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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 108. Отображено 100.
12-06-2018 дата публикации

EMS ANTENNA MODULE AND METHOD FOR MANUFACTURING SAME AND SEMICONDUCTOR PACKAGE INCLUDING SAME

Номер: KR1020180063403A
Автор: KWON, YONG TAE, LEE, JUN KYU, LEE, JAE CHEON
Принадлежит:

An EMS antenna module and a semiconductor package including the EMS antenna module are disclosed. According to an embodiment of the present invention, the EMS antenna module includes a substrate including an antenna pattern and a via hole, a first encapsulant on the substrate, and a radiation angle adjusting part for adjusting the signal radiation angle of an antenna. It is possible to increase signal transmission speed by maintaining the optimal radiation angle of the antenna signal through the radiation angle adjusting part of the EMS antenna module. The semiconductor package including the same can normally operate while maintaining inherent performance from electromagnetic interference or hindrance. COPYRIGHT KIPO 2018 ...

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Номер записи: 1
12-07-2016 дата публикации

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020160083388A
Автор: KWON, YONG TAE, LEE, JUN KYU, KANG, SUNG CHUL
Принадлежит:

Disclosed is a semiconductor package where a semiconductor chip and a mounting device are packaged together. The semiconductor package according to the embodiment of the present invention includes a semiconductor chip, a mounting block where a first mounting device is mounted on a substrate having a circuit, and a wiring part which electrically connects the semiconductor chip and the mounting block. So, the semiconductor chip can be separated from the substrate having the mounting device. COPYRIGHT KIPO 2016 ...

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Номер записи: 2
23-03-2017 дата публикации

ANTIBODY SPECIFICALLY BINDING TO ARGINYLATED ER PROTEIN, AND USE THEREOF

Номер: WO2017047846A1
Автор: KWON, Yong Tae, KIM, Bo Yeon, CHA, Hyunjoo, YOO, Young Dong, HWANG, Joonsung, KIM, Kyeong A, MUN, Su Ran, JI, Chang Hoon
Принадлежит:

The present invention relates to: an antibody specifically binding to an arginylated ER protein; and a use thereof. Arginylation occurs at the N-terminal of an ER protein by ATE1 R-transferase, the arginylated ER protein, which is a part of the innate immune system inducing cytosolic localization and targeted autophagic vacuoles, is induced into cytosolic dsDNA, the cytosolic dsDNA ATE1-dependently induces the arginylation of an ER protein, the arginylation is stimulated by a misfolded protein in the cytoplasm, and the arginylated ER protein induces the innate immune system by becoming a target as a substrate of an autophagosome inducing autophagic degradation, and thus the antibody specifically binding to an arginylated ER protein, of the present invention, can significantly detect an arginylated ER protein, and thus can be useful in a kit for screening for an immunomodulator, an immunomodulator and a method for screening for an antiviral agent.

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Номер записи: 3
19-07-2018 дата публикации

칩 패키지 및 이의 제조방법

Номер: KR0101870164B1
Автор: 권용태, 이준규, 이재천, 윤민아
Принадлежит: 주식회사 네패스

... 도전성 분말이 함유된 몰딩층이 형성된 칩 패키지 및 그 제조방법이 개시된다. 프레임의 관통홀에는 몰딩층과 도전층이 형성된다. 또한, 프레임에 형성된 비아홀에는 몰딩층과 동일한 재질을 가지는 제1 비아층이 형성되고, 제1 비아층 상에는 도전층과 동일한 재질을 가지는 제2 비아층이 형성된다. 몰딩층 및 도전층에 의해 칩에서 발생되는 열의 방출은 용이해지고, 외부로부터의 전자파는 차폐될 수 있다.

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Номер записи: 4
04-07-2013 дата публикации

STACKED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: WO2013100710A1
Автор: KWON, Yong Tae, LEE, Jun Kyu
Принадлежит:

The present invention provides a stacked semiconductor package in which semiconductor chips having different sizes are stacked. The stacked semiconductor package according to one embodiment of the present invention comprises: a first semiconductor chip structure further comprising a first semiconductor chip, a first mold layer for surrounding the first semiconductor chip, and a first through via which penetrates the first mold layer and is electrically connected to the first semiconductor chip; and a second semiconductor chip structure which is stacked vertically with respect to the first semiconductor chip structure, and further comprises a second semiconductor chip and a second through via connected electrically to the first through via, wherein the size of the first semiconductor chip structure and the second semiconductor chip structure are the same.

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Номер записи: 5
31-05-2018 дата публикации

SEMICONDUCTOR PACKAGE HAVING REWIRING LAYER AND METHOD FOR PRODUCING SAME

Номер: WO2018097414A1
Автор: KWON, Yongtae, LEE, Junkyu, LEE, Jaecheon, YOON, Mina
Принадлежит:

A semiconductor package having a rewiring layer and a method for producing same are disclosed. If a frame has an insulation material or a semiconductor material, and an insulation film comprising a polymer other than the usual SiO2 is used as an insulation film for the rewiring layer, the polymeric insulation film is not easily attached onto the frame. To improve this, an adhesive buffer layer is introduced onto an outer surface of the frame.

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Номер записи: 6
09-03-2017 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

Номер: WO2017039306A1
Автор: KWON, Yong Tae, LEE, Jun Kyu
Принадлежит:

Disclosed are a wire bond-type semiconductor package, which has a fanout metal pattern formed thereon, and a method for manufacturing the same. A semiconductor package according to an embodiment of the present invention comprises: a frame, which is configured such that an electric signal can be transferred between upper and lower portions thereof, and which has a penetrating portion formed therein; a first semiconductor chip contained in the penetrating portion of the frame; a second semiconductor chip mounted on the first semiconductor chip; a wire that electrically connects the first semiconductor chip and a signal unit of the frame; a sealing material that molds the frame, the first semiconductor chip, the second semiconductor chip, and the wire such that the same are integrated; and a wiring unit provided beneath the frame and the first semiconductor chip and electrically connected to the frame.

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Номер записи: 7
25-06-2018 дата публикации

반도체 패키지 및 이의 제조방법

Номер: KR0101870161B1
Автор: 권용태, 이준규, 이재천, 윤민아
Принадлежит: 주식회사 네패스

... 도전성 분말이 함유된 몰딩층이 형성된 반도체 패키지 및 그 제조방법이 개시된다. 몰딩층에는 도전성 분말이 포함되고, 반도체 칩의 외곽에 배치된 프레임에는 관통 비아가 형성된다. 몰딩층 등에 의해 반도체 칩에서 발생되는 열의 방출은 용이해지고, 외부로부터의 전자파는 차폐될 수 있다.

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Номер записи: 8
12-09-2018 дата публикации

신뢰성을 가지는 반도체 패키지 및 이의 제조방법

Номер: KR0101897520B1
Автор: 권용태, 이준규, 이재천, 윤민아
Принадлежит: 주식회사 네패스

... 높은 신뢰성을 가지는 반도체 패키지 및 그 제조방법이 개시된다. 반도체 칩과 몰딩층이 수용되는 절연 프레임에는 제1 관통공과 제1 관통공보다 넓은 폭을 가지는 제2 관통공이 형성된다. 제1 관통공을 통해 반도체 칩은 배치된다.

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Номер записи: 9
14-03-2018 дата публикации

반도체 패키지, 이의 제조 방법 및 시스템 인 패키지

Номер: KR0101837514B1
Автор: 권용태, 이준규, 이재천
Принадлежит: 주식회사 네패스

... 반도체 패키지, 이의 제조 방법 및 시스템 인 패키지가 개시된다. 본 발명의 실시예에 따른 반도체 패키지는 절연층 및 배선층을 포함하는 배선부, 상기 배선부 상에 실장되고, 상기 배선층과 본딩 패드를 통하여 전기적으로 연결되는 반도체 칩 및 상기 반도체 칩 및 상기 배선부를 커버하며, 상기 배선층과 연결되는 커버부재를 포함한다. 따라서, 커버부재가 반도체 칩을 커버하며 배선층과 연결되어 전자파 간섭현상을 줄이는 것이 가능하며, 반도체 패키지의 동작 간 노이즈를 최소화하고 신호 속도를 향상시킬 수 있다.

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Номер записи: 10
02-11-2015 дата публикации

ANTIBODY SPECIFICALLY BINDING TO ARGINYLATED ER PROTEIN AND USE THEREOF

Номер: KR1020150122287A
Автор: KWON YONG TAE, KIM, BO YEON, CHA HYUNJOO, YOO, YOUNG DONG, HWANG, JOON SUNG, KIM, KYEONG A, MUN, SU RAN, JI, CHANG HOON
Принадлежит:

The present invention relates to antibody specifically binding to arginylated ER protein and a use thereof. Arginylation occurs at N-end of ER protein by ATE1 R-transferase. The arginylated ER protein is induced to dsDNA of cytosolic as a part of the innate immune system inducing cytosolic localization and autophagic vacuoles for a target. The dsDNA of cytoplasm induces arginylation of the ER protein in an ATE1-dependent manner, and the arginylation is stimulated by a misfolded protein in the cytoplasm. The arginylated ER protein induces the innate immune system by being a target as a substrate of autophagosome inducing autophagic degradation. The antibody specifically binding to the arginylated ER protein, according to the present invention, is capable of significantly detecting the arginylated ER protein, and thus can be usefully used as a kit for screening immunomodulator, and a method for screening immunomodulator and medicine for viruses. COPYRIGHT KIPO 2016 (AA) Signal peptide (BB ...

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Номер записи: 11
14-08-2017 дата публикации

PAYMENT DATA TRANSMISSION METHOD THROUGH BLUETOOTH COMMUNICATION, PAYMENT DATA TRANSMITTING AND RECEIVING TERMINAL USING SAME, AND PAYMENT DATA PROCESSING SYSTEM THEREOF

Номер: KR1020170092909A
Автор: KIM, JONG KAK, PARK, JIN SOO, HAN, GEUN SEOK, SHIN, YONG JAE, KIM, JAE YEON, KWEON, YONG TAE
Принадлежит:

The present invention relates to a data transmission method using Bluetooth communication of a payment data processing device. The data transmission method includes: a payment data generation step (S200) of generating payment data in accordance with information input by a user; a Bluetooth Low Energy (BLE) transmission data generation step (S300) of generating BLE transmission data to transmit the generated payment data as BLE signals; and a BLE signal transmission step (S400) of transmitting the generated BLE transmission data as the BLE signals. The BLE transmission data is advertising data of BLE communication. The BLE transmission data generation step (S300) includes the processes of generating advertising data including payment information. The BLE signal transmission step (S400) includes the processes of transmitting the BLE signals of advertising packets including the advertising data. COPYRIGHT KIPO 2017 (S100) User terminal BT function activation step (S200) Payment data generation ...

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Номер записи: 12
24-11-2017 дата публикации

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170128781A
Автор: KWON, YONG TAE, LEE, JUN KYU, LIM, SI WOO, OH, DONG HOON, MA, JUN SUNG, KIM, TAE WON
Принадлежит:

The present invention discloses a semiconductor package including a fan-out structure, and a manufacturing method thereof. According to an embodiment of the present invention, the semiconductor package comprises: a wiring part including an insulating layer and a wiring layer; a semiconductor chip mounted on the wiring part, and coupled to the wiring part by flip chip bonding; a filling member filling between the semiconductor chip and the wiring part; and a film member coating to cover one sides of the semiconductor chip, the filling member, and the wiring part. COPYRIGHT KIPO 2017 ...

