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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 6. Отображено 6.
23-02-2016 дата публикации

BREAKING DEVICE

Номер: KR1020160020351A
Автор: SUZUKI MINORU
Принадлежит:

The present invention is to provide a breaking device which divides a wafer by using a ring frame according to the size of the wafer. The breaking device (10) comprises: a chuck table (11) which holds a work set (1); a pressurizing member (14) which pressurizes a wafer (W) along a division planned line (S) of the wafer (W) held by the chuck table (11); an index transport means (16) which relatively index-transports the chuck table (11) and the pressurizing member (14); a pressurizing means (15) which allows the pressurizing member (14) to approach or to be separated from the wafer (W) in a vertical direction to pressurize the wafer (W) by the pressurizing member (14); and a porous plate (17) which is depressed by the pressurizing of the pressurizing member (14) and is formed with a predetermined hardness. Accordingly, when the wafer held on an absorption face (111a) through the porous plate (17) is pressurized by the pressurizing member (14), the porous plate (17) is depressed along the ...

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05-07-2016 дата публикации

EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, HARDENED MATERIAL THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE

Номер: KR0101636587B1
Принадлежит: 히타치가세이가부시끼가이샤

... 본 발명은, 다가 카르복실산 무수물 및 수산기가 550mgKOH/g 이하의 수지상 고분자를 포함하고, 바람직하게는 상기 수지상 고분자의 중량 평균 분자량이 2000 이하인 에폭시 수지 경화제에 관한 것이고, 이것에 의해, 저점도로 취급성이 양호한 에폭시 수지 조성물이 얻어지고, 또한 착색이 적고, 내크랙성 및 투명성이 뛰어난 경화물이 얻어진다.

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22-07-2015 дата публикации

CUTTING METHOD

Номер: KR1020150084645A
Принадлежит:

The present invention is to provide a cutting method capable of dividing a workpiece which is made of a difficult to cut material such as sapphire, etc. without abnormal abrasion of a cutting blade. The cutting method includes a cutting transport process, an x-axis returning transport process, and a z-axis pitching process. In the cutting transport process, the cutting blade (21) which descends as a predetermined amount along a z-axis and is rotated to cut at a predetermined depth (H) for a workpiece (W) while the cutting blade (21) and a chuck table (10) are relatively cut and move as a first transport amount (D1) in an x-axis direction. Therefore, the workpiece (W) is cut as the first transport amount (D1) along a division planning line. In the x-axis returning transport process, the cutting blade (21) and the chuck table (10) are relatively returned in the x-axis direction and a opposite direction with the cutting transport process as a second transport amount (D2) than the first transport ...

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22-09-2015 дата публикации

APPARATUS AND METHOD FOR PROCESSING WAFER

Номер: KR1020150106833A
Автор: SUZUKI MINORU
Принадлежит:

The purpose of the present invention is to provide an apparatus and a method for processing a wafer to effectively radiate an ultraviolet ray without increasing the area of an apparatus. A cleaning device (1) as a wafer processing device includes a support table (20) which supports a wafer (W), and a cleaning and drying unit which cleans and dries the surface (WS) of the wafer (W) on the support table (20). The support table (20) comprises a support member (21) and an ultraviolet ray radiation part (23). The support member (21) has a support surface (21a) which has absorption holes (24) for absorbing and supporting the back side (WR) of the wafer (W) and supports the entire backside (WR), and is made of a material which transmits an ultraviolet ray. The ultraviolet ray radiation part (23) is arranged in the opposite side to the support surface (21a) of the support member (21). COPYRIGHT KIPO 2015 ...

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08-02-2019 дата публикации

배선 기판의 가공 방법

Номер: KR1020190012206A
Принадлежит:

... 본 발명의 배선 기판의 가공 방법은, 기판 위에 국소적으로 배치된 도체부가, 필러를 이루는 무기 부재가 유기 부재에 분산하여 이루어지는 수지부로 피복된 구성을 포함하는 배선 기판의 가공 방법으로서, 애싱법을 이용하여 상기 수지부의 표층측으로부터 상기 유기 부재를 제거하고, 웨트 세정법을 이용하여 상기 유기 부재가 제거된 수지부의 표층측에 잔존하는 상기 무기 부재를 제거한다.

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17-12-2015 дата публикации

RETURNING DEVICE

Номер: KR1020150141134A
Автор: SUZUKI MINORU
Принадлежит:

The present invention aims to provide a returning device which can improve the workability. The returning device of the present invention is a returning device which returns a processed item mounted on a ring-shaped frame through a tape attached to the back surface, and comprises: a returning arm; a returning head mounted on the returning arm; and, a moving means for moving the returning head. The returning head comprises: a supporting member attached to the returning arm; one or more pair of first adsorbing pads attached to the supporting member to be distanced for the distance corresponding to a first diameter of a first ring-shaped frame having the first diameter, which has a first adsorption maintaining surface for adsorbing and maintaining the first ring-shaped frame; and, one or more pair of second adsorbing pads attached to the supporting member to be distanced for the distance corresponding to a second diameter of a second ring-shaped frame having the second diameter, which is greater ...

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