TERTIARY BUTYL ACRYLATE POLYMER AND USE OF THE SAME FOR PHOTOSENSITIVE CORROSION-RESISTANT FILM COMPOSITION

PURPOSE: Provided are a polymer containing tertiary butyl acrylate ester as an acidic unstable group in order to produce a photosensitive corrosion-resistant film pattern having superior resolution property and a photosensitive corrosion-resistant film composition including the polymer. CONSTITUTION: The photosensitive film composition comprises a tertiary butyl acrylate polymer including monomer units represented by the following formular a, b or c; mineral acid generation agent, solvent and any basic compounds(wherein a is 0.5 to 0.7, b is 0.15 to 0.3, c is 0.1 to 0.2, b+c is 0.3 to 0.5; R is selected from a group consisting of H and C1-C4 alkyl groups; R1 is H, methyl or CH2OR2, R3 is independently selected from a group consisting of H, methyl, CH2OR2, CH2CN, CH2X and CH2COOR4 groups(in which X is Cl, I, Br or F, R2 is selected from a group consisting of H and C1-C4 alkyl groups, R4 is C1-C4 alkyl group); R5 is selected from a group consisting of isobornyl, cyclohexyl methyl, cyclohexyl ...

Photoacid generators for use in photoresist compositions

A photoacid compound having the following general structure:wherein n is an integer between about 1 to 4; R is selected from the group consisting of: substituted or unsubstituted C1-C12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF2)pO)m(CF2)q- wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, or glycidyl; and X is selected from the group consisting of: organic cations and covalently bonded organic radicals.

PROCESS FOR MAKING POLYIMIDE-POLYAMIC ESTER COPOLYMERS

A process for making polyimide-polyamic ester copolymer composition comprising reacting at least one diamine, a pyromellitic diacid diester compound; at least one other tetracarboxylic diacid diester compound and a selected phosphoramide in the presence of a base catalyst to form a polyimide-polyamic acid ester copolymer. © KIPO & WIPO 2007 ...

PROCESS FOR MAKING POLYIMIDES FROM DIAMINES AND TETRACARBOXYLIC DIACID DIESTER

A process for making polyimide composition comprising reacting at least one diamine, at least one tetracarboxylic diacid diester, selected phosphoramide and at least one base catalyst to form at least one polyimide compound, said reaction carried out at a temperature from about 20 °C to about 60 °C and wherein the molar ratio of diamine:tetracarboxylic diacid diester:phosphoramide:base catalyst is in the range of 0.8-1.2:1:2.5-4.0:2.5-4.0. © KIPO & WIPO 2007 ...

PRODUCTION OF ACETAL DERIVATIZED HYDROXYL AROMATIC POLYMERS AND THEIR USE IN RADIATION SENSITIVE FORMULATIONS

The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, quoting a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate. © KIPO & WIPO 2007 ...

Hydroxy-amino thermally cured undercoat for 193 NM lithography

The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography.

Silicon-containing acetal protected polymers and photoresists compositions thereof

A photoresist composition comprising at least one acetal polymer having a silicon substituent; provided that the silicon substituent is not directly attached to the acetal functionality, thereby providing high resolution, improved DOF, and improved dimensional stability under metrology conditions.

THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION

Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl- containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the formula (I) wherein R1 is H or methyl; R2 is a substituted or unsubstituted C6-C 14 aryl acrylate or C6-C14 aryl methacrylate group wherein the substituted groups may be phenyl, Cl-4 alkyl or C 1-4 alkoxy; R3 is a hydroxyl functionalized Cl- C8 alkyl acrylate, methacrylate or C6-C14 aryl group, R4 is a C1-C10 linear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the [-R 4O-]p ; R5 is a Cl-C10 linear, branched or cyclic alkyl, substituted or unsubstituted C6-Cl4 aryl, or substituted or unsubstituted C7-Cl5 alicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25. © KIPO & WIPO 2007 ...

CHEMICAL IMIDIZATION REAGENT FOR POLYIMIDE SYNTHESIS

A process for producing a polyimide composition by reacting at least one polyamic acid or at least one polyamic ester or a mixture of at least one polyamic acid and at least one polyamic ester with a selected phosphoramide in the presence of at least one base catalyst to form a polyimide composition. © KIPO & WIPO 2007 ...

