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Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 44. Отображено 44.
02-06-2016 дата публикации

CUSTOMIZED MODULE LID

Номер: US20160157359A1
Автор: Amilcar R. Arvelo, Michael J. Ellsworth, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro, ARVELO AMILCAR R, ELLSWORTH MICHAEL J, MCKEEVER ERIC J, NGUYEN THONG N, SEMINARO EDWARD J, ARVELO AMILCAR R., ELLSWORTH MICHAEL J., MCKEEVER ERIC J., NGUYEN THONG N., SEMINARO EDWARD J.
Принадлежит:

A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components. 1. A method comprising:providing a module base, wherein the module base includes a base pocket, the base pocket is an opening in the module base on a top surface of the module base, and the base pocket has a depth extending into the module base that is less than a thickness of the module base;placing a first thermal interface material (TIM) in the base pocket, wherein the first TIM is on a bottom surface of the base pocket;placing a multichip module (MCM) on the module base, wherein the MCM includes a substrate, a first component, a second component and a target component, the first component is a component on a bottom surface of the substrate, the second component and target component are components on a top surface of the substrate, the first component has a corresponding base pocket and fits inside of the corresponding base pocket, the first TIM is between the bottom surface of the base pocket and a bottom surface of the first component, and the bottom surface of the substrate directly contacts a top surface of the module base;providing a temporary lid, wherein the temporary lid includes, a viewing window, a datum window and a temporary pocket, the viewing window and the datum window are openings extending from a top surface of the temporary lid to a bottom surface of the temporary lid, the temporary pocket is an opening in the temporary lid on the bottom surface of the temporary lid, and the temporary pocket has a depth extending into the temporary lid that is less than a thickness of the temporary lid;placing the temporary lid on the ...

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Номер записи: 1
26-02-2015 дата публикации

FABRICATING THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FOR COOLING ELECTRONICS CARD(S)

Номер: US20150052754A1
Автор: Amilcar R. ARVELO, Levi A. CAMPBELL, Michael J. ELLSWORTH, JR., Eric J. McKEEVER, Richard P. SNIDER, ARVELO AMILCAR R, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, SNIDER RICHARD P, ARVELO AMILCAR R., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J., SNIDER RICHARD P.
Принадлежит:

Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided which include: coupling a thermal transfer structure configured to one or more sides of an electronics card having one or more electronic components to be cooled, the thermal transfer structure including a thermal spreader coupled to the one side of the electronics card; and disposing a coolant-cooled structure adjacent to the socket of the electronic system, the coolant-cooled structure including one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket, and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s). 1. A method comprising: [ 'a thermal spreader coupled to the one side of the electronics card; and', 'coupling a thermal transfer structure to at least one side of an electronics card comprising one or more electronic components to be cooled, the electronics card operatively docking within a socket of an electronic system, and the thermal transfer structure including, at least one cold rail sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and', 'at least one coolant-carrying channel associated with the at least one cold rail for removing heat from the at least one cold rail to coolant flowing through the at least one coolant-carrying channel., 'disposing a coolant-cooled structure adjacent to the socket of the electronic system within which the electronics card is to operatively dock, the coolant-cooled structure including], 'providing a cooing apparatus, the providing including2. The method of claim 1 , wherein the at least one cold rail comprises at ...

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Номер записи: 2
26-02-2015 дата публикации

FABRICATING MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING

Номер: US20150055299A1
Автор: Amilcar R. ARVELO, Levi A. CAMPBELL, Michael J. ELLSWORTH, JR., Eric J. McKEEVER, ARVELO AMILCAR R, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, ARVELO AMILCAR R., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J.
Принадлежит:

Methods for fabricating a coolant-cooled component assembly are provided, which include providing a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold. 1. A method comprising:providing a multi-component assembly comprising multiple electronic components disposed on a substrate; a module lid comprising multiple openings through the module lid aligned over the multiple electronic components of the multi-component assembly;', 'multiple thermally conductive elements disposed within the multiple openings in the module lid, one thermally conductive element of the multiple thermally conductive elements comprising a coolant-cooled surface and a conduction surface, the coolant-cooled surface and the conduction surface being opposite surfaces of the one thermally conductive element, and the conduction surface being thermally coupled via a thermal conduction path to one electronic component of the multiple electronic components of the multi-component assembly;, 'providing a module lid assembly, the module lid assembly comprisingdisposing an inner manifold element over the lid assembly, ...

