composition including hydrogen peroxide and making up 94-99.5% of the combination by weight, the second composition including at least one of a silicate, a carbonate, a bicarbonate and a percarbonate and making up 0.5-6% of the combination by weight; andapplying the combination to the outdoor surface within twenty four hours after combining.2. The method of claim 1 , wherein applying the combination to the outdoor surface includes applying the combination within two hours after combining.3. The method of claim 1 , further comprising claim 1 , prior to combining the first composition with the second composition claim 1 , selecting the at least one of silicate claim 1 , carbonate claim 1 , bicarbonate and percarbonate for the second composition based on properties of the outdoor surface to be cleaned.4. The method of claim 3 , wherein selecting the second composition includes selecting silicate when the outdoor surface to be cleaned is porous claim 3 , selecting at least one of carbonate claim 3 , percarbonate and ...

Stripping and Cleaning Compositions for Removal of Thick Film Resist

Stripping and cleaning compositions suitable for the removal of film resists include about 2-55% by weight of at least one alkanolamine or at least one morpholine or mixtures thereof; about 20-94% by weight of at least one organic solvent; and about 0.5-60% by weight water based on the total weight of the composition. 1. (canceled)2. (canceled)3. (canceled)4. The composition of comprising:about 2-8% by weight of said at least one alkanolamine or at least one morpholine or mixtures thereof;about 70-94% by weight of said at least one organic solvent; andabout 8-17% by weight said water;about 0.5-4% by weight of at least one hydroxide;and about 0.5-1.5% by weight of at least one corrosion inhibitor.5. The composition of comprising:about 2-5% by weight of said one or more alkanolamines or one or more morpholines or mixtures thereof;about 75-92% by weight of the one or more organic solvents;about 8-17% by weight water;and further comprising about 0.5-4% of said one or more hydroxides; andabout 0.5-1.5% by weight of one or more corrosion inhibitors based on the total weight of the composition.6. The composition of claim 29 , wherein the at least one alkanolamine comprises monoethanol amine claim 29 , N-methylethanolamine claim 29 , or triethanolamine.7. The composition of claim 29 , wherein the at least one organic solvent is selected from the group consisting of glycol ethers claim 29 , hydric alcohols or diols having 2 to 8 carbon atoms and benzyl alcohol.8. The composition of claim 29 , wherein the at least one organic solvent comprises tetrahydrofufuryl alcohol.9. The composition of claim 29 , where the at least one organic solvent is selected from the group consisting of propylene glycol mono phenyl ether claim 29 , tri(propylene glycol) mono butyl ether claim 29 , dipropylene glycol claim 29 , tri(propylene glycol) methyl ether and mixtures thereof.10. The composition of claim 29 , wherein the composition is free of dimethyl acetamide.11. The composition of claim 10 ...

Method for fabricating semiconductor device

A method for fabricating semiconductor device includes the steps of: providing a substrate having a NMOS region and a PMOS region; forming a pad oxide layer on the substrate, wherein the pad oxide layer comprises a first thickness; performing an implantation process to inject germanium (Ge) into the substrate on the PMOS region; performing a first cleaning process to reduce the first thickness of the pad oxide layer on the PMOS region to a second thickness; performing an anneal process; and performing a second cleaning process to remove the pad oxide layer.

Cleaning composition for removing organic material and method of forming semiconductor device using the composition

Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition includes 0.01-5 wt %.hydroxide based on a total weight of the cleaning composition and deionized water.

Cleaning Compositions

This disclosure relates to a cleaning composition that contains 1) hydroxylamine, 2) an amino alcohol, 3) hexylene glycol, and 4) water. 11) hydroxylamine in an amount of at most about 15% by weight of the composition;2) an aminoalcohol comprising at least two amino groups and at least one hydroxyl group, the aminoalcohol being in an amount of at most about 8% by weight of the composition;3) hexylene glycol in an amount of at most about 50% by weight of the composition; and4) water;wherein the pH of the composition is from about 8 to about 11.. A cleaning composition, comprising: The present application is a continuation of U.S. application Ser. No. 17/585,054, filed on Jan. 26, 2022, which is a continuation of U.S. application Ser. No. 16/923,535, filed on Jul. 8, 2020, now U.S. Pat. No. 11,279,903, which is a continuation of U.S. application Ser. No. 16/278,875, filed on Feb. 19, 2019, now U.S. Pat. No. 10,752,867, which claims priority to U.S. Provisional Application Ser. No. 62/649,029, filed on Mar. 28, 2018. The contents of the prior applications are hereby incorporated by reference in their entirety.The present disclosure relates to novel cleaning compositions for semiconductor substrates and methods of cleaning semiconductor substrates. More particularly, the present disclosure relates to cleaning compositions for semiconductor substrates after plasma etching of metal layers or dielectric material layers deposited on the substrates and the removal of residues left on the substrates after bulk resist removal via a plasma ashing process.In the manufacture of integrated circuit devices, photoresists are used as an intermediate mask for transferring the original mask pattern of a reticle onto the wafer substrate by means of a series of photolithography and plasma etching steps. One of the essential steps in the integrated circuit device manufacturing process is the removal of the patterned photoresist films from the wafer substrate. In general, this step is ...

Adhesive Acrylate-Olefin Copolymers, Methods for Producing Same and Compositions Utilizing Same

The present invention relates to an adhesive compositions, facestocks and/or packaging labels containing same, where such compositions, facestocks and/or labels are designed to facilitate the recyclability of a plastic article formed from any suitable polymer or mixture of polymers (e.g., a polyethylene terephthalate (PET), high density polyethylene (HDPE), polyvinyl chloride (PVC), low density polyethylene (LDPE), polypropylene (PP), polystyrene (PS), or others of all plastic types), or even glass bottles. In another embodiment, the present invention relates to a method for removing an adhesive composition, facestock and/or packaging label containing same, from a plastic article that is to be recycled. 1. A facestock/adhesive construction for a plastic , glass , cardboard , or metal article , the construction comprising:a face layer, wherein the face layer is formed from a facestock material selected from olefin polymer facestocks, polystyrene facestocks, or PET facestocks, the facestock having a shrink force; and 'wherein the adhesive retention force to the article is greater than the facestock shrink force in the presence of a caustic solution; and', 'an adhesive layer adhered to the article, the adhesive having a retention force to the article,'}wherein the adhesive layer comprises a homogeneous dispersion comprising an anionic/non-ionic emulsion pressure-sensitive copolymer latex of 2-ethylhexyl acrylate and other alkyl acrylates and styrene with at least one unsaturated carboxylic acid, including tackifiers comprising a mixture of hydrogenated rosin and tall oil esters, wherein other alkyl acrylates are selected from the group consisting of methyl acrylate, methyl methacrylate, and mixtures thereof.2. The facestock/adhesive construction of claim 1 , wherein the olefin polymer facestocks is selected from polyethylene facestocks or polypropylene facestocks.3. The facestock/adhesive construction of claim 1 , wherein the face layer is formed from a facestock ...

AGENT, LIQUID, AND METHOD FOR CLEANING REVERSE OSMOSIS MEMBRANE

Provided is a cleaning agent capable of preventing a reduction in the rejection rate of an RO membrane which may occur when the membrane is cleaned, the cleaning agent including a membrane protectant that is a basic or hydrophobic amino acid, a peptide containing the amino acid as a constituent amino acid, or a derivative of the amino acid or the peptide. The cleaning agent may further include at least one agent selected from the group consisting of an alkaline agent, a combined chlorine agent, and an oxidizing agent. The amino acid is preferably arginine, lysine, or phenylalanine. Also provided are a cleaning liquid that is an aqueous solution produced by diluting the cleaning agent and a method for cleaning a reverse osmosis membrane with the cleaning liquid. 1. An agent for cleaning a reverse osmosis membrane , the agent comprising a membrane protectant , the membrane protectant being a basic or hydrophobic amino acid , a peptide containing the amino acid as a constituent amino acid , or a derivative of the amino acid or the peptide.2. The agent for cleaning a reverse osmosis membrane according to claim 1 , wherein the amino acid is at least one amino acid selected from the group consisting of arginine claim 1 , lysine claim 1 , and phenylalanine.3. The agent for cleaning a reverse osmosis membrane according to claim 1 , the agent further comprising at least one selected from the group consisting of an alkaline agent claim 1 , a combined chlorine agent claim 1 , and an oxidizing agent.4. A liquid for cleaning a reverse osmosis membrane claim 1 , the liquid being an aqueous solution produced by diluting the agent for cleaning a reverse osmosis membrane according to .5. A liquid for cleaning a reverse osmosis membrane claim 1 , the liquid comprising a membrane protectant and at least one selected from the group consisting of an alkaline agent claim 1 , a combined chlorine agent claim 1 , and an oxidizing agent claim 1 , the membrane protectant being a basic or ...

ALKALINE DETERGENT COMPOSITION CONTAINING A CARBOXYLIC ACID TERPOLYMER FOR HARD WATER SCALE CONTROL

A highly alkaline detergent is described which includes the use of a carboxylic acid terpolymer in combination with an alkali metal hydroxide. The detergent maintains cleaning functions and also prevents hard water scaling at application temperatures, for example at temperatures of between about 145-180 degrees Fahrenheit and, for example, at a pH of 9.5 to about 13. 119-. (canceled)20: A method of dispensing a detergent composition comprising: at least 55 wt-% of alkali metal hydroxide; and', {'sub': 3', '8, 'claim-text': {'br': None, 'sub': 2', '2', 'x', 'y, 'sup': 1', '2', '3, 'HC═C(R)(CH)O[R—O]—R\u2003\u2003(I)'}, 'at least one carboxylic acid terpolymer comprising in copolymerized form from 30 to 90% by weight of at least one monoethylenically unsaturated C-C-carboxylic acid, or an anhydride or salt thereof, from 3 to 60% by weight of at least one monomer comprising a sulfo group, and from 3 to 20% by weight of at least one nonionic monomer of the formula I'}, {'sup': 1', '2', '2', '3, 'sub': 2', '6', '1', '4, 'in which Ris hydrogen or methyl, Rare identical or different, linear or branched C-C-alkylene wherein R—O may be arranged in blocks or randomly, and Ris hydrogen or a straight-chain or branched C-C-alkyl, x is 0, 1 or 2 and y is a number from 3 to 50; and'}, 'wherein the detergent composition is free of phosphate;, 'contacting a detergent composition with a water source to form a use solution, wherein the detergent composition comprises'}dispensing the use solution to an application; wherein the use solution reduces the formation, precipitation and/or deposition of hard water scale on a surface.21: The method of claim 20 , wherein the contacting is performed by spraying the water source.22: The method of claim 20 , wherein the detergent composition comprises from about 55 wt-% to about 90 wt-% of the alkali metal hydroxide claim 20 , and from about 10 wt-% to about 40 wt-% of the carboxylic acid terpolymer.23: The method of claim 20 , wherein the ...

