Optoelectronic device packaging assemblies

A diamond optical component for an optical tool

Optical module

本发明提供了一种光学模块。该光学模块具有外壳、第一固定部分、第二固定部分以及两个连接部分。所述外壳具有穿过其侧壁的光纤。所述第一固定部分将所述光纤直接地或通过中间件间接地固定到所述外壳的侧壁上。所述第二固定部分将所述光纤固定在所述外壳的内部。所述两个连接部分分别布置在所述外壳的两个相对角部处，或者布置在所述外壳的在所述角部附近的两个侧边处。所述第一固定部分和所述第二固定部分之间的距离小于6mm。

Optical module, optical communication equipment, and optical transmission device

An optical module includes a circuit board, an optical element on the circuit board, a semiconductor circuit element thereon and electrically coupled with the optical element, an optical connection member formed on a back surface of the circuit board and including an optical fiber receiving groove, and a pressing plate disposed on a side opposite to the circuit board of the optical connection member so as to fix the optical fiber. The semiconductor circuit element is mounted nearer a tip side of the circuit board in relation to the optical element such that the circuit board, the optical connection member and a tip part of the optical fiber are sandwiched between the semiconductor circuit element and the pressing plate. The circuit board includes a plurality of electrodes to be electrically coupled with an equipment side circuit board formed on a tip part of a back surface of the circuit board.

Optical component

Optical semiconductor module, useful for multimedia optical networks, comprises a resin gel covering an optical semiconductor element and filling the light transmission space between the element and an optical element

Un élément à ID=2.1 HE=3 WI=32 LX=840 LY=1062>>semiconducteursemi conducteur> optique (3) et un élément optique (2) comportant une facette de couplage optique sont disposés sur une surface de support d'une plate-forme (1). L'élément optique est couplé optiquement à l'élément à semiconducteur optique au niveau de la facette de couplage optique. Un élément de protection (6) recouvre l'élément à semiconducteur optique et est disposé au moins dans une zone de transmission de lumière dans un espace entre l'élément à semiconducteur et la facette de couplage optique de l'élément optique. L'élément de protection (6) est réalisé en une résine de modification acrylique constituant un gel. Un module à semiconducteur optique présentant une résistance suffisante à l'humidité et convenant pour un coût faible est constitué.

MANUFACTORING PROCESS Of a LASER FILM OF REFLEXION AND DEVICES AND OPTICS USING FILM OF REFLEXION

Le procédé de fabrication d'un film de réflexion (55), ayant une réflectivité équivalente dans des milieux présentant des indices de réfraction différents, comprend les étapes de préparation d'un milieu optique (51) comportant une surface de réflexion et présentant un indice de réfraction n0 , et de détermination d'une longueur d'onde de la lumière destinée à être réfléchie. Le procédé comprend, en outre, une étape d'empilement de plusieurs paires de couches (52, 53) constituées par une première couche (52) présentant un indice de réfraction n1 et par une seconde couche (53) présentant un indice de réfraction n2 sur la surface de réflexion du milieu optique (51). Une troisième couche (54) présentant l'indice de réfraction n1 est ensuite formée sur la surface de la seconde couche (53) de la dernière paire de couches (52, 53). The method of manufacturing a reflection film (55), having equivalent reflectivity in media having different refractive indices, comprises the steps of preparing an optical medium (51) having a reflection surface and having an index. refraction n0, and determining a wavelength of the light intended to be reflected. The method further comprises a step of stacking several pairs of layers (52, 53) constituted by a first layer (52) having a refractive index n1 and by a second layer (53) having a refractive index n2 on the reflection surface of the optical medium (51). A third layer (54) having the refractive index n1 is then formed on the surface of the second layer (53) of the last pair of layers (52, 53).

INTERPOSER STRUCTURE HAVING OPTICAL FIBER CONNECTION AND RELATED FIBER OPTIC CONNECTOR FOR THE SAME

Disclosed are interposer structures having an optical fiber connection and a related fiber optic ferrule that can form a portion of an optical assembly. The interposer structure is useful for transmitting optical signals to/from an integrated circuit that may be attached to the interposer. Specifically, the interposer structure and the related ferrule of the optical connector provide a passively aligned structure having a matched thermal response to maintain a suitable optical connection between the devices over a range of temperatures.

Method and structure for packaging fiber optics device

A method and structure for packaging fiber optics devices hermetically are provided. The packaging structure comprises a fiber optics sub-assembly that has one or more fibers extending out, a housing cap, and a sleeve. Sealants are permeated into narrow gaps between the fiber optics sub-assembly and other components through a capillary effect to achieve their tight bonding and air-tightness. The packaging method is different from and superior to conventional methods using a soldering process.

Optical carrier plate having electrical contacts and holes for guide pins defined by photolithography

A method of making an optical device (4) (e.g. a VCSEL or PIN diode) on a carrier plate (1) involves defining on one side of the carrier plate electrical contacts (2,2a) and through-holes (11) for guide pins (5) by a photolithographic process. Components are then mounted on the contacts (2,2a) and the guide pins (5) are passed through the holes (11). The holes (11) may be formed by etching after being lithographically defined. The plate (1) may be made of sapphire, and may have light transmissive openings (3) also defined by the photolithographic process. The electrical contacts (2,2a) may include solder pads (2) and energising contacts (2a) for components to be flip-chip bonded to the contacts. Supporting pedestals (6) may provide further support for guide pins (5). The photolithographic process allows components such as optical fibre and connector (9,10) to be accurately aligned with the optical device (4) as the position of the guide pins (5) and components may be defined by a single ...

Optoelectronic device packaging assemblies

An optoelectronic device packaging assembly 10 includes an electrical submount 12 that includes a mounting area 18, a device turning mount 14, and a light emitting device 16. The device turning mount has a sub-mount mounting side 20 that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area 22 that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light emitting device 16 includes one or more semiconductor layers that terminate at a common light-emitting surface 24 and are operable to emit light from the light emitting surface. The light emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount. In one embodiment each device of an array of light emitting devices is electrically connected to submount by a ...

A diamond optical component for an optical tool

PLANAR LIGHTWAVE CIRCUIT

In an integrated optical receiver or transmitter, both the displacement of an optical axis caused by thermal changes and the property degradation of an optical functional circuit are inhibited. A planar lightwave circuit having a substrate and a waveguide-type optical functional circuit formed thereon composed of a material different from that of the substrate, and includes a waveguide region formed only of an optical wavelength that is in contact with a side forming an emission-end face of the optical waveguide for propagating the light emitted from the optical functional circuit or an incident-end face of an optical waveguide for propagating the light incident on the optical functional circuit. The planar lightwave circuit is fixed to a fixing mount only at the bottom of the substrate where the waveguide region is formed.

OPTICAL COMMUNICATION MODULE

【課題】高速伝送に適した構成及び構造にすることが可能であり、また、小型化することが可能であり、さらには、光素子の固定や位置合わせを容易にするとともに温度変化時の光軸ズレの抑制を図ることも可能な光通信モジュールを提供する。 【解決手段】光通信モジュール１は、回路基板部としてのトランシーバ回路部２と、サブマウント部３と、光接続部材としてのファイバスタブ４と、光ファイバ結合部品５とを備えて構成されている。光通信モジュール１は、サブマウント部３に実装される光素子の光軸がトランシーバ回路部２の実装面６に対して略平行となるようなモジュール品として構成されている。 【選択図】図１

Layout assembly and method

OPTICAL MODULE

The objective of the present invention is to provide an optical module enabling a compact profile to be achieved in consideration of making connections to an optical fiber, even when a multichip integrated device is mounted on the optical module. An optical module (110) has an integrated multichip integrated device accommodated in a package (111), the integrated multichip integrated device having a planar lightwave circuit (PLC) (113a, b) connected at both ends of an optical function member (112). A reverse waveguide (131a, b) is formed in each of the PLCs, a waveguide formed on the optical function member and optical fibers (114a, b) being connected via the reverse waveguides (131a, b). Also, connection parts (120a, b) for connecting the optical fiber and the optical function member are connected on the same face on each PLC, each of the optical fibers being led out from the face opposing the package.

Optical semiconductor module, its manufacture, reflection film, its manufacture, and laser and optical devices using reflection film

An optical semiconductor element and an optical element having an optical coupling facet are disposed on a support surface of a platform. The optical element is optically coupled to the optical semiconductor element at the optical coupling facet. A protective member covers the optical semiconductor element and is disposed at least in a light transmission area in a space between the semiconductor element and the optical coupling facet of the optical element. The protective member is made of gel acrylic modification resin. An optical semiconductor module having a sufficient moisture resistance and being suitable for low cost is provided.

Multi-channel laser pump source for optical amplifiers

An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Optical fibre connector

An optical fibre connector is moulded into a planar metallic body that is manipulated into a cuboid to form an rf-shielded optical connector.

OPTICAL MODULE

The objective of the present invention is to provide an optical module enabling a compact profile to be achieved in consideration of making connections to an optical fiber, even when a multichip integrated device is mounted on the optical module. An optical module (110) has an integrated multichip integrated device accommodated in a package (111), the integrated multichip integrated device having a planar lightwave circuit (PLC) (113a, b) connected at both ends of an optical function member (112). A reverse waveguide (131a, b) is formed in each of the PLCs, a waveguide formed on the optical function member and optical fibers (114a, b) being connected via the reverse waveguides (131a, b). Also, connection parts (120a, b) for connecting the optical fiber and the optical function member are connected on the same face on each PLC, each of the optical fibers being led out from the face opposing the package.

Photo-semiconductor element package has fixing object made of predetermined amount of nickel or iron alloy for attaching optically transparent plate to frame

A photo-semiconductor element is mounted on a mounting area of a base. A frame with a hole is formed on the peripheral surface of the base. An optically transparent plate (10) is attached around the hole through a fixing object (9) containing 40-60 wt% of Ni or Fe alloy. A cover seals the upper surface of the frame that is formed on the base, thus photo-semiconductor element is sealed air-tightly within the frame.

LASER DEVICE USING A FILM OF REFLEXION AND ITS MANUFACTORING PROCESS

Air-tightly sealed container for photosemiconductor, and photosemiconductor module

A highly reliable air-tightly sealed container having a light transmissive window member formed of a borosilicate glass plate 4 and brazed to a cylindrical portion of a container side wall, the borosilicate glass plate being formed to a substantially right hexagonal shape and provided with a metallized portion 5 on an outer circumferential portion thereof with a circular light transmissive portion 6 left in the central part thereof, a diameter L1 of a circle inscribing the outer circumference of the borosilicate glass plate 4 and a diameter L2 of the light transmissive portion being in the relation of L2/L1 Подробнее

Optical connector with ferrule interference fit

An optical connector having a front and back orientation and suitable for operating with a temperature range, the connector comprising: (a) a ferrule comprising a first material having a first coefficient of thermal expansion (COE), and having no greater than a first diameter below a transition temperature with the temperature range, and no less than a second diameter above the transition temperature; (b) a spring disposed behind the ferrule and in contact with the ferrule to apply a forward urging force to the ferrule; and (c) a housing comprising a second material having a second COE, the housing defining a bore hole having a diameter greater than the second diameter, and an interface portion having a restricted bore hole having no greater than a third diameter below the transition temperature, and no less than a fourth diameter above the transition temperature.

Optical connector device and optical connector

In an optical connector device configured by a combination of an element-side optical connector 10 which accommodates an optical element D, and a fiber-side optical connector 30 which holds an optical fiber, an element accommodating housing member 11 of the optical connector 10, and a fiber holding housing member 31 of the optical connector 30 are formed by an electrically conductive resin. In a state where the optical connectors 10 and 30 are connected to each other, the fiber holding housing member 31 is electrically connected to the element accommodating housing member 11.

The photoelectric conversion module

LASER DEVICE HAS PASSIVE COMPENSATION COUPLING

Multi-channel laser pump source for optical amplifiers

An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Receiver optical module for wavelength multiplexed signal

A receiver optical module that receives a wavelength multiplexed signal is disclosed. The receiver optical module includes an optical de-multiplexer that generates a plurality of signals contained in the wavelength multiplexed signal depending on wavelengths of the signals. The wavelength de-multiplexer has features that the optical de-multiplexer has a plurality of sub-elements stacked to each other, where each of the sub-elements de-multiplexes a portion of the wavelength multiplexed signal. Or, the optical de-multiplexer has a series of wavelength selective filters each extracting signal components having outermost wavelengths from signal components entering therein.

Shielding cage assembly adapted for dense transceiver modules

A shielding cage assembly (10) for shielding a plurality of transceiver modules therein includes a conductive hanger (1), a conductive upper and a lower shielding cages (21, 22), and a spacer (3). A plurality of dividing walls (23, 25) inside the upper and lower shielding cages cooperatively define a plurality of channels for receiving the transceiver modules therein. The spacer is sandwiched between the stacked upper and lower shielding cages. The hanger encloses the shielding cages and the spacer therein and is fixed to a printed circuit board (4).

VERTICAL PLACEMENT SILICON PHOTONICS OPTICAL CONNECTOR HOLDER & MOUNT

A coupled optic system (100) is disclosed. The coupled optic system includes an optic system (202). The optic system includes a frame (504), one or more interface lenses (204), a rotatable lid (702), and one or more frame alignment surfaces (502). The coupled optic system further includes an optical connector (302). The optical connector includes one or more connector lenses (312), an optical connector holder (304), and one or more holder alignment surfaces (308). The optic system is configured to be removably couplable to the optical connector, and the one or more frame alignment surfaces are configured to be removably couplable to the one or more holder alignment surfaces.

