Настройки

Укажите год
-

Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

Подробнее
-

Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

Подробнее

Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Укажите год
Укажите год
Применить Всего найдено 1382. Отображено 100.
23-02-2012 дата публикации

Signal transmission line and circuit board

Номер: US20120043117A1
Автор: Jun Sasaki, Noboru Kato
Принадлежит: Murata Manufacturing Co Ltd

A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.

Подробнее
Номер записи: 1
09-08-2012 дата публикации

Electronic control device including interrupt wire

Номер: US20120200970A1
Автор: Hiroaki Nakamura, Ryoichi Shiraishi, Shigeki Nishiyama, Takahiko FURUTA, Toru Itabashi, Yuuki MIKAMI
Принадлежит: Denso Corp, Murata Manufacturing Co Ltd

An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

Подробнее
Номер записи: 2
01-11-2012 дата публикации

High-frequency signal transmission line

Номер: US20120274423A1
Автор: Noboru Kato
Принадлежит: Murata Manufacturing Co Ltd

A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.

Подробнее
Номер записи: 3
07-02-2013 дата публикации

Connection substrate

Номер: US20130032389A1
Автор: Fumiyuki Tokura, Mitsutoshi Sugiya, Shigeru Suzuki, Takashi Tonbe
Принадлежит: Hamamatsu Photonics KK

A connection substrate 13 includes a base material 130 formed by stacking a plurality of dielectric layers 130 a to 130 f and a plurality of through conductors 20 provided penetrating through the dielectric layers 130 c to 130 f adjacent to each other. A plurality of radiation shielding films 21 a to 23 a formed integrally with each of the plurality of through conductors 20 and separated from each other are provided at two or more interlayer parts in the dielectric layers 130 c to 130 f. A region PR 1 of the radiation shielding film 21 a ( 21 b ) formed integrally with one through conductor 20 in one interlayer part projected onto a virtual plane normal to a predetermined direction and a region of the radiation shielding film 22 b or 22 c ( 22 c ) formed integrally with another through conductor 20 in another interlayer part projected onto the virtual plane do not overlap each other. Accordingly, the readout circuits of an integrated circuit device can be protected from radiation, and an increase in parasitic capacitance can be suppressed.

Подробнее
Номер записи: 4
26-12-2013 дата публикации

Connector structure

Номер: US20130344717A1
Автор: Naoki Ito
Принадлежит: Yazaki Corp

A connector structure includes a circuit body, a fork terminal, a housing and an insertion member. The circuit body includes a conductor including a two-pronged part having two extended portions, and plated leads arranged at the extended portions respectively. The fork terminal includes a first terminal part and a second terminal part which project from a terminal base so that an insertion space is formed between the first and second terminal parts. The housing includes a fitting part accommodating the fork terminal. The insertion member is inserted into the insertion space through the fitting part in a state where the circuit body is fixed. The circuit body is electrically connected with one of the first and second terminal parts with the insertion of the insertion member.

Подробнее
Номер записи: 5
27-03-2014 дата публикации

Flexible printed circuit board and circuit-board connection structure

Номер: US20140085856A1
Автор: Hiroshi Aruga, Mizuki Shirao, Nobuo Ohata, Nobuyuki Yasui
Принадлежит: Mitsubishi Electric Corp

A terminal portion configured to obtain electrical connection with a printed circuit board includes a first signal pad that is formed in a first conductor layer and is electrically separated from a ground layer, a pair of first ground pads that is formed in the first conductor layer to sandwich the first signal pad and is connected to the ground layer, a second signal pad that is formed in a second conductor layer and is connected to a signal line, a pair of second ground pads that is formed in the second conductor layer to sandwich the second signal pad and is electrically separated from the signal line, a third signal pad formed in a third conductor layer, and a pair of third ground pads formed in the third conductor layer to sandwich the third signal pad. The second signal pad is wider than the third signal pad.

Подробнее
Номер записи: 6
27-01-2022 дата публикации

Pre-charge unit for charging a dc link capacitor and battery system including the same

Номер: US20220029427A1
Автор: Florian MAXL
Принадлежит: Samsung SDI Co Ltd

A pre-charge unit for charging a DC link capacitor includes a printed circuit board including at least one conductive layer; a pre-charge switch on the printed circuit board; and a pre-charge resistor electrically connected in series with the pre-charge switch, wherein the pre-charge resistor is formed by a conductive trace in the at least one conductive layer of the printed circuit board.

Подробнее
Номер записи: 7
12-01-2017 дата публикации

TRACE BORDER ROUTING

Номер: US20170013707A1
Автор: Chang Shih-Chang, Grunthaner Martin Paul, Lyon Benjamin B.
Принадлежит:

The border routing of conductive traces in devices, such as displays, touch sensor panels, and touch screens, to improve border area space usage, thereby reducing device size, and to reduce trace resistance, thereby improving device operation, is disclosed. The conductive traces can form a staggered stair-step configuration in the device border area, in which the average widths of the traces can be different from each other and each trace can have segments with different widths. The conductive traces can be coupled to an active area of the device to transmit signals to and from the active area in accordance with a device operation. The varying widths can help improve the border area space usage, reduce trace resistance, and reduce the differences in resistance between traces. 1. A display comprising:an active area configured to display data;a border area located outside of the active area, the border area including a first region and a second region;a plurality of rows in the active area, each row forming at least a portion of one or more display pixels;a connector in the second region of the border area; andmultiple routing traces in a plane disposed along a length of the plane, each routing trace electrically connected to one of the plurality of rows in the first region and configured to route a signal from the one of the plurality of rows to the connector, first and second routing traces located in the first and second regions, the first routing trace located closer to the active area than the second routing trace,', 'wherein the first routing trace includes one or more bends in the second region., 'the multiple routing traces including2. The display of claim 1 , wherein resistances of the multiple routing traces match.3. The display of claim 1 , wherein a number of bends of the first routing trace in the second region is greater than a number of bends of other routing traces in the second region.4. The display of claim 3 , wherein one of the multiple routing ...

Подробнее
Номер записи: 8
10-02-2022 дата публикации

Information handling system with split trace for high speed routing

Номер: US20220046790A1
Автор: Bhyrav Mutnury, Sandor Farkas
Принадлежит: Dell Products LP

An apparatus includes a first conductor trace arranged to electrically couple a first complementary signal to provide differential signaling. The first conductor trace includes a first plurality of split traces to conduct the first complementary signal, and a first plurality of tie bars to connect the first split traces.

Подробнее
Номер записи: 9
28-01-2021 дата публикации

TRANSMISSION LINE AND MOUNTING STRUCTURE THEREOF

Номер: US20210029822A1
Автор: YOSUI Kuniaki
Принадлежит:

A transmission line includes connecting portions connected to the outside and a main body located between the connecting portions. Each of the connecting portions includes a terminal electrode connected to an external electrode, a signal conductor, and ground conductors. The main body includes the signal conductor and the ground conductors, and at least one of the plurality of connecting portions includes a first region including the terminal electrode, a second region adjacent to the first region along a signal propagation path, and a third region located between the second region and the main body. The first region, the second region, and the third region provide impedance matching at the connecting portion. 1. A transmission line comprising a plurality of connecting portions respectively connected to an outside , and a main body located between the plurality of connecting portions , wherein:each of the plurality of connecting portions includes a terminal electrode connected to an external electrode, a signal conductor, and a ground conductor;the main body includes a signal conductor and a ground conductor;at least one of the plurality of connecting portions includes a first region including the terminal electrode, a second region adjacent to the first region along a signal propagation path, and a third region located between the second region and the main body;the first region includes an inductance component generated in the signal conductor larger than an inductance component generated in the main body;the second region includes a capacitance component generated between the terminal electrode and the ground conductor larger than a capacitance component generated in the main body; andthe third region includes the inductance component generated in the signal conductor larger than the inductance component generated in the main body.2. The transmission line according to claim 1 , wherein all of the plurality of connecting portions include the first region claim 1 , ...

Подробнее
Номер записи: 10
01-02-2018 дата публикации

WIRING BOARD AND ELECTRONIC APPARATUS

Номер: US20180035536A1
Автор: Baba Shunji, KANDA Takashi, KIRA Hidehiko, MATSUMURA Takayoshi, OZAKI Noritsugu
Принадлежит: FUJITSU LIMITED

A wiring board includes a base having extensibility and a wiring formed on the base. The wiring includes a wiring portion and a conductor portion. The wiring portion is formed on the base and extends in a first direction crossing (for example, perpendicular to) a longitudinal direction of the base. The conductor portion is formed on the wiring portion and extends in the first direction. Even when the wiring board is extended along a main extension axis in parallel with the longitudinal direction of the base, change of the resistance of the wiring is prevented. Thus, the wiring board represents stable characteristics. 1. A wiring board comprising:a base that has extensibility;a first wiring portion that is formed on the base and extends in a first direction crossing a longitudinal direction of the base; anda first conductor portion that is formed on the first wiring portion and extends in the first direction.2. The wiring board according to claim 1 ,wherein the first wiring portion has extensibility, andwherein the first conductor portion has extensibility lower than that of the first wiring portion and has resistivity lower than that of the first wiring portion.3. The wiring board according to claim 1 ,wherein the first wiring portion includes a binder and a conductive filler included in the binder, andwherein the first conductor portion includes metal material or carbon material.4. The wiring board according to claim 1 , wherein the first conductor portion is formed as a layer or a column.5. The wiring board according to claim 1 , wherein an angle between a lateral direction perpendicular to the longitudinal direction of the base and the first direction is smaller than an angle between a diagonal line of the first conductor portion and the first direction.6. The wiring board according to claim 1 , wherein the first conductor portion has a wider end portion in the first direction.7. The wiring board according to claim 6 , wherein the first conductor portion has a ...

Подробнее
Номер записи: 11
30-01-2020 дата публикации

METHOD FOR MANUFACTURING CIRCUIT BOARD

Номер: US20200037455A1
Автор: LIAO Po-Hsuan, LIU Wen-Fang
Принадлежит:

The present disclosure relates to a method for manufacturing a circuit board. The method for manufacturing the circuit board includes forming a patterned first dielectric layer on a substrate; forming an adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the adhesive layer; and patterning the second dielectric layer and the adhesive layer. 1. A method for manufacturing a circuit board , comprising:forming a patterned first dielectric layer on a substrate;forming an adhesive layer on the patterned first dielectric layer;forming a second dielectric layer on the adhesive layer; andpatterning the second dielectric layer and the adhesive layer.2. The method of claim 1 , wherein the forming the adhesive layer on the patterned first dielectric layer comprises:bonding the adhesive layer to the patterned first dielectric layer, such that the adhesive layer covers the patterned first dielectric layer and the substrate.3. The method of claim 1 , wherein the patterning the second dielectric layer and the adhesive layer comprises:performing an exposure process to the second dielectric layer; andperforming a developing process to the exposed second dielectric layer to expose a portion of the adhesive layer.4. The method of claim 3 , wherein the patterning the second dielectric layer and the adhesive layer comprises:removing the portion of the adhesive layer to at least expose at least a portion of the patterned first dielectric layer.5. The method of claim 4 , wherein the removing the portion of the adhesive layer is performed by a wet etching process.6. The method of claim 1 , further comprising:forming a conductive layer on the substrate before the forming the patterned first dielectric layer on the substrate, wherein the conductive layer is separated from the adhesive layer by the patterned first dielectric layer.7. The method of claim 1 , further comprising:filling a conductive material at least in the patterned second dielectric ...

Подробнее
Номер записи: 12
18-02-2016 дата публикации

Multi-layer substrates

Номер: US20160050751A1
Автор: Hongyu Deng, Maziar Amirkiai, Yunpeng Song
Принадлежит: Finisar Corp

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

Подробнее
Номер записи: 13
26-02-2015 дата публикации

High-frequency signal line and electronic device including the same

Номер: US20150054600A1
Автор: Satoshi Sasaki, Yuki Wakabayashi
Принадлежит: Murata Manufacturing Co Ltd

A high-frequency signal line includes a dielectric body including flexible dielectric sheets laminated in a direction of lamination and also including a first line portion, a second line portion extending along the first line portion, and a third line portion connecting ends in a specified direction of the first and second line portions. In the dielectric body, a signal line extends through the first, second and third line portions, and a first ground conductor and a second ground conductor face the signal line from both sides in the direction of lamination. One or more interlayer connection conductors are pierced in the dielectric sheets to connect the first ground conductor and the second ground conductor. None of the interlayer connection conductors is provided in a portion of the third line portion that is farther in a direction opposite to the specified direction than the signal line when viewed from the direction of lamination.

Подробнее
Номер записи: 14
22-02-2018 дата публикации

CIRCUIT BOARD STRUCTURE

Номер: US20180054893A1
Автор: Ho Chun-Lung, LEE Yi-Hsun, Lin Wu-Chen
Принадлежит:

A circuit board structure includes a first circuit board, a second circuit board and a plurality of first connection portions. The first circuit board has a first opening, and the second circuit board is disposed inside the first opening of the first circuit board. The first circuit board and the second circuit board are electrically independent from each other. The first connection portions are connected to the first circuit board and the second circuit board. 1. A circuit board structure , comprising:a first circuit board, having a first opening;a second circuit board, disposed inside the first opening of the first circuit board, and the first circuit board and the second circuit board being electrically independent from each other; anda plurality of first connection portions, connected to the first circuit board and the second circuit board.2. The circuit board structure as recited in claim 1 , further comprising:a mainboard, having a second opening, and the first circuit board and the second circuit board being disposed inside the second opening; anda plurality of second connection portions, connected to the mainboard and the first circuit board.3. The circuit board structure as recited in claim 2 , wherein the mainboard claim 2 , the first circuit board and the second circuit board are located on a same plane.4. The circuit board structure as recited in claim 2 , wherein the first circuit board comprises a plurality of first pads separated from one another claim 2 , the second circuit board comprises a plurality of second pads separated from one another claim 2 , the first pads are located on a first side surface of the first circuit board relatively far away from the second circuit board claim 2 , and the second pads are located on a second side surface of the second circuit board relatively adjacent to the first circuit board.5. The circuit board structure as recited in claim 4 , wherein the first connection portions and the second pads are misaligned claim 4 ...