Multiphase detergent tablet

The invention discloses a multiphase detergent tablet ( 1 ), comprising a first detergent phase with an alkali system with one or more components, of which at least one contact-unsuitable component comprises sodium hydroxide (caustic soda), and a second detergent phase to cover the first detergent phase, wherein the second detergent phase essentially contains no contact-unsuitable components, in particular no caustic, toxic or hygroscopic components, optionally also no irritant components, whereby the detergent tablet is constructed as a tablet with at least three layers, with a first layer ( 10 ) of the second detergent phase; a second middle layer ( 12 ) of the first detergent phase and a third layer ( 14 ) of the second detergent phase. The invention further describes a method of manufacturing such a multiphase detergent tablet ( 1 ) and its use to clean kitchen appliances, particularly in commercial kitchens.

Method for cleaning bonding interface before bonding

The present disclosure provides a method for cleaning a bonding interface before bonding. The method includes: providing a first surface and a second surface for bonding, the first surface being a non-crystal surface and the second surface being a crystal surface; and cleaning the first surface and the second surface with ammonia respectively before bonding, wherein at least one of parameters of an ammonia concentration and a cleaning temperature for cleaning the first surface is higher than a counterpart of parameters for cleaning the second surface.

TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

An object of the present invention is to provide a treatment liquid for a semiconductor device, which has excellent temporal stability of residue removing performance, and excellent anticorrosion performance for a treatment target. In addition, another object of the present invention is to provide a method for washing a substrate and a method for manufacturing a semiconductor device, each using the treatment liquid. 1. A treatment liquid for a semiconductor device , comprising:at least one hydroxylamine compound selected from the group consisting of a hydroxylamine and a hydroxylamine salt;at least one basic compound selected from the group consisting of an amine compound other than the hydroxylamine compound and a quaternary ammonium hydroxide salt; andat least one selected from the group consisting of a reducing agent other than the hydroxylamine compound and a chelating agent, andhaving a pH of 10 or more.2. The treatment liquid according to claim 1 ,which is used as a washing liquid for removing dry etching residues, a solution for removing a resist film used for the formation of a pattern, or a washing liquid for removing residues from a substrate after chemical mechanical polishing.3. The treatment liquid according to claim 1 ,which is used for a treatment to a metal layer of a substrate comprising the metal layer including Co or a Co alloy.4. The treatment liquid according to claim 1 , further comprising an organic solvent.5. The treatment liquid according to claim 4 ,wherein the content of the organic solvent is 45% by mass or more with respect to the total mass of the treatment liquid.6. The treatment liquid according to claim 4 , further comprising water claim 4 ,wherein with respect to the total mass of the treatment liquid, the content of water is 1% to 50% by mass, andthe content of the organic solvent is 45% to 98% by mass.7. The treatment liquid according to claim 1 ,wherein the content of the hydroxylamine compound is 3.5% by mass or more with ...

LIQUID COMPOSITION FOR CLEANING SEMICONDUCTOR DEVICE, AND METHOD FOR CLEANING SEMICONDUCTOR DEVICE

A liquid semiconductor device cleaning composition used in a process of fabricating a semiconductor integrated circuit, for removing a hard mask or a dry etch residue while suppressing damage to a low-dielectric-constant interlayer dielectric film and cobalt or a cobalt alloy, where the liquid semiconductor device cleaning composition contains hydrogen peroxide at 10-30% by mass, potassium hydroxide at 0.005-0.7% by mass, aminopolymethylene phosphonic acid at 0.00001-0.01% by mass, at least one selected from amines and azoles at 0.001-5% by mass and water. A semiconductor device can be cleaned by bringing the liquid cleaning composition into contact with the semiconductor device. 1. A liquid cleaning composition for removing a hard mask and a dry etch residue in a semiconductor device provided with a low-dielectric-constant interlayer dielectric film , the hard mask and cobalt or a cobalt alloy while suppressing damage to the low-dielectric-constant interlayer dielectric film and the cobalt or the cobalt alloy , the composition comprising hydrogen peroxide at 10-30% by mass , potassium hydroxide at 0.005-0.7% by mass , aminopolymethylene phosphonic acid at 0.00001-0.01% by mass , at least one selected from amines and azoles at 0.001-5% by mass , and water , wherein the amines are 1 ,2-propanediamine and/or 1 ,3-propanediamine.2. (canceled)3. The liquid cleaning composition according to claim 1 , wherein the azoles are one or more selected from the group consisting of 1-methylimidazole claim 1 , 1-vinylimidazole claim 1 , 2-phenylimidazole claim 1 , 2-ethyl-4-methylimidazole claim 1 , N-benzyl-2-methylimidazole claim 1 , 2-methylbenzimidazole claim 1 , pyrazole claim 1 , 4-methylpyrazole claim 1 , 3 claim 1 ,5-dimethylpyrazole claim 1 , 1 claim 1 ,2 claim 1 ,4-triazole claim 1 , 1H-benzotriazole claim 1 , 5-methyl-1H-benzotriazole and 1H-tetrazole.4. The liquid cleaning composition according to claim 1 , wherein the aminopolymethylene phosphonic acid is one or more ...

Foaming drain cleaner

A drain cleaner may be used on a periodic basis to clean soil residues from residential and commercial waste drains. The drain cleaner may chemically self-foam to fill a waste drain with the foam. For example, the drain cleaner may be provided in two or more parts that are physically intermixed during use of the drain cleaner. One part may include hydrogen peroxide and water while another part may include a catalase, an amylase, a protease, and an enzyme stabilizer. The drain cleaner may also include a surfactant present in at least one of the first part and the second part. Additionally, in some examples, the drain cleaner includes a sanitizing agent present in either of the two parts or in yet a third physically separate part. During use, the different drain cleaner parts can be dispensed simultaneously into a drain to generate a cleaning and/or sanitizing foam in-situ.

AQUEOUS CLEANING SOLUTION AND METHOD OF PROTECTING FEATURES ON A SUBSTRATE DURING ETCH RESIDUE REMOVAL

An alkaline wet solution for protecting features on a patterned substrate and a substrate processing method using the alkaline wet solution are described. The method includes providing a patterned substrate containing a low-k material, a metal oxide feature, and an etch residue, performing a treatment process that exposes the patterned substrate to an alkaline wet solution that forms a protective coating on the metal oxide feature, the alkaline wet solution containing a mixture of 1) water, 2) ammonium hydroxide, a quaternary organic ammonium hydroxide, or a quaternary organic phosphonium hydroxide, and 3) dissolved silica, and performing a wet cleaning process that removes the etch residue but not the metal oxide feature that is protected by the protective coating. The patterned substrate can further include a metallization layer and the alkaline wet solution can further contain 4) an inhibitor that protects the metallization layer from etching by the alkaline wet solution. 1. A substrate processing method , comprising:providing a patterned substrate containing a low-k material, a metal oxide feature, and an etch residue;performing a treatment process that exposes the patterned substrate to an alkaline wet solution that forms a protective coating on the metal oxide feature, the alkaline wet solution containing a mixture of 1) water, 2) ammonium hydroxide, a quaternary organic ammonium hydroxide, or a quaternary organic phosphonium hydroxide, and 3) dissolved silica; andperforming a wet cleaning process that removes the etch residue but not the metal oxide feature that is protected by the protective coating.2. The method of claim 1 , wherein the metal oxide feature includes aluminum oxide (AlO) claim 1 , hafnium oxide (HfO) claim 1 , zirconium oxide (ZrO) claim 1 , or titanium oxide (TiO).3. The method of claim 1 , wherein the patterned substrate further contains a metal-containing etch hardmask layer on the low-k material claim 1 , wherein at least a portion of the ...

PROCESS FOR FORMING A DESCALING COMPOSITION

A process for forming a descaling composition has the steps of macerating a bone meal with a dimethylamine solution, digesting the macerated bone meal with hydrochloric acid, neutralizing the digested bone meal with calcium oxide, treating the neutralized bone meal with sulfuric acid, and applying a refluxing treatment with dimethylamine and hydrazine hydrate. The process further includes removing the macerated bone meal solids from the dimethylamine solution and transferring the removed solids to an extraction tower prior to the step of digesting. The hydrochloric acid is circulated through the macerated bone meal. The treated bone meal and the sulfuric acid is filtered so as to produce a liquid phase and a solids phase. The liquid phase contains a phosphate amine. The dimethylamine and hydrazine hydrate are added to the liquid phase. 1. A process for forming a descaling composition , the process comprising:macerating a bone with a dimethylamine solution;digesting the macerated bone meal with hydrochloric acid;neutralizing the digested bone meal with calcium oxide;treating the neutralized bone meal with sulfuric acid; andapplying a refluxing treatment with dimethylamine and hydrazine hydrate.2. The process of claim 1 , the step of macerating comprising:adding the bone meal to the dimethylamine solution.3. The process of claim 2 , the dimethylamine solution being of a 10% concentration claim 2 , the step of macerating being for a period of eight hours.4. The process of claim 1 , further comprising:removing the macerated bone meal solids from the dimethylamine solution; andtransferring removed macerated bone meal solids to an extraction tower prior to the step of digesting.5. The process of claim 1 , the step of digesting comprising:circulating the hydrochloric acid through the macerated bone meal.6. The process of claim 5 , the step of circulating being for a period of time of eight hours at room temperature.7. The process of claim 6 , the step of digesting further ...

CLEANING LIQUID FOR SEMICONDUCTOR ELEMENTS AND CLEANING METHOD USING SAME

By cleaning with use of a cleaning liquid that contains 10-30% by mass of hydrogen peroxide, 0.005-10% by mass of a quaternary ammonium hydroxide, 0.005-5% by mass of potassium hydroxide, 0.000005-0.005% by mass of an amino polymethylene phosphonic acid and water, a hard mask, an organosiloxane-based thin film, dry etching residue and a photoresist can be removed without corroding a low-dielectric-constant interlayer dielectric film, a wiring material such as copper or an copper alloy, a barrier metal and a barrier dielectric film. According to preferred embodiments of the present invention, damage to copper wiring lines is suppressed even in cases where an acid is added into the cleaning liquid and significant decomposition of hydrogen peroxide is not caused even in cases where titanium is added into the cleaning liquid. 1. A cleaning liquid ,comprising 10 to 30% by mass of hydrogen peroxide, 0.005 to 10% by mass of a quaternary ammonium hydroxide, 0.005 to 5% by mass of potassium hydroxide, 0.000005 to 0.005% by mass of an amino polymethylene phosphonic acid and water.2. (canceled)3. The cleaning liquid according to claim 1 , wherein the quaternary ammonium hydroxide is at least one selected from the group consisting of tetramethylammonium hydroxide claim 1 , tetraethylammonium hydroxide claim 1 , tetrapropylammonium hydroxide claim 1 , tetrabutylammonium hydroxide and benzyltrimethylammonium hydroxide.4. The cleaning liquid according to claim 1 , wherein the amino polymethylene phosphonic acid is at least one selected from the group consisting of amino tri(methylene phosphonic acid) claim 1 , ethylenediamine tetra(methylene phosphonic acid) claim 1 , diethylenetriamine penta(methylene phosphonic acid) and 1 claim 1 ,2-propylenediamine tetra(methylene phosphonic acid).5. The cleaning liquid according to claim 1 , wherein the sodium concentration is 0.1 ppm or less.6. A method for cleaning a semiconductor element by removing a hard mask claim 1 , an organosiloxane- ...

