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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 58643. Отображено 100.
12-01-2012 дата публикации

System-in-a-package based flash memory card

Номер: US20120007226A1
Автор: Hem Takiar, Michael W. Patterson, Robert C. Miller, Shrikar Bhagath, Warren Middlekauff
Принадлежит: SanDisk Technologies LLC

A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

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Номер записи: 1
19-01-2012 дата публикации

Printed wiring board and a method of production thereof

Номер: US20120012464A1
Автор: Tomoyuki Ikeda
Принадлежит: Ibiden Co Ltd

A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.

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Номер записи: 2
19-01-2012 дата публикации

Control device

Номер: US20120014070A1
Автор: Yasuyuki Wakita
Принадлежит: JTEKT Corp

A circuit board unit of an ECU has an upper surface on which semiconductor elements are installed, a lower surface that is on the opposite side of the circuit board unit from the upper surface, and a cutout portion that is formed below the upper surface. A power module includes a conductive protruding and an electrically insulating main portion that holds the protruding piece. The conductive protruding piece is inserted in the cutout portion to support the circuit board unit, and is electrically connected to the semiconductor elements.

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Номер записи: 3
02-02-2012 дата публикации

Electronics substrate with enhanced direct bonded metal

Номер: US20120026692A1
Автор: Donald Lynn Smith, Sy-Jenq Loong
Принадлежит: Wolverine Tube Inc

A substrate for electronic components includes a ceramic tile and a cooling metal layer. The cooling metal layer can include copper, aluminum, nickel, gold, or other metals. The cooling metal layer has an enhanced surface facing away from the ceramic tile, where the enhanced surface includes either fins or pins. Electronic components can be connected to the substrate on a surface opposite the cooling metal layer.

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Номер записи: 4
02-02-2012 дата публикации

Circuit board of portable electronic device

Номер: US20120026699A1
Автор: Ming-Yuan Hsu
Принадлежит: Hon Hai Precision Industry Co Ltd

A circuit board includes a main body and a connecting member mounted on the main body. The main body defines a separating groove and is divided into two segments by the separating groove, such that the main body is broken along the separating groove to separate the two segments from each other when a force is applied thereto. When the main body is broken along the separating groove to separate the two segments from each other, the connecting member electronically connects the two segments to each other.

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Номер записи: 5
09-02-2012 дата публикации

Multi-Layer Circuit Assembly And Process For Preparing The Same

Номер: US20120031655A1
Автор: Alan G. Wang, Kevin C. Olson
Принадлежит: PPG Industries Ohio Inc

A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; (c) removing the dielectric coating in a predetermined pattern to expose sections of the substrate; (d) applying a layer of metal to all surfaces to form metallized vias through and/or to the electrically conductive core; (e) applying a resist to the metal layer to form a photosensitive layer thereon; (f) imaging resist in predetermined locations; (g) developing resist to uncover selected areas of the metal layer; and (h) etching uncovered areas of metal to form an electrical circuit pattern connected by the metallized vias.

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Номер записи: 6
09-02-2012 дата публикации

Touch screen and manufacturing method thereof

Номер: US20120031746A1
Автор: Beom-Mo Koo, Dong-Wook Lee, Hyeon Choi, In-Seok Hwang, Ji-Young Hwang, Ki-Hwan Kim, Min-Choon Park, Sang-ki Chun, Seung-Heon Lee, Su-Jin Kim, Yong-Koo Son, Young-Jun Hong
Принадлежит: LG Chem Ltd

The present invention provides a method of manufacturing a touch screen, comprising the steps of: a) forming a conductive layer on a substrate; b) forming an etching resist pattern on the conductive layer; and c) forming a conductive pattern having a line width smaller than the line width of the etching resist pattern by over-etching the conductive layer by using the etching resist pattern and a touch screen manufactured by the method. According to the present invention, a touch screen comprising a conductive pattern having an ultrafine line width can be economically and efficiently provided.

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Номер записи: 7
16-02-2012 дата публикации

Overmolded electronic module with an integrated electromagnetic shield using smt shield wall components

Номер: US20120036710A1
Автор: Larry D. Pottebaum, Philip H. Thompson
Принадлежит: Skyworks Solutions Inc

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.

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Номер записи: 8
16-02-2012 дата публикации

Thermal expansion suppressing member and anti-thermally-expansive member

Номер: US20120040196A1
Автор: Hisato Yabuta, Kaoru Miura, Makoto Kubota, Masaki Azuma, Yoshihiko Matsumura, Yuichi Shimakawa
Принадлежит: Canon Inc, KYOTO UNIVERSITY

Provided are a thermal expansion suppressing member having negative thermal expansion properties and a metal-based anti-thermally-expansive member having small thermal expansion. More specifically, provided are a thermal expansion suppressing member, including at least an oxide represented by the following general formula (1), and an anti-thermally-expansive member, including a metal having a positive linear expansion coefficient at 20° C., and a solid body including at least an oxide represented by the following general formula (1), the metal and solid being joined to each other: (Bi 1-x M x )NiO 3 (1) where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02≦x≦0.15.

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Номер записи: 9
16-02-2012 дата публикации

Method and apparatus for determining disposition of via hole on printed circuit board

Номер: US20120041710A1
Автор: Ming-Chin Tsai
Принадлежит: King Yuan Electronics Co Ltd

A method for determining disposition of via hole on printed circuit board (PCB), said method comprising the steps of: providing a PCB on which is disposed with a geometric layout and a via hole; providing a line on said PCB for intersecting said geometric layout to form a plurality of points of intersection; defining line segments by segmenting said line at each of said points of intersection to form a plurality of line segments; deleting some of said line segments having one end not being point of intersection for said geometric layout to form a plurality of segmented regions; searching a closed region by repeatedly searching region from any one of the points in said plurality of segmented regions; determining whether a closed region is a smallest closed region; determining whether a via hole is located within said smallest closed region.

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Номер записи: 10
23-02-2012 дата публикации

Flexible circuit structure with stretchability and method of manufacturing the same

Номер: US20120043115A1
Автор: Ying-Ching Shih, Yu-Hua Chen
Принадлежит: Industrial Technology Research Institute ITRI

In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate.

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Номер записи: 11
08-03-2012 дата публикации

Epoxy resin blend

Номер: US20120055704A1
Автор: Chih Wei Liao, Hsien Te Chen, Hsuan Hao HSU, Tsung Fan TSENG, Tsung Hsein LIN
Принадлежит: Taiwan Union Technology Corp

Embodiments of the present disclosure set forth a sintered talc powder. The sintered talc powder comprising a first X-ray diffraction peak from about 29° to about 30° and having a first intensity and a second X-ray diffraction peak from about 25° to about 27° and having a second intensity, wherein the first intensity is greater than the second intensity.

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Номер записи: 12
08-03-2012 дата публикации

Wiring Design Support Apparatus and Wiring Design Support Method

Номер: US20120060134A1
Автор: Akihisa Shimizu, Takahiro SUGAI
Принадлежит: Individual

According to one embodiment, a wiring design support apparatus comprises a display, a drawing module, and a data creation module. The display is configured to display a three-dimensional object. The drawing module is configured to draw a line connecting two points on a surface of the three-dimensional object displayed by the display. The data creation module is configured to create first three-dimensional data indicating a wiring based on the line drawn by the drawing module.

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Номер записи: 13
15-03-2012 дата публикации

Metal pattern formation system

Номер: US20120060708A1
Автор: Chien-Ho Huang, Ching-Yu Tso, Hsiou-Jeng Shy, Li-Jiuan Chen, Shang-Wanq Yeh
Принадлежит: Individual

The invention discloses a metal pattern formation system produced in the following steps: an organic liquid is first printed on a substrate to form a base pattern. A metal is then evaporated to generate several metal particles for covering the printed substrate. At last, the substrate is heated to vaporize the base pattern, and the metal particles adhered to the substrate forms a metal pattern complementary to the base pattern.

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Номер записи: 14
15-03-2012 дата публикации

Thermal interface material application for integrated circuit cooling

Номер: US20120063094A1
Автор: Dong G. Kam, Duixian Liu, Michael A. Gaynes, Scott K. Reynolds
Принадлежит: International Business Machines Corp

Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.

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Номер записи: 15
15-03-2012 дата публикации

Light source device and display device provided with same

Номер: US20120063150A1
Автор: Hideto Takeuchi
Принадлежит: Individual

A light source device includes a circuit board having a LED mounted on a surface, a lens attached to the surface so as to diffuse light emitted from the LED, a reflecting sheet having a through hole in the inside of which the lens is disposed and reflecting light emitted from the LED at an opposite side of the surface, and a restricting member which is disposed at one of an edge of the through hole in the reflecting sheet and the lens, and restricts a deviation of the reflecting sheet in a direction departing from the surface.

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Номер записи: 16
15-03-2012 дата публикации

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding

Номер: US20120064672A1
Автор: Charles W.C. Lin, Chia-Chung Wang
Принадлежит: Individual

A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate, then flowing the adhesive between the post and the substrate in the aperture, solidifying the adhesive, then grinding the post and the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

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Номер записи: 17
22-03-2012 дата публикации

Apparatus and method for wet processing substrate

Номер: US20120067848A1
Автор: Chao-Wen Lin
Принадлежит: Foxconn Advanced Technology Inc

An exemplary wet processing apparatus includes a tank, a conveyor configured for conveying a substrate, and a spraying system. The tank receives a wet processing liquid. The conveyor includes a first conveying portion, a second conveying portion, and a third conveying portion. The first conveying portion is in the tank and conveys the substrate in the wet processing liquid. The second conveying portion is obliquely interconnected between the first and third conveying portions. The third conveying portion conveys the substrate above the wet processing liquid in the tank. The spraying system is above the third conveying portion, sprays the wet processing liquid onto the substrate on the third conveying portion.

