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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 328. Отображено 100.
16-02-2012 дата публикации

CERAMIC COATING, ARTICLE COATED WITH COATING, AND METHOD FOR MANUFACTURING ARTICLE

Номер: US20120040136A1
Автор: CHIANG CHWAN-HWA, DU QI-JIAN
Принадлежит:

A ceramic coating comprised of alumina or zirconia. The ceramic coating defines a plurality of recesses on surface, giving a leather-like appearance thereon. The ceramic coating is formed by ion beam assisted evaporation. 1. A ceramic coating , the ceramic coating being composed of alumina or zirconia and defining a plurality of recesses on its surface , giving the ceramic coating a leather-like appearance.2. The ceramic coating as claimed in claim 1 , wherein the recesses intersect with each other.3. The ceramic coating as claimed in claim 1 , wherein the ceramic coating is formed by ion beam assisted evaporation.4. The ceramic coating as claimed in claim 1 , wherein the ceramic coating has a thickness of about 10 nm-200 nm.5. The process as claimed in claim 4 , wherein the ceramic coating is non-conductive.6. An article claim 4 , comprising:a substrate; anda ceramic coating formed on the substrate, the ceramic coating being composed of alumina or zirconia and defining a plurality of recesses on its surface, giving the ceramic coating a leather-like appearance.7. The article as claimed in claim 6 , wherein the substrate is made of one of the materials elected from the group consisting of plastic claim 6 , metal claim 6 , ceramic claim 6 , and glass.8. The article as claimed in claim 6 , wherein the recesses intersect with each other.9. The article as claimed in claim 6 , wherein the ceramic coating is formed by ion beam assisted evaporation.10. The article as claimed in claim 6 , wherein the ceramic coating has a thickness of about 10 nm-200 nm.11. The article as claimed in claim 6 , further comprising a transparent protective layer formed on the ceramic coating.12. The article as claimed in claim 11 , wherein protective layer comprises a single layer or multiple layers of transparent paint.13. A method for manufacturing an article claim 11 , comprising steps of:providing a substrate;forming a ceramic coating on the substrate, the ceramic coating being composed of ...

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Номер записи: 1
08-03-2012 дата публикации

Allocating register halves independently

Номер: US20120060011A1
Автор: Christopher A. Lapkowski, Chwan-Hang Lee, David P. Bélanger
Принадлежит: International Business Machines Corp

Register halves are allocated independently when performing register allocation during program compilation, thereby effectively doubling the number of registers which are available for allocation, which in turn may reduce spill code and improve run-time performance. When hardware registers are 64 bits wide, for example, an architecture supporting the present invention provides some number of separate hardware instructions that operate on the 32-bit high-word and/or the 32-bit low word of the hardware registers as if those 32-bit words are separate registers. Such hardware instructions are able to manipulate the register halves independently, leaving the other register half untouched. A register coloring algorithm using in the compilation process is invoked using the number of register halves, instead of the number of hardware registers.

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Номер записи: 2
10-05-2012 дата публикации

APPARATUS AND METHOD FOR AUTOMATIC REPLACEMENT OF WIRELESS LINK

Номер: US20120115421A1
Автор: Hsu Shih-Yao, Tang Kuang-Chuan, WU Chwan-Chia
Принадлежит:

An apparatus and a method for automatically establishing a new wireless link when the original wireless link between the apparatus and a commercially available FM radio receiver is interfered by other signal sources and reception conditions become poor, thereby eliminating the need to manually configure both the target FM radio receiver and the apparatus to a suitable FM frequency. The apparatus receives an audio signal, modulates and transmits the audio signal to the target FM radio receiver over a selected frequency, scans an FM spectrum for an alternative frequency, transmits an Radio Data System compatible command and a forcible switching signal to configure the target FM radio receiver to tune to the alternative frequency when signal quality of the received signal deteriorate sufficiently. 1. A method for automatically establishing a new wireless link when an original wireless link between an apparatus and a target FM radio receiver is subjected to interference and not suitable for communication , wherein said apparatus includes a first FM transmitter , a second FM transmitter and an FM receiver , said first FM transmitter transmitting a first signal over an initial frequency , said target FM radio receiver tuning to said initial frequency so as to establish said original wireless link with said apparatus and receive said first signal , the method comprising the following steps:(a) said FM receiver scanning an FM spectrum for one or more available frequencies and selecting one of said one or more available frequencies as an alternative frequency;(b) said first FM transmitter communicating an alternative frequency signal over said initial frequency to said target FM radio receiver, wherein said alternative frequency signal includes information of said alternative frequency;(c) said second FM transmitter transmitting a second signal over said alternative frequency;(d) said apparatus examining signal quality of said initial frequency to determine whether said ...

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Номер записи: 3
17-05-2012 дата публикации

SYSTEM AND METHOD FOR PROTECTING NETWORK RESOURCES FROM DENIAL OF SERVICE ATTACKS

Номер: US20120124383A1
Автор: Irwin J. David, Wang Chien-Cheng, Wu Chwan-Hwa
Принадлежит: AUBURN UNIVERSITY

The present disclosure generally pertains to systems and methods for protecting network resources from denial of service attacks. In one exemplary embodiment, a responder stores an access filter value used to determine whether an incoming message frame has been transmitted from an authorized user. In this regard, a user communication device includes logic for determining the access filter value stored at the responder and, includes the access filter value in a message frame transmitted from the computer to the responder. The responder compares the received access filter value to the stored access filter value. If such values match or otherwise correspond, the responder authenticates the message frame. However, if such values do not match or otherwise correspond, the responder discards the message frame. Thus, the responder processes authenticated message frames and discards unauthenticated message frames thereby preventing denial of service attacks from malicious users. 1. A system for protecting network resources from denial of service attacks , wherein the system comprises one or more processors configured to:exchange one or more private keys with a computing device;use a predetermined algorithm to calculate an access filter value uniquely associated with the computing device from the one or more private keys and one or more random values;transmit the one or more random values to the computing device;receive a message from the computing device, wherein the message includes a hash value calculated at the computing device; andauthenticate the message received from the computing device in response to the hash value in the message received from the computing device matching the access filter value uniquely associated with the computing device.2. The system of claim 1 , wherein the one or more processors are further configured to:update the one or more random values in response to the hash value in the message received from the computing device matching the access ...

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Номер записи: 4
05-07-2012 дата публикации

PROCESS FOR SURFACE TREATING MAGNESIUM ALLOY AND ELECTROMAGNETIC SHIELDING ARTICLE MADE WITH SAME

Номер: US20120171512A1
Автор: CHIANG CHWAN-HWA, LI ZHI-QIANG
Принадлежит:

A process for treating the surface of magnesium alloy comprises providing a substrate made of magnesium alloy. A chromium layer is then formed on the substrate by magnetron sputtering and a titanium layer is formed on the substrate by magnetron sputtering. A protective layer is formed on the titanium layer. The protective layer is an epoxy resin coating. 1. A process for surface treating magnesium alloy , the process comprising the following steps of:providing a substrate made of magnesium alloy;forming a chromium layer on the substrate by magnetron sputtering;forming a titanium layer on the chromium layer by magnetron sputtering; andforming a protective coating on the titanium layer, the protective coating being an epoxy resin coating.2. The process as claimed in claim 1 , wherein during magnetron sputtering of the chromium layer claim 1 , about 20 kW-40 kW of power is applied to chromium targets; argon at a flow rate of about 100 sccm to about 300 sccm is used as a sputtering gas; a bias voltage of about −150 V to about −200 V is applied to the substrate; and the sputtering temperature is about 150° C. to about 200° C.3. The process as claimed in claim 2 , wherein magnetron sputtering of the chromium layer takes about 10 min-15 min.4. The process as claimed in claim 1 , wherein during magnetron sputtering of the titanium layer claim 1 , about 20 kW-40 kW of power is applied to titanium targets; argon at a flow rate of about 100 sccm to about 300 sccm is used as a sputtering gas; a bias voltage of about −150 V to about −200 V is applied to the substrate; and the sputtering temperature is about 150° C. to about 200° C.5. The process as claimed in claim 4 , wherein magnetron sputtering of the titanium layer takes about 45 min-60 min.6. The process as claimed in claim 1 , wherein the protective coating is formed by spraying.7. The process as claimed in claim 6 , wherein during forming of the protective coating claim 6 , a liquid coating material was sprayed on the ...

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Номер записи: 5
26-07-2012 дата публикации

ELECTRONIC DEVICE HOUSING AND METHOD FOR MAKING THE SAME

Номер: US20120189842A1
Автор: CHIANG CHWAN-HWA, DU QI-JIAN
Принадлежит:

An electronic device includes a substrate, a metallic coating formed on the substrate by vacuum sputtering or vacuum vapor deposition and a top paint coating formed on the metallic coating. The metallic coating comprising a plurality of titanium oxide layers interleaved with an equal number of silicon oxide layers and has a reflectively of about 50%-80%. The top paint coating includes pearl pigments. 1. An electronic device housing , comprising:a substrate; anda metallic coating formed on the substrate by vacuum sputtering or vacuum vapor deposition, the metallic coating including a plurality of titanium oxide layers alternating with an equal number of silicon oxide layers and having a reflectivity of about 50%-80%; anda top paint coating formed on the metallic coating, the top paint coating including pearl pigments.2. The electronic device housing as claimed in claim 1 , wherein the metallic coating has a thickness of about 50 nm-500 nm.3. The electronic device housing as claimed in claim 1 , wherein the top paint coating has a thickness of about 20 μm-30 μm.4. The electronic device housing as claimed in claim 1 , wherein the top paint coating is a polyurethane resin paint coating claim 1 , wherein the mass percentage of pearl pigments is about 1-3%.5. The electronic device housing as claimed in claim 1 , wherein the metallic coating comprise three to seven layers.6. The electronic device housing as claimed in claim 1 , wherein each titanium oxide layer has a refractivity index of about 1.9-2.0 claim 1 , and each silicon oxide layer has a refractivity index of about 1.42-1.46.7. The electronic device housing as claimed in claim 1 , further comprising a middle paint coating formed between the metallic coating and the top paint coating.8. The electronic device housing as claimed in claim 7 , wherein middle paint coating has a thickness of about 10 μm-50 μm.9. The electronic device housing as claimed in claim 7 , wherein the middle paint coating is an ultraviolet ...

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Номер записи: 6
04-10-2012 дата публикации

COATED ARTICLE AND METHOD FOR MANUFACTURING SAME

Номер: US20120251838A1
Автор: CHEN JIA-LIN, CHIANG CHWAN-HWA, HUANG YI-JUN, LI Xu, PAN HAI-BO
Принадлежит:

A coated article is described. The coated article includes a substrate, a titanium bonding layer, a titanium-chromium alloy transition layer, and a titanium-chromium-nitrogen hard layer formed thereon, and in that order. The titanium bonding layer is a titanium layer. The titanium-chromium alloy transition layer is a titanium-chromium alloy layer. The titanium-chromium-nitrogen hard layer is a titanium-chromium-nitrogen layer. The titanium bonding layer, titanium-chromium alloy transition layer, and the titanium-chromium-nitrogen hard layer are formed by ion beam assisted sputtering. 1. A coated article , comprising:a substrate;a titanium bonding layer formed on the substrate;a titanium-chromium alloy transition layer formed on the titanium bonding layer; anda titanium-chromium-nitrogen hard layer formed on the titanium-chromium alloy transition layer.2. The coated article as claimed in claim 1 , wherein within the titanium-chromium alloy transition layer claim 1 , the titanium has an atomic percentage of about 30%-40%; the chromium has an atomic percentage of about 60%-70%.3. The coated article as claimed in claim 1 , wherein within the titanium-chromium-nitrogen hard layer claim 1 , the titanium has an atomic percentage of about 25.6%-37.0% claim 1 , the chromium has an atomic percentage of about 51.7%-67.6% claim 1 , and the nitrogen has an atomic percentage of about 5.4%-13.8%.4. The coated article as claimed in claim 1 , wherein the titanium bonding layer and the titanium-chromium alloy transition layer each has a thickness of about 0.1 μm-0.4 μm.5. The coated article as claimed in claim 1 , wherein the titanium-chromium-nitrogen hard layer has a thickness of about 1.3 μm-1.7 μm.6. The coated article as claimed in claim 1 , wherein the coated article has a surface micro-hardness of about 600 HV-700 HV.7. The coated article as claimed in claim 1 , wherein the titanium bonding layer claim 1 , titanium-chromium alloy transition layer claim 1 , and the titanium- ...

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Номер записи: 7
01-11-2012 дата публикации

FLOW DIVIDER SYSTEM

Номер: US20120273346A1
Автор: CHEN JIA-LIN, CHIANG CHWAN-HWA, HUANG YI-JUN, LI Xu, PAN HAI-BO
Принадлежит:

A flow divider system includes a gas box defining a chamber and an outlet gate, a shield located in the chamber and shielding the outlet gate, the shield including a main body, the main body defining a number of openings communicating the chamber with the outlet gate. The shielding can further includes a number of shield boards adjustably fixed to the main body, to adjustably shield portions of the openings. 1. A flow divider system , comprising:a gas box defining a chamber and an outlet gate;a shield located in the chamber and shielding the outlet gate, the shield comprising a main body, the main body defining a plurality of openings communicating the chamber with the outlet gate;wherein the shielding can further comprises a plurality of shield boards adjustably retained to the main body, to adjustably shield portions of the openings.2. The flow divider system as claimed in claim 1 , wherein the chamber is evacuated to form a vacuum space.3. The flow divider system as claimed in claim 1 , wherein the outlet gate is defined in one side of the gas box.4. The flow divider system as claimed in claim 1 , wherein the gas box further comprises a rotation board rotatably retained in the chamber claim 1 , and a plurality of spaced hanging rods fixed to the rotation board.5. The flow divider system as claimed in claim 1 , wherein the gas box further defines at least one inlet pipe opposite to the outlet gate.6. The flow divider system as claimed in claim 5 , wherein each inlet pipe defines a plurality of openings communicating with the chamber claim 5 , a reacting gas is capable of being fed into the chamber from the openings.7. The flow divider system as claimed in claim 1 , wherein the gas box further includes at least one target located in the chamber.8. The flow divider system as claimed in claim 1 , wherein each hole has a diameter between about 0.5 millimeters and about 50 millimeters.9. The flow divider system as claimed in claim 1 , wherein a distance between centers ...

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Номер записи: 8
21-02-2013 дата публикации

HOUSING AND METHOD FOR MAKING THE SAME

Номер: US20130045348A1
Автор: CHEN JIA-LIN, CHIANG CHWAN-HWA
Принадлежит:

A housing includes a substrate, a base layer formed on the substrate, a metal layer formed on the base layer, and a topcoat layer formed on the metal layer. The metal layer is a silicon-aluminum alloy layer. A method for making the housing is also described. 1. A housing , comprising:a substrate;a base layer formed on the substrate, the base layer being an acrylic epoxy layer;a metal layer formed on the base layer, the metal layer being a silicon-aluminum alloy layer and containing about 10%-90% of silicon and 10%-90% of aluminum by atomic percentage; anda topcoat layer formed on the metal layer, the topcoat layer being an acrylic polyurethane layer.2. The housing as claimed in claim 1 , wherein the substrate is made of plastic.3. The housing as claimed in claim 1 , wherein the base layer has a thickness of about 5 μm to about 30 μm.4. The housing as claimed in claim 1 , wherein the metal layer has a thickness of about 10 nm to about 80 nm.5. The housing as claimed in claim 1 , wherein the topcoat layer has a thickness of about 5 μm to about 20 μm.6. The housing as claimed in claim 1 , wherein the degree of cure of the base layer is about 50% to about 85%.7. The housing as claimed in claim 1 , wherein the degree of cure of the topcoat layer is about 50% to about 85%.8. A method for making a housing claim 1 , comprising:providing a substrate;forming a base layer on the substrate, the base layer being an acrylic epoxy layer;forming a metal layer on the base layer, the metal layer being a silicon-aluminum alloy layer and containing about 10%-90% of silicon and 10%-90% of aluminum by atomic percentage; andforming a topcoat layer formed on the metal layer, the topcoat layer being an acrylic polyurethane layer.9. The method as claimed in claim 8 , wherein magnetron sputtering the metal layer uses argon gas as the sputtering gas and the argon gas has a flow rate of about 80 sccm to about 120 sccm; uses silicon-aluminum alloy targets and the silicon-aluminum alloy targets ...

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Номер записи: 9
04-04-2013 дата публикации

HOUSING, ELECTRONIC DEVICE USING THE SAME AND METHOD FOR MAKING THE SAME

Номер: US20130082885A1
Автор: CHIANG CHWAN-HWA
Принадлежит: FIH (HONG KONG) LIMITED

A housing includes a base layer and a decorative layer formed on the base layer. The base layer includes a first portion and a second portion joining with the first portion. The first portion and the second portion cooperatively form an outer surface of the base layer. The first portion is composed of hardened carbon fiber woven fabric impregnated with resin. The second portion is composed of hardened glass fiber woven fabric impregnated with resin. The decorative layer formed on the outer surface. A method for making the housing and an electronic device using the device housing are provided. 1. A housing , comprising:a base layer, the base layer including a first portion and a second portion joining with the first portion, the first portion and the second portion cooperatively forming an outer surface of the base layer, the first portion composed of hardened carbon fiber woven fabric impregnated with resin, the second portion composed of hardened glass fiber woven fabric impregnated with resin; anda decorative layer formed on the outer surface.2. The housing as claimed in claim 1 , wherein the resin is at least translucent.3. The housing as claimed in claim 2 , wherein the resin is expoxy resin.4. The housing as claimed in claim 2 , wherein the resin is selected from polycarbonate or mixture of polyamide resin and glass fiber.5. The housing as claimed in claim 1 , wherein the first portion and the second portion are integrally joined together by the resin.6. The housing as claimed in claim 1 , wherein the decorative layer includes a base paint layer attached to the outer surface claim 1 , a metallic coating attached to the base paint layer claim 1 , a middle paint layer attached to the metallic coating claim 1 , and a transparent top paint layer attached to the middle paint layer.7. The housing as claimed in claim 6 , wherein the metallic coating is non-conductive.8. The housing as claimed in claim 7 , wherein the metallic coating is a material selected from a ...

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Номер записи: 10
16-05-2013 дата публикации

ANTENNA AND METHOD FOR MAKING SAME

Номер: US20130120196A1
Автор: CHEN JIA-LIN, CHIANG CHWAN-HWA
Принадлежит:

An antenna includes a transparent substrate, a silver layer directly formed on a surface of the transparent substrate, an ink layer made of an electroconductive ink directly formed on the silver layer, and a transparent protective layer directly formed on the silver layer. The silver layer forms a desired antenna pattern and has a feed portion and grounding portion. The ink layer covers the feed portion and the grounding portion. The protective layer covers the silver layer besides the feed portion and the grounding portion. A method for making the antenna is also described. 1. An antenna , comprising:a transparent substrate;a silver layer directly formed on a surface of the transparent substrate, the silver layer forming a desired antenna pattern and having a feed portion and grounding portion;an ink layer directly formed on the silver layer and covering the feed portion and the grounding portion, the ink layer made of an electroconductive ink; anda protective layer directly formed on the silver layer and covering the entire silver layer except the feed portion and the grounding portion, the protective layer being transparent.2. The antenna as claimed in claim 1 , wherein the thickness of the silver layer is about 5 nm to about 25 nm3. The antenna as claimed in claim 1 , wherein the sheet resistance of the silver layer is about 1.9 Ω/sq to about 2.1 Ω/sq.4. The antenna as claimed in claim 1 , wherein the antenna has an average transmission of visible light greater than 40%.5. The antenna as claimed in claim 1 , wherein the transparent substrate is made of plastic.6. The antenna as claimed in claim 5 , wherein the transparent substrate is made of polymethyl methacrylate.7. The antenna as claimed in claim 6 , wherein the transmission of light with a wavelength of about 550 nm of the antenna is about 45% to about 55%.8. The antenna as claimed in claim 1 , wherein the transparent substrate is made of glass.9. The antenna as claimed in claim 1 , wherein the ...

