Reconfigurable RF Front End And Antenna Arrays For Radar Mode Switching

Concepts and examples pertaining to reconfigurable radio frequency (RF) front end and antenna arrays for radar mode switching are described. A processor associated with a radar system selects a mode of a plurality of modes in which to operate the radar system. The processor then controls the radar system to operate in the selected mode by utilizing a plurality of antennas in a respective configuration of a plurality of configurations of the antennas which corresponds to the selected mode. Each configuration of the plurality of configurations of the antennas results in respective antenna characteristics. Each configuration of the plurality of configurations of the antennas utilizes a respective number of antennas of the plurality of antennas. 1. A method , comprising:selecting, by a processor associated with a radar system, a mode of a plurality of modes in which to operate the radar system; andcontrolling, by the processor, the radar system to operate in the selected mode by utilizing a plurality of antennas in a respective configuration of a plurality of configurations of the antennas which corresponds to the selected mode,wherein each configuration of the plurality of configurations of the antennas results in respective antenna characteristics, andwherein each configuration of the plurality of configurations of the antennas utilizes a respective number of antennas of the plurality of antennas.2. The method of claim 1 , wherein the selecting of the mode of the plurality of modes comprises selecting a mode from a plurality of modes comprising:an ultra-short-range radar (USRR) mode;a short-range radar (SRR) mode;a medium-range radar (MRR) mode; anda long-range radar (LRR) mode.3. The method of claim 1 , wherein the respective antenna characteristics of each configuration of the plurality of configurations of the antennas comprise respective values in terms of at least an antenna gain and a field of view.4. The method of claim 1 , wherein the controlling of the radar ...

Method and apparatus to provide digitally controlled crystal oscillators

Methods and systems to provide digitally controlled crystal oscillators are disclosed. One example method includes determining a state of an oscillator system and selecting a first output of a digitally controlled crystal oscillator or a second output of a second oscillator based on the determination. In an example implementation, the second oscillator is a ring oscillator.

Method and Associated Apparatus for Clock-Data Edge Alignment

An edge alignment apparatus includes: a signal source, for generating a first and a second square wave signals; a phase delay circuit, for receiving the first and the second square wave signals to generate a delayed first and a delayed second square wave signals; a data circuit, for generating a third square wave signal according to the delayed second square wave signal; and a phase calibrating circuit, for receiving the third square wave signal and the delayed first squared wave signal to generate at least one phase tuning signal to the phase delay circuit for tuning a phase difference between the delayed first and the delayed second square wave signals, such that a signal edge of the third square wave signal aligns with that of the first square wave signal. The first, second and third square wave signals have a same frequency. 1. An apparatus for signal edge alignment , comprising:a signal source that generates a first square wave signal and a second square wave signal;a phase delay circuit that receives the first square wave signal and the second square wave signal, and generates a delayed version of the first square wave signal and a delayed version of the second square wave signal according to a phase tuning signal;a data circuit, that generates a third square wave signal according to the delayed version of the second square wave signal; anda phase calibration circuit that receives the third square wave signal and the first square wave signal, and generates at the least one phase tuning signal to the phase delay circuit for tuning a phase difference between the delayed version of the first square wave signal and the delayed version of the second square wave signal, such that a signal edge of the third square wave signal aligns with a signal edge of the first square wave signal;wherein, the first square wave signal, the second square wave signal and the third square wave signal have a same frequency.2. The apparatus according to claim 1 , wherein the data ...

System and Method for Increasing Radio Frequency (RF) Microwave Inductor-Capacitor (LC) Oscillator Frequency Tuning Range

System and method for increasing the frequency tuning range of a RF/microwave LC oscillator. A preferred embodiment comprises a voltage controlled oscillator (VCO) configured to generate an output signal at a frequency that is dependent upon a magnitude of an input voltage level and an effective inductance of an inductive load and a variable inductor coupled to the VCO. The variable inductor comprises a primary inductor coupled to the VCO to produce a magnetic field based upon a current flowing through the primary inductor and a secondary inductor magnetically coupled to the primary inductor, the secondary inductor to affect the magnitude of the effective inductance of the primary inductor.

Negative contributive offset compensation in a transmit buffer utilizing inverse clocking

A novel method and apparatus for a negative contributive offset compensation mechanism for a transmit buffer adapted to compensate for the positive offset generated by higher order sigma-delta modulators used to amplitude modulate the transmit buffer. The positive outputs from the sigma-delta modulator are processed differently than the negative outputs. The inverters associated with the negative outputs in the sigma-delta modulator are removed and the clock signal used to drive the transistors corresponding to the negative outputs is negated or shifted 180 degrees from the clock used to drive the transistors corresponding to the positive outputs. A non-inverted version of the clock is used with the positive outputs and an inverse clock is used with the negative outputs. Use of the inverse clock causes a negative contributive offset to be generated that is added on the second half cycle of each clock. The result is an offset compensated RF output signal having zero offset.

On-chip test mechanism for transceiver power amplifier and oscillator frequency

An on-chip test mechanism for transceiver power amplifier and oscillator frequency for use with the transmitter portion of an integrated RF transceiver. The invention eliminates the need for expensive RF test equipment, permitting the use of low cost test equipment to test an integrated RF transmitter. In addition, test time spent to verify the power levels and frequency ranges of a tested transmitter is reduced, further reducing testing costs. The RF output from the power amplifier in the transmitter is input to a built-in dedicated analog comparator having a configurable threshold. The threshold is adjusted to a predetermined level at which crossings start to occur at the comparator output. The comparator outputs pulses only if the power amplifier output is above a minimum configurable level. The comparator output is input to a frequency divider whose frequency output is tested by a low cost external tester to determine the actual RF frequency thereby confirming generation of the correct ...

Semiconductor package with layer structures, antenna layer and electronic component

A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

Feedforward filter using translational filter

In accordance with an embodiment, a feedforward filter includes a first path, at least one second path and a signal combiner. The first path has a first translational filter, and employed for providing a first frequency response and generating a first output in response to an input signal based on the first frequency response. The at least one second path has a second translational filter and is coupled to the first path. The at least one second path is employed for providing a second frequency response that is different from the first frequency response to the input signal, and generating at least one second output in response to the input signal based on the second frequency response. The signal combiner is coupled to the first path and the second path, and employed for combining the first output and the at least one second output to generate a filtered signal.

Digital Frequency Modulation Aided AMPM Predistortion Digital Transmitter

Amplitude-modulation (AM) to AM (AMAM) predistortion data is obtained from an AMAM predistorter. When applied to a digital quadrature signal, the AMAM predistortion data predistorts in-phase (I) and quadrature (Q) data words in a digital quadrature modulator. AM to phase-modulation (AMPM) predistortion data is obtained that is associated with the AMAM predistortion data and a frequency change or a phase shift in a local oscillator (LO) signal is compelled in accordance with the AMPM predistortion data. The frequency-changed or phase-shifted LO signal is provided to a digital upconverter such that an output signal of the digital upconverter is linearized with respect to at least phase distortion in the digital upconverter. 1. An digital transmitter comprising:a digital upconverter generating a radio-frequency (RF) output signal having a predetermined output frequency from a sequence of predistorted digital in-phase (I) and quadrature (Q) data words generated from respective input I and Q data words provided from respective I and Q data channels;a programmable local oscillator (PLO) that provides a local oscillator (LO) signal to the digital upconverter in accordance with which the predetermined output frequency is established, the phase and period of the LO signal being selectable in accordance with a control signal provided to the PLO; and an amplitude-modulation (AM) to AM (AMAM) predistortion processor that predistorts the I and Q data words in accordance with an AMAM distortion profile of the digital upconverter; and', 'an AM to phase-modulation (AMPM) predistortion processor to provide the control signal to the PLO in accordance with the predistorted I and Q data words obtained from the AMAM predistortion processor, the control signal being indicative of a phase shift or period change in the LO signal at selected periods thereof in accordance with an AMPM predistortion profile of the digital upconverter., 'a predistortion processor receiving the input I and Q ...

WIRE BONDER

A wire bonder suitable for wire bonding a chip disposed on a carrier and bonding pads of the carrier is provided. The wire bonder includes a stage, a heater plate, a compression plate, a pair of clamping bases, a pair of extended blocks and a capillary. The heater plate is disposed on the stage. The compression plate arranged above the heater plate is able to move upward or downward for compressing the carrier. The clamping bases are arranged at two opposite sides of the compression plate, wherein the length of the compression plate does not match with the distance between the clamping bases. A pair of extended blocks is connected to a pair of clamping bases at one end, respectively, and connected to the compression plate at the other. The capillary is arranged above the compression plate for forming the bonding wires electrically connecting the chip and the carrier.

System and method for increasing radio frequency (RF)/microwave inductor-capacitor (LC) oscillator frequency tuning range

System and method for increasing the frequency tuning range of a RF/microwave LC oscillator. A preferred embodiment comprises a voltage controlled oscillator (VCO) configured to generate an output signal at a frequency that is dependent upon a magnitude of an input voltage level and an effective inductance of an inductive load and a variable inductor coupled to the VCO. The variable inductor comprises a primary inductor coupled to the VCO to produce a magnetic field based upon a current flowing through the primary inductor and a secondary inductor magnetically coupled to the primary inductor, the secondary inductor to affect the magnitude of the effective inductance of the primary inductor.

POWER RATCHET HEAD

A power ratchet head is composed of a main body and a reinforcing rib. The main body is hollow inside and includes a pair of stopping portions, a receiving space, and a first through hole. The stopping portions are spaced from each other, extending outward from one end of the main body. The receiving space is formed between the two stopping portions. The first through hole runs through one of the stopping portions. The reinforcing rib is connected between the two stopping portions and located at free ends of the stopping portions, having a width that is smaller than the radius of the first through hole. The reinforcing rib is connected with the free ends of the stopping portions to structurally reinforce the main body, such that the stopping portions are not subject to outward deformation and the working life of the power ratchet head can be enhanced.

SYSTEM AND METHOD FOR IMPLEMENTING LOW-COST ELECTRONIC GYROSCOPES AND ACCELEROMETER

Accelerometers have a number of wide-ranging uses, and it is desirable to both increase their accuracy while decreasing size. Here, millimeter or sub-millimeter wavelength accelerometers are provided which has the advantage of having the high accuracy of an optical accelerometer, while being compact. Additionally, because millimeter or sub-millimeter wavelength signals are employed, cumbersome and awkward on-chip optical devices and bulky optical mediums can be avoided.

APPARATUS AND METHOD FOR APPLYING FREQUENCY CALIBRATION TO LOCAL OSCILLATOR SIGNAL DERIVED FROM REFERENCE CLOCK OUTPUT OF ACTIVE OSCILLATOR THAT HAS NO ELECTROMECHANICAL RESONATOR

A wireless system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock. The LO signal generation circuit includes an active oscillator. The active oscillator generates the reference clock, wherein the active oscillator includes at least one active component, and does not include an electromechanical resonator. The RX circuit generates a down-converted RX signal by performing down-conversion upon an RX input signal according to the LO signal. The calibration circuit generates a frequency calibration control output according to a signal characteristic of the down-converted RX signal, and outputs the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

System and method for providing a low frequency filter pole

Systems are provided for producing a low frequency filter pole. A first bond pad is coupled to a power source. A second bond pad is inductively connected to the first bond pad by a first bond wire. A capacitor is connected to the second bond pad. A third bond pad is inductively connected to the second bond pad by a second bond wire. The second bond wire, in conjunction with the capacitor, forms a low frequency filter pole to mitigate noise in a regulated signal provided at the third bond pad.

Oscillator with multi-tap inductor, capacitors, and negative-Gm stages

System and method for increasing the frequency tuning range of a RF/microwave LC oscillator. An electronic communications device includes a controller to regulate the operation of the electronic communications device, a modem coupled to the controller, a radio frequency unit coupled to the controller and to the modem, an oscillator coupled to the controller and to the radio frequency unit, and an amplifier coupled to the radio frequency unit. The oscillator produces a timing and reference signal for the radio frequency unit based on control information from the controller. The oscillator includes a multi-tap inductor that may controllably alter its effective inductance to change the timing and reference signal provided to the radio frequency unit.

Low noise high isolation transmit buffer gain control mechanism

A novel apparatus for a low noise, high isolation, all digital transmit buffer gain control mechanism. The gain control scheme is presented in the context of an all digital direct digital-to-RF amplitude converter (DRAC), which efficiently combines the traditional transmit chain functions of upconversion, I and Q combining, D/A conversion, filtering, buffering and RF output amplitude control into a single circuit. The transmit buffer is constructed as an array of NMOS switches. The control logic for each NMOS switch comprises a pass-gate type AND gate whose inputs are the phase modulated output of an all digital PLL and the amplitude control word from a digital control block. Power control is accomplished by recognizing the impairments suffered by a pseudo class E pre-power amplifier (PPA) when implemented in a CMOS process. Firstly, the NMOS switches of the array have significant on resistance and thus can only draw a limited current from the an RF choke when the input waveform is high ...

