Mems optical device comprising a mems magnetic sensing mechansim and mems light absorbing structure

A MEMS optical device and an array composed thereof are disclosed herein, wherein the MEMS optical device comprises a light absorbing element, a deforming element, and a magnetic detector, wherein the magnetic detector comprises a magnetic source and a magnetic sensor.

MULTIPLEXED PATHLENGTH RESOLVED NONINVASIVE ANALYZER APPARATUS WITH NON-UNIFORM DETECTOR ARRAY AND METHOD OF USE THEREOF

A noninvasive analyzer apparatus and method of use thereof is described comprising a near-infrared source, a non-uniform detector array, and a photon transport system configured to direct photons from the source to the detector via an analyzer-sample optical interface. The non-uniform detector array provides a multitude of distinguishable optical pathlengths, couples to a plurality of optical transmission filters, couples to a plurality of light directing micro-optics, and/or couples to an array of light-emitting diodes. 1. An apparatus for noninvasively determining an analyte concentration of a subject , comprising: a near-infrared source;', 'a sample interface configured to proximately contact the subject during use; and', 'at least three detector elements positioned along a curved path, said at least three detector elements electrically linked for readout in series,', 'a non-uniform detector array, said non-uniform detector array comprising], 'a near-infrared noninvasive analyzer, comprisingwherein photons from said near-infrared source arrive at said non-uniform detector array via said sample interface.2. The apparatus of claim 1 , said non-uniform detector array further comprising:a first set of detector elements forming a first arc at a first distance from a center of said sample interface; anda second set of detector elements forming a second arc at a second distance from the center of said sample interface.3. The apparatus of claim 2 , said first arc forming a first ring of detector elements about the center of said sample interface claim 2 , said second arc forming a second ring of detector elements about the center of said sample interface.4. The apparatus of claim 2 , further comprising:a first optical filter comprising a first fifty percent transmission cut-on wavelength optically coupled to said first set of detector elements; anda second optical filter comprising a second fifty percent transmission cut-on wavelength optically coupled to said second set ...

Superconducting thermal detector (bolometer) of terahertz (sub-millimeter wave) radiation

A superconducting thermal detector (bolometer) of THz (sub-millimeter) wave radiation based on sensing the change in the amplitude or phase of a resonator circuit, consisting of a capacitor (Csh) and a superconducting temperature dependent inductor where the said inductor is thermally isolated from the heat bath (chip substrate) by micro-suspensions. The bolometer design includes a thin film inductor located on the membrane, a single or/and multi-layered thin film capacitor, and a thin film absorber of incoming radiation. The bolometer design can also include a lithographic antenna with antenna termination and/or a back reflector beneath the membrane for optimal wavelength detection by the resonance circuit. The superconducting thermal detector (bolometer) and arrays of these detectors operate in a temperature range from 1 Kelvin to 10 Kelvin.

TAILGATE DETECTION USING INFRA-RED BEAMS

A system, for calculating an object location within a portal, includes a portal map formed by a plurality of infra-red beams. The system further includes a broken beam detector for detecting and recording, in response to an object moving through the portal map, data indicative of one or more broken beams of the plurality of infra-red beams. The data includes first data indicative of an initial position of the object within the portal, second data indicative of a subsequent position of the object within the portal, and third data including one or more time records. The system also includes at least one broken beam analyzer for obtaining the data from the broken beam detector, the broken beam analyzer calculating the object location based on at least one of the first data, the second data, and the third data. 125-. (canceled)26. A system for calculating an object location within a portal , the system comprising:at least one portal map formed by a plurality of infra-red beams, wherein the plurality of infra-red beams includes one or more perpendicular infra-red beams and one or more diagonal infra-red beams;said at least one portal map created using one or more transmitters and one or more receivers, further wherein each transmitter transmits at least one perpendicular beam and at least one diagonal beam, and wherein each receiver receives at least one perpendicular beam and at least one diagonal beam; anda processor, comprisinga broken beam detector for detecting and recording, in response to an object moving through the at least one portal map, data indicative of one or more broken beams of the plurality of infra-red beams, the data including first data, second data, and third data, the first data being indicative of an initial position of the object within the portal, the second data being indicative of a subsequent position of the object within the portal, and the third data including one or more time records, andat least one broken beam analyzer for obtaining the ...

TUNABLE COHERENT LIGHT FILTER FOR OPTICAL SENSING AND IMAGING

Systems and methods are provided for filtering coherent infrared light from a thermal background for protection of infrared (IR) imaging arrays and detection systems. A Michelson interferometer is used for coherent light filtering. In an implementation, a system includes a fixed mirror, a beam splitter, and a moving mirror which can be controlled translationally, as well as tip/tilt. The Michelson interferometer may be used as an imaging system. For imaging applications, a system may comprise a tunable array of micro-electromechanical systems (MEMS) mirrors. A mid-wave IR interferometer with electronic feedback and MEMS mirror array is provided. 1. A system comprising:a beam splitter configured to receive incident light comprising at least coherent light, and split the light into a split beam comprising two beams;two mirrors configured to each receive a beam of the split beam and reflect the beam back to the beam splitter for recombining into a recombined beam;a detector configured to receive the recombined beam; anda computing device configured to determine an amount of the coherent light that has been removed from the incident light.2. The system of claim 1 , further comprising a translation stage configured to translate at least one of the two mirrors to tune the system to change the amount of the coherent light that is removed from the incident light.3. The system of claim 1 , wherein the beam splitter claim 1 , the two mirrors claim 1 , and the detector are comprised within a Michelson interferometer claim 1 , wherein the computing device is further configured to measure the light transmitted through the interferometer to determine the amount of the coherent light that has been removed from the incident light.4. They system of claim 1 , wherein the beam splitter claim 1 , the two mirrors claim 1 , and the detector are comprised within a mid-wave IR interferometer.5. The system of claim 1 , further comprising a light source configured to generate the incident ...

Terahertz-wave detector

A terahertz-wave detector having a thermal separation structure in which a temperature detection unit 14 including a bolometer thin film 7 connected to electrode wiring 9 is supported so as to be lifted above a substrate 2 by a support part 13 including the electrode wiring 9 connected to a reading circuit 2 a formed on the substrate 2 , wherein the terahertz-wave detector is provided with a reflective film 3 that is formed on the substrate 2 and reflects terahertz waves and an absorption film 11 that is formed on the temperature detection unit 14 and absorbs terahertz waves and the reflective film 3 is integrally formed with the reflective film of an adjacent terahertz-wave detector.

Device for radiating or receiving electromagnetic waves

The present invention relates to a device for radiating or receiving an electromagnetic wave. The device includes a substrate including a recess coated by a material that reflects the electromagnetic wave, a metal portion that radiates or receives the electromagnetic wave, and an electronic element connected to the metal portion on the substrate. The metal portion includes a portion provided above an opening of the recess and a portion which is located on the substrate and connected to the electronic element.

SEQUENTIAL BEAM SPLITTING IN A RADIATION SENSING APPARATUS

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces. 1. A radiation sensing apparatus , comprising:a micro-mirror chip comprising a plurality of light reflecting surfaces;an image sensor comprising an imaging surface; and 'the beamsplitter unit comprising a plurality of beamsplitters that are positioned side by side along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface.', 'a beamsplitter unit located between the micro-mirror chip and the image sensor,'}2. The radiation sensing apparatus of claim 1 , wherein there is only one layer of beamsplitters between the micro-mirror chip and the image sensor.3. The radiation sensing apparatus of claim 1 , wherein each light reflecting surface of the plurality of light reflecting surfaces includes a mirror that moves independent of the other mirrors of the plurality of light reflecting surfaces.4. The radiation sensing apparatus of claim 1 , wherein the plurality of light reflecting surfaces faces the imaging surface.5. The ...

Compact thermal aiming sight

A sight attachable to a weapon and comprising an objective lens, an image display, and a digital reticle. The objective lens focuses infrared light received from a scene onto a thermal imager, which is comprised of a focal plane array that detects infrared radiation in the scene focused by the lens. The image display is in signal communication with the thermal imager and provides an image of the received infrared light from the scene. The image rendered by the display is visible to the user. The digital reticle is rendered on the display and provides an aim point of the weapon upon a target in the scene. The image of the scene and superimposed reticle are directly viewable by a user with the aim point of the weapon upon the target being maintained constant over a range of viewing angles that depart from a viewing angle perpendicular to the display.

Systems and methods for thermal imaging systems

A thermal imaging system for use in maintaining a turbine assembly includes a case, a single pixel detector positioned within the case, at least one optical transportation device, and a prism. The optical transportation device is coupled to the case and configured to direct electromagnetic radiation to the single pixel detector. The prism is coupled to the optical transportation device and configured to direct electromagnetic radiation into the optical transportation device and to the single pixel detector. At least the prism and the optical transportation device are inserted into the turbine assembly and the single pixel detector acquires images of the turbine assembly.

AUTONOMOUS AREA MONITORING DEVICE USING A MULTI-AREA PASSIVE INFRARED SENSOR

A multi-area passive infrared sensor (PIF) produces a two-dimensional image formed of a grid of squares corresponding to adjacent elementary areas of an area to be monitored, with, for each square, a respective heat signal. The squares of the grid are classified into authorized and secured squares, and the device produces, for each square, an indicator of presence/absence of a target. In the presence of a detected target in at least one square, the processor conditionally delivers an alert as a function of i) the position on the grid of the detected target and ii) of the classification into authorized or secured square of the square in which this target is detected. A data memory stores a history of the states of the grid, and the processor performs a tracking of the target by an algorithm based on adjacent squares, based on this history. 2. The autonomous device of claim 1 , wherein:the device comprises a data memory interfaced with the processor, adapted to store a history of the successive states of the indicators of presence of a source of heat on the grid; andthe data processor is further configured to perform:a tracking of the detected target, by implementation of an algorithm based on adjacent squares, with determination of the route of the tracked target, on the grid, based on said history of the successive states of the indicators of presence of a source of heat on the grid; andthe conditional delivery of said alert as a functioni) of said route of the tracked target andii) of the classification into authorized squares or secured squares of the squares successively occupied by the target on this route.5. The autonomous device of claim 2 , wherein claim 2 , in case of a plurality of targets detected claim 2 , the data processor is configured to conditionally deliver said alert by:for each of the successive states of the indicators of presence of a source of heat on the grid, counting the number of detected targets simultaneously present in the area to be ...

Infrared sensor

To provide an infrared sensor that allows heat to be efficiently transferred from an insulating film to a heat sensitive element and has a good responsivity. The infrared sensor according to the present invention includes an insulating film 2; a pair of first adhesive electrodes 3 A that is patterned on either surface of the insulating film; a pair of first terminal electrodes 4 A that is patterned on either surface of the insulating film; a first heat sensitive element 5 A that is provided on either surface of the insulating film and is connected to the pair of first adhesive electrodes; a pair of first pattern wiring parts 6 A that is patterned on either surface of the insulating film with one end thereof being connected to the pair of first adhesive electrodes and the other end thereof being connected to the pair of first terminal electrodes; and a heat transfer film 7.

Micromechanical Device for Electromagnetic Radiation Sensing

Systems, methods, and apparatus for providing an improved electromagnetic radiation sensing micromechanical device to be utilized in high pixel-density pixel sensor arrays. The device includes an improved design for improved and adjustable performance through simple geometric or fabrication means. Furthermore, the design of the device lends itself to simple micromechanical manufacturing procedures. Additionally, the manufacturing procedures include a method to enable high uniformity and high yield sensor arrays. Arrays of the device can be utilized as IR imaging detectors for use in applications such as human presence detection, nonvisual environment monitoring, security and safety, surveillance, energy monitoring, fire detection and people counting. 1. A micromechanical radiation sensor , comprising: a first direction; and', 'a second direction that is perpendicular to the first direction; and, 'a substrate having a plate having a layer of a radiation absorbing material and a layer of a light reflecting material; and', 'two legs arranged in symmetry with respect to an axis of symmetry and causing the plate to rotate about an axis of rotation;, 'at least one column of micromechanical pixels, wherein the micromechanical pixels in the column are arranged along the first direction, the respective micromechanical pixel having two straight outer arms, each having a bimaterial region extending along the first direction; and', 'a thermal isolation region coupled between the two straight outer arms; and, 'wherein each respective leg of the two legs having one first end joining the substrate and a second end joining the plate on a respective edge of the plate, the respective leg havingwherein a dividing line between plates of adjacent micromechanical pixels in the column goes through center portions of legs of one of the adjacent micromechanical pixels.2. The micromechanical radiation sensor of claim 1 , wherein the plate further has an additional structured absorption layer ...

Imaging systems and methods

An imaging method includes receiving electromagnetic radiation at a focal plane array of a handheld device. The electromagnetic radiation is processed within the handheld device, and visible images are displayed on the handheld device. The displayed visible images are indicative of a scene, and include a designator and a designator identifier when a high frequency laser pulse is in the scene. The designator and designator identifier represent the high frequency pulsed electromagnetic radiation received by the focal plane array when a high frequency pulse is present in the scene.

