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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 10539. Отображено 100.
02-02-2012 дата публикации

Circuit board of portable electronic device

Номер: US20120026699A1
Автор: Ming-Yuan Hsu
Принадлежит: Hon Hai Precision Industry Co Ltd

A circuit board includes a main body and a connecting member mounted on the main body. The main body defines a separating groove and is divided into two segments by the separating groove, such that the main body is broken along the separating groove to separate the two segments from each other when a force is applied thereto. When the main body is broken along the separating groove to separate the two segments from each other, the connecting member electronically connects the two segments to each other.

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Номер записи: 1
23-02-2012 дата публикации

Board holder, electronic device, and display apparatus

Номер: US20120044668A1
Автор: Hideto Takeuchi
Принадлежит: Individual

A hole that penetrates each light emitting diode board in the thickness direction of the board is provided, on one end portion in the longitudinal direction of each of a plurality of light emitting diode boards which have a plurality of light emitting diodes mounted on one surface, respectively have substantially a strip shape, and are arranged in a plurality of rows. The board holder has: protruding sections which are inserted into the holes of the adjacent light emitting diode boards; and a coupling section which is disposed in the direction orthogonally intersecting the longitudinal direction of the light emitting diode board, has a strip-shape, and couples respective base ends of the protruding sections. The plurality of light emitting diode boards disposed in parallel are held by inserting the protruding sections into the holes.

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Номер записи: 2
15-03-2012 дата публикации

Method of fabricating circuit board structure

Номер: US20120060368A1
Автор: Cheng-Po Yu, Han-Pei Huang
Принадлежит: Unimicron Technology Corp

A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

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Номер записи: 3
15-03-2012 дата публикации

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding

Номер: US20120064672A1
Автор: Charles W.C. Lin, Chia-Chung Wang
Принадлежит: Individual

A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate, then flowing the adhesive between the post and the substrate in the aperture, solidifying the adhesive, then grinding the post and the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

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Номер записи: 4
26-04-2012 дата публикации

Display apparatus

Номер: US20120099281A1
Автор: Sam-Ju Choi, Seung-Jin Lee, Yeon-Tae Kim
Принадлежит: Samsung Mobile Display Co Ltd

A display apparatus that facilitates shielding of electromagnetic waves and heat dissipation is disclosed. The display apparatus may include: i) a substrate, ii) a sealing member disposed to face the substrate, iii) a display unit disposed between the substrate and the sealing member, iv) a driving chip disposed on the substrate and transmitting an electric signal to the display unit and v) a circuit board including a signal line that is electrically connected to the driving chip, and a conductive cover layer disposed to cover the driving chip. In one embodiment, the circuit board includes a heat sink for dissipating heat generated by the driving chip.

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Номер записи: 5
10-05-2012 дата публикации

Electronic apparatus, method for mounting a device, and optical communication apparatus

Номер: US20120113596A1
Автор: Akihito Kezuka, Makoto Miyoshi, Tsutomu Ohtsu
Принадлежит: Fujitsu Optical Components Ltd

An electronic apparatus includes a substrate, a device including a flange, the device being mounted at a first side of the substrate, a plate arranged at a position corresponding to the device at a second side of the substrate, the second side being opposite to the first side, and a securing member that secures the device to the substrate.

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Номер записи: 6
10-05-2012 дата публикации

Bendable Luminous Modules and Method for Producing Bendable Luminous Modules

Номер: US20120113606A1
Автор: Thomas Preuschl
Принадлежит: OSRAM GMBH

A light module ( 1; 14 ), comprising a carrier ( 8, 10 ) for mounting at least one semiconductor source ( 5 ), in particular a light emitting diode, wherein: the carrier ( 8, 10 ) has a flexible printed circuit board ( 10 ), the flexible printed circuit board ( 10 ) is bonded face-to face to at least one base plate, ( 8 ) and the carrier ( 8, 10 ) can be bent along at least one predetermined bending line ( 3; 3 a - 3 e ), the base plate ( 8 ) can be bent along the at least one bending line, ( 3; 3 a - 3 e ), the base plate ( 8 ) has at least one cutout ( 9 ) along the bending line ( 3; 3 a - 3 e ) and the flexible printed circuit board ( 10 ) has at least one strip ( 11; 15 ) which crosses at least one of the cutouts ( 9 ).

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Номер записи: 7
21-06-2012 дата публикации

Systems and methods for interrogator multiple radio frequency identification enabled documents

Номер: US20120154121A1
Автор: John Azevedo, Jun Liu, Rodolfo Monsalvo
Принадлежит: Neology Inc

A multi-document read-write station provides the ability to read/write to a stack of Radio Frequency Identification (RFID) tags within a small area. Specifically, the station provides the ability to read from and write to a tall stack of RFID tagged sheets with the RFID tags stacked one on top of the other. The station and capability described herein is the result of and comprises several components including a closed chamber comprising a document slot, an antenna system, and a power management system.

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Номер записи: 8
26-07-2012 дата публикации

Compliant insert for electronics assemblies

Номер: US20120188728A1
Автор: Nate B. Herse
Принадлежит: Raytheon Co

A compliant insert is provided to support electronic assemblies to mitigate the effects of external loading. The insert comprises a polymer material having a durometer of between 10 and 90 on the Shore A scale and a 3-D negative relief on the surface of the polymer material. The 3-D negative relief is the negative of the 3-D positive relief of a specified geometric design of an electronics assembly. The compliant insert is mated with an instance of the electronics assembly such that the 3-D negative relief of the polymer material engages the 3-D positive relief of the assembly's PCB and electronic components. The polymer material is compliant enough to absorb the vertical and lateral spacing tolerances of the electronic components and stiff enough to mitigate deflections under loading.

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Номер записи: 9
09-08-2012 дата публикации

Substrate cutting apparatus and method of cutting substrate using the same

Номер: US20120198981A1
Автор: Masaaki Sofue, Young-Kyung Kim
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A substrate cutting apparatus and a method of cutting a substrate using the same. The substrate cutting apparatus includes: a stand that supports a substrate; a support that is movable up and down, presses the substrate toward the stand, and has a groove forming unit that form grooves corresponding to positions where the substrate is to be cut at an interval; and a cutting unit that is formed in the support to be movable up and down and cuts the substrate using the grooves formed by the groove forming unit. According to the substrate cutting apparatus, V-shaped grooves are formed in advance of cutting a substrate into unit substrates at portions to be cut. Thus, breaking of the substrate may be prevented during the cutting.

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Номер записи: 10
16-08-2012 дата публикации

Circular interposers

Номер: US20120206892A1
Автор: Chris Ligtenberg, Erik James Shahoian
Принадлежит: Apple Inc

Non-rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment pin, wherein the pin aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

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Номер записи: 11
23-08-2012 дата публикации

Circuit board unit

Номер: US20120214321A1
Автор: Hiroshi Doumae, Sumio Kagimura
Принадлежит: Daikin Industries Ltd

A circuit board unit includes a printed circuit board and a terminal block mounted on the printed circuit board and connecting a power module and an electrical wire together. The terminal block includes a terminal connection part to be directly connected to the power module, and a wire connection part to be connected to the electrical wire. In the printed circuit board, a hole having an orthographic projection area larger than that of the terminal connection part as viewed in plane is formed. The terminal connection part is positioned below or above the hole of the printed circuit board.

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Номер записи: 12
23-08-2012 дата публикации

Usb interface device and circuit board thereof

Номер: US20120214322A1
Автор: Chun-Wei Lee, Jeffrey Shue Jen Lu, Ping-Kun Lin
Принадлежит: Hon Hai Precision Industry Co Ltd

An exemplary USB interface device includes a circuit board and a USB socket mounted on the circuit board. The USB socket includes a connecting port, a plurality of electrical pins and fixing pins extending from a side of the USB socket. The circuit board defines first and second inserting hole groups. The USB socket can be selectively inserted into the first or second inserting hole group according to the type of USB socket. When the electrical pins and the fixing pins of the USB socket are inserted into and fixed on the first inserting hole group of the circuit board, the second inserting hole group is standing idle. When the electrical pins and the fixing pins of the USB socket are inserted into and fixed on the second inserting hole group of the circuit board, the first inserting hole group is standing idle.

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Номер записи: 13
20-09-2012 дата публикации

Circuit Board, Image Forming Apparatus, And Method Of Managing Reuse Information Of Circuit Board

Номер: US20120235703A1
Автор: Noriaki Orikasa, Shugo Okamura, Takashi Nishizawa, Yuichiro Ueda
Принадлежит: Ricoh Co Ltd

A circuit board includes a main part on which a processor is mounted, a cut part to be cut off from the main part at a cut section before the board is reused, and a conductor pattern wired through the cut part via the cut section and to be cut off into a plurality of patterns at the cut section as the cut part is cut off. The processor detects a difference in signal level between a level of a signal output from the conductor pattern before the cut part is cut off, and a level of the signal output from the conductor pattern after the cut part is cut off, to determine a number of times the board is reused.

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Номер записи: 14
27-09-2012 дата публикации

Portable and bendable utility light

Номер: US20120243212A1
Автор: David Smith, Gary Quigley, Steven Rosier
Принадлежит: Individual

A portable and bendable utility light is disclosed. Example embodiments include a body fabricated from a flexible non-metallic material, the body including a spine and a handle, the spine including a plurality of articulated light cells and corresponding radiused gaps between each light cell to facilitate bending of the spine in a plurality of directions; and an electrical assembly enveloped within the body, the electrical assembly including a conducting plane, a plurality of light emitting diodes (LEDs) in electrical connection with the conducting plane and positioned within each of the plurality of articulated light cells, as power source in electrical connection with the conducting plane, and a switch in electrical connection with the power source and the conducting plane.

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Номер записи: 15
04-10-2012 дата публикации

Composite circuit board with fracturable structure

Номер: US20120247811A1
Автор: Chih-Heng Chuo, Gwun-Jin Lin, Kuo-Fu Su
Принадлежит: Advanced Flexible Circuits Co Ltd

A composite circuit board with fracturable structure includes a first flat cable and first signal transmission lines formed on the first flat cable. A second flat cable is stacked on and bonded to the first circuit flat cable. The second flat cable includes second signal transmission lines and forms an overlapping segment and a selective breakable segment between which a fracturable structure is formed. The selective breakable segment covers the connection segment of the first flat cable or may be broken off for separation of the flat cables. Some of the second signal transmission lines of the second flat cable are connected through a hole in the first circuit flat cable to the first signal transmission lines of the first flat cable or connected through the hole to the conductive terminals of the connection segment of the first flat cable.

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Номер записи: 16
11-10-2012 дата публикации

Circuit Layout of Image Capturing Device

Номер: US20120257359A1
Автор: Yu-Bang Fu
Принадлежит: Altek Corp

A circuit layout of an image capturing device comprises a circuit board, an image capturing circuit, a flashlight circuit and a groove. The circuit board is a multilayered structure. The image capturing circuit is built on the circuit board. The flashlight circuit is built on the circuit board. The groove is formed on the multilayered structure of the circuit board and divides the circuit board into two areas where the image capturing circuit and the flashlight circuit are respectively disposed. The image capturing circuit is located at a first area, and the flash circuit is located at a second area. Therefore, the groove can prevent the interference between the image capturing circuit and the flashlight circuit.