Подробнее
Номер записи: 15
13-02-2020 дата публикации

Electrically Conductive Film

Номер: US20200053873A1
Автор: Schaetzle Martin
Принадлежит:

The invention relates to an electrically conductive film () having an electrically nonconductive substrate layer (), and an electrically conductive metal layer () that has a structure produced by material removal and that on a first side is joined, at least in sections, to the substrate layer (). 1. An electrically conductive film comprising:an electrically nonconductive substrate layer;an electrically conductive metal layer that has a structure produced by material removal and that on a first side is joined, at least in sections, to the electrically nonconductive substrate layer; andan electrically nonconductive cover layer having a structure that is produced by material removal;wherein the electrically conductive metal layer is located on a second side and is joined, at least in sections, to the cover layer;wherein a material of which the electrically nonconductive substrate layer is made has a modulus of elasticity in the range of 10 to 100 megapascals;wherein the material of which the electrically nonconductive substrate layer is made has a lower modulus of elasticity than the material of which the cover layer is made; andwherein a difference between the modulus of elasticity of the material of which the electrically nonconductive substrate layer is made and the modulus of elasticity of the material of which the cover layer is made is at least 20 megapascals.2. An electrically conductive film comprising:an electrically nonconductive substrate layer;an electrically conductive metal layer that has a structure produced by material removal and that on a first side is joined, at least in sections, to the electrically nonconductive substrate layer; andwherein the structure of the electrically conductive metal layer has one or more strip conductors that have at least one bent section;wherein the structure of the metal layer has one or more strip conductors;wherein at least one of the one or more strip conductors includes multiple strip conductor sections whose strip ...

Подробнее
Номер записи: 16
05-03-2015 дата публикации

Flex circuit system for a battery assembly of an electrified vehicle

Номер: US20150064516A1
Автор: James Lawrence Swoish
Принадлежит: FORD GLOBAL TECHNOLOGIES LLC

A flex circuit system according to an exemplary aspect of the present disclosure includes, among other things, a substrate, at least one bus bar mounted to the substrate and at least one voltage sense lead integrated with the substrate.

Подробнее
Номер записи: 17
20-02-2020 дата публикации

Wiring substrate, electronic device, and electronic module

Номер: US20200058568A1
Автор: Hiroshi Kawagoe
Принадлежит: Kyocera Corp

A wiring substrate includes an insulating substrate that is square in plan view, the insulating substrate having one main surface with a recess and an other main surface opposite to the one main surface, and external electrodes located on the other main surface of the insulating substrate and in a peripheral section of the insulating substrate. The external electrodes include first external electrodes and second external electrodes. In plan view, the first external electrodes are located at corners of the insulating substrate, and the second external electrodes are interposed between the first external electrodes. Each of the first external electrodes has a smaller area and a larger width in a direction orthogonal to each side of the insulating substrate than each of the second external electrodes.

Подробнее
Номер записи: 18
12-03-2015 дата публикации

Components and circuits for output termination

Номер: US20150070104A1
Автор: Ian Juso Dedic
Принадлежит: Socionext Inc

A lossy electrical-signal transmission line having first and second ends, the transmission line being configured such that: its characteristic impedance at the first end has a first value; its characteristic impedance at the second end has a second value, lower than the first value; and its series resistance measured from its first end to its second end is within a given range of the difference between said first and second values.

Подробнее
Номер записи: 19
17-03-2022 дата публикации

DIFFERENTIAL CIRCUIT BOARD AND SEMICONDUCTOR LIGHT EMITTING DEVICE

Номер: US20220087007A1
Автор: ADACHI Koichiro
Принадлежит:

A differential circuit board includes a dielectric layer having a first and a second surface, a first conductor line with a first line-width, a second conductor line with a second line-width less than the first line-width, and a ground conductor. The dielectric layer has a first portion with a first thickness between the first and second surface and a second portion with a second thickness less than the first thickness between the first and second surfaces. The first conductor line is disposed on the first surface of the first portion. The second conductor line is disposed on the first surface of the second portion. The ground conductor is disposed on the second surface of the first portion and the second surface of the second portion, wherein the ground conductor overlaps with the first conductor line and the second conductor line. The first and second conductor lines are differential transmission lines. 1. A differential circuit board comprising: 'wherein the dielectric layer has a first portion with a first thickness between the first surface and the second surface and has a second portion with a second thickness less than the first thickness between the first surface and the second surface;', 'a dielectric layer having a first surface and a second surface,'} 'wherein the first conductor line is disposed on the first surface of the first portion;', 'a first conductor line with a first line-width,'} 'wherein the second conductor line is disposed on the first surface of the second portion; and', 'a second conductor line with a second line-width less than the first line-width,'} 'wherein the first conductor line and the second conductor line are differential transmission lines.', 'wherein the ground conductor overlaps with the first conductor line and the second conductor line,'}, 'a ground conductor disposed on the second surface of the first portion and the second surface of the second portion,'}2. The differential circuit board of claim 1 , wherein the ground ...

Подробнее
Номер записи: 20
10-03-2016 дата публикации

Driving Printed Circuit Board for Display Device and Display Device Having the Same

Номер: US20160073498A1
Автор: Inho Yeo, KyongShik JEON
Принадлежит: LG Display Co Ltd

An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.

Подробнее
Номер записи: 21
27-02-2020 дата публикации

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

Номер: US20200068705A1
Автор: Charbonneau Marc Robert, Paniagua Jose Ricardo
Принадлежит: Amphenol Corporation

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film. 1. A printed circuit board comprising:a plurality of layers including one or more planar conductive layers and one or more conductive trace layers; and first and second vias of a first diameter connected to at least one of the conductive trace layers; and', 'conductive vias of a second diameter smaller than the first diameter located between the first and second vias and connected to at least one of the planar conductive layers., 'columns of via patterns formed in one or more of the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising2. A printed circuit board comprising:a plurality of layers, a top layer of the plurality of layers including a conductive surface film; and at least one signal via connected to a layer of the plurality of layers; and', 'at least one conductive shadow via electrically connected to the conductive surface film., 'via patterns formed in the plurality of layers, each of the via patterns comprising3. The printed circuit board as defined in claim 2 , wherein the at least one signal via comprises first and second signal vias that form a differential signal pair.4. The printed circuit board as defined in claim 3 , wherein the at least one conductive shadow via includes two shadow vias located midway between the ...

Подробнее
Номер записи: 22
12-06-2014 дата публикации

Lead structure

Номер: US20140160708A1
Автор: Chen-Fu Huang, Chen-Hao Su, Chin-Pei Hwang, Chiu-Mei Liu, Chun-Cheng Huang, Chung-Hsien Li, Kuan-Yu Chu, Kuo-Hsing Chen, Ming-Wu Chen, Yu-ching Wang, Yu-Ting Chen
Принадлежит: Wintek Corp

A lead structure disposed on a substrate is provided. The substrate includes a display area disposed with a device and a peripheral area disposed with a lead structure including first pads, a second pad, first traces and a second trace. The first traces are connected to the device. Each first trace has a first linear portion and a first bonding portion connected together. Each first trace is electrically connected to one of the first pads through the first bonding portion. The second trace has a second linear portion and a second bonding portion connected together. The second trace is electrically connected to the second pad through the second bonding portion. A width of the first linear portion is smaller than a width of the first bonding portion, and a width of the second linear portion is smaller than a width of the second bonding portion.

Подробнее
Номер записи: 23
23-03-2017 дата публикации

CIRCUIT OBFUSCATION USING DIFFERING DIELECTRIC CONSTANTS

Номер: US20170086286A1
Автор: Worl Robert Tilman
Принадлежит:

An obfuscated radio frequency circuit may be manufactured to include a metallization layer, and a dielectric layer under the metallization layer. The dielectric layer may be made up of a plurality of dielectric substrates having different dielectric constants to obfuscate functions of the circuit. 1. A method of manufacturing an obfuscated radio frequency circuit comprising:determining what functions of a radio frequency circuit are required; andmanufacturing the radio frequency circuit to have a metallization layer and a dielectric layer comprising a plurality of dielectric substrates, comprising a same width, having varying dielectric constants in order to achieve the required functions of the radio frequency circuit while obfuscating the functions of the manufactured radio frequency circuit.2. The method of wherein the manufacturing step further comprises manufacturing the plurality of dielectric substrates to comprise different lengths.3. The method of wherein the manufacturing step further comprises manufacturing the plurality of dielectric substrates to comprise a same height claim 1 , with at least two of the plurality of dielectric substrates comprising different lengths.4. The method of wherein the manufacturing step further comprises manufacturing the metallization layer to have a substantially uniform width along an entire length of the metallization layer.5. The method of wherein the manufacturing step further comprises manufacturing the metallization layer to have varying width portions along a length of the metallization layer.6. The method of wherein the manufacturing step further comprises manufacturing a plurality of the varying width portions to have varying lengths.7. The method of wherein the manufacturing step further comprises manufacturing the radio frequency circuit to comprise at least one of a filter claim 1 , a matching network claim 1 , a LC network claim 1 , a coupler claim 1 , a hybrid claim 1 , a power divider claim 1 , a termination ...

Подробнее
Номер записи: 24
25-03-2021 дата публикации

CONDUCTIVE PATTERN

Номер: US20210089151A1
Автор: JANG HwanSil, KEUM Dong Ki, PARK Dae Chul, SONG Byung Hoon, Song Sun Young
Принадлежит: Dongwoo Fine-Chem Co., Ltd.

Provided is a conductive pattern having at least one unit conductive pattern forming one touch pixel according to an aspect of the present invention. The at least one unit conductive pattern includes a plurality of nanostructures each having opposite ends. A ratio of nanostructures, both opposite ends of which are in contact with edges of the at least one unit conductive pattern to all nanostructures included in the at least one unit conductive pattern is 70% or more. 1. A conductive pattern , comprising:at least two unit conductive patterns, wherein the unit conductive pattern includes a plurality of nano structures having both ends, and a first ratio of a number of the plurality of nano structures in which both ends are in contact with side surfaces of the unit conductive pattern to a total number of the plurality of nano structures is 70% or more; anda connection portion connecting the at least two unit conductive patterns,wherein a width of the connection portion is 50% to 60% of a width of the unit conductive pattern.2. The conductive pattern of claim 1 , further comprising a matrix containing the plurality of nano structures.3. The conductive pattern of claim 2 , wherein the matrix is formed to extend continuously over the unit conductive patterns and the connection portion.4. The conductive pattern of claim 2 , wherein an end of at least a portion of the plurality of nano structures in contact with a side surface of the unit conductive pattern is exposed to an outside of the matrix.5. The conductive pattern of claim 2 , wherein the matrix includes a conductive material.6. The conductive pattern of claim 2 , wherein the matrix prevents oxidation of the plurality of nano structures.7. The conductive pattern of claim 2 , wherein the plurality of nano structures is dispersed inside the matrix.8. The conductive pattern of claim 1 ,wherein the plurality of nano structures includes a first nano structure and a second nano structure,wherein an end of the first nano ...

Подробнее
Номер записи: 25
26-06-2014 дата публикации

High-frequency signal transmission line and electronic device

Номер: US20140176254A1
Автор: Kanto IIDA, Shigeru Tago
Принадлежит: Murata Manufacturing Co Ltd

A high-frequency signal transmission line includes a dielectric body including a plurality of dielectric sheets. A signal line is provided in the dielectric body. A connector is mounted on a first main surface of the dielectric body and electrically connected to the signal line. A ground conductor is provided on a second main surface side of the dielectric body, compared with the signal line, and faces the signal line across the dielectric sheet. In the ground conductor, conductor-missing portions are provided in which no conductors are provided in at least portions of regions overlapping with the signal line in planar in connection portions. Adjustment conductors are provided in the second main surface of the dielectric body, and overlap with at least portions of the conductor-missing portions in the planar view.

Подробнее
Номер записи: 26
30-03-2017 дата публикации

Memory Module and Solid State Drive Having the Same

Номер: US20170094781A1
Автор: Hwi-jong YOO, Kwang-Kyu Bang, Yusuf Cinar
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.

Подробнее
Номер записи: 27
26-06-2014 дата публикации

Interconnection device for electronic circuits, notably microwave electronic circuits

Номер: US20140179127A1
Автор: Didier BRIANTAIS, Dominique Leduc, Julien Fortel, Patrick Fouin, Stephane Denis
Принадлежит: Thales SA

An interconnection device for elements to be interconnected such as electronic modules or circuits, comprises at least one transmission line coupled to a ground line, the two lines being produced on a face of a dielectric substrate, the interconnection being made substantially at the ends of the transmission line and of the ground line, wherein said interconnection device is flexible over at least a part of its length situated roughly between the elements to be interconnected.

