ДАТЧИК ВЫСОКОГО НАПРЯЖЕНИЯ С ПЕРЕКРЫВАЮЩИМИСЯ ПО ОСИ ЭЛЕКТРОДАМИ

... 1. Датчик высокого напряжения для измерения напряжения между первой и второй контактными точками (2, 3, 20, 30, 21, 31), содержащийизолятор (1) из изолирующего материала, проходящий вдоль осевого направления между первой и второй контактными точками (2, 3, 20, 30, 21, 31),множество проводящих электродов (Eij, Es), расположенных в упомянутом изоляторе (1), причем упомянутые электроды (Eij, Es) взаимно разделены упомянутым изолирующим материалом и связаны друг с другом емкостной связью,по меньшей мере один датчик (6) электрического поля, расположенный по меньшей мере в одной полости (7; 70, 71) датчика, в частности, точно в одной полости (7) датчика упомянутого изолятора (1),при этом по меньшей мере для части упомянутых электродов (Eij, Es) каждый электрод по оси перекрывается по меньшей мере с другим из упомянутых электродов (Eij, Es),причем упомянутые электроды (Eij, Es) расположены так, чтобы создавать в упомянутой полости (7; 70, 71) датчика электрическое поле, имеющее среднюю напряженность ...

Контактное устройство

Изобретение относится к радиотехнике и может быть использовано, в частности, в установках внутрисхемного и функционального контроля пеU7 чатных плат и микросхем. Цель изобретения - миниатюризация конструкции и повышение ее надежности. Контактное устройство содержит корпус. 1, подвижную колодку 2, неподвижную колодку 3. В отверстиях колодок 2 и 3 размещены жесткие подпружиненные контакты. На подвижной колодке 2 жестко закреплены ленточные пружины 9. На нижнем конце пружин 9 закреплены башмаки 10, а на верхнем - фиксаторы 1 1. Фиксато-г ры 11 выполнены двухступенчатыми и сопряжены с корпусом 1 через двухступенчатые пазы. 1 з.п. ф-лы. 5 ил. (Л ел 00 ...

Automatic temporary connection of cables and wires - uses stackable plastic housing contg. EM latches, and has buffer to actuate auxiliary contact

The contact arrangement is for automatic temporary connection of cables and wires to a test device for electrical and electronic equipment. It can be operated rapidly using one hand and enables any number of contact positions to be served by choosing the number of elements used. The connection to a cable or wire takes place automatically. The wire is pushed past a contact housing (3) with a contact pin (4) until it presses against a plastic buffer (5). The buffer actuates an auxiliary contact via a spring (6). The auxiliary contact triggers a self-latching electrical circuit which connects the supply voltage to an electromagnet (10). The electromagnet pulls a soft iron lever (11) which presses the contact pin against the wire until the latching current is interrupted. The unit is in a stackable plastic housing (1).

Verbindungseinrichtung mit Prüfstecker.

Vorrichtung zum Verbinden eines Spannungsanzeigegerätes mit einem Sensor

Anordnung in einer perforierten Walze einer Faserbahnmaschine und vorgefertigte Sensorfolie für eine perforierte Walze einer Faserbahnmaschine

Die Erfindung betrifft eine Anordnung in einer perforierten Walze einer Faserbahnmaschine, wobei die Anordnung einen Walzenmantel (19), Löcher (13), die durch den Walzenmantel (19) verlaufen, ein Erfassungssystem (14), das in dem Walzenmantel (19) angeordnet ist, wobei das Erfassungssystem (14) wenigstens ein Paar von Leitungen (16) aufweist, an dem ein oder mehrere Sensoren (15) angeschlossen sind, umfasst. Zumindest ein Paar von Leitungen (16) ist dazu angepasst, aus flachen Leitungen (17.2, 17.2) zusammengesetzt zu sein, die in dem Walzenmantel (19) nebeneinander angeordnet sind. Die Erfindung betrifft auch eine vorgefertigte Sensorfolie (26) für eine perforierte Walze einer Faserbahnmaschine.

Receiver for recovering and retiming electromagnetically coupled data

Receiver for recovering and retiming electromagnetically coupled data

DEVICE FOR SNAPPING CONNECTION TWO POLIGER OF ELECTRICAL ELEMENTS

VORRICHTUNG ZUM SCHNELLEN ANSCHLUSS ZWEI- POLIGER ELEKTRISCHER BAUELEMENTE

SIGNAL MODULE WITH DECREASED RÜCKSTRAHLUNG

ELECTRICAL SENSOR IN FORM OF A BODY WITH ALTERNATING DIRECTIONS AND NOT DIRECTION SURFACE SECTIONS

IMPROVED FLEXIBLE RIBBON CABLE

High-voltage sensor with axially overlapping electrodes

A voltage sensor comprises an insulator (1) with mutually insulated electrodes (Eij, E ...

Device for connecting a voltage display apparatus to a sensor

MAGNETIC JUMPER FOR BYPASSING ELECTRICAL CIRCUITS

A magnetic jumper for bypassing electrical circuits. The jumper includes a magnet at each end of a wire. Each magnet can be attached to a terminal of a low voltage electrical circuit in order to bypass that circuit for testing and troubleshooting purposes. The magnetic jumper works with almost any terminal that has steel screws.

UNIVERSAL MOUNTING FOR ELECTRONIC APPARATUS

USE OF LATCHING RELAYS IN SIGNAL SWITCHING

A device for switching signals from multiple sources to a single testing or measuring device using latching relays.

MEASURING INSTRUMENT FOR DETECTION OF ELECTRICAL PROPERTIES IN A LIQUID

A measuring instrument for detection of electrical properties in a liquid includes a main body configured to hold a tester, a first pole extending from the main body, and a second pole extending from the main body that is spaced apart from the first pole. The first pole carries a positive probe for attachment to the tester, and the second pole carries a negative probe for attachment to the tester. When the probes are placed in the liquid, electrical properties in the liquid are detected by the tester.

Einrichtung zum Einschalten von Messinstrumenten in Stromkreise ohne Betriebsunterbruch.

TRANSDUCER IN PLUG-IN DESIGN FOR HEAVY CURRENT ENGINEERING MEASURING TASKS.

Device to intercalate in series in a circuit and to disconnect one or more apparatuses without cut from the circuit

EXTENSIBLE CONTROL SYSTEM OF SEQUENCE

EXTENSIBLE CONTROL SYSTEM OF SEQUENCE

Probe device

The present invention discloses a probe device, wherein a recessed part (14A) facing to the front side of a probing chamber (11) is formed on the bottom side of a head plate (14). A card exchange mechanism (20) for exchanging a probe card (13) is disposed in the recessed part (14A). The exchange mechanism (20) comprises a card support member (21) supporting the probe card (13), an extension mechanism (22), air cylinders (24), and a cam mechanism (35). The extension mechanism (22) makes the support member (21) move substantially in horizontal direction between a connection position for the probe card (13) corresponding to a pogo ring (16) and the opening part side of a case (10C), and the air cylinders (24) and the cam mechanism (35) make the support member (21) move vertically relative to the head plate (14) so that the probe card (13) can be connected to/disconnected from a test head (15) (through the pogo ring (16)).

Probe holder and probe unit

SMARTPHONE-CONNECTABLE MULTIMETER HAVING AUTOMATIC MEASUREMENT TARGET DETECTION FUNCTION, AND MEASUREMENT SYSTEM INCLUDING THE SAME

A smartphone-connectable multimeter having an automatic measurement target detection function, a measurement system including the same, and a measurement method using the same is provided. The smartphone-connectable multimeter includes: a housing; a pair of lead wires equipped with probes, and drawn from the housing; a range module configured to rectify and transform an electric signal, and installed in the housing; a voltage module configured to generate electricity and apply current to the measurement target; and a process module configured to receive instruction data, to generate analysis data by converting the electric signal, processed by the range module, into a corresponding digital signal suitable for an electrical characteristic according to settings of the instruction data and analyzing the digital signal, and to perform control so that the voltage module applies current when an electric signal is not received from the measurement target, and installed in the housing.

Methods and apparatuses for dynamic probe adjustment

An improved method and apparatus for automatically aligning probe pins to the test or bond pads of semiconductor devices under changing conditions. In at least one embodiment, a dynamic model is used to predict an impact of changing conditions to wafer probing process. This reduces the need for frequent measurements and calibrations during probing and testing, thereby increasing the number of dice that can be probed and tested in a given period of time and increasing the accuracy of probing at the same time. Embodiments of the present invention also make it possible to adjust positions of probe pins and pads in response to the changing conditions while they are in contact with each other.

Lumped resistance electrical cable

A lumped resistance electrical cable has a multiple twisted pair ribbon cable having first and second conductive lines and twisted and untwisted portions. In the untwisted portions, one of the conductive lines on each of the twisted pairs is formed with an electrical open. Resistor blocks having resistive elements and electrical contacts is disposed on the untwisted portions with the electrical contacts electrically coupling the resistive elements across the electrical opens in the conductive lines. Other electrical contacts in the connector couple the other conductive lines of the twisted pairs to an ground plane formed on the resistor block.

Automatic test equipement having fiber optic connections to remote servers

An example test system includes a test head, and a device interface board (DIB) configured to connect to the test head. The DIB is for holding devices under test (DUTs). The DIB includes electrical conductors for transmitting electrical signals between the DUTs and the test head. Servers are programmed to function as test instruments. The servers are external to, and remote from, the test head and are configured to communicate signals over fiber optic cables with the test head. The signals include serial signals.

Kontakteinrichtung

Prüfkabel

EINRICHTUNG ZUR ANZEIGE DER STELLUNG EINES ELEKTRISCHEN VERBINDUNGSSTECKERS.

Improvements in or relating to electric measurement transmission systems

... 956, 029. Measuring electrically. LEYBOLD HOLDING A. G. May 1, 1961 [April 29, 1960], No. 15771/61. Heading G1N. A cable capable of carrying large and small currents alternately, comprises a coaxial cable 5 including an insulated inner conductor 51 surrounded by a screen 53, and a second conductor 6 arranged outside the screen, the screen being connected to the inner conductor while a large current is transmitted, and to the outer conductor and earth while a small current is transmitted. The cable is used in conjunction with an ionisation manometer . 1, ganged switches 7, 10 completing the necessary connection during the heating and degassing and the measurement periods. The measurement current is therefore not affected by spurious currents due to the capacitance of the dielectric, following the passage of the heating current. The outer conductor 6 may be a single wire or a sheath coaxial with conductor 5.

SEQUENCE CONTROL SYSTEM

DEVICE FOR CONNECTING A TENSION INDICATOR WITH A SENSOR

Cable for testing of an object, a testing apparatus and method for testing a device under test

Zum Prüfen eines Transformators (2) wird ein Kabel (20) eingesetzt, das den Transformator (2) mit einer Prüfvorrichtung (10) verbindet. Das Kabel (2) umfasst wenigstens zwei Zwillingsleitungen (23-25). Über einen ersten Leiter einer Zwillingsleitung (23-25) ist jeweils ein Strom in eine Wicklung des Transformators einspeisbar. Die zweite Leitung der Zwillingsleitung (23-25) wird zur Spannungsmessung an der Wicklung verwendet.

MEASURING CABLE

High-voltage sensor with axially overlapping electrodes

A voltage sensor comprises an insulator (1) with mutually insulated electrodes (Eij, E ...

SLEEVE FOR A POWER CABLE

Sleeve (1 ) for a high- or medium-voltage power cable (120) having an inner conductor (130). The sleeve comprises (i) a tubular sleeve body (10) having an electrically conductive or semiconductive first axial electrode section (60), and (ii) a circuit board (30). The sleeve is radially expandable or shrinkable. It can be arranged radially outward of the inner conductor, such hat the first axial electrode section is radially separated from the inner conductor by at least an electrically insulating spacer layer (140). The circuit board is at least partially arranged radially outward of the sleeve body and comprises an electrical contact (100) which is electrically connected with the first axial electrode section.

FLEXIBLE STRIP CABLE

A flexible strip test cable having an elongated flexible strip cable, a series of strip traces disposed lengthwise on the flexible strip cable and having electrical strip contacts near one end of the flexible strip cable, an extension cable integral with the flexible strip cable and having a width at one end greater than the width of the flexible strip cable, and a series of test traces on the extension cable having electrical test contacts near the end of the extension cable remote from the flexible strip cable. Each of the test traces is electrically connected to one of the strip traces, and the minimum distance between two test contacts is greater than the minimum distance between two strip contacts. The flexible strip test cable may have a tooling guide for aligning a cutting tool with the end of the flexible strip cable which is connected to the extension cable. Alternatively, the test contacts may be electrically accessible through one surface of the extension cable in any pattern ...

Method for adjusting high frequency signal path and test device thereof

The invention relates to a method for adjusting a high frequency signal path and a test device thereof. The test device comprises a circuit board, a probe set and a path adjuster. The circuit board is provided with a plurality of transmission lines. The probe set is provided with a plurality of probes. The path adjuster has a plurality of first lead wires with a same length. Any one of the first lead wires can be replaced by a second lead wire with another length. Two ends of each lead wire are respectively in electric connection with the transmission lines of the circuit board and the probes of the probe set. A first high-frequency signal transmitting from one transmission line through the associated first lead wire to the associated probe and a second high-frequency signal transmitting from another transmission line through the associated second lead wire to the associated probe may have a same output timing. According to the invention, the path adjuster that can compensate the process ...

For an electric power cable sleeve

Probe card assembly

Relay connection member, inspection device and method of manufacturing relay connection member

An inspection device capable of coping with narrowness of terminals of inspection objects while the electrical connection with the inspection objects and the electrical connection inside thereof are sufficiently ensured is realized. The inspection device comprises probes 3, a probe holder 4 for holding the probes 3, an inspection circuit 5 for outputting inspection signals to an inspection object 1 through the probes 3, and a relay connection member 6 for electrically connecting the probes 3 and the inspection circuit 5. The relay connection member 6 has a first connection member 8 comprising first wiring structures 11, 12 which are electrically connected with the probes 3, wherein the adjacent wiring structures are formed on different layers, and a second connection member 9 comprising second wiring structures 16 which are electrically connected with wiring structures 7 provided in the inspection circuit 5 and are formed on the same layer. By comprising the first connection member 8 suitable ...

Method of cleaning a probe

A probe having a tip is cleaned with a cleaning sheet having a base sheet, a foamed layer of a porous material including non-fibrous abrading particles and air bubbles on the base sheet and a polishing layer formed on the foamed layer by causing a surface of the polishing layer to be pressed against the tip of the probe and the tip of the probe to penetrate the polishing layer and further to be inserted into the foamed layer having abrading particles dispersed inside. Such a cleaning sheet may be produced by preparing a paint having air bubbles dispersed inside by mechanically foaming a foaming material containing a foaming resin material and abrading particles, forming on the base sheet a foamed layer having abrading particles dispersed inside by coating a surface of the base sheet with this paint and drying it, and forming a polishing layer on the foamed layer.

ДАТЧИК ВЫСОКОГО НАПРЯЖЕНИЯ С ПЕРЕКРЫВАЮЩИМИСЯ ПО ОСИ ЭЛЕКТРОДАМИ

Группа изобретений относится к метрологии, в частности к средствам измерения напряжения. Датчик высокого напряжения содержит изолятор, проходящий вдоль осевого направления между первой и второй контактными точками, множество проводящих электродов, расположенных в упомянутом изоляторе, причем упомянутые электроды взаимно разделены упомянутым изолирующим материалом и связаны друг с другом емкостной связью. При этом часть упомянутых электродов перекрывается с другими электродами по оси, причем упомянутые электроды расположены так, чтобы создавать в упомянутой полости датчика электрическое поле, имеющее среднюю напряженность поля, большую, чем упомянутое напряжение, поделенное на расстояние между упомянутой первой и упомянутой второй контактными точками. Электроды формируют емкостный делитель и расположены асимметрично относительно плоскости отсчета и заделаны в материал изолятора, обладающий разными диэлектрическими постоянными по обеим сторонам плоскости отсчета. Датчик также содержит электрооптическое ...

Anschlussvorrichtung für eine Batterie

Anschlussvorrichtung (10, 10a, 10b, 13) für eine Batterie, insbesondere eine Fahrzeugbatterie, die zur elektrischen Verbindung von einem Batteriepol mit zumindest einem elektrischen Leiter (11) dient, mit einem Strommessmodul (12), das zumindest einen Messwiderstand (13) und eine Messschaltung (16) enthält, wobei die Messschaltung (16) zumindest die anliegende Spannung an dem Messwiderstand (13) erfasst und über die vorbekannte Größe des Messwiderstands (13) den durchfließendem Strom bestimmt , und die erfassten Messdaten in analoger oder digitaler Form an eine Auswerte- bzw. Steuereinheit weiterleitet, dadurch gekennzeichnet, dass die Anschlussvorrichtung (10, 10a, 10b) und der Messwiderstand (13) materialeinheitlich ausgebildet sind.

Prüfkarten Trägerelement

Aufgabe der Erfindung DOLLAR A Es ist eine Aufgabe der vorliegenden Erfindung, ein Prüfkarten-Trägerelement zur Messung elektrischer Eigenschaften eines Halbleiterelements, wie eines LSI-Chips, zur Verfügung zu stellen. DOLLAR A Kern der Erfindung DOLLAR A Ein Prüfkarten-Trägerelement umfasst ein mit einer Messeinrichtung zur Prüfung eines Halbleiterelements verbundenes Hauptträgerelement, ein Unterträgerelement, auf welchem ein mit dem Halbleiterelement verbundener Kontakt montiert ist, und eine beides elektrisch verbindende leitfähige Komponente, wobei das Hauptträgerelement und das Unterträgerelement miteinander verbunden sind zum Zwecke der Fixierung, und Elektroden, welche auf einer dem Unterträgerelement gegenüberliegenden Oberfläche des Hauptträgerelements angeordnet sind, und Elektroden, welche auf einer dem Hauptträgerelement gegenüberliegenden Oberfläche des Unterträgerelements angeordnet sind, elektrisch verbunden sind.

