High-frequency switch module

In a high-frequency switch module, a switch IC is mounted on a multilayer board to define a high-frequency switch module. The multilayer board includes two internal wirings and two internal ground electrodes. The internal ground electrodes are spaced apart from each other at an interval when viewed from a lamination direction of the multilayer board. The first internal wiring is located on the upper surface side of the first internal ground electrode, and is entirely separated from an RF wiring, and the first internal wiring includes a power supply wiring for supplying power to the switch IC. The second internal wiring is located on the upper surface side of the second internal ground electrode, and is entirely separated from the power supply wiring, and the second internal wiring includes a signal wiring through which an RF signal propagates.

Circuit Layout of Image Capturing Device

A circuit layout of an image capturing device comprises a circuit board, an image capturing circuit, a flashlight circuit and a groove. The circuit board is a multilayered structure. The image capturing circuit is built on the circuit board. The flashlight circuit is built on the circuit board. The groove is formed on the multilayered structure of the circuit board and divides the circuit board into two areas where the image capturing circuit and the flashlight circuit are respectively disposed. The image capturing circuit is located at a first area, and the flash circuit is located at a second area. Therefore, the groove can prevent the interference between the image capturing circuit and the flashlight circuit.

Printed circuit board and method for manufacturing the same

Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.

Metal core substrate and electrical junction box using the same

The electrical junction box is provided with a metal core substrate including: a rectangular-shaped core metal layer in which two core metal plates are arranged with a slit-shaped gap therebetween; and insulating layers filling the gap and integrating the two core metal plates by covering surfaces of the core metal plates. Electric power from a battery is inputted into the core metal plate, and electric power from an alternator is inputted into the core metal plate. The gap includes: a first straight portion vertically extended straight from one side of the core metal layer; a second straight portion vertically extended straight from another side of the core metal layer, parallel to a virtual extended line of the first straight portion, and not arranged in the same line as the first straight portion; and a square-U-shaped portion.

Apparatus and methods for a physical layout of simultaneously sub-accessible memory modules

A layout for simultaneously sub-accessible memory modules is disclosed. In one embodiment, a memory module includes a printed circuit board having a plurality of sectors, each sector being electrically isolated from the other sectors and having a multi-layer structure. At least one memory device is attached to each sector, the memory devices being organized into a plurality of memory ranks. A driver is attached to the printed circuit board and is operatively coupled to the memory ranks. The driver is adapted to be coupled to a memory interface of the computer system. Because the sectors are electrically-isolated from adjacent sectors, the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices on a particular sector may be accessed at one time. In an alternate embodiment, the printed circuit board includes a driver sector electrically isolated from the other sectors and having a multi-layer structure, the driver being attached to the driver sector.

Manufacture of a curved electronic device using differential heating and curved electronic device

A curved electronic device ( 10 c ) can be formed by a stack with a curved substrate ( 13 ) comprising a thermoplastic material (Ms), and at least one electronic component ( 14 ) connected to an electronic circuit ( 15 ) disposed on the substrate ( 13 ). A component area ( 11 ) of the substrate surface ( 11.12 ) around the electronic component ( 14 ) comprises a first material (M 1 ) providing relatively low absorption (A 1 ) to light (L) and a surrounding area ( 12 ) of the substrate ( 13 ) outside the component area ( 11 ), comprises a second material (M 2 ) providing relatively high absorption (A 2 ) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T 1 ) of the substrate ( 13 ) in the component area ( 11 ) may be relatively high compared to a second thickness (T 2 ) of the substrate ( 13 ) in the surrounding area ( 12 ).

Electrical device, model series of electrical devices, and production method

In an electrical device, a model series of electrical devices, and a production method, in particular for a converter, having a circuit board including circuit traces, the circuit board has two similar and/or identical contact area arrays, the contact area arrays in particular transitioning into each other through rotation and/or displacement. A first contact area array of the contact area arrays is fitted with a first power module, and the second contact area array is able to be fitted with a second power module, e.g., so that a respective electric motor is able to be supplied from the respective power module.

Electronic apparatus and method for fabricating the same

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Component package and printed circuit board for the same

A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.

Redistribution Board, Electronic Component and Module

A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a redistribution structure for high voltage signals, and a non-conductive layer. The second conductive layer is spaced apart from the first conductive layer by the non-conductive layer. The redistribution board further includes a conductive connector extending from a mounting surface of the redistribution board to the second conductive layer. The conductive connector is surrounded by a low voltage trace of the first conductive layer.

Multilayer board and electronic device

A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.

Method for manufacturing a printed circuit board, printed circuit board and rear view device

A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.

Multilayer electronic structure with integral faraday shielding

A multilayer electronic support structure including at least one metallic component encapsulated in a dielectric material, and comprising at least one faraday barrier to shield the at least one metallic component from interference from external electromagnetic fields and to prevent electromagnetic emission from the metallic component.

Semiconductor module

A semiconductor module includes a circuit substrate, a first semiconductor device substrate that is mounted on the circuit substrate and that processes an input signal of a first frequency band, a second semiconductor device substrate that is mounted on the circuit substrate and that processes an input signal of a second frequency band, and a control device substrate that is arranged between the first and second semiconductor device substrates and that controls the first and second semiconductor device substrates.

METHOD OF PROVIDING POWER INPUT TO A FLEXIBLE PRINTED CIRCUIT AND A FLEXIBLE PRINTED CIRCUIT HAVING POWER INPUT IN ACCORDANCE WITH THE METHOD

A method of providing power input to a flexible printed circuit. The method involves the step of bisecting a flexible printed circuit into a first conductive area adapted for power input and a second conductive area adapted for ground connection. In accordance with this teaching, power input is provided to electrical components attached to the flexible printed circuit via first conductive area and second conductive area, rather than through individual control lines. 1. A method of providing power input to a flexible printed circuit , comprising:bisecting a flexible printed circuit into a first conductive area adapted for power input and a second conductive area adapted for ground connection, such that power input is provided to electrical components attached to the flexible printed circuit via first conductive area and second conductive area.2. The method of claim 1 , wherein the flexible printed circuit is bisected by communication lines between the electrical components.3. The method of claim 1 , wherein the electrical components are attached by conductive adhesive.4. The method of claim 2 , wherein the electrical components are light emitting diodes (LEDs).5. The method of claim 4 , wherein the LEDs have integrated controllers that use a serial communications protocol that facilitates daisy chaining.6. A flexible printed circuit claim 4 , comprising:a flexible printed circuit substrate bisected by communication lines between electrical components into a first conductive area adapted for power input and a second conductive area adapted for ground connection; andelectrical components attached to the substrate along the communication lines and connected to the first conductive area and the second conductive area with power input provided to the electrical components via first conductive area and second conductive area.7. flexible printed circuit of claim 6 , wherein the electrical components are light emitting diodes (LEDs).8. The flexible printed circuits of claim ...

3D FLEX SOLDERING

In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations. 120.-. (canceled)21. A mobile device , comprising:a housing that defines an internal volume;an electrical component disposed within the internal volume, the electrical component comprising a protruding feature positioned between a first lead and a second lead; a first surface, comprising a first region soldered to the first lead, a second region soldered to the second lead and a central region disposed between the first and second regions that has a curved geometry that accommodates the protruding feature of the electrical component, and', 'a plurality of surface mounted components soldered to a second surface of the flexible circuit, the second surface being opposite the first surface., 'a flexible circuit, comprising22. The mobile device of claim 21 , wherein the electrical component is an audio jack comprising a monolithic audio jack housing comprising the first region and the second region.23. The mobile device of claim 21 , wherein the electrical component is an audio jack claim 21 , and wherein the audio jack comprises:a first modular connector component comprising the first lead;a second modular connector component comprising the second lead; anda support structure that interlocks with the first and second modular components, a central ...

Systems and methods for providing electromagnetic interference (emi) shielding between inductors of a radio frequency (rf) module

Electrically-conductive wires are used to construct an EMI shield between inductors of an RF module that prevents, or at least reduces, EMI crosstalk between the inductors while maintaining high Q factors for the inductors. The EMI shield comprises at least a first set of electrically-conductive wires that at least partially surrounds and extends over at least a first inductor of a pair of inductors. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire in between the first and second ends of the respective wire extends above the first inductor and is spaced apart from the first inductor so as not to be in contact with the first inductor.