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Номер записи: 13
27-09-2018 дата публикации

DISHWASHER AND CONTROL METHOD THEREOF

Номер: WO2018174520A2
Автор: SON, Changwoo, BAE, Jaegwang, KANG, Joonhyung, KWON, Yongtae, KIM, Minchul
Принадлежит:

The present invention relates to a dishwasher that sprays washing water to clean dishes and cookware, and a control method thereof. The control method of the dishwasher according to an embodiment of the present invention includes: a water supply step of supplying washing water from an external water source to a sump; and an intermittent driving step of intermittently driving a cleaning pump to vary the water level around a filter, and thus can remove pollutants blocking the filter.

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Номер записи: 14
30-01-2020 дата публикации

NOVEL P62 LIGAND COMPOUND, AND COMPOSITION FOR PREVENTING, ALLEVIATING, OR TREATING PROTEINOPATHIES COMPRISING SAME

Номер: WO2020022784A1
Автор: KWON, Yong Tae, JI, Chang Hoon, GANIPISETTI, Srinivasrao, KIM, Hee Yeon, MUN, Su Ran, JUNG, Chan Hoon, JUNG, Eui Jung, SUNG, Ki Woon
Принадлежит:

The present invention relates to a novel p62 ligand compound, or a stereoisomer, solvate, hydrate, or prodrug thereof, and a pharmaceutical or food composition for preventing or treating proteopathies comprising same as an active ingredient. The p62 ligand compound according to the present invention activates selective autophagy in cells, thereby selectively removes proteins, organelles, and aggregates in the body, and thus can be usefully employed as a pharmaceutical composition for preventing, alleviating, or treating various proteinopathies.

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Номер записи: 15
31-05-2018 дата публикации

SEMICONDUCTOR PACKAGE USING INSULATION FRAME AND METHOD FOR PRODUCING SAME

Номер: WO2018097408A1
Автор: KWON, Yongtae, LEE, Junkyu, LEE, Jaecheon, YOON, Mina
Принадлежит:

A semiconductor package using an insulation frame and a method for producing same are disclosed. The insulation frame has a thru-hole, and a first inclined surface and a second inclined surface which slantingly protrude toward the thru-hole. When thermal stress occurs due to thermal expansion or thermal contraction, the stress can be evenly distributed along the first inclined surface and the second inclined surface.

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Номер записи: 16
21-09-2016 дата публикации

CONTACTLESS POINT DATA PROCESSING DEVICE USING BLUETOOTH COMMUNICATION AND POINT DATA PROCESSING METHOD USING SAME

Номер: KR101658607B1
Автор: SHIN, YONG JAE, KWEON, YONG TAE, HAN, GEUN SEOK, KIM, JAE YEON, JANG, SEUNG MAN, KIM, JONG KAK, PARK, JIN SOO
Принадлежит: KIM, JONG KAK, PARK, JIN SOO

The present invention relates to a contactless point data processing device using Bluetooth communication in one aspect. The contactless point data processing device comprises: a data processing device (110) to process point data by receiving membership service processing information from a user of an affiliated store through a user interface, to produce a command for controlling a Bluetooth communication module and a sensor module according to a set input by receiving the setting for the sensor module and a communication module including the Bluetooth communication module for the processing of the point data, and to transmit and receive the point data with a user terminal through the Bluetooth communication module; and a data transmission and reception terminal (120) to be connected to the data processing device (110) by communication, to change the necessary setting according to a command of the data processing device by including the Bluetooth communication module used for the transmission ...

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Номер записи: 17
07-02-2019 дата публикации

CHIP PACKAGE AND MANUFACTURING METHOD THEREFOR

Номер: WO2019027278A1
Автор: KWON, Yong Tae, LEE, Eung Ju, YEO, Yong Woon, PARK, Yun Mook, KIM, Hyo Young, LEE, Jun Kyu, CHEON, Seok Hwi
Принадлежит:

Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer, without using a separate insulating layer formed on the molding layer as in the conventional art.

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Номер записи: 18
30-04-2020 дата публикации

SEMICONDUCTOR PACKAGE

Номер: WO2020085715A1
Автор: KIM, Su Yun, OH, Dong Hoon, KWON, Yong Tae, LEE, Jun Kyu, SHIN, Kyeong Rok, YEO, Yong Woon
Принадлежит:

The technical idea of the present invention provides a semiconductor package comprising: a semiconductor chip; and a redistribution structure including an upper structure including a first molding layer for molding the semiconductor chip, a lower structure disposed below the upper structure and including a conductive post and a second molding layer for molding the conductive post, and a wiring pattern provided between the upper structure and the lower structure and electrically connecting a pad of the semiconductor chip and the conductive post, wherein the thermal expansion coefficient of the second molding layer is different from the thermal expansion coefficient of the first molding layer.

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Номер записи: 19
31-01-2019 дата публикации

반도체 패키지 및 그 제조방법

Номер: KR0101944007B1
Автор: 권용태, 이준규, 이재천
Принадлежит: 주식회사 네패스

... 와이어 본딩을 이용하는 반도체 패키지 및 이의 제조방법이 개시된다. 본 발명의 실시예에 따른 반도체 패키지는 관통부가 형성되고 관통부 주위에 마련되는 관통배선을 통해 상부면과 하부면 사이에 전기적 신호의 전달이 가능한 프레임과, 관통부에 수용되는 제1 반도체 칩과, 프레임과 제1 반도체 칩의 하부에 마련되고 관통배선과 제1 반도체 칩을 전기적으로 연결하는 배선부와, 제1 반도체 칩 상에 적층되는 제2 반도체 칩과, 제2 반도체 칩과 프레임의 신호부를 전기적으로 연결하는 와이어와, 프레임과 제1 및 제2 반도체 칩과 와이어를 일체화하도록 몰딩하는 봉지재를 포함한다.

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Номер записи: 20
13-02-2019 дата публикации

블루투스 통신을 통한 출입 통제 시스템 및 이를 이용한 출입 통제 방법

Номер: KR1020190014719A
Автор: 김종각, 박진수, 한근석, 신용재, 김재연, 권용태
Принадлежит:

... 본 발명은 블루투스 통신을 통한 출입 통제 방법에 관한 것으로, 사용자 단말에 설치된 애플리케이션의 실행에 따라, 적어도 하나의 출입 인증을 위한 정보를 수신하는 단계; 상기 수신된 적어도 하나의 출입 인증을 위한 정보를 포함하는 BLE(Bluetooth Low Energy) 통신의 애드버타이징 데이터를 생성하는 단계; 및 BLE 통신 모듈을 통해 상기 생성된 애드버타이징 데이터를 포함하는 애드버타이징 패킷의 BLE 신호를 출입 통제 단말로 전송하는 단계;를 포함하는 것을 특징으로 한다.

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Номер записи: 21
06-03-2018 дата публикации

SYSTEM AND METHOD FOR PROVIDING AR SERVICE BASED ON POSITION OF AFFILIATED STORE

Номер: KR1020180021990A
Автор: KIM, JONG KAK, PARK, JIN SOO, HAN, GEUN SEOK, SHIN, YONG JAE, KIM, JAE YEON, KWEON, YONG TAE
Принадлежит:

The present invention relates to an AR service providing system which comprises: a mobile payment device for transmitting a beacon signal to provide service information of an affiliated store as an AR service to a user terminal entering the affiliated store through a Bluetooth communication module; a user terminal for executing an AR application by using the beacon signal received by the mobile payment device, and overlaying and displaying the service information of the affiliated store received from an AR server on an execution screen of the AR application; and the AR server for detecting the service information of the affiliated store corresponding to position information of the affiliated store received from the user terminal according to a request of the user terminal, and transmitting the service information to the user terminal. COPYRIGHT KIPO 2018 (110) Mobile payment device (120) Mobile payment terminal (AA) Motion recognition (BB) First network (CC) Second network (DD) Input/display ...

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Номер записи: 22
26-07-2018 дата публикации

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

Номер: WO2018135708A1
Автор: KIM, Nam Chul, YEO, Yong Woon, KWON, Yong Tae, LEE, Young Seok
Принадлежит:

Provided is a method for producing a semiconductor package comprising a step for forming an interconnected structure, the method according to the technical concept of the present invention comprising the steps of: arranging a plurality of wafers on a tray; forming the interconnected structure on top of the tray and plurality of wafers; and separating the plurality of wafers from the tray.

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Номер записи: 23
29-12-2011 дата публикации

NETWORK SYSTEM

Номер: KR2011162556A2
Автор: AHN, Junho, KIM, Yanghwan, LEE, Hoonbong, LEE, Koonseok, KANG, Sunhee, KANG, Seonghwan, KWON, Yongtae, KWON, Jaekuk, KIM, Hoyoung, PARK, Hyoungjun, JUNG, Jimoon, JOO, Younghoon
Принадлежит:

One embodiment of the present invention relates to a network system. The network system, according to the present embodiment, comprises: a first component having a first unique code which performs a predetermined function; and a second component having a second unique code and which exchanges information with the first component for communication-connecting to the first component, wherein when a command for communication-connecting to the first component or a second component is input, the component into which the command is input generates a connection signal, and wherein a communication address and the unique code of each of the components are exchanged between one component that generates the connection signal and another component that receives the connection signal.

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Номер записи: 24
25-06-2018 дата публикации

절연 프레임을 이용한 반도체 패키지 및 이의 제조방법

Номер: KR0101870153B1
Автор: 권용태, 이준규, 이재천, 윤민아
Принадлежит: 주식회사 네패스

... 절연 프레임을 이용한 반도체 패키지 및 이의 제조방법이 개시된다. 절연 프레임에는 관통공이 형성되고, 관통공을 향해 비스듬히 돌출된 제1 경사면과 제2 경사면이 형성된다. 열팽창 또는 열수축에 의한 열응력이 발생하는 경우, 제1 경사면과 제2 경사면을 따라 응력은 고르게 분산될 수 있다.

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Номер записи: 25
26-06-2018 дата публикации

EMS 안테나 모듈 및 그 제조방법과 이를 포함하는 반도체 패키지

Номер: KR0101870421B1
Автор: 권용태, 이준규, 이재천
Принадлежит: 주식회사 네패스

EMS 안테나 모듈과 이를 포함하는 반도체 패키지가 개시된다. 본 발명의 실시예에 따른 EMS 안테나 모듈은 안테나 패턴과 비아홀을 포함하는 기판과, 기판 상부의 제1 봉지재와, 안테나의 신호 방사각도를 조절하는 방사각 조절부를 포함한다. EMS 안테나 모듈의 방사각 조절부를 통해 안테나 신호의 최적 방사각도를 유지하여 신호 전송속도를 향상시킬 수 있으며, 이를 포함하는 반도체 패키지는 전자파 간섭 또는 장해로부터 고유성능을 유지하면서 정상적으로 동작할 수 있다.

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Номер записи: 26
26-07-2018 дата публикации

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

Номер: WO2018135705A1
Автор: KIM, Nam Chul, YEO, Yong Woon, KWON, Yong Tae, LEE, Young Seok
Принадлежит:

Provided is a method for producing a semiconductor package, the method according to the technical concept of the present invention comprising: a step for preparing a wafer having a semiconductor element; a first step for forming, on the wafer, a first insulation layer which exposes at least a part of the pad of the semiconductor element; a second step for forming, on the first insulation layer, a wiring layer connected to the pad exposed by the first insulation layer; and a third step for forming, on top of the first insulation layer and wiring layer, a second insulation layer exposing a part of the wiring layer, wherein at least one step from the first through third steps is carried out with the plurality of wafers arranged on a tray.

