Способ изготовления узла волноводнораспределительной системы сложной конфигурации

Изобретение может быть использовано при изготовлении объемных конструкций из тонкостенных деталей, а именно узлов волноводно-распределительной системы в устройствах радиоэлектронной аппаратуры, путем пайки погружением в расплав солей. На одной из соединяемых деталей выполняют лепестки, а на другой – пазы. Фиксируют детали путем установки лепестков в пазы и их разворота. Припой формируют в виде ленты-фольги с последующим ее отжигом и травлением, после чего выполняют перфорацию, соразмерную размерам лепестков. Проводят травление паяемых деталей. Укладку ленты-фольги выполняют на торцевые поверхности деталей, выполненных с лепестками, с последующим ее загибом на боковые поверхности деталей. После пайки проводят промывку узла с целью удаления остатков флюса и окончательную отмывку в ультразвуковой установке. Технический результат заключается в сокращении локальных механических напряжений в местах паек лепестков при перепаде температур и вибрационных воздействиях, а также в обеспечении стабильного ...

СПОСОБ КОМПОНОВКИ ДИФФЕРЕНЦИАЛЬНОЙ ПАРЫ ДЛЯ ЦЕПЕЙ С МОДАЛЬНЫМ РЕЗЕРВИРОВАНИЕМ НА ОСНОВЕ ЗЕРКАЛЬНО-СИММЕТРИЧНОЙ ПОЛОСКОВОЙ СТРУКТУРЫ

Изобретение относится к конструированию печатных плат, конкретно к способам их компоновки. Техническим результатом является ослабление помехового сигнала в дифференциальном и синфазном режимах воздействия помехи. Такой технический результат обеспечивается посредством компоновки полосковой структуры с резервированием и образованием пятипроводной связанной линии передачи, состоящей из опорных, резервных и резервируемых проводников, а также диэлектрической среды, при этом активные проводники резервируемой дифференциальной пары расположены друг под другом через диэлектрическую подложку, опорные проводники расположены по середине структуры на втором и третьем проводящих слоях, а резервная дифференциальная пара, состоящая из двух пассивных проводников, расположена зеркально-симметрично относительно опорных проводников. 5 ил.

N-Port-Speiseeinrichtung

Wellenleitereinrichtung, umfassend: ein entlang einer ersten Achse ausgerichtetes und zum Leiten eines ersten Signals mit ersten und zweiten Polaritäten konfiguriertes erstes Wellenleiterglied mit Querschnittsdimensionen, die entlang der ersten Achse von einem ersten distalen Ende zu einem zweiten proximalen Ende davon abnehmen; ein entlang der ersten Achse ausgerichtetes und zum Leiten eines zweiten Signals mit mindestens einer Polarität konfiguriertes zweites Wellenleiterglied, das mit dem ersten Wellenleiterglied durch eine erste Koppelapertur kommuniziert, wobei das zweite Wellenleiterglied Querschnittsdimensionen hat, die entlang der ersten Achse von einem ersten distalen Ende zu einem zweiten proximalen Ende davon abnehmen, wobei das zweite proximale Ende des zweiten Wellenleitergliedes an das zweite proximale Ende des ersten Wellenleitergliedes angrenzt; dritte und vierte Wellenleiterglieder in Kommunikation mit einem Inneren des ersten Wellenleitergliedes, wobei das erste Signal ...

Systems, circuits and methods related to low-loss bypass of a radio-frequency filter or diplexer

Coupled line and method of producing the same

Improvements relating to the manufacture of waveguides and slow wave structures

... A process for accurately forming waveguide or slow wave structures comprises forming apertures approximately to the required size in metallic diaphragms and then electrolytically removing metal to increase them accurately to size. Fig. 1 shows electrolytic removal of Cu from iris diaphragms of a waveguide assembly 1 using a Cu electrode 4 and an electrolyte 3 of H3PO4. An iris hole diameter may be increased by 2/10,000 in. in 8 secs. for a current density of 1 amp./sq. cm. The electrode 4, carried by a rod 5 insulated at 6, may be raised and lowered from iris to iris stepwise or continuously and may be of a length to extend over the distance of two irises Fig. 2 (not shown). The rate of electrode movement may be automatically controlled, e.g. by a cam preset according to the amount of metal to be removed. Alternatively, the rate of movement may be constant and the current varied. Electrolyte may be pumped at high velocity between the electrode and waveguide. The electrode ...

Microwave component having tailored operating characteristics and method of tailoring

Low firing temperature dielectric materials designed to be co-fired with high bismuth garnet ferrites for miniaturized isolators and circulators

Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example, bismuth vanadate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.

Package structures including discrete antennas assembled on a device

Improvements relating to a method and apparatus for the production of electric high frequency conductors of the recurrent type

... 434,560. Conductors. SIEMENS - SCHUCKERTWERKE AKT. - GES., Siemensstadt, Berlin. July 17, 1934, No. 20919. Convention date, July 17, 1933. [Class 36] High-frequency conductors of the recurrent type, i.e. having a regular cross-sectioned form entirely filled by a number of individual conductors stranded together and each individual conductor following a cyclic path of displacement in the cross section of the composite conductor so that the individual conductors return to their original positions, or the labyrinth type, i.e. in which while the individual conductors return at definite intervals in the direction of stranding to their original positions, the total cross section of the conductor is split up into a number of groups, have the direction of rotation of the recurrent or labyrinth stranding reversed at regular intervals in the stranding operation. In the manufacture of such conductors the individual conductors are drawn from a stranding basket and led to the stranding nipple ; guide ...

Electrical method of and apparatus for producing variable time delay

... 847,609. Electromagnetic delay lines. GENERAL RADIO CO. Nov. 19, 1956 [June 18, 1956], No. 35328/56. Class 40(8). [Also in Group XXV] In order to obtain constant time lag over a wide band of frequencies, portions of the turns of a delay line of the distributed-parameter type are skewed at an angle to the winding axis. Thus, the upper portions of the successive turns of the coil 5, of Fig. 8 lie in planes parallel to the plane P 2 whose normal N makes an angle # with the winding axis 0. It is stated that # should lie between 45 and 65 degrees. The particular configuration shown may be obtained by winding the coil about an insulating former 1 and a block 3, Fig. 5, which is subsequently removed. The upstanding portions of the turns are then bent over by means of a slider or a roller. Automatic winding methods are alternatively used (see Group XXV). The former 1 carries longitudinal conductive strips 13 which are joined to each other at an end. The strips are insulated from the winding by ...

PROCEDURE AND DEVICE FOR ADDING AT LEAST TWO CONSTRUCTION UNITS

VERFAHREN ZUR GEWINNUNG VON FESTEM CYANURCHLORID

ABLATIVES PROCEDURE FOR THE PRODUCTION OF CERAMIC(S) BLOCK FILTERS

DIRECTIONAL STRIPLINE STRUCTURE AND MANUFACTURE

Electrochemically fabricated hermetically sealed microstructures

CORRUGATED MICROWAVE HORNS

MICROWAVE CIRCULATOR WITH DEFORMABLE MEMBRANE

A circulator comprises a housing (10) in two halves (12, 11) with a ferrite (18) and associated magnet (16) in a central portion of a first one of the halves (12), the second housing-half (11) above the ferrite having a membrane (32) which is deformable by operation of an adjusting means (33) upon the membrane, so as to adjust the size of an airgap (26) between the membrane and the ferrite. The membrane is preferably the residual portion of the second housing-half following a milling operation to provide a recess (31 ), the recess accommodating the adjusting means in the form of, e.g., a screw. To further enhance predictability of the performance characteristics of the circulator, the ferrite is seated in a hollow (36) formed in the first housing- half and the securing of the ferrite to the first housing-half is by way of an adhesive applied between a lateral face (37) of the ferrite and a corresponding lateral face of the hollow.

METHOD OF FABRICATING AN RF SUBSTRATE WITH SELECTED ELECTRICAL PROPERTIES

Method for fabricating a textured dielectric substrate (400) for an RF circuit.The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate pattern (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206,208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

SYSTEMS AND METHODS FOR INJECTION MOLDED PHASE SHIFTER

Systems and methods for an injection molded phase shifter are provided. In at least one embodiment, a method for fabricating a phase shifter comprises fabricating a ferrite element with first and second ends, wherein electromagnetic energy propagating through the ferrite element propagates between the first the second end; placing the ferrite element within a waveguide mold; and injecting a liquefied dielectric into the mold, wherein the liquefied dielectric hardens to form first and second solid dielectric layers that abut against out-of-plane surfaces of the ferrite element. The method further comprises exposing in-plane surfaces of the ferrite element, wherein the in-plane surfaces extend longitudinally between the first and the second end and are orthogonal to the out-of-plane surfaces that extend longitudinally between the first and the second end; masking surfaces through which electromagnetic energy is emitted into and transmitted from the phase shifter; and plating the exposed surfaces ...

COMPLEX CIRCUIT BOARD, NONRECIPROCAL CIRCUIT DEVICE, RESONATOR, FILTER, DUPLEXER, COMMUNICATIONS DEVICE, CIRCUIT MODULE, COMPLEX CIRCUITBOARD MANUFACTURING METHOD, AND NONRECIPROCAL CIRCUIT DEVICE MANUFACTURING METHOD

In a complex circuit board, the positional relationships between element portions, including an electrode pattern, a dielectric substrate and a magnetic substrate, can be adjusted as desired, and the complex circuit board can be miniaturized. The complex circuit board includes a dielectric substrate and a magnetic substrate, a space being provided between the magnetic substrate and the dielectric substrate, and an electrode pattern provided between the dielectric substrate and the magnetic substrate, a capacitance element portion of the electrode pattern being provided adjacent or in contact with or spaced a predetermined distance from the dielectric substrate, and the inductance element portion of the electrode pattern being provided adjacent or in contact with or spaced a predetermined distance from the magnetic substrate.

Sophisticated process of manufacture of complex elements ultra high frequencies by électroforming

PROCEDE DE FORMATION D'UNE ELECTRODE SUR UNE PIECE DE CERAMIQUE DIELECTRIQUE POUR DES APPLICATIONS EN HAUTE FREQUENCE

PROCEDE DE FORMATION D'UNE ELECTRODE SUR UNE PIECE DE CERAMIQUE DIELECTRIQUE POUR DES APPLICATIONS EN HAUTE FREQUENCE. LE PROCEDE CONSISTE ESSENTIELLEMENT A DEPOSER DES ELECTRODES DE CUIVRE 2, 3, 4 SUR LA PIECE DE CERAMIQUE DIELECTRIQUE 1 DE FORME CYLINDRIQUE PAR PLACAGE CHIMIQUE DE CUIVRE ET A TRAITER THERMIQUEMENT LADITE ELECTRODE DE CUIVRE A UNE TEMPERATURE ALLANT DE 300C A 900C DANS UN ENVIRONNEMENT DE GAZ INERTE. AUCUNE ELECTRODE N'EST FORMEE SUR L'AUTRE SURFACE D'EXTREMITE 5 DE LA PIECE DE CERAMIQUE 1. L'ELECTRODE FORMEE PEUT ETRE UTILISEE DANS UN DISPOSITIF A HAUTE FREQUENCE, TEL QU'UN RESONATEUR DIELECTRIQUE, UNE PLAQUE DE CIRCUITS A HAUTE FREQUENCE OU UN CIRCUIT INTEGRE POUR HYPERFREQUENCE.

ELECTROMAGNETIC SHIELDING DEVICE FOR PROTECTING A MICROWAVE LINK BETWEEN A CONNECTOR ELEMENT AND A MICROWAVE

PROCESS OF SELECTIVE ENGRAVING AND GUIDE Of WAVE OBTAINED BY THE AFOREMENTIONED PROCESS

ELECTROMAGNETIC SAFETY DEVICE READY TO PROTECT A CONNECTION ULTRA HIGH FREQUENCIES BETWEEN A CONNECTOR AND AN ELEMENT ULTRA HIGH FREQUENCIES

La présente invention concerne le domaine des circuits hyperfréquences large bande placés dans un boîtier. La présente invention concerne plus particulièrement un dispositif de protection électromagnétique 20 apte à protéger une liaison hyperfréquences 21 entre un connecteur hyperfréquences coaxial placé sur un boîtier et au moins un élément d'un circuit hyperfréquences contenu dans ledit boîtier caractérisé en ce qu'il est formé d'une pièce rapportée réalisée en matériau élastique électriquement conducteur et en ce qu'il assure la continuité de masse entre la masse électrique du circuit hyperfréquences et la masse mécanique du boîtier.

Wideband coupler in thick-film technology and method of production

Coupleur à microrubans pour ondes hyperfréquences, large bande de longueur d'onde centrale g comportant sur un substrat une première et une seconde ligne conductrice (1, 2) chacune des lignes étant dans une zone dite de couplage composée de deux tronçons d'extrémités a1 , a2 pour la première b1 , b2 pour la seconde les extrémités a1 et b1 étant situées longitudinalement sensiblement dans le prolongement l'une de l'autre de même que les extrémité a2 et b2 , transversalement à une distance électrique égale à un quart de la longueur d'onde centrale, les extrémités a1 , a2 - b1 , b2 étant de part et d'autre d'une couche de matériau diélectrique (3), caractérisé en ce que les extrémités a1 , a2 - b1 , b2 de chacune des deux lignes (1, 2) sont liées entre elles par deux doigts (5, 6) conducteurs situés de part et d'autre de la couche de diélectrique (3) chacun des doigts (5, 6) ayant un bord avant (11, 12) et un bord arrière, les quatre bords étant parallèles entre eux situés perpendiculairement ...

SINGLE-PACKAGE PHASED ARRAY MODULE WITH INTERLEAVED SUB-ARRAYS

Switching network circuitry, semiconductor die, and method for fabricating device with bypass architecture

Complex circuit board nonreciprocal circuit device resonator filter duplexer communications device circuit module complex circuit board manufacturing method and nonreciprocal circuit device manufacturing method

MINIATURIZED AND RECONFIGURABLE CPW SQUARE-RING SLOT ANTENNA INCLUDING FERROELECTRIC BST VARACTORS

A coplanar waveguide (CPW) square-ring slot antenna for use in wireless communication systems is miniaturized and reconfigurable by the integration of ferroelectric (FE) BST (barium strontium titanate) thin film varactors therein. The slot antenna device includes a sapphire substrate, top and bottom metal layers, and a thin ferroelectric BST film layer, where the FE BST varactors are integrated at the back edge of the antenna on the top metal layer.

Method of manufacturing a body moulded from a plastics material and covered with a metallic layer

A method of manufacturing a moulded body, such as an aerial, of a plastic material covered with a metallic layer according to which an intermediate layer for facilitating removal from the mould has been previously formed on the surface of the mould. The metallic layer is deposited in the mould before the plastic material is introduced. The mould (3 and 4) is metallic, and the intermediate layer is formed by passivation of the metal. A metallic coating layer (15) is then deposited in the mould by an electrolytic method and the plastic material (50) is introduced into the mould thus prepared. Finally, after hardening of the plastic material removal from the mould is effected by applying a thermal treatment.

Method of manufacturing an electro-optical switch

A method of manufacturing an electro-optical switch in which a metal layer is deposited on a substrate of ferroelectric material and etched to expose the substrate in the form of two channels disposed parallel over a given length. A second layer is then deposited upon the metal layer and the channels, with the diffusion into the substrate of the second layer forming two zones having optical refractive indices greater than that of the substrate. The assembly is then heated and a biasing voltage applied to create remnant electrical polarizations in opposite senses. After removal of the bias voltage, the assembly is cooled and the metal layer removed.

Adjustable integrated circuit antenna structure

An adjustable integrated circuit antenna structure includes a plurality of antenna elements, a coupling circuit, a ground plane, and a transmission line circuit. The coupling circuit is operable to couple at least one of the plurality of antenna elements into an antenna based on an antenna structure characteristic signal, wherein the antenna has at least one of an effective length, a bandwidth, an impedance, a quality factor, and a frequency band in accordance with the antenna characteristic signal. The ground plane is proximal to the plurality of antenna elements. The transmission line circuit is coupled to provide an outbound radio frequency (RF) signal to the antenna and receive an inbound RF signal from the antenna.

System and method for producing a spatial force

An improved field emission system and method is provided that involves field emission structures having electric or magnetic field sources. The magnitudes, polarities, and positions of the magnetic or electric field sources are configured to have desirable correlation properties, which may be in accordance with a code. The correlation properties correspond to a desired spatial force function where spatial forces between field emission structures correspond to relative alignment, separation distance, and the spatial force function.

Dielectric waveguide line comprising a polytetrafluoroethylene molded article and method of manufacture

The present invention provides a dielectric waveguide having excellent transmission efficiency. The dielectric waveguide includes a polytetrafluoroethylene molded article that has a permittivity of 2.05 or higher at 2.45 GHz or 12 GHz, a loss tangent of 1.20×10−4 or lower at 2.45 GHz or 12 GHz, and a hardness of 95 or higher.

Приспособление для сборки волноводно-коаксиального перехода

Полезная модель может быть использована для сборки волноводно-коаксиального перехода. На основании смонтированы кронштейны, закрепленные фиксаторами. Три ролика установлены с возможностью вращения и укладки между ними кабеля волновода с формированием его наружного контура. Первый кронштейн имеет площадку для закрепления на ней первого фланца волновода. Второй кронштейн имеет скошенную под углом площадку и горизонтальную площадку, на которых закреплены первый и второй ролики. Первый ролик зафиксирован, а второй ролик установлен с возможностью его перемещения в горизонтальном направлении и закрепления фиксатором. Верхняя поверхность третьего кронштейна образует площадку, на которой закреплен третий ролик с возможностью его перемещения в горизонтальном направлении и закрепления фиксатором. На площадке четвертого кронштейна установлена планка для закрепления на ней второго фланца волновода. Приспособление обеспечивает надежную фиксацию волноводно-коаксиального перехода при заделке в него изогнутого кабеля. 4 з.п. ф-лы, 7 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 202 385 U1 (51) МПК H01P 11/00 (2006.01) B23K 37/04 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 37/04 (2020.08); H01P 11/00 (2020.08) (21)(22) Заявка: 2020130486, 15.09.2020 (24) Дата начала отсчета срока действия патента: Дата регистрации: Приоритет(ы): (22) Дата подачи заявки: 15.09.2020 (45) Опубликовано: 15.02.2021 Бюл. № 5 (56) Список документов, цитированных в отчете о поиске: RU 195039 U1, 14.01.2020. RU 182629 U1, 27.08.2018. RU 146558 U1, 10.10.2014. RU 150250 U1, 10.02.2015. KR 1020070066154 A1, 27.06.2007. 2 0 2 3 8 5 R U (54) Приспособление для сборки волноводно-коаксиального перехода (57) Реферат: Полезная модель может быть использована перемещения в горизонтальном направлении и для сборки волноводно-коаксиального перехода. закрепления фиксатором. Верхняя поверхность На основании смонтированы кронштейны, третьего кронштейна ...

СПОСОБ ПАЙКИ ВОЛНОВОДНЫХ ТРАКТОВ

Nichtreziprokes Schaltungselement

Mikrowellen-Radar-Sender und-Empfänger auf einem einzelnen Substrat mit Flip-Chip integrierten Schaltkreisen

Verfahren zur Herstellung von magnetischem keramischem Material zur Mikrowellenanwendung.

Ultraschallschleifsystem für keramisches Filter und Verfahren zum Abgleich dafür

Dielectrically loaded antenna and circuit board feed transmission line assembly

An antenna, or a method of making an antenna, comprises: an insulating substrate 12 with an axial passage 12B extending there through and a three dimensional antenna element formed on the surfaces of the substrate 12. An end region 12P of the substrate includes recesses 18 on opposite sides of the axial passage 12B and a feed board structure 16 is arranged to extend through the passage. The feed board transmission line structure 16 includes an end region which extends perpendicular to the axis of the substrate 12 and beyond the perimeter of the passage 12B and is arranged to be located within the said recesses 18 in the end region 12P of the substrate 12. The recesses 18 may be plated with a conductive material and tapered towards the same width as the thickness of the edges 16PE of the feed circuit board 16 such that the said board can be securely located and connected within the recesses using a solder reflow technique. The depth dG of the recesses 18 may be varied to adjust the length ...

Non-reciprocal circuit element and method thereof

A non-reciprocal circuit element (1), such as circulators and isolators, magnetic layer (2) and a plurality of center electrodes (3a to 3c) arranged therein to intersect with each other in a state being electrically insulated from each other. The element can be formed from a plurality of unfired magnetic green sheets (fig. 2, not shown) with patterned electrode films in the form of printed paste thereon. The sheets are then collectively fired forming cavities in the regions of the paste which can then be filled with molten metal to form the electrodes. Another method of forming the element is to adhere a plurality of fired magnetic plate on which an electrode has been formed on a single surface. ...

High-frequency non-reciprocal circuit element

Non-reciprocal circuit element and method for producing same

On a permanent magnet (5)-side surface of a dielectric component (3) is formed a cavity (3C) having: a bottom surface (3C1) that extends in a direction along one main surface (3A); and a side surface (3C2) that extends in a thickness direction crossing the bottom surface (3C1). At least a portion of the permanent magnet (5) is disposed in the cavity (3C). The surface of the at least a portion of the permanent magnet (5), that is, the portion disposed in the cavity (3C), is fixed to both the bottom surface (3C1) and the side surface (3C2) by means of an adhesive (13).

Improvements in or relating to microwave devices

The invention relates to a microwave reflecting, refracting or guiding device such as a waveguide, or an aerial reflector or lens, consisting of a supporting member of light weight insulating material such as fibreglass and adherent thereto a layer formed of metal flakes or filings in cured resinous material in which the flakes or filings are suspended before curing. A method of making the device consists of mixing the flakes or filings which may be copper, brass, iron or steel in a curable resinous material in fluid form such as epoxy resin and/or polyester resin, applying the mixture to a former of predetermined shape to form a layer thereon, curing the resinous material and, before completion of the curing, laying insulating backing material on to the exposed surface of the layer of the mixture to provide a mechanically supporting backing, the completed device then being separated from the former. The surface of the metal/resin layer remote from the insulating material may be provided ...

