Circuit board

The circuit board includes a base board and a pad array mounted on the base board. The pad array includes a plurality of spaced first pads, two second pads, and two third pads. The first pads, the second pads, and the third pads are all parallel to each other. The third pads are between the first pads and the second pads. The first pads electronically and physically connect to an electric element. The second pads and third pads physically connect to the electric element.

Printed circuit board

A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power source plane. Thus, a common mode noise arising from between the power source and the ground is caused to flow into the plane conductor. This reduces the common mode noise flowing in the ground and the power source of the printed wiring board, which relatively act as antennas.

Sensor, keyboard and method for manufacturing sensor

A sensor includes a first printed wiring board having a first electrode made of a metal film, a second printed wiring board facing the first printed wiring board and having a second electrode made of a metal film, the second electrode being positioned on the second printed wiring board such that the second electrode faces the first electrode of the first printed wiring board, and a dielectric body spacing the first electrode and the second electrode apart such that the first electrode, the second electrode and the dielectric body form a capacitor.

Printed wiring board and method for manufacturing the same

A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.

Display panel

Embodiments may be directed to a display panel includes a base substrate including a display region having a plurality of pixels and a non-display region adjacent to the display region, a connecting line in the non-display region and including at least a first input pad, a second input pad, and an output pad, and an insulating layer on the connecting line. The insulating layer includes at least one first contact hole exposing at least a portion of the first input pad, at least one second contact hole exposing at least a portion of the second input pad, and at least one third contact hole between the first contact hole and the second contact hole. A first contact electrode, a second contact electrode, and a dummy contact electrode are disposed at the first, second and third contact holes, respectively.

Method for connecting printed circuit boards

There is provided a first, connecting printed circuit board (PCB) and a second, receiving PCB and a method for connecting the first and second PCBs. The first PCB has three projections or prongs extending from the main body of the PCB. The second PCB has three holes into which the prongs of the first PCB can be inserted to provide a secure mechanical connection whilst the PCBs are soldered together.

Printed circuit board

A printed circuit board is designed to meet the following requirements. A front-back copper foil residual rate difference a−b falls within a range of −10% to 10%, where the insulative board is divided into a plurality of divisions, in which front and back surface copper foil residual rates of each division are a % and b %, respectively. A difference (a−b)−(c−d) between front-back copper foil residual rate differences of adjacent divisions falls within a range of −10% to 10%, where the front and back surface copper foil residual rates of a division adjacent to the each division are c % and d %, respectively. There are not three or more consecutive divisions for which the difference between the front-back copper foil residual rate differences goes beyond a range of −5% to 5%.

Printed wiring board and method for manufacturing printed wiring board

A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.

WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE

A wiring substrate includes: a wiring structure that includes a wiring layer and an insulating layer laminated; a plurality of first posts that are formed along a periphery of a predetermined area on a surface of the wiring structure, and that protrude out from the surface of the wiring structure; and a second post that is connected to the wiring layer at a position surrounded by the first posts, and that protrudes out from the surface of the wiring structure. The first posts are formed such that a post arranged at a central portion of a side constituting the periphery of the predetermined area is lower in height from the surface of the wiring structure than posts arranged at both ends of the side. 1. A wiring substrate comprising:a wiring structure that includes a wiring layer and an insulating layer laminated;a plurality of first posts that are formed along a periphery of a predetermined area on a surface of the wiring structure, and that protrude out from the surface of the wiring structure; anda second post that is connected to the wiring layer at a position surrounded by the first posts, and that protrudes out from the surface of the wiring structure, whereinthe first posts are formed such that a post arranged at a central portion of a side constituting the periphery of the predetermined area is lower in height from the surface of the wiring structure than posts arranged at both ends of the side.2. The wiring substrate according to claim 1 , further comprisinga solder resist layer that covers the surface of the wiring structure, whereinthe first posts are formed on the solder resist layer.3. The wiring substrate according to claim 1 , whereinthe first posts are formed on the insulating layer exposed to the surface of the wiring structure.4. The wiring substrate according to claim 1 , whereinthe first posts and the second post are made from an identical metal material.5. The wiring substrate according to claim 1 , whereinthe first posts are formed such that ...

DUMMY CORE RESTRICT RESIN PROCESS AND STRUCTURE

A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion. 1. A printed circuit board comprising:a. a rigid printed circuit board portion comprising a laminated stack of a plurality of non-conducting layers and a plurality of conductive layers, wherein the laminated stack further comprises a first portion of an inner core structure; andb. a flexible printed circuit board portion comprising a second portion of the inner core structure, wherein the inner core structure is a continuous structure that extends through both the rigid printed circuit board portion and the flexible printed circuit board portion, further wherein the second portion of the inner core structure comprises inner core circuitry and exposed coverlay material covering the inner core circuitry.2. The printed circuit board of wherein each of the conductive layers is pattern etched.3. The printed circuit board of further comprising one or more plated through hole vias in the rigid printed circuit board portion.4. The printed circuit board of wherein the rigid printed circuit board portion comprises a first rigid printed circuit board portion claim 1 , further wherein the printed circuit board further comprises a second rigid printed circuit board portion comprising a second laminated stack of a plurality of non-conducting layers ...

Method of manufacturing a printed circuit board assembly sheet

A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

DISPLAY DEVICE

A display device is provided. The display device comprises a display panel including a plurality of signal pads and one or more dummy pads, and at least one flexible wiring board providing signals to the signal pads, wherein a maximum bias period of signals provided to a pair of adjacent signal pads with at least one dummy pad interposed therebetween is longer than a maximum bias period of signals provided to a pair of adjacent signal pads with no dummy pad disposed therebetween. 1. A display device comprising:a display panel including first through n-th signal pads and a dummy pad; andat least one flexible wiring board providing signals to the first through n-th signal pads,wherein the dummy pad is disposed between k-th and (k+1)-th signal pads among the n signal pads,wherein a maximum bias period of signals provided to the k-th and (k+1)-th signal pads is longer than a maximum bias period of signals provided to another pair of the signal pads adjacent one another, andwherein n is a natural number greater than 1 and k is a natural number less than n.2. The display device of claim 1 , wherein each of the maximum bias periods is a period in which a difference in voltage between signals provided to a pair of the signal pads adjacent one another is maintained to be greater than a reference value.3. The display device of claim 2 , wherein the reference value is a difference between a high bias voltage and a low bias voltage of a driving chip that generates the signals.4. The display device of claim 2 , wherein the reference value is equal to or greater than a predetermined voltage.5. A display device comprising:a display panel including a plurality of pixels, a plurality of signal input pads connected to a corresponding one of the pixels, and a dummy input pad disposed between a first pair of the signal input pads adjacent one another, wherein the dummy input pad is not connected to any of the pixels; anda flexible wiring board including a plurality of signal output ...

Flexible Circuit Board, Light Bar, Light Source and Display Device

The present disclosure provides a flexible circuit board, a light bar, a light source and a display device. The light source includes a flexible circuit board having at least one effective welding portion and a light bar having at least one effective pad, the at least one effective welding portion being in one-to-one correspondence with the at least one effective pad, and the effective welding portion being fixed to a corresponding effective pad to transmit a signal loaded by itself to the corresponding effective pad. The flexible circuit board further includes at least one auxiliary welding portion, the light bar further includes at least one auxiliary pad that is in one-to-one correspondence with the at least one auxiliary welding portion, and the auxiliary welding portion is fixed to a corresponding auxiliary pad to enhance the firm fixing between the flexible circuit board and the light bar. 1. A flexible circuit board for being fixed to a light bar to provided a signal for the light bar , the flexible circuit board comprising:at least one effective welding portion configured to be fixed to a corresponding effective pad on the light bar and to transmit a signal loaded by itself to the corresponding effective pad; andat least one auxiliary welding portion configured to be fixed to a corresponding auxiliary pad on the light bar to enhance firm fixing between the flexible circuit board and the light bar.2. The flexible circuit board according to claim 1 , further comprising:a circuit body;at least one lead portion leading out of the circuit body; andat least one fixing portion disposed in one-to-one correspondence with the at least one lead portion,wherein each fixing portion is connected to an end of a corresponding lead portion, the effective welding portion and the auxiliary welding portion are both disposed on the at least one fixing portion, and each fixing portion is provided with at least one effective welding portion and at least one auxiliary welding ...

Multilayer wiring base plate and probe card using the same

A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers.

Flexible printed circuit board

A flexible printed circuit board according to an embodiment of the present invention includes an insulative base film; and a conductive pattern provided on at least one surface of the base film and including a wiring line including a bent portion having an angle of greater than or equal to 60° or a branched portion having an angle of greater than or equal to 60° in plan view. The wiring line is provided with a relaxation structure that relaxes stress concentration at the bent portion or the branched portion. The relaxation structure is structured such that the wiring line constitutes a wide wiring line or a dense wiring line group in a region in which a distance from the bent portion or the branched portion is less than or equal to 5 times a minimum width of the wiring line. The wide wiring line has a wiring line width that is greater than or equal to twice the minimum width of the wiring line. A ratio of a wiring line width to a wiring line interval of the dense wiring line group is greater than or equal to 1.5, and a total width of the dense wiring line group is greater than or equal to twice the minimum width of the wiring line.

MULTILAYER WIRING BOARD

A method reduces an area of a mounting electrode provided on a first surface of a multilayer body and connected to a specific component is reduced and decreases a pitch between mounting electrodes. A plating film is formed on the mounting electrodes with the reduced area. The mounting electrodes for connection to specific components are defined by first end surfaces of first via conductors, and hence, the areas of the mounting electrodes are significantly reduced, and the pitch between the mounting electrodes is significantly decreased. Also, the mounting electrodes defined by the first end surfaces of the first via conductors are connected to plane electrodes at end surfaces of second via conductors exposed from a surface of the multilayer body with internal wiring electrodes interposed therebetween. Thus, a plating film is able to be reliably provided on the mounting electrodes. 1. A multilayer wiring substrate comprising:a multilayer body including a laminate of a plurality of insulating layers;a first via conductor provided in the multilayer body, including a first end surface exposed from a first surface of the multilayer body, and defining a mounting electrode for connection with a specific component;a second via conductor provided in the multilayer body, and including first and second end surfaces, at least one of the first and second end surfaces being exposed from a surface of the multilayer body;a plane electrode located on the at least one of the first and second end surfaces of the second via conductor exposed from the surface of the multilayer body; andan internal wiring electrode provided in the multilayer body; whereinthe first via conductor is connected to the second via conductor with the internal wiring electrode interposed therebetween.2. The multilayer wiring substrate according to claim 1 , whereina plurality of mounting electrodes defined by the first end surface of a plurality of first via conductors are provided in a mounting region of the ...