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Номер записи: 27
24-08-2018 дата публикации

블루투스 통신을 통한 결제 데이터 송신방법, 이를 이용한 결제 데이터 송수신 단말 및 결제 데이터 처리 시스템

Номер: KR0101891875B1
Автор: 김종각, 박진수, 한근석, 신용재, 김재연, 권용태
Принадлежит: 김종각, 박진수

... 본 발명은, 결제 데이터 처리 장치의 블루투스 통신을 통한 데이터 송신방법으로, 사용자의 정보 입력에 따라 결제 데이터를 생성하는 결제 데이터 생성단계(S200); 상기 생성된 결제 데이터를 BLE 신호로 전송할 BLE 전송 데이터로 생성하는 BLE 전송 데이터 생성 단계(S300); 상기 생성된 BLE 전송 데이터를 BLE 신호로 전송하는 BLE 신호 전송 단계(S400);을 포함하여, 상기 BLE 전송 데이터는 BLE 통신의 에드버타이징 데이터(Advertising data)로, 상기 BLE 전송 데이터 생성 단계(S300)는 상기 결제 데이터를 포함하여 에드버타이징 데이터(Advertising data)를 생성하고, BLE 신호 전송 단계(S400)는 에드버타이징 데이터(Advertising data)를 포함하는 에드버타이징 패킷(Advertising packet)의 BLE 신호를 송출하는 것을 특징으로 한다.

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Номер записи: 28
22-06-2017 дата публикации

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

Номер: WO2017105004A1
Автор: KWON, Yong Tae, LEE, Jun Kyu, LEE, Jae Cheon
Принадлежит:

Disclosed are a semiconductor package using wire bonding and a manufacturing method therefor. The semiconductor package according to an embodiment of the present invention comprises: a frame having a through-portion formed therein, wherein an electrical signal can be transmitted between the upper and lower surfaces of the frame through penetrating interconnection wiring provided around the through-portion; a first semiconductor chip received in the through-portion; interconnection wiring provided below the frame and the first semiconductor chip to electrically connect the penetrating interconnection wiring and the first semiconductor chip; a second semiconductor chip stacked above the first semiconductor chip; a wire electrically connecting the second semiconductor chip and a signal unit of the frame; and an encapsulation material molded to integrate the frame, the first and second semiconductor chips, and the wire.

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Номер записи: 29
08-11-2018 дата публикации

DISHWASHER AND CONTROL METHOD THEREOF

Номер: WO2018174520A3
Автор: SON, Changwoo, BAE, Jaegwang, KANG, Joonhyung, KWON, Yongtae, KIM, Minchul
Принадлежит:

The present invention relates to a dishwasher that sprays washing water to clean dishes and cookware, and a control method thereof. The control method of the dishwasher according to an embodiment of the present invention includes: a water supply step of supplying washing water from an external water source to a sump; and an intermittent driving step of intermittently driving a cleaning pump to vary the water level around a filter, and thus can remove pollutants blocking the filter.

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Номер записи: 30
18-01-2018 дата публикации

반도체 패키지 및 그 제조방법

Номер: KR0101819558B1
Автор: 권용태, 이준규
Принадлежит: 주식회사 네패스

... 팬아웃 금속 패턴이 형성된 와이어 본드형 반도체 패키지 및 이의 제조방법이 개시된다. 본 발명의 실시예에 따른 반도체 패키지는 상부와 하부 사이에 전기적 신호의 전달이 가능하고 관통부가 형성되는 프레임과, 프레임의 관통부에 수용되는 제1 반도체 칩과, 제1 반도체 칩 상에 탑재되는 제2 반도체 칩과, 제1 반도체 칩과 프레임의 신호부를 전기적으로 연결하는 와이어와, 프레임과 제1 반도체 칩과 제2 반도체 칩과 와이어를 일체화하도록 몰딩하는 봉지재와, 프레임과 제1 반도체 칩의 하부에 마련되고 프레임과 전기적으로 연결되는 배선부를 포함한다.

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Номер записи: 31
22-08-2016 дата публикации

CONTACTLESS MOBILE PAYMENT DEVICE USING BLUETOOTH COMMUNICATION, PAYMENT DATA PROCESSING METHOD THEREOF, AND RECORDING MEDIUM WITH PROGRAM RECORDED THEREON

Номер: KR101649995B1
Автор: SHIN, YONG JAE, KWEON, YONG TAE, HAN, GEUN SEOK, KIM, JAE YEON, JANG, SEUNG MAN, KIM, JONG KAK, PARK, JIN SOO
Принадлежит: KIM, JONG KAK, PARK, JIN SOO

The present invention relates to a contactless mobile payment device using Bluetooth communication. According to an aspect of the present invention, the contactless mobile payment device using Bluetooth communication comprises: a mobile payment device (110) which includes a user interface to receive information related to a payment from a user of a member store to process payment data, receives settings for a communication module including a Bluetooth communication module for processing the payment data and a sensor module to generate control commands to control the Bluetooth communication module and the sensor module according to an input for the settings, and transmits/receives the payment data to/from a user terminal via the Bluetooth communication module; and a mobile payment terminal (120) which is connected to the mobile payment device (110) via communication, includes a Bluetooth communication module used for transmitting and receiving the payment data to change the settings needed ...

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Номер записи: 32
10-07-2015 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Номер: KR101535404B1
Автор: KWON, YONG TAE, JEON, BYOUNG YOOL
Принадлежит: NEPES CO., LTD.

Disclosed are a semiconductor package including a conductive path electrically connecting upper and lower parts of the semiconductor package, and a manufacturing method thereof. The semiconductor package according to an embodiment of the present invention comprises a semiconductor chip; a substrate arranged on one surface of the semiconductor chip, and electrically connected to the semiconductor chip; an external access part arranged on the other surface of the semiconductor chip, and electrically connected to the outside; a conductive ball arranged on the side part of the semiconductor chip, and electrically connecting the substrate and the external access part; and an encapsulation part molding to integrate the semiconductor chip, the external access part, and the conductive ball, and manufacturing method thereof. COPYRIGHT KIPO 2015 ...

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Номер записи: 33
28-02-2017 дата публикации

PREVENTION AND TREATMENT OF NEURODEGENERATIVE DISEASE THROUGH AUTOPHAGE ACTIVITY MEDIATED BY LIGAND BOUND TO p62 ZZ DOMAIN OR ARGINYLATED BiP

Номер: KR1020170021525A
Автор: KWON YONG TAE, KIM, BO YEON, CHA HYUNJOO, YOO, YOUNG DONG, YU, JI EUN
Принадлежит:

The present invention relates to a pharmaceutical composition for preventing and treating neurodegenerative diseases comprising ligands bound to a ZZ domain of p62 protein as an active ingredient and, more specifically, to a composition for preventing and treating neurodegenerative diseases through autophage activity mediated by ligands bound to a p62 ZZ domain or arginylated BiP. COPYRIGHT KIPO 2017 ...

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Номер записи: 34
15-03-2017 дата публикации

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170029056A
Автор: KWON, YONG TAE, LEE, JUN KYU
Принадлежит:

Disclosed are a wire bond type semiconductor package with a fan-out metal pattern and a manufacturing method thereof. The semiconductor package according to an embodiment of the present invention includes a frame which can transmit an electrical signal between an upper side and a lower side and has a through part, a first semiconductor chip which is received in the through part of the frame, a second semiconductor chip which is mounted on the first semiconductor chip, a wire which electrically connects the first semiconductor chip to a signal part of the frame, a sealing material which molds the frame, the first semiconductor chip, the second semiconductor chip, and the wire to be integrated, and a wiring part which is prepared on the lower sides of the first semiconductor chip and the frame and is electrically connected to the frame. Accordingly, the present invention can process a thin film package through a fan-out package process using the frame instead of a substrate. COPYRIGHT KIPO ...

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Номер записи: 35
10-05-2013 дата публикации

METHOD FOR MANUFACTURING A FANOUT SEMICONDUCTOR PACKAGE USING A LEAD FRAME, AND SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE FOR SAME

Номер: WO2013065895A1
Автор: SOH, Say Hean, SIEW, Yuen Zien, KWON, Yong Tae
Принадлежит:

Disclosed are a method for manufacturing a fanout semiconductor package using a lead frame, and a semiconductor package and a package-on-package for same. To this end, in the method of the present invention, a lead frame is installed at the perimeter of a semiconductor chip in order to realize a fanout semiconductor package structure. Accordingly, a signal lead is used so as to use the lead frame two-dimensionally and three-dimensionally in order to simplify complicated circuit designs and reduce the number of metal layers which are formed. The lead frame can be used as a flat-type connecting terminal or a three-dimensional vertical-type connecting terminal inside the semiconductor package.

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Номер записи: 36
31-05-2018 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME

Номер: WO2018097413A1
Автор: KWON, Yongtae, LEE, Junkyu, LEE, Jaecheon, YOON, Mina
Принадлежит:

A semiconductor package having a molding layer containing conductive powder and a method for producing the semiconductor package are disclosed. The molding layer comprises the conductive powder, and a frame disposed around a semiconductor chip has a thru-via. Due to the molding layer and so forth, the heat generated from the semiconductor chip can be easily emitted and an electromagnetic wave from the outside can be blocked.

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Номер записи: 37
31-05-2018 дата публикации

SEMICONDUCTOR PACKAGE HAVING RELIABILITY AND METHOD FOR PRODUCING SAME

Номер: WO2018097410A1
Автор: KWON, Yongtae, LEE, Junkyu, LEE, Jaecheon, YOON, Mina
Принадлежит:

A semiconductor package having high reliability and a method for producing same are disclosed. An insulation frame accommodating a semiconductor chip and a molding layer has a first thru-hole and a second thru-hole having a larger width than the first thru-hole. The semiconductor chip is disposed via the first thru-hole.

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Номер записи: 38
04-04-2017 дата публикации

블루투스 통신을 이용한 비접촉식 모바일 결제 디바이스를 포함하는 모바일 결제 시스템 및 이를 이용한 모바일 결제데이터 처리방법

Номер: KR0101718789B1
Автор: 신용재, 권용태, 한근석, 김재연, 장승만, 김종각, 박진수
Принадлежит: 김종각, 박진수

... 본 발명은 일측면에서 블루투스 통신을 이용한 비접촉식 모바일 결제 디바이스를 포함하는 모바일 결제 시스템으로, 상기 모바일 결제 시스템은, 사용자 인터페이스를 포함하여 이를 통해 가맹점의 사용자로부터 특정 거래에 대한 결제 관련정보를 입력받아 결제데이터를 처리하고, 상기 결제데이터의 처리를 위한 블루투스 통신모듈을 포함하는 통신모듈 및 센서모듈에 대한 설정을 입력받아 상기 설정 입력에 따라 블루투스 통신모듈 및 센서모듈을 제어하기 위한 명령을 생성하며 블루투스 통신모듈을 통해 사용자 단말과 결제데이터를 송수신하는 모바일 결제 디바이스(100) 및 상기 모바일 결제 디바이스와 블루투스 통신을 통해 상기 특정 거래에 대한 결제데이터를 송수신하고 사용자로부터 결제수단선택 및 사용자식별정보를 입력받고 결제데이터를 처리하여 APP 결제요청으로 상기 특정 거래에 대한 결제 요청을 제1 네트워크를 통해 결제사/금융사 서버(400)로 전송하고 상기 결제사/금융사 서버(400)의 결제 승인 결과(S4)를 수신하여 처리하는 사용자 단말(200)을 포함하여 이루어지며, 제2 네트워크를 통해 모바일 결제 디바이스(100)에서 결제데이터를 수신하여 처리하여 디바이스 결제요청정보로 상기 특정 거래에 대한 결제 요청을 결제사/금융사 시스템(400)에 전송하여 승인 요청하고 결제 승인 결과(D4)를 수신하여 모바일 결제 디바이스(100)에 전달하는 디바이스 플랫폼(300), 및 상기 사용자 단말(200)로부터 결제데이터 APP 결제요청을 제1 네트워크를 통하여 수신하고, 디바이스 플랫폼(300)으로부터 디바이스 결제요청을 수신하여, APP 결제요청 및 디바이스 결제요청에 포함된 데이터를 비교 검증하여, 결제 요청에 대한 승인 여부를 판단하여 결제 승인 결과(S4, D4)로서 각각 사용자 단말(200)과 디바이스 플랫폼(300)으로 전송하는 결제사/금융사 시스템(400)을 포함하여, 상기 사용자 단말의 APP 결제요청에는 상기 사용자 단말의 위치 정보가 포함되고, 상기 디바이스 결제요청에는 ...

