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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 48543. Отображено 100.
05-01-2012 дата публикации

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies

Номер: US20120003844A1
Автор: Michael J. Taylor, Monte P. Dreyer, Rajesh Kumar
Принадлежит: Individual

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

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Номер записи: 1
19-01-2012 дата публикации

Printed wiring board and a method of production thereof

Номер: US20120012464A1
Автор: Tomoyuki Ikeda
Принадлежит: Ibiden Co Ltd

A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.

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Номер записи: 2
19-01-2012 дата публикации

Package structure

Номер: US20120013002A1
Автор: Shih-Ping Hsu
Принадлежит: Unimicron Technology Corp

Disclosed is a package structure including a semiconductor chip disposed in a core board having a first surface and an opposite second surface. The package structure further includes a plurality of first and second electrode pads disposed on an active surface and an opposite inactive surface of the semiconductor chip respectively, the semiconductor chip having a plurality of through-silicon vias for electrically connecting the first and second electrode pads. As a result, the semiconductor chip is electrically connected to the two sides of the package structure via the through-silicon vias instead of conductive through holes, so as to enhance electrical quality and prevent the inactive surface of the semiconductor chip from occupying wiring layout space of the second surface of the core board to thereby increase wiring layout density and enhance electrical performance.

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Номер записи: 3
26-01-2012 дата публикации

Ceramic electronic component and wiring board

Номер: US20120018204A1
Автор: Koji Sato, Yasuhiro Nishisaka, Yukio Sanada
Принадлежит: Murata Manufacturing Co Ltd

A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.

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Номер записи: 4
26-01-2012 дата публикации

Electronic module with vertical connector between conductor patterns

Номер: US20120020044A1
Автор: Antti Iihola, Petteri Palm
Принадлежит: IMBERA ELECTRONICS OY

The present invention generally relates to a new structure to be used with electronic modules such as printed circuit boards and semiconductor package substrates. Furthermore there are presented herein methods for manufacturing the same. According to an aspect of the invention, the aspect ratio of through holes is significantly improved. Aspect ratio measures a relationship of a through hole or a micro via conductor in the direction of height divided width. According to the aspect of the invention, the aspect ratio can be increased over that of the prior art solution by a factor of ten or more.

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Номер записи: 5
26-01-2012 дата публикации

Storage apparatus and method of manufacturing the same

Номер: US20120020151A1
Автор: Chang-Chih Chen, Chun-Feng Lee, Wei-Hung Lin
Принадлежит: Phison Electronics Corp

A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced.

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Номер записи: 6
02-02-2012 дата публикации

Electrical Connector, Electrical Connection System and Lithographic Apparatus

Номер: US20120024585A1
Автор: Alexander Petrus HILBERS, Ronald van der Wilk
Принадлежит: ASML Netherlands BV

An electrical connector comprises a high voltage pad and a high voltage plate. When connected to another electrical connector, the two plates, which are at the same voltage as the pads, form a region of high voltage in which the field is low. The pads are positioned in that region. An electrostatic clamp of an EUV lithographic apparatus may have such a pad and plate, for connecting to the electrical connector. By placing the interconnection in a low field region, triple points (points of contact between a conductor, a solid insulator and a gas) may be present in that region.

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Номер записи: 7
02-02-2012 дата публикации

Composition for metal plating comprising suppressing agent for void free submicron feature filling

Номер: US20120024711A1
Автор: Alexandra Haag, Charlotte Emnet, Cornelia Roeger-Goepfert, Dieter Mayer, Roman Benedikt Raether
Принадлежит: BASF SE

A composition for filling submicrometer sized features having an aperture size of 30 nanometers or less comprising a source of copper ions, and at least one suppressing agent selected from compounds of formula (I) wherein the R1 radicals are each independently selected from a copolymer of ethylene oxide and at least one further C3 to C4 alkylene oxide, said copolymer being a random copolymer. the R2 radicals are each independently selected from R1 or alkyl. X and Y are spacer groups independently, and X for each repeating unit independently, selected from C1 to C6 alkylen and Z—(O—Z)m wherein the Z radicals are each independently selected from C2 to C6 alkylen, n is an integer equal to or greater than 0. m is an integer equal to or greater than 1.

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Номер записи: 8
02-02-2012 дата публикации

Composition for metal plating comprising suppressing agent for void free submicron feature filling

Номер: US20120027948A1
Автор: Alexandra Haag, Charlotte Emnet, Cornelia Roeger-Goepfert, Dieter Mayer, Roman Benedikt Raether
Принадлежит: BASF SE

A composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides, said suppressing agent having a molecular weight M w of 6000 g/mol or more.

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Номер записи: 9
09-02-2012 дата публикации

Multi-Layer Circuit Assembly And Process For Preparing The Same

Номер: US20120031655A1
Автор: Alan G. Wang, Kevin C. Olson
Принадлежит: PPG Industries Ohio Inc

A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; (c) removing the dielectric coating in a predetermined pattern to expose sections of the substrate; (d) applying a layer of metal to all surfaces to form metallized vias through and/or to the electrically conductive core; (e) applying a resist to the metal layer to form a photosensitive layer thereon; (f) imaging resist in predetermined locations; (g) developing resist to uncover selected areas of the metal layer; and (h) etching uncovered areas of metal to form an electrical circuit pattern connected by the metallized vias.

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Номер записи: 10
09-02-2012 дата публикации

Touch screen and manufacturing method thereof

Номер: US20120031746A1
Автор: Beom-Mo Koo, Dong-Wook Lee, Hyeon Choi, In-Seok Hwang, Ji-Young Hwang, Ki-Hwan Kim, Min-Choon Park, Sang-ki Chun, Seung-Heon Lee, Su-Jin Kim, Yong-Koo Son, Young-Jun Hong
Принадлежит: LG Chem Ltd

The present invention provides a method of manufacturing a touch screen, comprising the steps of: a) forming a conductive layer on a substrate; b) forming an etching resist pattern on the conductive layer; and c) forming a conductive pattern having a line width smaller than the line width of the etching resist pattern by over-etching the conductive layer by using the etching resist pattern and a touch screen manufactured by the method. According to the present invention, a touch screen comprising a conductive pattern having an ultrafine line width can be economically and efficiently provided.

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Номер записи: 11
23-02-2012 дата публикации

Printed circuit board and method of manufacturing the same

Номер: US20120043121A1
Автор: Jong Seok Bae
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a first circuit layer including a first metal layer and a first plating layer provided on an outer side of the first metal layer and embedded in one surface of the insulating layer; a second circuit layer including a second metal layer and a second plating layer provided on an outer side of the second metal layer and embedded in the other surface of the insulating layer; and a bump interconnecting the first circuit layer and the second circuit layer while penetrating through the insulating layer. The bump is used, such that there is no need to perform hole plating. Therefore, an increase in the surface plating thickness due to the hole plating is previously prevented.