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Номер записи: 11
27-06-2013 дата публикации

TRENCH METAL OXIDE SEMICONDUCTOR TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF

Номер: US20130161736A1
Автор: Chen Young-Shying, Hung Chien-Chung, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

A trench metal oxide semiconductor transistor device and a manufacturing method thereof are described. The trench metal oxide semiconductor transistor device includes a substrate of a first conductivity type, a drift region of the first conductivity type, a deep trench doped region of a second conductivity type, an epitaxial region of the second conductivity type, a trench gate, a gate insulating layer, a source region, a drain electrode and a source electrode. The drift region has at least one deep trench therein, and the deep trench doped region is disposed in the deep trench. The trench gate passes through the epitaxial region, and a distance between a bottom of the trench gate and a bottom of the deep trench doped region is 0.5˜3 um. 1. A trench metal oxide semiconductor (MOS) transistor device , comprising:a substrate of a first conductivity type, having a first surface and a second surface;a drift region of the first conductivity type, disposed on the first surface of the substrate and having at least one deep trench therein;a deep trench doped region of a second conductivity type, disposed in the deep trench;an epitaxial region of the second conductivity type, disposed on the drift region;a trench gate, passing through the epitaxial region, wherein a distance between a bottom of the trench gate and a bottom of the deep trench doped region is 0.5˜3 um;a gate insulating layer, disposed on a surface of the trench gate;a source region, disposed in the epitaxial region and disposed beside two sides of the trench gate;a drain electrode, disposed on the second surface of the substrate; anda source electrode, disposed on the source region.2. The trench MOS transistor device as claimed in claim 1 , further comprising a heavily doped region of the second conductivity type claim 1 , disposed at a bottom of the deep trench doped region.3. The trench MOS transistor device as claimed in claim 2 , wherein a width of the heavily doped region is larger than a width of the ...

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Номер записи: 12
04-07-2013 дата публикации

COATED ARTICLE AND METHOD FOR MAKING SAME

Номер: US20130171446A1
Автор: CHIANG CHWAN-HWA, DU QI-JIAN
Принадлежит:

A coated article is provided. The coated article comprises a transparent substrate, a base paint layer directly formed on a surface of the transparent substrate, an aluminum layer directly formed on the aluminum layer, and a top paint layer directly formed on the aluminum layer. The base paint layer is made of a paint containing color paste. The top paint layer is made of a transparent paint. A method for making the coated article is also described. 1. A coated article , comprising:a transparent substrate;a base paint layer directly formed on a surface of the transparent substrate, the base paint layer made of a paint containing color paste;an aluminum layer directly formed on the aluminum layer; anda top paint layer directly formed on the aluminum layer, the top paint layer made of a transparent paint.2. The coated article as claimed in claim 1 , wherein the transparent substrate is made of a material selected from the group consisting of transparent plastic claim 1 , transparent rubber claim 1 , and transparent glass.3. The coated article as claimed in claim 1 , wherein the paint for the base paint layer mainly comprises acrylic resin.4. The coated article as claimed in claim 1 , wherein the color paste is white paste.5. The coated article as claimed in claim 4 , wherein the white paste has a weight percentage of about 35% to about 40% within the paint for the base paint layer.6. The coated article as claimed in claim 4 , wherein the white paste mainly comprises titanium dioxide particles.7. The coated article as claimed in claim 1 , wherein the color paste is black paste.8. The coated article as claimed in claim 7 , wherein the black paste has a weight percentage of about 2% to about 4% within the paint for the base paint layer.9. The coated article as claimed in claim 7 , wherein the black paste mainly comprises carbon particles.10. The coated article as claimed in claim 7 , wherein the black paste mainly comprises ferric oxide particles.11. The coated article ...

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Номер записи: 13
19-09-2013 дата публикации

ELECTRONIC DEVICE HOUSING AND METHOD FOR MAKING THE SAME

Номер: US20130240350A1
Автор: CHIANG CHWAN-HWA, DU QI-JIAN
Принадлежит:

An electronic device housing includes a substrate and a nano titanium dioxide coating formed on the substrate. The nano titanium dioxide coating has a thickness of about 10-100 nm. The nano titanium dioxide coating is formed of rutile crystals or composite crystals formed of rutile and anatase. A method for making the electronic device is also described. 1. A method for making electronic device housing , comprising:providing a substrate;vacuum sputtering a nano titanium dioxide coating on the substrate, the nano titanium dioxide coating being formed of rutile crystals or composite crystals formed of rutile and anatase, and having a thickness of about 10 nm to about 100 nm.2. The method as claimed in claim 1 , wherein vacuum sputtering the nano titanium dioxide coating is carried out by using oxygen gas and argon gas claim 1 , the oxygen gas and the argon gas having a total pressure of about 0.05 Pa to about 0.29 Pa.3. The method as claimed in claim 2 , wherein the oxygen gas has a pressure of about 0.01 Pa to about 0.225 Pa.4. The method as claimed in claim 1 , wherein vacuum sputtering the nano titanium dioxide coating is carried out by using a titanium target claim 1 , the titanium target is set with an output power of about 3000 W to about 4000 W.5. The method as claimed in claim 1 , wherein the nano titanium dioxide coating is vacuum sputtered at a rate of about 0.3 nm/s to about 0.5 nm/s.6. The method as claimed in claim 1 , further comprising a step of spraying a base paint coating on the substrate before forming the nano titanium dioxide coating.7. The method as claimed in claim 6 , wherein spraying the base paint coating is carried out by using acrylic resin paint claim 6 , epoxy resin paint claim 6 , polyurethane resin paint claim 6 , or phenolic resin paint.8. The method as claimed in claim 6 , wherein the base paint coating has a thickness of about 1 μm to about 30 μm. This application is a divisional application of U.S. Ser. No. 12/949934, filed Nov. 19, ...

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Номер записи: 14
28-11-2013 дата публикации

ONE-PIECE ZIPPER PULLER

Номер: US20130312230A1
Автор: Chang Chwan Huey Lim, Chu Tun-Jen, Coffield Timothy P., Pontaoe John S., Shereyk David A.
Принадлежит: ILLINOIS TOOL WORKS INC.

A zipper puller () has a one piece structure including a molded plastic body () and an integral molded looped tether (). The looped tether is molded in a first size and shape, and after molding the looped tether is permanently deformed to a second size and second shape by aligning the crystalline structure of the looped tether material. 1. A one-piece zipper puller , comprising:a molded, elastomeric puller body;a molded tether defining a loop integrally formed with said puller body; andsaid tether being oriented by permanent deformation of the molded shape thereof.2. The one-piece zipper puller of claim 1 , said tether being permanently deformed in a size sufficiently large for said body to pass through said loop defined by said tether.3. The one-piece zipper puller of claim 1 , said tether being permanently deformed by stretching.4. The one-piece zipper puller of claim 1 , said tether being permanently deformed longer and thinner than in the molded shape thereof.5. The one-piece zipper puller of claim 1 , said tether and said body being molded of the same material.6. The one-piece zipper puller of claim 1 , said tether and said body being formed as a monolithic structure of different materials in a two-shot molding process.7. The one-piece zipper puller of claim 1 , said body including a hole for receiving an insert.8. The one-piece zipper puller of claim 1 , said body provided with a grip enhancing surface configuration.9. The one-piece zipper puller of claim 1 , said tether including a proximal solid rib portion and a distal loop portion.10. A one-piece zipper puller claim 1 , comprising:a molded, elastomeric puller body;a molded tether integral with said puller body and defining a loop; andsaid tether being oriented in the direction of its length to provide different load bearing characteristics in a first direction than in a second direction, with a crystalline structure thereof having a greater degree of alignment along the length of the loop.11. The one-piece ...

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Номер записи: 15
12-12-2013 дата публикации

MONITORING REMOVAL AND REPLACEMENT OF TOOLS WITHIN AN INVENTORY CONTROL SYSTEM

Номер: US20130328661A1
Автор: Chwan, Fly David C., JR. Joseph, Lipsey Matthew J., Phillips Preston, Rogers Frederick J.
Принадлежит:

An inventory control system is described that includes a tool storage device including a drawer or a tray providing a pallet, wherein the pallet includes storage locations for objects; a sensing device configured to form an image of the storage locations; and a data processor configured to determine presence or absence of the pallet and presence or absence of objects within the storage locations of the pallet using the information from the image. 1. An inventory control system comprising:a tool storage device including a drawer or a tray providing a pallet, wherein the pallet includes storage locations for objects;a sensing device configured to form an image of the storage locations; anda data processor configured to determine presence or absence of the pallet and presence or absence of objects within the storage locations of the pallet using the information from the image.2. The inventory control system of claim 1 , wherein the pallet is a removable section within the drawer or tray and is configured to group objects by housing them within the storage locations.3. The inventory control system of claim 1 , wherein upon determining the pallet is absent from the drawer or the tray claim 1 , the processor issues the pallet along with the objects stored within the pallet as being checked out.4. The inventory control system of claim 3 , wherein: identify a return of the pallet to the drawer or the tray, and', 'upon determining the pallet has been returned to the drawer or the tray, the processor determines the presence or absence of the objects within the storage sections of the pallet., 'the processor is configured to5. The inventory control system of claim 1 , further comprising a display configured to display information about the pallet and the objects stored within the pallet.6. The inventory control system of claim 5 , wherein the processor is configured to display on the display an image of the pallet and the objects within the pallet.7. An inventory control ...

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Номер записи: 16
12-12-2013 дата публикации

ENABLING COMMUNICATION BETWEEN AN INVENTORY CONTROL SYSTEM AND A REMOTE SYSTEM OVER A NETWORK

Номер: US20130332323A1
Автор: Chwan, Fly David C., JR. Joseph, Lipsey Matthew J., Phillips Preston, Rogers Frederick J.
Принадлежит:

The instant application describes an inventory control system including an object storage device including a drawer or a tray for housing objects; a sensing device configured to acquire an image including information about the objects stored in the object storage device; an interface circuitry in communication with the sensing device and configured to generate object data based on the image acquired by the sensing device; and a processor configured to provide an integrated network access and transmit the object data across a network using a Web Service as defined by World Wide Web Consortium (WC), the Web Service being a data link interface between the inventory control system and a remote system. 1. An inventory control system comprising:an object storage device including a drawer or a tray for housing objects;a sensing device configured to acquire at least one image including information about the objects stored in the object storage device;an interface circuitry in communication with the sensing device and configured to generate object data based on the image acquired by the sensing device; anda processor configured to provide an integrated network access and transmit the object data across a network using a Web Service as defined by World Wide Web Consortium (W3C), the Web Service being a data link interface between the inventory control system and a remote system.2. The inventory control system of claim 1 , wherein the Web Service is configured to translate object data into a format that can be understood by the remote system.3. The inventory control system of claim 1 , wherein:the remote system includes a customer enterprise system; andthe Web Service is configured to translate object data into a format that can be understood by the customer enterprise system.4. The inventory control system of claim 1 , wherein:the processor is configured to use a local Windows Communication Foundation (WCF) software application and a remote Web Service software application, ...

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Номер записи: 17
26-12-2013 дата публикации

AUDITING AND FORENSICS FOR AUTOMATED TOOL CONTROL SYSTEMS

Номер: US20130346261A1
Автор: Chwan, Fly David C., JR. Joseph, Lipsey Matthew J., Phillips Preston, Rogers Frederick J.
Принадлежит: Snap-on Incorporated

An inventory control system is provided for monitoring the removal and replacement of objects stored in the system. The system includes a storage container including a plurality of storage locations for storing objects; a sensing device configured to detect the presence or absence of objects in the storage locations; a display device; and a data processor. The data processor is configured to receive work order data identifying a particular work order; receive information associated with the work order based on the work order data; and display the information associated with the work order on the display device. 1. An inventory control system for monitoring the removal and replacement of objects stored in the system , the system comprising:a storage container including a plurality of storage locations for storing objects;a sensing device configured to detect the presence or absence of objects in the storage locations;a display device; anda data processor configured to:receive work order data identifying a particular work order;receive information associated with the work order based on the work order data; anddisplay the information associated with the work order on the display device.2. The inventory control system of claim 1 , further comprising a barcode reader operatively connected to the data processor claim 1 , for reading a barcode of the work order;wherein the barcode of the work order includes the work order data.3. The inventory control system of claim 1 , further comprising a manual data entry device operatively connected to the data processor claim 1 , for enabling a user to manually enter the work order data.4. The inventory control system of claim 1 , wherein the information associated with the work order includes at least one of a tool list claim 1 , work instructions claim 1 , an inspection form claim 1 , a drawing claim 1 , a photograph claim 1 , and technical specifications.5. The inventory control system of claim 1 , further comprising a data ...

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Номер записи: 18
02-01-2014 дата публикации

DOUBLE-RECESSED TRENCH SCHOTTKY BARRIER DEVICE

Номер: US20140001489A1
Автор: Chen Young-Shying, Hung Chien-Chung, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

A Schottky barrier device includes a semiconductor substrate, a first contact metal layer, a second contact metal layer and an insulating layer. The semiconductor substrate has a first surface, and plural trenches are formed on the first surface. Each trench includes a first recess having a first depth and a second recess having a second depth. The second recess extends down from the first surface while the first recess extends down from the second recess. The first contact metal layer is formed on the second recess. The second contact metal layer is formed on the first surface between two adjacent trenches. The insulating layer is formed on the first recess. A first Schottky barrier formed between the first contact metal layer and the semiconductor substrate is larger than a second Schottky barrier formed between the second contact metal layer and the semiconductor substrate. 1. A Schottky barrier device , comprising:a semiconductor substrate, having a first surface and a second surface positioned oppositely, and a plurality of trenches formed on the first surface, each trench comprising a first recess having a first depth and a second recess having a second depth, the second recess extending down from the first surface, the first recess extending down from the second recess, and the first depth larger than the second depth;a first contact metal layer at least formed on a surface of the second recess;a second contact metal layer formed on the first surface and between two adjacent trenches; andan insulating layer formed on a surface of the first recess,wherein a first Schottky barrier is formed between the first contact metal layer and the semiconductor substrate, a second Schottky barrier is formed between the second contact metal layer and the semiconductor substrate, and the first Schottky barrier is larger than the second Schottky barrier.2. The Schottky barrier device according to claim 1 , wherein a material of the semiconductor substrate comprises silicon ...

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Номер записи: 19
23-01-2014 дата публикации

TOOL TRAINING FOR AUTOMATED TOOL CONTROL SYSTEMS

Номер: US20140025543A1
Автор: Chwan, Fly David C., JR. Joseph, Lipsey Matthew J., Phillips Preston, Rogers Frederick J.
Принадлежит: Snap-on Incorporated

An inventory control system and method determines an inventory condition of objects stored in the system. Embodiments include a storage container including a plurality of storage locations for storing objects; an image sensing device to capture image data of the container, including image data of the plurality of storage locations and a target area that includes an individual object storage location having less than the plurality of storage locations; a data storage device for storing the image data of the container; and a data processor. The processor receives initial image data representing an initial image of the plurality of storage locations, and image data representing an image of the target area captured subsequent to the initial image; modifies the initial image data based on the image data of the target area to generate adjusted image data; and stores the adjusted image data in the data storage device. 1. An inventory control system for determining an inventory condition of objects stored in the system , the system comprising:a storage container including a plurality of storage locations for storing objects;an image sensing device configured to capture image data of the container, including image data of all of the plurality of storage locations, and of a target area of the container that includes an individual object storage location comprising less than the plurality of storage locations;a data storage device for storing the image data of the container; anda data processor configured to:receive initial image data representing an initial image of the plurality of storage locations,receive image data representing an image of the target area captured subsequent to the initial image;modify the initial image data based on the image data of the target area to generate adjusted image data; andstore the adjusted image data in the data storage device.2. The inventory control system of claim 1 , wherein the storage container comprises a drawer or a tray.3. The ...

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Номер записи: 20
01-01-2015 дата публикации

HOUSING AND METHOD FOR MAKING SAME

Номер: US20150003028A1
Автор: CHIANG CHWAN-HWA, WANG CHIEH-HSIANG
Принадлежит: FIH (HONG KONG) LIMITED

A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided. 1. A housing for an electronic device , comprising:a ceramic base comprising ceramic material, the ceramic base defining a receiving area and comprising an inner surface facing the receiving area;at least one electronic element embedded in the ceramic base; anda buffer layer formed on and in contact with the inner surface, the buffer layer made of resin.2. The housing as claimed in claim 1 , wherein the ceramic material is a mixture of ZrO claim 1 , InO claim 1 , and AlO; in the mixture claim 1 , the ZrOhas a weight percentage of about 85% to about 91% claim 1 , the InOhas a weight percentage of about 8% to about 13% claim 1 , and the AlOhas weight percentage of about 1% to about 2%.3. The housing as claimed in claim 2 , wherein the ceramic base further comprises a sintering-assistant agent; the sintering-assistant agent is an oxide having a melting point lower than a sintering temperature of the ceramic material.4. The housing as claimed in claim 1 , wherein the ceramic material is dielectric ceramic material comprising BaTiOor ((Zn claim 1 ,Mg)TiO) as a main constituent.5. The housing as claimed in claim 4 , wherein the ceramic base further comprises a sintering-assistant agent; the sintering-assistant agent is an oxide having a melting point lower than a sintering temperature of the ceramic material.6. The housing as claimed in claim 5 , wherein the oxide is selected one or more from the group consisting of copper oxide claim 5 , zinc oxide claim 5 , boron trioxide claim 5 , and ZnO—BOsystem glass.7. The housing as claimed in claim 1 , wherein the at least one electronic element is one or more selected from the group consisting of antenna ...

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Номер записи: 21
07-01-2016 дата публикации

SILICON CARBIDE SEMICONDUCTOR DEVICE

Номер: US20160005883A1
Автор: Hung Chien-Chung, Lee Chwan-Ying, Lee Lurng-Shehng, Yen Cheng-Tyng
Принадлежит:

A silicon carbide (SiC) semiconductor device having a metal oxide semiconductor field effect transistor (MOSFET) and integrated with an anti-parallelly connected Schottky diode includes: a substrate, an n-drift layer, a plurality of doped regions, a gate dielectric layer, a gate electrode, an inter-layer dielectric layer, a plurality of source openings, a plurality of junction openings, a plurality of gate openings, a first metal layer and a second metal layer. The second metal layer at the junction openings forms the Schottky diode. 1. A silicon carbide (SiC) semiconductor device , comprising:a substrate, having heavily doped n-type;an n-drift layer, disposed on the substrate, having lightly doped n-type compared to the substrate;a plurality of doped regions, disposed at the n-drift layer, spaced from each other and formed a junction field effect transistor (JFET) region therebetween, each of the doped regions comprising a p-well, a heavily doped n-type (n+) region located in the p-well, and a heavily doped p-type (p+) region located in the p-well and surrounded by the n+ region;a gate dielectric layer, disposed on the n-drift layer;a gate electrode, disposed on the gate dielectric layer;an inter-layer dielectric layer, disposed on the gate dielectric layer and the gate electrode;a plurality of source openings, penetrating through the inter-layer dielectric layer and the gate dielectric layer to a surface portion of the n+ region and the p+ region and are separated by the gate electrode and the inter-layer dielectric layer;a plurality of junction openings, penetrating through the inter-layer dielectric layer and the gate dielectric layer to a surface portion of the JFET region and the doped regions are separated by the gate electrode and the inter-layer dielectric layer;a plurality of gate openings, penetrating through the inter-layer dielectric layer to a surface portion of the gate electrode;a first metal layer, disposed at a bottom of the source openings, formed ...

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Номер записи: 22
03-02-2022 дата публикации

Semiconductor Package and Method for Fabricating a Semiconductor Package

Номер: US20220037222A1
Автор: Chiang Chau Fatt, Morban Norliza, Saw Khay Chwan Andrew
Принадлежит:

A semiconductor package includes a semiconductor die, an encapsulation encapsulating the semiconductor die, the encapsulation having a first side and an opposing second side, a plurality of contact pads for electrically contacting the semiconductor die, the contact pads being arranged on the first side of the encapsulation, and a plurality of inspection holes arranged in communication with the contact pads and extending from the first side to the second side, such that solder joints on the first side of the encapsulation are optically inspectable using the inspection holes viewed from the second side of the encapsulation. 1. A semiconductor package , comprising:a semiconductor die;an encapsulation encapsulating the semiconductor die, the encapsulation comprising a first side and an opposing second side;a plurality of contact pads for electrically contacting the semiconductor die, the contact pads being arranged on the first side of the encapsulation; anda plurality of inspection holes arranged in communication with the contact pads and extending from the first side to the second side, such that solder joints on the first side of the encapsulation are optically inspectable using the inspection holes viewed from the second side of the encapsulation.2. The semiconductor package of claim 1 , further comprising:a plating layer arranged in the inspection holes.3. The semiconductor package of claim 2 , wherein the plating layer in each inspection hole is contiguous with the respective contact pad.4. The semiconductor package of claim 2 , wherein the encapsulation comprises a molded body.5. The semiconductor package of claim 4 , wherein the molded body comprises a laser-activatable polymer composition claim 4 , and wherein the plating layer is arranged on laser-activated regions on the molded body.6. The semiconductor package of claim 4 , wherein the encapsulation further comprises a laminate claim 4 , wherein the contact pads are arranged on the laminate claim 4 , and ...