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Номер записи: 39
27-09-2018 дата публикации

반도체 패키지의 제조 방법

Номер: KR0101901988B1
Автор: 김남철, 여용운, 권용태, 이영석
Принадлежит: 주식회사 네패스

... 본 발명의 기술적 사상은 트레이에 복수개의 웨이퍼들을 배치하는 단계, 상기 복수개의 웨이퍼들 상에 상기 복수개의 웨이퍼들의 패드를 노출시키는 개구부를 가지는 제1 절연층을 형성하는 단계, 상기 제1 절연층 상에 상기 제1 절연층을 통해 노출된 상기 패드와 연결되는 시드 금속층을 형성하는 단계, 및 상기 시드 금속층 상의 적어도 하나의 지점에 도금 지그를 접촉시켜 상기 시드 금속층 상에 제1 금속층을 형성하는 단계를 포함하는 반도체 패키지의 제조 방법을 제공한다.

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Номер записи: 40
25-07-2018 дата публикации

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Номер: KR1020180084588A
Автор: KIM, NAM CHUL, YEO, YONG WOON, KWON, YONG TAE, LEE, YOUNG SEOK
Принадлежит:

The present invention provides a method for manufacturing a semiconductor package, comprising: a step of arranging a plurality of wafers on a tray; a step of forming a first insulation layer having an opening portion exposing pads of the wafers on the wafers; a step of forming a seed metal layer connected with the pad exposed on the first insulation layer through the first insulation layer; and a step of forming a first metal layer on the seed metal layer by contacting a plating jig on at least one of the seed metal layers, thereby capable of improving productivity of a semiconductor package process. COPYRIGHT KIPO 2018 (S100) Preparing a plurality of wafers (S200) Placing multiple wafers on a tray (S300) Forming an interconnection structure on the wafers (S400) Separating the wafers from the tray (S500) Cutting each of the wafers into a package ...

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Номер записи: 41
07-06-2018 дата публикации

SEMICONDUCTOR PACKAGE PRODUCED BY USING INSULATION FRAME AND PRODUCTION METHOD THEREOF

Номер: KR1020180060890A
Автор: KWON, YONG TAE, LEE, JUN KYU, LEE, JAE CHEON, YOON, MIN A
Принадлежит:

A semiconductor package and a production method thereof are disclosed. An insulation frame accommodating a semiconductor chip and a molding layer has a first through-hole and a second through-hole. The semiconductor chip is disposed in the first through-hole having a larger width than that of the second through-hole. Also, a second insulation frame defining the second through-hole is formed over an upper part of the semiconductor chip. By using the insulation frame, the semiconductor package prevents a mechanical deformation and protects the semiconductor chip from an external environment. COPYRIGHT KIPO 2018 ...

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Номер записи: 42
29-12-2011 дата публикации

NETWORK SYSTEM

Номер: WO2011162556A3
Автор: AHN, Junho, KIM, Yanghwan, LEE, Hoonbong, LEE, Koonseok, KANG, Sunhee, KANG, Seonghwan, KWON, Yongtae, KWON, Jaekuk, KIM, Hoyoung, PARK, Hyoungjun, JUNG, Jimoon, JOO, Younghoon
Принадлежит:

One embodiment of the present invention relates to a network system. The network system, according to the present embodiment, comprises: a first component having a first unique code which performs a predetermined function; and a second component having a second unique code and which exchanges information with the first component for communication-connecting to the first component, wherein when a command for communication-connecting to the first component or a second component is input, the component into which the command is input generates a connection signal, and wherein a communication address and the unique code of each of the components are exchanged between one component that generates the connection signal and another component that receives the connection signal.

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Номер записи: 43
15-05-2017 дата публикации

아르기닌화된 ＥＲ 단백질에 특이적으로 결합하는 항체 및 이의 용도

Номер: KR0101734931B1
Автор: 권용태, 김보연, 차현주, 유영동, 황준성, 김경아, 문수란, 지창훈
Принадлежит: 한국생명공학연구원, 서울대학교산학협력단

... 본 발명은 아르기닌화(arginylation)된 ER 단백질에 특이적으로 결합하는 항체 및 이의 용도에 대한 것으로, ATE1 R-transferase에 의해 ER 단백질의 N-말단에 아르기닌화가 발생하고, 상기 아르기닌화된 ER 단백질은 세포질 정위(cytosolic localization) 및 표적에 대한 자가포식 공포(autophagic vacuoles) 유도하는 내재 면역계(innate immune system)의 부분으로서 세포질(cytosolic)의 dsDNA로 유도되며, 세포질의 dsDNA는 ATE1 의존적으로 ER 단백질의 아르기닌화를 유도하고, 상기 아르기닌화는 세포질에서 미스 폴딩(misfolded) 단백질에 의해 자극되며, 아르기닌화된 ER 단백질은 자가소화작용퇴화(autophagic degradation)을 유도하는 자가포식소체(autophagosome)의 기질로서 표적이 되어 내재 면역계를 유도하므로, 본 발명의 아르기닌화된 ER 단백질 특이적으로 결합하는 항체는 아르기닌화된 ER 단백질을 유의적으로 탐지할 수 있으므로, 면역조절제 스크리닝용 키트, 면역조절제 및 바이러스 치료제 스크리닝 방법에 유용하게 사용될 수 있다.

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Номер записи: 44
12-10-2017 дата публикации

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

Номер: WO2017176020A1
Автор: KWON, Yong-Tae, LEE, Jun-Kyu, LIM, Si Woo, OH, Dong Hoon, MA, Jun Sung, KIM, Tae-Won
Принадлежит:

A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.

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Номер записи: 45
25-07-2018 дата публикации

TRAY FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Номер: KR1020180084589A
Автор: KIM, NAM CHUL, YEO, YONG WOON, KWON, YONG TAE, LEE, YOUNG SEOK
Принадлежит:

Provided is a tray for manufacturing a semiconductor package used in a semiconductor package process. A technical idea of the present invention is the tray for manufacturing a semiconductor package used in a semiconductor package process, in which a plurality of cavities are formed so that a plurality of wafers can be arranged. COPYRIGHT KIPO 2018 ...

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Номер записи: 46
25-07-2018 дата публикации

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Номер: KR1020180084590A
Автор: KIM, NAM CHUL, YEO, YONG WOON, KWON, YONG TAE, LEE, YOUNG SEOK
Принадлежит:

The present invention provides a method for manufacturing a semiconductor package, comprising: a step of arranging a plurality of wafers on a tray; a step of forming an interconnection structure in the tray and the wafers; and a step of separating the wafers from the tray. The present invention includes the step of forming the interconnection structure. Therefore, the present invention is able to improve productivity of a semiconductor package process. COPYRIGHT KIPO 2018 (S100) Preparing a plurality of wafers (S200) Placing multiple wafers on a tray (S300) Forming an interconnection structure on the wafers (S400) Separating the wafers from the tray (S500) Cutting each of the wafers into a package ...

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Номер записи: 47
29-12-2011 дата публикации

NETWORK SYSTEM

Номер: WO2011162576A3
Автор: AHN, Junho, KIM, Yanghwan, LEE, Hoonbong, LEE, Koonseok, KANG, Sangseog, KANG, Sunhee, KANG, Younghyun, KWON, Youngtae, KWON, Jaekuk, MIN, Byeongho, SHIN, Kicheol, SHIN, Dongchun, LIM, Taeyun, JEONG, Shinjae, JO, Kyungeun, CHA, Juyoung, HEO, Sungyong
Принадлежит:

A network system according to one embodiment of the present invention comprises an energy storage unit which comprises at least one component selected from an energy demand-supply unit for receiving a supply of energy and an energy management unit for management of the energy demand-supply unit, and which can adjust the amount of energy usage or the energy-usage charge of the energy demand-supply unit, and can ensure that the amount of energy usage or the energy-usage charge when controlling the component on the basis of data relating to at least the energy cost is lower than the amount of energy usage or the energy-usage charge when controlling the component other than on the basis of data relating to at least the energy cost, and stores energy that will be supplied to the energy demand-supply unit or the energy management unit.

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Номер записи: 48
22-11-2016 дата публикации

MOBILE PAYMENT SYSTEM INCLUDING CONTACTLESS MOBILE PAYMENT DEVICE USING BLUETOOTH COMMUNICATION AND MOBILE PAYMENT DATA PROCESSING METHOD USING SAME

Номер: KR1020160133302A
Автор: SHIN, YONG JAE, KWEON, YONG TAE, HAN, GEUN SEOK, KIM, JAE YEON, JANG, SEUNG MAN, KIM, JONG KAK, PARK, JIN SOO
Принадлежит:

An aspect of the present invention relates to a mobile payment system including a contactless mobile payment device using Bluetooth communication. The mobile payment system separates important payment data by the Bluetooth communication among the payment system, a user terminal, and the mobile payment device, and verifies a payment position, so as to perform a payment process, thereby enhancing security. COPYRIGHT KIPO 2016 (110) Mobile payment device (120) Mobile payment terminal (AA) Motion recognition (BB) Printing device (CC) Power supply (DD) First network (EE) Second network (FF) Input/display device ...

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Номер записи: 49
25-07-2018 дата публикации

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Номер: KR1020180084587A
Автор: KIM, NAM CHUL, YEO, YONG WOON, KWON, YONG TAE, LEE, YOUNG SEOK
Принадлежит:

The present invention relates to a method of manufacturing a semiconductor package, which is capable of improving productivity of a semiconductor package process. The method of manufacturing the semiconductor package includes: a step of preparing a wafer on which a semiconductor device is formed; a first step of forming a first insulation layer on the wafer to expose at least a portion of pads of the semiconductor device; a second step of forming a wiring layer connected with the pads exposed through the first insulation layer; and a third step of forming a second insulation layer on the first insulation layer and the wiring layer to expose a portion of the wiring layer, wherein at least one of the first to third steps is performed in a state in which multiple wafers are arranged in a tray. COPYRIGHT KIPO 2018 (S301) Placing multiple wafers in tray: (S310) Forming first insulation layer on tray and multiple wafers (S320) Forming seed metal layer on first insulation layer and pads of wafers ...

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Номер записи: 50
07-06-2018 дата публикации

SEMICONDUCTOR PACKAGE HAVING RELIABILITY AND METHOD OF MANUFACTURING SAME

Номер: KR1020180060891A
Автор: KWON, YONG TAE, LEE, JUN KYU, LEE, JAE CHEON, YOON, MIN A
Принадлежит:

A semiconductor package having high reliability and a method of manufacturing the same are disclosed. A first through hole and a second through hole having a width greater than that of the first through hole is formed in an insulating frame in which a semiconductor chip and a molding layer are accommodated. The semiconductor chip is disposed through the first through hole. COPYRIGHT KIPO 2018 ...

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Номер записи: 51
26-07-2018 дата публикации

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

Номер: WO2018135706A1
Автор: KIM, Nam Chul, YEO, Yong Woon, KWON, Yong Tae, LEE, Young Seok
Принадлежит:

Provided is a method for producing a semiconductor package, the method according to the technical concept of the present invention comprising the steps of: arranging a plurality of wafers on a tray; forming, on the plurality of wafers, a first insulation layer having openings which expose the pads of the plurality of wafers; forming, on the first insulation layer, a seed metal layer which connects to the pads exposed by the first insulation layer; and forming a first metal layer on the seed metal layer by bringing a plating jig in contact with at least one spot on the latter.