FABRICATING METHOD OF LASER USING FIBER BRAGG GRATING AS A EXTERNAL CAVITY AND LASER

본 발명은 광섬유 브라그(Bragg) 격자를 외부 공진기로 사용하는 외부 공진 레이저의 제조방법 및 이에 의해 제조된 레이저에 관한 것이다. 본 발명은, 광섬유 브라그 격자가 일부 영역에 형성된 광섬유 및 양측이 관통된 형태의 공동이 형성된 페룰을 마련하는 단계; 상기 광섬유 브라그 격자가 형성되지 않은 영역의 상기 광섬유 외주면 일부 영역에 열경화 에폭시 수지를 도포하는 단계; 상기 광섬유 브라그 격자가 형성된 영역 및 상기 열경화 에폭시 수지가 도포된 영역이 상기 페룰의 공동 내에 위치하도록 상기 광섬유를 상기 페룰의 공동에 삽입하는 단계; 상기 열경화 에폭시 수지를 경화시켜 상기 광섬유를 상기 페룰에 고정시키는 단계; 및 상기 페룰에 고정된 광섬유의 일단과 광원을 광학적으로 결합하는 단계를 포함하는 광섬유 브라그 격자 외부 공진기를 갖는 레이저의 제조방법을 제공한다. The present invention relates to a method of manufacturing an external resonant laser using an optical fiber Bragg grating as an external resonator, and a laser produced thereby. The present invention comprises the steps of providing an optical fiber formed in a portion of the optical fiber Bragg grating and a ferrule formed with cavities of both sides; Applying a thermosetting epoxy resin to a portion of the outer circumferential surface of the optical fiber in a region where the optical fiber Bragg grating is not formed; Inserting the optical fiber into the cavity of the ferrule such that the region where the optical fiber Bragg grating is formed and the region where the thermosetting epoxy resin is applied are located in the cavity of the ferrule; Curing the thermosetting epoxy resin to fix the optical fiber to the ferrule; And optically coupling one end of the optical fiber fixed to the ferrule and a light source. 광섬유, 광섬유 브라그(Bragg) 격자, 외부 공진, 페룰, 광결합, 티오-캔(TO-CAN) Fiber Optic, Fiber Bragg Grating, External Resonance, Ferrules, Optical Coupling, Tio-Can (TO-CAN)

Method for improving heat dissipation in optical transmitter

A method of positioning a heat generating component on a header to enhance heat sinking characteristics includes positioning the header on a first pedestal, wherein the first pedestal and the header are bounded by an air trench having a vertical surface, and positioning the heat generating component only in areas on the header having an associated heat dissipation conical region extending from the heat generating component downward through the first pedestal at an angle that satisfies Fourier's Law of Heat Conduction, wherein the conical region does not intersect the vertical surface of the air trench.

Electro-optical coupler with circuitry and converters, separated from optical fibres by filled coupling gap

The novel electro-optical coupler for optical fibres has a converter (1) with optically-active regions coupled individually to optical fibres, forming coupling gaps. A light-sensitive integrated electronic circuit (14) is located near the converter. This is electrically wire-bonded to the converter. A first material (20) specific to the light converted, fills each coupling gap. A second material (26) surrounds the circuit. This is basically of the same composition as the first material, but its optical characteristics are modified to make it e.g. opaque or reflective to the light affecting the circuit. First and second materials share a common boundary surface (24), through which the connecting wires (8 g) pass.

Registration structure for aligning components on a substrate

Components such as optical components are accurately aligned on a substrate by engagement with alignment features formed on the substrate. Substrate 1 is coated with a layer of SU-8 2000 (RTM) photoresist 26 by e.g. spin coating. The photoresist is then baked, a negative mask 28 is applied, and the photoresist is irradiated with UV light. The photoresist is then developed and unwanted portions are removed. The portions of photoresist remaining have sufficient size and strength to act as registration features for the alignment of circuit components on the substrate. The alignment structures are particularly useful for hybrid optical circuits.

A diamond window component for an optical tool suitable for harsh environments

An optical tool comprises a chemically inert tubular body 2 defining an internal channel and an opening; a diamond window 6 is bonded to a mounting ring 4 mounted within the channel. The mounting ring 4 comprises a material having a low coefficient of linear thermal expansion of 14.0 x 10-6 K-1 or less at 20°C and a high thermal conductivity of 60 Wm-1K-1 or more at 20°C such as molybdenum. The tubular body 2 comprises an internally tapered end portion 8 and the mounting ring 4 is press-fit into the tapered end portion 8. The optical probe is suitable for use in hostile environments. The diamond window 6 may be joined to the mounting ring 4 using a gold/tantalum braze 10. The tubular body 2 may comprise a plurality of portions 11 projecting from the end wall 13 to protect the window from damage. The mounting ring 4 may have an internal taper 16 so that an optical fibre can be threaded along the body 2. The optical tool may be configured to perform attenuated total reflectance (ATR) spectroscopy ...

Optical fibre alignment

Optoelectronic assembly and method of making the same

MODULATE OPTICAL SEMICONDUCTOR, LASER FILM OF REFLEXION, DEVICES AND OPTIQUEUTILISANT A FILM OF REFLEXION AND THEIR MANUFACTORING PROCESS

LASER DEVICE USING A FILM OF REFLEXION AND ITS MANUFACTORING PROCESS

Pour obtenir une faible différence entre la réflectivité dans l'air et la réflectivité après un scellement par résine, le dispositif de laser comprend un corps d'effet laser (70) présentant une longueur d'onde d'oscillation lambda (nm), un indice de réfraction effectif n0 et deux facettes de réflexion définissant un résonateur optique. Le dispositif comprend, en outre, une première couche (71) réalisée en oxyde de silicium et formée sur au moins une facette de réflexion du corps d'effet laser, une seconde couche (72) réalisée en silicium et formée sur une surface de la première couche, et une troisième couche (73) réalisée en oxyde de silicium et formée sur une surface de la seconde couche. Les première à troisième couches (71-73) forment un film de réflexion (74), dans lequel l'indice de réfraction n0 est dans la plage de 3, 18 à 3, 28. To achieve a small difference between reflectivity in air and reflectivity after resin sealing, the laser device includes a laser effect body (70) having an oscillation wavelength lambda (nm), a effective refractive index n0 and two reflection facets defining an optical resonator. The device further comprises a first layer (71) made of silicon oxide and formed on at least one reflection facet of the laser effect body, a second layer (72) made of silicon and formed on a surface of the laser effect body. first layer, and a third layer (73) made of silicon oxide and formed on a surface of the second layer. The first to third layers (71-73) form a reflection film (74), in which the refractive index n0 is in the range of 3.18 to 3.28.

SPACE ACTIVE OPTICAL CABLE

A space active optical cable (SAOC) includes a cable including one or more optical fibers, and two or more electrical transceivers on opposing ends of the cable and interconnected by the cable. Each of the electrical transceivers includes an enclosure that encloses one or more light sources, one or more light detectors, and control electronics. Also included in the enclosure are a coupling medium to couple light into and out of the one or more optical fibers. The coupling medium can be reflecting surface or an on-axis mount. The enclosure provides a suitable heat propagation and electromagnetic interference (EMI) shielding, and the cable and the two or more electrical transceivers are radiation resistant. SAOC features optionally support a health check algorithm that allows trending optical performance in the absence of an optical connector and a potential surface treatment to increase nominally low emissivity of an EMI conductive surface. 1. A space active optical cable (SAOC) comprising:a cable comprising one or more optical fibers; andtwo or more electrical transceivers on opposing ends of the cable and interconnected by the cable, each of the electrical transceivers of the two or more electrical transceivers comprising:an enclosure enclosing:one or more light sources, one or more light detectors, and control electronics enclosed in the enclosure;a coupling medium configured to couple light into and out of the one or more optical fibers;a radio-frequency (RF) modulator and a local oscillator (LO) modulator configured to modulate light generated by the one or more light sources; anda light processor coupled to the one or more light sources, the RF modulator and the LO modulator and comprising a filter and lock-diode unit configured to generate a heterodyne output light.2. The SAOC of claim 1 , wherein the two or more electrical transceivers are configured to receive power and communicate signals including data claim 1 , command claim 1 , control claim 1 , and ...

Optical fiber fixing structure

An optical fiber fixing structure includes: a cylindrical member; an optical fiber inserted into a hole of the cylindrical member; and a fixing material configured to fix the cylindrical member and the optical fiber, wherein the optical fiber is a polarization maintaining optical fiber having a polarization axis, and a center of the optical fiber is arranged so as to be eccentric to a center of the hole, and an angle formed by an eccentric direction connecting the center of the hole and the center of the optical fiber and the polarization axis is −22.5° to 22.5°, or 67.5° to 112.5°.

Ein aktives optisches Kabel (AOC) mit einem geformten Kunststoff-Leadframe, der einen optischen Stecker überflüssig macht, ein AOC, das den AOC-Stecker integriert, und ein Verfahren zum Verwenden des AOC

OPTICAL COMPONENT

In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component comprises an optical device chip including an LN waveguide, a first PLC waveguide, a second PLC waveguide, and a fiber alignment member, a mount, and optical fibers. Each of connection faces between the first PLC waveguide and the fiber alignment member is configured as a tilted structure, and each of connection faces between the LN waveguide, and the first and second PLC waveguides is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.

MANUFACTORING PROCESS Of a LASER FILM OF REFLEXION AND DEVICES AND OPTIQUEUTILISANT the FILM OF REFLEXION

MODULATE OPTICAL INTERCONNECTION, AND CANE COMPRISING SUCH a MODULE

Optical interconnection module, especially for optical fibers, has optical section overmolded in housing to form optical wave guide

Pour réaliser une interconnexion optique, soit de deux fibres optiques entre elles, soit d'une fibre optique avec un circuit optoélectronique de conversion, on prévoit un module muni d'un corps (2) dans lequel sont surmoulés des tronçons (3) de fibres optiques. Le surmoulage permet d'une part une simplification de la fabrication industrielle et permet d'autre part d'adopter pour les tronçons de fibres optiques des formes, notamment des évasements (16, 17) et ou des lentilles (18, 19) permettant une refocalisation utile des rayons lumineux transportés par ces fibres optiques.

Packaging method and structure of optical-fiber optical device

A sealing packaging structure of optical-fiber optical device is disclosed in the present invention. The invention includes the followings: a sub-assembly of optical-fiber optical device having an extended optical fiber; a ring cap; a tube; and a housing tube. By using the capillarity, the bonding agent is permeated into the minute gap between the subassembly of the optical-fiber optical device and each component so as to reach the purpose of dense bonding and sealing package. The bonding manner of the invention is different from and superior to that of the conventional optical device wherein soldering method is used.

Methods and structures for fiber alignment to photonics chip

OPTICAL CONNECTOR WITH FERRULE INTERFERENCE FIT

An optical connector having a front and back orientation, the connector comprising a ferrule comprising a first mateπal having a first coefficient of thermal expansion (COE), and having a first diameter at a first temperature, and a second diameter at a second temperature, the ferrule also comprising an endface, a housing comprising a second mateπal having a second COE, the housing having a restricted borehole having a third diameter at the first temperature, and a fourth diameter at the second temperature, a resilient member disposed in the housing and in contact with the ferrule to apply a forward urging force to the ferrule, wherein the connector has a first and second configuration, in the first configuration, the second COE is greater than the first COE, the first diameter is greater than the third diameter such that the connector is in an interference state at the first temperature ...

Optical module

An optical module of the present invention is provided with a substrate that includes an insulating layer, a passive element provided inside or on the surface of the insulating layer, and terminal electrodes formed on the surface of the insulating layer, and with at least one active element, which includes at least an optical element and is connected to the terminal electrodes on the substrate surface. The passive element has a dielectric layer, a resistive layer, or a magnetic layer, at least one of the terminal electrodes is connected to the passive element, and at least one of the at least one active element has a protruding electrode and is flip-chip mounted to the terminal electrodes on a principle face of the substrate via the protruding electrode. Taking a plane parallel to the principle face of the substrate as a projection plane, then an area of orthographic projection of the dielectric layer, the resistive layer, or the magnetic layer is smaller than an area of orthographic projection ...

IMPROVED PHOTONIC PACKAGING

The invention relates, amongst others, to an optoelectronic device comprising: a printed circuit board, PCB, comprising a planar PCB surface; a photonic integrated circuit, PIC, comprising a fiber attach region for attachment to a fiber array, FA, and an electronic interface for connecting to the PCB; wherein said PIC is mounted on a portion of said PCB surface being an integral part of the PCB surface; wherein said PCB comprises an opening surrounded, preferably circumferentially surrounded, by portions of said PCB and dividing said PCB surface in a first and second region for thermally insulating said first region and said second region from one another; wherein the portion of said PCB surface on which the PIC is mounted belongs to the first region; and wherein said connecting of the electronic interface to the PCB relates to at least one wire bond extending to the second region, said wire bond preferably being comprised in the optoelectronic device.

THERMAL INTERFACE

A thermal interface (118) may include a thermally conductive cap (120). The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket (122) defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings. An optoelectronic module (100) with an optical subassembly (108) having a plurality of leads located within the cap and gasket openings is described.

CASE FOR ELEMENT PHOTOSEMI-CONDUCTEUR

OPTICAL SUPPORT

Un procédé de fabrication d'un dispositif optique sur une plaque de support (1) met en jeu la définition, sur un côté de la plaque de support, de contacts électriques (2a, 7a) et de trous traversants pour des broches de guidage (5) au moyen d'un processus de photolithographie. Des composants (4, 7) sont ensuite montés sur les contacts (2a, 7a) et les broches de guidage (5) sont montées au travers des trous traversants, en utilisant ces trous traversants en tant que guides.

Optical connector, shield casing, optical connector device

A shield casing is received and held in a connector housing made of a resin. The shield casing includes a casing body portion for receiving an optical element therein, a guide sleeve portion which guides an optical fiber toward the element body portion, and a radiating portion exposed to the exterior of the connector housing. The casing body portion, the guide sleeve portion and the radiating portion are formed integrally on this casing body portion. The whole of the shield casing is made of a metal material such as aluminum and an aluminum alloy. The shield casing further includes screw-fastening fixing piece portions for fixing the shield casing to a mounting board. The shield casing is connected to a ground wiring circuit on the mounting board via the screw-fastening fixing piece portions.

INTERFACING CHIP ON GLASS ASSEMBLY

In one example embodiment, an optoelectronic assembly (200) includes an electronic substrate (208), a transparent component (202) coupled on a first side of the electronic substrate, and a first component (210) which may be formed of or may include nickel plated copper coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure (244). A laser array (232) or a receiver array (236) may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component (214) may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second ...

