Настройки

Укажите год
-

Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

Подробнее
-

Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

Подробнее

Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Укажите год
Укажите год
Применить Всего найдено 7. Отображено 7.
05-12-2017 дата публикации

다파장 광 주사 간섭계를 이용한 3차원 형상 측정장치

Номер: KR0101804527B1
Автор: 김기영, 윤종극, 유상혁, 박윤창
Принадлежит: 주식회사 미르기술, 선문대학교 산학협력단

... 본 발명은 다파장 광 주사 간섭계를 이용한 3차원 형상 측정장치에 관한 것으로서, 적어도 2개 이상의 서로 다른 파장대역의 광을 조사하는 광원과, 상기 광원에서 조사된 광을 분리하는 광 분리기, 상기 광 분리기의 하단에 배치되어 상기 광 분리기에서 반사된 광이 조사되는 시료, 상기 광분리기에서 투과된 광의 경로 상에 배치되고, 상기 광의 파장대역 개수에 상응하는 개수의 기준광을 제공하는 기준 거울부, 상기 시료에서 반사된 측정광과 상기 기준 거울부에서 반사된 기준광들을 수신하고, 수신된 이미지를 파장대역별로 분리하여 출력하는 측정부 및, 상기 측정부로부터 제공되는 측정광과 기준광에 의해 생성된 서로 다른 파장대역별 간섭 이미지를 분석함으로써, 서로 다른 높이 영역에 대한 측정 시료의 높이를 동시에 계산하는 3차원 형상 생성 단말을 포함하여 구성되고, 상기 측정 시료를 측정 시료의 전체 높이 보다 작은 이동 범위에서 높이 방향으로 이동시키면서 높이 측정 과정을 반복적으로 수행하되, 상기 파장대역 개수가 많을수록 측정 시료의 이동 범위가 보다 작게 설정되는 것을 특징으로 한다.본 발명에 따르면, 스캔 시간이 현저하게 감소됨에 따라 검사시간이 단축되고 그에 따라 수율이 현저하게 향상됨과 아울러, 스캔을 위한 시료 또는 기준 거울의 이동거리가 감소됨에 따라 구동계 제작 비용이 감소되어 제조원가를 낮출 수 있는 효과가 있다.

Подробнее
Номер записи: 1
29-11-2017 дата публикации

THREE-DIMENSIONAL SHAPE MEASURING APPARATUS USING MULTI-WAVELENGTH LIGHT SCANNING INTERFEROMETRY

Номер: KR1020170131084A
Автор: KIM, KI YOUNG, YUN, JONG KUK, YOO, SANG HYUK, PARK, YOON CHANG
Принадлежит:

The present invention relates to a three-dimensional shape measuring apparatus using a multi-wavelength light scanning interferometer, comprising: a light source to irradiate light of at least two or more different wavelength bands; a light separator to separate light emitted from the light source; a sample disposed on a lower end of the light separator, and irradiated with light reflected from the light separator; a reference mirror unit disposed on a path of light transmitted through the light separator providing a number of reference light corresponding to the number of wavelength bands of the light; and a measuring unit to receive a measured light reflected from a sample and the reference light reflected from the reference mirror unit, and separating the received images for each wavelength band. According to the present invention, as a scan time is significantly reduced, an inspection time is shortened and a yield remarkably improved. Moreover, as a moving distance of the sample or ...

Подробнее
Номер записи: 2
29-11-2017 дата публикации

COMPOSITE INSPECTION APPARATUS USING MULTI-OPTICAL SYSTEM

Номер: KR1020170131085A
Автор: KIM, KI YOUNG, YUN, JONG KUK, YOO, SANG HYUK, PARK, YOON CHANG
Принадлежит:

The present invention relates to a composite inspection apparatus using a multi-optical system, comprising: a first measurement light input unit to irradiate a sample with measurement light of a first wavelength band; a first optical filter to selectively transmit only measurement light of the first wavelength band; and a first measurement system to reflect a reflected light image of the first wavelength band passing through the first optical filter, which measures a three-dimensional shape of an object using a first optical measurement method. The composite inspection apparatus using the multi-optical system further comprises: a second measurement light input unit to irradiate the sample with measurement light of a second wavelength band; a second optical filter to selectively transmit only measurement light of the second wavelength band; and a second measurement system to acquire a reflected light image of the second wavelength band passing through the second optical filter, which measures ...