Quick-release multi-module terminating connector assembly

A quick-release interfacing assembly (165) comprising first and second carriers (53, 53a), a plurality of module assemblies (11) carried by the first and second carriers (53, 53a) and a coupling (73, 75) for joining the first and second carriers (53, 53a) together to form a double cartridge assembly (71). A panel receiver (91) receives the double cartridge assembly (71) and couples the double cartridge assembly (71) to a test device. Each of the module assemblies (11) includes a connector body (13), a pressure member (27), and a flexible sheet (17) carrying contacts (21, 23) thereon.

DEVICE FOR SNAPPING CONNECTION TWO POLIGER OF ELECTRICAL ELEMENTS

ELECTRICAL MESSFUHLER IN FORM OF A KORPERS WITH ALTERNATING DIRECTIONS AND NOT DIRECTION UPPER FLAT SECTIONS

ELEKTRISCHER MESSFUHLER IN FORM EINES KORPERS MIT ABWECHSELND LEITENDEN UND NICHT LEITENDEN OBERFLACHENABSCHNITTEN

Method and special test lines for quickly verifying relay protection outlet logic

Quality evaluation method for laminate having protective layer on surface of oxide semiconductor thin film and quality control method for oxide semiconductor thin film

CURRENT AND VOLTAGE MODULE AND METHODS FOR MONITORING CURRENT AND VOLTAGE IN POWER DISTRIBUTION NETWORKS

Universal support for electronic appts. - has greater depth channel in base fitting over corresponding projection

Probe holder and probe unit

This invention provides a probe holder and a probe unit, which are capable of assuring a descried stroke when the probe contacts the circuit structure to be inspected, and which exhibit excellent durability and economy. The probe holder is provided with a tip portion for holding a plurality of probes for performing input and output of electric signals between the circuit construction to be inspected and the probes by contacting the circuit construction with the probes, a base portion for supporting the above said tip portion, and a flection producing portion interposed between the tip portion and the base portion, the flection producing portion being adapted for producing a flection of the tip portion with respect to the base portion.

Anisotropic conductive sheet, anisotropic conductive composite sheet, anisotropic conductive sheet set, electric inspection device and electric inspection method

This anisotropic conductive sheet includes: a plurality of conductive paths; and an insulation layer which is disposed to fill the space between the plurality of conductive paths and has a first surface and a second surface. Each of the conductive path extends in a thickness direction of the insulation layer and has a first end part on the first surface side and a second end part on the second surface side. When the conductive paths are seen through so that the center of the first end part overlaps the center of the second end part, at least a portion of the conductive paths does not overlap the first end part and the second end part.

Conductive particle disposed film, method of manufacturing the same, inspection probe unit, continuity testing method

This electroconductive particle placement film, which is useful as an inspection probe unit for inspecting the continuity of objects that are to be subjected to fine-pitch continuity inspection such as semiconductor devices, has electroconductive particles placed in the planar direction of an elastomer film. The thickness of the elastomer film approximately matches the average particle diameter of the electroconductive particles. The end parts of the electroconductive particles are positioned near the respectively farthest outer surface of both surfaces of the elastomer film. Same or different electroconductive particle placement films may be laminated. An adhesive layer may also be formed on at least one surface of the electroconductive particle placement film.

AV FLERA DELAR BESTAENDE SPO

METHOD AND APPARATUS FOR TESTING INTERCONNECT NETWORKS

Method and apparatus for testing interconnect networks, by generating at least two plasma jets, each in the vicinity of a distinct point (12, 13) of the circuit to be tested, applying a voltage difference whereby to cause an electric current to flow between the points through the circuit, to each point through the corresponding plasma jet and maintaining the current flow to carry out the testing process. Each plasma jet is generated by producing a discharge between two electrodes within a cavity, said plasma being ejected out through an orifice. The apparatus comprises at least two plasma injector-electrodes (14, 16) to drive an electric current between two points of the circuit to be tested, each so positioned or positionable as to direct the plasma generated thereby to one of the two points, a first electric circuit (21, 27) to supply voltage to each plasma injector-electrode, means (18, 20) for supplying gas to each plasma injector-electrode, and a second electric circuit (21, 27) similar ...

Microwave probe fixture

A fixture having a header plate (20) in rectangular shape with a notch (28) on each end and an aperture (22) in the middle defined as a through hole. A plurality of microwave connectors (30) are located on the top surface of the header plate (20) adjacent to the aperture and penetrate through the body with the connector extended contact planar with the bottom. A substrate (32) of dielectric material with a ground plane on one side and a plurality of striplines (34) on the other is attached into a recess peripherally positioned on the bottom side of the aperture (22). The striplines (34) are joined to the connectors (30) on one end and to individual probe needles (38) with angular tips on the other near the midmost point. A centrally located access opening (36) in the substrate (32) allows visual indication of the probe needles (38) for positioning upon node points and inspection points on a microwave semiconductor wafer under test. The device allows a flowpath for microwave signals from ...

Use of conductive particles in a nonconductive body as an integrated circuit antifuse

A novel antifuse includes a composite of conductive particles dispersed throughout a nonconductive matrix, which composite is located inside an antifuse via. The antifuse via is defined by a dielectric layer that separates two electrodes. The electrodes can be located in the same conductive layer plane (typically parallel to and isolated from one another) or in two different conductive planes (typically formed transverse to one another and separated by a dielectric with an antifuse via formed therein). The electrodes can be coupled to, for example, active or passive regions of the integrated circuit. One embodiment of an antifuse (also called "composite antifuse") has only the composite in an antifuse via between the two conductive layers. Another embodiment of an antifuse (also called "hybrid antifuse") includes in addition to the composite, one or more thin dielectric layers also located in the antifuse via between the two conductive layers.

Expandable sequence control system

An expandable sequence control system including a central controller unit for sequentially controlling a plurality of I/O devices connected thereto through a plurality of I/O interface modules is disclosed herein. A terminal block is formed on each I/O interface module for connection between the interface module and the I/O devices. Each of the I/O interface modules is provided at its opposite ends with respective ports which are to be electrically coupled to the central controller unit or connected to each other by means of flexible cables. These ports of each I/O interface module are electrically interconnected through a feeder passage incorporated therein such that a desired number of the I/O interface modules can be added to the system by coupling the feeder passages thereof with the flexible cable connecting between the ports of adjacent I/O interface modules. Accordingly, a plurality of the I/O interface modules can be arranged in tandem or parallel relationship with each other depending ...

Anisotropic, conductive sheet and impedance measuring probe

An anisotropically conductive sheet of the invention formed by containing conductive particles exhibiting magnetism in a sheet base composed of an elastic polymeric substance in a state dispersed in a plane direction thereof and oriented so as to align in a thickness-wise direction thereof. A thickness of the sheet is 10 to 100 mum, a number average particle diameter of the conductive particles exhibiting magnetism is 5 to 50 mum, a ratio W₁/D of the thickness W₁ to the number average particle diameter D of the conductive particles exhibiting magnetism is 1.1 to 10, a content of the conductive particles exhibiting magnetism is 10 to 40% in terms of a weight fraction.

QUALITY EVALUATION METHOD FOR LAMINATE HAVING PROTECTIVE LAYER ON SURFACE OF OXIDE SEMICONDUCTOR THIN FILM AND QUALITY CONTROL METHOD FOR OXIDE SEMICONDUCTOR THIN FILM

Provided is a method for simply evaluating defects caused in interface states in oxide semiconductor thin films and protective films in TFTs having protective films formed on the surface of oxide semiconductor thin films without actually measuring the characteristics of the same. This evaluation method evaluates defects caused in the interface states by measuring electron states in the oxide semiconductor thin film by a contact method or noncontact method. The defects caused in the interface states are any of the following (1)-(3). (1) Threshold value voltage (Vth,) when a positive bias is applied to the thin-film transistor (2) Difference in threshold value voltage (ΔVth) before and after applying the positive bias to the thin-film transistor (3) Threshold value during the first measurement when a plurality of measurements is made of the threshold value voltage when a positive bias is applied to the thin-film transistor.

ELECTRICAL CONNECTING APPARATUS

To restrain misregistration of tips due to change in temperature, an electrical connecting apparatus is used for connection of a tester, and electrical connection terminals of a device under test to undergo electrical test by the tester. The electrical connecting apparatus comprises a probe board having a plurality of probe lands on its underside; and a plurality of contacts having tip portions to be brought into contact with a base end portion fixed at the respective probe lands and the connection terminals of the device under test. The measure from the tip of each contact and the probe land ranges from 1.1 to 1.3 mm, and the coefficient of thermal expansion of the probe board is greater than the coefficient of thermal expansion of the device under test within the range from 1 to 2 ppm/° C.

Electrical cable assembly for a signal measuring instrument and method

A cable assembly (A) is disclosed for a logic analyzer which comprises a flat woven cable (14) having an analyzer connector (18) and a probe connector (22). The analyzer connector includes a printed circuit board (32) and the probe connector includes a printed circuit board (34). Resistor-capacitor networks (D, E) are carried on respective PC board (32, 34) for extending the effective bandwidth of the cable assembly. A cable assembly (A") is disclosed having a low capacitance provided by high gauge signal conductors (92) and increased center-to-center spacing between the signal conductor and exclusively associated ground wires (94a, 94b). Resistor networks (D', E') provide a high input resistance to the cable assembly. An interface shroud (B) connects terminal (C) of probe leads (10) to probe connector (22). A plurality of exterior grooves (54) are formed on an upper wall (44) of interface shroud (B) which receive locking arm (62) of terminal body (60). A trigger ramp (74) allows locking ...

DEVICE FOR DISPLAYING THE VOLTAGE OF A CONDUCTOR OF A HIGH-VOLTAGE POWER SUPPLY SYSTEM

Electrical circuit load measurement auxiliary screw cap - screws in to replace overload trip protector for connection to meter

A screw cap for measuring the load in electrical circuits is easy to operate and gives rapid economical measurement. It is screwed in place of a conventional protection element, e.g. an overload trip for a motor circuit, and presents contacts for connection to a meter. Removal of the operational trip device and insertion of the screw and cap are for more easily and quickly accomplished than the conventional measurement steps. Currents up to 63 Amps can be measured. The conventional techniques for measuring loading in electrical circuits involve interruption of circuits, and interconnection of measurement devices. Protective coverings may also have to be removed using the usual methods which increases measurement time.

Plastics strip holder for electrical components - has constant wire separation enabling strip-related mfg. and testing

The holder is used for retaining connecting wires of identical electrical components during mfr. The wires (2, 3) are laid in notches in the plastics strip holder (4) and covered by melted plastics (6) to hold them in place. The strip has locating holes (5) which enables the strip to be moved to the various mfg. points. Since the wire separation is held constant all the construction processes and the final function test can be referred to the tape position. The strip is flexible and can thus be passed over rollers of small radius permitting a compacter fabrication system. The final product can be rolled up for delivery. The constant wire separation permits a simpler and cheaper fabrication plant design.

Lage-versetzte Sondenpads zum Prebond-Testen

Eine Anordnung zum Durchführen von Prebond-Testen eines Wafers von Halbleitergeräten benutzt Sondenpads, die so lage-versetzt in Waferbereiche, die benachbart zu den Geräten sind, sind, dass, wenn das Prebond-Testen abgeschlossen ist und der Wafer in einzelne Elemente aufgetrennt ist, die elektrische Verbindung zwischen dem Prebond-Sondenpad und dem getesteten Gerät unterbrochen ist. Die benachbarten Waferbereiche können vakante Flächen oder ein anderer Gerätebereich sein. Nach der Auftrennung in einzelne Elemente sind ein bestimmtes Prebond-Sondenpad und sein zugehöriges Gerät physisch voneinander getrennt und elektrisch voneinander isoliert. Somit ist ein großes Sondenpad mit einem zugehörigen Gerät elektrisch verbunden nur während der Wafer intakt ist, was das Platzieren der Sonden während des Prebond-Testens erleichtert. Sobald die Geräte getrennt sind, ist das Sondenpad nicht mit mehr mit dem Teilbereich seines zugehörigen aktiven Elements verbunden, was die Kapazität beseitigt, die ...

Lampholder with measuring contacts - allows use of lamps with different base dimensions by inclusion of hinged measuring contacts

The lamp holder is contained in a rectangular metallic box (1). The incoming supply lead (3) is routed (3a, 3b) to the contacts which receive the lamp connector pins. The measuring contacts (7) are connected (4a, 4b) to the voltage measuring output lead (4). The measuring contacts are hinged and can typically be moved by turning a knob (12) driving an eccentric. The contacts can thus be brought against the lamp connector pins to make a measurement. These adjustable contacts permit he use of a variety of lamps.

A probe for testing printed circuit boards

A probe pin for testing printed circuits has a conductive metallic tube 11a containing a plunger 11c. The plunger projects from the top end of the conductive metallic tube and is biased by a spring 11b. A plurality of salients 11d are formed symmetrically on outer surface of the conductive metallic tube 11a in the axial direction so that the conductive metallic tube is easily pushed into an opening in an insulated holding plate 10. In a modification the tube 11a is contained within a socket 12 provided with a plurality of salients 12a. ...

ELECTRICAL MEASURING DEVICES

... 1465417 Conductivity electrodes; liquid level sensor SIEMENS AG 31 July 1974 [3 Aug 1973] 33889/74 Heading G1N A device for measuring conductivity or liquid level comprises a synthetic plastics body with alternate surface sections comprising electrically conducting and non-conducting filler material, the proportions of which are such that the sections have substantially identical thermal expansion coefficients. The body may be rod shaped, 1 Fig. 1, with external annular conducting sections 2 and connecting wires 4 or may be tubular with the conducting sections forming rings on the inside. The conductive filler may be carbon block or graphite. The non-conductive filler may be powdered quartz, titanium dioxide, silicon carbide, moly- bdenum disulphide or barium sulphate. The plastics material is preferably an epoxy resin and may be a a homopolymer of a bis-glycidyl ether of 2-2 diphenylol propane, b a glycidyl ether of a phenol-formaldehyde condensation product or the reaction product of ...

Electronic device and method for measuring the electronic device

QUICK-RELEASE MULTI-MODULE TERMINATING ASSEMBLY

PORTABLE MEASURING DEVICE.

DEVICE FOR THE ANNOUNCEMENT OF THE TENSION OF A DIRECTOR/CONDUCTOR OF A HIGH VOLTAGE POWER SUPPLY SYSTEM

ANISOTROPIC CONDUCTIVE FOIL AND IMPEDANCE MEASURING PROBE

Cable for testing of an object, a testing apparatus and method for testing a device under test

Zum Prüfen eines Transformators (2) wird ein Kabel (20) eingesetzt, das den Transformator (2) mit einer Prüfvorrichtung (10) verbindet. Das Kabel (2) umfasst wenigstens zwei Zwillingsleitungen (23-25). Über einen ersten Leiter einer Zwillingsleitung (23-25) ist jeweils ein Strom in eine Wicklung des Transformators einspeisbar. Die zweite Leitung der Zwillingsleitung (23-25) wird zur Spannungsmessung an der Wicklung verwendet.

HOLDER FOR CONDUCTIVE CONTACT

METHOD AND APPARATUS FOR TESTING INTERCONNECT NETWORKS

Method and apparatus for testing interconnect networks, by generating at least two plasma jets, each in the vicinity of a distinct point (12, 13) of the circuit to be tested, applying a voltage difference whereby to cause an electric current to flow between the points through the circuit, to each point through the corresponding plasma jet and maintaining the current flow to carry out the testing process. Each plasma jet is generated by producing a discharge between two electrodes within a cavity, said plasma being ejected out through an orifice. The apparatus comprises at least two plasma injector-electrodes (14, 16) to drive an electric current between two points of the circuit to be tested, each so positioned or positionable as to direct the plasma generated thereby to one of the two points, a first electric circuit (21, 27) to supply voltage to each plasma injector-electrode, means (18, 20) for supplying gas to each plasma injector-electrode, and a second electric circuit (21, 27) similar ...

DEVICE FOR DETERMINING PLACEMENT OF ELECTRICAL CONNECTOR TERMINAL

A device for detecting and indicating the position of a terminal wherein a first detector circuit indicates that the terminal is in the proper receptacle and a second circuit indicates that the terminal is locked in place.

SLEEVE FOR A POWER CABLE

Sleeve (1 ) for a high- or medium-voltage power cable (120) having an inner conductor (130). The sleeve comprises (i) a tubular sleeve body (10) having an electrically conductive or semiconductive first axial electrode section (60), and (ii) a circuit board (30). The sleeve is radially expandable or shrinkable. It can be arranged radially outward of the inner conductor, such hat the first axial electrode section is radially separated from the inner conductor by at least an electrically insulating spacer layer (140). The circuit board is at least partially arranged radially outward of the sleeve body and comprises an electrical contact (100) which is electrically connected with the first axial electrode section.

MEASURING INSTRUMENT FOR DETECTION OF ELECTRICAL PROPERTIES IN A LIQUID

A measuring instrument for detection of electrical properties in a liquid includes a main body configured to hold a tester, a first pole extending from the main body, and a second pole extending from the main body that is spaced apart from the first pole. The first pole carries a positive probe for attachment to the tester, and the second pole carries a negative probe for attachment to the tester. When the probes are placed in the liquid, electrical properties in the liquid are detected by the tester.