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Номер записи: 52
13-02-2019 дата публикации

칩 패키지 및 그 제조방법

Номер: KR1020190015097A
Автор: 권용태, 이응주, 여용운, 박윤묵, 김효영, 이준규, 천석휘
Принадлежит:

... 패키지의 강도를 향상시키고, 제조 공정을 단순화할 수 있는 칩 패키지 및 이의 제조방법이 개시된다. 이는 칩 상에 접착층을 이용하여 보강층을 추가로 형성하고, 칩과 보강층을 몰딩층을 이용하여 일체화하도록 몰딩함으로써 패키지의 내구성을 향상시킬 수 있다. 또한, 베이스 기판과 재배선층 사이에 솔더볼을 형성하여 몰딩층으로 일체화하는 구조를 취함으로써 패키지의 강도를 향상시킬 수 있으며, 몰딩층으로 폴리이미드(PI)를 사용함으로써 종래와 같이 몰딩층 상에 형성된 별도의 절연층을 소모하지 않고 몰딩층 상에 바로 배선층을 형성할 수 있다.

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Номер записи: 53
10-07-2015 дата публикации

COMPOSITION AND METHOD FOR INHIBITING N-END RULE PATHWAY

Номер: KR1020150080706A
Автор: KWON YONG TAE, LEE, MIN JAE
Принадлежит:

Disclosed are a composition for inhibiting the N-end rule pathway, the composition containing a compound represented by chemical formula 1, or a pharmaceutically acceptable salt thereof; a method for regulating the N-end rule pathway; and a method and a kit for modulating protein denaturation through inhibition of the N-end rule pathway. The composition and method according to the present application can be effectively used to treat or prevent diseases associated with protein denaturation. COPYRIGHT KIPO 2015 ...

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Номер записи: 54
15-02-2016 дата публикации

Method for modulating autophagy mediated by p62 through ZZ domain and its use

Номер: KR0101594168B1
Автор: 권용태, 장준민, 한동훈, 김보연, 차현주, 유지은, 유영동
Принадлежит: 서울대학교산학협력단, 한국생명공학연구원

... 본원은 세포를 p62 단백질, 상기 p62 단백질의 ZZ 영역 또는 상기 ZZ 영역의 128 내지 163 잔기와 상호작용하는 N-end rule 라이겐드와 접촉하는 단계를 포함하는 자가포식 조절 방법 및 그 용도를 개시한다. 본원에 따른 p62를 이용한 N-end rule 경로를 통한 단백질 제거는 변성된 단백질의 비정상적인 축적으로 인한 다양한 질환의 치료 또는 예방을 위한 치료제 개발에 유용하게 사용될 수 있다.

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Номер записи: 55
13-10-2016 дата публикации

SYSTEM-IN-PACKAGE AND METHOD FOR MANUFACTURING SAME

Номер: KR1020160119367A
Автор: LEE, JUN KYU, KWON, YONG TAE
Принадлежит:

The present invention relates to a system-in-package comprising: a first semiconductor die including a plurality of bond pads; a lead frame disposed around the first semiconductor die, and comprising a plurality of signal leads; a second semiconductor die which is wire-bonded, and disposed above the first semiconductor die; and a fan-out metal pattern disposed below the first semiconductor die and the lead frame to electrically connect the bond pads and the signal leads, and including a plurality of metal pads. COPYRIGHT KIPO 2016 ...

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Номер записи: 56
17-11-2016 дата публикации

NON-CONTACT-TYPE MOBILE PAYMENT DEVICE USING BLUETOOTH COMMUNICATION, PAYMENT DATA PROCESSING METHOD OF MOBILE PAYMENT DEVICE, MOBILE PAYMENT SYSTEM COMPRISING NON-CONTACT-TYPE MOBILE PAYMENT DEVICE USING BLUETOOTH COMMUNICATION, AND RECORDING MEDIUM HAVING PROGRAM RECORDED THEREON

Номер: WO2016182308A1
Автор: KIM, Jong Kak, PARK, Jin Soo, SHIN, Yong-Jae, KWEON, Yong Tae, HAN, Geun-Seok, KIM, Jae Yeon, JANG, Seungman
Принадлежит:

The present invention relates to a non-contact-type mobile payment device using Bluetooth communication, a payment data processing method of the mobile payment device, a mobile payment system comprising the non-contact-type mobile payment device using Bluetooth communication, a mobile payment data processing method using same, and a recording medium having the program recorded thereon, wherein, when a payment processing is initiated by an input of a payment amount and a payment method of a user of an affiliated store, a mobile payment device sets a communicable area of a Bluetooth communication module as a short distance which has been adjusted to be shortened, and thus transmits/receives a payment data signal by means of Bluetooth communication with a user terminal.

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Номер записи: 57
30-01-2020 дата публикации

NOVEL P62 LIGAND COMPOUND, AND COMPOSITION CONTAINING SAME FOR PREVENTING, ALLEVIATING, OR TREATING PROTEIN ABNORMALITY DISORDERS

Номер: WO2020022783A9
Автор: KWON, Yong Tae, JI, Chang Hoon, GANIPISETTI, Srinivasrao, KIM, Hee Yeon, MUN, Su Ran, JUNG, Chan Hoon, JUNG, Eui Jung, SUNG, Ki Woon
Принадлежит:

The present invention pertains to: a novel p62 ligand compound or a stereoisomer, solvate, hydrate, or prodrug thereof; and a pharmaceutical or food composition containing same as an active ingredient for preventing or treating protein abnormality disorders. A p62 ligand compound according to the present invention can be useful as a pharmaceutical composition for preventing, alleviating, or treating various protein abnormality disorders by activating intracellular autophagy and selectively removing proteins, organelles, and coagulants in the body.

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Номер записи: 58
26-07-2018 дата публикации

TRAY FOR PRODUCING SEMICONDUCTOR PACKAGE

Номер: WO2018135707A1
Автор: KIM, Nam Chul, YEO, Yong Woon, KWON, Yong Tae, LEE, Young Seok
Принадлежит:

Provided is a tray for producing a semiconductor package, the tray being utilized in a semiconductor package process according to the technical concept of the present invention, wherein the tray is provided with a plurality of cavities so that a plurality of wafers can be placed therein.

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Номер записи: 59
30-06-2016 дата публикации

Semiconductor package and method of manufacturing the same

Номер: KR0101634067B1
Автор: 권용태, 이준규
Принадлежит: 주식회사 네패스

... 반도체 패키지의 상, 하부를 전기적으로 연결하는 도전성 통로가 마련되는 반도체 패키지 및 그 제조방법이 개시된다. 본 발명의 실시예에 따른 반도체 패키지는 반도체 칩과, 반도체 칩이 수용되는 수용부를 포함하는 기판과, 반도체 칩과 기판을 일체화하도록 몰딩하는 봉지재와, 기판을 상하 방향으로 관통하는 관통배선과, 반도체 칩과 관통배선의 일 측을 전기적으로 연결하는 배선부와, 관통배선의 타 측과 전기적으로 연결되고 외부에 전기적으로 접속 가능한 외부접속부를 포함하고, 배선부의 배선층은 관통배선과 접속하도록 마련된다.

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Номер записи: 60
12-04-2016 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

Номер: KR1020160039752A
Автор: KWON, YONG TAE, LEE, JUN KYU
Принадлежит:

Disclosed is a semiconductor packaging having a conductive passage electrically connecting an upper part with a lower part thereof and a method for manufacturing the same. The semiconductor package according to an embodiment of the present invention comprises: a semiconductor chip; a substrate including a reception part where the semiconductor chip is received; an encapsulating material used for integrally molding the semiconductor chip and the substrate; a through wiring vertically passing through the substrate; a wiring part electrically connecting the semiconductor chip to one side of the through wiring; and an outside connection part electrically connected to the other side of the through wiring and capable of electrically accessing the exterior. A wiring layer of the wiring part is provided to be connected to the through wiring. The semiconductor package can be manufactured to be in the shape of a thin film. COPYRIGHT KIPO 2016 ...

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Номер записи: 61
09-04-2015 дата публикации

METHOD FOR REGULATING P62 ZZ DOMAIN-MEDIATED AUTOPHAGY AND USE THEREOF

Номер: WO2015050383A1
Автор: KWON, Yong Tae, JANG, Jun-Min, HAN, Dong Hoon, KIM, Bo Yeon, CHA, Hyunjoo, YU, Ji-Eun
Принадлежит:

The present invention relates to: a method for regulating autophagy comprising a step of making cells come into contact with p62 protein, the ZZ domain of the p62 protein, or an N-end rule ligand interacting with residues 128-163 in the ZZ domain; and a use thereof. A protein removal through an N-end rule pathway by using p62, according to the present invention, can be useful for the development of a therapeutic agent for treating or preventing various diseases caused by the abnormal accumulation of misfolded proteins.

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Номер записи: 62
28-11-2013 дата публикации

SEMICONDUCTOR PACKAGE, FABRICATION METHOD THEREFOR, AND PACKAGE-ON PACKAGE

Номер: WO2013176426A1
Автор: KWON, Yong Tae, PARK, kyung Hoon
Принадлежит:

The present invention provides a method for fabricating a semiconductor package including a penetration wire which is precise and has low process defects. The semiconductor package, according to one embodiment of the present invention, comprises: an insulated substrate including a first penetration unit and a second penetration unit; a penetration wire which fills the first penetration unit and is positioned by penetrating the insulated substrate; a semiconductor chip which is positioned within the second penetration unit and is electrically connected to the penetration wire; a molding member for molding the semiconductor chip and the insulated substrate; and a rewiring pattern layer which is positioned on the lower side of the insulated substrate, and which electrically connects the penetration wire and the semiconductor chip.

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Номер записи: 63
15-03-2017 дата публикации

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170029055A
Автор: KWON, YONG TAE, LEE, JUN KYU
Принадлежит:

Disclosed are a wire-bonded semiconductor package having a fan-out metal pattern and a manufacturing method thereof. The semiconductor package according to an embodiment of the present invention comprises: a frame which can transmit an electrical signal between the upper part and the lower part thereof and has a penetration part formed therein; a first semiconductor chip accommodated in the penetration part; a first encapsulation member molding the frame and the first semiconductor chip to be integrated; a second semiconductor chip stacked on the first semiconductor chip; a wire electrically connecting a signal part of the frame and the second semiconductor chip; a second encapsulation member molding the second semiconductor chip and the wire to be integrated; and a wiring part provided below the frame and the first semiconductor chip and electrically connected to the frame and the first semiconductor chip. COPYRIGHT KIPO 2017 ...

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Номер записи: 64
09-07-2015 дата публикации

COMPOSITION AND METHOD FOR INHIBITING N-END RULE PATHWAY

Номер: WO2015102419A1
Автор: KWON, Yong Tae, LEE, Min Jae
Принадлежит:

Disclosed are a composition for inhibiting the N-end rule pathway, the composition containing a compound of chemical formula 1 or a pharmaceutically acceptable salt thereof; a method for regulating the N-end rule pathway; and a method and kit for modulating protein denaturation through inhibition of the N-end rule pathway. The composition and method according to the present application can be favorably used to treat or prevent diseases associated with protein denaturation.