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Номер записи: 23
16-01-2020 дата публикации

SHELL FOR AT LEAST ONE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20200021324A1
Автор: CHIANG CHWAN-HWA, TAI CHEN-YI, ZHENG ZENG-MAO
Принадлежит:

A shell for at least one electronic device which is very resilient for everyday purposes and which in addition can restore itself after severe deformations by being heated includes at least one frame, the frame being made in one or more parts out of memory metal. The disclosure also provides a method for manufacturing the shell. 1. A shell for at least one electronic device , comprising:at least one frame, wherein the frame is made of a memory metal.2. The shell of claim 1 , wherein the memory metal is nickel-titanium based memory alloy claim 1 , copper-based shape memory metal alloy claim 1 , iron-based shape memory metal alloy claim 1 , or gold-cadmium alloy.3. The shell of claim 2 , wherein the nickel-titanium based memory alloy is titanium-nickel alloy claim 2 , nickel-titanium-niobium alloy claim 2 , or titanium-nickel-palladium alloy.4. The shell of claim 2 , wherein the copper-based shape memory metal alloy is copper-gold-tin alloy claim 2 , copper-aluminum alloy claim 2 , or copper-tin alloy.5. The shell of claim 2 , wherein the iron-based shape memory metal alloy is iron-palladium alloy or iron-manganese-silicon alloy.6. The shell of claim 2 , wherein the frame has a thickness ranging from 0.8 millimeter to 1.2 millimeters.7. The shell of claim 1 , wherein the frame comprises a metal strip claim 1 , the metal strip is bent to form a shape claim 1 , two ends of the metal strip are joined together to form a close frame.8. The shell of claim 1 , wherein the frame comprises two metal strips claim 1 , the two metal strips are bent respectively to form a first portion and a second portion claim 1 , the first portion and the second portion are both U-shaped claim 1 , the first portion and the second portion are opposite to each other and joined to each other to form the frame.9. The shell of claim 1 , wherein the frame comprises four metal strips claim 1 , three of the four metal strips are bent respectively to form a first side portion and two second side ...

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Номер записи: 24
22-01-2015 дата публикации

LIQUID COATING COMPOSITION AND A COATING METHOD USING THE SAME

Номер: US20150024213A1
Автор: CHIANG CHWAN-HWA, WANG CHIEH-HSIANG
Принадлежит:

A liquid coating composition to protect electronic elements on a circuit board includes a heat curable resin composition, a photocurable resin, a photoinitiator, a curing agent, and a solvent. The heat curable resin composition includes poly(acrylic acid) oligomer and at least one compound selected from the group consisting of an epoxy resin and polyester polyol. The curing agent includes at least one compound selected from the group consisting of dicarboxylic anhydride and isocyanate. A method for applying and solidifying the liquid coating composition to form a cured film on a substrate and a resulting composite structure are also provided. 1. A liquid coating composition , comprising:a heat curable resin composition comprising poly (acrylic acid) oligomer and at least one compound selected from the group consisting of an epoxy resin and polyester polyol;a photocurable resin;a photoinitiator;a curing agent comprising at least one compound selected from the group consisting of dicarboxylic anhydride and isocyanate; anda solvent.2. The liquid coating composition of claim 1 , wherein if the heat curable resin composition includes the epoxy resin claim 1 , the curing agent includes at least the dicarboxylic anhydride of the group consisting of dicarboxylic anhydride and isocyanate claim 1 , and if the heat curable resin composition comprises the polyester polyol claim 1 , the curing agent includes at least the isocyanate of the group consisting of dicarboxylic anhydride and isocyanate.3. The liquid coating composition of claim 1 , wherein the photocurable resin is acrylic monomer.4. The liquid coating composition of claim 3 , wherein the acrylic monomer is selected from the group consisting of trimethtylol propane triacrylate claim 3 , tripropylene glycol diacrylate claim 3 , dipropylene glycol diacrylate claim 3 , 1 claim 3 ,6-hexanediol diacrylate claim 3 , and dipentaerythritol hexa(meth)acrylate.5. The liquid coating composition of claim 1 , wherein the poly( ...

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Номер записи: 25
25-01-2018 дата публикации

TOOL TRAINING FOR AUTOMATED TOOL CONTROL SYSTEMS

Номер: US20180025565A1
Автор: Chwan, Fly David C., JR. Joseph, Lipsey Matthew J., Phillips Preston, Rogers Frederick J.
Принадлежит:

An inventory control system and method determines an inventory condition of objects stored in the system. Embodiments include a storage container including a plurality of storage locations for storing objects; an image sensing device to capture image data of the container, including image data of the plurality of storage locations and a target area that includes an individual object storage location having less than the plurality of storage locations; a data storage device for storing the image data of the container; and a data processor. The processor receives initial image data representing an initial image of the plurality of storage locations, and image data representing an image of the target area captured subsequent to the initial image; modifies the initial image data based on the image data of the target area to generate adjusted image data; and stores the adjusted image data in the data storage device. 1. An inventory control system comprising:a storage container including a plurality of storage locations for storing objects;an image sensing device configured to capture image data of the container;a data storage device for storing the image data and data related to objects stored in the plurality of storage locations; and receive new data related to objects in the plurality of storage locations, wherein the new data includes data for an object in the plurality of storage locations for which there is no data stored in the data storage device; and', 'update the image data and the data related to objects stored in the plurality of storage locations stored in the storage device based on the received new data., 'a data processor configured to2. The inventory control system of claim 1 , wherein the other data and the new data comprises identification data for the objects.3. The inventory control system of claim 1 , wherein the processor is configured to remove the image data and the other data related to objects removed from the storage container from the data ...

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Номер записи: 26
28-01-2021 дата публикации

Pressure Sensor

Номер: US20210025774A1
Автор: Calo Paul Armand Asentista, Cha Chan Lam, Chiang Chau Fatt, Chua Kok Yau, Chye Jo Ean, Lee Chee Hong, Lee Swee Kah, Long Theng Chao, Narayanasamy Jayaganasan, Saw Khay Chwan
Принадлежит:

A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane. 1. A pressure sensor comprising:a lidless structure defining an internal chamber for a sealed environment and presenting an aperture;a chip including a membrane deformable from external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; anda circuitry configured to provide a pressure measurement information based on the deformation of the membrane.2. The pressure sensor of claim 1 , wherein the chip is mechanically connected to the lidless structure through a flip-chip connection claim 1 , to electrically connect the chip to the circuitry.3. The pressure sensor of claim 1 , wherein the chip is bonded to the lidless structure so as to prevent a fluid communication between the sealed environment and an external environment.4. The pressure sensor of claim 3 , wherein the chip is bonded to the lidless structure by glue occupying an interspace between the chip and the lidless structure.5. The pressure sensor of claim 3 , wherein the chip is bonded to the lidless structure by a film externally applied to the chip.6. The pressure sensor of claim 1 , further comprising a protective mesh cover of a reticular shape applied over the membrane.7. The pressure sensor of claim 1 , wherein the aperture is in an aperture wall integrated in one piece with the lidless structure.8. The pressure sensor of claim 1 , wherein the chip and the circuitry are placed at different walls of the structure.9. The pressure sensor of claim 1 , wherein the ...

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Номер записи: 27
06-02-2020 дата публикации

COMPOSITE MIDDLE FRAME OF ELECTRONIC COMMUNICATION DEVICE

Номер: US20200039184A1
Автор: CHIANG CHWAN-HWA, ZHENG ZENG-MAO
Принадлежит:

A composite middle frame for use in an electronic communication device includes at least two connecting layers. Each connecting layer is an endless structure. At least one of the connecting layers is made of plastic, and the remaining connecting layers are made of metal. 1. A composite middle frame for use in an electronic communication device , the composite middle frame comprising:at least two connecting layers, each connecting layer being an endless structure; wherein:at least one of the connecting layers is made of plastic; andthe remaining connecting layers are made of metal.2. The composite middle frame of claim 1 , wherein the at least two connecting layers comprise:a first connecting layer;a second connecting layer; anda third connecting layer; whereinthe first connecting layer, the second connecting layer, and the third connecting layer are layered in sequence; andboth of the first connecting layer and the third connecting layer are made of metal, and the second connecting layer is made of plastic.3. The composite middle frame of claim 2 , further comprising:two first side sections arranged on the outer, opposite sides of middle frame and parallel to each other; andtwo second side sections arranged on the outer, opposite sides of middle frame and parallel to each other; wherein:the two first side sections and the two second side sections are interconnected.4. The composite middle frame of claim 3 , wherein an outer surface of each first side section facing away from the other first side section is a flat surface; and an outer surface of each second side section facing away from the other second side section is a flat surface.5. The composite middle frame of claim 3 , wherein an outer surface of each first side section facing away from the other first side section is a cambered surface; and an outer surface of each second side section facing away from the other second side section is a cambered surface.6. The composite middle frame of claim 3 , wherein an ...

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Номер записи: 28
13-02-2020 дата публикации

Leadframe, Semiconductor Package and Method

Номер: US20200051898A1
Автор: Calo Paul Armand Asentista, Chiang Chau Fatt, Chua Kok Yau, Hoeglauer Josef, Lee Swee Kah, Saw Khay Chwan
Принадлежит:

In an embodiment, a leadframe includes a first electrically conductive part and a second electrically conductive part, each having an outer surface arranged to provide substantially coplanar outer contact areas having a footprint and an inner surface opposing the outer surface, the first part being spaced apart from the second part by a gap, a first recess arranged in the inner surface of the first part, a second recess arranged in the inner surface of the second part, and a first electrically conductive insert that is arranged in, and extends between, the first recess and the second recess and bridges the gap between the first part and the second part. 1. A leadframe , comprising:a first electrically conductive part and a second electrically conductive part, each having an outer surface arranged to provide substantially coplanar outer contact areas having a footprint and an inner surface opposing the outer surface, the first electrically conductive part being spaced apart from the second electrically conductive part by a gap;a first recess arranged in the inner surface of the first electrically conductive part;a second recess arranged in the inner surface of the second electrically conductive part; anda first electrically conductive insert arranged in, and extending between, the first recess and the second recess and bridging the gap between the first electrically conductive part and the second electrically conductive part.2. The leadframe of claim 1 , wherein an upper surface of the first electrically conductive insert is substantially coplanar with the inner surface of the first electrically conductive part and with the inner surface of the second electrically conductive part of the leadframe.3. The leadframe of claim 1 , wherein the first electrically conductive insert further comprises an electrically insulating coating on a lower surface claim 1 , and wherein the lower surface faces towards the inner surface of the first electrically conductive part and the ...

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Номер записи: 29
29-05-2014 дата публикации

Schottky Barrier Diode and Fabricating Method Thereof

Номер: US20140145207A1
Автор: CHU KUAN-WEI, Lee Chwan-Ying, Lee Lurng-Shehng, Yen Cheng-Tyng
Принадлежит:

A Schottky barrier diode and fabricating method thereof are disclosed. A semiconductor substrate may have a first surface and a second surface positioned oppositely to be provided. Several trenches are formed on the first surface. Each trench has a sidewall with a first depth and a first bottom surface. An insulating material is formed on the first surface of the semiconductor substrate and on the sidewall and the first bottom surface of each trench, wherein the insulating material has a first thickness on the sidewall. The insulating material on the sidewall is patterned to define a second bottom surface having a second depth smaller than the first depth, and the removed portion of the insulating material on the sidewall has a second thickness smaller than the first thickness. Afterward, a contact metal layer is at least formed on the first surface between adjacent trenches. 1. A method of fabricating a Schottky barrier diode , comprising:providing a semiconductor substrate having a first surface and a second surface positioned oppositely;forming a plurality of trenches on the first surface of the semiconductor substrate, and each of the trenches with a first depth having a sidewall and a first bottom surface;forming an insulating material on the first surface and on the sidewall and the first bottom surface of each of the trenches, wherein the insulating material has a first thickness on the sidewall of each of the trenches;patterning the insulating material on the first surface and the insulating material on the sidewall of each of the trenches so as to remove the insulating material on the first surface and to define a second bottom surface in each of the trenches, wherein the second bottom surface has a second depth smaller than the first depth, and an etched portion of the insulating material on the sidewall of each of the trenches has a second thickness smaller than the first thickness; andforming a contact metal layer at least on the first surface between ...

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Номер записи: 30
17-03-2016 дата публикации

MONITORING REMOVAL AND REPLACEMENT OF TOOLS WITHIN AN INVENTORY CONTROL SYSTEM

Номер: US20160078704A1
Автор: CHWAN Joseph, Fly David C., Lipsey Matthew J., Phillips Preston, Rogers Frederick J.
Принадлежит:

An inventory control system is described that includes a tool storage device including a drawer or a tray providing a pallet, wherein the pallet includes storage locations for objects; a sensing device configured to form an image of the storage locations; and a data processor configured to determine presence or absence of the pallet and presence or absence of objects within the storage locations of the pallet using the information from the image. 1. An inventory control system comprising:a tool storage device including a drawer or a tray having a storage location for storing a target object;a display device configured to display information about the target object; and receive a selection of a target object,', 'identify a target location image associated with the target object,', 'identify target object coordinates within the target location image,', 'apply a visual contrast element to the target location image at the target object coordinates; and', "display on the display device the visual contrast element applied to the target location image at the target object coordinates on a display of the inventory control system to draw a user's attention to the target object."], 'a processor configured to2. The inventory control system of claim 1 , further comprising a sensing device configured to form the target location image for determining presence or absence of the target object in the storage location.3. The inventory control system of claim 1 , wherein the processor is configured to receive the selection of the target object from a user operating the inventory control system.4. The inventory control system of claim 1 , wherein:the target object includes a tool for storage in the storage location, orthe target object includes the storage location for housing the tool.5. The inventory control system of claim 1 , wherein the target location image includes an image of a drawer or a tray within the tool storage device housing the target object.6. The inventory control ...

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Номер записи: 31
19-03-2015 дата публикации

SPACE-TIME SEPARATED AND JOINTLY EVOLVING RELATIONSHIP-BASED NETWORK ACCESS AND DATA PROTECTION SYSTEM

Номер: US20150082399A1
Автор: HAWKINS Myers, Irwin J. David, LAST David Charles, SUN Hao, Wu Chwan-Hwa
Принадлежит:

A network security system that employs space-time separated and jointly-evolving relationships to provide fast network access control, efficient real-time forensics capabilities, and enhanced protection for at-rest data in the event of a network breach. The network security system allows, in part, functionality by which the system accepts a request by a user to access the data stored in the database, identifies a sequence of security agents to participate in authenticating and protecting the access of the data by the user, generates a sequence of pseudorandom IDs and space-time varying credentials, checks at each one of the security agents a corresponding one of the credentials, determines that the user is permitted to access the data using access control logs if all the security agents accept the corresponding credentials, and varies the credentials based on a space-time relationship. 1. A system for determining whether user access to data stored in a database is authorized , comprising:computer-executable software code stored on at least one non-transitory data storage device for accepting a request by a user to access the data stored in the database;means for identifying a sequence of servers to participate in authenticating the access of the data by the user;means for generating a sequence of passwords;computer-executable software code stored on at least one non-transitory data storage device for checking, at each one of the servers, a corresponding one of the passwords;means for determining that the user is permitted to access the data if all the servers accept the corresponding password; andmeans for varying the passwords over time.2. The system of claim 1 , wherein the sequence of passwords comprise one-time passwords.3. The system of claim 1 , wherein the passwords vary subsequent to transmission of a data packet claim 1 , subsequent to the user accessing the data claim 1 , or subsequent to a user logon session.4. The system of claim 1 , further comprising ...

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Номер записи: 32
12-06-2014 дата публикации

SIC TRENCH GATE TRANSISTOR WITH SEGMENTED FIELD SHIELDING REGION AND METHOD OF FABRICATING THE SAME

Номер: US20140159053A1
Автор: Chen Young-Shying, Hung Chien-Chung, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

A SiC trench gate transistor with segmented field shielding region is provided. A drain region of a first conductivity type is located in a substrate. A first drift layer of the first conductivity type is located on the substrate and a second drift layer of the first conductivity type is located on the first drift layer. A base region of a second conductivity type is located on the second drift layer. A gate trench is located between the adjacent base regions. A plurality of segmented field shielding regions of the second conductivity type is placed under a bottom of the gate trench and the space between segmented field shielding regions is the first drift region. A gate dielectric layer is located on a bottom and at a sidewall of the gate trench and a trench gate is formed in the gate trench. 1. A trench gate transistor with segmented field shielding region , comprising:a drain region, being of a first conductivity type, and located in a substrate;a first drift layer, being of the first conductivity type, and located on the substrate;a second drift layer, being of the first conductivity type, and located on the first drift layera plurality of base regions, being of a second conductivity type, and located on the second drift layer, wherein a plurality of gate trenches are located between the base regions;a plurality of source regions, being of the first conductivity type, and disposed in the base regions and located adjacent to sidewalls of the gate trenches;a plurality of body regions, being of the second conductivity type, and disposed in the base regions;a plurality of segmented field shielding regions, being of the second conductivity type, and disposed under a bottom of the gate trenches;a plurality of gate dielectric layers, disposed on the bottom and at the sidewall of the gate trench; anda plurality of trench gates, located in the gate trenches.2. The trench gate transistor with segmented field shielding region as claimed in claim 1 , wherein depths of the ...

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Номер записи: 33
14-03-2019 дата публикации

SEMICONDUCTOR POWER DEVICE

Номер: US20190081136A1
Автор: Hung Chien-Chung, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит:

A semiconductor power device includes an n-type drift layer, a plurality of first p-doped regions, a plurality of n-doped regions, a plurality of second p-doped regions, a gate dielectric layer, a gate electrode, an interlayer dielectric layer and a plurality of source contacts. Each first p-doped region includes a first p-doped portion and a plurality of first p-doped arms extending outwards from the first p-doped portion. Each n-doped region includes an n-doped portion and a plurality of n-doped arms extending outwards from the n-doped portion. 1. A semiconductor power device , comprising:an n-type drift layer;a plurality of first p-doped regions disposed at the n-type drift layer, each of the plurality of first p-doped regions comprising a first p-doped portion and a plurality of first p-doped arms extending outwards from the first p-doped portion;a plurality of n-doped regions disposed in the plurality of first p-doped regions, each of the plurality of n-doped regions comprising an n-doped portion corresponding to the first p-doped portion and a plurality of n-doped arms extending outwards from the n-doped portion corresponding to the plurality of first p-doped arms;a plurality of second p-doped regions adjacent to the first p-doped portion,a gate dielectric layer disposed on the n-type drift layer;a gate electrode disposed on the gate dielectric layer;an interlayer dielectric layer disposed on the gate dielectric layer and the gate electrode; anda plurality of source contacts, each of the plurality of source contacts passing through the interlayer dielectric layer and the gate dielectric layer to form an Ohmic contact with a part of the n-doped portion and the plurality of second p-doped regions.2. The semiconductor power device of claim 1 , wherein the n-type drift layer is made of silicon carbide.3. The semiconductor power device of claim 1 , wherein each of the plurality of first p-doped arms comprises a pair of first arms and a pair of second arms extending ...

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Номер записи: 34
19-06-2014 дата публикации

STEPPED TRENCH MOSFET AND METHOD OF FABRICATING THE SAME

Номер: US20140167151A1
Автор: Chen Young-Shying, Hung Chien-Chung, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

A step trench metal-oxide-semiconductor field-effect transistor comprises a drift layer, a first semiconductor region, a stepped gate and a floating region. The drift layer is of a first conductivity type. The first semiconductor region is of a second conductivity type and located on the drift layer, wherein the drift layer and the first semiconductor region have a stepped gate trench therein. The stepped gate trench at least comprises a first recess located in the first semiconductor region and extending into the drift layer and a second recess located below a bottom of the first recess, wherein a width of the second recess is smaller than a width of the first recess. A floating region is of the second conductivity type and located in the drift layer below the second recess. 1. A stepped trench MOSFET , comprising:a drift layer of a first conductivity type;a first semiconductor region of a second conductivity type, disposed on a first surface of the drift layer, wherein a stepped gate trench is disposed in the drift layer and in the first semiconductor region, the stepped gate trench at least comprises a first recess and a second recess, the first recess is located in the first semiconductor region and extends into the drift layer, the second recess is located in the drift layer below a bottom of the first recess, and a width of the second recess is smaller than a width of the first recess;a second semiconductor region of the first conductivity type, disposed on a second surface of the drift layer;a stepped gate, disposed in the stepped gate trench;a floating region of the second conductivity type, disposed in the drift layer below a bottom of the second recess;an insulation layer, disposed in the stepped gate trench and insulating the stepped gate from each of the first semiconductor region, the drift layer and the floating region; anda source region of the first conductivity type, disposed in the first semiconductor region adjacent to a sidewall of the stepped ...

