Verfahren zur Herstellung von gedruckten Leiterplatten.

PROCEDURE FOR THE PRODUCTION OF A CIRCUIT PART ON A SUBSTRATE, PLATE AND KOMPOSITBAUTEIL

PROCEDURE FOR THE PRODUCTION OF AN ELECTRONIC LABEL

HOT-PRESSES POETS OF CERAMIC FLAT BODIES AS IN AND MULTI-LAYER SUBSTRATES FOR ELECTRONIC ELEMENTS.

ELECTRICAL CONNECTING OF SURFACE CONDUCTIVE LAYERS

Verfahren zur Herstellung mehrschichtiger Moduln integrierter Schaltungen aus Glas und Metall

Fluxing under fill compositions

PROCEEDED OF FORMATION OF PORTIONS Of a MATERIAL COMPOSES INSIDE UNECAVITE AND INCORPORATING ELECTRICAL CIRCUIT OF the MATERIAL PORTIONS COMPOSES AINSIOBTENUES

Electronic sound generating device

WIRING BOARD, SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THEM

... 본 발명은, 지지체의 표면에 유전체층과 배선층을 설치하여 중간체를 형성하는 공정과, 상기 중간체로부터 지지체를 제거하여 배선 기판을 얻는 공정과, 상기 중간체 형성 공정 전에 상기 지지체의 표면에 조화 처리를 실시하는 공정을 포함하는 것을 특징으로 한다.

Molded circuit board and method for the same

Ceramic multilayer circuit board and semiconductor module

A ceramic multilayer circuit board comprising ceramic layers and wiring conductor layers laminated alternately, in which the ceramic layer has a thermal expansion coefficient lower than that of the wiring conductor and not lower than one half of that of the conductor layer and is formed from a glass which softens at a temperature not higher than the melting point of the wiring conductor layer; a semiconductor module having a high reliability in its solder joint part comprising said ceramic multilayer circuit board mounted with a ceramic carrier substrate being mounted with a semiconductor device, said board being able to use a silver or copper conductor having a good electro-conductivity; and an amorphous glass powder for said ceramic multilayer circuit board.

Method for forming a circuit board via structure for high speed signaling

A method for forming a via in a printed circuit board is disclosed, which via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal planes. The method comprises forming a first conductive layer on a first side of a circuit board, and forming a second conductive layer on a second side of the circuit board; forming a first hole in the first side of the circuit board; forming a first cylinder on vertical edges of the first hole and in contact with the first conductive layer; forming a second hole in the second side of the circuit board; forming a second cylinder on vertical edges of the first hole, wherein the second cylinder is surrounded by first cylinder and in contact with the second conductive layer; and forming a via in the circuit board, wherein the via is surrounded by the second cylinder.

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.

Liner with electrical pathways

A liner for an appliance is formed by a plastic sheet formed into a three dimensional shape corresponding to at least a portion of a compartment of the appliance. A plurality of electrically conductive ink pathways are applied on a surface of the plastic sheet, and a sealer material is applied to the plastic sheet to cover said pathways.

Hot pressing dense ceramic sheets for electronic substrates and for multilayer ceramic electronic substrates

Dielektrische Mehrschichtvorrichtung und dazugehöriges Herstellungsverfahren

HERSTELLUNG VON GEDRUCKTEN SCHALTUNGEN.

PRINTED CIRCUIT BOARD WITH A SPRAYINGPOURED SUBSTRATE.

MANUFACTURING PROCESS FOR A TRANSPONDER COIL

HOT PRESSING DENSE CERAMIC SHEETS FOR ELECTRONIC SUBSTRATES AND FOR MULTILAYER CERAMIC ELECTRONIC SUBSTRATES

Electric rain sensor and method of manufacturing a sensor member thereto

MANUFACTURE OF ELECTRICAL CIRCUITS

FIRING PROCESS FOR FORMING A MULTILAYER GLASS-METAL MODULE

MANUFACTURING METHOD AND DEVICE FOR MAKING AN IN-MOLD CIRCUIT COMPRISING A CHIP

A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.

IN-MOLD CHIP ATTACH

A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.

METHOD FOR MAKING A TRANSPONDER COIL AND TRANSPONDER PRODUCED BY SAID METHOD

A method for making a transponder comprising the following steps: delimiting the different turns of a coil in a sheet comprising a dielectric substrate coated with at least a conductive layer by stamping the conductive layer with a sta mp having cutting contact surfaces with the surface conductive layer; connecting at least an electric component with the turns; assembling at least one protective sheet covering the coil and the electronic component. In order to facilitate the stamping and to obtain neat cuts, the conductive layer is covered with a synthetic film before stamping. In order to prevent short circuits from occurring above the cuts, the latter are preferably fill ed with glue, varnish or lacquer.

Manufactoring process of a mechanically fixed electric driver

condensar furo cego em núcleo de três camadas

Wiring board, semiconductor apparatus and method of manufacturing them

There are provided steps of providing a dielectric layer and a wiring layer on a surface of a support to form an intermediate body, removing the support from the intermediate body to obtain a wiring board, and carrying out a roughening treatment over a surface of the support before the intermediate body forming step.

MANUFACTURE OF ELECTRICAL CIRCUITS

A method of providing an electrical circuit on a surface of a three-dimensionally shaped substrate of insulating plastics material comprising providing a carrier film (33) of insulating plastics material with a circuit pattern (31) of electro-conductive or electro-resistive, heat-resistant synthetic resin applied to at least one face (32); supporting a face of the carrier; forming a carrier into a given three-dimensional shape; and, moulding, by the application of heat and pressure in a mould cavity (38), a substrate (34) of insulating plastics material against the unsupported face of the carrier; so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.

METHOD OF MANUFACTURING ELECTROLUMINESCENT DISPLAY DEVICES

Firing process for forming a multilayer glass-metal module

A process for forming a glass interconnection package for semiconductor chips including the steps of depositing a first layer of glass material on a supporting substrate and then heating the layer in a first gaseous ambient which is soluble in the glass material. Immediately thereafter, the first gaseous ambient is replaced by a second gaseous ambient which is insoluble in the glass material and the glass layer is heated and then cooled down to ambient atmosphere.

METHOD FOR MANUFACTURING TAPE WIRING BOARD

A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Method for manufacturing multilayer ceramic substrates

A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed by dividing a sintered multilayer mother substrate, and in addition, external terminal electrodes in a preferable state can be efficiently formed. When a green composite laminate comprising shrinkage suppression layers and a green multilayer mother substrate provided therebetween is formed, through-holes are provided on dividing lines so as to divide conductors, and in addition, cut-in grooves are provided along the dividing lines. After the shrinkage suppression layers are removed from the fired composite laminate, the multilayer ceramic substrates are obtained by dividing the multilayer mother substrate along the through-holes and the cut-in grooves. Conductors, which are formed into the external terminal electrodes, are exposed on parts of side surfaces of the multilayer ceramic substrate corresponding ...

ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

A semiconductor device is of a PoP structure such that first electrode portions provided in a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. The first electrode has a first conductor having the same thickness as that of a wiring layer provided in an insulating layer, a second conductor formed on the first conductor, a gold plating layer provided on the second conductor.

METHODE ZUR HERSTELLUNG VON MULTIFUNKTIONELLEN MIKROWELLEN-MODULEN AUS FLUOROPOLYMER KOMPOSITSUBSTRATEN

Electronic sound generating device

ELECTRONIC SOUND GENERATING DEVICE

A device for electronically generating a sound includes an integrated circuit chip 4 producing electronic signals corresponding to a desired melody, a switch 6 controlling the ON and OFF states of the integrated circuit chip 4, a battery 5 powering the integrated circuit chip 4, and a sound generator 3 having a dish-shaped vibrating plate 16 for producing sounds responsive to the electronic signals. A circuit pattern section 2 has a plurality of lead portions 10 interconnecting the integrated circuit chip 4, the switch 6, the battery 5 and the sound generator 3. The circuit pattern section 2 is formed by punching a conductive metal sheet (7, Fig. 4 not shown) in a press. Selected ones of the lead portions 10 can advantageously be formed by punching into a battery holder 13 or the switch 6. ...

Method for forming an electrical conductive pattern on a substrate

FORMING A GLASS LAYER ON A SUBSTRATE

... 1366602 Coating with glass INTERNATIONAL BUSINESS MACHINES CORP 28 July 1972 [27 Aug 1971] 35353/72 Heading C1M [Also in Division H1] A method of producing a glass layer on a ceramic substrate comprises depositing a glass slurry on the substrate and firing the structure in a first gaseous atmosphere which is soluble in the glass, and a second atmosphere which is less soluble in the glass. The first atmosphere may be hydrogen, the second, nitrogen or argon. The firing preferably takes place at the glass sintering temperature and results in a bubble free layer. The glass may be used as insulation layers between interconnection levels in a printed circuit. The substrate used is alumina with a metallizing layer and the glass is chosen to have a lower coefficient of thermal expansion than the ceramic. Specification 1,366,601 is referred to.

METHOD FOR THE PRODUCTION FROM MULTI-FUNCTIONAL MICROWAVE MODULES FLUOROPOLYMER KOMPOSITSUBSTRATEN

PROCEDURE FOR THE PRODUCTION OF AN ACTIVE ELECTRODE USING FLEXIBLE CIRCUIT TECHNOLOGY AND FLEXIBLE CIRCUIT COMPREHENSIVE SUCH AN ELECTRODE

MANUFACTURING METHOD FOR ELECTRICAL CIRCUIT BOARD

FLUXING UNDERFILL COMPOSITIONS

IMPROVED TEMPERATURE CONTROL

A method and apparatus are disclosed for controlling temperature of a plant comprising plural temperature control zones, wherein an effective control parameter for a first zone for which a signal representing measured temperature is available is produced according to an algorithm relating measured temperature, a desired temperature and a control parameter associated with a device affecting temperature in the first temperature control zone, the effective control parameter is summed with an offset value representing a proportional offset of the effective control parameter of a second temperature control zone relative to the effective control parameter of the first temperature control zone and the result is applied to control a device affecting temperature in the second temperature control zone. Advantageously, the offset value comprises a fixed amount and a variable amount, the variable amount accounting for dynamic differences in temperature control characteristics of the first and second ...