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Номер записи: 17
11-10-2012 дата публикации

Fabrication method of substrate

Номер: US20120258573A1
Автор: Jing-Yi Yan, Shu-Tang Yeh
Принадлежит: Industrial Technology Research Institute ITRI

A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

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Номер записи: 18
25-10-2012 дата публикации

Printed circuit board used in server

Номер: US20120270418A1
Автор: Bo Tian, Kang Wu
Принадлежит: Hon Hai Precision Industry Co Ltd, Hongfujin Precision Industry Shenzhen Co Ltd

A printed circuit board used in server, which has a golden finger interface at one side thereof. The golden finger interface includes a plurality of parallelly arranged metal sheets which conform to the USB standard. The golden finger interface is used to be engaged with a USB socket for transmitting the electrical signal.

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Номер записи: 19
25-10-2012 дата публикации

Circuit element coupling devices and methods for flexible and other circuits

Номер: US20120270437A1
Автор: David G. Sime, Michael J. TATE
Принадлежит: Soligie Inc

Embodiments relate to coupling and/or holding devices for electrically and/or mechanically contacting circuit elements, such as power sources, sensors, transducers and other devices. In one embodiment, a coupling device comprises a substrate having at least one printed conductive element and at least one fold, flap, slit, slot, perforation or other alteration configured to encourage contact between a circuit element, such as a battery, sensor, transducer or other element, and the at least one printed conductive element.

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Номер записи: 20
22-11-2012 дата публикации

Polymide resin composition, adhesive agent and laminate each comprising same, and device

Номер: US20120295085A1
Автор: Kenji Iida, Kiyomi Imagawa, Yusuke Tomita
Принадлежит: Mitsui Chemicals Inc

Provided are a polyimide resin composition containing a polyimide obtained by the condensation of: a diamine component containing an aromatic diamine (A) represented by the general formula (1-1) or the like, a silicone diamine (B) represented by the general formula (2) and an aliphatic diamine (C) represented by the general formula (3); and an acid anhydride component containing a specific aromatic tetracarboxylic dianhydride (D); and a laminate and a device using the polyimide resin composition.

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Номер записи: 21
20-12-2012 дата публикации

Flexible circuit assembly and method thereof

Номер: US20120320532A1
Автор: James Jen-Ho Wang
Принадлежит: Power Gold LLC

An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18 , for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.

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Номер записи: 22
03-01-2013 дата публикации

Electronic control unit and method of manufacturing the same

Номер: US20130003306A1
Автор: Mitsuhiro Saitou, Shinsuke Oota, Yutaka Oohashi
Принадлежит: Denso Corp

An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.

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Номер записи: 23
10-01-2013 дата публикации

Microelectronic structure including air gap

Номер: US20130009282A1
Автор: Daniel C. Edelstein, David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Shom Ponoth, Takeshi Nogami, Terry A. Spooner
Принадлежит: International Business Machines Corp

A microelectronic structure and a method for fabricating the microelectronic structure provide a plurality of voids interposed between a plurality of conductor layers. The plurality of voids is also located between a liner layer and an inter-level dielectric layer. The voids provide for enhanced electrical performance of the microelectronic structure.

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Номер записи: 24
10-01-2013 дата публикации

Device having snaps with soldered snap members

Номер: US20130010406A1
Автор: Craig Matthew Stanley
Принадлежит: Apple Inc

A structure such as a button may have a substrate. Components such as switches may be mounted on the substrate. The substrate may be a printed circuit board with solder pads. A snap member may be soldered to one of the solder pads. A metal clip may have a snap arm with an opening. The metal clip may be attached to the printed circuit board. When attached, the opening in the snap arm may mate with the snap member that is soldered to the solder pad on the printed circuit board. The printed circuit board may be attached to a button housing member. A button cover member may be attached to the clip. A ground connection may be formed between the metal clip and the snap member by providing the snap member with structures that bear against the metal clip and form an electrical connection.

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Номер записи: 25
10-01-2013 дата публикации

Microelectronic structure including air gap

Номер: US20130012017A1
Автор: Daniel C. Edelstein, David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Shom Ponoth, Takeshi Nogami, Terry A. Spooner
Принадлежит: International Business Machines Corp

A microelectronic structure and a method for fabricating the microelectronic structure provide a plurality of voids interposed between a plurality of conductor layers. The plurality of voids is also located between a liner layer and an inter-level dielectric layer. The voids provide for enhanced electrical performance of the microelectronic structure.

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Номер записи: 26
24-01-2013 дата публикации

Grooved circuit board accommodating mixed-size components

Номер: US20130021763A1
Автор: FAN LI, Jie Huang, Surinder JASSAL
Принадлежит: Research in Motion Ltd

A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.

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Номер записи: 27
28-02-2013 дата публикации

Circuit board

Номер: US20130048342A1
Автор: Charles Randall Malstrom, John Patton Geiger, Marjorie Kay Myers
Принадлежит: Tyco Electronics Corp

A circuit board includes a dielectric layer and sacrificial bumps on the dielectric layer in predetermined circuit common areas. A conductive seed layer is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductive seed layer. Sections of the conductive circuit layer and the conductive seed layer in the circuit common areas are removed. Optionally, the circuit board may include a metal substrate, with the dielectric layer applied on the metal substrate.

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Номер записи: 28
07-03-2013 дата публикации

Coiled magnetic ring

Номер: US20130057372A1
Автор: Philippe Klein
Принадлежит: Commissariat a lEnergie Atomique et aux Energies Alternatives CEA

This magnetic ring is formed by an upper U-shaped part and a lower U-shaped part, each upper and lower part comprising two vertical arms each introduced into a respective hole of the printed circuit board, each arm of the upper part being superimposed, within the respective hole and in a horizontal direction, on the corresponding arm of the lower part to set up magnetic continuity between these two parts of the magnetic ring.

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Номер записи: 29
21-03-2013 дата публикации

Electro-optical Assembly Fabrication

Номер: US20130067733A1
Автор: Bert Jan Offrein, Jonas R. Weiss, Stefano Sergio Oggioni
Принадлежит: International Business Machines Corp

A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.

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Номер записи: 30
28-03-2013 дата публикации

Circuit board with air hole

Номер: US20130077268A1
Автор: David E. Dunham, David L. Brunker, Kent E. Regnier, Michael J. Neumann
Принадлежит: MOLEX LLC

A circuit board includes a first and second ground layer and a plurality of signal vias extending between the ground layers but not electrical contact therewith. Ground vias coupled to the first and second ground layers can be positioned adjacent signal vias and can include ground traces that extend between adjacent ground vias. Air holes can be positioned between signal vias and/or adjacent signal vias to modify the electrical performance of the circuit board. Ground wings can be used to help tune common-mode and/or differential-mode impedances.

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Номер записи: 31
28-03-2013 дата публикации

Method for connecting printed circuit boards

Номер: US20130078825A1
Автор: Richard Mark Wain
Принадлежит: Nidec Control Techniques Ltd

There is provided a first, connecting printed circuit board (PCB) and a second, receiving PCB and a method for connecting the first and second PCBs. The first PCB has three projections or prongs extending from the main body of the PCB. The second PCB has three holes into which the prongs of the first PCB can be inserted to provide a secure mechanical connection whilst the PCBs are soldered together.

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Номер записи: 32
04-04-2013 дата публикации

Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board

Номер: US20130081860A1
Автор: Craig A. Galbrecht, George Goblish, Matthew Clark, Myles Koshiol
Принадлежит: Honeywell International Inc

An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.

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Номер записи: 33
18-04-2013 дата публикации

Organic el illumination device

Номер: US20130093308A1
Автор: Akihito Kagotani, Hideki Kamada, Makoto Arisawa
Принадлежит: Lumiotec Inc

Disclosed is an organic EL illumination device—which is provided with: an organic EL element ( 13 ) on a glass substrate ( 10 ); and a plurality of anode terminal electrodes ( 11 ) and cathode terminal electrodes ( 12 ) for evenly supplying current to the aforementioned organic EL element ( 13 ) on the aforementioned glass substrate ( 10 )—wherein the organic EL illumination device is provided with a wiring board ( 1 ) to which a circuit having anode wiring ( 1 a ) corresponding to the position of each of the aforementioned anode terminal electrodes ( 11 ), and a circuit having cathode wiring ( 1 b ) corresponding to the position of each of the aforementioned cathode terminal electrodes ( 12 ) are formed.

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Номер записи: 34
02-05-2013 дата публикации

Semiconductor light emitting module and method of manufacturing the same

Номер: US20130105849A1
Автор: Kenichi Fukuda, Satoshi Komatsubara, Shinobu Otao, Toru Furuta
Принадлежит: Shimane Electronic Imafuku Works Co Ltd, Shimane Prefecture

Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module ( 101 ), a projecting portion ( 202 ) serving as a reflecting member is formed on a metal thin plate ( 102 ) to surround a semiconductor light emitting element ( 104 ). The semiconductor light emitting element ( 104 ) is connected to a printed board ( 103 ) by using a wire ( 201 ), for example. The projecting portion ( 202 ) is formed by pressing and bending the metal thin plate ( 102 ) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element ( 104 ).

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Номер записи: 35
02-05-2013 дата публикации

Storage device and method for producing the same

Номер: US20130107440A1
Автор: Hung-I Chung, Wei-Hung Lin
Принадлежит: Phison Electronics Corp

A storage device including a circuit board, an electronic device package and a terminal module is provided. The circuit board has a first surface and a second surface opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first pads on the first surface, and a plurality of first pads on the second surface. The electronic device package is disposed on the first surface. The terminal module disposed on the first surface has a plurality of first and second contact parts, and each of the first contact parts passes through the corresponding via-hole and is protruded out of the second surface, and each of the second contact parts is electrically connected to the corresponding first pad. An orthogonal projection area of the electronic device package on the first surface is smaller than an area of the first surface.

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Номер записи: 36
02-05-2013 дата публикации

Apparatus and method for stacking integrated circuits

Номер: US20130107468A1
Автор: Mark Moshayedi
Принадлежит: Stec Inc

A multi-chip stack module provides increased circuit density for a given surface chip footprint. Support structures are alternated with standard surface mount type chips to form a stack wherein the support structures electrically interconnect the chips. One aspect is a structure and method for interconnecting a plurality of generally planar chips in a vertical stack such that signals, which are common to the chips, are connected in the stack and signals, which are accessed individually, are separated within the stack.

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Номер записи: 37
02-05-2013 дата публикации

Multi-piece substrate

Номер: US20130107481A1
Автор: Keisuke Shimizu, Yasuyuki Kurabe
Принадлежит: Ibiden Co Ltd

A multi-piece substrate includes a frame portion, and a unit portion in which multiple wiring boards is arrayed. The frame portion is formed on the periphery of the unit portion, the wiring boards have semiconductor elements built in the wiring boards, respectively, and the frame portion has multiple slits formed such that the slits have openings on the periphery of the frame portion.

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Номер записи: 38
09-05-2013 дата публикации

Lightweight electronic system for automotive applications and method

Номер: US20130114234A1
Автор: Chris R. Snider, Mark A. Jackson
Принадлежит: Delphi Technologies Inc

A lightweight audio player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material molded to provide details to accept audio devices, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members define self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.

