ПОДЛОЖКА С ЭЛЕКТРОНОДОНОРНОЙ ПОВЕРХНОСТЬЮ, СОДЕРЖАЩЕЙ ЧАСТИЦЫ МЕТАЛЛА, ВКЛЮЧАЯ ПАЛЛАДИЙ

Изобретение относится к медицине. Описана подложка, имеющая электронодонорную поверхность, на которой имеются металлические частицы, содержащие палладий и по меньшей мере один металл, выбранный из группы, состоящей из золота, рутения, родия, осмия, иридия и платины, причем количество указанных металлических частиц составляет примерно от 0,001 до 8 мкг/см2. Примерами изделий с подобным покрытием являются контактные линзы, стимуляторы сердца, электроды для стимуляторов сердца, стенты, зубные имплантаты, грыжевые сетки и ячеистые структуры, оборудование для центрифугирования крови, хирургические инструменты и другие. Модифицируют поверхностные свойства подложки, влияющие на ее биосовместимость и антимикробные свойства. 4 н. и 14 з.п. ф-лы, 4 табл.

Способ получения антибактериального покрытия на поверхности сплавов на основе титана медицинского назначения

Изобретение относится к способу получения антибактериального покрытия, содержащего наночастицы серебра на поверхности имплантата из титана или титанового сплава. Проводят предварительную обработку поверхности указанного имплантата в растворе из серной кислоты 98%-ой и перекиси водорода 30%-ой в соотношении 1:3, при температуре 18-22 °С в течение 90 мин. Затем получают антибактериальное покрытие путем модифицирования поверхности указанного имплантата с формированием на ней наночастиц серебра методом полиольного синтеза. Полиольный синтез проводят в среде полиэтиленгликоля-400 с содержанием химически чистого нитрата серебра (AgNO3) в концентрации 2 мг/мл, при температуре 18-22 °С и при постоянном перемешивании в течение 18 мин. В течение 8 мин указанное перемешивание проводят под воздействием ультрафиолетового излучения, а в течение последующих 10 мин - без воздействия ультрафиолетового излучения. Затем осуществляют промывание имплантата в дистиллированной воде и сушку на воздухе в течение ...

Nichtelektrolytische Goldplattierlösung

Zusammensetzung zur stromlosen Palladiumplattierung

WAESSRIGE BADLOESUNG UND VERFAHREN ZUM STROMLOSEN VERGOLDEN

Spannungsreduzierte Ni-P/Pd-Stapel für Waferoberfläche

ELECTROLESS GOLD PLATING COMPOSITION

An electroless gold plating composition comprises an aqueous solution of: (a) alkali metal gold cyanide in an amount sufficient to provide from 1.0 to 16.6 grams per litre of gold (calculated as metal); (b) from 3 to 110 grams per litre of alkali metal cyanide; (c) from 2 to 10 grams per litre of a boron compound which is an alkyl amine borane and/or an alkali metal borohydride; (c) from 10 to 1100 grams per litre of alkali metal hydroxide; and (e) from 0.1 to 0.3 grams per litre of a stabilizer of the formula wherein R1 is -COOH, -OH, -CH2OH or -SO3H (or an alkali metal salt thereof); R2 is -COOH, -OH, -Cl, -H, (or an alkali metal salt thereof) and is in the 2, 5, or 6 ring position, and -NO2 is in the 3 or 4 ring position; said composition having a pH of from 12.5 to 14.0; the weight ratio OH<->/CN<-> being from 4.0 to 10.0; and the oxidation/ reduction potential of the solution being -550 to -700 millivolts. The bath may be replenished during use with a replenisher formulation comprising ...

PALLADIUM ALLOY PLATE

Manufacturing of high resolution conductive patterns using organometallic ink and banded anilox rolls

Improvements relating to the deposition of gold on a tin nickel surface

A tin nickel surface, e.g. the protective plating on exposed metallic portions of electrical components such as printed circuit boards, is activated prior to immersion in an electroless gold solution to deposit thereon an even solderable layer of gold by degreasing the surface, e.g. first immersing in HCl solution then in hot alkaline cleaner, and rinsing, and then immersing it in an aqueous solution of O-phosphoric acid e.g. 30-60% by weight and at least one a -hydroxy polycarboxylic acid e.g. citric or tartaric acid, preferably at 100 DEG C.

Method and bath for the electroless plating of gold

The invention relates to a method and bath for the electroless plating of gold using an aqueous solution of trivalent gold, a ligand and a tertiary or secondary aminoborane as a reducing agent. Preferably, a stabilizer such as 6-ethoxy-2-mercaptobenzothiazole is used in the bath.

Device for silvering electrically unconductive objects

An article e.g. a sound record or a glass ornament, on a rotating disc 4 is silvered by spraying various solutions through adjustable nozzles 20, and the solutions are drained through a two-way cock either to a drain or to a receptacle 9. The process comprises rinsing with water, degreasing, rinsing, sensitizing, rinsing, simultaneously spraying through two nozzles the silvering solution and a reducing agent, and finally rinsing. The sensitizing solution is stannous chloride and HCl. The silvering solution is 12.5 g./1. of silver nitrate titrated with ammonia. The reducing agent is 22.5 g./1. of glucose and 2 mls. of 37% formaldehyde. Soda lye may also be mixed with the silvering solution during spraying. The operation of the apparatus may be controlled electrically. The liquids are fed from pressurized reservoirs 3.

Gold plating

A surface of e.g. Si, Ge, Cu, Ni, Fe-Cu- Ni alloy, solder, Ag, Ti, Cr brass, stainless steel, Ta, and Au is gold plated by immersion in a solution containing potassium gold cyanide (67% gold content) the solution being acidified to a pH of 2.0 to 3.5 with hydrofluoric, hydrochloric, nitric, sulphuric or acetic acid or ammonium fluoride. The pH may be adjusted with ammonium hydroxide. The temperature of the solution is 70 to 100 DEG C. In an example, the solution may contain potassium antimonyl tartrate to deposit Sb-Au on a Ge substrate. The layer may be subsequently sintered.

Improvements in and relating to methods of forming copper films on silicous substrate

A copper film is formed on a non-porous siliceous substrate such as glass or ceramic by contacting it with an aqueous solution of a stannous salt such as the chloride, bromide, iodide or sulphide, then with an aqueous silver salt solution containing a reducing agent such as prepared by mixing an ammoniacal silver salt solution, e.g. containing silver nitrate, sulphate or chloride and NH4OH, with a reducing solution e.g. containing formaldehyde, dextrose or invert sugar, to deposit a "flash" silver film, and contacting the silvered substrate, e.g. by spraying, immersion, roll coating, brushing or screening, with a copper salt solution containing a reducing agent such as formaldehyde, in the presence of a nickel or cobalt salt. The copper salt solution is preferably alkaline, e.g. made by adding NaOH and contains the sulphate, nitrate, chloride, phosphate, bromide, iodide or acetate of Cu and Ni or Co ; copper formate or tartrate may also be used, and the solution may additionally contain ...

ELECTROLESS SILVERING COMPOSITION AND METHOD

BATH FOR THE NICHTELEKTROLYTI SEPARATION OF GOLD

GOLD-PLATING BATH

VERBESSERTES VERFAHREN FUER DIE VERHINDERUNG DER BILDUNG VON EXPLOSIVEN BEDINGUNGEN ODER VER- BINDUNGEN

PROCEDURE FOR APPLYING A METALLIC SURFACE LAYER ON A HIGH TEMPERATURE SUPERCONDUCTOR

GOLD-PLATING BATH

BATH FOR THE NICHTELEKTROLYTI SEPARATION OF GOLD

SEPARATION OF SILVER LAYERS ON NON CONDUCTIVE SUBSTRATES

Procedure for the production of silver-containing layers on aluminum and its alloys

SOLUTION FOR THE DEAD SEPARATION OF GOLDLEGIERUNGEN ON A SUBSTRATE.

Chemical Silberbad

Procedure for silvering a nylon document

METAL MIRROR ON ACRYLIC RESIN

Stabilization amd performance of autocatalytic electroless processes.

Method and device for catchment of platinum group metals in a gas stream

Electroless silver plating

ELECTROLESS GOLD, SILVER & COPPER PLATING

Supported catalyst consisting of metal of the platinum group and obtained by means of controlled electroless deposition

COATING NYLON

ENHANCED METAL ION RELEASE RATE FOR ANTI-MICROBIAL APPLICATIONS

A method for enhancing the metal ion release rate of a substrate having a coating of a metal thereon. The method includes the steps of forming the metal~coated substrate and then subjecting the metal-coated substrate to a step that removes portions of the metal coating to form at least one notch in the metal coating, thereby increasing the surface area of the metal coating. The increased surface area enhances the metal ion release rate of the substrate. The metal may be silver. A silver-coated substrate may be used in the formation of medical products having increased antimicrobial and/or anti- fungal characteristics.

DUAL AND MULTIPLE COMPLEXERS FOR ELECTROLESS PLATING BATHS

IMPROVED STABILIZATION AND PERFORMANCE OF AUTOCATALYTIC ELECTROLESS PROCESSES

... ²²²Disclosed is a method of plating a substrate with a metal using an ²autocatalytic electroless plating bath wherein the bath is operated above its ²cloud point temperature such that at least two phases are present in the bath. ²An autocatalytic electroless plating bath for coating silver metal is also ²described. A method for autocatalytic plating of silver metal directly onto a ²silicon surface without the need for an intervening layer of metal is also ²disclosed. The deposits of silver obtained are uniform, non-porous and have ²electrical properties . The technique can be applied for different processes ²and bath formulations i.e. different metals, complexing agents and reducing ²agents .² ...

REDUCING AGENT AND METHOD FOR THE ELECTROLESS DEPOSITION OFSILVER

A brighter, more uniform deposit of electroless silver is achieved over a wider temperature range by employing as a reducer a compound represented by the general formula: R2 - (CHR1)n - CH2OH where n is two (2) to seven (7), R2 is represented by the formula COOH or CH2R1, each R1 group is independently selected from the class consisting of OH, NH2, NHCH3, NHC2H5 or NHC3H7 and at least one of the R1 groups is NH2, NHCH3, NHC2H5 or NHC3H7. Preferred reducers are N-methylglucamine, d-glucamine and glucosaminic acid.

ELECTROLESS SILVERING COMPOSITION AND METHOD

METHOD AND BATH FOR THE ELECTROLESS PLATING OF GOLD

TITLE METHOD AND BATH FOR THE ELECTROLESS PLATING OF GOLD The present invention relates to a method and bath for the electroless plating of gold using an aqueous solution of trivalent gold, a ligand and a tertiary or secondary amine borane reducing agent. Preferably, a stabilizer such as 6-ethoxy-2-mercaptobenzothiozole is used in the bath.

A SUBSTRATE HAVING AN ELECTRON DONATING SURFACE WITH METAL PARTICLES COMPRISING PALLADIUM ON SAID SURFACE

There is disclosed a substrate with an electron donating surface, characterized in having metal particles on said surface, said metal particles comprising palladium and at least one metal selected from the group consisting of gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of said metal particles is from about 0.001 to about 8µg/cm2. Examples of coated objects include contact lenses, pacemakers, pacemaker electrodes, stents, dental implants, rupture nets, rupture mesh, blood centrifuge equipment, surgical instruments, gloves, blood bags, artificial heart valves, central venous catheters, peripheral venous catheters, vascular ports, haemodialysis equipment, peritoneal dialysis equipment, plasmapheresis devices, inhalation drug delivery devices, vascular grafts, arterial grafts, cardiac assist devices, wound dressings, intermittent catheters, ECG electrodes, peripheral stents, bone replacing implants, orthopaedic implants, orthopaedic devices, tissue replacing ...

SINGLE SOLUTION FOR ELECTRO-ELECTROLESS DEPOSITION OF METALS

A hybrid electro-electroless deposition process whereby multiple metal films layers are deposited from a single plating solution which includes both electroless and electroplating components. The article to be plated is immersed in the solution, and electric current is selectively applied at determined voltages for predetermined times, at selected intervals to effect electroplating in conjunction with electroless deposition. Electroplated metal layers are interspersed with electroless deposited metal layers.

COMBINATION OF AQUEOUS BATHS FOR THE NON-ELECTRICAL DEPOSITION OF GOLD

The invention relates to a combination of aqueous baths for electroless gold deposition and, preferably, for the deposition of gold onto nickel and nickel alloy films. The combination consists of a preliminary bath and a primary bath and, optionally, a pickling solution and a pretreatment. The gold film which is obtained is chip-bondable and wire-bondable.

Verfahren zur Herstellung silberhaltiger Schichten auf Leichtmetallen.

Procédé pour la métallisation d'une surface en un matériau plastique.

Verfahren zur Herstellung galvanoplastischer Abdrücke.

Procédé d'argenture de la surface d'un objet en matière non conductrice de l'électricité.

Procédé de métallisation du verre ou de la céramique vitrifée au moyen de métaux précieux et produits obtenus par ce procédé

Elektrisch leitendes Papier und Verfahren zu seiner Herstellung

Verfahren zur Herstellung eines Versilberungsmittels für Anreibeversilberung.

Bain pour le dépôt par voie chimique de revêtements adhérents de palladium, et utilisation dudit bain

Bain pour le dépôt non électrolytique du palladium

Bad zum stromlosen Abscheiden von Goldschichten

Elektrisch leitender Füllstoff

Chemically silver-plating copper (alloys) - in nontoxic bath contg. silver nitrate, alkali metal bisulphite and hyposulphite

Stable bath for Ag- plating Cu or its alloy or Cu- plated plastics (e.g. printed circuits), or other metals, may contain 10 g/l. AgNO3, 40 g/l. NaHSO3, and 20 g/l. Na2S2O3.

Verfahren zum chemischen Plattieren von Unterlagen mit edlen Metallen der Platingruppe

Verfahren zur Herstellung einer Elektrode mit einem Titankern

Procédé de fabrication d'un article de verre portant une pellicule de métal

Procédé pour le dépôt de platine ou d'un alliage de platine

Procédé de métallisation d'une partie d'une pièce d'horlogerie

Verfahren zur Aktivierung einer Zinn-Nickelfläche zwecks nachfolgender Goldplattierung

METHOD FOR CHEMICAL ELECTROLESS GOLD BY REDUCTION.

WAESSERIGES BATH FOR DEAD PLATING ALSO GOLD OR GOLDLEGIERUNG.

PROCEDURE FOR THE PRODUCTION OF SILVERED GLASS MIRRORS.

WAESSRIGES BATH FOR DEAD GOLD-PLATING.

Coating hydrophilic solid with gold layer with extended surface, comprises immersing surface of solid in gold ions and hydroxylamine-containing reaction solution, comprising water, first component and second component

Coating hydrophilic solid with a gold layer with extended surface, comprises immersing the surface of the solid in gold ions and hydroxylamine-containing reaction solution. The reaction solution comprises: (a) water; (b) first component comprising tetrachloride gold acid and/or salts of the acid; and (c) second component comprising hydroxylamine salts and/or their mixtures. An independent claim is also included for the hydrophilic solid, coated with the gold layer with extended surface.

Procedure for the coating of hydrophilic solids with a gold layer with expanded surface as well as a hydrophilic solid body coated with a gold layer with expanded surface.

Die Erfindung betrifft ein Verfahren zur Beschichtung hydrophiler Festkörper mit einer Goldschicht mit ausgedehnter Oberfläche, umfassend das Eintauchen der Oberfläche des Festkörpers in einer Goldionen und Hydroxylamin enthaltenden Reaktionslösung, gekennzeichnet dadurch, dass die Reaktionslösung aus folgenden Bestandteilen besteht: Wasser, erster Bestandteil, ausgewählt aus der Gruppe umfassend Tetrachloridogoldsäure HAuCI 4 , Salze dieser Säure und deren Mischungen, zweiter Bestandteil, ausgewählt aus der Gruppe umfassend Hydroxylamin, dessen Salze und deren Mischungen. Die Erfindung umfasst auch einen hydrophilen, mit einer Goldschicht mit ausgedehnter Oberfläche beschichteten Festkörper, der mit diesem Verfahren hergestellt ist.

Procedure for the paint job metalizing of manufatti.

A method of electroless plating of a precious metal.

Procédé pour former une couche de métal précieux (5) sur une surface d’un substrat (1), comprenant les étapes consistant à: se doter d’un substrat (1); activer une surface dudit substrat (1) en mouillant ladite surface avec une suspension (2) de nanoparticules de métal précieux (3) dans un solvant, de façon à y déposer des nanoparticules de métal précieux (3), ledit solvant comprenant au moins un solvant organique; immerger la surface ainsi activée dans une solution aqueuse (4) comprenant au moins un sel de métal précieux de façon à déposer une couche de métal précieux (5) sur ladite surface.

СПОСОБ МЕТАЛЛИЗАЦИИ ПОЛИЭФИРНОГО ВОЛОКНА И МЕТАЛЛИЗИРОВАННОЕ ПОЛИЭФИРНОЕ ВОЛОКНО

Настоящее изобретение относится к способу металлизации полиэфирного волокна, согласно которому полиэфирное волокно обрабатывают щелочным раствором, обрабатывают по меньшей мере одним соединением, содержащим по меньшей мере одну функциональную группу, которую выбирают из группы, включающей первичный амин, вторичный амин, тиол, сульфид и олефин, при этом указанное соединение содержит поперечные связи, обработанное полиэфирное волокно обрабатывают раствором, содержащим по меньшей мере одну соль металла, которую выбирают из группы, включающей соль серебра, соль меди и соль никеля, и по меньшей мере один комплексообразователь, и обрабатывают по меньшей мере одним восстановителем. Настоящее изобретение относится также к полиэфирным волокнам, металлизированным указанным способом, а также к их применению для антибактериальной обработки жидкости в системах транспортировки жидкостей или для изготовления чулочно-носочных изделий, стелек, одежды, чехлов для мебели для сидения или матрацев. Кроме того ...

METHOD FOR PRODUCTION OF MIRROR WITHOUT A COPPER LAYER

Ink and method for manufacturing conductive wires by ink

The invention provides an ink, which comprises a reducer and soluble palladium salts; and the invention also provides a method for manufacturing conductive wires by the ink. The method contributes to improving the continuity and the conductibility of the conductive wires.

Composition and method for electroless plating of palladium phosphorus on copper, and a coated component therefrom

Method for preparing surface metallization aramid fibers

ELECTROLESS SILVERING COMPOSITION AND METHOD

Process for obtaining a photographic matter on aluminium and its alloys

CHEMICAL PROCESS OF GOLD PLATING BY AUTOCATALYTIC REDUCTION

Process of plating without electrodes

Electroless Deposition of Metals

Compositions for silvering or gilding of objects out of metal

BAINS AQUEUX DE REVETEMENT NON ELECTROLYTIQUE D'OR COMPRENANT UN COMPOSANT D'OR TRIVALENT, UN AUROCYANURE DE METAL ALCALIN ET UN REDUCTEUR

ON DECRIT DES BAINS PERFECTIONNES DE REVETEMENTS NON ELECTROLYTIQUE OU AUTO-CATALYTIQUE D'OR OU L'INGREDIENT OR EST UN MELANGE DE A UN COMPOSANT D'OR TRIVALENT, SOLUBLE DANS L'EAU, CHOISI PARMI UN AURICYANURE DE METAL ALCALIN, UN AURIHYDROXYDE DE METAL ALCALIN ET UN AURATE DE METAL ALCALIN; ET B UN COMPOSANT D'OR MONOVALENT, SOLUBLE DANS L'EAU, TEL QU'UN AUROCYANURE DE METAL ALCALIN. LE BAIN CONTIENT UN AMINOBORANE, UN BOROHYDRURE DE METAL ALCALIN, UN CYANOBOROHYDRURE DE METAL ALCALIN, DE L'HYDRAZINE OU UN HYPOSULFITE COMME REDUCTEURS; UN AGENT ALCALIN TEL QU'UN HYDROXYDE DE METAL ALCALIN; ET UN AGENT TAMPON ALCALIN. LE PROCEDE D'UTILISATION DE CE BAIN DE REVETEMENT AUTO-CATALYTIQUE OU NON ELECTROLYTIQUE POUR DEPOSER DE L'OR SUR DES SUBSTRATS METALLIQUES, TELS QUE DE L'OR, DU CUIVRE, DES ALLIAGES DE CUIVRE, DU CUIVRE DEPOSE PAR VOIE NON ELECTROLYTIQUE, DU NICKEL DEPOSE PAR VOIE NON ELECTROLYTIQUE, DU NICKEL, DES ALLIAGES DE NICKEL, ETC. ET SUR DES SUBSTRATS NON METALLIQUES EST EGALEMENT ...