CONTROL SYSTEM FOR UTILIZING ACTIVE MATERIAL ELEMENTS IN A MOLDING SYSTEM

Method and apparatus for controlling an injection molding machine having a first surface and a second surface includes a piezo-ceramic sensor configured to be disposed between the first surface and a second surface. The piezo- ceramic sensor is configured to sense a force between the first surface and the second surface, and to generate corresponding sense signals. Wiring structure is coupled to the piezo-ceramic sensor and is configured to carry the sense signals. Preferably, a piezo-ceramic actuator is also disposed between the first surface and a second surface, and is configured to provide an expansive force between the first surface and a second surface in accordance with the sense signals.

Composite substrate, module, and method of producing composite substrate

Provided are a composite substrate, a module comprising the composite substrate, and a method of producing the composite substrate, that are capable of dispersing the stress applied to external connecting terminals by dropping, and that can sufficiently ensure the connection strength of a ceramic substrate and the external connecting terminals. The composite substrate according to the present invention comprises: the ceramic substrate (1), at least one side of which has circuit wiringfor mounting an electronic component (2) formed thereon; the plurality of external connecting terminals (3) that are formed on one side of the ceramic substrate (1); and a resin layer (5) that is formed on the one side of the ceramic substrate (1). The external connecting terminals (3) are of a shape such that the cross-sectional area becomes smaller the further away from the one surface of the ceramic substrate (1), and a portion or all of the terminal surface that is on the opposite side of the terminal surface ...

Semiconductor light-emitting element module, semiconductor light-emitting element module mounting module and manufacturing method of semiconductor light-emitting element module

The application relates to a semiconductor light-emitting element module, a semiconductor light-emitting element module mounting module and a manufacturing method of semiconductor light-emitting element module. The semiconductor light-emitting element mounting module includes a metal conductor plate including at least one connection surface formed on one side thereof, wherein a semiconductor light-emitting element is connectable to the connection surface; a pair of terminals provided away from the connection surface and which are connectable to the connection surface to be electrically conductive therewith; a surface-insulation portion formed from a resin material, wherein the surface-insulation portion covers the entire surface of the metal conductor plate except for the connection surface. The pair of terminals is connectable with a corresponding pair of terminals that are provided on another semiconductor light-emitting element mounting module.

MANUFACTURING METHOD OF MULTILAYER CERAMIC SUBSTRATE

PURPOSE: To smoothly carry out a division process for obtaining a plurality of multilayer ceramic substrates from a sintered multilayer aggregate substrate, and at the same time, to efficiently form an external terminal electrode in an improved state, when adopting both of a non-contraction process and multiple machining for manufacturing the multilayer ceramic substrates. CONSTITUTION: The manufacture of a raw composite laminate 11, having a raw multilayer aggregate substrate 15 and a contraction suppression layer 19, arranged so that the raw multilayer aggregate layer 15 is sandwiched, a through-hole 22 is provided on a division line so that a conductor 18 is divided; and at the same time a notching groove 23 is provided along the division line. On the side of the multilayer ceramic substrate obtained by dividing the multilayer aggregate substrate 15 along the through-hole 22 and the notching groove 23, after the contraction suppression layer 19 is removed after sintering, one portion ...

Multi-layer wiring board

Substrate structure with capacitance component embedded therein and method for fabricating the same

A substrate structure with a capacitance component embedded therein comprises a substrate with the first and the second surfaces, and an opening penetrates through the first and the second surfaces. A capacitance component whose surface is roughness processed is received in the opening of substrate, and the at least one surface of capacitance component with a plurality of opposite electrode pads. The first and the second dielectric layers are formed on the surface of substrate and the surface of the capacitance component respectively and the capacitance component is immobilized in the opening of substrate. The first and the second dielectric layers have a plurality of opening to expose the electrode pads of the capacitance component. A circuit layer is formed on the surface of the first and second dielectric layers, and a conductive structure is formed in the opening of the first and second dielectric layers for electrically connecting the circuit layer to the electrode pads of capacitance ...

Tamper-proof structures for protecting electronic modules

A tamper-proof structure for protecting an electronic module, comprising a pattern of signal lines having a highly unpredictable layout, which is an approximation of a space-filling curve obtained by the replication of at least one elementary space element having an inscribed base curve inscribed therein. The base curve is adapted, by replication of the elementary space element, to generate an approximation of an at least two-dimensional space-filling curve, the replication being such that an end of the base curve in one elementary space element is connected to the end of the base curve in another, adjacent elementary space element of the replication.

PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE PATTERN, AND CONDUCTIVE FILM SUBSTRATE

A photosensitive conductive film 10 according to the invention includes a support film 1, a conductive layer 2 containing conductive fiber formed on the support film 1, and a photosensitive resin layer 3 formed on the conductive layer 2.

Manufacturing process for smaller active areas in flat panel X-ray detectors

The present invention relates to a method for forming an active area or flat panel in an X-ray detector device. The method comprises forming at least one flat form factor panel in a first size on a substrate of a second size and extending at least one contact of the at least one flat form factor panel. The method further comprises trimming the substrate to the first size forming the at least one flat panel.

Method for manufacturing tape wiring board

A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Dielectric laminated device including a buried electric conductive member to form a strip line and its method of manufacture

By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.

Меthоd fоr fоrming а сirсuit bоаrd viа struсturе fоr high spееd signаling

А mеthоd fоr fоrming а viа in а printеd сirсuit bоаrd is disсlоsеd, whiсh viа аllоws fоr thе pаssаgе оf а signаl frоm оnе signаl plаnе tо аnоthеr in thе (РСВ), аnd in sо dоing trаnsgrеssеs thе pоwеr аnd grоund plаnеs bеtwееn thе signаl plаnеs. Тhе mеthоd соmprisеs fоrming а first соnduсtivе lауеr оn а first sidе оf а сirсuit bоаrd, аnd fоrming а sесоnd соnduсtivе lауеr оn а sесоnd sidе оf thе сirсuit bоаrd; fоrming а first hоlе in thе first sidе оf thе сirсuit bоаrd; fоrming а first суlindеr оn vеrtiсаl еdgеs оf thе first hоlе аnd in соntасt with thе first соnduсtivе lауеr; fоrming а sесоnd hоlе in thе sесоnd sidе оf thе сirсuit bоаrd; fоrming а sесоnd суlindеr оn vеrtiсаl еdgеs оf thе first hоlе, whеrеin thе sесоnd суlindеr is surrоundеd bу first суlindеr аnd in соntасt with thе sесоnd соnduсtivе lауеr; аnd fоrming а viа in thе сirсuit bоаrd, whеrеin thе viа is surrоundеd bу thе sесоnd суlindеr.

Resistor storage cavity in plug of sensing edge

A sensing edge (10) for providing a signal to a controller indicating that a forward edge of a door (9) is obstructed during operation includes an elongated sheath (12) and first and second end plugs (14,15). The elongated sheath (12) is mounted to the forward door edge and has a first end (16), second end (18) and first cavity connecting the ends. First and second spaced apart electrically conductive materials (100,102) are disposed within the elongated sheath. The first end plug (14) includes an inner end having first engaging structures positioned within the first cavity in an assembled configuration and an outer end having a first depression (92) for housing an electronic component (84). The electronic component is electrically coupled to the electrically conductive materials (100,102). The second end plug includes an inner end having a sensing component and second engaging structures positioned within the first cavity in an assembled configuration. The sensing component is electrically ...

Circuit board with an injection-moulded substrate

Forming solder balls on contacts

A method of forming a solder ball 90 on a portion, e.g., one end, of a contact 80 is provided. In one embodiment, the contact 80 is a terminal pin which is intended for use in an electrical connector and more particularly, for use in a solder ball grid array (SBGA) connector. The method includes providing the contact 80 along with a solder-holding clip 18 having a body 20 with an opening 21. The body 20 has a solder-holding conformation 32 adjacent the opening 21 and a solder mass 30 is held by the conformation 32. The contact 80 is then positioned proximate to the body opening 21 and heat is applied to the solder mass 30 causing the solder to reflow so that the solder flows into a spherical shape. This results in a solder ball 90 being formed on the portion of the contact 80 (fig 24). Subsequent to forming the solder ball, the solder-holding clip 18 is separated from the contact 80 leaving a contact 80 with a solder ball 90 affixed thereto. Preferably, a series of solder-holding clips ...

Improvements in electrical conductors and assembly thereof

In a printed circuit (see Group XXXVI) copper powder is sintered to copper foil to form a key. Specification 725,115 is referred to.

METHODS OF MAKING ELECTRICAL CONNECTIONS

PRODUCTION OF PRINTED CIRCUITS.

PROCEDURE FOR THE PRODUCTION OF PRINTED PRINTED CIRCUIT BOARDS.

CONTROL SYSTEM FOR UTILIZING ACTIVE MATERIAL ELEMENTS IN A MOLDING SYSTEM

Disclosed herein is a control apparatus (106 or 206) for an injection molding machine, the injection molding machine having a first surface and a second surface. The control apparatus (106 or 206) includes a computer processor (209) configured to initiate an actuation signal to be transmitted, over a transmission structure (108B or 211), to an active material element (105 or 205). The active material element (105 or 205) is configured to generate a corresponding force responsive to the active material element (105 or 205) receiving the actuation signal. The corresponding force configured to urge the first surface and the second surface to interact with each other.

ELECTRICAL CONNECTING OF SURFACE CONDUCTIVE LAYERS

A method of making electrical connections between metal foils laminated to opposing surfaces of a flexible insulating layer, such as may be configured with spiral patterns in the respective metal foils to form inductivecapacitive circuits useful as detectable markers in RF antipilferage systems, and wherein an electrical connection is provided between the opposing foils by first extruding the laminate to shear the insulating layer and to contact the opposing metal foils in the vicinity of the sheared insulator layer and by subsequently forcing the extrusion back into a substantially planar relationship relative to the remainder of the laminate.