Optisches Halbleitermodul und Verfahren zu seiner Herstellung

Optoelectronic device packaging assemblies

Coupled optical and optoelectronic devices, and method of making the same

OPTICAL COMPONENT

In an optical component configured to fix to a mount an optical device chip in which waveguide type optical devices having different thermal expansion coefficients are butt-jointed, deterioration in reliability due to thermal stress is suppressed. The optical component comprises an optical device chip including an LN waveguide, a first PLC waveguide, a second PLC waveguide, and a fiber alignment member, a mount, and optical fibers. Each of connection faces between the first PLC waveguide and the fiber alignment member is configured as a tilted structure, and each of connection faces between the LN waveguide, and the first and second PLC waveguides is configured as a right-angled structure. In the right-angled structure, the connection faces are connected by an adhesive having a lower Young's modulus than that of an adhesive used on the connection faces of the tilted structure.

LASER DEVICE HAS PASSIVE COMPENSATION COUPLING

In an optical or optoelectronic module (1) on the optical path (7) between a diode laser (9) and an optical fibre (2) is inserted an intermediate medium (4, 10) whereof the optical index decreases with temperature. Thus power losses during laser emission caused by rise in operating temperature are passively compensated by improving transmission between the diode (9) and the fibre (5). Preferably, the intermediate medium (4, 10) is deposited in the form of a capsule enclosing the diode (9) and the tip of the fibre (5), thereby providing passively a transmitted power independent of the operating temperature.

Photonic interposer with wafer bonded microlenses

CONNECTING MID-BOARD OPTICAL MODULES

A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipator, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.

LASER MODULE

A semiconductor laser module (1) comprises: a laser mount (31) wherein a semiconductor laser chip (32) is mounted; a fiber mount (40) wherein an optical fiber (2) is mounted; a sub-mount (20) wherein both the laser mount (31) and the fiber mount (40) are mounted; and a substrate (10) on which the sub-mount (20) is mounted. Protruding sections (11a-11d) are formed on the upper surface of the substrate (10) and the sub-mount (20) is bonded to the substrate (10) by a soft solder (61) spreading between the sub-mount (20) and the substrate (10).

Optomechanical assembly

A dual enclosure including an inner housing inside an outer housing is provided for an optical bench supporting a plurality of optical elements. An air gap is provided between the inner and outer housings. The inner housing may act as a heat spreader for isothermal operation, and the outer housing may act as a heat insulator. The optical bench may be disposed within the inner housing on a supporting element or elements, which thermally and mechanically decouple the optical bench from the inner housing.

Optical fibre alignment between ferrule and housing using tapered surfaces

An optical fibre 8 is aligned with an with the housing 1 of an optical device 2, component or package such as an optical transducer or sensor. The housing has a tapered surface 5 to receive a correspondingly tapered portion 7 of a ferrule 6 in which a fibre 8 is mounted. The tapered surfaces 5, 7, may for example be frusto-conical or conical. An optical device 2 may be provided in a cavity 3 which may be sealed by the mating tapered surfaces 5, 7. The optical device may also be provided on a mounting bracket 10 with flexible supports (11, fig 2) connected to the housing to accommodate thermal expansion of the housing and maintain alignment.

Spacer and shielding cage assembly using the spacer

Optical module

The optical module includes a housing, an optical subassembly, a support and a thermal sheet. The housing has a base and a cover. The support having two leg portions and a bridge connecting these leg portions is placed on the bottom surface of the base. The optical subassembly is disposed between the leg portions without in contact with the bridge. The thermal sheet is provided between the bridge of the support and the cover. Heat generated in the optical subassembly is transferred in sequence to the leg portions, the bridge, the thermal sheet and the cover.

Flexible backlight illumination carrier

A display includes a light guide plate, a plurality of light sources disposed along an edge of the light guide plate, and a flexible carrier to which the plurality of light sources are secured. The flexible carrier includes a plurality of flexures, each flexure of the plurality of flexures disposed between a respective pair of adjacent light sources of the plurality of light sources to allow a spacing between the pair of adjacent light sources to change.

Coupled optical and optoelectronic devices, and method of making the same

An optical-optoelectronic coupling structure comprising a flip-chip optoelectronic/ultrathin silicon-on-sapphire device mounted on a V-groove, optical-fiber-bearing carrier substrate, including light-reflective structures for launching light into the optical fiber core or transmitting light emitted by the optical fiber core to the optoelectronic device. The optical fiber may be immobilized in the V-groove using a curable resin adhesive characterized by a refractive index substantially similar to the refractive index of the optical fiber.

Optical carrier

Stress reduced laser module

A module which holds an optical fiber and a laser in alignment to couple light energy emitted from the laser to an end of the fiber. The fiber is held within a metal ferrule. The fiber and the laser are aligned by means of a metal platform to which both the ferrule and the laser are secured. Only the ferrule is secured to the outer box of the module, so that the platform, along with the alignment of the fiber and the laser, are isolated from mechanical stresses induced in the box.

Active optical cable (AOC) connector having a molded plastic leadframe, an AOC that incorporates the AOC connector, and a method of using an AOC

An AOC connector is provided that has a molded plastic leadframe that obviates the need to use an optical connector in the AOC and that is capable of operating over a wide temperature range and a large number of temperature cycles. The AOC connector includes a plastic optical port that is adapted to be connected via an optically-transparent adhesive material to an end of an optical fiber cable.

Ferrule product, method of making the same, and optical module

A ferrule product 30b is utilized in an optical module 5 comprising a semiconductor optical amplifier 55 having a pair of end facets. The ferrule product 30b comprises an optical fiber 51 and a ferrule 52. The optical fiber 51 has one end part, optically coupled with one of the pair of end facets, a first part including a grating 511 disposed at a predetermined position separated from one end part, and a second part different from the first part. The ferrule 52 has a capillary part 521 for holding the optical fiber 51 and a flange part 522 for holding the capillary part. The flange part 522 is disposed on the second part.

Optical connector device and optical connector

In an optical connector device configured by a combination of an element-side optical connector 10 which accommodates an optical element D, and a fiber-side optical connector 30 which holds an optical fiber, an element accommodating housing member 11 of the optical connector 10, and a fiber holding housing member 31 of the optical connector 30 are formed by an electrically conductive resin. In a state where the optical connectors 10 and 30 are connected to each other, the fiber holding housing member 31 is electrically connected to the element accommodating housing member 11.

Optical module

Distortion of the temperature control element and the package by thermal deformation or mechanical deformation is prevented from being transmitted to the optical element as stress, and at the same time, constant temperature control of the optical element is realized. An optical element unit including an optical element that requires temperature control and an optical component that does not require temperature control, and a temperature control element for performing temperature adjustment of the optical element are arranged. The temperature control element performs temperature adjustment control of the optical element through a region mounted with the optical component of the optical element unit.

Optical subassembly and optical transceiver installing the same

The present invention relates to an optical transceiver that suppresses the EMI radiation through the optical receptacle and the discharge of the static electricity attributed to the optical connector through the optical receptacle. The optical transceiver of the invention includes an optical subassembly comprising a resin made sleeve cover in addition to a metal package and the metal sleeve assembly. Since the resin sleeve cover secures the tip of the sleeve assembly, the EMI discharge and the noise radiation through this sleeve cover can be suppressed. Moreover, the sleeve cover and the bush both included in the sleeve assembly form a united flange. Accordingly, the frame and the holder for positioning the optical subassembly are unnecessary to provide a specific structure.

ACTIVE OPTICAL CABLE (AOC) HAVING A MOLDED PLASTIC LEADFRAME THAT OBVIATES THE NEED FOR AN OPTICAL CONNECTOR, AN AOC THAT INCORPORATES THE AOC CONNECTOR, AND A METHOD OF USING THE AOC

An AOC connector is provided that has a molded plastic leadframe that obviates the need to use an optical connector in the AOC and that is capable of operating over a wide temperature range and a large number of temperature cycles. The AOC connector includes a plastic optical port that is adapted to be connected via an optically-transparent adhesive material to an end of an optical fiber cable.

Ein aktives optisches Kabel (AOC) mit einem geformten Kunststoff-Leadframe, der einen optischen Stecker überflüssig macht, ein AOC, das den AOC-Stecker integriert, und ein Verfahren zum Verwenden des AOC

Ein Aktives-optisches-Kabel(AOC)-Stecker (10a) zur Verwendung mit einem AOC (10), wobei der AOC-Stecker (10a) aufweist:einen geformten Steckerkörper (20), der einen ersten geformten Steckerteilbereich (20a) und einen zweiten geformten Steckerteilbereich (20b) aufweist, die zusammengekoppelt sind, und wobei eine Kavität zwischen angrenzenden inneren Oberflächen (20a) des ersten und des zweiten geformten Steckerteilbereichs (20a, 20b) existiert, wenn der erste und der zweite geformte Steckerteilbereich (20a, 20b) zusammengekoppelt sind, wobei die geformten Steckerteilbereiche (20a, 20b) ein Kunststoffmaterial aufweisen, wobei der geformte Steckerkörper (20) zumindest einen optischen Anschluss (21) und ein optisches System, das darin integral gebildet ist, aufweist, wobei der optische Anschluss (21) geeignet ist, mit einem Ende (22a) eines Lichtwellenleiterkabels (22) zu verbinden;einen Leadframe (30), der mit dem geformten Steckerkörper (20) gekoppelt ist, wobei der Leadframe (30) einen Befestigungsteilbereich ...

Optical module

The objective of the present invention is to provide an optical module enabling a compact profile to be achieved in consideration of making connections to an optical fiber, even when a multichip integrated device is mounted on the optical module. An optical module (110) has an integrated multichip integrated device accommodated in a package (111), the integrated multichip integrated device having a planar lightwave circuit (PLC) (113a, b) connected at both ends of an optical function member (112). A reverse waveguide (131a, b) is formed in each of the PLCs, a waveguide formed on the optical function member and optical fibers (114a, b) being connected via the reverse waveguides (131a, b). Also, connection parts (120a, b) for connecting the optical fiber and the optical function member are connected on the same face on each PLC, each of the optical fibers being led out from the face opposing the package.

Optical wiring component and electronic device

INTERPOSER STRUCTURE HAVING OPTICAL FIBER CONNECTION AND RELATED FIBER OPTIC CONNECTOR FOR THE SAME

Disclosed are interposer structures having an optical fiber connection and a related fiber optic ferrule that can form a portion of an optical assembly. The interposer structure is useful for transmitting optical signals to/from an integrated circuit that may be attached to the interposer. Specifically, the interposer structure and the related ferrule of the optical connector provide a passively aligned structure having a matched thermal response to maintain a suitable optical connection between the devices over a range of temperatures.

Optical module

Distortion of the temperature control element and the package by thermal deformation or mechanical deformation is prevented from being transmitted to the optical element as stress, and at the same time, constant temperature control of the optical element is realized. An optical element unit including an optical element that requires temperature control and an optical component that does not require temperature control, and a temperature control element for performing temperature adjustment of the optical element are arranged. The temperature control element performs temperature adjustment control of the optical element through a region mounted with the optical component of the optical element unit.

Flexible Optical Pillars for an Optical Assembly

An optical assembly is provided that includes a substrate. The substrate has a set of one or more optical waveguides. A component is coupled to and spaced apart from the substrate by at least one or more mechanical supports. The component has one or more photodetectors. A set of one or more flexible optical pillars is disposed to be positioned between the set of optical waveguides and the photodetectors. The set of flexible optical pillars is optically transmissive and configured to transmit light from the set of optical waveguides to the photodetectors.

Pull detach mechanism for fiber optic transceiver module

A delatch mechanism includes wedges that reside in pockets adjacent to a post on a module when the module is latched in a cage. Pulling on a handle pulls the wedges out of the pockets so that the wedges rise and lift a tab. Pulling the delatch mechanism to a limit of its motion frees the post on the module from the tab, and further pulling transfers to the module to pull the module out of the cage. The delatch mechanism can include a spring system that returns the wedges to their pockets for latching, allows movement of the wedges relative to the module for lifting of the tab, and locks into the module to pull the module free of the cage. Handles for the latch mechanism can include a bail, a flexible tab, or fixed handle that is part of an integrated structure including the wedges.

LASER MODULE

The semiconductor laser module (1) includes: a laser mount (31) having thereon a semiconductor laser chip (32); a fiber mount (40) having thereon an optical fiber (2); a submount (20) on which the laser mount (31) and the fiber mount (40) are placed; and a substrate (10) on which the submount 20 is placed, the substrate (10) having protrusions (11a to 11d) on a top surface thereof, the submount 20 being joined to the substrate (10) with a soft solder (61) spread between the submount (20) and the substrate (10).

Optical device using chip-on-board technology

Integrated coupling modules for high-bandwidth fiber-optic systems

OPTICAL FIBRE ALIGNMENT

Aligning an optical fibre (8) with an optical device (2), component or package such as an optical transducer or sensor is disclosed, A housing (1) for an optical device (2) is provided having a tapered surface (5) to receive a correspondingly tapered portion (7) of a ferrule (6) in which a fibre (8) is mounted. The tapered surfaces (5, 7), which may for example be frusta-conical or conical, enable the optical device (2) and ferrule to be quickly and precisely aligned. An optical device (2) may be provided in a cavity (3) which may be sealed by the mating tapered surfaces (5, 7), The optical device may also be provided on a mounting bracket (10) with flexible supports (11) connected to the housing to accommodate thermal expansion of the housing and maintain alignment.

OPTICAL FIBER FIXING STRUCTURE

An optical fiber fixing structure includes: a cylindrical member; an optical fiber inserted into a hole of the cylindrical member; and a fixing material configured to fix the cylindrical member and the optical fiber, wherein the optical fiber is a polarization maintaining optical fiber having a polarization axis, and a center of the optical fiber is arranged so as to be eccentric to a center of the hole, and an angle formed by an eccentric direction connecting the center of the hole and the center of the optical fiber and the polarization axis is −22.5° to 22.5°, or 67.5° to 112.5°.