PRINTED CIRCUIT BOARD

A printed circuit board includes a core layer, a plurality of conductive pattern layers disposed on one side and the other side of the core layer, a plurality of insulating layers disposed on the one side and the other side of the core layer, and a plurality of via layers disposed on the one side and the other side of the core layer. The printed circuit board has a wiring region and a dummy region surrounding at least a portion outside of the wiring region on a plane. A metal ratio in the dummy region on one side and a metal ratio in the dummy region on the other side are different from each other. 1. A printed circuit board , comprising:a core layer;a plurality of conductive pattern layers disposed on one side and the other side of the core layer;a plurality of insulating layers disposed on the one side and the other side of the core layer;a plurality of via layers disposed on the one side and the other side of the core layer; andthrough vias penetrating through the core layer,wherein the printed circuit board has a wiring region and a dummy region surrounding at least a portion outside of the wiring region on a plane,wherein a metal ratio in the dummy region on the one side and a metal ratio in the dummy region on the other side are different from each other, andwherein the through vias are spaced apart from the dummy region.2. The printed circuit board of claim 1 , wherein the plurality of conductive pattern layers disposed on the one side of the core layer comprise a first wiring pattern disposed in the wiring region claim 1 , respectively claim 1 ,one or more of the plurality of conductive pattern layers disposed on the one side of the core layer comprise a first dummy pattern disposed in the dummy region, respectively,the plurality of conductive pattern layers disposed on the other side of the core layer comprise a second wiring pattern disposed in the wiring region, respectively, andone or more of the plurality of conductive pattern layers disposed on the ...

ELECTRONIC DEVICE

In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer. 1. An electronic device comprising:a first interconnect layer having a first conductor interconnect;a second interconnect layer having a second conductor interconnect, and situated on the first interconnect layer;a first electronic component mounted in a flip chip configuration on the second interconnect layer, and electrically connected with the second conductor interconnect via a first bump;a second electronic component mounted in a flip chip configuration on the second interconnect layer, and electrically connected with the second conductor interconnect via a second bump; andan external connection terminal electrically connected with the first conductor interconnect,wherein a line thickness of the second conductor interconnect is smaller than a line thickness of the first conductor interconnect, andwherein the layer number of the second interconnect layer in which the second conductor interconnect is formed is less than the layer number of the first interconnect layer in which the first conductor interconnect is formed.2. The electronic device according to claim 1 ,wherein the first interconnect layer has a first insulation resin and the first conductor interconnect,wherein the second interconnect layer has a second insulation resin and the second conductor interconnect, andwherein a thickness of the first insulation resin which comprises the first interconnect ...

RECIPROCAL PCB MANUFACTURING PROCESS

Embodiments disclosed herein include a printed circuit board (PCB) with a non-uniform thickness and methods of fabricating such PCBs. In an embodiment, the PCB comprises a connector region with a top surface and a bottom surface, and a component region with a top surface and a bottom surface. In an embodiment, the bottom surface of the connector region is coplanar with the bottom surface of the component region. In an embodiment the top surface of the connector region is not coplanar with the top surface of the component region. 1. A printed circuit board (PCB) , comprising:a connector region with a top surface and a bottom surface; anda component region with a top surface and a bottom surface, wherein the bottom surface of the connector region is coplanar with the bottom surface of the component region, and wherein the top surface of the connector region is not coplanar with the top surface of the component region.2. The PCB of claim 1 , wherein the component region has a first thickness and the connector region has a second thickness that is greater than the first thickness.3. The PCB of claim 2 , wherein the top surface of the component region is coupled to the top surface of the connector region by a chamfered sidewall.4. The PCB of claim 3 , wherein an end of the component region opposite from the connector region has a chamfered surface between the top surface and the bottom surface of the component region.5. The PCB of claim 3 , further comprising a laser stop at the interface between the chamfered sidewall and the top surface of the component region.6. The PCB of claim 5 , wherein a top surface of the laser stop is substantially coplanar with a top surface of the component region.7. The PCB of claim 5 , wherein a width of the laser stop extends substantially along a width of the PCB.8. The PCB of claim 5 , wherein the laser stop is electrically isolated from circuitry of the PCB.9. The PCB of claim 5 , wherein the laser stop is a ring around the component ...

Electronic device

In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN PORTABLE ELECTRONIC DEVICES

A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer. 120-. (canceled)21. An electronic device comprising:a substrate;a plurality of electronic components mounted on the substrate;an insulating layer on the substrate and encapsulating the plurality of electronic components;a trench formed through the insulating layer and exposing the substrate to segregate the plurality of electronic components into a first subsystem including one or more of the plurality of electronic components and a second subsystem including one or more of the plurality of electronic components, the trench separating the first subsystem from the second subsystem; and an electrically conductive shielding layer that substantially fills the trench;', 'a protection layer over the shielding layer and the insulating layer, wherein the protection layer is formed of a first metal or metal alloy and does not fill the trench., 'a shielding structure comprising22. The electronic device of claim 21 , wherein the protection layer conformally coats outermost side surfaces of the substrate.23. The electronic device of claim 22 , wherein the substrate is a printed circuit board.24. The electronic device of claim 22 , further comprising an adhesion layer underneath the ...

Module

A module is provided with a substrate including a principal surface, a plurality of electronic components arranged on the principal surface, a sealing resin covering the principal surface and the plurality of electronic components, a ground electrode arranged on the principal surface or inside the substrate, a conductive layer covering the sealing resin and electrically connected to the ground electrode, and a magnetic member. The magnetic member includes a magnetic plate member arranged so as to cover at least a part of the sealing resin and a magnetic wall member arranged in a wall shape between any of the plurality of electronic components. The module is further provided with a metal pin or a metal wire provided along the magnetic wall member and connected to the ground electrode.

Electronic control unit and electric power steering apparatus having the same

In an electronic control unit, high-heat-generating devices are mounted on a first surface or a second surface of a board, a heat-dissipating member is located facing the first surface of the board, and a heat-conducting member is located between the board and the heat-dissipating member. The heat-conducting member is in contact with the high-heat-generating devices to transfer heat of the high-heat-generating devices to the heat-dissipating member. A ratio of the number of the high-heat-generating devices mounted on the board to the number of the high-heat-generating devices arranged inside a first limited region of the first surface or a second limited region of the second surface is greater than a predetermined ratio. The second limited region is located at a position corresponding to the first limited region.

Electronic device and electronic module

An electronic device includes a first wiring substrate having a first corner part, a first ground pattern formed on a lower surface of the first wiring substrate with avoiding the first corner part, a second ground pattern formed on an upper surface of the first wiring substrate with avoiding the first corner part, a second wiring substrate provided above the first wiring substrate and including a second corner part above the first corner part, a third ground pattern formed on a lower surface of the second wiring substrate with avoiding the second corner part, a fourth ground pattern formed on an upper surface of the second wiring substrate with avoiding the second corner part, a plurality of terminals electrically connected to each of the first, second, third and fourth ground patterns, and an antenna fixed to the upper surface of the second wiring substrate at the second corner part.

Printed wiring board and method of producing the same

A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. EBG unit cells are disposed on a boundary between the digital circuit and the analog circuit one dimensionally or two dimensionally and periodically, and an interdigital electrode is formed. A magnetic body film is formed over the printed wiring board, partially formed on the EBG unit cells, or formed avoiding the EBG unit cells.

MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN PORTABLE ELECTRONIC DEVICES

A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer. 1. An electronic device comprising:a substrate; and a plurality of subsystems including a plurality of electronic components,', 'a plurality of trenches, each trench separating adjacent subsystems and including two walls, wherein the walls are perpendicular to the substrate, and', 'a multi-layer thin film stack including portions disposed in each of the plurality of trenches, wherein the portions are perpendicular to the substrate., 'a system in package assembly including2. The electronic device of claim 1 , wherein the system in package assembly and the substrate are assembled into a single package3. The electronic device of claim 1 , wherein the plurality of subsystems further comprises a plurality of mechanical or optical components.4. The electronic device of claim 1 , wherein some of the plurality of electronic components produce RF or magnetic shield interference and some of the plurality of electronic components are sensitive to interference received from sources external from the electronic device.5. The electronic device of claim 1 , wherein at least one of the plurality of subsystems includes audio components claim 1 , at least one of the plurality of subsystems ...