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Номер записи: 12
01-03-2012 дата публикации

Buffer Layer to Enhance Photo and/or Laser Sintering

Номер: US20120049384A1
Автор: Mohshi Yang, Peter B. Laxton, Zvi Yaniv
Принадлежит: Ishihara Chemical Co Ltd

Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

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Номер записи: 13
08-03-2012 дата публикации

Split wave compensation for open stubs

Номер: US20120055016A1
Автор: Dan Gorcea
Принадлежит: FLEXTRONICS AP LLC

In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

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Номер записи: 14
15-03-2012 дата публикации

Method of fabricating circuit board structure

Номер: US20120060368A1
Автор: Cheng-Po Yu, Han-Pei Huang
Принадлежит: Unimicron Technology Corp

A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

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Номер записи: 15
15-03-2012 дата публикации

Method for forming conductive via in a substrate

Номер: US20120064230A1
Автор: Chien-Hung Ho, Hsiao-Chun Liu, Sheng-Li Hsiao, Shih-Long Wei
Принадлежит: Viking Tech Corp

The steps of the present invention are as follows: (a) a detachable film is formed on both sides of a substrate, respectively; (b) a number of vias running through both sides of the detachable films are formed in the substrate; (c) the vias are filled with a conductive paste; (d) the detachable films are peeled off; (e) a metallic conductive layer is deposited on both sides of the substrate, respectively; (f) a specific mold pattern is formed on the metallic conductive layers, respectively, by a photolithographic process; (g) a metallic circuit layout layer is formed on the patterns, respectively, by an electrochemical process; and (h) the mold patterns and the metallic conductive layers are removed. As such, the substrate is not contaminated by the conductive paste. Further, by using deposition, metallic conductive layers are directly adhered to the substrate and, by using photolithography, layouts with small linewidth could be formed.

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Номер записи: 16
15-03-2012 дата публикации

Composition, coated film formed of the composition, layered product containing the coated film, and electronic device incorporating the layered product

Номер: US20120065310A1
Автор: Eiji Honda, Enhai Sun, Hiroaki Adachi, Syuzou Waki, Toshiyuki Goshima, Yoro Sasaki, Yoshikazu Nishikawa
Принадлежит: Individual

An object is to provide a composition that has good viscosity stability and flowability at the time of processing, good shape retention after the processing, and good drying property in a temperature range of not degrading the conductor layer at the time of drying and that enables a coated film excellent in strength of adhesion with metal•polyimide, flame resistance, heat resistance, flexibility, mechanical properties, and chemical resistance to obtained after being dried. To meet this object, a composition is prepared containing (A) polyimide and (B) mixed solvent of two kinds or more, and the solubility parameter of the mixed solvent of two kinds or more ranges from 9 to 14.

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Номер записи: 17
22-03-2012 дата публикации

Package substrate unit and method for manufacturing package substrate unit

Номер: US20120067635A1
Автор: Hideaki Yoshimura, Hitoshi Suzuki, Hnin Nway San Nang, Kazuya Arai, Kei Fukui, Shinpei Ikegami, Yasuhito Takahashi
Принадлежит: Fujitsu Ltd

A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

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Номер записи: 18
29-03-2012 дата публикации

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Номер: US20120073868A1
Автор: Takeshi Nakamura, Yoshinori Takenaka
Принадлежит: Ibiden Co Ltd

A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative material and the first conductive circuit, forming on a surface of the second resin insulative material a first concave portion to be filled with a conductive material for formation of a second conductive circuit, forming on the surface of the second resin insulative material a pattern having a second concave portion and post portions to be filled with the conductive material for formation of a plane conductor, and filling the conductive material in the first concave portion and the second concave portion such that the second conductive circuit and the plane conductor are formed.

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Номер записи: 19
29-03-2012 дата публикации

Multi-layered substrate

Номер: US20120073871A1
Автор: Bernd Karl Appelt, Ming-Chiang Lee, You-Lung Yen, Yuan-Chang Su
Принадлежит: Advanced Semiconductor Engineering Inc

The present invention directs to double-sided multi-layered substrate a base, at least a through-hole passing through the base, patterned first and second metal layers formed on the two opposite surfaces of the base, and first and second plating layers. The first plating layer covers a sidewall of the through-hole and the bottom surface surrounding a bottom opening of the through hole. The second plating layer covers the first plating layer and the top surface surrounding a top opening of the through hole.

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Номер записи: 20
29-03-2012 дата публикации

Wiring structure and joint box including the same

Номер: US20120077359A1
Автор: Keisuke Takahashi, Takeyoshi Yamamoto, Yoshikatsu Hasegawa
Принадлежит: Honda Motor Co Ltd, Mitsubishi Cable Industries Ltd, Mitsubishi Materials Corp

A wiring structure includes a board assembly and pin terminals. In each of pin terminal insertion holes formed in the board assembly, a terminal connection portion electrically connected to a metal foil wire and fitted onto the pin terminal so as to hold the pin terminal is provided in a through-hole of at least one of a plurality of circuit boards forming the board assembly, which forms a part of the pin terminal insertion hole, whereas an insulating sleeve blocking contact between the pin terminal and each of the remaining circuit boards is fitted into through-holes of the remaining circuit boards, which form the remaining part of the pin terminal insertion hole.

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Номер записи: 21
05-04-2012 дата публикации

Circuit board including embedded decoupling capacitor and semiconductor package thereof

Номер: US20120080222A1
Автор: Hee-Seok Lee, Ji-hyun Lee, Yong-Hoon Kim
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A circuit board including an embedded decoupling capacitor and a semiconductor package thereof are provided. The circuit board may include a core layer including an embedded decoupling capacitor, a first build-up layer at one side of the core layer, and a second build-up layer at the other side of the core layer, wherein the embedded decoupling capacitor includes a first electrode and a second electrode, the first build-up layer includes a first via contacting the first electrode, and the second build-up layer includes a second via contacting the first electrode.

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Номер записи: 22
05-04-2012 дата публикации

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Номер: US20120080400A1
Автор: Iku Tokihisa, Sho Akai, Tatsuya Imai
Принадлежит: Ibiden Co Ltd

A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

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Номер записи: 23
05-04-2012 дата публикации

Chip Capacitor Precursors

Номер: US20120081832A1
Автор: Azuma Chikara
Принадлежит: Texas Instruments Inc

A capacitive precursor includes electrically conductive material layers stacked on a substrate. The electrically conductive layers provide first and second patterns. The patterns each include overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. Dielectric layers are interposed between neighboring electrically conductive material layers for electrical isolation. One or more capacitive precursors can be dropped onto or into a board and during assembly of a packaged semiconductor device and have electrically conducting layers associated with its respective plates connected together to form a capacitor during assembly using conventional assembly steps.