On-chip test mechanism for transceiver power amplifier and oscillator frequency

An on-chip test mechanism for transceiver power amplifier and oscillator frequency for use with the transmitter portion of an integrated RF transceiver. The RF output from the power amplifier in the transmitter is input to a built-in dedicated analog comparator having a configurable threshold. The threshold is adjusted to a predetermined level at which crossings start to occur at the comparator output. The comparator outputs pulses only if the power amplifier output is above a minimum configurable level. The comparator output is input to a frequency divider whose frequency output is tested by a low cost external tester to determine the actual RF frequency thereby confirming generation of the correct oscillator frequency and that the amplitude of the signal at the output of the power amplifier is sufficiently high for the configurable threshold level to be exceeded, thereby determining the compliance of the output power with its defined specifications.

System and method for providing a low frequency filter pole

Systems are provided for producing a low frequency filter pole. A first bond pad is coupled to a power source. A second bond pad is inductively connected to the first bond pad by a first bond wire. A capacitor is connected to the second bond pad. A third bond pad is inductively connected to the second bond pad by a second bond wire. The second bond wire, in conjunction with the capacitor, forms a low frequency filter pole to mitigate noise in a regulated signal provided at the third bond pad.

Communication device and control method thereof

A communication device is provided in the present invention. The communication device comprises an oscillation signal source, a tunable capacitor array, a frame counter; and a control module. The control module is configured to jointly or separately control the tunable capacitor array and the frame counter to compensate a first frequency offset of the oscillation signal source when the communication device operates in a first mode, and to jointly or separately control the tunable capacitor array and the frame counter to compensate a second frequency offset of the oscillation signal source when the communication device operates in a second mode.

POWER AMPLIFYING APPARATUS AND WIRELESS SIGNAL TRANSMITTER UTILIZING THE SAME

A power amplifying apparatus is provided. A reference signal generator provides a reference signal having an enabling state and a disabling state. A digital power amplifier generates a current based on the reference signal and an input signal. An output signal of the digital power amplifier is related to the current. When the reference signal is in the enabling state, the current is related to the input signal. When the reference signal is in the disabling state, the current is irrelevant to the input signal. During the enabling state of the reference signal, a data generator provides an output alternating between an in-phase signal and a quadrature-phase signal as the input signal to the digital power amplifier. When the reference signal is in the disabling state, the data generator provides a fixed signal as the input signal to the digital power amplifier.

Low noise high isolation transmit buffer gain control mechanism

A novel apparatus for a low noise, high isolation, all digital transmit buffer gain control mechanism. The gain control scheme is presented in the context of an all digital direct digital-to-RF amplitude converter (DRAC), which efficiently combines the traditional transmit chain functions of upconversion, I and Q combining, D/A conversion, filtering, buffering and RF output amplitude control into a single circuit. The transmit buffer is constructed as an array of NMOS switches. The control logic for each NMOS switch comprises a pass-gate type AND gate whose inputs are the phase modulated output of an all digital PLL and the amplitude control word from a digital control block. Power control is accomplished by recognizing the impairments suffered by a pseudo class E pre-power amplifier (PPA) when implemented in a CMOS process. Firstly, the NMOS switches of the array have significant on resistance and thus can only draw a limited current from the an RF choke when the input waveform is high ...

Efficient charge transfer using a switched capacitor resistor

The application of a non-zero voltage offset to rotating capacitors 1111 and 1112 permit the use of a single positive voltage supply. However, the precharging of the rotating capacitors 1111 and 1112 is power inefficient. A power efficient and low-noise precharging operation is realized through the sharing of the charge on a feedback capacitor 1075 and 1080 that is significantly larger than the rotating capacitors 1111. Once a precharging operation is complete, the charge on the feedback capacitor 1075 and 1080 is refreshed from its residual charge level (rather than zero charge level) to a desired charge level.

Radar interference mitigation method and apparatus

Methods and apparatuses pertaining to radar interference mitigation are described. A processor associated with an apparatus may generate a plurality of wave frames such that one or more aspects of the plurality of wave frames vary from one wave frame to another wave frame of the plurality of wave frames. Each of the plurality of wave frames may respectively include a plurality of chirps. A wireless transmitter associated with the apparatus may transmit the plurality of wave frames. A wireless receiver associated with the apparatus may receive one or more reflected waves comprising at least a portion of one or more of the wave frames reflected by an object. The processor may determine a distance between the object and the apparatus, a speed of the objet, or both, based on an analysis of the one or more reflected waves.

Frequency synthesizer with digitally-controlled oscillator

A transmitter (10) based on a frequency synthesizer includes an LC tank (12) of a digitally controlled oscillator (DCO) with various arrays of capacitors. The LC tank 12 is divided into two major groups that reflect two general operational modes: acquisition and tracking. The first group (process/voltage/temperature and acquisition) approximately sets the desired center frequency of oscillation initially, while the second group (integer and fractional tracking) precisely controls the oscillating frequency during the actual operation. For highly accurate outputs, dynamic element matching (DEM) is used in the integer tracking controller to reduce non-linearities caused by non-uniform capacitor values. Also, a preferred range of the integer tracking capacitor array may be used for modulation after the selected channel has been acquired. A digital sigma-delta modulator circuit (50) drives a capacitor array (14d) in response to the fractional bits of the error word. On mode switches, the accumulated ...

Semiconductor package device

An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.

METHOD AND APPARATUS FOR PERFORMING OBJECT DETECTION BY USING DETECTION THRESHOLD VALUES DERIVED FROM ADDING DIFFERENT OFFSET VALUES TO REFERENCE THRESHOLD VALUES

An object detection method includes: obtaining a first offset value and a second offset value, setting a first detection threshold value by adding the first offset value to a first reference threshold value, setting a second detection threshold value by adding the second offset value to a second reference threshold value, obtaining a detection input, and performing target detection upon the detection input according to at least the first detection threshold value and the second detection threshold value. The first offset value is different from the second offset value. The first reference threshold value is determined for detecting if at least one object with a first value of an object characteristic exists. The second reference threshold value is determined for detecting if at least one object with a second value of the object characteristic exists. The second value is different from the first value.

System and method for increasing radio frequency (RF) microwave inductor-capacitor (LC) oscillator frequency tuning range

System and method for increasing the frequency tuning range of a RF/microwave LC oscillator. A preferred embodiment comprises a voltage controlled oscillator (VCO) configured to generate an output signal at a frequency that is dependent upon a magnitude of an input voltage level and an effective inductance of an inductive load and a variable inductor coupled to the VCO. The variable inductor comprises a primary inductor coupled to the VCO to produce a magnetic field based upon a current flowing through the primary inductor and a secondary inductor magnetically coupled to the primary inductor, the secondary inductor to affect the magnitude of the effective inductance of the primary inductor.

Digital transmitter and method for calibrating digital transmitter

A digital transmitter includes: a plurality of adjustable delay lines arranged to delay a plurality of digital input signals by a plurality of delay times to generate a plurality of delayed digital input signals respectively; a plurality of converting devices arranged to convert the plurality of delayed digital input signals into a plurality of converting signals respectively; and a calibration device arranged to adjust a delay time of at least one adjustable delay line in the plurality of adjustable delay lines to make the plurality of converting devices convert the plurality of delayed digital input signals at respective desire time points.

Multi-band low noise amplifier system

A low noise amplifier (LNA) operates over multiple frequency bands while occupying less silicon area than known LNA implementations. The LNA includes output matching that can be tuned by an adjustable inductor together with a tunable capacitor bank.

ESD protection for RF power amplifier circuits

An electrostatic discharge (ESD) device for protecting a power amplifier circuit is disclosed. The ESD device comprises a first ESD protection circuit coupled between a positive terminal of a supply voltage and a negative terminal of the supply voltage, and a second ESD protection circuit coupled between the negative terminal of the supply voltage and an output terminal of the power amplifier circuit, wherein a first current path is formed from the positive terminal to the output terminal through the first and second ESD protection circuits. A circuit device operative to increase impedance of a second current path from the positive terminal to the output terminal through the power amplifier circuit to divert current from the second current path to the first current path in the course of an ESD event.

SEMICONDUCTOR PACKAGE WITH INTEGRATED ANTENNA AND SHIELDING PILLARS

A semiconductor package includes a base film, a semiconductor die on the base film, metal studs on the semiconductor die, shielding pillars on the base film and around the semiconductor die, a first molding compound encapsulating the semiconductor die, the metal studs, and the shielding pillars, a first re-distribution structure on the first molding compound, a second molding compound on the first re-distribution structure, through-mold-vias in the second molding compound, and a second re-distribution structure on the second molding compound and electrically connected to the through-mold-vias. The second re-distribution structure comprises an antenna.

HARMONIC REJECTION TRANSLATIONAL FILTER

A harmonic-rejection translational filter includes: a first path, a second path and a signal combiner. The first path has a first translational filter that is driven by a plurality of first oscillation signals, and is arranged to generate a first output signal according to an input signal. The second path has a second translation filter that is driven by a plurality of second oscillation signals that are different from the first oscillation signals in phase. The second path is coupled to the first path and arranged to generate a second output signal according to the input signal. The signal combiner is coupled to the first path and the second path, and arranged to combine the first output signal and the second output signal to SIN generate a filtered signal. 1. A harmonic-rejection translational filter , comprising:a first path, having a first translational filter, driven by a plurality of first oscillation signals, arranged to generate a first output signal according to an input signal;a second path, coupled to the first path, each having a second translation filter that is driven by a plurality of second oscillation signals that are different from the first oscillation signals in phase, arranged to generate a second output signal according to the input signal; anda signal combiner, coupled to the first path and the second path, arranged to combine the first output signal and the second output signal to generate a filtered signal, wherein harmonic responses caused by the first oscillation signals and the second oscillation signals are substantially reduced from the filtered signal by combining the first output signal and the second output signal.2. The harmonic-rejection translational filter of claim 1 , wherein the first oscillation signals and the second oscillation signals have a same frequency.3. The harmonic-rejection translational filter of claim 1 , wherein each of the first translation filter and the second translation filter includes a plurality of filter ...

Method and associated apparatus for clock-data edge alignment

An edge alignment apparatus includes: a signal source, for generating a first and a second square wave signals; a phase delay circuit, for receiving the first and the second square wave signals to generate a delayed first and a delayed second square wave signals; a data circuit, for generating a third square wave signal according to the delayed second square wave signal; and a phase calibrating circuit, for receiving the third square wave signal and the delayed first squared wave signal to generate at least one phase tuning signal to the phase delay circuit for tuning a phase difference between the delayed first and the delayed second square wave signals, such that a signal edge of the third square wave signal aligns with that of the first square wave signal. The first, second and third square wave signals have a same frequency.

Local oscillation generator, associated communication system and method for local oscillation generation

A local oscillation generator includes a multi-phase circuit and a multiplexer. The multi-phase oscillator provides a plurality of multi-phase oscillation signals of a same frequency and different phases. The multiplexer conducts one of the multi-phase oscillation signals to an output end in different time slots to provide an output oscillation signal. The frequency of the multi-phase oscillation signals is the same as a fundamental frequency, and the frequency of the output oscillation signal is different from the fundamental frequency. Thus, the local oscillation generator provides a local oscillation signal according to the output oscillation signal such that the fundamental frequency is different from the frequency of the local oscillation signal.

Electrostatic discharge protection device including precharge reduction

ESD protection circuitry for a signal power supply pad ( 801 ) comprising a discharge circuit ( 802 ) operable to discharge the ESD pulse to ground, and a precharge reduction circuit ( 810 ) in parallel with the discharge circuit. This precharge reduction circuit is operable to cancel any precharge voltage to ground before an ESD event, and also to discharge any trailing pulse to ground after an ESD event. The reduction circuit comprises a discharge resistor ( 811 ), preferably about 10 kOmega, connected to the discharge circuit, and a control MOS transistor ( 812 ) in series with the discharge resistor. The transistor source ( 812 a) is connected to the resistor, the drain ( 812 b) to ground, and the gate ( 812 c) to core power ( 813 ) so that the transistor is shut off during IC operation and conducting when pre-charge or post-charge is present at an ESD pulse.

ACTIVE DETECTION TECHNIQUES FOR PHOTOACOUSTIC SENSORS

Traditional photoacoustic sensors generally operate in a passive mode, which can degrade the performance. Here, however, a photoacoustic sensor has been disclosed that operates an acoustic resonance chamber and a transducer in an active mode so as to avoid the problems associated with traditional photoacoustic sensors; in particular, because the acoustic resonance chamber operates at near atmospheric pressure such as 100's Torr as opposed to 1 m Torr type of pressure for radio spectroscopy, the sensor is allowed to be scaled to operate on an integrated circuit or IC.

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits are disclosed. An example method comprises forming a substrate having a first trace and a contact, attaching an integrated circuit to the substrate over the first trace, and electrically coupling the first trace to the contact via an electrical conductor that extends over the integrated circuit to form the inductor in the packaged integrated circuit.

Radar sensor housing design

Various examples pertaining to a sensor housing design for millimeter wave (mmWave) sensors are described. A sensor housing may include a radar sensor, a printed circuit board (PCB), a radome and a PCB holder. The radar sensor may be capable of emitting a radio wave. The PCB may have a first side and a second side opposite the first side with the radar sensor mounted on the first side thereof to form a PCB assembly (PCBA). The radome may include a cavity in which the PCBA is disposed. The PCB holder may be disposed along a circumference of an inner wall of the radome, and the PCB holder may be configured to hold the PCBA such that a distance between an inner surface of the radome and a side of the radar sensor facing the inner surface of the radome is proportional to half wavelength of the radio wave.