Подробнее
Номер записи: 28
03-07-2014 дата публикации

Circuit board with signal routing layer having uniform impedance

Номер: US20140182902A1
Автор: Kai-Wen Wu
Принадлежит: Hon Hai Precision Industry Co Ltd

A circuit board comprises a signal routing layer, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first ground layer, a second ground layer, and a third ground layer. The signal routing layer includes chip traces, connector traces, and signal traces connected to components. The first dielectric layer, the first ground layer, the second dielectric layer, the second ground layer, the third dielectric layer, and the third ground layer, in that order, are located at gradually increasing distances from the signal routing layer. The first ground layer corresponds to the chip traces, the second ground layer corresponds to the signal traces, and the third ground layer corresponds to the connector traces.

Подробнее
Номер записи: 29
28-03-2019 дата публикации

FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS

Номер: US20190098764A1
Автор: Aygun Kemal, Li Eric, Ouyang Gong, Xiao Kai, Zhang Zhichao
Принадлежит: Intel Corporation

Fine feature formation techniques for printed circuit boards are described. In one embodiment, for example, a method may comprise fabricating a conductive structure on a low density interconnect (LDI) printed circuit board (PCB) according to an LDI fabrication process and forming one or more fme conductive features on the LDI PCB by performing a fme feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fme gap region within the conductive structure. Other embodiments are described and claimed. 125.-. (canceled)26. A method , comprising:fabricating a conductive structure on a low density interconnect (LDI) printed circuit board (PCB) according to an LDI fabrication process; andforming one or more fine conductive features on the LDI PCB by performing a fine feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fine gap region within the conductive structure.271. The method of / claim 26 , the fabrication of the conductive structure according to the LDI fabrication process to comprise implementing a minimum trace width of approximately 100 μm and a minimum trace spacing of approximately 100 μm.28. The method of claim 26 , the fine gap region to comprise a width of approximately 20-30 μm.29. The method of claim 26 , the fine gap region to comprise a width of approximately 50 μm or less.30. The method of claim 26 , the one or more fine conductive features to comprise breakout tracks for a connection array on the LDI PCB.315. The method of claim claim 26 , the connection array to comprise an inter-element pitch of approximately 0.8 mm.32. The method of claim 26 , the one or more fine conductive features to comprise an inductor coil.33. The method of claim 26 , the one or more fine conductive features to comprise a crosstalk mitigation structure.34. The method of claim 26 , the FFF ...

Подробнее
Номер записи: 30
12-05-2022 дата публикации

PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME

Номер: US20220151058A1
Автор: Choi Min Soo, NA Yeon Sun
Принадлежит:

An embodiment of a printed circuit board includes a first insulating layer, a metal layer disposed above the first insulating layer, a second insulating layer disposed above the metal layer, and signal lines disposed above the second insulating layer, the signal lines extending in a first direction and having line widths in a second direction perpendicular to the first direction. The metal layer has open areas overlapping the signal lines in a third direction perpendicular to the first and second directions. In another embodiment, the open areas are replaced with metal meshes. 1. A printed circuit board comprising:a first insulating layer;a metal layer disposed above the first insulating layer;a second insulating layer disposed above the metal layer; andsignal lines disposed above the second insulating layer, the signal lines extending in a first direction and having line widths in a second direction perpendicular to the first direction,wherein the metal layer has open areas overlapping the signal lines in a third direction perpendicular to the first and second directions.2. The printed circuit board of claim 1 , wherein the signal lines include a differential pair of signal lines.3. The printed circuit board of claim 1 , whereinthe signal lines include first and second signal lines,the line widths of the first and second signal lines are equal, andcenter lines of the first and second signal lines are parallel.4. The printed circuit board of claim 3 , wherein the line width of each of the first and second signal lines is a shortest distance from a side to an opposite side of each of the first and second signal lines in the second direction.5. The printed circuit board of claim 1 , further comprising additional signal lines disposed above the second insulating layer claim 1 , whereinthe additional signal lines have narrower line widths than the line widths of the signal lines, andthe metal layer under the additional signal lines is continuous.6. The printed circuit ...

Подробнее
Номер записи: 31
12-05-2022 дата публикации

Flexible printed circuit board and electronic device including the same

Номер: US20220151061A1
Автор: Chul Hyun Kim, Ji Won Lee, Kwang Youl Pyo
Принадлежит: Samsung Electro Mechanics Co Ltd

A flexible printed circuit board includes: a base film; a first circuit pattern disposed on an upper surface of the base film; a second circuit pattern disposed on a lower surface of the base film; and a boundary reinforcing pattern expanding the first circuit pattern in a width direction of the first circuit pattern based on a virtual boundary along which the first circuit pattern and the second circuit pattern meet each other in an overlay of the first circuit pattern and the second circuit pattern.

Подробнее
Номер записи: 32
03-07-2014 дата публикации

High-frequency signal line and electronic device

Номер: US20140184362A1
Автор: Noboru Kato, Shigeru Tago
Принадлежит: Murata Manufacturing Co Ltd

A high-frequency signal line includes an element assembly including a plurality of flexible insulator layers. a linear signal line provided in or on the element assembly, a first ground conductor provided in or on the element assembly and extending along the signal line, a plurality of second ground conductors provided in or on the element assembly and arranged at predetermined intervals in a direction in which the signal line extends, on a first side in a direction of lamination relative to the signal line, the second ground conductors being opposite to the signal line with at least one of the insulator layers positioned therebetween, and a plurality of first via-hole conductors extending through at least one of the insulator layers so as to connect the first and second ground conductors.

Подробнее
Номер записи: 33
26-03-2020 дата публикации

CIRCUIT SUBSTRATE, COMPONENT-MOUNTED SUBSTRATE, AND METHODS OF MANUFACTURING CIRCUIT SUBSTRATE AND COMPONENT-MOUNTED SUBSTRATE

Номер: US20200100360A1
Автор: Katsumata Masaaki, Noda Yosuke, SASAOKA Norifumi, Taguchi Koji
Принадлежит: NICHIA CORPORATION

A method of manufacturing a circuit substrate including forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method including filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further including performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other. 1. A circuit substrate comprising:a circuit pattern-provided insulating substrate including an insulating substrate and circuit patterns provided on a first surface and a second surface of the insulating substrate, the circuit pattern-provided insulating substrate having a through-hole penetrating the insulating substrate and the circuit patterns; andan electrically conductive paste filled in the through-hole and electrically connected to the circuit patterns, whereinthe circuit patterns contain Cu as a main component,the electrically conductive paste is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, anda diffusional reaction layer is provided where Cu included in the circuit patterns and Sn included in the electrically conductive paste cause a diffusional reaction in a portion where the electrically conductive paste and the circuit patterns are in contact with each other.2. The circuit substrate according to claim 1 , wherein a diameter of the ...

Подробнее
Номер записи: 34
19-04-2018 дата публикации

Circuit Board and Circuit Device

Номер: US20180110121A1
Автор: Yujiro Sugaya, Yuki Asanuma
Принадлежит: Iriso Electronics Co Ltd

To provide a circuit board that is capable of establishing electrical connection, that is thinner, and that has a higher maintainability. A circuit board 100 includes a substrate 101 including a hole portion 110 that penetrates the substrate 101 in a plate thickness direction, and a connector region including a first conductor layer 202 that closes one side of the hole portion 110, liquid metal 210 disposed in a recess 201 formed by the hole portion 110 and the first conductor layer 202, and a sealing layer 212 that is the liquid metal 210 cured on a liquid surface side. The liquid metal 210 may be in contact with a second conductor layer 204 formed in the recess 201.

Подробнее
Номер записи: 35
28-04-2016 дата публикации

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

Номер: US20160118360A1
Автор: Chen-Shien Chen, Sheng-Yu Wu, Tin-Hao Kuo
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A package includes a first and a second package component. The first package component includes a first metal trace and a second metal trace at the surface of the first package component. The second metal trace is parallel to the first metal trace. The second metal trace includes a narrow metal trace portion having a first width, and a wide metal trace portion having a second width greater than the first width connected to the narrow metal trace portion. The second package component is over the first package component. The second package component includes a metal bump overlapping a portion of the first metal trace, and a conductive connection bonding the metal bump to the first metal trace. The conductive connection contacts a top surface and sidewalls of the first metal trace. The metal bump is neighboring the narrow metal trace portion.

Подробнее
Номер записи: 36
03-05-2018 дата публикации

ELECTRONIC DEVICE

Номер: US20180120968A1
Автор: Wang Chao-Hsiang, Yen Chung-Wen, YUEH JUI-JEN
Принадлежит:

An electronic device is provided. The electronic device includes a substrate, a first contacting element, a second contacting element and a connecting element. The substrate has a first surface and a second surface. The substrate has a through hole located between the first surface and the second surface. At least a part of the connecting element is disposed in the through hole. The first contacting element is disposed on the first surface. The second contacting element is disposed on the second surface. The first contacting element electrically connects the second contacting element through the connecting element. 1. An electronic device , comprising:a substrate having a first surface and a second surface opposite to the first surface, wherein the substrate has a through hole located between the first surface and the second surface;a connecting element, wherein at least a part of the connecting element is disposed in the through hole;a first contacting element disposed on the first surface; anda second contacting element disposed on the second surface;wherein the first contacting element electrically connects the second contacting element through the connecting element.2. The electronic device according to claim 1 , wherein the connecting element includes a first portion claim 1 , a second portion and a third portion claim 1 , the first portion is disposed on the first surface claim 1 , the second portion is disposed on the second surface claim 1 , and the third portion is disposed in the through hole and connects the first portion and the second portion;wherein a covering area of the first contacting element on the first surface is greater than a covering area of the first portion on the first surface, and at least a part of the first contacting element overlaps the first portion in a direction perpendicular to the first surface.3. The electronic device according to claim 2 , wherein a covering area of the second contacting element on the second surface is greater ...

Подробнее
Номер записи: 37
14-05-2015 дата публикации

Shaped intneral leads for a printed circuit substrate

Номер: US20150129284A1
Автор: Chaovalit Chiyatan, Joompondej Bamrungwongtaree, Piriyakorn Jirawattanakasem, Prapan Aparimarn
Принадлежит: SEAGATE TECHNOLOGY LLC

A printed circuit substrate may be configured with at least one internal lead designed and shaped to reduce solder bridging. The printed circuit substrate can have a plurality of internal leads that each has a continuously curvilinear boundary that defines an isolation channel. The isolation channel may be configured with a uniform distance that separates a first internal lead from an adjacent second internal lead.

Подробнее
Номер записи: 38
03-05-2018 дата публикации

SIGNAL TRANSMISSION COMPONENT AND ELECTRONIC DEVICE

Номер: US20180123206A1
Автор: YOSUI Kuniaki
Принадлежит:

A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level. 1. A signal transmission component comprising:a laminate including a plurality of dielectric layers that are laminated on each other, the plurality of dielectric layers each including a conductor pattern with a flat film shape and having flexibility;a signal conductor that is defined, in the laminate, by the conductor pattern, has a linear shape, and extends in a direction perpendicular to a lamination direction of the laminate;a first ground conductor and a second ground conductor that are defined by a conductor pattern different from the signal conductor, in an extending direction so as to extend parallel or substantially parallel to the signal conductor, have a flat film shape, and hold the signal conductor between the first ground conductor and the second ground conductor in the lamination direction; anda connector for external connection that is connected to at least one of opposite ends of the signal conductor, wherein the laminate includes a thinned portion of which a thickness in the lamination direction is reduced an end portion;no first ground conductor is located at the thinned portion;the signal conductor is connected to the connector for external ...

Подробнее
Номер записи: 39
16-04-2020 дата публикации

ELECTRONIC DEVICE

Номер: US20200120787A1
Автор: CHAIO Wei-Hsin, Chou Wei-Ting, FENG Yu-Hsin, Lu Yu-Tse
Принадлежит:

The present disclosure relates to an electronic device. The electronic device includes a circuit board. The circuit board includes a wiring layer and a patterned electrode layer. The wiring layer includes a plurality of wires. One of the wires includes a trace part and a terminal part connected to the trace part. The patterned electrode layer is disposed opposite to the wiring layer. The trace part and the patterned electrode layer have a first overlapping area, the terminal part and the patterned electrode layer have a second overlapping area, and a ratio of the first overlapping area to the second overlapping area is between 0.7 and 1.3. 1. An electronic device , comprising:a circuit board including:a wiring layer including a plurality of wires, one of the plurality of wires including a trace part and a terminal part connected to the trace part; anda patterned electrode layer disposed opposite to the wiring layer;wherein, the trace part and the patterned electrode layer have a first overlapping area, the terminal part and the patterned electrode layer have a second overlapping area, and a ratio of the first overlapping area to the second overlapping area is between 0.7 and 1.3.2. The electronic device of claim 1 , wherein the patterned electrode layer includes a plurality of stripe electrodes claim 1 , and one of the stripe electrodes overlaps at least a part of the trace part and at least a part of the terminal part.3. The electronic device of claim 2 , wherein one of the plurality of stripe electrodes has a first width claim 2 , the trace part has a second width claim 2 , and a ratio of the first width to the second width is between 0.7 and 1.3.4. The electronic device of claim 2 , wherein one of the plurality of stripe electrodes has a first width claim 2 , the trace part has a second width claim 2 , and the first width is less than the second width.5. The electronic device of claim 2 , wherein one of the plurality of stripe electrodes is located between two ...

