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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 79. Отображено 79.
27-12-2012 дата публикации

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

Номер: US20120326294A1
Автор: KAMAL K. SIKKA, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz, SIKKA KAMAL K, TOY HILTON T, TUNGA KRISHNA R, ZITZ JEFFREY A, SIKKA KAMAL K., TOY HILTON T., TUNGA KRISHNA R., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant. 1. A method , comprising: 'placing a chip shim on the one or more chips on the chip carrier;', 'adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier, the adjusting comprising 'lowering the lid until the one or more pistons contact the chip shim;', 'placing a seal shim between a lid and the chip carrier, the seal shim being thicker than the chip shim;'} 'fixing the one or more pistons to the lid in the displaced position;', 'displacing the one or more pistons and lid individually until full surface contact with both the chip shim and the seal shim is established;'}separating the lid and the chip carrier;removing the chip shim and the seal shim;dispensing thermal interface material on the one or more chips and lowering the lid until a gap filled with the thermal interface material between the one or more chips and the one or more pistons is about a particle size of the thermal interface material; andsealing the lid to the chip carrier with sealant between the lid and the chip carrier.2. The method of claim 1 , further comprising aligning the one or more pistons of the lid in ...

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Номер записи: 1
08-03-2007 дата публикации

LAND GRID ARRAY INTERPOSER COMPRESSIVE LOADING SYSTEM

Номер: US2007052111A1
Автор: LONG DAVID C, BRODSKY WILLIAM L, MILLER JASON S, TOROK JOHN G, ZITZ JEFFREY A, LONG DAVID C., BRODSKY WILLIAM L., MILLER JASON S., TOROK JOHN G., ZITZ JEFFREY A.
Принадлежит:

An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.

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Номер записи: 2
18-10-2005 дата публикации

Method and apparatus to form a reworkable seal on an electronic module

Номер: US0006955543B2
Автор: Gaetano P. Messina, Patrick A. Coico, Lewis S. Goldmann, Richard F. Indyk, Vladimir Jambrih, Jeffrey A. Zitz, MESSINA GAETANO P, COICO PATRICK A, GOLDMANN LEWIS S, INDYK RICHARD F, JAMBRIH VLADIMIR, ZITZ JEFFREY A, MESSINA GAETANO P., COICO PATRICK A., GOLDMANN LEWIS S., INDYK RICHARD F., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION

A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.

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Номер записи: 3
20-02-2014 дата публикации

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

Номер: US20140051211A1
Автор: Suresh D. KADAKIA, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ, KADAKIA SURESH D, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, KADAKIA SURESH D., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips. 1. A method comprising:mounting a plurality of chips on a chip carrier;positioning a lid over the chip carrier;placing at least one single piston in a hole in the lid, such that the at least one piston is aligned with the plurality of chips, the at least one single piston having a continuous surface on a single plane;providing a thermal interface material (TIM) along an entirety of a length of the continuous surface of the at least one single piston; andmounting the lid on the chip carrier using a bonding material or seal.2. The method of claim 1 , further comprising planarizing an upper surface of the at least one single piston with an upper surface of the lid.3. The method of claim 1 , wherein the aligning the at least one single piston with the plurality of chips comprises overlapping edges of the plurality of chips with the continuous surface of the at least one single piston.4. The method of claim 1 , further comprising fixing the at least one single piston to the lid with material deposited between the lid and the at least one single piston.5. The method of claim 4 , wherein the material that fixes the at least one single piston to the lid comprises one of adhesive claim 4 , epoxy claim 4 , and solder.6. The method of claim 4 , further comprising attaching the lid to the chip carrier with an adhesive or sealant.7. The method of claim 6 , wherein the fixing the at least one single piston to the lid is by one of adhesive claim 6 , epoxy and solder.8. The method of claim 1 , wherein the aligning the at least one single piston with the plurality of chips comprises ...

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Номер записи: 4
29-05-2008 дата публикации

IC CHIP PACKAGE HAVING FORCE-ADJUSTABLE MEMBER BETWEEN STIFFENER AND PRINTED CIRCUIT BOARD

Номер: US2008123311A1
Автор: GOLDMANN LEWIS S, ZITZ JEFFREY A, GOLDMANN LEWIS S., ZITZ JEFFREY A.
Принадлежит:

An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an underside of the PCB; and at least two couplers for coupling the metal stiffener to a lid or a heat sink, with the PCB, the chip carrier and the LGA connector therebetween. The force-adjustable member reduces the required assembly forces and accommodates natural and non-systematic out-of flatness tolerances of the PCB and the chip carrier.

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Номер записи: 5
17-07-2014 дата публикации

DISASSEMBLABLE ELECTRONIC ASSEMBLY WITH LEAK-INHIBITING COOLANT CAPILLARIES

Номер: US20140198452A1
Автор: Thomas J. BRUNSCHWILER, Evan G. COLGAN, Michael J. ELLSWORTH, JR., Werner ESCHER, Ingmar MEIJER, Stephen PAREDES, Gerd SCHLOTTIG, Jeffrey A. ZITZ, BRUNSCHWILER THOMAS J, COLGAN EVAN G, ELLSWORTH JR MICHAEL J, ESCHER WERNER, MEIJER INGMAR, PAREDES STEPHEN, SCHLOTTIG GERD, ZITZ JEFFREY A, BRUNSCHWILER THOMAS J., COLGAN EVAN G., ELLSWORTH, JR. MICHAEL J., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one or more coolant-carrying channel(s) integrated within the module, and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure facilitates flow of coolant to the coolant-carrying channel(s) of the electronic module, and the coolant manifold structure and electronic module include adjoining surfaces. One surface of the adjoining surfaces includes a plurality of coolant capillaries or passages. The coolant capillaries are sized to inhibit, for instance, via surface tension, leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and electronic module along the adjoining surfaces. 1. An electronic assembly comprising:a coolant-cooled electronic module comprising at least one coolant-carrying channel configured to facilitate flow of coolant therethrough and thereby facilitate cooling at least one electronic component of the coolant-cooled electronic module; anda coolant manifold structure detachably coupled to the coolant-cooled electronic module, the coolant manifold structure facilitating flow of coolant to the at least one coolant-carrying channel of the coolant-cooled electronic module, wherein the coolant manifold structure and the coolant-cooled electronic module comprise adjoining surfaces, one surface of the adjoining surfaces comprising a plurality of coolant capillaries, the plurality of coolant capillaries being sized to inhibit leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and coolant-cooled electronic module along the adjoining surfaces.2. The electronic assembly of claim 1 , wherein the plurality of ...

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Номер записи: 6
09-06-2016 дата публикации

COOLING STRUCTURE FOR ELECTRONIC BOARDS

Номер: US20160165755A1
Автор: Paul F. BODENWEBER, Kenneth C. MARSTON, Kamal K. SIKKA, Hilton T. TOY, Randall J. WERNER, Jeffrey A. ZITZ, BODENWEBER PAUL F, MARSTON KENNETH C, SIKKA KAMAL K, TOY HILTON T, WERNER RANDALL J, ZITZ JEFFREY A, BODENWEBER PAUL F., MARSTON KENNETH C., SIKKA KAMAL K., TOY HILTON T., WERNER RANDALL J., ZITZ JEFFREY A.
Принадлежит:

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels. 1. An assembly , comprising:a frame having a plurality of openings;a cold plate mounted to the frame, the cold plate comprising at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet; anda heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.2. The assembly of claim 1 , wherein:the fluid channels comprise an in input fluid channel and an output fluid channel;the input fluid channel is in fluid communication with each individual compartment through an input port communicating to each of the individual compartments; andthe output fluid channel is in fluid communication each individual compartment through an output port communicating to each of the individual compartments.3. The assembly of claim 2 , wherein each individual compartment is a sealed compartment.4. The assembly of claim 2 , wherein the cold plate includes grooves which are structured to accommodate sidewalls of the plurality of openings of the frame for mounting of the frame to the cold plate.5. The assembly of claim 4 , further comprising an o-ring within the grooves.6. The assembly of ...