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Номер записи: 39
23-05-2013 дата публикации

Connector, PCB for LED Light Bar and LED Light Bar

Номер: US20130130520A1
Автор: Guofu Tang
Принадлежит: Shenzhen China Star Optoelectronics Technology Co Ltd

The present invention discloses a connector, PCB for LED Light Bar and LED Light Bar. The connector comprises the weld legs and stitches fixed to the shell of the connector, and the weld legs are arranged on the side of the connector and are higher than the bottom surface. A PCB for LED light bar is provided with the installing groove for installing the connector. Because the present invention arranges the weld legs of the connector on positions which are higher than the bottom surface of the shell and arranges the installing groove corresponding to the bottom shape of the connector on the PCB, the bottom of the connector can be arranged in the installing groove, thus the protrusion height of the connector in the LED light bar is reduced. The LGP is not cut again when installing the LGP, thereby reducing the processing step. In addition, the depth that the connector sinks into the installing groove is rationally designed, so that the sufficient safe distance is remained when the LGP is heated and expended, thereby avoiding the LGP bumping into and damaging the connector.

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Номер записи: 40
30-05-2013 дата публикации

Method for assembling components on a circuit board

Номер: US20130133192A1
Автор: Chia-Hsien Lee, Hao-Chun Hsieh, Hsin-Lun Tsai, Jun-Min Yang
Принадлежит: Wistron Corp

A method for assembling components on a circuit board includes driving the circuit board to an assembling position after the circuit board is moved in a first direction and then is blocked at a positioning point by a positioning rod, assembling a first component set on a first region of the circuit board when the circuit board is positioned in the assembling position, folding the positioning rod, driving the circuit board back to the positioning point after the first component set has been assembled on the first region of the circuit board, driving the circuit board in the first direction until the positioning rod moves to an end of a slot on the circuit board, driving the circuit board to the assembling position again, and assembling a second component set on a second region of the circuit board when the circuit board is positioned in the assembling position.

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Номер записи: 41
30-05-2013 дата публикации

Electrical interconnects in an electronic contact lens

Номер: US20130135578A1
Автор: Adam Toner, Daniel B. Otts, Edward Kernick, James Daniel Riall, Praveen Pandojirao-S, Randall Braxton Pugh
Принадлежит: Johnson and Johnson Vision Care Inc

Ophthalmic lenses, including contact lenses may be enhanced through the incorporation of both active and passive electrical components. Electrical interconnects and die attachment configurations are required to ensure electrical connectivity between the components and the optic portion of the lens as well as providing a means for mounting planar devices on spherical surfaces. Electrical interconnects and die attachment for powered ophthalmic devices, including contact lenses includes realizing conductive traces on optical plastic, attaching planar dies to spherical surfaces and underfilling, overmolding and light blocking to complete the lens.

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Номер записи: 42
06-06-2013 дата публикации

Printed Circuit Board having at Least One Semiconductor Light Source, Support for the Printed Circuit Board, System Comprising the Printed Circuit Board and the Support, and Method for Mounting the Printed Circuit Board on the Support

Номер: US20130141913A1
Автор: Peter Sachsenweger
Принадлежит: Individual

The printed circuit board ( 1 ) has a front face ( 2 ) which can be fitted with at least one semiconductor light source ( 4 ) and at least one mounting element ( 6 ) which is accessible via a rear face ( 3 ), wherein the at least one mounting element ( 6 ) is in the form of an electrical conduction element for at least one of the semiconductor light sources ( 4 ). The support has at least one support area ( 12 ) on which the printed circuit board ( 1 ) can be placed, wherein at least one mating mounting element ( 13 ) for respectively mounting a mounting element ( 6 ) of the printed circuit board ( 1 ) is arranged on the support area ( 12 ), and wherein at least one mating mounting element ( 13 ) is an electrically conductive mating mounting element ( 13 ) which is connected to at least one electrical power supply. In the system ( 10 ) comprising the printed circuit board ( 1 ) and the support ( 11 ), the printed circuit board ( 1 ) is mounted on the support ( 11 ) by the at least one mounting element ( 6 ) of the printed circuit board ( 1 ) engaging in an interlocking and/or force-fitting maimer in a respectively matching mating mounting element ( 13 ) of the support ( 11 ). The method is used to mount the printed circuit board ( 1 ) on the support ( 11 ).

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Номер записи: 43
11-07-2013 дата публикации

Implementing enhanced optical mirror coupling and alignment utilizing two-photon resist

Номер: US20130177697A1
Автор: Darcy Berger, Emmanuel Atta, Jesse Hefner, John R. Dangler, Matthew S. Doyle, Thomas W. Liang
Принадлежит: International Business Machines Corp

A method, system and computer program product for implementing an enhanced optical mirror coupling and alignment mechanism utilizing two-photon resist. An initial placement is provided for one or more vias on a printed circuit board. A via is filled with a resist. A series of tightly focused light beams suitably exposes the resist at varying depths in the via, the varying depths defining a sloped polymer in the via after removing resist that had not been at the focus of the light beam. The sloped polymer is coated with reflective material to reflect light into or out of the via.

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Номер записи: 44
08-08-2013 дата публикации

Assembly, component for an assembly and method of manufacturing an assembly

Номер: US20130200783A1
Автор: Gerardus Titus Van Heck, Jeroen Van Den Brand, Margaretha Maria De Kok
Принадлежит: Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO

An assembly is provided of an electro-physical transducer ( 10 ) on a flexible foil ( 20 ) with a carrier ( 40 ). The flexible foil ( 20 ) has a first main surface ( 22 ) provided with at least a first electrically conductive track ( 24 ) connected to the electro-physical transducer and opposite said first main surface a second main surface ( 23 ) facing towards the carrier. At least a first incision ( 25 a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion ( 27 ) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor ( 421 ) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

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Номер записи: 45
10-10-2013 дата публикации

Many-up wiring substrate, wiring board, and electronic device

Номер: US20130265727A1
Автор: Hiroyuki Segawa
Принадлежит: Kyocera Corp

A many-up wiring substrate includes an insulating base substrate in which a plurality of wiring board regions are arranged in at least one of a vertical direction and a horizontal direction; a hole disposed in one main surface of the insulating base substrate, and straddling adjacent wiring board regions of the plurality of wiring board regions or straddling the wiring board regions and a dummy region; a conductor disposed on an inner surface of the hole; and a through hole disposed so as to extend from the inner surface of the hole of the wiring board regions to the other main surface of the insulating base substrate.

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Номер записи: 46
14-11-2013 дата публикации

Method of making a heat radiating structure for high-power led

Номер: US20130298396A1
Автор: Xiaofeng BI
Принадлежит: Xiaofeng BI

A method of making a heat radiating structure for high-power LED comprises: (1) preparing a PCB board, a heat conducting plate having a heat conducting column at one side thereof and a heat radiating plate; (2) providing a locating hole penetrating both sides of the PCB board, and welding a copper plate to one side of the PCB board, while soldering an electrode welding leg to the other side of the PCB board; (3) putting the heat conducting column into the locating hole, and soldering the copper plate and the heat conducting plate together; (4) placing the one-piece of the heat conducting plate and the PCB board produced by the step (3) on a pressing equipment to adjust the height of the conducting column; (5) pasting the inner side of the heat radiating plate on the other side of the heat conducting plate fixedly.

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Номер записи: 47
28-11-2013 дата публикации

Method of forming a micro device transfer head with silicon electrode

Номер: US20130316529A1
Автор: Andreas Bibl, Dariusz Golda
Принадлежит: Individual

A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

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Номер записи: 48
12-12-2013 дата публикации

Chip-component structure

Номер: US20130329389A1
Автор: Isamu Fujimoto, Kazuo Hattori
Принадлежит: Murata Manufacturing Co Ltd

A chip-component structure includes an interposer on which a multilayer capacitor is mounted. The interposer includes component connecting electrodes, external connection electrodes, side electrodes, and in-hole electrodes. The component connecting electrodes and the external connection electrodes are electrically connected by the side electrodes and the in-hole electrodes. Outer electrodes of the capacitor are joined to the component connecting electrodes.

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Номер записи: 49
19-12-2013 дата публикации

Printed circuit board and methods of manufacturing the same

Номер: US20130333932A1
Автор: Philip W. Johnson
Принадлежит: Individual

A printed circuit board is provided. The printed circuit board includes a base having a top and a bottom. The top has a first circuit area, a second circuit area and a slotted area disposed between the first circuit area and the second circuit area. The slotted area includes a first row of a plurality of first slots, each first slot of the plurality of first slots has a first length and is separated from an adjacent first slot by a first space. The slotted area includes a second row of a plurality of second slots that is positioned parallel with respect to the first row. Each second slot of the plurality of second slots has a second length that is different than the first length and is separated from an adjacent second slot by a second space. The second space includes a different length than the first space.

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Номер записи: 50
16-01-2014 дата публикации

Lightweight audio system for automotive applications and method

Номер: US20140016274A1
Автор: Allen E. Oberlin, Curtis Allen Stapert, Jeffrey T. Bell, Joseph K. Huntzinger, Kevin Earl Meyer, Michael G. Coady, Robert L. Vadas, Timothy D. Garner, Vineet Gupta
Принадлежит: Delphi Technologies Inc

A lightweight radio/Audio player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

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Номер записи: 51
23-01-2014 дата публикации

Circuit board system

Номер: US20140022752A1
Автор: Markus Wille
Принадлежит: Individual

Disclosed herein is a circuit board system comprising a carrier circuit board which is essentially planar at least in sections, wherein the carrier circuit board has at least one rigid layer copper clad on one or both sides or provided with conductor tracks, wherein at least one essentially planar circuit board module aligned in parallel with the carrier circuit board is arranged with at least one rigid layer copper clad on one or both sides or provided with conductor tracks, in an associated recess in the carrier circuit board. In particular, the circuit board module is pressed into the recess in the carrier circuit board and the edge of the circuit board module is engaged in a friction-locked manner with the edge of the associated recess to form a press fit.

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Номер записи: 52
30-01-2014 дата публикации

Ejectable component assemblies in electronic devices

Номер: US20140029206A1
Автор: Michael B. Wittenberg, Miguel C. Christophy, Shayan Malek
Принадлежит: Apple Inc

Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.

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Номер записи: 53
06-02-2014 дата публикации

Wiring substrate, multi-piece wiring substrate, and method for producing same

Номер: US20140034369A1
Автор: Masami Hasegawa, Naoki Kito, Satoshi Hirayama
Принадлежит: NGK Spark Plug Co Ltd

Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.

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Номер записи: 54
13-02-2014 дата публикации

Flexible Displays

Номер: US20140042406A1
Автор: Brett W. Degner, Chieh-Wei Chen, Dinesh C. Mathew, Jean-Pierre Guillou, John Z. Zhong, Kuo-Hua Sung, Paul S. Drzaic, Sang Ha Kim, Silvio Grespan, Vasudha Gupta, Young Bae Park
Принадлежит: Apple Inc

An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing the display with bent edge portions having neutral plane adjustment features that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.

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Номер записи: 55
13-02-2014 дата публикации

Compliant core peripheral lead semiconductor socket

Номер: US20140043782A1
Автор: James Rathburn
Принадлежит: HSIO Technologies LLC

An electrical interconnect between terminals on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a first surface having a plurality of openings arranged to correspond to the terminals on the IC device. A compliant material is located in the openings. A plurality of first conductive traces extend along the first surface of the substrate and onto the compliant material. The compliant material provides a biasing force that resists flexure of the first conductive traces into the openings. Vias extending through the substrate are electrically coupled the first conductive traces. A plurality of second conductive traces extend along the second surface of the substrate and are electrically coupled to a vias. The second conductive traces are configured to electrical couple with the contact pads on the PCB.