PRINTED CIRCUIT BOARD HAVING AN INJECTION MOLDED SUBSTRATE

A printed circuit board includes an injected molded substrate having a pattern recessed in the substrate surface of interconnects, through-connections and contact surfaces. A trenchshaped depression is provided in the substrate surface in the region of each interconnect, and a planar depression is provided in the substrate's surface in at least one of (a) the region of each through-connection and (b) the region of each contact surface. The pattern of recesses is covered with a conductive metal coat, and the depth of each planar depression is greater than the depth of each trench-shaped depression, so that the metal coat fills the trench-shaped depressions to the surface of the substrate, while in the planar depressions a distance remains between the metal coat and the surface of the substrate. A solder stop lacquer can then be applied such as by roller coating, without the necessity of photo-structuring and without filling the planar depressions.

Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate

The invention relates to a photosensitive conductive film, a method for forming a conductive film, a method for forming a conductive pattern, and a conductive film substrate. The photosensitive conductive film is characterized by comprising a supporting film, a conductive layer which is arranged on the supporting film and contains a conductive fiber, and a photosensitive resin layer arranged on the conductive layer.

PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE PATTERN, AND CONDUCTIVE FILM SUBSTRATE

Method of manufacturing conduction wire in touch panel

A method of manufacturing conduction wire in the touch panel is disclosed in the present invention. The touch panel is formed after sealing the aligning frame of two conductive substrates, in which there is a gap between the two conductive substrates after sealing the aligning frame. The conduction wire in the touch panel is fabricated on two faces of two conductive substrates opposite to each other. The invented method at least includes the following procedures: forming the first conductive layer on the conductive substrate; forming the first photoresist layer on the first conductive layer; removing part of the first photoresist layer to define the first conductive layout pattern region on the first conductive layer; using the remained part of the first photoresist layer as a mask to remove part of the first conductive layer until part of the conductive substrate is exposed; and removing the first photoresist layer.

Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages

The invention encompasses methods of preparing interposers for utilization in semiconductor packages. The invention includes a method in which an interposer substrate having a surface and a conductive layer extending over the surface is provided. Pads are formed on the conductive layer by plating a conductive material on the conductive layer while using the conductive layer as an electrical connection to a power source and without utilizing conductive busses, other than the conductive layer. Subsequent to the formation of the pads, the conductive layer is patterned into circuit traces. Methodology of the present invention can be utilized for, for example, forming board-on-chip constructions.

Hot pressing dense ceramic sheets for electronic substrates and for multilayer electronic substrates

Dense ceramic sheets suitable for electronic substrates are prepared by hot pressing ceramic green sheets containing ceramic powder and organic binders which leave no undesirable residue upon pyrolysis in the absence of oxygen. Boron nitride sheets made of boron nitride powder in a similar binder are placed on each side of the ceramic green sheet to form a composite. After hot pressing the composite so as to remove the binder and densify the ceramic, the BN layers are removed.

SYSTEM FOR MAKING A CONDUCTIVE CIRCUIT ON A SUBSTANTIALLY NON-CONDUCTIVE SUBSTRATE

A method for forming a conductive circuit on a substantially non-conductive substrate includes indenting a major surface of a substrate with a plurality of features, plating the major surface and the indentations formed with a conductive layer, and removing a portion of the conductive layer leaving at least one of the plurality of the indentations filled with conductive material separated from at least one other of the plurality of the indentations filled with conductive material separated by non-conductive material. An electrical device formed includes a sheet of insulative material having grooves therein. The sheet of insulative material has a first planar surface, and a second planar surface. A conductive material is positioned within the grooves. The conductive material within the grooves forms electrical traces in the electrical device. The conductive material within the grooves fills the groove and includes a surface coplanar with at least one of the first planar surface or the second ...

Temperature control

A method and apparatus are disclosed for controlling temperature of a plant comprising plural temperature control zones, wherein an effective control parameter for a first zone for which a signal representing measured temperature is available is produced according to an algorithm relating measured temperature, a desired temperature and a control parameter associated with a device affecting temperature in the first temperature control zone, the effective control parameter is summed with an offset value representing a proportional offset of the effective control parameter of a second temperature control zone relative to the effective control parameter of the first temperature control zone and the result is applied to control a device affecting temperature in the second temperature control zone. Advantageously, the offset value comprises a fixed amount and a variable amount, the variable amount accounting for dynamic differences in temperature control characteristics of the first and second ...

Wiring board, semiconductor apparatus and method of manufacturing them

There are provided steps of providing a dielectric layer and a wiring layer on a surface of a support to form an intermediate body, removing the support from the intermediate body to obtain a wiring board, and carrying out a roughening treatment over a surface of the support before the intermediate body forming step.

METHOD OF FORMING A CONDUCTIVE PATTERN

MANUFACTURE OF ELECTRICAL CIRCUITS

СПОСОБ ИЗГОТОВЛЕНИЯ КАТУШКИ ИНДУКТИВНОСТИ ТРАНСПОНДЕРА И ТРАНСПОНДЕР, ИЗГОТОВЛЕННЫЙ ЭТИМ СПОСОБОМ

Изобретение относится к области электротехники и может быть использовано, например, в технологии изготовления плат с интегральными схемами. Сущность изобретения состоит в следующем. Способ изготовления катушки индуктивности для транспондера 20, включающий следующие этапы: разделение различных витков 8 катушки индуктивности в многослойном листе, включающем по меньшей мере один проводящий слой 2, посредством штамповки указанного проводящего слоя с помощью пуансона штампа, позволяющего прорезать разрезы 7, разделяющие указанные витки, подсоединение по меньшей мере одного электронного компонента к указанным виткам 8. Согласно изобретению указанный проводящий слой 2 перед штамповкой покрывают поверхностной пленкой 3, предназначенной для облегчения штамповки, и вводят в указанные разрезы 7 по меньшей мере один изолирующий материал 9 для обеспечения электрической изоляции различных проводящих дорожек. Изобретение также предусматривает выполнение транспондера, изготовленного данным способом, а ...

VERFAHREN ZUR HERSTELLUNG EINER AKTIVEN ELEKTRODE UNTER VERWENDUNG VON FLEXIBLER SCHALTUNGSTECHNOLOGIE UND FLEXIBLE SCHALTUNG UMFASSEND EINE SOLCHE ELEKTRODE

Lottragende Kontakte und Herstellungsverfahren dafür sowie Verwendung in einem Lotkugelgittermatrix-Verbinder

Vorrichtung zur Bildung einer Lotkugel an einem Kontakt, mit einem Kontaktträger und einer Lothalteklemme mit einem eine Öffnung aufweisenden Körper, einer neben der Öffnung positionierten Lothalteausbildung und eine dadurch positionierte Lotmasse, dadurch gekennzeichnet, dass die Lothalteklemme (370) und der Kontaktträger (360) als ein einziges integrales Glied ausgebildet sind und die Lothalteklemme (370) aus einem nicht benahbaren Material hergestellt ist.

Control system for utilizing active material elements in a molding system

Method for making a transponder coil and transponder produced by said method

Micromachine switch and its production method

Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate

The invention relates to a photosensitive conductive film, a method for forming a conductive film, a method for forming a conductive pattern, and a conductive film substrate. A photosensitive conductive film is provided with a supporting film, a conductive layer which is arranged on the supporting film and contains a conductive fiber, and a photosensitive resin layer arranged on the conductive layer.

Manufacturing method of multilayer circuit board

The invention provides a manufacturing method of a multilayer circuit board, which includes: providing a circuit substrate comprising a base and a circuit layer, wherein the circuit layer is provided with an assembly area and a lamination area; forming a first solder mask layer in the assembly area; enabling a protective rubber sheet to be attached to the first solder mask layer; enabling a first copper foil and a first adhesive sheet with a first opening to be laminated on the circuit substrate, and leading the protective rubber sheet to be located in the first opening; enabling the first copper foil to form a first circuit graph with a first window corresponding to the protective rubber sheet, leading a second adhesive sheet and a second copper foil to be laminated on the first circuit graph; enabling the second copper foil to form a second circuit graph with a second window corresponding to the boundary of the protective rubber sheet; forming a second solder mask layer on the second ...

Method for mfg. multilayer ceramic plate

Appareil générateur acoustique électronique et son procédé de fabrication.

L'invention concerne un appareil générateur acoustique électronique. Elle se rapporte à un appareil dans lequel une pastille de circuit intégré (4) créant des signaux électroniques, coopérant avec un interrupteur (6) et une pile ou batterie d'alimentation (5), alimente un générateur acoustique (16). Selon l'invention, une pièce découpée (2) formant le dessin du circuit comporte plusieurs parties de connexion des différents éléments, cette pièce découpée étant formée par poinçonnage d'une feuille d'un métal conducteur porté par une plaque de renforcement (17). Application à la fabrication des boîtes à musique.

METAL CONTAINING RESIN PARTICLE, RESIN PARTICLE, ELECTRONIC CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT

MULTIPLE RESIN-LAYERED SUBSTRATE AND METHOD OF MANUFACTURE OF MULTIPLE RESIN-LAYERED SUBSTRATE

Wiring board and manufacturing method for same

Disclosed is a wiring board having high connection reliability. The wiring board is provided with: an insulating substrate (30); wiring patterns (51-57) formed on one main surface of the insulating substrate (30); vias (11V, 12V) which pass from one main surface side of the insulating substrate (30) through to the other main surface side and which conduct along the wiring patterns (51-57). The vias (11V, 12V) have connection bases (111V, 121V) which curve along the wiring patterns (51-57), and cone sections (113V, 123V) of which the outer diameter becomes thinner approaching top sections (112V, 122V) of the vias (11V, 12V) from the connection bases (111V, 121V).

PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD

At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.

METHOD FOR THE PRODUCTION OF A CERAMIC MULTILAYER CIRCUIT ARRANGEMENT, AND MULTILAYER CIRCUIT ARRANGEMENT PRODUCED USING SAID METHOD

A method for producing a ceramic multilayer circuit system, and a corresponding multilayer circuit system are provided. An embodiment of the method includes sequential deposition of a plurality of circuit layers of the multilayer circuit system on a substrate using a powder spray method; pressing of the deposited plurality of circuit layers; and thermal sintering of the pressed plurality of circuit layers. The individual circuit layers have electrically conductive areas made of at least one conductive material and electrically insulating areas made of at least one ceramic material.

Dielectric laminated device including a buried electric conductive member to form a strip line and its method of manufacture

By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.