Making planar optical waveguide with polishing steps

A uniform planar optical waveguide is made by (a) depositing a lower cladding layer 402 on a substrate 400 and polishing the deposited surface; (b) depositing a core layer on the resultant structure of the step (a) and polishing the deposited surface; (c) patterning the core layer whose surface is polished in the step (b), to generate an optical waveguide; and (d) depositing an upper cladding layer on the optical waveguide formed through the patterning of the step (c). In the case of an arrayed waveguide demultiplexer (AWG DEMUX), the phase difference at each channel matches the intended value, thereby decreasing crosstalk.

DEVICE FOR INDICATING A HORIZONTAL OR INCLINATION THERETO AND ONE OR MORE ANGULAR DEVIATIONS THEREFROM

Improvements in waveguide components and methods for the manufacture thereof

... 733,359. Making articles by electrodeposition. ELLIOTT BROS. (LONDON), Ltd. May 22, 1953 [May 22, 1952], No. 13047/52. Class 41. [Also in Group XL (b)] A wave-guide component is made by forming in the surface of a block of metal open channels or recesses each of which requires to be closed by one or more additional walls to constitute a passage for use as a wave-guide, filling each channel with a core element which has previously been, or is subsequently shaped accurately on its exposed surface, depositing a layer of copper or other suitable metal electrolytically on the exposed surfaces of the block and core, and subsequently removing the core from the passages thus produced. In one example a block 2 of brass or copper (Fig. 2) is formed with grooves 3; 4 and 5, which are filled with wax or low-melting metal or alloy, the exposed surfaces of which are then accurately finished to lie in the same planes as the contiguous faces of the block 2. These faces together with the surfaces of the ...

FERRITE INSERT FABRICATION

MICROWAVE HORNS

... 1479256 Making microwave horns; jointing ANDREW CORP 15 Sept 1975 [16 Sept 1974] 37902/75 Headings B3A and B3V [Also in Division H4] A corrugated microwave horn comprises a conductive metal sheet 12 enclosing a plurality of spaced annular metal plates 11 with integral tabs 15 projecting through slots 13 in the sheet and secured therein by locking members 16. The sheet 12 is gradually rolled around the plates and secured thereto by flat strips or wires 16 inserted in sequence. Plates 11 may be brass and wires 16 bronze. The outside of the horn may be coated with solder paste and the horn then heated so that the solder melts and fills the slots, bonding the wires sheet and plates together electrically. Lengths of tube may be fastened together end-to-end by tabs 18 on the end of the sheet having slots 19 engaging with similar slotted tabs 18 Fig. 4, 5 (not shown) on the end of another tube. The microwave horn in Figs. 1-5 is preferably but not necessarily frusto-conical.

Low firing temperature dielectric materials designed to be co-fired with high bismuth garnet ferrites for miniaturized isolators and circulators

Improvements in or relating to the manufacture of waveguides, resonant cavities and other metal articles of precise dimensioning

... 928,938. Making waveguides by electroforming. MARCONI'S WIRELESS TELEGRAPH CO. Ltd. April 11, 1962 [June 14, 1961], No. 21468/61. Class 41. A waveguide is made by electro-forming using as a mould an alloy of low melting point pre-coated with a thin insulating layer e.g. of plastic over-coated with a conductive layer of a metal e.g. silver. As low melting alloys Woods metal and similar alloys of bismuth may be used. In the Figure a mould 1 of low melting alloy is pressure die-cast to precise dimensions, and is then coated with a thin layer of a plastic 2 over-coated with silver 3 applied by spraying or dipping. A forming plate of copper 4 is then deposited electrolytically to the required thickness. The alloy 1 is removed by melting out, and the plastic layer by treating with a solvent, leaving a waveguide of precision dimensions.

ZIRKULATOR

Procedure for the lining of tubular transverse electromagnetic waves with a thin dielectric layer

METHODS OF AND APPARATUS FOR ELECTROCHEMICALLY FABRICATING STRUCTURES VIA INTERLACED LAYERS OR VIA SELECTIVE ETCHING AND FILLING OF VOIDS

N port feed device

Microwave circulator with deformable membrane

DIRECTIONAL STRIPLINE STRUCTURE AND MANUFACTURE

Microwave packaging technique for integration of microwave f ilters and microwave cavity structures into microwave housin gs

On-chip broadband terahertz unidirectional transmitter combining gradual-change metasurface and sub-wavelength waveguide

Antenna and the method for manufacturing the same

An antenna according to an embodiment includes a structure, and an antenna pattern on the structure, wherein the antenna pattern includes a feeding structure and a radiator integrated with the feeding structure for radiating a signal provided from the feeding structure to an outside.

With interlaced sub-array of the single-package phased array module

Nonreciprocal circuit element to high frequency.

Improvements with the cores used in the manufacture of complex pipe fittings by electroforming

PROCEDE DE REALISATION D'UN CORPS MOULE EN MATIERE PLASTIQUE REVETU D'UNE COUCHE METALLIQUE, ET ANTENNE PLANE AINSI REALISEE

PROCEDE DE REALISATION D'UN CORPS MOULE EN MATIERE PLASTIQUE REVETU D'UNE COUCHE METALLIQUE, SELON LEQUEL, UNE COUCHE INTERMEDIAIRE DESTINEE A FACILITER LE DEMOULAGE AYANT ETE PREALABLEMENT FORMEE A LA SURFACE DU MOULE, LA COUCHE METALLIQUE EST DEPOSEE DANS LE MOULE AVANT L'INTRODUCTION DE LA MATIERE PLASTIQUE, CARACTERISE EN CE QUE D'ABORD, LE MOULE 3 ET 4 EST METALLIQUE ET LA COUCHE INTERMEDIAIRE EST FORMEE PAR PASSIVATION DU METAL, EN CE QUE ENSUITE LA COUCHE METALLIQUE 15 DE REVETEMENT EST DEPOSEE PAR ELECTROLYSE ET LA MATIERE PLASTIQUE 50 INTRODUITE DANS LE MOULE AINSI PREPARE ET EN CE QUE, ENFIN, APRES DURCISSEMENT DE LA MATIERE PLASTIQUE, LE DEMOULAGE EST EFFECTUE EN PRATIQUANT UN TRAITEMENT THERMIQUE. UNE ANTENNE PLANE DU TYPE A LIGNES MICRORUBANS ASSOCIEES A UN SUPPORT DIELECTRIQUE CARACTERISE EN CE QUE LES PARTIES DESTINEES A FORMER LES CAVITES DES ELEMENTS RAYONNANTS OU CELLES DES LIGNES D'ALIMENTATION SONT REALISEES PAR CE PROCEDE. APPLICATION : ANTENNES HYPERFREQUENCES.

DISQUES DE GRENAT D'YTTRIUM-FER SUR DES SUBSTRATS DE GADOLINIUM-GALLIUM POUR DES APPLICATIONS DE MICRO-ONDES

Procédé de fabrication de grenats d'yttrium-fer et nouveaux produits ainsi obtenus. Ce procédé consiste à former un film épitaxial d'un grenat d'yttrium-fer, contenant 0,5 à 1,5 % en atome d'ions lanthane trivalents sur les emplacements de dodécaèdre, sur un substrat tel qu'un grenat 10 de gadolinium-gallium, à former une couche mince de SiO2 sur le film de grenat il d'yttrium-fer, à former une couche de masque photorésistant sur la couche de SiO2 , à retirer des parties de la couche de masque pour exposer des parties de la couche de SiO 2 sous-jacente, à retirer les parties de la couche de SiO2 pour exposer les parties de la couche sous-jacente du grenat d'yttium-fer et à retirer les parties exposées de la couche de grenat d'yttrium-fer afin de former des disques de La:YIG supportés sur le substrat de GGG. La présente invention est particulièrement utile pour fournir un procédé de fabrication de disques de grenat d'yttrium-fer à faible largeur de lignes, convenables pour des applications ...

MANUFACTORING PROCESS Of an ANTENNA AND/OR a NETWORK Of ANTENNAS, ANTENNEET/OU NETWORK Of ANTENNAS FACTORIES ACCORDING TO SUCH a PROCESS

La présente invention concerne un procédé de fabrication d'une antenne (404, 406, 408, 410) comprenant un fil, formé par un matériau conducteur, dont le parcours présente une forme en hélice. Conformément à l'invention, un tel procédé est caractérisé en ce qu'on forme une empreinte en relief sur un seul côté d'un élément (402) en matériau électriquement isolant de telle sorte qu'on génère la forme en hélice en déposant le matériau conducteur dans cette empreinte.

HYBRID COUPLER

Antenna substrate and method for manufacturing the same

Antenna module Antenna module and manufacturing method thereof

FIELD EMISSION SYSTEM AND METHOD

BROADBAND MICROSTRIP BALUN AND A MANUFACTURING METHOD THEREOF, PERFORMING UNBALANCED/BALANCED SIGNAL CONVERSION IN A WIDE FREQUENCY BAND

PURPOSE: A broadband microstrip balun and a manufacturing method thereof are provided to remove unnecessary parasitic component by connecting an unbalanced transmission line and a balanced transmission line through an opening. CONSTITUTION: A broadband microstrip balun includes a first strip line(101), a second strip line(301), and a common ground plane(200). The first strip line is formed on an upper substrate(100). An input port(102) is formed in one end of the first strip line. The second strip line is formed on a lower substrate(300). An output port(302) is formed in both end parts of the second strip line. A part of the second strip line is overlapped with the first strip line. The common ground surface is formed between the upper substrate and the lower substrate. The common ground surface has an opening. The opening is the overlapped part of the first strip line and the second strip line. © KIPO 2009 ...

BALANCE/UNBALANCE CONVERSION ELEMENT, AND METHOD FOR MANUFACTURING THE SAME

A balance/unbalance conversion element (1) is a filter formed by providing a ground electrode (15) and a plurality of major surface electrodes (13A, 13B, 14) on a planar dielectric substrate (10). The major surface electrodes (13A, 13B) are connected with the ground electrode (15) through side face electrodes (11A, 11B) for short circuit to constitute a quarter-wavelength resonance line. The major surface electrodes (14) is arranged between the major surface electrodes (13A, 13B) and constituting a half-wavelength resonance line by opening the opposite ends. A side face electrode (18) for regulating balance characteristics is provided on the side face of the dielectric substrate (10). Phase balance between two balance signals is set as desired by regulating the capacitance occurring between the side face electrode (18) for regulating balance characteristics and the major surface electrodes (14).

AN ANTENNA

The invention relates to an antenna for operation at a frequency in excess of 200MHz comprising: an insulative substrate having a central axis, an axial passage extending therethrough and an outer substrate surface which extends around the axis; a three- dimensional antenna element structure including at least one pair of axially coextensive elongate conductive antenna elements on or adjacent the outer substrate surface; and an axial feeder structure which extends through the passage and comprises an elongate laminate board wherein the laminate board proximal end portion includes lateral extensions projecting in opposite lateral directions, and wherein, adjacent the laminate board proximal end portion, the substrate has recesses on opposite sides of the axis which receive at least edge parts of the said lateral extensions of the laminate board proximal end portion.

ANTENNA USING A GROUND RADIATOR

The present invention relates to a circuit for a radiator, wherein the circuit uses a capacitive element and has a simple configuration. The present invention also relates to a feeder circuit suitable for the above-mentioned circuit. Thus, the present invention relates to an antenna using a ground radiator, wherein the antenna has a simple configuration and a small size, and can be manufactured through a simple manufacturing process at a significantly reduced cost.

Methods of and Apparatus for Forming Three-Dimensional Structures Integral with Semiconductor Based Circuitry

Enhanced Electrochemical fabrication processes are provided that can form three-dimensional multi-layer structures using semiconductor based circuitry as a substrate. Electrically functional portions of the structure are formed from structural material (e.g. nickel) that adheres to contact pads of the circuit. Aluminum contact pads and silicon structures are protected from copper diffusion damage by application of appropriate barrier layers. In some embodiments, nickel is applied to the aluminum contact pads via solder bump formation techniques using electroless nickel plating. In other embodiments, selective electroless copper plating or direct metallization is used to plate sacrificial material directly onto dielectric passivation layers. In still other embodiments, structural material deposition locations are shielded, then sacrificial material is deposited, the shielding is removed, and then structural material is deposited. In still other embodiments structural material is made to ...

Method for manufacturing a field emission structure

An improved method for manufacturing a field emission structure is provided that involves receiving magnets from a magnet supplying device and placing each one of the magnets at a corresponding location of a plurality of location of the field emission structure. The corresponding location and a corresponding orientation of each of the magnets relative to each other are defined in accordance with a code.

Trimming of embedded structures

The idea of the invention is to form a cavity in a multilayer substrate at the point of the structure to be trimmed. This enables the embedding of tolerance critical components inside substrates, such as printed circuit boards, modules, and sub-systems. Trimming is done through the cavity using, for example, a laser. After trimming the cavity is easy to fill in with a suitable dielectric material, or to cover otherwise, e.g. by using a lid, or to leave the cavity uncovered.

COMPLEX CIRCUIT BOARD, NONRECIPROCAL CIRCUIT DEVICE, RESONATOR, FILTER, DUPLEXER, COMMUNICATIONS DEVICE, CIRCUIT MODULE, COMPLEX CIRCUIT BOARD MANUFACTURING METHOD, AND NONRECIPROCAL CIRCUIT DEVICE MANUFACTURING METHOD

In a complex circuit board, the positional relationships between element portions, including an electrode pattern, a dielectric substrate and a magnetic substrate, can be adjusted as desired, and the complex circuit board can be miniaturized. The complex circuit board includes a dielectric substrate and a magnetic substrate, a space being provided between the magnetic substrate and the dielectric substrate, and an electrode pattern provided between the dielectric substrate and the magnetic substrate, a capacitance element portion of the electrode pattern being provided adjacent or in contact with or spaced a predetermined distance from the dielectric substrate, and the inductance element portion of the electrode pattern being provided adjacent or in contact with or spaced a predetermined distance from the magnetic substrate.

Composite microwave circuit module having a pseudo-waveguide structure

A composite microwave circuit module includes a multilayer dielectric substrate, upper- and lower-surface grounds, an antenna pattern, a plurality of shield via holes, and a large number of first holes. The upper- and lower-surface grounds are formed on upper and lower surfaces of the multilayer dielectric substrate, respectively, and the upper-surface ground has an opening portion for waveguide coupling. The antenna pattern is formed on an interlayer of the multilayer dielectric substrate by a high-frequency signal line in correspondence with the opening portion. The plurality of shield via holes are formed around the antenna pattern and filled with a filler material to form a pseudo waveguide structure. The first holes have cavities formed in the multilayer dielectric substrate in correspondence with the pseudo waveguide structure between the antenna pattern and the opening portion of the upper-surface substrate. A method of manufacturing this circuit module is also disclosed.

Process to manufacture microwave components using hard anodised aluminum

The invention relates to a process for reducing the dimension and dramatically reducing the manufacturing cost, and of increasing the reliability of microwave components such as antennae (2), power dividers, filters, directional couplers and other types of integrated line networks, by producing a surface layer with a high dielectric constant on an aluminum substrate by hard anodization in combination with flat conductor technology.

Non-Reciprocal Circuit Element and Method for Manufacturing the Same

In a non-reciprocal circuit element, a permanent magnet is connected to one main surface of a magnetic plate, and a circuit board is connected to the other main surface of the magnetic plate, with a solder bump lying between the circuit board and the other main surface. The permanent magnet can control the transmission of electrical signal from each of a plurality of signal conductors of circuit board to a corresponding one of a plurality of input/output terminals of the magnetic plate. The non-reciprocal circuit element further includes an underfill material arranged between the magnetic plate and the circuit board. The magnetic plate has a through hole formed therein, the through hole extending from one main surface to the other main surface. The through hole has an empty space in which at least a part of a conductive film arranged in the through hole is exposed.

COMPACT MULTI-COLUMN ANTENNA

Nonreciprocal circuit device and its manufacturing method

In a complex circuit board, the positional relationships between element portions (21, 22, 23), including an electrode pattern (20), a dielectric substrate (11) and a magnetic substrate (12), can be adjusted as desired, and the complex circuit board can be miniaturized. The complex circuit board includes a dielectric substrate (11) and a magnetic substrate (12), a space being provided between the magnetic substrate (12) and the dielectric substrate (11), and an electrode pattern (20) provided between the dielectric substrate (11) and the magnetic substrate (12), a capacitance element portion (21) of the electrode pattern (20) being provided adjacent or in contact with or spaced a predetermined distance from the dielectric substrate (11), and an inductance element portion (22) of the electrode pattern (20) being provided adjacent or in contact with or spaced a predetermined distance from the magnetic substrate (12).

FILM MEMBER AND STICKING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a film member which prevents wrinkles from occurring easily when the film member is stuck to a member having a curved surface, and to provide a film member sticking method for sticking the film member to the member having the curved surface. SOLUTION: The film member sticking method for sticking a planar film member to a member having a curved surface includes: a first process in which a region, where high stress occurs when the film member is stuck to the member having the curved surface compared to when the film member has a planar shape, is specified by analysis; a second process in which a slit is formed in the region of the film member where the high stress occurs; and a third process in which the film member in which the slit is formed is stuck to the member having the curved surface. COPYRIGHT: (C)2012,JPO&INPIT ...

УПРОЩЕНИЕ СЛОЖНЫХ ВОЛНОВОДНЫХ СХЕМ

Группа изобретений относится к области проектирования волноводных схем, предназначенных для использования в спутниковых системах. Техническим результатом является упрощение сложных волноводных схем и повышение гибкости их настройки. Группа изобретений включает в себя устройство для направления волноводных маршрутов, содержащее по меньшей мере два корпуса, уложенные слоями друг на друга и содержащие множество волноводных каналов, вводы, выводы, причем второй корпус выполнен с возможностью перенаправления указанного сигнала к заданному выводу указанного первого множества волноводных каналов в первом корпусе или указанного второго множества волноводных каналов во втором корпусе; способ изготовления указанного устройства и спутниковую систему, его содержащую. 3 н. и 13 з.п. ф-лы, 30 ил.

Способ изготовления уголкового изгиба на прямолинейном волноводе с любым углом поворота волновода от 0 до 180 градусов

Изобретение относится к радиотехнике СВЧ и может быть использовано при изготовлении элементов волноводного тракта. Технический результат заключается в снижении трудоёмкости изготовления, повышении выхода годных изделий. Способ изготовления уголкового изгиба прямоугольного волновода с произвольным углом поворота волновода заключается в вырезании в трёх стенках волновода в направлении, перпендикулярном оси волновода, сквозного паза Y-образной формы с углом, равным углу поворота волновода, и на сплошной стенке волновода - узких пазов, прилегающих к боковым стенкам волновода в плоскости изгиба, сгибании сплошной стенки волновода радиусом цилиндра, ось которого перпендикулярна плоскости изгиба, а центр радиуса изгиба находится на оси симметрии Y-образного паза, при этом сквозной Y-образный паз вырезают с углом, равным углу поворота волновода, с прорезью в основании обращённой к сплошной стенке волновода. 1 з.п. ф-лы, 1 табл., 4 ил.

HOHLLEITERKOPPLER UND VERFAHREN ZU DESSEN HERSTELLUNG

Integrated waveguide prodn. - uses insulation strips placed on conducting base, which are then plated with thin metal film

The integrated circuit wave guide is used in circuits operating above 1GHZ, i.e. in the band 30-40 GHz. The guides are constructed by placing insulation strips, i.e. high pressure polyethylene, on a conducting base and then plating these with a thin metal film or metal laminate. Where guides lie closely adjacent for coupling, the insulation can be softened and made to flow together before plating.

DIELEKTRISCHES FILTER UND PRODUKTIONSVERFAHREN DAFÜR

DIELEKTRISCHE LEITUNG UND HERSTELLUNGSVERFAHREN DAFÜR

Method of adjusting operating characteristics of microwave components

The electrical operating characteristics of a microwave circuit e.g. embedded in layer 12 are modified by providing a dielectric layer 30 and a conductive layer 32 over or adjacent the circuit in a pattern which modifies the electrical characteristics of an overlay responsive portion of the circuit in a manner which results in the overall circuit having a desired electrical operating characteristic within a tolerance. Adjustment of the operating characteristics may be done in an iterative manner of measuring the characteristics, modifying the distribution of conductive material and remeasuring the operating characteristics until satisfactory operating characteristics are obtained. Alternatively, the operating characteristics may be adjusted in an interactive manner in which the circuit is provided with power and appropriate signals and its operating characteristics are monitored during the process of selectively removing conductive material with the removal process being controlled in accordance ...

Method for removing conductive portions

Center electrode assembly, nonreciprocal circuit device, communication device, and method of producing the center electrode assembly

A center electrode assembly includes a substrate 10 made of ferrite, insulation layers made from insulation paste, and a plurality of center electrodes which intersect the insulation layers at predetermined angles. The center electrodes are formed by coating a photosensitive electroconductive paste material, exposing, and firing. The center electrode assembly may be used in an isolator or circulator.