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Номер записи: 65
11-05-2017 дата публикации

p62 ZZ 도메인에 결합하는 리간드 또는 아르기닌화된 BiP에 의해 매개되는 오토파지 활성을 통한 신경변성 질환 예방 및 치료

Номер: KR0101731908B1
Автор: 권용태, 김보연, 차현주, 유영동, 유지은
Принадлежит: 서울대학교산학협력단, 한국생명공학연구원

... 본 발명의 약물작용 기전 및 핵심적인 기술들은 도 1에 요약되어 있다. 구체적으로, 돌연변이 헌팅틴이나 알파 시뉴클레인 등 악성 변성 단백질들은 서로 엉기면서 올리고머 응고체(①, ②), 섬유질(fibrillar) 응고체(③), 궁극적으로 인클루젼 보디(④)로 자란다. 젊은 신경세포는 BiP 등 소포체 샤프롱들의 N-말단 아르기닌화(⑤)를 통해 Nt-Arg를 다량 만들어내며, 이후 아르기닌화된 BiP(R-BiP)은 세포질로 나와서 변성 단백질과 결합한다(⑥). R-BiP의 Nt-Arg는 리간드로서 p62의 ZZ 도메인에 결합하여(⑦), 평소에 닫혀있는 불활성 형태의 p62가 열린형태로 바뀌면서 구조적인 활성화가 유도됨으로서(⑧), PB1 및 LC3-결합 도메인이 노출된다. PB1 도메인에 의한 올리고머화(⑨)를 기반으로 변성 단백질 응고체와 결합하면서 오토파지 분해가 가능한 응고체, 즉 p62 바디로 농축이 된다(⑩). 이후 p62가 오토파고좀 막에 돌출되어 있는 LC3와 결합을 통해 오토파지 타겟팅(⑪)과 리소좀 단백질 분해가 완료된다. 젊은 신경세포는 단계 ⑤-⑪로 이루어진 오토파지 단백질분해가 강력해서 세포독성 단백질 응고체(①-⑤)가 누적되지 않지만, 노화된 신경세포는 단계 ⑤-⑪의 오토파지 단백질분해가 약화됨으로서 단백질 응고체(①-⑤)가 누적이 되면서 악순환에 빠지게 된다. 본 발명에서는 p62 ZZ 도메인의 저질량 리간드를 이용하여 p62를 인위적으로 활성화하여(⑫, ⑬) 헌팅턴 및 알파 시뉴클레인 단백질 응고체 등을 효과적으로 제거하고자 한다. 구체적으로, 단계 ⑫를 통하여 리간드와 결합한 p62가 p62-R-BiP-변성단백질 올리고머화(⑨) 및 오토파지 응고체 형성(⑩)을 촉진하고자 한다. 또한 단계 ⑬을 통하여 리간드-p62 결합체는 오토파지 활성제로 작용하여(⑭) LC3의 합성, LC3-I의 LC3-II로의 변환 등을 촉진함으로서 오토파고좀 형성을 촉진하고자 한다(⑮).

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Номер записи: 66
12-08-2016 дата публикации

네트워크 시스템

Номер: KR0101648224B1
Автор: 권용태, 정지문, 권재국, 김호영, 주영훈, 강선희
Принадлежит: 엘지전자 주식회사

... 본 발명은 네트워크 시스템에 관한 것이다. 일 측면에 따른 네트워크 시스템은, 에너지발생부가 포함되며, 전기요금 정보 또는 전기요금 이외의 정보가 포함되는 에너지 정보를 송신 가능한 유틸리티 네트워크; 상기 에너지발생부에서 발생된 에너지를 소비하는 하나 이상의 에너지소비부가 포함되며, 상기 에너지 정보를 수신 가능한 가정용 네트워크; 및 상기 유틸리티 네트워크 또는 상기 가정용 네트워크와 통신 가능하며, 상기 에너지 정보의 송신 또는 수신이 가능한 모바일 기기가 포함되며, 상기 모바일 기기는 상기 유틸리티 네트워크 또는 가정용 네트워크를 구성하는 적어도 하나의 컴포넌트의 작동을 제어하는 것을 특징으로 한다.

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Номер записи: 67
30-01-2020 дата публикации

NOVEL AUTOPHAGY-TARGETING CHIMERA (AUTOTAC) COMPOUND, AND COMPOSITION FOR PREVENTING, ALLEVIATING, OR TREATING DISEASES THROUGH TARGET PROTEIN DEGRADATION COMPRISING SAME

Номер: WO2020022785A1
Автор: KWON, Yong Tae, JI, Chang Hoon, GANIPISETTI, Srinivasrao, KIM, Hee Yeon, MUN, Su Ran, JUNG, Chan Hoon, JUNG, Eui Jung, SUNG, Ki Woon
Принадлежит:

The present invention relates to: an autophagy-targeting chimera (AUTOTAC) compound in which a novel p62 ligand and a target-binding ligand are linked by means of a linker, or a stereoisomer, solvate, hydrate, or prodrug of the AUTOTAC compound; and a pharmaceutical or food composition for preventing or treating diseases through target protein degradation comprising same as an active ingredient. The present invention not only allows a concentration adjustment with a specific protein targeted, but also allows delivery of drugs and other low molecular weight compounds to lysosomes. The AUTOTAC compound according to the present invention selectively removes specific proteins and thus can be usefully employed as a pharmaceutical composition for preventing, alleviating, or treating various diseases.

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Номер записи: 68
22-03-2017 дата публикации

MOBILE PAYMENT SYSTEM INCLUDING CONTACTLESS MOBILE PAYMENT DEVICE USING BLUETOOTH COMMUNICATION AND MOBILE PAYMENT DATA PROCESSING METHOD USING SAME

Номер: KR1020170032272A
Автор: SHIN, YONG JAE, KWEON, YONG TAE, HAN, GEUN SEOK, KIM, JAE YEON, JANG, SEUNG MAN, KIM, JONG KAK, PARK, JIN SOO
Принадлежит:

An aspect of the present invention relates to a mobile payment system including a contactless mobile payment device using Bluetooth communication. The mobile payment system according to an embodiment of the present invention includes a mobile payment device (100) which processes payment data and transmits and receives the payment data to and from a user terminal through a Bluetooth communication module, a user terminal (200) which receives a payment approval result (S4) of a payment company/financial company server (400) and processes the payment approval result (S4), a device platform (300) which receives a payment approval result (D4) and transmits the payment approval result (D4) to the mobile payment device (100), and the payment company/financial company server (400) which determines whether to approve a payment request for a specific transaction. Therefore, the present invention can improve convenience and security. COPYRIGHT KIPO 2017 (110) Mobile payment device (120) Mobile payment ...

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Номер записи: 69
19-11-2015 дата публикации

Heterovalent inhibitors targeting N-end Rule Pathway and its use

Номер: KR0101569966B1
Автор: 권용태, 이민재
Принадлежит: 서울대학교산학협력단, 경희대학교 산학협력단

... 본원은 화학식 1의 화합물 및 이를 포함하는 N-end Rule 경로 저해용 조성물을 개시한다. 본원에 따른 화합물은 각각 타입 1 및 타입 2 기질을 인식하는 UBR box와 ClpS box를 갖는 포유동물 N-end rule E3 리가아제의 두 활성부위를 동시에 표적으로하는 헤테로밸런트 저해제로서, 상호협동적으로 작용하여 N-end Rule 경로의 효과적 조절이 가능하여, 단백질 분해 조절 이상과 관련된 질환 예를 들면 심장 질환, 신경 변성 질환의 치료 유용하게 사용될 수 있다.

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Номер записи: 70
23-03-2017 дата публикации

블루투스 통신을 이용한 비접촉식 모바일 결제 디바이스, 상기 모바일 결제 디바이스의 결제데이터 처리방법, 및 사용자 단말에서의 결제데이터 처리방법

Номер: KR0101718793B1
Автор: 신용재, 권용태, 한근석, 김재연, 김종각, 박진수
Принадлежит: 김종각, 박진수

... 본 발명은 일측면에서 블루투스 통신을 이용한 비접촉식 모바일 결제 디바이스에 관한 것으로, 사용자 인터페이스를 포함하여 이를 통해 가맹점의 사용자로부터 결제금액 및 결제방법을 포함하는 결제내용정보를 입력받아 결제정보를 생성하고, 블루투스 통신모듈을 포함하는 통신모듈 및 센서모듈에 대한 설정을 입력받아 상기 설정 입력에 따라 블루투스 통신모듈 및 센서모듈을 제어하기 위한 명령을 생성하며 블루투스 통신모듈을 통해 사용자 단말에 결제정보를 송신하는 모바일 결제 장치와, 상기 모바일 결제 장치와 유무선 통신을 통해 연결되고 블루투스 통신모듈을 포함하여 상기 모바일결제 장치의 명령에 따라 필요한 설정을 변경하며 사용자 단말과 블루투스 통신에 의하여 결제정보 신호를 송신하는 모바일 결제 단말을 포함하여, 상기 모바일 결제 장치는, 상기 가맹점의 사용자의 결제금액 및 결제방법이 입력에 따라 모바일 결제 단말을 통하여 상기 사용자 단말로 블루투스 통신에 의하여 결제정보(D1)를 송신하는 것을 특징으로 한다.

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Номер записи: 71
14-03-2018 дата публикации

반도체 패키지 및 그 제조방법

Номер: KR0101837511B1
Автор: 권용태, 이준규, 임시우, 오동훈, 마준성, 김태원
Принадлежит: 주식회사 네패스

... 팬아웃 구조를 포함하는 반도체 패키지 및 이의 제조방법이 개시된다. 본 발명의 실시예에 따른 반도체 패키지는 절연층과 배선층을 포함하는 배선부와, 배선부 상에 실장되고 배선층과 플립 칩 본딩으로 결합되는 반도체 칩과, 반도체 칩과 배선부 사이를 충진하는 충진부재와, 반도체 칩과 충진부재와 배선부의 일 면을 덮도록 코팅하는 막부재를 포함한다.

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Номер записи: 72
08-03-2018 дата публикации

SYSTEM AND METHOD FOR PROVIDING AR SERVICE USING OBJECT RECOGNITION IN FRANCHISE

Номер: KR1020180024246A
Автор: KIM, JONG KAK, PARK, JIN SOO, HAN, GEUN SEOK, SHIN, YONG JAE, KIM, JAE YEON, KWEON, YONG TAE
Принадлежит:

The present invention provides a system and a method for providing an augmented reality (AR) system using object recognition in a franchise, which can provide various service information provided by a franchise to an AR service. The system for providing an AR service using object recognition in a franchise comprises: a mobile payment device transmitting a beacon signal for providing the service information of the franchise to the AR service through a Bluetooth communication module to a user terminal entering the franchise; the user terminal executing an AR application by using the beacon signal received from the mobile payment device, and overlaying and displaying the service information of the franchise received from an AR server on an execution screen of the AR application; and the AR server detecting franchise object image identification information corresponding to location information of the franchise received from the user terminal according to a request of the user terminal, and ...

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Номер записи: 73
07-06-2018 дата публикации

EMS ANTENNA MODULE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR PACKAGE COMPRISING SAME

Номер: WO2018101767A1
Автор: KWON, Yong-Tae, LEE, Jun-Kyu, LEE, Jae Cheon
Принадлежит:

Disclosed are an EMS antenna module and a semiconductor package comprising the same. According to an embodiment of the present invention, the EMS antenna module comprises: a substrate including an antenna pattern and a via hole; a first sealing material on the upper portion of the substrate; and an emission angle adjustment unit for adjusting a signal emission angle of an antenna. A signal transmission speed can be improved by maintaining an optimum emission angle of an antenna signal through the emission angle adjustment unit of the EMS antenna module, and the semiconductor package comprising the same can normally operate while maintaining unique performance against electromagnetic interference.