PROTECTIVE COATINGS FOR DETERSIVE AGENTS AND METHODS OF FORMING AND DETECTING SAME

A method of creating a protective coating on an alkali metal hydroxide-containing solid is provided. The method includes providing carbon dioxide to an alkali metal hydroxide-containing solid and allowing the alkali metal hydroxide and carbon dioxide to react thereby forming a carbonate or bicarbonate-containing layer on the exterior of the solid wherein the carbonate or bicarbonate-containing layer is non-hygroscopic and water soluble, and wherein greater than 80% of the hydroxide in the hydroxide-containing solid does not react with the carbon dioxide, and further wherein the alkali metal hydroxide-containing solid is substantially free of lithium hydroxide. A method of testing for the presence of carbonate-containing coating on an alkali metal hydroxide containing solid is also provided. The method includes exposing the coated solid to 95 weight percent ethanol, collecting the ethanol effluent and testing the effluent for alkali metal hydroxide. A suitably coated solid does not have dissolved alkali metal hydroxide in the ethanol effluent or is substantially free of alkali metal hydroxide. 119-. (canceled)20. A method of making a protective coating on an alkali metal hydroxide-containing powder , comprising:exposing alkali metal hydroxide particles to a carbon dioxide atmosphere comprising at least 60% carbon dioxide to form coated alkali metal hydroxide particles, wherein the alkali metal hydroxide particles are coated with a carbonate or bicarbonate; andpreparing a detergent composition comprising at least 15 wt-% coated alkali metal hydroxide particles.21. The method of claim 20 , wherein the alkali metal hydroxide is sodium hydroxide claim 20 , potassium hydroxide claim 20 , or a combination thereof.22. The method of claim 20 , further comprising forming the detergent composition into a solid block.23. The method of claim 22 , wherein the solid block is a multiple-use solid having a weight of between about 1 and 50 kilograms.24. The method of claim 20 , ...

COMPOUND OF BIODEGRADABLE SURFACTANTS FOR SEPARATING IMPURITIES IN A HYDROCARBON

Compounds of biodegradable surfactants useful for optimizing the separation of impurities typical of hydrocarbons, and designed to intervene and stabilize the molecular structure of crude oil, with no significant alterations of the crude's intrinsic composition are disclosed. The biodegradable surfactants compounds coexist with a non-ionic surfactant and an organic mix in emulsion form with the purpose of isolating crude from the pipeline, reduce friction to improve crude flow and to enter the crude macromolecule to modify the hydrocarbon chain to reduce its density and thus its viscosity; including compounds of biodegradable surfactants that comprise sodium hydroxide 1N, potassium chloride, sulphonic acid, dodecanoic acid, nonylphenol, terpene-1 and water, preferably hard water. 1. A compound of biodegradable surfactants comprising sodium hydroxide 1N , potassium chloride , sulphonic acid , dodecanoic acid , nonylphenol , terpene-1 and water , preferably hard water.2. The compound of biodegradable surfactants of claim 1 , further comprising 60-80% v/v of a mix that comprises 2.5-5.5% v/v of sodium hydroxide 1N claim 1 , 2-4% v/v of potassium chloride claim 1 , 5-15% v/v of sulphonic acid claim 1 , 3-6% v/v of dodecanoic acid claim 1 , 3-8% v/v of nonylphenol of 4-10 mols and hard water claim 1 , and 20-40% v/v terpene.3. The compound of biodegradable surfactants of claim 1 , further comprising one or more components selected from the group consisting of 8-14% urea claim 1 , 3-8% sodium tripolyphosphate claim 1 , 2-6% sodium sulphate claim 1 , 3-6% liquid Genapol claim 1 , and 1-4% of a quaternary salt.4. The compound of biodegradable surfactants of claim 1 , wherein it can be applied both at the reservoir and at the surface.5. A procedure for producing the compound of biodegradable surfactants of claim 1 , comprising following steps:in a clean and dry mixer add an amount of hard water less than 50% v/v in respect of the total volume of the compound of the invention ...

COMPOSITIONS AND METHODS FOR POST-CMP CLEANING OF COBALT SUBSTRATES

A cleaning composition is disclosed for cleaning residue and/or contaminants from microelectronic devices having same thereon. The composition comprises at least one complexing agent, at least one cleaning additive, at least one pH adjusting agent, water, and at least one oxylamine compound. Advantageously, the compositions show effective cleaning of cobalt-containing substrates and improved cobalt compatibility. 1. A cleaning composition for cleaning residue and contaminants from microelectronic devices having same thereon , the cleaning composition comprising at least one complexing agent , at least one cleaning additive , at least one pH adjusting agent , water , and at least one oxylamine compound or salt thereof.2. The cleaning composition of claim 1 , wherein the complexing agent comprises a species selected from the group consisting of aminoethylethanolamine claim 1 , N-methylaminoethanol claim 1 , aminoethoxyethanol claim 1 , dimethylaminoethoxyethanol claim 1 , diethanolamine claim 1 , N-methyldiethanolamine claim 1 , monoethanolamine (MEA) claim 1 , triethanolamine (TEA) claim 1 , isopropanolamine claim 1 , diisopropanolamine claim 1 , aminopropyldiethanolamine claim 1 , N claim 1 ,N-dimethylpropanolamine claim 1 , N-methylpropanolamine claim 1 , 1-amino-2-propanol claim 1 , 2-amino-1-butanol claim 1 , isobutanolamine claim 1 , triethylenediamine claim 1 , 4-(2-hydroxyethyl)morpholine (HEM) claim 1 , 1 claim 1 ,2-cyclohexanediamine-N claim 1 ,N claim 1 ,N′ claim 1 ,N′-tetraacetic acid (CDTA) claim 1 , ethylenediaminetetraacetic acid (EDTA) claim 1 , m-xylenediamine (MXDA) claim 1 , iminodiacetic acid (IDA) claim 1 , 2-(hydroxyethyl)iminodiacetic acid (HIDA) claim 1 , nitrilotriacetic acid claim 1 , thiourea claim 1 , 1 claim 1 ,1 claim 1 ,3 claim 1 ,3-tetramethylurea claim 1 , urea claim 1 , urea derivatives claim 1 , uric acid claim 1 , alanine claim 1 , arginine claim 1 , asparagine claim 1 , aspartic acid claim 1 , cysteine claim 1 , glutamic acid claim ...

Metal-Safe Solid Form Aqueous-Based Compositions and Methods To Remove Polymeric Materials in Electronics Manufacturing

Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates, are provided. A method is presented which uses a minimum amount of solid form concentrate that is diluted into water, introduced into a manufacturing tool and heated, applied to said substrate for a sufficient time to allow penetration and removal of an organic substance, and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive variety most commonly used in the manufacture of a flat panel display (FPD) and other electronic substrates.

ON LINE CHEMICAL CLEANING OF AIR COOLERS

This invention relates to cleaning of deposits or scale or fouling from external surface of air coolers tubes bundle. 1. A waterless mixture for cleaning deposits , said mixture comprising sodium carbonate and sodium bicarbonate.2. A mixture according to claim 1 , comprising 80% sodium bicarbonate and 20% sodium carbonate.3. The mixture of claim 1 , further comprising sodium hydroxide.4. The mixture of claim 1 , further comprising silicon dioxide.5. The mixture of comprising up to 20% silicon dioxide.6. The mixture according to comprising 60% Sodium Carbonate claim 3 , 20% sodium hydroxide claim 3 , and 20% sodium bicarbonate.7. A mixture according to comprising 40% Sodium Carbonate claim 4 , 40% Sodium Bicarbonate and 20% of silicon dioxide.8. The mixture of claim 1 , wherein said mixture particle size is less than 200 μm.9. The mixture of claim 8 , wherein said particle size is 10-100 μm.10. A method for cleaning deposits claim 1 , said method comprising creating a chemical reaction by combining said mixture of with said deposits.11. The method of claim 10 , wherein said deposits comprise microorganisms.12. The method according to claim 10 , wherein said chemical reaction comprises reacting of chemicals with an organic matter.13. The method according to claim 10 , further comprising mechanical cleaning.14. The method of claim 10 , wherein said deposits are inside a heat exchanger.15. The method of claim 10 , wherein said method comprises spraying said mixture.16. The method of claim 15 , wherein said spraying is spot or area.17. The method of claim 10 , wherein said mixture comprises particle size of less than 200 μm.18. The method of claim 10 , wherein said mixture comprises particle size of 10-100 μm.19. A system for cleaning deposits or fouling by spraying a waterless mixture according to claim 1 , wherein said system comprises a sprayer and a lance connected with said sprayer.20. The system of claim 19 , wherein said sprayer comprises a tip claim 19 , wherein ...

SUPPORT MATERIAL FORMULATION AND ADDITIVE MANUFACTURING PROCESSES EMPLOYING SAME

Novel support material formulations, characterized as providing a cured support material with improved dissolution rate, while maintaining sufficient mechanical strength, are disclosed. The formulations comprise a water-miscible non-curable polymer, a first water-miscible, curable material and a second, water-miscible material that is selected capable of interfering with intermolecular interactions between polymeric chains formed upon exposing the first water-miscible material to curing energy. Methods of fabricating a three-dimensional object, and a three-dimensional object fabricated thereby are also disclosed. 1. A support material formulation comprising:a non-curable water-miscible polymer;a first water-miscible, curable material; andat least one second water-miscible curable material,wherein said second curable material is selected capable of interfering with intermolecular interactions between polymeric chains formed upon exposing the first water-miscible curable material to curing energy,said second curable material featuring at least two hydrogen bond-forming chemical moieties and is capable of forming hydrogen bonds with said polymeric chains.2. (canceled)3. The formulation of claim 1 , wherein said first curable material comprises a mixture of a mono-functional curable material and a multi-functional curable material.4. The formulation of claim 3 , wherein said second curable material is capable of interfering with a chemical cross-linking between said polymeric chains claim 3 , or of reducing a degree of said chemical cross-linking claim 3 , said chemical cross-linking being imparted by said multi-functional curable material.57-. (canceled)8. The formulation of claim 1 , wherein each of said at least two hydrogen bond-forming chemical moieties independently comprises at least one atom selected from oxygen and nitrogen.9. The formulation of claim 1 , wherein each of said at least two hydrogen bond-forming chemical moieties is independently selected from ...