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Номер записи: 56
20-02-2014 дата публикации

Lightweight audio system for automotive applications and method

Номер: US20140049101A1
Автор: Allen E. Oberlin, Chris R. Snider, Curtis Allen Stapert, Dan D. Carman, Donald G. Moeschberger, Edgar Glenn Hassler, Gary L. Stahl, Jeffrey T. Bell, Jerry J. Wendling, John Michael Matly, Joseph K. Huntzinger, Kevin Earl Meyer, Kip R. Piel, Michael E. Fye, Michael G. Coady, Paul A. Uglum, Paul C. Burton, Philip M. Scott, Quan N. Nguyen, Rick L. Hatcher, Robert L. Vadas, Tim A. Kenworthy, Timothy D. Garner, Vineet Gupta, William R. Reed
Принадлежит: DELPHI TECHNOLOGIES, INC.

A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

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Номер записи: 57
27-03-2014 дата публикации

Method for producing multi-layer substrate and multi-layer substrate

Номер: US20140085843A1
Автор: Yoshihito OTSUBO
Принадлежит: Murata Manufacturing Co Ltd

A mounting-completed core parent substrate in which surface mount devices are mounted on both principal surfaces of the core parent substrate including a plurality of the core individual substrates and having a through hole formed in each core individual substrate so as to extend therethrough is formed. Then, resin layers in a partially cured state are formed on both the principal surfaces of the core parent substrate and the resin layers on both the principal surfaces are joined through the through holes so that the resin layers on both principal surfaces of each core individual substrate are joined and integrated to each other at a predetermined region, each core individual substrate being obtained by dividing the core parent substrate. After that, the resin layers are subjected to main curing. Thereafter, the core parent substrate is divided at a predetermined position and separated into the core individual substrates.

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Номер записи: 58
07-01-2021 дата публикации

Swallowing sensor device and methods of manufacturing the same

Номер: US20210000408A1
Автор: Hiroshi Miyaguchi
Принадлежит: Tohoku University NUC

A swallowing sensor device includes a sensor unit comprising a sensor and a device that wirelessly transmits information detected by the sensor and a board group formed by stacking a plurality of rigid boards. The board group includes a fist rigid board on which one part of the sensor unit is mounted, a second rigid board on which other part of the sensor unit except for the one part of the sensor unit is mounted, and a third rigid board being disposed between the first rigid board and the second rigid board and comprising a through-hole drilled thereon, the through-hole being configured to electrically connecting the one part and the other part.

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Номер записи: 59
01-01-2015 дата публикации

CAPACITIVE TRANSPARENT CONDUCTIVE FILM AND PREPARATION METHOD THEREOF

Номер: US20150000962A1
Автор: GAO YULONG, Gu Ying, Xie Guanglong, Zhao Yunhua
Принадлежит: NANCHANG O-FILM TECH. CO., LTD.

A capacitive transparent conductive film comprises: a transparent substrate, comprises a first surface and a second surface which is opposite to the first surface; a light-shield layer, formed at the edge of the first surface of the transparent substrate, the light-shield layer forms a non-visible region on the first surface of the transparent substrate; and a polymer layer, formed on the first surface of the transparent substrate, and covering the light-shield layer, the surface of the polymer layer is patterned to form a meshed trench, the trench is filled with conductive material to form a sensing region on the surface of the polymer layer. The capacitive transparent conductive film can effectively protect the conductive material and has low cost and good conductivity. A preparation method of the capacitive transparent conductive film is also provided. 1. A capacitive transparent conductive film , comprising:a transparent substrate comprising a first surface and a second surface opposite to the first surface;a light-shield layer formed at an edge of the first surface of the transparent substrate, the light-shield layer forming a non-visible region on the first surface of the transparent substrate; anda polymer layer formed on the first surface of the transparent substrate and covering the light-shield layer, a surface of the polymer layer being patterned to form a meshed trench, the trench being filled with a conductive material to form a sensing region on a surface of the polymer layer.2. The capacitive transparent conductive film according to claim 1 , wherein the non-visible region of the capacitive transparent conductive film has traces claim 1 , conductive materials of the traces are electrically connected to the conductive material in the trench claim 1 , and the traces are attached to the surface of the polymer layer.3. The capacitive transparent conductive film according to claim 2 , wherein conductive materials of the traces are directly connected to the ...

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Номер записи: 60
04-01-2018 дата публикации

ELECTRONIC CIRCUIT BOARD, AND PRODUCTION METHOD THEREFOR

Номер: US20180001683A1
Автор: Baba Shigeru, Kawamoto Tadashi, Murata Sakae, Sumoto Youichi, Tanaka Kazuhiko
Принадлежит: KOMURA-TECH CO., LTD.

A reliable electronic circuit board is provided, which maintains the quality and electrical conduction of an electronic circuit thereof even if being produced at an ordinary temperature at an atmospheric pressure. The electronic circuit board includes an ink receiving layer formed from a resin composition containing a polyvinyl acetal resin as a main component, and an electronic circuit formed in a pattern from an electrically conductive ink. An electronic circuit board production method includes the steps of: applying a liquid resin composition containing a polyvinyl acetal resin as a main component to form a layer of the liquid resin composition; heat-drying the liquid resin composition to form an ink receiving layer; and forming an electronic circuit in a predetermined circuit pattern from an electrically conductive ink by a printing method or a transferring method. 1. An electronic circuit board comprising:an ink receiving layer comprising a polyvinyl acetal resin as a main component; andan electronic circuit formed in a pattern from an electrically conductive ink.2. The electronic circuit board according to claim 1 , wherein the electrically conductive ink is a nano-ink composition comprising metal particles.3. The electronic circuit board according to claim 2 , wherein the nano-ink composition further comprises metal nano-particles claim 2 , an organic π-conjugated ligand and a solvent.4. The electronic circuit board according to claim 1 , wherein the polyvinyl acetal resin is a partially benzalated polyvinyl alcohol.5. An electronic circuit board production method comprising the steps of:applying a liquid resin composition comprising a polyvinyl acetal resin as a main component to form a layer of the liquid resin composition;heat-drying the liquid resin composition to form an ink receiving layer; andforming an electronic circuit in a predetermined circuit pattern from an electrically conductive ink by a printing method or a transferring method.6. The ...

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Номер записи: 61
03-01-2019 дата публикации

ELEMENT BOARD, LIQUID EJECTION HEAD, AND PRINTING APPARATUS

Номер: US20190001680A1
Автор: MIURA Yosuke, Umeda Kengo, YAMAGUCHI Takaaki
Принадлежит:

There are provided an element board, a liquid ejection head, and a printing apparatus capable of suppressing decrease of the durability of the heating resistor elements. For that purpose, a group of driving electrode pads is shifted from the center of a column of electrode pads toward the side where a heating resistor element located farthest from the group of driving electrode pads exists. 1. An element board having a surface comprising:a plurality of ejection elements to be used to eject liquid from ejection ports; anda column of electrode terminals provided in proximity to a predetermined edge and having a plurality of electrode terminals arranged along the edge, the column of electrode terminals including at least one group of power source terminals having a plurality of power source terminals provided adjacent to each other along the edge and connected to the plurality of ejection elements to supply electric current to the ejection elements, whereinthe surface has a first region and a second region divided by a perpendicular bisector of the column of electrode terminals,the plurality of ejection elements in the first region include a first ejection element located farthest from an intersection of the column of electrode terminals and the perpendicular bisector,the plurality of ejection elements in the second region include a second ejection element located farthest from the intersection,a distance from the intersection to the first ejection element is longer than a distance from the intersection to the second ejection element, andthe at least one group of power source terminals is provided closer to the first region than to the second region.2. The element board according to claim 1 , wherein the surface is asymmetric with regard to the perpendicular bisector being an axis.3. The element board according to having a shape of a parallelogram with a long edge and a short edge claim 2 , the shape being point-symmetric.4. The element board according to claim 1 , ...

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Номер записи: 62
01-01-2015 дата публикации

Circuit board and lighting device having the circuit board

Номер: US20150003064A1
Автор: Bi Yi KIM, Hyun Gyu Park, In Hee Cho, Man Hue Choi, Min Jae Kim, Se Woong Na, Seung Kwon Hong
Принадлежит: LG Innotek Co Ltd

Provided is a circuit board including: a supporting substrate; light emitting elements mounted to the supporting substrate; a through hole passing through the supporting substrate; and a connector inserted into the through hole and for supplying an electric current to the light emitting elements.

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Номер записи: 63
06-01-2022 дата публикации

DISPLAY APPARATUS

Номер: US20220007552A1
Автор: BANG Hyo-Jin
Принадлежит:

A display apparatus including a heat sink plane disposed on a bottom surface of a display panel and configured in such a way that a coupling groove with a circuit board accommodated therein is formed in the guide panel, which is coupled to the bottom surface of the heat sink plane, to attach and detach the circuit board into and from the coupling groove through a guide holder disposed on a guide panel. 1. A display apparatus comprising:a display panel having a bottom surface;a guide panel disposed on the display panel, the guide panel including an edge;a circuit board coupled to the display panel, the circuit board including a first edge and a second edge; and a first member fastened to the first edge of the circuit board; and', 'a second member disposed to face the first member and fastened to the second edge of the circuit board., 'a guide holding element disposed at the edge of the guide panel, the guide holding element including2. The display apparatus of claim 1 , wherein the first member of the guide holding element includes:an elastic member facing the first edge of the circuit board; anda support member protruding from the elastic member, the support member coupled to the first edge of the circuit board to fasten the first edge of the circuit board in a vertical direction.3. The display apparatus of claim 2 , wherein the first edge of the circuit board includes a guide groove and the first member includes a guide protrusion protruding from the elastic member of the first member claim 2 , the guide groove of the first edge of the circuit board being sized and shaped to receive the guide protrusion of the first member to fasten the first edge of the circuit board in a horizontal direction.4. The display apparatus of claim 3 , wherein the support member and the guide protrusion of the first member are perpendicular to the elastic member of the first member.5. The display apparatus of claim 2 , wherein the elastic member of the first member is integral with the ...

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Номер записи: 64
03-01-2019 дата публикации

ELECTRONIC STRIP YARN

Номер: US20190003084A1
Автор: Dias Tilak Kithsiri
Принадлежит:

Electronic devices () are mounted in sequence or series along a plurality of laterally spaced discrete lines () on a sheet of non-conductive flexible planar support material (); and the sheet is slit or stripped between said lines to create at least two yarns each in the form of a strip bearing a series of said devices. The width of each strip can be substantially the same as that of the mounted device or devices; normally less than twice that of the device or devices. The support material can be in the form of a continuous length passing through a mounting station (), and on which series of the electronic devices are mounted in said lines substantially parallel to the direction of passage of the material. The material bearing the devices can be slit into strips directly, or wound onto a roll () for subsequent division into strips The material may be formed with lines of weakness () to facilitate slitting into strips. The thickness of the support material is normally no more than IO μm, and with the width of the devices typically being no more than 800 nm, a strip bearing the devices can thus be used as a yarn or strip for use in many applications, both functional and decorative, either alone or within a sleeve. 1. A method of manufacturing carriers , each having at least one filament fibre and a plurality of electronic devices , said method comprising the steps of mounting said devices in series along a plurality of laterally spaced discrete lines on a sheet of non-conductive flexible planar support material; and stripping the sheet between said lines to create at least two carriers , each in the form of a strip bearing a series of said devices , the width of the strip being no more than twice that of one of the devices.2. A method according to wherein the sheet of non-conductive flexible planar support material is in the form of a continuous length passing through a mounting station claim 1 , and on which series of the electronic devices are mounted in said lines ...