INFRARED IMAGING DETECTOR

The present specification generally relates to the field of imaging device and particularly discloses an imaging device for detecting infrared radiation. The imaging device comprises a first set of detectors responsive to infrared electromagnetic radiation in a first wavelength band, a second set of detectors and a filter disposed above the second set of detectors to prevent registration of electromagnetic radiation outside a second wavelength band at the second set of detectors. The second wavelength band is a subset of the first wavelength band. The imaging device is configured to detect a deviation from an expected value of a level of electromagnetic radiation in a third wavelength band based on signals obtained from the first set of detectors and the second set of detectors. The third wavelength band is within the first wavelength band and outside the second wavelength band. 1. An imaging device comprising:a first set of detectors responsive to infrared electromagnetic radiation in a first wavelength band;a second set of detectors; anda filter disposed above said second set of detectors to prevent registration of electromagnetic radiation outside a second wavelength band at said second set of detectors, wherein said second wavelength band is a subset of said first wavelength band; andwherein said imaging device is configured to detect presence of a medium or substance having a characteristic in a third wavelength band, wherein said third wavelength band is within said first wavelength band and outside said second wavelength band, by comparing a measurement signal obtained from a detector of the first set of detectors with a background level of electromagnetic radiation in the third wavelength band, said background level corresponding to one or more reference signals obtained from one or more detectors of the second set of detectors and scaled in accordance with a known dependence on wavelength of the background level of electromagnetic radiation in said second ...

Infrared Sensor Array Circuit Breaker Monitoring

A thermal monitoring system includes at least one of an infrared sensor and a plurality of infrared sensors arranged in an array. Each infrared sensor has a resolution including a plurality of pixels. A controller is configured to create a thermal image of an area to be monitored based at least in part on the plurality of pixels of each infrared sensor. A thermal monitoring assembly includes an electrical panel including a plurality of electrical components located within the electrical panel. The at least one of an infrared sensor and the plurality of infrared sensors arranged in an array, either alone or in combination with additional sensors, are located inside the electrical panel. Methods of monitoring various parameters including a temperature of the plurality of electrical components located inside the electrical panel are also provided. 1. A thermal monitoring system comprising:an infrared sensor having a resolution comprising a plurality of pixels; anda controller configured to create a thermal image of an area to be monitored based at least in part on the plurality of pixels of the infrared sensor.2. The thermal monitoring system of claim 1 , further comprising:an additional sensor comprising at least one of a current transformer and an ambient temperature sensor configured to respectively determine at least one of a current and an ambient temperature with respect to the area to be monitored.3. The thermal monitoring system of claim 1 , wherein the infrared sensor is arranged inside an electrical panel claim 1 , and wherein the area to be monitored comprises an electrical component located within the electrical panel.4. The thermal monitoring system of claim 3 , comprising a plurality of infrared sensors arranged in an array claim 3 , wherein each of the plurality of infrared sensors has a resolution comprising a plurality of pixels claim 3 , wherein the area to be monitored comprises an entire area within the electrical panel comprising a plurality of ...

MULTI-REFERENCE CORRELATED DOUBLE SAMPLING DETECTION METHOD AND MICROBOLOMETER USING THE SAME

Disclosed is a multi-reference correlated double sampling detection method including generating, by a plurality of unit reference cells, reference signals, receiving, by a plurality of unit active cells having absorbed an infrared signal, sensing signals, and detecting a pure infrared signal on a basis of the sensing signals and active cell values processed using the reference signals, wherein the unit reference cells do not react to the infrared signal and are configured of blind cells having identical electrical and thermal characteristics to the unit active cells. Accordingly, a self-heating effect of an active cell may be accurately cancelled out, the method is robust to common noise such as power supply noise, and fixed pattern noise occurring in a sensing circuit and including incoherence between skimming cells may be removed. Furthermore, the method may improve efficiency and greatly reduce complexity of analog and digital correction, and remove a thermo-electro cooler and shutter. 1. A multi-reference correlated double sampling detection method comprising:generating, by a plurality of unit reference cells, reference signals;receiving, by a plurality of unit active cells having absorbed an infrared signal, sensing signals; anddetecting a pure infrared signal on a basis of the sensing signals and active cell values processed using the reference signals,wherein the unit reference cells do not react to the infrared signal and are configured of blind cells having identical electrical and thermal characteristics to the unit active cells.2. The multi-reference correlated double sampling detection method of claim 1 , wherein the plurality of unit reference cells are configured of an n×m array claim 1 , where n and m are natural numbers.3. The multi-reference correlated double sampling detection method of claim 2 , wherein the active cell value is a value obtained by calculating an average value of reference output signals output from n unit reference cells present ...

CIRCUIT SOMMATEUR

A summing circuit, including a capacitor, a switching circuit capable of connecting the capacitor between a first node (ana) and a second node (ref), between a third node and the second node in a first connection direction or between the third node and the second node in a second connection direction, an integrator coupled to the third node, a hysteresis comparator coupled to the output of the integrator, and a counter coupled to the output of the hysteresis comparator. 1. A summing circuit comprising:a capacitor;a switching circuit capable of connecting the capacitor according to a first, a second, or a third configuration, the capacitor being connected between a first node and a second node in the first configuration, the capacitor being connected between a third node and the second node in a first connection direction in the second configuration and the capacitor being connected between the third node and the second node in a second connection direction in the third configuration;an integrator coupled to the third node;a hysteresis comparator coupled to the output of the integrator; anda counter coupled to the output of the hysteresis comparator.2. The summing circuit of claim 1 , wherein the integrator is capable of supplying a first signal and wherein the hysteresis comparator is capable of supplying a second signal in a first state or in a second state according to the result of the comparison of the first signal with a first threshold or with a second threshold.3. The summing circuit of claim 2 , wherein the counter is capable of incrementing a digital signal (num) for each rising edge and for each falling edge of the second signal.4. The summing circuit of claims 1 , wherein the integrator comprises an operational amplifier.5. The summing circuit of claim 1 , wherein the switching circuit comprises:a first switch coupling a first plate of the capacitor to the first node and controlled by a first control signal;a second switch coupling a second plate of the ...

Swir to visible image up-conversion integrated device

Dislosed is a device for up-conversion of Short Wavelength Infra-Red (SWIR) images into visible images. The device comprises a sub micrometer thickness structure that is composed of several sub-layers, each having a typical thickness of tens to hundreds of nanometers. The device is composed of two main sections one on top of the other: (a) a highly efficient SWIR absorption thin layer and (b) a highly efficient organic light emitted diode (OLED). The generated visible image is emitted from the OLED through a top transparent cathode, which is deposited on the OLED.

Systems and Methods for Thermal Radiation Detection

Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more Indium Antimonide (InSb)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

AUTO DETECTION SYSTEM BASED ON THERMAL SIGNALS

There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor. 1. An auto detection system , configured to monitor an elevator cabin , the auto detection system comprising:a thermal detection device configured to output digital values at a predetermined frequency; and receive the digital values,', 'calculate a slope between two digital values,', 'identify opening and closing of a door of the elevator cabin by comparing the calculated slop and a slope threshold range, and', 'calculate a fluctuation degree of multiple digital values within a predetermined time interval after the door is identified to be opened and then closed., 'a host configured to'}2. The auto detection system as claimed in claim 1 , whereinthe thermal detection device is further configured to output object temperatures at the predetermined frequency, and the calculated slope between the two digital values exceeding the slope threshold range,', 'the fluctuation degree exceeding a code variation threshold, and', 'the temperature variation exceeding a temperature threshold., 'the host is further configured to calculate a temperature variation of the object temperatures, and identify the elevator cabin having a person therein in response to'}3. The auto detection system as claimed in claim 1 , wherein the thermal detection device comprises:a single thermopile sensor configured to generate a voltage signal at the predetermined frequency; andan analog to digital converter configured to convert the voltage signal to the digital signals.4. The auto detection system as claimed in claim 1 , wherein the thermal detection ...

METHOD AND APPARATUS FOR READING DETECTOR ARRAYS

A solution for reading detector arrays is disclosed. The solution comprises generating () an excitation signal, varying () the frequency of the excitation signal in time, supplying () the excitation signal to a detector array comprising a set of thermal detectors. The number of detectors corresponds to the frequencies of the excitation signal. In the solution, the signal is demodulated () at the output of the detector array and time-multiplexed base band signal is obtained. An analogue to digital conversion is performed () to the time-multiplexed base band signal and the base band signal is demultiplexed () to obtain a set of detector signals. 1. A method of for reading detector arrays , comprising generating an excitation signal;varying the frequency of the excitation signal in time;supplying the excitation signal to a detector array comprising a set of thermal detectors, wherein the number of detectors corresponds to the frequencies of the excitation signal;demodulating the signal at the output of the detector array and obtaining time-multiplexed base band signal;performing analogue to digital conversion to the time-multiplexed base band signal; anddemultiplexing the base band signal to obtain a set of detector signals.2. The method as claimed in claim 1 , wherein the frequency of the excitation signal is switched through a given set of frequencies during a given time frame τ.3. The method as claimed in claim 1 , wherein the frequency of the excitation signal is kept at each frequency of the given set of frequencies for the duration of a given slot time τ.4. The method as claimed in claim 2 , wherein the frame rate 1/τof the frequency of the excitation signal is higher than the thermal cut-off frequency of the thermal detectors in the detector array.5. The method as claimed in claim 1 , further comprising: amplifying the signal at the output of the detector array prior demodulation.6. An arrangement for reading detector arrays claim 1 , comprising a signal ...

BOLOMETER WITH HIGH SPECTRAL SENSITIVITY

A bolometric detector including an absorption membrane, for converting an incident electromagnetic radiation into heat; and a reflector, for reflecting to the absorption membrane part of the incident electromagnetic radiation having passed there through, is provided. The bolometric detector includes a non-metallic layer, situated between the absorption membrane and the reflector, having a series of index jumps, so as to form a network resonating at a wavelength of interest λ; the mean pitch of the network is less than λ; and the optical distance between the absorption membrane and the reflector is substantially equal to a multiple of λ/2. 2. The bolometric detector according to claim 1 , wherein a difference between the first optical index and the second optical index is greater than 0.5.3. The bolometric detector according to claim 1 , wherein the mean pitch of the network is comprised between λ/2 and λ claim 1 , where λis the wavelength of interest.4. The bolometric detector according to claim 1 , wherein the resonating network is a periodic network.5. The bolometric detector according to claim 1 , wherein the resonating network is a pseudo-periodic network claim 1 , having variations in the shape of the elementary pattern such that a coverage rate relative to a mean shape of the elementary patterns is comprised between 90% and 99%.6. The bolometric detector according to claim 1 , wherein the resonating network has index jumps distributed along the two dimensions of a plane parallel to the absorption membrane.7. The bolometric detector according to claim 1 , wherein the resonating network has index jumps distributed along a single dimension of a plane parallel to the absorption membrane.8. The bolometric detector according to claim 1 , wherein each index jump is constituted of an interface between a first material and a second material claim 1 , and in that one of said materials is a vacuum or a gas such as air.9. The bolometric detector according to claim 1 , ...

DETECTOR LOCATOR SYSTEM

A detector locator system comprising: an electromagnetic radiation (EMR) source array comprising a plurality of EMR sources; a detector apparatus comprising an EMR detector configured to detect an EMR signal emitted by the EMR sources, a wireless transceiver configured to transmit an ON signal responsive to the EMR detector receiving the EMR signal; a control unit configured to instruct the driver to control the EMR sources to turn on one at a time in an activation pattern, receive the ON signal, and designate, responsive to the ON signal, the EMR source that triggered the detection signal as a triggering EMR source. 1. A detector locator system comprising:an electromagnetic radiation (EMR) source array comprising a plurality of EMR sources;a detector apparatus comprising:an EMR detector configured to detect an EMR signal emitted by the EMR sources; anda wireless transceiver configured to transmit an ON signal responsive to the EMR detector receiving the EMR signal; anda control unit configured to:control the EMR sources to turn on one at a time in an activation pattern;receive the ON signal; anddesignate, responsive to the ON signal, the EMR source from the plurality of EMR sources that triggered the detection signal as a triggering EMR source.2. The system according to claim 1 , wherein the EMR source is configured to emit an EMR with a frequency range selected from the group consisting of: a radio wave frequency range; an infrared frequency range; a visible light frequency range; and an ultraviolet frequency range.3. The system according to claim 1 , wherein claim 1 , upon designation of the triggering EMR source claim 1 , the control unit is configured to turn on one EMR source at a time in a second activation pattern within a subset of the plurality of EMR sources claim 1 , the subset comprising the triggering EMR source and a predetermined number of EMR sources flanking either side of the triggering EMR source.4. The system according to claim 1 , wherein the ...

MULTI-CONDITION SENSING DEVICE INCLUDING AN IR SENSOR

Techniques are disclosed for using an infrared (IR) sensor to sense flame and/or activity within an environment of a building, such as a home or office. One example embodiment provides a multi-condition sensing device that includes an IR sensor for sensing both human occupancy and fire within a given environment. Another example embodiment provides a multi-condition sensing device that includes a plurality of sensors. A first of the sensors includes an IR sensor that is adapted to sense IR radiation within a given environment. A second of the sensors is adapted to sense a second environmental condition (different than IR radiation) within the given environment. Another example embodiment provides a standalone modular sensor block with a standard communication interface to a building management system. The sensor block may act as a combo-sensor as well as an active fire detector and alarm. 1. A multi-condition sensing device , comprising:a housing including a plurality of sensor mounts;a plurality of sensors, including an IR array mounted to a first of the sensor mounts of the housing, and adapted to sense IR radiation within a first environment of the building; anda second sensor of the plurality of sensors mounted to a second of the sensor mounts of the housing and adapted to sense a second environmental condition, different than the IR radiation, within the first environment of the building.2. The multi-condition sensing device according to claim 1 , further comprising:a lighting element mounted to the housing and adapted to illuminate at least a portion of the first environment of the building.3. The multi-condition sensing device according to claim 1 , wherein the plurality of sensors includes a third sensor mounted to a third of the sensor mounts of the housing and adapted to sense a third environmental condition claim 1 , different than the IR radiation and different than the second environmental condition claim 1 , within the first environment of the building ...