Приспособление для сборки волноводного тракта под пайку

Предлагаемая полезная модель относится к технологическому оборудованию и может быть использована для сборки под пайку волноводных трактов. Приспособление для сборки волноводных трактов под пайку состоит из основания с закрепленной на нем стойкой. Для достижения возможности пайки волноводных трактов без ступенчатых стыков с регулировкой зазоров под пайку основание выполнено в виде металлической плиты, имеющей с внутренней стороны выборку со сквозными пазами, а с наружной стороны занижение, направляющие и выступы, имеющие форму отдельных элементов волноводного тракта. На основании установлены опоры, на которых закреплен шаблон, внутренняя поверхность шаблона повторяет форму наружного контура волноводного тракта, а стойка выполнена с отверстиями для установки прижимных элементов. С торцевых сторон основания установлены планки, перемещающие по направляющим упоры. Технический результат заключается в обеспечении возможности пайки волноводных трактов без ступенчатых стыков с регулировкой зазоров под пайку. 4 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 182 629 U1 (51) МПК H01P 11/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК H01P 11/00 (2018.05) (21)(22) Заявка: 2018122516, 19.06.2018 (24) Дата начала отсчета срока действия патента: Дата регистрации: Приоритет(ы): (22) Дата подачи заявки: 19.06.2018 (45) Опубликовано: 24.08.2018 Бюл. № 24 178435 U1, 04.04.2018. RU 2173474 C2, 10.09.2001. RU 2086369 C1, 10.08.1997. US 2004/ 0184705 A1, 23.09.2004. (54) Приспособление для сборки волноводного тракта под пайку (57) Реферат: Предлагаемая полезная модель относится к выступы, имеющие форму отдельных элементов технологическому оборудованию и может быть волноводного тракта. На основании установлены использована для сборки под пайку волноводных опоры, на которых закреплен шаблон, трактов. Приспособление для сборки внутренняя поверхность шаблона повторяет волноводных трактов под пайку состоит из форму наружного ...

Приспособление для фиксации волноводного тракта

Полезная модель относится к приспособлениям для фиксации волноводного тракта. Технической проблемой, решаемой предлагаемой полезной моделью, является создание простого по конструкции приспособления для фиксации волноводного тракта с обеспечением точности и надежности фиксации. Технический результат предлагаемой полезной модели заключается в упрощении конструкции приспособления для фиксации волноводного тракта. Для достижения указанного технического результата приспособление для фиксации волноводного тракта выполнено следующим образом. Приспособление для фиксации волноводного тракта содержит основание (1), с закрепленными на нем кронштейнами (3), (5), (7) с ребрами жесткости. На ребре жесткости (4) первого кронштейна (3) установлены с возможностью поворота подпорки (10), (11), на ребре жесткости (6) второго кронштейна (5), выполненном гребенчатым, закреплен упор (14), а на третьем кронштейне (7) установлен фигурный держатель (17), причем первый и второй кронштейны (3), (5), имеющие отверстия (20), (21) на ребрах жесткости (4), (6) закреплены по краям основания (1) напротив друг друга, а третий кронштейн (7) установлен между ними. 5 з.п. ф-лы, 3 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 192 773 U1 (51) МПК H01P 11/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК H01P 11/00 (2019.05) (21)(22) Заявка: 2019119463, 20.06.2019 (24) Дата начала отсчета срока действия патента: 30.09.2019 Приоритет(ы): (22) Дата подачи заявки: 20.06.2019 (45) Опубликовано: 30.09.2019 Бюл. № 28 1 9 2 7 7 3 R U (54) Приспособление для фиксации волноводного тракта (57) Реферат: Полезная модель относится к Приспособление для фиксации волноводного приспособлениям для фиксации волноводного тракта содержит основание (1), с закрепленными тракта. Технической проблемой, решаемой на нем кронштейнами (3), (5), (7) с ребрами предлагаемой полезной моделью, является жесткости. На ребре жесткости (4) первого создание простого по конструкции ...

Antenna Fabrication with Three-Dimensional Contoured Substrates

Disclosed herein is a method of fabricating an antenna in which a flexible stamp is formed from a first wafer, the first wafer transferring a pattern to the flexible stamp, in which an antenna substrate is shaped into a three-dimensional contour with a second mold, in which the flexible stamp is positioned in the second mold to deform the flexible stamp into the three-dimensional contour, and in which a metallic layer on the flexible stamp is cold welded to create a set of antenna traces on the antenna substrate in accordance with the pattern. The antenna traces may then be electroplated.

Embedded printed edge-balun antenna system and method of operation thereof

An antenna module having a side-edge balance-to-unbalance (BALUN). The antenna module may include a flexible substrate with one or more layers that may be configured to receive one first and second conductive patterns, the substrate may have opposed first and second ends which may define a longitudinal length and/or opposed side edges situated between the first and second ends. The first conductive pattern may form an antenna loop situated adjacent to the first end of the flexible substrate and be suitable for transmitting or receiving signals at one or more frequencies. The second conductive pattern may form at least part of the BALUN and may include one or more of a center portion, side portions which may extend from the center portion at opposite sides of the center portion, and electrically neutral slots situated between a corresponding side portion and the center portion.

Systems and methods for manufacturing passive waveguide components

Various embodiments are directed toward systems and method for manufacturing low cost passive waveguide components. For example, various embodiments relate to low cost manufacturing of passive waveguide components, including without limitation, waveguide filters, waveguide diplexers, waveguide multiplexers, waveguide bends, waveguide transitions, waveguide spacers, and an antenna adapter. Some embodiments comprise manufacturing a passive waveguide component by creating a non-conductive structure using a low cost fabrication technology, such as injection molding or three-dimensional (3D) printing, and then forming a conductive layer over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.

Systems and methods of waveguide assembly

Various embodiments provide for waveguide assemblies which may be utilized in wireless communication systems. Various embodiments may allow for waveguide assemblies to be assembled using tools and methodologies that are simpler than the conventional alternatives. Some embodiments provide for a waveguide assembly that comprises a straight tubular portion configured to be shortened, using simple techniques and tools, in order to fit into a waveguide assembly. For instance, for some embodiments, the waveguide assembly may be configured such that the straight portion can be shortened, at a cross section of the portion, using a basic cutting tool, such a hacksaw. In some embodiments, the straight portion may be further configured such that regardless of whether the straight tubular portion is shortened, the waveguide assembly remains capable of coupling to flanges, which facilitate coupling the straight tubular portion to connectable assemblies, such as other waveguide assemblies, radio equipment, or antennas.

Printed circuit board having micro strip line, printed circuit board having strip line and method of manufacturing thereof

A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.

Printed circuit board having micro strip line, printed circuit board having strip line and method of manufacturing thereof

A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.

PREPARING A SUBSTRATE FOR EMBEDDING WIRE

A portion of the surface of a substrate may be prepared for mounting an antenna wire such as by removing material to form a sequence of ditches (holes) separated by bridges (lands), and conforming to the pattern for the antenna, which is typically a flat squared spiral, having a number of turns. The antenna wire may be laid in the ditches and embedded in the bridges. Additional features, such as undermining or removing material from adjacent the bridges may facilitate displacement of substrate material at the bridges. The collapsed bridges form pinch points, securing the wire in the substrate. In some embodiments of the invention, relevant portions of the substrate are prepared for embedding antenna wire, without removing material. The substrate may be an inlay substrate or card body for a secure document. 1. A method of mounting a wire to a substrate for an electronic device comprising:preparing a selected area of the substrate with a sequence of ditches, separated by bridges, thereby removing material at some locations where an antenna wire will be scribed into the substrate; andscribing the antenna wire into ditches and embedding the antenna wire into the bridges.2. The method of claim 1 , wherein:the ditches coincide with a pattern for an antenna formed by the wire.3. The method of claim 2 , wherein:the pattern is a spiral pattern having a number of turns.4. The method of claim 1 , wherein:the ditches are elongated, being longer than they are wide.5. The method of claim 1 , wherein:the ditches are arranged generally end-to-end, but spaced apart from one another by the bridges.6. The method of claim 1 , wherein:{'b': '1', 'the ditches have a length (“L”);'}{'b': '2', 'the bridges have a length (“L”); and'}the ditches are longer than the bridges.7. The method of claim 6 , wherein:the ditches are at least twice as long as the bridges.8. The method of claim 6 , wherein:the ditches are approximately ten times long as the bridges.9. The method of claim 1 , wherein:the ...

Tamper-Proof RFID Label

Described are RFID structures and methods for forming RFID structures. An RFID structure includes an antenna assembly comprising a dipole antenna track and at least two contact pads, the dipole antenna track defining one or more gap regions that separate adjacent or adjoining segments of the dipole antenna track. The RFID structure also includes an antenna substrate supporting the antenna assembly, the antenna substrate including one or more perforations positioned in the one or more gap regions. 1. A RFID structure comprising:an antenna assembly comprising a dipole antenna track and at least two contact pads, the dipole antenna track defining one or more gap regions that separate adjacent or adjoining segments of the dipole antenna track; andan antenna substrate supporting the antenna assembly, the antenna substrate including one or more perforations positioned in the one or more gap regions.2. The RFID structure of claim 1 , wherein the one or more perforations comprise one or more cuts claim 1 , one or more holes claim 1 , one or more slits claim 1 , or any combination thereof.3. The RFID structure of claim 1 , wherein the dipole antenna track comprises at least two adjoining antenna segments that define lines having an angle less than 15 degrees claim 1 , at least one of the one or more gap regions positioned between the two adjoining antenna segments.4. The RFID structure of claim 3 , wherein the one or more gap regions separate the two adjoining antenna segments by between 0.16 mm and 1.0 mm.5. The RFID structure of claim 1 , wherein the antenna substrate comprises a carrier foil including polyethylene terephthalate (PET) claim 1 , polyethylene terephthalate glycol-modified (PET-G) claim 1 , polypropylene (PP) claim 1 , polyethylene (PE) claim 1 , polyimide (PI) claim 1 , polyvinyl chloride (PVC) claim 1 , acrylonitrile butadiene styrene (ABS) claim 1 , liquid crystal polymer (LCP) claim 1 , polybutylene terephthalate (PBT) claim 1 , polyethylene naphthalate ( ...

Common mode filter with multi spiral layer structure and method of manufacturing the same

A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.

Dual mode dielectric resonator loaded cavity filter

A dual mode dielectric resonator (DR) filter has a first DR, and is configured to operate at a HE12ε mode within a first frequency band while exhibiting a Q factor of no less than 5000. A first characteristic size of the first DR may be substantially similar to a size of a second DR, where the second DR is configured to operate in a conventional DR filter at a HE11δ mode within a second frequency band, the second frequency band being substantially lower than the first frequency band.

Systems and methods of embedding a radio transceiver into an energy storage device used in electronic equipment

Systems and methods relating to integration of circuitry including a transmitter or transceiver component into energy storage devices, such as battery packs for portable electronic equipment. Further embodiments also relate to providing a tuned miniature antenna and/or encapsulating such antenna inside the energy storage device.

ANTENNA BANDWIDTH-OPTIMIZED BY HYBRID STRUCTURE COMPRISING PLANAR AND LINEAR EMITTERS

The invention relates to a hybrid antenna structure that comprises at least one electrically insulating substrate, at least one electrically conductive coating that covers at least one surface of the substrate at least section-wise and serves as a planar antenna for reception of electromagnetic waves, as well as at least one coupling electrode electrically coupled to the conductive coating for coupling out of antenna signals from the planar antenna. It is essential here that the coupling electrode be electrically coupled to an unshielded, linear antenna conductor that serves as a linear antenna for reception of electromagnetic waves, with the antenna conductor situated outside an area that can be projected by orthogonal parallel projection onto the planar antenna serving as a projection area, by which means an antenna foot point of the linear antenna becomes a common antenna foot point of the linear and planar antenna. The invention further relates to a method for producing such a hybrid antenna structure. 1. A hybrid antenna structure , comprising:an electrically insulating substrate;an electrically conductive, transparent coating, which covers a surface of the substrate at least section-wise and serves at least partially as a planar antenna for reception of electromagnetic waves; anda coupling electrode, which is electrically coupled to the conductive coating for coupling out of antenna signals from the planar antenna,wherein the coupling electrode is electrically coupled to an unshielded, linear antenna conductor, which serves as a linear antenna for reception of electromagnetic waves, wherein the linear antenna conductor is situated outside an area that can be projected by orthogonal parallel projection onto the planar antenna serving as a projection area, such that an antenna foot point of the linear antenna becomes a common antenna foot point of the linear and planar antenna.2. The hybrid antenna structure according to claim 1 , characterized in that the ...

INDOOR CEILING-MOUNT OMNIDIRECTIONAL ANTENNA AND A METHOD FOR MANUFACTURING THE SAME

A ceiling-mount omnidirectional antenna for indoor distribution system of mobile communication network and a method for manufacturing the same are provided. The antenna includes: a monopole consisting of a cone part and a columnar part; a reflecting plate consisting of a cone part and a platform part; and a feed connector. The monopole and the reflecting plate are arranged in such that the tips of cone parts are opposite to each other. The signal is fed into the antenna through the feed connector and radiated outward by the monopole and the reflecting plate. In high frequency band, the maximal gain appears at about 70°, so that the signal power focuses at radiating angles of 60°˜85°. Comparing to the existing antenna, the gain of the antenna increases 4.22 dB at a radiating angle of 85° and decreases 10 dB at a radiating angle of 30°. So, the maximal permissible value of antenna aperture power of mobile communication signal in high frequency band, such as 3G, is increased; and the field strength of signal covering the edge is increased. The antenna can increase the covering range of a single antenna, increase the signal quality, and cover 2G and 3G networks in the same time so as to reduce the difficulty and the cost for building and reconstructing an indoor distribution system in 3G. 1. An indoor ceiling-mount omnidirectional antenna , comprising: a first cone part having a first small base and a first large base, and', 'a columnar part;, 'a monopole having a conical-column structure, the monopole including'} a second cone part having a second small base and a second large base, and', 'a disc; and, 'a reflecting plate having disc-cone structure and arranged below the monopole, the reflecting plate including'}a feed connector, disposed in a center of the second small base of the second cone and connecting with a feed coaxial line, for receiving and emitting signal feed-in or feed-out,wherein the monopole and the reflecting plate are arranged such that the first ...

ON PCB DIELECTRIC WAVEGUIDE

A method which relates to fabricating a dielectric waveguide (WG) on a PCB for RF communication between ICs on the PCB. The WG can replace a baseband copper bus and resulting in the PCB being smaller and/or cheaper. The WG may be printed, stamped, cut or prefabricated onto the PCB. 1. A method for providing chip-to-chip RF communications on a printed circuit board (PCB) , the method including:providing a dielectric waveguide made from a dielectric material; andconnecting a coupler at each end of the dielectric waveguide, the connecting coupling the dielectric waveguide to at least two chips.2. The method of claim 1 , wherein the dielectric has a cross-sectional shape that is selected from a group consisting of: quadrilateral claim 1 , circular claim 1 , semi-circular claim 1 , elliptical claim 1 , and polygonal.3. The method of claim 1 , wherein providing the dielectric waveguide comprises a process selected from a group consisting of: printing claim 1 , injection molding-and-stamping claim 1 , and etching.4. The method of claim 2 , wherein providing the dielectric waveguide comprises a process selected from a group consisting of: printing claim 2 , injection molding-and-stamping claim 2 , and etching.5. The method of claim 1 , wherein the coupler includes:a microstrip line (MSL) to connect to a contact of a chip; anda planar horn antenna transitioning from the MSL to the dielectric waveguide.6. The method of claim 1 , wherein the providing the dielectric waveguide further comprises:printing liquid or semi-liquid dielectric material on the PCB between the couplers; andsolidifying the liquid or semi-liquid dielectric material into the dielectric waveguide.7. The method of claim 1 , wherein the providing the dielectric waveguide further comprises:injecting dielectric material into a mold; andstamping the dielectric material from the mold to the PCB between the couplers.8. The method of claim 1 , wherein the providing the dielectric waveguide further comprises:adhering ...

Method for Manufacturing Resonance Tube, Resonance Tube, and Filter

A method for manufacturing a resonance tube includes: mixing powder materials, to form homogeneous powder particles, where the powder materials comprise iron powder with a weight proportion of 50% to 90%, at least one of copper powder and steel powder with a weight proportion of 1% to 30%, and an auxiliary material with a weight proportion of 1% to 20%; pressing and molding the powder particles, to form a resonance tube roughcast; sintering the resonance tube roughcast in a protective atmosphere, to form a resonance tube semi-finished product; and electroplating the resonance tube semi-finished product, to form the resonance tube. In the method, the resonance tube, and the filter according to embodiments of the present invention, the resonance tube is manufactured by using multiple powder materials.

ANTENNA DEVICE AND METHOD OF SETTING RESONANT FREQUENCY OF ANTENNA DEVICE

In antenna device, a coil conductor of an antenna coil module and a conductor layer at least partially overlap. A current flows in the conductor layer to block a magnetic field generated by a current flowing in the coil conductor. A current flows along the periphery of a slit and around the periphery of the conductor layer due to a cut-edge effect. Since magnetic flux does not pass through the conductor layer, magnetic flux attempts to bypass the conductor layer along a path in which the conductor opening of the conductor layer is on the inside and the outer edge of the conductor layer is on the outside. As a result, the magnetic flux generates large loops that link the inside and the outside of a coil conductor of an antenna on a reader/writer side to couple an antenna device and the antenna on the reader/writer side. 1. An antenna device comprising:a coil conductor having a loop shape or a spiral shape in which a winding center portion defines a coil opening;a conductor layer that is arranged on a side closer to an antenna on a communication partner side than a location of the coil conductor; anda magnetic layer that is arranged on a side farther from the antenna on the communication partner side than the location of the coil conductor; whereinthe conductor layer includes a conductor opening and a slit, the slit connecting the conductor opening and an outer edge of the conductor layer;the conductor layer is larger than an area of a region in which the coil conductor is disposed; andwhen the coil conductor is viewed in plan view, the coil conductor and the conductor layer are superposed one on top of the other.2. The antenna device according to claim 1 , wherein an inside diameter of the coil conductor is larger than a diameter of the conductor opening of the conductor layer.3. The antenna device according to claim 1 , wherein when the coil conductor is viewed in plan view claim 1 , the coil opening and the conductor opening at least partially overlap each other.4. ...

Modular Feed Network

A modular feed network is provided with a segment base provided with a feed aperture, a corner cavity at each corner and a tap cavity at a mid-section of each of two opposite sides. A segment top is provided with a plurality of output ports. The segment top is dimensioned to seat upon the segment base to form a segment pair. the segment base provided with a plurality of waveguides between cavities of the segment base. The modular feed network is configurable via a range of feed, bypass and/or power divider taps seated in the apertures and/or cavities to form a waveguide network of varied numbers of output ports by routing across one or more of the segment tops. For example, the modular feed network may comprise 1, 4 or 16 of the segment bases retained side to side. 1. A modular feed network , comprising:a generally rectangular segment base provided with a feed aperture; a corner cavity at each corner and a tap cavity at a mid-section of each of two opposite sides; and a segment top provided with a plurality of output ports; the segment top provided seated upon a first side of the segment base to form a segment pair;the segment base provided with a central waveguide, on the first side, between the feed aperture and the tap cavities;the segment base provided with a peripheral waveguide, on the first side, between each of the corner cavities that are adjacent to one another;the segment base provided with a feed waveguide between the feed aperture and the output ports.2. The modular feed network of claim 1 , wherein a path between the feed aperture and each of the output ports has a generally equivalent length.3. The modular feed network of claim 1 , further including retention features provided on a periphery of the segment pair; the retention features dimensioned for mechanical coupling of the segment pair to additional segment pairs claim 1 , side to side.4. The modular feed network of claim 1 , wherein the segment top is provided with a mirror image waveguide ...

DIPOLAR ANTENNA SYSTEM AND RELATED METHODS

Some embodiments include a dipolar antenna system to electrically power an implantable miniature device and/or to stimulate bioelectrically excitable tissue. Other related systems and methods are also disclosed. 1. An apparatus comprising: a first electrically conductive element having a first length and a first width; and', 'a second electrically conductive element having a second length and a second width;, 'a dipolar antenna comprising the dipolar antenna is configured to be implanted in biological tissue;', 'the dipolar antenna is configured to receive a dipolar electric field;', 'a combined length of the first length and the second length is greater than or equal to approximately 2 millimeters and less than or equal to approximately 6 centimeters; and', 'the first width and the second width are each less than or equal to approximately 1.5 millimeters., 'wherein2. The apparatus of further comprising:an electromagnetic wave exciter configured to emit electromagnetic radiation comprising the dipolar electric field, wherein the apparatus is configured to transfer energy between the electromagnetic wave exciter and the dipolar antenna through the dipolar electric field of the electromagnetic radiation.3. The apparatus of wherein at least one of:the electromagnetic wave exciter comprises an additional dipolar antenna; orthe first electrically conductive element is approximately co-linear with the second electrically conductive element, and the dipolar antenna is oriented approximately parallel to the electromagnetic wave exciter.4. The apparatus of wherein at least one of:the electromagnetic radiation comprises (i) a peak power level greater than or equal to approximately 10 watts and less than or equal to approximately 100 watts and (ii) an average power level greater than or equal to approximately 1 watt and less than or equal to approximately 10 watts;orthe electromagnetic wave exciter is configured to pulse the electromagnetic radiation for a time period of ...

Wireless Temperature Measurement System And Methods Of Making And Using Same

A temperature measurement system capable of operating in harsh environments including a temperature sensor having an antenna, diode, and dielectric layer disposed on the object of interest is provided, wherein the antenna includes a buried portion that extends through and is electrically coupled to the object of interest, and an exposed portion disposed upon an outer surface of the dielectric layer and the diode is coupled between the object of interest and the exposed portion of the antenna. The antenna is configured to receive interrogating signals from a transmitter, and to transmit response signals corresponding to the resonant frequency of the temperature sensor and its harmonics, which are indicative of the measured temperature of the object of interest. A receiver detects the response signals and correlates the frequency to a known temperature response of the dielectric material. Methods of making and using the temperature measurement system are also provided. 1. A method of fabricating a temperature measurement device , the method comprising:depositing a dielectric material having temperature-dependent electrical properties;disposing an antenna at least partially within the dielectric material, the antenna having a resonant frequency that varies in response to temperature-dependent characteristics of the dielectric material, the antenna configured to receive a RF signal; andproviding a diode in communication with the antenna and configured to produce a harmonic of the RF signal in response to receipt of the RF signal.2. The method of claim 1 , wherein depositing the dielectric material comprises depositing the dielectric material on a substrate.3. The method of claim 2 , wherein the substrate comprises a turbine blade.4. The method of claim 2 , wherein providing the diode further comprises coupling the diode to the substrate.5. The method of claim 1 , wherein the dielectric material comprises a thermal barrier coating.6. The method of claim 1 , wherein the ...

