СПОСОБ ОБРАЗОВАНИЯ ИЗОЛИРУЮЩЕГО СЛОЯ ПОСРЕДСТВОМ ЧАСТИЦ С НИЗКОЙ ЭНЕРГИЕЙ

Изобретение относится к способу обеспечения защитного, пассивирующего или герметизирующего слоя на органическом электронном устройстве или его компоненте путем осаждения слабо ускоренных частиц методом распыления пучка ионов или плазмы либо методом прямого осаждения пучка ионов или плазмы. Способ характеризуется тем, что на органическое электронное устройство или компонент воздействуют пучком частиц с преобладающей энергией частиц от 0,1 до 30 электронвольт, осаждая таким образом слой указанных частиц на электронном устройстве или компоненте. Также изобретение относится к способу герметизации органического электронного устройства, защитному слою, органическому электронному устройству, содержащему указанный слой. Предлагаемое изобретение предоставляет слой, который не повреждает органический слой и не оказывает или оказывает только незначительное негативное воздействие на характеристики устройства. 5 н. и 11 з.п. ф-лы, 2 табл., 3 пр., 5 ил.

СПОСОБ МОДЕЛИРОВАНИЯ ВОССТАНОВЛЕНИЯ ОПТИЧЕСКИХ И ПРОЧНОСТНЫХ ХАРАКТЕРИСТИК ИЗДЕЛИЯ ИЗ КВАРЦЕВОГО СТЕКЛА, ИСПОЛЬЗУЕМОГО В КОСМИЧЕСКИХ АППАРАТАХ

Изобретение относится к вакуумной технологии очистки поверхности и нанесения упрочняющих покрытий на изделия из кварцевого стекла, преимущественно марки КВ, указанная технология может быть использована в космических аппаратах в условиях космического пространства. Предложен способ восстановления прозрачного упрочняющего неорганического покрытия из кварцевого стекла марки КВ на поверхности изделия из кварцевого стекла, используемого в космическом аппарате, осуществляемый в имитируемых условиях космического пространства. Для осуществления способа проводят очистку поверхности изделия пучком ускоренных ионов инертного газа и последующее нанесение на очищенную поверхность изделия прозрачного неорганического упрочняющего покрытия путем ионно-лучевого распыления мишени из кварцевого стекла марки КВ пучком ускоренных ионов упомянутого инертного газа. Для имитации условий космического пространства очистку поверхности изделия из кварцевого стекла и нанесение упрочняющего неорганического покрытия выполняют ...

ПРОСВЕТЛЯЮЩЕЕ ПОКРЫТИЕ ДЛЯ ЛИНЗ, ИМЕЮЩЕЕ МАЛЫЕ ВНУТРЕННИЕ НАПРЯЖЕНИЯ И УЛЬТРАНИЗКУЮ ОСТАТОЧНУЮ ОТРАЖАЮЩУЮ СПОСОБНОСТЬ

... 1. Композиция для изготовления просветляющего покрытия с высоким коэффициентом преломления на оптических линзах, состоящая из смеси оксидов церия и титана, отличающаяся тем, что доля оксида церия меньше чем приблизительно 25% общей массы композиции. 2. Композиция для изготовления просветляющего покрытия с низким коэффициентом преломления на оптических линзах, состоящая из смеси оксидов кремния и алюминия, отличающаяся тем, что доля оксида алюминия меньше чем приблизительно 10% общей массы композиции. 3. Способ изготовления оптических линз с просветляющим покрытием, состоящий из следующих стадий: подготовка одной или более оптических линз и одной контрольной оптической линзы; размещение этих оптических линз и одной контрольной оптической линзы на одной и той же поверхности напыления в камере напыления в вакууме, снабженной взаимодействующим с указанной контрольной оптической линзой устройством непрерывного оптического контроля; оборудование указанной камеры по меньшей мере одним источником ...

Verfahren zum Bedecken optischer Glasteile mit durch Verdampfen im Vakuum darauf erzeugten Schichten aus Siliziummonoxyd und Aluminiumoxyd

Verfahren zur Herstellung einer korrosionsfesten, weitgehend absorptionsfreien Schicht auf der Oberfläche eines Werkstücks

SCHMUTZABWEISENDE BESCHICHTUNG FÜR GLASOBERFLÄCHEN

PLASTIKBEHÄLTER MIT EINER EXTERNEN GASSPERRENBESCHICHTUNG

Verfahren und Vorrichtung zum dauerhaften Reparieren von Defekten fehlenden Materials einer photolithographischen Maske

Die vorliegende Anmeldung bezieht sich auf ein Verfahren zum dauerhaften Reparieren von Defekten (260, 270, 280) fehlenden Materials einer photolithographischen Maske (105, 210, 220), die Schritte aufweisend: (a) Bereitstellen zumindest eines Kohlenstoff enthaltenden Präkursor-Gases und zumindest eines Oxidationsmittels an einer zu reparierenden Stelle der photolithographischen Maske (105, 210, 220); (b) Initiieren einer Reaktion des zumindest einen Kohlenstoff enthaltenden Präkursor-Gases mit Hilfe zumindest einer Energiequelle (127) an der Stelle fehlenden Materials zum Abscheiden von Material an der Stelle fehlenden Materials, wobei das abgeschiedene Material (460, 670, 880) zumindest ein Reaktionsprodukt des reagierten zumindest einen Kohlenstoff enthaltenden Präkursor-Gases umfasst; und (c) Kontrollieren eines Gasmengenstroms des zumindest einen Oxidationsmittels zum Minimieren eines Kohlenstoffanteils des abgeschiedenen Materials (460, 670, 880).

Verpackungen und Packhilfsmittel

MAGNETRONZERSTAEUBUNGSANLAGE UND -VERFAHREN.

Licht absorbierende Beschichtung mit geringer Reflektivität

Die Erfindung betrifft eine optische Komponente umfassend ein transparentes Substrat mit Beschichtung auf einer Substratgrenzfläche, wobei die Beschichtung mit der Umgebung eine Umgebungsgrenzfläche bildet und wobei die Beschichtung ein Wechselschichtsystem umfasst, das Me-Schichten enthält, wobei Me jeweils ein Element oder eine Kombination aus Elementen der Gruppe ist, welche gebildet wird aus: Metalle und/oder deren Legierungen, Halbmetalle, Halbleiter; und wobei das Wechselschichtsystem Schichten aus dielektrischen Materialien enthält, die sich mit den Me-Schichten abwechseln. Das Wechselschichtsystem ist aus mindestens 10 Schichten und vorzugsweise aus höchstens 30 Schichten aufgebaut. Es umfasst erste zwei Me-Schichten, nämlich diejenigen zwei Me-Schichten, die der Substratgrenzfläche am nächsten sind mit ersten, nicht notwendigerweise gleichen Kleinschichtdicken, die mindestens 0.5nm und höchstens 10nm betragen. Es umfasst ausserdem zweite zwei Me-Schichten nämlich diejenigen zwei ...

Beschichtete Unterlage und Verfahren zu ihrer Bildung

Beschichtete Unterlage, umfassend eine Unterlage, die Glas umfasst, und wenigstens eine primäre Beschichtungslage, die darauf gebildet ist, gekennzeichnet durch eine freiliegende schützende zusätzliche Schicht, die darauf durch Kathodenvakuumzerstäubung gebildet ist, einen Brechungsindex von weniger als 1,7 aufweist und ausgewählt ist aus den Oxiden von Silicium und Gemischen von einem oder mehreren der Oxide, Nitride und Oxynitride von Silicium, wobei diese Schutzschicht nicht aus einem oder mehreren Oxynitriden von Silicium besteht, und wobei diese Schutzschicht eine Dicke von 1 bis 10 nm aufweist.

GAS BARRIER PROPERTIES OF POLYMERIC CONTAINERS

PRODUCTION OF OXIDE COATINGS ON PLASTICS FILMS

Soil-resistant coating for glass surfaces

A glass article which has a water-sheeting coating and a method of applying coatings to opposed sides of a substrate are described. In one embodiment, a water-sheeting coating (20) comprising silica is sputtered directly onto an exterior surface of the glass. The exterior face of this water-sheeting coating is substantially non-porous but has an irregular surface. This water-sheeting coating causes water applied to the coated surface to sheet, making the glass article easier to clean and helping the glass stay clean longer. In one method of the invention, interior and exterior surfaces of a glass sheet are cleaned. Thereafter, the interior surface of the sheet of glass is coated with a reflective coating by sputtering, in sequence, at least one dielectric layer, at least one metal layer, and at least one dielectric layer. The exterior surface of the glass is coated with a water-sheeting coating by sputtering silica directly onto the exterior surface of the sheet of glass. If so desired, ...

Soil-resistant coating for glass surfaces

Soil-resistant coating for glass surfaces

Improvements in or relating to methods of forming silica coatings on refractory substrates

A silica coating is formed on a refractory substrate by thermal evaporation in vacuo, and then the coated substrate is heat-treated at not less than 1000 DEG C. to render the coating substantially non-porous and to improve the adhesion of the silica coating to the substrate. The substrate is of silicon but may be metallic. The silicon substrate is maintained at about 1000 DEG C. during coating by being supported on a horizontal strip or sheet of tungsten functioning as a heated electrical resistor. Silica is evaporated from a short rod held above the substrate and heated to 1800 DEG C. by electron bombardment. A suitable mask may be used and the exposed parts coated with silica of about 2 microns thickness. After coating the silicon body is heat treated in dry nitrogen at 1200 DEG C. for 30 minutes and then slowly cooled to room temperature. Alternatively, an atmosphere of dry oxygen may be used and the superficial oxidation of the previously masked areas removed by immersion in 40% hydrofluoric ...

Plastic container with an external gas barrier coating.

A coated plastic container provides for low permeability to gases and vapors. A method and system for coating plastic containers includes applying a thin inorganic oxide layer to the external surface of the containers with plasma-assisted vacuum vapor deposition. For example, the coating can include silica which is bonded to the external surface of the container. This coating is flexible and can be applied regardless of the container's internal pressure or lack thereof. The coating firmly adheres to the container and posess and enhanced gas barrier effect after pressurization even when the coating is scratched, fractured, flexed and/or stretched. Moreover, this gas barrier enhancement will be substantially unaffected by filling of the container. A method of recycling coated plastic containers and a method and system for packaging a beverage using the coated containers are also disclosed.

Plastic containers with an external gas barrier coating

Plastic containers with an external gas barrier coating

Plastic containers with an external gas barrier coating

DIRT-STEADY COATING FOR GLASS SURFACES

PROCEDURE FOR THE SURFACE COATING OF POLYMERS ARTICLES WITH INORGANIC FILMS

MAGNETRONZERSTÄUBUNGSANLAGE AND - PROCEDURES

MECHANISM FOR PLASMA-SUPPORTED ELECTRON-BEAM HIGH RATE VAPORIZING

MAGNETRONZERSTÄUBUNGSANLAGE AND - PROCEDURES

DIRT-DEFLECTING COATING WITH LOW RADIATING POWER FOR GLASS SURFACES

PROCEDURE FOR THE COATING WITH ACRYLATES

PROCEDURE FOR THE COATING FROM BOTH SIDES A GLASS SUBSTRATE

PACKING AND PACKAGING EXPEDIENTS

Dielectric films and related method

COATING ANTI-REFLECTION FILM ON

Curved-surface coated plate, preparation method thereof and solar module

A curved-surface coated plate is provided. The curved-surface coated plate includes a curved-surface light-transmitting substrate and a film layer arranged on one side of the curved-surface light-transmitting substrate. The film layer is a full dielectric film and includes a high refractive index material film whose refractive index is higher than that of the curved-surface light-transmitting substrate. A method for preparing the curved-surface coated plate and a solar module including the curved-surface coated plate are also provided. 10586729_1 (GHMatters) P109523.AU ...

METHOD FOR COATING SUBSTRATES WITH SILICON BASED COMPOUNDS

Plastic containers with an external gas barrier coating

METHOD OF PRODUCING PLANE-PARALLEL STRUCTURES OF SILICON SUBOXIDE, SILICON DIOXIDE AND/OR SILICON CARBIDE, PLANE-PARALLEL STRUCTURES OBTAINABLE BY SUCH METHODS, AND THE USE THEREOF

METHOD FOR FORMING HOUSINGS FOR ELECTRONIC COMPONENTS AND ELECTRONIC COMPONENTS THAT ARE HERMETICALLY ENCAPSULATED THEREBY

Hydrophobic and oleophobic coatings

A hydrophobic surface comprises a surface texture and a coating disposed on the surface texture, wherein the coating comprises an amorphous diamond like carbon material doped with 10 to 35 atomic percent of Si, O, F, or a combination comprising at least one of the foregoing, or a low surface energy material selected from fluoropolymer, silicone, ceramic, fluoropolymer composite, or a combination comprising at least one of the foregoing; and wherein the surface texture comprises a micro texture, a micro-nano texture, or a combination of a micro texture and a micro-nano texture.

Plastic containers with an external gas barrier coating

BIRD FRIENDLY ELECTROCHROMIC DEVICES

Various embodiments herein relate to electrochromic windows that are bird friendly, as well as methods and apparatus for forming such windows. Bird friendly windows include one or more elements that make the window visible to birds so that the birds recognize that they cannot fly through the window. Bird friendly windows can be used to minimize avian-window collisions, and therefore minimize avian deaths resulting from such collisions. In various embodiments, a window may be patterned such that the pattern is visible to birds. In these or other cases, the window may be made hazy, where the haze is visible to birds. The pattern and/or haze may be visible at wavelengths that fall in UV, and minimally noticeable (if at all) in wavelengths within the spectrum visible by humans.

GLASS MATERIAL FOR USE AT HIGH FREQUENCIES

The aim of the invention is to improve the high-frequency characteristics of high-frequency substrates or high-frequency conductor assemblies. To achieve this, the invention provides a glass material for producing insulation layers for high-frequency conductor assemblies. Said material is applied as a layer, in particular with a layer thickness ranging between 0.05 .mu.m and 5 mm, with a tangent of loss angle tan.delta. in at least one frequency range above 1 GHz of less than or equal to 70*10-4.

COATED SUBSTRATE AND PROCESS FOR ITS FORMATION

A coated substrate is described comprising a substrate and at least one primary coating layer formed thereon. The product is characterised by an exposed protective additional layer formed thereon by cathode vacuum sputtering. The protective layer is selected from oxides and oxynitrides of silicon, and mixtures of one or more of oxides, nitrides and oxynitrides of silicon and has a refractive index of less than 1.7 and a thickness of from 1 to 10 nm. The product has improved chemical and mechanical durability, while any consequential changes in the optical properties are minimised.

Verfahren zur Herstellung eines mindestens teilweise mit einem Glas überzogenen elektrischen Schaltelementes

Verfahren zum Aufbringen eines festhaftenden Schutzüberzuges auf feinmechanischen Präzisionsteilen und nach diesem Verfahren erhaltener feinmechanischer Präzisionsteil

Kunststoff mit aufgedampften SiOx-Oberflächenschichten und Verfahren zu dessen Herstellung

Hygroskopischer Kristall mit einer gut haftenden Deckschicht, vorzugsweise einerVergütungs- oder Spiegelschicht

Verfahren zur Herstellung einer elektronischen Vorrichtung

Verfahren zur Herstellung von glasigen Schichten auf Substraten

Coating plastics surfaces with vapourised silica and

Coating plastic materials by treatment with the vapour of SiOx where x = 1 to 2, under vacuum, in the presence of oxygen, to give a layer 2-5 mu thick, according to BE. 697449 (Basic 94,759P), in which instead of quartz there is vapourised a mixture of 95-98.5% silicon dioxide and 5-1.5% zinc oxide, zirconium oxide, antimony oxide, or pref. chromium oxide, or their mixtures. The modification improves resistance to rapid temperature fluctuations in the range 20-100 deg.C., and to humid air containing SO2. The plastic materials used can be any not softened by the treatment, E.G. polycarbonate sheet.

Magnetische Speicheranordnung und Verfahren zu ihrer Herstellung

Mindestens teilweise beschichteter Gegenstand und Verfahren zu dessen Herstellung

Verfahren zum Oberflächenvergüten von Kunststoffen

Gegen elektrische Aufladung geschützte Fensterscheibe

Component of turboengines.

Pretreating e.g. plastic film before vacuum depositing seal on it - by passing film round roller where it is exposed to plasmas produced by two successive ribbed high frequency hollow anodes

The surface of a substrate is pretreated before an inorganic seal is applied to it, where that seal is evaporated under vacuum from a pot and then deposited on the surface concerned. In the process the substrate is passed at high speed through the vacuum chamber and exposed to the action of a plasma. The process pref. utilises a film of polyethylene-terephthalate, polyethylene, polypropylene or polyamide. ADVANTAGE - The procedure bonds the seal layer to the substrate and produces a durable coating. It is useful in making packaging material which keeps its contents in good condition for long time.

Coat a substrate surface with an permeation barrier.

TRANSPARENT ABRASIVE RESISTANT SPUTTERED FILMS ON METAL SUBSTRATES

Röntgenopakes barium-free glass and its use.

Die Erfindung betrifft ein zirkonhaltiges BaO- und PbO-freies röntgenopakes Glas mit einem Brechungsindex n d von 1,54 bis 1,58 und einer hohen Röntgenopazität mit einer Aluminiumgleichwertdicke von mindestens 500%. Das Glas basiert auf dem System SiO 2 B 2 O 3 Al 2 O 3 R 2 O RO La 2 O 3 ZrO 2 mit optionalen Zusätzen von SnO 2 . Das Glas kann insbesondere als Dentalglas oder als optisches Glas eingesetzt werden.

A substrate bearing a and its production method.

PROCEDURE FOR THE PRODUCTION OF AN ANTI-REFLECTION FILM ON LENSES AND EYEGLASS LENSES.

SUBSTRATE CARRYING A COATING AND ITS PROCESS OF FBRICATION.

A method of manufacturing a micromechanical timepiece piece and said micromechanical timepiece.

L’invention se rapporte à un procédé de fabrication d’une pièce micromécanique horlogère à partir d’un substrat à base de silicium (1), comprenant, dans l’ordre, les étapes de: a) former des pores (2) à la surface d’au moins une partie d’une surface dudit substrat à base de silicium (1) d’une profondeur déterminée, b) remplir entièrement lesdits pores (2) d’un matériau choisi parmi le diamant, le carbone-diamant (DLC), l’oxyde de silicium, le nitrure de silicium, des céramiques, des polymères et leurs mélanges, afin de former dans les pores (2) une couche dudit matériau d’une épaisseur au moins égale à la profondeur des pores (2). L’invention concerne également une pièce micromécanique horlogère comprenant un substrat à base de silicium (1) qui présente, à la surface d’au moins une partie d’une de ses surfaces, des pores (2) d’une profondeur déterminée, lesdits pores (2) étant entièrement remplis d’une couche d’un matériau choisi parmi le diamant, le carbone-diamant (DLC), l’oxyde de silicium ...

A method of manufacturing a micromechanical timepiece piece and said micromechanical timepiece.

L’invention se rapporte à un procédé de fabrication d’une pièce micromécanique horlogère comprenant un substrat à base de silicium (1), comprenant, dans l’ordre, les étapes de: a) former des pores (2) à la surface d’au moins une partie d’une surface dudit substrat à base de silicium (1) d’une profondeur déterminée, b) remplir entièrement lesdits pores (2) d’un matériau choisi parmi le diamant, le carbone-diamant (DLC), l’oxyde de silicium, le nitrure de silicium, des céramiques, des polymères et leurs mélanges, afin de former dans les pores (2) une couche dudit matériau d’une épaisseur au moins égale à la profondeur des pores (2), la forme finale du substrat à base de silicium (1) en fonction de la pièce micromécanique horlogère à fabriquer étant donnée avant l’étape a) ou après l’étape b). L’invention concerne également une pièce micromécanique horlogère comprenant un substrat à base de silicium (1) qui présente, à la surface d’au moins une partie d’une de ses surfaces, des pores (2) d ...

Radiopaque barium-free glass and its use.

Die Erfindung betrifft ein zirkonhaltiges BaO- und PbO-freies röntgenopakes Glas mit einem Brechungsindex n d von 1,54 bis 1,58 und einer hohen Röntgenopazität mit einer Aluminiumgleichwertdicke von mindestens 500%. Das Glas basiert auf dem System SiO 2 B 2 O 3 Al 2 O 3 R 2 O RO La 2 O 3 ZrO 2 mit optionalen Zusätzen von SnO 2 . Das Glas kann insbesondere als Dentalglas oder als optisches Glas eingesetzt werden.

protivokondensatnoe glazing

METHOD OF PRODUCING WINDOW GLASS, CONTAINING POROUS LAYER

Coated metal plate with excellent corrosion resistance and reduced environmental impact

Hygroscopic optical crystal - for lasers with outer (anti)reflecting coating bonded to crystal by glass layer

FUNCTIONAL FILM WITH THE OPTICAL PROPERTIES AND ELECTRIC AMELIOREES

PROCESS OF SURFACE TREATMENT Of a SYNTHETIC RESIN LENS AND PRODUCT THUS OBTAINED

PROCEDE D'OBTENTION DE COUCHES DE VERRES LUMINESCENTS, APPLICATION A LA REALISATION DE DISPOSITIFS MUNIS DE CES COUCHES ET A LA REALISATION DE PHOTOSCINTILLATEURS.