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Номер записи: 18
29-03-2012 дата публикации

Multi-layered substrate

Номер: US20120073871A1
Автор: Bernd Karl Appelt, Ming-Chiang Lee, You-Lung Yen, Yuan-Chang Su
Принадлежит: Advanced Semiconductor Engineering Inc

The present invention directs to double-sided multi-layered substrate a base, at least a through-hole passing through the base, patterned first and second metal layers formed on the two opposite surfaces of the base, and first and second plating layers. The first plating layer covers a sidewall of the through-hole and the bottom surface surrounding a bottom opening of the through hole. The second plating layer covers the first plating layer and the top surface surrounding a top opening of the through hole.

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Номер записи: 19
05-04-2012 дата публикации

Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles

Номер: US20120082825A1
Автор: Jeffrey H. Tokie, Lijun Zu, Matthew H. Frey, Myungchan Kang
Принадлежит: 3M Innovative Properties Co

Method of patterning a substrate are described including a method of providing a substrate comprising a metalized surface having a self-assembled monolayer patterned region and unpatterned region; and wet etching the metalized surface in a liquid etchant agitated with bubbling gas to remove metal from the unpatterned regions to form a metal pattern. Also described are metal patterned article including an article comprising a substrate and an etched microcontact printed metal pattern disposed on the substrate wherein the pattern has a thickness of at least 100 nanometers and a pattern feature uniformity of at least 50% for an area of at least 25 cm 2 .

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Номер записи: 20
12-04-2012 дата публикации

Method and device of electromagnetics

Номер: US20120088377A1
Автор: Fredrik Ohlsson
Принадлежит: Huawei Technologies Co Ltd

A method and device for electromagnetic shielding is disclosed. An example arrangement includes a first and a second printed circuit board arranged adjacently and having an electromagnetic shield cover. An electrically conductive plug electrically provides an interconnection of the electromagnetic shielding.

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Номер записи: 21
26-04-2012 дата публикации

Chip package and manufacturing method thereof

Номер: US20120098109A1
Автор: Dongkyun Ko, Jaesun An, Jung Lee
Принадлежит: Individual

A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.

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Номер записи: 22
26-04-2012 дата публикации

Transparent substrate with thin film and method for manufacturing transparent substrate with circuit pattern wherein such transparent substrate with thin film is used

Номер: US20120100774A1
Автор: Eiji Morinaga, Hiroshi Sakamoto, Kenichi Ebata, Kenji Tanaka, Koji Nakagawa, Reo USUI, Ryohei Satoh, Satoru Takaki, Takamitsu Isono
Принадлежит: Asahi Glass Co Ltd

An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for manufacturing a transparent substrate bearing a circuit pattern, which comprises irradiating a thin-film-attached transparent substrate comprising a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×10 19 /cm 3 or higher, with a laser light having a wavelength of 1,064 nm to form a circuit pattern on the transparent substrate.

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Номер записи: 23
03-05-2012 дата публикации

Method of manufacturing multilayer wiring substrate

Номер: US20120102732A1
Автор: Shinnosuke Maeda
Принадлежит: NGK Spark Plug Co Ltd

A method of manufacturing a multilayer wiring substrate is provided. A foil of a metal-foil-clad resin insulation material is brought into contact with a foil of a metal-foil-clad support substrate. A peripheral edge portion of the resin insulation material exposed as a result of removal of a peripheral edge portion of the foil is adhered to the foil of the support substrate. A plurality of conductor layers and a plurality of resin insulation layers are laminated so as to obtain a laminate structure having a wiring laminate portion, which is to become the multilayer wiring substrate. The laminate structure is cut along a boundary between the wiring laminate portion and a surrounding portion, and the surrounding portion is removed. The wiring laminate portion is separated from the support substrate along the boundary between the two foils.

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Номер записи: 24
03-05-2012 дата публикации

Etching apparatus with suction mechanism

Номер: US20120103521A1
Автор: Chien-Pang Cheng
Принадлежит: Zhen Ding Technology Co Ltd

An etching apparatus includes a conveyor, a spraying mechanism, a suction mechanism, and a controller. The conveyor is configured for conveying a substrate. The spraying mechanism includes a submersible pump and a number of spraying nozzles. The submersible pump selectively operates at an activated state where the spraying nozzles can spray etchant onto the substrate, or an unactivated state where the spraying nozzles cannot spray etchant. The suction mechanism includes a vacuum pump and a number of suction intakes. The vacuum pump selectively operates at an activated state where the suction intakes can suck up the etchant on the substrate, or an unactivated state where the suction intakes cannot suck up the etchant. The controller controls the pumps to operate alternately, so the vacuum pump is unactivated when the submersible pump is activated and vice versa.

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Номер записи: 25
03-05-2012 дата публикации

Method for Producing an Electrical Circuit and Electrical Circuit

Номер: US20120106112A1
Автор: Ricardo Ehrenpfordt, Sonja Knies
Принадлежит: ROBERT BOSCH GMBH

A method for producing an electrical circuit includes providing a main printed circuit board having a plurality of metalized plated-through holes through the main printed circuit board along at least one separating line between adjacent printed circuit board regions of the main printed circuit board. Each printed circuit board region has electrical contact connection pads on at least the main surface of the printed circuit board region that is to be populated, electrical lines for connection between the plurality of plated-through holes and the contact connection pads, and at least one semiconductor chip electrically contact-connected by means of the contact connection pads. The main printed circuit board is covered with a potting compound across the printed circuit board regions with the semiconductor chips.

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Номер записи: 26
03-05-2012 дата публикации

Method for Producing Lamps

Номер: US20120107973A1
Автор: Klaus Müller, Stefan Grötsch
Принадлежит: OSRAM Opto Semiconductors GmbH

A method for producing luminous means proposes providing a carrier serving as a heat sink, said carrier comprising a planar chip mounting region. The planar chip mounting region is structured for the purpose of producing a first partial region and at least one second partial region. In this case, the first partial region has a solder-repellent property after structuring. Afterward, a solder is applied to the planar chip mounting region, such that said solder wets the at least one second partial region. At least one optoelectronic body is fixed into the at least one second partial region with the solder at the carrier. Finally, contact-connections are formed for the purpose of feeding electrical energy to the optoelectronic luminous body.

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Номер записи: 27
10-05-2012 дата публикации

Curved touch sensor

Номер: US20120111491A1
Автор: John Z. Zhong, Lili Huang, Seung Jae Hong
Принадлежит: Apple Inc

A method of forming a curved touch surface is disclosed. The method can include depositing and patterning a conductive thin film on a flexible substrate to form at least one touch sensor pattern, while the flexible substrate is in a flat state. According to certain embodiments, the method can include supporting the flexible substrate in the flat state on at least one curved forming substrate having a predetermined curvature; and performing an anneal process, or an anneal-like high-heat process, on the conductive thin film, wherein the anneal process can cause the flexible substrate to conform to the predetermined curvature of the at least one curved forming substrate. According to an embodiment, the curved forming substrate can include a first forming substrate having a first predetermined curvature and a second forming substrate having a second predetermined curvature complementing the first predetermined curvature.

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Номер записи: 28
10-05-2012 дата публикации

Electronic apparatus, method for mounting a device, and optical communication apparatus

Номер: US20120113596A1
Автор: Akihito Kezuka, Makoto Miyoshi, Tsutomu Ohtsu
Принадлежит: Fujitsu Optical Components Ltd

An electronic apparatus includes a substrate, a device including a flange, the device being mounted at a first side of the substrate, a plate arranged at a position corresponding to the device at a second side of the substrate, the second side being opposite to the first side, and a securing member that secures the device to the substrate.

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Номер записи: 29
10-05-2012 дата публикации

Bendable Luminous Modules and Method for Producing Bendable Luminous Modules

Номер: US20120113606A1
Автор: Thomas Preuschl
Принадлежит: OSRAM GMBH

A light module ( 1; 14 ), comprising a carrier ( 8, 10 ) for mounting at least one semiconductor source ( 5 ), in particular a light emitting diode, wherein: the carrier ( 8, 10 ) has a flexible printed circuit board ( 10 ), the flexible printed circuit board ( 10 ) is bonded face-to face to at least one base plate, ( 8 ) and the carrier ( 8, 10 ) can be bent along at least one predetermined bending line ( 3; 3 a - 3 e ), the base plate ( 8 ) can be bent along the at least one bending line, ( 3; 3 a - 3 e ), the base plate ( 8 ) has at least one cutout ( 9 ) along the bending line ( 3; 3 a - 3 e ) and the flexible printed circuit board ( 10 ) has at least one strip ( 11; 15 ) which crosses at least one of the cutouts ( 9 ).

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Номер записи: 30
17-05-2012 дата публикации

Printed circuit board and method for manufacturing the same

Номер: US20120118618A1
Автор: Byung Seung Min
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein are a printed circuit board and a method for manufacturing the same. The method for manufacturing a printed circuit board includes: (a) forming at least one plate through hole penetrating through an insulating layer; (b) forming pattern grooves for implementing inner layer circuits on both surfaces of the insulating layer; and (c) filling the plate through hole and the pattern grooves with a conductive material. The method for manufacturing a printed circuit board may provide the printed circuit board having excellent heat radiating characteristics and reduce process cost.