RIGID-FLEXIBLE CIRCUIT INTERCONNECTS

In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB), a second PCB, a spacer, and an electrically conductive solder joint. The first PCB includes a first electrically conductive pad. The second PCB includes a second electrically conductive pad. The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad. 1a first printed circuit board (PCB) including a first electrically conductive pad;a second PCB including a second electrically conductive pad;a spacer configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process; andan electrically conductive solder joint conductively connecting the first electrically conductive pad and the second electrically conductive pad.. A circuit interconnect comprising: This patent application is a Continuation of U.S. patent application Ser. No. 14/289,249, titled RIGID-FLEXIBLE CIRCUIT INTERCONNECTS, filed May 28, 2014, which claims priority to U.S. Provisional Application No. 61/828,312, titled RIGID-FLEXIBLE CIRCUIT INTERCONNECTS, filed May 29, 2013, both applications are incorporated herein by reference in their entirety.The embodiments discussed herein relate to interconnects between printed circuit boards (PCBs). More particularly, embodiments may relate to interconnects between rigid PCBs and flexible PCBs in rigid-flex PCBs with fine-pitch bonding.This Summary introduces a selection of concepts in a simplified form that are ...

FLEXIBLE WIRING BOARD AND DISPLAY DEVICE

A flexible wiring board (a first wiring board) includes: an insulating substrate which is flexible; a first terminal which is conductive and is disposed on the insulating substrate; a second terminal which is conductive and is disposed on the insulating substrate; and a no-connection (NC) terminal which is conductive and is disposed on the insulating substrate between the first terminal and the second terminal. The first terminal, the NC terminal, and the second terminal are arranged at a uniform pitch in an arranging direction that is predetermined, and a width of the NC terminal in the arranging direction is smaller than a width of the first terminal in the arranging direction and a width of the second terminal in the arranging direction. 1. A flexible wiring board , comprising:an insulating substrate which is flexible;a first terminal which is conductive and is disposed on the insulating substrate;a second terminal which is conductive and is disposed on the insulating substrate; anda no-connection (NC) terminal which is conductive and is disposed on the insulating substrate between the first terminal and the second terminal, whereinthe first terminal, the NC terminal, and the second terminal are arranged at a uniform pitch in an arranging direction that is predetermined, anda width of the NC terminal in the arranging direction is smaller than a width of the first terminal in the arranging direction and a width of the second terminal in the arranging direction.2. The flexible wiring board according to claim 1 , whereinthe width of the NC terminal in the arranging direction is less than half the uniform pitch.3. The flexible wiring board according to claim 1 , whereinthe width of the first terminal in the arranging direction and the width of the second terminal in the arranging direction are greater than half the uniform pitch.4. The flexible wiring board according to claim 1 , whereina first voltage is applied to the first terminal,a second voltage that is ...

FLEXIBLE PRINTED CIRCUIT AND DISPLAY DEVICE

A display device includes a first substrate, a flexible printed circuit, and a film. The flexible printed circuit is disposed on a first area of the first substrate. The film is disposed on the first substrate and the flexible printed circuit. The flexible printed circuit includes a second substrate, a pad area, and a dummy pad. The pad area comprises pads disposed on the second substrate. The pads extend in a first direction and are spaced apart from one another in a second direction crossing the first direction. The dummy pad is disposed on the second substrate. The dummy pad is spaced apart from the pad area. 1. A display device comprising:a first substrate;a flexible printed circuit disposed on a first area of the first substrate; anda film disposed on the first substrate and the flexible printed circuit, a second substrate;', 'a pad area comprising pads disposed on the second substrate, the pads extending in a first direction and spaced apart from one another in a second direction crossing the first direction; and', 'a dummy pad disposed on the second substrate, the dummy pad being spaced apart from the pad area., 'wherein the flexible printed circuit comprises2. The display device of claim 1 , wherein:a first air path is formed between the dummy pad and the pad area; andthe first air path is configured to discharge air bubbles disposed between the first substrate and the film to an ambient environment.3. The display device of claim 2 , wherein:a second air path is formed along a boundary of the first area between the dummy pad and the pad area; andthe second air path is configured to discharge air bubbles disposed between the first substrate and the film to an ambient environment.4. The display device of claim 1 , wherein the dummy pad extends in the first direction and is spaced apart from the pad area in the second direction.5. The display device of claim 4 , wherein a gap between the dummy pad and the pad area is greater than or equal to 0.25 millimeters.6. ...

FLEXIBLE PRINTED CIRCUIT FILM AND DISPLAY DEVICE USING THE SAME

A flexible printed circuit film connects a substrate with a printed circuit board. The flexible printed circuit film includes a first area configured to be attached to the substrate; a second area configured to be connected with the printed circuit board; and a third area between the first area and the second area. Each of the first area and the third area has a trapezoid shape with a width that gradually decreases in a direction toward the second area, and the second area has a rectangular shape. 1. A flexible printed circuit film configured to connect a substrate with a printed circuit board , the flexible printed circuit film comprising:a first area configured to be attached to the substrate;a second area configured to be connected with the printed circuit board; anda third area between the first area and the second area,wherein each of the first area and the third area has a trapezoid shape with a width that gradually decreases in a direction toward the second area, and the second area has a rectangular shape.2. The flexible printed circuit film according to claim 1 ,wherein the first area includes first and second sides facing each other and not parallel to each other, and a third side extending between the first and second sides, andwherein a first angle between a line perpendicular to the third side of the first area and the first side of the first area satisfies a range of 5°≦α<45°, where α is the first angle.3. The flexible printed circuit film according to claim 2 ,wherein the third area includes a first side connected with the first side of the first area, andwherein a second angle between a line perpendicular to the third side of the first area and the first side of the third area satisfies a range of 5°<β≦45°, where β is the second angle.4. The flexible printed circuit film according to claim 3 , wherein the second angle is greater than the first angle.5. The flexible printed circuit film according to claim 1 , wherein the first area and the second area ...

Conductor connecting structure and mounting board

A conductor connecting structure includes a mounting board, a target board, and an anisotropic conductive material. The mounting board includes a base material that includes first and second surfaces. The mounting board also includes a conductor layer formed on the first or second surface and a first dummy conductor layer formed at a corner of the second surface. The target board includes a mounting surface, a conductor layer, and a second dummy conductor layer. The anisotropic conductive material includes a polymeric material and electrically conductive particles dispersed in the polymeric material. The electrically conductive particles, when heated, aggregate so as to connect an end portion of the conductor layer of the mounting board and the conductor layer of the target board to each other and connect the first and second dummy conductor layers to each other.

Driving Printed Circuit Board for Display Device and Display Device Having the Same

An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.

CIRCUIT PROTECTION DEVICE AND METHOD OF MANUFACTURING SAME

Provided is a circuit protection device and a method of manufacturing the same including forming a plating lead line and a first coil pattern connected to the plating lead line on a substrate, forming an insulating layer on the first coil pattern and then forming a via hole exposing a portion of the first coil pattern, applying power through a plating lead line to form a via plug filling the via hole from the first coil pattern, and forming a second coil pattern connected to the via plug at an upper portion of the insulating layer. 1. A method of manufacturing a circuit protection device , the method comprising:forming a plating lead line and a first coil pattern connected to the plating lead line on a substrate;forming an insulating layer on the first coil pattern and then forming a via hole exposing a portion of the first coil pattern;applying power through the plating lead line to form a via plug filling the via hole from the first coil pattern; andforming a second coil pattern connected to the via plug on the insulating layer.2. The method of claim 1 , wherein the plating lead line is formed in plurality on the substrate in one direction and in another direction perpendicular to the one direction.3. The method of claim 2 , wherein at least one coil pattern is stacked on the second coil pattern in a vertical direction and the plurality of coil patterns stacked in the vertical direction are arranged in plurality inside a region between the plating lead lines in a horizontal direction.4. The method of claim 3 , wherein the plating lead line is formed so as to overlap a cutting line for cutting the substrate into unit devices.5. The method of claim 4 , wherein the plating lead line is eliminated together with the cutting line when the substrate on which the coil pattern is formed is cut into the unit devices.6. The method of claim 3 , further comprising forming an ESD protection part insulated from the coil pattern of the lowest layer or the uppermost layer under ...

Pin arrangement and electronic assembly

A pin arrangement adapted to a FPC connector is provided. The pin arrangement includes a pin lane. The pin lane includes a pair of ground pins, a pair of differential pins and at least one not-connected (NC) pin. The differential pins are located between the pair of ground pins. The at least one NC pin is located between the pair of differential pins or between one of the pair of ground pins and one of the pair of differential pins adjacent thereto. By adding the at least one NC pin between the pair of differential pins and/or between the differential pin and the ground pin adjacent thereto, a distance between each of the pair of the differential pins and/or between the differential pin and the ground pin is increased, and thus a differential characteristic impedance of the pair of differential pins is raised to reduce the impact of impedance mismatch.

Using time-domain reflectometry to identify manufacturing information for a passive printed circuit board

A method uses time-domain reflectometry to measure a signal reflection delay in a conductive trace formed on a specific passive printed circuit board, and uses the measured signal reflection delay as an index into a table storing a predetermined association between signal reflection delay and passive printed circuit board manufacturing information, wherein the table includes a plurality of predetermined signal reflection delay values, and wherein each of the predetermined signal reflection delay values is associated with unique passive printed circuit board manufacturing information. During manufacturing of the passive printed circuit board, a hole is drilled through the passive printed circuit board so that the hole intersects with the conductive trace and divides the conductive trace into a proximal segment extending from the connector to the hole and a distal segment that is electrically isolated from the proximal segment by the hole.

DISPLAY PANEL AND DISPLAY DEVICE

A display panel and a display device are provided. The display panel comprises a first substrate having a step area; a second substrate disposed opposite to the first substrate, wherein the second substrate has a first surface facing the first substrate and an opposite second surface; a Chip On Flex (COF) disposed on the step area of the first substrate and comprising at least one ground pad, wherein the COF has a first surface facing the first substrate and an opposite second surface, and the at least one ground pad is disposed on the second surface of the COF; a conductive layer disposed on the second surface of the second substrate; and a conductive adhesive electrically connected to the conductive layer and the at least one ground pad. 1. A display panel , comprising:a first substrate having a step area;a second substrate disposed opposite to the first substrate, wherein the second substrate has a first surface facing the first substrate and an opposite second surface;a Chip On Flex (COF) disposed on the step area of the first substrate and comprising at least one ground pad, wherein the COF has a first surface facing the first substrate and an opposite second surface, and the at least one ground pad is disposed on the second surface of the COF;a conductive layer disposed on the second surface of the second substrate; anda conductive adhesive electrically connected to the conductive layer and the at least one ground pad.2. The display panel according to claim 1 , wherein:the conductive adhesive includes a conductive silver paste or a conductive tape.3. The display panel according to claim 1 , wherein:the conductive adhesive is directly electrically connected to the conductive layer; andthe conductive adhesive is directly electrically connected to the at least one ground pad.4. The display panel according to claim 1 , wherein:an orthogonal projection of the at least one ground pad onto the first substrate is located within the step area of the first substrate.5. ...