PROCEDE D'OBTENTION DE COUCHES DE VERRES LUMINESCENTS, APPLICATION A LA REALISATION DE DISPOSITIFS MUNIS DE CES COUCHES ET A LA REALISATION DE PHOTOSCINTILLATEURS. CE PROCEDE SE CARACTERISE EN CE QU'IL CONSISTE A PROJETER SUR UN SUPPORT 6 DE PREFERENCE PAR PULVERISATION CATHODIQUE, DE LA MATIERE D'AU MOINS UNE CIBLE 1, CHAQUE CIBLE COMPRENANT DE LA SILICE ET AU MOINS UN COMPOSE CHIMIQUE APTE A DONNER DES CENTRES LUMINESCENTS, TEL QU'UN OXYDE DE CERIUM, DE FACON A FORMER AU MOINS UNE COUCHE 7 DE VERRE LUMINESCENT SUR LEDIT SUPPORT. LA (OU LES) COUCHE(S) FORMEE(S) EST(SONT) DE PREFERENCE SOUMISE(S) A UN TRAITEMENT THERMIQUE TEL QU'UN RECUIT POUR ACCROITRE SON (LEUR) RENDEMENT LUMINEUX. ON PEUT AINSI FORMER UNE COUCHE DE VERRE SCINTILLANT SUR LA FENETRE D'ENTREE PREALABLEMENT DEPOLIE D'UN PHOTOMULTIPLICATEUR POUR OBTENIR UN PHOTOSCINTILLATEUR INTEGRE.

METHOD OF PREPARATION Of an OPTICAL COATING ON a Vacuum SUBSTRATE PAREVAPORATION Of a POWDER

Strip coated aluminum, corrosion resistant and deformable, method for obtaining [...]

Bande brillante ou décorative à base d'aluminium, ou de ses alliages, revêtue d'une protection anti-corrosion améliorée permettant de conserver l'aspect de surface et la protection après formage de ladite bande, caractérisée en ce que le revêtement est constitué d'une couche d'oxyde de silicium.

ARTICLE INCLUDING/UNDERSTANDING A LAYER MESOPOREUSE PROTEGEE BY A COATING MAKING BARRIER WITH THE SEBUM AND MANUFACTORING PROCESS

La présente invention concerne un article comprenant un substrat revêtu d'un revêtement mésoporeux et d'un revêtement faisant barrière au sébum d'épaisseur inférieure ou égale à 20 nm, déposé directement sur le revêtement mésoporeux, comportant au moins une couche à base de silice, ladite couche à base de silice ayant une épaisseur d'au moins 5 nm, comprenant au moins 90 % en masse de silice, par rapport à la masse totale de la couche, et ayant été déposée par dépôt physique en phase vapeur. L'invention concerne également un procédé de préparation d'un tel article et l'utilisation d'un revêtement faisant barrière au sébum tel que défini ci-dessus pour empêcher la pénétration de sébum dans la porosité d'un revêtement mésoporeux formé sur un article.

MANUFACTORING PROCESS Of a GLAZING INCLUDING/UNDERSTANDING a POROUS LAYER

L'invention se rapporte à un procédé de fabrication d'un vitrage comprenant un substrat, notamment verrier, muni d'un revêtement comprenant au moins une couche constituée par un matériau poreux, notamment dont l'indice de réfraction en est ainsi diminué, comprenant les étapes suivantes : - dépôt sur le substrat, par un procédé de dépôt physique en phase vapeur PVD dans une enceinte sous vide, d'un revêtement comprenant une couche d'un matériau comprenant au moins un élément choisi parmi Si, Ti, Sn, Al, Zr, In ou un mélange d'au moins deux de ces éléments, de l'oxygène, du carbone, ladite couche comprenant en outre éventuellement de l'hydrogène, - traitement thermique de la couche ainsi déposée, dans des conditions permettant l'élimination d'au moins une partie du carbone et l'obtention de ladite couche du matériau poreux, ledit procédé se caractérisant en ce que ledit dépôt est réalisé sur le substrat défilant dans ladite enceinte par la pulvérisation cathodique d'une cible en carbone, ...

A METHOD FOR CARRYING OUT A TRANSPARENT COATING ABSORBING AND PRODUCTS OBTAINED

OBJET, TEL QU'ORFEVRERIE PLAQUE OR OU COMPOSANTS DE BRACELETS-MONTRE, POURVU D'UN REVETEMENT PROTECTEUR ET PROCEDE DE REALISATION DE CE REVETEMENT

A.OBJET MANUFACTURE AVEC SURFACE METALLIQUE 12 SUSCEPTIBLE D'ETRE DEGRADEE PAR L'ENVIRONNEMENT PAR CORROSION, ABRASION, TERNISSEMENT OU AUTRES AU COURS DE L'UTILISATION NORMALE DE CET OBJET. B.OBJET CARACTERISE EN CE QU'IL EST POURVU D'UN REVETEMENT PROTECTEUR COMPRENANT UNE MINCE PELLICULE TRANSPARENTE 16 D'UNE MATIERE D'UNE DURETE RESISTANTE A L'ABRASION AU COURS D'UN USAGE NORMAL, LA PELLICULE PROTECTRICE ETANT D'UNE EPAISSEUR CHOISIE EN CORRELATION AVEC L'INDICE DE REFRACTION DE LA MATIERE CONSTITUANT CETTE PELLICULE DE TELLE FACON QUE LA PELLICULE EN PLUS DE SA TRANSPARENCE, SOIT ESSENTIELLEMENT DEPOURVUE DE COLORATION DUE A DES EFFETS D'INTERFERENCE EVENTUELLEMENT PRODUITS SUR L'OBJET PAR DES RAYONS DE LUMIERE INCIDENTE. C.REVETEMENT APPLICABLE NOTAMMENT A LA PROTECTION DE SURFACES D'OBJETS D'ORFEVRERIE.

Film- equipped films with conductive, layers, method for producing films with conductive layers, and method for producing touch panel

COATING STRUCTURE AND FORMING METHOD FOR THE SAME

PHOTOCATALYTIC MULTILAYER METAL COMPOUND THIN FILM AND METHOD FOR PRODUCING SAME

일방향 투시를 위한 인쇄된 패턴 및 보호 하층이 구비된 유리 기판의 제조 방법

... 본 발명은 a) 10 ㎚ 이상의 두께를 가지며 산화물을 기재로 하는 하나 이상의 보호 층을 유리 기판 상에 침착시키고; b) 상이한 조성의 두 개 이상의 층을 보호 층 상에 침착시키며, 여기서 이들 층들 중 하나의 조성은 하나 이상의 무기 안료를 함유하며 유리 프릿을 포함하지 않고, 다른 층의 조성은 하나 이상의 유리 프릿, 및 유리 프릿을 포함하지 않는 층의 안료와 상이한 색상을 갖는 하나 이상의 무기 안료를 함유하는 에나멜이고, 유리 프릿을 포함하지 않는 층을 패널의 표면의 전부 또는 일부에 걸쳐 침착시키고, 에나멜 층을 원하는 패턴(들)의 형태로 스크린 인쇄함으로써 침착시키고; c) 상기 층으로 코팅된 패널을 에나멜을 소성시키기에 충분히 높은 온도로 가열하고; d) 에나멜에 의해 고정되지 않은 안료, 즉 패턴(들) 외부에 위치한 안료를 제거하며, 여기서 안료(들)의 입자 및 유리 프릿(들)의 입자는 유사한 크기를 갖고, 특히 입자의 50%가 7 ㎛ 미만의 크기를 갖는 입자 크기 분포를 가짐을 특징으로 하는, 정확하게 일치하는 복수의 층으로 구성된 하나 이상의 개별 에나멜 패턴을 포함하며 일방향 투시 기능을 제공하는 유리 패널의 제조 방법에 관한 것이다.

Sb-Te 기 합금 소결체 스퍼터링 타겟

Sb 함유량이 10 ∼ 60 at％, Te 함유량이 20 ∼ 60 at％, 잔부가 Ag, In, Ge 에서 선택한 1 종 이상의 원소 및 불가피적 불순물로 이루어지는 스퍼터링 타겟으로서, 산화물의 평균 입경이 0.5 ㎛ 이하인 것을 특징으로 하는 Sb-Te 기 합금 소결체 스퍼터링 타겟. Sb-Te 기 합금 소결체 스퍼터링 타겟 조직의 개선을 도모하고, 스퍼터링시에 아킹의 발생을 방지함과 함께, 스퍼터링막의 열안정성을 향상시키는 것을 목적으로 한다.

Method for manufacturing a micromechanical timepiece part and said micromechanical timepiece part

Sputtering device and method for manufacturing film

Moisture resistant coating for barrier films

PROCESS FOR COATING PARTS MADE OF ALUMINIUM ALLOY AND PARTS OBTAINED THEREFROM

A process is described for coating parts (1) made of an aluminium alloy, in particular made of a die-cast aluminium alloy, comprising the steps of; pre-treating the parts (1); washing the pre-treated parts (1); and depositing the parts on at least one first layer (3) and at least one second layer (5), each one of the first and the second layer (3, 5) being composed of a mixture of two constituents with variable relative molar fractions: 1) a metallic material, and 2) an oxide-based material of an element of Group IVA of the Periodic Table. A part (1) made of an aluminium alloy is further described, made through the above process.

SILICON MONOXIDE VAPOR DEPOSITION MATERIAL AND METHOD FOR PREPARATION THEREOF

In a method for preparing a silicon monoxide vapor deposition material wherein a mixture of a silicon powder and a silicon dioxide powder is heated and reacted in a raw material chamber under vacuum to generate a silicon monoxide gas and silicon monoxide is precipitated on a precipitation substrate in a precipitation chamber provided above the raw material chamber, an improvement which comprises using, as the precipitation substrate, a cylindrical body wherein a circumference wall is inclined from the perpendicular by 1 to 45 degrees and the inner diameter of the upper end thereof is smaller than that of the lower end, and effecting the precipitation under a vacuum of 7 Pa to 40 Pa. The method allows the preparation of a silicon monoxide vapor deposition material exhibiting a weight reduction rate in the rattler test (a rattler value) of 1.0 % or less and being reduced in the occurrence of the splash phenomenon during the formation of a silicon monoxide vapor deposition film.

SILICON MONOXIDE VAPOR DEPOSITION MATERIAL AND PROCESS FOR PRODUCING THE SAME

A silicon monoxide vapor deposition material resulting from powder sintering that is used in the production of silicon monoxide vapor-deposited film, which material is capable of inhibiting splashing. Further, the vapor deposition material ensures a strength capable of enduring uses. For realizing these, the vapor deposition material is prepared by sintering a raw material powder of deposited SiO at 700° to 1000°C. Si deposition during the sintering process is suppressed, and, in the measurement according to XRD, peak intensity P1 at Si peak point occurring around 2θ=28° and base intensity P2 at peak point assumed from an average intensity gradient in the vicinity of the peak point satisfy the relationship P1/P2≤3. Through screened employment of deposited SiO produced by a vacuum aggregation apparatus, the compression failure strength of the vapor deposition material after sintering is enhanced to 5 MPa or higher.

SOIL-RESISTANT COATING FOR GLASS SURFACES

A glass article which has a water-sheeting coating and a method of applying coatings to opposed sides of a substrate are described. In one embodiment, a water-sheeting coating 20 comprising silica is sputtered directly onto an exterior surface of the glass. The exterior face of this water-sheeting coating is substantially non-porous but has an irregular surface. This water-sheeting coating causes water applied to the coated surface to sheet, making the glass article easier to clean and helping the glass stay clean longer. In one method of the invention, interior and exterior surfaces of a glass sheet are cleaned. Thereafter, both surfaces are coated with a water-sheeting coating by sputtering silica directly onto the exterior surface of the sheet of glass. If so desired, both the interior surface and the exterior surface can be applied during the same pass through the same sputter coating apparatus while the glass maintains a constant orientation wherein the interior surface is positioned ...

System and method for forming a gate dielectric

A method of forming a dielectric stack on a pre-treated surface. The method comprises pre-cleaning a semiconductor wafer to remove native oxide, such as by applying hydroflouric acid to form an HF-last surface, pre-treating the HF-last surface with ozonated deionized water, forming a dielectric stack on the pre-treated surface and providing a flow of NH₃ in a process zone surrounding the wafer. Alternately, the method includes pre-treating the HF-last surface with NH₃, forming the stack after the pre-treating, and providing a flow of N₂ in a process zone surrounding the wafer after the forming. The method also includes pre-treating the HF-last surface using an in-situ steam generation process, forming the stack on the pre-treated surface, and annealing the wafer after the forming. The pre-treating includes providing an inert gas flow in a process zone surrounding the HF-last surface, reacting hydrogen with an oxidizer in the process zone for a very short ...

Deposited multi-layer device

The present invention provides a deposited multi-layer device with high reliability, which allows to reduce a weight, a production cost, and to avoid a peeling of a film, a crack and a curl of a substrate. The present invention relates to a deposited multi-layer device formed on a plastic substrate which is coated with a film of a buffer layer being made of an inorganic material on at least one surface of said substrate, wherein a total stress of the buffer layer is not greater than +700 Pa.m and not smaller than -700 Pa.m.

Process for forming thin film having excellent insulating property and metallic substrate coated with insulating material formed by said process

A dense insulating thin film having a remarkably improved insulating property can be formed by a process comprising a first step of forming a first portion of an insulating thin film on a substrate by a sputtering process without exposing the substrate to a plasma or while irradiating the substrate with low energy particles and a second step of forming a second portion of the insulating thin film on the first portion while exposing the substrate to a plasma or while irradiating the substrate with high energy particles, thereby forming said insulating thin film on the substrate. The insulating property in terms of the dielectric breakdown voltage is 100 V or more as determined in a film thickness of 1 mu m or less and an area of 20 mm2.

Magnetic recording medium, method of manufacturing the same, and magnetic recording/reproduction apparatus

According to one embodiment, a perpendicular magnetic recording layer comprises a granular film type recording layer and a continuous film type recording layer. The granular film type recording layer comprises a first granular film type recording layer in which magnetic crystal grains in a film plane has an average crystal grain diameter of 3 to 7 nm, and a second granular film type recording layer including magnetic crystal grains having an in plane average crystal grain diameter larger than that of the magnetic crystal grains of the first granular film type recording layer.

HEATING PLATE WITH PLANAR HEATER ZONES FOR SEMICONDUCTOR PROCESSING

An exemplary method is directed to powering heaters in a substrate support assembly on which a semiconductor substrate is supported. The support assembly has an array of heaters powered by two or more power supply lines and two or more power return lines wherein each power supply line is connected to a power supply and at least two of the heaters and each power return line is connected to at least two of the heaters, and a switching device which independently connects each one of the heaters to one of the power supply lines and one of the power return lines so as to provide time-averaged power to each of the heaters by time divisional multiplexing of switches of the switching device. The method includes supplying power to each of the heaters sequentially using a time-domain multiplexing scheme.

Gas barrier film

The gas barrier film having a thermoplastic polymer film, and an inorganic thin film provided on at least one surface of the thermoplastic polymer film, which gas barrier film is formed by applying, to the inorganic thin film, a solution which contains at least one ion species selected from the group consisting of alkali metal ions, alkaline earth metal ions, and ammonium ions and originating from a low-molecular-weight electrolyte having a molecular weight of 1,000 or less and which has a total ion concentration of the ion species of 1x10-5 mol/L or more and less than 10 mol/L and a solution concentration less than a saturation concentration.

Process for surface treating iron-based alloy and article

A process for surface treating iron-based alloy includes providing a substrate made of iron-based alloy. A chromium layer is then formed on the substrate by vacuum sputtering. A silicon oxide layer, an alumina layer, and a boron nitride layer are formed in that order by vacuum evaporation.

SPUTTERING TARGETS AND ASSOCIATED SPUTTERING METHODS FOR FORMING HERMETIC BARRIER LAYERS

A sputtering target comprises a low Tglass or an oxide of copper or tin. Such target materials can be used to form mechanically-stable thin films that exhibit a self-passivating phenomenon and which can be used to seal sensitive workpieces from exposure to air or moisture. Low Tglass materials may include phosphate glasses such as tin phosphates and tin fluorophosphates, borate glasses, tellurite glasses and chalcogenide glasses, as well as combinations thereof. 1. A sputtering target comprising a sputtering material selected from the group consisting of a low Tglass , a precursor of a low Tglass , and an oxide of copper or tin.2. The sputtering target according to claim 1 , wherein the sputtering material is formed over a thermally conductive backing plate.3. The sputtering target according to claim 1 , wherein the low Tglass or the low Tglass precursor comprises a material selected from the group consisting of a phosphate glass claim 1 , a borate glass claim 1 , a tellurite glass and a chalcogenide glass.4. The sputtering target according to claim 3 , wherein the low Tglass or the low Tglass precursor further comprises a dopant.5. The sputtering target according to claim 1 , wherein the low Tglass or the low Tglass precursor comprises a material selected from the group consisting of a tin phosphate claim 1 , tin fluorophosphate and a tin fluoroborate.6. The sputtering target according to claim 1 , wherein a composition of the low Tglass or the low Tglass precursor comprises:20-100 mol % SnO;{'sub': '2', '0-50 mol % SnF; and'}{'sub': 2', '5', '2', '3, '0-30 mol % POor BO.'}7. The sputtering target according to claim 1 , wherein a composition of the low Tglass or the low Tglass precursor comprises:35-50 mol % SnO,{'sub': '2', '30-40 mol % SnF,'}{'sub': 2', '5', '2', '3, '15-25 mol % POor BO; and'}{'sub': 3', '2', '2', '5, '1.5-3 mol % of at least one dopant oxide selected from the group consisting of WO, CeOand NbO.'}8. The sputtering target according to claim 1 , ...

Sputtering target and manufacturing method thereof, and transistor

One object is to provide a deposition technique for forming an oxide semiconductor film. By forming an oxide semiconductor film using a sputtering target including a sintered body of a metal oxide whose concentration of hydrogen contained is low, for example, lower than 1×10 16 atoms/cm 3 , the oxide semiconductor film contains a small amount of impurities such as a compound containing hydrogen typified by H 2 O or a hydrogen atom. In addition, this oxide semiconductor film is used as an active layer of a transistor.

Reactive sputter deposition of dielectric films

Reactive sputter deposition method and system are disclosed, in which a catalyst gas, such as water vapor, is used to increase the overall deposition rate substantially without compromising formation of a dielectric compound layer and its optical transmission. Addition to the sputtering or reactive gas of the catalyst gas can result in an increase of a deposition rate of the dielectric oxide film substantially without increasing an optical absorption of the film.

Vapor-deposited film having barrier performance

Such a vapor-deposited barrier film is provided that has a vapor-deposited layer having uniform film quality, a high film density and high barrier performance in the initial stage. The vapor-deposited barrier film contains a substrate having on at least one surface thereof at least one layer of a vapor-deposited layer (a). The vapor-deposited layer (a) contains a metal oxide, has a thickness of from 10 to 500 nm, and has an average value of an elemental ratio of oxygen (O) and the metal (oxygen (O)/metal) of 1.20 or more and 1.90 or less and a difference between the maximum value and the minimum value of the (oxygen (O)/metal) of 0.35 or less on analysis of the vapor-deposited layer in the depth direction thereof by an X-ray photoelectron spectroscopy (ESCA) method.

Heating plate with planar heater zones for semiconductor processing

An exemplary method for manufacturing a heating plate for a substrate support assembly includes forming holes in at least one sheet, printing a slurry of conductor powder, or pressing a precut metal foil, or spraying a slurry of conductor powder, on the at least one sheet to form the planar heater zones, the power supply lines, and power return lines. The holes in the at least one sheet are filled with a slurry of conductor powder to form power supply and power return vias. The sheets are then aligned, pressed, and bonded to form the heating plate.

Apparatus for manufacturing an adhesive-free gas barrier film having a ceramic barrier layer

The present invention relates to an apparatus for manufacturing an adhesive-free gas barrier film comprising conveying means for conveying a film web; at least one first lock system for introducing the film web into a coating chamber of the apparatus; at least one first coating means by means of which the film web can be at least partially coated by depositing a barrier material in the coating chamber; and optionally at least one second lock system for expelling the film web out of the coating chamber; and at least one second coating means by means of which the coated film web can be at least partially coated by extrusion of a plastic melt.

Heating plate with planar heater zones for semiconductor processing

A heating plate of a semiconductor substrate support for supporting a semiconductor substrate in a plasma processing chamber includes a first layer with an array of heater zones operable to tune a spatial temperature profile on the semiconductor substrate, and a second layer with one or more primary heaters to provide mean temperature control of the semiconductor substrate. The heating plate can be incorporated in a substrate support wherein a switching device independently supplies power to each one of the heater zones to provide time-averaged power to each of the heater zones by time divisional multiplexing of the switches.

EXTENSIBLE BARRIER FILMS, ARTICLES EMPLOYING SAME AND METHODS OF MAKING SAME

There is provided a barrier film including a barrier layer having two opposing major surfaces, a first organic layer in direct contact with one of the opposing major surfaces of the barrier layer; a second organic layer in direct contact with the other of the opposing major surfaces of the barrier layer; and a substrate in direct contact with the first organic layer or the second organic layer; wherein the barrier layer comprises buckling deformations with average spacing smaller than average spacing of the buckling deformations in the first or second organic layer. 1. A barrier film comprising:(e) a barrier layer having two opposing major surfaces;(f) a first organic layer in direct contact with one of the opposing major surfaces of the barrier layer; and(g) a second organic layer in direct contact with the other of the opposing major surfaces of the barrier layer;(h) a substrate in direct contact with the first organic layer or the second organic layer;wherein the barrier layer comprises buckling deformations with average spacing smaller than average spacing of the buckling deformations in the first or second organic layer.2. A barrier film comprising:(e) a barrier layer having two opposing major surfaces, wherein the barrier layer comprises buckling deformations;(f) a first organic layer in direct contact with one of the opposing major surfaces of the barrier layer;(g) a second organic layer in direct contact with the other of the opposing major surfaces of the barrier layer; and(h) a substrate in direct contact with the first organic layer or the second organic layer;wherein each of the first organic layer and the second organic layer has a conformable surface conforming to a shape of the barrier layer; andwherein each of the first organic layer and the second organic layer has a substantially flat surface disposed opposite to and spaced apart from the conformable surface.3. The barrier film of any of to , wherein the substrate is heat-shrinkable.4. The barrier ...