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Номер записи: 31
24-05-2012 дата публикации

Multilayered printed circuit board and manufacturing method thereof

Номер: US20120125680A1
Автор: Atsushi Shouda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Kouji Asano, Kouta Noda, Naohiro Hirose, Naoto Ishida
Принадлежит: Ibiden Co Ltd

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

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Номер записи: 32
31-05-2012 дата публикации

Tin plating solution

Номер: US20120132530A1
Автор: Makoto Sakai, Mutsuko Saito, Shinjiro Hayashi
Принадлежит: Rohm and Haas Electronic Materials LLC

To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline.

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Номер записи: 33
07-06-2012 дата публикации

Method for controlling glue flow

Номер: US20120138222A1
Автор: William Halliday
Принадлежит: STMicroelectronics Research and Development Ltd

A method for controlling a contact angle between a glue and a surface of a substrate during manufacture of microchip packages is disclosed. The method includes applying a glue to a surface of a substrate, and placing an electrode in electrical connection with the glue. A potential difference is applied between the electrode and the substrate. The potential difference is applied across the glue and causes a contact angle between the glue and the surface of the substrate to be altered.

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Номер записи: 34
07-06-2012 дата публикации

Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate

Номер: US20120138346A1
Автор: Hiroyuki Uematsu, Kenichi Kawabata
Принадлежит: TDK Corp

A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.

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Номер записи: 35
21-06-2012 дата публикации

Reduced pth pad for enabling core routing and substrate layer count reduction

Номер: US20120153495A1
Автор: Debendra Mallik, Mihir K. Roy
Принадлежит: Intel Corp

Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

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Номер записи: 36
21-06-2012 дата публикации

Flexible circuit board and manufacturing method thereof

Номер: US20120155038A1
Автор: Masaki Fujiwara, Steven Roy Droes, Yasumori Fukushima
Принадлежит: Sharp Corp

The present invention provides a high-performance flexible circuit board having excellent flexibility, a fine wiring pattern, and fine electric contacts, and a manufacturing method thereof. In a flexible circuit board ( 20 ), a second insulating layer ( 24 ) made of an inorganic material is positioned between a wiring layer ( 25 ) and a first insulating layer ( 23 ) made of an inorganic material.

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Номер записи: 37
28-06-2012 дата публикации

Circuit device and method of manufacturing the same

Номер: US20120160545A1
Автор: Hideyuki Sakamoto
Принадлежит: Semiconductor Components Industries LLC

Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.

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Номер записи: 38
05-07-2012 дата публикации

Method for producing flexible metal laminate

Номер: US20120168053A1
Автор: Hiroto Shimokawa, Masami Sasaki, Takuro Kochiyama, Yoshitaka Mineki
Принадлежит: UBE Industries Ltd, Ube Nitto Kasei Co Ltd

A method for producing a flexible metal laminate includes continuously thermocompression-bonding laminate metal foils to a resin film. The thermocompression-bonding step is conducted by placing a protection metal foil between a pressure surface of a heat and pressure forming apparatus and the laminate metal foils. When the protection metal foil is subjected to an abrasion resistance test, in which the protection metal foil is placed such that a matte surface of the protection metal foil contacts a plate material having a surface equivalent to the pressure surface and in which the matte surface is rubbed against the surface of the plate material by applying a load to a shiny surface of the protection metal foil and pulling the protection metal foil, a streak is found on the matte surface only in a case where the load is over 500 g per area of 76 mm×26 mm.

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Номер записи: 39
12-07-2012 дата публикации

System for manufacturing laminated circuit boards

Номер: US20120174387A1
Автор: Anthony Faraci, Gary N. Sortino
Принадлежит: Duetto Integrated Systems Inc

The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

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Номер записи: 40
19-07-2012 дата публикации

Double-sided circuit board and manufacturing method thereof

Номер: US20120181076A1
Автор: Kota Noda, Satoru Kawai, Tsutomu Yamauchi
Принадлежит: Ibiden Co Ltd

A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R 1 on the first surface of the substrate, a second hole having a second opening with a diameter R 2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R 1 and R 2.

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Номер записи: 41
02-08-2012 дата публикации

Method for connecting two objects electrically

Номер: US20120192415A1
Автор: Hiroto Sugahara
Принадлежит: Brother Industries Ltd

A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a lower surface of the substrate. Further, a droplet of an electroconductive liquid is made to land on the recess, and the liquid is filled in the through hole via the groove. Next, the liquid filled in the groove, the recess, and the through hole is heated to harden. Further, the recess and the groove of the substrate are removed by cutting up to an area near the through hole. Accordingly, it is possible to connect electrically the connecting bodies arranged on both surfaces of the substrate by filling an electroconductive material in the through holes easily.

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Номер записи: 42
09-08-2012 дата публикации

Substrate cutting apparatus and method of cutting substrate using the same

Номер: US20120198981A1
Автор: Masaaki Sofue, Young-Kyung Kim
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A substrate cutting apparatus and a method of cutting a substrate using the same. The substrate cutting apparatus includes: a stand that supports a substrate; a support that is movable up and down, presses the substrate toward the stand, and has a groove forming unit that form grooves corresponding to positions where the substrate is to be cut at an interval; and a cutting unit that is formed in the support to be movable up and down and cuts the substrate using the grooves formed by the groove forming unit. According to the substrate cutting apparatus, V-shaped grooves are formed in advance of cutting a substrate into unit substrates at portions to be cut. Thus, breaking of the substrate may be prevented during the cutting.

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Номер записи: 43
09-08-2012 дата публикации

System and method for protecting a computing device using vsd material, and method for designing same

Номер: US20120200963A1
Автор: Daniel Vasquez, Lex Kosowsky
Принадлежит: Shocking Technologies Inc

Embodiments described herein provide for programmatic design or simulation of substrates carrying electrical elements to integrate voltage switchable dielectric (“VSD”) material as a protective feature. In particular, VSD material may be incorporated into the design of a substrate device for purpose of providing protection against transient electrical conditions, such as electrostatic discharge (ESD).

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Номер записи: 44
16-08-2012 дата публикации

Method for manufacturing wiring board

Номер: US20120204424A1
Автор: Izumi Tanaka, Yuji Yukiiri
Принадлежит: Shinko Electric Industries Co Ltd

There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

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Номер записи: 45
27-09-2012 дата публикации

Mounting Structure for Solid State Light Sources

Номер: US20120241807A1
Автор: Guenter Hoetzl, Huey Ling Lim, Lorenzo Roberto Trevisanello, Peter Sachsenweger, Steven Wetzel, Thomas Preuschl
Принадлежит: OSRAM GMBH

A mounting structure for solid-state light sources, for example of the LED type, comprises a support board; a submount mounted on said support board and having at least one solid-state light radiation source mounted thereon; a drive board carrying drive circuitry for the light radiation source, the aforementioned drive board being mounted on the support board and extending peripherally with respect to the aforementioned submount; electrical interface connections between the submount and the drive board for connecting the light radiation source to the drive circuitry; and mechanical and thermal interface connections between the submount and the support board.

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Номер записи: 46
27-09-2012 дата публикации

system and a method for solder mask inspection

Номер: US20120244273A1
Автор: Albert Yafe, Avi Levy, Michael Lev, Roni Flieswasser
Принадлежит: CAMTEK LTD

A system and a method for method for printing a solder mask on a printed circuit board (PCB), the method includes: acquiring images of multiple areas of a PCB by an inspection unit while the PCB is supported by a mechanical stage; determining spatial differences between a model of the PCB and the PCB based on the images; determining solder mask ink deposition locations based on (i) the spatial differences, and (ii) locations of the model of the PCB that should be coated with the solder mask ink; and printing solder mask ink on the solder mask deposition locations by a printing unit, while the PCB is supported by the mechanical stage.

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Номер записи: 47
11-10-2012 дата публикации

Fabrication method of substrate

Номер: US20120258573A1
Автор: Jing-Yi Yan, Shu-Tang Yeh
Принадлежит: Industrial Technology Research Institute ITRI

A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

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Номер записи: 48
18-10-2012 дата публикации

Method for making circuit board

Номер: US20120260502A1
Автор: Lee-Sheng Yen
Принадлежит: Advance Materials Corp

A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.

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Номер записи: 49
18-10-2012 дата публикации

Heat radiating printed circuit board and chassis assembly having the same

Номер: US20120262945A1
Автор: Eunjin Kim, Haehyung Lee, Hyuksoo Lee, Hyungyu Park, Inhee Cho, Jaeman Park, Jungho Lee
Принадлежит: LG Innotek Co Ltd

The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit; and one or more mounting units bent from the circuit pattern unit to be fixed at a chassis providing a lightguide path of a backlight unit, where the circuit pattern unit includes a driving unit divided into a plurality of driving regions and at least one or more electrodes for supplying a power to the driving unit, and where, the mounting unit is arranged with an electrode line for connecting the driving unit and electrodes other than the electrode arranged on the circuit pattern unit, such that dimming and scanning functions can be performed whereby illumination can be finely controlled, the width of the circuit pattern unit can be narrowed and damage to the PCB caused by heat can be prevented.

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Номер записи: 50
08-11-2012 дата публикации

Manufacturing method of circuit substrate

Номер: US20120279630A1
Автор: Chih-Hong Chuang, Tzu-Wei Huang
Принадлежит: Subtron Technology Co Ltd

A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.