SEMICONDUCTOR ELEMENT CLEANING SOLUTION THAT SUPPRESSES DAMAGE TO TANTALUM-CONTAINING MATERIALS, AND CLEANING METHOD USING SAME

According to the present invention, it is possible to provide a cleaning method for removing a photoresist and dry etching residue on a surface of a semiconductor element having a low-k film and a material that contains 10 atom % or more of tantalum, wherein the cleaning method is characterized by using a cleaning solution that contains 0.002-50 mass % of hydrogen peroxide, 0.001-1 mass % of an alkaline earth metal compound, an alkali, and water. 1. A cleaning method for removing a photoresist and dry etching residue on a surface of a semiconductor element having a low-k film and a material that contains 10 atomic % or more of tantalum , said cleaning method comprising contacting a semiconductor element with a cleaning solution comprising 0.002 to 50% by mass of hydrogen peroxide , 0.001 to 1% by mass of an alkaline earth metal compound , an alkali , and water.2. The cleaning method according to claim 1 , wherein a pH value of the cleaning solution is 7 to 14.3. The cleaning method according to claim 1 , wherein the material that contains 10 atomic % or more of tantalum is at least one substance selected from the group consisting of tantalum oxide claim 1 , tantalum nitride and tantalum.4. The cleaning method according to claim 1 , wherein the alkaline earth metal compound is at least one selected from the group consisting of a calcium compound claim 1 , a strontium compound and a barium compound.5. The cleaning method according to claim 1 , wherein a content of the alkali is 0.1 to 20% by mass.6. The cleaning method according to claim 1 , wherein the alkali is at least one selected from the group consisting of potassium hydroxide claim 1 , potassium acetate claim 1 , potassium carbonate claim 1 , potassium phosphate claim 1 , ammonia claim 1 , tetramethylammonium hydroxide claim 1 , triethylamine claim 1 , ethanolamine and 1-amino-2-propanol.7. A cleaning solution which removes a photoresist and dry etching residue on a surface of a semiconductor element having a ...

REMOVING RESIN COATINGS FROM SURFACES

Methods and compositions are provided for removing a residue of resin from the surface of equipment. In one embodiment, the methods comprise: providing a cleaning solution comprising a pH-adjusting agent, a chemical solvent, and water, wherein the chemical solvent is selected from the group consisting of β-lactam, γ-lactam, δ-lactam, ε-lactam, 2-pyrrolidone, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone (DMI), caprolactam, cyclohexanone, cyclopentanone, β-butyrolactone, γ-butyrolactone, δ-decalactone, γ-valerolactone, ε-caprolactone, butylene carbonate, propylene carbonate, and ethylene carbonate, any combination thereof, and any derivative thereof; allowing the cleaning solution to contact a surface at least partially coated with a layer of resin; and allowing the cleaning solution to at least partially dissolve the resin. 1. A method comprising:providing a cleaning solution comprising a pH-adjusting agent, a chemical solvent, and water, wherein the chemical solvent is selected from the group consisting of β-lactam, γ-lactam, δ-lactam, ε-lactam, 2-pyrrolidone, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone (DMI), caprolactam, cyclohexanone, cyclopentanone, β-butyrolactone, γ-butyrolactone, δ-decalactone, γ-valerolactone, ε-caprolactone, butylene carbonate, propylene carbonate, and ethylene carbonate, any combination thereof, and any derivative thereof;allowing the cleaning solution to contact a surface wherein a layer of resin resides on at least part of the surface; andallowing the cleaning solution to at least partially dissolve the resin.2. The method of wherein the resin is at least partially uncured.3. The method of wherein the resin is at least partially cured.4. The method of wherein the chemical solvent is present in an amount of from about 5% to about 25% by volume.5. The method of wherein the chemical solvent comprises γ-butyrolactone.6. The method of wherein the pH-adjusting agent is present in an amount of from about 1% to about 5% by volume. ...

SEMICONDUCTOR ELEMENT CLEANING SOLUTION THAT SUPPRESSES DAMAGE TO COBALT, AND METHOD FOR CLEANING SEMICONDUCTOR ELEMENT USING SAME

According to the present invention, it is possible to provide a cleaning solution which removes a dry etching residue on a surface of a semiconductor element that includes: (1) a material containing cobalt or a cobalt alloy or (2) a material containing cobalt or a cobalt alloy and tungsten; and a low-dielectric constant interlayer dielectric film. The cleaning solution contains 0.001-7 mass % of an alkali metal compound, 0.005-35 mass % of a peroxide, 0.005-10 mass % of an anti-corrosion agent, 0.000001-1 mass % of an alkaline earth metal compound, and water. 1. A cleaning solution , comprising:0.001 to 7% by mass of an alkali metal compound;0.005 to 35% by mass of a peroxide;0.005 to 10% by mass of an anticorrosive;0.000001 to 1% by mass of an alkaline earth metal compound; and water.2. The cleaning solution according to claim 1 , wherein the alkali metal compound is at least one substance selected from the group consisting of lithium hydroxide claim 1 , lithium sulfate claim 1 , lithium carbonate claim 1 , lithium hydrogen carbonate claim 1 , lithium nitrate claim 1 , lithium fluoride claim 1 , lithium chloride claim 1 , lithium bromide claim 1 , lithium iodide claim 1 , lithium acetate claim 1 , sodium hydroxide claim 1 , sodium sulfate claim 1 , sodium carbonate claim 1 , sodium hydrogen carbonate claim 1 , sodium nitrate claim 1 , sodium fluoride claim 1 , sodium chloride claim 1 , sodium bromide claim 1 , sodium iodide claim 1 , sodium acetate claim 1 , potassium hydroxide claim 1 , potassium sulfate claim 1 , potassium carbonate claim 1 , potassium hydrogen carbonate claim 1 , potassium nitrate claim 1 , potassium fluoride claim 1 , potassium chloride claim 1 , potassium bromide claim 1 , potassium iodide claim 1 , potassium acetate claim 1 , cesium hydroxide claim 1 , cesium sulfate claim 1 , cesium carbonate claim 1 , cesium hydrogen carbonate claim 1 , cesium nitrate claim 1 , cesium fluoride claim 1 , cesium chloride claim 1 , cesium bromide claim 1 , ...

Hydrogen supply material and production therefor, and hydrogen supply method

A layered solid formulation ( 100 a ) as one hydrogen supply material ( 200 ) according to the present invention includes silicon fine particles having a capability of generating hydrogen and aggregates of the silicon fine particles, and a physiologically acceptable medium ( 90 b ) that gets contact with the silicon fine particles or the aggregates thereof. The hydrogen supply material ( 200 ) is a hydrogen supply material for bringing the hydrogen into contact with the skin and/or the mucous membrane through the medium ( 90 b ).

PHOSPHORUS FREE LOW TEMPERATURE WARE WASH DETERGENT FOR REDUCING SCALE BUILD-UP

Phosphorus-free detergent compositions are provided. Detergent compositions including an aminocarboxylate, water conditioning agent, source of alkalinity and water beneficially do not require the use of additional surfactants and/or polymers to provide suitable detergency and prevent scale build-up on treated surfaces. The detergent compositions are used with a sanitizer to employ the phosphorus-free detergent compositions for use as low temperature ware wash detergents that beneficially reduce scale build-up. Methods of employing the phosphorus-free detergent compositions are also provided. 1: A method of cleaning using a phosphorus-free ware wash detergent comprising:washing a surface with a detergent wash solution comprising a phosphorus-free alkaline detergent comprising from about 1 ppm to about 250 ppm aminocarboxylate, from about 1 ppm to about 250 ppm water conditioning polymer, from about 10 ppm to about 500 ppm alkalinity source, and water, wherein the composition is phosphorus-free, does not contain surfactants and reduces or eliminates scale build-up on said surfaces;employing a sanitizer with the detergent wash solution or a sanitizer formulated in the phosphorus-free alkaline detergent;employing a rinse aid;wherein the temperature of the detergent wash solution in the washing step is not heated above about 140° F., andwherein the detergent wash solution contains sufficient use levels of the aminocarboxylate to prevent the formation of precipitates in hard water sources.2: The method of claim 1 , wherein the method further comprises rinsing said surface with an initial rinse solution prior to washing with said detergent wash solution.3: The method of claim 1 , wherein the aminocarboxylate is methylglycinediacetic acid or a sodium salt of the methylglycinediacetic acid.4: The method of claim 1 , wherein the temperature of the detergent wash solution in the washing step is not heated above about 130° F.5: The method of claim 1 , further comprising rinsing ...

NON-AMINE POST-CMP COMPOSITION AND METHOD OF USE

A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of amine and ammonium-containing compounds, e.g., quaternary ammonium bases. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material. 116.-. (canceled)17. A method of removing post-chemical mechanical polishing (post-CMP) residue and contaminants from a microelectronic device having said post-CMP residue and contaminants thereon , said method comprising contacting the microelectronic device with a cleaning composition for sufficient time to at least partially clean said post-CMP residue and contaminants from the microelectronic device , wherein the cleaning composition includes at least one basic salt; at least one organic solvent; at least one chelating agent; and water , wherein the cleaning composition is substantially devoid of amine and ammonium-containing salts.18. (canceled)19. The method of claim 17 , wherein said contacting comprises conditions selected from the group consisting of: time of from about 15 seconds to about 5 minutes; temperature in a range of from about 20° C. to about 50° C.; and combinations thereof.20. The method of claim 17 , further comprising diluting the cleaning composition with solvent at or before a point of use.21. The method of claim 17 , wherein the at least one basic salt comprises a species selected from the group consisting of cesium hydroxide claim 17 , rubidium hydroxide claim 17 , potassium hydroxide claim 17 , and combinations thereof.22. The method of claim 17 , wherein the at least one basic salt comprises cesium hydroxide.23. The method of claim 17 , wherein the at least one basic salt comprises a species ...

LABEL REMOVAL SOLUTION FOR LOW TEMPERATURE AND LOW ALKALINE CONDITIONS

According to the invention, the compositions and methods provide for the complete removal of synthetic glues or adhesives from a plurality of surfaces through the use of amide solvents in combination with surfactants, chelants, acidulants and/or additional bottle wash additives. Beneficially, the compositions and methods are suitable for use at lower temperatures, including below 35° C., and lower pH conditions, including from 5 to 10, from 6 to 9, and from 6 to 8, in comparison to conventional caustic-based adhesive removal compositions. 1. A method for removing labels containing adhesive material from a surface comprising:applying a cleaning composition to a surface in need of removal of an adhesive material affixing a label to a surface; andremoving said adhesive material from the surface within a period of time less than about 10 minutes;wherein the cleaning composition comprises an aqueous or non-aqueous saturated or unsaturated amide solvent, a chelant, a surfactant, and less than about 25 wt-% sodium hydroxide (caustic), wherein the amide solvent replaces at least a portion of a caustic solution, andwherein the temperature of the cleaning composition is below about 50° C. and the pH conditions of the cleaning composition is below about 10.2. The method of wherein the cleaning composition has a pH of at least about 6 and less than 9 claim 1 , and the amide solvent has a RE(O)xNR′functional group claim 1 , wherein R and/or R′ is H or an organic group claim 1 , n is at least 1 claim 1 , E is C claim 1 , S claim 1 , or P claim 1 , and x is at least 1.3. The method of wherein the cleaning composition completely replaces the caustic solution.4. The method of wherein the cleaning composition is at a temperature below about 35° C. claim 1 , pH between about 6 and 8 claim 1 , wherein the adhesive material remains on the label intact claim 1 , and removes said adhesive material within a period of time less than about 5 minutes.5. The method of wherein the amide solvent ...