Lightning arrester

A lightning arrester comprises a non-linear resistor as a lightning arrester element and an insulator holding the non-linear resistor in one body without a gap to prevent deterioration of the non-linear resistor caused by moisture.

LINER WITH ELECTRICAL PATHWAYS

A liner for an appliance is formed by a plastic sheet formed into a three dimensional shape corresponding to at least a portion of a compartment of the appliance. A plurality of electrically conductive ink pathways are applied on a surface of the plastic sheet, and a sealer material is applied to the plastic sheet to cover said pathways.

Меthоd fоr fоrming а сirсuit bоаrd viа struсturе fоr high spееd signаling

А mеthоd fоr fоrming а viа in а printеd сirсuit bоаrd is disсlоsеd, whiсh viа аllоws fоr thе pаssаgе оf а signаl frоm оnе signаl plаnе tо аnоthеr in thе (РСВ), аnd in sо dоing trаnsgrеssеs thе pоwеr аnd grоund plаnеs bеtwееn thе signаl plаnеs. Тhе mеthоd соmprisеs fоrming а first соnduсtivе lауеr оn а first sidе оf а сirсuit bоаrd, аnd fоrming а sесоnd соnduсtivе lауеr оn а sесоnd sidе оf thе сirсuit bоаrd; fоrming а first hоlе in thе first sidе оf thе сirсuit bоаrd; fоrming а first суlindеr оn vеrtiсаl еdgеs оf thе first hоlе аnd in соntасt with thе first соnduсtivе lауеr; fоrming а sесоnd hоlе in thе sесоnd sidе оf thе сirсuit bоаrd; fоrming а sесоnd суlindеr оn vеrtiсаl еdgеs оf thе first hоlе, whеrеin thе sесоnd суlindеr is surrоundеd bу first суlindеr аnd in соntасt with thе sесоnd соnduсtivе lауеr; аnd fоrming а viа in thе сirсuit bоаrd, whеrеin thе viа is surrоundеd bу thе sесоnd суlindеr.

Меthоd fоr fоrming а сirсuit bоаrd viа struсturе fоr high spееd signаling

А mеthоd fоr fоrming а viа in а printеd сirсuit bоаrd is disсlоsеd, whiсh viа аllоws fоr thе pаssаgе оf а signаl frоm оnе signаl plаnе tо аnоthеr in thе (РСВ), аnd in sо dоing trаnsgrеssеs thе pоwеr аnd grоund plаnеs bеtwееn thе signаl plаnеs. Тhе mеthоd соmprisеs fоrming а first соnduсtivе lауеr оn а first sidе оf а сirсuit bоаrd, аnd fоrming а sесоnd соnduсtivе lауеr оn а sесоnd sidе оf thе сirсuit bоаrd; fоrming а first hоlе in thе first sidе оf thе сirсuit bоаrd; fоrming а first суlindеr оn vеrtiсаl еdgеs оf thе first hоlе аnd in соntасt with thе first соnduсtivе lауеr; fоrming а sесоnd hоlе in thе sесоnd sidе оf thе сirсuit bоаrd; fоrming а sесоnd суlindеr оn vеrtiсаl еdgеs оf thе first hоlе, whеrеin thе sесоnd суlindеr is surrоundеd bу first суlindеr аnd in соntасt with thе sесоnd соnduсtivе lауеr; аnd fоrming а viа in thе сirсuit bоаrd, whеrеin thе viа is surrоundеd bу thе sесоnd суlindеr.

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

Wiring board and method for manufacturing the same

A wiring board including a first insulation layer, a conductive pattern formed on the first insulation layer, a second insulation layer formed on the conductive pattern and the first insulation layer and having an opening portion exposing at least a portion of the conductive pattern, and a connection conductor formed in the opening portion of the second insulation layer such that the connection conductor is positioned on the portion of the conductive pattern. The connection conductor has a tip portion which protrudes from a surface of the second insulation layer and which has a tapered side surface tapering toward an end of the tip portion.

Split wave compensation for open stubs

In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Singulated semiconductor device separable electrical interconnect

A socket assembly that forms a solderless electrical interconnection between terminals on a singulated integrated circuit device and another circuit member. The socket housing has an opening adapted to receive the singulated integrated circuit device. The compliant printed circuit is positioned relative to the socket housing to electrically couple with the terminals on a singulated integrated circuit device located in the opening. The compliant printed circuit includes a dielectric base layer printed onto a surface of a fixture, while leaving cavities in the surface of the fixture exposed. A plurality of contact members are formed in the plurality of cavities in the fixture and coupled to the dielectric base layer. The contact members are exposed wherein the compliant printed circuit is removed from the fixture. At least one dielectric layer with recesses corresponding to a target circuit geometry is printed on the dielectric base layer. A conductive material is deposited in at least a portion of the recesses to form conductive traces electrically coupling the contact members to the other circuit member.

Method of fabricating a stimulation lead for delivering electrical pulses to tissue of a patient

In one embodiment, a method of fabricating stimulation leads, the method comprises: providing a spool of polymer film; providing a plurality of payout carriers of wires; drawing the polymer film from the spool and the wires from the plurality of payout carriers over a rotating drum, wherein the drum comprises a plurality of grooves over an outer circumferential surface of the drum for directing the wires from the plurality of payout carriers, wherein a distance of each groove from an edge of the drum is varied about the circumference of the drum; bonding the wires to the polymer film while performing the drawing to form an intermediate assembly comprising the polymer film as a carrier with the bonded wires in a repeating pattern along a length of the intermediate assembly.

Package substrate unit and method for manufacturing package substrate unit

A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative material and the first conductive circuit, forming on a surface of the second resin insulative material a first concave portion to be filled with a conductive material for formation of a second conductive circuit, forming on the surface of the second resin insulative material a pattern having a second concave portion and post portions to be filled with the conductive material for formation of a plane conductor, and filling the conductive material in the first concave portion and the second concave portion such that the second conductive circuit and the plane conductor are formed.

Multi-layered substrate

The present invention directs to double-sided multi-layered substrate a base, at least a through-hole passing through the base, patterned first and second metal layers formed on the two opposite surfaces of the base, and first and second plating layers. The first plating layer covers a sidewall of the through-hole and the bottom surface surrounding a bottom opening of the through hole. The second plating layer covers the first plating layer and the top surface surrounding a top opening of the through hole.

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

Resistor storage cavity in plug of sensing edge

A sensing edge for providing a signal to a controller indicating that a forward edge of a door is obstructed during operation includes an elongated sheath and first and second end plugs. The elongated sheath is mounted to the forward door edge and has a first end, second end and first cavity connecting the ends. First and second spaced apart electrically conductive materials are disposed within the elongated sheath. The first end plug includes an inner end having first engaging structures positioned within the first cavity in an assembled configuration and an outer end having a first depression for housing an electronic component. The electronic component is electrically coupled to the electrically conductive materials. The second end plug includes an inner end having a sensing component and second engaging structures positioned within the first cavity in an assembled configuration. The sensing component is electrically coupled to the electrically conductive materials.

Method for Producing an Electrical Circuit and Electrical Circuit

A method for producing an electrical circuit includes providing a main printed circuit board having a plurality of metalized plated-through holes through the main printed circuit board along at least one separating line between adjacent printed circuit board regions of the main printed circuit board. Each printed circuit board region has electrical contact connection pads on at least the main surface of the printed circuit board region that is to be populated, electrical lines for connection between the plurality of plated-through holes and the contact connection pads, and at least one semiconductor chip electrically contact-connected by means of the contact connection pads. The main printed circuit board is covered with a potting compound across the printed circuit board regions with the semiconductor chips.

Forming Heaters for Phase Change Memories

A heater for a phase change memory may be formed by depositing a first material into a trench such that the material is thicker on the side wall than on the bottom of the trench. In one embodiment, because the trench side walls are of a different material than the bottom, differential deposition occurs. Then a heater material is deposited thereover. The heater material may react with the first material at the bottom of the trench to make Ohmic contact with an underlying metal layer. As a result, a vertical heater may be formed which is capable of making a small area contact with an overlying chalcogenide material.

Multilayered printed circuit board and manufacturing method thereof

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Implantable medical device with swappable headers

An implantable electrical medical device system includes a device body portion having a plurality of contacts operably coupled to discrete channels of electronics. One or more swappable headers may be attached to the device body portion by an end user, such as an implanting physician, to operably couple internal lead receptacle contacts in the header to the contacts of the device body portion. The swappable headers may have lead receptacles configured to receive differing types or combinations of leads, allowing an end user to select one or more appropriate headers as desired.

Through wafer vias with dishing correction methods

Methods of forming through wafer vias (TWVs) and standard contacts in two separate processes to prevent copper first metal layer puddling and shorts are presented. In one embodiment, a method may include forming a TWV into a substrate and a first dielectric layer over the substrate; forming a second dielectric layer over the substrate and the TWV; forming, through the second dielectric layer, at least one contact to the TWV and at least one contact to other structures over the substrate; and forming a first metal wiring layer over the second dielectric layer, the first metal wiring layer contacting at least one of the contacts.

Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate

A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.

Multilayer printed wiring boards with holes requiring copper wrap plate

Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

Deflectable catheter constructed to inhibit component migration

A catheter includes a shaft having at least one lumen. The lumen comprises a longitudinally-extending trough defined by a longitudinally-extending recess, within which a component is disposed, and a longitudinally extending open edge. The lumen further comprises a longitudinally-extending channel defined by a longitudinally-extending cavity and by the open edge of the trough. A planarity wire is disposed within the cavity and is configured to close the open edge of the trough to within a pre-defined tolerance that is less than the size of the component to retain the component in the recess.

Bond package and approach therefor

Lead-free or substantially lead-free structures and related methods are implemented for manufacturing electronic circuits. In accordance with various example embodiments, circuit components are joined using a copper-tin (Cu—Sn) alloy, which is melted and used to form a Cu—Sn compound having a higher melting point than the Cu—Sn alloy and both physically and electrically coupling circuit components together.

Implantable pulse generator feedthrus and methods of manufacture

Disclosed herein is an implantable pulse generator feedthru configured to make generally planar electrical contact with an electrical component housed within a can of an implantable pulse generator. The feedthru may include a feedthru housing including a header side and a can side, a core within the feedthru housing, a generally planar electrically conductive interface adjacent the can side, and a feedthru wire extending through the core. The feedthru wire may include an interface end and a header end, wherein the header end extends from the header side and the interface end is at least one of generally flush with the generally planar interface and generally recessed relative to the generally planar interface.