Method for Manufacturing Resonant Tube, Resonant Tube and Cavity Filter

A method for manufacturing a resonant tube is provided in the present invention, which comprises: mechanically mixing 88-98 wt. % of iron-nickel alloy powder, 1-8 wt. % of carbonyl iron powder, and 1-8 wt. % of carbonyl nickel powder to form a uniform powder mixture; molding the uniform powder mixture to form a resonant tube blank; and continuously sintering and annealing the resonant tube blank. Also provided in the present invention are a resonant tube and a cavity filter. The method for manufacturing a resonant tube provided in the present invention significantly enhances production efficiency while greatly reducing consumption of raw materials. Moreover, the resonant tube provided in the present invention reduces, to the greatest extent, segregation of alloy components and coarse and uneven microstructures, thereby increasing the performance and stability of the corresponding products. 1. A method for manufacturing a resonant tube , wherein comprising:mechanically mixing 88-98 wt. % of iron-nickel alloy powder, 1-8 wt. % of carbonyl iron powder, and 1-8 wt. % of carbonyl nickel powder to form a uniform powder mixture;molding the uniform powder mixture to form a resonant tube blank; andcontinuously sintering and annealing the resonant tube blank.2. The method according to claim 1 , wherein the method further comprising: preparing the iron-nickel alloy powder before said mechanically mixing claim 1 , wherein preparing the iron-nickel alloy powder comprises preparing an alloy powder claim 1 , which is ball- or blob-shaped particles and comprises 36 wt. % of nickel and 64 wt. % of iron claim 1 , select purity iron and purity nickel using an ultrahigh pressure water or gas atomization technique.3. The method according to claim 1 , wherein said mechanically mixing comprises: mechanically mixing claim 1 , using a mechanical ball-mixing process claim 1 , the iron-nickel alloy powder claim 1 , the carbonyl iron powder claim 1 , and the carbonyl nickel powder with a ...

Multi-Layered Flexible Printed Circuit and Method of Manufacture

A flexible printed circuit includes 2 insulating flexible layers, and 3 conductive layers each including electrical tracks, the conductive and the insulating layers are provided stacked in alternated fashion. Electrical tracks of 3 conductive layers are electrically connected together through respective layers of insulating substrate to form an RFID antenna. 1. A flexible printed circuit comprising at least 2 electrically insulating flexible substrate layers , and at least 3 electrically conductive layers each with an electrically conductive pattern comprising an electrical track ,wherein the electrically conductive layers and the electrically insulating flexible substrate layers are provided stacked in alternated fashion,wherein electrical tracks of at least 3 electrically conductive layers are electrically connected together through respective layers of electrically insulating flexible substrate to form a RFID antenna having two ends, each adapted to be electrically connected to a respective contact of an integrated circuit.2. Flexible printed circuit according to claim 1 , further comprising a third electrically insulating flexible substrate layer stacked over one electrically conductive layer.3. Flexible printed circuit t according to claim 2 , further comprising a fourth electrically conductive layer stacked over said third electrically insulating flexible substrate layer.4. Flexible printed circuit according to claim 1 , wherein an external electrically conductive layer comprises electrical contacts adapted to be electrically contacted by an external card reader claim 1 , some of said electrical contacts also being adapted to be electrically connected to a respective contact of an integrated circuit.5. Flexible printed circuit according to wherein said electrical contacts are adapted to be electrically connected to a respective contact of an integrated circuit through at least one of said layers of electrically insulating flexible substrate.6. Flexible printed ...

ANTENNA

This application relates to antennas including, for example, an antenna for operation at a frequency in excess of 200 MHz comprising: an insulative substrate having a central axis, an axial passage extending therethrough and an outer substrate surface which extends around the axis; a three-dimensional antenna element structure including at least one pair of axially coextensive elongate conductive antenna elements on or adjacent the outer substrate surface; and an axial feeder structure which extends through the passage and comprises an elongate laminate board wherein the laminate board proximal end portion includes lateral extensions projecting in opposite lateral directions, and wherein, adjacent the laminate board proximal end portion, the substrate has recesses on opposite sides of the axis which receive at least edge parts of the said lateral extensions of the laminate board proximal end portion. 1. An antenna for operation at a frequency in excess of 200 MHz comprising:an insulative substrate having a central axis, an axial passage extending therethrough and an outer substrate surface which extends around the axis;a three-dimensional antenna element structure including at least one pair of axially coextensive elongate conductive antenna elements on or adjacent the outer substrate surface; andan axial feeder structure which extends through the passage and comprises an elongate laminate board having a proximal end portion for connection to host equipment circuitry, an intermediate portion including a transmission line, and a distal end portion coupled to the antenna elements;wherein the laminate board proximal end portion is wider than the intermediate portion in that it includes lateral extensions projecting in opposite lateral directions, and wherein, adjacent the laminate board proximal end portion, the substrate has recesses on opposite sides of the axis which receive at least edge parts of said lateral extensions of the laminate board proximal end portion.2. ...

MULTIBAND LOOP ANTENNA

An approximately planar antenna assembly can be formed or used, such as comprising a printed circuit board assembly. In an example, the approximately planar antenna assembly can include a dielectric material and a conductive loop comprising an outer loop portion having a first conic section an inner loop portion having a second conic section located within a footprint of the first conic section. The planar antenna assembly can be configured to support wireless transfer of information in at least two ranges of operating frequencies, such as two or more respective ranges used for cellular communications. 1. An apparatus comprising an approximately planar antenna assembly , the approximately planar antenna assembly comprising:a dielectric material; and an outer loop portion comprising a first conic section; and', 'an inner loop portion comprising a second conic section located within a footprint of the first conic section;, 'a conductive loop comprisingwherein the planar antenna assembly is configured to support wireless transfer of information in at least two ranges of operating frequencies;wherein one or more of the first or second conic sections includes an elliptical shape;wherein a line width of the conductive loop varies along the conductive loop;wherein a lateral width of the conductive loop is widest in a region along a major axis of the first or second conic section; andwherein the approximately planar antenna assembly is configured to support wireless transfer of information within two different specified ranges of operating frequencies, the specified ranges of operating frequencies comprising two different ranges of cellular communications operating frequencies.2. The apparatus of claim 1 , wherein the two different specified ranges of operating frequencies include:a first range from 806 MHz to about 960 MHz; anda second range from about 1.575 GHz to about 2.170 GHz.3. An apparatus comprising an approximately planar antenna assembly claim 1 , the ...

RECOMBINANT WAVEGUIDE POWER COMBINER / DIVIDER

In an example embodiment, an in-phase recombinant waveguide combiner/divider device can comprise: a single waveguide input; N waveguide outputs, wherein N is an integer greater than 2; a first waveguide dividing portion; a second waveguide dividing portion; a third waveguide dividing portion; and a waveguide combining portion. The waveguide combining portion can be configured to combine two signals that are each respectively received from the second waveguide dividing portion and third waveguide dividing portion. In general an in-phase recombinant waveguide combiner/divider can comprise more junctions than output ports of a conservative power divider network structure. In an example embodiment, for a N-way waveguide power divider, there can be at least N+1 waveguide junctions. 1. An in-phase recombinant three-way waveguide (WG) device comprising:a first WG port, wherein the first WG port is a common port; distribute a transmit signal, provided at the common port, as three separate signals respectively at the second, third and fourth WG ports; and', 'combine three receive signals respectively from the second, third and fourth WG ports into a single signal at first WG port;, 'second, third, and fourth WG ports, wherein in the recombinant three-way WG device is configured to simultaneouslywherein a signal communicated between the common port and the fourth WG port is split before it is combined with a portion of itself; signals in a first band communicated via the second, third, and fourth WG ports are in-phase with each other, and', 'signals in a second band communicated via the second, third, and fourth WG ports are in-phase with each other., 'wherein at least one of2. The device of claim 1 , wherein a signal communicated between the common port and the fourth WG port is split into at least four signals in-between the common port and the fourth WO port.3. The device of claim 1 , further comprising:a first junction;a second junction;a third junction;a fourth junction; ...

PROCESS FOR PRODUCING METAMATERIAL, AND METAMATERIAL

A process for producing a metamaterial excellent in productivity is provided. The present invention relates to a process for producing a metamaterial including an electromagnetic wave resonator resonating with an electromagnetic wave, the process including: vapor-depositing a material which can form the electromagnetic wave resonator to a support having a shape corresponding to a shape of the electromagnetic wave resonator to thereby arrange the electromagnetic wave resonator on the support. 1. A process for producing a metamaterial comprising an electromagnetic wave resonator resonating with an electromagnetic wave , the process comprising: vapor-depositing a material which can form the electromagnetic wave resonator to a support having a shape corresponding to a shape of the electromagnetic wave resonator to thereby arrange the electromagnetic wave resonator on the support.2. The process for producing a metamaterial according to claim 1 , wherein the material which can form the electromagnetic wave resonator is vapor-deposited by a physical vapor deposition to thereby arrange the electromagnetic wave resonator on the support.3. The process for producing a metamaterial according to claim 1 , wherein the material which can form the electromagnetic wave resonator is vapor-deposited to the support from two or more different directions.4. The process for producing a metamaterial according to claim 3 , wherein the support has a shape having a convex curved surface corresponding to the shape of the electromagnetic wave resonator claim 3 , and the material which can form the electromagnetic wave resonator is vapor-deposited to the convex curved surface of the support.5. The process for producing a metamaterial according to claim 3 , wherein a dielectric is vapor-deposited to the support claim 3 , and a conductive material and/or a dielectric is further vapor-deposited thereto.6. The process for producing a metamaterial according to claim 5 , wherein the support has a ...

MINIATURIZED AND RECONFIGURABLE CPW SQUARE-RING SLOT ANTENNA INCLUDING FERROELECTRIC BST VARACTORS

A coplanar waveguide (CPW) square-ring slot antenna for use in wireless communication systems is miniaturized and reconfigurable by the integration of ferroelectric (FE) BST (barium strontium titanate) thin film varactors therein. The slot antenna device includes a sapphire substrate, top and bottom metal layers, and a thin ferroelectric BST film layer, where the FE BST varactors are integrated at the back edge of the antenna on the top metal layer. 1. A CPW square-ring slot antenna having integral ferroelectric BST (barium strontium titanate) varactors therein; wherein said antenna is miniaturized and reconfigurable.2. The slot antenna of further including a sapphire substrate claim 1 , a bottom metal layer on said substrate claim 1 , a BST thin film layer on said bottom metal layer claim 1 , and a top metal layer; wherein said antenna and said varactors are included on said top metal layer.3. The slot antenna of wherein said sapphire substrate has a dielectric constant of about 9.7.4. The slot antenna of wherein said top and bottom metal layers comprise gold.5. The slot antenna of wherein said top and bottom metal layers comprise titanium claim 2 , platinum claim 2 , gold claim 2 , or combinations thereof.6. The slot antenna of having a size of about 0.12λ×0.12λ.7. The slot antenna of wherein the frequency of the antenna is reconfigurable from about 5.8 GHz to 6.1 GHz.8. The slot antenna of wherein said antenna comprises an inner patch including a back edge claim 2 , wherein said ferroelectric BST varactors are integrated on said back edge.9. The slot antenna of wherein from 3 to 9 varactors are integrated on said back edge.10. A method of making a miniaturized and reconfigurable CPW square-ring slot antenna comprising:providing a sapphire substrate;applying a bottom metal layer over said sapphire substrate;depositing a ferroelectric BST thin film over said bottom metal layer;applying a top metal layer over said BST thin film; said top metal layer comprising an ...

DUAL-CIRCULAR POLARIZED ANTENNA SYSTEM

In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array. 1. A combiner comprising:a septum layer comprising a plurality of septum dividers, the septum layer having a first side and a second side, and oriented in a first plane;a first housing layer attached to the first side of the septum layer, and oriented in a second plane;a second housing layer attached to the second side of the septum layer, and oriented in a third plane;wherein, in a coordinate system comprising an X axis, a Y axis, and a Z axis that are perpendicular to each other, the first, second and third planes are parallel to each other and to a plane defined by the Y axis and the Z axis;a linear array of ports on a first end of the combiner, the linear array of ports being aligned in parallel with the Y direction and opening in the Z direction;wherein the first and second housing layers each comprise waveguide T-junctions oriented in planes parallel to the plane defined by the Y axis and the Z axis; wherein the linear array of ports are connected to a common port via waveguide H-plane T-junction power dividers/combiners; andwherein the septum layer evenly bisects each port of the linear array of ports.2. The combiner of claim 1 , further comprising a common port on a second end of the combiner claim 1 , opposite the first end of the combiner and ...

SNAP-ON MODULE FOR SELECTIVELY INSTALLING RECEIVING ELEMENT(S) TO A MOBILE DEVICE

An apparatus and method for selectively attaching sensor(s) or antenna(s) to a mobile device at a convenient location are provided. The mobile device includes a body and a processing unit housed within the body for running an application, where the body includes a forward end and a rearward end that supports engagement with a charging dock. In addition, the rearward end accepts engagement of a snap-on module that physically assembles to and electronically interfaces with the mobile device. The antennas or sensors are externally mounted to the mobile device at a location proximate to the forward end of the body. Further, these antennas or sensors are interconnected to the snap-on module using media-routing conduit(s) that are configured to carry signals from the antennas or sensors to the snap-on module for distribution as an input to the application running on the processing unit. 1. A modular device comprising:a mobile device that includes a body and a processing unit housed within the body for running at least one application, wherein the body includes a forward end and a rearward end, and wherein the rearward end includes an electronic interface that is operably coupled to the processing unit; anda snap-on module that physically engages to the electronic interface at the rearward end of the mobile device, wherein engagement establishes a communication path between the snap-on module and the processing unit of the mobile device.2. The modular device of claim 1 , wherein the electronic interface of the mobile device is designed to dock with a charger that distributes power to at least one battery internal to the mobile device.3. The modular device of claim 1 , wherein the mobile device represents a bar-code scanner with radio-frequency identification (RFID)-reading functionality provisioned within the processing unit.4. The modular device of claim 1 , wherein the mobile device represents at least one of a mobile handset claim 1 , a personal digital assistant claim ...

IN-PHASE H-PLANE WAVEGUIDE T-JUNCTION WITH E-PLANE SEPTUM

In an example embodiment, an in-phase H-plane T-junction can comprise: a first waveguide port; a second waveguide port; a third waveguide port, wherein the third waveguide port can be a common port; and an E-plane septum. The first, second, and third waveguide ports can be in the H-plane and can be each connected to each other in a T configuration. The T-junction can be configured such that microwave signals in a first band can be in-phase with each other at the first and second waveguide ports, and microwave signals in a second band can be in-phase with each other at the first and second waveguide ports. The H-plane T-junction can be at least one of a power combiner and a power divider. 1. An in-phase H-plane T-junction comprising:a first waveguide port;a second waveguide port;a third waveguide port, wherein the third waveguide port is a common port; andan E-plane septum;wherein the first, second, and third waveguide ports are all in the H plane and are each connected to each other in a T configuration,wherein the T-junction is configured such that microwave signals in a first band are in-phase with each other at the first and second waveguide ports, and microwave signals in a second band are in-phase with each other at the first and second waveguide ports; andwherein the H-plane T-junction is at least one of a power combiner and a power divider.2. The in-phase H-plane claim 1 , T-junction of ;wherein the first band is a receive frequency band, and a first receive signal received at the first waveguide port is in phase with a second receive signal received at the second waveguide port;wherein the second band is a transmit frequency band, and a first transmit signal transmitted from the first port is in phase with a second transmit signal transmitted from the second port; andwherein the difference in frequency between the receive frequency hand and the transmit frequency band is greater than 1.5.3. The in-phase H-plane claim 1 , T-junction of claim 1 , wherein the E ...

TUNABLE BANDPASS FILTER

A bandpass filter has a combline structure having a plurality of cascaded nodes. A plurality of nodes in the filter are connected both to resonant elements (a.k.a. resonators) and non-resonant elements (including elements having inductances and/or capacitances that do not resonate in a predetermined frequency band of interest). The resonant frequencies of the resonant elements may be adjusted, in order to adjust the location of the center frequency and/or the width of the passband of the filter. The characteristics of the resonant and non-resonant elements are selected such that the poles of the filter, when plotted on the complex plane, move substantially along the imaginary axis when the resonant frequencies are adjusted, without substantial movement along the real axis. The resulting bandpass filter has substantially constant losses and substantially constant absolute selectivity over a relatively wide range of bandwidths. 1. A filter for receiving an input signal and providing a filtered output signal , the filter comprising:{'b': '501', 'an input coupling (e.g., ) adapted to receive the input signal;'}{'b': '509', 'an output coupling (e.g., ) adapted to provide the filtered output signal;'}{'b': 503', '505', '507, 'a plurality of transmission-line couplings (e.g., , , );'}{'b': 502', '504', '506', '508, 'a plurality of nodes (e.g., , , , ) connected in series between the input coupling and the output coupling, each node being connected to each adjacent node through one of the transmission-line couplings;'}{'b': 514', '517, 'a plurality of resonant elements (e.g., -), each connected to a different node and each having an adjustable resonant frequency; and'}{'b': 601', '604, 'claim-text': (i) at least one non-resonant element is one of (a) a capacitor coupled to ground and (b) a structure that is equivalent to a capacitor coupled to ground;', '(ii) at least one non-resonant element is one of (a) an inductor coupled to ground and (b) a structure that is equivalent ...

ANTENNA ASSEMBLY, METHOD OF MANUFACTURING ANTENNA ASSEMBLY AND MOBILE TERMINAL HAVING ANTENNA ASSEMBLY

An antenna assembly may include a carrier and an antenna located on the carrier to transmit a frequency in a specific RF band. The antenna may include a first pattern and a second pattern formed separately from the first pattern and coupled to the first pattern. The antenna may be configured by combining the second pattern formed separately from the first pattern with the first pattern, and thus the antenna may have various frequency bands. 1. An antenna assembly comprising:a carrier; andan antenna located at the carrier to transmit a frequency in a specific radio frequency (RF) band,wherein the antenna includes a first pattern and a second pattern coupled to the first pattern, the second pattern being formed separately from the first pattern, and the frequency of the specific RF band is based on a characteristic of at least one of the first pattern and the second pattern.2. The antenna assembly of claim 1 , wherein the second pattern is coupled to at least part of the first pattern claim 1 , and the frequency in the specific RF band is determined by at least one of a length claim 1 , an area and a shape of at least one of the first pattern and the second pattern.3. The antenna assembly of claim 1 , wherein the first pattern is formed of a conductive material claim 1 , and the first pattern is formed to have a predetermined length on at least part of the carrier.4. The antenna assembly of claim 1 , wherein the frequency in the specific RF band is determined based at least one of a length claim 1 , an area and a shape of the second pattern.5. The antenna assembly of claim 1 , wherein the second pattern is at least one of a line pattern claim 1 , a meander pattern or a saw pattern coupled to at least part of the first pattern.6. The antenna assembly of claim 1 , wherein the second pattern extends to outside of the carrier.7. A mobile terminal comprising:a body; andan antenna assembly located at one side of the body,wherein the antenna assembly includes a carrier and ...

Planar array feed for satellite communications

An apparatus, system, and method are disclosed for wireless communications. A planar antenna element is disposed on a surface of a substrate. The planar antenna element comprises an electrically conductive material and has a circular polarization. The substrate comprises a dielectric material. The planar antenna element may be arranged in a planar antenna array as a feed for a reflector antenna or as an aperture array. The planar antenna element may comprise a slot patch antenna element with a slot in the electrically conductive material of the planar antenna element circumscribing the planar antenna element. The slot exposes the dielectric material of the substrate. A ground plane may be disposed on the surface of the substrate. The ground plane comprises an electrically conductive material. The slot may be disposed between the ground plane and the patch antenna element.

QUASI-ELECTRIC SHORT WALL

Provided is an assembly and process for isolating internal regions of an electromagnetic cavity from interfering electromagnetic radiation. The assembly includes a first portion defining a first electrically conducting broad wall and an elongated, electrically conducting isolating wall, coupled to and extending away from the first broad wall. The assembly also includes a second portion defining a second electrically conducting broad wall and an elongated, electrically conducting trough defined therein. The trough is sized to accept at least a portion of the isolating wall. The first and second portions are adapted for assembly in a facing arrangement in which the isolating wall is aligned with the trough. When assembled, a tip portion of the isolating wall extends to a uniform depth within the trough, such that the isolating wall-trough combination substantially rejects a transfer of electromagnetic energy across the isolating wall over at least a predetermined range of wavelengths. 1. An electromagnetic shield assembly comprising:a first electrically conducting wall extending along a longitudinal axis;a second electrically conducting wall extending between base and tip portions; the second wall attached along its base portion to the first wall forming a line of intersection perpendicular to the longitudinal axis, whereby the tip portion extends away from the first wall; anda third electrically conducting wall extending along a longitudinal axis and having an electrically conducting trough defining an elongated aperture in the third wall, the elongated aperture extending along a direction perpendicular to the longitudinal axis,wherein the trough is configured to accept therein at least the tip portion of the second wall when the first and third walls are arranged in facing opposition and separated by a predetermined separation distance, the tip portion of the second wall and the trough being adapted to maintain physical separation therebetween when so arranged, ...