ANTI-CORROSION FILM, METAL SUBSTRATE WITH ANTI-CORROSION LAYER AND MANUFACTURING METHOD THEREOF

The present invention relates to an anti-corrosion film, a metal substrate with an anti-corrosion layer and a manufacturing method thereof. The anti-corrosion film is at least one selected from the group consisting of: a Zr-based metallic glass film formed of Formula 1, a Zr—Cu-based metallic glass film formed of Formula 2, and a Ti-based metallic glass film formed of Formula 3, Formula 4 or Formula 5, wherein Formula 1 to Formula 5 are as described in the specification. 1. An anti-corrosion film , comprising at least one selected from the group consisting of: a Zr-based metallic glass film formed of Formula 1 , a Zr—Cu-based metallic glass film formed of Formula 2 , and a Ti-based metallic glass film formed of Formula 3 , Formula 4 or Formula 5 ,{'br': None, 'sub': a', 'b', 'c', 'd', '100-x', 'x, '(ZrCuNiAl)Si, \u2003\u2003[Formula 1]'} {'br': None, 'sub': e', 'f', 'g', 'h', '100-y', 'y, '(ZrCuAlAg)Si, \u2003\u2003[Formula 2]'}, 'wherein, 45≦a≦75, 25≦b≦35, 5≦c≦15, 5≦d≦15, and 0.1≦x≦10,'} {'br': None, 'sub': i', 'j', 'k', 'l', 'm, 'TiCuPdZrSi, \u2003\u2003[Formula 3]'}, 'wherein, 35≦e≦55, 35≦f≦55, 5≦g≦15, 5≦h≦15, and 0.1 ≦y≦10,'} {'br': None, 'sub': n', 'o', 'p', 'q, 'TiTaSiZr, \u2003\u2003[Formula 4]'}, 'wherein, 40≦i≦75, 30≦j≦40, 10≦k≦20, 5≦l≦15, and 0.05≦m≦2,'} {'br': None, 'sub': r', 's', 't', 'u, 'TiCuZrPd, \u2003\u2003[Formula 5]'}, 'wherein, 30≦n≦80, 0≦o≦40, 1≦p≦20, and 5≦q≦40,'}wherein, 40≦r≦75, 30≦s≦40, 5≦t≦15, and 10≦u≦20.2. The anti-corrosion film of claim 1 , wherein the anti-corrosion film is the Zr-based metallic glass film formed of Formula 1 claim 1 , the Zr—Cu-based metallic glass film formed of Formula 2 claim 1 , or the Ti-based metallic glass film formed of Formula 3 claim 1 , Formula 4 or Formula 5.3. The anti-corrosion film of claim 1 , wherein the anti-corrosion film is a (ZrCuNiAl)Simetallic glass film or a (ZrCuAlAg)Simetallic glass film.4. A metal substrate with an anti-corrosion layer claim 1 , comprising:a metal substrate; and {'br': None ...

COATINGS OF NON-PLANAR SUBSTRATES AND METHODS FOR THE PRODUCTION THEREOF

A coated article is described herein that may comprise a substrate and an optical coating. The substrate may have a major surface comprising a first portion and a second portion. A first direction that is normal to the first portion of the major surface may not be equal to a second direction that is normal to the second portion of the major surface. The optical coating may be disposed on at least the first portion and the second portion of the major surface. The coated article may exhibit at the first portion of the substrate and at the second portion of the substrate hardness of about 8 GPa or greater at an indentation depth of about 50 nm or greater as measured on the anti-reflective surface by a Berkovich Indenter Hardness Test. 1. A coated article comprising:a substrate having a major surface, the major surface comprising a first portion and a second portion, wherein a first direction that is normal to the first portion of the major surface is not equal to a second direction that is normal to the second portion of the major surface, and the angle between the first direction and the second direction is in a range of from about 10 degrees to about 180 degrees; andan optical coating disposed on at least the first portion and the second portion of the major surface, the optical coating forming an anti-reflective surface, wherein:the coated article exhibits at the first portion of the substrate and at the second portion of the substrate hardness of about 8 GPa or greater;the coated article exhibits a photopic reflectance as measured at the anti-reflective surface at the first portion of the substrate of about 2% or less, wherein the photopic reflectance of the first portion is measured at a first incident illumination angle relative to the first direction, wherein the first incident illumination angle comprises an angle in the range from about 0 degrees to about 60 degrees from the first direction;the coated article exhibits a photopic reflectance as measured at the ...

ULTRAVIOLET RADIATION SHIELD LAYER

A method is provided to fabricate a wafer including a bonding layer interposed between a device wafer and a handle wafer. The method includes performing a first deposition process to deposit an ultraviolet (UV) shield layer on a backside surface of the handle wafer. A second deposition process is performed to deposit a stress compensation layer on an exposed surface of the UV shield layer. The UV shield layer blocks UV energy generated while performing the second deposition process from reaching the bonding layer. 1. A method of fabricating a wafer , the method comprising:performing a first deposition process on a wafer stack, the wafer stack including a bonding layer interposed between a device wafer and a handle wafer;depositing an ultraviolet (UV) shield layer on a backside surface of the handle wafer according to the first deposition process; andperforming a second deposition process on the wafer stack to deposit a stress compensation layer on an exposed surface of the UV shield layer,wherein the UV shield layer blocks UV energy generated while performing the second deposition process from reaching the bonding layer.2. The method of claim 1 , wherein the UV shield layer completely covers the backside surface of the handle wafer.3. The method of claim 1 , wherein the stress compensation layer completely covers the exposed surface of the UV shield layer.4. The method of claim 1 , wherein the first and second deposition processes each include a physical vapor deposition (PVD) process.5. The method of claim 4 , wherein the UV shield layer comprises tantalum (Ta).6. The method of claim 5 , wherein the UV shield layer has a thickness of at least 0.1 μm.7. The method of claim 5 , wherein the stress compensation layer comprises silicon dioxide (SiO).8. The method of claim 7 , wherein the bonding layer includes an adhesive comprising an organic material claim 7 , the adhesive configured to maintain bonding at a temperature ranging from about 250 degrees Celsius (° C.) to ...

Optical element, optical thin film forming apparatus, and optical thin film forming method

In forming an optical thin film on a curved surface of a material to be deposited, a specific space, which is part of a space in a processing chamber and is a space between an arrangement part and a target, is surrounded by a shielding part. In this state, when deposition is performed by a sputtering step in which a voltage is applied to the target in the processing chamber which is in a vacuum state and supplied with an active gas and an inert gas, an optical thin film of a substantially equal optical thickness is formed on the curved surface.

METHOD FOR APPLYING A METAL PROTECTIVE COATING TO A SURFACE OF A STEEL PRODUCT

A method for applying a metallic protective coating to a surface of a steel product, where another surface is to remain free from the metallic protective coating, may involve applying the metallic protective coating by hot dip coating in a hot dip coating bath. A preliminary coating may be applied to the surface that is to remain free from the metallic protective coating prior to the hot dip coating. The preliminary coating may include SiOand may prevent the metallic protective coating from adhering to the intended surface during hot dip coating. Thus one surface of a steel product may be provided with a metallic protective coating, and another surface of the steel product may be kept free from the protective coating, all with a minimum of cost and complexity and with optimized resource economics. Further, the preliminary coating, deposited from a gas phase to that surface of the steel product that is to be kept free from the metallic protective coating, may be a layer that includes amorphous silicon dioxide and has a layer thickness of 0.5-500 nm.” 115-. (canceled)16. A method for applying a metallic protective coating to a first surface of a steel product , wherein a second surface of the steel product is to remain free from the metallic protective coating , the method comprising:applying a preliminary coating comprising SiO2 to the second surface of the steel product, the preliminary coating for preventing the metallic protective coating from adhering to the second surface, wherein the preliminary coating is deposited from a gas phase to the second surface, wherein the preliminary coating applied to the second surface is a layer that comprises amorphous silicon dioxide and has a layer thickness of 0.5-500 nm; andapplying the metallic protective coating by hot dip coating in a hot dip coating bath after the preliminary coating has been applied to the second surface of the steel product.17. The method of comprising depositing the preliminary coating by flame ...

OPTICAL MEMBER AND METHOD FOR PRODUCING OPTICAL MEMBER

The present invention provides an optical member excellent in antifouling properties, rubbing resistance, and antifog properties. The optical member of the present invention includes, on a surface thereof, an uneven structure provided with multiple projections at a pitch not longer than a wavelength of visible light, the projections each including a hydrophilic portion at its tip. Preferably, each of the projections is formed from a hydrophobic resin and has its tip covered with a hydrophilic material, the hydrophilic material contains silicon dioxide, and the hydrophilic material has a thickness of 30 nm or smaller. 1. An optical member comprising , on a surface thereof , an uneven structure provided with multiple projections at a pitch not longer than a wavelength of visible light ,each of the projections being formed from a hydrophobic resin, having its tip covered with a hydrophilic material, and including a hydrophilic portion covered with the hydrophilic material at the tip and a hydrophobic portion where the hydrophobic resin is exposed.2. (canceled)3. The optical member according to claim 1 ,wherein the hydrophilic material contains silicon dioxide.4. The optical member according to claim 1 ,wherein the hydrophilic material has a thickness of 30 nm or smaller.5. (canceled)6. A method for producing the optical member according to claim 1 , comprisingforming a film of the hydrophilic material at the tip of each of the projections.7. The method for producing the optical member according to claim 6 ,wherein the film is formed by plasma deposition.8. The optical member according to claim 1 ,wherein each of the projections has a height of 50 nm or greater and 600 nm or smaller.9. The optical member according to claim 8 ,wherein each of the projections has a height of 100 nm or greater and 300 nm or smaller. The present invention relates to optical members and methods for producing optical members. More specifically, the present invention relates to an optical ...

RADIO-WAVE-PENETRABLE LAYER HAVING METALLIC LUSTER

Disclosed is a coating layer penetrable by radio wave and having a metallic luster. The coating layer includes a resin layer as an outmost layer to an exterior or front, a metallic texture layer formed on a rear side of the resin layer and comprising a optical film layer including metal oxides having different refractive indexes, and a germanium (Ge) layer to reflect light and a reflection layer formed on the rear side of the metallic texture layer. 114-. (canceled)15. A method of producing a coating layer , comprising:washing and activating a surface of a resin layer using a plasma converted from argon gas;radiating an electron beam using a first refractive material and a second refractive material to form a multilayered optical film layer on the surface of the resin layer,radiating an electron beam using germanium to form a germanium layer.16. The method of claim 15 , wherein the first refractive material comprises TiOand/or CrO.17. The method of claim 15 , wherein the second refractive material comprises SiO.18. The method of claim 15 , wherein the germanium layer is formed on a front side of the multilayered optical film layer claim 15 , on a rear side of the multilayered optical film layer claim 15 , or between the first refractive material and the second refractive material. The present application claims priority to Korean Patent Application No. 10-2015-0175332, filed Dec. 9, 2015 and No. 10-2016-0115705, filed Sep. 8, 2016, the entire content of which is incorporated herein for all purposes by this reference.The present invention relates to a coating layer, or particularly a radio-wave-penetrable coating layer having a metallic luster, such that the coating layer of the present invention may protect SCC radar while radio waves may penetrate the coating layer.A smart cruise control (SCC) system detects movement of a preceding vehicle using a radar mounted on a front portion of a vehicle, thereby controlling engine and brakes to maintain a distance from the ...

Method for depositing an amorphous layer primarily containing fluorine and carbon, and device suited for carrying out this method

A method for depositing, under vacuum, an amorphous layer primarily containing fluorine and carbon onto a substrate (), characterized in that it comprises a step for depositing this layer with an ion gun () for ejecting ions in the form of a beam of accelerated ions that is created from at least one compound containing fluorine and carbon in a gaseous form or saturated vapor supplied to the ion canon. A method of this type makes it possible, in particular, to improve the adherence of an outer layer having a low index of refraction to the underlying layer of an anti-reflective stack. A device suited for carrying out the method is also described. 1. A method of depositing an amorphous layer containing fluorine and carbon on a substrate in a vacuum , comprising:depositing said amorphous layer via an ion gun adapted to eject ions in a form of a beam of accelerated ions created from at least one compound containing fluorine and carbon in gas or saturated vapor form fed to the ion gun,wherein the substrate is an ophthalmic lens, and the amorphous layer containing fluorine and carbon is an exterior layer of an antireflection stack of the ophthalmic lens.2. The method according to claim 1 , wherein the ion gun is fed with the at least one compound containing fluorine and carbon mixed with oxygen or at least one rare gas.3. The method according to claim 1 , wherein the compound containing fluorine and carbon comprises at least one aliphatic or cyclic fluorocarbon compound claim 1 , at least one aliphatic or cyclic fluorinated hydrocarbon claim 1 , or a mixture thereof.4. The method according to claim 1 , wherein the compound containing fluorine and carbon comprises perfluorocyclobutane (c-CF) or a mixture with at least one other fluorocarbon compound comprising tetrafluoromethane (CF) or hexafluoromethane (CF).5. The method according to claim 1 , wherein the substrate is formed from plastic.6. The method according to claim 1 , further comprising fabricating the ...

SEMICONDUCTOR DEVICE, BASE, AND METHOD FOR MANUFACTURING SAME

A semiconductor device includes a base and a semiconductor element disposed on the base. The base includes: a base member, a reflective film located above the base member, the reflective film containing silver as a major component and containing particles formed of at least one material selected from the group consisting of an oxide, a nitride, and a carbide; and a dielectric multilayered film located above the reflective film. 1. A semiconductor device comprising: a base member,', 'a reflective film located above the base member, the reflective film containing silver as a major component and containing particles formed of at least one material selected from the group consisting of an oxide, a nitride, and a carbide, and', 'a dielectric multilayered film located above the reflective film; and, 'a base comprisinga semiconductor element disposed on the base.2. The semiconductor device according to claim 1 , wherein a content of the particles in the reflective film is at least 0.01% by mass and at most 5% by mass with respect to a total mass of the reflective film.3. The semiconductor device according to claim 1 , wherein the particles are in contact with the dielectric multilayered film or distributed near a surface of the reflective film closer to the dielectric multilayered film.4. The semiconductor device according to claim 1 , wherein the particles are dispersed throughout the reflective film.5. The semiconductor device according to claim 1 , wherein the particles are unevenly distributed and concentrated at or near an upper surface of the reflective film.6. The semiconductor device according to claim 1 , wherein the particles contained in the reflective film are formed of at least one material selected from the group consisting of GaO claim 1 , NbO claim 1 , and HfO.7. The semiconductor device according to claim 1 , wherein:the dielectric multilayered film comprises two or more types of films each containing an oxide or nitride of at least one element selected ...

TOUCH PANEL STRUCTURE, METHOD FOR FORMING THE SAME AND TOUCH DEVICE HAVING THE SAME

The present invention discloses a touch panel structure, a method for forming the same and a touch device having the same. A touch panel structure of the present invention comprises a substrate, a color layer, an inorganic layer, and a photoresist layer. The color layer is disposed on a surface of the substrate. The inorganic layer is disposed on a surface of the color layer which is opposite to the substrate. The photoresist layer is disposed on a surface of the inorganic layer which is opposite to the substrate, wherein the color layer and the photoresist layer have different surface tensions. For electronic products that rely on the Colorful OGS (One Glass Solution) technology, by providing an inorganic layer between the color layer and the photoresist layer, problems related to different surface tensions when the layers are stacked during the manufacturing process of a touch panel can be solved. 1. A touch panel structure , comprising:a substrate;a color layer disposed on the substrate;an inorganic layer disposed on a surface of the color layer which is opposite to the substrate; anda photoresist layer disposed on a surface of the inorganic layer which is opposite to the color layer,wherein the color layer and the photoresist layer have different surface tensions.2. The touch panel structure according to claim 1 , wherein the color layer comprises ink.3. The touch panel structure according to claim 1 , wherein the inorganic layer comprises a ceramic material.4. The touch panel structure according to claim 3 , wherein the ceramic material comprises silicon oxide (SiO) or silicon nitride (SiN).5. A method for forming a touch panel structure claim 3 , comprising:providing a substrate;providing a color layer on the substrate;providing an inorganic layer on a surface of the color layer which is opposite to the substrate; andproviding a photoresist layer on a surface of the inorganic layer which is opposite to the color layer,wherein the color layer and the ...

Method And System For Producing Coated Steel Components

A coated steel component is provided. The coated steel component includes a substrate composed of a steel sheet which can be supplied to a hot-forming process. The coated steel component also possesses a non-metallic coating on the basis of silicon, in a layered structure. The layered structure includes three functional layers having the composition SiOxNyCz, wherein x lies between 30 and 70%, y lies between 0 and 35%, and z lies between 0 and 50%.

LAMINATED MAGNETIC INDUCTOR STACK WITH HIGH FREQUENCY PEAK QUALITY FACTOR

Embodiments are directed to a method of forming a magnetic stack arrangement of a laminated magnetic inductor having a high frequency peak quality factor (Q). A first magnetic stack is formed having one or more magnetic layers alternating with one or more insulating layers in a first inner region of a laminated magnetic inductor. A second magnetic stack is formed opposite a surface of the first magnetic stack in an outer region of the laminated magnetic inductor. A third magnetic stack is formed opposite a surface of the second magnetic stack in a second inner region of the laminated magnetic inductor. The insulating layers are formed such that a thickness of an insulating layer in the second magnetic stack is greater than a thickness of an insulating layer in the first magnetic stack. 1. A laminated magnetic inductor comprising:a first inner region comprising one or more magnetic layers alternating with one or more insulating layers;an outer region comprising one or more magnetic layers alternating with one or more insulating layers, the outer region formed opposite a surface of the first inner region; anda second inner region comprising one or more magnetic layers alternating with one or more insulating layers, the second inner region formed opposite a surface of the outer region.2. The laminated magnetic inductor of claim 1 , wherein a thickness of an insulating layer in the outer region is greater than a thickness of an insulating layer in either the first or second inner regions.3. The laminated magnetic inductor of claim 2 , further comprising:a substrate;a first dielectric layer positioned between the substrate and the first inner region;a second dielectric layer formed opposite a surface of the second inner region; anda conductive coil helically wrapping through portions of the first and second dielectric layers.4. The laminated magnetic inductor of claim 2 , wherein the one or more insulating layers in the first inner region each comprise a thickness of ...

MULTI-LAYER ANTIREFLECTIVE COATED ARTICLES

Coated articles demonstrating antireflective properties are provided. Exemplary coated articles comprise a substrate and two or three coating layers applied to at least one surface of the substrate; the coatings are deposited from sol-gel compositions comprising a silane. Each adjacent coating layer demonstrates a different refractive index. The coated article further comprises an outermost anti-fouling coating layer applied to at least one surface of a coating layer. Processes for forming the coated articles are also provided. 1. A coated article comprising:(A) a substrate;(B) a first coating layer applied directly to at least one surface of the substrate; wherein the first coating layer has a dry film thickness of 90 to 150 nm and is formed from a sol-gel composition comprising at least an alkoxysilane and wherein the first coating layer demonstrates a refractive index of 1.62 to 1.85;(C) a second coating layer applied to at least one surface of the first coating layer; wherein the second coating layer has a dry film thickness of 87 to 97 nm and is formed from an acidic sol-gel composition comprising a silane and wherein the second coating layer demonstrates a refractive index of 1.40 to 1.48; and(D) an anti-fouling coating layer applied to at least one surface of the second coating layer.2. The coated article of claim 1 , wherein the substrate (A) comprises glass claim 1 , polymethylmethacrylate claim 1 , polycarbonate claim 1 , polyethylene terephthalate (PET) claim 1 , polyurea-urethane claim 1 , polyamide claim 1 , cellulose triacetate (TAC) claim 1 , cyclo olefin polymer (COP) or poly (allyl diglycol carbonate).3. The coated article of claim 1 , wherein the substrate (A) comprises glass or polymethylmethacrylate; and the first coating layer (B) is formed from a sol-gel composition comprising: (a) tetraalkoxysilane;', '(b) an epoxy functional trialkoxysilane;', '(c) a metal-containing catalyst; and', '(d) a solvent component; and, '(1) a resin component ...

PROCESS FOR MANUFACTURING GLAZING COMPRISING A POROUS LAYER

A process for manufacturing glazing including a substrate provided with a coating including a layer consisting of a porous material, includes depositing on the substrate, via a physical vapor deposition (PVD) process in a vacuum chamber, a coating including a layer of a material including an element selected from Si, Ti, Sn, Al, Zr, In or a mixture of at least two of these elements, oxygen and carbon, the layer in addition optionally including hydrogen, heat treatment of the layer thus deposited, under conditions that enable at least one portion of the carbon to be removed and the layer of porous material to be obtained, wherein the deposition is carried out, on the substrate passing through the chamber, by the sputtering of a carbon target, under a reactive plasma atmosphere including a precursor of the element or elements. 1. A process for manufacturing glazing comprising a provided with a coating comprising at least one layer consisting of a porous material , for which the refractive index is thus reduced thereby , comprising:depositing on the substrate, via a physical vapor deposition (PVD) process in a vacuum chamber, a coating comprising a layer of a material comprising at least one element selected from Si, Ti, Sn, Al, Zr, In or a mixture of at least two of said elements, oxygen and carbon, said layer in addition optionally comprising hydrogen,heat treatment of the layer thus deposited, under conditions that enable at least one portion of the carbon to be removed and said layer of porous material to be obtained,wherein said deposition is carried out, on the substrate passing through said chamber, by the sputtering of a carbon target, under a reactive, plasma atmosphere comprising at least one precursor of the element or elements.2. The process as claimed in claim 1 , wherein the power applied to the cathode is between 0.5 and 20 kW/m.3. The process as claimed in claim 1 , wherein the total pressure of the gases in the vacuum chamber is between 0.1 and 2 Pa.4. ...