SELECTED HIGH THERMAL NOVOLAKS AND POSITIVE-WORKING RADIATION-SENSITIVE COMPOSITIONS

A high thermal alkali-soluble novolak binder resin, comprising the addition-condensation reaction product of a phenolic mixture with at least one aldehyde source, the feedstock of the phenolic mixture for the reaction comprising: (1) about 25 to about 40 weight percent of the phenolic mixture being a monomer selected from meta-cresol 2,5-xylenol or the combination thereof; (2) about 50 to about 70 weight percent of the phenolic mixture being para-cresol; and (3) about 3 to about 20 weight percent of the phenolic mixture being acetamidophenol; all percentages based on the weight of total phenol monomer feedstock. The invention is also directed to a positive working photoresist made from the composition. © KIPO & WIPO 2007 ...

HYDROXY-EPOXIDE THERMALLY CURED UNDERCOAT FOR 193 NM LITHOGRAPHY

The present invention is directed to a thermally curable polymer composition comprising a hydroxyl-containing polymer and a polyfunctional epoxide as a crosslinking agent. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography. In addition, the present invention also relates to a photolithographic coated substrate comprising: a substrate, the thermally cured undercoat composition on the substrate, and a radiation- sensitive resist topcoat on the thermally cured undercoat composition. Furthermore, the present invention further relates to a process for using the photolithographic coated substrate for the production of relief structures. © KIPO & WIPO 2007 ...

HYDROXY-AMINO THERMALLY CURED UNDERCOAT FOR 193 NM LITHOGRAPHY

The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross- linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography. © KIPO & WIPO 2007 ...

PERFLUOROALKYLSULFONIC ACID COMPOUNDS FOR PHOTORESISTS

A photoacid compound having general structure: R-O(CF2) nSO3X wherein n is an integer between about 1 to 4; R is selected from the group consisting of: substituted or unsubstituted C 1-C12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF2)pO) m(CF2)q- wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, or glycidyl; and X is selected from the group consisting of: organic cations and covalently bonded organic radicals. © KIPO & WIPO 2007 ...

Radiation sensitive compositions containing image quality and profile enhancement additives

The present invention is a radiation sensitive composition that includes a polymer resin, a photoacid generator, a solvent, and a heterocyclic additive selected from:1-phenyl-2-pyrrolidinone and compound of the formulas (I), (II), (III), and (IV):where R1 is -H, -NH2-, -OH, -N(CH3)2, -NH-CO-CH3, orwhere R2 is -CH3 or benzoyl;where R3 is -H, or C1-C4 alkyl;W, X, Y, and Z are each independently selected from -CH2-, -CH(CH3)-, -C(CH3)2-, -NH-, or -N(CH3)-, with the proviso that at least one of W, X, Y, or Z is and at least one of W, X, Y, or Z is -NH- or -N(CH3)-;where A is -CH= orR4 is -H, -CH3, or -CH2-CH(CH3)2;R5 is -H, -CH3, or -CH2-CH(OH)-CH2(OH);R6 is -H;B and D are identical and selected fromone p and q is 0 and the other p and q is 1, when A is -CH=; andp and q are both 1, when A isand mixtures thereof.

PROCESS FOR PREPARING A RADIATION-SENSITIVE COMPOSITION

The present invention relates to a process for preparing a radiation- sensitive composition; comprising the steps of (1) passing a solution of a crude polymer comprising a mixture of polymer chains having different molecular weights through a porous polymeric media having a predetermined molecular weight cut-off (MWCO) value, thereby separating the crude polymeric mixture into a first fraction comprising polymer chains having molecular weights above the MWCO value and a second fraction comprising polymer chains having molecular weights below the MWCO value; and (2) adding at least one fraction produced in the first step to at least one radiation-sensitive compound and at least one solvent to produce a radiation-sensitive composition. © KIPO & WIPO 2007 ...

PHOTOSENSITIVE DIAZONAPHTHOQUINONE ESTERS BASED ON SELECTED CYCLIC ALKYL ETHER-CONTAINING PHENOLICS AND THEIR USE IN RADIATION SENSITIVE MIXTURES

A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formula (II), wherein the photosensitive compound is used in a radiation sensitive composition and a process for forming a positive patterned image. © KIPO & WIPO 2007 ...