Подробнее
Номер записи: 40
27-05-2021 дата публикации

Component Carrier With Electrically Reliable Bridge With Sufficiently Thick Vertical Thickness in Through Hole of Thin Dielectric

Номер: US20210161012A1
Автор: Chung Valerian Yun Khim, Dou Alex Yucun, Ismail Ismadi Bin, Tay Seok Kim
Принадлежит:

A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 μm and a narrowest vertical thickness of the bridge structure is at least 20 μm. 1. A component carrier , comprising:an electrically insulating layer structure having a first main surface and a second main surface;a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface;an electrically conductive bridge structure connecting opposing sidewalls of the electrically insulating layer structure delimiting the through hole;wherein the through hole comprises a first tapering portion extending from the first main surface, a second tapering portion extending from the second main surface, and a central substantially cylindrical section connecting the first tapering portion with the second tapering portion.2. The component carrier according to claim 1 , further comprising:a first electrically conductive layer structure on the first main surface; anda second electrically conductive layer structure on the second main surface.3. The component carrier according to claim 1 , comprising at least one of the following features:wherein a vertical thickness of the electrically insulating layer structure is not more than 200 μm, in particular not more than 140 μm, in particular not more than 110 μm, more particularly is in a range between 40 μm and 60 μm;wherein a narrowest vertical thickness of the bridge structure is at least 20 μm, in particular at least 25 μm;wherein the narrowest vertical thickness of the ...

Подробнее
Номер записи: 41
02-05-2019 дата публикации

SYSTEMS AND APPARATUSES FOR POWER ELECTRONICS WITH HIGH CURRENT CARRYING CONDUCTORS

Номер: US20190132944A1
Автор: COLLINS John Oliver, Handy Peter James, MAYES Julian Peter
Принадлежит: GE AVIATION SYSTEMS LIMITED

Systems and apparatuses for electrically switching current include a first conductor formed of an electrically conductive material and having a first longitudinal axis; a second conductor formed of the electrically conductive material and having a second longitudinal axis; a set of switching components, each component selectively configured to electrically couple the first conductor to the second conductor; and a printed circuit board on which the first and second conductors are disposed. The width of the first conductor along the first longitudinal axis varies such that the current density in the first conductor is substantially constant along the first longitudinal axis and the width of the second conductor along the second longitudinal axis varies such that the current density in the second conductor is substantially constant along the second longitudinal axis. 2. The apparatus of claim 1 , wherein each component of the set of switching components is a metal-oxide-semiconductor field effect transistor (MOSFET).3. The apparatus of claim 2 , wherein each of the metal-oxide semiconductor field effect transistors are electrically coupled in parallel.4. The apparatus of claim 1 , wherein the width of the first conductor is tapered along the first longitudinal axis.5. The apparatus of claim 4 , wherein the width of the second conductor is tapered along the second longitudinal axis such that the width of second conductor increases as the width of the first conductor decreases.6. The apparatus of claim 1 , wherein the second conductor is bifurcated with a first portion along the second longitudinal axis and a second portion along a third longitudinal axis.7. The apparatus of claim 6 , wherein the set of switching components includes a first subset of the switching components coupled to the first portion of the second conductor and a second subset of the switching components coupled to the second portion of the second conductor.8. The apparatus of claim 1 , wherein the ...

Подробнее
Номер записи: 42
28-05-2015 дата публикации

Overcurrent protection device

Номер: US20150146335A1
Автор: Kohei Ishido
Принадлежит: Kyocera Document Solutions Inc

An overcurrent protection device satisfactorily detects overcurrent without adding complicated component or occupying large space. Penetration member penetrates board face A having a first wiring circuit and face B with a second one, transmitting heat from face A to B. Connection/disconnection part is inserted into first wiring circuit, switching current to heat generation part for generating heat with current, formed in portion of first circuit, continued with one end of penetration member. Temperature detection member disposed near or abutted against other end of penetration member on face B detects transmitted heat, outputting signal. Control part controls connection/disconnection part on signal. Heat generation part is narrower than width w1 not generating heat in steady state, having width w2 to raise temperature upon overcurrent, and being sandwiched between patterns with width w1. Control part turns off current with heat generation part temperature raised to or above prescribed threshold.

Подробнее
Номер записи: 43
08-09-2022 дата публикации

ELECTRICALLY CONDUCTIVE FILM

Номер: US20220287173A1
Автор: Schaetzle Martin
Принадлежит:

The invention relates to an electrically conductive film () having an electrically nonconductive substrate layer (), and an electrically conductive metal layer () that has a structure produced by material removal and that on a first side is joined, at least in sections, to the substrate layer (). 1. An electrically conductive film comprising:an electrically nonconductive substrate layer; andan electrically conductive metal layer that has a structure produced by material removal and that on a first side is joined, at least in sections, to the electrically nonconductive substrate layer; andwherein the electrically conductive metal layer is made of copper, a copper alloy, aluminum, and/or an aluminum alloy.2. The electrically conductive film according to claim 1 , wherein the structure of the electrically conductive metal layer has one or more strip conductors that have at least one bent section.3. The electrically conductive film according to claim 1 ,wherein the structure of the electrically conductive metal layer has one or more strip conductors, wherein at least one strip conductor includes multiple strip conductor sections whose strip conductor widths differ from one another.4. The electrically conductive film according to claim 3 , wherein the multiple strip conductor sections of the at least one strip conductor extend in an offset manner and/or in parallel to one another.5. The electrically conductive film according to claim 3 , wherein the strip conductor width of successive strip conductor sections of the at least one strip conductor increases or decreases along the course of the strip conductor.6. The electrically conductive film according to claim 1 ,comprising an electrically nonconductive cover layer having a structure that is produced by material removal, wherein the electrically conductive metal layer on a second side is joined, at least in sections, to the electrically nonconductive cover layer7. The electrically conductive film according to claim 6 , ...

Подробнее
Номер записи: 44
26-05-2016 дата публикации

Multilayer substrate

Номер: US20160150636A1
Автор: Yoshihito OTSUBO
Принадлежит: Murata Manufacturing Co Ltd

A multilayer substrate includes a multilayer body including a plurality of stacked resin layers and a wiring layer provided in the resin layer. The multilayer body includes a deformable flexible portion which generally defines a wave-shaped portion extending in a direction of travel that is repeatedly changed when viewed in a direction of stacking of the resin layers, the wiring layer being routed along the wave-shaped portion. The flexible portion includes a turn-back portion arranged at a position where the direction of travel is changed and an intermediate portion connecting adjacent turn-back portions to each other. A width of the turn-back portion is greater than a width of the intermediate portion.

Подробнее
Номер записи: 45
15-09-2022 дата публикации

IMPEDANCE MATCHING WITHIN A SIGNAL TRANSMISSION CHANNEL

Номер: US20220295628A1
Автор: Farkas Sandor, Mutnury Bhyrav
Принадлежит:

A printed circuit board for an information handling system includes a trace, a routing component, and one or more intermediate components. The trace has a first impedance, and the routing component has a second impedance. The intermediate components have respective intermediate impedances. Each of the intermediate impedances has a corresponding value in a range between a value of the first impedance and a value of the second impedance. The one or more intermediate impedances reduce an impedance discontinuity between the trace and the routing component. 1. A printed circuit board for an information handling system , the printed circuit board comprising:a trace having a first impedance;a routing component having a second impedance; andone or more intermediate components having a respective intermediate impedance, each of the intermediate impedances have a corresponding value in a range between a value of the first impedance and a value of the second impedance, the intermediate impedances to reduce an impedance discontinuity between the trace and the routing component.2. The printed circuit board of claim 1 , wherein the one or more intermediate components is a single tapered component having a varying impedance.3. The printed circuit board of claim 2 , wherein the varying impedance is highest near the trace and lowest near the routing component.4. The printed circuit board of claim 2 , wherein the single tapered component is thinnest near the trace claim 2 , widens toward the routing component claim 2 , and is thickest near the routing component.5. The printed circuit board of claim 1 , wherein the one or more intermediate impedances of the respective one or more intermediate components spread the impedance discontinuity between the trace and the routing component over a length equal to a number of wavelengths of a signal transmitted along the trace claim 1 , the one or more intermediate components claim 1 , and the routing component.6. The printed circuit board of ...

Подробнее
Номер записи: 46
16-05-2019 дата публикации

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

Номер: US20190150273A1
Автор: Charbonneau Marc Robert, Paniagua Jose Ricardo
Принадлежит: Amphenol Corporation

A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements. 1. A printed circuit board comprising:a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including at least one signal layer; andvia patterns formed in the plurality of layers within a connector footprint of the printed circuit board, the via patterns including a first via pattern and a second via pattern,wherein the signal layer includes a conductor located between the first via pattern and the second via pattern and configured for connection to a reference voltage.2. The printed circuit board as defined in claim 1 , wherein the via patterns include first and second columns of via patterns and wherein the conductor is located between the first and second columns of via patterns.3. The printed circuit board as defined in claim 1 , wherein the conductor comprises a conductive strip located between the first and second via patterns.4. The printed circuit board as defined in claim 1 , wherein the conductor surrounds the first and second via patterns.5. The printed circuit board as defined in claim 1 , wherein the conductor includes a plurality of conductors configured for connection to the reference voltage.6. The printed circuit board as defined in claim 1 , wherein the ground conductor comprises a copper conductor configured for connection to ground.7. The printed circuit board as defined in claim 1 , wherein the signal ...

Подробнее
Номер записи: 47
07-05-2020 дата публикации

Systems and methods for providing a high speed interconnect system with reduced crosstalk

Номер: US20200146139A1
Автор: Andres M. Gonzalez, David Cure, Marvin D. Miller, Michael T. DeRoy, Tena M. Hochard
Принадлежит: Eagle Technology LLC

Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (“CS”) a First Via (“FV”) formed therethrough; disposing a First Trace (“FT”) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (“SV”) formed through the first HDI substrate; disposing a Second Trace (“ST”) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (“TV”) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

Подробнее
Номер записи: 48
04-09-2014 дата публикации

Touch screen panel

Номер: US20140247400A1
Автор: Ae Young MA, Han Kyung Kim, Hyun Song, Jin Ah Lee, Jon Ghwan KO, Joon SONG, Won Cheol HONG, Young Wook Kim
Принадлежит: Dongbu HitekCo Ltd

Touch screen panels and methods of manufacturing the same are provided. A touch screen panel can include a plurality of driving lines arranged in a first direction and a plurality of sensing lines arranged in a direction intersecting the first direction. The driving lines can each include at least one hole and/or at least one groove in an area intersecting the sensing line.

Подробнее
Номер записи: 49
18-06-2015 дата публикации

Electronic component mounting structure and printed wiring board

Номер: US20150173195A1
Автор: Takashi Aoki, Yasuhiro Sawada
Принадлежит: Canon Inc

An electronic component mounting structure includes a first land, a second land making a pair with the first land, an electronic component having a chip shape and including a first electrode connected to the first land and a second electrode connected to the second land, a first wiring pattern connected to the first land, and a second wiring pattern connected to the second land and including a first partial pattern overlapping a portion of a body of the electronic component in planar view, the portion being not covered with the pair of electrodes, a second partial pattern formed integral with the first partial pattern and overlapping the first electrode of the electronic component in planar view, and a third partial pattern formed integral with the second partial pattern and parallel to the first wiring pattern.

Подробнее
Номер записи: 50
11-09-2014 дата публикации

Electronic control device including interrupt wire

Номер: US20140253282A1
Автор: Hiroaki Nakamura, Ryoichi Shiraishi, Shigeki Nishiyama, Takahiko FURUTA, Toru Itabashi, Yuuki MIKAMI
Принадлежит: Denso Corp, Murata Manufacturing Co Ltd

An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

Подробнее
Номер записи: 51
29-09-2022 дата публикации

ELECTRONIC CIRCUIT AND CIRCUIT BOARD

Номер: US20220312581A1
Автор: HORIKAWA Daisuke
Принадлежит: FUJIFILM Business Innovation Corp.

An electronic circuit includes a conductor column that is connected to a ground of a first layer which is any one of plural conductor layers stacked in a separated state and extends in a stacking direction, a first conductor line that is connected to the conductor column to extend in a band shape in a second layer different from the first layer of the plural conductor layers, and of which an end portion separated from the conductor column is an open end, and a second conductor line that extends in a band shape in any layer of the plural conductor layers, in which each of the first conductor line and the second conductor line has one neighboring portion constituting at least a pair of neighboring portions, which are close to each other to be connectable, and a first end portion of the second conductor line, which is separated from the neighboring portion formed on the second conductor line, is an open end. 1. An electronic circuit comprising:a conductor column that is connected to a ground of a first layer which is anyone of a plurality of conductor layers stacked in a separated state and extends in a stacking direction;a first conductor line that is connected to the conductor column to extend in a band shape in a second layer different from the first layer of the plurality of conductor layers, and of which an end portion separated from the conductor column is an open end; anda second conductor line that extends in a band shape in any layer of the plurality of conductor layers,wherein each of the first conductor line and the second conductor line has one neighboring portion constituting at least a pair of neighboring portions, which are close to each other to be connectable, anda first end portion of the second conductor line, which is separated from the neighboring portion formed on the second conductor line, is an open end.2. The electronic circuit according to claim 1 ,wherein the neighboring portion is formed on a surface layer of the plurality of conductive ...