Fabrication of hierarchical silica nanomembranes and uses thereof for solid phase extraction of nucleic acids

The present invention provides a novel method to fabricate silica nanostructures on thin polymer films based on silica deposition and self-wrinkling induced by thermal shrinkage. These micro- and nano-scale structures have vastly enlarged the specific area of silica, thus the silica nanomembranes can be used for solid phase extraction of nucleic acids. The inventive silica nanomembranes are suitable for nucleic acid purification and isolation and demonstrated better performance than commercial particles in terms of DNA recovery yield and integrity. In addition, the silica nanomembranes have extremely high nucleic acid capacity due to its significantly enlarged specific surface area of silica. Methods of use and devices comprising the silica nanomembranes are also provided.

Laminates and gas barrier films

A laminate includes a substrate; an atomic layer deposition film that is disposed on at least one surface of the substrate, and is made of an inorganic material; and a protective film that is bonded to and covers the atomic layer deposition film, and has an adhesive layer that is in contact with the atomic layer deposition film.

TRANSPARENT GAS BARRIER LAMINATE FILM AND ELECTRONIC PAPER USING THE SAME

A transparent gas barrier laminate film in which a gas barrier layer including an inorganic thin film layer is formed on at least one surface of a first transparent plastic film substrate, and the surface of the first transparent plastic film substrate on which the gas barrier layer is formed and one surface of a second transparent plastic film substrate are bonded to each other with a first adhesive layer interposed therebetween, and a seal layer is formed on the other surface of the first transparent plastic film substrate or the second transparent plastic film substrate. 1. A transparent gas barrier laminate film , comprising:a gas barrier layer including an inorganic thin film layer is formed on at least one surface of a first transparent plastic film substrate, and the surface of the first transparent plastic film substrate on which the gas barrier layer is formed and one surface of a second transparent plastic film substrate are bonded to each other with a first adhesive layer interposed therebetween, anda seal layer is formed on the other surface of the first transparent plastic film substrate or the second transparent plastic film substrate.2. The transparent gas barrier laminate film of claim 1 , wherein the second transparent plastic film substrate is a polypropylene film.3. The transparent gas barrier laminate film of claim 1 , wherein the gas barrier layer includes the inorganic thin film layer and a gas barrier cover layer formed on the inorganic thin film layer.4. The transparent gas barrier laminate film of claim 1 , wherein a coefficient of thermal shrinkage of the second transparent plastic film substrate at 150° C. for 30 minutes is in a range of 5% or more and 15% or less.5. The transparent gas barrier laminate film of claim 1 , wherein a third transparent plastic film substrate is disposed via a second adhesive layer on a surface opposite to a surface on which the seal layer is formed.6. The transparent gas barrier laminate film of claim 5 , ...

TRANSPARENT CONDUCTIVE FILM

Provided is a transparent conductive film having excellent moist-heat resistance and capable of maintaining a low specific resistance value. The present invention relates to a transparent conductive film including: a transparent film substrate; at least three undercoat layers; and a crystalline transparent conductive layer in this order, wherein: the at least three undercoat layers include: a first undercoat layer formed by a wet coating method; a second undercoat layer that is a metal oxide layer having an oxygen deficient; and a third undercoat layer that is a metal oxide layer having a stoichiometric composition from a side of the film substrate; the transparent conductive layer has a surface roughness Ra of 0.1 nm or more and 1.6 nm or less; and the transparent conductive film has specific resistance of 1.1×10Ω·cm or more and 3.8×10Ω·cm or less. 1. A transparent conductive film comprising:a transparent film substrate;at least three undercoat layers; anda crystalline transparent conductive layer in this order,wherein:the at least three undercoat layers comprise:a first undercoat layer formed by a wet coating method;a second undercoat layer that is a metal oxide layer having an oxygen deficient; anda third undercoat layer that is a metal oxide layer having a stoichiometric composition from a side of the film substrate;the transparent conductive layer has a surface roughness Ra of 0.1 nm or more and 1.6 nm or less; and{'sup': −4', '−4, 'the transparent conductive film has specific resistance of 1.1×10Ω·cm or more and 3.8×10Ω·cm or less.'}2. The transparent conductive film according to claim 1 , wherein the second undercoat layer and the third undercoat layer are formed by a sputtering method.3. The transparent conductive film according to claim 1 , wherein a laminated body of the film substrate and the at least three undercoat layers has water vapor permeability of 0.01 g/m·day or more and 3.0 g/m·day or less.4. The transparent conductive film according to claim 1 ...

PROCESS FOR MANUFACTURING A GLASS SUBSTRATE EQUIPPED WITH PRINTED PATTERNS AND A PROTECTIVE UNDERLAYER FOR ONE-WAY VISION

The present invention relates to a process for manufacturing a one-way vision glass pane comprising one or more separate enamel patterns composed of a number of exactly aligned layers, characterized in that: 1. A process for manufacturing a one-way vision glass pane comprising one or more separate enamel patterns which comprise a number of exactly aligned layers , the process comprising:(a) depositing at least one protective layer based on an oxide and having a thickness greater than or equal to 10 nm on a glass substrate,(b) depositing at least two layers of different compositions on the at least one protective layer, the at least two layers comprising a layer that comprises at least one mineral pigment which layer is free of glass frit, the at least two layers further comprising a layer that comprises an enamel that comprises at least one glass frit and at least one mineral pigment having a color different from that of the layer free of glass frit, wherein the layer free of glass frit is deposited over all or some of a surface of the pane and the layer of enamel is deposited by screen printing in a shape of a desired pattern, thereby obtaining a pane coated with at least three layers,(c) heating the pane coated with said at least three layers at a temperature sufficient to fire the enamel, and(d) removing a portion of pigments not fixed by the enamel located outside of the pattern, thereby obtaining the one-way vision glass pane comprising one or more separate enamel patterns which comprise a number of exactly aligned layers,wherein particles of the pigments and particles of the at least one glass frit have a similar size.2. The process of claim 1 , wherein the layer free of glass frit is deposited on the protective layer over a thickness of between 4 and 15 μm claim 1 , then the layer of enamel is deposited by screen printing over a thickness of between 10 and 100 μ.m.3. The process of claim 1 , wherein the layer of enamel is deposited on the protective layer ...

LAMINATED FILM

The invention provides a laminated film containing at least a base material layer, a covering layer, and an inorganic thin-film layer in this order, wherein (a) the base material layer comprises a resin composition that contains at least 70 mass % of polybutylene terephthalate resin; (b) the laminated film has a piercing strength of 0.6 N/μm or more as measured in accordance with JIS Z 1707 after having undergone a 95° C.-boiling treatment for 30 minutes; (c) the base material layer has a surface orientation degree of 0.144-0.160; and (d) when the value of oxygen transmission rate obtained by measuring the laminated film under a 23° C.×65% RH condition is defined as (A) and the value of oxygen transmission rate obtained by measuring same under a 40° C.×90% RH condition is defined as (B), the barrier value deterioration rate of the laminated film, as calculated as (B/A)×100, is 300% or less. 1. A laminated film that comprises at least three layers of a base material layer/a covering layer/an inorganic thin film layer laminated in this order and satisfies the following requirements (a)-(d):(a) the base material layer comprises a resin composition that contains 70 mass % or more of polybutylene terephthalate resin;(b) the laminated film has a piercing strength of 0.6 N/μm or more as measured in accordance with JIS Z 1707 after having undergone a 95° C.-boiling treatment for 30 minutes;(c) the base material layer has a surface orientation degree of 0.144-0.160; and {'br': None, 'i': 'B/A', 'Barrier value deterioration rate (%)under high-temperature and high-humidity condition=()×100'}, '(d) when the value of oxygen transmission rate obtained by measuring the laminated film under a 23° C.×65% RH condition is defined as (A) and the value of oxygen transmission rate obtained by measuring same under a 40° C.×90% RH condition is defined as (B), the barrier value deterioration rate, determined by the following formula, of the laminated film is 300% or less under high- ...

COLORED MULTILAYER OXIDE COATINGS

Colored oxide coatings having multiple oxide layers are described. Processes for forming the multilayer oxide coating can include converting a portion of a metal substrate to a primary oxide layer, coloring the primary oxide layer, and depositing a secondary oxide layer on the primary oxide layer. The primary oxide layer and the secondary oxide layer can be at least partially transparent such that a texture of an underlying metal substrate surface is visible through the multilayer oxide coating. A top surface of the secondary oxide layer can be polished to a high gloss to give the multilayer oxide coating an appearance of depth. 1. An enclosure for an electronic device , the enclosure including a metal substrate having a multilayer oxide coating , the multilayer oxide coating comprising:a primary oxide layer on the metal substrate, the primary oxide layer characterized as having a color; anda secondary oxide layer on the primary oxide layer, the secondary oxide layer composed of a different oxide than the primary oxide layer and being sufficiently transparent such that the color of the primary oxide layer is visible through the secondary oxide layer.2. The enclosure of claim 1 , wherein an outer surface of the secondary oxide layer corresponds to an outer surface of the enclosure.3. The enclosure of claim 2 , wherein the primary oxide layer has a porous microstructure claim 2 , wherein a colorant is infused within pores of the porous microstructure.4. The enclosure of claim 1 , wherein the primary oxide layer is composed of aluminum oxide and the secondary oxide layer is composed of one or more of silicon oxide claim 1 , titanium oxide claim 1 , zirconium oxide and aluminum oxide.5. The enclosure of claim 1 , wherein primary oxide layer is at least partially transparent such that a texture of a surface the metal substrate is visible through the multilayer oxide coating.6. The enclosure of claim 1 , wherein the primary oxide layer has a thickness ranging from about 5 ...

METHOD FOR DEVELOPING A COATING HAVING A HIGH LIGHT TRANSMISSION AND/OR A LOW LIGHT REFLECTION

A method for developing a coating having a high light transmission and/or a low light reflection is provided. The method relates to a process for developing a coating with a high light transmission and/or a low light reflection, where the coating is deposited on a substrate. The coating is deposited as a mixed coating comprising a material A and a material B, where the coating is developed to have a coating thickness profile in which the lowest proportion of the material B is on the substrate surface and the highest proportion of coating material is on the coating surface. The material B is at least partially removed from the coating after deposition of the coating on the substrate. 1. A method for developing a coating with a high light transmission and/or a low light reflection , the method comprising:depositing the coating on a substrate, wherein the coating is deposited as a mixed coating comprising a material A and a material B, wherein the coating is developed with a gradient over the coating thickness profile such that the lowest proportion of the material B is on the substrate surface and the highest proportion is on the coating surface; andat least partially removing the material B from the coating after the coating is deposited on the substrate.2. The method according to claim 1 , wherein a wet chemical deposition process is used for depositing the coating.3. The method according to claim 1 , wherein a vacuum deposition process is used for depositing the coating.4. The method according to claim 3 , wherein a PVD or a CVD process is used for depositing the coating.5. The method according to claim 4 , wherein the material A and the material B are deposited by co-sputtering on the substrate claim 4 , wherein the substrate moves relative to the sputtering device.6. The method according to claim 1 , wherein chemical etching is used to remove the material B from the coating.7. The method according to claim 6 , wherein a hydrochloric acid solution is used for ...

TRANSPARENT CONDUCTIVE FILM AND METHOD FOR PRODUCING THE SAME

There is provided a transparent conductive film achieving low resistance characteristics of a transparent conductive layer. The present invention provides a transparent conductive film including: a polymer film substrate; and a transparent conductive layer formed on at least one surface of the polymer film substrate, wherein the transparent conductive film includes an inorganic undercoat layer formed by means of a vacuum film-forming method between the polymer film substrate and the transparent conductive layer, and an existing atomic amount of carbon atoms in the transparent conductive layer is 3×10atoms/cmor less. 1. A transparent conductive film comprising:a polymer film substrate; anda transparent conductive layer formed on at least one surface of the polymer film substrate, whereinthe transparent conductive film includes an inorganic undercoat layer formed by means of a vacuum film-forming method between the polymer film substrate and the transparent conductive layer, and{'sup': 20', '3, 'an existing atomic amount of carbon atoms in the transparent conductive layer is 3×10atoms/cmor less.'}2. A transparent conductive film comprising:a polymer film substrate; anda transparent conductive layer formed on at least one surface of the polymer film substrate, whereinthe transparent conductive film includes an inorganic undercoat layer formed by means of a vacuum film-forming method between the polymer film substrate and the transparent conductive layer, and{'sup': 20', '3, 'an existing atomic amount of hydrogen atoms in the transparent conductive layer is 3.7×10atoms/cmor less.'}3. The transparent conductive film according to claim 1 , wherein the transparent conductive layer has a specific resistance of 1.1×10Ω·cm or more and 2.8×10Ω·cm or less.4. The transparent conductive film according to claim 1 , wherein the transparent conductive layer is an indium-tin composite oxide layer.5. The transparent conductive film according to claim 1 , wherein the transparent ...

CURVED SUBSTRATE WITH FILM, METHOD FOR PRODUCING THE SAME, AND IMAGE DISPLAY DEVICE

A curved substrate with a film includes a substrate having a first main surface, a second main surface and an end surface, and an antiglare film provided on the first main surface. The substrate has a flat portion and a bent portion. A value obtained by dividing a reflected-image diffusibility index value R of the bent portion by the sum of the reflected-image diffusibility index value R of the bent portion and a reflected-image diffusibility index value R of the flat portion is 0.3 or higher and 0.8 or less. 1. A curved substrate with a film , comprising:a substrate having a first main surface, a second main surface and an end surface; andan antiglare film provided on the first main surface, wherein:the substrate has a flat portion and a bent portion; anda value obtained by dividing a reflected-image diffusibility index value R of the bent portion by the sum of the reflected-image diffusibility index value R of the bent portion and a reflected-image diffusibility index value R of the flat portion is 0.3 or higher and 0.8 or less: {'br': None, 'i': 'R', 'Reflected-image diffusibility index value =[(luminance of all reflected light)−(luminance of 45° regularly reflected light)]/(luminance of all reflected light) \u2003\u2003(1).'}, 'the reflected-image diffusibility index value R is determined by irradiating the substrate with light from a direction of +45° with respect to the first main surface of the substrate as a reference (taken as 0°) to measure a luminance of regular-reflection light reflected by a substrate surface (referred to as 45° regularly reflected light), subsequently similarly irradiating the substrate with the light from the direction of +45° to measure the luminance of all reflected light reflected by the substrate surface, while changing a light-receiving angle in a range of 0° to +90°, and calculating the reflected-image diffusibility index value R using the following equation (1)2. A curved substrate with a film , comprising:a substrate having a ...

Multilayer heat rejection coating

There is provided a multilayer coating comprising a plurality of layers comprising a) one or more layers of an elemental transition metal; b) one or more layers of an elemental metalloid; and c) two or more layers of an oxide; characterized in that the transition metal and metalloid layers are between the oxide layers and the plurality of layers does not need to contain an additional transparent conductive film (TCF). The multilayer coatings show high transparency in the visible light range combined with heat shielding without the need of transparent conductive oxide which have been previously used to achieve these properties. The multilayers can be produced with conventional physical vapour deposition methods on glass and polymer substrates. The coatings may therefore be used for applications on windows, plastic sheets and window shields. The invention relates also to the process for making the multilayer coatings, articles comprising them and their use in building and other applications.

OPTICAL MEMBER, METHOD OF MANUFACTURING THE SAME, AND OPTICAL SYSTEM USING THE SAME

Provided are an optical member capable of maintaining a high level of antireflectiveness while preventing fogging under conditions of total reflection, and a method of manufacturing the same. The optical member includes: a substrate; an intermediate layer; and an aluminum oxide layer which are stacked in this order, the aluminum oxide layer having a surface with an irregular structure made of aluminum oxide crystals. The intermediate layer includes multiple columnar structures inclined with respect to a substrate surface, and includes holes between the columnar structures. The method of manufacturing an optical member includes: forming on a substrate surface an intermediate layer including multiple columnar structures by oblique deposition; and forming a film by applying on the intermediate layer a solution containing aluminum compound and subjecting the film to hot water treatment to form on the film surface an aluminum oxide layer having an irregular structure made of aluminum oxide crystals. 14-. (canceled)5. A method of manufacturing an optical member comprising a substrate , an intermediate layer , and an aluminum oxide layer stacked on the intermediate layer , the aluminum oxide layer having a surface with an irregular structure made of aluminum oxide crystals , the method comprising:carrying out oblique deposition of depositing an evaporating material on the substrate in a direction inclined with respect to a surface of the substrate to form the intermediate layer; andforming a film containing aluminum on the intermediate layer, and subjecting the film to hot water treatment to form on a surface of the film an aluminum oxide layer having the irregular structure made of aluminum oxide crystals.6. The method of manufacturing an optical member according to claim 5 , wherein the oblique deposition is carried out with a deposition angle θ formed between a normal to the substrate and a vapor deposition direction being smaller than 80°.7. The method of manufacturing ...

ARGON-HELIUM BASED COATING

A sputtering system may include a substrate. The sputtering system may include at least one target. The at least one target may include at least one coating material to coat at least one layer onto the substrate. The at least one coating material may be sputtered onto the substrate in a presence of an inert gas. The inert gas may include argon gas and helium gas. 1. A sputtering system , comprising:a substrate; and wherein the at least one target includes at least one coating material to coat at least one layer onto the substrate,', 'wherein the at least one coating material is sputtered onto the substrate in a presence of an inert gas,', 'wherein the inert gas includes argon gas and helium gas., 'at least one target,'}2. The sputtering system of claim 1 , wherein the inert gas is associated with an argon gas to helium gas ratio of between approximately 1:1 and approximately 1:3.3. The sputtering system of claim 1 , wherein the inert gas is associated with 15% to 55% of helium gas.4. The sputtering system of claim 1 , wherein the at least one coating material is sputtered onto the substrate in a presence of hydrogen gas to hydrogenate the at least one coating material.5. The sputtering system of claim 4 , wherein the hydrogen gas is associated with a concentration of approximately 8% to approximately 20%.6. The sputtering system of claim 1 , wherein the at least one layer includes a first set of layers of a first type of material and a second set of layers of a second type of material.7. The sputtering system of claim 1 , wherein the sputtering system is a pulsed direct current magnetron sputtering system.8. The sputtering system of claim 1 , wherein a post-annealing intrinsic stress level of the at least one layer is less than a threshold.9. A coating system claim 1 , comprising:a vacuum chamber; and wherein the inert gas includes a mixture of argon gas and helium gas,', 'wherein the coating system is configured to sputter a coating material onto a substrate using ...

Diffusion bonded lead connector

A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.

Silicate Coatings

Metal products having improved properties and processes for preparing the metal products are provided. The present disclosure provides for a metal product comprising a metal surface, an oxide layer and a glass layer. The glass layer is provided by coating a stable aqueous silicate or borosilicate solution onto the metal surface and curing the aqueous solution to produce a glass layer. The metal products have surface characteristics that outperform all anodized metal surfaces. 1. A process for preparing a silicate surface coating comprising: the aluminum oxide layer consisting of a sealed, anodized-aluminum layer or a hydrated PVD alumina layer and having an EDX composition that is free of silicon, boron and/or nickel,', {'sub': 2', '2', '2', '2', '3, 'the aqueous silicate solution having a pH of about 11 to about 13, a composition that includes a ratio of SiOto MO of about 3.5 to about 2, where M is selected from Li, Na, K, and a mixture thereof, and a ratio of SiOto BOof about 10:1 to about 200:1; and thereafter,'}], 'forming a coated-aluminum-oxide layer by applying an aqueous silicate solution to an aluminum oxide layer that has a thickness of about 1 μm to about 25 μm,'}polymerizing and curing a silicate glass on the sealed, anodized-aluminum layer by (A) heating the coated, anodized-aluminum layer to a temperature of about 200° C. to about 500° C. or (B) exposing the coated, anodized-aluminum layer to an infrared source.2. The process of further comprising:providing an aluminum surface;anodizing the aluminum surface to provide an unsealed, anodized-aluminum layer; and thenhot sealing the unsealed aluminum oxide layer to provide the sealed, anodized-aluminum layer.3. The process of further comprising a hot sealing time of less than 6 min/micron.4. The process of claim 3 , wherein the hot sealing time is less than 5 min/micron.5. The process of claim 4 , wherein the hot sealing time is less than 2 min/micron.6. The process of claim 5 , wherein the hot sealing ...

Silicate Coatings

Metal products having improved properties and processes for preparing the metal products are provided. The present disclosure provides for a metal product comprising a metal surface, an oxide layer and a glass layer. The glass layer is provided by coating a stable aqueous silicate or borosilicate solution onto the metal surface and curing the aqueous solution to produce a glass layer. The metal products have surface characteristics that outperform all anodized metal surfaces. 1. A layered product comprising:a substrate carrying selected from the group consisting of aluminum, an aluminum alloy, and stainless steel,an aluminum oxide layer having a composition that is free of silicates carried by the substrate; anda silicate glass layer directly carried by the aluminum oxide layer and having a silicate glass layer EDX composition that consists of silicon, oxygen, sodium, optionally lithium, and optionally boron; wherein the silicate glass layer EDX composition is free of aluminum.2. The layered product of claim 1 , wherein the aluminum oxide layer has an EDX composition that is free of silicon claim 1 , boron claim 1 , and/or nickel.3. The layered product of claim 1 , wherein the silicate glass layer has a composition that includes about 55 wt. % to about 98 wt. % SiO claim 1 , 0 wt. % to about 6.7 wt. % BO claim 1 , and about 2.3 wt. % to about 36 wt. % MO claim 1 , wherein M is selected from the group consisting of lithium claim 1 , sodium claim 1 , potassium claim 1 , and a mixture thereof; and wherein the silicate glass layer includes less than 0.1 wt. % aluminum.4. The layered product of claim 1 , wherein the silicate glass layer has a TOF-SIMS composition that consists of silicon claim 1 , oxygen claim 1 , sodium claim 1 , optionally lithium claim 1 , and optionally boron; wherein the silicate glass layer TOF-SIMS data show a trace amount of aluminum.5. The layered product of claim 1 , wherein the silicate glass layer has a thickness in the range of about 50 nm ...

