28-11-2013 дата публикации
Номер: US20130313698A1
Принадлежит:
MEDIATEK INC.
A semiconductor package with reduced warpage problem is provided, including: a circuit board, having opposing first and second surfaces; a semiconductor chip, formed over a center portion of the first surface of the circuit board, having a first cross sectional dimension; a spacer, formed over a center portion of the semiconductor chip, having a second cross sectional dimension less than that of the first cross sectional dimension; an encapsulant layer, formed over the circuit board, covering the semiconductor chip and surrounding the spacer; a heat spreading layer, formed over the encapsulant layer and the spacer; and a plurality of solder balls, formed over the second surface of the circuit board. 1. A semiconductor package , comprising:a circuit board, having opposing first and second surfaces;a semiconductor chip, formed over a center portion of the first surface of the circuit board, having a first cross sectional dimension;a spacer, formed over a center portion of the semiconductor chip, having a second cross sectional dimension less than that of the first cross sectional dimension;an encapsulant layer, formed over the circuit board, covering the semiconductor chip and surrounding the spacer;a heat spreading layer, formed over the encapsulant layer and the spacer; anda plurality of solder balls, formed over the second surface of the circuit board.2. The semiconductor package as claimed in claim 1 , further comprising a thermal interlayer disposed between the heat spreading layer and the encapsulant layer and the spacer.3. The semiconductor package as claimed in claim 1 , further comprising a first adhesive layer claim 1 , formed over the first surface of the circuit board and the semiconductor chip.4. The semiconductor package as claimed in claim 1 , further comprising a second adhesive layer claim 1 , formed between the spacer and the semiconductor chip.5. The semiconductor package as claimed in claim 1 , wherein a ratio between the first cross sectional ...
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