26-10-2017 дата публикации
Номер: KR101790546B1
The present invention relates to a pick and place system for a wafer ring frame type and, more specifically, relates to the pick and place system for a wafer ring frame type to independently control transfer, inspection, classification, and loading of materials such as semiconductor packages by using a plurality of picker modules mounted on a pick and place system. Particularly, according to the present invention, the system is divided into a plurality of areas, and each area is independently controlled. Accordingly, work can be performed more smoothly, and materials can be easily detached and picked up in the course of unloading materials passing through a sputtering process in a wafer ring frame type, thereby preventing the materials from being damaged. Accordingly, it is possible to improve reliability and competitiveness in the fields of semiconductors and semiconductor package manufacturing, particularly, sputtering processing, pick and place system, and a detaching module used therein ...
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