Modular led strip lighting apparatus

A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use a multi-layer metal core printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification.

Printed wiring board and method for manufacturing printed wiring board

A printed wiring board includes a first insulating layer, a first conductor layer formed on a surface of the first insulating layer and including first pads, and a wiring structure including a second conductor layer formed on the first insulating layer, a second insulating layer laminated on the second conductor layer, a third conductor layer formed on the second insulating layer, and formed through the second insulating layer. The second conductor layer includes second pads formed on the first insulating layer, the third conductor layer includes third pads formed on the second insulating layer, the via conductors are positioned such that the via conductors are connecting the second pads and the third conductor layer, and the wiring structure is formed such that the second conductor layer and third conductor layer are not electrically connected to the first conductor layer.

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI) COMPARTMENT SHIELDING FOR COMPONENTS DISPOSED INSIDE OF SYSTEM ELECTRONIC PACKAGES

A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire that is located in between the first and second ends of the respective wire extends above the circuitry and is spaced apart from the components of the circuitry so as not to be in contact with the components of the circuitry. 1. A system module package comprising:a substrate;an electrical device disposed on a surface of the substrate;an electrical ground structure having two or more strips adjacent to two or more different sides of the electrical device;a first electrically-conductive wire having a first length, a first end and a second end, wherein the first end and the second end of the first electrically-conductive wire are respectively connected to two different strips of the two or more strips of the electrical ground structure; anda second electrically-conductive wire arranged substantially in parallel to the first electrically-conductive wire such that the first and second electrically-conductive wires are configured to at least attenuate in part a frequency or frequency range of interest; anda third electrically-conductive wire having a third length, a first end and a second end, wherein both the first and second ends of the third electrically-conductive wire are physically connected to one of the two or more strips of the electrical ground structure, and wherein the first length is greater than the third length.2. The system module package of claim 1 , wherein the two different strips of the two or more strips of the electrical ground ...

Shielding structures for system-in-package assemblies in portable electronic devices

A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.

COIL COMPONENT AND MANUFACTURING METHOD THEREOF

A coil component capable of being easily manufactured while significantly reducing a size thereof, and a manufacturing method thereof, the coil component including: a first coil part including a stacked substrate on which a first coil pattern is formed; a second coil part including a main substrate on which a second coil pattern is formed and a plurality of electronic components are mounted; a core penetrating through the first and second coil parts and coupled to the first and second coil parts; and an insulating member securing an insulation distance between the second coil pattern and the electronic components mounted on the main substrate. 1. A coil component , comprising:a first coil part including a stacked substrate on which a first coil pattern is formed;a second coil part including a main substrate on which a second coil pattern is formed and a plurality of electronic components are mounted;a core penetrating through the first and second coil parts and coupled to the first and second coil parts; andan insulating member securing an insulation distance between the second coil pattern and the electronic components mounted on the main substrate.2. The coil component of claim 1 , wherein the insulating member is an insulating cover including at least one side wall claim 1 , the side wall being interposed between the second coil pattern and the electronic components.3. The coil component of claim 2 , wherein the insulating member has the side wall interposed between terminal pins bonded to the first coil part and the second coil pattern of the second coil part.4. The coil component of claim 3 , wherein the main substrate is provided with a terminal pad to which the terminal pins are bonded and a cut part performing cutting between the terminal pad and the second coil pattern claim 3 , andthe side wall of the insulating member is disposed to be inserted into the cut part.5. The coil component of claim 1 , wherein the electronic components mounted on the main ...

Electronic control unit for operating an electric motor having a braking resistor

An electronic control unit is configured to operate an electric motor from a rechargeable battery pack. The control unit has a circuit board with electronic components for driving the electric motor. Furthermore, an electrical braking circuit having a braking resistor and also a braking switch is provided. The receiving surface of the circuit board is spatially divided into a first surface region and a second surface region. The first surface region serves to receive electronic components; the second surface region serves to receive the braking resistor, wherein the braking resistor is configured as a conductor track which is formed on the circuit board.

LIGHT ENGINE CONFIGURED TO BE BETWEEN A POWER SOURCE AND ANOTHER LIGHT ENGINE

A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification. The LEDs may comprise a subset of LEDs having a first colour and a subset of LEDs having a second colour different from said first colour intertwined on the light engine. 1a printed circuit board;at least one LED group on said printed circuit board; andfirst and second connectors on said printed circuit board.. A light engine comprising: The present application is a continuation of and claims the benefit under 35 USC 120 of U.S. patent application Ser. No. 16/286,588 entitled “LIGHTING APPARATUS WITH A PLURALITY OF LIGHT ENGINES” by Briggs filed on Mar. 12, 2018, which is a continuation of and claims the benefit under 35 USC 120 of U.S. patent application Ser. No. 15/919,147 entitled “LIGHT ENGINE AND LIGHTING APPARATUS WITH FIRST AND SECOND GROUPS OF LEDS” by Briggs filed on Mar. 12, 2018, which is a continuation of and claims the benefit under 35 USC 120 of U.S. patent application Ser. No. 15/426,049 entitled “CONTROL UNIT AND LIGHTING APPARATUS INCLUDING LIGHT ENGINE AND CONTROL UNIT” by Briggs filed on Feb. 6, 2017, which claims the benefit under 35 USC 120 of U.S. patent application Ser. No. 15/136,599 entitled “LED LIGHTING APPARATUS WITH FIRST AND SECOND COLOUR LEDS” by Briggs filed on Apr. 22, 2016, which claims the benefit under 35 USC 120 of U.S. patent application Ser. No. 14/606,013 entitled “MODULAR LED STRIP LIGHTING APPARATUS” by Briggs filed on Jan. 26, 2015, which claims the benefit under 35 USC 120 of U.S. patent application Ser. No. 13/423,142 entitled “MODULAR LED STRIP LIGHTING APPARATUS” by Briggs filed on ...

Printed circuit board assembly

The present invention provides a printed circuit board assembly including a substrate having a plurality of conductive layers vertically sandwiched between a first cap-insulation layer and a second cap-insulation layer. The substrate has a first part, a second part and a third part. For protecting the conductive layers from moisture, each of the areas of the conductive layers corresponding to the second part is smaller than the area of the first cap-insulation layer corresponding to the second part for at least a first predetermined percentage, and each of the areas of the conductive layers corresponding to the second part is smaller than the area of the second cap-insulation layer corresponding to the second part for at least the first predetermined percentage.

Semiconductor device

An electronic device has a control board having a plurality of wiring layers, a metal-made housing supporting the control board, and a fixing screw for fixing the control board to the housing through a washer. The control board includes a through hole penetrating from a third surface to a fourth surface, a through electrode formed inside the through hole, and a power system GND pattern formed on any wiring layer of the wiring layers. The power system GND pattern and the housing are electrically coupled through the through electrode, the washer, and the fixing screw.

METHOD FOR ACTIVATING THE SURFACE OF AN ELECTRONICS CARD IN ORDER TO IMPROVE THE ADHERENCE OF A PROTECTIVE LAYER SUCH AS A VARNISH OR AN ELECTRIC, MECHANICAL OR THERMAL BINDER

The invention relates to a method for treating surfaces of an electronic card () by means of a plasma torch (), said card () comprising a plurality of electronic components (C, C, C, C, C, C) and a plurality of surfaces to be treated, arranged at various heights relative to a reference plane (Ref) of the electronic card (). At least one region to be treated (Zn) containing the surfaces to be treated is determined, strata (S, S, S) which are parallel to said reference plane (Ref) and each contain at least one surface to be treated are determined, and then a torch movement path is generated such that: the surfaces are treated, stratum by stratum; for each stratum, the torch is exclusively moved in parallel with the reference plane (Ref); during the projection of the plasma flow (), each treated surface is exclusively placed in the ideal working zone (Pt). 1. A method for treating surfaces of an electronic card using a plasma torch generating a stream of plasma , this card including multiple electronic components , the card having multiple surfaces to be treated that are positioned at various heights with respect to a reference plane of the electronic card , at least some of these surfaces to be treated being formed on at least some of the components of the electronic card , characterized in that:at least one zone to be treated of the electronic card is determined, this zone to be treated containing the surfaces to be treated;an ideal working range specific to the plasma torch is determined, this working range being localized with respect to a given point of this torch; andusing an algorithm run by a computer, strata that are parallel to said reference plane of the card are determined, each of these strata containing at least one of the surfaces to be treated corresponding thereto, then a trajectory for the movement of said torch is generated such that when this movement trajectory is followed:the surfaces to be treated are treated in a chronological order, comprising ...