RADIATION SENSITIVE COMPOSITIONS CONTAINING IMAGE QUALITY AND PROFILE ENHANCEMENT ADDITIVES

The present invention is a radiation sensitive composition that includes a polymer resin, a photoacid generator, a solvent, and a heterocyclic additive selected from the group consisting of: compounds of the formulas (I), (II), (III), and (IV): where R1 isH, -NH 2-, -OH, -N(CH3)2, - NH-CO-CH3, or (II) where R2 is CH3 or benzoyl; (III) where R3 is H, or C1-C4 alkyl; W, X, Y, and Z are each independently selected from CH2-, -C-, -CH(CH 3)-, -C(CH3)2-, -NH-, or N(CH3)-, with the proviso that at least one of W, X, Y, or Z is C-, and at least one of W, X, Y, or Z is NH- or N(CH3)-; (IV) where A is CH= or C-; R 4 is H, -CH3, or CH2-CH(CH3)2; R5 is H, -CH3, or CH2-CH(OH)-CH2(OH); R6 is H; B and D are identical and selected from C- or CH-; one p and q is 0 and the other p and q is 1, when A is CH=; and p and q are both 1, when A is C-; and mixtures thereof. © KIPO & WIPO 2007 ...

Production of acetal derivatized hydroxyl aromatic polymers and their use in radiation sensitive formulations

The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.

Hydroxy-epoxide thermally cured undercoat for 193 NM lithography

The present invention is directed to a thermally curable polymer composition comprising a hydroxyl-containing polymer and a polyfunctional epoxide as a crosslinking agent. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography. In addition, the present invention also relates to a photolithographic coated substrate comprising: a substrate, the thermally cured undercoat composition on the substrate, and a radiation-sensitive resist topcoat on the thermally cured undercoat composition. Furthermore, the present invention further relates to a process for using the photolithographic coated substrate for the production of relief structures.

Hydroxy-amino thermally cured undercoat for 193 nm lithography

The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography.

Hydroxy-amino thermally cured undercoat of 193 nm lithography

The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography.

Production of acetal derivatized hydroxyl aromatic polymers and their use in radiation sensitive formulations

The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.

Thermally cured underlayer for lithographic application

Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula: wherein R¹ is H or methyl; R² is a substituted or unsubstituted C₆-C₁₄ aryl acrylate or C₆-C₁₄ aryl methacrylate group wherein the substituted groups may be phenyl, C_1-4 alkyl or C_1-4 alkoxy; R³ is a hydroxyl functionalized C₁-C₈ alkyl acrylate, methacrylate or C₆-C₁₄ aryl group, R⁴ is a C₁-C₁₀ linear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the [-R⁴O-]_p; R⁵ is a C₁-C₁₀ linear, branched or cyclic ...

Thermally cured underlayer for lithographic application

Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula:wherein R1 is H or methyl; R2 is a substituted or unsubstituted C6-C14 aryl acrylate or C6-C14 aryl methacrylate group wherein the substituted groups may be phenyl, C1-4 alkyl or C1-4 alkoxy; R3 is a hydroxyl functionalized C1-C8 alkyl acrylate, methacrylate or C6-C14 aryl group, R4 is a C1-C10 linear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the [-R4O-]p; R5 is a C1-C10 linear, branched or cyclic alkyl, substituted or unsubstituted C6-C14 aryl, or substituted or unsubstituted C7-C15 alicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25.

Selected block phenolic oligomers and their use in phenolic resin compositions and in radiation-sensitive resist compositions

Block phenolic oligomers of the formula (I): ##STR1## These may be reacted alone or with selected phenolic monomers during or after the formation of a phenolic novolak resin thereby said resin having at least one unit of formula (II): ##STR2##

Thermally stable phenolic resin compositions and their use in light-sensitive compositions

Perfluoroalkylsulfonic acid compounds for photoresists

A photoacid compound having general structure: R-O(CF2)nSO3X wherein n is an integer between about 1 to 4; R is selected from the group consisting of: substituted or unsubstituted C1-C12 linear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF2)pO)m(CF2)q- wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, or glycidyl; and X is selected from the group consisting of: organic cations and covalently bonded organic radicals.

Hydroxy-epoxide thermally cured undercoat for 193 nm lithography

The present invention is directed to a thermally curable polymer composition comprising a hydroxyl-containing polymer and a polyfunctional epoxide as a crosslinking agent. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography. In addition, the present invention also relates to a photolithographic coated substrate comprising: a substrate, the thermally cured undercoat composition on the substrate, and a radiation-sensitive resist topcoat on the thermally cured undercoat composition. Furthermore, the present invention further relates to a process for using the photolithographic coated substrate for the production of relief structures.

Production of acetal derivatized hydroxyl aromatic polymers and their use in radiation sensitive formulations

The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.