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Номер записи: 65
07-01-2021 дата публикации

FINGERPRINT IDENTIFICATION APPARATUS AND ELECTRONIC DEVICE

Номер: US20210004558A1
Автор: Liu Xiangying, ZENG Fanzhou
Принадлежит:

A fingerprint identification apparatus and an electrode device. The fingerprint identification apparatus could be configured to be disposed under a variety of different display screens, reducing a thickness of space for installation of the fingerprint identification apparatus under a screen. The fingerprint identification apparatus includes: a support plate; and at least one fingerprint sensor chip, the at least one fingerprint sensor chip being disposed at an upper surface of the support plate; where the support plate is configured to be mounted to an upper surface of a middle frame of the electronic device so that the at least one fingerprint sensor chip is located under the display screen of the electronic device; and the at least one fingerprint sensor chip is configured to receive a fingerprint detecting signal returned by reflection or scattering via a human finger on the display screen. 1. A fingerprint identification apparatus , wherein the fingerprint identification apparatus is configured to be disposed under a display screen of an electronic device , and comprises:a support plate; andat least one fingerprint sensor chip, the at least one fingerprint sensor chip being disposed at an upper surface of the support plate;wherein an edge of the support plate bends upward to form an inverted step structure, an upper surface of a middle frame of the electronic device extends downward and is provided with a groove or a through hole, the inverted step structure of the support plate is configured to be mounted to an edge of the groove or an edge of the through hole, so that the at least one fingerprint sensor chip is located under the display screen of the electronic device; andthe at least one fingerprint sensor chip is configured to receive a fingerprint detecting signal returned by reflection or scattering via a human finger on the display screen, wherein the fingerprint detecting signal is used to detect fingerprint information of the finger.2. The fingerprint ...

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Номер записи: 66
07-01-2021 дата публикации

Data Cable Device Having Cable Battery

Номер: US20210005350A1
Автор: KIM Hee-Gyu
Принадлежит: LG CHEM, LTD.

A data cable device includes USB connectors respectively formed at opposing ends of the data cable device; at least one data line having ends electrically connected to the respective USB connectors; a protection circuit module having a printed circuit board at which an external terminal is formed; a cable battery including an external input/output terminal electrically connected to an internal terminal of the printed circuit board, an inner electrode layer having a cylindrical shape formed at an inner center of the cable battery, a separator layer formed at an outer side of the inner electrode layer, an outer electrode layer formed at an outer side of the separator layer, and an inner insulation coating layer surrounding an outer surface of the outer electrode layer; and an outer insulation coating layer formed to surround at least a portion of an outer surface of the cable battery. 1. A data cable device , comprising:USB connectors respectively formed at opposing ends of the data cable device and each configured to be electrically connected to an electronic device or a battery charging adaptor;at least one data line having one end electrically connected to one of the USB connectors and another end electrically connected to another one of the USB connectors so that a plurality of electronic devices are configured to exchange electric signals with each other;a protection circuit module having a printed circuit board at which an external terminal electrically connected to a first one of the USB connectors is formed;a cable battery including an external input/output terminal electrically connected to an internal terminal of the printed circuit board, an inner electrode layer having a cylindrical shape extending in one direction and formed at an inner center of the cable battery, a separator layer formed at an outer side of the inner electrode layer, an outer electrode layer formed at an outer side of the separator layer, and an inner insulation coating layer ...

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Номер записи: 67
07-01-2016 дата публикации

Operating unit for a coffee machine

Номер: US20160006435A1
Автор: Simon Wager, Stefan REINHART, Wolfgang Riessbeck
Принадлежит: Eugster Frismag AG

A coffee machine ( 1 ), in particular a fully automatic coffee machine, comprising an operating unit ( 2 ), which has at least one touch sensor ( 102 ) for generating an operating signal when touched by an operator, and signal-conducting means ( 20 ), which are embodied to conduct the operating signal to logic means ( 202 ), which are connected to coffee-producing means in a signal-conducting manner, wherein the touch sensor ( 102 ), the signal-conducting means ( 20 ) and the logic means ( 202 ) are arranged on a common printed circuit board ( 10 ), wherein the logic means ( 202 ) are arranged in a flat logic means section ( 200 ) of the printed circuit board ( 10 ) and the touch sensor ( 102 ) is arranged in a sensor section ( 100 ) on the printed circuit board ( 10 ), and wherein the logic means section ( 200 ) integrally transitions into the sensor section ( 100 ), whereby the logic means section ( 200 ), which is embodied as logic means flap, which is released from the sensor section ( 100 ), which has a larger surface, whereby the logic means section ( 200 ) is delimited from the sensor section ( 100 ) by means of at least one recess ( 204 ) in the printed circuit board such that the logic means section ( 200 ) is not deformed in response to a deformation of the sensor section ( 100 ), and wherein the sensor section ( 100 ) extends out of the plane of the logic means section ( 200 ) in an arched manner, and wherein the logic means section ( 200 ) integrally transitions into the sensor section ( 100 ).

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Номер записи: 68
13-01-2022 дата публикации

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Номер: US20220015224A1
Автор: HUANG LIXIANG, Miao Hua, WANG ZEDONG
Принадлежит:

A circuit board is provided, including: a core board, defining a plurality of slots, the plurality of slots including a plurality of first sub-slots and a plurality of second sub-slots disposed beneath the first sub-slots. Each of the second sub-slots is located beneath a corresponding first sub-slot of the first sub-slots; and a plurality of chip assemblies, arranged in the slots and including a plurality of first chips located in the first sub-slots and a plurality of second chips located in the second sub-slots. Each of the first chips is connected in series with one of the second chips at a corresponding position to form a plurality of chipsets; the chipsets are connected in parallel with each other; an end of the chipsets is connected to a first power signal layer, and the other end of the plurality of chipsets is connected to a ground layer. 1. A circuit board , comprising:a core board, defining a plurality of slots, the plurality of slots comprising a plurality of first sub-slots and a plurality of second sub-slots disposed beneath the plurality of first sub-slots; wherein each of the second sub-slots is located beneath a corresponding first sub-slot of the plurality of first sub-slots; anda plurality of chip assemblies, arranged in the plurality of slots and comprising a plurality of first chips located in the plurality of first sub-slots and a plurality of second chips located in the plurality of second sub-slots;wherein each of the plurality of first chips is connected in series with one of the plurality of second chips at a corresponding position to form a plurality of chipsets; the plurality of chipsets are connected in parallel with each other; an end of the plurality of chipsets is connected to a first power signal layer, and the other end of the plurality of chipsets is connected to a ground layer;wherein each of the plurality of first chips has a connection terminal set; the connection terminal set consists of a first connection terminal, a second ...

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Номер записи: 69
03-01-2019 дата публикации

ARRAYED EMBEDDED MAGNETIC COMPONENTS AND METHODS

Номер: US20190006077A1
Автор: Quilici James E.
Принадлежит:

Disclosed are apparatus and methods for arrayed embedded magnetic components that include magnetic devices that have a core that is embedded between two or more substrates and a winding pattern surrounding the core that is implemented on and through the two or more substrates. The winding pattern is operable to induce a magnetic flux within the core when energized by a time varying voltage potential. The winding pattern may be implemented by printed circuit layers, plated vias, other electrically conductive elements, and combinations thereof. Arrayed embedded magnetic components include two or more electrically interconnected magnetic devices positioned side-by-side in a horizontal integration, positioned top-to-bottom in a vertical integration, or combinations thereof. The magnetic devices may have a magnetic functionality such as, but not limited to, a transformer, inductor, and filter. Disclosed magnetic components and methods provide for low cost construction, consistent performance, and a low profile form, among other benefits. 1. A magnetic component comprising:a first magnetic device including a first winding pattern implemented as a first second substrate conductive pattern, a first third substrate conductive pattern and first plated through holes that are electrically interconnected with the first second substrate conductive pattern and the first third substrate conductive pattern, the first winding pattern surrounding a first core, the first core defining a toroidal shape and the first winding pattern defining a complementary toroidal shape, wherein the first winding pattern defines one or more electric circuits that surround the first core thereby forming a winding-type relationship so as to induce a magnetic flux within the first core when the one or more electric circuits are energized by a time varying voltage potential, wherein the first magnetic device further comprises:a first base substrate defining a first base substrate first surface and a first ...

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Номер записи: 70
04-01-2018 дата публикации

SINGLE ELEMENT WIRE TO BOARD CONNECTOR

Номер: US20180006383A1
Автор: BISHOP Peter
Принадлежит:

A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted. 1. An electrical connector comprising: an inlet opening;', 'a contact end opposite the inlet opening; and', 'a first contact tine and a second contact tine each biased toward a centerline axis of the contact element downstream of the inlet opening in an insertion direction into the contact element, wherein the first and second contact tines define a contact pinch point, and wherein the first contact tine comprises a plurality of tabs extending from a distal portion of the first contact tine., 'a contact element comprising2. The electrical connector of claim 1 , wherein the contact element consists of a single piece of electrically-conductive material.3. The electrical connector of claim 1 , wherein the plurality of tabs comprises first and second tabs that are extensions from a main body portion of the first contact tine.4. The electrical connector of claim 3 , wherein the first and second tabs extend in a direction of the centerline axis.5. The electrical connector of claim 1 , wherein the electrical connector does not include an insulator.6. The electrical connector of claim 1 , wherein a first tab is located on a first side of the first contact tine claim 1 , wherein a second tab is located on a second side of the first contact tine claim 1 , and wherein the first side is ...

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Номер записи: 71
02-01-2020 дата публикации

SWIRL INTERCONNECTION IN A FLEXIBLE CIRCUIT

Номер: US20200006205A1
Автор: BARINK Marco, DE KOK Margaretha Maria, VAN HECK Gerardus Titus
Принадлежит: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO

The present disclosure concerns a flexible electronic circuit () and method of manufacturing. A flexible substrate () with conductive tracks is provided with a rigid electronic component (). The component () comprises electrical contacts () on either sides. The conductive tracks connect to the contacts via an arced section that originates from respective sides of the contacts but swirls partially around the component to approaches the component along a centerline (CL) separating the contacts (). 1. A flexible electronic circuit comprisinga substrate; a first electrical contact on a first side of the electronic component, and', 'a second electrical contact on a second side of the electronic component opposite the first side; and, 'an electronic component comprising'} a first conductive track formed along a first pathway between a first contact pad contacting one of the electrical contacts of the electronic component and a first main connection to the rest of the conductive tracks disposed at the first side of the electronic component, and', 'a second conductive track formed along a second pathway between a second contact pad contacting the other one of the electrical contacts of the electronic component and a second main connection to the rest of the conductive tracks disposed at the second side of the electronic component; wherein, 'conductive tracks disposed on the substrate; wherein the conductive tracks comprise'}the first pathway comprises a first arced section that approaches the electronic component along a center line of the electronic component and reaches the electronic component exclusively from a third side, which center line intersects the electronic component at the third side of the electronic component transverse to the first side and the second side of the electronic component and between the electrical contacts; andthe second pathway comprises a second arced section that approaches the electronic component along the center line of the electronic ...