COATING ELECTROPOLYMERISE FOR SOLID ELECTROLYTIC CAPACITOR

ELECTROLESS SILVERING COMPOSITION AND METHOD

Electroless silver plating soln - giving high density coatings

METHOD OF ELECTROLESS PLATING OF GOLD

BATH OF COATING NON-ELECTROLYTIQUE OUT OF GOLD

은도금 도장체

... 뛰어난 접착성과 변색 방지성을 가지는 은도금 도장체를 제공한다. 상기 은도금 도장체는, 은 박막층 및 탑코트층을 기재 상에 필수적인 층으로서 가지며, 상기 탑코트층은 티오요소 및 티오요소 유도체로부터 선택되는 적어도 1종과 티올유기산 및 티올유기산 유도체로부터 선택되는 적어도 1종을 포함한다.

IMPROVED SILVER PLATING METHOD AND ARTICLES MADE THEREFROM

An improved method for plating an organic substrate with silver is disclosed. Improved plating is achieved in part through the use of NaEDTA, which facilitates improved grain formation and recovery of silver from waste material. Articles prepared using the method of the invention are also disclosed.4 © KIPO & WIPO 2007 ...

팔라듐 도금액 및 그것을 사용하여 얻어진 팔라듐 피막

... 팔라듐 피막에 발생하는 핀홀 등의 불량부의 발생을 줄이고, 팔라듐 피막 상에 형성되는 금도금 피막을 박막화해도 종래의 것과 동등한 내열 성능을 얻는 것이 가능한 팔라듐 도금액을 제공하는 것을 과제로 하여, 팔라듐원으로서의 가용성 팔라듐염과, 1 위치의 질소 원자에 알킬기가 결합되고, 2 위치 내지 6 위치의 1 개 내지 5 개가, 알킬기, 아릴기, 카르복시기, 알콕시카르보닐기, 술포기, 알콕시술포닐기, 아미노기, 알킬아미노기, 디알킬아미노기 및 시아노기로 이루어지는 군에서 선택된 1 종 또는 2 종 이상의 특정 치환기로 치환된 특정 피리디늄 화합물을 함유하는 팔라듐 도금액, 그리고, 이러한 팔라듐 도금액을 사용하여 니켈, 니켈 합금, 구리 또는 구리 합금의 피막 상에 팔라듐 도금을 실시함으로써 얻어진 팔라듐 피막에 의해 과제를 해결하였다.

Compound material, method of producing the same and apparatus for producing the same

Method for producing flake-like silver powder

A method for producing a flake-like silver powder, which uses the characteristics that plated film has a uniform thickness, comprises selecting a substrate easily being removed and broken; plating a silver layer on the substrate; pulverizing the test piece and removing the substrate, or removing the substrate and then pulverizing for leaving a flake-like silver powder behind and obtaining a powder having a uniform thickness. During an ordinary stacking process, in addition to point contacts, a large proportion of the flakes has face-to-face layer-wise stacking. Comparing to point-to-point contact, a face-to-face contact has a larger transportation channel. Thus, a stacking with face-to-face contact has a largely reduced thermal resistance and electrical resistance due to easier passage of heat and electrons towards the face-to-face contact, which leads to thermal and electrical conductions at a specific direction.

Mirror finish and surface treatment thereof

Process For The Surface-Modification Of Flyash And Industrial Applications Thereof

Processes for the surface-modification of flyash and industrial applications thereof are described in this invention, which involve surface-sensitization, surface-activation, and subsequent Cu or Ag coating of as-received flyash particles in a conventional electroless bath. These new surface-modification processes offer efficient and cost-effective alternatives to conventional processes which modify the surface of flyash particles with a costlier Sn—Pd catalyst-system. Flyash processed with the inventive processes is also suitable for a greater number of industrial applications relative to that processed with the costlier Sn—Pd catalyst-system. The as-received flyash particles, processed via the inventive surface-modification processes, find industrial applications as conductive fillers for manufacturing conducting polymers, paints, adhesives, sealers, and resins used for EMI shielding of electronic devices, in lead-based composites used in the automobile industries, and as a catalyst to purify industrial waste-water by decomposing longer chains of organic molecules into smaller ones. 1. A process for the surface-modification of flyash containing sufficient amount of titania (TiO) or any other semiconductor oxide on its surface , wherein said process comprises the steps of:{'sub': '4', 'i. suspending flyash particles in a surface-activation bath consisting of an aqueous solution of metal-salt at pH˜10-12 obtained using an aqueous NHOH solution (25-28 wt. %);'}ii. stirring the suspension as obtained in step (i) continuously under UV, visible, or solar-radiation for a period ranging between 4-6 hours to deposit metal-clusters over the surface of flyash particles;iii. separating the surface-activated flyash particles as obtained in step (ii) via filtration followed by washing with distilled-water several times to remove unwanted ions from the surface;{'sup': −1', '−1', '−1, 'sub': 4', '4', '6, 'iv. stirring the surface-activated flyash particles, as obtained in step ( ...

Method of metal deposition

A method of forming a metal layer on an electrically insulating substrate comprises depositing a photocatalyst layer onto the substrate and depositing a mask layer comprising voids on the substrate, such as a layer of latex microparticles with voids between them, to give an open pore structure to the mask. An electroless plating solution is then provided on the photocatalyst layer, and the photocatalyst layer and electroless plating solution are illuminated with actinic radiation whereby deposition of metal from the electroless plating solution to form a metal layer on the photocatalyst layer is initiated whereby the metal deposits in the voids of the mask layer. The mask layer is subsequently removed to leave a porous metal layer on the substrate. The method allows for deposition of porous metal films with controlled thickness and excellent adhesion onto electrically insulating substrates. The method is suitable for providing metal layers with controlled, regular porosity.

Electroless Deposition of Platinum on Copper

Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices. 1. An electroless plating solution , comprising:a platinum supply chemical mother solution having a pH between about 13 and about 14;a reducing agent comprising hydrazine; anddeionized water;{'sub': 2', '6', '2', '6, 'sup': '2−', 'wherein the platinum supply chemical mother solution comprises chloroplatinic acid (HPtCl) and hydrogen hexahydroxyplatinate (HPt(OH));'}wherein a platinum concentration in the electroless plating solution is between about 2 mM and about 50 mM; andwherein a hydrazine concentration in the electroless plating solution is between about 0.1M and about 1M. [0015] [0016] [0017]2. The electroless plating solution of claim 1 , further comprising an accelerator. [0015]3. The electroless plating solution of claim 2 , wherein the accelerator comprises a derivative of aliphatic sulfonic acid. [0017]4. The electroless plating solution of claim 2 , wherein a concentration of the accelerator is between about 0.001 and about 0.5M. [0017]5. The electroless plating solution of claim 1 , further comprising a stabilizer. [0015]6. The electroless plating solution of claim 5 , wherein the stabilizer comprises about 2 mM to about 20 mM 5-sulfosalicylic acid and about 1 mM to about 10 mM EDTA. [0018]7. The electroless plating solution of claim 5 , wherein the stabilizer comprises about 5 mM to about 50 mM hydroxyl amine. [0018]8. The electroless plating solution of claim 1 , further comprising a surfactant. [0015]9. The electroless plating solution of claim 8 , wherein the surfactant comprises about 2 ppm ...

Metallic nanoparticle synthesis with carbohydrate capping agent

The disclosure relates to metal nanoparticle compositions and their methods of formation and use, in particular gold nanoparticles (AuNP) and gold-coated magnetic nanoparticles. Compositions according to the disclosure include aqueous suspensions of metal nanoparticles that are stabilized with one or more carbohydrate capping agents and/or that are functionalized with one or more binding pair members for capture/detection of a target analyte. The nanoparticle suspensions are stable for extended periods and can be functionalized as desired at a later point in time, typically prior to use in an assay for the detection of a target biological analyte. The stable nanoparticle suspension can be formed by the aqueous reduction of oxidized metal precursors at non-acidic pH values in the presence of a carbohydrate-based capping agent such as dextrin or other oligosaccharides.

ELECTROLESS PLATING METHOD AND CERAMIC SUBSTRATE

Provided is an electroless plating method for a low temperature co-fired glass ceramic substrate, the method including: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating treatment step. The electroless plating method further includes, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, and the catalyzing step includes providing the catalyst also to the silver precipitated in the silver precipitation treatment step. 1. An electroless plating method for a glass ceramic substrate comprising an insulating base material formed of glass ceramic , and a wiring pattern formed of a silver sintered body , the electroless plating method comprising:a degreasing and activation treatment step of degreasing and activating a surface of the wiring pattern formed of a silver sintered body;a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step; andan electroless multi-layered coating plating treatment step of forming a multi-layered electroless plating coating on the surface of the wiring pattern formed of a silver sintered body on which the catalyst is provided,the electroless plating method further comprising, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, ...

Conductive Fibres

A method for making a fibre electrically conductive comprises the steps of: (a) providing a fibre having a negative electric charge at the surface of the fibre, (b) applying to the fibre a substance (such as a polyelectrolyte) which provides a layer of said substance on the fibre and changes the electric charge at the surface of the fibre from negative to positive, wherein said substance is not chitosan, and (c) making the surface of the fibre electrically conductive with a metal, wherein the metal of step (c) is provided in the form of metal ions and wherein a reducing agent (for example) is employed to reduce the metal ions to elemental metal. Fabrics formed from conductive fibres are also provided.

MEANS FOR CARRYING OUT ELECTROLESS METAL DEPOSITION WITH ATOMIC SUB-MONOLAYER PRECISION

The present invention relates to a method of deposition of thin metal layers on different substrates by electroless chemical method. In the method of the invention, the potential of the plating solution, i.e. a solution from which the metal deposition is carried out, is controlled with a redox buffer. The appropriate plating solution is also disclosed. 1. A method of electroless deposition of a metal monolayer or sub-monolayer or a metal multilayer deposit onto a substrate from a plating solution , wherein the deposition process is controlled by means of a redox buffer having comparable concentration of oxidized and reduced form of a redox pair , which is used to adjust the potential of the plating solution and wherein such adjustment of the potential results in deposition of a metal monolayer or sub-monolayer , or a metal multilayer deposit , onto the substrate , which is immersed into said plating solution.2. A method of claim 1 , wherein the adjustment of the plating solution potential by means of a redox buffer is carried out in the presence of a depositing metal precursor claim 1 , and wherein the plating solution potential adjustment results in deposition of the metal onto the substrate.3. A method of claim 1 , wherein the adjustment of the plating solution potential by means of a redox buffer is followed by addition of a depositing metal precursor into said plating solution claim 1 , and wherein the deposition of a metal is controlled by concentration of said depositing metal precursor.4. The method of claim 1 , wherein adjustment of the plating solution potential is carried out before or after the substrate is immersed into said plating solution.5. The method of claim 1 , wherein the addition of the depositing metal precursor is carried out before or after the substrate is immersed into said plating solution.6. The method of claim 1 , wherein the plating solution is an aqueous solution.7. The method of claim 1 , wherein the redox buffer is selected from a ...

CATALYST PARTICLES FOR FUEL CELLS AND METHOD FOR PRODUCING SAME

A catalyst particle () for a fuel cell according to the present invention includes: a metal particle () composed of either one of metal other than noble metal and an alloy of the metal other than the noble metal and the noble metal; and a noble metal layer () that is provided on a surface of the metal particle and has a thickness of 1 nm to 3.2 nm. By the fact that the catalyst particle for a fuel cell has such a configuration, the catalyst particle can enhance catalytic activity while reducing an amount of the noble metal. The catalyst particle () for a fuel cell according to the present invention can enhance the catalytic activity while reducing the amount of the noble metal. 114-. (canceled)15. A catalyst particle for a fuel cell , the catalyst particle comprising:a metal particle composed of either one of metal other than noble metal and an alloy of the metal other than the noble metal and the noble metal, and having a particle diameter of 2 nm to 5.5 nm; anda noble metal layer that is provided on a surface of the metal particle, consists of platinum and has a thickness of 1 nm to 3.2 nm,wherein the noble metal layer covers at least 60% or more of the surface of the metal particle.16. The catalyst particle for a fuel cell according to claim 15 ,wherein the noble metal in the metal particle is at least one selected from the group consisting of platinum, palladium, gold, iridium, ruthenium and silver, andthe metal other than the noble metal in the metal particle is at least one selected from the group consisting of titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, zirconium, niobium, molybdenum and tantalum.17. A catalyst for a fuel cell claim 15 , the catalyst comprising:{'claim-ref': {'@idref': 'CLM-00015', 'claim 15'}, 'the catalyst particle for a fuel cell according to ; and'}a conductive carrier that carries the catalyst particle for a fuel cell thereon.18. A method for producing a catalyst particle for a fuel cell claim 15 , the ...

ELECTROLESS PALLADIUM PLATING BATH

A plating bath at least contains a palladium compound, a reducing agent, a complexing agent, and a stabilizer. The stabilizer is an organic compound in which a divalent sulfur compound is bonded to a compound with a heterocyclic structure, and the organic compound contains neither a thiol group nor a disulfide bond. 1. An electroless palladium plating bath at least comprising:a palladium compound; a reducing agent; a complexing agent; and a stabilizer,the stabilizer being an organic compound in which a divalent sulfur compound is bonded to a compound with a heterocyclic structure, the organic compound containing neither a thiol group nor a disulfide bond.2. The bath of claim 1 , whereinthe stabilizer has a concentration ranging from 0.01 mg/L to 10 mg/L.3. The bath of claim 1 , whereinthe heterocyclic structure is a nitrogen-containing heterocyclic structure or a sulfur-containing heterocyclic structure.4. The bath of claim 3 , whereinthe compound with the heterocyclic structure is at least one selected from the group consisting of imidazole, imidazolidine, imidazoline, oxadiazole, oxazine, thiadiazole, thiazole, thiazolidine, tetrazole, triazine, triazole, piperazine, piperidine, pyrazine, pyrazole, pyrazolidine, pyridine, pyridazine, pyrimidine, pyrrole, pyrrolidine, benzothiazole, benzimidazole, isoquinoline, thiophene, tetrahydrothiophene, pentamethylene sulfide, and a derivative thereof.5. The bath of claim 1 , whereinthe divalent sulfur compound is at least one selected from the group consisting of: thiadiazole, thiazole, thiazolidine, benzothiazole, thiophene, tetrahydrothiophene, methanethiol, benzenethiol, pentamethylene sulfide, dimethyl sulfide, methyl mercaptan, ethyl mercaptan, allyl mercaptan, thiopropionic acid, thioacetic acid, ethyl methyl sulfide, 1-propanethiol, 2-propanethiol, 2-aminoethanethiol, 2-mercaptoethanol, 4-mercaptopyridine, dimethyl sulfoxide, thiazolidine, S-methyl thioacetate, ethyl sulfide, methylpropyl sulfide, 1-butanethiol, ...

SILVER-COATED PARTICLE AND METHOD OF PRODUCING SAME

A silver-coated particle (P) is provided. The silver-coated particle (P) includes a core particle () made of a resin particle or an inorganic particle and a silver coating layer () formed on a surface of the core particle (), wherein, an amount of silver contained in the silver coating layer () is 5 to 90 parts by mass with respect to 100 parts of the silver-coated particle (P), a crystallite diameter of the silver, which is calculated from a diffraction line obtained by filling a sample holder belonging to an X-ray diffraction apparatus with the silver-coated particle (P); and irradiating X-ray in a range of 2θ/θ=30 to 120 deg., is in a range of 35 nm to 200 nm. 1. A silver-coated particle comprising a core particle made of a resin particle or an inorganic particle and a silver coating layer formed on a surface of the core particle , wherein ,an amount of silver contained in the silver coating layer is 5 to 90 parts by mass with respect to 100 parts of the silver-coated particle,a crystallite diameter of the silver, which is calculated from a diffraction line obtained by filling a sample holder belonging to an X-ray diffraction apparatus with the silver-coated particle; and irradiating X-ray in a range of 2θ/θ=30 to 120 deg., is in a range of 35 nm to 200 nm.2. A method of producing a silver-coated particle comprising the steps of:forming a tin absorbing layer on a surface of a core particle by adding the core particle made of a resin particle or an inorganic particle to an aqueous solution of a tin compound;preparing a silver-coated particle precursor, which contains a silver coating layer on the surface of the core particle, by performing electroless plating on the tin absorbing layer, which is formed on the surface of the core particle, by using a reducing agent; andsetting a crystallite diameter of the silver, which is measured by X-ray diffraction method, to 35 nm to 200 nm by sintering silver constituting the silver coating layer by heat treating the silver- ...

CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH

The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate: a base conductive layer; a Pd layer; a Pt layer; and an Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 μm or less.

CATALYSTS FOR ELECTROLESS METALLIZATION CONTAINING IMINODIACETIC ACID AND DERIVATIVES

Catalysts include iminodiacetic acid and derivatives thereof as ligands for metal ions which have catalytic activity. The catalysts may be used to electrolessly plate metal on metal clad and un-clad substrates. 2. The method of claim 1 , wherein the one or more compounds are chosen from iminodiacetic acid claim 1 , N-(2-hydroxyethyl) iminodiacetic acid claim 1 , methyliminodiacetic acid claim 1 , nitrilotriacetic acid claim 1 , N-(2-methoxyethyl) iminodiacetic acid claim 1 , N-(2-hydroxy-carboxyethyl)iminodiacetic acid claim 1 , N-(2-carboxyethyl)iminodiacetic acid claim 1 , N-(2-carboxy-propylsulfonyl)iminodiacetic acid claim 1 , N-(3-methoxypropyl)iminodiacetic acid claim 1 , N-(2-hydroxy-propylsulfonyl)iminodiacetic acid claim 1 , N-(2-hydroxypropyl)iminodiacetic acid claim 1 , N-(2-aminoethyl)iminodiacetic acid claim 1 , N-(2-carboxy-carboxyethyl)iminodiacetic acid claim 1 , N-(1-carboxycyclopentyl)iminodiacetic acid claim 1 , N-(dimethylcarboxymethyl)iminodiacetic acid claim 1 , N-(3-dimethylaminopropyl)iminodiacetic acid claim 1 , o-picolyliminodiacetic acid claim 1 , N-(2-methylfuran)iminodiacetic acid claim 1 , N-(o-hydroxybenzyl)iminodiacetic acid claim 1 , 2 claim 1 ,6-[bis(carboxymethyl)aminomethyl]-4-acetylaminophenol claim 1 , 5-(N claim 1 ,N-bis(carboxymethyl)amino)-barbituric acid claim 1 , N-(carboxymethyl)-N-(2-hydroxy-3-sulfopropyl)-alanine claim 1 , hydroxyethylethylenediaminetriacetic acid claim 1 , ethylenediamine-N claim 1 ,N′-diacetic acid claim 1 , triethylenetetramine-N claim 1 ,N claim 1 ,N′ claim 1 ,N″ claim 1 ,N′″ claim 1 ,N″″-hexacetic acid claim 1 , 1 claim 1 ,3-diamino-2-hydroxypropane-N claim 1 ,N claim 1 ,N′ claim 1 ,N″-tetraacetic acid and diethylenetriaminepentaacetic acid and salts thereof.3. The method of claim 1 , wherein a molar ratio of the one or more compounds or salts thereof to the metal ions is 1:1 to 4:1.4. The method of claim 1 , wherein the metal ions are chosen from palladium claim 1 , silver claim 1 , gold claim 1 , ...