METHOD OF CUTTING CONDUCTIVE PATTERNS

A method includes: providing a first layout of a first layer over a substrate, the first layer having at least one metal pattern, and generating a second layout by placing a cut mask at a first position relative to the substrate to remove material from a first region of the at least one metal pattern to provide a first metal pattern and placing the cut mask at a second position relative to the first layer over the substrate to remove material from a second region of the at least one metal pattern to provide a second metal pattern. 1. A method comprising:providing a first layout of a first layer over a substrate, the first layer having at least one metal pattern, andgenerating a second layout by placing a cut mask at a first position relative to the substrate to remove material from a first region of the at least one metal pattern to provide a first metal pattern and placing the cut mask at a second position relative to the first layer over the substrate to remove material from a second region of the at least one metal pattern to provide a second metal pattern.2. The method of claim 1 , wherein the first metal pattern comprises a plurality of first metal patterns claim 1 , each of the plurality of first metal patterns having a respective first region; andthe cut mask has a plurality of cut patterns, each respective cut pattern to be used during a first cut patterning step for removing material from the respective first region of a respective one of the first metal patterns, to divide a respective first metal pattern into a respective third metal pattern and a respective fourth metal pattern.3. The method of claim 2 , whereinat least one of the cut patterns is positioned so as to perform a dummy cut during the second cut patterning step.4. The method of claim 2 , wherein the generating step includes:providing pairs of cut regions in the second layout, each pair having a respective first cut region in a respective first metal pattern and a respective second cut region ...

Package substrate with band stop filter and semiconductor package including the same

According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.

Interconnection device for electronic circuits, notably microwave electronic circuits

An interconnection device for elements to be interconnected such as electronic modules or circuits, comprises at least one transmission line coupled to a ground line, the two lines being produced on a face of a dielectric substrate, the interconnection being made substantially at the ends of the transmission line and of the ground line, wherein said interconnection device is flexible over at least a part of its length situated roughly between the elements to be interconnected.

REVERSIBLE ELECTRONIC CARD AND METHOD OF IMPLEMENTATION THEREOF

There is provided a method for implementing an electronic card. The method can include providing the electronic card with a printed circuit board. The method further includes selecting one of a first side and a second side as a specified side on which only connection hardware is to be mounted. The first side is located at a first x-y plane and the second side is located at a second x-y plane, the first and second x-y planes being separated by a length equal to a thickness of the PCB. The first and second x-y planes are parallel. 1. A method for implementing an electronic card , the method comprising:providing the electronic card with a printed circuit board (PCB); wherein the first side is located at a first x-y plane and the second side is located at a second x-y plane, the first and second x-y planes being separated by a length equal to a thickness of the PCB;', 'wherein the first and second x-y planes are parallel;, 'selecting one of a first side and a second side as a specified side on which only connection hardware is to be mounted;'} wherein the first and second solder ball patterns are each a symmetric pattern; and', 'wherein the first and second solder ball patterns have the same x and y coordinates on their respective x-y planes., 'providing a first solder ball pattern on the first side and a second solder ball pattern on the second side;'}2. The method of claim 1 , wherein providing electronic card with the PCB includes providing a multi-layered PCB.3. The method of claim 1 , wherein providing the electronic card with the PCB includes providing a switched mezzanine card.4. The method of claim 3 , wherein providing the providing the electronic card with the PCB includes providing the switched mezzanine card with a multi-layered PCB.5. The method of claim 1 , further including designating one of the first and second sides as a hot side and the other one of the first and second side as a cold side.6. The method of claim 5 , further including designating the ...

Printed Circuit Board and Control Device for a Vehicle Transmission Comprising the Printed Circuit Board

The invention proposes a printed circuit board with multiple layers, which features at least one outer layer and at least one inner layer adjacent to the outer layer. The printed circuit board features a plurality of micro-through-holes, which are formed between a supply voltage area of at least one outer layer and a supply voltage area of at least one inner layer.

PRINTED CIRCUIT BOARD

A printed circuit board includes a core layer, a plurality of conductive pattern layers disposed on one side and the other side of the core layer, a plurality of insulating layers disposed on the one side and the other side of the core layer, and a plurality of via layers disposed on the one side and the other side of the core layer. The printed circuit board has a wiring region and a dummy region surrounding at least a portion outside of the wiring region on a plane. A metal ratio in the dummy region on one side and a metal ratio in the dummy region on the other side are different from each other. 1. A printed circuit board , comprising:a core layer;a plurality of conductive pattern layers disposed on one side and the other side of the core layer;a plurality of insulating layers disposed on the one side and the other side of the core layer;a plurality of via layers disposed on the one side and the other side of the core layer; andthrough vias penetrating through the core layer,wherein the printed circuit board has a wiring region and a dummy region surrounding at least a portion outside of the wiring region on a plane,wherein a metal ratio in the dummy region on the one side and a metal ratio in the dummy region on the other side are different from each other, andwherein the through vias are spaced apart from the dummy region.2. The printed circuit board of claim 1 , wherein the plurality of conductive pattern layers disposed on the one side of the core layer comprise a first wiring pattern disposed in the wiring region claim 1 , respectively claim 1 ,one or more of the plurality of conductive pattern layers disposed on the one side of the core layer comprise a first dummy pattern disposed in the dummy region, respectively,the plurality of conductive pattern layers disposed on the other side of the core layer comprise a second wiring pattern disposed in the wiring region, respectively, andone or more of the plurality of conductive pattern layers disposed on the ...

PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

A display device includes a display substrate including a display area and a pad region, a first pad portion including a plurality of first pad terminals, the plurality of first pad terminals being arranged in a first direction, and a printed circuit board (PCB) including a base film and a second pad portion. The second pad is electrically connected to the first pad portion. The second pad portion includes a plurality of second pad terminals electrically connected to the plurality of first pad terminals, and a plurality of first test lines. The plurality of second pad terminals includes a plurality of sub-pad terminals. One of the plurality of first lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first lines. 1. A printed circuit board (PCB) package , comprising:a base film;a first test pad portion electrically connected to a plurality of second pad terminals; anda second pad portion disposed on a first side of the base film, the second pad portion including the plurality of second pad terminals, wherein the plurality of second pad terminals is arranged along a first direction,wherein the plurality of second pad terminals includes a plurality of first sub-pad terminals, andwherein the first test pad portion is electrically connected to some of the plurality of first sub-pad terminals.2. The PCB package of claim 1 , wherein the plurality of first sub-pad terminals includes:a plurality of third-row sub-pad terminals arranged along a first virtual line which forms a first inclination angle with respect to the first direction, wherein a pair of the plurality of third-row sub-pad terminals extend parallel to each other; anda plurality of fourth-row sub-pad terminals separated from the third-row sub-pad terminals, wherein the plurality of fourth-row sub-pad terminals is arranged along a second virtual line which forms a ...

ELECTRONIC DEVICE

An electronic device is provided. The electronic device includes a substrate, a first contacting element, a second contacting element and a connecting element. The substrate has a first surface and a second surface. The substrate has a through hole located between the first surface and the second surface. At least a part of the connecting element is disposed in the through hole. The first contacting element is disposed on the first surface. The second contacting element is disposed on the second surface. The first contacting element electrically connects the second contacting element through the connecting element. 1. An electronic device , comprising:a substrate having a first surface and a second surface opposite to the first surface, wherein the substrate has a through hole located between the first surface and the second surface;a connecting element, wherein at least a part of the connecting element is disposed in the through hole;a first contacting element disposed on the first surface; anda second contacting element disposed on the second surface;wherein the first contacting element electrically connects the second contacting element through the connecting element.2. The electronic device according to claim 1 , wherein the connecting element includes a first portion claim 1 , a second portion and a third portion claim 1 , the first portion is disposed on the first surface claim 1 , the second portion is disposed on the second surface claim 1 , and the third portion is disposed in the through hole and connects the first portion and the second portion;wherein a covering area of the first contacting element on the first surface is greater than a covering area of the first portion on the first surface, and at least a part of the first contacting element overlaps the first portion in a direction perpendicular to the first surface.3. The electronic device according to claim 2 , wherein a covering area of the second contacting element on the second surface is greater ...

Retaining structure of wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus

A retaining structure of a flexible wiring member includes a flexible wiring member; and a retaining member. The flexible wiring member includes a front side wiring electrode formed on a front side the flexible wiring member and a rear side wiring electrode formed on a rear side thereof, and the flexible wiring member is bonded to the retaining member via the rear side wiring electrode. A liquid discharge head includes nozzles to discharge a liquid; an individual liquid chamber to hold the liquid; a pressure generator to press the liquid inside the individual liquid chamber; an actuator substrate, including an electrode, in which a wiring and the pressure generator are disposed. The electrode of the actuator and that of the flexible wiring member are connected; and the flexible wiring member is retained to the actuator or a member joined to the actuator via the retaining structure of the wiring member.

DISPLAY DEVICE

A display device includes a panel substrate, a first printed circuit board (PCB), a driver integrated circuit (IC), and a second PCB. The panel substrate includes a first substrate and a second substrate. The first PCB is disposed on the second substrate. The driver IC is disposed on the first substrate and is electrically connected to the first PCB. The second PCB is disposed on the first substrate and is electrically connected to the driver IC. The driver IC includes a first pad and a second pad. The first pad is disposed on an upper or lateral surface of the driver IC, the first pad being configured to transmit signals received via the first PCB. The second pad is disposed on a lower surface of the driver IC, the second pad being configured to receive the signals from the first PCB and to transmit the signals to the second PCB. 1. A display device , comprising:a panel substrate comprising a first substrate and a second substrate;a first printed circuit board disposed on the second substrate;a driver integrated circuit (IC) disposed on the first substrate, the driver IC being electrically connected to the first printed circuit board; anda second printed circuit board disposed on the first substrate, the second printed circuit board being electrically connected to the driver IC, the driver IC comprises a first pad and a second pad;', 'the first pad is disposed on an upper surface or a lateral surface of the driver IC, the first pad being configured to transmit signals received via the first printed circuit board; and', 'the second pad is disposed on a lower surface of the driver IC, the second pad being configured to receive the signals from the first printed circuit board and to transmit the signals to the second printed circuit board., 'wherein2. The display device of claim 1 , wherein:the driver IC further comprises a through-electrode penetrating an inner portion of the driver IC; andthe through-electrode is configured to electrically connect the first pad and ...

Driving Printed Circuit Board for Display Device and Display Device Having the Same

An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads. 1. A driving printed circuit board (PCB) for a display device , which is for connecting a display panel with a customer system , the driving PCB comprisinga main substrate area including at least one display panel driving element; anda customer system connector unit disposed at one end of the main substrate area and connected to the customer system,wherein the customer system connector unit includes:one or more ground pads extending from a ground pattern disposed in the main substrate area;one or more dummy ground pads to being connected to the customer system; anda connection line electrically connecting at least one among the dummy ground pads to an adjacent ground pad.2. The driving PCB for the display device of claim 1 , wherein the dummy ground pad includes a first dummy ground pad disposed between two signal pads included in a pair of signal pads attached to one end of a pair of signal lines disposed in the main substrate area.3. The driving PCB for the display device of claim 2 , wherein the ground pad includes a first ground pad directly extending from the ground metal pattern disposed in the main substrate area.4. The driving PCB for the display device of claim 3 , wherein the dummy ground pad includes at least ...