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Номер записи: 3
17-05-2016 дата публикации

Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)

Номер: US0009341418B2
Автор: Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Michael J. Ellsworth, Jr., Randall G. Kemink, Eric J. McKeever, ARVELO AMILCAR R, BRANDON MARK A, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, KEMINK RANDALL G, MCKEEVER ERIC J, ARVELO AMILCAR R., BRANDON MARK A., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., KEMINK RANDALL G., MCKEEVER ERIC J.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

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Номер записи: 4
16-10-2014 дата публикации

SEPARABLE AND INTEGRATED HEAT SINKS FACILITATING COOLING MULTI-COMPNENT ELECTRONIC ASSEMBLY

Номер: US20140307389A1
Автор: Amilcar R. ARVELO, Levi A. CAMPBELL, Michael J. ELLSWORTH, Jr., Eric J. McKEEVER, ARVELO AMILCAR R, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, ARVELO AMILCAR R., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Cooling apparatuses and methods of fabrication thereof are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.

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Номер записи: 5
16-06-2016 дата публикации

CUSTOMIZED MODULE LID

Номер: US20160172259A1
Автор: Amilcar R. Arvelo, Michael J. Ellsworth, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro, ARVELO AMILCAR R, ELLSWORTH MICHAEL J, MCKEEVER ERIC J, NGUYEN THONG N, SEMINARO EDWARD J, ARVELO AMILCAR R., ELLSWORTH MICHAEL J., MCKEEVER ERIC J., NGUYEN THONG N., SEMINARO EDWARD J.
Принадлежит:

A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components. 115-. (canceled)16. A structure comprising:a module base having a base pocket, wherein the base pocket is an opening in the module base on a top surface of the module base, and the base pocket has a depth extending into the module base that is less than a thickness of the module base;a multichip module (MCM) on the module base, wherein the MCM includes a substrate, a first component on a bottom surface of the substrate and a target component on a top surface of the substrate, the bottom surface of the substrate is directly on the top surface of the module base, and the first component is in the base pocket;a first thermal interface material (TIM) between the first component and a bottom surface of the base pocket;a custom lid on the MCM, wherein the custom lid includes a custom pocket, the custom pocket is an opening in the custom lid on a bottom surface of the custom lid, the custom pocket has a depth extending into the custom lid that is less than a thickness of the custom lid, and the custom pocket has an inside surface with a same profile as a target component surface profile; anda second TIM between the target component and the custom pocket.17. The structure of claim 16 , wherein the custom lid is a cold plate.18. The structure of claim 16 , wherein the module base includes a slot and the custom lid includes a corresponding fin claim 16 , and the fin fits inside of the slot.19. The structure of claim 16 , wherein the substrate is an organic laminate.20. The structure of claim 16 , wherein the module base and the custom lid are aluminum ...

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Номер записи: 6
18-04-2006 дата публикации

Method and structure for cooling a dual chip module with one high power chip

Номер: US0007031162B2
Автор: Amilcar R. Arvelo, Kamal Kumar Sikka, Hilton T. Toy, ARVELO AMILCAR R, SIKKA KAMAL KUMAR, TOY HILTON T, ARVELO AMILCAR R., TOY HILTON T.
Принадлежит: International Business Machines Corporation, IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION

Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mates to a heat sink with the smallest interface gap. The variable and higher gaps between the lower power spreaders and the heat sink base are accommodated by compressible thermal pad or grease materials.

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Номер записи: 7
04-09-2014 дата публикации

THERMAL TRANSFER STRUCTURE WITH IN-PLANE TUBE LENGTHS AND OUT-OF-PLANE TUBE BEND(S)

Номер: US2014246174A1
Автор: ARVELO AMILCAR R, BRANDON MARK A, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, ARVELO AMILCAR R., BRANDON MARK A., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J.
Принадлежит:

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

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Номер записи: 8
29-03-2016 дата публикации

Methods of fabricating a coolant-cooled electronic assembly

Номер: US0009298231B2
Автор: Amilcar R. Arvelo, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever, Richard P. Snider, ARVELO AMILCAR R, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, SNIDER RICHARD P, ARVELO AMILCAR R., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J., SNIDER RICHARD P.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM

Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided, which include providing a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The method further includes providing a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and providing a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the ...