Cleaning Method and Laminate of Aluminum Nitride Single-Crystal Substrate

A method for effectively removing minute impurities of 1 μm or less in size that are present on a surface of an aluminum nitride single-crystal substrate without etching the surface includes scrubbing a surface of an aluminum nitride single-crystal substrate using a polymer compound material having lower hardness than an aluminum nitride single crystal, and an alkali aqueous solution having 0.01-1 mass % concentration of potassium hydroxide or sodium hydroxide, the alkali aqueous solution being absorbed in the polymer compound material. 1. A cleaning method of an aluminum nitride single crystal substrate , comprising:a scrub cleaning step wherein a surface of the aluminum nitride single crystal substrate is scrubbed by moving a polymer compound material in a parallel direction of the surface of said substrate while said polymer compound material contacts the surface of said substrate, andwherein said polymer compound material has a lower hardness than the aluminum nitride single crystal and absorbed with an alkaline aqueous solution having concentration of 0.01 to 1 wt % of an alkaline which is selected from the group consisting of potassium hydroxide and sodium hydroxide.2. The method as set forth in claim 1 , wherein said alkaline aqueous solution includes citric acid in said scrub cleaning step.3. The method as set forth in claim 1 , wherein said polymer compound material in said scrub cleaning step comprises a melamine foam resin claim 1 , a porous polyvinyl alcohol resin claim 1 , a fibrous polyester resin claim 1 , or a nylon resin.4. The method as set forth in claim 1 , wherein a surface of said aluminum nitride single crystal substrate is polished by a chemical mechanical polishing method using colloidal silica.5. A production method of a laminated body claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'removing an oxide film of a surface of the substrate by immersing the aluminum nitride single crystal substrate cleaned by the cleaning ...

Odor Free Laundry Detergent Soap

An odor free detergent soap includes Diatomaceous Earth, Olive oil, Borax, Coconut oil, Palm oil, Shea butter, Sodium Hydroxide, Water, Sodium Bicarbonate, Carbon Dioxide and preparation method thereof. Further, the odor free detergent soap is bio-degradable and non-toxic insect killer. The food grade diatomaceous earth is used because it would not harm to the skin and also would not harm to the pet. The odor free laundry detergent soap is good for the washing clothes of people having sensitive skin. 1. An odor free detergent soap suitable for a laundry purpose , comprising predetermined amounts of diatomaceous earth , olive oil , borax , coconut oil , palm oil , shea butter , sodium hydroxide , water , sodium bicarbonate , and carbon dioxide.2. The odor free detergent soap of claim 1 , comprising 2 cups of diatomaceous earth per 5 gallons of water claim 1 , 18.5 ounces of olive oil claim 1 , 12.5 ounces of coconut oil claim 1 , 9 ounces palm oil claim 1 , 1 ounce of shea butter claim 1 , 5.8 ounces of sodium hydroxide claim 1 , and 13.5 ounces of water.3. The odor free detergent soap of claim 1 , wherein said diatomaceous earth includes particles having a particle size in a range between about 3 μm to more than 1 mm.4. The odor free detergent soap of claim 1 , wherein said diatomaceous earth includes particles having a particle size in a range between about 10 μm to about 200 μm.5. The odor free detergent soap of claim 4 , wherein the borax is taken from a group consisting of sodium borate claim 4 , sodium tetraborate claim 4 , and disodium tetraborate.6. The odor free detergent soap of claim 1 , wherein said sodium bicarbonate claim 1 , when heated becomes a washing soda consisting of sodium carbonate and carbon dioxide and water.7. The odor free detergent soap of claim 6 , wherein said sodium carbonate is a detergent having an alkaline pH.8. The odor free detergent soap as in claim 1 , comprising an aqueous solution having insect killing properties.9. An odor ...

CLEANING SOLUTION OBTAINED BY RECYCLING A SPENT SOLUTION

A cleaning solution obtained from an aqueous solution of alkaline or acid pH which has undergone at least two cleaning and recycling cycles. Each cleaning and recycling cycle includes the successive steps of heating a solution of alkaline or acid pH to a temperature above 50° C., completely cleaning the pipework of equipment fouled with organic deposits using the heated solution, and bringing the solution obtained after the cleaning steps into contact with a clay of at least one of the families selected from smectites, sepiolites, vermiculites and illites. At least one one anionic or cationic flocculating agent is added, followed by precipitation and separation to recover said aqueous solution. 110-. (canceled)11. A cleaning solution obtained from an aqueous solution of alkaline or acid pH which has undergone at least two cleaning and recycling cycles , each cleaning and recycling cycle comprising the successive steps of:heating the aqueous solution of alkaline or acid pH to a temperature above 50° C.;cleaning a pipework of equipment fouled with organic deposits using the heated solution;bringing the solution obtained after the cleaning step into contact with a clay of at least one of the families selected from smectites, sepiolites, vermiculites and illites; andadding at least one anionic or cationic flocculating agent, followed by precipitation and separation to recover the aqueous solution.12. The cleaning solution as claimed in claim 11 , wherein a concentration of the clay is 1 to 5 kg/mof solution to be regenerated claim 11 ,13. The cleaning solution as claimed in claim 12 , wherein the concentration of the clay is 2.5 to 3.5 kg/m claim 12 , and a concentration of a flocculant is 1 to 40 g/m.14. The cleaning solution as claimed in claim 11 , wherein the aqueous solution has undergone at least five cleaning and recycling cycles.15. The cleaning solution as claimed in claim 11 , wherein the aqueous solution has undergone at least twenty cleaning and recycling ...

Methods for making encapsulate-containing product compositions

Methods relating to making product compositions that include encapsulates, borate compounds, and a cationic polysaccharide, where the encapsulates include polyvinyl alcohol polymer. Compositions made from such methods. Encapsulate slurries.

MODERATELY ALKALINE CLEANING COMPOSITIONS FOR PROTEINACEOUS AND FATTY SOIL REMOVAL AT LOW TEMPERATURES

The present invention comprises chlorinated and non-chlorinated alkaline cleaning compositions for removal of proteinaceous and fatty soils at low temperature, i.e. less than 120° F., with little or no deleterious affect on cleaning performance. According to the invention, applicants have found that adding additional alkalinity makes protein removal more difficult and reducing the amount of alkalinity actually improves performance. According to the invention optimized combinations of chlorine and alkalinity components for low temperature cleaning as well as a surfactant system optimized for low temperature fatty soil removal are disclosed. 19-. (canceled)10. A non-chlorine alkaline cleaning composition in use concentration capable of removing proteinaceous soils and/or fatty soils or mixtures thereof at temperatures of less than 100° F. comprising:from about 50 ppm to about 10000 ppm of an active alkalinity source; andan amine oxide surfactant that has at least 50% of the carbon chain lengths of 14 or greater.11. The cleaning composition of claim 10 , wherein said active alkalinity source concentration comprises from about 100 to 5000 ppm.12. The cleaning composition of claim 10 , wherein said active alkalinity source concentration comprises from about 250 to 2000 ppm.13. The cleaning composition of wherein said alkaline portion comprises one or more of the following: an alkali or alkaline earth metal borate claim 10 , silicate claim 10 , carbonate claim 10 , hydroxide claim 10 , or phosphate.14. The cleaning composition of further comprising one or more of the following: a water conditioning agent claim 10 , a hydrotrope claim 10 , an antimicrobial agent claim 10 , a gelling agent and/or a metal corrosion inhibiting agent.1521-. (canceled) This is a Continuation Application of U.S. Ser. No. 15/710,471, filed Sep. 20, 2017, which is a continuation of U.S. Ser. No. 14/750,188 filed Jun. 25, 2015, now U.S. Pat. No. 9,803,160, issued Oct. 31, 2017, which is a ...

STAIN REMOVAL SYSTEMS AND METHODS

Systems and methods are provided for removing a stain from a surface. A first solution is applied to the stain, wherein the first solution comprises a combination of an ammoniated substance such as ammonium hydroxide and an alcohol such as isopropanol. A second solution is then applied to the stain treated with the first solution, wherein the second solution comprises between approximately 6% and approximately 15% hydrogen peroxide. 1. A stain removal system , comprising: between approximately 3% and approximately 9% ammonium hydroxide; and', 'between approximately 70% and approximately 98% isopropanol; and, 'a first container holding a first solution comprising 'between approximately 6% and approximately 15% hydrogen peroxide.', 'a second container holding second solution comprising2. The stain removal system of claim 1 , wherein the first and second containers comprise flexible plastic.3. The stain removal system of claim 2 , wherein each of the first and second containers has a volume gauge arranged thereon.4. The stain removal system of claim 3 , wherein the volume gauge comprises a plurality of hashes.5. A stain removal composition claim 3 , consisting essentially of:a first solution consisting essentially of 3-9% of an ammoniated substance and 70-98% of an alcohol; anda second solution consisting essentially of 6-15% of a peroxide.6. The stain removal composition of claim 5 , wherein the ammoniated substance is ammonium hydroxide.7. The stain removal composition of claim 6 , wherein the alcohol is isopropyl alcohol.8. The stain removal composition of claim 7 , wherein the peroxide is hydrogen peroxide.9. A method of removing a stain from a surface claim 7 , the method comprising: between approximately 3% and approximately 9% ammonium hydroxide; and', 'between approximately 70% and approximately 98% isopropanol; and, 'applying to the stain a first solution comprising 'between approximately 6% and approximately 15% hydrogen peroxide.', 'applying to the stain a ...

Stripping Solution for Zinc/Nickel Alloy Plating from Metal Substrate

The present disclosure relates generally to the field of electroplating and electroless plating. More specifically, the present disclosure relates to plating solutions and plating removal/stripping solutions for stripping zinc/nickel alloy plating from substrates. 1. A method for removing zinc/nickel alloy plating from a plated substrate comprising the steps of:immersing a plated substrate into a solution comprising a basic compound and an amine for a predetermined time, said plated substrate comprising a zinc/nickel alloy plating; andremoving the zinc/nickel plating from the substrate.2. The method of claim 1 , before claim 1 , after or concurrently with the step of removing the zinc/nickel plating from the substrate claim 1 , further comprising the step of:removing debris attached to the substrate by wiping, applying ultrasound, applying agitation, or combinations thereof.3. The method of claim 1 , wherein the solution is maintained at a temperature of from about 60° F. to about 200° F.4. The method of claim 1 , wherein the basic compound comprises sodium hydroxide claim 1 , potassium hydroxide and combinations thereof.5. The method of claim 1 , wherein the basic compound is maintained in the solution at a concentration of from about 10% to about 35% by weight.6. The method of claim 1 , wherein the amine comprises triethanolamine claim 1 , N-aminoethylethanolamine claim 1 , ethylenediamine claim 1 , diethylenetriamine claim 1 , triethylenetetramine claim 1 , tetraethylenepentamine claim 1 , pentathylenehexamine claim 1 , and combinations thereof.7. The method of claim 1 , wherein the amine is maintained in the solution at a concentration of from about 1% to about 25% by weight.8. The method of claim 1 , wherein the solution is maintained at a pH of greater than about 11.9. The method of claim 1 , wherein the plated substrate comprises steel claim 1 , stainless steel claim 1 , aluminum claim 1 , aluminum alloy claim 1 , titanium claim 1 , titanium alloy claim 1 , ...