MASK BLANK, PHASE SHIFT MASK, METHOD FOR MANUFACTURING PHASE SHIFT MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A mask blank with phase shift film where changes in transmittance and phase shift to an exposure light of an ArF excimer laser are suppressed. The film transmits light of an ArF excimer laser at a transmittance of 2% or more and less than 10% and generates a phase difference of 150 degrees or more and 190 degrees or less between the exposure light transmitted through the phase shift film and the exposure light transmitted through the air for the same distance as a thickness of the phase shift film. The film has a stacked lower layer and upper layer, the lower layer containing metal and silicon and substantially free of oxygen. The upper layer containing metal, silicon, nitrogen, and oxygen. The lower layer is thinner than the upper layer, and the ratio of metal to metal and silicon of the upper layer is less than the lower layer. 1. A mask blank comprising a phase shift film on a transparent substrate , wherein:the phase shift film has a function to transmit an exposure light of an ArF excimer laser at a transmittance of 2% or more and less than 10% and a function to generate a phase difference of 150 degrees or more and 190 degrees or less between the exposure light transmitted through the phase shift film and the exposure light transmitted through air for a same distance as a thickness of the phase shift film,the phase shift film has a structure where a lower layer and an upper layer are stacked from a side of the transparent substrate,the lower layer and the upper layer are formed from a material containing silicon,the lower layer has refractive index n of 1.00 or more and 1.90 or less,the lower layer has extinction coefficient k of 3.30 or less,the upper layer has refractive index n of 2.00 or more and 2.65 or less,the upper layer has extinction coefficient k of 0.20 or more and 0.60 or less, anda thickness of the lower layer is 1/30 or more and ⅓ or less of the whole thickness of the phase shift film.2. The mask blank according to claim 1 , wherein the lower ...

METHOD FOR DEPOSITING A LAYER USING A MAGNETRON SPUTTERING DEVICE

A method is provided for depositing a layer on a substrate inside a vacuum chamber by a magnetron sputtering device comprising at least two magnetron cathodes, each equipped with one target, at least one additional electrode, wherein a separate power supply unit is allocated to each magnetron cathode and wherein, in addition to at least one working gas, at least one reactive gas is introduced into the vacuum chamber. In a first phase, a pulsed negative direct current voltage is conducted from each power supply unit to the corresponding magnetron cathode, wherein the power supply units are operated in the push-pull mode. In a second phase, the pulsed direct current voltages provided by the power supply units are switched between the corresponding magnetron cathode and the additional electrode. An electric voltage is applied to the substrate or an electrode at the back of the substrate. 1. A method for depositing a layer on a substrate inside a vacuum chamber by a magnetron sputtering device comprising at least two magnetron cathodes each equipped with a target , at least one additional electrode , wherein a separate power supply unit is allocated to each magnetron cathode , and wherein , in addition to at least one working gas , at least one reactive gas is introduced into the vacuum chamber , whereinin a first phase, a pulsed, negative direct current voltage is conducted from each power supply unit to the corresponding magnetron cathode, wherein the power supply units are operated in the push-pull mode,in a second phase, the pulsed direct current voltages provided by the power supply units are switched between the corresponding magnetron cathode and the additional electrode,switching occurs between the first and the second phase with a frequency in a range from 1 Hz to 10 kHz,an electric voltage with a frequency higher than 1 MHz is formed at the substrate or an electrode at the back of the substrate,the introduction of the reactive gas into the vacuum chamber is ...

Antireflection Hard Coating Film and Preparation Method Thereof

Provided is a hard coating film in which a hard coating layer having a water contact angle of 90° or less, a high refractive index layer, and a low refractive index layer are laminated on a substrate, the film having suppressed curling, and excellent hardness and antireflection performance.

Antireflection Hard Coating Film and Preparation Method Thereof

Provided is a hard coating film in which a hard coating layer having a water contact angle of 90° or less, a conductive layer, and a low refractive index layer are laminated on a substrate, the film having excellent hardness, anti-curling property, antireflection performance, antifouling performance, and antistatic performance. 1. An antireflection hard coating film comprising:a substrate;a hard coating layer having a water contact angle of 90° or less, disposed on the substrate;a conductive layer disposed on the hard coating layer; anda low refractive index layer disposed on the conductive layer.3. The antireflection hard coating film of claim 2 , wherein the hard coating layer is a cured layer of a composition for forming a hard coating layer including the epoxy siloxane resin claim 2 , the thermal initiator including the compound represented by Chemical Formula 2 claim 2 , and the photoinitiator.4. The antireflection hard coating film of claim 3 , wherein the cured layer is formed by photocuring and then thermally curing the composition for forming a hard coating layer.6. The antireflection hard coating film of claim 1 , wherein the conductive layer includes a conductive metal oxide or a conductive metal nitride.7. The antireflection hard coating film of claim 6 , wherein the conductive metal oxide or the conductive metal nitride includes any one or more selected from the group consisting of an aluminum (Al) oxide doped with any one or more selected from the group consisting of phosphorus (P) claim 6 , indium (In) claim 6 , and antimony (Sb); a titanium (Ti) oxide doped with any one or more selected from the group consisting of phosphorus claim 6 , indium claim 6 , and antimony; and an antimony oxide doped with any one or more selected from the group consisting of phosphorus and indium.8. The antireflection hard coating film of claim 1 , wherein the low refractive index layer includes an inorganic oxide.9. The antireflection hard coating film of claim 8 , wherein ...

FABRICATION OF BIT PATTERNED MEDIA USING MICROCONTACT PRINTING

A method for manufacturing a bit patterned magnetic media for magnetic data recording. The method includes selectively depositing a self assembled monolayer over a seed layer and then oxidizing the deposited self assembled monolayer. The self-assembled monolayer can be deposited by use of a stamp to form a pattern covering areas where a non-magnetic segregant (such as an oxide) is to be formed and openings where a magnetic material is to be formed. A magnetic alloy and a segregant (such as an oxide) are then co-sputtered. The magnetic alloy grows only or selectively over the seed layer, whereas the segregant grows only or selectively over the oxidized self-assembled monolayer. 1. A method for manufacturing a magnetic media , comprising:depositing a seed layer;forming a stamp having a pattern formed thereon;coating the stamp with a segregant promoter;placing the stamp against the seed layer so as to selectively print the segregant promoter onto the seed layer; andperforming a co-sputtering of a magnetic material and a segregant.2. The method as in wherein the segregant promoter comprises a self-assembled monolayer.3. The method as in wherein the seed layer comprises Ru.4. The method as in wherein the segregant promoter comprises a hydrocarbon polymer with silane and thiol termination.5. The method as in wherein the segregant promoter comprises a thiol terminated organosilane.6. The method as in wherein the magnetic material comprises a plurality of layers of differing magnetic properties.7. The method as in wherein the co-sputtered segregant comprises an oxide.8. The method as in wherein the seed layer comprises Ru deposited by low pressure sputter deposition.9. The method as in further comprising claim 1 , after printing the segregant promoter claim 1 , and before co-sputtering the magnetic material and the segregant claim 1 , treating the segregant promoter to make it an oxide-like material.10. The method as in wherein the treatment of the segregant promoter to ...

HOUSING, MOBILE TERMINAL, AND SPUTTER COATING APPARATUS

An enclosure of a mobile terminal and a sputter coating apparatus for making the same are provided. The enclosure includes a substrate and a composite film layer coated onto the substrate. The composite film layer has a thickness changing along a first direction. A difference in thickness between any two regions arranged along the first direction of the composite film layer is less than or equal to 350 nanometers. The enclosure has a spatially varying color corresponding to a wavelength between 400 nanometers and 760 nanometers. 1. An enclosure of a mobile terminal , comprising:a substrate; anda composite film layer coated onto the substrate, having a thickness changing along a first direction, a difference in thickness between any two regions arranged along the first direction of the composite film layer being less than or equal to 350 nanometers, the enclosure having a spatially varying color corresponding to a wavelength between 400 nanometers and 760 nanometers.2. The enclosure according to claim 1 , wherein the thickness of the composite film layer changes along a second direction claim 1 , wherein the second direction is different from the first direction.3. The enclosure according to claim 2 , wherein an angle between the second direction and the first direction is less than or equal to 90° claim 2 , and change trends of the thicknesses of the composite film layer in the first direction and the second direction are the same.4. The enclosure according to claim 1 , wherein the composite film layer comprises a first film layer and a second film layer arranged in a stack claim 1 , the first film layer having a first coating material of a first refractive index claim 1 , and the second film layer having a second coating material of a second refractive index claim 1 , and change trends of thicknesses of the first film layer and the second film layer in a same direction are the same.5. The enclosure according to claim 4 , wherein the first film layer is made of a ...

Multilayer Diamond Display System and Method

Disclosed herein is a transparent glass system that includes an optical grade silicon substrate, a transparent substrate layer; a titanium dioxide transparent layer, the transparent layer having an index of refraction of 2.35 or greater; and a polycrystalline diamond layer, wherein the transparent layer is between the substrate layer and the polycrystalline diamond layer. 1. A multilayer diamond display system , comprising:a transparent substrate layer;a titanium dioxide transparent layer, the transparent layer having an index of refraction of 2.35 or greater; anda polycrystalline diamond layer, wherein the transparent layer is between the substrate layer and the polycrystalline diamond layer.2. The system of claim 1 , wherein the substrate is fused silica.3. The system of claim 1 , wherein the substrate level is a transparent metal.4. The system of claim 1 , wherein the titanium dioxide claim 1 , transparent layer is crystalline rutile.5. The system of claim 1 , wherein the titanic dioxide transparent layer is deposited using ion deposition.6. The system of claim 1 , wherein the polycrystalline diamond layer is nanocrystalline diamond.7. The system of claim 1 , wherein the polycrystalline diamond layer is formed using a chemical vapor deposition with wafer stage cooling.8. The system of claim 1 , further including a fused silica and titanium dioxide layer between the transparent substrate layer and the titanium dioxide transparent layer.9. The system of claim 9 , where the fused silica and titanium dioxide layer is formed using a sputtered physical vapor deposition.10. (canceled)11. A multilayer diamond display system claim 9 , comprising:a chassis layer;an organic light emitting diode layer;a capacitive touch layer; anda diamond composite exterior lens.12. The system of claim 12 , further including an interior lens between the capacitive touch layer and the diamond composite exterior lens.13. The system of claim 1 , wherein the substrate is aluminosilicate glass. ...

DIFFUSION BONDED LEAD CONNECTOR

A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level. 1. A method of forming a medical device lead connector comprising:diffusion bonding an electrically insulating ring between a first electrically conducting contact ring and a second electrically conducting contact ring to form an aligned joined element; andjoining a plurality of aligned joined elements in axial alignment to form a lead connector having a lead aperture.2. The method of forming a medical device lead connector according to claim 1 , wherein the joining step comprises welding a plurality of joined elements in axial alignment to form a lead connector having a lead aperture.3. The method of forming a medical device lead connector according to claim 1 , wherein the joining step comprises diffusion bonding a plurality of joined elements in axial alignment to form a lead connector having a lead aperture.4. The method of forming a medical device lead connector according to claim 1 , further comprising sputtering a metallization layer onto the electrically insulating ring before the diffusion bonding step.5. The method of forming a medical device lead connector according to claim 4 , wherein the metallization layer has a thickness in a range from 10 nanometers to 1 micrometer.6. The method of forming a medical device lead connector according to claim 4 , wherein the sputtering step comprises sputtering the metallization layer onto only a diffusion bond area portion of the electrically insulating ring.7. The method of forming a medical device lead connector according to claim 1 , wherein the electrically conducting contact ring comprises titanium or titanium alloys and the electrically insulating ring comprises sapphire or a ceramic material.8. The method of forming a medical device lead connector ...

GAS BARRIER FILM AND METHOD FOR PRODUCING SAME

A gas barrier film is provided including a polymer film substrate and a gas barrier layer containing at least zinc oxide and silicon dioxide on at least one surface of the polymer film substrate, wherein the gas barrier layer satisfies at least one of the following [I] to [III]: [I] with regard to X-ray absorption near edge structure (XANES) spectrum at K absorption edge of zinc, the value of (spectrum intensity at 9664.0 eV)/(spectrum intensity at 9668.0 eV) is in the range of 0.910 to 1.000; [II] the value obtained by dividing atomic concentration of zinc with atomic concentration of silicon is in the range of 0.1 to 1.5, and structural density index represented by the following equation: structural density index={density of the gas barrier layer obtained by X-ray reflectometry (XRR)}/{(theoretical density calculated from compositional ratio determined by X-ray photoelectron spectroscopy (XPS)} is 1.20 to 1.40; and [III] when peak in the wave number range of 900 to 1,100 cmmeasured in FT-IR measurement is subjected to peak separation into the wave number of 920 cmand the wave number of 1,080 cm, the value of ratio (A/B) of integrated intensity of the spectrum having its peak at 920 cm(A) to integrated intensity of the spectrum having its peak at 1,080 cm(B) is at least 1.0 and up to 7.0. 1. A gas barrier film comprising a polymer film substrate and a gas barrier layer containing at least zinc oxide and silicon dioxide on at least one surface of the polymer film substrate , wherein the gas barrier layer satisfies at least one of the following [I] to [III]:[I] with regard to X-ray absorption near edge structure (XANES) spectrum at K absorption edge of zinc, the value of (spectrum intensity at 9664.0 eV)/(spectrum intensity at 9668.0 eV) is in the range of 0.910 to 1.000; {'br': None, 'structural density index={density of the gas barrier layer obtained by X-ray reflectometry(XRR)}/{(theoretical density calculated from compositional ratio determined by X-ray ...

High-efficiency multiwavelength beam expander employing dielectric-enhanced mirrors

A high-efficiency, multiwavelength beam-expander optical system that employs dielectric-enhanced mirrors is disclosed. Each mirror includes a reflective multilayer coating formed from alternating layers of HfO 2 and SiO 2 that define, in order from the substrate surface, at least first and second sections, wherein the HfO 2 /SiO 2 layer thicknesses are generally constant within a given section and get smaller section by section moving outward from the substrate surface. The first and second sections are respectively configured to optimally reflect different operating wavelengths so that the beam-expander optical system has an optical transmission of greater than 95% at the different operating wavelengths.

HIGH-EFFICIENCY MULTIWAVELENGTH BEAM EXPANDER EMPLOYING DIELECTRIC-ENHANCED MIRRORS

A high-efficiency, multiwavelength beam-expander optical system that employs dielectric-enhanced mirrors is disclosed. Each mirror includes a reflective multilayer coating formed from alternating layers of HfOand SiOthat define, in order from the substrate surface, at least first and second sections, wherein the HfO/SiOlayer thicknesses are generally constant within a given section and get smaller section by section moving outward from the substrate surface. The first and second sections are respectively configured to optimally reflect different operating wavelengths so that the beam-expander optical system has an optical transmission of greater than 95% at the different operating wavelengths. 1. A method of forming a high-efficiency beam-expander optical system for use at ultraviolet (UV) , visible (VIS) and infrared (IR) operating wavelengths , comprising:diamond-turning and polishing a first mirror substrate and a second mirror substrate to respectively form a first mirror having a convex substrate surface and a second mirror having a concave substrate surface;{'sub': 2', '2', 'H', '2', '2, 'b': 1', '2', '3', '1', '2', '3, 'forming on each of the convex substrate surface and the concave substrate surface a reflective multilayer coating comprising alternating layers of HfOand SiOhaving respective layer thicknesses τand Is, including arranging the HfOand SiOlayers in at least three sections S, S and S in order outward from the convex substrate surface or the concave substrate surface, with the three sections S, S and S respectively configured to optimally reflect the IR, VIS and UV operating wavelengths; and'}{'sub': 'BE', 'arranging the first mirror and the second mirror in an off-axis, afocal configuration having greater than unity magnification and an optical transmittance T>95% at each of the UV, VIS and IR operating wavelengths.'}2. The method according to claim 1 , the forming the reflective multilayer coating comprising alternating layers of HfOand ...

In Situ Density Control During Fabrication Of Thin Film Materials

A system and method for forming a thin film device. A method may comprise depositing a layer of material on a substrate with a thin film system at a deposition rate, monitoring a density of the layer of material to control the deposition rate, selecting a threshold for the deposition rate for a consistent film density, wherein the threshold is a material density, decreasing the deposition rate when the deposition rate is higher than the threshold, and increasing the deposition rate when the deposition rate is lower than the threshold. A thin film system for fabricating a thin film device may comprise a chamber, a material source contained with the chamber, an electrical component to activate the material source, a substrate holder to support a multilayer stack of materials that form the thin film device, a measurement device, and an information handling system. 1. A method of forming a thin film device comprising:depositing a layer of material on a substrate with a thin film system at a deposition rate;monitoring a density of the layer of material in-situ with X-ray reflectivity to control the deposition rate;selecting a threshold for the deposition rate for a consistent film density, wherein the threshold is a material density;decreasing the deposition rate when the deposition rate is higher than the threshold; andincreasing the deposition rate when the deposition rate is lower than the threshold.2. The method of claim 1 , wherein monitoring the density is performed in-situ.3. (canceled)4. (canceled)5. The method of claim 1 , wherein the threshold is an optical thickness of the layer of material.6. The method of claim 1 , wherein the threshold is an optical property of the material.7. The method of claim 1 , further comprising adjusting the thin film system by changing an E-beam current.8. The method of claim 1 , further comprising adjusting the thin film system by changing an ion-source current.9. The method of claim 1 , further comprising adjusting the thin film ...

MICROSTRUCTURE SUBSTRATES, MANUFACTURING METHODS, AND DISPLAY DEVICES

The present disclosure relates to a microstructure substrate and the manufacturing method thereof, and a display device. The method includes coating an anti-fingerprint layer on a substrate, sputtering a SiO2 layer on the anti-fingerprint layer, and etching the SiO2 layer to form the SiO2 layer having a plurality of circular recessed microstructures. With such configuration, the impact caused by the circular depression microstructure to the high-resolution panel may be enhanced so as to reduce the degree of the blur with respect to the images. As such, the substrate may be adopted by high-resolution panels. 1. A display device , comprising:a microstructure substrate comprising:a substrate;an anti-fingerprint layer coated on the substrate;a SiO2 layer covering the anti-fingerprint layer, and the SiO2 layer comprising a plurality of circular depression microstructures;wherein the anti-fingerprint layer is made by mixed solution of SiO2, water-soluble resin, wax and related additive;and a width of the circular depression microstructure is in a range from 5 μm to 25 μm, a ratio of a depth to the width is in the range from 0.05 to 0.15, and an included angle between a tangent of an arc-surface and a horizontal direction is in the range from 5 to 20 degrees.2. A manufacturing method of microstructure substrates , comprising:coating an anti-fingerprint layer on a substrate;sputtering a SiO2 layer on the anti-fingerprint layer;etching the SiO2 layer to form the SiO2 layer having a plurality of circular recessed microstructures.3. The manufacturing method as claimed in claim 1 , wherein the step of sputtering the SiO2 layer on the anti-fingerprint layer further comprises:adjusting a sputtering direction relating to the SiO2 layer and the substrate, wherein the included angle formed by the sputtering direction and a normal line of the substrate is in a range from 75 to 85 degrees.4. The manufacturing method as claimed in claim 3 , wherein a thickness of the SiO2 layer is in a ...

Near infrared reflective coatings

A coating composition comprising 6 to 20 alternating layers of SiO 2 and one of ZrO 2 or Nb 2 O 5 wherein the thickness of each individual layer is about 70 nm to 200 nm is described. Also described is a substrate comprising a coating on at least a first major side thereof, the coating comprising 6 to 20 alternating layers of SiO 2 and one of ZrO 2 or Nb 2 O 5 wherein the thickness of each individual layer is about 70 nm to 200 nm The substrate can be glass, plastic, or metal. Also disclosed herein are methods of making the coated substrate. The coatings have good optical transparency and NIR reflectivity.

METHOD FOR MANUFACTURING THERMISTOR, AND THERMISTOR

The present invention is provided with a base electrode layer forming step of forming a base electrode layer by applying and sintering a conductive paste on an end surface of the thermistor element, an oxide layer forming step of forming an oxide layer on a surface of the base electrode layer, a cover electrode layer forming step of forming a cover electrode layer by applying and sintering a conductive paste on a surface of the oxide layer, and a conduction heat treatment step of performing a heat treatment such that the base electrode layer and the cover electrode layer are electrically conductive, in which the electrode portion having the base electrode layer and the cover electrode layer is formed and a plating step of forming a metal plating layer on a surface of the cover electrode layer is provided after the conduction heat treatment step.

Gas barrier laminate and packaging material using the same

A gas barrier laminate includes a polypropylene substrate layer; a first polyvinyl alcohol resin layer; and a metal oxide layer, which are laminated in this order, wherein the first polyvinyl alcohol resin layer has a mass per unit area of 0.5 to 2.5 g/m; and, a packaging material includes the above gas barrier laminate and a polypropylene sealant layer disposed on a surface of the gas barrier laminate, wherein a mass ratio of a sum of the polypropylene substrate layer and the polypropylene sealant layer to a total mass of the packaging material is 85 mass % or more.