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Номер записи: 9
19-03-2015 дата публикации

FABRICATING SEPARABLE AND INTEGRATED HEAT SINKS FACILITATING COOLING MULTI-COMPONENT ELECTRONIC ASSEMBLY

Номер: US20150075755A1
Автор: Amilcar R. ARVELO, Levi A. CAMPBELL, Michael J. ELLSWORTH, JR., Eric J. McKEEVER, ARVELO AMILCAR R, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, ARVELO AMILCAR R., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J.
Принадлежит:

Methods of fabricating cooling apparatus are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink. 1. A method comprising:providing a first liquid-cooled heat sink comprising at least one coolant-carrying first channel, the first liquid-cooled heat sink being separably coupled to an electronic assembly comprising at least one first electronic component and at least one second electronic component, and facilitating removal of heat generated by at the least one first electronic component;providing a second liquid-cooled heat sink comprising at least one coolant-carrying second channel, the second liquid-cooled heat sink being fixedly secured to the electronic assembly, and facilitating removal of heat generated by the at least one second electronic component; andproviding fluid couplers fluidically coupling the first and second liquid-cooled heat sinks and facilitating liquid coolant flow through the at least one coolant-carrying second channel of the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.2. The method of claim 1 , wherein the fluid couplers project from one of the first liquid-cooled heat sink or the second ...

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Номер записи: 10
28-08-2014 дата публикации

THERMAL TRANSFER STRUCTURE(S) AND ATTACHMENT MECHANISM(S) FACILITATING COOLING OF ELECTRONICS CARD(S)

Номер: US20140238640A1
Автор: Amilcar R. ARVELO, Levi A. CAMPBELL, Michael J. ELLSWORTH, JR., Eric J. McKEEVER, Richard P. SNIDER, ARVELO AMILCAR R, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, SNIDER RICHARD P, ARVELO AMILCAR R., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J., SNIDER RICHARD P.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The cooling apparatus further includes a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.

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Номер записи: 11
11-09-2014 дата публикации

MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING

Номер: US2014254098A1
Автор: ARVELO AMILCAR R, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, ARVELO AMILCAR R., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J.
Принадлежит:

A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant ...

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Номер записи: 12
22-09-2015 дата публикации

Selective clamping of electronics card to coolant-cooled structure

Номер: US0009144178B2
Автор: Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Tan D. Doan, Michael J. Ellsworth, Jr., Randall G. Kemink, Eric J. McKeever, ARVELO AMILCAR R, BRANDON MARK A, CAMPBELL LEVI A, DOAN TAN D, ELLSWORTH JR MICHAEL J, KEMINK RANDALL G, MCKEEVER ERIC J, ARVELO AMILCAR R., BRANDON MARK A., CAMPBELL LEVI A., DOAN TAN D., ELLSWORTH, JR. MICHAEL J., KEMINK RANDALL G., MCKEEVER ERIC J.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of ...

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Номер записи: 13
02-06-2016 дата публикации

TAPERING COUPLERS FOR CONNECTING FLUID FLOW COMPONENTS

Номер: US20160153595A1
Автор: Amilcar R. ARVELO, Michael J. ELLSWORTH, Jr., Eric J. McKEEVER, ARVELO AMILCAR R, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, ARVELO AMILCAR R., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J.
Принадлежит:

Tapering couplers and coupling methods for connecting fluid flow components are provided. In one embodiment, the tapering coupler includes a housing with a first opening and a second opening in fluid communication through the housing. The first opening is sized for a first fluid flow component to couple to the housing, and the second opening for a second fluid flow component. The first and second fluid flow components include first and second fluid-carrying channels of different diameter, with the first fluid-carrying channel having a first channel diameter that is larger than the second channel diameter of the second fluid-carrying channel. A tapering element is associated with the housing and extends into the first fluid-carrying channel. The tapering element includes a tapering fluid-carrying channel which tapers in a direction back towards the housing, for instance, from about the first channel diameter to about the second channel diameter. 1. A method comprising: providing a housing with a first opening and a second opening in fluid communication through the housing, the first opening being sized for the first fluid flow component to couple to the housing, and the second opening being sized for the second fluid flow component to couple to the housing, the first fluid flow component and the second fluid flow component comprising a first fluid-carrying channel and a second fluid-carrying channel, respectively, the first fluid-carrying channel having a first channel diameter and the second fluid-carrying channel having a second channel diameter, wherein the first channel diameter is larger than the second channel diameter; and', 'providing a tapering element associated with the housing and configured to extend into the first fluid-carrying channel of the first fluid flow component when the first fluid flow component is coupled to the housing, with the first fluid-carrying channel of the first fluid flow component and the first opening of the housing in fluid ...