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Номер записи: 24
19-04-2012 дата публикации

Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump

Номер: US20120091493A1
Автор: Charles W.C. Lin, Chia-Chung Wang
Принадлежит: Bridge Semiconductor Corp

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and dual adhesives. The heat spreader includes a bump, a base and a ledge. The conductive trace includes a pad and a terminal. The semiconductor device is mounted on the bump in a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The bump extends into an opening in the first adhesive and is aligned with and spaced from an opening in the second adhesive. The base and the ledge extend laterally from the bump. The first adhesive is sandwiched between the base and the ledge, the second adhesive is sandwiched between the conductive trace and the ledge and the ledge is sandwiched between the adhesives. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

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Номер записи: 25
03-05-2012 дата публикации

Method of manufacturing multilayer wiring substrate

Номер: US20120102732A1
Автор: Shinnosuke Maeda
Принадлежит: NGK Spark Plug Co Ltd

A method of manufacturing a multilayer wiring substrate is provided. A foil of a metal-foil-clad resin insulation material is brought into contact with a foil of a metal-foil-clad support substrate. A peripheral edge portion of the resin insulation material exposed as a result of removal of a peripheral edge portion of the foil is adhered to the foil of the support substrate. A plurality of conductor layers and a plurality of resin insulation layers are laminated so as to obtain a laminate structure having a wiring laminate portion, which is to become the multilayer wiring substrate. The laminate structure is cut along a boundary between the wiring laminate portion and a surrounding portion, and the surrounding portion is removed. The wiring laminate portion is separated from the support substrate along the boundary between the two foils.

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Номер записи: 26
03-05-2012 дата публикации

Through wiring substrate and manufacturing method thereof

Номер: US20120103679A1
Автор: Hirokazu Hashimoto, Satoshi Yamamoto
Принадлежит: Fujikura Ltd

A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section.

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Номер записи: 27
03-05-2012 дата публикации

Method for Producing an Electrical Circuit and Electrical Circuit

Номер: US20120106112A1
Автор: Ricardo Ehrenpfordt, Sonja Knies
Принадлежит: ROBERT BOSCH GMBH

A method for producing an electrical circuit includes providing a main printed circuit board having a plurality of metalized plated-through holes through the main printed circuit board along at least one separating line between adjacent printed circuit board regions of the main printed circuit board. Each printed circuit board region has electrical contact connection pads on at least the main surface of the printed circuit board region that is to be populated, electrical lines for connection between the plurality of plated-through holes and the contact connection pads, and at least one semiconductor chip electrically contact-connected by means of the contact connection pads. The main printed circuit board is covered with a potting compound across the printed circuit board regions with the semiconductor chips.

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Номер записи: 28
03-05-2012 дата публикации

Z-directed pass-through components for printed circuit boards

Номер: US20120108115A1
Автор: Brian Lee Nally, John Thomas Fessler, Keith Bryan Hardin, Paul Kevin Hall, Robert Aaron Oglesbee
Принадлежит: Lexmark International Inc

A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

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Номер записи: 29
10-05-2012 дата публикации

Method of manufacturing circuit board

Номер: US20120111728A1
Автор: Myeong Ho Hong, Suk Hyeon Cho
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein is a method of manufacturing a circuit board. The method of manufacturing a circuit board according to a preferred embodiment of the present invention is configured to include (A) forming a cavity 115 for a bump on one surface 111 of a carrier 110, (B) forming a bump 130 in the cavity 115 for the bump through an electroplating process, (C) laminating an insulating layer 140 on one surface 111 of the carrier 110 so as to apply the bump 130, (D) forming a circuit layer 150 including a via 155 connected with the bump 130 on the insulating layer 140, and (E) removing the carrier 110, whereby the process of forming separate solder balls is removed by forming the cavities 111 for the bumps in the carriers 110 to form the bumps, thereby simplifying the process of manufacturing a circuit board and reducing the lead time.

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Номер записи: 30
10-05-2012 дата публикации

Suspension board with circuit and producing method thereof

Номер: US20120113547A1
Автор: Yuu Sugimoto
Принадлежит: Nitto Denko Corp

A suspension board with circuit includes a metal supporting board; an insulating layer formed on the metal supporting board having an opening penetrating in the thickness direction formed therein; and a conductive pattern formed on the insulating layer including an external-side terminal electrically connected to an external board. The external-side terminal is filled in the opening of the insulating layer. In the metal supporting board, a support terminal electrically insulated from the surrounding metal supporting board and electrically connected to the external-side terminal is provided. The suspension board with circuit includes a metal plating layer formed below the support terminal and an electrically-conductive layer interposed between the support terminal and the metal plating layer having a thickness of 10 nm or more to 200 nm or less.

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Номер записи: 31
10-05-2012 дата публикации

Method for integrating and erecting carbon nanotube column

Номер: US20120115367A1
Автор: Chih-Pi Cheng, Yen-Chih Chang
Принадлежит: Hon Hai Precision Industry Co Ltd

A method for integrating and erecting CNT column, comprises following steps of: 1) providing a conductive layer; 2) applying a non-conductive layer over the conductive layer; 3) forming a via on the non-conductive substrate; 4) placing an electrode above the via; 5) deploying dispersive liquid containing CNT powder into the via; 6) applying a predetermined AC electric field between the conductive substrate and the electrode for integrating and erecting the CNT powder into CNT column under electric field force.

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Номер записи: 32
17-05-2012 дата публикации

Printed circuit board and method for manufacturing the same

Номер: US20120118618A1
Автор: Byung Seung Min
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein are a printed circuit board and a method for manufacturing the same. The method for manufacturing a printed circuit board includes: (a) forming at least one plate through hole penetrating through an insulating layer; (b) forming pattern grooves for implementing inner layer circuits on both surfaces of the insulating layer; and (c) filling the plate through hole and the pattern grooves with a conductive material. The method for manufacturing a printed circuit board may provide the printed circuit board having excellent heat radiating characteristics and reduce process cost.

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Номер записи: 33
17-05-2012 дата публикации

Electronic apparatus and hard disk drive

Номер: US20120120591A1
Автор: Nobuhiro Yamamoto, Takahisa Funayama
Принадлежит: Individual

According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.

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Номер записи: 34
24-05-2012 дата публикации

Multilayered printed circuit board and manufacturing method thereof

Номер: US20120125680A1
Автор: Atsushi Shouda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Kouji Asano, Kouta Noda, Naohiro Hirose, Naoto Ishida
Принадлежит: Ibiden Co Ltd

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

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Номер записи: 35
07-06-2012 дата публикации

Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate

Номер: US20120138346A1
Автор: Hiroyuki Uematsu, Kenichi Kawabata
Принадлежит: TDK Corp

A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.

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Номер записи: 36
14-06-2012 дата публикации

Multilayer printed wiring boards with holes requiring copper wrap plate

Номер: US20120144667A1
Автор: Rajwant Singh Sidhu
Принадлежит: DDI Global Corp

Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

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Номер записи: 37
14-06-2012 дата публикации

Printed circuit board

Номер: US20120147580A1
Автор: Seiji Hayashi
Принадлежит: Canon Inc

A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power source plane. Thus, a common mode noise arising from between the power source and the ground is caused to flow into the plane conductor. This reduces the common mode noise flowing in the ground and the power source of the printed wiring board, which relatively act as antennas.