PARELLEL OPTICAL TRANSCEIVER MODULE

A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer.

High Thermal Conductivity Region for Optoelectronic Devices

This document describes techniques and apparatuses that implement a high thermal conductivity region for optoelectronic devices. In some embodiments, a printed circuit board (PCB) includes a high thermal conductivity region that extends through the PCB. The high thermal conductivity region has first and second surfaces that are approximately coplanar with exterior layers of the PCB. A side-emitting optoelectronic device is mounted to the first surface of the high thermal conductivity region via conductive material that enables conduction of the device's heat into the high thermal conductivity region. The high thermal conductivity region can then transfer the heat away from the device and toward the second surface of the high thermal conductivity region, thereby improving the device's thermal performance. 1. A printed circuit board assembly comprising:a printed circuit board (PCB) having a first exterior layer on which conductive traces are embodied and a second exterior layer opposite to the first exterior layer;a high thermal conductivity region that extends through the PCB, the high thermal conductivity region having a first surface that is approximately coplanar to the first exterior layer of the PCB and a second surface that is approximately coplanar to the second exterior layer of the PCB; anda side-emitting or top-emitting optoelectronic device having a first electrical contact connected to the first surface of the high thermal conductivity region via electrically conductive material and a second electrical contact connected to the conductive traces of the first exterior layer of the PCB via wire bonds.2. The printed circuit board assembly of claim 1 , further comprising an insulative layer of material on the second surface of the high thermal conductivity region and at least a portion of the second exterior surface of the PCB.3. The printed circuit board assembly of claim 1 , wherein planar dimensions of the first surface of the high thermal conductivity ...

Method of manufacturing optical module

A method of manufacturing an optical module having an optical element includes: (a) providing a housing having a base portion and a frame portion provided on the base portion; (b) providing a spacer on the base portion of the housing; (c) pressing the spacer to plastically deform the spacer; (d) bonding the optical element and the spacer; (e) disposing a cover member formed of a transparent substrate on the housing; and (f) providing a connector with a lens to surround the housing.

Fiber laser apparatus

A fiber laser apparatus includes: a short-length type fiber to which an active element is added and that has a length of 300 mm or less: a ferrule attached to an end of the fiber; and a housing that accommodates the fiber and supports the fiber with the ferrule. Each of the housing and the ferrule is composed of a material having a first thermal expansion coefficient that is equal to or have a predetermined difference from a second thermal expansion coefficient of a raw material of the fiber. The predetermined difference between the first and second thermal expansion coefficients is within −8.6×10−6 to 11.4×10−6/K.

Interposer structure having optical fiber connection and related fiber optic connector for the same

OPTICAL COMMUNICATION MODULE AND METHOD OF PRODUCTING OPTICAL COMMUNICATION MODULE

Wavelengh Division Multiplexer and Demultiplexer

본 발명은 파장 분할 다중화 및 역다중화 장치, 광통신 모듈, 및 광학 장치를 제공한다. 이 파장 분할 다중화 및 역다중화 장치는 일측에 렌즈 어레이를 포함하는 제1 렌즈 블록, 렌즈 어레이들에 대응하는 렌즈 면을 포함하고 제1 렌즈 블록의 타측에 결합하는 제2 렌즈 블록, 중심에 광섬유 페럴을 고정하고 제2 렌즈 블록에 적층되는 리셉터클, 및 제1 렌즈 블록의 일측에 결합하는 베이스를 포함하고, 제1 렌즈 블록은 상기 베이스 상에 적층된다. The present invention provides a wavelength division multiplexing and demultiplexing apparatus, an optical communication module, and an optical apparatus. The wavelength division multiplexing and demultiplexing device includes a first lens block including a lens array on one side, a second lens block including a lens surface corresponding to the lens arrays and coupled to the other side of the first lens block, and an optical fiber ferrule in the center thereof. And a base coupled to one side of the first lens block and a receptacle fixed to the second lens block, wherein the first lens block is stacked on the base.

Optical connector with ferrule interference fit

An optical connector for operation within a temperature range, comprising: (a) a ferrule comprising a first material having a coefficient of thermal expansion COE-1, and a diameter no greater than a diameter d1 below a transition temperature Ts within the temperature range and no less than a diameter d2 above Ts; (b) a spring disposed behind and in contact with the ferrule to apply a forward force to the ferrule; and (c) a housing comprising a second material having a coefficient of thermal expansion COE-2 and defining a bore hole having a diameter greater than d2, and an interface having a restricted bore hole having a diameter no greater than a diameter d3 below Ts, and no less than a diameter d4 above Ts, wherein connector configuration is COE-2>COE-1 with d>d3 and d2d4.

APPARATUS FOR WAVELENGTH-DIVISION MULTIPLEXING AND DEMULTIPLEXING

The present invention relates to an apparatus for wavelength-division multiplexing and demultiplexing, to an optical communication module, and to an optical device. The apparatus for wavelength-division multiplexing and demultiplexing comprises: a first lens block having a lens array at one side thereof; a second lens block having a lens surface corresponding to the lens array and combined with the other side of the first lens block; a receptacle having an optical fiber ferrule fixed at the center thereof and stacked on the second lens block; and a base combined with one side of the first lens block, wherein the first block is stacked on the base. 1. An apparatus for wavelength division multiplexing and demultiplexing , the apparatus comprising:a first lens block including a lens array at one side of the first lens block;a second lens block including a lens surface corresponding to the lens array and combined with another side of the first lens block;a receptacle having an optical fiber ferrule fixed at a center thereof and stacked on the second lens block; anda base combined with the one side of the first lens block,wherein the first lens block is stacked on the base.2. The apparatus of claim 1 , further comprising a plurality of thin film is filters arranged at the another side of the first lens block corresponding to the lens array and having different wavelength ranges.3. The apparatus of claim 2 , wherein the optical fiber ferrule is aligned to a focal length of the second lens block claim 2 , a light ray emitted from the optical fiber ferrule is converted to a parallel light by the second lens block claim 2 , the parallel light is converted to light rays having predetermined wavelength ranges by the thin film filters claim 2 , and the light rays having predetermined wavelength ranges are concentrated on focuses by the lens array.4. The apparatus of claim 1 , wherein the first lens block and the second lens block are insertion combined with each other claim 1 , ...

Optical connector with ferrule interference fit

An optical connector for operation within a temperature range, comprising: (a) a ferrule comprising a first material having a coefficient of thermal expansion COE-1, and a diameter no greater than a diameter d1 below a transition temperature Ts within the temperature range and no less than a diameter d2 above Ts; (b) a spring disposed behind and in contact with the ferrule to apply a forward force to the ferrule; and (c) a housing comprising a second material having a coefficient of thermal expansion COE-2 and defining a bore hole having a diameter greater than d2, and an interface having a restricted bore hole having a diameter no greater than a diameter d3 below Ts, and no less than a diameter d4 above Ts, wherein connector configuration is COE-2>COE-1 with d>d3 and d2<d4 or COE-2<COE-1 with d1<d3 and d2>d4.

Thermally compensated parallel optical communication module

In a parallel optical communication module, an array of opto-electronic devices secured with respect to a mount and an array of optical elements of an optical device that is also secured with respect to the mount are unconstrained against relative movement due to thermal expansion of the mount and optical device. The mount and optical device can be made of materials having similar coefficients of thermal expansion. As thermal expansion in the mount causes the opto-electronic devices to move, similar thermal expansion in the optical device causes the optical elements to move to a similar extent. This co-movement of the opto-electronic devices and optical elements to similar extents promotes continued maintenance of optical alignment between opto-electronic elements and corresponding optical elements.

Active optical cable module for cable system

A module having first and second ends, and comprising at least one circuit board extending from the first end to the second end; at least one electrical connector at the first end, the at least one electrical connector being electrically connected to the circuit board, the electrical connector having a form factor of a standard electrical connector; at least one optical connector at the second end; a plurality of optical electrical devices (OEDs) disposed on the circuit board, wherein the OEDs are connected electrically to the at least one electrical connector through the circuit board, and wherein the OEDs are connected optically to at least one optical connector.

ACTIVE OPTICAL CABLE FOR WEARABLE DEVICE DISPLAY

An active optical cable (AOC) for a helmet mounted display (HMD) or goggles includes a transceiver module having a rigid-flex or flex connector packaging to physically couple with an electrical data interface of the HMD or goggles. The transceiver module includes one or more media converters to receive electrical data of multiple formats from the HMD or googles and convert the received electrical data to a common format, and an optical engine communicatively coupled to the one or more media converters to output the converted electrical data as optical data. The AOC includes a cable assembly including at least fiber optic cables with one end of the cable assembly communicatively couple to the transceiver module to receive the optical data output from optical engine; and another transceiver module having a quick-release connector packaging and communicatively coupled to other end of the cable assembly to receive the optical data. 1. An active optical cable for a wearable display associated with a helmet or goggles , the active optical cable comprising: one or more media converters configured to receive electrical data of multiple formats from the helmet or the goggles and convert the received electrical data to a common format, and', 'an optical engine communicatively coupled to the one or more media converters to output the converted electrical data as optical data;, 'a transceiver module having a rigid-flex or flex connector packaging configured to physically couple with an electrical data interface of the helmet or goggles, wherein the transceiver module includesa cable assembly including at least fiber optic cables with one end of the cable assembly communicatively couple to the transceiver module having the rigid-flex or flex connector packaging to receive the optical data output from optical engine of the transceiver module having the rigid-flex or flex connector packaging; andanother transceiver module having a quick-release connector packaging and ...

DIAMOND OPTICAL COMPONENT FOR AN OPTICAL TOOL

A component for an optical probe, the component comprising: a tubular body defining an internal channel and an opening; a mounting ring which is mounted within the internal channel and configured to define an aperture aligned with the opening; and a window disposed across the aperture and bonded to the mounting ring around the aperture, wherein the window is diamond, wherein the mounting ring comprises a material having a coefficient of linear thermal expansion a of 14×10Kor less at 20° C. and a thermal conductivity of 60 WmKor more at 20° C., and wherein the tubular body is made of a chemically inert material. 1. A component for an optical probe , the component comprising:a tubular body defining an internal channel and an opening;a mounting ring which is mounted within the internal channel and configured to define an aperture aligned with the opening; anda window disposed across the aperture and bonded to the mounting ring around the aperture,wherein the window is diamond,{'sup': −6', '−1', '−1', '−1, 'wherein the mounting ring comprises a material having a coefficient of linear thermal expansion α of 14.0×10Kor less at 20° C. and a thermal conductivity of 60 WmKor more at 20° C.,'}wherein the tubular body is made of a chemically inert material, andwherein the tubular body comprises an internally tapered end portion and the mounting ring is press-fit into the tapered end portion.2. A component according to claim 1 , wherein α is one of: 12.0×10Kor less; 10.0×10Kor less; 8.0×10Kor less; 6.0×10Kor less; and 4.0×10Kor less.3. A component according to claim 1 , wherein the thermal conductivity is one of: 60 WmKor more; 80 WmKor more; 100 WmKor more; 120 WmKor more; and 140 WmKor more.45-. (canceled)6. A component according to claim 1 , wherein the material of the mounting ring comprises one or more of molybdenum claim 1 , chromium claim 1 , tungsten claim 1 , nickel claim 1 , rhodium claim 1 , ruthenium claim 1 , diamond claim 1 , silicon carbide (SiC) claim 1 , ...

THERMAL INTERFACE

A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings. 1. A thermal interface comprising: a base defining a plurality of cap openings;', 'a finger extending from the base; and', 'an extension extending from the base; and, 'a thermally conductive cap includinga gasket defining a plurality of gasket openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings.2. The thermal interface of claim 1 , further comprising a pad including a pliant thermal interface material.3. The thermal interface of claim 1 , further comprising an adhesive located between the gasket and the base of the cap.4. The thermal interface of claim 1 , wherein the gasket openings are smaller than the cap openings.5. The thermal interface of claim 1 , wherein the finger is a first finger and the cap includes a plurality of fingers claim 1 , including the first finger.6. The thermal interface of claim 1 , wherein the extension has a length greater than a length of the finger.7. The thermal interface of claim 1 , wherein the cap is configured to be positioned at an end face of a header of an optical subassembly claim 1 , and the finger and the extension are configured to be positioned at a side of the header.8. The thermal interface of claim 1 , wherein the cap includes copper.9. An optoelectronic module comprising:a shell including a seat;an optical subassembly including a header having a plurality of leads; [ a base defining a plurality of cap openings;', 'a finger extending from the base; and', 'an extension extending from the base; and ...

LENS ASSEMBLIES AND OPTICAL CONNECTORS INCORPORATING THE SAME

Lens assemblies including a substrate and a plurality of mechanically isolated lenses coupled to the substrate are disclosed. The substrate may have a low coefficient of thermal expansion. Optical connectors including the lens assemblies described herein, as well as methods of fabricating a lens assembly, are also disclosed. In one embodiment, a lens assembly includes a substrate having a first surface, and a lens layer including a plurality of lenses. A coefficient of thermal expansion of the substrate is different from a coefficient of thermal expansion of the plurality of lenses. The lens layer is coupled to the first surface of the substrate, and each lens of the plurality of lenses is mechanically isolated from adjacent lenses of the plurality of lenses by gap regions within the lens layer. 1. A lens assembly comprising:a substrate comprising a first surface; and a coefficient of thermal expansion of the substrate is different from a coefficient of thermal expansion of the plurality of lenses;', 'the lens layer is coupled to the first surface of the substrate; and', 'each lens of the plurality of lenses is mechanically isolated from adjacent lenses of the plurality of lenses by gap regions within the lens layer., 'a lens layer comprising a plurality of lenses, wherein2. The lens assembly of claim 1 , wherein the coefficient of thermal expansion of the substrate is less than the coefficient of thermal expansion of the plurality of lenses.3. The lens assembly of claim 1 , wherein the lens layer is made from an Ultem resin.4. The lens assembly of claim 1 , wherein the substrate is glass.5. The lens assembly of claim 1 , wherein portions of lens layer material extend beyond a perimeter of one or more individual lenses of the plurality of lenses.6. The lens assembly of claim 1 , wherein each lens is disposed in a tab extending from a perimeter of the lens layer claim 1 , and the lens layer further comprises a discontinuous web portion.7. The lens assembly of claim 1 ...