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Номер записи: 14
28-01-2010 дата публикации

SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT

Номер: US2010019377A1
Автор: ARVELO AMILCAR R, COLGAN EVAN G, MAGERLEIN JOHN H, MARSTON KENNETH C, RIVERA KATHRYN C, SIKKA KAMAL K, WAKIL JAMIL A, WEI XIAOJIN, ZITZ JEFFREY A, ARVELO AMILCAR R., COLGAN EVAN G., MAGERLEIN JOHN H., MARSTON KENNETH C., RIVERA KATHRYN C., SIKKA KAMAL K., WAKIL JAMIL A., ZITZ JEFFREY A.
Принадлежит:

An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.

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Номер записи: 15
19-02-2015 дата публикации

FABRICATING THERMAL TRANSFER STRUCTURE(S) AND ATTACHMENT MECHANISM(S) FOR COOLING ELECTRONICS CARD(S)

Номер: US20150047809A1
Автор: Amilcar R. ARVELO, Levi A. CAMPBELL, Michael J. ELLSWORTH, Jr., Eric J. McKEEVER, Richard P. SNIDER, ARVELO AMILCAR R, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, SNIDER RICHARD P, ARVELO AMILCAR R., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J., SNIDER RICHARD P.
Принадлежит:

Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided, which include providing a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The method further includes providing a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and providing a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure. 1. A method comprising: [ a thermal spreader configured to couple to the at least one side of the electronics card; and', 'at least one coolant-carrying channel associated with the thermal spreader for removing heat from the thermal spreader to coolant flowing through the at least one coolant-carrying channel;, 'providing a thermal transfer structure configured to couple to at least one side of an electronics card comprising one or more electronic components to be cooled, the electronics card operatively docking within a socket of an electronic system, and the thermal transfer structure comprising, 'positioning a coolant manifold structure adjacent to the socket of the electronic system within which the electronics card is to operatively dock; and', 'providing a fluidic and mechanical attachment mechanism which selectively, fluidically and mechanically couples or decouples the thermal transfer structure and coolant ...

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Номер записи: 16
28-08-2014 дата публикации

THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FACILITATING COOLING OF ELECTRONICS CARD(S)

Номер: US20140240930A1
Автор: Amilcar R. ARVELO, Levi A. CAMPBELL, Michael J. ELLSWORTH, JR., Eric J. McKEEVER, Richard P. SNIDER, ARVELO AMILCAR R, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, SNIDER RICHARD P, ARVELO AMILCAR R., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J., SNIDER RICHARD P.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s). 1. A cooling apparatus comprising: 'a thermal spreader coupled to the one side of the electronics card; and', 'a thermal transfer structure coupled to at least one side of an electronics card comprising one or more electronic components to be cooled, the electronics card operatively docking within a socket of an electronic system, and the thermal transfer structure comprising at least one cold rail sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and', 'at least one coolant-carrying channel associated with the at least one cold rail for removing heat from the at least one cold rail to coolant flowing through the at least one coolant-carrying channel., 'a coolant-cooled structure disposed adjacent to the socket of the electronic system within which the electronics card is to operatively dock, the coolant-cooled structure comprising2. The cooling apparatus of claim 1 , wherein the at least one cold rail comprises at least one low-profile cold rail ...

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Номер записи: 17
26-02-2015 дата публикации

SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE

Номер: US20150052753A1
Автор: Amilcar R. ARVELO, Mark A. BRANDON, Levi A. CAMPBELL, Tan D. DOAN, Michael J. ELLSWORTH, Jr., Randall G. KEMINK, Eric J. McKEEVER, ARVELO AMILCAR R, BRANDON MARK A, CAMPBELL LEVI A, DOAN TAN D, ELLSWORTH JR MICHAEL J, KEMINK RANDALL G, MCKEEVER ERIC J, ARVELO AMILCAR R., BRANDON MARK A., CAMPBELL LEVI A., DOAN TAN D., ELLSWORTH, JR. MICHAEL J., KEMINK RANDALL G., MCKEEVER ERIC J.
Принадлежит:

Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure. 1. A method comprising: 'a clamping structure movable between an opened position and a clamped position; and', 'providing a thermal transfer structure configured to couple to an electronics card and facilitate transfer of heat from the electronics card, the thermal transfer structure comprisingproviding a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card is to be operatively inserted, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure of the thermal transfer structure when the thermal transfer structure is coupled to the electronics card and the electronics card is operatively inserted into the receiving slot of the electronic system, wherein the opened position of the clamping structure facilitates insertion of the electronics card into the electronic system with the coolant-cooled ...