Board mounted led array

A lighting device comprising a carrier board and an array of lighting elements mounted on the carrier board. The carrier board has a generally spiral shape and the carrier board can be tessellated with one or more identical other carrier boards with windings interleaved with each other. This enables multiple carrier boards to be formed from a single substrate with little or no waste of material. Different designs enable two, four or even more different identical carried board shapes to be tessellated together.

A hybrid microelectronic substrate and methods for fabricating the same

A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.

System of providing power

A system of providing power including: a preceding-stage power supply module, a post-stage power supply module and a load, connected in sequence; a projection on the mainboard of a smallest envelope area formed by contour lines of the preceding-stage power supply module and the load at least partially overlaps with a projection of the post-stage power supply module; the preceding-stage power supply module includes a plurality of sets of preceding-stage output pins and preceding-stage ground pins alternately arranged to form a first rectangular envelope area, and the load is disposed on a side of a long side of the first rectangular envelope area; and the load comprises a load input pin and a load ground pin forming a second rectangular envelope area, and a center line of the first rectangular envelope area and the second rectangular envelope area is perpendicular to the long side of the first rectangular envelope area.

Printed circuit board orientations

An example computing device enclosure can include a first printed circuit board (PCB) that includes a first plurality of components, where a first portion of the first plurality of components that are shorter than a threshold height are positioned on a first side of the first PCB and a second portion of the first plurality of components that are taller than the threshold height are positioned on a second side of the first PCB, and a second printed circuit board (PCB) that includes a second plurality of components, where a first portion of the second plurality of components that are shorter than the threshold height are positioned on a first side of the second PCB and a second portion of the second plurality of components that are taller than the threshold height are positioned on a second side of the second PCB.

LIGHTING APPARATUS WITH A PLURALITY OF LIGHT ENGINES

A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification. The LEDs may comprise a subset of LEDs having a first colour and a subset of LEDs having a second colour different from said first colour intertwined on the light engine. 1. (canceled)2. A lighting apparatus comprising:a plurality of light engines, each of the light engines comprising: a printed circuit board;and a first LED group on its printed circuit board coupled between a power supply input on the light engine and a first return path associated with the first LED group on the light engine; the first LED group comprising at least one LED set comprising a plurality of LEDs coupled in series; anda power source comprising a power supply output coupled to the power supply input of each of the light engines and a power supply return coupled to the first return path associated with the first LED group of each of the light engines;wherein the first return path on at least one of said light engines is coupled to the power supply return of the power source via the first return path on another one of the light engines.3. The lighting apparatus according to claim 2 , wherein the power supply input on at least one of the light engines is coupled to the power supply output of the power source via the power supply input on another one of the light engines.4. The lighting apparatus according to claim 2 , wherein the printed circuit board of each of the plurality of light engines comprises first and second interconnection layers; wherein the at least one LED set of the first LED group is mounted to the first interconnection layer on each of ...

Electronic apparatus

Provided is an electronic apparatus including a printed board having on a front surface thereof a first region and a second region in each of which a circuit element is disposed, and a shield member formed by a single metal sheet and disposed such as to face the front surface of the printed board. The shield member has a first section that faces the first region and a second section that faces the second region, and at least a boundary section of the first section and the second section is electrically connected to a ground pattern of the printed board, the ground pattern being formed between the first region and the second region.

Method of manufacturing a package for embedding one ore more electronic components

The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave / THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

Printed wiring board

Circuit board

One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.

大陶瓷制品及其制造方法

一种供电子电路应用的大陶瓷基片制品，它至少 包括一层烧结的陶瓷材料，所述的层包括有多个边对 边地接合的陶瓷材料毛坯块。还公开了一种制造未 烧结的大陶瓷毛坯制品的方法，以及一种大陶瓷基片 制品。

Backlight for liquid crystal display comprising light emitting diode

A backlight of an LCD(Liquid Crystal Display) using a light emitting diode is provided to form the lines for electrically connecting LEDs(Light Emitting Diodes) with a driving circuit connecting connector on the surface opposite to the arrangement surface of LEDs. A double-sided PCB(Printed Circuit Board) has plural division areas and conduction via holes. Plural light emitting diodes are arranged at the upper surface of the double-sided PCB. Plural driving circuit connection connectors(25) are arranged at a side of the double-sided PCB. Plural first lead patterns(26) are formed on the upper surface of the double-sided PCB and electrically connect plural light emitting diodes located at the division areas. Plural second lead patterns are formed on the lower surface of the double-sided PCB and electrically connect the first lead patterns and the connectors through the conduction via holes. The double-sided PCB also includes heat radiating via holes penetrated from the upper surface to the lower surface having LEDs arranged thereon. The first lead patterns adjacent to the connectors are directly connected with the connectors.

Backlight unit

Printed circuit board and manufacturing method thereof

The present invention is a core layer disposed cavity; An electronic component provided in the cavity; A conductor partition wall disposed at a side of the cavity; And an insulating layer disposed above and below the core layer.

Integrated circuit assembly for power and electronics

An automotive circuit package combines electronic control functions and power function on a single circuit board substrate. Electronic components including signal level terminals are in one section of the substrate and an array of power terminals are in a second section of the substrate but sharing some common circuit paths carrying control signals. Supplemental conductors in the second section are selectively connected to power terminals to carry high current levels. Each terminal is a through access terminal for directly connecting conductors on the substrate, wiring harness connectors on one side of the substrate and fuses and relays on the other side of the substrate. In one embodiment the terminals have a male portion extending from one side of the substrate and a female portion on the other side. In another embodiment male and female portions are on the same side of the substrate and apertures in the substrate allow plugging into the female portions from the other side.

Substrate for Package

패키지 기판이 개시된다. 일면에 반도체칩이 실장되며, 타면이 메인기판에 실장되는 인쇄회로기판으로서, 기판부, 반도체칩과 전기적으로 연결되도록, 기판부의 일면에 형성되는 제1패드 및 제1 패드가 노출되도록 기판부의 일면에 형성되며, 제1 패드가 노출되는 패드영역 및 더미영역으로 구획되는 제1 솔더레지스트층을 포함하며, 더미영역은 패드영역 보다 얇은 것을 특징으로 하는 패키지 기판은, 상하의 열팽창계수의 대칭구조 형성에 기여하여, 휨을 방지할 수 있다. A package substrate is disclosed. A printed circuit board on which a semiconductor chip is mounted on one surface and the other surface is mounted on a main substrate, and the first pad and the first pad formed on one surface of the substrate are exposed to be electrically connected to the substrate and the semiconductor chip. And a first solder resist layer partitioned into a pad region and a dummy region to which the first pad is exposed, wherein the dummy region is thinner than the pad region. By contributing, warping can be prevented. 패키지, 휨, warpage, coreless Package, bending, warpage, coreless

Tightly-coupled PCB GNSS circuit and manufacturing method

A tightly-coupled printed circuit board (PCB) circuit includes components mounted on a PCB enabling smaller integrations using decoupled lines extending between reference layers, such as ground planes, form isolation islands on the PCB. The decouplers are capacitors, inductors and/or resistors in tandem with ground layers of the PCB. The isolated components can comprise high-frequency RF antennas and receivers, for example in a GNSS antenna-receiver circuit. Multiple antennas can be connected to one for more receivers with multiple, independent RF front end components by RF traces, which are either embedded within the PCB between the ground planes, or by surface microstrip antenna traces.

