ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
24-02-2005 дата публикации
Номер:
WO2005017229A1
Принадлежит: ENTHONE INC.
Контакты:
Номер заявки: US93-02-200382
Дата заявки: 18-09-2003
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.[1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23]
