ANNEALING PROCESS OF VERTICALLY PULLED SILICON DOPED BY NEUTRON TRANSMUTATION

White LED integration module with adjustable color temperature and color rendering indexes

The invention relates to an encapsulation structure for a light-emitting diode (LED) integration module and a preparation process thereof. The encapsulation structure comprises a red LED chip 7, a blue LED chip 8, an LED support 1 with independent electrodes 3, 4 and 5, a ceramic substrate 6, fluorescent powder 10 and silica gel 11, wherein the red LED chip 7 and the blue LED chip 8 are fixed in the LED support; and the fluorescent powder 10 and the silica gel 11 are coated on the chips uniformly. In a white LED integration module with adjustable color temperatures and color rendering indexes, the light intensity of the red LED chip can be adjusted at any time under the environment of different color temperatures and color rendering indexes to change the color temperatures and the color rendering indexes without the usage of a plurality of independent LED integration modules with different color temperatures, so the design of lamps is simplified, the using amount of the fluorescent powder ...

CMOS DEVICE FOR DEFECT CONTROL BY SLICE OF SILICON AND UTILIZATION TECHNOLOGY

Lens-free LED lamp and encapsulation method thereof

The invention relates to an encapsulation method for a molded light emitting diode (LED) lens die, and aims to provide an encapsulation method for a silica gel lens LED. In order to fulfill the purposes, the encapsulation method for the lens-free LED comprises the following steps of: dehumidifying and cleaning an LED bracket; fixing an LED chip on a pedestal in the cavity of the LED bracket by using silver glue, baking and fixing; connecting the anode and the cathode of the LED chip and the first and second electrodes on the LED bracket respectively; combining a lens on the LED bracket, injecting equivalent transparent silica gel into the cavity of the lens in a mode that a needle cylinder of a glue dispenser is aligned with glue injection holes on two protruded parts of the lens, and putting the lens into a 150 DEG C oven for baking and molding; separating the lens and the LED bracket; and injecting sealant and baking to form a silica gel lens on the bracket. The silica gel lens has small ...

Novel thermoelectric separation bracket for light-emitting diode (LED) surface mounted device (SMD)

The invention relates to a high-power light-emitting diode (LED) bracket, in particular to a novel thermoelectric separation bracket for a light-emitting diode (LED) surface mounted device (SMD), belonging to the technical field of LEDs. The invention provides the novel thermoelectric separation bracket for the LED SMD, which can enable heat dissipated when an LED chip works to be timely conducted to a heat dissipation substrate, and comprises the substrate, a connecting bracket and a supporting strip, wherein the substrate is matched with two side surfaces of the connecting bracket, the supporting strip is positioned at one side of the bottom surface of the connecting bracket, the LED chip is fixed on the conductive substrate by using insulating glue, the substrate is provided with a first brazing wire area, the connecting bracket is also provided with a second brazing wire area and an electrode connected with the second brazing wire area, the first brazing wire area and the second brazing ...