COATED GLASS SLEEVES AND METHODS OF COATING GLASS SLEEVES

Disclosed are methods for coating or decorating a surface of a glass sleeve. The methods include depositing a metal layer onto a surface of the glass sleeve by an electroless plating method. Also disclosed are glass sleeves which are coated or decorated on an internal surface, and electronic devices comprising the coated glass sleeves. 1. A hollow glass sleeve comprising an internal surface , at least a portion of said internal surface coated by an electroless plating method comprising:affixing a physical or chemical barrier to at least a portion of the internal surface of the glass sleeve,contacting at least a portion of the internal surface of the glass sleeve with an electroless plating solution for a time sufficient to deposit a metal layer on at least a portion of the glass sleeve,providing a protective layer to the portion of the internal surface of the glass sleeve comprising the deposited metal layer, andremoving the physical or chemical barrier,the electroless plating solution comprising at least one material for providing metal ions to the glass sleeve and at least one reducing agent.2. A hollow glass sleeve comprising an internal surface , said internal surface comprising a layer of metal , wherein said layer of metal comprises trace amounts of at least one reducing agent.3. An electronic device comprising a glass sleeve , the glass sleeve comprising an internal surface ,wherein said internal surface comprises a layer of metal, andwherein said layer of metal comprises trace amounts of at least one reducing agent.4. The electronic device according to claim 3 , chosen from laptops claim 3 , cell phones claim 3 , electronic tablets claim 3 , watches claim 3 , and media players.5. The electronic device according to claim 3 , wherein at least a portion of the internal surface does not comprise a layer of metal.6. The electronic device according to claim 5 , wherein the portion of the internal surface that does not comprise a layer of metal corresponds to a ...

IRON OXIDE-GOLD CORE-SHELL NANOPARTICLES AND USES THEREOF

Magnetic-optical iron oxide-gold core-shell nanoparticles are disclosed. Methods for making and using the nanoparticles are also disclosed. 1. A magnetic-optical iron oxide-gold core-shell nanoparticle comprising a silver-adsorbed iron oxide nanoparticle core.2. The magnetic-optical iron oxide-gold core-shell nanoparticle of claim 1 , wherein the magnetic-optical iron oxide-gold core-shell nanoparticle is anisotropic.3. The anisotropic magnetic-optical iron oxide-gold core-shell nanoparticle of claim 2 , which is a nanooval claim 2 , a nanopin claim 2 , a nanoflower claim 2 , nanohexagon or a nanostar.4. The anisotropic magnetic-optical iron oxide-gold core-shell nanoparticle of claim 2 , which is a nanooval.5. The anisotropic magnetic-optical iron oxide-gold core-shell nanoparticle of claim 2 , wherein the nanoparticle is superparamagnetic.6. (canceled)7. (canceled)8. (canceled)9. A method for producing iron oxide-gold core-shell nanoparticles claim 2 , the method comprising:(a) providing silver-adsorbed iron oxide nanoparticles; and(b) forming a gold shell on the silver-adsorbed iron oxide nanoparticles to form iron oxide-gold core-shell nanoparticles.10. The method of claim 9 , wherein step (a) comprises adsorbing diamminesilver ions onto superparamagnetic iron oxide nanoparticles claim 9 , and reduction with a reducing agent to form silver-adsorbed iron oxide nanoparticles.11. The method of claim 10 , wherein the reducing agent is sodium borohydride.12. The method of claim 9 , wherein step (b) comprises (i) providing a solution of a cationic surfactant such as cetyltrimethylammonium bromide (ii) addition of a source of gold(III) ions such as chloroauric acid claim 9 , gold (III) and silver nitrate; (iii) reducing gold (III) to gold (I) ions claim 9 , (iv) addition of silver-adsorbed iron oxide nanoparticles to the solution of gold (I) ions claim 9 , such that anisotropic iron oxide-gold core-shell nanoparticles are formed.13. The method of claim 12 , wherein the ...

Electroless gold plating liquid

The present invention relates to an electroless gold plating liquid, which may form gold plating without corrosion of a base metal by performing substitution and reduction reactions in the same bath, and satisfy both weldability of lead-free soldering and wire bonding characteristics, and has excellent stability such that a gold deposition rate may be continuously maintained.

COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM PHOSPHORUS ON COPPER, AND A COATED COMPONENT THEREFROM

A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface. 1. A plating solution for use as a bath for electroless plating of palladium phosphorus on a metal , comprising:a palladium compound; andat least one of a polyaminocarboxylic compound.2. The plating solution of claim 1 , wherein the polyaminocarboxylic compound includes ethylene diamine tetraacetic acid (EDTA) or a derivative thereof at a concentration between 1 g/l and 20 g/l and the palladium compound is present at a concentration between 0.2 grams per liter (g/l) and 10 g/l.3. The plating solution of claim 2 , further comprising hypophosphite or a derivative thereof claim 2 , a pH adjuster claim 2 , a complexing agent claim 2 , and a reaction stabilizer.4. The plating solution of claim 3 , wherein the pH adjuster and the complexing agent are the same and include ethylene diamine.5. The plating solution of claim 3 , wherein the reaction stabilizer includes at least one of lead claim 3 , thallium claim 3 , tin claim 3 , indium claim 3 , bismuth claim 3 , cadmium claim 3 , selenium claim 3 , antimony claim 3 , arsenic claim 3 , copper claim 3 , nickel claim 3 , tellurium claim 3 , phosphite claim 3 , iodide claim 3 , iodate claim 3 , bromide claim 3 , bromate claim 3 , nitrate claim 3 , or nitrite.6. The plating solution of claim 5 , wherein the reaction ...

PLATED OBJECT AND METHOD OF FORMING THE SAME

The invention relates to a method of forming a plated object comprising forming an electrically conductive layer on a surface of a substrate, providing a catalyst on or in contact with the electrically conductive layer and contacting the catalyst with an electroless plating bath solution to form a metallic layer over the substrate. In particular, the electrically conductive layer comprises a conductive carbon material of reduced graphene oxide; and the catalysts include palladium or silver. 1. A method of forming a plated object , the method comprising:forming an electrically conductive layer on a surface of a substrate;providing a catalyst on the electrically conductive layer; andcontacting the catalyst with an electroless plating bath solution to form a metallic layer over the substrate, thereby forming the plated object;wherein a density of the catalyst relative to the electrically conductive layer is less than 1 microgram per centimeter square.2. The method according to claim 1 ,wherein the substrate is electrically non-conductive.3. The method according to claim 1 ,wherein the electrically conductive layer comprises a conductive carbon material or a conductive polymer.4. The method according to claim 3 ,wherein the conductive carbon material is any one selected from a group consisting of graphene, reduced graphene oxide, carbon nanotubes, and carbon powder.5. The method according to claim 4 ,wherein the conductive carbon material is reduced graphene oxide; and dipping the substrate in a mixture comprising graphene oxide; and', 'dipping the substrate adhered with graphene oxide in a reducing agent so that the graphene oxide is reduced to form reduced graphene oxide., 'wherein forming the electrically conductive layer comprises6. The method according to claim 1 ,wherein providing the catalyst on the electrically conductive layer comprises dipping or immersing the substrate, the electrically conductive layer on the surface of the substrate, in a catalyst solution ...

ELECTROLESS GOLD PLATING BATH

The present invention concerns an electroless gold plating bath comprising 2. The electroless gold plating bath of wherein the pH value of the electroless gold plating bath ranges from 5.5 to 8.5.3. The electroless gold plating bath of wherein the concentration of the sulfite ions ranges from 10 to 150 mmol/L.4. The electroless gold plating bath of wherein the amount of substance of the sulfite ions is at least as high as the amount of substance of the gold ions.5. The electroless gold plating bath of wherein the concentration of the iodide ions ranges from 4 to 100 mmol/L.6. The electroless gold plating bath of wherein R claim 1 , R claim 1 , Rand each Rare independently C1-C6-alkanediyl groups.7. The electroless gold plating bath of wherein b ranges from 1 to 6.8. The electroless gold plating bath of wherein the electroless gold plating bath comprises at least one hydroxycarboxylic acid.9. The electroless gold plating bath of wherein the at least one hydroxycarboxylic acid is aliphatic.10. The electroless gold plating bath of wherein the at least one hydroxycarboxylic acid is a C1-C12-hydroxycarboxylic acid.11. The electroless gold plating bath of wherein the electroless gold plating bath is free of thiosulfate ions.12. The electroless gold plating bath of wherein the electroless gold plating bath is free of cyanide ions.13. (canceled)14. A method for depositing a gold layer on a surface of a substrate claim 1 , comprising claim 1 , in this order claim 1 , the method stepsproviding the substrate with the surface;{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'claim-text': 'and thereby depositing a gold layer onto at least one portion of the surface of the substrate.', '(ii) contacting at least a portion of the surface of the substrate with the electroless gold plating bath according to ;'}16. The electroless gold plating bath of wherein the at least one hydroxycarboxylic acid is a C1-C12-hydroxycarboxylic acid.17. The electroless gold plating bath of wherein ...

Method for production of metal skin layer particles with controllable layer thickness

A method of depositing at least one metal skin layer on a metal nanoparticle core is disclosed. The first step of the method is selecting a metal to deposit. Then, the metal nanoparticle core is dispersed in an electrolyte solvent to form a liquid mixture. Next, a hydrogen containing gas is bubbled through the liquid mixture to form a layer of adsorbed hydrogen atoms on the surface of the metal nanoparticle core. Finally, the selected metal is added to the liquid mixture to form a metal skin layer on the metal nanoparticle core.

Fabrication of mirror-like coatings

This invention relates to an object with electroless plated coatings that includes an adhesion coating, a smoothening coating, a silver coating and an anti-scratch coating. A method of fabricating the electroless plated object is also described.

ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRIMIDINE DERIVATIVE CONTAINING CATALYSTS

Pyrimidine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants. 2. The method of claim 1 , wherein the one or more pyrimidine derivatives are chosen from uracil claim 1 , barbituric acid claim 1 , orotic acid claim 1 , thymine claim 1 , 2-aminopyrimidine claim 1 , 6-hydroxy-2 claim 1 ,4 claim 1 ,6-triaminopyrimidine claim 1 , 6-methyluracil claim 1 , 2-hydroxypyrimidine claim 1 , 4 claim 1 ,6-dichloropyrimidine claim 1 , 2 claim 1 ,4-dimethoxypyrimidine claim 1 , 2-amino-4 claim 1 ,6-dimethylpyrimidine claim 1 , 2-hydroxy-4 claim 1 ,6-dimethylpyrimidine and 6-methylisocytosine.3. The method of claim 1 , wherein a molar ratio of the one or more pyrimidine derivatives to the metal ions is 1:1 to 4:1.4. The method of claim 1 , wherein the metal ions are chosen from palladium claim 1 , silver claim 1 , gold claim 1 , platinum claim 1 , copper claim 1 , nickel and cobalt.5. The method of claim 1 , wherein the metal on the substrate is copper claim 1 , copper alloy claim 1 , nickel or nickel alloy.6. The method of claim 1 , wherein the aqueous alkaline catalyst solution has a pH of 8.5 or greater.7. The method of claim 6 , wherein the aqueous alkaline catalyst solution has pH of 9 or greater.8. The method of claim 1 , wherein the substrate comprising the dielectric further comprises a plurality of through-holes.9. The method of claim 8 , wherein the substrate comprising the dielectric further comprises metal cladding. The present invention is directed to electroless metallization of dielectrics with alkaline stable monomeric pyrimidine derivative containing catalysts. More specifically, the present invention is directed to metallization of dielectrics with alkaline stable monomeric pyrimidine derivative containing catalysts as a ...

Electroless palladium plating solution and palladium film

An electroless palladium plating liquid containing at least hydrazine or a salt thereof as a reducing agent, which has excellent bath stability in the vicinity of acidity to neutrality range, long-term stability, and is capable of suppressing the Pd film deposition rate decrease caused by elution of etching resist. An electroless palladium plating solution of the invention includes a palladium compound, hydrazine or its salt, at least one selected from a group consisting of a compound represented by the following formula (1) or its salt and a compound represented by the following formula (2) or its salt; and a pH of 8 or less, NH2NHCOR1 (1), (NH2NHCO)2(R2)n (2), wherein R1 represents H, NH2, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, NHNH2, or an aromatic group, wherein each of these groups may have a substituent; R2 represents (CH2) or an aromatic group, wherein each of these groups may have a substituent; and n represents an integer of 0 to 10.

ELECTROLESS PLATING PROCESS

An object is to provide an electroless plating process which can thin a film thickness of a nickel film and can obtain a film having excellent mounting characteristics, when the nickel film and a gold film are sequentially formed on a surface of a copper material. In order to solve the above-mentioned problems, provided is an electroless plating process which sequentially forms a nickel film and a gold film on a surface of a copper material by an electroless plating method and includes: a step of forming the nickel film on the surface of the copper material by an electroless strike plating method; and a step of forming the gold film by a reduction-type electroless plating method. 1. An electroless plating process for sequentially forming a nickel film and a gold film on a surface of a copper material by an electroless plating method , comprising:forming the nickel film on the surface of the copper material by an electroless strike plating method; andforming the gold film by a reduction-type electroless plating method.2. The electroless plating process according to claim 1 , wherein the electroless strike plating method is performed by using an electroless nickel strike plating solution that contains a water-soluble nickel salt in a concentration of 0.002 to 1 g/L in terms of nickel claim 1 , a carboxylic acid or a salt thereof claim 1 , and one or more reducing agents selected from the group of dimethylamine borane claim 1 , trimethylamine borane claim 1 , hydrazine and a hydrazine derivative claim 1 , and has a pH adjusted to 6 to 10 and a bath temperature adjusted to 20 to 55° C. claim 1 , and immersing the copper material in the electroless nickel strike plating solution.3. The electroless plating process according to claim 2 , wherein the electroless nickel strike plating solution is prepared by mixing and stirring the water-soluble nickel salt claim 2 , the carboxylic acid or the salt thereof and water to prepare an aqueous solution containing a nickel complex ...

Electroless Silver Plating Bath and Method of Using the Same

An electroless silver plating bath and method of use is presented within. The electroless silver plating bath is designed to plate only on the desired metal substrate while preventing plating on areas other than those which are to be plated. The invention uses heavy metal based stabilizers in the electroless silver plating bath to prevent extraneous plating. The ability to control the amount of stabilizer present in the plating bath allows for elimination of extraneous plating and allows for a stable bath. The electroless silver plating bath is very stable and yet plates at an acceptable rate. The electroless silver plating bath prevents corrosion on the underlying metal that is plated on by using the stabilizers as described herein. The silver plating bath presented herein is useful for a wide variety of applications including those in electronic packaging, integrated circuits (IC) and in manufacturing of light emitting diodes (LEDs).

METHOD OF MANUFACTURING PALLADIUM THIN FILM BY USING ELECTROLESS-PLATING METHOD

Provided is a method of manufacturing a palladium (Pd) thin film by using an electroless-plating method, the method including: manufacturing a reaction mixture by adding Pd salt and an alkaline pH regulator to an alcohol-water mixed solution; and forming a Pd thin film by loading and stirring the reaction mixture in a substrate. Accordingly, a Pd thin film having a surface enhancement Raman scattering (SERS) effect may be easily manufactured without having to use expensive additional equipment, such as a vacuum device, and in detail, electroless-plating may be performed even on an insulating substrate formed of, for example, glass. In addition, since a size of the Pd thin film manufactured on the substrate may be adjusted, the Pd thin film may be applied to various electrochemical products. 1. A method of manufacturing a palladium (Pd) thin film by using an electroless-plating method , the method comprising:manufacturing a reaction mixture by adding Pd salt and an alkaline pH regulator to an alcohol-water mixed solution; andforming a Pd thin film by putting a substrate in the reaction mixture and stirring the reaction mixture.2. The method of claim 1 , wherein the alcohol-water mixed solution is a mixed solution containing 70 to 90 wt % of alcohol and 30 to 10 wt % of water.3. The method of or claim 1 , wherein the alcohol is C1 to C4 alcohol.4. The method of claim 1 , wherein the Pd salt is selected from the group consisting of Pd nitrate claim 1 , Pd chloride claim 1 , Pd iodide claim 1 , and Pd (II) acetate.5. The method of claim 1 , wherein the alkaline pH regulator is selected from the group consisting of butylamine claim 1 , ethylamine claim 1 , propylamine claim 1 , pentylamine claim 1 , and triethylamine.6. The method of claim 1 , wherein the substrate is formed of a material selected from the group consisting of glass claim 1 , plastic claim 1 , and indium tin oxide (ITO).7. The method of claim 2 , wherein the alcohol is C1 to C4 alcohol. This application ...

Method of manufacturing gold thin film by using electroless-plating method

Provided is a method of manufacturing a gold (Au) thin film on a dielectric surface by using an electroless-plating method, the method including: manufacturing a reaction mixture by adding an Au chloride compound and an alkaline compound to an alcohol-water mixed solution; and forming an Au thin film by putting a substrate in the reaction mixture and stirring the reaction mixture. Accordingly, compounds that are relatively low toxic may be used as raw materials, and an Au thin film having a surface enhancement Raman scattering (SERS) effect may be conveniently and stably formed on a dielectric surface without having to use expensive additional equipment, such as a vacuum device. 1. A method of manufacturing a gold (Au) thin film by using an electroless-plating method , the method comprising:manufacturing a reaction mixture by adding an Au chloride compound and an alkaline compound to an alcohol-water mixed solution; andforming an Au thin film by putting a substrate in the reaction mixture and stirring the reaction mixture in the temperature range of 50˜70° C.2. The method of claim 1 , wherein the alcohol-water mixed solution is a mixed solution containing 70 to 90 wt % of alcohol and 30 to 10 wt % of water.3. The method of claim 1 , wherein the alcohol is C1 to C4 alcohol.4. The method of claim 1 , wherein the Au chloride compound is selected from the group consisting of potassium Au chloride (KAuCl4) claim 1 , gold potassium cyanide (KAu(CN)2) claim 1 , and chloroauric acid (HAuCl4).5. The method of claim 1 , wherein the alkaline compound is selected from the group consisting of potassium carbonate claim 1 , sodium hydroxide claim 1 , potassium hydroxide claim 1 , butylamine claim 1 , and sodium hydrogen carbonate.6. The method of claim 1 , wherein the substrate is formed of a dielectric material selected from the group consisting of glass claim 1 , plastic claim 1 , and silicon.7. The method of claim 2 , wherein the alcohol is C1 to C4 alcohol. This application ...

Substrate liquid processing apparatus and substrate liquid processing method

A substrate liquid processing apparatus configured to supply a plating liquid to a substrate includes a substrate holder configured to hold the substrate; a plating liquid sending device configured to send the plating liquid to a first flow path; a temperature controller connected to the plating liquid sending device via the first flow path and configured to control a temperature of a fluid supplied through the first flow path; an extrusion fluid sending device configured to send an extrusion fluid different from the plating liquid to the first flow path; and a discharge device connected to the temperature controller and configured to discharge a fluid supplied from the temperature controller.

METHOD TO DEPOSIT A PRECIOUS METAL FILM

A versatile, highly scalable single step method is provided for depositing a metallic Pd film from low temperature combustion of an aqueous solution. By using only palladium nitrate and glycine as precursors, water as a solvent, mirror-bright dense Pd films with high crystallinity and good adhesion can be deposited at 250° C. on different substrates without subsequent annealing. The technique can be used to form a reusable catalytic flask as illustrated by the Suzuki-Miyaura cross-coupling reaction, where the Pd film uniformly covers the inner walls of the flask and eliminates the catalyst separation step. 1. A method for depositing a metal film on a substrate , the method comprising:a single heating of a precursor solution coated on a substrate, wherein the precursor solution comprises at least one metal, and whereby that the single heating causes solution combustion synthesis (SCS) to take place and the at least one metal is deposited on the substrate as a metal film.2. The method of claim 1 , wherein the at least one metal is palladium (Pd).3. The method of claim 2 , wherein the precursor solution comprises palladium nitrate (Pd(NO)) and glycine (NHCHCOOH) in a molar ratio in the range of 1:1.2 to 1:2.5.4. The method of claim 1 , wherein the metal film is a palladium (Pd) film and the precursor coating is formed from palladium nitrate (Pd(NO).HO) and glycine (NHCHCOOH) in water.5. The method of claim 4 , wherein the precursor coating is formed by dissolving 100 mg palladium nitrate (99.9%) and 40 mg glycine (98.5%) in 20 mL ultrapure water (18.2 M Ω ·cm) to obtain a solution with Pd concentration of 0.016 M.6. The method of claim 4 , wherein the single heating is at approximately 250° C.7. The method of claim 1 , wherein the precursor solution is coated on the substrate via spin-coating.8. The method of claim 1 , wherein the metal film is a mirror-bright dense Pd film.9. The method of claim 1 , wherein the metal film is deposited on the substrate without the use ...