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Номер записи: 7
05-08-2014 дата публикации

Determining magnitude of compressive loading

Номер: US0008794079B2
Автор: Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal Sikka, Jiantao Zheng, Jeffrey A. Zitz, BODENWEBER PAUL F, JADHAV VIRENDRA R, OSTRANDER STEVEN P, SIKKA KAMAL, ZHENG JIANTAO, ZITZ JEFFREY A, BODENWEBER PAUL F., JADHAV VIRENDRA R., OSTRANDER STEVEN P., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, BODENWEBER PAUL F, JADHAV VIRENDRA R, OSTRANDER STEVEN P, SIKKA KAMAL, ZHENG JIANTAO, ZITZ JEFFREY A, IBM, BODENWEBER PAUL F., JADHAV VIRENDRA R., OSTRANDER STEVEN P., ZITZ JEFFREY A., INTERNATIONAL BUSINESS MACHINES CORPORATION

An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.

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Номер записи: 8
11-08-2015 дата публикации

Non-hermetic sealed multi-chip module package

Номер: US0009105500B2
Автор: Paul F. Bodenweber, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz, BODENWEBER PAUL F, TOY HILTON T, TUNGA KRISHNA R, ZITZ JEFFREY A, BODENWEBER PAUL F., TOY HILTON T., TUNGA KRISHNA R., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, BODENWEBER PAUL F, TOY HILTON T, TUNGA KRISHNA R, ZITZ JEFFREY A, IBM, BODENWEBER PAUL F., TOY HILTON T., TUNGA KRISHNA R., ZITZ JEFFREY A., INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface.

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Номер записи: 9
27-09-2012 дата публикации

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

Номер: US20120241944A1
Автор: Martin M. BEAUMIER, Steven P. OSTRANDER, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ, BEAUMIER MARTIN M, OSTRANDER STEVEN P, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, BEAUMIER MARTIN M., OSTRANDER STEVEN P., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.

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Номер записи: 10
21-02-2008 дата публикации

Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures

Номер: US2008042264A1
Автор: COLGAN EVAN G, GELORME JEFFREY D, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, COLGAN EVAN G., GELORME JEFFREY D., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит:

Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.

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Номер записи: 11
30-01-2014 дата публикации

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

Номер: US20140027898A1
Автор: Kamal K. SIKKA, Hilton T. TOY, Krishna R. TUNGA, Jeffrey A. ZITZ, SIKKA KAMAL K, TOY HILTON T, TUNGA KRISHNA R, ZITZ JEFFREY A, SIKKA KAMAL K., TOY HILTON T., TUNGA KRISHNA R., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant. 1. A method , comprising: placing a chip shim on the one or more chips on the chip carrier;', 'placing a seal shim between a lid and the chip carrier, the seal shim being thicker than the chip shim;', 'lowering the lid until the lid contacts the seal shim and the one or more pistons contact the chip shim;', 'fixing the one or more pistons to the lid in the lowered position; and', 'removing the chip shim and the seal shim;, 'adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier, the adjusting comprisingdispensing thermal interface material on the one or more chips and lowering the lid until a gap filled with the thermal interface material between the one or more chips and the one or more pistons is about a particle size of the thermal interface material; andsealing the lid to the chip carrier with sealant.2. The method of claim 1 , further comprising aligning the one or more pistons of the lid in registration with respective one or more chips on the chip carrier.3. The method of claim 1 , further comprising planarizing the one or more pistons with a surface of the lid and fixing ...

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Номер записи: 12
20-03-2014 дата публикации

ELECTRONIC ASSEMBLY WITH DETACHABLE COOLANT MANIFOLD AND COOLANT-COOLED ELECTRONIC MODULE

Номер: US20140078672A1
Автор: Thomas J. BRUNSCHWILER, Evan G. COLGAN, Michael J. ELLSWORTH, JR., Werner ESCHER, Ingmar G. MEIJER, Stephan PAREDES, Gerd SCHLOTTIG, Martin WITZIG, Jeffrey A. ZITZ, BRUNSCHWILER THOMAS J, COLGAN EVAN G, ELLSWORTH JR MICHAEL J, ESCHER WERNER, MEIJER INGMAR G, PAREDES STEPHAN, SCHLOTTIG GERD, WITZIG MARTIN, ZITZ JEFFREY A, BRUNSCHWILER THOMAS J., COLGAN EVAN G., ELLSWORTH, JR. MICHAEL J., MEIJER INGMAR G., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module. 1. A cooled electronic assembly comprising: at least one electronic component; and', 'at least one coolant-carrying channel integrated within the coolant-cooled electronic module and configured to facilitate flow of coolant therethrough for cooling the at least one electronic component; and, 'a coolant-cooled electronic module, the coolant-cooled electronic module comprisinga coolant manifold structure detachably coupled to the coolant-cooled electronic module, the coolant manifold structure comprising a coolant inlet and a coolant outlet in fluid communication with the at least one coolant-carrying channel of the coolant-cooled electronic module, the coolant manifold structure facilitating the flow of coolant through the at least one coolant-carrying channel of the coolant-cooled electronic module, and thereby cooling of the at least one electronic component.2. The cooled electronic assembly of claim 1 , further comprising a coolant-absorbent material positioned at an ...

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Номер записи: 13
16-01-2014 дата публикации

NON-HERMETIC SEALED MULTI-CHIP MODULE PACKAGE

Номер: US20140015387A1
Автор: Paul F. Bodenweber, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz, BODENWEBER PAUL F, TOY HILTON T, TUNGA KRISHNA R, ZITZ JEFFREY A, BODENWEBER PAUL F., TOY HILTON T., TUNGA KRISHNA R., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation

A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface. 1. A multi-chip module (MCM) package , comprising:a substrate including a surface on which chips of the MCM are re-workable; anda hat assembly configured to be non-hermetically sealed to the substrate,the hat assembly and the substrate being configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface.2. The MCM package according to claim 1 , wherein the substrate comprises high performance glass ceramic (HPGC).3. The MCM package according to claim 1 , wherein the substrate and the hat assembly are substantially square claim 1 , rectangular or polygonal.4. The MCM package according to claim 1 , wherein tension applied for the tension-type disassembly is distributed substantially evenly to each side of the substrate.5. A multi-chip module (MCM) package claim 1 , comprising:a substrate including a surface on which chips of the MCM are re-workable and plugs disposed on the surface; anda hat assembly including a sealband receptive of the plugs such that the hat assembly is configured to be non-hermetically sealed to the substrate and disassembled from the substrate in a dimension oriented substantially normally with respect to a plane of the substrate surface.6. The MCM package according to claim 5 , wherein the substrate comprises high performance glass ceramic (HPGC).7. The MCM package according to claim 5 , wherein the plugs are shaped to provide for an interference fit with the sealband.8. The MCM package according to claim 5 , wherein the plugs comprise compliant material.9. ...

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Номер записи: 14
14-06-2016 дата публикации

Determining magnitude of compressive loading

Номер: US0009366591B2
Автор: Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz, BODENWEBER PAUL F, JADHAV VIRENDRA R, OSTRANDER STEVEN P, SIKKA KAMAL K, ZHENG JIANTAO, ZITZ JEFFREY A, BODENWEBER PAUL F., JADHAV VIRENDRA R., OSTRANDER STEVEN P., SIKKA KAMAL K., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM

An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.

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Номер записи: 15
08-04-2014 дата публикации

Semiconductor device cooling module

Номер: US0008693200B2
Автор: Evan G. Colgan, Michael A. Gaynes, Jeffrey A. Zitz, COLGAN EVAN G, GAYNES MICHAEL A, ZITZ JEFFREY A, COLGAN EVAN G., GAYNES MICHAEL A., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, COLGAN EVAN G, GAYNES MICHAEL A, ZITZ JEFFREY A, IBM, COLGAN EVAN G., GAYNES MICHAEL A., ZITZ JEFFREY A., INTERNATIONAL BUSINESS MACHINES CORPORATION

A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.

