SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND METHOD OF PRODUCING THE SAME
02-09-1993 дата публикации
Номер:
WO1993017457A1
Контакты:
Номер заявки: JP9000851
Дата заявки: 29-06-1990
A substrate for mounting semiconductor adapted to high-density packaging. In order to highly densely mount the multi-terminal electronic parts, the substrate is made up of a lead frame as a base which consists of die pads and leads and
wherein an adhesive layer and an insulator layer are formed on the lead frame, while conductor circuits are formed thereon by the additive method, and the conductor circuits and the leads are connected together through plated conductors. With the
device thus constituted, no printed wiring board is required since an IC can be directly mounted on the lead frame via the plated conductor circuit.[1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28]