Methods, devices and systems that dissipate heat and facilitate optical alignment in optical communications modules

A heat dissipation system for an optical communications module is provided that includes a cold block on which the optoelectronic components and a lens assembly of an OSA of the module are mounted. The cold block has precisely-controlled mounting surface heights that precisely passively align the lens assembly in directions normal to mounting surfaces of the cold block. The cold block is made of a material of very high thermal conductivity, typically copper, so that heat generated by the optoelectronic components is dissipated into the cold block to maintain the optoelectronic components well below maximum allowable temperatures. In addition, an optical interface device of the OSA has a low-profile and an optical configuration that allows it to be used with a high optical fiber count.

Optical sub-module and optical module

An optical sub-module includes a first casing, a second casing, an adhesive layer and an optical device. The first casing has a top wall and a first sidewall. The second casing has a bottom wall and a second sidewall. A height of the second sidewall in a thickness direction of the bottom wall is greater than a height of the first sidewall in a thickness direction of the top wall, and the second casing and the first casing is connected to form a chamber. The adhesive layer is disposed between a surface of the first sidewall and a surface of the second sidewall, and a coefficient of thermal expansion of the adhesive layer is greater than a coefficient of thermal expansion of the first casing and a coefficient of thermal expansion of the second casing. The optical device is disposed in the chamber and fixedly connected to the second casing.

Apparatus For Forming A Transceiver Interface, Ferrule, and Optical Transceiver Component

An apparatus for forming a transceiver interface includes an fiber optic ferrule and an optical transceiver component. The fiber optic ferrule engages a mating plane of a lens array in the optical transceiver component. The engagement of the two components may be removable rather than fixed. The fiber optic ferrule also engages a mechanical interface to account for three degrees of freedom, while the engagement of the mating surfaces account for another three degrees of freedom. 1. An apparatus for forming a transceiver interface comprising: a main body having a front end, a back end, and a first opening extending from the back end toward the front end, the first opening configured to receive optical fibers therein; and', 'a bottom surface having a first portion and a second portion, the first portion having an optical aperture therein to allow light associated with the optical fibers to pass therethrough and the second portion having alignment projections extending from the bottom surface and away from the main body; and, 'a fiber optic ferrule comprising a lens array having a plurality of optical lenses; and', 'a mechanical interface operatively attached to the lens array and having a joining surface, the mechanical interface having two openings extending into the mechanical interface through the joining surface to receive the alignment projections on the bottom surface of the fiber optic ferrule, the second portion of the bottom surface of the fiber optic ferrule and the joining surface forming a gap therebetween upon engagement of the fiber optic ferrule to the optical transceiver., 'an optical transceiver component comprising2. The apparatus according to claim 1 , wherein the first portion defines a first mating surface that lies in a first plane claim 1 , the second portion lies in a second plane claim 1 , the joining surface of mechanical interface lies in a third plane claim 1 , the second and third planes being offset from one another when the fiber optic ...

Thermal management of optical coupling systems

An optical coupling system includes a substrate, an electronic die comprising a plurality of coupling holes for passing light, an optical element die attached to a bottom surface of the electronic die, the electronic die attached to the substrate such that the electronic die covers a cavity in the substrate and the optical element die resides within the cavity of the substrate. The system may also include a thermally conductive lid that covers and contacts the electronic die and the substrate and has a coupling aperture that enables light that passes through the coupling holes to pass through the thermally conductive lid. The system may also include an optical cable coupler comprising a coupling section that laterally fits within the coupling aperture and a body section disposed above the coupling section that is laterally larger than the coupling section. A method for providing the above system is also disclosed herein.

INTERPOSER COUPLING ASSEMBLY HAVING AN OPTICAL PATHWAY INCLUDING A GRIN LENS AND RELATED OPTICAL PLUG ASSEMBLIES

Disclosed are interposer including an interposer coupling assemblies for communicating optical signals to an integrated circuit and other interposer structures having an optical interface for optical connections. In one embodiment, the interposer coupling assembly includes a connector attachment saddle having an optical alignment structure, an optical pathway that includes a GRIN lens, and an optical signal turning element adjacent to the GRIN lens. The interposer coupling assembly may be optically attached to an integrated circuit or a base that is attached to an integrated circuit to form an interposer structure that allows high-speed data transfer. Also disclosed are complimentary optical assemblies that may be optically connected to the interposer coupling assembly.

INTERPOSER STRUCTURE HAVING OPTICAL FIBER CONNECTION AND RELATED FIBER OPTIC CONNECTOR FOR THE SAME

Disclosed are interposer structures having an optical fiber connection and a related fiber optic ferrule that can form a portion of an optical assembly. The interposer structure is useful for transmitting optical signals to/from an integrated circuit that may be attached to the interposer. Specifically, the interposer structure and the related ferrule of the optical connector provide a passively aligned structure having a matched thermal response to maintain a suitable optical connection between the devices over a range of temperatures.

Light Generating Apparatus

A light generating apparatus that is capable of being coupled to a connector that supports the proximal end of a light diffusing fiber. According to one implementation the light generating apparatus includes a laser having a housing and a focus lens through which light generated by the laser is emitted. The apparatus also includes a heat removing metallic receptacle that has a first end that is thermally connected to the laser housing and a second end that is connectable to the light diffusing fiber connector. The metallic receptacle has an internal cavity that provides a direct line of sight between the focus lens of the laser and the proximal end of the light diffusing fiber when the connector is coupled to the second end of the metallic receptacle. 1. A light generating apparatus that is capable of being coupled to a light diffusing fiber connector that supports the proximal end of a light diffusing fiber , the apparatus comprising:a laser having a laser housing and a focus lens through which a light beam generated by the laser is emitted,a heat removing metallic receptacle having a first end that is thermally connected to the laser housing and a second end that is connectable to the light diffusing fiber connector, the metallic receptacle having an internal cavity that is configured to provide an unobstructed pathway for the generated light beam to pass from the focus lens of the laser and the proximal end of the light diffusing fiber when the light diffusing fiber connector is coupled to the second end of the metallic receptacle.2. The light generating apparatus according to claim 1 , further comprising a light generating apparatus housing onto which the metallic receptacle is removably attached claim 1 , at least a portion of the laser and metallic receptacle residing inside the light generating apparatus housing.3. The light generating apparatus according to claim 2 , wherein the metallic receptacle is removably attached to the light generating apparatus ...

Optical module, optical communication equipment, and optical transmission device

An optical module includes a circuit board, an optical element on the circuit board, a semiconductor circuit element thereon and electrically coupled with the optical element, an optical connection member formed on a back surface of the circuit board and including an optical fiber receiving groove, and a pressing plate disposed on a side opposite to the circuit board of the optical connection member so as to fix the optical fiber. The semiconductor circuit element is mounted nearer a tip side of the circuit board in relation to the optical element such that the circuit board, the optical connection member and a tip part of the optical fiber are sandwiched between the semiconductor circuit element and the pressing plate. The circuit board includes a plurality of electrodes to be electrically coupled with an equipment side circuit board formed on a tip part of a back surface of the circuit board.

OPTICAL FIBER HEAT DISSIPATION PACKAGE

A heat-dissipation package for use with an optical fiber includes a base, a cover, and a hollow sleeve. The base includes an upper surface, a lower surface, and a groove embedded in the upper surface, the groove having a generally U-shaped cross-sectional shape. The cover is positioned on the upper surface of the base. The sleeve includes a cylindrical inner surface and an outer surface with a first portion which has a generally U-shaped cross section and a second portion which has a generally planar cross section such that edges of the planar cross section contact an open end of the U-shaped cross section. The first portion of the outer surface of the sleeve is positioned in the groove and the second portion of the outer surface of the sleeve is in contact with the cover. The sleeve is configured to encapsulate a heat-generating section of the optical fiber. 1. A heat-dissipation package for use with an optical fiber with a heat-generating section , the optical fiber including a core which is surrounded by at least one cladding which is surrounded by at least one coating layer , the heat-generating section including the core and the at least one cladding and occupying a portion of an axial length of the optical fiber , the heat-dissipation package comprising:a base including an upper surface, a lower surface, two opposing end surfaces, and a groove embedded in the upper surface, the groove having a generally U-shaped cross-sectional shape;a cover including an upper surface, a lower surface, and two opposing end surfaces, the cover positioned on the upper surface of the base; anda hollow sleeve including a cylindrical inner surface and an outer surface with a first portion which has a generally U-shaped cross section and a second portion which has a generally planar cross section such that edges of the planar cross section contact an open end of the U-shaped cross section, the first portion of the outer surface of the sleeve positioned in the groove and the second ...

OPTICAL COUPLING ASSEMBLIES FOR COUPLING OPTICAL CABLES TO SILICON-BASED LASER SOURCES

Optical coupling assemblies for silicon-based optical sources are disclosed. In one embodiment, an optical coupling assembly includes an optical coupling carrier frame and a jumper cable assembly. The optical coupling carrier frame includes a frame portion defining an integrated circuit opening operable to receive an integrated circuit assembly, and a connector portion extending from the frame portion. The connector portion includes a channel operable to receive an optical connector of an optical cable assembly. The jumper cable assembly is disposed within the connector portion. The jumper cable assembly includes a plurality of jumper optical fibers, a jumper ferrule coupled to a first end of the plurality of jumper optical fibers, and an optical turn assembly coupled to a second end of the plurality of jumper optical fibers. The optical turn assembly is operable to optically turn optical signals propagating within the optical turn assembly. 1. An optical coupling assembly comprising: a frame portion defining an integrated circuit opening operable to receive an integrated circuit assembly; and', 'at least one connector portion extending from the frame portion, wherein the at least one connector portion comprises a channel operable to receive an optical connector of an optical cable assembly; and, 'an optical coupling carrier frame comprising a plurality of jumper optical fibers having a first end and a second end;', 'a jumper ferrule coupled to the first end of the plurality of jumper optical fibers; and', 'an optical turn assembly coupled to the second end of the plurality of jumper optical fibers, wherein the optical turn assembly is operable to optically turn optical signals propagating within the optical turn assembly from a first direction to a second direction., 'at least one jumper cable assembly disposed within the at least one connector portion, the at least one jumper cable assembly comprising2. The optical coupling assembly of claim 1 , wherein the at ...

THERMAL INTERFACE

A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings. 1. A thermal interface comprising: a base defining a plurality of cap openings;', 'a finger extending from the base; and', 'an extension extending from the base; and, 'a thermally conductive cap includinga gasket defining a plurality of gasket openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings.2. The thermal interface of claim 1 , further comprising a pad including a pliant thermal interface material.3. The thermal interface of claim 1 , further comprising an adhesive located between the gasket and the base of the cap.4. The thermal interface of claim 1 , wherein the gasket openings are smaller than the cap openings.5. The thermal interface of claim 1 , wherein the finger is a first finger and the cap includes a plurality of fingers claim 1 , including the first finger.6. The thermal interface of claim 1 , wherein the extension has a length greater than a length of the finger.7. The thermal interface of claim 1 , wherein the cap is configured to be positioned at an end face of a header of an optical subassembly claim 1 , and the finger and the extension are configured to be positioned at a side of the header.8. The thermal interface of claim 1 , wherein the cap includes copper.9. An optoelectronic module comprising:a shell including a seat;an optical subassembly including a header having a plurality of leads; [ a base defining a plurality of cap openings;', 'a finger extending from the base; and', 'an extension extending from the base; and ...

OPTICAL REPEATER AND OPTICAL CONNECTOR DEVICE

An optical repeater to be arranged between a substrate and an optical connector, the optical repeater includes: a body part including a plurality of optical paths to transmit an optical signal between the substrate and the optical connector, a substrate-side end-face in which one end of each of the optical paths opposes the substrate, and a connector connecting part to connect another end of each of the optical paths to the optical connector, the body part being configured from a material with a greater coefficient of linear expansion than that of the substrate; and a reinforcing member arranged so as to surround the optical paths in a side to the substrate-side end-face, the reinforcing member being configured from a material with a smaller coefficient of linear expansion than that of the body part. 1. An optical repeater to be arranged between a substrate and an optical connector , the optical repeater comprising:a body part including a plurality of optical paths to transmit an optical signal between the substrate and the optical connector, a substrate-side end-face in which one end of each of the optical paths opposes the substrate, and a connector connecting part to connect another end of each of the optical paths to the optical connector, the body part being configured from a material with a greater coefficient of linear expansion than that of the substrate; anda reinforcing member arranged so as to surround the optical paths in a side to the substrate-side end-face, the reinforcing member being configured from a material with a smaller coefficient of linear expansion than that of the body part.2. An optical repeater according to claim 1 , whereinthe substrate-side end-face is arranged with a plurality of end-faces of optical fibers configuring the optical paths, andthe reinforcing member is configured so as to surround a periphery of the plurality of the optical fibers.3. An optical repeater according to claim 2 , whereinthe reinforcing member is configured so ...

OPTICAL WIRING PART AND ELECTRONIC DEVICE

The object of the present invention is to provide an optical wiring part which can connect the optical waveguide and another optical element with high optical coupling efficiency while inhibiting the decrease of the transmission loss, and an electronic device with high reliability including the optical wiring part, the present invention provides an optical wiring part including a tape-shaped optical waveguide and a ferrule having a penetration hole which is formed from a base end to a tip end of the ferrule, and a part of the optical waveguide in a longitudinal direction is inserted into the penetration hole, wherein at least one main surface of two main surfaces of the optical waveguide is fixed to an inner wall of the penetration hole, and there is a clearance between the inner wall of the penetration hole and two side surfaces of the optical waveguide. 17-. (canceled)8. An optical wiring component , comprising:a ferrule having a base end, a tip end and a penetration hole penetrating from the base end to the tip end; andan optical waveguide having a tape shape and having a first main surface, a second main surface, a first side surface and a second side surface, the optical waveguide having a portion in a lengthwise direction configured to be inserted into the penetration hole, at least one of the first main surface and the second main surface being fixed to an inner wall of the penetration hole, the first side surface and the second side surface being separated from the inner wall of the penetration hole.9. The optical wiring component according to claim 8 , wherein the ferrule comprises a main body having a groove claim 8 , and a lid body configured to cover the groove claim 8 , the groove has an inner surface fixed to the first main surface of the optical waveguide claim 8 , and the lid body is fixed to the second main surface of the optical waveguide.10. The optical wiring component according to claim 9 , wherein the lid body has at least one part disposed in ...