Photosensitive diazonaphthoquinone esters based on selected cyclic alkyl ether-containing phenolics and their use in radiation sensitive mixtures

A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formula (II): ##STR1## wherein the photosensitive compound is used in a radiation sensitive composition and a process for forming a positive patterned image.

Production of acetal derivatized hydroxyl aromatic polymers and their use in radiation sensitive formulations

Thermally stable phenolic resin compositions and their use in light-sensitive compositions

A phenolic novolak resin characterized by the product of a condensation reaction of an aldehyde comprising a haloacetaldehyde source or a mixture of a haloacetaldehyde source and a formaldehyde source with a phenolic monomer comprising at least one compound of formula (I), wherein R1, R2 and R3 are individually selected from hydrogen or a one to four carbon alkyl group and wherein the ratio of total carbon atoms in the sum of R1, R2 and R3 to the total number of phenolic nuclei in said resin is from about 0.5:1 to about 1.5:1 in the presence of a solvent; said resin made by employing a molar ratio of total aldehyde to total phenolic monomers from about 0.33:1 to about 0.70:1. These phenolic resins are suitable for use in light-sensitive compositions (e.g. positive-working photoresists).

Selected high thermal novolaks and positive-working radiation-sensitive compositions

Hydroxy-amino thermally cured undercoat for 193 nm lithography

The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography.

Light-sensitive o-quinone diazide composition and product with phenolic novolak prepared by condensation with haloacetoaldehyde

A phenolic novolak resin comprising the product of a condensation reaction of an aldehyde comprising a haloacetaldehyde source or a mixture of a haloacetaldehyde source and a formaldehyde source with a phenolic monomer comprising at least one compound of the formula: ##STR1## wherein R 1 , R 2 and R 3 are individually selected from hydrogen or a one to four carbon alkyl group and wherein the ratio of total carbon atoms in the sum of R 1 , R 2 and R 3 to the total number of phenolic nuclei in said resin is from about 0.5:1 to about 1.5:1 in the presence of a solvent; said resin made by employing a molar ratio of total aldehyde to total phenolic monomers from about 0.33:1 to about 0.70:1. These phenolic resins are suitable for use in light-sensitive compositions (e.g. positive-working photoresists).

High contrast photoresist developer

ABSTRACT HIGH CONTRAST PHOTORESIST DEVELOPER A positive photoresist metal ion aqueous developer is provided that gives a high contrast to the photo-resist. The developer disclosed comprises a formulation of aqueous alkali-base such as potassium hydroxide and a fluorocarbon surfactant. The incorporation of the fluorocarbon surfactant provides the unexpected increase in the contrast of the photoresist. The addition of the fluorocarbon surfactant increases the gamma from a typi-cal photoresist gamma (.gamma.) of 3 or less to a gamma greater than 10. The high contrast photoresist provides linewidth control and affords improved process latitude in photo-resist imaging. The linewidth control is particularly critical in cases where fine lines are to be defined in the resist that covers steps or topography on the coated substrate. The higher the contrast, the less affected the resist by the topography, provided the exposure is adequate to expose the resist. The process latitude afforded by the high contrast is a result of the ability to over develop (develop longer) the exposed resist without affecting the unexposed resist in the adjacent areas.

Selected block phenolic oligomers and their use in radiation-sensitive resist compositions

Block phenolic oligomers of the formula (I): <IMAGE> (I) These may be reacted alone or with selected phenolic monomers during or after the formation of a phenolic novolak resin thereby said resin having at least one unit of formula (II): <IMAGE> (II)

Selected block copolymer novolak binder resins and their use in radiation-sensitive compositions

Tertiary-butyl acrylate polymers and their use in photoresist compositions

A photosensitive resist composition comprising: a polymer of tertiary -butyl acrylate having monomeric units of: where 0.5≤a≤0.7; 0.15≤b≤0.3; 0.1≤c≤0.2; 0.3<b+c≤0.5; R is H, or a C 1 -C 4 alkyl group; R 1 = H, methyl, CH 2 OR 2 ; each R 3 is independently selected from H, methyl, CH 2 OR. CH 2 CN, CH 2 X, or CH 2 COOR 4 group where X= Cl, I, Br,or F; R 2 is H, or C 1 -C 4 alkyl; R 4 is a C 1 -C 4 alkyl group; R 5 is f a isobornyl, cyclohexyl methyl, cyclohexyl ethyl, benzyl, phenethyl, or tetrahydrofurfural group a photoacid generator; a solvent; and optionally, a basic compound.