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Номер записи: 38
14-06-2012 дата публикации

Method of manufacturing printed circuit board

Номер: US20120148960A1
Автор: Chang Sup Ryu, Eung Suek Lee, Je Gwang Yoo, Jee Soo Mok
Принадлежит: Samsung Electro Mechanics Co Ltd

A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

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Номер записи: 39
21-06-2012 дата публикации

Electrolytic copper process using anion permeable barrier

Номер: US20120152751A1
Автор: Bioh Kim, John Lee Klocke, Kyle M. Hanson, Rajesh Baskaran, Robert W. Batz, Jr., Tom L. Ritzdorf
Принадлежит: Applied Materials Inc

Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.

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Номер записи: 40
21-06-2012 дата публикации

Method of manufacturing substrate for capacitor-embedded printed circuit board and capacitor-embedded printed circuit board

Номер: US20120152886A1
Автор: Hwa-Sun Park, Jong-Woo Han, Sang-Chul Lee, Sung Yi, Woon-Chun KIM, Young-Do Kweon
Принадлежит: Samsung Electro Mechanics Co Ltd

A method of manufacturing a capacitor-embedded printed circuit board, the method including providing a substrate on which a first metal layer, a dielectric layer and an adhesive resin layer are stacked on the order thereof; etching a part of the first metal layer to form a first electrode and a first circuit pattern; compressing a surface of the substrate, on which the first electrode is formed, onto a core board by interposing an insulation resin layer; forming a second electrode and a second circuit pattern on the adhesive resin layer; stacking an insulation board on the substrate such that the second electrode and the second circuit pattern are covered; and forming a third circuit pattern on the insulation board.

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Номер записи: 41
21-06-2012 дата публикации

Lead pin for package substrate and semiconductor package printed circuit board including the same

Номер: US20120153473A1
Автор: Sang Yul Lee
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein is a lead pin for a package substrate including a connection pin, and a head part including a flange part formed at one end of the connection pin and having one surface bonded to the connection pin and a flat part formed at the other surface of the flange part and having at least one groove formed along an outer circumference thereof. According to the present invention, the grooves are formed along the outer circumference of the flat part of the head part of the lead pin to increase a bonding area, thereby making it possible to increase bonding strength of the lead pin.

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Номер записи: 42
21-06-2012 дата публикации

Reduced pth pad for enabling core routing and substrate layer count reduction

Номер: US20120153495A1
Автор: Debendra Mallik, Mihir K. Roy
Принадлежит: Intel Corp

Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

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Номер записи: 43
21-06-2012 дата публикации

Semiconductor package and manufacturing method therefor

Номер: US20120153509A1
Автор: Akihiko Tateiwa, Masahiro Kyozuka, Toru Hizume
Принадлежит: Shinko Electric Industries Co Ltd

According to one embodiment, there is provided a semiconductor package including: a semiconductor chip; a resin portion formed to cover the semiconductor chip; a wiring structure formed on the resin portion and electrically connected to the semiconductor chip; and a warpage preventing member provided above the resin portion to have a thermal expansion coefficient closer to that of the semiconductor chip than to that of the wiring structure.

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Номер записи: 44
21-06-2012 дата публикации

Semiconductor chip assembly and method for making same

Номер: US20120155055A1
Автор: Belgacem Haba, Hiroaki Sato, Ilyas Mohammed, Kiyoaki Hashimoto, Norihito Masuda, Philip Damberg, Teck-Gyu Kang, Wei-Shun Wang, Yoshikuni Nakadaira
Принадлежит: Tessera LLC

A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

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Номер записи: 45
28-06-2012 дата публикации

Coreless layer buildup structure

Номер: US20120160547A1
Автор: Frank D. Egitto, Rabindra N. Das, Timothy Antesberger, Voya R. Markovich, William E. Wilson
Принадлежит: Endicott Interconnect Technologies Inc

A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin.

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Номер записи: 46
28-06-2012 дата публикации

Metalized pad to electrical contact interface

Номер: US20120164888A1
Автор: James Rathburn
Принадлежит: HSIO Technologies LLC

A surface mount electrical interconnect to provide an interface between a PCB and contacts on an integrated circuit device. The electrical interconnect includes a substrate with a plurality of recesses arranged along a first surface to correspond to the contacts on the integrated circuit device. Contact members are located in a plurality of the recess. The contact members include contact tips adapted to electrically couple with the contacts on the integrated circuit device. An electrical interface including at least one circuit trace electrically couples the contact member to metalized pads located along a second surface of the substrate at a location offset from a corresponding contact member. A solder ball is attached to a plurality of the metalized pads.

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Номер записи: 47
05-07-2012 дата публикации

Printed circuit board and method for manufacturing the same

Номер: US20120168212A1
Автор: Dong Kyu Lee, Hyung Gi HA, Ja Ho KOO, Jae Won Jung, Jong Jin Lee, Yong Hwan Kim, Young Hwan Shin
Принадлежит: KOREA E&S CO Ltd, Samsung Electro Mechanics Co Ltd

Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.

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Номер записи: 48
12-07-2012 дата публикации

System for manufacturing laminated circuit boards

Номер: US20120174387A1
Автор: Anthony Faraci, Gary N. Sortino
Принадлежит: Duetto Integrated Systems Inc

The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

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Номер записи: 49
12-07-2012 дата публикации

Wiring board and method of producing the same

Номер: US20120175157A1
Автор: Kentaro Kaneko
Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the wiring board, an outer peripheral edge of the external connection pad is retracted from an outer peripheral edge of the surface plated layer toward a center of the external connection pad.

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Номер записи: 50
12-07-2012 дата публикации

Printed circuit board

Номер: US20120175162A1
Автор: Jee Soo Mok, Jun Heyoung Park
Принадлежит: Samsung Electro Mechanics Co Ltd

A printed circuit board having an insulating layer; circuit patterns formed on both surfaces of the insulating layer in order to be embedded in the insulating layer; and a bump formed to pass through the insulating layer in order to electrically connect the circuit patterns formed on both surfaces of the insulating layer.

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Номер записи: 51
19-07-2012 дата публикации

Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods

Номер: US20120181073A1
Автор: Casey Philip Rodriguez, Louis Joseph Rendek, Jr., Steven R. Snyder
Принадлежит: HARRIS CORP

An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack.

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Номер записи: 52
19-07-2012 дата публикации

Double-sided circuit board and manufacturing method thereof

Номер: US20120181076A1
Автор: Kota Noda, Satoru Kawai, Tsutomu Yamauchi
Принадлежит: Ibiden Co Ltd

A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R 1 on the first surface of the substrate, a second hole having a second opening with a diameter R 2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R 1 and R 2.

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Номер записи: 53
19-07-2012 дата публикации

Packaging substrate with conductive structure

Номер: US20120181688A1
Автор: Shih-Ping Hsu
Принадлежит: Individual

A packaging substrate with conductive structure is provided, including a substrate body having at least one conductive pad on a surface thereof, a stress buffer metal layer disposed on the conductive pad and a thickness of the stress buffer metal layer being 1-20 μm, a solder resist layer disposed on the substrate body and having at least one opening therein for correspondingly exposing a portion of top surface of the stress buffer metal layer, a metal post disposed on a central portion of the surface of the stress buffer metal layer, and a solder bump covering the surfaces of the metal post. Therefore, a highly reliable conductive structure is provided, by using the stress buffer metal layer to release thermal stresses, and using the metal post and the solder bump to increase the height of the conductive structure.