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Номер записи: 74
23-02-2017 дата публикации

PREVENTION AND TREATMENT OF NEURODEGENERATIVE DISEASES THROUGH AUTOPHAGY ACTIVITY MEDIATED BY LIGAND OR ARGINYLATED BIP BINDING TO P62 ZZ DOMAIN

Номер: WO2017030292A1
Автор: KWON, Yong Tae, KIM, Bo Yeon, CHA, Hyunjoo, YOO, Young Dong, YU, Ji-eun
Принадлежит:

The drug action mechanisms and core techniques of the present invention are summarized in figure 1. Specifically, malignant denatured proteins, such as mutant Huntingtin protein or α-synuclein, stick together to grow into oligomer aggregates (①, ②), fibrillar aggregates (③), and ultimately inclusion bodies (④). Young neuronal cells produce a large quantity of Nt-Arg through N-terminal arginylation (⑤) of endoplasmic reticulum chaperones, such as BiP, and thereafter, arginylated BiP (R-BiP) comes into the cytoplasm and binds with denatured proteins (⑥). Nt-Arg of R-BiP, as a ligand, binds with the ZZ domain of p62 (⑦) to induce the structural activation of p62 (⑧) while the ordinarily closed inactive form of p62 is changed with an open form thereof, and thus PB1 and LC3-binding domains are exposed. On the basis of oligomerization (⑨) by the PB1 domain, p62 binds with the denatured protein aggregates to be concentrated to autophagically degradable aggregates, that is, p62 bodies (⑩). Thereafter ...

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Номер записи: 75
02-03-2017 дата публикации

TREATMENT AND PREVENTION OF NEURODEGENERATIVE DISEASES THROUGH ACTIVITIES OF AUTOPHAGE MEDIATED BY ARGINATED BiP OR LIGAND BINDING TO p62 ZZ DOMAIN

Номер: KR1020170023045A
Автор: KWON YONG TAE, KIM, BO YEON, CHA HYUNJOO, YOO, YOUNG DONG, YU, JI EUN
Принадлежит:

The present invention relates to treatment and prevention of neurodegenerative diseases through activities of autophage mediated by arginated BiP or ligand binding to p62 ZZ domain. COPYRIGHT KIPO 2017 ...

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Номер записи: 76
27-09-2018 дата публикации

반도체 패키지의 제조 방법

Номер: KR0101901989B1
Автор: 김남철, 여용운, 권용태, 이영석
Принадлежит: 주식회사 네패스

... 본 발명의 기술적 사상은 반소체 소자가 형성된 웨이퍼를 준비하는 단계, 상기 웨이퍼 상에 상기 반도체 소자의 패드의 적어도 일부를 노출시키는 제1 절연층을 형성하는 제1 단계, 상기 제1 절연층 상에 상기 제1 절연층을 통해 노출된 상기 패드와 연결된 배선층을 형성하는 제2 단계, 및 상기 제1 절연층 및 상기 배선층 상에 상기 배선층의 일부를 노출시키는 제2 절연층을 형성하는 제3 단계를 포함하고, 상기 제1 내지 제3 단계 중 적어도 하나는, 복수개의 웨이퍼들을 트레이에 배치한 상태에서 수행하는 반도체 패키지의 제조 방법을 제공한다.

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Номер записи: 77
07-06-2018 дата публикации

SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREOF

Номер: KR1020180060895A
Автор: KWON, YONG TAE, LEE, JUN KYU, LEE, JAE CHEON, YOON, MIN A
Принадлежит:

Disclosed are a semiconductor package having a molding layer containing conductive powder, and a production method thereof. The conductive powder is included in the molding layer, and a through-via is formed in a frame arranged outside a semiconductor chip. Therefore, the heat generated by the semiconductor chip can be easily emitted by the molding layer or the like, and an electromagnetic wave can be shielded from the outside. COPYRIGHT KIPO 2018 ...

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Номер записи: 78
31-05-2018 дата публикации

SEMICONDUCTOR PACKAGE PRODUCED USING INSULATION FRAME, AND METHOD FOR PRODUCING SAME

Номер: WO2018097409A1
Автор: KWON, Yongtae, LEE, Junkyu, LEE, Jaecheon, YOON, Mina
Принадлежит:

A semiconductor package and a method for producing same are disclosed. An insulation frame accommodating a semiconductor chip and a molding layer has a first thru-hole and a second thru-hole. The semiconductor chip is disposed in the first thru-hole having a larger width than the second thru-hole. Also, a second insulation frame defining the second thru-hole is formed over the semiconductor chip.

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Номер записи: 79
29-12-2011 дата публикации

NETWORK SYSTEM

Номер: KR2011162576A2
Автор: AHN, Junho, KIM, Yanghwan, LEE, Hoonbong, LEE, Koonseok, KANG, Sangseog, KANG, Sunhee, KANG, Younghyun, KWON, Youngtae, KWON, Jaekuk, MIN, Byeongho, SHIN, Kicheol, SHIN, Dongchun, LIM, Taeyun, JEONG, Shinjae, JO, Kyungeun, CHA, Juyoung, HEO, Sungyong
Принадлежит:

A network system according to one embodiment of the present invention comprises an energy storage unit which comprises at least one component selected from an energy demand-supply unit for receiving a supply of energy and an energy management unit for management of the energy demand-supply unit, and which can adjust the amount of energy usage or the energy-usage charge of the energy demand-supply unit, and can ensure that the amount of energy usage or the energy-usage charge when controlling the component on the basis of data relating to at least the energy cost is lower than the amount of energy usage or the energy-usage charge when controlling the component other than on the basis of data relating to at least the energy cost, and stores energy that will be supplied to the energy demand-supply unit or the energy management unit.

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Номер записи: 80
21-12-2016 дата публикации

시스템 인 패키지 및 이의 제조방법

Номер: KR0101685068B1
Автор: 이준규, 권용태
Принадлежит: 주식회사 네패스

... 본 발명은 복수의 본드 패드들을 포함하는 제1 반도체 다이, 상기 제1 반도체 다이의 주변에 배치되며, 복수의 신호 리드들을 포함하는 리드 프레임, 상기 제1 반도체 다이 상부에 배치되며, 상기 리드 프레임과 와이어 본딩(wire bonding)된 제2 반도체 다이 및 상기 제1 반도체 다이 및 상기 리드 프레임 하부에 배치되어 상기 본드 패드들 및 상기 신호 리드들을 전기적으로 연결하며, 복수의 금속 패드들을 포함하는 팬아웃 금속 패턴을 포함하는 시스템 인 패키지에 관한 것이다.

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Номер записи: 81
23-03-2017 дата публикации

CONTACTLESS DATA TRANSCEIVING TERMINAL WITH BLUETOOTH COMMUNICATION FUNCTION AND DATA PROCESSING SYSTEM INCLUDING THE SAME

Номер: KR101718795B1
Автор: SHIN, YONG JAE, KWEON, YONG TAE, HAN, GEUN SEOK, KIM, JAE YEON, KIM, JONG KAK, PARK, JIN SOO
Принадлежит: KIM, JONG KAK, PARK, JIN SOO

The present invention relates to a contactless data transceiving terminal with a Bluetooth communication function, the terminal comprising: a first Bluetooth communication module which is connected to a main body of a data processing device via wired/wireless communications to transmit/receive data of information required, includes two or more Bluetooth communication modules to perform a function of transmitting/receiving BLE signals of data of information required for Bluetooth communication with a user terminal, and performs a function of transmitting/receiving BLE signals of data required for Bluetooth communication with a user terminal (300); and a second Bluetooth communication module which transmits a beacon signal to the user terminal, wherein the first Bluetooth communication module and the second Bluetooth communication module are individually controlled according to a command of the main body of the data processing device. COPYRIGHT KIPO 2017 (100a) Device main body I/F (111a) ...

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Номер записи: 82
15-06-2017 дата публикации

DOUBLE-SIDED PCB DRYING APPARATUS IN SLIDE CLAMP FIXING TYPE

Номер: KR101743507B1
Автор: KWON, BYUNG GOO, KWON, YONG TAE
Принадлежит: CHUNBO HI-TECH CO., LTD.

A double-sided PCB drying apparatus in a slide clamp fixing type according to the present invention includes: a slide clamp including a bottom plate extending in a longitudinal direction, a pair of guides coupled to the top surface of the bottom plate to stand in a height direction and supporting a side of a PCB, and a stretching device supporting the guide to move to the left and the right by a certain range; and a slide clamp conveyor rotating while the plurality of slide clamps are mounted and transferring the PCB into the PCB drying apparatus. COPYRIGHT KIPO 2017 ...

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Номер записи: 83
07-06-2018 дата публикации

SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION LINE AND MANUFACTURING METHOD THEREOF

Номер: KR1020180060897A
Автор: KWON, YONG TAE, LEE, JUN KYU, LEE, JAE CHEON, YOON, MIN A
Принадлежит:

Disclosed are a semiconductor package having a redistribution line and a manufacturing method thereof. In the case where a frame has an insulating material or a semiconductor material and a polymer insulating film instead of commonly used SiO_2 is used as an insulating film of a redistribution layer, the polymer insulating film is not easily attached on the frame. To solve the above-mentioned problem, an adhesive buffer layer is introduced on a surface of the frame. COPYRIGHT KIPO 2018 ...

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Номер записи: 84
02-03-2017 дата публикации

CONTACTLESS MOBILE PAYMENT DEVICE USING BLUETOOTH COMMUNICATION, METHOD OF PROCESSING PAYMENT DATA OF MOBILE PAYMENT DEVICE, AND METHOD OF PROCESSING PAYMENT DATA IN USER TERMINAL

Номер: KR1020170022303A
Автор: SHIN, YONG JAE, KWEON, YONG TAE, HAN, GEUN SEOK, KIM, JAE YEON, KIM, JONG KAK, PARK, JIN SOO
Принадлежит:

The present invention relates to a contactless mobile payment device using Bluetooth communication. The contactless mobile payment device using Bluetooth communication comprises: a mobile payment device including a user interface, generating payment information by receiving payment information including payment amount and a payment method through the user interface from a user of an affiliated store, generating a command for controlling a Bluetooth communication module and a sensor module according to a setting input by receiving the setting for the sensor module and the communication module including the Bluetooth communication module, and transferring payment information to the user terminal through the Bluetooth communication module; and a mobile payment terminal changing a setting required according to the command of the mobile payment device and transmitting a payment information signal through the user terminal and the Bluetooth communication by being connected to the mobile payment ...

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Номер записи: 85
26-04-2012 дата публикации

SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SAME

Номер: KR2012053750A1
Автор: KWON, Yong Tae
Принадлежит:

The present invention relates to a semiconductor package comprising: an insulation frame having an opening part formed on the center thereof and a via hole formed around the opening part; a semiconductor chip disposed on the opening; a conductive part filling the via hole; an inner insulation layer formed on the bottom surfaces of the semiconductor chip and the insulation frame so as to expose the bottom surface of the conductive part; and an inner signal pattern formed on the inner insulation layer and electrically connecting the semiconductor chip and the conductive part. The invention further relates to a semiconductor module comprising a vertical stack of a plurality of the semiconductor chip packages, and to a method for manufacturing same. Accordingly, the semiconductor chip packages are vertically stacked, and thus the size of the semiconductor module is reduced, thereby enabling all types of electronic devices to be reduced in weight and efficient in the use of space thereof, and ...

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Номер записи: 86
01-10-2018 дата публикации

DISHWASHER AND CONTROL METHOD THEREOF

Номер: KR1020180106999A
Автор: CHANGWOO SON, JAEGWANG BAE, KIM MINCHUL, YONGTAE KWON, JOON HYUNG KANG
Принадлежит:

The present invention relates to a dishwasher to clean the dishes or cooking appliances by spraying cleaning water and a control method thereof. According to an embodiment of the present invention, a control method of a dishwasher comprises: a water supply step of supplying cleaning water to a sump from an external water source; and an intermittently driving step of intermittently driving a cleaning pump to change a water level around a filter. Therefore, filth blocking the filter can be removed. COPYRIGHT KIPO 2018 (P310) Preliminary washing 1 (P320) Preliminary washing 2 (P330) Preliminary washing 3 (P340) Main washing (P350) Filter washing (P360) Rinsing (P370) Heating and rinsing ...

