СПОСОБ ИЗГОТОВЛЕНИЯ МНОГОСЛОЙНЫХ ПЕЧАТНЫХ ПЛАТ И МНОГОСЛОЙНАЯ ПЕЧАТНАЯ ПЛАТА

Способ изготовления многослойных печатных плат, известных как мультислои, включающих по меньшей мере две электроизолированные подложки с электропроводным рисунком или слоями, выполненными на по меньшей мере трех их поверхностях, при котором посредством получения слоистой структуры под давлением отвержденную базовую подложку на основе VD-армированного синтетического материала с рисунком на обеих сторонах комбинируют и соединяют со вспомогательной (задней) подложкой, добавляемой к базовой подложке, при этом вспомогательная подложка, содержащая VD-армированный отвержденный слой твердого заполнителя, имеет по меньшей мере на стороне, обращенной к проводящему рисунку базовой подложки, слой пластически деформируемого (текучего) связующего, и ее ламинат оказывается такое давление, чтобы привести в соприкосновение отвержденный слой твердого заполнителя вспомогательной (задней) подложки с проводящим рисунком базовой подложки, а связующий материал заполнил пустоты между этим рисунком для соединения ...

НОСИТЕЛЬ ИНФОРМАЦИИ С ЭЛЕКТРОННЫМ МОДУЛЕМ И СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ

... 1. Однослойный или многослойный носитель данных, выполненный в виде карточки на ИС с интеллектом со встроенным электронным модулем (1), служащим для обмена данными с внешним устройством, отличающийся тем, что этот носитель данных выполнен из бумаги и/или картона. 2. Носитель данных по п.1, отличающийся тем, что он состоит из корпуса (3) карточки с выемкой, в которую заделывают электронный модуль (1), и что размеры корпуса (3) карточки соответствуют стандарту ISO 7810. 3. Носитель данных по пп.1 - 2, отличающийся тем, что встроенный электронный модуль (1) имеет контактные площади (73) для контактного обмена данными и что контактные площадки (73) расположены в зоне носителя данных, определенной стандартом ISO 7816/2. 4. Носитель данных по одному или нескольким пп. 2 - 3, отличающийся тем, что корпус (3) карточки выполнен из однослойного картона (17), который содержит выемку для размещения электронного модуля (1). 5. Носитель данных по п. 4, отличающийся тем, что поверхности картона (17) снабжены ...

Микросхема

POLYIMID-ZUSAMMENSETZUNG UND DAMIT HERGESTELLTES PREPREG UND LAMINAT

KUPFERKASCHIERTE LAMINIERTE PLATTE, LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG

Verfahren zur Bildung einer Drahtbondelektrode auf einer Dickschichtleiterplatte

Verfahren zum Herstellen einer Drahtbondelektrode auf einer Dickschichtleiterplatte, bei welcher eine Kupfer-Dickschicht (2) als Verdrahtungsschicht auf einem isolierenden Substrat (1) gebildet ist und ein auf dem isolierenden Substrat angebrachtes Teil (7) elektrisch mit der Kupfer-Dickschicht (2) über einen Golddraht (8) verbunden ist, mit: einem Schritt des Druckens der Kupfer-Dickschicht (2) auf das isolierende Substrat und des Sinterns der Kupfer-Dickschicht zur Bildung der Verdrahtungsschicht; und einem Schritt des Druckens einer Gold-Dickschicht, welcher vor dem Drucken Kupfer hinzugefügt worden ist, auf das isolierende Substrat und des Sinterns der Gold-Dickschicht als Drahtbondelektrode, um wenigstens partiell die Kupfer-Dickschicht zu überlappen, welche auf dem isolierenden Substrat gebildet ist.

LAMINIERTES SUBSTRAT FUER INTEGRIERTE SCHALTUNGEN.

VERBUNDMATERIAL AUS HOCHTEMPERATURBESTAENDIGEN POLYMEREN UND DIREKT DARAUF AUFGEBRACHTEN METALLSCHICHTEN.

Composite materials consist of thermoplastics (I) based on polyaryl ether sulphones, polyarylene ether ketones, polyether imides or thermotropic polymers, which are resistant to high temp., and a metal layer (II) applied directly to this, the surface area of which is increased by chemical or mechanical treatment. The novel features are that the enlarged surface area of (II) is towards (I); and the bond strength between (I) and (II) is min. 1.9 N/m, measured at a peel rate of 20 mm/min and angle of peel of 180 deg.C..

Leitfähige Muster-Schichtstruktur und Verfahren zur Herstellung der leitfähigen Muster-Schichtstruktur

Gegossene gedruckte Schaltungsplatte.

Keramik-Metall-Verbund und Verfahren zu seiner Herstellung.

"IDENTIFIZIERUNGSANORDNUNG IN FORM EINES AN EINEM GEGENSTAND ANBRINGBAREN, ETIKETTARTIGEN STREIFENS"

VERFAHREN UND EINRICHTUNG ZUR HERSTELLUNG VON LEITENDEN MUSTERN AUF EINEM SUBSTRAT.

Klebstoffzusammensetzung für gedruckte Schaltungen.

Substrat, verwendbar bei der Herstellung einer Dickschichtschaltung.

Elektrolumineszierende Anordnung von Verbindungshalbleitern.

LAMINIERHARZ AUF DER BASIS VON EPOXYDHARZZUSAMMENSETZUNGEN UND DAMIT HERGESTELLTE VERBUNDSTOFFE.

A polymer compsn. comprises 50-99.5 wt.% advanced epoxy resin and 0.5-50 wt.% halogenated phenoxy resin (I). (I) has halogen substd. in the aromatic nuclei and contains at least 5 wt.% halogen. (I) has the formula (A) where A is a direct bond, 1-20C hydrocarbylene, -S-, -S-S-, -SO-, -SO2-, -O-, or -CO-; Z is -OH or glycidyloxy; R1 is H or 1-4C alkyl; Ar' represents phenylene groups, at least some of which are halogenated; n = 12-150. The epoxy resin has the formula (B) (where G is glycidyl which can be 1-4C alkyl substd.; Ar is phenylene which can be 1-4C alkyl or halogen-substd. and n' = 0-10. (I) has a halogen content of 20-40 wt.% and is used at 3-10 wt.% of the compsn. Dicyandiamide is used as a curing agent.

VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG VON OPTISCHEN WELLENLEITERN AUF METALLISCHEN SUBSTRATEN.

Laminierte Leiterplatte und Herstellungsverfahren

Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte

VERBESSERTE POLYARYLENETHERZUSAMMENSETZUNGEN UND VERFAHREN ZU IHRER HERSTELLUNG

UNIDIREKTIONALE GLASGEWEBE HERGESTELLT MIT ENDLOSGARNEN MIT GERINGER ODER OHNE VERDREHUNG UND VERFLOCHTEN MIT DÜNNEN GLASGARNEN ALS STABILISIERUNGSELEMENTE, UND VERWENDUNG ZUR HERSTELLUNG VON GEDRUCKTEN SCHALTUNGEN

PROCESS FOR SELECTIVELY DEPOSITING A NICKEL-BORON COATING OVER A METALLURGY PATTERN ON A DIELECTRIC SUBSTRATE AND PRODUCTS PRODUCED THEREBY

UV-HÄRTBARE HARZZUSAMMENSETZUNG UND DIE ZUSAMMENSETZUNG ENTHALTENDE PHOTOLOTRESISTTINTE

Hitzehärtbare Silikonzusammensetzung, Harzfilm, Metallfolie, Isolationsfilm, Metall-Leiterplatte-Laminat, Multischicht-Leiterplatte, die Zusammensetzung enthaltend und Verwendung der Zusammensetzung

Gewalzte Kupferfolie für eine flexible gedruckte Schaltung und Herstellungsverfahren dafür

Process for the production of flexible printed circuit boards for high bending stress

Zur Herstellung von durchkontaktierten flexiblen Leiterplatten, deren Schichtenaufbau im Biegebereich streng symmetrisch ist und die keinerlei freiliegenden Klebstoff aufweisen, werden zunächst Registrierbohrungen in ein kupferkaschiertes Basismaterial gebohrt, sodann, unter Aussparung des Biegebereiches, mit Hilfe der Registrierbohrungen eine klebende Schicht auf die Trägerfolie des Basismaterials aufgebracht, eine zweite Kupferfolie auf die Kleberschicht gelegt, laminiert, Durchgangskontaktbohrungen und Leiterbahnen im flexiblen Bereich aufgebracht, wobei ebenfalls die Registrierbohrungen als Positionshilfe dienen, die Zwischenbereiche der Leiterbahnen sowie die gesamte Kupferfolie im Biegebereich abgeätzt und zuletzt alle Leiterbahnenbereiche mit Deckfolie abgedeckt. Im Biegebereich befinden sich somit die Leiterbahnen in der neutralen Faser. For the production of plated-through flexible printed circuit boards, the layer structure of which is strictly symmetrical in the bending area and which do not have any exposed adhesive, registration holes are first drilled in a copper-clad base material, then, with the exception of the bending area, an adhesive layer is applied to the carrier film of the base material with the help of the registration holes , put a second copper foil on the adhesive layer, laminated it, applied through-contact bores and conductor tracks in the flexible area, whereby the registration holes also serve as a positioning aid, the intermediate areas of the conductor tracks as well as the entire copper foil in the bending area are etched and finally all conductor track areas are covered with cover foil. In the bending area, the conductor tracks are located in the neutral fiber.