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Номер записи: 18
08-12-2015 дата публикации

Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly

Номер: US0009210831B2
Автор: Amilcar R. Arvelo, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever, ARVELO AMILCAR R, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, MCKEEVER ERIC J, ARVELO AMILCAR R., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., MCKEEVER ERIC J.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM

Cooling apparatuses are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.

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Номер записи: 19
19-04-2011 дата публикации

Segmentation of a die stack for 3D packaging thermal management

Номер: US0007928562B2
Автор: Amilcar R. Arvelo, Evan G. Colgan, John H. Magerlein, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jeffrey A. Zitz, ARVELO AMILCAR R, COLGAN EVAN G, MAGERLEIN JOHN H, MARSTON KENNETH C, RIVERA KATHRYN C, SIKKA KAMAL K, WAKIL JAMIL A, WEI XIAOJIN, ZITZ JEFFREY A, ARVELO AMILCAR R., COLGAN EVAN G., MAGERLEIN JOHN H., MARSTON KENNETH C., RIVERA KATHRYN C., SIKKA KAMAL K., WAKIL JAMIL A., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION

An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.

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Номер записи: 20
26-02-2015 дата публикации

FABRICATING THERMAL TRANSFER STRUCTURE WITH IN-PLANE TUBE LENGTHS AND OUT-OF-PLANE TUBE BEND(S)

Номер: US20150053388A1
Автор: Amilcar R. ARVELO, Mark A. BRANDON, Levi A. CAMPBELL, Michael J. ELLSWORTH, JR., Randall G. KEMINK, Eric J. McKEEVER, ARVELO AMILCAR R, BRANDON MARK A, CAMPBELL LEVI A, ELLSWORTH JR MICHAEL J, KEMINK RANDALL G, MCKEEVER ERIC J, ARVELO AMILCAR R., BRANDON MARK A., CAMPBELL LEVI A., ELLSWORTH, JR. MICHAEL J., KEMINK RANDALL G., MCKEEVER ERIC J.
Принадлежит:

Methods of fabricating cooling apparatuses are provided, which include providing a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths. 1. A method comprising: a thermal spreader; and', multiple tube lengths disposed substantially in a common plane; and', 'at least one out-of-plane tube bend, one out-of-plane tube bend of the at least one out-of-plane tube bend coupling in fluid communication a first tube length and a second tube length of the multiple tube lengths, the one out-of-plane tube bend extending out-of-plane from the multiple tube lengths disposed in the common plane., 'at least one coolant-carrying tube coupled to and in thermal contact with the thermal spreader, the at least one coolant-carrying tube comprising], 'providing a thermal transfer structure, the thermal transfer structure comprising2. The method of claim 1 , wherein the first tube length and the second tube length are spaced apart claim 1 , with a third tube length of the multiple tube lengths disposed therebetween.3. The method of claim 2 , wherein the at least one coolant-carrying tube further comprises at least one in-plane tube bend claim 2 , one in-plane tube bend of the at least one in-plane tube ...

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Номер записи: 21
04-09-2014 дата публикации

SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE

Номер: US2014247555A1
Автор: ARVELO AMILCAR R, BRANDON MARK A, CAMPBELL LEVI A, DOAN TAN D, ELLSWORTH JR MICHAEL J, KEMINK RANDALL G, MCKEEVER ERIC J, ARVELO AMILCAR R., BRANDON MARK A., CAMPBELL LEVI A., DOAN TAN D., ELLSWORTH, JR. MICHAEL J., KEMINK RANDALL G., MCKEEVER ERIC J.
Принадлежит:

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of ...

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Номер записи: 22
18-02-2016 дата публикации

MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING

Номер: US20160050790A1
Автор: ARVELO Amilcar R., CAMPBELL Levi A., ELLSWORTH, JR. Michael J., McKeever Eric J.
Принадлежит:

A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold. 1. A coolant-cooled electronic module comprising:a multi-component assembly comprising multiple electronic components disposed on a substrate; a module lid comprising multiple openings through the module lid, each opening being aligned over a respective electronic component of the multiple electronic components of the multi-component assembly;', 'multiple thermally conductive elements disposed within the multiple openings in the module lid, each thermally conductive element of the multiple thermally conductive elements comprising a coolant-cooled surface and a conduction surface, the coolant-cooled surface and the conduction surface being opposite surfaces of the thermally conductive element, and the conduction surface being coupled to the respective electronic component of the multiple electronic components of the multi-component assembly;, 'a module lid assembly, the module lid assembly comprisingan inner manifold element disposed over the lid assembly, the ...