2,3,3,3-TETRAFLUOROPROPENE COMPOSITIONS HAVING IMPROVED MISCIBILITY

The use of an alcoholic compound to improve the miscibility of ammonia with 2,3,3,3-tetrafluoropropene, as well as to compositions of ammonia, 2,3,3,3-tetrafluoropropene and an alcoholic compound, and the use thereof, in particular in heat-transfer applications. A composition including 2,3,3,3-tetrafluoropropene, ammonia and an alcoholic compound having a melting point less than or equal to 0° C. 1. A composition comprising 2 ,3 ,3 ,3-tetrafluoropropene , ammonia and an alcoholic compound having a melting point less than or equal to 0° C.2. The composition as claimed in claim 1 , wherein the alcoholic compound has a melting point less than or equal to −50° C.; and/or in that the alcoholic compound has a viscosity at 20° C. less than or equal to 32.5 mm/s.3. The composition as claimed in claim 1 , wherein the alcoholic compound is a primary alcohol of formula R—CH—OH claim 1 , or a secondary alcohol of formula RR—CH—OH claim 1 , or a tertiary alcohol of formula RRR—C—OH claim 1 , or an enol of formula RRC═CROH claim 1 , or a phenol of formula R—OH claim 1 , the groups R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , Rand Reach representing independently a linear or branched alkyl group comprising from 1 to 20 carbon atoms claim 1 , optionally substituted partially or completely with F claim 1 , Br claim 1 , Cl or OH; and Rrepresents a benzene ring optionally substituted partially or completely with F claim 1 , Br claim 1 , Cl claim 1 , OH or with alkyl groups as defined above.4. The composition as claimed in claim 1 , wherein the alcoholic compound is selected from propan-1-ol claim 1 , propan-2-ol claim 1 , 2-perfluorohexylethanol claim 1 , 1 claim 1 ,1 claim 1 ,1 claim 1 ,3 claim 1 ,3 claim 1 ,3-hexafluoropropan-2-ol and mixtures thereof.5. The composition as claimed in claim 1 , comprising:from 1 to 60% of ammonia and from 40 to 99% of 2,3,3,3-tetrafluoropropene;the proportions being given relative to the sum of ammonia and 2,3,3 ...

Cleaning Agent for Removal of Soldering Flux

A composition effective for removing solder fluxes either as a concentrated material or when diluted with water. The composition is effective in removing all types of solder fluxes including rosin type, resin type, no-clean, low residue, lead-free, organic acid and water soluble soldering fluxes. The composition comprises isopropylidene glycerol and an alkali and has a pH of greater than 7.5. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present. 1. A composition effective for removing solder flux characterized in that it comprises isopropylidene glycerol and an alkali and has a pH of at least about 7.5.2. The composition of claim 1 , characterized in that it further comprises water.3. The composition of claim 2 , wherein said water is present in an amount of about 99.9% to about 0.1%.4. The composition of claim 1 , further comprising a secondary solvent.5. The composition of claim 4 , wherein said secondary solvent is present in an amount up to about 90%.6. The composition of claim 4 , wherein the secondary solvent is a member of the group consisting of{'sub': 1', 'x', '2x', 'n, 'b': '1', 'claim-text': [{'sup': '1', 'Ris an alkyl group having 1 to 6 carbon atoms,'}, 'n is integer from 1 to 4, and', 'x is integer from 1 to 4;, 'a glycol ether of the formula R—O—(CHO)—H, wherein{'sub': '2', 'claim-text': 'is an alkyl group having 1 to 8 carbon atoms, a tetrahydrofurfuryl group, a benzyl group or hydrogen;', 'an alcohol of the formula R—OH, wherein{'sub': '3', 'claim-text': Npyrr represents a pyrollidone ring', {'sub': '3', 'Ris an alkyl group having 1 to 8 carbon atoms; and'}], 'an N-alkyl pyrollidone of the formula RNpyrr, wherein{'sub': 4', '2', 'k', '4, 'claim-text': [{'sub': '4', 'Ris Methyl ...

CLEANING COMPOSITION AND METHOD FOR PROCESSING EQUIPMENT

An aqueous cleaning solution composition includes about 8.7 wt. % to about 10.7 wt. % sodium hydroxide and about 0.7 wt. % to about 1.1 wt. % of potassium sodium tartrate. 1. An aqueous cleaning solution composition comprising:about 8.7 wt. % to about 10.5 wt. % sodium hydroxide; andabout 0.7 wt. % to about 1.1 wt. % potassium sodium tartrate.2. The aqueous cleaning solution composition of claim 1 , wherein the sodium hydroxide is present in an amount of about 9.2 wt. % to about 10.0 wt. % claim 1 , and the potassium sodium tartrate is present in an amount of about 0.8 wt. % to about 1.0 wt. %.3. The aqueous cleaning solution composition of claim 2 , wherein the sodium hydroxide is present in an amount of about 9.6 wt. % claim 2 , and the potassium sodium tartrate is present in an amount of about 0.9 wt. %.4. A method for removing residues including starches claim 2 , and metal ions complexed to the starches claim 2 , from a processing equipment surface claim 2 , the method comprising:providing an aqueous cleaning solution composition including sodium hydroxide and potassium sodium tartrate;maintaining the cleaning solution composition at a temperature of about 88° C. (190° F.) to about 97° C. (207° F.);bringing the cleaning solution composition into contact with the processing equipment surface for a time sufficient to remove residues including starches, and metal ions complexed to the starches, from the surface; andremoving the cleaning solution composition including the removed residues from the processing equipment.5. The method of claim 4 , wherein the aqueous cleaning solution composition provided includes:about 1.5 wt. % to about 10.5 wt. % of the sodium hydroxide; andabout 0.1 wt. % to about 1.1 wt. % of the potassium sodium tartrate.6. The method of claim 5 , wherein the aqueous cleaning solution composition provided includes:about 1.6 wt. % to about 10.0 wt. % of the sodium hydroxide, and about 0.2 wt. % to about 1.0 wt. % of the potassium sodium tartrate. ...

REMOVING PETS URIN, ODOR AND MILDEW OUT OF HAND MADE RUGS

This invention relates to isolating and removing mildew, harmful bacterial and pets urine out of handmade wool and silk rugs. 13-. (canceled)4. A method of removing pet urine and mildew from handmade wool rugs by applying a solution mixture comprising 8-12% of sodium hydrochloride and 0.5-6.5% sodium hydroxide to 850-1000 gallons of water tank for the said wool rug and wherein the temperature of the cleaning solution is between 50-95° F. and penetrates said wool rug for a duration of 45-60 minutes dissolving mildew and infected areas of the wool fiber thereby removing the pet urine or mildew from said rug.5. A method of removing pet urine and mildew from handmade silk rugs by applying a removal solution mixture comprising 11-16% of sodium tetra borate and 11-16% of sodium bicarbonate to 850-1000 gallons of water tank for the said silk rug; wherein the temperature of the solution is between 50-95° F. and penetrates said silk rug for a duration of 45-60 minutes dissolving the mildew and pet urine substance thereby removing the pet urine or mildew from said rug.6. A method of removing pet urine and mildew odor from handmade silk rugs by applying 56% by volume of acetic acid to 850 to 1000 gallon of water tank making the solution for said silk rug and wherein the temperature of the cleaning solution is between 50-95° F. and penetrates said silk rug for a duration of 45-60 minutes thereby removing the pet urine or mildew from said rug. This invention has made if possible to create new services and jobs. It eliminates handmade rugs from rotting, from being discarded and helps to create a more healthy environment. it allows the rug cleaning industry to grow.This document covers the process necessary to remove pet urine, odor, and mildew from wool and silk handmade area rugs.The process and three procedures suggested here are highly technical and intended for rug experts and expert cleaners. It will save valuable area rugs from being discard, and give them a new life. ...

CLEANER COMPOSITION AND PREPARATION OF THIN SUBSTRATE

A cleaner composition consisting essentially of (A) 90.0-99.9 wt % of an organic solvent and (B) 0.1-10.0 wt % of a C-Calcohol, and containing (C) 20-300 ppm of sodium and/or potassium is effective for cleaning a surface of a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate. 1. A cleaner composition for cleaning a surface of a substrate , consisting essentially of(A) 90.0 to 99.9% by weight of an organic solvent exclusive of an alcohol of 3 to 6 carbon atoms, and(B) 0.1 to 10.0% by weight of an alcohol of 3 to 6 carbon atoms,the composition containing (C) sodium and/or potassium in an amount of 0.002 to 0.03 part by weight per 100 parts by weight of components (A) and (B) combined.2. The cleaner composition of wherein component (C) is present in the form of sodium hydroxide and/or potassium hydroxide.3. The cleaner composition of wherein the organic solvent (A) is an aliphatic hydrocarbon of 5 to 20 carbon atoms.4. The cleaner composition of wherein the organic solvent (A) is a dialkylene glycol dialkyl ether of 5 to 20 carbon atoms.5. The cleaner composition of claim 1 , further comprising a quaternary ammonium salt.6. The cleaner composition of wherein the substrate is a semiconductor substrate.7. A method for preparing a thin substrate claim 1 , comprising the steps of(a) forming an adhesive layer on a substrate or handle substrate from an adhesive composition and bonding the substrate and the handle substrate via the adhesive layer,(b) processing the substrate bonded to the handle substrate,(c) separating the substrate as processed from the handle substrate, the adhesive layer remaining on the substrate after separation, and(d) cleaning away the adhesive layer on the substrate with the cleaner composition, wherein the cleaner composition comprises(A) 90.0 to 99.9% by weight of an organic solvent exclusive of an alcohol of 3 to 6 carbon atoms, ...