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Номер записи: 51
08-11-2012 дата публикации

Method for producing metallic foil laminate body

Номер: US20120279652A1
Автор: Hironobu Iyama, Satoshi Okamoto, Shohei Azami
Принадлежит: Sumitomo Chemical Co Ltd

Improved moisture absorption solder heat resistance is obtained in producing a metallic foil laminate body having a metal foil attached on both sides of a laminated base material including a plurality of insulating base materials. A laminated base material ( 2 ) is first prepared by pressurizing and integrating a plurality of insulating base materials ( 2 a ) in a prepressing step. Then, the laminated base material ( 2 ) is heat-treated. Thereafter, this laminated base material ( 2 ) is sandwiched between a pair of metal foils ( 3 A) and ( 3 B), and heated and pressurized to be integrated into a metallic foil laminate body. The prepressing step makes it possible to prevent an interface between the insulating base materials ( 2 a ) from being generated. As a result, swelling is not generated on the surfaces of the insulating base materials ( 2 a ).

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Номер записи: 52
08-11-2012 дата публикации

Circuit board viaholes and method of manufacturing the same

Номер: US20120279775A1
Автор: Chang-han Shim, Se-chuel Park, Sung-Il Kang
Принадлежит: Samsung Techwin Co Ltd

Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate.

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Номер записи: 53
08-11-2012 дата публикации

Circuit module and manufacturing method for the same

Номер: US20120281370A1
Автор: Fumikiyo KAWAHARA, Hiroshi Nishikawa, Makoto Fujita
Принадлежит: Murata Manufacturing Co Ltd

A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.

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Номер записи: 54
08-11-2012 дата публикации

Circuit structure and manufacturing method thereof

Номер: US20120282738A1
Автор: Ching-Sheng Chen
Принадлежит: Subtron Technology Co Ltd

A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. The metal layer and the surface passivation layer are dipped into a modifier, and the modifier is selectively absorbed and attached to the surface passivation layer, so as to form a covering layer. The covering layer has a plurality of nanoparticles and covers the surface passivation layer.

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Номер записи: 55
06-12-2012 дата публикации

Wet lamination of photopolymerizable dry films onto substrates and compositions relating thereto

Номер: US20120308929A1
Автор: Pedro Goncalo Carvalhais Teixeira Dias Jorge, Shinji Yu
Принадлежит: EI Du Pont de Nemours and Co

The invention is directed to a lamination fluid useful in processes for wet laminating a photopolymerizable film onto circuit board panels or other substrates. The lamination system comprises 1) a dry film photoresist, 2) a laminate comprising i) copper ii) stainless steel iii) non metal on a surface, 3) a lamination fluid and 4) fluid application device on the laminates. The lamination fluid comprises water and a surface energy modification agent. The surface energy modification agent is present in a range between 0.0001 and 3.0 moles/liter, and the pH of the fluid is between 3 and 11.

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Номер записи: 56
13-12-2012 дата публикации

Method for manufacturing a printed circuit board

Номер: US20120312775A1
Автор: Duck-Young Maeng, Je-Sik Yeon, Se-Won Park
Принадлежит: Samsung Electro Mechanics Co Ltd

A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method for manufacturing a printed circuit board can include forming a circuit pattern over a seed layer that is formed over an insulation layer, pressing the circuit pattern such that the circuit pattern and the seed layer corresponding with the circuit pattern are buried in the insulation layer, and removing the exposed seed layer. This method can prevent undercuts caused by etching in the seeds positioned between the circuit pattern and the insulation layer, and can thereby prevent the circuit pattern from becoming detached. Also, the adhesion between the circuit pattern and the insulation layer can be increased, making it possible to implement a finer circuit pattern over the insulation layer.

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Номер записи: 57
13-12-2012 дата публикации

Injection molded control panel with in-molded decorated plastic film that includes an internal connector

Номер: US20120314380A1
Автор: Scott Moncrieff
Принадлежит: Canyon Graphics Corp

Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

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Номер записи: 58
20-12-2012 дата публикации

Module substrate, module-substrate manufacturing method, and terminal connection substrate

Номер: US20120320536A1
Автор: Issei Yamamoto
Принадлежит: Murata Manufacturing Co Ltd

In a module substrate, a plurality of terminal connection substrates each including an insulator and a plurality of columnar terminal electrodes arranged on a single lateral surface or both lateral surfaces of the insulator is mounted on a single side of a composite substrate such that at least one of the terminal connection substrates extends over a border between a plurality of neighboring module substrates. The composite substrate, in which the plurality of terminal connection substrates is mounted on the single side and a plurality of electronic components is mounted on at least the single side, is divided at a location where the module substrates are to be cut from the composite substrate.

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Номер записи: 59
03-01-2013 дата публикации

Method of forming circuit on flexible laminate substrate

Номер: US20130001186A1
Автор: Hajime Inazumi, Kazuhiko Sakaguchi
Принадлежит: JX Nippon Mining and Metals Corp

Disclosed is a method of forming a circuit on a flexible laminate substrate. When forming a circuit using an adhesiveless flexible laminate which includes a polyimide film as the flexible laminate substrate in which at least one surface thereof is subject to plasma treatment, a tie-coat layer A formed on the polyimide film, a metal conductor layer B formed on the tie-coat layer, and a layer C which has the same components as the tie-coat layer that was formed on the metal conductor layer, the following method is used. The photoresist is coated on the layer C which has the same components as the tie-coat layer that was formed on the metal conductor layer, the photoresist is exposed and developed, the layer C other than the circuit forming parts thereof is selectively removed in advance via pre-etching, the conductor layer B is thereafter removed by supplemental etching with leaving the circuit portion, and the photoresist of the circuit portion is further removed so as to form the circuit. By forming a tie-coat layer or a metal or alloy that is equivalent to the tie-coat layer on the metal conductor layer of the adhesiveless flexible laminate, simultaneously achieved are the inhibition of side etching, which interferes with the achievement of finer pitches of circuit wiring, and the improvement of linearity of the wiring.

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Номер записи: 60
03-01-2013 дата публикации

Electronic control unit and method of manufacturing the same

Номер: US20130003306A1
Автор: Mitsuhiro Saitou, Shinsuke Oota, Yutaka Oohashi
Принадлежит: Denso Corp

An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.

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Номер записи: 61
24-01-2013 дата публикации

Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer

Номер: US20130020118A1
Автор: Hideaki Tanaka, Hiroko Asada, Shintaro Nanbara, Takeshi Ito, Yoichi Kenmotsu, Yuto Tanikawa
Принадлежит: Individual

Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass.

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Номер записи: 62
24-01-2013 дата публикации

Circuit module

Номер: US20130020119A1
Автор: Masato Yoshida
Принадлежит: Murata Manufacturing Co Ltd

A circuit module includes a substrate that has a substantially rectangular parallelepiped shape and includes a plurality of inner conductive layers, an electronic component disposed on a first main surface of the substrate, an insulating layer disposed on the first main surface of the substrate so as to cover the electronic component, a shielding layer disposed on a surface of the insulating layer, and a ground electrode connected to the plurality of inner conductive layers. At least two of the inner conductive layers are directly connected to the shielding layer.

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Номер записи: 63
31-01-2013 дата публикации

Method of forming microstructures, laser irradiation device, and substrate

Номер: US20130029092A1
Автор: Hiroyuki WAKIOKA
Принадлежит: Fujikura Ltd

A microstructure forming method includes a step A of irradiating a region of a substrate, in which a hole-shaped or groove-shaped microstructure is to be formed, with a circularly or elliptically polarized laser beam having a pulse width of which the pulse duration is on the order of picoseconds or shorter, and scanning a focal point at which the laser beam converges to form a modified region, and a step B of performing an etching process on the substrate in which the modified region is formed and removing the modified region to form a microstructure.

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Номер записи: 64
14-02-2013 дата публикации

Printed circuit board having a non-plated hole with limited drill depth

Номер: US20130038998A1
Автор: Mark E. Andresen, Virginia Ott
Принадлежит: International Business Machines Corp

A printed circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

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Номер записи: 65
28-02-2013 дата публикации

Circuit board

Номер: US20130048342A1
Автор: Charles Randall Malstrom, John Patton Geiger, Marjorie Kay Myers
Принадлежит: Tyco Electronics Corp

A circuit board includes a dielectric layer and sacrificial bumps on the dielectric layer in predetermined circuit common areas. A conductive seed layer is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductive seed layer. Sections of the conductive circuit layer and the conductive seed layer in the circuit common areas are removed. Optionally, the circuit board may include a metal substrate, with the dielectric layer applied on the metal substrate.

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Номер записи: 66
28-02-2013 дата публикации

Base member

Номер: US20130048350A1
Автор: Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda
Принадлежит: Shinko Electric Industries Co Ltd

A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of the core layer; and a silicon layer or a glass layer, formed on the bonding layer.

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Номер записи: 67
28-02-2013 дата публикации

Method for partially stripping a defined area of a conductive layer

Номер: US20130048618A1
Автор: Bostjan Podobnik, Drago Kovacic, Jan Van Aalst
Принадлежит: LPKF Laser and Electronics AG

A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.