High frequency circuit block member, its manufacturing method, high refrequency module device and its manufaturing method

一种高频模块装置，具有包括一无源装置的一高频电路组合单元。许多单元布线层各自由一在其部位上具有一无源装置的绝缘层并由一图案线路构成，铺设在一虚拟基底上，并从虚拟基底释放以形成一安装在一母板(3)上的高频电路组合单元(2)。各个单元布线层的各主表面是经过整平的。无源装置和图案线路，形成在高频电路组合装置每一单元布线层的主表面上，可以以高精度形成以提高高频特性。高频电路组合单元(2)不需要一基础基底，从而实现了尺寸和成本的减小和降低。

Structure and wiring substrate

提出了一种结构体，包括：第一导体(102)和第二导体(103)，所述第一导体的至少一部分与所述第二导体的至少一部分彼此相对；第三导体(101)，所述第三导体插入到所述第一导体(102)与所述第二导体(103)之间，所述第三导体的至少一部分与所述第一导体(102)和所述第二导体(103)相对，并且所述第三导体具有第一开口(105)；互连(111)，设置在所述第一开口(105)的内部；以及导体过孔(121)，所述导体过孔与所述第一导体(102)和所述第二导体(103)电连接，并且与所述第三导体(101)电绝缘，其中所述互连(111)与所述第一导体(102)和所述第二导体(103)相对，所述互连的一端在所述第一开口(105)的边缘处与所述第三导体(101)电连接，并且所述互连的另一端形成为开路端。

Digital wireless narrow band radio

A network communication card is provided for facilitating ultra high frequency (UHF) radio communication between a terminal and a base station, the network communication card being in communication with an antenna and comprising a double-sided multilayer printed circuit board (PCB). The PCB comprises a digital interface, a receiver and a transmitter. The digital interface provides communication between the PCB and the terminal. The receiver receives incoming radio signals from the base station and processes the received signals for communication to the terminal via the digital interface. The transmitter transmits outgoing radio signals from the terminal via the digital interface to the base station and includes the following components. A digital synthesizer provides a highly accurate modulated carrier signal. An upconversion circuit increases the frequency of the carrier signal. A filter filters spurious content from the carrier signal. A phase locked loop (PLL) comprising a synthesizer and a voltage controlled oscillator (VCO) generates a transmission signal from the filtered carrier signal. A transmission circuit transmits the transmission signal via the antenna.

Digital wireless narrow band radio

A network communication card is provided for facilitating ultra high frequency (UHF) radio communication between a terminal and a base station, the network communication card being in communication with an antenna and comprising a double-sided multilayer printed circuit board (PCB). The PCB comprises a digital interface, a receiver and a transmitter. The digital interface provides communication between the PCB and the terminal. The receiver receives incoming radio signals from the base station and processes the received signals for communication to the terminal via the digital interface. The transmitter transmits outgoing radio signals from the terminal via the digital interface to the base station and includes the following components. A digital synthesizer provides a highly accurate modulated carrier signal. An upconversion circuit increases the frequency of the carrier signal. A filter filters spurious content from the carrier signal. A phase locked loop (PLL) comprising a synthesizer and a voltage controlled oscillator (VCO) generates a transmission signal from the filtered carrier signal. A transmission circuit transmits the transmission signal via the antenna.

Electronics-flat system for e.g. clothing article in textile structure, has electronic component arranged on upper and lower sides of printed circuit boards in dry area, and electrical connecting contacts arranged in dry area on sides

The system (1) has printed circuit boards (5, 6) with surfaces, which are provided with dry and wet areas (2, 3). An electronic component (8) is arranged on an upper side and/or a lower side of the boards in the dry area. Electrical connecting contacts (10a, 11a) are arranged in the dry area on the sides of the boards. Edgings (9, 15) completely cover and hermetically lock the boards together with the component and the contacts in the dry area upto free lying sections (10a-1, 11a-1) of the contacts. Electrical connecting lines (12, 13) electrically connect the component with the contacts. Independent claims are also included for the following: (1) an arrangement comprising an electronics-flat system (2) a textile structure comprising a textile unit.

Washable electronics flat system with free connection contacts for integration into a textile material or flexible material

Elektronik-Flachsystem (1) mit einem flächig ausgebildeten Flachelement (5, 6), dessen Oberfläche mindestens einen zusammenhängenden, als Trockenbereich bezeichneten, ersten Bereich und mindestens einen zusammenhängenden, als Nassbereich bezeichneten, zweiten Bereich aufweist, einem auf der Oberseite und/oder der Unterseite des Flachelementes (5, 6) in dem ersten Bereich oder in einem der ersten Bereiche angeordneten elektronischen Bauelement (8), zwei auf der Oberseite und/oder der Unterseite des Flachelementes (5, 6) in dem zweiten Bereich oder in einem der zweiten Bereiche angeordneten elektrischen Anschlusskontakten (10a, 11a), einer Einfassung (9, 15), welche in dem ersten Bereich oder in den ersten Bereichen das Flachelement (5, 6) samt dem elektronischen Bauelement (8) vollständig bedeckt und hermetisch abschließt und welche in dem zweiten Bereich oder in den zweiten Bereichen das Flachelement (5, 6) samt der zwei Anschlusskontakte (10a, 11a) bis auf einen freiliegenden Abschnitt (10a-1, 11a-1) jedes der beiden Anschlusskontakte (10a, 11a) vollständig bedeckt und hermetisch... Electronics flat system (1) with a planar flat element (5, 6), the surface of which has at least one contiguous first region designated as dry region and at least one contiguous second region designated as wet region, an electronic component (8) arranged on the upper side and / or the lower side of the flat element (5, 6) in the first region or in one of the first regions, two electrical connection contacts (10a, 11a) arranged on the upper side and / or the lower side of the flat element (5, 6) in the second region or in one of the second regions, an enclosure (9, 15) which completely covers and hermetically seals the flat element (5, 6) together with the electronic component (8) in the first region or in the first regions, and which flat element in the second region or regions (5, 6) together with the two connection contacts (10a, 11a) except for an exposed portion (10a-1, 11a-1) of ...

Multi-layer flexible printed circuit board and manufacturing method thereof

본 발명은 다층 연성회로기판 및 그 제조방법에 관한 것이다. The present invention relates to a multilayer flexible circuit board and a method of manufacturing the same. 본 발명은 대상 모듈의 디바이스에 대응되는 폭으로 형성된 본딩 시트; 상기 본딩 시트의 폭으로 상기 본딩 시트의 상측에 접착된 상부 베이스층; 상기 본딩 시트의 폭 이상으로 상기 본딩 시트의 하측에 접착된 하부 베이스층; 상기 상부 베이스층의 상면에 도포된 상부 커버레이; 및 상기 하부 베이스층의 저면에 도포된 하부 커버레이를 포함하는 다층 연성회로기판을 제공함에 있다.. The present invention is a bonding sheet formed in a width corresponding to the device of the target module; An upper base layer bonded to an upper side of the bonding sheet in a width of the bonding sheet; A lower base layer adhered to the lower side of the bonding sheet more than the width of the bonding sheet; An upper coverlay applied to an upper surface of the upper base layer; And it provides a multi-layer flexible circuit board comprising a lower coverlay applied to the bottom of the lower base layer. 다층 연성회로기판, 이방 전도성 필름 Multilayer Flexible Circuit Board, Anisotropic Conductive Film

Surface mount module

Electronic equipment manufactured on glass substrate, employs transparent, thin-film tracks in functional, e.g. display areas, whilst conventional thick film technology is employed in areas of circuitry

A pattern of transparent tracks (18) is produced near the functional section (11) on the glass substrate (10) using thin film technology. A second pattern of visible tracks (24) is formed on the glass substrate (10) using thick film technology. An Independent claim is included for the corresponding electrical equipment.

Printed circuit board with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna

A printed circuit device used in conjunction with inductive power and data transmission applications is formed substantially of ferrite material, with an inductive coil conductor formed around the substrate to increase the electromagnetic properties of the coil for both power and data transmission functions, thereby eliminating the need for a discrete ferrite core wire-wound coil to be connected to the circuit device.

Printed circuit board with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna

A printed circuit device used in conjunction with inductive power and data transmission applications is formed substantially of ferrite material, with an inductive coil conductor formed around the substrate to increase the electromagnetic properties of the coil for both power and data transmission functions, thereby eliminating the need for a discrete ferrite core wire-wound coil to be connected to the circuit device.

Modular LED strip lighting apparatus

A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use a multi-layer metal core printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification.