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Номер записи: 16
13-11-2014 дата публикации

DETERMINING MAGNITUDE OF COMPRESSIVE LOADING

Номер: US20140331792A1
Автор: Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz, BODENWEBER PAUL F, JADHAV VIRENDRA R, OSTRANDER STEVEN P, SIKKA KAMAL K, ZHENG JIANTAO, ZITZ JEFFREY A, BODENWEBER PAUL F., JADHAV VIRENDRA R., OSTRANDER STEVEN P., SIKKA KAMAL K., ZITZ JEFFREY A.
Принадлежит:

An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied. 1. An apparatus for determining a magnitude of a compressive load , the apparatus comprising:a cap affixed to and movable with an upper portion of a piston in a movement direction along which the magnitude of the compressive load is to be determined;a spring disposed in contact with the cap;a pin disposed to extend through the upper portion of the piston and urged by the spring toward a lower portion of the piston, the pin being thereby movable with the lower portion of the piston in the movement direction; anda sensor to measure a distance between the cap and the pin in the movement direction, the measured distance being related to a deformation of a compliant film disposed between the upper and lower portions as the compressive load is applied.2. The apparatus according to claim 1 , wherein a plane of a surface of the cap is recessed from a corresponding plane of a surface of the upper portion of the piston.3. The apparatus according to claim 1 , further comprising a bushing disposed within the upper portion of the piston through which the pin extends.4. The apparatus according to claim 1 , wherein the sensor comprises a capacitive sensor.5. A method for determining a magnitude of a compressive load claim 1 , the method comprising:machining a through-hole in an upper portion of a piston;disposing in the through-hole a sensor assembly apparatus including a cap movable ...

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Номер записи: 17
28-01-2010 дата публикации

SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT

Номер: US2010019377A1
Автор: ARVELO AMILCAR R, COLGAN EVAN G, MAGERLEIN JOHN H, MARSTON KENNETH C, RIVERA KATHRYN C, SIKKA KAMAL K, WAKIL JAMIL A, WEI XIAOJIN, ZITZ JEFFREY A, ARVELO AMILCAR R., COLGAN EVAN G., MAGERLEIN JOHN H., MARSTON KENNETH C., RIVERA KATHRYN C., SIKKA KAMAL K., WAKIL JAMIL A., ZITZ JEFFREY A.
Принадлежит:

An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.

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Номер записи: 18
26-11-2013 дата публикации

Multichip electronic packages and methods of manufacture

Номер: US0008592970B2
Автор: Kamal K. Sikka, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz, SIKKA KAMAL K, TOY HILTON T, TUNGA KRISHNA R, ZITZ JEFFREY A, SIKKA KAMAL K., TOY HILTON T., TUNGA KRISHNA R., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, SIKKA KAMAL K, TOY HILTON T, TUNGA KRISHNA R, ZITZ JEFFREY A, IBM, SIKKA KAMAL K., TOY HILTON T., TUNGA KRISHNA R., ZITZ JEFFREY A., INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant.

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Номер записи: 19
05-04-2012 дата публикации

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

Номер: US20120080784A1
Автор: SURESH D. KADAKIA, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz, KADAKIA SURESH D, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, KADAKIA SURESH D., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips. 1. A multi-chip package comprising:a plurality of chips mounted on a chip carrier;a lid mounted on the chip carrier using a bonding material or seal; andat least one single piston extending from the lid, each of which cover an entire surface of multiple chips of the plurality of chips.2. The multi-chip package of claim 1 , wherein the lid encapsulates the plurality of chips mounted on the chip carrier.3. The multi-chip package of claim 1 , wherein the at least one single piston covers at least two chips mounted on the chip carrier.4. The multi-chip package of claim 1 , wherein the chip carrier is a ceramic claim 1 , silicon or inorganic chip carrier.5. The multi-chip package of claim 1 , wherein the chip carrier is a polymer-based or organic chip carrier.6. The multi-chip package of claim 1 , further comprising a thermally-conducting material provided between the at least one single piston and the respective multiple chips which are covered by the at least one single piston.7. The multi-chip package of claim 1 , wherein the at least one single piston is planar with a surface of the lid.8. The multi-chip package of claim 1 , wherein the multiple chips have a spacing therebetween of about 1 millimeter to about 2 millimeters.9. The multi-chip package of claim 1 , wherein the at least one single piston is fixed to the lid.10. The multi-chip package of claim 1 , wherein edges of each of the at least one single piston overlap edges of the multiple chips.11. A structure comprising:a lid encapsulating at least two chips mounted on a chip carrier;a single piston of a lid ...

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Номер записи: 20
28-01-2010 дата публикации

LID EDGE CAPPING LOAD

Номер: US2010020503A1
Автор: BEAUMIER MARTIN, BELAZZOUZ MOHAMED, BROFMAN PETER J, EDWARDS DAVID L, SIKKA KAMAL K, ZHENG JIANTAO, ZITZ JEFFREY A, BROFMAN PETER J., EDWARDS DAVID L., SIKKA KAMAL K., ZITZ JEFFREY A.
Принадлежит:

A method attaches a semiconductor chip to a substrate, applies a thermal interface material to a top of the semiconductor chip, and positions a lid over the semiconductor chip typically attached to the substrate with an adhesive. The method applies a force near the distal ends of the lid or substrate to cause a center portion of the lid or substrate to bow away from the semiconductor chip and increases the central thickness of the thermal interface material prior to curing. While the center portion of the lid or substrate is bowed away from the semiconductor chip, the thermal interface material method increases the temperature of the assembly, thus curing the thermal interface material and lid adhesive. After the thermal interface material has and adhesive have cured, the method removes the force from near the distal ends of the lid or substrate to cause the center portion of the lid to return to a position closer to the semiconductor chip, creating a residual compressive stress in the ...

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Номер записи: 21
02-12-2003 дата публикации

High density thermal solution for direct attach modules

Номер: US0006657864B1
Автор: Warren D. Dyckman, Edward R. Pillai, Jeffrey A. Zitz, DYCKMAN WARREN D, PILLAI EDWARD R, ZITZ JEFFREY A, DYCKMAN WARREN D., PILLAI EDWARD R., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION

A high power density thermal packaging solution. A highly efficient thermal path is provided using a lid of a unique design configuration that connects the chip back-side to both a heat sink and thermally conductive substrate vias thus establishing two thermal paths to carry heat from the die. The thermal interface between the chip back-side to lid and lid-to-substrate is enhanced with a thermally conductive elastomer. The heat is conducted through the substrate through thermal vias that are added to the perimeter of the substrate or which may be configured from preexisting electrical shielding structures that connect the top surface of the substrate to the bottom of the package. The bottom surface connection then conducts the heat to a copper ground plane in the printed circuit card. The heat from the die to the heat sink is transferred in the conventional method using the thin layer of thermally conductive elastomer to complete the thermal path from chip to lid to heat sink.

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Номер записи: 22
20-01-2015 дата публикации

Electronic assembly with detachable coolant manifold and coolant-cooled electronic module

Номер: US0008937810B2
Автор: Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Werner Escher, Ingmar G. Meijer, Stephan Paredes, Gerd Schlottig, Martin Witzig, Jeffrey A. Zitz, BRUNSCHWILER THOMAS J, COLGAN EVAN G, ELLSWORTH JR MICHAEL J, ESCHER WERNER, MEIJER INGMAR G, PAREDES STEPHAN, SCHLOTTIG GERD, WITZIG MARTIN, ZITZ JEFFREY A, BRUNSCHWILER THOMAS J., COLGAN EVAN G., ELLSWORTH, JR. MICHAEL J., MEIJER INGMAR G., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, BRUNSCHWILER THOMAS J, COLGAN EVAN G, ELLSWORTH JR MICHAEL J, ESCHER WERNER, MEIJER INGMAR G, PAREDES STEPHAN, SCHLOTTIG GERD, WITZIG MARTIN, ZITZ JEFFREY A, IBM, BRUNSCHWILER THOMAS J., COLGAN EVAN G., ELLSWORTH, JR. MICHAEL J., MEIJER INGMAR G., ZITZ JEFFREY A., INTERNATIONAL BUSINESS MACHINES CORPORATION

Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.