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Номер записи: 23
17-03-2016 дата публикации

COMPUTE INTENSIVE MODULE PACKAGING

Номер: US20160079140A1
Автор: ARVELO Amilcar R., Ellsworth Michael J., McKeever Eric J., Nguyen Thong N., Seminaro Edward J.
Принадлежит:

A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system. 1. A package for an integrated circuit chip module comprising:a generally planar substrate having first and second opposing surfaces;a plurality of integrated circuit chips mounted on said first surface of said substrate;a first heat sink in thermal communication with at least one of said plurality of integrated circuit chips; anda second heat sink located opposite said first heat sink with respect to said substrate, at least a portion of said first heat sink being in contact with a portion of said second heat sink, said first and second heat sinks together substantially surrounding said integrated circuit chips.2. The package of wherein said first heat sink is a cold plate.3. The package of wherein said cold plate has first and second opposing surfaces claim 2 , said first surface of said cold plate being in thermal communication with the at least one of said plurality of integrated circuit chips claim 2 , said second surface of said cold plate having a groove formed therein in a serpentine pattern claim 2 , and copper tubing pressed into said groove to receive a ...

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Номер записи: 24
17-03-2016 дата публикации

Compute intensive module packaging

Номер: US20160081197A1
Автор: Amilcar R. Arvelo, Edward J. Seminaro, Eric J. McKeever, Michael J. Ellsworth, Thong N. Nguyen
Принадлежит: International Business Machines Corp

A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.

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Номер записи: 25
11-04-2019 дата публикации

CUSTOMIZED MODULE LID

Номер: US20190109058A1
Автор: ARVELO Amilcar R., Ellsworth Michael J., McKeever Eric J., Nguyen Thong N., Seminaro Edward J.
Принадлежит:

A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components. 1. A method comprising:placing a multichip module (MCM) on a module base, wherein the MCM includes a substrate and a target component, the target component is on a top surface of the substrate, and a bottom surface of the substrate is in direct contact with a top surface of the module base;providing a temporary lid including a viewing window, wherein the viewing window is an opening extending from a top surface of the temporary lid to a bottom surface of the temporary lid;placing the temporary lid on the MCM, wherein the target component fits inside of the viewing window, and the bottom surface of the temporary lid is on the top surface of the substrate;mapping a surface profile of the target component through the viewing window; andproviding a custom lid having a custom pocket, wherein the custom pocket is an opening in the custom lid on a bottom surface of the custom lid, the custom pocket has a depth extending into the custom lid that is less than a thickness of the custom lid, and the custom pocket has an inside surface with a same profile as the target component surface profile.2. The method of claim 1 , wherein the target component includes an application-specific integrated circuits.3. The method of claim 1 , wherein the target component is measured using an optical process.4. The method of claim 1 , wherein the custom lid is a cold plate.5. The method of claim 1 , wherein the module base includes a slot and the custom lid includes a corresponding fin claim 1 , and the corresponding fin fits inside of the slot.6. The method of claim 1 ...

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Номер записи: 26
04-09-2014 дата публикации

THERMAL TRANSFER STRUCTURE WITH IN-PLANE TUBE LENGTHS AND OUT-OF-PLANE TUBE BEND(S)

Номер: US20140246174A1
Автор: ARVELO Amilcar R., Brandon Mark A., CAMPBELL Levi A., ELLSWORTH, JR. Michael J., McKeever Eric J.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths. 1. A cooling apparatus comprising: a thermal spreader; and', multiple tube lengths disposed substantially in a common plane; and', 'at last one out-of-plane tube bend, one out-of-plane tube bend of the at last one out-of-plane tube been coupling in fluid communication a first tube length and a second tube length of the multiple tube lengths, the one out-of-plane tube bend extending out-of-plane from the multiple tube lengths disposed in the common plane., 'at least one coolant-carrying tube coupled to and in thermal contact with the thermal spreader, the at least one coolant-carrying tube comprising], 'a thermal transfer structure, the thermal transfer structure comprising2. The cooling apparatus of claim 1 , wherein the first tube length and the second tube length are spaced apart claim 1 , with a third tube length of the multiple tube lengths disposed therebetween.3. The cooling apparatus of claim 2 , wherein the at least one coolant-carrying tube further comprises at least one in-plane tube bend claim 2 , one in-plane tube bend of the ...