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Номер записи: 68
28-02-2013 дата публикации

Etching liquid for a copper/titanium multilayer thin film

Номер: US20130048904A1
Автор: Kazuki Kobayashi, Keiichi Tanaka, Kenichi Kitoh, Satoshi Okabe, Taketo Maruyama, Tetsunori Tanaka, Tomoyuki Adaniya, Toshiyuki Gotou, Wataru Nakamura
Принадлежит: Mitsubishi Gas Chemical Co Inc, Sharp Corp

The present invention provides an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, and a method of using it for etching a multilayer thin film containing a copper layer and a titanium layer, that is, an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, which comprises (A) hydrogen peroxide, (B) nitric acid, (C) a fluoride ion source, (D) an azole, (E) a quaternary ammonium hydroxide and (F) a hydrogen peroxide stabilizer and has a pH of from 1.5 to 2.5, and a etching method of using it.

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Номер записи: 69
28-02-2013 дата публикации

Solid state disk assembly

Номер: US20130050928A1
Автор: Guo-Yi Chen, Kang Wu
Принадлежит: Hon Hai Precision Industry Co Ltd, Hongfujin Precision Industry Shenzhen Co Ltd

A solid state disk assembly includes a solid state disk, a first heat conducting member and a second heat conducting member. The solid state disk includes a printed circuit board (PCB) and a chipset. The PCB includes a front surface, a rear surface, a first end, and a second end. The chipset is mounted on the front surface. The first heat conducting member abuts the chipset for absorbing heat generated by the solid state disk and includes at least a pair of elastic arms. The second heat conducting member attaches on the rear surface and includes at least a pair of engaging arms spatially corresponding to the at least one pair of elastic arms. The first end and the second end are clamped between the at least one pair of elastic arms. Each elastic arm engages with a respective one of the engaging arms.

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Номер записи: 70
28-02-2013 дата публикации

Metal clad circuit board

Номер: US20130051018A1
Автор: Charles Randall Malstrom, Dean Perronne, Leonard H. Radzilowski, Marjorie K. Myers, Matthew E. Mostoller, Michael F. Laub, Miguel Morales, Robert D. Rix
Принадлежит: Tyco Electronics Corp

A metal clad circuit board includes a metal substrate. A dielectric layer is applied to the metal substrate. A conductive seed layer is printed on the dielectric layer. A conductive circuit layer is plated onto the conductive seed layer. Optionally, the conductive seed layer may be inkjet printed on the dielectric layer. Alternatively, the conductive seed layer may be pad printed on the dielectric layer. Optionally, the dielectric layer may be powder coated to the metal substrate. The dielectric layer may include polymers and fillers compression molded to the metal substrate. Optionally, the conductive circuit layer may be electroplated to the conductive seed layer. Optionally, a solder mask may be applied over the conductive circuit layer.

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Номер записи: 71
07-03-2013 дата публикации

Method for Manufacturing a Double-Sided Printed Circuit Board

Номер: US20130056250A1
Автор: Hee-Yong Ahn, Kwang Choon Chung, Kwang-Baek Yoon, Kyong-Min Lee, Myung-Bong Yoo, Nam-Boo Cho, Su-Han Kim, Young-Ho Han, Young-Koo Han
Принадлежит: Haeun Chemtec Co Ltd, InkTec Co Ltd

Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.

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Номер записи: 72
21-03-2013 дата публикации

TOUCH PANEL USING A METAL THIN FILM, AND METHOD FOR MANUFACTURING SAME

Номер: US20130068603A1
Автор: Kwak Min Gi
Принадлежит: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

This invention relates to a touch panel using a metal thin film and a method of manufacturing the same. The touch panel according to an embodiment of the invention includes a transparent substrate; a metal pattern unit formed under the transparent substrate and including at least one first pattern electrode and a first wiring electrode which is connected to the first pattern electrode; and a film substrate combined with the transparent substrate having the metal pattern unit, and including at least one second pattern electrode and a second wiring electrode which is connected to the second pattern electrode, wherein the first pattern electrode is in the form of a mesh of thin wires. 1. A touch panel , comprising:{'b': '100', 'a transparent substrate ();'}{'b': 200', '100', '220', '240', '220, 'a metal pattern unit () formed under the transparent substrate (), and including at least one first pattern electrode () and a first wiring electrode () which is connected to the first pattern electrode (); and'}{'b': 300', '100', '200', '320', '340', '320, 'a film substrate () combined with the transparent substrate() having the metal pattern unit (), and including at least one second pattern electrode () and a second wiring electrode () which is connected to the second pattern electrode (),'}{'b': '220', 'wherein the first pattern electrode () is in a form of a mesh of thin wires.'}2200. The touch panel of claim 1 , wherein the metal pattern unit () is formed using any one selected from among Ag claim 1 , Al claim 1 , Cu claim 1 , Cr and Ni claim 1 , or an alloy thereof.3300. The touch panel of claim 1 , wherein the film substrate () comprises ITO (Indium Tin Oxide) or a conductive polymer.4100. The touch panel of claim 1 , wherein the transparent substrate () is a glass substrate claim 1 , a transparent silicon substrate or a transparent plastic substrate.5220220320. The touch panel of claim 1 , wherein the first pattern electrode () is configured such that the thin wires ...

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Номер записи: 73
21-03-2013 дата публикации

Method of Using a Mask to Provide a Patterned Substrate

Номер: US20130068723A1
Автор: Matthew S. Stay, Mikhail L. Pekurovsky
Принадлежит: 3M Innovative Properties Co

A method of producing substrates having a patterned mask layer with fine features such as repeating stripes. The method including the steps of forming a substrate having a transfer layer with a predetermined pattern on a first major surface of the substrate; providing the substrate having the transfer layer on the first major surface; providing a structured tool having a body and a plurality of contact portions, the contact portions having a Young's Modulus between about 0.5 Gpa to about 30 Gpa; heating either the structured tool or the substrate; contacting the transfer layer with the structured tool; cooling the transfer layer; and withdrawing the structured tool from the transfer layer such that portions of the transfer layer separate with the structured tool leaving openings in the transfer layer that extend all the way through the transfer layer to the substrate forming the transfer layer with the predetermined pattern.

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Номер записи: 74
28-03-2013 дата публикации

Method of fabricating micro structured surfaces with electrically conductive patterns

Номер: US20130075946A1
Автор: Robert J. Petcavich
Принадлежит: Unipixel Displays Inc

A method comprises forming a first pattern on a first flat surface and forming an inverse of the pattern on a second flat surface. The method further comprises attaching the second flat surface to a roller to produce an embossing tool and applying pressure between the embossing tool and a substrate thereby forming a second pattern in the substrate. The substrate is coated with a radiation curable resin material. The method also comprises transferring ink to the substrate, the ink containing a catalyst, and coating the substrate with the second pattern in an electroless plating bath. The first pattern alternatively may be formed on a sleeve which is then attached to a drum/roller.

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Номер записи: 75
28-03-2013 дата публикации

SEGMENTABLE WIRING BOARD AND METHOD FOR PRODUCING THE SAME, AND WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME

Номер: US20130078408A1
Автор: NIINO Noritaka, Ochi Masaya
Принадлежит: KYOCERA CORPORATION

A segmentable wiring board includes a ceramic base body, a conductor, a metal plating film and a glass layer, the glass layer having an upwardly-protruding convexity located on the metal plating film. The ceramic base body has a plurality of wiring substrate regions and dividing grooves located in boundaries among the plurality of wiring substrate regions. Moreover, the conductor is located in a periphery of each of the plurality of wiring substrate regions. Moreover, the metal plating film is located on the conductor. Further, the glass layer coveringly extends from an inner surface of each of the dividing grooves of the ceramic base body to the metal plating film. 1. A segmentable wiring board , comprising:a ceramic base body having a plurality of wiring substrate regions and dividing grooves formed in boundaries among the plurality of wiring substrate regions;a conductor located in a periphery of each of the plurality of wiring substrate regions; anda glass layer coveringly extending from an inner surface of each of the dividing grooves of the ceramic base body to the conductor,the glass layer having an upwardly-protruding convexity located on the conductor.2. The segmentable wiring board according to claim 1 ,wherein the conductor is situated under the convexity of the glass layer and upwardly protrudes.3. The segmentable wiring board according to claim 1 ,wherein a thickness of the conductor falls in a range of 20 μm to 80 μm.4. The segmentable wiring board according to claim 1 ,wherein a depth of each of the dividing grooves falls in a range of 5 μm to 16 μm.5. The segmentable wiring board according to claim 4 ,wherein the depth of each of the dividing grooves falls in a range of 30% to 62% of a thickness of the ceramic base body.6. A wiring substrate claim 4 , comprising:a ceramic base body;a conductor located in a periphery of a first main surface of the ceramic base body; anda glass layer which covers a side surface of the ceramic base body and a side ...

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Номер записи: 76
11-04-2013 дата публикации

Conductive film with high transmittance having a number of anti reflection coatings, touch panel using the same and manufacturing method thereof

Номер: US20130087374A1
Автор: Hyunmin Nah
Принадлежит: LG Innotek Co Ltd

The present invention relates to a conductive film with high transmittance and having a number of anti reflection (AR) coated films, whereby transmittance of an ITO film can be improved by coating the number of anti reflection (AR) coating having a high refractivity and lower refractivity on the conductive film, and the present invention according to an exemplary embodiment can be advantageously applied to a touch panel of an ITO film/ITO film combination to obtain a clear image due to sufficient transmittance, wherein an exemplary embodiment of the present invention includes a conductive film formed with a transparent electrode pattern, and a number of anti reflection (AR)films formed on at least one surface of the conductive film to prevent optical reflection.