Verbundwerkstoff und Verfahren zu deren Herstellung

GEDRUCKTES SCHALTELEMENT MIT POLYIMID ENTHALTENDER DECKSCHICHT

Organisches Antireflex-Beschichtungspolymer, Antireflex-Beschichtungszusammensetzung und Verfahren zur Herstellung derselben

Verbindung mit der Struktur der folgenden Formel 1: wobei gilt: R, R' und R'' sind jeweils unabhängig aus der Gruppe ausgewählt, die aus Wasserstoff und Methyl besteht; Ra bis Rd und R1 bis R18 sind jeweils unabhängig aus der Gruppe ausgewählt, die aus -H, -OH, -OCOCH3, -COOH, -CH2OH oder Alkyl mit 1 bis 5 Kohlenstoffatomen und Alkoxy-Alkyl mit 1 bis 5 Kohlenstoffatomen besteht; m und n stellen eine ganze Zahl dar, die aus der Gruppe ausgewählt ist, die aus l, 2, 3, 4 und 5 besteht; x, y und z stellen jeweils einen Molenbruch im Bereich von 0,01 bis 0,99 dar.

Gedruckte Leiterplatte und ihre Anordnung

Substrate for a power semiconductor module in an electric vehicle has a buffer layer of intermediate thermal expansion coefficient interposed between an insulating substrate and a heat sink

A power module substrate comprises a buffer layer of intermediate thermal expansion coefficient interposed between an insulating substrate and a heat sink. A power module substrate has a buffer layer which is interposed between an insulating substrate and a heat sink and which has a surface area one to three times larger than that of the substrate. The buffer layer is formed of a material with a thermal expansion coefficient intermediate between those of the substrate and the heat sink.

Silicon composition low dielectric film, semiconductor device and method for producing low dielectric films

A composition comprising a siloxane resin, a silicon compound substantially consisting of silicon, carbon and hydrogen, wherein the number ratio of carbon to silicon atoms forming an -X- bond (wherein X is (C)m (where m is an integer in the range of from 1 to 3), or a substituted or unsubstituted aromatic group with 9 or less carbon atoms) in the main chain of one molecule is in the range of from 2:1 to 12:1, and a solvent, is subjected to a heat treatment to form a low dielectric constant film. Accordingly, a low dielectric constant film having excellent resistance against chemicals and excellent moisture resistance is provided. A semiconductor integrated circuit having a fast response can be produced by using the film.

Adhesive resin composition

HEATING ELEMENTS AND METHODS OF MANUFACTURING SUCH ELEMENTS

... 1391814 Enamelling ORBAICETA SA 7 Nov 1972 [12 April 1972] 51213/72 Heading CIM [Also in Division H5] A resistance heating element comprises a printed conductor on a support in the form of an iron plate having a carbon content of 0À04% or less coated with a plurality of vitrified enamel layers. The plate preferably consists of iron laminations. Each enamel layer is annealed and preferably cooled to room temperatures before the next layer is applied. After the layers are applied, the support plate is cured naturally or artificially. Next, the plate is heated to a temperature just below the melting point of the metal conductor to be applied and the conductor in the form of aluminium, copper or zinc is projected by an air stream from a flame pistol on to the support.

MULTI-LAYER PRINTED WIRING BOARDS

Epoxy resin composition process for producing the same and resin-sealed semiconductor device

Metal-clad laminate construction

A metal-clad laminate having special utility in the production of high resolution printed circuit patterns and preparation of the laminate are described. The laminate preferably comprises a resin- bonded, glass-reinforced substrate, a layer of coupling agent covering and bonded to a major surface of the substrate, a layer of ultra-thin copper adjacent the layer of coupling agent, and a composite bonding layer disposed between the copper layer and the layer of coupling agent. The composite bonding layer comprises copper alloyed with at least one non-copper metal and oxide material of the non-copper metal.

A method of producing a hybrid multi-layered circuit substrate

A method for producing a hybrid multi-layered circuit substrate which utilizes prefabricated flexible printed circuit(s) which are rigidized in areas which define high density hybrid circuits. The hybrid circuit regions are formed by disposing copper-lined sheets on both surfaces of the flexible circuit, adhesively bonding the copper-lined sheets to the flexible circuit, forming through-hole conductors and etching a circuit pattern in the copper layer of the lined sheets. The copper-lined sheets are initially general coextensive in size and shape with the flexible circuit and are subsequently severed so that the copper-lined sheets remain only in the hybridized portions of the product. Separation is achieved by mechanically punching along predetermined boundaries and is facilitated by providing either any elongated narrow through-hole at the boundary of the hybrid circuit from which the flexible circuit will extend the end product or by forming a groove in the copper-lined sheets at such ...

MULTILAYER PRINTED WIRING BOARDS AND METHOD FOR MAKING SAME

CERAMIC SUBSTRATE FOR HYBRID MICROCIRCUITS AND METHOD OF MAKING THE SAME

Printed polymer circuits and contacts

A conductive component for carrying electrical signals constructed from a molded polymer substrate and a conductive coating adhered to the substrate, the coating defining a continuous electrical pathway between at least two terminals. Preferably, molded plastic such as liquid crystal polymer is formed to make circuits having conductive ink adhered thereto in order to provide inexpensive and versatile printed circuit boards for carrying electrical traces and other components and to provide printed formed contacts. The conductive solderable inks can be adhered to the substrate, for example, via screen printing, brush spraying, dipping, masking, vacuum, plating or vacuum deposition with subsequent oven drying, reflowing in a vapor phase, post curing or plating.

Improved cermet resistive element for variable resistor

An improved resistive element comprises a film-type resistive layer applied to an insulative substrate and then fired. An array of discrete, spaced apart islands of predominantly conductive material is then applied to the resistive layer in a repetitive pattern having predetermined inter-island spacing. The islands have a conductivity that is substantially greater than the conductivity of the resistive layer. Preferably, the islands are of substantially uniform shape and size. In one preferred embodiment, the islands are formed of a conductive thick film ink that is screen-printed onto a cermet resistive layer through an appropriate mask, and then fired. In another preferred embodiment, the islands are formed of a conductive metal that is applied to the resistive layer by vapor deposition, sputtering, or ion implantation through a suitable mask. Either embodiment of the invention provides a resistive element with lower contact resistance and improved contact resistance stability than prior ...

Composition of epoxy group-containing cycloolefin resin

SUPERCONDUCTING ARTICLES

GLASS CERAMIC ARTICLE

Epoxy resin composition process for producing the same and resin-sealed semiconductor device

FILM RESISTOR FOR FLOW MEASURING APPARATUS

A METHOD FOR FORMING ELECTRICALLY CONDUCTIVE CIRCUITS ON A BASE BOARD

WIRED SUBSTRATE FOR MOUNTING LARGE-SCALE INTEGRATED CIRCUITS USED IN DATA PROCESSING AND COMMUNICATION SYSTEMS

METALLIC LEADS FOR ELECTRONIC DEVICES

... 1331901 Component assemblies; semi-conductor devices E I DU PONT DE NEMOURS & CO 4 Feb 1972 [5 Feb 1971] 5408/72 Headings H1K and H1R [Also in Division H2] In a semi-conductor device package, the thick film material substrate 8 is connected to metallic leads 2, by means of a clamp portion 3. Bifurcated fingers 4 and 5 clamp the lead to the terminal 9, and are soldered thereto, and laterally disposed offset tab 7 is adapted to abut the clamp 3 at a predetermined distance from the substrate. In Fig. 3, an adaptation with only two of the described leads 11 is shown. The nature of the clamp is to maintain a rigid bond at the high temperatures required for the use of thick film materials in the insulating dielectric, 13, substrate 8, metallurgical seal ring 12, conducting fingers 14 semi-conductor die attachment region 15, and terminal pads 9, the assembly may then be hermetically sealed. An elongated shorting or tie bar 1 is provided to maintain the leads 2 in proper relationship to each other ...