Dummy structure for visual aid in printed wiring board etch inspection

A dummy structure for a printed wiring board (PWB) includes a unit shape defined on the PWB, the unit shape configured to, based on a visual inspection thereof, provide an indication of one of: etching of a PWB circuit element within a desired tolerance range, over etching of the PWB circuit element, or under etching of the PWB circuit element.

Circuit board and method for producing same

A circuit board includes a main portion and at least one uneven portion. The main portion is obtained by stacking a plurality of base sheets made of a flexible material in a predetermined direction and subjecting the stacked base sheets to compression bonding. The at least one uneven portion is provided on one of the base sheets. The uneven portion includes a concave portion and a convex portion extending in a direction perpendicular or substantially perpendicular to the predetermined direction. The concave portion is sunken in the predetermined direction. The convex portion protrudes in an opposite direction to the predetermined direction.

WIRING CIRCUIT BOARD ASSEMBLY SHEET AND PRODUCING METHOD THEREOF

A wiring circuit board assembly sheet is partitioned by a product region in which a plurality of wiring circuit boards serving as products are disposed in alignment and a margin region surrounding the product region with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area. The wiring circuit board assembly sheet includes a dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board. 1. A wiring circuit board assembly sheet partitioned by a product region in which a plurality of wiring circuit boards serving as products are disposed in alignment and a margin region surrounding the product region with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area , whereinthe wiring circuit board assembly sheet includes a dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board.2. The wiring circuit board assembly sheet according to claim 1 , whereinthe dummy wiring circuit board is disposed in the entire first area.3. The wiring circuit board assembly sheet according to claim 1 , whereinthe wiring circuit board includes a wiring made of a conductive layer andthe dummy wiring circuit board includes a dummy wiring made of the conductive layer.4. The wiring circuit board assembly sheet according to claim 3 , whereinthe wiring circuit board assembly sheet has a long shape,has both end portions in a width direction perpendicular to a longitudinal direction and included in the second area, andincludes a conductive end portion disposed at both end portions in the width direction and made of the conductive layer.5. The wiring circuit board assembly sheet according to claim 1 , whereinthe wiring circuit board includes a support substrate ...

CHIP ON FILM FLEXIBLE CIRCUIT BOARD AND DISPLAY DEVICE

A Chip on Film (COF) flexible circuit board and a display device using the COF flexible circuit board are provided. The circuit board includes: a substrate; a plurality of conductive terminals arranged separately in parallel over the substrate, each of the plurality of conductive terminals including a wide line and a narrow line; and a anisotropic conductive adhesive region provided over the substrate. A connection site of the wide line and the narrow line is located in an overlapping area of the anisotropic conductive adhesive region and the substrate. The embodiments of the invention can reduce the probability of the circuit board being broken and the undesirable phenomena such as open circuit. 1. A Chip on Film (COF) flexible circuit board , comprising:a substrate;a plurality of conductive terminals arranged separately in parallel over the substrate, each of the plurality of conductive terminals including a wide line and a narrow line connected with each other; andan anisotropic conductive adhesive region provided over the substrate;wherein a connection site of the wide line and the narrow line is disposed in an overlapping area of the anisotropic conductive adhesive region and the substrate.2. The COF flexible circuit board according to claim 1 , wherein a space area is provided between adjacent wide lines claim 1 , and the wide lines have a width larger than a width of the space area claim 1 , and the width of the space area is about four times larger than a diameter of conductive particles in the anisotropic conductive adhesive.3. The COF flexible circuit board according to claim 2 , wherein a ratio of the width of the wide lines and the width of the space area is about 5.1:4.9 to 5.9:4.1.4. The COF flexible circuit board according to claim 2 , wherein a ratio of the width of the wide lines and the width of the space area is about 5.5:4.5.5. The COF flexible circuit board according to claim 1 , wherein a conductive terminal joint area is disposed between ...

FLEXIBLE PRINTED BOARD

A flexible printed board electrically connected to an electronic component (for example, a liquid crystal panel) by thermal compression bonding, including a flexible substrate, a terminal portion formed on one surface of the flexible substrate and having a plurality of connection terminals to be connected to the electronic component, a wire portion having a plurality of wires formed on the other surface of the flexible substrate, and a plurality of through wires formed inside through holes penetrating the flexible substrate in a compression bonding connection area to the electronic component of the terminal portion to connect the connection terminals of the terminal portion and the respective wires of the wire portion. 17-. (canceled)8. A flexible printed board electrically connected to an electronic component by thermal compression bonding , the flexible printed board comprising:a flexible substrate;a terminal portion formed on one surface of the flexible substrate and having a plurality of connection terminals to be connected to the electronic component;a wire portion having a plurality of wires formed on the other surface of the flexible substrate; anda plurality of through wires formed inside through holes penetrating the flexible substrate in a compression bonding connection area of the terminal portion to the electronic component to connect the connection terminals of the terminal portion to the respective wires of the wire portion,the through wires being arranged in mutually different positions in a direction in which the plurality of connection terminals are arranged side-by-side and a perpendicular thereto.9. The flexible printed board according to claim 8 , whereinthe wire portion is formed such that the plurality of wires is arranged mostly in an area corresponding to the terminal portion.10. The flexible printed board according to claim 8 , whereinthe wire portion is formed such that the wires extend in a direction intersecting the connection terminals ...

SUBSTRATE COMPRISING EMBEDDED ELONGATED CAPACITOR

A substrate that includes a first dielectric layer and a capacitor embedded in the first dielectric layer. The capacitor includes a first terminal, a second terminal, and a third terminal. The second terminal is laterally located between the first terminal and the third terminal. The capacitor also includes a second dielectric layer, a first metal layer and a second metal layer. The first metal layer is coupled to the first and third terminals. The first metal layer, the first terminal, and the third terminal are configured to provide a first electrical path for a first signal. The second metal layer is coupled to the second terminal. The second metal layer and the second terminal are configured to provide a second electrical path for a second signal. 1. A substrate comprising:a first dielectric layer; and a first terminal;', 'a second terminal;', 'a third terminal, wherein the second terminal is laterally located between the first terminal and the third terminal;', 'a second dielectric layer;', 'a first metal layer in the second dielectric layer, the first metal layer coupled to the first and third terminals, the first metal layer, the first terminal, and the third terminal configured to provide a first electrical path for a first signal; and', 'a second metal layer in the second dielectric layer, the second metal layer coupled to the second terminal, the second metal layer and the second terminal configured to provide a second electrical path for a second signal., 'a capacitor embedded in the first dielectric layer, the capacitor comprising2. The substrate of claim 1 , wherein the capacitor further comprises:a fourth terminal;a fifth terminal;a third metal layer in the second dielectric layer, the third metal layer coupled to the fourth terminal; anda fourth metal layer in the second dielectric layer, the fourth metal layer coupled to the fifth terminal, wherein the third and fourth metal layers are configured to change an equivalent series resistance (ESR) of the ...

CIRCUIT BOARD AND CONDUCTIVE PATTERN STRUCTURE

A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape. 1. A circuit board comprising:a first conductive layer;a second conductive layer; andan insulating layer disposed between the first conductive layer and the second conductive layer,wherein the first conductive layer comprises a signal line, and the second conductive layer comprises a ground line electrically separated from the signal line,wherein the ground line includes a pattern area in a corresponding area provided with the signal line and an outer area surrounding the pattern area and being connected to the pattern area, andwherein inner unit patterns of the pattern area are oblique to the signal line, and outer unit patterns of the pattern area are connected to the inner unit patterns of the pattern area.2. The circuit board of claim 1 , wherein the outer area connects to the pattern area in two regions.3. The circuit board of claim 1 , wherein the outer area connects to the pattern area via the outer unit patterns.4. The circuit board of claim 1 , wherein a portion of the outer unit patterns is substantially parallel to the signal line.5. The circuit board of claim 1 , wherein a portion of the outer unit patterns is substantially perpendicular to the signal line.6. The circuit board of claim 1 , wherein a portion of the outer unit patterns is substantially parallel to the signal line claim 1 , and another portion of the outer unit patterns is substantially perpendicular to the signal line.7. The circuit board of claim 1 , wherein a shape of the inner unit patterns under the signal line is substantially the same regardless of a position of the signal line within the ...

FLEXIBLE CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME

A flexible circuit board and display device including the same are disclosed. In one aspect, the flexible circuit board includes a base film including a bending area and a plurality of signal wires formed over the bending area of the base film. At least one through-hole is defined in the base film. 120-. (canceled)21. A display device comprising:a display panel configured to display an image;a first flexible circuit board having a first end electrically connected to the display panel and a second end opposite the first end, the first flexible circuit board having a first through-hole overlapping a bending area of the first flexible circuit board; anda driving circuit substrate electrically connected to the second end of the first flexible circuit board, the driving circuit substrate being configured to drive the display panel;wherein the first flexible circuit board is bent along the bending area so that the driving circuit substrate and the display panel overlap each other,wherein the first flexible circuit board comprises a plurality of first signal wires arranged along a first direction,wherein each of the plurality of first signal wires extends along a second direction different from the first direction, andwherein each of the plurality of first signal wires crosses the bending area.22. The display device of claim 21 , further comprising:a touch panel on the display panel; anda second flexible circuit board having an end electrically connected to the touch panel and a bending area, wherein a second through-hole overlaps the bending area of the second flexible circuit board.23. The display device of claim 21 , wherein the first flexible circuit board comprises:a first base film having the first through-hole therein; andan IC chip on the first base film arid electrically connected to the first signal wires.24. The display device of claim 23 , wherein the first flexible circuit board further comprises:a first pad region in which a first end of each of the first ...

Display device and method for manufacturing display device

According to one embodiment, a display device includes a display panel including a first substrate, and a wiring board mounted on a mounting portion of the first substrate. The display panel includes a first terminal and a second terminal located in the mounting portion, a first alignment mark located in the mounting portion and located between the first terminal and the second terminal, a first wiring line connected to the first terminal, and a second wiring line connected to the second terminal. The wiring board includes a first connection wiring line connected to the first terminal, a second connection wiring line connected to the second terminal, and a second alignment mark located between the first connection wiring line and the second connection wiring line.

Multilayer capacitor and electronic component device

A multilayer capacitor includes an element assembly, a first external electrode, a second external electrode, and a plurality of internal electrodes which are disposed at the inside of the element assembly. The plurality of internal electrodes include a first internal electrode that is electrically connected to the first external electrode, a second internal electrode that is electrically connected to the second external electrode, and a plurality of third internal electrodes. The plurality of third internal electrodes are electrically connected to each other by a first connection conductor and a second connection conductor, a first capacitance portion is constituted by the first internal electrode and the third internal electrodes, a second capacitance portion is constituted by the second internal electrode and the third internal electrodes, and the first capacitance portion and the second capacitance portion are electrically connected in series.