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Номер записи: 72
03-01-2019 дата публикации

Printed Circuit Board Solder Joints

Номер: US20190006777A1
Автор: Knauss Matthew, Ledyard Roland L.
Принадлежит: LUTRON ELECTRONICS CO., INC.

A printed circuit board (PCB) assembly may include a motherboard PCB with one or more plated holes and a daughterboard PCB with one or more plated fingers extending from a lower edge of the daughterboard PCB. The plated fingers may have a rectangular and/or square cross section. The plated fingers may be plated on four sides that define the rectangular cross section. Each of the plated holes may be configured to receive a respective plated finger, for example, such that a lower portion of the plated fingers extend beyond a lower surface of the motherboard PCB. Each of the plated holes may be configured to be electrically connected to a respective plated finger via a solder joint. The solder joint may extend around the respective plated finger. The solder joints for the plated fingers may be configured to secure the daughterboard PCB to the motherboard PCB. 1. A printed circuit board (PCB) assembly comprising: a first surface and an opposing second surface, and', the hole comprises an inner surface, and', 'the inner surface of the hole comprises plating;, 'a hole that extends through the first PCB from the first surface to the second surface, wherein], 'a first PCB comprising a first surface, an opposing second surface, and an edge that is perpendicular to the first and second surfaces of the second PCB, and', the finger comprises four surfaces,', 'at least one of the four surfaces comprises plating, and', 'the hole of the first PCB has received therein the finger of the second PCB such that at least a portion of each of the four surfaces of the finger are adjacent to the inner surface of the hole and such that the edge of the second PCB is adjacent to the first surface of the first PCB; and, 'a finger that extends from the edge of the second PCB, wherein'}], 'a second PCB comprisinga solder joint that electrically connects the plating on the inner surface of the hole to the plating on the at least one surface of the finger.2. The PCB assembly of claim 1 , wherein: ...

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Номер записи: 73
07-01-2016 дата публикации

S-Shaped Ceramic Feedthrough

Номер: US20160007448A1
Автор: McGillivray Kenneth G., Sturdivant Ricky Lee
Принадлежит: AMETEK AEGIS

An electrical interconnect has a non-planar ceramic substrate with opposing first and second ends. A first conductive layer having first and second opposing sides is disposed within the ceramic substrate with one of the first and second opposing sides exposed at the first end and one of the first and second opposing sides exposed at the second end. The electrical interconnect is useful to join an integrated circuit in a hybrid package to a circuit board in high frequency communication applications. 1. An electrical interconnect , comprising:a non-planar ceramic substrate having coplanar opposing first and second ends with opposing first and second surfaces of the non-planar ceramic substrate coated with respective first and second conductive material; anda first conductive layer having first and second opposing sides disposed within the ceramic substrate with one of said first and second opposing sides exposed at said first end and one of said first and second opposing sides exposed at said second end;one or more additional conductive layers, that are coplanar with said first conductive layer disposed within the ceramic substrate each of said one or more additional conductive layers also having one of a first and a second opposing sides exposed at said first end and one of said first and said second opposing sides exposed at said second end; anda plurality of electrically conductive vias extending from said first conductive material to said second conductive such that an electrically conductive via extends along two opposing edges of each of said conductive layer and said one of more additional conductive layers.2. (canceled)3. The electrical interconnect of wherein a mid-portion of said non-planar ceramic substrate is approximately perpendicular to both said first end and said second end.4. (canceled)5. (canceled)6. (canceled)7. An electrical interconnect claim 1 , comprising:a non-planar ceramic substrate having coplanar opposing first and second ends with ...

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Номер записи: 74
07-01-2016 дата публикации

Circuit substrate and method for manufacturing the same

Номер: US20160007451A1
Автор: Koji Asano, Mitsuhiro Tomikawa
Принадлежит: Ibiden Co Ltd

A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating layer and laminated on first side of the core substrate such that the first build-up layer is covering the cavity on the first side of the core substrate, and a second build-up layer including an insulating layer and laminated on second side of the core substrate such that the second build-up layer is covering the cavity on the second side of the core substrate, and a filling resin filling gap formed between the cavity and block positioned in the cavity of the core substrate. The block has roughened surfaces such that the roughened surfaces are in contact with the insulating layers in the first and second build-up layers on the first and second sides of the core substrate.

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Номер записи: 75
07-01-2016 дата публикации

Insulating Substrates Including Through Holes

Номер: US20160007461A1
Автор: Ide Akiyoshi, Iwasaki Yasunori, MIYAZAWA Sugio, Nakanishi Hirokazu, TAKAGAKI Tatsuro
Принадлежит: NGK Insulators, Ltd.

It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 μm, and a diameter of the through hole is 20 to 100 μm. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 μm in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 μm. 1. An insulating substrate including through holes for conductors , said through holes being arranged in said insulating substrate:wherein a thickness of said insulating substrate is 25 to 100 μm;wherein a diameter of said through hole is 20 to 100 μm;wherein said insulating substrate comprises a main body part and exposed regions exposed to said through holes, respectively;wherein said insulating substrate comprises an alumina sintered body;wherein a relative density of said alumina sintered body is 99.5 percent or higher;wherein said alumina sintered body has a purity of 99.9 percent or higher;wherein said alumina sintered body has an average grain size of 3 to 6 μm in said main body part;wherein alumina grains of said alumina sintered body are plate-shaped in said exposed region; andwherein said plate-shaped alumina grain has an average length of 8 to 25 μm.2. The insulating substrate of claim 1 , wherein said through hole is formed by laser processing.3. The insulating substrate of claim 1 , wherein said through holes are formed in molding said alumina sintered body.4. The insulating substrate of claim 1 , wherein 200 to 800 mass ppm of zirconia claim 1 , 150 to 300 mass ppm of magnesia and 10 to 30 mass ppm of yttria are added to said alumina sintered body as sintering ...

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Номер записи: 76
07-01-2016 дата публикации

Assembly for attaching a circuit board to a housing

Номер: US20160007495A1
Автор: Allen B. McKittrick
Принадлежит: Google Technology Holdings LLC

The present invention provides an assembly for attaching a circuit substrate to a housing. The assembly includes a fastener having a first end and a second end opposite the first end, where the first end is larger than a second end. The assembly further includes a circuit substrate including a through hole having a first opening on a first side of the circuit substrate and a second opening on a second side of the circuit substrate, the through hole for receiving the fastener. The assembly still further includes a mounted structure attached to the circuit substrate, which at least partially covers the second opening of the through hole on the second side of the circuit substrate, wherein the mounted structure restricts the size of an exposed portion of the second opening of the through hole. The second end of the fastener, which is received in the through hole of the circuit substrate is sized to extend through the through hole, as well as the restricted size of the exposed portion of the second opening restricted by the mounted structure. The larger first end of the fastener is sized to extend through the through hole, but not through the restricted size of the exposed portion of the second opening. The assembly further includes a housing having a boss adapted and aligned for receiving the second end of the fastener after the second end of the fastener has been received by the through hole of the circuit substrate, and extends therethrough, wherein the boss is adapted to grip the received second end of the fastener.

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Номер записи: 77
07-01-2021 дата публикации

Circuit board

Номер: US20210007226A1
Автор: Chih-Chieh Fu
Принадлежит: Avary Holding Shenzhen Co Ltd, Hongqisheng Precision Electronics Qinhuangdao Co Ltd, Hongqisheng Precision Electronics Qinhuangdao CoLtd

A circuit board includes a baseboard, a first conductive circuit layer, a second conductive circuit layer, at least one through hole, and a number of conductive lines. The first conductive circuit layer includes a number of first conductive circuit lines formed on a first side of the baseboard. The second conductive circuit layer includes a number of second conductive circuit lines formed on a second side of the baseboard. The through hole is defined through the first conductive circuit layer, the baseboard, and the second conductive circuit layer. The number of conductive lines are formed in an inner wall of the through hole and spaced apart around the through hole. Each conductive line electrically couples one of the first conductive circuit lines to a corresponding one of the second conductive circuit lines.

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Номер записи: 78
07-01-2021 дата публикации

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

Номер: US20210007250A1
Автор: JUNG Chul Hwan
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device. 1. An electronic device module comprising:a first substrate;an electronic device mounted on a lower surface of the first substrate;a second substrate mounted on the lower surface of the first substrate, the second substrate being configured to electrically connect the first substrate to an external source of power;a connecting conductor bonded to a lower surface of the second substrate; anda sealing portion that seals the electronic device, the second substrate, and the connecting conductor,wherein the sealing portion covers the lower surface of the second substrate,the connecting conductor passes through the sealing portion so that a surface of the connecting conductor is exposed to an exterior of the sealing portion, andthe exposed surface of the connecting conductor and a lower surface of the sealing portion are disposed on a same plane.2. The electronic device module of claim 1 , wherein a surface of the electronic device is exposed to the exterior of the sealing portion claim 1 , andthe exposed surface of the connecting conductor, the lower surface of the sealing portion, and the exposed surface of the electronic device are disposed on a same plane.3. The electronic device module of claim 1 , further comprising a protective layer disposed along a surface formed by the electronic device and the sealing portion.4. The electronic device module of claim 3 , further comprising a shielding ...

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Номер записи: 79
04-01-2018 дата публикации

Electronic device and method for producing an electronic device

Номер: US20180007779A1
Автор: Müller Robert
Принадлежит:

The invention relates to an electronic device comprising a printed circuit board () and comprising an electronic component () arranged on a first surface () of the printed circuit board (). The printed circuit board () has a cutout () extending from a second surface () of the printed circuit board (), said second surface being situated opposite the first surface (), in the direction of the electronic component (). The electronic device comprises a coolant container (), which has an opening closed by the second surface () of the printed circuit board (). The invention additionally relates to a method for producing such an electronic device. 1. An electronic device comprising:a printed circuit board;an electronic component arranged on a first surface of the printed circuit board;the printed circuit board has a cutout extending from a second surface of the printed circuit board, the second surface being situated opposite the first surface, in the direction of the electronic component; anda coolant container which has an opening closed by the second surface of the printed circuit board.2. The electronic device as claimed in claim 1 , wherein the material thickness of the printed circuit board in the region of the cutout is less than 50% claim 1 , preferably less than 30% claim 1 , more preferably less than 20% claim 1 , with respect to the thickness of the printed circuit board.3. The electronic device as claimed in claim 1 , wherein the cutout has side faces aligned perpendicularly to the plane of the printed circuit board.4. The electronic device as claimed in claim 1 , wherein the cutout overlaps the electronic component in a direction perpendicular to the plane of the printed circuit board.5. The electronic device as claimed in claim 1 , wherein the opening of the coolant container is larger than the cutout of the printed circuit board.6. The electronic device as claimed in claim 1 , wherein the cutout is arranged completely within the opening of the coolant ...

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Номер записи: 80
04-01-2018 дата публикации

Electrical device, model series of electrical devices, and production method

Номер: US20180007805A1
Автор: Alexander Kolbert, Dirk Momann
Принадлежит: SEW Eurodrive GmbH and Co KG

In an electrical device, a model series of electrical devices, and a production method, in particular for a converter, having a circuit board including circuit traces, the circuit board has two similar and/or identical contact area arrays, the contact area arrays in particular transitioning into each other through rotation and/or displacement. A first contact area array of the contact area arrays is fitted with a first power module, and the second contact area array is able to be fitted with a second power module, e.g., so that a respective electric motor is able to be supplied from the respective power module.

