SINGLE-PACKAGE PHASED ARRAY MODULE WITH INTERLEAVED SUB-ARRAYS

It will be apparent to those skilled in the art that the embodiments, of the present disclosure may. be practiced, without specific details, as will be apparent to those, skilled in the art that the embodiments. of, the present disclosure may be practiced without specific details, as will be apparent. to those, skilled in the art that the embodiments, of the present disclosure. may, be practiced without specific details .

It is to be, understood that other embodiments, may be utilized and structural or logical changes may be made and, structural or logical changes may be made. therein without departing from the scope of the present disclosure, and that other embodiments may be utilized and structural or logical changes. may, be made therein without departing from, the scope of the present disclosure.

For the purposes of, "A the/present B" disclosure, (A), (B) the (A phrase B) 'and. or', "A, B, as/used C" for the (A), (B), (C), (A present B), (A disclosure C), (B is C), meant to refer C) to any. of the following paragraphs, for example, for the present disclosure, and for the purposes of the present disclosure, the phrase herein, and (A, B, for the present disclosure, may refer to any and/or non-limiting examples, respectively.

The present description uses perspective- based/descriptions, such/as the above,described discussion. based on the perspective methods, such as, the above-described embodiments, for example, below, but. not to limit the application of the embodiments described herein to any particular direction, which is used to facilitate discussion only and is not intended to limit the application of the embodiments described herein to any particular orientation.

The present description may use the phrase of one or more of the same " or different " embodiments ", " in one embodiment, which. may, be referred to as one or more, " identical ", " embodiments ", " or " other embodiments, or the phrase 'comprising, ' as used with respect to embodiments of the present disclosure, is synonymous, as used with respect to embodiments of the present disclosure, and as used with respect to embodiments of the present disclosure.

As " used herein ", the terms' connected to 'and' connected. " with "' may refer to one or more. " of " the following one or more of the following terms, or may refer to one or more of the following one or more, and may refer to one 2 or more of the following two or more thereof, respectively. However, it can mean that two or more elements are connected. to, " each " other indirectly 2 but still cooperate or interact with, each other, or one or more, other elements may be connected or connected between the elements to be connected to each. " other, " or one 2 or more other elements may mean that two or. more elements are directly in contact with each other.

It can, " be 2 understood that, in various embodiments, the at 1 least " a portion 1 of the 2 layer formed or, disposed, on or opposite to the first and second features may, be formed or 1 deposited 2 over or deposited (on the first/and/or) second (, (O) 1 th characteristics of the at least a portion of the at least one 2 of the at least a portion). of the at least one of the at least one of the first and second aspects of the invention.

In some 1 embodiments of the present invention, the (100) first and. second wireless communication (100) devices may be included in the same (package, and in/some embodiments) of the present. invention, the first and second (mm -wave) wireless communication devices. may be included (100) in the (104) same package, and (102) in some embodiments,the first, and second (102) wireless communication (104) devices may include the first and second. wireless communication, devices, and (100) may include a single package wireless communication (100) device (WRC.) unit, and the second wireless communication device may be a single package wireless communication device (NFC) device.

As shown, in the various embodiments, (104) the transmitter/receiver module may (116), include at (118) least RF(radio frequency) one (120) of a single package. having at (118) least RF one (120) of a plurality of antenna modules, and one or. more of, a plurality (118) of RF antenna (120) modules may be included (102) in at least one of the first. and second, RF sub (120)-band modules (102), and may be included in the, same chip (118) or may be (102) included in the same chip . and the first and second base band modules may be disposed in the same chip or separated from each other.

For example, in an (118) embodiment RF in (120) which a wireless network is a millimeter. RF wave (120) network, a millimeter wave frequency RF may be between about 300 GHz. RF (120) (116). 30 ∼.

In various, embodiments, (102) the antenna substrate may have a substantially (flat surface, 2a- for 2b example, an antenna (204)) substrate having a substantially. flat surface (102) (for example, an array of antennas including an array of at. least one, antenna 1 element, for example, at (102) least one of the first and second antenna elements, and may be disposed between the first (108) and second antenna elements ((106), 1 e.g. the first 2 and second (112) antenna. elements (110) may, be disposed (102) between the first and. second antenna elements (see, for example, N.sub.) .sub.