DISPLAY DEVICE

A display device, including a display panel displaying an image; a chip on film (COF) connected to the display panel and on which a driving integrated circuit is mounted; and a printed circuit board (PCB) connected to the COF and including a driving circuit for driving the display panel, in the COF, on a film, a first pad portion being connected to the driving integrated circuit by a first wiring line, a second pad portion being connected to the driving integrated circuit by a second wiring line, and a solder resist being applied to the first and second wiring lines, the second pad portion being spaced from and offset from the first pad portion, and the PCB including stepped portions at sides of first and second corresponding pad portions connected with the first and second pad portions, respectively, to receive a portion of the solder resist. 1. A display device , comprising:a display panel displaying an image;a chip on film (COF) connected to the display panel and on which a driving integrated circuit is mounted; anda printed circuit board (PCB) connected to the COF and including a driving circuit for driving the display panel,in the COF, on a film, a first pad portion being connected to the driving integrated circuit by a first wiring line, a second pad portion being connected to the driving integrated circuit by a second wiring line, and a solder resist being applied to the first wiring line and the second wiring line, the second pad portion being spaced from and offset from the first pad portion, andthe PCB including stepped portions at sides of a first corresponding pad portion and a second corresponding pad portion connected with the first pad portion and the second pad portion, respectively, to receive a portion of the solder resist.2. The display device as claimed in claim 1 , wherein the stepped portions correspond to the second wiring line of the COF.3. The display device as claimed in claim 1 , wherein the first pad portion and the second pad portion of ...

Conductive sheet and touch panel

A conductive sheet includes: a substrate having a first main surface and a second main surface; and a first electrode pattern placed on the first main surface of the substrate. The first electrode pattern is made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction. Each first conductive pattern includes, at least, inside thereof, a sub-nonconduction pattern that is electrically separated from the first conductive pattern. An area A of each first conductive pattern and an area B of each sub-nonconduction patterns satisfy a relation of 5%<B/(A+B)<97%. Accordingly, a conductive sheet and a touch panel having a high detection accuracy can be provided.

Mounting cable and cable assembly

A mounting cable includes: a metal cable that includes a core wire formed of a conductive material and a jacket formed of an insulator and covering the core wire; a cable fixing portion that fixes an end portion of the metal cable, and has an end face which is perpendicular to an axial direction of the metal cable and on which a cross section of an end portion of the core wire is exposed; an external connection electrode formed on at least one surface of the cable fixing portion, the at least one surface being in parallel with the axial direction of the metal cable; and a wire pattern that extends from an area on the core wire exposed on the end face to the external connection electrode.

Illuminated display

An illuminated display includes a plurality of illumination means, in particular a plurality of LEDs, which are arranged on a transparent base member. The transparent base member reduces visible light on average by a maximum of 40%. Preferably, the transparent base member is constructed in the form of a film, or in a further preferred manner in the form of a plastics material film. The illumination means are supplied with voltage by means of strip conductors. The strip conductors are electrically connected at one end preferably to a control unit and at the other end to at least one illumination means.

Component Carrier Comprising a Copper Filled Multiple-Diameter Laser Drilled Bore

A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D) and a connected second bore section with a second diameter (D) differing from the first diameter (D). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling. 1. A component carrier , comprising:a layer stack formed of an electrically insulating structure and an electrically conductive structure;a bore extending into the layer stack and having a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter; anda thermally conductive material filling the bore.2. The component carrier according to claim 1 ,wherein the layer stack comprises a first surface and a second surface opposing the first surface,wherein the bore extends between the first surface and the second surface.3. The component carrier according to claim 2 ,wherein the thermally conductive material forms a pad section onto the second surface.4. The component carrier according to claim 2 ,wherein the thermally conductive material extends along the first surface for forming a heat radiation section.5. The component carrier according to claim 4 ,wherein the heat radiation section forms a first covering area onto the first surface and the pad section forms a second covering area onto the second surface,wherein the first covering area is larger than the second covering area.6. The component carrier according to claim 2 , further comprising:a further bore extending into the layer stack,wherein the further bore is spaced apart from the bore,wherein the further bore extends between the first surface and the second surface,wherein the thermally conductive material is filling substantially the entire further bore.7. The component carrier according ...

Printed circuit board structure, and wiring method therefor

A printed circuit board structure and a wiring method therefor are disclosed. The printed circuit board structure comprises a first wiring channel formed inside the printed circuit board for transmitting a circuit signal; a pin, connected to the first wiring channel for connecting a chip to the printed circuit board; the pin comprising an unused pin and a used pin, the used pin comprising a peripheral pin and an internal pin; wherein the printed circuit board further comprises a second wiring channel, the second wiring channel leads out the internal pin by means of covering at least a portion of the unused pin. By means of using a printed circuit board structure and a wiring method to configure pins of the printed circuit board, the number of printed circuit board layers is reduced, and the current carrying capacity is enhanced.

Printed circuit board and method of manufacturing the same

Disclosed herein are a printed circuit board and a method of manufacturing the same. According to an exemplary embodiment of the present invention, the printed circuit board includes: a first insulating layer in which a metal layer is embedded; a warpage prevention layer stacked on the first insulating layer; second insulating layers stacked on both surfaces of the first insulating layer; a via formed on the second insulating layer to be connected to the metal layer; and a solder resist layer stacked on the second insulating layer.

DUMMY CORE RESTRICT RESIN PROCESS AND STRUCTURE

A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion. 1. A printed circuit board comprising:a. a rigid printed circuit board portion comprising a laminated stack of a plurality of non-conducting layers and a plurality of conductive layers, wherein the laminated stack further comprises a first portion of an inner core structure; andb. a flexible printed circuit board portion comprising a second portion of the inner core structure, wherein the inner core structure is a continuous structure that extends through both the rigid printed circuit board portion and the flexible printed circuit board portion, further wherein the second portion of the inner core structure comprises inner core circuitry and exposed coverlay material covering the inner core circuitry, wherein the coverlay material comprises a continuous layer having a first portion in the flexible printed circuit board portion that is the exposed coverlay material covering the inner core circuitry and a second portion embedded within the laminated stack of the rigid printed circuit board portion, the second portion only partially extending into the rigid printed circuit board portion.2. The printed circuit board of wherein each of the conductive layers is pattern etched.3. The printed circuit board of further comprising one or more ...

IMPLANTABLE ELECTRODE AND METHOD OF MAKING THE SAME

An implantable electrode system of is disclosed that includes a conductive electrode layer, an interconnect coupled to the electrode layer, an insulator that insulates the interconnect, and an anchor that more securely fixes the electrode layer in place. This structure is particularly useful with the electrode layer being a neural interface that is configured to provide either a recording or stimulating function. A method for forming such an implantable electrode system includes forming an interconnect over a base layer, forming an anchoring structure over the base layer, depositing an insulating material layer over the interconnect structure and over the anchoring structure, exposing a portion of the interconnect structure, forming an electrode layer over the insulating layer, the electrode layer contacting the exposed portion of the interconnect structure. 1. A method for controlling charge distribution of an implantable electrode comprising:forming an interconnect structure over a base layer;forming an anchoring structure over the base layer;depositing an insulating material layer over the interconnect structure and over the anchoring structure;exposing a portion of the interconnect structure; andforming an electrode site over the insulating layer, the electrode site contacting the exposed portion of the interconnect structure.2. The method of claim 1 , further comprising:exposing the portion of the interconnect structure through the insulating material layer; anddepositing a plug over the interconnect structure, the plug electrically coupling the interconnect structure to the electrode site.3. The method of claim 1 , wherein the exposed portion of the interconnect structure having a ring geometry.4. The method of claim 1 , wherein exposing the portion of the interconnect structure comprises exposing the interconnect structure a central portion of the interconnect structure without exposing an edge portion of the interconnect structure.5. The method of claim 1 , ...

PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING THE SAME

A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove. 1. A printed circuit board assembly sheet comprising:a plurality of printed circuit boards;a support frame configured to integrally support the plurality of printed circuit boards such that the plurality of printed circuit boards are arranged at spacings; anda dummy trace portion provided in a region between at least a printed circuit board on one end side and the support frame, whereineach of the plurality of printed circuit boards and the dummy trace portion includes:a support substrate;a first insulating layer formed on the support substrate;a plurality of conductor traces formed on the first insulating layer; anda second insulating layer formed on the first insulating layer to cover the plurality of conductor traces,the support frame has a pair of first frame portions extending in a first direction, and a pair of second frame portions extending in a second direction that is substantially perpendicular to the first direction,a first groove extending in the second direction is formed in the first insulating layer in a region between adjacent conductor traces in the dummy trace portion, anda second groove extending in the second direction is formed in the second insulating layer in the region between the adjacent conductor traces in the dummy trace portion.2. The printed circuit board assembly sheet according to claim 1 , wherein each of the plurality of printed circuit boards is configured to be separated from the ...

MULTILAYER WIRING BOARD AND PROBE CARD HAVING THE SAME

A multilayer wiring board includes: a multilayer body including a plurality of insulating layers; a lower outer electrode provided on a lower surface of the multilayer body; a first via conductor connected at one end to the lower outer electrode; a first in-plane conductor connected to another end of the first via conductor; a second via conductor provided within the multilayer body on a surface of the first in-plane conductor on the opposite side from a surface of the first in-plane conductor in a position distanced from the first via conductor viewed in a direction orthogonal to a layering direction of the multilayer body, one end of the second via conductor being connected to the first in-plane conductor; and a second in-plane conductor connected to another end of the second via conductor. A line width of the first in-plane conductor is narrower than that of the second in-plane conductor. 1. A multilayer wiring board comprising:a multilayer body comprising a plurality of insulating layers laminated together;an outer electrode located on one main surface of the multilayer body;a first via conductor provided within the multilayer body and connected at one end to the outer electrode;a first wiring layer including a line-shaped first in-plane conductor directly connected to another end of the first via conductor;a second via conductor provided within the multilayer body on a surface of the first in-plane conductor on the opposite side from a surface of the first in-plane conductor connected to the first via conductor, in a position distanced from the first via conductor by a predetermined distance in a direction orthogonal to a layering direction of the multilayer body, one end of the second via conductor being connected to the first in-plane conductor; anda second wiring layer including a line-shaped second in-plane conductor connected to another end of the second via conductorwherein a line width of the first in-plane conductor is narrower than a line width of the ...

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion. 1. A method for producing a wired circuit board including an insulating layer and a conductive pattern , the method comprising the steps of:a step (1), in which the insulating layer having an inclination face is provided;a step (2), in which a metal thin film is provided at least on the surface of the insulating layer;a step (3), in which a photoresist is provided on the surface of the metal thin film;a step (4), in which a photomask is disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask;a step (5), in which the first portion is removed to expose the metal thin film corresponding to the first portion; anda step (6), in which the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist,wherein the inclination face has a second portion that allows the reflected light reflected at the metal thin film to reach the first portion, andin the step (4), the photomask is disposed so that the photoresist facing the second portion is shielded from light.2. The ...