FORMATION OF NANOSIZED METAL PARTICLES ON A TITANATE CARRIER

Methods directed to the synthesis of metal nanoparticles are described. A formation process can be carried out at ambient temperature and pressure and includes the deposition of metal ions on a titanate carrier according to a chemical deposition process followed by exposure of the metal ions to a reducing agent. Upon the exposure, nanoparticles of the reduced metal are formed that are adhered to the titanate carrier. 1. A method of forming metal nanoparticles comprising:depositing metal ions on a titanate carrier, the metal ions having an oxidation state;following the deposition, exposing the metal ions and the titanate carrier to a reducing agent, wherein upon the exposure nanoparticles of the metal are formed on the titanate carrier, the metal of the nanoparticles being reduced from the oxidation state of the metal ions.2. The method of claim 1 , wherein the titanate carrier is a nanosized titanate carrier.3. The method of claim 1 , wherein the titanate carrier is a micron-sized titanate carrier.4. The method of claim 1 , wherein the metal ions are deposited according to a chemical deposition process.5. The method of claim 4 , wherein the chemical deposition process is an ion exchange process.6. The method of claim 1 , wherein the titanate carrier is monosodium titanate.7. The method of claim 1 , wherein the titanate carrier is sodium peroxotitanate.8. The method of claim 1 , wherein the titanate carrier is sodium titanium oxide nanoparticles.9. The method of claim 1 , wherein the reducing agent comprises an alcohol.10. The method of claim 9 , wherein the alcohol is ethanol.11. The method of claim 1 , wherein the reducing agent comprises ultraviolet-visible light.12. The method of claim 1 , wherein the metal is a transition metal.13. The method of claim 12 , wherein the metal is a metal of the platinum group.14. The method of claim 13 , wherein the metal is gold.15. The method of claim 1 , wherein the deposition is carried out at ambient temperature and pressure. ...

Antimicrobial Silver Compositions

The present invention comprises methods and compositions for antimicrobial silver compositions comprising silver nanoparticles. The present invention further comprises compositions for preparing silver nanoparticles comprising at least one stabilizing agent, one or more silver compounds, at least one reducing agent and a solvent. In one aspect, the stabilizing agent comprises a surfactant or a polymer. The polymer may comprise polymers such as polyacrylamides, polyurethanes, and polyamides. In one aspect, the silver compound comprises a salt comprising a silver cation and an anion. The anion may comprise saccharinate derivatives, long chain fatty acids, and alkyl dicarboxylates. The methods of the present invention comprise treating devices with the silver nanoparticle compositions, including, but not limited to, such devices as woven wound care materials, catheters, patient care devices, and collagen matrices. The present invention further comprises treatment of humans and animals wacr6ith the antimicrobial devices described herein. 115-. (canceled)16. A method of treating a surface with silver nanoparticles , comprising , a) contacting a surface with a solution comprising silver nanoparticles for a time sufficient for an effective amount of nanoparticles to bind to the surface , and b) rinsing the solution from the surface.17. The method of claim 16 , wherein the contacting and rinsing steps are repeated multiple times to increase the number of nanoparticles adhering to the surface.18. The method of claim 16 , wherein the surface contacted is a medical device claim 16 , polymer claim 16 , a fiber claim 16 , a metal claim 16 , glass claim 16 , ceramic claim 16 , fabric or combination thereof.19. The method of claim 16 , further comprising c) contacting the surface with nanoparticles adhered thereto with an aqueous solution of hydrogen peroxide for a sufficient period of time claim 16 , and d) rinsing the hydrogen peroxide solution from the surface.20. The method of ...

NOBLE METAL COATED SILVER NANOWIRES, METHODS FOR PERFORMING THE COATING

Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network. 1. A method for forming noble metal coated silver nanowires by direct metal deposition , the method comprising:gradually adding a coating solution comprising dissolved noble metal ions and a metal ion complexing ligand into a reaction solution comprising silver nanowires and a reducing agent to form the noble metal coating on the silver nanowires.2. The method of wherein the metal ion complexing ligand is selected from the group consisting of nitrite claim 1 , diethyl amine claim 1 , ethylene diamine claim 1 , nitrilotriacetic acid claim 1 , iminobis(methylene phosphonic acid) claim 1 , aminotris(methylene phosphonic acid) claim 1 , ethylene diamine tetraacetic acid (EDTA) claim 1 , 1 claim 1 ,3-propylenediaminetetraacetic acid (1 claim 1 ,3-PDTA) claim 1 , triethylene tetramine claim 1 , tri(2-aminoethyl) amine claim 1 , diethylenetriaminepentaacetic acid claim 1 , 1 claim 1 ,2-cyclohexanediaminotetraacetic acid claim 1 , iminodiacetic acid claim 1 , methyliminodiacetic acid claim 1 , N-(2-acetamide) iminoacetic acid claim 1 , N-(2-carboxyethyl) iminodiacetic acid claim 1 , N-(2-carboxymethyl)imino dipropionic acid claim 1 , picolinic acid claim 1 , dipicolinic acid claim 1 , histidine claim 1 , combinations thereof.3. The method of wherein the reacting step comprises gradual addition of a coating solution comprising the noble metal ions and the metal ion complexing ligands to a ...

NANOMETAL-NANOCARBON HYBRID MATERIAL AND METHOD OF MANUFACTURING THE SAME

Disclosed are a nanometal-nanocarbon hybrid material and a method of manufacturing the same, the method including modifying the surface of nanocarbon to introduce a functional group to conductive nanocarbon; mixing the surface-modified nanocarbon with an isocyanate-based compound and a pyrimidine-based compound and allowing them to react, thus forming a nanocarbon dispersion reactive to metal ions; adding the nanocarbon dispersion with a metal salt precursor, a reducing agent and a solvent, thus manufacturing nanometal particles; and separating a hybrid of the nanometal particles having the nanocarbon bound thereto. Thereby, nanocarbon is mixed with an isocyanate-based compound and a pyrimidine-based compound and then allowed to react, whereby the nanocarbon reactive with metal ions is used as an additive, thus obtaining a nanometal having a low-dimensional shape having less than three dimensions. Also, a nanometal can be hybridized with nanocarbon simultaneously with the formation of the nanometal, and solvent dispersibility is ensured by a functional group formed by mixing and reacting an isocyanate-based compound and a pyrimidine-based compound, ultimately facilitating the preparation of conductive ink or paste. 1. A method of manufacturing a nanometal-nanocarbon hybrid material , comprising:modifying a surface of a nanocarbon to introduce a functional group to a conductive nanocarbon, thus obtaining a surface-modified nanocarbon;mixing the surface-modified nanocarbon with an isocyanate-based compound and a pyrimidine-based compound and allowing them to react, thus forming a nanocarbon dispersion that is reactive to metal ions;adding the nanocarbon dispersion with a metal salt precursor, a reducing agent and a solvent, thus manufacturing nanometal particles; andseparating a hybrid of the nanometal particles having the nanocarbon bound thereto.2. The method of claim 1 , wherein the nanocarbon is selected from the group consisting of carbon nanotubes (CNT) claim 1 ...

METHOD FOR FORMING METAL PLATING FILM

A method that forms a metal plating film having a thick film thickness by a solid phase method is provided. The present disclosure is a method that forms the metal plating films of a first metal and a second metal having an ionization tendency larger than an ionization tendency of the first metal. The method includes: depositing the second metal on a surface of a copper base material to form the plating film of the second metal; and depositing the first metal on a surface of the second metal by a solid electroless plating method to form the plating film of the first metal. The solid electroless plating method in the depositing of the first metal is performed using a laminated complex. The laminated complex includes a first substitution-type electroless plating bath, a solid electrolyte membrane, a copper base material, a third metal, a second substitution-type electroless plating bath, and an insulating polymer. The first substitution-type electroless plating bath contains ions of the first metal. The second metal is plated on the copper base material. The third metal has an ionization tendency larger than the ionization tendency of the first metal. The second substitution-type electroless plating bath contains ions of the first metal. 1. A method that forms metal plating films of a first metal and a second metal having an ionization tendency larger than an ionization tendency of the first metal , the method comprising:depositing the second metal on a surface of a copper base material to form the plating film of the second metal; anddepositing the first metal on a surface of the second metal by a solid electroless plating method to form the plating film of the first metal,wherein the solid electroless plating method in the depositing of the first metal is performed using a laminated complex, the laminated complex includes a first substitution-type electroless plating bath, a solid electrolyte membrane, a copper base material on which the second metal is plated, a ...

METHOD FOR FORMING A BIMETALLIC CORE-SHELL NANOSTRUCTURE

A method forms a bimetallic core-shell nanostructure. The bimetallic core-shell nanostructure comprises a core comprising silver and a shell comprising gold. The bimetallic core-shell nanostructure may be used in various technical fields, such as surface-enhanced Raman scattering (SERS), photovoltaic cells, biomedical, bioimaging and biosensing applications. 1. A method for forming a bimetallic core-shell nanostructure , wherein the core comprises silver and the shell comprises gold , the method comprising simultaneously adding a gold precursor and a reducing agent to a solution containing silver nanoparticles , wherein the reducing agent comprises hydroxylamine solution or a hydroxylamine salt.2. The method of claim 1 , wherein prior to or during adding the reducing agent claim 1 , a basic solution is added to the reducing agent.3. The method of claim 1 , wherein a reaction mixture comprising the solution claim 1 , the gold precursor claim 1 , and the reducing agent is placed in a container placed in an ice bath.4. The method of claim 1 , wherein the reaction mixture is continuously stirred.5. The method of claim 1 , wherein the reducing agent is added at a flow rate of about 1 to 3 ml/h.6. The method of claim 5 , wherein the flow rate of the reducing agent is variable.7. The method of claim 1 , wherein the gold precursor is added at a flow rate of about 1 to 3 ml/h.8. The method of claim 7 , wherein the flow rate of the gold precursor is variable.9. The method of claim 1 , wherein the gold precursor is selected from the group consisting of chloroauric acid (HAuCl) claim 1 , gold (III) chloride (AuCl) claim 1 , gold (I) chloride (AuCl) claim 1 , and a mixture thereof.10. The method of claim 1 , wherein the reducing agent has a concentration of 100 mM or less.11. The method of claim 10 , wherein the concentration of the reducing agent is 10 mM or less.12. A bimetallic core-shell nanostructure claim 1 , wherein the core comprises silver and the shell comprises gold ...

WATER SOLUBLE AND AIR STABLE PHOSPHAADAMANTANES AS STABILIZERS FOR ELECTROLESS METAL DEPOSITION

The present invention relates to the use of water soluble and air stable phosphaadamantanes as stabilizers in electrolytes for electroless metal deposition. An electrolyte, as well as a method for the electroless deposition of metals is disclosed. The plated metal layers can comprise nickel, copper, cobalt, boron, silver, palladium or gold, as well as alloys comprising at least one of the aforementioned metals as an alloying metal. The present invention further relates to an organic stabilizer for electroless plating processes, and an electrolyte for the electroless deposition of a metal layer on a substrate, comprising a metal ion source for the metal to be deposited, a reducing agent, a complexing agent, a stabilizer and preferably an accelerator. A method for the electroless deposition of a metal layer on a surface from an electrolyte according to the invention is also disclosed. 2. The aqueous electrolyte composition according to claim 1 , wherein the phosphaadamantane is present in a concentration between ≥0.05 mg/L and ≤100 mg/L.3. The aqueous electrolyte composition according to claim 2 , wherein the phosphaadamantane is present in a concentration between ≥0.1 mg/L and ≤25 mg/L.4. The aqueous electrolyte composition according to claim 3 , wherein the phosphaadamantane is present in a concentration between ≥0.5 mg/L and ≤10 mg/L.5. The aqueous electrolyte composition according to claim 1 , wherein the metal to be deposited is at least one metal selected from the group consisting of nickel claim 1 , copper claim 1 , cobalt claim 1 , boron claim 1 , silver claim 1 , and gold.6. The aqueous electrolyte composition according to claim 1 , wherein the accelerator is selected from the group consisting of saccharine claim 1 , hydantoin claim 1 , rhodanine claim 1 , carbamide claim 1 , carbamide derivates and mixtures thereof.7. The aqueous electrolyte composition according to claim 1 , wherein the electrolyte is essentially free of inorganic stabilizers claim 1 , lead ...

ELECTROLESS PLATING OF RUTHENIUM AND RUTHENIUM-PLATED PRODUCTS

An electroless plating Ru bath for the deposition of Ru on the surface of a substrate comprises a Ru stock solution and hydrazine as a reducing reagent. Ru layers may be applied, for example, for use in membranes for the separation of hydrogen gas from mixtures of gases or to protect materials from corrosion. An example Ru stock solution comprises Ru chloride, hydrochloric acid, ammonia, nitrite salt, alkali hydroxide, and deionized water. The electroless plating bath may be applied to deposit ruthenium layers onto palladium layers to prepare Pd—Ru composite or alloy membranes or multilayer Pd—Ru composite or alloy membranes. Such membranes have example application to the separation of hydrogen from mixtures of gases. 1. A method for depositing Ru onto a surface of a substrate , the method comprising: a Ru stock solution; and', 'a hydrazine reducing reagent; and, 'preparing an electroless plating bath having a pH of at least 13 comprisingcontacting the substrate with the electroless plating bath.2. A method according to claim 1 , wherein the Ru stock solution comprises:a source of Ru ions; anda water soluble nitrite salt.3. A method according to claim 2 , wherein the electroless plating bath further comprises one or more of:hydrochloric acid;a complexing reagent; andan alkali hydroxide.4. A method according to claim 3 , wherein the source of Ru ions comprises a chloride or nitrate of Ru.5. A method according to claim 3 , wherein the complexing reagent comprises ammonia.6. A method according to claim 5 , wherein the molar ratio of ammonia/Ru is at least 150.7. A method according to claim 6 , wherein the molar ratio of ammonia/Ru is at least 200.8. A method according to claim 7 , wherein the alkali hydroxide comprises sodium hydroxide or potassium hydroxide.9. A method according to claim 2 , wherein the water soluble nitrite salt comprises sodium nitrite or potassium nitrite.10. A method according to claim 2 , wherein the molar ratio of nitrite/Ru is at least 1.11. A ...

Cyanide-free liquid composition for immersion gold plating

A gold deposition accelerator for electroless gold plating comprising one or more alkali metal compound(s), wherein said alkali metal compound is not a compound comprising only sodium as an alkali metal, and said alkali metal compound is not only halide, only potassium sulfite, or only potassium sodium tartrate of an alkali metal, an electroless gold plating solution comprising said gold deposition accelerator, a gold plating method and a gold deposition accelerating method using the same and the like are provided.

NANOSTRUCTURE SUBSTRATE

A nanostructure substrate includes groups of composite particles in which a reduced and deposited coating layer shows cohesive polarization action and/or electromagnetic polarization action. Also, to provide a nanostructure substrate, such active sites are dramatically increased to allow a medium to react homogenously over the entire nanostructure substrate. On a transparent semi-curable polyester resin film, groups of gold fine particles (average particle diameter: 20 nm) are reduced and deposited from an aqueous solution and self-aggregated. A half of the lower part of the groups of gold fine particles is submerged in the polyester resin film, and embedded in the front surface side of the transparent resin base body. Then, this transparent substrate is immersed in an electroless gold-plating solution repeatedly to deposit gold crystal grains on the fixed groups of gold fine particles. 1. A nanostructure substrate having a front surface and a back surface , comprisinga metal structure body including groups of composite particles, anda substrate including a resin base body and a support body,wherein a geometric surface area of a front surface side of the groups of composite particles is larger than a geometric surface area of a back surface side, and each of the composite particles includes fine particles of metal or the like and a coating layer having an upper part being reduced and deposited and including metal or a co-deposit, a lower part of the fine particles of metal or the like is embedded in the resin base body, and the embedded fine particles of metal or the like is present apart from another fine particles of metal or the like.2. The nanostructure substrate according to claim 1 , wherein the coating layer is reduced and deposited from an aqueous solution claim 1 , and comprises metal claim 1 , an alloy claim 1 , or a co-deposit.3. The nanostructure substrate according to claim 1 , wherein the coating layer is linked.4. The nanostructure substrate according ...

MANUFACTURING OF HIGH RESOLUTION CONDUCTIVE PATTERNS USING ORGANOMETALLIC INK AND BANDED ANILOX ROLLS

Disclosed herein are systems methods for using ink comprising organometallics in a flexographic printing process using engraved anilox rolls to transfer ink to an impression roll that prints a pattern on a substrate. A banded anilox roll with more than one geometry and/or volume of cells may be used in these production systems and methods. The pattern printed may comprise a plurality of lines which are each from 1 micrometer-25 micrometers wide and may be part of an electronics application such as a touch screen sensor or an RF antenna that requires microscopic conductive patterns such as touch screen displays or antennas. 1. A method of making a touch sensor comprising:flexographically printing a first pattern on a first substrate by a transferring ink from an ink source by a first anilox roll to a first flexomaster; and wherein the first pattern comprises a first plurality of lines and the second pattern comprises a second plurality of lines, wherein the first plurality of lines and the second plurality of lines are formed from an ink comprising 1 wt %-20 wt % organometallics and at least one solvent, wherein the ink viscosity is from 200 cps-20000 cps,', 'wherein printing comprises transferring the ink from an ink source by a first anilox roll to the first flexomaster and from the ink source by a second anilox roll to the second flexomaster, and wherein each line of the plurality of lines is between 1-25 micrometers wide;', 'wherein at least one of the first anilox roll and the second is a banded anilox roll, wherein the at least one banded anilox roll comprises a plurality of sections, wherein each section comprises a volume and a cell shape, and wherein at least two sections of the plurality of sections comprise at least one of different cell shapes or different volumes; and, 'flexographically printing a second pattern on a second substrate by a transferring ink from the ink source by a second anilox roll to a second flexomaster;'}plating the first and the ...

PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM

The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aromatic compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aromatic compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aromatic compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths. 2. (canceled)3. The aqueous plating bath composition according to claim 1 , wherein the linear C1 to C8 alkyl groups claim 1 , the linear C1 to C20 alkyl groups claim 1 , the branched C3 to C8 alkyl groups or the branched C3 to C20 alkyl groups are substituted and the substituents are selected independently from each other from an unsubstituted or substituted phenyl group and an unsubstituted or substituted naphthyl group.4. The aqueous plating bath composition according to claim 3 , wherein the phenyl group or the naphthyl group are substituted and the substituents are selected independently from each other from the group consisting of —OH claim 3 , —O—CH claim 3 , —O—CH—CH claim 3 , —CH claim 3 , and —CHO.6. The aqueous plating bath composition according to claim 1 , wherein the at least one aromatic compound according to Formula (I) has a concentration ranging from 0.01 to 100 mg/I.7. The aqueous plating bath composition according to claim 1 , wherein the pH-value ranges from 4 to 7.8. The aqueous plating bath composition according to claim 1 , wherein the at least one source for ...