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Номер записи: 54
19-07-2012 дата публикации

Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices

Номер: US20120182701A1
Автор: David Nicol, Louis Joseph Rendek, Jr., Michael Weatherspoon
Принадлежит: HARRIS CORP

A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.

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Номер записи: 55
26-07-2012 дата публикации

Multi-layer flexible printed circuit board for electronic device

Номер: US20120186856A1
Автор: Hyun-Sik Min, Jong-Hun AN
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A multi-layer Flexible Printed Circuit Board (FPCB) for an electronic device, in which a plurality of components are provided alternately on a top surface and a bottom surface of a base layer and the components are removed from the other region. The multi-layer FPCB includes a base layer, a first circuit pattern provided on a side region on a top surface of the base layer, a first adhesive layer provided in the first circuit pattern, a second circuit pattern provided on a bottom surface of the base layer and in an other-side region opposite to the side region, a second adhesive layer provided in the second circuit pattern, a first insulating/protecting layer provided on a top surface of the first adhesive layer, and a second insulating/protecting layer provided on a bottom surface of the second adhesive layer.

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Номер записи: 56
26-07-2012 дата публикации

Flexible circuit board

Номер: US20120186858A1
Автор: Hiroharu UEHARA, Hiroki Shirato, Katsuhide NAKAI
Принадлежит: Canon Components Inc

A flexible circuit board includes a base film which is composed of an aluminum sheet and first protective films formed on the respective surfaces of the aluminum sheet and has a sprocket hole and a device hole, a predetermined conductor pattern which is formed on a surface of the base film, and a second protective film which is composed of aluminum and an electrically insulative film formed on a surface of the aluminum and is formed so as to cover the predetermined conductor pattern.

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Номер записи: 57
02-08-2012 дата публикации

Method for connecting two objects electrically

Номер: US20120192415A1
Автор: Hiroto Sugahara
Принадлежит: Brother Industries Ltd

A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a lower surface of the substrate. Further, a droplet of an electroconductive liquid is made to land on the recess, and the liquid is filled in the through hole via the groove. Next, the liquid filled in the groove, the recess, and the through hole is heated to harden. Further, the recess and the groove of the substrate are removed by cutting up to an area near the through hole. Accordingly, it is possible to connect electrically the connecting bodies arranged on both surfaces of the substrate by filling an electroconductive material in the through holes easily.

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Номер записи: 58
09-08-2012 дата публикации

Optical Printed Circuit Board and Method for Manufacturing the Same

Номер: US20120201493A1
Автор: Jae Bong Choi
Принадлежит: LG Innotek Co Ltd

Provided are an optical printed circuit board and a method for manufacturing the same. The optical printed circuit board includes a printed circuit board and an optical connecting module. The printed circuit board is provided with at least one or more inner layers, and a circuit pattern electrically connecting the inner layers. The optical connecting module is embedded in the printed circuit board and includes an optical transmitting portion, an optical receiving portion, and an optical waveguide connecting the optical transmitting portion and the optical receiving portion. The printed circuit board defines an align pattern region, such that tops of the optical transmitting portion and the optical receiving portion are formed lower than a surface of the printed circuit board.

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Номер записи: 59
16-08-2012 дата публикации

Method for manufacturing wiring board

Номер: US20120204424A1
Автор: Izumi Tanaka, Yuji Yukiiri
Принадлежит: Shinko Electric Industries Co Ltd

There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

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Номер записи: 60
23-08-2012 дата публикации

Wired circuit board and producing method thereof

Номер: US20120211263A1
Автор: Masaki Mizutani
Принадлежит: Nitto Denko Corp

A wired circuit board includes an insulating layer formed with an insulating opening extending through the insulating layer in a thickness direction, and a conductive pattern including a wire formed on the insulating layer and a terminal connected to the wire. The terminal includes a filling portion with which the insulating opening of the insulating layer is internally filled, a first projecting portion formed to continue to the filling portion and project from the filling portion on one side in the thickness direction, and a second projecting portion formed to continue to the filling portion and project from the filling portion on the other side in the thickness direction.

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Номер записи: 61
30-08-2012 дата публикации

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Номер: US20120217634A9
Автор: Il Kwon Shim, Seng Guan Chow, Yaojian Lin
Принадлежит: Stats Chippac Pte Ltd

A semiconductor device includes a first semiconductor die or component having a plurality of bumps, and a plurality of first and second contact pads. In one embodiment, the first and second contact pads include wettable contact pads. The bumps are mounted directly to a first surface of the first contact pads to align the first semiconductor die or component. An encapsulant is deposited over the first semiconductor die or component. An interconnect structure is formed over the encapsulant and is connected to a second surface of the first and second contact pads opposite the first surface of the first contact pads. A plurality of vias is formed through the encapsulant and extends to a first surface of the second contact pads. A conductive material is deposited in the vias to form a plurality of conductive vias that are aligned by the second contact pads to reduce interconnect pitch.

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Номер записи: 62
13-09-2012 дата публикации

Sensor, keyboard and method for manufacturing sensor

Номер: US20120228109A1
Автор: Christopher Lee KELLER, Dongdong Wang, Masataka Ito, Yoshitsugu Wakazono
Принадлежит: Ibiden Co Ltd

A sensor includes a first printed wiring board having a first electrode made of a metal film, a second printed wiring board facing the first printed wiring board and having a second electrode made of a metal film, the second electrode being positioned on the second printed wiring board such that the second electrode faces the first electrode of the first printed wiring board, and a dielectric body spacing the first electrode and the second electrode apart such that the first electrode, the second electrode and the dielectric body form a capacitor.

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Номер записи: 63
20-09-2012 дата публикации

Printed wiring board and method for manufacturing the same

Номер: US20120233857A1
Автор: Kazuhiro Kashiwakura
Принадлежит: Individual

A printed wiring board comprises ground layers stacked via insulator(s); a first through hole; second through holes; and signal wirings each extending from the first through hole through the clearance between predetermined ones of the ground layers, disposed between predetermined second through holes of the second through holes. Each of first clearances in the ground layers neighboring layer in which the signal wiring is disposed has an outline that a distance between the first through hole and outline of the first clearance is minimum of the signal wiring. Each of second clearances in the ground layers not adjacent to the signal wiring has an outline formed outside a circle connecting each center of second through holes centering the first signal through hole, such that outline of second clearance does not contact with the second through holes.