INFRARED SENSOR ARRAY BASED TEMPERATURE MONITORING SYSTEMS FOR DATA CENTERS AND RELATED METHODS

Temperature monitoring systems for data centers include a plurality of ceiling-mounted infrared sensor arrays. Each infrared sensor array includes a two-dimensional array of infrared emission sensors, and at least some of the infrared emission sensors have field of view patterns that project onto aisle faces of equipment racks that are mounted in rows in the data center. These systems may further include a controller that is remote from at least some of the infrared sensor arrays and that is in communications with the infrared sensor arrays, the controller configured to provide a two-dimensional thermal map of the aisle faces of the equipment racks based at least in part on temperature data received from the infrared sensor arrays. 1. A temperature monitoring system for a data center that includes a plurality of aisles and a plurality of equipment racks that are mounted in rows between the aisles , the temperature monitoring system comprising:a plurality of overhead-mounted infrared sensor arrays that are mounted above the aisles and/or the equipment racks, wherein each infrared sensor array includes a two-dimensional array of infrared emission sensors, and at least some of the infrared emission sensors have field of view patterns that project onto aisle faces of the equipment racks; anda controller that is remote from at least some of the infrared sensor arrays and that is in communications with the infrared sensor arrays, the controller configured to provide a two-dimensional thermal map of the aisle faces of the equipment racks based at least in part on temperature data received from the infrared sensor arrays.2. The temperature monitoring system of claim 1 , wherein a first of the infrared sensor arrays comprises a substrate that has the plurality of infrared emission sensors on a front surface of the substrate claim 1 , and wherein a back surface of the substrate is mounted at an acute angle with respect to a plane defined by the floor of the data center.3. The ...

ON-BOARD RADIATION SENSING APPARATUS

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter. 1. A radiation sensing apparatus , comprising:a micro-mirror chip comprising a plurality of light reflecting surfaces;an image sensor comprising an imaging surface;a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip; and enclose at least the beamsplitter and a light source, the light source being attached to a printed circuit board (PCB), the enclosure comprising an inner surface that comprises an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter; or', 'enclose at least the beamsplitter, the beamsplitter and a light source being attached to a printed circuit board (PCB), and the light source being attached to the PCB by a flexible connector., 'an enclosure, either configured to2. The radiation sensing apparatus of claim 1 , wherein the enclosure ...

Multizone control of lamps in a conical lamphead using pyrometers

A method and apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors.

LARGE-AREA LASER HEATING SYSTEM

The instant disclosure provides a large-area laser heating system including a laser module, a reaction module and a guiding module. The laser module includes a vertical-cavity surface-emitting laser for emitting a laser beam and a laser adjusting structure connected to the vertical-cavity surface-emitting laser. The incident angle of the laser beam emitted by the vertical-cavity surface-emitting laser is adjusted by the laser adjusting structure. The reaction module includes a sample holder for carrying a sample. The guiding module is connected between the laser module and the reaction module, and the laser beam emitted by the vertical-cavity surface-emitting laser passes through the guiding module and projects onto the surface of the sample. 1. A large-area laser heating system , comprising:a laser module comprising at least a vertical-cavity surface-emitting laser for emitting at least a laser beam, and a laser adjusting structure connected to the vertical-cavity surface-emitting laser, wherein an incident angle of the laser beam emitted by the vertical-cavity surface-emitting laser is adjusted by the laser adjusting structure;a reaction module comprising a sample holder for holding a sample; anda guiding module connected between the laser module and the reaction module, wherein the laser beam emitted by the vertical-cavity surface-emitting laser passes through the guiding module and projects onto a surface of the sample.2. The large-area laser heating system according to claim 1 , further comprising a cooling module connected to the laser module and the guiding module claim 1 , wherein the cooling module provides cooling water to cool the laser module and the guiding module.3. The large-area laser heating system according to claim 2 , wherein the guiding module is a vertical chamber having a jacket structure for cooling water to pass through.4. The large-area laser heating system according to claim 1 , further comprising a temperature detecting device disposed ...

Method for Producing a Thermal Infrared Sensor Array in a Vacuum-Filled Wafer-Level Housing

A method for producing a thermal infrared sensor array in a vacuum-filled wafer-level housing with particularly small dimensions, consisting of at least two wafers, a cover wafer and a central wafer comprising multiple infrared-sensitive sensor pixels on a respective thin slotted membrane over a heat-insulating cavity is disclosed. A method for producing a high-resolution monolithic silicon micromechanical thermopile array sensor using wafer level packaging technology, wherein the sensor achieves a particularly high spatial resolution capability and a very high filling degree with very small housing dimensions, in particular a very low overall thickness, and can be inexpensively produced using standard CMOS processes. This is achieved in that the cover wafer is first rigidly mechanically connected to the provided central wafer comprising the sensor pixels with the infrared-sensitive pixels by means of wafer bonding, and the central wafer is then thinned out from the wafer rear face to a specified thickness. 117.-. (canceled)18. A method for producing a thermal infrared sensor array in a vacuum-filled wafer-level housing comprising at least two wafers ,{'b': '1', 'a cover wafer () and'}{'b': 3', '5', '5', '11, 'a central wafer () having a plurality of infrared-sensitive pixels () respectively on a slitted membrane (″) over a thermally insulating cavity (),'}the method comprising:{'b': 1', '10, 'initially providing the cover wafer () on an inner side with at least one cavity () and'}{'b': 1', '3', '5, 'firmly mechanically connecting the cover wafer () to the central wafer () having the plurality of infrared-sensitive pixels () by wafer bonding, and'}{'b': '3', 'subsequently thinning the central wafer () from a backside of the wafer to a predetermined thickness.'}19. The method as claimed in claim 18 ,{'b': 11', '5', '5', '11', '5', '3', '3, 'wherein the thermally insulating cavity () is etched below the slitted membrane (″) of each infrared-sensitive sensor pixel () ...

MICROSCOPE WITH DETECTOR STOP MATCHING

A microscope includes a detector device having an enclosure and an infrared sensitive detector array disposed within the enclosure. The enclosure may be cryogenically cooled and have an aperture which defines an aperture stop for an optical path extending to the detector array. The microscope may have a microscope objective with an objective exit pupil, and the microscope may include one or more intermediate optical elements which are configured to image at least a portion of the objective exit pupil at the aperture stop while simultaneously focusing light from an object transmitted through the objective at the detector array. 1. A microscope comprising:a detector device having an enclosure and an infrared sensitive detector array disposed within the enclosure, the enclosure having an aperture which defines an aperture stop for an optical path extending to the detector array;a microscope objective having one or more objective optical elements, the one or more objective optical elements having an objective exit pupil; andone or more intermediate optical elements,wherein the one or more intermediate optical elements are configured to image at least a portion of the objective exit pupil at the aperture stop while simultaneously focusing light from an object transmitted through the objective at the detector array.2. The microscope of claim 1 , wherein the microscope objective is a solid immersion lens.3. The microscope of claim 1 , further comprising one or more polarization control optics disposed between the aperture and the objective.4. The microscope of claim 3 , wherein the polarization control optics include one or more linear polarizers.5. The microscope of claim 4 , wherein the one or more linear polarizers are configured to rotate to adjust a polarization of light transmitted to the aperture.6. The microscope of claim 1 ,wherein a diameter of the exit pupil of the objective is approximately equal to a diameter of the aperture stop.7. The microscope of claim 1 , ...

Additive manufacturing temperature controller/sensor apparatus and method of use thereof

An additive manufacturing temperature controller/temperature sensor uses one or more spectrophotometric sensors to monitor temperature of successive layers and preferably localized sections of successive layers of a melt pool, and transients thereof, of an object being generated for the purpose of dynamic control of the additive manufacturing device and/or quality control of the generated object manufactured with the additive manufacturing device. Generally, the additive manufacturing temperature controller/sensor apparatus monitors temperature of a section of the object during manufacture as a function of wavelength, time, position, and/or angle to determine melt extent in terms of radius and/or depth.

SEQUENTIAL BEAM SPLITTING IN A RADIATION SENSING APPARATUS

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces. 1. An apparatus comprising:a plurality of mirrors;a sensor having a surface to receive light rays reflected from the mirrors; andat least one beamsplitter located between the mirrors and the sensor, wherein the beamsplitter comprises at least one partially-reflective surface configured to partially reflect light rays towards the mirrors.2. The apparatus of claim 1 , wherein the at least one partially-reflective surface includes first and second partially-reflective surfaces aligned in sequence.3. The apparatus of claim 2 , wherein a first beamsplitter comprises the first partially-reflective surface claim 2 , and a second beamsplitter comprises the second partially-reflective surface.4. The apparatus of claim 3 , wherein the first and second beamsplitters are positioned side by side.5. The apparatus of claim 1 , wherein each mirror comprises a light reflecting surface on one side of the mirror claim 1 , and a radiation absorption surface on an ...

Method for Determining a Temperature without Contact, and Infrared Measuring System

A method for contactlessly establishing a temperature of a surface includes determining the temperature measurement values of the plurality of blind pixels and determining temperature measurement values of the plurality of measurement pixels. The method further includes determining a temperature measurement value and a temperature measurement values by subtracting the temperature measurement value of the first blind pixel of the plurality of blind pixels from a temperature measurement value of a second blind pixel of the plurality of blind. The method further includes correcting the temperature measurement values by pixel-associated temperature drift components in each case, wherein the temperature drift components are determined using the temperature measurement value and/or the temperature measurement value. 1. A method for contactlessly establishing a temperature of a surface with an infrared measurement system comprising:an infrared detector array with a detector array substrate;at least one reference pixel, which is connected to the detector array substrate with a first thermal conductivity and which provides a reference signal for establishing temperature measurement values;a plurality of measurement pixels, which are each connected to the detector array substrate with a second thermal conductivity, wherein the measurement pixels are sensitive to infrared radiation and each provide a measurement signal, wherein a temperature measurement value, which is dependent on an intensity of the incident infrared radiation, is established in each case from the difference between the measurement signal and the reference signal;a plurality of blind pixels, which are each connected to the detector array substrate with a third thermal conductivity and which each provide a measurement signal, wherein a temperature measurement value is established in each case from the difference between the measurement signal and the reference signal;the method comprising:determining the ...

INFRARED DETECTOR

Methods, systems, and apparatus, for an infrared detector are provided. In one aspect, an infrared detector is provided that includes a pyroelectric sensor; a controller for receiving a trigger signal outputted by the pyroelectric sensor; a thermopile sensor, wherein the controller starts the thermopile sensor after receiving the trigger signal output by the pyroelectric sensor; and an alarm, wherein the controller controls the alarm to generate an alarm signal in response to a determination that a difference between a current temperature and a background temperature detected by the thermopile sensor is larger than a threshold value and a determination that the areas of the thermopile sensor activated correspond to a human being. 1. An infrared detector , comprising:a pyroelectric sensor;a controller for receiving a trigger signal outputted by the pyroelectric sensor;a thermopile sensor, wherein the controller starts the thermopile sensor after receiving the trigger signal output by the pyroelectric sensor;a timer, wherein the controller starts the timer after receiving the trigger signal output by the pyroelectric sensor, and starts the thermopile sensor after a counted time is ended; andan alarm, wherein the controller controls the alarm to generate an alarm signal in response to a determination that a difference between a current temperature and a background temperature detected by the thermopile sensor is larger than a threshold value and a determination that the areas of the thermopile sensor activated correspond to a human being.2. The infrared detector of claim 1 , comprising a processing engine configured to analyze data from the thermopile sensor to determine whether a human being is detected.3. The infrared detector of claim 1 , comprising a processing engine configured to use a wireless circuit to communicate data from the thermopile sensor to a remote analysis location and to receive a result of the analysis.4. The infrared detector of claim 1 , wherein ...

DETECTION DEVICE WITH SUSPENDED BOLOMETRIC MEMBRANES HAVING A HIGH ABSORPTION EFFICIENCY AND SIGNAL-TO- NOISE RATIO

A bolometric detection device includes a substrate having a read-out circuit. The device also includes an array of elementary detectors each including a membrane suspended above the substrate and connected to the read-out circuit by at least two electric conductors. The membrane has two electrically-conductive electrodes respectively connected to the two electric conductors, and a volume of transducer material electrically connecting the two electrodes. The read-out circuit is configured to apply an electrical stimulus between the two electrodes of the membrane and to form an electric signal as a response to said application. The volume includes a volume of a first transducer material electrically connecting the two electrodes of the membrane and forming walls of a closed enclosure having each of the electrodes at least partially housed therein; and a volume of a second transducer material, electrically connecting the two electrodes and housed in the enclosure, the electric resistivity of the second material being smaller than the electric resistivity of the first material; and the two transducer materials having a negative thermal coefficient of resistivity TCR. 1. A bolometric detection device comprising:a substrate comprising a read-out circuit;an array of elementary detectors each comprising a membrane suspended above the substrate and connected to the read-out integrated circuit by at least two electric conductors, said membrane comprising two electrically-conductive electrodes respectively connected to the two electric conductors, and a volume of transducer material electrically connecting the two electrodes,wherein the read-out circuit is configured to apply an electrical stimulus between the two electrodes of the membrane and to form an electric signal as a response to said application, a volume of a first transducer material electrically connecting the two electrodes of the membrane and forming walls of a closed enclosure having each of the electrodes at ...

Controlled-emissivity face heated by non-resistive heat source

In an example, an apparatus is described that includes a non-resistive heat source, a thermally conductive face, and a temperature detector. The thermally conductive face has a controlled long-wave infrared emissivity and is in thermal contact with the non-resistive heat source. The temperature detector is positioned to detect a temperature of the thermally conductive face.