PROCESS OF PRODUCING RESINOUS BOARD HAVING A ROUGH SURFACE USABLE FOR FIRMLY SUPPORTING THEREON A PRINTED CIRCUIT

... 1420156 Laminates FUJITSU Ltd 20 June 1973 [29 June 1972] 29181/73 Heading B5N [Also in Divisions C7 and H1] A board for a printed circuit is produced with a rough surface to improve circuit adhesion by forming the board from a synthetic resin impregnated fibrous web under heat and pressure, the pressure members having a rough surface produced by electrolytic or electroless deposition of metal thereon. The board surface may have concavities and convexities of between 1 and 5 Á in height, and if desired, portions of the metal layer may remain on the board to form a base layer of the printed circuit. The board may be of glass, or synthetic, fibre webs, fabrics or paper. To conserve the rough surface of the metal layer prior to pressing, the layer may be coated with a polymer which later forms a surface region of the board.

PRODUCING POLYIMIDE/METALLIC FOIL FILM

CIRCUIT BOARDS

SURFACE MOUNTING LEADLESS COMPONENTS ON CONDUCTOR PATTERN SUPPORTING SUBSTRATES

MULTILAYER PRINTED WIRING BOARDS & METHOD FOR MAKING SAME

Multilayer circuit component and method for manufacturing the same

Improvements in and relating to printed circuits

... 1,019,345. Printed circuits. SOC. D'ELECTRONIQUE ET D'AUTOMATISME. Aug. 30, 1962 [Sept. 4, 1961], No. 33311/62. Heading H1R. A transfer plate for producing printed circuits comprises a rigid plate of insulating material having on one face thereof a printed circuit pattern the outer surface of which is formed of a metal having low adhesion to metal plated thereon to form the printed circuits (which are transferred on to a permanent base), said outer surface being flush with the face of the plate. As described a laminated plate comprises a layer of uncured epoxy glass and a Cu foil. The desired pattern is etched in the foil, using a photo-resist technique, and the resulting pattern is plated with hard Cr. The plate is then compressed in a heated press or die to make the plated pattern flush with the epoxy glass while hardening the latter. In use, the Cr pattern is plated with a layer of Cu which is transferred directly to a base in known manner, or is stripped from the Cr for subsequent bonding ...

Heat shock resistant printed circuit board assemblies

The heat shock resistance of plated through holes in printed circuit assemblies is significantly increased by using as the through hole plating a special multi-layered arrangement comprising at least two layers of an electrically conductive metal in combination with at least one intermediate layer of a different electrically conductive metal. In preferred embodiments, the through hole plating comprises at least two layers of a stressed metal together with at least one intermediate layer of a metal having a stress in counteraction to that of one or more of the other metal layers. These through hole platings are capable of exposure to conditions of heat shock, such as encountered during high temperature soldering, without developing cracks resulting in breaks in the conducting pathways and failures.

NICKEL PHOSPHIDE-BORIDE DISPERSIONS

PRINTED CIRCUITS

PROCEDURE FOR THE PRODUCTION MIDPLANE

ADHESIVE, ADHESIVE ARTICLE, CIRCUIT SUBSTRATE FOR SEMICONDUCTOR ASSEMBLY WITH AN ADHESIVE AND A SEMICONDUCTOR ARRANGEMENT THESE CONTAINS

TRENNPLATTE ZUM HERSTELLEN VON LEITERPLATTENKOMPONENTEN

HEAT-HARDENABLE SILICONE COMPOSITION, RESIN FILM, METAL FOIL, ISOLATION FILM, METAL PRINTED CIRCUIT BOARD LAMINATE, MULTI-SHIFT LEADER PLATE, THE COMPOSITION CONTAINING AND USE OF THE COMPOSITION

UVFROM-HARDCASH RESIN COMPOSITION AND PHOTOLÍT RESIST COLORING MATERIAL WITH THE COMPOSITION

LAMINATED STRUCTURE, SENSOR AND MANUFACTURING PROCESS AND USE FOR IT

VERFAHREN ZUM HERSTELLEN VON GEDRUCKTEN SCHALTUNGEN

PROCEDURE FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH STARING AND FLEXIBLE RANGES

WELDABLE CONDUCTIVE COMPOSITIONS, YOUR APPLICATION AS COATINGS ON SUBSTRATES AND SUITABLE COMPOSITIONS TO YOUR EDUCATION.

DIELECTRIC MATERIALS WITH LOW DIELECTRIC CONSTANTS AND PROCEDURES FOR YOUR PRODUCTION.

POLYIMIDHARZLAMINATE.

THE SCHICHTFOERMIGE GREENS CERAMIC(S).

PROCEDURE FOR THE PRODUCTION OF A SUBSTRATE WITH MANAGING PORTIONS

LAMINATED PLASTIC ON EPOXY RESIN BASIS FOR PRINTED CIRCUITS.

PRODUCTION OF DIELECTRIC PLATES PLATED WITH COPPER.

WELL AT THE FORM LYING CLOSE COATING SYSTEMS.

EPOXY RESIN MIXTURES FOR PREPREGS AND COMPOSITE MATERIALS

INTERFERENCE DECREASE OF MEANS OF DIRECTIONS OF THERMOPLASTIC BONDING MATERIALS

Procedure for the production of a Schichtkörpers for printed circuits

Procedure for the production of a printed circuit of small dimensions serving as heating element

UNIDIRECTIONAL GLASS FABRICS MANUFACTURED WITH CONTINUOUS YARNS WITH SMALLER OR WITHOUT TWIST AND INTERTWINED WITH THIN GLASGARNEN THAN STABILIZATION ELEMENTS, AND USE TO THE PRODUCTION OF PRINTED CIRCUITS

Electrical and electronic components made of a polyamide composition

A MULTILAYER STRUCTURE AND ITS FABRICATION METHOD

EPOXY RESINS FROM TRIGLYCIDYL ETHERS AND DIHYDRIC PHENOLS

Expansible synthetic resin baffle with magnetic attachment

SEPARATOR PLATE FOR THE PRODUCTION OF CIRCUIT BOARD COMPONENTS

Multifunctional cyanate ester and epoxy blends

Interference mitigation through conductive thermoplastic composite materials

PRINTED CIRCUIT BOARD

Laminates for printed circuits using unidirectional glass fabric

SYNTHETIC MICA PRODUCTS

METHOD TO ENSURE THE COOLING OF ELECTRONIC COMPONENTS FIXED ON A MULTILAYER FOR PRINTED CIRCUITS AND MULTILAYER REALIZED ACCORDING TO SAID METHOD

POLYMERIC FILM ADHESIVE FOR METAL-CLAD SHEETING

METALLISABLE SUBSTRATES FOR PRINTED CIRCUITS, AND THEIR PREPARATION

L'invention concerne des substrats isotropes métallisables ayant de très faibles coefficients de dilatation,caractérisés en ce qu'ils sont constitués par des fibres polymériques liées par un polymère à groupements imides et par des charges, mis en forme par voie humide, séchés puis pressés à chaud. L'invention concerne également un procédé pour la fabrication de ces substrats. Ces substrats peuvent être métallisés sélectivement pour former des circuits imprimés.

POLYMER FILM WITH CONDUCTIVE PATTERN AND METHOD OF MANUFACTURING THE SAME

A polymer film with a conductive electrode has an insulated polymer film with an electrically conductive pattern containing an electrically conductive polymer of an aromatic compound, the conductive pattern being formed on at least one major surface of the insulated film, and an internal portion extending from the at least one major surface.

SURFACE-ROUGHENED FILM AND SHEET, AND PROCESS FOR PRODUCTION AND USE THEREOF

SURFACE-ROUGHENED FILM AND SHEET, AND PROCESS FOR PRODUCTION AND USE THEREOF An essentially non-oriented surface roughened film or sheet comprising a homopolymer or copolymer of 4methyl-1-pentene having the surface roughness of 0.5 to 10 micrometers; a process for production of the abovementioned surface roughened film or sheet comprising the following steps (1) preparing a molten composition comprising a homopolymer ox copolymer of 4-methyl-1-pentene, (2) extruding the molten composition to form a film or sheet, and (3) placing the film or sheet in contact with a roller having a roughened surface or passing the film or sheet through a pair of rollers, at least one of which has a roughened surface; and the use of the above-mentioned surface roughened film or sheet for the manufacture of single-sided metal clad laminates.