Harmonic rejection translational filter

A harmonic translational filter includes a first path, a second path and a signal combiner. The first path has a first translational filter that is driven by a plurality of first oscillation signals, and is arranged to generate a first output signal according to an input signal. The second path has a second translation filter that is driven by a plurality of second oscillation signals that are different from the first oscillation signals in phase. The second path is coupled to the first path and arranged to generate a second output signal according to the input signal. The signal combiner is coupled to the first path and the second path, and arranged to combine the first output signal and the second output signal to generate a filtered signal.

System and method for increasing radio frequency (RF)/microwave inductor-capacitor (LC) oscillator frequency tuning range

System and method for increasing the frequency tuning range of a RF/microwave LC oscillator. A preferred embodiment comprises a voltage controlled oscillator (VCO) configured to generate an output signal at a frequency that is dependent upon a magnitude of an input voltage level and an effective inductance of an inductive load and a variable inductor coupled to the VCO. The variable inductor comprises a primary inductor coupled to the VCO to produce a magnetic field based upon a current flowing through the primary inductor and a secondary inductor magnetically coupled to the primary inductor, the secondary inductor to affect the magnitude of the effective inductance of the primary inductor.

Segmented Power Amplifier with Varying Segment Activation

Various apparatuses and methods for varying segment activation in a segmented power amplifier are disclosed herein. For example, some embodiments provide a power amplifier including an input, an output, a plurality of amplifier segments and a controller. The amplifier segments are connected in parallel between the input and the output and are adapted to be activated and inactivated. The power level at the output may be controlled by changing a number of the amplifier segments that are activated concurrently. The controller is connected to the amplifier segments and is adapted to vary which of the amplifier segments are activated to arrive at a selected number of activated amplifier segments.

Radar Interference Mitigation Method And Apparatus

Methods and apparatuses pertaining to radar interference mitigation are described. A processor associated with an apparatus may generate a plurality of wave frames such that one or more aspects of the plurality of wave frames vary from one wave frame to another wave frame of the plurality of wave frames. Each of the plurality of wave frames may respectively include a plurality of chirps. A wireless transmitter associated with the apparatus may transmit the plurality of wave frames. A wireless receiver associated with the apparatus may receive one or more reflected waves comprising at least a portion of one or more of the wave frames reflected by an object. The processor may determine a distance between the object and the apparatus, a speed of the objet, or both, based on an analysis of the one or more reflected waves. 1. A method , comprising:transmitting, by a wireless transmitter associated with an apparatus, a plurality of wave frames, each of the plurality of wave frames respectively comprising a plurality of chirps, such that one or more aspects of the plurality of wave frames vary from one wave frame to another wave frame of the plurality of wave frames; andreceiving, by a wireless receiver associated with the apparatus, one or more reflected waves comprising at least a portion of one or more of the wave frames reflected by an object.2. The method of claim 1 , wherein the one or more aspects of the plurality of wave frames comprise a frequency-modulated continuous-wave (FMCW) ramp rate claim 1 , a frequency range claim 1 , an initial phase of a radio frequency (RF) carrier claim 1 , a duration of a gap between two adjacent chirps claim 1 , a duration of a gap between two adjacent wave frames claim 1 , a slope of an up ramp of a chirp claim 1 , a slope of a down ramp of the chirp claim 1 , or any combination thereof claim 1 , of the respective chirps of each wave frame of the plurality of wave frames.3. The method of claim 1 , wherein the plurality of wave ...

System and method for increasing frequency tuning range

System and method for increasing the frequency tuning range of a RF/microwave LC oscillator. An electronic communications device includes a controller to regulate the operation of the electronic communications device, a modem coupled to the controller, a radio frequency unit coupled to the controller and to the modem, an oscillator coupled to the controller and to the radio frequency unit, and an amplifier coupled to the radio frequency unit. The oscillator produces a timing and reference signal for the radio frequency unit based on control information from the controller. The oscillator includes a multi-tap inductor that may controllably alter its effective inductance to change the timing and reference signal provided to the radio frequency unit.

APPARATUS AND METHOD FOR APPLYING FREQUENCY CALIBRATION TO LOCAL OSCILLATOR SIGNAL DERIVED FROM REFERENCE CLOCK OUTPUT OF ACTIVE OSCILLATOR

A system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock, and includes an active oscillator that generates the reference clock. The active oscillator includes at least one active component. The RX circuit generates a processed RX signal by processing an RX input signal according to the LO signal. The calibration circuit checks a signal characteristic of the processed RX signal by detecting if a calibration tone exists within a receiver bandwidth, set a frequency calibration control output in response to the calibration tone being not found in the receiver bandwidth, and output the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

COMMUNICATION DEVICE AND CONTROL METHOD THEREOF

A communication device is provided in the present invention. The communication device comprises an oscillation signal source, a tunable capacitor array, a frame counter; and a control module. The control module is configured to jointly or separately control the tunable capacitor array and the frame counter to compensate a first frequency offset of the oscillation signal source when the communication device operates in a first mode, and to jointly or separately control the tunable capacitor array and the frame counter to compensate a second frequency offset of the oscillation signal source when the communication device operates in a second mode. 1. A control method , applied to a communication device comprising an oscillation signal source , a tunable capacitor array and a frame counter , the control method comprising:when the communication device operates in a first mode, compensating a first frequency offset of the oscillation signal source jointly or separately by the tunable capacitor array and the frame counter; andwhen the communication device operates in a second mode, compensating a second frequency offset of the oscillation signal source jointly or separately by the tunable capacitor array and the frame counter.2. The control method according to claim 1 , further comprising:providing predetermined compensation information;wherein, the frame counter compensates the second frequency offset of the oscillation signal source according to the predetermined compensation information.3. The control method according to claim 1 , further comprising:when the communication device is switched from the first mode to the second mode, reducing a capacitance value of the tunable capacitor array.4. The control method according to claim 3 , wherein when the communication device operates in the second mode claim 3 , the frame counter compensates the second frequency offset of the oscillation signal source according to a control value of the tunable capacitor array.5. The control ...

TRANSCEIVERS WITH A TRANSFORMER SUPPORTING MULTIBAND OPERATION

Several multiband transceivers are disclosed. An exemplified multiband transceiver supporting different bands has a transformer, an inbound switch circuit, and an outbound switch circuit. The transformer has input ports on a primary side, and output ports on a secondary side. The input ports are direct-current isolated from and magnetically coupled to the output ports. The inbound switch circuit is configured to connect one of the input ports with an RF signal source for signal transmission. The outbound switch circuit is configured to connect one of the output ports with a RF output load. Optionally, an input tunable capacitor is configured to shunt with the effective inductance of one of the input ports and form a LC tank for band selection. 1. A multiband transceiver capable of supporting different bands , comprising:a transformer, comprising a plurality of input ports on a primary side, and a plurality of output ports on a secondary side, wherein the plurality of input ports are direct-current isolated from and magnetically coupled to the plurality of output ports;an inbound switch circuit, configured to apply a RF signal source to one of the plurality of input ports for signal transmission; andan outbound switch circuit, configured to connect one of the plurality of output ports to a RF output load.2. The multiband transceiver of claim 1 , further comprising at least one input tunable capacitor configured to shunt with one of the plurality of input ports and form a LC tank for band selection.3. The multiband transceiver of claim 1 , wherein a high-band output port is connected to a high-band RF output load by the outbound switch circuit when the multiband transceiver operates at a high band claim 1 , a low-band output port is connected to a low-band RF output load when the multiband transceiver operates at a low band claim 1 , and an inductance looking into the high-band output port is different from an inductance looking into the low-band output port.4. The ...

Oscillator system, method of providing a resonating signal and a communications system employing the same

An nth-order oscillator system for providing a resonating signal, a method of generating a resonating signal and a communications system. In one embodiment, the nth-order oscillator system, n being greater than two, includes (1) an amplifier configured to provide an intermediate signal and (2) a feedback loop including an nth-order complex LC tank and configured to generate the resonating signal by feeding back a complex-filtered form of the intermediate signal to the amplifier.

Methodology to guard ESD protection circuits against precharge effects

An ESD protection circuit (710) is guarded by a parallel first precharge elimination circuit (720) relative to an I/O pad (721) and a parallel second precharge elimination circuit (730) relative to a VDD pad (731). The precharge elimination circuits are synchronized with the ESD protection circuit to eliminate any precharge voltage to ground before an ESD pulse affects the I/O pad or VDD pad. A diode (722) is connected between I/O pad and VDD. Circuit (720) is between I/O pad and ground (740) and is powered by the same VDD. Circuit (720) includes a first resistor (723), a first nMOS transistor (724), and a first RC timer including a second resistor (725) and a first capacitor (726). Circuit (730) includes a third resistor (733), a second nMOS transistor (734), and a second RC timer including a fourth resistor (735) and a second capacitor (736).

METHODOLOGY TO GUARD ESD PROTECTION CIRCUITS AGAINST PRECHARGE EFFECTS

An ESD protection circuit ( 710 ) is guarded by a parallel first precharge elimination circuit ( 720 ) relative to an I/O pad ( 721 ) and a parallel second precharge elimination circuit ( 730 ) relative to a VDD pad ( 731 ). The precharge elimination circuits are synchronized with the ESD protection circuit to eliminate any precharge voltage to ground before an ESD pulse affects the I/O pad or VDD pad. A diode ( 722 ) is connected between I/O pad and VDD. Circuit ( 720 ) is between I/O pad and ground ( 740 ) and is powered by the same VDD. Circuit ( 720 ) includes a first resistor ( 723 ), a first nMOS transistor ( 724 ), and a first RC timer including a second resistor ( 725 ) and a first capacitor ( 726 ). Circuit ( 730 ) includes a third resistor ( 733 ), a second nMOS transistor ( 734 ), and a second RC timer including a fourth resistor ( 735 ) and a second capacitor ( 736 ).

FEEDFORWARD FILTER USING TRANSLATIONAL FILTER

Described in embodiments herein are techniques for realizing filters having a variety of frequency responses, such as multiple pass-bands, high out-of-band rejection, without complicated designs. In accordance with an embodiment, a feedforward filter includes a first path, at least one second path and a signal combiner. The first path has a first translational filter, and employed for providing a first frequency response and generating a first output in response to an input signal based on the first frequency response. The at least one second path has a second translational filter and is coupled to the first path. The at least one second path is employed for providing a second frequency response that is different from the first frequency response to the input signal, and generating at least one second output in response to the input signal based on the second frequency response. The signal combiner is coupled to the first path and the second path, and employed for combining the first output and the at least one second output to generate a filtered signal. 1. A feedforward filter , comprising:a first path, having a first translational filter, for providing a first frequency response and generating a first output in response to an input signal based on the first frequency response;at least one second path, each having a second translational filter and coupled to the first path, for providing a second frequency response that is different from the first frequency response, and generating at least one second output in response to the input signal based on the second frequency response; anda signal combiner, coupled to the first path and the second path, for combining the first output and the at least one second output to generate a filtered signal.2. The feedforward filter of claim 1 , wherein the first translational filter comprises a plurality of filter branches that are respectively driven by a plurality of first oscillation signals and the second translational filter ...

Power amplifying apparatus and wireless signal transmitter utilizing the same

A power amplifying apparatus is provided. A reference signal generator provides a reference signal having an enabling state and a disabling state. A digital power amplifier generates a current based on the reference signal and an input signal. An output signal of the digital power amplifier is related to the current. When the reference signal is in the enabling state, the current is related to the input signal. When the reference signal is in the disabling state, the current is irrelevant to the input signal. During the enabling state of the reference signal, a data generator provides an output alternating between an in-phase signal and a quadrature-phase signal as the input signal to the digital power amplifier. When the reference signal is in the disabling state, the data generator provides a fixed signal as the input signal to the digital power amplifier.

METHOD AND DEVICE FOR SIGNAL PROCESSING

A method for signal processing is provided. The method includes: obtaining a predistortion signal for compensating nonlinear distortion generated by a transmission path; adding the predistortion signal to the transmission path to compensate the nonlinear distortion; and outputting the nonlinear distortion compensated signal by the transmission path. With the above method, the nonlinear distortion of the transmission path can be compensated without modifying a current transmission path, thereby enhancing transmission performance of a transmitter by using a simple structure. 1. A method for signal processing , comprising:obtaining a predistortion signal for compensating a nonlinear distortion generated by a transmission path;adding the predistortion signal to the transmission path to compensate the nonlinear distortion; andoutputting the nonlinear distortion compensated signal by the transmission path.2. The method according to claim 1 , wherein:the transmission path comprises a driving amplifier;the step of adding the predistortion signal to the transmission path to compensate the nonlinear distortion comprises adding the predistortion signal to an input end of the driving amplifier, and amplifying a frequency mixed signal added with the predistortion signal by the driving amplifier;the frequency mixed signal comprises a first frequency mixed signal and a second frequency mixed signal;the nonlinear distortion generated by a process that the driving amplifier performs on the first frequency mixed signal and the second frequency mixed signal is compensated by the predistortion signal to obtain an RF signal in which the nonlinear distortion of the driving amplifier is eliminated.4. The method according to claim 2 , wherein:the transmission path further comprises a baseband filter and a mixer;the step of adding the predistortion signal to the transmission path to compensate the nonlinear distortion comprises adding the predistortion signal to an input end of the baseband ...