Production of acetal derivatized hydroxyl aromatic polymers and their use in radiation sensitive formulations

Durch wärme vernetzbare hydroxyamino-unterschicht für lithographie 193 mn

Process for making polyimide-polyamic ester copolymers

Process for making polyimide-polyamic ester copolymers

Process for making polyimide-polyamic ester copolymers

A process for making polyimide-polyamic ester copolymer composition comprising reacting at least one diamine, a pyromellitic diacid diester compound; at least one other tetracarboxylic diacid diester compound and a selected phosphoramide in the presence of a base catalyst to form a polyimide-polyamic acid ester copolymer.

Chemical imidization reagent for polyimide synthesis

Process for making polymides from diamines and tetracarboxylic diacid diester

Verfahren zur herstellung einer strahlungsempfindlichen zusammensetzung

Process for preparing a radiation-sensitive composition

Process for preparing a radiation-sensitive composition

The present invention relates to a process for preparing a radiation-sensitive composition; comprising the steps of (1) passing a solution of a crude polymer comprising a mixture of polymer chains having different molecular weights through a porous polymeric media having a predetermined molecular weight cut-off (MWCO) value, thereby separating the crude polymeric mixture into a first fraction comprising polymer chains having molecular weights above the MWCO value and a second fraction comprising polymer chains having molecular weights below the MWCO value; and (2) adding at least one fraction produced in the first step to at least one radiation-sensitive compound and at least one solvent to produce a radiation-sensitive composition.

Ausgewählte O-Chinondiazidsulfonsäureestern von phenolischen Verbindungen

Ausgewählte O-chinondiazidsulfonsäureester von phenolischen Verbindungen und deren Verwendung in strahlungsempfindlichen Gemischen

Ausgewählte O-chinondiazidsulfonsäureester von phenolischen Verbindungen und deren Verwendung in strahlungsempfindlichen Gemischen

Ausgewählte O-Chinondiazidsulfonsäureestern von phenolischen Verbindungen

Radiation sensitive compositions containing image quality and profile enhancement additives

Process for preparing a radiation-sensitive composition

The present invention relates to a process for preparing a radiation-sensitive composition; comprising the steps of (1) passing a solution of a crude polymer comprising a mixture of polymer chains having different molecular weights through a porous polymeric media having a predetermined molecular weight cut-off (MWCO) value, thereby separating the crude polymeric mixture into a first fraction comprising polymer chains having molecular weights above the MWCO value and a second fraction comprising polymer chains having molecular weights below the MWCO value; and (2) adding at least one fraction produced in the first step to at least one radiation-sensitive compound and at least one solvent to produce a radiation-sensitive composition.

Process for preparing a radiation-sensitive composition

The present invention relates to a process for preparing a radiation-sensitive composition; comprising the steps of (1) passing a solution of a crude polymer comprising a mixture of polymer chains having different molecular weights through a porous polymeric media having a predetermined molecular weight cut-off (MWCO) value, thereby separating the crude polymeric mixture into a first fraction comprising polymer chains having molecular weights above the MWCO value and a second fraction comprising polymer chains having molecular weights below the MWCO value; and (2) adding at least one fraction produced in the first step to at least one radiation-sensitive compound and at least one solvent to produce a radiation-sensitive composition.

Radiation sensitive compositions containing image quality and profile enhancement additives

Radiation sensitive compositions containing image quality and profile enhancement additives

The present invention is a radiation sensitive composition that includes a polymer resin, a photoacid generator, a solvent, and a heterocyclic additive selected from the group consisting of: compounds of the formulas (I), (II), (III), and (IV): where R<1> is H, -NH2-, -OH, -N(CH3)2, -NH-CO-CH3, or (II) where R<2> is CH3 or benzoyl; (III) where R<3> is H, or C1-C4 alkyl; W, X, Y, and Z are each independently selected from CH2-, -C-, -CH(CH3)-, -C(CH3)2-, -NH-, or N(CH3)-, with the proviso that at least one of W, X, Y, or Z is C-, and at least one of W, X, Y, or Z is NH- or N(CH3)-; (IV) where A is CH= or C-; R<4> is H, -CH3, or CH2-CH(CH3)2; R<5> is H, -CH3, or CH2-CH(OH)-CH2(OH); R<6> is H; B and D are identical and selected from C- or CH-; one p and q is 0 and the other p and q is 1, when A is CH=; and p and q are both 1, when A is C-; and mixtures thereof.