Подробнее
Номер записи: 52
01-07-2021 дата публикации

Electrically Conductive Film

Номер: US20210204400A1
Автор: Schaetzle Martin
Принадлежит:

The invention relates to an electrically conductive film () having an electrically nonconductive substrate layer (), and an electrically conductive metal layer () that has a structure produced by material removal and that on a first side is joined, at least in sections, to the substrate layer (). 1) An electrically conductive film for a cell contacting unit for a battery , the electrically conductive film having:an electrically nonconductive substrate layer;an electrically conductive metal layer that has a structure produced by material removal and that on a first side is joined, at least in sections, to the electrically nonconductive substrate layer; andan electrically nonconductive cover layer having a structure that is produced by material removal;wherein the electrically conductive metal layer is located on a second side and is joined, at least in sections, to the cover layer;wherein a material of which the electrically nonconductive substrate layer is made has a modulus of elasticity in the range of 10 to 100 megapascals;wherein the material of which the electrically nonconductive substrate layer is made has a lower modulus of elasticity than the material of which the cover layer is made; andwherein a difference between the modulus of elasticity of the material of which the electrically nonconductive substrate layer is made and the modulus of elasticity of the material of which the cover layer is made is at least 20 megapascals.220-. (canceled)21) The electrically conductive film according to claim 1 ,wherein the conductive film has contacting sections that are configured to be electroconductively connected to contact poles of unit cells.2226-) (canceled)27) The electrically conductive film according to claim 1 , wherein the battery is a vehicle battery.28) The electrically conductive film according to claim 1 , wherein the electrically conductive metal layer includes multiple strip conductors.29) The electrically conductive film according to claim 28 , wherein ...

Подробнее
Номер записи: 53
06-06-2019 дата публикации

FLEXIBLE PRINTED CIRCUIT AND ELECTRONIC DEVICE

Номер: US20190174632A1
Автор: SHUTO Takaya
Принадлежит:

A flexible printed circuit according to the present invention comprises a flexible base, a wiring pattern arranged on the flexible base, and a via that is provided in the flexible base and is electrically connected to the wiring pattern, wherein the wiring pattern is formed to have an aspect ratio of at least 0.7 or more. This feature enables to increase the density of a wiring structure in the flexible printed circuit while improving the reliability thereof. 1. A flexible printed circuit comprising:a flexible base;a wiring pattern arranged on the flexible base; anda via that is provided in the flexible base and is electrically connected to the wiring pattern,wherein the wiring pattern is formed to have an aspect ratio of at least 0.7 or more.2. The flexible printed circuit according to claim 1 , wherein claim 1 , in a cross section orthogonal to a direction in which the wiring pattern extends claim 1 , the width of the wiring pattern in a horizontal direction increases from a lower side toward an upper side claim 1 , and the wiring pattern includes a portion that satisfies claim 1 , when the angle of inclination of a side face of the wiring pattern is denoted as θ claim 1 , 90°<θ<105°.3. The flexible printed circuit according to claim 2 , wherein the portion of the side face of the wiring pattern is curved in a convex shape.4. The flexible printed circuit according to claim 2 , wherein 90°<θ≤100° is further satisfied.5. The flexible printed circuit according to claim 2 , wherein the wiring pattern is formed to have a width in a range from 2 μm to 50 μm and a height in a range from 6 μm to 35 μm.6. The flexible printed circuit according to claim 2 , wherein when claim 2 , in the cross section claim 2 , the height from a lower face to an upper face of the wiring pattern is denoted as H claim 2 , and the distance from an end of the lower face to an end of the upper face of the wiring pattern in a horizontal direction is denoted as D claim 2 , H/D≥5 is satisfied.7. The ...

Подробнее
Номер записи: 54
28-05-2020 дата публикации

Method of Utilizing Serpentine Regions

Номер: US20200170103A1
Автор: Liao Chun-Lin, Mutnury Bhyrav Murthy
Принадлежит:

In one or more embodiments, a circuit board may include a trace pair and a serpentine region of the trace pair, which may include: a first subregion in which the first trace includes a first portion that has a third width and a first length and in which the second trace includes a second portion, at least substantially parallel to the first portion, that has a fourth width, greater than the second width, and a second length; and a second subregion, adjacent to the first subregion, in which the first trace includes a third portion that has the third width and a third length and in which the second trace includes a third portion that has the fourth width and a third length, different from the second length. 1. A method , comprising:providing a circuit board that includes a first board structure member, a second board structure member, a third board structure member, and a fourth board structure member; forming a first trace of the trace pair that extends between the first board member structure and the third board member structure; and', 'forming a second trace of the trace pair that extends between the second board member structure and the fourth board member structure;, 'forming a trace pair, which includes forming a first subregion in which the first trace includes a first portion that has a third width and a first length and in which the second trace includes a second portion, at least substantially parallel to the first portion, that has a fourth width, greater than the second width, and a second length; and', 'forming a second subregion, adjacent to the first subregion, in which the first trace includes a third portion that has the third width and a third length and in which the second trace includes a third portion that has the fourth width and a third length, different from the second length., 'forming a serpentine region of the trace pair, which extends the second trace and which includes2. The method of claim 1 , wherein the second width is the first width.3 ...

Подробнее
Номер записи: 55
28-05-2020 дата публикации

METHOD FOR THROUGH-PLATING A PRINTED CIRCUIT BOARD AND SUCH A PRINTED CIRCUIT BOARD

Номер: US20200170123A1
Автор: Brinkis Waldemar, Mattmann Erich, Zacherl Jürgen
Принадлежит:

A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections. 118.-. (canceled)19. A method of through-plating a printed circuit board with conductor tracks formed on two sides of a sintered ceramic substrate , comprising:simultaneously filling a multitude of holes of different hole diameter in the sintered ceramic substrate under compression pressure with a metallic sintering paste in a single filling manufacturing operation;drying and firing and sintering the metallic sintering paste in a course of the firing, wherein the metallic sintering paste in its sintered state enters into at least a cohesive bond with the sintered ceramic substrate and fills the hole;wherein, for the simultaneous filling of the multitude of holes of different hole diameter with the metallic sintering paste, a printing screen having a multitude of assigned screen holes of different diameter is used; andusing a single set of print parameters fixed based on one hole among those to be filled that functions as a reference;wherein the printing screen comprises at least one screen hole for filling a hole which is larger compared to a reference hole; andwherein the at least one screen hole has an area-reducing and area-dividing geometry that divides the at least one screen hole into at least two hole sections.20. The method as claimed in claim 19 , wherein the ...

Подробнее
Номер записи: 56
15-07-2021 дата публикации

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

Номер: US20210219420A1
Автор: Charbonneau Marc Robert, Paniagua Jose Ricardo
Принадлежит: Amphenol Corporation

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film. 1. A printed circuit board comprising:a plurality of layers, a top layer of the plurality of layers including a conductive surface film; and at least one signal via connected to a layer of the plurality of layers; and', 'at least one conductive shadow via electrically connected to the conductive surface film., 'via patterns formed in the plurality of layers, each of the via patterns comprising2. The printed circuit board as defined in claim 1 , wherein the at least one signal via comprises first and second signal vias that form a differential signal pair.3. The printed circuit board as defined in claim 2 , wherein the at least one conductive shadow via includes two shadow vias located midway between the first and second signal vias.4. The printed circuit board as defined in claim 1 , wherein the at least one shadow via extends through the plurality of layers.5. The printed circuit board as defined in claim 1 , further comprising additional shadow vias located between adjacent via patterns and electrically connected to the conductive surface film.6. The printed circuit board as defined in claim 1 , wherein the conductive surface film is configured to contact a conductive element of a connector.7. The printed circuit board as defined in claim 2 , wherein each of the via patterns further comprises an antipad formed in the ...

Подробнее
Номер записи: 57
20-07-2017 дата публикации

Shielded, folded connector for a sensor

Номер: US20170202495A1
Автор: Matthew Dalene
Принадлежит: CAS Medical Systems Inc

An oximetry sensor assembly connector, and a method for making the same, is provided that includes a flexible circuit and a stiffener panel. The flexible circuit has a plurality of layers including at least one electrical trace layer and at least one electromagnetic interference (EMI) shield layer. The stiffener panel has a first side surface and a second side surface, which second side surface is opposite the first side surface. The flexible circuit includes a first segment and a second segment, and one or more of the plurality of layers are disposed within the first segment and the second segment. The flexible circuit is folded such that the first segment is contiguous with the first side surface of the stiffener panel, and the second segment is contiguous with the second side surface of the stiffener panel.

Подробнее
Номер записи: 58
04-07-2019 дата публикации

DUAL-DRILL PRINTED CIRCUIT BOARD VIA

Номер: US20190208631A1
Автор: Xiong Yongming
Принадлежит:

A printed circuit board having multiple layers of circuitry, the printed circuit board including a first layer having a first cylindrical opening with a first diameter, the first cylindrical opening formed through at least the first layer and formed about a particular axis; and a second layer having a second cylindrical opening with a second diameter, the second cylindrical opening formed through at least the second layer and formed about the particular axis, where the first cylindrical opening is a portion of a conductive via, and where the second diameter is smaller than the first diameter. 1. A method of forming vias on a printed circuit board having multiple layers of circuitry , the method comprising:forming, about a particular axis, a first cylindrical opening with a first diameter through at least a first layer of the printed circuit board; andforming, about the particular axis, a second cylindrical opening with a second diameter through at least a second layer of the printed circuit board,wherein the first cylindrical opening and the second cylindrical opening are portions of a conductive via, andwherein the second diameter is smaller than the first diameter.2. The method of claim 1 ,wherein forming the second cylindrical opening further comprises drilling, using a drill bit having the second diameter, a cylindrical opening through the first layer followed by the second layer, andwherein forming the first cylindrical opening further comprises after forming the cylindrical opening with the second diameter through the first layer and the second layer, drilling, using a drill bit having the first diameter, the first cylindrical opening through at least the first layer.3. The method of claim 1 ,wherein forming the first cylindrical opening further comprises drilling, in a first direction along the particular axis, the first cylindrical opening through at least the first layer of the printed circuit board,wherein forming the second cylindrical opening further ...

Подробнее
Номер записи: 59
13-08-2015 дата публикации

Board assembly for transmitting high-speed signal and method of manufacturing the same

Номер: US20150230330A1
Автор: Eun Gu Lee, Jyung Chan Lee, Sang Soo Lee, Sil Gu Mun
Принадлежит: Electronics and Telecommunications Research Institute ETRI

A board assembly for transmitting a high-speed signal and a method of manufacturing the same. The board assembly may include a submount board, a base board, and a contact member for a signal line. The submount board may include at least one first high-speed signal line formed on the surface thereof. The base board may include the submount board on one part of the upper surface thereof, and at least second high-speed signal line on the other part of the upper surface thereof, wherein the second high-speed signal lines corresponds to the first high-speed signal lines, respectively. The contact member for the signal line may be installed on the side of the submount board, and have an upper portion contacting the first high-speed signal line and a lower portion contacting the second high-speed signal line such that the first high-speed signal line contacts the second high-speed signal line.

Подробнее
Номер записи: 60
27-08-2015 дата публикации

Paddle card with improved performance

Номер: US20150245466A1
Автор: Mark Alan BUGG
Принадлежит: MOLEX LLC

A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged thereon in pairs. The contact pads of each pair are spaced apart from each other to provide a pair of points to which cable wire free ends may be terminated, such as by soldering. The spacing of the pads apart from each other in effect reduces to amount of capacitance in the cable wire termination area on the circuit board, thereby reducing the impedance and insertion loss in that area at high frequencies. The contact pads of each pair may be further interconnected together by a thin, conductive trace that extends lengthwise between the contact pads.

Подробнее
Номер записи: 61
13-11-2014 дата публикации

Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures

Номер: US20140331482A1
Автор: Jason L. Frankel, Jinwoo Choi, Paul R. Walling, Roger D. Weekly, Sungjun Chun
Принадлежит: International Business Machines Corp

A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.

Подробнее
Номер записи: 62
16-07-2020 дата публикации

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

Номер: US20200229299A1
Автор: Charbonneau Marc Robert, Paniagua Jose Ricardo
Принадлежит: Amphenol Corporation

A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements. 1. A printed circuit board comprising:a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including at least one signal layer; andvia patterns formed in the plurality of layers within a connector footprint of the printed circuit board, wherein the via patterns include a first column of via patterns and a second column of via patterns,wherein the signal layer includes at least one signal trace between the first column of via patterns and the second column of via patterns, a first conductor located between the first column of via patterns and the at least one signal trace, and a second conductor located between the second column of via patterns and the at least one signal trace, wherein the first and second conductors are configured for connection to a reference voltage.2. The printed circuit board as defined in claim 1 , wherein the first conductor and the second conductor each comprise a conductive strip located between the first and second columns of via patterns.3. The printed circuit board as defined in wherein the first conductor and the second conductor each comprise conductive areas that surround the via patterns of the first and second columns of via patterns.4. The printed circuit board as defined in wherein the first conductor and the second conductor each comprise a copper conductor configured for connection ...

Подробнее
Номер записи: 63
13-11-2014 дата публикации

Wiring board and light emitting device using same

Номер: US20140334164A1
Автор: Tadaaki Miyata
Принадлежит: Nichia Corp

A wiring board includes an insulated substrate, a wiring pattern and a folded part. The insulated substrate has an elongated shape with shorter sides extending along a width direction. The wiring pattern is provided on the substrate. The wiring pattern extends between both ends in the width direction of the substrate, and has an exposed part exposed at at least one of the ends of the substrate. In the folded part, the exposed part of the wiring pattern and the substrate are integrally folded up inwardly toward an upper face side of the substrate at each of the ends of the substrate.

Подробнее
Номер записи: 64
01-08-2019 дата публикации

Stubbed differential trace pair system

Номер: US20190239339A1
Автор: Bhyrav M. Mutnury, Mallikarjun Vasa, Umesh Chandra
Принадлежит: Dell Products LP

A stubbed differential trace pair system includes a circuit board having a first differential trace pair with a first trace and a second trace, and a second differential trace pair with a third trace and a fourth trace, where the first trace located opposite the second trace and the third trace from the fourth trace. Second trace stubs extend in a spaced apart orientation relative to each other and from a side of the second trace that is opposite the second trace from the first trace. Third trace stubs extend in a spaced apart orientation relative to each other and from a side of the third trace that is opposite the third trace from the fourth trace. The second trace stubs and the third trace stubs are configured to reduce crosstalk generated by the transmission of signals through the first differential trace pair and the second differential trace pair.