FILTERING STRUCTURE FOR AN INFRARED CUT FILTER

An infrared-cut filter structure is disclosed. The infrared-cut filter structure uses a glass substrate having an upper side and a lower side, with a first multilayer film formed on the upper side and a second multilayer film formed on the lower side so that the infrared-cut filter can effectively filter out infrared light and transmit visible light to produce normal colored images. 2. The infrared-cut filter structure of claim 1 , wherein the glass substrate is a white glass substrate.3. The infrared-cut filter structure of claim 1 , wherein the glass substrate is a blue glass substrate.4. The infrared-cut filter structure of claim 1 , wherein the glass substrate is a substrate comprising white glass coated with an infrared-absorbing organic film.5. The infrared-cut filter structure of claim 1 , wherein the plurality of high-refractive-index layers of the first multilayer film are each composed of a material selected from the group consisting of: trititanium pentoxide (TiO) claim 1 , titanium dioxide (TiO) claim 1 , tantalum pentoxide (TaO) claim 1 , niobium pentoxide (NbO) claim 1 , and mixtures thereof.6. The infrared-cut filter structure of claim 1 , wherein the plurality of low-refractive-index layers of the first multilayer film are each composed of a material selected from the group consisting of: silicon dioxide (SiO) claim 1 , magnesium fluoride (MgF) claim 1 , and mixtures thereof.7. The infrared-cut filter structure of claim 1 , wherein the plurality of high-refractive-index layers of the second multilayer film are each composed of a material selected from the group consisting of: trititanium pentoxide (TiO) claim 1 , titanium dioxide (TiO) claim 1 , tantalum pentoxide (TaO) claim 1 , niobium pentoxide (NbO) claim 1 , and mixtures thereof.8. The infrared-cut filter structure of claim 1 , wherein the plurality of low-refractive-index layers of the second multilayer film are each composed of a material selected from the group consisting of: silicon dioxide ...

Fabrication of hierarchical silica nanomembranes and uses thereof for solid phase extraction of nucleic acids

The present invention provides a novel method to fabricate silica nanostructures on thin polymer films based on silica deposition and self-wrinkling induced by thermal shrinkage. These micro- and nano-scale structures have vastly enlarged the specific area of silica, thus the silica nanomembranes can be used for solid phase extraction of nucleic acids. The inventive silica nanomembranes are suitable for nucleic acid purification and isolation and demonstrated better performance than commercial particles in terms of DNA recovery yield and integrity. In addition, the silica nanomembranes have extremely high nucleic acid capacity due to its significantly enlarged specific surface area of silica. Methods of use and devices comprising the silica nanomembranes are also provided.

Anti-reflective sputtering stack with low rv and low ruv

The present invention provides a UV antireflective coating stack for ophthalmic lenses. The antireflective coating stack is deposited by sputtering, which lowers the reflectivity of the antireflective stack in the UV range and maintains low reflectivity in the visible range. The antireflective coating stack offers improved thermo-mechanical performance as compared to evaporation-based UV antireflective stacks.

Method for manufacturing barrier film with enhanced moisture resistance and barrier film manufactured by the same

A barrier film and a method of manufacturing the barrier film are provided. The method includes performing high-pressure thermal treatment under certain conditions on an oxide thin film deposited by sputtering deposition or atomic layer deposition (ALD) to manufacture a barrier film with improved moisture resistance. According to the method, moisture resistance of the barrier film can be improved at a low process temperature by using both thermal energy and pressure energy. The barrier film provided herein can be useful as a barrier film for solar cells.

Methods and apparatus to eliminate wafer bow for cvd and patterning hvm systems

A method and apparatus for forming a backside coating on a substrate to counteract stresses from a previously deposited film is disclosed. In one embodiment, a method for flattening a bowed substrate includes providing a substrate having a film stack formed on a first major surface thereof, wherein the substrate comprises a bowed orientation, and forming a coating a second major surface of the substrate, wherein the coating is configured to counter stresses produced by the film stack and flattens the substrate from the bowed orientation.

TRANSFERABLE SILICA BILAYER FILM

The present invention inter alia relates to a supported silica bilayer (SiObilayer) film. In the supported silica bilayer film, the silica bilayer film consists of two atomic layers of corner-sharing SiOtetrahedra, forms in itself a chemically saturated structure and contains pores. The silica bilayer film has a first () and a second side () and is supported on the first side () by a removable polymer film. The invention further relates to a process for producing the supported silica bilayer film, a process for transferring a silica bilayer film, a free-standing silica bilayer film, a stack comprising a plurality of silica bilayer films, a filed-effect transistor having a gate oxide comprising the silica bilayer film or a stack thereof and the use of a silica bilayer film. 1. A supported silica bilayer (SiObilayer) film , wherein:{'sub': '4', 'the silica bilayer film consists of two atomic layers of corner-sharing SiOtetrahedra, forms in itself a chemically saturated structure and contains pores,'}{'b': 1', '2', '1, 'and wherein the silica bilayer film has a first () and a second side () and is supported on the first side () by a removable polymer film.'}2. The supported silica bilayer film according to claim 1 , wherein the total volume of the pores contained in the silica bilayer film amount to 5.0 to 35.0 vol. % claim 1 , based on the total volume of the silica bilayer film and the pores contained therein.3. The supported silica bilayer film according to claim 1 , wherein (i) the silica bilayer film is amorphous or (ii) consists of amorphous and crystalline domains claim 1 , which crystalline domains constitute less than 50% of the silica bilayer film.4. The supported silica bilayer film according to claim 1 , wherein{'b': '2', 'the silica bilayer film is not attached to a growth substrate, and wherein the second side () is exposed.'}5. A process for producing a the supported silica bilayer film claim 1 , comprising the steps:(A) forming a silica bilayer film on ...

ELECTRODE STRUCTURE AND METHOD OF MANUFACTURING AN ELECTRODE STRUCTURE

A method of manufacturing an electrode structure includes providing an initial structure, the initial structure including at least two elevated regions extending from a substrate, wherein top portions of the two elevated regions are separated by a first lateral distance, depositing material onto the elevated regions by means of physical vapor deposition such that adjacent top portions of the deposited material are separated by a second lateral distance that is smaller than the first lateral distance, and applying electrodes onto the top portions of the material. 1. A method of manufacturing an electrode structure , the method comprising:providing an initial structure, the initial structure comprising at least two elevated regions extending from a substrate, wherein top portions of the two elevated regions are separated by a first lateral distance,depositing material by means of physical vapor deposition onto the elevated regions such that adjacent top portions of the deposited material are separated by a second lateral distance that is smaller than the first lateral distance, andapplying electrodes onto the top portions of the material.2. The method according to claim 1 , wherein depositing material onto the elevated regions comprises sputtering material onto the elevated regions.3. The method according to claim 1 , wherein the material deposited onto an elevated region comprises a first lateral width adjacent to the elevated region and a second lateral width remote from the elevated region claim 1 , wherein the first lateral width is smaller than the second lateral width.4. The method according to claim 1 , wherein the elevated regions are permanently maintained at the initial structure.5. The method according to claim 1 , wherein the deposited material is a dielectric.6. The method according to claim 1 , wherein the electrodes are applied onto the top portions of the deposited material by evaporation of conductive material.7. The method according to claim 1 , ...

VEHICLE DECORATIVE PLATE AND FORMING METHOD THEREOF

A vehicle decorative plate and a forming method thereof are disclosed. The vehicle decorative plate can be made into a vehicle emblem, a vehicle grille, a vehicle front bumper trim, a vehicle door trim or a vehicle rear bumper trim. The vehicle decorative plate includes a curved substrate, a display layer, and a curved covering. After the curved substrate is coated with a plating layer, unnecessary parts of the plating layer are removed by laser engraving to process the plating layer into the display layer. The curved covering is attached to the curved substrate and covers the display layer. At least one of the curved substrate and the curved covering is transparent or semi-transparent. 1. A vehicle decorative plate , comprising:a curved substrate;a display layer, after the curved substrate is coated with a plating layer, unnecessary parts of the plating layer being removed by laser engraving to process the plating layer into the display layer;a curved covering, attached to the curved substrate and covering the display layer, at least one of the curved substrate and the curved covering being transparent or semi-transparent.2. The vehicle decorative plate as claimed in claim 1 , wherein the curved substrate is transparent or semi-transparent and has a convex display surface and a concave back surface claim 1 , and the display layer is located on the concave back surface.3. The vehicle decorative plate as claimed in claim 2 , wherein the curved substrate has an anti-scratch layer thereon claim 2 , and the anti-scratch layer is located opposite the display layer.4. The vehicle decorative plate as claimed in claim 1 , wherein the curved substrate has a convex display surface and a concave back surface claim 1 , the display layer is located on the convex display surface claim 1 , and the curved covering is transparent or semi-transparent.5. The vehicle decorative plate as claimed in claim 4 , wherein the curved covering has an anti-scratch layer thereon claim 4 , and the ...

Method and Apparatus for Depositing a Material

A method is for depositing a dielectric material on to a substrate in a chamber by pulsed DC magnetron sputtering with a pulsed DC magnetron device which produces one or more primary magnetic fields. In the method, a sputtering material is sputtered from a target, wherein the target and the substrate are separated by a gap in the range 2.5 to 10 cm and a secondary magnetic field is produced within the chamber which causes a plasma produced by the pulsed DC magnetron device to expand towards one or more walls of the chamber. 1. A PVD apparatus for depositing a dielectric material on a substrate from a metallic target by pulsed DC magnetron sputtering comprising:a cylindrical chamber;a rotating magnetron device which produces one or more primary magnetic fields in the vicinity of a target located at the top of the chamber, wherein a sputtering material is sputtered from the target;an RF driven substrate support disposed in the chamber which is orientated parallel to a surface of the target at a distance from 2.5 cm to 9 cm and axially aligned with the target, wherein a rotational path of the magnetron device behind the target extends to beyond a diameter of a substrate on the substrate support;a gas inlet;a secondary magnetic field production device positioned around a body of the chamber between the target and the substrate support which produces a generally axial secondary magnetic field that causes a plasma to expand towards one or more walls of the chamber, wherein the secondary magnetic field production device includes an electromagnet; anda controller configured to control the secondary magnetic field production device so that a secondary magnetic field is produced within the chamber while a dielectric material is deposited from the target to produce an increase in thickness at a peripheral portion of the substrate.2. The apparatus according to claim 1 , wherein the distance is from 2.5 cm to less than or equal to 5 cm.3. The apparatus according to claim 1 , ...

MOISTURE RESISTANT COATING FOR BARRIER FILMS

A barrier film having a substrate, a base polymer layer applied to the substrate, an oxide layer applied to the base polymer layer, and a top coat polymer layer applied to the oxide layer. An optional inorganic layer can be applied over the top coat polymer layer. The top coat polymer includes a silane and an acrylate co-deposited to form the top coat layer. The use of a silane co-deposited with an acrylate to form the top coat layer of the barrier films provide for enhanced resistance to moisture and improved peel strength adhesion of the top coat layer to the underlying barrier stack layers. 1. A barrier film , comprising:a substrate;a base polymer layer applied to the substrate;an oxide layer applied to the base polymer layer; anda top coat polymer layer applied to the oxide layer,wherein the top coat polymer layer comprises a reaction product of a cyclic aza-silane, an acrylate monomer having a molecular weight in a range of about 150 to about 600 grams per mole, and a surface of the oxide layer.2. The barrier film of claim 1 , further comprising a plurality of the alternating layers of the base polymer layer and the oxide layer between the substrate and the top coat polymer.3. The barrier film of claim 1 , wherein the substrate comprises a flexible transparent film.4. The barrier film of claim 1 , wherein the base polymer layer comprises an acrylate smoothing layer.5. The barrier film of claim 1 , wherein the oxide layer comprises a layer of an inorganic silicon aluminum oxide.6. The barrier film of claim 1 , further comprising an inorganic layer applied to the top coat polymer layer.7. The barrier film of claim 6 , wherein the inorganic layer comprises a layer of an inorganic silicon aluminum oxide.8. The barrier film of claim 1 , wherein the acrylate monomer has a molecular weight from about 200 to about 400 grams per mole.9. The barrier film of claim 1 , wherein the acrylate monomer is tricyclodecane dimethanol diacrylate.10. The barrier film of claim 1 , ...

Simplified Mirror

This disclosure relates to an optical system and a method for its manufacture. One embodiment of the optical system may include an optical material upon which a multilayer stack may be deposited. The multilayer stack may include a first layer composed on a first surface of the optical material, a second layer composed on the first layer, and a third layer composed on the second layer. Among other possibilities, the first layer may include Al 2 O 3 , the second layer may include Al, and the third layer may include SiO 2 . The multilayer stack may be a reflective coating on a surface of the optical material with optical power. Thus, the reflective coating may serve as a reflective image former within the optical system. The optical system may be configured as a head-mountable device.

LIMITING-CURRENT TYPE GAS SENSOR AND FABRICATION METHOD OF THE SAME, AND SENSOR NETWORK SYSTEM

The limiting-current type gas sensor includes: a porous lower electrode disposed on a substrate; an insulating film disposed on the porous lower electrode; a solid electrolyte layer disposed on the porous lower electrode in an opening formed by patterning the insulating film, and further disposed on the insulating film surrounding the opening; and a porous upper electrode disposed on the solid electrolyte layer, wherein the insulating film realizes non-contact between an edge face of the solid electrolyte layer and the porous lower electrode, in order to suppress the intake of oxygen (O) ion from the edge face of the solid electrolyte layer, and thereby the surface-conduction current component between the porous upper electrode and the porous lower electrode can be reduced. There can be provided the limiting-current type gas sensor capable of reducing the surface-conduction current component and realizing low power consumption. 1. A limiting-current type gas sensor comprising:a substrate;a porous lower electrode disposed on the substrate;an insulating film disposed on the porous lower electrode;a solid electrolyte layer disposed on the porous lower electrode in an opening formed by patterning the insulating film, and further disposed on the insulating film surrounding the opening; anda porous upper electrode disposed on the solid electrolyte layer so as to be opposite to the porous lower electrode, and so as to be disposed in a substantially vertical direction with respect to the substrate, whereinthe insulating film realizes non-contact between an edge face of the solid electrolyte layer and the porous lower electrode, in order to suppress the intake of oxygen (O) ion from the edge face of the solid electrolyte layer, and thereby the surface-conduction current component between the porous upper electrode and the porous lower electrode can be reduced.2. The limiting-current type gas sensor according to claim 1 , further comprisinga detection circuit configured to ...

REACTIVE SPUTTER DEPOSITION OF DIELECTRIC FILMS

Reactive sputter deposition method and system are disclosed, in which a catalyst gas, such as water vapor, is used to increase the overall deposition rate substantially without compromising formation of a dielectric compound layer and its optical transmission. Addition to the sputtering or reactive gas of the catalyst gas can result in an increase of a deposition rate of the dielectric oxide film substantially without increasing an optical absorption of the film. 120-. (canceled)21. A method , comprising:supplying a reactive gas to a reactive gas source that is inside a chamber;releasing, from the reactive gas source, the reactive gas into the chamber in a manner that causes the reactive gas to react with silicon atoms and form a silicon dioxide layer on a substrate; andadding a catalyst to the chamber in a manner that increases a deposition rate of the silicon dioxide layer without impacting optical absorption spectra of deposited silicon dioxide film.22. The method of claim 21 , wherein the reactive gas source is a plasma-activated reactive gas source.23. The method of claim 21 , further comprising:loading the substrate into a substrate holder before the silicon dioxide layer is formed on the substrate.24. The method of claim 21 , further comprising:activating a vacuum pump that that pumps out air from the chamber.25. The method of claim 21 , further comprising:injecting a sputtering gas, via a sputtering gas inlet, to a pre-defined pressure within the chamber.26. The method of claim 21 , further comprising:applying a voltage to one or more cathode targets in a manner that causes the silicon atoms to move from the one or more cathode targets towards the substrate and adhere to the substrate.27. The method of claim 21 , wherein the reactive gas comprises oxygen.28. The method of claim 21 , wherein the reactive gas reacts with the silicon atoms when the silicon atoms are adhered to the substrate.29. The method of claim 21 , wherein the reactive gas reacts with the ...

Method for producing coatings with adapted coating properties

Method for producing coating materials by conducting at least following two steps: —a first step in which a coating layer of a first material is synthesized on the surface of a substrate to be coated, wherein the coating layer is produced by using a vapor deposition method, at a first temperature T 1 , wherein T 1 is preferably a temperature not higher than 500° C., and —a second step conducted after the first step, in which the coating layer of the first material deposited in the first step, is exposed to an specific high energy, wherein the specific high energy to be delivered to the substrate is selected in order to produce the same or an equivalent effect as it, which would be attained if the coating layer were produced at a second temperature T 2 , wherein T 2 is higher than T 1 and preferably T 2 is a temperature above 500° C. or more preferably above 600° C. or even above 1000° C.

FABRICATION OF SUPERHYDROPHOBIC AND ICEPHOBIC COATINGS BY NANOLAYERED COATING METHOD

Nano-multilayered coatings and fabrication methods are disclosed. By exemplary disclosure, a nano-multilayered coating fabricated from sequential depositions on a substrate from an atmospheric-plasma chemical vapor deposition (AP-CVD) source is disclosed. The coating includes a vapor precursor fed to the deposition source, an amorphous oxide layer deposited from the deposition source onto the substrate, and a nanoparticle layer deposited onto the substrate on top of the amorphous oxide layer. A nano-multilayered coating of the amorphous oxide and nanoparticle layers is fabricated from alternating deposition coatings of the amorphous oxide layer and the nanoparticle layer onto the substrate two or more times. 1. A method for fabricating nano-multilayered coatings by sequential deposition , comprising:providing an atmospheric-plasma chemical vapor deposition (AP-CVD) source and a substrate;feeding a vapor precursor to the source;depositing an amorphous oxide layer onto the substrate;depositing a nanoparticle layer onto the substrate on top of the amorphous oxide layer; andalternating deposition coatings of the amorphous oxide layer and the nanoparticle layer onto the substrate two or more times for fabricating a nano-multilayered coating of the amorphous oxide and nanoparticle layers.2. The method of claim 1 , wherein the amorphous oxide layer comprises at least one of silicon dioxide claim 1 , silicon nitride claim 1 , aluminum oxide claim 1 , and zirconium oxide.3. The method of claim 1 , further comprising:ultrasonically agitating and atomizing the nanoparticle layer for depositing onto the substrate.4. The method of claim 1 , further comprising:functionalizing a surface of the substrate with a plasma from the source comprising at least one of Helium or Argon or Silicon and Oxygen or Nitrogen gas.5. The method of claim 4 , further comprising:injecting the vapor precursor into the plasma.6. The method of claim 1 , wherein the vapor precursor has at least vapor ...

LAMINATE AND METHOD OF MANUFACTURING THE SAME, AND GAS BARRIER FILM AND METHOD OF MANUFACTURING THE SAME

A laminate of the present invention includes: a substrate made of a polymer material; an undercoat layer disposed on at least part of an outer surface of the substrate and made up of an inorganic material containing an inorganic substance having a functional group; and an atomic layer deposition film disposed so as to cover an outer surface of the undercoat layer and containing a precursor which is a deposition raw material such that the precursor located on the outer surface of the undercoat layer and the functional group of the inorganic substance are bound to each other. 1. A laminate comprising:a substrate made of a polymer material;an undercoat layer disposed on at least part of the outer surface of the substrate and made up of an inorganic material containing an inorganic substance having a functional group; andan atomic layer deposition film disposed so as to cover an outer surface of the undercoat layer and containing a precursor which is a deposition raw material such that the precursor located on the outer surface of the undercoat layer and the functional group of the inorganic substance are bound to each other.2. The laminate of claim 1 , wherein claim 1 , when a water vapor transmission rate of the substrate is defined as 100% claim 1 , the water vapor transmission rate of a two-layer laminate which is made up of the substrate and the undercoat layer is in a range of 2% or more and 100% or less.3. The laminate of claim 1 , wherein the inorganic substance is one of inorganic oxide claim 1 , inorganic nitride and a mixture of inorganic oxide and inorganic nitride.4. The laminate of claim 1 , wherein the undercoat layer contains SiOwith X in a range of 1.0 or more and 2.0 or less.5. The laminate of claim 4 , wherein the undercoat layer contains Sn.6. The laminate of claim 1 , wherein the atomic layer deposition film has a thickness in a range of 0.5 nm or more and 200 nm or less.7. A gas barrier film comprising the laminate of claim 1 , wherein the ...

Method for producing thin film, thin film forming material, optical thin film, and optical member

Disclosed are a method for producing an optical thin film having a low refractive index, a thin film forming material, an optical thin film, and an optical member. The method for producing an optical thin film includes forming a vapor deposition film by depositing a thin film forming material on an object in a non-oxidizing atmosphere by a physical vapor deposition method; and bringing the vapor deposition film into contact with a first acidic solution comprising an acidic substance in a range of pH 2.5 or more and pH 3.5 or less to obtain a first thin film having voids, wherein the thin film forming material is a mixture comprising indium oxide and silicon oxide, in which the indium oxide is in a range of 0.230 mol or more and 0.270 mol or less with respect to 1 mol of the silicon oxide.