Non-Metallic Nano/Micro Particles Coated with Metal, Process and Applications Thereof

The present invention provides a simple and economical process for preparation of metal-coated non-metallic nano/micro particles. The nano/micro particles are composed of a core and metallic coat over the core using silver or other transition/noble metals. The core of the non-metallic nano/micro particles are selected from inorganic material such as silica, calcium carbonate, barium sulfate, or emulsion grade polyvinyl chloride and other polymers prepared by emulsion process including porous polymers. The metal coating is selected from the transition/noble metals such as copper, nickel, silver, palladium, platinum, osmium, ruthenium, rhodium, and such other metals and their combinations that are easily reducible to elemental metal. 1. A method for preparing a coated nano/micro particle , comprising the method steps of:(a) dissolving a metallic salt in a liquid solvent;(b) dispersing a quantity of non-metallic inorganic cores in the solvent;(c) evaporating the solvent to produce a slurry comprising a plurality of coated nano/micro particles;(d) adding a reducing agent to the slurry; and(e) drying the slurry.2. The method of claim 1 , wherein said metallic salt comprises a metal selected from the group consisting of copper claim 1 , nickel claim 1 , silver claim 1 , palladium claim 1 , platinum claim 1 , ruthenium claim 1 , gold claim 1 , osmium claim 1 , and rhodium.3. The method of claim 1 , wherein said nonmetallic inorganic cores comprise a material selected from the group consisting of silica claim 1 , calcium carbonate claim 1 , barium sulfate claim 1 , and titanium dioxide. This patent application is a divisional of U.S. patent application Ser. No. 12/227,716, entitled “Non-Metallic Nano/Micro Particles Coated with Metal, Process and Applications Thereof,” which is a national-phase of international patent application Ser. No. PCT/US2007/011998, entitled “Non-Metallic Nano/Micro Particles Coated with Metal, Process and Applications Thereof,” filed May 21, 2007, ...

A method of electroless deposition of platinum group metals and their alloys and a plating bath used therein

The invention relates to a method of electroless deposition of platinum group metals and their alloys from a plating bath onto a substrate, comprising a reduction step of one or more platinum group metal precursors with a reducing agent, wherein the reducing agent is a primary or secondary monohydroxyalcohol or a mixture of primary or secondary monohydroxyalcohols. The invention also provides a plating bath suitable for use in said method.

NOBLE METAL SALT PREPARATION, A METHOD FOR PRODUCTION THEREOF AND USE FOR ELECTROPLATING

The present invention relates to a method for production of a noble metal salt preparation, the noble metal salt preparation comprising at least one noble metal sulfonate and thiourea and the use for surface coating by electroplating or electroless plating of a noble metal or metal alloy. 1. A method for production of a noble metal salt preparation by membrane electrolysis comprising the steps:a) providing an electrolytic cell comprising an anode comprising a noble metal and a cathode, wherein an anodic region and cathodic region are separated by a membrane;b) providing of at least one sulfonate solution in the anodic region; and 'wherein thiourea is added in the anodic region after step b) or after step c), and wherein the concentration of thiourea is 0.005 g/l to 200 g/l.', 'c) anodic oxidation of the noble metal and formation of a noble metal salt preparation comprising a noble metal sulfonate by passing a current through the electrolytic cell,'}2. The method for production of a noble metal salt preparation of claim 1 , wherein the noble metal is selected from gold (Au) claim 1 , platinum (Pt) claim 1 , palladium (Pd) claim 1 , rhodium (Rh) claim 1 , iridium (Ir) claim 1 , ruthenium (Ru) and indium (In).3. The method for production of a noble metal salt preparation of claim 1 , wherein the membrane is a cation-exchange membrane or an anion-exchange membrane.4. The method for production of a noble metal salt preparation of claim 1 , wherein the sulfonate is an alkyl sulfonate.5. The method for production of a noble metal salt preparation of claim 1 , wherein the concentration of the at least one sulfonate solution is 0.1% (w/w) to 20% (w/w).6. The method for production of a noble metal salt preparation of claim 1 , wherein the method comprises at least one further step selected from precipitation claim 1 , flocculation claim 1 , complexation claim 1 , oxidation and/or reduction.7. A noble metal salt preparation comprising at least one noble metal sulfonate and ...

SUBSTRATE HAVING AN ELECTRON DONATING SURFACE WITH METAL PARTICLES COMPRISING PALLADIUM ON SAID SURFACE

There is disclosed a substrate with an electron donating surface, characterized in having metal particles on said surface, said metal particles comprising palladium and at least one metal selected from the group consisting of gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of said metal particles is from about 0.001 to about 8 μg/cm. Examples of coated objects include contact lenses, pacemakers, pacemaker electrodes, stents, dental implants, rupture nets, rupture mesh, blood centrifuge equipment, surgical instruments, gloves, blood bags, artificial heart valves, central venous catheters, peripheral venous catheters, vascular ports, haemodialysis equipment, peritoneal dialysis equipment, plasmapheresis devices, inhalation drug delivery devices, vascular grafts, arterial grafts, cardiac assist devices, wound dressings, intermittent catheters, ECG electrodes, peripheral stents, bone replacing implants, orthopaedic implants, orthopaedic devices, tissue replacing implants, intraocular lenses, sutures, needles, drug delivery devices, endotracheal tubes, shunts, drains, suction devices, hearing aid devices, urethral medical devices, and artificial blood vessels. 1. A method of treating a patient comprising a step of bringing an object in contact with the patient , wherein said object at least partially has an electron donating surface , wherein there are metal particles on said electron donating surface , said metal particles comprising palladium and at least one metal selected from the group consisting of gold , ruthenium , rhodium , osmium , iridium , and platinum; and wherein the amount of said metal particles is from about 0.001 to about 8 μg/cm.2. The method according to claim 1 , wherein said electron donating surface is a layer of silver which is applied in an amount of about 0.05 to about 12 μg/cm.3. The method according to claim 1 , wherein said object comprises a polymer.4. The method according to claim 3 , wherein said polymer is ...

ALNICO-BASED HARD MAGNETIC PARTICLE AND METHOD FOR MANUFACTURING THE SAME

Disclosed is an AlNiCo-based hard magnetic particle containing Al, Ni, Co, Cu, Ti, and the balance of Fe. The AlNiCo-based hard magnetic particle contains Co in an amount of 10 to 17 wt %, has a coercive force of 250-450 Oe, and has a residual magnetization/coercive force rate of 0.06 or more. The AlNiCo-based hard magnetic particle according to the present invention can advantageously guarantee magnetic properties suitable for being detected by a magnetic reluctance device due to a low content of Co. 1. An AlNiCo-based hard magnetic particle comprising Al , Ni , Co , Cu , and Ti , with the balance being Fe , wherein the magnetic particle has a Co content between an 10% by weight to 17% by weight , and has a coercive force between 250 Oe and 450 Oe and a residual magnetization/coercive force ratio of 0.06 or more.2. The AlNiCo-based hard magnetic particle according to claim 1 ,wherein the Ni content is between 18% by weight and 25% by weight.3. The AlNiCo-based hard magnetic particle according to claim 1 ,wherein the Al content is between 4% by weight and 9% by weight, the Cu content is between 1% by weight and 4% by weight, and the Ti content is between 2% by weight and 5.5% by weight.4. The AlNiCo-based hard magnetic particle according to claim 1 ,wherein a sum of the Co content and the Ni content is a value between 32% by weight and 40% by weight.5. The AlNiCo-based hard magnetic particle according to claim 1 , further comprising:{'sub': 2', '2, 'an intermediate layer made from ZrOor TiOand'}a metal coating layer made from Ag sequentially formed on a surface of the intermediate layer.6. Security ink comprising:an AlNiCo-based hard magnetic particle comprising Al, Ni, Co, Cu, and Ti, with the balance being Fe,wherein the magnetic particle has a Co content between an 10% by weight to 17% by weight, and has a coercive force between 250 Oe and 450 Oe and a residual magnetization/coercive force ratio of 0.06 or more.7. The security ink of claim 6 ,wherein the Ni ...

Method and Solution for Forming Interconnects

An oxygen-free or oxygen-poor solution for the electroless deposition of a platinum group metal is described. The solution includes a ruthenium (II) amine complex having a first oxidation potential, and a platinum group metal compound having a reduction potential larger than the opposite of the oxidation potential of the ruthenium (II) amine complex. 1. An oxygen-free or oxygen-poor solution for the electroless deposition of a platinum group metal , comprising:a ruthenium (II) amine complex having an oxidation potential, anda platinum group metal compound having a reduction potential, larger than the opposite of the oxidation potential of the ruthenium (II) amine complex.2. The solution according to for depositing rhodium wherein the platinum group metal compound is a rhodium compound.3. The solution according to claim 2 , wherein the ruthenium amine complex is selected from [Ru(NH)] and [Ru(en)] wherein en stands for ethylenediamine.4. The solution according to claim 3 , wherein the platinum group metal compound has a general formula selected from MX claim 3 , MMX claim 3 , MX.xHO and MMX.xHO claim 3 , wherein x is an integer claim 3 , wherein Mis one or more platinum group metal atoms totalizing a positive valency v claim 3 , Mis one or more atoms claim 3 , one or more functional groups claim 3 , or a combination thereof claim 3 , other than M claim 3 , totalizing a positive valency v claim 3 , and X is one or more atoms claim 3 , one or more functional groups claim 3 , or a combination thereof claim 3 , totalizing a negative valency equal to −(v+v).5. The solution according to claim 1 , further comprising a complexing agent.6. The solution according to claim 1 , wherein the molar ratio ruthenium (II) amine complex:platinum group metal compound is from 5:1 to 20:1.7. A method for forming a platinum group metal interconnect during the fabrication of an integrated circuit claim 1 , comprising the steps of: a semiconductor substrate,', 'dielectric layer, the ...

COATED GLASS SLEEVES AND METHODS OF COATING GLASS SLEEVES

Disclosed are methods for coating or decorating a surface of a glass sleeve. The methods include depositing a metal layer onto a surface of the glass sleeve by an electroless plating method. Also disclosed are glass sleeves which are coated or decorated on an internal surface, and electronic devices comprising the coated glass sleeves. 1. A method for coating an internal surface of a hollow glass sleeve , said method comprising:contacting at least a portion of the internal surface of the glass sleeve with an electroless plating solution for a time sufficient to deposit a metal layer on at least a portion of the glass sleeve,the electroless plating solution comprising at least one material for providing metal ions to the glass sleeve and at least one reducing agent.2. The method according to claim 1 , wherein the material for providing metal ions to the glass sleeve comprises at least one metal chosen from palladium claim 1 , gold claim 1 , silver claim 1 , tin claim 1 , nickel claim 1 , platinum claim 1 , aluminum claim 1 , and copper.3. The method according to claim 2 , wherein the material providing metal ions to the glass sleeve is chosen from aqueous solutions of water-soluble salts of palladium claim 2 , gold claim 2 , silver claim 2 , tin claim 2 , nickel claim 2 , platinum claim 2 , aluminum claim 2 , and copper.4. The method according to claim 1 , wherein the reducing agent is chosen from glucose claim 1 , formaldehyde claim 1 , sodium hypophosphite claim 1 , glycerol claim 1 , hydrazine claim 1 , sodium borohydride claim 1 , amine boranes claim 1 , triethanol amine claim 1 , sodium sulfide claim 1 , and titanium chloride.5. The method according to claim 1 , comprising a further step of exposing the glass sleeve to an elevated temperature during or after the step of contacting the glass sleeve with the electroless plating solution.6. The method according to claim 1 , further comprising a step of pre-treating at least a portion of the internal surface of the ...

PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM

The present invention relates to a plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous acidic plating bath according to the present invention comprises a source for palladium ions, a reducing agent, a nitrogenated complexing agent for palladium ions and a water-soluble stabilizing agent selected from the group consisting of aromatic compounds comprising at least two residues wherein at least one residue is a hydrophilic residue and at least one residue has a negative mesomeric effect. The plating bath has an increased stability against undesired decomposition while maintaining a sufficient plating rate. 1. An aqueous acidic plating bath composition for electroless deposition of palladium , comprising(i) a source for palladium ions,(ii) a nitrogenated complexing agent for palladium ions,(iii) a reducing agent selected from the group consisting of formic acid, derivatives and salts thereof, wherein the at least one hydrophilic residue is selected from the group consisting of hydroxyl, carboxyl, sulfonate and salts thereof; and', 'wherein the at least one residue having a negative mesomeric effect is selected from the group consisting of nitro, nitrile, acetyl, carboxyl and sulfonate., '(iv) a water-soluble stabilizing agent selected from the group consisting of aromatic compounds comprising at least two residues wherein at least one residue is a hydrophilic residue and at least one residue has a negative mesomeric effect, and'}2. The aqueous acidic plating bath composition according to wherein the source for palladium ions is selected from the group consisting of palladium chloride claim 1 , palladium nitrate claim 1 , palladium acetate claim 1 , palladium sulfate claim 1 , palladium perchlorate claim 1 , di-chlorodiethylenediamine palladium claim 1 , dinitrodiethylenediamine palladium and diacetatodiethylenediamine palladium.3. The aqueous acidic plating bath composition according to wherein the ...

CHEMICAL VAPOR DEPOSITION PROCESSES USING RUTHENIUM PRECURSOR AND REDUCING GAS

Chemical vapor deposition (CVD) processes which use a ruthenium precursor of formula RRRu(0), wherein Ris an aryl group-containing ligand, and Ris a diene group-containing ligand and a reducing gas a described. The CVD can include oxygen after an initial deposition period using the ruthenium precursor and reducing gas. The method can provide selective Ru deposition on conductive materials while minimizing deposition on non-conductive or less conductive materials. Further, the subsequent use of oxygen can significantly improve deposition rate while minimizing or eliminating oxidative damage of the substrate material. The method can be used to form Ru-containing layers on integrated circuits and other microelectronic devices. 120-. (canceled)21. A method for selectively depositing ruthenium on a substrate in a chemical vapor deposition process comprising:{'sup': 1', '2', '1', '2, 'vaporizing a ruthenium precursor of the Formula I: RRRu(0), wherein Ris an aryl group-containing ligand, and Ris a diene group-containing ligand; and'}contacting the substrate with the vaporized ruthenium precursor and a reducing gas, wherein the substrate comprises a first, conductive material and a second, less conductive material and ruthenium is preferentially deposited on the first, conductive material compared with deposition on the second, less conductive material.23. The method of wherein one claim 22 , two claim 22 , or three of R-Rare selected from C-Calkyl claim 22 , with the remaining R-Rbeing H.24. The method of wherein Ris 0 (covalent bond) claim 22 , and Rand Rform one or more ring structures.25. The method of claim 21 , wherein the ruthenium precursor has a total carbon atom amount in the range of 12 to 20.26. The method of claim 21 , wherein the ruthenium precursor has a total hydrogen atom amount in the range of 16 to 28.27. The method of claim 21 , wherein Ris benzene or a mono- claim 21 , di- claim 21 , or tri-alkylbenzene.28. The method of claim 21 , wherein Ris a cyclic ...

Method for producing noble metal nanocomposites

The method for producing noble metal nanocomposites involves reducing noble metal ions (Ag, Au and Pt) on graphene oxide (GO) or carbon nanotubes (CNT) by using Artocarpus integer leaves extract as a reducing agent. As synthesized MNPs/GO and MNPs/CNT composites have been characterized using X-ray diffraction (XRD), transmission electron microscope (TEM) imaging, and energy dispersive X-ray spectroscopy (EDX). The TEM images of prepared materials showed that the nanocomposites were 1-30 nm in size with spherical nanoparticles embedded on the surface of GO and CNT. This synthetic route is easy and rapid for preparing a variety of nanocomposites. The method avoids use of toxic chemicals, and the prepared nanocomposites can be used for biosensor, fuel cell, and biomedical applications.

Metal nanowire thin-films

A conductive nanowire film having a high aspect-ratio metal is described. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.

FORMALDEHYDE-FREE ELECTROLESS METAL PLATING COMPOSITIONS AND METHODS

Formaldehyde-free electroless metal plating solutions include glyoxylic acid or salts thereof in combination with tertiary amines which stabilize the glyoxylic acid and salts. The electroless metal plating solutions are environmentally friendly, stable and deposit bright metal deposits on substrates. 2. The composition of claim 1 , wherein the one or more sources of glyoxylic acid is chosen from non-dissociated glyoxylic acid claim 1 , dihydroxy acetic acid claim 1 , a dihaloacetic acid and the bisulphite adduct of glyoxylic acid.3. The composition of claim 1 , wherein the salts of glyoxylic acid are chosen from alkali metal salts and ammonium salt of glyoxylic acid.4. The composition of claim 1 , wherein the one or more tertiary amines are chosen from triethanolamine claim 1 , 2-[bis(2-hydroxyethyl)amino]acetic acid and its salts claim 1 , N-(2-hydroxyethyl)iminodiacetic acid and its salts claim 1 , nitrilotriacetic acid claim 1 , nitrilo(3-propionic)diacetic acid and its salts claim 1 , nitrilotripropionic acid and its salts claim 1 , N claim 1 ,N-bis(2-hydroxypropyl)ethanolamine claim 1 , 1-[bis(2-hydroxyethyl)amino]-2-propanol claim 1 , 2-[bis(2-hydroxyethyl)amino]-2-(hydroxymethyl)-1 claim 1 ,3-propanediol claim 1 , N claim 1 ,N-Bis(carboxymethyl)-DL-alanine and its salts claim 1 , triisopropanolamine claim 1 , L-glutamic acid N claim 1 ,N′-diacetic acid and its salts claim 1 , N claim 1 ,N claim 1 ,N′ claim 1 ,N′-tetrakis(2-hydroxypropyl)ethylenediamine claim 1 , N claim 1 ,N claim 1 ,N′ claim 1 ,N′-tetrakis(2-hydroxyethyl)ethylenediamine claim 1 , 1 claim 1 ,3-Diamino-2-hydroxypropane-N claim 1 ,N claim 1 ,N′ claim 1 ,N′-tetraacetic acid and its salts claim 1 , ethylenediaminetetrapropionic acid and its salts claim 1 , propylenediaminetetraacetic acid and its salts claim 1 , N-(2-hydroxyethyl)ethylenediamine-N claim 1 ,N′ claim 1 ,N′-triacetic acid and its salts claim 1 , diethylenetriamine pentaacetic acid and its salts claim 1 , triethylenetetramine-N claim ...

Preparation of Modified Organic Core Materials and Metallic Shell Composite Microspheres

The present invention relates to a preparation of modified organic core materials and metallic shell composite microspheres, in which, the surface zeta potential of an organic core materials can attract the opposite zeta potential of the polyelectrolyte and form a polyelectrolyte layer so as to modify the surface of organic core materials. Moreover, the polyelectrolyte layer could attract a first metal ions, particles or complexes added later in suitable condition such that the surface of organic core materials could be metallized and covered with a first metal layer. Furthermore, the organic core materials could be covered with at least one surface metal layer. The first metal layer can be modified by second metal layer with redox-transmetalation® technology to obtain multi-metal layers organic-metallic composite structure. 1. A preparation of modified organic core materials and metallic shell composite microspheres , comprising steps of:{'b': '1', '(1) adding an organic substrate into a solvent to obtain a slurry;'}{'b': 2', '2', '1, '(2) adding a first polyelectrolyte into the slurry, wherein the zeta potential of the first polyelectrolyte is opposite to the surface zeta potential of the organic substrate ;'}{'b': 3', '3', '2, '(3) adding a second polyelectrolyte into the slurry, wherein the zeta potential of the second polyelectrolyte is opposite to the zeta potential of the first polyelectrolyte ;'}{'b': '4', '(4) adding a first metal compound into the slurry; and'}{'b': 5', '4', '6', '1, '(5) adding a reductant into the slurry for making the first metal compound be metalized, so as to form a first metal layer on the surface of the organic substrate .'}2. The preparation of modified organic core materials and metallic shell composite microspheres of further comprises the steps of:{'b': '7', '(6) adding a second metal compound into the slurry; and'}{'b': 6', '8', '7', '4', '6, '(7) the first metal layer being modified to a second metal layer after occurring an ...