CMOS IMAGE SENSORS AND MANUFACTURING METHODS THEREOF

Various embodiments of the present disclosure are directed towards an integrated circuit on a semiconductor substrate. First and second gate electrode structures are disposed over the substrate and are spaced laterally from one another. A common source/drain region is disposed in the semiconductor substrate between the first and second gate electrode structures. An insulator layer overlies the first and second gate electrode structures. A source/drain contact extends through the insulator layer between the first and second gate electrode structures to contact the common source/drain region. First and second sidewall spacer structures are disposed along outer sidewalls of the first and second gate electrode structures, respectively, and have first and second outer sidewalls, respectively, adjacent to the source/drain contact. The first outer sidewall includes at least two indentations facing a first side of the source/drain contact, and the second outer sidewall includes at least two indentations facing a second side of the source/drain contact.

Stacked bump structure and manufacturing method thereof

A method for manufacturing a stacked bump structure including the following steps is provided. First, a substrate having multiple bonding pads disposed on a surface thereof is provided. Next, a first bump and a second bump are respectively formed on any two adjacent bonding pads of the substrate. Then, a third bump is formed between the first bump and the second bump by wire bonding technology, so as to make the two adjacent bonding pads electrically connected to each other through the third bump.

TRANSMITTER CIRCUIT, COMMUNICATION UNIT AND METHOD FOR AMPLIFYING A COMPLEX QUADRATURE SIGNAL

A transmitter circuit includes a frequency generation circuit configured to generate a local oscillator signal and a digital modulator configured to: receive data to be transmitted; quadrature modulate the received data to at least a first, Q, modulated value and a second, I, modulated value; examine the quadrature modulated data to determine if the first, Q, modulated value exceeds a limit, and in response thereto selectively modify the quadrature modulated values to a first modified, Q′, modulated value and a second modified, I′, modulated value thereby bringing only a value of the first modified, Q′, modulated value to within the limit. A local oscillator phase is selected in order to map the first modified, Q′, modulated value and second modified, I′, modulated value to desired quadrature values. A digital power amplifier, DPA, coupled to the digital quadrature modulator, is configured to amplify the quadrature modified modulated data. 1. A transmitter circuit comprising:a frequency generation circuit configured to generate a local oscillator signal; and receive data to be transmitted;', 'quadrature modulate the received data to at least a first, Q, modulated value and a second, I, modulated value;', 'examine the quadrature modulated data to determine if the first, Q, modulated value exceeds a limit, and in response thereto', 'selectively modify the quadrature modulated values to a first modified, Q′, modulated value and a second modified, I′, modulated value thereby bringing only a value of the first modified, Q′, modulated value to within the limit;', 'select and apply a phase of the local oscillator signal to map the first modified, Q′, modulated value and second modified, I′, modulated value to desired quadrature values., 'a digital quadrature modulator coupled to the frequency generation circuit and configured to2. The transmitter circuit of wherein the digital quadrature modulator is configured to selectively modify the first claim 1 , Q′ claim 1 , ...

Frequency synthesizer with digitally-controlled oscillator

A transmitter (10) based on a frequency synthesizer includes an LC tank (12) of a digitally controlled oscillator (DCO) with various arrays of capacitors. The LC tank 12 is divided into two major groups that reflect two general operational modes: acquisition and tracking. The first group (process/voltage/temperature and acquisition) approximately sets the desired center frequency of oscillation initially, while the second group (integer and fractional tracking) precisely controls the oscillating frequency during the actual operation. For highly accurate outputs, dynamic element matching (DEM) is used in the integer tracking controller to reduce non-linearities caused by non-uniform capacitor values. Also, a preferred range of the integer tracking capacitor array may be used for modulation after the selected channel has been acquired. A digital sigma-delta modulator circuit (50) drives a capacitor array (14d) in response to the fractional bits of the error word. On mode switches, the accumulated ...

RADAR MODULE INCORPORATED WITH A PATTERN-SHAPING DEVICE

A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

SIGNAL PROCESSING SYSTEM WITH BIST FUNCTION, TESTING METHOD THEREOF AND TESTING SIGNAL GENERATOR

A signal processing system includes a module under test, an oscillation signal generator, a translational filter, and a testing module. The module under test has a signal input end. The oscillation signal generator generates an oscillation signal. The translational filter includes a mixer controlled by the oscillation signals. The mixer has a high-frequency side and a low-frequency side. The high-frequency side is coupled to the signal input end of the module under test. The testing module is coupled to the low-frequency side of the mixer. When the signal processing system is in a testing mode, the testing module provides a testing signal to the low-frequency side, so as to generate a high-frequency testing signal at the high-frequency side of the mixer. 1. A signal processing system , comprising:a module under test, having a signal input end;an oscillation signal generator, configured to generate an oscillation signal;a translational filter, comprising a baseband filtering circuit and a mixer that is controlled by the oscillation signal, the mixer having a high-frequency side and a low-frequency side, the high-frequency side being coupled to the signal input end of the module under test, the baseband filtering circuit being coupled to the low-frequency side; anda testing module, configured to provide a testing signal to the low-frequency side, so as to generate a high-frequency testing signal at the high-frequency side of the mixer.2. The signal processing system according to claim 1 , wherein an oscillation frequency of the oscillation signal is adjustable.3. The signal processing system according to claim 1 , wherein a frequency of the testing signal is adjustable.4. The signal processing system according to claim 1 , wherein the testing module provides the testing signal when the signal processing system is in a testing mode.5. The signal processing system according to claim 4 , wherein a connection between the baseband filtering circuit and the low-frequency ...

Apparatus and method for applying frequency calibration to local oscillator signal derived from reference clock output of active oscillator

A system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock, and includes an active oscillator that generates the reference clock. The active oscillator includes at least one active component. The RX circuit generates a processed RX signal by processing an RX input signal according to the LO signal. The calibration circuit checks a signal characteristic of the processed RX signal by detecting if a calibration tone exists within a receiver bandwidth, set a frequency calibration control output in response to the calibration tone being not found in the receiver bandwidth, and output the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

Multiband antenna

A multiband antenna includes a radiating portion and a ground portion. The radiating portion includes a first radiating section, a second radiating section and a coupling section. The coupling section is coupled between the first radiating section and the second radiating section. The ground portion includes a first ground section, a second ground section and a third ground section. The second ground section and the third ground section both coupled to a first side of the first ground section. The coupling section and the second radiating section are accommodated in a surrounded area defined inside the first ground section, the second ground section and the third ground section, and the first radiating section extend outside the surrounded area.

Semiconductor package

A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.

System and method for implementing low-cost electronic gyroscopes and accelerometer

Accelerometers have a number of wide-ranging uses, and it is desirable to both increase their accuracy while decreasing size. Here, millimeter or sub-millimeter wavelength accelerometers are provided which has the advantage of having the high accuracy of an optical accelerometer, while being compact. Additionally, because millimeter or sub-millimeter wavelength signals are employed, cumbersome and awkward on-chip optical devices and bulky optical mediums can be avoided.

Radar module incorporated with a pattern-shaping device

A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

Digital play system, LCD display module and display control method

The present invention provides a digital play system, comprising a signal conversion unit to receive a video signal and convert it into image data; and a LCD display module consisting of a timing controller to receive said image data and output row control signals and pixel data, a row driver to receive row control signals and output row driving signals, and a display panel to receive the row driving signals and pixel data, wherein the timing controller controls the row driver to output odd row driving signals and even row driving signals to display alternately odd-row array and even-row array of the display panel.

Semiconductor device package and method for manufacturing the same

A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

DIGITAL TRANSMITTER AND METHOD FOR CALIBRATING DIGITAL TRANSMITTER

A digital transmitter includes: a plurality of adjustable delay lines arranged to delay a plurality of digital input signals by a plurality of delay times to generate a plurality of delayed digital input signals respectively; a plurality of converting devices arranged to convert the plurality of delayed digital input signals into a plurality of converting signals respectively; and a calibration device arranged to adjust a delay time of at least one adjustable delay line in the plurality of adjustable delay lines to make the plurality of converting devices convert the plurality of delayed digital input signals at respective desire time points. 1. A digital transmitter , comprising:a plurality of adjustable delay lines, arranged to delay a plurality of digital input signals by a plurality of delay times to generate a plurality of delayed digital input signals respectively;a plurality of converting devices, arranged to convert the plurality of delayed digital input signals into a plurality of converting signals respectively; anda calibration device, arranged to adjust a delay time of at least one adjustable delay line in the plurality of adjustable delay lines.2. The digital transmitter of claim 1 , wherein the calibration device comprises:an edge detecting circuit, arranged to receive a first signal edge of a first delayed digital input signal outputted by a first adjustable delay line in the plurality of adjustable delay lines and a second signal edge of a second delayed digital input signal outputted by a second adjustable delay line in the plurality of adjustable delay lines, and to generate a detection signal; andan adjusting circuit, arranged to adjust at least one of a first delay time of the first adjustable delay line and a second delay time of the second adjustable delay line according to the detection signal.3. The digital transmitter of claim 2 , wherein the first adjustable delay line and the second adjustable delay line are two consecutive adjustable ...

Semiconductor device package and method for manufacturing the same

A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact.

SEMICONDUCTOR CHIP WITH LOCAL OSCILLATOR BUFFER REUSED FOR LOOP-BACK TEST AND ASSOCIATED LOOP-BACK TEST METHOD

A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.

RF differential signal squarer/limiter and balancer with high power supply rejection

The differential signal squarer/limiter and balancer circuit includes: a complementary differential pair MP5, MP6, MN2, and MN3; and a complementary positive feedback amp MP11, MP12, MN12, and MN13 coupled to the complementary differential pair.

Apparatus and method for applying frequency calibration to local oscillator signal derived from reference clock output of active oscillator that has no electromechanical resonator

A wireless system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock. The LO signal generation circuit includes an active oscillator. The active oscillator generates the reference clock, wherein the active oscillator includes at least one active component, and does not include an electromechanical resonator. The RX circuit generates a down-converted RX signal by performing down-conversion upon an RX input signal according to the LO signal. The calibration circuit generates a frequency calibration control output according to a signal characteristic of the down-converted RX signal, and outputs the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

Packaged Integrated Circuits Having Inductors and Methods to Form Inductors in Packaged Integrated Circuits

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits are disclosed. An example method comprises forming a substrate having a first trace and a contact, attaching an integrated circuit to the substrate over the first trace, and electrically coupling the first trace to the contact via an electrical conductor that extends over the integrated circuit to form the inductor in the packaged integrated circuit.

Method and apparatus for a programmable frequency divider

A dual-edge triggered variable frequency divider for use in digital frequency synthesis is disclosed. The variable frequency divider utilizes a multiphase clock and a logic unit, including both positive and negative edge triggered unit delay elements connected in parallel. The variable frequency divider generates a clock pulse from a signal source that corresponds to an input value from a logic unit, generates a next input value by the logic unit based on the input value and a frequency control word, and transmits the next input value from the logic unit to the signal source in response to the clock pulse. The multiphase clock is configured to generate the clock signal in response to the falling edge of the first pulse of the clock signal. Iteratively selecting signals by this process results in an observed output frequency of fout=N*fsrc/D, where fsrc is the input signal frequency, N is the number of phases of the multi-phase (N-phase) clock, and D is an integer between 1 and N configured ...

STACKED BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

A method for manufacturing a stacked bump structure including the following steps is provided. First, a substrate having multiple bonding pads disposed on a surface thereof is provided. Next, a first bump and a second bump are respectively formed on any two adjacent bonding pads of the substrate. Then, a third bump is formed between the first bump and the second bump by wire bonding technology, so as to make the two adjacent bonding pads electrically connected to each other through the third bump.

Multi-band low noise amplifier system

A low noise amplifier (LNA) operates over multiple frequency bands while occupying less silicon area than known LNA implementations. The LNA includes output matching that can be tuned by an adjustable inductor together with a tunable capacitor bank.

SPURIOUS TONE SUPPRESSOR AND METHOD OF OPERATION THEREOF

The present invention provides a spurious tone suppressor for use with a power supply system. In one embodiment, the spurious tone suppressor includes an error signal generator configured to provide a spur error signal proportional to a spur signal associated with the power supply system. Additionally, the spurious tone suppressor also includes an adaptive spur cancellation engine coupled to the error signal generator and configured to adaptively process the spur error signal and generate a corresponding anti-spur signal that is injected into the power supply system to suppress the spur signal.

Circuit to reduce internal ESD stress on device having multiple power supply domains

An ESD protection circuit is designed on an integrated circuit (100) having a first power supply bus (106) and a second power supply bus (108). The circuit includes a first logic gate (116, 118) having a current path coupled to the first power supply bus. The first logic gate includes an output terminal. A second logic gate (122, 124) has a current path coupled to the second power supply bus. The second logic gate has an input terminal coupled to the output terminal of the first logic gate. A first device (306) is coupled in series with the current path of the second logic gate and is always on during normal circuit operation.

Segmented power amplifier with varying segment activation

Various apparatuses and methods for varying segment activation in a segmented power amplifier are disclosed herein. For example, some embodiments provide a power amplifier including an input, an output, a plurality of amplifier segments and a controller. The amplifier segments are connected in parallel between the input and the output and are adapted to be activated and inactivated. The power level at the output may be controlled by changing a number of the amplifier segments that are activated concurrently. The controller is connected to the amplifier segments and is adapted to vary which of the amplifier segments are activated to arrive at a selected number of activated amplifier segments.