Interior aircraft led light unit

An interior aircraft LED light unit includes at least one printed circuit board, on which a plurality of LEDs are connected to a power source, each one of the plurality of LEDs having a predetermined distance to the power source, and each one of the plurality of LEDs being associated with a respective thermal transfer member having a predetermined size, for transferring heat away from the respective LED, wherein, for at least some of the plurality of LEDs the predetermined size of the respective thermal transfer member varies with the predetermined distance of the LED to the power source.

Electronic part

An electronic part (air pressure detecting device) 1 includes a sensor element (air pressure sensor element) 2 that includes an ambient air contacting surface S including an ambient air contacting region Sa to be exposed to ambient air, and a supporting substrate 4 , arranged to support the sensor element 2 . The sensor element 2 is bonded to one surface 4 a of the supporting substrate 4 in a state where its ambient air contacting surface S faces the one surface 4 a of the supporting substrate 4 and a gap, through which the ambient air flows, is formed between the ambient air contacting surface S and the one surface 4 a of the supporting substrate 4.

Semiconductor package substrate

The present invention relates to a semiconductor package substrate, and more particularly, to a semiconductor package substrate that can prevent warpage by minimizing the difference in the residual ratio of copper between a substrate region and a dummy region or between upper and lower surfaces of the dummy region and prevent a molding material applied to the substrate region from being introduced into the dummy region by patterns formed in the dummy region.

PAD PATTERNS

In one implementation, a printed circuit board (PCB) includes a plurality of pads that form a pad pattern on the PCB. In that implementation, the plurality of pads include a group of load pads, a dummy pad, and a false pad. The group of load pads act as contact points to establish an electrical path between a first circuitry and a second circuitry. The dummy pad is coupled to a via that floats electrically and the false pad is coupled to a third circuitry. 1. A printed circuit board (PCB) comprising: a group of load pads that act as contact points to establish an electrical path between a first circuitry and a second circuitry;', 'a dummy pad coupled to a first via that floats electrically; and', 'a false pad coupled to a second via that couples to a third circuitry., 'a plurality of pads that form a pad pattern on the PCP, the plurality of pads comprising2. The PCB of claim 1 , wherein:the pad pattern is a grid having a size that is a first number by a second number, the first number being greater than a number of components and the second number being greater than the number of components; andthe group of load pads comprises pairs of load pads associated with the number of components.3. The PCB of claim 1 , wherein a non-dummy pad is orthogonal to each of the plurality of pads claim 1 , the non-dummy pad comprising the false pad or a first load pad of the group of load pads.4. The PCB of claim 1 , wherein less than a first number of false pads are orthogonal to each of the plurality of pads claim 1 , where the first number is a number of pads that are within a first distance that is reachable based on a length of a component usable with the plurality of pads.5. The PCB of claim 1 , wherein the plurality of pads comprises a number of pads described by a ratio of a number of dummy pads to an equal number of non-dummy pads.6. The PCB of claim 1 , comprising:a plurality of traces on a second layer of the PCB coupled to the group of load pads, the second layer being an ...

MULTILAYER CIRCUIT BOARD AND TESTER INCLUDING THE SAME

Interfacial delamination of a resin multilayer body from a ceramic multilayer body that occurs in a multilayer circuit board composed of a ceramic multilayer body and a resin multilayer body thereon is reduced, and the warpage of the multilayer circuit board is reduced. A multilayer circuit board includes a ceramic multilayer body that is a stack of multiple ceramic layers and a resin multilayer body that is a stack of multiple resin insulating layers to and is on the ceramic multilayer body. The resin multilayer body contains dummy electrode pads for relaxing shrinkage stress in the resin multilayer body. This lessens the stress on the interface between the ceramic multilayer body and the resin multilayer body because the dummy electrode pads work to prevent the resin multilayer body from shrinking. 1. A multilayer circuit board comprising:a ceramic multilayer body that is a stack of a plurality of ceramic layers; anda resin multilayer body that is a stack of a plurality of resin insulating layers, the resin multilayer body being on the ceramic multilayer body,the multilayer circuit board comprises at least one dummy conductor in the resin multilayer body that relaxes shrinkage stress in the resin multilayer body.2. The multilayer circuit board according to claim 1 , wherein the at least one dummy conductor is located at a periphery of the resin multilayer body in plan view.3. The multilayer circuit board according to claim 1 , wherein the at least one dummy conductor includes at least one dummy conductive via.4. The multilayer circuit board according to claim 3 , wherein:the at least one dummy conductor includes a plurality of dummy conductive vias; andat least a pair of dummy conductors is provided in point symmetry around a center of the resin multilayer body in plan view.5. The multilayer circuit board according to claim 4 , wherein:the resin multilayer body is rectangular in plan view; andthere is a dummy conductive via at each of four corners of the resin ...

Method of cutting conductive patterns

A method includes patterning a layer over a substrate with a first metal pattern; using a cut mask in a first position relative to the substrate to perform a first cut patterning for removing material from a first region within the first pattern; and using the same cut mask to perform a second cut patterning while in a second position relative to the same layer over the substrate, for removing material from a second region in a second metal pattern of the same layer over the substrate.

ELECTRONIC COMPONENT

An electronic component includes a body having a side surface, coil conductor layers wound along main surfaces parallel to the side surface, and capacitor conductor layers each having a substantially plate-like shape parallel to the side surface. The coil conductor layers and the capacitor conductor layers are arranged in a widthwise direction perpendicular to the side surface. The capacitor conductor layers include first and second capacitor conductor layers adjacent to each other in the widthwise direction. The coil conductor layers include a first coil conductor layer that is in the same layer as the first capacitor conductor layer and a second coil conductor layer that is in the same layer as the second capacitor conductor layer. The shortest distance between the first coil conductor layer and the first capacitor conductor layer is larger than the shortest distance between the second coil conductor layer and the second capacitor conductor layer. 1. An electronic component comprising:a body having a first side surface;a plurality of coil conductor layers each of which is wound in the body parallel to the first side surface; anda plurality of capacitor conductor layers each of which is disposed in the body and each of which has a substantially plate-like shape parallel to the first side surface;whereinthe plurality of coil conductor layers are arranged in a lamination direction that is perpendicular to the first side surface,the plurality of capacitor conductor layers are arranged in the lamination direction and include a first capacitor conductor layer and a second capacitor conductor layer that are adjacent to each other in the lamination direction,the plurality of coil conductor layers include a first coil conductor layer that is in the same layer as the first capacitor conductor layer and a second coil conductor layer that is in the same layer as the second capacitor conductor layer, andthe shortest distance between the first coil conductor layer and the first ...

SUBSTRATE UNIT, LIQUID CRYSTAL DISPLAY UNIT, AND ELECTRONIC APPARATUS

A substrate unit includes a first substrate, a second substrate, an adhesive layer in which conductive particles and an adhesive agent are mixed, and an inspection pattern. In the inspection pattern, one of a first inspection electrode and a second inspection electrode includes a plurality of bar electrodes arranged to extend in a first direction and a connection electrode that connects the bar electrode to the other adjacent bar electrode. The first inspection electrode is conducted with the second inspection electrode at a first portion that includes at least one of the bar electrodes, the first inspection electrode is conducted with the second inspection electrode at a second portion that is different from the first portion and includes at least one of the bar electrodes, and the first portion and the second portion are arranged at positions not overlapped with each other along the first direction. 1. A substrate unit comprising:a first substrate provided with first wiring;a second substrate provided with second wiring on a flexible substrate body;an adhesive layer in which conductive particles and an adhesive agent are mixed to conduct the first wiring of the first substrate with the second wiring of the second substrate; andan inspection pattern including a first inspection electrode formed in a region of the first substrate in which the adhesive layer is arranged and a second inspection electrode formed in a region of the second substrate facing the first inspection electrode and conducted with the first inspection electrode via the adhesive layer, whereinin the inspection pattern, one of the first inspection electrode and the second inspection electrode includes a connection electrode that connects a plurality of adjacent bar electrodes arranged to extend in a first direction to each other,the first inspection electrode is conducted with the second inspection electrode at a first portion that includes at least one of the bar electrodes, the first inspection ...

LED DEVICE

An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern. 1. A holder , comprising:a heat dissipating base body with a top portion; anda carrying unit connected to the top portion and comprising a carrying base body, a circuit pattern and a heat dissipating pattern, the carrying unit being formed of a non-electrically conductive material, the circuit pattern and the heat dissipating pattern being directly formed to a surface of the carrying base body, the circuit pattern defining a mounting position where a light emitting element is configured to be mounted to the surface of the carrying base body to establish an electrical connection with the circuit pattern, the heat dissipating pattern at least extending from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body.2. The holder of claim 1 , wherein the circuit pattern defines a plurality of mounting positions where respective light emitting elements are configured to be mounted to the surface of the carrying base body to establish an electrical connection with the circuit pattern claim 1 , the heat dissipating pattern ...

PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

A printed circuit board, a semiconductor package, and a method of producing the same are provided. The printed circuit board (PCB) includes an insulating layer and a circuit layer including metal pads exposed on a side surface and a lower surface of the insulating layer. 1. A printed circuit board (PCB) comprising:an insulating layer; anda circuit layer comprising metal pads exposed on a side surface and a lower surface of the insulating layer.2. The PCB of claim 1 , wherein one of the metal pads covers substantially the entire side surface of the insulating layer.3. The PCB of claim 1 , wherein one of the metal pads covers a portion of the side surface of the insulating layer.4. The PCB of claim 1 , further comprising a solder resist layer having an opening exposing the metal pad.5. The PCB of claim 1 , wherein the PCB is a multilayer PCB.6. The PCB of claim 4 , wherein the PCB further comprises a via connecting an interlayer circuit layer claim 4 , and the solder resist layer is embedded in at least a portion of the via.7. A method of manufacturing a semiconductor package claim 4 , the method comprising:forming a circuit layer comprising a dummy via and a metal pad in an insulating layer;forming a solder resist layer having an opening exposing the metal pad to both surfaces of the insulating layer; andcutting through the dummy via to form a metal side surface pad of the insulating layer.8. The method of claim 7 , wherein the insulating layer is a built-up layer formed by stacking two or more layers.9. The method of claim 7 , wherein the forming of the circuit layer comprisesthe metal pad being formed on a lower surface of the dummy via.10. A method of manufacturing a semiconductor package claim 7 , the method comprising:obtaining a printed circuit board comprising an insulating layer and a metal side surface pad disposed on a side surface of the insulating layer; andmounting a semiconductor device on the printed circuit board.11. The method of claim 10 , wherein ...

Structure for circuit interconnects

Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.