METHOD FOR ELECTROLESS PLATING OF PALLADIUM PHOSPHORUS DIRECTLY ON COPPER, AND A PLATED COMPONENT THEREFROM

A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface. 1. A method for electroless plating of palladium onto a copper surface of a component , comprising:preparing a bath having a palladium compound;a poly aminocarboxylic compound;hypophosphite or a derivative thereofa pH adjuster;a complexing agent;a reaction stabilizing mixture of phosphite at a concentration between 0.1 grams per liter (g/l) and 5 g/l, nitrite at a concentration between 0.1 g/l and 5 g/l, copper at a concentration between 0.1 milligrams per liter (mg/l) and 10 mg/l, bismuth at a concentration between 0.1 mg/l and 10 mg/l, and lead at a concentration between 0.1 mg/l and 5 mg/l; andsubmerging the component in the bath to plate palladium directly on the copper surface of the component.2. The method of claim 1 , wherein the palladium compound is present in the bath at a concentration between 0.2 grams per liter (g/l) and 10 g/l and the polyaminocarboxylic compound includes at least one of an ethylene diamine tetraacetic acid (EDTA) or a derivative thereof at a concentration between 1 g/l and 20 g/l.3. The method of claim 1 , wherein preparing the bath includes:dissolving the polyaminocarboxylic compound and the reaction stabilizer in water to create a mixture;dissolving the palladium compound in the mixture;adjusting pH of the mixture by ...

Method for the metallization of a porous material

Metallization method for a porous material including deposition of a metallic material in the liquid phase using a solution containing metal ions, the conditions consisting of the solution temperature, the pH of the solution, and the concentration of metal ions in solution being chosen to result in a deposition rate of the metallic material less than or equal to 0.1 nm/min.

Process for depositing metal on a substrate

A process for depositing a metal on a substrate involves the use of two reduction reactions in a bottom-up based tandem manner starting from a substrate surface and working upward. A first reduction reaction starts on the substrate surface at ambient temperature, and a second reduction reaction, which is initiated by the reaction heat of the first reduction reaction, occurs in a reactive ink solution film coated on top, which becomes solid after the reaction. Gas and other small molecules generated from the reduction reactions, and the solvent, can readily escape through the upper surface of the film before the solid metal layer is formed or during post-treatment, with no or few voids left in the metal film. Thus, the process can be used to form highly conductive films and features at ambient temperature on various substrates.

SUBSTRATE HAVING AN ELECTRON DONATING SURFACE WITH METAL PARTICLES COMPRISING PALLADIUM ON SAID SURFACE

There is disclosed a substrate with an electron donating surface, characterized in having metal particles on said surface, said metal particles comprising palladium and at least one metal selected from the group consisting of gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of said metal particles is from about 0.001 to about 8 μg/cm. Examples of coated objects include contact lenses, pacemakers, pacemaker electrodes, stents, dental implants, rupture nets, rupture mesh, blood centrifuge equipment, surgical instruments, gloves, blood bags, artificial heart valves, central venous catheters, peripheral venous catheters, vascular ports, haemodialysis equipment, peritoneal dialysis equipment, plasmapheresis devices, inhalation drug delivery devices, vascular grafts, arterial grafts, cardiac assist devices, wound dressings, intermittent catheters, ECG electrodes, peripheral stents, bone replacing implants, orthopaedic implants, orthopaedic devices, tissue replacing implants, intraocular lenses, sutures, needles, drug delivery devices, endotracheal tubes, shunts, drains, suction devices, hearing aid devices, urethral medical devices, and artificial blood vessels. 126-. (canceled)27. An object at least partially coated with an outer layer , the outer layer comprising an electron donating material and metal particles , characterized in that the metal particles comprise palladium and at least one metal selected from the group consisting of gold , ruthenium , rhodium , osmium , iridium , and platinum , wherein the amount of the metal particles is from about 0.001 to about 8 μg/cm , and wherein the metal particles have an average size of about 10-10000 Å.28. The object according to claim 27 , wherein the electron donating material is applied in an amount of about 0.05 to about 12 μg/cm.29. The object according to claim 27 , wherein the electron donating material is silver.30. The object according to claim 27 , wherein the object comprises a polymer.31 ...

ELECTROLESS PALLADIUM PLATING BATH COMPOSITION

The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions. 2. The aqueous plating bath according to wherein X is selected from the group consisting of hydrogen claim 1 , lithium claim 1 , sodium claim 1 , potassium and ammonium.3. The aqueous plating bath according to wherein n claim 1 , m claim 1 , o and p are independently selected from 1 and 2.4. The aqueous plating bath according to wherein n and m are 1 and o and p are 2.5. The aqueous plating bath according to wherein the stabilising agent is selected from compounds according to formula (1) with R1 and R3 selected from formula (2a) claim 1 , R2 selected from formula (2c) and R4 selected from formula (2d).6. The aqueous plating bath according to wherein the source of palladium ions is selected from palladium chloride claim 1 , palladium nitrate claim 1 , palladium acetate claim 1 , palladium sulfate claim 1 , palladium perchlorate and complex compounds comprising at least one palladium ion and at least one nitrogenated complexing agent which is free of phosphorous.7. The aqueous plating bath according to wherein the concentration of palladium ions ranges from 0.5 to 500 mmol/l.8. The aqueous plating bath according to wherein the nitrogenated complexing agent which is free of phosphorous is selected from primary amines claim 1 , secondary amines and ternary amines.9. The aqueous plating bath according to wherein the mole ratio of nitrogenated complexing agent which is free of phosphorous and palladium ions ranges from 2:1 to 50:1.10. The ...

REDUCING ELECTROLESS SILVER PLATING SOLUTION AND REDUCING ELECTROLESS SILVER PLATING METHOD

Provided are a reducing electroless silver plating solution and a reducing electroless silver plating method using the silver plating solution, the reducing electroless silver plating solution being capable of preventing decomposition of silver in the plating solution thereby to maintain stability of the solution and also being capable of preventing excessive roughening of an underlying metal or the like thereby to form a plating film having good film characteristics and a good appearance. The reducing electroless silver plating solution according to the present invention comprises a water-soluble silver salt and a reducing agent, wherein cyanide ions in a concentration of 0.006×10mol/L to 12.5×10mol/L are contained. 1. A reducing electroless silver plating solution , comprising: a water-soluble silver salt and a reducing agent ,{'sup': −3', '−3, 'wherein cyanide ions in a concentration of 0.006×10mol/L to 12.5×10mol/L are contained.'}2. The reducing electroless silver plating solution according to claim 1 , wherein the above-mentioned water-soluble silver salt is a silver salt other than a cyanide claim 1 , and the above-mentioned cyanide ions are contained as an alkali metal cyanide.3. The reducing electroless silver plating solution according to claim 1 , wherein the above-mentioned reducing agent is at least one kind or more selected from hydroxylammonium sulfate and hydroxylacetate ammonium.4. The reducing electroless silver plating solution according to claim 1 , having a pH of 8 to 11.5. A reducing electroless silver plating method claim 1 , wherein claim 1 , using the reducing electroless silver plating solution according to claim 1 , electroless silver plating is applied to a plated material. The present invention relates to a reducing electroless silver plating solution and a reducing electroless silver plating method, more specifically, relates to a reducing electroless silver plating solution and a reducing electroless silver plating method using the ...

BETA-AMINO ACID COMPRISING PLATING FORMULATION

A plating formulation for the electroless deposition of a metal layer on a substrate, wherein a β-amino acid and/or β-amino acid derivative is used as a stabilizer. The β-amino acid is present within a range of 1 mg/L to 2 g/L. Typically, the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between −2 and +5. The inventive plating formulation can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid. 1. A plating formulation comprising a metal ion source for a metal to be deposited , a reducing agent , a complexing agent , an accelerator , and a β-amino acid and/or β-amino acid derivative as stabilizer , wherein the β-amino acid is present within a range of 1 mg/L to 2 g/L.2. The plating formulation of wherein the β-amino acid is present within a range of 100 mg/L to 1 g/L.3. The plating formulation of wherein the β-amino acid is present within a range of 200 mg/L to 400 mg/L.4. The plating formulation of wherein the β-amino acid and/or derivative has a pKa value within a range of 4 to 8.5. The plating formulation of wherein the β-amino acid and/or β-amino acid derivative is selected from the group consisting of 3-aminopropionic acid claim 1 , 3-aminobutyric acid claim 1 , 3-amino-4-methylvaleric acid claim 1 , 2-aminoethanesulfonic acid claim 1 , and derivatives thereof.6. The plating formulation of wherein the β-amino acid and/or β-amino acid derivative is selected from the group consisting of 3-aminopropionic acid claim 1 , 3-aminobutyric acid claim 1 , 3-amino-4-methylvaleric acid claim 1 , and combinations thereof.7. The plating formulation of wherein the reducing agent is a compound of the group consisting of sodium hypophosphite claim 1 , formaldehyde claim 1 , dimethyl aminoborane claim 1 , amino borane claim 1 , and other organic boranes.8. The plating formulation of wherein the plating formulation comprises ...

Method for manufacturing laminate containing patterned layers to be plated, method for manufacturing metal layer-containing laminate, touch panel sensor, touch panel, laminate containing patterned layers to be plated, and metal layer-containing laminate

A method for manufacturing a laminate containing patterned layers to be plated includes a step of preparing a laminate having a substrate having two main surfaces, and layers for forming a layer to be plated, respectively disposed on two main surfaces of the substrate and containing a polymerization initiator, a step of irradiating a layer for forming a layer to be plated in the laminate with light in a patternwise fashion under a predetermined requirement, and a step of removing non-light irradiated regions in the layers for forming a layer to be plated, thereby forming patterned layers to be plated on two main surfaces of the substrate. Also set forth are a touch panel sensor, a touch panel, a laminate containing patterned layers to be plated, and a metal layer-containing laminate.

Electroless Process for Depositing Refractory Metals

The invention provides an inexpensive, scalable process for coating materials with a film of a refractory metal. As an example, the immersion process can comprise the deposition of a sacrificial zinc coating which is galvanically displaced by the ether-mediated reduction of oxophilic WClto form a complex WOClfilm, and subsequently annealed to crystalline, metallic tungsten. The efficacy of this process was demonstrated on a carbon foam electrode, showing a 50% decrease in electrode resistance and significant gains in electrochemical performance. This process enables voltage efficiency gains for electrodes in batteries, redox flow batteries, and industrial processes where high conductivity and chemical stability are paramount. 1. An electroless process for depositing a refractory metal , comprising:depositing a sacrificial coating having an electrochemical reduction potential lower than the refractory metal on a surface of a substrate; andimmersing the coated substrate in a solution containing dissolved refractory metal ions, whereby the sacrificial coating is oxidized and the dissolved refractory metal ions are reduced onto the surface of the substrate to provide a refractory metal-containing coating on the surface.2. The process of claim 1 , wherein the refractory metal comprises tungsten.3. The process of claim 1 , wherein the refractory metal comprises molybdenum claim 1 , niobium claim 1 , or tantalum.4. The process of claim 1 , wherein the sacrificial coating comprises zinc.5. The process of claim 1 , wherein the sacrificial coating comprises lithium claim 1 , sodium claim 1 , potassium claim 1 , magnesium claim 1 , or manganese.6. The process of claim 1 , wherein the solution comprises ether.7. The process of claim 6 , wherein the ether comprises diethyl ether.8. The process of claim 6 , wherein the ether comprises a polyether claim 6 , cyclic ether claim 6 , glycol ether claim 6 , tetrahydrofuran claim 6 , or dioxane.9. The process of claim 2 , wherein a salt ...

ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES

Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 μm in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost. 1. A method for forming a conductive trace on a substrate wettable with a volatile liquid , comprising:providing a suspension of nanoparticles in the volatile liquid, the nanoparticles comprising a catalyst for electroless plating;selectively depositing the suspension of nanoparticles in the volatile liquid on the substrate in a pattern, wherein at least a portion of the substrate remains un-wet by the volatile liquid;drying the volatile liquid, to form a pattern of nanoparticles on the substrate; andselectively electroless plating the nanoparticles, to form a conductive metal pattern corresponding to a distribution of the formed pattern of nanoparticles.2. The method according to claim 1 , wherein the substrate comprises at least one of a polyimide sheet and glass.3. The method according to claim 1 , wherein the nanoparticles comprise polydopamine.4. The method according to claim 1 , wherein the suspension of nanoparticles is selectively deposited by a method selected from the group consisting of inkjet printing claim 1 , lithography claim 1 , and a pad printing process.5. The method according to claim 1 , wherein the suspension of nanoparticles is aqueous claim 1 , and is selectively deposited by selectively forming hydrophobic and hydrophilic regions on the substrate ...

SILVER MIRROR FILM, DECORATIVE ARTICLE, SILVER MIRROR FILM-FORMING LIQUID, AND METHOD FOR PRODUCING REDUCING LIQUID THEREFOR

A silver mirror film includes a plurality of silver particles arranged in a film surface direction, a plurality of interparticle silicon particles between the silver particles, and a plurality of surface silicon particles on surfaces of the silver particles so as to at least partially cover the surfaces. The interparticle silicon particles and the surface silicon particles are present as (SiO){x≥1, y≥1, and n≥1}. 1. A silver mirror film comprising a plurality of silver particles arranged in a film surface direction , a plurality of interparticle silicon particles between the silver particles , and a plurality of surface silicon particles on surfaces of the silver particles so as to at least partially cover the surfaces.2. The silver mirror film according to claim 1 , wherein the interparticle silicon particles and the surface silicon particles are present as (SiO){x≥1 claim 1 , y≥1 claim 1 , and n≥1}.3. A decorative article comprising a substrate claim 1 , a silver mirror film formed on the substrate claim 1 , and a top coat layer formed on the silver mirror film claim 1 , whereinthe silver mirror film comprises a plurality of silver particles arranged in a film surface direction, a plurality of interparticle silicon particles between the silver particles, and a plurality of surface silicon particles on surfaces of the silver particles so as to at least partially cover the surfaces.4. The decorative article according to claim 3 , comprising an undercoat layer between the substrate and the silver mirror film.5. A silver mirror film-forming liquid comprising a silver mirror liquid containing ammonia silver nitrate and a reducing liquid containing an aldehyde and a siloxane.6. The silver mirror film-forming liquid according to claim 5 , wherein the silver mirror liquid contains a silver main liquid that is a mixture of water claim 5 , silver nitrate claim 5 , and ammonium hydroxide and a silver sub-liquid that is a mixture of water claim 5 , caustic soda claim 5 , and ...

ELECTROLESS PLATINUM PLATING SOLUTION AND PLATINUM FILM OBTAINED USING SAME

An electroless platinum plating solution is disclosed that can be subjected to plating processing with high deposition efficiency, does not self-decompose even when it does not contain sulfur or heavy metals, and has excellent bath stability, and an electroless platinum plating solution that can suppresses out-of-pattern deposition of platinum and perform platinum plating only on a necessary portion. An electroless platinum plating solution is disclosed that contains a soluble platinum salt, a complexing agent and any of a borohydride compound, an aminoborane compound and a hydrazine compound, and has a pH of 7 or more, adding a specific hydroxymethyl compound represented by the following formula (1) or a salt thereof: 117-. (canceled)18. An electroless platinum plating solution containing a soluble platinum salt , a complexing agent , and a reducing agent that is any of a borohydride compound , an aminoborane compound , and a hydrazine compound , the electroless platinum plating solution having a pH of 7 or more , and containing a specific hydroxymethyl compound represented by a following formula (1) or a salt thereof:{'br': None, 'sup': '1', 'sub': '2', 'R—CH—OH\u2003\u2003(1)'}{'sup': '1', 'wherein Ris an atomic group having an aldehyde group or a ketone group.'}19. The electroless platinum plating solution according to claim 18 , wherein the specific hydroxymethyl compound represented by the formula (1) is a sugar.20. The electroless platinum plating solution according to claim 18 , wherein the specific hydroxymethyl compound represented by the formula (1) is at least one compound selected from the group consisting of ascorbic acid claim 18 , erythorbic acid claim 18 , dehydroascorbic acid claim 18 , dehydroerythorbic acid and diketogulonic acid claim 18 , and salts thereof.21. The electroless platinum plating solution according to claim 18 , wherein the soluble platinum salt is at least one compound selected from the group consisting of tetraammineplatinum (II) ...

ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRIMIDINE DERIVATIVE CONTAINING CATALYSTS

Pyrimidine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants. 2. The method of claim 1 , wherein the one or more pyrimidine derivatives are chosen from uracil claim 1 , barbituric acid claim 1 , orotic acid claim 1 , thymine claim 1 , 2-aminopyrimidine claim 1 , 6-hydroxy-2 claim 1 ,4 claim 1 ,6-triaminopyrimidine claim 1 , 6-methyluracil claim 1 , 2-hydroxypyrimidine claim 1 , 4 claim 1 ,6-dichloropyrimidine claim 1 , 2 claim 1 ,4-dimethoxypyrimidine claim 1 , 2-amino-4 claim 1 ,6-dimethylpyrimidine claim 1 , 2-hydroxy-4 claim 1 ,6-dimethylpyrimidine and 6-methylisocytosine.3. The method of claim 1 , wherein a molar ratio of the one or more pyrimidine derivatives to the metal ions is 1:1 to 4:1.4. The method of claim 1 , wherein the metal ions are chosen from palladium claim 1 , silver claim 1 , gold claim 1 , platinum claim 1 , copper claim 1 , nickel and cobalt.5. The method of claim 1 , wherein the metal on the substrate is copper claim 1 , copper alloy claim 1 , nickel or nickel alloy.6. The method of claim 1 , wherein the aqueous alkaline catalyst solution has a pH of 8.5 or greater.7. The method of claim 6 , wherein the aqueous alkaline catalyst solution has pH of 9 or greater.8. The method of claim 1 , wherein the substrate comprising the dielectric further comprises a plurality of through-holes.9. The method of claim 8 , wherein the substrate comprising the dielectric further comprises metal cladding. The present invention is directed to electroless metallization of dielectrics with alkaline stable monomeric pyrimidine derivative containing catalysts. More specifically, the present invention is directed to metallization of dielectrics with alkaline stable monomeric pyrimidine derivative containing catalysts as a ...

ELECTROLESS PLATING BATH

An object of the present invention is to provide an electroless plating bath having excellent property in plating film deposition without containing halides such as chloride in the electroless plating bath. A halogenfree electroless plating bath of the present invention comprising: 1. A halogen-free electroless plating bath comprisinga water soluble platinum compound ora water soluble palladium compound, anda reducing agent whereinthe water soluble platinum compound is a tetraammine platinum (II) complex salt excluding a halide of the tetraammine platinum (II) complex salt,the water soluble palladium compound is a tetraammine palladium (II) complex salt excluding a halide of the tetraammine palladium (II) complex salt and tetraammine palladium (II) sulfate,the reducing agent is formic acid or its salts, andthe electroless plating bath contains no halide as an additive.2. The halogen-free electroless plating bath according to claim 1 , wherein the tetraammine platinum (II) complex salt is tetraammine platinum (II) hydroxide or tetraammine platinum (II) nitrate.3. The halogen-free electroless plating bath according to claim 1 , wherein the tetraammine palladium (II) complex salt is tetraammine palladium (II) hydroxide or tetraammine palladium (II) nitrate. This application is related to and claims priority under 35 U.S.C. 119 to Japanese Patent Application No. 2018-224984, filed on Nov. 30, 2018, incorporated herein by reference in its entirety.The present invention relates to an electroless plating bath and more precisely a halogen-free electroless plating bath.Plating films are widely used for various electronic parts such as semiconductor circuits and joining terminals. In recent year, platinum (herein after may be called as “Pt”) plating films and palladium (herein after may be called as “Pd”) plating films are widely noticed as substitutes for underlying metal plating for Au plating films. Because Pt plating films and Pd plating films are excellent in diffusion ...

USE OF TITANIA PRECURSOR COMPOSITION PATTERN

A conductive metal pattern can be formed using a titania sol-gel obtained from a titania precursor composition having (a) a titanium alkoxide or titanium aryloxide, (b) a R(O)COCHCO(O)R′ compound wherein R and R′ are independently alkyl and m and n are independently 0 or 1, (c) water, (d) either an acid having a pKless than 1 or a source of a halogen, and (e) a water-miscible organic solvent, on a substrate, wherein the molar amounts of (a) through (d) are sufficient to form a pattern of a titania sol-gel upon drying on the substrate. This pattern is contacted with electroless seed metal ions to form a pattern of electroless seed metal ions deposited within the pattern of titania sol-gel on the substrate, which electroless seed metal ions are exposed to electromagnetic radiation to reduce the electroless seed metal. The article is then subjected to electroless metal plating. 1. A method for forming a conductive metal pattern , comprising:{'sub': m', '2', 'n', 'a, 'forming a pattern of a titania sol-gel formed from a titania precursor composition that comprises: (a) a titanium alkoxide or titanium aryloxide, (b) a R(O)COCHCO(O)R′ compound wherein R and R′ are independently alkyl having at least 1 carbon atom, and m and n are independently 0 or 1, (c) water, (d) either an acid having a pKless than 1 or a source of a halogen, and (e) a water-miscible organic solvent, on a substrate, wherein the molar amounts of (a) through (d) are sufficient to form a pattern of a titania sol-gel upon drying on the substrate,'}contacting the pattern of titania sol-gel with electroless seed metal ions to form a pattern of electroless seed metal ions deposited within the pattern of titania sol-gel on the substrate,exposing the pattern of electroless seed metal ions to electromagnetic radiation to reduce the electroless seed metal ions, thereby forming a pattern of electroless seed metal nuclei within the pattern of titania sol-gel on the substrate, andelectrolessly plating the pattern of ...