Method, apparatus, and non-transitory computer readable medium for visualizing infrared radiation strength

A method, an apparatus, and a non-transitory computer readable medium for visualizing infrared radiation strength includes obtaining infrared radiation (IR) image data transmitted by a light sensor; determining a radiation strength distribution and a module emitting mode corresponding to the IR image data; based on the radiation strength distribution and the module emitting mode, determining whether the IR image data meets a predetermined standard; when it is determined that the IR image data meets the predetermined standard, applying a gray processing to the IR image data to obtain a strength gray image; and applying color modulation to the strength gray image to generate a visual energy distribution image.

Multizone control of lamps in a conical lamphead using pyrometers

A substrate processing apparatus is provided. The substrate processing apparatus includes a vacuum chamber having a dome and a floor. A substrate support is disposed inside the vacuum chamber. A plurality of thermal lamps are arranged in a lamphead and positioned proximate the floor of the vacuum chamber. A reflector is disposed proximate the dome, where the reflector and the dome together define a thermal control space. The substrate processing apparatus further includes a plurality of power supplies coupled to the thermal lamps and a controller for adjusting the power supplies to control a temperature in the vacuum chamber.

Readout circuit for uncooled infrared focal plane array

A readout circuit for an uncooled infrared focal plane array includes: a first biasing circuit for generating a detection output signal; a second biasing circuit for generating a first reference output signal; a first integration circuit; and an analog-to-digital circuit including: a ramp signal generating circuit for generating a ramp signal according to a second reference microbolometer of a third biasing circuit. In the readout circuit, subtracting and amplifying the detection output signal and the first reference output signal are provided by the integrator at an analog domain, while ratio counting is provided by an analog-to-digital converter during analog-to-digital conversion. Furthermore, a column level integrated readout channel utilizes only one reference microbolometer, and the chip level ramp signal generator also utilizes only one reference microbolometer. Therefore, a chip area is further saved, and noise sources are decreased. 1. A readout circuit for an uncooled infrared focal plane array , comprising:a first biasing circuit, wherein said first biasing circuit is connected to an active microbolometer unit, said first biasing circuit generates a detection output signal according to an electrical property of said active microbolometer unit;a second biasing circuit, wherein said second biasing circuit comprises a first reference microbolometer unit, said second biasing circuit generates a first reference output signal according to an electrical property of said first reference microbolometer unit;a first integration circuit, wherein said first biasing circuit and said second biasing circuit are connected to said first integration circuit, said first integration circuit subtracts said first reference output signal from said detection output signal and amplifies a difference of said detection output signal and said first reference output signal, for generating an integration output signal; andan analog-to-digital circuit, wherein said first integration ...

Infrared imaging detector

The present specification generally relates to the field of imaging device and particularly discloses an imaging device for detecting infrared radiation. The imaging device comprises a first set of detectors responsive to infrared electromagnetic radiation in a first wavelength band, a second set of detectors and a filter disposed above the second set of detectors to prevent registration of electromagnetic radiation outside a second wavelength band at the second set of detectors. The second wavelength band is a subset of the first wavelength band. The imaging device is configured to detect a deviation from an expected value of a level of electromagnetic radiation in a third wavelength band based on signals obtained from the first set of detectors and the second set of detectors. The third wavelength band is within the first wavelength band and outside the second wavelength band.

INFRARED DETECTION DEVICE AND INFRARED DETECTION METHOD

An infrared detection device that can detect movement, a temperature, and a stationary state of a detection object with a simple configuration is provided. 1. An infrared detection device comprising a pyroelectric infrared sensor , peak detecting unit for an electric signal waveform , peak inclination amount detecting unit for an electric signal waveform , peak value holding unit for an electrical signal waveform , and determining unit ,wherein the pyroelectric infrared sensor outputs an electric signal depending on change in an infrared ray resulting from a detection object,the peak detecting unit detects a peak of a temporal waveform of an electric signal output by the sensor,the peak inclination amount detecting unit detects an inclination amount of a peak detected by the peak detecting unit,the peak value holding unit holds an initial peak value when the detection object enters a detection region of the sensor, for a peak detected by the peak detecting unit, andthe determining unitdetermines at least one of entry of the detection object to and exit of the detection object from the sensor region based on the detected peak,determines at least one of a movement speed and a temperature of the detection object, based on the peak inclination amount, anddetermines at least one of movement and motionlessness of a detection object in a detection region of the sensor, based on whether or not the held peak value is held for a waveform saturation period acquired from an inclination amount of the initial peak.2. The infrared detection device according to claim 1 , wherein the pyroelectric infrared sensor is an array type sensor in which a plurality of pyroelectric infrared detection elements are arranged in an array on a substrate.3. The infrared detection device according to claim 1 , detecting a one-dimensional or two-dimensional temperature distribution.4. A person movement detection device comprising the infrared detection device according to claim 1 ,wherein the ...

Thermography process for a thermal imaging system

A thermography process for thermal imaging systems produced in quantity, including an imaging sensor and an ambient temperature sensor, that includes operations at three different places in the manufacture and actual use of the system. A temperature calibration may be performed on all units of a given design at a small number of controlled scene temperatures at one ambient temperature to produce a function that relates sensor signal to scene temperature. The function is determined for each individual unit and may be unique for each unit. Selected calibrated units may be subjected to a qualification test where they are exposed to larger number of controlled scene temperatures at a plurality of controlled ambient temperatures and the errors between the calibration derived function and the observed results and/or the actual scene temperatures at the various scene/ambient temperature combinations may be derived and put into a table that is loaded into all production units. In actual use of the imaging system, for any given actual observed signal and temperature sensor values, the corresponding scene temperature and/or error may be derived from the table and used to modify the temperature value from the calibration function.

Method for making an infrared detection device

An infrared detection device including an infrared heat detector and a connection pad each spaced apart from an etching stop layer by a non-zero distance substantially equal relatively to each other, wherein first and second electrically conducting vias are respectively electrically connected to first and second portions of a metal line of a penultimate level of electrical interconnections, and wherein an empty space formed in a first inter-metal dielectric layer surrounds the first electrically conducting via and extends under the infrared heat detector.

METHOD AND GAS ANALYSIS UNIT FOR DETERMINING A CHANCE TO ENABLE A ZEROING OF GAS ANALYSIS

A method for determining a chance to enable a zeroing of gas analysis is disclosed herein. The method includes emitting radiation, and receiving emitted radiation, the received radiation comprising a first wavelength range absorbed by the at least one desired gas component and one or more disturbing factor, and a second wavelength range absorbed by the disturbing factor, the first wavelength range differing from the second wavelength range. The method also includes providing to a processing unit a first signal data indicative of a concentration of the at least one desired gas component and absorption of the disturbing factor, and a second signal data indicative of absorption of the disturbing factor. The method also includes determining a stability of the first and second signal data as a function of time, and if they are substantially stable enabling the zeroing to improve a measurement accuracy. 1. A method for determining a chance to enable a zeroing of gas analysis , said gas analysis unit being configured outside the zeroing to obtain a signal indicative of at least one desired gas component of a respiratory gas for an analysis , said method comprising:emitting radiation by means of at least one radiation source;receiving emitted radiation in at least one radiation sensing detector, said received radiation comprising a first wavelength range configured to be absorbed by said at least one desired gas component of the respiratory gas in case such gas component is present to the extent exceeding a reference gas concentration, which first wavelength range also being absorbed by one or more disturbing factor, in case such factor is present, and a second wavelength range configured to be absorbed by said disturbing factor, said first wavelength range differing from said second wavelength range;providing by means of said at least one radiation sensing detector to a processing unit a first signal data indicative of a concentration of said at least one desired gas ...

Optical layered structure, manufacturing method, and use

The present publication describes a heat-resistant optical layered structure, a manufacturing method for a layered structure, and the use of a layered structure as a detector, emitter, and reflecting surface. The layered structure comprises a reflecting layer, an optical structure on top of the reflecting layer, and preferably shielding layers for shielding the reflecting layer and the optical structure. According to the invention, the optical structure on top of the reflecting layer comprises at least one partially transparent layer, which is optically fitted at a distance to the reflecting layer.

APPARATUS AND METHOD FOR VALIDATING LEAK SURVEY RESULTS

An apparatus and method for validating a leak survey result obtained from an Optical Gas Imaging (OGI) device is proposed. The validation system is coupled to a gas detection infrared thermography camera that captures the infrared image of a scene which may or may not include a gas plume. The validation system performs operations to validate the leak survey result, which includes acquiring a background temperature of each pixel of the infrared image of the scene, acquiring a temperature of the gas plume or ambient air from a temperature sensor that is coupled to the validation system, calculating a temperature difference of said each pixel between the background temperature of said each pixel and the temperature of the gas plume or ambient air, comparing the temperature difference of said each pixel to a predetermined threshold value, and determining whether the leak survey result of the infrared thermography camera is valid based on the temperature difference of said each pixel. 1. An optical gas imaging (OGI) leak survey system , comprising:an infrared (IR) thermography camera capable of capturing an infrared image of a gas plume, a leak survey result being obtained from the infrared image of the gas plume;a temperature sensor to measure a temperature of the gas plume or ambient air; anda validation system for validating the leak survey result obtained from the infrared image, the validation system coupled to the infrared thermography camera and coupled to the temperature sensor, the validation system including a machine readable storage medium that provides instructions that cause a machine apparatus to perform operations to validate the leak survey result, the operations comprising:acquiring an apparent temperature of each pixel of the infrared image of a scene;acquiring a temperature of the gas plume or ambient air from the temperature sensor;calculating a temperature difference of said each pixel between the apparent temperature of said each pixel and the ...

AUTO DETECTION SYSTEM BASED ON THERMAL SIGNALS

There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor. 1. An auto detection system , comprising:an elevator cabin;at least one thermal detection device configured to output digital values and object temperatures at a predetermined frequency; and calculate a slope between two digital values,', 'calculate a fluctuation degree of multiple digital values,', 'calculate a temperature variation of the object temperatures, and', 'identify whether the elevator cabin has a person therein or not according to the slope, the fluctuation degree and the temperature variation., 'a host receiving the digital values and the object temperatures, and configured to'}2. The auto detection system as claimed in claim 1 , wherein the at least one thermal detection device comprises:a single thermopile sensor configured to generate a voltage signal at the predetermined frequency; andan analog to digital converter configured to convert the voltage signal to the digital signals.3. The auto detection system as claimed in claim 1 , wherein the at least one thermal detection device comprises:a thermopile sensor array comprising a pixel array configured to generate multiple voltage signals;an addition circuit configured to perform binning on the multiple voltage signals to generate a voltage sum; andan analog to digital converter configured to convert the voltage sum to the digital signals.4. The auto detection system as claimed in claim 1 , wherein the host iscoupled with an indication device for indicating whether the elevator cabin has a person therein or not via the indication device, orcoupled ...

INFRARED SENSOR ARRAYS FOR MONITORING VEHICLE OCCUPANTS AND WINDOWS

Method and apparatus are disclosed for infrared sensor arrays for monitoring vehicle occupants and windows. An example vehicle includes a side window and an infrared sensor array. The infrared sensor array includes first pixels of measurement resolution to monitor an occupant and second pixels of measurement resolution to monitor the side window. The example vehicle also includes a cabin environment controller to detect, via the first pixels, whether a body temperature of the occupant is outside a predetermined temperature range and detect, via the second pixels, whether fog is on the side window. 1. A vehicle comprising:a side window;an infrared sensor array including first pixels of measurement resolution to monitor an occupant and second pixels of measurement resolution to monitor the side window; and detect, via the first pixels, whether a body temperature of the occupant is outside a predetermined temperature range; and', 'detect, via the second pixels, whether fog is on the side window., 'a cabin environment controller to2. The vehicle of claim 1 , wherein the cabin environment controller selects the first pixels and the second pixels of the infrared sensor array based on a location of the occupant relative to the side window.3. The vehicle of claim 2 , wherein the cabin environment controller detects the location of the occupant based on a temperature map determined via the infrared sensor array.4. The vehicle of claim 3 , wherein the first pixels selected by the cabin environment controller have a temperature value that is greater than or equal to a body temperature threshold.5. The vehicle of claim 4 , wherein the second pixels selected by the cabin environment controller have a temperature value that is less than the body temperature threshold.6. The vehicle of claim 2 , further including a camera to detect the location of the occupant.7. The vehicle of claim 1 , further including an HVAC system in communication with the cabin environment controller claim ...

DISPLAY VIEWING DETECTION

In embodiments of display viewing detection, a presence module, implemented on an electronic device, enables a first sensor to detect an object responsive to detecting audio via one or more microphones of the electronic device. The first sensor generates data that is used by the presence module to determine that the object is within a viewing range of the electronic device and that movement of the object is below a predetermined threshold. The presence module then enables at least a second sensor to confirm the object is viewing a display of the electronic device. When the object is detected by the second sensor, the presence module enables the display for viewing by the object. 1. A method comprising:enabling, at an electronic device, a first sensor to detect an object responsive to detecting audio via one or more microphones of the electronic device;determining that the object is within a viewing range of the electronic device based at least in part on data received from the first sensor;determining that movement by the object is below a predetermined threshold based at least in part on the data received from the first sensor;enabling at least one second sensor to confirm the object is viewing a display of the electronic device; andenabling the display of the electronic device for viewing by the object when the object is detected by the second sensor.2. The method as recited in claim 1 , wherein prior to detecting the audio claim 1 , the method further comprises determining that the electronic device is stationary based on data received from an accelerometer claim 1 , wherein the first sensor and the second sensor are disabled when the electronic device is stationary.3. The method as recited in claim 1 , wherein the first sensor comprises a wide-beam heat sensor.4. The method as recited in claim 3 , wherein the wide-beam heat sensor comprises multiple heat sensors.5. The method as recited in claim 4 , further comprising adjusting a coverage of the wide-beam heat ...