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Номер записи: 23
25-09-2014 дата публикации

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

Номер: US2014284040A1
Автор: COLGAN EVAN G, DAVIS TARYN J, LIAN CHENZHOU, PAN YI, SIKKA KAMAL K, ZITZ JEFFREY A, COLGAN EVAN G., DAVIS TARYN J., SIKKA KAMAL K., ZITZ JEFFREY A.
Принадлежит:

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

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Номер записи: 24
23-06-2015 дата публикации

Disassemblable electronic assembly with leak-inhibiting coolant capillaries

Номер: US0009066460B2
Автор: Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Werner Escher, Ingmar Meijer, Stephen Paredes, Gerd Schlottig, Jeffrey A. Zitz, BRUNSCHWILER THOMAS J, COLGAN EVAN G, ELLSWORTH JR MICHAEL J, ESCHER WERNER, MEIJER INGMAR, PAREDES STEPHEN, SCHLOTTIG GERD, ZITZ JEFFREY A, BRUNSCHWILER THOMAS J., COLGAN EVAN G., ELLSWORTH, JR. MICHAEL J., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM

Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one or more coolant-carrying channel(s) integrated within the module, and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure facilitates flow of coolant to the coolant-carrying channel(s) of the electronic module, and the coolant manifold structure and electronic module include adjoining surfaces. One surface of the adjoining surfaces includes a plurality of coolant capillaries or passages. The coolant capillaries are sized to inhibit, for instance, via surface tension, leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and electronic module along the adjoining surfaces.

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Номер записи: 25
09-12-2014 дата публикации

Multichip electronic packages and methods of manufacture

Номер: US0008906809B2
Автор: Martin M. Beaumier, Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz, BEAUMIER MARTIN M, OSTRANDER STEVEN P, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, BEAUMIER MARTIN M., OSTRANDER STEVEN P., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, BEAUMIER MARTIN M, OSTRANDER STEVEN P, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, IBM, BEAUMIER MARTIN M., OSTRANDER STEVEN P., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A., INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.

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Номер записи: 26
14-10-2008 дата публикации

Elastomer interposer with voids in a compressive loading system

Номер: US0007436057B2
Автор: David C. Long, William L. Brodsky, Jason S. Miller, John G. Torok, Jeffrey A. Zitz, LONG DAVID C, BRODSKY WILLIAM L, MILLER JASON S, TOROK JOHN G, ZITZ JEFFREY A, LONG DAVID C., BRODSKY WILLIAM L., MILLER JASON S., TOROK JOHN G., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION

An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.

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Номер записи: 27
21-07-2015 дата публикации

Multichip electronic packages and methods of manufacture

Номер: US0009087834B2
Автор: Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz, KADAKIA SURESH D, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, KADAKIA SURESH D., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM

A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.

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Номер записи: 28
19-11-2013 дата публикации

Multichip electronic packages and methods of manufacture

Номер: US0008587114B2
Автор: Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz, KADAKIA SURESH D, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, KADAKIA SURESH D., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, KADAKIA SURESH D, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, IBM, KADAKIA SURESH D., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A., INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.

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Номер записи: 29
06-10-2015 дата публикации

Heatsink attachment module

Номер: US0009153460B2
Автор: Evan G. Colgan, Michael A. Gaynes, Jeffrey A. Zitz, COLGAN EVAN G, GAYNES MICHAEL A, ZITZ JEFFREY A, COLGAN EVAN G., GAYNES MICHAEL A., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION

An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module subassembly chip face down in the fixture.

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Номер записи: 30
28-10-2008 дата публикации

IC chip package having force-adjustable member between stiffener and printed circuit board

Номер: US0007443026B2
Автор: Lewis S. Goldmann, Jeffrey A. Zitz, GOLDMANN LEWIS S, ZITZ JEFFREY A, GOLDMANN LEWIS S., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION

An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an underside of the PCB; and at least two couplers for coupling the metal stiffener to a lid or a heat sink, with the PCB, the chip carrier and the LGA connector therebetween. The force-adjustable member reduces the required assembly forces and accommodates natural and non-systematic out-of flatness tolerances of the PCB and the chip carrier.

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Номер записи: 31
16-02-2012 дата публикации

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

Номер: US20120039046A1
Автор: Martin M. BEAUMIER, Steven P. OSTRANDER, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ, BEAUMIER MARTIN M, OSTRANDER STEVEN P, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, BEAUMIER MARTIN M., OSTRANDER STEVEN P., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier. 1. A method , comprising:contacting pistons of a lid with respective ones of chips on a chip carrier;separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier, the at least one seal shim having a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier;dispensing thermal interface material within the gap and in contact with the chips; andsealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.2. The method of claim 1 , further comprising aligning the pistons of the lid in registration with chips on the chip carrier.3. The method of claim 1 , further comprising planarizing the pistons with a surface of the lid and fixing the pistons to the lid.4. The method of claim 3 , wherein the fixing the pistons to the lid includes cooling solder such that the solder bonds the pistons to the lid.5. The method of claim 4 , wherein the contacting comprising placing the lid and chip carrier in a reflow furnace and heating the solder to release the pistons from the lid.6. The method of claim 1 , further comprising sealing the at least one seal shim to the one of the lid and chip carrier with a sealant.7. The method of claim 1 , further comprising ...

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Номер записи: 32
14-10-2014 дата публикации

Multichip electronic packages and methods of manufacture

Номер: US0008860206B2
Автор: Kamal K. Sikka, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz, SIKKA KAMAL K, TOY HILTON T, TUNGA KRISHNA R, ZITZ JEFFREY A, SIKKA KAMAL K., TOY HILTON T., TUNGA KRISHNA R., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant.

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Номер записи: 33
19-04-2011 дата публикации

Segmentation of a die stack for 3D packaging thermal management

Номер: US0007928562B2
Автор: Amilcar R. Arvelo, Evan G. Colgan, John H. Magerlein, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jeffrey A. Zitz, ARVELO AMILCAR R, COLGAN EVAN G, MAGERLEIN JOHN H, MARSTON KENNETH C, RIVERA KATHRYN C, SIKKA KAMAL K, WAKIL JAMIL A, WEI XIAOJIN, ZITZ JEFFREY A, ARVELO AMILCAR R., COLGAN EVAN G., MAGERLEIN JOHN H., MARSTON KENNETH C., RIVERA KATHRYN C., SIKKA KAMAL K., WAKIL JAMIL A., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, IBM, INTERNATIONAL BUSINESS MACHINES CORPORATION

An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.

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Номер записи: 34
01-09-2005 дата публикации

Apparatus and methods for cooling semiconductor integrated circuit package structures

Номер: US2005189568A1
Автор: COLGAN EVAN G, GELORME JEFFREY D, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, COLGAN EVAN G., GELORME JEFFREY D., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит:

Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.

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Номер записи: 35
02-08-2012 дата публикации

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

Номер: US20120196408A1
Автор: Suresh D. KADAKIA, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ, KADAKIA SURESH D, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, KADAKIA SURESH D., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.

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Номер записи: 36
02-12-2014 дата публикации

Multichip electronic packages and methods of manufacture

Номер: US0008900927B2
Автор: Martin M. Beaumier, Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz, BEAUMIER MARTIN M, OSTRANDER STEVEN P, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, BEAUMIER MARTIN M., OSTRANDER STEVEN P., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, BEAUMIER MARTIN M, OSTRANDER STEVEN P, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, IBM, BEAUMIER MARTIN M., OSTRANDER STEVEN P., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A., INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.

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Номер записи: 37
21-05-2013 дата публикации

Multichip electronic packages and methods of manufacture

Номер: US0008445331B2
Автор: Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz, KADAKIA SURESH D, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, KADAKIA SURESH D., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, KADAKIA SURESH D, SIKKA KAMAL K, TOY HILTON T, ZITZ JEFFREY A, IBM, KADAKIA SURESH D., SIKKA KAMAL K., TOY HILTON T., ZITZ JEFFREY A., INTERNATIONAL BUSINESS MACHINES CORPORATION

A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.

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Номер записи: 38
06-05-2014 дата публикации

Determining thermal interface material (TIM) thickness change

Номер: US0008717043B2
Автор: Paul F. Bodenweber, Virendra R. Jadhav, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz, BODENWEBER PAUL F, JADHAV VIRENDRA R, SIKKA KAMAL K, ZHENG JIANTAO, ZITZ JEFFREY A, BODENWEBER PAUL F., JADHAV VIRENDRA R., SIKKA KAMAL K., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation, BODENWEBER PAUL F, JADHAV VIRENDRA R, SIKKA KAMAL K, ZHENG JIANTAO, ZITZ JEFFREY A, IBM, BODENWEBER PAUL F., JADHAV VIRENDRA R., SIKKA KAMAL K., ZITZ JEFFREY A., INTERNATIONAL BUSINESS MACHINES CORPORATION

An apparatus for determining a thickness change of thermal interface material (TIM) disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the TIM thickness is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to the TIM thickness change.

