02-03-2017 дата публикации
Номер: US20170062061A1
A semiconductor memory device according to an embodiment comprises: a memory cell array, the memory cell array including a memory block, the memory block including a memory cell, the memory cell including a semiconductor layer, a conductive layer, and a charge accumulation layer, the charge accumulation layer being disposed between the semiconductor layer and the conductive layer; and a control circuit that executes an access operation on the memory cell, the control circuit, triggered by the access operation, detecting a leak current of the conductive layer, and when the leak current is a certain value or more, executing a faulty memory block processing that registers as an access-prohibited region the memory block including the conductive layer. 1. A semiconductor memory device , comprising:a memory cell array, the memory cell array including a memory block, the memory block including a memory cell, the memory cell including a semiconductor layer, a conductive layer, and a charge accumulation layer, the charge accumulation layer being disposed between the semiconductor layer and the conductive layer; anda control circuit that executes an access operation on the memory cell,the control circuit, triggered by the access operation, detecting a leak current of the conductive layer, and when the leak current is a certain value or more, executing a faulty memory block processing that registers as an access-prohibited region the memory block including the conductive layer, andexecuting the faulty memory block processing based on the number of times of executions of the access operation.2. The semiconductor memory device according to claim 1 , whereinthe access operation is a read operation, a write operation, or an erase operation on the memory cell.3. (canceled)4. The semiconductor memory device according to claim 2 , whereinthe control circuit confirms a fail bit number of data read from the memory cell during the read operation, and when the fail bit number is a ...
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