EMBEDDED PRINTED EDGE - BALUN ANTENNA SYSTEM AND METHOD OF OPERATION THEREOF

An antenna module having a side-edge balance-to-unbalance (BALUN). The antenna module may include a flexible substrate with one or more layers that may be configured to receive one first and second conductive patterns, the substrate may have opposed first and second ends which may define a longitudinal length and/or opposed side edges situated between the first and second ends. The first conductive pattern may form an antenna loop situated adjacent to the first end of the flexible substrate and be suitable for transmitting or receiving signals at one or more frequencies. The second conductive pattern may form at least part of the BALUN and may include one or more of a center portion, side portions which may extend from the center portion at opposite sides of the center portion, and electrically neutral slots situated between a corresponding side portion and the center portion. 1. An antenna apparatus for a mobile station (MS) , the antenna apparatus comprising:a flexible substrate portion comprising one or more layers and having first and second ends defining a longitudinal length thereof, the substrate portion comprising a first portion situated adjacent to the first end and a second portion situated adjacent to the second end;a coil antenna configured to inductively transmit or receive radio frequency (RF) signals for communication with a radio-frequency identification (RFID) device and disposed on one or more of the one or more flexible layers of the substrate portion in the first portion of the substrate portion; anda second conductive pattern configured to be coupled to one or more of a ground plane of the MS and disposed on one or more of the one or more flexible layers of the first portion of the substrate portion in the second portion of the substrate portion, the second conductive pattern being further configured to form a side-edge (SE) balance-to-unbalance (BALUN) which controls impedance in the second conductive pattern.2. The apparatus of claim 1 , ...

SYSTEM AND METHOD FOR MANUFACTURING A FIELD EMISSION STRUCTURE

An improved field emission system and method is provided that involves field emission structures having electric or magnetic field sources. The magnitudes, polarities, and positions of the magnetic or electric field sources are configured to have desirable correlation properties, which may be in accordance with a code. The correlation properties correspond to a desired spatial force function where spatial forces between field emission structures correspond to relative alignment, separation distance, and the spatial force function. 17-. (canceled)8. A system for manufacturing a field emission structure , comprising:a magnet supplying device; anda magnet placement device, said magnet placement device placing each one of a plurality of magnets at a corresponding location of a plurality locations of said field emission structure, said corresponding location and a corresponding polarity orientation of each of said plurality of magnets relative to each other being defined in accordance with a code that specifies at least one magnet of said plurality of magnets having a first polarity orientation and at least one other magnet of said plurality of magnets having a second polarity orientation, said second polarity orientation being different from said first polarity orientation.9. The system of claim 8 , wherein said magnet placement device comprises vacuum tweezers.10. The system of claim 8 , wherein said magnet placement device comprises an insertion tool.11. The system of claim 8 , wherein said magnet placement device comprises a screwing device.12. The system of claim 8 , wherein said magnet placement device comprises a bolting device.13. The system of claim 8 , wherein said magnet placement device comprises an affixing device.14. The system of claim 8 , wherein said magnet placement device comprises an adhesive supplying device.15. The system of claim 8 , further comprising:a pressure supplying device.16. The system of claim 15 , wherein said pressure supplying device ...

METAMATERIAL LINERS FOR HIGH-FIELD-STRENGTH TRAVELING-WAVE MAGNETIC RESONANCE IMAGING

A liner for a bore of a waveguide is provided. The liner as an aperture passing through it and is formed of a metamaterial that has a relative electrical permittivity that is negative and near zero. When the liner is installed in the waveguide, it lowers the cutoff frequency of the waveguide while allowing the waveguide to remain hollow. This liner can be used in the bore of an MRI machine to lower the cutoff frequency of the bore of the MRI machine to allow the MRI machine to operate using waves having a lower frequency that if the liner was not used. 1. A liner for a bore of an MRI machine comprising:a body having an annular shape and formed of a metamaterial having a relative electrical permittivity that is negative and near zero.2. The liner of wherein the relative electrical permittivity of the metamaterial forming the body is in the range of −1 to −0.14. The liner of wherein the relative electrical permittivity of the metamaterial forming the body is in the range of −22.27εto ε5. The liner of wherein the body has an outer diameter having a size that is substantially the same as an inner diameter of the bore of the MRI machine.6. The liner of wherein the liner is sized to fit within the bore of the MRI machine and adjacent to an inside surface of the bore of the MRI machine.7. The liner of wherein the metamaterial is a negative-refractive-index transmission-line (NRI-TL) metamaterial.8. The liner of wherein the liner is formed of stacks of planar NRI-TL metamaterial layers.9. The liner of wherein the stacks are oriented radially and arranged azimuthally in periodic fashion in the liner and each stack extends a length of the bore.10. The liner of wherein the thickness of the liner decreases a diameter of the bore of the MRI machine by 10% or less.11. The liner of wherein the liner is sized to fit within the bore of the MRI machine and adjacent to an inside surface of the bore of the MRI machine.12. A liner for a bore of a waveguide comprising:a body having an ...

UNIVERSAL RFID TAGS AND METHODS

Radio frequency identification (RFID) devices, and methods of manufacture are described herein. In one implementation, an RFID device comprises a near field only RFID tag that does not function as a far field RFID tag and is pre-manufactured; and a conductive element independent from the near field only RFID tag and configured to function as a far field antenna, wherein the conductive element extends a length and includes a central region and includes at least one distal region defining a voltage end of the conductive element. The near field only RFID tag and a distal region of the conductive element are coupled in proximity to each other such that the RFID device functions in both a near field and a far field. 1. A radio frequency identification (RFID) device comprising:a near field only RFID tag that does not function as a far field RFID tag and is pre-manufactured;a conductive element independent from the near field only RFID tag and configured to function as a far field antenna, wherein the conductive element extends a length and includes a central region and includes at least one distal region defining a voltage end of the conductive element; andwherein the near field only RFID tag and a distal region of the conductive element are coupled in proximity to each other such that the RFID device functions in both a near field and a far field.2. The RFID device of wherein the near field only RFID tag comprises a conductor configured to assist in the proximity coupling.3. The RFID device of wherein the near field only RFID tag is encoded with an electronic product code prior to being coupled in proximity to the conductive element.4. The RFID device of further comprising an alignment feature configured to assist in aligning the near field only RFID tag and the conductive element in the proximity coupling.5. The RFID device of wherein the conductive element comprises a material selected from a group consisting of one or more of: a wire claim 1 , a printed element claim ...

Chip antenna and manufacturing method thereof

After a three-dimensional antenna pattern ( 10 ) is formed by bending a conductive plate, the three-dimensional antenna pattern ( 10 ) thus bent is supplied in an injection molding die set as an insert component and a base ( 20 ) is formed by injection molding of a resin. With this, a chip antenna ( 1 ) comprising the three-dimensional antenna pattern ( 10 ) can be formed easier as comparison to a case where the antenna pattern is formed over a plurality of surfaces by printing and the like.

ANTENNA WITH EFFECTIVE AND ELECTROMAGNETIC BANDGAP (EBG) MEDIA AND RELATED SYSTEM AND METHOD

An apparatus includes an antenna having multiple layers. At least a first of the layers includes both an effective medium and an electromagnetic bandgap (EBG) medium. The antenna could include a ground plane and a feed line, and the first layer of the antenna can be located between the ground plane and the feed line. The antenna could also include a slot ground and a planar antenna structure, and the first layer of the antenna could be located between the slot ground and the planar antenna structure. The antenna could further include a first substrate between a feed line and a slot ground and a second substrate covering a planar antenna structure, and the first layer could include one of the first and second substrates. 1. An apparatus comprising:an antenna comprising multiple layers;wherein at least a first of the layers comprises both an effective medium and an electromagnetic bandgap (EBG) medium.2. The apparatus of claim 1 , wherein:the antenna comprises a ground plane and a feed line; andthe first layer of the antenna is located between the ground plane and the feed line.3. The apparatus of claim 1 , wherein:the antenna comprises a slot ground and a planar antenna structure; andthe first layer of the antenna is located between the slot ground and the planar antenna structure.4. The apparatus of claim 1 , wherein:the antenna comprises a ground plane, a feed line, a slot ground, and a planar antenna structure;the first layer of the antenna is located between the ground plane and the feed line; anda second of the layers of the antenna comprises both a second effective medium and a second EBG medium, the second layer located between the slot ground and the planar antenna structure.5. The apparatus of claim 1 , wherein the antenna comprises:a first substrate between a feed line and a slot ground; anda second substrate covering a planar antenna structure.6. The apparatus of claim 5 , wherein the first layer comprises one of the first and second substrates.7. The ...

ADAPTABLE VEHICULAR FILM ANTENNA

An antenna has a flat support having two sections. Antenna structures carried on the support sections. A joint between the connections allows the two sections to be pivoted relative to each other. 1. An antenna comprising:a flat support,two antenna structure carried on the support,an antenna cable connected to the antenna structures, the support having two support sections and each carrying a respective one of the antenna structures.2. The antenna as set forth in claim 1 , wherein the angle between the two support sections is fixed and is between 60° and 100°.3. The antenna as set forth in claim 1 , further comprising:a joint connecting together the two support sections such that the angle can be varied.4. The antenna as set forth in claim 1 , wherein the two support sections are connected to one another at a presettable angle.5. The antenna as set forth in claim 1 , further comprising:antenna electronics on at least one of the two support sections, the antenna cable and the at least one antenna structure being electrically connected to the antenna electronics.6. The antenna as set forth in that claim 1 , wherein at least one of the support sections claim 1 , has an adhesive layer and a stripoff layer covering the adhesive layer before mounting of the antenna.7. A method of installing an antenna claim 1 , having a flat support carrying at least one antenna structure connected to an antenna cable claim 1 , the support having two support sections extending at an angle relative to each other claim 1 , the method comprising the steps of:applying the support sections to a target component in a final mounting position.8. The method as set forth in claim 7 , further comprising the step of:changing an angle between the two support sections is changed from a first angle to another angle, the other angle corresponding to the angle at which the two support sections are to be applied to the target component in the final mounting position relative to each other.9. The method as ...

PCB ANTENNA LAYOUT

A circuit board panel includes a plurality of circuit boards (PCB). One or more antenna boards () are formed in spare areas about the plurality of circuit boards (PCB). Antenna boards may also be coupled to circuitry on the circuit boards in a detachable manner. 1. A method comprising:laying out traces for multiple circuit boards on a circuit board panel;identifying spare areas on the panel;laying out traces for antenna boards in the spare areas of the panel; andforming the circuit boards and antenna boards on the panel.2. The method of claim 1 , wherein the antenna boards are formed in a column or row on the panel.3. The method of claim 2 , wherein the column or row is located between circuit boards.4. The method of claim 2 , wherein the column or row is located on an outer edge of the panel.5. The method of claim 1 , wherein antenna boards are formed in at least one column and at least one row on the panel.6. The method of claim 1 , wherein antenna boards are formed between four adjacent corners of circuit boards.7. The method of claim 6 , wherein the antenna boards are oriented at an angle from the circuit boards.8. The method of claim 1 , wherein the antenna boards are formed within a rectangular perimeter of the circuit board having an unused portion of the space bounded by the rectangular perimeter.9. The method of claim 8 , wherein at least one antenna board is formed such that it is detachable.10. The method of claim 9 , wherein the antenna board is partially routed or scored to provide detachability.11. The method of claim 9 , wherein the detachable antenna board is electrically coupled to circuitry on the circuit board until detached.12. The method of claim 11 , wherein the detachable antenna board is formed with pads to facilitate electrical connections to the circuit board after the detachable antenna board is detached.13. The method of claim 1 , wherein the antenna boards are formed in place of a circuit board in a rectangular matrix of circuit boards. ...

COMPACT MULTI-COLUMN ANTENNA

The invention provides an antenna arrangement having an operating frequency band with a mean wavelength λ and comprising at least two columns of antenna elements with at least two antenna elements in each column. Each column of antenna elements extends above a separate elongated column ground plane with a column separation defined as a distance between mid-points of neighbouring column ground planes. The antenna elements in each column are located along a column axis pointing in a longitudinal direction of the column ground plane wherein all column separations are below 0.9λ and wherein a parasitic element extends above at least one antenna element in each column. Parameters of the parasitic element are adapted for proper excitation thus achieving a reduced beamwidth for each of said columns of antennas. The invention also provides a method to manufacture the antenna arrangement. 1. An antenna arrangement having an operating frequency band with a mean wavelength I and comprising: at least two columns of antenna elements with at least two antenna elements in each column , each column of antenna elements extending above a separate elongated column ground plane with a column separation defined as a distance between midpoints of neighbouring column ground planes , the antenna elements in each column being located along a column axis pointing in a longitudinal direction of the column ground plane a parasitic element , such that all column separations are below 0.9I and the parasitic element extends above at least one antenna element in each column , the shape and dimensions of the parasitic element and the height of the parasitic element above the antenna element and above the column ground plane being adapted for proper excitation to achieve a reduced beamwidth for each of said columns of antennas.2. An antenna arrangement according to claim 1 , wherein the antenna elements are located in an antenna element plane being substantially parallel to the column ground planes. ...

Transmission line RF applicator for plasma chamber

A transmission line RF applicator apparatus and method for coupling RF power to a plasma in a plasma chamber. The apparatus comprises an inner conductor and one or two outer conductors. The main portion of each of the one or two outer conductors includes a plurality of apertures that extend between an inner surface and an outer surface of the outer conductor. 1. A transmission line RF applicator for coupling electrical power to a plasma outside the RF applicator , comprising:an outer conductor having a main portion extending between first and second end portions; andan inner conductor having a main portion extending between first and second end portions, wherein the main portion of the inner conductor is positioned within, and spaced away from, the main portion of the outer conductor; (i) an inner surface facing the main portion of the inner conductor,', '(ii) an outer surface, and', '(iii) a plurality of apertures that extend between the inner surface of the outer conductor and the outer surface of the outer conductor., 'wherein the main portion of the outer conductor includes2. The applicator of claim 1 , further comprising:a dielectric cover;wherein the main portion of each of said inner and outer conductors is positioned within the dielectric cover; andwherein the dielectric cover provides a gas seal around the main portion of each of said conductors such that gas cannot flow between the exterior of the dielectric cover and the main portion of either of said conductors.3. The applicator of claim 1 , wherein:the outer conductor has a tubular shape; andthe inner conductor and the outer conductor are positioned coaxially.4. A plasma chamber comprising:a vacuum enclosure that encloses an interior of the plasma chamber;a dielectric cover having a main portion extending between first and second end portions, wherein the main portion of the dielectric cover is positioned within said interior of the plasma chamber;an outer conductor having a main portion extending ...

FILM-LIKE MEMBER AND ATTACHING METHOD THEREOF

An attaching method of attaching a film-like member shaped like a plane face to a member having a surface shaped like a curved face including a first step of determining, by an analysis, a region where stress higher than that in a case where the film-like member is shaped like the plane face is generated when the film-like member is attached to the member shaped like the curved face, a second step of forming a slit at the region where the stress higher than that in the case where the film-like member is shaped like the plane face is generated, and a third step of attaching the film-like member having the formed slit to the member having the surface shaped like the curved face. 1. An attaching method of attaching a film-like member shaped like a plane face to a member having a surface shaped like a curved face , the attaching method comprising:a first step of determining, by an analysis, a region where stress higher than that in a case where the film-like member is shaped like the plane face is generated when the film-like member is attached to the member shaped like the curved face;a second step of forming a slit at the region where the stress higher than that in the case where the film-like member is shaped like the plane face is generated; anda third step of attaching the film-like member having the formed slit to the member having the surface shaped like the curved face.2. The attaching method according to claim 1 ,wherein, in the first step, the region where the stress higher than that in the case where the film-like member is shaped like the plane face is generated is determined by an FEM analysis.3. The attaching method according to claim 1 ,wherein, in the third step, another member having a surface shaped like the curved surface is provided so that a number of the members become two, and the film-like member is interposed between the two members having the surface shaped like the curved face.4. A film-like member shaped like a plane face to be attached to a ...

HYBRID ANTENNAS FOR ELECTRONIC DEVICES

A portable electronic device is provided that has a hybrid antenna. The hybrid antenna may include a slot antenna structure and an inverted-F antenna structure. The slot antenna portion of the hybrid antenna may be used to provide antenna coverage in a first communications band and the inverted-F antenna portion of the hybrid antenna may be used to provide antenna coverage in a second communications band. The second communications band need not be harmonically related to the first communications band. The electronic device may be formed from two portions. One portion may contain conductive structures that define the shape of the antenna slot. One or more dielectric-filled gaps in the slot may be bridged using conductive structures on another portion of the electronic device. A conductive trim member may be inserted into an antenna slot to trim the resonant frequency of the slot antenna portion of the hybrid antenna. 1. An antenna for an electronic device , wherein the antenna has a resonant frequency , comprising:at least one conductive structure that forms an antenna resonating element; andat least one removable conductive resonant frequency trim member that is mounted to the conductive structure, wherein the removable conductive resonant frequency trim member is configured to tune the resonant frequency of the antenna.2. The antenna defined in claim 1 , wherein the removable conductive resonant frequency trim member comprises conductive foam.3. The antenna defined in claim 2 , further comprising:adhesive interposed between the conductive foam and the at least one conductive structure.4. The antenna defined in claim 1 , wherein the at least one conductive structure forms an antenna slot and wherein the removable conductive resonant frequency trim member is mounted within the antenna slot.5. The antenna defined in claim 4 , wherein the at least one conductive structure that forms the antenna slot comprises a bezel for the electronic device.6. The antenna defined in ...

DEPOSITION ANTENNA APPARATUS AND METHODS

Space- and cost-efficient antenna apparatus and methods of making and using the same. In one embodiment, the antenna is formed using a deposition process, whereby a conductive fluid or other material is deposited directly on one or more interior components of a host device (e.g., cellular phone or tablet computer). The antenna can be formed in a substantially three-dimensional “loop” shape, and obviates several costly and environmentally unfriendly processing steps and materials associated with prior art antenna manufacturing approaches. 1. Antenna apparatus , comprising:a conductor deposited on a component of a portable device, wherein the conductor is formed using the process comprising:depositing a conductive flowable substance onto said component in a desired pattern; andcuring said deposited flowable substance so as to render the flowable substance substantially non-flowable.2. The antenna apparatus of claim 1 , wherein the conductor comprises a wire-like form factor substantially enclosing a central region having no conductive substance therein.3. The antenna apparatus of claim 1 , wherein the curing comprises using at least one of electromagnetic radiation or heat claim 1 , and the depositing comprises depositing using an electrically controlled print head.4. The antenna apparatus of claim 1 , wherein the conductor comprises a wire-like form factor substantially enclosing a central region claim 1 , the component comprising a plurality of electrical components disposed substantially within the central region.5. Antenna apparatus claim 1 , comprising a structure formed by deposition of a conductive flowable material and having at least one variation in at least one of a (i) cross-sectional shape and/or (ii) a cross-sectional area.6. The apparatus of claim 5 , wherein the structure comprises a substantially wire-like form factor claim 5 , and the variation in at least one of a (i) cross-sectional shape and/or (ii) a cross-sectional area comprises variation in ...

ANTENNA DEVICE AND METHOD OF SETTING RESONANT FREQUENCY OF ANTENNA DEVICE

In antenna device, a coil conductor of an antenna coil module and a conductor layer at least partially overlap. A current flows in the conductor layer to block a magnetic field generated by a current flowing in the coil conductor. A current flows along the periphery of a slit and around the periphery of the conductor layer due to a cut-edge effect. Since magnetic flux does not pass through the conductor layer, magnetic flux attempts to bypass the conductor layer along a path in which the conductor opening of the conductor layer is on the inside and the outer edge of the conductor layer is on the outside. As a result, the magnetic flux generates large loops that link the inside and the outside of a coil conductor of an antenna on a reader/writer side to couple an antenna device and the antenna on the reader/writer side. 1. An electronic appliance comprising:a casing;an antenna device disposed in the casing;a coil conductor having a loop shape or a spiral shape in which a winding center portion defines a coil opening; anda conductor layer that is arranged on a side closer to an antenna on a communication partner side than a location of the coil conductor; whereinthe conductor layer includes a conductor opening and a slit, the slit connecting the conductor opening and an outer edge of the conductor layer, and the slit extending towards an edge surface of the casing; andwhen the coil conductor is viewed in plan view, the coil conductor and conductor layer are superposed one on top of the other.2. The electronic appliance according to claim 1 , wherein the slit in the conductor layer is provided in a portion of the conductor layer at which a distance from the conductor opening to the edge surface of the casing is less than half of a length or width of the casing.3. The electronic appliance according to claim 1 , wherein the slit in the conductor layer is provided in a portion of the conductor layer which is adjacent to the edge surface of the casing.4. The electronic ...

Apparatus and Method for Electromagnetic Wave Structure Modulation

Electromagnetic wave structure modulation apparatus comprises an encoded device that has an electromagnetic wave-transparent material having a three-dimensional volume and electromagnetic wave-opaque walls, and a plurality of electromagnetic wave-opaque projections projecting into the electromagnetic wave-transparent material. The apparatus further comprises an interrogating device that has a transceiver operable to transmit an electromagnetic wave into the electromagnetic wave-transparent material, the electromagnetic wave being modulated and reflected by the electromagnetic wave-opaque walls and projections, an antenna operable to receive the reflected electromagnetic waves, and a decoder operable to decode the received reflected electromagnetic waves. 1. Electromagnetic wave structure modulation apparatus , comprising: an electromagnetic wave-transparent material having a three-dimensional volume and electromagnetic wave-opaque walls;', 'a plurality of electromagnetic wave-opaque projections projecting into the electromagnetic wave-transparent material;, 'an encoded device comprising a transceiver operable to transmit an electromagnetic wave into the electromagnetic wave-transparent material, the electromagnetic wave being modulated and reflected by the electromagnetic wave-opaque walls and projections;', 'an antenna operable to receive the reflected electromagnetic waves; and', 'a decoder operable to decode the received reflected electromagnetic waves., 'an interrogating device comprising2. Electromagnetic wave structure modulation method , comprising: an electromagnetic wave-transparent material having a three-dimensional volume and electromagnetic wave-opaque walls;', 'a plurality of electromagnetic wave-opaque projections projecting into the electromagnetic wave-transparent material and operable to modulate the modulated electromagnetic wave; and', 'a reflector reflecting the modulated electromagnetic wave;, 'generating and directing an electromagnetic wave ...