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Номер записи: 39
31-01-2013 дата публикации

DETERMINING THERMAL INTERFACE MATERIAL (TIM) THICKNESS CHANGE

Номер: US20130027063A1
Автор: PAUL F. BODENWEBER, Virendra R. Jadhav, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz, BODENWEBER PAUL F, JADHAV VIRENDRA R, SIKKA KAMAL K, ZHENG JIANTAO, ZITZ JEFFREY A, BODENWEBER PAUL F., JADHAV VIRENDRA R., SIKKA KAMAL K., ZITZ JEFFREY A.
Принадлежит: International Business Machines Corporation

An apparatus for determining a thickness change of thermal interface material (TIM) disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the TIM thickness is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to the TIM thickness change. 1. An apparatus for determining a thickness change of thermal interface material (TIM) disposed between first and second elements , the apparatus comprising:a first part movable with the first element in a movement direction along which the TIM thickness change is to be determined;a second part movable with the second element in the movement direction; anda sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to the TIM thickness.2. The apparatus according to claim 1 , wherein the first element comprises a lid and the second element comprises a processor.3. The apparatus according to claim 1 , wherein the first part is affixed to the first element.4. The apparatus according to claim 3 , wherein the first part is recessed from a plane of a surface of the first element.5. The apparatus according to claim 1 , further comprising an elastic element interposed between the first and second parts to urge the second part to contact the second element.6. The apparatus according to claim 5 , wherein the elastic element comprises a spring.7. The apparatus according to claim 1 , wherein the second part comprises a pin oriented to extend in the movement direction.8. The apparatus according to claim 7 , further comprising a bushing disposed within the first element through which the pin extends.9. The apparatus according to claim 1 , wherein the sensor comprises a capacitive sensor.10. The apparatus ...

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Номер записи: 40
02-05-2013 дата публикации

HEATSINK ATTACHMENT MODULE

Номер: US20130105994A1
Автор: Colgan Evan G., Gaynes Michael A., Zitz Jeffrey A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A chip packaging apparatus includes a substrate, a load frame attached to the substrate by an adhesive material, the load frame being formed to define an aperture and a semiconductor chip mounted on the substrate within the aperture. A thickness of the adhesive material between the load frame and the substrate is varied and adjusted such that a surface of the load frame opposite the substrate is disposed substantially in parallel to a surface of the chip opposite the substrate. 1. A chip packaging apparatus , comprising:a substrate;a load frame attached to the substrate by an adhesive material, the load frame being formed to define an aperture; anda semiconductor chip mounted on the substrate within the aperture;a thickness of the adhesive material between the load frame and the substrate being varied and adjusted such that a surface of the load frame opposite the substrate is disposed substantially in parallel to a surface of the chip opposite the substrate.2. The chip packaging apparatus according to claim 1 , wherein the adhesive material comprises a polymer material.3. The chip packaging apparatus according to claim 1 , wherein the adhesive material thickness is between about 10-400 microns.4. The chip packaging apparatus according to claim 1 , wherein the adhesive material thickness is between about 10-190 microns.5. The chip packaging apparatus according to claim 4 , wherein the substrate comprises ceramic material.6. The chip packaging apparatus according to claim 3 , wherein the substrate comprises organic material.7. The chip packaging apparatus according to claim 1 , wherein the surface of the chip opposite the substrate is offset from the surface of the load frame.8. The chip packaging apparatus according to claim 7 , further comprising:a heat sink disposed above the chip; anda thermal interface material (TIM) interposed between the heat sink and the chip.9. The chip packaging apparatus according to claim 8 , wherein a thickness of the TIM is ...

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Номер записи: 41
09-05-2013 дата публикации

DETERMINING MAGNITUDE OF COMPRESSIVE LOADING

Номер: US20130112006A1
Автор: BODENWEBER PAUL F., Jadhav Virendra R., Ostrander Steven P., Sikka Kamal, Zheng Jiantao, Zitz Jeffrey A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied. 1. An apparatus for determining a magnitude of a compressive load , the apparatus comprising:a first part movable with a first element in a movement direction along which the magnitude of the compressive load is to be determined;a second part movable with a second element in the movement direction; anda sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of a compliant film disposed between the first and second elements as the compressive load is applied.2. The apparatus according to claim 1 , wherein the first element comprises an upper portion of a piston and the second element comprises a lower portion of the piston.3. The apparatus according to claim 1 , wherein the first part is affixed to the first element.4. The apparatus according to claim 3 , wherein the first part is recessed from a plane of a surface of the first element.5. The apparatus according to claim 1 , further comprising an elastic element interposed between the first and second parts to urge the second part to contact the second element.6. The apparatus according to claim 5 , wherein the elastic element comprises a spring.7. The apparatus according to claim 1 , wherein the second part comprises a pin oriented to extend in the movement direction.8. The apparatus according to claim 7 , further comprising a ...

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Номер записи: 42
08-08-2013 дата публикации

SEMICONDUCTOR DEVICE COOLING MODULE

Номер: US20130199752A1
Автор: Colgan Evan G., Gaynes Michael A., Zitz Jeffrey A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together. 1. A cooling module for cooling a semiconductor , comprising:a land grid array (LGA) interposer;a substrate with an LGA side and a chip side;a cooler;a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable;a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor; anda load assembly device configured to urge the load frame and the LGA interposer together.2. The module according to claim 1 , wherein the load assembly device comprises a cross-shaped load plate.3. The module according to claim 2 , wherein the cross-shaped load plate is displaced from the spring clamp.4. The module according to claim 2 , wherein the load assembly device further comprises:a tension screw; anda load assembly disposed over a portion of the cross-shaped load plate.5. A cooling module for cooling one or more semiconductor devices claim 2 , comprising:a land grid array (LGA) interposer;a substrate with an LGA side and a chip side to which a semiconductor device is attachable;a cooler including a fluid chamber having a chip side and a clamp side and fluid inlet and outlet openings;a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable;a spring clamp removably attachable to ...

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Номер записи: 43
26-12-2013 дата публикации

Heatsink attachment module

Номер: US20130344660A1
Автор: Evan G. Colgan, Jeffrey A. Zitz, Michael A. Gaynes
Принадлежит: International Business Machines Corp

An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module subassembly chip face down in the fixture.

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Номер записи: 44
23-02-2017 дата публикации

Reducing directional stress in an orthotropic encapsulation member of an electronic package

Номер: US20170053845A1
Автор: Hilton T. Toy, Jeffrey A. Zitz, Marcus E. Interrante, Yi Pan
Принадлежит: International Business Machines Corp

Methods and apparatuses for reducing directional stress in an orthotropic encapsulation member of an electronic package may include attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip and a plurality of opposing sidewalls, electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction.

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Номер записи: 45
01-03-2018 дата публикации

Chip module with stiffening frame and orthogonal heat spreader

Номер: US20180061732A1
Автор: Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz, Yi Pan
Принадлежит: International Business Machines Corp

An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

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Номер записи: 46
01-03-2018 дата публикации

Chip module with stiffening frame and orthogonal heat spreader

Номер: US20180061733A1
Автор: Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz, Yi Pan
Принадлежит: International Business Machines Corp

An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

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Номер записи: 47
08-03-2018 дата публикации

Lid attach optimization to limit electronic package warpage

Номер: US20180068916A1
Автор: Hilton T. Toy, Jeffrey A. Zitz, Kamal K. Sikka, Shidong Li, Sushumna Iruvanti
Принадлежит: International Business Machines Corp

An electronic package includes a carrier and a semiconductor chip. In a first aspect an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material.