Oscillator System, Method Of Providing A Resonating Signal And A Communications System Employing The Same

An n th -order oscillator system for providing a resonating signal, a method of generating a resonating signal and a communications system. In one embodiment, the n th -order oscillator system, n being greater than two, includes (1) an amplifier configured to provide an intermediate signal and (2) a feedback loop including an n th -order complex LC tank and configured to generate the resonating signal by feeding back a complex-filtered form of the intermediate signal to the amplifier.

Digital frequency modulation aided AMPM predistortion digital transmitter

Amplitude-modulation (AM) to AM (AMAM) predistortion data is obtained from an AMAM predistorter. When applied to a digital quadrature signal, the AMAM predistortion data predistorts in-phase (I) and quadrature (Q) data words in a digital quadrature modulator. AM to phase-modulation (AMPM) predistortion data is obtained that is associated with the AMAM predistortion data and a frequency change or a phase shift in a local oscillator (LO) signal is compelled in accordance with the AMPM predistortion data. The frequency-changed or phase-shifted LO signal is provided to a digital upconverter such that an output signal of the digital upconverter is linearized with respect to at least phase distortion in the digital upconverter.

Frequency synthesizer with digitally-controlled oscillator

A transmitter ( 10 ) based on a frequency synthesizer includes an LC tank ( 12 ) of a digitally controlled oscillator (DCO) with various arrays of capacitors. The LC tank 12 is divided into two major groups that reflect two general operational modes: acquisition and tracking. The first group (process/voltage/temperature and acquisition) approximately sets the desired center frequency of oscillation initially, while the second group (integer and fractional tracking) precisely controls the oscillating frequency during the actual operation. For highly accurate outputs, dynamic element matching (DEM) is used in the integer tracking controller to reduce non-linearities caused by non-uniform capacitor values. Also, a preferred range of the integer tracking capacitor array may be used for modulation after the selected channel has been acquired. A digital sigma-delta modulator circuit ( 50 ) drives a capacitor array ( 14 d ) in response to the fractional bits of the error word. On mode switches, the accumulated error is recalculated to a phase restart value to prevent perturbations.

Multiplexed Configurable Sigma Delta Modulators for Noise Shaping in a 25-Percent Duty Cycle Digital Transmitter

A modulator generates a baseband digital signal from an information-bearing digital signal. The baseband signal has time-varying phase and amplitude defined by a sequence of complex data words, each having an in-phase (I) component and a quadrature (Q) component. A noise-shaping modulator generates a noise-shaped digital signal from the baseband digital signal such that quantization noise in the noise-shaping modulator is attenuated by a spectral null of its noise transfer function. The spectral null is selected by a noise-shaping parameter corresponding to a selected one of a plurality of output frequencies. A signal converter generates an analog signal conveying the information of the information-bearing digital signal on an analog carrier signal having the selected output frequency. 1. An apparatus comprising:a modulator to generate a baseband digital signal from an information-bearing digital signal, the baseband signal having a time-varying phase and an amplitude defined by a sequence of complex data words, each complex data word having an in-phase (I) data word and a quadrature (Q) data word;a noise-shaping modulator to generate a noise-shaped digital signal from the baseband digital signal such that quantization noise is attenuated by a spectral null of a noise transfer function characterizing the noise-shaping modulator, the spectral null being selected by a noise-shaping parameter corresponding to a selected one of a plurality of output frequencies; anda signal converter to generate an analog signal conveying the information of the information-bearing digital signal on an analog carrier signal having the selected output frequency.2. The apparatus of claim 1 , wherein the noise-shaping modulator comprises:a quantizer to generate a quantized digital word and a quantization error word for each I data word and for each Q data word of the baseband digital signal;a variable multiplier to multiply the quantization error word of the I data word and the Q data word ...

Method and apparatus for performing object detection by using detection threshold values derived from adding different offset values to reference threshold values

An object detection method includes: obtaining a first offset value and a second offset value, setting a first detection threshold value by adding the first offset value to a first reference threshold value, setting a second detection threshold value by adding the second offset value to a second reference threshold value, obtaining a detection input, and performing target detection upon the detection input according to at least the first detection threshold value and the second detection threshold value. The first offset value is different from the second offset value. The first reference threshold value is determined for detecting if at least one object with a first value of an object characteristic exists. The second reference threshold value is determined for detecting if at least one object with a second value of the object characteristic exists. The second value is different from the first value.

Radar Sensor Housing Design

Various examples pertaining to a sensor housing design for millimeter wave (mmWave) sensors are described. A sensor housing may include a radar sensor, a printed circuit board (PCB), a radome and a PCB holder. The radar sensor may be capable of emitting a radio wave. The PCB may have a first side and a second side opposite the first side with the radar sensor mounted on the first side thereof to form a PCB assembly (PCBA). The radome may include a cavity in which the PCBA is disposed. The PCB holder may be disposed along a circumference of an inner wall of the radome, and the PCB holder may be configured to hold the PCBA such that a distance between an inner surface of the radome and a side of the radar sensor facing the inner surface of the radome is proportional to half wavelength of the radio wave. 1. An apparatus , comprising:a radar sensor capable of emitting a radio wave;a printed circuit board (PCB) having a first side and a second side opposite the first side with the radar sensor mounted on the first side thereof to form a PCB assembly (PCBA);a radome with a cavity in which the PCBA is disposed; anda PCB holder along a circumference of an inner wall of the radome, the PCB holder configured to hold the PCBA such that a distance between an inner surface of the radome and a side of the radar sensor facing the inner surface of the radome is proportional to half wavelength of the radio wave.2. The apparatus of claim 1 , wherein the distance is equal to one wavelength of the radio wave.3. The apparatus of claim 1 , wherein the PCB holder and the radome are integral parts of a monolithic antenna cover.4. The apparatus of claim 1 , wherein the PCB is configured with one or more through holes through which one or more electrical conductors traverse from the second side of the PCB to electrically connect to the radar sensor.5. The apparatus of claim 1 , further comprising:a housing with a cavity such that the housing and the radome are mated together to form an ...

Systems and methods for reducing flicker noise in an oscillator

Various systems and methods for implementing dynamic logic are disclosed herein. For example, some embodiments of the present invention provide LC tank circuits having an inductance and a capacitance. In addition, the circuits include a flicker noise reducing switch that is operable to selectively incorporate the capacitance such that an output of the circuit operates at a frequency based on a combination of the inductance and the capacitance.

Methodology to guard ESD protection circuits against precharge effects

An ESD protection circuit (710) is guarded by a parallel first precharge elimination circuit (720) relative to an I/O pad (721) and a parallel second precharge elimination circuit (730) relative to a VDD pad (731). The precharge elimination circuits are synchronized with the ESD protection circuit to eliminate any precharge voltage to ground before an ESD pulse affects the I/O pad or VDD pad. A diode (722) is connected between I/O pad and VDD. Circuit (720) is between I/O pad and ground (740) and is powered by the same VDD. Circuit (720) includes a first resistor (723), a first nMOS transistor (724), and a first RC timer including a second resistor (725) and a first capacitor (726). Circuit (730) includes a third resistor (733), a second nMOS transistor (734), and a second RC timer including a fourth resistor (735) and a second capacitor (736).

METHODOLOGY TO GUARD ESD PROTECTION CIRCUITS AGAINST PRECHARGE EFFECTS

An ESD protection circuit (710) is guarded by a parallel first precharge elimination circuit (720) relative to an I/O pad (721) and a parallel second precharge elimination circuit (730) relative to a VDD pad (731). The precharge elimination circuits are synchronized with the ESD protection circuit to eliminate any precharge voltage to ground before an ESD pulse affects the I/O pad or VDD pad. A diode (722) is connected between I/O pad and VDD. Circuit (720) is between I/O pad and ground (740) and is powered by the same VDD. Circuit (720) includes a first resistor (723), a first nMOS transistor (724), and a first RC timer including a second resistor (725) and a first capacitor (726). Circuit (730) includes a third resistor (733), a second nMOS transistor (734), and a second RC timer including a fourth resistor (735) and a second capacitor (736).

Frequency synthesizer with digitally-controlled oscillator

A transmitter ( 10 ) based on a frequency synthesizer includes an LC tank ( 12 ) of a digitally controlled oscillator (DCO) with various arrays of capacitors. The LC tank 12 is divided into two major groups that reflect two general operational modes: acquisition and tracking. The first group (process/voltage/temperature and acquisition) approximately sets the desired center frequency of oscillation initially, while the second group (integer and fractional tracking) precisely controls the oscillating frequency during the actual operation. For highly accurate outputs, dynamic element matching (DEM) is used in the integer tracking controller to reduce non-linearities caused by non-uniform capacitor values. Also, a preferred range of the integer tracking capacitor array may be used for modulation after the selected channel has been acquired. A digital sigma-delta modulator circuit ( 50 ) drives a capacitor array ( 14 d ) in response to the fractional bits of the error word. On mode switches, the accumulated error is recalculated to a phase restart value to prevent perturbations.

System and Method for Impedance Mismatch Compensation in Digital Communications Systems

A system and method for digitally providing impedance mismatch compensation for a communications medium in a communications device. A method comprises producing a power amplifier (PA) output signal, providing the PA output signal to a digitally-controlled transmission line (DCTL), transforming a first load impedance to a second load impedance producing a DCTL output, and coupling the DCTL output to an antenna. The PA having the first load impedance and the transforming is controlled by a digital control word provided to the DCTL.

Efficient charge transfer using a switched capacitor resistor

The application of a non-zero voltage offset to rotating capacitors 1111 and 1112 permit the use of a single positive voltage supply. However, the precharging of the rotating capacitors 1111 and 1112 is power inefficient. A power efficient and low-noise precharging operation is realized through the sharing of the charge on a feedback capacitor 1075 and 1080 that is significantly larger than the rotating capacitors 1111. Once a precharging operation is complete, the charge on the feedback capacitor 1075 and 1080 is refreshed from its residual charge level (rather than zero charge level) to a desired charge level.

Light device with remote function

A light device with remote function includes a remote controller and a light stick. When the remote controller is switched on, the remote controller transmits a control message to the light stick, wherein one lighting mode datum is attached to the control message; the light stick lights according to one lighting mode which corresponds to one lighting mode datum. Therefore, when there are many users with light sticks in a large concert, the light sticks of the users are all controlled by only one remote controller; therefore, the lighting modes of the light sticks are the same as each other; in other words, a light effect in front of a stage would be performed uniformly.

Harmonic suppression device

A harmonic suppression device includes a multilayer printed circuit board (PCB). The multilayer PCB includes a first layer, a second layer, and a third layer. The third layer is connected to the ground. The first layer is configured with a power amplifier, an input microstrip, a voltage divider microstrip, and an output microstrip. The power amplifier is operable to amplify radio frequency (RF) signals input using the input microstrip and to output the amplified RF signals using the output microstrip. The second layer is configured with a first microstrip and a second microstrip. One end of each of the first and second microstrips is connected to an alternative one of the first layer and the third layer by vias, and the other ends of the first and second microstrips are unattached so as to suppress harmonics on the power amplifier.

Semiconductor package with layer structures, antenna layer and electronic component

A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

Circuit to reduce internal ESD stress on device having multiple power supply domains

An ESD protection circuit is designed on an integrated circuit (100) having a first power supply bus (106) and a second power supply bus (108). The circuit includes a first logic gate (116, 118) having a current path coupled to the first power supply bus. The first logic gate includes an output terminal. A second logic gate (122, 124) has a current path coupled to the second power supply bus. The second logic gate has an input terminal coupled to the output terminal of the first logic gate. A first device (306) is coupled in series with the current path of the second logic gate and is always on during normal circuit operation.

Electrostatic discharge protection device including precharge reduction

ESD protection circuitry for a signal power supply pad (801) comprising a discharge circuit (802) operable to discharge the ESD pulse to ground, and a precharge reduction circuit (810) in parallel with the discharge circuit. This precharge reduction circuit is operable to cancel any precharge voltage to ground before an ESD event, and also to discharge any trailing pulse to ground after an ESD event. The reduction circuit comprises a discharge resistor (811), preferably about 10 kΩ, connected to the discharge circuit, and a control MOS transistor (812) in series with the discharge resistor. The transistor source (812a) is connected to the resistor, the drain (812b) to ground, and the gate (812c) to core power (813) so that the transistor is shut off during IC operation and conducting when pre-charge or post-charge is present at an ESD pulse.

Method and device for signal processing

A method for signal processing is provided. The method includes: obtaining a predistortion signal for compensating nonlinear distortion generated by a transmission path; adding the predistortion signal to the transmission path to compensate the nonlinear distortion; and outputting the nonlinear distortion compensated signal by the transmission path. With the above method, the nonlinear distortion of the transmission path can be compensated without modifying a current transmission path, thereby enhancing transmission performance of a transmitter by using a simple structure.

Sensor system interconnect for automatic configuration

Various examples pertaining to a sensor system interconnect for automatic configuration of sensors of the sensor system are described. A sensor senses at least one parameter. The sensor also determines its respective position among a series of sensors. Based on a result of the determining, the sensor performing either a first procedure, responsive to the sensor being a first sensor in the series of sensors, or a second procedure, responsive to the sensor not being the first sensor in the series of sensors. The first procedure involves the sensor transmitting first data of the sensed at least one parameter via a second input/output (I/O) pin of the sensor. The second procedure involves the sensor receiving second data from a preceding sensor in the series of sensors via a first I/O pin of the sensor and transmitting the first data and the second data via the second I/O pin.