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Номер записи: 64
20-09-2012 дата публикации

Wiring substrate and method of manufacturing the same

Номер: US20120234589A1
Автор: Akihiko Tateiwa, Jun Furuichi, Naoyuki Koizumi
Принадлежит: Shinko Electric Industries Co Ltd

A wiring substrate includes a structure in which a plurality of wiring layers are stacked through insulating layers intervening therebetween, and which has a first surface side and a second surface side, the first surface side where a semiconductor element is to be mounted, the second surface side being located at an opposite side to the first surface side, an interposer buried in an outermost one of the insulating layers located at the first surface side, and electrically connected to the semiconductor element to be mounted, and a sheet-shaped member buried in an outermost one of the insulating layers located at the second surface side, wherein, the interposer and the sheet-shaped member are disposed at symmetrical positions symmetrical each other.

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Номер записи: 65
04-10-2012 дата публикации

Composite circuit board with fracturable structure

Номер: US20120247811A1
Автор: Chih-Heng Chuo, Gwun-Jin Lin, Kuo-Fu Su
Принадлежит: Advanced Flexible Circuits Co Ltd

A composite circuit board with fracturable structure includes a first flat cable and first signal transmission lines formed on the first flat cable. A second flat cable is stacked on and bonded to the first circuit flat cable. The second flat cable includes second signal transmission lines and forms an overlapping segment and a selective breakable segment between which a fracturable structure is formed. The selective breakable segment covers the connection segment of the first flat cable or may be broken off for separation of the flat cables. Some of the second signal transmission lines of the second flat cable are connected through a hole in the first circuit flat cable to the first signal transmission lines of the first flat cable or connected through the hole to the conductive terminals of the connection segment of the first flat cable.

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Номер записи: 66
04-10-2012 дата публикации

Coreless layer laminated chip carrier having system in package structure

Номер: US20120247822A1
Автор: James W. Fuller, Jr., Jeffrey Knight, Kostas I. Papathomas, Voya R. Markovich
Принадлежит: Endicott Interconnect Technologies Inc

A substrate for use in a laminated chip carrier (LCC) and a system in package (SiP) device having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can include thermoset and thermoplastic resin.

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Номер записи: 67
11-10-2012 дата публикации

Packaging substrate and method of fabricating the same

Номер: US20120255771A1
Автор: Chao-Meng Cheng, Wen-Hung Hu, Ya-Ping Chiou, Yu-Hsiang Huang
Принадлежит: Unimicron Technology Corp

A packaging substrate includes a core board having a first surface and an opposite second surface; at least a conic through hole formed in the core board and penetrating the first and second surfaces; a plurality of conductive paths formed on a wall of the conic through hole, free from being electrically connected to one another in the conic through hole; and a plurality of first circuits and second circuits disposed on the first and second surfaces of the core board, respectively, and being in contact with peripheries of two ends of the conic through hole, wherein each of the first circuits is electrically connected through each of the conductive paths to each of the second circuits. Compared to the prior art, the packaging substrate has a reduced number of through holes or vias and an increased overall layout density.

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Номер записи: 68
18-10-2012 дата публикации

Optical Printed Circuit Board and Method of Fabricating the Same

Номер: US20120263412A1
Автор: Jae Bong Choi
Принадлежит: LG Innotek Co Ltd

Provided are a photovoltaic apparatus and a manufacturing method thereof. The photovoltaic apparatus includes: substrate; a back electrode layer disposed on the substrate; a plurality of first intermediate layers disposed on the back electrode layer; a plurality of second intermediate layers disposed on the back electrode layer and each disposed between the first intermediate layers; light absorbing layers disposed on the first intermediate layers and the second intermediate layers; and a front electrode layer disposed on the light absorbing layer.

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Номер записи: 69
25-10-2012 дата публикации

Enhanced Modularity in Heterogeneous 3D Stacks

Номер: US20120272040A1
Автор: Eren Kursun, Jude A. Rivers, Philip G. Emma
Принадлежит: International Business Machines Corp

A computer program product for generating and implementing a three-dimensional (3D) computer processing chip stack plan. The computer readable program code includes computer readable program code configured for receiving system requirements from a plurality of clients, identifying common processing structures and technologies from the system requirements, and assigning the common processing structures and technologies to at least one layer in the 3D computer processing chip stack plan. The computer readable program code is also configured for identifying uncommon processing structures and technologies from the system requirements and assigning the uncommon processing structures and technologies to a host layer in the 3D computer processing chip stack plan. The computer readable program code is further configured for determining placement and wiring of the uncommon structures on the host layer, storing placement information in the plan, and transmitting the plan to manufacturing equipment. The manufacturing equipment forms the 3D computer processing chip stack.

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Номер записи: 70
01-11-2012 дата публикации

Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board

Номер: US20120275124A1
Автор: Dietmar Drofenik, Johannes Stahr, Liubomir Mareljic, Rainer Pludra, Siegfried Gotzinger
Принадлежит: Individual

In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions ( 20, 21, 22 ) to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions ( 20, 21, 22 ) to be connected to one another, at least one additional layer or ply of the printed circuit board is arranged or applied over the printed circuit board regions ( 20, 21, 22 ) to be connected to one another, it is provided that the additional layer is embodied as a conductive layer ( 26 ), which is contact-connected via plated-through holes ( 23 ) to conductive layers or devices or components integrated in the printed circuit board regions ( 20, 21, 22 ) to be connected to one another, as a result of which a simple and reliable connection or coupling of printed circuit board regions ( 20, 21, 22 ) to be connected to one another can be made available. Furthermore, a printed circuit board consisting of a plurality of printed circuit board regions ( 20, 21, 22 ) is made available.

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Номер записи: 71
08-11-2012 дата публикации

Manufacturing method of circuit substrate

Номер: US20120279630A1
Автор: Chih-Hong Chuang, Tzu-Wei Huang
Принадлежит: Subtron Technology Co Ltd

A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.

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Номер записи: 72
08-11-2012 дата публикации

Printed wiring board and method for manufacturing the same

Номер: US20120279770A1
Автор: Hiroyasu Nagata
Принадлежит: Ibiden Co Ltd

A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.

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Номер записи: 73
08-11-2012 дата публикации

Circuit board viaholes and method of manufacturing the same

Номер: US20120279775A1
Автор: Chang-han Shim, Se-chuel Park, Sung-Il Kang
Принадлежит: Samsung Techwin Co Ltd

Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate.

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Номер записи: 74
22-11-2012 дата публикации

Component built-in module, and manufacturing method for component built-in module

Номер: US20120293965A1
Автор: Kazuo Ohtani, Shozo Ochi, Yoshitake Hayashi, Yosuke Maeba
Принадлежит: Panasonic Corp

A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

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Номер записи: 75
29-11-2012 дата публикации

Construction of reliable stacked via in electronic substrates - vertical stiffness control method

Номер: US20120299195A1
Автор: David J. Russell, David L. Questad, Douglas O. Powell, Karan Kacker, Sri M. Sri-Jayantha
Принадлежит: International Business Machines Corp

A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing with a thickness of substantially 3 μm. The platted through hole landing includes an etched pattern and a copper top surface.

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Номер записи: 76
29-11-2012 дата публикации

Multilayer substrate

Номер: US20120300416A1
Автор: Gohki NISHIMURA, Naoyuki Tasaka, Tetsuo Saji
Принадлежит: TAIYO YUDEN CO LTD

A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.

