23-05-2023 дата публикации
Номер: CN116153815A
Принадлежит:
The invention discloses a wafer surface cleaning device which is characterized in that the wafer surface cleaning device comprises a fixed case, a first area, a second area, a third area and a fourth area are arranged in the fixed case, a wafer carrying device and a wafer storing and taking device are fixedly arranged in the first area, a wafer spin-drying device is arranged in the second area, and the wafer carrying device and the wafer storing and taking device are fixedly arranged in the fourth area. A wafer scrubbing device is arranged in the third area, a power driving device is arranged in the fourth area, vertical partition plates are arranged among the first area, the second area and the third area, a transverse partition plate is arranged between the second area and the third area, and transverse partition plates are arranged among the fourth area, the first area and the third area. A first channel is arranged between the first area and the second area. The full-automatic wafer ...
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