Method for metallising a porous structure made of carbon material

Method for metallising a porous structure made of carbon material, the method comprising the following steps: supplying a porous structure made of carbon material, immersing the porous structure in a solution comprising an ionic liquid, formed by a cation and an anion, and a metal precursor, placing the porous structure in a vacuum, immersed in the solution, in such a way as to cause the solution to penetrate into the porosity of the porous structure, adding a hydrogenated reducing agent, in such a way as to metallise the porous structure to within the porosity of the porous structure.

Method of forming asper-silver on a lead frame

A method for plating a lead frame comprises the steps of plating the lead frame with at least one plating layer including silver and forming an asper-silver layer comprising nano-silver formations over the at least one plating layer including silver. The asper-silver layer is particularly beneficial for enhancing the adhesion of plastic molding compound to the lead frame.

ELECTROLESS PLATING METHOD AND CERAMIC SUBSTRATE

An electroless plating method for a low temperature co-fired glass ceramic substrate includes: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating treatment step of forming a multi-layered electroless plating coating on the surface of the wiring pattern formed of a silver sintered body. The method further includes, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, and the catalyzing step includes providing the catalyst also to the silver precipitated in the silver precipitation treatment step. 1. A glass ceramic substrate , comprising an insulating base material formed of glass ceramic , and a wiring pattern formed of a silver sintered body ,precipitated silver being scattered in a particulate form on a glass component present on a surface of the wiring pattern formed of a silver sintered body,a nickel plating coating being formed on the wiring pattern formed of a silver sintered body including the glass component and the silver scattered on the glass component,a palladium plating coating being formed on the nickel plating coating,a gold plating coating being formed on the palladium plating coating.2. A glass ceramic substrate , comprising an insulating base material formed of glass ceramic , and a wiring pattern formed of a silver sintered body ,precipitated silver being scattered in a particulate form on a glass component present on a surface of the wiring pattern formed of a silver sintered body,a nickel plating coating being formed on the wiring pattern formed of a silver sintered ...

NANO METAL FILM DEPOSITION

Devices, systems, and methods are contemplated for depositing metals to the surface of a substrate. A first precursor ink including a metal is applied to a surface of the substrate, and the precursor ink is reduced to deposit the metal to the substrate, preferably by thermal reduction, forming a first metal layer. A second precursor ink having a second metal is then applied to the substrate, at least partially over the first metal layer. The second precursor ink is then reduced, typically by chemical reduction, depositing the second metal over the first metal layer in a globular fashion. Precursor inks are also disclosed having an alkyl metal carboxylate, a cyclic amine, and at least one of an ester, a hydrocarbon, or an ether. 1. A method for depositing a metal on a substrate , comprising:applying a first precursor ink comprising the metal over at least a portion of the substrate; andreducing at least a portion of the first precursor ink on the substrate to deposit the metal on the substrate, wherein the first precursor ink comprises an alkyl metal carboxylate, an amine, and a hydrophobic solvent.2. The method of claim 1 , wherein the hydrophobic solvent includes at least an ester claim 1 , a hydrocarbon claim 1 , an ether claim 1 , or mixture of these.3. The method of claim 1 , wherein the portion of the first precursor ink is reduced by a thermal reaction or a chemical reaction.4. The method of claim 1 , wherein the alkyl metal carboxylate comprises the metal.5. The method of claim 1 , wherein the alkyl metal carboxylate comprises a Calkyl.6. The method of claim 1 , wherein the metal is at least one of palladium claim 1 , platinum claim 1 , gold claim 1 , silver claim 1 , copper claim 1 , nickel claim 1 , cobalt claim 1 , rhodium claim 1 , ruthenium claim 1 , iridium claim 1 , tungsten claim 1 , molybdenum claim 1 , rhenium claim 1 , osmium claim 1 , an alloy or a mixture thereof.7. The method of claim 1 , wherein the metal of the alkyl metal carboxylate is at ...

ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER

A method for providing an electroless plating of a platinum containing layer is provided. A Tistabilization solution is provided. A Ptstabilization solution is provided. A flow from the Tistabilization solution is combined with a flow from the Ptstabilization solution and water to provide a diluted mixture of the Tistabilization solution and the Pt stabilization solution. A substrate is exposed to the diluted mixture of the Tistabilization solution and the Ptstabilization solution. 1. A method for providing an electroless plating of a platinum containing layer , comprising:{'sup': '3+', 'providing a Tistabilization solution;'}{'sup': '4+', 'providing a Ptstabilization solution;'}{'sup': 3+', '4+', '3+', '4+, 'combining a flow from the Tistabilization solution with a flow from the Pt stabilization solution and water to provide a diluted mixture of the Tistabilization solution and the Ptstabilization solution; and'}{'sup': 3+', '4+, 'exposing a substrate to the diluted mixture of the Tistabilization solution and the Pt stabilization solution.'}2. The method claim 1 , as recited in claim 1 , wherein exposing the wafer to the diluted mixture of the Tistabilization solution and the Ptstabilization solution claim 1 , comprises:providing a solution temperature between 10° to 40° C., inclusive; andproviding a pH of between 6 to 10, inclusive.3. The method claim 2 , as recited in claim 2 , wherein exposing the wafer to the diluted mixture of the Tistabilization solution and the Ptstabilization solution provides Tiwith a concentration between 25-75 mM.4. The method claim 3 , as recited in claim 3 , further comprising disposing the diluted mixture.5. The method claim 4 , as recited in claim 4 , wherein the platinum containing layer is 99.9% pure platinum.6. The method claim 3 , as recited in claim 3 , further comprising reactivating the diluted mixture.7. The method claim 3 , as recited in claim 3 , wherein the Tistabilization solution comprises a solution of TiCland HCl.8. ...

REDUCTIVE ELECTROLESS GOLD PLATING SOLUTION, AND ELECTROLESS GOLD PLATING METHOD USING THE PLATING SOLUTION

The present invention has an object to provide an electroless gold plating solution capable of suppressing the corrosion of a substrate metal and realizing excellent wire bondability, and containing no hazardous substance. In order to achieve the object, as a reductive electroless gold plating solution used for formation of an electroless plated gold film on a surface of a plating target by electroless plating, an electroless plating solution containing a water-soluble gold compound, citric acid or a citrate salt, ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate salt, hexamethylenetetramine, and a chain polyamine having an alkyl group having 3 or more carbon atoms and 3 or more amino groups is adopted. 1. A reductive electroless gold plating solution used for formation of an electroless plated gold film on a surface of a plating target , comprising:a water-soluble gold compound; citric acid or a citrate salt; ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate salt; hexamethylenetetramine; and a chain polyamine having an alkyl group having 3 or more carbon atoms and 3 or more amino groups.2. The reductive electroless gold plating solution according to claim 1 , wherein the gold plating solution has a pH of 7.0 to a pH of 9.0.3. The reductive electroless gold plating solution according to claim 1 , wherein the chain polyamine is 3 claim 1 ,3′-diamino-N-methyldipropylamine or N claim 1 ,N′-bis(3-aminopropyl)ethylenediamine.4. The reductive electroless gold plating solution according to claim 1 , comprising a thallium compound as a deposition accelerator.5. A method of electroless gold plating claim 1 , comprising forming an electroless plated gold film on a surface of a plating target using the reductive electroless gold plating solution according to .6. The method of electroless gold plating according to claim 5 , wherein one of copper claim 5 , palladium claim 5 , gold and nickel is present on the surface of the plating target.7. The ...

Method for forming a metal film, and nanoimprint lithography material

The present invention is to solve the problem of residues in nanoimprint lithography without losing the merits thereof, i.e., low cost and high productivity, and provides a metal film formation technique advantageous in pattern accuracy and product reliability over time. A metal film formation method according to the present invention comprises a first step where a nanoimprint lithography material is deposited on an insulating substrate to form an underlayer, a second step where the underlayer is pressed with a mold having protrusions to pattern by nanoimprint lithography, a third step where residues of the underlayer at regions pressed with the protrusions of the mold are evaporated by heating to be removed, and forming a metal film at least on the patterned underlayer. A nanoimprint lithography material according to the present invention contains a catalyst for a metal plating.

Metallic Nanoparticle Synthesis with Carbohydrate Capping Agent

The disclosure relates to metal nanoparticle compositions and their methods of formation and use, in particular gold nanoparticles (AuNP) and gold-coated magnetic nanoparticles. Compositions according to the disclosure include aqueous suspensions of metal nanoparticles that are stabilized with one or more carbohydrate capping agents and/or that are functionalized with one or more binding pair members for capture/detection of a target analyte. The nanoparticle suspensions are stable for extended periods and can be functionalized as desired at a later point in time, typically prior to use in an assay for the detection of a target biological analyte. The stable nanoparticle suspension can be formed by the aqueous reduction of oxidized metal precursors at non-acidic pH values in the presence of a carbohydrate-based capping agent such as dextrin or other oligosaccharides. 1. A method for detecting a target analyte , the method comprising:(a) providing a functionalized, stabilized metal nanoparticle comprising: (i) a metal nanoparticle, (ii) a carbohydrate capping agent present as a layer on an outer surface of the metal nanoparticle, and (iii) a binding pair member (A) immobilized on the outer surface of the metal nanoparticle and (B) capable of binding to a target analyte;(b) forming an analyte-nanoparticle conjugate between a target analyte and the binding pair member of the functionalized stabilized metal nanoparticle; and(c) detecting a metal component of the metal nanoparticle of the analyte-nanoparticle conjugate.2. The method of claim 1 , wherein part (c) comprises electrochemically detecting the metal component of the metal nanoparticle in the presence of the carbohydrate capping agent.3. The method of claim 1 , wherein (i) the analyte-nanoparticle conjugate further comprises a magnetic moiety and (ii) the method further comprises magnetically separating the analyte-nanoparticle conjugate from a sample matrix in which the analyte-nanoparticle conjugate is formed ...

Silver-coated copper powder and method for producing same

There is provided a silver-coated copper powder, which has excellent storage stability (reliability), and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a gold plating solution, which is a potassium gold cyanide solution (to which at least one of tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is preferably added), to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of gold to be supported on the surface of the copper powder coated with the silver containing layer.

SUBSTRATE HAVING AN ELECTRON DONATING SURFACE WITH METAL PARTICLES COMPRISING PALLADIUM ON SAID SURFACE

There is disclosed a substrate with an electron donating surface, characterized in having metal particles on said surface, said metal particles comprising palladium and at least one metal selected from the group consisting of gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of said metal particles is from about 0.001 to about 8 μg/cm. Examples of coated objects include contact lenses, pacemakers, pacemaker electrodes, stents, dental implants, rupture nets, rupture mesh, blood centrifuge equipment, surgical instruments, gloves, blood bags, artificial heart valves, central venous catheters, peripheral venous catheters, vascular ports, haemodialysis equipment, peritoneal dialysis equipment, plasmapheresis devices, inhalation drug delivery devices, vascular grafts, arterial grafts, cardiac assist devices, wound dressings, intermittent catheters, ECG electrodes, peripheral stents, bone replacing implants, orthopaedic implants, orthopaedic devices, tissue replacing implants, intraocular lenses, sutures, needles, drug delivery devices, endotracheal tubes, shunts, drains, suction devices, hearing aid devices, urethral medical devices, and artificial blood vessels. 126-. (canceled)27. A surgical method comprising the step of inserting an implant into a patient , wherein said implant at least partially comprises an electron donating surface , wherein there are metal particles on said electron donating surface , said metal particles comprising palladium and at least one metal selected from the group consisting of gold , ruthenium , rhodium , osmium , iridium , and platinum and wherein the amount of said metal particles is from about 0.001 to about 8 μg/cm2.28. The method according to claim 27 , wherein said electron donating surface is a layer of silver which is applied in an amount of about 0.05 to about 12 μg/cm2.29. The method according to claim 27 , wherein said implant comprises a polymer.30. The method according to claim 29 , wherein said ...

PLATING BATH COMPOSITION FOR ELECTROLESS PLATING OF GOLD AND A METHOD FOR DEPOSITING A GOLD LAYER

An electroless aqueous gold plating bath, comprising at least one source of gold ions and at least one reducing agent for gold ions, characterized in that it comprises at least one ethylenediamine derivative as plating enhancer compound according to formula (I) 2. The electroless aqueous gold plating bath according to characterised in that the residues Rand Rin formula (I) comprise 2 to 8 carbon atoms.3. The electroless aqueous gold plating bath according to characterised in that the residues Rand Rin formula (I) are the same.4. The electroless aqueous gold plating bath according to characterised in that the residues Rand Rin formula (I) are free of any further amino moieties and/or any hydroxy moieties.5. The electroless aqueous gold plating bath according to characterised in that the residues Rand Rin formula (I) are branched alkyl residues having 3 to 6 carbon atoms.6. The electroless aqueous gold plating bath according to characterised in that the concentration of the at least one plating enhancer compound according to formula (I) ranges from 0.001-1 mol/L.7. The electroless aqueous gold plating bath according to characterised in that the concentration of the at least one plating enhancer compound according to formula (I) ranges from 10 to 100 mmol/L.8. The electroless aqueous gold plating bath according to characterised in that the at least one reducing agent for gold ions is selected from the group consisting of aliphatic aldehydes claim 1 , aliphatic dialdehydes claim 1 , aliphatic unsaturated aldehyde claim 1 , aromatic aldehydes claim 1 , sugars having an aldehyde group and precursors of formaldehyde.9. The electroless aqueous gold plating bath according to characterised in that the molar ratio of reducing agent to plating enhancer compound according to formula (I) ranges from 0.8 to 3.10. The electroless aqueous gold plating bath according to characterised in that the pH of the electroless aqueous gold plating bath ranges from 5 to 9.11. The electroless ...

COMPOUND, SUBSTRATE FOR PATTERN FORMATION, PHOTODEGRADABLE COUPLING AGENT, PATTERN FORMATION METHOD, AND TRANSISTOR PRODUCTION METHOD

A compound represented by Formula (1). [In the formula, X represents a halogen atom or an alkoxy group, Rrepresents any one group selected from an alkyl group having 1 to 5 carbon atoms, a group represented by Formula (R2-1), and a group represented by Formula (R2-2), Rrepresents a group represented by Formula (R2-1) or (R2-2), n0 represents an integer of 0 or greater, n1 represents an integer of 0 to 5, and n2 represents a natural number of 1 to 5.] 2. The compound according to claim 1 ,{'sup': 21', '22, 'wherein Ror Rrepresents any of a methyl group, an isopropyl group, or a tert-butyl group.'}3. A substrate for pattern formation claim 1 , which has a surface chemically modified by the compound according to .4. A photodegradable coupling agent formed of the compound according to .5. A pattern formation method of forming a pattern on a surface of an object to be treated claim 1 , the method comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'chemically modifying the surface to be treated using the compound according to ;'}irradiating the chemically modified surface to be treated with light having a predetermined pattern to generate a latent image formed of a hydrophilic region and a water-repellent region; anddisposing a pattern-forming material in the hydrophilic region or the water-repellent region.6. The pattern formation method according to claim 5 ,wherein the predetermined pattern corresponds to a circuit pattern for an electronic device.7. The pattern formation method according to claim 5 ,wherein the pattern-forming material contains a conductive material, a semiconductor material, or an insulating material.8. The pattern formation method according to claim 7 ,wherein the conductive material is formed of a conductive fine particle dispersion liquid.9. The pattern formation method according to claim 7 ,wherein the semiconductor material is formed of an organic semiconductor material dispersion liquid.10. A pattern formation method of forming a ...

Silver plating in electronics manufacture

Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.

Method for directly depositing palladium onto a non-activated surface of a gallium nitride semiconductor

The present invention relates to a method for directly depositing palladium onto a non-activated surface of a gallium nitride semiconductor, the use of an acidic palladium plating bath (as defined below) for directly depositing metallic palladium or a palladium alloy onto a non-activated surface of a doped or non-doped gallium nitride semiconductor, and a palladium or palladium alloy coated, doped or non-doped gallium nitride semiconductor.

Palladium Plating Solution And Plating Method

The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound; one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound. 1. A palladium plating solution for improving a bath stability , without decreasing a deposition property , comprising:an aqueous palladium compound;one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton;a formic acid or a formate; anda sulfur compound,wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.2. The palladium plating solution according to claim 1 , wherein the sulfur compound is a compound represented by a general formula in below.{'br': None, 'sub': 2', 'x', '2', 'y', '2', 'z, 'R1-(CH)—S—(CH)—S—(CH)—R2'} 'R1 or R2 is a functional group selected from —OH, —COOH, —CN', 'wherein x=1 to 4, y=1 to 3, z=1 to 4,'}3. The palladium plating solution according to claim 1 , wherein a concentration of the sulfur compound is 0.01 mg/L to 50 mg/L.4. The palladium plating solution according to claim 1 , wherein a concentration of the complexing agent is 0.5 g/L to 25 g/L.6. A plating method using a palladium plating solution for improving a bath stability claim 1 , without decreasing a deposition property claim 1 , comprisinga palladium plating step for applying a palladium plating on a surface of an underlying metal,wherein a plating solution used for applying the palladium plating comprises: an aqueous ...

GOLD PLATE COATED MATERIAL

A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B. 1. A gold plate coated material comprising:a base material;an underlying alloy layer formed on the base material; anda gold plate layer formed on the underlying alloy layer, whereinthe underlying alloy layer is formed of an M1-M2-M3 alloy, andwhere M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B.2. The gold plate coated material as set forth in claim 1 , wherein a ratio of each element in the M1-M2-M3 alloy is that M1 is 20 to 50 at. % claim 1 , M2 is 30 to 50 at. % claim 1 , and M3 is 20 to 30 at. %.3. The gold plate coated material as set forth in claim 1 , further comprising a modifying layer which is formed on the base material in order to enhance the interfacial adhesion property between the base material and the underlying alloy layer.4. The gold plate coated material as set forth in claim 1 , wherein the thickness of the underlying alloy layer is 0.01 to 1.0 μm.5. The gold plate coated material as set forth in claim 1 , wherein the thickness of the gold plate layer is 1 to 200 nm. This application is a Divisional of co-pending application Ser. No. 14/414,655 filed on Jan. 13, 2015, which is a U.S. National Stage of International Application No. PCT/JP2013/068956 filed on Jul. 11, 2013, for which priority is claimed under 35 U.S.C. §120; and this application claims priority of Application No. 2012-157180 ...

ELECTROLESS PALLADIUM PLATING SOLUTION, AND ELECTROLESS PALLADIUM PLATED COATING

An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention solved above problems, the solution includes a Palladium compound, at least one selected from a group consisting of a hypophosphorous acid compound and a phosphorous acid compound, at least one selected from the group consisting of an amine borane compound and a hydroboron compound, and a complexing agent. 1. An electroless Pd plating solution comprising:a Palladium compound;at least one selected from a group consisting of a hypophosphorous acid compound and a phosphorous acid compound;at least one selected from the group consisting of an amine borane compound and a hydroboron compound; anda complexing agent.2. The electroless Pd plating solution according to wherein claim 1 ,the amine borane compound is at least one selected from a group consisting of dimethylamine borane and trimethylamine borane; andthe hydroboron compound is borohydride salt3. The electroless Pd plating solution according to wherein claim 1 ,the complexing agent is at least one selected from a group consisting of ammonia and an amine compound.4. An electroless Pd plating film including phosphorus and boron.5. A laminated film comprising:{'claim-ref': {'@idref': 'CLM-00004', 'claim 4'}, 'the electroless Pd plating film according to ;'}a gold plating film formed on a surface of the electroless Pd plating film.6. An electronic equipment component comprising:{'claim-ref': {'@idref': 'CLM-00004', 'claim 4'}, 'the electroless Pd plating film according to .'}7. The electroless Pd plating solution according to wherein claim 2 ,the complexing agent is at least one selected from a group consisting of ammonia and an amine compound.8. An electronic equipment component comprising:{'claim-ref': {'@idref': 'CLM-00005', ' ...