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Номер записи: 77
06-12-2012 дата публикации

Resonant via structures in multilayer substrates and filters based on these via structures

Номер: US20120306597A1
Автор: Taras Kushta
Принадлежит: NEC Corp

A resonant via structure is provided with a multilayer substrate, a signal via conductor and ground vias. The multilayer substrate includes conductor layers and a dielectric. The dielectric isolates each of the conductor layers. The signal via conductor is disposed through the multilayer substrate. The ground vias are disposed through the multilayer substrate and around the signal via conductor. The dielectric comprises two sections disposed between the signal via and ground vias, in the plane of conductor layers. The first section is disposed between the first layer and other layer of the conductor layers. The second section is disposed between the other layer and the last layer of the conductor layers.

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Номер записи: 78
06-12-2012 дата публикации

Component-embedded substrate

Номер: US20120307466A1
Автор: Isamu Fujimoto, Masanori Fujidai
Принадлежит: Murata Manufacturing Co Ltd

In a component-embedded substrate, a component and wiring block units are embedded in a component-embedded layer; conductive layers are located on all surfaces of the wiring block units; the component and the wiring block units are arranged such that lower surface side conductive layers of the wiring block units and electrodes of the component contact lower surface side wiring layers; via-hole conductors are located in respective upper positions relative to upper surface side conductive layers of the wiring block units and the electrodes of the component; and upper surface side wiring layers of the component-embedded layer are thus electrically connected to upper surface side conductive layers of the wiring block units, and the electrodes of the component by the via-hole conductors.

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Номер записи: 79
20-12-2012 дата публикации

Method of electroplating uniform copper layers

Номер: US20120318676A1
Автор: Elie H. Najjar, Leon R. Barstad, Mark Lefebvre, Michael P. Toben
Принадлежит: Rohm and Haas Electronic Materials LLC

Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power.

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Номер записи: 80
20-12-2012 дата публикации

Flexible circuit assembly and method thereof

Номер: US20120320532A1
Автор: James Jen-Ho Wang
Принадлежит: Power Gold LLC

An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18 , for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.

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Номер записи: 81
20-12-2012 дата публикации

Module substrate, module-substrate manufacturing method, and terminal connection substrate

Номер: US20120320536A1
Автор: Issei Yamamoto
Принадлежит: Murata Manufacturing Co Ltd

In a module substrate, a plurality of terminal connection substrates each including an insulator and a plurality of columnar terminal electrodes arranged on a single lateral surface or both lateral surfaces of the insulator is mounted on a single side of a composite substrate such that at least one of the terminal connection substrates extends over a border between a plurality of neighboring module substrates. The composite substrate, in which the plurality of terminal connection substrates is mounted on the single side and a plurality of electronic components is mounted on at least the single side, is divided at a location where the module substrates are to be cut from the composite substrate.

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Номер записи: 82
27-12-2012 дата публикации

Wiring board and method of manufacturing the same

Номер: US20120325529A1
Автор: Akinori Shiraishi, Hideaki Sakaguchi, Mitsutoshi Higashi
Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

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Номер записи: 83
27-12-2012 дата публикации

Method of manufacturing multilayer circuit board and multilayer circuit board

Номер: US20120325533A1
Автор: Hideaki Yoshimura
Принадлежит: Fujitsu Ltd

A method of manufacturing a multilayer circuit board includes forming a prepreg on a surface of a first circuit board including a first region in which a plated-through hole is formed and a second region in which a solid pattern is formed, the prepreg having a first hole reaching the plated-through hole and a second hole reaching the solid pattern, filling the first hole with a conductive paste, and pressing a second circuit board on the prepreg to laminate the first circuit board and the second circuit board to each other after filling the first hole with the conductive paste.

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Номер записи: 84
27-12-2012 дата публикации

Mobile computing devices

Номер: US20120327048A1
Автор: Colin Shiva Ramrattan, Mohamad El-Hage
Принадлежит: Research in Motion Ltd

A mobile computing device includes a flexible display, a rigid-flex printed circuit board (PCB) arrangement, an electrically conductive memory fabric, and a controller. The rigid-flex PCB arrangement is connected to the flexible display, and has a honeycomb configuration. The electrically conductive memory fabric is connected to the flexible display and the rigid-flex PCB arrangement. The controller is configured to, by selectively controlling supply of electrical current to the electrically conductive memory fabric, control whether the electrically conductive memory fabric (i) straightens and resists flexing of the flexible display and the rigid-flex PCB arrangement or (ii) is relaxed and allows flexing of the flexible display and the rigid-flex PCB arrangement.

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Номер записи: 85
03-01-2013 дата публикации

Electronic control unit and method of manufacturing the same

Номер: US20130003306A1
Автор: Mitsuhiro Saitou, Shinsuke Oota, Yutaka Oohashi
Принадлежит: Denso Corp

An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.

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Номер записи: 86
10-01-2013 дата публикации

Semiconductor element-embedded substrate, and method of manufacturing the substrate

Номер: US20130009325A1
Автор: Daisuke Ohshima, Hideya Murai, Katsumi Kikuchi, Kentaro Mori, Shintaro Yamamichi, Yoshiki Nakashima
Принадлежит: NEC Corp

A semiconductor element-embedded substrate includes a semiconductor element; a chip component; a peripheral insulating layer covering at least the outer circumferential side surfaces thereof; an upper surface-side wiring line provided on the upper surface side of the substrate; and a lower surface-side wiring line provided on the lower surface side of the substrate. The built-in semiconductor element includes a terminal on the upper surface side thereof, and this terminal is electrically connected to the upper surface-side wiring line. The built-in chip component includes an upper surface-side terminal electrically connected to the upper surface-side wiring line; a lower surface-side terminal electrically connected to the lower surface-side wiring line; and a through-chip via penetrating through the chip component to connect the upper surface-side terminal and the lower surface-side terminal.

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Номер записи: 87
24-01-2013 дата публикации

Grooved circuit board accommodating mixed-size components

Номер: US20130021763A1
Автор: FAN LI, Jie Huang, Surinder JASSAL
Принадлежит: Research in Motion Ltd

A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.

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Номер записи: 88
31-01-2013 дата публикации

Thermal substrate

Номер: US20130025839A1
Автор: Frank Egitto, Timothy Antesberger, Varaprasad V. Calmidi, Voya R. Markovich, William E. Wilson
Принадлежит: Endicott Interconnect Technologies Inc

An organic substrate capable of providing effective heat transfer through its entire thickness by the use of parallel, linear common thermally conductive openings that extend through the substrate, the substrate having thin dielectric layers bonded together to form an integral substrate structure. The structure is adapted for assisting in providing cooling of high temperature electrical components on one side by effectively transferring heat from the components to a cooling structure positioned on an opposing side. Methods of making the substrate are also provided, as is an electrical assembly including the substrate, component and cooling structure.