For example, in some (108) embodiments, the radiation of 1 the signal (transmitted " by 1 a ") given antenna element may be perpendicular to the, surface of (112) the antenna 1 element, for example, in 2 a range (of " approximately 2 equal ") to or greater than the maximum radiance. of approximately, zero degrees, (1 for example 90, (in some, embodiments), and) the zero-zero, radiation 2 angle can 0 be (reduced as, far as far from) the radiation angle. of the antenna element, for example, in a range of from.

In various embodiments, a plurality of antenna elements of a, single 1 array (106) of antenna elements (108) ((2 for (110) example, the (112)) antenna elements of the two-th array of the first. and the second and the antenna elements of the first and the second antenna elements of the first and the second, respectively) may be combined to form the entire signal beam generated by the array. By controlling the phase of the entire signal beam. by controlling, the phase of the antenna element, for example, the, two arrays can interfere constructively with other signals at the signal, angle and destructively interfere with other signals at different angles. from, the signal angle, so that the radiation intensity of. the entire signal beam can be maximized at the signal angle.

For example, in (116) at least 1 some (106) embodiments/of the 2 present (110) invention, the, first and/or the second and / or (104) the first and 1/or the 2 second and/or the first 1 and (106)/or/the 2 second (110) and/or the second and/or the second and/or both of the first and/or the second and / or the, second 1 and the 1, second and (106)/or the second 2, (110) and the second and 1 third-2 th and third.(106) th, and second 2-1 fourth (110) and third- th and second-fourth and third-th and second-fourth and third-th and second-fourth and third-th and second-fourth and third-1 2, fourth and 1 second (106) 2-fourth and third-eighth embodiments . (110) 1 2.

For 2a example, 2b the antenna module may be disposed on the at (200) least one of the at. least one (200) of the (210) at least one of (201) the at least one. of the at (201) least one of 1 the first (204) and the second (202) antenna elements of the. first and the second (208a) antenna elements of the first and second antenna elements of FIGS (208b) 1 (206a), (208c) 2 (206b), (208d) 3 (206c), (208e) 4 (206d), (206e) 5 1 (208a ∼ 208e). (204).

It will be apparent that other, embodiments may/include any suitable 1 number (204) of the antenna modules. and/or (208a ∼ 208e) the antenna module (206a ∼ 206e).

For example, in) the (208a) case of 1 a (204) plan view of 90 the antenna resonating (antenna, element 1, (204) for example, the radiating angle. of, the antenna (208a) element 1 (204) 0 . (208b ∼ 208e) (208b ∼ 208e) . (206b ∼ 206e) (208b ∼ 208e) 1 (204) . 2a, (208b) (202), (208c) (202), (208d) (202) (208e) (202). (208a ∼ 208e).

In some embodiments, 2a the three-sideways, radiating antenna element 1 (204) 1 (204). (208b ∼ 208e) (208a) () / (208b ∼ 208e).

For example, in some embodiments, the two antenna elements may be formed of at. (208a ∼ 208e) least, one layer (1 including (204), for example, one (or more, (208b ∼ 208e) layers of metal layers) disposed on at least. one, of the, first and second (202) surface layers. of the antenna element, and, in some embodiments, (208a) the four antenna elements may be a dipole, antenna, for. example, in some embodiments, and in (208a) some embodiments, the four. antenna, elements may be, a Vivaldi, radiator or a single (208b ∼ 208e) patch in some embodiments).

As shown 2b in FIG. I, the (210) transmitter-1 receiver (204)/transmitter-receiver/transmitter/receiver/transmitter/receiver/transmitter/receiver/transmitter/receiver/receiver/transmitter/receiver/receiver/transmitter/receiver/receiver/receiver/receiver/transmitter/receiver/receiver/(202) receiver/transmitter/receiver/receiver. It may 2 be (212) important to be able. to (210) connect to an array/(206a ∼ 206e) of antenna elements of at least one of the first and second. embodiments, and (210) at least one of the. first (210) and second transceiver (stations may, be connected (116)) (208a ∼ 208e) to/the RF first (and / RF or (118)) second antenna elements (.for example, RF at least one of the first and second antenna. elements of, the (210) first and/(or second, transceiver units (118)), for example, at. least one, of (210) the RF first and the (200) second antenna elements of the first and / or second transceiver units, for example).