Ir sensor system, ir sensor module, temperature detection module and corresponding calibration method

An IR sensor system, an IR sensor module, a temperature detection module and a corresponding calibration method are provided. The IR sensor system has an IR sensor module including a pixelated IR detection area, which has a first control unit for controlling an IR measuring operation and a calibration operation, and a storage unit connected to it, and including a temperature detection module which is detectable in a pixel subarea of the IR detection area, the temperature detection module having a temperature sensor device and a second control unit connected to it. The geometric position of the pixel subarea on the IR detection area is storable in the storage unit.

Device for radiating or receiving electromagnetic waves

The present invention relates to a device for radiating or receiving an electromagnetic wave. The device includes a substrate including a recess coated by a material that reflects the electromagnetic wave, a metal portion that radiates or receives the electromagnetic wave, and an electronic element connected to the metal portion on the substrate. The metal portion includes a portion provided above an opening of the recess and a portion which is located on the substrate and connected to the electronic element.

Systems and methods for thermal imaging of rf signals

Illustrative embodiments disclosed herein pertain to a thermal imaging system that includes a thermal imaging sheet having an array of thermal unit cells for generating a thermal footprint in response to receiving an RF signal. The thermal footprint is composed of an array of hotspots having a first set of hotspots indicative of a radiation characteristic of a first polarization component of the RF signal, and a second set of hotspots indicative of a radiation characteristic of a second polarization component of the RF signal. Each thermal unit cell includes a first RF antenna and a second RF antenna oriented orthogonal with respect to each other. The first RF antenna includes a terminating resistor that generates a hotspot among the first set of hotspots and the second RF antenna includes another terminating resistor that generates a hotspot in the second set of hotspots.

THREAT DETECTION

A method of threat detection includes illuminating a scene with short-wavelength infrared (SWIR) illumination and receiving a return of the SWIR illumination reflected back from the scene. The method includes analyzing the return of the SWIR illumination to detect presence of man-made optics in the scene. Illuminating, receiving, and analyzing can be performed by a device, e.g., a rifle-mounted laser device. 1. A method of threat detection comprising:illuminating a scene with pulsed short-wavelength infrared (SWIR) illumination;receiving SWIR illumination reflected back from the scene with a receiving device configured to detect pulsed SWIR illumination;analyzing the received SWIR illumination; andattributing the presence of man-made optics in the scene to the received SWIR illumination, wherein illuminating, receiving, and analyzing are performed by a single rifle-mounted laser device.23-. (canceled)4. The method as recited in claim 1 , wherein the receiving is performed by a SWIR-sensitive focal plane array (FPA) of a receiving device that is operatively connected to a module for pixel-wise processing of the received SWIR illumination.5. The method as recited in claim 4 , wherein the illuminating is performed by a SWIR illumination source configured to emit pulsed SWIR illumination claim 4 , wherein the receiving device is configured to detect pulsed SWIR illumination.6. The method as recited in claim 5 , wherein the illuminating the scene and receiving the return are performed with the SWIR illumination source synchronized with the receiving device for pulse detection in the SWIR illumination reflected from the scene.7. The method as recited in claim 5 , wherein the illuminating the scene and receiving are performed with the SWIR illumination source and receiving device asynchronously claim 5 , wherein the receiving device has a scan rate high enough to continuously detect illumination pulses and perform synchronization in post-process calculation.8. The method ...

SENSOR ASSEMBLY

A sensor assembly includes: a sensor including pixels that are aligned in a predetermined direction, the pixels being for detecting an electromagnetic wave; and a lens that forms, in a detector plane on the sensor, an image according to the electromagnetic wave, wherein the lens has an f-number in a first direction and an f-number in a second direction, the f-number in the first direction being different from the f-number in the second direction, the first direction being orthogonal to the predetermined direction in a plane parallel to the detector plane, and the second direction being the predetermined direction. For example, the f-number of the lens in the first direction is smaller than the f-number of the lens in the second direction. 1. A sensor assembly comprising:a line sensor including a plurality of pixels that are aligned in a predetermined direction, the plurality of pixels being for detecting an electromagnetic wave; andan imaging optics that forms, in a detector plane on the plurality of pixels, an image according to the electromagnetic wave,wherein the imaging optics has an f-number in a first direction that is smaller than an f-number in a second direction, the first direction being orthogonal to the predetermined direction in a plane parallel to the detector plane, and the second direction being the predetermined direction.2. (canceled)3. The sensor assembly according to claim 1 ,wherein the imaging optics includes a lens, andthe lens has an f-number in the first direction that is smaller than an f-number of the lens in the second direction.4. The sensor assembly according to claim 3 ,wherein the lens has a width in the first direction that is larger than a width of the lens in the second direction.5. The sensor assembly according to claim 3 ,wherein the lens has different cross-sectional shapes in a plane orthogonal to the first direction and in a plane orthogonal to the second direction.6. The sensor assembly according to claim 3 ,wherein the lens ...

Thermal image sensing system and thermal image sensing method

A thermal image sensing system including at least one thermal sensor, at least one light sensor, an image identification module, a storage module and a computing module is provided. The thermal sensor senses thermal radiation emitted by an object and generates a thermal radiation image signal correspondingly. The light sensor senses visible light reflected by the object and generates at least one visible light image signal correspondingly. The image identification module receives the visible light image signal generated by the light sensor and determines a material of the object according to the at least one visible light image signal. The storage module stores a radiation coefficient of the material of the object. The computing module calculates a surface temperature of the object according to the radiation coefficient of the material of the object and the thermal radiation emitted by the object. A thermal image sensing method is also provided.

METHOD AND GAS ANALYSIS UNIT FOR DETERMINING A CHANCE TO ENABLE A ZEROING OF GAS ANALYSIS

A method for determining a chance to enable a zeroing of gas analysis is disclosed herein. The method includes emitting radiation, and receiving emitted radiation, the received radiation comprising a first wavelength range absorbed by the at least one desired gas component and one or more disturbing factor, and a second wavelength range absorbed by the disturbing factor, the first wavelength range differing from the second wavelength range. The method also includes providing to a processing unit a first signal data indicative of a concentration of the at least one desired gas component and absorption of the disturbing factor, and a second signal data indicative of absorption of the disturbing factor. The method also includes determining a stability of the first and second signal data as a function of time, and if they are substantially stable enabling the zeroing to improve a measurement accuracy. 1. A method for determining when to enable a zeroing of gas analysis during ventilation of a patient , said gas analysis unit being configured outside the zeroing to obtain a signal indicative of at least one desired gas component of a respiratory gas for an analysis , said method comprising:emitting radiation by means of at least one radiation source;receiving emitted radiation in at least one radiation sensing detector, said received radiation comprising a first wavelength range configured to be absorbed by said at least one desired gas component of the respiratory gas in case such gas component is present to the extent exceeding a reference gas concentration, which first wavelength range also being absorbed by one or more disturbing factor, in case such factor is present, and a second wavelength range configured to be absorbed by said disturbing factor but not to be absorbed by said at least one desired gas component of the respiratory gas, said first wavelength range differing from said second wavelength range;providing by means of said at least one radiation sensing ...

SYSTEM AND METHOD FOR MONITORING ABNORMAL BEHAVIOR

A system for monitoring abnormal behavior includes a distribution sensing unit and a controlling unit. The controlling unit is electrically connected to the distribution sensing unit. The distribution sensing unit is configured to sense a change of a temperature of a target object in the monitoring area according to a background temperature value and output distribution data of the temperature change. The controlling unit is configured to receive and analyze the distribution data of the temperature change to identify a behavior of the target object. 1. A system for monitoring abnormal behavior , comprising:a distribution sensing unit configured to sense a change of a temperature of a target object in a monitoring area according to a background temperature value and output distribution data of the temperature change; anda controlling unit electrically connected to the distribution sensing unit, the controlling unit configured to receive and analyze the distribution data of the temperature change to identify a behavior of the target object.2. The system of claim 1 , further comprising:a background sensing unit electrically or wirelessly connected to the distribution sensing unit and configured to sense the monitoring area and generate a sensing signal, wherein the distribution sensing unit is further configured to receive the sensing signal and adjust the background temperature value according to the sensing signal.3. The system of claim 2 , wherein the background sensing unit comprises a temperature sensor claim 2 , the background sensing unit senses a temperature of the monitoring area claim 2 , the distribution sensing unit receives temperature data in the monitoring area sensed by the background sensing unit and adjusts the background temperature value according to the temperature data.4. The system of claim 2 , wherein the background sensing unit comprises a humidity sensor claim 2 , the background sensing unit senses a humidity of the monitoring area claim 2 , ...

INFRARED SENSOR

Provided is an infrared sensor which is capable of measuring a temperature of an object to be measured with high accuracy even when lead wires are connected to one side thereof. The infrared sensor includes an insulating film; a first and a second heat sensitive element which are provided on one face of the insulating film; a first and a second wiring film that are respectively connected to the first and the second heat sensitive element; an infrared reflecting film; a plurality of terminal electrodes; and a thermal resistance adjusting film which is provided on the other face of the insulating film, is in opposition to at least a portion of the longer one of the first or the second wiring film in wiring distance from the terminal electrodes, and is formed of a material with greater heat dissipation than the insulating film. 1. An infrared sensor comprising:an insulating film;a first heat sensitive element and a second heat sensitive element provided on one face of the insulating film so as to he spaced apart from one another;a first conductive wiring film and a second conductive wiring film that are formed on one surface of the insulating film and are respectively connected to the first heat sensitive element and the second heat sensitive element;an infrared reflecting film provided on the other face of the insulating film so as to face the second heat sensitive element;a plurality of terminal electrodes which are provided on the same end side of the insulating film and are connected to the corresponding first wiring film and second wiring film; anda thermal resistance adjusting film which is provided on the other face of the insulating film, is in opposition to at least a portion of the longer one of the first wiring film or the second wiring film in wiring distance from the terminal electrodes, and is formed of a material with greater heat dissipation than the insulating film.2. The infrared sensor according to claim 1 , wherein the thermal resistance adjusting ...

BOLOMETER

A bolometer is described. A bolometer includes a superconductor-insulator-semiconductor-superconductor structure or a superconductor-insulator-semiconductor-insulator-superconductor structure. The semiconductor comprises an electron gas in a layer of silicon, germanium or silicon-germanium alloy in which valley degeneracy is at least partially lifted. The insulator or a one or both of the insulators may comprise a layer of dielectric material. The insulator or a one or both of the insulators may comprise a layer of non-degenerately doped semiconductor. 1. A bolometer comprising a superconductor-insulator-semiconductor-superconductor structure or a superconductor-insulator-semiconductor-insulator-superconductor structure , wherein the semiconductor comprises an electron gas in a layer of silicon , germanium or silicon-germanium alloy in which valley degeneracy is at least partially lifted.2. A bolometer according to claim 1 , wherein the layer of silicon claim 1 , germanium or silicon-germanium is strained.3. A bolometer according to claim 1 , wherein the silicon claim 1 , germanium or silicon-germanium layer comprises a layer of n-type silicon claim 1 , germanium or silicon-germanium.4. A bolometer according to claim 3 , wherein the silicon claim 3 , germanium or silicon-germanium layer is doped to a concentration of at least 1×10cm.5. A bolometer according to claim 1 , wherein the silicon claim 1 , germanium or silicon-germanium layer has a thickness of no more than 100 nm.6. A bolometer according to claim 1 , wherein the silicon claim 1 , germanium or silicon-germanium layer includes a delta-doped layer.7. A bolometer according to claim 1 , wherein the silicon claim 1 , germanium or silicon-germanium layer includes a quantum well.8. A bolometer according to claim 1 , wherein the insulator or a one of or both insulators comprises a layer of dielectric material.9. A bolometer according to claim 8 , wherein the dielectric material comprises an oxide.10. A bolometer ...

INFRARED SENSING DEVICES AND METHODS

An infrared sensor assembly for sensing infrared radiation comprises infrared sensing elements and the infrared sensing compensation elements that are different so that, for a same flux on the infrared sensing elements and the infrared sensing compensation elements, the radiation responsive element of the infrared sensing elements absorbs more radiation than the radiation responsive element of the infrared sensing compensation elements, as to receive substantially more radiation than the radiation responsive element of the infrared sensing compensation elements. An output of the sensor array is a subtractive function of a sum of the signals of the plurality of infrared sensing elements and a sum of the signals of the plurality of the infrared sensing compensation elements such that at least linear and/or non-linear parasitic thermal fluxes are at least partly compensated for. 1. An infrared sensor assembly for sensing infrared radiation from an object , the infrared sensor assembly comprising: at least two infrared sensing elements, each infrared sensing element having a radiation responsive element providing a proportionate electrical signal in response to infrared radiation incident thereto; and responsive to parasitic thermal fluxes,', 'at least two infrared sensing compensation elements, at least one of said infrared sensing compensation elements being interspersed among the at least two infrared sensing elements, each of said two infrared sensing compensation elements having a radiation responsive element providing a proportionate electrical signal in response to infrared radiation incident thereto and responsive to parasitic thermal fluxes, and, 'a sensor array comprising a plurality of sensing elements, provided on or embedded in a substrate extending in a substrate plane, wherein the sensor array comprisesthe infrared sensing elements and the infrared sensing compensation elements being different so that, for a same flux on the infrared sensing elements and ...