ELECTRONIC DEVICES WTH TRANSPARENT CONDUCTING ELECTRODES, AND METHODS OF MANUFACTURE THEREOF

An embodiment of a transparent conducting electrode includes a first non-conductive layer formed from a first non-conductive material, a conductive layer, and a second non-conductive layer formed from a second non-conductive material that is different from the first non-conductive material. One or more of the transparent conducting electrodes may be incorporated into electronic devices such as solar cells, light emitting diodes, electrochromic devices, liquid crystal displays, and other devices. 1. An electronic device comprising:a substrate having a substrate top surface; anda transparent conducting electrode coupled to the substrate top surface, wherein the transparent conducting electrode includes a first non-conductive layer formed from a first non-conductive material, a conductive layer on the first non-conductive layer and formed from an electrically conductive material, and a second non-conductive layer on the conductive layer and formed from a second non-conductive material that is different from the first non-conductive material.2. The device of claim 1 , wherein the first and second non-conductive materials are selected from aluminum oxide (AlO) claim 1 , barium oxide/tellurium oxide (BaO—TeO) claim 1 , indium tin oxide (InSnO) claim 1 , cerium oxide (CeO) claim 1 , nickel oxide (NiO) claim 1 , niobium oxide (NbO) claim 1 , silicon dioxide (SiO) claim 1 , tin oxide (SnO) claim 1 , tantalum oxide (TaO) claim 1 , tungsten oxide (WO) claim 1 , zinc oxide (ZnO) claim 1 , chromium oxide (CrO) claim 1 , manganese oxide (MnO) claim 1 , titanium oxide (TiO) claim 1 , zirconium oxide (ZrO) claim 1 , boron bismuth oxide (BBiO) claim 1 , indium tin oxide (ITO) claim 1 , fluorine doped tin oxide (FTO) claim 1 , aluminum doped zinc oxide (AZO) claim 1 , indium-doped cadmium-oxide claim 1 , and a doped metal oxide.3. The device of claim 1 , wherein the first and second non-conductive materials are selected from a nitride claim 1 , a metal-nitride claim 1 , a ...

RAMAN EDGE FILTER IN DEEP-UV RANGE AND METHOD OF MANUFACTURING THE SAME

A Raman edge filter and a method of manufacturing the same, wherein in order to obtain a Raman spectrum for compound analysis in a Raman spectrometer using a deep-ultraviolet ray (UV) laser, the Raman edge filter functions to eliminate a deep-UV laser wavelength, which is a light source, and to transmit Raman scattered light. 1. A method of manufacturing a Raman edge filter in a deep-ultraviolet ray (UV) range , comprising:providing a molten silica substrate, a high-refractive-index dielectric material, and a low-refractive-index dielectric material in a vacuum chamber;evacuating an inside of the chamber, andrepeatedly depositing the high-refractive-index dielectric material and the low-refractive-index dielectric material by turns on a surface of the molten silica substrate using ion beam sputtering (IBS) until a number of deposited layers reaches a predetermined repeating number such that an irradiation light source wavelength in a deep-UV range is removed and light at a wavelength equal to or greater than the irradiation light source wavelength is transmitted.2. The method of claim 1 , wherein the high-refractive-index dielectric material comprises any one selected from among LaF claim 1 , HfO claim 1 , AlO claim 1 , and ScO claim 1 , and the low-refractive-index dielectric material comprises any one selected from among SiO claim 1 , MgF claim 1 , and NaAlF.3. The method of claim 1 , wherein the repeating number is about 200 or more.4. The method of claim 1 , wherein the irradiation light source wavelength has an optical density (OD) of about 6 or more claim 1 , and a transmittance of about 50% or more at about +4 nm.5. The method of claim 1 , wherein an ion beam of the ion beam sputtering is a Kaufman-type ion beam.6. The method of claim 1 , wherein the irradiation light source wavelength in the deep-UV range is about 213 nm.7. The method of claim 1 , wherein the repeatedly depositing is performed in a manner in which the high-refractive-index dielectric ...

Self-Healing Environmental Barrier Coating

The present inventions incorporate self-healing mechanisms into current and future EBC systems. Such approaches have the potential to form environmental protection materials (i.e. thermally grown silicate compositions) in-situ to enable the ability to provide environmental protection to SiC based ceramics even in the event that cracks or voids form from within the EBC layer. In this disclosure, novel, self-healing EBC systems are disclosed along with coating synthesis techniques required to deposit the materials, microstructures and architectures. This research is anticipated to result in a thermal/environmental barrier coating system (T/EBC) that provides improved durability over current coatings. These advancements will aid the use of Si-based ceramics in a range of high temperature applications such a gas turbine engines and heat exchangers. These advances will not only benefit military engines, but also commercial and industrial engines requiring greater performance. 3. The self-healing coating of wherein the multi-phase coating comprises at least one phase having a lower melting temperature which can heal defects in an EBC layer at the operational use temperature.4. The self-healing coating of wherein the multilayer coating comprises alternating thin layers having different phases and wherein at least one layer is an EBC layer and wherein at least one of the other layers is self-healing.5. The multilayer coating of wherein at least one of the thin layers forms rare-earth silicate scales during self-healing.6. The multilayer coating of wherein the thin layers provide enhanced erosion protection.7. The self-healing coating of wherein the multilayer coating comprises alternating thin layers having different compositions and wherein at least one layer is an EBC layer and wherein at least one of the other layers is self-healing.8. The multilayer coating of wherein at least one of the thin layers forms rare-earth silicate scales during self-healing.9. The multilayer ...

Electron-Beam Deposition of Striated Composite Layers for High-Fluence Laser Coatings

Striated composite layers are deposited using reactive electron-beam evaporation of hafnium dioxide and silicon dioxide sublayers in a planetary rotation or linear translation system in which the hafnia and silica vapor plumes are present at the same time, and yet the hafnia and silica sublayers are distinct. The resulting StriCom materials exhibit significant improvements in laser-induced damage thresholds, thin-film stresses, environmental sensitivity, and control of refractive indices relative to monolayer hafnia films.

MOISTURE RESISTANT COATING FOR BARRIER FILMS

A process for making a barrier film having a substrate, a base polymer layer applied to the substrate, an oxide layer applied to the base polymer layer, and a top coat polymer layer applied to the oxide layer is provided. An optional inorganic layer can be applied over the top coat polymer layer. The top coat polymer layer is formed by vapor depositing and curing cyclic aza-silane and acrylate monomer. The use of a silane co-deposited with an acrylate to form the top coat layer of the barrier films provide for enhanced resistance to moisture and improved peel strength adhesion of the top coat layer to the underlying barrier stack layers. 1. A process for making a barrier film , comprising:providing a substrate;vapor depositing and curing a base polymer layer to the substrate;applying an oxide layer to the base polymer layer; andvapor depositing and curing cyclic aza-silane and acrylate monomer having a molecular weight in a range of about 150 to about 600 grams per mole to form a top coat polymer layer on the oxide layer, wherein the cyclic aza-silane and the acrylate monomer are simultaneously vapor deposited.2. The process of claim 1 , wherein the applying the oxide layer step comprises sputter depositing an oxide onto the base polymer layer to form the oxide layer.3. The process of claim 1 , further comprising repeating the vapor depositing step and the applying step to apply a plurality of the alternating layers of the base polymer layer and the oxide layer between the substrate and the top coat polymer layer.4. The process of claim 1 , wherein the applying base polymer layer step comprises applying an acrylate smoothing layer to the substrate.5. The process of claim 1 , wherein the applying the oxide layer step comprises applying a layer of an inorganic silicon aluminum oxide to the base polymer layer.6. The process of claim 1 , further comprising applying an inorganic layer to the top coat polymer layer.7. The process of claim 6 , wherein the applying the ...

NEAR INFRARED OPTICAL INTERFERENCE FILTERS WITH IMPROVED TRANSMISSION

An interference filter includes a layers stack comprising a plurality of layers of at least: layers of amorphous hydrogenated silicon with added nitrogen (a-Si:H,N) and layers of one or more dielectric materials, such as SiO, SiO, SiON, a dielectric material with a higher refractive index in the range 1.9 to 2.7 inclusive, or so forth. The interference filter is designed to have a passband center wavelength in the range 750-1000 nm inclusive. Added nitrogen in the a-Si:H,N layers provides improved transmission in the passband without a large decrease in refractive index observed in a-Si:H with comparable transmission. Layers of a dielectric material with a higher refractive index in the range 1.9 to 2.7 inclusive provide a smaller angle shift compared with a similar interference filter using SiOas the low index layers. 134-. (canceled)35. A method of manufacturing an interference filter comprising alternating a-Si:H ,N and silicon-based dielectric layers , the method comprising:sputtering silicon from a silicon target onto a filter substrate; and (i) a process gas including hydrogen and nitrogen in order to deposit a-Si:H,N having a refractive index in the range 3.3 to 3.5 inclusive to form each a-Si:H,N layer; and', {'sub': x', 'x', 'y', '3', '4, '(ii) at least one of a process gas including oxygen in order to deposit SiO, a process gas including oxygen and nitrogen in order to deposit silicon oxynitride (SiON), or a process gas including nitrogen in order to deposit silicon nitride (SiN) to form each silicon-based dielectric layer;'}], 'during the sputtering, alternating betweenwherein the a-Si:H,N layers have an atomic concentration of hydrogen between 4% and 8% and an atomic concentration of nitrogen between 2% and 12%;wherein the silicon-based dielectric layers have a refractive index lower than a refractive index of the a-Si:H,N, and wherein at least one of the silicon-based dielectric layers has a refractive index in the range of 1.9 to 2.7 inclusive.36. The ...

Multilayer Diamond Display System and Method

Disclosed herein is a transparent glass system that includes an optical grade silicon substrate, a transparent substrate layer; a titanium dioxide transparent layer, the transparent layer having an index of refraction of 2.35 or greater; and a polycrystalline diamond layer, wherein the transparent layer is between the substrate layer and the polycrystalline diamond layer.

SILICONE FILM WITH GAS BARRIER PROPERTIES

The disclosure provides a silicone resin film with water vapor barrier property formed by curing a curable silicone resin composition, wherein the curable silicone resin composition comprises 10 to 25 parts by weight of a linear polysiloxane; 40 to 55 parts by weight of a first silicone resin wherein the first silicone resin have at least following siloxane units represented by the general formulas: RSiOand RSiO, wherein the molar fraction of RSiOunit is present in the range of 0.60 to 0.75 in the general formula; 15 to 30 parts by weight of a second silicone resin; 15 to 25 parts by weight of a polysiloxane having silicon-hydrogen bond; 10 to 40 parts by weight of microsheets; and a platinum group metal catalyst. 1. A silicone resin film with water vapor barrier property , which is formed by curing a curable silicone resin composition , wherein the curable silicone resin composition comprising:10 to 25 parts by weight of a linear polysiloxane;{'sup': 1', '2', '1', '2', '1, 'sub': 3/2', '2', '2/2', '3/2, '40 to 55 parts by weight of a first silicone resin, wherein the first silicone resin have at least following unit represented by the general formulas: RSiOand RSiO, Rand Rare independently substituted or unsubstituted alkyl group, substituted or unsubstituted alkenyl group, or substituted or unsubstituted aryl group, and the molar fraction of RSiOunit is present in the range of 0.60 to 0.75 in the general formula, and the molar ratio of the alkenyl groups bonded to Si atoms to the functional groups bonded to Si atoms is in the range of 0.03 to 0.15;'}{'sup': 3', '4', '3', '4, 'sub': 3/2', '3', '1/2, '15 to 30 parts by weight of a second silicone resin, wherein the second silicone resin have at least following units represented by the general formulas: RSiOand RSiO, Rand Rare independently substituted or unsubstituted alkyl group, substituted or unsubstituted alkenyl group, or substituted or unsubstituted aryl group;'}{'sup': 5', '6', '5', '5', '6, 'sub': 2', '2', ' ...

GAS BARRIER MULTILAYER FILM

Provided is a gas barrier laminate film capable of realizing excellent gas barrier property, water resistance, and adhesiveness, having a plastic substrate (A), a silicon oxide layer (B) formed on at least one surface of the plastic substrate (A), and a coat layer (C) formed by applying a coating solution onto a surface of the silicon oxide layer (B), wherein the coating solution comprises a mixture of a polyurethane-based resin (c1) and a silane coupling agent (c2) and contains a reaction product of (c1) with (c2) as a main component; and a number-average molecular weight of the reaction product is in the range of 100,000 to 1,000,000. 1: A gas barrier laminate film , comprising:a plastic substrate (A);a silicon oxide layer (B) formed on at least one surface of the plastic substrate (A); anda coat layer (C) formed by applying a coating solution onto a surface of the silicon oxide layer (B),whereinthe coating solution comprises a mixture of a polyurethane-based resin (c1) and a silane coupling agent (c2) and contains a reaction product of (c1) with (c2) as a main component, anda number-average molecular weight of the reaction product is in the range of 100,000 to 1,000,000.2: A gas barrier laminate film , comprising:a plastic substrate (A);a silicon oxide layer (B) formed on at least one surface of the plastic substrate (A); anda coat layer (C) formed by applying a coating solution onto a surface of the silicon oxide layer (B),{'sup': '2', 'wherein the coating solution comprises a mixture of a polyurethane-based resin (c1) and a silane coupling agent (c2) and contains a reaction product of (c1) with (c2) as a main component, and an oxygen permeability is 5 mL/m/24-hours/MPa or less.'}3: The gas barrier laminate film according to claim 1 , wherein the polyurethane-based resin (c1) is obtained by reaction of a polyol and a polyisocyanate claim 1 , and the polyisocyanate is at least one selected from the group consisting of xylylene diisocyanate and hydrogenated ...

LAMINATED BODY

A laminated body includes a substrate provided with a first surface; a rugged layer including fluorine; and an antifouling layer. The rugged layer has an average surface roughness of 0.05-50 nm. A peak of a binding energy of F1s in the rugged layer falls within 684-687.5 eV, a ratio of atomic concentrations of fluorine to silicon obtained from peaks of binding energies of F1s and Si2p falls within 0.003-100. A peak of a binding energy of F1s in the antifouling layer falls within 687.5-691 eV. An F-value, (A−B)/(C−B), is 0.1 or more, where “A” is an F-Kα line strength of the laminated body measured from the antifouling layer side by a fluorescent X-ray measurement device, “B” is an F-Kα line strength of a glass plate with only trace amounts of fluorine, and “C” is an F-Kα line strength of an aluminosilicate glass plate including fluorine of 2 wt %. 1. A laminated body comprising , in this order:a substrate provided with a first surface;a rugged layer including fluorine; andan antifouling layer,wherein the rugged layer has an arithmetic average surface roughness Ra that falls within a range from 0.05 nm to 50 nm,wherein a peak of a binding energy of F1s of fluorine in the rugged layer falls within a range of greater than or equal to 684 eV and less than or equal to 687.5 eV, a ratio of an atomic concentration (atm %) of fluorine obtained from the peak of the binding energy of F1s of fluorine to an atomic concentration (atom %) of silicon obtained from a peak of a binding energy of Si2p of silicon, i.e. F1s/Si2p, falls within a range from 0.003 to 100,wherein a peak of a binding energy of F1s of fluorine in the antifouling layer falls within a range of greater than 687.5 eV and less than or equal to 691 eV, andwherein an F-value expressed by (A−B)/(C−B) is greater than or equal to 0.1,where “A” is an F-Kα line strength of the laminated body measured from the antifouling layer side by a fluorescent X-ray measurement device, “B” is an F-Kα line strength of a glass plate ...

TRANSPARENT OMNIPHOBIC THIN FILM ARTICLES

An article having a nanostructured surface and a method of making the same are described. The article can include a substrate and a nanostructured layer bonded to the substrate. The nanostructured layer can include a plurality of spaced apart nanostructured features comprising a contiguous, protrusive material and the nanostructured features can be sufficiently small that the nanostructured layer is optically transparent. A surface of the nanostructured features can be coated with a continuous hydrophobic coating. The method can include providing a substrate; depositing a film on the substrate; decomposing the film to form a decomposed film; and etching the decomposed film to form the nanostructured layer. 1. A method comprising:applying a glass film to a substrate;heating the glass film to a temperature and for a duration sufficient to phase-separate the glass;differentially etching the glass to create a porous interpenetrating structure;modifying a surface chemistry of the porous interpenetrating structure; andadding a lubricating fluid to at least one pore of the porous interpenetrating structure.2. The method according to claim 1 , wherein the glass film is applied to the substrate by one selected from the group consisting of radio frequency (RF) sputtering claim 1 , chemical vapor deposition (CVD) claim 1 , metallorganic chemical vapor deposition (MOCVD) claim 1 , screen printing claim 1 , ink-jet printing claim 1 , spray painting claim 1 , plasma spraying claim 1 , pulsed laser ablation claim 1 , sputtering claim 1 , e-beam co-evaporation claim 1 , wet solution chemical deposition (sol-gel claim 1 , dip-coating) approaches and combinations thereof.3. The method according to claim 1 , wherein the glass film comprises one selected from the group consisting of sodium borosilicate glass claim 1 , a soda lime glass claim 1 , and combinations thereof.4. The method according to claim 1 , wherein the temperature is from 500 to 800 degrees Celsius.5. The method ...

APPARATUS FOR MANUFACTURING AN ADHESIVE-FREE GAS BARRIER FILM HAVING A CERAMIC BARRIER LAYER

The present invention relates to an apparatus for manufacturing an adhesive-free gas barrier film comprising conveying means for conveying a film web; at least one first lock system for introducing the film web into a coating chamber of the apparatus; at least one first coating means by means of which the film web can be at least partially coated by depositing a barrier material in the coating chamber; and optionally at least one second lock system for expelling the film web out of the coating chamber; and at least one second coating means by means of which the coated film web can be at least partially coated by extrusion of a plastic melt. 110-. (canceled)11. A method of manufacturing an adhesive-free gas barrier film comprising the steps:optionally, extruding a plastic melt to form a carrier film;{'b': 30', '135, 'conveying, in particular inline conveying, of a carrier film () to at least one lock system ();'}{'b': 30', '135', '130, 'introducing the carrier film () through the lock system () into a coating chamber ();'}{'b': '30', 'depositing a barrier layer onto the carrier film ();'}{'b': 30', '200, 'optionally, expelling the film () through a lock system (); and'}coating, in particular inline coating, of the barrier layer by applying a plastic melt.12. A method in accordance with claim 11 , characterized in that the steps{'b': '30', 'extruding at least one plastic melt through at least one extrusion nozzle for manufacturing at least one carrier film (); and'}{'b': '30', 'conveying the obtained extruded film to the coating chamber, are carried out inline at the start of the method to obtain the carrier film ().'}13. A method in accordance with characterized in that the conveying speed of the film amounts to at least 3 m/min claim 11 , in particular between 30 m/min and 45 m/min claim 11 , further in particular between 30 and 300 m/min claim 11 , or up to 240 m/min claim 11 , or up to 150 m/min and below claim 11 , in particular to a maximum of 300 m/min claim 11 ...

BIRD FRIENDLY ELECTROCHROMIC DEVICES

Various embodiments herein relate to electrochromic windows that are bird friendly, as well as methods and apparatus for forming such windows. Bird friendly windows include one or more elements that make the window visible to birds so that the birds recognize that they cannot fly through the window. Bird friendly windows can be used to minimize avian-window collisions, and therefore minimize avian deaths resulting from such collisions. In various embodiments, a window may be patterned such that the pattern is visible to birds. In these or other cases, the window may be made hazy, where the haze is visible to birds. The pattern and/or haze may be visible at wavelengths that fall in UV, and minimally noticeable (if at all) in wavelengths within the spectrum visible by humans. 1. A window comprising:(a) one or more transparent substrates, wherein at least one of the substrates is an electrochromic (EC) lite having an electrochromic device coating thereon; (i) a first feature that provides an average of at least about 10% more reflection or scattering of electromagnetic radiation at wavelengths between about 300-400 nm than at wavelengths between about 400-700 nm, and', '(ii) a second feature that is substantially transparent to electromagnetic radiation at wavelengths between about 300-700 nm, the first and second features being interspersed with one another., '(b) a pattern disposed on at least one of the substrates, the pattern comprising2. The window of claim 1 , wherein the substrate on which the pattern is disposed is the EC lite.3. The window of claim 1 , wherein the pattern is at least partially defined in a patterned layer comprising at least one of titanium oxide claim 1 , aluminum oxide claim 1 , tantalum oxide claim 1 , tin oxide claim 1 , silicon oxide claim 1 , aluminum nitride claim 1 , and silicon nitride.4. The window of claim 1 , wherein the patterned layer comprises titanium dioxide.5. The window of claim 4 , wherein the first feature comprises an ...

SAPPHIRE THIN FILM COATED SUBSTRATE

A method to transfer a layer of harder thin film substrate onto a softer, flexible substrate. In particular, the present invention provides a method to deposit a layer of sapphire thin film on to a softer and flexible substrate e.g. quartz, fused silica, silicon, glass, toughened glass, PET, polymers, plastics, paper and fabrics. This combination provides the hardness of sapphire thin film to softer flexible substrates 1. A sapphire-coated substrate made by a method comprising:an e-beam evaporation or sputtering deposition process at room temperature or 25° C., wherein sapphire is deposited directly on to a substrate selected from quartz, fused silica, silicon, glass, or toughened glass to form the sapphire-coated substrate, wherein the substrate during deposition is without external cooling or heating; andan annealing process, wherein said sapphire-coated substrate is annealed under an annealing temperature ranging between approximately room temperature or 25° C. and 2040° C. for an effective duration of time.2. The sapphire-coated substrate according to claim 1 , wherein said substrate comprises at least one material with a Mohs value less than that of said sapphire.3. The sapphire-coated substrate according to claim 1 , wherein said sapphire is deposited as a sapphire thin film on to said substrate.4. The sapphire-coated substrate according to claim 1 , wherein said sapphire is deposited as a doped sapphire thin film on to said substrate.5. The sapphire-coated substrate according to claim 4 , wherein the doped sapphire thin film is doped with doping element comprising one or more of chromium claim 4 , chromium oxide claim 4 , magnesium claim 4 , magnesium oxide claim 4 , beryllium claim 4 , beryllium oxide claim 4 , lithium claim 4 , lithium oxide claim 4 , sodium claim 4 , sodium oxide claim 4 , potassium claim 4 , potassium oxide claim 4 , calcium claim 4 , calcium oxide claim 4 , molybdenum claim 4 , molybdenum oxide claim 4 , silicon claim 4 , silicon oxide ...