MINIMAL INTRUSION VERY LOW INSERTION LOSS TECHNIQUE TO INSERT A DEVICE TO A SEMI-RIGID COAXIAL TRANSMISSION LINE

A signal conditioning apparatus can include a coaxial cable having at least one slot formed therein. A conductive film can be applied to the coaxial cable so as to cover each slot. A device mounting surface can be formed within the slot and a protection device can be mounted on the device mounting surface. A housing consisting of one or more interlockable portions can be coupled to the coaxial cable. 1. A signal conditioning apparatus , comprising:a coaxial cable comprising at least one slot formed therein, each slot extending to a conductive core of the coaxial cable; anda conductive film applied to the coaxial cable such that the conductive film at least substantially covers the at least one slot.2. The signal conditioning apparatus of claim 1 , further comprising a material applied within the at least one slot to form a device mounting surface.3. The signal conditioning apparatus of claim 2 , wherein the material comprises nickel-gold.4. The signal conditioning apparatus of claim 2 , wherein the material is applied by way of a plating operation.5. The signal conditioning apparatus of claim 1 , wherein the conductive film comprises nickel claim 1 , gold claim 1 , or copper.6. The signal conditioning apparatus of claim 1 , further comprising a protective housing to cover the conductive film.7. The signal conditioning apparatus of claim 6 , wherein the housing comprises two portions configured to interlock with each other so as to remain fixedly coupled with the coaxial cable.8. The signal conditioning apparatus of claim 2 , further comprising a protective device mounted to the device mounting surface.9. The signal conditioning apparatus of claim 8 , wherein the protective device comprises an electrostatic discharge diode.10. The signal conditioning apparatus of claim 1 , wherein the coaxial cable is at least semi-rigid.11. A method claim 1 , comprising:forming at least a first slot within a coaxial cable, the first slot extending to a conductive core of the coaxial ...

METHOD FOR PRODUCING AN RFID TRANSPONDER

A method for producing an RFID transponder. An RFID chip is attached onto a conductive sheet. A portion of an antenna element is cut from the conductive sheet using a laser beam after the RFID chip has been attached to the conductive sheet. 122-. (canceled)23. A method for producing an RFID transponder , the method comprising:attaching an RFID chip onto a conductive sheet; andcutting a portion of an antenna element from the conductive sheet using a laser beam after the RFID chip has been attached to the conductive sheet.24. The method according to claim 23 , further comprising:forming a first electrical connection between a first contact element of the chip and the conductive sheet;forming a second electrical connection between a second contact element of the chip and the conductive sheet; andcutting a region of the conductive sheet located between said contact elements by at least one of heating or ablating the conductive material of the sheet with the laser beam after the electrical connections have been formed.25. The method according to claim 24 , wherein the laser beam is arranged to propagate through a groove cut in the conductive sheet such that an intensity of laser radiation at a surface of the chip is smaller than 10% of a maximum intensity of the laser beam during cutting the region of the conductive sheet located between said contact elements.26. The method according to claim 25 , wherein a part of the laser radiation impinges on the surface of the chip claim 25 , and the intensity of the laser radiation impinging on the surface of the chip is limited to be smaller than or equal to 10% of the maximum intensity of the laser beam impinging on the conductive sheet.27. The method according to claim 25 , wherein a divergence angle of the laser beam and a distance between the conductive sheet and the chip have been selected such that a width of an area of the chip exposed to laser radiation is greater than three times a width of the laser spot on the ...

WAVEGUIDE DEVICE, COMMUNICATION MODULE, METHOD OF PRODUCING WAVEGUIDE DEVICE AND ELECTRONIC DEVICE

An electronic device includes a central control unit and a waveguide device. The waveguide device includes a high-frequency signal waveguide for transmitting a high-frequency signal emitted from a communication module having a communication function, and an attachment/detachment unit capable of attaching/detaching the communication module so that coupling between the high-frequency signal waveguide and the high-frequency signal is possible. The communication module includes a communication device and a transfer structure configured to cause the high-frequency signal emitted from the communication device to be transferred to the high-frequency signal waveguide of the waveguide device. 1. A waveguide device comprising:a high-frequency signal waveguide configured to transmit a high-frequency signal emitted from a module having a communication function; andan attachment/detachment unit capable of attaching/detaching the module so that coupling between the high-frequency signal waveguide and the high-frequency signal is possible.2. The waveguide device according to claim 1 , wherein the attachment/detachment unit is provided at a plurality of positions.3. The waveguide device according to claim 1 , wherein a plurality of high-frequency signal waveguides are coupled to the attachment/detachment unit.4. The waveguide device according to claim 3 , wherein a plurality of high-frequency signal waveguides do not come in contact with the attachment/detachment unit.5. The waveguide device according to claim 1 , wherein the high-frequency signal waveguide is decoupled in the attachment/detachment unit.6. The waveguide device according to claim 4 , wherein a relay module having a data relay function is provided in the attachment/detachment unit in which the high-frequency signal waveguide is decoupled.7. The waveguide device according to claim 1 , wherein each high-frequency signal waveguide includes a plurality of independent transmission paths.8. The waveguide device according ...

APERTURE-COUPLED MICROSTRIP ANTENNA AND MANUFACTURING METHOD THEREOF

An aperture-coupled microstrip antenna and a manufacturing method thereof are provided. The aperture-coupled microstrip antenna includes a radiating patch including an aperture, and a ground plane disposed below the radiating patch. The aperture-coupled microstrip antenna further includes a shorting wall connecting the radiating patch with the ground plane, and a microstrip feeder configured to apply electromagnetic waves to the aperture. 1. An aperture-coupled microstrip antenna comprising:a radiating patch comprising an aperture;a ground plane disposed below the radiating patch;a shorting wall connecting the radiating patch with the ground plane; anda microstrip feeder configured to apply electromagnetic waves to the aperture.2. The aperture-coupled microstrip antenna of claim 1 , wherein the microstrip feeder is disposed between the radiating patch and the ground plane.3. The aperture-coupled microstrip antenna of claim 1 , wherein the radiating patch claim 1 , the ground plane claim 1 , and the shorting wall are integrally formed.4. The aperture-coupled microstrip antenna of claim 3 , wherein the radiating patch claim 3 , the ground plane claim 3 , and the shorting wall are folded.5. The aperture-coupled microstrip antenna of claim 1 , wherein the radiating patch claim 1 , the ground plane claim 1 , and the shorting wall comprise respective surfaces of the aperture-coupled microstrip antenna.6. The aperture-coupled microstrip antenna of claim 1 , wherein a portion of the microstrip feeder overlaps with a remaining portion of the microstrip feeder.7. The aperture-coupled microstrip antenna of claim 1 , wherein the radiating patch claim 1 , the ground plane claim 1 , and the shorting wall comprise a flexible printed circuits board (FPCB).8. The aperture-coupled microstrip antenna of claim 1 , wherein the radiating patch claim 1 , the ground plane claim 1 , and the shorting wall comprise a material comprising a loss tangent of less than 0.025.9. The aperture- ...

STRUCTURE HAVING NANOANTENNA AND METHOD FOR MANUFACTURING SAME

The present invention relates to a structure having a nanoantenna, a method for manufacturing same, a drug delivery body having the same, a thermotherapy complex, a drug therapy device, and a thermotherapy device. The structure of the present invention has a nanoantenna pattern formed on the outer surface of a porous micro-container, thereby enabling wireless control from the outside, and when the structure is used as a drug delivery system and a thermotherapy complex, drug therapy and thermotherapy can be carried out at a desired application region inside a living body at a desired time. Also, the structure of the present invention enables transmission and reception of a wireless signal with an external controller through the nanoantenna, thereby enabling the detection of a signal inside the living body and the transmission of the signal to the external controller, and the discharge of a drug or nanowires according to a response signal transmitted from the external controller. 136-. (canceled)37. A structure , comprising:a porous micro-container; anda nanoantenna pattern formed on an outer surface of the porous micro-container,wherein the nanoantenna pattern is formed to have an array of one or more nanoantennas which are arranged at regular intervals.38. The structure of claim 37 , wherein a basic framework of the porous micro-container consists of at least one metal selected from the group consisting of Ni claim 37 , Fe claim 37 , Cu claim 37 , Zn claim 37 , Au claim 37 , an alloy thereof claim 37 , and a metal coated with Au or a parylene polymer.39. The structure of claim 37 , wherein a solder hinge is attached to an inner edge of the porous micro-container.40. The structure of claim 37 , wherein the volume of the porous micro-container is 10 μmto 64 claim 37 ,000 claim 37 ,000 μm.41. The structure of claim 37 , wherein the regular intervals are 10 nm to 300 nm.42. The structure of claim 37 , wherein the nanoantenna includes a conductive material.43. The ...

ELECTROMAGNETIC COUPLING STRUCTURE, MULTILAYERED TRANSMISSION LINE PLATE, METHOD FOR PRODUCING ELECTROMAGNETIC COUPLING STRUCTURE, AND METHOD FOR PRODUCING MULTILAYERED TRANSMISSION LINE PLATE

This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole. 1. An electromagnetic coupling structure used in a frequency band of a microwave zone , the electromagnetic coupling structure comprising:a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers that are a plurality of ground layers;one pair of outer dielectric layers that face each other with the laminated body interposed between the outer dielectric layers; andone pair of outer conductive layers that face each other with the one pair of outer dielectric layers interposed between the outer conductive layers,wherein each one of the one pair of outer conductive layers includes a wiring portion and a conductive patch portion disposed at a front end of the wiring portion,the conductive patch portion has a portion longer than the wiring portion in a direction perpendicular to an extending direction of the wiring portion,a hole passing through the inner dielectric layer and the inner conductive layers that are the plurality of ground layers is formed in the laminated body, andthe one pair of outer conductive ...

Self Keying and Orientation System for a Repeatable Waveguide Calibration and Connection

The self-keying waveguide interconnection system for repeatable waveguide calibration and connection comprises a plug with a centrally disposed aperture, a jack provided with a counterbore to accept a plug diameter. The jack includes a plurality of self-keying channels. A shim having a shape complementary to the plurality of self keying thru slots has a plurality of self keying thru slots for aligning the centrally disposed aperture of the plug to the centrally disposed aperture of the jack. The system identifies the orientation and flange face polarity of the line or adapter without the use of alignment pins as two or more of these independent waveguide interfaces are coupled. In use, the device functions as a self-keying shim/spacer/adapter for a calibration kit or adapter in waveguide sections. 1. A self keying waveguide interconnection system for repeatable waveguide calibration and connection comprising:a first member, the first member being a plug component provided with a protruding surface having a centrally disposed aperture therethrough for a connection to a first duct;a second member, the second member being a jack provided with a counterbore complimentary to the protruding surface to accept a plug diameter, the second member comprising a plurality of self keying channels, the counterbore comprising a centrally disposed aperture therethrough for connection to a second duct to join the first duct to the second duct; anda shim having a shape complementary to the plurality of self keying thru channels and having dimensions to position within the counterbore and a plurality of self keying thru slots, the shim having a centrally disposed aperture therethrough for aligning the centrally disposed aperture of the first member to the centrally disposed aperture of the second member, the shim having a width less than a counterbore depth;whereby the shim accurately fits onto the counterbore and the self keying thru slots of the second member to align the centrally ...

ANTENNA AND METHOD FOR MANUFACTURING THE SAME

An antenna according to an embodiment includes a structure, and an antenna pattern on the structure, wherein the antenna pattern includes a feeding structure and a radiator integrated with the feeding structure for radiating a signal provided from the feeding structure to an outside. 1. An antenna comprising:a structure; andan antenna pattern on the structure,wherein the antenna pattern includes a feeding structure and a radiator integrated with the feeding structure for radiating a signal provided from the feeding structure to an outside.2. The antenna of claim 1 , wherein the feeding structure includes a feeder for providing a signal; anda closed loop formed by a capacitive device and a conductive line.3. The antenna of claim 1 , wherein the feeding structure includes a feeder for providing a signal;a first closed loop formed by a first capacitive device and a conductive line; anda second closed loop formed by the first capacitive device, a second capacitive device and a conductive line.4. The antenna of claim 1 , wherein the structure includes a back cover of an apparatus to which the structure is applied.5. The antenna of claim 1 , wherein the radiator is attached to a first surface of the structure claim 1 , and the feeding structure is attached to a second surface of the structure which is different from the first surface.6. A method for manufacturing an antenna claim 1 , the method comprising:printing an antenna pattern on a plate;mounting a capacitive device on the printed antenna pattern;cutting the antenna pattern on which the capacitive device is mounted; andattaching the cut antenna pattern to an injection molded structure,wherein the printing of the antenna pattern comprises printing an antenna pattern which includes a feeding structure and a radiator integrated with the feeding structure for radiating a signal provided from the feeding structure to an outside.7. The method of claim 6 , wherein the structure includes a back cover of an apparatus to ...

PLANAR BALUN TRANSFORMER DEVICE

An electric transformer device (balun) is formed on a support plate having a first base face and an opposite second base face. The balun includes a first port () connectable to an electrical line for a differential signal and a second port connectable to an electrical line for a single-ended signal. A first printed conductive track is associated to the first base face of the support plate for connecting the first port to the second port. A printed conductive path is associated to the second base face of the support plate for connecting the first port to the second port. The printed conductive path is formed of a symmetric second and third printed conductive tracks. 1. An electric transformer device configured to adapt an electrical line for differential signal to an electrical line for single-ended signal , comprising:a support plate having a first base face and an opposite second base face;a first port connectable to the electrical line for differential signal;a second port connectable to the electrical line for single-ended signal;a first printed conductive track associated to said first base face of the support plate for connecting said first port to said second port; anda printed conductive path associated to said second base face of the support plate for connecting said first port to said second port.2. The electric transformer device according to claim 1 , wherein said printed conductive path comprises a second and a third conductive track claim 1 , each of which is configured to connect said first port to said second port.3. The electric transformer device according to claim 2 , wherein said first claim 2 , second and third conductive tracks are metal tracks made of copper.4. The electric transformer device according to claim 3 , wherein said conductive tracks are obtained by means of a selective chemical removal operation of the copper from a copper sheet that is secured on each of said first and second base faces of the support plate.5. The electric ...

MICROWAVE RESONATOR WITH IMPEDANCE JUMP, NOTABLY FOR BAND-STOP OR BAND-PASS MICROWAVE FILTERS

A microwave resonator with impedance jump, comprises at least one line of high characteristic impedance of a determined length and one line of low characteristic impedance, at least the line of high characteristic impedance comprising a first line cut, a first link wire of a first determined impedance ensuring an electrical link for the passage of the signal from one side to the other of the first line cut. A method for producing a microwave resonator comprising an adjustment step is also provided. 1. A microwave resonator with impedance jump , comprising at least one line of high characteristic impedance of a determined length and one line of low characteristic impedance , at least the line of high characteristic impedance comprising a first line cut , a first link wire of a determined length ensuring a determined impedance at the first line cut , said first line cut being produced substantially at one third of the overall length of the microwave resonator starting from the side of an end of the line of high characteristic impedance opposite to the end of the line of high characteristic impedance situated on the side of the line of low characteristic impedance.2. The microwave resonator according to claim 1 , wherein it comprises a second line cut claim 1 , a second link wire of a second determined impedance ensuring an electrical link for the passage of the signal from one side to the other of the second line cut.3. The microwave resonator according to claim 2 , wherein the second line cut is situated between a line with high characteristic impedance and a line with low characteristic impedance.4. The microwave resonator according to claim 1 , wherein said first line cut is produced substantially at mid-length of the line with high characteristic impedance.5. The microwave resonator according to claim 1 , wherein said at least one line of high characteristic impedance and one line of low characteristic impedance are produced in the form of metal tracks printed on ...

Printed circuit board and diplexer circuit

A printed circuit board 100 for forming a diplexer circuit 200 comprising a first connector 110 for connecting a first filter 112 and second connector 120 for connecting a second filter 122 , wherein the first connector 110 and the second connector 120 are located on opposite sides of the printed circuit board 100.

METHOD FOR MANUFACTURING QUARTZ CRYSTAL RESONATOR, QUARTZ CRYSTAL UNIT AND QUARTZ CRYSTAL OSCILLATOR

In a method for manufacturing a quartz crystal resonator, the method comprising the steps of: forming a quartz crystal tuning fork resonator having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines; forming at least one groove in at least one of opposite main surfaces of each of the first and second quartz crystal tuning fork tines so that a width of the at least one groove is greater than a distance in the width direction of the at least one groove measured from an outer edge of the at least one groove to an outer edge of the corresponding one of the first and second quartz crystal tuning fork tines; and forming a metal film on at least one of the opposite main surfaces of the first and second quartz crystal tuning fork tines so that an oscillation frequency of the quartz crystal tuning fork resonator is lower than 32.768 kHz. 1. A method for manufacturing a quartz crystal resonator , comprising the steps of:forming a quartz crystal tuning fork resonator having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines connected to the quartz crystal tuning fork base, each of the first and second quartz crystal tuning fork tines having opposite main surfaces and opposite side surfaces;forming at least one groove in at least one of the opposite main surfaces of each of the first and second quartz crystal tuning fork tines so that a width of the at least one groove formed in the at least one of the opposite main surfaces of each of the first and second quartz crystal tuning fork tines is greater than a distance in the width direction of the at least one groove measured from an outer edge of the at least one groove to an outer edge of the corresponding one of the first and second quartz crystal tuning fork tines; andforming a metal film on at least one of the opposite main surfaces of the first and second quartz crystal tuning fork tines so that an oscillation frequency of the quartz crystal tuning ...

GROUND RADIATION ANTENNA

A ground radiation antenna is disclosed. Herein, the ground radiation antenna provides a radiator-forming circuit, which is formed to have a simple structure using a capacitive element, as well as a feeding circuit suitable for the provided radiator-forming circuit. Thus, the structure of the antenna becomes simpler and the size of the antenna becomes smaller. Accordingly, the fabrication process of the antenna is simplified, thereby largely reducing the fabrication cost. 126-. (canceled)27. An antenna comprising:a ground area formed on a circuit board;a clearance area formed within the ground area, wherein the ground area and the clearance area are formed on a substantially same plane and at least one side of the clearance area does not border the ground area;a first conductor line formed in the clearance area, both ends of the first conductor line being connected to the ground area, the first conductor line comprising at least one capacitor;a feeding part, provided on the circuit board, comprising a feeding transmission line and a feeding source; anda second conductor line formed in an area within the clearance area which is surrounded by the first conductor line and the ground area, wherein a first end of the second conductor line is connected to the ground area and a second end of the second conductor line is connected to an end of the transmission line.28. The antenna of claim 27 , wherein the capacitor is a chip-capacitor.29. The antenna of claim 27 , wherein the clearance area has a rectangular shape.30. The antenna of claim 29 , wherein at least one side of the rectangular clearance area does not border the ground area.31. The antenna of claim 27 , wherein the second conductor line is a straight line.32. The antenna of claim 27 , wherein the second conductor line directly connects the first conductor line and the feeding part without any lumped element.33. The antenna of claim 27 , wherein the second conductor line includes at least one inductive element.34. ...

Foil Laminate Intermediate and Method of Manufacturing

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies. 1. A method of making a conductive metal foil laminate , comprising the steps of:providing a substrate having first and second sides;applying an adhesive pattern to the first side of the substrate;providing a metal foil having first and second sides such that the second side of the foil is in contact with the adhesive;cutting a first pattern in the metal foil coincident with the adhesive pattern to create a first conductive foil pattern and a matrix; andremoving the matrix from the first conductive foil pattern.2. The method as recited in claim 1 , wherein the adhesive includes an optical brightener.3. The method as recited in claim 1 , wherein a second pattern is cut in the metal foil to create a second conductive foil pattern coincident with the first pattern.4. The method as recited in claim 1 , including a further step of removing a matrix after cutting of the second pattern.5. The method as recited in claim 1 , wherein the cutting of the first and second pattern is accomplished by a laser.6. The method as recited in claim 1 , including a further step of deadening portions of the adhesive in areas outside of the first and second patterns in the metal foils after the step of applying the adhesive.7. The method as recited in claim 1 , wherein the first pattern in the metal foil is created with a 100 micron wide trace.8. The method of claim 2 , wherein the optical brighteners are ...

TRANSMISSION LINE AND METHODS FOR FABRICATING THEREOF

A transmission line comprising a transmission medium defined by a plurality of dielectric layers, wherein the dielectric layers include a first layer having a first dielectric constant, a second layer having a second dielectric constant and a third layer having a third dielectric constant being less than the first and second dielectric constant. 1. A transmission line comprising: a first layer having a first dielectric constant;', 'a second layer having a second dielectric constant and', 'a third layer having a third dielectric constant being less than the first and second dielectric constant., 'a transmission medium defined by a plurality of dielectric layers, wherein the dielectric layers include2. A transmission line in accordance with claim 1 , wherein the third layer is disposed between the first and second layer.3. A transmission line in accordance with claim 1 , wherein each of the dielectric layers is non-metallic.4. A transmission line in accordance with claim 1 , wherein the transmission medium is arranged to transmit a wave signal.5. A transmission line in accordance with claim 4 , wherein the wave signal is an electromagnetic signal with a frequency range in a microwave range claim 4 , a millimeter-wave range or a submillimeter-wave range.6. A transmission line in accordance with claim 1 , wherein the first dielectric constant is equal to the second dielectric constant.7. A transmission line in accordance with claim 1 , wherein the first layer is a strip.8. A transmission line in accordance with claim 7 , wherein:the first and second dielectric constant is 10.2;the third dielectric constant is 2.94;the first and second layer have a thickness of 1.27 mm;the third layer has a thickness of 0.381 mm;the strip has a width of 5 mm; andthe second and third layer have a width of 50 mm.9. A transmission line in accordance with claim 1 , wherein the third layer is a layer of air defined by a gap between the first and second layer.11. A wave guide comprising: a ...