OPTICAL DEVICE, OPTICAL MODULATOR, AND METHOD FOR MANUFACTURING OPTICAL DEVICE

To provide an optical device which enables both (i) suppression of an increase in production cost and (ii) suppression of an increase in optical loss which increase is caused in accordance with a change in temperature of an external environment. 1. An optical device comprising:a substrate waveguide having an upper surface on which a first recess is provided;a holding member disposed on the upper surface of the substrate waveguide; andan optical fiber having a core, a part of the optical fiber being contained in the first recess so that the core faces a core of the substrate waveguide,the holding member and the optical fiber being bonded and fixed to each other via a first resin layer which is provided between a surface of the optical fiber and a holding surface which is a part of a lower surface of the holding member,the substrate waveguide and the holding member being bonded and fixed to each other via a second resin layer which (i) is provided between the upper surface of the substrate waveguide and a region of the lower surface of the holding member which region is outside the holding surface and (ii) has a coefficient of thermal expansion having a sign identical to that of a coefficient of thermal expansion of the first resin layer.2. The optical device as set forth in claim 1 , wherein a thickness of the first resin layer and a thickness of the second resin layer are each not less than 10 μm and not more than 30 μm.3. The optical device as set forth in claim 1 , wherein the first resin layer has a thickness substantially equal to that of the second resin layer.4. The optical device as set forth in claim 1 , wherein a material of the first resin layer is identical to that of the second resin layer.5. The optical device as set forth in claim 1 , wherein a material of the holding member has an ultraviolet transmitting property.6. The optical device as set forth in claim 1 , wherein the core of the substrate waveguide is contained in the core of the optical fiber ...

Symmetric Micro-Optic Module

A micro-optic module couples a pair of substrates to opposing sides of a fast-axis collimating lens and a beam twister. The arrangement of optical elements is oriented substantially parallel to a neutral plane defined by propagation paths of the light from each emitter of an array of laser emitters. The pair of substrates may have substantially the same coefficient of thermal expansion and coefficient of thermal conductivity, and the micro-optic module may be configured to exhibit symmetry of thermal loading about the neutral plane when the array of laser emitters emits light at an operational power level. The micro-optic module may be coupled with an array of laser emitters, for example a laser diode bar. The module exhibits thermal properties that facilitate a consistently focused light beam with minimal positional drift, which may enable efficient and reliable coupling of the light beam to optical fibers and other high-tolerance applications. 1. A laser diode module , comprising:an array of laser emitters configured to emit light; and a fast-axis collimating lens arranged to receive the light from each emitter of the array of laser emitters;', 'a beam twister arranged to receive the light propagated through the fast axis collimating lens and to rotate the light as the light propagates through the beam twister; and', 'a pair of substrates, coupled to opposing sides of the fast-axis collimating lens and the beam twister, and substantially parallel to a neutral plane defined by propagation paths of the light from each emitter of the array of laser emitters, the pair of substrates having substantially the same coefficient of thermal expansion (CTE) and coefficient of thermal conductivity;', 'the optic module configured to exhibit symmetry of thermal loading about the neutral plane when the array of laser emitters emit light at an operational power level., 'an optic module comprising2. The laser diode module of claim 1 , wherein the collimating lens and the beam ...

OPTICAL MODULE AND OPTICAL FIBER ASSEMBLY

An optical module includes a substrate on which an optical waveguide is formed, and an optical fiber assembly. The optical fiber assembly includes an optical fiber, a translucent member, and a mirror portion. The translucent member includes a joint surface joined to an end surface of the substrate at an end of the optical waveguide, and is attached to a distal end of the optical fiber. The mirror portion is formed on the translucent member, reflects light emitted from the distal end of the optical fiber in a direction different from a traveling direction of the light, and collects the reflected light into the end of the optical waveguide through the joint surface. 1. An optical module comprising:a substrate on which an optical waveguide is formed; and an optical fiber;', 'a translucent member including a joint surface joined to an end surface of the substrate at an end of the optical waveguide, the translucent member being attached to a distal end of the optical fiber; and', 'a mirror portion that reflects light emitted from the distal end of the optical fiber in a direction different from a traveling direction of the light, and collects the reflected light into the end of the optical waveguide through the joint surface, the mirror portion being formed on the translucent member., 'an optical fiber assembly including2. The optical module according to claim 1 , whereinthe direction different from the traveling direction of the light is a direction toward the end of the optical waveguide.3. The optical module according to claim 1 , whereinthe translucent member further includes an inclined surface inclined relative to the traveling direction of the light emitted from the distal end of the optical fiber,the mirror portion includes a projection formed on the inclined surface and formed of a material that is the same as a material of the translucent member, and a curved surface formed on the projection, andby using total reflection at the curved surface, the mirror ...

Photonic interposer with wafer bonded microlenses

A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.

THERMALLY INTERFACING CHIP ON GLASS ASSEMBLY

In one example embodiment, an optoelectronic assembly includes an electronic substrate, a transparent component coupled on a first side of the electronic substrate, and a first component coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure. A laser array or a receiver array may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component. 1. An optoelectronic assembly , comprising:a transparent component that extends between a first surface and an oppositely positioned second surface;a laser array coupled to the second surface of the transparent component, the laser array oriented to transmit optical signals through the transparent component;a receiver array coupled to the second surface of the transparent component, the receiver array oriented to receive optical signals through the transparent component;an electronic substrate mechanically coupled to the transparent component;a first component coupled to the electronic substrate opposite the transparent component, the first component defining a receptacle; anda second component positioned between the first component and the transparent component in the receptacle defined by the first component, a first surface of the second component coupled to the laser array and the receiver array by a thermal interface material, the thermal interface material being softer than the first component and the second component, and a second surface of ...

SPACE ACTIVE OPTICAL CABLE

A space active optical cable (SAOC) includes a cable including one or more optical fibers, and two or more electrical transceivers on opposing ends of the cable and interconnected by the cable. Each of the electrical transceivers includes an enclosure that encloses one or more light sources, one or more light detectors, and control electronics. Also included in the enclosure are a coupling medium to couple light into and out of the one or more optical fibers. The coupling medium can be reflecting surface or an on-axis mount. The enclosure provides a suitable heat propagation and electromagnetic interference (EMI) shielding, and the cable and the two or more electrical transceivers are radiation resistant. SAOC features optionally support a health check algorithm that allows trending optical performance in the absence of an optical connector and a potential surface treatment to increase nominally low emissivity of an EMI conductive surface. 1. A space active optical cable (SAOC) comprising:a cable comprising one or more optical fibers; and one or more light sources, one or more light detectors, and control electronics enclosed in the enclosure; and', 'a coupling medium configured to couple light into and out of the one or more optical fibers,, 'an enclosure enclosing, 'two or more electrical transceivers on opposing ends of the cable and interconnected by the cable, each of the electrical transceivers of the two or more electrical transceivers comprisingwherein:the enclosure provides a suitable heat propagation and electromagnetic interference (EMI) shielding, andthe cable and the two or more electrical transceivers are radiation resistant.2. The SAOC of claim 1 , wherein each of the electrical transceivers comprise space rated electrical interface configured to receive power and communicate signals including data claim 1 , command claim 1 , control claim 1 , and telemetry signals.3. The SAOC of claim 1 , wherein each light source of the one or more light sources is ...

OPTICAL FIBRE ALIGNMENT

Aligning an optical fibre with an optical device, component or package such as an optical transducer or sensor is disclosed, A housing for an optical device is provided having a tapered surface to receive a correspondingly tapered portion of a ferrule in which a fibre is mounted. The tapered surfaces, which may for example be frusta-conical or conical, enable the optical device and ferrule to be quickly and precisely aligned. An optical device may be provided in a cavity which may be sealed by the mating tapered surfaces. The optical device may also be provided on a mounting bracket with flexible supports connected to the housing to accommodate thermal expansion of the housing and maintain alignment. 1. A housing for an optical device , the housing having comprising:a tapered surface to be engaged with a correspondingly tapered portion of a ferrule in which a fibre is arranged to be mounted.2. The housing of claim 1 , wherein the housing further comprises a frusto-conical surface to be engaged with a correspondingly frusto-conical portion of a ferrule.3. The housing of claim 1 , wherein the housing further comprises a conical surface to be engaged with a correspondingly conical portion of a ferrule.4. The housing of claim 1 , further comprising a mounting bracket to support an optical device claim 1 , the mounting bracket comprising flexible supports connected to the housing.5. The housing of claim 4 , wherein the flexible supports isolate an optical device to be supported by the mounting bracket from thermal strain in the housing.6. The housing of claim 4 , wherein the mounting bracket further comprises stiffening beams arranged along the sides between the flexible supports.7. The housing of claim 1 , wherein the housing further comprises a cavity to accommodate an optical device and the ferrule is arranged to be secured to the housing sufficiently securely to generate a compressive pressure seal at the mating tapered surfaces of the housing and the ferrule to seal ...

SPACE ACTIVE OPTICAL CABLE

A space active optical cable (SAOC) includes a cable including one or more optical fibers, and two or more electrical transceivers on opposing ends of the cable and interconnected by the cable. Each of the electrical transceivers includes an enclosure that encloses one or more light sources, one or more light detectors, and control electronics. Also included in the enclosure are a coupling medium to couple light into and out of the one or more optical fibers. The coupling medium can be reflecting surface or an on-axis mount. The enclosure provides a suitable heat propagation and electromagnetic interference (EMI) shielding, and the cable and the two or more electrical transceivers are radiation resistant. SAOC features optionally support a health check algorithm that allows trending optical performance in the absence of an optical connector and a potential surface treatment to increase nominally low emissivity of an EMI conductive surface. 1. A method for providing a space active optical cable (SAOC) , the method comprising:providing a cable comprising one or more optical fibers, said cable having a first end;providing a first electrical transceiver for coupling to said first end of said cable;providing a first enclosure enclosing said first electrical transceiver and enclosing a light detector and a first reflecting surface configured to reflect a first incident light;processing said first enclosure to provide a predetermined heat propagation and electromagnetic interference (EMI) specification and to include radiation hard components; andproviding the cable and the first electrical transceiver to be radiation resistant.2. The method of claim 1 , further comprising:configuring the light detector to convert a reflected light into a transmit (TX) electrical signal, andconfiguring the first reflecting surface to generate the reflected light by reflecting the first incident light from the one or more optical fibers.3. The method of claim 1 , wherein said cable further ...

HETEROGENEOUS COMMON SUBSTRATE MULTI-CHIP PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT AND DIGITAL SIGNAL PROCESSOR

An optical transceiver package comprising a transceiver module, a digital signal processor (DSP), a substrate supporting the transceiver module and the DSP, and a barrier to mechanically protect and thermally insulate the transceiver module. The substrate comprises a material having a coefficient of thermal expansion (CTE) of 2.3-14 ppm/° C. and the barrier comprises a material having a CTE of 3.5-14 ppm/° C. 1. An optical transceiver package comprising:a transceiver module;a digital signal processor (DSP);a substrate supporting the transceiver module and the DSP; anda barrier to mechanically protect and thermally insulate the transceiver module,wherein the substrate comprises a material having a coefficient of thermal expansion (CTE) of 2.3-14 ppm/° C. and the barrier comprises a material having a CTE of 3.5-14 ppm/° C.2. The optical transceiver package of claim 1 , wherein the transceiver module includes a transceiver photonic integrated circuit (PIC) and an application specific integrated circuit (ASIC) that generates analog drive signals for the transceiver PIC.3. The optical transceiver package of claim 1 , further comprising a lid claim 1 , wherein:the barrier and the lid hermitically seal the transceiver module;the substrate comprises a low temperature co-fired ceramic having a CTE of 11-13 ppm/° C.;the barrier comprises stainless steel; andthe barrier is soldered to the substrate using a hard solder.4. The optical transceiver package of claim 1 , further comprising a lid claim 1 , wherein:the barrier and the lid hermitically seal the transceiver module;the substrate comprises a low temperature co-fired ceramic having a CTE of 4-7 ppm/° C.;the barrier comprises a material having a CTE of 3.5-7.5 ppm/° C.; andthe barrier is soldered to the substrate using a hard solder.5. The optical transceiver package of claim 1 , further comprising a lid claim 1 , wherein:the barrier and the lid hermitically seal the transceiver module;the substrate comprises a low ...

A photoelectric conversion module

본 발명은 광소자와 광도파로를 수평방향으로 정렬시켜 광 커플링 효율을 향상시키고, 이를 통해 광 손실을 감소시킬 수 있는 광전변환모듈을 제공하기 위한 것으로, 이를 위해 본 발명은 인쇄회로기판과, 상기 인쇄회로기판 상부에 실장되고, 내부에 일측부로부터 타측부로 관통되는 광도파로 어레이가 형성되며, 일측벽에 제1 및 제2 전극패드가 형성된 집적회로기판과, 상기 집적회로기판과 대향되는 일측벽에 상기 제1 및 제2 전극패드와 각각 접속되는 제1 및 제2 전극범프가 형성되고, 중앙부에 광소자가 설치된 광소자 어레이와, 상기 집적회로기판 상부에 실장된 반도체칩을 포함하는 광전변환모듈을 제공한다. The present invention is to provide a photoelectric conversion module that can align the optical element and the optical waveguide in the horizontal direction to improve the optical coupling efficiency, thereby reducing the optical loss, the present invention is a printed circuit board, An optical waveguide array mounted on the printed circuit board and penetrating from one side to the other, and having first and second electrode pads formed at one side of the printed circuit board, and facing the integrated circuit board; A photoelectric device including first and second electrode bumps formed on one side wall of the first and second electrode bumps respectively connected to the first and second electrode pads, an optical element array having an optical element in a central portion thereof, and a semiconductor chip mounted on the integrated circuit board; Provide a conversion module. 광소자, 광전변환, 광도파로, 전기회로소자, 광회로소자 Optical element, photoelectric conversion, optical waveguide, electric circuit element, optical circuit element

Optical module

The purpose of the present invention is to provide an optical module in which a change in the optical characteristics of a planar lightwave circuit (PLC) element in accordance with a temperature change is suppressed. The optical module is provided with: a base having the product of a predetermined linear coefficient of expansion and a Young's modulus; a planar lightwave circuit element mounted on the base; and a warping suppressing component which is mounted on a surface of the planar lightwave circuit element on the side opposite to the surface for mounting on the base, and which has the product of a linear coefficient of expansion and a Young's modulus for decreasing warping of the planar lightwave circuit element as a result of warping of the base in accordance with a temperature change.