SEMICONDUCTOR CHIP WITH LOCAL OSCILLATOR BUFFER REUSED FOR SIGNAL TRANSMISSION AND ASSOCIATED TRANSMISSION METHOD

A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.

WIRELESS TEST SYSTEM FOR TESTING MICROELECTRONIC DEVICES INTEGRATED WITH ANTENNA

A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna. 1. A wireless test system , comprising:a load board having an upper surface and a lower surface, wherein the load board comprises a testing antenna disposed on the load board;a socket for receiving a device under test (DUT) having an antenna structure therein, disposed on the upper surface of the load board, wherein the antenna structure is corresponding to the testing antenna; anda handler for picking up and delivering the DUT to the socket, wherein the handler comprises a clamp for holding and pressing the DUT, and wherein the clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.2. The wireless test system according to claim 1 , wherein a radio-frequency (RF) instrumentation circuitry is disposed under the load board.3. The wireless test system according to claim 2 , wherein the load board is electrically connected to the RF instrumentation circuitry by a cable or a connector.4. The wireless test system according to claim 3 , wherein the testing antenna is electrically coupled to the RF instrumentation circuitry through the cable.5. The wireless test system according to claim 2 , wherein connection between the ...

SEMICONDUCTOR CHIP WITH LOCAL OSCILLATOR BUFFER REUSED FOR LOOP-BACK TEST AND ASSOCIATED LOOP-BACK TEST METHOD

A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.

LED PROJECTOR WITH ADJUSTABLE PROJECTING EFFECTS

The present invention relates to a projecting effect adjusting device containing at least a optical module that can change the LED projecting effects. The projecting effect adjusting device has the function of two-dimensional displacement and fixed-point locating using a displacing control module and a locating module. The said two-dimensional displacement allows at least the linear displacement of the projecting effect adjusting device between the first position and the second position. The fixed-point locating allows at least the projecting effect adjusting device to be located on the first position and the second position. The first position is set to keep a distance between the optical module and the LED matrix light source and the second position is set between the optical module and the light-emitting plane of the LED matrix light source. 1. A LED projector with adjustable projecting effects that includes:a projector that contains several LED set on a base plate in a matrix arrangement;a projecting effect adjusting device that contains a optical module;a displacing control module on which the projecting effect adjusting device is installed in front of the projecting side of the projector, the displacing control module also allows the projecting effect adjusting device to move within a two-dimensional zone; anda locating module set on the base of the projector that allows the projecting effect adjusting device to be fixed at a preset position in the displacement zone.2. The LED projector with adjustable projecting effect as in claim 1 , wherein the projecting effect adjusting device can move linearly claim 1 , forward and backward between the first position and the second position. Also the projecting effect adjusting device can be set at a location between the first position and the second position using the locating module.3. The LED projector with adjustable projecting effect as in claim 2 , wherein the first position is set to keep a distance between the ...

SYSTEM AND METHOD FOR IMPLEMENTING LOW-COST ELECTRONIC GYROSCOPES AND ACCELEROMETER

Accelerometers have a number of wide-ranging uses, and it is desirable to both increase their accuracy while decreasing size. Here, millimeter or sub-millimeter wavelength accelerometers are provided which has the advantage of having the high accuracy of an optical accelerometer, while being compact. Additionally, because millimeter or sub-millimeter wavelength signals are employed, cumbersome and awkward on-chip optical devices and bulky optical mediums can be avoided. 1. An apparatus comprising:a substrate;a first propagation path have a first shape formed on the substrate;a second propagation path having a second shape formed on the substrate, wherein the second shape is substantially the same as the first shape;an oscillator that is coupled to the first propagation path and the second propagation path and applies a first signal to the first propagation path and a second signal to the second propagation path, wherein the wavelength of the first signal is less than 10 mm, and wherein the wavelength of the first signal is greater than 100 μm, and wherein the wavelength of the second signal is approximately equal to the wavelength of the first signal;a PLL that is coupled to the first propagation path, the second propagation path, and the oscillator; anddetection circuitry that is coupled to each of the first and second PLLs, wherein detection circuitry measures the phase difference between the first and second signals to determine physical movement.2. The apparatus of claim 1 , wherein the oscillator further comprises:a first oscillator that is coupled to the first propagation path and applies the first signal to the first propagation path; anda second oscillator that is coupled to the second propagation path and that applies the second signal to the second propagation path.3. The apparatus of claim 2 , wherein the PLL further comprises:a first PLL that is coupled to the first propagation path and the first oscillator; anda second PLL that is coupled to the second ...

LOW-NOISE AMPLIFIERS FOR RF RECEIVER

Disclosed are low-noise amplifiers and SAW-less receivers. An exemplary amplifier includes at least two amplifier modules. The amplifier modules share a common output node and comprise a common input to which the amplifier modules are AC or DC coupled for receiving an inbound RF signal. The amplifier modules operate at different biases. 1. A low noise amplifier , comprising:a plurality of amplifier modules, coupled to share a common output node and comprising a common input to which the amplifier modules are alternative-current (AC) or direct-current (DC) coupled for receiving an inbound RF signal;wherein the amplifier modules operate at different biases.2. The amplifier of claim 1 , wherein the amplifier modules comprise a class A amplifier in combination with a class B or class AB amplifier.3. The amplifier of claim 1 , further comprising a capacitor that couples one of the amplifier modules to the common input claim 1 , such that the amplifier module that couples to the capacitor is capable to receive the inbound RF signal when voltage of the inbound RF signal is within a predetermined range.4. The amplifier of claim 1 , wherein the plurality of amplifier modules are transconductance amplifiers.5. The amplifier of claim 1 , wherein the plurality of amplifier modules have differential circuit structure.6. The amplifier of claim 1 , wherein the plurality of amplifier modules are common-source amplifiers.7. A low noise amplifier claim 1 , comprising:a plurality of amplifier modules, comprising a common input to receive an inbound RF signal, and outputting a current to a common output node;wherein the amplifier modules are AC or DC coupled to the common input, and one of the amplifier modules allows a wider voltage range of the inbound RF signal than another amplifier module AC coupled to the common input node.8. The amplifier of claim 7 , wherein the amplifier modules comprise a Class A amplifier in combination with a Class B or Class AB amplifier.9. The amplifier ...

Local oscillation generator, associated communication system and method for local oscillation generation

A local oscillation generator includes a multi-phase circuit and a multiplexer. The multi-phase oscillator provides a plurality of multi-phase oscillation signals of a same frequency and different phases. The multiplexer conducts one of the multi-phase oscillation signals to an output end in different time slots to provide an output oscillation signal. The frequency of the multi-phase oscillation signals is the same as a fundamental frequency, and the frequency of the output oscillation signal is different from the fundamental frequency. Thus, the local oscillation generator provides a local oscillation signal according to the output oscillation signal such that the fundamental frequency is different from the frequency of the local oscillation signal.

THREE POLARIZATION MIMO ANTENNA SYSTEM

An antenna system is set in a substrate. The substrate includes a first floor, a second floor, a third floor, a fourth floor, and a ground plane. The antenna system further includes at least one radiation part, including a first radiation part, a second radiation part, and a third radiation part. The antenna system further includes at least one signal feed part set in the fourth floor, configured to feed electromagnetic wave signal. The feed part comprises a first feed part, a second feed part, and a third feed part. The antenna system employs simple hierarchical structure, is low cost, and occupies a little space. The antenna system also has advantages of high gain, low loss, and high stability in 2.412 GHz˜2.472 GHz frequency band. 1. An antenna system , set in a substrate , the substrate comprising a first floor , a second floor , a third floor , a fourth floor , and a ground plane , the antenna system comprising: a first radiation part defining a square shape, and set in a first floor surface closed to the second floor', 'a second radiation part defining a square shape, set in a third floor surface closed to the second floor;', 'a third radiation part defining a annular shape, set in a second floor surface close to the first floor; and, 'at least one radiation part, configured to radiate a electromagnetic wave signal, comprising 'a first feed part, a second feed part, and a third feed part.', 'at least one feed part, set in the fourth floor, configured to feed the electromagnetic wave signal, and the at least one feed part comprising2. The antenna system of claim 1 , wherein the first floor claim 1 , the second floor claim 1 , the third floor and the fourth floor are set in successively and in parallel claim 1 , and the antenna system further comprises:a first interval, set between the first floor and the second floor;a second interval, set between the second floor and the third floor;the ground plane, set between the third floor and the fourth floor.3. The ...

SEMICONDUCTOR SENSOR AND METHODS THEREOF

A method and structure providing an optical sensor having an optimized Ge—Si interface includes providing a substrate having a pixel region and a logic region. In some embodiments, the method further includes forming a trench within the pixel region. In various examples, and after forming the trench, the method further includes forming a doped semiconductor layer along sidewalls and along a bottom surface of the trench. In some embodiments, the method further includes forming a germanium layer within the trench and over the doped semiconductor layer. In some examples, and after forming the germanium layer, the method further includes forming an optical sensor within the germanium layer. 1. A method of fabricating a semiconductor device , comprising:providing a substrate including a pixel region and a logic region;forming a trench within the pixel region;after forming the trench, forming a doped semiconductor layer along sidewalls and along a bottom surface of the trench;forming a germanium layer within the trench and over the doped semiconductor layer; andafter forming the germanium layer, forming an optical sensor within the germanium layer.2. The method of claim 1 , wherein the forming the doped semiconductor layer includes performing an ion implantation process into the sidewalls and the bottom surface of the trench.3. The method of claim 2 , further comprising prior to performing the ion implantation process claim 2 , forming an oxide layer over the sidewalls and the bottom surface of the trench.4. The method of claim 3 , further comprising prior to forming the germanium layer claim 3 , removing the oxide layer.5. The method of claim 2 , wherein the ion implantation process forms a doped silicon (Si) layer along the sidewalls and the bottom surface of the trench.6. The method of claim 1 , wherein the forming the doped semiconductor layer includes epitaxially growing a doped Si layer along the sidewalls and the bottom surface of the trench.7. The method of claim ...

Semiconductor package

A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.

ANTENNA AND ELECTRONIC DEVICE WITH ANTENNA

An antenna includes a dielectric substrate, two pairs of antenna elements engaged on opposite sides of the dielectric substrate, two feed portions and a first connection element. Each antenna elements includes a first antenna electrode and a second antenna electrode connected to the first antenna electrode. A portion of the first antenna electrode is engaged on an upper surface of the dielectric substrate. A portion of the second antenna electrode is engaged on a lower surface of the dielectric substrate. Each of the two feed portions is connected between the ground and a conducive pad formed on the dielectric substrate. The first connection element is connected between the two antenna electrodes. A length of the first connection element is one-fourth wavelength of the first antenna electrode. 1. An antenna comprising:a dielectric substrate having a conductive pad formed thereon;two pairs of antenna elements engaged on opposite sides of the dielectric substrate; wherein each pair of the antenna elements comprises a first antenna electrode and a second antenna electrode connected to the first antenna electrode, a portion of the first antenna electrode is engaged on an upper surface of the dielectric substrate, and a portion of the second antenna electrode is engaged on a lower surface of the dielectric substrate;two feed portions, wherein each of the two feed portions is connected between the ground and the conducive pad of the dielectric substrate; anda first connection element connected between the two first antenna electrodes, wherein a length of the first connection element is equal to one-fourth wavelength of the first antenna electrode.2. The antenna as described in claim 1 , further comprising:a second connection element connected between the two second antenna electrodes, wherein a length of the second connection element is equal to one-fourth wavelength of the second antenna electrode.3. The antenna as described in claim 1 , wherein the first antenna ...

Over the air wireless test system for testing microelectronic devices integrated with antenna

An over-the-air (OTA) wireless test system includes a container, a machine plate disposed on the container, a supporter disposed on the machine plate, a load board disposed on the supporter, a socket disposed on the load board, a device under test (DUT) installed in the socket, and a wave-guiding feature in the socket and the load board configured to pass and guide electromagnetic waves to and/or from an antenna structure of the DUT. The wave-guiding feature comprises a wave-guiding channel in the socket defined by a plurality of pogo pins surrounding the antenna structure of the DUT. The wave-guiding feature may further comprise a radiation passage in the load board defined by rows of via fence extending through an entire thickness of the load board.

Multiband antenna

A multiband antenna includes a radiating portion and a ground portion. The radiating portion includes a first radiating section, a second radiating section and a coupling section. The coupling section is coupled between the first radiating section and the second radiating section. The ground portion includes a first ground section, a second ground section and a third ground section. The second ground section and the third ground section both coupled to a first side of the first ground section. The coupling section and the second radiating section are accommodated in a surrounded area defined inside the first ground section, the second ground section and the third ground section, and the first radiating section extend outside the surrounded area.