Circuit substrate and display apparatus

A circuit substrate includes a substrate portion; a circuit portion that is provided on the substrate portion; a terminal portion that is provided on the substrate portion and connected to the circuit portion; and a dummy terminal portion that is disposed at a position closer to an edge than the terminal portion is on the substrate portion so as to be spaced from the terminal portion with an insulating space between the terminal portion and the dummy terminal portion.

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

A circuit board including a substrate, a patterned conductive layer, a patterned insulating layer, a conductive terminal, and a dummy terminal is provided. The patterned conductive layer is disposed on the substrate. The patterned insulating layer is disposed on the substrate and at least covers a portion of the patterned conductive layer. The conductive terminal is disposed on the patterned conductive layer and has a first top surface. The dummy terminal is disposed on the patterned conductive layer and has a second top surface. A first height between the first top surface and the substrate is greater than a second height between the second top surface and the substrate. 1. A circuit board , comprising:a substrate;a patterned conductive layer, disposed on the substrate;a patterned insulating layer, disposed on the substrate and at least covering a portion of the patterned conductive layer, the patterned insulating layer has a third top surface;a conductive terminal, disposed on the patterned conductive layer and having a first top surface; anda dummy terminal, disposed on the patterned conductive layer and having a second top surface, wherein a first height between the first top surface and the substrate is greater than a second height between the second top surface and the substrate, and the first height between the first top surface and the substrate is greater than a third height between the third top surface and the substrate.2. The circuit board of claim 1 , wherein the conductive terminal and the dummy terminal are electrically separated from each other.3. The circuit board of claim 1 , wherein:the substrate has a first surface;the patterned conductive layer is disposed on the first surface of the substrate; anda ratio of a sum of a projected area of the conductive terminal on the first surface and a projected area of the dummy terminal on the first surface to a surface area of the first surface is greater than or equal to 10% and less than 100%.4. The ...

Thermally conductive electronic packaging

Disclosed herein are apparatuses and methods for configuring a circuit board to have a plurality of die having different bottom-side electrical potential. An apparatus comprises a circuit board comprising a metallic base plate, a thermally conductive dielectric, and a plurality of metallic pads. Each of a plurality of die of the apparatus is coupled to a respective one of the plurality of metallic pads, and the plurality of die comprises a first die and a second die. Based on each of the plurality of die being coupled to a respective one of the plurality of metallic foil pads, the first die is configured to exhibit a first bottom-side electrical potential and the second die is configured to exhibit a second bottom-side electrical potential. The apparatus is further configured to conduct heat from the plurality of die away from the plurality of die via at least the metallic base plate, the thermally conductive dielectric, and the plurality of metallic pads.

Thin-carrier circuit for use in waveguides and manufacturing processes

Eine substratbasierte Schaltung (31) weist ein Trägersubstrat (2) auf, wobei auf zumindest einem Teil des Trägersubstrats (2) eine Haftschicht (5) ausgebildet ist und wobei auf zumindest einem ersten Teil (51) der Haftschicht (5) eine Kontaktschicht (6) ausgebildet ist, die zumindest eine Leiterbahn (7) und/oder zumindest ein Antennenelement (8) bildet. Das Trägersubstrat (2) weist zumindest ein Befestigungselement (20) auf, welches am äußeren Bereich des Trägersubstrats (2) abgeschieden ist und über den äußeren Bereich des Trägersubstrats (2) hinaussteht. A substrate-based circuit (31) has a carrier substrate (2), an adhesive layer (5) being formed on at least part of the carrier substrate (2) and a contact layer (6) on at least a first part (51) of the adhesive layer (5) ) is formed, which forms at least one conductor track (7) and / or at least one antenna element (8). The carrier substrate (2) has at least one fastening element (20), which is deposited on the outer region of the carrier substrate (2) and projects beyond the outer region of the carrier substrate (2).

Electrically conductive layer structure and method for its production

Die Erfindung betrifft ein Verfahren zur Herstellung mindestens einer musterförmig ausgebildeten, elektrisch leitenden Schichtstruktur (5''') auf einem elektrisch isolierenden Substrat (1) sowie eine danach hergestellte elektrisch leitende Schichtstruktur (5'''), die in Schichtebene in allen Richtungen Abmessungen von kleiner als 20 mm aufweist. The invention relates to a method for producing at least one pattern-formed, electrically conductive layer structure (5 '' ') on an electrically insulating substrate (1) and an electrically conductive layer structure (5' '') produced thereafter, the dimensions in layer plane in all directions of less than 20 mm.

Method and apparatus for designing interconnection structure and method for manufacturing interconnection structure

The present disclosure provides methods and apparatus for designing an interconnection structure and methods for manufacturing an interconnection structure, and relates to the technical field of semiconductors. An implementation of the method may include: designing n virtual interconnection units according to a number of metal interconnection layers in a circuit area of a chip design drawing, where an i th virtual interconnection unit includes i metal interconnection layers, and where adjacent metal interconnection layers in a j th virtual interconnection unit are connected by using vias, and n≥2, 1≤i≤n, and 2≤j≤n; and filling an area in the chip design drawing outside the circuit area with virtual interconnection units, where the j th virtual interconnection unit is filled, and a (j−1) th virtual interconnection unit is not filled unless there is no space in the area for the j th virtual interconnection unit.

Multilayer circuit board

A circuit board is manufactured from a core layer having a conductor run layer (4') overlying the core layer (2) on one side thereof, and a continuous layer (16') of dielectric material over­lying the conductor run layer, by forming a con­tinuous outer layer (18) of conductive material over the layer of dielectric material. Material of the continuous outer layer is removed at a prede­termined location, and the dielectric material that is thus exposed is also removed so as to form an opening through which the conductor run layer is exposed. Conductive material is deposited into the opening to at least the level of the outer conduc­tor layer, whereby the conductor run layer is con­nected to the outer layer of conductive material.

Film substrate and manufacturing method thereof

Printed wiring board

互连结构的设计方法、装置及制造方法

本公开提供了一种互连结构的设计方法、装置及制造方法，涉及半导体技术领域。所述方法包括：根据芯片设计图的电路区域中金属互连层的数量设计n种虚拟互连单元，第i种虚拟互连单元包括i层金属互连层，第j种虚拟互连单元中相邻的金属互连层通过通孔连接，其中，n≥2，1≤i≤n，2≤j≤n；在芯片设计图中除电路区域之外的区域中填充虚拟互连单元，其中，优先填充第j种虚拟互连单元，在所述区域中没有空间用于填充第j种虚拟互连单元的情况下，才填充第j‑1种虚拟互连单元。

Surface metal balancing to reduce chip carrier flexing

A surface metal balancing structure for a chip carrier, and an associated method of fabrication, to reduce or eliminate thermally induced chip carrier flexing. A substrate, such as a chip carrier made of organic dielectric material, is formed and includes: internal circuitization layers, a plated through hole, and outer layers comprised of an allylated polyphenylene ether. A stiffener ring for mechanically stabilizing the substrate is bonded to an outer portion, such as an outer perimeter portion, of the top surface of the substrate, in light of the soft and conformal organic material of the substrate. The top and bottom surfaces of the substrate have metal structures, such as copper pads and copper circuitization, wherein a surface area (A) multiplied by a coefficient of thermal expansion (C) is greater for the metal structure at the bottom surface than for the metal structure at the top surface. A metal pattern is adjacent to the top surface so as to make the product AC of metal structures at or near the top and bottom surfaces approximately equal. The metal pattern reduces or eliminates flexing of the substrate in an elevated temperature environment, such as during a reflow of solder that couples a semiconductor chip to the substrate.

Thermal interface for a printed wiring board

A printed wiring board is comprised of a combination of layers providing a good thermal match with surface mount components. The board consists of a core surrounded by multiple layers of dielectric and conductive materials optimized for their thermal expansion qualities. The core is also used as a heat sink for drawing excess heat from the components. An integral thermal interface region is used to dissipate the heat from the core.

フレキシブルプリント基板およびフレキシブルプリント基板の製造方法

【課題】アルミニウム放熱材を用いなくても放熱性を向上させることができると共に、軽量であり、加工性が良好であり、さらにコストも低減可能なフレキシブルプリント基板およびフレキシブルプリント基板の製造方法を提供する。【解決手段】電力を消費する負荷が実装されるフレキシブルプリント基板１０であって、銅箔を材質とすると共に、負荷が実装される回路部を有する表面放熱層３０と、表面放熱層３０が表面側に積層されていると共に、熱伝導率が０．４９Ｗ／ｍＫ以上の熱伝導性樹脂層２０と、銅箔を材質とすると共に、熱伝導性樹脂層２０の裏面側に積層され、表面放熱層３０に対して１００〜４００％の厚みを有する裏面放熱層と、を備えている。【選択図】図１

Flex rigid wiring board and manufacturing method thereof

Module connection structure

Electromagnetic bandgap structure and printed circuit board

An electromagnetic band gap structure and a printed circuit board are provided to prevent a mixed signal in an electronic device having an RF circuit and a digital circuit on the same substrate. An electromagnetic band gap structure includes first to third metal layers(210-1,210-2,210-3), first to third dielectric layers(220a,220b,220c), a metal plate(330), and first and second vias(340,360). The first dielectric layer is formed on the first metal layer. The second metal layer is formed on the first dielectric layer and has a hole(350). The second dielectric layer is formed on the second metal layer. The metal plate is formed on the second dielectric layer. The first via connects the first metal layer and the metal plate through the hole. The third dielectric layer is formed on the metal plate and the second dielectric layer. The third metal layer is formed on the third dielectric layer. The second via connects the metal layer and the third metal layer.