Optoelectronic assembly and method of making the same

An optoelectronic assembly having an insulating substrate with a planar surface and a metal layer bonded to the planar surface such that selected regions of the substrate are exposed and a step is produced between the substrate and a top surface of the metal layer. An active optical device is mounted on the metal layer and a passive optical device is aligned with the active device using the step as a fiduciary for positioning the former. The metal layer provides an electrical path to the active device. The thickness of the metal layer is selected such that the heat generated by the active device is dissipated, the substrate does not interfere with the propagation of light along the first optical axis, and such that the in-plane coefficient of thermal expansion (CTE) of the metal layer is constrained by the substrate. The optoelectronic assembly is also suitable for mounting active devices provided with submounts or without.

Ferrule product, method of making the same, and optical module

A ferrule product 30b is utilized in an optical module comprising a semiconductor optical amplifier 55 having a pair of end facets. The ferrule product 30b comprises an optical fiber 51 and a ferrule 52. The optical fiber 51 has one end part, optically coupled with one of the pair of end facets, a first part including a grating 511 disposed at a predetermined position separated from one end part, and a second part different from the first part. The ferrule 52 has a capillary part 521 for holding the optical fiber 51 and a flange pant 522 for holding the capillary part. The flange part 522 is disposed on the second part.

Planar lightwave circuit

In an integrated optical receiver or transmitter, both the displacement of an optical axis caused by thermal changes and the property degradation of an optical functional circuit are inhibited. A planar lightwave circuit having a substrate and a waveguide-type optical functional circuit formed thereon composed of a material different from that of the substrate, and includes a waveguide region formed only of an optical wavelength that is in contact with a side forming an emission-end face of the optical waveguide for propagating the light emitted from the optical functional circuit or an incident-end face of an optical waveguide for propagating the light incident on the optical functional circuit. The planar lightwave circuit is fixed to a fixing mount only at the bottom of the substrate where the waveguide region is formed.

Optical transceiver

Connecting mid-board optical modules

A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipater, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.

Fiber-coupled optical device

Optical module

Optical component attachment to optoelectronic packages

An optical connection module attaches an active or passive optical component to a substrate and aligns the optical component with a first laser. The optical connection module includes a fiber submount that is attached to the substrate and that includes a thermally insulating material having a thickness greater than 20 micrometers. The optical component is soldered to the fiber submount using heat from a second laser. A laser submount is attached to the substrate. The first laser is attached to the laser submount. A fiber bonding pad is located between the thermally insulating material and the optical component. The thermally insulating material and the fiber bonding pad promote lateral heat transfer and limit vertical heat transfer to the substrate during soldering. The thermally insulating material can be integrally formed in the substrate by flame hydrolysis or by anodic bonding.

Apparatus for wavelength-division multiplexing and demultiplexing

The present invention relates to an apparatus for wavelength-division multiplexing and demultiplexing, to an optical communication module, and to an optical device. The apparatus for wavelength-division multiplexing and demultiplexing comprises: a first lens block having a lens array at one side thereof; a second lens block having a lens surface corresponding to the lens array and combined with the other side of the first lens block; a receptacle having an optical fiber ferrule fixed at the center thereof and stacked on the second lens block; and a base combined with one side of the first lens block, wherein the first block is stacked on the base.

Optical waveguide package and light emitting device

The present invention comprises: a substrate having a first surface and a second surface positioned opposite to the first surface; a clad having a third surface that is positioned on the second surface and that faces the second surface, a fourth surface positioned opposite to the third surface, and an element mounting region opened to the fourth surface; a core that is positioned inside the clad and that extends from the element mounting region; and a first metal body that is positioned in the element mounting region in a plan view to the fourth surface and that includes an element mounting part. The first metal body is configured to be connected to a second metal body via a first via conductor penetrating from the first surface to the second surface of the substrate.

Ferrule product, method of making the same, and optical module

A ferrule product 30 b is utilized in an optical module 5 comprising a semiconductor optical amplifier 55 having a pair of end facets. The ferrule product 30 b comprises an optical fiber 51 and a ferrule 52 . The optical fiber 51 has one end part, optically coupled with one of the pair of end facets, a first part including a grating 511 disposed at a predetermined position separated from one end part, and a second part different from the first part. The ferrule 52 has a capillary part 521 for holding the optical fiber 51 and a flange part 522 for holding the capillary part. The flange part 522 is disposed on the second part.

Optoelectronic assembly for signal conversion

Aspects of the present disclosure include an optoelectronic assembly with a housing that defines a cavity and includes a first component and a glass component disposed on an opposite side of the cavity from the first component. The glass component may include a first surface and a second surface and a lens located on the first surface. An optical transmitter and/or an optical receiver may be mechanically coupled to the first component within the cavity and oriented to emit optical signals through the glass component and the lens. Conductive traces may be located on the second surface of the glass component and electrically coupled to the optical transmitter and/or the optical receiver. An electronic component may be coupled to at least one of the conductive traces.

Optical carrier

A method of making an optical device on a carrier plate involves defining on one side of the carrier plate electrical contacts and through-holes for guide pins by a photolithographic process. The components are then mounted on the contacts and the guide pins of are mounted through the through-holes, using the through-holes as guides.

A diamond optical component for an optical tool

A component for an optical probe, the component comprising: a tubular body defining an internal channel and an opening; a mounting ring which is mounted within the internal channel and configured to define an aperture aligned with the opening; and a window disposed across the aperture and bonded to the mounting ring around the aperture, wherein the window is diamond, wherein the mounting ring comprises a material having a coefficient of linear thermal expansion a of 14 x 10 -6 K -1 or less at 20°C and a thermal conductivity of 60 Wm -1 K -1 or more at 20°C, and wherein the tubular body is made of a chemically inert material.

Coupled optical and optoelectronic devices, and method of making the same

An optical-optoelectronic coupling structure comprising a flip-chip optoelectronic/ultrathin silicon-on-sapphire device mounted on a V-groove, optical-fiber-bearing carrier substrate, including light-reflective structures for launching light into the optical fiber core or transmitting light emitted by the optical fiber core to the optoelectronic device. The optical fiber may be immobilized in the V-groove using a curable resin adhesive characterized by a refractive index substantially similar to the refractive index of the optical fiber.

Multi-Channel Laser Pump Source for Optical Amplifiers

An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

High thermal conductivity region for optoelectronic devices

This document describes techniques and apparatuses that implement a high thermal conductivity region for optoelectronic devices. In some embodiments, a printed circuit board (PCB) includes a high thermal conductivity region that extends through the PCB. The high thermal conductivity region has first and second surfaces that are approximately coplanar with exterior layers of the PCB. A side-emitting optoelectronic device is mounted to the first surface of the high thermal conductivity region via conductive material that enables conduction of the device's heat into the high thermal conductivity region. The high thermal conductivity region can then transfer the heat away from the device and toward the second surface of the high thermal conductivity region, thereby improving the device's thermal performance.

Bonding chip on glass assembly

Chip packaging structure and optical computing device

本申请实施例提供一种芯片封装结构以及光计算设备。其中，结构包括：封装基板、光子芯片以及用于为所述光子芯片提供光信号的光源组件；所述光源组件和所述光子芯片分别设置于所述封装基板之上；所述光源组件与所述光子芯片之间设置有用于抵抗所述封装基板弯曲形变的抵抗部。本申请实施例中，通过抵抗部可降低封装基板的弯曲形变，从而可减少从光源组件到光子芯片的光路的偏移量，以保证光耦合效率。

Laser system with passive compensation coupling

光学的または光電子的モジュール１において、光学屈折率が温度とともに低下する中間媒質４、１０が、レーザダイオード９と光ファイバ５との間の光路７内に導入される。これは、ダイオード９と光ファイバ５との間の伝送を改善することによって、動作温度の上昇によるレーザ放射のパワー損失を、受動的手段によって補償する。中間媒質４、１０は、好ましくは、ダイオード９および光ファイバ５の端部を包封するカプセル１０の形で付着される。 これは、受動的手段によって、動作温度に左右されない伝送パワーを達成する。

Laser module

本发明提供一种半导体激光模块（1），其具有配置有半导体激光芯片（32）的激光器安装座（31）、配置有光纤（2）的光纤安装座（40）、配置有激光安装座（31）和光纤安装座（40）两方的基座（20）、配置有基座（20）的基板（10），在基座（10）上表面上形成有凸部（11a～11d），基座（20）通过伸展在基座（20）与基板（10）之间的软焊料（61）而接合在基板（10）上。

Packaging for a fiber-coupled optical device

An optical device assembly comprises a substrate with a component and fiber groove thereon. A segment of optical fiber is engaged with the fiber groove, which positions the fiber segment for optical coupling with a component on the substrate. A fiber retainer maintains the fiber segment in engagement with the groove. The fiber retainer may be secured to the substrate with adhesive means. Recessed regions formed on the substrate/retainer are filled with adhesive means, forming retaining members. Alternatively, the fiber retainer comprises a resilient member engaged with the device substrate and biased so as to urge the fiber segment into the groove. The resilient member may be variously configured and/or adapted for enhancing engagement of the fiber segment with the fiber groove. Either embodiment may include a housing, which may be variously configured and/or adapted for engaging a mating fiber-optic connector, providing fiber pigtail(s), mechanical splicing, and so forth.

Adaptable optical subassembly module for different optical fiber connection interfaces

A modular TOSA that is compatible with multiple optical fiber connector standards and a method of making the TOSA are presented. With the invention, a modular TOSA can be made compatible with different connector standards by switching the nose assembly while keeping the port assembly design and the adapter assembly design constant. The nose assembly that is compatible with the desired connector standard is selected from a group of nose assemblies, which are designed to be coupled with the same port assembly but having different connector standards.

Interfacing chip on glass assembly

In one example embodiment, an optoelectronic assembly (200) includes an electronic substrate (208), a transparent component (202) coupled on a first side of the electronic substrate, and a first component (210) which may be formed of or may include nickel plated copper coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure (244). A laser array (232) or a receiver array (236) may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component (214) may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component.

Hermetically sealed optical subassembly

An optical subassembly includes a high speed ceramic substrate having cavity containing an array of photodetectors, and a glass or silicon window for covering the cavity and forming a hermetic seal. A retainer is attached to the window for direct or indirect attachment to a fiber. The hermetic seal protects the device from moisture and other environmental conditions. The window has an index of refraction higher than air that effectively increases the optical pathlength sufficient while maintaining an acceptable coupling efficiency between the optoelectronic device and a fiber. This provides increased spacing within which to place and interconnect components within the cavity on the substrate. In alternate embodiments, the window is decoupled from direct contact with the retainer via a metal frame or ring. Decoupling the window from direct contact with the retainer helps prevent cracking of the window due to mismatches in the coefficients of thermal expansion between the window and the retainer.

Optoelectronic device packaging assemblies and methods of making the same

Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.

Optical connector with ferrule interference fit

An optical connector having a front and back orientation and suitable for operating with a temperature range, the connector comprising: (a) a ferrule comprising a first material having a first coefficient of thermal expansion (COE), and having no greater than a first diameter below a transition temperature with the temperature range, and no less than a second diameter above the transition temperature, the ferrule also comprising an endface, and containing at least one fiber having a fiber end presented at the endface; (b) a spring disposed behind the ferrule and in contact with the ferrule to apply a forward urging force to the ferrule; and (c) a housing comprising a second material having a second COE, the housing defining a bore hole having a diameter greater than the second diameter, and an interface portion having a restricted bore hole having no greater than a third diameter below the transition temperature, and no less than a fourth diameter above the transition temperature; wherein the connector is configured in one of two ways, in a first configuration, the second COE is greater than the first COE, and in the second configuration, the second COE is less than the first COE; wherein, in the first configuration, the first diameter is greater than the third diameter and the second diameter is less than the fourth diameter; and wherein, in the second configuration, the first diameter is less than the third diameter, and the second diameter is greater than the fourth diameter.

Optical module

光モジュールの構造を、パッケージに加わる応力を緩和する構造とする。平面光波回路（３０）の導波路（３７）の端面に、光素子を収容した複数のパッケージ（４０）が、導波路と光素子とが光学的に結合するように接合された光モジュールにおいて、平面光波回路および複数のパッケージを収容する筐体（３）であって、底部に形成された突出部（２７０）の上面に平面光波回路（３０）を固定する筐体（３）を備え、複数のパッケージ（４０）と筐体（３）に配置された電気部品（２２）とは、パッケージごとにフレキシブルプリント基板（２７１ａ，２７１ｂ）を介して電気的に接続されている。 The structure of the optical module is a structure that relaxes the stress applied to the package. In the optical module in which a plurality of packages (40) containing optical elements are joined to the end face of the waveguide (37) of the planar lightwave circuit (30) so that the waveguide and the optical element are optically coupled. A housing (3) for accommodating a planar lightwave circuit and a plurality of packages, the housing (3) for fixing the planar lightwave circuit (30) on the upper surface of the protrusion (270) formed on the bottom, The package (40) and the electrical component (22) arranged in the housing (3) are electrically connected to each package via flexible printed boards (271a, 271b).