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Номер записи: 77
11-04-2013 дата публикации

Interposer, circuit board module, and method for manufacturing interposer

Номер: US20130087376A1
Автор: Yasuo Moriya
Принадлежит: Fujitsu Ltd

An interposer includes a substrate having first and second opposing surfaces, the substrate having a sheet shape; and a plurality of spring electrodes fixed to the substrate in a certain arrangement, each of the plurality of the spring electrodes including a first pad disposed opposite the first surface of the mesh and extending in a first direction, a second pad disposed opposite the second surface of the mesh and extending in the first direction, and a post extending through the substrate between the first and second surfaces and connecting an end of the first pad to an end of the second pad.

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Номер записи: 78
11-04-2013 дата публикации

BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE ASSEMBLY

Номер: US20130088839A1
Автор: ISHIKAWA Kuniko, KITAJIMA Masayuki, KUBOTA Takashi, YAMAKAMI Takatoyo
Принадлежит: FUJITSU LIMITED

There is provided a method of manufacturing a board module which includes attaching a metal particle to a surface of a solder bump, which includes at least a tin component and is mounted on an electrode provided on a first surface of an electric part or a printed circuit board, the metal particle having a higher specific gravity and a higher melting point than the solder bump, making the first surface face up, heating the solder bump to a temperature equal to or higher than the melting point of the solder bump so that the metal particle precipitates in the solder bump, and forming an inter-metal compound layer, which has a higher melting point than a melting point of the solder bump, at an interface between the solder bump and the electrode by using the metal particle, which has precipitated, and the tin component of the solder bump. 1. A method of manufacturing a board module , the method comprising:attaching a metal particle to a surface of a solder bump, which includes at least a tin component and is mounted on an electrode provided on a first surface of an electric part or a printed circuit board, the metal particle having a higher specific gravity than that of the solder bump and a higher melting point than that of the solder bump;making the first surface, on which the electrode is provided, face up;heating the solder bump to a temperature equal to or higher than the melting point of the solder bump to melt the solder bump so that the metal particle precipitates in the solder bump; andforming an inter-metal compound layer, which has a higher melting point than a melting point of the solder bump, at an interface between the solder bump and the electrode by using the metal particle, which has precipitated, and the tin component of the solder bump.2. The method of manufacturing a board module according to claim 1 , the method further comprising:electrically bonding the electrode and an opposite electrode, which is disposed on a second surface facing the electrode, ...

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Номер записи: 79
25-04-2013 дата публикации

METHOD OF FABRICATING A WIRING BOARD

Номер: US20130097856A1
Автор: Kaneko Kentaro
Принадлежит: SHINKO ELECTRIC INDUSTRIES CO., LTD.

A method of fabricating a wiring board includes forming a surface plating layer on a support member, and forming an external connecting pad on the surface plating layer formed on the support member such that an area of the external connecting pad formed on the surface plating layer is smaller than an area of the surface plating layer. The method also includes forming an insulating layer and a wiring layer on a surface of the support member where the external connecting pad is formed, and removing the support member. 1. A method of fabricating a wiring board , comprising steps of:forming a surface plating layer on a support member, and forming an external connecting pad on the surface plating layer formed on the support member such that an area of the external connecting pad formed on the surface plating layer is smaller than an area of the surface plating layer;forming an insulating layer and a wiring layer on a surface of the support member where the external connecting pad is formed; andremoving the support member.2. The method of fabricating a wiring board according to claim 1 , wherein forming the external connecting pad on the surface plating layer such that the area of the external connecting pad formed on the surface plating layer is smaller than the area of the surface plating layer includes processing the external connecting pad to make the area of the external connecting pad smaller than the area of the surface plating layer.3. The method of fabricating a wiring board according to claim 2 , wherein the processing of the external connecting pad to make the area of the external connecting pad smaller than the area of the surface plating layer is carried out by etching.4. The method of fabricating a wiring board according to claim 2 , wherein the processing of the external connecting pad to make the area of the external connecting pad smaller than the area of the surface plating layer creates an interval in a horizontal direction between an outer peripheral ...

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Номер записи: 80
25-04-2013 дата публикации

Printed circuit board and layout method thereof

Номер: US20130098661A1
Автор: Yu-Hsu Lin
Принадлежит: Hon Hai Precision Industry Co Ltd

A printed circuit board includes a signal layer having a pair of differential transmission lines thereon. An eye width and an eye height of an eye diagram obtained at output terminals of the pair of differential transmission lines are variable according to a distance between the pair of differential transmission lines. The eye width and the eye height of the eye diagram are at minimum values when the distance between the pair of differential transmission lines is at a first distance. The eye width and the eye height meet requirements of the pair of differential transmission lines for the eye diagram when the distance between the pair of differential transmission lines is set at a second distance, the second distance is less than the first distance.

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Номер записи: 81
25-04-2013 дата публикации

Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die

Номер: US20130099378A1
Автор: HanGil Shin, HeeJo Chi, NamJu Cho
Принадлежит: Stats Chippac Pte Ltd

A semiconductor device has an interposer frame mounted over a carrier. A semiconductor die has an active surface and bumps formed over the active surface. The semiconductor die can be mounted within a die opening of the interposer frame or over the interposer frame. Stacked semiconductor die can also be mounted within the die opening of the interposer frame or over the interposer frame. Bond wires or bumps are formed between the semiconductor die and interposer frame. An encapsulant is deposited over the interposer frame and semiconductor die. An interconnect structure is formed over the encapsulant and bumps of the first semiconductor die. An electronic component, such as a discrete passive device, semiconductor die, or stacked semiconductor die, is mounted over the semiconductor die and interposer frame. The electronic component has an I/O count less than an I/O count of the semiconductor die.

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Номер записи: 82
25-04-2013 дата публикации

ELECTRONIC COMPONENT AND FABRICATION METHOD OF THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME

Номер: US20130099628A1
Автор: INOUE Kazunori, Iwaki Masafumi, Matsumoto Kazuhiro, MIYASHITA Tsutomu
Принадлежит: TAIYO YUDEN CO., LTD.

An electronic component includes: an element that is located on a substrate; a signal wiring that is located on the substrate and electrically connected to the element; a metal plate that is located so as to form a cavity on a functional part of the element and covers an upper surface of the cavity; a support post that is located on the substrate so as not to be located on the signal wiring, and supports the metal plate; and an insulating portion that covers the metal plate and the support post, and contacts a side surface of the cavity. 1. An electronic component by comprising:an element that is located on a substrate;a signal wiring that is located on the substrate and electrically connected to the element;a metal plate that is located so as to form a cavity on a functional part of the element and covers an upper surface of the cavity;a support post that is located on the substrate so as not to be located on the signal wiring, and supports the metal plate; andan insulating portion that covers the metal plate and the support post, and contacts a side surface of the cavity.2. The electronic component according to claim 1 , whereinthe support post is made of a metal.3. The electronic component according to claim 1 , whereinthe support posts are located along opposing sides of the metal plate so as to have lengths shorter than lengths of the sides.4. The electronic component according to claim 1 , further comprising:a connection terminal that is located on the substrate so as to penetrate through the insulating portion, and provides an external electrical connection to the element, whereina height from the substrate to an upper surface of the connection terminal is equal to a height from the substrate to an upper surface of the metal plate.5. The electronic component according to claim 4 , whereinthe metal plate electrically connects to the connection terminal connected to a ground.6. The electronic component according to claim 5 , whereinthe metal plate extends to ...

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Номер записи: 83
02-05-2013 дата публикации

Circuit board structure

Номер: US20130105202A1
Автор: David C. H. Cheng, Shu-Sheng Chiang, Tsung-Yuan Chen
Принадлежит: Unimicron Technology Corp

A circuit board structure including a dielectric layer, a fine circuit pattern and a patterned conductive layer is provided, wherein the fine circuit pattern is embedded in a surface of the dielectric layer, and the patterned conductive layer is disposed on another surface of the dielectric layer and protrudes therefrom.

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Номер записи: 84
02-05-2013 дата публикации

Method for manufacturing circuit board provided with metal posts and circuit board manufactured by the method

Номер: US20130105214A1
Автор: Sang Min Lee, Soon Chul KWON
Принадлежит: Samsung Techwin Co Ltd

Provided is a method for manufacturing a circuit board provided with metal posts formed on at least one surface of the circuit board, the method including preparing a substrate made of a conductive material, performing a first selective etching a first surface of the substrate in regions corresponding to insulating portions of a first circuit pattern, laminating a first insulating layer over the first surface of the substrate, and performing a second etching on a second surface opposite of the first surface of the substrate, thereby forming the metal posts and the first circuit.

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Номер записи: 85
02-05-2013 дата публикации

Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect

Номер: US20130105989A1
Автор: Reza A. Pagaila, Seng Guan Chow, Seung Uk Yoon
Принадлежит: Stats Chippac Pte Ltd

A semiconductor device has a first semiconductor die mounted over a carrier. An interposer frame has an opening in the interposer frame and a plurality of conductive pillars formed over the interposer frame. The interposer is mounted over the carrier and first die with the conductive pillars disposed around the die. A cavity can be formed in the interposer frame to contain a portion of the first die. An encapsulant is deposited through the opening in the interposer frame over the carrier and first die. Alternatively, the encapsulant is deposited over the carrier and first die and the interposer frame is pressed against the encapsulant. Excess encapsulant exits through the opening in the interposer frame. The carrier is removed. An interconnect structure is formed over the encapsulant and first die. A second semiconductor die can be mounted over the first die or over the interposer frame.