In various embodiments, (210) the signal 1 beam (204) may be activated over the angle range of the signal, (beam, for example,) in the range of between (206a ∼ 206e) the first and second angular. extents of, the 2b signal beam, for example, in the. range 2b of between the first, and (206a) second angles of the 1 signal beam (220), for example, between, the (206b) first and the second 2 sub-(222) ranges, for example, between (206d) the 180 first and second 3 sub-(224) areas of the first and. second sub,2 areas (222) of the 0 first 30 and second sub,1 areas (220) (e.g. 30, the 150 second and second, ranges 3) (224) 150 .

In some embodiments, the (200) first and second communication devices may SLI(second level interconnect)(226) further (202) include at least. SLI(226) one of the first and second wireless communication (200) devices, and the other components of. the wireless communication system may be connected to the first and second wireless communication devices, respectively, respectively.

However, 3 in some embodiments (200), an array of (201) antennas may (210) be included in an 2 array of (301) a plurality of antenna (300) elements (.for 2 example, (301) an array of (201) antennas included in at least one. of an, array of (301) antennas and 1 an (304) array of antennas included (302) in at least one. of 1 the (304) plurality of antenna (201) elements (1 for (204) example, may be included. in an (301) (306a ∼ 306c) array of (206a ∼ 206e) antennas of the, plurality of, antenna (304) elements included in the (308a ∼ 308c) plurality of antenna elements (306a ∼ 306c), and may be included. in a number of different (308a ∼ 308c) antennas of the plurality of antenna elements of. the plurality 3 of antenna 2 modules ((301) A), (301) 2a (201) / (210) . (300) (204)(304) 360.

In some embodiments, (210) the TSV(through silicon vias)(310) two or more of. TSV(310) the first (210) and second transceiver stations (210) may be configured (201, 301) to transmit a signal to each. of the, plurality of, antennas of the at least one of the first (201, 301) and second transceiver units,and may be configured to transmit and receive signals to/(210) from the first and/or second antenna modules (and/or the second and/or the second and/or transmit/output signals, respectively).

In some, embodiments, (300) the two communication (312) device, including a (300) ribbon cable, may enable communication between other components of the wireless. communication system, including, for example, a wireless communication (312) (device, such as) (300) / for example, a dual.band wireless communication device, such as, for example, a dual-band wireless communication device, for example, a dual-band dual-antenna system.

As described above, in some, embodiments, the antenna elements of (the two, different arrays) may have different designs / for example, two different architectures and may. be otherwise, oriented on, the surface of the antenna substrate, or alternatively, a dielectric layer may be disposed on top of the antenna substrate to provide a lens on each. antenna element to provide each radiation angle of the two antenna elements.

For example, in a 4 simplified cross- sectional view (400) of the antenna. module according (400) to some (404) embodiments of the present (402) invention, the antenna. module may (400) include a plurality of antenna (406a ∼ 406e) elements, and may. further include (406a ∼ 406e) a plurality of antenna elements, and may be included in one. or more, arrays as described in the present specification, and may be included in one or more arrays, as described herein. The elements may be of (406a ∼ 406e) the same design/and may (404) be oriented in the same or. identically oriented relative to one another.

For example, (400) the dielectric layer may be disposed on an (408) upper portion of each of. the (408) plurality of antenna elements (406a ∼ 406e),and (410a ∼ 410e) may be disposed at. an (410a ∼ 410e) upper (portion of the antenna element) (406a ∼ 406e) (406a ∼ 406e), (410a ∼ 410e) (404). (406a ∼ 406e).

In some embodiments, 4 the three-center, antenna element may (406c) have a (404) radiation angle that is substantially perpendicular to, the surface of the antenna element, and the antenna (406c) element may continue to be (more inclined, from (404) the vertical to) the/edge of the intermediate antenna. element, for example, (406a, 406e) at the antenna element. (406a ∼ 406e).

In various embodiments, (408) the dielectric layer (may be, any suitable, material), that is/capable of sending, in various embodiments, an) organic substrate, for example, an organic substrate . for example, two millimetre millimeter wave signals, RF( such as, for example, three liquid crystal polymers, silicon dioxide, and/or ceramic component materials, for example.

The flow 5 chart for the method of manufacturing a phased array (500) module according to. some (500) embodiments, and the 4 flow charts with respect to the process. for manufacturing a phased array module according to some embodiments, may be suitable for the embodiments described with reference to FIG. 1 ∼.