Optical module

An optical module has a structure for reducing the stress applied to a package. The optical module is structured so that an end face of a waveguide ( 37 ) of a planar lightwave circuit ( 30 ) is joined to a plurality of packages ( 40 ) storing therein optical elements so that the waveguide is optically coupled to the optical elements. The optical module includes a housing ( 3 ) storing therein a planar lightwave circuit and a plurality of packages in which an upper face of a protrusion ( 270 ) formed in the bottom section is fixed to the planar lightwave circuit ( 30 ). Each of the plurality of packages ( 40 ) is electrically connected to an electric part ( 22 ) provided in the housing ( 3 ) via flexible printed circuits ( 271 a , 271 b ).

Method for connecting an optical component to optical-electronic modules

FIELD: electronics, optics. SUBSTANCE: optical connection module for connecting an optical component to substrate contains substrate; auxiliary support, connected to aforementioned substrate, containing heat-isolating material; optical component, adjusted relatively to the first laser and soldered to aforementioned auxiliary support with usage of heat from the second laser; contact area, located between aforementioned heat-isolating material and aforementioned optical component; laser auxiliary support, connected to aforementioned substrate; and a first laser, connected to aforementioned laser auxiliary support. Optical component is an optical fiber, while aforementioned optical connection module is a module for connecting the first laser to the optical fiber. Aforementioned contact area and aforementioned heat-isolating material ensure local transfer of heat during soldering for even melting of solder alloy and for limiting transfer of heat into aforementioned substrate. Aforementioned optical component is picked from a group which includes optical fiber, mirrors, lenses, detectors, micro-electro-mechanical devices and isolators. Method for manufacturing an integration optical connection module includes creating a substrate, applying a pattern and etching first zone of aforementioned substrate, creating a heat-isolating material in aforementioned first zone of aforementioned substrate, polishing aforementioned heat-isolating material and aforementioned substrate for creation of a flat surface, including a part of substrate and the heat-isolating part, connection of contact area, including at least one metallic layer, to aforementioned heat-isolating part, positioning of first laser on aforementioned part of substrate and adjustment and connection of optical component to aforementioned contact area. Aforementioned optical component is connected to aforementioned contact area with usage of solder alloy, which is heated using the second laser. EFFECT: increased ...

Connecting mid-board optical modules

A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipator, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.

Optical component and method of manufacturing the same

An optical component is provided for optical communication and has a smaller size and a shorter height. The optical component involves a concave package provided by layering ceramic substrates, a groove section formed at a bottom face of this package, an optical semiconductor element provided in this groove section, a cover provided to cover an opening section of the package and a lens formed at the cover.

Mounting structure for optical subassembly

A mounting structure is disclosed for mounting optical devices in optical alignment with optical systems. A mounting comb includes a base and a plurality of spaced apart fingers extending from the base perpendicular to and opposite a mounting surface. The mounting surface of the mounting comb is fixedly attached to the surface of a substrate with the fingers extending outwardly from the substrate. A receiving comb includes a base with a mounting surface and a plurality of spaced apart fingers extending from the base perpendicular to and opposite the mounting surface. The optoelectronic device is fixedly mounted on the mounting surface of the receiving comb. The fingers of the receiving comb and the mounting comb are fixed in an interdigitated orientation by a layer of adhesive so that an I/O light port of the optoelectronic device is optically aligned with an I/O light port of the optical system.

Flexible backlight illuminates carrier

一种包括导光板(110)、沿导光板(110)的边缘(116)设置的多个光源(114)以及多个光源(114)被紧固到的柔性载体(132)的显示器。柔性载体(132)包括多个挠曲件(150)，多个挠曲件中的每个挠曲件被设置在多个光源中的相应的一对相邻光源(114)之间，以允许一对相邻光源之间的间距改变。

Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection

A hermetically sealed, opto-electronic array housing assembly having a ceramic base, electrical connectors, a metal can, and a glass window. The glass window can support a micro-lens array. The metal can receives the glass window. The electrical impedance of the electrical connectors is beneficially carefully controlled to enable high-speed data communications. A multi-element optical fiber connector can provide for optical communications to and/or from an opto-electronic array contained within the housing.

Optical device

Optical path displacement compensation-based transmission optical power stabilization assembly

An optical path displacement compensation-based transmission optical power stabilization assembly comprises: a laser (1), a lens (2), and an optical fiber coupling port (4) disposed on a first substrate (6) and a second substrate (5) according to a preset arrangement scheme, wherein an expansion coefficient of the second substrate (5) is greater than an expansion coefficient of the first substrate (6). The preset arrangement scheme enables initial distances between the laser (1) and the lens (2), between the lens (2) and the optical fiber coupling port (4), and/or between the laser (1) and the optical fiber coupling port (4) to differ from an optimal coupling distance of an optimal coupling point by a preset value, thereby ensuring that a coupling loss on an optical path changes along with the temperature to achieve a complementary effect with respect to an optical power-temperature curve of the laser, and reducing temperature-caused fluctuation of the transmission optical power of an optical assembly.

Optical module

本発明の目的は、マルチチップ集積デバイスを実装した光モジュールであっても、光ファイバとの接続を考慮して小型化を図った光モジュールを提供することである。光モジュール１１０は、光機能部材１１２の両端部に平面光波回路（ＰＬＣ）１１３ａ、ｂが接続され一体化されたマルチチップ集積デバイスが、パッケージ１１１に収容されてなる。前記ＰＬＣの各々には、折返し導波路１３１ａ、ｂが形成され、それを介して、前記光機能部材に形成された光導波路と光ファイバ１１４ａ、ｂとが接続される。また、前記ＰＬＣの各々には、前記光ファイバを接続するための接続部品１２０ａ、ｂと前記光機能部材とが同一の面で接続され、前記光ファイバが、前記パッケージの対向する面からそれぞれ取り出される。 An object of the present invention is to provide an optical module that is miniaturized in consideration of connection with an optical fiber even if it is an optical module on which a multichip integrated device is mounted. The optical module 110 includes a multi-chip integrated device in which a planar lightwave circuit (PLC) 113 a and 113 b is connected to both ends of an optical functional member 112 and is integrated in a package 111. Folded waveguides 131a and 131b are formed in each of the PLCs, and the optical waveguides formed in the optical functional member and the optical fibers 114a and 114b are connected through the folded waveguides 131a and 131b. Further, each of the PLCs is connected to the optical component with connecting parts 120a and 120b for connecting the optical fiber on the same surface, and the optical fiber is taken out from the opposing surface of the package. It is.

Photonic integrated circuit connectors with temperature-independent mechanical alignment

광학 조립체는 광 도파관으로부터의 광을 수광하도록 구성되고 적어도 4개의 페룰 정렬 특징부들을 포함하는 광 페룰; 및 광 페룰을 내부에 고정하고 광 페룰을 광학 구성요소에 대해 정렬시키도록 구성되는 크래들을 포함하고, 크래들은 적어도 4개의 대응하는 접촉 영역들에서 일대일 대응으로 적어도 4개의 페룰 정렬 특징부들과 접촉 또는 근접촉하도록 구성된 적어도 4개의 크래들 정렬 특징부들을 포함하여, 크래들 및 광 페룰 중 적어도 하나의 온도가 충분히 변함에 따라, 광 페룰과 크래들의 대응하는 정렬 특징부들이 서로에 대해 활주하여 광 페룰과 크래들의 대응하는 정렬 특징부들이 이동하게 하여 대응하는 횡단된 영역들을 한정하도록 하여서, 연장될 때, 적어도 4개의 페룰 정렬 특징부들 및 적어도 4개의 크래들 정렬 특징부들의 횡단된 영역들이 동일한 제1 지점의 20 미크론 내에서 이동하도록 한다.

Optical waveguide package and light-emitting device

An optical waveguide package includes a substrate, and an optical waveguide layer on an upper surface of the substrate. The optical waveguide layer includes a cladding and a core in the cladding. The cladding has at least one first recess having a bottom surface and a first inner wall surface surrounding the bottom surface. The first inner wall surface of the at least one first recess is inclined and has an upper side outward from a lower side.

Optical fiber support structure and semiconductor laser module

An optical fiber support structure includes: a first portion configured to support an optical fiber including a core wire and a covering surrounding the core wire, the core wire including a core and a cladding; a second portion attached to the first portion; and a relaxing portion that is connected to an end portion of the core wire and that is positioned between the first portion and the second portion, the relaxing portion having a light receiving surface configured to receive light input from a space, an area of the light receiving surface being larger than an area of the end portion of the core wire.

Heat dissipation type single/double fiber pluggable optical module, assembly method thereof and external clamping fastener

本发明涉及一种散热型单/双纤可插拔光模块及其组立方法、外夹扣件，光模块包括:壳盖、模块电路板、底座、外夹扣件;模块电路板的侧边夹设固定于壳盖与底座之间以在模块电路板的上下方形成两个热对流通道，利用壳盖内的导热凸台与具有特定结构的外夹扣件，导热凸台热耦合芯片致热体，外夹扣件导热地贴附壳盖，导热地扣接底座，建立导热凸台经由外夹扣件至底座的热传导路径，是围绕两热对流通道的坏式路径，提高单/双纤可插拔光模块产品的气冷式散热效能，适用于高速通信的资料传输。

Optical module

An optical module has a package, a first fixing portion, a second fixing portion, and two attachment portions. The package has an optical fiber passing through a sidewall thereof. The first fixing portion fixes the optical fiber to the sidewall of the package directly or indirectly through an intermediate member. The second fixing portion fixes the optical fiber inside of the package. The two attachment portions are arranged respectively at two opposing corners of the package or at two sides of the package around the corners. A distance between the first fixing portion and the second fixing portion is less than 6 mm.

New and improved variable dual-directional thermal compensator for arrayed waveguide grating (awg) modules

A thermal compensator, for use in connection with arrayed waveguide grating (AWG) modules which are, in turn, utilized in conjunction with wavelength multiplexing and de-multiplexing within optical networks, is disclosed. The thermal compensator comprises a bow-shaped frame member, a central bar member, and a screw. The bow-shaped frame member is characterized by a higher or great coefficient of thermal expansion (CTE) than that of the central bar member such that the bow-shaped frame member can expand and elongate at a greater rate than can the central bar member under hot temperature conditions, however, under cold temperature conditions, the rate of contraction of the bow-shaped member is effectively retarded by the slower rate of contraction of the central bar member. The bow-shaped frame member is adapted to be attached to a movable section of an athermal arrayed waveguide grating (AAWG) module such that the expansion and contraction movements of the bow-shaped member influence the movement of a movable section of the athermal arrayed waveguide grating (AAWG) module in order to maintain the proper focus of the athermal arrayed waveguide grating (AAWG) module across disparate temperature conditions within which the athermal arrayed waveguide grating (AAWG) module is designed to operate.

Demountable dry connection for flexible circuits to circuit boards

Substrates are connected by demountable coupling by connecting an electronic module to a substrate. An electronic module and a substrate carrying electrical and/or optical circuits are provided. A connector electrical circuit is connected between the substrate and the electronic module. The connector electrical circuit is electrically demountable dry connected to the electronic module.

Fibre laser device

Provided is a fibre laser device capable of avoiding problems caused by heat accumulation in a fibre which occurs due to shortening of the fibre to achieve device miniaturisation. This fibre laser device (10) uses a short fibre (19) having a highly concentrated active element added thereto. Ferrules (31, 32) are inserted into the end portions of the fibre (19). The fiber laser device is provided with a housing (30) that accommodates the fibre (19), where the fibre is supported by the ferrules (31, 32). The housing (30) and the ferrules (31, 32) are made of a metal material which has a thermal expansion coefficient similar to that of the material of fibre (19).

Optical carrier

Ein Verfahren zum Herstellen einer optischen Vorrichtung auf einer Trägerplatte umfaßt das Definieren von elektrischen Kontakten und Durchgangslöchern für Führungsstifte auf einer Seite der Trägerplatte durch einen photolithographischen Prozeß. Die Komponenten werden dann auf den Kontakten angebracht und die Führungsstifte werden durch die Durchgangslöcher angeordnet, wobei die Durchgangslöcher als Führungen verwendet werden. One method of manufacturing an optical device on a carrier plate includes defining electrical contacts and through holes for guide pins on one side of the carrier plate by a photolithographic process. The components are then mounted on the contacts and the guide pins are placed through the through holes, using the through holes as guides.

Heat dissipation type single/double fiber pluggable optical module, assembly method thereof and external clamping fastener

本发明涉及一种散热型单/双纤可插拔光模块及其组立方法、外夹扣件，光模块包括:壳盖、模块电路板、底座、外夹扣件;模块电路板的侧边夹设固定于壳盖与底座之间以在模块电路板的上下方形成两个热对流通道，利用壳盖内的导热凸台与具有特定结构的外夹扣件，导热凸台热耦合芯片致热体，外夹扣件导热地贴附壳盖，导热地扣接底座，建立导热凸台经由外夹扣件至底座的热传导路径，是围绕两热对流通道的坏式路径，提高单/双纤可插拔光模块产品的气冷式散热效能，适用于高速通信的资料传输。

Hermetically sealed package container for optical module

In order to minimize thermal deformation of a package caused by joining, brazing or soldering process between different materials, exterior environments or on/off operation of an optical module, the present invention provides a hermetically sealed package container for optical module, comprising; a heat-dissipating bottom plate which an optical-semiconductor element including laser diode element, photodiode element and printed circuit board, and an electronic cooling element installed directly under the optical-semiconductor element for cooling the optical-semiconductor element are installed, wherein the bottom plate is made from tungsten-copper composite material and dissipates heat from the optical-semiconductor element and/or the electronic cooling element outside of the bottom surface of the package; a heat-dissipating frame perpendicular to the bottom plate for constituting the package wherein the frame is made from tungsten-copper composite material to form a one-body with the bottom plate and dissipates heat from the optical-semiconductor element and/or the electronic cooling element outside of the side surface of the package; a ceramic part for insulating the frame and/or the bottom plate from a lead frame incoming from outside for actuating the optical-semiconductor element; a pipe installed in the frame for transmitting/receiving optical signals from outside.