LIQUID CLEANING CONCENTRATE

A detergent concentrate comprising 1. A detergent concentrate comprising(i) 22 to 46% by weight alkaline metal hydroxide,(ii) 5 to 50% by weight dispersing agent, chelating agent or a combination thereof,(iii) 0 to 5% by weight tenside,(iv) 0 to 5% by weight excipients and(v) 28 to 39% by weight water,wherein the detergent concentrate is a suspension.2. A detergent concentrate according to claim 1 , wherein the suspension has a viscosity of at the most 6500 mPa·s claim 1 , measured according to ISO 2555:1989 at 20° C. at a rotational speed of 5 rpm.3. A detergent concentrate according to claim 1 , wherein the alkaline metal hydroxide is sodium hydroxide claim 1 , potassium hydroxide claim 1 , or a mixture thereof.4. A detergent concentrate according to claim 3 , wherein the detergent concentrate comprises:20 to 41% by weight sodium hydroxide and5 to 10% by weight potassium hydroxide.5. A detergent concentrate according to claim 1 , wherein the dispersing agent comprises at least a chelating agent and polymeric dispersing agent.6. A liquid detergent concentrate according to claim 5 , wherein the detergent concentrate comprises:5 to 49% by weight chelating agent and1 to 10% by weight polymeric dispersing agent.7. A liquid detergent concentrate according to claim 5 , wherein the chelating agent has an organic amino function.8. A liquid detergent concentrate according to claim 4 , wherein the polymeric dispersing agent is a polycarboxylic acid.9. A liquid detergent concentrate according to claim 1 , wherein the excipient is monoethanol amine.10. A method for producing a suspension claim 1 , comprising(i) 22 to 46% by weight alkaline metal hydroxide,(ii) 5 to 50% by weight dispersing agent, chelating agent or a combination thereof,(iii) 0 to 5% by weight tenside,(iv) 0 to 5% by weight excipients and(v) 28 to 39% by weight water, a) providing a portion of a dispersing agent, chelating agent or a combination thereof in an aqueous solution,', 'b) optionally adding ...

Cleaning Compositions

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one alkylsulfonic acid or a salt thereof, the alkylsulfonic acid containing an alkyl group substituted by OH or NH; 3) at least one aminoalcohol; 4) at least one corrosion inhibitor; 5) at least one water soluble organic solvent; 6) water; and 7) optionally, at least one pH adjusting agent. 1. A cleaning composition , comprising:1) at least one redox agent;{'sub': '2', '2) at least one alkylsulfonic acid or a salt thereof, the alkylsulfonic acid comprising an alkyl group substituted by OH or NH;'}3) at least one aminoalcohol;4) at least one corrosion inhibitor;5) at least one organic solvent;6) water; and7) optionally, at least one pH adjusting agent.2. The composition of claim 1 , wherein the composition has a pH from about 8 to about 11.3. The composition of claim 1 , wherein the at least one alkylsulfonic acid comprises an alkylsulfonic acid of formula (I):{'br': None, 'sub': '3', 'R—SOH\u2003\u2003(I),'}{'sub': 1', '10', '2, 'in which R is C-Calkyl substituted by at least one substituent selected from the group consisting of OH and NH.'}4. The composition of claim 3 , wherein R is C-Calkyl substituted by at least one OH.5. The composition of claim 1 , wherein the at least one alkylsulfonic acid or a salt thereof comprises HO(CH)SOH or HO(CH)SONH.6. The composition of claim 1 , wherein the at least one alkylsulfonic acid or a salt thereof is from about 0.3% by weight to about 5% by weight of the composition.7. The composition of claim 1 , wherein the at least one redox agent comprises hydroxylamine.8. The composition of claim 1 , wherein the at least one redox agent is from about 6% by weight to about 15% by weight of the composition.9. The composition of claim 1 , wherein the at least one aminoalcohol comprises ethanolamine or 2-(2-aminoethoxy)ethanol.10. The composition of claim 1 , wherein the at least one aminoalcohol is from about 5% by weight to about 10 ...

Method for dissolution of polymerized soil

A method for removing polymerized soil by adding to the soil a composition which includes: (a) from 4 to 30 wt % of a hydroxide or alkoxide, (b) from 10 to 96 wt % of a C 1 -C 12 primary alcohol; and (c) from 0 to 75 wt % of an organic solvent which is not a C 1 -C 12 primary alcohol; wherein the composition contains no more than 40 wt % water.

NANO SUPER ION WATER AND PREPARATION METHOD OF THE SAME

Nano super ion water and a preparation method of the same are provided, wherein the method including the following steps: adjusting a distance between two electrode plates of a electrolysis device to a predetermined distance, adding pre-electrolysis water to a cathode electrode, adding a carbonate solution to an anode electrode, applying an electrolysis reaction to the pre-electrolysis water and the carbonate solution separated by an ion-exchange membrane, and collecting the nano super ion water from the anode electrolysis tank. The nano super ion water of the present invention provides better detergency for removing dirt and chemical residues, and also provides functions of odor elimination, disinfection, and resistance of corrosive oxidation of an object. 1. A method of manufacturing a nano super ion water , comprising:adjusting a distance of two electrodes of an electrolysis device to a predetermined distance;adding pre-electrolysis water into an anode electrolysis tank;adding a carbonate solution into a cathode electrolysis tank;applying an electrolysis reaction to the pre-electrolysis water and the carbonate solution separated by an ion-exchange membrane; andcollecting the nano super ion water from the anode electrolysis tank.2. The method as in claim 1 , wherein the predetermined distance is from 0.1 cm to 0.8 cm.3. The method as in claim 1 , wherein a voltage used in the electrolysis reaction is from 8 V to 15 V.4. The method as in claim 1 , wherein the ion-exchange membrane has a pore size between 0.001 μm to 0.005 μm.5. The method as in claim 1 , further comprising extracting a gas product using a gas extraction device during the electrolysis reaction.6. A nano super ion water claim 1 , which is manufactured by the method of any one of to .7. The nano super ion water as in claim 6 , wherein the pH value of the nano super ion water is from 8 to 14.8. The nano super ion water as in claim 6 , wherein the nano super ion water is a solution comprising 0.001% to ...

Synthetic Base and Associated Methods

Glycine is an organic compound that can be used in the making of a synthetic base that obviates all the drawbacks of strong bases such as sodium hydroxide. The new compound is made by dissolving glycine in water and adding calcium hydroxide at a molar ration of about 1:1. Next, sodium percarbonate is dissolved in the solution to produce the new compound, which can be referred to as glycine hydroxide. 1. A synthetic base made by a process comprising:combining glycine, calcium hydroxide, and sodium percarbonate.2. The synthetic base as described in claim 1 , wherein the glycine and the calcium hydroxide are mixed at a molar ratio of about 1:1.3. The synthetic base as described in claim 2 , wherein the sodium percarbonate is added at a concentration of about 25% by weight.4. The synthetic base as described in claim 1 , wherein the glycine is mixed with the calcium hydroxide prior to addition of the sodium percarbonate.5. A method for making a synthetic base claim 1 , the method comprising:combining glycine, calcium hydroxide, and sodium percarbonate.6. The method as described in claim 5 , wherein the glycine and the calcium hydroxide are mixed at a molar ratio of about 1:1.7. The method as described in claim 6 , wherein the sodium percarbonate is added at a concentration of about 25% by weight.8. The method as described in claim 5 , wherein the glycine is mixed with the calcium hydroxide prior to addition of the sodium percarbonate. This application is a continuation of and claims priority to U.S. patent application Ser. No. 15/218,766, filed Jul. 25, 2016, which is a continuation of and claims priority to U.S. patent application Ser. No. 14/585,774, filed Dec. 30, 2014, which claims priority to U.S. Provisional Application Ser. No. 61/921,813, filed Dec. 30, 2013, the contents of which are incorporated by reference for all purposes and commonly owned.The present invention relates to compositions comprising synthetic bases and to methods of use for such compositions, ...

Synthetic Base and Associated Methods

Glycine is an organic compound that can be used in the making of a synthetic base that obviates all the drawbacks of strong bases such as sodium hydroxide. The new compound is made by dissolving glycine in water and adding calcium hydroxide at a molar ration of about 1:1. Next, sodium percarbonate is dissolved in the solution to produce the new compound, which can be referred to as glycine hydroxide. 1. A composition made by a process comprising:mixing glycine with calcium hydroxide to produce a solution; andadding sodium percarbonate to the solution.2. The composition as described in claim 1 , wherein the glycine and the calcium hydroxide are mixed at a molar ratio of about 1:1.3. The composition as described in claim 2 , wherein the sodium percarbonate is added at a concentration of about 25% by weight of the solution.4. An additive for at least one of a cleaning solution and a sanitizing solution comprising:glycine, calcium hydroxide, and sodium percarbonate.5. The additive as described in claim 4 , wherein the glycine is mixed with the calcium hydroxide prior to addition of the sodium percarbonate.6. The additive as described in claim 5 , wherein the glycine and the calcium hydroxide are mixed at a molar ratio of about 1:1.7. The additive as described in claim 6 , wherein the sodium percarbonate is added at a concentration of about 25% by weight.8. The additive as described in claim 4 , wherein the at least one of a cleaning solution and a sanitizing solution comprises a degreaser.9. A composition for assisting with at least one of a fruit and vegetable peeling process claim 4 , the composition comprising:glycine, calcium hydroxide, and sodium percarbonate.10. The composition as described in claim 9 , wherein the at least one of a fruit and vegetable peeling process comprises a tomato peeling process. This application is a continuation of and claims priority to U.S. patent application Ser. No. 14/585,774, filed Dec. 30, 2014, which claims priority to U.S. ...

PHOSPHORUS FREE LOW TEMPERATURE WARE WASH DETERGENT FOR REDUCING SCALE BUILD-UP

Phosphorus-free detergent compositions are provided. Detergent compositions including an aminocarboxylate, water conditioning agent, source of alkalinity and water beneficially do not require the use of additional surfactants and/or polymers to provide suitable detergency and prevent scale build-up on treated surfaces. The detergent compositions are used with a sanitizer to employ the phosphorus-free detergent compositions for use as low temperature ware wash detergents that beneficially reduce scale build-up. Methods of employing the phosphorus-free detergent compositions are also provided. 1. A phosphorus-free detergent composition comprising:from about 0.1-15 wt-% of an aminocarboxylate;from about 0.1-15 wt-% of a water conditioning polymer;from about 20-80 wt-% of an alkalinity source;from about 20-80 wt-% of water,wherein the composition is phosphorus-free, does not contain surfactants and reduces or eliminates scale build-up on treated surfaces, andwherein the detergent composition provides an effective sanitizing effect at wash temperatures that are not heated above about 140° F. when employed with a sanitizer.2. The composition of claim 1 , wherein the aminocarboxylate is an aminocarboxylic acid or a salt of an aminocarboxylic acid.3. The composition of claim 2 , wherein the aminocarboxylate is methylglycinediacetic acid.4. The composition of claim 1 , wherein the water conditioning polymer is a polyacrylate claim 1 , polycarboxylate or polycarboxylic acid.5. The composition of claim 1 , wherein the alkalinity source is sodium hydroxide.6. The composition of claim 1 , wherein the ratio of the aminocarboxylate to the water conditioning polymer is from about 1:5 to about 5:1.7. The composition of claim 1 , wherein the composition comprises between about 1 wt-% and about 10 wt-% aminocarboxylate claim 1 , between about 0.1 wt-% and about 10 wt-% water conditioning polymer claim 1 , between about 30 wt-% and about 80 wt-% alkalinity source claim 1 , and between ...