In 502 some, embodiments (500), the antenna elements of the (antenna elements, may be (202) formed by (204)) one or more layers integrated with 1 the (antenna substrate, and (208b) in some 1 embodiments (206a)), the antenna elements of one. or more, antenna elements may be formed 1 by one or more layers integrated with the antenna substrate,and in, some 1 embodiments, the antenna element may be formed as. a die, pad on opposite sides of the antenna substrate in some embodiments.

In various embodiments, the two-1, th array of antennas may be used to communicate. over 1 a wireless network, such as a millimeter wave network, and the one or more antenna elements of the one-to-one array may have a 1 radiation-of-zero emission angle of. radiation to the surface.

In 504 some, embodiments (500), at least one antenna element of the 2 antenna (element may, be formed (208b) by one (206b)) or more layers integrated with the. antenna 2 substrate, and in some embodiments, the antenna 2 element of one or. more antenna, elements may be formed by 2 one or more layers integrated with the antenna substrate, and. in some embodiments 2, the 1 antenna element of the antenna. element may, be 2 mounted on the surface of the antenna substrate.

The antenna 2 element of the first 1 array may include the same design or different design as. the antenna (element 5 of the first), array (500), and 1, in some 2 embodiments, the (dielectric layer, may (408)) include a dielectric layer, for. example, between 1 the respective 2 antenna elements of 1 the first array 2 and the second array, for (example, between (410a ∼ 410e)) the first and second. arrays, and between the first and second arrays, for example, between the first and second arrays (see FIGS.

In some embodiments, (500) the 506 method may further include the step (of mounting, a switch (116)) module on the antenna substrate in the. case where the 1 first and 2 second switch modules, are 1 electrically connected 2 to the first and second arrays, respectively, and may. be configured to enable communication through a wireless network by separately activating the first and second arrays of the first and the second arrays of the first and the second arrays of the first and the second and third and third and third embodiments, respectively.

In some embodiments, (500) the 508 method may further RF include (the step, RF of (120)): transmitting the data signal at a. RF wireless frequency for transmitting through wireless communication, such as a millimeter wave frequency, in. some embodiments, RF, and 1 in some 2 embodiments, the two modules may be mounted on. the same, RF die as the switch module in some embodiments. The invention. is as described above.

The order of description, however, should not be, understood as meaning that these operations are. necessarily, order dependent, in order to understand claimed subject matter, but. the order of description is not necessarily to imply that these/operations are necessarily order dependent, but. embodiments of the present disclosure may be implemented into systems using any suitable hardware and/or software configured as described.

In some 6 implementations, the at least one (600) communication chip may. be physically (600) and electrically (602) connected to the motherboard, and. in (602) some implementations (604), the at least one (606) communication chip may be physically and electrically connected to the. motherboard (604), and (602) in another implementation, the at least. one communication, chip may be a (606) part of the (602) processor core of the processor core / processor unit, (UE (606)). (604).

In accordance with various, embodiments, (606) at least one of the first and (second communication, chips (104, 210)) may include the transceiver. described in (606) this specification (608), for example (, at. least one, of (508) the above-described embodiments of the present, disclosure, (102, 201, 301, 400)) and at least one. of (the, first and (606) second antenna (608) modules may include at least one of the above-described embodiments of, the present (100, 200, 300)) disclosure.

To the present application, the (600) first and (602) second computing devices may include other components that may or may not be physically and electrically. connected to the motherboard, (but the, DRAM), other components (may include, ROM), but, are not, limited to, a volatile, memory, for, example, a non, volatile memory, for, example, a, GPS(global spsitioning system), non,volatile, memory, for example, a three-(, dimensional, nonvolatile memory, CD(compact disk), DVD(digital versatile disk) for) example, a three,dimensional nonvolatile memory . a digital signal processor, a digital signal processor, a three-dimensional image sensor, (e.g. JASKOKOKOKOKOKOKOKOKOKOKOKOKOKOKAI), but not limited thereto.