ELECTRICAL LAMINATE

Invention: ELECTRICAL LAMINATE An electrical laminate comprising layers of a polyester resinimpregnated fibrous cellulosic substrate is disclosed. The substrate is preimpregnated with a nitrogen-containing composition having (a) N-methylol or N-lower alkoxymethyl group attached to said nitrogen atom, and (b) an unsaturated group capable of coploymerizing with a cross-linking monomer present in the polyester resin.

ULTRA HIGH-FREQUENCY CIRCUIT

... an ultra-high-frequency circuit realized on an insulating aluminiumoxide substrate according to hybrid technology and by silk screen printing. Silver-palladium is used for the mass surface instead of gold of the prior art circuits. The connection between the conductive gold tracks of the circuit and the mass surface of silverpalladium through the metallized holes is ensured by the intertposition of a gold-platinum alloy metallization. The gold-platinum alloy interconnection is necessary in order to obtain a stable configuration. avoiding migration of silver into the gold of the circuit. The new configuration provides a considerable reduction of cost with respect to an assembly with total metal appliance of gold.

Adhesion promotion in printed circuit boards

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Adhesion promotion in printed circuit boards

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Ultraviolet curable resin composition and photo solder resist including the same

An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating. This resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy-group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group to obtain an intermediate product, and then reacting the intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in its molecule; (C) a photo-polymerization initiator; (D) a diluent; and (E) an ultraviolet curable resin obtained by reacting a novolac epoxy compound (e) with the ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with the saturated or unsaturated polybasic acid anhydride (c). The ultraviolet curable resin (E) has an acid value of 10 mgKOH/g or more and less than 45 mgKOH/g.

Resist ink composition for manufacturing printed circuit board, resist film using the same, and printed circuit board

Printed circuit board

Active energy ray-curable composition and printed wiring board

Composition for photoimaging

According to the present invention, an improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of an difunctional epoxy resin. Since the photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns. The photosensitive cationically polymerizable non-brominated epoxy based solder mask has a glass transition temperature greater than about 100° C., preferably greater than about 110° C. The solder mask dries to a tack-free film; thus, artwork used in the photoimaging process will not stick to the dried soldermask film. The polyol resin which is a condensation product of epichlorohydrin and bisphenol A, has a weight average molecular weight of between about 40,000 and 130,000. The polyepoxy resin is an epoxidized multi-functional bisphenol A formaldehyde novolak resin having a weight average molecular weight of 4,000 to 10,000. The epoxidized diglycidyl ether of bisphenol A has two epoxide groups per molecule, a melting point of between about 80° C. and about 110° C. and a weight average molecular weight of between about 600 and 2,500. The invention also relates to a cationically polymerized solder mask.

Machine direction oriented polymeric films and methods of making the same

This invention relates to a film comprising a machine direction oriented polymeric film prepared from (A) at least one propylene homopolymer or copolymer or lend of two or more thereof, wherein (A) has a melt flow rate from about 6 to about 30 and (B) an olefin elastomer having a melt flow rate of 0.5 to 10. In one embodiment, the film also contains a nucleating agent. In one embodiment, these films are clear. The films have good stiffness and clarity with low haze. These films are useful in preparing labels and may be used as a monolayer film or in a multilayer film. In one embodiment, the films are printable. Die-cut labels are also described which comprise a composite comprising the extruded, machine-direction oriented polypropylene copolymer films of the present invention in combination with an adhesive associated with said copolymer films for adhering said label to a substrate. Multilayer composites also are described which comprise a label facestock material comprising an extruded oriented multilayer film of the present invention, an adhesive layer associated with said facestock material, and a release-coated liner or carrier. Combinations of the labels of the present invention joined with layer of adhesive to a substrate such as glass bottles also are described.

Oriented films comprising polypropylene / olefin elastomer blends

This invention relates to a film comprising a machine direction oriented polymeric film prepared from (A) at least one propylene homopolymer or copolymer or lend of two or more thereof, wherein (A) has a melt flow rate from about 6 to about 30 and (B) an olefin elastomer having a melt flow rate of 0.5 to 10. In one embodiment, the film also contains a nucleating agent. In one embodiment, these films are clear. The films have good stiffness and clarity with low haze. These films are useful in preparing labels and may be used as a monolayer film or in a multilayer film. In one embodiment, the films are printable. Die-cut labels are also described which comprise a composite comprising the extruded, machine-direction oriented polypropylene copolymer films of the present invention in combination with an adhesive associated with said copolymer films for adhering said label to a substrate. Multilayer composites also are described which comprise a label facestock material comprising an extruded oriented multilayer film of the present invention, an adhesive layer associated with said facestock material, and a release-coated liner or carrier. Combinations of the labels of the present invention joined with layer of adhesive to a substrate such as glass bottles also are described.

Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board

A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol% or more of a compound represented by the following general formula (1) and 20 mol% or more of a compound represented by the following general formula (2).

Electrical feedthrough structure and manufacturing process

Resin composition and flexible printed circuit board

A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300 °C or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5 - 8.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 µm or below, thickness b: 1.0 µm or below, and aspect ratio (a/b): 20 or above.

Machine direction oriented polymeric films and methods of making the same

This invention relates to a film comprising a machine direction oriented polymeric film prepared from (A) at least one propylene homopolymer or copolymer or lend of two or more thereof, wherein (A) has a melt flow rate from about 6 to about 30 and (B) an olefin elastomer having a melt flow rate of 0.5 to 10. In one embodiment, the film also contains a nucleating agent. In one embodiment, these films are clear. The films have good stiffness and clarity with low haze. These films are useful in preparing labels and may be used as a monolayer film or in a multilayer film. In one embodiment, the films are printable. Die-cut labels are also described which comprise a composite comprising the extruded, machine-direction oriented polypropylene copolymer films of the present invention in combination with an adhesive associated with said copolymer films for adhering said label to a substrate. Multilayer composites also are described which comprise a label facestock material comprising an extruded oriented multilayer film of the present invention, an adhesive layer associated with said facestock material, and a release-coated liner or carrier. Combinations of the labels of the present invention joined with layer of adhesive to a substrate such as glass bottles also are described.

Machine direction oriented polymeric films and methods of making the same

This invention relates to a film comprising a machine direction oriented polymeric film prepared from (A) at least one propylene homopolymer or copolymer or lend of two or more thereof, wherein (A) has a melt flow rate from about 6 to about 30 and (B) an olefin elastomer having a melt flow rate of 0.5 to 10. In one embodiment, the film also contains a nucleating agent. In one embodiment, these films are clear. The films have good stiffness and clarity with low haze. These films are useful in preparing labels and may be used as a monolayer film or in a multilayer film. In one embodiment, the films are printable. Die-cut labels are also described which comprise a composite comprising the extruded, machine-direction oriented polypropylene copolymer films of the present invention in combination with an adhesive associated with said copolymer films for adhering said label to a substrate. Multilayer composites also are described which comprise as label facestock material comprising an extruded oriented multilayer film of the present invention, an adhesive layer associated with said facestock material, and a release-coated liner or carrier. Combinations of the labels of the present invention joined with layer of adhesive to a substrate such as glass bottles also are described.

Process for the manufacture of through-hole contacted flexible circuit boards for high bending stresses and the circuit boards made therefrom

A multi-layer through-hole contacted flexible circuit board and method of manufacture thereof is presented having a laminar construction which is strictly symmetrical in the bending area; and which have no exposed adhesive. Registration holes are first introduced in a copper-laminated base material, then, avoiding the bending area, with the aid of the registration holes, an adhesive layer is applied to the non-conductive film carrier of the base material. Next, a second copper foil is placed on the adhesive layer. Thereafter, all of the layers are laminated. This is followed by the formation of through-holes in the area surrounding the bending area while circuit patterns are formed in the flexible or bending area (the registration holes again providing assistance in positioning). The spaces between the circuit pattern, as well as the entire copper foil, is then etched away in the bending area, and, finally, all the conducting path areas are covered with non-conductive cover film. As a result, the conducting paths are located in the "neutral section", that is, the area of the flexible circuit board which is neutral with respect to the forces generated during bending.

Adhesion promotion in printed circuit boards

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Adhesion promotion in printed circuit boards

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Adhesion promotion in printed circuit boards

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Adhesion promotion in printed circuit boards

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Adhesion promotion in printed circuit boards

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Adhesion promotion in printed circuit boards

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Electroless plating liquid and semiconductor device

The present invention relates to an electroless-plating liquid useful for forming a protective film for selectively protecting surface of exposed interconnects of a semiconductor device which has an embedded interconnect structure formed by an electric conductor, such as copper or silver, embedded in fine recesses for interconnects formed in a surface of a semiconductor substrate, and also to a semiconductor device in which surfaces of exposed interconnects are selectively protected with a protective film. The electroless-plating liquid contains cobalt ions, a complexing agent and a reducing agent containing no alkali metal.