ELECTRIFIED WATER AND CURRENT TESTER

정전용량 변화를 이용한 플라즈마 밀도 측정 방법 및 장치, 그리고 측정용 탐침

... 반도체, 디스플레이, 태양전지뿐만 아니라 대기압 플라즈마를 이용한 바이오 분야 등에서 플라즈마를 이용한 공정이 확대 되는 만큼 플라즈마에 대한 정확한 진단이 요구되고 있다. 기존 플라즈마 진단 방법인 직접 탐침을 이용한 방법과 플라즈마 방출광을 이용한 방법은 각각의 명확한 한계를 가지고 있다. 또한 대기압 플라즈마를 응용한 연구나 공정이 확대 되는 시점에 대기압 플라즈마를 진단하기 위한 적절한 방법이 존재하지 않는다. 본 발명은 기존 플라즈마 진단 방법의 한계를 극복하고 대기압 플라즈마 진단에도 적합한 진단 방법이다.

Inspection substrate and method for manufacturing inspection substrate having conductive protection portion

SIMULTANEOUS PRESSURE AND LOCATION SENSING TOUCH SENSOR WHICH USES A GRIFFIN AS AN ELECTRODE

PURPOSE: A simultaneous pressure and position detecting touch sensor is provided to implement a multi-touch function by applying a griffin electrode to a touch sensor. CONSTITUTION: A first griffin electrode pattern is formed in a first material and includes griffins(450). An FSR(Force Sensing Resistor) layer is formed on the first griffin electrode pattern. A second griffin electrode pattern is formed in a second material and includes griffin electrodes. A controller applies an electrode to the first and second griffin electrode patterns and senses resistance variation of the FSR. COPYRIGHT KIPO 2012 ...

luva para um cabo de potência

Conductive contact holder and conductive contact unit

A conductive contact holder includes a holder base that has an opening formed to accommodate a ground conductor. The inside of the opening is in direct contact with the outer periphery of the ground conductor. This arrangement makes it possible supply ground potential to the ground conductor from the holder base, and to supply stable ground potential to a semiconductor integrated circuit.

PROBE APPARATUS FOR HARDWARE TESTING

Disclosed is a probe apparatus for hardware testing, comprising: a probe, and a probe pin and a transmission line that are disposed on the probe; and further comprising: a connection piece disposed on an upper surface of the probe, and a magnifying lens apparatus connected to the connection piece and used for magnifying a testing point. The connection piece is a guide way, and the magnifying lens apparatus is movably or fixedly connected to the guide way. The magnifying lens apparatus comprises: a magnifying lens, and an extension piece, having one end rotationally connected to the magnifying lens and the other end movably or fixedly connected to the guide way. In this utility model, the probe apparatus for hardware testing has a simple structure, and convenient use, and has a function of observing and magnifying a pin and a through hole, thereby improving convenience of using a conventional probe, and protecting a chip.

Programmable/reprogramable structure using fuses and antifuses

Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable burn-in board in one embodiment and an electrically programmable device-under-test (DUT) card in another embodiment. Both types of programmable elements can also be used in a reconfiguration device for interconnecting electrical contacts in a first configuration to electrical contacts in a second configuration. The various embodiments of this invention include, for example, a component socket, a socket adapter, a cable, a cable adapter, a scrambler card for a burn-in board and a device-under-test card for a burn-in board. A method for forming a fuse is also disclosed.

Microwave probe fixture

A fixture having a header plate (20) in rectangular shape with a notch (28) on each end and an aperture (22) in the middle defined as a through hole. A plurality of microwave connectors (30) are located on the top surface of the header plate (20) adjacent to the aperture and penetrate through the body with the connector extended contact planar with the bottom. A substrate (32) of dielectric material with a ground plane on one side and a plurality of striplines (34) on the other is attached into a recess peripherally positioned on the bottom side of the aperture (22). The striplines (34) are joined to the connectors (30) on one end and to individual probe needles (38) with angular tips on the other near the midmost point. A centrally located access opening (36) in the substrate (32) allows visual indication of the probe needles (38) for positioning upon node points and inspection points on a microwave semiconductor wafer under test. The device allows a flowpath for microwave signals from ...

Low-current probe card

A low-current probe card for measuring currents down to the femtoamp region includes a dielectric board, such as of glass-epoxy material, forming an opening. A plurality of probing devices, such as ceramic blades, are edge-mounted about the opening so that the probing elements or needles included thereon terminate below the opening in a pattern suitable for probing a test device. A plurality of cables are attached to the card for respectively connecting each device to a corresponding channel of a test instrument. The on-board portion of each cable is of coaxial type and includes an inner layer between the inner dielectric and outer conductor for suppressing the triboelectric effect. An inner conductive area and a conductive backplane that are respectively located below and on one side of each device are set to guard potential via the outer conductor of the corresponding cable so as to guard the signal path on the other side of the device. The lead-in portion of each cable, which is detachably ...

X-band logic test jig

A jig (10 is provided for testing high speed integrated circuit devices (52). The jig includes a lead guide (50) for automatically aligning the IC leads (54) with the signal carrying traces (22). The underside of the jig is provided with a grounded pad (30) that enables leadless external components (86) to be easily connected to given leads of the IC under test.

Electrical connecting apparatus and contacts used therefor

An electrical connecting apparatus 10 comprises: a base plate 16 provided on its underside 14 with a plurality of pedestals 12 at intervals in a front-back direction; and multiple contact groups, each of which has a first contact 18 and a second contact 19. Each first contact 18 includes a needle body portion 24 having a rear end portion 20 supported on the pedestal 12 and a front end portion 22 which is a free end and extending leftward. Each second contact 19 includes a needle body portion 25 having a rear end portion 21 supported on the pedestal 12 and a front end portion 23 which is a free end and extending rightward. When the first contact 18 is broken, the second contacts 19 can be used.

Датчик напряженности электрического поля

Полезная модель относится к области измерительной техники и может быть использована для измерения ортогональных составляющих вектора напряженности электрического поля. датчик напряженности электрического поля содержит проводящий цилиндр. На поверхности цилиндра изолировано друг от друга и от цилиндра, на двух координатных осях попарно расположены четыре проводящих чувствительных элемента в форме цилиндрического прямоугольника, разделенных двумя взаимно-перпендикулярными плоскостями, проходящими через ось цилиндра. При этом координатные оси датчика проходят не через центры чувствительных элементов, а располагаются во взаимно-перпендикулярных плоскостях, разделяющих боковую поверхность датчика на четыре цилиндрических прямоугольника. Техническим результатом является увеличение чувствительности двухкоординатного датчика напряженности электрического поля до чувствительности однокоординатного (в 1,4 раза). 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 183 095 U1 (51) МПК G01R 29/12 (2006.01) G01R 1/067 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК G01R 29/12 (2018.05); G01R 1/067 (2018.05) (21)(22) Заявка: 2018120984, 06.06.2018 (24) Дата начала отсчета срока действия патента: 11.09.2018 Приоритет(ы): (22) Дата подачи заявки: 06.06.2018 (56) Список документов, цитированных в отчете о поиске: ФИЗИЧЕСКИЕ ОСНОВЫ (45) Опубликовано: 11.09.2018 Бюл. № 26 (54) ДАТЧИК НАПРЯЖЕННОСТИ ЭЛЕКТРИЧЕСКОГО ПОЛЯ (57) Реферат: Полезная модель относится к области проходящими через ось цилиндра. При этом измерительной техники и может быть координатные оси датчика проходят не через использована для измерения ортогональных центры чувствительных элементов, а составляющих вектора напряженности располагаются во взаимно-перпендикулярных электрического поля. датчик напряженности плоскостях, разделяющих боковую поверхность электрического поля содержит проводящий датчика на четыре цилиндрических цилиндр. На поверхности цилиндра ...

Test prod for high-frequency measurement

A test prod for high-frequency measurement having a contact-side end for electrically contacting planar structures and a cable-side end, for connecting to a cable, wherein between the contact-side end and the cable-side end a coplanar conductor structure having at least two conductors is arranged, wherein on the coplanar conductor structure a dielectric is arranged over a predetermined section between the cable-side end and the contact-side end, wherein the test prod is between the dielectric and the contact-side end such that the conductors of the coplanar conductor structure are arranged freely in space and relative to the dielectric in a suspending manner, wherein on one side of the test prod facing towards the planar structure a shielding element is arranged extending into the area of the coplanar conductor structure.

Microsprings Partially Embedded In A Laminate Structure And Methods For Producing Same

At least one microspring has applied thereover a laminate structure to provide: mechanical protection during handling and wafer processing, a spring spacer layer, strengthening of the anchor between spring and substrate, provision of a gap stop during spring deflection, and moisture and contaminant protection. A fully-formed laminate structure may be applied over the microspring structure or a partly-formed laminate structure may be applied over the microspring structure then cured or hardened. The tip portion of the microspring may protrude through the laminate structure and be exposed for contact or may be buried within the contact structure. The laminate structure may remain in place in the final microspring structure or be removed in whole or in part. The laminate structure may be photolithographically patternable material, patterned and etched to remove some or all of the structure, forming for example additional structural elements such as a gap stop for the microspring.

Signal Acquisition Probe Storing Compressed or Compressed and Filtered Time Domain Impulse or Step Response Data for Use in a Signal Measurement System

A signal acquisition probe stores compressed or compressed and filtered time domain data samples representing at least one of an impulse response or step response characterizing the signal acquisition probe. The compressed or compressed and filtered time domain data samples of the impulse response or the step response are provided to a signal measurement instrument for compensating the signal measurement instrument for the impulse or step response of the signal measurement instrument.

Semiconductor test probe apparatus and method

An improved probe card system includes a probe assembly having a cantilever probe with a contact arm integral with and extending from a distal end of the probe, wherein the contact arm is oriented substantially parallel to a die or other material to be tested. The contact arm may be an elongated tip of the probe configured to contact a bumped pad or other contact on an outer surface of the arm. Inherent cantilever action of the probe may translating to a scrubbing action of the side of a contact arm on a test pad or solder ball. Some embodiments employ two or more probes for Kelvin-type probing, and the contact arm at the end of the probe can incorporate a substantially straight arm or a bent arm to follow the contour of a solder bump.

Insulated probe pin and method for fabricating the same

An insulated probe pin 10 includes a conductor probe pin 11 and an insulator coating 12 covering a periphery of the conductor probe pin 10 such that a sensing-side end portion of the conductor probe pin 10 is exposed. An end portion 12 a of the insulator coating 12 toward the sensing-side end of the conductor probe pin 11 has a thickness larger than that of an end portion of the insulator coating 12 toward a connection-side end of the conductor probe pin 11 in an entire periphery of the insulator coating 12.

Socket for a semiconductor device

A device, wherein, at cells 10 ai of a metallic upper housing 10 corresponding to a signal line, between an end portion of an adapter 24 that has electrically insulating properties the inner surface of an upper housing 12 that has electrically insulating properties, an annular air layer Ai is formed at the peripheries of sleeves 20 S of contact terminals 20 ai that have the same structure as each other, and wherein, at the cells 10 ai that correspond to ground lines, contact points 20 CT 2 of the contact terminals 20 ai are inserted in through-holes 12 ai of the lower housing 12, and their contact points 20 CT 1 are inserted into small diameter holes 22 b of conductive collars 22 that touch the inner surfaces of the cells 10 ai.

Signal sensing device and circuit boards

Apparatus are provided for use in testing circuit boards. A signal sensing device includes one or more probes. Each probe includes a length of rigid coaxial conductor configured to define a sensing pin at one end. A circuit board defines a number of through vias lined in metal and configured to receive the sensing pin of a corresponding probe. The signal sensing device also includes a ground pin. Electrical pathways extending away from adjacent pairs of the through vias can be tested for electrical impedance and other signal propagating characteristics by way of the signal sensing device.

Contact head, probe pin including the same, and electrical connector using the probe pin

The contact head includes a head base, and at least two elastic contact pieces located on an upper end portion of the head base and configured to electrically contact a contact target object. A dent having a circular horizontal cross-sectional shape is formed at a central portion surrounded by the at least two elastic contact pieces. Additionally, each of the elastic contact pieces is formed with a tip end serving as a free end of the elastic contact piece located on a circumference of at least one virtual circle which is a circle concentric with an inscribed circle inscribed in a horizontal cross-sectional shape of the head base and which has a diameter being the same as or smaller than a diameter of the inscribed circle. Moreover, the contact piece is formed to be elastically deformable in a vertical direction by being formed to extend spirally.

Vertical probe tip rotational scrub and method

A vertical probe tip rotational scrub and method is described. The vertical probe includes a wafer prober chuck; a wafer positioned on the wafer prober chuck; and at least one probe having a probe tip, the at least one probe tip rotatably mounted such that the probe tip provides a rotational scrub on a surface of a wafer surface. A method for wafer probing is also described, the method includes: determining a vertical location of a wafer surface relative to at least one probe having a probe tip; retracting the probe tip; and imparting an upward motion on the at least one probe in response to the retracting of the probe tip, wherein the upward motion results in a rotational scrub of the wafer surface.

Test Contact System For Testing Integrated Circuits With Packages Having An Array Of Signal and Power Contacts

A test fixture ( 120 ) is disclosed for electrically testing a device under test ( 130 ) by forming a plurality of temporary mechanical and electrical connections between terminals ( 131 ) on the device under test ( 130 ) and contact pads ( 161 ) on the load board ( 160 ). The test fixture ( 120 ) has a replaceable membrane ( 150 ) that includes vias ( 151 ), with each via ( 151 ) being associated with a terminal ( 131 ) on the device under test ( 130 ) and a contact pad ( 161 ) on the load board ( 160 ). In some cases, each via ( 151 ) has an electrically conducting wall for conducting current between the terminal ( 131 ) and the contact pad ( 161 ). In some cases, each via ( 151 ) includes a spring ( 152 ) that provides a mechanical resisting force to the terminal ( 131 ) when the device under test ( 130 ) is engaged with the test fixture ( 120 ).

Contact assembly

A contact assembly for receiving a spring probe unit includes an elongate contact element adapted to electrically contact the spring probe unit. The contact element includes a stop for restraining movement of the spring probe unit towards the stop in the direction of an axis along the length of the contact element, and urging means, adapted to urge the spring probe unit against the contact element for removable engagement of the spring probe unit with the contact element.

Interposer

An interposer includes a substrate having a first surface and a second surface with vias extending between the first and second surfaces. The interposer also includes a contact array mounted to the first surface that has a plurality of coil-shaped contacts. The contacts have heels terminated to corresponding vias. The contacts have beams defining a mating interface of the interposer configured for mating with an electronic component. The contacts may be conic helix shaped. The beams may include at least one turn. The beams may be free standing from the heel and may be compressible along contact axes toward the first surface of the substrate.

Wafer level testing structure

A wafer level testing structure, disposed between a wafer and a prober, for transmitting the electrical signal of the wafer to the prober, the wafer level testing structure includes: a socket and a probe interface board disposed between the socket and the prober, wherein the probe interface board is electrically coupled to the prober, and a plurality of pogo pins is inserted through the socket, and one end of the plurality of pogo pins is electrically coupled to the wafer, the other end of the plurality of pogo pins is electrically coupled to the probe interface board, thereby the electrical signal of the wafer transmits from the probe interface board to the prober.

Test probe with ceramic coating and test instrument

The present invention discloses a test probe including a conductive member having a first end defined by an electrically conductive tip, and an insulative member surrounding a first portion of the conductive member. The second portion of the conductive member between the first end and the first portion is coated with a layer of insulative material. The test probe in the present invention does not require separate probe tips to be carried for use on various test applications but still meet the safety requirement of IEC standard.

High-frequency coupling testing device by coupling effect

Method for transmitting a high-frequency signal by a coupling effect includes receiving a high-frequency signal by a high-frequency circuit and coupling the high-frequency signal to a coupling circuit by the coupling effect to output a high-frequency coupled signal, and adjusting a filter between the coupling circuit and the high-frequency circuit formed by the coupling effect for adjusting transmission frequency of the high-frequency coupled signal; upon when the high-frequency circuit includes a high-frequency metal probe, the coupling circuit comprises a coupling transmission wire. Meanwhile, upon when the high-frequency circuit includes the coupling transmission wire, the coupling circuit includes the high-frequency metal probe. Further, the filter between the coupling circuit and the high-frequency circuit can be adjusted by changing the number of the coupling metal probes surrounding the high-frequency metal probe, or by changing the distances between the coupling metal probes and the high-frequency metal probes.

Non-Linear Vertical Leaf Spring

An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.

Signal Acquisition System Having a Compensation Digital Filter

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system having an input amplifier with feedback loop circuitry and a compensation digital filter providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Switched Multi-Lead Test Adapter

A switched multi-lead test adapter is described. The multi-lead adapter has a main lead and a plurality of test leads. Each lead is connected to a switch that selects one of the test leads for connection to the main lead, or for connection to another test lead. The switch allows only one conductive path between the leads, so that the remaining, unselected leads to not cause interference on an active telecommunication wire, such as a DSL line. The test leads include multiple terminating connectors for connecting to various terminal blocks and cabling systems.

High Voltage Sensing Mechanism with Integrated On-Off Switch

The present invention is an efficient high voltage sensing mechanism that operates only when an individual needs to test the voltage across a wire. The present invention attaches around a tested wire using a jaw and a hook. The hook is tensioned using an expansion spring. The operator propels the hook outwards from the jaw, around the tested wire; thereafter, the expansion spring retracts to latch onto the tested wire against the jaw. An on-off switch is integrated into the mechanical hook device. As the hook is propelled outwards, the on-off switch moves into the “on” position, which powers the electrical processing and voltage analysis equipment. Once the hook is returned to the initial position, the on-off switch moves to the “off” position. This arrangement allows the present invention to remain unpowered for any instance a wire is not being tested. The present invention detects voltage through capacitive coupling.

Cable assembly, connector and semiconductor tester

In a cable assembly, when auxiliary ground conductor is provided so as to face the lower surface of supporting insulating member, elastically-deformed piece in an elastically deformed status comes in contact with the tip of ground terminal protruding from the lower surface of supporting insulating member.