THERMAL DETECTOR ARRAY CONFIGURED TO DETECT THERMAL RADIATION FROM THE INTEGRATED CIRCUIT

An apparatus is disclosed that comprises an integrated circuit and a thermal detector array configured to detect thermal radiation from the integrated circuit. A method is disclosed that comprises providing an integrated circuit and disposing a thermal detector array so as to detect thermal radiation from the integrated circuit. Another apparatus is disclosed that comprises means for processing and means for detecting thermal radiation from the means for processing. 12-. (canceled)3. An apparatus comprising:an integrated circuit substrate;an integrated circuit, wherein the integrated circuit is disposed on a top surface of the integrated circuit substrate;a thermal detector array substrate;a thermal detector array configured to detect thermal radiation from the integrated circuit, wherein the thermal detector array is disposed on a bottom surface of the thermal detector array substrate; andone or more spacers disposed on the top surface of the integrated circuit substrate;wherein the one or more spacers are disposed between the top surface of the integrated circuit substrate and the bottom surface of the thermal detector array substrate.4. The apparatus of claim 3 , wherein a distance between a top surface of the integrated circuit and a bottom surface of the thermal detector array is within a range of distances between twenty micrometers and one-thousand micrometers.5. An apparatus comprising:an integrated circuit substrate;an integrated circuit, wherein the integrated circuit is disposed on a top surface of the integrated circuit substrate;a thermal detector array substrate;a thermal detector array configured to detect thermal radiation from the integrated circuit; andone or more conductive couplings disposed between the integrated circuit substrate and the thermal detector array substrate;wherein the one or more conductive couplings are configured to conduct a thermal detection signal from the thermal detector array substrate to the integrated circuit substrate, ...

TRAJECTORY TRACKING USING LOW COST OCCUPANCY SENSOR

A system and method for tracking a trajectory of a target within a space. The system and method determining a current time instant, detecting a movement of at least one target in a space at the current time instant to generate a current sensor measurement, and determining a current state of the at least one target based on the current sensor measurement. 1. A method for tracking a trajectory of a target within a space , comprising:receiving a space layout of the space including locations of a plurality of sensors in the space;determining an initial state of the plurality of sensors at an initial time instant by detecting movement of at least one target in the space at the initial time instant based on initial sensor measurements of each of the plurality of sensors;determining a current state of the plurality of sensors at a current time instant based on current sensor measurements of each of the plurality of sensors; andtracking a trajectory of the at least one target in the space based on the initial state or a previous state and the current state of the plurality of sensors and the space layout.2. (canceled)3. The method of claim 1 , further comprising:analyzing a distance of travel of the at least one target between the current state and a previous state based on the sensor measurements.4. The method of claim 1 , further comprising:generating a graphical representation of the space based on the space layout and legitimate paths of travel of a target through the space.5. The method of claim 4 , wherein the space layout includes one of walls claim 4 , an entry point into the space claim 4 , and obstructions in the space.6. (canceled)7. The method of claim 1 , further comprising:generating a lighting response based on the current state of each of the plurality of sensors, wherein the light response mitigates false negatives and positives using the legitimate paths of travel through the space.8. A system for tracking a trajectory of a target within a space claim 1 , ...

INFRARED SENSOR ARRAY WITH ALTERNATING FILTERS

Improved techniques for thermal imaging and gas detection are provided. In one example, a system includes a first set of filters configured to pass first filtered infrared radiation comprising a first range of thermal wavelengths associated with a background portion of a scene. The system also includes a second set of filters configured to pass second filtered infrared radiation comprising a second range of thermal wavelengths associated with a gas present in the scene. The first and second ranges are independent of each other. The system also includes a sensor array comprising adjacent infrared sensors configured to separately receive the first and second filtered infrared radiation to capture first and second thermal images respectively corresponding to the background portion and the gas. Additional systems and methods are also provided. 1. A system comprising:a first set of filters configured to pass first filtered infrared radiation comprising a first range of thermal wavelengths associated with a background portion of a scene;a second set of filters configured to pass second filtered infrared radiation comprising a second range of thermal wavelengths associated with a gas present in the scene, wherein the first and second ranges are independent of each other; anda sensor array comprising adjacent infrared sensors configured to separately receive the first and second filtered infrared radiation to capture first and second thermal images respectively corresponding to the background portion and the gas.2. The system of claim 1 , wherein:the first and second filters are arranged in an alternating checkerboard pattern; andthe adjacent infrared sensors are configured to separately receive the first and second filtered infrared radiation according to the checkerboard pattern.3. The system of claim 2 , wherein the checkerboard pattern aligns the first and second thermal images with each other to remove parallax between the first and second thermal images.4. The system ...

THz RADIATION DETECTION IN STANDARD CMOS TECHNOLOGIES BASED ON THERMIONIC EMISSION

A detector of terahertz (THz) energy includes a MOSFET having an extended source region, and a channel region depleted of free carriers, which MOSFET operates in a sub-threshold voltage state and has an output that is an exponential function of THz energy supplied to the gate. 1. A detector of terahertz (THz) energy configured to operate in a thermionic emission mode and comprising:a MOSFET having an extended source region, a channel region controlled by a gate, and a drain region;a gate-to-source voltage source configured to deplete the channel region of free carriers thereby placing the MOSFET in a sub-threshold voltage state; andsaid MOSFET being configured to operate in said thermionic emission mode to provide an output that is a measure of THz energy supplied to the gate.2. The detector of in which the output is an exponential function of the THz energy supplied to the gate.3. The detector of in which the output increases with increase of a size of the source region.4. The detector of in which the output increases with increase of a resistance of the source region.5. The detector of further including at least one THz antenna responsive to said THz energy and coupled with said gate.6. The detector of further including additional MOSFETs arranged in a detector array and configured to provide an image of an object traversed by or emitting the THz energy.7. The detector of in which the MOSFET is configured to operate in a photo-voltaic readout mode in which the detector output is integrated over selected time intervals to form a time succession of integrated detector output signals.8. The detector of including a readout resistor configured to convert drain-source current of the MOSFET to an output voltage.9. The detector of further including a communication network configured to supply information-modulated THz energy to the detector.10. The detector of in which the MOSFET is configured to provide spectral information regarding the THz energy.11. The detector of ...

Gas detector

A gas detector includes: an infrared camera that images a gas; and a controller including at least an electronic component, wherein the controller determines a temperature range of the infrared camera in which the gas can be imaged, and detects the gas from moving infrared images taken for a predetermined period of time in the temperature range determined.

INFRARED PHOTODETECTION SYSTEM

An infrared photodetection system is provided that is capable of measuring infrared light up to high-temperature regions while improving a temperature resolution for low-temperature regions without increasing image-acquisition time even if the measuring temperature range varies. The infrared photodetection system is set up to exhibit sensitivity spectrum SSP for high sensitivity (for low temperature use) and sensitivity spectrum SSP for low sensitivity (for high temperature use) in the transmission band of the bandpass filter when different voltages are applied to a quantum-dot infrared photodetector. The infrared photodetection system then integrates temperature data for the infrared light detected using sensitivity spectrum SSP and temperature data for the infrared light detected using sensitivity spectrum SSP, in order to output a temperature distribution in a measurement region. 2. The infrared photodetection system according to claim 1 , wherein the intensity distribution output means outputs the intensity distribution based also on data obtained through detection in a third state in which the photoelectric conversion elements have a detection sensitivity that is intermediate between a detection sensitivity in the first state and a detection sensitivity in the second state.3. The infrared photodetection system according to claim 1 , wherein the photoelectric conversion elements are adjustable in terms of sensitivity and a center wavelength and full width at half maximum of the infrared light absorption spectra by adjusting an applied voltage for each element.4. The infrared photodetection system according to claim 1 , further comprising a conversion unit configured to convert the intensity distribution outputted by the intensity distribution output means to a temperature distribution.5. The infrared photodetection system according to claim 4 , wherein the conversion unit stores therein coefficients of a prescribed function that approximates a sensitivity ...

Method for making a device for detecting electromagnetic radiation comprising a layer of getter material

A method makes an electromagnetic radiation detecting device including at least one thermal detector with an absorbent membrane suspended above a substrate, intended to be located in a sealed cavity. The method includes depositing, on the substrate, a gettering metallic layer including a metallic material with a gettering effect; depositing a carbonaceous sacrificial layer of amorphous carbon on the gettering metallic layer; depositing at least one sacrificial mineral layer on the carbonaceous sacrificial layer; chemical-mechanical planarization of the sacrificial mineral layer; fabricating the thermal detector so that the absorbent membrane is produced on the sacrificial mineral layer; removing the sacrificial mineral layer; and removing the carbonaceous sacrificial layer.

SENSOR CONTROL METHOD EXECUTED BY AIR-CONDITIONING APPARATUS

A sensor control method that is executed by an air-conditioning apparatus includes: acquiring a first thermal image by scanning an air-conditioned space using the infrared sensor in accordance with a first scanning scheme, the air-conditioning apparatus being placed in the air-conditioned space; extracting a subject thermal image from the first thermal image, based on a difference between a background thermal image of the air-conditioned space when no subject is present therein and the first thermal image; determining a second scanning scheme different from the first scanning scheme, when the subject thermal image has a size smaller than a threshold size; and acquiring a second thermal image by scanning an area corresponding to the subject thermal image of the air-conditioned space using the infrared sensor in accordance with the determined second scanning scheme. 1. A sensor control method executed by an air-conditioning apparatus including a linear infrared sensor that includes a plurality of infrared light-receiving elements , the sensor control method comprising:acquiring, as a first thermal image, at least one of a thermal image of a first area by scanning the first area in an air-conditioned space using the infrared sensor and a thermal image of a second area by scanning the second area in the air-conditioned space using the infrared sensor, wherein the first area is different from the second area and wherein the air-conditioning apparatus is placed in the air-conditioned space; anddetermining whether a subject thermal image is detected in the first thermal image, based on a difference between a background thermal image of the air-conditioned space when no subject is present therein and the first thermal image,wherein when it is determined that the subject thermal image is not detected in the thermal image of the first area as first thermal image, or when predetermined control information is received from a remote controller, the thermal image of the second ...

GAS TURBINE ENGINE OPTICAL SYSTEM

A turbine engine optical system includes a plurality of viewing ports in an engine case that are circumferentially spaced from one-another. At least one optical device is optically coupled to the ports for viewing an internal chamber defined by the engine case and for depicting at least spatial temperature distributions. The chamber may be an exhaust chamber and the controller may have the capability to correlate events in the exhaust chamber to events in an upstream combustor chamber and may thereby adjust operating parameters of a fuel system of the combustor. 1. A turbine engine optical system comprising:a plurality of viewing ports in and circumferentially spaced about an engine case located downstream of a combustor section for depicting the spatial temperature distribution in an annular exhaust chamber defined between the engine case and an exhaust cone; andat least one optical device constructed and arranged to receive depictions through the plurality of viewing ports to detect at least exhaust temperature distributions.2. The turbine engine optical system set forth in further comprising:a controller for receiving an depiction input signal from the at least one optical device, analyzing the input signal, and outputting a control signal to control a parameter affecting combustion in a combustion chamber of the combustor section.3. The turbine engine optical system set forth in claim 2 , wherein the control signal controls a fuel pump of a fuel system.4. The turbine engine optical system set forth in claim 2 , wherein the control signal controls a fuel flow control valve of a fuel system.5. The turbine engine optical system set forth in claim 2 , wherein the control signal controls combustor air flow in a fuel-air mixer.6. The turbine engine optical system set forth in further comprising:a controller for receiving an depiction input signal from the at least one optical device, analyzing the input signal, and storing the data for future reference.7. The turbine ...

THERMAL INFRARED DETECTOR AND MANUFACTURING METHOD FOR THERMAL INFRARED DETECTOR

In a thermal infrared detector having trench structures, at least one sensor element is provided between the trench structures, an etching hole through which the sensor element is hollowed out and thereby thermally insulated is provided in a substrate rear surface or on the periphery of a pixel area, and an opening portion is provided below the pixel area. 1. A thermal infrared detector having trench structures , wherein at least one sensor element is provided between the trench structures ,an etching hole through which the sensor element is hollowed out and thereby thermally insulated is provided in a substrate rear surface or on the periphery of a pixel area, andan opening portion is provided below the pixel area.2. The thermal infrared detector according to claim 1 , wherein the trench structure is provided directly below a wire for connecting the sensor element to a peripheral circuit.3. The thermal infrared detector according to claim 1 , wherein a high thermal conductivity material is provided in the interior of the trench structure.4. The thermal infrared detector according to claim 2 , wherein a high thermal conductivity material is provided in the interior of the trench structure.5. The thermal infrared detector according to claim 1 ,comprising an infrared ray absorbing film provided on a rear surface of the sensor element.6. The thermal infrared detector according to claim 2 ,comprising an infrared ray absorbing film provided on a rear surface of the sensor element.7. The thermal infrared detector according to claim 3 ,comprising an infrared ray absorbing film provided on a rear surface of the sensor element.8. The thermal infrared detector according to claim 1 ,comprising an infrared ray reflecting film provided on a side wall of the trench structure.9. The thermal infrared detector according to claim 2 ,comprising an infrared ray reflecting film provided on a side wall of the trench structure.10. The thermal infrared detector according to claim 3 , ...