Elastomer connector for integrated circuits or similar, and method of manufacturing same

An elastomer connector is disclosed for integrated circuits or similar, comprising an elastomer material support on one face of which is formed a dense network of electro-conducting lines. Using photo-etching techniques and metal deposition on a layer of strippable material, which techniques are used for manufacturing integrated circuits, the lines may be given a very small width and very high conductivity.

Adhesion promotion in printed circuit boards

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Adhesion enhancement on printed circuit boards

Una composición de potenciación de la adhesión para mejorar la adhesión entre una capa conductora de cobre y un material dieléctrico durante la fabricación de una placa de circuito impreso, comprendiendo la composición de potenciación de la adhesión al menos el 0,1 % en peso y no más del 20 % en peso de un inhibidor de la corrosión que comprende un triazol, un tetrazol o un imidazol, al menos el 14 % en peso de un ácido inorgánico que comprende H2SO4 y HNO3, un agente de oxidación que comprende al menos el 1 % en peso peróxido de hidrógeno y no más del 20 % en peso peróxido de hidrógeno, ión cloruro en una concentración de entre 20 ppm y 100 ppm, y un alcohol que es un alcohol oligomérico o un derivado de alcohol oligomérico, dicho alcohol constituye entre el 0,5 % en peso y el 20 % en peso de la composición para aumentar la carga de cobre en la composición, y en donde la composición de potenciación de la adhesión está inicialmente sustancialmente libre de metales de transición que tienen una tendencia a desestabilizar el agente de oxidación. An adhesion-enhancing composition for improving the adhesion between a conductive layer of copper and a dielectric material during the manufacture of a printed circuit board, the adhesion-enhancing composition comprising at least 0.1% by weight and not more than 20% by weight of a corrosion inhibitor comprising a triazole, a tetrazole or an imidazole, at least 14% by weight of an inorganic acid comprising H2SO4 and HNO3, an oxidizing agent comprising at least 1 % by weight hydrogen peroxide and not more than 20 % by weight hydrogen peroxide, chloride ion in a concentration between 20 ppm and 100 ppm, and an alcohol that is an oligomeric alcohol or an oligomeric alcohol derivative, said alcohol constituting between 0.5 wt% and 20 wt% of the composition to increase the copper loading in the composition, and wherein the adhesion-enhancing composition is initially substantially free of transition metals having They have a tendency ...

Adhesion promotion in printed circuit boards

Method for promoting adhesion of printed circuit board

Adhesion promotion in printed circuit boards

印刷电路板中的增粘剂

本发明提供了一种在制造印刷电路板时提高铜导电层和电介质材料之间粘合力的增粘剂工艺和组合物，该组合物包括阻蚀剂、无机酸和有助于提高所述组合物中铜负荷的醇。

Adhesion promotion in printed circuit boards

Multilayer circuit boards and processes of making the same

This invention relates to a process for improving the adhesion of copper circuitry to a dielectric layer and a method for forming a multilayer printed circuit board wherein the copper circuitry of the board is covered with a layer of an oxide, hydroxide, or combination thereof of a metal selected from the group consisting of tin, bismuth, lead, indium, gallium, germanium, and alloys of said metals. The process and multilayer circuit boards made thereby, have improved laminate adhesion and strength. Further, partial delamination, known as pink ring, is decreased or avoided by the present process. Further, the multilayer structures have decreased bond strength deterioration when exposed to elevated temperatures.

PLASTIC PLATING ADHESIVE, RAW MATERIAL COMPOSITION FOR PRODUCING ELECTRIC PLATING, AND PRINTED CIRCUIT BOARD

Adhesion promotion in printed circuit boards

An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Adhesion promotion in printed circuit boards

Adhesion promotion in printed circuit boards

印刷电路板中的增粘剂

本发明提供了一种在制造印刷电路板时提高铜导电层和电介质材料之间粘合力的增粘剂工艺和组合物，该组合物包括阻蚀剂、无机酸和有助于提高所述组合物中铜负荷的醇。

热固性树脂组合物、固化物、预成型料、金属铠装层压板和线路板

热固性树脂组合物(A)包含60-97重量%的含二氢苯并噁嗪环的热固性树脂和3-40重量%的酚醛清漆树脂，热固性树脂组合物(B)包含5-30重量%的含二氢苯并噁嗪环的热固性树脂和70-95重量%的酚醛清漆树脂。这些热固性树脂组合物固化迅速，它们的固化物具有优异的机械特性和不易燃性。

Multiple substrate and process for its manufacture

Active energy beam curable composition and printed wiring board

There is provided an active energy beam curable composition, which is useful for forming a solder resist film for a printed wiring board, which can be developed through an ultraviolet exposure and a dilute alkali aqueous solution, and is excel lent in heat resistance, adhesivity and chemical resistance. There is also proposed a printed wiring board provided with a cured film of such an active energy beam curable composition. This composition is featured in that it comprises not only an active energy beam curable vinyl copolymer modified resin wherein an epoxy compound having an ethylenic unsaturated group is added to a copolymer comprising styrene, (metha)acrylic acid, and, as an optional component, (metha)acrylate; but also an active energy beam curable bisphenol type epoxyacrylate resin.

Solder resist composition and printed circuit boards

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

An ultraviolet-curable resin composition which is excellent in developped-line width and resolution and satisfactory in soldering heat resistance and gold plating resistance. The resin composition comprises (A) an ultraviolet-curable resin obtained by polymerizing an ethylenic monomer ingredient comprising an epoxidized ethylenic monomer (i), reacting the resultant epoxidized polmymer (a) with a carboxylated ethylenic monomer (b), and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c); (B) an epoxy compound having two or more epoxy groups per molecule; (C) a photopolymerization initiator; (D) a diluent; and (E) an ultraviolet-curable resin which is obtained by reacting a novolak epoxy compound (e) with a carboxylated ethylenic monomer (b) and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c) and which has an acid value of 10 to 45 mgKOH/g, excluding 45 mgKOH/g.

Resist ink composition, printed circuit board produced by using the composition and process for producing the printed circuit board

A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance printed circuits and which comprises an ultraviolet-curable resin obtained by copolymerizing (a) from 5 to 50% by weight of an ethylenically unsaturated monomer of a general formula: ##STR1## wherein R 1 represents a hydrogen atom or a methyl group; R 2 represents a hydrogen atom or an alkyl group; n represent an integer of from 1 to 4, and/or glycerol mono(meth)acrylate, (b) from 10 to 90% by weight or glycidyl (meth)acrylate and (c) from 0 to 80% by weight of other ethylenically unsaturated monomers capable of copolymerizing with these (a) and (b), followed by reacting the resulting copolymer with from 0.7 to 1.2 equivalents, relative to one epoxy equivalent of said copolymer, of (meth)acrylic acid and a saturated or unsaturated polybasic acid anhydride; a photopolymerization initiator; a diluent; and a thermosetting epoxy compound.

Solder resist composition and printed circuit boards

A solder resist composition comprises an acrylate of novolac type epoxy resin and an imidazole curing agent and has a viscosity of 0.5-10 Pa·s adjusted with glycol ether type solvent. A printed circuit board is formed by using such a solder resist composition.

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating. This resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy-group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group to obtain an intermediate product, and then reacting the intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in its molecule; (C) a photo-polymerization initiator; (D) a diluent; and (E) an ultraviolet curable resin obtained by reacting a novolac epoxy compound (e) with the ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with the saturated or unsaturated polybasic acid anhydride (c). The ultraviolet curable resin (E) has an acid value of 10 mgKOH/g or more and less than 45 mgKOH/g.

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

An ultraviolet-curable resin composition which is excellent in developped-line width and resolution and satisfactory in soldering heat resistance and gold plating resistance. The resin composition comprises (A) an ultraviolet-curable resin obtained by polymerizing an ethylenic monomer ingredient comprising an epoxidized ethylenic monomer (i), reacting the resultant epoxidized polmymer (a) with a carboxylated ethylenic monomer (b), and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c); (B) an epoxy compound having two or more epoxy groups per molecule; (C) a photopolymerization initiator; (D) a diluent; and (E) an ultraviolet-curable resin which is obtained by reacting a novolak epoxy compound (e) with a carboxylated ethylenic monomer (b) and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c) and which has an acid value of 10 to 45 mgKOH/g, excluding 45 mgKOH/g.