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Номер записи: 81
08-01-2015 дата публикации

Wiring substrate and semiconductor package

Номер: US20150009645A1
Автор: Katsuya Fukase, Kentaro Kaneko
Принадлежит: Shinko Electric Industries Co Ltd

A wiring substrate includes an insulating layer that is an outermost layer of the wiring substrate and includes an external exposed surface, a pad forming part formed on a side of the external exposed surface, and a pad that projects from the external exposed surface. The pad forming part includes a recess part recessed from the external exposed surface, and a weir part that projects from the external exposed surface and encompasses the recess part from a plan view. The pad includes a pad body formed within the recess part and the weir part, and an eave part formed on the weir part. The pad body includes an end part that projects to the weir part. The eave part projects in a horizontal direction from the end part of the pad body. The end part of the pad body includes a flat surface.

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Номер записи: 82
03-01-2019 дата публикации

INTEGRATED WIRING SYSTEM FOR COMPOSITE STRUCTURES

Номер: US20190008065A1
Автор: Dalal Hardik, Duce Jeffrey Lynn, Merriweather Breana K., Robbins Brent A., Rosillo Yelina
Принадлежит:

A composite part comprising an electronic device and method for making the same. A primer is deposited on a surface of the composite part. An electronic device comprising a group of conductive elements is deposited on the primer. Power may be supplied to a device connected to the composite part through current flowing through the group of conductive elements. 1. An apparatus comprising:a composite part;a primer deposited on a surface of the composite part; andan electronic device comprising a group of conductive elements deposited on the primer, wherein power is supplied to a device connected to the composite part through current flowing through the group of conductive elements.2. The apparatus of claim 1 , wherein the primer comprises:a layer of metallic material sprayed on the surface of the composite part using a thermal plasma spray; anda layer of ceramic material sprayed on the layer of metallic material using the thermal plasma spray.3. The apparatus of claim 1 , wherein conductive material is sprayed on the primer using a thermal plasma spray to form the group of conductive elements.4. The apparatus of claim 3 , wherein the conductive material is selected from at least one of copper claim 3 , copper alloy claim 3 , carbon claim 3 , graphene claim 3 , titanium claim 3 , nickel claim 3 , or silver.5. The apparatus of claim 1 , wherein the composite part is an aircraft part.6. The apparatus of claim 5 , wherein the composite part is selected from one of a skin panel claim 5 , an interior panel claim 5 , a stringer claim 5 , a frame claim 5 , a spar claim 5 , a wing claim 5 , a winglet claim 5 , a fuselage claim 5 , an empennage claim 5 , and a control surface.7. The apparatus of claim 1 , wherein the group of conductive elements comprises at least one of an electrical trace claim 1 , an interconnect claim 1 , a wire claim 1 , a transistor claim 1 , an integrated circuit claim 1 , or a conductive connector.8. The apparatus of claim 1 , wherein the device ...

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Номер записи: 83
03-01-2019 дата публикации

Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same

Номер: US20190008071A1
Автор: Gerald Ho Kim
Принадлежит: Individual

Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

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Номер записи: 84
20-01-2022 дата публикации

PRINTED CIRCUIT BOARD ASSEMBLY

Номер: US20220022319A1
Автор: JANG Dae Hyun, KIM Yong Jae, SEO Chang Min
Принадлежит:

A PCB assembly includes a second PCB disposed adjacent to a first PCB and have a second hole facing a first hole, an upper plate disposed at an upper of the first and second hole and have a third hole disposed at the upper of the first hole and a fourth hole disposed at the upper of the second hole, a holder disposed at a lower of the first and second hole and have a lower plate having a fifth hole disposed at the lower of the first hole and a sixth hole disposed at the lower of the second hole, a first fixing screw penetrating through the third first, and fifth hole, and a second fixing screw penetrating through the fourth, second and sixth hole, and the lower plate includes a protrusion penetrating through the second PCB coupling the first PCB and the second PCB. 1. A printed circuit board (PCB) assembly , comprising:a first PCB configured to have a first hole;a second PCB configured to be disposed adjacently to the first PCB and have a second hole disposed to face the first hole;a holder comprising an upper plate configured to be disposed at an upper of the first hole and the second hole and have a third hole disposed at the upper of the first hole and a fourth hole disposed at the upper of the second hole, and a lower plate configured to be disposed at a lower of the first hole and the second hole and have a fifth hole disposed at the lower of the first hole and a sixth hole disposed at the lower of the second hole;a first fixing screw configured to penetrate through the third hole, the first hole and the fifth hole; anda second fixing screw configured to penetrate through the fourth hole, the second hole and the sixth hole,wherein the lower plate comprises a protrusion part configured to penetrate through the second PCB to couple the first PCB and the second PCB.2. The PCB assembly of claim 1 , wherein the protrusion part is configured to couple with the upper plate for the lower plate and the upper plate to connect.3. The PCB assembly of claim 1 , wherein the ...

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Номер записи: 85
11-01-2018 дата публикации

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

Номер: US20180009141A1
Автор: Bojie ZHAO, Feifan CHEN, Fengsheng XI, Heng JIANG, LIANG Ding, Mingzhu Wang, Nan Guo, TAKEHIKO Tanaka, Zhenyu Chen, Zhongyu LUAN
Принадлежит: Ningbo Sunny Opotech Co Ltd

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

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Номер записи: 86
08-01-2015 дата публикации

Printed circuit board, method of manufacturing same, and method of mounting the circuit board in a connector socket

Номер: US20150011100A1
Автор: Michael Stock, Scott Semmler
Принадлежит: Germane Systems LC

A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and second opposite sides of the circuit board, each of the retention bosses protruding from a surface of the circuit board and extending parallel to and adjacent to the first edge of the circuit board. When the first edge of the circuit board is inserted into a slot of a connector socket, contact surfaces of the first and second retention bosses contact top surfaces of the connector socket to help immobilize the circuit board with respect to the connector socket. Adhesive layers on the contact surfaces of the first and second retention bosses may adhere to the top surfaces of the connector socket to help hold the circuit board immobile with respect to the connector socket.

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Номер записи: 87
11-01-2018 дата публикации

METAL PCB ASSEMBLY FOR VEHICLE LAMP AND MANUFACTURING METHOD THEREOF

Номер: US20180010775A1
Автор: SUNG Jaedeok
Принадлежит: SEJONG MATERIALS CO., LTD

The present invention relates to a manufacturing method of a metal PCB assembly for a vehicle lamp and the metal PCB assembly made by the method. The manufacturing method of a metal PCB assembly for a vehicle lamp comprises a step S in which a material of a metal PCB is prepared, a step S in which a circuit pattern and a plurality of unit patterns are formed and cut from the material of a metal PCB to form a metal PCB a step S in which a bending groove is formed on a bottom surface of the metal PCB a step S in which each of the unit patterns is protruded forward around the bending groove of the metal PCB such that each of the unit patterns is bent to be inclined from the metal PCB and a step S in which a stepwise injection molded products is coupled with the metal PCB while the unit pattern is protruded. 114. A metal PCB assembly comprising: a metal printed circuit board (PCB) ;{'b': 16', '14', '20', '20', '20', '14', '20', '14', '16', '14', '24', '14', '20', '16', '14, 'i': a,', 'b,', 'c', 'd', 'd, 'at least one unit pattern which is arranged on the metal PCB and has three surfaces cut from the metal PCB and one rest surface connected to the metal PCB , wherein the unit pattern is protruded to be inclined at a predetermined angle from the metal PCB by forming a bending groove on a bottom surface of the metal PCB , which corresponds to the one rest surface , in a width direction to a predetermined depth, and pushing the unit pattern from the metal PCB ; and'}{'b': 12', '14', '26', '16', '14, 'an injection molded product which is coupled with the metal PCB and includes a support portion which is protruded from a horizontal plane to support the unit pattern at the predetermined angle from the metal PCB .'}2. A manufacturing method of a metal PCB assembly comprising:{'b': 100', '14, 'a step S in which a material of a metal PCB is prepared;'}{'b': 110', '22', '16', '14', '14, 'a step S in which a circuit pattern and a plurality of unit patterns are formed and cut from ...

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Номер записи: 88
10-01-2019 дата публикации

Test Fixture with Sintered Connections Between Mother Board and Daughter Board

Номер: US20190011497A1
Автор: Randal LeRay Newby
Принадлежит: Texas Instruments Inc

A test fixture includes a mother board that has test signal lines configured to couple to a test station. The mother board includes a recessed region with contact pads coupled to the test signal lines. A daughter board is engaged with the recessed region such that a top surface of the daughter board is approximately coplanar with a top surface of the mother board. The daughter board includes test signal lines coupled to contact pads on the daughter board. The contact pads on the daughter board align with the contact pads on the mother board and are permanently coupled by sintered bonds.

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Номер записи: 89
27-01-2022 дата публикации

PRINTED CIRCUIT BOARD

Номер: US20220030704A1
Автор: Okada Hiroki
Принадлежит:

A printed circuit board includes a rigid region and a flexible region; a first substrate disposed on the rigid region and the flexible region and comprising a first insulating layer and a first wiring layer comprising a first groove in the flexible region; and a second substrate disposed on the first substrate in the rigid region and comprising a first adhesive layer, a second insulating layer and a second wiring layer. 1. A printed circuit board , comprising:a rigid region and a flexible region;a first substrate disposed on the rigid region and the flexible region, the first substrate comprising a first insulating layer comprising a first groove in the flexible region, and a first wiring layer; anda second substrate disposed on the first substrate in the rigid region and comprising a first adhesive layer, a second insulating layer and a second wiring layer.2. The printed circuit board of claim 1 , wherein the first groove is disposed adjacent to an interface between the rigid region and the flexible region.3. The printed circuit board of claim 1 , wherein the first groove is disposed in one surface of the first insulating layer claim 1 , the one surface of the first insulating layer facing the second substrate.4. The printed circuit board of claim 3 , wherein the first insulating layer further comprises a second groove disposed in the one surface of the insulating layer in the rigid region.5. The printed circuit board of claim 4 , wherein the first adhesive layer is disposed between the first and second insulating layers and disposed in at least a portion of the second groove.6. The printed circuit board of claim 5 , wherein the second insulating layer comprises a third groove disposed in a surface of the second insulating layer opposite to one surface of the second insulating layer claim 5 , the one surface of the second insulating layer facing the first substrate.7. The printed circuit board of claim 6 , wherein the adhesive layer claim 6 , the second insulating ...

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Номер записи: 90
27-01-2022 дата публикации

IMAGING MODULE AND IMAGING DEVICE

Номер: US20220030715A1
Автор: Egashira Yoshihiro, FURUYA Takahiro, Inaba Tsutomu, KAMEI Takatoshi, QI Bin, Tashiro Kei
Принадлежит:

An imaging module includes an electric cable including a plurality of wirings, an imager having an imaging surface intersecting an axial direction of a distal end of the electric cable, and a flexible wiring board configured to electrically connect the imager and the electric cable. The wiring board includes a plurality of extending portions that extend from at least three portions of a connection portion connected with the imager. At least one wiring pad to which at least one of the plurality of wirings of the electric cable is connected is provided in each of the plurality of extending portions. 1. An imaging module comprising:an electric cable including a plurality of wirings;an imager having an imaging surface intersecting an axial direction of a distal end of the electric cable; anda flexible wiring board configured to electrically connect the imager and the electric cable,wherein the wiring board includes a plurality of extending portions that extend from at least three portions of a connection portion connected with the imager, andat least one wiring pad to which at least one of the plurality of wirings of the electric cable is connected is provided in each of the plurality of extending portions.2. The imaging module according to claim 1 , wherein one wiring pad to which one of the plurality of wirings is connected is provided in at least one of the plurality of extending portions.3. The imaging module according to claim 1 , wherein one wiring pad to which each of the plurality of wirings is connected is provided in each of the plurality of extending portions.4. The imaging module according to claim 3 , whereinthe electric cable includes four wirings as the plurality of wirings, and the wiring board includes four extending portions as the plurality of extending portions, andone wiring pad to which each of the four wirings is connected is provided in each of the four extending portions.5. The imaging module according to claim 1 , wherein each of the plurality ...