TRANSFERRING AN ANTENNA TO AN RFID INLAY SUBSTRATE

Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites. 1. A method of making a transponder comprising an inlay substrate , an RFID chip and an antenna structure , characterized by:forming a wide trench in the inlay substrate for accepting the antenna structure; andafter forming the trench, disposing the antenna structure in the trench.2. The method of claim 1 , wherein:the trench is several times wider than a cross-dimension of a single turn of the antenna structure.3. The method of claim 1 , wherein:the trench is approximately as deep as the cross-dimension of a single turn of the antenna structure.4. The method of claim 1 , wherein:the antenna structure comprises a wire, a foil or a ribbon.5. The method of claim 1 , wherein:turns of the antenna structure are laid into the trench sequentially, turn-by-turn.6. The method of claim 1 , wherein;the turns of the antenna structure are scribed into the trench using a sonotrode tool.7. The method of claim 1 , wherein:the antenna structure is preformed, and disposed as a single unit into the trench.8. The method of claim 1 , further comprising:connecting end portions of the antenna structure with terminals of the chip.9. The method of claim 1 , further comprising:dispensing glue in the trench.10. The method of ...

METHODS AND SYSTEMS FOR MEMS CMOS-BASED RADIO FREQUENCY FILTERS HAVING ARRAYS OF ELEMENTS

Systems and methods for manufacturing a chip comprising a MEMS-based radio frequency filter arranged in an integrated circuit are provided. In one aspect, the systems and methods provide for a chip including electronic elements formed on a semiconductor material substrate. The chip further includes a stack of interconnection layers including layers of conductor material separated by layers of dielectric material. A radio frequency filter is formed within the stack of interconnection layers by applying gaseous HF to the interconnection layers. The radio frequency filter includes a plurality of mechanically decoupled resonator elements. 1. A method for manufacturing a chip comprising a MEMS-based radio frequency filter arranged in an integrated circuit comprising:forming electronic elements on a semiconductor material substrate;forming, above the semiconductor material substrate, a stack of interconnection layers including a plurality of layers of conductor material, each layer separated by a layer of dielectric material; andforming a radio frequency filter within the stack of interconnection layers by applying gaseous HF to the interconnection layers, wherein the radio frequency filter includes a plurality of mechanically decoupled resonator elements.2. The method of claim 1 , wherein the chip is manufactured using a 180 nm or lower CMOS process.3. The method of claim 2 , wherein the chip is manufactured using one of a 22 nm CMOS process claim 2 , a 32 nm CMOS process claim 2 , a 45 nm CMOS process claim 2 , and a 65 nm CMOS process.4. The method of claim 1 , wherein the radio frequency filter includes a sensor array of mechanically decoupled resonator elements claim 1 , wherein the sensor array is configured to collectively operate as a radio frequency filter.5. The method of claim 4 , wherein the sensor array comprises about 60 to about 200 resonator elements.6. The method of claim 4 , wherein the sensor array is densely formed in a small area of the ...

CONFORMAL MM-WAVE PHASED ARRAY ANTENNA WITH INCREASED SCAN COVERAGE

A system according to one embodiment includes a phased array antenna comprising a plurality of slot loop antenna elements, the plurality of slot loop antenna elements configured in a planar array disposed on a flexible dielectric substrate, wherein each of the plurality of slot loop antenna elements generates a beam pattern orthogonal to the plane of the planar array; and driver circuitry coupled to each of the plurality of antenna elements, wherein the driver circuitry comprises a plurality of transceivers, the plurality of transceivers configured to provide independently adjustable phase delay to each of the plurality of slot loop antenna elements. 1. A system , comprising:a phased array antenna comprising a plurality of slot loop antenna elements, said plurality of slot loop antenna elements configured in a planar array disposed on a flexible dielectric substrate, wherein each of said plurality of slot loop antenna elements is configured to generate a beam pattern orthogonal to the plane of said planar array; anddriver circuitry coupled to each of said plurality of antenna elements, wherein said driver circuitry comprises a plurality of transceivers, said plurality of transceivers configured to provide independently adjustable phase delay to each of said plurality of slot loop antenna elements.2. The system of claim 1 , wherein said orthogonal beam pattern is oriented with a central axis that deviates from a normal to said plane by less than 5 degrees.3. The system of claim 1 , wherein said slot loop antenna element has a major axis and a minor axis and a ratio of the length of said major axis to the length of said minor axis is selected such that said beam pattern provides omni-directional spatial coverage above said plane.4. The system of claim 1 , wherein said slot loop antenna element is configured as a circular loop.5. The system of claim 1 , wherein said slot loop antenna element is configured as a rectangular loop.6. The system of claim 1 , wherein said ...

ELECTROMAGNETIC INTERFACE USING INDIRECT COMPRESSION FORCE

In an example embodiment, an electromagnetic interface can comprise: a first component comprising a first waveguide channel, a first interface surface, and a first force transfer feature; a second component comprising a second waveguide channel, a second interface surface, and a second force transfer feature; and a fastener that can be configured to force the first force transfer feature in sliding engagement with the second force transfer feature. The first and second force transfer features can be configured to interoperate to create an indirect force holding the first interface surface in contact with the second interface surface and holding the first waveguide channel in alignment with the second waveguide channel. 1. An electromagnetic interface comprising:a first component comprising a first waveguide channel, a first interface surface, and a first force transfer feature;a second component comprising a second waveguide channel, a second interface surface, and a second force transfer feature; anda fastener configured to force the first force transfer feature in sliding engagement with the second force transfer feature, wherein the first and second force transfer features are configured to interoperate to create an indirect force holding the first interface surface in contact with the second interface surface and holding the first waveguide channel in alignment with the second waveguide channel.2. The electromagnetic interface of claim 1 , wherein the first component is a waveguide and the second component is a chassis.3. The electromagnetic interface of claim 1 , further comprising a slot hole in the first component claim 1 , and a threaded hole in the second component claim 1 , and wherein the fastener is a threaded bolt configured to pass through the slot hole in the first component and to engage the threaded hole in the second component to apply the indirect force.4. The electromagnetic interface of claim 1 , wherein at least one of the first force transfer ...

Waveguide Polarizers

A method and apparatus for a polarizer. The apparatus comprises a dielectric rod, a first array of slots, and a second array of slots. The first array of slots and the second array of slots are formed in sidewalls of the dielectric rod. The first array of slots is substantially opposite to the second array of slots. The first array of slots and the second array of slots are configured to shift a first component orthogonal to a second component in a signal traveling through the dielectric rod by around 90 degrees with respect to each other. The dielectric rod may be a solid material or comprised of layers of dielectric substrates with metal tabs. 17-. (canceled)8. An apparatus comprising:a cylinder of dielectric substrates stacked in layers, wherein the cylinder of dielectric substrates has walls with edge metal plating on the walls;a first array of conductive tabs joined to a portion of the edge metal plating; anda second array of conductive tabs substantially opposite to the first array of conductive tabs and joined to a portion of the edge metal plating, wherein the first array of conductive tabs and the second array of conductive tabs are configured to shift a first component orthogonal to a second component in a signal traveling through the cylinder of dielectric substrates by around 90 degrees with respect to each other.9. The apparatus of further comprising:a plurality of arrays of vias arranged in a ring through the cylinder of dielectric substrates surrounding the first array of conductive tabs and the second array of conductive tabs, wherein vias in each array of vias in the plurality of arrays of vias are electrically connected to each other.10. The apparatus of claim 8 , wherein the first array of conductive tabs has different spacing and wherein the second array of conductive tabs has different spacing.11. The apparatus of claim 8 , wherein at least a portion of the first array of conductive tabs has a different size and at least a portion of the second ...

COMMUNICATION SYSTEM WITH ANTENNA CONFIGURATION AND METHOD OF MANUFACTURE THEREOF

A communication system includes: a ceramic housing; and a ceramic antenna device attached to the ceramic housing. 1. A communication system comprising:a ceramic housing; anda ceramic antenna device attached to the ceramic housing.2. The system as claimed in further comprising an adhesive between the ceramic housing and the ceramic antenna device for attaching the ceramic antenna device and the ceramic housing.3. The system as claimed in further comprising an additional ceramic-material between the ceramic housing and the ceramic antenna device for attaching the ceramic antenna device and the ceramic housing.4. The system as claimed in wherein the ceramic antenna device is embedded into the ceramic housing.5. The system as claimed in wherein:the ceramic housing having a housing-processing temperature associated therewith for processing the ceramic housing; andthe ceramic antenna device having an antenna-processing temperature associated therewith, the antenna-processing temperature less than the housing-processing temperature for processing the ceramic antenna device.6. A communication system comprising:a ceramic housing including a bottom planar portion with a pocket concave below an inner surface of the bottom planar portion; anda ceramic antenna device in the pocket and directly attached to the ceramic housing.7. The system as claimed in further comprising an adhesive in the pocket and between the ceramic housing and the ceramic antenna device for attaching the ceramic antenna device directly to the ceramic housing.8. The system as claimed in further comprising an additional ceramic-material between the ceramic housing and the ceramic antenna device for attaching the ceramic antenna device directly to the ceramic housing.9. The system as claimed in wherein:the ceramic housing includes the pocket having a pocket depth extending below the inner surface; andthe ceramic antenna device includes an antenna height for the ceramic antenna device and a protrusion height ...

COMBINING SIGNAL POWER USING MAGNETIC COUPLING BETWEEN CONDUCTORS

A system including a plurality of amplifiers, a plurality of first transmission lines, and a plurality of second transmission lines. The plurality of first transmission lines have first ends respectively connected to outputs of the plurality of amplifiers and second ends connected to a reference potential. The plurality of second transmission lines have first ends connected to a conductor and second ends that are unconnected. Signals output by the plurality of amplifiers to the plurality of first transmission lines are respectively magnetically coupled to the plurality of second transmission lines. 1. A system comprising:a plurality of amplifiers;a plurality of first transmission lines having first ends respectively connected to outputs of the plurality of amplifiers and second ends connected to a reference potential; anda plurality of second transmission lines having first ends connected to a conductor and second ends that are unconnected,wherein signals output by the plurality of amplifiers to the plurality of first transmission lines are respectively magnetically coupled to the plurality of second transmission lines.2. The system of claim 1 , wherein the signals magnetically coupled to the plurality of second transmission lines are combined at the conductor.3. The system of claim 2 , further comprising:an antenna coupled to the conductor,wherein the signals combined at the conductor are output to the antenna.4. The system of claim 1 , wherein each of the plurality of first transmission lines is arranged parallel to a corresponding one of the plurality of second transmission lines.5. The system of claim 1 , wherein:the plurality of amplifiers includes single-ended amplifiers, andthe reference potential is a supply voltage.6. The system of claim 1 , wherein:the plurality of amplifiers includes differential amplifiers, andthe reference potential is a supply voltage.7. The system of claim 6 , wherein:each of the plurality of first transmission lines includes a pair ...

FLEXIBLE WIRELESS PATCH FOR PHYSIOLOGICAL MONITORING AND METHODS OF MANUFACTURING THE SAME

Provided herein is an integrated wireless patch comprising a contact layer, an electronics layer, and a battery layer. The contact layer is a substrate having gel cutouts. The electronics layer can be folded into contact with the contact layer. The battery layer can be folded into contact with the electronic layer. Further provided herein is a method of manufacturing a wireless integrated patch comprising folding a substrate comprising at least one cutout, at least one contact disk in communication with a surface of a patient through the cutout, and battery terminals, wherein the at least one cutout, the at least on contact, and the battery terminals are adaptable to be located in different layers after the substrate is folded. 1. An integrated wireless patch which comprises:a contact layer comprising a substrate;an electronic layer folded into contact with the contact layer; anda battery layer folded into contact with the electronic layer.2. The patch of wherein the battery layer comprises battery terminal tabs.3. The patch of wherein the battery layer further comprises at least one antenna.4. The patch of wherein the patch is adaptable to be assembled by positioning the electronic layer between the contact layer and the battery layer.5. The patch of further comprising an adhesive layer adaptable to be located between the contact layer and the electronic layer.6. The patch of further comprising a battery.7. The patch of wherein the contact layer comprises at least one contact adaptable to be in communication with a surface of a patient.8. The patch of wherein the contact layer further comprises an adhesive surround positioned around the contact.9. The patch of further comprising at least one antenna.10. The patch of further comprising at least one application-specific integrated circuit on the electronic layer.11. A method of manufacturing a wireless integrated patch comprising:folding a substrate comprising at least one cutout, at least one contact disk in ...

MODAL ANTENNA-INTEGRATED BATTERY ASSEMBLY

A modal antenna is formed within a battery assembly for use with a portable electronic device. In certain embodiments, the antenna is printed on an exterior surface of a battery enclosure using a conductive ink. In other embodiments, the antenna is attached, or etched, on a substrate; the substrate may at least partially include a battery housing. The antenna can include an Isolated Magnetic Dipole (IMD) antenna, or other radiating structure. Active components, such as active tuning components, are optionally included in the antenna-integrated battery assembly for the purpose of tuning the antenna. 1. A modal antenna integrated battery assembly , comprising:a battery assembly having an inner portion enclosed within a battery housing, said inner portion including an anode, cathode, and a separator positioned therebetween; and a first antenna element positioned above a ground plane and forming an antenna volume therebetween;', 'a first parasitic element positioned outside of said antenna volume and adjacent to said first antenna;', 'a first active tuning element associated with said first parasitic element, said first active tuning element adapted to vary a current mode about said first parasitic element for actively steering a radiation pattern associated with said first antenna element;', 'a second parasitic element positioned within said antenna volume; and', 'a second active tuning element associated with said second parasitic element; said second active tuning element adapted to vary a reactive coupling between said first antenna element and said second parasitic element for actively tuning a frequency characteristic associated with said first antenna element., 'a modal antenna integrated within said battery assembly, said modal antenna comprising2. The assembly of claim 1 , wherein said first antenna element is one of: a coil claim 1 , monopole claim 1 , dipole claim 1 , inverted F antenna (IFA) claim 1 , microstrip antenna claim 1 , single resonance Isolated ...

Filtering device and method for adjusting filter characteristic

A filtering device includes at least one dielectric resonant element, which includes a dielectric block, an outer conductor, and an inner conductor, a terminal disposed in a through hole of the dielectric resonant element from a front surface, a plate-shaped circuit element electrically coupled with the at least one dielectric resonant element via the terminal, and a substrate on which the at last one dielectric resonant element and the plate-shaped circuit element are mounted. The outer conductor is disposed so as to cover the back surface besides the peripheral surface of the dielectric block. The first end surface of the dielectric block includes a first electrode-free portion that electrically isolates the inner conductor from the outer conductor, and a second electrode-free portion that electrically isolates the inner conductor from the outer conductor.

Coupled Transmission Line Resonate RF Filter

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate. 1. A method of making a mechanically stabilized RF coupled interdigitated resonate device comprising:masking a design layout comprising one or more structures to form one or more interdigitated structures with electrical conduction channels on a photosensitive glass substrate;exposing at least one portion of the photosensitive glass substrate to an activating energy source;heating the photosensitive glass substrate for at least ten minutes above its glass transition temperature;cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate;etching the glass-crystalline substrate with an etchant solution to form a mechanical support device; andcoating the one or more electrical conductive interdigitated transmission line, ground plane and input and output channels with one or more metals, wherein the metal is connected to a circuitry.2. The method of claim 1 , wherein the device is covered with a lid covering all or part of the external electrical isolation structure with a metal or metallic media further comprises connecting the metal or metallic media to a ground.3. The method of claim 1 , wherein the RF filter line has mechanical and thermal stabilization structure is under less than 50% claim 1 , 40% claim 1 , 35% claim 1 , 30% claim 1 , 25% claim 1 , 20% claim 1 , 10% claim 1 , 5% or 1% of the contact area ...

ABSORBING TERMINATION IN AN INTERCONNECT

Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed. 125-. (canceled)26. An apparatus comprising:a printed circuit board (PCB) comprising at least one transmission line to route an electrical signal within the PCB, wherein at least one end of the transmission line is coupled to a connecting component that comprises a connector slot disposed on a surface of the PCB; anda connecting element inserted in the connector slot, wherein at least a surface of the connecting element that faces the connector slot is covered with an absorbing material in contact with at least a portion of the connector slot, to at least partially absorb a portion of the electrical signal.27. The apparatus of claim 26 , wherein the electrical signal comprises a transmission signal transmitted at a frequency between 5 and 7 GHz.28. The apparatus of claim 26 , wherein the connecting component is a first connecting component claim 26 , wherein the connector slot is a first connector slot claim 26 , wherein the connecting element is a first connecting element of a first computing component coupled with the apparatus.29. The apparatus of claim 28 , further comprising a second connecting component coupled with the transmission line claim 28 , wherein the second connecting component comprises a second connector slot to receive a corresponding second connecting element of a second ...

SHIELDED INTERCONNECTS

Disclosed herein are shielded interconnects, as well as related methods, assemblies, and devices. In some embodiments, a shielded interconnect may be included in a quantum computing (QC) assembly. For example, a QC assembly may include a quantum processing die; a control die; and a flexible interconnect electrically coupling the quantum processing die and the control die, wherein the flexible interconnect includes a plurality of transmission lines and a shield structure to mitigate cross-talk between the transmission lines. 1. A quantum computing (QC) assembly , comprising:a quantum processing die;a control die; anda flexible interconnect electrically coupling the quantum processing die and the control die, wherein the flexible interconnect includes a plurality of transmission lines and a shield structure to mitigate cross-talk between the transmission lines, and the shield structure includes a plurality of air gaps.2. The QC assembly of claim 1 , wherein the flexible interconnect includes a flexible portion having a first end and an opposing second end claim 1 , a first rigid connection portion at the first end claim 1 , and a second rigid connection portion at the second end.3. The QC assembly of claim 2 , further comprising:a circuit component;wherein the quantum processing die and the first rigid connection portion are coupled to the circuit component, and the circuit component includes electrical pathways to electrically couple the quantum processing die and the first rigid connection portion.4. The QC assembly of claim 1 , wherein the plurality of transmission lines have a longitudinal portion and at least one transverse portion.5. The QC assembly of claim 4 , wherein a pitch of the plurality of transmission lines in the longitudinal portion is less than a pitch of the plurality of transmission lines in the transverse portion.6. The QC assembly of claim 4 , wherein the shield structure includes a plurality of rectangular sleeves in the longitudinal portion ...

ON-CHIP COPLANAR WAVEGUIDE (CPW) TRANSMISSION LINE INTEGRATED WITH METAL-OXIDE-METAL (MOM) CAPACITORS

A coplanar waveguide may include a first transmission line extending between a first ground plane and a second ground plane at a first interconnect level. The coplanar waveguide may further include a shielding layer at a second interconnect level. The shielding layer may include a first set of conductive fingers coupled to the first ground plane. The first set of conductive fingers may be interdigitated with a second set of conductive fingers that are coupled to the second ground plane. Only a dielectric layer may be between the first set of conductive interdigitated fingers and the second set of conductive interdigitated fingers. The first ground plane, the second ground plane, the dielectric layer, and the shielding layer may form a capacitor. 1. A coplanar waveguide comprising:a first transmission line extending between a first ground plane and a second ground plane at a first interconnect level; anda shielding layer at a second interconnect level, the shielding layer comprising a first set of conductive fingers coupled to the first ground plane and interdigitated with a second set of conductive fingers coupled to the second ground plane, and only a dielectric layer between the first set of conductive interdigitated fingers and the second set of conductive interdigitated fingers, the first ground plane, the second ground plane, the dielectric layer, and the shielding layer comprising a capacitor.2. The coplanar waveguide of claim 1 , in which the first interconnect level is different than the second interconnect level.3. The coplanar waveguide of claim 1 , further comprising a second transmission line between the first transmission line and one of the first ground plane and the second ground plane.4. The coplanar waveguide of claim 1 , in which the coplanar waveguide is on-chip or on a printed circuit board (PCB).5. The coplanar waveguide of claim 1 , in which the first set of conductive fingers are coupled to the first ground plane through a first set of vias ...

DUAL-CIRCULAR POLARIZED ANTENNA SYSTEM

In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array. 1. An antenna array comprising:a plurality of combiner sticks, wherein each of the plurality of combiner sticks comprises a linear array of ports arranged along a first dimension and coupled to a common port via a network of combiner/dividers, and wherein the plurality of combiner sticks are stacked along a second dimension such that the linear array of ports of the plurality of combiner sticks define a two-dimensional grid of ports;a horn plate comprising an array of horn elements coupled to the plurality of combiner sticks, wherein each horn element of the array of horn elements includes a horn port coupled to a corresponding port of the two-dimensional grid of ports and further includes an aperture port; anda grid plate coupled to the horn plate, the grid plate dividing the aperture port of each horn element into a corresponding plurality of apertures.2. The antenna array of claim 1 , further comprising an aperture close out coupled to the grid plate.3. The antenna array of claim 1 , wherein the common port of each of the plurality of combiner sticks is a first common port associated with a first polarization claim 1 , the network of combiner/dividers of each of the plurality of combiner sticks is a first network of combiner/dividers claim 1 , and ...