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating. This resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy-group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group to obtain an intermediate product, and then reacting the intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in its molecule; (C) a photo-polymerization initiator; (D) a diluent; and (E) an ultraviolet curable resin obtained by reacting a novolac epoxy compound (e) with the ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with the saturated or unsaturated polybasic acid anhydride (c). The ultraviolet curable resin (E) has an acid value of 10 mgKOH/g or more and less than 45 mgKOH/g.

Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler

It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

Aperture fill

Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.

Active energy beam curable composition and printed wiring board

There is provided an active energy beam curable composition, which is useful for forming a solder resist film for a printed wiring board, which can be developed through an ultraviolet exposure and a dilute alkali aqueous solution, and is excellent in heat resistance, adhesivity and chemical resistance. There is also proposed a printed wiring board provided with a cured film of such an active energy beam curable composition. This composition is featured in that it comprises not only an active energy beam curable vinyl copolymer modified resin wherein an epoxy compound having an ethylenic unsaturated group is added to a copolymer comprising styrene, (metha)acrylic acid, and, as an optional component, (metha)acrylate; but also an active energy beam curable bisphenol type epoxyacrylate resin.

Carboxyl group-containing polyurethane and heat-curable polyurethane resin composition prepared therefrom

A carboxyl group-containing polyurethane is capable of giving cured products excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability. The carboxyl group-containing polyurethane includes a structure derived from a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule. The carboxyl group-containing polyurethane is produced by reacting: (A) a polyisocyanate compound; (B) a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule; and (C) a carboxyl group-containing dihydroxy compound (other than the compound (B)).

含羧基的聚氨酯以及由其制备的可热固化的聚氨酯树脂组合物

本发明涉及一种能够产生具有下述性能的固化产物的含羧基的聚氨酯：与基片优异的粘合性，低翘曲、柔韧性、耐电镀性、耐焊接热性和长期可靠性。这种含羧基的聚氨酯包含由按每分子计具有1-10个羟基和18-72个碳原子的多元醇化合物衍生的结构。所述含羧基的聚氨酯通过(A)多异氰酸酯化合物；(B)每分子具有1-10个羟基和18-72个碳原子的多元醇化合物；和(C)含羧基的二羟基化合物(与化合物(B)不同)反应制备。

Carboxyl group-containing polyurethane and heat-curable polyurethane resin composition

A carboxyl group-containing polyurethane is capable of giving cured products excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability. The carboxyl group-containing polyurethane includes a structure derived from a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule. The carboxyl group-containing polyurethane is produced by reacting: (A) a polyisocyanate compound; (B) a polyol compound having 1 to 10 hydroxyl groups and 18 to 72 carbon atoms per molecule; and (C) a carboxyl group-containing dihydroxy compound (other than the compound (B)).

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in molecule; (C) a photopolymerization initiator; and (D) a diluent The ultraviolet curable resin includes 0.3 to 10 mol of a polymerizable unsaturated group in 1 kg thereof. A photo solder resist ink containing this resin composition has the capability of providing a permanent film with excellent flexibility and solder heat resistance, and is preferably used to manufacture flexible printed circuit boards.

Ultraviolet curable resin composition and photo solder resist ink including the same

An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in molecule; (C) a photopolymerization initiator; and (D) a diluent The ultraviolet curable resin includes 0.3 to 10 mol of a polymerizable unsaturated group in 1 kg thereof. A photo solder resist ink containing this resin composition has the capability of providing a permanent film with excellent flexibility and solder heat resistance, and is preferably used to manufacture flexible printed circuit boards.

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

An ultraviolet-curable resin composition which is excellent in developped-line width and resolution and satisfactory in soldering heat resistance and gold plating resistance. The resin composition comprises (A) an ultraviolet-curable resin obtained by polymerizing an ethylenic monomer ingredient comprising an epoxidized ethylenic monomer (i), reacting the resultant epoxidized polmymer (a) with a carboxylated ethylenic monomer (b), and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c); (B) an epoxy compound having two or more epoxy groups per molecule; (C) a photopolymerization initiator; (D) a diluent; and (E) an ultraviolet-curable resin which is obtained by reacting a novolak epoxy compound (e) with a carboxylated ethylenic monomer (b) and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c) and which has an acid value of 10 to 45 mgKOH/g, excluding 45 mgKOH/g.

紫外線硬化性樹脂組成物および同組成物を含むフォトソルダーレジストインク

紫外线可固化树脂组合物及含该组合物的光防焊油墨

提供显影宽度及图像分辨性优良的，具有良好的抗焊耐热性及耐镀金性的紫外线可固化树脂组合物。该树脂组合物含有：(A)紫外线可固化树脂，通过使含有具有环氧基的乙烯性不饱和单体(i)的乙烯性不饱和单体成分聚合而得到的含环氧基的聚合物(a)与具有羧基的乙烯性不饱和单体(b)反应，使得到的中间产物与饱和或不饱和的多元酸酐(c)反应而得；(B)在分子中有2个以上环氧基的环氧化合物；(C)光聚合引发剂；(D)稀释剂；(E)紫外线可固化树脂，通过使线型酚醛树脂型环氧化合物(e)与具有羧基的乙烯性不饱和单体(b)反应，使得到的中间产物与饱和或不饱和的多元酸酐(c)反应，得到具有酸值10mgKOH/g～45mgKOH/g的紫外线可固化树脂。

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

紫外线可固化树脂组合物及含该组合物的光防焊油墨

提供显影宽度及图像分辨性优良的，具有良好的抗焊耐热性及耐镀金性的紫外线可固化树脂组合物。该树脂组合物含有：(A)紫外线可固化树脂，通过使含有具有环氧基的乙烯性不饱和单体(i)的乙烯性不饱和单体成分聚合而得到的含环氧基的聚合物(a)与具有羧基的乙烯性不饱和单体(b)反应，使得到的中间产物与饱和或不饱和的多元酸酐(c)反应而得；(B)在分子中有2个以上环氧基的环氧化合物；(C)光聚合引发剂；(D)稀释剂；(E)紫外线可固化树脂，通过使线型酚醛树脂型环氧化合物(e)与具有羧基的乙烯性不饱和单体(b)反应，使得到的中间产物与饱和或不饱和的多元酸酐(c)反应，得到具有酸值10mgKOH/g～45mgKOH/g的紫外线可固化树脂。

Ultraviolet curable resin composition and photo solder resist ink containing the same

現像幅および解像性に優れ、良好なはんだ耐熱性および耐金めっき性を示す紫外線硬化性樹脂組成物を提供する。この樹脂組成物は、（Ａ）エポキシ基を有するエチレン性不飽和単量体（ｉ）を含有するエチレン性不飽和単量体成分を重合させて得られるエポキシ基含有重合体（ａ）にカルボキシル基を有するエチレン性不飽和単量体（ｂ）を反応させ、得られた中間生成物に飽和又は不飽和多塩基酸無水物（ｃ）を反応させて得られる紫外線硬化性樹脂；（Ｂ）分子中に２個以上のエポキシ基を有するエポキシ化合物；（Ｃ）光重合開始剤；（Ｄ）希釈剤；及び（Ｅ）ノボラック型エポキシ化合物（ｅ）にカルボキシル基を有するエチレン性不飽和単量体（ｂ）を反応させ、得られた中間生成物に飽和又は不飽和多塩基酸無水物（ｃ）を反応させて得られる１０ｍｇＫＯＨ／ｇ以上で４５ｍｇＫＯＨ／ｇ未満の酸価を有する紫外線硬化性樹脂を含む。 Provided is an ultraviolet-curable resin composition having excellent development width and resolution and exhibiting good solder heat resistance and gold plating resistance. This resin composition is obtained by polymerizing an epoxy group-containing polymer (a) obtained by polymerizing an ethylenically unsaturated monomer component (A) containing an ethylenically unsaturated monomer (i) having an epoxy group. An ultraviolet curable resin obtained by reacting an ethylenically unsaturated monomer having a group (b) with a saturated or unsaturated polybasic acid anhydride (c) with the resulting intermediate product; (B) An epoxy compound having two or more epoxy groups in the molecule; (C) a photopolymerization initiator; (D) a diluent; and (E) an ethylenically unsaturated monomer having a carboxyl group in the novolak-type epoxy compound (e). (B) is reacted, and the resulting intermediate product is reacted with a saturated or unsaturated polybasic acid anhydride (c) to obtain an ultraviolet curable resin having an acid value of 10 mgKOH / g or more and less than 45 mgKOH / g. Including resin.