Circuit board module and electronic unit

本发明提供一种电路基板模块及具备该电路基板模块的电子设备，可减小在抵抗不需要的辐射弱的脆弱电路和其以外的电路之间的辐射带来的不良影响，并且可减小作为整体向模块外部的辐射。该电路基板模块具备：具有安装面的基板(1)；分别安装于安装面的第一电子零件(2)及第二电子零件(3)、包围第一电子零件(2)和第二电子零件(3)且安装于安装面的具有导电性的第一框体(4)；包围第二电子零件(3)且安装于第一框体(4)的内侧的安装面的具有导电性的第二框体(5)；在第一框体(4)和第二框体(5)之间与第一电子零件、安装面、第一框体(4)和第二框体(5)紧贴的第一树脂部(6)；在第二框体(5)的内侧与第二电子零件(3)的安装面和第二框体(5)紧贴的第二树脂部(7)；覆盖第一电子零件、第二电子零件(3)和第二框体(5)且具有导电性并与第一框体(4)连接的第一盖部(8)；通过第二框体(5)的接点连接且覆盖第二框体(5)的第二盖部(9)。

Medical device substrate and medical device

System and method for attenuating the effect of ambient light on an optical sensor

본 발명은 광센서에 대한 주변광의 영향을 약화시키며 주변광에 대해 정량적으로 측정하고 보상하기 위한 시스템들 및 방법들을 제공한다.

Printed circuit board and method for manufacturing the same

본 발명은 인쇄회로기판에 대한 것으로, 본 발명의 실시예에 따른 인쇄회로기판은 코어층, 코어층 상에 적층된 복수의 회로층들을 포함하되, 회로층들 중 어느 하나는 메쉬 패턴 및 솔리드 패턴을 포함하고, 회로층들 중 다른 하나는 메쉬 패턴에 대향되는 제1 시그날 패턴 및 솔리드 패턴에 대향되며 제1 시그날 패턴에 비해 고속 신호선을 갖는 제2 시그날 패턴을 포함한다. A printed circuit board according to an embodiment of the present invention includes a core layer, a plurality of circuit layers stacked on the core layer, and one of the circuit layers includes a mesh pattern and a solid pattern And the other of the circuit layers includes a first signal pattern opposing the mesh pattern and a second signal pattern opposing the solid pattern and having a high speed signal line relative to the first signal pattern.

High frequency circuit block member, its manufacturing method, high refrequency module device and its manufaturing method

一种高频模块装置，具有包括一无源装置的一高频电路组合单元。许多单元布线层—各自由一在其部位上具有一无源装置的绝缘层并由一图案线路构成，铺设在一虚拟基底上，并从虚拟基底释放以形成一安装在一母板(3)上的高频电路组合单元(2)。各个单元布线层的各主表面是经过整平的。无源装置和图案线路，形成在高频电路组合装置每一单元布线层的主表面上，可以以高精度形成以提高高频特性。高频电路组合单元(2)不需要一基础基底，从而实现了尺寸和成本的减小和降低。

System and method for attenuating the effect of ambient light on an optical sensor

本发明提供用于削弱环境光对光学传感器的影响，以及用于定量测量和补偿环境光的系统和方法。

Multilayer wiring board and method of manufacturing the same

(57)【要約】 【課題】 ファインピッチな導体パターンの寸法安定性 を確保できるとともに、材料選定面からのプロセス上の 制約を解消し、更に、生産コストを低減できる多層配線 基板の製造方法および多層配線基板を提供する。 【解決手段】 金属製の支持シート４０上に形成した第 ２配線基板２２および接着材料層２３を、支持シート４ ０を用いて第１配線基板２１の所定領域上に部分的に積 層する。第２配線基板２２を積層後、支持シート４０は 最終的にエッチング除去する。第２配線基板２２は、第 １配線基板２１上の多層化が必要な部位にのみ積層し、 第２配線基板２２の構成材料の使用量を低減する。

Backlight unit

提供一种背光单元，在安装多个点状光源的安装基板上还安装点状光源以外的电子部件的情况下，不使背光单元大型化就能抑制亮度不均匀的产生。背光单元(10)具备PWB(6)，该PWB(6)至少包括沿着导光板(3)的侧面(3a)延伸的LED安装区域(6a)。并且，在PWB(6)的LED安装区域(6a)的一侧端部设有FPC安装区域(6b)，并且，在PWB(6)的与LED安装区域(6a)的一侧相反的另一侧端部设有沿着与导光板(3)的侧面(3a)垂直的侧面(3b)延伸的电容器安装区域(6c)。

Camera module and molded circuit board assembly, circuit board and application thereof

본 발명은 카메라 모듈 및 이의 몰딩 회로 기판 어셈블리, 회로 기판 및 응용에 관한 것으로서, 상기 회로 기판은 디지털 회로부, 아날로그 회로부 및 기판을 포함한다. 상기 디지털 회로부와 상기 아날로그 회로부는 각각 상기 기판에 형성되고, 상기　디지털 회로부와 상기 아날로그 회로부는 서로 도통되고, 여기서 상기 디지털 회로부의 회로가 발생하는 전자파가 상기 아날로그 회로부에 의해 전송되고 처리되는 전기적 신호가 간섭받지 않도록, 상기 아날로그 회로부의 적어도 일부와 상기 디지털 회로부 사이에 안전 거리를 구비함으로써, 상기 회로 기판이 전기적 신호를 전송하고 처리하는 안정성과 신뢰성을 향상시킨다. The present invention relates to a camera module and a molded circuit board assembly, circuit board and application thereof, wherein the circuit board includes a digital circuit part, an analog circuit part and a board. The digital circuit unit and the analog circuit unit are each formed on the substrate, and the digital circuit unit and the analog circuit unit are in conduction with each other, wherein electromagnetic waves generated by the circuit of the digital circuit unit are transmitted and processed by the analog circuit unit. By providing a safe distance between at least a portion of the analog circuit unit and the digital circuit unit to avoid interference, stability and reliability in which the circuit board transmits and processes electrical signals is improved.

Modular LED circuit board

A modular LED circuit board consisting of a circuit board being frangible along a first and second set of intersecting fragmentation lines, the fragmentation lines dividing the circuit board into a plurality of sections. A plurality of LEDs are mounted to the circuit board, at least one LED being mounted to each section, each section having a sub-circuit operatively coupled to the LED, each sub-circuit having a positive and negative lead. The sub-circuits of adjacent sections are operatively coupled together by frangible leads.

Shielding structures for system-in-package assemblies in portable electronic devices

A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.

Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices

A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

Hybrid ground grid for printed circuit board

Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines include groups of substantially parallel ground lines configured such that the groups of ground lines are positioned in transverse arrangement with other groups of ground lines formed on the same level. Such implementations have many uses, including, but not limited to, the ability to more efficiently route signal lines and connect electrical components on a circuit board.

Printed circuit board with embedded cavity capacitor

캐비티 캐패시터가 내장된 인쇄회로기판이 개시된다. 본 발명의 실시예에 따르면 각각 전원층 및 접지층으로 이용될 2개의 전도층과, 상기 2개의 전도층 사이에 개재되는 제1 유전층을 포함하는 인쇄회로기판에 있어서, 상기 2개의 전도층을 각각 제1 전극 및 제2 전극으로 이용하고, 상기 제1 전극과 상기 제2 전극 사이에 개재되는 제2 유전층이 상기 제1 유전층보다 낮은 단차(段差)를 갖도록 형성된 캐비티 캐패시터가 상기 인쇄회로기판에 위치하는 노이즈 근원지와 노이즈 차폐 목적지 간의 노이즈 전달 가능 경로 사이에 1개 이상 배치되는 것을 특징으로 하는 캐비티 캐패시터가 내장된 인쇄회로기판이 제공된다. 본 발명에 의하면 인쇄회로기판에 내장된 캐비티 캐패시터를 전자기 밴드갭 구조물(EBG structure)로서 이용함으로써, 아날로그 회로와 디지털 회로 등을 포함하여 다양한 전자부품, 소자가 탑재되는 인쇄회로기판에 있어서 혼합 신호(mixed signal) 문제를 해결할 수 있는 효과가 있다. 인쇄회로기판, 캐비티, 캐패시터, 내장.

Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna

A printed circuit device used in conjunction with inductive power and data transmission applications is formed substantially of ferrite material, with an inductive coil conductor formed around the substrate to increase the electromagnetic properties of the coil for both power and data transmission functions, thereby eliminating the need for a discrete ferrite core wire-wound coil to be connected to the circuit device.

Structural body and wiring substrate

互いに少なくとも一部が対向する第１導体（１０２）および第２導体（１０３）と、第１導体（１０２）および第２導体（１０３）に挟まれ、少なくとも一部が第１導体（１０２）および第２導体（１０３）と対向し、かつ、第１開口（１０５）を有する第３導体（１０１）と、第１開口（１０５）の内部に設けられた配線（１１１）と、第１導体（１０２）および第２導体（１０３）と電気的に接続され、かつ、第３導体（１０１）と電気的に絶縁された導体ビア（１２１）とを備え、配線（１１１）は、第１導体（１０２）および第２導体（１０３）と対向し、その一端が第１開口（１０５）の縁で第３導体（１０１）と電気的に接続され、他端が開放端となっていることを特徴とする構造体。

METHOD FOR MANUFACTURING A PRINTED CIRCUIT

L'invention concerne un procédé de fabrication d'un circuit imprimé comprenant un premier circuit principal (N) ayant une première structure caractérisé en ce qu'il comporte une succession d'étapes adaptées à insérer un ou plusieurs circuits imprimés secondaires (RF) présentant une structure différente de celle du circuit imprimé principal, lesdites étapes comprenant : • une étape au cours de laquelle on définit une ou plusieurs cavités (40) adaptées à recevoir le ou les inserts, • une étape de préparation du ou des inserts (20) comprenant sur au moins une face destinée à être en contact avec une paroi (40f) de la cavité des motifs gravés et une métallisation, et un ou plusieurs vias (20i), • une étape d'insertion du ou des inserts (20) dans la ou les cavités (40) dudit circuit principal, • une étape mise en place d'une résine au niveau de la ou des cavités (40) afin d'assurer le maintien de l'ensemble formé par le circuit principal et le ou les circuits secondaires, • une étape de stratification de l'ensemble formé par le ou les inserts disposés dans le circuit principal. The invention relates to a method for manufacturing a printed circuit comprising a first main circuit (N) having a first structure characterized in that it comprises a succession of steps adapted to insert one or more secondary printed circuits (RF) presenting a structure different from that of the main printed circuit, said steps comprising: a step during which one or more cavities (40) are defined adapted to receive the inserts, a step of preparation of the inserts (20) comprising on at least one face intended to be in contact with a wall (40f) of the cavity of the etched patterns and a metallization, and one or more vias (20i), • a step of insertion or inserts (20) in the cavity or cavities (40) of said main circuit, • a step of placing a resin at the level of the cavity or cavities (40) in order to maintain the assembly formed by the main circuit and the or ...

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD FOR A VEHICLE MIRROR

POWER SUPPLY MODULE FOR A HEATING RADIATOR AND HEATING RADIATOR EQUIPPED WITH SUCH A MODULE

L'invention concerne un radiateur de chauffage (1) comprenant un module d'alimentation (2) et un corps de chauffe (3), ledit module d'alimentation (2) comprenant une carte de circuit imprimé (20), une pluralité de commutateurs électroniques (21) et un ou des connecteurs (22) à un circuit externe, ladite carte de circuit imprimé (20) comprenant une première zone (200) assurant une connexion électrique avec le corps de chauffe (3), une deuxième zone (210) assurant une connexion électrique avec les commutateurs électroniques (21) et une troisième zone (220) assurant une connexion électrique avec le ou les connecteurs (22), lesdites première, deuxième et troisième zones étant situées côte à côte dans cet ordre dans une direction transversale à un plan d'extension du corps de chauffe (2).  The invention relates to a heating radiator (1) comprising a supply module (2) and a heating body (3), said supply module (2) comprising a printed circuit board (20), a plurality of electronic switches (21) and one or more connectors (22) to an external circuit, said printed circuit board (20) comprising a first zone (200) ensuring an electrical connection with the heating body (3), a second zone ( 210) ensuring an electrical connection with the electronic switches (21) and a third zone (220) ensuring an electrical connection with the connector (s) (22), said first, second and third zones being located side by side in this order in a direction transverse to an extension plane of the heating body (2).

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD FOR A VEHICLE MIRROR

La présente invention a trait à un procédé de fabrication d'une carte de circuit imprimé (10) comprenant un substrat (2) et un circuit électrique (8), en particulier pour un dispositif rétroviseur d'un véhicule à moteur, comprenant les étapes consistant à : • fabriquer une pluralité de parties de substrat (2a, 2b) ; • choisir au moins deux des parties de substrat (2a, 2b) ; et • connecter les parties de substrat choisies (2a, 2b) et fournir les parties de substrat connectées (2a, 2b) avec le circuit (8). The present invention relates to a method of manufacturing a printed circuit board (10) comprising a substrate (2) and an electrical circuit (8), in particular for a rear view mirror device of a motor vehicle, comprising the steps comprising: • fabricating a plurality of substrate portions (2a, 2b); • select at least two of the substrate portions (2a, 2b); and • connecting the selected substrate portions (2a, 2b) and supplying the connected substrate portions (2a, 2b) with the circuit (8).

Plural layers coating for the system in package component in portable electronic device

本发明公开了一种被封装到系统级封装组件中的便携式电子设备(600)。该便携式电子设备可包括基板(614)和被安装在该基板上并且被包括在一个或多个子系统中的多个部件(601‑604)。通过在部件上方沉积绝缘层(616)可减少或消除子系统之间的或来自外部源的干扰，从而在子系统之间形成窄沟槽(630)并且在绝缘层上沉积多层薄膜叠堆(640,642,644,646)的一个或多个层并且填充沟槽。在一些示例中，该多层薄膜叠堆可包括粘附层(640)、屏蔽层(642)、保护层(644)、和美化层(646)。在一些示例中，该多层薄膜叠堆可包括多功能层诸如保护和美化层。

Printed circuit board for electrical circuit.

Camera module and its molding circuit board assembly, circuit board and application

본 발명은 카메라 모듈 및 이의 몰딩 회로 기판 어셈블리, 회로 기판 및 응용에 관한 것으로서, 상기 회로 기판은 디지털 회로부, 아날로그 회로부 및 기판을 포함한다. 상기 디지털 회로부와 상기 아날로그 회로부는 각각 상기 기판에 형성되고, 상기　디지털 회로부와 상기 아날로그 회로부는 서로 도통되고, 여기서 상기 디지털 회로부의 회로가 발생하는 전자파가 상기 아날로그 회로부에 의해 전송되고 처리되는 전기적 신호가 간섭받지 않도록, 상기 아날로그 회로부의 적어도 일부와 상기 디지털 회로부 사이에 안전 거리를 구비함으로써, 상기 회로 기판이 전기적 신호를 전송하고 처리하는 안정성과 신뢰성을 향상시킨다. The present invention relates to a camera module and a molded circuit board assembly, circuit board and application thereof, wherein the circuit board includes a digital circuit part, an analog circuit part and a board. The digital circuit unit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are in conduction with each other, wherein electromagnetic waves generated by the circuit of the digital circuit unit are transmitted and processed by the analog circuit unit. By providing a safe distance between at least a portion of the analog circuit portion and the digital circuit portion to avoid interference, the stability and reliability of the circuit board transmitting and processing electrical signals is improved.

