25-07-2013 дата публикации
Номер: US20130187262A1
Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like. 1. A device , comprising:an electronic device having at least one hot spot, anda composite thermal capacitor disposed in thermal communication with the hot spot of the electronic device, wherein the composite thermal capacitor includes a phase change material, wherein the heat from the hot spot is stored by the phase change material.2. The device of claim 1 , wherein the phase change material is selected from the group consisting of: solid-to-solid claim 1 , a solid-to-liquid claim 1 , a solid-to-gas claim 1 , and a liquid-to-gas claim 1 , phase change material.3. The device of claim 1 , wherein the composite thermal capacitor includes the phase change material imbedded into a matrix of a high thermal conductivity material.4. The device of claim 3 , wherein the high thermal conductivity material is selected from the group consisting of: copper claim 3 , silver claim 3 , gold claim 3 , aluminum claim 3 , graphitzed carbon claim 3 , silicon claim 3 , carbon nanotubes claim 3 , diamond claim 3 , graphene claim 3 , and a combination thereof.5. The device of claim 3 , wherein the ratio of the phase change material to the high thermal conductivity material is about 1:100 to 1:1.6. The device of claim 1 , wherein the electronic device is selected from the group consisting of: a two-dimensional semiconductor chip stack claim 1 , a three-dimensional semiconductor chip stack claim 1 , a multi-core semiconductor chip claim 1 , a memory device claim 1 , Application Specific Integrated Circuits (ASICs) claim 1 , System-on-a-Chip (SoC) claim 1 , a microelectronic chip claim 1 , a optoelectronic chip claim 1 , a hybrid optoelectronic/microelectronic chip claim 1 , a memory device claim 1 , analog or radio frequency (RF) micro devices ...
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