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Номер записи: 27
04-09-2014 дата публикации

SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE

Номер: US20140247555A1
Автор: ARVELO Amilcar R., Brandon Mark A., CAMPBELL Levi A., DOAN Tan D., ELLSWORTH, JR. Michael J., Kemink Randall G., McKeever Eric J.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure. 1. A cooling apparatus comprising: 'a clamping structure movable between an opened position and a clamped position; and', 'a thermal transfer structure configured to couple to an electronics card and facilitate transfer of heat from the electronics card, the thermal transfer structure comprisinga coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card is to be operatively inserted, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure of the thermal transfer structure when the thermal transfer structure is coupled to the electronics card and the electronics card is operatively inserted into the receiving slot of the electronic system, wherein the opened position of the clamping structure facilitates insertion of the electronics card into the electronic system with the coolant- ...

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Номер записи: 28
11-09-2014 дата публикации

MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING

Номер: US20140254098A1
Автор: ARVELO Amilcar R., CAMPBELL Levi A., ELLSWORTH, JR. Michael J., McKeever Eric J.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.

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Номер записи: 29
24-11-2016 дата публикации

COUPLING ASSEMBLIES FOR CONNECTING FLUID-CARRYING COMPONENTS

Номер: US20160341342A1
Автор: ARVELO Amilcar R., Benner Alan F., ELLSWORTH, JR. Michael J., McKeever Eric J.
Принадлежит:

Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting. 1. A method comprising: providing a socket fitting with a first opening and a second opening in fluid communication through the socket fitting, the first opening being sized to accommodate a portion of a first fluid-carrying component therein, and the second opening being sized to accommodate a portion of a second fluid-carrying component therein;', 'providing a sleeve, the sleeve encircling the socket fitting at least in part, and being rotatable relative to the socket fitting, the sleeve comprising a first locking feature; and', 'providing a second locking feature associated with one fluid-carrying component of the first and second fluid-carrying components, the second locking feature being positioned and sized to engage the first locking feature when the one fluid-carrying component is inserted into a respective opening of the first and second openings in the socket fitting, and wherein, once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket ...

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Номер записи: 30
24-11-2016 дата публикации

Coupling assemblies for connecting fluid-carrying components

Номер: US20160345466A1
Автор: Alan F. Benner, Amilcar R. Arvelo, Eric J. McKeever, Michael J. Ellsworth, Jr.
Принадлежит: International Business Machines Corp

Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.

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Номер записи: 31
10-12-2015 дата публикации

Selective clamping of electronics card to coolant-cooled structure

Номер: US20150359140A1
Автор: Amilcar R. Arvelo, Eric J. McKeever, Levi A. Campbell, Mark A. Brandon, Michael J. Ellsworth, Jr., Randall G. Kemink, Tan D. DOAN
Принадлежит: International Business Machines Corp

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.

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Номер записи: 32
15-12-2016 дата публикации

Tapering couplers for connecting fluid flow components

Номер: US20160363243A1
Автор: Amilcar R. Arvelo, Eric J. McKeever, Michael J. Ellsworth, Jr.
Принадлежит: International Business Machines Corp

Tapering couplers and coupling methods for connecting fluid flow components are provided. In one embodiment, the tapering coupler includes a housing with a first opening and a second opening in fluid communication through the housing. The first opening is sized for a first fluid flow component to couple to the housing, and the second opening for a second fluid flow component. The first and second fluid flow components include first and second fluid-carrying channels of different diameter, with the first fluid-carrying channel having a first channel diameter that is larger than the second channel diameter of the second fluid-carrying channel. A tapering element is associated with the housing and extends into the first fluid-carrying channel. The tapering element includes a tapering fluid-carrying channel which tapers in a direction back towards the housing, for instance, from about the first channel diameter to about the second channel diameter.

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Номер записи: 33
20-12-2018 дата публикации

Coupling assemblies for connecting fluid-carrying components

Номер: US20180368285A1
Автор: Alan F. Benner, Amilcar R. Arvelo, Eric J. McKeever, Michael J. Ellsworth, Jr.
Принадлежит: International Business Machines Corp

Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.