Подробнее
Номер записи: 3
07-10-2015 дата публикации

COMPACT SUBSTRATE VISION INSPECTION APPARATUS

Номер: KR101557783B1
Автор: JANG, SEONG GUK, KIM, KI YOUNG, YU, STEVE, PAK, CHAN WHA
Принадлежит: MIRTEC CO., LTD.

A vision inspection apparatus according to the present invention is a compact substrate vision inspection apparatus which takes an image of a substrate on which components are mounted and then compares the taken image with a previously input target image to determine whether an object for inspection is good or not, the apparatus comprising: a stage portion for accommodating various components of the vision inspection device; a transfer member which receives a substrate at an upper portion of the station portion to transfer the substrate to the next processing device; an inspection member which is configured to move in a direction (Y direction) vertical to the movement direction (X direction) of the transfer member; a vision processing unit which reads the image taken by a camera unit included in the inspection member and determines whether the inspected object is good or not; a defective substrate discharging member for discharging a substrate determined as a defective substrate by the ...

Подробнее
Номер записи: 4
31-01-2013 дата публикации

CUTTING APPARATUS FOR AN LED MATERIAL AND METHOD FOR CUTTING THE LED MATERIAL

Номер: WO2013015470A1
Автор: YOO, Sang Hyuk
Принадлежит:

The present invention relates to a cutting apparatus for an LED material, and to a method for cutting the LED material, and more particularly, to a cutting apparatus for an LED material, and to a method for cutting the LED material, which increase the speed at which the LED material is cut while simultaneously preventing burrs from being formed on individual LED units that are cut.

Подробнее
Номер записи: 5
08-12-2016 дата публикации

METHOD FOR BONDING FLEXIBLE PRINTED CIRCUIT BOARD

Номер: KR1020160141015A
Автор: PAK, CHAN WHA, JANG, SEONG GUK, YOO, SANG HYUK
Принадлежит:

The present invention relates to a method for bonding a flexible printed circuit board, in which an ultrasonic wave is applied rather than heat when bonding a flexible printed circuit board and a substrate together, and which implements each step for the bonding by using a rotating plate, thereby reducing costs and improving productivity. The method for bonding a flexible printed circuit board comprises the steps of loading, aligning, ultrasonic wave processing, and unloading. At the step of loading, a substrate and a flexible printed circuit board to be bonded to the substrate are loaded. At the step of aligning, the loaded substrate and the loaded flexible printed circuit board are rotated in a rotation direction, are photographed, and are aligned by using a photographed image. At the step of ultrasonic wave processing, the aligned substrate and the aligned flexible printed circuit board are rotated, and the flexible printed circuit board is bonded to the substrate by applying an ultrasonic ...

Подробнее
Номер записи: 6
08-12-2016 дата публикации

DEVICE FOR BONDING FLEXIBLE PRINTED CIRCUIT BOARD

Номер: KR1020160141014A
Автор: PAK, CHAN WHA, JANG, SEONG GUK, YOO, SANG HYUK
Принадлежит:

The present invention relates to a device for bonding a flexible printed circuit board, capable of improving productivity and reducing costs. According to the present invention, the device for bonding a flexible printed circuit board includes: a loading and unloading unit, an aligning unit, an ultrasonic processing unit, and a rotation unit. The loading and unloading unit loads a substrate and the flexible printed circuit board to be bonded to the substrate or unloads the substrate to which the flexible printed circuit board is bonded. The aligning unit is aligned to be separated from the loading and unloading unit in a rotation direction and has an aligning camera photographing the flexible printed circuit board and the substrate to align the flexible printed circuit board and the substrate. The ultrasonic processing unit is arranged to be separated from the aligning unit in the rotation direction and applies ultrasonic waves to the flexible printed circuit board to bond the flexible printed ...

Подробнее
Номер записи: 7