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Номер записи: 48
08-03-2018 дата публикации

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

Номер: US20180068917A1
Автор: Iruvanti Sushumna, LI SHIDONG, SIKKA Kamal K., TOY Hilton T., Zitz Jeffrey A.
Принадлежит:

In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness. 1. A electronic package comprising:a carrier comprising a top surface and a bottom surface;a frame comprising an opening upon the carrier, the frame comprising a first frame side and second frame side, the first frame side comprising a top surface coplanar with a top surface of a lid and the second frame side comprising a top surface below the top surface of the lid;a semiconductor chip electrically connected to the top surface within and concentric with the opening;the lid thermally connected to a top surface of the semiconductor chip; andjoin material that connects the lid and the frame.2. The electronic package of claim 1 , wherein the join material contacts a sidewall of the first frame side and a first sidewall of the lid.3. The electronic package of claim 1 , wherein the join material contacts a sidewall and the top surface of the second frame side and a second sidewall of the lid.4. The electronic package of claim 1 , wherein the first sidewall of the lid opposes the second sidewall of the lid.5. The electronic package of claim 1 , wherein the join material is solder.6. The electronic package of claim 1 , wherein the join material is epoxy.7. The electronic package of claim 1 , wherein the join material is elastomeric.8. The electronic package of claim 3 , wherein a top surface of the join material that contacts the top surface of the second frame side is coplanar with the top surface of the lid. Embodiments of the present invention generally relate to electronic devices and more specifically to lid attach techniques to limit warpage within an electronic device package.An electronic package may ...

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Номер записи: 49
27-02-2020 дата публикации

COOLING STRUCTURE FOR ELECTRONIC BOARDS

Номер: US20200068744A1
Автор: BODENWEBER PAUL F., Marston Kenneth C., SIKKA Kamal K., TOY Hilton T., Werner Randall J., Zitz Jeffrey A.
Принадлежит:

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels. 1. A manifold assembly , comprising:a frame assembly having a plurality of sealed compartments each comprising a single heat sink registered to an underlying chip and/or package mounted on an electronic board;a fluid channel within the frame assembly; andan inlet and an outlet associated with each of the sealed compartments and in fluid communication with the fluid channel, a plurality of openings in a frame; and', 'a cold plate assembly sealed to sidewalls of openings of a bottom plate,', 'the bottom plate having a top side and a bottom side, and', 'the bottom side having a plurality of grooves which accommodate sidewalls of the openings of the frame., 'wherein the frame assembly includes2. The manifold assembly of claim 1 , wherein the inlet and the outlet direct coolant over the single heat sink of each of the sealed compartments.3. The manifold assembly of claim 1 , wherein the cold plate assembly includes fluid channels for the inlet and outlet for each of the sealed compartments.4. The manifold assembly of claim 1 , wherein the heat sink includes fins which are one of cuboidal claim 1 , cylindrical pin fins claim 1 , channels that are parallel and trapezoidal.5. The manifold assembly of claim 1 , wherein the heat sink in each of the plurality of openings is registered and spans over at least one ...

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Номер записи: 50
15-03-2018 дата публикации

Test cell for laminate and method

Номер: US20180076101A1
Автор: David L. Questad, Jeffrey A. Zitz, Krishna R. Tunga, Marek A. Orlowski, Randall J. Werner, Shidong Li, Sushumna Iruvanti, Thomas A. Wassick, Tuhin Sinha
Принадлежит: International Business Machines Corp

A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.

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Номер записи: 51
30-04-2020 дата публикации

Multi Integrated Circuit Chip Carrier Package

Номер: US20200135495A1
Автор: INTERRANTE Marcus E., Lange Kathryn R., SIKKA Kamal K., Sinha Tuhin, TOY Hilton T., Zitz Jeffrey A.
Принадлежит:

A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned against a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment features within the lid with one or more respective alignment features of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, the lid be loaded against respective IC chips, and the lid may be loaded against the carrier. While under compression, thermal interface material between respective the lid and respective IC chips and seal band material between the lid and the carrier may be cured. 1. An electronic device fabrication method comprising:positioning a multiple IC chip carrier against a carrier deck that comprises a plurality of first alignment features;aligning a lid, comprising a plurality of second alignment features, with the carrier deck by engaging the first alignment features with the second alignment features;connecting the lid to each IC chip of the multiple IC chip carrier; andremoving the multiple IC chip carrier from the carrier deck.2. The method of claim 1 , further comprising:connecting the lid to the multiple IC chip carrier3. The method of claim 2 , further comprising:applying a seal band material upon the multiple IC chip carrier around a circumference of each IC chip or applying a seal band material upon an underside surface of the lid.4. The method of claim 2 , further comprising:applying a thermal interface material upon an upper surface of each IC chip of the multiple IC chip carrier.5. The method of claim 2 , further comprising:applying a thermal interface material upon an underside surface of the lid.6. The method of claim 2 , further comprising:curing a seal band that exists between the lid and ...

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Номер записи: 52
15-06-2017 дата публикации

Lid attach optimization to limit electronic package warpage

Номер: US20170170030A1
Автор: Hilton T. Toy, Jeffrey A. Zitz, Kamal K. Sikka, Shidong Li, Sushumna Iruvanti
Принадлежит: International Business Machines Corp

An electronic package includes a carrier and a semiconductor chip. In a first aspect a lid is attached to the chip and subsequently the gap between the lid and the carrier is filled by a seal band that includes seal band material and a plurality of shim members. In another aspect, an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material. In another aspect, the lid includes a plurality of surfaces at different topographies to reduce the thickness of the seal band between the topographic lid and the carrier. In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness.

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Номер записи: 53
15-06-2017 дата публикации

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

Номер: US20170170086A1
Автор: Iruvanti Sushumna, LI SHIDONG, SIKKA Kamal K., TOY Hilton T., Zitz Jeffrey A.
Принадлежит:

An electronic package includes a carrier and a semiconductor chip. In a first aspect a lid is attached to the chip and subsequently the gap between the lid and the carrier is filled by a seal band that includes seal band material and a plurality of shim members. In another aspect, an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material. In another aspect, the lid includes a plurality of surfaces at different topographies to reduce the thickness of the seal band between the topographic lid and the carrier. In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness. 1. A electronic package comprising:a carrier comprising a top surface and a bottom surface;a semiconductor chip electrically connected to the top surface;a lid thermally connected to a top surface of the semiconductor chip, and;a seal band connected to the carrier and the lid perimeter and that surrounds two metal shim members, the seal band comprising a first bead of thermally compliant seal-band material connected to the top surface of the carrier, connected to respective lower sidewall surface portions of the two metal shim members, and connected to respective bottom surfaces of the two metal shim members and a second bead of thermally compliant seal-band material connected to the lid perimeter, connected to respective upper sidewall surface portions of the two metal shim members, and connected to respective top surfaces of the two metal shim members.25.-. (canceled)6. The electronic package of claim 1 , wherein the seal-band fills a gap between the carrier and an underside of the lid.7. The electronic package of claim 1 , wherein the ...

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Номер записи: 54
22-06-2017 дата публикации

Test cell for laminate and method

Номер: US20170178982A1
Автор: David L. Questad, Jeffrey A. Zitz, Krishna R. Tunga, Marek A. Orlowski, Randall J. Werner, Shidong Li, Sushumna Iruvanti, Thomas A. Wassick, Tuhin Sinha
Принадлежит: International Business Machines Corp

A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.

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Номер записи: 55
25-09-2014 дата публикации

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

Номер: US20140284040A1
Автор: Colgan Evan G., Davis Taryn J., Lian Chenzhou, Pan Yi, SIKKA Kamal K., Zitz Jeffrey A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps. 1. A cooling system for a semiconductor package comprising:a heat spreading layer partially encased in a supporting frame, the heat spreading layer including a perimeter, the supporting frame being configured to encase the perimeter and an adjacent portion of the heat spreading layer, defining centrally exposed top and bottom portions of the heat spreading layer; anda heat generating element thermally connected to the centrally exposed bottom portion of the heat spreading layer.2. The system of claim 1 , wherein the semiconductor package is a flip chip ball grid array package claim 1 , a flip chip land grid array package claim 1 , or a flip chip pin grid array package.3. The system of claim 1 , wherein the semiconductor package is a wire bonding assembly package.4. The system of claim 3 , wherein the centrally exposed bottom portion of the heat spreading layer further comprises a centrally protruding portion connected to a central portion of a top surface of the heat generating element.5. The system of claim 1 , wherein the heat spreading layer is made from graphite.6. The system of wherein the heat spreading layer is positioned to have high thermal conductivity in a first direction being substantially perpendicular relative to the substrate claim 5 , and relatively high thermal conductivity in at least a second direction substantially parallel relative to the substrate.7. The system of claim 1 , wherein the heat spreading layer is made from pyrolytic graphite.8. The system of claim 1 , ...