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Номер записи: 35
25-03-2021 дата публикации

Use of on-screen content identifiers in automated tool control systems

Номер: US20210089774A1
Автор: Cody L. HOUSTON, David C. Fly, Frederick J. Rogers, Jason NEWPORT, Joseph Chwan, Matthew J. Lipsey, Preston C. PHILLIPS, Sean W. RYAN
Принадлежит: Snap On Inc

An inventory control system comprises an object storage device, a display device, and one or more processors. The object storage device includes a plurality of compartments, in which each compartment has a plurality of storage locations for storing objects. The display device is configured to display information about the object storage device. The one or more processors are configured to establish a description database of objects configured for storage in the inventory control system. The one or more processors retrieve object keywords corresponding to objects stored in the plurality of storage locations of one of the plurality of compartments. The one or more processors also generate a text block based on the retrieved object keywords. On the display device, the one or more processors display a representation of the plurality of compartments of the object storage device with the text block applied to the one of the plurality of compartments.

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Номер записи: 36
21-03-2019 дата публикации

MONITORING REMOVAL AND REPLACEMENT OF TOOLS WITHIN AN INVENTORY CONTROL SYSTEM

Номер: US20190088061A1
Автор: CHWAN Joseph M., Fly David C., Lipsey Matthew J., Phillips Preston, Rogers Frederick J.
Принадлежит:

An inventory control system is described that includes a tool storage device including a drawer or a tray providing a pallet, wherein the pallet includes storage locations for objects; a sensing device configured to form an image of the storage locations; and a data processor configured to determine presence or absence of the pallet and presence or absence of objects within the storage locations of the pallet using the information from the image. 1. An inventory control system comprising:a tool storage device including a drawer, or a tray, or a shelf having a plurality of storage locations for storing a plurality of objects;a sensing device configured to sense information relating to presence or absence of the objects in the plurality of storage locations;a display device configured to display information about the inventory control system; and receive identification of a target object configured for storage in the inventory control system;', 'retrieve target object coordinates for an object storage location associated with the identified target object from among the plurality of storage locations;', 'apply a visual contrast element at the retrieved target object coordinates in an image including the plurality of storage locations; and', 'display, on the display device, the image of the plurality of storage locations having the visual contrast element applied thereto., 'a processor configured to2. The inventory control system of claim 1 , wherein the processor is configured to:receive information sensed by the sensing device relating to the presence or absence of the objects in the plurality of storage locations; andidentify the target object as an object being returned to the tool storage device based on the received information relating to the presence or absence of the objects in the plurality of storage locations.3. The inventory control system of claim 1 , wherein the processor is configured to:receive selection of the target object through a user input device ...

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Номер записи: 37
26-06-2014 дата публикации

SIC-BASED TRENCH-TYPE SCHOTTKY DEVICE

Номер: US20140175457A1
Автор: Chen Kai-Yu, Chen Young-Shying, Chuang Chiao-Shun, Huang Cheng-Chin, Hung Chien-Chung, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

A SiC-based trench-type Schottky device is disclosed. The device includes: a SiC substrate having first and second surfaces; a first contact metal formed on the second surface and configured for forming an ohmic contact on the substrate; a drift layer formed on the first surface and including a cell region and a termination region enclosing the cell region; a plurality of first trenches with a first depth formed in the cell region; a plurality of second trenches with a second depth less than the first depth; a plurality of mesas formed in the substrate, each defined between neighboring ones of the trenches; an insulating layer formed on sidewalls and bottoms of the trenches; and a second contact metal formed on the mesas and the insulating layer, extending from the cell region to the termination region, and configured for forming a Schottky contact on the mesas of the substrate. 1. A SiC-based trench-type Schottky device , comprising:a SiC substrate having a first surface and an opposing second surface;a first contact metal formed on the second surface of the SiC substrate and configured for forming an ohmic contact between the first contact metal and the SiC substrate;a SiC drift layer formed on the first surface of the SiC substrate and including a cell region and a termination region enclosing the cell region;a plurality of first spaced trenches with a first depth formed in the cell region;a plurality of second spaced trenches with a second depth formed in the termination region, wherein the second depth is less than the first depth;a plurality of mesas formed in the SiC drift layer, each defined between neighboring ones of the first and the second spaced trenches;an insulating layer formed on sidewalls and bottoms of the first and the second spaced trenches; anda second contact metal formed on the mesas and the insulating layer, extending from the cell region to the termination region, and configured for forming a Schottky contact between the second contact ...

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Номер записи: 38
26-06-2014 дата публикации

INTEGRATED DEVICE HAVING MOSFET CELL ARRAY EMBEDDED WITH BARRIER SCHOTTKY DIODE

Номер: US20140175559A1
Автор: Chen Young-Shying, Hung Chien-Chung, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Provided is an integrated device having a MOSFET cell array embedded with a junction barrier Schottky (JBS) diode. The integrated device comprises a plurality of areas, each of which includes a plurality of MOS transistor cells and at least one JBS diode. Any two adjacent MOS transistor cells are separated by a separating line. A first MOS transistor cell and a second MOS transistor cell are adjacent in a first direction and separated by a first separating line, and the first transistor cell and a third MOS transistor cell are adjacent in a second direction and separated by a second separating line. The JBS diode is disposed at an intersection region between the first separating line and the second separating line. The JBS diode is connected in anti-parallel to the first, second and third MOS transistor cells. 1. An integrated device having a metal oxide semiconductor field effect transistor (MOSFET) cell array embedded with a junction barrier Schottky (JBS) diode , comprising a plurality of areas , each area comprising:a plurality of MOS transistor cells, wherein any two adjacent MOS transistor cells are separated by a separating line, and wherein a first MOS transistor cell and a second MOS transistor cell are adjacent in a first direction and separated by a first separating line, and the first transistor cell and a third MOS transistor cell are adjacent in a second direction and separated by a second separating line; andat least one JBS diode, disposed at an intersection region between the first separating line and the second separating line, wherein the JBS diode is connected in anti-parallel to the first, second and third MOS transistor cells.2. The integrated device of claim 1 , wherein the MOS transistor cells of each area comprises:a plurality of well regions of a second conductivity type, wherein any two adjacent well regions are separated by one of the separating lines; anda plurality of source regions of a first conductivity type, disposed in the well ...

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Номер записи: 39
05-04-2018 дата публикации

RECHARGEABLE TOOL AND BATTERY STATUS MONITORING IN AN AUTOMATED TOOL CONTROL SYSTEM

Номер: US20180095138A1
Автор: CHWAN Joseph, Fly David C., Lipsey Matthew J., LOBO Andrew R., NEWPORT Jason, PHILLIPS Preston C., Rogers Frederick J., RYAN Sean W.
Принадлежит:

An automated tool control system provides both inventory control of items stored in the system and monitoring of the charging status of rechargeable inventory items such as tools and batteries stored in the system. For these purposes, the tool control system includes storage locations for storing tools and other inventory items, and the storage locations include at least one storage location located in a charger operative to charge a rechargeable tool, battery, or battery pack disposed therein. In operation, the tool control system may monitor the charging status of any tool, battery, or battery pack disposed in the storage location of the charger through monitoring of battery status indicators of the tool, battery, battery pack, or charger; through monitoring of current or voltage drawn by the tool, battery, battery pack, or charger; or through wired or wireless communication with a communication enabled tool, battery, battery pack, or charger. 1. An automated tool control system comprising:a plurality of storage locations configured to store inventory items including at least one rechargeable inventory item;a charger associated with one storage location of the plurality of storage locations and configured to charge the at least one rechargeable inventory item when the at least one inventory item is present in the one storage location; anda processor and sensing device configured to determine the presence or absence of inventory items in the plurality of storage locations,wherein the processor is configured to determine presence of the at least one rechargeable inventory item in the one storage location associated with the charger, and to monitor a charging status of the at least one rechargeable inventory item.2. The automated tool control system of claim 1 , wherein the at least one rechargeable inventory item is at least one of a rechargeable tool claim 1 , battery claim 1 , and battery pack.3. The automated tool control system of claim 1 , wherein the processor ...

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Номер записи: 40
16-04-2015 дата публикации

Silicon carbide power device equipped with termination structure

Номер: US20150102362A1
Автор: Cheng-Tyng Yen, Chien-Chung Hung, Chwan-Ying Lee, Lurng-Shehng Lee
Принадлежит: Hestia Power Inc

A silicon carbide power device equipped with termination structure comprises a silicon carbide substrate, a power element structure and a termination structure. The silicon carbide substrate contains a drift layer which has a first conductivity and includes an active zone and a termination zone. The power element structure is located in the active zone. The termination structure is located in the termination zone and has a second conductivity, and includes at least one first doped ring abutting and surrounding the power element structure and at least one second doped ring surrounding the first doped ring. The first doped ring has a first doping concentration smaller than that of the second doped ring and a first doping depth greater than that of the second doped ring, thereby can increase the breakdown voltage of the silicon carbide power device.

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Номер записи: 41
26-06-2014 дата публикации

Gripper apparatus and method for controlling the same

Номер: US20140180477A1
Автор: Cheng-Yen Li, Chwan-Hsen Chen, Wei-Der Chung, yan-chen Liu
Принадлежит: Industrial Technology Research Institute ITRI

A gripper apparatus and its control method are provided. The gripper apparatus includes at least one gripper unit, and each gripper unit is configured with a first connecting rod and a second connecting rod. In addition, there is an elastic part disposed at the joint of the first and the second connecting rods, an encoder and a controller. Thereby, the controller is enabled to control the gripper apparatus to move toward an object in a first mode so as to enable the gripper unit to engage the object and thus exert a force upon the object. Consequently, the elastic part is deformed and the deformation of the elastic part is measured and encoded by the encoder into a force information to be transmitted to the controller for enabling the controller to switch the control of the gripper apparatus into a second mode according to the force information.

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Номер записи: 42
12-04-2018 дата публикации

MONITORING REMOVAL AND REPLACEMENT OF TOOLS WITHIN AN INVENTORY CONTROL SYSTEM

Номер: US20180102011A1
Автор: CHWAN Joseph M., Fly David C., Lipsey Matthew J., Phillips Preston, Rogers Frederick J.
Принадлежит:

An inventory control system is described that includes a tool storage device including a drawer or a tray providing a pallet, wherein the pallet includes storage locations for objects; a sensing device configured to form an image of the storage locations; and a data processor configured to determine presence or absence of the pallet and presence or absence of objects within the storage locations of the pallet using the information from the image. 1. An inventory control system comprising:a tool storage device including a drawer, a tray, or a shelf providing a pallet removably disposed in the drawer, tray, or shelf, wherein the pallet includes storage locations for objects;a sensing device configured to sense information relating to presence or absence of the pallet or objects within the storage locations of the pallet; anda data processor configured to track check out of the pallet and objects stored within the pallet by determining, based on the information sensed by the sensing device, presence or absence of the pallet in the drawer or tray and presence or absence of objects within the storage locations of the pallet.2. The inventory control system of claim 1 , wherein the sensing device is a camera configured to form an image of the drawer claim 1 , tray claim 1 , or shelf claim 1 , andthe data processor tracks check out of the pallet and objects stored within the pallet by determining, based on the image of the drawer, tray, or shelf formed by the camera, presence or absence of the pallet in the drawer or tray and presence or absence of objects within the storage locations of the pallet.3. The inventory control system of claim 1 , further comprising:a non-volatile memory storing information of two baseline images of the drawer, tray, or shelf including a first baseline image having the pallet present in the drawer, tray, or shelf and a second baseline image having the pallet absent from the image,wherein the data processor determines presence or absence of the ...

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Номер записи: 43
21-04-2016 дата публикации

METAL-AND-RESIN COMPOSITE AND METHOD FOR MAKING SAME

Номер: US20160107342A1
Автор: CHIANG CHWAN-HWA, WANG CHIEH-HSIANG, ZHANG BAO-SHEN
Принадлежит:

A metal-resin composite includes a metal member and a resin member, the metal member has a plurality of metal posts formed on a surface of the metal member, the resin member is filled spaces between adjacent metal posts and covers the surface of the metal member to bond with the metal member. 1. A metal-resin composite comprising:a metal member having a plurality of metal posts on a surface of the metal member; anda resin member being filled in spaces between adjacent metal posts and covering the surface of the metal member to bond with the metal member.2. The metal-resin composite as claimed in claim 1 , wherein each metal post has a diameter of about 0.01 mm to about 1 mm claim 1 , and the length of each metal post is about 2 μm to about 15 μm along a direction extending from the metal member to the resin member.3. The metal-resin composite as claimed in claim 2 , wherein each end of the metal posts away from the metal member further has a metal lug connected with a corresponding metal post claim 2 , the thickness of each metal lug is about 4 μm to about 8 μm claim 2 , the resin member is filled the spaces between adjacent metal posts and covers the surface of the metal member and the metal lugs to bond with the metal member.4. The metal-resin composite as claimed in claim 1 , wherein each metal post has a diameter of about 0.01 mm to about 1 mm claim 1 , the length of each metal post is about 2 μm to about 20 μm along a direction extending from the metal member to the resin member claim 1 , and the surface roughness of each metal post is about 2.0 μm to about 5.0 μm.5. The metal-resin composite as claimed in claim 4 , wherein each end of the metal posts away from the metal member further has a metal lug connected with a corresponding metal post claim 4 , the thickness of each metal lug is about 4 μm to about 8 μm claim 4 , the surface roughness of the metal posts is about 2.0 μm to about 5.0 μm claim 4 , the resin member is filled the spaces between adjacent ...

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Номер записи: 44
21-04-2016 дата публикации

METAL-AND-RESIN COMPOSITE AND METHOD FOR MAKING SAME

Номер: US20160107419A1
Автор: CHIANG CHWAN-HWA, WANG CHIEH-HSIANG
Принадлежит:

A metal-resin composite includes a metal member, a connecting layer formed on the metal member and a resin member. The connecting layer has a plurality of micro-pores and is made of inorganic material. The resin member is filled into the micro-pores and covered on a surface of the connecting layer to bond with the metal member. 1. A metal-resin composite comprising:a metal member;a connecting layer formed on the metal member, the connecting layer defining a plurality of micro-pores and comprising an inorganic material; anda resin member being filled into the micro-pores and covered on a surface of the connecting layer to bond with the metal member.2. The metal-resin composite as claimed in claim 1 , wherein the connecting layer has a thickness of about 1 μm to about 100 μm claim 1 , and a surface roughness of about 2.0 μm to about 5.0 μm.3. The metal-resin composite as claimed in claim 1 , wherein each micro-pore has a diameter of about 5 μm to about 100 μm claim 1 , and a depth of about less than 100 μm.4. The metal-resin composite as claimed in claim 1 , wherein the metal-resin composite further includes an intermediate layer formed on a surface of the metal member claim 1 , the intermediate layer is made of inorganic material claim 1 , the connecting layer is formed on the intermediate layer.5. The metal-resin composite as claimed in claim 4 , wherein the intermediate layer has a thickness of about 0.1 μm to about 1 μm.6. The metal-resin composite as claimed in claim 4 , wherein the inorganic material is inorganic material powder having a diameter of about 5 μm to about 100 μm or inorganic material wire having a diameter of about 1 μm to about 5 μm claim 4 , and the inorganic material is selected from a group consisting of metal claim 4 , metal alloy claim 4 , metal carbide claim 4 , metal oxide claim 4 , resin and ceramic.7. The metal-resin composite as claimed in claim 6 , wherein the inorganic material powder is selected from a group consisting of self-fluxing ...

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Номер записи: 45
04-04-2019 дата публикации

MONITORING OF TOOL CALIBRATION STATUS IN AUTOMATED TOOL CONTROL SYSTEMS

Номер: US20190101463A1
Автор: CHWAN Joseph, Fly David C., KASSOUF Thomas L., Lipsey Matthew J., LOBO Andrew R., NEWPORT Jason D., PHILLIPS Preston C., Rogers Frederick J., RYAN Sean W.
Принадлежит:

A calibration monitoring system is provided to automatically monitor the calibration status of tools and other inventory items, such as upon the items being issued from or returned to the automated calibration monitoring system. The system identifies an inventory item, for example a calibrated torque wrench or other calibrated tool identified based on a unique identifying tag attached thereto. The system retrieves a calibration parameter value for the item from a calibration database, and completes a calibration measurement of the item based on the calibration parameter value. In the example, a torque measurement of the calibrated torque wrench can thus be automatically completed. In turn, the system determines a current calibration status of the item based on the calibration measurement, and selectively enables or disables issuance of the inventory item from the system according to the item's status as being in calibration or out of calibration. 1. An automated calibration monitoring system comprising:a plurality of storage locations configured to store inventory items including a calibrated inventory item;a database storing information on inventory items, including the calibrated inventory item, associated with the automated calibration monitoring system and configured for storage in the plurality of storage locations of the automated calibration monitoring system,wherein the database further stores a calibration parameter value for the calibrated inventory item; anda processor configured to, upon the calibrated inventory item being issued from or returned to the automated calibration monitoring system, compare a calibration measurement of the calibrated inventory item with the calibration parameter value for the calibrated inventory item.2. The automated calibration monitoring system of claim 1 , wherein the processor selectively authorizes the issue or return of the calibrated inventory item according to a result of the comparison.3. The automated calibration ...

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Номер записи: 46
04-04-2019 дата публикации

SPACE-TIME SEPARATED AND JOINTLY EVOLVING RELATIONSHIP-BASED NETWORK ACCESS AND DATA PROTECTION SYSTEM

Номер: US20190104118A1
Автор: HAWKINS Myers, Irwin J. David, LAST David Charles, SUN Hao, Wu Chwan-Hwa
Принадлежит:

A network security system that employs space-time separated and jointly-evolving relationships to provide fast network access control, efficient real-time forensics capabilities, and enhanced protection for at-rest data in the event of a network breach. The network security system allows, in part, functionality by which the system accepts a request by a user to access the data stored in the database, identifies a sequence of security agents to participate in authenticating and protecting the access of the data by the user, generates a sequence of pseudorandom IDs and space-time varying credentials, checks at each one of the security agents a corresponding one of the credentials, determines that the user is permitted to access the data using access control logs if all the security agents accept the corresponding credentials, and varies the credentials based on a space-time relationship. 130.-. (canceled)31. A system for protecting a data file stored in a cloud based storage system , comprising: authenticating a synchronous password received by a plurality of computing devices, a first portion of the synchronous password being received by one of the plurality of computing devices, and a second portion of the synchronous password being received by another of the plurality of computing devices;', 'encrypting a selected data file using a key determined through the use of a space-time jointly evolving function generated by one of the plurality of computing devices;', 'splitting the selected data file into a plurality of file fragments;', 'storing each of the plurality of file fragments in a random location on the plurality of computing devices; and', 'generating an index file that includes a file storage path for each file fragment and a security key for each file fragment, the index file configured to be used to merge the plurality of file fragments into the selected data file., 'computer-executable software code stored on one or more non-transitory data storage devices ...

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Номер записи: 47
21-04-2016 дата публикации

SILICON CARBIDE SEMICONDUCTOR DEVICE

Номер: US20160111533A1
Автор: Hung Chien-Chung, Lee Chwan-Ying, Lee Lurng-Shehng, Yen Cheng-Tyng
Принадлежит:

A silicon carbide (SiC) semiconductor device having a metal oxide semiconductor field effect transistor (MOSFET) and integrated with an anti-parallelly connected Schottky diode includes: an n-type substrate, an n-type drift layer, a plurality of doped regions, a gate dielectric layer, a gate electrode, an inter-layer dielectric layer, a plurality of source openings, a plurality of junction openings, a plurality of gate openings, a first metal layer and a second metal layer. The second metal layer at the junction openings forms the Schottky diode. 1. A silicon carbide (SiC) semiconductor device , comprising:an n-type substrate, having a first doping concentration;an n-type drift layer, disposed on the substrate, having a second doping concentration less than the first doping concentration;a plurality of doped regions, disposed at the n-type drift layer, spaced from each other and formed a junction field effect transistor (JFET) region having a third doping concentration therebetween, each of the doped regions comprising a p-well, a heavily doped n-type (n+) region located in the p-well, and a heavily doped p-type (p+) region;a gate dielectric layer, disposed on the n-type drift layer;a gate electrode, disposed on the gate dielectric layer;{'b': '41', 'an inter-layer dielectric layer, disposed on the gate dielectric layer and the gate electrode;'}a plurality of source openings, penetrating through the inter-layer dielectric layer and the gate dielectric layer to a surface portion of the n+ region and the p+ region and are separated by the gate electrode and the inter-layer dielectric layer;a plurality of junction openings, penetrating through the inter-layer dielectric layer and the gate dielectric layer to a surface portion of the JFET region and the doped regions are separated by the gate electrode and the inter-layer dielectric layer;a plurality of gate openings, penetrating through the inter-layer dielectric layer to a surface portion of the gate electrode;a first ...