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Номер записи: 89
31-01-2013 дата публикации

Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board

Номер: US20130026636A1
Автор: Makoto Tani, Shinsuke Yano, Takami Hirai, Tsutomu Nanataki
Принадлежит: NGK Insulators Ltd

A circuit board that can decrease thermal stress acting between a semiconductor element and a board in association with temperature alteration and has high mechanical strength (rigidity) as a whole board (including a multilayer wiring layer) is provided. Ceramic base material having a coefficient of thermal expansion close to that of a semiconductor element and inner layer wiring are integrally sintered, and the circuit board is configured so that fine-lined conductor structure corresponding to a multilayer wiring layer in the inner layer wiring has predetermined width, intralayer interval and interlayer interval. Thereby, thermal stress acting between a semiconductor element and the board when the board is exposed to temperature alteration in a condition where it is joined with the semiconductor element is suppressed, rigidity of the board is maintained, and its reliability against temperature cycle is increased.

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Номер записи: 90
31-01-2013 дата публикации

Apparatus for detecting pattern alignment error

Номер: US20130027076A1
Автор: Jeong Hyun PARK
Принадлежит: Hynix Semiconductor Inc

An apparatus for detecting pattern alignment error includes a first conductive pattern disposed over a first insulation member with a power source applied of the first conductive pattern; a second insulation member for covering the first conductive pattern; a second conductive pattern disposed on the second insulation member; a conductive via connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first to conductive pattern for detecting an alignment error in response to a position of the conductive via. The apparatus for detecting pattern alignment error can detect the alignment of lower wiring in a device with multi-layer wiring

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Номер записи: 91
31-01-2013 дата публикации

Method of forming microstructures, laser irradiation device, and substrate

Номер: US20130029092A1
Автор: Hiroyuki WAKIOKA
Принадлежит: Fujikura Ltd

A microstructure forming method includes a step A of irradiating a region of a substrate, in which a hole-shaped or groove-shaped microstructure is to be formed, with a circularly or elliptically polarized laser beam having a pulse width of which the pulse duration is on the order of picoseconds or shorter, and scanning a focal point at which the laser beam converges to form a modified region, and a step B of performing an etching process on the substrate in which the modified region is formed and removing the modified region to form a microstructure.

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Номер записи: 92
07-02-2013 дата публикации

Thin film electrode ceramic substrate and method for manufacturing the same

Номер: US20130032384A1
Автор: Byeung Gyu Chang, Taek Jung Lee, Won Hee Yoo, Yun Hwi Park
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; a thin film electrode pattern formed on the ceramic substrate; and a plating layer formed on the thin film electrode pattern, wherein the plating layer is formed above the thin film electrode pattern and on both lateral surfaces of the thin film electrode pattern. According to the present invention, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented, by forming a plating layer above the thin film electrode pattern or on both lateral surfaces of the thin film electrode pattern, or forming an intaglio type anti-etching metal layer in the surface of the ceramic substrate.

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Номер записи: 93
21-02-2013 дата публикации

Method for forming coreless flip chip ball grid array (fcbga) substrates and such substrates formed by the method

Номер: US20130043060A1
Автор: David John Russell, Jean Audet, Kevin Arthur Dore, Sylvain Pharand, Sylvie Allard
Принадлежит: International Business Machines Corp

A method for forming coreless flip chip ball grid array (FCBGA) substrates comprising the steps of sequentially depositing a pair of laminates, each having a plurality of insulated metallization layers simultaneously respectively on each side of a temporary carrier substrate, and then removing the temporary carrier to separate the pair of laminates, so that each laminate has an outer ball grid metal pad array, and during the depositing of the pair of laminates on the carrier substrate, further depositing a supporting layer of dielectric material enclosing the metal pad array, wherein said supporting layers of dielectric material provides structural support for each of the laminates after the separation.

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Номер записи: 94
21-02-2013 дата публикации

Novel compound and use thereof

Номер: US20130043137A1
Автор: Aya Shimomura, Hiroki Yasuda, Hiroshi Ishizuka, Mikiko Kosaka, Ryoichi Kimizuka, Takuro Sato, Tatsuji Takasu, Yasuhiro Ogo, Yu Tonooka, Yumiko Shimizu, Yuto Oyama
Принадлежит: JCU Corp

Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed technique involves a tertiary amine compound, which is obtained by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group of a compound that has three or more glycidyl ether groups, and a quaternary amine compound thereof, as well as a copper plating additive, a copper plating bath, and a copper plating method employing the compounds.

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Номер записи: 95
28-02-2013 дата публикации

Circuit board

Номер: US20130048342A1
Автор: Charles Randall Malstrom, John Patton Geiger, Marjorie Kay Myers
Принадлежит: Tyco Electronics Corp

A circuit board includes a dielectric layer and sacrificial bumps on the dielectric layer in predetermined circuit common areas. A conductive seed layer is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductive seed layer. Sections of the conductive circuit layer and the conductive seed layer in the circuit common areas are removed. Optionally, the circuit board may include a metal substrate, with the dielectric layer applied on the metal substrate.

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Номер записи: 96
28-02-2013 дата публикации

Base member

Номер: US20130048350A1
Автор: Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda
Принадлежит: Shinko Electric Industries Co Ltd

A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of the core layer; and a silicon layer or a glass layer, formed on the bonding layer.

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Номер записи: 97
28-02-2013 дата публикации

Metal clad circuit board

Номер: US20130051018A1
Автор: Charles Randall Malstrom, Dean Perronne, Leonard H. Radzilowski, Marjorie K. Myers, Matthew E. Mostoller, Michael F. Laub, Miguel Morales, Robert D. Rix
Принадлежит: Tyco Electronics Corp

A metal clad circuit board includes a metal substrate. A dielectric layer is applied to the metal substrate. A conductive seed layer is printed on the dielectric layer. A conductive circuit layer is plated onto the conductive seed layer. Optionally, the conductive seed layer may be inkjet printed on the dielectric layer. Alternatively, the conductive seed layer may be pad printed on the dielectric layer. Optionally, the dielectric layer may be powder coated to the metal substrate. The dielectric layer may include polymers and fillers compression molded to the metal substrate. Optionally, the conductive circuit layer may be electroplated to the conductive seed layer. Optionally, a solder mask may be applied over the conductive circuit layer.

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Номер записи: 98
28-02-2013 дата публикации

Screening Process for Manufacturing a Z-directed Component for a Printed Circuit Board

Номер: US20130052338A1
Автор: Keith Bryan Hardin, Paul Kevin Hall, Qing Zhang, Zachary Charles Nathan KRATZER
Принадлежит: Lexmark International Inc

A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.

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Номер записи: 99
28-02-2013 дата публикации

Compositions for low k, low temperature co-fired composite (ltcc) tapes and low shrinkage, multi-layer ltcc structures formed therefrom

Номер: US20130052433A1
Автор: Kumaran Manikantan Nair, Mark Frederick Mccombs, Stephen C. Beers
Принадлежит: EI Du Pont de Nemours and Co

Novel compositions for LTCC green tapes having low K values and low shrinkage and composite laminates of ten to twenty layers or more of green tapes together with conventional LTCC green tapes.

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Номер записи: 100