DUAL INFRARED BAND APPARATUS AND METHOD FOR THERMALLY MAPPING A COMPONENT IN A HIGH TEMPERATURE COMBUSTION ENVIRONMENT

Apparatus and method for thermally mapping a component in a high temperature environment. An optical probe () has a field of view () arranged to encompass a surface of a component () to be mapped. The probe () captures infrared (IR) emissions in the near or mid IR band. An optical fiber () has a field of view to encompass a spot location () on the surface of the component within the field of view () of the probe (). The fiber () captures emissions in the long IR band. The emissions in the long IR band are indicative of an emittance value at the spot location. This information may be used to calibrate a radiance map of the component generated from the emissions in the near or mid IR band and thus map the absolute temperature of the component regardless of whether the component includes a TBC. 1. An apparatus comprising:an optical probe housed in a viewing tube, the optical probe having a field of view arranged to encompass a surface of a component to be thermally mapped in a high temperature combustion environment of a turbine engine, the optical probe effective to capture infrared (IR) emissions comprising a first band in an IR spectrum, wherein the first band in the IR spectrum comprises a near IR wavelength or comprises a mid IR wavelength, wherein the component of the turbine engine comprises a thermal barrier coating (TBC) subject to emittance variation in the combustion environment of the turbine engine; andan optical fiber housed in the viewing tube, a field of view of the optical fiber arranged to encompass a spot location on the surface of the component disposed within the field of view of the optical probe, the optical fiber effective to capture IR emissions comprising a second band in the IR spectrum, wherein the second band in the IR spectrum comprises a long IR wavelength effective to measure with a higher degree of accuracy emittance values from the TBC than the wavelengths in the first band, the IR emissions in the second band in the IR spectrum ...

Temperature estimation method of high temperature member, content estimation method of tetragonal-prime phase, and deterioration determination method

A temperature estimation method includes the steps of measuring a content of a tetragonal-prime phase included in a coating layer formed on a surface of a high temperature member by X-ray diffraction or Rietveld analysis, Raman spectroscopy, or the like; and estimating a surface temperature of the high temperature member based on the estimated content of the tetragonal-prime phase.

Tailgate detection using infra-red beams

A system, for calculating an object location within a portal, includes a portal map formed by a plurality of infra-red beams. The system further includes a broken beam detector for detecting and recording, in response to an object moving through the portal map, data indicative of one or more broken beams of the plurality of infra-red beams. The data includes first data indicative of an initial position of the object within the portal, second data indicative of a subsequent position of the object within the portal, and third data including one or more time records. The system also includes at least one broken beam analyzer for obtaining the data from the broken beam detector, the broken beam analyzer calculating the object location based on at least one of the first data, the second data, and the third data.

THERMAL INFRARED SENSOR ARRAY IN WAFER-LEVEL PACKAGE

A thermal infrared sensor array in a wafer-level package includes at least one infrared-sensitive pixel produced using silicon micro mechanics, comprising a heat-isolating cavity in a silicon substrate surrounded by a silicon edge, and a thin membrane connected to the silicone edge by of thin beams. The cavity extends through the silicon substrate to the membrane, and there are slots between the membrane, the beams and the silicon edge. A plurality of infrared-sensitive individual pixels are arranged in lines or arrays and are designed in a CMOS stack in a dielectric layer, forming the membrane, and are arranged between at least one cover wafer which is designed in the form of a cap and has a cavity and a base wafer. The cover wafer, the silicon substrate and the base wafer are connected to one another in a vacuum-tight manner and enclosing a gas vacuum. 1. A thermal infrared sensor array in wafer-level package comprising at least one infrared-sensitive pixel produced using silicon micromachining , comprising a thermally insulating pit in a silicon substrate , said pit being surrounded by a silicon edge , and comprising a thin membrane connected to the silicon edge by thin beams , wherein the pit extends through the silicon substrate as far as the membrane , wherein slots are situated between the membrane , the beams and the silicon edge , wherein a plurality of infrared-sensitive individual pixels are arranged in linear or array form and are configured in a CMOS stack on a dielectric layer in a manner forming the membrane , and are arranged between at least one cover wafer configured in a cap-like fashion and having a cavity and a base wafer , wherein the at least one cover wafer , the silicon substrate and the base wafer are connected to one another in a vacuum-tight fashion , in a manner enclosing a gas vacuum.2. The thermal infrared sensor array as claimed in claim 1 , wherein the at least one cover wafer comprises an infrared-transmissive material of silicon- ...

METHOD OF IMPROVING THE ACCURACY OF THE TEMPERATURE MEASUREMENT OF THERMAL/INFRARED ARRAY SENSOR

An arrangement for sensing temperatures on a surface includes a thermal/infrared array sensor having a field of view. The thermal/infrared array sensor is positioned such that the surface is within the field of view. A benchmark object has a known temperature. The benchmark object is disposed within the field of view of the thermal/infrared array sensor. An electronic processor is communicatively coupled to the thermal/infrared array sensor and receives a signal from the thermal/infrared array sensor. The signal includes a temperature measurement of the surface and a temperature measurement of the benchmark object. A difference between the temperature measurement of the benchmark object and the known temperature of the benchmark object is calculated. A temperature of the surface is calculated based on the temperature measurement of the surface and the difference between the temperature measurement of the benchmark object and the known temperature of the benchmark object. 1. An arrangement for sensing temperatures on a surface , the arrangement comprising:a thermal/infrared array sensor having a field of view, the thermal/infrared array sensor being positioned such that the surface is within the field of view;a benchmark object having a known temperature, the benchmark object being disposed within the field of view of the thermal/infrared array sensor; and receive a signal from the thermal/infrared array sensor, the signal including a temperature measurement of the surface and a temperature measurement of the benchmark object;', 'calculate a difference between the temperature measurement of the benchmark object and the known temperature of the benchmark object; and', 'calculate a temperature of the surface based on the temperature measurement of the surface and the difference between the temperature measurement of the benchmark object and the known temperature of the benchmark object., 'an electronic processor communicatively coupled to the thermal/infrared array ...

GRAPHENE-BASED INFRARED BOLOMETER

An infrared bolometer. In one embodiment a waveguide configured to transmit infrared radiation is arranged to be adjacent a graphene sheet and configured so that evanescent waves from the waveguide overlap the graphene sheet. The graphene sheet has two contacts connected to an amplifier, and a power detector connected to the amplifier. Infrared electromagnetic power in the evanescent waves is absorbed in the graphene sheet, heating the graphene sheet. The power of Johnson noise generated at the contacts is proportional to the temperature of the graphene sheet. The Johnson noise is amplified and the power in the Johnson noise is used as a measure of the temperature of the graphene sheet, and of the amount of infrared power propagating in the waveguide. 1. An infrared bolometer comprising:a waveguide configured to guide infrared electromagnetic waves, in a mode having an evanescent field extending outside of the waveguide; to be coupled to the evanescent field;', 'to have a temperature, when electromagnetic power in the evanescent field is absorbed by the graphene sheet, corresponding to the amount of electromagnetic power absorbed by the graphene sheet; and', 'to generate thermal noise at the two contacts at a level corresponding to the temperature; and, 'a graphene sheet having two contacts and configureda circuit connected to the two contacts, the circuit configured to measure the thermal noise level.2. The bolometer of claim 1 , further comprising a refrigerator configured to cool the graphene sheet to a temperature below 4 K.3. The bolometer of claim 2 , wherein the refrigerator is a pulse tube refrigerator.4. The bolometer of claim 2 , wherein the refrigerator is a Gifford-McMahon cooler.5. The bolometer of claim 1 , wherein the graphene sheet substantially has the shape of a rectangle claim 1 , the rectangle having a length and a width claim 1 , the length being greater than or equal to the width.6. The bolometer of claim 5 , wherein the length of the rectangle ...

GRAPHENE-BASED BOLOMETER

A bolometer. In one embodiment a graphene sheet is configured to absorb electromagnetic waves. The graphene sheet has two contacts connected to an amplifier, and a power detector connected to the amplifier. Electromagnetic power in the evanescent electromagnetic waves is absorbed in the graphene sheet, heating the graphene sheet. The power of Johnson noise generated at the contacts is proportional to the temperature of the graphene sheet. The Johnson noise is amplified and the power in the Johnson noise is used as a measure of the temperature of the graphene sheet, and of the amount of electromagnetic wave power absorbed by the graphene sheet. 1. A bolometer comprising: to be coupled to received electromagnetic waves;', 'to have a temperature, when electromagnetic power in the received electromagnetic waves is absorbed by the graphene sheet, corresponding to the amount of electromagnetic power absorbed by the graphene sheet; and', 'to generate thermal noise at the first pair of contacts at a level corresponding to the temperature, 'a graphene sheet having a first pair of contacts and configureda Fabry-Perot resonator comprising two mirrors, the graphene sheet being between the two mirrors; anda circuit connected to the first pair of contacts, the circuit configured to measure the thermal noise level.2. The bolometer of claim 1 , further comprising a refrigerator configured to cool the graphene sheet to a temperature below 4 K.3. The bolometer of claim 2 , wherein the refrigerator is a pulse tube refrigerator.4. The bolometer of claim 2 , wherein the refrigerator is a Gifford-McMahon cooler.5. The bolometer of claim 1 , wherein the graphene sheet substantially has the shape of a rectangle claim 1 , the rectangle having a length and a width claim 1 , the length being greater than or equal to the width.6. The bolometer of claim 5 , wherein the length of the rectangle is less than 20 microns.7. The bolometer of claim 5 , wherein the product of the length of the ...

INFRARED DEVICE

An infrared device comprises a substrate (), and arranged on or in the substrate () a configuration () for one of selectively emitting and selectively absorbing infrared radiation of a band, the configuration () comprising a pattern made from an electrically conducting material on a first level (L), an electrically conducting film () on a second level (L), and a dielectric layer () between the pattern and the film (). One or more of a heater () for heating the configuration (), and a thermal sensor () arranged for sensing the selective infrared radiation of the band absorbed by the configuration () on or in the substrate. 1. Infrared device , comprisinga substrate,a recess in the substrate,a membrane spanning at least a portion of the recess, andsupported by the substrate:a configuration for one of selectively emitting and selectively absorbing infrared radiation of a band, the configuration being arranged on or in the membrane and comprising: a pattern made from an electrically conducting material on a first level; an electrically conducting film on a second level; and a dielectric layer between the pattern and the film; andone or more of a heater arranged for heating the configuration to emit the infrared radiation of the band, and a thermal sensor arranged for sensing the selective infrared radiation of the band absorbed by the configuration,whereinthe heater if available, and/or the thermal sensor if available are/is arranged on or in the membrane,the film at least extends over an area of the second level that is defined by a projection of the pattern and gaps in the pattern onto the second level, anda thickness of the dielectric layer between the pattern and the film is less than a center wavelength of the band.231- (canceled)32. The infrared device according to claim 1 , wherein said configuration and said one or more of the heater and the thermal sensor form part of a CMOS-compatible layer stack that is supported by the substrate.33. The infrared device ...

MULTISPECTRAL BAND SENSOR

Devices, methods, systems, and computer-readable media for a multiband detector are described herein. One or more embodiments include a multiband detector designed to detect an emission source including a broadband lens, a broadband detector, and a filter that allows electromagnetic radiation entering the system to be filtered into at least two wavelength bands before contacting the broadband detector wherein one or more wavelength bands are used to determine system functionality and wherein one or more other wavelength bands are used to identify the presence of an emission source having a characteristic particular wavelength or wavelength range. 1. A filter , comprising:wavelength bands to allow electromagnetic radiation entering the filter to be filtered into at least two wavelength ranges before contacting a detector to identify a presence of an emission source having a particular wavelength range.2. The filter of claim 1 , wherein one of the at least two wavelength ranges are used to determine a functionality of a system.3. The filter of claim 1 , wherein the detector is a bolometer that operates over mid-wavelength infrared (MWIR) and long wavelength infrared (LWIR) ranges.4. The filter of claim 1 , wherein the emission source is a flame.5. The filter of claim 1 , wherein one of the wavelength ranges is 4.3 micrometers or 2.7 micrometers.6. The filter of claim 1 , wherein a spectral transmission of the filter is set such that a first wavelength range of electromagnetic radiation from an emission source has a different intensity than a second wavelength range of electromagnetic radiation from the emission source.7. The filter of claim 5 , wherein a first wavelength range and a second wavelength range is used to determine a fail safe condition.8. The filter of claim 1 , wherein the filter includes a narrow band transmission between 4.3 and 4.7 micrometers (μm).9. A system for a multiband detector claim 1 , comprising:a filter to allow a first wavelength band of ...

TWO-WAVEBAND IMAGE ACQUISITION DEVICES AND METHODS OF USE

A method for image acquisition includes receiving, by an image acquisition computing device, a digitized LiDAR image frame and a thermal image frame of a region of interest from a read out integrated circuit of an image acquisition device coupled to the image acquisition computing device. The LiDAR image frame and the thermal image frame are processed to detect one or more objects of interest located in the region of interest. The detected one or more objects of interest are correlated between the LiDAR image frame and the thermal image frame. The detected one or more objects of interest are identified based on the correlation between the LiDAR image frame and the thermal image frame. An integrated LiDAR and thermal image acquisition device is also disclosed. 1. An integrated LiDAR and thermal image acquisition device comprising:an infrared illumination source configured to provide infrared illumination over a region of interest;a photodetector array positioned to receive radiated thermal energy and reflected infrared beams, based on the infrared illumination from the infrared illumination source, reflected off of objects within the region of interest, wherein the photodetector array comprises a plurality of non-silicon photodetectors responsive to infrared and a plurality of non-silicon photodetectors responsive to thermal radiation;a read-out integrated circuit coupled to the photodetector array and configured to generate a LiDAR image frame and a thermal image frame based on signals received from the photodetector array; andan image acquisition device coupled to the read-out integrated circuit, the image acquisition device comprising a computational unit and image storage memory which is configured to receive and operate on a LiDAR region of interest frame and a thermal image region of interest frame.2. The device of claim 1 , wherein the infrared illumination source is a plurality of pulsed laser diodes.3. The device of claim 1 , wherein the infrared ...