Urethane oligomer, resin compositions thereof, and cured article thereof

The present invention relates to a new urethane oligomer (A) and a resin composition comprising (A) and an unsaturated group containing polycarboxylic acid resin (B) that can be diluted with water and is excellent in providing a cured product and that is suitable for a solder resist and an interlayer dielectric layer because the cured product is excellent in flexibility, soldering-heat resistance or the like and allows a development with an organic solvent or a dilute alkali solution; a photosensitive resin composition suitable for an etching resist or a cover lay; and a photosensitive film obtained thereby.

Conformal coating systems

Ultraviolet curable polymerizable coating system having one or more built-in secondary curing mechanisms is disclosed. The polymerizable coating system is a two component system comprising (1) a first component comprising at least one urethane-acrylate or methacrylate, and a mono or polyfunctional acrylate or methacrylate diluent and a polymerization initiator of the photo-initiator type, and (2) a second component comprising a polyisocyanate. The coating system is uv curable, and also possess at least one additional cure mechanism.

Conformal coating systems

Ultraviolet curable polymerizable coating system having a built-in secondary curing mechanism is disclosed. The polymerizable coating system is a one component system comprising at least one urethane-acrylate or methacrylate, an allyl-group containing acrylate or methacrylate monomer, a non-allylic acrylate or methacrylate diluent, a polymerization initiator of the photoinitiator type, and a metal drier. The coating system is UV curable, and also possesses an additional cure mechanism.

Ultraviolet curable conductive resin

A UV curable electrically conductive adhesive has been developed with low resistivity, adequate lap shear strength, good thermal stability, and very stable conductivity at high temperatures of about 100° C. and high humidity. The adhesive may be applied by silk screen printing and cured by UV in about 8 seconds. The adhesive may also be used as a replacement of solder in automated surface mount technology for electronic circuit fabrication. The adhesive is a mixture of (A) a blend of an acrylate epoxy and a urethane, a copolymer of an acrylate epoxy and a urethane, or mixtures thereof; (B) a polyfunctional acrylate monomer; (C) a photoinitiator, and (D) a conductive filler. Optionally, adhesion promoters and flow control agents may be used.

COATING PROCEDURE FOR PRINTED CIRCUITS.

SE PRESENTA UNA COMPOSICON DOBLE ENDURECEDORA QUE SE PREPARA A PARTIR DE COMPONENTES QUE CONSTAN ESENCIALMENTE DE: A) UN ABDUCTOR DE ISOCIANATO QUE TENGA (I) GRUPOS DE ISOCIANATO LIBRES Y (II) GRUPOS ETILENICAMENTE INSATURADOS POLIMERIZABLES LIBRES, EN DONDE LOS GRUPOS ETILENICAMENTE INSATURADOS COMPRENDEN ENTRE UN 10 Y 70% DE CUALQUIER GRUPO FUNCIONAL LIBRE SOBRE DICHO ABDUCTOR; B) UN DILUYENTE REACTIVO DE (MET)ACRILATO; Y C) OPCIONALMENTE, UN FOTOINICIADOR. CUANDO SE ENCUENTRA ENDURECIDA, LA COMPOSICION ANTERIOR ES PARTICULARMENTE ADECUADA PARA CONFORMAR REVESTIMIENTOS SOBRE TARJETAS PARA CIRCUITOS ELECTRONICOS. A DOUBLE HARDENING COMPOSITION IS PRESENTED THAT IS PREPARED FROM COMPONENTS ESSENTIALLY CONTAINING: A) AN ISOCYANATE ABDUCTOR THAT HAS (I) FREE ISOCIANATE GROUPS AND (II) ETHYLINALLY INSURATED GRUPULES, EASTENATELY GRUPOUS, IN DONUTY BETWEEN 10 AND 70% OF ANY FREE FUNCTIONAL GROUP ON SUCH ABDUCTOR; B) A REACTIVE THINNER OF (MET) ACRYLATE; AND C) OPTIONALLY, A PHOTO INITIATOR. WHEN IT IS HARDENED, THE PREVIOUS COMPOSITION IS PARTICULARLY SUITABLE FOR CONFORMING COVERINGS ON ELECTRONIC CIRCUIT BOARDS.

Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive

A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent; (d) optionally, a source of free radical initiators; and (e) optionally, a resin. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces. Alternatively, a solder paste, comprising solder powder mixed with the fluxing agent of the present invention can be used. During the reflow step, the fluxing agent promotes wetting of the solder to the metallization patterns and, simultaneously, the fluxing agent itself crosslinks to mechanically bond and encapsulate the surfaces and their metallizations. The compositions can also be used to formulate sinterable conductive ink.

Manufacturing method of multilayer printed wiring board

Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini

Copper-clad laminate with copper-plated circuit layer and method for producing printed wiring board using copper-clad laminate with copper-plated circuit layer

Composite materials

The invention provides a laminate which comprises a metal film or sheet and a film or sheet of a fluorine-containing polyimide (1); a composite sheet comprising a fluorohydrocarbon polymer substrate impregnated with a fluorine-containing polyimide (2); and a laminate which comprises a metal film or sheet and the above composite sheet, the polyimide (1) and (2) being defined in the specification.

Photopolymerizable composition

A photopolymerizable composition used suitably as a solder resist for a printed circuit board which comprises: (a) 0.1 to 5.0 wt. % of a s-triazine compound represented by the general formula I: ##STR1## [wherein R 1 stands for ##STR2## (wherein R 2 stands for a hydrogen atom, an alkyl group or a phenyl group and R 3 stands for a hydrogen atom or a lower alkyl group)]; (b) 5 to 50 wt. % of a photopolymerizable oligomer which has an average molecular weight in the range of 200 to 4000 and has 2 or more of acryloyl groups or methacryloyl groups in a molecule; (c) 5 to 50 wt. % of vinyl monomer having 1 or more of acryloyl groups or methacryloyl groups which are liquid at 50° C.; (d) 0.5 to 5 wt. % of a photo-initiator which acts to initiate a cross-linking reaction between said photopolymerizable oligomer and said vinyl monomer when subjected to activated radiation; and (e) 5 to 60 wt. % of an inorganic filler.

Multilayer printed circuit board formation

Component of printed circuit boards.

Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates

The present invention is directed to a metal-clad electrical laminate which comprises a core of one or more of a polyetherimide thermoplastic, polyphenylene oxide thermoplastic, or a resinous-filled reinforced substrate. A pair of intermediate layers of hollow glass microsphere-filled polyphenylene oxide/epoxy is bound to either side of the core. Finally, a pair of metal foil layers are bound to the filled intermediate layers to produce the laminate of the present invention. The laminate desirably has a thickness of less than about 0.010 in., a dielectric constant of about 3 or less, and a HGM content in excess of about 10 wt-%. Additionally, the laminate has a softening point sufficiently high to avoid substantial distortion at processing temperatures of around 200°-235° C.

우레탄 올리고머, 그의 수지조성물, 그의 경화물

본 발명은 물로 희석할 수 있고 경화물성(경화성, 밀착성, 내수성)이 우수한 수지 및 수지조성물, 경화물의 가요성이나 땜납내열성이 우수하며 유기용제 또는 희석 알칼리 용액에서 현상할 수 있어 솔더 레지스트용 및 층간 절연층용으로 적합한 수지조성물 및 에칭 레지스트나 커버 레이용으로 적합한 감광성 수지조성물 및 이를 이용한 감광성 필름을 제공한다. 폴리올 화합물(a), 1 분자당 적어도 2개의 산무수물기를 갖는 다염기 산무수물(b), 폴리이소시아네이트 화합물(c) 및 에틸렌성 불포화기 함유 하이드록시 화합물(d)을 반응시켜 수득되는 우레탄 올리고머(A), 및 (1) 이 올리고머(A), (2) 불포화기 함유 폴리카르복시산(B), (메타)아크릴레이트류 등과 같은 반응성 희석제(C-1), 카르비톨 아세테이트 등과 같은 비반응성 희석제(C-2) 및 열가소성 중합체(D)로부터 선택되는 1종 또는 2종 이상의 수지 및 (3) 광중합 개시제를 함유하는 수지조성물 및 감광성 필름.

紫外線硬化性樹脂組成物および同組成物を含むフォトソルダーレジストインク

Substrate for mounting semiconductor and method of producing the same

A substrate for mounting semiconductor adapted to high-density packaging. In order to highly densely mount the multi-terminal electronic parts, the substrate is made up of a lead frame as a base which consists of die pads and leads and wherein an adhesive layer and an insulator layer are formed on the lead frame, while conductor circuits are formed thereon by the additive method, and the conductor circuits and the leads are connected together through plated conductors. With the device thus constituted, no printed wiring board is required since an IC can be directly mounted on the lead frame via the plated conductor circuit.