Method And Apparatus For Automotive Parking Assistance Using Radar Sensors

Methods and apparatuses pertaining to automotive parking assistance using radar sensors are described. A processor controls a plurality of radar sensors to transmit radio frequency (RF) signals and receive reflected signals reflected by an object such that each of the radar sensors individually transmits a respective RF signal and receive a respective reflected signal reflected by the object. The processor or the radar sensor detects one or more aspects of the object based on the respective reflected signals received by the plurality of radar sensors. 1. A method , comprising:controlling, by a processor, a plurality of radar sensors to transmit radio frequency (RF) signals and receive reflected signals reflected by an object such that each of the radar sensors individually transmits a respective RF signal and receive a respective reflected signal reflected by the object; anddetecting, by the processor or the radar sensors, one or more aspects of the object based on the respective reflected signals received by the plurality of radar sensors.2. The method of claim 1 , wherein the controlling of the plurality of radar sensors to transmit the RF signals and receive the reflected signals comprises controlling the plurality of radar sensors to sequentially transmit the RF signals one radar sensor at a time.3. The method of claim 1 , wherein the detecting of the one or more aspects of the object comprises determining at least one of the one or more aspects of the object by triangulation using more than one of the reflected signals received by more than one of the radar sensors.4. The method of claim 1 , wherein the detecting of the one or more aspects of the object comprises simultaneously detecting the one or more aspects of each of a plurality of objects.5. The method of claim 1 , wherein the detecting of the one or more aspects of the object comprises detecting the one or more aspects of the objects based on reflection strengths of the reflected signals claim 1 , ...

FAN-OUT BALL GRID ARRAY PACKAGE STRUCTURE AND PROCESS FOR MANUFACTURING THE SAME

A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant. 1. A surface mount structure , comprising:a redistribution structure having a first surface and a second surface opposite the first surface;an electrical connection on the first surface of the redistribution structure; andan encapsulant encapsulating the first surface of the redistribution structure and the electrical connection;wherein a portion of the electrical connection is exposed by the encapsulant.2. The surface mount structure of claim 1 , wherein the electrical connection comprises a core.3. The surface mount structure of claim 2 , wherein the core comprises a metal core and a barrier layer surrounding the metal core.4. The surface mount structure of claim 3 , wherein the electrical connection further comprises a solder layer surrounding the barrier layer.5. The surface mount structure of claim 2 , wherein the core comprises an elastic core and a metal layer surrounding the elastic core.6. The surface mount structure of claim 5 , wherein the core further comprises a barrier layer surrounding the metal layer.7. The surface mount structure of claim 6 , wherein the electrical connection further comprises a solder layer surrounding the barrier layer.8. The surface mount structure of claim 5 , wherein the elastic core has a modulus of elasticity ranged from approximately 1 gigapascal (GPa) to approximately 50 GPa.9. The surface mount structure of claim 5 , wherein the elastic core has a modulus of elasticity ranged from approximately 3 GPa to approximately 6 GPa.10. The surface mount structure of ...

SEMICONDUCTOR PACKAGE DEVICE

An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module. 1. An electronic device , comprising: a substrate defining an opening penetrating the substrate; and', 'a piezoelectric element disposed on the substrate and across the opening of the substrate;, 'a piezoelectric module comprisinga sensing module disposed over the piezoelectric module; anda buffer element disposed between the piezoelectric module and the sensing module.2. The electronic device of claim 1 , wherein the buffer element comprises a conductive adhesive claim 1 , a polymer core and a metal layer covering the polymer core claim 1 , or an anisotropic conductive film (ACF).3. The electronic device of claim 1 , wherein the substrate comprises a plane portion and a dam structure claim 1 , the dam structure disposed between the buffer element and the plane portion claim 1 , wherein the sensing module claim 1 , the dam structure and the buffer element define a space to accommodate the piezoelectric element.4. The electronic device of claim 3 , wherein a Young's modulus of the dam structure is greater than a Young's modulus of the buffer element.5. The electronic device of claim 3 , wherein the dam structure and the plane portion are integrally formed.6. The electronic device of claim 3 , wherein the dam structure comprises a printed circuit board.7. The electronic device of claim 1 , further comprising a conductive material disposed between the sensing module and the piezoelectric module to electrically connect the sensing module with the piezoelectric element.8. The electronic device of claim 1 , ...

Light Device with Remote Function

A light device with remote function includes a remote controller and a light stick. When the remote controller is switched on, the remote controller transmits a control message to the light stick, wherein one lighting mode datum is attached to the control message; the light stick lights according to one lighting mode which corresponds to one lighting mode datum. Therefore, when there are many users with light sticks in a large concert, the light sticks of the users are all controlled by only one remote controller; therefore, the lighting modes of the light sticks are the same as each other; in other words, a light effect in front of a stage would be performed uniformly. 1. A light device with remote function comprising:a remote controller having a transmitting device, a first processor and a switch unit, the first processor having a store memory, a plurality of lighting mode data stored in the store memory, each lighting mode datum corresponding to each corresponding lighting mode of the light stick, the transmitting device transmitting a control message, wherein when the remote controller is switched on via the switch unit, the transmitting device transmits the control message to the light stick, wherein one lighting mode datum is attached to the control message; the light stick lights according to one lighting mode which corresponds to one lighting mode datum; anda light stick having a stick body, the stick body having at least one light unit assembled therein, a color of the light unit being changeable, the stick body further having a control circuit assembled therein, the stick body having a positioning board assembled therein, the light unit positioned on the positioning board, the control circuit having a second processor, a driving module, a receiving module, a quartz oscillator, a mode button and a switch member, the receiving module having an aerial which is positioned on the positioning board, the aerial configured to receive the control message from the ...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact. 1. A semiconductor device , comprising:a substrate having a first surface and a second surface opposite to the first surface;an electronic component disposed on the first surface of the substrate;a sensor disposed adjacent to the second surface of the substrate;an electrical contact disposed on the first surface of the substrate; anda package body exposing a portion of the electrical contact.2. The semiconductor device of claim 1 , wherein the package body comprises a transparent material and covers a surface of the sensor.3. The semiconductor device of claim 1 , wherein a sensing area of the sensor is disposed adjacent to the second surface of the substrate.4. The semiconductor device of claim 1 , wherein the sensor is a light-sensing sensor.5. The semiconductor device of claim 1 , further comprising:a passive electrical component disposed on the first surface of the substrate.6. The semiconductor device of claim 1 , wherein the package body defines a cavity to expose the portion of the electrical contact claim 1 , and a sidewall of the cavity of the package body is spaced apart from a portion of the electrical contact.7. The semiconductor device of claim 1 , wherein a portion of the electrical contact protrudes from a surface of the package body facing away from the first surface of the substrate.8. A semiconductor device claim 1 , comprising:a substrate having a first surface, a second surface opposite to the first surface and a third surface extending between the first surface and the second surface;an electronic component disposed on the first surface of the substrate;a ...

RADAR MODULE INCORPORATED WITH A PATTERN-SHAPING DEVICE

A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals. 1. A radar module , comprising:a printed circuit board (PCB) having a first surface and a second surface opposite to the first surface;a semiconductor package mounted on the first surface of the PCB, wherein the semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB, wherein the substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals; anda pattern-shaping device mounted on the first surface of the PCB configured to shape a radiation pattern of said radar signals.2. The radar module according to claim 1 , wherein the semiconductor package further comprises a molding compound encapsulating the integrated circuit die.3. The radar module according to claim 2 , wherein the pattern-shaping device is a discrete device directly mounted on the first surface of the PCB and a top surface of the molding compound of the semiconductor package.4. The radar module according to claim 1 , wherein the pattern-shaping device is a monolithic piece that is made of a homogeneous material.5. The radar module according to claim 1 , wherein the pattern-shaping device is made of metal claim 1 , plastic or mmW absorber material.6. The radar module according to claim 1 , wherein the substrate further comprises ...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact. 1. A semiconductor device , comprising:a substrate having a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface;an electronic component disposed on the first surface of the substrate;a first package body covering the electronic component and the first surface of the substrate; anda second package body covering a lateral surface of the first package body and the lateral surface of the substrate.2. The semiconductor device of claim 1 , wherein the lateral surface of the first package body and the lateral surface of the substrate are substantially coplanar.3. The semiconductor device of claim 1 , wherein the second package body covers the second surface of the substrate.4. The semiconductor device of claim 3 , further comprising:a sensor disposed adjacent to the second surface of the substrate.5. The semiconductor device of claim 1 , further comprising:an electrical contact electrically connected to the substrate and exposed from the first package body.6. The semiconductor device of claim 1 , further comprising:an electronic element disposed proximal to the second surface of the substrate.7. The semiconductor device of claim 6 , wherein the electronic element comprises a sensor.8. The semiconductor device of claim 7 , wherein the sensor is configured for sensing through the second package body.9. The semiconductor device of claim 7 , wherein the second package body covers the sensor.10. The semiconductor device of claim 9 , further comprising:an electrical contact electrically connected to ...

WIRELESS SYSTEM HAVING LOCAL OSCILLATOR SIGNAL DERIVED FROM REFERENCE CLOCK OUTPUT OF ACTIVE OSCILLATOR THAT HAS NO ELECTROMECHANICAL RESONATOR

A wireless system includes an active oscillator and a front-end circuit. The active oscillator is used to generate and output a reference clock. The active oscillator includes at least one active component, and does not include an electromechanical resonator. The front-end circuit is used to process a transmit (TX) signal or a receive (RX) signal according to a local oscillator (LO) signal. The LO signal is derived from the reference clock. 1. A wireless system comprising:an active oscillator, arranged to generate and output a reference clock, wherein the active oscillator comprises at least one active component, and does not include an electromechanical resonator; anda front-end circuit, arranged to process a transmit (TX) signal or a receive (RX) signal according to a local oscillator (LO) signal, wherein the LO signal is derived from the reference clock.2. The wireless system of claim 1 , wherein the wireless system is a Radio Detection and Ranging (radar) system.3. The wireless system of claim 1 , wherein the LO signal has an LO frequency at a 3.1-10.6 GHz band claim 1 , 24 GHz claim 1 , 60 GHz claim 1 , a 76-77 GHz band claim 1 , or a 77-81 GHz band.4. The wireless system of claim 1 , wherein the wireless system is implemented on a chip claim 1 , and the active oscillator is an on-chip oscillator.5. The wireless system of claim 1 , wherein the reference clock with an LO frequency is supplied to the front-end circuit claim 1 , and the reference clock received by the front-end circuit acts as the LO signal directly.6. The wireless system of claim 1 , further comprising:a frequency processing circuit, arranged to receive the reference clock with a reference frequency different from an LO frequency, generate the LO signal with the LO frequency according to the reference clock, and output the LO signal to the front-end circuit.7. The wireless system of claim 1 , further comprising:a digital circuit, arranged to perform at least one data processing function according ...

Method and apparatus for a programmable frequency divider

A dual-edge triggered variable frequency divider for use in digital frequency synthesis is disclosed. The variable frequency divider utilizes a multiphase clock and a logic unit, including both positive and negative edge triggered unit delay elements connected in parallel. The variable frequency divider generates a clock pulse from a signal source that corresponds to an input value from a logic unit, generates a next input value by the logic unit based on the input value and a frequency control word, and transmits the next input value from the logic unit to the signal source in response to the clock pulse. The multiphase clock is configured to generate the clock signal in response to the falling edge of the first pulse of the clock signal. Iteratively selecting signals by this process results in an observed output frequency of f out =N*f src /D, where f src is the input signal frequency, N is the number of phases of the multi-phase (N-phase) clock, and D is an integer between 1 and N configured by the frequency control word.

Conical antenna

A conical antenna includes a chassis, a main radiator and a ring resonator. A central of the chassis defines a via for feeding electromagnetic signals. The main radiator includes a first radiating portion with a conical shape, a second radiating portion with a cylindrical shape and a third radiating portion with a frustum cone shape, for transmitting and receiving electromagnetic signals. The ring resonator is disposed on the chassis. A sidewall of the first radiating portion connects with a sidewall of the via in the chassis through the ring resonator. The main radiator and the ring resonator collectively resonate to generate a resonance frequency useful in mobile communications devices.

Sensor System Interconnect For Automatic Configuration

Various examples pertaining to a sensor system interconnect for automatic configuration of sensors of the sensor system are described. A sensor senses at least one parameter. The sensor also determines its respective position among a series of sensors. Based on a result of the determining, the sensor performing either a first procedure, responsive to the sensor being a first sensor in the series of sensors, or a second procedure, responsive to the sensor not being the first sensor in the series of sensors. The first procedure involves the sensor transmitting first data of the sensed at least one parameter via a second input/output (I/O) pin of the sensor. The second procedure involves the sensor receiving second data from a preceding sensor in the series of sensors via a first I/O pin of the sensor and transmitting the first data and the second data via the second I/O pin.

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact. 1. A surface mount structure , comprising:a substrate having a first surface and a second surface opposite to the first surface;a sensor disposed adjacent to the second surface of the substrate;an electrical contact disposed on the first surface of the substrate; anda package body covering the first surface and the second surface of the substrate, a portion of the sensor, and a first portion of the electrical contact.2. The surface mount structure of claim 1 , whereinthe sensor is disposed within the substrate; anda surface of the sensor is exposed from the second surface of the substrate and covered by the package body.3. The surface mount structure of claim 1 , whereinthe package body covering the first surface of the substrate has a first surface surrounding the electrical contact and a second surface separated from the electrical contact by the first surface; andthe first surface of the package body and the second surface of the package body are not coplanar.4. The surface mount structure of claim 3 , wherein the first surface of the package body is closer to the substrate than is the second surface of the package body.5. The surface mount structure of claim 3 , wherein the electrical contact comprises a second portion protruding from the first surface or the second surface of the package body.6. The surface mount structure of claim 3 , wherein a recess is defined by the first surface of the package body claim 3 , and is located between the electrical contact and the second surface of ...

