28-04-2023 дата публикации
Номер: CN116021654A
Принадлежит:
The invention belongs to the technical field of wafer tool changing, and relates to an automatic tool changing device for wafer cutting and a tool changing method thereof.The device comprises a cutting-up blade mechanism, a height calibration system and a visual system.The cutting-up blade mechanism is installed on a portal frame in a sliding mode, and the portal frame is arranged on a bench in a spanning mode. All the devices return to zero, the blade recovers to the vertical state, blade height calibration is carried out, and the zero point of the blade is determined; the cutting blade mechanism begins to cut the wafer, after cutting is completed, the wafer moves into the field of view of the visual system, and the controller triggers the camera to photograph the product to recognize the damage width a of a cutting gap; the damage width a is compared with a standard value a0 of the specified damage width, and whether tool changing is needed or not is judged. Manual intervention is reduced ...
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