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Номер записи: 86
02-05-2013 дата публикации

Liquid Crystal Display Based on Insulation Backplane

Номер: US20130107158A1
Автор: Chong Huang, Shih hsiang Chen
Принадлежит: Shenzhen China Star Optoelectronics Technology Co Ltd

The invention discloses a liquid crystal display (LCD) based on an insulation backplane. The LCD comprises a backplane, a display driving circuit board, and a metal front frame, wherein the backplane comprises a sidewall at the side surface of the LCD and a base plate at the bottom surface of the LCD; the metal front frame is fixedly connected with the sidewall of the backplane; and the display driving circuit board is fixed on the base plate. The LCD also comprises a metal insert, and the display driving circuit board is electrically connected with the metal front frame through the metal insert. In the invention, the display driving circuit board is connected with the metal front frame through the metal insert, compared with a conductive aluminum foil, the metal insert has higher strength and reliability, and the problems of falling, damage, tearing, etc. are not easy to occur. In addition, the metal insert can be assembled and disassembled as a whole conveniently, and thus, no additional trouble can be caused in the rework process.

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Номер записи: 87
02-05-2013 дата публикации

Multi-piece substrate

Номер: US20130107481A1
Автор: Keisuke Shimizu, Yasuyuki Kurabe
Принадлежит: Ibiden Co Ltd

A multi-piece substrate includes a frame portion, and a unit portion in which multiple wiring boards is arrayed. The frame portion is formed on the periphery of the unit portion, the wiring boards have semiconductor elements built in the wiring boards, respectively, and the frame portion has multiple slits formed such that the slits have openings on the periphery of the frame portion.

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Номер записи: 88
02-05-2013 дата публикации

Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition

Номер: US20130108843A1
Автор: Makoto Yanagida, Shuuji Gouzu
Принадлежит: Individual

The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:

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Номер записи: 89
09-05-2013 дата публикации

Printed Circuit Board and Manufacturing Method Thereof

Номер: US20130112463A1
Автор: Ahn Chi Hee, Kim Jin Su, Lee Sang Myung, Nam Myoung Hwa, Seo Yeong Uk, Yoon Sung Woon
Принадлежит: LG INNOTEK CO., LTD.

The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer. 1. A method of manufacturing a printed circuit board , the method comprising:(a) forming circuit patterns on an insulating layer in which a seed layer is formed;(b) embedding the circuit patterns into the insulating layer by a press method; and(c) removing the seed layer.2. The method of claim 1 , wherein the step (a) comprises:(a-1) forming the seed layer on the insulating layer;(a-2) coating a photosensitive material on the seed layer to be patterned by an exposure process and a developing process;(a-3) filling a metallic material in the patterned photosensitive material layer to form the circuit patterns; and(a-4) removing the patterned photosensitive material.3. The method of claim 2 , wherein the seed layer in the (a-1) step is a metal layer including at least one of copper (Cu) claim 2 , gold (Au) claim 2 , nickel (Ni) claim 2 , palladium (Pd) claim 2 , indium (In) claim 2 , titanium (Ti) claim 2 , and tin (Sn).4. The method of claim 2 , wherein the seed layer in the step (a-1) is a conductive polymer using alkene such as aniline claim 2 , pyrrole claim 2 , thiophene claim 2 , and ...

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Номер записи: 90
09-05-2013 дата публикации

PRINTED CIRCUIT BOARDS WITH EMBEDDED ELECTRO-OPTICAL PASSIVE ELEMENT FOR HIGHER BANDWIDTH TRANSMISSION

Номер: US20130112465A1
Автор: Duvanenko Vladimir
Принадлежит: SANMINA-SCI CORPORATION

A printed circuit board (PCB) is provided comprising a plurality of non-conductive layers with conductive or signal layers in between. The PCB includes a first conductive via traversing the plurality of non-conductive and conductive or signal layers as well as a second conductive via traversing the plurality of non-conductive layers and conductive or signal layers, the second conductive via located substantially parallel to the first conductive via. An embedded electro-optical passive element is also provided that extends perpendicular to and between the first conductive via and the second conductive via. The electro-optical passive element embedded is located within a selected layer at a first depth in the printed circuit board, wherein such first depth is selected to reflect an incident electromagnetic wave back into the printed circuit board to enhance or diminish an electrical signal in the first conductive via by creating a positive or negative electromagnetic interference. 1. A printed circuit board , comprising:a plurality of non-conductive layers with conductive or signal layers in between;a first conductive via traversing the plurality of non-conductive and conductive or signal layers;a second conductive via traversing the plurality of non-conductive layers and conductive or signal layers, the second conductive via located substantially parallel to the first conductive via; andan electro-optical passive element extending perpendicular to and between the first conductive via and the second conductive via, the electro-optical passive element embedded within a selected layer at a first depth in the printed circuit board, wherein such first depth is selected to reflect an incident electromagnetic wave back into the printed circuit board to enhance or diminish an electrical signal in the first conductive via by creating a positive or negative electromagnetic interference.2. The printed circuit board of claim 1 , wherein the first conductive via is coupled to a ...

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Номер записи: 91
09-05-2013 дата публикации

Transparent conductive film and method for producing same

Номер: US20130113757A1
Автор: Hiroyuki Iizuka, Koji Ohguma, Mikio Yamahiro, Takuro Tanaka, Yasuhiko Nakagawa
Принадлежит: JNC Corp

Provided is a transparent conductive film having multilayer structure, and inconspicuous pattern shape and good visibility. The film includes: transparent base 11 formed of film-like polymer resin; first hard coat layer 12 laminated on the base 11 ; first transparent dielectric layer 13 laminated as required on the layer 12 ; and first transparent conductive layer 14 laminated on the layer 13 . The base 11 has a film thickness of 2 to 250 micrometers. The layer 12 is formed of hardening resin containing inorganic oxide, with refractive index: 1.40 to 1.90 and film thickness: 0.5 to 6 micrometers. The layer 13 is formed of inorganic substance, with refractive index: 1.30 to 1.50 and film thickness: 10 to 50 nanometers. The layer 14 is formed of at least one kind of inorganic oxide, metal and carbon, and patterned, and has a film thickness of 10 nanometers to 2 micrometers.

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Номер записи: 92
09-05-2013 дата публикации

HYBRID NANOSTRUCTURE, A METHOD FOR FORMING THE HYBRID NANOSTRUCTURE, AND AN ELECTRODE INCLUDING A PLURALITY OF THE HYBRID NANOSTRUCTURES

Номер: US20130115453A1
Автор: Fan Hongjin, Guan Cao, Liu Jinping
Принадлежит: NANYANG TECHNOLOGICAL UNIVERSITY

The present invention is directed to a hybrid nanostructure. The hybrid nanostructure includes at least two pseudocapacitative materials arranged in an elongate core-shell arrangement, wherein the core is an elongate nanostructure comprising or consisting of the first pseudocapacitative material and the shell is a plurality of flake- or sheet-like nanostructures attached to the core structure and comprising or consisting of the second pseudocapacitative material. The present invention also relates to a method for forming the hybrid nanostructure, and an electrode including a plurality of the hybrid nanostructures. 1. Hybrid nanostructure comprising at least two pseudocapacitative materials arranged in an elongate core-shell arrangement , wherein the core is an elongate nanostructure comprising or consisting of the first pseudocapacitative material and the shell is a plurality of flake- or sheet-like nanostructures attached to the core structure and comprising or consisting of the second pseudocapacitative material.2. Hybrid nanostructure of claim 1 , wherein the elongate nanostructure is a nanowire.3. Hybrid nanostructure of claim 1 , wherein the first pseudocapacitative material comprises or consists of a transition metal oxide or a transition metal hydroxide.4. Hybrid nanostructure of claim 1 , wherein the first pseudocapacitative material is selected from the group consisting of cobalt oxide claim 1 , nickel oxide claim 1 , zinc oxide claim 1 , tin oxide and any combination thereof.5. Hybrid nanostructure of claim 1 , wherein the second pseudocapacitative material comprises or consists of a transition metal oxide or a transition metal hydroxide.6. Hybrid nanostructure of claim 1 , wherein the second pseudocapacitative material comprises or consists of manganese oxide or cobalt oxide or nickel oxide or nickel hydroxidenitrate.7. Hybrid nanostructure of claim 1 , wherein the elongate nanostructure is porous.8. Hybrid nanostructure of claim 1 , wherein the elongate ...

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Номер записи: 93
16-05-2013 дата публикации

Wireless terminal with reduced specific absorption rate peak and implementation method thereof

Номер: US20130118780A1
Автор: LU Zhang
Принадлежит: ZTE Corp

The disclosure discloses a wireless terminal with a reduced Specific Absorption Rate (SAR) peak. The wireless terminal comprises a Printed Circuit Board (PCB), wherein a fractal gap is formed at an edge of a metal ground on the PCB to disturb distribution of induced current at the edge of the metal ground. The disclosure also discloses a method for reducing an SAR peak. On the premise of the non-influence on the communication quality of the wireless terminal, the SAR and the production cost can be reduced and the structure space of wireless terminal can be saved by using the wireless terminal and the method.