Printed circuit board

A printed circuit board having an insulating layer; circuit patterns formed on both surfaces of the insulating layer in order to be embedded in the insulating layer; and a bump formed to pass through the insulating layer in order to electrically connect the circuit patterns formed on both surfaces of the insulating layer.

Double-sided circuit board and manufacturing method thereof

A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R 1 on the first surface of the substrate, a second hole having a second opening with a diameter R 2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R 1 and R 2.

Method for connecting two objects electrically

A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a lower surface of the substrate. Further, a droplet of an electroconductive liquid is made to land on the recess, and the liquid is filled in the through hole via the groove. Next, the liquid filled in the groove, the recess, and the through hole is heated to harden. Further, the recess and the groove of the substrate are removed by cutting up to an area near the through hole. Accordingly, it is possible to connect electrically the connecting bodies arranged on both surfaces of the substrate by filling an electroconductive material in the through holes easily.

Charging and Communication System for a Battery-Powered Microstimulator

A system and method are provided for both recharging and communicating with a stimulator having a rechargeable battery, which stimulator is implanted deeply in the body, in particular where the stimulator is a microstimulator, the system includes a base station and an external device, for instance a chair pad. The chair pad may contain an antenna/charging coil and a booster coil. The antenna/charging coil can be used for charging the rechargeable battery and also for communicating with the stimulator using frequency shift keying and on-off keying. The booster coil can be used to recharge a battery depleted to zero volts. The base station connected to the chair pad may be used to power the antenna/charging coil and the booster coil.

Method for manufacturing wiring board

There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

Multi-plate board embedded capacitor and methods for fabricating the same

A printed wiring board (PWB) including one or more embedded capacitors. The PWB defines a planar area and includes a plurality of first conductive plates that are substantially parallel to the planar area and extend from a first normal axis towards a second normal axis. The first normal axis and the second normal axis extend substantially perpendicularly through the planar area. The PWB also includes one or more second conductive plates that are substantially parallel to the planar area and extend from the second normal axis towards the first normal axis. The second conductive plates are positioned between the first conductive plates. A non-conductive material is positioned between the first and second conductive plates. At least one first conductive via extends substantially collinear with the first normal axis in contact with the first conductive plates. A plurality of second conductive vias extends substantially collinear with the second normal axis in contact with the second conductive plate.

Fabrication method of substrate

A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

Method of manufacturing in-plane switching mode liquid crystal display

Provided is a method for manufacturing an in-plane switching mode liquid crystal display, which can prevent the problem of bubble generation caused by an Ag dot during the attachment process of a liquid crystal panel and a cover substrate, and improve the yield of an Ag dot process. A method for manufacturing an in-plane switching mode liquid crystal display according to an embodiment of the present invention may comprise: forming a liquid crystal panel by interposing a liquid crystal layer between a color filter substrate and a TFT array substrate; attaching a polarizer, with a protective film attached thereon, on the color filter substrate; forming an Ag dot to be in contact with an edge of the protective film, the color filter substrate, and the TFT array substrate; removing part of the Ag dot by removing the protective film; and attaching a cover substrate on the color filter substrate.

Buss Bar Strip

A buss bar strip for mounting to a solar panel to electrically connect to a series of electrical lines extending from solar cells. The buss bar strip can include a thin elongate flat flexible strip of insulative material having a longitudinal length. A predetermined pattern of elongate conductors can be longitudinally disposed on the insulative strip in at least two rows along the longitudinal length and electrically isolated from each other. Each conductor can have a predetermined position, length, and spacing from each other on the insulative strip for laterally electrically connecting to selected electrical lines from the solar cells at lateral electrical connection points located along the length of the conductor on exposed surfaces on the conductor.

Printed wiring board and method for manufacturing the same

A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.

Package structure and manufacturing method thereof

A manufacturing method of a package structure is provided. In the manufacturing method, a metal substrate having a seed layer is provided. A patterned circuit layer is formed on a portion of the seed layer. A first patterned dry film layer is formed on the other portion of the seed layer. A surface treatment layer is electroplated on the patterned circuit layer with use of the first patterned dry film layer as an electroplating mask. The first patterned dry film layer is removed. A chip bonding process is performed to electrically connect a chip to the surface treatment layer. An encapsulant is formed on the metal substrate. The encapsulant encapsulates the chip, the surface treatment layer, and the patterned circuit layer. The metal substrate and the seed layer are removed to expose a bottom surface of the encapsulant and a lower surface of the patterned circuit layer.

Circuit board viaholes and method of manufacturing the same

Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate.

Implantable Medical Lead

An implantable medical lead for transmitting electrical pulses to excitable bodily tissue and/or signals detected at bodily tissue to a detection and evaluation unit, including a distal electrode or a distal sensor, or actuator; a proximal electrode connector or sensor/actuator connector; and a lead pole which connects the electrode or the sensor or actuator to the electrode connector or sensor/actuator connector and extends in the lead body, wherein the lead pole comprises at least two separate and individually insulated conductors which are electrically interconnected at least at one point which functions as an interchange point, or reversal point, in the lead extension from the proximal electrode or sensor connector to the distal electrode or the distal sensor, and wherein at least one of the separate conductors, in particular close to the reversal point, is interrupted at least once and/or is not connected at one end.

Method of manufacturing a vibratory actuator for a touch panel with haptic feedback

The disclosure relates to a method of manufacturing vibratory elements, comprising forming on a substrate a multilayer structure by an integrated circuit manufacturing method, the multilayer structure comprising an element susceptible of vibrating when it is subjected to an electrical signal, and electrodes for transmitting an electrical signal to the vibratory element, the vibratory element comprising a mechanical coupling face that is able to transmit to control element vibrations perceptible by a user.

Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application

An interconnect structure including an alloy liner positioned directly between a diffusion barrier and a Cu alloy seed layer as well as methods for forming such an interconnect structure are provided. The alloy liner of the present invention is formed by thermally reacting a previously deposited diffusion barrier metal alloy layer with an overlying Cu alloy seed layer. During the thermal reaction, the metal alloys from the both the diffusion barrier and the Cu alloys seed layer react forming a metal alloy reaction product between the diffusion barrier and the Cu seed layer.

Printed circuit board having micro strip line, printed circuit board having strip line and method of manufacturing thereof

A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.

Printed circuit board having micro strip line, printed circuit board having strip line and method of manufacturing thereof

A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.

Printed circuit board having a non-plated hole with limited drill depth

A printed circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

Feedthrough assembly including a capacitive filter array

A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. In some examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.

Electrified Bird Deterrent Device with Cavity

An animal deterrent device includes an elongated carrier having an internal cavity. A conductive trace can be coupled to the carrier by a first fastener that extends from the conductive trace to the cavity, which prevents water from contacting the fastener and shorting the conductive trace.

Touch panel having a shielding structure and method of manufacturing the same

The present disclosure relates to a touch panel having a shielding structure and a method of manufacturing the same. The touch panel having a shielding structure comprises a conductive ring disposed on periphery of an upper surface of a substrate, a shielding layer disposed on a lower surface of the substrate, and a plurality of conductive connection points electrically connecting the shielding layer and the conductive ring. By connecting the shielding layer and the conductive ring by the conductive connection points, impedance of the shielding layer is consistent for different distances between the shielding layer and flexible printed circuit, thereby eliminating noise interference from a liquid crystal display or an electronic device under the touch panel, while using the touch panel. Moreover, the manufacturing method of the touch panel with a shielding structure is a simple process, which reduces the manufacturing cost.

Stackable electronic component

An embodiment of an electronic component includes a circuit element disposed within a package, which includes a surface and at least one standoff protruding from the surface. For example, where the circuit element is an inductor in a power supply, the standoff may allow one to mount the inductor component over another component, such as a transistor component. Therefore, the layout area of such a power supply may be smaller than the layout area of a power supply in which the inductor and transistor components are mounted side by side.

Package for an Implantable Device

The present invention is an implantable electronic device formed within a biocompatible hermetic package. Preferably the implantable electronic device is used for a visual prosthesis for the restoration of sight in patients with lost or degraded visual function. The package is formed from a thin film of hermetic biocompatible material to minimize the size of the implanted device.

Circuit board contact pads

The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias.

Lightweight electronic system for automotive applications and method

A lightweight audio player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material molded to provide details to accept audio devices, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members define self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.

High strength through-substrate vias

A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.

Printed circuit board and method for manufacturing the same

Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern.

Wind turbine rotor blade having a heating element and a method of making the same

The invention relates to a wind turbine rotor blade having a blade root, a blade tip, two interconnected rotor blade half shells, which include a fiber-reinforced plastics material, and an electrical heating element, which is arranged on an outer side of the rotor blade and has a blade root end and a blade tip end, wherein the blade tip end is connected via an electrical line leading to the blade root and at least a first segment of the electrical line, which is arranged on an inner side of one of the rotor blade half shells, is made of a carbon fiber material. Further, the present invention relates to a method for making a wind turbine rotor blade having an electrical heating element.

External electrical connection for a portable electronic device

A portable electronic device includes: a housing, a processor provided in the housing, a rechargeable power pack provided in the housing in communication with the processor, apertures extending through the housing, insulating portions of the housing being provided between the apertures, a location of the apertures being selected to map out a graphical element, electrical contacts in communication with the battery for charging the battery, the electrical contacts being sized to be received in the apertures and wherein the insulating portions are provided for insulating the electrical contacts from one another.

Printed circuit board and the method for manufacturing the same

Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without performing a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.

Process for making stubless printed circuit boards

A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

Safety electrical outlet and switch system

An electrical box is mounted on a wall stud, and a wiring panel is installed within the electrical box so as to partition the interior of the electrical box into a user inaccessible wiring compartment and a user accessible module compartment. A protective cover is attached to the wiring panel so as to protect the wiring panel during a makeup phase of wall panel installation and painting. After the makeup phase, the protective cover is removed from the wiring panel and a module having a user operable electrical function is mounted to the wiring panel within the user accessible module compartment.