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Номер записи: 48
19-04-2018 дата публикации

UTILIZATION OF WORK ORDER DATA IN AN AUTOMATED TOOL CONTROL SYSTEM

Номер: US20180108197A1
Автор: Chwan, Fly David C., JR. Joseph, Lipsey Matthew J., Phillips Preston, Rogers Frederick J.
Принадлежит:

An inventory control system is provided for monitoring the removal and replacement of objects stored in the system. The system includes a storage container including a plurality of storage locations for storing objects; a sensing device configured to detect the presence or absence of objects in the storage locations; a display device; and a data processor. The data processor is configured to receive work order data identifying a particular work order; receive information associated with the work order based on the work order data; and display the information associated with the work order on the display device. 1. An inventory control system for monitoring the removal and replacement of tools stored in the system , the system comprising:a storage container including a plurality of storage locations for storing objects;a sensing device configured to detect the presence or absence of tools in the storage locations;a display device; and receive a tool list;', 'determine whether each of the tools on the tool list is present in one of the storage locations; and', 'cause the display device to display a list of users and locations for each of the tools that is not present., 'a data processor configured to2. The inventory control system of claim 1 , wherein the data processor is further configured to:cause the display device to display information relating to which of the storage locations contains each of the tools that are present, andcause the display device to display alternative tool locations for each of the tools that is not present.3. The inventory control system of claim 1 , wherein the storage locations are a plurality of drawers or trays.4. The inventory control system of claim 1 ,wherein the data processor is further configured to receive a work order and information associated with the work order, andwherein the information associated with the work order includes the tool list.5. The inventory control system of claim 1 , further comprising a data storage device ...

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Номер записи: 49
29-04-2021 дата публикации

DATA ACQUISITION USING MACHINE-READABLE OPTICAL SYMBOLS

Номер: US20210125141A1
Автор: CHWAN Joseph, Fly David C., HOUSTON Cody L., Lipsey Matthew J., NEWPORT Jason, PHILLIPS Preston C., Rogers Frederick J., RYAN Sean W.
Принадлежит:

An inventory control system comprises an object storage device, one or more processors, a display device, and a mobile device. The object storage device includes a plurality of compartments, and each compartment includes a plurality of storage locations for storing objects. The one or more processors are configured to establish a database containing information regarding the object storage device, retrieve the information regarding the object storage device from the database, and generate an optical symbol based on the information regarding the object storage device. The display device is associated with the object storage device and configured to display the optical symbol. The mobile device is configured to capture an image of the optical symbol, obtain the information regarding the object storage device based on the image of the optical symbol, and display the information regarding the object storage device on a display screen of the mobile device. 1. An inventory control system comprising:an object storage device including a plurality of compartments, each compartment including a plurality of storage locations for storing objects; establish a database containing information regarding the object storage device,', 'retrieve the information regarding the object storage device from the database, and', 'generate an optical symbol based on the information regarding the object storage device;, 'one or more processors configured toa display device associated with the object storage device and configured to display the optical symbol; and capture an image of the optical symbol,', 'obtain the information regarding the object storage device based on the image of the optical symbol, and', 'display, on a display screen of the mobile device, the information regarding the object storage device., 'a mobile device configured to2. The inventory control system of claim 1 , wherein the optical symbol is one of: a two-dimensional (2D) bar code claim 1 , a Quick Response (QR) code ...

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Номер записи: 50
05-05-2016 дата публикации

SILICON CARBIDE FIELD EFFECT TRANSISTOR

Номер: US20160126346A1
Автор: Hung Chien-Chung, HUNG Hsiang-Ting, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит:

A silicon carbide field effect transistor includes a silicon carbide substrate, an n-type drift layer, a p-type epitaxy layer, a source region, a trench gate, at least one p-type doped region, a source, a dielectric layer and a drain. The p-type doped region is disposed at the n-type drift layer to be adjacent to one lateral side of the trench gate, and includes a first doped block and a plurality of second doped blocks arranged at an interval from the first doped block towards the silicon carbide substrate. Further, a thickness of the second doped blocks does not exceed 2 um. Accordingly, not only the issue of limitations posed by the energy of ion implantation is solved, but also an electric field at a bottom and a corner of the trench gate is effectively reduced, thereby enhancing the reliability of the silicon carbide field effect transistor. 1. A silicon carbide field effect transistor , comprising:a silicon carbide substrate;an n-type drift layer, disposed on the silicon carbide substrate;a p-type epitaxy layer, disposed on the n-type drift layer;a source region, formed at the p-type epitaxy layer and away from the n-type drift layer;a trench gate, penetrating through the p-type epitaxy layer and extending to the n-type drift layer;at least one p-type doped region, formed at the n-type drift layer and adjacent to a lateral side of the trench gate;a source, covering the source region and the trench gate;a dielectric layer, disposed between the trench gate and the source; anda drain, disposed at the silicon carbide substrate and away from the n-type drift layer;wherein, the p-type doped region comprises a first doped block being in contact with the first p-type epitaxy layer, and a plurality of second doped blocks arranged at an interval from the first doped block towards the silicon carbide substrate.2. The silicon carbide field effect transistor of claim 1 , wherein the first doped block has a thickness greater than that of the second doped blocks.3. The ...

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Номер записи: 51
27-05-2021 дата публикации

AUTOMATED TOOL DATA GENERATION IN AUTOMATED ASSET MANAGEMENT SYSTEMS

Номер: US20210158040A1
Автор: CHWAN Joseph, Fly David C., KASSOUF Thomas L., Lipsey Matthew J., LOBO Andrew R., NEWPORT Jason, PHILLIPS Preston C., Rogers Frederick J., RYAN Sean W.
Принадлежит:

An asset management system automatically generates and updates tool data stored in and used by the system for determining the presence or absence of tools or other inventory objects in the systems. The tool data can be automatically generated when a tool is newly added to the automated asset management system, and can be updated if and when characteristics of the tool and/or automated asset management system change. The automatic generation and updating includes automatically recognizing unique identifiers of tags located on inventory objects, automatically identifying an inventory object to associate with each unique identifier, and automatically populating a database to store each unique identifier in association with stored data for the corresponding inventory object. 1. An inventory control device comprising:a plurality of storage locations for storing objects;a processor; anda sensing device configured to determine presence or absence of the objects in the plurality of storage locations, performing a tool training scan of the plurality of the storage locations to associate a particular object with an attribute of a particular storage location,', 'determining, based on the tool training scan, whether a tag encoding a unique identifier is present on the particular object, and', 'updating a database storing data relating to the objects to include the unique identifier of the tag determined to be present on the particular object., 'wherein the processor is configured to perform a tool training process by2. The device of claim 1 , wherein the tool training process further includes a first scan of the plurality of the storage locations configured to associate the particular object with an attribute of the particular storage location while the particular object is empty.3. The device of claim 2 , wherein the tool training process further includes a second scan of the plurality of the storage locations configured to associate the particular object with an attribute of ...

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Номер записи: 52
23-04-2020 дата публикации

FRAME AND SURFACE TREATMENT METHOD FOR THE FRAME

Номер: US20200122194A1
Автор: CHIANG CHWAN-HWA, Guan Jun, TAI CHEN-YI, XIAO FEI-LONG
Принадлежит:

A frame includes a substrate, a first priming paint layer, a second priming paint layer, a non-conductive vacuum metallized priming paint layer, and a non-conductive vacuum metallized coating layer. The substrate is made by die casting technology of metal powder. The substrate, the first priming paint layer, the second priming paint layer, the non-conductive vacuum metallized priming paint layer, and the non-conductive vacuum metallized coating layer are stacked in the order written. The disclosure also provides a surface treatment method for the frame. 1. A frame comprising:a substrate made by die casting technology of metal powder;a first priming paint layer;a second priming paint layer;a non-conductive vacuum metallized priming paint layer;a non-conductive vacuum metallized coating layer;wherein the substrate, the first priming paint layer, the second priming paint layer, the non-conductive vacuum metallized priming paint layer, and the non-conductive vacuum metallized coating layer are stacked in sequence thereof.2. The frame of claim 1 , wherein the frame further comprises a colored well lacquer layer formed on a surface of the non-conductive vacuum metallized coating layer facing away from the non-conductive vacuum metallized priming paint layer.3. The frame of claim 2 , wherein the colored well lacquer layer has a thickness of 6 μm to 10 μm.4. The frame of claim 2 , wherein the frame further comprises a finish paint layer formed on a surface of the colored well lacquer layer facing away from the non-conductive vacuum metallized coating layer.5. The frame of claim 4 , wherein the frame further comprises an optical coating layer sandwiched between the colored well lacquer layer and the finish paint layer.6. The frame of claim 4 , wherein the finish paint layer has a thickness of 20 μm to 25 μm claim 4 , and is made of silicon dioxide or titanium dioxide.7. The frame of claim 1 , wherein the first priming paint layer has a thickness of 8 μm to 12 μm.8. The frame ...

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Номер записи: 53
01-09-2022 дата публикации

METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USING A SOLDERLESS JOINT

Номер: US20220278085A1
Автор: Calo Paul Armand Asentista, Cha Chan Lam, Chiang Chau Fatt, Chua Kok Yau, Lee Chee Hong, Lee Swee Kah, Long Theng Chao, Narayanasamy Jayaganasan, Saw Khay Chwan Andrew
Принадлежит: INFINEON TECHNOLOGIES AG

The method for fabricating an electrical module is disclosed. In one example, the method includes providing a bottom unit comprising a plateable encapsulant. Selective areas of the bottom unit are activated thereby turning them into electrically conductive regions. At least one electrical device comprising external contact elements is provided. The method includes placing the electrical device on the bottom unit so that the external contact elements are positioned above at least a first subset of the electrically conductive regions, and performing a plating process on the electrically conductive regions for generating plated regions and for electrically connecting the external contact elements with at least a first subset of the plated regions. 1. A method for fabricating an electrical module , the method comprisingproviding a bottom unit comprising a plateable encapsulant;activating selective areas of the bottom unit and thereby turning them into electrically conductive regions;providing at least one electrical device comprising external contact elements;placing the electrical device on the bottom unit so that the external contact elements are positioned above at least a first subset of the electrically conductive regions; andperforming a plating process on the electrically conductive regions for generating plated regions and for electrically connecting the external contact elements with at least a first subset of the plated regions.2. The method according to claim 1 , whereinthe plating process comprises one or both of electroless plating and electrochemical plating.3. The method according to claim 1 , whereinthe plating process comprises only electroless plating.4. The method according to claim 3 , whereinbefore placing the electrical device on the bottom unit a protrusion is formed onto the bottom unit for supporting the electrical device.5. The method according to claim 1 , whereinthe plating process comprises a first process of electroless plating and a ...

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Номер записи: 54
19-05-2016 дата публикации

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

Номер: US20160141412A1
Автор: Huang Yao-Feng, Hung Chien-Chung, HUNG Hsiang-Ting, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит:

A silicon carbide semiconductor device and method of manufacture thereof is made by providing a channel control zone which has impurity concentration distribution increased gradually from a first doping boundary to reach a maximum value between the first doping boundary and a second doping boundary, then decreased gradually toward the second doping boundary, so that the silicon carbide semiconductor device is formed with a lower conduction resistance and increased drain current without sacrificing threshold voltage. 1. A silicon carbide semiconductor device , comprising:a first semiconductor layer having a first conductivity;a second semiconductor layer located on the first semiconductor layer;an insulation layer located on the second semiconductor layer;a gate electrode located on the insulation layer;a first doping zone having a second conductivity opposite to the first conductivity and a first doping boundary and being located in the first semiconductor layer along the second semiconductor layer;a second doping zone having the first conductivity and a second doping boundary and being located in the first doping zone along the second semiconductor layer; anda third doping zone having the second conductivity and being located in the first semiconductor layer along the second semiconductor layer and abutting the second doping zone and partially overlapped with the first doping zone;wherein the first doping zone includes a channel control zone located along the second semiconductor layer between the first doping boundary and the second doping boundary; wherein the impurity concentration of the second semiconductor layer forms a gradient distribution in a thickness direction thereof;', 'wherein the gradient distribution has a peak value proximate the first semiconductor layer., 'wherein the channel control zone has impurity concentration distribution increased gradually from the first doping boundary to reach a maximum value between the first doping boundary and the ...

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Номер записи: 55
09-05-2019 дата публикации

Automated asset management system with multiple sensing technologies

Номер: US20190138981A1
Автор: Andrew R. Lobo, David C. Fly, Frederick J. Rogers, Jason NEWPORT, Joseph Chwan, Matthew J. Lipsey, Preston C. PHILLIPS
Принадлежит: Snap On Inc

An automated asset management system includes a plurality of storage locations for storing objects, and first and second sensing subsystems each configured to sense presence or absence of the objects in the plurality of storage locations. The first and second sensing subsystems are used to sense the presence or absence of a same particular object using different respective sensing modalities. In operation, a first scan of the storage locations is performed using the first sensing subsystem, and the presence or absence of the particular object is determined using the first sensing modality. In turn, a second scan of the storage locations is performed using the second sensing subsystem, and the presence or absence of the particular object is confirmed using both the result of the determination made using the first sensing modality and a determination of the presence or absence of the particular object using the second sensing modality.

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Номер записи: 56
09-05-2019 дата публикации

Molded Semiconductor Package with C-Wing and Gull-Wing Leads

Номер: US20190139869A1
Автор: Chong Hai Sin, Danny Koh Cher Hau, Macheiner Stefan, Poh Yong Chern, Salminen Toni, Saw Khay Chwan
Принадлежит:

A semiconductor package includes a semiconductor die embedded in a molded package body, leads electrically connected to the die and protruding from a side face of the molded package body, and a recess extending inward from the side face and into a bottom main face of the molded package body to form a single groove. The recess begins below a region of the side face from which the leads protrude, so that this region of the side face is flat and each of the leads exits the molded package body in the same plane. A first subset of the leads is bent inward towards the molded package body and seated in the single groove, to form a first row of leads configured for surface mounting. A second subset of the leads extends outward from the molded package body, to form a second row of leads configured for surface mounting. 1. A semiconductor package , comprising:a molded package body having a bottom main face, a top main face and side faces extending from the bottom main face to the top main face,a semiconductor die embedded in the molded package body;a first plurality of leads electrically connected to the semiconductor die and protruding from a first side face of the molded package body; anda first recess extending inward from the first side face of the molded package body and into the bottom main face to form a single groove along the first side face at a bottom of the package,wherein the first recess begins below a region of the first side face from which the first plurality of leads protrudes, so that the region of the first side face from which the first plurality of leads protrudes is flat and all leads of the first plurality of leads exit the molded package body in the same plane,wherein a first subset of the first plurality of leads is bent inward towards the molded package body and seated in the single groove formed by the first recess, to form a first row of leads configured for surface mounting,wherein a second subset of the first plurality of leads extends outward ...

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Номер записи: 57
09-06-2016 дата публикации

METAL-AND-RESIN COMPOSITE AND METHOD FOR MAKING THE SAME

Номер: US20160159029A1
Автор: CHIANG CHWAN-HWA, WANG CHIEH-HSIANG, ZHANG BAO-SHEN
Принадлежит:

A metal-and-resin composite includes a metal substrate having a plurality of nano pores, an intermediate layer formed on the metal substrate, and a resin member. The intermediate layer fills at least portion of each nano pore. The resin member covers and bonds with the intermediate layer, thus to bond with the metal substrate. 1. A metal-and-resin composite comprising:a metal substrate defining a plurality of nano pores;an intermediate layer formed on the metal substrate and filling at least a portion of each nano pore; anda resin member covering and bonding with the intermediate layer thus to bond with the metal substrate.2. The metal-and-resin composite as claimed in claim 1 , wherein the nano pores have a diameter of about 10 nm to about 1000 nm claim 1 , and a depth of about 0.1 μm to about 20 μm.3. The metal-and-resin composite as claimed in claim 1 , wherein a portion of each nano pore is unfilled with the intermediate layer claim 1 , and the portion of each nano pore unfilled with the intermediate layer has a diameter of about 10 nm to about 990 nm.4. The metal-and-resin composite as claimed in claim 3 , wherein the resin member fills the portion of each nano pore unfilled with the intermediate layer.5. The metal-and-resin composite as claimed in claim 1 , wherein the resin member is made of polybutylene terephthalate claim 1 , polyphenylene sulfide claim 1 , polyethylene terephthalate claim 1 , polyetheretherketone claim 1 , polycarbonate claim 1 , or polyvinyl chloride.6. The metal-and-resin composite as claimed in claim 1 , wherein the bonding between the resin member and the intermediate layer includes chemical bondings claim 1 , such the resin member can bond with the metal substrate through the chemical bondings.7. The metal-and-resin composite as claimed in claim 1 , wherein the intermediate layer has a thickness of about 0.5 nm to about 10 nm.8. The metal-and-resin composite as claimed in claim 1 , wherein the intermediate layer comprises a coupling ...

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Номер записи: 58
23-05-2019 дата публикации

Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating

Номер: US20190157173A1
Автор: Danny Koh Cher Hau, Morban Norliza, Poh Yong Chern, Saw Khay Chwan, Vincent Yeo Si Hao
Принадлежит:

A first packaged semiconductor device is provided. The first packaged semiconductor device includes a first semiconductor die having a first terminal, a first electrically conductive lead that is electrically connected to the first terminal, and a first electrically insulating mold compound that encapsulates the first semiconductor die and exposes an end portion of the first lead at an outer surface of the first mold compound. A conductive track is formed in the outer surface of the first mold compound. Forming the conductive track includes activating a portion of the outer surface of the first mold compound for an electroless plating process, and performing the electroless plating process so as to form an electrically conductive material only within the activated portion of the outer surface of the first mold compound. 1. A method of forming a semiconductor package , the method comprising:providing a first packaged semiconductor device, the first packaged semiconductor device comprising a first semiconductor die comprising a first terminal, a first electrically conductive lead that is electrically connected to the first terminal, and a first electrically insulating mold compound that encapsulates the first semiconductor die and exposes an end portion of the first lead at an outer surface of the first mold compound; and activating a portion of the outer surface of the first mold compound for an electroless plating process; and', 'performing the electroless plating process so as to form an electrically conductive material only within the activated portion of the outer surface of the first mold compound., 'forming a conductive track in the outer surface of the first mold compound, wherein forming the conductive track comprises2. The method of claim 1 , wherein activating a portion of the outer surface of the first mold compound comprises forming a recessed channel in the outer surface of the mold compound claim 1 , and wherein performing the electroless plating ...

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Номер записи: 59
21-05-2020 дата публикации

AUTOMATED TOOL DATA GENERATION IN AUTOMATED ASSET MANAGEMENT SYSTEMS

Номер: US20200160053A1
Автор: CHWAN Joseph, Fly David C., KASSOUF Thomas L., Lipsey Matthew J., LOBO Andrew R., NEWPORT Jason, PHILLIPS Preston C., Rogers Frederick J., RYAN Sean W.
Принадлежит:

An asset management system automatically generates and updates tool data stored in and used by the system for determining the presence or absence of tools or other inventory objects in the systems. The tool data can be automatically generated when a tool is newly added to the automated asset management system, and can be updated if and when characteristics of the tool and/or automated asset management system change. The automatic generation and updating includes automatically recognizing unique identifiers of tags located on inventory objects, automatically identifying an inventory object to associate with each unique identifier, and automatically populating a database to store each unique identifier in association with stored data for the corresponding inventory object. 1. An automated asset management system comprising:a plurality of storage locations for storing a plurality of objects, wherein the plurality of objects include at least one of a common object, and wherein the plurality of storage locations include at least two storage locations having an substantially identical shape for fittingly receiving the common object;a camera configured to generate images used to determine presence or absence of the objects; a unique identifier encoded on a tag of each object; and', 'an image attribute of each of the storage locations and information pre-designating, for the at least one of the common object, one of the at least two storage locations having the substantially identical shape;, 'a database storinga processor; anda non-transitory machine readable recording medium storing program instructions which, when executed by the processor, cause the processor to perform a process that includes:performing, using the camera of the automated asset management system, a scan of the storage locations while the at least one of the common object is stored in the other of the at least two storage locations having the substantially identical shape;determining, based on an image ...