[UNK]

Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds

A resin blend that includes a copolymer of styrene and maleic anhydride (SMA), an epoxy resin (brominated, phosphonated, or bromine-free), and a multifunctional amine cross-linking agent is disclosed. The cross-linking agent generally contains at least two primary amino groups to promote formation of imide functionalities upon reaction with the anhydride moieties of the SMA copolymer. Particularly useful cross-linking agents include triazine-centered diamino and triamino compounds such as benzoguanamine, acetoguanamine, and melamine. The disclosed resin blend finds use as a polymer matrix in composite materials and as an impregnating resin in laminates. Compared to conventional SMA copolymer/epoxy resin blends, the disclosed resin exhibits lower dielectric constant and dissipation factor, as well as higher thermal and moisture resistance, making it especially useful in high-speed, low-loss printed wire board applications.

Solder resist composition and printed circuit boards

The present invention refers to a printed circuit board comprising a wiring substrate provided with conductor circuits (5) and a solder resist layer (14) formed on a surface of the Substrate, in which a roughened layer (11) is formed on a surface of the conductor circuit (5).

Solder resist composition and printed circuit boards

The present invention refers to a printed circuit board comprising a wiring substrate provided with conductor circuits (5) and a solder resist layer (14) formed on a surface of the Substrate, in which a roughened layer (11) is formed on a surface of the conductor circuit (5).

Printed circuit board

Solder resist composition and printed circuit boards

롤 도포기로 도포하기 쉽고 납의 이동이 적은 솔더레지스트 조성물과, 이 솔더레지스트 조성물을 사용한 프린트 배선판을 제안함을 과제로 한다. An object of the present invention is to propose a solder resist composition which is easy to apply with a roll applicator and little lead movement, and a printed wiring board using the solder resist composition. 그 과제를 해결수단으로, 본 발명은 노볼락형 에폭시 수지의 아크릴레이트와 이미다졸 경화제를 함유하고, 글리콜에테르계 용제를 사용하여 점도를 25℃에서 0.5∼10Pa·s로 조정하여 이루어지는 솔더레지스트 조성물과, 이 솔더레지스트 조성물을 사용한 프린트배선판을 제안한다. In order to solve the problem, the present invention includes a acrylate of an novolak-type epoxy resin and an imidazole curing agent, and a soldering resist composition obtained by adjusting the viscosity to 0.5 to 10 Pa · s at 25 ° C using a glycol ether solvent. And a printed wiring board using this soldering resist composition is proposed.

抗焊剂组成物与印刷电路板

提出的任务是实现易由辊涂机涂布且铅迁移少的抗焊剂组成物以及采用此种抗焊剂组成物的印刷电路板。作为完成上述任务的手段，本发明给出了含有酚醛清漆型环氧树脂的丙烯酸酯与咪唑硬化剂，且用乙二醇醚系溶剂将粘度调整到25℃为0.5～10Pa.s的抗焊剂组成物以及应用此抗焊剂组成物的印刷电路板。

Solder resist composition and printed circuit boards

A SOLDER RESIST COMPOSITION COMPRISES AN ACRYLATE OF NOVOLAC TYPE EPOXY RESIN AND AN IMIDAZOLE CURING AGENT AND HAS A VISCOSITY OF 0.5-10 PA.S ADJUSTED WITH GLYCOL ETHER TYPE SOLVENT. A PRINTED CIRCUIT BOARD IS FORMED BY USING SUCH A SOLDER RESIST COMPOSITION. (FIG. 2A)

Printed circuit boards and method of producing the same

A PRINTED CIRCUIT BOARD IS BY FORMED BY LAMINATING AN INTERLAMINAR INSULATING LAYER (2) ON A CONDUCTOR CIRCUIT (4) OF A SUBSTRATE, IN WHICH THE CONDUCTOR CIRCUIT (4) IS COMPRISED OF AN ELECTROLESS PLATED FILM AND AN ELECTROLYTIC PLATED FILM AND A ROUGHENED LAYER (11) IS FORMED ON AT LEAST A PART OF THE SURFACE OF THE CONDUCTOR CIRCUIT.(FIG. 43)

Multilayer wiring substrate and method for producing the same

The present invention relates to a multilayer wiring substrate for mounting a semiconductor chip, etc. The multilayer wiring substrate is comprised of a plurality of double-sided circuit substrates, each comprised of an organic high molecular weight insulating layer and wiring conductor. An adhesive is used for laminating the double-sided circuit substrates. A Ni--Fe based alloy foil or a titanium foil is embedded within the organic high molecular weight insulating layer.

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Epoxy resin coating compositions for printed circuit boards

A resinous protective coating useful in adhering plastics to metallic substrates. The protective coating is particularly useful as a solder mask and in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating, upon being subjected to heat, goes from a liquid or soft "gel-like" state into a solid phase without bleeding. The protective coating is resistant to copper, nickel and gold electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.

Epoxy resin coating composition for printed circuit boards

A resinous protective coating useful in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating upon being subjected to heat goes from a high viscosity solution to a gel and then to a solid or from a soft "gel-like" state into a solid. The protective coating is resistant to copper electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.

Printed circuit boards having improved adhesion between solder mask and metal

A printed circuit board having improved adhesion between solder mask and metal includes a primer film on the metal deposited from an aqueous solution which includes 0.01 to 10% by weight of a carboxyl-containing polymer or copolymer.

Epoxy/amino powder resin adhesive for printed circuit board

There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet or a prepreg, whereby the printed circuit board can be produced easily and cheaply.

印刷电路板

提出的任务是实现易由辊涂机涂布且铅迁移少的抗焊剂组成物以及采用此种抗焊剂组成物的印刷电路板。作为完成上述任务的手段，本发明给出了含有酚醛清漆型环氧树脂的丙烯酸酯与咪唑硬化剂，且用乙二醇醚系溶剂将粘度调整到25℃为0.5～10Pa.s的抗焊剂组成物以及应用此抗焊剂组成物的印刷电路板。

Solder resist composition and printed circuit boards

PURPOSE: A solder resist composition and a printed wiring board using the composition are provided, to allow a solder resist composition to be applied easily by using a roll coater and to reduce the migration of lead from it. CONSTITUTION: The solder resist composition comprises a novolac epoxy resin or an acrylate of a novolac epoxy resin, and 1-10 wt% of an imidazole curing agent based on total solid component of composition; its viscosity is controlled to be 0.5-10 Pa·s at a temperature of 25 deg.C by using 10-40 wt% of a glycol ether-based solvent based on the total weight of composition. The printed wiring board comprises a wiring board where a conductor circuit is formed; a solder resist layer(14) formed on the surface of the wiring board by using the composition; and a rough layer(11) having a thickness of 0.5-10 micrometers formed on the surface of the conductor circuit. Preferably the rough layer is an alloy layer comprising 90-96 wt% of copper, 1-5 wt% of nickel and 0.5-2 wt% of phosphorus.

Solder resist composition and printed circuit boards

The present invention refers to a printed circuit board comprising a wiring substrate provided with conductor circuits, a solder resist layer formed on the surface of the substrate, and a solder body fed onto a pad as a part of the conductor circuit exposed from an opening portion formed in the solder resist layer, in which the surface of the pad is rendered into an electrically conductive roughened layer, and a metal layer having a non-oxidizing metal on at least a surface-thereof is formed on a surface of the pad exposed from the opening portion, and the solder is supported on the pad through the metal layer.

Solder resist composition and printed circuit boards

The present invention refers to a printed circuit board comprising a wiring substrate provided with conductor circuits (5), a solder resist layer (14) formed on the surface of the substrate, and a solder body (17) fed onto a pad as a part of the conductor circuit (5) exposed from an opening portion formed in the solder resist layer (14), in which the surface of the pad is rendered into an electrically conductive roughened layer (11), and a metal layer (15,16) having a non-oxidizing metal (16) on at least a surface-thereof is formed on a surface of the pad exposed from the opening portion, and the solder (17) is supported on the pad through the metal layer (15,16).

抗焊剂组成物与印刷电路板

提出的任务是实现易由辊涂机涂布且铅迁移少的抗焊剂组成物以及采用此种抗焊剂组成物的印刷电路板。作为完成上述任务的手段，本发明给出了含有酚醛清漆型环氧树脂的丙烯酸酯与咪唑硬化剂，且用乙二醇醚系溶剂将粘度调整到25℃为0.5～10Pa.s的抗焊剂组成物以及应用此抗焊剂组成物的印刷电路板。