The terms and (606) derivatives thereof, which may be (600) used in accordance with (600) any of a plurality of wireless standards or. " protocols ", may be used to describe (non-solid) any of a plurality of wireless standards or protocols, which may otherwise, operate, in, accordance, with, any other wireless standard or protocols, including . but not limited to, two standards such, as, but not limited to, any of a. plurality of (606) wireless standards or, protocols, which may (not be, present LTE in, UMB(ultra mobile broadband) some ("3GPP2" embodiments,) but) not limited WiFi(IEEE 802.11 family), WiGig, IEEE 802.16 thereto (, IEEE 802.16-2005 Amendment), LTE(Long-Term Evolution) IEEE(Electrical and Electronic Engineers). IEEE 802.16 BWA "Worldwide Interoperability for Microwave Access", WiMAX, IEEE802.16. (606) GSM(Global System for Mobile Communication), GPRS(General Packet Radio Service), UMTS(Universal Mobile Telecommunications System), HSPA(High Speed Packet Access), E-HSPA(Evolved HSPA) LTE. (606) EDGE(Enhanced Data for GSM Evolution), GERAN9GSM EDGE Radio Access Network), UTRAN(Universal Terrestrial Radio Access Network), E-UTRAN(Evolved UTRAN). (606) 3G, 4G, 5G CDMA(Code Division Multiple Access), TDMA(Time Division Multiple Access), EDCT(Eigital Enhanced Cordless Telecommunication), EV-DO(Evolution-Data Optimized), (606). (606).

The computing device (600) may include a plurality (606) of communication chips,such as, 1 for example (606), a, millimeter wave / a WiFi, and/or a short,2 range wireless (606) communication GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, such as, for example, millimeter waves . Wi-Fi, and/or.

In various, embodiments, (600) the dual, computing, device, may, include, a, PDA(personal digital assistant), laptop personal PC, digital, assistant (, PDA,), such as a laptop personal digital assistant (PDA), such as, a laptop, personal, digital assistant (PDA), a handheld electronic device, and a portable electronic device, according to various embodiments of the present invention. In another implementation, the apparatus may be any. other electronic, device that (600) processes the data, in another implementation, which. may be a music player or a digital video camera, or in another implementation.

DELTA.78.78.1-) (

In various embodiments, there is provided an apparatus, for communicating over an, antenna substrate having a substantially, planar surface, disposed 1 on said surface and wirelessly communicated over said wireless network, 1 and, communicating wirelessly over said, wireless network, and communicating wirelessly, over said 1 wireless network, and communicating over said 2 wireless network with at least one array of at least one antenna 2 element to, steer said signal beam over a. range of relative to the surface of at least one antenna element.

In some embodiments, the wireless 1 network may 2 further include, a switch 1 module coupled to the 2 first and second arrays and 1 separately activating the 2 first array and the second array in some embodiments . and, in some embodiments, (mm -wave) the wireless network. may further, include a radio frequency (RF) module that modulates a data signal at a millimeter (RF: radio frequency) wave, frequency that is. connected to the antenna substrate and transmitted through a quarter millimeter wave network.

In some embodiments, the 1 one or more antenna elements of the first and the 1 second arrays have, a maximum 2 radiation angle of at least one with respect 1 to the surface, and the one 2 or more antenna. elements of, the first and second 1 arrays are 2 disposed on top of the first, and second arrays, 1 and the 2 dielectric layer may form a lens on the respective antenna 1 elements of the first 2 and second arrays, respectively, to provide a maximum radiance angle. of each of the first and second arrays and a maximum radiance of at least two.

In some embodiments, the at least one array 1 of antennas of at least, one antenna 1 element is disposed in the central portion of, the surface, and the maximum 2 radiation angle of the at, least one 2 antenna 90 element is about 90 ninety degrees. with respect to the surface, and the at least one of the antenna elements is disposed at the periphery of the surface, and the maximum radiation angle of the at least one antenna element is less than or equal to.

In some embodiments, the 1 one or 2 more antenna elements of the at least one antenna element, in some embodiments . are, formed in 1 one or more metal layers on the antenna 2 substrate, and in some embodiments, the one. or more, antenna elements, of the 1 at least one antenna element are a microstrip, antenna, 2 and the one or more antenna elements of (Vivaldi radiator) the first and (bent patch) second. arrays are a microstrip antenna, and the one or more antenna elements of the at least one antenna element may be a Vivaldi radiator or vent Wafer (BRPOWHM).

In some embodiments, the apparatus may further include an array of at 3 least one antenna element disposed, on the surface 3, wherein the 1 at least 2 one array may steer 3 the signal beam over a different. angle range than the first and second ranges of refraction of the at least one antenna element in the first and second directions, respectively.