Semiconductor package

A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

SEMICONDUCTOR PACKAGE WITH LAYER STRUCTURES, ANTENNA LAYER AND ELECTRONIC COMPONENT

A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure. 1. A semiconductor package , comprising:a first substrate;a first layer structure;a second layer structure; anda first antenna layer formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure;wherein the first layer structure is formed between the first substrate and the second layer structure, and wherein the first layer structure comprises a second substrate and a first package body, the second substrate has a receiving portion, and the first package body fills up the receiving portion.2. The semiconductor package as claimed in claim 1 , further comprising:a second antenna layer formed on at least one of the first layer structure and the second layer structure.3. The semiconductor package as claimed in claim 2 , wherein the second layer structure has a layer lower surface claim 2 , and wherein the second antenna layer has an antenna lower surface substantially flush with the layer lower surface.4. The semiconductor package as claimed in claim 1 , wherein the first package body has a layer upper surface claim 1 , and wherein the second layer structure comprises a second package body having a layer lower surface directly contacting the layer upper surface.5. The semiconductor ...

Three polarization MIMO antenna system

An antenna system is set in a substrate. The substrate includes a first floor, a second floor, a third floor, a fourth floor, and a ground plane. The antenna system further includes at least one radiation part, including a first radiation part, a second radiation part, and a third radiation part. The antenna system further includes at least one signal feed part set in the fourth floor, configured to feed electromagnetic wave signal. The feed part comprises a first feed part, a second feed part, and a third feed part. The antenna system 10 employs simple hierarchical structure, is low cost, and occupies a little space. The antenna system also has advantages of high gain, low loss, and high stability in 2.412 GHz˜2.472 GHz frequency band.

Efficient charge transfer using a switched capacitor resistor

The application of a non-zero voltage offset to rotating capacitors 1111 and 1112 permit the use of a single positive voltage supply. However, the precharging of the rotating capacitors 1111 and 1112 is power inefficient. A power efficient and low-noise precharging operation is realized through the sharing of the charge on a feedback capacitor 1075 and 1080 that is significantly larger than the rotating capacitors 1111. Once a precharging operation is complete, the charge on the feedback capacitor 1075 and 1080 is refreshed from its residual charge level (rather than zero charge level) to a desired charge level.

Method and apparatus for automotive parking assistance using radar sensors

Methods and apparatuses pertaining to automotive parking assistance using radar sensors are described. A processor controls a plurality of radar sensors to transmit radio frequency (RF) signals and receive reflected signals reflected by an object such that each of the radar sensors individually transmits a respective RF signal and receive a respective reflected signal reflected by the object. The processor or the radar sensor detects one or more aspects of the object based on the respective reflected signals received by the plurality of radar sensors.

Local oscillation generator and associated communication system and method for local oscillation generation

Low-noise amplifiers for rf receiver

Fan-out ball grid array package structure and process for manufacturing the same

A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.

Digital transmitter and signal processing method thereof

Semiconductor package

A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.

Digital transmitter and signal predistortion method thereof

利用一振幅調變至振幅調變(AMAM)前置補償裝置產生一AMAM前置補償資料。該AMAM前置補償資料被用以補償一數位正交調變器中之同相及正交資料字語。經過AMAM前置補償後的資料字語被用以產生相對應之一振幅調變至相位調變(AMPM)前置補償資料。根據該AMPM前置補償資料，一本地振盪信號之頻率被改變或相位被偏移。該頻率改變後或相位偏移後本地振盪信號被提供至一數位升頻轉換器，以使該數位升頻轉換器之一輸出信號被線性化，消除該數位升頻轉換器造成之相位失真。

Radar interference mitigation method and apparatus

Wireless system having local oscillator signal derived from reference clock output of active oscillator that has no electromechanical resonator

A wireless system includes an active oscillator and a front-end circuit. The active oscillator is used to generate and output a reference clock. The active oscillator includes at least one active component, and does not include an electromechanical resonator. The front-end circuit is used to process a transmit (TX) signal or a receive (RX) signal according to a local oscillator (LO) signal. The LO signal is derived from the reference clock.

Radar interference mitigation method and apparatus

Methods and apparatuses pertaining to radar interference mitigation are described. A processor associated with an apparatus may generate a plurality of wave frames such that one or more aspects of the plurality of wave frames vary from one wave frame to another wave frame of the plurality of wave frames. Each of the plurality of wave frames may respectively include a plurality of chirps. A wireless transmitter associated with the apparatus may transmit the plurality of wave frames. A wireless receiver associated with the apparatus may receive one or more reflected waves comprising at least a portion of one or more of the wave frames reflected by an object. The processor may determine a distance between the object and the apparatus, a speed of the objet, or both, based on an analysis of the one or more reflected waves.

Radar interference mitigation method and apparatus

Methods and apparatuses pertaining to radar interference mitigation are described. A processor associated with an apparatus may generate a plurality of wave frames such that one or more aspects of the plurality of wave frames vary from one wave frame to another wave frame of the plurality of wave frames. Each of the plurality of wave frames may respectively include a plurality of chirps. A wireless transmitter associated with the apparatus may transmit the plurality of wave frames. A wireless receiver associated with the apparatus may receive one or more reflected waves comprising at least a portion of one or more of the wave frames reflected by an object. The processor may determine a distance between the object and the apparatus, a speed of the objet, or both, based on an analysis of the one or more reflected waves.

Sensor system interconnect for automatic configuration

Method and electronic device for motion prediction

A method for motion prediction includes receiving spatial information output by a radio-wave sensor, wherein the spatial information includes position and velocity of at least one point; receiving an image captured by a camera; tracking at least one object based on the spatial information and the image to obtain a consolidated tracking result; predicting a motion trajectory of the at least one object based on the consolidated tracking result to obtain a prediction result; and controlling the camera according to the prediction result.

Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method

A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.

Reconfigurable RF front end and antenna arrays for radar mode switching

Concepts and examples pertaining to reconfigurable radio frequency (RF) front end and antenna arrays for radar mode switching are described. A processor associated with a radar system selects a mode of a plurality of modes in which to operate the radar system. The processor then controls the radar system to operate in the selected mode by utilizing a plurality of antennas in a respective configuration of a plurality of configurations of the antennas which corresponds to the selected mode. Each configuration of the plurality of configurations of the antennas results in respective antenna characteristics. Each configuration of the plurality of configurations of the antennas utilizes a respective number of antennas of the plurality of antennas.

Radar module incorporated with a pattern-shaping device

A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

Semiconductor device package and method for manufacturing the same

A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

Ｃｍｏｓイメージセンサおよびその製造方法

【課題】高い画素密度を実現する集積回路を提供する。【解決手段】ＣＭＯＳイメージセンサでは、第１、第２ゲート電極構造１０４ａ、１０４ｂが、半導体基板１０２の上に配置され、且つ、互いに横方向に間隔を空け、共通ソース／ドレイン領域５０２が、第１、第２ゲート電極構造間の半導体基板内に配置される。絶縁層８０２は、第１、第２ゲート電極構造を覆い、ソース／ドレインコンタクト９０４は、第１、第２ゲート電極構造の間の絶縁層を介して延伸し、共通ソース／ドレイン領域に接触する。ソース／ドレインコンタクトが第１幅ｗ１を有する場合、第１、第２側壁スペーサ構造は、それぞれ２つの凹み７０２ｂ、７０２ｃを有する。しかしながら、ソース／ドレインコンタクトが第２幅ｗ２を有する場合、第１、第２側壁スペーサ構造は、それぞれ３つの凹み７０２ａ、７０２ｂ、７０２ｃを有する。【選択図】図９

Multi-band low noise amplifier system

A low noise amplifier (LNA) (400) operates over multiple frequency bands while occupying less silicon area than known LNA implementations. The LNA includes output matching that can be tuned by an adjustable inductor together with a tunable capacitor bank. Output matching is accomplished by an adjustable inductor (402) together with a tunable capacitor bank (404).

Multi-band low noise amplifier system

A low noise amplifier (LNA) (400) operates over multiple frequency bands while occupying less silicon area than known LNA implementations. The LNA includes output matching that can be tuned by an adjustable inductor together with a tunable capacitor bank. Output matching is accomplished by an adjustable inductor (402) together with a tunable capacitor bank (404).

可變除頻器以及可變除頻方法

本發明提供一雙緣觸發可變除頻器，其中包含一邏輯單元與一信號源。該邏輯單元包含並聯之升緣觸發單位延遲元件及降緣觸發單位延遲元件。回應於該邏輯單元提供之一輸入值，該信號源產生一脈衝。該邏輯單元根據該輸入值及一頻率控制字產生一後續輸入值。回應於該脈衝，該邏輯單元將該後續輸入值傳遞至該信號源。回應於一時脈信號中的第一個脈衝之降緣，該時脈信號根據一多相位時脈信號被產生。藉由迭代選擇信號，此程序產生之輸出頻率為fout=N*fsrc/D，其中fsrc為輸入頻率，N為該多相位時脈信號的相位數量，D為以該頻率控制字表示之整數。

Halbleitersensor und verfahren dafür

Ein Verfahren und eine Struktur, die einen optischen Sensor mit einer optimierten Ge-Si-Grenzfläche bereitstellen, umfassen Bereitstellen eines Substrats mit einem Pixelbereich und einem Logikbereich. In einigen Ausführungsformen umfasst das Verfahren ferner Bilden eines Grabens innerhalb des Pixelbereichs. In verschiedenen Beispielen umfasst das Verfahren nach dem Bilden des Grabens ferner Bilden einer dotierten Halbleiterschicht entlang von Seitenwänden und entlang einer unteren Fläche des Grabens. In einigen Ausführungsformen umfasst das Verfahren ferner Bilden einer Germaniumschicht innerhalb des Grabens und über der dotierten Halbleiterschicht. In einigen Beispielen umfasst das Verfahren nach dem Bilden der Germaniumschicht ferner Bilden eines optischen Sensors innerhalb der Germaniumschicht.

Semiconductor sensor and methods thereof

A method and structure providing an optical sensor having an optimized Ge—Si interface includes providing a substrate having a pixel region and a logic region. In some embodiments, the method further includes forming a trench within the pixel region. In various examples, and after forming the trench, the method further includes forming a doped semiconductor layer along sidewalls and along a bottom surface of the trench. In some embodiments, the method further includes forming a germanium layer within the trench and over the doped semiconductor layer. In some examples, and after forming the germanium layer, the method further includes forming an optical sensor within the germanium layer.

具有旋角控制之風力發電裝置

一種具有旋角控制之風力發電裝置，係包含：一風力發電裝置，具有一葉輪與數扇葉，該葉輪具有一實際轉速訊號，該數扇葉之葉片旋角可調整，並具有一實際旋角訊號；一誤差產生器，係接收該風力發電裝置之實際轉速訊號與實際旋角訊號，並輸出一轉速訊號誤差與一旋角訊號誤差；及一控制系統，係接收該誤差產生器之轉速訊號誤差與旋角訊號誤差，並輸出一轉矩電流命令至該風力發電裝置，該控制系統係具有一類神經網路，該類神經網路之各階層間係使用一監督式學習演算法修正權重，並透過一最佳化方法求得較佳之學習速率。

Wireless test system for testing microelectronic devices integrated with antenna

Multiple band antenna

Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method

A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.

時脈信號與資料信號的邊緣對準方法與相關裝置

邊緣對準裝置，包括：信號源，產生第一方波信號與第二方波信號；相位延遲電路，接收第一方波信號與第二方波信號，產生延遲的第一方波信號與延遲的第二方波信號；資料電路，根據延遲的第二方波信號產生第三方波信號；以及，相位校正電路，接收第三方波信號與延遲的第一方波信號，並據以產生至少一相位調整信號至相位延遲電路以調整延遲的第一方波信號與延遲的第二方波信號之間的一相位差，使得第三方波信號的信號邊緣對準延遲的第一方波信號的信號邊緣；其中，第一方波信號、第二方波信號與第三方波信號具有相同的一頻率。

Semiconductor package with integrated antenna and shielding pillars

A semiconductor package (1) includes a base film (PA1), a semiconductor die (100) on the base film (PA1), metal studs (102) on the semiconductor die (100), shielding pillars (SP) on the base film (PA1) and around the semiconductor die (100), a first molding compound (MC1) encapsulating the semiconductor die (100), the metal studs (102), and the shielding pillars (SP), a first re-distribution structure (RDL) on the first molding compound (MC1), a second molding compound (MC2) on the first re-distribution structure (RDL), through-mold-vias (202) in the second molding compound (MC2), and a second re-distribution structure (RDT) on the second molding compound (MC2) and electrically connected to the through-mold-vias (202). The second re-distribution structure (RDT) comprises an antenna (AT).

Semiconductor package with integrated antenna and shielding pillars

A semiconductor package (1) includes a base film (PA1), a semiconductor die (100) on the base film (PA1), metal studs (102) on the semiconductor die (100), shielding pillars (SP) on the base film (PA1) and around the semiconductor die (100), a first molding compound (MC1) encapsulating the semiconductor die (100), the metal studs (102), and the shielding pillars (SP), a first re-distribution structure (RDL) on the first molding compound (MC1), a second molding compound (MC2) on the first re-distribution structure (RDL), through-mold-vias (202) in the second molding compound (MC2), and a second re-distribution structure (RDT) on the second molding compound (MC2) and electrically connected to the through-mold-vias (202). The second re-distribution structure (RDT) comprises an antenna (AT).