Wiring board and method for manufacturing the same

A wiring board includes a first insulation layer, a second insulation layer formed on the first insulation layer, a wiring structure interposed between the first insulation layer and the second insulation layer and including an insulation layer and conductive patterns formed on the insulation layer, second conductive patterns formed on the second insulation layer, and a via conductor formed through the second insulation layer and connected to one of the second conductive patterns on the second insulation layer.

Stretchable electrical interconnect and method of making same

An electrical interconnect including at least one electrically-conductive fibre configured to form a stretchable interlaced configuration.

Base substrate, electronic device, and method of manufacturing base substrate

Abase substrate includes an insulator board comprising through holes penetrating between two opposed principal surfaces, penetrating electrodes provided within the through holes, and intermediate layers sandwiched between inner surfaces of the through holes and the penetrating electrodes and having surfaces with smaller concavities and convexities than those of the inner surfaces at the penetrating electrode sides.

New printed circuit board and method for manufacturing same

The present invention relates to a laminated body for forming a printed circuit board comprising: a separation member in which first conductive layers and second conductive layers separable from each other are sequentially provided on each of upper and lower surfaces of a separating-insulation member; a laminating-insulation member sequentially laminated on each of the upper and lower surfaces of the separation member; and a conductive layer sequentially laminated on each of upper and lower surfaces of the insulation member, a printed circuit board comprising the laminated body, and a method of manufacturing the same. The present invention provides the new multi-layer printed circuit board to which various designs, such as a double-sided structure or an unbalanced structure, are applicable while overcoming an application limitation of a single-sided printed circuit board structure in the related art, thereby improving productivity and economic feasibility.

Method of fabricating touch panel

A method of fabricating a touch panel is provided. A substrate having a touch-sensing region and a peripheral region is provided. A touch-sensing circuit layer including first sensing series, and second meshed metal sensing pads is formed on the touch-sensing region of the substrate. An insulating layer having first contact windows is formed on the substrate to cover the touch-sensing circuit layer. The first contact windows expose a portion of the second meshed metal sensing pads. A plurality of second transparent bridge lines are formed on the insulating layer located in the touch-sensing region. Each second transparent bridge line is electrically connected to two adjacent second meshed metal sensing pads through two first contact windows. The second transparent bridge lines completely cover the portion of the second meshed metal sensing pads exposed by the first contact windows.

Ultra-thin near-hermetic package based on rainier

A microelectronic package including a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface; a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface; a metallic lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space; and a microelectronic element disposed within the space and electrically connected to the terminals.

Guide wire arrangement, strip arrangement and methods of forming the same

A guide wire arrangement, a strip arrangement, a method of forming a guide wire arrangement, and a method of forming a strip arrangement are provided. The guide wire arrangement includes a strip; a sensor being disposed on a first portion of the strip; a chip being disposed next to the sensor on a second portion of the strip, wherein the second portion of the strip is next to the first portion of the strip; wherein the strip is folded at a folding point between the first portion of the strip and the second portion of the strip such that the first portion of the strip and the second portion of the strip form a stack of strip portions.

Method of fabricating multi-chip stack package structure having inner layer heat-dissipating board

An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.

Package substrate and die spacer layers having a ceramic backbone

A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Wiring board, manufacturing method for wiring board, and image pickup apparatus

A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.

Lightweight audio system for automotive applications and method

A lightweight radio/Audio player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Flexible multilayer substrate

A flexible multilayer substrate includes a multilayer body including a plurality of laminated resin layers. The multilayer body includes an innermost surface, which is a surface on an inner side when the substrate is bent, and an outermost surface, which is a surface on an outer side when the substrate is bent. Each of the plurality of resin layers includes a skin layer on one surface. Lamination of the multilayer body includes a skin layer joint plane at one location at a central portion in the thickness direction, and the skin layer and other surface come in contact with each other at another location along the central portion in the thickness direction. A skin layer joint plane is arranged on a side closer to the innermost surface than a central plane in the thickness direction of the multilayer body.

Wiring substrate, multi-piece wiring substrate, and method for producing same

Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface.

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

A monitoring system for monitoring fluid in a fluid supply vessel during operation including dispensing of fluid from the fluid supply vessel. The monitoring system includes (i) one or more sensors for monitoring a characteristic of the fluid supply vessel or the fluid dispensed therefrom, (ii) a data acquisition module operatively coupled to the one or more sensors to receive monitoring data therefrom and responsively generate an output correlative to the characteristic monitored by the one or more sensors, and (iii) a processor and display operatively coupled with the data acquisition module and arranged to process the output from the data acquisition module and responsively output a graphical representation of fluid in the fluid supply vessel, billing documents, usage reports, and/or resupply requests.

Compliant core peripheral lead semiconductor socket

An electrical interconnect between terminals on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a first surface having a plurality of openings arranged to correspond to the terminals on the IC device. A compliant material is located in the openings. A plurality of first conductive traces extend along the first surface of the substrate and onto the compliant material. The compliant material provides a biasing force that resists flexure of the first conductive traces into the openings. Vias extending through the substrate are electrically coupled the first conductive traces. A plurality of second conductive traces extend along the second surface of the substrate and are electrically coupled to a vias. The second conductive traces are configured to electrical couple with the contact pads on the PCB.

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

Lightweight audio system for automotive applications and method

A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Electronic paper active substrate and method of forming the same and electronic paper display panel

Embodiments of the invention disclose an electronic paper active substrate and a method of forming the same and an electronic paper display panel. The electronic paper active substrate comprises: a base substrate, a gate electrode, a first common electrode, a second common electrode, a gate insulating layer, an active layer, source-drain electrodes, a passivation layer, a resin passivation layer, and a pixel electrode layer. The gate electrode and the first common electrode are arranged on the base substrate, and the gate is provided with the gate insulating layer, the active layer, the source-drain electrodes, the passivation layer, the resin passivation layer, and the pixel electrode layer sequentially arranged thereon; the first common electrode is provided with the gate insulating layer, the source-drain electrodes, the passivation layer, the second common electrode, the resin passivation layer, and the pixel electrode layer sequentially arranged thereon; and the first and second common electrodes are electrically connected to each other.

Passive Devices in Package-on-Package Structures and Methods for Forming the Same

A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs.

Conductive polymer electronic devices with surface mountable configuration and methods for manufacturing same

Surface-mountable conductive polymer devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively. First and second planar conductive terminals are on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. In some embodiments, at least one cross-conductor includes a beveled portion through the first insulation layer to provide enhanced adhesion between the cross-conductor and the first insulation layer, while allowing greater thermal expansion without undue stress. In other embodiments, these advantages are achieved by having at least one cross-conductor in physical contact with a metallized anchor pad on the first insulation layer.

Method of manufacturing printed circuit board

In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Printed wiring board and method for manufacturing the same

A printed circuit board has a core substrate, a first conductive pattern on first surface of the substrate, a second conductive pattern on second surface of the substrate, and a through-hole conductor formed of plated material through the substrate such that the conductor is connecting the first and second patterns. The plated material is filling a through hole in the substrate, the substrate includes an insulation layer including inorganic fiber and resin, a first resin layer on one surface of the insulation layer and having the first surface of the substrate, and a second resin layer on the opposite surface of the insulation layer and having the second surface of the substrate, the first and second resin layers do not contain inorganic fiber material, and the sum of thicknesses of the first and second resin layers is set in the range of 20% or less of thickness of the substrate.

Dual interface smart cards, and methods of manufacturing

A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).

Printed circuit board having dc blocking dielectric waveguide vias

A printed circuit board is disclosed. The printed circuit board includes a first signal transmission layer, a via and a second signal transmission layer. The via connects the first signal transmission layer to the second signal transmission layer. The via includes a first region made of a first dielectric material having a first dielectric constant, and a second region made of a second dielectric material having a second dielectric constant lower than the first dielectric constant. The via allows AC Component of an electro-magnetic signal to be transmitted from the first signal transmission layer to the second signal transmission layer while blocking any DC component of the electromagnetic signal.

METHOD OF MANUFACTURING A CIRCUIT DEVICE

In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. First and second transistors and first and second diodes are mounted upper surfaces of island portions of respective first and second leads, and are connected to the respective leads through wirings that connect the transistors and diodes to the bonding portions of the respective leads. Lower surfaces of the island portions are attached to an upper surface of a circuit board, and the circuit board, the transistors, the diodes, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin. 1. A method of manufacturing a circuit device , comprising:providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion;mounting a first transistor and a first diode of a first phase on an upper surface of the island portion of a first lead;connecting the first transistor and the first diode of the first phase to a bonding portion of a second lead by a first wiring;mounting a second transistor and a second diode of the first phase on the upper surface of the island portion of a third lead;connecting the second transistor and the second diode of the first phase to a bonding portion of the second lead by a second wiring;attaching lower surfaces of the island portion of each of the plurality of leads to an upper surface of a circuit board; andencapsulating by a resin the circuit board, the first and second transistors, the first and second diodes and the lead ...

Circuit board and method of manufacturing the same

A circuit board includes a substrate and a through via. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes circuit layers and insulation layers. The insulation layers are sandwiched between the circuit layers. The through via goes through the substrate and has portions defining a first portion and a second portion. The first portion of the through via is coated with a first metal layer and electrically connected to at least one of the circuit layer by the first metal layer. The second portion of the through via is coated with a second metal layer and electrically connected to at least one of the circuit layer by the second metal layer. The first and second portions are electrically insulted, and the diameter of the second portion is larger than that of the first portion.

INTERCONNECT STRUCTURE

An interconnect structure includes a substrate, a dielectric block, and a conductor. The dielectric block is in the substrate. A dielectric constant of the dielectric block is smaller than a dielectric constant of the substrate, and the dielectric block and the substrate have substantially the same thickness. The conductor includes a first portion extending from a top surface to a bottom surface of the dielectric block and a second portion extending along and contacting the top surface of the dielectric block. 1. An interconnect structure , comprising:a substrate;a dielectric block in the substrate, wherein a dielectric constant of the dielectric block is smaller than a dielectric constant of the substrate, and the dielectric block and the substrate have substantially the same thickness; anda conductor comprising a first portion extending from a top surface to a bottom surface of the dielectric block and a second portion extending along and contacting the top surface of the dielectric block.2. The interconnect structure of claim 1 , wherein the conductor further comprises a third portion extending along and contacting the bottom surface of the dielectric block.3. The interconnect structure of claim 2 , wherein the third portion of the conductor is spaced apart from the substrate.4. The interconnect structure of claim 1 , further comprising a plug laterally surrounded by the conductor.5. The interconnect structure of claim 4 , wherein the plug is electrically conductive.6. The interconnect structure of claim 4 , wherein the plug is electrically non-conductive.7. The interconnect structure of claim 1 , wherein the dielectric block contacts the substrate.8. An interconnect structure claim 1 , comprising:a substrate;a dielectric block in the substrate;a shielding element laterally surrounding the dielectric block; anda conductor extending from a top surface to a bottom surface of the dielectric block, wherein the shielding element and the conductor have substantially ...