Connection terminal and connection jig

Provided is a connection terminal that maintains an approximately circular shape before or after a cylindrical part is fixed by resistance welding. The connection terminal used for a connection jig interconnecting target points includes a small-diameter conductive part and a large-diameter cylindrical part disposed to surround the small-diameter conductive part. The small-diameter conductive part has a front end protruding from a front end of the large-diameter cylindrical part. A part of the small-diameter conductive part is joined to a part of the large-diameter cylindrical part. A cutout part is formed in a part of a strip portion around an axis of the cylindrical part that at least includes the portion of the large-diameter cylindrical part which is joined to the small-diameter conductive part.

Indirect non-contact high voltage measurement on electrical power line

A non-contact electrical power line voltage measurement device comprises a probe including an insulated shield supporting an electrode to sense electrostatically induced voltage from the power line. The shield houses a high voltage resistor connected in series with the electrode. A meter comprises a housing operatively associated with the shield and enclosing a measurement circuit electrically connected to the high voltage resistor for measuring induced electrode voltage. A calibration circuit correlates measured electrode voltage to power line voltage. A display is driven by the measurement circuit for displaying actual power line voltage responsive to the electrode being a select distance from the power line.

Probe card and manufacturing method thereof

There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin.

Electrically Conductive Kelvin Contacts For Microcircuit Tester

Terminals () of a device under test (DUT) are connected to corresponding contact pads or leads by a series of electrically conductive contacts. Each terminal testing connects with both a “force” contact and a “sense” contact. In one embodiment, the sense contact () partially or completely laterally surrounds the force contact (). In order to increase the contact surface, the force contact, in a spring pin () configuration contacts the device under test terminal at that portion of the lead which is curved or angled, rather than orthogonal to the pin. 112502. A device for forming a plurality of temporary mechanical and electrical connections between a device under test (DUT) () having a plurality of terminals ( , ) , comprising:{'b': 700', '1', '700', '2', '502', '2', '502, 'a plurality of electrically conductive force contacts () extending toward a device under test () and being deflectable, each force contact () in the plurality being laterally arranged to correspond to one terminal (, ); said force contacts being a plurality of vertically oriented spaced spring biased pins, each pin including a contact point aligned to engage said terminals (,) on a portion of the terminal which is not orthogonal to the terminal and'}{'b': 74', '554', '74', '554', '652', '2', '502', '74', '554', '1', '501', '652, 'a plurality of electrically conductive sense contacts (,), each sense contact (, ) in the plurality being laterally arranged to correspond to one force contact () and one terminal (, ), each sense contact (, ) in the plurality extending toward the device under test (, ) proximate the corresponding force contact ();'}{'b': 74', '554', '76', '554', '1', '501', '72', '552, 'wherein each sense contact (, ) in the plurality includes a freely movable portion (, ) extending resiliently toward device under test (,) wherein the sense contact is laterally separated from the corresponding force contact (, ); and'}{'b': 772', '764', '770, 'wherein the free portion includes an ...

PROBE

Disclosed is a probe which stably transmits a test signal. The probe electrically connects a semiconductor device and a tester for testing the semiconductor device. The probe may include an upper plunger which is configured to be electrically connected to the semiconductor device; a lower plunger which is configured to be electrically connected to the tester; an elastic member which is disposed between the upper plunger and the lower plunger, and elastically biases the upper and lower plungers to have them spaced from each other; a conductive member which is disposed in an inside or outside of the elastic member and electrically connects the upper plunger and the lower plunger; and a barrel which accommodates therein the upper plunger, the lower plunger, the elastic member and the conductive member. 1. A probe which electrically connects a semiconductor device and a tester for testing the semiconductor device , the probe comprising:an upper plunger which is configured to be electrically connected to the semiconductor device;a lower plunger which is configured to be electrically connected to the tester;an elastic member which is disposed between the upper plunger and the lower plunger, and elastically biases the upper and lower plungers to have them spaced from each other;a conductive member which is disposed in an inside or outside of the elastic member and electrically connects the upper plunger and the lower plunger; anda barrel which accommodates therein the upper plunger, the lower plunger, the elastic member and the conductive member.2. The probe according to claim 1 , wherein the conductive member electrically connects the upper and lower plungers only when at least one of the upper plunger and the lower plunger moves toward the other one of the upper plunger and the lower plunger.3. The probe according to claim 1 , wherein the conductive member selectively contacts at least one of the upper plunger and the lower plunger.4. The probe according to claim 3 , ...

CONTACT PROBE AND PROBE UNIT

A contact probe includes a conductive first plunger including, on a same axis, a distal end portion, a flange portion, a boss portion, and a base end portion, a conductive second plunger including, on the same axis, a second distal end portion and a boss portion, and a coil spring including a coarsely wound portion formed by winding at a predetermined pitch with an inner diameter equal to or larger than a diameter of the boss portion of the first plunger and a tightly wound portion formed by tightly winding with an inner diameter substantially equal to a diameter of the boss portion of the second plunger, so that the first plunger and the second plunger are connected to each other on the same axis. 1. A contact probe comprising:a conductive first contact member comprising, on a same axis, a first distal end portion having a tapered distal end shape, a first flange portion extending from a base end side of the first distal end portion and having a diameter larger than a diameter of the first distal end portion, a first boss portion extending from an end portion of the first flange portion different from the side of the first boss portion which is connected to the first distal end portion and having a diameter smaller than a diameter of the first flange portion, and a first base end portion extending from an end portion of the first boss portion different from the side of the first base end portion which is connected to the first flange portion and having a diameter smaller than a diameter of the first boss portion;a conductive second contact member comprising, on the same axis, a second distal end portion having a tapered distal end shape and a second boss portion extending from a base end side of the second distal end portion and having a diameter substantially equal to a diameter of the first base end portion; anda coil spring comprising a coarsely wound portion formed by winding at a predetermined pitch with an inner diameter larger than the diameter of the first ...

MICROMACHINED ON-WAFER PROBES AND RELATED METHOD

A micromachining process to fabricate a single chip that simple drops into a supporting structure. The micromachining process provides the ability to create a probe that will interface with integrated circuits, for example, operating at frequencies in the range of about 100 GHz to about 3,000 GHz (3 THz). This approach creates a silicon structure (or other applicable choice of material) that provides mechanical force for probing while supporting the transfer of the high frequency energy between a measurement system and the integrated circuit, individual device or material. 1150-. (canceled)151. A device for probing a structure on a surface of an object substrate , said device comprising a microfabricated compliant chip , wherein said microfabricated compliant chip comprises integrated electrical interconnects.152. The device of claim 151 , wherein said microfabricated compliant chip is monolithic.153. The device of claim 151 , wherein said integrated electrical interconnects of said microfabricated compliant chip comprise:at least one compliant beam;at least one transmission circuit; anda waveguide transition element, wherein said at least one transmission circuit suitable to electrically interconnect said at least one compliant beam with said waveguide transition element.154. The device of claim 151 , wherein said microfabricated compliant chip is configured to be secured by a housing.155. The device of claim 154 , wherein said securement comprises detachably engaging said microfabricated compliant chip to said housing.156. The device of claim 154 , wherein said securement is provided by compressive forces.157. The device of claim 154 , wherein said housing comprises an aperture configured to receive said microfabricated compliant chip.158. The device of claim 157 , wherein said housing aperture comprises at least one of the following: slot claim 157 , groove claim 157 , recess claim 157 , channel claim 157 , tunnel claim 157 , indentation claim 157 , passage claim ...

TEST PROBE FOR TEST AND FABRICATION METHOD THEREOF

A method of fabricating a test probe includes a first conductive providing operation in which a first conductive member formed of a conductive metal material is provided, the first conductive member including a probe portion that has a probe shape and is formed in an upper portion of the first conductive member by a micro-electromechanical systems (MEMS) process, a second conductive member providing operation in which a second conductive member formed of a conductive metal material is provided, the second conductive member having an insertion portion formed in an upper portion of the second conductive member for inserting the first conductive member to be coupled to the insertion portion, an insertion operation in which the first conductive member is inserted into the insertion portion of the second conductive member, and a fixing and coupling operation in which the first conducive member is fixedly coupled to the second conductive member by deforming a part of the second conductive member. 1. A method of fabricating a test probe , the method comprising:a first conductive member providing operation in which a first conductive member formed of a conductive metal material is provided, the first conductive member comprising a probe portion that has a probe shape and is formed in an upper portion of the first conductive member by a micro-electromechanical systems (MEMS) process;a second conductive member providing operation in which a second conductive member formed of a conductive metal material is provided, the second conductive member having an insertion portion formed in an upper portion of the second conductive member for inserting the first conductive member to be coupled to the insertion portion;an insertion operation in which the first conductive member is inserted into the insertion portion of the second conductive member; anda fixing and coupling operation in which the first conducive member is fixedly coupled to the second conductive member by deforming a ...

Test Pad Structure, A Pad Structure For Inspecting A Semiconductor Chip And A Wiring Substrate For A Tape Package Having The Same

A test pad structure may include a plurality of test pads and a plurality of connection leads. A plurality of the test pads may be sequentially arranged from a wiring pattern on a substrate and arranged in rows parallel with one another. The plurality of the test pads may include a first group of test pads having at least one pad and a second group of test pads having at least two pads. A plurality of the connection leads may extend from end portions of the wiring pattern to be connected to the plurality of test pads. A plurality of the connection leads may include at least one inner lead passing between the at least two pads of the second group of the test pads and arranged in a first row closest to the first group of the test pads. The at least one inner lead may be connected to at least one pad of the at least two pads of the second group of the test pads arranged in a second row next to the first row. 1. A test pad structure , comprising: 'the plurality of test pads including a first group of test pads having at least one pad arranged in a first row and a second group of test pads having at least two first pads and at least two second pads, the at least two first pads arranged in a second row parallel with the first row, and the at least two second pads arranged in a third row parallel with the first row; and', 'a plurality of test pads sequentially arranged from a wiring pattern on a substrate and arranged in rows parallel with one another,'} 'the plurality of connection leads including a first group of connection leads connected to the first group of test pads and a second group of connection leads having first leads and second leads, the first leads connected to the at least two first pads, and one of the second leads passing between the at least two first pads to be connected to at least one of the at least two second pads arranged in the third row next to the second row,', 'a plurality of connection leads extending from end portions of the wiring pattern to ...

Hybrid Electrical Contactor

An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad.

Passive capture adapter circuit for sensing signals of a high-speed circuit

A multi-stage passive capture adapter (PCA) circuit is configured to sense and recover digital signals present on a high-speed serial bus for capture and analysis in external test equipment. A first stage of the PCA circuit includes a differentiator that functions as a high impedance probe that contacts the serial bus to capture an original input signal waveform of the high-speed digital signals. The signal waveform is fed to a dual-slope comparator/driver that includes a plurality of high-speed comparators and drivers. The second stage includes a differential receiver/shaper that converts logic levels of differential receiver outputs to input signals that set and reset a signal restorer whose output signals are fed to a driver of a driver/shaper. The output of the driver is then fed to a shaper network configured to substantially match an output signal of driver/shaper to the input signal waveform sensed from the high-speed serial bus.

PROBE ASSEMBLY FOR INSPECTING POWER SEMICONDUCTOR DEVICES AND INSPECTION APPARATUS USING THE SAME

The present invention provides a probe assembly for inspecting power semiconductor devices, which comprises (1) a probe block having more than one probe holding hole, (2) more than one probe, each of which is contained in one of the probe holding holes with its outer surface being in contact with the inner surface of the probe holding hole, and which has lower end protruding from the probe block and coming into contact with the power semiconductor device on inspection, and (3) one or more cooling means which cool the probe block. According to the probe assembly and the inspection apparatus having the prove assembly of the present invention, it is possible to inspect characteristics of power semiconductor devices accurately by suppressing temperature rises of the probes as well as the power semiconductor device under test. 1. A probe assembly for power semiconductor devices , which comprises;(1) a probe block having more than one probe holding hole,(2) more than one probe, each of which is contained in one of the probe holding holes with its outer surface being in contact with the inner surface of the probe holding hole, and which has lower end protruding from the probe block and coming into contact with the power semiconductor device on inspection, and(3) one or more cooling means which cool the probe block.2. The probe assembly for power semiconductor devices according to claim 1 , wherein one of the cooling means is a blower which blows cooling gas to the probe block.3. The probe assembly for power semiconductor devices according to claim 2 , wherein the probe block has cooling fins.4. The probe assembly for power semiconductor devices according to claim 3 , wherein the upper ends of the probes protrude from the probe block and function as cooling fins.5. The probe assembly for power semiconductor devices according to claim 1 , wherein the probe block has a cooling chamber inside and/or outside of the probe block and one of the cooling means is a cooling medium ...

SUSPENDED IO TRACE DESIGN FOR SSP CANTILEVER DATA READ / WRITE

A suspended IO trace design for SSP cantilever Read/Write is described. Instead of having the whole I/O trace attached to surface of the cantilever, the cantilever is designed with fish-bone-like support and the I/O traces are anchored to cantilever structures at some specific attachment locations with dielectric insulation in between. This design provides very compliant trace compared to cantilever's see-saw actuation around the torsional beam pivot and is also insensitive to residual stress variations from I/O trace in fabrication. 1. A seek-scan probe , comprising:a pair of lateral actuation structures;a cantilever structure having a probe tip on its terminal end and attached to a bottom actuation electrode at its opposite end;a pair of I/O pads electrically connected to traces on corresponding ones of the lateral actuation structures; andthe traces suspended from the pair of lateral actuation structures to the cantilever structure over a dielectric layer connecting to the probe tip.2. The seek-scan probe as recited in wherein the traces on the cantilever structure comprise a step trace design pattern.3. The seek-scan probe as recited in wherein the traces on the cantilever structure comprise a curved suspended trace design pattern.4. The seek-scan probe as recited in further comprising a torsional beam pivot for the cantilevered structure.5. The seek-scan probe as recited in further comprising frame supports for the lateral actuation structures.6. The seek-scan probe as recited in further comprising trace anchors to anchor the trace to the cantilevered structure.7. A method claim 1 , comprising:providing a pair of lateral actuation structures;providing a cantilever structure having a probe tip on its terminal end and attached to a bottom actuation electrode at its opposite end;providing a pair of I/O pads electrically connected to traces on corresponding ones of the lateral actuation structures; andsuspending the traces from the pair of lateral actuation ...

Vertical probe assembly with air channel

A vertical probe assembly includes an upper die; a lower die; a plurality of probes, the probes comprising an electrically conductive material, wherein the probes extend from the upper die through the lower die; and an air channel located between the upper die and the lower die, such that airflow through the air channel passes through the plurality of probes.

SIGNAL TRANSMISSION LINES WITH TEST PAD

A pair of signal transmission lines includes an aggressor line, a victim line, a first test pad, and a second test pad. The first test pad is in the aggressor line. The victim line is parallel to the aggressor line. A second test pad is in the victim line. The first test pad, on the aggressor line, is misaligned with the second test pad, on the victim line, to reduce the incidence and amplitude of any crosstalk generated. 1. A pair of signal transmission lines , comprising:an aggressor line;a first test pad linked in the aggressor line;a victim line parallel to the aggressor line; anda second test pad linked in the victim line;wherein the first test pad, on the aggressor line, is misaligned with the second test pad, on the victim line.2. The pair of signal transmission lines of claim 1 , wherein length of each of the aggressor line and the victim line is h; the aggressor line comprises a first aggressor line end and a second aggressor line end; the victim line comprises a first victim line end in alignment with the first aggressor line end of the aggressor line claim 1 , and a second victim line end in alignment with the second aggressor line end of the aggressor line; the aggressor line is placed parallel to a one dimension coordinate axis with the first aggressor line end in alignment with a zero point of the coordinate axis claim 1 , and the first test pad and the second test pad have different coordinate values.3. The pair of signal transmission lines of claim 2 , wherein two not-negative values claim 2 , a and b claim 2 , satisfy the following equation: a+b=h/2 claim 2 , a first test pad coordinate value is a claim 2 , and a second test pad coordinate value pad is h−b.4. The pair of signal transmission lines of claim 3 , wherein each of the two not-negative values claim 3 , a and b claim 3 , is equal to h/4.5. The pair of signal transmission lines of claim 1 , wherein the first test pad and the second test pad have a same delay time.6. The pair of signal ...

Schottky Diode Radio Frequency Detector Probe With Amplitude Linearity Compensation

A passive radio frequency probe that can detect low level RF signals is disclosed. Schottky diodes are used in the probe to convert alternating current (AC) signals to direct current (DC) signals on a one-to-one basis within a given tolerance. The probe is used with a DC voltmeter to permit measurements of radio frequency signals.

Probes With Programmable Motion

The elongated body of an electrically conductive contact probe can be disposed in a guide hole and can include a patterned region for engaging and riding on a contact region of an inner sidewall of the guide hole as the elongated body moves in the guide hole in response to a force on a tip of the probe. As the patterned region rides the contact region, the tip moves in a lateral pattern that is a function of the surface(s) of the patterned region. 1. An electronic contactor apparatus comprising:a guide comprising a guide hole; anda probe comprising a tip at an end of an elongated body disposed in said guide hole, said elongated body comprises a first patterned region that contacts and rides on a first contact region of a first inner sidewall of said guide hole as said elongated body moves in said guide hole in response to a force on said tip, and', 'as said first patterned region rides on said first contact region, said tip moves in a pattern that comprises a lateral pattern that is a function of said one or more surfaces of said first patterned region., 'wherein2. The apparatus of claim 1 , said first patterned region comprising one or more surfaces that extend into or out of a side of said elongated body.3. The apparatus of claim 2 , wherein:said elongated body comprises a second patterned region that contacts and rides on a second contact region of a second inner sidewall of said guide hole as said elongated body moves in said guide hole in response to said force, said second patterned region comprising one or more surfaces that extend into or out of a side of said elongated body, andsaid lateral pattern is a function of said one or more first surfaces of said first patterned region and said one or more surfaces of said second patterned region.4. The apparatus of claim 3 , wherein:said first contact region is part of said first inner sidewall of said guide hole adjacent a first opening of said guide hole in a first surface of said guide, andsaid second contact ...