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Номер записи: 91
09-01-2020 дата публикации

OPTICAL MODULE AND ENDOSCOPE

Номер: US20200012086A1
Автор: KAWAHARA Kosuke
Принадлежит: OLYMPUS CORPORATION

An optical module includes: an optical element having a light emitting portion for emitting optical signals, and an external electrode on a top face; a wiring board having a connection electrode bonded to the external electrode of the optical element on the first main face, and having a through hole serving as an optical path of the optical signals; an optical fiber for transmitting the optical signals arranged at a position coupled optically to the optical element; a resin layer sealing a bonding portion between the external electrode and the connection electrode, constituting a wall surrounding the optical path; and transparent resin filling the optical path. The transparent resin is expanded around the resin layer via at least one gap of the resin layer. 1. An optical module comprises:an optical element having a light function region for emitting or receiving optical signals, and an external electrode on a top face;a wiring board having a first main face and a second main face, having a connection electrode bonded to the external electrode of the optical element on the first main face, and having a through hole serving as an optical path of the optical signals;a light waveguide for transmitting the optical signals, the light waveguide being arranged at a position coupled optically to the optical element;a resin layer sealing a bonding portion between the external electrode and the connection electrode, constituting a wall surrounding the optical path, and having at least one gap serving as a break on the wall, andtransparent resin filling the optical path between the optical element and the light waveguide,wherein the transparent resin is expanded around the resin layer via at least one gap of the resin layer.2. The optical module according to claim 1 , wherein the resin layer has a light shielding property.3. The optical module according to claim 1 , wherein the at least one gap is one gap claim 1 , and the resin layer is a U-shaped cross section orthogonal to ...

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Номер записи: 92
03-02-2022 дата публикации

Massage Roller and Conductive Structure thereof

Номер: US20220031561A1
Автор: Liangsan Zhao
Принадлежит: Xiamen High Top Electronic Technology Co ltd

A conductive structure of a massage roller includes a working circuit board, a conductive base, a conductive plate, two first conductive parts and two second conductive parts. The working circuit board and the conductive plate are positioned at upper and lower ends of the conductive base respectively. The conductive base is provided with at least a pair of accommodating cavities, and conductors are placed in the accommodating cavities. The two first conductive parts are positioned on the bottom surface of the working circuit board, and the first conductive parts are connected with the working circuit board. The two second conductive parts are positioned on the top surface of the conductive plate, and the second conductive parts are connected with the conductive plate; and the top surfaces of the conductors abut against the two first conductive parts, and the bottom surfaces of the conductors abut against the two second conductive parts.

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Номер записи: 93
14-01-2016 дата публикации

MULTI-BAND ANTENNA ASSEMBLY

Номер: US20160013565A1
Автор: Ortiz Jorge Isaac
Принадлежит:

Antenna assemblies and methods of manufacturing antenna assemblies are provided. In one embodiment, an antenna assembly comprises a printed circuit board having a first surface and a second surface. The antenna assembly also includes a cellular antenna structure having a first section disposed on the first surface of the printed circuit board and a second section disposed on the second surface of the printed circuit board. The antenna assembly further includes a wireless local area antenna structure having a first section disposed on the first surface of the printed circuit board and a second section disposed on the second surface of the printed circuit board. 1. An antenna assembly comprising:a printed circuit board having a first surface and a second surface;a cellular antenna structure having a first section disposed on the first surface of the printed circuit board and a second section disposed on the second surface of the printed circuit board; anda wireless local area antenna structure having a first section disposed on the first surface of the printed circuit board and a second section disposed on the second surface of the printed circuit board.2. The antenna assembly of claim 1 , further comprising a global positioning system (GPS) module claim 1 , wherein the printed circuit board comprises an aperture configured to accommodate the GPS module.3. The antenna assembly of claim 2 , wherein two or more of the cellular antenna structure claim 2 , wireless local area antenna structure claim 2 , and GPS module are configured to operate simultaneously.4. The antenna assembly of claim 2 , further comprising a ground plane formed on the second surface of the printed circuit board claim 2 , the ground plane configured to provide a ground potential for the GPS module.5. The antenna assembly of claim 1 , wherein the cellular antenna structure is configured to operate within a frequency band ranging from 600 MHz to 6 GHz and the wireless local area antenna structure is ...

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Номер записи: 94
11-01-2018 дата публикации

Method for manufacturing electrical interconnection structure

Номер: US20180013251A1
Автор: Chong Kwang Yoon, Yeong Joo MOON, Yeong Uk Seo, Young Soo Kim
Принадлежит: UNID CO Ltd

Provided is a method of manufacturing an electrical connection structure which includes a female connection structure having an inner conductive material inside an insertion hole of a female connection member, and a male connection structure having a conductive column configured to be inserted into and fixed to the insertion hole to be in contact with the inner conductive material, and formed to protrude from a male connection member. The method includes preparing insulating members used for the female connection member and the male connection member, and forming the inner conductive material and the column by patterning a conductive material on each of the insulating member using a photolithography process.

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Номер записи: 95
15-01-2015 дата публикации

High frequency module and manufacturing method thereof

Номер: US20150016067A1
Автор: Chang Sup Song, Jong Pil Park
Принадлежит: Samsung Electro Mechanics Co Ltd

A high frequency (HF) module and a manufacturing method thereof. The HF module has a single airtight box-like structure formed by a first PCB, a second PCB, and a third PCB. On a lower surface of the third PCB facing the first PCB, a second electronic component is mounted at a position corresponding to a first electronic component relatively low in height, among first electronic components mounted on the first PCB. Upper and lower ends of a plurality of vias formed within the second PCB are connected to a copper layer existing within a body of the third PCB and a copper layer existing within a body of the first PCB to constitute a single electromagnetic wave shielding unit overall.

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Номер записи: 96
11-01-2018 дата публикации

Manufacturing method of circuit board structure

Номер: US20180014409A1
Автор: Cheng-Chung Lo, Chien-Te Wu, Chien-Tsai Li
Принадлежит: Unimicron Technology Corp

Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A dicing process is performed, such that at least one slit is formed in the glass film. A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on the glass film. A polymer layer is formed on the first circuit layer. The polymer layer covers surfaces of the first circuit layer and the glass film. A plurality of second conductive vias are formed in the polymer layer. A second circuit layer is formed on the polymer layer, such that a first circuit board structure is formed. A singulation process is performed, such that the first circuit board structure is divided into a plurality of second circuit board structures.

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Номер записи: 97
11-01-2018 дата публикации

Pcb module with multi-surface heat dissipation structure, heat dissipation plate used in pcb module, multi-layer pcb assembly, and module case

Номер: US20180014426A1
Автор: Ku Yong Kim
Принадлежит: Individual

A PCB module having a multi-surface heat dissipation structure is provided. The PCB module includes: a multi-layer PCB assembly which includes a heat dissipation plate having electrical insulating properties, and an upper PCB and a lower PCB attached to a top surface and a bottom surface of the heat dissipation plate, respectively; an upper case for covering a top surface of the multi-layer PCB assembly; and a lower case for covering a bottom surface of the multi-layer PCB assembly, and the heat dissipation plate includes; a first heat pole which is thermally in contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole which is thermally in contact with an inner surface of at least one of the upper and lower cases.

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Номер записи: 98
09-01-2020 дата публикации

POGO MODULE AND ELECTRONIC DEVICE COMPRISING SAME

Номер: US20200014163A1
Автор: Kim Ji-Min, KIM Ki-Won, KWON Ki-young
Принадлежит:

Various embodiments relating to a pogo module comprising a pogo pin for maintaining an electrical connection state when an electronic device is rotated and not rotated are disclosed, and according to one embodiment, the pogo module comprises: first and second housings; module circuit boards provided inside the first and second housings; at least one pogo pin provided to the module circuit board and comprising a rotatable structure electrically connected to at least one electrode pattern included in a printed circuit board of the electronic device; and a support body coupled to the module circuit board to support the at least one pogo pin, wherein the rotatable structure can maintain an electrical connection state with the at least one electrode pattern when the electronic device is rotated or not rotated. In addition, various other embodiments are possible. 1. A pogo module comprising a pogo pin , the pogo module comprising:a first housing and a second housing;a module circuit board provided in the first housing and the second housing;at least one pogo pin provided in the module circuit board and comprising a rotatable structure electrically connected to at least one electrode pattern included in a printed circuit board of an electronic device; anda support body coupled with the module circuit board to support the at least one pogo pin,wherein the rotatable structure maintains an electrical connection with the at least one electrode pattern in rotation or non-rotation of the electronic device.2. The pogo module of claim 1 , wherein the first housing comprises at least one mounting portion that is coupled with the at least one pogo pin and electrically connects the rotatable structure to the at least one electrode pattern while exposing the rotatable structure to outside.3. The pogo module of claim 1 , wherein the at least one electrode pattern comprises an electrode pattern in a ring shape.4. The pogo module of claim 1 , wherein the at least one electrode pattern ...

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Номер записи: 99
14-01-2016 дата публикации

APPARATUS, SYSTEM, AND METHOD FOR ELECTRONICS MANUFACTURING USING DIRECT WRITE WITH FABRICATED FOILS

Номер: US20160014900A1
Автор: Culp Slade R., Dardona Sameh, Piech Marcin, Schmidt Wayde R.
Принадлежит: UNITED TECHNOLOGIES CORPORATION

An apparatus system and method for an electronic component made with additive manufacturing processes and a foil substrate is provided. The electronic component may include one or more foil substrates and one or more elements. The elements may be produced by an additive manufacturing process. Moreover, the elements may be produced in the same plane or out of plain with one or more foil substrates. The elements may also be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures. 1. A method , comprising:producing a first foil from a metal substrate by at least one of an etching process or micro-machining process, wherein the foil is a portion of a circuit;writing a first structure by depositing conductive material via a direct write manufacturing process to the first foil, wherein the first structure is substantially in a plane defined by the first foil; andwriting a second structure by depositing conductive material via the direct write manufacturing process to the first foil, wherein at least a portion of the second structure is substantially out of the plane defined by the first foil.2. The method of claim 1 , further comprising pre-processing the first foil claim 1 , wherein the pre-processing includes treating the foil to facilitate bonding of at least one of the first structure or the second structure.3. The method of claim 1 , further comprising post-processing an electronic assembly claim 1 , wherein the electronic assembly comprises the foil claim 1 , the first structure and the second structure.4. The method of claim 1 , wherein the first structure is at least one of a connector or an electronic component.5. The method of claim 1 , wherein the second structure is at least one of a connector and an electronic component.6. The method of claim 1 , further comprising coupling a second foil to the second structure.7. ...

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Номер записи: 100