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Номер записи: 94
16-05-2013 дата публикации

STRUCTURE OF EMBEDDED-TRACE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Номер: US20130122216A1
Автор: Lee Teck-Chong, TARNG Shin-Luh
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A method of manufacturing an embedded-trace substrate is provided. First, a core plate is provided. Next, a through hole and a plurality of trenches are formed on the core plate, wherein the through hole passes through the core plate, and the trenches are formed on the upper and the lower surfaces of the core plate. Then, the core plate is subjected to one-plating step for electroplating a conductive material in the through hole and the trenches at the same time. Afterwards, the excess conductive material is removed. 1. A method of manufacturing an embedded-trace substrate , comprising: a central core; and', 'a first resin layer and a second resin layer, respectively formed on a top side and a bottom side of the central core;, 'providing a core plate, comprisingforming a through hole and a plurality of trenches in the core plate, wherein the through hole passes through the core plate, and the trenches are formed on an upper surface and a lower surface of the core plate;applying one-plating step to the core plate for electroplating the through hole and the trenches with a conductive material at the same time; andremoving the excess conductive material from the upper surface and the lower surface of the core plate so that surfaces of the conductive material filling in the through hole and the trenches are coplanar with the upper surface and the lower surface of the core plate.2. The manufacturing method according to claim 1 , wherein the central core comprises at least one glass fiber-reinforced resin layer.3. The manufacturing method according to claim 1 , wherein the glass fiber-reinforced resin layer claim 1 , the first resin layer and the second resin layer comprise a resin material selected from ammonium bifluoride (ABF) claim 1 , bismaleimide (BT) claim 1 , glass cloth epoxy (FR4 claim 1 , FR5) claim 1 , polyimide (PI) claim 1 , liquid crystal polymer (LCP) or epoxy.4. The manufacturing method according to claim 1 , wherein the through hole passing through the ...

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Номер записи: 95
16-05-2013 дата публикации

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDE

Номер: US20130122430A1
Автор: Cho Han Seo, Jung Jae Hyun, KIM Joon Sung, KIM Sang Hoon
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

A method of manufacturing a printed circuit board for an optical waveguide includes forming an insulation layer having a through hole on a substrate; forming a lower clad layer on a bottom of the through hole; forming a core part on the lower clad layer; and forming an upper clad layer covering the core part on the lower clad layer and the core part. 1. A method of manufacturing a printed circuit board for an optical waveguide , comprising:forming an insulation layer having a through hole on a substrate;forming a lower clad layer on a bottom of the through hole;forming a core part on the lower clad layer; andforming an upper clad layer covering the core part on the lower clad layer and the core part.2. The method according to claim 1 , wherein the forming of the insulation layer having the through hole comprises:forming an insulation layer on a substrate; andforming a through hole in the insulation layer through an exposure/development process or a laser drilling process.3. The method according to claim 1 , wherein the forming of the lower clad layer comprises:applying a liquid lower clad material on a bottom of the through hole;flattening the applied lower clad material by placing a transparent release film thereon; andcuring the flattened lower clad material by applying ultraviolet rays or heat thereto to form the lower clad layer on a bottom of the through hole.4. The method according to claim 1 , wherein the forming of the core part comprises:applying a liquid core material on the lower clad layer formed in the through hole;flattening the applied core material by placing a transparent release film thereon;selectively exposing the flattened core material using a pattern mask; andremoving the transparent release film and then developing the exposed core material to form the core part.5. The method according to claim 1 , wherein the forming of the core part comprises:applying a liquid core material on the lower clad layer formed in the through hole;curing the ...

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Номер записи: 96
16-05-2013 дата публикации

HIGH DENSITY TERMINAL CONTACTS FOR STIMULATION LEAD AND STIMULATION SYSTEM EMPLOYING THE SAME, AND METHOD OF STIMULATION LEAD FABRICATION

Номер: US20130123891A1
Автор: Swanson John
Принадлежит:

In one embodiment, a method of fabricating a lead comprises: providing a lead body comprising a plurality of conductive wires; providing a flex film connector structure, the flex film connector structure comprising a plurality of conductive pads on a first portion of the flex film connector structure, a plurality of contacts on a second portion of the flex film connectors, and a plurality of traces electrically connecting the plurality of conductive pads with the plurality of contacts; placing the first portion of the flex film connector adjacent to a cross-section of one end of the lead body; electrically coupling the plurality of conductive pads of the flex film connector structure to the plurality of conductive wires at the one end of the lead body; and wrapping the second portion of the flex film connector structure about the lead body to form a plurality of electrical contacts. 1. A method of fabricating a stimulation lead for providing electrical pulses to patient tissue or a lead extension , comprising:providing a lead body, the lead body comprising a plurality of conductive wires embedded or enclosed within insulative material;providing a flex film connector structure, the flex film connector structure comprising a plurality of conductive pads on a first portion of the flex film connector structure, a plurality of contacts on a second portion of the flex film connectors, and a plurality of traces electrically connecting the plurality of conductive pads with the plurality of contacts;placing the first portion of the flex film connector adjacent to a cross-section of one end of the lead body;electrically coupling the plurality of conductive pads of the flex film connector structure to the plurality of conductive wires at the one end of the lead body, wherein after performing the electrically coupling, the first portion of the flex film connector is disposed in contact with a cross-sectional surface of the lead body at a respective end of the lead body; ...

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Номер записи: 97
23-05-2013 дата публикации

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Номер: US20130126224A1
Автор: KIM Joon Sung
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate; an outer circuit layer formed on an upper portion of the base substrate and including a connection pad; a first solder resist formed on the upper portion of the base substrate so that the connection pad of the outer circuit layer is exposed; and a second solder resist formed on an upper portion of an outer circuit layer and formed so that the connection pad is exposed. 1. A printed circuit board comprising:a base substrate;an outer circuit layer formed on an upper portion of the base substrate and including a connection pad;a first solder resist formed on the upper portion of the base substrate so that the connection pad of the outer circuit layer is exposed; anda second solder resist formed on an upper portion of an outer circuit layer and formed so that the connection pad is exposed.2. The printed circuit board as set forth in claim 1 , further comprising an inner circuit layer formed between the upper portion of the base substrate and a lower portion of the outer circuit layer.3. The printed circuit board as set forth in claim 2 , wherein the inner and outer circuit layers are formed on both surfaces of the base substrate.4. The printed circuit board as set forth in claim 3 , wherein the base substrate includes a penetration via electrically interconnecting the inner circuit layers formed on the both surfaces thereof.5. The printed circuit board as set forth in claim 1 , wherein the connection pad includes a semiconductor device mounted thereon or electrically connected thereto.6. The printed circuit board as set forth in claim 1 , wherein the connection pad includes a solder bump formed on an upper portion thereof.7. The printed circuit board as set forth in claim 1 , wherein in the connection pad claim 1 , wire bonding is performed.8. A method of manufacturing a printed circuit board claim 1 , the method comprising:preparing ...

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Номер записи: 98
30-05-2013 дата публикации

WIRING BOARD AND METHOD OF FABRICATING THE SAME

Номер: US20130134127A1
Автор: Kaneko Kentaro, Kobayashi Kazuhiro, KODANI Kotaro
Принадлежит: SHINKO ELECTRIC INDUSTRIES CO., LTD.

A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad. 1. A method of fabricating a wiring board , comprising:an electrode pad forming step forming an electrode pad on a support plate made of a first metal;a projecting part forming step forming, on the support plate at a portion opposing the electrode pad, a projecting part which exposes a surface of the electrode pad on a side opposing the support plate and contacts the electrode pad, by etching the support plate;an insulator layer forming step forming an insulator layer covering the electrode pad, the projecting part, and a surface of the support plate formed with the projecting part;a conductor pattern forming step forming, on the insulator layer, a conductor pattern connected to the electrode pad; anda support plate removing step removing the support plate formed with the projecting part by an etching, after the conductor pattern forming step, to thereby expose a portion of the surface of the electrode pad on the side opposing the support plate and form in the insulator layer an opening having a shape corresponding to a shape of the projecting part.2. The method of fabricating the wiring board as claimed in claim 1 , wherein the projecting part forming step etches the support plate so that the shape of the projecting part widens from the electrode pad towards the support plate.3. The method of fabricating the wiring board as claimed in claim 1 , wherein a first metal layer forming step forming a first metal layer made of a metal different from the first metal; and', 'a second metal layer forming step forming, on the first metal layer, a second metal layer made of a metal different ...

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Номер записи: 99
30-05-2013 дата публикации

EDGE DETECTION

Номер: US20130136852A1
Автор: Liehr Stefan, Ortega-Cagara Rina, Riedel David
Принадлежит: PLASTIC LOGIC LIMITED

A technique comprising: forming a plurality of smaller substrates from one or more larger substrates by a reduction process according to which there is some possible variation size between the smaller substrates within a variation range; and, in advance of said reduction process, providing said one or more larger substrates with one or more detection marks whose size and location are selected such that after the reduction process each smaller substrate includes a portion of at least one of said one or more detection marks, said portion having one or more edges that coincide with at least a part of one or more edges of the smaller substrate whatever actual size the smaller substrate has within said variation range. 1. A method comprising: forming a plurality of smaller substrates from one or more larger substrates by a reduction process according to which there is some possible variation size between the smaller substrates within a variation range; and , in advance of said reduction process , providing said one or more larger substrates with one or more detection marks whose size and location are selected such that after the reduction process each smaller substrate includes a portion of at least one of said one or more detection marks , said portion having one or more edges that coincide with at least a part of one or more edges of the smaller substrate whatever actual size the smaller substrate has within said variation range.2. A method according to claim 1 , comprising: forming each of said smaller substrates from a respective larger substrate by removing an edge portion of said larger substrate according to a removal process according to which there is some possible variation in the size of the removed edge portion between substrates within a variation range; and in advance of said removal process claim 1 , providing each larger substrate with one or more detection marks whose size and location are selected such that a portion of each detection mark remains as ...

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Номер записи: 100