Подробнее
Номер записи: 65
23-07-2020 дата публикации

Electrical conductors

Номер: US20200236780A1
Автор: Andrew J. Ouderkirk, Andrew P. Bonifas, II Alejandro Aldrin A. Narag, Nicholas T. GABRIEL, Ravi Palaniswamy, Robert M. Jennings, Robin E. Gorrell, Ronald D. Jesme
Принадлежит: 3M Innovative Properties Co

Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.

Подробнее
Номер записи: 66
27-11-2014 дата публикации

SEMICONDUCTOR DEVICE

Номер: US20140347836A1
Автор: NAKAMURA Youko, NASHIDA Norihiro
Принадлежит:

A semiconductor device includes: a conductive-patterned insulating substrate; conductive blocks fixed to conductive patterns of the conductive-patterned insulating substrate; a semiconductor chip fixed to each conductive block; a printed circuit board that has a conductive post fixed to the semiconductor chip; and a resin. The semiconductor device is configured such that the average volume of a conductive film per unit area of each conductive pattern around a section thereof, to which the corresponding conductive block is fixed, is reduced from the conductive block toward the outside. 1. A semiconductor device , comprising:an insulating substrate;a conductive pattern disposed on the insulating substrate;a conductive block disposed on the conductive pattern;a semiconductor chip disposed on the conductive block;a printed circuit board comprising a conductive post coupled to the semiconductor chip; anda resin disposed on the semiconductor chip and printed circuit board,wherein an average volume per unit area of the conductive pattern decreases in a direction away from the conductive block.2. The semiconductor device according to claim 1 , wherein the conductive pattern comprises holes claim 1 , and the number of holes per unit area of the conductive pattern increases in the direction away from the conductive block.3. The semiconductor device according to claim 1 , wherein the conductive pattern comprises holes claim 1 , and cross-sectional areas of the holes increase in the direction away from the conductive block.4. The semiconductor device according to claim 1 , wherein the conductive pattern comprises annular grooves claim 1 , and the number of annular grooves per unit length increases in the direction away from the conductive block.5. The semiconductor device according to claim 1 , wherein the conductive pattern comprises annular grooves claim 1 , and widths of the annular grooves increase in the direction away from the conductive block.6. The semiconductor device ...

Подробнее
Номер записи: 67
30-07-2020 дата публикации

INPUT DEVICE

Номер: US20200245454A1
Автор: ASAKAWA Takashi, SASAGAWA Hideto
Принадлежит:

An input device includes a support base, a sensor unit including electrode portions, an extended portion extending outward from the support base, a lead-out wire in conduction with the electrode portions, a grounding wire adjacent to the lead-out wire, the lead-out wire and the grounding wire being along a first major surface of the extended portion, and a reinforcement plate on a part of a second major surface opposite to the first major surface and on the side of the support base from the tip. When viewed from a normal direction of the second major surface, the grounding wire is greater than the lead-out wire, an end-portion projection line formed by a support-base-side end portion of the reinforcement plate is nonlinear, and a most-protruding location in the end-portion projection line closest to the support base overlaps the grounding wire. 1. An input device comprising:a support base;a sensor unit disposed on the support base and including a plurality of electrode parts;an extended portion extending outward from the support base, the extended portion having a first main surface and a second main surface opposite to the first main surface;a plurality of lead-out wires disposed on the first main surface of the extended portion so as to be in electrical conduction with the electrode parts;at least one grounding wire disposed on the first main surface of the extended portion, the grounding wire extending alongside the lead-out wires; anda reinforcement plate disposed on the second main surface of the extended portion, the reinforcement plate extending from an outer edge portion of the extended portion toward the support base so as to form an inner edge thereof without reaching the support base, a width of the grounding wire is greater than a width of the lead-out wires,', 'an inner edge contour formed by the inner edge of the reinforcement plate forms a non-straight line, and', 'a tip portion of the inner edge contour closest to the support base is disposed at a ...

Подробнее
Номер записи: 68
06-08-2020 дата публикации

HIGH SPEED SERIAL LINK INTRA PAIR SKEW CORRECTION

Номер: US20200253036A1
Автор: CHANDRA Umesh, Liao Chun-Lin, MUTNURY BHYRAV M.
Принадлежит:

A differential trace pair system includes a board including a board structure having a first, a second, a third, and a fourth board structure member, wherein a distance between the first and the third board structure members is longer than a distance between the second and the fourth board structure members. The differential trace pair system further includes a differential trace pair that includes a first differential trace extending between the first and the third board structure members and a second differential trace extending between the second and the fourth board structure members. The second differential trace having a serpentine structure that includes a first portion that continuously transitions away from the first differential trace and a second portion that is contiguous with the first portion, the second portion continuously transitions towards the first differential trace. 1. A differential trace pair system , comprising:a board including a board structure having a first board structure member, a second board structure member, a third board structure member, and a fourth board structure member, wherein a distance between the first board structure member and the third board structure member is longer than a distance between the second board structure member and the fourth board structure member; and a first differential trace extending between the first board structure member and the third board structure member;', 'a second differential trace extending between the second board structure member and the fourth board structure member, the second differential trace having a serpentine structure that includes:', 'a first portion of the second differential trace that transitions away from the first differential trace; and', 'a second portion of the second differential trace that is contiguous with the first portion of the second differential trace, the second portion of the second differential trace transitions towards the first differential trace., 'a ...

Подробнее
Номер записи: 69
06-08-2020 дата публикации

Component Carrier With Electrically Reliable Bridge With Sufficiently Thick Vertical Thickness in Through Hole of Thin Dielectric

Номер: US20200253053A1
Автор: Chung Valerian Yun Khim, Dou Alex Yucun, Ismail Ismadi Bin, Tay Seok Kim
Принадлежит:

A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 μm and a narrowest vertical thickness of the bridge structure is at least 20 μm. 1. A component carrier , comprising:an electrically insulating layer structure having a first main surface and a second main surface;a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface;an electrically conductive bridge structure connecting opposing sidewalls of the electrically insulating layer structure delimiting the through hole;wherein a vertical thickness of the electrically insulating layer structure is not more than 200 μm and a narrowest vertical thickness of the bridge structure is at least 20 μm.2. The component carrier according to claim 1 , further comprising:a first electrically conductive layer structure on the first main surface; anda second electrically conductive layer structure on the second main surface.3. The component carrier according to claim 1 , comprising at least one of the following features:wherein the vertical thickness of the electrically insulating layer structure is not more than 140 μm, in particular not more than 110 μm, more particularly is in a range between 40 μm and 60 μm;wherein the narrowest vertical thickness of the bridge structure is at least 25 μm;wherein the narrowest vertical thickness of the bridge structure is not more than 40 μm;wherein a narrowest horizontal width of the through hole is not more than 100 μm, in particular not more than 75 μm;wherein a ...

Подробнее
Номер записи: 70
21-09-2017 дата публикации

HIGH-FREQUENCY SIGNAL LINE, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE

Номер: US20170273178A1
Автор: KATO Noboru
Принадлежит:

A high-frequency signal line includes a laminate of a plurality of insulator layers, a signal line provided on a first principal surface of one of the insulator layers, a first ground conductor provided on a second principal surface of the insulator layer provided with the signal line, the first ground conductor including openings that overlap with the signal conductor, and a second ground conductor provided in or on the laminate so as to be opposed to the first ground conductor with the signal conductor positioned therebetween.

Подробнее
Номер записи: 71
13-08-2020 дата публикации

Printed circuit board

Номер: US20200260580A1
Автор: Gyu-Mook KIM, Hea-Sung KIM, Sang-Hoon Kim, Yoong Oh, Young-Kuk KO
Принадлежит: Samsung Electro Mechanics Co Ltd

A printed circuit board includes: an insulating layer; a via passing through the insulating layer; and a metal post in contact with a surface of the via, and protruding from the insulating layer. The metal post includes a region having a width that is greater than a width of the via.

Подробнее
Номер записи: 72
11-11-2021 дата публикации

FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS

Номер: US20210352807A1
Автор: Aygun Kemal, Li Eric, Ouyang Gong, Xiao Kai, Zhang Zhichao
Принадлежит: Intel Corporation

Fine feature formation techniques for printed circuit boards are described. In one embodiment, for example, a method may comprise fabricating a conductive structure on a low density interconnect (LDI) printed circuit board (PCB) according to an LDI fabrication process and forming one or more fine conductive features on the LDI PCB by performing a fine feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fine gap region within the conductive structure. Other embodiments are described and claimed. 1. An apparatus , comprising:a low density interconnect (LDI) printed circuit board (PCB); andone or more fine conductive features disposed on the LDI PCB formed from a conductive feature, wherein the conductive feature comprising a fine gap region devoid of conductive material.2. The apparatus of claim 1 , wherein the LDI PCB comprises a minimum trace width of approximately 100 μm and a minimum trace spacing of 100 μm and wherein the fine gap region comprises a width of less than 100 μm.3. The apparatus of claim 2 , wherein the fine gap region comprises a width of less than 50 μm.4. The apparatus of claim 2 , wherein the fine gap region comprises a width of less than 30 μm.5. The apparatus of claim 2 , the one or more fine conductive features to comprise an inductor coil.6. The apparatus of claim 5 , the inductor coil a multi-turn inductor coil.7. The apparatus of claim 6 , the inductor coil comprising a winding trace portion winding around a central portion at least twice.8. The apparatus of claim 7 , wherein the width of the winding trace portion is less than 100 μm claim 7 , the distance between the central portion and an inner winding of the winding trace portion is less than 100 μm claim 7 , and the distance between the inner winding of the winding trace portion and an outer winding of the winding trace portion is less than 100 μm.9. An apparatus claim 7 , comprising:a low ...

Подробнее
Номер записи: 73
06-10-2016 дата публикации

Detection device and display device with detection function

Номер: US20160291723A1
Автор: Hayato Kurasawa, Keisuke Asada, Koji Ishizaki, Tatsuya Ide
Принадлежит: Japan Display Inc

[Problem] To prevent detachment of overcoat layer which covers at least a part of a terminal formed on a substrate. [Measure to solve the problem] According to one embodiment, a detection device includes a substrate, detection electrode, terminal formed of a metal material, lead, coating layer, conductive adhesion layer, and circuit board. The lead connects the electrode and the terminal. The coating layer covers the electrode and the lead, and partly covers the terminal. The adhesion layer covers a part of the terminal exposed from the coating layer and covers a part of the coating layer. The circuit board is connected to the terminal with the adhesion layer interposed therebetween. At least in an overlapping area where the conductive adhesion layer covers the coating layer, the metal material that forms the terminal includes a shape that the metal material is partly removed.

Подробнее
Номер записи: 74
05-09-2019 дата публикации

CIRCUIT BOARD PAD MOUNTING ORIENTATION SYSTEM

Номер: US20190274213A1
Автор: CHANDRA Umesh, Liao Chun-Lin, MUTNURY BHYRAV M.
Принадлежит:

A circuit board pad mounting orientation system includes a board. A signal transmission line is included on the board. A plurality of connector pads are positioned on the board. At least one connector pad receives the signal transmission line adjacent a first end of that connector pad. At least one connector pad includes a second end that provides a reduction in a width of that connector pad to indicate a mounting orientation for coupling to the connector pad that receives the signal transmission line. In a specific example, a first connector pad receives the signal transmission line, includes the first end, and includes the second end that is opposite the first connector pad from the first end and that provides the reduction in the width of the first connector pad to indicate the mounting orientation for coupling to the first connector pad. 1. A circuit board pad mounting orientation system , comprising:a board;a signal transmission line included on the board; at least one connector pad that receives the signal transmission line adjacent a first end of that connector pad; and', 'at least one connector pad that includes a second end that provides a reduction in a width of that connector pad to indicate a mounting orientation for coupling to the connector pad that receives the signal transmission line; and, 'a plurality of connector pads that are positioned on the board and that includeone of an orientation-dependent connector or a cable mounted to the at least one connector pad that receives the signal transmission line, wherein the one of the orientation-dependent connector or the cable is oriented according to the mounting orientation indicated by the second end.2. The system of claim 1 , wherein a first connector pad receives the signal transmission line and includes the first end claim 1 , and wherein that first connector pad includes the second end that is opposite the first connector pad from the first end and that provides the reduction in the width of the ...

Подробнее
Номер записи: 75
04-10-2018 дата публикации

CONNECTION STRUCTURE BETWEEN OPTICAL DEVICE AND CIRCUIT SUBSTRATE, AND OPTICAL TRANSMISSION APPARATUS USING THE SAME

Номер: US20180288874A1
Автор: KATAOKA Toshio, Katou Kei
Принадлежит:

An optical device includes a connection pad, which is connected to a conductor pattern on the circuit substrate, at one edge. The connection pad includes one ground pad, and two or more signal pads between which the ground pad is interposed from its both sides. The ground pad includes a concave portion including an opening at the edge. The circuit substrate is provided with a metal columnar member in the conductor pattern to which the ground pad is connected. The conductor pattern and the connection pad are fixed to each other with solder in a state in which the columnar member is fitted into the concave portion. Solder, which gradually rises from the ground pattern to a lateral surface of the columnar member, is formed between the columnar member and the ground pattern that is formed in the flexible printed circuit. 1. A connection structure between an optical device and a circuit substrate ,wherein the optical device includes a flexible printed circuit including a conductive pattern to which an electrode configured to input a radio-frequency signal to the optical device is connected,in the flexible printed circuit,connection pads, which are connected to a conductor pattern on the circuit substrate, are arranged at one edge,the connection pads include at least one ground pad, and at least two signal pads between which the ground pad is interposed from its both sides, andat least one concave portion including an opening formed in the one edge is provided at a portion, at which the ground pad is formed, in the one edge of the flexible printed circuit, andin the circuit substrate,the conductive pattern, to which the ground pad is connected, on a surface of the circuit substrate, is provided with a columnar member that extends from the conductor pattern to an upper side of a substrate surface of the circuit substrate and is formed from a metal,the conductor pattern and the connection pads are fixed to each other with solder in a state in which the columnar member is ...