PITCH CHANGING APPARATUS, ELECTRONIC DEVICE HANDLING APPARATUS, AND ELECTRONIC DEVICE TESTING APPARATUS

There is provided a pitch changing apparatus which can change a pitch of DUTs when the DUTs are transferred between trays by a shuttle revolving system. 1. A pitch changing apparatus which changes a pitch of electronic devices to be tested , the pitch changing apparatus comprising:a plurality of holding units which hold the electronic devices;a track which guides the plurality of holding units;a first moving unit which feeds the holding units along the track at a first pitch;a second moving unit which includes a plurality of receiving portions and moves the receiving portions along the track at a second pitch, the receiving portions which receive the holding units from the first moving unit; anda control unit which controls a feed rate of the first moving unit and a receiving rate of the second moving unit.2. The pitch changing apparatus according to claim 1 , whereinan interval between the plurality of holding units is variable on the track.3. The pitch changing apparatus according to claim 1 , whereinthe control unit makes the feed rate of the first moving unit and the receiving rate of the second moving unit be different from each other so as to change a pitch of the holding units.4. The pitch changing apparatus according to claim 1 , whereinthe control unit intermittently stops the first moving unit while moves receiving portions by the second moving unit so that the holding units do not convey to at least one among the receiving portions.5. The pitch changing apparatus according to claim 1 , whereinthe first moving unit moves the rearmost holding unit while making the plurality of holding units come into contact with each other so as to push the foremost holding unit toward the second moving unit.6. The pitch changing apparatus e according to claim 1 , whereinthe second moving unit includes:an endless belt on which the plurality of receiving portions are mounted at the second pitch and which is provided in parallel with the track;at least two pulleys on which ...

Ground Spring with Strain Relief

A ground spring for receiving a ground end of a high-frequency test probe is described. The ground spring includes a generally annular base portion, and a number of elongated spring fingers extending from the base portion. The fingers extend generally radially inwardly from the base portion and have inner end faces that together define a substantially circular opening in a center portion of the ground spring. Each of the fingers have a tapered shape including a wider base portion end and a narrower inner end portion Each of the fingers has a longitudinal axis that is aslant relative to a reference line extending from the center of the ground spring to a center of the base portion of each finger. BMA connectors including the ground spring and test and measurement devices are also described.

Replaceable coupon for a probing apparatus

The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.

Signal acquisition system having reduced probe loading of a device under test

A signal acquisition system has a signal acquisition probe having probe tip circuitry coupled to a resistive center conductor signal cable. The resistive center conductor signal cable of the signal acquisition probe is coupled to a compensation system in a signal processing instrument via an input node and input circuitry in the signal processing instrument. The signal acquisition probe and the signal processing instrument have mismatched time constants at the input node with the compensation system providing pole-zero pairs for maintaining flatness over the signal acquisition system frequency bandwidth.

Structure of Bridging Electrode

In a structure of a bridging electrode, the structure of a bridging electrode applied to a capacitive touchpad, the structure comprising: a substrate; a plurality of first electrode blocks disposed on the substrate and electrically connected together in series through a first wire; a plurality of second electrode blocks disposed on the substrate and respectively disposed on two sides of the first wire; and a bridging insulation unit, which is perpendicular to and disposed on the first wire and having a bridging groove; wherein the second electrode blocks connecting electrically together in series through the bridging insulation unit having a second wire. 110-. (canceled)11. A structure of a bridging electrode applied to a capacitive touchpad , the structure comprising: a substrate layer; a transparent electro-conductive layer disposed on at least one side of the substrate layer; an alignment film layer disposed on one side of the substrate layer and the transparent electro-conductive layer; and an electro-conductive layer disposed adjacent to one side of the alignment film layer.12. The structure according to claim 11 , further comprising a protection layer disposed on at least one side of the structure of the bridging electrode.13. The structure according to claim 12 , wherein the protection layer is an organic material layer claim 12 , a photoresist layer claim 12 , an anti-reflective (AR) layer claim 12 , an anti-gloss (AG) layer or a combination thereof. (1) FIELD OF THE INVENTIONThe present invention relates to a layout method and a structure of an electrode, and more particularly to a layout method and a structure of a bridging electrode, in which a special mask is utilized to form bridging grooves in an insulation unit so that the overall yields of wires disposed in the bridging grooves cannot be deteriorated owing to the subsequent manufacturing processes.(2) DESCRIPTION OF THE PRIOR ARTIn the prior art of manufacturing a capacitive touchpad, two electrodes ...

CONTACT PROBE PIN

The present invention provides a contact probe pin in which a carbon film having both of conductivity and durability is formed on a base material with a tip divided, wherein Sn adherence can be reduced as much as possible to be able to maintain stable electrical contact over a long period of time, even under such circumstances that the temperature of a usage environment becomes high. The present invention relates to a contact probe pin, including a tip divided into 2 or more projections and repeatedly coming into contact with a test surface at the projection, wherein a carbon film containing a metal element is formed at least on a surface of the projection, and a radius of curvature at an apex part of the projection is 30 μm or more. 1. A contact probe pin , comprising:a tip divided into 2 or more projections and repeatedly coming into contact with a test surface at the projections,whereina carbon film comprising a metal element is present at least on a surface of the projections, anda radius of curvature at an apex part of the projections is 30 μm or more.2. The contact probe pin according to claim 1 , wherein the metal element is at least one selected from the group consisting of W claim 1 , Ta claim 1 , Mo claim 1 , Nb claim 1 , Ti and Cr.3. The contact probe pin according to claim 1 , wherein a content of the metal element is of from 5 to 30 atomic %.4. The contact probe pin according to claim 2 , wherein a content of the metal element is of from 5 to 30 atomic %.5. The contact probe pin according to claim 1 , wherein a thickness of the carbon film is of from 0.1 to 5 μm.6. The contact probe pin according to claim 2 , wherein a thickness of the carbon film is of from 0.1 to 5 μm.7. The contact probe pin according to claim 3 , wherein a thickness of the carbon film is of from 0.1 to 5 μm.8. The contact probe pin according to claim 4 , wherein a thickness of the carbon film is of from 0.1 to 5 μm.9. The contact probe pin according to claim 1 , wherein the test ...

METHOD FOR MANUFACTURING CONTACT PROBE

A method for manufacturing a contact probe includes: a lithography step of obtaining a resin mold by forming a pattern for the contact probe, a pattern for a tie bar in a shape of a frame therearound, and a pattern for a coupling portion coupling these two patterns, in a resist formed on a conductive substrate, by lithography; an electroforming step of forming a layer made of a metal material on the resin mold by electroforming to form a metal structure in which the contact probe is integral with the tie bar at the coupling portion; a removal step of removing the resin mold and the conductive substrate; a plating step of forming a plating layer on a surface of the metal structure by electroplating after the removal step; and a separation step of separating the contact probe from the metal structure after the plating step. 1. A method for manufacturing a contact probe , comprising:a lithography step of obtaining a resin mold by forming a pattern for the contact probe, a pattern for a tie bar in a shape of a frame therearound, and a pattern for a coupling portion coupling these two patterns, in a resist formed on a conductive substrate, by lithography;an electroforming step of forming a layer made of a metal material on said resin mold by electroforming to form a metal structure in which said contact probe is integral with said tie bar at said coupling portion;a removal step of removing said resin mold and said conductive substrate;a plating step of forming a plating layer on a surface of said metal structure by electroplating after said removal step; anda separation step of separating said contact probe from said metal structure after said plating step.2. The method for manufacturing the contact probe according to claim 1 , comprising a polishing step of polishing the surface of said metal structure before said plating step.3. The method for manufacturing the contact probe according to claim 1 , whereinthe pattern for said contact probe, the pattern for said tie bar ...

VARIABLE PRESSURE FOUR-POINT COATED PROBE PIN DEVICE AND METHOD

A variable pressure probe pin device, including: a housing with a channel having a first longitudinal axis; a probe at least partially disposed in the channel and including a plurality of probe pins configured to measure a property of a conductive layer; and a fluid pressure system configured to supply pressurized fluid o the channel to control a position of the probe within the channel. The housing or the probe is displaceable such that the plurality of probe pins contact the conductive layer. 1. A variable pressure probe pin device , comprising:a housing including a channel with a first longitudinal axis;a probe at least partially disposed in the channel and including a plurality of probe pins configured to measure a property of a conductive layer; and, 'the housing or the probe is displaceable such that the plurality of probe pins contact the conductive layer.', 'a fluid pressure system configured to supply pressurized fluid to the channel to control a position of the probe within the channel, wherein2. The device of claim 1 , wherein:the fluid pressure system configured to supply the pressurized fluid to the channel to control a position of the probe, within the channel, orthogonal to the first longitudinal axis3. The device of claim 1 , wherein:the housing includes a cylindrical wall forming the channel and including first and second pluralities of openings; and, supply the pressurized fluid through the first plurality of openings; and,', 'exhaust the pressurized fluid through the second plurality of openings., 'the fluid pressure system is configured to4. The device of claim 3 , wherein:the probe includes a second longitudinal axis;the plurality of probe pins includes first, second, third, and fourth probe pins symmetrically disposed about the second longitudinal axis in a circumferential direction;the cylindrical wall includes four portions, each portion aligned, in a direction orthogonal to the first longitudinal axis, with a respective one of the first, ...

PROBE AND METHOD OF MANUFACTURING PROBE

A probe is made to contact an electrode terminal in an electric circuit or an electronic part for an electric measurement of the electric circuit or the electronic part. The probe includes a terminal portion which is brought in contact with the electrode terminal at one end of the probe, a spring portion in which U-shaped unit portions are arrayed in a zigzag formation, and a housing portion which surrounds the spring portion. The probe is formed of a sheet of a metal sheet which is bent multiple times, the metal sheet having a predetermined configuration in which a portion corresponding to the terminal portion, a portion corresponding to the spring portion, and a portion corresponding to the housing portion are continuously linked together. 1. A method of manufacturing a probe which is made to contact an electrode terminal in an electric circuit or an electronic part for an electric measurement of the electric circuit or the electronic part , formed of a single metal sheet , and includes a terminal which is brought in contact with the electrode terminal , a spring in which U-shaped unit portions are arrayed in a zigzag formation , and a housing which surrounds the spring , the method comprising:forming the single metal sheet to have a portion corresponding to the terminal, a portion corresponding to the spring, and a portion corresponding to the housing such that they are linked together in this order; andbending the metal sheet to form the terminal, the spring and the housing.2. The method of manufacturing the probe according to claim 1 , wherein the probe is arranged that the terminal is disposed at one end of the probe claim 1 , and further includes a second terminal disposed at the other end of the probe claim 1 , andwherein, the metal sheet is formed to have a configuration that, the portion corresponding to the terminal, the portion corresponding to the spring, and a portion corresponding to the second terminal are linked together, and the portion ...

Multifunction Test Instrument Probe

A multifunction test instrument probe includes a housing having a hollow bore with an open end. A clamp plunger is carried in the hollow bore, with a first end including a thumb press, and a second end including an alligator clamp having a pair of jaws, with a compression spring normally biasing the thumb press away from the housing, and normally biasing the alligator clamp substantially within the hollow bore proximate the open end. A point plunger is also carried in the bore, with a first end including a thumb press, and a second end terminating in a point, with a second compression spring normally biasing the thumb press away from the housing, and biasing the point within the hollow bore proximate the open end. When the clamp plunger is depressed, the alligator clamp is extended from the open end and the jaws are urged open by a jaw spring, and when the clamp plunger is released, the compression spring acts to retract the alligator clamp back towards the hollow bore and the jaws are urged closed by contact with the open end. When the point plunger is depressed, the point is extended from the open end. When the clamp plunger is again depressed, the point retracts into the housing. 1. A multifunction test instrument probe comprising:a housing having a hollow bore with an open end;a first plunger carried in said hollow bore, said first plunger having a first end including a thumb press portion, a second end terminating in an alligator clamp having a pair of jaws, and a first plunger compression spring normally biasing said first end thumb press away from said housing, and normally biasing said alligator clamp substantially within said hollow bore proximate said open end;a second plunger carried in said hollow bore, said second plunger having a first end including a thumb press portion, a second end terminating in a point, and a second plunger compression spring normally biasing said first end thumb press away from said housing, and biasing said point within said ...

MULTIPLE RIGID CONTACT SOLUTION FOR IC TESTING

A chip testing solution having two separate contacts: one to provide current and one to measure voltage. One contact acts as the force and other as sense, and with its unique short wipe stroke technology enables the electrical connection from the contact terminal of the device under test (DUT) to the loadboard without fail even after prolonged insertion/testing of the devices. The two contacts are in close proximity, but electrically isolated from each other. Each contact is made to electrically touch a single conductive lead/pad on the DUT thus forming a test connection. The two contacts; one on front and other on back, wiping on the lead/pads will generally be a “sense” probe, and a “force” used for making a Kelvin connection. The short contact is connected to the loadboard by means of an additional contact known as “interposer” extending through and top of the tall contact base body. 2. An apparatus for establishing an electrical connection between a chip and a circuit board for testing said chip according to wherein the said tall contact is used to deliver electrical current to said chip claim 1 , and said short contact is used to detect voltage from said chip.3. An apparatus for establishing an electrical connection between a chip and a circuit board for testing said chip according to further including a short insulating housing for electrically insulating said short contact.4. An apparatus for establishing an electrical connection between a chip and a circuit board for testing said chip according to further including a pocket claim 1 , said pocket keeping said force insulating housing and said short insulating housing aligned.5. An apparatus for establishing an electrical connection between a chip and a circuit board for testing said chip according to wherein said interposer member is adapted to make electrical connection with said load board terminal with a sufficient pretension force to allow surface variations of the load board terminal.6. An apparatus for ...

System and method to provide talking feature and interactive voice menu in phasing meters

A high voltage detection device comprises a probe comprising an electrode for sensing a high voltage electrical line. The electrode is connected in series with a resistor. A meter comprises a housing enclosing a control for measuring parameters of line voltage. The control comprises an input module for connection to the probe to develop a voltage signal. A signal processing module receives the voltage signal and determines parameters of line voltage and drives an audio module. The audio module provides an audio output representing the determined parameters of line voltage.

CONTACT TEST DEVICE

Because a guide hole that guides a plunger of a probe requires cumbersome machining of a hole, it is difficult to accommodate to narrowing of pitch and multi-polarization of terminals or electrodes. A probe () is fitted into cylindrical retaining holes ( and ) formed in upper and lower blocks ( and ). The plunger () of the probe () has a plate-like guide portion (), and an edge contact portion (). The bottomed retaining hole () is formed in the upper block () from a lower part thereof and a guide groove () is formed from an upper surface (s) thereof. The guide portion () is guided movably vertically while being stopped from turning and from slipping out by the guide groove (). 110-. (canceled)11. A contact test device configured to test electrical characteristics of a test electronic parts , the contact test device comprising: a retaining portion;', 'a plate-like guide portion obtained by removing a side surface of the retaining portion of the plunger; and', 'a contact portion formed into a peak at an edge of the guide portion; and, 'a probe that comes in contact with a terminal or an electrode of a test electronic parts and includes a plunger biased such that it comes in resilient contact with the terminal or the electrode, the plunger including a retaining hole which is a bottomed hole formed from a side opposite from a surface of the first block on the terminal or electrode side; and', 'a guide groove formed to cross the bottomed hole on the surface and having a width narrower than that of the retaining hole;, 'a socket configured to retain the probe and including at least a first block positioned on a side of the terminal or electrode, the first block includingwherein the socket movably guides the plunger in an axial direction in the first block such that the retaining portion is retained and stopped from slipping out by the retaining hole of the block and is stopped from turning by the guide groove.12. The contact test device according to claim 11 , wherein the ...

NEEDLE PROBE FOR ANALYSIS OF MULTIPHASE FLOWS, PRODUCTION AND USE OF NEEDLE PROBE

A triaxial constructed needle probe for reliable differentiation of multiphase media, comprises a probe body having a central light conductor having a metallic surface and a distal end of which is to be inserted in the medium, a first electrically insulating sheath disposed around the optical fiber, a hollow cylindrical shield electrode arranged around the first insulating sheath, a second electrically insulating sheath arranged around the shield electrode, and a hollow cylindrical reference electrode arranged around the second insulating sheath, as well as a measuring circuit for measuring the optical refractive index and electrical conductivity of the medium. 17.-. (canceled)8. A needle probe for analysis of a flowing multiphase medium comprising a plurality of phases constituting a plurality of respective components , the needle probe comprising a needle probe body having a central light conductor , a metal sheath surrounding the central light conductor and a distal end of which metal-sheathed light conductor is situated at a head of the probe body for insertion in the multiphase medium , a first electrically insulating sheath arranged around the metal-sheathed light conductor , a hollow cylindrical shield electrode arranged around the first insulating sheath , a second electrically insulating sheath arranged around the shield electrode , and a hollow cylindrical reference electrode arranged around the second insulating sheath , the needle probe further comprising a measuring circuit optically and electrically connected to the needle probe body and having an optical measuring branch and an impedance measuring branch , wherein:a. the optical measuring branch includes an optical transmitter and an optical receiver and the light conductor is optically connected to the optical transmitter and to the optical receiver;b. the impedance measuring branch includes an AC voltage source, a transimpedance amplifier and a differential amplifier;c. the shield electrode and non- ...