Carbon-based Nano-thin Film for Enhancing Surface Abrasion Resistance on Sapphire Thin Film

The present disclosure relates to display, windows, camera cover, lens and lens cover, optical/infra-red sensors, glasses and spectacles. 1. A method of enhancing surface abrasion resistance on a substrate comprising depositing a carbon-based film with a thickness of no more than 100 nm on to said substrate such that the carbon-based film deposited substrate has an optical transmittance of at least 70%.2. The method of claim 1 , wherein the substrate comprises glass claim 1 , quartz claim 1 , fused silica claim 1 , metals and sapphire.3. The method of claim 1 , wherein said depositing comprises physical vapor deposition and/or chemical vapor deposition.4. The method of claim 3 , wherein the physical vapor deposition comprises DC sputtering claim 3 , RF sputtering claim 3 , thermal evaporation claim 3 , and e-beam evaporation.5. The method of claim 3 , wherein said chemical vapor deposition is plasma enhanced chemical vapor deposition.6. The method of claim 1 , wherein said deposition is carried out in a temperature from about room temperature to about 800° C.7. The method of claim 1 , wherein said carbon-based film comprises one or more of C60 claim 1 , carbon nano-tube claim 1 , graphene claim 1 , graphite claim 1 , diamond-like carbon claim 1 , and/or metal.8. The method of claim 7 , wherein the carbon-based film comprises graphite and metal in which the metal is deposited as a precursor to enhance adhesion between the substrate and the carbon-based film claim 7 , and wherein the thickness ratio between the metal layer and the carbon-based film is no more than 1:10.9. The method of claim 7 , wherein the metal is deposited by physical vapor deposition comprising DC sputtering claim 7 , RF sputtering and e-beam evaporation.10. The method of wherein said metal comprises aluminium claim 7 , silver claim 7 , chromium claim 7 , titanium claim 7 , and magnesium.11. The method of claim 7 , wherein said metal is deposited at a temperature from about room temperature to 900 ...

AN INTERFERENCE COATING OR ITS PART CONSISTING LAYERS WITH DIFFERENT POROSITY

A Coating, a system of coatings and a method to produce thin film coating, deposited by a stream of particles, produced by thermal evaporation or magnetron/ion-beam sputtering, wherein the thin film coating comprises at least 3 distinct refractive index layers, out of a single target () material. In the process of the coating, vapor flux or particle stream is pointed obliquely to the uncovered surface of the substrate (), which can be rotated about an axis (), parallel to the surface of the substrate. The substrates can also be rotated about an axis (), co-aligned with the normal vector of the substrate, to obtain an evenly deposited coating with the desired amorphous structure. The structure of the coating is selected in a pattern, which allows the porosity in-between adjacent layers to be varied. As a consequence, achieving a reflectance of the coating of at least 90% for at least one frequency radiation or polarization component. 1. A multilayer dielectric coating having a refractive index modulation as a function of coating thickness , where an energy band gap of the coating material is 6 eV or higher and the refractive index modulation is realized by depositing the same target material and obtaining different porosity , characterized in that the entire coating or at least an upper surface region is formed to have an amorphous structure and a coating reflection coefficient , which is higher than 90% for at least one frequency of radiation or one polarization component.2. The dielectric thin film coating according to claim 1 , characterized in that the multilayer coating is formed from sub-layers having discretely varying refractive index and porosity.3. The dielectric thin film coating according to claim 1 , characterized in that the coating is arranged to have a continuously varying refractive index modulation claim 1 , which is achieved through continuously varying coating porosity modulation claim 1 , formed during the coating process.4. The dielectric thin ...

COVER GLASS AND PROCESS FOR PRODUCING THE SAME

A cover glass includes a glass substrate and an antireflection film disposed on at least one of main surfaces of the glass substrate, and the at least one of main surfaces of the glass substrate has one or more cracks formed therein, the crack(s) each having a length of 5 μm or less, and a difference Δa* in a* value between any two points within a surface of the cover glass on the side where the antireflection film has been disposed and a difference Δb* in b* value between any two points within the surface of the cover glass on the side where the antireflection film has been disposed satisfy the following expression: 1. A cover glass comprising a glass substrate and an antireflection film disposed on at least one of main surfaces of the glass substrate , whereinthe at least one of main surfaces of the glass substrate has one or more cracks formed therein, the crack(s) each having a length of 5 μm or less, and {'br': None, 'i': a', 'b, 'sup': 2', '2, '√{(Δ*)+(Δ*)}≦4\u2003\u2003(1)'}, 'a difference Δa* in a* value between any two points within a surface of the cover glass on the side where the antireflection film has been disposed and a difference Δb* in b* value between any two points within the surface of the cover glass on the side where the antireflection film has been disposed satisfy the following expression (1).'}2. The cover glass according to claim 1 , wherein the Δa* and the Δb* are determined by selecting any square portion of 10 cmas a measuring range from the surface of the cover glass on the side where the antireflection film has been disposed claim 1 , dividing the measuring range into 11×11 equal portions claim 1 , examining all 100 intersections of equally dividing lines for a* values and b* values claim 1 , determining a maximum value a*of the a* values claim 1 , a minimum value a*of the a* values claim 1 , a maximum value b*of the b* values claim 1 , and a minimum value b*of the b* values claim 1 , from the a* values and b* values claim 1 , and ...

BIRD FRIENDLY ELECTROCHROMIC DEVICES

Various embodiments herein relate to electrochromic windows that are bird friendly, as well as methods and apparatus for forming such windows. Bird friendly windows include one or more elements that make the window visible to birds so that the birds recognize that they cannot fly through the window. Bird friendly windows can be used to minimize avian-window collisions, and therefore minimize avian deaths resulting from such collisions. In various embodiments, a window may be patterned such that the pattern is visible to birds. In these or other cases, the window may be made hazy, where the haze is visible to birds. The pattern and/or haze may be visible at wavelengths that fall in UV, and minimally noticeable (if at all) in wavelengths within the spectrum visible by humans. 1. (canceled)2. An electrochromic insulated glass unit (IGU) comprising:{'b': 1', '2, 'claim-text': [{'b': 1', '2, '(i) wherein S is configured to be outboard of S, and'}, {'b': 1', '1, '(ii) wherein S comprises a pattern configured to discourage birds from impacting the IGU, the pattern being either etched or coated on S;'}], '(a) a first lite comprising surfaces S and S on opposite faces of the first lite,'}{'b': 3', '4, 'a second lite comprising surfaces S and S on opposite faces of the second lite, wherein the second lite is configured to be positioned inboard of the first lite; and'}(b) an electrochromic device disposed on the first lite or on the second lite.3. The IGU of claim 2 , wherein the pattern is etched by sandblasting.4. The IGU of claim 2 , wherein the pattern is etched by laser etching claim 2 , plasma etching claim 2 , or ion milling.5. The IGU of claim 2 , wherein the pattern is etched and is at least partially defined in a layer comprising at least one of titanium oxide claim 2 , aluminum oxide claim 2 , tantalum oxide claim 2 , tin oxide claim 2 , silicon oxide claim 2 , aluminum nitride claim 2 , and silicon nitride.6. The IGU of claim 2 , wherein the electrochromic device ...

ANTIREFLECTIVE MEMBER AND METHOD OF MANUFACTURE THEREFOR

Provided is an antireflective member that has a water- and oil-repellent layer on a multi-layered antireflective layer and is capable of exhibiting excellent surface lubricity, water- and oil-repellent properties, and durability. The surface of the multi-layered antireflective layer on a base material has a root-mean-square surface roughness of 0.8 nm to 2.0 nm. The water- and oil-repellent layer has a thickness of 1 to 30 nm and is a cured product of water- and oil-repellents having as principal components a fluorooxyalkylene group-containing polymer modified organosilicon compound with the numerical average molecular weight of 4,500 to 10,000 of a fluoropolymer part and/or partial hydrolysis condensate thereof. 1. An antireflective member comprising:a water- and oil-repellent layer that has a thickness of 1 to 30 nm and is a cured product of water- and oil-repellents having as principal components a fluorooxyalkylene group-containing polymer modified organosilicon compound with a numerical average molecular weight of 4,500 or more and 10,000 or less of a fluoropolymer part and/or partial hydrolysis condensate thereof, on a multi-layered antireflective layer in which a surface of the multi-layered antireflective layer on a base material has a root-mean-square surface roughness of 0.8 nm or more and 2.0 nm or less.2. The antireflective member according to claim 1 , wherein the multi-layered antireflective layer is a multi-layered antireflective layer using at least two kinds selected from MgF claim 1 , MgO claim 1 , SiO claim 1 , SiO claim 1 , CeF claim 1 , NdF claim 1 , LaF claim 1 , AlF claim 1 , YF claim 1 , BaF claim 1 , CaF claim 1 , AlO claim 1 , SiN(x is a positive number of 1 to 1.5) claim 1 , ITO claim 1 , InO claim 1 , SnO claim 1 , ZrO claim 1 , TiO claim 1 , TiO claim 1 , TiO claim 1 , TiO claim 1 , TiNO(x′ is a positive number of 1 to 4 and y is a positive number of 1 to 12) claim 1 , NbO claim 1 , TaO claim 1 , YO claim 1 , ZnS claim 1 , WOHfO claim 1 ...

FUNCTIONALIZED SUBSTRATE

The present invention relates to a functionalized substrate comprising a substrate () and a near infrared absorbing coating (), wherein said near infrared absorbing coating () comprises near infrared absorbing nanoparticles () comprising indium, tin, zinc, antimony, aluminum, tungsten or mixtures thereof. In an embodiment, the near infrared absorbing coating () further includes an inorganic matrix (). 1. A functionalized substrate comprising a substrate and a near infrared absorbing coating , wherein said near infrared absorbing coating comprises near infrared absorbing nanoparticles comprising indium , tin , zinc , antimony , aluminum , tungsten or mixtures thereof.2. The functionalized substrate according to claim 1 , wherein the near infrared absorbing nanoparticles comprise a transparent conductive oxide selected from the group consisting of indium tin oxide claim 1 , indium zinc oxide claim 1 , antimony tin oxide claim 1 , tin zinc oxide claim 1 , fluorine-doped tin oxide claim 1 , aluminum-doped zinc oxide claim 1 , gallium-doped zinc oxide claim 1 , and optionally doped tungsten oxide.3. The functionalized substrate according to claim 1 , wherein the near infrared absorbing nanoparticles have a core-shell structure with a metallic core and an at least partially oxidized shell.4. The functionalized substrate according to claim 2 , wherein the transparent conductive oxide is indium tin oxide.5. The functionalized substrate according to claim 1 , wherein the near infrared absorbing nanoparticles have a diameter from 0.2 to 150 nm.6. The functionalized substrate according to claim 1 , wherein the near infrared absorbing nanoparticles are spaced apart from each other.7. The functionalized substrate according to claim 1 , wherein the near infrared absorbing coating comprises near infrared absorbing nanoparticles dispersed within an inorganic encapsulating layer.8. The functionalized substrate according to claim 1 , wherein the near infrared absorbing coating ...

Material comprising a functional layer made from silver, crystallised on a nickel oxide layer

A process for obtaining a material including a transparent substrate coated with a stack of thin layers which are deposited by cathode sputtering, optionally assisted by a magnetic field, including at least one silver-based functional metal layer and at least two antireflective coatings, each antireflective coating including at least one dielectric layer, so that each functional metal layer is positioned between two antireflective coatings, the process includes the sequence of following stages: (a) an antireflective coating including at least one thin layer based on crystalline nickel oxide is deposited, then (b) at least one silver-based functional metal layer is deposited above and in contact with the thin layer based on crystalline nickel oxide.

GAS BARRIER FILM

A gas barrier film including a polymer base, an undercoat layer that contains, as the main component, an acrylic resin having at least one side chain selected from the group consisting of the side chains (I) to (III) mentioned below, and an inorganic layer, wherein the undercoat layer and the inorganic layer are arranged in this order on at least one surface of the polymer base in such a manner that the undercoat layer and the inorganic layer are in contact with each other: (I) a side chain having an acrylic polymer skeleton; (II) a side chain having a dimethylsiloxane skeleton; and (III) a side chain having a skeleton containing a fluorine atom. 1. A gas barrier film comprising a polymer base laminated , at least on one surface thereof , with an inorganic layer , wherein the inorganic layer comprises a layer [B1] or a layer [B2] as specified below:Layer [B1]: a layer of a phase in which zinc oxide, silicon dioxide, and aluminum oxide coexist,Layer [B2]: a layer of a phase in which zinc sulfide and silicon dioxide coexist.27.-. (canceled)8. Gas barrier film as described in claim 1 , wherein the inorganic layer has a thickness of 10 to 1 claim 1 ,000 nm.9. (canceled)10. Gas barrier film as described in claim 1 , wherein the inorganic layer is a layer [B1] as specified above and the layer [B1] has a zinc (Zn) atom concentration of 20 to 40 atom % claim 1 , a silicon (Si) atom concentration of 5 to 20 atom % claim 1 , an aluminum (Al) atom concentration of 0.5 to 5 atom % claim 1 , and an oxygen (O) atom concentration of 35 to 70 atom % as determined by ICP emission spectroscopy analysis.11. Gas barrier film as described in claim 1 , wherein the inorganic layer is a layer [B2] as specified above and the layer [B2] has a composition in which zinc sulfide accounts for a mole fraction of 0.7 to 0.9 of the total quantity of zinc sulfide and silicon dioxide.12. Gas barrier film as described in claim 1 , wherein the inorganic layer has a surface roughness Ra of 2 nm or less. ...

Transparent member, imaging apparatus, and method for producing transparent member

Provided are a transparent member having excellent transparency and maintaining anti-fogging properties for a long period of time and a method for producing a transparent member. A transparent member includes a substrate and a stacked body having an organic layer and an inorganic porous layer stacked on the substrate in the mentioned order such that the both layers are in contact with each other, in which the organic layer includes an organic molecular chain network including an organic polymer chain and an organic crosslinking chain having 3 or more to 30 or less carbon atoms, and an acidic group aggregate, and in which the inorganic porous layer has hydrophilicity and includes silicon oxide.

FABRICATING HIGHLY DURABLE NANOSTRUCTURED COATINGS ON POLYMER SUBSTRATE

A method of forming a coating that includes depositing a multicomponent glass layer on a polymer substrate and depositing a heat absorbing layer on the multicomponent glass layer. Inducing spinodal decomposition of the multicomponent glass layer by annealing the heat absorbing layer, and etching at least one of a phase separated component of the multicomponent glass layer. The spinodal decomposition may be achieved through a pulse thermal or electromagnetic assisted annealing process. The coating may then be used as a hydrophilic surface, or may be fluorinated using conventional methods to produce the superhydrophobic coating. 1. A method of forming a coating , comprising:depositing a multicomponent glass layer on a polymer substrate;depositing a heat absorbing layer on the multicomponent glass layer;inducing spinodal decomposition of the multicomponent glass layer by annealing the heat absorbing layer; andetching at least one of a phase separated component of the multicomponent glass layer.2. The method according to claim 1 , further comprising:fluorinating, after etching, the multicomponent glass layer.3. The method according to claim 1 , wherein the multicomponent glass layer thickness is between 100 nm and 5 microns.4. The method according to claim 1 , wherein the multicomponent glass layer is deposited using sputtering.5. The method according to claim 1 , wherein the multicomponent glass layer is deposited using wet coating process.6. The method according to claim 1 , wherein the heat absorbing layer thickness is between 10 nm and 500 nm.7. The method according to claim 1 , wherein the heat absorbing layer is copper.8. The method according to claim 1 , wherein annealing of the heat absorbing layer is achieved by a rapid thermal pulse.9. The method according to claim 1 , wherein annealing of the heat absorbing layer is achieved by the application of electromagnetic radiation.10. The method according to claim 1 , wherein annealing of the heat absorbing layer ...

Methods for Encapsulating Nanocrystals and Resulting Compositions

The present invention provides methods for hermetically sealing luminescent nanocrystals, as well as compositions and containers comprising hermetically sealed luminescent nanocrystals. By hermetically sealing the luminescent nanocrystals, enhanced lifetime and luminescence can be achieved. 120-. (canceled)21. A film comprising luminescent nanocrystals embedded in a polymeric matrix and disposed on a substrate , and a barrier layer disposed on the polymeric matrix , wherein the nanocrystals are thereby hermetically sealed.22. The film of claim 21 , wherein the substrate is a polymeric material.23. A light emitting diode (LED) comprising the film of .24. A cellular telephone claim 21 , personal digital assistant claim 21 , personal media player claim 21 , a video output device claim 21 , personal color claim 21 , eyewear claim 21 , a heads up or heads down display for an automobile or airplane claim 21 , or a digital light processor comprising the film of . This application is a continuation of U.S. patent application Ser. No. 16/248,127, filed Jan. 15, 2019, which is a continuation of U.S. patent application Ser. No. 15/695,220, filed Sep. 5, 2017, now U.S. Pat. No. 10,214,686, which is a continuation-in-part of U.S. patent application Ser. No. 14/858,585, filed Sep. 18, 2015, now abandoned, which is a divisional of U.S. patent application Ser. No. 14/194,996, filed Mar. 3, 2014, now U.S. Pat. No. 9,139,767, which is a divisional of U.S. patent application Ser. No. 13/684,782, filed Nov. 26, 2012, now U.S. Pat. No. 8,697,471, which is a divisional of U.S. patent application Ser. No. 12/318,516, filed Dec. 30, 2008, now U.S. Pat. No. 8,343,575, each of which are incorporated herein by reference in their entirety.The present invention relates to methods for hermetically sealing luminescent nanocrystals, and hermetically sealed nanocrystal compositions. The present invention also provides microspheres comprising luminescent nanocrystals as well as methods of making the ...

GLASS SUBSTRATE WITH ANTIFOULING LAYER AND FRONT PLATE FOR DISPLAY

A glass substrate with an antifouling layer includes: a glass substrate which has a pair of principal surfaces facing to each other; a cohesive layer provided on the side of one principal surface of the glass substrate; and an antifouling layer provided on a surface of the cohesive layer, wherein the cohesive layer has a layer, the layer is in contact with the antifouling layer, contains mainly a silicon oxide, and contains carbon atoms at a concentration of 5×10atoms/cmto 5×10atoms/cm. 1. A glass substrate with an antifouling layer , comprising:a glass substrate which has a pair of principal surfaces facing to each other;a cohesive layer provided on the side of one principal surface of the glass substrate; andan antifouling layer provided on a surface of the cohesive layer,{'sup': 18', '3', '19', '3, 'wherein the cohesive layer has a layer, the layer is in contact with the antifouling layer, contains mainly a silicon oxide, and contains carbon atoms at a concentration of 5×10atoms/cmto 5×10atoms/cm.'}2. The glass substrate with the antifouling layer according to claim 1 ,wherein the layer which is in contact with the antifouling layer has an arithmetic mean roughness (Ra) of 3 nm or less.3. The glass substrate with the antifouling layer according to claim 1 ,wherein the cohesive layer is constituted by one or more layers to eight layers or less.4. The glass substrate with the antifouling layer according to claim 1 ,wherein the cohesive layer is a laminate of a layer made of one or more kinds of compounds selected from a silicon nitride, a niobium oxide, a tantalum oxide, and a zirconium oxide, and a layer made of the silicon oxide alternately.5. The glass substrate with the antifouling layer according to claim 1 ,wherein the antifouling layer is made of a cured product of a film-forming composition containing a fluorine-containing hydrolyzable silicon compound.6. The glass substrate with the antifouling layer according to claim 1 ,wherein the one principle surface ...

Method of making conducting ceramic glass with texture and smoothness

A method for making ceramic glass that is textured, hard, transparent and conducting, for use in various electronic devices and displays, such as LEDs, solar cells, the covers of solar panels, CICs used in satellites, smartphones, and computer displays. The ceramic glass can also be used for window shields in automobiles, and in any other industries where anti-scratch glass is beneficial. The ceramic glass is composed of ultra-thin layers which reduces the cost of manufacturing, and provides advantageous properties such as smoothness for stringent electronic device fabrication requirements. The method includes depositing a crystalline MgO film on a glass substrate at a temperature below the softening point of the glass, depositing a metal thin-film one nanometer at a time on said MgO film on the glass substrate at a similar temperature while keeping the substrate heated, wherein said MgO film is less than 1 micron thick, and said metal thin-film is less than 20 nanometers thick, and introducing O 2 after each one nanometer layer of said metal thin film.

Solid Phase Coatings for Microextraction

An extractive system, such as SPME, has an adsorptive phase in the form of a porous coating that has essentially vertical, mutually supporting, columnar structures with nanospaces at the boundaries of the grains. 114-. (canceled)15. A method for manufacturing an extractive apparatus in which analytes are adsorbed onto an extractive phase and subsequently desorbed , the method for manufacturing comprising:providing a substrate with a surface;producing vapor of a coating precursor material by sputtering a target with plasma, a distance between the target and the substrate being greater than a mean free path of atoms in the vapor; andcoating the surface with an adsorptive porous phase to create the extractive phase on the surface, performed under conditions sufficient to form:a porous coating of mutually supporting columnar nanostructures which are close to perpendicular to a surface plane of the substrate; andnanospaces at boundaries between adjacent columnar nanostructures.16. A method for manufacturing an extractive apparatus in which analytes are adsorbed onto an extractive phase and subsequently desorbed , the method for manufacturing comprising: producing vapor of a coating precursor material by sputtering a target with plasma; and', 'coating the surface with an adsorptive porous phase to create the extractive phase on the surface, wherein atoms in the vapor impinge upon the surface at an oblique angle and coating is performed under conditions sufficient to form:', 'a porous coating of mutually supporting columnar nanostructures; and', 'nanospaces at boundaries between adjacent columnar nanostructures., 'providing a substrate with a surface;'}17. A method for manufacturing an extractive apparatus in which analytes are adsorbed onto an extractive phase and subsequently desorbed , the method for manufacturing comprising:providing a substrate with a surface;producing vapor of a coating precursor material by sputtering a target with plasma; andcoating the substrate ...