Подробнее
Номер записи: 76
13-10-2016 дата публикации

Printed circuit board and manufacturing method thereof

Номер: US20160302301A1
Автор: Dae Hyun Park, Han Kim
Принадлежит: Samsung Electro Mechanics Co Ltd

A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes a base, a wiring structure disposed on at least one of a surface and an interior of the base, and a plurality of stitching vias penetrating through the base in a thickness direction along an edge of the base and having side surfaces exposed externally.

Подробнее
Номер записи: 77
26-09-2019 дата публикации

DIFFERENTIAL TRACE PAIR SYSTEM

Номер: US20190297721A1
Автор: CHANDRA Umesh, MUTNURY BHYRAV M.
Принадлежит:

A differential trace pair system includes a first conductive layer that is located immediately adjacent a first insulating layer. The system includes a second conductive layer that is located immediately adjacent the first insulating layer and opposite the first insulating layer from the first conductive layer, and includes an aperture that extends through the second conductive layer. A second insulating layer is located immediately adjacent the second conductive layer and opposite the second conductive layer from the first insulating layer. The system includes a first differential trace pair that is included in the second insulating layer and that includes a first differential trace that is positioned adjacent the aperture and references the second conductive layer, and a second differential trace that is longer than the first differential trace and that includes a first portion that is positioned adjacent the second conductive layer aperture and references the first conductive layer. 1. A differential trace pair system , comprising:a first conductive layer that is included in a board;a second conductive layer that is included in the board and spaced apart from the first conductive layer, wherein the second conductive layer defines a second conductive layer opening that extends through the second conductive layer; and a first differential trace that is configured to reference to the second conductive layer; and', 'a second differential trace that includes a first portion that is configured to reference to the first conductive layer through the second conductive layer opening., 'a differential trace pair that is included in the board and spaced apart from the second conductive layer opposite the second conductive layer from the first conductive layer, wherein differential trace pair includes2. The printed circuit board of claim 1 , wherein the referencing to the first conductive layer increases a propagation speed of a first signal transmitted through the first ...

Подробнее
Номер записи: 78
03-10-2019 дата публикации

CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORATING THE SAME

Номер: US20190306976A1
Автор: Dai Qi, Garner Richard, JR. Earl Alfred, Picard, Venk Sridharan
Принадлежит: OSRAM SYLVANIA INC.

A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided. 1. A conductor pad comprising:a first contact region;a second contact region; and a first convex segment;', 'a second convex segment; and', 'a first non-convex segment disposed between the first convex segment and the second convex segment., 'a body portion configured to establish a conductive path between the first contact region and the second contact region, wherein the first contact region and the second contact region are intersected by a horizontal axis of the conductor pad, or are vertically spaced from each other relative to the horizontal axis, the body portion comprising conductive material having a perimeter edge, the perimeter edge comprising on each side of the horizontal axis2. The conductor pad of claim 1 , wherein the first non-convex segment is a concave segment.3. The conductor pad of claim 1 , wherein the first convex segment has a first convex segment outermost edge at a distance Hfrom the horizontal axis claim 1 , and wherein the second convex segment defines an outermost edge of the perimeter edge at a distance Hfrom the horizontal axis claim 1 , wherein the distance His greater than the distance H.4. The conductor pad of claim 1 , wherein the first contact region and the first convex segment are at a proximal end of the conductor pad and the first convex segment extends in a direction away from the first contact region at an angle θ claim 1 ...

Подробнее
Номер записи: 79
01-11-2018 дата публикации

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE

Номер: US20180316080A1
Автор: BABA Takahiro, YOSUI Kuniaki
Принадлежит:

A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section. The signal line is wider in the second section than in the first section. 1. A high-frequency signal transmission line comprising:an element;a linear signal line provided at the element and including a first end and a second end;andat least one ground conductor provided at the element and extending along the signal line; whereinthe element includes stacked insulating layers;the ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween;the ground conductor includes a plurality of openings arranged along the signal line;the signal line, the ground conductor, and the element generate a characteristic impedance;the signal line includes a first section and a second section, the first section being an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end, the second section generating a characteristic impedance less than the first ...

Подробнее
Номер записи: 80
08-12-2016 дата публикации

Flexible Printed Circuit and Detecting Device, Detecting Method and Display Device Thereof

Номер: US20160356840A1
Автор: LEI Jin, Pengjun Fang, Ping Chen, Xingguang JIN, Yimin Wang
Принадлежит: BOE Technology Group Co Ltd, Hefei BOE Optoelectronics Technology Co Ltd

Disclosed are a flexible printed circuit and a detecting device, a detecting method and a display device thereof. The flexible printed circuit comprises a body and an interface structure that is connected with the body, wherein the interface structure is provided with a plurality of mark lines dividing the interface structure into a plurality of interfaces with the same structure. When a front end interface of the flexible printed circuit of the disclosure is damaged, the front end interface can be removed along the mark line, and then an exposed rear end interface can be used successively, thus preventing a situation where the flexible printed circuit cannot be used because the only interface is damaged, thereby extending the life span of the flexible printed circuit, reducing productivity loss due to frequent replacements of the flexible printed circuit and reducing production cost.

Подробнее
Номер записи: 81
14-12-2017 дата публикации

Electrical contact pad for electrically contacting a connector

Номер: US20170358881A1
Автор: Graham Harry Smith, Jr., Michael Frank Cina, Scott Eric Walton
Принадлежит: TE Connectivity Corp

An electrical contact pad for electrically contacting a connector includes first, second and third regions. The first region is connected to a trace. The second region is adjacent to the first region and has a width less than the first region. The third region is adjacent to the second region and has a width that is greater than the second region. The third region is sized to make contact with a connector. Having the width of the second region be smaller than the width of the first and third regions increases an impedance of the electrical contact pad.

Подробнее
Номер записи: 82
29-10-2020 дата публикации

WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF

Номер: US20200344888A1
Автор: Kawamura Yoshihiro, Shibata Shusaku, TAKAKURA Hayato, Takano Takahiro, WAKAKI Shuichi
Принадлежит: NITTO DENKO CORPORATION

An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y and length S satisfy 0 Подробнее

Номер записи: 83
14-12-2017 дата публикации

ELECTRICAL CONDUCTORS

Номер: US20170359894A1
Автор: Bonifas Andrew P., GABRIEL Nicholas T., Gorrell Robin E., II Alejandro Aldrin A., Jennings Robert M., Jesme Ronald D., Narag, OUDERKIRK Andrew J., Palaniswamy Ravi
Принадлежит:

Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates. 13-. (canceled)4. An elongated undulating conductor centered on an axis along a length of the conductor and defining a plane of the conductor , the conductor having a width along a direction parallel to the plane of the conductor , such that along the length of the conductor:the axis has a continuous radius of curvature; andat a plurality of spaced apart first locations the axis has a local minimum radius of curvature and the conductor has a local maximum width.5. The conductor of claim 4 , wherein the local maximum width at each first location is greater than the width of the conductor at any other location that is not a first location.6. The conductor of claim 4 , wherein a magnitude of a second derivative of the axis with respect to a reference line claim 4 , the reference line being parallel to an elongation direction of the conductor claim 4 , is continuous along the length of the conductor.710-. (canceled)11. A conductor assembly comprising:a flexible stretchable substrate stretchable along a first direction up to 1.5 times an original unstretched dimension of the substrate without tearing; anda conductor disposed on the substrate and generally extending along the first direction, the conductor centered on an axis along a length of the conductor, such that for a plurality of alternating first and second locations along the axis the conductor is wider at each first location than at each second location.12. The conductor assembly of claim 11 , wherein the axis has a smaller radius of curvature at each first location than at each second location.13. An electrically continuous conductor elongated along a length of the conductor claim 11 , the conductor having a varying thickness and a varying radius of curvature along the length of the conductor claim 11 ...

Подробнее
Номер записи: 84
22-12-2016 дата публикации

Transmission line member and electronic apparatus

Номер: US20160372811A1
Автор: Kosuke Nishino, Kuniaki Yosui, Takahiro Baba
Принадлежит: Murata Manufacturing Co Ltd

A transmission line member includes a dielectric base body. At an intermediate point in a thickness direction of the dielectric base body, first and second signal conductors are disposed. A reference ground conductor is disposed at one side of the first and second signal conductors in the thickness direction, and an auxiliary ground conductor is disposed at the other side. At intermediate points of the first signal conductor, a coil conductor and a capacitor-defining plate conductor are disposed. The capacitor-defining plate conductor faces the reference ground conductor and the auxiliary ground conductor to connect a low pass filter and the first transmission line. A coil conductor is disposed between the second signal conductor and the reference ground conductor, and connected to the second signal conductor and the reference ground conductor to connect a high pass filter and the second transmission line.

Подробнее
Номер записи: 85
20-12-2018 дата публикации

High-speed printed circuit board and differential wiring method thereof

Номер: US20180368260A1
Автор: Bei Chen, Hong Fan, Hongfei Wang
Принадлежит: Guangzhou Fastprint Circuit Technology Co Ltd, Shenzen Fastprint Circuit Tech Co Ltd, Yixing Silicon Valley Electronic Technology Co Ltd

Provided is a differential wiring method for a high-speed printed circuit board, including the following steps: setting a pre-set impedance required value Z2 of a non-ball grid array (BGA) region, determining the width w2 of the second differential wire (210) and the distance d2 between the two second differential wires (210) according to the pre-set impedance required value Z2; calculating the width w1 of the first differential wire (110) and the distance d1 between the two first differential wires (110), according to the distance s1 between two adjacent rows of bonding pads in a BGA region bonding pad array and the minimum processable distance s2 between the bonding pad and the first differential wire (110), where w1 and d1 should satisfy 2w1+d1≤s1−2s2, while further calculating w1 and d1 according to a differential characteristic impedance formula; arranging the two first differential wires (110) disposed oppositely to each other in the BGA region according to the determined d1, and arranging the two second differential wires (210) disposed oppositely to each other in the non-BGA region according to the determined d2; connecting the first differential wire (110) and the second differential wire (210) corresponding thereto via a first connection wire (310); and connecting the first differential wire (110) and the bonding pad (120) corresponding thereto via a second connection wire (320).

Подробнее
Номер записи: 86
19-12-2019 дата публикации

Flexible printed circuit board

Номер: US20190387614A1
Автор: CUI Lin, Liao Chuanwu, Wang Hao, ZHANG Shun, Zhang Wenchen
Принадлежит:

A flexible printed circuit board is disclosed, which includes a pad portion, wherein the pad portion includes a pair of first signal pads formed in a first conductor layer and respectively connected with a pair of signal wires, a pair of second signal pads formed in a second conductor layer and electrically separated from a grounding layer; a pair of first grounding pads formed in the first conductor layer and electrically separated from the pair of signal wires, wherein: the pair of first signal pads is sandwiched between the pair of first grounding pads, and a pair of second grounding pads formed in the second conductor layer and connected with the grounding layer, wherein the pair of second signal pads are sandwiched between the pair of second grounding pads. A width of the first and the second signal pads is larger than that of the signal wires. 1. A flexible printed circuit board having a first conductor layer , a second conductor layer and a dielectric layer sandwiched between the first conductor layer and the second conductor layer , wherein the flexible printed circuit board comprises:a pad portion for electrically connecting with a circuit substrate, anda wire portion for forming a transfer circuit which is connected with the circuit substrate through he pad portion, wherein the transfer circuit comprises two signal wires formed in the first conductor layer and a grounding layer formed in the second conductor layer, wherein: a pair of first signal pads spaced from and adjacent to each other both of which are formed in the first conductor layer and respectively connected with the two signal wires,', 'a pair of second signal pads spaced from and adjacent to each other both of which are formed in the second conductor layer and electrically separated from the grounding layer;', 'a pair of first grounding pads both of which are formed in the first conductor layer and electrically separated from the two signal wires, wherein the pair of first signal pads are ...