VEHICULAR CAMERA SYSTEM

A vehicular camera system includes a camera module having an imager assembly, a main circuit board and a camera housing. The imager assembly includes (i) an imager disposed on an imager circuit board and (ii) a lens holder having a lens assembly that includes a lens barrel accommodating a lens. The imager assembly includes a flexible ribbon cable that electrically connects to an electrical connector at a multilayered PCB of the main circuit board. The camera housing includes an upper cover and a lower cover and includes a forward portion and a rearward portion. The main circuit board is accommodated within the forward and rearward portions, and the imager is disposed at the rearward portion and is not disposed at the forward portion of the camera housing. The lens holder is attached at the upper cover of the camera housing. 1. A vehicular camera system , said vehicular camera system comprising:a camera module comprising an imager assembly, a main circuit board and a camera housing;wherein said imager assembly comprises (i) an imager disposed on an imager circuit board and (ii) a lens holder comprising a lens assembly;wherein said lens assembly comprises a lens barrel accommodating a lens;wherein said imager assembly comprises a flexible ribbon cable, said flexible ribbon cable terminating at a terminator portion;wherein said terminator portion of said flexible ribbon cable comprises a first electrical connector;wherein said main circuit board comprises a multilayered printed circuit board (multilayered PCB) having a first planar side and a second planar side opposite the first planar side and separated from the first planar side by a thickness dimension of the multilayered PCB of said main circuit board;wherein first circuitry is disposed at the first planar side of the multilayered PCB of said main circuit board, and wherein second circuitry is disposed at the second planar side of the multilayered PCB of said main circuit board;wherein said second circuitry ...

CUTTABLE FLEXIBLE LIGHT ENGINES

Flexible light engines capable of being cut, and methods thereof, are provided. A cuttable flexible light engine includes a flexible strip and strings of solid state light sources coupled in parallel. A voltage balancer establishes a desired current flow through the strings of solid state light sources when the flexible strip is cut to a desired length, and may be part of a connector placed where the strip is cut. The strings may be provided in a first set of strings coupled in parallel between a first conductive path and an intermediate conductive path and a second set of strings coupled in parallel between the intermediated conductive path and a second conductive path. A cuttable flexible light engine may also include test points positioned within the strings. 1. A flexible light engine comprising:a flexible strip;a first string of solid state light sources, comprising a first plurality of solid state light sources, and a second string of solid state light sources, comprising a second plurality of solid state light sources, coupled to the flexible strip;a voltage balancer coupled to at least the first string of solid state light sources, wherein the voltage balancer is configured to establish a desired current flow through the first string of solid state light sources and the second string of solid state light sources; anda plurality of test points along a length of the flexible strip, a first test point in the plurality of test points being positioned within the first string of solid state light sources and a second test point in the plurality of test points being positioned within the second string of solid state light sources.2. The flexible light engine of claim 1 , wherein the voltage balancer is provided in a connector coupled to the flexible strip.3. The flexible light engine of claim 1 , further comprising:a connector having a first connection point coupled to a first conductive path and a second connection point coupled to a second conductive path, ...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST

A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment. 1. A multilayer printed circuit board , comprising:a first conductive layer;a first plating resist selectively positioned within the first conductive layer;a second plating resist selectively positioned within a second conductive layer, the second plating resist separate from the first plating resist; anda through hole extending through the first plating resist in the first conductive layer, and the second plating resist in the second conductive layer, where an interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist to form a partitioned plated through hole having a first via segment electrically isolated from a second via segment.2. The multilayer printed circuit board of claim 1 , wherein the first plating resist is located adjacent a first surface of a first core or sub-composite structure claim 1 , and the second plating resist is located adjacent a second surface of a second core or sub-composite structure.3. The multilayer printed circuit board of claim 1 , wherein the first plating resist is located adjacent a first surface of a first core or sub-composite structure and the second plating resist is located adjacent an opposite second surface of the first core or sub-composite structure.4 ...

Interconnect structure and method of manufacturing the same

A method for manufacturing an interconnect structure is provided. The method includes the following steps. An opening is through a substrate. A low-k dielectric block is formed in the opening. At least one first via is formed through the low-k dielectric block. A first conductor is formed in the first via.

Solar Power Conversion Kit for Umbrella

A solar power conversion kit allows converting of a standard umbrella into a solar charging umbrella, which can then use solar power to charge electronic devices. The solar charging umbrella is self-sustained, capable of charging electronic devices in locations away from electrical outlets. The umbrella has a rechargeable battery that is recharged by sunlight. When charged, the umbrella's battery can charge devices when sunlight is not available. The umbrella supports simultaneous charging of higher power devices such as tablet computers. 1. A kit for an umbrella comprising a shaft and umbrella shade , the umbrella shade being coupled between a fastener and the shaft , the kit comprising:a cap, coupled between the fastener and the umbrella shade, comprising a cap opening and at least a first hinge portion and a second hinge portion, wherein the fastener couples to a bolt of the shaft that passes through the cap opening;a first strut, comprising first and second ends, a third hinge portion at the first end, and between the first and second ends is a first solar panel, wherein the third hinge portion couples with the first hinge portion of the cap to form a first strut hinge;a second strut, comprising third and fourth ends, a fourth hinge portion at third end, and between the third and fourth ends is a second solar panel, wherein the fourth hinge portion couples to the second hinge portion of the cap to form a second strut hinge,the umbrella comprises an open position during which the umbrella shade is extended into a position away from the shaft and a closed position during which the umbrella shade is folded into a position closer to the shaft,when changing the umbrella from the closed to the open position, the umbrella shade pushes against a bottom of the struts while the umbrella shade is extended, causing the struts to rotate via the first and second strut hinges in a first turn direction, so that an angle between a top of the first strut and a top of the cap ...

Printed Circuit Board Assembly With Air Dielectric

An assembly that includes a printed circuit board having an air gap, and a method of fabricating the assembly is disclosed. The assembly includes at least one air gap. This air gap is created by using a soluble material during the PCB assembly process. The soluble material can preferably be processed in accordance with traditional PCB fabrication processes. For example, other materials can be bonded to the soluble material. Additionally, the soluble material is capable of withstanding a drilling process. After the PCB assembly is complete, the soluble material is then dissolved, leaving an air gap where the soluble material once existed. This assembly may be useful in configurations where an antenna, EBG material or other electronic structure is to be disposed above the top surface of the printed circuit board.

CORDLESS HAND-HELD ULTRASONIC SURGICAL DEVICE

An ultrasonic surgical device includes a handle body, an ultrasonic waveguide engaged with the handle body and extending distally therefrom and including a proximal end portion disposed at the handle body, an ultrasonic generator releasably engagable with the handle body and including a first set of contacts, and an ultrasonic transducer releasably engagable with the handle body independently of the ultrasonic generator. The ultrasonic transducer includes a distal end portion configured to engage the proximal end portion of the ultrasonic waveguide and a second set of contacts configured to electrically couple to the first set of contacts. 117-. (canceled)18. An ultrasonic surgical device , comprising:a handle body;an ultrasonic waveguide engaged with the handle body and extending distally therefrom, the ultrasonic waveguide including a proximal end portion disposed at the handle body;an ultrasonic generator releasably engagable with the handle body, the ultrasonic generator including a first set of contacts; andan ultrasonic transducer releasably engagable with the handle body independently of the ultrasonic generator, the ultrasonic transducer including a distal end portion configured to engage the proximal end portion of the ultrasonic waveguide and a second set of contacts configured to electrically couple to the first set of contacts.19. The ultrasonic surgical device according to claim 18 , wherein the handle body includes a waveguide attachment dock engaging the ultrasonic waveguide claim 18 , a generator attachment dock configured to engage the ultrasonic generator claim 18 , and a transducer attachment docket configured to engage the ultrasonic transducer.20. The ultrasonic surgical device according to claim 18 , further comprising a battery releasably engagable with the handle body claim 18 , the battery configured to power the ultrasonic generator.21. The ultrasonic surgical device according to claim 20 , wherein the handle body includes a battery-holding ...

Methods of manufacturing printed circuit boards with stacked micro vias

A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.

Interconnections for a substrate associated with a backside reveal

An apparatus relating generally to a substrate is disclosed. In this apparatus, a post extends from the substrate. The post includes a conductor member. An upper portion of the post extends above an upper surface of the substrate. An exterior surface of the post associated with the upper portion is in contact with a dielectric layer. The dielectric layer is disposed on the upper surface of the substrate and adjacent to the post to provide a dielectric collar for the post. An exterior surface of the dielectric collar is in contact with a conductor layer. The conductor layer is disposed adjacent to the dielectric collar to provide a metal collar for the post, where a top surface of each of the conductor member, the dielectric collar and the metal collar have formed thereon a bond structure for interconnection of the metal collar and the conductor member.

SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED VIA IN A PRINTED CIRCUIT BOARD

In accordance with embodiments of the present disclosure, a circuit board may include a first trace formed in a first layer of the circuit board, a second trace formed in a second layer of the circuit board, a via, and a termination pad. The via may be configured to electrically couple the first trace to the second trace, the via comprising a via stub corresponding to a first portion of a length of the via not within a second portion of the via between a first location in which the first trace is electrically coupled to the via and a second location in which the second trace is electrically coupled to the via. The termination pad may be formed at an end of the via stub opposite at least one of the first location and the second location. 123-. (canceled)24. A method comprising:determining a length of a via stub, the via stub corresponding to a first portion of a via not within a second portion of the via electrically coupling a first trace of a circuit board to a second trace of the circuit board;determining a Nyquist frequency of signals communicated on the via and one or more harmonic frequencies thereof;estimating a resonance frequency of the via stub based on the length; andin response to determining that the resonance frequency is approximately equal to the Nyquist frequency or one of the one or more harmonic frequencies, determine a size of a termination pad to be formed on an end of the via stub.25. The method of claim 24 , the size of the termination pad determined such that an effective impedance of the via stub having the termination pad formed thereon is approximately equal to a desired impedance.26. The method of claim 25 , wherein the desired impedance comprises at least one of a desired capacitance and a desired inductance.27. The method of claim 25 , wherein the desired impedance is selected such that the via stub has a desired effective resonant frequency.28. The method of claim 24 , wherein the size is a radius of the termination pad.29. The method ...

Multilayer printed circuit board via hole registration and accuracy

A method of making printed circuit board vias using a double drilling and plating method is disclosed. A first hole is drilled in a core, the first hole having a first diameter. The first hole is filled and/or plated with an electrically conductive material. A circuit pattern may be formed on one or two conductive layers of the core. A multilayer structure may then be formed including a plurality of cores that also include pre-drilled and plated via holes, wherein at least some of the pre-drilled and plated via holes are aligned with the first hole. A second hole is then drilled within the first hole and the aligned pre-drilled and plated holes, the second hole having a second diameter where the second diameter is smaller than the first diameter. A conductive material is then plated to an inner surface of the second hole.

Wiring board and method for manufacturing same

A wiring board includes an electric insulating base material including an incompressible member and a thermosetting member; a first wiring and a second wiring formed with the electric insulating base material interposed therebetween; and a via-hole conductor penetrating the electric insulating base material, and electrically connecting the first wiring and the second wiring to each other. The via-hole conductor includes a resin portion and a metal portion. The metal portion includes a first metal region mainly composed of Cu; a second metal region mainly composed of a Sn—Cu alloy; and a third metal region mainly composed of Bi. The second metal region is larger than the first metal region, and larger than the third metal region.

Printed circuit board and method of manufacturing the same

Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding.

DOUBLE-SIDED CIRCUIT BOARD AND METHOD FOR PREPARING THE SAME

A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region. 1. A method for preparing a circuit board , comprising steps of:preparing a non-conductive substrate having a top surface and a bottom surface;utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern; andforming a conductive circuit upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top circuit pattern and the bottom surface outside of the bottom circuit pattern.2. The method for preparing a circuit board of claim 1 , wherein the forming of the conductive circuit comprises steps of:forming a metallic base layer upon the top surface and the bottom surface and inside the through hole, wherein the top metallic base layer at least covers the top circuit pattern and the bottom metallic base layer at least covers the bottom circuit pattern;forming a first metal layer at least upon the metallic base layer; andcreating a top isolation region surrounding the top circuit pattern and a bottom isolation region surrounding the bottom circuit pattern.3. The method for preparing a circuit board of claim 2 , wherein ...

Method for Manufacturing a Circuit Having a Lamination Layer Using Laser Direct Structuring Process

The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material. 19-. (canceled)10. A multi-layer circuit structure comprising:a substrate;a first circuit formed on the substrate;a layer of LDS paint formed over at least a portion of the first circuit; anda second circuit formed on the layer of LDS paint.11. The multi-layer circuit structure of claim 10 , wherein the substrate comprises at least one curved surface.12. The multi-layer circuit structure of claim 10 , wherein the first circuit is electrically connected with the second circuit at a connection region.13. The multi-layer circuit structure of claim 12 , wherein the connection region extends through the layer of LDS paint.14. The multi-layer circuit structure of claim 10 , further comprising a third circuit claim 10 , and wherein the substrate comprises an upper surface and a back surface claim 10 , and wherein the first circuit is formed on the upper surface of the substrate and the third circuit is formed on the back surface of the substrate.15. The multi-layer circuit structure of claim 14 , wherein the substrate comprises a through hole and the first circuit is electrically connected with the third circuit at a location that is proximate the through hole. The present application claims priority of Korean Patent Application Number 10-2015-0078172, filed Jun. 2, 2015, the entire contents of which are hereby incorporated by reference.The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring), and more particularly, in which can form circuit ...

Bolometric Detector With A Compensation Bolometer Having An Enhanced Thermalization

A bolometric detector includes a substrate; bolometric detection microbridges suspended above the substrate and thermally insulated from the substrate; bolometric compensation microbridges suspended above the substrate and thermalized to the substrate; and a read circuit formed in the substrate to apply a biasing to the detection microbridges and to the compensation microbridges and to form differences between signals generated by detection microbridges and signals generated by compensation microbridges under the effect of the applied biasing. Each detection microbridge and each compensation microbridge includes electrically-conductive anchoring nails connected to the read circuit, a membrane attached to the anchoring nails above the substrate, and a thermometric element arranged in the membrane. The detector further includes thermal short-circuit elements between the membrane of each compensation microbridge and the substrate.

REPLACABLE DEBRIDER BLADE MODULE WITH LATCHING MECHANISM

A blade assembly comprising: a tip including two or more tubes, wherein the two or more tubes include at least: an outer tube and an inner tube; and a mechanical enclosure including: a locking spline having a longitudinal axis; and a slide lock; wherein the slide lock slides along the longitudinal axis of the locking spline and over the locking spline forming a locked state so that rotational movement of the locking spline, around the longitudinal axis of the locking spline, is prevented; and wherein the outer tube is coupled to the locking spline so that rotational movement of the outer tube, around the longitudinal axis of the locking spline, is prevented during the locked state. 1) A blade assembly comprising: i. an outer tube and', 'ii. an inner tube; and, 'a. a tip including two or more tubes, wherein the two or more tubes include at least i. a locking spline having a longitudinal axis; and', 'ii. a slide lock that is movable between a locked position and an unlocked position within the mechanical enclosure;, 'b. a mechanical enclosure includingwherein the slide lock moves between the locked position and the unlocked position along the longitudinal axis of the locking spline, and the slide lock in the locked position extends over the locking spline forming a located state where the locking spline is located within the slide lock so that rotational movement of the locking spline, around the longitudinal axis of the locking spline, is prevented; andwherein the outer tube is coupled to the locking spline so that rotational movement of the outer tube, around the longitudinal axis of the locking spline, is prevented during the locked state.220)-) (canceled)21) The blade assembly of claim 1 , wherein the slide lock includes an actuation connection that connects the slide lock to a lock lever that moves the slide lock between the locked position and the unlocked position.22) The blade assembly of claim 1 , wherein the mechanical enclosure includes a control enclosure ...

Systems and methods for forming an end of an elongated member of an electrical stimulation system

A method for forming a lead or lead extension having an arrangement of elongated conductors disposed in a body of a lead or lead extension includes ablating a plurality of spaced-apart channels in proximity to at least one of the proximal end or the distal end of the body to expose at least part of at least one of the conductors. A C-shaped contact is disposed into each of a different one of the transverse channels. Each C-shaped contact is electrically coupled to at least one of the conductors. Each C-shaped contact is closed so that opposing ends of the C-shaped contact are adjacent to one another and aligned over one of the elongated conductors. The two opposing ends of each C-shaped contact is coupled together such that each C-shaped contact forms a continuous path around the arrangement within the transverse channel in which the C-shaped contact is disposed.

HANDHELD DEVICE ENCLOSURE

This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device. 1. An electronic device enclosure , comprising:an outer periphery member defining a ring and having a front surface and a back surface;an internal platform placed at least in part within the outer periphery member and connected to at least two distinct regions of the outer periphery member, the internal platform offset from the front surface and the back surface;a front cover assembly placed adjacent to the front surface and covering the internal platform; and a back cover assembly placed adjacent to the back surface and covering the internal platform.2. The electronic device enclosure of claim 1 , wherein the outer periphery member and internal platform combine to provide stiffness to the device.3. The electronic device enclosure of claim 1 , wherein:the internal platform comprises a main plate placed entirely within the height of the outer periphery member.4. The electronic device enclosure of claim 3 , wherein:the internal platform comprises at least one step connected to the outer periphery member, the at least one step extending from the main plate.5. The electronic device enclosure of claim 4 , wherein:the front surface substantially defines a single plane; andthe at least one step is connected to the front surface.6. The electronic device enclosure of claim 1 , wherein:the internal platform separates a first region of the outer periphery member from a second region of the outer periphery ...

PLATED OPENING WITH VENT PATH

A plated hole with a sidewall plating. The plated hole has a vent opening that has a sidewall of non-conductive material that is not plated. During attachment of a joint conductive material such as solder to the sidewall plating, gasses generated from the attachment process are outgassed through the vent opening. 114-. (canceled)15. An electronic component assembly comprising:an electronic component;a workpiece including an opening extending from a first major surface of the workpiece, the opening including an opening sidewall of non-conductive material;a sidewall plating, the sidewall plating covers a first portion of the opening sidewall of the non-conductive material in a plane parallel to the first major surface, a second portion of the opening sidewall in the plane is not covered by the sidewall plating;a conductive structure electrically coupled to the sidewall plating with a conductive joint material structure attached to the sidewall plating and to the conductive structure, wherein at least a portion of the conductive joint material structure is located in the opening and attached to the sidewall plating in the opening including in the plane, wherein the conductive joint material structure is not attached to the second portion of the opening sidewall in the plane.16. The assembly of wherein the sidewall plating extends to a conductive structure embedded in the workpiece and the sidewall plating and a portion of the opening are characterized as a plated blind via.17. The assembly of wherein the sidewall plating and the opening extends to a second major surface of the workpiece opposite the first major surface and a portion of the opening and the sidewall plating are characterized as a plated through hole via.18. The assembly of wherein the workpiece is characterized as an interposer and the conductive structure is a conductive structure of a substrate claim 15 , wherein the interposer is encapsulated in an encapsulant with the electronic component.19. The ...

Printed circuit board and method of manufacturing the same

Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulation layer; pattern parts formed on both surfaces of the insulation layer; a connection pad disposed between the pattern parts and having a step part; a first plated layer formed on the pattern part; an oxide film formed on a region excluding a region on which the first plated layer is formed; a second plated layer formed on the connection pad; and a solder ball covering the connection pad.