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Номер записи: 60
23-06-2016 дата публикации

SPACE-TIME SEPARATED AND JOINTLY EVOLVING RELATIONSHIP-BASED NETWORK ACCESS AND DATA PROTECTION SYSTEM

Номер: US20160182486A1
Автор: HAWKINS Myers, Irwin J. David, LAST David Charles, SUN Hao, Wu Chwan-Hwa
Принадлежит:

A network security system that employs space-time separated and jointly-evolving relationships to provide fast network access control, efficient real-time forensics capabilities, and enhanced protection for at-rest data in the event of a network breach. The network security system allows, in part, functionality by which the system accepts a request by a user to access the data stored in the database, identifies a sequence of security agents to participate in authenticating and protecting the access of the data by the user, generates a sequence of pseudorandom IDs and space-time varying credentials, checks at each one of the security agents a corresponding one of the credentials, determines that the user is permitted to access the data using access control logs if all the security agents accept the corresponding credentials, and varies the credentials based on a space-time relationship. 130.-. (canceled)31. A system for protecting a data file stored in a cloud based storage system , comprising: authenticating a synchronous password received by a plurality of computing devices, a first portion of the synchronous password being received by one of the plurality of computing devices, and a second portion of the synchronous password being received by another of the plurality of computing devices;', 'encrypting a selected data file using a key determined through the use of a space-time jointly evolving function generated by one of the plurality of computing devices;', 'splitting the selected data file into a plurality of file fragments;', 'storing each of the plurality of file fragments in a random location on the plurality of computing devices; and', 'generating an index file that includes a file storage path for each file fragment and a security key for each file fragment, the index file configured to be used to merge the plurality of file fragments into the selected data file., 'computer-executable software code stored on one or more non-transitory data storage devices ...

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Номер записи: 61
13-06-2019 дата публикации

INTELLIGENT POWER MODULE OPERABLE TO BE DRIVEN BY NEGATIVE GATE VOLTAGE

Номер: US20190181849A1
Автор: HSU Fu-Jen, Hung Chien-Chung, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит:

An intelligent power component module operable to be driven by a negative gate voltage integrates a wide bandgap semiconductor power unit, an adjustment unit and a driving unit so as to adjust a voltage level of the driving unit by the adjustment unit. Accordingly, the wide bandgap semiconductor power unit, in a driven state, comprises a driving voltage level alternating between a positive and a negative voltage. 1. An intelligent power component module operable to be driven by a negative gate voltage , comprising:an upper bridge circuit, comprising a first driving unit and a first wide bandgap semiconductor power unit electrically connected to the first driving unit, the first wide bandgap semiconductor power unit having a first drain terminal, a first gate terminal and a first source terminal;a lower bridge circuit, comprising a second driving unit and a second wide bandgap semiconductor power unit electrically connected to the second driving unit, the second wide bandgap semiconductor power unit having a second drain terminal electrically connected to the first source terminal of the first wide bandgap semiconductor power unit, a second gate terminal and a second source terminal;a first adjustment unit, comprising a first resistor electrically connected to the first driving unit and a first Zener diode electrically connected to the first resistor, the first Zener diode electrically connected to a first output node between the first source terminal of the first wide bandgap semiconductor unit and the second drain terminal of the second wide bandgap semiconductor power unit, and a first high side of the first driving unit; anda second adjustment unit, comprising a second resistor electrically connected to the second driving unit and a second Zener diode, the second Zener diode electrically connected to the second source terminal of the second wide bandgap semiconductor power unit and a first low side of the second driving unit;wherein, voltage levels of the first ...

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Номер записи: 62
16-07-2015 дата публикации

METAL-AND-RESIN COMPOSITE AND METHOD FOR MAKING THE SAME

Номер: US20150197048A1
Автор: CHIANG CHWAN-HWA, WANG CHIEH-HSIANG, ZHANG BAO-SHEN
Принадлежит:

A metal-and-resin composite includes a metal substrate, an anodic oxide layer defining nano pores formed on the substrate, an intermediate layer including coupling agent formed on the surface of the anodic oxide layer, and a resin article covering and coupled to the intermediate layer. 1. A metal-and-resin composite comprising:a metal substrate;an anodic oxide layer formed on the metal substrate, the anodic oxide layer defining nano pores;an intermediate layer comprising a coupling agent formed on the surface of the anodic oxide layer; anda resin article coupled to the intermediate layer.2. The metal-and-resin composite as claimed in claim 1 , wherein the intermediate layer has a thickness of about 0.5 nm to about 10 nm.3. The metal-and-resin composite as claimed in claim 1 , wherein the coupling agent is titanate coupling agent claim 1 , aluminate coupling agent claim 1 , zirconate coupling agent claim 1 , aluminium-titanium compound coupling agent claim 1 , boric acid ester coupling agent claim 1 , or sulfonic acid coupling agent.4. The metal-and-resin composite as claimed in claim 1 , wherein the nano pores have a diameter of about 5 nm to about 25 nm and a depth of about 1 μm to about 9 μm.5. The metal-and-resin composite as claimed in claim 1 , wherein the anodic oxide layer has a thickness of about 1 μm to about 9 μm claim 1 , and oxygen atoms distributing on the surface of the anodic oxide layer have a weight percentage of about 35% to about 50%.6. The metal-and-resin composite as claimed in claim 1 , wherein bond between the resin article and the intermediate layer comprises chemical bondings.7. The metal-and-resin composite as claimed in claim 1 , wherein the resin article is made of polybutylene terephthalate claim 1 , polyphenylene sulfide claim 1 , polyethylene terephthalate claim 1 , polyetheretherketone claim 1 , polycarbonate claim 1 , or polyvinyl chloride polymer.8. The metal-and-resin composite as claimed in claim 1 , wherein the resin of the resin ...

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Номер записи: 63
06-07-2017 дата публикации

Genetically Modified Microorganism For Producing medium-chain lauric acid and/or dodecanedioic acid And Method of Using Thereof

Номер: US20170191092A1
Автор: CHEN Ya-Wen, HSIAO Chwan-Deng, HSIEH Hsin-Ju, LEE Cheng-Chung, Lin Yu-Ju, WANG Hwei-Jiung
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Described herein are genetically-modified microorganisms for producing medium chain lauric acid and/or dodecanedioic acid and methods of using the microorganisms. The microorganisms contain a nucleic acid encoding an lauroyl ACP-thioesterase (BTE) operably linked to a promoter. 1Umbellularia californica. A genetically modified microorganism , comprising a nucleic acid encoding an lauroyl ACP-thioesterase (BTE) operably linked to a promoter , wherein the microorganism produces an increased amount of medium-chain lauric acid and/or dodecanedioic acid as compared to the unmodified parent of the microorganism.2Umbellularia californicaUmbellularia californica. The genetically modified microorganism of claim 1 , wherein the lauroyl ACP-thioesterase (BTE) is a modified lauroyl ACP-thioesterase (BTE).3Umbellularia californicaUmbellularia californica. The genetically modified microorganism of claim 2 , wherein the modified lauroyl ACP-thioesterase (BTE) comprises residues 17-283 of a wild-type lauroyl ACP-thioesterase (BTE).4Umbellularia californica. The genetically modified microorganism of claim 3 , wherein the modified lauroyl ACP-thioesterase (BTE) further comprises a C-terminal His-tag fusion.5Umbellularia californicaUmbellularia californica. The genetically modified microorganism of claim 2 , wherein the modified lauroyl ACP-thioesterase (BTE) comprises residues 17-295 of a wild-type lauroyl ACP-thioesterase (BTE).6Umbellularia californica. The genetically modified microorganism of claim 5 , wherein the modified lauroyl ACP-thioesterase (BTE) further comprises a C-terminal His-tag fusion.7Umbellularia californicaUmbellularia californica. The genetically modified microorganism of claim 2 , wherein the modified lauroyl ACP-thioesterase (BTE) consists of residues 17-283 of a wild-type lauroyl ACP-thioesterase (BTE) and a C-terminal His-tag fusion.8Umbellularia californica. The genetically modified microorganism of claim 7 , wherein residue 124 of the wild-type lauroyl ACP ...

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Номер записи: 64
27-06-2019 дата публикации

METAL-AND-RESIN COMPOSITE AND METHOD FOR MAKING THE SAME

Номер: US20190193370A1
Автор: CHIANG CHWAN-HWA, WANG CHIEH-HSIANG, ZHANG BAO-SHEN
Принадлежит:

A method for making a metal-and-resin composite, including: providing a metal substrate made of stainless steel; forming a plurality of nano pores on a surface of the metal substrate by chemical etching the metal substrate; forming an intermediate layer on the metal substrate by dipping the metal substrate in a coupling agent solution, the intermediate layer filling at least portion of each nano pore; and forming a resin member by placing the metal substrate in a mold and molding molten resin on a surface of the intermediate layer, the resin member covering and bonding with the intermediate layer, treating the metal substrate with a coupling solution having a silane compound coupling agent to make the intermediate layer. 1. A method for making a metal-and-resin composite , comprising:providing a metal substrate, the metal substrate being made of stainless steel;forming a plurality of nano pores on a surface of the metal substrate by chemical etching the metal substrate;forming an intermediate layer on the metal substrate by dipping the metal substrate in a coupling agent solution, the intermediate layer filling at least portion of each of the nano pores;forming a resin member placing the metal substrate in a mold and molding molten resin on a surface of the intermediate layer, the resin member covering and bonding with the intermediate layer; andtreating the metal substrate with a coupling solution having a silane compound coupling agent to make the intermediate layer.2. The method as claimed in claim 1 , the method of forming the intermediate layer comprises dipping the metal substrate in the coupling agent solution having a concentration of approximately 10 ml/L to approximately 100 ml/L and a temperature of approximately 25° C. to approximately 100° C. for approximately 1 second to approximately 5 minutes claim 1 , a thickness of the intermediate layer is in a range of approximately 0.5 nm to approximately 10 nm.3. The method as claimed in claim 1 , wherein the ...

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Номер записи: 65
02-10-2014 дата публикации

HOUSING AND ELECTRONIC DEVICE USING THE SAME

Номер: US20140295115A1
Автор: CHIANG CHWAN-HWA, WANG CHIEH-HSIANG
Принадлежит:

A housing includes a substrate and a decorative layer deposited on the substrate. The decorative layer includes chromium, iron, aluminum, chromium oxide, ferric oxide, and aluminum oxide. The chromium oxide, ferric oxide, and aluminum oxide distribute evenly among the chromium, iron, and aluminum respectively, such that the chromium, iron, and aluminum atoms are separated from each other. The decorative layer is electrically non-conductive and electromagnetically transmissive and gives the housing a mirror-like black and metallic appearance. An electronic device using the housing is also described. 1. A housing , comprising:a substrate; anda decorative layer disposed on the substrate;wherein the decorative layer comprises chromium, iron, aluminum, chromium oxide, ferric oxide, and aluminum oxide; the chromium oxide, ferric oxide, and aluminum oxide distribute among the chromium, iron, and aluminum respectively to separate the atoms of chromium, iron, or aluminum from each other in the decorative layer.2. The housing as claimed in claim 1 , wherein in the decorative layer claim 1 , the chromium has a total mass percentage of about 19% to about 20% claim 1 , the iron has a total mass percentage of about 68% to about 71% claim 1 , the aluminum has a total mass percentage of about 4% to about 5% claim 1 , and oxygen has a total mass percentage of about 4% to about 5%.3. The housing as claimed in claim 2 , wherein the decorative layer has a thickness of about 30 nm to about 100 nm.4. The housing as claimed in claim 3 , wherein the color value of the decorative layer has an L* coordinate between 53 and 57 claim 3 , an a* coordinate between −0.5 and 1 claim 3 , and a b* coordinate between −0.8 and 1 in the CIE LAB color system.5. The housing as claimed in claim 1 , further comprising a top paint layer formed on the decorative layer claim 1 , the top paint layer is transparent claim 1 , and has a thickness of about 10 μm to about 30 μm.6. The housing as claimed in claim 5 , ...

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Номер записи: 66
29-07-2021 дата публикации

WATERPROOF THERMOMETER FOR MONITORING FOOD TEMPERATURES DURING COOKING PROCESS

Номер: US20210231503A1
Автор: LIN Mendel, WU Chwan-Chia
Принадлежит: GRANDEX INTERNATIONAL CORPORATION

A waterproof thermometer for monitoring a food temperature during a cooking process includes a rechargeable battery for supplying power, a thermal sensor for measuring the food temperatures, and a processing unit for wirelessly transmitting data via an antenna. The waterproof thermometer further includes a first conductive part for containing the thermal sensor, the processing unit, and the rechargeable battery, a first insulating part for containing the antenna, a second insulating part, and a second conductive part. The first insulating part is surrounded by the second insulating part, and separated from the second insulating part by an air filled gap. The first conductive part, the first insulating part and the second conductive part form a first hermetic shell for providing waterproof function. The first conductive part, the second insulating part, and the second conductive part form a second hermetic shell for providing protection to the first insulating part from being damaged. 1. A waterproof thermometer for monitoring food temperatures during a cooking process , comprising: a battery; and', 'a circuit board, configured to be electrically connected to the battery, and comprising at least one thermal sensor and a processing unit; wherein the thermal sensor is configured to measure the food temperatures, and the processing unit is electrically connected to the thermal sensor; and, 'a first portion, comprisinga second portion, comprising an antenna; wherein the second portion is connected to the first portion, and the antenna is electrically connected to the processing unit of the circuit board;wherein the processing unit is configured to convert the food temperatures measured by the thermal sensor to thermometer data and wirelessly transmit the thermometer data via the antenna;wherein the second portion further comprises a two-layer shell which forms a moisture barrier to prevent water from entering the waterproof thermometer.2. The waterproof thermometer as ...

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Номер записи: 67
20-07-2017 дата публикации

SILICON CARBIDE SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF

Номер: US20170207305A1
Автор: Huang Yao-Feng, Hung Chien-Chung, HUNG Hsiang-Ting, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит:

A silicon carbide (SiC) semiconductor element includes a semiconductor layer, a dielectric layer on a surface of the semiconductor layer, a gate electrode layer on the dielectric layer, a first doped region, a second doped region, a shallow doped region and a third doped region. The semiconductor layer is of a first conductivity type. The first doped region is of a second conductivity type and includes an upper doping boundary spaced from the surface by a first depth. The shallow doped region is of the second conductivity type, and extends from the surface to a shallow doped depth. The second doped region is adjacent to the shallow doped region and is at least partially in the first doped region. The third doped region is of the second conductivity type and at least partially overlaps the first doped region. 1. A silicon carbide (SiC) semiconductor element , comprising:a semiconductor layer of a first conductivity type, the semiconductor layer made of SiC and comprising a surface;a dielectric layer on the semiconductor layer;a gate electrode layer on the dielectric layer;{'b': '1', 'a first doped region of a second conductivity type opposite the first conductivity type, the first doped region being in the semiconductor layer and comprising an upper doping boundary spaced from the surface of the semiconductor layer by a first depth D;'}a shallow doped region of the second conductivity type, the shallow doped region being in the semiconductor layer and extending from the surface to a shallow doped depth dl;a second doped region of the first conductivity type, the second doped region being adjacent to the shallow doped region and at least partially located in the first doped region; anda third doped region of the second conductivity type, the third doped region being adjacent to the second doped region and at least partially overlapping the first doped region.21. The SiC semiconductor element of claim 1 , wherein the shallow doped region has a doping concentration ...

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Номер записи: 68
16-08-2018 дата публикации

AUTOMATED TOOL DATA GENERATION IN AUTOMATED ASSET MANAGEMENT SYSTEMS

Номер: US20180232577A1
Автор: CHWAN Joseph, Fly David C., KASSOUF Thomas L., Lipsey Matthew J., LOBO Andrew R., NEWPORT Jason, PHILLIPS Preston C., Rogers Frederick J., RYAN Sean W.
Принадлежит:

An asset management system automatically generates and updates tool data stored in and used by the system for determining the presence or absence of tools or other inventory objects in the systems. The tool data can be automatically generated when a tool is newly added to the automated asset management system, and can be updated if and when characteristics of the tool and/or automated asset management system change. The automatic generation and updating includes automatically recognizing unique identifiers of tags located on inventory objects, automatically identifying an inventory object to associate with each unique identifier, and automatically populating a database to store each unique identifier in association with stored data for the corresponding inventory object. 1. An automated asset management system comprising:a plurality of storage locations for storing objects;an image-based sensing system configured to generate images used to determine presence or absence of objects configured to be stored in the plurality of storage locations;a database storing data relating to the objects configured to be stored in the plurality of storage locations, wherein the database stores data sufficient to enable the asset management system to determine the presence or absence of the objects from the storage locations based on the images generated by the image-based sensing system;a processor; and performing using the image-based sensing system a first scan of the storage locations while a particular storage location associated with a particular object subject to the tool training is empty, and storing an image attribute of the particular storage location while the particular storage location is empty,', 'performing using the image-based sensing system a second scan of the storage locations while the particular storage location associated with the particular object subject to the tool training is occupied by the particular object, and storing an image attribute of the ...

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Номер записи: 69
31-08-2017 дата публикации

SILICON CARBIDE SEMICONDUCTOR DEVICE

Номер: US20170250275A1
Автор: Hung Chien-Chung, Lee Chwan-Ying, Yen Cheng-Tyng
Принадлежит:

The present invention is related to a silicon carbide semiconductor device which employs a silicon carbide substrate to form an integrated device. The integrated device of the present invention comprises a metal oxide semiconductor field-effect transistor (MOSFET) and an integrated junction barrier Schottky (JBS) diode in an anti-parallel connection with the MOSFET. 1. A silicon carbide semiconductor device , comprising:an n-type heavily doped substrate;an n-type drift layer disposed on the substrate, having a first doping concentration;a plurality of doped regions disposed and spaced apart in the n-type drift layer, wherein a first junction field-effect region is formed between the doped regions, and each of the doped region comprises a p-type well, an n-type heavily doped region disposed in the p-type well, a plurality of p-type heavily doped regions abutting the n-type heavily doped region and overlapping with a portion of the p-type well, and at least one second junction field-effect region enclosed by the p-type well;a gate dielectric disposed on the n-type drift layer;a gate electrode disposed on the gate dielectric;an interlayer dielectric disposed on the gate dielectric and the gate electrode;a plurality of source openings passing through the interlayer dielectric and the gate dielectric until a portion of the n-type heavily doped region and a portion of the p-heavily doped region are reached;a plurality of junction openings passing through the interlayer dielectric and the gate dielectric until the second junction field-effect region, a portion of the p-type well and a portion of the p-type heavily doped region are reached;a plurality of gate openings passing through the interlayer dielectric to the gate electrode;a first metal layer disposed at the bottom side of the source opening to form an ohmic contact with a portion of the n-type heavily doped region and a portion of the p-type heavily doped region; anda second metal layer comprising a first portion ...

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Номер записи: 70
27-11-2014 дата публикации

BATTERY MONITORING IN A NETWORKED INVENTORY CONTROL SYSTEM

Номер: US20140350716A1
Автор: CHWAN Joseph, Fly David C., Lipsey Matthew J., NEWPORT Jason, PHILLIPS Preston C., Roger Frederick J.
Принадлежит: Snap-on Incorporated

An inventory control device, such as an electronic toolbox, monitors the identity of battery packs that are mounted in the device and used to provide electrical power to the device. The device retrieves a unique identifier for each battery pack, and monitors the operation of each battery pack. The monitored data can be logged into memory for future use, communicated to a user of the inventory control device, and/or used to predict the future performance or replacement date for a battery pack. The monitored data can also be communicated across a communication network to an inventory control server that monitors the operation and performance of battery packs throughout an electronic tools control system including multiple toolboxes. The server can further track the operation and locations of battery packs through all of the toolboxes. 1. An inventory control device comprising:a plurality of storage locations configured to store inventory items;a processor and sensing device configured to determine the presence or absence of inventory items in the plurality of storage locations;a power source comprising at least one battery pack operative to provide electrical power to the processor and the sensing device; anda power source controller configured to control the power source to provide the electrical power to the processor and the sensing device, retrieve, from each of the at least one battery pack, an identifier uniquely identifying the battery pack;', 'monitor the operation of each of the at least one battery pack; and', 'store in memory data indicative of the monitored operation of each of the at least one battery pack in association with the retrieved unique identifier for the battery pack., 'wherein the power source controller is configured to perform functions to2. The device of claim 1 , wherein the at least one battery pack includes rechargeable batteries.3. The device of claim 1 , further comprising:a display screen configured to display information to a user of ...