TRANSISTOR CONTROL UNIT FOR SERVOMOTOR

UNITE DE COMMANDE A TRANSISTORS DESTINEE A UN SERVOMOTEUR ET COMPRENANT UN BLOC DE COMMANDE ELECTRONIQUE, CONSTITUE PAR DES COMPOSANTS DISPOSES SUR UNE FACE D'UNE PLAQUE DU TYPE CARTE EUROPA DOUBLE, AINSI QU'UN CIRCUIT IMPRIME SUR LA FACE ARRIERE DE LA PLAQUE ET UN BLOC DE PUISSANCE DISTINCT DU BLOC DE COMMANDE, FORMANT L'ETAGE FINAL ET ESSENTIELLEMENT CONSTITUE PAR DES TRANSISTORS DE PUISSANCE MONTES AVEC LES DIODES CORRESPONDANTES SUR UN RADIATEUR. LE RADIATEUR 8 PORTANT LES TRANSISTORS DE PUISSANCE 11 ET LES DIODES 12 EST MONTE SUR LA MEME PLAQUE 1 ET SUR LA MEME FACE QUE LES COMPOSANTS DU BLOC DE COMMANDE 2 A COTE DE CES DERNIERS; LES CONNEXIONS ENTRE LES BLOCS DE PUISSANCE 9 ET DE COMMANDE 2 SONT DES CONDUCTEURS IMPRIMES SUR LA FACE ARRIERE DE LA PLAQUE 1; ET CERTAINES RESISTANCES DU BLOC DE COMMANDE 2, DE VALEURS EGALES OU VOISINES, SONT REALISEES SOUS FORME DE RESEAUX DE RESISTANCES 6, LOGES DANS DES BOITIERS RECTANGULAIRES PLATS, DONT LES FACES PRINCIPALES SONT PERPENDICULAIRES A LA PLAQUE 1. TRANSISTOR CONTROL UNIT INTENDED FOR A SERVOMOTOR AND INCLUDING AN ELECTRONIC CONTROL BLOCK, CONSTITUTED BY COMPONENTS ARRANGED ON ONE SIDE OF A DOUBLE EUROPA CARD TYPE PLATE, AS WELL AS A CIRCUIT PRINTED ON THE REAR FACE OF THE PLATE AND A POWER BLOCK DISTINCT FROM THE CONTROL BLOCK, FORMING THE END STAGE AND ESSENTIALLY CONSTITUTED BY POWER TRANSISTORS MOUNTED WITH THE CORRESPONDING DIODES ON A RADIATOR. THE RADIATOR 8 CARRYING THE POWER TRANSISTORS 11 AND THE DIODES 12 IS MOUNTED ON THE SAME PLATE 1 AND ON THE SAME FACE AS THE COMPONENTS OF THE CONTROL BLOCK 2 NEXT TO THE LATTER; THE CONNECTIONS BETWEEN POWER 9 AND CONTROL BLOCKS 2 ARE CONDUCTORS PRINTED ON THE REAR FACE OF PLATE 1; AND CERTAIN RESISTORS OF CONTROL BLOCK 2, OF EQUAL OR NEARLY VALUES, ARE MADE IN THE FORM OF RESISTOR NETWORKS 6, HOUSED IN FLAT RECTANGULAR BOXES, THE MAIN FACES OF WHICH ARE PERPENDICULAR TO PLATE 1.

Control module for high voltage electrical device

Module de commande pour dispositif électrique haute tension pour véhicule automobile L’invention concerne un module de commande (2) pour un dispositif électrique haute tension, notamment pour véhicule automobile, ledit module de commande (2) comportant un circuit imprimé (9), ledit circuit imprimé (9) comprenant:- une zone (15) alimentée en basse tension, cette zone (15) s’étendant sur au moins 50 % de la périphérie du circuit imprimé (9), - une zone (17) alimentée en haute tension, caractérisé en ce que - la zone (15) alimentée en basse tension s’étend de manière continue le long de la périphérie du circuit imprimé (9), et en ce que- la zone (15) alimentée en basse tension entoure au moins partiellement la zone (17) alimentée en haute tension. L’invention concerne également un dispositif (1) de chauffage comportant un boîtier (7) et un tel module (2) de commande. Figure pour l’abrégé : Fig. 1 Control module for a high voltage electrical device for a motor vehicle The invention relates to a control module (2) for a high voltage electrical device, in particular for a motor vehicle, said control module (2) comprising a printed circuit (9), said printed circuit (9) comprising:- a zone (15) supplied with low voltage, this zone (15) extending over at least 50% of the periphery of the printed circuit (9), - a zone (17) supplied with high voltage, characterized in that - the area (15) supplied with low voltage extends continuously along the periphery of the printed circuit (9), and in that- the area (15) supplied with low voltage surrounds least partially the zone (17) supplied with high voltage. The invention also relates to a heating device (1) comprising a housing (7) and such a control module (2). Figure for the abstract: Fig. 1

Systems and methods for obtaining large creepage isolation on printed circuit boards

An electrical circuit with large creepage isolation distances is provided. In some embodiments, the electrical circuit is capable of increasing creepage isolation distances by many multiples over traditional electrical circuits. In one embodiment, an electrical circuit comprises a ground circuit optically coupled to a floating circuit, and an isolated circuit optically coupled to the floating circuit. The circuits can be optically coupled with opto-isolators, for example. The isolated circuit can have a creepage isolation distance at least twice as large as a traditional circuit. In some embodiments, "n" number of floating circuits can be optically coupled between the ground circuit and the isolated circuit to increase the total creepage isolation distance by a factor of "n". Methods of use are also described.

THERMAL INSULATION ARRANGEMENT OF AN INDICATOR

Printed circuit card for electrical circuits

The printed circuit card has a plate of insulating material which has, on at least one face, a number of conducting tracks, with at least one machined privileged line (L) crossing the tracks (2). Each track has two holes (3,4), one on either side of the line that crosses the conducting tracks, and is reinforced with a metallic die (5) on at least one side of the card.The holes can also have metallic discs on both sides of the card. The metallisation of the holes allows galvanic liaison with the conducting tracks.

Multi-layer circuit wiring board for data processing equipment

The board, for use esp. in data processing equipment, consists of a first signal wiring layer, an electric current feed layer, and a second wiring layer between the two. The second layer has a mass layer zone (32) which is of the same proportion as a signal wiring layer first zone (41) on the first layer and occupies a corresponding position to it. The first layer has a second wiring zone in its other position. The first layer also incorporates for a different signal with another amplitude and feed tension. The board also has insulating layers interleaved between the current feed and wiring layers.

Microelectronic substrate for encapsulation function alternately

本公开内容涉及被制造为具有重叠的连接区的微电子衬底，例如插入器、主板、测试平台等，以使得不同的微电子设备（例如微处理器、芯片组、图形处理设备、无线设备、存储器设备、专用集成电路等）可以交替地连接到微电子衬底，以形成功能的微电子封装。

Wiring substrate, method of manufacturing the same and semiconductor device

A wiring substrate (10) equipped with a rerouted wiring (17) having one end connected to an electronic-part mounting pad (16) for electrically connecting an electronic part and another end connected to an external-connection terminal (12). In the wiring substrate, a low-elasticity underlayer (3) made of a material having a lower modulus of elasticity than that of a base material (1) of the wiring substrate (10) is disposed between the base material (1) of the wiring substrate and the electronic-part mounting pad (16) and the rerouted wiring (17). A method of manufacturing the wiring substrate and a semiconductor device using the wiring substrate are also disclosed.

Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof

Transmission of electric and optical signal, realization of high-speed and high capacity of transmission of information signals. A base substrate section having an interconnect layer formed on an insulating substrate by a printed circuit process; a micro interconnect circuit section having a micro electrical interconnect layer which is finer than the interconnect layer of the base substrate section, formed on an insulating resin layer by a semiconductor process; and an optical interconnect circuit section adapted to transfer and/or receive an optical signal and provided with an optical wave-guide having an input section and an output section of a optical signal at opposite ends thereof; and at least a pair of optical elements composed of a light emitting device with a light emitting section thereof facing the input section and a photo detecting device with a photo detecting section thereof facing the output section are provided and the micro interconnect circuit section and the optical interconnect circuit section are mounted on the base substrate section.

Control unit for electric motor and vehicle steering system including the same

本发明提供电动马达的控制装置以及具备它的车辆用转向操作装置。在电路基板（22）划分区域地设置有形成了控制电路图案（41）的控制图案部（43）、以及形成了驱动电路图案（42）的驱动图案部（44）。另外，在基座（23）形成凹部（45），以保持驱动电路相对于基座（23）的绝缘并且控制图案部（43）配置于凹部（45）的上方的方式将驱动图案部（44）固定于基座（23），由此在控制图案部（43）与凹部（45）之间形成了能够安装电路元件（47）的空间（S）。

Component mounting board structure

Microelectronic substrate for alternate package functionality

The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.