Photoresist Stripper

Improved stripper solutions for removing photoresists from substrates are provided that exhibit improved compatibility with copper, leadfree solder, and epoxy-based molding compounds. The stripper solutions comprise a primary solvent, a secondary glycol ether solvent, potassium hydroxide, and an amine. The solutions also exhibit reduced potassium carbonate crystal formation compared to conventional formulations containing potassium hydroxide, and extended bath life compared to formulations containing tetramethylammonium hydroxide. 1. A stripper solution for removing photoresist from substrates comprising:about 20 weight % to about 90 weight % primary solvent;about 5 weight % to about 50 weight % of a secondary solvent;about 1 weight % to about 7 weight % of an inorganic base;about 1 weight % to about 30 weight % of an amine;about 0.0001 weight % to about 10 weight % of corrosion inhibitor;wherein the solution exhibits a flash point above about 90 degrees Celsius; andwherein the solution is essentially free of a quaternary ammonium hydroxide.2. The stripper solution of claim 1 , wherein said primary solvent is diethylene glycol butyl ether claim 1 , or diethylene glycol ethyl ether.3. The solution of claim 1 , wherein the inorganic base is present in an amount from about 1 weight % to about 4 weight %.4. The solution of claim 3 , wherein the inorganic base comprises potassium hydroxide.5. The solution of claim 1 , further comprising from about 0.1 weight % to about 5 weight % water.6. The solution of claim 1 , wherein the amine is present in the amount of about 1 weight % to about 20 weight %.7. The solution of claim 1 , further comprising a tertiary solvent claim 1 , wherein the sum of the amount of the primary claim 1 , secondary claim 1 , and tertiary solvents is about 50 weight % to about 99.5 weight %.8. The solution of claim 1 , wherein the amine comprises monoethanolamine claim 1 , diethanolamine claim 1 , triethanolamine claim 1 , diethylenetriamine claim 1 , ...

COMPOSITIONS AND METHODS OF CLEANING POLYVINYL PYRROLIDONE-BASED HEMODIALYSIS FILTRATION MEMBRANE ASSEMBLIES

A method and/or a composition relates to cleaning and reprocessing a hemodialysis filtration membrane assembly that employs polyvinylpyrrolidone-containing membranes. The method includes the step of treating the assembly with an aqueous mixture or a gas-liquid mixture having an inorganic base and from 100 to 1,000 ppm of a hypochlorite salt, wherein the mixture has a pH between about 12.0 and about 12.5, an oxidation reduction potential of less than 0.5 volts, a temperature of 40° to 55° C. and wherein the mole % of hypochlorous acid, HOCl, relative to the sum of hypochlorous acid plus hypochlorite anion, —OCl, is less than 0.004%. The composition may be used in such a method. 1. A method of cleaning a hemodialysis membrane assembly , comprising: an inorganic base;', 'from about 100 to about 1,000 ppm of a hypochlorite salt;', 'less than 50 ppb free HOCl;', 'a pH between at least 12.0 and about 12.8;', 'an oxidation-reduction potential less than 0.5 volts; and', 'a mole % of hypochlorous acid, HOCl, relative to the sum of hypochlorous acid plus hypochlorite anion, —OCl is less than 0.004%; and, '(a) applying a composition to the assembly for 5 to 10 minutes at a temperature of about 40° to about 55° C., the composition comprising(b) removing the composition from the membrane assembly with water.2. The method of claim 1 , wherein the hemodialysis membrane assembly comprises polyethersulfones and polyvinylpyrrolidone.3. The method of claim 1 , further comprising:(c) storing the hemodialysis membrane assembly in acid for 1 to 2 days after step (b); and(d) removing the acid from the membrane assembly with water.4. The method of claim 3 , wherein peracetic acid solution is used to perform step (c).5. The method of claim 1 , wherein prior to step (a) the composition is in the form of a concentrate claim 1 , and the method further comprises diluting the concentrate to the composition se forth in step (a).6. The method of claim 5 , wherein the step of diluting the ...

NON-AMINE POST-CMP COMPOSITIONS AND METHOD OF USE

An amine-free composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The compositions achieve highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material, copper interconnect material, or cobalt-containing materials. 1. A composition for cleaning residue and contaminants from a surface , said composition comprising at least one complexing agent , at least one basic compound , at least one buffering agent , water , optionally at least one oxidizing agent , optionally at least one reducing agent , and optionally at least one solvating agent , wherein the composition is substantially devoid of amines , quaternary bases , fluoride-containing sources , and abrasive material typically used in chemical mechanical polishing processes.2. The composition of claim 1 , wherein pH is in a range from 7 to about 13.3. The composition of claim 1 , wherein the at least one basic compound comprise a species selected from the group consisting of KOH claim 1 , CsOH claim 1 , ammonium hydroxide claim 1 , and combinations thereof.4. The composition of claim 1 , wherein the at least one basic compound comprises KOH.5. The composition of claim 1 , wherein the at least one complexing agent comprises a species selected from the group consisting of lactic acid claim 1 , maleic acid claim 1 , ascorbic acid claim 1 , malic acid claim 1 , citric acid claim 1 , benzoic acid claim 1 , fumaric acid claim 1 , succinic acid claim 1 , oxalic acid claim 1 , malonic acid claim 1 , mandelic acid claim 1 , maleic anhydride claim 1 , phthalic acid claim 1 , aspartic acid claim 1 , glutamic acid claim 1 , glutaric acid claim 1 , glycolic acid claim 1 , glyoxylic acid claim 1 , glycerin claim 1 , acetylacetone claim 1 , salicylhydroxamic acid claim 1 , a salt thereof claim ...

Cleaning Compositions

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one alkylsulfonic acid or a salt thereof, the alkylsulfonic acid containing an alkyl group substituted by OH or NH; and 3) at least one aminoalcohol. 1. A cleaning composition , comprising:1) at least one redox agent;{'sub': '2', '2) at least one alkylsulfonic acid or a salt thereof, the alkylsulfonic acid comprising an alkyl group substituted by OH or NH; and'}3) at least one aminoalcohol.2. The composition of claim 1 , wherein the composition has a pH from about 8 to about 11.4. The composition of claim 3 , wherein R is C-Calkyl substituted by at least one OH.5. The composition of claim 1 , wherein the at least one alkylsulfonic acid or a salt thereof comprises HO(CH)SOH or HO(CH)SONH.6. The composition of claim 1 , wherein the at least one alkylsulfonic acid or a salt thereof is from about 0.3% by weight to about 5% by weight of the composition.7. The composition of claim 1 , wherein the at least one redox agent comprises hydroxylamine.8. The composition of claim 1 , wherein the at least one redox agent is from about 6% by weight to about 15% by weight of the composition.9. The composition of claim 1 , wherein the at least one aminoalcohol comprises ethanolamine or 2-(2-aminoethoxy)ethanol.10. The composition of claim 1 , wherein the at least one aminoalcohol is from about 5% by weight to about 10% by weight of the composition.11. The composition of claim 1 , further comprising at least one corrosion inhibitor.12. The composition of claim 11 , wherein the at least one corrosion inhibitor comprises benzotriazole optionally substituted by at least one substituent selected from the group consisting of alkyl groups claim 11 , aryl groups claim 11 , halogen groups claim 11 , amino groups claim 11 , nitro groups claim 11 , alkoxy groups claim 11 , and hydroxyl groups.13. The composition of claim 11 , wherein the at least one corrosion inhibitor comprises a compound ...

Cleaning Method and Laminate of Aluminum Nitride Single-Crystal Substrate

A method for effectively removing minute impurities of 1 μm or less in size that are present on a surface of an aluminum nitride single-crystal substrate without etching the surface includes scrubbing a surface of an aluminum nitride single-crystal substrate using a polymer compound material having lower hardness than an aluminum nitride single crystal, and an alkali aqueous solution having 0.01-1 mass % concentration of potassium hydroxide or sodium hydroxide, the alkali aqueous solution being absorbed in the polymer compound material. 1. An aluminum nitride single crystal substrate , wherein:{'sup': '2', 'a number of foreign matters larger than 1 μm per 400 μmof a surface of the substrate is less than 1,'}a number of the foreign matters of 1 μm or less is less than 1, and{'sup': '2', 'a root mean square roughness per 4 μmof the surface of the substrate is 0.06 to 0.30 nm,'}2. A laminated body comprising the aluminum gallium nitride layer AlGaN claim 1 , 0≤x≤1 on the substrate as set forth in .3. The laminated body as set forth in claim 2 , wherein the film thickness of the aluminum gallium nitride layer AlGaN claim 2 , 0≤x≤1 is thicker than 1 μm.4. A polymer compound material for cleaning an aluminum nitride single crystal substrate comprising a polymer compound material absorbed with an alkaline aqueous solution having concentration of 0.01 to 1 wt % of an alkaline which is selected from the group consisting of potassium hydroxide and sodium hydroxide. This application is a divisional patent application of U.S. Ser. No. 15/508,501, filed on 3 Mar. 2017 in the U.S. Patent and Trademark Office, which is a U.S. national stage of PCT international application PCT/JP2015/073552 filed on 21 Aug. 2015, and claims priority to Japanese patent document JP 2014-185567 filed on 11 Sep. 2014, the entireties of which are incorporated herein by reference.The present invention relates to a cleaning method of a aluminum nitride single crystal substrate, and a production method of ...

CAUSTIC FREE LOW TEMPERATURE WARE WASH DETERGENT FOR REDUCING SCALE BUILD-UP

Caustic-free detergent compositions are provided. Detergent compositions including an aminocarboxylate, water conditioning agent, non-caustic source of alkalinity and water beneficially do not require the use of additional surfactants and/or polymers to provide suitable detergency and prevent scale build-up on treated surfaces. The detergent compositions are used with a sanitizer to employ the caustic-free detergent compositions are particularly suitable for use as low temperature ware wash detergents that beneficially reduce scale build-up. Methods of employing the caustic-free detergent compositions are also provided. 1. A caustic-free detergent composition comprising:from about 0.1-15 wt-% of an aminocarboxylate;from about 0.1-15 wt-% of a water conditioning polymer;from about 0.1-15 wt-% of a sequestrant;from about 10-60 wt-% of a non-caustic alkalinity source;from about 20-80 wt-% of water,wherein the composition is caustic-free, does not contain surfactants and reduces or eliminates scale build-up on treated surfaces, and wherein a use solution of the composition has a pH less than about 11.5,wherein the detergent composition provides an effective sanitizing effect at wash temperatures that are not heated above about 140° F. when employed with a sanitizer.2. The composition of claim 1 , wherein the aminocarboxylate is an aminocarboxylic acid or a salt of an aminocarboxylic acid.3. The composition of claim 2 , wherein the aminocarboxylate ismethylglycinediacetic acid or trisodium salt of methylglycinediacetic acid.4. The composition of claim 1 , wherein the water conditioning polymer is a polyacrylate claim 1 , polycarboxylate or polycarboxylic acid and wherein the sequestrant is a condensed phosphate claim 1 , phosphonate or organic phosphonate.5. The composition of claim 1 , wherein the non-caustic alkalinity source is a silicate and/or metasilicate.6. The composition of claim 1 , wherein the ratio of the aminocarboxylate to the water conditioning polymer to ...