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Номер записи: 71
15-08-2019 дата публикации

THERMOMETER AND TEMPERATURE MONITORING SYSTEM

Номер: US20190250043A1
Автор: LIN Mendel, WU Chwan-Chia
Принадлежит:

A temperature monitoring system includes a thermometer and a first communication device. The thermometer counts a monitoring time, executes a measuring procedure to acquire a first temperature value and a second temperature value to determine whether to wirelessly broadcast a temperature information signal, and executes a time interval producing procedure after the measuring procedure to determine a time interval and to determine whether the measuring procedure is terminated. The first communication device receives the temperature information signal from the thermometer. The user may remotely monitor the temperature of a monitored object through the first communication device. 1. A thermometer , comprising:a first sensing unit configured to sense an internal temperature of a monitored object to produce a first temperature value;a second sensing unit configured to sense an ambient temperature external to the monitored object to produce a second temperature value;an antenna; load the first previous temperature value and the second pervious temperature from the memory;', 'acquire the first temperature value and the second temperature value from the first sensing unit and the second sensing unit;', 'produce and wirelessly broadcast a temperature information signal when the difference between the first temperature value and the first previous temperature value exceeds a first threshold value or when the difference between the second temperature value and the second pervious temperature exceeds a second threshold value, otherwise exit the measuring procedure;', 'after broadcasting the temperature information signal store the first temperature value and the second temperature value in the memory to respectively replace the first previous temperature value and the second previous temperature value in the memory, and then exit the measuring procedure;, 'a wireless communication unit configured to be electrically connected to the first sensing unit, the second sensing unit, ...

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Номер записи: 72
21-09-2017 дата публикации

ENABLING COMMUNICATION BETWEEN AN INVENTORY CONTROL SYSTEM AND A REMOTE SYSTEM OVER A NETWORK

Номер: US20170270733A1
Автор: Chwan, Fly David C., JR. Joseph, Lipsey Matthew J., Phillips Preston, Rogers Frederick J.
Принадлежит:

The instant application describes an inventory control system including an object storage device including a drawer or a tray for housing objects; a sensing device configured to acquire an image including information about the objects stored in the object storage device; an interface circuitry in communication with the sensing device and configured to generate object data based on the image acquired by the sensing device; and a processor configured to provide an integrated network access and transmit the object data across a network using a Web Service as defined by World Wide Web Consortium (W3C), the Web Service being a data link interface between the inventory control system and a remote system.

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Номер записи: 73
08-10-2015 дата публикации

SEMICONDUCTOR STRUCTURE

Номер: US20150287818A1
Автор: BAKOWSKI Mietek, Hung Chien-Chung, Lee Chwan-Ying, Reshanov Sergey, Schöner Adolf, Yen Cheng-Tyng
Принадлежит:

A semiconductor structure comprising a substrate, a drift layer, at least a doping region, an epitaxial channel, a gate oxide layer, a gate metal and an isolation layer is provided. The drift layer is disposed on the substrate. The doping region comprises a p-well region, an n+ region and a p+ region, wherein the n+ region and a portion of p+ region are disposed in the p-well region which is adjacent to the n+ region. The epitaxial channel is disposed over the drift layer and covers at least a portion of the n+ region. The epitaxial channel is composed of at least two epitaxial layers whose conduction types or doping concentrations are not identical. The gate oxide layer is disposed on the epitaxial channel. The gate metal is disposed on the gate oxide layer. The isolation layer is disposed on the gate metal and the gate oxide layer. 1. A semiconductor structure , comprising:a substrate;a drift layer disposed on the substrate, wherein the substrate and the drift layer is n-type conduction; a p-well region;', 'an n+ region disposed in the p-well region;', 'a p+ region adjacent to the n+ region, wherein at least a portion of the p+ region is disposed in the p-well region;, 'a plurality of doping regions intervally disposed in the drift layer and a plurality of junction field effect transistor (JFET) regions formed between the doping regions, wherein each of the doping regions comprisesan epitaxial channel disposed over the drift layer and covering at least a portion of the n+ region, wherein the epitaxial channel is composed of at least two epitaxial layers, and the conduction types or doping concentrations of the epitaxial layers are not identical;a gate oxide layer disposed on the epitaxial channel;a gate metal disposed on the gate oxide layer; andan isolation layer disposed on the gate metal and the gate oxide layer.2. The semiconductor structure according to claim 1 , wherein the epitaxial channel comprises a first epitaxial layer and a second epitaxial layer ...

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Номер записи: 74
16-12-2021 дата публикации

Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Package

Номер: US20210391298A1
Автор: Chiang Chau Fatt, Macheiner Stefan, Saw Khay Chwan, Yong Wae Chet
Принадлежит:

A packaged semiconductor includes an electrically insulating encapsulant body having an upper surface, a first semiconductor die encapsulated within the encapsulant body, the first semiconductor die having a main surface with a first conductive pad that faces the upper surface of the encapsulant body, a second semiconductor die encapsulated within the encapsulant body and disposed laterally side by side with the first semiconductor die, the second semiconductor die having a main surface with a second conductive pad that faces the upper surface of the encapsulant body, and a first conductive track that is formed in the upper surface of the encapsulant body and electrically connects the first conductive pad to the second conductive pad. The encapsulant body includes a laser activatable mold compound. 1. A packaged semiconductor device , comprising:an electrically insulating encapsulant body comprising an upper surface;a first semiconductor die encapsulated within the encapsulant body, the first semiconductor die comprising a main surface with a first conductive pad that faces the upper surface of the encapsulant body;a second semiconductor die encapsulated within the encapsulant body and disposed laterally side by side with the first semiconductor die, the second semiconductor die comprising a main surface with a second conductive pad that faces the upper surface of the encapsulant body;a first conductive track that is formed in the upper surface of the encapsulant body and electrically connects the first conductive pad to the second conductive pad; anda protective layer disposed over the first conductive track,wherein the encapsulant body comprises a laser activatable mold compound;wherein the first conductive track is formed in a first laser activated region of the laser activatable mold compound,wherein the protective layer comprises an electrically insulating material different from the laser activatable mold compound,wherein the protective layer contacts and ...

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Номер записи: 75
22-10-2015 дата публикации

ENTEROCOCCUS FAECIUM EF08 STRAIN, A USE, A FEED ADDITIVE AND A FEED THEREOF

Номер: US20150297647A1
Автор: HSU Tien-Ken, LEE Ting-Yu, LIN Jin-Seng, WANG CHIH-HSUAN, YANG Lian-Chwan, YU Bi
Принадлежит:

An EF08 strain for manufacturing a feed additive is disclosed. The EF08 strain is deposited at Bioresource Collection and Research Center of Taiwan with deposit number BCRC 910525. Also, the EF08 strain is deposited at CGMCC-China General Microbiological Culture Collection with deposit number CGMCC 5549. Moreover, the EF08 strain has a 16S rDNA sequence as set forth as SEQ ID NO: 1. 1Enterococcus faecium. An EF08 strain , deposited at Bioresource Collection and Research Center of Taiwan with deposit number BCRC 910525 , deposited at CGMCC-China General Microbiological Culture Collection with deposit number CGMCC 5549 , and with a 16S rDNA sequence as set forth as SEQ ID NO: 1.2. A use of the EF08 strain described in claim 1 , wherein the EF08 strain is used to manufacture a feed additive for terrestrial economic animals.3. The use according to claim 2 , wherein the EF08 strain is incorporated into a feed for the terrestrial economic animals at dosages of 10-10CFU/per gram of the feed.4. A use of the EF08 strain described in claim 1 , wherein the EF08 strain is used to enhance secretion of IL-10 claim 1 , TNF-α claim 1 , IL-12p40 and IFN-γ.5Escherichia coliSalmonella typhimurium.. A use of the EF08 strain described in claim 1 , wherein the EF08 strain is used to suppress growth of and6. A feed additive comprising the EF08 strain described in claim 1 , wherein the feed additive comprises the EF08 strain at concentrations of 10-10CFU/per gram of the feed additive.7LactobacillusLactobacillus plantarumLactobacillus acidophilus. The feed additive according to claim 6 , wherein the feed additive further comprises a strain selected from a group consisting of a LP28 strain and a LASW strain claim 6 , wherein the LP28 strain is deposited at CGMCC-China General Microbiological Culture Collection with deposit number CGMCC 3346 claim 6 , and wherein the LASW strain is deposited at CGMCC-China General Microbiological Culture Collection with deposit number CGMCC M204083. ...

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Номер записи: 76
20-10-2016 дата публикации

Automated asset management system with multiple sensing technologies

Номер: US20160307150A1
Автор: Andrew R. Lobo, David C. Fly, Frederick J. Rogers, Jason NEWPORT, Joseph Chwan, Matthew J. Lipsey, Preston C. PHILLIPS
Принадлежит: Snap On Inc

An automated asset management system includes a plurality of storage locations for storing objects, and first and second sensing subsystems each configured to sense presence or absence of the objects in the plurality of storage locations. The first and second sensing subsystems are used to sense the presence or absence of a same particular object using different respective sensing modalities. In operation, a first scan of the storage locations is performed using the first sensing subsystem, and the presence or absence of the particular object is determined using the first sensing modality. In turn, a second scan of the storage locations is performed using the second sensing subsystem, and the presence or absence of the particular object is confirmed using both the result of the determination made using the first sensing modality and a determination of the presence or absence of the particular object using the second sensing modality.

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Номер записи: 77
10-11-2016 дата публикации

HOUSING, ELECTRONIC DEVICE USING SAME AND METHOD FOR MAKING SAME

Номер: US20160327981A1
Автор: CHIANG CHWAN-HWA, TAI CHEN-YI, WANG CHIEH-HSIANG, ZHANG BAO-SHEN
Принадлежит:

A housing includes a main portion and at least one insulating portion. The main portion includes two portions, an inner surface and an outer surface opposite to the inner surface. The inner surface defines at least one groove. The outer surface defines at least one gap that is coupled to the at least one groove. The at least one insulating portion is corresponding to the at least one groove and each insulating portion is filled in one groove. The two portions of the main portion are positioned at two sides of the at least one gap and the two portions are insulated by the at least one gap and the at least one insulating portion. 1. A housing comprising:a main portion comprising two portions, an inner surface defining at least one groove, and an outer surface opposite to the inner surface, the outer surface defining at least one gap that is coupled to the at least one groove; andat least one insulating portion corresponding to the at least one groove, each insulating portion filled in one groove;wherein the two portions of the main portion are positioned at two sides of the at least one gap and the two portions are insulated by the at least one gap and the at least one insulating portion.2. The housing of claim 1 , wherein the main portion comprises two opposite first end walls and two opposite second end walls claim 1 , the at least one groove is defined on the two first end walls or the two second end walls.3. The housing of claim 1 , wherein each gap has a width of about 10 μm to about 100 μm claim 1 , and a depth of the gap from the outer surface of the main portion to the inner surface is about 10 μm to about 50 μm.4. The housing of claim 1 , wherein each groove comprises two sidewalls and a bottom wall perpendicularly connected between the two sidewalls claim 1 , the gap is defined at a junction between the bottom wall and one sidewall.5. The housing of claim 4 , wherein a metallic layer is formed on the sidewalls and the bottom wall claim 4 , a surface of the ...

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Номер записи: 78
09-11-2017 дата публикации

SYSTEM AND METHOD FOR PREEMPTIVE SELF-HEALING SECURITY

Номер: US20170324555A1
Автор: Hou Daoqi, Irwin J. David, Wu Chwan-Hwa
Принадлежит: AUBURN UNIVERSITY

The present system and method allow for preemptive, self-healing computer security. The system includes a user device processor and a PSS server processor. The two processors perform an initial Data Structure & Key Mutation (DSKM) method and an interval DSKM method at a given interval to protect secret information and prevent its exposure by attackers. When a user requests a site or service that is an attractive target for attackers, such as a bank site or monetary transfer service, the processors perform a Man in the Browser attack prevention method. When a packet is received or generated, the processors perform a Deep Protocol and Stateful Inspection and Prevention method to prevent receipt of malicious packets or the loss of sensitive information. Various forensics modules allow accurate forensic examination of the type, scope, and method of attack, as well as real-time protection of cloud-based services. 1. A method for preemptive , self-healing computer security , comprising:performing an initial Data Structure & Key Mutation (DSKM) method;performing an interval DSKM method at a given interval;performing a Man in the Browser (MitB) attack prevention method when a user requests a predetermined site; andperforming a Deep Protocol and Stateful Inspection and Prevention (DPSI) method when a packet is received or generated.2. The method of claim 1 , wherein the initial DSKM method comprises:storing a plurality of client secrets on at least one of a plurality of user device tables, wherein the plurality of user device tables comprise at least a first user device table, a second user device table, a third user device table, and a fourth user device table;storing a plurality of network secrets on at least one of a plurality of PSS tables, wherein the plurality of PSS tables comprise at least a first PSS table, a second PSS table, a third PSS table, and a fourth PSS table;{'sub': 'DT1', 'encrypting the first user device table with a first device table Galois/Counter ...

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Номер записи: 79
08-10-2020 дата публикации

Chip to Lead Interconnect in Encapsulant of Molded Semiconductor Package

Номер: US20200321269A1
Автор: Chiang Chau Fatt, Saw Khay Chwan
Принадлежит:

A semiconductor package includes an electrically insulating first encapsulant body having an upper surface, a first semiconductor die encapsulated within the first encapsulant body, the first semiconductor die having a main surface with a first conductive pad that faces the upper surface of the first encapsulant body, a plurality of electrically conductive leads, each of the leads having interior ends that are encapsulated within the first encapsulant body and outer ends that are exposed from the first encapsulant body, and a first direct electrical connection between the first conductive pad and the interior end of a first lead from the plurality. The first direct electrical connection includes a first conductive track formed in the upper surface of the first encapsulant body. The first encapsulant body includes a laser activatable mold compound. The first conductive track is formed in a first laser activated region of the laser activatable mold compound. 1. A packaged semiconductor device , comprising:an electrically insulating first encapsulant body comprising an upper surface;a first semiconductor die encapsulated within the first encapsulant body, the first semiconductor die comprising a main surface with a first conductive pad that faces the upper surface of the first encapsulant body;a plurality of electrically conductive leads, each of the leads comprising interior ends that are encapsulated within the first encapsulant body and outer ends that are exposed from the first encapsulant body; anda first direct electrical connection between the first conductive pad and the interior end of a first lead from the plurality of electrically conductive leads,wherein the first direct electrical connection comprises a first conductive track that is formed in the upper surface of the first encapsulant body,wherein the first encapsulant body comprises a laser activatable mold compound, andwherein the first conductive track is formed in a first laser activated region of the ...

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Номер записи: 80
08-10-2020 дата публикации

Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Package

Номер: US20200321276A1
Автор: Chau Fatt Chiang, Khay Chwan Saw, Stefan Macheiner, Wae Chet YONG
Принадлежит: INFINEON TECHNOLOGIES AG

A packaged semiconductor includes an electrically insulating encapsulant body having an upper surface, a first semiconductor die encapsulated within the encapsulant body, the first semiconductor die having a main surface with a first conductive pad that faces the upper surface of the encapsulant body, a second semiconductor die encapsulated within the encapsulant body and disposed laterally side by side with the first semiconductor die, the second semiconductor die having a main surface with a second conductive pad that faces the upper surface of the encapsulant body, and a first conductive track that is formed in the upper surface of the encapsulant body and electrically connects the first conductive pad to the second conductive pad. The encapsulant body includes a laser activatable mold compound.

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Номер записи: 81
24-11-2016 дата публикации

HOUSING, ELECTRONIC DEVICE EMPLOYING SAME AND MANUFACTURE METHOD

Номер: US20160344090A1
Автор: CHIANG CHWAN-HWA, TAI CHEN-YI, WANG CHIEH-HSIANG, ZHANG BAO-SHEN
Принадлежит:

A housing used in an electronic device having an antenna, the housing includes a base and a non-conductive film. The base defines a slot corresponding to the antenna and forms a surface enclosing the slot. The non-conductive film is formed on a surface of the base, the non-conductive film is configured to be coupled to the antenna and insulated the antenna from the base. An electronic device employing the housing and a manufacture method of the housing are also provided. 1. A housing used in an electronic device having an antenna , the housing comprising:a base defining a slot corresponding to the antenna, the base forming a surface enclosing the slot; anda non-conductive film formed on a surface of the base, the non-conductive film configured to be coupled to the antenna and insulated the antenna from the base.2. The housing as claimed in claim 1 , wherein the slot is configured to receive the antenna.3. The housing as claimed in claim 2 , wherein the surface of the base enclosing the slot defines at least one groove claim 2 , the non-conductive film forms on a surface of the groove.4. The housing as claimed in claim 3 , wherein the antenna includes at least one inlay correspondingly coupled to the at least one groove claim 3 , the non-conductive film is sandwiched between the antenna and the surface enclosing the groove.5. The housing as claimed in claim 1 , wherein the housing is a frame claim 1 , the slot is defined throughout the frame claim 1 , the non-conductive film is filled in the slot to be coupled to and insulated from the frame.6. The housing as claimed in claim 5 , wherein a surface of the frame enclosing the slot defines at least one notch claim 5 , the antenna includes at least one inlay correspondingly coupled to the at least one notch claim 5 , the antenna is firmly coupled to and insulated from the frame by the non-conductive film.7. The housing as claimed in claim 1 , wherein a thickness of the non-conductive film is 5 micron to 5 millimeter.8. ...

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Номер записи: 82
30-11-2017 дата публикации

AUTOMATED ASSET MANAGEMENT SYSTEM WITH MULTIPLE SENSING TECHNOLOGIES

Номер: US20170344938A1
Автор: CHWAN Joseph, Fly David C., Lipsey Matthew J., LOBO Andrew R., NEWPORT Jason, PHILLIPS Preston C., Rogers Frederick J.
Принадлежит:

An automated asset management system includes a plurality of storage locations for storing objects, and first and second sensing subsystems each configured to sense presence or absence of the objects in the plurality of storage locations. The first and second sensing subsystems are used to sense the presence or absence of a same particular object using different respective sensing modalities. In operation, a first scan of the storage locations is performed using the first sensing subsystem, and the presence or absence of the particular object is determined using the first sensing modality. In turn, a second scan of the storage locations is performed using the second sensing subsystem, and the presence or absence of the particular object is confirmed using both the result of the determination made using the first sensing modality and a determination of the presence or absence of the particular object using the second sensing modality. 1. A method comprising:performing, using a first sensing subsystem, a first scan of a plurality of storage locations for storing objects in an automated asset management system having the first sensing subsystem configured to sense presence or absence of the objects in the plurality of storage locations;determining, based on a result of the first scan, presence or absence of at least one object in the plurality of storage locations using the first sensing subsystem;setting a parameter for a second scan of the plurality of storage locations based on the result of the first scan;performing the second scan of the plurality of storage locations, according to the parameter set based on the result of the first scan, to sense presence or absence of the objects in the plurality of storage locations; anddetermining, based on the result of the first scan and a result of the second scan, presence or absence of objects in the plurality of storage locations.2. The method of claim 1 , wherein the automated asset management system includes a second ...

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Номер записи: 83
05-11-2020 дата публикации

Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating

Номер: US20200350222A1
Автор: Danny Koh Cher Hau, Morban Norliza, Poh Yong Chern, Saw Khay Chwan, Vincent Yeo Si Hao
Принадлежит:

An electronic circuit includes a first packaged semiconductor device having a first semiconductor die including a first terminal, a first electrically conductive lead that is electrically connected to the first terminal, and a first electrically insulating mold compound that encapsulates the first semiconductor die and exposes an end portion of the first lead at an outer surface of the first mold compound. A conductive track is formed in the outer surface of the first mold compound. 1. An electronic circuit , comprising:a first packaged semiconductor device comprising a first semiconductor die comprising a first terminal, a first electrically conductive lead that is electrically connected to the first terminal, and a first electrically insulating mold compound that encapsulates the first semiconductor die and exposes an end portion of the first lead at an outer surface of the first mold compound; anda conductive track formed in the outer surface of the first mold compound.2. The electronic circuit of claim 1 , wherein the first electrically insulating mold compound comprises a multi-layer exterior compound comprising: a metallic ion containing layer claim 1 , a hydrophilic layer disposed on the metallic ion containing layer claim 1 , and a hydrophobic layer disposed on the hydrophilic layer.3. The electronic circuit of claim 2 , wherein the conductive track is formed in a recessed channel that is formed in the hydrophilic layer and the hydrophobic layer and extends to the metallic ion containing layer.4. The electronic circuit of claim 1 , wherein the first packaged semiconductor device further includes a second semiconductor die having a second terminal and a second electrically conductive lead claim 1 , the second terminal being electrically connected to the second lead claim 1 , wherein the first mold compound encapsulates the second semiconductor die and exposes an end portion of the second lead at the outer surface of the first mold compound claim 1 , wherein ...