Multilayer wiring board and method of producing the same

본 발명은 코어 기판과 코어 기판의 양면에 형성된 배선 패턴을 갖고, 코어 기판은 코어 기판을 관통하는 도전성 부재를 갖고, 코어 기판의 양면의 배선 패턴 부재는 코어 기판을 관통하는 도전성 부재를 통해 서로 접속되는 다층 배선판에 있어서, 코어 기판은 비어 칼럼과, 도금으로 형성된 도전성 구조 부재 및 비어 칼럼과 도전 구조 부재를 전기적으로 서로 절연시키는 절연 구조 부재를 갖고, 비어 칼럼은 코어 기판을 관통하여 코어 기판의 양면의 배선 패턴 부재를 서로 접속하는 도전성 부재로서 기능하는 다층 배선판에 관한 것이다. 이와 같은 다층 배선판을 제조하는 방법도 개시된다. The present invention has a wiring pattern formed on both sides of the core substrate and the core substrate, the core substrate has a conductive member penetrating the core substrate, the wiring pattern members on both sides of the core substrate are connected to each other through the conductive member penetrating the core substrate In the multilayer wiring board, the core substrate has a via column, a conductive structural member formed by plating, and an insulating structural member that electrically insulates the via column and the conductive structural member from each other. The multilayer wiring board which functions as an electroconductive member which connects wiring pattern members of each other is related. Also disclosed is a method of manufacturing such a multilayer wiring board. 다층 배선판, 비어 칼럼 Multilayer Wiring Board, Beer Column

Display panel having marks for visual inspection and manufacturing method therefor

패널 기판, TAB 기판(2, 3) 및 플렉시블 기판(4)의 각 접속 영역(11, 12, 13, 14) 근처에서, 육안 검사용 마크(15a∼15d, 20a∼20d, 30a∼30d, 40a∼40d)가 상기 접속 영역으로부터 설정된 거리만큼 떨어져서 제공된다. 상기 제공된 마크에 의해, 디스플레이 패널의 접속이 완료된 후에 육안 검사 공정에서 고정밀도로 불량품이 제거될 수 있다. 따라서 육안 검사 공정 후에 현미경 검사 공정의 부하가 경감될 수 있다. Visual inspection marks 15a-15d, 20a-20d, 30a-30d, 40a near each connection area | region 11, 12, 13, 14 of panel board | substrate, TAB board | substrate 2,3, and flexible board | substrate 4, respectively. To 40d are provided at a distance set from the connection area. By the marks provided, the defective article can be removed with high precision in the visual inspection process after the connection of the display panel is completed. Therefore, the load of the microscopy process can be reduced after the visual inspection process. 육안 검사, 현미경 검사, 마크, 접속 영역, 디스플레이 패널, 기판 Visual inspection, microscopy, mark, connection area, display panel, substrate

絶縁金属ベース回路基板及びそれを用いた混成集積回路モジュール

【課題】基板の実装工程時の熱負荷により発生する反り挙動を減少するための回路設計方法及びそれを用いた絶縁金属ベース回路基板及びその回路基板を用いた混成集積回路モジュールを提供する。 【解決手段】金属箔上に絶縁層を介して導体回路を設けてなる絶縁金属ベース回路基板であって、絶縁金属ベース回路基板の回路側平面の重心を通る、回路平面に垂直な、少なくとも一つの任意の断面において、前記導体回路の回路占有率が５０％以上であり、かつ、該絶縁金属ベース回路基板平面内にとりうる最大の矩形形状をとり、その矩形形状の前記絶縁金属ベース回路基板平面に占める割合が６０％以上であることを特徴とする絶縁金属ベース回路基板。 【選択図】図２

一种走线结构及其制备方法、显示装置

本发明公开了一种走线结构及其制备方法、显示装置，该走线结构包括基体，还包括形成于所述基体上的预布置层，形成于所述基体和所述预布置层上的种子层，以及形成于所述种子层上的电极走线，所述电极走线覆盖所述预布置层，以使所述预布置层引导所述电极走线的形成；走线结构可在基体上形成致密且无缺陷的电极走线，避免电极走线中出现孔洞。

印刷线路板及其制造方法

本发明提供一种能够提高部件安装用凹腔的底部的机械强度、提高可靠性的印刷线路板。本发明提供的印刷线路板(10)，其在金属芯(11)的表面与背面的一个面形成绝缘层(16)、并且将形成于上述金属芯(11)的开口(12)作为部件安装用凹腔(15a)使用，在该印刷线路板(10)中，在上述绝缘层(16)的、与成为上述凹腔(15a)的底部的部分相对的绝缘层的表面部分形成有加强图案(30)。上述加强图案(30)使用与形成于上述绝缘层(16)的布线图案(28c、29c)相同的材料且与该布线图案(28c、29c)同时形成。

Coreless substrate and manufacturing method thereof

(a) 금속 시트의 일면에 절연층을 형성하는 단계; (b) 상기 절연층에 상기 금속 시트와 타면의 층간 전기적 접속을 위한 비아홀을 형성하는 단계; 및 (c) 상기 금속 시트를 식각함으로써 돌출된 다수의 기능 패드를 형성하는 단계를 포함하는 코어층이 없는 기판 제조 방법이 제시된다. 본 발명에 따른 코어층이 없는 기판 및 그 제조 방법은 이너 비아홀이 필요 없으므로 신호전달특성이 향상된 효과가 있다. (a) forming an insulating layer on one surface of the metal sheet; (b) forming a via hole in the insulating layer for electrical connection between the metal sheet and the other surface; And (c) forming a plurality of protruding functional pads by etching the metal sheet. Since the substrate without the core layer and the manufacturing method thereof according to the present invention do not require an inner via hole, there is an effect of improving signal transmission characteristics. 이너 비아홀, 금속 시트, 기능 패드, 반도체 패키지. Inner via hole, metal sheet, function pad, semiconductor package.

Thermal-emitting Memory Module, Thermal-emitting Module Socket Electrically Connecting The Thermal-emitting Memory Module, Computer System Comprising The Thermal-emitting Memory Module And The Thermal-emitting Memory Module, And Method Of Using The Computer System Comprising The Same

열 발산 메모리 모듈, 상기 열 발산 메모리 모듈과 전기적으로 접속하는 열 발산 모듈 소켓, 상기 열 발산 메모리 모듈 및 상기 열 발산 모듈 소켓을 구비하는 컴퓨터 시스템, 그리고 그 컴퓨터 시스템의 사용방법을 제공한다. 이를 위해서, 상기 열 발산 메모리 모듈 및 상기 열 발산 모듈 소켓은 컴퓨터 시스템의 구동 동안에 그들 로부터 생성되는 열을 빠른 시간 내에 식혀주는 방안을 제공한다. 이를 위하여, 컴퓨터 시스템 내 장착되는 열 발산 모듈 소켓이 준비될 수 있다. 상기 열 발산 모듈 소켓은 접속부, 상기 접속부를 둘러싸는 유체 저장소, 및 상기 유체 저장소를 노출시키는 유체 흐름 게이트들로 구비되는 소켓 바디를 가질 수 있다. 상기 열 발산 모듈 소켓과 전기적으로 접속하는 열 발산 메모리 모듈이 준비될 수 있다. 상기 열 발산 메모리 모듈은 모듈 기판, 반도체 소자, 및 열 발산 부분을 가질 수 있다. A heat dissipation memory module, a heat dissipation module socket electrically connected to the heat dissipation memory module, a computer system having the heat dissipation memory module and the heat dissipation module socket, and a method of using the computer system are provided. To this end, the heat dissipation memory module and the heat dissipation module socket provide a way to cool the heat generated from them during the operation of the computer system in a short time. To this end, a heat dissipation module socket can be prepared for mounting in the computer system. The heat dissipation module socket may have a socket body provided with a connection, a fluid reservoir surrounding the connection, and fluid flow gates exposing the fluid reservoir. A heat dissipation memory module electrically connected to the heat dissipation module socket may be prepared. The heat dissipation memory module may have a module substrate, a semiconductor device, and a heat dissipation portion. 모듈 기판, 반도체 소자, 메모리 모듈, 소켓 바디, 저장소 Module Board, Semiconductor Device, Memory Modules, Socket Body, Storage

覆晶薄膜柔性电路板及显示装置

本发明涉及显示技术领域，具体涉及一种覆晶薄膜柔性电路板及应用该覆晶薄膜柔性电路板的显示装置。该覆晶薄膜柔性电路板包括基底以及平行间隔设置在基底上的多个导电端子，每个导电端子均包括宽线以及窄线，覆晶薄膜柔性电路板上方设置有异方性导电胶区域；宽线与窄线的结合部位位于异方性导电胶区域与基底交叠的区域中。本发明通过将易发生断裂的宽线与窄线结合部位设置在异方性导电胶区域与基底交叠的区域中，从而使防断裂能力较强的宽线承受弯折，减少了断裂发生的几率；通过将防断裂能力更强的导电端子交合区域设置在异方性导电胶区域与基底交叠的区域中，使其承受部分弯折，减少了断裂发生的几率；因此，本发明能够大幅度降低电路断路不良。

具有共同化接地板的印刷电路板

一种电连接器，包括基板以及接地耦合组件。该基板包括在基板的第一表面和第二表面处的多个接地迹线，该接地耦合组件在第一表面和第二表面均耦合接地迹线对，并且还将第一表面处的接地迹线耦合到第二表面处的接地迹线。

Source driver, source driver manufacturing method, and liquid crystal module

Mold for manufacturing display device and manufacturing method of display device using the same

본 발명은 표시장치 제조용 몰드와 이를 이용한 표시장치의 제조방법에 관한 것이다. 본 발명에 따른 표시장치의 제조방법은 매트릭스 형태로 배치되어 있는 사용영역과 상기 사용영역 사이의 제거영역을 가지는 마더 절연기판을 마련하는 단계와; 상기 마더 절연기판 상에 유기층을 형성하는 단계와; 상기 사용영역에 대응하는 패턴부와 상기 제거영역의 적어도 일부에 대응하는 그루브가 형성되어 있는 몰드를 상기 유기층 상에 배치하는 단계와; 가압수단을 이동시키면서 상기 몰드를 상기 유기층에 순차적으로 가압하는 단계와; 상기 몰드를 상기 유기층에서 분리하는 단계를 포함하는 것을 특징으로 한다. 이에 의하여 기포로 인한 유기층 패터닝 불량을 감소시킬 수 있다. The present invention relates to a mold for manufacturing a display device and a method of manufacturing a display device using the same. A method of manufacturing a display device according to the present invention includes the steps of: providing a mother insulating substrate having a use area arranged in a matrix form and a removal area between the use areas; Forming an organic layer on the mother insulating substrate; Disposing a mold having a pattern portion corresponding to the use region and a groove corresponding to at least a portion of the removal region on the organic layer; Sequentially pressing the mold onto the organic layer while moving the pressing means; And separating the mold from the organic layer. As a result, poor organic layer patterning due to bubbles can be reduced.

Semiconductor device

Printed circuit board and method of manufacturing the same

본 발명은 인쇄회로기판 및 그 제조방법에 관한 것이다. 본 발명에 따른 인쇄회로기판은, 금속층이 삽입된 제1 절연층; 상기 제1 절연층에 적층된 휨방지층; 상기 제1 절연층 양면에 적층된 제2 절연층; 상기 제2 절연층에 형성되어 상기 금속층과 접속된 비아; 및 상기 제2 절연층 상에 적층된 솔더 레지스트층;을 포함한다. The present invention relates to a printed circuit board and its manufacturing method. Printed circuit board according to the present invention, the first insulating layer is a metal layer is inserted; A warpage-preventing layer laminated on the first insulating layer; A second insulating layer laminated on both surfaces of the first insulating layer; A via formed in the second insulating layer and connected to the metal layer; And a solder resist layer stacked on the second insulating layer.

Printed circuit board and manufacturing method thereof

본 발명의 일 측면에 따른 인쇄회로기판은, 절연층 및 회로를 포함하고, 상기 절연층 내에 이격 배치된 한 쌍의 판상형 제1 보강재; 및 상기 한 쌍의 제1 보강재를 연결하는 제2 보강재를 더 포함한다. A printed circuit board according to an aspect of the present invention includes: a pair of plate-shaped first reinforcing materials including an insulating layer and a circuit, and spaced apart from each other in the insulating layer; and a second reinforcing member connecting the pair of first reinforcing members.