16-08-2017 дата публикации
Номер: KR1020170093394A
Принадлежит:
The present invention relates to a method of manufacturing a curved board and a circuit board using the same. According to the present invention, in manufacturing the curved board which maintains flexibility having a predetermined curvature, a sheet member made of a prepreg material is pressure-molded above a predetermined temperature (for example, 70°C) in a molding portion or one or more reinforced sheets made of a thermosetting resin are stacked on the sheet member made of a prepreg material, and then the sheet member is pressure-molded above a predetermined temperature (for example, 70°C) in the molding portion, such that the curved board which maintains flexibility having a predetermined curvature is manufactured, and a circuit forming portion is formed on one or both surfaces of the curved board, thereby enabling distribution of the curved circuit boards (PCB). In addition, flexibility of the curved board is prevented from deforming even if the thermosetting resin contained in the ...
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