PROBE AND PROBE CARD

A probe is provided with a linear main body portion having a tip in contact with an electrode of a member to be tested in a state where a board-side end is in contact with the circuit board side of a probe card. An elastic support portion is provided on a board-side end portion of the main body portion and elastically supports the main body portion on the probe card side. The support portion has its base end side integrally fixed to the board-side end portion and is formed with the distal end side directed toward the tip portion of the main body portion and curved having an arc shape toward the main body portion side. Two pieces of the support portion are provided symmetrically on both sides sandwiching the board-side end portion and are configured by being curved, each having an arc shape with the same radius of curvature. 1. A probe comprising:a linear main body portion having a tip in contact with an electrode of a member to be tested in a state where a board-side end is in contact with the circuit board side of a probe card; andan elastic support portion which is provided on a board-side end portion of the main body portion and elastically supports the main body portion on the probe card side.2. The probe according to claim 1 , whereinthe elastic support portion has its base end side integrally fixed to the board-side end portion of the main body portion and having the distal end side directed toward a tip portion of the main body portion and formed by being curved having an arc shape toward the main body side.3. The probe according to claim 2 , whereintwo pieces of the elastic support portion are provided symmetrically on the both sides sandwiching the main body portion on the board-side end portion of the main body portion and each is formed by being curved having an arc shape with the same radius of curvature.4. The probe according to claim 1 , whereinthe main body portion is a conductive material having elasticity.5. The probe according to claim 1 , ...

Contact and connector

A contact for electrically connecting two electric components, includes a first end portion which contacts an object to be contacted; a second end portion for passing a signal from the first end portion; an elastic portion which connects the first end portion with the second end portion while pushing the first end portion and the second end portion in an opposing direction, the elastic portion having a meandering shape from the first end portion to the second end portion and having a curved/bent structure provided with an open portion where a width of the open portion is different from the maximum inner width of the curved/bent structure of the elastic portion when seen from the opposing direction; and a housing portion which surrounds the elastic portion, wherein the first end portion, the second end portion, the elastic portion and the housing are formed by bending a single conductive plate.

RHODIUM ALLOY WHICH HAS EXCELLENT HARDNESS, PROCESSABILITY AND ANTIFOULING CHARACTERISTICS AND IS SUITABLE FOR WIRE ROD FOR PROBE PINS

The present invention is a rhodium alloy suitable for wire for a probe pin, the rhodium alloy comprising 30 to 150 ppm of Fe, 80 to 350 ppm of Ir and 100 to 300 ppm of Pt as additive elements, and the balance being Rh. A probe pin composed of the material maintains processability of rhodium, has stable contact resistance even at a low contact pressure, and has excellent strength and antifouling properties, and therefore, can be used in a stable manner for a long period. 1. A rhodium alloy suitable for wire for a probe pin , the rhodium alloy comprising: 30 to 150 ppm of Fe , 80 to 350 ppm of Ir and 100 to 300 ppm of Pt as additive elements , and the balance being Rh.2. A probe pin comprising the rhodium alloy defined in . The present invention relates to a rhodium alloy suitable for wire rod constituting a probe pin for testing electric properties of semiconductor integrated circuits or the like.Electric properties of semiconductor integrated circuits or the like are tested with a probe pin brought into contact with a large number of electrode pads thereof. Constituent materials of a probe pin are required to have various properties such as hardness for ensuring abrasion resistance for the test repeated several million times, oxidation resistance for preventing contamination of test objects caused by the generation of oxidation film, and low specific resistance for improving signal delay.Copper alloy such as beryllium copper and phosphor bronze, tungsten and palladium alloy or the like have long been known as a material for a probe pin. However, these conventional materials do not have all required properties. For example, copper alloy and tungsten have sufficient mechanical properties but are relatively easily oxidized, and palladium alloy has good oxidation resistance but may be slightly inferior in hardness or the like.Thus, as a novel constituent material of a probe pin, a material composed of precious metal such as iridium as a main component has been ...

APPARATUS AND METHOD FOR ACTIVE VOLTAGE COMPENSATION OF ELECTROSTATIC DISCHARGE OF A SUBSTRATE

A voltage compensation assembly adapted for apparatus having a prober for contacting the electronic elements on a substrate is described. The voltage compensation assembly includes a controller connected to the prober and adapted for active voltage compensation, and a voltage measuring unit connected to the controller and for measuring a voltage on the substrate. 1. A voltage compensation assembly adapted for a system having a prober configured to contact electronic elements on a substrate; the voltage compensation assembly comprising:a controller connected to the prober and adapted for active voltage compensation to the electronic elements via the prober;a voltage measuring unit connected to the controller and configured to measure a static voltage on the substrate, wherein the controller is configured to provide, via the prober, a voltage to the electronic elements in order to actively compensate the voltage on the substrate measured by the voltage measuring unit; andwherein the voltage measuring unit is configured to measure electronic field flux lines of the static voltage for measuring the static voltage of the substrate.2. The voltage compensation assembly according to claim 1 , wherein the voltage measuring unit is adapted for measuring an absolute value of the static voltage.3. The voltage compensation assembly according to claim 1 , wherein the voltage measuring unit is a static voltmeter.4. The voltage compensation assembly according to claim 1 , wherein the voltage measuring unit includes an oscillating piezo-crystal measuring the electronic field flux lines.5. The voltage compensation assembly according to claim 1 , wherein the system is a test system for the electronic elements on the substrate.6. An apparatus for testing or processing a substrate with electronic elements formed thereon claim 1 , comprising:a chamber;a substrate support configured to support the substrate within the chamber;a prober positioned to contact the substrate disposed on the ...

HIGH-FREQUENCY TEST PROBE DEVICE COMPRISING CENTERING PORTION

A high-frequency test probe device comprising a contact section () which forms an inner contact () and an outer contact (), which is designed to interact with a contact partner () that is to be contacted for testing purposes, and which is provided on an inner housing () at one end and can be contacted at a pickup end () for signal pickup at the other end. The inner housing is guided at least along some sections in an outer housing () and in an axially movable manner relative to same. 110-. (canceled)11. A high frequency test probe device comprising:a hollow cylindrical outer housing;an inner housing received in the outer housing and movable therein along a longitudinal axis, the inner housing having a contact portion on one end and a pick-up on the other end;a contact partner on the inner housing is selectively contacted by the contact portion;the inner housing has a centering portion configured to interact with the outer housing, the inner housing is movable along the longitudinal axis between a first relative position and a second relative position;a spring has one end which engages a first shoulder of the outer housing and another end which engages a second shoulder on the inner housing, wherein the spring pushes the outer housing and inner housing apart;wherein in the first relative position the contact portion is in engagement with the contact partner and the inner housing is tilted in a plane vertical to the longitudinal axis about a predefined maximum angle, relative to the longitudinal axis defined by the outer housing and corresponding to a direction of engagement, andwherein in the second relative position the contact portion is detached from the contact partner, the inner housing is held non-rotatably about the longitudinal axis in the outer housing against the bias of the spring.12. The device according to claim 11 , wherein the contact portion comprises a polygonal contour.13. The device according to claim 11 , wherein the outer housing is configured ...

Touch sensor using graphene for simultaneously detecting a pressure and a position

A touch sensor capable of specifying a touch position and/or a degree of a touch pressure by using graphene as an electrode and/or a strain gauge, and more particular, a touch sensor capable of simultaneously detecting a pressure and a position by means of change in resistance by using graphene is provided.

VARIABLE SPACING FOUR-POINT PROBE PIN DEVICE AND METHOD

A continuous variable spacing probe pin device, including first and second probe pins. The first and second probe pins are configured to measure a property of a conductive layer. In a first configuration, the first and second probe pins include respective first portions arranged to contact the conductive layer to measure the property. In a second configuration, the first and second probe pins include respective second portions arranged to contact the conductive layer to measure the property. A first area for each respective first portion is different from a second area for each respective second portion. 1. A continuous variable spacing probe pin device , comprising:a first probe pin; and, the first and second probe pins are configured to measure a property of a conductive layer;', 'in a first configuration, the first and second probe pins include respective first portions arranged to contact the conductive layer to measure the property;', 'in a second configuration, the first and second probe pins include respective second portions arranged to contact the conductive layer to measure the property; and,', 'a first area for each respective first portion is different from a second area for each respective second portion., 'a second probe pin, wherein2. The continuous variable spacing probe pin device of claim 1 , further comprising:an actuator, wherein:to transition between the first and second configurations, the actuator is arranged roll respective first and second outer surfaces of the first and second probe pins, respectively, along the conductive layer while maintaining contact of the first and second probe pins with the conductive layer.3. The continuous variable spacing probe pin device of claim 2 , wherein:a first area of contact between the first outer surface and the conductive layer varies as the first outer surface is rolled along the conductive layer;a second area of contact between the second outer surface and the conductive layer varies as the second ...

METHOD FOR MANUFACTURING INSPECTION PROBE

This is to provide a method for manufacturing an inspection probe in which qualities of a bonded portion of the inspection probe constituted by bonding wire rods including different metals are improved. The method for manufacturing an inspection probe is configured by bonding a first wire rod and a second wire rod , at least one of which has an inspection contact portion at a tip thereof, performing laser welding by irradiating laser beam to outer circumferential surfaces of the first wire rod and the second wire rod with different energy quantities, and then, polishing the outer circumferential surfaces. 1. A method for manufacturing an inspection probe which is configured by bonding a first wire rod and a second wire rod , at least one of which has an inspection contact portion at a tip thereof , which comprisesperforming laser welding the first wire rod and the second wire rod in a state of putting together by irradiating laser beam to outer circumferential surfaces at a bonded portion, and an energy quantity applied to a material of a higher melting point side among the first wire rod and the second wire rod by the laser beam is made larger than an energy quantity applied to a material of a lower melting point side.2. The method for manufacturing an inspection probe according to claim 1 , wherein after the laser welding is performed claim 1 , outer circumferential surfaces at a welded portion are polished to an outer diameter of a product.3. A method for manufacturing an inspection probe which is configured by bonding a first wire rod and a second wire rod claim 1 , at least one of which has an inspection contact portion at a tip thereof claim 1 , which compriseslaser welding the first wire rod and the second wire rod in a state of putting together by irradiating laser beam to outer circumferential surfaces at a bonded portion, andafter the laser welding is performed, outer circumferential surfaces at a welded portion are polished to an outer diameter of a ...

Touch-Sensing Electrode Structure and Touch-Sensitive Device

A touch-sensing electrode structure has a plurality of electrode units. Each of the electrode units includes at least one first electrode and at least one second electrode. The second electrode is formed in an area not overlapping the first electrode, and the first electrode has a first part and a second part. The second electrode is adjacent to the first part of the first electrode and spaced apart the first part of the first electrode by a first interval, the second part of the first electrode is adjacent to the second electrode and spaced apart the second electrode by a second interval, and a width of the second interval is not equal to a width of the first interval. 1. A touch-sensing electrode structure having a plurality of electrode units , wherein each of the electrode units comprises:at least one first electrode; andat least one second electrode thrilled in an area not overlapping the first electrode, wherein the first electrode has a first part and a second part, the second electrode is adjacent to the first part of the first electrode and spaced apart the first part of the first electrode by a first interval, the second part of the first electrode is adjacent to the second electrode and spaced apart the second electrode by a second interval, and a width of the second interval is not equal to a width of the first interval.2. The touch-sensing electrode structure as claimed in claim 1 , wherein a width of the first interval and a width of the second interval are respectively determined by the intensity of an electric field around the first interval and the intensity of the electric field around the second interval.3. The touch-sensing electrode structure as claimed in claim 1 , wherein the second electrode substantially surrounds the first part of the first electrode claim 1 , and the second part of the first electrode substantially surrounds the second electrode.4. The touch-sensing electrode structure as claimed in claim 1 , wherein an area of the first ...

TESTING APPARATUS AND METHOD USING SAME

A testing apparatus for testing a number of different characteristics of a circuit board includes at least two probes, at least one measuring meter, and a storage device. After a circuit schematic diagram of the circuit board and a circuit wiring diagram of the circuit board have been compared, the location of each electric contact is determined. The probes necessary for testing particular characteristics are connected in turn to the measuring meter. The circuit board is moved to align the electric contacts with the probes, and bring the probes into electrical contact with the electric contacts for testing. 1. A testing apparatus for testing a circuit board comprising electrical contacts , the testing apparatus comprising:a testing device comprising two probes and at least one measuring meter, wherein a distance between the two probes is adjustable and each measuring meter comprises at least two input terminals;a position adjusting device aligning the electric contacts of the circuit board with the probes;a lifting device bringing the probes into electrical contact with the electric contacts of the circuit board;a storage device storing a circuit schematic diagram and a circuit wiring diagram of the circuit board, wherein the circuit schematic diagram of the circuit board schematically shows connections among each electrical contact of the circuit board, and the circuit wiring diagram shows an actual wiring pattern of the circuit board;a processor; anda testing system executed by the processor, the testing system comprising:a circuit analyzing module that matches the circuit schematic diagram with the circuit wiring diagram to determine a location of the electric contacts on the circuit board and determines a predicted voltage of each electric contact;a meter choosing module that chooses the measuring meter according to a characteristic to be tested and connects the input terminals of the chosen measuring meter with the probes;a probe regulating module that ...

Inspection apparatus and inspection method

An inspection apparatus includes an insulating substrate, a probe pin having a body portion secured to the insulating substrate, a tip portion connected to one end of the body portion and disposed on the back surface side of the insulating substrate, and a connection portion connected to the other end of the body portion and disposed on the front surface side of the insulating substrate, and a heat-radiating terminal in contact with the connection portion, wherein a current is applied through the heat-radiating terminal and the probe pin to an object to measured, and wherein the heat-radiating terminal discharges heat from the probe pin.

Electrical test probe

An electrical test probe according to an embodiment includes a probe main body portion having a connection end to a circuit of a probe base plate and made of a first metal material with resiliency, and a probe tip portion having a probe tip, made of a second metal material with higher hardness than that of the first metal material for the probe main body portion, and communicating with the probe main body portion, wherein the probe main body portion and the probe tip portion are provided with a current path made of an equal metal material extending from the probe tip to the connection end.

SENSOR AND TRANSPORTING DEVICE INCLUDING THE SAME

A sensor detects a workpiece ready for transportation by means of an outwardly hanging contact arm which, when the workpiece is dropped or placed on a carrying frame, is pushed back into a groove in the body of the sensor and in that location gives a contact signal to start the transport, avoiding damage to the hanging arm or to its mechanism otherwise caused by the continuing weight or impact of the dropped or placed workpiece. 1. A sensor , comprising:a mounting body, the mounting body comprising a main portion and a mounting portion formed on one end of the main portion, a mounting groove being defined in an adjoining portion between the mounting portion and the main body, the mounting groove comprising a first groove and a second groove, the second groove substantially perpendicularly communicating with the first groove;an electrode, the electrode comprising a hinge portion and a contacting portion extending from the hinge portion; anda connection member mounted on the main portion; wherein the hinge portion is rotatably connected to the mounting body in the first groove by the connection member, a center of gravity of the hinge portion is positioned on a side thereof away from the contacting portion, and the contacting portion protrudes out from the second groove.2. The sensor of claim 1 , wherein a connection hole is defined in a corner of each side surface of the main portion communicating to the first groove claim 1 , a mounting hole is defined in the mounting portion communicating to the first groove claim 1 , the mounting hole and the connection hole are coaxial and opposite to each other claim 1 , a hinge hole is defined in a corner of the hinge portion adjacent to the contacting portion claim 1 , the connection member passes through the mounting hole and the hinge hole claim 1 , and then is fixed in the connection hole claim 1 , such that the electrode is rotatably connected to the mounting body by the connection member claim 1 , and the center of ...

Eddy current inspection probe

A probe for transporting a nondestructive inspection sensor through a tube, that employs wheels to reduce friction. The radial travel of the wheels are mechanically linked through a cam and axially reciprocal plunger arrangement that centers the probe at tube diameter transitions. Internal wire bending is minimized and a dynamic seal is provided to facilitate an insertion force at the probe and reduce or eliminate compressive load buckling of the flexible cable carried by the probe. Like the wheel arrangement, radial travel of the seal segments are mechanically linked to provide probe centering.

Probe-on-substrate

Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.

Electrical Contactor and Contact Method for the Same

An electrical contactor has a contact portion that is pressed onto a terminal of an electronic device and is electrically connected. When the dimension of the contact portion is S the contact dimension of the contact portion and the terminal of the electronic device is V, the amount of sliding of the contact portion is W, and the additional element including at least positional accuracy of the contact portion is X, the dimension of the contact portion S satisfies S>V+W+X. In a contact method for the electrical contactor, when the sum of a clearance on the front end side in the sliding direction in starting contact and a clearance on the back end side in the sliding direction in ending contact is X the crushed area S of the terminal is set to satisfy a relationship of SV+W+X.'}2. The electrical contactor according to claim 1 , wherein{'b': '1', 'the dimension of the contact portion S is set within a range not to contact with adjacent electrical contactors.'}3. The electrical contactor according to claim 1 , whereina minimum value Vmin. of the contact dimension V of the contact portion and the terminal of the electronic device is 14% of the terminal size.4. The electrical contactor according to claim 1 , whereina maximum value Vmax. of the contact dimension V of the contact portion and the ...