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Номер записи: 84
05-12-2019 дата публикации

COMPOSITE AND METHOD FOR MANUFACTURING SAME

Номер: US20190366588A1
Автор: CHIANG CHWAN-HWA, TAI CHEN-YI, ZHENG ZENG-MAO
Принадлежит:

A composite object with more complete and stronger adhesion between the constituent parts includes a substrate and a plastic member formed on a surface of the substrate. The substrate can be made of memory metal. Nano-holes are formed on the surface of the substrate. The composite further includes a combining layer. The combining layer is positioned between the substrate and the plastic member. The nano-holes are at least partially filled with the combining layer, unfilled holes being filled with the plastic constituent in the molten state. The disclosure further provides a method for manufacturing the composite. 1. A composite comprising:a substrate made of a memory metal, the substrate comprising nano-holes on a surface of the substrate;a combining layer on the substrate, the nano-holes being partially filled with the combining layer; anda plastic member on the combining layer.2. The composite of claim 1 , wherein the nano-holes are irregular cavities claim 1 , and widths of the nano-holes vary in a range from several tens of nanometers to several hundreds of nanometers.3. The composite of claim 2 , wherein shapes of the nano-holes are substantially similar to honeycombs claim 2 , and the nano-holes are surrounded by irregular protrusions.4. The composite of claim 1 , wherein the memory metal is selected from Ti—Ni based memory alloys claim 1 , Cu-based memory alloy claim 1 , Fe-based memory alloy and Au—Cr alloys.5. The composite of claim 1 , wherein portions of the nano-holes that is not filled with the combining layer is filled with the plastic member.6. The composite of claim 1 , wherein the combining layer is made of alcohol amine reagents and nitroalkane reagents.7. A method for manufacturing a composite comprising:providing a substrate made of a memory metal;forming nano-holes on a surface of the substrate by acid treatment;forming a combining layer on the substrate by surface treatment of the surface of the substrate, and partially filling the nano-holes ...

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Номер записи: 85
05-12-2019 дата публикации

METAL AND PLASTIC COMPOSITE MATERIAL AND METHOD FOR MAKING SAME

Номер: US20190366603A1
Автор: CHIANG CHWAN-HWA, TAI CHEN-YI, ZHENG ZENG-MAO
Принадлежит:

A composite material includes a metal substrate, and a plastic member formed on a surface of the metal substrate. A material of the metal substrate is titanium or titanium alloys, and an acid treatment leaves nano-holes and protrusions on the surface of the metal substrate. The composite material further includes a combining layer between the metal substrate and the plastic member. The nano-holes are partially filled with the combining layer, the protrusions are partially surrounded by the combining layer. The disclosure further provides a method for making such composite material. 1. A composite material comprising:a metal substrate, a material of the metal substrate is selected from one of titanium and titanium alloys, nano-holes being formed on a surface of the metal substrate;a combining layer formed on the metal substrate, the nano-holes partially filled with the combining layer; anda plastic member formed on the combining layer.2. The composite material of claim 1 , wherein the nano-holes are irregular cavities claim 1 , and diameters of the nano-holes vary in a range from several tens of nanometers to several hundreds of nanometers.3. The composite material of claim 2 , wherein shapes of nano-holes are substantially like those in a honeycomb.4. The composite material of claim 2 , wherein protrusions accompany the nano-holes claim 2 , the protrusions are formed beside the nano-holes.5. The composite material of claim 2 , wherein protrusions accompany the nano-holes claim 2 , the protrusions are formed in the nano-holes.6. The composite material of claim 2 , wherein protrusions accompany the nano-holes claim 2 , the protrusions are formed at portions of the metal substrate other than the nano-holes and the protrusions.7. The composite material of claim 1 , wherein the titanium alloys are selected from a group consisting of TAD claim 1 , TA0 claim 1 , TA1 claim 1 , TA2 claim 1 , TA3 claim 1 , TA4 claim 1 , TA5 claim 1 , TA6 claim 1 , TA7 claim 1 , TA9 claim 1 , ...

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Номер записи: 86
05-12-2019 дата публикации

COMPOSITE AND METHOD FOR MAKING SAME

Номер: US20190368052A1
Автор: CHIANG CHWAN-HWA, TAI CHEN-YI, ZHENG ZENG-MAO
Принадлежит:

A composite toughened against chipping during machining and other operations includes a substrate and a coating layer includes a substrate and a coating layer. The substrate is titanium or titanium alloys. Nano-holes are formed on a surface of the substrate. The coating layer completely fills in the nano-holes and completely covers the surface of the substrate where the nano-holes are not formed. The disclosure further provides a method for making such composite. 1. A composite comprising:a substrate, wherein a material of the substrate being selected from one of titanium and titanium alloys;nano-holes formed on a surface of the substrate; anda coating layer covers the surface of the substrate, and the nano-holes are filled with the coating layer.2. The composite of claim 1 , wherein the nano-holes are irregular cavities claim 1 , diameters of the nano-hole vary in a range from several tens of nanometers to several hundreds of nanometers.3. The composite of claim 1 , wherein the shape of the nano-holes are similar to honeycomb structure.4. The composite of claim 1 , wherein protrusions accompany the nano-holes claim 1 , the protrusions are formed beside the nano-holes.5. The composite of claim 1 , wherein protrusions accompany the nano-holes claim 1 , the protrusions are formed in the nano-holes.601234567910234123469101112. The composite of claim 1 , wherein the titanium alloys can be selected from a group consisting of TAD claim 1 , TA claim 1 , TA claim 1 , TA claim 1 , TA claim 1 , TA claim 1 , TA claim 1 , TA claim 1 , TA claim 1 , TA claim 1 , TA claim 1 , TB claim 1 , TB claim 1 , TB claim 1 , TC claim 1 , TC claim 1 , TC claim 1 , TC claim 1 , TC claim 1 , TC claim 1 , TC claim 1 , TC and TC.7. The composite of claim 1 , wherein the coating layer is a nanometric ceramic coating layer.8. A method for making a composite comprising:providing a substrate, wherein the material of the substrate being selected from one of titanium and titanium alloys;forming nano- ...

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Номер записи: 87
19-12-2019 дата публикации

METHODS AND APPARATUS FOR FINISHING EDGES OF GLASS SHEETS

Номер: US20190381626A1
Автор: Chang Chwan-Yang, CHU TING-WEI, Hsu Chi-Cheng, HUANG CHENG-FENG, Shafrir Shai Negev, Tang Yuyin
Принадлежит:

A method for finishing an edge of a glass sheet comprises grinding the edge of the glass sheet with a grinding wheel. The glass sheet includes a first major surface, a second major surface substantially parallel to the first major surface, and the edge connecting the first and second major surfaces. The grinding produces a central edge portion and two chamfered edge portions connecting the central edge portion with the first and second major surfaces, respectively. The method further comprises polishing the central edge portion with at least one cup wheel rotated about a first axis substantially parallel with the first and second major surfaces of the glass sheet to polish the central edge portion, wherein an abrasive layer of the cup wheel comprises at least one of ferric oxide (FeO), silicon carbide (SiC), and ceric oxide (CeO). 1. A method for finishing an edge of a glass sheet , comprising:grinding the edge of the glass sheet with a grinding wheel, the glass sheet including a first major surface, a second major surface substantially parallel with the first major surface, and the edge connecting the first and second major surfaces, the grinding producing a central edge portion and two chamfered edge portions connecting the central edge portion with the first and second major surfaces, respectively; and{'sub': 2', '3', '2, 'polishing the central edge portion with a first cup wheel rotated about a first axis substantially parallel with the first and second major surfaces of the glass sheet to polish the central edge portion, wherein an abrasive layer of the first cup wheel comprises at least one of FeO, SiC, and CeO.'}2. The method of claim 1 , wherein the abrasive layer comprises about 5% to about 15% of FeOby volume.3. The method of claim 1 , wherein the abrasive layer comprises about 15% to about 27% of SiC or CeOby volume.4. The method of claim 1 , wherein the abrasive layer further comprises diamond particles comprising a particle size from about 2 micrometers ...

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Номер записи: 88
31-12-2020 дата публикации

AUTOMATED TOOL CONTROL DEVICE MANAGED IN A TOOL CRIB MANAGEMENT SYSTEM

Номер: US20200407162A1
Автор: CHWAN Joseph, Fly David C., Lipsey Matthew J., LOBO Andrew R., NEWPORT Jason, PHILLIPS Preston C., Rogers Frederick J., RYAN Sean W.
Принадлежит:

The present application describes an automated inventory control system that comprises a storage device, a sensing system, a data storage, and one or more processors. The storage device includes a plurality of storage locations for storing objects. The sensing system is configured to associate the storage device with a first location and with a second location. The data storage is configured to store configurable data of the storage device. The one or more processors are configured to send configurable data corresponding to the first location to the storage device in response to receiving information associating the storage device with the first location from the sensing system. In response to receiving information associating the storage device with the second location from the sensing system, the one or more processors are configured to send configurable data corresponding to the second location to the storage device. 1. An inventory control system comprising:a storage device including a plurality of storage locations for storing objects;a sensing system configured to associate the storage device with a first location and with a second location;a data storage configured to store configurable data of the storage device; and in response to receiving information associating the storage device with the first location from the sensing system, send configurable data corresponding to the first location to the storage device; and', 'in response to receiving information associating the storage device with the second location from the sensing system, send configurable data corresponding to the second location to the storage device., 'one or more processors communicatively coupled to the storage device and the sensing system, the one or more processors configured to2. The inventory control system of claim 1 , wherein the sensing system includes one or more GPS devices of the storage device.3. The inventory control system of claim 1 , wherein the sensing system includes:a ...

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Номер записи: 89
31-12-2020 дата публикации

MANAGING OBJECTS WITH ASSIGNED STATUS IN AN AUTOMATED TOOL CONTROL SYSTEM

Номер: US20200410434A1
Автор: CHWAN Joseph, Fly David C., Lipsey Mathew J., LOBO Andrew R., NEWPORT Jason, PHILLIPS Preston C., Rogers Frederick J., RYAN Sean W.
Принадлежит:

The present application describes an automated inventory control system that comprises one or more storage devices containing a plurality of storage locations for storing objects and first and second predefined locations. The first and second predefined locations for receiving one or more objects includes a sensing system that is configured to sense when an object is deposited at the first and second predefined locations, respectively. The one or more processors are configured to automatically assign a first status to the object and cause transmission of an alert indicating the first status of the deposited object when an object is deposited at the first predefined location. The one or more processors are configured to track a plurality of transactions associated with the deposited object after a user checks the deposited object out of the first predefined location. 1. An automated inventory control system , comprising:one or more storage devices containing a plurality of storage locations for storing objects;a first predefined location for receiving one or more objects, the first predefined location including a sensing system configured to sense when an object is deposited at the first predefined location;a second predefined location for receiving one or more objects; the second predefined location including a sensing system configured to sense when an object is deposited at the second predefined location; when an object is deposited at the first predefined location, automatically assign a first status to the object and cause transmission of an alert indicating the first status of the deposited object,', 'track a plurality of transactions associated with the deposited object after a user checks the deposited object out of the first predefined location, and', 'when an object is deposited at the second predefined location, automatically assign a second status to the object and cause transmission of an alert indicating the second status of the deposited object., 'one ...

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Номер записи: 90
31-12-2020 дата публикации

LANGUAGE MANAGEMENT IN AUTOMATED TOOL CONTROL SYSTEMS

Номер: US20200410447A1
Автор: CHWAN Joseph, Fly David C., Lipsey Matthew J., LOBO Andrew R., NEWPORT Jason, PHILLIPS Preston C., Rogers Frederick J., RYAN Sean W.
Принадлежит:

The present application describes an automated inventory control system that comprises a storage device, an access control device, and a data storage. The storage device includes a plurality of storage locations for storing objects. The access control device is configured to receive user credentials for access to the storage device. The data storage is configured to store configurable parameters associated with the storage device in a plurality of languages, and information corresponding to respective users of the storage device including an assigned language. In response to the access control device receiving user credentials by the access control device, the storage device is configured to obtain configurable parameters from the data storage. 1. An automated inventory control system comprising:a storage device including a plurality of storage locations for storing objects;an access control device configured to receive user credentials for access to the storage device;a data storage configured to store configurable parameters associated with the storage device in a plurality of languages, and information corresponding to respective users of the storage device including an assigned language;wherein, in response to the access control device receiving user credentials by the access control device, the storage device is configured to obtain configurable parameters from the data storage.2. The automated inventory control system of claim 1 , wherein the configurable parameters from the data storage are in the assigned language corresponding to the user.3. The automated inventory control system of claim 1 , wherein the configurable parameters include text files claim 1 , audio files claim 1 , and video files in a plurality of languages.4. The automated inventory control system of claim 1 , further comprising:a display associated with the storage device,wherein the configurable parameters includes display information comprising one or more of: work instructions, tool ...

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Номер записи: 91
08-06-2000 дата публикации

Preparation of novel coupled polymer by using a particular coupling agent

Номер: DE19857768A1
Автор: Henry Chi-Chen Hsieh, James Kung-Hsi Chan, Sean Chwan-Sheng Huang
Принадлежит: Taiwan Synthetic Rubber Corp, TAIWAN SYNTHETIC RUBBER CORP TAIPEI

A coupled linear polymer is prepared by reacting a living alkali metal-terminated polymer with a coupling agent. A coupled linear polymer is prepared by reacting a living alkali metal-terminated polymer with a coupling agent. The living alkali metal-terminated polymer has the formula P-M, in which M is an alkali metal, P is a polymeric carbanion of one or more conjugated dienes having 4-12C atoms, and one or more monovinylarenes having 8-18C atoms. The coupling agent has the formula (I). R1 and R3 = aliphatic alkyl and alkenyl, H, and R2 = alkylene, alkenylene, divalent cycloalkylene, divalent arenyl, or 1-17C divalent hydrocarbyl containing ether group.

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Номер записи: 92
16-05-2000 дата публикации

Rubber for the tread of high-performance tyres

Номер: ES2143935A1
Автор: Chi-Chen Hsieh Henry, Chwan-Sheng Huang Sean, J D Lee Peter, Lin Fu
Принадлежит: Taiwan Synthetic Rubber Corp

The rubber of the invention basically includes: (a) vinylaromatic/conjugated diene copolymer or conjugated diene monopolymer, coupled, of low molecular weight, approximately 10-50%, with a molecular weight of 5 x 10<4> - 35 x 10<4>, (b) vinylaromatic/conjugated diene copolymer, not coupled, of medium molecular weight, approximately 10-60% by weight, with a molecular weight of 10 x 10<4> - 80 x 10<4>, and (c) vinylaromatic/ conjugated diene copolymer, coupled, of high molecular weight, 5-60% by weight, with a molecular weight of 45 x 10<4> - 200 x 10<4>.

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Номер записи: 93
23-06-2000 дата публикации

Preparation of novel coupled polymer by using a particular coupling agent

Номер: FR2787456A1
Автор: Henry Chi Chen Hsieh, James Kung Hsi Chan, Sean Chwan Sheng Huang
Принадлежит: Taiwan Synthetic Rubber Corp

A coupled linear polymer is prepared by reacting a living alkali metal-terminated polymer with a coupling agent. A coupled linear polymer is prepared by reacting a living alkali metal-terminated polymer with a coupling agent. The living alkali metal-terminated polymer has the formula P-M, in which M is an alkali metal, P is a polymeric carbanion of one or more conjugated dienes having 4-12C atoms, and one or more monovinylarenes having 8-18C atoms. The coupling agent has the formula (I). R1 and R3 = aliphatic alkyl and alkenyl, H, and R2 = alkylene, alkenylene, divalent cycloalkylene, divalent arenyl, or 1-17C divalent hydrocarbyl containing ether group.

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Номер записи: 94
18-06-1999 дата публикации

Tread rubber suitable for high performance tire

Номер: FR2772386A1
Автор: Fu Lin, Henry Chi Chen Hsieh, Jd Peter Lee, Sean Chwan Sheng Huang
Принадлежит: Taiwan Synthetic Rubber Corp

A tread rubber suitable for high performance tire, which comprises: about 1050% by weight of at least one low molecular weight copolymer of a conjugated diene and a vinyl aromatic hydrocarbon or a conjugated diene monopolymer, the copolymer or monopolymer being coupled by a coupling agent such as RmMXn-m or (RO)kMXn-k, etc. and having a molecular weight of about 5x10<4>35x10<4>; about 1060% by weight of at least one an intermediate molecular weight copolymer of a conjugated diene and a vinyl aromatic hydrocarbon, the copolymer being linear and un-coupled, and having a molecular weight of about 10x10<4>80x10<4>; and about 560% by weight of a high molecular weight copolymer of a conjugated diene and a vinyl aromatic hydrocarbon, the copolymer being coupled by a coupling agent such as RmMXn-m or (RO)kMXn-k, etc. and having a molecular weight of about 45x10<4>200x104; in which the coupling agent has a structure of RmMXn-m or (RO)kMXn-k: M is Sn, P, Ga, Si, etc.; X represents a halogen atom; R represents a paraffin hydrocarbon, cycloalkyl hydrocarbon or aromatic hydrocarbon; n represents the number of chemical bonds capable of bonding to a center atom; n = 4 or 3; m 2, k 4.

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Номер записи: 95
24-03-2005 дата публикации

Rice glutelin gene promoters

Номер: US20050066387A1
Автор: Chwan-Yang Hong, Su-May Yu
Принадлежит: Academia Sinica

A nucleic acid containing a glutelin gene promoter. Disclosed are transformed plant cells and transgenic plants containing a nucleic acid that includes the promoter operably linked to a sequence encoding heterologous protein. Also disclosed are methods of making the transformed plant cells and transgenic plants and methods for expressing a polypeptide.

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Номер записи: 96
27-01-2005 дата публикации

Watermark embedding method based on DCT subband image characters

Номер: US20050018872A1
Автор: Chwan-Chang Chen, Guo-Zua Wu, Yi-Jung Wang, Zu-Wen Chao
Принадлежит: Industrial Technology Research Institute ITRI

A watermark embedding method based on DCT subband image characters is disclosed. An original image is converted into a frequency image using a discrete cosine transformation. The watermark information is then embedded into a specific embedding block in each macro-block of the frequency image. The method has the following advantages: (1) the image embedded by watermark is resistant from distortion and damages from compressions; (2) the watermark image can be extracted without employing the original image; and (3) the quality of the image embedded with the watermark image can remain intact.

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Номер записи: 97
17-09-2019 дата публикации

Silicon carbide semiconductor device

Номер: US10418476B2
Автор: Cheng-Tyng Yen, Chien-Chung Hung, Chwan-Ying Lee
Принадлежит: Hestia Power Inc

The present invention is related to a silicon carbide semiconductor device which employs a silicon carbide substrate to form an integrated device. The integrated device of the present invention comprises a metal oxide semiconductor field-effect transistor (MOSFET) and an integrated junction barrier Schottky (JBS) diode in an anti-parallel connection with the MOSFET.

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Номер записи: 98
30-06-2011 дата публикации

Electronic device housing

Номер: US20110159275A1
Автор: Chwan-Hwa Chiang, Qi-Jian Du
Принадлежит: Fih Hong Kong Ltd, Shenzhen Futaihong Precision Industry Co Ltd

An electronic device housing is provided. The electronic device housing includes a substrate, a metallic coating formed on the substrate, and a top paint coating formed on the metallic coating. The top paint coating contains nano-titanium dioxide powder. The top paint coating has a self-cleaning property. It can oxygenize and clean off dust and sweat accumulated on the surface of the electronic device housing.

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Номер записи: 99
27-11-2014 дата публикации

Battery monitoring in a networked inventory control system

Номер: WO2014189972A1
Автор: David C. Fly, Frederick J. Rogers, Jason NEWPORT, Joseph Chwan, Matthew J. Lipsey, Preston C. PHILLIPS
Принадлежит: Snap-on Incorporated

An inventory control device, such as an electronic toolbox, monitors the identity of battery packs that are mounted in the device and used to provide electrical power to the device. The device retrieves a unique identifier for each battery pack, and monitors the operation of each battery pack. The monitored data can be logged into memory for future use, communicated to a user of the inventory control device, and/or used to predict the future performance or replacement date for a battery pack. The monitored data can also be communicated across a communication network to an inventory control server that monitors the operation and performance of battery packs throughout an electronic tools control system including multiple toolboxes. The server can further track the operation and locations of battery packs through all of the toolboxes.

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Номер записи: 100