Silver-containing compositions containing reactive polymers

Silver-containing compositions contain a water-soluble complex of a reactive polymer with either reducible silver ions or silver nanoparticles, the reactive polymer comprising: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphoric acid, or carboxylic acid group, all amounts based on the total recurring units in the reactive polymer. Other silver-containing compositions contain a water-insoluble complex of a reacted polymer with either reducible silver ions or silver nanoparticles. The reacted polymers are derived from the reactive polymers.

MULTI-FUNCTIONALIZED CARBON NANOTUBES

The present invention relates to a method of manufacturing coated carbon nanotubes, the method comprising the steps of: functionalizing the carbon nanotubes in a solvent comprising a silane polymer; coating the carbon nanotubes with a SiOlayer; depositing metal catalyst particles on the SiOlayer of the carbon nanotubes; and performing electroless plating to form an Ag coating on the SiOlayer of the carbon nanotubes. The invention also relates Ag-coated CNTs, and to the use of Ag-coated CNTs as interconnects in a flexible electronic film.

Silver Coated Copper Flakes and Methods of Their Manufacture

Compositions having copper flakes coated with silver, where the silver is present as a hermetically closed metal shell around the copper, are described. The hermetically closed metal shell can limit oxidation of copper for at least 365 days at a temperature of less than 100° C. The composition can also contain palladium in an amount of about 1% or less by weight of silver in the shell. Palladium limits the migration of copper from the core flakes to the silver shell at temperatures below 250° C. Methods of manufacturing copper flakes coated can include the steps of treating copper flakes with an acid to form acid treated copper flakes, treating the acid treated copper flakes with a polyamine to form polyamine treated copper flakes, depositing silver on the polyamine treated copper flakes to form copper flakes comprising silver deposits, and depositing silver onto the copper flakes comprising silver deposits.

METHOD TO PRODUCE NOBLE METAL NANOCOMPOSITES

The method for producing noble metal nanocomposites involves reducing noble metal ions (Ag, Au and Pt) on graphene oxide (GO) or carbon nanotubes (CNT) by using leaves extract as a reducing agent. As synthesized MNPs/GO and MNPs/CNT composites have been characterized using X-ray diffraction (XRD), transmission electron microscope (TEM) imaging, and energy dispersive X-ray spectroscopy (EDX). The TEM images of prepared materials showed that the nanocomposites were 1-30 nm in size with spherical nanoparticles embedded on the surface of GO and CNT. This synthetic route is easy and rapid for preparing a variety of nanocomposites. The method avoids use of toxic chemicals, and the prepared nanocomposites can be used for biosensor, fuel cell, and biomedical applications. 1. A method for producing noble metal nanocomposites , comprising the steps of:functionalizing carbon nanotubes;preparing an aqueous solution of the functionalized carbon nanotubes;adding an aqueous solution of a salt of a noble metal to the solution of the functionalized carbon nanotubes to form a complex of the functionalized carbon nanotubes and the noble metal ion in aqueous solution; and{'i': 'Artocarpus integrifolia', 'reducing the noble metal ion on the carbon nanotubes by adding an extract of leaves to the aqueous solution of the noble metal ion-functionalized carbon nanotubes complex, thereby forming a composite of nanoparticles of the reduced noble metal on the functionalized carbon nanotubes the nanoparticles being embedded on a surface of the carbon nanotubes.'}2. (canceled)3. The method for producing noble metal nanocomposites according to claim 1 , wherein the carbon nanotubes are functionalized by oxidation in an acid claim 1 , the oxidation including refluxing the carbon nanotubes with the acid.4. The method for producing noble metal nanocomposites according to claim 1 , wherein the noble metal is selected from the group consisting of platinum claim 1 , gold claim 1 , and silver.5. The ...

ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEXED Co2+ METAL ION REDUCING AGENT

A solution for electroless deposition of platinum is provided. The solution comprises Coions, Ptions, and amine ligands. A ratio of Co to Pt ion is between 100:1 and 2:1. The solution allows for electroless deposition of platinum without requiring high temperatures and high pH. The solution allows for the deposition of a pure platinum layer. 1. A solution for electroless deposition of platinum , comprising:{'sup': '2+', 'Co ions;'}{'sup': '4+', 'Pt ions; and'}amine ligands.2. The solution claim 1 , as recited in claim 1 , wherein the solution has a pH between 6 and 11 claim 1 , inclusive and a ratio of Co to Pt ion is between 100:1 and 2:1.3. The solution claim 2 , as recited in claim 2 , further comprising Cl ions.4. The solution claim 3 , as recited in claim 3 , wherein the concentration of Co ions is 1-500 mM.5. The method claim 1 , as recited in claim 1 , wherein the solution is boron claim 1 , phosphorus claim 1 , hydrazine claim 1 , and formaldehyde free.6. A method for providing an electroless plating of a platinum containing layer claim 1 , comprising:{'sup': '2+', 'providing a Co concentrated stock solution;'}{'sup': '4+', 'providing a Pt concentrated stock solution;'}{'sup': 2+', '4+', '2+', '4+, 'combining a flow from the Co concentrated stock solution with a flow from the Pt concentrated stock solution and water to provide a mixed electrolyte solution of the Co concentrated stock solution and the Pt concentrated stock solution; and'}{'sup': 2+', '4+, 'exposing a substrate to the mixed electrolyte solution of the Co concentrated stock solution and the Pt concentrated stock solution.'}7. The method claim 6 , as recited in claim 6 , wherein exposing the wafer to the mixed electrolyte solution of the Co concentrated stock solution and the Pt concentrated stock solution claim 6 , comprises:providing a solution temperature between 10° to 40° C., inclusive; andproviding a pH of between 6 and 11, inclusive.8. The method claim 7 , as recited in claim 7 , wherein ...

CONTROLLED GROWTH OF ULTRANARROW NANOWIRES ON FUNCTIONALIZED 2D MATERIALS AND USES THEREOF

The present invention generally relates to a method for preparing structurally unique nanomaterials and the products thereof. In particular, the present invention discloses a method for preparing ultra-narrow nanowire or nanorod on a patterned monolayer or thin film supported by a 2D material substrate in a nonpolar environment, wherein said pattered monolayer or thin film comprises a polymerizable phospholipid with a terminal amine. A gold nanowire or nanorod so prepared has a highly controlled diameter of about 2 nm, and a length about 1000 nm, dependent in part on molecular domain sizes in the monolayer. 1. A method for preparing an ultra-narrow nanowire or nanorod on a non-covalently functionalized supporting 2D material substrate comprising the steps ofa. preparing a supporting 2D material substrate;b. functionalizing said supporting 2D material substrate by preparing a monolayer or thin film comprising the step of assembling a polymerizable amphiphile comprising both hydrophobic and hydrophilic constituents on said supporting 2D material substrate, and then polymerizing said amphiphile to afford said monolayer or thin film;c. preparing a salt solution or suspension; andd. growing an ultra-narrow nanowire or nanorod by exposing the salt solution or suspension to said monolayer or thin film on said supporting 2D material substrate.2. The method of claim 1 , wherein said salt is a metal salt.3. The method of claim 2 , wherein said metal salt is a gold or silver salt.4. The method of claim 1 , wherein said salt solution or suspension comprises a non-polar solvent or a mixture thereof.5. The method of claim 1 , wherein said salt solution or suspension comprises a cyclohexane solvent mixed with oleylamine claim 1 , triisopropylsilane and a gold salt.6. The method of claim 5 , wherein said gold salt is HAuCl.3HO.7. The method of claim 5 , wherein said cyclohexane solution comprises about 1-1000 mM of oleylamine.8. The method of claim 5 , wherein said cyclohexane ...

METHOD FOR PRODUCING NOBLE METAL NANOCOMPOSITES

The method for producing noble metal nanocomposites involves reducing noble metal ions (Ag, Au and Pt) on graphene oxide (GO) or carbon nanotubes (CNT) by using integer leaves extract as a reducing agent. As synthesized MNPs/GO and MNPs/CNT composites have been characterized using X-ray diffraction (XRD), transmission electron microscope (TEM) imaging, and energy dispersive X-ray spectroscopy (EDX). The TEM images of prepared materials showed that the nanocomposites were 1-30 nm in size with spherical nanoparticles embedded on the surface of GO and CNT. This synthetic route is easy and rapid for preparing a variety of nanocomposites. The method avoids use of toxic chemicals, and the prepared nanocomposites can be used for biosensor, fuel cell, and biomedical applications. 110-. (canceled)11. A method for producing noble metal nanocomposites , comprising the steps of:preparing an aqueous solution of graphene oxide;adding an aqueous solution of a salt of a noble metal to the solution of the graphene oxide to form a complex of the graphene oxide and the noble metal ion in aqueous solution; and{'i': 'Artocarpus integrifolia', 'adding an extract of leaves to the aqueous solution of the noble metal ion-graphene oxide complex in order to reduce the noble metal ion, thereby forming a composite of nanoparticles of the reduced noble metal embedded on the graphene oxide and having a particle size between 1 nm and 30 nm.'}12. A platinum-graphene oxide nanocomposite prepared according to the method of .13. (canceled)14. A gold-graphene oxide nanocomposite prepared according to the method of .15. (canceled)16. A silver-graphene oxide nanocomposite prepared according to the method of .17. (canceled)18. The method for producing noble metal nanocomposites according to claim 11 , wherein the noble metal is selected from the group consisting of platinum claim 11 , gold claim 11 , and silver.19. The method for producing noble metal nanocomposites according to claim 11 , wherein the ...

ANTI-MULTIPACTOR DEVICE

The invention relates to anti-multipactor coating deposited onto a substrate that can be exposed to the air and its procedure of obtainment by simple chemical methods. Furthermore, the present invention relates to its use for the fabrication of high power devices working at high frequencies. 1. Anti-multipactor coating deposited onto a substrate characterized in that{'sup': 7', '−1, 'it comprises at least two contacting high conductive metal layers with an electrical conductivity greater than 4×10S·m,'}it has a secondary electron emission yield below 1 in air, between 0.4 and 0.9 for a incident electron energy range between 0 and 5000 eV,it has a final surface roughness with a grooves aspect ratio greater than 4, with a surface grooves density greater than 70%,and it has a insertion loss of between 0.1 and 0.14 dB, wherein the substrate consists of a metal or a mixture of metals.2. Anti-multipactor coating according to claim 1 , wherein the substrate consists of a metal or a mixture of metals selected from Ni doped with P claim 1 , Al claim 1 , Cu and Ag.3. Anti-multipactor coating according to any of or claim 1 , wherein the high conductive metal of each layer is selected independently from Ag and Cu.4. A process of obtainment of the anti-multipactor coating deposited onto a substrate according to any of to claim 1 , wherein the process comprises at least the following steps:{'sup': 7', '−1, 'a) deposition of a high conductive metal layer, with an electrical conductivity greater than 4×10S·m, onto a substrate,'}{'sup': 7', '−1, 'b) etching of the deposited high conductive metal layer of step a) by an acid dissolution, c) activating of the etched layer obtained in step b), and d) electroless plating of a high conductive metal, of an electrical conductivity greater than 4×10S·m, onto the activated etched layer obtained in step c) using a solution of high conductive metal ions and a reducing agent.'}5. The process of obtainment claim 1 , according to the previous ...

Method for Producing Patterned Metallic Coatings

A method for producing patterned metallic coatings, includes an initiator composition having at least one active substance being added to a substrate. A precursor composition including at least one precursor compound for a metallic layer is applied to the initiator composition coating. A metallic layer is then deposited by the active substance. At least one composition is applied as an emulsion in order to obtain a patterning of the resultant metallic layer.

METHOD FOR PRODUCING NOBLE METAL NANOCOMPOSITES

The method for producing noble metal nanocomposites involves reducing noble metal ions (Ag, Au and Pt) on graphene oxide (GO) or carbon nanotubes (CNT) by using leaves extract as a reducing agent. As synthesized MNPs/GO and MNPs/CNT composites have been characterized using X-ray diffraction (XRD), transmission electron microscope (TEM) imaging, and energy dispersive X-ray spectroscopy (EDX). The TEM images of prepared materials showed that the nanocomposites were 1-30 nm in size with spherical nanoparticles embedded on the surface of GO and CNT. This synthetic route is easy and rapid for preparing a variety of nanocomposites. The method avoids use of toxic chemicals, and the prepared nanocomposites can be used for biosensor, fuel cell, and biomedical applications. 1. A method for producing noble metal nanocomposites , comprising the steps of:functionalizing carbon nanotubes;preparing an aqueous solution of the functionalized carbon nanotubes;adding an aqueous solution of a salt of a noble metal to the solution of the functionalized carbon nanotubes to form a complex of the functionalized carbon nanotubes and the noble metal ion in aqueous solution; and{'i': 'Artocarpus integer', 'reducing the noble metal ion on the carbon nanotubes by adding an extract of leaves to the aqueous solution of the noble metal ion-functionalized carbon nanotubes complex, thereby forming a composite of nanoparticles of the reduced noble metal on the functionalized carbon nanotubes, the nanoparticles being embedded on a surface of the carbon nanotubes.'}2. The method for producing noble metal nanocomposites according to claim 1 , wherein the carbon nanotubes are functionalized by oxidation in an acid claim 1 , the oxidation including refluxing the carbon nanotubes with the acid.3. The method for producing noble metal nanocomposites according to claim 1 , wherein the noble metal is selected from the group consisting of platinum claim 1 , gold claim 1 , and silver.4. The method for producing ...

Electroless gold plating bath

wherein R1, R2, and R3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.

ELECTROLESS PLATING METHOD AND ELECTROLESS PLATING FILM

An electroless plating method of an embodiment includes: a step of preparing a catalyst solution containing titanium alkoxide, a copper ion, a naphthoquinonediazide esterification product, and methoxyethoxyacetic acid; a step of coating a substrate with the catalyst solution; a step of patterning the coating film; a step of converting the coating film to a catalyst precursor film; a step of immersing the catalyst precursor film in a reducing agent-containing aqueous solution to reduce the copper ion to metal; and a step of forming an electroless copper plating film. 1. An electroless plating method comprising:a solution preparation step of preparing a catalyst solution containing titanium alkoxide, a copper ion, a derivative of an ortho-benzenediol in which a substituent is introduced into a carbon atom of a 4-position of the ortho-benzenediol, a naphthoquinonediazide esterification product, methoxyethoxyacetic acid, and a silane coupling agent;a coating step of coating a substrate with the catalyst solution to form a coating film;a patterning step of patterning the coating film by a photolithography method;a curing step of converting the coating film to a catalyst precursor film, wherein the titanium alkoxide of the coating film is thermally decomposed to titanium oxide;a reduction step of immersing the catalyst precursor film in a reducing agent-containing aqueous solution to reduce the copper ion to metal copper; anda plating step of forming an electroless copper plating film.2. An electroless plating method comprising:a solution preparation step of preparing a catalyst solution containing an organic compound of a first metal that does not serve as a catalyst of an electroless plating reaction, an ion of a second metal that serves as a catalyst of the electroless plating reaction, an organic compound that forms a complex with the first metal and the second metal, and a photosensitive compound;a coating step of coating a substrate with the catalyst solution to ...

DEVICE FOR ELECTROLESS METALLIZATION OF A TARGET SURFACE OF AT LEAST ONE WORKPIECE

An assembly for electroless metallization of a target surface () of at least one workpiece (), comprising—a container () for receiving an electrolyte solution—an inlet for the electrolyte solution, said inlet arranged in the base () of the container (), wherein the inlet () is designed as an inlet port () with a diffuser plate () comprising inlet openings () arranged in concentric circles—an outlet () which is arranged on an upper side of the container ()—a receiving area for holding the at least one workpiece (), wherein the diffuser plate () is formed as a first assembly () and a second assembly (), which is identical to the first assembly, of a respective plurality of inlet openings (), wherein the assemblies at least partially but not completely overlap, and the inlet () has at least two inlet ports ().

MANUFACTURING METHOD OF TEST STRIP

A manufacturing method including the steps of: providing a substrate, whereby a masking layer is formed on one surface of the substrate; carrying out a patterning manufacturing process, whereby a patterning is formed on the masking layer, and a section covered with the masking layer and an exposed section not covered with the masking layer are formed on the surface of the substrate; forming an ion guide on the surface of the exposed section of the substrate; carrying out a first chemical plating, whereby a first metal layer is formed on the surface of the ion guide; stripping the masking layer, whereby the masking layer is removed from the surface of the substrate; carrying out a second chemical plating, whereby a second metal layer is formed on the surface of the first metal layer, which is used to form a line metal patterning, and thus producing a test strip. 1. A manufacturing method of test strip , comprising the following steps:a) providing a substrate;b) forming a masking layer on one surface of the substrate;c) carrying out a patterning manufacturing process to form a patterning on the masking layer, whereby a section covered with the masking layer and an exposed section not covered with the masking layer is formed on the surface of the substrate;d) forming an ion guide on the surface of the exposed section of the substrate;e) carrying out a first chemical plating, whereby a first metal layer is formed on the surface of the ion guide;f) stripping the masking layer, whereby the masking layer is removed from the surface of the substrate; andg) carrying out a second chemical plating, whereby a second metal layer is formed on the surface of the first metal layer.2. The manufacturing method of test strip according to claim 1 , wherein the substrate is provided with a modified surface claim 1 , and the masking layer is disposed on the modified surface.3. The manufacturing method of test strip according to claim 2 , wherein a surface modifier is used to carry out ...

ELECTROLESS PLATING OF SILVER ONTO GRAPHITE

A one-pot process for the electroless-plating of silver onto graphite powder is disclosed. No powder pretreatment steps for the graphite, which typically require filtration, washing or rinsing, are required. The inventive process comprises mixing together three reactant compositions in water: an aqueous graphite activation composition comprising graphite powder and a functional silane, a silver-plating composition comprising a silver salt and a silver complexing agent, and a reducing agent composition. 19.-. (canceled)10. An aqueous electroless plating composition for plating graphite with silver comprising:(A) graphite, present in the range of 0.1-100 g/L;(B) a silver salt, present in the range of 0.01-50 g/L;(C) a silver complexing agent, present in the range of 0.01-35 g/L;(D) a nitrogen-containing silane present in the range of 0.01-20 w % of the graphite weight;(E) a reducing agent for the silver salt, present in the range of 1-50 times the moles of silver salt.11. The plating composition of in which the silver salt is selected from the group consisting of silver nitrate claim 10 , silver sulfate claim 10 , and silver chloride.12. The plating composition of in which the silver complexing agent is selected from the group consisting of ammonium hydroxide claim 10 , ethylenediamine claim 10 , methylamine claim 10 , and ethylamine.13. The plating composition of wherein the nitrogen-containing silane is selected from the group consisting of 3-isocyanatopropyltriethoxysilane claim 10 , 3-isocyanatopropyltrimethoxysilane claim 10 , 2-cyanoethyltrimethoxysilane; 2-cyanoethyltriethoxysilane claim 10 , 3-cyanopropyltrimethoxysilane claim 10 , 3-cyanopropyltriethoxysilane claim 10 , 3-cyanopropylmethyldimethoxysilane claim 10 , 3-aminopropyltrimethoxy-silane claim 10 , 3-aminopropyltriethoxysilane claim 10 , 3-aminopropylmethyldimethoxysilane claim 10 , 3-aminopropylmethyldiethoxysilane claim 10 , 4-aminobutyltriethoxysilane claim 10 , N-(2-aminoethyl)-3-amino- ...