CURRENT APPLYING DEVICE

A current applying device is provided in which a contact body which surface-contacts with an inspection target body makes contact with the surface of the inspection target body uniformly; current can be favorably applied from the contact body to the inspection target body; and the contact body alone can be replaced. A probe device for applying current by being in pressure-contact with the power semiconductor H includes: a contact body which surface-contacts with the power semiconductor H; and a plurality of electrically-conductive two-tier springs which press the contact body onto the power semiconductor H; the contact body and the plurality of electrically-conductive two-tier springs are separate bodies, and the plurality of electrically-conductive two-tier springs electrify the contact body while providing pressing force F to each of a plurality of sections of the contact body 1. A current applying device for applying current by being in pressure-contact with an inspection target body , comprising:a contact body which surface-contacts with the inspection target body; anda pressing body which presses the contact body to the inspection target body; whereinthe contact body and the pressing body are separate bodies, andthe pressing body electrifies the contact body while providing pressing force to each of a plurality of sections of the contact body.2. The current applying device according to claim 1 , wherein the pressing body includes a plurality of electrically-conductive elastic bodies.3. The current applying device according to claim 1 , whereinthe contact body includes a surface layer that contacts with the inspection target body, and a supporting layer that supports the surface layer, andthe supporting layer is more flexible than the surface layer.4. The current applying device according to claim 1 , whereinthe contact body has microscopic projections that are inserted into only a surface layer of the inspection target body, on a surface that contacts with the ...

Semiconductor wafer evaluation method, semiconductor wafer evaluation device, and probe for semiconductor evaluation device

Provided is a semiconductor wafer evaluation method of performing an evaluation of electrical characteristics of a semiconductor wafer by bringing mercury into contact with a surface of the semiconductor wafer, the method including using a probe constituted of a fixed electrode having a tip end portion and a transparent covering portion that covers a portion other than the tip end portion of the fixed electrode, the fixed electrode being made of a metal having stronger wettability with respect to the mercury than the semiconductor wafer and the covering portion, and measuring the electrical characteristics by attaching the mercury to the tip end portion of the fixed electrode and then bringing the mercury into contact with the surface of the semiconductor wafer.

SPRING ASSEMBLY AND TEST SOCKET USING THE SAME

Spring assemblies and a test socket using the spring assemblies. The spring assemblies are used in a test socket electrically connecting lead terminals of a semiconductor chip to test terminals of a test device by contacting the lead terminals and the test terminals, and include: first springs in which a first steel wire having elasticity and conductivity is coiled in a spiral in one direction; and second springs in which a second steel wire having elasticity and conductivity is coiled in a spiral in an opposite direction to the direction in which the first springs are coiled, which have outer diameters narrower than inner diameters of the first springs, and are inserted into the first springs. Accordingly, electric resistances and inductances of two spring assemblies coiled in a spiral are reduced to improve electricity transmission characteristic. A height of a test socket is easily adjusted using spring assemblies having desired lengths. Also, since only plating is performed on the springs to form the spring assemblies, the spring assemblies are formed at a very low cost and have a wide range of applications. 1. Spring assemblies used in a test socket electrically connecting lead terminals of a semiconductor chip to test terminals of a test device , comprising:first springs in which a first steel wire having elasticity and conductivity is coiled in a spiral in one direction; andsecond springs in which a second steel wire having elasticity and conductivity is coiled in a spiral in an opposite direction to the direction in which the first springs are coiled and which have outer diameters narrower than inner diameters of the first spring and are inserted into the first springs.2121221. The spring assemblies of claim 1 , wherein when the number of coiling of the first springs is N claim 1 , and the number of coiling of the second springs is N claim 1 , the numbers N and N are 0.3 ≦N/N ≦3.0.3. The spring assemblies of claim 1 , wherein the first and second springs ...

Signal transmission medium and high frequency signal transmission medium

A signal transmission medium for transmitting EHF band signals from a first point to a second point, including: a first end at which a signal exchange with the first point takes place; a second end at which a signal exchange with the second point takes place; and a transmission line portion which is flexible and connects the first end and the second end. The transmission line portion includes: strip conductors which are formed substantially down a center of a flexible printed circuit board to establish electrical connection between a signal line at the first end and a signal line at the second end; and a pair of grounding sheets which are arranged in parallel to each other at a substantially constant gap from the flexible printed circuit board in 180-degree opposite directions. The cavities are formed between the pair of grounding sheets and the strip conductors.

Coaxial probe

A coaxial probe is revealed. A protective sleeve is mounted in a sleeve port of a main sleeve. A leaning flange projecting inward is formed on a bottom end of a sleeve port of the main sleeve. The leaning flange is stopped and positioned by a stopping flange on an upper part of the protective sleeve. A probe is disposed on a sleeve port of the main sleeve and is passed through a sleeve port of a protective hole. Thus the probe is hidden in the protective sleeve. After the protective sleeve being in contact with a coaxial connector to be detected, the probe is moved to project from the protective sleeve for detecting the coaxial connector. Thereby damages of the probe caused by impact force received can be avoided.

Handheld Devices, Systems, and Methods for Measuring Parameters

Embodiments of the present disclosure are generally directed to handheld systems, individual components, and methods of using such systems and components for measuring parameters, such as electrical, mechanical, and physical measurement parameters. In one embodiment of the present disclosure, a host handheld device generally includes a measuring system for measuring a first parameter, wherein the first parameter is an electrical parameter, and a receiving system for receiving at least a second parameter from a separate module device. 1. A host handheld measurement device , comprising:a measuring system configured to measure a first parameter and determine a first measurement value; anda receiving system configured to receive at least a second measurement value from a separate measurement device, wherein the second measurement value is determined by a measuring system in the separate measurement device measuring a second parameter.2. The host device of claim 1 , further comprising a display on the host device for displaying at least the first and second measurement values.3. The host device of claim 1 , wherein the host device is a digital multimeter.4. The host device of claim 1 , wherein the first parameter is selected from the group consisting of voltage claim 1 , current claim 1 , vibration claim 1 , resistance claim 1 , capacitance claim 1 , inductance claim 1 , and frequency.5. The host device of claim 1 , wherein the second parameter is selected from the group consisting of voltage claim 1 , current claim 1 , vibration claim 1 , resistance claim 1 , capacitance claim 1 , inductance claim 1 , frequency claim 1 , temperature claim 1 , relative humidity claim 1 , decibels claim 1 , magnetic field claim 1 , flow velocity claim 1 , moisture claim 1 , rotational speed claim 1 , pressure claim 1 , distance claim 1 , light claim 1 , and contact infrared.6. The host device of claim 1 , wherein the host device is configured to establish a communication link with the ...

Method for fabricating a through wire interconnect (twi) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer

A method for fabricating a through wire interconnect for a semiconductor substrate having a substrate contact includes the steps of: forming a via through the semiconductor substrate from a first side to a second side thereof; placing a wire in the via having a first end with a bonded connection to the substrate contact and a second end proximate to the second side; forming a first contact on the wire proximate to the first side; forming a second contact on the second end of the wire; and forming a polymer layer on the first side at least partially encapsulating the wire while leaving the first contact exposed.

VERTICAL PROBES FOR MULTI-PITCH FULL GRID CONTACT ARRAY

A testing method (and the probes used) comprising providing one or more probes each comprising: a body portion which is substantially straight; an extended portion extending from the body portion and comprising at least two separate probe portions; and a tip portion at the opposite end of the extended portion; and contacting an object to be tested with the one or more probes. 1. A probe comprising:a body portion which is substantially straight;an extended portion extending from said body portion and comprising at least two separate probe portions; anda tip portion at an opposite end of said extended portion.2. The probe of additionally comprising a conductive tie between said at least two probe portions at approximately a midpoint of said extended portion.3. The probe of additionally comprising a conductive tie at said tip portion.4. The probe of additionally comprising a skate on said conductive tie at said tip portion.5. The probe of additionally comprising a conductive tie at said tip portion.6. The probe of additionally comprising a skate on said conductive tie at said tip portion.7. The probe of additionally comprising one or more skates on said tip portion.8. The probe of wherein one or both of said extended portion and said tip portion is laser cut.9. The probe of wherein said tip portion is created prior to the laser cut of said extended portion.10. The probe of wherein said extended portion is curved.11. A testing method comprising: a body portion which is substantially straight;', 'an extended portion extending from the body portion and comprising at least two separate probe portions; and', 'a tip portion at the opposite end of the extended portion; and, 'providing one or more probes each comprisingcontacting an object to be tested with the one or more probes.12. The method of additionally comprising providing a conductive tie between the at least two probe portions at approximately a midpoint of the extended portion.13. The method of additionally ...

CONTACT PROBE AND PROBE CARD

A contact probe electrically connects the tester side and an electrode pad of a circuit to be tested. This contact probe has a mounting portion on a base end portion mounted on a probe card, a contact portion on a distal end portion brought into contact with the electrode pad, and an arm portion between them elastically supporting the contact portion. The contact portion is provided on a lower end portion of a base portion integrally mounted on a distal end portion of the arm portion. The arm portion has a one-side arm piece supporting the base portion and allowing vertical movement of the base portion and the other-side arm piece supporting the base portion and adjusting an inclination angle of the base portion to reduce a scrub amount of the contact portion. The probe card uses the above-described contact probe. 1. A contact probe supported by a probe card substrate on a tester side and extended to an electrode pad of a circuit to be tested and electrically connecting the tester side and the electrode pad of the circuit to be tested , comprising:a mounting portion located on a base end portion and mounted on the probe card substrate on the tester side, a contact portion located on a distal end portion and brought into contact with the electrode pad of the circuit to be tested, and an arm portion located between them and elastically supporting the contact portion, whereinthe contact portion is provided on a lower end portion of a base portion integrally mounted on a distal end portion of the arm portion; andthe arm portion is provided with a one-side arm piece supporting the base portion and allowing vertical movement of the base portion and the other-side arm piece supporting the base portion and adjusting an inclination angle of the base portion so as to reduce a scrub amount of the contact portion.2. The contact probe according to claim 1 , whereinthe other-side arm piece is composed of a distal-end side curved arm piece extending from the distal end portion ...

ADJUSTABLE MEASUREMENT DEVICE

An adjustable measurement device includes a case, a positive contact portion, a negative contact portion, a test probe, a first wire, and a second wire. The positive contact portion is positioned on an end of the case and electrically connected to the first wire. The negative contact portion is movably received in the case and electrically connected to the second wire. A receiving hole is defined in the negative contact portion for the test probe. The test probe includes a main body electrically connected to the negative contact portion, a tip portion electrically connected to the positive contact portion, and an insulating portion positioned between the main body and the tip portion. A distance between the positive contact portion and the negative contact portion is adjustable by moving the negative contact portion. The negative contact portion and the positive contact portion are isolated from each other. 1. An adjustable measurement device comprising:a case comprising an end;a positive contact portion positioned at the end of the case;a negative contact portion movably received in the case, and defining a receiving hole; a main body electrically connected to the negative contact portion;', 'a tip portion electrically connected to the positive contact portion; and', 'an insulation portion positioned between the main body and the tip portion, to insulate the main body from the tip portion;, 'a test probe extending through the receiving hole of the negative contact portion, and comprisinga first wire electrically connected to the positive contact portion; anda second wire electrically connected to the negative contact portion;wherein a distance between the positive contact portion and the negative contact portion is adjustable by moving the negative contact portion in the case, and the positive contact portion is isolated from the positive contact portion.2. The adjustable measurement device of claim 1 , wherein the case is pipe-like and has a C-shaped cross-section ...

METHOD FOR MANUFACTURING A CONTACT FOR TESTING A SEMICONDUCTOR DEVICE

The present invention relates to a contact for a test socket in which conductor portions are formed so as to be arranged at certain intervals on a dielectric plate used for testing whether a semiconductor device is normal by contacting a read terminal of the semiconductor device, and more particularly, to a method for manufacturing a contact for testing a semiconductor device, wherein a dielectric plate and a conductor portion are continuously alternately bonded and stacked repeatedly, one side of the stack is cut, then the stack and a dielectric layer are again subjected to repeated alternating bonding and stacking, after which the front surface of the stack is cut to yield a finished product of a new type of contact. Thus, the pitch between adjacent conductor portions can be determined according to the thickness at which layers are formed and the cut width in the manufacturing process, so that a desired pitch of the conductor portion can be achieved. 1. A method of manufacturing a contact for testing a semiconductor device , the method comprising:{'b': 1', '2', '1, 'a first stacking stage (S) of continuously alternately bonding and stacking a dielectric layer () and a conductor layer () on one another to a certain height, forming a first stacked body;'}{'b': 2', '1', '21', '11, 'a first cutting stage (S) of vertically cutting a lateral side of the first stacked body by a constant thickness across a whole height of the first stacked body, forming a first cut body (M) which consists of a plurality of sets of a dielectric layer () and a conductor layer (), which extends in longitudinal directions, respectively, wherein the sets being continuously arranged on one another;'}{'b': 3', '1', '2, 'a second stacking stage (S) of continuously alternately bonding and stacking the first cut body (M), which is disposed flat, and another dielectric layer () in parallel on one another to a certain height, forming a second stacked body; and'}{'b': 4', '2', '21', '21', '21', '20', ...

MEASURING DEVICE, MEASURING METHOD, AND ELEMENT MANUFACTURING METHOD INCLUDING MEASURING METHOD

A measuring device includes: a probe applying a voltage to an electrode of an element; and a supplying member supplying an insulating liquid to a contact portion between the electrode and the probe via a surface of the probe. Accordingly, the insulating liquid can be securely supplied to the contact portion between the electrode and the probe via the surface of the probe positioned relative to the electrode. 1. A measuring device comprising:a probe applying a voltage to an electrode of an element; anda supplying member supplying an insulating liquid to a contact portion between said electrode and said probe via a surface of said probe.2. The measuring device according to claim 1 , wherein said supplying member is attached to said probe claim 1 , and includes an ejection nozzle ejecting said insulating liquid to said contact portion via the surface of said probe.3. The measuring device according to claim 1 , whereinsaid supplying member includes a liquid bath containing said insulating liquid, andsaid insulating liquid is supplied to said contact portion via the surface of said probe by immersing said probe in said liquid bath.4. The measuring device according to claim 1 , wherein said probe includes a retaining portion temporarily retaining said insulating liquid.5. The measuring device according to claim 4 , wherein said retaining portion is a groove formed in the surface of said probe.6. The measuring device according to claim 4 , wherein said retaining portion is a hole formed in the surface of said probe.7. The measuring device according to claim 4 , wherein said retaining portion is irregularities formed in the surface of said probe.8. The measuring device according to claim 4 , wherein said retaining portion is a cut groove formed in a tip of said probe.9. A measuring method comprising the steps of:preparing a wafer provided with an element including an electrode;bringing said electrode of said element and a probe into contact with each other; andmeasuring an ...

ELECTRICAL CONTACT MEMBER

Provided is an electrical contact member which is capable of maintaining stable conductivity over a long period of time, while achieving low adhesion to a test subject, in particular, an electrical contact member which is capable of maintaining stable electrical contact over a long period of time by suppressing increase in the contact resistance, while achieving low adhesion to a test subject even after repeated contact at high temperatures around 85° C. or after being left in the atmosphere for a long period of time. The present invention relates to an electrical contact member, which repeatedly comes into contact with a test subject, and wherein the surface of the electrical contact member, said surface coming into contact with the test subject, is configured of a carbon coating film that contains Pd. 1. An electrical contact member coming into contact with a test subject repeatedly ,wherein a surface of the member coming into contact with the test subject is configured to be a carbon coating film containing Pd.2. The electrical contact member according to claim 1 , wherein the content by percentage of Pd contained in the carbon coating film is from 10 to 50% by atom.3. The electrical contact member according to claim 2 , wherein the content by percentage of Pd contained in the carbon coating film is from 10 to 23% by atom.4. The electrical contact member according to claim 1 , wherein the carbon coating film has a thickness of 5 nm to 10 μm.5. The electrical contact member according to claim 2 , wherein the carbon coating film has a thickness of 5 nm to 10 μm.6. The electrical contact member according to claim 3 , wherein the carbon coating film has a thickness of 5 nm to 10 μm.7. The electrical contact member according to claim 1 , wherein when the carbon coating film has a thickness of 5 nm to 10 μm claim 1 , the content by percentage of Pd contained in the carbon coating film is from 10 to 23% by atom claim 1 , andwhen the carbon coating film has a thickness ...

Sort Probe Gripper

A sort probe gripper includes a body, a jaw mount inserted into the body, a plurality of grippers mounted in the jaw mount and an actuator sleeve slidable along the body to engage the plurality of grippers. 1. A sort probe gripper comprising:a body;a jaw mount inserted into the body;a plurality of grippers mounted in the jaw mount; andan actuator sleeve slidable along the body to engage the plurality of grippers.2. The sort probe gripper of wherein the plurality of grippers are closed upon being engaged by the actuator sleeve.3. The sort probe gripper of wherein the plurality of grippers are opened upon being disengaged by the actuator sleeve sliding up the body.4. The sort probe gripper of further comprising an insert pin to attach the jaw mount to the body.5. The sort probe gripper of further comprising one or more pinion shafts to attach each gripper to the jaw mount.6. The sort probe gripper of wherein two pinion shafts attach each gripper to the jaw mount.7. The sort probe gripper of further comprising a retainer pin to attach the sort probe gripper to a testing apparatus.8. The sort probe gripper of wherein the sort probe gripper receives a current to heat a sort probe.9. An apparatus comprising:a probe card substrate including one or more sort probes; and a body;', 'a jaw mount inserted into the body;', 'a plurality of grippers mounted in the jaw mount to grasp a sort probe; and', 'an actuator sleeve slidable along the body to engage the plurality of grippers., 'a sort probe gripper including10. The apparatus of wherein the plurality of grippers are closed upon being engaged by the actuator sleeve.11. The apparatus of wherein the plurality of grippeers are opened upon being disengaged by the actuator sleeve sliding up the body.12. The apparatus of wherein the sort probe gripper further comprises an insert pin to attach the jaw mount to the body.13. The apparatus of wherein the sort probe gripper further comprises one or more pinion shafts to attach each ...