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Номер записи: 87
03-10-2019 дата публикации

NOVEL COMPOUND AND PHARMACEUTICAL COMPOSITION FOR PREVENTING OR TREATING OBESITY OR METABOLIC SYNDROME COMPRISING SAME

Номер: WO2019190172A1
Автор: KWON, Yong Tae, GANIPISETTI, Srinivasrao, SUNG, Ki Woon, JUNG, Eui Jung, BAE, Tae Hyon, MUN, Su Ran, JUNG, Chan Hoon
Принадлежит:

The present invention is to provide a compound represented by the formula 1 or a pharmaceutically acceptable salt thereof, and a pharmaceutical composition comprising the same, which can be used for preventing or treating obesity or metabolic syndrome.

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Номер записи: 88
30-01-2020 дата публикации

NOVEL P62 LIGAND COMPOUND, AND COMPOSITION CONTAINING SAME FOR PREVENTING, ALLEVIATING, OR TREATING PROTEIN ABNORMALITY DISORDERS

Номер: WO2020022783A1
Автор: KWON, Yong Tae, JI, Chang Hoon, GANIPISETTI, Srinivasrao, KIM, Hee Yeon, MUN, Su Ran, JUNG, Chan Hoon, JUNG, Eui Jung, SUNG, Ki Woon
Принадлежит:

The present invention pertains to: a novel p62 ligand compound or a stereoisomer, solvate, hydrate, or prodrug thereof; and a pharmaceutical or food composition containing same as an active ingredient for preventing or treating protein abnormality disorders. A p62 ligand compound according to the present invention can be useful as a pharmaceutical composition for preventing, alleviating, or treating various protein abnormality disorders by activating intracellular autophagy and selectively removing proteins, organelles, and coagulants in the body.

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Номер записи: 89
30-11-2016 дата публикации

CONTACTLESS GRATITUDE POINT DATA PROCESSING DEVICE USING BLUETOOTH COMMUNICATION, AND GRATITUDE POINT DATA PROCESSING METHOD USING SAME

Номер: KR1020160137363A
Автор: SHIN, YONG JAE, KWEON, YONG TAE, HAN, GEUN SEOK, KIM, JAE YEON, JANG, SEUNG MAN, KIM, JONG KAK, PARK, JIN SOO
Принадлежит:

One aspect of the present invention relates to a contactless gratitude point data processing device using Bluetooth communication. Upon processing of gratitude point data initiated by input of membership service processing information, i.e., input of the amount of payment and input of accumulation or use of gratitude points by a user of an affiliated shop, a data transmission and reception terminal (120) sets a communication coverage area of a Bluetooth communication module to a reduced, adjusted short distance, and transmits and receives gratitude point data to and from a user terminal via Bluetooth communication. A data processing device (110) receives payment-related information from the user of the affiliated shop via a user interface, processes payment data, receives settings about a communication module and a sensor module including the Bluetooth communication module adapted for processing of the payment data, generates commands adapted to control the Bluetooth communication module ...

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Номер записи: 90
25-06-2018 дата публикации

절연 프레임을 이용하여 제조된 반도체 패키지 및 이의 제조방법

Номер: KR0101870157B1
Автор: 권용태, 이준규, 이재천, 윤민아
Принадлежит: 주식회사 네패스

... 반도체 패키지 및 그 제조방법이 개시된다. 반도체 칩과 몰딩층을 수용하는 절연 프레임은 제1 관통공과 제2 관통공을 가진다. 제2 관통공보다 넓은 폭을 가지는 제1 관통공 내에 반도체 칩은 배치된다. 또한, 제2 관통공을 정의하는 제2 절연 프레임은 반도체 칩의 상부에 걸쳐 형성된다.

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Номер записи: 91
27-09-2018 дата публикации

반도체 패키지의 제조 방법

Номер: KR0101901987B1
Автор: 김남철, 여용운, 권용태, 이영석
Принадлежит: 주식회사 네패스

... 본 발명의 기술적 사상은 트레이에 상기 복수개의 웨이퍼들을 배치하는 단계, 상기 트레이 및 상기 복수개의 웨이퍼들 상에 인터커넥션 구조를 형성하는 단계, 및 상기 복수개의 웨이퍼들을 상기 트레이로부터 분리하는 단계를 포함하고, 상기 인터커넥션 구조를 형성하는 단계를 포함하는 반도체 패키지의 제조 방법를 제공한다.

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Номер записи: 92
10-05-2017 дата публикации

디바이스의 제어방법

Номер: KR0101733487B1
Автор: 정신재, 권용태, 김양환, 이훈봉, 차주영
Принадлежит: 엘지전자 주식회사

... 본 발명은 디바아스의 제어방법에 관한 것으로, 보다 구체적으로 특정 시간에 따라 전력정보가 변동되는 전력망 하에서, 상기 전력정보를 인식하고, 축전비용 과 소정금액을 비교하여 축전 여부를 판단함으로써 전기요금을 절약하고 전력을 효율적으로 사용할 수 있는 디바이스의 제어방법에 관한 것이다.

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Номер записи: 93
01-11-2018 дата публикации

METHOD FOR TRANSMITTING PAYMENT DATA THROUGH BLUETOOTH COMMUNICATION, AND PAYMENT DATA TRANSMISSION/RECEPTION TERMINAL AND PAYMENT DATA PROCESSING SYSTEM USING SAME

Номер: WO2018199352A1
Автор: KIM, Jong Kak, PARK, Jin Soo, HAN, Geun-Seok, SHIN, Yong-Jae, KIM, Jae Yeon, KWEON, Yong Tae
Принадлежит:

The present invention provides a method for transmitting data through Bluetooth communication by a payment data processing apparatus, the method comprising: a payment data generation step (S200) for generating payment data according to information input by a user; a BLE transmission data generation step (S300) for generating, from the generated payment data, BLE transmission data to be transmitted using a BLE signal; and a BLE signal transmission step (S400) for transmitting a BLE signal which is used for transmission of the generated BLE transmission data; wherein: the BLE transmission data comprises advertising data of BLE communication; in the BLE transmission data generation step (S300), the advertising data is generated to include the payment data; and in the BLE signal transmission step (S400), the BLE signal including an advertising packet of the advertising data is transmitted.

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Номер записи: 94
18-12-2017 дата публикации

반도체 패키지 및 그 제조방법

Номер: KR0101809521B1
Автор: 권용태, 이준규
Принадлежит: 주식회사 네패스

... 팬아웃 금속 패턴이 형성된 와이어 본드형 반도체 패키지 및 이의 제조방법이 개시된다. 본 발명의 실시예에 따른 반도체 패키지는 상부와 하부 사이에 전기적 신호의 전달이 가능하고 관통부가 형성되는 프레임과, 관통부에 수용되는 제1 반도체 칩과, 프레임과 제1 반도체 칩을 일체화하도록 몰딩하는 제1 봉지재와, 제1 반도체 칩 상에 적층되는 제2 반도체 칩과, 제2 반도체 칩과 프레임의 신호부를 전기적으로 연결하는 와이어와, 제2 반도체 칩과 와이어를 일체화하도록 몰딩하는 제2 봉지재와, 프레임과 제1 반도체 칩의 하부에 마련되고 프레임과 제1 반도체 칩과 전기적으로 연결되는 배선부를 포함한다.

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Номер записи: 95
02-11-2017 дата публикации

ELECTRONIC DEVICE INCLUDING NEAR FIELD COMMUNICATIONS MODULE, AND METHOD FOR CONTROLLING NEAR FIELD COMMUNICATIONS MODULE IN ELECTRONIC DEVICE

Номер: KR1020170121645A
Автор: KIM, JONG KAK, PARK, JIN SOO, HAN, GEUN SEOK, SHIN, YONG JAE, KIM, JAE YEON, KWEON, YONG TAE
Принадлежит:

The present invention relates to an electronic device including a near field communications module, and a method for controlling a near field communications module in the electronic device. The electronic device of the present invention comprises: a storage unit for storing program information for a plurality of applications transmitting and receiving data to and from a near field wireless communications device during an execution; at least one near field wireless communications module for providing near field wireless communications with the near field wireless communications device for transmitting and receiving the data or information required when at least one of the applications is executed; and a near field communications integrated control module for controlling a scan operation of a first near field wireless communications module for a near field wireless communications signal from the near field wireless communications device in accordance with a scan period for the near field ...

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Номер записи: 96
08-11-2017 дата публикации

근거리 무선통신 모듈을 포함하는 전자 장치 및 전자 장치에서 근거리 무선통신 모듈을 제어하는 방법

Номер: KR0101795248B1
Автор: 김종각, 박진수, 한근석, 신용재, 김재연, 권용태
Принадлежит: 김종각, 박진수

... 본 발명은, 근거리 무선통신 모듈을 포함하는 전자 장치 및 전자 장치에서 근거리 무선통신 모듈을 제어하는 방법에 관한 것으로, 상기 전자 장치는 실행시 근거리 무선통신 장치와 데이터를 송수신하는 복수의 애플리케이션에 대한 프로그램 정보를 저장하는 저장부; 상기 복수의 애플리케이션들 중 적어도 하나의 애플리케이션의 실행 시 요구되는 데이터 또는 정보의 송수신을 위한 근거리 무선통신 장치와의 근거리 무선통신을 제공하는 하나 이상의 근거리 무선통신 모듈; 및 상기 하나 이상의 근거리 무선통신모듈의 근거리 무선통신 장치로부터의 근거리 무선통신 신호에 대한 스캔 주기에 따라 근거리 무선통신 장치로부터의 근거리 무선통신 신호에 대한 제1 근거리 무선통신 모듈의 스캔 동작을 제어하는 근거리 무선통신 통합제어 모듈;을 포함하는 것을 특징으로 한다.

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Номер записи: 97
12-09-2016 дата публикации

반도체 패키지 및 그 제조방법

Номер: KR0101656269B1
Автор: 권용태, 이준규, 강성철
Принадлежит: 주식회사 네패스

... 반도체 칩과 실장 소자를 함께 패키징하는 반도체 패키지가 개시된다. 본 발명의 실시예에 따른 반도체 패키지는 반도체 칩과, 회로가 형성되는 기판 상에 제1실장 소자가 실장되는 실장 블록과, 반도체 칩과 실장 블록을 전기적으로 연결하는 배선부를 포함한다.

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Номер записи: 98
28-10-2016 дата публикации

MOTOR FOR FACILITY

Номер: KR101669876B1
Автор: KIM, BYOUNG KWEON, HAN, YOUNG SIK, KWON, YONG TAE, KIM, JOO SEOB, YOO, KYUN HO, KIM, KYUNG HAK
Принадлежит: HYOSUNG CORPORATION

According to an aspect of the present invention, a motor for a facility includes: a power generation unit which generates power to be supplied to a facility; a protection case embedded with the power generation unit to protect the same; a support leg unit connected to the protection case and fixing the protection case onto a facility; a mirror leg unit connected to the protection case on the opposite side of the support leg unit in a shape symmetric to the support leg unit; multiple radiating pins formed in a shape of being stretched toward the outside from an outer surface of the protection case; and a guide plate in contact with terminals of the radiating pins and formed in a shape of enclosing the terminals. COPYRIGHT KIPO 2016 ...

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Номер записи: 99
07-06-2018 дата публикации

SEMICONDUCTOR PACKAGE USING INSULATION FRAME AND PRODUCTION METHOD THEREOF

Номер: KR1020180060889A
Автор: KWON, YONG TAE, LEE, JUN KYU, LEE, JAE CHEON, YOON, MIN A
Принадлежит:

A semiconductor package using an insulation frame and a production method thereof are disclosed. The insulation frame has a through-hole formed therein and has first and second inclined surfaces laterally protruding towards the through-hole. The stress can be uniformly dispersed along the first and second inclined surfaces when the thermal stress is generated by thermal expansion and thermal contraction. COPYRIGHT KIPO 2018 ...

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Номер записи: 100