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Номер записи: 34
20-12-2018 дата публикации

COUPLING ASSEMBLIES FOR CONNECTING FLUID-CARRYING COMPONENTS

Номер: US20180368286A1
Автор: ARVELO Amilcar R., Benner Alan F., ELLSWORTH, JR. Michael J., McKeever Eric J.
Принадлежит:

Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting. 1. An apparatus comprising: a socket fitting with a first opening and a second opening in fluid communication through the socket fitting, the first opening being sized to accommodate a portion of a first fluid-carrying component therein, and the second opening being sized to accommodate a portion of a second fluid-carrying component therein;', 'a sleeve, the sleeve encircling the socket fitting at least in part, and being rotatable relative to the socket fitting, the sleeve comprising a first locking feature;', 'a second locking feature associated with one fluid-carrying component of the first and second fluid-carrying components, the second locking feature being positioned and sized to engage the first locking feature when the one fluid-carrying component is inserted into a respective opening of the first and second openings in the socket fitting, and wherein, once engaged, rotating of the sleeve facilitates locking the first and second locking features together to secure the one fluid-carrying component to the socket fitting;', ' ...

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Номер записи: 35
15-11-2016 дата публикации

Customized module lid

Номер: US9496194B2
Автор: Amilcar R. Arvelo, Edward J. Seminaro, Eric J. McKeever, Michael J. Ellsworth, Thong N. Nguyen
Принадлежит: International Business Machines Corp

A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

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Номер записи: 36
09-02-2016 дата публикации

Selective clamping of electronics card to coolant-cooled structure

Номер: US9258925B2
Автор: Amilcar R. Arvelo, Eric J. McKeever, Levi A. Campbell, Mark A. Brandon, Michael J. Ellsworth, Jr., Randall G. Kemink, Tan D. DOAN
Принадлежит: International Business Machines Corp

Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure.

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Номер записи: 37
14-11-2017 дата публикации

Compute intensive module packaging

Номер: US09818667B2
Автор: Amilcar R. Arvelo, Edward J. Seminaro, Eric J. McKeever, Michael J. Ellsworth, Thong N. Nguyen
Принадлежит: International Business Machines Corp

A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.

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Номер записи: 38
23-05-2017 дата публикации

Multi-component electronic module with integral coolant-cooling

Номер: US09661784B2
Автор: Amilcar R. Arvelo, Eric J. McKeever, Levi A. Campbell, Michael J. Ellsworth, Jr.
Принадлежит: International Business Machines Corp

A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.

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Номер записи: 39
07-03-2017 дата публикации

Selective clamping of electronics card to coolant-cooled structure

Номер: US09591787B2
Автор: Amilcar R. Arvelo, Eric J. McKeever, Levi A. Campbell, Mark A. Brandon, Michael J. Ellsworth, Jr., Randall G. Kemink, Tan D. DOAN
Принадлежит: International Business Machines Corp

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.

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Номер записи: 40
15-11-2016 дата публикации

Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)

Номер: US09497888B2
Автор: Amilcar R. Arvelo, Eric J. McKeever, Levi A. Campbell, Michael J. Ellsworth, Jr., Richard P. SNIDER
Принадлежит: International Business Machines Corp

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The cooling apparatus further includes a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.

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Номер записи: 41
08-11-2016 дата публикации

Compute intensive module packaging

Номер: US09490188B2
Автор: Amilcar R. Arvelo, Edward J. Seminaro, Eric J. McKeever, Michael J. Ellsworth, Thong N. Nguyen
Принадлежит: International Business Machines Corp

A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.

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Номер записи: 42
27-09-2016 дата публикации

Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly

Номер: US09456527B2
Автор: Amilcar R. Arvelo, Eric J. McKeever, Levi A. Campbell, Michael J. Ellsworth, Jr.
Принадлежит: International Business Machines Corp

Methods of fabricating cooling apparatus are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink.

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Номер записи: 43
27-09-2016 дата публикации

Pluggable module for heat removal device

Номер: US09453972B1
Автор: Alan F. Benner, Amilcar R. Arvelo, David P. GRAYBILL, Eric J. McKeever, Michael J. Ellsworth
Принадлежит: International Business Machines Corp

A pluggable module is provided and includes a plug receptacle in which a plug is receivable, a housing coupled to the plug receptacle, a heat removal device partially disposable within the housing to assume and be movable between first and second positions and an armature. The armature is interposed between corresponding portions of the housing and the heat removal device and is configured for selective manipulation to thereby move the heat removal device from the second position to the first position. With the plug received in the plug receptacle and the heat removal device in the first position, the heat removal device forms a thermal pathway with the plug by which heat is removed from the plug.

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Номер записи: 44