ELECTRICAL SENSOR SYSTEMS AND METHODS

Various techniques are disclosed for providing electrical current and/or voltage sensor probes or tags integrated with measurement circuitry. For example, an electrical sensor is provided that includes a probe adapted to be arranged to at least partially encircle a conductor to be measured, wherein the probe has a proximal end and a distal end, the proximal end terminating in a base portion that houses measurement circuitry. The base portion may also include electrical components suitable for displaying, wirelessly transmitting, and/or otherwise conveying the measured electrical parameters. In some embodiments, the distal end of the probe may be removably received by the base portion, such that the probe forms a loop encircling the conductor when measuring it. In other embodiments, the probe may resiliently clip on to the conductor. In another example, an electrical sensor includes an attachable tag that can be mounted to the conductor to be measured. 1. An electrical sensor for determining an electrical property associated with a target object , the electrical sensor comprising:a flexible probe configured to be looped around to at least partially encircle the target object;wherein the flexible probe has a proximal end and a distal end, the proximal end terminating in a base portion; andwherein the base portion comprises measurement circuitry configured to determine a current and/or voltage associated with the target object and sensed via the flexible probe.2. The electrical sensor of claim 1 , wherein:the flexible probe is elongated and tubular; andthe base portion comprises a socket for removably receiving the distal end of the flexible probe such that the flexible probe forms a closed loop to completely encircle the target object when the distal end of the flexible probe is received in the socket.3. The electrical sensor of claim 1 , wherein the flexible probe is configured to resiliently clip onto the target object.4. The electrical sensor of claim 1 , wherein ...

IMPEDANCE DETERMINATION

Apparatus for use in performing impedance measurements on a subject. The apparatus includes a processing system for causing a first signal to be applied to the subject, determining an indication of a second signal measured across the subject, using the indication of the second signal to determine any imbalance and if an imbalance exists, determining a modified first signal in accordance with the imbalance and causing the modified first signal to be applied to the subject to thereby allow at least one impedance measurement to be performed. 1) An apparatus for use in performing impedance measurements on a subject , wherein the apparatus includes a number of electrode systems , and wherein each electrode system includes: 'a second substrate having at least two conductive pads mounted thereon, the conductive pads forming first and second electrodes for coupling the signal generator and the sensor to a subject in use.', 'a first substrate having a signal generator and sensor mounted thereon, the signal generator being for applying a first signal to the subject and the sensor for sensing a second signal across the subject; and'}2) The apparatus of claim 1 , wherein the electrode system includes a capacitive cancelling circuit for cancelling capacitive coupling between the drive and sense electrodes.3) The apparatus of claim 2 , wherein the capacitive cancelling circuit includes an inverting amplifier for coupling a signal generator output to a sensor input.4) The apparatus of claim 3 , wherein the inverting amplifier applies a capacitance cancelling signal to the sensor input to thereby cancel any effective capacitance between the drive electrode and the sense electrode.5) The apparatus of claim 3 , wherein an inverting amplifier output is coupled to the sensor input via at least one of:a resistor;a capacitor; andan inductor.6) The apparatus of claim 5 , wherein at least one of a resistor and capacitor are adjustable claim 5 , thereby allowing a capacitance cancelling ...

Probe tip formation for die sort and test

Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.

BALUNLESS TEST FIXTURE

A test fixture and method of its use are disclosed. The test fixture includes a test fixture frame including a first test fixture mount having a first test head mounted thereon, the first test head slidable along a first axis, and a second test fixture mount having a second test head mounted thereon that is slidable along a second axis perpendicular to the first axis. The test fixture further includes a first test plate holder mounted to the first test head and including a clamping mechanism, as well as a probe mounting plate mounted to the first test plate holder and retained by the clamping mechanism and including a plurality of radially-disposed probe receptacles. The test fixture includes a plurality of probe assemblies received in corresponding probe receptacles, each including a probe extending at least partially through the probe mounting plate, each electrically connecting to a design under test. 1. A test fixture for electrical equipment , the test fixture comprising: a first test fixture mount having a first test head mounted thereon, the first test head slidable along a first axis; and', 'a second test fixture mount having a second test head mounted thereon, the second test head slidable along a second axis perpendicular to the first axis;, 'a test fixture frame includinga first test plate holder mounted to the first test head, the first test plate holder including a clamping mechanism;a probe mounting plate mounted to the first test plate holder and retained by the clamping mechanism, the probe mounting plate including a plurality of radially-disposed probe receptacles;a plurality of probe assemblies received in corresponding probe receptacles, each of the probe assemblies including a probe extending at least partially through the probe mounting plate, each probe electrically connecting to a design under test.2. The test fixture of claim 1 , further comprising:a second test plate holder mounted to the second test head, the second test plate holder ...

DESIGNED ASPERITY CONTACTORS, INCLUDING NANOSPIKES, FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package. 125-. (canceled)26. An apparatus for testing semiconductor dies , comprising:a translator having a wafer side positioned to face toward a device under test, and an inquiry side facing away from the wafer side;a plurality of wafer-side sites carried by the translator at the wafer side of the translator; anda plurality of nanospikes carried by at least one wafer-side site.27. The apparatus of claim 26 , wherein the nanospikes are made of a material selected from a group consisting of tantalum nitride claim 26 , tungsten carbide claim 26 , hafnium carbide claim 26 , titanium carbide claim 26 , titanium diboride claim 26 , molybdenum carbide claim 26 , rhenium diboride claim 26 , and a combination thereof.28. The apparatus of claim 26 , wherein a cross-section of the nanospikes is selected from a group consisting of generally concave claim 26 , triangular claim 26 , convex claim 26 , and a combination thereof.29. The apparatus of claim 26 , wherein a shape of the nanospikes is selected from a group consisting of a star claim 26 , a blade claim 26 , a cross claim 26 , a spike claim 26 , and a combination thereof.30. The apparatus of claim 26 , wherein the nanospikes comprise a cover material.31. The apparatus of claim 26 , wherein the nanospikes are approximately 0 ...

CONDUCTIVE TEST PROBE

A conductive probe may include a probe body for communicating with a circuit tester or a jumper. The probe body may be formed of metal and may have a free end. A probe tip may be mounted to the end of the probe body. The probe tip may be formed of thorium-tungsten. The probe tip may be configured for contacting a circuit node. 120.-. (canceled)21. A conductive probe , comprising:a probe body comprised of a conductor;a probe tip coupled with the probe body; anda probe plug configured to couple the probe body with a circuit tester or a jumper.22. The conductive probe of claim 21 , wherein the probe body is configured to conduct an electrical current between the probe plug and the probe tip mounted to an end of probe body.23. The conductive probe of claim 21 , wherein the probe body includes portions that are enclosed in an insulating layer so as to prevent unintended electrical shorting to a test environment.24. The conductive probe of claim 21 , wherein the probe tip is configured to provide a low contact resistance with a circuit node and minimize the electrical resistance of the conductive probe.25. The conductive probe of claim 21 , wherein the circuit tester is comprised of a multi-meter electrical circuit tester or other electrical test equipment that may be used to diagnose or repair an electrical circuit.26. The conductive probe of claim 21 , wherein the probe plug is configured to electrically mate with a circuit tester jack of the circuit tester.27. The conductive probe of claim 26 , wherein the probe plug is configured to slidably couple with the circuit tester jack.28. The conductive probe of claim 26 , wherein the probe plug is configured to threadably couple with the circuit tester jack.29. The conductive probe of claim 21 , wherein the probe tip is comprised of a buried end configured to be coupled with a socket disposed in the probe body and a narrowed end configured for contacting a circuit node to be measured.30. The conductive probe of claim 29 , ...

TESTING HEAD COMPRISING VERTICAL PROBES

A testing head for testing a device includes a couple of plate-like supports separated from each other by a suitable gap and provided with respective guide holes to slidably house a plurality of contact probes, each including a rod-like body extending along a preset longitudinal axis between a first and second ends, the first end being a contact tip that abuts a contact pad of the device and the second end being a contact head that abuts a contact pad of a space transformer. At least one of the supports comprises a couple of guides that are parallel to each other and separated by an additional gap and provided with corresponding guide holes. Each contact probe comprises a protruding element or stopper originating from a lateral wall and realized in correspondence of one wall of a guide hole of the guides contacting the lateral wall of the contact probe. 1. A testing head for functionality testing an electronic device under test comprising:a plurality of vertical contact probes, andat least one couple of plate-like supports separated from each other by a suitable gap and provided with respective guide holes in order to slidably house the plurality of vertical contact probes, a rod-like body,', 'a first end and a second end,', 'the rod-like body extending along a preset longitudinal axis between the first and second ends,', 'the first end being a contact tip adapted to abut onto a contact pad of the electronic device under test, and', 'the second end being a contact head adapted to abut onto a contact pad of a space transformer,, 'each contact probe comprisingwherein at least one support of the supports comprises at least one couple of guides that are parallel to each other and separated by an additional gap and provided with corresponding guide holes and 'the at least one stopper being realized in correspondence of one wall of a guide hole of the guides contacting the lateral wall of the contact probe.', 'wherein each contact probe comprises a lateral wall and at ...

PROBE HEAD AND CONDUCTIVE PROBE THEREOF

A probe head and a conductive probe thereof are provided. The conductive probe includes a first long lateral surface and an opposite second long lateral surface. The first long lateral surface and the second long lateral surface define a central axis there-between. The conductive probe includes a middle segment, an upper connecting segment and a lower connecting segment respectively extending from the middle segment in two opposite directions, and an upper contacting segment and a lower contacting segment respectively extending from the upper and the lower connecting segments in two opposite directions. The upper connecting segment includes an extension extending from the first long lateral surface in a direction away from the central axis. The upper contacting segment includes a protrusion extending from the first long lateral surface in a direction away from the central axis, and the extension and the protrusion are spaced apart from each other. 1. A probe head for an integrated circuit (IC) test , comprising:an upper die unit and a lower die unit that is spaced apart from the upper die unit; and a middle segment arranged between the upper die unit and the lower die unit;', 'an upper connecting segment and a lower connecting segment which respectively extend from two opposite ends of the middle segment in two opposite directions parallel to the central axis, wherein the upper connecting segment is arranged in the upper die unit, and the lower connecting segment is arranged in the lower die unit, and wherein the upper connecting segment includes an extension extending from the first long lateral surface in a direction away from the central axis;', 'an upper contacting segment extending from the upper connecting segment in a direction away from the middle segment along the central axis to protrude from the upper die unit, wherein the upper contacting segment includes a protrusion extending from the first long lateral surface in a direction away from the central axis ...

PLATE SPRING-TYPE CONNECTING PIN

A plate spring-type connection pin is proposed. The connection pin includes: a support pin that has a bending lip portion at an upper portion thereof and a base portion at a lower portion thereof, and is vertically elongated; a plate spring that has an upper probe portion vertically extending adjacent to the lip portion, a lower probe portion disposed at the same height as the base portion, a laterally lying V-shaped portion disposed between the upper probe portion and the lower probe portion, an upper bending portion connecting an upper end of the V-shaped portion and a lower end of the upper probe portion, and a lower bending portion connecting a lower end of the V-shaped portion and an upper end of the lower probe portion; and a bridge that is disposed between the base portion of the support pin and the lower probe portion of the plate spring.

PROBE HEAD AND CONDUCTIVE PROBE THEREOF

A probe head and a conductive probe thereof are provided. The conductive probe has a first long lateral edge and a second long lateral edge which define a central axis there-between. The conductive probe includes a middle segment, an upper connecting segment and a lower connecting segment respectively extending from the middle segment in two opposite directions, and an upper contacting segment and a lower contacting segment respectively extending from the upper and the lower connecting segments in two opposite directions. The lower contacting segment includes a testing tip having an offset with respect to the central axis and a curved surface connecting the testing tip and the second long lateral edge. A first distance between the testing tip and the first long lateral edge is less than a second distance between the testing tip and the second long lateral edge.

ELECTRONIC PRODUCT TEST JIG

An electronic product test jig includes a key testing unit and a circuit testing unit. The key testing unit includes: an X-axis mechanical arm, a Y-axis mechanical arm, a depression mechanical arm that are connected in succession; wherein the X-axis mechanical arm; and a key depression test head disposed at one end of the depression mechanical arm. The X-axis mechanical arm, the Y-axis mechanical arm, and the depression mechanical arm are configured to drive the key depression test head to move and fall over key positions of a product under test so as to complete the test of keys through the key depression test head. A pressure sensor is disposed on the key depression test head. 1. An electronic product test jig , comprising:a rack;a key testing unit; anda circuit testing unit;wherein the key testing unit comprises an X-axis mechanical arm, a Y-axis mechanical arm, and a depression mechanical arm that are connected in succession, and a key depression test head disposed at one end of the depression mechanical arm; the X-axis mechanical arm, the Y-axis mechanical arm, and the depression mechanical arm are configured to drive the key depression test head to move and fall over key positions of a product under test so as to complete the test of keys through the key depression test head; and a pressure sensor is disposed on the key depression test head.2. The electronic product test jig according to claim 1 , wherein the depression mechanical arm comprises a Y-axis connecting plate connected to the Y-axis mechanical arm claim 1 , a motor disposed on the Y-axis connecting plate claim 1 , and an actuating unit connected between the motor and the key depression test head and configured to convert a driving force of the motor and thus drive the key depression test head to perform a reciprocating up and down depression test motion.3. The electronic product test jig according to claim 2 , wherein the actuating unit comprises a ballscrew nut claim 2 , a nut fixing plate claim 2 ...

CHEVRON INTERCONNECT FOR VERY FINE PITCH PROBING

An apparatus an apparatus comprising: a substrate having a plane; and an array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip, wherein the one or more conductive probes comprise at least three points that are non-collinear. 1. An apparatus comprising:a substrate having a plane; andan array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip,wherein the one or more conductive probes comprise at least three points that are non-collinear.2. The apparatus of claim 1 , wherein the at least one conductive probe comprises a first segment that extends from the substrate at a first angle with respect to the plane of the substrate claim 1 , the first segment having a first end affixed to the substrate and a second end distal to the first end claim 1 , and a second segment that extends from the second end of the first segment at a second angle that is rotated azimuthally 180 degrees from the first angle.3. The apparatus of claim 2 , wherein the at least one conductive probe has a chevron shape.4. The apparatus of claim 2 , wherein the at least one conductive probe comprises a third segment having a first end affixed to the second end of the third segment and extending therefrom at a third angle that is rotated azimuthally from the second angle claim 2 , terminating at a second end.5. The apparatus of claim 3 , wherein the at least one conductive probe comprises a fourth segment having a first end affixed to the second end of the third segment and extending therefrom to a second end at a fourth angle that is rotated azimuthally from the third angle claim 3 , terminating at a second end.6. The apparatus of claim 4 , wherein all of the segments are coplanar.7. The apparatus of wherein two or more ...

Contact probe and inspection jig

A contact probe includes a first plunger, a second plunger, and a coil spring. The coil spring is disposed outside the first plunger, and urges the first plunger and the second plunger in a direction away from each other. The first plunger and the second plunger are fitted to each other so as to be slidable with respect to each other. The first plunger includes a large diameter pail, and a small diameter part provided on a proximal end side of the large diameter part. The small diameter part is fitted into the second plunger. The coil spring includes a close winding part on a side of the second plunger. Adjacent lines of the close winding parts are brought into close contact with each other and come into electrical contact with each other at least in a compressed state of the coil spring.

Electrically Conductive Pins Microcircuit Tester

The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted. 112.-. (canceled)13. A test contactor to be interposed between a contact load board and a device under test (DUT) , the DUT including a plurality a plurality of contact pads , each contact pad being laterally arranged , a plurality of upper and lower pin pairs , the pin pairs having distal ends and proximal ends , the proximal end of the upper pin being configured to engage the DUT and the proximal end of the lower pin being configured to engage a load board , the pairs having an outer surface and an overlapping inner mating surface capable of sliding longitudinally along the mating surface ,the inner mating surfaces being inclined and planar and the outer surfaces being partially arcuate and wherein the pins are tapered toward their distal ends;an engagement feature including a narrowed neck on each of said pins proximate the proximal ends providing an engagement recess;an interposer comprising:a longitudinally compressible resilient non-electrically conductive membrane matrix having a plurality of spaced part apertures defining cross sectional areas and forming passages, each passage extending through said interposer, each passage sized to engage said pin pairs with horizontal elastomeric compression ...

TESTING APPARATUS AND METHOD FOR MICROCIRCUIT TESTING WITH CONICAL BIAS PAD AND CONDUCTIVE TEST PIN RINGS

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections. 1. A test system for testing integrated circuits (IC) comprising:a. an upper probe guide plate having an array of spaced apart upper apertures for receiving a test probe;b. an anti-intrusion layer proximate said upper probe guide plate, said layer having a like array of spaced apart lower apertures, collinearly aligned with the apertures of said upper guide, or receiving a test probe;c. an elastomeric block have a like a like array of spaced apart apertures, collinearly aligned with the passages of said upper guide, for receiving a test probe;d. a plurality of elongated test probes having a probe tip at its distal end and a connecting end at its proximal end, and a cross member extending generally orthogonally from each of said probes, said cross member being of such extent that it cannot pass through said upper apertures or said passages in said elastomeric material;e. said test probes passing through said upper and lower apertures and said passages, with said cross member located between said upper probe guide plate and said anti-intrusion later, so that the bias force of the elastomer drives said probes upwardly thorough said upper plate to a stop where said cross member engages said upper plate;f. said proximal ends of said test probes being group into a plurality of subgroups, each of the ends in said subgroup having the same height as measured from the lower probe ...

Test carrier and carrier assembling apparatus

A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT; and a lid member that covers the DUT and is attached to the carrier body. The lid member includes a through-hole for sucking the DUT that is provided to face the DUT and penetrating through the lid member.

Test carrier and carrier assembling apparatus

A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT; and a lid member that covers the DUT and is attached to the carrier body. The lid member includes: a plate-like main body; and a pusher protruding from the main body in a convex shape.