Подробнее
Номер записи: 87
24-12-2020 дата публикации

PRINTED CIRCUIT BOARD HAVING A DIFFERENTIAL PAIR ROUTING TOPOLOGY WITH NEGATIVE PLANE ROUTING AND IMPEDANCE CORRECTION STRUCTURES

Номер: US20200404774A1
Автор: Jayaraj Navneeth, Kachroo Aneesh, V V Mithun Gopal
Принадлежит:

A printed circuit board including a set of five layers encompassing a breakout area is described. The set includes a first ground layer, a first signal layer having a first conductive layer within the breakout area, a second ground layer having conductive material, a second signal layer having a second conductive layer within the breakout area, and a third ground layer. The second ground layer having a void forming a differential pair being two parallel traces, and being separated into a first portion positioned within the breakout area and a second portion outside of the breakout area. The differential pair having a first width and a first spacing within the breakout area and a second width and second spacing outside of the breakout area, with the second width greater than the first width. The first and second conductive layers forming a first ground plane and a second ground plane. 1. A printed circuit board , comprising: a first ground layer;', 'a first signal layer having a first conductive layer within the breakout area;', 'a second ground layer having conductive material;', 'a second signal layer having a second conductive layer within the breakout area; and', 'a third ground layer; and, 'a set of five layers encompassing a breakout area having a plurality of spatially disposed vias arranged in a grid pattern with a routing lane positioned between an adjacent pairs of vias, and within the breakout area, the routing lane being a contiguous space on one or more of the five layers, the five layers comprisingthe second ground layer having a void forming a differential pair, the void being an absence of conductive material, the differential pair being two parallel traces, and being separated into a first portion positioned within the routing lane of the breakout area and a second portion within a negative plane routing region outside of the breakout area, the differential pair having a first width and a first spacing within the breakout area and a second width and ...

Подробнее
Номер записи: 88
10-02-2010 дата публикации

印刷布线板和印刷电路板

Номер: CN101646300A
Автор: 林靖二
Принадлежит: Canon Inc

本发明公开一种印刷布线板和印刷电路板。在多层印刷布线板中，连接第一电源布线和第二电源布线的多个通路孔平行于电流沿其流动的方向而排成行。为了防止电流集中在通路孔之中的与电源布线的最端部连接的通路孔上，通路孔和通路孔之间的狭窄部分被窄化以增大电阻。在第二导体层的电源布线的最端部处类似地设置被窄化的狭窄部分。

Подробнее
Номер записи: 89
04-02-2003 дата публикации

Memory module with parallel stub traces

Номер: US6515555B2
Автор: James A. McCall, Michael W. Leddige
Принадлежит: Intel Corp

A printed circuit board is described. That printed circuit board includes a capacitive load that is coupled to a signal trace. The signal trace has a first section and a second section. The first section is positioned between the capacitive load and the second section. The second section has a first width, and the first section includes first and second lines that each have a width that is smaller than the first width.

Подробнее
Номер записи: 90
04-07-2012 дата публикации

柔性基板、具备其的电光装置以及电子设备

Номер: CN101160020B
Автор: 宫下智明, 平林秀和
Принадлежит: Seiko Epson Corp

本发明提供柔性基板、具备其的电光装置以及电子设备。在柔性基板中防止可能发生于其相对于连接器倾斜插入时的相邻的端子部间的短路。柔性基板(200)，与具有多个连接端子(320，321)的连接器(300)连接；具备：延伸于柔性基板的长度方向的基板主体(210)；配置于基板主体上而延伸于长度方向的多条布线(220)；及在基板主体的前端侧与多条布线分别电连接，对应于多个连接端子沿相交于长度方向的宽度方向排列的多个端子部(230)。还具备分别连接于多个端子部中的与连接于多条布线的部分不相同的部分，延伸至该柔性基板的边缘(200e1)并具有比布线的宽度(W1)窄的宽度(W2)的镀敷用引线(240)。

Подробнее
Номер записи: 91
02-02-2015 дата публикации

Connection structure between printed circuit board and electronic component

Номер: KR101488996B1
Автор: 야스토 이시마루, 히로후미 에베
Принадлежит: 닛토덴코 가부시키가이샤

각 배선 패턴은 도체층 및 주석 도금층으로 이루어지고, 선단부, 접속부 및 신호 전송부를 포함한다. 선단부의 폭과 신호 전송부의 폭은 서로 같고, 접속부의 폭은 선단부 및 신호 전송부의 폭보다 작다. 전자 부품의 실장시에는, 각 배선 패턴의 접속부와 전자 부품의 각 범프가 열융착에 의해서 접속된다. 거리 A1, A2는 0.5㎛ 이상으로 설정된다. 거리 B1, B2는 20㎛ 이상으로 설정된다. 주석 도금층의 두께는 0.07㎛ 이상 0.25㎛ 이하로 설정된다. Each wiring pattern is composed of a conductor layer and a tin plating layer, and includes a front end portion, a connection portion, and a signal transmission portion. The width of the tip portion and the width of the signal transmission portion are equal to each other and the width of the connection portion is smaller than the width of the tip portion and the signal transmission portion. When mounting electronic components, the connection portions of the wiring patterns and the bumps of the electronic components are connected by heat fusion. The distances A1 and A2 are set to 0.5 mu m or more. The distances B1 and B2 are set to 20 mu m or more. The thickness of the tin plating layer is set to 0.07 μm or more and 0.25 μm or less.

Подробнее
Номер записи: 92
16-03-2016 дата публикации

覆晶薄膜柔性电路板及显示装置

Номер: CN103269563B
Автор: 孙莲, 李扬, 汪敏, 程亮, 聂春扬, 黄阳, 齐鹏, 龚小卫
Принадлежит: BOE Technology Group Co Ltd, Hefei BOE Optoelectronics Technology Co Ltd

本发明涉及显示技术领域，具体涉及一种覆晶薄膜柔性电路板及应用该覆晶薄膜柔性电路板的显示装置。该覆晶薄膜柔性电路板包括基底以及平行间隔设置在基底上的多个导电端子，每个导电端子均包括宽线以及窄线，覆晶薄膜柔性电路板上方设置有异方性导电胶区域；宽线与窄线的结合部位位于异方性导电胶区域与基底交叠的区域中。本发明通过将易发生断裂的宽线与窄线结合部位设置在异方性导电胶区域与基底交叠的区域中，从而使防断裂能力较强的宽线承受弯折，减少了断裂发生的几率；通过将防断裂能力更强的导电端子交合区域设置在异方性导电胶区域与基底交叠的区域中，使其承受部分弯折，减少了断裂发生的几率；因此，本发明能够大幅度降低电路断路不良。

Подробнее
Номер записи: 93
01-09-2006 дата публикации

Tape package preventing a crack defect in lead bonding process

Номер: KR100618898B1
Автор: 강사윤, 정예정
Принадлежит: 삼성전자주식회사

리드 본딩시 크랙을 방지하는 테이프 패키지에 관해 개시한다. 이를 위해 본 발명은 크랙이 발생되는 영역에 형성된 확장된 리드 폭을 갖는 배선결함 방지수단을 갖는 테이프 패키지를 제공한다. Disclosed is a tape package that prevents cracks in lead bonding. To this end, the present invention provides a tape package having a wiring defect preventing means having an extended lead width formed in an area where a crack is generated. CoF 패키지, 크랙, 리드 폭 확장. CoF package, cracks, lead width extension.

Подробнее
Номер записи: 94
01-07-2014 дата публикации

고밀도 및 저밀도 기판 영역을 구비한 하이브리드 기판 및 그 제조방법

Номер: KR20140081193A
Автор: 최진원
Принадлежит: 삼성전기주식회사

본 발명은 고밀도 및 저밀도 기판 영역을 구비한 하이브리드 기판 및 그 제조방법에 관한 것이다. 본 발명의 하나의 실시예에 따라, 중간 영역에 캐비티가 형성되고 캐비티 주위에 패턴 밀집도가 낮은 저밀도 영역으로 이루어진 저밀도 기판층; 저밀도 기판층의 캐비티에 내장되고 저밀도 영역보다 패턴 밀집도가 높은 고밀도 영역으로 이루어진 고밀도 기판층; 고밀도 기판층 및 저밀도 기판층의 상부, 하부 또는 상하부에 형성된 적층영역으로 이루어진 절연 지지층; 절연 지지층의 적층영역을 관통하고 고밀도 기판층 및 저밀도 기판층의 패턴과 연결되는 절연층 비아들; 및 절연층 비아들과 연결되는 회로 패턴들을 포함하고 절연 지지층의 적층영역 상에 형성된 외곽 패턴층; 을 포함하는 고밀도 및 저밀도 기판 영역을 구비한 하이브리드 기판이 제안된다. 또한, 그 제조방법이 제안된다.

Подробнее
Номер записи: 95
13-08-2021 дата публикации

具有共同化接地板的印刷电路板

Номер: CN110915314B
Автор: 乔纳森·E·巴克
Принадлежит: Samtec Inc

一种电连接器，包括基板以及接地耦合组件。该基板包括在基板的第一表面和第二表面处的多个接地迹线，该接地耦合组件在第一表面和第二表面均耦合接地迹线对，并且还将第一表面处的接地迹线耦合到第二表面处的接地迹线。

Подробнее
Номер записи: 96
22-04-2014 дата публикации

플렉시블 기판 및 이를 구비한 전기 광학 장치, 그리고전자 기기

Номер: KR101387837B1
Автор: 도모아키 미야시타, 히데카즈 히라바야시
Принадлежит: 세이코 엡슨 가부시키가이샤

과제 플렉시블 기판에 있어서, 커넥터에 대하여 경사 삽입된 경우에 발생할 수 있는, 서로 인접하는 단자부 사이의 단락을 방지한다. 해결 수단 플렉시블 기판 (200) 은 복수의 접속 단자 (320, 321) 를 갖는 커넥터 (300) 와 접속되는 플렉시블 기판으로서, 플렉시블 기판의 길이 방향으로 연장되는 기판 본체 (210) 와, 기판 본체 상에 배치되어 있으며 길이 방향으로 연장되는 복수의 배선 (220) 과, 기판 본체의 선단측에서 복수의 배선과 전기적으로 각각 접속되어 있으며 복수의 접속 단자에 대응하여 길이 방향과 교차되는 폭 방향을 따라 배열된 복수의 단자부 (230) 를 구비한다. 또한, 복수의 단자부에 있어서의 복수의 배선에 접속되는 부분과는 상이한 부분에 각각 접속되어 있으며 당해 플렉시블 기판의 가장자리 (200e1) 까지 연장됨과 함께 배선의 폭 (W1) 보다 좁은 폭 (W2) 을 갖는 도금용 리드선 (240) 을 구비한다. 플렉시블 기판, 액정 장치, 광학 장치, 액정 프로젝터

Подробнее
Номер записи: 97
01-06-1999 дата публикации

Fine pitch solder deposits on printed circuit board process and product

Номер: KR100188625B1
Автор: 그랜트 훼버너 칼, 맥스 후바쳐 에릭, 피터 파트릿지 쥴리앙
Принадлежит: 인터내셔널 비지네스 머신즈 코포레이션, 포만 제프리 엘

본 발명은 구성들의 리플로우 접속에 적합한 저융점 땜납을 인쇄 회로 기판의 선택된 접점상에 형성하는 방법 및 그로 인해 생성된 제품에 관한 것이다. 본 발명의 방법은 플립 칩 장치를 포함하는 미세 피치 장치를 가지고 있고 통상적인 거친 피치 표면 장착된 구성들을 포함하는 기판상에 접속된 보편화된 인쇄 회로 기판의 제조에 특히 적합하다. 기판의 미세 피치 접점은 땜납 리플로우 온도를 견딜 수 있는 능력, 땜납에 의해 적셔지지 않는 성질 및 인쇄 회로 기판에 상대적으로 어울리는 열팽창 계수를 가지는 것을 특징으로 하는 스텐실에 있는 구멍을 통해 노출된다. 저온 땜납 페이스트는 스텐실 개구내로 스크린 피착된다. 기판상에 고정적으로 피착된 스텐실을 가지고, 스텐실 패턴에 의해 보유된 땜납 페이스트를 리플로우시켜 하부에 놓인 인쇄 회로 기판의 접점을 선택적으로 형성한다. 그 후에, 본 발명의 바람직한 실행방법에 따라, 스텐실을 기판으로부터 제거하고 미세 및 거친 피치 구성 배치를 제조하는데 있어서 이미 실행된 플럭스와 페이스트의 피착이 이루어지게 하고 이어서 땜납 리플로우시킨다. 본 발명의 또다른 실행으로는 미세 피치 땜납과 거친 피치 땜납이 동시에 피착되게 하고 미세 피치 땜납 리플로우 결과 생기는 스텐실을 보유하는 것이다.

Подробнее
Номер записи: 98
14-09-2011 дата публикации

Connection structure between printed circuit board and electronic component

Номер: CN101339935B
Автор: 江部宏史, 石丸康人
Принадлежит: Nitto Denko Corp

本发明提供一种配线电路基板与电子部件的连接结构，各配线图案由导体层和锡镀层构成，包括前端部、连接部和信号传送部。前端部的宽度和信号传送部的宽度相互等同，连接部的宽度小于前端部和信号传送部的宽度。在电子部件的安装时，通过热熔融连接各配线图案的连接部和电子部件的各隆起焊盘。距离(A1、A2)设定为0.5μm以上。距离(B1、B2)设定为20μm以上。锡镀层的厚度设定为0.07μm以上0.25μm以下。

Подробнее
Номер записи: 99
15-09-2020 дата публикации

LED lamp strip and manufacturing method thereof

Номер: CN107637181B
Автор: A·J·弗鲁格普, J·H·A·哈格拉尔
Принадлежит: Signify Holding BV

本发明提供了一种发光二极管LED灯带，其被布置用于提供在其长度上的改进的颜色一致性。LED灯带包括LED串，LED串沿着LED灯带的长度定位并且被并联供电，以用于发射例如红色、绿色、蓝色和白色的光。供应和返回迹线的电阻结合不同颜色的LED串中使用的各种LED和电阻器所汲取的电流或正向电压的变化，引起沿着这些迹线的电压降，从而导致不一致的显色。通过调整迹线的电阻率，诸如通过为不同颜色的LED串提供具有不同电阻的返回路径，可以改进显色的一致性。

Подробнее
Номер записи: 100