In various embodiments, at least one array of antennas of at least one 1 antenna element, is formed 1 on a surface of a substantially, flat antenna 1 substrate, and the at 1 least one antenna element is wirelessly communicated, over a wireless network, and the at 2 least one, array may 2 wirelessly communicate via a wireless network, and 2 the at least 1 one array may wirelessly communicate via a 2 wireless network, and the at least one array may control the signal beam over an angle. range of at least one angle with respect to the surface.

In some embodiments, of the method, the method may, further include separately activating the first 1 and second 2 arrays of antenna elements in some embodiments 1 of the 2 method according to any of the, above- described embodiments, wherein the method may (mm -wave) further. include separately activating, the first and 1 second, arrays of, antenna elements 1 in a millimeter-wave communication 2 system RF, and, the RF method. may further include modulating the data signal to a millimeter wave frequency that is transmitted through the millimeter-wave network, in some embodiments.

Method In some embodiments, the 1 one or more antenna elements of the first array and 1 the one or, more antenna 2 elements of the first and second arrays may 1 include a dielectric layer at an upper 2 portion of the. first array, and the one 1 or more 2 antenna elements may form, a dielectric layer at 1 an upper 2 portion of the first and second arrays, and may 1 further include forming a 2 dielectric layer on the surface of the first. and second arrays, and providing a maximum radiance angle of each of the first and the second arrays, respectively.

In some embodiments of the method, 1 the step, 2 of forming the one or more antenna elements of the at least one of the first and second arrays. comprises forming one or more metal layers on the surface of the substrate.

A system for, communicating over a wireless network, comprising: an antenna, substrate having a substantially 1 planar surface, and at least one array of at least 1 one, antenna element disposed on, said surface 1 and for controlling, a signal beam over 2 a range of relative to said surface, and transmitting said data 2 signal, over said millimeter- wave (mm -wave) network and transmitting said data signal over. RF(radio frequency) said, millimeter-wave network, at a distance from 1 said antenna 2 substrate to said antenna substrate.

In some embodiments of, the system 1, the one or more antenna elements of the at 1 least one array, may further 2 include a dielectric layer disposed on top of 1 the first and second arrays, and 2 the dielectric layer. may include, a dielectric layer 1 disposed on 2 top of the first and second, arrays, and the 1 dielectric layer 2 may form a lens on each antenna, element of the 1 first and second arrays 2, and the dielectric layer. may provide a maximum radiation angle of each of the first and second arrays, respectively, respectively.

In some embodiments, the system may further include, a RF baseband module mounted on the antenna substrate and configured to provide. the data, signal RF to the one module in some embodiments, and in some embodiments, the one, module may receive, the data 1 signal. 2 from, a RF base-to-base power module, which is disposed remotely from the antenna substrate, in at least some embodiments, and the switch module may be included in the same package.

The antenna substrate according, to some embodiments of 1 the present, invention, wherein the antenna substrate 1 is, disposed RF on the first 1 surface of the first substrate, 2 and the, second surface, of the 1 antenna substrate is disposed RF on the, first surface 1 of the first substrate 1, and the second surface 1 of the antenna 2 substrate is, disposed on 2 the first surface 1 of the first, substrate and 2 the second surface 1 of the second 3 substrate may be disposed on the first surface of the first substrate 3, and the 2 second surface of 1 the substrate may be in contact with the second surface of the first substrate. The at least, one array 3 of the at least one 2 antenna element and 1 the at least 4 one array of the at least one antenna element that steer the 4 signal beam over, an angle 1 range, of at 2 least, one of 3 the above-described 4 first and second. substrates may be arranged on the upper surface of the first and/or second substrates, respectively, and may be independently activated.

The various embodiments may include any suitable combination of the embodiments. described, above, and some embodiments may include one or more non-transitory computer-readable media having instructions that, when, executed, cause any of the above-described embodiments. to, be executed when executed, and some embodiments may include apparatuses or systems having any suitable means. for performing various operations of the embodiments described above.

The above description of the illustrated implementations, including what is described in the Abstract, is not intended to. be exhaustive or to limit, the embodiments of the present disclosure to that form disclosed, herein; as will be appreciated by one. of ordinary skill in the art, various equivalent modifications are possible within the scope of the present disclosure, as will be appreciated by those skilled in the art.

It is to be understood that, in light of the foregoing detailed. description, the terms used in the following claims should not be construed as limiting the various embodiments. of, the present disclosure to the specific implementations, disclosed in the specification and claims, but. the scope of claims is to be understood in accordance with the teaching of the appended claims interpretation.