Infrared detecting device and infrared detecting element for use in the device

Setting method of non-contact temperature sensor

The present invention relates to a setting method of a non-contact temperature sensor, for simply and easily setting a parameter of the non-contact temperature sensor immediately according to a request of a user, in which the non-contact temperature sensor is installed at a fire prevention area such as a culvert, an electrical room, and a distribution board where a power cable is installed, to sense a sign of an outbreak of fire in a non-contact multi-division manner. To this end, in the present invention, a central processing unit displays an ID setting screen on a display device, stores ID, a maximum sensing temperature of the non-contact temperature sensor and an output limit-setting temperature when measuring an infrared temperature, on and off information of multi-divided array pixels according to the request of the user, and displays the infrared measurement temperature on each of the array pixels on a screen.

Multi-aperture view field partially overlapped dual-band thermal imaging method and device

本发明公开了一种多孔径视场部分重叠的双波段热成像方法与装置。使用本发明能够实现大视场、高分辨、多目多波段信息的互补和丰富，提高目标探测、快速跟踪和识别能力。本发明包括多组单孔径的红外成像探测器组件，其中，相邻单孔径红外成像探测器组件的视场有重叠；所述红外成像探测器组件包括长波探测器组件和中波探测器组件，长波探测器组件和中波探测器组件间隔排列，且同种类的探测器组件呈中心对称分布。视场重叠区域中重叠的探测器越多，则该区域分辨率越高；并且，重叠区域可同时获得长波成像数据和中波成像数据，可充分利用多波段信息的互补和丰富，提高目标探测，快速跟踪和识别能力。

Method for Fabricating Thermal Infrared Sensor Array with Vacuum Filled Wafer Level Enclosure

本発明は、断熱用の空洞１１の上方のスリットを開けられた薄い薄膜５’’のそれぞれの上にセンサーとしての複数の赤外線検知センサー画素５を備えた、カバーウェハ１と中央ウェハ３の少なくとも二つのウェハから構成される特に小さいサイズの真空充填式ウェハレベル筐体によりサーマル赤外線センサーアレーを製作する方法に関する。本発明の課題は、筐体サイズが非常に小さい、特に、全体的な厚さが非常に小さい形で、特に高い空間分解能と非常に高い充填率を達成する、標準的なＣＭＯＳプロセスで安価に製作できる高解像度のサーモパイルアレーセンサーをウェハレベルパッケージによるモノリシックシリコンマイクロメカニックス技術で製作する方法を提示することである。本課題は、先ずは、カバーウェハ１が、赤外線を検知する画素５であるセンサー画素５を有するウェハとして用意された中央ウェハ３とウェハ接合によって機械的に固く接続されることと、次に、中央ウェハ３が、そのウェハの裏側から所与の厚さに薄くされることとによって達成される。

Cross-shaped four-aperture view field partially-overlapped heat-generation-simulating imaging system

本发明公开的一种“十”字型四孔径视场部分重叠仿生热成像系统，属于光电探测和图像处理技术领域。本发明包括探测成像模块、系统供电电源板、FPGA信号处理板、PC机处理显示模块。探测成像模块包括四个单孔径探测成像子模块，每个单孔径探测成像子模块包括光学镜头、探测器及探测器驱动电路板。本发明通过“十”字型四孔径视场部分重叠仿生热成像布局，构造类似人眼视觉的中心高分辨成像、周边大视场搜索的视觉模式，缓减常规热成像系统视场与分辨率的矛盾，并利用“十”字型四孔径视场部分重叠仿生热成像系统实现仿生全偏振热成像或双色热成像，提高光学系统的灵敏度，增强复杂背景下运动目标的探测与识别能力。

Cross-shaped five-aperture view field partially-overlapped bionic thermal imaging system

本发明公开的一种“十”字型五孔径视场部分重叠仿生热成像系统，属于光电探测和图像处理技术领域。本发明包括探测成像模块、系统供电电源板、FPGA信号处理板、PC机处理显示模块。所述探测成像模块包括五个单孔径探测成像子模块，每个单孔径探测成像子模块包括光学镜头、探测器及探测器驱动电路板。本发明通过“十”字型五孔径视场部分重叠仿生热成像布局，构造类似人眼视觉的中心高分辨成像、周边大视场搜索的视觉模式，缓减常规热成像系统视场与分辨率的矛盾，并利用“十”字型五孔径视场部分重叠仿生热成像系统实现仿生全偏振热成像或双色热成像，提高光学系统的灵敏度，增强复杂背景下运动目标的探测与识别能力。

Abnormal behaviour monitoring system and method

本发明提供一种异常行为监控系统，包括第一感测单元、第二感测单元以及中央控制单元，所述第一感测单元用以感测一监控区域，并生成相应的感测信号，所述第二感测单元用于接收所述感测信号，根据所述感测信号调整其背景温度阀值，检测进入所述监控区域内的目标主体的温度变化，并将该温度变化的分布数据传送至所述中央控制单元，所述中央控制单元用以对该分布数据进行分析，进而识别出该目标主体的行为。上述异常行为监控系统可有效监控目标主体的行为，并在目标主体的行为出现异常时，及时通知相关人员，应用较为广泛。本发明还提供一种异常行为监控方法。

Device and method for measuring temperature using infrared array sensors

公开了一种用于使用红外阵列传感器测量温度的装置和方法。本装置可以包括：红外阵列传感器模块，所述红外阵列传感器模块包括以进一步包括多个像素的阵列进行布置的多个红外传感器，用于获取关于对象的热像图的信息；OSD生成模块，所述OSD生成模块具有与对象的整体形状或局部形状对应的轮廓，用于生成对待被测量温度的目标区进行限定的指示器；显示模块，该显示模块用于显示指示器和关于热像图的信息；以及控制器，用于在当关于热像图的信息和指示器被显示在显示模块上时借助于关于热像图的信息被显示的对象的目标区与指示器交叠的情况下，控制红外阵列传感器模块来测量对象的温度。

Thermal infrared sensor array in wafer level package

Infrared detector and infrared imager

本发明涉及一种红外探测器，其包括：一红外光谱吸收体，用于吸收红外光谱并将红外光谱转化为热量；一热电元件，所述红外光谱吸收体设置在所述热电元件上，与所述热电元件接触设置；一电信号检测器，与所述热电元件电连接并串联形成一回路，用于检测所述热电元件的电学性能的变化；其中，所述红外光谱吸收体包括一碳纳米管阵列，所述碳纳米管阵列包括多个碳纳米管，该多个碳纳米管的高度基本相同，且垂直于所述热电元件的表面。本发明还涉及一种基于该红外探测器的红外成像仪。

Multizone control of lamps in a conical lamphead using pyrometers

반도체 기판을 처리하기 위한 방법 및 장치가 기재되어 있다. 이 장치는, 광학적으로 투명한 상부 돔 및 하부 돔을 갖는 프로세스 챔버이다. 처리 동안 프로세스 챔버 내에서 진공이 유지된다. 상부 돔은 처리 영역 외부에서 상부 돔을 따라 열 제어 유체를 유동시킴으로써 열 제어된다. 열 램프들은 하부 돔 부근에 위치되고, 열 센서들은 램프들 사이에 배치된다. 램프들에는 구역별로 전력이 공급되고, 제어기가 열 센서들로부터 수신된 데이터에 기초하여 램프 구역들에 대한 전력을 조절한다. A method and apparatus for processing a semiconductor substrate is described. This device is a process chamber having an optically transparent upper dome and a lower dome. A vacuum is maintained within the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the treatment area. Thermal lamps are located near the lower dome, and thermal sensors are placed between the lamps. The lamps are supplied with power for each region, and the controller adjusts the power for the lamp regions based on data received from the thermal sensors.

Security disaster safety system using infrared temperature sensor and radar sensor

The present invention relates to a security disaster safety system using an infrared temperature sensor and a radar sensor, which includes: a radar sensor unit which scans a monitoring area and generates motion information including coordinate values at which motion is detected; a temperature measuring unit for generating temperature information by measuring the temperature of the monitoring area through an infrared sensor array; and a control unit which controls the scan of the radar sensor unit, adjusts a focus directed by the infrared sensor array of the temperature measurement unit to correspond to the coordinate value at which the motion is detected, and controls opening and closing of an entrance gate according to the motion information and temperature information. According to the present invention as described above, by combining an infrared temperature measuring system and a radar sensor system to double detect a body temperature and movement of a subject at the set time, thereby significantly reducing misinformation in the detection of illegal entry and improve the reliability of a detection result.

For manufacturing the method for being used to detect the device of electromagnetic radiation containing layers of getter material

本发明涉及一种用于制造包括至少一个热检测器(10)的电磁辐射检测装置(1)的方法，所述热检测器包括悬置在衬底(2)上方的吸收膜(11)并且旨在位于密封腔(3)中，所述方法包括以下步骤：‑在衬底(2)上沉积包括具有吸气效应的金属材料的、所谓吸气金属层(40)；‑在吸气金属层(40)上沉积非晶碳的所谓的碳质牺牲层(50)；‑在碳质牺牲层(50)上沉积至少一个牺牲矿物层(60A、60B)；‑使牺牲矿物层(60A)化学‑机械平面化；‑制造热检测器(10)，使得吸收膜(11)在牺牲矿物层(60A)上被制造；‑去除牺牲矿物层(60A、60B)；‑去除碳质牺牲层(50)。

Temperature mapping apparatus and method

An apparatus 10 for determining a temperature map across at least part of a blank 100 having first and second surfaces. The apparatus comprises a temperature measuring device 20A, such as a pyrometer or a thermocouple, for measuring the temperature of a first spot S1 on the blank 100 and for producing an output temperature signal. The apparatus also comprises a thermal camera 30 for taking a thermal image of the blank 100 and for producing a thermal image output. A transmitter 40A is provided for transmitting the output temperature signal from the temperature measuring device 20A. An adjuster 50 is connected to receive the thermal image output from the thermal camera 30 and to receive the output temperature signal from the transmitter 40A and for adjusting the thermal image output of the thermal camera 30 in accordance with the output temperature signal from the temperature measuring device 20A to create the temperature map. The blank may be a sheet metal blank used in a forming process.

Temperature mapping apparatus and method

An apparatus 10 for determining a temperature map across at least part of a blank 10 having first and second surfaces 102a,102b. The apparatus comprises a temperature measuring device 20A, 20B, for measuring the temperature of a first spot S1 on the blank 100 and for producing an output temperature signal. The apparatus also comprises a thermal camera 30 for taking a thermal image of the blank 100 and for producing a thermal image output. A transmitter 40A, 40B is provided for transmitting the output temperature signal from the temperature measuring device 20A, 20B. An adjuster 50 is connected to receive the thermal image output from the thermal camera 30 and to receive the output temperature signal from the transmitter 40A, 40B and for adjusting the thermal image output of the thermal camera 30 in accordance with the output temperature signal from the temperature measuring device 20A, 20B to create the temperature map.

suspended membrane thermal detector comprising a deformable absorber

L’invention porte sur un détecteur thermique comportant une structure tridimensionnelle (2) adaptée à détecter un rayonnement électromagnétique, suspendue au-dessus et thermiquement isolée d’un substrat (10), comportant une membrane (20) et un absorbeur (30), celui-ci étant formé à base d’un alliage à mémoire de forme et étant adapté à présenter une configuration plane de détection lorsque sa température est inférieure ou égale à T1 et une configuration courbe de refroidissement lorsque sa température est supérieure à une température austénitique initiale As. Figure pour l’abrégé : Figure 2A Disclosed is a thermal detector comprising a three-dimensional structure (2) adapted to detect electromagnetic radiation, suspended above and thermally insulated from a substrate (10), comprising a membrane (20) and an absorber (30), the latter being formed on the basis of a shape memory alloy and being adapted to have a plane detection configuration when its temperature is less than or equal to T1 and a cooling curve configuration when its temperature is greater than an initial austenitic temperature As. Figure for abstract: Figure 2A

METHOD FOR PRODUCING AN ELECTROMAGNETIC RADIATION DETECTION DEVICE COMPRISING A LAYER OF GETTER MATERIAL

L'invention porte sur un procédé de réalisation d'un dispositif de détection (1) de rayonnement électromagnétique comprenant au moins un détecteur thermique (10) à membrane absorbante (11) suspendue au-dessus d'un substrat (2), situé dans une cavité hermétique (3), comportant les étapes suivantes : - dépôt, sur le substrat (2), d'une couche métallique dite getter (40) comprenant un matériau métallique à effet getter ; - dépôt d'une couche sacrificielle dite carbonée (50) sur la couche métallique getter (40); - dépôt d'au moins une couche sacrificielle minérale (60A, 60B) sur la couche sacrificielle carbonée (50) ; - réalisation du détecteur thermique (10) de sorte que la membrane absorbante (11) est réalisée sur la couche sacrificielle minérale (60A) ; - suppression de la couche sacrificielle minérale (60A, 60B) ; - suppression de la couche sacrificielle carbonée (50). The invention relates to a method for producing a device (1) for detecting electromagnetic radiation comprising at least one thermal detector (10) with an absorbing membrane (11) suspended above a substrate (2), located in a a hermetic cavity (3), comprising the following steps: depositing, on the substrate (2), a metal layer known as getter (40) comprising a metal material having a getter effect; depositing a so-called carbonaceous sacrificial layer (50) on the getter metal layer (40); depositing at least one mineral sacrificial layer (60A, 60B) on the carbonaceous sacrificial layer (50); - Realization of the thermal detector (10) so that the absorbent membrane (11) is formed on the mineral sacrificial layer (60A); - removing the mineral sacrificial layer (60A, 60B); - Removal of the carbonaceous sacrificial layer (50).

BOLOMETER WITH HIGH SPECTRAL SENSITIVITY.

SUMMER CIRCUIT