THERMALIZATION OF MICROWAVE ATTENUATORS FOR QUANTUM COMPUTING SIGNAL LINES

The technology described herein is directed towards microwave attenuators, and more particularly to a cryogenic microwave attenuator device for quantum technologies. In some embodiments, a device can comprise a cryogenic microwave attenuator device. The cryogenic microwave attenuator device can comprise: a housing component and a microwave attenuator chip, wherein the housing component can have thermal conductivity of about at least 0.1 Watts per meter-Kelvin at 1 degree Kelvin. The cryogenic microwave attenuator device can also comprise a microwave connector comprising a signal conductor that is direct wire coupled to the microwave attenuator chip. 1. A device , comprising:a cryogenic microwave attenuator device, the cryogenic microwave attenuator device comprising a housing component and a microwave attenuator chip, the housing component having thermal conductivity of about at least 0.1 Watts per meter-Kelvin at 1 degree Kelvin; anda microwave connector, the microwave connector comprising a signal conductor that is direct wire coupled to the microwave attenuator chip.2. The device of claim 1 , wherein the housing component comprises a copper alloy housing material.3. The device of claim 2 , wherein the housing component is plated with an oxidation-resistant material.4. The device of claim 3 , wherein the oxidation-resistant material comprises gold.5. The device of claim 1 , wherein the housing component comprises a substantially oxygen-free claim 1 , high-conductivity copper material having thermal conductivity of about at least 0.1 Watts per meter-Kelvin at 1 degree Kelvin.6. The device of claim 1 , wherein the housing component comprises an electrolytic copper material.7. The device of claim 1 , wherein the signal conductor comprises a connector center pin that is direct wire coupled to the microwave attenuator chip via one or more gold wires.8. The device of claim 1 , wherein the cryogenic microwave attenuator device is to be used in conjunction with a dilution ...

Method and Apparatus for Integrated Shielded Circulator

An RF circulator in combination with a RF integrated circuit, the RF integrated circuit having a plurality of RF waveguide or waveguide-like structures in or on the RF integrated circuit, the RF circulator comprising a disk of ferrite material disposed on a metallic material disposed on or in the RF integrated circuit, the disk of ferrite material extending away from the RF integrated circuit when disposed thereon, the metallic portion having a plurality of apertures therein adjacent the disk of ferrite material which, in use, are in electromagnetic communication with the disk of ferrite material and with the plurality of RF waveguide or waveguide-like structures, the disk of ferrite material being disposed in a metallic cavity.

Waveguides

A dielectric waveguide comprising a dielectric probe at each end, wherein the dielectric probes are arranged to transfer energy.

WELL THERMALIZED STRIPLINE FORMATION FOR HIGH-DENSITY CONNECTIONS IN QUANTUM APPLICATIONS

A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor. 1. A stripline that is usable in a quantum application (q-stripline) comprising:a first polyimide film;a second polyimide film;a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film; anda first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.2. The q-stripline of claim 1 , wherein a thickness of the first polyimide film is at least half of a specified insulator thickness B.3. The q-stripline of claim 2 , wherein the insulator thickness B is selected such that three times the sum of a first dimension of the first center conductor and a separation distance between the first center conductor and the second conductor is greater than twice of the insulator thickness B to yield a microwave crosstalk of less than −50 decibels between the first center conductor and the second center conductor.4. The q-stripline of claim 1 , further comprising:a first recess in the second polyimide film, wherein the first recess is formed through a second ground plane and the second polyimide film to expose a portion of the first center conductor, and wherein the first pin is configured through the first recess.5. The q-stripline of claim 1 , further comprising:an elastic pin, wherein the elastic pin is used as the first pin, and wherein the elastic pin makes the electrical and thermal contact only by applying pressure on the first center conductor and without soldering.6. The q-stripline of claim 1 , further comprising:a ...

TRANSMISSION LINE AND METHOD FOR MANUFACTURING TRANSMISSION LINE

A transmission line includes a ground conductor between first and second signal conductors. A substrate includes a first insulating layer and a second insulating layer having a relative permittivity lower than a relative permittivity of the first insulating layer. The first and second insulating layers are laminated in the thickness direction of the substrate and in contact with each other. The first and second signal conductors and the ground conductor are on an interface at which the first and second insulating layers are in contact with each other. The first and second signal conductors and the ground conductor each include a surface in contact with the first insulating layer and a surface in contact with the second insulating layer, the surface in contact with the second insulating layer being larger than the surface in contact with the first insulating layer. 1. A transmission line comprising:an insulating substrate;a first ground conductor and a second ground conductor spaced at a distance from each other in a thickness direction of the insulating substrate;a first signal conductor and a second signal conductor side by side in a width direction of the substrate and between the first ground conductor and the second ground conductor in the thickness direction without any other conductor pattern interposed between the first ground conductor and the second ground conductor, the first signal conductor and the second signal conductor each being combined with the first ground conductor and the second ground conductor and defining a strip line; anda third ground conductor between the first signal conductor and the second signal conductor in the width direction; wherein a first insulating layer; and', 'a second insulating layer having a second relative permittivity lower than a first relative permittivity of the first insulating layer; and', 'the first insulating layer and the second insulating layer are laminated in the thickness direction of the substrate and are in ...

Same-Band Combiner for Co-Sited Base Stations

The invention is a compact three-port signal combiner suitable for use in a base station having two different wireless systems. The combiner is designed as a four-port network, but one of the ports is terminated with a predetermined load, thus leaving three ports for connection to user equipment. A first port (A) receives from an antenna a first input signal comprising first and second receive bands and transmits to the antenna a first output signal comprising a transmit band. A second port (R), connected to the first wireless system, outputs to the first wireless system a second output signal comprising the first and second receive bands. A third port (T\R) outputs, to the second wireless system, a third output signal comprising the first and second receive bands and receives from the second wireless system a second input signal that is to be transmitted from the first port.

PRECISION WAVEGUIDE INTERFACE

A waveguide interface comprising a support block configured to support a printed circuit board assembly. An interface is coupled to an end portion of the support block and extends from the support block. The interface includes a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide component. The support block and interface are molded as a monolithic device. A method of forming the waveguide interface, a waveguide assembly including the waveguide interface, and a method of making the waveguide assembly including the waveguide interface are also disclosed. 1. A waveguide interface comprising:a support block configured to support a printed circuit board assembly; andan interface coupled to an end portion of the support block and extending from the support block, the interface having a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide flange, wherein the support block and interface are molded as a monolithic device.2. The waveguide interface of claim 1 , wherein the support block and the interface are formed from a moldable metal alloy.3. The waveguide interface of claim 1 , wherein the support block and interface comprise a plurality of draft angles along one or more surfaces of the support block and the interface to allow for removal from a mold.4. A waveguide assembly comprising: 'a support block having a printed circuit board assembly affixed thereto and an interface coupled to an end portion of the support block and extending from the support block, the interface having a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide flange, wherein the support block and interface ...

DIFFERENTIAL SIGNAL TRANSMISSION CABLE, MULTI-CORE CABLE, AND MANUFACTURING METHOD OF DIFFERENTIAL SIGNAL TRANSMISSION CABLE

Provided is a differential signal transmission cable, a multi-core cable, and a method of manufacturing a differential signal transmission cable that can suppress an increase in differential-to-common mode conversion quantity. The differential signal transmission cable includes two signal lines, an insulation layer covering a periphery of the two signal lines, and a plating layer covering the insulation layer. Differential-to-common mode conversion quantity of the differential signal transmission cable has a maximum value of −26 dB or less, in a frequency band of 50 GHz or less. In the method of manufacturing a differential signal transmission cable, dry ice blasting is performed on an outer peripheral surface of the insulation layer, and then corona discharge exposure is performed on the outer peripheral surface. 1. A differential signal transmission cable comprising:two signal lines;an insulation layer covering a periphery of the two signal lines; anda plating layer covering the insulation layer,differential-to-common mode conversion quantity of the differential signal transmission cable having a maximum value of −26 dB or less, in a frequency band of 50 GHz or less.2. The differential signal transmission cable according to claim 1 ,wherein the insulation layer bundle-covers the two signal lines.3. The differential signal transmission cable according to claim 1 ,wherein an outer edge of the insulation layer has a substantially oval or elliptical shape in a cross section orthogonal to an extending direction of the two signal lines.4. The differential signal transmission cable according to claim 1 ,wherein the plating layer has a thickness of 1 μm to 5 μm.5. The differential signal transmission cable according to claim 1 ,wherein a standard deviation of a thickness of the plating layer acquired at a total of sixteen points from four points in each of four cross sections perpendicular to an extending direction of the two signal lines is 0.8 μm or less.6. The ...

SIGNAL TRANSMISSION CABLE, MULTICORE CABLE, AND METHOD OF MANUFACTURING SIGNAL TRANSMISSION CABLE

A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 μm and 10 μm inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface. 1. A signal transmission cable comprising:a signal line;an insulation layer configured to cover the signal line; anda plating layer configured to cover the insulation layer,wherein an arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 μm and 10 μm inclusive.2. The signal transmission cable according to claim 1 ,wherein a thickness of the plating layer is between 1 μm and 5 μm inclusive,wherein a standard deviation of the thickness of the plating layer is 0.8 μm or less, andwherein the standard deviation of the thickness of the plating layer is measured bytaking four cross sections of the signal line orthogonally to an axis of extension of the signal line,taking four random points on each cross section to make sixteen points in total, andmeasuring a thickness of the plating layer at each of the sixteen points and obtain a standard deviation, which is used as the standard deviation of the thickness of the plating layer.3. The signal transmission cable according to claim 1 ,wherein a contact angle on the outer peripheral surface of the insulation layer is 95° or less.4. The signal transmission cable according to claim 1 ,{'sup': '2', 'wherein an absolute value of adhesion-wetting surface free energy on the outer peripheral surface of the insulation layer is 66 ...

Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure. 120-. (canceled)21. A hermetic package including a coaxial waveguide microstructure , comprising:a multi-layer coaxial waveguide including a center conductor having one or more layers of a conductive material, an outer conductor comprising one or more walls spaced apart from and disposed around the center conductor, the one or more walls having a plurality of layers of the conductive material, and a non-conductive core volume disposed between the center conductor and the outer conductor; anda dielectric cap disposed over an endface of the multi-layer coaxial waveguide to hermetically seal the coaxial waveguide at the endface.22. The hermetic package according to claim 21 , wherein the dielectric cap comprises a membrane extending from the center conductor to the outer conductor23. The hermetic package according to claim 22 , wherein the dielectric membrane covers at least an outer periphery of the center conductor and at least an inner periphery of the outer conductor.24. The hermetic package according to claim 21 , comprising a device mounted on the dielectric cap.25. The hermetic package according to claim 21 , wherein the dielectric cap comprises a photopatternable polymer.26. The hermetic package according to claim 21 ...

METHOD OF PRODUCING WAVEGUIDE DEVICE

A waveguide device includes: a first electrically conductive member having a first electrically conductive surface and a second electrically conductive surface opposite thereto; a second electrically conductive member having a third electrically conductive surface and a fourth electrically conductive surface opposite thereto, the third electrically conductive surface opposing the second electrically conductive surface; a waveguide member on the third electrically conductive surface; and a plurality of electrically-conductive rods on the third electrically conductive surface. The method of producing a waveguide device includes: obtaining an intermediate product through a forming technique using one or more dies or molds, the intermediate product including the second electrically conductive member, the waveguide member, and the plurality of rods; and obtaining a finished product through a process including subjecting a portion(s) of the intermediate product to cutting, the finished product including the second electrically conductive member, the waveguide member, and the plurality of rods. 1. A method of producing a waveguide device ,the waveguide device including:a first electrically conductive member having a first electrically conductive surface and a second electrically conductive surface opposite to the first electrically conductive surface;a second electrically conductive member having a third electrically conductive surface and a fourth electrically conductive surface opposite to the third electrically conductive surface, the third electrically conductive surface opposing the second electrically conductive surface of the first electrically conductive member;a ridge-shaped waveguide member connected to the third electrically conductive surface of the second electrically conductive member, the waveguide member having an electrically-conductive top face opposing the second electrically conductive surface; anda plurality of electrically-conductive rods connected to ...

Low loss microelectromechanical system (mems) phase shifter

A phase shifter comprising an actuator coupled to a dielectric. When the dielectric is inserted into the waveguide in response to actuation by the actuator, the phase velocity of the incoming electromagnetic wave is decreased, resulting in a phase shift of the electromagnetic wave. A desired phase shift and a low insertion loss can be controlled by positioning of the dielectric and engineering the permittivity of the dielectric.

METHODS AND APPARATUSES FOR TUNING A FILTER

The present application describes a method of tuning a printed device. The method includes measuring a frequency response of a target device and a device under tune (DUT). The method includes computing, based on the measured frequency response, a coupling matrix for the target device and a coupling matrix for the DUT. The method also includes extracting eigenvalues for the coupling matrix of the target device and a first set of eigenvalues for the coupling matrix of the DUT. The eigenvalues of the target device are different than the first set of eigenvalues of the DUT. The method further includes tuning the DUT with a material removal source. The method even further includes measuring a second set of eigenvalues of the DUT. The second set of eigenvalues is different from the first set of eigenvalues of the DUT. The method yet even further includes calculating a tune path for iterative convergence of the second or a subsequent set of eigenvalues of the DUT with the eigenvalues of the target device. The method still even further includes observing the iterative convergence of the DUT and the target device. 1. A method of tuning a printed device comprising:measuring a frequency response of a target device and a device under tune (DUT);computing, based on the measured frequency response, a coupling matrix for the target device and a coupling matrix for the DUT;extracting eigenvalues for the coupling matrix of the target device and a first set of eigenvalues for the coupling matrix of the DUT, where the eigenvalues of the target device are different than the first set of eigenvalues of the DUT;tuning the DUT with a material removal source;measuring a second set of eigenvalues of the DUT, where the second set of eigenvalues is different from the first set of eigenvalues of the DUT;calculating a tune path for iterative convergence of the second or a subsequent set of eigenvalues of the DUT with the eigenvalues of the target device; andobserving the iterative convergence ...

PLATED, INJECTION MOLDED, AUTOMOTIVE RADAR WAVEGUIDE ANTENNA

The radar system includes a split-block assembly comprising a first portion and a second portion. The first portion and the second portion form a seam, where the first portion has a top side opposite the seam and the second portion has a bottom side opposite the seam. The system includes at least one port located on a bottom side of the second portion. Additionally, the system includes radiating elements located on the top side of the first portion, wherein the radiating elements are arranged in a plurality of arrays. Yet further, the system includes a set of waveguides in the split-block assembly configured to couple each array to at least one port. Furthermore, the split-block assembly is made from a polymer and where at least the set of waveguides, the at least one port, and the plurality of radiating elements include metal on a surface of the polymer. 1. A radar system comprising:a split-block assembly comprising a plurality of portions;a plurality of radiating elements formed in an array located on a top side of one portion of the plurality of portions; anda set of waveguides in the split-block assembly configured to couple the array to at least one port,wherein the split-block assembly comprises a polymer and wherein at least the set of waveguides, the at least one port, and the plurality of radiating elements comprise metal on a surface of the polymer, wherein the polymer is formed by an injection molding process.2. The radar system according to claim 1 , wherein the split-block assembly comprises at least one seam between a first portion and a second portion of the plurality of portions.3. The radar system according to claim 2 , wherein a top side of the second portion and a bottom side of the first portion form the seam and wherein the first and second portions are electrically coupled at the seam.4. The radar system according to claim 3 , wherein the top side of the second portion and the bottom side of the first portion each have a respective region that ...

Distributed Coupling and Multi-Frequency Microwave Accelerators

A microwave circuit for a linear accelerator has multiple metallic cell sections, a pair of distribution waveguide manifolds, and a sequence of feed arms connecting the manifolds to the cell sections. The distribution waveguide manifolds are connected to the cell sections so that alternating pairs of cell sections are connected to opposite distribution waveguide manifolds. The distribution waveguide manifolds have concave modifications of their walls opposite the feed arms, and the feed arms have portions of two distinct widths. In some embodiments, the distribution waveguide manifolds are connected to the cell sections by two different types of junctions adapted to allow two frequency operation. The microwave circuit may be manufactured by making two quasi-identical parts, and joining the two parts to form the microwave circuit, thereby allowing for many manufacturing techniques including electron beam welding, and thereby allowing the use of un-annealled copper alloys, and hence greater tolerance to high gradient operation. 1. A microwave circuit for a linear accelerator , the microwave circuit comprisingmultiple metallic cell sections,a pair of distribution waveguide manifolds, anda sequence of feed arms connecting the manifolds to the cell sections;wherein the distribution waveguide manifolds are connected to the cell sections so that alternating pairs of cell sections are connected to opposite distribution waveguide manifolds, wherein the distribution waveguide manifolds have concave modifications of their walls opposite the feed arms, and wherein the feed arms have portions of two distinct widths.2. The microwave circuit of wherein coupling geometry to each cell section is implemented with a three port network claim 1 , wherein the three port network is adapted such that a dependence of the accelerator cavity design on a distribution manifold circuit parameter is minimized.3. The microwave circuit of wherein the three port network is an E-plane junction claim ...

Self-aligned tunable metamaterials

A self-aligned tunable metamaterial is formed as a wire mesh. Self-aligned channel grids are formed in layers in a silicon substrate using deep trench formation and a high-temperature anneal. Vertical wells at the channels may also be etched. This may result in a three-dimensional mesh grid of metal and other material. In another embodiment, metallic beads are deposited at each intersection of the mesh grid, the grid is encased in a rigid medium, and the mesh grid is removed to form an artificial nanocrystal.

PRINTED WIRING BOARD FOR HIGH FREQUENCY TRANSMISSION

A printed wiring board for high frequency transmission according to an embodiment of the present invention includes: an insulating base material a signal line extending in a longitudinal direction of the insulating base material ground wirings extending in the longitudinal direction while being spaced apart from the signal line by a predetermined distance; a ground layer formed on a major surface a plurality of ground connection vias electrically connecting the ground wiring and the ground layer and a plurality of ground connection vias electrically connecting the ground wiring and the ground layer A width of the ground wirings is smaller than a land diameter of the ground connection vias Then, the ground connection vias and the ground connection vias are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 1. A printed wiring board for high frequency transmission , comprising:an insulating base material having a first major surface and a second major surface opposite to the first major surface, and extending in a longitudinal direction thereof;a first signal line formed on the first major surface and extending in the longitudinal direction;a first ground wiring formed on the first major surface and extending in the longitudinal direction while being spaced apart from the first signal line by a predetermined distance;a second ground wiring formed on an opposite side of the first ground wiring with the first signal line interposed therebetween on the first major surface, and extending in the longitudinal direction while being spaced apart from the first signal line by a predetermined distance;a ground layer formed on the second major surface;a plurality of first ground connection vias electrically connecting the first ground wiring and the ground layer; anda plurality of second ground connection vias electrically connecting the second ground wiring and the ground layer, whereina width of the ...

METHODS FOR MANUFACTURING A RADIO FREQUENCY IDENTIFICATION TAG WITHOUT ALIGNING THE CHIP AND ANTENNA

An apparatus and method for attaching antennae to RFID tags is disclosed. Included is the use of RFID tags having a symmetrical interconnect system for attaching one or more antennae, such that virtually any rotational orientation of the RFID tag will result in a successful antennae attachment. Two oversized and “L” shaped gold-bumped poles can be arranged on the same side of a chip in an opposing fashion, such that at least one axis of symmetry is formed. Accordingly, virtually all rotational orientations of the chip are then acceptable when attaching a pair of opposing pole antenna leads. Alternatively, a pair of poles can be located on opposing chip surfaces, such that antenna substrates can attach to both the top and bottom of the chip to form a product “sandwich,” whereby the rotational orientation of the chip is irrelevant at an antenna attachment step 1. A method of manufacturing a radio frequency identification tag , comprising:creating a first radio frequency identification integrated circuit;forming an interconnect system connected to said radio frequency identification integrated circuit; andutilizing a parts handling system to process said first radio frequency identification integrated circuit, wherein said parts handling system processes said radio frequency identification integrated circuit without controlling for the rotational orientation of said radio frequency identification integrated circuit.2. The method of claim 1 , wherein said parts handling system comprises a mass parts handling system having a rotary feeder drive.3. The method of claim 2 , wherein said mass parts handling system further comprises an outside track bowl.4. A method of attaching an antenna to a radio frequency identification integrated circuit claim 2 , comprising:selecting a first radio frequency identification integrated circuit;creating an interconnect system on said radio frequency identification integrated circuit;utilizing a parts handling system to process said radio ...

WAVEGUIDE AND SEMICONDUCTOR PACKAGING

A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration. 1. A method of fabricating sub-millimeter wavelength (SMMW) devices , comprising the steps of:batch processing a first wafer to include one or more DC through vias;depositing one or more solder bumps on an upper surface of the first wafer;batch processing a second wafer to create one or more cavities aligned with the solder bumps;bonding a lower surface of the second wafer to the upper surface of the first wafer;batch processing one or more third wafers of semiconductor material to form monolithic microwave integrated circuit (MMIC) chips;dicing the one or more third wafers into individual MMIC chips; andplacing one or more MIMIC chips into the cavities of the second wafer.2. The method of further comprising the steps of:batch processing a fourth wafer to form one or more antennas aligned with the one or more cavities of the second wafer; andbonding the fourth wafer to an upper surface of the second wafer.3. The method of wherein the one or more antennas are horn antennas.4. The method of wherein the first claim 2 , second and fourth wafers are assembled using wafer scale assembly (WSA) techniques.5. The method of wherein the cavities in the second wafer comprise waveguides.6. The method of wherein the first wafer is GaAs claim 1 , the second and fourth wafers are silicon and the third wafer is a III-V semiconductor material.7. The method of wherein the MMICs are tested for ...