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Номер записи: 56
06-07-2017 дата публикации

COOLING STRUCTURE FOR ELECTRONIC BOARDS

Номер: US20170196119A1
Автор: BODENWEBER PAUL F., Marston Kenneth C., SIKKA Kamal K., TOY Hilton T., Werner Randall J., Zitz Jeffrey A.
Принадлежит:

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels. 1. A manifold assembly , comprising:a frame assembly having a plurality of sealed compartments each comprising a single heat sink registered to an underlying chip and/or package mounted on an electronic board;a fluid channel within the frame assembly; andan inlet and an outlet associated with each of the sealed compartments and in fluid communication with the fluid channel, the inlet and the outlet directing coolant over the single heat sink of each of the sealed compartments.2. The manifold assembly of claim 1 , wherein the frame assembly includes:a plurality of openings in a frame; anda cold plate assembly sealed to sidewalls of the openings of the bottom plate,fluid channels in the cold plate which includes the inlet and outlet for each of the sealed compartments.3. The manifold assembly of claim 2 , wherein the heat sink is mounted within each of the plurality of openings of the frame and in combination with sidewalls of the openings of the frame and the cold plate assembly form individual compartments each of which is in fluid communication with the fluid channels.4. The manifold assembly of claim 2 , wherein the cold plate assembly includes grooves structured to accommodate the sidewalls of the plurality of openings of the frame for mounting of the frame to the cold plate.5. The manifold assembly of ...

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Номер записи: 57
12-08-2021 дата публикации

Conformal Integrated Circuit (IC) Device Package Lid

Номер: US20210249333A1
Автор: David J. Lewison, Hongqing Zhang, Jay A. Bunt, Jeffrey A. Zitz, Sushumna Iruvanti
Принадлежит: International Business Machines Corp

An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.

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Номер записи: 58
16-08-2018 дата публикации

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

Номер: US20180233381A1
Автор: Iruvanti Sushumna, LI SHIDONG, SIKKA Kamal K., TOY Hilton T., Zitz Jeffrey A.
Принадлежит:

An electronic package includes a carrier and a semiconductor chip. In a first aspect, a lid is attached to the chip and subsequently the gap between the lid and the carrier is filled by a seal band that includes seal band material and a plurality of shim members. In another aspect, an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material. In another aspect, the lid includes a plurality of surfaces at different topographies to reduce the thickness of the seal band between the topographic lid and the carrier. In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness. 1. A method to fabricate an electronic package comprising:electronically connecting a semiconductor chip to a carrier;forming a gap between a lid and the carrier by thermally connecting the lid to the semiconductor chip;subsequent to thermally connecting the lid to the semiconductor chip, inserting a plurality of shim members upon the carrier in the gap between the lid and the carrier; andsubsequent to inserting the plurality of shim members, forming a seal band upon the plurality of shim members within the gap to connect the lid and the carrier.2. The method of claim 1 , wherein forming a seal band upon the plurality of shim members comprises:injecting the seal band upon respective upper surfaces of each of the plurality of shim members.3. The method of claim 2 , wherein forming a seal band upon the plurality of shim members comprises:injecting the seal band upon at least one side surface of each of the plurality of shim members.4. The method of claim 3 , wherein the seal band comprises an elastomeric material.5. The method of claim 3 ...

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Номер записи: 59
27-09-2018 дата публикации

Chip module with stiffening frame and orthogonal heat spreader

Номер: US20180277396A1
Автор: Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz, Yi Pan
Принадлежит: International Business Machines Corp

An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

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Номер записи: 60
22-11-2018 дата публикации

COOLING STRUCTURE FOR ELECTRONIC BOARDS

Номер: US20180338390A1
Автор: BODENWEBER PAUL F., Marston Kenneth C., SIKKA Kamal K., TOY Hilton T., Werner Randall J., Zitz Jeffrey A.
Принадлежит:

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels. 1. A manifold assembly , comprising:a frame assembly having a plurality of sealed compartments each comprising a single heat sink registered to an underlying chip and/or package mounted on an electronic board;a fluid channel within the frame assembly; andan inlet and an outlet associated with each of the sealed compartments and in fluid communication with the fluid channel, the inlet and the outlet directing coolant over the single heat sink of each of the sealed compartments, a plurality of openings in a frame; and', 'a cold plate assembly sealed to sidewalls of the openings of a bottom plate,', 'fluid channels in the cold plate which includes the inlet and outlet for each of the sealed compartments, and, 'wherein the frame assembly includeswherein the heat sink includes fins which are one of cuboidal, cylindrical pin fins, channels that are parallel and trapezoidal.2. The manifold assembly of claim 1 , wherein the heat sink is provided in each of the plurality of openings attached to the sidewalls of the openings.3. The manifold assembly of claim 2 , wherein the heat sink in each of the plurality of openings is registered and spans over at least one underlying chip or package mounted on an electronic board and mounted thereon by a thermal interface material (TIM).4. A manifold assembly claim 2 , comprising: ...

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Номер записи: 61
31-10-2019 дата публикации

Cooling structure for electronic boards

Номер: US20190335617A1
Автор: Hilton T. Toy, Jeffrey A. Zitz, Kamal K. Sikka, Kenneth C. Marston, Paul F. Bodenweber, Randall J. Werner
Принадлежит: International Business Machines Corp

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

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Номер записи: 62
08-12-2016 дата публикации

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

Номер: US20160358836A1
Автор: Colgan Evan G., Pan Yi, TOY Hilton T., Zitz Jeffrey A.
Принадлежит:

An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction. 1. A method comprising:attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip, a base portion, and a plurality of opposing sidewalls;electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and;thermally contacting a first directional heat spreader to the semiconductor chip, the first directional heat spreader transferring heat from the semiconductor chip in a first opposing bivector direction towards first opposing sidewalls.2. The method of claim 1 , wherein the first directional heat spreader contacts the first opposing sidewalls.3. The method of claim 1 , further comprising:thermally contacting a second directional heat spreader to the first directional heat spreader, the second directional heat spreader transferring heat from the first directional heat spreader in a second opposing bivector direction towards second opposing sidewalls.4. The method of claim 3 , wherein the ...

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Номер записи: 63
24-12-2015 дата публикации

Heat spreading layer with high thermal conductivity

Номер: US20150371917A1
Автор: Chenzhou Lian, Evan G. Colgan, Jeffrey A. Zitz, Kamal K. Sikka, Taryn J. Davis, Yi Pan
Принадлежит: International Business Machines Corp

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

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Номер записи: 64
24-12-2015 дата публикации

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

Номер: US20150371918A1
Автор: Colgan Evan G., Davis Taryn J., Lian Chenzhou, Pan Yi, SIKKA Kamal K., Zitz Jeffrey A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps. 1. A cooling system for a semiconductor package comprising:a heat spreading layer partially encased in a supporting frame, the heat spreading layer including a perimeter, the supporting frame being configured to encase the perimeter and an adjacent portion of the heat spreading layer, defining centrally exposed top and bottom portions of the heat spreading layer; anda heat generating element thermally connected to the centrally exposed bottom portion of the heat spreading layer.212-. (canceled)13. The system of claim 1 , wherein the supporting frame is made from a metal.1419-. (canceled)20. The system of claim 1 , wherein a top surface and/or a bottom surface of the heat spreading layer is chamfered.2125-. (canceled) This invention relates generally to the field of controlling thermal conduction in computer chip packaging, and more specifically to a heat spreading cap structure having high thermal conductivity.Innovations in semiconductor fabrication and packaging technologies have enabled development of high performance, densely integrated semiconductor chip modules. The downscaling of chip geometries and the increase in operating speeds lead to increased power densities, resulting in more heat generation per unit area. The increased power density poses practical limitations to the level of integration density and performance that may be achieved. The ability to implement chip modules with higher densities and higher performance is limited primarily by the ability to effectively cool the ...

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Номер записи: 65
24-12-2015 дата публикации

Heat spreading layer with high thermal conductivity

Номер: US20150371919A1
Автор: Chenzhou Lian, Evan G. Colgan, Jeffrey A. Zitz, Kamal K. Sikka, Taryn J. Davis, Yi Pan
Принадлежит: International Business Machines Corp

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

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Номер записи: 66
24-12-2015 дата публикации

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

Номер: US20150371922A1
Автор: Colgan Evan G., Davis Taryn J., Lian Chenzhou, Pan Yi, SIKKA Kamal K., Zitz Jeffrey A.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps. 1. A cooling system for a semiconductor package comprising:a heat spreading layer partially encased in a supporting frame, the heat spreading layer including a perimeter, the supporting frame being configured to encase the perimeter and an adjacent portion of the heat spreading layer, defining centrally exposed top and bottom portions of the heat spreading layer; anda heat generating element thermally connected to the centrally exposed bottom portion of the heat spreading layer.221-. (canceled)22. A semiconductor package , comprising:a substrate;a chip electrically connected to the substrate;a thermal module having a heat spreading layer partially encased in a supporting frame, the heat spreading layer including a perimeter, the supporting frame being configured to encase the perimeter and an adjacent portion of the heat spreading layer, defining centrally exposed top and bottom portions of the heat spreading layer, wherein the chip is thermally connected to the centrally exposed bottom portion of the heat spreading layer; anda circuit board electrically connected to the substrate and the chip.2325-. (canceled) This invention relates generally to the field of controlling thermal conduction in computer chip packaging, and more specifically to a heat spreading cap structure having high thermal conductivity.Innovations in semiconductor fabrication and packaging technologies have enabled development of high performance, densely integrated semiconductor chip modules. The downscaling of chip ...

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Номер записи: 67
24-12-2015 дата публикации

Heat spreading layer with high thermal conductivity

Номер: US20150373879A1
Автор: Chenzhou Lian, Evan G. Colgan, Jeffrey A. Zitz, Kamal K. Sikka, Taryn J. Davis, Yi Pan
Принадлежит: International Business Machines Corp

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

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Номер записи: 68
24-12-2015 дата публикации

Heat spreading layer with high thermal conductivity

Номер: US20150373880A1
Автор: Chenzhou Lian, Evan G. Colgan, Jeffrey A. Zitz, Kamal K. Sikka, Taryn J. Davis, Yi Pan
Принадлежит: International Business Machines Corp

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

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Номер записи: 69
28-02-2017 дата публикации

Reducing directional stress in an orthotropic encapsulation member of an electronic package

Номер: US9583408B1
Автор: Hilton T. Toy, Jeffrey A. Zitz, Marcus E. Interrante, Yi Pan
Принадлежит: International Business Machines Corp

Methods and apparatuses for reducing directional stress in an orthotropic encapsulation member of an electronic package may include attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip and a plurality of opposing sidewalls, electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction.

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Номер записи: 70
31-07-2007 дата публикации

Chip package having chip extension and method

Номер: US7250576B2
Автор: Benjamin V. Fasano, David L. Edwards, Evan G. Colgan, Jeffrey A. Zitz, Kamal K. Sikka, Wei Zou
Принадлежит: International Business Machines Corp

A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.

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Номер записи: 71
16-07-2009 дата публикации

Electronic package method and structure with cure-melt hierarchy

Номер: US20090179322A1
Автор: Bruce K Furman, Jeffrey A Zitz, Jiantao Zheng, Kenneth C Marston
Принадлежит: International Business Machines Corp

Disclosed herein are embodiments of electronic package incorporating a thermal interface material (e.g., a metal TIM) that is positioned between a lid and a chip on a substrate. The TIM has a predetermined (i.e., repeatable) minimum thickness and is further registered to the top surface of the chip (i.e., the TIM has an essentially symmetric shape and does not extend vertically along the sidewalls of the chip). Also, disclosed herein are embodiments of a method of forming such an electronic package that uses a hierarchical heating process that cures a lid sealant, thereby securing the lid to the substrate, and then reflows (i.e., melts and cools) the TIM, thereby adhering the TIM to both the chip and lid. This hierarchical heating process ensures that the TIM has the above-mentioned characteristics (i.e., a predetermined minimum thickness and registration to the top surface of the chip) and further provides robust process windows for high-yield, low-cost electronic package manufacturing.

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Номер записи: 72
25-08-2020 дата публикации

Cooling structure for electronic boards

Номер: US10757833B2
Автор: Hilton T. Toy, Jeffrey A. Zitz, Kamal K. Sikka, Kenneth C. Marston, Paul F. Bodenweber, Randall J. Werner
Принадлежит: International Business Machines Corp

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

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Номер записи: 73
02-10-2018 дата публикации

Method of fabricating a chip module with stiffening frame and directional heat spreader

Номер: US10090173B2
Автор: Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz, Yi Pan
Принадлежит: International Business Machines Corp

A method of fabricating a chip module is presented. The chip module includes a stiffening frame, a directional heat spreader, a carrier, and a semiconductor chip. The stiffening frame is attached to the carrier. The stiffening frame includes a base portion with a central opening to accept a semiconductor chip and a first pair of opposing sidewalls. The semiconductor chip is electronically coupled to the carrier concentrically arranged within the central opening. A first directional heat spreader is thermally coupled to the semiconductor chip. The first directional heat spreader includes directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards the first pair of opposing sidewalls.

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Номер записи: 74
10-07-2014 дата публикации

Wärmesenken-Befestigungsmodul

Номер: DE112012004476T5
Автор: c/o IBM Corp. MS 10-204 Colgan Evan G., c/o IBM Corp. MS 10-204 Gaynes Michael A., c/o IBM Corp. Zitz Jeffrey A.
Принадлежит: International Business Machines Corp

Eine Chipverkapselungsvorrichtung umfasst ein Substrat, einen Lastrahmen, welcher mit einem Klebstoffmaterial an dem Substrat befestigt ist, wobei der Lastrahmen so gebildet ist, dass er eine Öffnung definiert, und einen Halbleiterchip, welcher innerhalb der Öffnung an dem Substrat angebracht ist. Eine Dicke des Klebstoffmaterials zwischen dem Lastrahmen und dem Substrat variiert und wird so eingestellt, dass eine Fläche des Lastrahmens gegenüber dem Substrat im Wesentlichen parallel zu einer Fläche des Chips gegenüber dem Substrat angeordnet ist.

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Номер записи: 75
02-04-2019 дата публикации

Test cell for laminate and method

Номер: US10249548B2
Автор: David L. Questad, Jeffrey A. Zitz, Krishna R. Tunga, Marek A. Orlowski, Randall J. Werner, Shidong Li, Sushumna Iruvanti, Thomas A. Wassick, Tuhin Sinha
Принадлежит: International Business Machines Corp

A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.

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Номер записи: 76
17-04-2018 дата публикации

Lid attach optimization to limit electronic package warpage

Номер: US09947603B2
Автор: Hilton T. Toy, Jeffrey A. Zitz, Kamal K. Sikka, Shidong Li, Sushumna Iruvanti
Принадлежит: International Business Machines Corp

An electronic package includes a carrier and a semiconductor chip. In a first aspect a lid is attached to the chip and subsequently the gap between the lid and the carrier is filled by a seal band that includes seal band material and a plurality of shim members. In another aspect, an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material. In another aspect, the lid includes a plurality of surfaces at different topographies to reduce the thickness of the seal band between the topographic lid and the carrier. In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness.

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Номер записи: 77
01-08-2017 дата публикации

Cooling structure for electronic boards

Номер: US09721870B2
Автор: Hilton T. Toy, Jeffrey A. Zitz, Kamal K. Sikka, Kenneth C. Marston, Paul F. Bodenweber, Randall J. Werner
Принадлежит: International Business Machines Corp

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

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Номер записи: 78
06-09-2016 дата публикации

Heat spreading layer with high thermal conductivity

Номер: US09437515B2
Автор: Chenzhou Lian, Evan G. Colgan, Jeffrey A. Zitz, Kamal K. Sikka, Taryn J. Davis, Yi Pan
Принадлежит: International Business Machines Corp

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

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Номер записи: 79